<?xml version="1.0" encoding="UTF-8"?>
<tw-patent-applications total-count="3175"> 
  <tw-patent-application no="1" publication-number="202627396"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627396.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水箱組件之水室加強板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">F28F9/02</main-classification>  
        <further-classification edition="200601120260319B">F28F9/007</further-classification>  
        <further-classification edition="200601120260319B">B60K11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉茂精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥狄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳洲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作係有關於一種水箱組件之水室加強板，包括一水槽、一加強板，水槽具有一水室，於水室二內側設有平行相對具第一、第二插槽之第一、第二支肋，加強板係一體成型出具一以上相鄰的第一、二框槽之連結片，於對應各第一框槽二側對稱設有間隔相對之第一、第二扣片，於第一、第二扣片與連結片第一框槽銜接處設有一第一、第二彎弧部，其中，利用第一、第二扣接片與水室第一、第二插槽相對組設，用以形成一穩固支撐之水室內置式加強板，以及利用第一、第二彎弧部用以對第一、第二扣片組接段形成一控制限位，同時構成連結片與水室內側壁插置間形成一適當距離之進水空間，俾達提升水槽抗壓及抗熱應力強度，有效防止塑槽內縮變形裂開之效。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">100:水箱組件</p>  
        <p type="p">20:水槽</p>  
        <p type="p">21:中空槽體</p>  
        <p type="p">211:進水孔</p>  
        <p type="p">212:組接孔</p>  
        <p type="p">22:水室</p>  
        <p type="p">23:第一支肋</p>  
        <p type="p">231:插槽</p>  
        <p type="p">30:加強板</p>  
        <p type="p">31:連接片</p>  
        <p type="p">311:第一框槽</p>  
        <p type="p">312:第二框槽</p>  
        <p type="p">32:第一扣片</p>  
        <p type="p">321:第一彎弧部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2" publication-number="202626032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吡啶並吡唑衍生物藥物组合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">A61K31/437</main-classification>  
        <further-classification edition="200601120250701B">A61K31/4162</further-classification>  
        <further-classification edition="200601120250701B">A61K31/4355</further-classification>  
        <further-classification edition="200601120250701B">A61K31/381</further-classification>  
        <further-classification edition="200601120250701B">A61K31/495</further-classification>  
        <further-classification edition="200601120250701B">A61K31/435</further-classification>  
        <further-classification edition="200601120250701B">A61K31/357</further-classification>  
        <further-classification edition="200601120250701B">A61K31/34</further-classification>  
        <further-classification edition="200601120250701B">A61K31/397</further-classification>  
        <further-classification edition="200601120250701B">A61K31/337</further-classification>  
        <further-classification edition="200601120250701B">A61K31/35</further-classification>  
        <further-classification edition="200601120250701B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商西藏海思科製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIZANG HAISCO PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李陽光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANGGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王菊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴龐科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, PANGKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種式（I）所示吡啶並吡唑衍生物藥物組合物及其在製備抗腫瘤藥物中的應用，所述藥物組合物包括式（I）化合物和PARP抑制劑。 &lt;br/&gt;&lt;img align="absmiddle" height="123px" width="151px" file="ed10347.JPG" alt="ed10347.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3" publication-number="202628428"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628428.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療直播影像擷取控制系統及方法</chinese-title>  
        <english-title>CONTROL SYSTEM AND METHOD FOR MEDICAL LIVE BROADCAST IMAGE CAPTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241231B">H04N21/43</main-classification>  
        <further-classification edition="201801120241231B">H04N13/117</further-classification>  
        <further-classification edition="200601120241231B">H04N7/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪克多股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TWIN BEANS LIMITED CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳多偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孟翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王明朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MING-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林盈志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種醫療直播影像擷取控制系統及方法。本發明的醫療直播影像擷取控制系統適用於執行本發明的醫療直播影像擷取控制方法。在醫療直播影像擷取控制方法中，控制影像擷取裝置在不同影像擷取位置之間移動並擷取多個醫療影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control system and method for live medical broadcast image capturing is provided. The medical image capturing remote control system is applicable to perform the medical image capturing remote control method. In the medical image capturing remote control method, controlling an image capturing device to move between different positions and to capture a plurality of medical images at the plurality of positions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主控裝置</p>  
        <p type="p">200:影像擷取裝置</p>  
        <p type="p">300:用戶遠端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="4" publication-number="202626489"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626489.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氫氣與生物炭聯產的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD FOR CO-PRODUCTION OF HYDROGEN GAS AND BIOCHAR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">C01B3/32</main-classification>  
        <further-classification edition="201701120260401B">C01B32/05</further-classification>  
        <further-classification edition="200601120260401B">C10B53/02</further-classification>  
        <further-classification edition="200601120260401B">B01J23/42</further-classification>  
        <further-classification edition="200601120260401B">B01J23/72</further-classification>  
        <further-classification edition="200601120260401B">B01J8/06</further-classification>  
        <further-classification edition="200601120260401B">B01J19/24</further-classification>  
        <further-classification edition="202501120260401B">F27D17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧陳翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, CHEN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHI-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氫氣與生物炭聯產的製造方法包含利用產氫系統依序進行產氫步驟以及對生質物進行加熱步驟，其中產氫步驟產生氫氣和廢熱。產氫系統包含反應器、氣體供應模組以及液體供應模組。反應器配置以容置觸媒和生質物。氣體供應模組與反應器連通，且配置以提供氧氣。液體供應模組與反應器連通，且配置以提供甲醇和水，其中氧氣與甲醇(O &lt;sub&gt;2&lt;/sub&gt;/C)具有特定的莫耳比，且水與甲醇(S/C)具有特定的莫耳比。本揭示的生物炭係藉由回收廢熱而製得，可有效回收廢熱，有利於再生能源技術的發展並促進循環生物經濟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method for co-production of hydrogen gas and biochar includes utilizing a hydrogen production system to sequentially perform a hydrogen production step and a heating step for a biomass, in which the hydrogen production step generates the hydrogen gas and a waste heat. The hydrogen production system includes a reactor, a gas supply module, and a liquid supply module. The reactor is configured to accommodate a catalyst and the biomass. The gas supply module is communicated with the reactor and configured to supply an oxygen gas. The liquid supply module is communicated with the reactor and configured to provide a methanol liquid and a water, in which the oxygen gas to the methanol liquid (O &lt;sub&gt;2&lt;/sub&gt;/C) has a specific molar ratio and the water to the methanol liquid (S/C) has a specific molar ratio. The biochar of the present invention is produced by recovering the waste heat, which can effectively recover waste heat and improve energy efficiency. This is beneficial to the development of renewable energy technology and promotes a circular bioeconomy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">310,320,330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="5" publication-number="202626151"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626151.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>健身裝置及其阻力調整方法</chinese-title>  
        <english-title>FITNESS DEVICE AND RESISTANCE ADJUSTMENT METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">A63B24/00</main-classification>  
        <further-classification edition="200601120241231B">A63B21/055</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱大洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TA-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種健身裝置及其阻力調整方法。健身裝置包含一運動組件與連接運動組件的至少一個阻尼模組。阻尼模組包含一拉繩、一阻力源、一線位移感測單元、一阻力感測單元及一處理器。阻力源能依據一目標阻力設定值輸出一輸出阻力及控制拉繩所伸出的線長。線位移感測單元感測感測拉繩伸出的線長而產生一線位移感測訊號。阻力感測單元感測阻力源的輸出阻力而產生一阻力感測訊號。處理器依據線位移感測訊號與阻力感測訊號，計算出一運動頻率，處理器比對運動頻率與一預設運動頻率，而控制阻力源能輸出的輸出阻力的大小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a fitness device and resistance adjustment method thereof. The fitness device includes an exercise assembly and at least one damping module that is connected to the exercise assembly. The damping module includes a pull rope, a resistance source, a linear displacement sensor, a resistance sensor, and a process. The resistance source is configured to output an output resistance according to a target resistance setting value and to control an extended length of the pull rope. The linear displacement sensor is operated to sense the extended length of the pull rope to generate a linear displacement sensing signal. The resistance sensor is operated to sense the output resistance of the resistance source to generate a resistance sensing signal. The processor is operated to calculate an exercising frequency according to the linear displacement sensing signal and the resistance sensing signal, and the processor is operated to compare the exercise frequency and a predetermined exercise frequency to control the output resistance of the resistance source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:健身裝置</p>  
        <p type="p">1:運動組件</p>  
        <p type="p">11:加速度感測單元</p>  
        <p type="p">12:通訊模組</p>  
        <p type="p">2:阻尼模組</p>  
        <p type="p">21:拉繩</p>  
        <p type="p">22:阻力源</p>  
        <p type="p">23:線位移感測單元</p>  
        <p type="p">24:阻力感測單元</p>  
        <p type="p">25:處理器</p>  
        <p type="p">26:通訊模組</p>  
        <p type="p">TD:終端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="6" publication-number="202628328"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628328.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於LLC諧振電源轉換器的控制器</chinese-title>  
        <english-title>CONTROLLER APPLIED TO AN LLC RESONANT POWER CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H02M1/084</main-classification>  
        <further-classification edition="200601120241231B">H02M3/335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>通嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEADTREND TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳耀宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周冠賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, KUAN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">應用於LLC諧振電源轉換器的控制器包含一臨界電壓產生電路和一閘極控制信號產生電路。該臨界電壓產生電路是用以根據一參考電壓、一回授電壓和一閘極控制信號相位，產生一上臨界電壓和一下臨界電壓。該閘極控制信號產生電路是用以根據一偵測電壓和該上臨界電壓去能一上橋控制信號，或根據該偵測電壓和該下臨界電壓去能一下橋控制信號，其中該LLC諧振電源轉換器的一上橋開關是根據該上橋控制信號開啟，以及該LLC諧振電源轉換器的一下橋開關是根據該下橋控制信號開啟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A controller applied to an LLC resonant power converter includes a threshold voltage generation circuit and a gate control signal generation circuit. The threshold voltage generation circuit is used for generating an upper threshold voltage and a lower threshold voltage according to a reference voltage, a feedback voltage, and a gate control signal phase. The gate control signal generation circuit is used for disabling an upper bridge control signal according to a sensing voltage and the upper threshold voltage or disabling an lower bridge control signal according to the sensing voltage and the lower threshold voltage, wherein an upper bridge switch of the LLC resonant power converter is turned on according to the upper bridge control signal, and an lower bridge switch of the LLC resonant power converter is turned on according to the lower bridge control signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:LLC諧振電源轉換器</p>  
        <p type="p">102:上橋開關</p>  
        <p type="p">104:下橋開關</p>  
        <p type="p">200:控制器</p>  
        <p type="p">202:臨界電壓產生電路</p>  
        <p type="p">203:邏輯電路</p>  
        <p type="p">204:閘極控制信號產生電路</p>  
        <p type="p">206、208、210、212:接腳</p>  
        <p type="p">2022:補償電路</p>  
        <p type="p">2024:電壓調整電路</p>  
        <p type="p">GP:閘極控制信號相位</p>  
        <p type="p">HGATE:上橋控制信號</p>  
        <p type="p">LGATE:下橋控制信號</p>  
        <p type="p">△VFBC_PD:補償電壓</p>  
        <p type="p">VCM:參考電壓</p>  
        <p type="p">VFBC:偵測電壓</p>  
        <p type="p">VFBC_THH:上臨界電壓</p>  
        <p type="p">VFBC_THL:下臨界電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="7" publication-number="202628720"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628720.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水平式發光二極體及其製造方法</chinese-title>  
        <english-title>HORIZONTAL LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250312B">H10H20/83</main-classification>  
        <further-classification edition="202501120250312B">H10H20/832</further-classification>  
        <further-classification edition="202501120250312B">H10H20/824</further-classification>  
        <further-classification edition="202501120250312B">H10H20/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鴻達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HONG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡景元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭羽彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種水平式發光二極體及其製造方法，水平式發光二極體包含一永久基板、一磊晶複合層、一透明導電層、複數個導電栓、一第一導電型電極及一第二導電型電極。其中，磊晶複合層具有發光波段為1100~2000奈米（nm）之一發光層，設置於永久基板上。透明導電層夾置於永久基板與磊晶複合層之間，各導電栓設置於透明導電層與磊晶複合層間，並電性連接至磊晶複合層。第一導電型電極設置於永久基板上，並電性連接至磊晶複合層。第二導電型電極設置於磊晶複合層上，電性連接至磊晶複合層，且與第一導電型電極位於永久基板同側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A horizontal light-emitting diode (LED) and its manufacturing method are provided. The horizontal LED comprises a permanent substrate, an epitaxial composite layer, a transparent conductive layer, a plurality of conductive plugs, a first conductive type electrode, and a second conductive type electrode. The epitaxial composite layer includes a light-emitting layer with an emission wavelength in the range of 1100 to 2000 nanometers which is disposed on the permanent substrate. The transparent conductive layer is sandwiched between the permanent substrate and the epitaxial composite layer. Each conductive plug is disposed between the transparent conductive layer and the epitaxial composite layer and is electrically connected to the epitaxial composite layer. The first conductive type electrode is disposed on the permanent substrate and is electrically connected to the epitaxial composite layer. The second conductive type electrode is disposed on the epitaxial composite layer and is electrically connected to the epitaxial composite layer. The second conductive type electrode is located on the same side of the permanent substrate as the first conductive type electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101N:型歐姆接觸層</p>  
        <p type="p">102:第二化合物半導體層</p>  
        <p type="p">103:發光層</p>  
        <p type="p">104:第一化合物半導體層</p>  
        <p type="p">105:高摻雜磷砷化銦鎵層</p>  
        <p type="p">106:介電層</p>  
        <p type="p">107:金屬疊層</p>  
        <p type="p">108:透明導電層</p>  
        <p type="p">109:反射金屬層</p>  
        <p type="p">110:永久基板</p>  
        <p type="p">111:第一導電型電極</p>  
        <p type="p">112:第二導電型電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="8" publication-number="202628291"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628291.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>VCSEL元件及其製造方法</chinese-title>  
        <english-title>VCSEL COMPONENT AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H01S5/024</main-classification>  
        <further-classification edition="200601120250203B">H01S5/183</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尚澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHANG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種VCSEL元件製造方法，包括以下步驟：提供磷化銦基板；執行磊晶製程以於磷化銦基板上形成磊晶結構，且磊晶結構包括頂面及底面；執行第一平台成型製程以使磊晶結構形成第一平台；執行磊晶製程以於第一平台內形成穿隧接面；移除磷化銦基板；執行第二平台成型製程以使磊晶結構形成第二平台，且第二平台與第一平台之間形成間隙；執行沉積製程以於磊晶結構上形成絕緣層；以及執行金屬化製程以於磊晶結構上形成N型電極及P型電極，其中N型電極位於磊晶結構之底面，且P型電極自磊晶結構之頂面沿著側壁延伸至底面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a method for manufacturing a VCSEL component, which includes the following steps: providing an InP substrate; performing an epitaxial process to form an epitaxial structure on the InP substrate, and the epitaxial structure includes a top surface and a bottom surface; performing a first mesa formation process to form a first mesa from the top surface of the epitaxial structure; performing an epitaxy process to form a tunnel junction in the first mesa; removing the InP substrate; performing a second mesa formation process to form a second mesa from the top surface of the epitaxial structure, and a gap is formed between the first mesa and the second mesa; performing a deposition process to form an insulating layer on the epitaxial structure; and performing a metallization process to form an N-type electrode and a P-type electrode on the epitaxial structure, where the N-type electrode is positioned on the bottom surface of the epitaxial structure, and the P-type electrode extends from the top surface of the epitaxial structure along a sidewall to the bottom surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S8:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="9" publication-number="202627821"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627821.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於減少門閘數的周邊模組數量決定方法、用於減少功耗的方法與單晶片系統</chinese-title>  
        <english-title>METHOD FOR DETERMINING NUMBER OF PERIPHERAL MODULES TO REDUCE GATE COUNTS, METHOD FOR REDUCING POWER CONSUMPTION AND SYSTEM ON CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F13/10</main-classification>  
        <further-classification edition="201901120250303B">G06F1/3215</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於減少門閘數的周邊模組數量決定方法，係在單晶片系統的開發階段時執行，且具有至少以下的步驟：(步驟A)選定第一周邊模組預估數量；(步驟B)將第一周邊模組預估數量之第一周邊模組配置於單晶片系統中；(步驟C)取得各第一周邊模組的啟動狀況及周邊設定參數暨效能參數組；(步驟D)使用經訓練的機器學習模型根據各第一周邊模組的啟動狀況及周邊設定參數暨效能參數組計算各第一周邊模組傳送資料的第一處置時序；以及(步驟E)使用推論單元根據各第一周邊模組傳送資料的第一處置時序判讀是否能夠減少第一周邊模組預估數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for determining a number of peripheral modules for reducing the gate counts, which is executed during the development stage of a system on chip and has at least of following steps: (step A) selecting the an estimated first peripheral module number; (step B) arranging the estimated first peripheral module number of first peripheral modules in the system on chip; (step C) obtaining a trigger status of each first peripheral module and a parameter set of peripheral setting parameters and performance parameters of each first peripheral module; (step D ) using a trained machine learning model to calculate a first transaction timing of data transmission of each first peripheral module based on the trigger status of each first peripheral module and the parameter set of peripheral setting parameters and performance parameters of each first peripheral module; and (step E) using an inference unit to determine whether estimated first peripheral module number can be reduced based on the first transaction timing of data transmission of each first peripheral module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S501~S506:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="10" publication-number="202628577"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628577.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體元件及其製作方法</chinese-title>  
        <english-title>MEMORY COMPONENT AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B41/00</main-classification>  
        <further-classification edition="202501120260302B">H10D84/03</further-classification>  
        <further-classification edition="202601120260302B">H10P30/00</further-classification>  
        <further-classification edition="202601120260302B">H10P32/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易　亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任馳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體元件，包含二記憶單元、一第一閘極以及一摻雜區。二記憶單元設置於一基底上，第一閘極設置於二記憶單元之間，其中第一閘極包含一嵌入部嵌設於基底中。摻雜區設置於基底中且包圍嵌入部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory component includes two memory units, a first gate and a doped region. The two memory units are disposed on a substrate. The first gate is disposed between the two memory units, wherein the first gate includes an embedded portion embedded in the substrate. The doped region is disposed in the substrate and surrounds the embedded portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:記憶體元件</p>  
        <p type="p">10:記憶體區域</p>  
        <p type="p">100:基底</p>  
        <p type="p">101:頂表面</p>  
        <p type="p">110:凹槽</p>  
        <p type="p">120:絕緣結構</p>  
        <p type="p">130:凹槽</p>  
        <p type="p">140:摻雜區</p>  
        <p type="p">160:摻雜區</p>  
        <p type="p">170:通道區</p>  
        <p type="p">180:穿隧層</p>  
        <p type="p">200:浮動閘極</p>  
        <p type="p">220:阻擋層</p>  
        <p type="p">220a,260a:第一層</p>  
        <p type="p">220b,260b:第二層</p>  
        <p type="p">220c:第三層</p>  
        <p type="p">240:控制閘極</p>  
        <p type="p">260:遮罩層</p>  
        <p type="p">310,320,340,350,360:側壁子</p>  
        <p type="p">410:穿隧層</p>  
        <p type="p">420:閘極介電層</p>  
        <p type="p">510:第一閘極</p>  
        <p type="p">512:嵌入部</p>  
        <p type="p">514:上部</p>  
        <p type="p">520:第二閘極</p>  
        <p type="p">D1,D2:水平方向</p>  
        <p type="p">D3:垂直方向</p>  
        <p type="p">MU:記憶單元</p>  
        <p type="p">S3:外側表面</p>  
        <p type="p">S4:內側表面</p>  
        <p type="p">ST:階狀結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="11" publication-number="202628934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測晶圓測試數據的方法與裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR PREDICTING WAFER TEST DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P74/00</main-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification>  
        <further-classification edition="202301120260302B">G06N3/08</further-classification>  
        <further-classification edition="201201120260302B">G06Q50/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崛智科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIGWISE TECHNOLOGY CORPORATION, LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶圓測試數據的預測方法及相關電子裝置。預測方法包括：對晶圓的晶圓允收測試（Wafter Acceptance Test, WAT）數據進行前處理，以將晶圓中WAT數據的位置資訊轉換為位置嵌入向量，其中WAT數據具有第一數量的數據點；以及將晶圓的裸晶針測試（Chip Probing, CP）數據及位置嵌入向量輸入至人工智能模型，使人工智能模型產生該晶圓的預測WAT數據，其中預測WAT數據具有高於第一數量的第二數量的數據點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for predicting wafer test data and the corresponding electronic device. The prediction method involves: preprocessing multiple test data points from the wafer to convert their positional information into position embedding vectors; then inputting chip probing data and the position embedding vectors into an artificial intelligence model to generate predicted data for the wafer. The test data has a first amount of data points, and the predicted data has a second amount of data points more than the first amount of data points.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S20~S21:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="12" publication-number="202627626"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627626.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學超表面結構以及其製作方法</chinese-title>  
        <english-title>OPTICAL METASURFACE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G02F1/01</main-classification>  
        <further-classification edition="200601120250512B">G02F1/13</further-classification>  
        <further-classification edition="200601120250512B">C09K19/02</further-classification>  
        <further-classification edition="200601120250512B">G02B27/28</further-classification>  
        <further-classification edition="200601120250512B">G03F7/20</further-classification>  
        <further-classification edition="200601120250512B">H01J37/305</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊晉嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馥郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, FU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡濱祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, BIN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學超表面(metasurface)結構包括基底、複數個金屬軌道結構以及液晶材料。基底包括第一區以及第二區。複數個金屬軌道結構與液晶材料設置在第一區之上，液晶材料的至少一部分在水平方向上位於相鄰的金屬軌道結構之間，且多個金屬軌道結構中的一個金屬軌道結構的上部寬度小於此金屬軌道結構的底部寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical metasurface structure includes a substrate, metal rail structures, and a liquid crystal material. The substrate includes a first region and a second region. The metal rail structures and the liquid crystal material are disposed above the first region. At least a part of the liquid crystal material is located between the metal rail structures adjacent to each other in a horizontal direction, and a top width of one of the metal rail structures is less than a bottom width of the one of metal rail structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:基底</p>  
        <p type="p">24:介電層</p>  
        <p type="p">26:蝕刻停止層</p>  
        <p type="p">28:介電層</p>  
        <p type="p">30:阻障層</p>  
        <p type="p">32:導電材料</p>  
        <p type="p">34:蝕刻停止層</p>  
        <p type="p">36:介電層</p>  
        <p type="p">38:蝕刻停止層</p>  
        <p type="p">40:阻障層</p>  
        <p type="p">42:導電材料</p>  
        <p type="p">44:圖案化阻障層</p>  
        <p type="p">44A:第一阻障圖案</p>  
        <p type="p">44B:第二阻障圖案</p>  
        <p type="p">46:圖案化銅層</p>  
        <p type="p">46A:第一銅圖案</p>  
        <p type="p">46B:第二銅圖案</p>  
        <p type="p">48:圖案化金屬遮罩層</p>  
        <p type="p">48A:第一金屬遮罩圖案</p>  
        <p type="p">48B:第二金屬遮罩圖案</p>  
        <p type="p">60:介電蓋層</p>  
        <p type="p">70:封裝材料</p>  
        <p type="p">101:光學超表面結構</p>  
        <p type="p">BP:接合墊</p>  
        <p type="p">BS:底表面</p>  
        <p type="p">BS1:底表面</p>  
        <p type="p">BS2:底表面</p>  
        <p type="p">BS3:底表面</p>  
        <p type="p">BS4:底表面</p>  
        <p type="p">CS:連接結構</p>  
        <p type="p">D1:垂直方向</p>  
        <p type="p">D2:水平方向</p>  
        <p type="p">LC:液晶材料</p>  
        <p type="p">M1:導線</p>  
        <p type="p">OP:開口</p>  
        <p type="p">R1:第一區</p>  
        <p type="p">R2:第二區</p>  
        <p type="p">RC1:凹陷</p>  
        <p type="p">RC2:凹陷</p>  
        <p type="p">RS:金屬軌道結構</p>  
        <p type="p">SW:側壁</p>  
        <p type="p">TS1:上表面</p>  
        <p type="p">TS2:上表面</p>  
        <p type="p">TS3:上表面</p>  
        <p type="p">TS4:上表面</p>  
        <p type="p">V1:通孔導體</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">WB:接合銅線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="13" publication-number="202628289"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628289.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148872</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>面射型雷射裝置及其製造方法</chinese-title>  
        <english-title>SURFACE EMITTING LASER DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250204B">H01S5/0225</main-classification>  
        <further-classification edition="200601120250204B">H01S5/042</further-classification>  
        <further-classification edition="200601120250204B">H01S5/065</further-classification>  
        <further-classification edition="202101120250204B">H01S5/10</further-classification>  
        <further-classification edition="200601120250204B">H01S5/183</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪瑜亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, YU-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭浩中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤信介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HSIN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉惠慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, HUI-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種面射型雷射裝置，包括一第一型分布式布拉格反射層、一活性層、一第二型分布式布拉格反射層及一氧化層。活性層配置於第一型分布式布拉格反射層上，第二型分布式布拉格反射層配置於活性層上。氧化層配置於第二型分布式布拉格反射層在靠近活性層的一側，氧化層具有一開口，活性層發出的光通過開口。第二型分布式布拉格反射層的局部區域的頂部具有至少一凹陷及一氧化區，凹陷連通至氧化區，氧化區位於開口上方。一種面射型雷射裝置的製造方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface emitting laser device including a first type distributed Bragg reflective layer, an active layer, a second type distributed Bragg reflective layer, and an oxide layer is provided. The active layer is disposed on the first type distributed Bragg reflective layer. The second type distributed Bragg reflective layer is disposed on the active layer. The oxide layer is disposed at a side of the second type distributed Bragg reflective layer adjacent to the active layer. The oxide layer has an opening, and light emitted by the active layer passes through the opening. A top of a local region of the second type distributed Bragg reflective layer has at least one recess and an oxide region. The recess communicates with the oxide region. The oxide region is located above the opening. A manufacturing method of a surface emitting laser device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:面射型雷射裝置</p>  
        <p type="p">110:第一型分布式布拉格反射層</p>  
        <p type="p">120:活性層</p>  
        <p type="p">122:雷射光</p>  
        <p type="p">130:第二型分布式布拉格反射層</p>  
        <p type="p">131:開口</p>  
        <p type="p">132、134:氧化層</p>  
        <p type="p">136:高折射率層</p>  
        <p type="p">138:低折射率層</p>  
        <p type="p">140:上電極</p>  
        <p type="p">150:下電極</p>  
        <p type="p">170:基板</p>  
        <p type="p">210:凹陷</p>  
        <p type="p">212:盲孔</p>  
        <p type="p">220:氧化區</p>  
        <p type="p">A1:光軸</p>  
        <p type="p">D1、D2:直徑</p>  
        <p type="p">P1:路徑</p>  
        <p type="p">R1:局部區域</p>  
        <p type="p">R2:區域</p>  
        <p type="p">T1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="14" publication-number="202625991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＴＰＵ薄膜長效面膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250205B">A61F13/0206</main-classification>  
        <further-classification edition="200601120250205B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>縱曜光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>縱曜光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種TPU薄膜長效面膜，TPU薄膜的基材是採熱塑性聚氨基甲酸酯(Thermoplastic polyurethane簡稱TPU)製成，該TPU薄膜基材上面塗佈一層含中草藥護膚成份的敷覆層，敷覆層表面再覆設有一層離型紙以形成隔離保護，於TPU薄膜基材被裁製成相符人體之片狀型態，並在相對雙眼、鼻部、以及嘴部等位置預留孔洞，據以製成本發明TPU薄膜長效面膜，其中TPU薄膜的基材透過配方調整及製作技術而使其形成多數微小孔隙，用以增加透氣性及阻擋液體水份傳遞之保濕性，可提升貼敷臉部時更優舒適性，不致造成臉部膚層刺激、起疹或過敏問題，適合較長時間之貼敷以加強敷覆層的護膚效果，本發明其材質的彈性與柔軟性，更得以完全貼敷於人體臉部，取得更佳之貼敷效果者。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">(10):TPU薄膜</p>  
        <p type="p">(20):敷覆層</p>  
        <p type="p">(30):離型紙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="15" publication-number="202628948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於拼接式微影製程的形成圖案的方法</chinese-title>  
        <english-title>METHOD OF FORMING PATTERN FOR STITCHING LITHOGRAPHY PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P76/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林傳傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種用於拼接式（stitching）微影製程的形成圖案的方法，其包括以下步驟。於基底上形成目標層，其中基底包括第一區域和第二區域。使用第一光罩對基底的第一區域上的目標層進行第一曝光製程。使用第二光罩對基底的第二區域上的目標層進行第二曝光製程，其中在進行第二曝光製程之前，對第二光罩的位置進行校正程序，以校正第一光罩和第二光罩在拼接處所產生的偏移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of forming a pattern for a stitching lithography process, which includes following steps. A target layer is formed on a substrate in which the substrate includes a first region and a second region. A first exposure process is performed on the target layer on the first region of the substrate. A second exposure process is performed on the target layer on the second region of the substrate, wherein a correction procedure is performed on the position of the second photomask before performing the second exposure process, so as to correct the offset at which the first photomask and the second photomask are stitching.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一光罩</p>  
        <p type="p">110、120:第一圖案</p>  
        <p type="p">200:第二光罩</p>  
        <p type="p">210、220:第二圖案</p>  
        <p type="p">ST1、ST2:拼接線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="16" publication-number="202628001"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628001.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>跨裝置物件追蹤方法與系統</chinese-title>  
        <english-title>CROSS-DEVICE OBJECT TRACKING METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">G06V10/70</main-classification>  
        <further-classification edition="202201120250303B">G06V20/52</further-classification>  
        <further-classification edition="201701120250303B">G06T7/20</further-classification>  
        <further-classification edition="201701120250303B">G06T7/292</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉哲宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHE-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡勝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHENG-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種跨裝置物件追蹤方法與系統，在方法中，以裝置或周邊裝置的攝影模組拍攝連續幀，通過多物件追蹤技術偵測當前幀中的至少一物件，運用一卷積神經網路萃取各幀中物件的物件特徵，並經與各裝置的原始物件池中暫存的前一幀的物件特徵比對，其中以一轉換模型的編碼器將各物件特徵轉換為嵌入向量，提供以轉換模型的解碼器比對出前後幀匹配的物件，匹配出相同物件。接著，從物件中決定目標物件，再傳送並暫存此目標物件的物件特徵至裝置與周邊裝置的目標物件池中，使所述裝置與周邊裝置即可根據目標物件的物件特徵協同追蹤目標物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cross-device object tracking method and a system are provided. A photographing module of one of devices captures continuous frames. A multi-object tracking technology is used to detect at least one object in a current frame. A convolutional neural network is used to extract object features of the object in each of the frames. The object features of the current frame are provided for comparing with the object features of objects in a previous frame buffered in an original object pool so as to match a same object. An encoder of a transformer model transforms the object features into embedding vectors that are provided for a decoder to compare the embedding vectors in the preceding and following frames for matching a same object that is assigned with an identifier. A target object is then decided. The object features of the target object are transmitted and buffered to a target object pool of each of the devices that can be collaboratively with the device for tracking the target object based on the object features.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:網路</p>  
        <p type="p">100:中控中心</p>  
        <p type="p">120:裝置</p>  
        <p type="p">121:中央處理單元</p>  
        <p type="p">123:影像處理單元</p>  
        <p type="p">125:攝影模組</p>  
        <p type="p">127:通訊模組</p>  
        <p type="p">129:緩衝器</p>  
        <p type="p">191:原始物件池</p>  
        <p type="p">192:目標物件池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="17" publication-number="202626242"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626242.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成傾斜式孔洞的雷射鑽孔方法及系統</chinese-title>  
        <english-title>LASER DRILLING METHOD AND SYSTEM FOR FORMING AN INCLINED HOLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250326B">B23K26/57</main-classification>  
        <further-classification edition="200601120250326B">B23K26/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聚嶸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種形成傾斜式孔洞的雷射鑽孔方法，其包含：提供一待鑽工件；將包含三角體的一光引導元件設置於待鑽工件的表面上；以及，通過一雷射提供模組從光引導元件的斜面的一側提供雷射光束，使雷射光束穿透光引導元件，並投射至待鑽工件，以在待鑽工件上形成傾斜式孔洞。本發明另提供一種用於形成傾斜式孔洞的雷射鑽孔系統，其包含一雷射提供模組和包含三角體的一光引導元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser drilling method for forming an inclined hole is provided. The laser drilling method includes: providing a workpiece to be drilled; placing a light guiding element, which includes a trigonal body, on a surface of the workpiece to be drilled; and providing a laser beam through a laser supply module and from a side of an inclined plane of the light guiding element so that the laser beam is projected onto the workpiece to be drilled by passing through the light guiding element, and then an inclined hole is formed on the workpiece to be drilled. A laser drilling system for forming an inclined hole is also provided. The laser drilling system includes a laser supply module and a light guiding element, which includes a trigonal body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1-S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="18" publication-number="202627361"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627361.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣清淨除濕設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250312B">F24F3/14</main-classification>  
        <further-classification edition="202101120250312B">F24F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣松下電器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳順昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種空氣清淨除濕設備，包含一殼體、一過濾裝置、一除濕裝置、一控制裝置、一主通道、一副通道，及一風門裝置。該風門裝置設置於該副通道內且由該控制裝置操控開關，當該風門裝置處於一開啟狀態時，該副通道可供部分氣流流通至該通風口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">11:外殼</p>  
        <p type="p">111:入風口</p>  
        <p type="p">112:出風口</p>  
        <p type="p">12:撐托架</p>  
        <p type="p">121:直立架板</p>  
        <p type="p">122:支撐架板</p>  
        <p type="p">123:通風口</p>  
        <p type="p">124:透風口</p>  
        <p type="p">2:除濕裝置</p>  
        <p type="p">21:蒸發器</p>  
        <p type="p">22:冷凝器</p>  
        <p type="p">3:主通道</p>  
        <p type="p">4:副通道</p>  
        <p type="p">5:風門裝置</p>  
        <p type="p">54:擋風板</p>  
        <p type="p">6:風扇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="19" publication-number="202628722"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628722.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/854</main-classification>  
        <further-classification edition="202501120250102B">H10H20/811</further-classification>  
        <further-classification edition="200601120250102B">C09K11/54</further-classification>  
        <further-classification edition="200601120250102B">C09K11/62</further-classification>  
        <further-classification edition="200601120250102B">C09K11/88</further-classification>  
        <further-classification edition="200601120250102B">C09K11/56</further-classification>  
        <further-classification edition="202501120250102B">H10H20/857</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商冠捷投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子閎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁鎮鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斳倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIN-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光元件，包含一封裝單元、一發光單元，及多數吸光粒子。該封裝單元包括一由可透光材料構成的封裝杯，及一封裝層。該封裝杯包括一頂面，及自該頂面向下形成的一凹面，該凹面定義出具有一開口的一容納空間，該封裝層填覆該容納空間。該發光單元位於該容納空間並被該封裝層包覆，該等吸光粒子位於該頂面及該封裝杯內部的其中至少一者，並可吸收自該發光單元發出的預定波長的光。藉由該等吸光粒子吸收該預定波長的光，以避免不同色光的發光範圍相互影響，進而達到避免色彩串擾的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:封裝單元</p>  
        <p type="p">21:封裝杯</p>  
        <p type="p">211:底部</p>  
        <p type="p">212:杯部</p>  
        <p type="p">22:封裝層</p>  
        <p type="p">3:導線架</p>  
        <p type="p">4:發光單元</p>  
        <p type="p">5:吸光粒子</p>  
        <p type="p">6:螢光粒子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="20" publication-number="202626560"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626560.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148912</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆銅基板與其形成方法</chinese-title>  
        <english-title>DIRECT BONDED COPPER SUBSTRATE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C04B35/581</main-classification>  
        <further-classification edition="200601120260302B">C04B35/64</further-classification>  
        <further-classification edition="200601120260302B">C04B37/02</further-classification>  
        <further-classification edition="200601120260302B">C23C28/00</further-classification>  
        <further-classification edition="202601120260302B">H10W76/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李映萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游勝閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SHENG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓麗卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, LI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃天恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TIEN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張名惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">覆銅基板包括：氮化鋁基板；銅層，位於氮化鋁基板的一側上，以及氧化物層，位於氮化鋁基板與銅層之間，其中氧化物層包括(1)氧化鋁、氧化鋯、或上述之組合與(2)其他金屬氧化物，且(1)氧化鋁、氧化鋯、或上述之組合與(2)其他金屬氧化物的重量比為100:3至100: 600；其中(2)其他金屬氧化物包括(2a)氧化銅與(2b)氧化鈮、氧化鉭、或上述之組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A direct bonded copper substrate includes an aluminum nitride substrate, a copper layer disposed on a side of the aluminum nitride substrate, and an oxide layer disposed between the aluminum nitride substrate and the copper layer, wherein the oxide layer includes (1) aluminum oxide, zirconium oxide, or a combination thereof and (2) other metal oxides, and (1) the aluminum oxide, zirconium oxide, or a combination thereof and (2) the other metal oxides have a weight ratio of 100:3 to 100:600. (2) The other metal oxides including (2a) copper oxide and (2b) niobium oxide, tantalum oxide, or a combination thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="21" publication-number="202627769"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627769.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍵盤裝置以及鍵盤輸入方法</chinese-title>  
        <english-title>KEYBOARD DEVICE AND KEYBOARD INPUT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250321B">G06F3/03</main-classification>  
        <further-classification edition="200601120250321B">H01H13/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHIH HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種鍵盤裝置以及鍵盤輸入方法。鍵盤裝置包括按鍵模組以及控制器。控制器電性連接按鍵模組。控制器用以取得按鍵模組的多個按鍵的多個按壓距離。控制器根據多個按壓距離判斷按鍵模組中的多個特定按鍵是否被輕觸。當控制器判斷所述多個特定按鍵被輕觸時，控制器輸出控制指令。被輕觸的所述多個特定按鍵的所述多個按壓距離小於第一距離閾值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A keyboard device and a keyboard input method are provided. The keyboard device includes a key module and a controller. The controller is electrically connected to the key module. The controller is used to obtain a plurality of pressing distances of a plurality of keys of the key module. The controller determines whether a plurality of specific keys in the key module have been lightly touched based on the plurality of pressing distances. When the controller determines that the plurality of specific keys are lightly touched, the controller outputs a control instruction. The plurality of pressing distances of the plurality of lightly touched specific keys are less than a first distance threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鍵盤裝置</p>  
        <p type="p">110:控制器</p>  
        <p type="p">120:按鍵模組</p>  
        <p type="p">121_1、121_2~121_P:按鍵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="22" publication-number="202628238"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628238.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線裝置</chinese-title>  
        <english-title>ANTENNA DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">H01Q1/12</main-classification>  
        <further-classification edition="200601120250320B">H05K7/14</further-classification>  
        <further-classification edition="200601120250320B">H05K7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛羽庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線裝置包括電路板、無線模組、天線模組以及固定蓋。電路板具有第一連接器；無線模組設置在電路板上，且與第一連接器經由電路板電性連接；天線模組包括天線、傳輸線以及第二連接器，其中傳輸線連接在天線及第二連接器之間，第二連接器與第一連接器對接；以及固定蓋固定到電路板，且固定蓋接觸該第二連接器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna device including a circuit board, a wireless module, an antenna module and a fixed cover is provided. The circuit board has a first connector; the wireless module is disposed on the circuit board and is electrically connected to the first connector through the circuit board; the antenna module includes an antenna, a cable and a second connector, wherein the cable is connected between the antenna and the second connector, the second connector is connected to the first connector; and the fixing cover is fixed to the circuit board, and the fixing cover contacts the second connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線裝置</p>  
        <p type="p">110:電路板</p>  
        <p type="p">112:第一連接器</p>  
        <p type="p">120:無線模組</p>  
        <p type="p">130:天線模組</p>  
        <p type="p">132:天線</p>  
        <p type="p">134:傳輸線</p>  
        <p type="p">136:第二連接器</p>  
        <p type="p">140:固定蓋</p>  
        <p type="p">142:頂壁</p>  
        <p type="p">144:側壁</p>  
        <p type="p">144a:缺口</p>  
        <p type="p">150:導熱墊片</p>  
        <p type="p">160:鎖固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="23" publication-number="202628745"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628745.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10H29/855</main-classification>  
        <further-classification edition="202501120250801B">H10H29/856</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錼創顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLAYNITRIDE DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴皓云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HAO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒漢澄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, HAN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板，包含顯示基板、反射結構、多個微型發光元件、多個屈光結構及透光結構。反射結構設置於顯示基板，且區隔顯示基板的表面為多個畫素區域。各微型發光元件配置於這些畫素區域的其中一者，且在遠離顯示基板的一側具有上表面，上表面定義有中心區域及圍繞中心區域的外圍區域。各屈光結構覆蓋這些微型發光元件的其中一者的外圍區域，並暴露其中的微型發光元件的中心區域而形成凹口。透光結構覆蓋這些屈光結構以及這些微型發光元件，透光結構填充於各凹口並接觸各中心區域，且透光結構的折射率小於屈光結構的折射率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel includes a display substrate, a reflective structure, micro-light-emitting elements, refractive structures and a light transparent structure. The reflective structure is disposed on the display substrate, and defines a surface of the display substrate as pixel areas. Each of the micro-light-emitting elements is disposed on one of the pixel areas and has an upper surface away from the display substrate. The upper surface defines a central area and a peripheral area surrounding the central area. Each of the refractive structures covers the peripheral area of one of the micro-light-emitting elements and exposes the central area of the one of the micro-light-emitting elements to form a recess. The light transparent structure covers the refractive structures and the micro-light-emitting elements. The light transparent structure fills each of the recesses and contacts each of the central areas, and a refractive index of the light transparent structure is smaller than a refractive index of the refractive structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">θ:夾角</p>  
        <p type="p">X1、X2、X3:中心軸</p>  
        <p type="p">L1~L3:光線</p>  
        <p type="p">100:顯示面板</p>  
        <p type="p">110:顯示基板</p>  
        <p type="p">120:反射結構</p>  
        <p type="p">122:反射壁</p>  
        <p type="p">124:下層部</p>  
        <p type="p">126:上層部</p>  
        <p type="p">130:微型發光元件</p>  
        <p type="p">132:上表面</p>  
        <p type="p">134:中心區域</p>  
        <p type="p">136:外圍區域</p>  
        <p type="p">138:發光層</p>  
        <p type="p">140:屈光結構</p>  
        <p type="p">142:凹口</p>  
        <p type="p">144:接觸面</p>  
        <p type="p">145:交界點</p>  
        <p type="p">146:頂部</p>  
        <p type="p">148:內側壁</p>  
        <p type="p">150:透光結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="24" publication-number="202627734"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627734.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148916</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樞軸模組及電子裝置</chinese-title>  
        <english-title>PIVOT MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">G06F1/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哲賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHE-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱哲賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHE-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樞軸模組，包括一支架、一主軸體、一限位件及一轉動組件。主軸體連接於支架。限位件沿一轉動軸線連接於主軸體且包括一凸塊。一定位軸線與凸塊的一限位面之間具有一第一角度，定位軸線相異於轉動軸線。轉動組件可動地套設於主軸體且包括一止擋部。當樞軸模組處於一第一狀態時，止擋部與限位面之間具有一間隙。當樞軸模組處於一第二狀態時，止擋部接觸限位面，轉動組件與定位軸線之間具有一第二角度，第二角度小於第一角度。此外，一種電子裝置亦被提及。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pivot module including a bracket, a main shaft, a limiting member and a rotating assembly is provided. The main shaft is connected to the bracket. The limiting member is connected to the main shaft along a rotation axis and includes a protrusion. There is a first angle between a positioning axis and a limiting surface of the protrusion, and the positioning axis is different from the rotation axis. The rotating assembly is movably sleeved to the main shaft and includes a stop portion. When the pivot module is in a first state, there is a gap between the stop portion and the limiting surface. When the pivot module is in a second state, the stop portion contacts the limiting surface, and there is a second angle between the rotating assembly and the positioning axis, and the second angle is smaller than the first angle. In addition, an electronic device is also mentioned.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1:第一角度</p>  
        <p type="p">A2:第二角度</p>  
        <p type="p">L2:定位軸線</p>  
        <p type="p">M2:第二狀態</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">110:第一機體</p>  
        <p type="p">111:頂面</p>  
        <p type="p">120:第二機體</p>  
        <p type="p">121:顯示面</p>  
        <p type="p">130:支撐架</p>  
        <p type="p">131:開孔</p>  
        <p type="p">200:樞軸模組</p>  
        <p type="p">210:支架</p>  
        <p type="p">220:主軸體</p>  
        <p type="p">230:限位件</p>  
        <p type="p">231:凸塊</p>  
        <p type="p">232:限位面</p>  
        <p type="p">240:轉動組件</p>  
        <p type="p">241:止擋部</p>  
        <p type="p">242:凸出部</p>  
        <p type="p">243:轉動件</p>  
        <p type="p">244:滑動件</p>  
        <p type="p">2442:頂表面</p>  
        <p type="p">245:彈性件</p>  
        <p type="p">250:連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="25" publication-number="202628143"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628143.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電感元件及其製造方法</chinese-title>  
        <english-title>INDUCTOR AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250312B">H01F27/28</main-classification>  
        <further-classification edition="200601120250312B">H01F41/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇力新電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHILISIN ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹守義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, SHOU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡丰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖林梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, LINMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電感元件及其製造方法，包括磁性封裝結構、內埋於磁性封裝結構中的線圈主體、分別連接線圈主體兩端的兩條延伸線段及兩個密封材料。磁性封裝結構包括表面及設置於表面上的兩凹槽。每個延伸線段包括從線圈主體依序連接的彎折部、引腳部及固定部。彎折部從線圈主體朝向磁性封裝結構的表面而延伸，並且穿透表面而裸露於磁性封裝結構的外部。引腳部設置於磁性封裝結構的表面，並且從彎折部朝向凹槽而延伸。固定部從引腳部朝向凹槽的內部而延伸，並且沿著凹槽的側壁延伸至凹槽的底面。密封材料設置於凹槽的內部並且覆蓋固定部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inductor and a method for manufacturing the same are provided. The inductor includes a magnetic packaging structure, a coil embedded in the magnetic packaging structure, two extending wires connected to two ends of the core and two encapsulation materials. The magnetic packaging structure includes a surface and two cavities on the surface. Each extending wire includes a bending part, a pin part and a fixture part which are connected to each other in sequence. The bending part extends to the surface of the magnetic packaging structure from the core and penetrates through the surface to be exposed to the outside of the magnetic packaging structure. The pin part is disposed on the surface of the magnetic packaging structure and extends to one of the cavities from the bending part. The fixture part extends to the interior of the one of the cavities and extends to a bottom surface along with a side wall of this cavity. The encapsulation materials are disposed inside the cavities and cover the fixture part in each cavity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電感元件</p>  
        <p type="p">120:磁性封裝結構</p>  
        <p type="p">120s:表面</p>  
        <p type="p">122:凹槽</p>  
        <p type="p">140:線圈主體</p>  
        <p type="p">160:延伸線段</p>  
        <p type="p">162:彎折部</p>  
        <p type="p">164:引腳部</p>  
        <p type="p">166:固定部</p>  
        <p type="p">180a,180b:密封材料</p>  
        <p type="p">190:保護層</p>  
        <p type="p">A1:軸心</p>  
        <p type="p">CS:截面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="26" publication-number="202627113"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627113.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148921</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含鐵細料之造塊方法</chinese-title>  
        <english-title>METHOD OF BRIQUETTING IRON-CONTAINING FINE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241226B">C22B1/248</main-classification>  
        <further-classification edition="200601120241226B">C22B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鐿夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡耀慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪永熊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YUNG-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳榮志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RONG-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含鐵細料之造塊方法，其係在常溫下，對不含黏結劑之乾燥含鐵細料施以較高的線壓力，以獲得抗壓強度及低溫還原粉化率符合回收用之煉鐵/煉鋼製程與塊材運輸要求的含鐵塊材。此方法不僅製程簡單、低成本、低耗能，且因乾燥含鐵細料不含黏結劑，造塊後不需經由養生硬化，能減少場地需求並縮短製程時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of briquetting iron-containing fine material is provided. In the method, a dry iron-containing fine material without binder is applied with a higher linear pressure at room temperature, so as to obtain an iron-containing bulk material with compressive strength and reduction degradation index both of which meet the requirements of the iron/steel-making process for recycling and the transportation of the bulk material. This method is not only a simple, low-cost, and low-energy-consumption process, but also reduces space requirements and the processing time due to the dry iron-containing fine material without any binder and no need for aging and hardening after briquetting.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">101,103:操作</p>  
        <p type="p">105:獲得含鐵塊材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="27" publication-number="202627071"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627071.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>賦予食品曳絲性的乳酸菌</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">C12N1/20</main-classification>  
        <further-classification edition="202501120260302B">A23C11/10</further-classification>  
        <further-classification edition="200601120260302B">A23C9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京科學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商咕嘟媽咪股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURUNAVI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田拓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, TAKUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田和典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明目的提供一種新的乳酸菌，其可對於發酵物賦予曳絲性。 &lt;br/&gt;[解決手段] 本發明人發現了由醃漬物分離出來的新穎乳酸菌之植物乳桿菌(Lactiplantibacillus plantarum) KY5-ES5株(寄存編號：NITEP-04000)的發酵物具有曳絲性。與植物乳桿菌的公開菌株JCM1100株、JCM1149T株以及本公司保有的菌株35種進行比較檢討，結果驚人地發現僅在以KY5-ES5株進行培養的發酵物中具有高曳絲性，而提供KY5-ES5株以作為新穎菌株。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="28" publication-number="202626004"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626004.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兩截式鼻胃管結構改良</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">A61J15/00</main-classification>  
        <further-classification edition="200601120250102B">A61M39/08</further-classification>  
        <further-classification edition="200601120250102B">A61M39/10</further-classification>  
        <further-classification edition="200601120250102B">A61M25/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彰化基督教醫療財團法人彰化基督教醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧通醫材科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉森永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭勝夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種兩截式鼻胃管結構改良，包含：一第一管體及一第二管體，該第一管體一端設置一第一接頭，該第二管體一端設置一第二接頭，該第二接頭與該第一接頭採用相互套合和旋轉卡扣方式連接，藉以可降低病患的不適感，提高醫護人員的操作方便性，節省醫療時間成本，同時增強連接的穩固性以避免非預期的分離情況，提升使用方便性，完全符合實際應用需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一管體</p>  
        <p type="p">10:第一接頭</p>  
        <p type="p">11:套合部</p>  
        <p type="p">111:卡扣塊</p>  
        <p type="p">112:插接孔</p>  
        <p type="p">12:封閉件</p>  
        <p type="p">121:延伸片</p>  
        <p type="p">122:封蓋</p>  
        <p type="p">2:第二管體</p>  
        <p type="p">20:第二接頭</p>  
        <p type="p">22:定位溝槽</p>  
        <p type="p">24:卡合槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="29" publication-number="202626351"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626351.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148929</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合元件及行動裝置</chinese-title>  
        <english-title>COMPOSITE ELEMENT AND MOBILE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241225B">B32B15/01</main-classification>  
        <further-classification edition="200601120241225B">C22C16/00</further-classification>  
        <further-classification edition="200601120241225B">H05K5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張沛頎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PEI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪于傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, YU-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧鈞鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種複合元件，包含一複合結構。複合結構包含一基材及一複合層，複合層設置於基材的一表面，且複合層包含一合金層。合金層包含至少三金屬，且所述至少三金屬包含鋯、銅及鋁。藉由複合元件包含複合結構，且在複合結構的基材表面設置包含合金層的複合層，使複合結構獲得理想性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a composite element including a composite structure. The composite structure includes a substrate and a composite layer, wherein the composite layer is disposed on a surface of the substrate, and the composite layer includes an alloy layer. The alloy layer includes at least three metals, and the at least three metals include zirconium, copper and aluminum. Therefore, by the arrangement that the composite element includes the composite structure, and the surface of the substrate of the composite structure is arranged with the composite layer including the alloy layer, the ideal properties of the composite structure can be obtained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:行動裝置</p>  
        <p type="p">11:複合元件</p>  
        <p type="p">13:螢幕</p>  
        <p type="p">101:轉折區</p>  
        <p type="p">102:長邊區</p>  
        <p type="p">103:短邊區</p>  
        <p type="p">110:複合結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="30" publication-number="202626978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>建材用塗料、建築構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C09D1/00</main-classification>  
        <further-classification edition="201801120250402B">C09D7/61</further-classification>  
        <further-classification edition="201801120250402B">C09D7/65</further-classification>  
        <further-classification edition="200601120250402B">C09D5/00</further-classification>  
        <further-classification edition="200601120250402B">E04B1/64</further-classification>  
        <further-classification edition="200601120250402B">E04B1/76</further-classification>  
        <further-classification edition="200601120250402B">E04B1/94</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤榮欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤榮欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種建築構件包含一基材體及一覆蓋在該基材體表面的功能塗層，且該功能塗層由一種建材用塗料固化所形成。該建材用塗料包含A劑及B劑，該A劑包括骨材、紫外線阻隔劑、擴散劑、疏水性可再分散乳膠粉、耐熱級丙烯腈-丁二烯-苯乙烯共聚物及水性壓克力樹脂，該B劑包括矽酸鹽類固化劑。該建築構件具備抗熱、防水、耐蝕、耐鹼及防焰的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材體</p>  
        <p type="p">2:功能塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="31" publication-number="202627513"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627513.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於電池健康狀態的充電評估方法及其之使用</chinese-title>  
        <english-title>CHARGING EVALUATION METHOD BASED ON STATE OF HEALTH OF BATTERY AND USE OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241231B">G01R31/396</main-classification>  
        <further-classification edition="201901120241231B">G01R31/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘秉毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, PING-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃建中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋隆裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, LUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉益華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃士權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHI-QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔慶茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, CHING-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於電池健康狀態的充電評估方法，包括以下步驟：提供處於複數種電池健康狀態的一或多個電池；以複數種充電法對一或多個電池進行充電；擷取所述一或多個電池在充電過程的複數種電池參數；以所述複數種電池參數形成對應單一種電池健康狀態的一雷達圖；計算並比較所述複數種充電法在所述雷達圖上對應的面積占比；以及，判定所述複數種充電法中具有最高面積占比的一者作為一電池健康狀態區間所適用的充電法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charging evaluation method based on state of health of battery comprises the following steps: providing one or more batteries with multiple types of state of health; charging one or more batteries by multiple types of charging methods; acquiring multiple types of battery parameter of the one or more batteries during the charging process; forming a radar chart corresponding to a single kind of state of health based on the multiple types of battery parameter; calculating and comparing area proportions of multiple types of charging methods on the radar chart; and determining the one with the highest area proportion among multiple types of charging methods to be a charging method applicable to an interval of state of health.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S160:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="32" publication-number="202628724"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628724.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250613B">H10H20/856</main-classification>  
        <further-classification edition="202501120250613B">H10H29/14</further-classification>  
        <further-classification edition="202501120250613B">H10H29/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝嘉定</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子芩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉展睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHAN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括基板以及其上的多個顯示單元。顯示單元包括發光二極體、第一絕緣層以及第二絕緣層。發光二極體包括依序配置的第一半導體層、發光層以及第二半導體層。第一絕緣層以及第二絕緣層圍繞發光二極體，其中第一絕緣層配置於基板以及第二絕緣層之間。第二半導體層的頂面與基板之間的距離大於第一絕緣層的頂面與基板之間的距離，且小於第二絕緣層的頂面與基板之間的距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device including a substrate and a plurality of display units thereon is provided. The display unit includes a light emitting diode, a first insulating layer and a second insulating layer. The light emitting diode includes a first semiconductor layer, a light emitting layer and a second semiconductor layer in sequence. The first insulating layer and the second insulating layer surround the light emitting diode, wherein the first insulating layer is disposed between the substrate and the second insulating layer. A distance between a top surface of the second semiconductor layer and the substrate is greater than a distance between a top surface of the first insulating layer and the substrate, and smaller than a distance between a top surface of the second insulating layer and the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">10:顯示單元</p>  
        <p type="p">101:第一絕緣層</p>  
        <p type="p">101P:部分頂面</p>  
        <p type="p">101T:頂面</p>  
        <p type="p">102:第二絕緣層</p>  
        <p type="p">102B’:輪廓</p>  
        <p type="p">102S:側面、出光面</p>  
        <p type="p">102S’:側面</p>  
        <p type="p">102T:頂面</p>  
        <p type="p">102T’:頂面</p>  
        <p type="p">200:發光二極體</p>  
        <p type="p">200S:側面、出光面</p>  
        <p type="p">201:第一半導體層</p>  
        <p type="p">202:第二半導體層</p>  
        <p type="p">202T:頂面</p>  
        <p type="p">203:發光層</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">H1:第一距離</p>  
        <p type="p">H2:第二距離</p>  
        <p type="p">H3:第三距離</p>  
        <p type="p">L1、L1’:光線</p>  
        <p type="p">PAD:電極接墊</p>  
        <p type="p">SB:基板</p>  
        <p type="p">SD:焊料</p>  
        <p type="p">T1、T2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="33" publication-number="202627603"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627603.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像鏡頭（八十三）</chinese-title>  
        <english-title>LENS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G02B13/18</main-classification>  
        <further-classification edition="200601120241231B">G02B13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞洲光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA OPTICAL CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施柏源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像鏡頭包括一第一透鏡、一第二透鏡、一第三透鏡以及一第四透鏡。該第一透鏡具有正屈光力，且包括一凸面朝向一物側。該第二透鏡具有屈光力。該第三透鏡為彎月型透鏡具有正屈光力，且包括一凹面朝向該物側以及一凸面朝向一像側。該第四透鏡具有負屈光力且包括一凹面朝向該像側。該第一透鏡、該第二透鏡、該第三透鏡以及該第四透鏡沿著一光軸從該物側至該像側依序排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lens assembly includes a first lens, a second lens, a third lens, and a fourth lens. The first lens is with positive refractive power and includes a convex surface facing an object side. The second lens is with refractive power. The third lens is a meniscus lens with positive refractive power and includes a concave surface facing the object side and a convex surface facing an image side. The fourth lens is with negative refractive power and includes a concave surface facing the image side. The first lens, the second lens, the third lens, and the fourth lens are arranged in order from the object side to the image side along an optical axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:成像鏡頭</p>  
        <p type="p">ST1:光圈</p>  
        <p type="p">L11:第一透鏡</p>  
        <p type="p">L12:第二透鏡</p>  
        <p type="p">L13:第三透鏡</p>  
        <p type="p">L14:第四透鏡</p>  
        <p type="p">CG1:保護玻璃</p>  
        <p type="p">IMA1:成像面</p>  
        <p type="p">OA1:光軸</p>  
        <p type="p">S11:光圈面</p>  
        <p type="p">S12:第一透鏡物側面</p>  
        <p type="p">S13:第一透鏡像側面</p>  
        <p type="p">S14:第二透鏡物側面</p>  
        <p type="p">S15:第二透鏡像側面</p>  
        <p type="p">S16:第三透鏡物側面</p>  
        <p type="p">S17:第三透鏡像側面</p>  
        <p type="p">S18:第四透鏡物側面</p>  
        <p type="p">S19:第四透鏡像側面</p>  
        <p type="p">S110:保護玻璃物側面</p>  
        <p type="p">S111:保護玻璃像側面</p>  
        <p type="p">S4:深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="34" publication-number="202628246"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628246.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線結構及應用其的通訊設備</chinese-title>  
        <english-title>ANTENNA STRUCTURE AND COMMUNICATION APPARATUS APPLYING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H01Q9/04</main-classification>  
        <further-classification edition="200601120250303B">H01Q9/42</further-classification>  
        <further-classification edition="201501120250303B">H01Q5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江建佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIE-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線結構包括: 接地單元、第一輻射單元以及第二輻射單元。第一輻射單元連接接地單元，且包括第一延伸枝節及第二延伸枝節。第一延伸枝節沿著第一方向延伸；第二延伸枝節從第一延伸枝節的第一起始端，沿著實質上垂直第一方向的第二方向向外延伸。第二輻射單元連接該接地單元，且包括第四延伸枝節及第五延伸枝節。其中，第四延伸枝節沿著實質上平行第一方向的第三方向延伸；第五延伸枝節從第四延伸枝節的第二起始端，沿著實質上平行第二方向的第四方向向外延伸。第一起始端與第二起始端相對，且彼此分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna structure includes: a ground unit, a first radiating unit and a second radiating unit. The first radiating unit is connected to the ground unit and includes a first extending branch and a second extending branch. The first extension branch extends along a first direction; the second extension branch extends outward from a first starting end of the first extension branch along a second direction substantially perpendicular to the first direction. The second radiating unit is connected to the ground unit and includes a third extending branch and a fourth extending branch. The third extension branch extends along a third direction substantially parallel to the first direction; the fourth extension branch extends outward from a second starting end of the third extension branch along a fourth direction substantially parallel to the second direction. The first starting end and the second starting end are opposite and separated from each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線結構</p>  
        <p type="p">101:接地單元</p>  
        <p type="p">101A:金屬表面</p>  
        <p type="p">102A:第一延伸枝節</p>  
        <p type="p">102B:第二延伸枝節</p>  
        <p type="p">102C:第三延伸枝節</p>  
        <p type="p">102E:第一延伸端</p>  
        <p type="p">102S:第一起始端</p>  
        <p type="p">104:第一彎折腳</p>  
        <p type="p">105:饋入點</p>  
        <p type="p">106:射頻導線</p>  
        <p type="p">112:第二輻射單元</p>  
        <p type="p">112A:第四延伸枝節</p>  
        <p type="p">112B:第五延伸枝節</p>  
        <p type="p">112C:第六延伸枝節</p>  
        <p type="p">112E:第二延伸端</p>  
        <p type="p">112S:第二起始端</p>  
        <p type="p">114:第二彎折腳</p>  
        <p type="p">114A:第三連接部</p>  
        <p type="p">114B:第四連接部</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">D4:第四方向</p>  
        <p type="p">θ1:非平(非180°)角</p>  
        <p type="p">θ2:非平(非180°)角</p>  
        <p type="p">L1:L型的彎折結構</p>  
        <p type="p">L3:L型的彎折結構</p>  
        <p type="p">L4:L型的彎折結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="35" publication-number="202627449"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627449.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148950</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層膜截面的光譜同步量測裝置</chinese-title>  
        <english-title>SPECTRAL SYNCHRONIZED MEASUREMENT APPARATUS FOR MULTILAYER FILM CROSS SECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G01N21/65</main-classification>  
        <further-classification edition="201401120250512B">G01N21/35</further-classification>  
        <further-classification edition="200601120250512B">G01N21/41</further-classification>  
        <further-classification edition="200601120250512B">G01J3/44</further-classification>  
        <further-classification edition="200601120250512B">G01J3/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景鴻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳景翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多層膜截面的光譜同步量測裝置，其中多層膜截面的光譜同步量測裝置包括一第一光源、一第二光源、一第一感測元件、一第二感測元件、一物鏡以及一光學掃描器。該第一光源發出一第一光線。該第二光源發出一第二光線。該光學掃描器可改變該第一光線的行進方向，使該第一光線進行二維掃描一測試樣品。該測試樣品經該第一光線照射後被激發出一散射光。該散射光由該第一感測元件接收。該測試樣品經該第二光線照射後發出一反射光。該反射光由該第二感測元件接收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A spectral synchronized measurement apparatus for multilayer film cross section includes a first light source, a second light source, a first sensing element, a second sensing element, an object lens, and an optical scanner. The first light source emits a first light ray. The second light source emits a second light ray. The optical scanner can change the propagating direction of the first light so that the first light scans a test sample in two dimensions. The test sample is excited to emit a scattered light after being illuminated by the first light. The scattered light is received by the first sensing element. The test sample emits a reflected light after being illuminated by the second light. The reflected light is received by the second sensing element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多層膜截面的光譜同步量測裝置</p>  
        <p type="p">10:置物平台</p>  
        <p type="p">30:物鏡</p>  
        <p type="p">40:暗場光源</p>  
        <p type="p">50:第二光譜分析儀</p>  
        <p type="p">60:雷射光源</p>  
        <p type="p">70:第一光譜分析儀</p>  
        <p type="p">81:分光鏡</p>  
        <p type="p">82:分光鏡</p>  
        <p type="p">83:分光鏡</p>  
        <p type="p">84:雷射掃描器</p>  
        <p type="p">85:陷波濾波器</p>  
        <p type="p">86:反射鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="36" publication-number="202626920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽水凝膠混合物及其所形成之可濕式矽水凝膠鏡片</chinese-title>  
        <english-title>SILICONE HYDROGEL MIXTURE AND WETTABLE SILICONE HYDROGEL LENS FORMED THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241225B">C08K5/103</main-classification>  
        <further-classification edition="200601120241225B">C08L83/04</further-classification>  
        <further-classification edition="200601120241225B">G02C7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玥鴻醫材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCENS TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐國騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, KUO TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁鐵生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種矽水凝膠混合物及其所形成之可濕式矽水凝膠鏡片，所述矽水凝膠混合物包含一聚矽氧烷巨分子、一親水性聚合物以及一親水性非聚矽氧交聯劑，其中所述親水性非聚矽氧交聯劑為聚乙二醇二甲基丙烯酸酯（PEGDMA），其具有以下由式（A）表示的結構式： &lt;br/&gt;&lt;img align="absmiddle" height="105px" width="343px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;其中R &lt;sub&gt;1&lt;/sub&gt;及R &lt;sub&gt;2&lt;/sub&gt;為CH &lt;sub&gt;3&lt;/sub&gt;或R &lt;sub&gt;1&lt;/sub&gt;及R &lt;sub&gt;2&lt;/sub&gt;為H，n為4至42之一整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A silicone hydrogel mixture and a wettable silicone hydrogel lens formed thereof. The silicone hydrogel mixture comprises a silicone macromere, a hydrophilic polymer, and a non-silicone hydrophilic crosslinker, wherein the non-silicone hydrophilic crosslinker is Polyethylene glycol dimethacrylate (PEGDMA) represented by the following structural formula (A): &lt;br/&gt;&lt;img align="absmiddle" height="117px" width="350px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;wherein R &lt;sub&gt;1&lt;/sub&gt;and R &lt;sub&gt;2&lt;/sub&gt;are CH &lt;sub&gt;3&lt;/sub&gt;or R &lt;sub&gt;1&lt;/sub&gt;and R &lt;sub&gt;2&lt;/sub&gt;are H, and n is an integer from 4 to 42.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="37" publication-number="202627845"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627845.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遠端授權系統</chinese-title>  
        <english-title>REMOTE AUTHORIZATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250303B">G06F21/30</main-classification>  
        <further-classification edition="201301120250303B">G06F21/31</further-classification>  
        <further-classification edition="200601120250303B">H04L9/32</further-classification>  
        <further-classification edition="202201120250303B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳提</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JIA TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種遠端授權系統，包含複數個使用者裝置、複數個代理使用者裝置以及一授權伺服器。該授權伺服器通訊連接至該等使用者裝置及該等代理使用者裝置。該系統響應於該等代理使用者裝置中之一第一代理使用者裝置產生一待授權資料，自該第一代理使用者裝置接收該待授權資料；該系統傳送該待授權資料至一第一使用者裝置；該系統響應於自該第一使用者裝置接收一確認訊號，傳送一授權密碼至該第一代理使用者裝置；該系統響應於該第一代理使用者裝置之一輸入密碼對應至該授權密碼，授權該待授權資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A remote authorization system includes a plurality of user devices, a plurality of proxy user devices and an authorization server. The authorization server communicatively connects the user devices and the proxy user devices. In response to a first proxy user device among the proxy user devices generating a pending authorization data, the system receives the pending authorization data from the first proxy user device. The system sends the pending authorization data to a first user device. In response to receiving a confirmation signal from the first user device, the system sends an authorization password to the first proxy user device. In response to an input password of the first proxy user device corresponding to the authorization password, the system authorizes the pending authorization data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:遠端授權系統</p>  
        <p type="p">UD1、UD2、......、UDx:使用者裝置</p>  
        <p type="p">PUD1、PUD2、......、PUDy:代理使用者裝置</p>  
        <p type="p">AS:授權伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="38" publication-number="202627056"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627056.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148967</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗劑組成物及使用其去除高分子膜之方法</chinese-title>  
        <english-title>CLEANING COMPOSITION AND METHOD FOR REMOVING POLYMER FILM USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C11D1/62</main-classification>  
        <further-classification edition="200601120260401B">C11D1/24</further-classification>  
        <further-classification edition="200601120260401B">C11D3/32</further-classification>  
        <further-classification edition="202601120260401B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻悅先進科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGYUE ADVANCED TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李盈壕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清洗劑組成物及使用該清洗劑組成物去除高分子膜接合材料之方法，特別係去除矽氧烷高分子接合材料之方法，其中，該清洗劑組成物至少包含氟化季銨鹽化合物(重量百分濃度：0.1%-15%)、烷基醯胺化合物(重量百分濃度：20%-95%)、芳香醚化合物(重量百分濃度：1%-80%)及水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a cleaning composition and a method for removing polymer film bonding materials using the same, especially for removing siloxane polymer bonding materials, wherein the cleaning composition at least comprises tetraalkylammonium fluoride (weight percentage concentration: 0.1%-15%), alkyl amide (weight percentage concentration: 20%-95%), aromatic ether (weight percentage concentration: 1%-80%) and water.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="39" publication-number="202627632"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627632.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秉勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PING-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚怡安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, I-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開一種電子裝置，包括一第一基板、一電子單元、一相位延遲層、以及一偏光層。第一基板具有法線方向；電子單元設置於第一基板上；相位延遲層設置於電子單元相反於第一基板之一側，且包含在垂直法線方向上彼此相鄰的第一部分與第二部分，第一部分包含第一快軸，第二部分包含第二快軸；偏光層設置於相位延遲層相反於電子單元之一側，且包含穿透軸。第一快軸與穿透軸之間的夾角不同於第二快軸與穿透軸之間的夾角；或第一部分的相位延遲不同於第二部分的相位延遲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an electronic device, which includes a first substrate, an electronic unit, a retardation layer, and a polarizing layer. The first substrate has a normal direction. The electronic unit is disposed on the first substrate. The retardation layer is disposed on a side of the electronic unit away from the first substrate, and includes a first portion and a second portion adjacent to each other in a direction perpendicular to the normal direction. The first portion has a first fast axis, and the second portion has a second fast axis. The polarizing layer is disposed on a side of the retardation layer away from the electronic unit, and has a transmission axis. The included angle between the first fast axis and the transmission axis is different from the included angle between the second fast axis and the transmission axis, or the phase retardation of the first portion is different from the phase retardation of the second portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">12:第二基板</p>  
        <p type="p">13:電子單元</p>  
        <p type="p">13a,13b,13c:發光元件</p>  
        <p type="p">14:相位延遲層</p>  
        <p type="p">141:第一部分</p>  
        <p type="p">142:第二部分</p>  
        <p type="p">15:偏光層</p>  
        <p type="p">16:黏著層</p>  
        <p type="p">A,B:區域</p>  
        <p type="p">N:法線方向</p>  
        <p type="p">S1:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="40" publication-number="202625972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>刺激訊號控制系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD OF CONTROLLING STIMULATION SIGNAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241231B">A61B5/24</main-classification>  
        <further-classification edition="202101120241231B">A61B5/279</further-classification>  
        <further-classification edition="202101120241231B">A61B5/31</further-classification>  
        <further-classification edition="200601120241231B">A61N1/32</further-classification>  
        <further-classification edition="200601120241231B">A61H39/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亭侁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TING-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種刺激訊號控制系統及方法。刺激訊號控制方法包含以控制裝置執行：根據多個候選光刺激參數組中的第一光刺激參數組控制多個光刺激元件輸出第一刺激訊號，其中所述多個候選光刺激參數組各包含閃爍度值、亮度值及所述多個光刺激元件各自的佔空比，取得對應於第一刺激訊號的回饋訊號，判斷回饋訊號是否對應於待優化結果，當回饋訊號對應於待優化結果時，根據回饋訊號從所述多個選光刺激參數組中選擇相鄰於第一光刺激參數組的第二光刺激參數組，以及根據第二光刺激參數組控制所述多個光刺激元件輸出第二刺激訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure proposes a system and method of controlling stimulation signal. The method of controlling stimulation signal, performed by a control device, includes: controlling light stimulation elements to output a first stimulation signal according to a first light stimulation parameter group among candidate light stimulation parameter groups, wherein each of the candidate light stimulation parameter groups includes a flicker value, a brightness value, and a duty cycle of each of the light stimulation elements, obtaining a feedback signal corresponding to the first stimulation signal, determining whether the feedback signal corresponds to a to-be-optimized result, selecting a second light stimulation parameter group next to the first light stimulation parameter group from the candidate light stimulation parameter groups according to the feedback signal when the feedback signal corresponds to the to-be-optimized result, and controlling the light stimulation elements to output a second stimulation signal according to the second light stimulation parameter group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107,S109:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="41" publication-number="202626414"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626414.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148981</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛狀態預測系統及方法</chinese-title>  
        <english-title>VEHICLE STATUS PREDICTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250326B">B60W50/04</main-classification>  
        <further-classification edition="201201120250326B">B60W40/12</further-classification>  
        <further-classification edition="201201120250326B">B60W40/10</further-classification>  
        <further-classification edition="201601120250326B">B60W20/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛毓弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, YU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種車輛狀態預測系統及方法。車輛狀態預測方法，適用於安裝有至少一感測器的車輛，所述方法包含以處理裝置執行：取得至少一感測器產生的至少一筆原始行車資料，依據多個待觀測指標從所述至少一筆原始行車資料萃取出至少一目標子資料集，對所述至少一目標子資料集進行分群以產生群集標籤，以及根據群集標籤利用預訓練模型對所述至少一筆原始行車資料進行預測，以產生車輛的狀態預測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a vehicle status prediction system and method. The vehicle status prediction method is adapted to a vehicle installed with at least one sensor, and the method, performed by a processing device, includes: obtaining at least one set of raw driving data from the at least one sensor, extracting at least one target sub-data set from the at least one set of raw driving data based on observation indicators, performing clustering on the at least one target sub-data set to generate a cluster label, and using a pre-trained model according to the cluster label to predict the at least one set of raw driving data to generate a vehicle status prediction result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="42" publication-number="202628531"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628531.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148984</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性流體、使用此磁性流體的液冷系統及液冷系統的元件配置方法</chinese-title>  
        <english-title>MAGNETIC FLUID, LIQUID COOLING SYSTEM USING THE SAME, AND COMPONENT CONFIGURATION METHOD FOR LIQUID COOLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">H05K7/20</main-classification>  
        <further-classification edition="200601120250422B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何亞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳采亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSAI-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈之涯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHIH-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒達仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, DA-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁性流體、使用此磁性流體的液冷系統及液冷系統的元件配置方法。磁性流體，適用於液冷系統，包含：流體溶劑以及磁性物質。磁性物質混合於流體溶劑中，磁性物質包含氧化鐵及石墨烯中的至少一者，磁性物質的粒徑的範圍為5奈米到1公釐，且磁性物質在流體溶劑的重量百分比大於0%且不大於10%。元件配置方法適用於包含液冷系統及多個電子元件的電子裝置，液冷系統可包括供磁性流體流過的散熱流道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a magnetic fluid, liquid cooling system using the same and component configuration method for liquid cooling system. The magnetic fluid, adapted to a liquid cooling system, includes a fluid solvent and a magnetic substance. The magnetic substance includes at least one of iron oxide and graphene, a particle size of the magnetic substance ranges from 5 nanometers to 1 millimeter, and a weight percentage of the magnetic substance in the fluid solvent is greater than 0% and not more than 10%. The component configuration method is applicable to an electronic device including the liquid cooling system and electronic components, wherein the liquid cooling system may include a heat dissipation flow channel designed for the passage of the magnetic fluid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107,S109,S111:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="43" publication-number="202628320"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628320.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軸承組件</chinese-title>  
        <english-title>BEARING ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250312B">H02K5/16</main-classification>  
        <further-classification edition="200601120250312B">H02K5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建準電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高瑋廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, WEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝坤利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KUN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軸承組件，用以解決習知軸承內空氣難以排出的問題。係包含：一套筒，具有一開口及一封閉部；及一軸承，該軸承位於該套筒內部，該軸承與該封閉部之間具有一儲油空間，該軸承具有一截面部，該截面部與該套筒的內壁面之間具有間距而形成一排氣通道，該開口藉由該排氣通道連通該儲油空間。藉此可以達成空氣容易排出使該轉軸能夠順暢安裝等功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bearing assembly is used to solve the problem that air in conventional bearings is difficult to discharge. Includes: a sleeve with an opening and a closing part; and a bearing, the bearing is located inside the sleeve, there is an oil storage space between the bearing and the closing part, the bearing has a cross-section with a distance between the inner wall surface of the sleeve and the opening to form an exhaust channel, and the opening communicates with the oil storage space through the exhaust channel. This allows the air to be easily discharged and the shaft to be installed smoothly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:套筒</p>  
        <p type="p">1a:內壁面</p>  
        <p type="p">11:開口</p>  
        <p type="p">12:封閉部</p>  
        <p type="p">12a:內底面</p>  
        <p type="p">13:肩部</p>  
        <p type="p">14:縮徑部</p>  
        <p type="p">15:封蓋</p>  
        <p type="p">15a:通孔</p>  
        <p type="p">16:防脫件</p>  
        <p type="p">16a:貫孔</p>  
        <p type="p">161:貫通槽</p>  
        <p type="p">17:耐磨片</p>  
        <p type="p">2:軸承</p>  
        <p type="p">2a:第一端面</p>  
        <p type="p">2b:第二端面</p>  
        <p type="p">21:軸孔</p>  
        <p type="p">22:大徑段</p>  
        <p type="p">23:小徑段</p>  
        <p type="p">24:抵接面</p>  
        <p type="p">25:截面部</p>  
        <p type="p">25a:徑向端邊</p>  
        <p type="p">251:第一軸向端邊</p>  
        <p type="p">252:第二軸向端邊</p>  
        <p type="p">26:凹入部</p>  
        <p type="p">261:凹底面</p>  
        <p type="p">262:內環壁</p>  
        <p type="p">T:轉軸</p>  
        <p type="p">T1:環槽</p>  
        <p type="p">J:軸承組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="44" publication-number="202627111"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627111.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148989</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疊積鐵芯用電磁鋼及其製造方法</chinese-title>  
        <english-title>ELECTROMAGNETIC STEEL FOR LAMINATED IRON CORE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">C21D1/30</main-classification>  
        <further-classification edition="200601120241231B">H01F41/02</further-classification>  
        <further-classification edition="200601120241231B">C22C38/34</further-classification>  
        <further-classification edition="200601120241231B">H01F27/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭一清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, I-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李欣怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伯宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種疊積鐵芯用電磁鋼及其製造方法，該方法包括以下步驟：提供一電磁鋼材，其中按該電磁鋼材總重為100 wt%計，該電磁鋼材包括2至4 wt%的矽、0.3至2 wt%的鋁、0.1至0.5 wt%的錳、大於0 wt%且0.0050 wt%以下的碳、大於0 wt%且0.0050 wt%以下的硫、大於0 wt%且0.0050 wt%以下的氮、大於0 wt%且0.0050 wt%以下的氧、平衡量的鐵及不可避免的雜質；及對該電磁鋼材進行一退火步驟，其中該退火步驟之退火溫度為700至850℃之間和退火時間為50至300秒之間，並將該電磁鋼材的再結晶尺寸控制為介於5至35微米之間，從而通過固溶強化、細晶及強化使得該電磁鋼材之鐵損W10/400控制為25 W/kg以下，從而形成降伏強度為500 MPa以上的一電磁鋼材產物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electromagnetic steel for laminated iron core and manufacturing method thereof are provided. The method includes the following steps: providing an electromagnetic steel, wherein the electromagnetic steel includes 2 to 4 wt% silicon, 0.3 to 2 wt% aluminum, 0.1 to 0.5 wt% manganese, greater than 0 wt% and equal to or less than 0.0050 wt% carbon, greater than 0 wt% and equal to or less than 0.0050 wt% sulfur, greater than 0 wt% and equal to or less than 0.0050 wt% nitrogen, greater than 0 wt% and equal to or less than 0.0050 wt% oxygen, a balanced amount of iron, and inevitable impurities, based on a total weight of 100 wt% of the electromagnetic steel; and performing an annealing step on the electromagnetic steel, wherein the annealing temperature of the annealing step ranges from 700 to 850 ℃ and the annealing time ranges from 50 and 300 seconds, and the recrystallization size of the electromagnetic steel is controlled between 5 and 35 microns, so that the iron loss W10/400 of the electromagnetic steel is controlled below 25 W/kg through solid solution strengthening, fine grain strengthening and dislocation strengthening, thereby forming an electromagnetic steel product with a yield strength of 500 MPa or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="45" publication-number="202628133"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628133.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>埋管深度的推估方法</chinese-title>  
        <english-title>ESTIMATING METHOD FOR BURIED-PIPELINE DEPTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250512B">G16Y40/20</main-classification>  
        <further-classification edition="202001120250512B">G16Y20/10</further-classification>  
        <further-classification edition="202001120250512B">G16Y10/35</further-classification>  
        <further-classification edition="202301120250512B">G06N3/08</further-classification>  
        <further-classification edition="202301120250512B">G06N3/045</further-classification>  
        <further-classification edition="200601120250512B">H01B7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宜宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種埋管深度的推估方法，其包括：取得當前海水溫度監控資料；根據當前海水溫度監控資料，藉由環境溫度推估模型產生當前海床溫度模擬資料；根據當前海床溫度模擬資料，藉由熱流固耦合模型產生當前電纜溫度模擬資料；取得當前電纜溫度監控資料；以及根據當前電纜溫度模擬資料及當前電纜溫度監控資料，藉由埋管深度推估模型產生當前埋管深度推估結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An estimating method for the buried-pipeline depth is provided, which includes the following steps. Current adjacent ambient-temperature monitoring data of a pipe is measured. According to the current adjacent ambient-temperature monitoring data, current buried-pipeline ambient-temperature simulation data is generated through an ambient-temperature estimation model. According to the current buried-pipeline ambient-temperature simulation data, current pipe-body temperature simulation data is generated through a thermal-fluid-solid interaction model. Current pipe-body temperature monitoring data of the pipe is measured. According to the current pipe-body temperature simulation data and the current pipe-body temperature monitoring data, current buried-pipeline depth result is generated by a buried-pipeline depth estimation model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資料採集模組</p>  
        <p type="p">2:資料推估模組</p>  
        <p type="p">CBT:當前海床溫度模擬資料</p>  
        <p type="p">CL:當前負載電流資料</p>  
        <p type="p">CPT1:當前電纜溫度模擬資料</p>  
        <p type="p">CPT2:當前電纜溫度監控資料</p>  
        <p type="p">CWT:當前海水溫度監控資料</p>  
        <p type="p">DR:當前埋管深度推估結果</p>  
        <p type="p">GV:埋管深度猜測值</p>  
        <p type="p">HBT1:歷史海床溫度監控資料</p>  
        <p type="p">HEP:歷史環境參數資料</p>  
        <p type="p">M1:環境溫度推估模型</p>  
        <p type="p">M2:熱流固耦合模型</p>  
        <p type="p">M3:埋管深度推估模型</p>  
        <p type="p">MP:電纜參數資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="46" publication-number="202626866"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626866.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流動型助劑及其製備方法</chinese-title>  
        <english-title>FLOW AGENT AND PREPARING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C08G73/10</main-classification>  
        <further-classification edition="200601120250402B">C08K5/3417</further-classification>  
        <further-classification edition="200601120250402B">C08L67/00</further-classification>  
        <further-classification edition="200601120250402B">C09K19/38</further-classification>  
        <further-classification edition="200601120250402B">C09K19/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人紡織產業綜合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周上智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種流動型助劑包括液晶聚酯及聚醯亞胺化合物。聚醯亞胺化合物具有如式(1)所式的重複單元： &lt;br/&gt;&lt;img align="absmiddle" height="133px" width="692px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;式(1)，其中在溫度為攝氏20度至攝氏50度時，聚醯亞胺化合物溶解於N-甲基吡咯烷酮中形成重量百分濃度為15%的溶液的特性黏度為100厘泊至190厘泊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flow agent includes a liquid crystal polyester and a polyimide compound. The polyimide compound has repeating units as shown in Formula (1): &lt;br/&gt;&lt;img align="absmiddle" height="128px" width="692px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;Formula (1), in which an intrinsic viscosity of a solution formed by dissolving the polyimide compound with a concentration of 15% by weight in N-methylpyrrolidone at a temperature of 20°C to 50 C is 100 cps to 190 cps.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S20:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="47" publication-number="202628725"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628725.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149001</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250312B">H10H20/857</main-classification>  
        <further-classification edition="202501120250312B">H10F77/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭修邑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHIOU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁建欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, JIAN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體元件，其包括驅動件、發光件、感光件、覆蓋層、複數第一電連接層及複數第二電連接層。發光件與感光件並排於驅動件上，且覆蓋層覆蓋發光件、感光件及驅動件。複數第一電連接層與複數第二電連接層位於覆蓋層與驅動件之間，使發光件可藉由複數第一電連接層與驅動件電性連接，感光件可藉由複數第二電連接層與驅動件電性連接。覆蓋層包含第一開口及第二開口，第一開口對應位於發光件上，並暴露出部分發光件，第二開口對應位於感光件上，並暴露出部分感光件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device is provided. The semiconductor device includes a driving element, a light-emitting element, a light-sensing element, a cover layer, multiple first electrical connecting layers, and multiple second electrical connecting layers. The light-emitting element and the light-sensing element are arranged side by side on the driving element. The cover layer covers the light-emitting element, the light-sensing element, and the driving element. The first electrical connecting layers and the second electrical connecting layers are arranged between the cover layer and the driving element. The light-emitting element is electrically connected to the driving element via the first electrical connecting layers and the light-sensing element is electrically connected to the driving element via the second electrical connecting layers. The cover layer includes a first opening and a second opening. The first opening is correspondingly arranged on the light-emitting element to expose a part of the light-emitting element, and the second opening is correspondingly arranged on the light-sensing element to expose a part of the light-sensing element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體元件</p>  
        <p type="p">10:驅動件</p>  
        <p type="p">14:驅動接點</p>  
        <p type="p">20:發光件</p>  
        <p type="p">22:發光疊層</p>  
        <p type="p">24:發光接點</p>  
        <p type="p">30:感光件</p>  
        <p type="p">32:感光疊層</p>  
        <p type="p">34:感光接點</p>  
        <p type="p">40:覆蓋層</p>  
        <p type="p">42:第一開口</p>  
        <p type="p">44:第二開口</p>  
        <p type="p">50:第一電連接層</p>  
        <p type="p">60:第二電連接層</p>  
        <p type="p">70:中間層</p>  
        <p type="p">72:第三開口</p>  
        <p type="p">74:第四開口</p>  
        <p type="p">71:第一貫孔</p>  
        <p type="p">73:第二貫孔</p>  
        <p type="p">75:第三貫孔</p>  
        <p type="p">80:第一接合層</p>  
        <p type="p">90:第二接合層</p>  
        <p type="p">A:區域</p>  
        <p type="p">C:載板</p>  
        <p type="p">L:光線</p>  
        <p type="p">I-I:線段</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="48" publication-number="202626939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title>RESIN COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241224B">C08L63/00</main-classification>  
        <further-classification edition="200601120241224B">C08L79/08</further-classification>  
        <further-classification edition="200601120241224B">C08L61/34</further-classification>  
        <further-classification edition="200601120241224B">C08K7/18</further-classification>  
        <further-classification edition="200601120241224B">C08K9/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳其霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物。樹脂組成物包括樹脂（A）、填料（B）以及有機改質黏土（C）。有機改質黏土（C）包括CT-APA、MP-250、GM-1958、SD-1或其組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition is provided. The resin composition includes a resin (A), a filler (B) and an organic modified clay (C). The organic modified clay (C) includes CT-APA, MP-250, GM-1958, SD-1 or a combination thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="49" publication-number="202628012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>證件相片真偽辨識系統及其方法</chinese-title>  
        <english-title>ID PHOTO AUTHENTICITY IDENTIFICATION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">G06V40/40</main-classification>  
        <further-classification edition="202201120250303B">G06V40/10</further-classification>  
        <further-classification edition="201301120250303B">G06F21/30</further-classification>  
        <further-classification edition="201301120250303B">G06F21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>正修學校財團法人正修科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG SHIU UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李迦恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIA-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YEN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪誌翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾弘宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, HONG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種證件相片真偽辨識系統，包含：一影像接收模組、一背景分析模組、一數量分析模組、一佔比分析模組、一真偽分析模組及一中央控制模組，透過擷取一欲辨識影像之像素特徵區塊與一真偽影像特徵模型進行比對，辨識該欲辨識影像是否為生成式影像。一種證件相片真偽辨識方法，包含：一影像傳送步驟、一背景分析步驟、一人臉分析步驟、一佔比分析步驟及一真偽分析步驟，該真偽分析步驟係對該欲辨識影像之人臉部位擷取至少一特徵區塊，該特徵區塊中每一像素與一真偽特徵模型進行生成特徵比對，當該生成特徵相似值達一生成門檻值時，則判斷為生成式影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for identifying the authenticity of ID photos, including: an image receiving module, a background analysis module, a quantity analysis module, a proportion analysis module, an authenticity analysis module and a central control module. By capturing the pixel feature block ​​of an image to be identified and comparing them with an authentic and false image feature model, it is determined whether the image to be identified a generated image. A method for identifying the authenticity of a document photo, including: an image transmission step, a background analysis step, a face analysis step, a proportion analysis step and an authenticity analysis step. The authenticity analysis step is based on the image to be identified. At least one feature block is extracted from the human face part, and each pixel in the feature block is compared with an authentic and fake feature model to generate features. When the similarity value of the generated feature reaches a generation threshold, it is determined to be a generative image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(S0):影像傳送步驟</p>  
        <p type="p">(S1):背景分析步驟</p>  
        <p type="p">(S2):人臉分析步驟</p>  
        <p type="p">(S3):佔比分析步驟</p>  
        <p type="p">(S4):真偽分析步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="50" publication-number="202625885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蜂群生態及蜂蜜產量的遠端監控方法</chinese-title>  
        <english-title>REMOTE MONITORING METHOD FOR BEE COLONY ECOLOGY AND HONEY PRODUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">A01K47/00</main-classification>  
        <further-classification edition="200601120250701B">A01K47/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏豪呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, HAU CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭俊佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JYUN YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUAN CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種蜂群生態及蜂蜜產量的遠端監控方法，測得蜂巢板的板重量及總重量值，作為監控該蜂巢板重量變化的基準，估算出蜂重量及蜜重量；以一氣候偵測器偵測該蜂箱所在位置之氣候狀態，並配合該蜂巢板之該總重量值的重量變化，據以判斷是否符合收蜜、補充蜂群、搬移蜂箱或發生異常狀況之條件；並根據總重量值的重量變化與氣候狀態之配合條件，予以提醒執行收蜜作業、補充蜂群作業、搬移蜂箱作業或解決異常狀況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="51" publication-number="202628400"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628400.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服設備、網路設備的檢測系統與方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR CHECKING NETWORK DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L43/08</main-classification>  
        <further-classification edition="200601120250303B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技鋼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　善民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, SIN-MAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫佩傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, PEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種伺服設備、網路設備的檢測系統與方法，包括PXE主機、交換器與多個伺服叢集。PXE主機具有靜態數據與OS映象檔，OS映象檔具有設備讀取程式；伺服叢集連接於交換器，各伺服叢集具有多個伺服器，伺服器具有BMC單元與網路單元，各伺服器的網路單元連接於交換器的連接埠；伺服器向PXE主機獲取OS映象檔，伺服器執行設備讀取程式，設備讀取程式獲取網路單元的設備資訊與交換器的連接埠資訊，設備讀取程式將設備資訊與連接埠資訊封裝為動態數據，設備讀取程式發送動態數據至PXE主機，PXE主機根據靜態數據與動態數據產生異常檢測報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for checking network devices are provide. The checking system comprise a PXE host, a switch, and a plurality cluster. The PXE host comprises a static data and an OS image file. The OS image file includes a reading device process. The cluster connects to the switch. The cluster comprises a plurality server. The server comprises a BMC unit and a network unit. The network unit of the server connect to the response the port of the switch. The server fetches the OS image file form the PXE host. The reading device process fetches the device data of the network unit and the port data of the switch. The reading device process packs the device data and the port data as a dynamic data. The reading device process sends the dynamic data to the PXE host. The PXE host generates an abnormal detection report according to the static data and the dynamic data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:檢測系統</p>  
        <p type="p">100:伺服叢集</p>  
        <p type="p">110:伺服器</p>  
        <p type="p">115:下載要求</p>  
        <p type="p">200:PXE主機</p>  
        <p type="p">400:交換器</p>  
        <p type="p">510:OS映象檔</p>  
        <p type="p">530:異常檢測報告</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="52" publication-number="202628206"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628206.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149018</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改性石墨氈電極及其製備方法</chinese-title>  
        <english-title>MODIFIED GRAPHITE FELT ELECTRODE AND PREPARATION METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">H01M4/88</main-classification>  
        <further-classification edition="200601120250402B">H01M4/90</further-classification>  
        <further-classification edition="200601120250402B">H01M4/96</further-classification>  
        <further-classification edition="200601120250402B">H01M8/18</further-classification>  
        <further-classification edition="201101120250402B">B82Y30/00</further-classification>  
        <further-classification edition="201101120250402B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林浩東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAO-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳祈彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋隆裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, LUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何淑梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, SHU-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種改性石墨氈電極的製備方法，包括於一氣氛中熱蝕刻石墨氈電極，以使其表面形成複數個奈米微孔，再將石墨氈電極浸泡至前驅物溶液，使前驅物溶液進入奈米微孔，烘乾經浸泡的石墨氈電極後對石墨氈電極進行碳化熱處理，以於石墨氈電極表面形成複數個奈米碳微粒，並於奈米微孔處形成嵌入物，其中嵌入物包括碳化物。對石墨氈電極進行親水化處理，以使嵌入物的表面形成氧化層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A preparation method of modified graphite felt electrode includes thermally etching a graphite felt electrode in an atmosphere to form a plurality of nanopores on the surface thereof, and then the graphite felt electrode is soaked in a precursor solution to let the precursor solution to enter the nanopores, and after drying the soaked graphite felt, a carbonization heat treatment is performed on the graphite felt electrode to form a plurality of carbon nanoparticles on the surface of the graphite felt electrode and form inserts at the nanopores, wherein the inserts include carbides. A hydrophilic treatment is performed on the graphite felt electrode to form an oxide layer on the surface of the inserts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、110、120、130、140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="53" publication-number="202627953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金融網站內容自動校對系統及其方法</chinese-title>  
        <english-title>AUTOMATIC PROOFREADING FOR FINANCIAL WEBSITE CONTENT SYSTEM AND METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q40/02</main-classification>  
        <further-classification edition="201201120250303B">G06Q20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種金融網站內容自動校對系統，包括輸入輸出裝置及處理器。處理器包括網頁更新確認模組、網頁擷取比對模組及網頁錯誤標示模組。網頁更新確認模組確認金融網頁是否更新。網頁擷取比對模組透過對應於網頁資料的複數個網頁機器學習模型的其中一者進行針對更新後的金融網頁進行擷取比對操作。網頁錯誤標示模組標示出更新後的金融網頁中的至少一錯誤資訊，並產生錯誤提醒網頁資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this disclosure provide an automatic proofreading for financial website content system, including an input/output device and a processor. The processor includes a webpage update confirmation module, a webpage capture and comparison module, and a webpage error marking module. The webpage update confirmation module confirms whether a financial webpage is updated. The webpage capture and comparison module performs a capture and comparison operation on the updated financial webpage through one of a plurality of webpage machine learning models corresponding to the webpage data. The webpage error marking module marks at least one error data in the updated financial webpage and generates an error reminder webpage data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:金融網站內容自動校對系統</p>  
        <p type="p">102:處理器</p>  
        <p type="p">104:輸入輸出裝置</p>  
        <p type="p">106:網頁伺服器</p>  
        <p type="p">110:網頁模型建立模組</p>  
        <p type="p">120:網頁模型資料庫</p>  
        <p type="p">130:網頁更新確認模組</p>  
        <p type="p">140:網頁擷取比對模組</p>  
        <p type="p">150:網頁錯誤標示模組</p>  
        <p type="p">160:網頁錯誤輸出模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="54" publication-number="202628900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝定位機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P72/50</main-classification>  
        <further-classification edition="202601120260401B">H10P72/70</further-classification>  
        <further-classification edition="202601120260401B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>典泰科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANTAI TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱文慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱啟仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於封裝的定位機構，包括：一個針座，其包括：多根支撐柱和多根頂針。各該支撐柱牢固該針座，彼此相隔一個距離。該頂針不固定地裝上該針座。該針座靠近一個磁性載具，該支撐柱穿過該磁性載具的多個通孔之一，支持一片蓋板在該磁性載具的上方。同時，該頂針經由該通孔插入該蓋板的多個定位孔之一，限制該蓋板的多個銷孔對著該磁性載具的多個定位銷。該針座離開時，該支撐柱退出該通孔，不再支撐該蓋板，該頂針脫離該通孔和該定位孔，使該定位銷插入該銷孔，該磁性載具依磁性吸住該蓋板，有效解決習用物的翹曲弊端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:定位機構</p>  
        <p type="p">11:機台</p>  
        <p type="p">12:調節板</p>  
        <p type="p">13:軌道</p>  
        <p type="p">14:工作區</p>  
        <p type="p">15:固定板</p>  
        <p type="p">16:調整動力源</p>  
        <p type="p">20:第一阻擋單元</p>  
        <p type="p">21:第二阻擋單元</p>  
        <p type="p">22、23:擋塊</p>  
        <p type="p">24:縱向動力源</p>  
        <p type="p">25:驅動機構</p>  
        <p type="p">30:針座</p>  
        <p type="p">31:頂針單元</p>  
        <p type="p">32:支撐柱</p>  
        <p type="p">40:導引座</p>  
        <p type="p">41:橫向動力源</p>  
        <p type="p">42:夾爪</p>  
        <p type="p">43:壓力缸</p>  
        <p type="p">44:引導部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="55" publication-number="202628384"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628384.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單向傳輸數據的狀態反饋方法、系統與單向閘道器</chinese-title>  
        <english-title>STATUS FEEDBACK METHOD FOR UNIDIRECTIONAL DATA TRANSMISSION, SYSTEM AND UNIDIRECTIONAL GATEWAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H04L1/18</main-classification>  
        <further-classification edition="202301120250303B">H04L1/1809</further-classification>  
        <further-classification edition="202201120250303B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勤晁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZYELL SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖朝暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAW, CHAO-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薄榮鋼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PO, JUNG-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁弘培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, HUNG-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱金龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種單向傳輸數據的狀態反饋方法、系統與單向閘道器，單向閘道器包括傳送端與接收端，並運行單向傳輸數據的狀態反饋方法。傳送端透過傳送端通訊埠連接第一網域，並設有傳送端通訊協定代理模組、重傳模組與反饋接收模組，接收端透過接收端通訊埠連接第二網域，設有接收端通訊協定代理模組、監控模組與反饋模組，並以單向通道連接傳送端。在方法中，在傳送端將一筆網路數據分割為多個數據區塊，接收端透過單向通道自傳送端接收多個數據區塊，判斷其中遺漏區塊，再以一反饋技術將重傳區塊的訊息反饋至傳送端，使傳送端重傳遺漏區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A status feedback method for unidirectional data transmission, a system, and a unidirectional gateway are provided. The unidirectional gateway that performs the method includes a transmitting end and a receiving end that are connected via a unidirectional channel. The transmitting end connects with a first network domain via a transmitting-end communication port and includes a transmitting-end communication-protocol proxy module, a resend module, and a feedback receiving module. The receiving end connects with a second network domain via a receiving-end communication port and includes a receiving-end communication-protocol proxy module, a monitoring module, and a feedback module. In the method, data is divided into multiple data blocks at the transmitting end, and the receiving end receives the data blocks via the unidirectional channel. When any missing block is detected at the receiving end, a feedback technology is performed to send a request to the transmitting end for resending the missing block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:單向閘道器</p>  
        <p type="p">201:傳送端</p>  
        <p type="p">211:傳送端通訊協定代理模組</p>  
        <p type="p">213:暫存器</p>  
        <p type="p">215:重傳模組</p>  
        <p type="p">217:反饋接收模組</p>  
        <p type="p">202:接收端</p>  
        <p type="p">221:接收端通訊協定代理模組</p>  
        <p type="p">223:暫存器</p>  
        <p type="p">225:監控模組</p>  
        <p type="p">227:反饋模組</p>  
        <p type="p">21:第一網域</p>  
        <p type="p">22:第二網域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="56" publication-number="202628862"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628862.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射二極體裝置製程監測的方法及其設備</chinese-title>  
        <english-title>METHOD AND EQUIPMENT FOR PROCESS MONITORING OF LASER DIODE DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification>  
        <further-classification edition="202101120260302B">H01S5/0225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華立捷科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HLJ TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEN-SSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐雙良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHUANG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴力弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, LI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種雷射二極體裝置製程監測的方法，包括：提供雷射二極體，包括反射層及主動發光層，主動發光層位於反射層上。在主動發光層上生成電流侷限層，且電流侷限層形成有侷限孔。通過觀察裝置觀察侷限孔的孔徑，觀察裝置包括透鏡組及光源模組，對應於主動發光層及反射層的材料組成，光源模組對電流侷限層發出光束，光束不被反射層吸收且不激發主動發光層 ，以提供透鏡組獲取清晰的侷限孔的影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for monitoring the manufacturing process of a laser diode device is provided. The method includes: providing a laser diode, including a reflective layer and an active light-emitting layer, and the active light-emitting layer is located on the reflective layer. A current limited layer is formed on the active light-emitting layer, and a confinement hole is formed in the current limited layer. Observe the aperture of a limited hole through an observation device. The observation device includes a lens group and a light module, corresponding to the material composition of the active light-emitting layer and the reflective layer. The light module emits a light beam to the current limited layer. The light beam is not absorbed by the reflective layer and not excites the active light-emitting layer, so as to provide the lens group with a clear image of the limited hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷射二極體裝置製程監測的方法</p>  
        <p type="p">S11-S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="57" publication-number="202628532"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628532.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光模塊裝置</chinese-title>  
        <english-title>OPTICAL MODULE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">H05K7/20</main-classification>  
        <further-classification edition="200601120250313B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>正淩精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEXTRONICS ENGINEERING CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商正凌精密工業（廣東）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEXTRONICS ENGINEERING(GUANGDONG)CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮景盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, JING-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾定勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, DING-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖小瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, XIAO-QIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光模塊裝置，包括一光模塊單元、一下蓋、一上蓋、一進水接頭及一出水接頭。上蓋設置於下蓋的上方，上蓋及下蓋組合，上蓋及下蓋包覆於光模塊單元外，以組成一光模塊。上蓋內設有流道，進水接頭及出水接頭為快速公母接頭，進水接頭及出水接頭分別以管路連接於流道，進水接頭及出水接頭設置於電子設備的面板外，而能由進水接頭輸送冷卻液至流道內，冷卻液經熱交換後再由出水接頭輸出熱水，可用以協助光模塊單元散熱。所述光模塊通過面板插置於電子設備內，使光模塊與電子設備內的小型可插拔模組連接器連接。本發明利用前進出水方式，可避免漏水時影響到電路板，進水接頭及出水接頭可採用小型化設計。由此，可利用最小空間解決散熱問題，並達到小型化、重量輕的優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical module device includes an optical module unit, a bottom lid, a top lid, a water inlet joint, and a water outlet joint. The top lid is disposed above the bottom lid, the top lid and the bottom lid are assembled, and the top lid and the bottom lid cover an outer periphery of the optical module unit, so as to form an optical module. The top lid has a flow channel inside, the water inlet joint and the water outlet joint are quick male and female connectors, the water inlet joint and the water outlet joint are connected to the flow channel with tubes, the water inlet joint and the water outlet joint are disposed outside of a panel of an electronic equipment, cold water can be transferred from the water inlet joint to the flow channel, the cold water can be formed into hot water through heat change and can be output from the water outlet joint, so as to facilitate heat dissipation of the optical module unit. The optical module is inserted in the electronic equipment through the panel, such that the optical module is connected to a small pluggable module connector in the electronic equipment. In the present disclosure, through a front water inlet manner, a circuit board is not affected when water leaks, and the water inlet joint and the water outlet joint can adopt a miniaturized design. In this way, a heat dissipation issue can be improved by utilizing a miniaturized space, thereby achieving the advantages of miniaturization and light weight.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光模塊單元</p>  
        <p type="p">2:下蓋</p>  
        <p type="p">3:上蓋</p>  
        <p type="p">31:上蓋本體</p>  
        <p type="p">33:蓋板</p>  
        <p type="p">4:進水接頭</p>  
        <p type="p">41:進水頭</p>  
        <p type="p">42:進水座</p>  
        <p type="p">6:第一管路</p>  
        <p type="p">8:線纜</p>  
        <p type="p">100:電子設備</p>  
        <p type="p">101:面板</p>  
        <p type="p">102:電路板</p>  
        <p type="p">103:連接器</p>  
        <p type="p">104:金屬殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="58" publication-number="202628560"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628560.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B12/00</main-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10P14/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王喻柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭德軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, TE-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體結構。半導體結構包含基板及多個連接襯墊。基板具有陣列區與周邊區，而連接襯墊設置於基板之上並位於陣列區。半導體結構也包含多個導電柱及底部支撐層。導電柱設置於連接襯墊之上，而底部支撐層設置於導電柱的底部之間。半導體結構更包含保護層及額外支撐層。保護層設置於底部支撐層之上，而額外支撐層設置於保護層之上。此外，半導體結構包含中央支撐層及頂部支撐層。中央支撐層設置於額外支撐層的上方，而頂部支撐層設置於中央支撐層的上方。額外支撐層、中央支撐層及頂部支撐層皆位於導電柱之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a substrate and multiple landing pads. The substrate has an array area and a peripheral area, and the landing pads are disposed on the substrate and in the array area. The semiconductor structure also includes multiple conductive pillars and a bottom support layer. The conductive pillars are disposed on the landing pads, and the bottom support layer is disposed between the bottoms of the conductive pillars. The semiconductor structure further includes a protective layer and an additional support layer. The protective layer is disposed on the bottom support layer, and the additional support layer is disposed on the protective layer. Moreover, the semiconductor structure includes a central support layer and a top support layer. The central support layer is disposed above the additional support layer, and the top support layer is disposed above the central support layer. The additional support layer, the central support layer, and the top support layer are all disposed between the conductive pillars.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">10:基板</p>  
        <p type="p">10A:陣列區</p>  
        <p type="p">10P:周邊區</p>  
        <p type="p">12:絕緣層</p>  
        <p type="p">12A:連接襯墊</p>  
        <p type="p">12P:金屬襯墊</p>  
        <p type="p">14A:底部支撐層</p>  
        <p type="p">14B:額外支撐層</p>  
        <p type="p">14C:中央支撐層</p>  
        <p type="p">14D:頂部支撐層</p>  
        <p type="p">16A:保護層</p>  
        <p type="p">18P:導電柱</p>  
        <p type="p">23:高介電係數層</p>  
        <p type="p">24:半導體層</p>  
        <p type="p">26:金屬層</p>  
        <p type="p">E:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="59" publication-number="202628716"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628716.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光電元件及半導體光電裝置</chinese-title>  
        <english-title>SEMICONDUCTOR OPTOELECTRONIC DEVICE AND SEMICONDUCTOR OPTOELECTRONIC COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250313B">H10H20/81</main-classification>  
        <further-classification edition="202501120250313B">H10H20/84</further-classification>  
        <further-classification edition="202501120250313B">H10H20/857</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富采光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENNOSTAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MIN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高振凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, ZHEN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮輝慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, HUI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容提供一種半導體光電元件，包括半導體磊晶疊層、第一金屬接觸結構、導電氧化物層以及第一連接電極。半導體磊晶疊層包含第一半導體結構、第二半導體結構以及位於第一半導體結構及第二半導體結構間的活性區，且具有凹部。第一金屬接觸結構位於第一半導體結構下且具有第一下表面。導電氧化物層位於第一半導體結構下且與第一金屬接觸結構在水平方向上有重疊。第一連接電極覆蓋於半導體磊晶疊層且填入凹部。第一半導體結構具有第一寬度，第二半導體結構具有第二寬度小於第一寬度。第一連接電極直接接觸第一金屬接觸結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor optoelectronic device including a semiconductor epitaxial stack, a first metal contact structure, a conductive oxide layer and a first connecting electrode. The semiconductor epitaxial stack includes a first semiconductor structure, a second semiconductor structure and an active region between the first semiconductor structure and the second semiconductor structure, and has a recess portion. The first metal contact structure is located under the first semiconductor structure and has a first lower surface. The conductive oxide layer is located under the first semiconductor structure and is overlapped with the first metal contact structure in a horizontal direction. The first connecting electrode covers the semiconductor epitaxial stack and fills in the recess portion. The first semiconductor structure has a first width, the second semiconductor structure has a second width less than the first width. The first connecting electrode directly contacts the first metal contact structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體磊晶疊層</p>  
        <p type="p">100a:第一半導體結構</p>  
        <p type="p">100a1:第一半導體接觸層</p>  
        <p type="p">100a2:第一半導體覆蓋層</p>  
        <p type="p">100b:第二半導體結構</p>  
        <p type="p">100b1:第二半導體覆蓋層</p>  
        <p type="p">100b2:第二半導體接觸層</p>  
        <p type="p">100c:活性區</p>  
        <p type="p">100s:第二下表面</p>  
        <p type="p">102:第一金屬接觸結構</p>  
        <p type="p">102s:第一下表面</p>  
        <p type="p">104:導電氧化物層</p>  
        <p type="p">102d:第一側表面</p>  
        <p type="p">102s:第一下表面</p>  
        <p type="p">102t:上表面</p>  
        <p type="p">100t:上表面</p>  
        <p type="p">105:絕緣結構</p>  
        <p type="p">105a1:第一開口</p>  
        <p type="p">105a2:第二開口</p>  
        <p type="p">106:第一連接電極</p>  
        <p type="p">106a:第一部分</p>  
        <p type="p">106b:第二部分</p>  
        <p type="p">108:第二金屬接觸結構</p>  
        <p type="p">110:第二連接電極</p>  
        <p type="p">112:第一電極墊</p>  
        <p type="p">114:第二電極墊</p>  
        <p type="p">w1:第一寬度</p>  
        <p type="p">w2:第二寬度</p>  
        <p type="p">R:凹部</p>  
        <p type="p">w3、w4:寬度</p>  
        <p type="p">s:底面</p>  
        <p type="p">t、t1、t2:厚度</p>  
        <p type="p">d1:內側壁</p>  
        <p type="p">d2:外側壁</p>  
        <p type="p">H:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="60" publication-number="202628484"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628484.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源驅動系統及其故障回報方法</chinese-title>  
        <english-title>LIGHT SOURCE DRIVE SYSTEM AND FAILURE REPORTING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241231B">H05B47/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉維宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開是一種光源驅動系統及其故障回報方法。光源驅動系統包括控制電路及驅動電路模組。驅動電路模組具有至少一光源驅動電路，光源驅動電路經由一故障傳輸線與控制電路連接。光源驅動電路具有一故障仲裁電路，包括：偵測電路、故障回報電路、切換開關及故障控制電路。故障控制電路於故障狀況發生時啟動計數工作週期，且控制切換開關於偵測時間導通以及於延遲時間截止。故障控制電路控制偵測電路於工作週期偵測故障傳輸線的第一準位，以及根據故障狀況的種類不同相對應輸出不同時間長度的偵測時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light source drive system and a failure reporting method thereof are provided. The light source drive system includes a control circuit and a drive circuit module. The driving circuit module has at least one light source driving circuit, and the light source driving circuit is connected with the control circuit through a fault transmission line. The light source drive circuit has a fault arbitration circuit, including: a detection circuit, a fault report circuit, a switch and a fault control circuit. The fault control circuit initiates the counting duty cycle when the fault condition occurs, and controls the switch is on in the detection time and the switch is off in the delay time. The fault control circuit controls the detection circuit to detect a first level of the fault transmission line in the duty cycle, and outputs the detection time of different lengths of time according to the different types of fault conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:控制電路</p>  
        <p type="p">20:驅動電路模組</p>  
        <p type="p">21:第一光源驅動電路</p>  
        <p type="p">23:第二光源驅動電路</p>  
        <p type="p">24:暫存器</p>  
        <p type="p">22:故障仲裁電路</p>  
        <p type="p">30:電源轉換電路</p>  
        <p type="p">LD:照明元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="61" publication-number="202626127"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626127.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>篩網式霧化器的掃頻方法</chinese-title>  
        <english-title>FREQUENCY SWEEPING METHOD FOR MESH-TYPE NEBULIZER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">A61M11/00</main-classification>  
        <further-classification edition="200601120250228B">A61M11/02</further-classification>  
        <further-classification edition="200601120250228B">A61M31/00</further-classification>  
        <further-classification edition="200601120250228B">A61M15/00</further-classification>  
        <further-classification edition="200601120250228B">A61M35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>心誠鎂行動醫電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HCMED INNOVATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡健申</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIEN-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種篩網式霧化器的掃頻方法，其包含下列步驟：選定一篩網單元的一工作頻率範圍；將工作頻率範圍以一第一間隔值區分為多個第一檢測頻率點；依序對多個第一檢測頻率點提供驅動電壓以決定一第一最佳工作頻率；對第一最佳工作頻率進行一運算步驟以獲得一細掃頻率區段；將細掃頻率區段以一第二間隔值區分為多個第二檢測頻率點；以及依序對多個第二檢測頻率點提供驅動電壓以決定一選定最佳工作頻率；其中，第一間隔值大於等於第二間隔值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A frequency sweeping method for a mesh-type nebulizer is provided. The frequency sweeping method includes the following steps: selecting a working frequency range of a mesh unit; dividing the working frequency range into a plurality of first detection frequency points with a first interval value; sequentially providing driving voltages to the plurality of first detection frequency points to determine a first optimal operating frequency; performing an operation step on the first optimal operating frequency to obtain a fine sweep frequency section; dividing the fine sweep frequency section into a plurality of second detection frequency points with a second interval value; and sequentially providing driving voltages to the plurality of second detection frequency points to determine a selected optimal operating frequency. The first interval value is greater than or equal to the second interval value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S60:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="62" publication-number="202628855"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628855.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支撐結構及加工方法</chinese-title>  
        <english-title>SUPPORT STRUCTURE AND PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P70/00</main-classification>  
        <further-classification edition="200601120260302B">B32B7/12</further-classification>  
        <further-classification edition="201901120260302B">B32B7/06</further-classification>  
        <further-classification edition="201801120260302B">C09J7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山太士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLIANCE MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳學宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSUEH CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林欽楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝詩柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, SHI-ROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宣佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XUAN YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡冠羣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種支撐結構，適於貼合至工件，且支撐結構包括基底結構以及黏著層。黏著層被配置成直接接觸工件以將工件黏接至基底結構。黏著層包括熱滑移膠或紫外光固化膠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A support structure is adapted for attaching to a workpiece, and the support structure includes a base structure and an adhesive layer. The adhesive layer is configured to directly contact the workpiece to bond the workpiece to the base structure. The adhesive layer includes thermal slide adhesive or UV curing adhesive.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:支撐結構</p>  
        <p type="p">110:載板</p>  
        <p type="p">120’:雷射解離層</p>  
        <p type="p">130A’:黏著層</p>  
        <p type="p">200:工件</p>  
        <p type="p">Ls:雷射解離製程</p>  
        <p type="p">SSA:基底結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="63" publication-number="202627868"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627868.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件分群方法、電腦可讀取記錄媒體及電子裝置</chinese-title>  
        <english-title>COMPONENTS PARTITIONING METHOD, COMPUTER READABLE RECORDING MEDIA, AND ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250303B">G06F30/39</main-classification>  
        <further-classification edition="202001120250303B">G06F30/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泳昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仕先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種元件分群方法，適於將電路圖中的多個電子元件進行分群，其中電子元件包括多個主要元件及多個輔助元件。元件分群方法包括：根據連線表搜尋主要元件、主要元件組合及輔助元件；設定至少一邊界條件；以及根據邊界條件及連線表對主要元件及輔助元件進行分群，其中各元件群之間的邊界條件符合設定值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A components partitioning method, adapted to group a plurality of electronic components in a circuit diagram. The electronic components includes a plurality of main components and a plurality of auxiliary components. The components partitioning method includes: searching for the main components, main component sets, and the auxiliary components according to a netlist; setting at least one boundary condition; and grouping the main components and the auxiliary components according to the boundary condition and the netlist. The boundary condition between groups of components meets a set value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S110、S120、S130、S140、S150:方法步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="64" publication-number="202626945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626945.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title>RESIN COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241225B">C08L63/02</main-classification>  
        <further-classification edition="200601120241225B">C08G59/42</further-classification>  
        <further-classification edition="200601120241225B">C08L61/06</further-classification>  
        <further-classification edition="200601120241225B">C08K7/18</further-classification>  
        <further-classification edition="200601120241225B">C08K3/36</further-classification>  
        <further-classification edition="200601120241225B">C08K5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃威儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樹脂組成物，包括環氧樹脂、活性酯化合物、酚醛樹脂、自由基聚合性化合物、無機填充材料以及促進劑。酚醛樹脂包括至少一種含有羥基的化合物，且酚醛樹脂的羥基當量為100至200克/當量。相對於樹脂組成物100質量份，酚醛樹脂的添加量為0.1至5質量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition includes an epoxy resin, an active ester compound, a phenolic resin, a free radical polymerizable compound, an inorganic filler material, and an accelerator. The phenolic resin includes at least one compound containing hydroxyl groups, and the hydroxyl equivalent weight of the phenolic resin is 100 to 200 g/equivalent. An amount of phenolic resin added is 0.1 to 5 parts by mass relative to 100 parts by mass of the resin composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="65" publication-number="202626946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626946.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低介電樹脂組成物及其用途</chinese-title>  
        <english-title>LOW DIELECTRIC RESIN COMPOSITION AND ITS USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241225B">C08L63/02</main-classification>  
        <further-classification edition="200601120241225B">C08G59/42</further-classification>  
        <further-classification edition="200601120241225B">C08L79/08</further-classification>  
        <further-classification edition="200601120241225B">C08K3/36</further-classification>  
        <further-classification edition="200601120241225B">C08K7/18</further-classification>  
        <further-classification edition="200601120241225B">H01B3/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃威儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種低介電樹脂組成物及用途，其中低介電樹脂組成物包括環氧樹脂、活性酯化合物、馬來醯亞胺化合物、無機填充材料以及促進劑。相對於低介電樹脂組成物100質量份，馬來醯亞胺化合物的添加量為至少20質量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A low dielectric resin composition and its use, wherein the low dielectric resin composition includes an epoxy resin, an active ester compound, a maleimide compound, an inorganic filler material, and an accelerator. The maleimide compound is added in an amount of at least 20 parts by mass relative to 100 parts by mass of the low dielectric resin composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="66" publication-number="202626963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物及包括其的預浸體及覆金屬積層板</chinese-title>  
        <english-title>RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241225B">C08L79/08</main-classification>  
        <further-classification edition="200601120241225B">C08L63/00</further-classification>  
        <further-classification edition="200601120241225B">C08K5/315</further-classification>  
        <further-classification edition="200601120241225B">C08J5/24</further-classification>  
        <further-classification edition="200601120241225B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃威儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物，包括樹脂混合物，其中，以樹脂混合物的總重量計，樹脂混合物包括10重量%至30重量%的環氧樹脂、50重量%至70重量%的馬來醯亞胺樹脂以及5重量%至30重量%的多官能氰酸酯。本發明的樹脂組成物所製成的覆金屬積層板能夠具有降低的熱膨脹係數，以滿足高階伺服器產品的需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition is provided. The resin composition includes a resin mixture, which includes 10 wt% to 30 wt% of an epoxy resin, 50 wt% to 70 wt% of a maleimide resin, and 5 wt% to 30 wt% of a multi-functional cyanate ester, based on a total weight of the resin mixture. The resin composition enables the production of a metal clad laminate having a reduced coefficient of thermal expansion, thereby meeting the requirements of high-end server products.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="67" publication-number="202626407"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626407.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>互動式車道變換控制系統、方法以及顯示介面</chinese-title>  
        <english-title>INTERACTIVE LANE CHANGE CONTROL SYSTEM, METHOD AND DISPLAY INTERFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250401B">B60W30/08</main-classification>  
        <further-classification edition="202001120250401B">B60W30/12</further-classification>  
        <further-classification edition="202001120250401B">B60W60/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古昆隴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, KUN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡家睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHIA-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許修瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明透過互動式車道變換控制系統以及方法，可透過預先橫向偏移的方式，使得駕駛人在切換車道時與鄰車互動，藉以取得鄰車的禮讓意願，並在真正執行切換車道時能安全地切換車道。除此之外，透過顯示介面，還可以將路況以及各車子的狀態以視覺化地呈現給駕駛人，使得駕駛人更能掌控其行車的狀態，並增加行車的安全。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention includes the interactive lane change control system and method, which can utilize the previous lateral offset method, allowing the driver to interact with neighboring vehicles when switching lanes, thereby obtaining the courtesy intention of neighboring vehicles, and safely switching lanes when actually performing lane switching. In addition, through the display interface, the road conditions and the status of each vehicle can also be visually presented to the driver, allowing the driver to better control his driving status and increase driving safety.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210、S220:流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="68" publication-number="202627234"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627234.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149086</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電解銅箔、其製造方法以及集流體</chinese-title>  
        <english-title>ELECTROLYTIC COPPER FOIL, MANUFACTURING METHOD THEREOF AND CURRENT COLLECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">C25D7/06</main-classification>  
        <further-classification edition="200601120250123B">C25D3/38</further-classification>  
        <further-classification edition="200601120250123B">B32B15/20</further-classification>  
        <further-classification edition="200601120250123B">H01M4/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEN TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>房奈美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, NEI-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電解銅箔的製造方法。電解銅箔的製造方法包括：提供電解裝置，包括陰極以及陽極；將陰極浸泡在電解液中；將添加劑加入電解液中；以及進行電鍍，以在陰極的表面形成電解銅箔。添加劑包括羥乙基纖維素、3-巰基-1-丙烷磺酸鈉、伸乙基硫脲、生物膠、聚乙烯亞胺或其組合。本發明另提供一種電解銅箔以及集流體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of an electrolyte copper foil is provided. The manufacturing method of an electrolyte copper foil includes: provide an electrolysis device, including a cathode and an anode; immersing the cathode in an electrolyte; adding an additive to the electrolyte; and performing electroplating to form an electrolytic copper foil on a surface of the cathode. The additive includes hydroxyethyl cellulose, sodium 3-mercapto-1-propanesulfonate, ethylene thiourea, bio-glue, polyethyleneimine or a combination thereof. An electrolyte copper foil and a current collector are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="69" publication-number="202627006"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627006.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面膠帶以及利用雙面膠帶的加工方法</chinese-title>  
        <english-title>DOUBLE-SIDED ADHESIVE TAPE AND PROCESSING METHOD USING DOUBLE-SIDED ADHESIVE TAPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250102B">C09J7/20</main-classification>  
        <further-classification edition="201801120250102B">C09J7/40</further-classification>  
        <further-classification edition="200601120250102B">B32B7/10</further-classification>  
        <further-classification edition="201901120250102B">B32B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山太士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLIANCE MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳學宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSUEH CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林欽楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝詩柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, SHI-ROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宣佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XUAN YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡冠羣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙面膠帶，包括第一黏著層、第二黏著層、基材層、第一離型膜以及第二離型膜。第一黏著層為第一光減黏膠以及第一熱減黏膠中的一者。第二黏著層重疊於第一黏著層，且為第二光減黏膠、第二熱減黏膠以及熱滑移感壓膠中的一者。基材層位於第一黏著層與第二黏著層之間。第一離型膜以及第二離型膜，分別貼合至第一黏著層以及第二黏著層上。第一黏著層、基材層以及第二黏著層位於第一離型膜以及第二離型膜之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A double-sided adhesive tape includes a first adhesive layer, a second adhesive layer, a base material layer, a first release film and a second release film. The first adhesive layer is one of a first light-debonding adhesive and a first thermal-debonding adhesive. The second adhesive layer overlaps the first adhesive layer and is one of a second light-debonding adhesive, a second thermal-debonding adhesive, and a thermal slip pressure-sensitive adhesive. The base material layer is located between the first adhesive layer and the second adhesive layer. The first release film and the second release film are respectively bonded to the first adhesive layer and the second adhesive layer. The first adhesive layer, the base material layer and the second adhesive layer are located between the first release film and the second release film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雙面膠帶</p>  
        <p type="p">110:第一黏著層</p>  
        <p type="p">120:第二黏著層</p>  
        <p type="p">130:基材層</p>  
        <p type="p">140:第一離型膜</p>  
        <p type="p">150:第二離型膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="70" publication-number="202627774"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627774.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149088</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其環境光感測方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND AMBIENT LIGHT SENSING METHOF THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">G06F3/041</main-classification>  
        <further-classification edition="200601120250313B">G09G5/10</further-classification>  
        <further-classification edition="200601120250313B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奕力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILI TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜俊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置及其環境光感測方法被提出。電子裝置包括環境光感測器、信號處理器、至少一周邊電路以及環境光感測信號驅動電路。環境光感測器產生環境光感測信號。信號處理器透過信號傳輸通道以接收環境光感測信號，根據環境光感測信號的信號範圍以產生數位信號及至少一信號調整資訊。周邊電路根據信號調整資訊以產生偏移電壓，使偏移電壓透過觸控感測面板耦合至信號傳輸通道中以調整環境光感測信號。環境光感測信號驅動電路提供感測驅動信號至環境光感測器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and an ambient light sensing method are provided. The electronic device includes an ambient light sensor, a signal processor, at least one peripheral circuit and an ambient light sensing signal driving circuit. The ambient light sensor generated an ambient light sensing signal. The signal processor receives the ambient light sensing signal through a signal transmission channel, and generates a digital conversion signal and at least one signal adjusting information according to a signal range of the ambient light sensing signal. The peripheral circuit generates a shifting voltage, and coupled the shifting voltage to the signal transmission channel through a touch display panel to adjust the ambient light sensing signal. The ambient light sensing signal driving circuit provides a sensing driving signal to the ambient light sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:信號處理器</p>  
        <p type="p">120:周邊電路</p>  
        <p type="p">ADJ:信號調整資訊</p>  
        <p type="p">ALS:環境光感測器</p>  
        <p type="p">ALSD:環境光驅動信號</p>  
        <p type="p">S1:環境光感測信號</p>  
        <p type="p">STC:信號傳輸通道</p>  
        <p type="p">TP:觸控感測面板</p>  
        <p type="p">VS:偏移電壓</p>  
        <p type="p">CP1~CP4:電容</p>  
        <p type="p">RP1~RP3:電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="71" publication-number="202628414"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628414.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>投影方法及系統與電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H04N9/31</main-classification>  
        <further-classification edition="200601120250303B">H04N9/12</further-classification>  
        <further-classification edition="200601120250303B">H04N5/74</further-classification>  
        <further-classification edition="200601120250303B">G03B21/26</further-classification>  
        <further-classification edition="201701120250303B">G06T7/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>所羅門股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLOMON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　春祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, XUAN LOC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝環宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種投影方法由一投影系統實施，其包含：(A)一處理單元控制一拍攝單元進行拍攝，以獲得一由該拍攝單元產生的拍攝結果；(B)該處理單元利用一影像辨識模型從該拍攝結果中辨識出一被該拍攝結果所呈現出的目標物件；(C)該處理單元根據該目標物件被呈現於該拍攝結果中的位置決定一投影位置，並根據該投影位置控制一投影單元將一對應於該目標物件的目標影像投影至該拍攝結果所呈現出的一待投影環境中，以使該目標影像在該待投影環境中所呈現的位置或形狀與該目標物件相配合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S7:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="72" publication-number="202626072"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626072.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物及其用於製備抗發炎或促進傷口癒合之藥物的用途</chinese-title>  
        <english-title>COMPOSITION AND USE THEREOF IN MANUFACTURE OF MEDICAMENTS FOR ANTI-INFLAMMATION OR ENHANCING WOUND HEALING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250102B">A61K35/28</main-classification>  
        <further-classification edition="200601120250102B">A61K31/445</further-classification>  
        <further-classification edition="200601120250102B">A61K47/10</further-classification>  
        <further-classification edition="200601120250102B">A61K9/51</further-classification>  
        <further-classification edition="200601120250102B">A61P29/00</further-classification>  
        <further-classification edition="200601120250102B">A61P17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長崎幸夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASAKI, YUKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘信誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, SHIN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組成物包含：提取自幹細胞之外源粒線體以及抗氧化奈米粒子。抗氧化奈米粒子包含：具有抗氧化劑之核心及具有親水性聚合物之殼層，且殼層包覆核心。外源粒線體係與抗氧化奈米粒子混合。另提供一種組成物之用途，其係用於製備抗發炎及/或促進傷口癒合之藥物。組成物包含：有效量之抗氧化奈米粒子、提取自幹細胞之外源粒線體或兩者之組合；以及醫藥上可接受的載體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition includes: exogenous mitochondria extracted from stem cells and antioxidative nanoparticles. The antioxidative nanoparticle includes: a core with antioxidants and a shell with hydrophilic polymer, and the shell encapsulates the core. The exogenous mitochondria are mixed with the antioxidative nanoparticles. Also provided is the use of the composition in the manufacture of the medicament for anti-inflammation and/or enhancing wound healing. The composition includes: an effective amount of the antioxidative nanoparticles, exogenous mitochondria extracted from the stem cells, or a combination thereof; and a pharmaceutically acceptable carrier.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="73" publication-number="202626964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149097</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組合物及使用其製成之物品</chinese-title>  
        <english-title>RESIN COMPOSITION AND ARTICLE MANUFACTURED USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">C08L79/08</main-classification>  
        <further-classification edition="200601120241227B">C08K5/10</further-classification>  
        <further-classification edition="200601120241227B">C08K5/54</further-classification>  
        <further-classification edition="200601120241227B">C08K5/5435</further-classification>  
        <further-classification edition="200601120241227B">C08K5/544</further-classification>  
        <further-classification edition="200601120241227B">H05K1/03</further-classification>  
        <further-classification edition="200601120241227B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台光電子材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITE MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林奕呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜昕霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, SIN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組合物，包含：100重量份的馬來醯亞胺樹脂，其中馬來醯亞胺樹脂包含50重量份至100重量份的具有式(1)所示結構的馬來醯亞胺樹脂；2重量份至30重量份的聚合物，包含式(2)所示的結構單元、式(5)所示的結構單元、式(3)所示的結構單元和式(4)所示的結構單元，其中，式(3)所示的結構單元和式(4)所示的結構單元皆位於式(2)所示的結構單元與(5)所示的結構單元間；以及0.5重量份至5重量份的含矽化合物，</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="157px" width="536px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="231px" width="284px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="179px" width="265px" file="d10003.TIF" alt="化學式ed10003.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10003.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="81px" width="331px" file="d10004.TIF" alt="化學式ed10004.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10004.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="221px" width="269px" file="d10005.TIF" alt="化學式ed10005.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10005.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">其中，n為數量平均重複單元數(基於數均分子量)，且n為1至20的數值；R&lt;sub&gt;1&lt;/sub&gt;至R&lt;sub&gt;4&lt;/sub&gt;各自獨立為氫或C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;3&lt;/sub&gt;的烷基。本發明亦提供由前述樹脂組合物製成的物品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition is disclosed. The resin composition includes 100 parts by weight of a maleimide resin, wherein the maleimide resin includes 50 parts by weight to 100 parts by weight of a maleimide resin represented by the formula (1); 2 parts by weight to 30 parts by weight of a polymer, including a structural unit represented by the formula (2), a structural unit represented by the formula (5), a structural unit represented by the formula (3) and a structural unit represented by the formula (4), wherein the structural unit represented by the formula (3) and the structural unit represented by the formula (4) are located between the structural unit represented by the formula (2) and the structural unit represented by the formula (5); and 0.5 parts by weight to 5 parts by weight of a silicon-containing compound;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="147px" width="588px" file="d10007.TIF" alt="化學式ed10007.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10007.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="216px" width="327px" file="d10008.TIF" alt="化學式ed10008.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10008.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="149px" width="264px" file="d10009.TIF" alt="化學式ed10009.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10009.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="84px" width="376px" file="d10010.TIF" alt="化學式ed10010.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10010.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="211px" width="327px" file="d10006.TIF" alt="化學式ed10006.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10006.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">wherein n is a numerical average number of repeating unit based on number-average molecular weight, and n is numerical value ranging from 1 to 20, and R&lt;sub&gt;1&lt;/sub&gt; to R&lt;sub&gt;4&lt;/sub&gt; are each independently hydrogen or C&lt;sub&gt;1&lt;/sub&gt; to C&lt;sub&gt;3&lt;/sub&gt; alkyl. The invention also provides an article manufactured using the aforesaid resin composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1:大銅面區域</p>  
        <p type="p">A2,A4:空曠區</p>  
        <p type="p">A3:溢膠口</p>  
        <p type="p">D1,D4,D6:長</p>  
        <p type="p">D2,D3,D5:寬</p>  
        <p type="p">L:流痕長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="74" publication-number="202628391"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628391.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於ＸＹ路由演算法實現網狀或環狀網路的資料廣播的方法、傳輸網路及電子設備</chinese-title>  
        <english-title>DATA BROADCASTING METHOD FOR MESH OR TORUS NETWORK BASED ON XY ROUTING ALGORITHM, TRANSIMISSION NETWORK AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H04L12/42</main-classification>  
        <further-classification edition="200601120250401B">H04L12/28</further-classification>  
        <further-classification edition="202201120250401B">H04L45/02</further-classification>  
        <further-classification edition="200901120250401B">H04W40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商臉萌有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEMON INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於XY路由演算法實現網狀網路或環狀網路的資料廣播的方法、傳輸網路和電子設備，網狀網路或環狀網路包括沿至少兩個方向陣列排布的多個傳輸節點，至少兩個方向包括相互交叉的X方向和Y方向，XY路由演算法包括將資料包沿X方向路由直至到達目標傳輸節點所在的Y軸並將資料包沿Y方向路由直至到達目標傳輸節點，該方法包括：每個傳輸節點回應於接收來自X方向的第一相鄰傳輸節點的廣播資料包，將廣播資料包傳輸至除第一相鄰傳輸節點之外的全部相鄰傳輸節點；每個傳輸節點回應於接收來自Y方向的第二相鄰傳輸節點的廣播資料包，將廣播資料包傳輸至位於至少兩個方向中除X方向之外的全部其他方向上、除第二相鄰傳輸節點之外的相鄰傳輸節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data broadcasting method for a mesh network or a torus network based on an XY routing algorithm, a transmission network, and an electronic device. The mesh or torus network includes a plurality of transmission nodes arranged in array along at least two directions including X and Y directions that intersect each other, and in the XY routing algorithm, a data packet is routed along the X direction until the data packet reaches a Y axis where a destination transmission node of the data packet is located and the data packet is routed along the Y direction until the data packet reaches the destination transmission node. The method includes: each of the transmission nodes, in response to receiving a broadcast data packet from a first neighboring transmission node in the X direction, transmitting the broadcast data packet to all neighboring transmission nodes except the first neighboring transmission node; and each of the transmission nodes, in response to receiving a broadcast data packet from a second neighboring transmission node in the Y direction, transmitting the broadcast data packet to neighboring transmission nodes, except the second neighboring transmission node, located in all other of the at least two directions except the X direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S510、S520:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="75" publication-number="202627981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>建立2.5D的X光影像以預測骨質疏鬆的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250416B">G06T5/50</main-classification>  
        <further-classification edition="202401120250416B">G06T5/73</further-classification>  
        <further-classification edition="200601120250416B">G06T1/00</further-classification>  
        <further-classification edition="202401120250416B">A61B6/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和鑫生技開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANORAY BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾劭鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, SHAO CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種建立2.5D的X光影像以預測骨質疏鬆的方法，步驟包括：以電腦控制單發雙能量X光管在第一位置、第二位置、第三位置分別拍攝一肢端，獲得第一X光影像、第二X光影像與第三X光影像，並進一步利用演算法重建2.5D的一肢端X光影像，該肢端X光影像包含一皮質骨區域與一海綿質骨區域，藉由2.5D的該肢端X光影像，計算該皮質骨區域與該海綿質骨區域的比例關係，並根據該比例關係獲取骨質疏鬆預測值。本發明的執行過程快速、輻射計量少，2.5D具有深度效果的清晰X光影像有利於準確計算骨質疏鬆預測值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="76" publication-number="202625905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醬汁生魚片製程方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250502B">A23L17/00</main-classification>  
        <further-classification edition="201601120250502B">A23L17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>政澄水產股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪慧惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳友炘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種醬汁生魚片製程方法，包含下列步驟：提供複數原魚材料；提供一第一超低溫冷凍技術以將複數原魚材料冷凍後進行分切；將複數原魚材料進行比例混合以形成一半成品；將半成品與一調製醬汁混合以構成一醬汁生魚片；提供一真空包裝技術以將醬汁生魚片進行一真空包裝；以及提供一第二超低溫冷凍技術將真空包裝以一零下溫度進行冷凍儲存。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110~170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="77" publication-number="202628406"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628406.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>路由器以及網路封包傳輸方法</chinese-title>  
        <english-title>ROUTER AND PACKAGE TRANSMISSION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">H04L51/226</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱青泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種路由器，適用連線至一終端裝置。此路由器包含一網路介面模組、一封包類型判斷模組以及一優先級控制模組。網路介面模組適於接收來自終端裝置之一網路封包。封包類型判斷模組適於依據網路封包之資料類別確認網路封包之優先級。優先級控制模組適於依據所確認的優先級對網路封包進行傳輸控制。本案並提供一種適用於此路由器之網路封包傳輸方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A router adapted for communicating with a terminal device is provided. The router comprises a network interface module, a package type determination module, and a priority control module. The network interface module is used for receiving a package from the terminal device. The package type determination module is for determining a priority level of the package according to the data type of the package. The priority control module is for controlling transmission of the package based on the determined priority level. A package transmission method using the router is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:終端裝置</p>  
        <p type="p">100:路由器</p>  
        <p type="p">110:處理單元</p>  
        <p type="p">120:網路介面模組</p>  
        <p type="p">140:封包類型判斷模組</p>  
        <p type="p">160:優先級控制模組</p>  
        <p type="p">180:人工智慧模型</p>  
        <p type="p">P1:網路封包</p>  
        <p type="p">D1:傳輸策略資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="78" publication-number="202627755"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627755.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149113</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率監控裝置以及主機板</chinese-title>  
        <english-title>POWER MONITORING DEVICE AND MAIN BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241231B">G06F1/3203</main-classification>  
        <further-classification edition="200601120241231B">F04D27/00</further-classification>  
        <further-classification edition="200601120241231B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡政倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種功率監控裝置，適用於一電腦系統，電腦系統設於一主機板，主機板透過一電源線連接至一電源供應器以取得電力，電源供應器具有一散熱風扇。功率監控裝置包含一電流偵測模組以及一邏輯判斷模組。電流偵測模組適於偵測流經電源線之一輸入電流以產生一電流監控訊號。邏輯判斷模組適於獲取電腦系統之一系統狀態訊號以及電流監控訊號，據以產生一輸出值提供電源供應器以控制散熱風扇。本案並提供一種主機板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power monitoring device for a computer system arranged on a main board is provided. The main board is connected to a power supply through a power line. The power supply has a cooling fan. The power monitoring device has a current sensing module and a logic determination module. The current sensing module is for detecting an input current on the power line to generate a current monitoring signal. The logic determination module is for receiving a system condition signal of the computer system and the current monitoring signal to generate an output value provided to the power supply for controlling the operation of the cooling fan. A main board having the power monitoring device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電腦系統</p>  
        <p type="p">12:主機板</p>  
        <p type="p">13:電源線</p>  
        <p type="p">14:電源供應器</p>  
        <p type="p">141:電源供應單元</p>  
        <p type="p">142:散熱風扇</p>  
        <p type="p">143:風扇控制電路</p>  
        <p type="p">200:功率監控裝置</p>  
        <p type="p">220:電流偵測模組</p>  
        <p type="p">240:邏輯判斷模組</p>  
        <p type="p">I0:輸入電流</p>  
        <p type="p">Z:輸出值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="79" publication-number="202627761"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627761.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>眼睛狀態偵測裝置及其操作方法</chinese-title>  
        <english-title>EYE STATE DETECTION DEVICE AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F3/01</main-classification>  
        <further-classification edition="202201120250303B">G06V40/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種眼睛狀態偵測裝置以及用於眼睛狀態偵測裝置的操作方法。眼睛狀態偵測裝置包括影像擷取元件。操作方法包括：由影像擷取元件擷取在當前幀的臉部影像；從臉部影像中獲得包括眼睛區域的當前影像；取得在當前幀之前的至少一幀的包括眼睛區域的至少一先前影像；對當前影像以及所述至少一先前影像進行加權運算以產生經處理影像；以及依據經處理影像判斷眼睛區域中的眼睛的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An eye state detection device and an operating method for the eye state detection device are provided. The eye state detection device includes an image capturing component. The operating method includes: capturing the facial image in a current frame by the image capturing element; obtaining a current image including an eye region from the facial image; obtaining at least one previous image including the eye region of at least one frame before the current frame; performing a weighting operation on the current image and the at least one previous image to generate a processed image; and determining a state of the eye in the eye region according to the processed image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:操作方法</p>  
        <p type="p">S110~S150:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="80" publication-number="202626208"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626208.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴灑裝置及噴灑方法</chinese-title>  
        <english-title>SPRAYING DEVICE AND SPRAYING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250218B">B05B3/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳婉昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WANN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江鴻志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱婉珣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WAN HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳靖眉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐陽盟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU YANG, MANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHI-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴灑裝置及噴灑方法。用於將液體噴灑於待噴灑區域的噴灑裝置包括氣體壓力源、噴灑頭以及管路單元。噴灑頭適於將液體以環狀噴灑。管路單元連接在氣體壓力源及噴灑頭之間，用以提供液體進入噴灑頭，其中在液體位在管路單元中時，氣體壓力源提供第一氣體壓力以將位在管路單元中的液體輸送到噴灑頭；當液體移動到噴灑頭時，氣體壓力源提供第二氣體壓力，以將液體經由噴灑頭以環狀噴灑至待噴灑區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A spraying device and a spraying method are provided. The spray device used to spray a liquid on an area to be sprayed includes a gas pumping source, a spray head and a pipe unit. The spray head is used to spray the liquid in a ring shape. The pipe unit is connected between the gas pumping source and the spray head and used to provide liquid into the spray head. The gas pumping source provides a first gas pressure to push the liquid in the pipe unit forward to the spray head, and then provides a second gas pressure to spray the liquid out annularly through the spray head.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:噴灑裝置</p>  
        <p type="p">110:氣體壓力源</p>  
        <p type="p">120:噴灑頭</p>  
        <p type="p">130:管路單元</p>  
        <p type="p">131:第一管</p>  
        <p type="p">132:第二管</p>  
        <p type="p">140:管接頭</p>  
        <p type="p">2:內環形壁</p>  
        <p type="p">3:內視鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="81" publication-number="202628457"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628457.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池通訊系統及其運作方法</chinese-title>  
        <english-title>BATTERY COMMUNICATION SYSTEM AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120241231B">H04W52/18</main-classification>  
        <further-classification edition="200901120241231B">H04W84/12</further-classification>  
        <further-classification edition="200601120241231B">H01M10/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連恩微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRACE CONNECTION MICROELECTRONICS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳培煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳憲穀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIEN-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池通訊系統及其運作方法。電池通訊系統用以進行數個電池單元之溝通。電池通訊系統之運作方法包括以下步驟。於電池通訊系統之一無線菊鏈通訊路徑中，一第一無線通訊單元透過一無線傳輸或耦方式向相鄰之一第二無線通訊單元發出一傳輸訊號。於電池通訊系統之無線菊鏈通訊路徑中，第一無線通訊單元與第二無線通訊單元執行一自動功率控制程序，以自動調整第一無線通訊單元之一輸出功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery communication system and an operation method thereof are provided. The battery communication system is used to communicate between a plurality of battery units. The operation method of the battery communication system includes the following steps. In a wireless daisy chain communication path of the battery communication system, a first wireless communication unit sends a transmission signal to a second wireless communication unit adjacent thereto through a wireless communication or coupling. In the wireless daisy chain communication path of the battery communication system, the first wireless communication unit and the second wireless communication unit execute an Auto-Power Control (APC) to automatically adjust an output power of the first wireless communication unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S300,S400,S500:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="82" publication-number="202627535"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627535.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超穎光學裝置</chinese-title>  
        <english-title>META-OPTICAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">G02B3/00</main-classification>  
        <further-classification edition="200601120250313B">G02B3/10</further-classification>  
        <further-classification edition="201101120250313B">B82Y20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張學智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSUEH-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淇霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHY-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉泰源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, TAI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的實施方式提供一種超穎光學裝置，包括具有出光面的發光元件、位於出光面上方的多焦點超穎透鏡及位於多焦點超穎透鏡相對於發光元件的一側的收光元件。多焦點超穎透鏡與出光面在垂直於出光面的方向上相距距離(d)。多焦點超穎透鏡具有落於出光面上的多個焦點區域，其中焦點區域在出光面上的直徑(ϕ)、距離(d)及收光元件的可收光角度(θ)符合以下關係式：ϕ≤(2×d×tan(θ))。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a meta-optical device including a light-emitting element having a light-emitting surface, a multifocal meta-lens above the light-emitting surface, and a light-receiving element on a side of the multifocal meta-lens opposite to the light-emitting element. The multifocal meta-lens is distanced from the light-emitting surface by distance (d) along a direction perpendicular to the light-emitting surface. The multifocal meta-lens has focus regions on the light-emitting surface, wherein a radius (ϕ) of the focus regions on the light-emitting surface, the distance (d), and an acceptance angle (θ) of the light-receiving element meets: ϕ≤(2×d×tan(θ)).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:超穎光學裝置</p>  
        <p type="p">110:發光元件</p>  
        <p type="p">112:出光面</p>  
        <p type="p">120:多焦點超穎透鏡</p>  
        <p type="p">122:焦點區域</p>  
        <p type="p">130:收光元件</p>  
        <p type="p">132:入光面</p>  
        <p type="p">d:距離</p>  
        <p type="p">L:最大孔徑</p>  
        <p type="p">R:半徑</p>  
        <p type="p">W:入光孔徑</p>  
        <p type="p">X,Y,Z:軸</p>  
        <p type="p">θ:可收光角度</p>  
        <p type="p">Φ:直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="83" publication-number="202627785"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627785.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容式觸控面板的驅動裝置</chinese-title>  
        <english-title>DRIVING DEVICE FOR CAPACITIVE TOUCH PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241226B">G06F3/044</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYDIUM SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭富元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, FU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙宜任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, I-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔明緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, MING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種驅動裝置，用以驅動電容式觸控面板。電容式觸控面板上設有複數個觸控感測電極。驅動裝置包括觸控驅動電路。觸控驅動電路耦接至該複數個觸控感測電極。在電容式觸控面板的觸控感測期間內，觸控驅動電路輸出觸控感測驅動訊號至該複數個觸控感測電極中的至少一觸控感測電極並同步輸出與觸控感測驅動訊號同相的觸控同驅訊號至該複數個觸控感測電極中的其他觸控感測電極。在觸控感測期間最初的第一區間內，觸控同驅訊號具有第一斜坡波形。在觸控感測期間最後的第二區間內，觸控同驅訊號具有第二斜坡波形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving device for driving a capacitive touch panel is disclosed. The capacitive touch panel is provided with a plurality of touch sensing electrodes. The driving device includes a touch driving circuit. The touch driving circuit is coupled to the plurality of touch sensing electrodes. During the touch sensing period of the capacitive touch panel, the touch driving circuit outputs a touch sensing driving signal to at least one of the plurality of touch sensing electrodes and synchronizes the output with the touch sensing driving signal. Touch co-driving signals with the same signal phase are sent to other touch sensing electrodes among the plurality of touch sensing electrodes. In an initial first interval of the touch sensing period, the touch co-driving signal has a first slope waveform. In a last second interval of the touch sensing period, the touch co-driving signal has a second slope waveform.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">PTS:觸控感測期間</p>  
        <p type="p">P1:第一區間</p>  
        <p type="p">P2:第二區間</p>  
        <p type="p">P3:第三區間</p>  
        <p type="p">FS:前設定期間</p>  
        <p type="p">BS:後設定期間</p>  
        <p type="p">VCFD:觸控同驅訊號</p>  
        <p type="p">RP1:第一斜坡波形</p>  
        <p type="p">RP2:第二斜坡波形</p>  
        <p type="p">WF:窗函數波形</p>  
        <p type="p">t1~t5:時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="84" publication-number="202627895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於觸控系統的場景分類方法及裝置</chinese-title>  
        <english-title>SCENE CLASSIFICATION METHOD AND DEVICE APPLIED TO TOUCH SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06N3/08</main-classification>  
        <further-classification edition="202201120250303B">G06V10/82</further-classification>  
        <further-classification edition="200601120250303B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYDIUM SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐成儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻柏憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, PO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛乃誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, NAI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種應用於觸控系統的場景分類方法，包括下列步驟：(a)透過資料擴增技術對場景資料進行資料前處理以產生訓練場景資料集及測試場景資料集；(b)提供該訓練場景資料集給神經網路模型進行深度學習的訓練；(c)提供該測試場景資料集給已訓練完成的該神經網路模型進行場景分類推論，以評估該神經網路模型判斷操作場景的準確率；以及(d)應用不特定的資料幀篩選機制至該神經網路模型以輕量化該神經網路模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A scene classification method applied to a touch system is disclosed. The scene classification method includes the following steps of: (a) performing data pre-processing on scene data through data amplification technology to generate a training scene data set and a test scene data set; (b) providing the training scene data set to a neural network model for deep learning training; (c) providing the test scene data set to the trained neural network model for scene classification inference to evaluate the accuracy of the neural network model determining operating scene; and (d) applying an unspecific data frame filtering mechanism to the neural network model to lightweight the neural network model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:步驟</p>  
        <p type="p">S12:步驟</p>  
        <p type="p">S14:步驟</p>  
        <p type="p">S16:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="85" publication-number="202628265"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628265.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器及纜線連接模組</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR AND CABLE CONNECTION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H01R13/58</main-classification>  
        <further-classification edition="201101120241231B">H01R24/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>好慶科技企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMCOM TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王主力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種電連接器、纜線轉動裝置、纜線彎折裝置以及纜線連接模組。電連接器包含第一電連接單元以及纜線連接模組。第一電連接單元包含相反之第一端及第二端，第一端與纜線電連接，且可插入至相應之第二電連接單元，使纜線與第二電連接單元電性連接，其中第一電連接單元為電子插頭及插座的其中一個，第二電連接單元為另一個，一出線方向自該第二端向外延伸。纜線連接模組鄰近第二端，可沿垂直於該出線方向之平面旋轉第一旋轉角，或沿平行於該出線方向之平面轉動第一轉動角，纜線由第二端伸出第一電連接單元並通過纜線連接模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector, a cable rotating device, a cable bending device, and a cable connection module are provided. The electrical connector include a first electrical connecting unit and a cable connection module. The electrical plug includes a first end and a second end opposite to each other. The first end is electrically connected to a cable and can be inserted into a corresponding second electrical connecting unit to electrically connect the cable to the second electrical connecting unit. The first electrical connecting unit is one of an electrical plug and a socket, wherein the second electrical connecting unit is the other of the same. An wire-outgoing direction extends outward from the second end. The cable connection module is adjacent to the second end and can rotate a first rotation angle along a plane perpendicular to the wire-outgoing direction, or a first turning angle along a plane parallel to the wire-outgoing direction. The cable extends out of the first electrical connecting unit from the second end and passes through the cable connection module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一電連接單元</p>  
        <p type="p">200:纜線連接模組</p>  
        <p type="p">300:纜線轉動裝置</p>  
        <p type="p">400:纜線彎折裝置</p>  
        <p type="p">700:纜線</p>  
        <p type="p">900:電連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="86" publication-number="202628267"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628267.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器組件</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250210B">H01R13/627</main-classification>  
        <further-classification edition="200601120250210B">H01R13/639</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奎熠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, KUI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊竣翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JYUN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器組件包括第一連接器、第二連接器、外環與至少一彈性位能元件。第一連接器具有定位槽。定位槽具有導引斜面與定位端部。第二連接器配置以耦接第一連接器。外環圍繞第一連接器與第二連接器，且外環靠近第一連接器的邊緣處具有定位凸點。彈性位能元件位於第二連接器與外環之間，配置以在定位凸點沿導引斜面進入定位槽後提供彈性恢復力，使定位凸點抵接定位端部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector assembly includes a first connector, a second connector, an outer ring, and at least one spring. The first connector has a positioning recess. The positioning recess has a guiding inclined surface and a positioning end portion. The second connector is configured to couple with the first connector. The outer ring surrounds the first connector and the second connector, and an edge of the outer ring adjacent to the first connector has a positioning protruding point. The spring is located between the second connector and the outer ring, and is configured to provide an elastic recovery force after the positioning protruding point enters the positioning recess along the guiding inclined surface, such that the positioning protruding point abuts against the positioning end portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電連接器組件</p>  
        <p type="p">110:第一連接器</p>  
        <p type="p">111:導引斜面</p>  
        <p type="p">112:定位槽</p>  
        <p type="p">113:定位端部</p>  
        <p type="p">115:軸向部</p>  
        <p type="p">120:第二連接器</p>  
        <p type="p">130:外環</p>  
        <p type="p">140:彈性位能元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="87" publication-number="202626467"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626467.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件導引裝置、工件導引方法及作業設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">B65G47/80</main-classification>  
        <further-classification edition="200601120250325B">B65G47/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝承軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHENG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇啟瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種工件導引裝置、工件導引方法及作業設備。該工件導引裝置適用於將利用一提取器提取的一工件向下引導置入一治具設有的一容穴，並設有一承載座、一導引單元，及一控制單元。該承載座設有用於承載該治具的一承載部。該導引單元設有可被驅動而在該治具上方相向合攏或背向遠離的一第一導座與一第二導座。該控制單元可控制該第一導座與該第二導座被驅動而相向合攏構成可導引該工件置入該容穴的一導引通道。本發明藉由該導引單元及該控制單元的相互配合以形成該導引通道，該工件可被該導引通道引導而精準且有效率地被置入該治具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:承載座</p>  
        <p type="p">11:承載部</p>  
        <p type="p">111:貫孔</p>  
        <p type="p">2:導引單元</p>  
        <p type="p">22:微驅動組件</p>  
        <p type="p">3:水平驅動組件</p>  
        <p type="p">31:第一水平驅動組件</p>  
        <p type="p">311:第一驅動件</p>  
        <p type="p">314:第一滑塊</p>  
        <p type="p">32:第二水平驅動組件</p>  
        <p type="p">321:第二驅動件</p>  
        <p type="p">324:第二滑塊</p>  
        <p type="p">33:滑軌</p>  
        <p type="p">4:底座</p>  
        <p type="p">41:垂直驅動組件</p>  
        <p type="p">6:第一高度偵測單元</p>  
        <p type="p">8:工件</p>  
        <p type="p">81:第一部分</p>  
        <p type="p">82:第二部分</p>  
        <p type="p">9:治具</p>  
        <p type="p">901:先置入區</p>  
        <p type="p">902:後置入區</p>  
        <p type="p">91:容穴</p>  
        <p type="p">A20:第一導槽</p>  
        <p type="p">A21:第一導座</p>  
        <p type="p">A23:第一導部</p>  
        <p type="p">A25:第一固定座</p>  
        <p type="p">A26:第一活動座</p>  
        <p type="p">B20:第二導槽</p>  
        <p type="p">B21:第二導座</p>  
        <p type="p">B23:第二導部</p>  
        <p type="p">B25:第二固定座</p>  
        <p type="p">B26:第二活動座</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">O1:工件導引裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="88" publication-number="202628512"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628512.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>供料機櫃及供料系統</chinese-title>  
        <english-title>SUPPLY CABINET AND SUPPLY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250312B">H05K5/02</main-classification>  
        <further-classification edition="200601120250312B">H05K7/14</further-classification>  
        <further-classification edition="200601120250312B">B65G47/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁瑞鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, JUI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張立寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, LI-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林暄智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSUAN CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許書晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHU CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝嘉新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種供料機櫃，用以容納多個料件載盤，以供一取料裝置取出。供料機櫃包含一櫃體、多層支撐件及多個第一受測元件。這些支撐件設置於櫃體內且間隔排列，這些支撐件分別用以承載這些料件載盤。這些第一受測元件分別設置於這些支撐件，第一受測元件用以受設置於取料裝置上的一感測元件感測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A supply cabinet is configured to accommodate a plurality of material trays for an extraction device to extract the material trays. The supply cabinet includes a cabinet, a plurality of supports and a plurality of first detected components. The supports are disposed in the cabinet and spaced apart from each other. The supports are configured to support the material trays, respectively. The first detected components are respectively disposed on the supports. The first detected components are configured to be detected by a detector on the extraction device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:供料系統</p>  
        <p type="p">2:機架</p>  
        <p type="p">3:供料模組</p>  
        <p type="p">31:供料機櫃</p>  
        <p type="p">32:取料裝置</p>  
        <p type="p">4:輸送裝置</p>  
        <p type="p">5:安裝裝置</p>  
        <p type="p">E:電子裝置</p>  
        <p type="p">M:主機板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="89" publication-number="202627354"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627354.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149143</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燃燒器裝置</chinese-title>  
        <english-title>BURNER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250318B">F23D14/22</main-classification>  
        <further-classification edition="200601120250318B">F23D14/02</further-classification>  
        <further-classification edition="200601120250318B">F23D14/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRA, DIPANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林友崧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEOU-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種燃燒器裝置，包含一管件、一噴頭板件、多個噴嘴及至少一燃料輸送管路。管件具有一內部空間。噴頭板件設置於內部空間中並將內部空間分隔出一輸氣通道及一燃燒室，且噴頭板件具有多個進氣孔。輸氣通道透過進氣孔連通燃燒室，且輸氣通道用以供空氣流通，使空氣通過進氣孔而進入燃燒室。噴嘴設置於噴頭板件並位於燃燒室中，且噴嘴分別對應並鄰近設置於進氣孔的一側。燃料輸送管路設置於輸氣通道中，燃料輸送管路的一端穿設噴頭板件以連通噴嘴，且燃料輸送管路的另一端用以連接一供料設備。其中，噴嘴的噴料方向與進氣孔的送氣方向非平行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A burner device includes a tube, a nozzle plate, a plurality of nozzles and at least one fuel delivery pipeline. The tube has an internal space. The nozzle plate is disposed within the internal space and divides the internal space into an air supply passage and a combustion chamber, and the nozzle plate has a plurality of through holes. The air supply passage is connected to the combustion chamber through the through holes, and the supply passage is configured for air to flows through the through holes into the combustion chamber. The nozzles are disposed on the nozzle plate and located in the combustion chamber, and the nozzles respective correspond to and are disposed adjacent to one side of the through holes. The fuel delivery pipeline is disposed with in the air supply passage, with one end of the fuel delivery pipeline passing through the nozzle plate to connect to the nozzles, while the other end of the fuel delivery pipeline is configured to connect to a fuel supply device. In addition, a spray direction of the nozzles is not parallel to an airflow direction through the through holes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:管件</p>  
        <p type="p">12:噴頭板件</p>  
        <p type="p">13a,13b:噴嘴</p>  
        <p type="p">15:燃料輸送管路</p>  
        <p type="p">120a,120b:進氣孔</p>  
        <p type="p">C1:燃燒室</p>  
        <p type="p">D2:噴料方向</p>  
        <p type="p">D3:送氣方向</p>  
        <p type="p">D4:供料方向</p>  
        <p type="p">G1:間隙</p>  
        <p type="p">P1:輸氣通道</p>  
        <p type="p">S1:內部空間</p>  
        <p type="p">W1:內壁面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="90" publication-number="202628228"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628228.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎂氧氣電池</chinese-title>  
        <english-title>MAGNESIUM-OXYGEN BATTERY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241226B">H01M12/08</main-classification>  
        <further-classification edition="201001120241226B">H01M10/0562</further-classification>  
        <further-classification edition="201001120241226B">H01M10/0565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德鑫新技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXIN ADVANCED TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇秀惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSIU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫　誠康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IPUTERA, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達馬拉　瓦薩坦　羅素皮萊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHARMARAJ, VASANTAN RASUPILLAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾仁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, REN-JEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉如熹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, RU-SHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳漢楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林瑜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周秀麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA CHOU, HSIU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃琮益</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鎂氧氣電池。該鎂氧氣電池包含陽極、陰極、以及設置於陽極與陰極之間的準固態電解質，其中該準固態電解質包含以電紡織方式製得之聚合物基質，較佳係以電紡織方式製得之含氟聚合物基質。本發明之鎂氧氣電池可兼具高放電容量、低過電位、高工作電壓與長循環壽命的優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnesium-oxygen battery is provided. The magnesium-oxygen battery comprises an anode, a cathode, and a quasi-solid-state electrolyte disposed between the anode and cathode, wherein the quasi-solid-state electrolyte comprises a polymer matrix made by an electrospinning method, preferably a fluoropolymer matrix made by an electrospinning method. The magnesium-oxygen battery of the present invention combines the advantages of high discharge capacity, low overpotential, high operating voltage, and long cycling life.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池</p>  
        <p type="p">110:陽極</p>  
        <p type="p">120:陰極</p>  
        <p type="p">130:準固態電解質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="91" publication-number="202627286"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627286.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>捲簾固定裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">E06B9/40</main-classification>  
        <further-classification edition="200601120250224B">E06B9/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麗窗企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAUTIFUL WINDOW FASHIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SZU-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種捲簾固定裝置，包含一連接軌、二滑動軌、二抵接板、二定位螺桿，及二固定架。該等滑動軌滑動地套設於該連接軌的兩端。該等抵接板抵接於該等滑動軌與該連接軌之間。每一抵接板包括一板體，及一形成於該板體的螺孔。該等定位螺桿螺接於該等螺孔。該等固定架用於固定一捲簾。轉動該等定位螺桿，能驅動該等抵接板在一固定位置及一鬆動位置之間移動。當在該固定位置時，該連接軌與該等滑動軌之間緊密接觸並產生摩擦力，以抑制該等滑動軌相對該連接軌滑動。當在該鬆動位置時，該等滑動軌能相對該連接軌滑動，以調整該捲簾固定裝置的長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:捲簾固定裝置</p>  
        <p type="p">10:捲簾</p>  
        <p type="p">2:連接軌</p>  
        <p type="p">3:滑動軌</p>  
        <p type="p">4:抵接板</p>  
        <p type="p">5:定位螺桿</p>  
        <p type="p">6:固定架</p>  
        <p type="p">X:長度方向</p>  
        <p type="p">Z:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="92" publication-number="202626281"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626281.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴油嘴拔除槍</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">B25B27/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖建修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖建修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種噴油嘴拔除槍，設有一握持組、一進氣組及一振動組，該握持組設有一握柄、一外殼、兩結合座及一固定座，該兩結合座與該外殼相結合且間隔設置，該固定座與該兩結合座固設結合，該進氣組與該握持組相結合且設有一閥座及一扳機，該振動組與該握持組相結合且設有一主軸及一振動筒，該主軸與該固定座相固設結合且伸入該外殼內，該振動筒滑動地套設於該主軸上且設於該外殼內，於移動過程中提供該主軸一振動力，該振動筒的外表面與該外殼的內表面呈間隔設置，提供一種方便握持、提升安全性、縮短操作時間且減少振動力的噴油嘴拔除槍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:握持組</p>  
        <p type="p">11:握柄</p>  
        <p type="p">12:外殼</p>  
        <p type="p">122:開口端</p>  
        <p type="p">123:閉口端</p>  
        <p type="p">13A:下結合座</p>  
        <p type="p">13B:上結合座</p>  
        <p type="p">14:固定座</p>  
        <p type="p">143:鎖固件</p>  
        <p type="p">22:扳機</p>  
        <p type="p">311:外端</p>  
        <p type="p">315:鎖合頭</p>  
        <p type="p">32:振動筒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="93" publication-number="202627282"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627282.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防水門窗框</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">E06B3/96</main-classification>  
        <further-classification edition="200601120250313B">E06B7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晟鈺智能全球有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑞汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種防水門窗框，其具有一外框、一內框及複數固定件。外框具有一連接邊。連接邊具有一主板、一第一密封板及一第一密封件。第一密封板向外框的內側延伸，第一密封件設置於第一密封板遠離主板的一端。內框可轉動地設置於連接邊的內側並具有一樞軸部、一外板、一內板及一固定孔。內框能以樞軸部為軸心相對於外框轉動，並使外板貼合於第一密封件。固定孔貫穿形成於外板，且固定孔位於第一密封槽的外側。固定件穿設於固定孔，並固設於外框的第一密封板。當門窗關閉時，水不會自固定件與外框、內框之間的間隙流入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:外框</p>  
        <p type="p">20:連接邊</p>  
        <p type="p">21:主板</p>  
        <p type="p">22:側板</p>  
        <p type="p">24:第一密封板</p>  
        <p type="p">25:第一密封槽</p>  
        <p type="p">26:第一密封件</p>  
        <p type="p">27:第二密封板</p>  
        <p type="p">28:第二密封槽</p>  
        <p type="p">29:第二密封件</p>  
        <p type="p">30:內框</p>  
        <p type="p">31:樞軸部</p>  
        <p type="p">32:外板</p>  
        <p type="p">33:內板</p>  
        <p type="p">34:連結板</p>  
        <p type="p">35:固定孔</p>  
        <p type="p">40:固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="94" publication-number="202627284"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627284.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防水門窗</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">E06B7/14</main-classification>  
        <further-classification edition="200601120250313B">E06B7/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晟鈺智能全球有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑞汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種防水門窗，其具有一框體及一門窗扇。框體具有複數擋片。擋片自框體的內側突出，且彼此間隔設置。門窗扇可移動地設置於框體中，並具有一連桿、複數防水擋塊及一防水把手。連桿可移動地沿門窗扇的側緣設置，並位置上對應於擋片。防水擋塊設置於連桿，並朝框體突出，且防水擋塊彼此間隔設置。防水把手能帶動連桿移動。當連桿沿門窗扇的側緣移動時，防水擋塊的位置分別對應於擋片的位置，或防水擋塊與擋片能位置上相交錯。當防水擋塊與擋片相貼時，框體的內側及門窗扇的側緣相貼合，以避免框體及門窗扇之間產生間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:框體</p>  
        <p type="p">20:門窗扇</p>  
        <p type="p">23:防水把手</p>  
        <p type="p">25:開關把手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="95" publication-number="202626284"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626284.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙模式訂書機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">B25C5/00</main-classification>  
        <further-classification edition="200601120250313B">B25C5/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>順德工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白丞祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種雙模式訂書機，包含一第一底座、一第二底座、一針匣組件、一壓柄組件及一鎖定機構，第二底座、針匣組件及壓柄組件可樞擺地結合於第一底座，鎖定機構包含一操作件及一彈性件，操作件設於其中一底座上，且能沿著滑動方向於一鎖定位置與一解鎖位置之間滑動，彈性件設於操作件及設有操作件的底座之間；操作件位於鎖定位置時，操作件與另外一底座卡掣，使第二底座與針匣組件可維持適當間距，訂書機能以收針模式使用；而操作件位於解鎖位置時，第二底座朝遠離針匣組件的方向樞擺而呈開啟狀態，使訂書機能以不收針模式使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一底座</p>  
        <p type="p">101:安裝板</p>  
        <p type="p">102:連接板</p>  
        <p type="p">11:卡合鉤</p>  
        <p type="p">20:第二底座</p>  
        <p type="p">21:座體</p>  
        <p type="p">211:連通孔</p>  
        <p type="p">22:上蓋</p>  
        <p type="p">30:針匣組件</p>  
        <p type="p">40:壓柄組件</p>  
        <p type="p">511:卡合部</p>  
        <p type="p">512:斜面</p>  
        <p type="p">513:操作孔</p>  
        <p type="p">52:彈性件</p>  
        <p type="p">S:滑動方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="96" publication-number="202627365"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627365.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>屋面太陽能裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241231B">F24S25/615</main-classification>  
        <further-classification edition="201801120241231B">F24S20/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大瀚鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>項錦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種屋面太陽能裝置，包含一底板、一設置於該底板上方的中介層、多個設置於該中介層上的承接單元、一太陽能板，及多個卡匣。該底板定義出彼此垂直的一第一方向及一第二方向。該等承接單元彼此沿該第一方向相互銜接，且每一該承接單元包括一基板，及二自該基板沿該第一方向相互靠近地延伸，並沿一厚度方向向外凸伸的裝設部。相鄰的該等裝設部相互配合界定出一滑槽。所述太陽能板裝設於該等裝設部。該等卡匣分別設置於該等滑槽。藉由該太陽能板設置於該等裝設部及該等滑槽，即能取代以往額外搭建支架之做工複雜的方式，而能降低施作成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:底板</p>  
        <p type="p">10:吸收空間</p>  
        <p type="p">2:中介層</p>  
        <p type="p">20:設置空間</p>  
        <p type="p">21:防火棉</p>  
        <p type="p">22:Z型夾具</p>  
        <p type="p">3:承接單元</p>  
        <p type="p">31:基板</p>  
        <p type="p">32:裝設部</p>  
        <p type="p">320:滑槽</p>  
        <p type="p">321:擋緣</p>  
        <p type="p">322:抵緣</p>  
        <p type="p">5:卡匣</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:厚度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="97" publication-number="202628015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音樂連動式教保系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">G09B5/04</main-classification>  
        <further-classification edition="201201120250116B">G06Q50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>育音資訊科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳舜云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種音樂連動式教保系統，包含一伺服單元、一播音單元、一遠端使用單元及一應用程式。該伺服單元具有一音樂資料庫、一作息時間表、一通訊組件。該播音單元可撥放該伺服單元輸出之音源。該遠端使用單元可與該通訊組件以有線或無線方式連接。該應用程式分別安裝於該伺服單元及該遠端使用單元。藉此，該伺服器依該作息時間表依序撥放該音樂資料庫之音樂至該播音單元，該遠端使用單元可設計該作息時間表依序撥放該音樂資料庫之音樂，讓親、師、生利用本發明的教保系統，以音樂配合達到訊息傳遞，讓嬰幼兒自然而然養成作息、學習、好情緒、好習慣，學習生活自理、建立生活常規。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:伺服單元</p>  
        <p type="p">11:音樂資料庫</p>  
        <p type="p">12:作息時間表</p>  
        <p type="p">13:通訊組件</p>  
        <p type="p">131:網際網路</p>  
        <p type="p">132:藍芽</p>  
        <p type="p">133:無線網路</p>  
        <p type="p">20:播音單元</p>  
        <p type="p">30:遠端使用單元</p>  
        <p type="p">31:終端電腦</p>  
        <p type="p">32:遠端電腦</p>  
        <p type="p">33:第一智慧手機</p>  
        <p type="p">34:第二智慧手機</p>  
        <p type="p">40:應用程式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="98" publication-number="202627573"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627573.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149168</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透鏡式全反射波長分波多工被動元件結構</chinese-title>  
        <english-title>LENS-TYPE TOTAL REFLECTION WAVELENGTH DIVISION MULTIPLEXING PASSIVE ELEMENT STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">G02B6/34</main-classification>  
        <further-classification edition="200601120250313B">G02B6/32</further-classification>  
        <further-classification edition="200601120250313B">H04J14/02</further-classification>  
        <further-classification edition="200601120250313B">G02B5/20</further-classification>  
        <further-classification edition="201301120250313B">H04B10/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上詮光纖通信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡頂達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方介昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林廷晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張澤夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種透鏡式全反射波長分波多工被動元件結構，包括一本體，具有相對設置的一第一側面以及一第二側面；一透鏡組，設置在該本體的該第一側面上；一全反射膜，設置在該本體的該第一側面上並位在該透鏡組下方；複數個帶通濾波片，上下並列地設置在該本體的該第二側面上，各該帶通濾波片分別供不同波長的光波通過；以及一三稜鏡，設置在該本體的該第二側面上並覆蓋該等帶通濾波片，該三稜鏡的一垂直側邊貼附該本體的該第二側面；其中，穿過對應各該帶通濾波片的光波經過該三稜鏡的一斜邊進行全反射而轉向到該三稜鏡的一底邊而將不同波長的光波分別輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a lens-type total reflection wavelength division multiplexing passive element structure. The structure involves a body, having a first side and a second side arranged oppositely; a lens set, arranged on the first side of the body; a total reflection film, provided on the first side of the body and located below the lens set; a plurality of bandpass filters, arranged in parallel up and down on the second side of the body, and each bandpass filter allows light waves of different wavelengths to pass through; and a triangular prism, provided on the second side of the body and covering the bandpass filters, and a vertical side of the triangular prism is attached to the second side of the body; wherein, the light waves passing through the corresponding bandpass filters undergo total reflection through an oblique side of the triangular prism and are turned to a bottom side of the triangular prism to output light waves of different wavelengths respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:透鏡式全反射波長分波多工被動元件結構</p>  
        <p type="p">100:本體</p>  
        <p type="p">110:第一側面</p>  
        <p type="p">120:第二側面</p>  
        <p type="p">200:透鏡組</p>  
        <p type="p">210:透鏡</p>  
        <p type="p">300:全反射膜</p>  
        <p type="p">410~440:帶通濾波片</p>  
        <p type="p">500:三稜鏡</p>  
        <p type="p">510:垂直側邊</p>  
        <p type="p">520:斜邊</p>  
        <p type="p">530:底邊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="99" publication-number="202627372"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627372.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻循環散熱件及具有該冷卻循環散熱件的電子裝置</chinese-title>  
        <english-title>COOLING CYCLE HEAT SINK AND ELECTRONIC DEVICE WITH THE COOLING CYCLE HEAT SINK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">F25D17/02</main-classification>  
        <further-classification edition="200601120241231B">B01D19/02</further-classification>  
        <further-classification edition="200601120241231B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建準電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷卻循環散熱件，用以解決習知冷卻循環散模組容易產生噪音的問題。係包含：一殼體；及一流道，位於該殼體，該流道具有至少一聚氣區，該至少一聚氣區具有具有一入液部及一出液部，該入液部與該出液部之間可以具有至少一擴增段，該至少一擴增段具有一第一側邊及一第二側邊，該第一側邊及該第二側邊於該殼體的一Y方向成相對，該流道具有一集液區，該集液區依序具有一擴徑段及一縮徑段。本發明另關於一種具有該冷卻循環散熱件的電子裝置。藉此可以達成使冷卻循環模組靜音化功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling cycle heat dissipation component is used to solve the problem that conventional cooling cycle module units are prone to noise. Includes: a shell; and a flow channel located in the shell. The flow channel has at least one gas gathering area, and the at least one gas gathering area has a liquid inlet and a liquid outlet, and there can be at least one amplification section between the liquid inlet and the liquid outlet. The at least one amplification section has a first side and a second side. The first side and the second side are at a Y of the housing. The directions are opposite, and the flow channel has a liquid collecting area, and the liquid collecting area has an enlarged diameter section and a reduced diameter section in sequence. The present invention also relates to an electronic device having the cooling cycle heat sink. This can achieve the effect of making the cooling cycle module silent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">1a:第一板</p>  
        <p type="p">1b:第二板</p>  
        <p type="p">11:入液口</p>  
        <p type="p">12:出液口</p>  
        <p type="p">2:流道</p>  
        <p type="p">2a:第一端</p>  
        <p type="p">2b:第二端</p>  
        <p type="p">21:聚氣區</p>  
        <p type="p">21a:入液部</p>  
        <p type="p">21b:出液部</p>  
        <p type="p">21c:擴增段</p>  
        <p type="p">22:第一側邊</p>  
        <p type="p">23:第二側邊</p>  
        <p type="p">24:集液區</p>  
        <p type="p">241:擴徑段</p>  
        <p type="p">242:縮徑段</p>  
        <p type="p">M:冷卻循環散熱件</p>  
        <p type="p">T:連通管</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="100" publication-number="202628444"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628444.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活動數位追蹤整合服務系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250303B">H04W4/029</main-classification>  
        <further-classification edition="202301120250303B">B64U10/00</further-classification>  
        <further-classification edition="202301320250303B">B64U101/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紙飛機服務科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李學真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李學真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃無名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種活動數位追蹤整合服務系統，使用於水域活動設施，包括：一追蹤管理平台、至少一定位追蹤標籤、至少一無人機、一通訊平台，追蹤管理平台包括：一設備管理模組、一緊急救援模組，與設備管理模組連接、一數據分析模組，與設備管理模組連接、一數位雙生模組，與數據分析模組連接、一管理者介面，與設備管理模組及緊急救援模組連接。本發明的活動數位追蹤整合服務系統，其主要目的為增加大型活動的搜救範圍及搜救效率，並且應用於各種場域，或者偵測使用者的運動數據及健康數據，以即時發現使用者的生理狀況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:追蹤管理平台</p>  
        <p type="p">11:設備管理模組</p>  
        <p type="p">12:緊急救援模組</p>  
        <p type="p">13:數據分析模組</p>  
        <p type="p">14:數位雙生模組</p>  
        <p type="p">15:管理者介面</p>  
        <p type="p">20:定位追蹤標籤</p>  
        <p type="p">30:無人機</p>  
        <p type="p">40:通訊平台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="101" publication-number="202627620"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627620.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像生成系統、影像生成方法及其電腦程式產品</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR GENERATING IMAGE AND COMPUTER PROGRAM PRODUCT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251105B">G02B30/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江其勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐘逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提出一種適應性高品質影像生成系統與方法。影像下採樣單元對兩張輸入影像進行下採樣以產生多組的兩張下採樣影像，光流預測單元使用光流預測模型對其中一組的兩張下採樣影像進行處理以產生兩個輸入光流，上採樣單元使用升維模型對兩個輸入光流進行迭代上採樣以產生其中一組的兩張下採樣影像之兩個上採樣光流，影像合成模組根據兩個上採樣光流及兩張輸入影像進行影像合成以重建出兩張輸入影像之間的中間影像。本案另提出執行影像生成方法之電腦程式產品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method for generating images and a computer program product thereof are provided. An image downsampling unit is configured to downsample two input images to generate a plurality of sets of two downsampled images. An optical flow estimating unit is configured to process one set of the plurality of sets of two downsampled images using an optical flow estimating model to generate two input optical flows. An upsampling unit is configured to iteratively upsample the two input optical flows to generate two upsampled optical flows of the one set of two downsampled images. An image synthesis module is configured to perform image synthesis based on the two upsampled optical flows and the two input images to reconstruct an intermediate image between the two input images. A computer program product of the method for generating images is further provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:影像生成系統</p>  
        <p type="p">10:影像暫存模組</p>  
        <p type="p">20:影像處理模組</p>  
        <p type="p">21:影像下採樣單元</p>  
        <p type="p">22:光流預測單元</p>  
        <p type="p">221:光流預測模型</p>  
        <p type="p">23:上採樣單元</p>  
        <p type="p">231:升維模型</p>  
        <p type="p">30:影像合成模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="102" publication-number="202628020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149175</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>長者防災知識互動教具</chinese-title>  
        <english-title>THE INTERACTIVE DISASTER PREVENTION LEARNING AIDS FOR THE ELDERLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250313B">G09B19/00</main-classification>  
        <further-classification edition="200601120250313B">G09B19/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建國科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIENKUO TECHNOLOGY UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王珮茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEI-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡慕凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥佳筠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, CHIA-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪偉任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種長者防災知識互動教具，係包括 : 一箱體，具有一開口朝上之容置空間;一頂板，係樞設於該箱體並封閉該容置空間，該頂板上設有複數通道以及複數通孔，用以供一滾珠可以滾動通行，該複數通道上且設有各種正確或不正確的防災知識標語及圖樣，該複數通孔設置於不正確防災知識標語及圖樣的通道上、貫穿該頂板且連通於該容置空間;使用者手持該箱體控制該滾珠滾入標示有正確防災識標語及圖樣的通道，即可以順利通過，當該滾珠滾入標示有不正確防災識標語及圖樣的通道時，即會從該複數通孔掉進該容置空間內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The Interactive disaster prevention learning aids for the elderly., which includes: a box with an upward-opening accommodation space; a top plate that is pivotally mounted on the box and closes the accommodation space; the top plate is provided with a plurality of Channels and a plurality of through holes are used for a ball to roll through. The plurality of channels are provided with various correct or incorrect disaster prevention knowledge slogans and patterns. The plurality of through holes are provided with incorrect disaster prevention knowledge slogans and patterns. on the passage, running through the top plate and connected to the accommodation space; the user holds the box and controls the ball to roll into the passage marked with the correct disaster prevention identification slogan and pattern, and can pass smoothly. When the ball rolls into the passage marked with the correct disaster prevention identification slogan and pattern, If the passage with disaster prevention signs and patterns is not correct, people will fall into the accommodation space from the plurality of through holes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:長者防災知識互動教具</p>  
        <p type="p">10:箱體</p>  
        <p type="p">20:頂板</p>  
        <p type="p">21:通道</p>  
        <p type="p">22:通孔</p>  
        <p type="p">23:凸隔條</p>  
        <p type="p">24:正確防災知識標語及圖樣</p>  
        <p type="p">25:不正確的防災知識標語及圖樣</p>  
        <p type="p">26:“開始”文字圖樣</p>  
        <p type="p">27:“過關”文字圖樣</p>  
        <p type="p">30:滾珠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="103" publication-number="202628396"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628396.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器化服務方法及系統</chinese-title>  
        <english-title>CONTAINERIZED SERVICE METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L41/04</main-classification>  
        <further-classification edition="202201120250303B">H04L41/0273</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉山商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E.SUN COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李峻緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游俊逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, CHUN YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡昇哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHENG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種容器化服務系統，當接收到一前端連線請求時，一前端伺服器判斷該前端連線請求是否來自一管理終端。當判斷結果為肯定時，該前端伺服器產生並傳送一指示出進行內部驗證的驗證後端連線請求至一後端伺服器，以致該後端伺服器根據該驗證後端連線請求透過該容器平台調度一驗證容器集，以進行內部驗證。當判斷結果為否定時，該前端伺服器產生並傳送一未指示出進行內部驗證的服務後端連線請求至該後端伺服器，以致該後端伺服器根據該服務後端連線請求透過該容器平台調度一對應該服務後端連線請求的服務容器集，以進行對外服務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A containerized service system comprises a backend server and a front end server. When the front end server receives a front end connection request, the front end server determines whether the front end connection request is from a management terminal. When the determination is affirmative, the front end server generates and transmits a verification backend connection request indicating performance of internal verification to the backend server so that the backend server dispatches a verification container set through the container platform based on the verification backend connection request to perform internal verification. When the determination is negative, the front end server generates and transmits a service backend connection request that does not indicate performance of internal verification to the backend server so that the backend server dispatches, through the container platform based on the service backend connection request, a service container set corresponding to the service</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301~308:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="104" publication-number="202628404"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628404.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用知識圖譜以建立應用於智慧醫療之安全無害聊天機器人</chinese-title>  
        <english-title>USE KNOWLEDGE GRAPH TO BUILD A SAFE AND HARMLESS CHATBOT TO EVALUATE SMART MEDICAL CARE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L51/02</main-classification>  
        <further-classification edition="201801120250303B">G16H50/00</further-classification>  
        <further-classification edition="201801120250303B">G16H50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建國科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIENKUO TECHNOLOGY UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈慧宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUI-YU, SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊明維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MING-WEI, ZHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN-JIA, ZHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用知識圖譜以建立應用於智慧醫療之安全無害聊天機器人，係包括一大型語言查詢模型、一知識圖譜檢索模組、一安全門檻檢測模組及一提示生成模組，藉由上述系統，透過知識圖譜（Knowledge Graph）與大語言模型（LLM）的智慧醫療聊天機器人，能有效設置安全無害門檻，解決傳統 LLM 在醫療對話中面臨的安全性和準確性問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A safe and harmless chat robot that uses knowledge graphs to build smart medical applications. It includes a large-scale language query model, a knowledge graph retrieval module, a safety threshold detection module and a prompt generation module. Through the above system , through knowledge graph and large language model (LLM), smart medical chatbots can effectively set safe and harmless thresholds and solve the security and accuracy problems faced by traditional LLM in medical conversations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:利用知識圖譜以建立應用於智慧醫療之安全無害聊天機器人</p>  
        <p type="p">10:大型語言查詢模型</p>  
        <p type="p">20:知識圖譜檢索模組</p>  
        <p type="p">30:安全門檻檢測模組</p>  
        <p type="p">40:提示生成模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="105" publication-number="202628410"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628410.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用二維碼產生虛擬連接的撥接通話網站</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H04M3/42</main-classification>  
        <further-classification edition="202301120250602B">G06Q10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫義勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫義勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用二維碼產生虛擬連接的撥接通話網站，包含：一撥接中心單元用於接收一物主或一外部人員的訊號，該撥接中心單元包含一通訊介面；該物主經由一物主通訊裝置連接該通訊介面，該外部人員經由一外部人員通訊裝置連接該通訊介面；一物主資料庫連接該通訊介面；一二維碼產生單元連通該物主資料庫及該通訊介面，該二維碼產生單元對於該物主產生一二維碼，使得該物主可將該二維碼標示在其所有物上；一虛擬電話號碼產生單元連接該通訊介面及該物主資料庫，該虛擬電話號碼產生一虛擬電話號碼組包含一外部人員虛擬號碼及/或一物主虛擬號碼；該物主可以通過此外部人員虛擬號碼與該外部人員聯絡；同樣地，該外部人員可以通過此物主虛擬號碼與該物主聯絡。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">2:物主</p>  
        <p type="p">4:外部人員</p>  
        <p type="p">5:二維碼</p>  
        <p type="p">10:通訊介面</p>  
        <p type="p">20:物主通訊裝置</p>  
        <p type="p">30:外部人員通訊裝置</p>  
        <p type="p">40:物主資料庫</p>  
        <p type="p">45:二維碼產生單元</p>  
        <p type="p">50:虛擬電話號碼產生單元</p>  
        <p type="p">55:虛擬電話號碼組</p>  
        <p type="p">100:撥接中心單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="106" publication-number="202626371"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626371.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層結構及包含的PVB層與應用的顯示裝置</chinese-title>  
        <english-title>MULTILAYER STRUCTURE, PVB LAYER INCLUDED IN THE MULTILAYER STRUCTURE, AND DISPLAY DEVICE UTILIZING THE MULTILAYER STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">B32B27/42</main-classification>  
        <further-classification edition="200601120250401B">B32B27/22</further-classification>  
        <further-classification edition="201901120250401B">B32B7/023</further-classification>  
        <further-classification edition="200601120250401B">G09F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>住華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMIKA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-NIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鴻棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, MING-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁輝鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HUI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐姿漣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種多層結構、一種多層結構包含的PVB層、以及一種應用多層結構的顯示裝置。多層結構包括一黏著層、一聚乙烯醇縮丁醛(polyvinyl butyral；PVB)層以及一光學層。PVB層位於黏著層的第一表面上，光學層位於黏著層的第二表面上。PVB層包括PVB組合物，此PVB組合物包括質量占比為40%~70%的可塑劑，和質量占比為30%~60%的PVB樹脂，且此PVB樹脂的聚乙烯醇(polyvinyl alcohol；PVOH)含量為PVB樹脂質量的5%~10%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a multilayer structure, a PVB layer included in the multilayer structure, and a display device utilizing the multilayer structure. The multilayer structure includes an adhesive layer, a polyvinyl butyral (PVB) layer, and an optical layer. The PVB layer is disposed on the first surface of the adhesive layer, and the optical layer is disposed on the second surface of the adhesive layer. The PVB layer includes a PVB composition, which includes 40% to 70% by mass of plasticizer and 30% to 60% by mass of PVB resin based on the PVB composition. In addition, the PVB resin contains 5% to 10% polyvinyl alcohol (PVOH).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多層結構</p>  
        <p type="p">102:PVB層</p>  
        <p type="p">104:黏著層</p>  
        <p type="p">1041:第一表面</p>  
        <p type="p">1042:第二表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="107" publication-number="202627908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於人工智慧的工程服務業之詢答系統</chinese-title>  
        <english-title>AI-BASED DIALOGUE SYSTEM FOR THE ENGINEERING SERVICE INDUSTRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q10/06</main-classification>  
        <further-classification edition="202001120250303B">G06F40/30</further-classification>  
        <further-classification edition="202301120250303B">G06N5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>匠管股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炳寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘子維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於人工智慧的工程服務業詢答系統，包括資料蒐集模組、資料庫模組、模型訓練/生成模組以及詢答模組。資料蒐集模組負責從施工現場提取原始資料並轉換為結構化資料；資料庫模組儲存標準化資料與結構化資料，並對資料進行標籤化處理；模型訓練/生成模組利用標準化資料與結構化資料進行加權性訓練，生成針對不同工程種類的人工智慧模型；詢答模組基於用戶的提問，選用適當的人工智慧模型進行回答。本發明通過結合各類型的資料，提供適用於工程服務業的針對性強的技術建議。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides an AI-Based Dialogue System for the Engineering Service Industry, comprising a data collection module, a database module, a model training/generation module, and a dialogue module. The data collection module extracts raw data from construction sites and converts it into structured data. The database module stores standardized and structured data while performing labeling processes. The model training/generation module conducts weighted training using standardized and structured data to generate AI models tailored for different types of engineering tasks. The dialogue module selects an appropriate AI model to respond to user queries. By integrating various types of data, this invention delivers highly targeted technical recommendations tailored to the engineering service industry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:工程服務業詢答系統</p>  
        <p type="p">110:資料蒐集模組</p>  
        <p type="p">120:資料庫模組</p>  
        <p type="p">130:模型訓練/生成模組</p>  
        <p type="p">140:詢答模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="108" publication-number="202626171"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626171.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過濾膜、過濾裝置及過濾膜之製造方法</chinese-title>  
        <english-title>FILTRATION MEMBRANE, FILTRATION DEVICE AND MANUFACTURING METHOD OF FILTRATION MEMBRANE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241225B">B01D39/12</main-classification>  
        <further-classification edition="200601120241225B">C09D183/04</further-classification>  
        <further-classification edition="200601120241225B">B05D5/00</further-classification>  
        <further-classification edition="200601120241225B">B05D1/18</further-classification>  
        <further-classification edition="200601120241225B">C23F1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅崇瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, CHUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHUN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許如溱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴宇倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YU-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏紹儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHAW-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種過濾膜、過濾裝置及過濾膜的製造方法。本揭露的過濾膜，其包括：一網狀結構，該網狀結構材質包括不銹鋼，該網狀結構的孔徑為10μm以下，且該網狀結構的表面上具有一微結構；以及一改質層，其包括烷氧基矽烷化合物、鹵素基矽烷化合物、或聚烷基矽氧烷化合物，設置於該網狀結構上，該改質層至少部分不覆蓋該網狀結構的該微結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a filtration membrane, a filtration device and a manufacturing method of filtration membrane. The filter membrane of the present disclosure includes: a mesh structure including stainless steel, the pore size of the mesh structure is less than 10 μm, wherein a surface of the mesh structure has a microstructure; and a modification layer disposed on the mesh structure,the modification layer containing an alkoxysilane compound, a halosilane compound or a polyalkylsiloxane compound disposed on the mesh structure, wherein the modification layer at least partially does not cover the microstructure of the mesh structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="109" publication-number="202628533"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628533.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149189</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱系統</chinese-title>  
        <english-title>HEAT SINK SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K7/20</main-classification>  
        <further-classification edition="200601120250418B">F25B1/00</further-classification>  
        <further-classification edition="202101120250418B">F25B41/20</further-classification>  
        <further-classification edition="200601120250418B">F25B45/00</further-classification>  
        <further-classification edition="200601120250418B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHENGJEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHENGJEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種散熱系統，其中依序包含：第一熱交換板，其一側形成有第一氣流導引槽；主體，包含：第一穿設部、第二穿設部、第三穿設部，與主體界定有穿置空間、以及閥口；第一導流板，其一側係形成有第二氣流導引槽；第二導流板，其一側形成有第三氣流導引槽、另一側形成有第四氣流導引槽；壓縮機，設置於穿置空間中，其中包含：壓縮艙，其內部界定有壓縮空間，且壓縮艙上形成有與壓縮空間相連通的進氣口與出氣口、馬達、轉動桿、以及轉子，其中：第一氣流導引槽、第二氣流導引槽、第三氣流導引槽、第四氣流導引槽、以及壓縮空間相連通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a heat sink system comprising: a first heat exchange plate, wherein a first air flow guide groove is formed on a side of the first heat exchange plate; a main body comprising: a first penetration portion, a second penetration portion, and a third penetration portion, wherein a penetration space and a valve orifice are defined thereof with the main body; a first flow guide plate, wherein a second air flow guide groove is formed on a side of the first flow guide plate; a second flow guide plate, wherein a third air flow guide groove is formed on a side of the second flow guide plate, and a fourth air flow guide groove is formed on another side of the second flow guide plate; a compressor having a compression space therein, wherein an air inlet and an air outlet connecting to the compression space, a motor, a rotating rod, and a rotor are formed on the compressor, wherein the first air flow guide groove, the second air flow guide groove, the third air flow guide groove, the fourth air flow guide groove and the compression space are interconnected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:散熱系統</p>  
        <p type="p">2:第一熱交換板</p>  
        <p type="p">3:第一氣流導引槽</p>  
        <p type="p">4:主體</p>  
        <p type="p">5:第一穿設部</p>  
        <p type="p">6:第二穿設部</p>  
        <p type="p">7:第三穿設部</p>  
        <p type="p">8:穿置空間</p>  
        <p type="p">9:閥口</p>  
        <p type="p">10:第一導流板</p>  
        <p type="p">12:第二導流板</p>  
        <p type="p">14:第四氣流導引槽</p>  
        <p type="p">15:第二熱交換板</p>  
        <p type="p">16:壓縮機</p>  
        <p type="p">17:壓縮艙</p>  
        <p type="p">18:壓縮空間</p>  
        <p type="p">19:進氣口</p>  
        <p type="p">20:出氣口</p>  
        <p type="p">21:馬達</p>  
        <p type="p">22:轉動桿</p>  
        <p type="p">23:轉子</p>  
        <p type="p">24:定子</p>  
        <p type="p">32:鰭片</p>  
        <p type="p">36:第一穿孔</p>  
        <p type="p">37:第二穿孔</p>  
        <p type="p">38:第三穿孔</p>  
        <p type="p">39:第四穿孔</p>  
        <p type="p">41:第六穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="110" publication-number="202627362"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627362.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>除濕機</chinese-title>  
        <english-title>DEHUMIDIFIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250312B">F24F3/14</main-classification>  
        <further-classification edition="200601120250312B">F24F13/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣博世舒適科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴央青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃盈毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂祈曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種除濕機，其包括機殼以及水箱。機殼具有由機殼的其中一側內凹而形成的容置區，容置區包含相互連通的主接收空間以及操作空間。水箱被可分離地收納在機殼內。水箱包括箱體以及握把，握把設置在箱體上。當水箱收納在機殼內時，箱體位於主接收空間內，且操作空間位於所述握把的上方，並露出於機殼外表面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dehumidifier is provided. The dehumidifier includes a housing and a water tank. The housing has a receiving region that is formed at one side of the housing, and the receiving region contains a main receiving space and an operation space that are in spatial communication with each other. The water tank is removably accommodated in the housing. The water tank includes a tank body and a handle, and the handle is disposed on the tank body. When the water tank is accommodated in the housing, the tank body is located in the main receiving space, and the operation space is located above the handle and exposed at an outer surface of the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Z:除濕機</p>  
        <p type="p">R1:收納區</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">1:機殼</p>  
        <p type="p">2:水箱</p>  
        <p type="p">10:容置區</p>  
        <p type="p">11:主接收空間</p>  
        <p type="p">12:操作空間</p>  
        <p type="p">20:箱體</p>  
        <p type="p">22:握把</p>  
        <p type="p">200:外殼</p>  
        <p type="p">200a:第一側壁</p>  
        <p type="p">200b:第二側壁</p>  
        <p type="p">201:樞接架</p>  
        <p type="p">202:遮水板</p>  
        <p type="p">203:蓋板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="111" publication-number="202628227"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628227.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋁空氣電池遙控動力船</chinese-title>  
        <english-title>REMOTE-CONTROLLED POWERED BOAT EQUIPPED WITH ALUMINUM-AIR BATTERY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">H01M12/06</main-classification>  
        <further-classification edition="200601120241231B">H01M4/90</further-classification>  
        <further-classification edition="200601120241231B">H01M4/46</further-classification>  
        <further-classification edition="201601120241231B">H01M8/1016</further-classification>  
        <further-classification edition="200601120241231B">B63H21/17</further-classification>  
        <further-classification edition="200601120241231B">B63B3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY, TAIPEI TECH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏端</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN,PO TUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江祐安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG,YU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鋁空氣電池遙控動力船，其包括船體、動力傳輸系統、鋁空氣電池模組和控制系統。動力傳輸系統設置於船體，以驅動船體移動，鋁空氣電池模組設置於船體並電性連接動力傳輸系統，以輸出電力供給動力傳輸系統，控制系統設置於船體並電性連接鋁空氣電池模組和動力傳輸系統，以控制鋁空氣電池模組和動力傳輸系統進行運作。本發明將鋁空氣電池整合至遙控動力船上，具有極高的安全性，且在運行過程中不會產生有害物質，環境無污染，並可利用鋁金屬的再生特性，實現接近完全的可再生能源利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鋁空氣電池遙控動力船</p>  
        <p type="p">10:船體</p>  
        <p type="p">20:動力傳輸系統</p>  
        <p type="p">30:鋁空氣電池模組</p>  
        <p type="p">31:鋁空氣電池</p>  
        <p type="p">40:控制系統</p>  
        <p type="p">50:無線遙控器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="112" publication-number="202627857"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627857.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149196</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於對電晶體特性進行建模的系統及方法</chinese-title>  
        <english-title>A SYSTEM AND METHOD FOR MODELING CHARACTERISTICS OF A TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250528B">G06F30/20</main-classification>  
        <further-classification edition="202001120250528B">G06F30/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>即思創意股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAST SIC SEMICONDUCTOR INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許甫任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏誠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHENG-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於對電晶體特性進行建模的系統及方法，使用以下方程式執行電晶體的一組電壓電流值的擬合： &lt;br/&gt;&lt;img align="absmiddle" height="78px" width="347px" file="ed10081.JPG" alt="ed10081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="61px" width="58px" file="ed10082.JPG" alt="ed10082.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;表示通過該電晶體的電流， &lt;img align="absmiddle" height="46px" width="47px" file="ed10083.JPG" alt="ed10083.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;表示該電晶體上的一施加電壓， &lt;img align="absmiddle" height="37px" width="39px" file="ed10084.JPG" alt="ed10084.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、 &lt;img align="absmiddle" height="32px" width="30px" file="ed10085.JPG" alt="ed10085.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;及 &lt;img align="absmiddle" height="25px" width="24px" file="ed10086.JPG" alt="ed10086.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;為電路相關係數， &lt;img align="absmiddle" height="37px" width="40px" file="ed10087.JPG" alt="ed10087.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;為與該施加電壓相關的一函數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for modeling characteristics of a transistor uses the following equation to perform a fitting of a set of I-V values of the transistor: &lt;br/&gt;&lt;img align="absmiddle" height="81px" width="345px" file="ed10088.JPG" alt="ed10088.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="61px" width="58px" file="ed10082.JPG" alt="ed10082.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;is a current through the transistor, &lt;img align="absmiddle" height="46px" width="47px" file="ed10083.JPG" alt="ed10083.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;is an applied voltage of the transistor, &lt;img align="absmiddle" height="37px" width="39px" file="ed10084.JPG" alt="ed10084.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;img align="absmiddle" height="32px" width="30px" file="ed10085.JPG" alt="ed10085.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;and &lt;img align="absmiddle" height="25px" width="24px" file="ed10086.JPG" alt="ed10086.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;are circuit-dependent coefficients, and &lt;img align="absmiddle" height="37px" width="40px" file="ed10087.JPG" alt="ed10087.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;is a function related to the applied voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電路</p>  
        <p type="p">11:第一電容器</p>  
        <p type="p">12:第二電容器</p>  
        <p type="p">13:第三電容器</p>  
        <p type="p">14:第一電流源</p>  
        <p type="p">15:第二電流源</p>  
        <p type="p">16:內接二極體</p>  
        <p type="p">17a:閘極供電端子</p>  
        <p type="p">17b:汲極供電端子</p>  
        <p type="p">17c:源極供電端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="113" publication-number="202627649"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627649.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁式快門裝置</chinese-title>  
        <english-title>ELECTROMAGNETIC SHUTTER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250312B">G03B9/08</main-classification>  
        <further-classification edition="202101120250312B">G03B30/00</further-classification>  
        <further-classification edition="200601120250312B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯柄瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, BINQ-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電磁式快門裝置，包括有殼體、至少一磁鐵、電磁鐵模組及快門。殼體，具有凹槽；至少一磁鐵，設置於凹槽；電磁鐵模組，設置於凹槽並抵靠於磁鐵之一端，更包括有鐵芯及線圈：鐵芯，設置於凹槽；線圈，設置並圍繞於鐵芯；以及快門，設置並覆蓋於電磁鐵模組。當電磁鐵模接受電流並流通電磁鐵模組，使電磁鐵模組與磁鐵之一端產生磁性相吸並抵靠，藉此使快門以開啟或關閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses an electromagnetic shutter device, which includes a housing, at least one magnet, an electromagnet module, and a shutter. The housing is equipped with a groove; at least one magnet is positioned within the groove; the electromagnet module is also installed within the groove and abuts one end of the magnet. The electromagnet module further comprises a core and a coil: the core is placed within the groove, and the coil is installed and wound around the core. The shutter is arranged to cover the electromagnet module. When the electromagnet module receives current and allows it to flow through the electromagnet module, one end of the electromagnet module generates magnetic attraction with a magnet, causing them to press against &lt;br/&gt;each other. This enables the shutter to open or close.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電磁式快門裝置</p>  
        <p type="p">10:殼體</p>  
        <p type="p">20:磁鐵</p>  
        <p type="p">30:電磁鐵模組</p>  
        <p type="p">40:快門</p>  
        <p type="p">50:電路板</p>  
        <p type="p">60:感測元件</p>  
        <p type="p">70:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="114" publication-number="202628518"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628518.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>屏蔽蓋結構</chinese-title>  
        <english-title>SHIELDING LID STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250312B">H05K5/03</main-classification>  
        <further-classification edition="200601120250312B">H05K9/00</further-classification>  
        <further-classification edition="200601120250312B">H05K7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯柄瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, BINQ-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種屏蔽蓋結構，設置於電路板並覆蓋至少一電子元件，包括殼體，設置電路板的上表面；框體，連接殼體，包括第一側壁、第二側壁、第三側壁及第四側壁，並第一側壁向電路板的下表面延伸而有延長部，且延長部具有至少一安裝部，第二側壁、第三側壁及第四側壁抵靠於上表面；以及至少一轉軸，設置於框體的安裝部，該殼體根據該些轉軸沿軸向進行旋轉，藉此， 以安裝或拆卸在電路板上的屏蔽蓋結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention discloses a shielding lid structure installed on a circuit board and covering at least one electronic component, including a housing positioned on the upper surface of the circuit board, a frame connected to the housing and comprising a first side wall, a second side wall, a third side wall, and a fourth side wall, wherein the first side wall extends downward to the lower surface of the circuit board to form an extension portion, the extension portion having at least one mounting portion, and the second, third, and fourth side walls being in contact with the upper surface, and at least one pivot located at the mounting portion of the frame, allowing the housing to rotate &lt;br/&gt;&lt;br/&gt;axially around the pivot for installation or removal of the shielding lid structure from the circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:屏蔽蓋結構</p>  
        <p type="p">10:殼體</p>  
        <p type="p">20:框體</p>  
        <p type="p">30:轉軸</p>  
        <p type="p">40:電路板</p>  
        <p type="p">50:上表面</p>  
        <p type="p">60:容置空間</p>  
        <p type="p">70:電子元件</p>  
        <p type="p">80:第一側壁</p>  
        <p type="p">100:第三側壁</p>  
        <p type="p">120:下表面</p>  
        <p type="p">130:延長部</p>  
        <p type="p">140:安裝部</p>  
        <p type="p">150:固定夾</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="115" publication-number="202626001"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626001.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>指尖訓練裝置及訓練方法</chinese-title>  
        <english-title>A FINGERTIP TRAINING DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">A61H39/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施　金波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEE, AARON RAYMOND ANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余奕賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種指尖訓練裝置及訓練方法，包括：基座，具有上表面，形成有可分別放置人體手指之複數置放槽，用以供使用者放置手指，以及置放部，用以供使用者放置手掌；刺激模組，係設於基座，刺激模組設有複數刺激塊體以及控制組件，控制組件係分別與各刺激塊體電性連接；以及電子裝置，資訊連接基座，具有顯示單元，用以顯示各刺激塊體之運作圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fingertip training device and method comprise a base with an upper surface， which is formed with multiple placement grooves for individually positioning human fingers， and a placement section for the user to rest their palm. A stimulation module is installed on the base， including multiple stimulation blocks and a control component， where the control component is electrically connected to each stimulation block. An electronic device is communicatively connected to the base and features a display unit designed to show operational images of each stimulation block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基座</p>  
        <p type="p">111:置放槽</p>  
        <p type="p">112:置放部</p>  
        <p type="p">12:刺激模組</p>  
        <p type="p">2:電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="116" publication-number="202626984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱形眼鏡保存溶液和隱形眼鏡的製作方法</chinese-title>  
        <english-title>CONTACT LENS PACKAGING SOLUTION AND METHOD FOR MANUFACTURING CONTACT LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C09D129/04</main-classification>  
        <further-classification edition="200601120250402B">C09D139/06</further-classification>  
        <further-classification edition="200601120250402B">A61L12/08</further-classification>  
        <further-classification edition="201501120250402B">G02B1/10</further-classification>  
        <further-classification edition="200601120250402B">G02C7/04</further-classification>  
        <further-classification edition="200601120250402B">G02C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望隼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIZIONFOCUS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許偉航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游主依</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭堯聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YAO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許惠雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種隱形眼鏡保存溶液，適於讓鏡片核心本體浸泡，並於鏡片核心本體浸泡於隱形眼鏡保存溶液時進行滅菌步驟，隱形眼鏡保存溶液包含第一聚合物與第二聚合物，第一聚合物包括聚乙烯醇，第二聚合物包括聚乙烯吡咯烷酮。本發明另提供一種隱形眼鏡的製作方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a contact lens packaging solution, suitable for soaking a core lens body, and performing a sterilization step when the core lens body is soaked in the contact lens packaging solution. The contact lens packaging solution includes a first polymer and a second polymer. The first polymer includes polyvinyl alcohol, and the second polymer includes polyvinyl pyrrolidone. The present invention also provides a method for manufacturing contact lenses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:隱形眼鏡</p>  
        <p type="p">110:鏡片核心本體</p>  
        <p type="p">120:外殼層</p>  
        <p type="p">200:隱形眼鏡保存溶液</p>  
        <p type="p">300:隱形眼鏡包裝</p>  
        <p type="p">310:鋁箔</p>  
        <p type="p">320:容器</p>  
        <p type="p">A:圓圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="117" publication-number="202626334"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626334.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149206</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱形眼鏡的製作方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING CONTACT LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">B29C71/00</main-classification>  
        <further-classification edition="200601120250402B">B29D11/00</further-classification>  
        <further-classification edition="200601120250402B">G02C7/04</further-classification>  
        <further-classification edition="200601320250402B">B29L11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望隼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIZIONFOCUS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許偉航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游主依</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭堯聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YAO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許惠雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種隱形眼鏡的製作方法，包括：提供鏡片乾片；將鏡片乾片進行水化製程，得到鏡片濕片；將鏡片濕片進行滅菌製程，得到隱形眼鏡。將第一聚合物應用於水化製程和滅菌製程之至少其中之一，將第二聚合物應用於水化製程和滅菌製程之至少其中之一，使隱形眼鏡包括外殼層，外殼層包括第一聚合物與第二聚合物；第一聚合物包括聚乙烯醇，第二聚合物包括聚乙烯吡咯烷酮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for manufacturing contact lens, and the method includes: providing a dry lens; subjecting the dry lens to a hydration process to obtain a wet lens; and subjecting the wet lens to a sterilization process to obtain a contact lens. A first polymer is applied to at least one of the hydration process and the sterilization process, and a second polymer is applied to at least one of the hydration process and the sterilization process, so the contact lens includes a shell layer. The shell layer includes the first polymer and the second polymer. The first polymer includes polyvinyl alcohol, and the second polymer includes polyvinyl pyrrolidone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="118" publication-number="202628935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149207</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>漏液監測系統及具有漏液監測的半導體濕式製程設備</chinese-title>  
        <english-title>LEAK DETECTION SYSTEM AND SEMICONDUCTOR WET PROCESS EQUIPMENT WITH LEAK DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P74/00</main-classification>  
        <further-classification edition="202201120260401B">G06V10/82</further-classification>  
        <further-classification edition="202201120260401B">G06V20/52</further-classification>  
        <further-classification edition="202601120260401B">H10P72/00</further-classification>  
        <further-classification edition="202601120260401B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曠信科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳念修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, NIAN-SIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有漏液監測的半導體濕式製程設備，其包含一配液模組、一伺服模組、一高速攝影機以及一作業終端裝置，該高速攝影機即時地拍攝該配液模組之供應調配流程，形成一操作影像上傳至該伺服模組儲存；該伺服模組透過人工智慧物件辨識演算法即時分析該配液模組中的一流量感測數據與該操作影像，形成一監測結果即時地予該作業終端裝置，其得以達成異常即時偵測並具備高準確性之效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor wet process equipment with leak detection includes a dispensing module, a servo module, a high-speed camera, and an operational terminal. The high-speed camera captures real-time images of the dispensing module’s supply and mixing process, generating an operational image that is uploaded to the servo module for storage. The servo module, using an AI-based object recognition algorithm, analyzes flow sensor data and the operational image from the dispensing module in real-time, producing a monitoring result that is instantly relayed to the operational terminal, enabling highly accurate and immediate anomaly detection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:配液模組</p>  
        <p type="p">11:輸送管道</p>  
        <p type="p">12:分配噴嘴</p>  
        <p type="p">121:流量感測器</p>  
        <p type="p">122:滴定閥門</p>  
        <p type="p">20:伺服模組</p>  
        <p type="p">21:資料庫</p>  
        <p type="p">211:高速存取單元</p>  
        <p type="p">22:運算單元</p>  
        <p type="p">30:高速攝影機</p>  
        <p type="p">40:作業終端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="119" publication-number="202625940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149211</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通用式組合架</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">A47F5/10</main-classification>  
        <further-classification edition="200601120250228B">A47B47/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉華婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉承鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉國煇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉華婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉承鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉國煇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種通用式組合架，包含有複數個接頭、框架單元、層板座及定位件，各接頭設有本體以及自本體的端面延伸的複數個插接結構，框架單元包含複數個支撐管，各支撐管能供接頭的插接結構插入而結合，其中，部分支撐管為擠型管，擠型管沿著高度方向設置，且設有滑軌，各層板座設有滑塊及支撐座部，滑塊設於滑軌內，且能沿著高度方向滑移，各定位件能螺合並穿置滑塊、抵靠於滑軌，藉此，能調整層板的高度，透過層板形成具有多種變化的空間來放置物品，再搭配接頭、框架單元的連續拼接，本發明能夠組合出不同尺寸的家具或是展示架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:接頭</p>  
        <p type="p">20A:橫樑</p>  
        <p type="p">20B,20B1:擠型管</p>  
        <p type="p">200:插口</p>  
        <p type="p">21:外板槽</p>  
        <p type="p">22:滑軌</p>  
        <p type="p">30:層板座</p>  
        <p type="p">92A:木製層板</p>  
        <p type="p">92B:玻璃層板</p>  
        <p type="p">H:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="120" publication-number="202628343"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628343.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安全走道發電結構</chinese-title>  
        <english-title>SAFE WALKWAY POWER GENERATION STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250317B">H02S20/22</main-classification>  
        <further-classification edition="201401120250317B">H02S20/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向陽農業生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNNY RICH AGRIC.&amp; BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳貴光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUEI-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張以彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種安全走道發電結構，該安全走道固設於建築物可受光懸空位置，具一底板、至少一太陽能板、一控制裝置，該底板具一內側部、一外側部，該內側部與該建築物固接，並使該底板約對應地面水平設置；又該太陽能板可樞轉的設於該底板之外側部；又該控制裝置與該太陽能板接合，並可控制該太陽能板對應該底板垂直或傾斜角度；藉此本發明可提供安全走道兼具安全及較佳發電效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a safe walkway power generation structure. The safe walkway is fixedly installed at a light-receiving, suspended position of a building and includes a base plate, at least one solar panel, and a control device. The base plate has an inner section and an outer section, with the inner section fixedly connected to the building, ensuring the base plate is approximately level with the ground. The solar panel is pivotably mounted on the outer section of the base plate, while the control device is connected to the solar panel, enabling the adjustment of the solar panel's angle to be either perpendicular or inclined relative to the base plate. The present invention provides a safe walkway that ensures safety while achieving improved power generation efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:安全走道</p>  
        <p type="p">2:底板</p>  
        <p type="p">21:內側部</p>  
        <p type="p">22:外側部</p>  
        <p type="p">23:頂面</p>  
        <p type="p">3:太陽能板</p>  
        <p type="p">31:第一受光面</p>  
        <p type="p">32:第二受光面</p>  
        <p type="p">33:第一樞接部</p>  
        <p type="p">34:第二樞接部</p>  
        <p type="p">4:控制裝置</p>  
        <p type="p">41:伸縮桿</p>  
        <p type="p">411:第一端部</p>  
        <p type="p">412:第二端部</p>  
        <p type="p">42:控制器</p>  
        <p type="p">5:建築物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="121" publication-number="202627930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能定向匯集潛在客戶系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250303B">G06Q30/0201</further-classification>  
        <further-classification edition="202301120250303B">G06Q30/0241</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉元琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智能定向匯集潛在客戶系統，至少包含一智能關鍵字優化模組、一多平台數據採集模組、一數據清洗與標準化模組、一潛在客戶識別與分類模組、一自動化數據分析與報告生成模組及一即時通知與跟進模組，可將使用者輸入的關鍵字進行優化與擴展，且實時獲取多個平台的數據，將該數據進行篩選清洗與標準化處理形成可靠數據，依該可靠數據分析識別出複數潛在客戶，並深入分析生成定製化報告，更實時跟進該潛在客戶的行為變化，以調整各潛在客戶的分類，讓廣告業者或商家可依該等潛在客戶的分類精準投放廣告，並可依該定製化報告調整廣告內容，藉此達到定向匯集潛在客戶，精準投放廣告提高網路行銷效益之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:智能關鍵字優化模組</p>  
        <p type="p">11:自然語言處理單元</p>  
        <p type="p">12:第一機器學習單元</p>  
        <p type="p">20:多平台數據採集模組</p>  
        <p type="p">21:網頁抓取單元</p>  
        <p type="p">22:應用程式介面接口</p>  
        <p type="p">30:數據清洗與標準化模組</p>  
        <p type="p">31:大數據單元</p>  
        <p type="p">40:潛在客戶識別與分類模組</p>  
        <p type="p">41:第二機器學習單元</p>  
        <p type="p">50:自動化數據分析與報告生成模組</p>  
        <p type="p">51:數據分析工具</p>  
        <p type="p">60:即時通知與跟進模組</p>  
        <p type="p">61:自動化跟進工具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="122" publication-number="202627669"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627669.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光罩清洗方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241227B">G03F1/84</main-classification>  
        <further-classification edition="202401120241227B">B08B1/14</further-classification>  
        <further-classification edition="200601120241227B">B08B3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>積凱科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁志誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐慶吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種光罩清洗方法，其包含一準備步驟，提供一水刀、一無塵布及待清洗的一光罩，無塵布設置於水刀上，光罩位於無塵布的第一橫向側邊且與無塵布保持距離；一第一清洗步驟，光罩縱向移動，使得光罩的一側面與無塵布的表面位於同一平面上；一第二清洗步驟，光罩橫向移動至無塵布的第二橫向側邊；一第三清洗步驟，光罩縱向移動，使得光罩遠離無塵布；一第四清洗步驟，光罩橫向移動至無塵布的第一橫向側邊，重複第一清洗步驟至第四清洗步驟數次；第五清洗步驟，光罩橫向移動至無塵布的第一橫向側邊，使得無塵布完成對光罩的側面的最後一次擦拭動作；藉此可使無塵布上所沾附之髒污平均分配於左右二端以提高清潔的能力且增進無塵布的使用壽命，而光罩藉由縱向之移動後再橫向移動可避免髒污回沾於光罩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P1:準備步驟</p>  
        <p type="p">S1:第一清洗步驟</p>  
        <p type="p">S2:第二清洗步驟</p>  
        <p type="p">S3:第三清洗步驟</p>  
        <p type="p">S4:第四清洗步驟</p>  
        <p type="p">S5:第五清洗步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="123" publication-number="202626160"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626160.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能(AI)人機互動複合裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250228B">A63F13/20</main-classification>  
        <further-classification edition="201401120250228B">A63F13/212</further-classification>  
        <further-classification edition="200601120250228B">G06F3/01</further-classification>  
        <further-classification edition="201301120250228B">G06F3/048</further-classification>  
        <further-classification edition="201401120250228B">A63F13/00</further-classification>  
        <further-classification edition="200601120250228B">A63B24/00</further-classification>  
        <further-classification edition="200601120250228B">A63B71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬思正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎煥斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智能(AI)人機互動複合裝置，其以一動感平台組合在一XYθ軸移動平台上，並結合一智能頭盔、一VR (虛擬實境)眼鏡，所構成的4D沉浸式互動遊戲車，具有讓使用者在動態化的虛擬實境環境，獲得更好地操作體驗，增加了遊戲玩家個性化狀態對遊戲角色的影響，使遊戲角色變得生動鮮活和與眾不同，讓遊戲玩家獲得更深入的沉浸式體驗，增強遊戲的虛擬實境感、趣味性和娛樂性。此外VR 眼鏡可自動偵別確認身份，防止課金，帳號，線上寶物等被盜，訂個自動套用AI客製化人物角色扮演，可調整以4D沉浸式互動遊戲車連動速度角度防暈，並提醒使用人防沉迷遊戲無法自拔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:動感平台</p>  
        <p type="p">11:座椅</p>  
        <p type="p">12:支撐架</p>  
        <p type="p">121:照明燈</p>  
        <p type="p">13:大腿部構件</p>  
        <p type="p">14:小腿部構件</p>  
        <p type="p">141:連接裝置</p>  
        <p type="p">17:樞軸</p>  
        <p type="p">22:雷達感側器</p>  
        <p type="p">30:遙桿</p>  
        <p type="p">31:方向盤</p>  
        <p type="p">40:XYθ軸移動平台</p>  
        <p type="p">50:智能頭盔</p>  
        <p type="p">60:VR(虛擬實境)眼鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="124" publication-number="202626150"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626150.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調節滑軌式臥推椅</chinese-title>  
        <english-title>ADJUSTABLE SLIDING RAIL TYPE WEIGHT TRAINING BENCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">A63B23/00</main-classification>  
        <further-classification edition="200601120250418B">A63B23/02</further-classification>  
        <further-classification edition="200601120250418B">A63B23/035</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豐壬國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VONRANG INTERNATIONAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳濬亦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉祖維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WAYNE TSU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉珏安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JUE-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調節滑軌式臥推椅，包含：一支撐基座；一坐墊構件，樞接在該支撐基座前側；一背靠構件，樞接在該支撐基座後側；一坐墊角度定位機構，連接在該坐墊構件與該支撐基座之間，且與該坐墊構件相互連動，使該坐墊構件以一坐墊擺設角度而定位；一背靠角度定位機構，連接在該背靠構件與該支撐基座之間，且與該背靠構件相互連動，使該背靠構件以一背靠擺設角度而定位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is an adjustable sliding rail type weight training bench, comprising: a supporting base; a seat assembly pivotally connected to a front side of the supporting base; a backrest assembly pivotally connected to a rear side of the supporting base; a seat angle positioning means connected between the seat assembly and the supporting base and operably linked to the seat assembly to position the seat assembly at a seat arrangement angle; and a backrest angle positioning means connected between the backrest assembly and the supporting base and operably linked to the backrest assembly to position the backrest assembly at a backrest arrangement angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可調節滑軌式臥推椅</p>  
        <p type="p">1:支撐基座</p>  
        <p type="p">11:樞接台</p>  
        <p type="p">12:前斜柱桿</p>  
        <p type="p">121:坐墊調節定位孔</p>  
        <p type="p">13:後斜柱桿</p>  
        <p type="p">131:背靠調節定位孔</p>  
        <p type="p">14:站立裝置</p>  
        <p type="p">141:橫向支撐桿</p>  
        <p type="p">142:縱向支撐桿</p>  
        <p type="p">143:滑輪機構</p>  
        <p type="p">15:搬運用握把</p>  
        <p type="p">2:坐墊構件</p>  
        <p type="p">21:坐墊部</p>  
        <p type="p">3:背靠構件</p>  
        <p type="p">31:背靠部</p>  
        <p type="p">4:坐墊角度定位機構</p>  
        <p type="p">41:前斜滑軌</p>  
        <p type="p">42:前滑移套管</p>  
        <p type="p">43:前滑塊</p>  
        <p type="p">44:前連桿</p>  
        <p type="p">45:前定位件</p>  
        <p type="p">5:背靠角度定位機構</p>  
        <p type="p">51:後斜滑軌</p>  
        <p type="p">52:後滑移套管</p>  
        <p type="p">53:後滑塊</p>  
        <p type="p">54:後連桿</p>  
        <p type="p">55:後定位件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="125" publication-number="202628283"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628283.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高速纜線組件</chinese-title>  
        <english-title>HIGH-SPEED CABLE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">H01R13/66</main-classification>  
        <further-classification edition="200601120250324B">H01R13/46</further-classification>  
        <further-classification edition="200601120250324B">H01R11/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏致電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACES ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩那提　歐米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANATI, OMID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾頓　米克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FELTON, MICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡書慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳嘉敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種高速纜線組件，其具有一端子板及一扁平高速纜線組件穿設於殼體中，端子板具有多個用以接地的第一接墊及多個用以傳遞訊號的第二接墊組，扁平高速纜線組件的導線組分別電連接於第二導線組，導線組的金屬傳輸線包含有彎折部與焊接部，接地遮蔽單元設於端子板上，其分隔板連接於第一接墊以接地，分隔板之間的容槽覆蓋金屬傳輸線的暴露部分，容槽較窄的第一區域覆蓋焊接部，而容槽較寬的第二區域覆蓋彎折部，藉此降低來自外部的輻射雜訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a high-speed cable assembly having a paddle card and an FFC assembly inserted into a shell. The paddle card has multiple first type pads for ground and multiple second type pad sets for signal. The wire sets on the FFC assembly respectively connecting to the second type pad sets. The metal transmission wire of each wire set includes a bending part and a soldered part. A ground shield is mounted on the paddle card. The partitions of the ground shield respectively connect to the first type pads of the paddle card to allow the ground shield being grounded through the first type pads. The grooves between the partitions respectively cover the exposed part of each metal transmission wire. A narrower first part of each groove covers the soldered part, while a wider second part of the groove covers the bending part to efficiently decrease the radiating noise originating outside.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:端子板</p>  
        <p type="p">21:基板</p>  
        <p type="p">211:第一表面</p>  
        <p type="p">212:第二表面</p>  
        <p type="p">231:第二接墊</p>  
        <p type="p">312:彎折部</p>  
        <p type="p">313:焊接部</p>  
        <p type="p">40:接地遮蔽單元</p>  
        <p type="p">41:基座</p>  
        <p type="p">43:容槽</p>  
        <p type="p">430:壁面</p>  
        <p type="p">431:第一開口</p>  
        <p type="p">432:第一區域</p>  
        <p type="p">433:第二區域</p>  
        <p type="p">434:第二開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="126" publication-number="202628376"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628376.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>收發機裝置</chinese-title>  
        <english-title>TRANSCEIVER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250303B">H04B1/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秉軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王柏之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種收發機裝置包含一發射電路以及一接收電路。發射電路用以耦接一天線且包含一第一混頻器以及一第一緩衝電路。第一混頻器用以依據一第一基頻訊號以及一第一本地震盪訊號輸出一第一射頻訊號。第一緩衝電路用以輸出第一本地震盪訊號至第一混頻器且包含複數第一緩衝器。接收電路用以耦接天線。第一緩衝電路的一第一緩衝器並聯數量依據一運作條件被調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transceiver device includes a transmitter circuit and a receiver circuit. The transmitter circuit is configured to couple an antenna and includes a first mixer and a first buffer circuit. The first mixer is configured to output a first radio frequency signal according to a first baseband signal and a first local oscillator signal. The first buffer circuit is configured to output the first local oscillator signal to the first mixer and includes a plurality of first buffers. The receiver circuit is configured to couple the antenna. A first quantity of buffers coupled in parallel in the first buffer circuit is adjusted according to an operation condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200A:緩衝電路</p>  
        <p type="p">BF[1]-BF[N]:緩衝器</p>  
        <p type="p">IN:輸入端</p>  
        <p type="p">OUT:輸出端</p>  
        <p type="p">T1,T2:電晶體</p>  
        <p type="p">CT1:控制電晶體</p>  
        <p type="p">VD:電源端</p>  
        <p type="p">GND:地端</p>  
        <p type="p">EN1:控制訊號</p>  
        <p type="p">S3,S4:訊號</p>  
        <p type="p">LO1,LO2:本地震盪訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="127" publication-number="202627920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>郵件伺服器與加解密郵件附件的處理方法</chinese-title>  
        <english-title>MAIL SERVER AND THE PROCESSING METHOD FOR DECRYPTED EMAIL ATTACHMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q10/107</main-classification>  
        <further-classification edition="202201120250303B">H04L51/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周逸修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHOU, YI-SIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種郵件伺服器與加解密郵件附件的處理方法，郵件伺服器可以應用於發信端發送具有加密附件的第一郵件的解密處理。加解密郵件附件的處理方法包括由郵件伺服器接收第一郵件；郵件伺服器讀取第一郵件的目標收信端；郵件伺服器判斷目標收信端的解密能力與解密權限；若目標收信端符合解密權限且無解密能力，郵件伺服器解密加密附件並獲取原始文件；郵件伺服器根據第一郵件與原始文件產生第二郵件；郵件伺服器發送第二郵件至目標收信端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mail server and the processing method for decrypted email attachment is provide. The processing method comprises the steps. An email server reads a target recipient of the first email. The email server determines the decryption capabilities and permissions of the target recipient. If the target recipient has the necessary permissions but lacks decryption capabilities, the email server decrypts the encrypted attachment and obtains the original file. The email server generates a second email based on the first email and the original file. Finally, the email server sends the second email to the target recipient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:郵件伺服器</p>  
        <p type="p">200:客戶端</p>  
        <p type="p">210:發信端</p>  
        <p type="p">221:目標收信端</p>  
        <p type="p">222:預設收信端</p>  
        <p type="p">310:第一郵件</p>  
        <p type="p">320:第二郵件</p>  
        <p type="p">410:加密附件</p>  
        <p type="p">420:原始文件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="128" publication-number="202627253"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627253.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>羥基氟化鋅奈米結構、其製備方法及還原二氧化碳的方法</chinese-title>  
        <english-title>ZINC HYDROXY FLUORIDE NANOSTRUCTURE, PREPARATION METHOD THEREOF, AND METHOD FOR REDUCING CARBON DIOXIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250804B">D03D15/40</main-classification>  
        <further-classification edition="201101120250804B">B82Y40/00</further-classification>  
        <further-classification edition="200601120250804B">B01J23/06</further-classification>  
        <further-classification edition="200601120250804B">C01G9/02</further-classification>  
        <further-classification edition="200601120250804B">C01G9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TA-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳心樵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIN-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種羥基氟化鋅奈米結構、其製備方法及一種藉由羥基氟化鋅奈米結構還原二氧化碳的方法。羥基氟化鋅奈米結構包括複數條羥基氟化鋅奈米線，其中羥基氟化鋅奈米線的線徑為5 nm至100 nm，羥基氟化鋅奈米線中的鋅與氟的莫耳比為5~7：4。製備方法包括以下操作。混合氟化鋅、還原劑及溶劑，以得到反應溶液，其中氟化鋅與還原劑的莫耳比為1：1~4。加熱反應溶液至40℃至90℃，使氟化鋅與還原劑反應形成羥基氟化鋅奈米線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a zinc hydroxy fluoride nanostructure, a preparation method thereof, and a method for reducing carbon dioxide by the zinc hydroxy fluoride nanostructure. The zinc hydroxy fluoride nanostructure includes a plurality of zinc hydroxy fluoride nanowires, in which the wire diameter of the zinc hydroxy fluoride nanowires is 5 nm to 100 nm, and the zinc and fluorine in the zinc hydroxy fluoride nanowires have a molar ratio of 5-7:4. The preparation method includes the following operations. Zinc fluoride, a reducing agent, and a solvent are mixed to obtain a reaction solution, in which the zinc fluoride and the reducing agent have a molar ratio of 1:1-4. The reaction solution is heated to 40 °C to 90 °C to react the zinc fluoride with the reducing agent to form the zinc hydroxy fluoride nanowires.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510、520、530、540:數據點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="129" publication-number="202627937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分銷拆潤式電子商務行銷系統及實施方法</chinese-title>  
        <english-title>PROOFIT-SHARING DISTRIBUTION E-COMMERCE MARKETING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250509B">G06Q30/0207</main-classification>  
        <further-classification edition="202301120250509B">G06Q30/0214</further-classification>  
        <further-classification edition="202301120250509B">G06Q30/0217</further-classification>  
        <further-classification edition="202301120250509B">G06Q30/0601</further-classification>  
        <further-classification edition="202301120250509B">G06Q40/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃照峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種分銷拆潤式電子商務行銷系統及實施方法，應用於電子商務行銷流程中，其係針對當有數個不同的推薦方，在不同時間點推薦商品給同一被推薦方時，系統可依據推薦的前後順序，應用不同的利潤分配參數，計算出數筆的利潤分配金額，並使各筆利潤分配金額可分別被歸戶到各推薦方，其主要係由一帳戶識別單元對一推薦連結進行帳戶資訊識別，再由系統中的一分潤精算模組的一計算單元，依據各利潤分配參數進行計算後，將各利潤分配金額歸戶到各推薦方，以達到鼓勵行銷的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分銷拆潤式電子商務行銷系統</p>  
        <p type="p">11:中央處理器</p>  
        <p type="p">12:推薦連結產生模組</p>  
        <p type="p">13:歸戶模組</p>  
        <p type="p">14:分潤精算模組</p>  
        <p type="p">131:帳戶識別單元</p>  
        <p type="p">141:計算單元</p>  
        <p type="p">142:利潤分配參數</p>  
        <p type="p">15:會員資料庫</p>  
        <p type="p">16:商品資料庫</p>  
        <p type="p">151:會員資料帳戶</p>  
        <p type="p">161:商品資料</p>  
        <p type="p">2:第一使用者端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="130" publication-number="202627026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨漿料組成物及晶圓研磨方法</chinese-title>  
        <english-title>POLISHING SLURRY COMPOSITION AND WAFER POLISHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K3/14</main-classification>  
        <further-classification edition="201201120260401B">B24B37/00</further-classification>  
        <further-classification edition="200601120260401B">C09G1/02</further-classification>  
        <further-classification edition="202601120260401B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江培瑀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種研磨漿料組成物及晶圓研磨方法。所述研磨漿料組成物包含無機粒子、一水溶性高分子、一界面活性劑、一含氮雜環化合物及水。所述水溶性高分子的數均分子量40,000至60,000之間。所述含氮雜環化合物的酸解離常數（pKa）是介於7.5至10.5之間。所述無機粒子的含量介於45 重量份至55 重量份之間，所述水溶性高分子的含量介於0.1 重量份至5 重量份之間，所述界面活性劑的含量介於0.1 重量份至5 重量份之間，所述含氮雜環化合物的含量介於1 重量份至10 重量份之間，並且水的含量介於40 重量份至50 重量份之間。所述研磨漿料組成物的pH值介於10至12之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polishing slurry composition and wafer polishing method are provided. The polishing slurry composition includes inorganic particles, a water soluble polymer, a surfactant, a nitrogen-containing heterocyclic compound, and water. A number average molecular weight of the water soluble polymer is between 40,000 and 60,000. An acid dissociation constant (pKa) of the nitrogen-containing heterocyclic compound is between 7.5 and 10.5. A content of the inorganic particles is between 45 parts by weight and 55 parts by weight, a content of the water soluble polymer is between 0.1 parts by weight and 5 parts by weight, a content of the surfactant is between 0.1 parts by weight and 5 parts by weight, a content of the nitrogen-containing heterocyclic compound is between 1 part by weight and 10 parts by weight, and a content of water is between 40 parts by weight and 50 parts by weight. A pH value of the polishing slurry composition is between 10 and 12.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:準備步驟</p>  
        <p type="p">S120:研磨步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="131" publication-number="202626828"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626828.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性透溼防水材料的製作方法及水性透溼防水樹脂</chinese-title>  
        <english-title>METHOD FOR PRODUCING BREATHING WATERPROOFING AQUEOUS MATERIAL AND WATERPROOFING AQUEOUS RESIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">C08G18/32</main-classification>  
        <further-classification edition="200601120250602B">C08G18/48</further-classification>  
        <further-classification edition="200601120250602B">C08G18/66</further-classification>  
        <further-classification edition="200601120250602B">C08G18/75</further-classification>  
        <further-classification edition="200601120250602B">C08L75/08</further-classification>  
        <further-classification edition="200601120250602B">C08K3/34</further-classification>  
        <further-classification edition="200601120250602B">C09D175/08</further-classification>  
        <further-classification edition="201801120250602B">C09D7/61</further-classification>  
        <further-classification edition="200601120250602B">C09D5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙成禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, CHENG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種水性透溼防水樹脂的製作方法及水性透溼防水樹脂。水性透溼防水樹脂的製作方法包括將高嶺土加入水性聚氨酯中，以得到樹脂混合物，、攪拌樹脂混合物，使樹脂混合物形成孔隙，以及將樹脂混合物塗布在基底層上，並進行加熱乾燥。所述水性聚氨酯包括聚醚多元醇、異氰酸酯及1,4環己烷二甲醇聚合以形成具有環狀結構的聚氨酯樹脂。所述高嶺土的添加量為3%至8%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for producing breathing waterproofing aqueous material and waterproofing aqueous resin. The method for producing breathing waterproofing aqueous material includes adding kaolin clay to the water-based polyurethane to obtain a resin mixture, stir the resin mixture to form pores in the resin mixture, apply the resin mixture on the base layer, and heat and dry. The water-based polyurethane includes polyether polyol, isocyanate and 1,4-cyclohexanedimethanol polymerized to form a polyurethane resin with a cyclic structure. The addition amount of kaolin is 3% to 8%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="132" publication-number="202627898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於數位孿生的塗膠系統、塗膠方法以及建立膠體物理模型的方法</chinese-title>  
        <english-title>DIGITAL TWIN-BASED DISPENSING SYSTEM AND METHOD FOR CREATING A PHYSICAL MODEL OF A FLUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251105B">G06N5/00</main-classification>  
        <further-classification edition="200601120251105B">B41L47/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇育正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉育維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹篁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHAO-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔如心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, JU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種塗膠系統，包括：電腦裝置，包括：塗膠參數設定模組，係設定至少一塗膠參數；以及模擬塗膠模組，基於該些塗膠參數執行膠體物理模擬，產生模擬塗膠結果的數位孿生；該膠體物理模擬係基於納維-斯托克斯方程式及一表面張力物理模型的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dispensing system is provided, including: a computer device comprising: a dispensing parameter setting module configured to set at least one dispensing parameter; and a dispensing simulation module configured to perform a fluid simulation based on the at least one dispensing parameter to generate a digital twin of a dispensing result; wherein the fluid simulation is based on at least one of a Navier-Stokes equation and a surface tension physical model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:塗膠系統</p>  
        <p type="p">401:電腦裝置</p>  
        <p type="p">401A:路徑規劃模組</p>  
        <p type="p">401B:塗膠參數測定模組</p>  
        <p type="p">401C:模擬塗膠模組</p>  
        <p type="p">401D:比對模組</p>  
        <p type="p">402:塗膠裝置</p>  
        <p type="p">404:塗膠結果(膠體)</p>  
        <p type="p">406:取像裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="133" publication-number="202625922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水中安全行走裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250317B">A43B3/00</main-classification>  
        <further-classification edition="200601120250317B">A45B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李燕瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江智偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李燕瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴雅韻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係在提供一種水中安全行走裝置，主要係設有二踩踏座及二支撐杖所組成，其中，該二踩踏座之底部均設有一底板，該二踩踏座之上部均設有一鞋體，該鞋體上設有黏扣帶，該二支撐杖均由數段伸縮桿所組接而成，各該伸縮桿之間均設有鎖固元件，藉由該鎖固元件將相鄰之二伸縮桿予以鎖固，而該二支撐杖底部均設有墊體，該二支撐杖之上部均設有握柄，於該握柄下方設有套繩，如此，藉由該踩踏座之增高，可將使用者托高，方便於水中行走，另藉由該二支撐杖之輔助，可使在水中行走時更加穩定，更具安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:踩踏座</p>  
        <p type="p">10:底板</p>  
        <p type="p">11:鞋體</p>  
        <p type="p">12:黏扣帶</p>  
        <p type="p">2:支撐杖</p>  
        <p type="p">20:伸縮桿</p>  
        <p type="p">21:鎖固元件</p>  
        <p type="p">22:墊體</p>  
        <p type="p">23:握柄</p>  
        <p type="p">24:套繩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="134" publication-number="202626439"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626439.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水中安全行走裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241231B">B63B34/56</main-classification>  
        <further-classification edition="202001120241231B">B63B34/565</further-classification>  
        <further-classification edition="200601120241231B">A43B13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李燕瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江智偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李燕瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴雅韻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係在提供一種水中安全行走裝置，主要係設有二踩踏座、二支撐杖、一安全帽及一呼吸管所組成，該二踩踏座之底部均設有一底板，該二踩踏座之上部均設有一鞋體，該鞋體上設有黏扣帶，該二支撐杖均由數段伸縮桿所組接而成，各該伸縮桿之間均設有鎖固元件，藉由該鎖固元件將相鄰之二伸縮桿予以鎖固，而該二支撐杖底部均設有墊體，該二支撐杖之上部均設有握柄，於該握柄下方設有套繩，該安全帽與該呼吸管相對設有黏扣帶，該呼吸管係藉由該黏扣帶定位於該安全帽上，該安全帽之下方設有定位束帶，該呼吸管之下端設有吸嘴，如此，藉由該踩踏座之增高，可將使用者托高，方便於水中行走，另藉由該二支撐杖之輔助，可使在水中行走時更加穩定，更具安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:踩踏座</p>  
        <p type="p">10:底板</p>  
        <p type="p">11:鞋體</p>  
        <p type="p">12:黏扣帶</p>  
        <p type="p">2:支撐杖</p>  
        <p type="p">20:伸縮桿</p>  
        <p type="p">21:鎖固元件</p>  
        <p type="p">22:墊體</p>  
        <p type="p">23:握柄</p>  
        <p type="p">24:套繩</p>  
        <p type="p">3:安全帽</p>  
        <p type="p">30:定位束帶</p>  
        <p type="p">4:呼吸管</p>  
        <p type="p">40:吸嘴</p>  
        <p type="p">5:黏扣帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="135" publication-number="202626381"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626381.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於拆裝車輪緊固件之套筒</chinese-title>  
        <english-title>SOCKET TOOL FOR DISASSEMBLING/ASSEMBLING A WHEEL FASTENER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250217B">B60B29/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元鑠工具有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN SHOW TOOLS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瀅如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴翊慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於拆裝車輪緊固件之套筒，包括：一筒件，包括一工作端部及一驅動端部，該工作端部包括一套接孔，該套接孔供套接於一位於一輪框的凹孔中的緊固件，該驅動端部包括一組接孔，該組接孔供一驅動工具插接；及一套件，可相對轉動地套設於該筒件，包括一外表面且定義有一軸向，該外表面包括至少一外傾斜面，該至少一外傾斜面相對於該軸向朝外傾斜延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A socket tool for disassembling/assembling a wheel fastener is provided, including: a sleeve member, including a working end and a driving end, the working end including a sleeve hole, the sleeve hole being configured for sleeving around the fastener in a hole in a wheel frame, the driving end including a connecting hole for a driving tool to be inserted; and a sleeve, rotatably sleeved on the sleeve member, including an outer surface and defining an axial direction, the outer surface including at least one outer inclined surface, the at least one outer inclined surface extending obliquely relative to the axial direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:套筒</p>  
        <p type="p">10:筒件</p>  
        <p type="p">11:工作端部</p>  
        <p type="p">111:套接孔</p>  
        <p type="p">12:驅動端部</p>  
        <p type="p">121:組接孔</p>  
        <p type="p">13:環溝</p>  
        <p type="p">20:套件</p>  
        <p type="p">21:外表面</p>  
        <p type="p">211:外傾斜面</p>  
        <p type="p">22:第一端部</p>  
        <p type="p">23:第二端部</p>  
        <p type="p">24:凸緣</p>  
        <p type="p">30:間隙</p>  
        <p type="p">A:軸向</p>  
        <p type="p">θ:傾斜角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="136" publication-number="202626382"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626382.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於拆裝車輪緊固件之套筒</chinese-title>  
        <english-title>SOCKET TOOL FOR DISASSEMBLING/ASSEMBLING A WHEEL FASTENER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250217B">B60B29/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元鑠工具有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN SHOW TOOLS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瀅如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴翊慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於拆裝車輪緊固件之套筒，包括：一筒件，包括一工作端部及一驅動端部，該工作端部包括一套接孔，該套接孔供套接於一位於一輪框的凹孔中的緊固件，該驅動端部包括一組接孔，該組接孔供一驅動工具插接；及一套件，可相對轉動地套設於該筒件，包括一外套及一內套，該外套及該內套具有不同硬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A socket tool for disassembling/assembling a wheel fastener is provided, including: a sleeve member, including a working end and a driving end, the working end including a sleeve hole, the sleeve hole being configured for sleeving around the fastener in a hole in a wheel frame, the driving end including a connecting hole for a driving tool to be inserted; and a sleeve member, rotatably sleeved on the sleeve member, including an outer sleeve and an inner sleeve, the outer sleeve and the inner sleeve having different hardness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:套筒</p>  
        <p type="p">10:筒件</p>  
        <p type="p">11:工作端部</p>  
        <p type="p">111:套接孔</p>  
        <p type="p">12:驅動端部</p>  
        <p type="p">121:組接孔</p>  
        <p type="p">13:環溝</p>  
        <p type="p">20:套件</p>  
        <p type="p">20a:外套</p>  
        <p type="p">20b:內套</p>  
        <p type="p">21:外表面</p>  
        <p type="p">211:外傾斜面</p>  
        <p type="p">22:第一端部</p>  
        <p type="p">23:第二端部</p>  
        <p type="p">24:凸緣</p>  
        <p type="p">30:間隙</p>  
        <p type="p">A:軸向</p>  
        <p type="p">θ:傾斜角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="137" publication-number="202627633"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627633.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種前光模組及反射式顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250226B">G02F1/1335</main-classification>  
        <further-classification edition="200601120250226B">G02B6/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商冠捷投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炫仰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUAN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王伯賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種適用於一反射式顯示器的前光模組，包括一設置於該反射式顯示器之出光側的表面的導光板，及一位於該導光板側邊的光源，該導光板具有一鄰近該反射式顯示器的底面、一相反於該底面的頂面、多個自該頂面向下形成的凹面，每一該凹面定義出一凹槽，及多個位於該等凹槽的反射物，該等凹面相對於該頂面的夾角不大於75度，且該等反射物由不透光材料構成。藉由該等凹面的結構設計，以及位於該等凹槽的反射物，將自該光源發出而朝向該導光板的頂面方向的部分光線反射，以進入該反射式顯示器，而有效增加光的利用率，達到良好出光效果的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:導光板</p>  
        <p type="p">311:底面</p>  
        <p type="p">312:頂面</p>  
        <p type="p">313:凹面</p>  
        <p type="p">314:反射物</p>  
        <p type="p">θ:夾角</p>  
        <p type="p">Z:垂直深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="138" publication-number="202627963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ESG風險評分系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250204B">G06Q40/06</main-classification>  
        <further-classification edition="202301120250204B">G06Q30/02</further-classification>  
        <further-classification edition="202301120250204B">G06Q10/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國信託商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔瑜芝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU-CHIH, TREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳詩薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏明俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, MING CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林道通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DAW-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池祥麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIH, HSIANG LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴敏育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAY, MIN-YUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭翃驛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種ESG風險評分系統，包含一處理單元及一儲存單元。該儲存單元與該處理單元電連接，並儲存多個類別。該處理單元取得一對應於一公司的ESG事件資料。該處理單元判斷該ESG事件資料為該等類別的其中一者以產生一類別判斷結果。該處理單元根據該公司的ESG事件資料及該類別判斷結果產生一對應於該ESG事件資料及該類別判斷結果的風險等級。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:ESG風險評分系統</p>  
        <p type="p">1:處理單元</p>  
        <p type="p">2:儲存單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="139" publication-number="202625901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以小葉種茶製作茶膏的方法</chinese-title>  
        <english-title>METHOD FOR MAKING TEA PASTE FROM CAMELLIA SINENSIS VAR SINENSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A23F3/22</main-classification>  
        <further-classification edition="200601120250501B">A23F3/16</further-classification>  
        <further-classification edition="200601120250501B">A23F3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董憓陵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, HUEI - LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董憓陵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, HUEI - LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高宏銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種以小葉種茶製作茶膏的方法。該方法包含步驟：取小葉種茶的茶菁製成可沖泡飲用的茶葉；分別將茶葉與5倍、3倍與2倍重量的逆滲透水，於常壓下置於陶鍋中，在90±2℃下進行萃取後進行過濾，分離取得萃取液與萃取後茶葉；將萃取液混合置於陶鍋中，在90±2℃下加熱6小時或至產生掛旗現象為止，以形成熱熔狀態的茶膏；及將熱熔狀態的茶膏倒入模具中並攤薄，在25±2°C及相對濕度80±2%的通風環境中進行乾燥至少60天。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for making tea paste from camellia sinensis var sinensis is disclosed. The method includes the following steps: taking the tea leaves of Camellia Sinensis Var Sinensis and making tea leaves that can be brewed for drink; adding the tea leaves with 5 times, 3 times and 2 times the weight of reverse osmosis water respectively, and placing them in a pottery pot under normal pressure, to extract at 90±2°C and then filter to separate the extract and extracted tea leaves; mixing the extracts and place them in the pottery pot, and heating the mixed extracts at 90±2°C for 6 hours or until flagging occurs to form tea paste in a hot molten state; and pouring the tea paste in the hot molten state into a mold and spread it thinly, and drying it in a ventilated environment at 25±2°C and a relative humidity of 80±2% for at least 60 days.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="140" publication-number="202628997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260223B">H10W42/60</main-classification>  
        <further-classification edition="202601120260223B">H10W40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚力崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宗諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, TSUNG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林依蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭書瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仲偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括基板、屏蔽層、絕緣層、電路層以及電子元件。基板包括第一、第二以及第三部分，其中第一部分低於第二部分，且第三部分將第二部分與第一部分連接，而形成凹槽。屏蔽層設置在第一、第二以及第三部分上。絕緣層設置在屏蔽層上。電路層設置在絕緣層上。電子元件設置在凹槽中並與電路層電性連接。設置在第三部分上的屏蔽層側向環繞電子元件。另提供一種電子裝置的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a substrate, a shielding layer, an insulation layer, a circuit layer and an electronic component is provided. The substrate includes first, second and third portions, wherein the first portion is lower than the second portion, and the third portion connects the second portion to the first portion to form a groove. The shielding layer is disposed on the first, second and third portions. The insulation layer is disposed on the shielding layer. The circuit layer is disposed on the insulation layer. The electronic component is disposed in the groove and electrically connected to the circuit layer. The shielding layer disposed on the third portion laterally surrounds the electronic component. A manufacturing method of an electronic device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:屏蔽層</p>  
        <p type="p">12:絕緣層</p>  
        <p type="p">13:電路層</p>  
        <p type="p">14:電子元件</p>  
        <p type="p">101:第一部分</p>  
        <p type="p">102:第二部分</p>  
        <p type="p">103:第三部分</p>  
        <p type="p">131:導線</p>  
        <p type="p">132:接墊</p>  
        <p type="p">140:接腳</p>  
        <p type="p">AG:開口</p>  
        <p type="p">D1、D2、D3:方向</p>  
        <p type="p">DP:深度</p>  
        <p type="p">G:凹槽</p>  
        <p type="p">MW:電磁波</p>  
        <p type="p">R:區域</p>  
        <p type="p">SB101、SB102、SB103:底面</p>  
        <p type="p">ST101、ST102、ST103:頂面</p>  
        <p type="p">T10、T11、T14:厚度</p>  
        <p type="p">θ:夾角</p>  
        <p type="p">I-I’:剖線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="141" publication-number="202626283"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626283.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動力工具之撞針升降機構及擊發安全裝置及其控制方法</chinese-title>  
        <english-title>FIRING PIN LIFTING MECHANISM AND FIRING SAFETY DEVICE OF A POWER TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">B25C1/06</main-classification>  
        <further-classification edition="200601120250423B">B25C1/00</further-classification>  
        <further-classification edition="200601120250423B">B25F5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力偕實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APACH INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡博芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, BO-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種動力工具之撞針升降機構及擊發安全裝置，包括：撞針驅動機構，驅動撞針位移；撞針與撞針驅動機構動力連接，撞針具有爬升齒及止動齒，止動齒具有傾斜面及擋止面；齒輪，具有帶動齒，帶動齒靠抵並抬升爬升齒；齒輪驅動機構與齒輪動力連接，齒輪驅動機構帶動齒輪旋轉；止動件，組設於該撞針的另一側，止動件具有凸部，凸部具有限止面及靠抵面，限止面靠抵於擋止面，該靠抵面靠抵於傾斜面；止動件驅動機構，驅動止動件擺動至靠抵狀態或遠離狀態；中央控制單元，控制齒輪驅動機構旋轉或止動，中央控制單元控制撞針驅動機構驅動撞針位移，中央控制單元控制止動件驅動機構驅動止動件擺動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A firing pin lifting mechanism and firing safety device of a power tool, which includes a firing pin driving mechanism for driving a firing pin to move, the firing pin is connected to the firing pin driving mechanism and is defined with climbing teeth and stop teeth having inclined and stop surfaces, a gear having driving teeth abutted against and lifts the climbing teeth, a gear driving mechanism connected to the gear and drives the gear to rotate, a stop member disposed on the other side of the firing pin and has a protruding portion, the protruding portion has a limiting surface abutted against the the stop surface and an abutting surface abutted against the inclined surface, a stop member driving mechanism drives the stop member to swing to the abutting or separating state, a central control unit rotates or stops the gear driving mechanism, controls the firing pin driving mechanism to move the firing pin, and controls the stop member driving mechanism to make the stop member swing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:撞針驅動機構</p>  
        <p type="p">11:汽缸</p>  
        <p type="p">12:活塞</p>  
        <p type="p">20:撞針</p>  
        <p type="p">20A:撞擊段</p>  
        <p type="p">21:第一側面</p>  
        <p type="p">211:爬升齒</p>  
        <p type="p">22:第二側面</p>  
        <p type="p">221:止動齒</p>  
        <p type="p">30:齒輪</p>  
        <p type="p">31:帶動齒</p>  
        <p type="p">40:齒輪驅動機構</p>  
        <p type="p">41:馬達</p>  
        <p type="p">50:止動件</p>  
        <p type="p">50A:頂端</p>  
        <p type="p">50B:底端</p>  
        <p type="p">51:凸部</p>  
        <p type="p">511:限止面</p>  
        <p type="p">512:靠抵面</p>  
        <p type="p">52:樞接部</p>  
        <p type="p">522:樞軸</p>  
        <p type="p">53:移動部</p>  
        <p type="p">531:第二穿孔</p>  
        <p type="p">532:移動軸</p>  
        <p type="p">60:止動件驅動機構</p>  
        <p type="p">61:動力源</p>  
        <p type="p">80:殼體</p>  
        <p type="p">90:座體</p>  
        <p type="p">X:軸向</p>  
        <p type="p">Y:橫向</p>  
        <p type="p">Z:前後方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="142" publication-number="202627369"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627369.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149321</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷媒熱交換機構、作業裝置及作業機</chinese-title>  
        <english-title>REFRIGERANT HEAT EXCHANGE MECHANISM, PROCESSING DEVICE, AND PROCESSING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250318B">F25B41/20</main-classification>  
        <further-classification edition="200601120250318B">F17D3/01</further-classification>  
        <further-classification edition="200601120250318B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游慶祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷媒熱交換機構，包含熱交換具、至少一前置單元及控流單元，至少一前置單元於熱交換具設有至少一給冷流路，以供輸出冷媒至控流單元，控流單元於熱交換具設有第一選擇流路及第二選擇流路，第一、二選擇流路連接前置單元之給冷流路，並配置切換結構，依冷測作業需求切換給冷流路之冷媒流入第一選擇流路或/及第二選擇流路，不僅可控制冷媒流量及低溫負載能力，並可利於相對調整壓縮機之運轉功率及加熱器之加熱功率，進而有效節省能源成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A refrigerant heat exchange mechanism includes a heat exchange member, at least one front unit, and a flow controlling unit. The at lease one front unit has at least one cold flow providing channel at the heat exchange member in order to provide the refrigerant to the flow controlling unit. The flow controlling unit has a first channel and a second channel at the heat exchange member. The first channel and the second channel communicate with the cold flow providing channel. A switching structure is arranged to switch the flow from the cold flow providing channel to the first channel or/and the second channel. Thus, the flow of the refrigerant can be adjusted, and the working power of the compressor and the heating power of the heater can be also adjusted so that the cost of energy can be saved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:熱交換具</p>  
        <p type="p">111:第一區</p>  
        <p type="p">112:第二區</p>  
        <p type="p">113:第三區</p>  
        <p type="p">114:第四區</p>  
        <p type="p">121:第一給冷流路</p>  
        <p type="p">1211:第一入口</p>  
        <p type="p">1212:第一出口</p>  
        <p type="p">122:第二給冷流路</p>  
        <p type="p">1221:第二入口</p>  
        <p type="p">1222:第二出口</p>  
        <p type="p">123:第一輸送管</p>  
        <p type="p">124:第三膨脹閥</p>  
        <p type="p">125:第一冷水流路</p>  
        <p type="p">1251:第一入水口</p>  
        <p type="p">1252:第一出水口</p>  
        <p type="p">126:第三給冷流路</p>  
        <p type="p">1261:第三入口</p>  
        <p type="p">1262:第三出口</p>  
        <p type="p">127:第四給冷流路</p>  
        <p type="p">1271:第四入口</p>  
        <p type="p">1272:第四出口</p>  
        <p type="p">128:第二輸送管</p>  
        <p type="p">129:第二冷水流路</p>  
        <p type="p">1291:第二入水口</p>  
        <p type="p">1292:第二出水口</p>  
        <p type="p">130:第一選擇流路</p>  
        <p type="p">1301:第一流入口</p>  
        <p type="p">1302:第一流出口</p>  
        <p type="p">131:第二選擇流路</p>  
        <p type="p">1311:第二流入口</p>  
        <p type="p">1312:第二流出口</p>  
        <p type="p">1321:主管段</p>  
        <p type="p">1322:支管段</p>  
        <p type="p">133:電磁閥</p>  
        <p type="p">134:第一膨脹閥</p>  
        <p type="p">135:第三輸送管</p>  
        <p type="p">136:第二膨脹閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="143" publication-number="202626469"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626469.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拾取具、接合機構及作業機</chinese-title>  
        <english-title>PICK-UP MEMBER, PRESSING MECHANISM, AND PROCESSING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">B65G47/91</main-classification>  
        <further-classification edition="200601120250324B">B65G47/90</further-classification>  
        <further-classification edition="200601120250324B">B07C5/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種拾取具，包含本體、拾取部件及複數個變流區，本體設有第一段部及第二段部，並設有相通第二段部之第一通氣道，拾取部件設於本體之第二段部 &lt;br/&gt;，並設有相通第一通氣道之第二通氣道，第二通氣道之底面沿軸線凹設有流場 &lt;br/&gt;，複數個變流區凹設於拾取部件之流場的壁面，各變流區具有呈弧面之第一承撞部，第一承撞部與流場的壁面間界定有第二承撞部；藉以拾取部件之第二通氣道的氣體吹入流場，氣體能夠碰撞複數個變流區之第一承撞部及第二承撞部而形成紊流且沿側向及垂直向沖出破口，使拾取部件與所移載之電子元件迅速分離，達到拾取具確實卸料之使用效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pick-up member includes a main body, a pick-up element, and plural flow changing areas. The main body has a first section and a second section. A first gas channel is arranged to communicate with the second section. The pick-up element is arranged at the second section of the main body and has a second gas channel communicating with the first gas channel. The bottom of the second gas channel is recessedly formed with a flow area along an axis. The flow changing areas are formed on the wall of the flow area. Each flow changing area has a first colliding portion which is arc-shaped. A second colliding portion is defined between the first colliding portion and the wall of the flow area. Thereby, the gas in the second channel enters the flow area to collide with the first colliding portion and the second colliding portion to form the turbulent flow getting out from the breach along the lateral direction and the vertical direction so that the electronic component carried by the pick-up member can quickly leave.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:承載器</p>  
        <p type="p">21:載具</p>  
        <p type="p">211:第一座件</p>  
        <p type="p">2111:第一容置部</p>  
        <p type="p">2112:凹槽</p>  
        <p type="p">212:第二座件</p>  
        <p type="p">2121:第二容置部</p>  
        <p type="p">213:彈性件</p>  
        <p type="p">22:移載臂</p>  
        <p type="p">221:輸送通道</p>  
        <p type="p">A:軸線</p>  
        <p type="p">30:拾取具</p>  
        <p type="p">31:本體</p>  
        <p type="p">311:第一段部</p>  
        <p type="p">312:第二段部</p>  
        <p type="p">313:第一通氣道</p>  
        <p type="p">314:凸板</p>  
        <p type="p">32:拾取部件</p>  
        <p type="p">321:第二通氣道</p>  
        <p type="p">322:流場</p>  
        <p type="p">33:變流區</p>  
        <p type="p">331:第一承撞部</p>  
        <p type="p">332:第二承撞部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="144" publication-number="202627479"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627479.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合機構、作業裝置及作業機</chinese-title>  
        <english-title>PRESSING MECHANISM, PROCESSING DEVICE, AND PROCESSING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G01R1/02</main-classification>  
        <further-classification edition="200601120241231B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游慶祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張湛生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHAN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接合機構，包含接合具、供給單元、微流道單元及給出單元，接合具設有接合面，以供貼接溫控電子元件，供給單元於接合具設有相通之入主流道 &lt;br/&gt;、分流道及複數個入支流道，以將預溫之流體均勻分流至複數個入支流道，微流道單元於接合具設有可供入支流道流入預溫流體之複數個微流道，而與接合面作密集多區微面積熱交換以均溫溫控電子元件，給出單元於接合具設有相通之出主流道、匯流道及複數個出支流道，並將複數個微流道輸入已熱交換之流體匯流輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pressing mechanism includes a pressing member, a providing unit, a micro-channel unit, and an outlet unit. The pressing member has a pressing face to press the electronic component and the temperature of the electronic component. The providing unit has a main channel, a branch channel, and plural inlet channel communicating with each other at the pressing member. The fluid in the predetermined temperature enters the inlet channels. The micro-channel unit has plural micro-channels at the pressing member to make the fluid in the inlet channels flow into so as to exchange heat in a large area with the pressing member for controlling the temperature of the electronic component. The outlet unit has a main outlet channel, a converging channel, and plural outlet channels at the pressing member. The heat-exchanged fluid from the micro-channels flows into the outlet unit to get out.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一構件</p>  
        <p type="p">12:第二構件</p>  
        <p type="p">132:分流道</p>  
        <p type="p">1321:分流入口</p>  
        <p type="p">133:入支流道</p>  
        <p type="p">134:入水管</p>  
        <p type="p">141:入口</p>  
        <p type="p">142:微流段</p>  
        <p type="p">143:出口</p>  
        <p type="p">153:出支流道</p>  
        <p type="p">154:出水管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="145" publication-number="202629040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊封裝構造</chinese-title>  
        <english-title>STACKED PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/10</main-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>頎邦科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPBOND TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施政宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHENG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝永偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭百勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, PAI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜智浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種堆疊封裝構造至少包含一載板、複數個導電柱、一半導體元件、複數個電子元件及一封裝體，該些導電柱僅設置於該載板的一表面的一邊緣與一電子元件設置區之間的一導電柱設置區，並藉由該些導電柱電性連接該載板與該半導體元件，使未設有該導電柱的該電子元件設置區可設置該些電子元件，以增加該堆疊封裝構造的電性功能，該封裝體填充於該載板及該半導體元件之間，以支撐該半導體元件並密封該些導電柱及該些電子元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stacked package includes a substrate, conductive columns, a semiconductor element, electronic elements and an encapsulant. The conductive columns are only arranged on a conductive column arrangement area which is located between an edge of a surface of the substrate and an electronic element mounting area. The semiconductive element is electrically connected to the substrate via the conductive columns such that the electronic elements can be mounted on the electronic element mounting area without the conductive columns to increase electrical performance of the stacked package. The encapsulant is provided between the substrate and the semiconductor element to support the semiconductor element and seal the conductive columns and the electronic elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:堆疊封裝構造</p>  
        <p type="p">110:載板</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">111a:邊緣</p>  
        <p type="p">111b:電子元件設置區</p>  
        <p type="p">111c:導電柱設置區</p>  
        <p type="p">120:導電柱</p>  
        <p type="p">121:第一端</p>  
        <p type="p">122:第二端</p>  
        <p type="p">130:電子元件</p>  
        <p type="p">140:第一封裝體</p>  
        <p type="p">150:半導體元件</p>  
        <p type="p">151:第二表面</p>  
        <p type="p">151a:導電柱接合區</p>  
        <p type="p">151b:非導電柱接合區</p>  
        <p type="p">151c:邊緣</p>  
        <p type="p">S:空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="146" publication-number="202627480"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627480.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試作業機</chinese-title>  
        <english-title>TESTING PROCESSING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G01R1/02</main-classification>  
        <further-classification edition="200601120241231B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李思宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SSU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種測試作業機，包含測試裝置、輸送裝置、供料裝置、收料裝置、移料裝置及中央控制裝置，測試裝置之複數層測試室配置測試器以供測試電子元件 &lt;br/&gt;，輸送裝置之移動架能夠沿輸送路徑承載供料裝置、收料裝置及移料裝置同步位移至測試裝置之一方，移料裝置之移料器獨立作複數個方向位移，以利迅速於供料裝置、收料裝置及測試裝置間移載待測/已測之電子元件；藉以有效縮減供料/收料之移料行程及輕量化迅速位移取放料，進而提高測試產能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A testing processing machine includes a testing device, a transportation device, a providing device, a collecting device, a carrying device, and a central control device. The testing rooms in plural layers of the testing device are arranged with testing members to test the electronic components. The movable rack of the transportation device can carry the providing device, the collecting device, and the carrying device to move along a transportation path to one side of the testing device. The carrying members of the carrying device are movable along plural directions independently so as to carry the electronic components among the providing device, the collecting device, and the testing device. Thus, the moving path of the electronic component is reduced, and the electronic components can be moved and carried quickly to improve the efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試裝置</p>  
        <p type="p">11:機架</p>  
        <p type="p">12:載板</p>  
        <p type="p">13:測試器</p>  
        <p type="p">14:壓接器</p>  
        <p type="p">15:測試室</p>  
        <p type="p">20:輸送裝置</p>  
        <p type="p">22:輸送驅動器</p>  
        <p type="p">A:輸送路徑</p>  
        <p type="p">30:供料裝置</p>  
        <p type="p">40:收料裝置</p>  
        <p type="p">50:移料裝置</p>  
        <p type="p">60:轉位器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="147" publication-number="202627378"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627378.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149330</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預燒爐體及預燒設備</chinese-title>  
        <english-title>PRE-HEATING FURNACE AND PRE-HEATING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">F27B17/00</main-classification>  
        <further-classification edition="200601120250317B">F27D1/18</further-classification>  
        <further-classification edition="200601120250317B">F27D13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒兆慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAO, CHAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預燒爐體，包含爐本體及出風單元，爐本體具有相通之測試室及出風流道；測試室以供流入預設測試低溫之氣體，並使低溫氣體流出至出風流道；出風單元裝配於爐本體，並設置箱具、止擋件及閥門，箱具之通道相通出風流道，並於通道之內部固設具有排氣孔之止擋件，止擋件之貼接面下方配置一可旋轉擺動之閥門，於閥門擺動遮蔽止擋件之排氣孔時，閥門能夠承受出風流道之氣體推力，而以壓接面緊密貼合止擋件之貼接面，進而有效防止低溫氣體外洩及結露，以提高預燒測試品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pre-heating furnace includes a furnace body and an air-outlet unit. The furnace body has a testing room and an air-outlet channel communicating with each other. The testing room is adapted for the low-temperature gas to flow into, and the gas further flows into the air-outlet channel. The air-outlet unit is arranged on the furnace body and has a box, a blocking member, and a valve. The channel of the box communicates with the gas-outlet channel and is disposed with the blocking member having the ventilation hole therein. The blocking member is arranged with the rotatable valve under the contact face thereof. When the ventilation hole of the blocking member is covered by the valve, the valve is pushed by the gas from the air-outlet channel to make the pressing face firmly contact the contact face of the blocking member. Thus, the low-temperature gas is prevented from leaking, and condensation is also prevented.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:箱具</p>  
        <p type="p">321:通道</p>  
        <p type="p">322:內壁面</p>  
        <p type="p">323:凹槽</p>  
        <p type="p">33:止擋件</p>  
        <p type="p">331:外環部</p>  
        <p type="p">332:排氣孔</p>  
        <p type="p">333:貼接面</p>  
        <p type="p">34:閥門</p>  
        <p type="p">341:壓接面</p>  
        <p type="p">342:承推面</p>  
        <p type="p">35:旋轉缸</p>  
        <p type="p">351:轉軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="148" publication-number="202626071"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626071.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有凝血酶抑制劑及聚丙烯酸均聚物的醫藥組合物及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">A61K31/727</main-classification>  
        <further-classification edition="200601120250114B">A61K38/58</further-classification>  
        <further-classification edition="200601120250114B">A61K47/32</further-classification>  
        <further-classification edition="200601120250114B">A61P7/02</further-classification>  
        <further-classification edition="200601120250114B">A61L17/14</further-classification>  
        <further-classification edition="200601120250114B">A61L17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚醫療財團法人基隆長庚紀念醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林峯輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種醫藥組合物及其用途。前述醫藥組合物含有一凝血酶抑制劑、一聚丙烯酸均聚物及水，其中，以該醫藥組合物之總重為基準，該凝血酶抑制劑之含量為0.1重量百分比至0.5重量百分比；該聚丙烯酸均聚物之含量為0.1重量百分比至10重量百分比；該水的含量為89.5重量百分比至99.8重量百分比，且所述醫藥組合物的pH值為6.1至7.9。藉由添加凝血酶抑制劑於聚丙烯酸均聚物溶液中，且調整至特定pH值，使其具有最適黏稠度，最適合塗覆於血管切口上；而在將本發明之醫藥組合物塗覆於血管切口上時，可達到抑制血管平滑肌細胞的增殖、抑制血管內膜平滑肌增生、減緩血管內膜增生、抑制血管壁增厚的效果，且可利用凝血酶抑制劑預防產生血栓，此外並可避免口服抗血小板藥物所產生的副作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="149" publication-number="202626119"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626119.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包覆有抗纖維化藥物的線材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">A61L17/14</main-classification>  
        <further-classification edition="200601120250102B">A61L17/10</further-classification>  
        <further-classification edition="200601120250102B">A61B17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚醫療財團法人基隆長庚紀念醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林峯輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包覆有抗纖維化藥物的線材及其用途，其具有：一線材及一抗纖維化藥物層，且所述抗纖維化藥物層包覆所述線材，其中，以所述線材的表面積為基準，所述抗纖維化藥物層的面積覆蓋率為10%至100%。將本發明的線材用於血管切口縫合可達到抑制血管平滑肌細胞的增生、減緩血管內膜增生、抑制血管壁增厚的效果，此外並可避免口服抗血小板藥物所產生的副作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="150" publication-number="202627380"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627380.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預燒爐體及預燒設備</chinese-title>  
        <english-title>PRE-HEATING FURNACE AND PRE-HEATING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250613B">F27D17/30</main-classification>  
        <further-classification edition="200601120250613B">F27D1/12</further-classification>  
        <further-classification edition="200601120250613B">F27D19/00</further-classification>  
        <further-classification edition="200601120250613B">F27D5/00</further-classification>  
        <further-classification edition="200601120250613B">F27B17/02</further-classification>  
        <further-classification edition="200601120250613B">F16J15/46</further-classification>  
        <further-classification edition="200601120250613B">F16K7/10</further-classification>  
        <further-classification edition="202001120250613B">G01R31/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒兆慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAO, CHAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預燒爐體，包含爐本體、出風單元、中介件及給氣單元，爐本體設有相通之測試室及出風流道，測試室以供流入預設低溫之測試用氣體，並將測試用氣體排出至出風流道；出風單元裝配於爐本體，並設置箱具及閥門，箱具之通道相通出風流道，閥門可擺動式裝配於箱具，能夠啟閉通道；中介件設有腔室，並於外表面界定連結部及接合部，連結部裝配於閥門之外環部，接合部為自由端而可彈性變形；給氣單元之給氣管能夠對中介件之腔室充氣或抽氣，使中介件之接合部作彈性變形而貼合或脫離箱具之內壁面，以確實氣密通道或利於閥門擺動位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pre-heating furnace includes a furnace body, an air-outlet unit, an intermediate member, and a gas-providing unit. The furnace body has a testing room and an air-outlet channel communicating with each other. The testing room is adapted for a low-temperature gas to flow into, and the gas further enters the air-outlet channel. The air-outlet unit is arranged at the furnace body and has a box and a valve. The channel of the box communicates with the air-outlet channel. The valve is pivotably disposed on the box to open or close the channel. The intermediate member has a cavity, and has an engaging portion and a connection portion at the exterior surface thereof. The engaging portion is arranged at a portion surrounding the valve. The connection portion is a free end and is flexible and deformable. The gas-providing pipe can provide gas into the cavity or suck the gas from the cavity so that the connection portion deforms to contact or to leave the inner wall of the box. Thus, the channel is prevented from gas leaking, and the valve is easy to pivot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:箱具</p>  
        <p type="p">321:通道</p>  
        <p type="p">322:內壁面</p>  
        <p type="p">33:閥門</p>  
        <p type="p">331:外環部</p>  
        <p type="p">332:容置部</p>  
        <p type="p">333:階級面</p>  
        <p type="p">334:底面</p>  
        <p type="p">35:中介件</p>  
        <p type="p">351:腔室</p>  
        <p type="p">3511:通孔</p>  
        <p type="p">352:連結部</p>  
        <p type="p">353:接合部</p>  
        <p type="p">361:管道</p>  
        <p type="p">362:給氣管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="151" publication-number="202628098"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628098.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體介面電路與記憶體控制方法</chinese-title>  
        <english-title>MEMORY INTERFACE CIRCUIT AND MEMORY CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G11C11/4072</main-classification>  
        <further-classification edition="200601120250501B">G11C11/406</further-classification>  
        <further-classification edition="200601120250501B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商星宸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜維生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳艷雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YAN-XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了記憶體介面電路與記憶體控制方法。記憶體介面電路應用於一電子裝置，該電子裝置包含一計算電路及一記憶體。該記憶體介面電路耦接該計算電路與該記憶體並且包含：一命令儲存電路、一狀態機以及一記憶體控制電路。命令儲存電路用來儲存至少一命令。狀態機耦接該命令儲存電路，用來管理該記憶體的一當前模式。記憶體控制電路耦接該狀態機，用來切換該記憶體的該當前模式。該記憶體控制電路控制該記憶體週期性地操作於一第一模式及一第二模式，且該記憶體在該第一模式中不處理該至少一命令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a memory interface circuit and a memory control method. The memory interface circuit is applied to an electronic device, and the electronic device includes a computing circuit and a memory. The memory interface circuit is coupled to the computing circuit and the memory and includes a command storage circuit, a state machine, and a memory control circuit. The command storage circuit is used to store at least one command. The state machine is coupled to the command storage circuit and is used to manage a current mode of the memory. The memory control circuit is coupled to the state machine and is used to switch the current mode of the memory. The memory control circuit controls the memory to periodically operate in a first mode and a second mode, and the memory does not process the at least one command in the first mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410,S420,S430,S440,S450,S460,S470,S480:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="152" publication-number="202627377"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627377.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預燒爐體及預燒設備</chinese-title>  
        <english-title>PRE-HEATING FURNACE AND PRE-HEATING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260407B">F27B15/04</main-classification>  
        <further-classification edition="200601120260407B">F27B15/10</further-classification>  
        <further-classification edition="200601120260407B">F27B15/18</further-classification>  
        <further-classification edition="202601120260407B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒兆慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAO, CHAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預燒爐體，包含爐本體、出風單元、擋止件及致動單元，爐本體之測試室以供流入預設低溫之測試用氣體，並將測試用氣體排出至出風流道；出風單元之箱具裝配於爐本體，並於箱具之通道設有可擺動式之閥門，以供啟閉通道；擋止件設有相對之第一面部及第二面部，第一面部位於閥門之外環部，第二面部朝向箱具之內壁面，致動單元於閥門之外環部設有承置部，以供承置擋止件，並以致動器能夠驅動擋止件沿第一軸線位移，使擋止件之第二面部頂抵貼合箱具之內壁面，進而確實氣密箱具之通道，以提高預燒測試品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pre-heating furnace includes a furnace body, an air-outlet unit, a blocking member, and a driving unit. The testing room of the furnace body is adapted for the low-temperature gas to flow into, and the gas further enters the air-outlet channel. The box of the air-outlet unit is arranged at the furnace body, and the channel of the box is disposed with a pivotable valve to open or close the channel. The blocking member has a first face and a second face. The first face is located at the exterior periphery of the valve, and the second face faces the inner wall of the box. The driving unit has a support portion at the exterior periphery of the valve to support the blocking member. The driving unit can drive the blocking member to move along a first axis so that the second face abuts against the inner wall of the box to ensure the gas in the channel of the box may not leak.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:箱具</p>  
        <p type="p">321:通道</p>  
        <p type="p">322:內壁面</p>  
        <p type="p">33:閥門</p>  
        <p type="p">331:外環部</p>  
        <p type="p">332:承置部</p>  
        <p type="p">3321:底面</p>  
        <p type="p">3322:第一擋面</p>  
        <p type="p">3323:第二擋面</p>  
        <p type="p">333:氣室</p>  
        <p type="p">334:管道</p>  
        <p type="p">335:輸送管</p>  
        <p type="p">336:底面</p>  
        <p type="p">35:擋止件</p>  
        <p type="p">351:第一面部</p>  
        <p type="p">352:第二面部</p>  
        <p type="p">353:第三面部</p>  
        <p type="p">354:頂抵面</p>  
        <p type="p">X:第一軸線</p>  
        <p type="p">A1:第一位置</p>  
        <p type="p">A2:第二位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="153" publication-number="202628814"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628814.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇性蝕刻氮化矽的方法</chinese-title>  
        <english-title>A METHOD FOR SELECTIVE ETCHING OF SILICON NITRIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P50/00</main-classification>  
        <further-classification edition="202601120260401B">H10P50/28</further-classification>  
        <further-classification edition="202601120260401B">H10P14/69</further-classification>  
        <further-classification edition="200601120260401B">C09K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張鼎張</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭娟瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHUAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周聖堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHENG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭紘銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張涵羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚詠方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, YUNG-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種選擇性蝕刻氮化矽的方法，用以改良蝕刻效果。係包括：提供一基板，該基板上形成有一交替堆疊結構由複數個氮化矽層及複數個氧化矽層交替堆疊而成；於一腔體中，將具有一預定濃度的一磷酸水溶液加熱至一預定溫度；將該交替堆疊結構置入該磷酸水溶液中而暴露於該磷酸水溶液；將一氣體通入該腔體中，使該腔體內的環境壓力達到一預定壓力，該預定壓力為20~200 atm；及於該預定溫度及該預定壓力之條件下，對該交替堆疊結構中之該氮化矽層進行選擇性蝕刻。藉此可以達成提升蝕刻速率、提高蝕刻選擇比、減少回沉積及提升蝕刻速率一致性的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for selective etching of silicon nitride to improve the etching effect, comprising the steps of: providing a substrate including an alternating stacked structure formed by a plurality of silicon nitride layers and a plurality of silicon oxide layers stacked alternately; heating a phosphoric acid aqueous solution with a predetermined concentration to a predetermined temperature within a chamber; placing the alternating stacked structure into the phosphoric acid aqueous solution to expose it to the phosphoric acid aqueous solution; introducing a gas into the chamber to achieve a predetermined pressure in the chamber, the predetermined pressure being 20 to 200 atm; and selective etching the silicon nitride layers in the alternating stacked structure under the conditions of the predetermined temperature and predetermined pressure. This method achieves improved etching rate, higher etching selectivity, reduced redeposition, and enhanced uniformity of the etching rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:交替堆疊結構</p>  
        <p type="p">21:氮化矽層</p>  
        <p type="p">22:氧化矽層</p>  
        <p type="p">3:通道結構</p>  
        <p type="p">C:腔體</p>  
        <p type="p">G:氣體源</p>  
        <p type="p">P:磷酸水溶液</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="154" publication-number="202628321"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628321.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機械傳動裝置的軸承組件</chinese-title>  
        <english-title>BEARING ASSEMBLY FOR MECHANICAL TRANSMISSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250213B">H02K5/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建準電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軸承組件，用以解決習知軸承容易磨損及產生噪音的問題。係包含：一套筒；一軸承，位於該套筒內，該軸承之一軸孔係由一內環頂面貫穿至一底面，該軸承具有至少一內壁溝槽，環繞排列於該軸承之一內壁面，該內壁面與該底面交界處的邊緣角形成一導斜面，該至少一內壁溝槽的溝道末端連通至該導斜面，該導斜面之導角尺寸大於各該內壁溝槽的深度；及一轉動件，可旋轉地結合於該軸孔內，該轉動件與該導斜面之間形成一儲油空間，一潤滑油沿該至少一內壁溝槽流動至該導斜面並進入該儲油空間。藉此可以達成減少運轉摩擦及降低噪音功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bearing assembly is provided to solve the problem of easy wear and noise generation of the conventional bearing. The bearing assembly includes a sleeve, a bearing located in the sleeve, and a rotating member. A shaft hole of the bearing passes through a top surface of inner ring to a bottom surface. The bearing includes at least one inner wall groove arranged around an inner wall surface of the bearing. The edge angle at the junction of the inner wall surface and the bottom surface forms a bevel surface. The end of the at least one inner wall groove is connected to the bevel surface. The chamfer angle of the bevel surface is greater than the depth of each inner wall groove. The rotating member is rotatably coupled to the shaft hole. An oil storage space is formed between the rotating member and the bevel surface. A lubricating oil flows along the at least one inner wall groove to the bevel surface and enters the oil storage space. The bearing assembly provides the effect of reducing running friction and reducing noise.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">H:軸承組件</p>  
        <p type="p">1:套筒</p>  
        <p type="p">11:管體</p>  
        <p type="p">11a:開口</p>  
        <p type="p">12:底蓋</p>  
        <p type="p">12a:上表面</p>  
        <p type="p">13:間隔件</p>  
        <p type="p">14:環槽</p>  
        <p type="p">15:中央凹槽</p>  
        <p type="p">2:軸承</p>  
        <p type="p">2a:內環頂面</p>  
        <p type="p">2b:外環頂面</p>  
        <p type="p">2c:底面</p>  
        <p type="p">2d:內壁面</p>  
        <p type="p">2e:第一外壁面</p>  
        <p type="p">2f:第二外壁面</p>  
        <p type="p">21:軸孔</p>  
        <p type="p">22:內壁溝槽</p>  
        <p type="p">23:導斜面</p>  
        <p type="p">3:轉動件</p>  
        <p type="p">31:轉軸</p>  
        <p type="p">32:止推板</p>  
        <p type="p">4:定位環</p>  
        <p type="p">41:遮蓋部</p>  
        <p type="p">42:通孔</p>  
        <p type="p">43:斜面</p>  
        <p type="p">M:安裝空間</p>  
        <p type="p">S:儲油空間</p>  
        <p type="p">P:導油通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="155" publication-number="202627500"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627500.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓接機構、測試裝置及作業機</chinese-title>  
        <english-title>PRESSING MECHANISM, TESTING DEVICE, AND PROCESSING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">G01R31/28</main-classification>  
        <further-classification edition="200601120241227B">G01R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林聖鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀詠鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, YUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓接機構，包含架置單元、接合單元及溫控單元，架置單元設有架置器，以供裝配接合單元，接合單元設有壓接具能夠壓接電子元件，溫控單元包含溫控器及中介件，溫控器裝配於接合單元，以供溫控壓接具及電子元件，中介件設有轉傳面、嵌合部及複數個側傳面，並以轉傳面裝配於壓接具之承貼面而能夠作直向熱交換，於壓接具帶動中介件之嵌合部嵌合電子元件，不僅使壓接具之承貼面與電子元件之頂面作熱交換，更可使中介件之嵌合部四周界定的複數個側傳面與電子元件的複數個側周面作側向熱交換，進而迅速提高對電子元件之溫控效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pressing mechanism includes a support unit, a pressing unit, and a temperature control unit. The support unit has a support member to dispose with the pressing unit. The pressing unit has a pressing member to press and contact the electronic component. The temperature control unit has a temperature control member and an intermediate member. The temperature control member is disposed on the pressing unit to control the temperature of the pressing member and the electronic component. The intermediate member has a transmitting face, an recess portion, and plural lateral transmitting faces. The transmitting face is disposed on the contact face of the pressing member to exchange heat vertically. The pressing member drives the recess portion to engage with the electronic member. Thus, the lateral transmitting faces around the recess portion exchange heat with the lateral faces of the electronic component laterally.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:測試裝置</p>  
        <p type="p">31:移載臂</p>  
        <p type="p">32:基座</p>  
        <p type="p">33:壓接具</p>  
        <p type="p">331:承貼面</p>  
        <p type="p">34:致冷晶片</p>  
        <p type="p">35:中介件</p>  
        <p type="p">351:轉傳面</p>  
        <p type="p">353:側傳面</p>  
        <p type="p">354:抵接面</p>  
        <p type="p">361:電路板</p>  
        <p type="p">362:測試座</p>  
        <p type="p">40:電子模組</p>  
        <p type="p">41:載板</p>  
        <p type="p">42:電子元件</p>  
        <p type="p">421:頂面</p>  
        <p type="p">422:側周面</p>  
        <p type="p">43:金屬框</p>  
        <p type="p">A:容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="156" publication-number="202627501"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627501.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試裝置及作業機</chinese-title>  
        <english-title>TESTING DEVICE AND PROCESSING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">G01R31/28</main-classification>  
        <further-classification edition="200601120241227B">G01R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀詠鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, YUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種測試裝置，包含測試機構、壓接機構及溫控機構，測試機構之測試座的承置部以供承置電子元件，壓接機構之接合器以供壓接測試座之電子元件執行測試作業，溫控機構設有第一溫控單元及第二溫控單元，第一溫控單元之第一溫控器以供溫控接合器，第二溫控單元於接合器設有具中介流體之第一流道 &lt;br/&gt;，並使中介流體與接合器作能源再利用之熱交換而具有預設測試溫度，再以輸送器將中介流體輸送至位於測試座之第二流道，第二流道將具有預設測試溫度之中介流體吹送至測試座之承置部而溫控電子元件，進而節省溫控能源成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A testing device includes a testing mechanism, a pressing mechanism, and a temperature control mechanism. The support portion of the testing seat of the testing mechanism is adapted for receiving the electronic component. The pressing member of the pressing mechanism is adapted for pressing the electronic component for testing, The temperature control mechanism has a first control unit and a second control unit. The first control member of the first control unit is adapted for controlling the temperature of the pressing member. The second control unit has a first channel having an intermediate fluid at the pressing member. The intermediate fluid exchanges heat with the pressing member to reach a predetermined temperature. The intermediate fluid further enters the second channel at the testing seat. The second channel provides the intermediate fluid in the predetermined temperature to the support portion to control the temperature of the electronic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試裝置</p>  
        <p type="p">12:測試座</p>  
        <p type="p">121:承置部</p>  
        <p type="p">124:探針</p>  
        <p type="p">14:下壓治具</p>  
        <p type="p">15:第一溫控器</p>  
        <p type="p">152:腔室</p>  
        <p type="p">153:封板</p>  
        <p type="p">155:輸入管道</p>  
        <p type="p">161:第一流道</p>  
        <p type="p">162:第一管體</p>  
        <p type="p">163:第一流通段</p>  
        <p type="p">164:第二流通段</p>  
        <p type="p">165:第二管體</p>  
        <p type="p">171:第一輸送管</p>  
        <p type="p">20:電子元件</p>  
        <p type="p">21:接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="157" publication-number="202627337"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627337.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓力自動出液開關裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">F16K15/02</main-classification>  
        <further-classification edition="200601120241231B">F16K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋云惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳谷舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋云惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳谷舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明壓力自動出液開關裝置，其包括：一容器，其頂部及頂部的一側分別具有一透孔及一與該透孔連通的第一出液口，該容器內具有一與該透孔及該第一出液口連通的容置空間，該容置空間提供裝設一流體；以及一蓋體，其包括有一滑動件、一外蓋及一彈性元件，該滑動件的頂面及底面分別為開放端及封閉端，且該滑動件的外側環設有一止擋部，該滑動件可移動的結合於該透孔內，以封閉該透孔與該第一出液口；該外蓋的頂面及底面分別為封閉端與開放端，該外蓋以開放端的一側與該容器的頂部結合，且該外蓋設有一與該第一出液口對應的第二出液口；該彈性元件設於該滑動件與該外蓋之間，以該彈性元件的彈力推擠該滑動件，當該容器傾斜或倒立時，該流體推動該滑動件，使該彈性元件收縮，該滑動件移動一預定距離，使該流體經由該第一出液口與該第二出液口輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:容器</p>  
        <p type="p">11:透孔</p>  
        <p type="p">12:第一出液口</p>  
        <p type="p">13:容置空間</p>  
        <p type="p">14:外螺紋</p>  
        <p type="p">16:第二凸塊</p>  
        <p type="p">20:蓋體</p>  
        <p type="p">21:滑動件</p>  
        <p type="p">211:止擋部</p>  
        <p type="p">213:定位槽</p>  
        <p type="p">214:寬徑部</p>  
        <p type="p">215:窄徑部</p>  
        <p type="p">216:溝槽</p>  
        <p type="p">217:密封環</p>  
        <p type="p">22:外蓋</p>  
        <p type="p">221:第二出液口</p>  
        <p type="p">225:防拆部</p>  
        <p type="p">2251:拆裝條</p>  
        <p type="p">23:彈性元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="158" publication-number="202627455"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627455.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紗線顏色的確定方法及裝置</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR YARN COLOR DETERMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250417B">G01N21/898</main-classification>  
        <further-classification edition="200601120250417B">G01J3/46</further-classification>  
        <further-classification edition="200601120250417B">G06N3/02</further-classification>  
        <further-classification edition="200601120250417B">G06T1/40</further-classification>  
        <further-classification edition="200601120250417B">D06P5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣保楊有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMARTEX SOLUTION TAIWAN LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊惠婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HUEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊凱強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯慶辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種紗線顏色的確定方法及裝置，方法包括獲取當前紗線的顏色；獲取當前織物的顏色；計算當前紗線的顏色與當前織物的顏色的當前色差；根據當前色差和目標顏色，確定目標紗線的顏色。該紗線顏色的確定方法可以根據該差異反推目標顏色需要的紗線顏色，這個顏色可以確保最終面料的顏色與目標顏色相符。通過量化色差並進行調整，減少了後續生產中的返工和廢料問題，提高了生產效率，降低了成本，解決從紗線到織物在加工過程中顏色變化的問題，最終得到與設計師要求的目標顏色一致的織物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a method and system for determining the color of yarn. The method includes: obtaining the color of the current yarn; obtaining the color of the current fabric; calculating the current color difference between the yarn and the fabric; and determining the target yarn color based on the current color difference and the target color. This method allows the target yarn color to be deduced backward from the color difference, ensuring that the final fabric color matches the target color. By quantifying and adjusting the color difference, the method reduces rework and waste in subsequent production, improves production efficiency, lowers costs, and addresses the issue of color changes during the processing of yarn into fabric. Ultimately, the fabric achieves the target color as required by the designer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11:步驟</p>  
        <p type="p">S12:步驟</p>  
        <p type="p">S20:步驟</p>  
        <p type="p">S30:步驟</p>  
        <p type="p">S40:步驟</p>  
        <p type="p">S50:步驟</p>  
        <p type="p">S60:步驟</p>  
        <p type="p">S70:步驟</p>  
        <p type="p">S80:步驟</p>  
        <p type="p">S90:步驟</p>  
        <p type="p">S91:步驟</p>  
        <p type="p">S92:步驟</p>  
        <p type="p">10:第一獲取模組</p>  
        <p type="p">20:第二獲取模組</p>  
        <p type="p">30:計算模組</p>  
        <p type="p">40:確定模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="159" publication-number="202626268"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626268.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動化研磨系統</chinese-title>  
        <english-title>AUTOMATIC GRINDING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">B24B51/00</main-classification>  
        <further-classification edition="201201120250317B">B24B37/005</further-classification>  
        <further-classification edition="201201120250317B">B24B37/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡智宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王則仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TSE JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾柏巖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, POYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動化研磨系統，包括一無人載具、一承載架、一研磨機構以及至少一限位件。承載架固設於無人載具。研磨機構配置於承載架。至少一限位件配置於承載架且朝外延伸。無人載具適於移動至一定點並對位一靶材，至少一限位件用以卡合一門板，且研磨機構伸出承載架以研磨靶材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automated grinding system including an unmanned vehicle, a carrying frame, a grinding mechanism, and at least one limiting member is provided. The carrying frame is fixed on the unmanned vehicle. The grinding mechanism is disposed on the carrying frame. The at least one limiting member is disposed on the bearing frame and extended outward. The unmanned vehicle is suitable for moving to a certain point and positioning a target. The at least one limiting member is used to engage a door panel, and the grinding mechanism is extended out of the carrier to grind the target.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:自動化研磨系統</p>  
        <p type="p">110:無人載具</p>  
        <p type="p">111:車體</p>  
        <p type="p">112:車輪</p>  
        <p type="p">113:導航組件</p>  
        <p type="p">120:承載架</p>  
        <p type="p">121:升降軸</p>  
        <p type="p">130:研磨機構</p>  
        <p type="p">131:平台</p>  
        <p type="p">132:機械手臂</p>  
        <p type="p">133:機座</p>  
        <p type="p">134:轉動部</p>  
        <p type="p">135:力量感測器</p>  
        <p type="p">136:視覺相機</p>  
        <p type="p">140:限位件</p>  
        <p type="p">141:夾持部</p>  
        <p type="p">150:耗材機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="160" publication-number="202628774"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628774.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">H10K59/80</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商群豐駿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARUX TECHNOLOGY PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昱嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭宇瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括發光元件和設置在發光元件上的第一光學膜。第一光學膜具有第一區以及圍繞第一區的第二區。第一光學膜還包括主透鏡單元和次透鏡單元。主透鏡單元設置在第一區上，次透鏡單元設置在第二區上。主透鏡單元的第一形狀不同於次透鏡單元的第二形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a light emitting element and a first optical film disposed on the light emitting element. The first optical film has a first region and a second region surrounding the first region. The first optical film also includes a main lens unit and a secondary lens unit. The main lens unit is disposed on the first area, and the secondary lens unit is disposed on the second area. A first shape of the main lens unit is different from a second shape of the secondary lens unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:電子裝置</p>  
        <p type="p">10:發光模組</p>  
        <p type="p">20:第一光學膜</p>  
        <p type="p">30:第二光學膜</p>  
        <p type="p">40,50:光學膜片</p>  
        <p type="p">60:邊框</p>  
        <p type="p">601:蓋板</p>  
        <p type="p">100A:第一發光元件</p>  
        <p type="p">100B:第二發光元件</p>  
        <p type="p">101:電路基板</p>  
        <p type="p">200:第一基板</p>  
        <p type="p">201:主透鏡單元</p>  
        <p type="p">203:次透鏡單元</p>  
        <p type="p">300:第二基板</p>  
        <p type="p">301:第一聚光透鏡</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">f1:第一聚光透鏡焦距</p>  
        <p type="p">PIN1:第一固定件</p>  
        <p type="p">PIN2:第二固定件</p>  
        <p type="p">R1:第一區</p>  
        <p type="p">R2:第二區</p>  
        <p type="p">W:擋牆</p>  
        <p type="p">I-I’:剖線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="161" publication-number="202626833"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626833.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149363</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂單體的製造方法及製造系統</chinese-title>  
        <english-title>MANUFACTURING METHOD AND MANUFACTURING SYSTEM FOR EPOXY RESIN MONOMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">C08G59/06</main-classification>  
        <further-classification edition="200601120250123B">C08G59/20</further-classification>  
        <further-classification edition="200601120250123B">B01J14/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金志龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖釗鋙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAW, CHAO-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環氧樹脂單體的製造方法包括：混合反應物溶液及第一觸媒溶液以獲得第一中間物溶液；加入第二觸媒溶液於第一中間物溶液以獲得第二中間物溶液；以及加入鹼化合物溶液於第二中間物溶液以獲得環氧樹脂單體，其中該反應物溶液包含二酚化合物及環氧氯丙烷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of epoxy resin monomer includes: mixing a reactant solution and a first catalyst solution to obtain a first intermediate solution; adding a second catalyst solution to the first intermediate solution to obtain a second intermediate solution; and adding an alkali compound solution to the second intermediate solution to obtain the epoxy resin monomer, wherein the reactant solution includes a diphenol compound and epichlorohydrin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="162" publication-number="202628513"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628513.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具把手自鎖功能的機殼結構</chinese-title>  
        <english-title>CASING STRUCTURE WITH HANDLE SELF-LOCKING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">H05K5/02</main-classification>  
        <further-classification edition="200601120250317B">H05K7/00</further-classification>  
        <further-classification edition="200601120250317B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIAN POWER DEVICES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉得彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DE BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具把手自鎖功能的機殼結構，包括：一機殼、一自鎖結構及一把手。該機殼上具有一第一導引結構及一第二導引結構。該自鎖結構具有一第一彈片及一第二彈片。其中，以該把手的該第一凹凸結構及該第二凹凸結構順著該第一導引結構及該第二導引結構的導引路徑移動，在該第一凹凸結構及該第二凹凸結構依序的移動至該第一彈片及該第二彈片時，因彈力關係使該第一彈片及該第二彈片自鎖住該第一凹凸結構及該第二凹凸結構。使把手快速定位組裝，可防止把手鬆脫，可免用其他鎖附件與工具，以提升機殼與把手之間的組裝效率，使鎖附件數量與成本為零。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A casing structure with a handle self-locking function includes: a casing, a self-locking structure, and a handle. The casing has a first guide structure and a second guide structure. The self-locking structure has a first elastic piece and a second elastic piece. Moreover, a first concave-convex structure and a second concave-convex structure of the handle move along a guiding path of the first guide structure and the second guide structure. When the first concave-convex structure and the second concave-convex structure move to the first elastic piece and the second elastic piece in sequence, the first elastic piece and the second elastic piece self-lock the first concave-convex structure and the second concave-convex structure due to an elastic force. The handle is quickly positioned and assembled to prevent the handle from loosening, and eliminates the need for other locking accessories and tools to improve the assembly efficiency between the case and the handle, making the number and cost of locking accessories zero.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機殼</p>  
        <p type="p">11:第一導引結構</p>  
        <p type="p">111:第一入口</p>  
        <p type="p">12:第二導引結構</p>  
        <p type="p">121:第二入口</p>  
        <p type="p">13、14:安裝部</p>  
        <p type="p">15:安裝元件</p>  
        <p type="p">2:把手</p>  
        <p type="p">21:握把部</p>  
        <p type="p">22:桿臂</p>  
        <p type="p">23:第一凹凸結構</p>  
        <p type="p">231:第一頂撞部</p>  
        <p type="p">232:第一凹槽</p>  
        <p type="p">233:第一定位凹部</p>  
        <p type="p">24:第二凹凸結構</p>  
        <p type="p">241:第二頂撞部</p>  
        <p type="p">242:第二凹槽</p>  
        <p type="p">243:第二定位凹部</p>  
        <p type="p">3:自鎖結構</p>  
        <p type="p">31:第一彈片</p>  
        <p type="p">311:第一翹板</p>  
        <p type="p">3111:第一被頂面</p>  
        <p type="p">312:第一自鎖部</p>  
        <p type="p">3121:第一定位凸部</p>  
        <p type="p">313:第一固接部</p>  
        <p type="p">3131:第一通孔</p>  
        <p type="p">32:第二彈片</p>  
        <p type="p">321:第二翹板</p>  
        <p type="p">3211:第二被頂面</p>  
        <p type="p">322:第二自鎖部</p>  
        <p type="p">3221:第二定位凸部</p>  
        <p type="p">323:第二固接部</p>  
        <p type="p">3231:第二通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="163" publication-number="202627954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>信用卡優惠推薦系統及方法</chinese-title>  
        <english-title>CREDIT CARD REWARD RECOMMENDATION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250206B">G06Q40/02</main-classification>  
        <further-classification edition="202301120250206B">G06Q40/00</further-classification>  
        <further-classification edition="202301120250206B">G06Q30/02</further-classification>  
        <further-classification edition="201201120250206B">G06Q20/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華南商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA NAN COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯彥任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YEN JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出一種信用卡優惠推薦系統及方法，所述系統包括雲端伺服器、銷售時點資訊主機、微型定位裝置以及行動通訊裝置。雲端伺服器用於依據一商店代碼從儲存的多個優惠資訊中篩選出要發送的多個候選優惠資訊，其中這些優惠資訊各自對應不同金融機構的信用卡。銷售時點資訊主機用於廣播交易啟動訊號及交易請求。微型定位裝置用於在收到交易啟動訊號後廣播商店代碼。行動通訊裝置接收交易請求、商店代碼以及所述多個候選優惠資訊，依據交易請求及所述多個候選優惠資訊計算出多個回饋數值，並選擇這些回饋數值中的一者以完成交易請求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A credit card reward recommendation system and method are proposed, comprising a cloud server, a point-of-sale (POS) device, a micro-positioning device, and a mobile communication device. The cloud server is configured to filter multiple candidate reward information from stored reward data based on a store code and send it to the mobile communication device, wherein these reward information items each correspond to credit cards issued by different financial institutions. The POS device is configured to broadcast a transaction initiation signal and a transaction request. The micro-positioning device is configured to broadcast the store code upon receiving the transaction initiation signal. The mobile communication device receives the transaction request, the store code, and the candidate reward information, calculates multiple reward values based on the transaction request and the candidate reward information, and selects one of the reward values to complete the transaction request.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:信用卡優惠推薦系統</p>  
        <p type="p">1:雲端伺服器</p>  
        <p type="p">3:銷售時點資訊主機</p>  
        <p type="p">5:微型定位裝置</p>  
        <p type="p">7:行動通訊裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="164" publication-number="202626122"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626122.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149375</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>骨科植入物複合夾層結構</chinese-title>  
        <english-title>COMPOSITE SANDWICH STRUCTURE OF ORTHOPEDIC IMPLANT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">A61L27/42</main-classification>  
        <further-classification edition="200601120250203B">A61L27/44</further-classification>  
        <further-classification edition="200601120250203B">A61L27/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詩萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佩宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王羽淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUCHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種骨科植入物複合夾層結構，包括：核心體、包覆核心體外表面的強化層，以及包覆強化層外表面的親和層。其中核心體材料包含聚芳醚酮，強化層再包括：至少一層由碳纖維束所構成的編織層；親和層材料則包含聚芳醚酮及或與生物陶瓷的複合材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite sandwich structure of orthopedic implant is provided, which includes: a core, a reinforcement layer covering the outer surface of the core, and an affinity layer further covering the outer surface of the reinforcement layer. The material of the core includes polyaryletherketone (PAEK), the reinforcement layer includes at least one braided layer composed of carbon fiber bundles, and the affinity layer includes PAEK and/or compounded further with bio-ceramics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:核心體</p>  
        <p type="p">10s:表面</p>  
        <p type="p">20:強化層</p>  
        <p type="p">22:編織層</p>  
        <p type="p">22p1:第一部位</p>  
        <p type="p">22p2:第二部位</p>  
        <p type="p">24:親和層</p>  
        <p type="p">100:骨科植入物複合夾層結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="165" publication-number="202628062"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628062.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其驅動方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND DRIVING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G09G3/36</main-classification>  
        <further-classification edition="200601120250418B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾衡逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HENG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾奕瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯怡君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, YI-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝仁杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, JEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置及其驅動方法。在顯示裝置中，顯示面板具有多個畫素。掃描驅動器提供多個掃描信號至多個畫素。於掃描期間中，掃描驅動器依據掃描信號對被掃描畫素進行掃描，源極驅動器依據被掃描畫素的顯示灰階程度提供源極驅動信號至被掃描畫素。源極驅動器根據被掃描畫素的顯示灰階程度來設定源極驅動信號的電壓峰值，被掃描畫素的顯示灰階程度與源極驅動信號的電壓峰值呈負相關。或者，源極驅動器根據被掃描畫素的顯示灰階程度來設定源極驅動信號的持續時間，被掃描畫素的顯示灰階程度與源極驅動信號的持續時間呈負相關。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device and driving method thereof are provided. In the display device, a display panel has a plurality of pixels. A scan driver provides a plurality of scan signals to the plurality of pixels. During a scanning period, the scan driver scans a scanned pixel according to the scanning signal, and a source driver provides a source driving signal to the scanned pixel according to a display grayscale level of the scanned pixel. The source driver sets a voltage peak value of the source driving signal according to the display gray level of the scanned pixel. The display gray level of the scanned pixel is negatively correlated with the voltage peak of the source driving signal. Alternatively, the source driver sets a duration of the source driving signal according to the display gray level of the scanned pixel. The display gray level of the scanned pixel is negatively correlated with the duration of the source driving signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:顯示面板</p>  
        <p type="p">120:掃描驅動器</p>  
        <p type="p">130:源極驅動器</p>  
        <p type="p">CLC:液晶電容</p>  
        <p type="p">DL1、DL2:源極線</p>  
        <p type="p">DATA1、DATA2:源極驅動信號</p>  
        <p type="p">GL1、GL2:掃描線</p>  
        <p type="p">GS1、GS2:掃描信號</p>  
        <p type="p">PX11、PX12、PX21、PX22:畫素</p>  
        <p type="p">T:電晶體</p>  
        <p type="p">VCOM:共用電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="166" publication-number="202628317"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628317.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輸出電壓控制方法及電池裝置</chinese-title>  
        <english-title>OUTPUT VOLTAGE CONTROL METHOD AND BATTERY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H02J9/06</main-classification>  
        <further-classification edition="202601120260401B">H02J7/00</further-classification>  
        <further-classification edition="200601120260401B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新普科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMPLO TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉書宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種輸出電壓控制方法，用於一電池裝置，該方法包括偵測一通信介面之一資料通信線與一時脈通信線之信號狀態；以及根據該資料通信線與該時脈通信線之信號狀態以及一第一持續時間判斷是否進入一第一階段關閉模式以控制該電池裝置之一輸出電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An output voltage control method for a battery device is provided. The method includes detecting signal states of a data communication line and a clock communication line of a communication interface, and determining whether to enter a first-phase shutdown mode to control an output voltage of the battery device according to the signal states of the data communication line and the clock communication line and a first duration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:流程</p>  
        <p type="p">S200,S202,S204,S206,S208,S210,S212,S214,S216,S224:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="167" publication-number="202626250"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626250.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工作臺交換裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">B23Q3/10</main-classification>  
        <further-classification edition="200601120250325B">B23Q3/02</further-classification>  
        <further-classification edition="200601120250325B">B23Q3/06</further-classification>  
        <further-classification edition="200601120250325B">B23Q1/74</further-classification>  
        <further-classification edition="200601120250325B">B23Q7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榮田精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳松田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種工作臺交換裝置，主要包含有一本體、一驅動模組、一平台模組、二第一本體、二第二本體、二限位環體以及二夾緊模組，該驅動模組組設於該本體並電性連接一控制單元；該控制單元控制組設於該驅動模組上之該平台模組作動；該等第一本體分別組設於該平台模組並沿軸向各設有一第一定位單元與間隔凸設之複數第一定位塊；該等第二本體分別組設該等第一本體上，並各設有一第二定位單元與間隔凸設之複數第二定位塊；該等限位環體分別組設於該等第二本體於內側面各設有一限位槽；該等夾緊模組一端結合該等第一本體另端結合該等第二本體，且各設有一導引環體及間隔設置複數導引貫孔且各容置一限位單元，而該等夾緊模組凹設形成一容置環槽；其中，當該等第一定位單元結合於該第二定位單元時，該等第一定位塊與該等第二定位塊彼此交錯設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">11:控制單元</p>  
        <p type="p">20:驅動模組</p>  
        <p type="p">30:平台模組</p>  
        <p type="p">40:第一本體</p>  
        <p type="p">50:第二本體</p>  
        <p type="p">70:夾緊模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="168" publication-number="202626505"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626505.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽氧化物之製備設備</chinese-title>  
        <english-title>PREPARATION APPARATUS FOR SILICON OXIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">C01B33/113</main-classification>  
        <further-classification edition="201001120241230B">H01M4/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中美矽晶製品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINO-AMERICAN SILICON PRODUCTS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煌偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUANG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊瑜民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許松林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖思涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施英汝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YING-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種矽氧化物之製備設備，包含一加熱爐、一加熱裝置、一坩堝、一收集裝置與一抽氣裝置。加熱爐內部具有一加熱區；加熱裝置與坩堝設置於加熱區中，坩堝具有一上開口；收集裝置設置於加熱區與加熱爐之內爐壁之間，收集裝置包含一收集筒、一固定板與複數個吸附件，其中：收集筒包括一頂板、一底板與一筒身，頂板具有一出氣口，底板具有一入氣口，入氣口連通坩堝的上開口，筒身具有一內壁面；固定板設置於筒身中，固定板之一外周緣與筒身的內壁面之間形成一氣流通道；該些吸附件設置於該固定板；抽氣裝置連通收集裝置之頂板的出氣口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A preparation apparatus for silicon oxide comprises a heating furnace, a heating device, a crucible, a collection device, and an exhaust device. The interior of the heating furnace is provided with a heating zone. The heating device and the crucible are disposed inside the heating zone, the crucible having an upper opening. The collection device disposed between the heating zone and an inner wall of the heating furnace includes a collection cylinder, a fixing plate, and a plurality of adsorbent members. The collection cylinder includes a top plate, a bottom plate, and a cylindrical body. The top plate has an exhaust opening. The bottom plate has an inlet opening communicating with the upper opening of the crucible. The cylindrical body has an inner wall. The fixing plate is disposed inside the cylindrical body. An airflow passage is formed between an outer edge of the fixing plate and the inner wall of the cylindrical body. The adsorbent members are disposed at the fixing plate. The exhaust device communicates with the exhaust opening of the top plate of the collection device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製備設備</p>  
        <p type="p">10:加熱爐</p>  
        <p type="p">12:隔熱材料</p>  
        <p type="p">124:加熱區</p>  
        <p type="p">14:加熱裝置</p>  
        <p type="p">142:加熱器</p>  
        <p type="p">16:坩堝</p>  
        <p type="p">162:上開口</p>  
        <p type="p">164:通氣口</p>  
        <p type="p">18:收集裝置</p>  
        <p type="p">20:收集筒</p>  
        <p type="p">44:抽氣裝置</p>  
        <p type="p">46:排氣管路</p>  
        <p type="p">462:主管路</p>  
        <p type="p">464:第一分支管路</p>  
        <p type="p">466:第二分支管路</p>  
        <p type="p">48:第一開關閥</p>  
        <p type="p">50:第二開關閥</p>  
        <p type="p">52:底座</p>  
        <p type="p">60:套接管</p>  
        <p type="p">62:延伸管</p>  
        <p type="p">64:冷卻氣源</p>  
        <p type="p">66:單向排氣閥</p>  
        <p type="p">200:固態原料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="169" publication-number="202625878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>植栽系統及其搬運車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241231B">A01G9/00</main-classification>  
        <further-classification edition="200601120241231B">A01G27/00</further-classification>  
        <further-classification edition="200601120241231B">A01G9/20</further-classification>  
        <further-classification edition="200601120241231B">A01B51/00</further-classification>  
        <further-classification edition="200601120241231B">A01D90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱均瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱均瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種植栽系統，適用於二植栽區，包含一植栽盆，及一搬運車。該植栽盆跨置在任一該植栽區的二載體上，包括一盆體，及一設置於該盆體的重心的配重件。該搬運車用於在該等植栽區間搬運該植栽盆，包括二舉升件。該等舉升件能夠帶動該植栽盆沿一上下方向移動，使該植栽盆脫離對應的載體、或被留置在對應的載體上。藉此，通過該配重件的設計，及與該等舉升件的空間配置，減少該植栽盆遠離重心的二端部的變形量，而能夠在搬運該植栽盆的過程中減少晃動，及避免碰撞，進而提升搬運，及移轉該植栽盆時的穩定性與效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:盆體</p>  
        <p type="p">210:植栽空間</p>  
        <p type="p">211:重心</p>  
        <p type="p">214:邊緣</p>  
        <p type="p">221:配重件</p>  
        <p type="p">222:配輕件</p>  
        <p type="p">23:被感測單元</p>  
        <p type="p">231:被感測件</p>  
        <p type="p">232:透光孔</p>  
        <p type="p">3:搬運車</p>  
        <p type="p">31:車體</p>  
        <p type="p">321:舉升件</p>  
        <p type="p">322:頂推面</p>  
        <p type="p">33:避障單元</p>  
        <p type="p">331:避障元件</p>  
        <p type="p">34:定位單元</p>  
        <p type="p">341:感測件</p>  
        <p type="p">X:長度方向</p>  
        <p type="p">Y:寬度方向</p>  
        <p type="p">L1:第一間距</p>  
        <p type="p">L2:第二間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="170" publication-number="202625906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149396</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝦加工方法及蝦加工處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250501B">A23L17/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人石材暨資源產業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE &amp; RESOURCE INDUSTRY R&amp;D CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文卲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEN-SHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳輔庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, FU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許紘瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種蝦加工方法，包含將蝦浸泡於具有大於0%且10%以下的鹽度的浸泡液中，且浸泡時間為3分鐘以上。透過具有大於0%且10%以下的鹽度的浸泡液，本發明蝦加工方法所產出的蝦在口感及鮮味上具有不錯的表現。本發明亦提供一種蝦加工處理系統，且該蝦加工處理系統包含一用來提供浸泡液的處理設備，及一連接該處理設備且用來供蝦與該浸泡液接觸的浸泡裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="171" publication-number="202628820"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628820.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用電漿蝕刻去除盲孔之殘留物的電子元件製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P50/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凌嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINCO TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹承育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃一原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉官儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUAN-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種採用電漿蝕刻去除盲孔之殘留物的電子元件製造方法，適用於處理一工件，該工件具有一圖案化金屬層，及一覆蓋在該圖案化金屬層的絕緣層，該絕緣層具有複數盲孔。該電子元件製造方法先以強蝕刻率≥100 Å/min對該等盲孔進行電漿強蝕刻步驟，以去除在該圖案化金屬層的金屬氧化物殘留。再以弱蝕刻率＜100Å/min對該等盲孔進行電漿弱蝕刻步驟，以去除在該電漿強蝕刻步驟後的氧化物殘留。本發明能降低接觸阻抗、提高導電性並提升產品性能與良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11~16:步驟</p>  
        <p type="p">131,132,141,142:子步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="172" publication-number="202628303"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628303.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>放電管理方法及系統</chinese-title>  
        <english-title>DISCHARGE MANAGEMENT METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H02J7/00</main-classification>  
        <further-classification edition="202601120260302B">H02J13/00</further-classification>  
        <further-classification edition="202401120260302B">G06Q50/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>來穎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RITWIN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖東源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TUNG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余長傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHANG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡庭鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, TING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚彥宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, YEN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUNG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種放電管理方法，適用於多個待用電池，包含：檢測所述多個待用電池各自的健康狀態及容量狀態，將所述多個待用電池中的每一者作為目標電池，執行：判斷目標電池的容量狀態與預設容量閾值之間的關係，當容量狀態大於或等於預設容量閾值時根據健康狀態及容量狀態產生功率分配參數，及當容量狀態小於預設容量閾值時根據健康狀態產生功率分配參數，並根據預設總功率及所述多個待用電池各自的功率分配參數，調整所述多個待用電池的輸出功率。一種放電管理系統，適用於多個待用電池，包含檢測裝置、運算裝置及多個功率控制裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A discharge management method, applicable for a plurality of standby batteries, comprises: detecting the health status and capacity status of each of standby batteries, treating each of standby batteries as a target battery and performing: determining the relationship between the capacity status of the target battery and a preset capacity threshold, generating a power allocation parameter based on the health status and capacity status when the capacity status is greater than or equal to the preset capacity threshold, generating a power allocation parameter based on the health status when the capacity status is less than the preset capacity threshold, and adjusting the output power of the standby batteries based on a preset total power and the respective power allocation parameters of the standby batteries. A discharge management system, applicable for a plurality of standby batteries, comprises a detection device, a computing device, and a plurality of power control devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11,S13,S131,S133,S135,S15:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="173" publication-number="202627416"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627416.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驗證手機　App　於混凝土裂縫寬度量測的準確度之標準實驗方法</chinese-title>  
        <english-title>STANDARD TEST METHOD FOR VALIDATING THE ACCURACY OF MOBILE PHONE APPS IN MEASURING CONCRETE CRACK WIDTHS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">G01B21/00</main-classification>  
        <further-classification edition="200601120250317B">G01B21/02</further-classification>  
        <further-classification edition="200601120250317B">G01B21/04</further-classification>  
        <further-classification edition="200601120250317B">G01N33/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立暨南國際大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHI NAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭全桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENG, CHYUAN-HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭俐瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種標準實驗方法及其標準設備，以測試用於量測混凝土裂縫寬度的手機App的準確度。前述標準設備至少包含一模擬牆、一標準化的裂縫寬度校正板、一手機姿態調整與固定裝置和一空間距離量測組件。運用空間距離量測組件，此標準實驗方法使用創新的兩階段方法來同步計算並顯示手機四角落點到模擬牆的平均距離(Ki，i = 1 ~ 4 )。亦即，在此Ki值連續監測的同時，手機的空間位置可使用前述姿態調整與固定裝置進行調整，直到四個監測的平均距離(Ki)與目標平均距離(Ki)相符。之後，再使用安裝在手機上的App量測前述裂縫寬度校正板上的裂縫寬度。本發明之標準實驗方法並建立一標準實驗流程，用於執行手機App量測裂縫寬度的標準實驗，以驗證手機App於量測混凝土裂縫寬度的準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention presents a standard test method and it’s standard apparatus for testing the accuracy of mobile phone apps designed to measure concrete crack widths. Said standard apparatus at least includes a simulated wall (SW), a standardized crack-width calibration plate (CWCP), a pose adjusting and fixing device (PAFD) and a spatial distance measuring assemblage (SDMA). This standard test method employs an innovative two-stage method associated with said SDMA to synchronously calculate and display the average distances ( &lt;i&gt;K &lt;sub&gt;i&lt;/sub&gt;&lt;/i&gt;, &lt;i&gt;i&lt;/i&gt;= 1 ~ 4) from the phone’s four corner points to said SW. With continuous feedback, the phone’s spatial position can be adjusted using said PAFD until the four monitored &lt;i&gt;K &lt;sub&gt;i&lt;/sub&gt;&lt;/i&gt;values match the target &lt;i&gt;K &lt;sub&gt;i&lt;/sub&gt;&lt;/i&gt;. Subsequently, an app installed on the phone is used to measure crack widths on said CWCP. In the standard test method of the present invention, a standard experimental procedure was established for conducting standard test to assess the accuracy of mobile phone apps in measuring concrete crack widths.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:模擬牆</p>  
        <p type="p">2:裂縫寬度校正板</p>  
        <p type="p">3:姿態調整與固定裝置</p>  
        <p type="p">31:雲台腳架</p>  
        <p type="p">32:二軸移動機構</p>  
        <p type="p">4:空間距離量測組件</p>  
        <p type="p">43:固定槽座</p>  
        <p type="p">5:手機</p>  
        <p type="p">6:雷射位移計</p>  
        <p type="p">61:動態資料紀錄器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="174" publication-number="202628601"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628601.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體封裝單元的結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B99/00</main-classification>  
        <further-classification edition="202601120260302B">H10W20/43</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華東科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTON ADVANCED ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于鴻祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HONG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古瑞庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, RUEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體記憶體封裝單元的結構改良，該半導體記憶體封裝單元包含一晶片封裝、多個第一連結體及一基板，該晶片封裝包含一重佈線層，該重佈線層具有一介電層及多條導接線路，且各該導接線路是與該晶片封裝的晶片的多個晶墊電性連結，藉由該重佈線層來改善該晶片封裝上多個晶墊的佈局空間，再模塑封裝成型該半導體記憶體封裝單元，藉以調整各該導接線路對外連結處的佈局，使得製造端容易佈局線路而降低製作成本，並避免線路過於密集而產生良率下降的問題，以利於提升產品的市場競爭力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體記憶體封裝單元</p>  
        <p type="p">10:晶片封裝</p>  
        <p type="p">11:晶片</p>  
        <p type="p">12:第一表面</p>  
        <p type="p">13:晶墊</p>  
        <p type="p">20:重佈線層</p>  
        <p type="p">21:介電層</p>  
        <p type="p">211:第一表面</p>  
        <p type="p">212:凹槽</p>  
        <p type="p">22:導接線路</p>  
        <p type="p">30:絕緣層</p>  
        <p type="p">31:第一表面</p>  
        <p type="p">32:第一開口</p>  
        <p type="p">40:第一連結體</p>  
        <p type="p">41:錫球</p>  
        <p type="p">50:基板</p>  
        <p type="p">51:第一表面</p>  
        <p type="p">52:第二表面</p>  
        <p type="p">53:第一外護層</p>  
        <p type="p">54:第二外護層</p>  
        <p type="p">55:第二開口</p>  
        <p type="p">56:第一線路</p>  
        <p type="p">57:第三開口</p>  
        <p type="p">58:第二線路</p>  
        <p type="p">59:導電柱</p>  
        <p type="p">60:第二連結體</p>  
        <p type="p">2:印刷電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="175" publication-number="202626247"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626247.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦機櫃之防變形快速導熱、散熱的焊接工法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250325B">B23K37/003</main-classification>  
        <further-classification edition="200601120250325B">B23K37/02</further-classification>  
        <further-classification edition="200601120250325B">B23K37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浩然科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEON LIGHTING TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁見國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAMES, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電腦機櫃之防變形快速導熱、散熱的焊接工法，包括下列步驟：設定一儲液空間，且該儲液空間尺寸係定義為對應複數欲焊接元件進行連結後的尺寸，該儲液空間內係盛裝有一工作液體；提供一水下焊接設備，其具有一可延伸至該儲液空間的焊接頭，以在液面下的一設定距離進行焊接工序；提供一焊接治具以暫時固定該等欲焊接元件再置入該儲液空間內；使用該水下焊接設備之該焊接頭進入該工作液體中將該等欲焊接元件相互連結成一體；完成焊接之該等欲焊接元件靜置於該工作液體中至冷卻後再取出，藉由焊接工序快速驅散所產生的熱量以避免變形，大幅提昇成品品質者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="176" publication-number="202627231"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627231.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗垢永磁鍍膜結構與其製造方法</chinese-title>  
        <english-title>STRUCTURE OF ANTI-SCALE PERMANENT MAGNET COATING AND ITS MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">C25D3/56</main-classification>  
        <further-classification edition="200601120250701B">C25D5/48</further-classification>  
        <further-classification edition="200601120250701B">C25D7/00</further-classification>  
        <further-classification edition="200601120250701B">H01F1/047</further-classification>  
        <further-classification edition="200601120250701B">H01F41/02</further-classification>  
        <further-classification edition="200601120250701B">F16L58/04</further-classification>  
        <further-classification edition="201801120250701B">F24T10/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃晁裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抗垢永磁鍍膜結構與其製造方法，此永磁鍍膜結構包括基材和永磁鍍膜。該永磁鍍膜設置於基材的表面上，且具有磁場排列結構。該磁場排列結構包括由多個N/S磁極與多個S/N磁極交替設置，以使永磁鍍膜在基材的表面產生交變磁場，且磁場排列結構的磁極間距不超過3 mm，多個N/S磁極與多個S/N磁極的每一者的磁極磁場強度為35Gs以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A structure of anti-scale permanent magnet coating and its manufacturing method are provided. The anti-scale permanent magnet coating structure comprises substrate and a permanent magnet coating. The substrate has a surface. The permanent magnet coating is disposed on the surface of the substrate, and has a magnetic field arrangement structure. The magnetic field arrangement structure comprises a plurality of N/S poles and a plurality of S/N poles arranged alternately, so that the permanent magnet coating generates an alternating magnetic field on the surface of the substrate, and a magnetic pole pitch of the magnetic field arrangement structure does not exceed 3 mm, a magnetic pole magnetic field intensity of each of the plurality of N/S poles and the plurality of S/N poles is 35Gs or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:抗垢永磁鍍膜結構</p>  
        <p type="p">100:基材</p>  
        <p type="p">100S:表面</p>  
        <p type="p">110:永磁鍍膜</p>  
        <p type="p">120:磁場排列結構</p>  
        <p type="p">122:N/S磁極</p>  
        <p type="p">124:S/N磁極</p>  
        <p type="p">D:內徑</p>  
        <p type="p">F:流體</p>  
        <p type="p">I:離子</p>  
        <p type="p">P:結垢物</p>  
        <p type="p">PP:磁極間距</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="177" publication-number="202629041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝模組及其製法</chinese-title>  
        <english-title>PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/10</main-classification>  
        <further-classification edition="202601120260302B">H10W42/60</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔帟暟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, I KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝模組及其製法，主要在形成有封裝層之封裝單元上表面先形成屏蔽層，再於該封裝單元之下表面設置複數導電元件，以避免機械手臂吸取力不足而造成製程受阻問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package module and its manufacturing method mainly form a shielding layer on the upper surface of a package unit formed with a molding layer, and then provide a plurality of conductive elements on the lower surface of the package unit in order to avoid the problem of process obstruction caused by insufficient suction force of a robot arm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:封裝單元</p>  
        <p type="p">3a:第一表面</p>  
        <p type="p">3b:第二表面</p>  
        <p type="p">3c:側面</p>  
        <p type="p">51:屏蔽層</p>  
        <p type="p">60:承載板</p>  
        <p type="p">600:開口</p>  
        <p type="p">7:封裝模組</p>  
        <p type="p">71:導電元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="178" publication-number="202627105"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627105.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從非動物來源的蛋白質萃取物製備出高脯胺酸和甘胺酸含量的胜肽混合物之方法、產物及其在促進皮膚細胞、成骨細胞、軟骨細胞與肌肉細胞再生上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">C12P21/06</main-classification>  
        <further-classification edition="200601120250114B">A61K38/16</further-classification>  
        <further-classification edition="200601120250114B">A61K8/64</further-classification>  
        <further-classification edition="201601120250114B">A23L33/18</further-classification>  
        <further-classification edition="200601120250114B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銘崎生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱毅恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YI-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王洪鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUNG CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王洪文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳涵綾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種衍生自大米與豌豆的胜肽混合物暨其製備方法。本發明亦揭示該胜肽混合物可被用來促進細胞再生，其中該細胞是選自於由下列所構成之群組：皮膚細胞、肌肉細胞、成骨細胞、軟骨細胞，以及它們的組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="179" publication-number="202627477"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627477.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>步進流動式自動分析方法</chinese-title>  
        <english-title>STEP-FLOW AUTO-ANALYSIS METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">G01N35/00</main-classification>  
        <further-classification edition="200601120250325B">G01N1/24</further-classification>  
        <further-classification edition="200601120250325B">G01N21/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白書禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, SU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動分析裝置，供用於測定水中化學物質，包含一主管路、一空氣推送單元、一檢測單元、一介於該檢測單元與該空氣推送單元之間的汲樣單元、一沖洗單元、一介於該檢測單元與該沖洗單元之間的試劑單元，及一與各單元訊號連接的繼電器模組。本發明還提供一種利用該自動分析裝置測定水中化學物質的步進流動式自動分析方法。通過該繼電器模組控制各單元並使各單元依序操作，以便於自動汲取樣水與試劑溶液、自動回推多餘的樣水、自動滯停使化學反應趨於完全，及自動記錄檢測訊號後自動清洗，而達成自動退樣與自動化檢測化學物質濃度的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automated analysis device for measuring chemical substances in solution includes a main pipe, an air push unit, a detection unit, a sampling unit between the detection unit and the air push unit, a flushing unit, a reagent unit between the detection unit and the flushing unit, and a relay module in signal connection with each unit. Furthermore, the invention also provides a step-flow auto-analysis method for measuring chemical substances in solution by using the automated analysis device. The relay module is used for controlling each unit in sequence to operate the units, so as to automatically aspirate the water sample and the reagent solution, automatically return for the redundant water sample, enable the chemical reaction to tend to be complete, and automatically record after the detection signal is recorded, thereby achieving the purpose of automatic evacuating the water sample and the reagent solution and automatic detection of chemical concentration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主管路</p>  
        <p type="p">2:空氣推送單元</p>  
        <p type="p">21:空氣管路</p>  
        <p type="p">22:空氣泵</p>  
        <p type="p">23:三通接頭</p>  
        <p type="p">3:檢測單元</p>  
        <p type="p">31:偵測器</p>  
        <p type="p">32:訊號傳輸模組</p>  
        <p type="p">33:處理器</p>  
        <p type="p">34:廢液桶</p>  
        <p type="p">4:汲樣單元</p>  
        <p type="p">41:汲樣管路</p>  
        <p type="p">42:汲樣泵</p>  
        <p type="p">43:樣水容器</p>  
        <p type="p">5:沖洗單元</p>  
        <p type="p">51:沖洗管路</p>  
        <p type="p">52:沖洗泵</p>  
        <p type="p">53:沖洗液容器</p>  
        <p type="p">54:三通接頭</p>  
        <p type="p">6:試劑單元</p>  
        <p type="p">61:試劑管路</p>  
        <p type="p">62:試劑泵</p>  
        <p type="p">63:試劑容器</p>  
        <p type="p">64:三通接頭</p>  
        <p type="p">7:繼電器模組</p>  
        <p type="p">71:汲樣繼電器</p>  
        <p type="p">72:試劑繼電器</p>  
        <p type="p">73:空氣繼電器</p>  
        <p type="p">74:沖洗繼電器</p>  
        <p type="p">75:主控繼電器</p>  
        <p type="p">76:啟動按鈕</p>  
        <p type="p">8:加熱單元</p>  
        <p type="p">81:加熱器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="180" publication-number="202626395"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626395.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電能管理系統及其方法</chinese-title>  
        <english-title>ELECTRIC ENERGY MANAGING SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241231B">B60L58/40</main-classification>  
        <further-classification edition="201901120241231B">B60L58/16</further-classification>  
        <further-classification edition="201901120241231B">B60L58/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡祖揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSU-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王銘浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電能管理系統，應用於電動載具，電能管理系統包括以下元件。第一健康度計算電路，用於計算電動載具的燃料電池的整體健康度，整體健康度關聯於燃料電池的老化狀況。第二健康度計算電路，用於計算電動載具的鋰電池的健康度，健康度關聯於鋰電池的老化狀況。電能分配電路，用於根據燃料電池的整體健康度與鋰電池的健康度計算燃料電池的輸出功率相對於電動載具的電能總需求的第一預定比例，並且根據第一預定比例控制燃料電池的輸出功率相對於鋰電池的輸出功率的第二預定比例。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electric energy managing system, is applied to an electric vehicle. The electric energy managing system includes the following components. A first health calculating circuit, is used to calculate an overall state of health of a fuel cell of the electric vehicle, and the overall state of health is related to an aging condition of the fuel cell. A second health calculating circuit, is used to calculate a state of health of a lithium battery of the electric vehicle, and the state of health is related to an aging condition of the lithium battery. an electric energy distributing circuit, is used to calculate a first predefined ratio of an output power of the fuel cell relative to a total power demand of the electric vehicle based on the overall state of health of the fuel cell and the state of health of the lithium battery, and control a second predefined ratio of the output power of the fuel cell relative to an output power of the lithium battery based on the first predefined ratio.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:電能管理系統</p>  
        <p type="p">100:燃料電池</p>  
        <p type="p">200:鋰電池</p>  
        <p type="p">300:第一健康度計算電路</p>  
        <p type="p">400:第二健康度計算電路</p>  
        <p type="p">500:電能分配電路</p>  
        <p type="p">SOH&lt;sub&gt;fc&lt;/sub&gt;:整體健康度</p>  
        <p type="p">SOH&lt;sub&gt;b&lt;/sub&gt;:健康度</p>  
        <p type="p">C1:控制訊號</p>  
        <p type="p">{V}:電壓參數集合</p>  
        <p type="p">{E}:發電量參數集合</p>  
        <p type="p">{H}:耗氫量參數集合</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="181" publication-number="202627519"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627519.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149442</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷達天線裝置與其雷達元件</chinese-title>  
        <english-title>RADAR ANTENNA DEVICE AND RADAR ELEMENT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">G01S7/02</main-classification>  
        <further-classification edition="200601120250117B">G01S13/88</further-classification>  
        <further-classification edition="202001120250117B">G01S13/93</further-classification>  
        <further-classification edition="200601120250117B">H01Q1/27</further-classification>  
        <further-classification edition="200601120250117B">H01Q1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智易科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCADYAN TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOU-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹益鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭信郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種雷達天線裝置與其雷達元件。雷達天線裝置用於安裝於一車輛的一側表面，包括：一底座；一第一天線電路板，設置於該底座之一表面上；以及一第二天線電路板，設置於該底座之該表面上，其中，該第一天線電路板與該車輛的該側表面之間形成之一第一夾角，該第二天線電路板與該車輛的該側表面之間形成之一第二夾角，該第一夾角與該第二夾角皆大於等於15度且小於等於25度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a radar antenna device and a radar element thereof. The radar antenna device is intended for installation on a side surface of a vehicle and includes: a base; a first antenna circuit board positioned on one surface of the base; and a second antenna circuit board positioned on the same surface of the base. A first angle is formed between the first antenna circuit board and the side surface of the vehicle, and a second angle is formed between the second antenna circuit board and the side surface of the vehicle, wherein both the first and second angles are greater than or equal to 15 degrees and less than or equal to 25 degrees.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:天線電路板</p>  
        <p type="p">310:雷達元件</p>  
        <p type="p">311:饋入線</p>  
        <p type="p">312:輻射元件</p>  
        <p type="p">313:寄生元件</p>  
        <p type="p">311A、311B:饋入線311的兩端</p>  
        <p type="p">311M:饋入線311的中間</p>  
        <p type="p">L1、L2:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="182" publication-number="202627531"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627531.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐高溫鏡片構造</chinese-title>  
        <english-title>HIGH-TEMPERATURE-RESISTANT LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250318B">G02B1/10</main-classification>  
        <further-classification edition="201501120250318B">G02B1/115</further-classification>  
        <further-classification edition="200601120250318B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康德光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANT OPTICAL PTE LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁啟洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHI CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耐高溫鏡片構造，包含一基板，有一基板本體及一硬化層，該硬化層包覆於該基板本體；至少一薄膜層組，披覆於該基板的其中一側，前述薄膜層組包含至少二第一折射率薄膜層及至少一第二折射率薄膜層，前述第一折射率薄膜層的折射率低於前述第二折射率薄膜層，自該基板上依序排列為前述第一折射率薄膜層、前述第二折射率薄膜層及前述第一折射率薄膜層，使至少一個前述第一折射率薄膜層包含5wt%至15wt%的Ta &lt;sub&gt;2&lt;/sub&gt;O &lt;sub&gt;5&lt;/sub&gt;及85wt%至95wt%的SiO &lt;sub&gt;2&lt;/sub&gt;；一防水塗層，披覆於前述薄膜層；藉此，能縮小第一折射率薄膜層及第二折射率薄膜層對於溫度之膨脹係數的差異，藉此當有劇烈的溫度變化如升高溫度時，能使薄膜層之間不易分離而具有抵抗溫度變化大的能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">11:基板本體</p>  
        <p type="p">12:硬化層</p>  
        <p type="p">2:薄膜層組</p>  
        <p type="p">21:第一折射率薄膜層</p>  
        <p type="p">22:第二折射率薄膜層</p>  
        <p type="p">3:防水塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="183" publication-number="202627254"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627254.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>沙發布改良結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250319B">D03D15/50</main-classification>  
        <further-classification edition="202101120250319B">D03D15/567</further-classification>  
        <further-classification edition="200601120250319B">A47C17/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盟哲實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴彥穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李赫茗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種沙發布改良結構，包含由複數條複合紗組成的一紗線組，各複合紗由收縮率(如沸水縮率)不同的至少二種纖維(高收縮纖維與機能纖維)複合而成，此複合紗織製成沙發布料後，經高溫染色加工，可使二種纖維受熱產生收縮、捲曲，利用受熱後收縮率不同的特性，使機能纖維包覆(或纏繞)在高收縮纖維之外周面，後續再進行防潑水處理及貼合表層布料(如針織布或T/C布)，本發明據以實施後，不僅可達到組織設計的自由化，亦可使紗線具備立體感、雙色效果與機能性(如涼感)等，更能提升布料的生產良率與降低生產/設計複雜性。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:複合紗</p>  
        <p type="p">11:高收縮纖維</p>  
        <p type="p">12:機能纖維</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="184" publication-number="202627678"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627678.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂膜及其應用</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN FILM AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G03F7/004</main-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="202601120260401B">H10W74/40</further-classification>  
        <further-classification edition="202601120260401B">H10W74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長春人造樹脂廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHUN PLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, ZIH-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何義明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, E-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃琮益</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性樹脂膜，其係具有一單位為微米之厚度T。當該感光性樹脂膜以紫外光-可見光光譜術測定時，所得光譜於355奈米處具有一吸光度A &lt;sub&gt;355&lt;/sub&gt;，且0.003 ＜ A &lt;sub&gt;355&lt;/sub&gt;/T ≦ 0.03。該光譜於第一波長範圍內具有至少一個一次微分等於0且二次微分小於0的點，該點各自獨立具有一A &lt;sub&gt;w1&lt;/sub&gt;/T值，其中w1表示該點所對應之波長，A &lt;sub&gt;w1&lt;/sub&gt;表示所對應之吸光度，且0.003 ≦ A &lt;sub&gt;w1&lt;/sub&gt;/T。該第一波長範圍為大於450奈米至780奈米，該厚度T為20微米至200微米。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photosensitive resin film is provided. The photosensitive film has a thickness T in μm. When the photosensitive resin film is characterized by ultraviolet-visible spectroscopy, the resulting spectrum has an absorbance A &lt;sub&gt;355&lt;/sub&gt;at 355 nm, and 0.003 ＜ A &lt;sub&gt;355&lt;/sub&gt;/T ≦ 0.03. The spectrum has at least one point within a fist wavelength range where the first derivative equals 0 and the second derivative is less than 0, and each of the point independently has an A &lt;sub&gt;w1&lt;/sub&gt;/T value, and 0.003 ≦ A &lt;sub&gt;w1&lt;/sub&gt;/T, wherein w1 represents a wavelength corresponding to the point, A &lt;sub&gt;w1&lt;/sub&gt;represents a corresponding absorbance. The first wavelength is from higher than 450 nm to 780 nm, and the thickness T is 20 μm to 200 μm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">：無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="185" publication-number="202628712"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628712.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構</chinese-title>  
        <english-title>PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250606B">H10F77/50</main-classification>  
        <further-classification edition="202501120250606B">H10F77/40</further-classification>  
        <further-classification edition="202501120250606B">H10F39/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長春人造樹脂廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHUN PLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, ZIH-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何義明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, E-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃琮益</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種封裝結構，其包含具上表面及下表面之透光片、環形支撐層及基板。環形支撐層設置於透光片之下表面上，且具有朝向透光片之頂面、與頂面相對之底面、內表面、及與內表面相對之外表面。透光片與環形支撐層以環形支撐層之底面設置於基板上，形成一封裝空間。環形支撐層沿垂直於透光片之方向具有一單位為微米之高度T，於T/2處具有相應的寬度L &lt;sub&gt;A&lt;/sub&gt;，寬度L &lt;sub&gt;A&lt;/sub&gt;為8至400微米，且0.05 ≦ T/L &lt;sub&gt;A&lt;/sub&gt;≦ 25。當環形支撐層以紫外光-可見光光譜術沿垂直於環形支撐層之頂面及底面之方向進行測定時，所得光譜於355奈米處具有吸光度A &lt;sub&gt;355&lt;/sub&gt;，且0.003 ＜ A &lt;sub&gt;355&lt;/sub&gt;/T ≦ 0.03。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure is provided. The package structure comprises a light-transmitting sheet having an upper surface and a lower surface, an annular support layer, and a substrate. The annular support layer is disposed under the lower surface of the light-transmitting sheet, and has a top surface facing the light-transmitting sheet, a bottom face opposite to the top surface, an inner surface, and an outer surface opposite to the inner surface. The light-transmitting sheet and the annular support layer are disposed on the substrate with the bottom face of the annular support layer facing the substrate, thereby forming a packaging space. The annular support layer has a height T in μm along the direction perpendicular to the light-transmitting sheet, and has a corresponding width L &lt;sub&gt;A&lt;/sub&gt;at T/2. The width L &lt;sub&gt;A&lt;/sub&gt;ranges from 8 to 400 μm, and 0.05 ≦ T/L &lt;sub&gt;A&lt;/sub&gt;≦ 25. When the annular support layer is characterized by ultraviolet-visible spectroscopy in a direction perpendicular to the top and bottom surfaces of the annular support layer, the obtained spectrum exhibits an absorbance A &lt;sub&gt;355&lt;/sub&gt;at 355 nm, and 0.003 ＜ A &lt;sub&gt;355&lt;/sub&gt;/T ≦ 0.03.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:透光片</p>  
        <p type="p">102:環形支撐層</p>  
        <p type="p">103:基板</p>  
        <p type="p">104:感測晶片</p>  
        <p type="p">105:封裝體</p>  
        <p type="p">L&lt;sub&gt;A&lt;/sub&gt;:寬度</p>  
        <p type="p">T:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="186" publication-number="202627276"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627276.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於塑膠模板的水平調平裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250226B">E04G21/18</main-classification>  
        <further-classification edition="200601120250226B">E04G9/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登鼎智慧工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許明偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江　憶鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏婌烊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於塑膠模板的水平調平裝置，設置於一塑膠模板的一安裝孔內，該水平調平裝置包含一設置於該安裝孔內的轉接座、一穿設於該轉接座的螺帽，及一穿伸於該螺帽內的螺桿，其中，該轉接座的外形與該安裝孔相匹配，該轉接座具有一貫穿孔，該螺帽穿設於該貫穿孔內，該螺桿穿伸於該螺帽內。將該水平調平裝置之轉接座直接設置於該塑膠模板的安裝孔內，再將該螺帽設置於該轉接座內並與該螺桿配合使用，就能利用該螺桿調整塑膠模板的水平及垂直位準，提升塑膠模板的組裝效率與後續的施工品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:塑膠模板</p>  
        <p type="p">10:安裝孔</p>  
        <p type="p">2:轉接座</p>  
        <p type="p">3:螺帽</p>  
        <p type="p">4:螺桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="187" publication-number="202626533"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626533.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含硝酸根廢液的處理系統及其處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250402B">C02F1/461</main-classification>  
        <further-classification edition="200601320250402B">C02F101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯瑞特科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許庭維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許凱捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含硝酸根廢液的處理系統及其處理方法，旨在解決現有技術中處理效率低、成本高及易產生二次污染的問題。所述系統包括無隔膜電解槽的電解裝置、酸度調節裝置、抗氧化劑添加裝置及氣體處理段。電解槽內設有銅電極陰極及不溶性電極陽極，廢液通電後在酸性環境下還原生成亞硝酸根、氨氣和氮氣。酸度調節裝置通過pH監測自動調節酸劑添加量，確保適宜的酸性環境。抗氧化劑添加裝置可定時定量添加抗氧化劑，抑制副產物生成並促進還原反應。氣體處理段中的洗滌塔利用稀硫酸與混合氣體中的氨氣中和反應，最終排放無害的氮氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電解裝置</p>  
        <p type="p">11:電解槽</p>  
        <p type="p">12:陰極</p>  
        <p type="p">13:陽極</p>  
        <p type="p">14:抽氣遮罩</p>  
        <p type="p">141:抽氣口</p>  
        <p type="p">15:電源供應器</p>  
        <p type="p">20:酸度調節裝置</p>  
        <p type="p">21:酸劑槽</p>  
        <p type="p">22:第一電控閥</p>  
        <p type="p">23:酸鹼測量計</p>  
        <p type="p">30:抗氧化劑添加裝置</p>  
        <p type="p">31:藥劑槽</p>  
        <p type="p">32:第二電控閥</p>  
        <p type="p">40:氣體處理段</p>  
        <p type="p">41:洗滌塔</p>  
        <p type="p">411:進流口</p>  
        <p type="p">412:出流口</p>  
        <p type="p">42:排放口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="188" publication-number="202628134"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628134.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>插頭型印刷電路板及其接線</chinese-title>  
        <english-title>PLUG-TYPE PRINTED CIRCUIT BOARD (PCB) AND CABLE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">H01B7/08</main-classification>  
        <further-classification edition="200601120250324B">H01B7/04</further-classification>  
        <further-classification edition="201101120250324B">H01R12/79</further-classification>  
        <further-classification edition="200601120250324B">H05K1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宜鼎國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNODISK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高志傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種插頭型印刷電路板（PCB）接線，包括插頭型印刷電路板與一組纜線。插頭型印刷電路板包括：插頭型連接部、接線部、以及阻抗控制區。插頭型連接部設置於插頭型印刷電路板之第一端，且插頭型連接部具有複數個連接部接點，其中插頭型連接部之厚度適配以使插頭型連接部插入外接介面。接線部設置於插頭型印刷電路板之第二端，且接線部具有複數個接線部接點與接地/電源區。阻抗控制區具有一組走線，電連接於複數個連接部接點與複數個接線部接點之間，以達成複數個連接部接點與複數個接線部接點之間的阻抗匹配。該組纜線連接至接線部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plug-type printed circuit board (PCB) cable includes a printed circuit board and a set of wires. The printed circuit board includes: a plug-type connection section, a wiring section, and an impedance control section. The plug-type connection section is disposed at a first end of the printed circuit board and has connection pins, wherein a thickness of the plug-type connection section is adapted to allow the plug-type connection section to be inserted into an external interface. The wiring section is disposed at a second end of the printed circuit board and has wiring pins and a ground/power area. The impedance control section is electrically connected between the connection pins and the wiring pins to achieve impedance matching between the first and second sets of pins. The set of wires is connected to the wiring section.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:插頭型印刷電路板接線</p>  
        <p type="p">10:插頭型印刷電路板</p>  
        <p type="p">101:插頭型連接部</p>  
        <p type="p">1011:連接部接點</p>  
        <p type="p">102:阻抗控制區</p>  
        <p type="p">1021:走線</p>  
        <p type="p">103:接線部</p>  
        <p type="p">1031:接線部接點</p>  
        <p type="p">1032:接地/電源區</p>  
        <p type="p">15:纜線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="189" publication-number="202626144"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626144.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化合成三環、四環京尼平衍生物之製備方法及其用於抗發炎的用途</chinese-title>  
        <english-title>OXDIZATION SYNTHESIS OF TRICYCLIC AND TETRACYCLIC GENIPIN DERIVATIVES AS ANTI-INFLAMMATORY AGENTS AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">A61P29/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁豐富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, FUNG FUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾維政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, WEI-ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查君翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, CHUN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾承諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUAN-JHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁豐富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, FUNG FUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及新穎的三環和四環京尼平衍生物合成及其製備方法。其係涉及抗發炎活性的三環和四環京尼平衍生物，該化合物係以京尼平為起始物，經環化和氧化兩個反應步驟，合成出三環和四環京尼平衍生物。該三環和四環京尼平衍生物經實驗證實對LPS誘導RAW264.7細胞生成的一氧化氮具有顯著的抑制效果，並在體外活性評價對第二型環氧合酶具有良好抑制效果，另外通過胃安全性和體內促炎細胞因子產生評價結果顯示出抗炎作用和顯著的選擇性，在小鼠體內比市售藥物吲哚美辛還更具有抗發炎活性，並且不會有胃部損傷之副作用，因此本發明所製備的化合物可應用於製備治療各種炎症及其相關疾病的藥物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to the synthesis of novel tricyclic and tetracyclic genipin derivatives and their preparation methods. Specifically, it concerns tricyclic and tetracyclic genipin derivatives with anti-inflammatory activity. These compounds are synthesized starting from genipin via two reaction steps: cyclization and oxidation, resulting in the formation of tricyclic and tetracyclic genipin derivatives. Experimental results have demonstrated that these derivatives significantly inhibit nitric oxide production in LPS-induced RAW264.7 cells. Additionally, in vitro activity evaluations reveal that these compounds exhibit strong inhibitory effects on cyclooxygenase-2 (COX-2). Furthermore, evaluations of gastric safety and the modulation of pro-inflammatory cytokine production in vivo indicate potent anti-inflammatory effects with remarkable selectivity. In a mouse model, these compounds exhibit greater anti-inflammatory activity compared to the commercial drug indomethacin, without causing gastric damage. Therefore, the compounds prepared in this invention have potential applications in the development of drugs for the treatment of various inflammatory conditions and related diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="190" publication-number="202628072"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628072.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成式問答系統及生成式問答方法</chinese-title>  
        <english-title>GENERATIVE QUESTION ANSWERING SYSTEM AND GENERATIVE QUESTION ANSWERING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G10L15/26</main-classification>  
        <further-classification edition="202001120250303B">G06F40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俋穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YI-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林奇賦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生成式問答系統被揭示。此生成式問答系統包含輸入輸出裝置、記憶體和處理器。輸入輸出裝置用以接收輸入資訊。記憶體用以儲存角色資料庫以及文本知識資料庫。角色資料庫記錄多個角色模板及多個對話範例，文本知識資料庫儲存多個候選文本。處理器用以：依據輸入資訊從文本知識資料庫取得至少一候選文本，並依據輸入資訊以及至少一候選文本產生第一輸出文本；依據輸入資訊從角色資料庫取得第一角色模板及至少一對話範例；以及依據輸入資訊、第一角色模板、至少一對話範例以及第一輸出文本，產生第二輸出文本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A generative question answering system is disclosed. The generative question answering system includes an input/output device, a memory and a processor. Input/output device is configured to receive input information. The memory is configured to store the character database and text knowledge database. The character database records several character templates and several dialogue examples, and the text knowledge database stores several candidate texts. The processor is configured to: obtain at least one candidate text from the text knowledge database based on the input information, and generate a first output text based on the input information and the at least one candidate text; obtain the first character template and at least one dialogue example from the character database based on the input information; and generate a second output text based on the input information, the first character template, at least one dialogue example and the first output text.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100B:生成式問答系統</p>  
        <p type="p">110:輸入輸出裝置</p>  
        <p type="p">130B:處理器</p>  
        <p type="p">150:記憶體</p>  
        <p type="p">310:文本檢索模塊</p>  
        <p type="p">330:答案生成模塊</p>  
        <p type="p">350:情境感知模塊</p>  
        <p type="p">370:風格轉換模塊</p>  
        <p type="p">152:角色資料庫</p>  
        <p type="p">154:文本知識資料庫</p>  
        <p type="p">156:使用者資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="191" publication-number="202626016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滋養液組成物及滋養油組成物</chinese-title>  
        <english-title>NOURISHING LIQUID COMPOSITION AND NOURISHING OIL COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250114B">A61K8/9767</main-classification>  
        <further-classification edition="201701120250114B">A61K8/9789</further-classification>  
        <further-classification edition="201701120250114B">A61K8/9794</further-classification>  
        <further-classification edition="200601120250114B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澄富興業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG FU ENTERPRISE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宜孟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具舒緩頭皮效果之滋養液組成物，其包括：以一精油為主劑，並搭配純水及酊劑作為輔劑所形成。藉由特定比例製作所述精油，並將所述精油、所述純水及所述酊劑混成而成滋養液組成物，使滋養液組成物的使用具有滋養頭皮之有益效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nourishing liquid composition having a soothing effect on human’s scalp is disclosed. The nourishing liquid composition includes: an essential oil as a main agent, and purified water and a tincture as auxiliary agents. Through making the essential oil in a specific ratio, and then mixing the essential oil, the purified water, and the tincture to form the nourishing liquid composition, the use of the nourishing lotion composition has the beneficial effect of nourishing the scalp.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S14:製作步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="192" publication-number="202628511"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628511.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置之外殼板體的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING HOUSING PLATE OF ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H05K5/00</main-classification>  
        <further-classification edition="200601120250102B">G06F1/16</further-classification>  
        <further-classification edition="200601120250102B">G09F13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嫚君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MAN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何瑞峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, JUI-FONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置、電子裝置之外殼板體及其製造方法，其中外殼板體的製造方法包括以下步驟：準備一基板；在基板的局部區域形成多個透光孔，各透光孔貫穿基板的外表面與內表面，且多個透光孔排列成一圖案；於各透光孔內填充一透明光固化膠，透明光固化膠於一未固化狀態；以及發出光線照射各透光孔內的透明光固化膠，使透明光固化膠由未固化狀態反應為一固化狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device, a housing plate of the electronic device and a manufacturing method thereof. The manufacturing method of the housing plate includes the following steps: preparing a substrate; forming a plurality of light-transmitting holes in a localized area of ​​the substrate, and each light-transmitting hole penetrates an outer surface and an inner surface of the substrate, and the light-transmitting holes are arranged in a pattern; each light-transmitting hole is filled with a transparent light-curing glue, and the transparent light-curing glue is in an uncured state; and emitting light to irradiate the transparent light-curing glue inside the light-transmitting holes, to make the transparent light-curing glue to a cured state from the uncured state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">3:區域</p>  
        <p type="p">10:外殼板體</p>  
        <p type="p">20:顯示螢幕</p>  
        <p type="p">21:顯示面</p>  
        <p type="p">22:背面</p>  
        <p type="p">25:發光源</p>  
        <p type="p">P:圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="193" publication-number="202627859"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627859.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片腳位配置系統及其方法</chinese-title>  
        <english-title>CHIP PIN CONFIGURATION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250526B">G06F30/27</main-classification>  
        <further-classification edition="200601120250526B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李敏豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片腳位配置系統，包含：生成式人工智慧模組、人工智慧代理模組及工具程式模組。生成式人工智慧模組之提示介面用以輸入晶片之應用場景或腳位配置樣板，生成式人工智慧模組之檢索增強生成模型用以生成晶片之腳位配置程式碼。一種晶片腳位配置方法，包含以下步驟：輸入應用場景；分析周邊資源；腳位配置；時脈配置；衝突分析；生成腳位配置程式碼；以及生成腳位配置檔案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip pin configuration system comprises: a generative artificial intelligence module, an artificial intelligence agent module and a tool program module. The prompt interface of the generative artificial intelligence module is used to input the application scenario or pin configuration template of the chip, and a retrieval-augmented generation model of the generative artificial intelligence module is used to generate the pin configuration code of the chip. A chip pin configuration method includes the following steps: inputting application scenarios; analyzing peripheral resources; pin configuration; clock configuration; conflict analysis; generating pin configuration code; and generating pin configuration files.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片腳位配置系統</p>  
        <p type="p">110:生成式人工智慧模組</p>  
        <p type="p">120:人工智慧代理模組</p>  
        <p type="p">130:工具程式模組</p>  
        <p type="p">131:自動測試應用程式介面</p>  
        <p type="p">132:程式設計應用程式介面</p>  
        <p type="p">133:程式檢查應用程式介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="194" publication-number="202627578"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627578.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽光子測試插拔模組與矽光子測試設備</chinese-title>  
        <english-title>SILICON PHOTONIC TEST PLUG-IN MODULE AND SILICON PHOTONIC TEST EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G02B6/42</main-classification>  
        <further-classification edition="200601120250401B">G02B6/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>京元電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING YUAN ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳國榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUO-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁興岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HSING YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖栢維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PO WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏宏棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, HUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王怡婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YI TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種矽光子測試插拔模組，包含有一載板、一浮動移動器、一對接連接器以及一容置座。浮動移動器可移動地安裝於載板之上，對接連接器浮動地安裝於浮動移動器之中，而容置座鄰設於載板，用以固定矽光子裝置，而對接連接器自動對準矽光子裝置的矽光子裝置連接器。此外，一種矽光子測試設備包含有一矽光子測試插拔模組，亦在此揭露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A silicon photonic test plug-in module includes a carrier board, a floating moving device, a mating connector and an accommodating seat. The floating moving device is movably installed on the carrier board, the mating connector is floatingly installed in the floating moving device, and the accommodating seat is located adjacent to the carrier board to fix a silicon photonic device, and the mating connector is automatically aligned with a silicon photonic device connector of the silicon photonic device. In addition, a silicon photonic test equipment including the silicon photonic test plug-in module is also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:矽光子測試設備</p>  
        <p type="p">200:矽光子測試插拔模組</p>  
        <p type="p">300:分類機</p>  
        <p type="p">310:進料模組</p>  
        <p type="p">330:出料模組</p>  
        <p type="p">340:移動模組</p>  
        <p type="p">342:第一移動器</p>  
        <p type="p">344:第二移動器</p>  
        <p type="p">346:第三移動器</p>  
        <p type="p">350:測試台</p>  
        <p type="p">400:光學辨識模組</p>  
        <p type="p">410:第一光學辨識器</p>  
        <p type="p">420:第二光學辨識器</p>  
        <p type="p">430:第三光學辨識器</p>  
        <p type="p">440:第四光學辨識器</p>  
        <p type="p">500:矽光子裝置</p>  
        <p type="p">600:矽光子測試機</p>  
        <p type="p">700:矽光子取放裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="195" publication-number="202627328"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627328.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自適應隔震系統</chinese-title>  
        <english-title>ADAPTIVE ISOLATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250318B">F16F15/121</main-classification>  
        <further-classification edition="200601120250318B">F16F15/129</further-classification>  
        <further-classification edition="200601120250318B">F16F15/20</further-classification>  
        <further-classification edition="200601120250318B">E04B1/98</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧煉元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LYAN YWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱鈺清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YU CING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSUNG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種被動式自適應隔震系統，其係建構於構造基礎部與上部構造之間，在該構造基礎部與該上部構造之間包含：第一支承單元；及第二滑動支承單元，係具有提供與該第一支承單元相異的水平面方向阻尼力及/或回復力，且相對於該第二滑動支承單元的水平面方向垂直地組裝有提供垂直方向勁度的彈性元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an passive adaptive isolation system configured between a structural base section and a superstructure section, comprising: A first bearing unit; and A second bearing sliding unit configured to provide horizontal damping force and/or restoring force that differ from those of the first bearing unit, wherein an elastic element configured to provide stiffness in the vertical direction is assembled perpendicular to the horizontal plane direction of the second bearing sliding unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:自適應隔震系統</p>  
        <p type="p">2:上部構造</p>  
        <p type="p">3:構造基礎部</p>  
        <p type="p">10:第一支承單元</p>  
        <p type="p">11:滑動子</p>  
        <p type="p">12:曲盤</p>  
        <p type="p">20:第二滑動支承單元</p>  
        <p type="p">21:滑動子</p>  
        <p type="p">22:曲盤</p>  
        <p type="p">23:彈性元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="196" publication-number="202626415"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626415.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軌跡修正方法、裝置、電子設備及存儲介質</chinese-title>  
        <english-title>TRAJECTORY CORRECTION METHOD, DEVICE, ELECTRONIC APPARATUS AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250805B">B60W60/00</main-classification>  
        <further-classification edition="200601120250805B">B60W40/02</further-classification>  
        <further-classification edition="201201120250805B">B60W40/10</further-classification>  
        <further-classification edition="200601120250805B">B60W30/10</further-classification>  
        <further-classification edition="201801120250805B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富智捷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOBILE DRIVE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑞亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JUI-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種軌跡修正方法、裝置、電子設備及存儲介質，所述軌跡修正方法包括：基於車輛的初始軌跡與數字地圖，確定所述車輛所在道路的行進方向；根據所述車輛的環境圖像，獲取所述車輛的行進方向與所述道路的行進方向的角度偏差；及根據所述道路的行進方向與所述角度偏差，修正所述初始軌跡，得到修正軌跡。本申請提高了車輛的修正軌跡的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a trajectory correction method, a device, an electronic apparatus and a storage medium. The trajectory correction method includes: determining the travel direction of the road where the vehicle is located based on the initial trajectory of the vehicle and the digital map; obtaining the angle deviation between the travel direction of the vehicle and the travel direction of the road based on the vehicle's environment image; and correcting the initial trajectory based on the travel direction of the road and the angle deviation to obtain the corrected trajectory. This application improves the accuracy of the vehicle's corrected trajectory.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="197" publication-number="202628994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149490</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超接面金氧半場效電晶體</chinese-title>  
        <english-title>SUPERJUNCTION METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260203B">H10W42/20</main-classification>  
        <further-classification edition="202501120260203B">H10D30/64</further-classification>  
        <further-classification edition="202501120260203B">H10D84/83</further-classification>  
        <further-classification edition="202601120260203B">H10D84/01</further-classification>  
        <further-classification edition="202601120260203B">H10P30/00</further-classification>  
        <further-classification edition="202601120260203B">H10W10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博盛半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTENS SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　相鉀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HAMILTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴東明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TUNG MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟祥集</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, HSIANG CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯永盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YUNG SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃照峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種超接面金氧半場效電晶體，首先於一N型漂移層內，以離子佈植分別埋設具有高摻雜濃度的一P型半導體與一N型半導體，所述之P型半導體與N型半導體在接合面處形成一I型接面，利用I型接面所產生之同、異位量子態能階，可吸收元件經輻照後產生的載子與P、N型半導體間的穿隧電子，並加上由重疊同步量子態的效應，產生大量量子態能階數量，用以吸收載子，進而有效改善元件的抗輻射能力；又，可進一步將PIN二極體埋設於N型漂移層內的不同位置，使其分別具有不同的抗輻射能力和導通電阻，以滿足使用者的最適需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:超接面金氧半場效電晶體</p>  
        <p type="p">101:基板</p>  
        <p type="p">102:N型漂移層</p>  
        <p type="p">103:P型柱狀區</p>  
        <p type="p">104:P型井區</p>  
        <p type="p">105:N型源極區</p>  
        <p type="p">106:閘道區</p>  
        <p type="p">107:介電層</p>  
        <p type="p">108:閘極層</p>  
        <p type="p">109:I型區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="198" publication-number="202627527"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627527.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>定位方法、電子設備及儲存介質</chinese-title>  
        <english-title>METHOD FOR POSITIONING, ELECTRONIC DEVICE, STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250303B">G01S19/42</main-classification>  
        <further-classification edition="200601120250303B">G01C21/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富智捷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOBILE DRIVE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-SHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈柏瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, PO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及車輛領域，提供一種定位方法、電子設備及儲存介質。該方法獲取車輛在第一時刻的第一位置資訊及第二位置資訊；根據預設導航路徑及第一位置資訊，預測車輛在多個預設時刻對應的第三位置資訊及第一行進方向； 根據車輛的行駛資訊及第一位置資訊，預測車輛在第二時刻對應的第四位置資訊及第二行進方向；根據第二位置資訊、多個第三位置資訊、第四位置資訊、多個第一行進方向及第二行進方向，從多個第三位置資訊中確定車輛在第二時刻對應的目標位置資訊。上述方法能夠提高目標位置資訊的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a field of vehicle, and provides a method for positioning, an electronic device and a storage medium. The method includes: obtaining first position information and second position information of a vehicle at a first moment; according to a preset navigation path and the first position information, predicting a plurality of third position information and a plurality of first travel directions corresponding to the vehicle at a plurality of preset moments; according to driving information and the first position information of the vehicle, predicting fourth position information and a second travel direction corresponding to the vehicle at a second moment; according to the second position information, the plurality of third position information, the fourth position information, the plurality of first travel directions and the second travel direction, determining target position information corresponding to the vehicle at the second moment from the plurality of third position information. The above method can improve an accuracy of the target location information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="199" publication-number="202625964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於PRT模型之塑形雷達心跳訊號偵測方法</chinese-title>  
        <english-title>RADAR HEARTBEAT SIGNAL DETECTION METHOD BASED ON PRT MODEL SHAPING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">A61B5/0205</main-classification>  
        <further-classification edition="202101120250317B">A61B5/05</further-classification>  
        <further-classification edition="200601120250317B">G01S13/88</further-classification>  
        <further-classification edition="200601120250317B">G06F17/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王復康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FU-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石如吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, JU-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾季勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, JI-XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於PRT模型之塑形雷達心跳訊號偵測方法包含一雷達裝置測得一生理訊號，該生理訊號包含一心跳成份及一呼吸成份；一運算裝置電性連接該雷達裝置並接收該生理訊號，該運算裝置擷取生理訊號中的該心跳成份而得到一雷達心跳訊號；該運算裝置將該雷達心跳訊號分割為複數個單週期雷達心跳訊號；以及該運算裝置將各該單週期雷達心跳訊號乘上一PRT模型並合併而得到一塑形雷達心跳訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radar heartbeat signal detection method based on the PRT model includes a radar device measuring a physiological signal, wherein the physiological signal contains a heartbeat component and a respiration component. A computing device is electrically connected to the radar device and receives the physiological signal. The computing device extracts the heartbeat component from the physiological signal to obtain a radar heartbeat signal. The computing device then segments the radar heartbeat signal into multiple single-cycle radar heartbeat signals. Finally, the computing device multiplies each single-cycle radar heartbeat signal by the PRT model and combines them to produce a shaped radar heartbeat signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基於PRT模型之塑形雷達心跳訊號偵測方法</p>  
        <p type="p">11:測得生理訊號</p>  
        <p type="p">12:擷取生理訊號之心跳成份</p>  
        <p type="p">13:分割雷達心跳訊號為單週期雷達心跳訊號</p>  
        <p type="p">14:將單週期雷達心跳訊號塑形並合併為塑形雷達心跳訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="200" publication-number="202628534"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628534.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧氮冷液冷AI伺服器雙模散熱系統與氮冷液冷雙模散熱模組</chinese-title>  
        <english-title>INTELLIGENT DUAL-MODE NITROGEN AND LIQUID COOLING AI SERVER HEAT DISSIPATION SYSTEM AND NITROGEN-LIQUID DUAL-MODE HEAT DISSIPATION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">H05K7/20</main-classification>  
        <further-classification edition="200601120250108B">F28C3/06</further-classification>  
        <further-classification edition="200601120250108B">F28F3/06</further-classification>  
        <further-classification edition="200601120250108B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞元科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLLARCHIP TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾棨斐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHI-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種智慧氮冷液冷AI伺服器雙模散熱系統，該系統基於氮冷液冷雙模技術，設計了一種氮冷液冷雙模散熱模組，用於高效管理伺服器在高負載運行中的散熱需求。該模組採用4:6、3:7或5:5的氮冷液冷空間比例設計，通過智能控制技術實現啟動頻率的靈活調整（10%-20%），以5°C/秒的降溫效率將伺服器穩定於40°C。該系統顯著提升了散熱速度（相比單模液冷快2.5倍），同時節約能源成本，特別適用於高負載運行的伺服器資料中心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention presents an Intelligent Dual-Mode Nitrogen and Liquid Cooling AI Server Heat Dissipation System featuring a dual-mode heat dissipation module. The module is designed for efficient thermal management in high-load server operations, employing a 4:6, 3:7, or 5:5 spatial allocation ratio between liquid cooling and nitrogen cooling. The system utilizes intelligent control to flexibly adjust activation frequencies (10%-20%), achieving a cooling efficiency of 5°C per second to stabilize server temperatures at 40°C. This system significantly enhances cooling speed (2.5 times faster than single-mode liquid cooling) while optimizing energy consumption, making it ideal for high-performance server data centers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:氮冷液冷雙模散熱模組</p>  
        <p type="p">7:氮冷冷卻通道</p>  
        <p type="p">8:液冷冷卻通道</p>  
        <p type="p">9:氮氣蒸發通道</p>  
        <p type="p">10:冷卻層內崁氮冷液冷通道</p>  
        <p type="p">11:液冷層</p>  
        <p type="p">12:氮氣層</p>  
        <p type="p">13:氣態氮收集區</p>  
        <p type="p">14:氣態氮出口</p>  
        <p type="p">15:氮氣蒸發層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="201" publication-number="202626386"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626386.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬達自驅式泵送裝置及包含其之側掛水冷系統</chinese-title>  
        <english-title>MOTOR SELF-DRIVEN PUMPING DEVICE AND SIDE-MOUNTED WATER COOLING SYSTEM COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">B60K11/02</main-classification>  
        <further-classification edition="200601120250317B">F04B9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-JHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘詳親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, XIANG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許翰林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEU, HAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種馬達自驅式泵送裝置及包含其之側掛水冷系統，馬達自驅式泵送裝置設置於一機車上，包括有一水泵以及一驅動馬達。水泵用以泵送一冷卻液。驅動馬達動力驅動水泵。其中，驅動馬達係以一減速機構連接水泵，使得驅動馬達帶動減速機構以驅使水泵運轉。此外，本發明還有關於一種包含前述馬達自驅式泵送裝置之側掛水冷系統。藉由上述設計，驅動馬達可經減速機構後直接驅動水泵，改善冷卻循環過快所帶來的負面影響，或可無須額外加裝水泵之動力來源，實為一優化設計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a motor self-driven pumping device and side-mounted water cooling system comprising the same, and the motor self-driven pumping device is provided on a motorcycle and includes a water pump and a motor. The water pump is used to pump a coolant. The motor drives the water pump. The motor is connected to the water pump through a reduction mechanism, so that the motor drives the reduction mechanism to operate the water pump. In addition, the present invention also relates to a side-mounted water cooling system including the aforementioned motor self-driven pumping device. By this way, the motor can directly drive the water pump by the reduction mechanism, thereby improving the negative affect caused by too fast cooling cycle, or eliminating the need to install a power source of a water pump.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:驅動馬達</p>  
        <p type="p">10:馬達自驅式泵送裝置</p>  
        <p type="p">100:側掛水冷系統</p>  
        <p type="p">2:減速機構</p>  
        <p type="p">3:水泵</p>  
        <p type="p">4:冷卻液分配器</p>  
        <p type="p">5:電池</p>  
        <p type="p">6:馬達控制器</p>  
        <p type="p">7:側掛散熱水箱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="202" publication-number="202628355"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628355.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音訊放大器晶片以及用來適應性地調整音訊放大器的啟動時間的方法</chinese-title>  
        <english-title>AUDIO AMPLIFIER CHIP AND METHOD FOR ADAPTIVELY ADJUSTING START-UP TIME OF AUDIO AMPLIFIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F3/181</main-classification>  
        <further-classification edition="200601120250303B">H03F3/183</further-classification>  
        <further-classification edition="200601120250303B">H03F3/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶豪科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曜洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ISAAC Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種音訊放大器晶片包含有一音訊放大器、一電流提供電路、一偵測電路以及一控制電路。音訊放大器用以驅動一揚聲器，其中音訊放大器具有多個差動輸入端，以及一直流阻隔電容係耦接於多個差動輸入端的其一。電流提供電路用以提供至少一電流以供對直流阻隔電容進行充電。偵測電路耦接於多個差動輸入端的該其一與直流阻隔電容之間的一節點，並用以根據來自節點的一輸入電壓來偵測音訊放大器晶片的一外部電阻是否存在，以產生一偵測結果。控制電路用以根據偵測結果來決定音訊放大器的一啟動時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An audio amplifier chip includes an audio amplifier, a current providing circuit, a detection circuit, and a control circuit. The audio amplifier is arranged to drive a speaker, wherein the audio amplifier has multiple differential input terminals, and a direct current (DC) blocking capacitor is coupled to one of the multiple differential input terminals. The current providing circuit is arranged to provide at least one current for charging the DC blocking capacitor. The detection circuit is coupled to a node located between the one of the multiple differential input terminals and the DC blocking capacitor, and is arranged to detect whether an external resistor of the audio amplifier chip exists according to an input voltage from the node, in order to generate a detection result. The control circuit is arranged to determine a start-up time of the audio amplifier according to the detection result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:音訊放大器晶片</p>  
        <p type="p">100:音訊放大器</p>  
        <p type="p">101:開關電路</p>  
        <p type="p">102:電流提供電路</p>  
        <p type="p">104:偵測電路</p>  
        <p type="p">106:控制電路</p>  
        <p type="p">150:揚聲器</p>  
        <p type="p">160,170:系統單晶片驅動器</p>  
        <p type="p">C&lt;sub&gt;1&lt;/sub&gt;,C&lt;sub&gt;2&lt;/sub&gt;:直流阻隔電容</p>  
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;,R&lt;sub&gt;2&lt;/sub&gt;,R&lt;sub&gt;3&lt;/sub&gt;,R&lt;sub&gt;4&lt;/sub&gt;:電阻</p>  
        <p type="p">N1:節點</p>  
        <p type="p">SW_S:開關控制訊號</p>  
        <p type="p">Charge_EN:致能訊號</p>  
        <p type="p">DEL_V:輸入電壓</p>  
        <p type="p">TH_V:門檻電壓</p>  
        <p type="p">DET_R:偵測結果</p>  
        <p type="p">CS:控制訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="203" publication-number="202628479"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628479.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149510</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種讓微波加熱均勻化的方法</chinese-title>  
        <english-title>A METHOD FOR UNIFORMIZING MICROWAVE HEATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250312B">H05B6/64</main-classification>  
        <further-classification edition="200601120250312B">H05B6/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEILIN HOLDINGS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林能源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁敏航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, MIN-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李武燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WU-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐家勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種讓微波加熱均勻化的方法，用於一微波加熱設備的一加熱腔體內，該加熱腔體的外表面具有複數個微波功率源，主要包含下列步驟：啟動該些微波功率源以對該加熱腔體內提供使一待加熱物所需的微波功率；以及控制該些微波功率源中至少一個微波功率源在一段時間內關閉或調整微波功率大小，以對該加熱腔體內提供不同的微波功率分布。根據本發明的一種讓微波加熱均勻化的方法，能夠提供更多樣變化的均勻化之微波功率分布，以達到物料均勻化加熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a method for uniformizing microwave heating, which is used in a heating cavity of a microwave heating equipment, the outer surface of the heating cavity has a plurality of microwave power sources, mainly including the following steps: starting the microwave power sources to provide the microwave power required for an object to be heated in the heating cavity; and controlling at least one of the microwave power sources to close or adjust the microwave power level within a period of time to provide different microwave power distribution in the heating cavity. A method for uniformizing microwave heating according to the present invention can provide a more diverse and uniform microwave power distribution to achieve uniform heating of the objects.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="204" publication-number="202626539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃纖維絲及其製造方法</chinese-title>  
        <english-title>GLASS FIBER AND METHOD FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">C03B37/022</main-classification>  
        <further-classification edition="200601120241231B">C03B37/07</further-classification>  
        <further-classification edition="200601120241231B">C03C13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇珈臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種玻璃纖維絲及其製造方法。所述玻璃纖維絲的製造方法包含一披覆步驟、一燒結步驟、一混合步驟及一抽紗步驟。於所述披覆步驟中，將氧化鋯粉末披覆於多個無機粒子的表面以形成多個改質無機粒子。於所述燒結步驟中，於氮氣氣氛中及400℃至1000℃的溫度條件下對所述改質無機粒子進行燒結。於所述混合步驟中，將經過燒結的多個所述改質無機粒子混合於呈熔融狀態的玻璃原料中。於所述抽紗步驟中，將混合有多個所述改質無機粒子的所述玻璃原料抽紗而形成為一玻璃纖維絲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass fiber and method for producing the same are provided. The method for producing the glass fiber includes a covering process, a sintering process, a mixing process, and a drawing process. The covering process is implemented by covering a plurality of zirconia powders onto a plurality of surfaces of a plurality of inorganic particles to form a plurality of modified inorganic particles. The sintering process is implemented by sintering the modified inorganic powders at a nitrogen atmosphere and at a temperature of between 400℃ and 1,000℃. The mixing process is implemented by mixing the modified inorganic particles that are sintered into a glass raw material that is in a molten state. The drawing process is implemented by drawing the glass raw material mixed with the modified inorganic particles to form a glass fiber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:披覆步驟</p>  
        <p type="p">S120:燒結步驟</p>  
        <p type="p">S130:混合步驟</p>  
        <p type="p">S140:抽紗步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="205" publication-number="202628324"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628324.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有暫態響應提升機制的電源轉換器</chinese-title>  
        <english-title>POWER CONVERTER HAVING TRANSIENT RESPONSE IMPROVEMENT MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">H02M1/08</main-classification>  
        <further-classification edition="200601120250526B">H02M3/156</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳富權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, FU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有暫態響應提升機制的電源轉換器。電源轉換器包含第一上橋開關、第一下橋開關、第二上橋開關、第二下橋開關以及控制電路。當第二上橋開關的第一端的輸出電壓低於下限門檻電壓時，控制電路開啟第一上橋開關以及第二下橋開關且關閉第一下橋開關以及第二上橋開關。相反地，當輸出電壓高於上限門檻電壓時，控制電路開啟第一下橋開關以及第二上橋開關且關閉第一上橋開關以及第二下橋開關。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power converter having a transient response improvement mechanism is provided. The power converter includes a first high-side switch, a first low-side switch, a second high-side switch, a second low-side switch and a control circuit. When an output voltage of a first terminal of the second high-side switch is lower than a lower limit threshold voltage, the control turns on the first high-side switch and the second low-side switch, and turns off the first low-side switch and the second high-side switch. Conversely, when the output voltage is higher than an upper limit threshold voltage, the control turns on the first low-side switch and the second high-side switch, and turns off the first high-side switch and the second low-side switch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">SW:開關電路</p>  
        <p type="p">HS1:第一上橋開關</p>  
        <p type="p">LS1:第一下橋開關</p>  
        <p type="p">HS2:第二上橋開關</p>  
        <p type="p">LS2:第二下橋開關</p>  
        <p type="p">L:電感</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">CTR:控制電路</p>  
        <p type="p">SHS1、SLS1、SHS2、SLS2:控制訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="206" publication-number="202627356"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627356.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體拱型點火電阻元件及其製造方法</chinese-title>  
        <english-title>STEREOSCOPIC ARCH IGNITOR RESISTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">F23Q7/00</main-classification>  
        <further-classification edition="200601120250328B">F42C19/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光頡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIKING TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張巧欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIAO-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭順和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHUN-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧契佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡朝安</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了 一種立體拱型點火電阻元件及其製造方法，其包含：一基板、一合金層、一待燃物容置部以及一側導層，該合金層設置在該基板的一第一表面上，該合金層包含一拱型引線、一第一連接部及一第二連接部，該待燃物容置部限定在該拱型引線與該基板之間，該拱型引線界定該待燃物容置部的一待燃物的一體積，該側導層設置在該合金層上，並且側導層抵接該基板的一側表面，該立體拱型點火電阻元件係配置以減少點火距離及/或增加與該待燃物的接觸面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stereoscopic arch ignitor resistor and manufacturing method thereof are provided. The stereoscopic arch ignitor resistor includes a substrate, an alloy layer, a flammable material accommodating portion, and a lateral conductive layer. The alloy layer is disposed on a first surface of the substrate. The alloy layer includes an arch lead, a first connecting portion, and a second connecting portion. The combustible material accommodating portion is positioned between the arched lead and the substrate. The arch lead defines a volume of combustible material of the combustible material accommodating portion. The lateral conductive layer is disposed on the alloy layer. The lateral conductive layer abuts against a side surface of the substrate. The three-dimensional arch-type ignition resistance element is configured to reduce ignition distance and/or increase contact area with combustible material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:立體拱型點火電阻元件</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:黏合層</p>  
        <p type="p">31:拱型引線</p>  
        <p type="p">32:第一連接部</p>  
        <p type="p">33:第二連接部</p>  
        <p type="p">41:第一背電極</p>  
        <p type="p">42:第二背電極</p>  
        <p type="p">50:待燃物容置部</p>  
        <p type="p">61:第一側導體</p>  
        <p type="p">62:第二側導體</p>  
        <p type="p">71:第一外電極</p>  
        <p type="p">72:第二外電極</p>  
        <p type="p">90:待燃物</p>  
        <p type="p">D1:上拱距離</p>  
        <p type="p">θ:上拱夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="207" publication-number="202627754"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627754.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及控制方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250526B">G06F1/32</main-classification>  
        <further-classification edition="200601120250526B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含：儲存模組，用於儲存複數個指令；控制器，用於：載入及解析該複數個指令中的第一指令；當該第一指令的第一類型為邏輯指令時，根據該第一指令從該複數個指令選擇第二指令，以及載入及解析該第二指令；以及當該第一類型為觸發指令時，輸出指示時間期間的第一訊號及指示週邊模組的第二訊號；以及計時模組，用於：接收該第一訊號及該第二訊號；計數以獲得計數值，其中該計數值關聯於該時間期間；比較該計數值及該時間期間，以產生時間觸發訊號；以及根據該時間觸發訊號，輸出標的觸發訊號以觸發該週邊模組運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device, including: a storage module for storing a plurality of instructions; a controller for: loading and parsing a first instruction of the plurality of instructions; when a first type of the first instruction is a logic instruction, selecting a second instruction from the plurality of instructions according to the first instruction, and loading and parsing the second instruction; and when the first type is a trigger instruction, outputting a first signal indicating a time period and a second signal indicating a peripheral module; and a timing module for: receiving the first signal and the second signal; counting to obtain a count value, wherein the count value is associated with the time period; comparing the count value with the time period to generate a time trigger signal; and outputting, according to the time trigger signal, a target trigger signal to trigger the peripheral module to operate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">104:儲存模組</p>  
        <p type="p">106:控制器</p>  
        <p type="p">108:計時模組</p>  
        <p type="p">110:週邊模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="208" publication-number="202627240"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627240.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍍覆方法及鍍覆裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">C25D21/04</main-classification>  
        <further-classification edition="200601120260128B">C25D17/00</further-classification>  
        <further-classification edition="200601120260128B">C25D17/06</further-classification>  
        <further-classification edition="200601120260128B">C25D7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田泰之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋渡良輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIWATASHI, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長井瑞樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可謀求膜厚均勻化之技術。本發明之鍍覆方法包含：供給處理（S5），其係在配置了陽極及中間構件之鍍覆槽中供給基板，且基板供給至不接觸中間構件之部位，基板具有形成了複數個圖案之圖案形成區域，圖案形成區域之輪廓形狀係非圓形，中間構件從平面觀看具有：形成了鍍覆液可通過之複數個孔的孔形成區域；及配置於孔形成區域周圍之電場遮蔽區域；孔形成區域之輪廓形狀對應於圖案形成區域之輪廓形狀；對準處理（S10），其係以變成圖案形成區域之輪廓形狀與孔形成區域之輪廓形狀空間性對準狀態的方式調整基板之位置；及第一通電處理（S20），其係使基板搖晃旋轉運動，同時對陽極及基板通電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S5:步驟</p>  
        <p type="p">S10:步驟</p>  
        <p type="p">S20:步驟</p>  
        <p type="p">S30:步驟</p>  
        <p type="p">S40:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="209" publication-number="202628023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視覺空間認知能力訓練系統及其方法和其電腦可讀存儲介質</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR TRAINING VISUAL-SPATIAL COGNITIVE ABILITIES AND COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">G09B23/04</main-classification>  
        <further-classification edition="200601120250225B">G02B27/01</further-classification>  
        <further-classification edition="200601120250225B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊政達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮書軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, SHU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭民輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, MING-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張焜棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUN-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅晧倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, HAO-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許郁莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種視覺空間認知能力訓練系統，包括儲存複數個主要文本和複數個三維圖形元素的一儲存單元，其中該些主要文本與訓練空間認知能力相關；一處理單元用以提取該些主要文本之一和至少一該些三維圖形元素以產生一訓練作業並於一預設訓練時限內執行該訓練作業；以及一顯示介面，其顯示被執行的該訓練作業的該三維圖形元素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for training visual-spatial cognitive abilities includes a storing unit storing plural main scripts and 3D figure elements which are relevant to spatial cognition. A processing may extract one of the main scripts and at least one of the 3D figure elements to generate a training work, and conduct the training work within a preset time. A display interface displays the 3D figure element based on the conducted training work.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:視覺空間認知能力訓練系統</p>  
        <p type="p">52:儲存單元</p>  
        <p type="p">54:處理單元</p>  
        <p type="p">56:顯示介面</p>  
        <p type="p">58:輸入介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="210" publication-number="202628723"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628723.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體及其製造方法</chinese-title>  
        <english-title>LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250204B">H10H20/855</main-classification>  
        <further-classification edition="202501120250204B">H10H20/84</further-classification>  
        <further-classification edition="202501120250204B">H10H20/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JUN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種發光二極體及其製造方法，發光二極體包含一基板、一磊晶複合層、一限光層及一透明導電層。其中，磊晶複合層具有一第一化合物半導體層、一發光層及一第二化合物半導體層，第一化合物半導體層夾置於基板與發光層間，限光層具有一限光開口，設置於發光層及第二化合物半導體層間。透明導電層設置於磊晶複合層上，發光層發出的光線將受限而須穿越限光層之限光開口後再由透明導電層對外射出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting diode (LED) and its manufacturing method are provided. The LED comprises a substrate, an epitaxial composite layer, a light-restricting layer, and a transparent conductive layer. The epitaxial composite layer includes a first compound semiconductor layer, a light-emitting layer, and a second compound semiconductor layer, where the first compound semiconductor layer is sandwiched between the substrate and the light-emitting layer. The light-restricting layer, having a light-restricting opening, is disposed between the light-emitting layer and the second compound semiconductor layer. The transparent conductive layer is disposed on the epitaxial composite layer. The light emitted by the light-emitting layer is restricted to pass through the light-restricting opening of the light-restricting layer before being emitted externally via the transparent conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:磊晶成長基板</p>  
        <p type="p">101:反射層</p>  
        <p type="p">102:第一化合物半導體層</p>  
        <p type="p">103:發光層</p>  
        <p type="p">104:第二化合物半導體層</p>  
        <p type="p">105:P型歐姆接觸層</p>  
        <p type="p">106:氮化矽層</p>  
        <p type="p">108:限光層</p>  
        <p type="p">109:氮化矽層</p>  
        <p type="p">111:透明導電層</p>  
        <p type="p">114:P型金屬層</p>  
        <p type="p">115:背側金屬層</p>  
        <p type="p">D:開口內徑</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="211" publication-number="202628697"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628697.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149544</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電晶體</chinese-title>  
        <english-title>PHOTOTRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250318B">H10F30/24</main-classification>  
        <further-classification edition="202501120250318B">H10F77/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏程昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHENG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳厚潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HOU-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光電晶體，其包含第一導電型基底、第二導電型基極區及一第一導電型圖案化射極區。其中，第二導電型基極區設置於第一導電型基底中。第一導電型圖案化射極區具有複數個射極子區分別地設置於第二導電型基極區中，以增加電子注入路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A phototransistor is provided. The phototransistor comprises a first conductivity-type substrate, a second conductivity-type base region, and a first conductivity-type patterned emitter region. The second conductivity-type base region is disposed within the first conductivity-type substrate. The first conductivity-type patterned emitter region includes multiple emitter sub-regions, each independently located within the second conductivity-type base region to increase electron injection pathways.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光電晶體</p>  
        <p type="p">110:基底</p>  
        <p type="p">120:基極區</p>  
        <p type="p">130:射極區</p>  
        <p type="p">140:射極電極</p>  
        <p type="p">150:集極電極</p>  
        <p type="p">160:透明介電層</p>  
        <p type="p">I&lt;sub&gt;BC&lt;/sub&gt;:基極集極電流</p>  
        <p type="p">I&lt;sub&gt;EC&lt;/sub&gt;:射極集極電流</p>  
        <p type="p">N:第一導電型</p>  
        <p type="p">P:第二導電型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="212" publication-number="202627772"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627772.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149548</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滾輪模組及其滑鼠設備</chinese-title>  
        <english-title>ROLLER MODULE AND MOUSE APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250321B">G06F3/0362</main-classification>  
        <further-classification edition="200601120250321B">G06F3/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許伊辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅承緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇振畇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHEN-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滾輪模組用於輸入裝置且包含滾輪支架、滾輪、馬達、轉動感測器及控制電路板。滾輪可轉動地設置於滾輪支架上。馬達與滾輪連接以驅動滾輪轉動。轉動感測器設置於滾輪之至少一側，用來於滾輪受力轉動時偵測滾輪之轉動方向。控制電路板電連接於馬達與轉動感測器，控制電路板根據轉動感測器所偵測到之轉動方向，對馬達輸出反向轉動驅動訊號，以驅動馬達在特定時間內施予反向旋轉扭力至滾輪。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A roller module is used for an input device and includes a roller bracket, a roller, a motor, a rotation sensor and a control circuit board. The roller is rotatably disposed on the roller bracket. The motor is connected to the roller for driving the roller to rotate. The rotation sensor is disposed on at least one side of the roller for detecting a rotation direction of the roller when the roller is rotated by an external force. The control circuit board is electrically connected to the motor and the rotation sensor. The control circuit board outputs a reverse rotation signal to the motor according to the rotation direction detected by the rotation sensor for driving the motor to exert a reverse rotation torque to the roller within a specific period of time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:滾輪模組</p>  
        <p type="p">16:滾輪支架</p>  
        <p type="p">18:滾輪</p>  
        <p type="p">20:馬達</p>  
        <p type="p">22:轉動感測器</p>  
        <p type="p">24:控制電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="213" publication-number="202626289"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626289.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組</chinese-title>  
        <english-title>BATTERY PACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">B25F5/00</main-classification>  
        <further-classification edition="202101120250801B">H01M50/247</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車王電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOBILETRON ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奕松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明電池組，包含一電池盒。該電池盒包含一殼體、一通道空間，及一按鍵組。該殼體為柱狀。該通道空間沿該殼體的一徑向穿設該殼體。該按鍵組具有多個按鍵單元，可活動地設置於該通道空間，且沿該徑向運動。該按鍵組於該通道空間沿該徑向移動時，其一側周面限位設置於該通道空間內。本案利用該殼體與按鍵組的結構設計，令該按鍵組的按壓單元沿該徑向並限位於該通道空間內，能避免因多次按壓或施力不當而斷裂或鬆脫的問題發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery pack includes a shell, a channel space, and a pressing key set. The shell is cylindrical. The channel space passes through the shell along a radial direction of the shell. The pressing key set is movably setup in the channel space and moves along the radial direction of the shell. The pressing key set has several pressing units. When the pressing key set moves along the radial direction, the peripheral surface of the pressing key set is limited in the channel space. In this invention, the pressing units move along the radial direction and are limited to the channel space, thereby avoiding the pressing units from breaking or loosening due to multiple pressings or improper application of force.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">11a:上殼部</p>  
        <p type="p">11b:下殼部</p>  
        <p type="p">11c:平台部</p>  
        <p type="p">12:平台</p>  
        <p type="p">21:第一通口</p>  
        <p type="p">22:第二通口</p>  
        <p type="p">30:按鍵組</p>  
        <p type="p">31:按壓單元</p>  
        <p type="p">312:按壓件</p>  
        <p type="p">313:按壓部</p>  
        <p type="p">314:卡扣部</p>  
        <p type="p">40:底座</p>  
        <p type="p">41:底座下殼</p>  
        <p type="p">R:徑向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="214" publication-number="202627613"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627613.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149550</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像產生裝置以及抬頭顯示器</chinese-title>  
        <english-title>IMAGE GENERATING DEVICE AND HEAD-UP DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250627B">G02B27/02</main-classification>  
        <further-classification edition="200601120250627B">G02B27/10</further-classification>  
        <further-classification edition="200601120250627B">G02B27/28</further-classification>  
        <further-classification edition="200601120250627B">G02F1/1333</further-classification>  
        <further-classification edition="200601120250627B">G02F1/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中強光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉尚祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種抬頭顯示器及其影像產生裝置，影像產生裝置包括光源模組、照明元件以及光調制模組。光源模組在不同時序分別提供第一色光束和第二色光束。照明元件勻化第一色光束及第二色光束以形成第一色照明光束及第二色照明光束，並傳遞至光調制模組。光調制模組與照明元件之間具有第一間隔距離，包括以陣列形式排列的多個像素單元。該些像素單元的每一個可為開啟狀態或關閉狀態，並在不同時序接收第一色照明光束及第二色照明光束，以將第一色照明光束或第二色照明光束轉換為影像光束。本發明的影像產生裝置能降低過溫風險且提高光學效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A head-up display device and an image generating device thereof are provided. The image generating device includes a light source module, a lighting element and a light modulation module. The light source module respectively provides a first color light beam and a second color light beam in different time periods. The lighting element homogenizes the first color light beam and the second color light beam to form a first color illumination beam and a second color illumination beam, and transmit the first color illumination beam and the second color illumination beam to the light modulation module. The light modulation module includes a plurality of pixel units arranged in an array, and is separated from the lighting element by a first separation distance. Each of the pixel units may be in an on-state or an off-state, and receive the first color illumination beam and the second color illumination beam in different time periods, so as to convert the first color illumination beam or the second color illumination beam into an image beam. The image generating device of the present invention can reduce the risk of overheating and improve the optical efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:影像產生裝置</p>  
        <p type="p">100A:光源模組</p>  
        <p type="p">100S:基板</p>  
        <p type="p">101:發光單元</p>  
        <p type="p">200:照明元件</p>  
        <p type="p">200A:入光面</p>  
        <p type="p">200B:出光面</p>  
        <p type="p">200R:子區域</p>  
        <p type="p">201:透鏡陣列元件</p>  
        <p type="p">300:光調制模組</p>  
        <p type="p">301:第一偏光層</p>  
        <p type="p">302:第二偏光層</p>  
        <p type="p">303:液晶層</p>  
        <p type="p">400:聚光元件</p>  
        <p type="p">D1:第一間隔距離</p>  
        <p type="p">D2:第二間隔距離</p>  
        <p type="p">IL:影像光束</p>  
        <p type="p">LE:透鏡單元</p>  
        <p type="p">L1:第一色光束</p>  
        <p type="p">L2:第二色光束</p>  
        <p type="p">L3:第三色光束</p>  
        <p type="p">LL1:第一色照明光束</p>  
        <p type="p">LL2:第二色照明光束</p>  
        <p type="p">LL3:第三色照明光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="215" publication-number="202628053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250418B">G09G3/3233</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫又卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, YU-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任珂銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN, KO-RUEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇韋任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鈺琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板。顯示面板包括畫素陣列、掃描驅動電路、發光啟始調整電路以及發光驅動電路。掃描驅動電路耦接畫素陣列，且接收掃描啟始信號，以提供依序致能的多個掃描信號到畫素陣列。發光啟始調整電路接收掃描啟始信號、發光啟始信號、以及重置啟始信號，以提供次級發光啟始信號，其中在掃描啟始信號為致能準位時，次級發光啟始信號固定為反相於致能準位的禁能準位。發光驅動電路耦接畫素陣列及發光啟始調整電路，且接收次級發光啟始信號，以提供依序致能的多個發光信號到畫素陣列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel is provided. The display panel includes a pixel array, a scan driving circuit, an emission start adjustment circuit and an emission driving circuit. The scan driving circuit is coupled to the pixel array and receives a scan start signal to provide a plurality of sequentially enabled scan signals to the pixel array. The emission start adjustment circuit receives the scan start signal, an emission start signal, and a reset start signal to provide a secondary emission start signal, wherein when the scan start signal is an enable level, the secondary emission start signal is fixed to a disabled level which is inverse to the enabled level. The emission driving circuit is coupled to the pixel array and the emission start adjustment circuit, and receives the secondary emission start signal to provide a plurality of sequentially enabled light-emitting signals to the pixel array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示面板</p>  
        <p type="p">110:畫素陣列</p>  
        <p type="p">120:掃描驅動電路</p>  
        <p type="p">130:發光啟始調整電路</p>  
        <p type="p">140:發光驅動電路</p>  
        <p type="p">150:重置電路</p>  
        <p type="p">160:補償電路</p>  
        <p type="p">Comp:補償信號</p>  
        <p type="p">Comp_CLK:補償時脈信號</p>  
        <p type="p">Comp_STV:補償啟始信號</p>  
        <p type="p">EM:發光信號</p>  
        <p type="p">EM_CLK:發光時脈信號</p>  
        <p type="p">EM_STV:發光啟始信號</p>  
        <p type="p">EM_STVre:次級發光啟始信號</p>  
        <p type="p">PX:自發光畫素電路</p>  
        <p type="p">Reset_CLK:重置時脈信號</p>  
        <p type="p">Reset_STV:重置啟始信號</p>  
        <p type="p">Reset:重置信號</p>  
        <p type="p">SCAN:掃描信號</p>  
        <p type="p">SCAN_CLK:掃描時脈信號</p>  
        <p type="p">SCAN_STV:掃描啟始信號</p>  
        <p type="p">Vdata:資料電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="216" publication-number="202628247"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628247.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺旋天線</chinese-title>  
        <english-title>HELICAL ANTENNA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250321B">H01Q11/08</main-classification>  
        <further-classification edition="200601120250321B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖彥傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YAN-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱冠傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱永承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, YONG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧峻誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳開璿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAI-SHYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯名峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, MING-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案關於一種螺旋天線，包含饋電板及四個輻射元件。饋電板架構於饋入訊號，且包含頂面。四個輻射元件分別電性連接於饋電板，且分別朝向遠離饋電板的相同方向螺旋地環繞形成介質空間，其中四個輻射元件係環狀間隔排列，且在平行於饋電板之頂面之任一截面為圓形。每一個輻射元件包含饋電單元及輻射部。饋電單元包含短路部及饋入部，其中短路部之一端連接於饋電板，饋入部間隔地鄰設於短路部之一側，且饋入部之一端連接於饋電板。輻射部架構於產生第一頻段之無線訊號收發。輻射部之一端連接於短路部，輻射部之另一端連接於饋入部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A helical antenna is disclosed and includes a feed plate and four radiating elements. The feed plate is configured to feed signals, and includes a top surface. The four radiating elements are electrically coupled with the feed plate, respectively. The four radiating elements spirally surround and extend in the same direction away from the feed plate to form a dielectric space. The four radiating elements are circularly arranged at intervals, and any cross-section of the four radiating elements parallel to the top surface of the feed plate is circular. Each of the radiating elements includes a feed unit and a radiating portion. The feed unit includes a short circuit portion and feed portion. An end of the short circuit portion is in connection to the feed plate. The feed portion is spaced adjacent to one side of the short-circuit portion, and an end of the feed portion is in connection to the feed plate. The radiating portion is configured to generate the wireless signal transmission and reception of a first frequency band. An end of the radiating portion is in connection with the short circuit portion, and the other end of the radiating portion is in connection with the feed portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:螺旋天線</p>  
        <p type="p">1:饋電板</p>  
        <p type="p">11:頂面</p>  
        <p type="p">2:輻射元件</p>  
        <p type="p">3:介質元件</p>  
        <p type="p">X:介質空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="217" publication-number="202628154"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628154.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微動開關</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">H01H13/26</main-classification>  
        <further-classification edition="200601120250324B">H01H13/20</further-classification>  
        <further-classification edition="200601120250324B">H01H13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新巨企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIPPY TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林杰毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微動開關，包含一基座，至少二導電端子及一訊號產生件。該基座具有一基礎部及二活動限制部，該至少二導電端子每一具有一接電部及一接觸部，該接觸部顯露於該二活動限制部其一的表面，該訊號產生件包含一活動座及一開關簧片，該開關簧片具有一埋設於該活動座內的基板，及複數可接觸複數該接觸部的外擴接腳，該些外擴接腳每一具有一連接該基板的連接端，及一與該連接端相對的自由端，該些外擴接腳的複數該自由端的水平高度高於該些外擴接腳的複數該連接端，該些外擴接腳的複數該自由端之間的距離大於該些外擴接腳的複數該連接端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:微動開關</p>  
        <p type="p">21:基座</p>  
        <p type="p">211:基礎部</p>  
        <p type="p">212:活動限制部</p>  
        <p type="p">213:活動空間</p>  
        <p type="p">214:定位塊</p>  
        <p type="p">22:導電端子</p>  
        <p type="p">221:接電部</p>  
        <p type="p">222:接觸部</p>  
        <p type="p">23:訊號產生件</p>  
        <p type="p">231:活動座</p>  
        <p type="p">232:開關簧片</p>  
        <p type="p">233:外擴接腳</p>  
        <p type="p">240:基板</p>  
        <p type="p">241:輔助安裝部</p>  
        <p type="p">243:穿孔</p>  
        <p type="p">244:操作塊</p>  
        <p type="p">245:切平面</p>  
        <p type="p">247:保護套</p>  
        <p type="p">26:彈性件</p>  
        <p type="p">27:外殼</p>  
        <p type="p">272:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="218" publication-number="202627722"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627722.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於光學變形的無人機導航方法以及使用該方法的無人機</chinese-title>  
        <english-title>DRONE NAVIGATION METHOD BASED ON OPTICAL DISTORTION AND DRONE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250325B">G05D1/243</main-classification>  
        <further-classification edition="202401120250325B">G05D1/46</further-classification>  
        <further-classification edition="202401120250325B">G05D1/246</further-classification>  
        <further-classification edition="202401320250325B">G05D109/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安國　律多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANGOT, LUDOVIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴源助</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YUAN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供基於光學變形的無人機導航方法以及使用該方法的無人機。方法包含：經由具有高光學變形特性之鏡頭的無人機的相機擷取環境影像；偵測影像中的參考物件以及參考線條；判定由參考線條所形成的區格並監測線條曲率；判定一個鄰近無人機的參考區格；根據區格邊界的曲率判定無人機在參考區格中的投影位置；根據導航任務判定目標運動方向並控制無人機的運動；以及基於監測到的邊界曲率持續更新無人機的投影位置以管理無人機的運動。此方法能實現不依賴GPS或外部標記的室內導航，顯著提升無人機在倉庫和工業設施等複雜室內環境中的操作性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A drone navigation method based on optical distortion and a drone using the same are provided. The method includes: capturing images of an environment using a drone's camera with high optical distortion properties; detecting a reference object and reference lines in the images; determining cells formed by the reference lines and monitoring curvatures of the lines; determining a reference cell adjacent to the drone; determining the drone's projected position in the reference cell based on curvatures of cell boundaries; determining a target motion direction according to a navigation task and controlling the drone's motion; and continuously updating the drone's projected position based on monitored boundary curvatures to manage the drone's motion. This method enables precise indoor navigation without relying on GPS or external markers, significantly enhancing drone operability in complex indoor environments such as warehouses and industrial facilities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310-S370:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="219" publication-number="202626197"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626197.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將二氧化碳轉化為甲醇的觸媒及甲醇的製備方法</chinese-title>  
        <english-title>CATALYST FOR CONVERTING CARBON DIOXIDE INTO METHANOL AND PREPARATION METHOD OF METHANOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">B01J23/72</main-classification>  
        <further-classification edition="200601120250117B">B01J23/06</further-classification>  
        <further-classification edition="200601120250117B">B01J21/04</further-classification>  
        <further-classification edition="200601120250117B">C07C29/153</further-classification>  
        <further-classification edition="200601120250117B">C07C29/154</further-classification>  
        <further-classification edition="200601120250117B">C07C31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣中油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CPC CORPORATION, TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴維新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林延壕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳朝鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-YUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仁耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YAW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李美津</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MAY-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種將二氧化碳轉化為甲醇的觸媒，其係包括：30~70重量份之銅(Cu)或其氧化物；20~50重量份之鋅(Zn)或其氧化物；2~10重量份之鋁(Al)或其氧化物；以及0.1~10重量份之第一改質劑，其係選自由銦(In)或其氧化物及鈰(Ce)或其氧化物所組成之群組。本發明之將二氧化碳轉化為甲醇的觸媒係適用於甲醇之生產。本發明亦關於一種甲醇的製備方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A catalyst for converting carbon dioxide into methanol, which includes: 30 to 70 parts by weight of copper (Cu) or oxide thereof; 20 to 50 parts by weight of zinc (Zn) or oxide thereof; 2 to 10 parts by weight of aluminum (Al) or oxide thereof; and 0.1 to 10 parts by weight of first modifier, which is selected from the group consisting of indium (In) or oxide thereof and cerium (Ce) or oxide thereof. The catalyst for converting carbon dioxide into methanol of the present invention is suitable for the production of methanol. The invention also relates to a method for preparing methanol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="220" publication-number="202628037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素電路以及顯示面板</chinese-title>  
        <english-title>PIXEL CIRCUIT AND DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G09G3/30</main-classification>  
        <further-classification edition="200601120250501B">G02F1/13</further-classification>  
        <further-classification edition="200601120250501B">G06F3/042</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錼創顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLAYNITRIDE DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖冠詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, KUAN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅政祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴彥任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YEN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素電路以及顯示面板被提出。畫素電路包括驅動電路、選擇電路、發光元件以及訊號處理器。驅動電路受控於資料訊號。選擇電路根據畫素電路的模式以被導通或斷開。發光元件在光感測模式中，透過感測光訊號的亮度以產生感測訊號。訊號處理器根據感測訊號與參考電壓以產生光感測資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel circuit and a display panel are provided. The pixel circuit includes a driving circuit, a selection circuit, a light emitting component and a signal processor. The driving circuit is controlled by a data signal. The selection circuit is turned-on or cut-off according to a mode of the pixel circuit. The light emitting component generates, in a light sensing mode, a sensing signal by sensing a luminance of a light signal. The signal processor generates a light sensing information according to the sensing signal and a reference voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:畫素電路</p>  
        <p type="p">110:驅動電路</p>  
        <p type="p">120:選擇電路</p>  
        <p type="p">130:發光元件</p>  
        <p type="p">140:訊號處理器</p>  
        <p type="p">DA1:資料訊號</p>  
        <p type="p">ELVDD:電源電壓</p>  
        <p type="p">ELVSS:參考接地電壓</p>  
        <p type="p">SLD:感測訊號</p>  
        <p type="p">SS1:選擇訊號</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">VSO:光感測資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="221" publication-number="202627654"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627654.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>投影裝置</chinese-title>  
        <english-title>PROJECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250319B">G03B21/14</main-classification>  
        <further-classification edition="202101120250319B">G02B7/02</further-classification>  
        <further-classification edition="200601120250319B">H04N9/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中強光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方祖彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, TSU-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種投影裝置，包括光機模組、投影鏡頭模組、感測器以及至少一個處理器。投影鏡頭模組設置在來自光機模組的影像光束的傳遞路徑上，用以將影像光束投射出投影裝置。投影鏡頭模組包括投影鏡頭以及用以調整投影鏡頭的位置的透鏡調整模組。感測器用以感測投影裝置的擺放狀態。所述至少一個處理器耦接於感測器並耦接於光機模組以及透鏡調整模組中的至少其中之一。所述至少一個處理器用以根據投影裝置的擺放狀態調整提供至光機模組以及透鏡調整模組中的至少其中之一的控制訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A projection device includes an optical engine module, a projection lens module, a sensor and at least one processor. The projection lens module is disposed on a transmission path of the image beam from the optical engine module and is configured to project the image beam out of the projection device. The projection lens module includes a projection lens and a lens adjustment module configured to adjust a position of the projection lens. The sensor is configured to sense a placement status of the projection device. The at least one processor is coupled to the sensor and to at least one of the optical engine module and the lens adjustment module. The at least one processor is configured to adjust a control signal provided to at least one of the optical engine module and the lens adjustment module according to the placement status of the projection device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:投影裝置</p>  
        <p type="p">10:光機模組</p>  
        <p type="p">11:投影鏡頭模組</p>  
        <p type="p">12:感測器</p>  
        <p type="p">13:處理器</p>  
        <p type="p">110:投影鏡頭</p>  
        <p type="p">111:透鏡調整模組</p>  
        <p type="p">CS10、CS11:控制訊號</p>  
        <p type="p">MB:影像光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="222" publication-number="202627290"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627290.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻系統的補液治具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250207B">F01P5/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元鈦科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>META GREEN COOLING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳茂欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱佳建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHIA-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳敏瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, REX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷卻系統的補液治具，適於由一冷卻液槽對一冷卻系統補充冷卻液，該冷卻系統的補液治具包含：一補液泵，具有一進液部；一管路組，包括一第一管路及一第二管路，該第一管路適於連通該補液泵的進液部與該冷卻液槽，該第二管路適於連通該第一管路與該冷卻液槽；一副泵，設於該第二管路，適於驅使該第二管路內的流體流動；及一電流控制器，電性連接該副泵，用以對該副泵提供運作電力及控制該副泵的運作時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:補液泵</p>  
        <p type="p">2:管路組</p>  
        <p type="p">21:第一管路</p>  
        <p type="p">22:第二管路</p>  
        <p type="p">23:第三管路</p>  
        <p type="p">3:副泵</p>  
        <p type="p">4:電流控制器</p>  
        <p type="p">5:外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="223" publication-number="202627467"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627467.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濕度感測裝置</chinese-title>  
        <english-title>HUMIDITY SENSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G01N27/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慶森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曠舉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUANG-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供濕度感測裝置。濕度感測裝置包括基板、第一介電層、阻擋層、第二介電層、感測電極、覆蓋層及感測材料層。第一介電層設置於基板上。阻擋層設置於第一介電層上。第二介電層設置於阻擋層上。第二介電層包括複數個凸部。感測電極設置於複數個凸部上。覆蓋層設置於感測電極上。感測材料層設置於覆蓋層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A humidity sensing device is provided. The humidity sensing device includes a substrate, a first dielectric layer, a barrier layer, a second dielectric layer, a sensing electrode, a covering layer, and a sensing material layer. The first dielectric layer is disposed on the substrate. The barrier layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the barrier layer. The second dielectric layer includes a plurality of protruding portions. The sensing electrode is disposed on the plurality of protruding portions. The covering layer is disposed on the sensing electrode. The sensing material layer is disposed on the covering layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:濕度感測裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">120:第一介電層</p>  
        <p type="p">140:阻擋層</p>  
        <p type="p">160:第二介電層</p>  
        <p type="p">162:凸部</p>  
        <p type="p">200:感測電極</p>  
        <p type="p">300:覆蓋層</p>  
        <p type="p">400:感測材料層</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">s1:間隔</p>  
        <p type="p">t1:第一厚度</p>  
        <p type="p">t2:第二厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="224" publication-number="202627468"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627468.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濕度感測裝置</chinese-title>  
        <english-title>HUMIDITY SENSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G01N27/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慶森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曠舉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUANG-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供濕度感測裝置。濕度感測裝置包括基板、第一介電層、第二介電層、感測電極及感測材料層。第一介電層設置於基板上。第二介電層設置於第一介電層上。其中，第二介電層包括複數個凸部，且複數個凸部中的每一個彼此分離。感測電極設置於複數個凸部上。感測材料層設置於感測電極上。其中，複數個凸部中的每一個的頂部寬度小於底部寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A humidity sensing device is provided. The humidity sensing device includes a substrate, a first dielectric layer, a second dielectric layer, a sensing electrode, and a sensing material layer. The first dielectric layer is disposed on the substrate. The second dielectric layer is disposed on the first dielectric layer. Wherein, the second dielectric layer includes a plurality of protruding portions, and each protruding portion is separated from other. The sensing electrode is disposed on the plurality of protruding portions. The sensing material layer is disposed on the sensing electrode. Wherein, a top width of the protruding portion is less than a bottom width of the protruding portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:濕度感測裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">120:第一介電層</p>  
        <p type="p">140:阻擋層</p>  
        <p type="p">160:第二介電層</p>  
        <p type="p">162,402:凸部</p>  
        <p type="p">162wt:頂部寬度</p>  
        <p type="p">162wb:底部寬度</p>  
        <p type="p">162S1,162S2:側表面</p>  
        <p type="p">164:平坦部分</p>  
        <p type="p">200:感測電極</p>  
        <p type="p">222:側壁部分</p>  
        <p type="p">224:頂部部分</p>  
        <p type="p">300:覆蓋層</p>  
        <p type="p">400:感測材料層</p>  
        <p type="p">400P1:第一部分</p>  
        <p type="p">400P2:第二部分</p>  
        <p type="p">A1:角度</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">t1:第一厚度</p>  
        <p type="p">t2:第二厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="225" publication-number="202628402"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628402.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149582</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減輕網路封包負載的方法及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR REDUCING NETWORK PACKET LOAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L47/10</main-classification>  
        <further-classification edition="202201120250303B">H04L47/125</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁家陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHIA-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種減輕網路封包負載的方法，由一裝置所執行，包括：接收來自一乙太網路實體層的網路封包至一接收槽中；判斷位於上述接收槽中上述網路封包之一封包計數值是否超過一中間門檻值；以及當上述封包計數值超過上述中間門檻值時，根據一黑名單過濾掉來自在上述黑名單中媒體存取控制位址的第一網路封包。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for reducing network packet load is provided. The method is executed by a device, and includes: receiving network packets from an Ethernet physical layer into a receiving slot; determining whether the packet count value of the network packets located in the receiving slot exceeds an intermediate threshold; and filtering out first network packets from media access control addresses in a blacklist according to the blacklist when the packet count value exceeds the intermediate threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">S305,S310,S315,S320,S325,S330,S335:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="226" publication-number="202627430"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627430.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱電偶溫度採集裝置</chinese-title>  
        <english-title>THERMOCOUPLE TEMPERATURE ACQUISITION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250318B">G01K7/02</main-classification>  
        <further-classification edition="200601120250318B">G01K7/10</further-classification>  
        <further-classification edition="200601120250318B">G01R27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>研華股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炳彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BIING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種熱電偶溫度採集裝置，適於連接一熱電偶導線。該熱電偶溫度採集裝置包含一機殼、一電路板、一接線總成及一溫度感測組件。該機殼形成有一容置空間。該接線總成部分外露出該機殼。該接線總成外露出該機殼的部位用以供該熱電偶導線連接並與該熱電偶導線形成一冷端。該溫度感測組件包括一溫度感測器及一熱傳導元件。該溫度感測器電性連接於該電路板。該熱傳導元件設置於該溫度感測器且部分外露出該機殼並鄰近於該接線總成外露出該機殼的部位。該溫度感測器通過該熱傳導元件量測該冷端的溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermocouple temperature acquisition device, is adapted for connecting at least one thermocouple wire. The thermocouple temperature acquisition device includes a housing, a circuit board, a wiring assembly and a temperature sensing component. The housing is formed with a receiving space. The wiring assembly is partially exposed from the housing. The portion of the wiring assembly exposed from the housing is used for connecting the thermocouple wire and forming a cold end with the thermocouple wire. The temperature sensing component includes a temperature sensor and a thermal conductive element. The temperature sensor is electrically connected to the circuit board. The thermal conductive element is disposed on the temperature sensor and is partially exposed from the housing and is adjacent to the portion of the wiring assembly that is exposed from the housing. The temperature sensor measures the temperature of the cold end through the thermal conductive element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:容置空間</p>  
        <p type="p">22:蓋體</p>  
        <p type="p">221:開孔</p>  
        <p type="p">223:端壁面</p>  
        <p type="p">225:定位孔</p>  
        <p type="p">226:開口</p>  
        <p type="p">3:電路板</p>  
        <p type="p">311:導電通孔</p>  
        <p type="p">4:接線總成</p>  
        <p type="p">41:插座連接器</p>  
        <p type="p">42:插頭連接器</p>  
        <p type="p">5:溫度感測組件</p>  
        <p type="p">51:溫度感測器</p>  
        <p type="p">511:本體</p>  
        <p type="p">512:引腳</p>  
        <p type="p">52:熱傳導元件</p>  
        <p type="p">520:遮罩</p>  
        <p type="p">521:凸柱</p>  
        <p type="p">522:容置凹槽</p>  
        <p type="p">525:斜面</p>  
        <p type="p">526:切平面</p>  
        <p type="p">527:外露部</p>  
        <p type="p">528:弧形導引面</p>  
        <p type="p">529:擋止肩面</p>  
        <p type="p">53:絕緣支撐塊</p>  
        <p type="p">531:穿槽</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="227" publication-number="202626335"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626335.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149606</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>標誌外形模仿壓合設備</chinese-title>  
        <english-title>SIMULATION PRESSING EQUIPMENT OF THE LOGO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250417B">B29C51/30</main-classification>  
        <further-classification edition="200601120250417B">B29C51/26</further-classification>  
        <further-classification edition="200601120250417B">B29C51/18</further-classification>  
        <further-classification edition="200601120250417B">B29C45/47</further-classification>  
        <further-classification edition="201901120250417B">B29C48/265</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鞠強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種標誌外形模仿壓合設備，包括：支撐架；傳送機構，設置在所述支撐架上，用於沿第一方向傳送產品；壓合機構，位於所述傳送機構的上方，所述壓合機構包括固定板、壓合支架、壓合驅動件以及壓頭元件，所述壓合驅動件透過所述固定板設置在所述支撐架上，殼體的各個外側壁上分別設置有不同的壓頭。當需要使用不同的壓頭時，轉動驅動件驅動殼體沿自身軸線轉動，使殼體的外側壁進行輪換並使載有對應壓頭的外側壁面向產品。以使殼體的不同外側壁能夠面對待壓合的產品，從而能夠針對不同產品改變壓頭。本方案結構簡單，成本低，節省人工成本的同時還能夠節省更換壓頭的時間，從而提高生產效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A simulation pressing equipment of the logo includes support frame, transmission mechanism and pressing mechanism. The transmission mechanism is set on the support frame to use to deliver products along a first direction. The pressing mechanism is located above the transmission mechanism. The pressing mechanism includes a fixing plate, a pressing frame, a pressing driver and a pressure head component. The pressing driver is arranged on the support frame through the fixing plate. Different pressure heads are set on each outer wall of a case respectively. The case is rotated along its own axis by a rotating driver component that alternate the outer walls of the case so that the outer wall carrying the corresponding pressure head faces the product when different pressure heads are required to be used. Different outer walls of the case can face the to-be-pressed products to change the pressure head for different products. This solution has a simple structure and low cost. The invention not only saves labor costs, but also saves the time of changing the pressure head to improve production efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:壓頭組件</p>  
        <p type="p">32:固定板</p>  
        <p type="p">33:壓合支架</p>  
        <p type="p">331:滑桿</p>  
        <p type="p">34:壓合驅動件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="228" publication-number="202627295"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627295.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風力發電裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250318B">F03D7/04</main-classification>  
        <further-classification edition="201601120250318B">F03D80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風力發電裝置，包含一固定單元；一風車單元，位於該固定單元一端，包含一具有一傳動軸的葉片組及一相對該葉片組並具一固定軸的風向舵；一剎車單元，包含一位於該葉片組與該風向舵間的剎車組，各與該傳動軸和該固定軸連接；一旋轉單元，連接該葉片組與該剎車單元，以迎風驅使該葉片組轉向；一傳動單元，位於該固定單元另一端並樞接該葉片組，包含一第一動力裝置、一第一變速裝置、一具有一離合器的第二變速裝置及一第二動力裝置；以及一發電裝置，該發電裝置於該第二動力裝置轉動連接以帶動該發電裝置轉動，以使該離合器隨轉速提高推動該第二變速裝置進行變速，增加發電效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:風力發電裝置</p>  
        <p type="p">2:固定單元</p>  
        <p type="p">21:第一固定架</p>  
        <p type="p">22:第二固定架</p>  
        <p type="p">23:第三固定架</p>  
        <p type="p">2311:入口</p>  
        <p type="p">235:樓梯組</p>  
        <p type="p">2351:第一樓梯</p>  
        <p type="p">2352:第二樓梯</p>  
        <p type="p">24:第一框體</p>  
        <p type="p">244:電磁閘</p>  
        <p type="p">25:第二框體</p>  
        <p type="p">26:第三框體</p>  
        <p type="p">3:風車單元</p>  
        <p type="p">31:外殼</p>  
        <p type="p">32:葉片組</p>  
        <p type="p">321:傳動軸</p>  
        <p type="p">322:葉片</p>  
        <p type="p">323:第一軸承座</p>  
        <p type="p">324:第二軸承座</p>  
        <p type="p">325:第三軸承座</p>  
        <p type="p">326:從動傘齒輪</p>  
        <p type="p">33:風向舵</p>  
        <p type="p">331:固定軸</p>  
        <p type="p">4:剎車單元</p>  
        <p type="p">41:前剎車驅動環</p>  
        <p type="p">42:後剎車驅動環</p>  
        <p type="p">43:剎車組</p>  
        <p type="p">431:立式框架</p>  
        <p type="p">432:剎車板</p>  
        <p type="p">4321:穿孔</p>  
        <p type="p">4322:推動件</p>  
        <p type="p">433:電磁閥件</p>  
        <p type="p">45:碟剎盤</p>  
        <p type="p">5:旋轉單元</p>  
        <p type="p">513:維修孔</p>  
        <p type="p">6:傳動單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="229" publication-number="202626446"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626446.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>收束裝置</chinese-title>  
        <english-title>CABLE TIE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">B65B13/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>益實實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELKA INTERNATIONAL LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林凱炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KAI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧友元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, YOU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">收束裝置包含帶體、環形結構、第一收縮結構以及第二收縮結構。環形結構設置於帶體頂端。第一收縮結構經由帶體連接至環形結構。第二收縮結構經由帶體連接至第一收縮結構。其中第二收縮結構具有大於環形結構的內徑的舒張尺寸，且具有小於內徑的收縮尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cable tie comprises a belt body, an annular structure, a first contraction structure, and a second contraction structure. The annular structure is arranged at a top end of the belt body. The first contraction structure is connected to the annular structure through the belt body. The second contraction structure is connected to the first contraction structure through the belt body. The second contraction structure has a structure dimension larger than an inner diameter of the annular structure, and a contraction dimension smaller than the inner diameter of the annular structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:收束裝置</p>  
        <p type="p">110:帶體</p>  
        <p type="p">111:第一子段</p>  
        <p type="p">112:第二子段</p>  
        <p type="p">113:第三子段</p>  
        <p type="p">114:第四子段</p>  
        <p type="p">120:環形結構</p>  
        <p type="p">130:第一收縮結構</p>  
        <p type="p">140:第二收縮結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="230" publication-number="202627995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼筋支數計算系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250318B">G06V10/25</main-classification>  
        <further-classification edition="202201120250318B">G06V10/44</further-classification>  
        <further-classification edition="202201120250318B">G06V20/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東和鋼鐵企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許溦芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁華建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉易儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘俞宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種鋼筋支數計算系統，主要包括:輸送設備、影像處理模組、物件偵測模組及支數判斷模組，其中輸送設備以同方向平放複數鋼筋並輸送至剪裁區域，影像處理模組對剪裁區域擷取影像資訊，並且對影像資訊進行切割形成複數影像圖象，針對各影像圖像界定至少一橫向形成之基準線，由物件偵測模組接收來自影像處理單元完成基準線標記的各影像圖像，同時各影像圖像以基準線為基準，根據各鋼筋位置並處於交叉處而生成特徵判斷區，支數判斷模組接收各影像圖像生成的各特徵判斷區進行支數分析，並以數量最大化為主計算出一標準支數圖像並儲存置一資料庫，藉此於生產流程中加入鋼筋支數自動計算功能，無須更動原有生產設備及流程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:系統</p>  
        <p type="p">10:輸送設備</p>  
        <p type="p">100:剪裁區域</p>  
        <p type="p">12:影像處理模組</p>  
        <p type="p">120:影像擷取單元</p>  
        <p type="p">122:影像處理單元</p>  
        <p type="p">14:物件偵測模組</p>  
        <p type="p">16:支數判斷模組</p>  
        <p type="p">18:資料庫</p>  
        <p type="p">3:顯示設備</p>  
        <p type="p">4:剪裁控制設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="231" publication-number="202627715"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627715.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁鋼片塗覆膜厚預測系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR PREDICTING THICKNESS OF ELECTROMAGNETIC STEEL SHEET COATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G05B19/404</main-classification>  
        <further-classification edition="200601120260302B">G05B19/414</further-classification>  
        <further-classification edition="202301120260302B">G06Q10/04</further-classification>  
        <further-classification edition="201901120260302B">G06N20/20</further-classification>  
        <further-classification edition="202601120260302B">C21D8/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電磁鋼片塗覆膜厚預測系統，包含：製程控制伺服器、製程資料庫、以及膜厚預測伺服器。其中製程控制伺服器用以控制電磁鋼片之塗覆製程，且經由控制產生參數資料。膜厚預測伺服器，包含膜厚預測模組及膜厚誤差補償模組，膜厚預測模組用以根據參數資料以膜厚預測模型預測經塗覆製程之電磁鋼片之初始膜厚預測值；膜厚誤差補償模組用以根據參數資料以膜厚誤差補償模型預測塗覆製程之電磁鋼片之膜厚補償值；膜厚預測伺服器根據初始膜厚預測值及膜厚補償值計算最終膜厚預測值。製程控制伺服器根據最終膜厚預測值判斷是否調整製程參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for predicting electromagnetic steel sheet coating thickness includes: a process control server, a process database, and a film thickness prediction server. The process control server is used for controlling a coating process of an electromagnetic steel sheet and generating a parameter data through the control. The film thickness prediction server includes a film thickness prediction module and a film thickness error compensation module. The film thickness prediction module is used for predicting an initial film thickness prediction value of the electromagnetic steel sheet after the coating process based on the parameter data using the film thickness prediction model, and the film thickness error compensation module is used for predicting the film thickness compensation value of the electromagnetic steel sheet in the coating process based on the parameter data using the film thickness error compensation model. The film thickness prediction server calculates the final film thickness prediction value based on the initial film thickness prediction value and the film thickness compensation value. The process control server is further used for determining whether to adjust a process parameter based on the final film thickness prediction value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電磁鋼片塗覆膜厚預測系統</p>  
        <p type="p">110:膜厚預測伺服器</p>  
        <p type="p">111:膜厚預測模組</p>  
        <p type="p">112:膜厚誤差補償模組</p>  
        <p type="p">120:製程資料庫</p>  
        <p type="p">130:製程控制伺服器</p>  
        <p type="p">131:歷史資料更新模組</p>  
        <p type="p">140:人機介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="232" publication-number="202627912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149633</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物件資訊管理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250422B">G06Q10/08</main-classification>  
        <further-classification edition="200601120250422B">G06K19/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>振鈺數位服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICONNECT, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王信隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物件資訊管理方法，包含下列步驟：A. 一電子裝置連線到一伺服器，該電子裝置於該伺服器中建立一物件表單，該物件表單包括複數個第一資料欄位與複數個第二資料欄位。B. 該電子裝置讀取一無線射頻標籤，以取得該無線射頻標籤中的一唯一識別碼且傳送到該伺服器。C. 該電子裝置將一連結網址寫入該無線射頻標籤。D. 該伺服器將該物件表單之該些第二資料欄位傳送至一儲存平台以形成一組物件資訊，該儲存平台的一數位產品護照網頁連結該組物件資訊；該連結網址用以連結到該儲存平台的該數位產品護照網頁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11:步驟</p>  
        <p type="p">S12:步驟</p>  
        <p type="p">S13:步驟</p>  
        <p type="p">S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="233" publication-number="202626163"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626163.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>體感模擬系統及其對位控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">A63G31/02</main-classification>  
        <further-classification edition="200601120250512B">A47C1/022</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智崴資訊科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROGENT TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于宗玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種體感模擬系統，於基礎面設置球幕與觀影平台，觀影平台具有高低不同的多個支撐平台，於各支撐平台上設置體感裝置，各體感裝置具有一多方向運動機構，於多方向運動機構結合一載座，於載座結合一角度調整機構，於角度調整機構結合一座椅；各角度調整機構用以帶動各座椅俯仰轉動，使各座椅於一初始狀態與一對位狀態之間變化；藉此，當體感模擬系統開始運作時，每一角度調整機構先將對應的座椅由初始狀態變為對位狀態，使乘坐於各座椅的使用者的視線大致朝向球幕的中心，再由各多方向運動機構驅動各座椅運動，藉此提升體感娛樂的觀影效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:體感模擬系統</p>  
        <p type="p">10:基礎面</p>  
        <p type="p">20:球幕顯示裝置</p>  
        <p type="p">22:球幕支架</p>  
        <p type="p">24:球幕</p>  
        <p type="p">241:凹球面</p>  
        <p type="p">242:中心</p>  
        <p type="p">30:觀影平台</p>  
        <p type="p">32:支撐平台</p>  
        <p type="p">321:自由端</p>  
        <p type="p">40:體感裝置</p>  
        <p type="p">S:觀看點</p>  
        <p type="p">L:旋轉軸</p>  
        <p type="p">X:X軸</p>  
        <p type="p">Y:Y軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="234" publication-number="202626445"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626445.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149635</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種低溫碳化農廢發電整合系統</chinese-title>  
        <english-title>A LOW-TEMPERATURE CARBONIZED AGRICULTURAL WASTE POWER GENERATION INTEGRATED SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251105B">B64U50/33</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEILIN HOLDINGS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林能源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁敏航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, MIN-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊茹媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李武燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WU-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種低溫碳化農廢發電整合系統，包括：一破碎模組，用於將一廢棄物料破碎成一破碎物料；一微波裂解模組，設置於該破碎模組之後，接收來自該破碎模組的破碎物料，用於將該破碎物料進行300℃到600℃之間的微波加熱反應，分解成一固態產物與一氣態產物；一渦輪發電模組，設置於該微波裂解模組之後，接收來自該微波裂解模組的該氣態產物，用於將該氣態產物進行燃燒發電，以產生一電力。本發明之低溫碳化農廢發電整合系統，可以整合單一貨櫃中，輕易地移動到廢棄物料區域進行發電，減少廢棄物料的清運產生的碳足跡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a low-temperature carbonized agricultural waste power generation integrated system, including: a crushing module for crushing a waste material into a broken material; a microwave pyrolysis module, installed behind the crushing module to receive the broken material from the crushing module, performing a microwave heating reaction between 300℃ to 600℃ on the broken materials and decompose them into a solid product and a gaseous product; a turbine power generation module, installed behind the microwave pyrolysis module to receive the gaseous product from the microwave cracking module, burning the gaseous product to generate electricity to generate electricity. The low-temperature carbonized agricultural waste power generation integrated system of this present invention can be integrated into a single container and easily moved to the waste material area for power generation, thereby reducing the carbon footprint caused by the removal of waste materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:低溫碳化農廢發電整合系統</p>  
        <p type="p">5:破碎模組</p>  
        <p type="p">10:微波裂解模組</p>  
        <p type="p">15:渦輪發電模組</p>  
        <p type="p">20:儲能模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="235" publication-number="202626148"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626148.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兼具動力及無動力模式的跑步裝置</chinese-title>  
        <english-title>A RUNNING DEVICE HAVING BOTH POWERED AND NON-POWERED MODES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250319B">A63B22/02</main-classification>  
        <further-classification edition="200601120250319B">A63B21/005</further-classification>  
        <further-classification edition="200601120250319B">A63B24/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力山工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REXON INDUSTRIAL CORP.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文都</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEN-TU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兼具動力及無動力模式的跑步裝置，包含一機架單元、一跑帶單元、一動力單元，及一阻力單元。該動力單元包括一驅動馬達，及一傳動機構，該驅動馬達具有一輸出轉軸，該輸出轉軸具有一與該傳動機構連接的出力端部，及一阻力端部，當該驅動馬達在一動力模式時，該驅動馬達可經由該傳動機構驅動該跑帶單元，當該驅動馬達在一無動力模式時，該驅動馬達停止主動運轉。該阻力單元包括一設置於該阻力端部的不導磁飛輪，及一與該機架單元連接的永久磁阻模組，當該永久磁阻模組在一非作用位置時，該永久磁阻模組脫離該不導磁飛輪，當該永久磁阻模組在一作用位置時，該永久磁阻模組鄰近於該不導磁飛輪，當該驅動馬達在該無動力模式且該永久磁阻模組在該作用位置時，該永久磁阻模組用於對該不導磁飛輪產生磁阻力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A running device having both powered and non-powered modes comprises a frame unit, a running unit, a power unit, and a resistance unit. The power unit includes a driving motor and a transmission mechanism. The driving motor has an output rotary shaft with an output end connected with the transmission mechanism, and a resistance end. When the driving motor is in a powered mode, the driving motor is operable to drive the running belt unit through the transmission mechanism. When the driving motor is in a non - powered mode, the driving motor stops active operation. The resistance unit includes a non - magnetic flywheel disposed on the resistance end, and a permanent magnetic resistance module connected to the frame unit. When the permanent magnetic resistance module is in an inactive position, the permanent magnetic resistance module disengages from the non - magnetic flywheel. When the permanent magnetic resistance module is in an active position, the permanent magnetic resistance module is adjacent to the non - magnetic flywheel. When the driving motor is in the non - powered mode and the permanent magnetic resistance module is in the active position, the permanent magnetic resistance module is used to generate a magnetic resistance force on the non - magnetic flywheel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:底架</p>  
        <p type="p">12:第一安裝座</p>  
        <p type="p">13:第二安裝座</p>  
        <p type="p">31:驅動馬達</p>  
        <p type="p">312:輸出轉軸</p>  
        <p type="p">314:阻力端部</p>  
        <p type="p">40:阻力單元</p>  
        <p type="p">41:不導磁飛輪</p>  
        <p type="p">42:驅動模組</p>  
        <p type="p">43:永久磁阻模組</p>  
        <p type="p">431:永久磁鐵</p>  
        <p type="p">44:螺桿</p>  
        <p type="p">45:擺臂</p>  
        <p type="p">451:臂板</p>  
        <p type="p">46:作動馬達</p>  
        <p type="p">461:內轉動件</p>  
        <p type="p">47:磁阻安裝座</p>  
        <p type="p">471:側板</p>  
        <p type="p">50:感應單元</p>  
        <p type="p">51:第一感應開關</p>  
        <p type="p">52:第二感應開關</p>  
        <p type="p">60:控制單元</p>  
        <p type="p">X:長度方向</p>  
        <p type="p">Y:橫方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="236" publication-number="202626212"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626212.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149638</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免控場域導滑架及應用其之自走式清洗系統</chinese-title>  
        <english-title>FIELD-FREE GUIDE SLIDING FRAME AND SELF-PROPELLED CLEANING SYSTEMS USING THEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250319B">B08B1/30</main-classification>  
        <further-classification edition="200601120250319B">B08B13/00</further-classification>  
        <further-classification edition="201401120250319B">H02S40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄紫琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄紫琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳居亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種免控場域導滑架及其應用結構，其特點主要包括:一滑座部；一水管跨置部設於滑座部下方，該水管跨置部之型態須能供軟式水管局部區段跨置限位；一限位旋接關節，連設於滑座部與水管跨置部之間，該限位旋接關節包括頸座部及旋設於頸座部之旋轉件，其中頸座部連設於滑座部，旋轉件則連設於水管跨置部，且旋轉件能夠相對於座部進行轉動，且藉由角度限位結構的設置，使旋轉件之轉動具有一最大擺角行程範圍，所述最大擺角行程範圍係介於30度至60度之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a field-free guide sliding frame and an application structure thereof, comprising:A sliding seat portion, onfigured to serve as a foundational component.A water pipe straddling portion, disposed beneath the sliding seat portion, wherein the water pipe straddling portion is shaped to permit a local section of a flexible water pipe to straddle and be positionally limited.A limiting rotary joint, disposed between the sliding seat portion and the water pipe straddling portion, the limiting rotary joint comprising:A neck seat portion, integrally connected to the sliding seat portion.A rotary member, rotatably attached to the neck seat portion and integrally connected to the water pipe straddling portion. The rotary member is configured to rotate relative to the neck seat portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:免控場域導滑架</p>  
        <p type="p">10:軟式水管</p>  
        <p type="p">20:滑座部</p>  
        <p type="p">30:軌道</p>  
        <p type="p">40:水管跨置部</p>  
        <p type="p">41:拱形面</p>  
        <p type="p">42:擋緣</p>  
        <p type="p">50:限位旋接關節</p>  
        <p type="p">51:頸座部</p>  
        <p type="p">52:旋轉件</p>  
        <p type="p">60:角度限位結構</p>  
        <p type="p">61:凸塊</p>  
        <p type="p">62:抵擋部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="237" publication-number="202625993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具肩、肘關節主動式動力上肢外骨骼系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">A61H1/02</main-classification>  
        <further-classification edition="200601120250228B">B25J17/00</further-classification>  
        <further-classification edition="200601120250228B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任國光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN, KUO-KUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝叔達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHU-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳尚儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHANG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃克臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KE-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊晉淯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李聯旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, LIAN-WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具肩、肘關節主動式動力上肢外骨骼系統，包括：一電力模組，係用以提供電力；一肩部模組，包含一肩關節馬達控制艙、一肩關節馬達轉子及一懸臂梁機構，該肩關節馬達控制艙係用以控制該肩關節馬達轉子；一肩部滑動模組，設置於該電力模組與肩部模組間，該肩部滑動模組樞接該肩部模組；一肘部模組，包含一肘關節馬達控制艙及一肘關節馬達轉子，該肘關節馬達控制艙係用以控制該肘關節馬達轉子。藉此，製備出一種肩部具有多維自由度、適用不同體型的主動式動力上肢外骨骼系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">110:電力模組</p>  
        <p type="p">121:肩關節馬達控制艙</p>  
        <p type="p">122:肩關節馬達轉子</p>  
        <p type="p">132:第二懸臂梁</p>  
        <p type="p">141:滑軌</p>  
        <p type="p">142:滑車</p>  
        <p type="p">143:綁帶區</p>  
        <p type="p">151:肘關節馬達控制艙</p>  
        <p type="p">152:肘關節馬達轉子</p>  
        <p type="p">160:前臂機構</p>  
        <p type="p">170:長度調整機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="238" publication-number="202625988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具安全操作功能之上肢外骨骼裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">A61F2/68</main-classification>  
        <further-classification edition="200601120250325B">A61F2/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任國光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN, KUO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝叔達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHU-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳尚儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHANG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐愷辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYU, KAI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊晉淯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李聯旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, LIAN-WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種具安全操作功能之上肢外骨骼裝置，係包括：係包括：一本體，其具有一背部結構與二手部結構，該二手部結構分別具有一肩關節單元與一肘關節單元，該肩關節單元；二角度感測器，係分別設置於該肩關節單元，用於感測該肩關節單元之旋轉角度；二驅動馬達，係設置於該背部結構上，分別透過二串聯彈性致動器與二驅動線連接至該二手部結構，並驅動該二手部結構之肩關節單元旋轉；一電源單元，係供應該上肢外骨骼裝置之各元件運作所需之電力；一操控介面，係由該使用者穿戴，用於發送控制命令；一主控制器單元，係設置於該背部結構上，係接收該角度感測器之旋轉角度訊號與該控制命令，用以控制該驅動馬達。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">11:背部結構</p>  
        <p type="p">12:手部結構</p>  
        <p type="p">12A:肩關節單元</p>  
        <p type="p">12B:肘關節單元</p>  
        <p type="p">13:角度感測器</p>  
        <p type="p">14:驅動馬達</p>  
        <p type="p">141:串聯彈性致動器</p>  
        <p type="p">142:驅動線</p>  
        <p type="p">14A:棘爪與棘輪模組</p>  
        <p type="p">15:電源單元</p>  
        <p type="p">16:操控介面</p>  
        <p type="p">17:主控制器單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="239" publication-number="202628345"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628345.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓控振盪器結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H03B5/12</main-classification>  
        <further-classification edition="200601120250701B">H03B1/04</further-classification>  
        <further-classification edition="200601120250701B">H03B5/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高瑄苓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, HSUAN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種壓控振盪器結構，其係為一種用於通訊電路之壓控振盪器結構，該結構係包括一交叉耦合電路及一傳輸線模組，其中，該交叉耦合電路係具有一第一電晶體、一第一電容、一第二電晶體，及一第二電容，該傳輸線模組係具有第一傳輸線單元及第二傳輸線單元，透過該傳輸線模組消除該交叉耦合電路之傳輸線效應，藉以降低該壓控振盪器的相位雜訊，進一步達到提升通訊頻率範圍之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">21:交叉耦合電路</p>  
        <p type="p">22:傳輸線模組</p>  
        <p type="p">211:第一電晶體</p>  
        <p type="p">212:第一電容</p>  
        <p type="p">213:第二電晶體</p>  
        <p type="p">214:第二電容</p>  
        <p type="p">221:第一傳輸線單元</p>  
        <p type="p">222:第二傳輸線單元</p>  
        <p type="p">S1、S2:汲極</p>  
        <p type="p">G1、G2:閘極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="240" publication-number="202627521"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627521.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於４Ｄ雷達輔助高度偵測系統及其影像偵測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G01S13/88</main-classification>  
        <further-classification edition="200601120250303B">G01S13/89</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭有崧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡士哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, SHIH-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張峰嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FENG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊定為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花凱龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, KAI-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種基於4D雷達輔助高度偵測系統，該系統係包括一影像模組、一影像融合模組及一處理單元，其中，該影像模組用以接收該4D雷達訊號及該影像訊號，分別產生一雷達池化訊號及一體素池化訊號，該影像融合模組接收該雷達池化訊號及該體素池化訊號，利用一鳥瞰圖互動式注意力模組(BEV Interactive Attention Module,IAM)融合該體素池化訊號，與該雷達池化訊號，產生一融合鳥瞰圖特徵之影像特徵訊號，透過該處理單元接收該影像特徵訊號，並產生一顯示訊號，透過該處理單元顯示該顯示訊號，藉以達到顯示影像偵測結果之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">11:影像模組</p>  
        <p type="p">12:影像融合模組</p>  
        <p type="p">13:處理模組</p>  
        <p type="p">G1:影像訊號</p>  
        <p type="p">G3:體素池化訊號</p>  
        <p type="p">L1:雷達訊號</p>  
        <p type="p">L3:雷達池化訊號</p>  
        <p type="p">B:鳥瞰圖互動式注意力模組</p>  
        <p type="p">G4:影像特徵訊號</p>  
        <p type="p">G5:顯示訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="241" publication-number="202627997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>交通事件偵測系統及其影像特徵偵測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250122B">G06V10/40</main-classification>  
        <further-classification edition="202201120250122B">G06V20/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡士哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, SHIH-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭有崧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張峰嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FENG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊定為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-SHINH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種交通事件偵測系統，其係為一種用以接收公路監視系統之影像訊號，對該影像訊號進行交通事件特徵判斷之偵測系統，該系統係包括一影像偵測模組、一影像融合單元、一目標區域產生單元及一影像顯示單元，透過該影像偵測模組接收該影像訊號分別產生一特徵影像區域訊號，及一影像特徵訊號，利用該影像融合單元接收該特徵影像區域訊號及該影像特徵訊號，產生一影像融合訊號，利用該目標區域產生單元，產生一目標區域標註訊號，最後利用該影像顯示單元顯示該影像中交通事件區域，藉以達到顯示交通事件偵測之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">11:影像偵測模組</p>  
        <p type="p">12:影像融合單元</p>  
        <p type="p">13:目標區域產生單元</p>  
        <p type="p">14:影像顯示單元</p>  
        <p type="p">111:特徵區域選取單元</p>  
        <p type="p">112:物件偵測單元</p>  
        <p type="p">K1:影像訊號</p>  
        <p type="p">K2:影像特徵訊號</p>  
        <p type="p">K3:特徵影像區域訊號</p>  
        <p type="p">K4:影像融合訊號</p>  
        <p type="p">K5:目標區域標註訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="242" publication-number="202628535"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628535.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超純水單相浸沒式冷卻水槽</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H05K7/20</main-classification>  
        <further-classification edition="200601120250203B">F28D1/02</further-classification>  
        <further-classification edition="200601120250203B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅文瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王興廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅文瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王興廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘俞宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種超純水單相浸沒式冷卻水槽，主要包括:容器、液體感應元件、液體控制閥、含氧量偵測器、排氣閥、氮體充填閥、電子式壓力錶、電子式氣體壓力偵測器及壓力分析模組，其中容器的容置空間供容置非導電液體並用於浸泡電子設備，液體控制閥主要連接液體感應元件並根據非導電液體液體狀態及液位狀態，來開啟或關閉進、排水口輸送或排出非導電液體，含氧量偵測器用於對未浸泡該非導電液體之空間進行含氧量偵測，並輸出含氧量訊號，排氣閥根據含氧量訊號以排出空間內混和有氧氣及氮氣的氣體，氮體充填閥則根據根據電子式氣體壓力偵測訊號，使氮氣輸送至空間內，電子式壓力錶及電子式氣體壓力偵測器透過壓力分析模組取得容器內的精準壓力值，並依據精準壓力值決定氮體充填閥是否啟動或關閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:超純水單相浸沒式冷卻水槽</p>  
        <p type="p">10:容器</p>  
        <p type="p">100:容置空間</p>  
        <p type="p">101:排水口</p>  
        <p type="p">102:進水口</p>  
        <p type="p">104:感測器</p>  
        <p type="p">106:視窗</p>  
        <p type="p">11:液體感應元件</p>  
        <p type="p">110:低液位偵測區</p>  
        <p type="p">112:高液位偵測區</p>  
        <p type="p">12:液體控制閥</p>  
        <p type="p">14:含氧量偵測器</p>  
        <p type="p">15:排氣閥</p>  
        <p type="p">16:氮體充填閥</p>  
        <p type="p">17:電子式壓力錶</p>  
        <p type="p">18:電子式氣體壓力偵測器</p>  
        <p type="p">19:壓力分析模組</p>  
        <p type="p">2:非導電液體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="243" publication-number="202627433"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627433.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>力量感測模組及應用其之可撓管裝置</chinese-title>  
        <english-title>FORCE SENSING MODULE AND FLEXIBLE TUBE DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">G01L1/14</main-classification>  
        <further-classification edition="200601120250320B">G01L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅宇然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YU-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭家君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林禹辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEU-CHERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">力量感測模組包括介電彈性體、第一電路板及第二電路板。介電彈性體具有相對之第一端面與第二端面。第一電路板配置在第一端面且包括數個第一電極。第二電路板配置在第二端面且包括數個第二電極。此些第一電極與此些第二電極沿介電彈性體之一厚度方向重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A force sensing module includes a dielectric elastomer, a first circuit board and a second circuit board. The dielectric elastomer has a first end surface and a second end surface opposite to the first end surface. The first circuit board is disposed on the first end surface and includes a plurality of first electrodes. The second circuit board is disposed on the second end surface and includes a plurality of second electrodes. The first electrodes and the second electrodes overlap along a thickness direction of the dielectric elastomer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可撓管裝置</p>  
        <p type="p">10:工具</p>  
        <p type="p">110:可撓管</p>  
        <p type="p">111:可撓管體</p>  
        <p type="p">1111:第三定位部</p>  
        <p type="p">112:端部件</p>  
        <p type="p">1121:第一定位部</p>  
        <p type="p">112a:工具容納孔</p>  
        <p type="p">112a1:內側面</p>  
        <p type="p">120:力量感測模組</p>  
        <p type="p">121:介電彈性體</p>  
        <p type="p">122:第一電路板</p>  
        <p type="p">1221:第一板體</p>  
        <p type="p">1222:第一軟性電路板</p>  
        <p type="p">12221:第一可撓板體</p>  
        <p type="p">122T2:第一傳輸線</p>  
        <p type="p">122E2:第一電極</p>  
        <p type="p">123:第二電路板</p>  
        <p type="p">1231:第二板體</p>  
        <p type="p">1232:第一軟性電路板</p>  
        <p type="p">123E2:第二電極</p>  
        <p type="p">123T2:第一傳輸線</p>  
        <p type="p">124:第一抵壓件</p>  
        <p type="p">1241:第二定位部</p>  
        <p type="p">125:第二抵壓件</p>  
        <p type="p">125a:容納孔</p>  
        <p type="p">125s:外側面</p>  
        <p type="p">111v:貫孔</p>  
        <p type="p">126:第一黏合層</p>  
        <p type="p">127:第二黏合層</p>  
        <p type="p">130:限位件</p>  
        <p type="p">130a:限位穿孔</p>  
        <p type="p">140:保護層</p>  
        <p type="p">d1,d3:內徑</p>  
        <p type="p">d2,d4:外徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="244" publication-number="202627414"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627414.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149656</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同心圓陰影莫爾測量系統</chinese-title>  
        <english-title>CONCENTRIC CIRCULAR SHADOW MOIRÉ MEASUREMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250219B">G01B11/25</main-classification>  
        <further-classification edition="200601120250219B">G01N21/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊育丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈皓文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA, HAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種同心圓陰影莫爾測量系統，該同心圓陰影莫爾測量系統包括向晶圓表面發射光線的照明模組以及在晶圓表面生成精確陰影圖案的同心圓光柵。影像感測器捕捉由同心圓光柵與陰影圖案相互作用所形成的重疊陰影莫爾圖樣。處理單元利用基於快速傅立葉轉換的相位解調處理捕捉到的莫爾圖樣，並以亞微米解析度重建晶圓表面形態的三維模型。該同心圓陰影莫爾測量系統實現了無需機械掃描的一次性全域測量，消除了與位移平台相關的幾何不準確性。同心圓光柵確保莫爾條紋始終與晶圓上的任何方向性表面特徵垂直，減少由任意方向表面週期性結構引起的不準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a Concentric Circular Shadow Moiré Measurement System, which includes an illumination module configured to emit light towards the wafer surface and a concentric circular grating that generates precise shadow patterns on the wafer surface. An imaging sensor captures the superimposed concentric circular shadow moiré patterns formed by the interaction of the concentric circular grating and the shadow patterns. A processing unit utilizes Fast Fourier Transform-based phase demodulation to process the captured moiré patterns and reconstruct a three-dimensional model of the wafer's surface morphology with sub-micron resolution. This Concentric Circular Shadow Moiré Measurement System achieves one-shot global measurements without mechanical scanning, eliminating geometric inaccuracies associated with displacement platforms. The concentric circular grating ensures that moiré fringes remain perpendicular to any directional surface features on the wafer, reducing inaccuracies caused by periodic surface structures with arbitrary orientations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓</p>  
        <p type="p">20:光束</p>  
        <p type="p">22:反射光</p>  
        <p type="p">100:同心圓陰影莫爾測量系統</p>  
        <p type="p">110:照明模組</p>  
        <p type="p">120:分光器</p>  
        <p type="p">130:光柵組件</p>  
        <p type="p">132:同心圓光柵</p>  
        <p type="p">140:影像感測器</p>  
        <p type="p">150:處理單元</p>  
        <p type="p">160:位移平台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="245" publication-number="202628340"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628340.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬達系統及其控制方法</chinese-title>  
        <english-title>MOTOR SYSTEM AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241227B">H02P27/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIA-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁家敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, CHIA-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張鈞傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張正敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種馬達系統，適於連接電源與馬達，包括馬達驅動器。電源提供輸入電壓。馬達因應於輸出電流的驅動而進行轉動，並且產生關聯於馬達的轉速的位置訊號。馬達驅動器包括功率模組與控制模組。功率模組因應於輸入電壓產生直流母線電壓與輸出電流，並且產生直流母線電壓對應的回授電壓值與輸出電流對應的回授電流值。其中輸出電流的三相電流包括第一相位電流、第二相位電流與第三相位電流。控制模組因應於回授電壓值、回授電流值與位置訊號產生調變訊號與脈衝寬度調變(PWM)訊號。功率模組因應於調變訊號與PWM訊號調整第一相位電流、第二相位電流與第三相位電流以及直流母線電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motor system adapted to connect an external power supply and an electric motor, includes a motor driver. The power supply provides an input voltage. The motor rotates in response to a driving by an output current, and generates a position signal related to a rotational speed of the motor. The motor driver includes a power module and a control module. The power module generates an DC bus voltage and the output current in response to the input voltage, and generates a feedback voltage value corresponding to the DC bus voltage and feedback current values corresponding to the output current. Three-phase currents of the output current includes a first phase current, a second phase current and a third phase current. The control module generates a modulating signal and a pulse width modulation (PWM) signal in response to the feedback voltage value, the feedback current values and the position signal. The power module adjusts the first phase current, the second phase current, the third phase current and the DC bus voltage in response to the modulating signal and the PWM signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:馬達系統</p>  
        <p type="p">100:電源</p>  
        <p type="p">200:馬達驅動器</p>  
        <p type="p">210:功率模組</p>  
        <p type="p">220:控制模組</p>  
        <p type="p">300:外部控制器</p>  
        <p type="p">400:馬達</p>  
        <p type="p">410:位置感測器</p>  
        <p type="p">Vi:輸入電壓</p>  
        <p type="p">Io:輸出電流</p>  
        <p type="p">U:第一相位電流</p>  
        <p type="p">V:第二相位電流</p>  
        <p type="p">W:第三相位電流</p>  
        <p type="p">I_V,I_U,I_W:回授電流值</p>  
        <p type="p">V_BUS:回授電壓值</p>  
        <p type="p">B:位置訊號</p>  
        <p type="p">C:控制訊號</p>  
        <p type="p">P1:PWM訊號</p>  
        <p type="p">P2:調變訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="246" publication-number="202628130"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628130.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149660</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療風險事件之管理方法、管理平台及管理系統</chinese-title>  
        <english-title>MEDICAL RISK EVENT MANAGEMENT METHOD, MANAGEMENT PLATFORM AND MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250303B">G16H50/30</main-classification>  
        <further-classification edition="201801120250303B">G16H50/20</further-classification>  
        <further-classification edition="201801120250303B">G16H10/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇美醫療財團法人奇美醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI MEI MEDICAL GROUP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖家德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIA-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李美娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MEI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慧玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種醫療風險事件之管理方法、管理平台及管理系統，管理方法包括下述步驟：(a) 提供架設於伺服器上之管理平台，管理平台包括雙向溝通之整合模組及擷取模組；(b) 由整合模組取得對應醫療對象之風險評估請求；(c) 由擷取模組對應風險評估請求向醫療資料庫索取對應醫療對象之醫療資訊；(d) 由整合模組產生對應醫療資訊之提示指令；(e) 由整合模組將提示指令傳遞至運算平台，使運算平台利用生成式預訓練模型進行運算，以產生風險評估結果；以及，(f) 由整合模組接收運算平台回傳之風險評估結果，當風險評估結果符合示警條件時發出風險事件通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S20:管理方法</p>  
        <p type="p">S21~S26:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="247" publication-number="202628251"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628251.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙層電路板連接器結構及其組裝方法</chinese-title>  
        <english-title>DOUBLE LAYER CIRCUIT BOARD CONNECTOR AND ASSEMBLING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250324B">H01R12/52</main-classification>  
        <further-classification edition="200601120250324B">H01R13/514</further-classification>  
        <further-classification edition="200601120250324B">H01R13/629</further-classification>  
        <further-classification edition="200601120250324B">H05K3/46</further-classification>  
        <further-classification edition="200601120250324B">H05K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳必琪國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JPC CONNECTIVITY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭杰明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIEH MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙層電路板連接器結構及其組裝方法，包括一殼體、一第一電路模組、一第二電路模組與一屏蔽構件；殼體內具有一容置空間，第一電路模組設於容置空間內，並具有一第一電路板、一第一成型模塊與複數第一導接元件，各第一導接元件電性連接於第一電路板後端，第二電路模組設於容置空間內並疊置於第一電路模組上，並具有一第二電路板、一第二成型模塊與複數第二導接元件，各第二導接元件電性連接於第二電路板後端，屏蔽構件則設於第一電路板與第二電路板之間，並具有一第一屏蔽面與一第二屏蔽面，並分別朝向第一導接元件、第二導接元件各自與其電路板的電性連接處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A double layer circuit board connector and an assembling method thereof are provided. The double layer circuit board connector includes a shell, a first circuit module, a second circuit module, and a shielding member. The shell has an accommodating space. The first circuit module is arranged in the accommodating space and has a first circuit board, a first molding block, and a plurality of first conducting members. The first conducting members are electrically connected to the first circuit board. The second circuit module is arranged in the accommodating space, is stacked on the first circuit module, and has a second circuit board, a second molding block, and a plurality of second conducting members. The second conducting members are electrically connected to the second circuit board. The shielding member is arranged between the first circuit board and the second circuit board and has a first shielding surface facing the first conducting members and a connecting joint with the first circuit board and a second shielding surface facing the second conducting members and a connecting joint with the second circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">1a:第一殼件</p>  
        <p type="p">1b:第二殼件</p>  
        <p type="p">10:第一殼板</p>  
        <p type="p">11:第二殼板</p>  
        <p type="p">110:側緣</p>  
        <p type="p">111:扣部</p>  
        <p type="p">112:定位片</p>  
        <p type="p">113:拉柄</p>  
        <p type="p">12:側殼板</p>  
        <p type="p">120:凸壁</p>  
        <p type="p">121:滑入槽</p>  
        <p type="p">122:滑入塊</p>  
        <p type="p">122a:第二卡點</p>  
        <p type="p">123:定位槽</p>  
        <p type="p">123a:第一卡點</p>  
        <p type="p">13:容置空間</p>  
        <p type="p">130:前端區</p>  
        <p type="p">130a:插口</p>  
        <p type="p">131:後端區</p>  
        <p type="p">2:第一電路模組</p>  
        <p type="p">3:第二電路模組</p>  
        <p type="p">F1:插接方向</p>  
        <p type="p">F2:組裝方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="248" publication-number="202627742"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627742.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻循環散熱件及具有該冷卻循環散熱件的電子裝置</chinese-title>  
        <english-title>COOLING CYCLE HEAT SINK AND ELECTRONIC DEVICE HAVING THE COOLING CYCLE HEAT SINK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">G06F1/20</main-classification>  
        <further-classification edition="200601120250320B">F28F9/22</further-classification>  
        <further-classification edition="200601120250320B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建準電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張名嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳寶生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PAO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷卻循環散熱件，用以解決習知冷卻循環模組散熱效果不佳的問題。係包含：一殼體，具有相對的一第一表面及一第二表面，該第一表面具有至少一支撐部；及一導熱件，具有相對的一結合面及一導熱面，該導熱件的結合面結合於該殼體的第二表面，該導熱件與該殼體共同形成一流道。本發明另關於一種具有該冷卻循環散熱件的電子裝置。藉此可以達成在有限的空間內提升散熱效能功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling cycle heat sink is used to solve the problem of poor heat dissipation effect of conventional cooling cycle modules. Includes: a shell having a first surface and a second surface opposite each other, the first surface having at least one support portion; and a thermal conductive component having a joining surface and a thermal surface opposite each other, and the joining surface is coupled to the second surface of the housing, and the heat conducting member and the housing together form a flow channel. The present invention also relates to an electronic device having the cooling circulation heat sink. This can achieve improved heat dissipation efficiency in a limited space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">1a:第一表面</p>  
        <p type="p">1b:第二表面</p>  
        <p type="p">11:支撐部</p>  
        <p type="p">12:槽</p>  
        <p type="p">2:導熱件</p>  
        <p type="p">2a:結合面</p>  
        <p type="p">2b:導熱面</p>  
        <p type="p">21:流道</p>  
        <p type="p">21a:出液部</p>  
        <p type="p">21b:入液部</p>  
        <p type="p">22:泵浦</p>  
        <p type="p">23:入液口</p>  
        <p type="p">24:出液口</p>  
        <p type="p">G:冷卻循環散熱件</p>  
        <p type="p">E:電子裝置</p>  
        <p type="p">E1:主機本體</p>  
        <p type="p">T:熱管</p>  
        <p type="p">H:熱源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="249" publication-number="202628008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安全事件判斷系統及其方法</chinese-title>  
        <english-title>SAFETY EVENT DETERMINING SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241231B">G06V40/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YI-JIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種安全事件判斷系統，包括以下元件。第一辨識裝置，根據第一影像辨識目標物的姿態以產生第一辨識結果，其關聯於第一信賴度。第二辨識裝置，根據第二影像辨識目標物的姿態以產生第二辨識結果，其關聯於第二信賴度。第二影像是異質於第一影像。第一處理器，疊合第一影像與第二影像以產生疊合影像，並且根據第一辨識結果、第二辨識結果與疊合影像進行匹配運算以得到複數個匹配結果。第二處理器，分析各匹配結果以得到姿態類別結果與安全事件判斷結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A safety event determining system, includes the following components. A first recognizing device, recognizes a posture of a target object according to a first image to generate a first recognizing result, which is associated with a first confidence. The second recognizing device, recognizes the posture of the target object according to a second image to generate a second recognizing result, which is associated with the second confidence. The second image is heterogeneous from the first image. A first processor, overlays the first image and the second image to generate a overlaid image, and performs a matching operation according to the first recognition result, the second recognition result and the overlaid image to obtain a plurality of matching results. A second processor, analyzes each matching result to obtain a posture class result and a safety event determining result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:安全事件判斷系統</p>  
        <p type="p">10:第一影像擷取裝置</p>  
        <p type="p">20:第二影像擷取裝置</p>  
        <p type="p">50:目標物</p>  
        <p type="p">100:第一辨識裝置</p>  
        <p type="p">200:第二辨識裝置</p>  
        <p type="p">300:第一處理器</p>  
        <p type="p">400:第二處理器</p>  
        <p type="p">500:警示裝置</p>  
        <p type="p">I1:第一影像</p>  
        <p type="p">I2:第二影像</p>  
        <p type="p">D1:第一辨識結果</p>  
        <p type="p">D2:第二辨識結果</p>  
        <p type="p">A:第一信賴度</p>  
        <p type="p">B:第二信賴度</p>  
        <p type="p">CLS:姿態類別結果</p>  
        <p type="p">S:安全事件判斷結果</p>  
        <p type="p">WR:警示訊號</p>  
        <p type="p">{M(i)}:匹配結果集合</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="250" publication-number="202626444"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626444.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149664</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋翼快速拆裝結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250317B">B64U30/292</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翔隆航太股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鴻烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邦棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種旋翼快速拆裝結構，係包括：一旋翼連接體設置有至少一旋翼樞接孔及形成有至少一連接卡面與至少一連接卡槽；一主體形成有一頂組槽及至少一內組面，而該旋翼連接體係設置於該頂組槽內並與該內組面相互貼附，又該主體側邊形成有至少一連動組槽及至少一側通孔；至少一導引體係設置於該連動組槽內並形成有一展肋設置於連接卡槽內，以及該導引側邊設置有至少一側壓件通過所述側通孔，又該導引體底部設置有至少一彈性件；及一驅動組件設置於該導引體與該側壓件下方且具有一驅動軸，而該旋翼連接體可透過所述導引體快速拆裝在主體上，達到可快速拆裝替換，以解決無法更換旋翼問題之功效者。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:旋翼快速拆裝結構</p>  
        <p type="p">2:旋翼連接體</p>  
        <p type="p">21:旋翼樞接孔</p>  
        <p type="p">22:連接卡面</p>  
        <p type="p">23:連接卡槽</p>  
        <p type="p">24:連接導邊</p>  
        <p type="p">3:主體</p>  
        <p type="p">31:頂組槽</p>  
        <p type="p">311:內組面</p>  
        <p type="p">32:主軸凸部</p>  
        <p type="p">33:連動組槽</p>  
        <p type="p">331:滑槽</p>  
        <p type="p">34:側通孔</p>  
        <p type="p">4:導引體</p>  
        <p type="p">41:展肋</p>  
        <p type="p">411:連動導邊</p>  
        <p type="p">42:導引導邊</p>  
        <p type="p">43:側壓件</p>  
        <p type="p">431:側壓導邊</p>  
        <p type="p">432:側壓底肋</p>  
        <p type="p">44:導肋</p>  
        <p type="p">45:彈性件</p>  
        <p type="p">5:驅動組件</p>  
        <p type="p">51:驅動軸</p>  
        <p type="p">52:驅動組板</p>  
        <p type="p">521:延伸抵邊</p>  
        <p type="p">522:板限位槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="251" publication-number="202627936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結合大型語言模型及自然語言理解以預生成內容推薦商品及服務的系統</chinese-title>  
        <english-title>SYSTEM FOR RECOMMENDING PRODUCTS AND SERVICES BY PRE-GENERATING CONTENT USING COMBINATION OF LARGE LANGUAGE MODELS AND NATURAL LANGUAGE UNDERSTANDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q30/0202</main-classification>  
        <further-classification edition="202301120250303B">G06Q30/0201</further-classification>  
        <further-classification edition="201201120250303B">G06Q40/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南山人壽保險股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN SHAN LIFE INSURANCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂新科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HSIN-KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林濬琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宜嫈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡其杭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHI-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游程盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種商機預測系統，包含：儲存裝置，經配置以儲存客戶特徵集、商品及服務資料庫以及規範資料庫；以及推薦伺服器，耦接儲存裝置，其中推薦伺服器更經配置以：接收商品或服務之預生成請求；判斷客戶特徵集是否具有對應於商品或服務的未處理客戶特徵；響應於判斷客戶特徵集不具有對應於商品或服務的未處理客戶特徵，產生關聯於商品或服務之預生成請求完成訊息；以及響應於判斷客戶特徵集具有對應於商品或服務的未處理客戶特徵，存取商品及服務資料庫的訓練資料以及規範資料庫的廣告文宣規範與法規資料，以執行客戶特徵處理作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for business opportunity prediction is provided, including: a storage device configured to store a customer characteristic set, a product and service database, and a specification database; and a recommendation server coupled to the storage device, wherein the recommendation server is further configured to: receive a pre-generated request for a product or service; determine whether the customer feature set contains an unprocessed customer feature corresponding to the product or service; in response to the customer feature set not containing the unprocessed customer feature corresponding to the product or service, generate a pre-generated request completion message associated with the product or service; and in response to the customer characteristic set including the unprocessed customer characteristic corresponding to the product or service, accessing a training data of the product and service database and an advertising literature standard and regulatory data of the specification database to execute a customer characteristic processing operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:儲存裝置</p>  
        <p type="p">120:推薦伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="252" publication-number="202626443"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626443.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋翼快速拆裝套件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250123B">B64U30/291</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翔隆航太股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鴻烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邦棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種旋翼快速拆裝套件，係包括：一旋翼連接體設置有至少一旋翼樞接孔及具有一連接組部，該連接組部形成有至少一展肋及形成有一連接組槽及至少一卡槽；一主體形成有一頂組槽，而該連接組部係設置於所述頂組槽內，及該主體內形成有一導槽及至少一內通孔與側邊形成有至少一側通孔；一導引體設置於所述主體內且設置有至少一卡肋通過所述內通孔，及側邊設置有至少一側壓件通過所述側通孔，又該導引體側邊設置有至少一彈性件；及一驅動組件設置於所述導引體下方且具有一驅動軸與該主體相互組設，而該旋翼連接體可透過所述導引體快速拆裝在主體上，達到可快速拆裝替換，以解決無法更換旋翼問題之功效者。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:旋翼快速拆裝套件</p>  
        <p type="p">2:旋翼連接體</p>  
        <p type="p">21:旋翼樞接孔</p>  
        <p type="p">22:連接組部</p>  
        <p type="p">221:展肋</p>  
        <p type="p">3:主體</p>  
        <p type="p">31:頂組槽</p>  
        <p type="p">34:側簷肋</p>  
        <p type="p">342:導槽</p>  
        <p type="p">35:側通孔</p>  
        <p type="p">43:側壓件</p>  
        <p type="p">5:驅動組件</p>  
        <p type="p">52:驅動組板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="253" publication-number="202627985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種透過向量迭代地面點分割系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250320B">G06T7/10</main-classification>  
        <further-classification edition="201101120250320B">G06T19/00</further-classification>  
        <further-classification edition="200601120250320B">G06F17/16</further-classification>  
        <further-classification edition="202001120250320B">G01S17/89</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣智慧駕駛股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡子正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭兆仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邦棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透過向量迭代地面點分割系統及其方法，包括一光達及一中央處理單元，該光達裝設於一載具中，其用以取得一三維模型，該中央處理單元電性連接該光達，該中央處理單元包含有一分析運算模組及一儲存模組，該分析運算模組接收所述三維模型並透過一向量迭代地面分割法分析計算產生至少一參考向量值及一目標向量值，該參考向量值及目標向量值之間形成一角度，該角度與該儲存模組之一預設閾值進行計算比對，藉以判斷該角度與該預設閾值並產生一地面點或一非地面點。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">S1~S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="254" publication-number="202626142"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626142.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>歸原能量光波儀</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">A61N5/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖立志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾錫銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖立志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾錫銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林邦棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種歸原能量光波儀，係包括：一外殼體設置有一前隔板及頂部形成有一排氣口與排氣口下方設置有一導引板，該導引板與該前隔板間界定有一導引通道；一反射內殼體設置於所述外殼體內且形成設置鏡面斜板與界定有一蓄熱腔室，該鏡面斜板向下延伸有一前檔板與該前隔板間界定有一排氣通道，另於內設置有一熾熱球體；及一燃燒器係容置於所述蓄熱腔室內，該燃燒器係設置有一第一管體及一第二管體及一金屬件，該第一管體兩端分別形成一入氣口及一出氣口並共同界定形成一第一腔室，及一頸縮部形成於該第一管體上並相鄰該入氣口，另該第一管體外壁與該第二管體內壁之間共同界定形成一第二腔室，該第二管體兩端分別形成一吸入端及一開放端，該金屬件係對應組設於所述開放端處且由一外環部、一受熱部及一中空導流部所構成，該受熱部對應開設複數孔洞，並該受熱部與該外環部間形成一環出氣口，該環出氣口與該第二腔室相連通，該中空導流部形成一第三腔室，所述孔洞與該第三腔室相互連通。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:歸原能量光波儀</p>  
        <p type="p">2:外殼體</p>  
        <p type="p">21:前隔板</p>  
        <p type="p">211:前隔入氣口</p>  
        <p type="p">212:前隔導邊</p>  
        <p type="p">22:排氣口</p>  
        <p type="p">23:導引板</p>  
        <p type="p">231:導引通道</p>  
        <p type="p">24:外隔板</p>  
        <p type="p">241:外隔通道</p>  
        <p type="p">242:外隔入氣口</p>  
        <p type="p">25:外殼底板</p>  
        <p type="p">26:底組座</p>  
        <p type="p">261:啟動件</p>  
        <p type="p">3:反射內殼體</p>  
        <p type="p">31:鏡面斜板</p>  
        <p type="p">311:內斷熱腔室</p>  
        <p type="p">312:前檔板</p>  
        <p type="p">313:排氣通道</p>  
        <p type="p">314:後遮板</p>  
        <p type="p">33:熾熱球體</p>  
        <p type="p">331:展部</p>  
        <p type="p">332:開口</p>  
        <p type="p">34:內殼底座</p>  
        <p type="p">341:底斷熱腔室</p>  
        <p type="p">342:側斜板</p>  
        <p type="p">343:後檔板</p>  
        <p type="p">344:平台</p>  
        <p type="p">345:抽取件</p>  
        <p type="p">4:燃燒器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="255" publication-number="202628459"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628459.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>更新追蹤區域的方法及終端裝置</chinese-title>  
        <english-title>METHOD FOR UPDATING TRACKING AREA AND TERMINAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250303B">H04W60/04</main-classification>  
        <further-classification edition="200901120250303B">H04W60/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供一種更新追蹤區域的方法及終端裝置。所述方法包括：取得終端裝置的地理位置，其中終端裝置使用非地面網路通訊功能；基於地理位置判定終端裝置所在的第一追蹤區域；以及反應於判定需執行追蹤區域更新程序，發送請求訊息至網路裝置，其中請求訊息指示第一追蹤區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure provide a method for updating a tracking area and a terminal device. The method includes: obtaining a geographical location of the terminal device, wherein the terminal device uses a non-terrestrial network communication function; determining a first tracking area where the terminal device is located based on the geographical location; and in response to determining that a tracking area update procedure needs to be executed, sending a request message to a network device, where the request message indicates the first tracking area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S510,S520,S530:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="256" publication-number="202627814"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627814.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼控制方法、記憶體儲存裝置及記憶體控制電路單元</chinese-title>  
        <english-title>ENCODING CONTROL METHOD, MEMORY STORAGE DEVICE AND MEMORY CONTROL CIRCUIT UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250501B">G06F12/0866</main-classification>  
        <further-classification edition="200601120250501B">G06F11/07</further-classification>  
        <further-classification edition="200601120250501B">G06F13/14</further-classification>  
        <further-classification edition="200601120250501B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群聯電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHISON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玉祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BO LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種編碼控制方法、記憶體儲存裝置及記憶體控制電路單元。所述編碼控制方法包括：取得寫入資料；由編碼電路根據寫入資料執行編碼操作以產生第一奇偶資料與第二奇偶資料，其中第二奇偶資料不根據第一奇偶資料而產生；以及發送第一寫入指令序列，以指示將寫入資料、第一奇偶資料及第二奇偶資料儲存至可複寫式非揮發性記憶體模組中，其中第一奇偶資料用以與寫入資料執行解碼操作，並且第二奇偶資料用以搭配第一奇偶資料與寫入資料執行解碼操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An encoding control method, a memory storage device and a memory control circuit unit are provided. The encoding control method includes: obtaining a writing data; performing a encoding operation to generate a first parity data and a second parity data according to the writing data through an encode circuit, wherein the second parity data is not generated according to the first parity data; and sending a first write command sequence to instruct a storing of the writing data, the first parity data and the second parity data to a rewritable non-volatile memory module, wherein the first parity data is used to perform a decoding operation with the writing data, and the second parity data is used to perform the decoding operation with the first parity data and the writing data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1001:步驟(取得寫入資料)</p>  
        <p type="p">S1002:步驟(由編碼電路根據寫入資料執行編碼操作以產生第一奇偶資料與第二奇偶資料，其中第二奇偶資料不根據第一奇偶資料而產生)</p>  
        <p type="p">S1003:步驟(發送第一寫入指令序列，以指示將寫入資料、第一奇偶資料及第二奇偶資料儲存至可複寫式非揮發性記憶體模組中，其中第一奇偶資料用以與寫入資料執行解碼操作，並且第二奇偶資料用以搭配第一奇偶資料與寫入資料執行解碼操作)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="257" publication-number="202627939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運用人工智慧模型推薦商品及服務之系統</chinese-title>  
        <english-title>SYSTEM FOR RECOMMENDING PRODUCTS AND SERVICES USING AI MODELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250321B">G06Q30/0214</main-classification>  
        <further-classification edition="200601120250321B">G06N3/10</further-classification>  
        <further-classification edition="202001120250321B">G06F30/27</further-classification>  
        <further-classification edition="201901120250321B">G06F16/953</further-classification>  
        <further-classification edition="202001120250321B">G06F40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南山人壽保險股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN SHAN LIFE INSURANCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂新科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HSIN-KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林濬琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡雅安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YA-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種運用人工智慧模型推薦商品及服務之系統。該系統包含一受理平台伺服器、一推薦伺服器及一商品及服務資料庫。該商品及服務資料庫包含以大型語言模型訓練及生成的複數個回覆，各該回覆包含至少一個推薦商品或服務。該受理平台伺服器接受一使用者之輸入文字、語音或引導式應答，根據該輸入文字、該語音或該引導式應答提供該使用者至少一問卷以得到一回答內容。該推薦伺服器根據該回答內容，以及該輸入文字及該引導式應答中一者，讀取及搜尋該商品及服務資料庫，從而向該使用者顯示至少一該回覆。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for recommending products and services using artificial intelligence models is provided. The system comprises an acceptance platform server, a recommendation server and a product and service database. The product and service database includes a plurality of responses trained and generated by a large language model, each of which contains at least one recommended product or service. The acceptance platform server accepts a textual input, audio, or leaded answer from a user by the electronic device, and provides the user with at least one questionnaire based on the textual input, the audio or the leaded answer to obtain reply content. The recommendation server reads and searches the product and service database based on the reply content and one the textual input and the leaded answer to display at least one of the responses to the user by the electronic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">11:電子裝置</p>  
        <p type="p">12:網際網路</p>  
        <p type="p">13:受理平台伺服器</p>  
        <p type="p">14:客戶資料庫</p>  
        <p type="p">15:推薦伺服器</p>  
        <p type="p">16:商品及服務資料庫</p>  
        <p type="p">17:訓練伺服器</p>  
        <p type="p">171:LLM訓練單元</p>  
        <p type="p">172:自然語言理解處理單元(NLU)</p>  
        <p type="p">18:訓練資料庫</p>  
        <p type="p">19:成果資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="258" publication-number="202628338"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628338.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於電流自編碼器的馬達健康度診斷系統及診斷方法</chinese-title>  
        <english-title>MOTOR HEALTH DIAGNOSIS SYSTEM AND METHOD BASED ON CURRENT AUTOENCODER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250526B">H02P6/34</main-classification>  
        <further-classification edition="201601120250526B">H02P29/00</further-classification>  
        <further-classification edition="202001120250526B">G01R31/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECOM CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YI HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊士進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHIH CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易承霈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, CHEN PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊虹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於電流自編碼器的馬達健康度診斷系統執行以下操作：(a) 持續獲得馬達的電流檢測資料；(b) 編碼器對電流檢測資料進行特徵擷取並下降維度至瓶頸層以獲得電流特徵壓縮資料；(c) 解碼器對電流特徵壓縮資料進行資料重建並增加維度至輸出層以獲得電流特徵重建資料；(d) 以損失函數計算電流特徵重建資料與電流檢測資料之間的重建誤差值；(e) 重複執行操作(a)至操作(d)，以獲得代表電流檢測結果的重建誤差分布；以及(f) 於檢測出重建誤差分布超出異常邊界值時，診斷馬達的運作出現異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motor health diagnosis system based on an autoencoder includes operations of: (a) continuously obtaining current detected data of the motor; (b) by an encoder, acquiring features of the current detected data and performing a dimension reduction down to a bottleneck layer to obtain a current feature compression data; (c) by a decoder, performing a data reconstruction on the current feature compression data and performing a dimension expansion up to an output layer to obtain a current feature reconstruction data; (d) using loss function to obtain a reconstruction error between the current detected data and the current feature reconstruction data; (e) repeating (a) to (d) to obtain a reconstruction error distribution representing the current detection result; (f) when the reconstruction error distribution exceeds an abnormal boundary, an abnormality of the motor is detected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:馬達</p>  
        <p type="p">120:電流感測器</p>  
        <p type="p">130:資料處理器</p>  
        <p type="p">140:運算裝置</p>  
        <p type="p">142:儲存媒體</p>  
        <p type="p">144:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="259" publication-number="202626121"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626121.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有外膜層的假體</chinese-title>  
        <english-title>PROSTHESIS WITH ADVENTITIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">A61L27/16</main-classification>  
        <further-classification edition="200601120250303B">A61L27/52</further-classification>  
        <further-classification edition="200601120250303B">G09B23/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜翌群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, YI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林偉哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種外膜層假體及具有外膜層的假體，前述外膜層假體包含：一去離子水、一聚乙烯醇，以及一丙三醇；將該聚乙烯醇加入該去離子水中混合，並加熱至攝氏80至90度，而得到一聚乙烯醇水凝膠；將該丙三醇加入該聚乙烯醇水凝膠混合，並加熱至攝氏80至90度之間，而得到一聚乙烯醇含甘油水凝膠；在一模具中對該聚乙烯醇含甘油水凝膠進行一冷凍操作及一解凍操作而塑型，該外膜層假體選擇性地設有至少一透孔供液體緩慢流通。藉此，可以阻止生理鹽水等液體快速流失，也能利用透孔模擬真實人體吸收生理鹽水之效果，更好地輔助醫師或醫學生練習水分離術。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:器官假體</p>  
        <p type="p">11:結節假體</p>  
        <p type="p">2:外膜層假體</p>  
        <p type="p">23:透孔</p>  
        <p type="p">3:胸鎖乳突肌假體</p>  
        <p type="p">6:內頸靜脈假體</p>  
        <p type="p">8:喉返神經假體</p>  
        <p type="p">81:危險三角區域</p>  
        <p type="p">9:生理鹽水</p>  
        <p type="p">A:超音波探頭</p>  
        <p type="p">B:注射器械</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="260" publication-number="202628407"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628407.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149688</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援ＩＰ群播技術之會談邊界控制系統、方法及電腦可讀媒介</chinese-title>  
        <english-title>SESSION BORDER CONTROL SYSTEM, METHOD AND COMPUTER READABLE MEDIUM SUPPORTING IP MULTICAST TECHNOLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L65/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒應殿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZOU, YING-DIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜怡楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-QUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種支援IP群播技術之會談邊界控制系統、方法及電腦可讀媒介，係由語音閘道器提供電話介面以通訊連結用戶之電話，且將電話之信號轉換為VoIP信號以通訊連結IP多媒體子系統，再由用戶管控模組解析群播/單播控制模組所接收之群播信號之信號內容以區分用戶之撥號行為是本地呼叫或對外呼叫，以於是對外呼叫時，檢查用戶之發話號碼是否為白名單。當用戶之發話號碼不是白名單時，由用戶管控模組拒絕此對外呼叫，而當用戶之發話號碼是白名單時，由用戶管控模組轉發此對外呼叫至呼叫管控模組，再由呼叫管控模組檢查目前通話數是否已達門檻值，俾於目前通話數已達門檻值時，由呼叫管控模組拒絕此對外呼叫，而於目前通話數未達門檻值時，由呼叫管控模組管控/累計同時通話數及轉發此對外呼叫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a session border control system, method and computer readable medium supporting IP multicast technology. A voice gateway provides a telephone interface to communicate with a user's phone, and converts the phone signal into a VoIP signal to communicate with an IP multimedia subsystem, and then a user management control module analyzes signal content of a multicast signal received by a multicast/unicast control module to distinguish whether the user's dialing behavior is a local call or an outbound call, so as to check whether the user's calling number is in a whitelist when making the outbound call. When the user's calling number is not in the whitelist, the user management control module rejects the outbound call; conversely, when the user's calling number is in the whitelist, the user management control module forwards the outbound call to a call management control module, and then the call management control module checks whether a current number of calls has reached a threshold. When the current number of calls has reached the threshold, the call management control module rejects the outbound call; conversely, when the current number of calls has not reached the threshold, the call management control module will control/accumulate the number of simultaneous calls and forward the outbound call.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:會談邊界控制系統</p>  
        <p type="p">10:語音閘道器</p>  
        <p type="p">11:交換器</p>  
        <p type="p">20:會談邊界控制器(SBC)</p>  
        <p type="p">30:IP多媒體子系統(IMS)</p>  
        <p type="p">31:商用會談邊界控制器(C-SBC)</p>  
        <p type="p">32:查詢-呼叫會談控制元件(I-CSCF)</p>  
        <p type="p">33:歸屬用戶伺服器(HSS)</p>  
        <p type="p">34:服務-呼叫會談控制元件(S-CSCF)</p>  
        <p type="p">A:電話</p>  
        <p type="p">B:機房</p>  
        <p type="p">C1:固定網路</p>  
        <p type="p">C2:異質網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="261" publication-number="202627267"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627267.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水面垃圾清理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251003B">E02B15/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>正修學校財團法人正修科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳富民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水面垃圾清理裝置，包含一本體單元、一連接該本體單元的收集單元，及一安裝於該本體單元的動力單元。該本體單元包括二彼此間隔的浮力件、二分別設置於該等浮力件上方的支持件，及一連接於該等支持件之間，且與該等浮力件及該等支持件界定出一沿一前後方向延伸之導引通道的承載件。該收集單元設置於該導引通道下游，並適用於收集通過該導引通道的水面垃圾。該動力單元包括二分別安裝於該等浮力件並用以運作而提供使該本體單元移動之動力的運轉模組，及一設置於該承載件上方且電連接於該等運轉模組的太陽能發電模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本體單元</p>  
        <p type="p">11:浮力件</p>  
        <p type="p">12:支持件</p>  
        <p type="p">13:承載件</p>  
        <p type="p">14:扣環</p>  
        <p type="p">2:收集單元</p>  
        <p type="p">3:動力單元</p>  
        <p type="p">31:運轉模組</p>  
        <p type="p">32:太陽能發電模組</p>  
        <p type="p">D:前後方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="262" publication-number="202628041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素電路</chinese-title>  
        <english-title>PIXEL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250109B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭又綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇文銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEN-CHIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡靈櫻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, LING-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉匡祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUANG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素電路。畫素電路包括第一連接點、第二連接點、第一電晶體、第二電晶體、第三電晶體、第四電晶體、第五電晶體、第六電晶體、第七電晶體、第八電晶體、第九電晶體、第一電容。第一電晶體、第二電晶體、第三電晶體、第四電晶體、第五電晶體、第六電晶體、第七電晶體、第八電晶體、第九電晶體所接收的第一控制訊號、第二控制訊號、發光控制訊號、系統高電壓、系統低電壓、第一參考電壓、以及第二參考電壓被設定以電性測試第一連接點、第二連接點、第一電晶體、第二電晶體、第三電晶體、第五電晶體、第六電晶體、第七電晶體及第一電容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An pixel circuit are provided. The pixel circuit includes a first connection point, a second connection point, a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a seventh transistor, an eighth transistor, a ninth transistor, and a first capacitor. A first control signal, a second control signal, an emission control signal, a system high voltage, a system low voltage, a first reference voltage, and a second reference voltage received by the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, the sixth transistor, the seventh transistor, the eighth transistor and the ninth transistor are set to electrically test the first connection point, the second connection point, the first transistor, the second transistor, and the third transistor, the fifth transistor, the sixth transistor, the seventh transistor and the first capacitor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:畫素電路</p>  
        <p type="p">C1:電容</p>  
        <p type="p">Data:資料訊號</p>  
        <p type="p">DC_1:第一參考電壓</p>  
        <p type="p">DC_2:第二參考電壓</p>  
        <p type="p">EM1:發光控制訊號</p>  
        <p type="p">LD1:微型發光二極體</p>  
        <p type="p">PAD1、PAD2:連接點</p>  
        <p type="p">S1、S2:控制訊號</p>  
        <p type="p">T1~T9:電晶體</p>  
        <p type="p">VDD:系統高電壓</p>  
        <p type="p">VSS:系統低電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="263" publication-number="202626218"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626218.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態廢棄物分解方法</chinese-title>  
        <english-title>SOLID WASTE DECOMPOSITION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250319B">B09B3/70</main-classification>  
        <further-classification edition="200601120250319B">B09B5/00</further-classification>  
        <further-classification edition="200601120250319B">C04B14/32</further-classification>  
        <further-classification edition="200601120250319B">C04B41/00</further-classification>  
        <further-classification edition="200601120250319B">B01J20/30</further-classification>  
        <further-classification edition="202201320250319B">B09B101/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東海大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNGHAI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓佩家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, PEI-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐偉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯芊亦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, QIAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐若庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種固態廢棄物處理方法，其包含下列步驟。將一固態廢棄物與一添加劑進行混合，以獲得一待處理混合物。將待處理混合物靜置一靜置時間。對靜置後的待處理混合物進行碳化，以獲得一碳化物。將碳化物與水進行混合，以獲得一處理後產物。靜置時間不小於2小時。藉此，可將固態廢棄物轉化為具有良好溶解性的碳化物，顯著提升固態廢棄物的分解效果及後續應用潛力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to the present disclosure, a solid waste treatment method includes the following steps. A solid waste is mixed with an additive to obtain a mixture to be treated. The mixture to be treated stands for a standing time. The mixture to be treated after standing is carbonized to obtain a carbonized product. The carbonized product is mixed with water to obtain a treated product. The standing time is no less than 2 hours. Therefore, the solid waste can be converted into the carbonized product with good solubility, which significantly improves the decomposition effect of the solid waste and the potential for subsequent applications thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:固態廢棄物處理方法</p>  
        <p type="p">110,120,130,140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="264" publication-number="202628710"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628710.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電半導體元件</chinese-title>  
        <english-title>OPTOELECTRONIC SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250319B">H10F77/40</main-classification>  
        <further-classification edition="202501120250319B">H10H29/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富采光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENNOSTAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳義宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇初日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHU-JIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃炤舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光電半導體元件，包含基底以及磊晶疊層，磊晶疊層包含基底上方的第一半導體層、第一半導體層上方的第二半導體層、及第一半導體層與該第二半導體層之間的吸光層。光電半導體元件更包含濾光層，其位於第二半導體層上。吸光層具有第一能隙、第二半導體層具有第二能隙大於第一能隙，濾光層具有第三能隙介於第一能隙及第二能隙之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optoelectronic semiconductor device includes a substrate and an epitaxial stack, the epitaxial stack includes a first semiconductor layer over the substrate, a second semiconductor layer over the first semiconductor layer, and a light absorbing layer between the first semiconductor layer and the second semiconductor layer. The optoelectronic semiconductor device further includes a light filter layer on the second semiconductor layer. The light absorbing layer has a first energy gap, the second semiconductor layer has a second energy gap greater than the first energy gap, and the light-absorbing layer has a third energy gap between the first energy gap and the second energy gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光電半導體元件</p>  
        <p type="p">100:基底</p>  
        <p type="p">110:磊晶疊層</p>  
        <p type="p">112:第一半導體層</p>  
        <p type="p">114:吸光層</p>  
        <p type="p">116:第二半導體層</p>  
        <p type="p">116u:未改質區</p>  
        <p type="p">118:改質區</p>  
        <p type="p">120:濾光層</p>  
        <p type="p">125:溝槽</p>  
        <p type="p">130:接觸部</p>  
        <p type="p">140:鈍化層</p>  
        <p type="p">150:第一電極結構</p>  
        <p type="p">152:電極墊</p>  
        <p type="p">154:延伸部</p>  
        <p type="p">160:抗反射層</p>  
        <p type="p">170:第二電極結構</p>  
        <p type="p">X:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="265" publication-number="202627075"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627075.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細胞體外增殖方法</chinese-title>  
        <english-title>IN VITRO PROLIFERATION METHOD FOR CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250206B">C12N5/0783</main-classification>  
        <further-classification edition="201001120250206B">C12N5/078</further-classification>  
        <further-classification edition="200601120250206B">C12M1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚寧生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINING BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多田和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種細胞體外增殖方法，包含以下步驟：將一NKG2A接合物加入至一第一細胞培養液中，以形成一第二細胞培養液；以及將一細胞加入至含有該第二細胞培養液之一細胞培養容器中進行一細胞擴增培養，以獲得一擴增細胞。本發明提供之細胞體外增殖方法可以高效獲得大量高純度的NK細胞，並且其擴增細胞具備顯著的腫瘤毒殺能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a method for in vitro proliferation of cells, comprising the steps of: adding a NKG2A conjugate to a first cell culture medium to form a second cell culture medium; adding a cell into a cell culture vessel containing the second cell culture medium for cell expansion culture, thereby obtaining an expanded cell. The invention provides a method for in vitro proliferation of cells that enables the efficient production of large quantities of highly pure NK cells, and the expanded cell exhibits significant tumor cytotoxicity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="266" publication-number="202627392"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627392.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有三維多孔隙毛細結構之複合銅網及其製作方法</chinese-title>  
        <english-title>COMPOSITE COPPER MESH WITH THREE-DIMENSIONAL POROUS WICK STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">F28F3/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣州力及熱管理科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGZHOU NEOGENE THERMAL MANAGEMENT TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳振賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JEN-SHYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有三維多孔隙毛細結構之複合銅網包含銅網結構以及三維多孔隙毛細結構。銅網結構由複數條銅絲編織而成。三維多孔隙毛細結構分別形成於網格中。每一三維多孔隙毛細結構包含複數條鏈條狀銅結構以及複數個塊狀銅結構。塊狀銅結構設置分佈於鏈條狀銅結構之間，以使塊狀銅結構、鏈條狀銅結構以及銅絲相互連結。其中，三維多孔隙毛細結構之厚度不大於銅網結構之厚度。相較於習知技術，本發明提供之具有三維多孔隙毛細結構之複合銅網可提供更顯著的毛細現象。進一步應用於均溫板毛細結構製作時，可增大加熱區的相變效能提供更好的兩相流循環性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite copper mesh with three-dimensional porous wick structures comprises a copper mesh structure and three-dimensional porous wick structures. The copper mesh structure includes mesh grids, which is woven from copper wires. The three-dimensional porous wick structures are respectively formed within the mesh grids. Each three-dimensional porous wick structure includes chain-like copper structures and block-like copper structures. The block-like copper structures are arranged among the chain-like copper structures. Therefore, the block-like copper structures, the chain-like copper structures, and copper wires are interconnected. Wherein, the thickness of the three-dimensional porous wick structures is no greater than the thickness of the copper mesh structure. Compared with the prior art, the copper mesh with three-dimensional porous wick structures of the invention can provide a significantly enhanced capillary effect. Moreover, the composite copper mesh with three-dimensional porous wick structures can be applied to vapor chamber as wick structure, it can enhance phase change efficiency at evaporator area, and provides better performance of two phase flow circulation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:具有三維多孔隙毛細結構之複合銅網</p>  
        <p type="p">10:銅網結構</p>  
        <p type="p">20:三維多孔隙毛細結構</p>  
        <p type="p">A:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="267" publication-number="202628633"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628633.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直型超接面功率半導體裝置</chinese-title>  
        <english-title>VERTICAL SUPER JUNCTION POWER SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250512B">H10D30/66</main-classification>  
        <further-classification edition="202501120250512B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李羿軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李羿軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李坤彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUNG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳瑞祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, RUEI-CI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種垂直型超接面功率半導體裝置包括半導體基底、半導體基底上的半導體層、半導體層內的(n-1)個柱、井與源極、閘極組件及源極接觸層。半導體基底、半導體層與源極及井與柱各含第一、二導電型載子。半導體層自頂面朝半導體基底的深度方向包括n個堆疊的區段，n≥4的正整數。柱沿深度方向堆疊於半導體層且位在各區段內。井位於第一柱內以貼近頂面。源極位於第一柱內以貼近頂面並由井所分隔。閘極組件間隔設於頂面並位在井的相反兩側。源極接觸層覆蓋源極、井與閘極組件。各區段的摻雜濃度沿深度方向遞減且相鄰區段的摻雜濃度差介於7至50倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vertical super junction power semiconductor device includes a semiconductor substrate containing first conductivity type carriers, a semiconductor layer formed on the semiconductor substrate and containing the first conductivity type carriers, (n-1) pillars located in the semiconductor layer and containing second conductivity type carriers opposite to the first conductivity type carriers, a well, a source, two gate components, and a source contact layer. The semiconductor layer includes n sequentially stacked sections along a depth direction from a top surface thereof toward the semiconductor substrate, where n is a positive integer greater than or equal to 4. The pillars are sequentially stacked from the top surface and extend into the semiconductor layer along the depth direction, and each pillar is disposed within a corresponding on of the regions. The well is positioned within a first pillar of the pillars to be proximate the top surface and contains the second conductivity type carriers. The source is located within the first pillar to be proximate to the top surface, contains the first conductivity type carriers, and is divided by the well into two source regions that are spaced apart from each other. The two gate components are disposed spaced apart from each other on the top surface of the semiconductor layer and are located on opposite sides of the well. Each gate component includes a dielectric layer, a gate layer disposed on the dielectric layer, and an insulating film covering the gate layer. Each dielectric layer covers a first region of the regions and the first pillar, and partially covers a respective corresponding source region. The source contact layer covers and contacts the source regions, the well, and the insulation films. Each section of the semiconductor has a doping concentration, the doping concentration of the sections decreases along the depth direction, and a doping concentration difference between 7 and 50 times each two adjacent sections.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:半導體基底</p>  
        <p type="p">3:半導體層</p>  
        <p type="p">31:頂面</p>  
        <p type="p">4:柱</p>  
        <p type="p">5:井</p>  
        <p type="p">6:源極</p>  
        <p type="p">61:源極區</p>  
        <p type="p">7:閘極組件</p>  
        <p type="p">71:介電層</p>  
        <p type="p">72:閘極層</p>  
        <p type="p">73:絕緣膜</p>  
        <p type="p">8:源極接觸層</p>  
        <p type="p">9:汲極接觸層</p>  
        <p type="p">N1:第一區段</p>  
        <p type="p">N2:第二區段</p>  
        <p type="p">N3:第三區段</p>  
        <p type="p">N4:第四區段</p>  
        <p type="p">P1:第一柱</p>  
        <p type="p">P2:第二柱</p>  
        <p type="p">P3:第三柱</p>  
        <p type="p">W:寬度方向</p>  
        <p type="p">Z:深度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="268" publication-number="202627748"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627748.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多段輸出電壓的電源供應器、檢測系統與檢測方法</chinese-title>  
        <english-title>MULTI-OUTPUT VOLTAGE POWER SUPPLY, DETECTION SYSTEM, AND DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">G06F1/26</main-classification>  
        <further-classification edition="200601120250526B">G06F13/38</further-classification>  
        <further-classification edition="200601120250526B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃順治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛黛娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, TAI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林立凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多段輸出電壓的電源供應器、檢測系統與檢測方法，多段輸出電壓的電源供應器，可以提供測試電壓至待測設備，多段輸出電壓的電源供應器包括變壓器、多個供電軌、微控制器。變壓器提供多種運作電壓；供電軌連接於變壓器，每一供電軌具有迴授電路，每一供電軌輸出對應的測試電壓；微控制器連接於供電軌，微控制器接收選擇要求與調整要求，微控制器根據選擇要求從供電軌中擇一，受選的供電軌為指定軌；微控制器根據調整要求將運作電壓調整為測試電壓並輸出至待測設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-output voltage power supply, detection system, and detection method are provided. The multi-output voltage power supply is capable of providing a plurality testing voltages to a device under test. The multi-output voltage power supply comprises a transformer, a plurality of power rails, and a microcontroller. The transformer provides a multiple operating voltages. Each power rail is connected to the transformer and is equipped with a feedback circuit, allowing each power rail to output a corresponding test voltage. The microcontroller is connected to the power rails and is configured to receive selection requests and adjustment requests. The microcontroller selects one of the power rails based on the selection request, designating it as the specified rail. The microcontroller then adjusts the operating voltage according to the adjustment request to produce the test voltage, which is subsequently supplied to the device under test.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:檢測系統</p>  
        <p type="p">110:週邊設備</p>  
        <p type="p">111:待測設備</p>  
        <p type="p">200:主機板</p>  
        <p type="p">210:訊號介面</p>  
        <p type="p">220:電源介面</p>  
        <p type="p">300:電源供應器</p>  
        <p type="p">310:變壓器</p>  
        <p type="p">320:供電軌</p>  
        <p type="p">321:指定軌</p>  
        <p type="p">330:微控制器</p>  
        <p type="p">341:運作電壓</p>  
        <p type="p">342:測試電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="269" publication-number="202628332"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628332.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電荷幫浦電路</chinese-title>  
        <english-title>CHARGE PUMP CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250124B">H02M3/07</main-classification>  
        <further-classification edition="200601120250124B">H03L7/085</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張唯揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余家緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張介斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEH-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃惠民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HUI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電荷幫浦電路包含電荷幫浦級及濾波級。電荷幫浦級具有一輸出端，且濾波級耦接於輸出端。濾波級包含串接的複數低通濾波器。每一低通濾波器包含電容組件。每一電容組件包含複數插指電容，其中此些電容組件中之一者的此些插指電容具有第一插指間距。此些電容組件中之另一者的此些插指電容具有不同於第一插指間距的第二插指間距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charge pump circuit includes a charge pump stage and a filtering stage. The charge pump stage has an output terminal, and the filtering stage is coupled to the output terminal. The filtering stage includes a plurality of low-pass filters coupled in series. Each low-pass filter includes a capacitor assembly, and each capacitor assembly includes a plurality of interdigitated capacitors. The interdigitated capacitors in one capacitor assembly have a first interdigitated spacing, and the interdigitated capacitors of another capacitor assembly have a second interdigitated spacing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電荷幫浦電路</p>  
        <p type="p">102:電荷幫浦級</p>  
        <p type="p">104:濾波級</p>  
        <p type="p">106:輸出端</p>  
        <p type="p">108:低通濾波器</p>  
        <p type="p">116:第一低通濾波器</p>  
        <p type="p">118:第二低通濾波器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="270" publication-number="202627289"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627289.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149729</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>油冷引擎</chinese-title>  
        <english-title>OIL-COOLED ENGINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250219B">F01P3/02</main-classification>  
        <further-classification edition="200601120250219B">F01M5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-JHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹文晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, WEN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘詳親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, XIANG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許翰林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEU, HAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種油冷引擎，包括有一引擎本體及一汽缸頭蓋。引擎本體具有一油冷室，汽缸頭蓋設置於引擎本體上，具有一溫度感知驅動器及一冷卻構件，並開設有一噴油口。其中，油冷引擎包括一冷卻油路，且冷卻油路可經由溫度感知驅動器切換為一第一冷卻通路或一第二冷卻通路，第一冷卻通路之機油由油冷室流經溫度感知驅動器後，直接由噴油口噴濺至引擎本體中；第二冷卻通路之機油由油冷室流經溫度感知驅動器後，先導引至冷卻構件再由噴油口噴濺至引擎本體中。藉此，本發明係將油冷室及冷卻構件整合於油冷引擎上，俾能透過機油流經油冷室將引擎燃燒後的金屬溫下降，再依據機油溫度的不同，若機油溫度達到目標溫度時可將機油導引至冷卻構件進行冷卻降溫，增進散熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an oil-cooled engine, which includes an engine body and a cylinder head cover. The engine body has an oil-cooled chamber, the cylinder head cover is arranged on the engine body, has a temperature sensing driver and a cooling component, and has an oil injection port. Wherein, the oil-cooled engine includes a cooling oil circuit, and the cooling oil circuit can be switched to a first cooling passage or a second cooling passage through a temperature sensing driver. The oil in the first cooling passage flows from the oil-cooled chamber through the temperature sensing driver, directly sprayed from the oil injection port into the engine body. The oil in the second cooling passage flows from the oil-cooled chamber through the temperature sensing driver, first guided to the cooling component and then sprayed into the engine body from the oil injection port. Therefore, the present invention integrates the oil-cooled chamber and cooling components in the oil-cooled engine, so that after the engine is combusted the metal temperature can be reduced by the oil flowing through the oil-cooled chamber. Then, depending on the temperature of the oil, if the oil temperature reaches the target temperature, the engine oil can be guided to the cooling component for cooling, thereby improving heat dissipation efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:油冷引擎</p>  
        <p type="p">2:引擎本體</p>  
        <p type="p">21:油冷室</p>  
        <p type="p">3:汽缸頭蓋</p>  
        <p type="p">31:溫度感知驅動器</p>  
        <p type="p">32:冷卻構件</p>  
        <p type="p">33:噴油口</p>  
        <p type="p">4:曲軸箱</p>  
        <p type="p">41:油底殼</p>  
        <p type="p">42:油泵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="271" publication-number="202628393"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628393.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於無線通訊振幅相位位移鍵送調變信號之低複雜度軟式輸出檢測方法及其系統及非暫態電腦可讀儲存媒體</chinese-title>  
        <english-title>LOW-COMPLEXITY METHOD FOR SOFT-OUTPUT DETECTION OF AMPLITUDE PHASE SHIFT KEYING MODULATED SIGNALS IN WIRELESS COMMUNICATIONS AND SYSTEM THEREOF, AND NON-TRANSITORY COMPUTER READABLE STORGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H04L27/22</main-classification>  
        <further-classification edition="200601120250303B">H04L25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中正大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG CHENG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宗憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TSUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敬紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JING-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊東霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DON-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種應用於無線通訊振幅相位位移鍵送調變信號之低複雜度軟式輸出檢測方法，包含將振幅相位位移鍵送星座點區分成同心圓，並排序各同心圓之相位位移鍵送星座點而產生有序相位位移鍵送星座點；依據星座點座標及信號座標計算各同心圓之有序相位位移鍵送星座點之第一星座點與接收信號之間的距離平方值，並找出對應距離平方值之最小者的第一接近星座點，並依據第一接近星座點決定最大似然比星座點標籤值；執行迭代程序，依序搜尋有序相位位移鍵送星座點，並找出相對應距離平方值之最小者；及計算對數似然比。藉此，降低檢測複雜度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A low-complexity method for soft-output detection of Amplitude Phase Shift Keying (APSK) modulated signals in wireless communications is proposed. The low-complexity method includes partitioning and ordering all APSK constellation points into rings of ordered phase shift keying (PSK) constellation points; computing a distance squared between a first constellation point of the ordered PSK constellation points of each ring and the received signal according to coordinates of the constellation points and the received signal, and finding the first nearest constellation point corresponding to the smallest distance squared, and determining a maximum log-likelihood ratio constellation point label according to the first nearest constellation point; performing an iterative search strategy to search over the ordered irregular PSK constellation points, and finding a smallest corresponding distance squared and computing log-likelihood ratios. Therefore, the low-complexity method of the present disclosure requires very low computational complexity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S0:應用於無線通訊APSK調變信號之低複雜度軟式輸出檢測方法</p>  
        <p type="p">S02,S04,S06,S08,S10:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="272" publication-number="202625881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹木防風固定系統</chinese-title>  
        <english-title>TREE WIND-RESISTANCE ANCHORING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">A01G17/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旻臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MIN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旻臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MIN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種樹木防風固定系統，其係設置於一樹木之周圍，樹木防風固定系統包含一支撐裝置、一連接裝置及一抵頂裝置。支撐裝置包含複數支撐件，支撐件設於樹木周圍的地面，各支撐件具有一基部及凸設於基部的一第一連接部；連接裝置包含複數連接件，各連接件之兩端具有一第一連接端及一第二連接端，第一連接端連接各支撐件的第一連接部；抵頂裝置包含複數抵頂件，抵頂件環繞設置於樹木的樹幹周緣，各抵頂件具有一抵頂部及一第二連接部，抵頂部抵頂於樹木的樹幹周緣，第二連接部凸設於抵頂部遠離樹木的側面並連接第二連接端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tree wind-resistance anchoring system installed around a tree. The system includes a supporting device, a connecting device, and a top-bracing device. The supporting device consists of multiple support elements, which are installed on the ground around the tree. Each support element has a base and a first connecting part protruding from the base. The connecting device consists of multiple connecting components, each with a first connection end and a second connection end at its two ends. The first connection end connects to the first connecting part of each support element. The top-bracing device consists of multiple bracing components arranged around the tree trunk. Each bracing component has a bracing part and a second connecting part. The bracing part braces against the perimeter of the tree trunk, while the second connecting part protrudes from the side of the bracing part opposite the tree and connects to the second connection end.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:樹木防風固定系統</p>  
        <p type="p">200:樹木</p>  
        <p type="p">10:支撐裝置</p>  
        <p type="p">11:支撐件</p>  
        <p type="p">111:基部</p>  
        <p type="p">112:第一連接部</p>  
        <p type="p">113:插入部</p>  
        <p type="p">20:連接裝置</p>  
        <p type="p">21:連接件</p>  
        <p type="p">211:第一連接端</p>  
        <p type="p">212:第二連接端</p>  
        <p type="p">30:抵頂裝置</p>  
        <p type="p">31:抵頂件</p>  
        <p type="p">311:抵頂部</p>  
        <p type="p">312:第二連接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="273" publication-number="202625943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能炒菜機</chinese-title>  
        <english-title>INTELLIGENT COOKING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250319B">A47J27/00</main-classification>  
        <further-classification edition="200601120250319B">A47J36/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁嘉廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, JIA TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀勝元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, SHENG YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁嘉廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, JIA TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀勝元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, SHENG YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智能炒菜機，其包含一機台提供一熱源至該機台之一置物面，一容器對應該熱源放置於該置物面至少一部份，鄰近該容器設置一升降裝置，該升降裝置用於垂直升降一鍋蓋，該鍋蓋設有一攪拌部以及一抽氣部，該攪拌部用以攪拌一食材，並使該熱源均勻分布於該食材中，該抽氣部抽取該容器內的一氣體，以調節內部壓力和濕度，該智能炒菜機大幅提升使用者操作的便利性和靈活性，該鍋蓋垂直升降的設計亦減少了該食材噴濺等問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent cooking machine has a base unit that provides a heat source to a surface of the unit, a container placed on the surface, corresponding to the heat source, with at least a part of the container positioned on the surface. An elevating device is set up adjacent to the container, which is used to vertically lift a lid. The lid is equipped with a stirring mechanism and an air extraction component. The stirring mechanism is used to stir ingredients, ensuring that the heat source is evenly distributed throughout the ingredients. The air extraction component extracts gas from inside the container to regulate internal pressure and humidity. This intelligent cooking machine significantly enhances the convenience and flexibility of user operations. The vertical lifting design of the lid also helps reduce issues such as ingredient splashing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:智能炒菜機</p>  
        <p type="p">11:機台</p>  
        <p type="p">111:人機介面區</p>  
        <p type="p">112:置物面</p>  
        <p type="p">1121:加熱部</p>  
        <p type="p">12:料盒曲</p>  
        <p type="p">121:移動機構</p>  
        <p type="p">1211:移動軌道</p>  
        <p type="p">1212:移動盤</p>  
        <p type="p">122:料盒</p>  
        <p type="p">1221:料盒開口</p>  
        <p type="p">13:倒料機構</p>  
        <p type="p">131:旋轉結構</p>  
        <p type="p">132:固定端</p>  
        <p type="p">133:載物端</p>  
        <p type="p">14:容器</p>  
        <p type="p">141:容置空間</p>  
        <p type="p">142:容器開口</p>  
        <p type="p">15:升降裝置</p>  
        <p type="p">151:升降軌道</p>  
        <p type="p">152:支撐塊</p>  
        <p type="p">153:驅動馬達</p>  
        <p type="p">16:鍋蓋</p>  
        <p type="p">161:尖部</p>  
        <p type="p">1611:穿孔</p>  
        <p type="p">1612:固定部</p>  
        <p type="p">162:基部</p>  
        <p type="p">163:攪拌部</p>  
        <p type="p">164:抽氣部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="274" publication-number="202628132"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628132.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149738</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自適應環境感測灌溉系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250320B">G16Y10/05</main-classification>  
        <further-classification edition="202001120250320B">G16Y20/10</further-classification>  
        <further-classification edition="202001120250320B">G16Y40/20</further-classification>  
        <further-classification edition="200601120250320B">A01G25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂學德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHIUE-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方麒瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, QI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林忠輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHONG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫辰祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉中勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHONG-QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁玉芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自適應環境感測灌溉系統，至少包含：一第一溫度計、一日照計、一土壤溼度感測器、一酸鹼值感測器、一雨量感測器、一可程式化邏輯控制器、一植物育成平台及一監控平台，利用收集到的即時環境數據，如環境溫度、太陽光源強度、土壤濕度、土壤酸鹼值、降雨量等，來主動提供即時且精確的動態調整灌溉策略及預警服務。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:自適應環境感測灌溉系統</p>  
        <p type="p">11:第一溫度計</p>  
        <p type="p">12:日照計</p>  
        <p type="p">13:土壤溼度感測器</p>  
        <p type="p">14:酸鹼值感測器</p>  
        <p type="p">15:雨量感測器</p>  
        <p type="p">16:微處理器</p>  
        <p type="p">17:可程式化邏輯控制器</p>  
        <p type="p">18:植物育成平台</p>  
        <p type="p">181:布簾升降裝置</p>  
        <p type="p">182:植物生長燈</p>  
        <p type="p">183:灑水裝置</p>  
        <p type="p">184:營養液噴灑裝置</p>  
        <p type="p">185:第二溫度計</p>  
        <p type="p">19:監控平台</p>  
        <p type="p">2:太陽能發電裝置</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;at&lt;/i&gt;
        &lt;/sub&gt;:環境溫度訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;si&lt;/i&gt;
        &lt;/sub&gt;:太陽光源強度訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;pH&lt;/i&gt;
        &lt;/sub&gt;:酸鹼值訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;sm&lt;/i&gt;
        &lt;/sub&gt;:土壤溼度訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;pr&lt;/i&gt;
        &lt;/sub&gt;:降雨量訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;it&lt;/i&gt;
        &lt;/sub&gt;:室內溫度訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;j&lt;/i&gt;1&lt;/sub&gt;:第一判斷訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;j&lt;/i&gt;2&lt;/sub&gt;:第二判斷訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;j&lt;/i&gt;3&lt;/sub&gt;:第三判斷訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;j&lt;/i&gt;4&lt;/sub&gt;:第四判斷訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;:第一控制訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;2&lt;/sub&gt;:第二控制訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;3&lt;/sub&gt;:第三控制訊號</p>  
        <p type="p">
        &lt;i&gt;S&lt;/i&gt;
        &lt;sub&gt;4&lt;/sub&gt;:第四控制訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="275" publication-number="202628030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149740</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素數據處理方法、顯示驅動晶片、顯示器及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250103B">G09G3/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商集創北方（珠海）科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (ZHUHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭嘉洵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊舜勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁偉倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種像素數據處理方法，係由一顯示驅動晶片執行，以將M×N個輸入像素數據處理為2(M×N)個輸出像素數據，且包括以下步驟：當第j個和第j+1個輸入像素數據之間的一像素灰階差值大於一預定閥值時，將第j個和第j+1個所述輸入像素數據複製為第j+(j-1)個及第j+j個輸出像素數據；以及在所述像素灰階差值小於該預定閥值的情況下，對第j個和第j+1個輸入像素數據執行一平均運算以獲得一平均像素數據，接著以第j個輸入像素數據和該平均像素數據分別作為第j+(j-1)個及第j+j個輸出像素數據；其中，M、N皆為正整數，且j係起始值為1的正整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:在第j個所述輸入像素數據與第j+1個所述輸入像素數據之間的一像素灰階差值大於一預定閥值的情況下，將第j個所述輸入像素數據複製為第j+(j-1)個所述輸出像素數據與第j+j個所述輸出像素數據</p>  
        <p type="p">S2:在所述像素灰階差值小於該預定閥值的情況下，對第j個所述輸入像素數據與第j+1個所述輸入像素數據執行一平均運算以獲得一平均像素數據，並以第j個所述輸入像素數據和該平均像素數據分別作為第j+(j-1)個所述輸出像素數據與第j+j個所述輸出像素數據</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="276" publication-number="202627568"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627568.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射耦合裝置</chinese-title>  
        <english-title>LASER COUPLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250217B">G02B6/26</main-classification>  
        <further-classification edition="200601120250217B">G02B6/32</further-classification>  
        <further-classification edition="200601120250217B">G02B6/122</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊烙亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IROYAL TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃清河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃忠捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈永屏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA, YUNG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射光源模組及其雷射耦合裝置，雷射光源模組包括第一雷射光源及第一聚光元件，雷射耦合裝置包括雷射光源模組、第一光傳輸元件、導光元件、第二聚光元件以及第二光傳輸元件。第一雷射光源包括座部、殼部及發光部。殼部具有相對的底端和出光端。底端固定於座部，發光部設置於座部並位於殼部內。發光部適於產生第一雷射光束。第一聚光元件固定於殼部的出光端或座部，並位於第一雷射光束的傳遞路徑上。第一光傳輸元件適於傳輸第二雷射光束。導光元件設置於第一光傳輸元件的光路下游。第二聚光元件設置於導光元件和第一聚光元件的光路下游。第二光傳輸元件位於第二聚光元件的光路下游，其中該第二聚光元件適於耦合該第一雷射光束與該第二雷射光束至該第二光傳輸元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser light source module and a laser coupling device thereof are provided. The laser light source module includes a first laser light source and a first condensing element, and the laser coupling device includes the laser light source module, a first light transmission element, a light guide element, a second condensing element and a second light transmission element. The first laser light source includes a base part, a shell part and a light-emitting part. The shell part has a bottom end and a light-emitting end opposite to the bottom end. The bottom end is fixed to the base part, and the light-emitting part is disposed at the base part and located in the shell part. The light-emitting part is adapted to generate a first laser beam. The first condensing element is fixed to the light-emitting end of the shell part or the base part and is located on a transmission path of the first laser beam. The first light transmission element is adapted to transmit a second laser beam. The light guide element is disposed on downstream of a light transmission path of the first light transmission element. The second condensing element is disposed on downstream of light transmission paths of the light guide element and the first condensing element. The second light transmission element is located on downstream of a light transmission path of the second condensing element, wherein the second condensing element is adapted to couple the first laser beam and the second laser beam to the second light transmission element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雷射光源模組</p>  
        <p type="p">100:雷射耦合裝置</p>  
        <p type="p">110:第一雷射光源</p>  
        <p type="p">111:座部</p>  
        <p type="p">112:殼部</p>  
        <p type="p">120:第一聚光元件</p>  
        <p type="p">130:第一光傳輸元件</p>  
        <p type="p">140:導光元件</p>  
        <p type="p">150:第二聚光元件</p>  
        <p type="p">160:第二光傳輸元件</p>  
        <p type="p">B:底端</p>  
        <p type="p">E:出光端</p>  
        <p type="p">L1:第一雷射光束</p>  
        <p type="p">L2:第二雷射光束</p>  
        <p type="p">S1、S2、S3:導光面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="277" publication-number="202628719"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628719.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149743</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆晶式發光二極體及其製造方法</chinese-title>  
        <english-title>FLIP CHIP LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250627B">H10H20/824</main-classification>  
        <further-classification edition="202501120250627B">H10H20/857</further-classification>  
        <further-classification edition="202501120250627B">H10H20/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭羽彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡景元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鴻達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HONG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種覆晶式發光二極體及其製造方法，覆晶式發光二極體包含一透明基板、一磊晶複合層、一第一導電型電極焊墊、一第二導電型電極焊墊及一晶圓鍵結複合層。其中，磊晶複合層設置於透明基板上，第一導電型電極焊墊設置於透明基板上並電性連接至磊晶複合層。第二導電型電極焊墊設置於磊晶複合層上，電性連接至磊晶複合層，與該第一導電型電極焊墊位於透明基板同側之同一水平面上。晶圓鍵結複合層包含至少一二氧化鈦（TiO &lt;sub&gt;2&lt;/sub&gt;）層及至少一二氧化矽（SiO &lt;sub&gt;2&lt;/sub&gt;）層，夾置於磊晶複合層與透明基板間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flip-chip light-emitting diode and a manufacturing method thereof are provided. The flip-chip light-emitting diode includes a transparent substrate, an epitaxial composite layer, a first conductive type electrode pad, a second conductive type electrode pad and a wafer bonding composite layer. The epitaxial composite layer is disposed on the transparent substrate, and the first conductive electrode pad is disposed on the transparent substrate and electrically connected to the epitaxial composite layer. The second conductive type electrode pad is disposed on the epitaxial composite layer, is electrically connected to the epitaxial composite layer, and is configured on the same level as the first conductive type electrode pad on the same side of the transparent substrate. The wafer bonding composite layer includes at least one titanium dioxide (TiO &lt;sub&gt;2&lt;/sub&gt;) layer and at least one silicon dioxide (SiO &lt;sub&gt;2&lt;/sub&gt;) layer, which is sandwiched between the epitaxial composite layer and the transparent substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:磊晶成長基板</p>  
        <p type="p">201:N型歐姆接觸層</p>  
        <p type="p">202:第二化合物半導體層</p>  
        <p type="p">203:發光層</p>  
        <p type="p">204:第一化合物半導體層</p>  
        <p type="p">205:P型歐姆接觸層</p>  
        <p type="p">206:二氧化鈦層</p>  
        <p type="p">207:二氧化矽層</p>  
        <p type="p">208:透明基板</p>  
        <p type="p">209:第一導電型電極</p>  
        <p type="p">210:第二導電型電極</p>  
        <p type="p">211:第一導電型電極焊墊</p>  
        <p type="p">212:第二導電型電極焊墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="278" publication-number="202628863"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628863.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>巨量轉移設備</chinese-title>  
        <english-title>MASS TRANSFER EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P72/00</main-classification>  
        <further-classification edition="202601120260401B">H10P72/50</further-classification>  
        <further-classification edition="202601120260401B">H10P72/76</further-classification>  
        <further-classification edition="202601120260401B">H10H29/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錼創顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLAYNITRIDE DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥穆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-MU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱竑茗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, HUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒漢澄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, HAN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡仲威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種巨量轉移設備，適於將設於一元件基板上的複數個微型晶片轉移至一目標基板。巨量轉移設備的一第一載台與一第二載台適於分別搭載元件基板與目標基板，並可於第一方向移動，且元件基板與目標基板間的至少一對應區域在一第二方向上相距一距離。一致動單元適於控制第一載台與第二載台的至少其中之一運動。一測距儀適於測量元件基板及目標基板在第一方向上移動時所分別具有的一第一變化資訊及一第二變化資訊，其中第一變化資訊及第二變化資訊包含對應區域在第二方向上的向量。一處理單元依據第一變化資訊或/及第二變化資訊得到一補償值。致動單元依據補償值改變該距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a mass transfer equipment, which is suitable for transferring a plurality of microchips on a component substrate to a target substrate. A first stage and a second stage of the mass transfer equipment are suitable for carrying the component substrate and the target substrate respectively, and can move in the first direction, and at least one corresponding area between the component substrate and the target substrate is separated by a distance in a second direction. An actuating unit is suitable for controlling at least one of the first stage and the second stage to move or/and rotate. A rangefinder is suitable for measuring a first change information and a second change information respectively possessed by the component substrate and the target substrate when moving in the first direction, wherein the first change information and the second change information include vectors of the corresponding area in the second direction. A processing unit obtains a compensation value based on the first change information or/and the second change information. The actuating unit changes the distance according to the compensation value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:巨量轉移設備</p>  
        <p type="p">11:第一載台</p>  
        <p type="p">111:開孔</p>  
        <p type="p">12:第二載台</p>  
        <p type="p">14:測距儀</p>  
        <p type="p">17:雷射光源</p>  
        <p type="p">2:元件基板</p>  
        <p type="p">21:基板</p>  
        <p type="p">22:微型晶片</p>  
        <p type="p">23:黏著層</p>  
        <p type="p">3:目標基板</p>  
        <p type="p">d:距離</p>  
        <p type="p">D1(Y):第一方向</p>  
        <p type="p">D2(Z):第二方向</p>  
        <p type="p">D3(X):第三方向</p>  
        <p type="p">L:光軸</p>  
        <p type="p">S1、S2:表面</p>  
        <p type="p">v1、v2:速度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="279" publication-number="202627652"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627652.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>震動鏡頭模組及其震動鏡頭</chinese-title>  
        <english-title>VIBRATION CAMERA MODULE AND VIBRATION LENS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250319B">G03B17/56</main-classification>  
        <further-classification edition="202101120250319B">G03B17/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紘立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETERGE OPTO-ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中揚光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG YANG TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昀憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUN-XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祖孟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TSU-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國樟</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種震動鏡頭包括一鏡頭及一震動裝置，該鏡頭包括一鏡筒、一前蓋、設置在該鏡筒與該前蓋之間的一前鏡片、及設置在該鏡筒內的一鏡片組。該震動裝置包括接觸該前蓋但不接觸該前鏡片的一震動環片。此外，該震動鏡頭還可再包括用以對該前蓋及／或該前鏡片加熱的一加熱裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vibration camera includes a lens and a vibration device, wherein the lens comprises a lens barrel, a front cover, a front lens disposed between the lens barrel and the front cover, and a lens assembly disposed within the lens barrel. The vibration device includes a vibration ring that contacts the front cover but not in contact with the front lens. Additionally, the vibration camera may further include a heating device for heating the front cover and/or the front lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鏡頭</p>  
        <p type="p">11:鏡筒</p>  
        <p type="p">12:前鏡片</p>  
        <p type="p">13:前蓋</p>  
        <p type="p">131:底邊</p>  
        <p type="p">2:座體</p>  
        <p type="p">201:頂面</p>  
        <p type="p">202:底面</p>  
        <p type="p">21:第一接收槽</p>  
        <p type="p">203:環形凹槽</p>  
        <p type="p">211、212:側壁</p>  
        <p type="p">3:加熱裝置</p>  
        <p type="p">311:加熱環片</p>  
        <p type="p">312:加熱裝置3的導線段</p>  
        <p type="p">35:溫度感測器</p>  
        <p type="p">4:震動裝置</p>  
        <p type="p">41:震動環片</p>  
        <p type="p">42:震動裝置4的導線段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="280" publication-number="202627646"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627646.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素電路</chinese-title>  
        <english-title>PIXEL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250418B">G02F1/167</main-classification>  
        <further-classification edition="201901120250418B">G02F1/1676</further-classification>  
        <further-classification edition="201601120250418B">G09G3/3225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元太科技工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭文瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, WEN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁廣恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, KUANG-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素電路，包含第一電晶體、掃描線、數據線、選擇單元、儲存電容以及畫素電極。第一電晶體包含閘極、源極以汲極。掃描線電性連接第一電晶體的閘極。數據線電性連接至第一電晶體的源極。選擇單元電性連接至第一電晶體的汲極。儲存電容的第一端電性連接至第一電晶體的汲極與選擇單元的輸入節點。畫素電極電性連接選擇單元的輸出節點，且選擇單元提供驅動電壓至畫素電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel circuit include a first transistor, a scan line, a data line, a selective unit, a storage capacitor, and a pixel electrode. The first transistor includes a gate electrode, a source electrode, and a drain electrode. The scan line is electrically connected with the gate electrode of the first transistor. The data line is electrically connected with the source electrode of the first transistor. The selective unit is electrically connected with the drain electrode of the first transistor. A first end of the storage capacitor is electrically connected with the drain electrode of the first transistor and an input node of the selective unit. The pixel electrode is electrically connected with an output node of the selective unit. The selective unit provides a driving voltage to the pixel electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:畫素電路</p>  
        <p type="p">110:第一電晶體</p>  
        <p type="p">G:閘極</p>  
        <p type="p">S:源極</p>  
        <p type="p">D:汲極</p>  
        <p type="p">SL:掃描線</p>  
        <p type="p">DL:數據線</p>  
        <p type="p">120:儲存電容</p>  
        <p type="p">122:第一端</p>  
        <p type="p">124:第二端</p>  
        <p type="p">130:選擇單元</p>  
        <p type="p">132:輸入節點</p>  
        <p type="p">134:輸出節點</p>  
        <p type="p">140:前面板疊構上電極</p>  
        <p type="p">142:前面板疊構電容</p>  
        <p type="p">150:畫素電極</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">Vdd:高電壓源</p>  
        <p type="p">Vss:低電壓源</p>  
        <p type="p">Vp:驅動電壓</p>  
        <p type="p">Vcom:共用電壓</p>  
        <p type="p">Vq:資料電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="281" publication-number="202628124"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628124.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像辨識裝置及方法</chinese-title>  
        <english-title>IMAGE RECOGNITION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250602B">G16H30/40</main-classification>  
        <further-classification edition="201801120250602B">G16H30/20</further-classification>  
        <further-classification edition="201701120250602B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺北醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIPEI MEDICAL UNIVERSITY (TMU)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張靜宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇祐瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YOU-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇品諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, PIN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像辨識裝置。該裝置基於一預處理規則，產生對應該切片影像之一預處理影像。該裝置分割該預處理影像中之至少一細胞核影像，以產生對應該至少一細胞核影像之一細胞核特徵。該裝置基於該預處理影像，擷取對應該預處理影像之一紋理特徵。該裝置基於該預處理影像、該至少一細胞核影像之該細胞核特徵及該紋理特徵，產生對應該預處理影像之複數個潛在病理區域之一辨識結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image recognition device. The device generates a preprocessed image corresponding to the slice image based on a preprocessing rule. The device segments at least one cell nucleus image in the preprocessed image to generate a cell nucleus feature corresponding to the at least one cell nucleus image. Based on the preprocessed image, the device extracts a texture feature corresponding to the preprocessed image. The device generates a recognition result corresponding to a plurality of potential pathological areas of the preprocessed image based on the nucleus feature and the texture feature of the at least one cell nucleus image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">IRD:影像辨識裝置</p>  
        <p type="p">11:收發介面</p>  
        <p type="p">12:儲存器</p>  
        <p type="p">13:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="282" publication-number="202628024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>虛擬超音波訓練系統及虛擬超音波訓練方法</chinese-title>  
        <english-title>TRAINING SYSTEM FOR VIRTUAL ULTRASOUND AND TRAINING METHOD FOR VIRTUAL ULTRASOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G09B23/28</main-classification>  
        <further-classification edition="200601120251103B">G09B19/00</further-classification>  
        <further-classification edition="200601120251103B">A61B8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國醫藥大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝凱生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KAI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊東華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許玉龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張詩聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種虛擬超音波訓練系統及虛擬超音波訓練方法，虛擬超音波訓練系統包含一感測裝置、一資料處理裝置及一顯示裝置。感測裝置用以感測一手部動作訊號及一語音訊號。資料處理裝置分析手部動作訊號而進行虛擬超音波檢測。資料處理裝置辨識複數超音波資料中之一待播放者而產生一虛擬模型判斷結果。資料處理裝置依據虛擬模型判斷結果產生一解剖模型動畫。顯示裝置在一虛擬場景中播放解剖模型動畫。藉此，提升超音波操作的模擬訓練的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A training system for virtual ultrasound and a training method for virtual ultrasound are proposed. The training system for virtual ultrasound includes a sensing device, a data processing device and a display device. The sensing device is configured to sense a hand movement signal and a voice signal. The data processing device analyzes the hand movement signal to perform virtual ultrasound detection. The data processing device identifies one of a plurality of ultrasound data to be played and generates a virtual model judgment result. The data processing device generates an anatomical model animation based on the virtual model judgment result. The display device plays the anatomical model animation in a virtual scene. Thus, the effect of simulation training of ultrasonic operation is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:虛擬超音波訓練系統</p>  
        <p type="p">310:感測裝置</p>  
        <p type="p">311:手部位置感測器</p>  
        <p type="p">312:頭部位置感測器</p>  
        <p type="p">313:參考點位置感測器</p>  
        <p type="p">320:資料處理裝置</p>  
        <p type="p">321:顯示產生模組</p>  
        <p type="p">322:超音波資料接收模組</p>  
        <p type="p">323:分析模組</p>  
        <p type="p">324:辨識模組</p>  
        <p type="p">325:互動模組</p>  
        <p type="p">326:模型動畫模組</p>  
        <p type="p">330:顯示裝置</p>  
        <p type="p">331:穿戴虛擬實境顯示器</p>  
        <p type="p">332:穿戴混合實境顯示器</p>  
        <p type="p">333:投影顯示器</p>  
        <p type="p">340:資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="283" publication-number="202626118"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626118.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛室內香氛裝置及其使用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">A61L9/01</main-classification>  
        <further-classification edition="200601120250228B">A61L9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>興聯科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳楊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟欣達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種車輛室內香氛裝置及其使用方法，主要包括︰一第一基座；一第二基座，係設置於該第一基座上；一香氛風扇，係一端連接該第一基座上，另一端連接該第二基座上；以及一香氛單元，係設置於該第一基座上；其中，該香氛風扇可將該香氛單元的香味吹入車內鼓風機，再透過車內循環系統帶入車室內，以提升車內氣味進行以下步驟 : S1 將香氛單元設置於第一基座上；S2 啟動香氛風扇，使香味吹入車內鼓風機；S3 透過車內循環系統將香味帶入車室內；S4 透過顯示器通知車主更換香氛材料；S5 根據需要選擇ECO模式或循環模式以控制香氛風扇的運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:車輛室內香氛裝置</p>  
        <p type="p">10:第一基座</p>  
        <p type="p">11:香氛風扇</p>  
        <p type="p">12:香氛單元</p>  
        <p type="p">20:第二基座</p>  
        <p type="p">50:可替換的香氛材料盒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="284" publication-number="202626549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐火保溫磚</chinese-title>  
        <english-title>INSULATING REFRACTORY BRICK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C04B33/13</main-classification>  
        <further-classification edition="200601120250402B">C04B33/132</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國文化大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINESE CULTURE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王子奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王澤生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TSE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種耐火保溫磚，其包括5wt%-75wt%的底渣、10wt%-45wt%的結合劑、10wt%-35wt%的發泡劑、少於20wt%的汙泥；以及少於7wt%的骨材，其中底渣含有氧化鈣，結合劑含有三氧化二鋁，耐火保溫磚的成份不包括水泥，且骨材為陶瓷廢料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an insulating refractory brick, which includes a bottom ash of 5wt%-75wt%, binder of 10wt%-45wt%, foaming agent of 10wt%-35wt%, sludge of equal or less than 20 wt% and aggregate of equal or less than 7 wt%. The bottom ash contains calcium oxide, and the binder contains aluminum oxide. The composition of the insulating refractory brick does not include cement, and the aggregate is ceramic waste.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S200:製造方法</p>  
        <p type="p">S202~S212:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="285" publication-number="202627775"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627775.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無縫觸控顯示模組</chinese-title>  
        <english-title>SEAMLESS TOUCH DISPLAY MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250627B">G06F3/041</main-classification>  
        <further-classification edition="200601120250627B">G02F1/13357</further-classification>  
        <further-classification edition="200601120250627B">G02F1/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致伸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹偉平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, WEI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">無縫觸控顯示模組包括透光蓋板、遮蔽層、組裝電路板及背光模組。遮蔽層設置在透光蓋板的下表面上，以定義透光區域。組裝電路板位於遮蔽層下方，並具有觸控感測區域，其中透光區域的垂直投影鄰近或對應觸控感測區域的垂直投影。背光模組位於遮蔽層下方，並且設置在組裝電路板上方或下方，並且包括發光元件及導光板。導光板側向鄰接發光元件，其中透光區域的垂直投影位於導光板的垂直投影內。當背光模組設置在組裝電路板下方時，組裝電路板具有對應透光區域的貫穿開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A seamless touch display module includes a transparent cover, a shielding layer, a printed circuit board assembly and a backlight module. The shielding layer is disposed on the lower surface of the light-transmitting cover plate to define a light-transmitting region. The printed circuit board assembly is located beneath the shielding layer and has a touch sensing region, in which a vertical projection of the light-transmitting region is adjacent to or corresponds to a vertical projection of the touch sensing region. The backlight module is located beneath the shielding layer and is disposed on or beneath the printed circuit board assembly, and includes a light-emitting element and a light guide plate. The light guide plate is laterally adjacent to the light emitting element, in which the vertical projection of the light-transmitting region is located within a vertical projection of the light guide plate. When the backlight module is disposed beneath the printed circuit board assembly, the printed circuit board assembly has a through opening corresponding to the light-transmitting region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:透光蓋板</p>  
        <p type="p">120:遮蔽層</p>  
        <p type="p">120a:透光區域</p>  
        <p type="p">130:組裝電路板</p>  
        <p type="p">130t:貫穿開口</p>  
        <p type="p">144:導光板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="286" publication-number="202627790"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627790.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149782</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視覺化音效調整方法以及程式</chinese-title>  
        <english-title>VISUAL SOUND EFFECT ADJUSTMENT METHOD AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F3/16</main-classification>  
        <further-classification edition="201301120250303B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致伸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周世耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOU, SHYH-YAW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳崇瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮倉勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, CHANG-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂弘德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, HUNG-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭瑞仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JUI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種視覺化音效調整方法以及程式。視覺化音效調整方法可應用於一視覺化音效調整程式之中，而令一電子計算機執行以下步驟，包括：擷取一第一音訊；自第一音訊中識別出一第一聲音元素，並顯示出對應第一聲音元素之一第一代表圖標與一第一音量設定圖標；判斷是否調整第一聲音元素之音量設定；於調整第一聲音元素之音量設定後，擷取一第二音訊，並將第二音訊中的第一聲音元素抽離；以及重製第二音訊，加入音量設定調整後的第一聲音元素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A visual sound effect adjustment method and program. The visual sound effect adjustment method can be applied to a visual sound effect adjustment program, and causes an electronic computer to perform the following steps, including: acquiring a first audio signal; identifying a first sound element from the first audio signal, and displaying a first representative icon and a first volume setting icon corresponding to the first sound element; determining whether to adjust the volume setting of the first sound element; after adjusting the volume setting of the first sound element, retrieve a second audio signal, and extracting the first sound element from the second audio signal; and reproducing the second audio signal, adding the first sound element whose volume setting has been adjusted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S105:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="287" publication-number="202626423"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626423.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三輪機車及廣告套件</chinese-title>  
        <english-title>MOTORIZED TRICYCLEAND ADVERTISEMENT KIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250103B">B62K5/027</main-classification>  
        <further-classification edition="202001120250103B">B62J9/20</further-classification>  
        <further-classification edition="200601120250103B">G09F21/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADATA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江昱承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江在民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TSAI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種三輪機車及廣告套件。三輪機車包含：機車本體及廣告套件。機車本體的後座設置有置物箱。廣告套件包含：四個廣告燈箱、多個廣告板、多個樞接構件及多個固定組件。四個廣告燈箱分別設置於置物箱的四個側面；各個廣告燈箱具有箱本體及蓋體，箱本體具有容置空間。容置空間中用以容置廣告板。蓋體以磁吸的方式，與箱本體連接，以封閉容置空間的開口。其中兩個廣告燈箱能相對箱本體旋轉，且兩個廣告燈箱能旋轉後相互抵靠，並與箱本體共同構成類似三角結構。另外兩個廣告燈箱固定於箱本體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a motorized tricycleand an advertisement kit. The motorcycle includes: a motorcycle body and an advertisement kit. A storage box is installed on the rear seat of the motorcycle body. The advertisement kit comprises: four advertising light boxes, a plurality of advertisement panels, a plurality of pivot components, and a plurality of fastening components. The four advertising light boxes are respectively installed on the four sides of the storage box. Each advertising light box comprises a box body and a cover. The box body has a containing space designed to hold advertisement panels. The cover is magnetically attached to the box body to seal the opening of the containing space. Two of the advertising light boxes can rotate relative to the box body, and after rotation, the two advertising light boxes can lean against each other, forming a triangular structure together with the box body. The other two advertising light boxes are fixed to the box body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:置物箱</p>  
        <p type="p">21:活動門</p>  
        <p type="p">3:廣告套件</p>  
        <p type="p">31:旋轉燈箱</p>  
        <p type="p">32:固定燈箱</p>  
        <p type="p">34:固定組件</p>  
        <p type="p">35:樞接構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="288" publication-number="202626432"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626432.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腳踏板運動訊號檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250325B">B62M6/50</main-classification>  
        <further-classification edition="200601120250325B">G01L5/22</further-classification>  
        <further-classification edition="200601120250325B">G01R15/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光旴科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳侑郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種腳踏板運動訊號檢測裝置，其主要包括定子套軸以及內套軸，定子套軸是穿設於腳踏板轉軸軸孔內之軸承上，且定子套軸內設有定位槽，並且定子套軸一端開設有與定位套軸連通的穿孔，內套軸是自穿孔穿入定位槽內，並以螺紋或緊配方式與定子套軸固定，且內套軸的外周表面設有至少一壓力感測單元用以量測踩踏腳踏板的施力強度以及力量分布在健身車踏板表面的施力狀況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:定子套軸</p>  
        <p type="p">21:定位槽</p>  
        <p type="p">22:穿孔</p>  
        <p type="p">23:內螺紋</p>  
        <p type="p">3:內套軸</p>  
        <p type="p">31:壓力感測單元</p>  
        <p type="p">32:外螺紋</p>  
        <p type="p">4:控制電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="289" publication-number="202626251"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626251.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升降式刀庫系統</chinese-title>  
        <english-title>LIFTING TOOL MAGAZINE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">B23Q3/155</main-classification>  
        <further-classification edition="200601120250114B">B23Q3/157</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡和勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種升降式刀庫系統，設置於加工機上，升降式刀庫系統包含升降式儲刀裝置及刀具交換裝置。升降式儲刀裝置具備可沿Y軸移動的升降單元，升降單元上設置多個刀夾座用於儲存刀具，刀具交換裝置能夠沿X軸、Z軸至少一軸移動，將預定的刀夾座從換刀夾座位置移動至換刀位置，以供主軸進行刀具更換，以達到高效換刀及減少刀庫佔用加工機空間。並可根據需求於刀具交換裝置安裝刀夾座旋轉驅動單元，其可根據主軸換刀方向需求，驅使刀夾座繞Z軸旋轉，用以達到多方向換刀的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a lifting tool magazine system installed on a machining device. The lifting tool magazine system comprises a lifting tool storage device and a tool exchange device. The lifting tool storage device includes a lifting unit capable of moving along the Y-axis. Multiple tool clamp holders are arranged on the lifting unit for storing tools. The tool exchange device can move along at least one of the X-axis or Z-axis to transfer a designated tool clamp holder from the tool clamp holder position to the tool exchange position, allowing the spindle to perform tool replacement. This configuration achieves efficient tool changing while reducing the space occupied by the tool magazine on the machining device. Additionally, a tool clamp holder rotation drive unit can be installed on the tool exchange device based on requirements. This drive unit enables the tool clamp holder to rotate around the Z-axis, meeting the spindle's tool change directional requirements and providing multi-directional tool change functionality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:升降式刀庫系統</p>  
        <p type="p">10:加工機</p>  
        <p type="p">11:工作平台</p>  
        <p type="p">12:主軸</p>  
        <p type="p">13:機座</p>  
        <p type="p">14:立柱</p>  
        <p type="p">15:架體</p>  
        <p type="p">20:升降式儲刀裝置</p>  
        <p type="p">213:驅動單元</p>  
        <p type="p">24:定位架</p>  
        <p type="p">241:支撐臂</p>  
        <p type="p">30:刀具交換裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="290" publication-number="202626173"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626173.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二氧化碳吸附模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">B01D53/02</main-classification>  
        <further-classification edition="200601120250320B">B01D53/06</further-classification>  
        <further-classification edition="201701120250320B">C01B32/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保佳利健康科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴振立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王和麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳全正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種二氧化碳吸附模組，能應用至可產出二氧化碳的煙氣處理系統中，如：工業製程的煙道氣或燃料分解產製程的廢氣等，其包括一本體與一氣液分離膜，其中，該本體設有至少一進氣結構與至少一出氣結構，且該進氣結構用以導入煙氣，該出氣結構用以導出煙氣；該氣液分離膜能安裝至該本體中，且具有至少一液體腔室，該氣液分離膜的外部能與煙氣相接觸，又，該氣液分離膜允許氣體通過，但會阻擋液體，使得該液體腔室中的液體無法滲透至外部，如此，藉由該氣液分離膜之特性，能夠使煙氣由外部流動至液體腔室，並能與液體腔室中的液體形成反應，進而使煙氣中的二氧化碳被液體腔室中的液體所捕捉與吸附住。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:本體</p>  
        <p type="p">11:頂端蓋</p>  
        <p type="p">111:第一頂氣孔</p>  
        <p type="p">112:第一輸液孔</p>  
        <p type="p">12:底端蓋</p>  
        <p type="p">121:第二輸液孔</p>  
        <p type="p">13:中空通氣柱</p>  
        <p type="p">130:氣體腔室</p>  
        <p type="p">132:氣體噴出口</p>  
        <p type="p">2:氣液分離膜</p>  
        <p type="p">20:液體腔室</p>  
        <p type="p">C1:二氧化碳吸附模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="291" publication-number="202628625"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628625.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149810</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直接面場效電晶體及其製造方法</chinese-title>  
        <english-title>VERTICAL JUNCTION FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250526B">H10D30/60</main-classification>  
        <further-classification edition="202501120250526B">H10D30/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁武得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, WU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂宜融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林盈秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING-SHIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邰翰忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, HAN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　永中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YONG-ZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種垂直接面場效電晶體及其製造方法。該垂直接面場效電晶體包含：N+型基板、N型基體區、N型漂移區、兩P型埋區、兩P型基區、兩P+型閘極區以及N+型源極區；其中，於垂直接面場效電晶體導通時，N+型源極區與N+型基板之間，經由N型漂移區與N型基體區，而在垂直方向上形成通道以傳導導通電流；其中，垂直接面場效電晶體的結構使通道僅在垂直方向上形成，導通電流從N+型源極區垂直流向N+型基板；其中，每一P型埋區與對應之P型基區形成連續的P型區域，用於改善垂直接面場效電晶體的導通電阻、擊穿電壓和漏電流特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a vertical junction field-effect transistor (JFET) and a manufacturing method thereof. The vertical JFET comprises an N+ type substrate, an N type bulk region, an N type drift region, two P type buried regions, two P type base regions, two P+ type gate regions, and an N+ type source region. When the vertical JFET is in a conduction mode, a channel is formed in a vertical direction between the N+ type source region and the N+ type substrate through the N type drift region and the N type bulk region, allowing conduction of current. The structure of the vertical JFET ensures that the channel is formed exclusively in the vertical direction, with the conduction current flowing vertically from the N+ type source region to the N+ type substrate. Furthermore, each of the P type buried region and the corresponding P type base region form a continuous P type region, which improves the vertical JFET's conductive resistance, breakdown voltage, and leakage current characteristics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:垂直接面場效電晶體</p>  
        <p type="p">21:N+型基板</p>  
        <p type="p">22:N型基體區</p>  
        <p type="p">23:N型漂移區</p>  
        <p type="p">24:P型埋區</p>  
        <p type="p">25:P型基區</p>  
        <p type="p">26:P+型閘極區</p>  
        <p type="p">26a:閘極</p>  
        <p type="p">27:N+型源極區</p>  
        <p type="p">28:汲極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="292" publication-number="202628298"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628298.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過溫保護裝置及過溫保護方法</chinese-title>  
        <english-title>OVER TEMPERATURE PROTECTING DEVICE AND OVER TEMPERATURE PROTECTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H02H5/04</main-classification>  
        <further-classification edition="200601120250512B">G01K7/16</further-classification>  
        <further-classification edition="200601120250512B">G01K7/01</further-classification>  
        <further-classification edition="200601120250512B">G06F9/06</further-classification>  
        <further-classification edition="200601120250512B">G05B19/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃凱彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KAI-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種過溫保護裝置包含第一溫度偵測器、第二溫度偵測器及處理器。第一溫度偵測器設置於電路板上且靠近於接頭。第二溫度偵測器設置於電路板上且遠離於接頭。第一溫度偵測器及第二溫度偵測器相距一距離，距離小於電路板的長度。處理器用以根據記憶體的複數個指令以執行以下步驟：藉由第一溫度偵測器取得第一偵測溫度；藉由第二溫度偵測器取得第二偵測溫度；判斷第一偵測溫度及第二偵測溫度的第一溫度差值是否大於溫度閾值；以及當第一溫度差值大於溫度閾值時，輸出警告信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An over temperature protecting device includes a first temperature detector, a second temperature detector, and a processor. The first temperature detector is disposed on a circuit board and close to a connector. The second temperature detector is disposed on the circuit board and is away from the connector. The first temperature detector and the second temperature detector are separated by a distance, and the distance is smaller than a length of the circuit board. The processor is configured to perform the following steps according to a plurality of instructions of a memory: obtaining a first detecting temperature through the first temperature detector; obtaining a second detecting temperature through the second temperature detector; determining whether a first temperature difference between the first detecting temperature and the second detecting temperature is greater than a temperature threshold; and when the first temperature difference is greater than the temperature threshold, outputting a warning signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:過溫保護裝置</p>  
        <p type="p">110:第一溫度偵測器</p>  
        <p type="p">120:第二溫度偵測器</p>  
        <p type="p">130:處理器</p>  
        <p type="p">900:電路板</p>  
        <p type="p">910:接頭</p>  
        <p type="p">920:記憶體</p>  
        <p type="p">T1:偵測溫度</p>  
        <p type="p">T2:偵測溫度</p>  
        <p type="p">T3:偵測溫度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="293" publication-number="202627383"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627383.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149818</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浸沒式冷卻系統</chinese-title>  
        <english-title>IMMERSION COOLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250319B">F28D1/02</main-classification>  
        <further-classification edition="200601120250319B">G06F1/20</further-classification>  
        <further-classification edition="200601120250319B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技鋼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶　瀚明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NALBANDIAN ABHAR, HAMID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾智鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煜祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種浸沒式冷卻系統，用以冷卻一發熱元件。浸沒式冷卻系統包含至少一槽體以及一分流結構。所述至少一槽體用以容置一冷卻液。所述至少一槽體具有一底面、一冷卻液輸入口以及一冷卻液輸出口。冷卻液輸入口較冷卻液輸出口靠近底面。分流結構設置於所述至少一槽體內以分隔出一底流道以及多個分流道。底流道沿著平行於底面的方向延伸。分流道沿著遠離底面的方向延伸。分流結構於分流道處具有多個開孔。冷卻液輸入口依序經由底流道、分流道與開孔連通冷卻液輸出口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An immersion cooling system configured to cool a heating element includes at least one tank and a distribution structure. The at least one tank is configured to accommodate a coolant. The at least one tank has a bottom surface, a coolant inlet and a coolant outlet. The coolant inlet is located closer to the bottom surface than the coolant outlet. The distribution structure is disposed in the at least one tank to configure a bottom channel and a plurality of branch channels. The bottom channel extends along a direction parallel to the bottom surface. The branch channels extend along a direction away from the bottom surface. The distribution structure has a plurality of holes at sides adjacent to the branch channels. The coolant inlet is in fluid communication connection with the coolant outlet via the bottom channel, the branch channels and the holes in sequence.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:浸沒式冷卻系統</p>  
        <p type="p">11:槽體</p>  
        <p type="p">110:底面</p>  
        <p type="p">111:冷卻液輸入口</p>  
        <p type="p">112:冷卻液輸出口</p>  
        <p type="p">13:分流結構</p>  
        <p type="p">131:分隔部</p>  
        <p type="p">132:分流部</p>  
        <p type="p">1321:開孔</p>  
        <p type="p">AA:區域</p>  
        <p type="p">D1、D4:箭頭</p>  
        <p type="p">S1:底流道</p>  
        <p type="p">S2:分流道</p>  
        <p type="p">S3:容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="294" publication-number="202627791"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627791.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦裝置及聽感校正方法</chinese-title>  
        <english-title>COMPUTER DEVICE AND HEARING CORRECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F3/16</main-classification>  
        <further-classification edition="200601120250303B">H04R3/04</further-classification>  
        <further-classification edition="200601120250303B">H04R5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫培華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, PEI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林英宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種電腦裝置及聽感校正方法。電腦裝置包括感測器、音訊播放器以及處理器。音訊播放器朝向放置平面。處理器耦接感測器以及音訊播放器。處理器透過感測器取得物理參數，並且根據物理參數判斷放置平面的材質類型。處理器根據材質類型來調整音訊播放器的等化器，以使音訊播放器根據調整後的等化器進行音訊播放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer device and a hearing correction method are provided. The computer device includes a sensor, an audio player, and a processor. The audio player faces a placement surface. The processor is coupled to the sensor and the audio player. The processor obtains a physical parameter through the sensor and determines a material type of the placement surface based on the physical parameter. The processor adjusts an equalizer of the audio player according to the material type, so that the audio player performs audio playback according to the adjusted equalizer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電腦裝置</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:感測器</p>  
        <p type="p">130:音訊播放器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="295" publication-number="202626391"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626391.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊模組</chinese-title>  
        <english-title>COMMUNICATION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260302B">B60L53/22</main-classification>  
        <further-classification edition="201901120260302B">B60L53/30</further-classification>  
        <further-classification edition="202601120260302B">H02J7/00</further-classification>  
        <further-classification edition="200601120260302B">H01Q1/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛羽庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通訊模組，適用於充電樁，且包括電路板、無線模組、天線、電子元件、屏蔽件及膠體。電路板具有表面。無線模組設置於此表面。天線電性連接無線模組。電子元件設置於所述表面，且電子元件電性連接無線模組。屏蔽件配置於所述表面且具有容納空間。電子元件設置於容納空間內，無線模組位於容納空間之外。膠體包覆所述屏蔽件的周側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication module, adapted to be used in an electric vehicle supply equipment, includes a circuit board, a wireless module, an antenna, an electronic component, a shielding component, and an adhesive material. The circuit board has a surface. The wireless module is disposed on the surface. The antenna is electrically connected to the wireless module. The electronic component is disposed on the surface, and the electronic component is electrically connected to the wireless module. The shielding component is arranged on the surface and has an accommodating space. The electronic component is disposed in the accommodating space, and the wireless module is disposed outside the accommodating space. The adhesive material covers the perimeter of the shielding component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:通訊模組</p>  
        <p type="p">110:電路板</p>  
        <p type="p">120:無線模組</p>  
        <p type="p">130:天線</p>  
        <p type="p">150:屏蔽件</p>  
        <p type="p">152:頂板</p>  
        <p type="p">154:側壁</p>  
        <p type="p">156:開口</p>  
        <p type="p">160:膠體</p>  
        <p type="p">170:固定夾持件</p>  
        <p type="p">E:邊緣</p>  
        <p type="p">F:表面</p>  
        <p type="p">P:周側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="296" publication-number="202628609"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628609.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳化矽功率元件的製造方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING SILICON CARBIDE POWER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">H10D30/01</main-classification>  
        <further-classification edition="202501120260401B">H10D30/63</further-classification>  
        <further-classification edition="202501120260401B">H10D62/10</further-classification>  
        <further-classification edition="202601120260401B">H10P30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韋廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭逸楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪嘉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游瑋丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭浩中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種碳化矽功率元件的製造方法包括以下步驟。提供一基底，其表面有磊晶層。在磊晶層上形成第一圖案化罩幕層並露出部分表面，再進行第一離子佈植製程，以在磊晶層內形成接面場效電晶體（JFET）區。移除第一圖案化罩幕層後，在JFET區上方的磊晶層上形成第二圖案化罩幕層。進行第二離子佈植製程，以在JFET區兩側的磊晶層內形成井區。在第二圖案化罩幕層的側壁形成第一間隙壁。進行第三離子佈植製程，以在井區內形成自我校準的一重摻雜區。在第一間隙壁的側面形成第二間隙壁，以遮蔽部分重摻雜區。進行第四離子佈植製程，以在重摻雜區內形成自我校準的另一重摻雜區。移除第二圖案化罩幕層、第一間隙壁與第二間隙壁，然後形成閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a silicon carbide power device includes following steps. A substrate is provided with an epitaxial layer on the surface. A first patterned mask layer is formed on the epitaxial layer to expose a portion of the surface, and then a first ion implantation process is performed to form a junction field effect transistor (JFET) region in the epitaxial layer. After removing the first patterned mask layer, a second patterned mask layer is formed on the epitaxial layer above the JFET region. A second ion implantation process is performed to form well regions in the epitaxial layer at both sides of the JFET region. A first spacer is formed on sidewalls of the second patterned mask layer. A third ion implantation process is performed to form a self-aligned heavily doped region in the well regions. A second spacer is formed on the side of the first spacer to shield a portion of the heavily doped region. A fourth ion implantation process is performed to form another self-aligned heavily doped region in the heavily doped region. The second patterned mask layer, the first spacer and the second spacer are removed, and then a gate structure is formed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">102:磊晶層</p>  
        <p type="p">108:第二圖案化罩幕層</p>  
        <p type="p">112:第一間隙壁</p>  
        <p type="p">114:第二間隙壁</p>  
        <p type="p">d1、d2:摻雜深度</p>  
        <p type="p">HD1:第一重摻雜區</p>  
        <p type="p">HD2:第二重摻雜區</p>  
        <p type="p">IM4:第四離子佈植製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="297" publication-number="202628245"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628245.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射陣列的配置方法及使用其的電子裝置</chinese-title>  
        <english-title>CONFIGURATION METHOD OF REFLECTARRAY AND ELECTRONIC DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H01Q3/44</main-classification>  
        <further-classification edition="200601120250512B">H01Q15/10</further-classification>  
        <further-classification edition="200601120250512B">H01Q15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稜研科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSUAN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種反射陣列的配置方法及電子裝置，其中反射陣列包含多個反射單元。配置方法包含：取得目標入射訊號的第一入射訊號特徵以及目標反射訊號的第一反射訊號特徵；根據第一入射訊號特徵以及第一反射訊號特徵判斷虛擬反射面的幾何形狀種類；根據第一入射訊號特徵以及第一反射訊號特徵配置虛擬反射面，其中虛擬反射面與多個反射單元中的第一反射單元相交；以及根據第一入射訊號特徵、第一反射訊號特徵以及幾何形狀種類判斷多個反射單元的至少一部分的延遲補償以配置多個反射單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A configuration method of reflectarray and an electronic device are provided, wherein the reflectarray includes a plurality of reflective units. The configuration method includes: obtaining a first incidence signal characteristic of a target incidence signal and a first reflected signal characteristic of a target reflected signal; determining a geometric shape type of a virtual reflective surface according to the first incidence signal characteristic and the first reflected signal characteristic; configuring the virtual reflective surface according to the first incidence signal characteristic and the first reflected signal characteristic, wherein the virtual reflective surface intersects a first reflective unit of the plurality of reflective units; and determining delay compensations of at least a part of the plurality of reflective units according to the first incidence signal characteristic, the first reflected signal characteristic, and the geometric shape type to configure the plurality of reflective units.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201,S202,S203,S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="298" publication-number="202627792"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627792.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦裝置及音訊調整方法</chinese-title>  
        <english-title>COMPUTER DEVICE AND AUDIO ADJUSTMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F3/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹國廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KUO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王家睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIA-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許立昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, LI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種電腦裝置及音訊調整方法。電腦裝置包括音訊接收器、音訊播放器以及處理器。音訊播放器朝向放置平面。處理器耦接音訊接收器以及音訊播放器。處理器透過音訊播放器朝向放置平面播放測試音訊。處理器透過音訊接收器接收反射音訊。處理器分析反射音訊，以取得多個特徵資料。處理器將多個特徵資料輸入至至少一機器學習模型，以透過至少一機器學習模型決定放置平面的材質類型。處理器根據材質類型來調整音訊播放器的等化器，以使音訊播放器根據調整後的等化器進行音訊播放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer device and an audio adjustment method are provided. The computer devices includes an audio receiver, an audio player, and a processor. The audio player faces a placement surface. The processor is coupled to the audio receiver and the audio player. The processor plays a test audio through the audio player toward the placement surface. The processor receives a reflected audio through the audio receiver. The processor analyzes the reflected audio to obtain feature data. The processor inputs the feature data to at least one machine learning model to determine a material type of the placement surface through the at least one machine learning model. The processor adjusts an equalizer of the audio player according to the material type, so that the audio player performs audio playback according to the adjusted equalizer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電腦裝置</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:音訊接收器</p>  
        <p type="p">130:音訊播放器</p>  
        <p type="p">140:儲存裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="299" publication-number="202626412"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626412.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛偏移檢測方法、電腦可讀存儲介質、車載裝置及車輛</chinese-title>  
        <english-title>VEHICLE OFFSET DETECTION METHOD, COMPUTER-READABLE STORAGE MEDIUM, ONBOARD DEVICE, AND VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260128B">B60W40/10</main-classification>  
        <further-classification edition="202201120260128B">G06V20/56</further-classification>  
        <further-classification edition="201701120260128B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富智捷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOBILE DRIVE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種車輛偏移檢測方法、電腦可讀存儲介質、車載裝置及車輛。該方法應用於車輛，車輛之兩側安裝有長焦相機用於採集第一道路圖像，長焦相機與地面之高度小於預設高度，方法包括：獲取長焦相機採集之第一道路圖像；對第一道路圖像進行影像處理以確定是否包括車道線；當第一道路圖像包括車道線時，根據第一道路圖像確定車輛與車道線之間之距離；當車輛與車道線之間之距離小於預設距離時，發出車輛偏移預警。本申請提供之車輛偏移檢測方法可提高車輛偏移檢測之準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a vehicle offset detection method, a computer-readable storage medium, an onboard device, and a vehicle. The method is applied to a vehicle. And telephoto cameras are installed on both sides of the vehicle to capture a first road image. The height between the telephoto camera and the ground is less than the preset height. The method comprises: obtaining the first road image captured by the telephoto camera; performing image processing on the first road image to determine if it includes lane markings; calculating the distance between the vehicle and the lane markings based on the first road image when the first road image includes lane markings; outputting vehicle offset warning when the distance between the vehicle and the lane markings is less than the preset distance. The vehicle offset detection method provided in this application can improve the accuracy of vehicle offset detection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401-S404:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="300" publication-number="202626661"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626661.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149864</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電洞傳輸材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">C07D495/04</main-classification>  
        <further-classification edition="202301120250203B">H10K30/86</further-classification>  
        <further-classification edition="202301120250203B">H10K30/50</further-classification>  
        <further-classification edition="202301120250203B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東吳大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有式I所示的結構的電洞傳輸材料，式I中，R &lt;sub&gt;1&lt;/sub&gt;至R &lt;sub&gt;8&lt;/sub&gt;各自獨立地選自於 &lt;img align="absmiddle" height="106px" width="106px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、 &lt;img align="absmiddle" height="106px" width="102px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或 &lt;img align="absmiddle" height="89px" width="114px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。該電洞傳輸材料本身具有良好的電洞遷移率，並有優異的疏水性而不易對鈣鈦礦層的結構穩定性乃至鈣鈦礦太陽能電池的使用壽命造成不良影響。該電洞傳輸材料可單獨作為鈣鈦礦太陽能電池的電洞傳輸層，讓鈣鈦礦太陽能電池具有良好的光電轉換效率。 &lt;br/&gt;[式I] &lt;img align="absmiddle" height="718px" width="795px" file="ed10004.jpg" alt="ed10004.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="301" publication-number="202627106"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627106.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>寵物腸道菌群檢測分析系統及其檢測分析方法</chinese-title>  
        <english-title>DETECTION AND ANALYSIS SYSTEM OF PET INTESTINAL MICROFLORA AND ITS DETECTION AND ANALYSIS METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">C12Q1/02</main-classification>  
        <further-classification edition="201801120250320B">C12Q1/6869</further-classification>  
        <further-classification edition="201901120250320B">G06N20/00</further-classification>  
        <further-classification edition="200601120250320B">G06F17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>真研健康科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彰威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種寵物腸道菌群檢測分析系統及其檢測分析方法，其檢測輸入端設有核酸分析設備供檢驗訓練樣本或檢測樣本以形成參考資料集或檢測資料集；該參考資料集及該檢測資料集經輸出至位於分析輸出端並與機器學習分類器通訊連接的中央處理器；該機器學習分類器至少設有寵物飲食分析模組及寵物腸道環境健康分析模組之參數指標。藉此，透過次世代定序(NGS)技術檢驗獲得檢測樣本定序，以傳輸至受過訓練之機器學習分類器，經由提供和執行該機器學習分類器預測參數指標，獲得個體化檢測報告，實現精確的寵物腸道菌群檢測和健康風險評估方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection and analysis system of pet intestinal microflora and its detection and analysis method, a detection input end is provided with a nucleic acid analysis equipment for detecting training samples or detection samples to form a reference data set or a detection data set, the reference data set and the detection data set are output to a central processor located at an analysis output end and connected to a machine learning classifier, the machine learning classifier has at least parameters of a pet diet analysis module and a pet intestinal environment health analysis module, thereby, the test sample sequence is obtained through the next generation sequence (NGS) technology detection, which is transmitted to the trained machine learning classifier, so as to predict parameter indicators through the provision and execution of the machine learning classifier, obtaining an individual detection report to achieve accurate pet intestinal flora detection and health risk assessment method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:核酸分析設備</p>  
        <p type="p">11:訓練樣本</p>  
        <p type="p">12:檢測樣本</p>  
        <p type="p">20:參考資料集</p>  
        <p type="p">21:OTU訓練資料集</p>  
        <p type="p">30:檢測資料集</p>  
        <p type="p">31:OTU檢測資料集</p>  
        <p type="p">40:第一通訊模組</p>  
        <p type="p">50:中央處理器</p>  
        <p type="p">60:機器學習分類器</p>  
        <p type="p">61:寵物飲食分析模組</p>  
        <p type="p">62:寵物腸道環境健康分析模組</p>  
        <p type="p">63:胃擴張扭轉症風險評估模組</p>  
        <p type="p">64:慢性腸病分析模組</p>  
        <p type="p">65:貓蛔蟲感染風險評估模組</p>  
        <p type="p">66:肥胖風險評估模組</p>  
        <p type="p">67:糖尿病分析模組</p>  
        <p type="p">68:有益菌協助生產維生素能力分析模組</p>  
        <p type="p">69:寵物抗生素使用建議評估模組</p>  
        <p type="p">70:電腦可儲存裝置</p>  
        <p type="p">71:OTU矩陣</p>  
        <p type="p">72:檢測報告數據集</p>  
        <p type="p">80:報告生成模組</p>  
        <p type="p">90:第二通訊模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="302" publication-number="202627363"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627363.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>室內場域智能潔淨系統</chinese-title>  
        <english-title>INDOOR INTELLIGENT PURIFYING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250317B">F24F11/30</main-classification>  
        <further-classification edition="202101120250317B">F24F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>研能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫皓然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOU, HAO-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳錦銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種室內場域智能潔淨系統，包含：氣體偵測模組、空污清淨處理設備及聯網雲端運算服務裝置。聯網雲端運算服務裝置基於氣體偵測模組持續監測環境之空氣品質，並自動啟動空污清淨處理設備。聯網雲端運算服務裝置包含AI智能演算平台。AI智能演算平台具備AI智能控制、智能化的能源管理和故障診斷功能技術，使得室內場域環境能夠根據實時的環境變化做出快速反應，優化系統能效，並保持最佳空氣品質，為室內場域創造一個持續潔淨、健康的空氣環境，並減少空氣中有害污染物對人體的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An indoor intelligent purifying system is disclosed and includes a gas detection module, an air pollution cleaning processing device and a networked cloud computing service device. The networked cloud computing service device automatically enables the air pollution cleaning processing device according to the air quality of the environment continuously detected by the gas detection module. The networked cloud computing service device includes an AI intelligent calculation platform. The AI intelligent calculation platform has functions of AI intelligent control, intelligent energy management and fault diagnosis technology, so that the air quality of the indoor space can be immediately adjusted according to the air quality of the environment in the real-time, the efficiency of the system is enhanced, the air quality is maintained, and the impact of harmful pollutants in the air on the human body is reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:氣體偵測模組</p>  
        <p type="p">2:空污清淨處理設備</p>  
        <p type="p">3:聯網雲端運算服務裝置</p>  
        <p type="p">4:中控電腦控制設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="303" publication-number="202628536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱組件、主機板模組及電子裝置</chinese-title>  
        <english-title>HEAT DISSIPATION ASSEMBLY, MOTHERBOARD MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K7/20</main-classification>  
        <further-classification edition="200601120250418B">F28D15/02</further-classification>  
        <further-classification edition="200601120250418B">F28F13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳誠安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭屹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱組件，配置來熱耦合於一第一熱源及熱設計功耗大於第一熱源的一第二熱源。散熱組件包含一熱交換器以及一冷板。熱交換器配置來熱耦合於第一熱源並接收一冷卻液，以使得冷卻液吸收第一熱源所產生的熱而升溫。冷板配置來熱耦合於第二熱源，且冷板連通於熱交換器，以接收來自熱交換器的冷卻液，以使得冷卻液吸收第二熱源所產生的熱而汽化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation assembly is configured to be thermally coupled to a first heat source and a second heat source having a thermal design power greater than that of the first heat source. The heat dissipation assembly includes a heat exchanger and a cold plate. The heat exchanger is configured to be thermally coupled to the first heat source and receive a coolant, such that the coolant absorbs heat generated by the first heat source and has temperature increase. The cold plate is configured to be thermally coupled to the second heat source, and the cold plate communicates with the heat exchanger to receive the coolant from the heat exchanger, such that the coolant absorbs heat generated by the second heat source and vaporizes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">11:冷卻液分配裝置</p>  
        <p type="p">111:儲液容器</p>  
        <p type="p">112:泵浦</p>  
        <p type="p">113:冷凝器</p>  
        <p type="p">12:主機板模組</p>  
        <p type="p">121:主機板</p>  
        <p type="p">1211:第一熱源</p>  
        <p type="p">1212:第二熱源</p>  
        <p type="p">1213:第一表面</p>  
        <p type="p">1214:第二表面</p>  
        <p type="p">1215:電路板</p>  
        <p type="p">122:散熱組件</p>  
        <p type="p">1221:熱交換器</p>  
        <p type="p">1222:冷板</p>  
        <p type="p">1223:連接管</p>  
        <p type="p">13:輸液管</p>  
        <p type="p">14:輸氣管</p>  
        <p type="p">BS:助沸結構</p>  
        <p type="p">C:冷卻液</p>  
        <p type="p">C1:兩相流體腔室</p>  
        <p type="p">OS:外表面</p>  
        <p type="p">OFS:外鰭片結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="304" publication-number="202626345"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626345.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護膠帶及其製造方法</chinese-title>  
        <english-title>PROTECTION TAPE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B32B7/10</main-classification>  
        <further-classification edition="200601120260302B">B32B27/18</further-classification>  
        <further-classification edition="201801120260302B">C09J7/29</further-classification>  
        <further-classification edition="201801120260302B">C09J7/30</further-classification>  
        <further-classification edition="200601120260302B">C09J11/04</further-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種保護膠帶，包括基材膜、抗靜電層以及黏著層。抗靜電層位於基材膜的表面上且包括第一樹脂。黏著層位於抗靜電層上，其中黏著層包括第二樹脂，且以第二樹脂的總重量計，第二樹脂接枝6重量%至12重量%的甲基丙烯酸縮水甘油酯及3重量%至5重量%的乙酸乙烯酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A protection tape includes a base film, an antistatic layer and an adhesive layer. The antistatic layer is disposed on a surface of the base film and includes a first resin. The adhesive layer is disposed on the antistatic layer, wherein the adhesive layer includes a second resin grafted with 6 wt% to 12 wt% of glycidyl methacrylate and 3 wt% to 5 wt% of vinyl acetate, based on a total weight of the second resin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:保護膠帶</p>  
        <p type="p">12:基材膜</p>  
        <p type="p">12a,12b,14a:表面</p>  
        <p type="p">14,16:抗靜電層</p>  
        <p type="p">18:黏著層</p>  
        <p type="p">T1,T2,T3:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="305" publication-number="202627344"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627344.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快接式母接頭結構</chinese-title>  
        <english-title>QUICK CONNECT FEMALE COUPLER STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">F16L37/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITECK CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐安賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, AN-SZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成艷姣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YAN-JIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫大龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種快接式母接頭結構，具有外套筒、固定件、接合筒、彈簧及活動件。該外套筒的內部具有一容置空間，該外套筒的底端向內環設一頂止部。該固定件穿設有彈簧，其頂端活動套設有活動件，底端則設有一限位部，該固定件透過該限位部抵撐於該外套筒的該頂止部，所述該接合筒係收容該固定件，其底端抵接該限位部並與該外套筒組接。藉由該外套筒搭配該接合筒將該固定件穩固結合，令該固定件得被穩固且確保限位於軸中心位置上，使該母接頭結構可具有結構簡單、故障率低、連接可靠、氣密性佳等特性者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:外套筒</p>  
        <p type="p">13:頂止部</p>  
        <p type="p">14:螺紋槽</p>  
        <p type="p">2:固定件</p>  
        <p type="p">21:限位部</p>  
        <p type="p">22:凸出部</p>  
        <p type="p">221:第一環狀密封件</p>  
        <p type="p">3:彈簧</p>  
        <p type="p">4:活動件</p>  
        <p type="p">41:環狀體</p>  
        <p type="p">42:連接面</p>  
        <p type="p">43:第二環狀密封件</p>  
        <p type="p">52:螺紋</p>  
        <p type="p">53:插接通道</p>  
        <p type="p">54:內壁面</p>  
        <p type="p">541:階部</p>  
        <p type="p">542:引導斜面</p>  
        <p type="p">543:第三環狀密封件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="306" publication-number="202627242"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627242.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電化學反應電極</chinese-title>  
        <english-title>ELECTROCHEMICAL REACTION ELECTRODE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C25F3/16</main-classification>  
        <further-classification edition="200601120250402B">C25F7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUNG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電化學反應電極，包含至少二多孔性導電層。所述至少二多孔性導電層由碳纖維編織布形成且彼此疊設。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrochemical reaction electrode including at least two porous conductive layers. The at least two porous conductive layers are formed be carbon fiber weave and are stacked on each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電化學反應電極</p>  
        <p type="p">100:集電板</p>  
        <p type="p">110:第一側</p>  
        <p type="p">120:第二側</p>  
        <p type="p">210,211,212:第一多孔性導電層</p>  
        <p type="p">2100,2110,2120:纖維束</p>  
        <p type="p">220,221,222:第二多孔性導電層</p>  
        <p type="p">300:末梢導電化膜</p>  
        <p type="p">400:通道夾層</p>  
        <p type="p">500:夾框</p>  
        <p type="p">510:框體</p>  
        <p type="p">T1,T2,T3:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="307" publication-number="202626168"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626168.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有環保AI控制超音波油水分離清洗設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">B01D17/02</main-classification>  
        <further-classification edition="202301120250328B">C02F1/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>偉鵬科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余慶鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余俊衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余英豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余英榤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余婕菱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種具有環保AI控制超音波油水分離清洗設備，包含：一機箱、一清洗槽、一臭氧產生器、一加熱裝置、一超音波模組、一油水分離系統及一AI控制系統，該設備利用智能控制系統提升操作便利性，結合超音波技術、臭氧消毒和加熱，能快速高效地清洗各類物件，顯著縮短清洗時間，此外，內置的油水分離系統支持清洗液的循環使用，有效降低水和清洗液的消耗，達成節能減碳，減少運營成本，並符合環境保護要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機箱</p>  
        <p type="p">11:長方體框架</p>  
        <p type="p">20:清洗槽</p>  
        <p type="p">23:進水管路</p>  
        <p type="p">24:排水管路</p>  
        <p type="p">25:水位檢知器</p>  
        <p type="p">30:臭氧產生器</p>  
        <p type="p">31:臭氧輸送管</p>  
        <p type="p">40:氣瀑機</p>  
        <p type="p">41:輸氣管路</p>  
        <p type="p">50:加熱裝置</p>  
        <p type="p">51:感溫器</p>  
        <p type="p">52:加熱管</p>  
        <p type="p">60:超音波模組</p>  
        <p type="p">61:超音波產生器</p>  
        <p type="p">70:油水分離系統</p>  
        <p type="p">71:油水分離機</p>  
        <p type="p">711:集液槽</p>  
        <p type="p">712:馬達</p>  
        <p type="p">714:導油槽道</p>  
        <p type="p">715:刮板</p>  
        <p type="p">716:接油槽</p>  
        <p type="p">717:輸送管</p>  
        <p type="p">72:幫浦</p>  
        <p type="p">73:過濾器</p>  
        <p type="p">74:第一導管</p>  
        <p type="p">75:第二導管</p>  
        <p type="p">76:第三導管</p>  
        <p type="p">77:第四導管</p>  
        <p type="p">80:AI控制系統</p>  
        <p type="p">81:人機螢幕</p>  
        <p type="p">82:控制面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="308" publication-number="202627873"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627873.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149920</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線上閱讀協助方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250224B">G06F40/10</main-classification>  
        <further-classification edition="200601120250224B">G09B9/02</further-classification>  
        <further-classification edition="202301120250224B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厚淐科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA CING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線上閱讀協助方法，包含以下步驟：一知識加值單元接收一文本，該知識加值單元傳送複數文本區塊及複數文本向量至一文本處理單元，該文本處理單元產生一第一圖譜檢索增強生成資料，該文本處理單元接收一第二圖譜檢索增強生成資料，該知識加值單元依據一閱讀協助指令從該文本處理單元載入該第一圖譜檢索增強生成資料及該第二圖譜檢索增強生成資料的其中一者，該知識加值單元依據該第二圖譜檢索增強生成資料由該大語言模型生成對應一問題的一回答。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:知識加值單元</p>  
        <p type="p">11:大語言模型</p>  
        <p type="p">2:文本處理單元</p>  
        <p type="p">3:第一終端機</p>  
        <p type="p">4:第二終端機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="309" publication-number="202626196"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626196.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149922</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸媒粉末的製造方法、觸媒漿料以及觸媒電極片</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING CATALYST POWDER, CATALYST SLURRY AND CATALYST ELECTRODE SHEET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">B01J23/14</main-classification>  
        <further-classification edition="202401120250402B">B01J35/50</further-classification>  
        <further-classification edition="202401120250402B">B01J35/60</further-classification>  
        <further-classification edition="200601120250402B">B01J37/00</further-classification>  
        <further-classification edition="200601120250402B">B01J37/03</further-classification>  
        <further-classification edition="200601120250402B">B01J37/04</further-classification>  
        <further-classification edition="200601120250402B">B01J37/08</further-classification>  
        <further-classification edition="200601120250402B">C25B1/13</further-classification>  
        <further-classification edition="202101120250402B">C25B11/052</further-classification>  
        <further-classification edition="202101120250402B">C25B11/077</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁特電子企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIGHT ELECTRONIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏奕韓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林品萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PIN HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾智勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIN YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高仕棻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, SHIH FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張貴雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUEI-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸媒粉末的製造方法，包括以下步驟。步驟(a):將含錫鹽類的水溶液與有機酸混合，然後加入醇類以得到前驅溶液。步驟(b):加入酸至前驅溶液中，然後在大於一大氣壓且高於170℃的環境下進行反應得到反應溶液。步驟(c):待反應溶液冷卻後，於反應溶液中加入水並收集沉澱物。步驟(d):清洗並破碎沉澱物得到觸媒半成品。步驟(e):將觸媒半成品進行退火得到觸媒粉末。亦提供具有觸媒粉末的觸媒漿料及觸媒電極片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing catalyst powder includes the following steps: Step (a): mixing an aqueous solution containing tin salts with an organic acid, then adding an alcohol to obtain a precursor solution; Step (b): adding an acid to the precursor solution, and then reacting at an environment greater than 1 atmospheric pressure and higher than 170°C to obtain a reaction solution; Step (c): after the reaction solution being cooled, adding water to the reaction solution and collecting a precipitate; Step (d): cleaning and crushing the precipitate to obtain a semi-finished catalyst product; Step (e): annealing the semi-finished catalyst product to obtain a catalyst powder. A catalyst slurry and a catalyst electrode sheet with the catalyst powder are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(a)~(f):步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="310" publication-number="202627735"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627735.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149929</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>筆電閂鎖歸位結構</chinese-title>  
        <english-title>LAPTOP LATCH RETURE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">G06F1/16</main-classification>  
        <further-classification edition="200601120250320B">H05K7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭啟人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHI ZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家震</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴宏源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HUNGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUN HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及筆記本電腦技術領域，具體為一種筆電l閂鎖atch歸位結構，在筆電本體上通過閂鎖按鈕連動閂鎖滑動金屬動作，推動頂出電池蓋上的斜面結構，並使卡勾部分分離，頂出電池門實現拆解；通過閂鎖按鈕保持架定位結構沿閂鎖latch滑動金屬斜面設計下滑至定位孔，使D蓋重新組裝時latch按鈕會自動歸位，本發明設計可以簡化維修或更換電池時的操作，減少工具的使用，並可能降低損壞的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the field of laptop technology, specifically a laptop latch return structure. The latch button is linked to the latch sliding metal action on the laptop body to push out the inclined surface structure on the battery cover and separate the hook part, thereby disassembling the battery door; The positioning structure of the latch button holder is designed to slide along the metal inclined surface of the latch to the positioning hole, so that the latch button will automatically return to its original position when the D cover is reassembled. This invention simplifies the operation of repairing or replacing batteries, reduces the use of tools, and may reduce the risk of damage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:筆電本體</p>  
        <p type="p">41:插銷滑動金屬</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="311" publication-number="202627651"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627651.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>攝影機鏡頭前鏡片結構</chinese-title>  
        <english-title>A FRONT LENS STRUCTURE FOR A CAMERA LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250320B">G03B17/12</main-classification>  
        <further-classification edition="202101120250320B">G03B17/08</further-classification>  
        <further-classification edition="202101120250320B">G03B17/56</further-classification>  
        <further-classification edition="202101120250320B">G03B19/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴昆輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, KUN HUI,</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許瑋錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種攝影機鏡頭前鏡片結構，係適用於攝影機，攝影機具有殼體，內設有固定支架以及攝影機組，其中攝影機鏡頭前鏡片結構包括：透明鏡片，一側透過膠合方式與殼體結合，另一側設有第一隔離層；光源模組，具有至少一發光單元，設置於PCB基板，其中至少一發光單元與PCB基板電性連接，且PCB基板上設有第二隔離層，使光源模組組設於透明鏡片一側，並透過第二隔離層與第一隔離層緊密抵靠於透明鏡片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A front lens structure for a camera lens is designed for use in a camera, which includes a housing containing a fixed bracket and a camera module. The structure comprises a transparent lens, with one side bonded to the housing using an adhesive method, while the other side is coated with a first isolation layer. It also includes a light source module with at least one light-emitting unit installed on a PCB board, where the light-emitting unit is electrically connected to the PCB board. The PCB board features a second isolation layer, enabling the light source module to be mounted on one side of the transparent lens and closely fitted to the transparent lens through the contact between the second isolation layer and the first isolation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:透明鏡片</p>  
        <p type="p">211:第一隔離層</p>  
        <p type="p">212:密封填充件</p>  
        <p type="p">22:光源模組</p>  
        <p type="p">221:發光單元</p>  
        <p type="p">222:PCB基板</p>  
        <p type="p">223:第二隔離層</p>  
        <p type="p">31:殼體</p>  
        <p type="p">311:固定支架</p>  
        <p type="p">312:散熱基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="312" publication-number="202628280"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628280.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶單元屏蔽結構</chinese-title>  
        <english-title>A SHIELDING STRUCTURE FOR A MEMORY UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250512B">H01R13/6581</main-classification>  
        <further-classification edition="201101120250512B">H01R13/6594</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯柄瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, BINQ-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶單元屏蔽結構，係用以屏蔽固定於可攜式電子裝置的記憶單元，其中記憶單元屏蔽結構包括：連接器，可供固定記憶單元並電性連接於電路基板，更包括：本體，其具有插接槽，用以固定插接記憶單元，本體兩側分別具有卡扣部，以及本體頂面具有定位柱；以及屏蔽組件，具有屏蔽件與屏蔽蓋，屏蔽件用以包繞於本體，設有定位孔，可分別對應與定位柱相疊，屏蔽件兩側分別設有U型部，U型部相近定位孔一側具有凸肋，用以與卡扣部卡合，U型部與凸肋設置處相異的另一側具有按壓部，屏蔽蓋用以覆蓋於記憶單元頂側，一端與屏蔽件相連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shielding structure for a memory unit is designed to shield a memory unit fixed in a portable electronic device. The shielding structure comprises a connector that secures the memory unit and electrically connects it to a circuit board. The connector includes a main body with a slot for securing the memory unit, locking sections on both sides of the main body, and positioning posts on its top surface. The shielding component consists of a shielding piece and a shielding cover. The shielding piece encases the main body and features positioning holes that align with the positioning posts. On both sides of the shielding piece are U-shaped sections, with ribs located near the positioning holes for locking with the locking sections. On the opposite side of the ribs, the U-shaped sections have pressing parts. The shielding cover is designed to cover the top side of the memory unit, with one end connected to the shielding piece.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接器</p>  
        <p type="p">11:本體</p>  
        <p type="p">111:插接槽</p>  
        <p type="p">112:卡扣部</p>  
        <p type="p">113:定位柱</p>  
        <p type="p">12:屏蔽組件</p>  
        <p type="p">121:屏蔽件</p>  
        <p type="p">1211:定位孔</p>  
        <p type="p">1212:U型部</p>  
        <p type="p">12121:凸肋</p>  
        <p type="p">12122:按壓部</p>  
        <p type="p">122:屏蔽蓋</p>  
        <p type="p">3:電路基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="313" publication-number="202627318"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627318.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱藏式螺絲組</chinese-title>  
        <english-title>A CONCEALED SCREW ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250319B">F16B37/14</main-classification>  
        <further-classification edition="200601120250319B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉堂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TANG AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種隱藏式螺絲組，適用於在第一物體和第二物體之間提供隱藏式可調節鎖固的裝置，包括：鎖固起子，其具有柄端，及沿柄端軸向相對之頭端，頭端具有第一磁性件及第二磁性件；以及鎖固螺絲，包含：螺柱；及螺絲頭，設置於螺柱一端並與螺柱共同界定出第一軸線，螺絲頭包括位在相反於螺柱一端的端面，設置有與第一軸線垂直的鎖固部，鎖固部具有第三磁性件及第四磁性件；其中，鎖固螺絲設置於第一物體的容置空間，使鎖固螺絲隱藏在第一物體的外表面下方，且螺絲頭靠近外表面，使鎖固螺絲可相對於第一物體旋轉，同時防止第一物體相對於鎖固螺絲沿第一軸線移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A concealed screw assembly, suitable for providing hidden and adjustable fastening between a first object and a second object, includes a fastening screwdriver with a handle end and a head end opposite to the handle end along its axial direction. The head end is equipped with a first magnetic component and a second magnetic component. The assembly also includes a fastening screw comprising a screw shank and a screw head. The screw head is positioned at one end of the screw shank, jointly defining a first axis with the screw shank. The screw head features an end surface opposite the screw shank, which is equipped with a locking section perpendicular to the first axis. The locking section contains a third magnetic component and a fourth magnetic component. The fastening screw is placed in a recess within the first object, concealing it beneath the outer surface of the first object. The screw head is positioned near the outer surface, allowing the fastening screw to rotate relative to the first object while preventing the first object from moving along the first axis relative to the fastening screw.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:隱藏式螺絲組</p>  
        <p type="p">11:鎖固起子</p>  
        <p type="p">111:柄端</p>  
        <p type="p">112:頭端</p>  
        <p type="p">113:軸桿</p>  
        <p type="p">12:鎖固螺絲</p>  
        <p type="p">121:螺柱</p>  
        <p type="p">122:螺絲頭</p>  
        <p type="p">123:鎖固部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="314" publication-number="202627399"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627399.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149934</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>校準方法，及其瞄準裝置</chinese-title>  
        <english-title>CALIBRATION METHODS, AND AIMING DEVICES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250627B">F41G1/473</main-classification>  
        <further-classification edition="200601120250627B">F41G3/06</further-classification>  
        <further-classification edition="200601120250627B">F41G1/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞洲光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA OPTICAL CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉華唐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HUA-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯寒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, PENG-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于陽陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YANG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔普慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, PU-QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種校準方法及其瞄準裝置。首先，利用一顯示單元檢視一第一落點，其中該第一落點距一射擊裝置的距離係一第一距離，並依據該第一落點於該顯示單元中所呈現之位置，於該顯示單元中標記相應該第一落點之一第一標記。相應該第一落點之該第一標記完成之後，透過該顯示單元檢視一第二落點，其中該第二落點距該射擊裝置的距離係一第二距離，其中該第一距離及該第二距離不同，並依據該第二落點於該顯示單元中所呈現之位置，於該顯示單元中標記相應該第二落點之一第二標記。之後，依據相應該第一落點之該第一距離及該第一標記與相應該第二落點之該第二距離及該第二標記進行處理計算落點軌跡後進行一落點指示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Calibration method and aiming devices thereof are provided. First, a first impact point is viewed through a display unit, wherein the distance between the first impact point and a shooting device is a first distance, and a first mark corresponding to the first impact point is made in the display unit based on the position of the first impact point presented in the display unit. After the first mark is completed, a second impact point is viewed through the display unit, wherein the distance between the second impact point and the shooting device is a second distance, wherein the first distance and the second distance are different, and a second mark corresponding to the second landing point is marked in the display unit based on the position of the second impact point presented in the display unit. Then, a calculation of the trajectory of the landing point is performed based on the first distance and the first mark corresponding to the first impact point and the second distance and the second mark corresponding to the second impact point and then perform a landing point indication.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310、S320、S330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="315" publication-number="202628901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149945</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓定位環結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/50</main-classification>  
        <further-classification edition="201201120260302B">B24B37/005</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沛科精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASCO PRECISION CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶圓定位環結構，包含研磨環、組接環，及定位單元。該定位單元包括數個間隔設置在該研磨環與該組接環的其中之一的第一定位部，及數個間隔設置在該研磨環與該組接環的其中另一的第二定位部。該等第一定位部與該研磨環與該組接環的其中之一為一體成形。該等第二定位部與該研磨環與該組接環的其中另一為一體成形。該等第二定位部能分別與該等第一定位部可移離地相結合。透過上述設計，只要操作該組接環使該等第一定位部分別相結合於該等第二定位部，就能使該組接環定位在該研磨環頂側，有助於提升組裝效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:研磨環</p>  
        <p type="p">41:研磨內環面</p>  
        <p type="p">42:研磨外環面</p>  
        <p type="p">421:第一結合面部</p>  
        <p type="p">422:第一橫面部</p>  
        <p type="p">423:第一外露面部</p>  
        <p type="p">43:研磨環頂面</p>  
        <p type="p">44:研磨環底面</p>  
        <p type="p">5:組接環</p>  
        <p type="p">51:組接內環面</p>  
        <p type="p">511:第二延伸面部</p>  
        <p type="p">512:第二橫面部</p>  
        <p type="p">513:第二結合面部</p>  
        <p type="p">52:組接外環面</p>  
        <p type="p">53:組接環底面</p>  
        <p type="p">54:組接環頂面</p>  
        <p type="p">61:第一定位部</p>  
        <p type="p">62:第二定位部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="316" publication-number="202626404"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626404.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>警示燈裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">B60Q1/50</main-classification>  
        <further-classification edition="200601120250225B">B60Q7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百盈實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉能蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種警示燈裝置，其係於基座裝設警示燈組，警示燈組的第一警示燈桿及第二警示燈桿各以一端樞設基座的相對兩端，且第一警示燈桿與第二警示燈桿相對錯位配置，另以二彈力部件分別對第一警示燈桿和第二警示燈桿提供朝外偏轉的轉動彈力，並能推動第一警示燈桿和第二警示燈桿自基座旋出較大的角度，基座還設有電動式驅動組件連接警示燈組，提供驅動第一警示燈桿與第二警示燈桿朝向基座收合之電動驅動力量，使警示燈裝置之結構精簡化及減少耗能，縱使電動式驅動組件故障，也能手動直接將伸展的第一警示燈桿及第二警示燈桿收合並予以固定，而無安全的顧慮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基座</p>  
        <p type="p">11:基板</p>  
        <p type="p">13:承載墊</p>  
        <p type="p">20:警示燈組</p>  
        <p type="p">21:第一警示燈桿</p>  
        <p type="p">211:第一燈桿</p>  
        <p type="p">2111:第一樞接部</p>  
        <p type="p">2112:第一活動端</p>  
        <p type="p">212:第一警示燈具</p>  
        <p type="p">22:第二警示燈桿</p>  
        <p type="p">221:第二燈桿</p>  
        <p type="p">2211:第二樞接部</p>  
        <p type="p">2213:第二活動端</p>  
        <p type="p">222:第二警示燈具</p>  
        <p type="p">23:樞接部件</p>  
        <p type="p">30:彈力部件</p>  
        <p type="p">40:電動式驅動組件</p>  
        <p type="p">42:捲線輪</p>  
        <p type="p">43:拉線</p>  
        <p type="p">45:轉向部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="317" publication-number="202625994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鏈條式傳動按摩機之按摩強度調整結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251104B">A61H7/00</main-classification>  
        <further-classification edition="200601120251104B">A61H15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫東和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫東和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芳池</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鏈條式傳動按摩機之按摩強度調整結構，其包含有一按摩椅座與一按摩機，按摩椅座具有一椅框，椅框後側設有一轉軸，轉軸左右各設有一調整齒輪且可以一馬達轉動，調整齒輪各咬合有一鏈條，按摩機設有一第一轉軸與一第二轉軸，第一轉軸左右各設有一第一齒輪，第二轉軸左右各設有一第二齒輪，按摩機兩側設有數張緊齒輪，鏈條咬合於第一齒輪、第二齒輪與張緊齒輪之間，透過轉動調整齒輪捲收鏈條調整其中間段的長度而調整按摩機被拉掣的張力，從而調整按摩的強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">(10):按摩椅座</p>  
        <p type="p">(11):椅框</p>  
        <p type="p">(112):右椅框</p>  
        <p type="p">(113):連接框</p>  
        <p type="p">(114):轉軸</p>  
        <p type="p">(1141):調整齒輪</p>  
        <p type="p">(1142):調整齒輪凸緣</p>  
        <p type="p">(115):連接罩</p>  
        <p type="p">(13):鏈條</p>  
        <p type="p">(20):按摩機</p>  
        <p type="p">(21):第一轉軸</p>  
        <p type="p">(211):第一齒輪</p>  
        <p type="p">(212):第一齒輪凸緣</p>  
        <p type="p">(22):第二轉軸</p>  
        <p type="p">(221):第二齒輪</p>  
        <p type="p">(222):第二齒輪凸緣</p>  
        <p type="p">(23):第一張緊軸</p>  
        <p type="p">(231):第一張緊齒輪</p>  
        <p type="p">(232):第一張緊齒輪凸緣</p>  
        <p type="p">(24):第二張緊軸</p>  
        <p type="p">(241):第二張緊齒輪</p>  
        <p type="p">(242):第二張緊齒輪凸緣</p>  
        <p type="p">(25):第三張緊軸</p>  
        <p type="p">(251):第三張緊齒輪</p>  
        <p type="p">(252):第三張緊齒輪凸緣</p>  
        <p type="p">(27):按摩件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="318" publication-number="202627313"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627313.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙油供油裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">F15B3/00</main-classification>  
        <further-classification edition="200601120250418B">F15B1/26</further-classification>  
        <further-classification edition="200601120250418B">F16K31/02</further-classification>  
        <further-classification edition="200601120250418B">F16K17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中日流體傳動股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡新鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙油供油裝置，包含一下蓋單元、一上蓋單元，及一主體單元。該上蓋單元包括一下油蓋，及一可受操作而沿自身軸向於該下油蓋內移動的閥桿。該上蓋單元包括一上油蓋。該主體單元包括一連接該下油蓋及該上油蓋的內管、一環繞該內管的外管，及一穿設該內管的拉桿。該內管及該拉桿相配合界定出一油杯空間。該內管及該外管相配合界定出一油桶空間。本發明將多條通道整合於該下油蓋中，組裝時僅需將該下油蓋及該上油蓋安裝於該主體單元的上下兩側便能完成，如此可大幅減少所需安裝的部件及管線之數量，並降低所需的安裝空間而減少整體的體積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:下油蓋</p>  
        <p type="p">15:頂座部</p>  
        <p type="p">16:圍繞壁部</p>  
        <p type="p">161:導氣通道</p>  
        <p type="p">162:輸氣通道</p>  
        <p type="p">163:檢測通道</p>  
        <p type="p">18:閥座部</p>  
        <p type="p">19:設置座部</p>  
        <p type="p">191:進氣口</p>  
        <p type="p">C:開孔</p>  
        <p type="p">D:開孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="319" publication-number="202627965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧型農田監控系統</chinese-title>  
        <english-title>SMART FARMLAND MONITORING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250225B">G06Q50/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊正輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王裕民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧型農田監控系統，包含一連接水源的水源監控單元、一連接該水源監控單元的主控單元、一伺服單元、一可攜裝置，及一現場監控單元。該水源監控單元包括一進水管、一蓄水塔、一設置於該進水管的抽水馬達、一連接該蓄水塔的出水管、一設置於該出水管的出水閥，及一水源監控模組。該水源監控模組包括一降雨感測器、一水位感測器，及一連接該降雨及水位感測器的監測控制器。該主控單元包括一主要微控制器，及一連接該主要微控制器的操作介面。該伺服單元包括一伺服器及一資料庫。該可攜裝置能執行設定、控制、監看、查詢的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A smart farmland monitoring system includes a water source monitoring unit connected to a water source, a main control unit connected to the water source monitoring unit, a server unit, a portable device and a field monitoring unit. The water source monitoring unit includes an inlet pipe, a water storage tank, an exhaust motor disposed on the inlet pipe, a water output pipe connected to the water storage tank, a water outlet valve disposed on the water output pipe, and a water source monitoring module. The water source monitoring module includes a rainfall sensor, a water level sensor, and a monitoring controller connected to the rainfall and water level sensors. The main control unit includes a main microcontroller, and an operation interface connected to the main microcontroller. The server unit includes a server and a database. The portable device is capable of executing functions of setting, control, monitoring, and querying.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:水源監控單元</p>  
        <p type="p">3:主控單元</p>  
        <p type="p">4:伺服單元</p>  
        <p type="p">41:伺服器</p>  
        <p type="p">42:資料庫</p>  
        <p type="p">5:可攜裝置</p>  
        <p type="p">6:現場監控單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="320" publication-number="202625919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背包背心可換式靠墊結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">A41F5/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芳池</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種背包背心可換式靠墊結構，其包含有一可換式靠墊，其中，所述可換式靠墊包含一第一表層、一內墊及一第二表層，所述第一表層與該第二表層結合，並將該內墊包於所述第一表層及該第二表層之間，所述第一表層是可吸溼排汗的針織網布，所述內墊是聚酯纖維針織網布，該內墊具有二蜂巢狀的內墊表層，二該內墊表層間設有一具彈性之支撐層，所述支撐層是以聚酯纖維單絲織成且厚度於1毫米以上，所述第二表層設有至少一黏扣帶用以快速黏扣固定，所述可換式靠墊透過該黏扣帶快速黏扣於一背包或一背心上。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">(10):可換式靠墊</p>  
        <p type="p">(11):第一表層</p>  
        <p type="p">(12):內墊</p>  
        <p type="p">(121):內墊表層</p>  
        <p type="p">(122):彈性支撐層</p>  
        <p type="p">(13):第二表層</p>  
        <p type="p">(131):黏扣帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="321" publication-number="202628411"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628411.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149962</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於防止傳真長時呼叫之傳真系統、方法及其電腦可讀媒介</chinese-title>  
        <english-title>FACSIMILE SYSTEM FOR PREVENTING PROLONGED FACSIMILE CALLS, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H04N1/32</main-classification>  
        <further-classification edition="202201120250401B">H04L65/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范恭達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, GONG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜怡楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱振宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於防止傳真長時呼叫之傳真系統及其方法，係應用於IP多媒體子系統網路上，能於傳真系統撥出傳真電話時，若發生傳真作業長時間未完成並且沒有主動中斷電話的情況時，藉由本發明從待發送傳真文件之相關資訊中估算出傳真該待發送傳真文件所需的最長傳真時間，以於通話時間到達最大秒數時，透過應用伺服器主動中斷通話，藉此避免電路被長時間佔用以及不必要的通話費用。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a facsimile system for preventing prolonged facsimile calls and method thereof. The system is applied to the IP multimedia subsystem network. When making a facsimile call in the facsimile system, if the facsimile job is not completed for a long time and the call is not actively interrupted, the present invention is used to estimate a maximum facsimile time based on the information of the facsimile document to be sent. When the call time reaches the maximum facsimile time, an application server actively interrupts the call to avoid long-term occupation of the circuit and unnecessary call charges. The present invention also provides a computer-readable medium for executing the method of the present invention.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:用於防止傳真長時呼叫之傳真系統</p>  
        <p type="p">11:文件儲存伺服器</p>  
        <p type="p">12:應用伺服器</p>  
        <p type="p">13:媒體伺服器</p>  
        <p type="p">14:傳真記錄資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="322" publication-number="202628081"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628081.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二階段聲音事件偵測系統、方法及其電腦可讀媒介</chinese-title>  
        <english-title>TWO-STAGE SOUND EVENT DETECTION SYSTEM, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250303B">G10L25/48</main-classification>  
        <further-classification edition="201301120250303B">G10L25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊向峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, HSIANG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂仲理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭羽涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種二階段聲音事件偵測系統及其方法，系統運行時，會在邊緣端以第一階段辨識子系統進行聲音事件檢測，透過第一聲音事件偵測模型以低複雜度偵測為主體進行第一階段篩選，藉以找出潛在聲音事件，接著，再透過在雲端的第二階段辨識子系統進行聲音事件的二次辨識，利用第二聲音事件偵測模型以高複雜度偵測為主體進行第二階段檢測，進而達到減少傳輸頻寬、降低雲端系統負擔之目的。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a two-stage sound event detection system and method thereof. When the system is running, a first-stage identification subsystem at the edge will be used to detect sound events. First-stage filtering can be performed based on low-complexity detection by a first-stage sound event detection model to find potential sound events. Then, secondary identification of sound events can be performed by a second-stage identification subsystem in the cloud. The second sound event detection model with high-complexity detection is used to perform the second stage of detection, thereby achieving the purpose of reducing transmission bandwidth and reducing the burden on the cloud system. The present invention also provides a computer-readable medium for executing the method of the present invention.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:二階段聲音事件偵測系統</p>  
        <p type="p">11:第一階段辨識子系統</p>  
        <p type="p">12:第二階段辨識子系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="323" publication-number="202627896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大型語言模型微調訓練系統、方法及電腦可讀媒介</chinese-title>  
        <english-title>LARGE LANGUAGE MODEL FINE-TUNING TRAINING SYSTEM, METHOD AND COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06N3/08</main-classification>  
        <further-classification edition="202301120250303B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種大型語言模型微調訓練系統、方法及電腦可讀媒介，係由量化降維模組將原始之大型語言模型進行量化以降低大型語言模型之位元數或參數量，再使用低秩分解技術以分解大型語言模型之原始參數為原始凍結參數與可訓練參數。繼之，由偏好導向最佳化模組對大型語言模型之可訓練參數進行微調訓練或偏好導向最佳化訓練而得出已訓練完成之大型語言模型，俾由模型微調訓練模組將偏好導向最佳化模組所訓練完成之大型語言模型結合量化降維模組所分解出之原始凍結參數而得出已微調訓練之大型語言模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a large language model fine-tuning training system, method and computer readable medium. A quantitative dimensionality reduction module quantizes an original large language model to reduce bit amount or parameter amount of the large language model, and then uses a low-rank decomposition technology to decompose original parameters of the large language model into original frozen parameters and trainable parameters. Next, a preference-oriented optimization module performs fine-tuning training or preference-oriented optimization training on the trainable parameters of the large language model to obtain a trained large language model, and then a model fine-tuning training module combines the large language model trained by the preference-oriented optimization module with the original frozen parameters decomposed by the quantitative dimensionality reduction module to obtain a fine-tuned and trained large language model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:大型語言模型微調訓練系統</p>  
        <p type="p">10:量化降維模組</p>  
        <p type="p">11:量化降維方法</p>  
        <p type="p">12:量化轉換法</p>  
        <p type="p">20:偏好導向最佳化模組</p>  
        <p type="p">21:直接偏好最佳化方法</p>  
        <p type="p">22:反向傳播梯度更新方法</p>  
        <p type="p">30:模型微調訓練模組</p>  
        <p type="p">31:模型微調訓練方法</p>  
        <p type="p">A:第一低秩矩陣</p>  
        <p type="p">B:第二低秩矩陣</p>  
        <p type="p">D:偏好資料集</p>  
        <p type="p">D1:訓練資料</p>  
        <p type="p">L:大型語言模型</p>  
        <p type="p">L':已微調訓練之大型語言模型</p>  
        <p type="p">L1:策略模型</p>  
        <p type="p">L2:參照模型</p>  
        <p type="p">L3:訓練模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="324" publication-number="202627860"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627860.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用人工智慧防詐之使用者裝置、方法及電腦可讀媒介</chinese-title>  
        <english-title>USER DEVICE, METHOD AND COMPUTER READABLE MEDIUM USING ARTIFICIAL INTELLIGENCE FOR FRAUD PREVENTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250324B">G06F30/27</main-classification>  
        <further-classification edition="202001120250324B">G16Y10/75</further-classification>  
        <further-classification edition="200901120250324B">H04W60/04</further-classification>  
        <further-classification edition="202401320250324B">G05D101/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華資安國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHT SECURITY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何玟叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WUN RUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TSUNG WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種利用人工智慧防詐之使用者裝置、方法及電腦可讀媒介，係由使用者裝置之通知解析模組解析外部之推播通知以得出無疑慮或有疑慮之推播通知，再由使用者裝置之資料儲存器儲存無疑慮之推播通知，或由使用者裝置之終端人工智慧訊息分析模組分析有疑慮之推播通知。當分析出有疑慮之推播通知是詐騙之推播通知時，由使用者裝置之詐騙通知防護模組向作業系統請求取消詐騙之推播通知之展示及移除詐騙之推播通知，俾針對詐騙之推播通知發出訊息或通知，以提醒使用者裝置之使用者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a user device, method and computer readable medium using artificial intelligence for fraud prevention. A notification parsing module of a user device parses an external push notification to obtain a doubtless or questionable push notification, and then a data storage of the user device stores the doubtless push notification, or an on-device artificial intelligence message analysis module of the user device analyzes the questionable push notification. When the questionable push notification is analyzed to be a fraudulent push notification, a fraud notification protection module of the user device requests an operating system to cancel display of the fraudulent push notification and remove the fraud push notification, in order to send a message or notification to alert a user of the user device in response to the fraudulent push notification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:使用者裝置</p>  
        <p type="p">2:人工智慧伺服器</p>  
        <p type="p">11:通訊軟體</p>  
        <p type="p">12:作業系統</p>  
        <p type="p">12a:通知中心軟體</p>  
        <p type="p">13:權限取得模組</p>  
        <p type="p">14:通知解析模組</p>  
        <p type="p">15:終端人工智慧訊息分析模組</p>  
        <p type="p">16:詐騙通知防護模組</p>  
        <p type="p">17:個資保護模組</p>  
        <p type="p">18:人工智慧模型優化模組</p>  
        <p type="p">19:資料儲存器</p>  
        <p type="p">20:處理器</p>  
        <p type="p">A:推播通知</p>  
        <p type="p">A1:有疑慮之推播通知</p>  
        <p type="p">A2:詐騙之推播通知</p>  
        <p type="p">A3:已精簡化之詐騙之推播通知</p>  
        <p type="p">B:外部</p>  
        <p type="p">C:使用者</p>  
        <p type="p">D:終端人工智慧模型</p>  
        <p type="p">D1:終端人工智慧模型之母體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="325" publication-number="202627899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149967</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於知識圖譜之智慧導引系統、方法及其電腦可讀媒介</chinese-title>  
        <english-title>SMART GUIDANCE SYSTEM BASED ON KNOWLEDGE GRAPH, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06N5/022</main-classification>  
        <further-classification edition="202301120250303B">G06N5/02</further-classification>  
        <further-classification edition="202301120250303B">G06N5/04</further-classification>  
        <further-classification edition="201901120250303B">G06F16/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昭宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHAO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林心鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種基於知識圖譜之智慧導引系統及其方法，以自然語言的方式接受用戶的提問，再經由判斷問句意圖後，進行圖譜資料庫的檢索搜尋答案，即由大語言模型(LLM)產出代理(Agent)名單，以供意圖判斷模組選擇，藉此提升檢索精確度，另外，知識文件經知識轉換模組進行轉換後儲存於圖譜資料庫中，無論是搜尋或是建立知識，都由查詢生成模組產生搜尋或建立圖譜的指令，因此透過將知識文件轉化為查詢描述，顯著減少建立圖譜的時間，故能提高整體效率和適用性。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a smart guidance system based on knowledge graph and method thereof. In the smart guidance system, questions from users in a natural language can be accepted, and answers can be searched in a graph database after judging the intention of the questions. That is, an agent list produced by a large language model(LLM) for selection by an intent judgment module, thereby improving the retrieval accuracy. In addition, knowledge files are converted by a knowledge conversion module and stored in the graph database. Whether searching or creating knowledge, instructions for searching or creating graphs are generated by a query generation module. Therefore, by converting knowledge files into query descriptions, the time to build the graph is significantly reduced, thus improving overall efficiency and applicability. The present invention also provides a computer-readable medium for executing the method of the present invention.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基於知識圖譜之智慧導引系統</p>  
        <p type="p">10:大語言模型</p>  
        <p type="p">11:意圖判斷模組</p>  
        <p type="p">12:查詢生成模組</p>  
        <p type="p">13:結果彙整模組</p>  
        <p type="p">14:圖譜資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="326" publication-number="202626276"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626276.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於扳手之棘輪結構</chinese-title>  
        <english-title>RATCHET STRUCTURE APPLIED TO WRENCHES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">B25B13/46</main-classification>  
        <further-classification edition="200601120250320B">B25B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍崴股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACT QUALITY INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃春曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種應用於扳手之棘輪結構，其包含：一棘輪本體，該本體一端形成一連接部，該本體另一端朝連接部方向凹設形成一凹槽，並於該凹槽槽底壁朝凹槽槽口方向延伸一驅動部，另於該棘輪本體的外表面環設一棘齒部；其中，利用該驅動部的設置，使其配合所要裝、卸的零配件之結合，並搭配該凹槽槽內壁與該驅動部之間的間隙形成下，使其能夠牢固的與零配件相組裝，且方便使用者能快速的作使用，藉以克服以往防脫效果不佳、不斷更換棘輪結構消耗時間，以至於擰動作業受影響，甚至造成使用者受傷的情形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a ratchet structure applied to wrenches, which includes: a ratchet body, one end of which forms a connection portion, and the other end of which is recessed toward the connection portion to form a groove. A drive portion extends from the bottom wall of the groove towards the opening of the groove. Additionally, a ratchet tooth portion is arranged around the outer surface of the ratchet body. The drive portion is designed to engage with the components to be assembled or disassembled, and the gap formed between the inner wall of the groove and the drive portion ensures a secure assembly with the components. This design allows for quick use by the operator. It overcomes the issue of poor anti-loosening performance in previous designs, the time wasted in frequently replacing the ratchet structure, and the negative impact on the twisting operation, which could even lead to user injury.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:棘輪本體</p>  
        <p type="p">11:連接部</p>  
        <p type="p">12:凹槽</p>  
        <p type="p">13:驅動部</p>  
        <p type="p">14:棘齒部</p>  
        <p type="p">141:齒塊</p>  
        <p type="p">142:齒槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="327" publication-number="202628121"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628121.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供一操作建議給一苯酚異丙苯法反應區的裝置、方法及其電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250613B">G16C20/70</main-classification>  
        <further-classification edition="201901120250613B">G16C20/30</further-classification>  
        <further-classification edition="201901120250613B">G16C20/10</further-classification>  
        <further-classification edition="202301120250613B">G06N3/08</further-classification>  
        <further-classification edition="200601120250613B">C07C37/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣化學纖維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMOSA CHEMICALS &amp; FIBRE CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱裕堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YU-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHIA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏立玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, LI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JUN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提供操作建議給苯酚異丙苯法反應區的裝置、方法及其電腦程式產品，其針對進料的進料條件組合及各操作條件組合進行：(a)將進料條件組合及操作條件組合中的第一操作條件輸入氧化預測模型，藉此得到第一產率、第一輸出組合及第一安全觀察指標，(b)將第一輸出組合、裂鍵單元的進料量及操作條件組合中的第二操作條件輸入裂鍵預測模型，藉此得到第二產率及第二安全觀察指標，及(c)當第一及第二安全觀察指標中的每一個符合對應的安全要求時，選取該操作條件組合作為候選條件組合。裝置根據各候選條件組合的第一及第二產率，決定操作建議。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S601、S603、S605、S607、S609:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="328" publication-number="202627960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資產處置表決方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250303B">G06Q40/04</main-classification>  
        <further-classification edition="201201120250303B">G06Q20/38</further-classification>  
        <further-classification edition="201201120250303B">G06Q40/06</further-classification>  
        <further-classification edition="200601120250303B">H04L9/32</further-classification>  
        <further-classification edition="201301120250303B">G06F21/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA CING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪家佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA CING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪家佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資產處置表決方法，由一表決系統實施，該資產處置表決方法包含以下步驟：該表決系統從一第一終端單元接收一資產標的資料、一權力範圍資料、複數認購份、一認購截止時間，及一第一狀態，並產生一智慧合約資料，該表決系統更新其中一認購份對應至另一使用者識別號，該表決系統接收一處置表決指令及一表決截止時間，該表決系統從複數第二終端單元接收複數決定值及複數數位簽章，該表決系統判定到達該表決截止時間後，判定一表決結果，並依此更新該智慧合約資料為該第一狀態及一第二狀態的其中一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:表決系統</p>  
        <p type="p">11:智慧合約資料庫</p>  
        <p type="p">2:第一終端單元</p>  
        <p type="p">3:第二終端單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="329" publication-number="202626165"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626165.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>獨立及並聯的預熱式直通真空集熱管蒸餾器</chinese-title>  
        <english-title>INDEPENDENT AND PARALLELLY-CONNECTED PREHEATING DIRECT-FLOW VACUUM HEAT-COLLETING DISTILLATION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">B01D3/04</main-classification>  
        <further-classification edition="200601120250423B">F28B1/02</further-classification>  
        <further-classification edition="202301120250423B">C02F1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慈濟學校財團法人慈濟大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZU CHI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文曲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇美惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, MEI HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴昌賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, CHANG HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種獨立及並聯的預熱式直通真空集熱管蒸餾器。所述預熱式直通真空集熱管蒸餾器包括：一直通真空集熱管，有一真空玻璃外管及一直通金屬內管，該直通金屬內管穿伸於該真空玻璃外管，該直通金屬內管有一入口端及一出口端；一水霧噴管，自該入口端伸入該直通金屬內管中；一冷凝器，包括一外層冷凝水管及一內層蜿蜒水管，該外層冷凝水管有一冷凝水入口及一冷凝水出口，該冷凝水出口連通該水霧噴管，該內層蜿蜒水管有一連接口及一出水口，該連接口連接該直通金屬內管之出口端。上述預熱式直通真空集熱管蒸餾器為獨立的模組，可透過一並聯管路的複數三通管連接於複數預熱式直通真空集熱管蒸餾器的水霧噴管而形成並聯連接的預熱式直通真空集熱管蒸餾器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:直通真空集熱管</p>  
        <p type="p">11:真空玻璃外管</p>  
        <p type="p">12:直通金屬內管</p>  
        <p type="p">121:入口端</p>  
        <p type="p">122:出口端</p>  
        <p type="p">123:排放口</p>  
        <p type="p">23:彈力伸縮管</p>  
        <p type="p">231:進水口</p>  
        <p type="p">232:噴頭</p>  
        <p type="p">3:冷凝器</p>  
        <p type="p">31:外層冷凝水管</p>  
        <p type="p">311:冷凝水入口</p>  
        <p type="p">312:冷凝水出口</p>  
        <p type="p">32:內層蜿蜒水管</p>  
        <p type="p">321:連接口</p>  
        <p type="p">322:出水口</p>  
        <p type="p">5:抽水馬達</p>  
        <p type="p">6:輸送管路</p>  
        <p type="p">61:閥門</p>  
        <p type="p">7:太陽能電池模組</p>  
        <p type="p">71:太陽能板</p>  
        <p type="p">72:鋰電池</p>  
        <p type="p">20:來源水</p>  
        <p type="p">30:收集桶</p>  
        <p type="p">40:鹵水桶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="330" publication-number="202628304"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628304.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結合磁吸線材之行動電源</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H02J7/00</main-classification>  
        <further-classification edition="200601120260302B">H01R13/04</further-classification>  
        <further-classification edition="200601120260302B">H01R13/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬摩科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳欣曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施品如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘俞宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種結合磁吸線材之行動電源，主要包括:電源裝置及電力傳輸線，其中電源裝置電性連接一非接觸式充電模組及至少一插座連接器，電源裝置至少一側設置磁性件，電力傳輸線兩端的插頭連接器可供電性連接插座連接器，電力傳輸線內設置的吸附件，經插頭連接器與插座連接器分離後，電力傳輸線由吸附件與磁性件相互產生磁性吸附而位於電源裝置一側，電源裝置及電力傳輸線透過吸附件與磁性件相互產生磁性吸附，可有效確保電力傳輸線使用完畢後的無感且快速的結合於電源裝置，避免電力傳輸線使用完後造成可能的遺失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:行動電源</p>  
        <p type="p">10:電源裝置</p>  
        <p type="p">11:電力傳輸線</p>  
        <p type="p">110:吸附件</p>  
        <p type="p">13:插座連接器</p>  
        <p type="p">14:磁性件</p>  
        <p type="p">15:插頭連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="331" publication-number="202627402"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627402.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橢偏儀及其操作方法</chinese-title>  
        <english-title>ELLIPSOMETRY AND OPERATION METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">G01B9/00</main-classification>  
        <further-classification edition="200601120250320B">G01B11/06</further-classification>  
        <further-classification edition="200601120250320B">G01N21/21</further-classification>  
        <further-classification edition="200601120250320B">G01N21/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊富程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種橢偏儀，包含光源、起偏器、樣品台、相位延遲器、檢偏器以及檢測器。光源配置以發出未偏振光束。起偏器接收未偏振光束，並使未偏振光束轉變為具有已知偏振態的偏振光束。樣品台用於支撐待測樣品，其中偏振光束入射至待測樣品的表面。相位延遲器配置以調節偏振光束的S偏振與P偏振的相位差，且相位延遲器的快軸與偏振光束的S偏振分量平行。檢偏器配置以於接收從待測樣品表面反射的反射光束，其中相位延遲器位在起偏器與檢偏器之間以降低待測樣品的膜厚量測變異性。檢測器配置以接收通過檢偏器的反射光束。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ellipsometry includes a light source, a polarizer, a sample platform, a phase retarder, a analyzer, a detector. The light source is configured to emit an unpolarized light. The polarizer receives the unpolarized light and transforms the unpolarized light to a polarized light with known polarization. The sample platform is used to support a sample to be inspected. The polarized light is emitted onto a surface of the sample to be inspected. The phase retarder is configured to modulate a phase difference between S polarization and P polarization of the polarized beam. A fast axis of the phase retarder is parallel with a S-polarization of the polarized light. The analyzer is configured to receive a reflection light reflected from the surface of the sample. The phase retarder is located between the polarizer and the analyzer to reduce the variability of film thickness measurements of the same to be inspected. The detector is configured to receive the reflection light passed through the analyzer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:橢偏儀</p>  
        <p type="p">110:光源</p>  
        <p type="p">120:起偏器</p>  
        <p type="p">130:樣品台</p>  
        <p type="p">132:待測樣品</p>  
        <p type="p">140:相位延遲器</p>  
        <p type="p">150:檢偏器</p>  
        <p type="p">160:檢測器</p>  
        <p type="p">L1:未偏振光束</p>  
        <p type="p">L2:偏振光束</p>  
        <p type="p">L3,L4:反射光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="332" publication-number="202627955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於自訂薪轉明細分析之金融商品媒合推薦系統及其方法</chinese-title>  
        <english-title>FINANCIAL PRODUCT MATCHING RECOMMENDATION SYSTEM BASED ON CUSTOMIZED PAYROLL DETAIL ANALYSIS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q40/02</main-classification>  
        <further-classification edition="201201120250303B">G06Q40/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彰化商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG HWA COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張立群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於自訂薪轉明細分析之金融商品媒合推薦系統及其方法，透過提供薪轉明細格式且允許自行訂立項目名稱，以及偵測到使用薪轉明細格式執行批次薪資轉帳時，擷取指定的時間週期內相同帳戶的所有項目名稱及其相應的項目類別與金額作為分析樣本，再根據分析樣本計算平均收入及視為收入波動度的標準差，以便根據收入波動度載入合適的理財商品作為媒合結果，以及根據客戶投資風險等級對照表及平均收入進行篩選及引導申購理財商品，用以達成提高理財推薦的適切性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A financial product matching recommendation system based on customized payroll detail analysis and method thereof is disclosed. By providing a payroll detail format that allows users to define item names and detecting when a batch payroll transfer is executed using the payroll detail format, it extracts all item names, corresponding item categories, and amounts from the same account within the specified time period as an analysis sample. Then, based on the analysis sample, it calculates the average income and the standard deviation, which is considered as income volatility, in order to load suitable financial products as matching results based on income volatility. Additionally, it filters and guides the subscription of financial products based on the client's investment risk level chart and average income. The mechanism is help to improve the suitability of financial product recommendations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:網銀伺服器</p>  
        <p type="p">101:客戶端</p>  
        <p type="p">110:設定模組</p>  
        <p type="p">120:擷取模組</p>  
        <p type="p">130:分析模組</p>  
        <p type="p">140:媒合模組</p>  
        <p type="p">150:推薦模組</p>  
        <p type="p">160:風險模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="333" publication-number="202627956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供ERP導入網銀自訂格式整批薪轉交易的系統及其方法</chinese-title>  
        <english-title>BATCH PAYROLL TRANSACTIONS SYSTEM BASED ON ERP FOR PROVIDING CUSTOM FORMAT AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q40/02</main-classification>  
        <further-classification edition="202301120250303B">G06Q10/10</further-classification>  
        <further-classification edition="202301120250303B">G06Q40/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彰化商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG HWA COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張立群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提供ERP導入網銀自訂格式整批薪轉交易的系統及其方法，透過將企業資源規劃（Enterprise resource planning, ERP）主機與銀行主機相互連接，以便在客戶端登入銀行主機自訂薪轉明細格式時，由銀行主機自ERP主機載入員工訊息以與薪資項目名稱範本執行關鍵字比對，進而擷取比對相符的關鍵字以生成項目名稱及其項目類別與金額，並且顯示於圖形使用者介面以供客戶端進行調整，再根據調整結果產生薪轉明細格式用於執行批次薪資轉帳，用以達到提高薪資轉帳操作的易用性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A batch payroll transactions system based on enterprise resource planning (ERP) for providing custom format and method thereof is disclosed. By connecting the ERP host with the bank host, the bank host loads employee information from the ERP host when the client logs in to customize the payroll details format. The bank host performs keyword matching with the payroll item name template, extracting matching keywords to generate item names, their corresponding categories, and amounts. These are displayed on a graphical user interface for the client to adjust. Based on the adjustments, the payroll details format is generated for executing batch payroll transfers. The mechanism is help to improve the usability of payroll transfer operations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:企業資源規劃主機</p>  
        <p type="p">120:銀行主機</p>  
        <p type="p">121:載入模組</p>  
        <p type="p">122:分析模組</p>  
        <p type="p">123:自訂模組</p>  
        <p type="p">124:執行模組</p>  
        <p type="p">130:客戶端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="334" publication-number="202627374"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627374.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>門框保冷結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250219B">F25D23/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡雨霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡雨霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種門框保冷結構及其轉角接頭，包含一對門框，包含一垂直邊料、一水平邊料、一接合部以及連接該水平邊料且相對的一第一抵靠部、一第二抵靠部及一第三抵靠部，各該垂直邊料與各該水平邊料一端間有一第一容置槽，各該第一抵靠部與各該第二抵靠部間有一第二容置槽，各該第三抵靠部與各該垂直邊料間有一第三容置槽；一轉角接頭，包含一對設於該對門框各轉角處的各該第二容置槽內的嵌接體，以及一對各朝各該嵌接體外側下方向外延伸且與各該抵靠部相抵接的平面；以及一氣密壓條，設於該對門框的各該第三容置槽內並與各該平面相抵接；藉此，使該對門框各轉角相接的銜接處外側不會產生間隙，提升保冷程度，令門板密封冷度不外漏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:門框保冷結構</p>  
        <p type="p">4:門框</p>  
        <p type="p">41:垂直邊料</p>  
        <p type="p">42:水平邊料</p>  
        <p type="p">43:接合部</p>  
        <p type="p">44:第一抵靠部</p>  
        <p type="p">45:第一容置槽</p>  
        <p type="p">46:第二抵靠部</p>  
        <p type="p">47:第三抵靠部</p>  
        <p type="p">48:第二容置槽</p>  
        <p type="p">49:第三容置槽</p>  
        <p type="p">5:轉角接頭</p>  
        <p type="p">51:嵌接體</p>  
        <p type="p">511:穿伸孔</p>  
        <p type="p">52:平面</p>  
        <p type="p">6:氣密壓條</p>  
        <p type="p">61:平整面</p>  
        <p type="p">62:弧形</p>  
        <p type="p">71:門片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="335" publication-number="202626137"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626137.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150018</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>餵食器之連接裝置</chinese-title>  
        <english-title>FEEDING DEVICE CONNECTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250120B">A61M39/08</main-classification>  
        <further-classification edition="200601120250120B">A61M25/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾奇爾生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCHER BIOTECHNOLOGY DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辜雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, YA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露為一種餵食器之連接裝置，其包括一輸料件及一封口件。輸料件具有一銜接管、一安裝單元及一輸料通道，銜接管位於安裝單元之一側，輸料通道貫穿安裝單元，輸料通道連通輸料件之外部與銜接管之管內；封口件相鄰於輸料件，封口件具有一塞子及一相連單元，塞子選擇性地封住於銜接管的一管口，相連單元連接於輸料件的安裝單元與塞子之間。藉此，便於相關人員快速拆裝餵食器與導管，以便於導管的清洗。此外，本揭露的封口件能隔絕餵食器內部流質食物與外部空氣，避免流質食物受到汙染。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A feeding device connecting device, which comprises a conveying piece and a sealing piece. The conveying piece has a connecting pipe, an installation unit and a conveying channel, the connecting pipe is located on one side of the installation unit, the conveying channel runs through the installation unit, and the conveying channel is connected with the outside of the conveying piece and the connecting pipe; The sealing piece is adjacent to the conveying piece, and the sealing piece has a plug and a connecting unit, the plug is selectively sealed at the connecting pipe, and the connecting unit is connected between the installation unit and the plug . Thus, it is convenient for relevant personnel to quickly disassemble and assemble the feeding device and catheter to facilitate the cleaning. In addition, the sealing piece revealed in this article can isolate the liquid food inside the feeding device from the outside air, preventing the liquid food from being contaminated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接裝置</p>  
        <p type="p">10:輸料件</p>  
        <p type="p">11:銜接管</p>  
        <p type="p">112:卡合部</p>  
        <p type="p">112a:錐面</p>  
        <p type="p">12:安裝單元</p>  
        <p type="p">121:穩固部</p>  
        <p type="p">121a:肋條</p>  
        <p type="p">13:輸料通道</p>  
        <p type="p">20:封口件</p>  
        <p type="p">21:塞子</p>  
        <p type="p">211:連接部</p>  
        <p type="p">212:隔絕部</p>  
        <p type="p">22:相連單元</p>  
        <p type="p">221:蜿蜒段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="336" publication-number="202627835"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627835.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150026</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可彈性變更表格的網頁伺服系統</chinese-title>  
        <english-title>FLEXIBLE FORM MODIFICATION WEB SERVER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250401B">G06F16/95</main-classification>  
        <further-classification edition="202001120250401B">G06F40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清蓮科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CING LIAN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佑豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啓倉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-TSNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佑豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啓倉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-TSNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種網頁伺服系統，其包括至少一網頁、一資料庫、一表格配置文件及一表格產生程式模組。該網頁具有一表格，該表格包括多列的資料列。由於該表格配置文件記載該表格的每一資料列的標題及資料來源，因此，該表格產生程式模組可根據該表格配置文件來產生該表格。若想要變更表格，只需修改該表格配置文件的內容，不涉及資料庫操作，也不用修改網頁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a web server system includes at least a web page, a database, a form configuration file and a form generation module. The web page has a form, the form consists of multiple rows of data. Since the form configuration file records the title and data source for each data row of the form, the form generation module can generate the form based on the form configuration file. To modify the form, only the content of the form configuration file needs to be updated, without any database operations or modification on the web page.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:網頁</p>  
        <p type="p">10:網頁伺服系統</p>  
        <p type="p">2:資料庫</p>  
        <p type="p">20:使用者電腦</p>  
        <p type="p">3:表格配置文件</p>  
        <p type="p">4:表格產生程式模組</p>  
        <p type="p">5:編輯操作介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="337" publication-number="202628537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱組件</chinese-title>  
        <english-title>HEAT DISSIPATION ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K7/20</main-classification>  
        <further-classification edition="200601120250418B">F28D21/00</further-classification>  
        <further-classification edition="200601120250418B">F28F13/00</further-classification>  
        <further-classification edition="200601120250418B">F28F3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴昆輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, KUN HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種散熱組件包括有一殼體，具有一第一容置空間；一電路板， 設置於該第一容置空間內，進一步包括有；以及至少一彈性元件，該些彈性元件之一端設置於該電路板之上表面；一發熱元件，設置該電路板之上表面；一散熱板，設置於該發熱元件上，且具有至少一第一吸附件；一散熱器，具有一第二容置空間，且具有至少一第二吸附件。該散熱器以可拆卸式安裝於該殼體之外表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation assembly comprising a housing with a first accommodating space; a circuit board disposed within the first accommodating space, further including; at least one elastic element, with one end of the elastic elements positioned on the upper surface of the circuit board; a heating element disposed on the upper surface of the circuit board; a heat dissipation plate positioned on the heating element and having at least one first attachment member; and a heat sink with a second accommodating space and at least one second attachment member. The heat sink is detachably mounted on the outer surface of the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:散熱組件</p>  
        <p type="p">10:殼體</p>  
        <p type="p">20:散熱器</p>  
        <p type="p">30:第一容置空間</p>  
        <p type="p">40:電路板</p>  
        <p type="p">50:彈性元件</p>  
        <p type="p">60:發熱元件</p>  
        <p type="p">70:散熱板</p>  
        <p type="p">80:上表面</p>  
        <p type="p">90:第一吸附件</p>  
        <p type="p">100:第二容置空間</p>  
        <p type="p">110:第二吸附件</p>  
        <p type="p">120:固定件</p>  
        <p type="p">130:下表面</p>  
        <p type="p">140:限位件</p>  
        <p type="p">150:下表面</p>  
        <p type="p">160:突出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="338" publication-number="202626002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射刺激與管理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">A61H39/00</main-classification>  
        <further-classification edition="200601120250203B">A61N5/067</further-classification>  
        <further-classification edition="201801120250203B">G16H20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新優勢行銷事業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭建彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一雷射刺激與管理系統的一控制裝置透過一通訊模組連接一伺服器和一雷射裝置；該伺服器儲存有一使用者資料、對應該使用者資料的一客製化按摩設定資料和一按摩生理數據參數表，而該控制裝置儲存有至少一按摩設定參數；當該伺服器接收到該控制裝置上傳的該生理數據資料時，該伺服器根據該生理數據資料和該按摩生理數據參數表更新該客製化按摩設定資料，且將更新後的該客製化按摩設定資料傳送至該控制裝置，該控制裝置根據該客製化按摩設定資料更新該至少一按摩設定參數以進一步控制該雷射裝置客製化的產生一刺激雷射光束。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:伺服器</p>  
        <p type="p">200:控制裝置</p>  
        <p type="p">210:處理模組</p>  
        <p type="p">220:通訊模組</p>  
        <p type="p">230:記憶模組</p>  
        <p type="p">240:顯示模組</p>  
        <p type="p">250:輸入模組</p>  
        <p type="p">260:聲音模組</p>  
        <p type="p">300:雷射裝置</p>  
        <p type="p">310:通訊及處理模組</p>  
        <p type="p">320:雷射發射器</p>  
        <p type="p">330:震動模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="339" publication-number="202628268"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628268.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲能連接器之樞接結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">H01R13/629</main-classification>  
        <further-classification edition="200601120250324B">H01R13/639</further-classification>  
        <further-classification edition="200601120250324B">H01R13/04</further-classification>  
        <further-classification edition="200601120250324B">H01R13/10</further-classification>  
        <further-classification edition="200601120250324B">H01R13/64</further-classification>  
        <further-classification edition="201101120250324B">H01R24/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進聯工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商進聯電子科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商高誠電子（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳智遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑋奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種儲能連接器之樞接結構，提供一裝卸簡便、防止插錯和容許360度轉動(整線)等作用；包括公端模組和母端模組的組合；公端模組設置有柄部和連接柄部的頭部，頭部具有外壁、內壁和內壁界定的多邊形插接腔，頭部(或多邊形插接腔)設置有插接筒和設在插接筒內的導電部。以及，母端模組設置有副插接筒，副插接筒有副外壁、副內壁和副內壁界定的副插接腔；副插接腔內設有副導電部。在插接筒插入副插接筒形成電性連接時，使母端模組的副外壁與(或相切於)公端模組的多邊形插接腔(或內壁)，構成至少3個切點，迫使副插接筒被拘留或包圍在多邊形插接腔裏面，以獲得穩固聯結的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:公端模組</p>  
        <p type="p">11:柄部</p>  
        <p type="p">12:頭部</p>  
        <p type="p">13:絕緣柱</p>  
        <p type="p">14:插接筒</p>  
        <p type="p">15:外壁</p>  
        <p type="p">16:內壁</p>  
        <p type="p">17:多邊形插接腔</p>  
        <p type="p">19:基部區</p>  
        <p type="p">20:母端模組</p>  
        <p type="p">23:絕緣套</p>  
        <p type="p">24:副插接筒</p>  
        <p type="p">25:副外壁</p>  
        <p type="p">26:副內壁</p>  
        <p type="p">27:副插接腔</p>  
        <p type="p">30:導電部</p>  
        <p type="p">40:副導電部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="340" publication-number="202628272"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628272.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150046</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲能連接器之聯接結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250627B">H01R13/64</main-classification>  
        <further-classification edition="200601120250627B">H01R35/00</further-classification>  
        <further-classification edition="201101120250627B">H01R24/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進聯工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商進聯電子科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商高誠電子（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳智遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑋奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳恕琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種儲能連接器之聯接結構，提供一裝卸簡便、防止插錯和容許360度轉動(整線)等作用；包括公端模組和母端模組的組合；公端模組設置有柄部和連接柄部的頭部，頭部具有外壁、內壁、插接腔和設在內壁上的至少三個限制部，頭部設置有插接筒和設在插接筒內的導電部。以及，母端模組設置有副插接筒，副插接筒有副外壁、副內壁和副插接腔；副插接腔內設有副導電部。在插接筒插入副插接筒形成電性連接時，使母端模組的副外壁與(或相切於)公端模組的限制部，構成至少3個切點，迫使副插接筒被拘留或包圍在插接腔裏面，以獲得穩固聯結的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:公端模組</p>  
        <p type="p">11:柄部</p>  
        <p type="p">12:頭部</p>  
        <p type="p">13:絕緣柱</p>  
        <p type="p">14:插接筒</p>  
        <p type="p">15:外壁</p>  
        <p type="p">16:內壁</p>  
        <p type="p">17:插接腔</p>  
        <p type="p">19:基部區</p>  
        <p type="p">20:母端模組</p>  
        <p type="p">23:絕緣套</p>  
        <p type="p">24:副插接筒</p>  
        <p type="p">25:副外壁</p>  
        <p type="p">26:副內壁</p>  
        <p type="p">27:副插接腔</p>  
        <p type="p">30:導電部</p>  
        <p type="p">40:副導電部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="341" publication-number="202628269"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628269.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於連接器之樞接結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">H01R13/629</main-classification>  
        <further-classification edition="200601120250320B">H01R13/639</further-classification>  
        <further-classification edition="200601120250320B">H01R13/04</further-classification>  
        <further-classification edition="200601120250320B">H01R13/10</further-classification>  
        <further-classification edition="200601120250320B">H01R13/64</further-classification>  
        <further-classification edition="201101120250320B">H01R24/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進聯工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商進聯電子科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商高誠電子（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳智遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑋奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳恕琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於連接器之樞接結構，提供一裝卸簡便、防止插錯和容許360度轉動(整線)等作用；包括公端模組和母端模組的組合。公端模組設置有頭部，頭部具有外壁、內壁和內壁界定的插接腔；頭部(或內壁/插接腔)形成有至少二個直線區(及/或弧線區)及/或朝向插接腔(內部方向)突出的限制部(或限制部的弧線段及/或直線段)及/或副限制部。以及，母端模組設置有副插接筒、副外壁(及/或副內壁、副內壁界定的副插接腔)。在插接腔組合副插接筒時，使母端模組的副外壁與(或相切於)公端模組的頭部(或內壁/插接腔)的直線區(及/或弧線區)及/或限制部(弧線段及/或直線段)，構成至少3個切點，以建立公端模組穩定聯結母端模組的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:公端模組</p>  
        <p type="p">11:柄部</p>  
        <p type="p">12:頭部</p>  
        <p type="p">13:絕緣柱</p>  
        <p type="p">14:插接筒</p>  
        <p type="p">15:外壁</p>  
        <p type="p">16:內壁</p>  
        <p type="p">17:插接腔</p>  
        <p type="p">19:基部區</p>  
        <p type="p">20:母端模組</p>  
        <p type="p">23:絕緣套</p>  
        <p type="p">24:副插接筒</p>  
        <p type="p">25:副外壁</p>  
        <p type="p">26:副內壁</p>  
        <p type="p">27:副插接腔</p>  
        <p type="p">30:導電部</p>  
        <p type="p">40:副導電部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="342" publication-number="202625890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能循環魚菜共生系統</chinese-title>  
        <english-title>INTELLIGENT CIRCULAR AQUAPONICS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250126B">A01K63/04</main-classification>  
        <further-classification edition="200601120250126B">A01K63/06</further-classification>  
        <further-classification edition="200601120250126B">A01G31/02</further-classification>  
        <further-classification edition="201801120250126B">A01G9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>空軍航空技術學院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIR FORCE INSTITUTE OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李錦昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIN ANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃珊珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智能循環魚菜共生系統，包含一種植單元、一過濾單元、一養殖單元及一控制單元，該種植單元包括一種植主體及一土壤濕度控制模組，該過濾單元包括一過濾主體，該養殖單元包括一養殖主體，該土壤濕度控制模組抽取該養殖主體中的液體，並且控制該種植主體中土壤的濕度，該控制單元包括一種植設定模組及一植物設定模組，該植物設定模組中儲存一植物種類資料及一與該植物種類資料相關連的種植環境資料，該種植環境資料為對該植物種類資料的環境設定，該種植設定模組依據該種植環境資料控制該土壤濕度控制模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent circulating aquaponics system includes a planting unit, a filtering unit, a breeding unit and a control unit. The planting unit includes a planting body and a soil moisture control module. The filter unit includes a filter body. The breeding unit includes a breeding body. The soil moisture control module extracts liquid from the cultivation body and controls the soil moisture in the cultivation body. The control unit includes a planting setting module and a plant setting module. The plant setting module stores a plant species data and a planting environment data related to the plant species data. The planting environment data is the environment setting for the plant species data. The planting setting module controls the soil moisture control module according to the planting environment data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:種植單元</p>  
        <p type="p">31:種植主體</p>  
        <p type="p">32:土壤濕度控制模組</p>  
        <p type="p">4:過濾單元</p>  
        <p type="p">41:過濾主體</p>  
        <p type="p">5:養殖單元</p>  
        <p type="p">51:養殖主體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="343" publication-number="202628249"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628249.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力連接器</chinese-title>  
        <english-title>POWER CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250430B">H01R4/2404</main-classification>  
        <further-classification edition="200601120250430B">H01R4/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪永熾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電力連接器及電力端子，可電性連接第一外部元件及第二外部元件，所述電力端子包括：對接件，包括向前延伸並可插入所述第一外部元件的柱狀接觸部及第一擋部；支撐件，包括可固定在所述第二外部元件的安裝部及容納空間，所述容納空間貫穿所述支撐件的前表面及後表面；及固定件，包括第二檔部；其中，所述對接件與固定件之間由一連接部作彼此固定，所述連接部穿過所述容納空間，所述連接部與所述容納空間的內壁面之間間隔有一定間距，所述第一擋部與所述支撐件的前表面之間設有第一彈性件。如此，本發明的電力端子適用公端電力端子，且組裝方便，滿足多角度浮動的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power connector includes two power terminals, each terminal includes a mating member including a pin shape contacting portion and a first stopping portion, a support member including a mounting portion and a hole running through a front face and a rear face thereof, and a retaining member including a second stopping portion. The mating member and the retaining member are retained together by a connecting portion, the connecting portion goes through the hole. A first biasing member is disposed between the first stopping portion and a front face of the supporting member. Therefore, the power terminals are suitable for plug terminals and provide multiple-angle floating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">113:連接部</p>  
        <p type="p">122:容納空間</p>  
        <p type="p">123:淺凹部</p>  
        <p type="p">132:連接柱</p>  
        <p type="p">14:第一彈性件</p>  
        <p type="p">141:指狀部</p>  
        <p type="p">15:第二彈性件</p>  
        <p type="p">16:固定銷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="344" publication-number="202626019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療關節炎的組合物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR TREATING ARTHRITIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K31/122</main-classification>  
        <further-classification edition="200601120250501B">A61K38/39</further-classification>  
        <further-classification edition="200601120250501B">A61K36/185</further-classification>  
        <further-classification edition="200601120250501B">A61K47/36</further-classification>  
        <further-classification edition="200601120250501B">A61P19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聿健生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUJIAN INTERNATIONAL BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂耀仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YAO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宇珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭至媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊翊鈴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊金昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種用於治療關節炎的組合物，其包含蝦紅素、海藻鈣組合物、膠原蛋白、玻尿酸、果糖硼酸鈣 (calcium fructoborate)、訶子 (Terminalia chebula) 萃取物、及棕櫚果萃取物。本揭露亦關於一種治療關節炎的方法，其包含施予一個體本揭露組合物，以達到舒緩關節炎症狀的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure concerns a composition for treating arthritis. The composition comprises astaxanthin, a seaweed calcium composition, collagen, calcium fructoborate, a &lt;i&gt;Terminalia chebula&lt;/i&gt;extract, and a palm fruit extract. The present disclosure is also related to a method for treating arthritis, comprising administering a composition of the present disclosure to a subject to alleviate a symptom of arthritis.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="345" publication-number="202628538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150057</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器及其伺服器機箱</chinese-title>  
        <english-title>SERVERS AND SERVER CHASSIS THEROF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K7/20</main-classification>  
        <further-classification edition="200601120250418B">H05K7/14</further-classification>  
        <further-classification edition="200601120250418B">H05K7/18</further-classification>  
        <further-classification edition="200601120250418B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技鋼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂嘉宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃進權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種伺服器包括主機板、連接線及伺服器機箱。伺服器機箱包括機箱本體、二導引板及擴充裝置。二導引板分別固定於機箱本體的基板且彼此間隔配置。各導引板具有長邊、短邊及彼此間隔配置的二組裝部。各組裝部包括導槽與第一定位槽。擴充裝置之二側面具有彼此間隔設置的二導引柱，此些導引柱沿延伸方向分別進入導槽，並沿組裝方向固定於第一定位槽，使擴充裝置固定於組裝空間之中。主機板固定於基板上且具有連接器。連接線二端電性連接於連接器及擴充裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server includes a motherboard, a connecting cable and a server chassis. The server chassis includes a chassis body, two guiding plates and an expansion device. The two guiding plates are respectively fixed on a base board of the chassis body and are spaced apart from each other. Each guiding plate has long sides, short sides and two assembling parts spaced apart from each other. Each assembling part includes a guiding groove and a first positioning groove. Two side surfaces of the expansion device have two guiding posts spaced apart from each other. These guiding posts enter the guiding groove along an extension direction and are fixed to the first positioning groove along the assembling direction, so that the expansion device is fixed in an assembling space. The motherboard is fixed on the base board and has connectors. Two ends of the connecting cable are electrically connected to the connector and the expansion device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:伺服器</p>  
        <p type="p">102:伺服器機箱</p>  
        <p type="p">103:風扇模組</p>  
        <p type="p">104:主機板</p>  
        <p type="p">108:機箱本體</p>  
        <p type="p">110,110’:導引板</p>  
        <p type="p">112:擴充裝置</p>  
        <p type="p">114:基板</p>  
        <p type="p">150:側板</p>  
        <p type="p">S1:組裝空間</p>  
        <p type="p">3,10:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="346" publication-number="202628071"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628071.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管道聲波發射器及振幅棒組件</chinese-title>  
        <english-title>PIPELINE ACOUSTIC EMITTER AND TRANSDUCER BAR COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G10K11/22</main-classification>  
        <further-classification edition="200601120250512B">G10K11/26</further-classification>  
        <further-classification edition="200601120250512B">G10K11/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許清淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEU, CHING-IUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡仁德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEAN, REN-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHAO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡曜隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YAO-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種管道聲波發射器包含壓電組件、桿體、套管座、第一彈性件以及振幅棒組件。桿體具有第一端部及第二端部，壓電組件套設於桿體之外，且介於第一端部及第二端部之間；套管座包含套管及基座，基座耦接於套管之一端，套管之另一端套設於第二端部之外；第一彈性件設置於套管之管腔，抵接基座及第二端部；以及振幅棒組件耦接於基座。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pipeline acoustic emitter comprises a piezoelectric component, a rod, a casing seat, an elastic component, and a transducer bar component. The rod has a first end and a second end, with the piezoelectric component sleeved around the rod and positioned between the first end and the second end. The casing seat comprises a casing and a base, with the base coupled to one end of the casing, while the other end of the casing is sleeved around the second end of the rod. The elastic component is positioned in a lumen of the casing, abutting the base and the second end. The transducer bar component is coupled to the base.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:管道聲波發射器</p>  
        <p type="p">1:壓電組件</p>  
        <p type="p">2:調節組件</p>  
        <p type="p">3:振幅棒組件</p>  
        <p type="p">31:振幅棒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="347" publication-number="202627423"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627423.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>即時儲槽粉體傳送狀態辨識系統</chinese-title>  
        <english-title>A REAL-TIME POWDER TRANSFER STATUS IDENTIFICATION SYSTEM FOR STORAGE TANKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">G01F1/66</main-classification>  
        <further-classification edition="200601120250401B">G01F1/68</further-classification>  
        <further-classification edition="201301120250401B">G10L17/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明志科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMOSA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游孟潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉岳峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂振華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳光星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昶任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決減少重複性敲擊確認作業，提升人員效率，並逐步朝智能工廠的目標，本發明提供一種即時儲槽粉體傳送狀態辨識系統，檢測設備，其所包括的準系統連接量測不同物理量的至少一感測器；主控台，連接該檢測設備和辨識系統，並將該準系統傳送的數據透過該辨識系統進行模型訓練以得到預測結果並儲存；人機介面，連接該主控台並呈現該數據及該預測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To reduce repetitive confirmation operations, enhance personnel efficiency, and gradually move towards the goal of a smart factory, this invention provides a real-time powder transfer status identification system for storage tanks. The system includes detection equipment, which comprises a sub-system connected to at least one sensor for measuring different physical quantities; a main console, connected to the detection equipment and the identification system, which processes the data transmitted by the sub-system through the identification system for model training to obtain prediction results and stores them; and a human-machine interface, connected to the main console to display the data and prediction results.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:即時儲槽粉體傳送狀態辨識系統</p>  
        <p type="p">11:檢測設備</p>  
        <p type="p">12:辨識系統</p>  
        <p type="p">13:主控台</p>  
        <p type="p">14:人機介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="348" publication-number="202627579"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627579.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件耦合裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">G02B6/42</main-classification>  
        <further-classification edition="200601120250613B">G02B6/36</further-classification>  
        <further-classification edition="200601120250613B">G02B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉恒惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭育昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種元件耦合裝置，適用於將一光纖陣列元件耦合於一積體電路元件上，並設有：一第一驅動機構；一第二驅動機構，設於該第一驅動機構上，並可受該第一驅動機構驅動作多軸向的直線移動；一保持機構，設於該第二驅動機構上，並可受該第二驅動機構驅動作多軸向的旋轉移動；該保持機構設有可保持該光纖陣列元件的一保持件；藉此改善了先前技術還需另外驅動該積體電路元件配合該光纖陣列元件作移動的缺點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:元件耦合裝置</p>  
        <p type="p">3:第一載台</p>  
        <p type="p">4:第二載台</p>  
        <p type="p">5:塗膠站</p>  
        <p type="p">6:檢查站</p>  
        <p type="p">7:控制單元</p>  
        <p type="p">A:第一驅動機構</p>  
        <p type="p">A1:第一直動組件</p>  
        <p type="p">A11:第一軌座</p>  
        <p type="p">A12:第一滑座</p>  
        <p type="p">A2:第二直動組件</p>  
        <p type="p">A21:第二軌座</p>  
        <p type="p">A22:第二滑座</p>  
        <p type="p">A3:第三直動組件</p>  
        <p type="p">B:第二驅動機構</p>  
        <p type="p">C:保持機構</p>  
        <p type="p">D:檢查機構</p>  
        <p type="p">T:機台</p>  
        <p type="p">W1:光纖陣列元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="349" publication-number="202627575"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627575.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件耦合方法及設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250627B">G02B6/36</main-classification>  
        <further-classification edition="200601120250627B">G02B6/26</further-classification>  
        <further-classification edition="200601120250627B">G02B6/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉恒惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭育昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種元件耦合方法及設備；該元件耦合方法包括：提供一光纖陣列元件，該光纖陣列元件設有一光耦部；提供一積體電路元件，該積體電路元件設有一光子積體電路；使一保持機構保持該光纖陣列元件，並使該光纖陣列元件的該光耦部經一第一膠材黏著於該光子積體電路；使該保持機構繼續保持該光纖陣列元件，並量測傳輸於該光纖陣列元件與該積體電路元件之間的一光訊號的一強度值；使該保持機構繼續保持該光纖陣列元件，並依該強度值調整該光纖陣列元件的姿態直到該強度值落在一預設範圍內後固化該第一膠材；藉此可改善先前技術在該光纖陣列元件與該積體電路元件黏著後無法再調整該光纖陣列元件的姿態的缺點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:量測單元</p>  
        <p type="p">2:元件耦合裝置</p>  
        <p type="p">3:控制單元</p>  
        <p type="p">4:第一載台裝置</p>  
        <p type="p">5:第二載台裝置</p>  
        <p type="p">6:檢測站</p>  
        <p type="p">7:第一軌道裝置</p>  
        <p type="p">8:第二軌道裝置</p>  
        <p type="p">9:元件移載裝置</p>  
        <p type="p">10:塗膠站</p>  
        <p type="p">11:元件耦合設備</p>  
        <p type="p">T:機台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="350" publication-number="202627580"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627580.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件耦合設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G02B6/42</main-classification>  
        <further-classification edition="200601120250418B">G01B11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉恒惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭育昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種元件耦合設備；該元件耦合設備在一機台上設有：一第一載台裝置，設有可承載一積體電路元件的一第一載台；一第二載台裝置，設有可承載一光纖陣列元件的一第二載台；一塗膠站，設有可對該光纖陣列元件塗佈一第一膠材的一第一膠閥；一元件耦合裝置，設有可保持該光纖陣列元件的一保持機構；該保持機構可受驅動而帶動該光纖陣列元件依序在該第二載台、該塗膠站及該第一載台之間移動；藉此不僅可節省驅動膠閥移動至該積體電路元件的機構，也可確保該第一膠材存在於該光纖陣列元件與該積體電路元件之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:元件耦合裝置</p>  
        <p type="p">4:第一載台裝置</p>  
        <p type="p">41:第一載台</p>  
        <p type="p">42:第一旋轉座</p>  
        <p type="p">43:第一載台軌座</p>  
        <p type="p">5:第二載台裝置</p>  
        <p type="p">51:第二載台</p>  
        <p type="p">52:第二載台軌座</p>  
        <p type="p">6:檢測站</p>  
        <p type="p">7:第一軌道裝置</p>  
        <p type="p">71:第一軌道</p>  
        <p type="p">8:第二軌道裝置</p>  
        <p type="p">81:第二軌道</p>  
        <p type="p">9:元件移載裝置</p>  
        <p type="p">91:龍門架</p>  
        <p type="p">92:第一取放機構</p>  
        <p type="p">93:第二取放機構</p>  
        <p type="p">10:塗膠站</p>  
        <p type="p">S1:第一料盤</p>  
        <p type="p">S2:第二料盤</p>  
        <p type="p">W1:光纖陣列元件</p>  
        <p type="p">W2:光纖陣列元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="351" publication-number="202628440"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628440.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具非對稱輻射結構之波導號角的揚聲器系統及其前蓋</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H04R1/32</main-classification>  
        <further-classification edition="200601120250303B">H04R1/34</further-classification>  
        <further-classification edition="200601120250303B">H04R1/40</further-classification>  
        <further-classification edition="200601120250303B">H04R1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗奇諾科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王肇朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王健丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易撰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種具非對稱輻射結構之波導號角的揚聲器系統及其前蓋，且該揚聲器系統包括一低音單體、至少一高音單體與一音箱殼體，其中，該音箱殼體的前側設有一第一安裝孔與至少一波導號角，該第一安裝孔能安裝該低音單體，各該波導號角的喉口能安裝各該高音單體；每一個波導號角分別包含複數個輻射擴散面，以低音單體所處位置的中心點作為參考平面，各該輻射擴散面分別具有一中央截斷線，且各該中央截斷線相對於該參考平面分別具有一投影距離，各該投影距離的長度彼此互不相同，如此，透過該等輻射擴散面彼此不對稱的特徵，能有效地調整該高音單體所產生的聲音音色，與控制聲音的擴散模式，進而能改變其聲音的指向性覆蓋範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:揚聲器系統</p>  
        <p type="p">11:低音單體</p>  
        <p type="p">13:高音單體</p>  
        <p type="p">17:波導號角</p>  
        <p type="p">171:第一輻射擴散面</p>  
        <p type="p">1711:第一號角口邊</p>  
        <p type="p">172:第二輻射擴散面</p>  
        <p type="p">1721:第二號角口邊</p>  
        <p type="p">173:第三輻射擴散面</p>  
        <p type="p">1731:第三號角口邊</p>  
        <p type="p">174:第四輻射擴散面</p>  
        <p type="p">1741:第四號角口邊</p>  
        <p type="p">18:高音啟閉控制部</p>  
        <p type="p">181:高音控制開關</p>  
        <p type="p">19:音色調整部</p>  
        <p type="p">191:音色控制開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="352" publication-number="202627388"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627388.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浸沒式散熱裝置</chinese-title>  
        <english-title>IMMERSION COOLING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250207B">F28D15/02</main-classification>  
        <further-classification edition="200601120250207B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭懿倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖承恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHENG EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種浸沒式散熱裝置，包括：一槽體，具有一容置空間；一冷卻液，填充於該容置空間內；一散熱管路，連接於該槽體之外部，並可循環性將該冷卻液帶離並帶回至該槽體；一發熱設備，浸泡於具有該冷卻液的該容置空間； 以及至少一散熱模組，具有至少一熱管以及一鱗片組，該些熱管之一端連接於該發熱設備，該鱗片組之一面貼覆該些熱管之一端，並該鱗片組沿一方向向外延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an immersion cooling apparatus, comprising: a tank with an accommodating space; a coolant filled within the accommodating space; a cooling pipeline connected to the exterior of the tank, capable of cyclically transporting the coolant away from and back to the tank; a heat-generating device immersed in the accommodating space containing the coolant; and at least one cooling module, which includes at least one heat pipe and a fin assembly. One end of the heat pipe is connected to the heat-generating device, while one side of the fin assembly is attached to the same end of the heat pipe, and the fin assembly extends outward in a single direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:浸沒式散熱裝置</p>  
        <p type="p">10:槽體</p>  
        <p type="p">20:冷卻液</p>  
        <p type="p">30:散熱管路</p>  
        <p type="p">40:發熱設備</p>  
        <p type="p">50:散熱模組</p>  
        <p type="p">60:容置空間</p>  
        <p type="p">70:熱管</p>  
        <p type="p">80:鱗片組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="353" publication-number="202628348"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628348.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>放大器電路</chinese-title>  
        <english-title>AMPLIFIER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F1/30</main-classification>  
        <further-classification edition="200601120250303B">H03F3/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃詩雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種放大器電路具有第一及第二輸入端與第一及第二輸出端，並且包含：第一及第二基於反相器的放大器與第一及第二輸出級。第一基於反相器的放大器具有第三及第四輸出端。第二基於反相器的放大器具有第五及第六輸出端。該第一及第二輸入端為該第一及第二基於反相器的放大器的兩輸入端。該第一及第二基於反相器的放大器分別耦接第一及第二電壓。第一輸出級耦接該第三及第四輸出端，其中，該第一輸出端為該第一輸出級的其中一輸出端。第二輸出級耦接該第五及第六輸出端，其中，該第二輸出端為該第二輸出級的其中一輸出端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An amplifier circuit has a first and a second input terminal and a first and a second output terminal and includes a first and a second inverter-based amplifier and a first and a second output stage. The first inverter-based amplifier has a third and a fourth output terminal. The second inverter-based amplifier has a fifth and a sixth output terminal. The first and the second input terminal are the two input terminals of the first and the second inverter-based amplifier. The first and the second inverter-based amplifier are respectively coupled to a first and a second voltage. The first output stage is coupled to the third and the fourth output terminal. The second output stage is coupled to the fifth and the sixth output terminal. The first and the second output terminals are an output terminal of the first and the second output stages, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:放大器電路</p>  
        <p type="p">110:層疊放大器</p>  
        <p type="p">112,114:基於反相器的放大器</p>  
        <p type="p">120,130:輸出級</p>  
        <p type="p">I1a,I1b,I2a,I2b,Ic:電流</p>  
        <p type="p">MN1,MN2,MN3,MN4:NMOS電晶體</p>  
        <p type="p">MP1,MP2,MP3,MP4:PMOS電晶體</p>  
        <p type="p">N1,N2,N3,N4,Nc:節點</p>  
        <p type="p">V1,V2:電壓</p>  
        <p type="p">V3,V4:中間電壓</p>  
        <p type="p">VIN,VIP:輸入端</p>  
        <p type="p">VON1,VON2,VON3,VOP1,VOP2,VOP3:輸出端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="354" publication-number="202627728"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627728.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫度調節裝置、溫度調節控制方法、電子設備與存儲介質</chinese-title>  
        <english-title>TEMPERATURE ADJUSTMENT DEVICE, TEMPERATURE ADJUSTMENT CONTROL METHOD, ELECTRONIC EQUIPMENT AND STORAGE MEDIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G05D23/27</main-classification>  
        <further-classification edition="200601120250401B">H05B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽程科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USUN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃忠勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUNG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崇聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳信達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIN-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及溫度調節技術領域，提供一種溫度調節裝置、溫度調節控制方法、電子設備與存儲介質。溫度調節裝置包括：本體、隔熱板、溫控板、加熱組件及夾板。隔熱板設有通槽。溫控板內嵌於通槽內。溫控板設有測量孔。加熱組件用於加熱溫控板。夾板用於將加熱組件壓緊於隔熱板上。控制器用於接收測溫儀測量溫控板之測量孔之溫度，以調節加熱組件之加熱功率。溫度調節控制方法包括：獲取溫控板上測量孔之測量溫度；根據測量溫度與預設溫度，調節溫度調節裝置中之加熱組件之加熱功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a technical field of temperature adjustment and provides a temperature adjustment device, a temperature adjustment control method, electronic equipment and storage media. The temperature adjustment device includes: a body, a heat insulation board, a temperature control board, a heating component and a clamping board. The insulation board defines a through slot. The temperature control board is embedded in the through slot, and the temperature control board defines a measuring hole. The heating component is used to heat the temperature control board. The clamping board is used to press the heating component against heat insulation board. A controller is used to receive a temperature measured by a thermometer from the measuring hole of the temperature control board to adjust the heating power of the heating component. In the temperature adjustment control method, a measured temperature of a measuring hole on a temperature control board is obtained. Based the measured temperature and a preset temperature, a heating power of a heating component in the temperature adjusting device is adjusted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:溫度調節裝置</p>  
        <p type="p">11:本體</p>  
        <p type="p">12:隔熱板</p>  
        <p type="p">15:夾板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="355" publication-number="202627802"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627802.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>缺陷搜尋方法與電子裝置</chinese-title>  
        <english-title>DEFECT SEARCHING METHOD AND ELECTRIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F11/00</main-classification>  
        <further-classification edition="201901120250303B">G06F16/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甄　魏珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARCHELINA, JESICA ELIZABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YA TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許雅茵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YA YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出一種缺陷搜尋方法，包含：取得使用者輸入的問題描述；擷取問題描述中的燈光碼，並根據燈光碼搜尋資料庫以得到第一搜尋結果；擷取問題描述中的錯誤碼，並根據錯誤碼搜尋資料庫以得到第二搜尋結果；擷取問題描述中的症狀，並根據症狀搜尋資料庫以得到第三搜尋結果；擷取問題描述中的動作，並根據動作搜尋資料庫以得到第四搜尋結果；以及整合第一搜尋結果、第二搜尋結果、第三搜尋結果以及第四搜尋結果以從資料庫中取得一個項目。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides a defect searching method, including: obtaining an issue description input by a user; extracting a light code from the issue description and searching a database based on the light code to obtain a first search result; extracting an error code from the issue description and searching the database based on the error code to obtain a second search result; extracting a symptom from the issue description and searching the database based on the symptom to obtain a third search result; extracting an action from the issue description and searching the database based on the action to obtain a fourth search result; and integrating the first search result, second search result, third search result, and fourth search result to retrieve an item from the database.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201~210:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="356" publication-number="202626851"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626851.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性化合物與織物</chinese-title>  
        <english-title>HYDROPHILIC COMPOUND AND FABRIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C08G63/91</main-classification>  
        <further-classification edition="200601120250402B">D06M15/51</further-classification>  
        <further-classification edition="200601320250402B">D06M101/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖苡君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃魁彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瑞珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JUI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇稚琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張芬梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FEN-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昌榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHANG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">水性化合物係由酯化的衣康酸與不飽和有機酸或不飽和有機醇經自由基反應而成，其中酯化的衣康酸係由衣康酸與C &lt;sub&gt;4-12&lt;/sub&gt;的直鏈二元醇經酯化反應而成，其中不飽和有機酸係C &lt;sub&gt;n&lt;/sub&gt;H &lt;sub&gt;2n-x&lt;/sub&gt;(COOH) &lt;sub&gt;x&lt;/sub&gt;，其中n為2至8，且x為1至3，其中不飽和有機醇係C &lt;sub&gt;m&lt;/sub&gt;H &lt;sub&gt;2m-y&lt;/sub&gt;(OH) &lt;sub&gt;y&lt;/sub&gt;，其中m為3至8，且y為1至3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hydrophilic compound is formed by reacting an esterified itaconic acid with an unsaturated organic acid or an unsaturated organic alcohol through a free radical reaction, wherein the esterified itaconic acid is formed by reacting the itaconic acid with a C &lt;sub&gt;4-12&lt;/sub&gt;linear diol through an esterification reaction. The unsaturated organic acid is C &lt;sub&gt;n&lt;/sub&gt;H &lt;sub&gt;2n-x&lt;/sub&gt;(COOH) &lt;sub&gt;x&lt;/sub&gt;, wherein n is 2 to 8, and x is 1 to 3. The unsaturated organic alcohol is C &lt;sub&gt;m&lt;/sub&gt;H &lt;sub&gt;2m-y&lt;/sub&gt;(OH) &lt;sub&gt;y&lt;/sub&gt;, wherein m is 3 to 8, and y is 1 to 3.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="357" publication-number="202626416"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626416.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軌道車輛警示系統及警示軌道車輛行駛異常之方法</chinese-title>  
        <english-title>RAIL VEHICLE WARNING SYSTEM AND METHOD OF WARNING RAIL VEHICLE FOR ABNORMAL DRIVING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250226B">B61L27/53</main-classification>  
        <further-classification edition="202201120250226B">B61L27/20</further-classification>  
        <further-classification edition="200601120250226B">B61K9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三商電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCURIES DATA SYSTEMS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭良聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, LIANG SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊文棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, WEN CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軌道車輛警示系統。該軌道車輛警示系統包括：一軌道車輛調度裝置、一調度台及一無線通訊網路。該軌道車輛調度裝置配置於一軌道車輛中並包括一陀螺儀模組及一處理模組，該陀螺儀模組量測該軌道車輛行駛於一軌道上之一向量資訊，該處理模組基於該向量資訊產生一異常訊息。該調度台配置於一固定地點並監控該軌道車輛的一運輸狀態。該調度台經由該無線通訊網路自該軌道車輛調度裝置接收該異常訊息。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rail vehicle warning system. The rail vehicle warning system comprising: a rail vehicle dispatching device, a dispatching console and a wireless communication network. The rail vehicle dispatching device is arranged in a rail vehicle and includes a gyroscope module and a processing module. The gyroscope module measures vector information of the rail vehicle traveling on a track. The processing module generates an abnormal message based on the vector information. The dispatching console is arranged at a fixed location and monitors a transportation status of the rail vehicle. The dispatching console receives the abnormal message from the rail vehicle dispatching device through the wireless communication network.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:中央控制裝置</p>  
        <p type="p">20:調度台</p>  
        <p type="p">40:無線通訊網路</p>  
        <p type="p">50:行動通訊裝置</p>  
        <p type="p">70:軌道車輛調度裝置</p>  
        <p type="p">713:陀螺儀模組</p>  
        <p type="p">714:處理模組</p>  
        <p type="p">TR:軌道車輛</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="358" publication-number="202627961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實時計算保證金的現場可程式化邏輯閘陣列</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250303B">G06Q40/04</main-classification>  
        <further-classification edition="201201120250303B">G06Q40/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皓德盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VSENSE FINTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬席彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>房煒鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高全傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高翊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊皓鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實時計算保證金的現場可程式化邏輯閘陣列，包含一收發單元及一運算單元。該收發單元接受至少一封包，該封包具有複數資料欄位，該些資料欄位可包含一商品行情資料及/或一交易發佈資料。該運算單元記憶有一用戶持倉資料及一保證金程序集，該運算單元由該封包的該些資料欄位至少其中之一擷取位元資料進行運算，該運算單元以該用戶持倉資料或該交易發佈資料為基礎，搭配該商品行情資料進行該保證金程序集的運算，產生一保證金需額，該保證金需額的計算納入一基於該商品行情資料與該用戶持倉資料取得的未實現收益金。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:現場可程式化邏輯閘陣列</p>  
        <p type="p">11:收發單元</p>  
        <p type="p">12:運算單元</p>  
        <p type="p">121:用戶持倉資料</p>  
        <p type="p">122:保證金程序集</p>  
        <p type="p">129:比對程序集</p>  
        <p type="p">20:封包</p>  
        <p type="p">50:用戶終端設備</p>  
        <p type="p">60:集中市場伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="359" publication-number="202627666"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627666.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150118</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>目標圖案以及形成目標圖案的圖案化方法</chinese-title>  
        <english-title>TARGET PATTERN AND PATTERNING METHOD OF FORMING TARGET PATTERN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250926B">G03F1/76</main-classification>  
        <further-classification edition="201201120250926B">G03F1/38</further-classification>  
        <further-classification edition="201201120250926B">G03F1/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的目標圖案包括主圖案以及補償圖案。補償圖案位於主圖案的至少一末端以補償主圖案的圓角化特徵，其中補償圖案具有近似矩形的圖案。本揭露另提供一種目標圖案的圖案化方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A target pattern including a main pattern and a compensation pattern. The compensation pattern is located at least one end of the main pattern to compensate for a rounded feature of the main pattern, wherein the compensation pattern has an approximately rectangular pattern. A patterning method of forming a target pattern is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10、1000:目標圖案</p>  
        <p type="p">10a:主圖案</p>  
        <p type="p">10b:補償圖案</p>  
        <p type="p">10R:圓角化特徵</p>  
        <p type="p">100:間隙壁圖案</p>  
        <p type="p">AA:陣列區</p>  
        <p type="p">CP1:第一核心圖案</p>  
        <p type="p">CP2:第二核心圖案</p>  
        <p type="p">PA:周邊區</p>  
        <p type="p">SP1:第一間隙壁</p>  
        <p type="p">SP2:第二間隙壁</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="360" publication-number="202628099"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628099.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>存取電路及記憶胞電路</chinese-title>  
        <english-title>ACCESS CIRCUIT AND MEMORY CELL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">G11C11/409</main-classification>  
        <further-classification edition="200601120250526B">G11C7/22</further-classification>  
        <further-classification edition="202301120250526B">H10B12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂函庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUE, HANG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種存取電路及記憶胞電路。存取電路包括第一電晶體及第二電晶體。第一電晶體的第一端耦接讀取位元線。第一電晶體的第二端耦接讀取源極線。第二電晶體的第一端耦接寫入位元線。第二電晶體的第二端耦接第一電晶體的閘極端以作為儲存端點。第二電晶體的閘極端耦接寫入字元線。第一電晶體的基極端耦接第一電晶體的閘極端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An access circuit and a memory cell circuit are provided. The access circuit includes a first transistor and a second transistor. A first end of the first transistor is coupled to a read bit-line. A second end of the first transistor is coupled to A read source line. A first end of the second transistor is coupled to a write bit-line. A second end of the second transistor is coupled to a gate terminal of the first transistor to serve as the storage endpoint. A gate terminal of the second transistor is coupled to the write word-line. A base terminal of the first transistor is coupled to the gate terminal of the first transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶胞電路</p>  
        <p type="p">M1:第一電晶體</p>  
        <p type="p">M2:第二電晶體</p>  
        <p type="p">RN1、WN1:第一端</p>  
        <p type="p">RN2、WN2:第二端</p>  
        <p type="p">RNG、WNG:閘極端</p>  
        <p type="p">RNB:基極端</p>  
        <p type="p">SN:儲存端點</p>  
        <p type="p">C1:電容器</p>  
        <p type="p">WWL:寫入字元線</p>  
        <p type="p">WBL:寫入位元線</p>  
        <p type="p">RBL:讀取位元線</p>  
        <p type="p">RSL:讀取源極線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="361" publication-number="202628147"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628147.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵磁感測材料的製造系統以及製造方法</chinese-title>  
        <english-title>MANUFACTURING SYSTEM AND MANUFACTURING METHOD OF FERROMAGNETIC SENSING MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H01F41/02</main-classification>  
        <further-classification edition="200601120250512B">G01R33/12</further-classification>  
        <further-classification edition="200601120250512B">C21D1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張存均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LIANG-JUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭詠仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鐵磁感測材料的製造系統，用以對原始材料加工形成為鐵磁感測材料。鐵磁感測材料的製造系統包括旋轉裝置、工作腔體、承載元件、陣列磁鐵模組、自旋波激發裝置、擋板模組、量測裝置以及控制單元。旋轉裝置包括旋轉軸。承載元件配置於工作腔體的內部空間，用以承載原始材料。陣列磁鐵模組用以提供固定磁場。自旋波激發裝置用以提供高頻磁場自旋波。擋板模組用以改變工作腔體內的電磁波分佈。量測裝置用以量測鐵磁感測材料。控制單元依據反射光束獲得鐵磁感測材料的磁化結果，其中旋轉裝置驅動承載元件以及陣列磁鐵模組旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing system of ferromagnetic sensing materials is adapted to process an original material into a ferromagnetic sensing material. The manufacturing system of ferromagnetic sensing materials includes a rotating device, a working cavity, a carrying element, an array magnet module, a spin wave excitation device, a baffle module, a measuring device and a control unit. The rotating device includes a rotating shaft. The carrying element is arranged in an internal space of the working cavity to carry the original material. The array magnet module is adapted to provide a fixed magnetic field. The spin wave excitation device is adapted to provide a high-frequency magnetic field spin wave. The baffle module is adapted to change an electromagnetic wave distribution in the working cavity. The measuring device is adapted for measuring the ferromagnetic sensing material. The control unit obtains a magnetization result of the ferromagnetic sensing material based on a reflected beam. The rotating device drives the bearing element and the array magnet module to rotate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:原始材料</p>  
        <p type="p">100:鐵磁感測材料的製造系統</p>  
        <p type="p">105:基座</p>  
        <p type="p">110:旋轉裝置</p>  
        <p type="p">112:本體</p>  
        <p type="p">114:旋轉軸</p>  
        <p type="p">120:工作腔體</p>  
        <p type="p">130:承載元件</p>  
        <p type="p">140:陣列磁鐵模組</p>  
        <p type="p">142:旋轉平台</p>  
        <p type="p">144:磁鐵</p>  
        <p type="p">150:自旋波激發裝置</p>  
        <p type="p">160:擋板模組</p>  
        <p type="p">162:遮擋件</p>  
        <p type="p">164:驅動元件</p>  
        <p type="p">170:量測裝置</p>  
        <p type="p">172:第一光源</p>  
        <p type="p">174:第二光源</p>  
        <p type="p">180:控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="362" publication-number="202627847"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627847.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>識別與配對方法與電子裝置</chinese-title>  
        <english-title>METHOD AND ELECTRIC DEVICE FOR IDENTIFICATION AND PAIRING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250303B">G06F21/31</main-classification>  
        <further-classification edition="202301120250303B">G06N3/08</further-classification>  
        <further-classification edition="201901120250303B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APACECORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許萓庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YI TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出一種識別與配對方法，適用於電子裝置。此方法包含：執行註冊程序以建立第一帳號，此註冊程序包含證件驗證程序、手機驗證程序、電子郵件驗證程序、以及網際網路協定位址驗證程序；接收對應於第一帳號的即時照片，並根據即時影像執行照片驗證程序；取得對應第一帳號的個人資訊，並根據此個人資訊計算第一特徵向量；計算第一特徵向量以及對應於第二帳號的第二特徵向量之間的匹配度；以及根據匹配度提供配對資訊給第一帳號和第二帳號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure presents a method for identification and pairing applicable to an electronic device. The method includes: performing a registration process to establish a first account, in which the registration process includes an identity verification process, a mobile phone verification process, an email verification process, and an internet protocol address verification process; receiving a real-time photo corresponding to the first account and performing a photo verification process based on the real-time image; obtaining personal information corresponding to the first account and calculating a first feature vector based on the personal information; calculating a matching degree between the first feature vector and a second feature vector corresponding to a second account; and providing pairing information to the first account and the second account based on the matching degree.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301~305:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="363" publication-number="202628042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面顯示器及其製造方法</chinese-title>  
        <english-title>DUAL-SIDED DISPLAY AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250325B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃景亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉展睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHAN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, JIA-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃書豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇松宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙面顯示器，包括第一基板、電路結構、第一畫素以及第二畫素。電路結構形成於第一基板之上，且包括第一畫素控制電路。第一畫素控制電路包括驅動電晶體及電性連接至驅動電晶體的第一發光控制電晶體與第二發光控制電晶體。第一畫素包括第一發光二極體。第二畫素包括第二發光二極體。第一發光二極體以及第二發光二極體接合至電路結構，且分別電性連接至第一發光控制電晶體及第二發光控制電晶體。第二畫素被配置成使雙面顯示器從第一側發光，且第一畫素被配置成使雙面顯示器從相反於第一側的第二側發光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual-sided display includes a first substrate, a circuit structure, a first pixel, and a second pixel. The circuit structure is formed above the first substrate and includes a first pixel control circuit. The first pixel control circuit includes a driving transistor and first and second light-emission control transistors electrically connected to the driving transistor. The first pixel includes a first light-emitting diode. The second pixel includes a second light-emitting diode. The first light-emitting diode and the second light-emitting diode are bonded to the circuit structure and are electrically connected to the first light-emission control transistor and the second light-emission control transistor, respectively. The second pixel is configured to cause the dual-sided display to emit light from a first side, and the first pixel is configured to cause the dual-sided display to emit light from a second side opposite the first side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:雙面顯示器</p>  
        <p type="p">100:第一基板</p>  
        <p type="p">110:遮蔽層</p>  
        <p type="p">120:緩衝層</p>  
        <p type="p">130:半導體層</p>  
        <p type="p">140:閘介電層</p>  
        <p type="p">150:第一導電層</p>  
        <p type="p">152:閘極</p>  
        <p type="p">154:導電特徵</p>  
        <p type="p">160:介電層</p>  
        <p type="p">170:第二導電層</p>  
        <p type="p">180:層間介電層</p>  
        <p type="p">190:第三導電層</p>  
        <p type="p">192,194:源極/汲極</p>  
        <p type="p">196:導電特徵</p>  
        <p type="p">200:第一平坦化層</p>  
        <p type="p">210:第一絕緣層</p>  
        <p type="p">220:第四導電層</p>  
        <p type="p">230:第二平坦化層</p>  
        <p type="p">240:第二絕緣層</p>  
        <p type="p">250:第五導電層</p>  
        <p type="p">260:第三絕緣層</p>  
        <p type="p">270:第四絕緣層</p>  
        <p type="p">280:第六導電層</p>  
        <p type="p">282:第一接墊</p>  
        <p type="p">284:第二接墊</p>  
        <p type="p">290:第五絕緣層</p>  
        <p type="p">300:第一遮光層</p>  
        <p type="p">300H:第一開口</p>  
        <p type="p">400:第二基板</p>  
        <p type="p">410:第二遮光層</p>  
        <p type="p">410H:第二開口</p>  
        <p type="p">420:隔離結構</p>  
        <p type="p">430:反射層</p>  
        <p type="p">440:封裝層</p>  
        <p type="p">CS:電路結構</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">EMT1:第一電晶體</p>  
        <p type="p">EMT2:第二電晶體</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">LD1:第一發光二極體</p>  
        <p type="p">LD2:第二發光二極體</p>  
        <p type="p">ND:法線方向</p>  
        <p type="p">PC1:第一畫素控制電路</p>  
        <p type="p">PX1:第一畫素</p>  
        <p type="p">PX2:第二畫素</p>  
        <p type="p">S1,S2:距離</p>  
        <p type="p">TR:透明區</p>  
        <p type="p">X1:第一側</p>  
        <p type="p">X2:第二側</p>  
        <p type="p">θ:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="364" publication-number="202628730"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628730.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面顯示器</chinese-title>  
        <english-title>DUAL-SIDED DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250107B">H10H29/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃景亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, JIA-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃書豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇松宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙面顯示器，包括第一基板、第二基板、電路結構、反射層、多個第一畫素、多個第二畫素以及隔離結構。第二基板重疊於第一基板。電路結構以及反射層分別形成於第一基板以及第二基板之上。各第一畫素包括接合至電路結構的第一發光二極體。電路結構被配置成至少部分遮蔽第一發光二極體朝第一基板發出的光線。各第二畫素包括接合至電路結構的第二發光二極體。反射層被配置成反射第二發光二極體朝第二基板發出的光線。隔離結構形成於第二基板之上。第一畫素以及第二畫素被隔離結構環繞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual-sided display includes a first substrate, a second substrate, a circuit structure, a reflective layer, first pixels, second pixels and an isolation structure. The second substrate overlaps the first substrate. The circuit structure and the reflective layer are formed above the first substrate and the second substrate respectively. Each first pixel includes a first light emitting diode bonded to the circuit structure. The circuit structure is configured to at least partially block light emitted by the first light emitting diode toward the first substrate. Each second pixel includes a second light emitting diode bonded to the circuit structure. The reflective layer is configured to reflect light emitted by the second light emitting diode toward the second substrate. An isolation structure is formed above the second substrate. The first pixels and the second pixels are surrounded by isolation structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:雙面顯示器</p>  
        <p type="p">100:第一基板</p>  
        <p type="p">110:遮蔽層</p>  
        <p type="p">120:緩衝層</p>  
        <p type="p">130:半導體層</p>  
        <p type="p">140:閘介電層</p>  
        <p type="p">150:第一導電層</p>  
        <p type="p">152:閘極</p>  
        <p type="p">154:導電特徵</p>  
        <p type="p">160:介電層</p>  
        <p type="p">170:第二導電層</p>  
        <p type="p">180:層間介電層</p>  
        <p type="p">190:第三導電層</p>  
        <p type="p">192,194:源極/汲極</p>  
        <p type="p">196:導電特徵</p>  
        <p type="p">200:第一平坦化層</p>  
        <p type="p">210:第一絕緣層</p>  
        <p type="p">220:第四導電層</p>  
        <p type="p">230:第二平坦化層</p>  
        <p type="p">240:第二絕緣層</p>  
        <p type="p">250:第五導電層</p>  
        <p type="p">260:第三絕緣層</p>  
        <p type="p">270:第四絕緣層</p>  
        <p type="p">280:第六導電層</p>  
        <p type="p">282:第一接墊</p>  
        <p type="p">284:第二接墊</p>  
        <p type="p">290:第五絕緣層</p>  
        <p type="p">300:第一遮光層</p>  
        <p type="p">300H:第一開口</p>  
        <p type="p">400:第二基板</p>  
        <p type="p">410:第二遮光層</p>  
        <p type="p">410H:第二開口</p>  
        <p type="p">420:隔離結構</p>  
        <p type="p">430:反射層</p>  
        <p type="p">440:封裝層</p>  
        <p type="p">CS:電路結構</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">EMT1:第一電晶體</p>  
        <p type="p">EMT2:第二電晶體</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">LD1:第一發光二極體</p>  
        <p type="p">LD2:第二發光二極體</p>  
        <p type="p">ND:法線方向</p>  
        <p type="p">PC1:第一畫素控制電路</p>  
        <p type="p">PC2:第二畫素控制電路</p>  
        <p type="p">PX1:第一畫素</p>  
        <p type="p">PX2:第二畫素</p>  
        <p type="p">S1,S2:距離</p>  
        <p type="p">TR:透明區</p>  
        <p type="p">X1:第一側</p>  
        <p type="p">X2:第二側</p>  
        <p type="p">θ:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="365" publication-number="202628739"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628739.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其製造方法</chinese-title>  
        <english-title>DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250324B">H10H29/49</main-classification>  
        <further-classification edition="202501120250324B">H10H29/80</further-classification>  
        <further-classification edition="202501120250324B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂智文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIH-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊皓安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, HAO-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括驅動背板、多個發光元件及多個殘膠結構。多個發光元件接合至驅動背板。每一殘膠結構覆蓋對應的一個發光元件的側壁的至少一部分。在顯示裝置的俯視圖中，殘膠結構具有超出發光元件的邊緣，且邊緣呈不規則狀。此外，上述顯示裝置的製造方法也被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus includes a driving backplane, light-emitting elements and residual glue structures. The light emitting elements are bonded to the driving backplane. Each of the residual glue structures covers at least one portion of a side wall of a corresponding light-emitting element. In a top view of the display apparatus, a residual glue structure has an edge beyond a light-emitting element, and the edge is irregular. In addition, a manufacturing method of the display apparatus is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:發光元件</p>  
        <p type="p">142:殘膠結構</p>  
        <p type="p">142s:表面</p>  
        <p type="p">150:焊料</p>  
        <p type="p">210:驅動背板</p>  
        <p type="p">212:接墊</p>  
        <p type="p">220:成型層</p>  
        <p type="p">DP:顯示裝置</p>  
        <p type="p">G212:接墊組</p>  
        <p type="p">T220、t220:厚度</p>  
        <p type="p">z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="366" publication-number="202627420"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627420.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學編碼器、伺服馬達及光學編碼器的定位方法</chinese-title>  
        <english-title>OPTICAL ENCODER, SERVO MOTOR AND POSITIONING METHOD OF OPTICAL ENCODER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G01D5/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宏洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HORNG-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林良偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LIANG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡侑樵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YOU-CHYAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂杰鍠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIEH-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學編碼器包括：碼盤單元，包括N個第一單位圖紋彼此陣列排列，各第一單位圖紋包括高反射區及低反射區；光學感測單元，包括發光元件及第一感測區，第一感測區鄰設於發光元件並包括複數第一單位感測圖紋彼此陣列排列，各第一單位感測圖紋包括複數第一弦波輪廓曲線；及處理單元，與光學感測單元電性連接。發光元件發射光線至第一單位圖紋，第一單位圖紋反射光線並產生第一反射光線射至具有第一弦波輪廓曲線的第一單位感測圖紋，第一單位感測圖紋依據第一反射光線產生複數第一感測訊號，處理單元將該些第一感測訊號轉換為位置資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical encoder includes: a code disc unit, including N first unit patterns arranged in an array with one another, each first unit pattern including a high reflection area and a low reflection area; an optical sensing unit, including a light emitting element and a first sensing area, the first sensing area disposed adjacently to the light emitting element and including a plurality of first unit sensing patterns arranged in an array with one another, each first unit sensing pattern including a plurality of first sine wave outline curves; and a processing unit, electrically connected to the optical sensing unit. The light emitting element emits a light to the first unit patterns. The first unit patterns reflect the light and produce a first reflected light onto the first unit sensing patterns which have the first sine wave outline curves. The first unit sensing patterns generate a plurality of first sensing signals based on the first reflected light. The processing unit converts the first sensing signals into a position information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學編碼器</p>  
        <p type="p">11:碼盤單元</p>  
        <p type="p">12:光學感測單元</p>  
        <p type="p">120:發光元件</p>  
        <p type="p">13:處理單元</p>  
        <p type="p">C:轉軸</p>  
        <p type="p">LT:光線</p>  
        <p type="p">R1:第一反射光線</p>  
        <p type="p">R2:第二反射光線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="367" publication-number="202628398"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628398.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三層式人工智慧檢測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L43/02</main-classification>  
        <further-classification edition="202201120250303B">H04L43/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皓博科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARBOR TECHNOLOGY SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂宏益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HUNG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種三層式人工智慧檢測系統，包含至少一感測器、一閘道器、一伺服平台，該感測器用以感測一設備並獲得該設備之感測訊號資料，該感測器包含一第一人工智慧模組、一第一通訊模組，該閘道器包含一第二人工智慧模組、一第二通訊模組，該伺服平台包含一第三人工智慧模組、一資料儲存管理模組、一第三通訊模組，該感測器、該閘道器、該伺服平台藉由第一、第二、第三通訊模組相互溝通。藉由多層式之人工智慧技術手段對所接收的檢測資料及相關程式來分層處理、管理、執行，可具有的效益：分散式分層處理、效率高、速度快、成本低、開發容易、可持續自動學習並更新人工智慧模型、可即時同步處理大量數據資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:感測器</p>  
        <p type="p">11:第一人工智慧模組</p>  
        <p type="p">12:第一通訊模組</p>  
        <p type="p">20:閘道器</p>  
        <p type="p">21:第二人工智慧模組</p>  
        <p type="p">22:第二通訊模組</p>  
        <p type="p">30:伺服平台</p>  
        <p type="p">31:第三人工智慧模組</p>  
        <p type="p">32:資料儲存管理模組</p>  
        <p type="p">33:第三通訊模組</p>  
        <p type="p">40:設備</p>  
        <p type="p">50:異常警報系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="368" publication-number="202628128"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628128.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腦中風AI輔助判讀系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250422B">G16H50/20</main-classification>  
        <further-classification edition="201801120250422B">G16H30/40</further-classification>  
        <further-classification edition="202301120250422B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長佳智能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVER FORTUNE.AI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王帝皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種腦中風AI輔助判讀系統，係架設於一終端裝置，該終端裝置具有一用戶介面，還包括一影像擷取模組用以接收患者的電腦斷層掃描和/或磁振造影的醫學影像數據，對醫學影像數據進行影像預處理的影像預處理模組，將影像預處理後的醫學影像數據輸入基於深度學習架構經由中風相關的CT和MRI醫學影像數據集訓練而成的人工智慧引擎，檢測和分類中風相關特徵產生一分析結果，再由結果生成模組以分析結果生成一診斷結果顯示於該用戶介面；以能處理多模態數據的AI系統對患者的醫學影像數據進行分析，輔助使用者於臨床環境中進行更快速、準確和客觀的中風診斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:腦中風AI輔助判讀系統</p>  
        <p type="p">10:影像擷取模組</p>  
        <p type="p">20:影像預處理模組</p>  
        <p type="p">30:人工智慧引擎</p>  
        <p type="p">40:結果生成模組</p>  
        <p type="p">50:反饋模組</p>  
        <p type="p">A:醫學影像數據</p>  
        <p type="p">A1:終端裝置</p>  
        <p type="p">A2:用戶介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="369" publication-number="202626174"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626174.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸附式管膜化學濾網裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">B01D53/04</main-classification>  
        <further-classification edition="202201120250325B">B01D46/12</further-classification>  
        <further-classification edition="200601120250325B">B01J20/02</further-classification>  
        <further-classification edition="200601120250325B">B01J20/22</further-classification>  
        <further-classification edition="200601120250325B">B01J20/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華懋科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海華懋環保節能設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扶亞民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張淑婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種吸附式管膜化學濾網裝置，主要是用以處理空氣中的微分子污染物(AMC)，並透過一框體及至少一組膜塊的組合設計，該組膜塊係設於該框體內，而該組膜塊係由至少二以上片膜塊所排列組成，並於該片膜塊與該片膜塊之間係設有一流通道，且每一片膜塊係由複數根管式膜吸附材組成，而該管式膜吸附材係設有複數孔通道，該複數孔通道係相通該流通道，讓該空氣中的微分子污染物(AMC)的氣流能經由該流通道進入該管式膜吸附材之複數孔通道內，並沿該管式膜吸附材之複數孔通道方向流動，以提高化學濾網之吸附容量，並能兼顧性能效率、壓損與使用壽命，同時符合先進半導體產業的奈米製程廠之需求規格。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:框體</p>  
        <p type="p">11:第一邊</p>  
        <p type="p">111:突出部</p>  
        <p type="p">112:第一邊流通道</p>  
        <p type="p">12:第二邊</p>  
        <p type="p">121:突出部</p>  
        <p type="p">122:第二邊流通道</p>  
        <p type="p">13:第三邊</p>  
        <p type="p">14:第四邊</p>  
        <p type="p">30:管式膜吸附材</p>  
        <p type="p">80:組膜塊</p>  
        <p type="p">81:第一片膜塊</p>  
        <p type="p">82:第二片膜塊</p>  
        <p type="p">83:第三片膜塊</p>  
        <p type="p">84:第四片膜塊</p>  
        <p type="p">85:第一中流通道</p>  
        <p type="p">86:第二中流通道</p>  
        <p type="p">87:第三中流通道</p>  
        <p type="p">91:第一中擋板</p>  
        <p type="p">92:第二中擋板</p>  
        <p type="p">93:第三中擋板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="370" publication-number="202627384"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627384.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浸沒式冷卻裝置</chinese-title>  
        <english-title>IMMERSION COOLING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">F28D1/02</main-classification>  
        <further-classification edition="200601120250320B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭懿倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖承恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHENG EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種浸沒式冷卻裝置，包括有一槽體，具有一容置空間；一冷卻液，填充於該容置空間內；一電路板，浸泡於具有該冷卻液的該容置空間，該電路板之一部分設置一發熱元件；一散熱管路，連接該槽體之外部，並可循環性將該冷卻液帶離並帶回至該槽體；以及一噴流部件，設置於該容置空間並鄰近該電路板，該噴流部件具有一基部以及至少一出水口，該基部沿該發熱元件之方向而連接該些出水口。該噴流部件的該些出水口朝向該發熱元件之方向噴射一水流方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention presents an immersion cooling apparatus that comprises a tank body with an accommodation space; a cooling liquid filled in the accommodation space; and a circuit board immersed in the accommodation space with the cooling liquid. A portion of the circuit board is provided with a heating element; a heat dissipation pipe is connected to the exterior of the tank, allowing for the cyclical removal of the cooling liquid and its return to the tank; and a jet component is arranged in the accommodation space, adjacent to the circuit board, the jet component has a base and at least one water outlet, and the base connected to the water outlets along the direction of the heating element. The water outlets of the jet component direct a flow of water toward the heating element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:槽體</p>  
        <p type="p">20:冷卻液</p>  
        <p type="p">30:電路板</p>  
        <p type="p">40:散熱管路</p>  
        <p type="p">50:噴流部件</p>  
        <p type="p">60:容置空間</p>  
        <p type="p">70:發熱元件</p>  
        <p type="p">80:基部</p>  
        <p type="p">90:出水口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="371" publication-number="202627385"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627385.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兩相浸沒式散熱結構</chinese-title>  
        <english-title>TWO-PHASE IMMERSED HEAT DISSIPATION STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">F28D1/02</main-classification>  
        <further-classification edition="200601120260302B">G06F1/20</further-classification>  
        <further-classification edition="202601120260302B">H10W40/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭懿倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖承恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHENG EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種兩相浸沒式散熱結構，包括有一電路板以及一沸騰器板。電路板，具有一第一表面以及一第二表面，該第一表面被設置有一發熱元件。以及沸騰器板，具有一第三表面以及一第四表面，該第三表面接觸該電路板的該發熱元件，並該第三表面上具有一導熱結構，該第四表面具有一沸騰結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention presents a two-phase immersed heat dissipation structure, which includes a circuit board and a boiler plate. The circuit board has a first surface and a second surface, and the first surface is equipped with a heating element. The boiler plate has a third surface and a fourth surface; the third surface contacts the heating element of the circuit board, and has a thermal conductive structure on the third surface, and the fourth surface has a boiling structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電路板</p>  
        <p type="p">20:沸騰器板</p>  
        <p type="p">30:第一表面</p>  
        <p type="p">40:第二表面</p>  
        <p type="p">50:發熱元件</p>  
        <p type="p">60:第三表面</p>  
        <p type="p">70:第四表面</p>  
        <p type="p">80:導熱結構</p>  
        <p type="p">90:沸騰結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="372" publication-number="202626953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯組成物及其製品</chinese-title>  
        <english-title>POLYESTER COMPOSITION AND ARTICLES MADE THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250107B">C08L67/03</main-classification>  
        <further-classification edition="200601120250107B">C08L69/00</further-classification>  
        <further-classification edition="200601120250107B">C08K5/521</further-classification>  
        <further-classification edition="200601120250107B">C08K5/109</further-classification>  
        <further-classification edition="200601120250107B">C08K5/101</further-classification>  
        <further-classification edition="200601120250107B">B29C45/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉騏瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, CI SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚酯組成物，以聚酯組成物的總重量計，聚酯組成物包括10重量%至40重量%的聚對苯二甲酸乙二酯；40重量%至50重量%的聚碳酸酯；8重量%至18重量%的阻燃劑；5重量%至15重量%的增韌劑；以及0.5重量%至3重量%的加工助劑。本發明還提供一種聚酯組成物的製品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a polyester composition. The polyester composition includes 10 wt% to 40 wt% of polyethylene terephthalate, 40 wt% to 50 wt% of polycarbonate, 8 wt% to 18 wt% of a flame retardant, 5 wt% to 15 wt% of a toughening agent, and 0.5 wt% to 3 wt% of processing aids, based on a total weight of the polyester composition. An article made from the polyester composition is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="373" publication-number="202626912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF POLYESTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">C08J11/28</main-classification>  
        <further-classification edition="200601120250108B">C08G63/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃呈水</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG-SHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張夢臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MONG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章鑑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHANG-JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚酯的製造方法，包括提供回收材料、乙二醇與觸媒，其中所述回收材料包括聚對苯二甲酸乙二酯；使用回收材料、乙二醇與觸媒執行解聚步驟，以獲得對苯二甲酸雙羥乙酯粗產物；使用對苯二甲酸雙羥乙酯粗產物執行純化步驟，以獲得對苯二甲酸雙羥乙酯單體；提供含磷單體；以及使用對苯二甲酸雙羥乙酯單體與含磷單體執行酯化步驟與聚合步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a polyester includes: providing a recycled material, ethylene glycol, and a catalyst, wherein the recycled materials include PET; using the recycled material, the ethylene glycol and the catalyst to perform a depolymerization step to obtain BHET crude product; performing a purification step using the BHET crude product to obtain BHET monomer; providing a phosphorus-containing monomer; and using the BHET monomer and the phosphorus-containing monomer to perform the esterification step and the polymerization step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110、S120、S130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="374" publication-number="202626913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF POLYESTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250107B">C08J11/28</main-classification>  
        <further-classification edition="200601120250107B">C08G63/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃呈水</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG-SHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章鑑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHANG-JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張夢臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MONG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚酯的製造方法，包括提供第一回收材料、第二回收材料、乙二醇與含磷單體，其中所述第一回收材料包括聚對苯二甲酸乙二酯，且所述第二回收材料包括對苯二甲酸雙羥乙酯、聚對苯二甲酸乙二酯二聚體、聚對苯二甲酸乙二酯三聚體、單(2-羥乙基)對苯二甲酸或其組合；使用第一回收材料、第二回收材料、乙二醇與含磷單體執行解聚與單體鍵結步驟，以獲得含磷單體的聚對苯二甲酸乙二酯寡聚物；提供觸媒；以及使用含磷單體的聚對苯二甲酸乙二酯寡聚物與所述觸媒執行共聚合步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a polyester includes: providing a first recycled material, a second recycled material, an ethylene glycol and a phosphorus-containing monomer, wherein the first recycled material includes PET, and the second recycled material includes BHET, polyethylene terephthalate dimer, polyethylene terephthalate trimer, mono(2-hydroxyethyl)terephthalic acid, or combinations thereof; using the first recycled material, the second recycled material, the ethylene glycol and the phosphorus-containing monomer to perform a depolymerization and monomer bonding step to obtain polyethylene terephthalate containing phosphorus monomer oligomer; providing a catalyst; and performing a copolymerization step using the polyethylene terephthalate containing phosphorus monomer oligomer and the phosphorus-containing monomer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110、S120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="375" publication-number="202628469"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628469.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊裝置與資料傳輸方法</chinese-title>  
        <english-title>COMMUNICATION DEVICE AND DATA TRANSMISSION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250303B">H04W76/10</main-classification>  
        <further-classification edition="200901120250303B">H04W88/02</further-classification>  
        <further-classification edition="200901120250303B">H04W88/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳定緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, DING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林逸文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通訊裝置包括一無線通訊模組與一處理器。無線通訊模組用以傳送或接收複數無線訊號，並且提供一熱點。無線通訊模組自一同級通訊裝置接收請求連線至熱點之一連線請求，並且響應於連線請求與同級通訊裝置建立一無線連接。處理器耦接至無線通訊模組，並且控制通訊裝置之運作。處理器在無線連接被成功建立之後，利用一強制入口機制透過無線通訊模組傳送一下載連結之相關資訊至同級通訊裝置，並且響應於接收自同級通訊裝置之一下載請求，處理器透過無線通訊模組將一既定資料傳送至同級通訊裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication device includes a wireless communication module and a processor. The wireless communication module transmits or receives multiple wireless signals, and provides a hotspot. The wireless communication module receives a connection request from a peer communication device to request to connect to the hotspot and establishes a wireless connection with the peer communication device in response to the connection request. The processor is coupled to the wireless communication module and controls operations of the communication device. After the wireless connection has been successfully established, the processor uses a captive portal mechanism to transmit information regarding a download link to the peer communication device through the wireless communication module, and in response to a download request received from the peer communication device, the processor transmits predetermined data to the peer communication device through the wireless communication module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:資料傳輸系統</p>  
        <p type="p">100,200:通訊裝置</p>  
        <p type="p">110,210:處理器</p>  
        <p type="p">120,220:無線通訊模組</p>  
        <p type="p">230:強制入口模組</p>  
        <p type="p">240:網頁伺服器模組</p>  
        <p type="p">150,250:記憶體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="376" publication-number="202627720"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627720.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>設備異常檢測系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR EQUIPMENT ANOMALY DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G05B23/02</main-classification>  
        <further-classification edition="201901120250303B">G06N20/00</further-classification>  
        <further-classification edition="202301120250303B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李日傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煒祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳民融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MIN-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-CHIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種設備異常檢測方法，執行於電腦系統，設備異常檢測方法包含：取得待測設備之待測訊號，及將待測訊號轉換為待測訊號影像；基於待測訊號影像，使用第一分類模型判斷待測設備為正常或異常；以及響應於判斷待測設備為異常，基於待測訊號影像，使用第二分類模型判斷待測設備的異常類別。第一分類模型是使用待測設備的複數個正常訊號影像所訓練的單類別分類器。第二分類模型以正常訊號影像、複數個異常訊號影像及複數個模擬異常訊號影像進行訓練。模擬異常訊號影像是使用生成模型基於正常訊號影像及異常訊號影像所生成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for equipment anomaly detection is provided. The method is executed by a computer system and includes obtaining a test signal from a test equipment, and convert the test signal to a test-signal image. The method further includes applying a first classification model to determine whether the test equipment is normal or abnormal based on the test-signal image, applying a second classification model to determine an anomaly class for the test equipment. The first classification model is a one-class classifier trained using multiple normal-signal images. The second classification model is trained using the normal-signal images, multiple abnormal-signal images and multiple simulated abnormal-signal images. The simulated abnormal-signal images are generated by a generative model based on the normal-signal images and the abnormal-signal images.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23:第一分類模型</p>  
        <p type="p">24:第二分類模型</p>  
        <p type="p">30:訓練階段</p>  
        <p type="p">31:正常訊號影像</p>  
        <p type="p">32:異常訊號影像</p>  
        <p type="p">33:生成模型</p>  
        <p type="p">34:模擬異常訊號影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="377" publication-number="202628026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素陣列基板及其驅動方法</chinese-title>  
        <english-title>PIXEL ARRAY SUBSTRATE AND DRIVING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G09F9/30</main-classification>  
        <further-classification edition="200601120250801B">G09G3/30</further-classification>  
        <further-classification edition="200601120250801B">G09G3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林城興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅睿騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, JUI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素陣列基板，包括多個畫素電路、多條資料線、第一重置控制訊號線以及第一發光控制訊號線。各畫素電路包括重置電路、寫入電路、發光控制電路以及發光二極體。資料線沿著第一方向延伸，且電性連接至畫素電路。第一重置控制訊號線沿著第一方向延伸，且電性連接至畫素電路中的第一多者的重置電路。畫素電路中的第一多者沿著第一方向排成兩列以上。第一發光控制訊號線沿著第一方向延伸，且電性連接至畫素電路中的第一多者的發光控制電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel array substrate includes pixel circuits, data lines, a first reset control signal line and a first light-emitting control signal line. Each pixel circuit includes a reset circuit, a writing circuit, a light-emitting control circuit and a light-emitting diode. The data lines extend along a first direction and are electrically connected to the pixel circuits. The first reset control signal line extends along the first direction and is electrically connected to the reset circuits of a first plurality of pixel circuits. The first plurality of the pixel circuits is arranged in two or more rows along the first direction. The first light-emitting control signal line extends along the first direction and is electrically connected to the light-emitting control circuits of the first plurality of the pixel circuits.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:縱向訊號線</p>  
        <p type="p">310:第一傳輸線</p>  
        <p type="p">320:第二傳輸線</p>  
        <p type="p">322:閘極訊號線</p>  
        <p type="p">324:寫入控制訊號線</p>  
        <p type="p">400:橫向訊號線</p>  
        <p type="p">410:電壓訊號線</p>  
        <p type="p">420:訊號輸出線</p>  
        <p type="p">422:閘極線</p>  
        <p type="p">424:掃描線</p>  
        <p type="p">AT:測試電壓訊號線</p>  
        <p type="p">AP:開口區</p>  
        <p type="p">CR:線路布局區</p>  
        <p type="p">CS:導電結構</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">data:資料線</p>  
        <p type="p">EM_H:發光訊號線</p>  
        <p type="p">EM_V:發光控制訊號線</p>  
        <p type="p">ini:起始電壓訊號線</p>  
        <p type="p">PX:畫素結構</p>  
        <p type="p">RS_H:重置訊號線</p>  
        <p type="p">RS_V:重置控制訊號線</p>  
        <p type="p">ref_V:縱向參考電壓訊號線</p>  
        <p type="p">ref_H:橫向參考電壓訊號線</p>  
        <p type="p">SPR,SPG,SPB:畫素電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="378" publication-number="202628244"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628244.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150168</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊裝置</chinese-title>  
        <english-title>COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H01Q1/48</main-classification>  
        <further-classification edition="200601120250303B">H01Q1/22</further-classification>  
        <further-classification edition="200601120250303B">H01Q1/38</further-classification>  
        <further-classification edition="200601120250303B">H01Q9/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張竑琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林軍毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通訊裝置，包括：一接地面、一天線結構、一電纜線、一連接金屬部，以及一介質基板。天線結構具有一饋入點。電纜線包括一饋入導體和一接地導體，其中饋入導體係耦接至饋入點，而接地導體包括一第一導電區域和一第二導電區域。連接金屬部係耦接於接地導體之第一導電區域和第二導電區域之間。天線結構和連接金屬部皆設置於介質基板上。電纜線係鄰近於接地面，其中無論是接地導體之第一導電區域或第二導電區域均未耦接至接地面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication device includes a ground plane, an antenna structure, a cable, a connection metal element, and a dielectric substrate. The antenna structure has a feeding point. The cable includes a feeding conductor and a grounding conductor. The feeding conductor is coupled to the feeding point. The grounding conductor includes a first conductive region and a second conductive region. The connection metal element is coupled between the first conductive region and the second conductive region of the grounding conductor. The antenna structure and the connection metal element are disposed on the dielectric substrate. The cable is adjacent to the ground plane. Neither the first conductive region nor the second conductive region of the grounding conductor is coupled to the ground plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:通訊裝置</p>  
        <p type="p">110:接地面</p>  
        <p type="p">120:電纜線</p>  
        <p type="p">121:饋入導體</p>  
        <p type="p">125:接地導體</p>  
        <p type="p">126:第一導電區域</p>  
        <p type="p">127:第二導電區域</p>  
        <p type="p">128:非導體外皮元件</p>  
        <p type="p">130:連接金屬部</p>  
        <p type="p">131:連接金屬部之第一端</p>  
        <p type="p">132:連接金屬部之第二端</p>  
        <p type="p">140:天線結構</p>  
        <p type="p">150:饋入輻射部</p>  
        <p type="p">151:饋入輻射部之第一端</p>  
        <p type="p">152:饋入輻射部之第二端</p>  
        <p type="p">155:饋入輻射部之三角形增寬部份</p>  
        <p type="p">160:第一輻射部</p>  
        <p type="p">161:第一輻射部之第一端</p>  
        <p type="p">162:第一輻射部之第二端</p>  
        <p type="p">170:第二輻射部</p>  
        <p type="p">171:第二輻射部之第一端</p>  
        <p type="p">172:第二輻射部之第二端</p>  
        <p type="p">180:短路輻射部</p>  
        <p type="p">181:短路輻射部之第一端</p>  
        <p type="p">182:短路輻射部之第二端</p>  
        <p type="p">185:短路輻射部之矩形增寬部份</p>  
        <p type="p">190:介質基板</p>  
        <p type="p">199:信號源</p>  
        <p type="p">FP:饋入點</p>  
        <p type="p">GC1:第一間隙</p>  
        <p type="p">GC2:第二間隙</p>  
        <p type="p">L1,L2,L3:長度</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="379" publication-number="202628080"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628080.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理心音訊號的方法、計算機裝置、系統、非暫時性電腦可讀取記錄媒體以及電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">G10L25/30</main-classification>  
        <further-classification edition="201301120250401B">G10L25/27</further-classification>  
        <further-classification edition="200601120250401B">A61B7/02</further-classification>  
        <further-classification edition="200601120250401B">A61B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麗臺生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEADTEK BIOMED INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣易翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佩寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEI-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種用於處理心音訊號的方法，其係經由計算機裝置載入並執行電腦程式產品之後而被執行。所述方法包含以下步驟：接收原始心音時域訊號；針對原始心音時域訊號進行訊號前處理操作，並基於原始心音時域訊號來產生前處理心音時頻訊號，其中訊號前處理操作包括連續小波轉換操作；將前處理心音時頻訊號輸入至生成式對抗網路模型；透過生成式對抗網路模型，基於前處理心音時頻訊號來產生及輸出純心音時頻訊號和噪音時頻訊號；以及分別針對純心音時頻訊號和噪音時頻訊號進行訊號後處理操作，並基於純心音時頻訊號和噪音時頻訊號來分別產生純心音時域訊號和噪音時域訊號，其中訊號後處理操作包括逆向連續小波轉換操作；其中，生成式對抗網路模型具有生成器和鑑別器，並且生成式對抗網路模型係透過純心音訊號資料集和噪音訊號資料集而被訓練。藉此，所述方法能適用於處理心音訊號，並解決使用者無法完全地去除噪音訊號而取得純心音訊號的問題。另，一種用於處理心音訊號的計算機裝置、系統、非暫時性電腦可讀取記錄媒體以及電腦程式產品亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S610、S620:步驟</p>  
        <p type="p">S630、S640:步驟</p>  
        <p type="p">S650A、S650B:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="380" publication-number="202627897"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於訓練生成式對抗網路模型的方法、計算機裝置、非暫時性電腦可讀取記錄媒體以及電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06N3/094</main-classification>  
        <further-classification edition="201901120250401B">G06N20/00</further-classification>  
        <further-classification edition="201301120250401B">G10L25/30</further-classification>  
        <further-classification edition="201301120250401B">G10L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麗臺生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEADTEK BIOMED INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣易翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佩寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEI-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種用於訓練生成式對抗網路模型的方法，其係經由計算機裝置載入並執行電腦程式產品之後而被執行。所述方法包含以下訓練步驟：接收純心音訓練時域訊號和噪音訓練時域訊號；將純心音訓練時域訊號和噪音訓練時域訊號合成為合成訓練時域訊號；分別針對純心音訓練時域訊號、噪音訓練時域訊號和合成訓練時域訊號進行連續小波轉換操作，以基於純心音訓練時域訊號、噪音訓練時域訊號和合成訓練時域訊號而分別產生純心音訓練時頻訊號、噪音訓練時頻訊號和合成訓練時頻訊號；以及將純心音訓練時頻訊號、噪音訓練時頻訊號和合成訓練時頻訊號輸入至生成式對抗網路模型，並透過生成式對抗網路模型執行下列的訓練子步驟：透過生成器，基於合成訓練時頻訊號來分別產生純心音生成時頻訊號和噪音生成時頻訊號；將純心音生成時頻訊號和噪音生成時頻訊號合併成合併生成時頻訊號；透過鑑別器，將合併生成時頻訊號與合成訓練時頻訊號進行差異性比較，並產生第一損失函數；將純心音生成時頻訊號與純心音訓練時頻訊號進行差異性比較以及將噪音生成時頻訊號與噪音訓練時頻訊號進行差異性比較，並產生第二損失函數；及將第一損失函數和第二損失函數反饋至生成器，並基於第一損失函數和第二損失函數來更新生成器的權重值。藉此，所述方法能適用於訓練生成式對抗網路模型，並解決生成式對抗網路模型的訓練成效有限的問題。另，一種用於訓練生成式對抗網路模型的計算機裝置、非暫時性電腦可讀取記錄媒體以及電腦程式產品亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210、S220、S230:訓練步驟</p>  
        <p type="p">S240、S250、S260:訓練步驟</p>  
        <p type="p">S270、S280:訓練步驟</p>  
        <p type="p">S281、S282、S283:訓練子步驟</p>  
        <p type="p">S284、S285:訓練子步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="381" publication-number="202627815"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627815.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲存裝置及其操作方法</chinese-title>  
        <english-title>STORAGE DEVICE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250528B">G06F12/0866</main-classification>  
        <further-classification edition="200601120250528B">G06F13/38</further-classification>  
        <further-classification edition="200601120250528B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀旻志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, MIN-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮士洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, SHIH-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭乃萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, NAI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種儲存裝置及其操作方法。由一儲存控制器的至少一第一功能模組對複數個記憶儲存單元執行複數個第一記憶管理功能，該儲存控制器耦接至該些記憶儲存單元，該儲存控制器更包括一第一加速橋接器。一加速器的一第二功能模組對該些記憶儲存單元執行一第二記憶管理功能，該加速器通過該第一加速橋接器而外部連接至該儲存控制器，其中，該第二記憶管理功能不同於任何該第一記憶管理功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application provides a storage device and an operation method thereof. A plurality of first memory management functions are performed on a plurality of memory storage units by at least one first functional module of a storage controller coupled to the plurality of memory storage units, the storage controller further including a first accelerator bridge. A second memory management function is performed on the plurality of memory storage units by a second functional module of an accelerator externally connected to the storage controller through the first accelerator bridge, wherein the second memory management function is different from any of the first memory management functions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">910-920:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="382" publication-number="202627293"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627293.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於啟動機車引擎的方法以及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">F02N11/04</main-classification>  
        <further-classification edition="200601120250328B">B60W10/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩特動力工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTIVE POWER INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王長生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JOHN-SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種用於啟動機車引擎的方法，其係透過引擎啟動控制系統而被執行，其中引擎啟動控制系統包括控制器、與控制器耦接的供電裝置及分別與控制器和供電裝置耦接的一體式啟動發電機，並且引擎啟動控制系統中的一體式啟動發電機與機車引擎耦接。所述方法包含以下步驟：透過控制器，驅動一體式啟動發電機於反轉時間內以反轉定轉矩值進行反向運轉，直到反轉時間終止，其中反轉定轉矩值所驅動之一體式啟動發電機的反轉力矩大於摩擦阻力值並小於閥門彈簧阻力的最大阻力值；在一體式啟動發電機停止反向運轉之後，透過控制器，控制供電裝置向一體式啟動發電機輸出正轉定電流，以驅動一體式啟動發電機進行正向運轉，其中正轉定電流的電流量所驅動之一體式啟動發電機的正轉力矩大於摩擦阻力值和閥門彈簧阻力的當前阻力值的總額；以及在一體式啟動發電機進行正向運轉的期間，當一體式啟動發電機所帶動之機車引擎的正轉角速度值大於或等於預期值時，機車引擎將透過一體式啟動發電機而被啟動。藉此，所述方法能夠適用於啟動機車引擎，並解決實務上需要花費較高的成本才能啟動機車引擎的問題。另，一種用於啟動機車引擎的系統亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210、S220、S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="383" publication-number="202626783"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626783.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150183</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚乙烯醇縮醛樹脂、包含其之夾層玻璃用中間膜及其製造方法</chinese-title>  
        <english-title>POLYVINYL ALCOHOL ACETAL RESIN, INTERLAYER FILM FOR LAMINATED GLASS CONTAINING THE SAME AND THE MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250106B">C08F16/06</main-classification>  
        <further-classification edition="200601120250106B">C08J5/18</further-classification>  
        <further-classification edition="200601120250106B">B32B27/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長春石油化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG CHUN PETROCHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豫宛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚乙烯醇縮醛樹脂，其以BET法測得之比表面積為0.1000至1.4000 m &lt;sup&gt;2&lt;/sup&gt;/g，假比重為0.200至0.350 g/cm &lt;sup&gt;3&lt;/sup&gt;，且其D50粒徑為75.0至187.5 μm。本發明之聚乙烯醇縮醛樹脂可適用於多種用途，如用於夾層玻璃之中間膜、塗料或接著劑。由本發明之聚乙烯醇縮醛樹脂所製成之後續製品具有低黃度、高穿透度及高亮度等優異的光學性能，且在該聚乙烯醇縮醛樹脂於室溫環境下放置48小時後，其所製成的後續製品仍具有前述良好的光學性能，可見其亦具備優異的穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a polyvinyl alcohol acetal resin having a specific surface area of 0.1000 to 1.4000 m &lt;sup&gt;2&lt;/sup&gt;/g measured by the BET method, a bulk density of 0.200 to 0.350 g/cm &lt;sup&gt;3&lt;/sup&gt;and a D50 particle size of 75.0 to 187.5μm. The polyvinyl acetal resin of the present invention can be used in various applications, such as interlayer film for laminated glass, coating materials, or adhesive agents. The subsequent product made from the polyvinyl acetal resin of the present invention has excellent optical properties such as low yellowness, high transmittance, and high brightness. Moreover, after left at room temperature for 48 hours, the polyvinyl alcohol acetal resin can still be made into the subsequent product with aforementioned ideal optical properties, which shows that the polyvinyl acetal resin also has excellent stability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:中孔洞</p>  
        <p type="p">B:巨孔</p>  
        <p type="p">C:微孔</p>  
        <p type="p">P:聚乙烯醇縮醛樹脂顆粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="384" publication-number="202627980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影片處理方法、裝置及電子設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250401B">G06T3/40</main-classification>  
        <further-classification edition="201701120250401B">G06T7/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬維爾京群島商威爾德嘉德有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILD GUARD LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾廷恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, TING-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任彥豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, YANHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種影片處理方法、裝置及電子設備，屬於通訊技術領域。該影片處理方法包括：獲取待處理影片；基於該待處理影片，獲取畫面更新率為第一畫面更新率的深度圖資料以及畫面更新率為第二畫面更新率的基於事件的視覺感測器EVS資料；將該深度圖資料和該EVS資料登錄到深度圖插幀網路模型進行插幀結果預測，得到該待處理影片的深度圖插幀結果，該深度圖插幀網路模型為預先獲取的用於對深度圖資料和EVS資料進行插幀結果預測的模型；基於該深度圖插幀結果，輸出畫面更新率為目標畫面更新率的目標影片，且該目標畫面更新率為該第一畫面更新率的N倍，N為大於1的整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101-S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="385" publication-number="202627280"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627280.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬框構造</chinese-title>  
        <english-title>METAL FRAME STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">E06B3/04</main-classification>  
        <further-classification edition="200601120250225B">E06B3/263</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貫順精密科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUN TAIWAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥晉嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, CHIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥晉輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, CHIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥晉綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, CHIN-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種金屬框構造，用以解決習知金屬框斷熱、隔音效果不佳的問題。係包含：一外框，由一第一連接件連接一第一外框桿與一第二外框桿，一第一阻體連接在該第一連接件之上表面；及一閉合體，由一第三連接件連接一第一內桿與一第二內桿；該第一外框桿與該第二外框桿之相對地內面之間具有一第一距離，該第一距離係具有一第一中心線，該第一內桿與該第二內桿之相對地內面之間具有一第二距離，該第二距離係具有一第二中心線，當該閉合體對該外框作關閉時，該第一中心線與該第二中心線係重疊在同一直線上。如此，係具有較佳斷熱、隔音效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metal frame structure for solving the problem of heat breakage and poor sound insulation effect of a conventional metal frame. The frame comprises: an outer frame with a first connector connecting a first outer frame rod to a second outer frame rod, a first resistor connected to the upper surface of the first connector; and a closed body with a third connector connecting a first inner rod to a second inner rod; the first outer frame rod has a first distance between the opposite inner surfaces of the first outer frame rod and the second outer frame rod, the first distance has a first centerline, and the first inner rod has a second distance between the opposite inner surfaces of the second inner rod, the second distance has a second centerline, and the first inner rod has a second centerline, the second distance has a second centerline, and the first inner rod has a second centerline, and the second inner rod has a second centerline. The first inner rod and the second inner rod have a second distance from each other with a second centerline, and the first centerline and the second centerline overlap on the same line when the closing body closes the outer frame. In this way, the present invention has better heat and sound insulation effects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:外框</p>  
        <p type="p">11:第一外框桿</p>  
        <p type="p">11a:內面</p>  
        <p type="p">111:側連接槽</p>  
        <p type="p">112:嵌槽</p>  
        <p type="p">113:抵止條</p>  
        <p type="p">12:第二外框桿</p>  
        <p type="p">12a:內面</p>  
        <p type="p">121:側連接槽</p>  
        <p type="p">122:擋牆</p>  
        <p type="p">13:第一連接件</p>  
        <p type="p">131:側連接部</p>  
        <p type="p">132:上連接部</p>  
        <p type="p">133:空心槽</p>  
        <p type="p">14:第一阻體</p>  
        <p type="p">141:下連接部</p>  
        <p type="p">142:第一抵接部</p>  
        <p type="p">143:空心槽</p>  
        <p type="p">15:第二連接件</p>  
        <p type="p">151:側連接部</p>  
        <p type="p">152:空心槽</p>  
        <p type="p">16:第二阻體</p>  
        <p type="p">2:閉合體</p>  
        <p type="p">21:第一內桿</p>  
        <p type="p">21a:內面</p>  
        <p type="p">211:側連接槽</p>  
        <p type="p">212:第一嵌槽</p>  
        <p type="p">213:擋牆</p>  
        <p type="p">214:抵止條</p>  
        <p type="p">22:第二內桿</p>  
        <p type="p">22a:內面</p>  
        <p type="p">221:側連接槽</p>  
        <p type="p">222:第二嵌槽</p>  
        <p type="p">223:抵止條</p>  
        <p type="p">224:上嵌合部</p>  
        <p type="p">225:固定桿</p>  
        <p type="p">226:防漏條</p>  
        <p type="p">23:第三連接件</p>  
        <p type="p">231:側連接部</p>  
        <p type="p">232:空心槽</p>  
        <p type="p">233:第二抵接部</p>  
        <p type="p">24:座體</p>  
        <p type="p">241:片體</p>  
        <p type="p">25:第四連接件</p>  
        <p type="p">251:側連接部</p>  
        <p type="p">252:空心槽</p>  
        <p type="p">26:凸體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="386" publication-number="202627283"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627283.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150196</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拉摺門片及拉摺門構造</chinese-title>  
        <english-title>FOLDING DOOR PIECE AND FOLDING DOOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">E06B7/082</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貫順精密科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUN TAIWAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥晉嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, CHIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥晉輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, CHIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥晉綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, CHIN-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種拉摺門片，用以解決習知拉摺門缺乏變化的問題。係包含：數樞接件，各形成長條狀之各具有一表面與一底面，於該表面與該底面之間係具有二樞轉槽，該二樞轉槽係各具有一開口，該二開口各具有二端點，該二端點與該樞轉槽的中心具有一夾角；及數門片，各由一片體的二側各具有一樞轉部，該樞轉部用以容置在該樞接件的該樞轉槽樞轉。本發明另提供具有該拉摺門片之拉摺門構造。藉此，該拉摺門片及該拉摺門具有多樣化，係可以符合不同設計、環境需求的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A folding door piece for solving the problem of lack of variation in the known folding door. It comprises: several pivots, each formed in the form of an elongated strip having a surface and a bottom surface, between the surface and the bottom surface there are two pivot grooves, the two pivot grooves each having an opening, the two openings each having two endpoints, the two endpoints having an angle of entrapment with the center of the pivot grooves; and several door pieces, each formed by a piece of a body on each side of a pivot portion, which is used to accommodate pivoting of the pivot grooves of the pivot piece. The present invention also provides a folding door structure having the folding door piece. By doing so, the folding door sheet and the folding door are diversified, and can be used to meet the effects of different designs and environmental requirements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:樞接件</p>  
        <p type="p">1a:表面</p>  
        <p type="p">1b:底面</p>  
        <p type="p">11:樞轉槽</p>  
        <p type="p">12:開口</p>  
        <p type="p">12a:端點</p>  
        <p type="p">12b:端點</p>  
        <p type="p">2:門片</p>  
        <p type="p">21:片體</p>  
        <p type="p">22:樞轉部</p>  
        <p type="p">3:飾蓋</p>  
        <p type="p">31:結合柱</p>  
        <p type="p">4:懸吊座</p>  
        <p type="p">41:結合柱</p>  
        <p type="p">42:軸座</p>  
        <p type="p">43:旋轉軸</p>  
        <p type="p">44:輪體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="387" publication-number="202627398"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627398.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖案結構及設置該圖案結構的瞄準器</chinese-title>  
        <english-title>PATTERN STRUCTURE AND SIGHT UTILIZING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">F41G1/00</main-classification>  
        <further-classification edition="200601120250303B">F41G1/46</further-classification>  
        <further-classification edition="200601120250303B">F41G1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞洲光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA OPTICAL CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家淦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KEN CHIAKAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種瞄準器及其圖案結構，圖案結構包括一第一圖案以及一第二圖案。第一圖案由第一光源單元組成的一第一幾何形狀，且具有一第一顏色。第二圖案係由第一光源單元組成的一第二幾何形狀。該第二圖案的內側緣沿該第一圖案之外側緣相對設置，其中該第一圖案的外側緣與該第二圖案的內側緣彼此對應的各位置之間具有一第一特徵間距，且各位置之間的該第一特徵間距為相同。該第二圖案具有一第一端以及一第二端，該第一端與該第二端是相對設置且分別與該第二圖案的內側緣連接，且該第一端與該第二端相隔一第二特徵間距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pattern structure and a sight utilizing the same are disclosed. The pattern structure includes a first pattern and a second pattern. The first pattern is composed of a first geometric shape of the first light source unit and has a first color. The second pattern is a second geometric shape composed of the first light source units. The inner edge of the second pattern is arranged oppositely along the outer edge of the first pattern, wherein there is a first characteristic distance between the corresponding positions of the outer edge of the first pattern and the inner edge of the second pattern, and the first characteristic distance between the positions is the same. The second pattern has a first end and a second end. The first end and the second end are oppositely arranged and connected to the inner edge of the second pattern respectively, and the first end and the second end are spaced a second characteristic distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:主要幾何形狀</p>  
        <p type="p">10:第一圖案</p>  
        <p type="p">10a:第一幾何形狀</p>  
        <p type="p">20:第二圖案</p>  
        <p type="p">20a:第二幾何形狀</p>  
        <p type="p">20b:缺口</p>  
        <p type="p">d1:第一直徑</p>  
        <p type="p">d2:第二直徑</p>  
        <p type="p">d3:第三直徑</p>  
        <p type="p">L1:第一特徵間距</p>  
        <p type="p">L2:第二特徵間距</p>  
        <p type="p">O1、O2、O3:圓心</p>  
        <p type="p">T1:第一圖案的外側緣之切線</p>  
        <p type="p">T2:第二圖案的內側緣之切線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="388" publication-number="202627971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廟宇用的資料歸戶系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250321B">G06Q50/22</main-classification>  
        <further-classification edition="200601120250321B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文玄企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張煥鄉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種廟宇用的資料歸戶系統，包含一能夠通過網路與一圖資伺服器、一用戶端相互通訊的通訊單元、一訊號連接於該通訊單元的處理單元，及一用於儲存一戶籍資訊的資料庫單元。本發明的資料歸戶方法通過該處理單元執行以下步驟：(a)接收一來自該用戶端的用戶資訊。(b)傳輸該用戶資訊中的一用戶地址給該圖資伺服器。(c)擷取一由該圖資伺服器根據該用戶地址所生成的規格化地址。(d)根據對應該用戶地址的規格化地址與該用戶姓名，建立、或更新該戶籍資訊。藉此，本發明能夠以通用的格式，自動且快速轉換該用戶地址為規格化地址，用以避免資料重複。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S09:步驟流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="389" publication-number="202627386"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627386.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有熱交換單元的電子設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">F28D1/02</main-classification>  
        <further-classification edition="200601120250926B">F28D1/06</further-classification>  
        <further-classification edition="200601120250926B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>承康研創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BE RICH LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林憲仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHEN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有熱交換單元的電子設備，包含一機殼、一電子模組及一熱交換單元。該機殼包括一圍繞界定出一容室的殼本體。該電子模組位於該容室且包括一基板，及數設置於該基板且會產生熱量的電子元件。該熱交換單元設置於該機殼且包括一填充於該容室的超臨界流體。該電子模組直接浸沒於該超臨界流體且與該超臨界流體熱交換。藉由該電子模組浸沒於該超臨界流體，使該超臨界流體直接接觸該電子模組的表面而提升熱交換效果，而降低該電子模組的整體耗能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機殼</p>  
        <p type="p">11:殼本體</p>  
        <p type="p">12:容室</p>  
        <p type="p">121:頂部空間</p>  
        <p type="p">2:電子模組</p>  
        <p type="p">21:基板</p>  
        <p type="p">22:電子元件</p>  
        <p type="p">3:熱交換單元</p>  
        <p type="p">31:超臨界流體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="390" publication-number="202628142"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628142.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扼流圈結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H01F27/24</main-classification>  
        <further-classification edition="200601120250303B">H01F27/28</further-classification>  
        <further-classification edition="201601120250303B">H01F41/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西北臺慶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪振雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種扼流圈結構，其包含：一線圈，該線圈定義出相互垂直的一第一軸向及一第二軸向，該線圈包含該第一軸向的複數個第一引線、該第二軸向的複數個第二引線、該第一軸向的複數個第三引線、該第二軸向的複數個第四引線、該第一軸向的一第五引線，該第一引線連接該第二引線，該第二引線連接該第三引線，該第三引線連接該第四引線，該第四引線連接該第五引線；以及一主體，該主體包含一磁性材料，該主體形成在該線圈的周圍，且該主體的一外側設有該複數個第一引線。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:線圈</p>  
        <p type="p">11:第一引線</p>  
        <p type="p">12:第二引線</p>  
        <p type="p">13:第三引線</p>  
        <p type="p">14:第四引線</p>  
        <p type="p">15:第五引線</p>  
        <p type="p">2:主體</p>  
        <p type="p">X:第一軸向</p>  
        <p type="p">Y:第二軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="391" publication-number="202626138"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626138.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輸液連接裝置</chinese-title>  
        <english-title>INFUSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">A61M39/10</main-classification>  
        <further-classification edition="200601120250418B">A61M5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>怡安醫療器材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILY-MEDICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王湘菱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINY, WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡賢治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIV, TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯明憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種輸液連接裝置，其包括內套筒、彈性套件與外套筒。內套筒之內部設有一支撐板，以區分內套筒之內部空間為兩個子空間。支撐板貫穿有位於上述兩個子空間中的一中央導管。彈性套件包含封口部及彈簧部，封口部之底部連接彈簧部，彈簧部之底部具有一開口。彈簧部透過開口套設於中央導管上，並位於支撐板上，以利用封口部與彈簧部封閉中央導管。彈簧部包含由上而下排列之多個環形彈簧結構，環形彈簧結構由上而下所環繞的面積漸增，以形成一錐形排列。外套筒套設於內套筒之外側壁，以容置彈性套件於中央導管與外套筒之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention discloses an infusion device, which includes an inner sleeve, a resilient member, and an outer sleeve. The interior of the inner sleeve is equipped with a support plate that divides an internal space of the inner sleeve into two sub-spaces. The support plate has a central conduit that penetrates through the two sub-spaces. The resilient member includes a sealing part and a spring part, with a bottom of the sealing part connected to the spring part, and a bottom of the spring part having an opening. The spring part is fitted around the central conduit through the opening and is positioned on the support plate, utilizing the sealing part and the spring part to close the central conduit. The spring part includes multiple annular spring structures arranged from top to bottom, with the area enclosed by the annular spring structures increasing from top to bottom, forming a tapered arrangement. The outer sleeve is fitted around the outer side wall of the inner sleeve to accommodate the flexible assembly between the central conduit and the outer sleeve.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:輸液連接裝置</p>  
        <p type="p">10:內套筒</p>  
        <p type="p">100:內部空間</p>  
        <p type="p">1000:子空間</p>  
        <p type="p">11:彈性套件</p>  
        <p type="p">110:封口部</p>  
        <p type="p">1100:片狀凸緣</p>  
        <p type="p">111:彈簧部</p>  
        <p type="p">1110:開口</p>  
        <p type="p">1111:環形彈簧結構</p>  
        <p type="p">12:外套筒</p>  
        <p type="p">120:錐形容置空間</p>  
        <p type="p">13:支撐板</p>  
        <p type="p">14:中央導管</p>  
        <p type="p">140:開孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="392" publication-number="202628140"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628140.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扼流圈構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">H01F17/02</main-classification>  
        <further-classification edition="200601120250325B">H01F27/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西北臺慶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申寶琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪振雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種扼流圈構造，其包含：一線圈，該線圈定義出相互垂直的一第一軸向及一第二軸向，該線圈包含該第一軸向的複數個第一引線、該第二軸向的複數個第二引線、該第一軸向的複數個第三引線、該第二軸向的複數個第四引線、該第一軸向的複數個第五引線、該第二軸向的複數個第六引線、該第一軸向的一第七引線，該第一引線連接該第二引線，該第二引線連接該第三引線，該第三引線連接該第四引線，該第四引線連接該第五引線，該第五引線連接該第六引線，該第六引線連接該第七引線；以及一主體，該主體包含一磁性材料，該主體形成在該線圈的周圍，且該主體的一外側設有該複數個第一引線。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:線圈</p>  
        <p type="p">11:第一引線</p>  
        <p type="p">12:第二引線</p>  
        <p type="p">13:第三引線</p>  
        <p type="p">14:第四引線</p>  
        <p type="p">15:第五引線</p>  
        <p type="p">16:第六引線</p>  
        <p type="p">17:第七引線</p>  
        <p type="p">2:主體</p>  
        <p type="p">X:第一軸向</p>  
        <p type="p">Y:第二軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="393" publication-number="202628260"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628260.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源連接器</chinese-title>  
        <english-title>POWER CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250124B">H01R13/40</main-classification>  
        <further-classification edition="201101120250124B">H01R13/6581</further-classification>  
        <further-classification edition="200601120250124B">H01R13/655</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞市康祥電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN KANGXIANG ELECTRONIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永常</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG- CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張弘典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾軒禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, HSUAN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭振田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種電源連接器，其包括第一端子組及第二端子組；第一端子組包括有間隔設置之至少二第一接地端子、一第一電源端子及一第一偵測迴路端子，第二端子組與第一端子組上下對應，其包括有間隔設置之至少二第二接地端子、一第二電源端子及一第二偵測迴路端子，每個第一、二接地端子之間設有接地隔板，第一、二電源端子之間設有電源隔板；藉此，透過第一、二端子組其所設端子與端子之間呈上下的對應，達到本發明之電源連接器具新穎的平板狀式對接形式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a power connector, which includes a first terminal set and a second terminal set. The first terminal set comprises at least two first ground terminals arranged at intervals, a first power terminal, and a first detection loop terminal. The second terminal set corresponds vertically to the first terminal set and comprises at least two second grounding terminals arranged at intervals, a second power terminal, and a second detection loop terminal. Grounding separators are positioned between each of the first and second grounding terminals, while power separators are positioned between the first and second power terminals. By arranging the terminals of the first and second terminal sets in a vertical corresponding configuration, the invention achieves a novel flat docking design for the power connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電源連接器</p>  
        <p type="p">11:第一端子組</p>  
        <p type="p">111:第一接地端子</p>  
        <p type="p">1111:第一接地焊接腳</p>  
        <p type="p">112:第一電源端子</p>  
        <p type="p">1121:第一電源焊接腳</p>  
        <p type="p">113:第一偵測迴路端子</p>  
        <p type="p">1131:第一偵測焊接腳</p>  
        <p type="p">12:第二端子組</p>  
        <p type="p">121:第二接地端子</p>  
        <p type="p">1211:第二接地焊接腳</p>  
        <p type="p">122:第二電源端子</p>  
        <p type="p">1221:第二電源焊接腳</p>  
        <p type="p">123:第二偵測迴路端子</p>  
        <p type="p">1231:第二偵測焊接腳</p>  
        <p type="p">13:接地隔板</p>  
        <p type="p">14:電源隔板</p>  
        <p type="p">15:絕緣座體</p>  
        <p type="p">151:舌板</p>  
        <p type="p">152:凸肋條</p>  
        <p type="p">16:絕緣殼體</p>  
        <p type="p">161:第一定位部</p>  
        <p type="p">17:屏蔽殼體</p>  
        <p type="p">171:第二定位部</p>  
        <p type="p">2:控制基板</p>  
        <p type="p">21:第一焊孔組</p>  
        <p type="p">22:第二焊孔組</p>  
        <p type="p">23:第一定位孔</p>  
        <p type="p">24:第二定位孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="394" publication-number="202628261"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628261.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150206</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源連接器</chinese-title>  
        <english-title>POWER CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250509B">H01R13/40</main-classification>  
        <further-classification edition="201101120250509B">H01R13/6581</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞市康祥電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN KANGXIANG ELECTRONIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永常</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG- CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張弘典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾軒禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, HSUAN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭振田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種電源連接器，其包括第一端子組及第二端子組；第一端子組包括有間隔設置之至少二第一接地端子、一第一電源端子及至少二第一訊號端子， 第二端子組與第一端子組上下對應，其包括有間隔設置之至少二第二接地端子、一第二電源端子及至少二第二訊號端子，且第一、二端子組之間設有一隔板；藉此，透過第一、二端子組其所設端子與端子之間呈上下的對應，使得電源連接器其插接頭可呈扁平狀形式，而對接之電源連接器母座也相對呈扁平狀形式，達到有效縮減其整體體積或高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a power connector, which includes a first terminal set and a second terminal set. The first terminal set comprises at least two first ground terminals arranged at intervals, a first power terminal, and at least two first signal terminals. The second terminal set corresponds vertically to the first terminal set and includes at least two second ground terminals arranged at intervals, a second power terminal, and at least two second signal terminals. A partition is positioned between the first and second terminal sets. By aligning the terminals of the first and second terminal sets vertically, the power connector's plug can be configured in a flat form, and the corresponding power connector receptacle also adopts a flat form, effectively reducing its overall size or height.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電源連接器</p>  
        <p type="p">11:第一端子組</p>  
        <p type="p">111:第一接地端子</p>  
        <p type="p">1111:第一接地焊接腳</p>  
        <p type="p">112:第一電源端子</p>  
        <p type="p">1121:第一電源焊接腳</p>  
        <p type="p">113:第一訊號端子</p>  
        <p type="p">1131:第一訊號焊接腳</p>  
        <p type="p">12:第二端子組</p>  
        <p type="p">121:第二接地端子</p>  
        <p type="p">1211:第二接地焊接腳</p>  
        <p type="p">122:第二電源端子</p>  
        <p type="p">1221:第二電源焊接腳</p>  
        <p type="p">123:第二訊號端子</p>  
        <p type="p">1231:第二訊號焊接腳</p>  
        <p type="p">13:隔板</p>  
        <p type="p">131:嵌合柱</p>  
        <p type="p">14:第一絕緣座體</p>  
        <p type="p">15:第二絕緣座體</p>  
        <p type="p">151:定位槽孔</p>  
        <p type="p">16:屏蔽殼體</p>  
        <p type="p">161:夾鏈槽</p>  
        <p type="p">17:第三絕緣座體</p>  
        <p type="p">2:控制基板</p>  
        <p type="p">21:焊接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="395" publication-number="202627972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150217</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>評分系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250321B">G06Q50/22</main-classification>  
        <further-classification edition="200601120250321B">G06Q90/00</further-classification>  
        <further-classification edition="200601120250321B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>右府建設股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊嘉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種評分系統，包括：複數個蒐集端計算機裝置，用於蒐集複數位使用者的複數個使用者特徵資訊及複數個使用者行為模式，並針對該等使用者行為模式的每一個給予一評分；一資料庫，儲存該等使用者的每一個的複數筆個人資訊及複數筆個人特徵資訊；一資料處理裝置，電性連接至該資料庫且接收該等使用者特徵資訊及該評分，並將該等使用者特徵資訊與該個人資訊、該個人特徵資訊進行比對，以從該資料庫中找出對應的一使用者，再將該評分對應至該使用者；以及一使用者端計算機裝置，接收該評分。再者，本發明亦提供一種評分方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:蒐集端計算機裝置</p>  
        <p type="p">20:使用者</p>  
        <p type="p">30:資料庫</p>  
        <p type="p">40:資料處理裝置</p>  
        <p type="p">50:使用者端計算機裝置</p>  
        <p type="p">101:評分</p>  
        <p type="p">201:使用者特徵資訊</p>  
        <p type="p">203:使用者行為模式</p>  
        <p type="p">205:個人資訊</p>  
        <p type="p">207:個人特徵資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="396" publication-number="202628358"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628358.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>類比緩衝器裝置</chinese-title>  
        <english-title>ANALOG BUFFER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F3/50</main-classification>  
        <further-classification edition="200601120250303B">H03K19/0185</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃詩雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">類比緩衝器裝置包含第一源極追隨器電路以及第二源極追隨器電路。第一源極追隨器電路用以根據一第一輸入訊號產生一第一輸出訊號。第二源極追隨器電路用以根據一第二輸入訊號產生一第二輸出訊號。該第一源極追隨器電路與該第二源極追隨器電路串聯耦接，並耦接在一第一電源節點與一第二電源節點之間，該第一電源節點接收一第一電源電壓，且該第二電源節點接收一第二電源電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An analog buffer device includes a first source follower circuit and a second source follower circuit. The first source follower circuit is configured to generate a first output signal according to a first input signal. The second source follower circuit is configured to generate a second output signal according to a second input signal. The first source follower circuit and the second source follower circuit are coupled in series and are coupled between a first power node and a second power node, the first power node receives a first power voltage, and the second power node receives a second power voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:類比緩衝器裝置</p>  
        <p type="p">110,120:源極追隨器電路</p>  
        <p type="p">MN1,MN2:電晶體</p>  
        <p type="p">MP1,MP2:電晶體</p>  
        <p type="p">PN1,PN2:電源節點</p>  
        <p type="p">V1,V2:電源電壓</p>  
        <p type="p">VIN1,VIN2:輸入訊號</p>  
        <p type="p">VO1,VO2:輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="397" publication-number="202626154"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626154.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>球拍框</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250126B">A63B49/02</main-classification>  
        <further-classification edition="201501120250126B">A63B49/08</further-classification>  
        <further-classification edition="201501120250126B">A63B60/54</further-classification>  
        <further-classification edition="201501320250126B">A63B102/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>知惠企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種球拍框，包含一柄桿及一拍頭。該拍頭包括一環框體、複數彼此相間隔地設置於該環框體上的凸設結構，及複數設置於該環框體上的降阻結構。該環框體形成複數穿孔。每一凸設結構具有二分別位於其中數個穿孔前後兩側的凸緣，該等凸緣界定出一寬度較大的開槽。每一降阻結構具有二分別位於其中數個穿孔前後兩側的側遮壁。該等側遮壁界定出一寬度較小的狹槽。該等穿孔可供網線直接穿設而無需使用塑膠釘，透過該等狹槽之寬度小於該等開槽的設計，使該等側遮壁可緊密地貼靠網線的線段，如此可大幅降低風阻並避免揮擊時受到干擾。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:柄桿</p>  
        <p type="p">3:拍頭</p>  
        <p type="p">31:環框體</p>  
        <p type="p">311:拍面空間</p>  
        <p type="p">312:內周面</p>  
        <p type="p">313:外周面</p>  
        <p type="p">314:穿孔</p>  
        <p type="p">32:凸設結構</p>  
        <p type="p">321:凸緣</p>  
        <p type="p">322:開槽</p>  
        <p type="p">33:降阻結構</p>  
        <p type="p">331:側遮壁</p>  
        <p type="p">332:狹槽</p>  
        <p type="p">34:擋體</p>  
        <p type="p">341:線段槽</p>  
        <p type="p">4:網線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="398" publication-number="202628349"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628349.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態放大器</chinese-title>  
        <english-title>DYNAMIC AMPLIFIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250321B">H03F1/30</main-classification>  
        <further-classification edition="200601120250321B">H03F3/217</further-classification>  
        <further-classification edition="200601120250321B">H03F3/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃詩雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">動態放大器包含電源供應電路以及第一至第四電晶體。電源供應電路用以提供複數個電源電壓。第一電晶體用以經由一第一輔助訊號偏壓，並接收該複數個電源電壓中的一第一電源電壓。第二電晶體用以經由一第二輔助訊號偏壓，並接收該第一電源電壓。第三電晶體接收該複數個電源電壓，並用以根據一第一輸入訊號產生一第一輸出訊號。第四電晶體接收該複數個電源電壓，並用以根據一第二輸入訊號產生一第二輸出訊號。該第三電晶體經由該第一電晶體接收該第一電源電壓，且該第四電晶體經由該第二電晶體接收該第一電源電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dynamic amplifier includes a power supply circuit and first to fourth transistors. The power supply circuit is configured to provide a plurality of supply voltages. The first transistor is configured to receive a first supply voltage among the plurality of supply voltages via a first auxiliary signal bias. The second transistor is configured to receive the first supply voltage via a second auxiliary signal bias. The third transistor receives the plurality of supply voltages and is configured to generate a first output signal according to a first input signal. The fourth transistor receives the plurality of supply voltages and is configured to generate a second output signal according to a second input signal. The third transistor receives the first supply voltage via the first transistor, and the fourth transistor receives the first supply voltage via the second transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:動態放大器</p>  
        <p type="p">110:電源供應電路</p>  
        <p type="p">C:電容</p>  
        <p type="p">MN1,MN2:電晶體</p>  
        <p type="p">MP1,MP2:電晶體</p>  
        <p type="p">S1,S2:切換訊號</p>  
        <p type="p">SW1,SW2,SW3,SW4:開關</p>  
        <p type="p">V1,V2:電源電壓</p>  
        <p type="p">VA1,VA2:輔助訊號</p>  
        <p type="p">VHH,VLL:供應電壓</p>  
        <p type="p">VIN,VIP:輸入訊號</p>  
        <p type="p">VO1,VO2:輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="399" publication-number="202626603"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626603.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種利用微通道反應器製備維生素Ｄ之方法</chinese-title>  
        <english-title>A METHOD FOR PREPARING VITAMIN D USING A MICROCHANNEL REACTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">C07C401/00</main-classification>  
        <further-classification edition="200601120250203B">B01J19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台耀化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMOSA LABORATORIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃中彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUNG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種利用微通道反應器製備維生素D&lt;sub&gt;2&lt;/sub&gt;之方法，包含：(a)溶解麥角固醇於第一溶劑中，以形成第一反應溶液；(b)將該第一反應溶液通入微通道反應器，該微通道反應器定義有為第一光源照射之第一光反應區及位於該第一光反應區下游且為第二光源照射之第二光反應區，俾於該第一反應溶液通過該第一光反應區及第二光反應區時，依序以該第一光源及第二光源照射該第一反應溶液；(c)收集並濃縮經該第二光源照射之該第一反應溶液；(d)視需要將步驟(c)之經濃縮之該第一反應溶液與第二溶劑混合，以形成第二反應溶液；(e)加熱該步驟(c)之第一反應溶液或該步驟(d)之第二反應溶液，以獲得該維生素D&lt;sub&gt;2&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method for preparing vitamin D&lt;sub&gt;2&lt;/sub&gt; using a microchannel reactor, comprising: (a) dissolving ergosterol in a first solvent to form a first reaction solution; (b) passing the first reaction solution into the microchannel reactor, the microchannel reactor is defined with a first photoreaction zone irradiated by light source A and a second photoreaction zone located downstream of the first photoreaction zone and irradiated by light source B, so that the first reaction solution is irradiated with the light source A and the light source B in sequence as the first reaction solution passes through the first photoreaction zone and the second photoreaction zone; (c) collecting and concentrating the first reaction solution irradiated by the light source B; (d) optionally, mixing the first reaction solution of step (c) with a second solvent to form a second reaction solution; (e) heating the first reaction solution of step (c) or the second reaction solution of step (d) to obtain the vitamin D&lt;sub&gt;2&lt;/sub&gt;.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="400" publication-number="202628350"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628350.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150233</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有緩衝器功能的放大器裝置</chinese-title>  
        <english-title>AMPLIFIER DEVICE HAVING BUFFER FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F1/30</main-classification>  
        <further-classification edition="200601120250303B">H03F3/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃詩雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">具有緩衝器功能的放大器裝置包含放大器電路以及緩衝器電路。放大器電路用以放大一第一輸入訊號以產生一第一放大輸出訊號，並放大一第二輸入訊號以產生一第二放大輸出訊號。緩衝器電路用以根據一第三輸入訊號產生一第一緩衝輸出訊號，並根據一第四輸入訊號產生一第二緩衝輸出訊號。該放大器電路與該緩衝器電路串聯耦接，並耦接在一第一電源節點與一第二電源節點之間，該第一電源節點接收一第一電源電壓，且該第二電源節點接收一第二電源電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An amplifier device having a buffer function includes an amplifier circuit and a buffer circuit. The amplifier circuit is configured to amplify a first input signal to generate a first amplified output signal, and amplify a second input signal to generate a seocnd amplified output signal. The buffer circuit is configured to generate a first buffer output signal according to a third input signal, and generate a second buffer output signal according to a fourth input signal. The amplifier circuit and the buffer circuit are coupled in series and between a first power node and a second power node, the first power node receives a first power voltage, and the second power node receives a second power voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:放大器裝置</p>  
        <p type="p">110:放大器電路</p>  
        <p type="p">120:緩衝器電路</p>  
        <p type="p">BO1,BO2:緩衝輸出訊號</p>  
        <p type="p">PN1,PN2:電源節點</p>  
        <p type="p">V1,V2:電源電壓</p>  
        <p type="p">VIN1,VIN2,VIN3,VIN4:輸入訊號</p>  
        <p type="p">VO1,VO2:放大輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="401" publication-number="202626436"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626436.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>個人化之自行車變速檔位評估方法</chinese-title>  
        <english-title>PERSONALIZED EVALUATION METHOD OF BICYCLE GEAR SHIFT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">B62M25/08</main-classification>  
        <further-classification edition="202001120250225B">B62J3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人自行車暨健康科技工業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYCLING &amp; HEALTH TECH INDUSTRY R&amp;D CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊勝傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種個人化之自行車變速檔位評估方法，包含有步驟1：收集騎乘時的數據，包括坡度、齒比，還包括功率、速度、踩踏扭力、踏頻其中一者以上；步驟2：當坡度或齒比其中一者變化時作劃分而得到多個分段；步驟3：設定一採計時間長度；步驟4：篩選坡度及齒比同時維持無變化且大於採計時間長度之分段；步驟5：以功率、速度、踩踏扭力、踏頻至少其中一者以上與坡度計算建立一模型，得出一評估齒比而得一評估檔位，再依該評估檔位提示建議檔位或自動變換檔位。藉此，本發明可快速準確得出評估，改善已知評估較慢且不準確的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A personalized evaluation method of bicycle gear shift includes the following steps: 1. Collecting data during riding, including slope, gear ratio, power, speed, pedaling torque and pedaling frequency; Step 2, when one of the slope or the gear ratio changes, dividing to obtain a plurality of segments; Step 3, setting a sampling time length; Step 4: screen the segments whose slope and tooth ratio are unchanged at the same time and are longer than the length of sampling time; Step 5: establish a model by calculating at least one of power, speed, pedaling torque and pedaling frequency and slope, and obtain an estimated gear ratio, and then suggest the gear or automatically change the gear according to the estimated gear. Therefore, the evaluation can be quickly and accurately obtained, and the problem that the known evaluation is slow and inaccurate is solved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S:分段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="402" publication-number="202628351"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628351.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150239</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可處理多組輸入訊號的放大器裝置</chinese-title>  
        <english-title>AMPLIFIER DEVICE ABLE TO PROCESS MULTIPLE SETS OF INPUT SIGNALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F1/30</main-classification>  
        <further-classification edition="200601120250303B">H03F3/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃詩雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">放大器裝置包含第一輸入對電路、第二輸入對電路以及閂鎖器電路。第一輸入對電路用以放大一第一組輸入訊號。第二輸入對電路用以放大一第二組輸入訊號，其中該第一輸入對電路的一導電型態不同於該第二輸入對電路的一導電型態。該第一輸入對電路與該第二輸入對電路更經由複數個輸出節點串聯耦接，並經由該複數個輸出節點產生複數個放大訊號，該第一輸入對電路與該第二輸入對電路耦接至一第一電源節點與一第二電源節點之間，且該第一電源節點與該第二電源節點接收不同電源電壓。閂鎖器電路用以根據該複數個放大訊號產生複數個輸出訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The amplifier device includes a first input pair circuit, a second input pair circuit, and a latch circuit. The first input pair circuit is configured to amplify a first set of input signals. The second input pair circuit is configured to amplify a second set of input signals, in which a conductivity type of the first input pair circuit is different from that of the second input pair circuit. The first input pair circuit and the second input pair circuit are further coupled in series through multiple output nodes, and multiple amplified signals are generated via the multiple output nodes. The first input pair circuit and the second input pair circuit are coupled between a first power node and a second power node, in which the first power node and the second power node receive different power voltages. The latch circuit is configured to generate multiple output signals according to the multiple amplified signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:放大器裝置</p>  
        <p type="p">110,120:輸入對電路</p>  
        <p type="p">130:閂鎖器電路</p>  
        <p type="p">MN1,MN2:N型電晶體</p>  
        <p type="p">MP1,MP2:P型電晶體</p>  
        <p type="p">NO1,NO2:輸出節點</p>  
        <p type="p">PN1,PN2:電源節點</p>  
        <p type="p">V1,V2:電源電壓</p>  
        <p type="p">VA1,VA2:放大訊號</p>  
        <p type="p">VG1:第一組輸入訊號</p>  
        <p type="p">VG2:第二組輸入訊號</p>  
        <p type="p">VIN1,VIN2:輸入訊號</p>  
        <p type="p">VIP1,VIP2:輸入訊號</p>  
        <p type="p">VO1,VO2:輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="403" publication-number="202626421"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626421.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可減輕重量之升降座管</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">B62J1/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久鼎金屬實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之升降座管包含有一外管、一內管，以及一流體壓缸。內管以可上下位移的方式穿設於外管，內管具有一位於外管外之頂端和一位於外管內之底端，流體壓缸具有一設於內管內之缸體和一穿設於缸體之活塞桿，缸體之底端固定於內管之底端。藉此，本發明之升降座管可以達到減輕重量的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:內管</p>  
        <p type="p">38:徑向穿孔</p>  
        <p type="p">41:缸體</p>  
        <p type="p">43:延伸部</p>  
        <p type="p">44:環槽</p>  
        <p type="p">45:活塞桿</p>  
        <p type="p">60:銷件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="404" publication-number="202627375"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627375.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷凍櫃的構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">F25D25/02</main-classification>  
        <further-classification edition="200601120250926B">F25D11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許喻婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許喻婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉昉昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種冷凍櫃的構造，係在冷凍櫃的外殼和內箱之間配置一自動升降裝置，其構造包括：一儲物架、一活動架以及一升降驅動單元，儲物架用於承載食材或物品，儲物架的頂端的相對兩側分別設有一掛耳，活動架配置在內箱的外側並且介於外殼和內箱之間，活動架配置有一承載桿，儲物架的掛耳可以掛置於承載桿，升降驅動單元用以帶動活動架上升或下降，進而將儲物架向上抬起而離開內箱，或是將儲物架放入內箱；使用者能夠方便地拿取置於儲物架底層的食材或物品。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:外殼</p>  
        <p type="p">11:開口</p>  
        <p type="p">20:內箱</p>  
        <p type="p">40:儲物架</p>  
        <p type="p">41:掛耳</p>  
        <p type="p">42:層板</p>  
        <p type="p">50:活動架</p>  
        <p type="p">51:承載桿</p>  
        <p type="p">511:第一承載桿</p>  
        <p type="p">512:第二承載桿</p>  
        <p type="p">521:第一立桿</p>  
        <p type="p">522:第二立桿</p>  
        <p type="p">523:第三立桿</p>  
        <p type="p">524:第四立桿</p>  
        <p type="p">53:支撐桿</p>  
        <p type="p">60:升降驅動單元</p>  
        <p type="p">61:電動機</p>  
        <p type="p">62:導螺桿</p>  
        <p type="p">63:螺帽支座</p>  
        <p type="p">64:螺桿支撐座</p>  
        <p type="p">70:固定導軌</p>  
        <p type="p">701:第一固定導軌</p>  
        <p type="p">702:第二固定導軌</p>  
        <p type="p">703:第三固定導軌</p>  
        <p type="p">704:第四固定導軌</p>  
        <p type="p">80:活動導軌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="405" publication-number="202628357"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628357.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可同時放大多個輸入的動態放大器</chinese-title>  
        <english-title>DYNAMIC AMPLIFIER THAT AMPLIFIES MULTIPLE INPUTS SIMULTANEOUSLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250321B">H03F3/217</main-classification>  
        <further-classification edition="200601120250321B">H03F3/45</further-classification>  
        <further-classification edition="200601120250321B">H03F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃詩雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">動態放大器包含第一至第六電晶體以及電源電壓供應電路。第一至第三電晶體分別放大第一至第三輸入訊號，並響應於該第一至該第三輸入訊號共同在第一輸出節點產生第一輸出訊號。第四至第六電晶體分別放大第四至第六輸入訊號，並響應於該第四至該第六輸入訊號共同在第二輸出節點產生第二輸出訊號。電源供應電路動態地提供複數個電源電壓，以驅動該第一至該第六電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The dynamic amplifier includes first to sixth transistors and a power supply circuit. The first to third transistors respectively amplify first to third input signals and, in response to the first to third input signals, commonly generate a first output signal at a first output node. The fourth to sixth transistors respectively amplify fourth to sixth input signals and, in response to the fourth to sixth input signals, commonly generate a second output signal at a second output node. The power supply circuit dynamically provides a plurality of supply voltages to drive the first to sixth transistors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:動態放大器</p>  
        <p type="p">110:電源供應電路</p>  
        <p type="p">C:電容</p>  
        <p type="p">MN1,MN2,MN3,MN4:電晶體</p>  
        <p type="p">MP1,MP2:電晶體</p>  
        <p type="p">NO1,NO2:輸出節點</p>  
        <p type="p">S1,S2:切換訊號</p>  
        <p type="p">SW1,SW2,SW3,SW4:開關</p>  
        <p type="p">V1,V2:電源電壓</p>  
        <p type="p">VHH,VLL:供應電壓</p>  
        <p type="p">VIN1,VIN2,VIN3:輸入訊號</p>  
        <p type="p">VIP1,VIP2,VIP3:輸入訊號</p>  
        <p type="p">VO1,VO2:輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="406" publication-number="202626214"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626214.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓框架清潔裝置及晶圓框架之清潔方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B08B13/00</main-classification>  
        <further-classification edition="202401120260302B">B08B1/12</further-classification>  
        <further-classification edition="200601120260302B">B08B3/04</further-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智樂精密有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡耀宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作晶圓框架清潔裝置包含一機台本體及設置於機台本體上的至少一注水機構、至少一輪刷機構及一翻轉機構，機台本體包含有依序設置的一進出料區、一清潔腔、一翻轉區，及能於進出料區至翻轉區之間往復移動的一移動台，注水機構及輪刷機構的輪刷件位於清潔腔中，翻轉機構位於翻轉區。本創作之清潔方法係應用於清潔裝置，使一晶圓框架由進出料區輸入機台本體並承載於移動台，透過移動台往復移動，通過清潔腔而被注水機構及輪刷件清洗，又透過翻轉機構翻面，因此僅透過同一清潔裝置即能夠清潔晶圓框架的兩面，減少所需的整體空間及減少成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機台本體</p>  
        <p type="p">11:進出料區</p>  
        <p type="p">12:清潔腔</p>  
        <p type="p">13:翻轉區</p>  
        <p type="p">14:移動台</p>  
        <p type="p">20:注水機構</p>  
        <p type="p">30:輪刷機構</p>  
        <p type="p">32:輪刷驅動組件</p>  
        <p type="p">40:翻轉機構</p>  
        <p type="p">50:進出料機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="407" publication-number="202627109"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627109.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於建議煉鋼精煉處理的終點溫度的方法及其裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR SUGGESTING ENDPOINT TEMPERATURE OF REFINING PROCESS OF STEELMAKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">C21C5/28</main-classification>  
        <further-classification edition="200601120250418B">C21C5/52</further-classification>  
        <further-classification edition="200601120250418B">C21C5/46</further-classification>  
        <further-classification edition="200601120250418B">G05D23/30</further-classification>  
        <further-classification edition="200601120250418B">F27D9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林常盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHANG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張顧齡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於建議煉鋼精煉處理的終點溫度的方法及其裝置，以用於建議精煉處理站一爐的鋼液的終點溫度，該方法包含：一參數取得步驟；一溫降計算步驟；及一精煉終點溫度建議步驟。通過凝固溫度、過熱溫度、鋼液的頂部渣面與盛鋼桶的外壁於精煉完成時間至澆鑄開始時間之間造成的鋼液溫度下降度數、盛鋼桶的鐵殼吸熱與耐材吸熱於精煉完成時間至澆鑄開始時間之間造成的鋼液溫度下降度數及分鋼槽下降溫度，計算出合適的鋼液的精煉終點建議溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and device for suggesting an endpoint temperature of refining process of steelmaking are provided, for suggesting an endpoint temperature of a ladle of molten steel in a refining process station. The method includes: a parameter acquisition step; a temperature-drop calculation step; and a suggesting refining endpoint temperature step. The recommended refining endpoint temperature for the molten steel is calculated based on the solidification temperature, the overheating temperature, the degree of temperature drop from the slag top surface of the molten steel and the outer wall of the ladle between the completion time of refining and the start time of casting, the degree of temperature drop from the heat absorption of the iron shell and refractory material of the ladle between the completion time of refining and the start time of casting, and the temperature drop of the tundish.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="408" publication-number="202626409"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626409.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛故障智能預測系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250219B">B60W40/02</main-classification>  
        <further-classification edition="200601120250219B">G08B21/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳駿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林智鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃玉成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種車輛故障智能預測系統，包括：車內診斷系統、客戶端待診斷設備組、診斷管理平台、數據庫、智能分析引擎，其中，車內診斷系統的車內診斷引擎接收來自斷管理平台的診斷任務腳本並解析診斷任務腳本，且由車輛宿主交互模組、安全模組、診斷模組執行診斷任務，車內診斷引擎將診斷結果傳送至診斷管理平台，診斷管理平台再將診斷結果傳送至數據庫，數據庫儲存診斷結果並將診斷結果傳送至智能分析引擎，智能分析引擎分析診斷結果並推斷出車輛的故障潛在風險。再者，本發明亦提供一種車輛故障智能預測方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:車內診斷系統</p>  
        <p type="p">20:客戶端待診斷設備組</p>  
        <p type="p">30:診斷管理平台</p>  
        <p type="p">40:數據庫</p>  
        <p type="p">50:智能分析引擎</p>  
        <p type="p">101:車內診斷引擎</p>  
        <p type="p">103:車輛宿主交互模組</p>  
        <p type="p">105:安全模組</p>  
        <p type="p">107:診斷模組</p>  
        <p type="p">109:高階電子控制元件之統一診斷服務用戶端</p>  
        <p type="p">111:低階電子控制元件之統一診斷服務用戶端</p>  
        <p type="p">201:高階電子控制元件之統一診斷服務伺服端</p>  
        <p type="p">203:低階電子控制元件之統一診斷服務伺服端</p>  
        <p type="p">205:高階電子控制元件</p>  
        <p type="p">207:低階電子控制元件</p>  
        <p type="p">401:診斷資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="409" publication-number="202628038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有自我測試功能的驅動電路及其測試方法</chinese-title>  
        <english-title>DRIVER CIRCUIT WITH SELF-TEST FUNCTION AND TEST METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">G09G3/30</main-classification>  
        <further-classification edition="202001120250526B">H05B45/30</further-classification>  
        <further-classification edition="200601120250526B">G06F11/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇文銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEN-CHIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施立偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭又綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡靈櫻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, LING-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有自我測試功能的驅動電路及其測試方法。資料輸入電路耦接資料線以及測試電壓輸入端，電容耦接於資料輸入電路與功率開關的控制端之間，功率開關的第一端與第二端分別耦接第一操作電壓輸入端與發射開關，補償電路耦接於功率開關的控制端與第二端之間，第一開關耦接於補償電路與資料線之間，發射開關耦接於功率開關的第二端與第一畫素接點之間，第二畫素接點耦接第二操作電壓輸入端，第一畫素接點與第二畫素接點適於耦接顯示畫素。控制資料輸入電路、補償電路、第一開關以及發射開關的導通狀態。自資料線接收測試結果信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driver circuit with self-test function and a test method thereof are provided. A data input circuit is coupled to a data line and a test voltage input terminal. A capacitor is coupled between the data input circuit and a control end of a power switch. A first end and a second end of the power switch are respectively coupled to a first operating voltage input end and an emission switch. A compensation circuit is coupled between a control terminal and a second terminal of the power switch. A first switch is coupled between the compensation circuit and the data line. The emission switch is coupled between the second end of the power switch and a first pixel contact. A second pixel contact is coupled to a second operating voltage input terminal. The first pixel contact and the second pixel contact are suitable for coupling display pixels. Control conduction states of the data input circuit, the compensation circuit, the first switch and the emission switch. Receive a test result signal from the data line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:驅動電路</p>  
        <p type="p">102:補償電路</p>  
        <p type="p">104:資料輸入電路</p>  
        <p type="p">106:控制電路</p>  
        <p type="p">L1:顯示畫素</p>  
        <p type="p">T1:第一開關</p>  
        <p type="p">T2:第二開關</p>  
        <p type="p">T3:第三開關</p>  
        <p type="p">T4:第四開關</p>  
        <p type="p">T5:第五開關</p>  
        <p type="p">T6:功率開關</p>  
        <p type="p">T7:發射開關</p>  
        <p type="p">C1:電容</p>  
        <p type="p">P1:第一畫素接點</p>  
        <p type="p">P2:第二畫素接點</p>  
        <p type="p">DL1:資料線</p>  
        <p type="p">DC1:測試電壓</p>  
        <p type="p">VDD:第一操作電壓</p>  
        <p type="p">VSS:第二操作電壓</p>  
        <p type="p">S1、S2:開關控制信號</p>  
        <p type="p">EM1:發射控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="410" publication-number="202627913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體鋼瓶運輸排程系統</chinese-title>  
        <english-title>A GAS CYLINDER TRANSPORTATION SCHEDULING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250108B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250108B">G06Q10/047</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳駿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林益丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉濬祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決排程系統通常需要調度人員根據經驗和手動計算來制定運輸計劃，這不僅耗時且容易出錯等問題，本發明提供一種氣體鋼瓶運輸排程系統，包括以下模組：資料整合與分析模組，整合客戶地址、產品資訊、運輸限制等生成分析結果；路線規劃模組，基於GIS和即時交通數據設計最優路線；車輛與司機分配模組，依據路線和司機條件進行優化分配；動態調整模組，實時監控並在異常時調整路線和資源；客戶通知模組，提供自動通知和查詢功能；數據記錄與分析模組，記錄並分析運輸數據；系統學習與優化模組，利用機器學習提升運算邏輯，實現高效排程和持續優化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To solve the issues where scheduling systems typically require personnel to manually calculate and develop transportation plans based on experience, which is not only time-consuming but also prone to errors, the present invention provides a gas cylinder transportation scheduling system, including the following modules: Data Integration and Analysis Module: Integrates customer addresses, product information, transportation restrictions, etc., to generate analysis results. Route Planning Module: Designs the optimal route based on GIS and real-time traffic data. Vehicle and Driver Allocation Module: Optimizes allocation based on routes and driver conditions. Dynamic Adjustment Module: Monitors in real-time and adjusts routes and resources in case of abnormalities. Customer Notification Module: Provides automatic notifications and inquiry functions. Data Recording and Analysis Module: Records and analyzes transportation data. System Learning and Optimization Module: Uses machine learning to improve computational logic, achieving efficient scheduling and continuous optimization.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:氣體鋼瓶運輸排程系統</p>  
        <p type="p">11:資料整合與分析模組</p>  
        <p type="p">12:路線規劃模組</p>  
        <p type="p">13:車輛與司機分配模組</p>  
        <p type="p">14:動態調整模組</p>  
        <p type="p">15:客戶通知模組</p>  
        <p type="p">16:數據記錄與分析模組</p>  
        <p type="p">17:系統學習與優化模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="411" publication-number="202626411"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626411.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150266</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疲勞駕駛偵測系統及其方法</chinese-title>  
        <english-title>FATIGUE DRIVING DETECTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250126B">B60W40/08</main-classification>  
        <further-classification edition="201201120250126B">B60W40/09</further-classification>  
        <further-classification edition="200601120250126B">G08B21/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳駿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林益丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉濬祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種疲勞駕駛偵測系統及其方法。該方法包括一資料收集步驟：從一車輛收集一資料以持續監控一駕駛員的一行為和該車輛的一動態；一資料處理步驟：將該資料即時地傳輸到一雲端平台並進行一初步資料處理；一資料分析步驟：將該資料與一規則表進行比對並產生一比對結果，並與一班表資訊進行結合以評估該駕駛員的一疲勞狀態，判斷是否需要發出一警告提示；以及一資料回饋與優化步驟：記錄該資料、該比對結果以及該警告提示再透過一機器學習模型回饋至該雲端平台以優化該規則表。藉此確保警告的準確性和即時性，進而有效提升駕駛安全。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a fatigue driving detection system and method. The method involves a data collection step: collecting a data from a vehicle to continuously monitor a behavior of a driver and a dynamics of the vehicle; a data processing step: transmitting the data to a cloud platform in real time and performing a preliminary data processing; a data analysis step: comparing the data with a rule table and generating a comparison result, and combining it with a schedule information to evaluate a fatigue status of the driver and determine whether a warning prompt needs to be issued; and a data feedback and optimization step: recording the data, the comparison results and the warning prompt, and then feeding them back to the cloud platform through a machine learning model to optimize the rule table. This ensures the accuracy and timeliness of warnings, thereby effectively improving driving safety.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:疲勞駕駛偵測方法</p>  
        <p type="p">S110~S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="412" publication-number="202626308"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626308.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人感應設備及其觸覺感應器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">B25J13/08</main-classification>  
        <further-classification edition="200601120250203B">B25J19/02</further-classification>  
        <further-classification edition="200601120250203B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊裕勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊裕勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種機器人感應設備，包含：一觸覺感應器，該觸覺感應器具有一感測單元及一電容檢測單元，該感測單元包括一第一介電層、一第二導電層、一第三絕緣層、一第四導電層及一第五絕緣層，而該電容檢測單元，具有一正電極及一負電極，該正電極電性連接該感測單元的第二導電層，而該負電極電性連接該感測單元的該第四導電層，且檢測藉由一導電物體接近、觸摸或按壓該感測單元，使該感測單元的電容值發生變化，而取得變化的一電容數值；以及一處理單元，將該電容檢測單元檢測到所產生變化之該電容數值，用以建立變化之電容數值與感測該機器人的位置之一對應關係，再透過一 機器學習(ML)訓練模型，以得知該導電物體接近、觸摸或按壓的一實際位置及一觸感。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:機器人感應設備</p>  
        <p type="p">200:觸覺感應器</p>  
        <p type="p">10:感測單元</p>  
        <p type="p">20:電容檢測單元</p>  
        <p type="p">30:處理單元</p>  
        <p type="p">40:電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="413" publication-number="202625987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具雙向蹠背屈輔助的無電式外骨骼</chinese-title>  
        <english-title>NON-ELECTRIC EXOSKELETON WITH BIDIRECTIONAL PLANTAR-DORSIFLEXION ASSISTANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">A61F2/66</main-classification>  
        <further-classification edition="200601120250114B">A61H3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊俊融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHUANG, JYUN-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭楨樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾奕誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴伯修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, PO-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具雙向蹠背屈輔助的無電式外骨骼，其包含：一鞋體，其設置有底板及殼套；且殼套樞設有樞轉元件；該底板後端處之底端設有一足底氣囊；一支撐桿，其係對應樞接於該樞轉元件；一氣動儲能裝置，其具有連通足底氣囊支伸縮氣囊，並設置有彈性單元；該氣動儲能裝置一端設有一傳動元件；一連桿，其接設有一扭力彈性元件，且扭力彈性元件於相對連桿一端，係對應連接並彈性作用於該支撐桿；藉此，本發明係可供使用者穿套於足部，並於步行使腳跟落地時，透過足底氣囊充氣於該伸縮氣囊，並拉伸所述彈性單元，且透過站立時，令支撐桿朝鞋體樞轉以壓縮扭力彈性元件；藉以於解除站立並擺動推進而行走時，該扭力彈性元件將彈性復位，以提供踝關節扭轉之蹠屈助力；並當腳跟離地時，彈性單元將彈性復位，以對應透過傳動元件拉動鞋體，以進行踝關節進行背屈輔助，以將使用者之腳掌抬起，同時令伸縮氣囊對應充氣於該足底氣囊，使本發明可無須進行電力之耗損，即可完成蹠屈與背屈之步行輔助，並具有低成本、體積小、輕量化及可易於隱藏之特性，以提升使用者穿戴之意願。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a non-electric exoskeleton with bidirectional plantar-dorsiflexion assistance, comprising: a shoe body, which is equipped with a soleplate and a shell; the shell is pivotally mounted with a pivoting component; a foot sole airbag is located at the rear end of the soleplate; a support rod, which is pivotally connected to the pivoting component; a pneumatic energy storage device, which is connected to the foot sole airbag to extend and contract the airbag, and is equipped with an elastic unit; one end of the pneumatic energy storage device is provided with a transmission component; a connecting rod, which is connected with a torsional elastic component, and the torsional elastic component at the opposite end of the connecting rod is elastically connected to and acts on the support rod. Thus, the present invention can be worn by a user on the foot. When walking, the foot’s heel strikes the ground, inflating the foot sole airbag to extend the pneumatic airbag and stretch the elastic unit. While standing, the support rod rotates towards the shoe body to compress the torsional elastic component. When standing is relieved and walking progresses with swinging, the torsional elastic component elastically resets, providing dorsiflexion assistance to the ankle joint. Additionally, when the heel lifts off the ground, the elastic unit resets elastically, and the transmission component is pulled to move the shoe body, assisting the dorsiflexion of the ankle joint and lifting the user’s foot. Simultaneously, the pneumatic airbag inflates, providing plantar flexion assistance. The invention enables walking assistance for both plantar and dorsiflexion without the need for electric power consumption. It has the advantages of low cost, small size, light weight, and easy concealment, which enhances the user’s willingness to wear it.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鞋體</p>  
        <p type="p">11:底板</p>  
        <p type="p">111:活動板</p>  
        <p type="p">12:殼套</p>  
        <p type="p">13:樞轉元件</p>  
        <p type="p">14:後板</p>  
        <p type="p">2:足底氣囊</p>  
        <p type="p">3:支撐桿</p>  
        <p type="p">31:承接板</p>  
        <p type="p">4:氣動儲能裝置</p>  
        <p type="p">41:定位板</p>  
        <p type="p">42:伸縮氣囊</p>  
        <p type="p">43:彈性單元</p>  
        <p type="p">44:導管</p>  
        <p type="p">441:氣閥</p>  
        <p type="p">5:傳動元件</p>  
        <p type="p">6:連桿</p>  
        <p type="p">7:扭力彈性元件</p>  
        <p type="p">8:驅動氣囊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="414" publication-number="202627265"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627265.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維助劑組成物、纖維基材及回收纖維基材的方法</chinese-title>  
        <english-title>FIBER AUXILIARY COMPOSITION, FIBER BASE MATERIAL, AND METHOD FOR RECYCLING FIBER BASE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">D21H17/36</main-classification>  
        <further-classification edition="200601120250402B">D21H17/37</further-classification>  
        <further-classification edition="200601120250402B">D21H17/47</further-classification>  
        <further-classification edition="200601120250402B">D21H17/55</further-classification>  
        <further-classification edition="200601120250402B">D21H17/56</further-classification>  
        <further-classification edition="200601120250402B">D21H21/20</further-classification>  
        <further-classification edition="200601120250402B">D21C5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華紙漿股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG HWA PULP CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉人銪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱文德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, WEN TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種纖維助劑組成物、一種纖維基材及一種回收纖維基材的方法。纖維助劑組成物包括永久性濕強劑及第一暫時性濕強劑，其中永久性濕強劑包括改性澱粉、醛基化合物、脲基化合物、醚基化合物、胺基樹脂、聚醯胺環氧氯丙烷或其組合，第一暫時性濕強劑係由醛及具有至少一反應性官能基的化合物反應而成。纖維基材包括複數條纖維及附著於纖維上的纖維助劑組成物。回收纖維基材的方法包括將纖維基材浸泡於含有解離劑的溶液中以形成混合液，以及進行散漿製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a fiber auxiliary composition, a fiber base material, and a method of recycling the fiber base material. The fiber auxiliary composition includes a permanent wet strength agent and a first temporary wet strength agent, in which the permanent wet strength agent comprises a modified starch, a compound with an aldehyde group, a compound with an ureido group, a comound with an ether group, an amino resin, a polyamide epichlorohydrin, or combinations thereof, and the first temporary wet strength agent is formed by reacting an aldehyde and a compound with at least one reactive functional group. The fiber base material includes a plurality of fibers and the fiber auxiliary composition attached to the fibers. The method for recycling the fiber base material includes soaking the fiber base material in a solution containing a disintegration agent to form a mixed liquid and performing a pulping process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">310、320:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="415" publication-number="202626950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>造粒母料之組成物</chinese-title>  
        <english-title>COMPOSITION OF GRANULATION MASTERBATCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C08L67/00</main-classification>  
        <further-classification edition="200601120250402B">C08K5/103</further-classification>  
        <further-classification edition="200601120250402B">C08L79/08</further-classification>  
        <further-classification edition="200601120250402B">C08L91/06</further-classification>  
        <further-classification edition="200601120250402B">C08J3/12</further-classification>  
        <further-classification edition="200601120250402B">B29B9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人紡織產業綜合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴偉仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周上智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種造粒母料之組成物包括液晶聚酯、改質劑及流動促進劑。改質劑包括氧化型聚乙烯蠟、超支化羧基聚合物、聚醯亞胺化合物或其組合。流動促進劑包括季戊四醇油酸酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition of granulation masterbatch includes a liquid crystal polyester, a modifier, and a flow promoter. The modifier includes an oxidized polyethylene wax, a hyperbranched carboxylic polymer, a polyimide compound, or combinations thereof. The flow promoter includes a pentaerythritol oleate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="416" publication-number="202628352"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628352.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>放大器電路</chinese-title>  
        <english-title>AMPLIFIER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F1/34</main-classification>  
        <further-classification edition="200601120250303B">H03F3/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昀樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUN-LE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳巍仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-ZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝文獻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIE, WEN-SHIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUNGPIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種放大器電路。放大器電路包含第一轉導放大器及第一轉阻放大器。第一轉導放大器用以接收第一輸入訊號。第一轉阻放大器的第一輸入端耦接第一轉導放大器的第一輸出端。第一轉阻放大器包含第一被動回授結構及第一主動回授結構。第一被動回授結構包含第一電阻器，第一電阻器耦接在第一轉阻放大器的第一輸出端及第一轉阻放大器的第一輸入端之間。第一主動回授結構包含第一反相器，第一反相器的輸出端耦接第一轉阻放大器的第一輸入端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An amplifier circuit is provided. The amplifier circuit includes a first transconductance amplifier and a first transimpedance amplifier. The first transconductance amplifier receives a first signal. A first input terminal of the transimpedance amplifier is coupled to a first output terminal of the transconductance amplifier. The first transimpedance amplifier includes a first passive feedback structure and a first active feedback structure. The first passive feedback structure includes a first resistor. The first resistor is coupled between the first output terminal of the transimpedance amplifier and the first input terminal of the transimpedance amplifier . The first active feedback structure includes a first inverter. An output terminal of the first inverter is coupled to the first input terminal of the first transimpedance amplifier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電路</p>  
        <p type="p">100:電路</p>  
        <p type="p">110:轉導放大器電路</p>  
        <p type="p">111:反相器</p>  
        <p type="p">112:反相器</p>  
        <p type="p">120:轉阻放大器電路</p>  
        <p type="p">121:反相器</p>  
        <p type="p">122:反相器</p>  
        <p type="p">123:反相器</p>  
        <p type="p">124:反相器</p>  
        <p type="p">I1:輸入端</p>  
        <p type="p">I2:輸入端</p>  
        <p type="p">N1:節點</p>  
        <p type="p">N2:節點</p>  
        <p type="p">O1:輸出端</p>  
        <p type="p">O2:輸出端</p>  
        <p type="p">R1:電阻器</p>  
        <p type="p">R2:電阻器</p>  
        <p type="p">VIP:電壓訊號</p>  
        <p type="p">VIN:電壓訊號</p>  
        <p type="p">VOP:電壓訊號</p>  
        <p type="p">VON:電壓訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="417" publication-number="202627528"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627528.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150278</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種水中氚活度濃度之自動量測系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR AUTOMATIC MONITORING OF TRITIUM ACTIVITY CONCENTRATION IN WATER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G01T1/178</main-classification>  
        <further-classification edition="200601120250512B">G01T1/204</further-classification>  
        <further-classification edition="200601120250512B">G01N35/10</further-classification>  
        <further-classification edition="200601120250512B">G05B19/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家原子能科技研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈錦昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李思偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種水中氚活度濃度之自動量測系統及方法。本發明的水中氚活度濃度之自動量測系統，應用於水體，包含樣品水供應單元、閃爍液供應單元、液體混合單元、氚活度液體閃爍分析儀、控制模組以及操作模組。樣品水供應單元與水體連接。液體混合單元分別與樣品水供應單元及閃爍液供應單元連接。氚活度液體閃爍分析儀與液體混合單元連接。控制模組分別與樣品水供應單元及閃爍液供應單元通訊連接。操作模組分別與控制模組及氚活度液體閃爍分析儀通訊連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic measurement system and method for tritium activity concentration in water are provided. The automatic measurement system for tritium activity concentration in water of the present invention is applied to water bodies and includes a sample water supply unit, a scintillation liquid supply unit, a liquid mixing unit, a tritium activity liquid scintillation analyzer, a control module and an operation module. The sample water supply unit is connected to the water body. The liquid mixing unit is connected to the sample water supply unit and the scintillation liquid supply unit respectively. The tritium activity liquid scintillation analyzer is connected to the liquid mixing unit. The control module is communicated with the sample water supply unit and the scintillation liquid supply unit respectively. The operation module is communicated with the control module and the tritium activity liquid scintillation analyzer respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:樣品水供應單元</p>  
        <p type="p">110:淨水單元</p>  
        <p type="p">200:閃爍液供應單元</p>  
        <p type="p">300:液體混合單元</p>  
        <p type="p">400:氚活度液體閃爍分析儀</p>  
        <p type="p">500:控制模組</p>  
        <p type="p">600:操作模組</p>  
        <p type="p">800:水體</p>  
        <p type="p">900:水中氚活度濃度之自動量測系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="418" publication-number="202626139"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626139.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>深腦電刺激演算系統、其操作方法及非暫態電腦可讀取儲存媒體</chinese-title>  
        <english-title>DEEP BRAIN STIMULATION ALGORITHM SYSTEM, OPERATION METHOD OF THE SAME AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">A61N1/04</main-classification>  
        <further-classification edition="200601120250303B">A61B5/00</further-classification>  
        <further-classification edition="201801120250303B">G16H50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康培玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, PEI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂冠毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KUAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示文件提供一種深腦電刺激演算系統，包含深腦電刺激裝置。深腦電刺激裝置用以產生電刺激訊號至受測對象，並根據刺激參數調整電刺激訊號。深腦電刺激裝置包含訊號感測模組、控制模組、個體化模組及調整模組。訊號感測模組用以自受測對象感測局部場電位訊號。控制模組用以產生刺激參數，並根據調整參數調整刺激參數。個體化模組用以根據病歷資料及局部場電位訊號產生預測結果。調整模組用以使用全頻譜分析來比較局部場電位訊號及預測結果，以產生調整參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A deep brain stimulation algorithm system is provided in the present disclosure. The deep brain stimulation algorithm system comprises a deep brain stimulation device configured to generate an electrical stimulation signal to a subject and adjust the electrical stimulation signal based on a stimulation parameter. The deep brain stimulation device comprises a signal sensing module, a control module, a personalization module and an adjustment module. The signal sensing module is configured to sense a local field potential signal from the subject. The control module is configured to generate the stimulation parameter, and configured to adjust the stimulation parameter based on an adjustment parameter. The personalization module is configured to generate a prediction result based on the medical data and the local field potential signal. The adjustment module is configured to compare the local field potential signal and the prediction result by using a full spectrum analysis to, so as to generate the adjustment parameter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:深腦電刺激演算系統</p>  
        <p type="p">110:深腦電刺激裝置</p>  
        <p type="p">111:訊號感測模組</p>  
        <p type="p">112:控制模組</p>  
        <p type="p">113:個體化模組</p>  
        <p type="p">114:調整模組</p>  
        <p type="p">115:無線傳輸模組</p>  
        <p type="p">116:電刺激模組</p>  
        <p type="p">120:伺服端</p>  
        <p type="p">ADP:調整參數</p>  
        <p type="p">MR:病歷資料</p>  
        <p type="p">PAS:調整訊號</p>  
        <p type="p">PRE:預測結果</p>  
        <p type="p">STP:刺激參數</p>  
        <p type="p">STS:電刺激訊號</p>  
        <p type="p">VT:受測對象</p>  
        <p type="p">VTS:局部場電位訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="419" publication-number="202627116"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627116.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150284</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高溫熔融鋼爐碴之處理方法</chinese-title>  
        <english-title>METHOD FOR PROCESSING HIGH TEMPERATURE MOLTEN STEEL SLAGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">C22B7/04</main-classification>  
        <further-classification edition="200601120250108B">C04B5/06</further-classification>  
        <further-classification edition="202201120250108B">B09B3/30</further-classification>  
        <further-classification edition="202201120250108B">B09B3/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中聯資源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHC RESOURCES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許伯良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, BO-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐登科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TENG-KER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明高溫熔融鋼爐碴之處理方法，其包含預處理、改質及養護等步驟；其中，該預處理步驟中，將高溫熔融鋼爐碴導入一處理系統中，以使該鋼爐碴於該處理系統轉動過程中，充分地與水接觸，同時受複數作動件破碎至粒徑為4.75mm以下，另於該改質步驟中，取該鋼爐碴重量1~10wt%之有機酸鹽、適量的水與該鋼爐碴均勻混合，再於該養護步驟中進行靜置，從而提升該鋼爐碴的抗壓強度與體積穩定性，使該鋼爐碴兼具安定化與活性，同時簡化整體流程，以及減少所需時間與成本，進而達到該鋼爐碴的資源再利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing high temperature molten steel slags includes a preprocessing step, a modifying step, and a curing step. The preprocessing step includes placing the high temperature molten steel slags into a processing system so that the steel slags are in contact with water fully during a rotation of the processing system. Simultaneously, the steel slags are crushed by a plurality of processing units to have a particle size less than 4.75mm. The modifying step includes mixing the preprocessed steel slags, water, and organic acid salt evenly. The adding amount of the organic acid salt is calculated by 1~10wt% of the steel slags. The curing step is to leave the modified steel slags and stand awhile, thereby improving the compressive strength and the volume stability of the steel slags, attaining the stabilization and the activation of the steel slags simultaneously, simplifying the overall processing process, reducing processing time and costs, and achieving the resource reuse and recycling of the steel slags.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:高溫熔融鋼爐碴之處理方法</p>  
        <p type="p">31:預處理步驟</p>  
        <p type="p">32:改質步驟</p>  
        <p type="p">33:養護步驟</p>  
        <p type="p">4:處理系統</p>  
        <p type="p">41:破碎裝置</p>  
        <p type="p">42:冷卻裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="420" publication-number="202626325"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626325.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>均質發泡之超臨界射出成型方法及其裝置</chinese-title>  
        <english-title>A SUPERCRITICAL INJECTION MOLDING METHOD AND A DEVICE THEREOF CAPABLE OF HOMOGENIZING THE FOAMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">B29C45/46</main-classification>  
        <further-classification edition="200601120250325B">B29C45/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天崗精機科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN KANG CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鳳梧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, FONG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明均質發泡之超臨界射出成型方法及其裝置，該方法係包含有準備步驟、注塑步驟及成型步驟；該準備步驟主要在於一模具上設置有一緩衝器，且該模具係供一注塑器注入發泡材料於其中，並利用該緩衝器具有一與該模具之灌注通道連通之緩衝通道，使得於該注塑步驟將發泡材料透過該灌注通道進入該模具之成形槽後，於該成型步驟中則帶動該緩衝器之洩壓桿呈移動，使該洩壓桿之一部分往該模具外位移，而使部份之該發泡材料於膨脹發泡過程中可流入該緩衝通道內，得以確實避免發泡材料於發泡成型過程產生擠壓且呈過度集中於該灌注通道周邊處缺失，有效避免該成型步驟所得之發泡物產生非均質密度狀態，以改善成型後該發泡物之製造品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a supercritical injection molding method and a device thereof capable of homogenizing the foaming. The method includes a preparation step, an injection step, and a molding step. The preparation step mainly preparing a buffer device disposed on a mold and also preparing an injection device adapted to inject a foaming material into the mold. The buffer device includes a buffering channel communicating with an injecting channel of the mold. The injection step includes injecting the foaming channel from the injecting channel into a forming cavity of the mold. The molding step includes moving a pressure relief shaft of the buffer device so that a partial portion of the pressure relief shaft is moved to a place outside the mold and allowing some of the foaming material to flow into the buffering channel during the expansion and foaming process of the foaming material, thereby preventing the foaming material from getting crowded and gathering unduly around the injecting channel during the foam molding process. Accordingly, a foam product obtained in the molding step can prevent the occurrence of the non-homogeneous density efficiently so that the manufacturing quality of the foam product is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:均質發泡之超臨界射出成型方法</p>  
        <p type="p">31:準備步驟</p>  
        <p type="p">32:注塑步驟</p>  
        <p type="p">33:成型步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="421" publication-number="202627964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150290</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於區塊鏈的資產信託合約管理系統與方法</chinese-title>  
        <english-title>MANAGEMENT SYSTEM AND METHOD FOR CONTRACTS OF ASSET TRUST BASED ON BLOCKCHAIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250107B">G06Q40/06</main-classification>  
        <further-classification edition="202001120250107B">G16Y10/45</further-classification>  
        <further-classification edition="202001120250107B">G16Y40/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江子榆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TZU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於區塊鏈的資產信託合約管理系統與方法。此管理系統包含：通訊裝置、資料庫以及處理器。通訊裝置係配置以連接至公有區塊鏈網路以及私有區塊鏈網路。資料庫儲存有信託合約資訊。處理器係電性連接至上述通訊裝置以及資料庫，以利用區塊鏈技術來管理資料庫所儲存的信託合約資訊。此管理方法包含：接收來自委託人之信託合約修改請求；在接收信託合約修改請求後，對委託人進行身分認證；以及當委託人通過身分認證後，利用公有區塊鏈網路之代理合約(proxy contract)來提供信託合約修改服務給委託人。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A management system and a management method for contracts of asset trust based on blockchain are provided. The management system includes: a communication device, a database and a processor. The communication device is configured to be connected to a public blockchain network and a private blockchain network. The database stores information of a trust contract. The processor is electrically connected to the communication device and the database to use blockchain technology to manage the information of the asset trust stored in the data base. The management method includes: receiving a request for revising the trust contract from a client; performing identity authentication with respect to the client after receiving the request for revising the trust contract; and using a proxy contract of the public blockchain network to provide a service of revising the trust contract to the client after the identity authentication is passed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基於區塊鏈的資產信託合約管理系統</p>  
        <p type="p">110:通訊裝置</p>  
        <p type="p">120:資料庫</p>  
        <p type="p">122:數位帳簿</p>  
        <p type="p">124:信託合約子資料庫</p>  
        <p type="p">130:處理器</p>  
        <p type="p">200:委託人</p>  
        <p type="p">300:受益人</p>  
        <p type="p">PLNW:公有區塊鏈網路</p>  
        <p type="p">PVNW:私有區塊鏈網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="422" publication-number="202627307"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627307.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可配重平衡之改良型蓋子之轉子裝置</chinese-title>  
        <english-title>THIS ROTOR DEVICE WITH AN IMPROVED LID FOR COUNTERBALANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">F04D19/04</main-classification>  
        <further-classification edition="200601120250926B">F04D29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景澤國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温斯忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐敏嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温景棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温子承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張基祖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係揭露具有可配重平衡之改良型蓋子之轉子裝置，係用於設置於渦輪分子式真空泵。具有可配重平衡之改良型蓋子之轉子裝置係包含旋轉軸、轉子本體、蓋子以及配重單元;旋轉軸之一端系設置於渦輪分子式真空泵，旋轉軸之另一端系連結於轉子本體，且轉子本體相對於旋轉軸之一端系具有鎖附空間；蓋子係包含加固單元、連結單元及配重單元，連結單元之一端系設置於旋轉軸之一端，加固單元之一端系連結該連結單元之另一端；配重單元系設置於連結單元上，且位於該加固單元及旋轉軸之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a rotor device with an improved lid featuring adjustable counterbalance, designed for use in a turbo molecular vacuum pump. This rotor device with an improved lid for counterbalance includes a rotating shaft, a rotor body, a lid, and a counterbalance unit. One end of the rotating shaft is positioned within the turbo molecular vacuum pump, while the other end is connected to the rotor body, with a locking space provided relative to this end of the rotating shaft. The lid comprises a reinforcement unit, a connecting unit, and a counterbalance unit. One end of the connecting unit is positioned at one end of the rotating shaft, and one end of the reinforcement unit is connected to the other end of the connecting unit. The counterbalance unit is installed on the connecting unit and is located between the reinforcement unit and the rotating shaft.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:渦輪分子式真空泵</p>  
        <p type="p">12:旋轉軸</p>  
        <p type="p">13:轉子本體</p>  
        <p type="p">14:鎖附空間</p>  
        <p type="p">15:蓋子</p>  
        <p type="p">16:連結單元</p>  
        <p type="p">17:配重單元</p>  
        <p type="p">18:加固單元</p>  
        <p type="p">19:固定元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="423" publication-number="202627996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理感興趣區域的圖像增強裝置與圖像增強方法</chinese-title>  
        <english-title>IMAGE ENHANCEMENT DEVICE AND IMAGE ENHANCEMENT METHOD FOR PROCESSING REGION OF INTEREST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250526B">G06V10/25</main-classification>  
        <further-classification edition="202201120250526B">G06V20/52</further-classification>  
        <further-classification edition="202401120250526B">G06T5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商星宸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹然磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, RAN-LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張燕妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YAN-NI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張益彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">圖像增強裝置包含預處理電路、智慧處理器以及處理器。預處理電路對一輸入圖像資料進行預處理，以產生一第一圖像資料。智慧處理器偵測該第一圖像資料中的至少一感興趣區域以產生至少一原始區域資料，並提升該至少一原始區域資料的畫質以產生至少一增強區域資料。處理器根據一混合比例混合該至少一原始區域資料以及該至少一增強區域資料以產生至少一混合區域資料，並以該至少一混合區域資料替換該第一圖像資料中的該至少一感興趣區域以產生一輸出圖像資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image enhancement device includes a preprocessing circuit, an intelligence processing unit, and a processor. The preprocessing circuit preprocesses input image data to generate first image data. The intelligence processing unit detects at least one region of interest in the first image data to generate at least one original region data, and enhances the image quality of the at least one original region data to generate at least one enhanced region data. The processor mixes the at least one original region data and the at least one enhanced region data according to a blending ratio to generate at least one mixed region data, and replaces the at least one region of interest in the first image data with the at least one mixed region data to generate output image data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:圖像增強裝置</p>  
        <p type="p">101:圖像感測器</p>  
        <p type="p">110:預處理電路</p>  
        <p type="p">120:處理器</p>  
        <p type="p">130:智慧處理器</p>  
        <p type="p">140:記憶體</p>  
        <p type="p">BR:混合比例</p>  
        <p type="p">D1:圖像資料</p>  
        <p type="p">D2:至少一原始區域資料</p>  
        <p type="p">D3:至少一增強區域資料</p>  
        <p type="p">D4:至少一混合區域資料</p>  
        <p type="p">DIN:輸入圖像資料</p>  
        <p type="p">DO:輸出圖像資料</p>  
        <p type="p">NL:過渡帶的總層數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="424" publication-number="202627838"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627838.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離散餘弦變換處理裝置與離散餘弦變換處理方法</chinese-title>  
        <english-title>DISCRETE COSINE TRANSFORM PROCESSING DEVICE AND DISCRETE COSINE TRANSFORM PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250321B">G06F17/14</main-classification>  
        <further-classification edition="200601120250321B">G06F17/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商星宸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">離散餘弦變換處理裝置包含加法器、暫存器、多個乘積累加運算電路、累加器、運算控制電路以及輸出電路。加法器根據第一置換矩陣處理第一輸入資料，以產生第二輸入資料。暫存器儲存運算矩陣。運算控制電路根據對應於單位維度的矩陣乘法運算配置多個乘積累加運算電路與該累加器，以經由多個乘積累加運算電路與累加器將運算矩陣與第二輸入資料進行相乘與累加，從而產生第一運算結果。輸出電路根據第二置換矩陣處理第一運算結果，以產生第二運算結果，其中該第一置換矩陣、該運算矩陣以及該第二置換矩陣是自一離散餘弦變換矩陣分解而來。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A discrete cosine transform processing device includes an adder, a register, a plurality of multiply-accumulate operation circuits, an accumulator, an operation control circuit, and an output circuit. The adder processes first input data according to a first permutation matrix to generate second input data. The register stores an operation matrix. The operation control circuit configures the plurality of multiply-accumulate operation circuits and the accumulator based on matrix multiplication operations corresponding to an unit dimension, such that the operation matrix and the second input data are multiplied and accumulated via the plurality of multiply-accumulate operation circuits and the accumulator to generate a first operation result. The output circuit processes the first operation result according to a second permutation matrix to generate a second operation result, in which the first permutation matrix, the operation matrix, and the second permutation matrix are derived from the decomposition of a discrete cosine transform matrix.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:離散餘弦變換處理裝置</p>  
        <p type="p">110:加法器</p>  
        <p type="p">120:選擇電路</p>  
        <p type="p">125:暫存器</p>  
        <p type="p">130:乘積累加運算電路</p>  
        <p type="p">140:累加器</p>  
        <p type="p">150:運算控制電路</p>  
        <p type="p">160:輸出電路</p>  
        <p type="p">A:運算矩陣</p>  
        <p type="p">DIN,S:輸入資料</p>  
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;,P&lt;sub&gt;r&lt;/sub&gt;:置換矩陣</p>  
        <p type="p">R1,R2:運算結果</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="425" publication-number="202627630"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627630.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素結構</chinese-title>  
        <english-title>PIXEL STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250226B">G02F1/1333</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江丞偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素結構包括第一控制件群、第二控制件群、導電結構、第一介電層及畫素元件。畫素元件電性連接於導電結構、第一控制件群及第二控制件群。第一控制件群包括第一薄膜電晶體。第一介電層設置且覆蓋基板、第一控制件群及導電結構之上。第二控制件群包括第二薄膜電晶體。導電結構的至少一部分於基板上的垂直投影面積大於或實質上等於第二薄膜電晶體的第二含矽半導體層於基板上的垂直投影面積。此外，另一種畫素結構也被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel structure includes a first control component group, a second control component group, a conductive structure, a first dielectric layer and a pixel element. The pixel element is electrically connected to the conductive structure, the first control component group and the second control component group. The first control component group includes a first thin film transistor. The first dielectric layer is disposed on and covers the substrate, the first control component group and the conductive structure. The second control element group includes a second thin film transistor. A normal projection area of ​​at least one portion of the conductive structure on a substrate is greater than or substantially equal to a normal projection area of ​​a second silicon-containing semiconductor layer of the second thin film transistor on the substrate. In addition, another pixel structure is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:畫素結構</p>  
        <p type="p">110:基板</p>  
        <p type="p">120、140:緩衝層</p>  
        <p type="p">130:導電層</p>  
        <p type="p">150:第一含矽半導體層</p>  
        <p type="p">152、154、172、174:部分</p>  
        <p type="p">160:第一閘極介電層</p>  
        <p type="p">170:第一導電層</p>  
        <p type="p">180:第二介電層</p>  
        <p type="p">200:第一介電層</p>  
        <p type="p">200a:平整表面</p>  
        <p type="p">210:第二含矽半導體層</p>  
        <p type="p">220:第二閘極介電層</p>  
        <p type="p">230:第二導電層</p>  
        <p type="p">240:介電層</p>  
        <p type="p">252:第一源極</p>  
        <p type="p">254:第一汲極</p>  
        <p type="p">256:第二源極</p>  
        <p type="p">258:第二汲極</p>  
        <p type="p">C:導電結構</p>  
        <p type="p">E1、E2:電極</p>  
        <p type="p">TA:第一薄膜電晶體</p>  
        <p type="p">TAc:第一閘極</p>  
        <p type="p">TB:第二薄膜電晶體</p>  
        <p type="p">TBc:第二閘極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="426" publication-number="202628111"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628111.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電壓產生電路</chinese-title>  
        <english-title>VOLTAGE GENERATING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">G11C16/30</main-classification>  
        <further-classification edition="200601120250407B">G11C5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣汝安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, JU-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電壓產生電路，包括比較器、源極隨耦電路以及輸出電路。比較器經配置以接收回授電壓及參考電壓，根據回授電壓及參考電壓之間的比較結果，輸出控制信號。源極隨耦電路經配置以受控於控制信號而調整輸出至比較器的回授電壓，使回授電壓等於參考電壓，並根據回授電壓提供驅動電壓。輸出電路操作在電源電壓與參考電壓之間，經配置以根據驅動電壓產生箝位電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A voltage generating circuit including a comparator, a source follower circuit and an output circuit is provided. The comparator is configured to receive a feedback voltage and a reference voltage, and output a control signal according to a comparison result between the feedback voltage and the reference voltage. The source follower circuit is configured to be controlled by a control signal to adjust the feedback voltage output to the comparator so that the feedback voltage is equal to the reference voltage, and provide a drive voltage according to the feedback voltage. The output circuit operates between a power supply voltage and the reference voltage and is configured to generate a clamp voltage based on the drive voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電壓產生電路</p>  
        <p type="p">110:比較器</p>  
        <p type="p">120:源極隨耦電路</p>  
        <p type="p">122:電流源電路</p>  
        <p type="p">130:輸出電路</p>  
        <p type="p">ID:驅動電流</p>  
        <p type="p">IREF:參考電流</p>  
        <p type="p">M1~M5:第一至第五電晶體</p>  
        <p type="p">N_F:回授節點</p>  
        <p type="p">R:電阻</p>  
        <p type="p">SCT:控制信號</p>  
        <p type="p">VBLCLAMP:箝位電壓</p>  
        <p type="p">VD:驅動電壓</p>  
        <p type="p">VFB:回授電壓</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">VP:電源電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="427" publication-number="202626756"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626756.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可固化組合物及固化層</chinese-title>  
        <english-title>CURABLE COMPOSITION AND CURED LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C08F2/44</main-classification>  
        <further-classification edition="200601120250402B">C08F220/28</further-classification>  
        <further-classification edition="200601120250402B">C08F220/32</further-classification>  
        <further-classification edition="200601120250402B">C08F220/58</further-classification>  
        <further-classification edition="200601120250402B">C08F222/20</further-classification>  
        <further-classification edition="200601120250402B">C08F290/06</further-classification>  
        <further-classification edition="200601120250402B">C09D175/16</further-classification>  
        <further-classification edition="200601120250402B">C09D4/00</further-classification>  
        <further-classification edition="201801120250402B">C09D7/61</further-classification>  
        <further-classification edition="201801120250402B">C09D7/63</further-classification>  
        <further-classification edition="200601120250402B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING-TZUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-JHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張德宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余陳正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張金華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雙慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHUANG-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種組合物及固化層。該組合物包含100重量份的第一單體、1至10重量份的第二單體、10至30重量份的聚氨酯丙烯酸酯、以及15至35重量份的封閉異氰酸酯，其中該第一單體係單丙烯酸酯基化合物(monoacrylate compound)、單甲基丙烯酸酯基化合物(monomethacrylate compound)、乙烯基芳香族化合物(vinyl aromatic compound)、氧雜環丁烷(oxetane)化合物、馬來酸酐maleic anhydride)、二環戊二烯(dicyclopentadiene)、N-乙烯基吡咯烷酮(N-vinylpyrrolidone)、N-乙烯基甲醯胺(N-vinylformamide)、或上述之組合；以及，該第二單體係具有至少二個反應官能基的醇類化合物，其中該反應官能基係丙烯酸酯基(acrylate group)、或甲基丙烯酸酯基(acrylate group)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition and a cured layer are provided. The composition includes 100 parts by weight of a first monomer, 1 to 10 parts by weight of a second monomer, 10 to 30 parts by weight of an acrylic polyurethane, and 15 to 35 parts by weight of a blocked isocyanate compound. The first monomer is a monoacrylate compound, a monomethacrylate compound, a vinyl aromatic compound, an oxetane compound, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, N-vinylformamide, or a combination thereof. The second monomer is an alcohol compound having at least two reactive functional groups, wherein the reactive functional group is an acrylate group or methacrylate group.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="428" publication-number="202627441"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627441.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>石墨塊材的耐水解性之評估方法</chinese-title>  
        <english-title>METHOD FOR EVALUATING HYDROLYSIS RESISTANCE OF GRAPHITE BLOCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">G01N5/00</main-classification>  
        <further-classification edition="200601120250324B">G01N5/04</further-classification>  
        <further-classification edition="201701120250324B">C01B32/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許仁勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JEN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭佳祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHIA-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種石墨塊材的耐水解性之評估方法，其係對石墨塊材的試片進行熱水水解步驟，並分析經或未經熱水水解步驟的試片之失重差值，藉此評估石墨塊材的耐水解性，以篩選適用於高溫製程的石墨工件之石墨塊材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for evaluating hydrolysis resistance of a graphite block. The method includes performing a hot water hydrolyzing step on a test piece of the graphite block, and then analyzing the differences of weight losses of the test pieces with or without the hot water hydrolyzing step. The method can evaluate the hydrolysis resistance of the graphite blocks, and facilitate screening the graphite block as a graphite workpiece used in a high-temperature process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:評估方法</p>  
        <p type="p">110,120,130,140,150:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="429" publication-number="202626326"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626326.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>均質發泡之超臨界射出成型方法</chinese-title>  
        <english-title>A SUPERCRITICAL INJECTION MOLDING METHOD CAPABLE OF HOMOGENIZING THE FOAMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">B29C44/58</main-classification>  
        <further-classification edition="200601120250203B">B29C44/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天崗精機科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN KANG CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鳳梧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, FONG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明均質發泡之超臨界射出成型方法，其係包含有準備步驟、注塑步驟及成型步驟；其主要在於該注塑步驟中，由注塑器之注塑單元輸出發泡材料至模具後，該注塑器之移動單元將帶動該注塑單元移動，而使該注塑單元與該模具產生一緩衝距離，且該模具與該注塑單元間因該緩衝距離而產生一緩衝空間，該發泡材料於一成型槽內膨脹發泡過程中，部份之該發泡材料部分可由一灌注通道釋出至該緩衝空間上，以避免該發泡材料於發泡成型過程過度集中且受到擠壓情事，進而確保經由該成型步驟後所得之發泡物可具備均質化密度，因而可有效改善該發泡物之製造品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A supercritical injection molding method capable of homogenizing the foaming includes a preparation step, an injection step, and a molding step. The injection step includes injecting a foaming material from an injecting unit of an injection device into a mold and moving the injecting unit with a movable unit of the injection device, thereby forming a buffering distance between the injecting unit and the mold. A buffering space is formed between the mold and the injecting unit because of the buffering distance. Some of the foaming material can be released from an injecting channel into the buffering space during the expansion and foaming process of the foaming material in a forming cavity, which prevents the foaming material from gathering unduly and getting crowded during the foam molding process, thereby allowing a foam product obtained in the molding step to have the homogeneous density and improving the manufacturing quality of the foam product efficiently.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:均質發泡之超臨界射出成型方法</p>  
        <p type="p">31:準備步驟</p>  
        <p type="p">32:注塑步驟</p>  
        <p type="p">33:成型步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="430" publication-number="202628387"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628387.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自我調適以優化多通訊模組分頻雙工共存的方法與通訊系統</chinese-title>  
        <english-title>SELF-ADAPTATION METHOD FOR OPTIMIZING MULTIPLE COMMUNICATION MODULES CO-EXISTENCE IN FREQUENCY-DIVISION DUPLEXING AND COMMUNICATION SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H04L5/22</main-classification>  
        <further-classification edition="200901120250401B">H04W24/02</further-classification>  
        <further-classification edition="200901120250401B">H04W88/06</further-classification>  
        <further-classification edition="200901120250401B">H04W16/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何杰霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIEH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡思懿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SSU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出一種自我調適以優化多通訊模組分頻雙工共存的方法，方法運行在具有至少通訊模組的通訊系統中，通訊系統先運行在分時雙工模式下，取得至少兩個通訊模組產生的通訊數據，建立該通訊系統運行在一分頻雙工模式下的基準比較值，通訊系統接著進入參數調整階段，並取得至少兩個通訊模組的射頻參數。如此，即可根據基準比較值，週期性地執行關鍵績效指標把關，其中將根據一或多個參考指標評估執行或停止一分頻雙工調適流程，以確認是否調整至少兩個通訊模組的射頻參數，最終取得一組適合通訊系統運行在分頻雙工模式下的射頻參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A self-adaptation method for optimizing multiple communication modules co-existence in frequency-division duplexing is provided. The method is operated in a communication system having at least two communication modules. Communication data generated by the communication modules is obtained when the communication system is operated under a time-division duplexing mode. The communication data is used to establish a standard comparison value for a frequency-division duplexing mode. The communication system then enters a parameter-adjustment phase, and radio-frequency parameters for the communication modules can be obtained. Thus, based on the standard comparison value, key performance indicator check is periodically performed for assessing whether to start or to stop a frequency-divisional duplexing training process according to one or more reference indicators so as to determine whether the radio-frequency parameters need to be adjusted. A set of radio-frequency parameters suitably operating the communication system under the frequency-division duplexing mode are finally obtained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S501:通訊系統運行分時雙工模式</p>  
        <p type="p">S503:擷取通訊模組的訊號強度與網路吞吐量</p>  
        <p type="p">S505:進入參數調整階段，取得射頻參數</p>  
        <p type="p">S507:選擇欲調整的初始值與調整區間</p>  
        <p type="p">S509:引入週期性的關鍵績效指標把關</p>  
        <p type="p">S511:根據參考指標評估是否執行分頻雙工調適流程</p>  
        <p type="p">S513:得出分頻雙工模式的射頻參數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="431" publication-number="202626903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯材料的回收方法及調色劑</chinese-title>  
        <english-title>RECYCLING METHOD OF POLYESTER MATERIAL AND COLORIING AGENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">C08J11/04</main-classification>  
        <further-classification edition="200601120250206B">C08J11/08</further-classification>  
        <further-classification edition="202201120250206B">B09B3/00</further-classification>  
        <further-classification edition="202201120250206B">B01F23/00</further-classification>  
        <further-classification edition="201901120250206B">B29C48/51</further-classification>  
        <further-classification edition="201901120250206B">B29C48/515</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴佳昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIA-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚酯材料的回收方法及調色劑，調色劑包括色粉與分散劑分散於液態介質中。色粉包括藍色色粉及紅色色粉，分散劑包括酸性聚醚類、酸性共聚物、磷酸鹽類高分子或改性脂肪酸，液態介質包括生質油脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a recycling method of polyester material and a coloring agent. The coloring agent includes color powders and dispersion agents scattered in a liquid medium. The color powder includes blue and red color powder, and the dispersion agent includes acidic polyether, acidic cluster, polymer or modified fatty acids with phosphates, and the liquid medium includes biomass fat.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="432" publication-number="202626282"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626282.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>羊角撐開器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">B25B27/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昱鋒實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU FENG INDUSTRIAL LTD., CO.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳碧凉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PI LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種羊角撐開器，主要用於汽車懸吊系統中，用以撐開羊角的夾緊套管的開口。該羊角撐開器包括一固定座，設有無牙軸孔以及兩個延伸方向相反且厚度不同的定位部；一調整螺栓，以無牙段穿過無牙軸孔，該調整螺栓的操作部和螺紋段分別位於該固定座的兩端外部；一活動座，設有內螺紋孔與調整螺栓的螺紋段鎖合；該活動座設有兩組延伸方向相反且厚度不同的撐開部。當調整螺栓被旋轉時，活動座沿著固定座往復移動，使撐開部與定位部錯開，從而對羊角的開口施加撐開力，達到撐開羊角的開口的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:固定座</p>  
        <p type="p">15:第一定位部</p>  
        <p type="p">16:第二定位部</p>  
        <p type="p">17:凸肋</p>  
        <p type="p">20:調整螺栓</p>  
        <p type="p">21:操作部</p>  
        <p type="p">30:限位栓</p>  
        <p type="p">40:活動座</p>  
        <p type="p">45:第一撐開部</p>  
        <p type="p">46:第二撐開部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="433" publication-number="202625982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手術系統及減壓系統</chinese-title>  
        <english-title>SURGICAL SYSTEM AND DECOMPRESSION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250126B">A61B34/20</main-classification>  
        <further-classification edition="200601120250126B">A61B17/17</further-classification>  
        <further-classification edition="201601120250126B">A61B34/10</further-classification>  
        <further-classification edition="200601120250126B">A61F5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>炳碩生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POINT ROBOTICS MEDTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, REN-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹訢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石耘碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YUN-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田永皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, YONG-HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁浚瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, JIUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳詩元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡勝州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHENG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種手術系統及減壓系統，手術系統包括手術導航模組、機械手臂、手術工具、套筒鏡、多個偵測標記、導航影像擷取裝置及顯示裝置。手術工具具有力感測器，可測量當前施力數據。顯示裝置用於供使用者規劃預定手術路徑，並顯示病患之組織模型、預定手術路徑以及攝影鏡頭所擷取的手術部位之影像。在系統操作程序中，手術導航模組依據當前施力向量、套筒鏡軸向量及預定手術路徑決定機械手臂的驅動方式，以使使用者操作手術工具時沿著預定手術路徑移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surgical system and a decompression system are provided. The surgical system includes a surgical navigation module, a robotic arm, a surgical tool, a dilator scope, a plurality of detection markers, a navigation image capturing device, and a display device. The surgical tool has a force sensor that measures a current force applied. The display device is used for a user to plan a predetermined surgical path, and displays a patient's tissue model, the predetermined surgical path, and an image of a surgical site captured by a camera. During a system operating process, the surgical navigation module determines a driving mode of a robotic arm based on a current force vector, a scope axis vector and the predetermined surgical path, such that the user operates and moves the surgical tool along the predetermined surgical path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">SS:手術系統</p>  
        <p type="p">1:減壓系統</p>  
        <p type="p">DD:顯示裝置</p>  
        <p type="p">10:手術導航模組</p>  
        <p type="p">11:機械手臂</p>  
        <p type="p">12:手術工具</p>  
        <p type="p">120:力感測器</p>  
        <p type="p">122:工具軸</p>  
        <p type="p">13:套筒鏡</p>  
        <p type="p">130:鏡筒</p>  
        <p type="p">134:攝影鏡頭</p>  
        <p type="p">132:鏡軸</p>  
        <p type="p">14:多個偵測標記</p>  
        <p type="p">15:導航影像擷取裝置</p>  
        <p type="p">2:行動台車</p>  
        <p type="p">20:底座</p>  
        <p type="p">21:支撐柱</p>  
        <p type="p">22:第一踏板</p>  
        <p type="p">23:第二踏板</p>  
        <p type="p">17:可動支撐臂</p>  
        <p type="p">170:連桿結構</p>  
        <p type="p">DD:顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="434" publication-number="202627133"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627133.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150321</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>合金化熱浸鍍鋅鋼材及其製造方法</chinese-title>  
        <english-title>ALLOYED HOT-DIP GALVANIZED STEEL AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">C23C2/02</main-classification>  
        <further-classification edition="200601120250320B">C23C2/04</further-classification>  
        <further-classification edition="200601120250320B">C23C2/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KUO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂睿帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, JUI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種合金化熱浸鍍鋅鋼材，其包含：鋼底材；貧錳、矽及內氧化層；以及鋅鐵合金化層。貧錳、矽及內氧化層形成於鋼底材之表面上。鋅鐵合金化層形成於貧錳、矽及內氧化層之表面上。貧錳、矽及內氧化層位於鋼底材及鋅鐵合金化層之間。一種製造合金化熱浸鍍鋅鋼材的方法，其包含：氧化還原熱處理鋼底材；熱浸鍍鋅經氧化還原之鋼材；以及合金化熱處理經熱浸鍍鋅之鋼材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An alloyed hot-dip galvanized steel includes a steel substrate; a lean manganese, silicon, and internal oxide layer; and a zinc-iron alloyed layer. The lean manganese, silicon, and internal oxide layer forms on a surface of the steel substrate. The zinc-iron alloyed layer forms on a surface of the lean manganese, silicon, and internal oxide layer. The lean manganese, silicon, and internal oxide layer is disposed between the steel substrate and the zinc-iron alloyed layer. A method for manufacturing the alloyed hot-dip galvanized steel includes: oxidation-reduction heat-treating the steel substrate; hot-dip galvanizing the steel material subjected to the oxidation-reduction; and alloying and heat-treating the hot-dip galvanized steel material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:合金化熱浸鍍鋅鋼材</p>  
        <p type="p">101:鋼底材</p>  
        <p type="p">102:貧錳、矽及內氧化層</p>  
        <p type="p">103:鋅鐵合金化層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="435" publication-number="202626811"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626811.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物及包含其之組合物</chinese-title>  
        <english-title>POLYMER AND COMPOSITION EMPLOYING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">C08F220/18</main-classification>  
        <further-classification edition="200601120250116B">G03F7/004</further-classification>  
        <further-classification edition="200601120250116B">G03F7/028</further-classification>  
        <further-classification edition="200601120250116B">G03F7/039</further-classification>  
        <further-classification edition="200601120250116B">H05K1/03</further-classification>  
        <further-classification edition="200601120250116B">C08G73/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENG, JYH-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡政禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種聚合物及包含其之組合物。該聚合物具有至少一種第一重複單元以及至少一種第二重複單元，其中該第一重複單元具有式(I)所示之結構，該第二重複單元具有式(II)所示之結構 &lt;br/&gt;&lt;img align="absmiddle" height="339px" width="673px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;，其中A1、A2、以及A3如說明書中所定義。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polymer and a compostion employing the same are provided. The polymer includes at least one first repeating unit of Formula(I) and at least one second repeating unit of Formula(II) &lt;br/&gt;&lt;img align="absmiddle" height="351px" width="618px" file="ed10058.JPG" alt="ed10058.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;, wherein A1, A2, and A3 are as defined in specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="436" publication-number="202626935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高分子可塑劑、其製造方法、及聚氯乙烯產品</chinese-title>  
        <english-title>POLYMERIC PLASTICIZER, METHOD FOR PRODUCING THE SAME, AND POLYVINYL CHLORIDE PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250116B">C08L27/06</main-classification>  
        <further-classification edition="200601120250116B">C08G63/16</further-classification>  
        <further-classification edition="200601120250116B">C08F2/42</further-classification>  
        <further-classification edition="200601120250116B">C07C69/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種高分子可塑劑、其製造方法、以及聚氯乙烯產品。高分子可塑劑是由二元酸成分及二元醇成分進行酯化反應，並且通過封端劑封端形成。二元酸成分為直鏈飽和二元酸且具有C4至C10的碳數。二元醇成分為化學結構中具有側基的二元醇、且具有C3至C16的碳數。封端劑為化學結構中具有側基的單元醇封端劑、且具有C4至C12的碳數。其中二元醇成分的側基為甲基或二甲基，並且單元醇封端劑的側基為乙基或丙基。聚氯乙烯產品的絕緣阻抗不小於0.5×10 &lt;sup&gt;14&lt;/sup&gt;Ω cm，且於60℃至80℃的熱水下經時14天的泡水的一體積膨脹率不大於2%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polymeric plasticizer, a method for producing the same, and a polyvinyl chloride (PVC) product are provided. The polymeric plasticizer is formed by subjecting a dicarboxylic acid component and a diol component to an esterification reaction, followed by end-capping with an end-capping agent. The dicarboxylic acid component is a straight-chain saturated dicarboxylic acid having 4 to 10 carbon atoms, and the diol component is a diol having 3 to 16 carbon atoms with a side group. The end-capping agent is a mono functional alcohol having 4 to 12 carbon atoms with a side group. The side group of the diol component is methyl or dimethyl, and the side group of the mono functional alcohol end-capping agent is ethyl or propyl. The PVC product has an insulation impedance of not less than 0.5×10 &lt;sup&gt;14&lt;/sup&gt;Ω·cm, and when immersed in hot water at 60°C to 80°C for 14 days, a volume expansion rate of the PVC product is not greater than 2%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:步驟S110</p>  
        <p type="p">S120:步驟S120</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="437" publication-number="202628509"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628509.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板撕膜結構及方法</chinese-title>  
        <english-title>SUBSTRATE PEELING STRUCTURE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H05K3/38</main-classification>  
        <further-classification edition="200601120250512B">H05K3/28</further-classification>  
        <further-classification edition="200601120250512B">H05K3/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群翊工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROUP UP INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳安順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, AN-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板撕膜結構，係用以黏貼於一基板且包括一載體膜與一絕緣膠層，該絕緣膠層附著於該載體膜的底面，該載體膜包括一膜本體與一提拉部，該膜本體的周圍具有一邊緣，該邊緣環繞為封閉的形狀，該提拉部連接於該邊緣的一側，該提拉部用以供掀起，作為由該絕緣膠層撕離該載體膜的起點；藉此，當將該基板撕膜結構貼合於該基板，且將該絕緣膠層固化後，以該提拉部為由該絕緣膠層撕離該載體膜的起點的方式，將該載體膜撕離固化後的該絕緣膠層，可避免撕離該載體膜的過程中損傷該絕緣膠層對應該膜本體的部分，保持該絕緣膠層具有絕緣功能部分的完整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate peeling structure is provided for adhesion to a substrate and comprises a carrier film and an insulating adhesive layer. The insulating adhesive layer is attached to the bottom surface of the carrier film. The carrier film includes a film body and a lifting portion. The film body has a surrounding edge forming a closed shape, and the lifting portion is connected to one side of the surrounding edge. The lifting portion serves as the starting point for peeling the carrier film from the insulating adhesive layer. Accordingly, once the substrate peeling structure is adhered to the substrate and the insulating adhesive layer is cured, the carrier film can be peeled off from the cured insulating adhesive layer starting from the lifting portion. This approach prevents damage to the portion of the insulating adhesive layer corresponding to the film body during the peeling process, thereby maintaining the integrity of the insulating function of the insulating adhesive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板撕膜結構</p>  
        <p type="p">10:載體膜</p>  
        <p type="p">12:膜本體</p>  
        <p type="p">121:邊緣</p>  
        <p type="p">14:提拉部</p>  
        <p type="p">20:絕緣膠層</p>  
        <p type="p">A:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="438" publication-number="202628665"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628665.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D84/40</main-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202501120260302B">H10D30/60</further-classification>  
        <further-classification edition="202501120260302B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱崇益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗穆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TSUNG-MU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俞仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宸誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡咏真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YUNG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高育瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, YU-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫梓萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TZU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯崴任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, WEI-RENN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於半導體裝置及其形成方法，其包括基底、第一閘極結構、兩第一源極/汲極結構以及氣隙阻擋層。基底包括設置在其內的至少一淺溝渠隔離。第一閘極結構設置在基底上。第一源極/汲極結構設置在基底內並位在第一閘極結構的兩相對側，各第一源極/汲極結構的一側鄰接至少一淺溝渠隔離。氣隙阻擋層設置在基底和各第一源極/汲極結構之間，其中，氣隙阻擋層包括一底面和兩側壁係分別朝向彼此不同的三個方向延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a semiconductor device and a method of fabricating the same including a substrate, a first gate structure, two first source/drain structures, and an air barrier layer. The substrate includes at least one shallow trench isolation disposed therein. The first gate structure is disposed on the substrate. Two first source/drain structures are disposed in the substrate, at two sides of the first gate structure, and a side of each of the two first source/drain structures is adjacent to the at least one shallow trench isolation. The air gap barrier layer is disposed between the substrate and each of the two first source/drain structures, wherein the air gap barrier layer includes a bottom surface and two sidewalls each extending in three different directions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基底</p>  
        <p type="p">100D:密集區</p>  
        <p type="p">100I:稀疏區</p>  
        <p type="p">100t:頂面</p>  
        <p type="p">102:淺溝渠隔離</p>  
        <p type="p">102t:頂面</p>  
        <p type="p">110:第一閘極結構</p>  
        <p type="p">112、212:閘極介電層</p>  
        <p type="p">114、214:電極層</p>  
        <p type="p">116、216:側壁子</p>  
        <p type="p">120:第一源極/汲極結構</p>  
        <p type="p">130:氣隙阻擋層</p>  
        <p type="p">132:底面</p>  
        <p type="p">134、136:側壁</p>  
        <p type="p">134t、136t:最高點</p>  
        <p type="p">150:蝕刻停止層</p>  
        <p type="p">160:層間介電層</p>  
        <p type="p">162:第一介電層</p>  
        <p type="p">164:第二介電層</p>  
        <p type="p">210:第二閘極結構</p>  
        <p type="p">220:第二源極/汲極結構</p>  
        <p type="p">230:第一半導體層</p>  
        <p type="p">232:底面</p>  
        <p type="p">234、236:側壁</p>  
        <p type="p">240:第二半導體層</p>  
        <p type="p">D1、D2、D3、D4:方向</p>  
        <p type="p">T1、T2:厚度</p>  
        <p type="p">Y:垂直方向</p>  
        <p type="p">θ1、θ2:角度</p>  
        <p type="p">θ3、θ4:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="439" publication-number="202628305"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628305.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲能裝置</chinese-title>  
        <english-title>ENERGY STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H02J7/00</main-classification>  
        <further-classification edition="200601120260302B">H02J7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞福儲能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APH EPOWER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇修賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSIU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宜君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種儲能裝置。儲能裝置包括電源匯流排、第一電池模組、第二電池模組、第一充放電電路、第二充放電電路以及控制電路。第一充放電電路接收位於電源匯流排的電能以及第一電池模組的第一電池狀態以提供第一感測訊號。第二充放電電路接收位於電源匯流排的電能以及第二電池模組的第二電池狀態以提供第二感測訊號。控制電路依據第一感測訊號以及第二感測訊號來控制第一充放電電路對第一電池模組執行第一電能傳輸操作並控制第二充放電電路對第二電池模組執行第二電能傳輸操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy storage device is provided. The energy storage device includes a power bus, a first battery module, a second battery module, a first charging and discharging circuit, a second charging and discharging circuit and a control circuit. The first charging and discharging circuit receives an energy on the power bus and a first battery status of the first battery module to provide a first sensing signal. The second charging and discharging circuit receives the power on the power bus and a second battery status of the second battery module to provide a second sensing signal. The control circuit controls the first charging and discharging circuit to perform a first power transmission operation on the first battery module and controls the second charging and discharging circuit to perform a second power transmission operation on the second battery module based on the first sensing signal and the second sensing signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:儲能裝置</p>  
        <p type="p">110:電源匯流排</p>  
        <p type="p">120_1:第一電池模組</p>  
        <p type="p">120_2:第二電池模組</p>  
        <p type="p">130_1:第一充放電電路</p>  
        <p type="p">130_2:第二充放電電路</p>  
        <p type="p">140:控制電路</p>  
        <p type="p">LD:負載</p>  
        <p type="p">PB1、PB2:電池電能</p>  
        <p type="p">PEX:外部電源</p>  
        <p type="p">SC1、SC2:控制訊號</p>  
        <p type="p">SS1:第一感測訊號</p>  
        <p type="p">SS2:第二感測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="440" publication-number="202627445"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627445.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜光學常數的測定方法</chinese-title>  
        <english-title>METHOD FOR MEASURING OPTICAL CONSTANTS OF THIN-FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">G01N21/00</main-classification>  
        <further-classification edition="201401120250324B">G01N21/55</further-classification>  
        <further-classification edition="200601120250324B">G01B11/06</further-classification>  
        <further-classification edition="200601120250324B">G06F17/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明新學校財團法人明新科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINGHSIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江政忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAING, CHENG-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHAO-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　晉達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LE, TAN DAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種薄膜光學常數的測定方法，其步驟首先是測量多層薄膜的每一層薄膜的厚度，然後設定每一層薄膜的折射率理論值與消光係數理論值，再基於多角度反射率函數，計算出在多個入射角條件下多層薄膜的模擬反射率，並測量多層薄膜在多個入射角條件下的實際反射率，最後，將模擬反射率與實際反射率相互擬合，找出擬合成功的反射率擬合值，即可獲得每一層薄膜的折射率與消光係數。本發明可以應用於高反射薄膜的量測，不會受到雜訊影響，實為一種快速準確且可靠的測定方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a method for measuring optical constants of thin films. The steps of the method are to first measure the thickness of each layer of a multi-layer film. Then, determine theoretical values of a refractive index and an extinction coefficient of each layer of the film. Based on a multi-angle reflectance function, simulated reflectivities of the multi-layer film under multiple incident angle conditions are calculated, and actual reflectivities of the multi-layer film under multiple incident angle conditions are measured. Finally, the simulated reflectivities and the actual reflectivities are fitted to each other to find the successfully fitted reflectivity fitting value. The refractive index and extinction coefficient of each layer of the film will be obtained. The invention can be applied to the measurement of highly reflective films without being affected by noise to achieve a fast, accurate and reliable measurement method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S70:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="441" publication-number="202628241"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628241.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線結構</chinese-title>  
        <english-title>ANTENNA STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250321B">H01Q1/36</main-classification>  
        <further-classification edition="201501120250321B">H01Q5/30</further-classification>  
        <further-classification edition="201501120250321B">H01Q5/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WNC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳子民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TZU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭伊登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YI-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, KUO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古光原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, KUANG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線結構，包括：一第一接地面、一第一電容器、一饋入部、一介質基板，以及一金屬腔體。第一接地面包括一較窄邊緣區段和一較寬邊緣區段。第一接地面具有一第一槽孔。第一電容器係耦接於較窄邊緣區段和較寬邊緣區段之間。第一接地面之第一槽孔係由饋入部所激發。接地部係耦接至較窄邊緣區段。介質基板具有相對之一第一表面和一第二表面。第一接地面、第一電容器，以及饋入部皆設置於介質基板之第一表面。金屬腔體係耦接至第一接地面。金屬腔體係鄰近於介質基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna structure includes a first ground plane, a first capacitor, a feeding element, a dielectric substrate, and a metal cavity. The first ground plane includes a narrow edge segment and a wide edge segment. The first ground plane has a first slot. The first capacitor is coupled between the narrow edge segment and the wide edge segment. The first slot of the first ground plane is excited by the feeding element. The grounding element is coupled to the narrow edge segment. The dielectric substrate has a first surface and a second surface which are opposite to each other. The first ground plane, the first capacitor, and the feeding element are disposed on the first surface of the dielectric substrate. The metal cavity is coupled to the first ground plane. The metal cavity is adjacent to the dielectric substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線結構</p>  
        <p type="p">110:第一接地面</p>  
        <p type="p">114:較窄邊緣區段</p>  
        <p type="p">115:較寬邊緣區段</p>  
        <p type="p">120:第一槽孔</p>  
        <p type="p">121:第一槽孔之第一閉口端</p>  
        <p type="p">122:第一槽孔之第二閉口端</p>  
        <p type="p">125:第一槽孔之較長部份</p>  
        <p type="p">126:第一槽孔之較短部份</p>  
        <p type="p">130:電纜線</p>  
        <p type="p">134:饋入部</p>  
        <p type="p">135:接地部</p>  
        <p type="p">140:介質基板</p>  
        <p type="p">190:信號源</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">C2:第二電容器</p>  
        <p type="p">E1:介質基板之第一表面</p>  
        <p type="p">FP1:饋入點</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">W1,W2,W3:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="442" publication-number="202626893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調整功函數的離子液體官能化聚(3,4-乙烯二氧噻吩):聚(苯乙烯磺酸)薄膜的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING WORK FUNCTION-TUNABLE IONIC LIQUID-FUNCTIONALIZED PEDOT:PSS FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C08J5/18</main-classification>  
        <further-classification edition="200601120250402B">C08J7/12</further-classification>  
        <further-classification edition="200601120250402B">C08L25/18</further-classification>  
        <further-classification edition="200601120250402B">C08L65/00</further-classification>  
        <further-classification edition="200601120250402B">H01B1/12</further-classification>  
        <further-classification edition="200601120250402B">H01B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何立夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, LI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調整功函數的離子液體官能化聚(3,4-乙烯二氧噻吩):聚(苯乙烯磺酸)薄膜的製造方法，包含：前處理步驟，於聚(3,4-乙烯二氧噻吩):聚(苯乙烯磺酸)溶液中加入甲醇以得到前處理液體；製膜步驟，將前處理溶5液以刮刀塗佈於基板上而得到第一階段薄膜；膜處理步驟，將DMSO以刮刀塗佈於第一階段薄膜再洗去DMSO而得到第二階段薄膜；及離子液體處理步驟，將離子液體水溶液以刮刀塗佈於第二階段薄膜再洗去離子溶液而得到離子液體官能化聚(3,4-乙烯二氧噻吩):聚(苯乙烯磺酸)薄膜，不但有良好的機械穩定性，且具有良好的導電率及能夠透過使用不同離子液體實現可改變的功函數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for manufacturing an work function-tunable ionic liquid-functionalized PEDOT:PSS film, comprising a pretreatment step, a film forming step, a film treatment step and an ionic liquid treatment step, wherein the pretreatment step obtain a pretreatment solution of PEDOT:PSS solution and methanol, the film performing step applying the pretreatment solution on a substrate with blade coating method to obtain a first-stage film, the film treatment step applying a DMSO on the first-stage film with blade coating method to obtain a DSMO-treated first-stage film, performing annealing treatment to the DSMO-treated first-stage film then washing the DSMO-treated first-stage film with methanol to obtain a second-stage film, and the ionic liquid treatment step adding deionized water into ionized liquid then performing ultrasonic vibration to obtain an ionic liquid solution, applying the ionic liquid solution on the second-stage film with blade coating method to obtain a ionized-liquid-treated film, performing annealing treatment to the ionized-liquid-treated film then washing the ionized-liquid-treated film with deionized water to obtain a ionic liquid-functionalized PEDOT:PSS film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:前處理步驟</p>  
        <p type="p">S2:製膜步驟</p>  
        <p type="p">S3:膜處理步驟</p>  
        <p type="p">S4:離子液體處理步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="443" publication-number="202628514"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628514.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">H05K5/02</main-classification>  
        <further-classification edition="200601120250325B">F16M13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商冠捷投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游豐華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, FENG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家有</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含一螢幕、一背殼及一折疊壁掛單元。螢幕具有一背面。背殼設置於該背面並包括一容置槽。折疊壁掛單元設置於該容置槽並包括一固接於該背殼的基板及一樞設於該基板的安裝板。安裝板可被操作在一收合位置及一伸出位置之間樞轉，在該收合位置時，該安裝板位於該容置槽內，在該伸出位置時，該安裝板相對於該基板向上樞轉而伸出該容置槽，使得該安裝板及該背殼適用於供一壁掛板裝設。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">1:螢幕</p>  
        <p type="p">11:背面</p>  
        <p type="p">2:背殼</p>  
        <p type="p">21:容置槽</p>  
        <p type="p">22:彈臂</p>  
        <p type="p">23:下鎖孔</p>  
        <p type="p">3:折疊壁掛單元</p>  
        <p type="p">4:底座單元</p>  
        <p type="p">41:底座</p>  
        <p type="p">43:接合板</p>  
        <p type="p">44:蓋板</p>  
        <p type="p">45:彈性塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="444" publication-number="202625932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150375</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>飛機座艙上行李置放櫃</chinese-title>  
        <english-title>LUGGAGE CABINET OF AIRCRAFT CABIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">A47B81/00</main-classification>  
        <further-classification edition="200601120250324B">A47B49/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳祥祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃暐倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳幃辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏福楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種飛機座艙上行李置放櫃，具有一置放櫃與一樞接於該置放櫃的櫃蓋，該櫃蓋採打開時是往下掀方向旋轉的設計，並該櫃蓋具有一擋牆，因此將行李置放於該擋牆上並蓋上該櫃蓋時，可讓行李順著該櫃蓋的旋轉被送入該置放櫃內，藉此改善過往行李置放櫃使用上較為費力不便的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention related to a luggage cabinet of aircraft cabin includes a cabinet and a cover pivotally connected to the cabinet. The cover would move downwardly when being opened. The cover has a blocking wall. After the luggage put on the blocking wall, it can be sent into the cabinet with the rotation of the closed cover. So the problem about the inconvenience and the laboriousness of the past cabinet can be solved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:置放櫃</p>  
        <p type="p">11:櫃體</p>  
        <p type="p">12:容室</p>  
        <p type="p">13:凹槽</p>  
        <p type="p">2:櫃蓋</p>  
        <p type="p">21:蓋體</p>  
        <p type="p">211:擋牆</p>  
        <p type="p">22:樞接件</p>  
        <p type="p">23:連桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="445" publication-number="202625927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>方便拖行之行李箱把手</chinese-title>  
        <english-title>HANDLE FOR SUITCASE FOR COMFORTABLE PULLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">A45C13/26</main-classification>  
        <further-classification edition="200601120250324B">A45C5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳祥祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃暐倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳幃辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏福楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方便拖行之行李箱把手，具有一用於組裝於行李箱箱體的拉桿與至少一樞接於該拉桿的輔助握把，該拉桿具有複數定位孔，該輔助握把則具有一定位鈕，該定位鈕用於卡掣於其中一該定位孔，使該輔助握把可定位在與該拉桿夾有預定角度的位置，此時該輔助握把可讓使用者舒適地握持以拖行行李箱，而不用像以往一樣呈現手腕扭轉的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention related to a handle for suitcase for comfortable pullling includes a pull bar used to a mounted to a case body of a suitcase. The pull bar has several positioning holes and pivotally jointed with at least an auxiliary grip. The auxiliary grip has a positioning block used to a snap into one of the positioning holes. So the auxiliary grip can be positioned at a predetermined angle with the pull bar. Then the users can hold the auxiliary grip to comfortabling trail the suitcase rather than twisting wrist like before.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:拉桿</p>  
        <p type="p">11:桿體</p>  
        <p type="p">12:凹槽</p>  
        <p type="p">13:定位孔</p>  
        <p type="p">2:輔助握把</p>  
        <p type="p">21:把體</p>  
        <p type="p">3:箱體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="446" publication-number="202628967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/00</main-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification>  
        <further-classification edition="202601120260302B">H10W20/20</further-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鉅富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHU-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林川嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUAN-LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許閔翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MIN-SHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王裕平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先提供一基底包含複數個矽穿導孔，然後形成一無機層於該基底上，形成一有機層於該無機層上，再將複數個具有不同功能之晶粒接合至該無機層上。其中該等晶粒可包含一無線射頻積體電路晶粒、一功率放大器晶粒以及/或一高電子遷移率電晶體晶粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a semiconductor device includes the steps of first providing a substrate having through-silicon vias (TSVs) therein, forming an inorganic layer on the substrate, forming an organic layer on the inorganic layer, and then bonding dies having different functionalities on the organic layer. Preferably, the dies include a radio-frequency integrated circuit (RFIC) die, a power amplifier (PA) die, and/or a high electron mobility transistor (HEMT) die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:晶圓</p>  
        <p type="p">14:基底</p>  
        <p type="p">16:矽穿導孔</p>  
        <p type="p">18:無機層</p>  
        <p type="p">20:有機層</p>  
        <p type="p">22:晶粒</p>  
        <p type="p">24:晶粒</p>  
        <p type="p">26:晶粒</p>  
        <p type="p">28:微突塊</p>  
        <p type="p">30:錫球</p>  
        <p type="p">32:金屬內連線</p>  
        <p type="p">64:封膠層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="447" publication-number="202628028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明顯示裝置及拼接顯示裝置</chinese-title>  
        <english-title>TRANSPARENT DISPLAY DEVICE AND TILED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">G09F9/33</main-classification>  
        <further-classification edition="200601120250109B">G09F9/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, JIA-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃書豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭佳添</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHIA-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透明顯示裝置，包括電路基板、微型發光二極體、保護層以及阻水結構。電路基板具有穿透區以及非穿透區。微型發光二極體設置於非穿透區上，且接合至電路基板。保護層設置於非穿透區上，且覆蓋微型發光二極體的頂面以及側壁。微型發光二極體與阻水結構被保護層隔開，且阻水結構包括重疊於微型發光二極體的頂面的開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent display device includes a circuit substrate, a micro light-emitting diode, a protective layer and a water-blocking structure. The circuit substrate has a transmissive area and a non- transmissive area. Micro light-emitting diodes are disposed on the non- transmissive area and bonded to the circuit substrate. The protective layer is disposed on the non-transmissive area and covers a top surface and a sidewall of the micro light-emitting diode. The micro light emitting diode and the water-blocking structure are separated by the protective layer, and the water-blocking structure includes an opening that overlaps the top surface of the micro light emitting diode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:透明顯示裝置</p>  
        <p type="p">100:電路基板</p>  
        <p type="p">110:透明基板</p>  
        <p type="p">112:緩衝層</p>  
        <p type="p">113:第一絕緣層</p>  
        <p type="p">114:第二絕緣層</p>  
        <p type="p">115:第一緩衝層</p>  
        <p type="p">116:第二緩衝層</p>  
        <p type="p">117:第三緩衝層</p>  
        <p type="p">118:第四緩衝層</p>  
        <p type="p">119:鈍化層</p>  
        <p type="p">120:半導體層</p>  
        <p type="p">130:第一導電圖案層</p>  
        <p type="p">131:閘極</p>  
        <p type="p">132:導電特徵</p>  
        <p type="p">140:第二導電圖案層</p>  
        <p type="p">150:第三導電圖案層</p>  
        <p type="p">151:第一源極/汲極</p>  
        <p type="p">152:第二源極/汲極</p>  
        <p type="p">153:導電特徵</p>  
        <p type="p">160:第四導電圖案層</p>  
        <p type="p">170:第五導電圖案層</p>  
        <p type="p">180:第六導電圖案層</p>  
        <p type="p">181,182:接墊</p>  
        <p type="p">191:第三絕緣層</p>  
        <p type="p">192:第四絕緣層</p>  
        <p type="p">193:第五絕緣層</p>  
        <p type="p">200:微型發光二極體</p>  
        <p type="p">200s,300s:側壁</p>  
        <p type="p">200t,300t:頂面</p>  
        <p type="p">210:接點</p>  
        <p type="p">300:保護層</p>  
        <p type="p">400:阻水結構</p>  
        <p type="p">400H:開口</p>  
        <p type="p">410:氧化物層</p>  
        <p type="p">420:氮化物層</p>  
        <p type="p">500:封裝層</p>  
        <p type="p">BM:黑矩陣</p>  
        <p type="p">T:主動元件</p>  
        <p type="p">TR:穿透區</p>  
        <p type="p">NTR:非穿透區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="448" publication-number="202626205"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626205.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二合一水槍</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">B05B1/02</main-classification>  
        <further-classification edition="200601120250324B">B05B1/04</further-classification>  
        <further-classification edition="200601120250324B">B05B1/14</further-classification>  
        <further-classification edition="200601120250324B">B05B9/01</further-classification>  
        <further-classification edition="202301120250324B">B05B11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中山市慶誼金屬制品企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張開山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍崑廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李述龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤棠傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田國健</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種二合一水槍，包括一槍身及一具有複數噴嘴之噴頭組件，噴頭組件轉動切換不同的噴嘴與槍身之內流道相連通。噴頭組件包括一轉盤，轉盤內設有與出水口相對應之組接座，一隔板套設於組接座外，該些噴嘴組設於一底盤並接設於組接座而將隔板迫緊固定在轉盤內，其中一圓形噴嘴及一扇形噴嘴相對設置，扇形噴嘴受一撥動部帶動轉動而噴出不同擴散方向的扇形水花；圓形噴嘴受一調節滾輪帶動前後移動，進而改變出水形狀。透過優化結構減少內部空間佔用且多功能合一，使用便捷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:槍身</p>  
        <p type="p">101:前端</p>  
        <p type="p">102:內通道</p>  
        <p type="p">103:控制開關</p>  
        <p type="p">104:連接柱</p>  
        <p type="p">105:安裝孔</p>  
        <p type="p">1:轉盤</p>  
        <p type="p">11:組接端</p>  
        <p type="p">12:出水端</p>  
        <p type="p">121:出水口</p>  
        <p type="p">153:花灑孔</p>  
        <p type="p">2:隔板</p>  
        <p type="p">21:通孔</p>  
        <p type="p">3:底盤</p>  
        <p type="p">31:第一安裝座</p>  
        <p type="p">32:第二安裝座</p>  
        <p type="p">33:固定塊</p>  
        <p type="p">34:導向塊</p>  
        <p type="p">4:噴嘴</p>  
        <p type="p">4b:扇形噴嘴</p>  
        <p type="p">42:軸芯</p>  
        <p type="p">422:軸芯出水口</p>  
        <p type="p">43:撥動部</p>  
        <p type="p">44:閥芯</p>  
        <p type="p">442:閥芯出水孔</p>  
        <p type="p">443:外螺紋</p>  
        <p type="p">45:調節滾輪</p>  
        <p type="p">46:阻尼環</p>  
        <p type="p">47:彈性元件</p>  
        <p type="p">5:連接孔</p>  
        <p type="p">6:鎖固元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="449" publication-number="202628373"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628373.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150386</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>類比至數位轉換器以及用來校正類比至數位轉換器中的比較器的方法</chinese-title>  
        <english-title>ANALOG-TO-DIGITAL CONVERTER AND METHOD FOR CALIBRATING COMPARATOR WITHIN ANALOG-TO-DIGITAL CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250204B">H03M1/06</main-classification>  
        <further-classification edition="200601120250204B">H03M1/10</further-classification>  
        <further-classification edition="200601120250204B">H03M1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪瑋謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, WEI-CIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種類比至數位轉換器以及用來校正該類比至數位轉換器中的一比較器的方法。該類比至數位轉換器包含一取樣電容陣列、該比較器、一偏移校正控制開關以及一控制邏輯，其中該偏移校正控制開關耦接於該取樣電容陣列與該比較器之間。在一取樣階段中，該取樣電容陣列取樣一輸入訊號，該偏移校正控制開關被關閉，該比較器的輸入端子被拉至一相同位準，以及該控制邏輯依據該比較器產生的一比較結果進行該比較器的校正。在一轉換階段中，該偏移校正控制開關被開啟，以及該控制邏輯依據該比較結果輸出該輸入訊號的一類比至數位轉換結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An analog-to-digital converter (ADC) and a method for calibrating a comparator within the ADC are provided. The ADC includes a sampling capacitor array, the comparator, an offset calibration control switch and a control logic, where the offset calibration control switch is coupled between the sampling capacitor array and the comparator. In a sampling phase, the sampling capacitor array samples an input signal, the offset calibration control switch is turned off, input terminals of the comparator is pulled to a same level, and the control logic perform calibration of the comparator according to a comparison result generated by the comparator. In a conversion phase, the offset calibration control switch is turned on, and the control logic output an analog-to-digital conversion result of the input signal according to the comparison result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:SAR類比至數位轉換器</p>  
        <p type="p">100:取樣電容陣列</p>  
        <p type="p">110:比較器</p>  
        <p type="p">120:SAR邏輯</p>  
        <p type="p">C&lt;sub&gt;1P&lt;/sub&gt;,C&lt;sub&gt;2P&lt;/sub&gt;,C&lt;sub&gt;3P&lt;/sub&gt;,C&lt;sub&gt;4P&lt;/sub&gt;,C&lt;sub&gt;5P&lt;/sub&gt;,C&lt;sub&gt;6P&lt;/sub&gt;,C&lt;sub&gt;7P&lt;/sub&gt;,C&lt;sub&gt;8P&lt;/sub&gt;,C&lt;sub&gt;9P&lt;/sub&gt;,C&lt;sub&gt;10P&lt;/sub&gt;:電容器</p>  
        <p type="p">C&lt;sub&gt;1N&lt;/sub&gt;,C&lt;sub&gt;2N&lt;/sub&gt;,C&lt;sub&gt;3N&lt;/sub&gt;,C&lt;sub&gt;4N&lt;/sub&gt;,C&lt;sub&gt;5N&lt;/sub&gt;,C&lt;sub&gt;6N&lt;/sub&gt;,C&lt;sub&gt;7N&lt;/sub&gt;,C&lt;sub&gt;8N&lt;/sub&gt;,C&lt;sub&gt;9N&lt;/sub&gt;,C&lt;sub&gt;10N&lt;/sub&gt;:電容器</p>  
        <p type="p">SWS,SW&lt;sub&gt;CP&lt;/sub&gt;,SW&lt;sub&gt;CN&lt;/sub&gt;,SW&lt;sub&gt;OS&lt;/sub&gt;,SW&lt;sub&gt;VCM&lt;/sub&gt;,S&lt;sub&gt;1P&lt;/sub&gt;~S&lt;sub&gt;9P&lt;/sub&gt;,S&lt;sub&gt;1N&lt;/sub&gt;~S&lt;sub&gt;9N&lt;/sub&gt;:開關</p>  
        <p type="p">NP:正端取樣節點</p>  
        <p type="p">NN:負端取樣節點</p>  
        <p type="p">VIP,VIN:輸入訊號</p>  
        <p type="p">VCIP,VCIN:取樣訊號</p>  
        <p type="p">VREF,VSS,VCM:參考電壓</p>  
        <p type="p">CMP:比較結果</p>  
        <p type="p">B1~B10:位元</p>  
        <p type="p">CLK&lt;sub&gt;S&lt;/sub&gt;,CLK&lt;sub&gt;OS&lt;/sub&gt;,CLK&lt;sub&gt;C&lt;/sub&gt;,CLK&lt;sub&gt;VCM&lt;/sub&gt;:控制訊號</p>  
        <p type="p">CLK&lt;sub&gt;CP1&lt;/sub&gt;~CLK&lt;sub&gt;CP9&lt;/sub&gt;,CLK&lt;sub&gt;CN1&lt;/sub&gt;~CLK&lt;sub&gt;CN9&lt;/sub&gt;:控制訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="450" publication-number="202627621"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627621.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150394</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>曲面立體顯示器與其製作方法</chinese-title>  
        <english-title>CURVE STEREOSCOPIC DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250418B">G02B30/26</main-classification>  
        <further-classification edition="202001120250418B">G02B30/27</further-classification>  
        <further-classification edition="202001120250418B">G02B30/30</further-classification>  
        <further-classification edition="202001120250418B">G02B30/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖貞慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, JANE-HWAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林耿賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭依濠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王何立穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG HE, LI-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳思帷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種曲面立體顯示器，包含目標載體、發光層與視差障板。目標載體之表面的第一區域所在之切平面的法線方向不同於第二區域所在之切平面的法線方向。發光層包含可覆蓋於目標載體上之可撓式基板以及設置於可撓式基板上的發光單元，發光單元包含位在第一區域中之第一群發光單元以及位於第二區域中之第二群發光單元。視差障板設置於發光層上，包含複數個光學透鏡，光學透鏡包含設置以調整第一群發光單元的光路的第一光學透鏡以及設置以調整第二群發光單元的光路的第二光學透鏡，且第一光學透鏡的屈光度不同於第二光學透鏡的屈光度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A curve stereoscopic display includes a target carrier, a light-emitting layer, and a parallax barrier. A normal direction of a first zone of the surface of the target carrier is different from a normal direction of a second zone. The light-emitting layer includes a flexible substrate covering the target carrier and light-emitting units disposed on the flexible substrate. The light-emitting units include a first group of light-emitting units on the first zone and a second group of light-emitting units on the second zone. The parallax barrier is disposed on the light-emitting layer and includes optical lenses. The optical lenses includes a first optical lens that is configured to adjust a light path of the first group of light-emitting units and a second optical lens that is configured to adjust a light path of the second group of light-emitting units. The diopter of the first optical lens is different from the diopter of the second optical lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:曲面立體顯示器</p>  
        <p type="p">100:目標載體</p>  
        <p type="p">110:第一區域</p>  
        <p type="p">120:第二區域</p>  
        <p type="p">200:發光層</p>  
        <p type="p">210:可撓式基板</p>  
        <p type="p">220:發光單元</p>  
        <p type="p">220A:第一群發光單元</p>  
        <p type="p">220B:第二群發光單元</p>  
        <p type="p">222:發光元件</p>  
        <p type="p">224:封裝結構</p>  
        <p type="p">300:視差障板</p>  
        <p type="p">310:光學透鏡</p>  
        <p type="p">310A:第一光學透鏡</p>  
        <p type="p">310B:第二光學透鏡</p>  
        <p type="p">N1,N2:法線方向</p>  
        <p type="p">S1:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="451" publication-number="202626494"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626494.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150396</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>臭氧產生裝置</chinese-title>  
        <english-title>OZONE MANUFACTURING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250120B">C01B13/10</main-classification>  
        <further-classification edition="200601120250120B">C01B13/11</further-classification>  
        <further-classification edition="202101120250120B">F24F8/26</further-classification>  
        <further-classification edition="202301120250120B">C22C1/057</further-classification>  
        <further-classification edition="202101120250120B">C25B1/04</further-classification>  
        <further-classification edition="200601120250120B">D21C9/153</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊翼帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊翼帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳尚倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHANG-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種臭氧產生裝置，包含：一陽極，其表面係形成有一催化塗層，其中：該催化塗層中包含：鉑(Pt)、鈦（Ti）、錳（Mn）、鈷（Co）、銻(Sb)、鎳(Ni)、二氧化錳(MnO₂)、二氧化釕(RuO₂)、或二氧化錫(SnO₂)，且該催化塗層的標準電極電位大於或等於1.6 V；一陰極，係與該陽極相對應地設置，並與該陽極間界定有一放電空間；以及一電源，係分別與該陽極、以及該陰極連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an ozone manufacturing device comprising: an anode having a surface on which a catalytic coating is formed, wherein the catalytic coating comprises: Platinum (Pt), Titanium (Ti), Manganese (Mn), Cobalt (Co), Stibium (Sb), Nickel (Ni), Manganese Dioxide (MnO₂), Ruthenium Oxide (RuO₂), or Tin Oxide (SnO₂), and a standard electrode potential of the catalytic coating is greater than or equal to 1.6V; a cathode arranged relative to the anode, between which a discharge space is defined; and a power connected to the anode and the cathode respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:臭氧產生裝置</p>  
        <p type="p">2:陽極</p>  
        <p type="p">3:催化塗層</p>  
        <p type="p">4:陰極</p>  
        <p type="p">5:放電空間</p>  
        <p type="p">6:電源</p>  
        <p type="p">7:第一穿孔</p>  
        <p type="p">8:第二穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="452" publication-number="202626561"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626561.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面改質氮化鋁粉體及其製造方法</chinese-title>  
        <english-title>SURFACE MODIFIED ALUMINUM NITRIDE POWDER AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250204B">C04B35/581</main-classification>  
        <further-classification edition="200601120250204B">C01B21/072</further-classification>  
        <further-classification edition="202501120250204B">H10D86/00</further-classification>  
        <further-classification edition="200601120250204B">C04B38/02</further-classification>  
        <further-classification edition="201701120250204B">C01B32/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊弘華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉佳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾美榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, MEI-RURNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方家振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古俊能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, CHUN-NENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHIH-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種表面改質氮化鋁粉體及其製造方法。所述表面改質氮化鋁粉體包括具有疏水性表面的氮化鋁本體以及位於疏水性表面上且包覆氮化鋁本體的包覆層。所述包覆層包括陰離子型表面活性劑。所述表面改質氮化鋁粉體的製造方法包括使氮化鋁本體與有機酸溶液接觸以在氮化鋁本體表面形成一疏水性表面；以及使陰離子型表面活性劑與疏水性表面接觸以形成包覆層於該疏水性表面上以獲得表面改質氮化鋁粉體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface modified aluminum nitride powder and a preparation method thereof. The surface modified aluminum nitride powder includes an aluminum nitride body with a hydrophobic surface and a coating layer on the hydrophobic surface and covering the aluminum nitride body. The coating layer includes an anionic surfactant. The preparation method of the surface modified aluminum nitride powder includes contacting the aluminum nitride body with an organic acid solution to form a hydrophobic surface on the surface of the aluminum nitride body; and contacting an anionic surfactant with the hydrophobic surface to form a coating layer on the hydrophobic surface to obtain the surface　modified aluminum nitride powder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:表面改質氮化鋁粉體</p>  
        <p type="p">11:氮化鋁本體</p>  
        <p type="p">11S:疏水性表面</p>  
        <p type="p">13:包覆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="453" publication-number="202627901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於量子控制與讀取的訊號傳輸裝置</chinese-title>  
        <english-title>SIGNAL TRANSMISSION DEVICE FOR QUANTUM CONTROL AND READ-OUT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">G06N10/20</main-classification>  
        <further-classification edition="202201120250401B">G06N10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李哲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHE-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張博盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種用於量子控制與讀取的訊號傳輸裝置，其包括控制組件、隔熱腔體、第一訊號轉換組件、塑膠波導元件、第二訊號轉換組件、以及量子位元。控制組件處於第一溫度下。隔熱腔體具有腔壁及處於第二溫度下的第一容置空間。第一溫度大於第二溫度。第一訊號轉換組件部分設置於腔壁上或第一容置空間中，並電性連接控制組件。塑膠波導元件設置於第一容置空間中並電性連接第一訊號轉換組件。第二訊號轉換組件設置於第一容置空間中並電性連接塑膠波導元件。量子位元設置於第一容置空間中並電性連接第二訊號轉換組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A signal transmission device for quantum control and read-out is provided, which includes a control component, a heat-insulating cavity, a first signal transition component, a plastic waveguide component, a second signal transition component, and a qubit. The control component is at the first temperature. The heat-insulating cavity has a cavity wall and a first accommodation space at a second temperature. The first temperature is greater than the second temperature. The first signal transition component is partially disposed on the cavity wall or in the first accommodation space and is electrically connected to the control component. The plastic waveguide component is disposed in the first accommodation space and is electrically connected to the first signal transition component. The second signal transition component is disposed in the first accommodation space and is electrically connected to the plastic waveguide component. The qubit is disposed in the first accommodation space and is electrically connected to the second signal transition component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2A:訊號傳輸裝置</p>  
        <p type="p">20:控制組件</p>  
        <p type="p">200:電路</p>  
        <p type="p">201:訊號產生器</p>  
        <p type="p">21:第一訊號轉換組件</p>  
        <p type="p">210:第一混頻器</p>  
        <p type="p">211,212:第一轉接器</p>  
        <p type="p">22:塑膠波導元件</p>  
        <p type="p">220,221:塑膠波導管</p>  
        <p type="p">23:第二訊號轉換組件</p>  
        <p type="p">230,231:第二轉接器</p>  
        <p type="p">232:第二混頻器</p>  
        <p type="p">24:量子位元</p>  
        <p type="p">25:隔熱腔體</p>  
        <p type="p">250:腔壁</p>  
        <p type="p">251:第一容置空間</p>  
        <p type="p">CS1:第一控制訊號</p>  
        <p type="p">CS2:第二控制訊號</p>  
        <p type="p">MS:混頻訊號</p>  
        <p type="p">MTS:混頻傳輸訊號</p>  
        <p type="p">RS1:第一讀取訊號</p>  
        <p type="p">RS2:第二讀取訊號</p>  
        <p type="p">TS1:第一傳輸訊號</p>  
        <p type="p">TS2:第二傳輸訊號</p>  
        <p type="p">T1,T2:溫度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="454" publication-number="202626437"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626437.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變速控制裝置</chinese-title>  
        <english-title>SHIFT CONTROL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250219B">B62M25/08</main-classification>  
        <further-classification edition="200601120250219B">B62K23/04</further-classification>  
        <further-classification edition="200601120250219B">B62K11/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彥豪智能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEKTRO TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖翊均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, I-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種變速控制裝置，用以安裝於一車手把，包含一煞車單元及一電子單元。電子單元包含一電子單元束環、一電路板及一電池，電子單元束環包含一連接臂、一轉臂及一鎖固件，連接臂連接於煞車單元，轉臂的一端可樞轉地設置於連接臂，鎖固件固定轉臂及連接臂，以使連接臂及轉臂共同夾持車手把，電路板及電池設置於電子單元束環的轉臂且彼此電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shift control device is configured to be mounted on a handlebar and includes a brake unit and an electronic unit. The electronic unit includes a fastening ring, a circuit board and a battery. The fastening ring includes a connection arm, and a pivotable arm and a fastener. The connection arm is connected to the brake unit, and one end of the pivotable arm is pivotably disposed on the connection arm. The fastener fixes the pivotable arm and the connection arm for forcing the connection arm and the pivotable arm together clamp the handlebar. The circuit board and the battery are disposed on the pivotable arm and are electrically connected to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:煞車單元</p>  
        <p type="p">11:煞車把手</p>  
        <p type="p">111:煞車拉桿</p>  
        <p type="p">112:油壓缸體</p>  
        <p type="p">12:變速控制開關組件</p>  
        <p type="p">21:電子單元束環</p>  
        <p type="p">211:連接臂</p>  
        <p type="p">212:轉臂</p>  
        <p type="p">2121:電路板槽</p>  
        <p type="p">2122:電池槽</p>  
        <p type="p">213:鎖固件</p>  
        <p type="p">22:電路板</p>  
        <p type="p">23:電池</p>  
        <p type="p">24:無線訊號傳輸器</p>  
        <p type="p">H:車手把</p>  
        <p type="p">A:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="455" publication-number="202628539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱組件、電子模組及電子裝置</chinese-title>  
        <english-title>HEAT DISSIPATION ASSEMBLY, ELECTRONIC MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">H05K7/20</main-classification>  
        <further-classification edition="200601120250108B">G06F1/20</further-classification>  
        <further-classification edition="200601120250108B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭景文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHING WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹瑞蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, JUI LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱組件，用以熱耦合於一熱源且受二第一限位件限位，散熱組件包含一導熱件及二第二限位件。導熱件包含二覆蓋板，二覆蓋板相組裝且用以共同夾持熱源。二第二限位件的一部分分別可活動地設置於導熱件的相對二側，二第二限位件的另一部分可分離地設置於二覆蓋板。二第二限位件各具有一限位結構，二第二限位件的二限位結構分別用以受二第一限位件限位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation assembly is configured to be thermally coupled to a heat source and limited by two first limiting component. The heat dissipation assembly includes a thermally conductive component and two second limiting components. The thermally conductive component includes two covering plates. The two covering plates are assembled with each and are configured to clamp the heat source. Portions of the two second limiting components are respectively disposed on two opposite sides of the thermally conductive component, other portions of the two second limiting components are removably disposed on the two covering plates. Each of the two second limiting components has a limiting structure. The limiting structures of the two second limiting components are respectively configured to be limited by the two first limiting components.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:座體</p>  
        <p type="p">12:蓋體</p>  
        <p type="p">121:鰭片結構</p>  
        <p type="p">20:主機板</p>  
        <p type="p">21:插槽</p>  
        <p type="p">30:第一限位件</p>  
        <p type="p">40:電子模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="456" publication-number="202627650"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627650.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉折相機模組與電子裝置</chinese-title>  
        <english-title>OPTICAL PATH FOLDING CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250324B">G03B11/04</main-classification>  
        <further-classification edition="202101120250324B">G03B30/00</further-classification>  
        <further-classification edition="200601120250324B">G02B17/08</further-classification>  
        <further-classification edition="202101120250324B">G02B7/02</further-classification>  
        <further-classification edition="200601120250324B">G02B13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHEN-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭亦詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, I YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉折相機模組，包含一光線轉折元件、一物側透鏡、一像側透鏡以及一遮光片。光線轉折元件具有一反射面。物側透鏡具有一光學表面。光學表面為球面或非球面，且光學表面與反射面對應設置。遮光片設置於光學表面與反射面之間。遮光片包含一物側表面、一像側表面、一遮光部以及一通光口。像側表面相對設置於物側表面並面向反射面。遮光部連接物側表面與像側表面，且遮光部具有一遮光表面。通光口由遮光表面所定義。遮光表面朝向物側表面與像側表面連續地延伸且無斷裂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical path folding camera module includes a light folding element, an object-side lens element, an image-side lens element, and a light-blocking sheet. The light folding element has a reflection surface. The object-side lens element has an optical surface being spherical or aspheric and being disposed corresponding to the reflection surface. The light-blocking sheet is disposed between the optical surface and the reflection surface. The light-blocking sheet includes an object-side surface, an image-side surface, a light-blocking part, and a light opening. The image-side surface is disposed opposite to the object-side surface and facing towards the reflection surface. The light-blocking part is connected to the object-side surface and the image-side surface and has a light-blocking surface. The light opening is defined by the light-blocking surface. The light-blocking surface continuously extends towards the object-side surface and the image-side surface without any crack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:轉折相機模組</p>  
        <p type="p">1a:第一光軸</p>  
        <p type="p">1b:第二光軸</p>  
        <p type="p">101:光線轉折元件</p>  
        <p type="p">102:物側透鏡</p>  
        <p type="p">103:像側透鏡</p>  
        <p type="p">104a:遮光片</p>  
        <p type="p">IMG:成像面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="457" publication-number="202628726"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628726.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>修補基板上空缺之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR REPAIRING VACANICES ON A SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250512B">H10H29/03</main-classification>  
        <further-classification edition="200601120250512B">G05B19/404</further-classification>  
        <further-classification edition="202201120250512B">G06V10/764</further-classification>  
        <further-classification edition="202201120250512B">G06V10/82</further-classification>  
        <further-classification edition="202301120250512B">G06N3/092</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞利光智能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYLEIGH VISION INTELLIGENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂寧遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYU, NING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種修補基板上空缺之系統。該系統包含一轉移裝置、一影像識別模組及一運算處理模組。該轉移裝置係建構為轉移一第一基板上至少一第一晶片到一第二基板上至少一空缺。該影像識別模組分別檢視及得到該第一基板上該至少一第一晶片之一第一位置資料及該第二基板上該至少一第二晶片之一第二位置資料。該運算處理模組將該第一位置資料及該第二位置資料輸入一預測機器模型中，以得到一最佳的相對位移。其中該轉移裝置產生該第二基板及該第一基板之間具該最佳的相對位移之運動以進行該至少一第一晶片之轉移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for repairing vacancies on a substrate is provided. The system comprises a transfer apparatus, an image recognition module, and a computing processor. The transfer apparatus is configured to transfer at least one first chip on a first substrate into a vacancy on a second substrate. The image recognition module respectively inspects and obtains the first position data of the at least one first chip on the first substrate and the second position data of at least one second chip on the second substrate. The computing processor inputs the first position data and the second position data into a prediction machine model and obtains an optimal relative displacement, wherein the transfer apparatus generates a movement with the optimal relative displacement between the second substrate and the first substrate so as to proceed the transfer of the at least one first chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:架構</p>  
        <p type="p">41:修補平台模擬器</p>  
        <p type="p">42:平台位移預測模型</p>  
        <p type="p">43:損失函數模型</p>  
        <p type="p">P:參數</p>  
        <p type="p">Q:平台位移分數</p>  
        <p type="p">R:數量</p>  
        <p type="p">S1、S2:陣列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="458" publication-number="202626248"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626248.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具偏位分配之滾珠通道的滾珠線性滑軌及其滑座</chinese-title>  
        <english-title>BALL LINEAR GUIDE RAIL WITH OFFSET DISTRIBUTION BALL CHANNELS AND CORRESPONDING SLIDE SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">B23Q1/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高明鐵企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GMT GLOBAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳居亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種具偏位分配之滾珠通道的滾珠線性滑軌及其滑座，所述滾珠線性滑軌，包括一長形的軌條、一個該滑座及數個滾珠，其中二迴圈狀的通道分別形成於該滑座，各該通道分別具有一負荷段，各該負荷段分別位於該軌條與該滑座之間，每一個該通道均設有多個該滾珠分別在各該通道循環滾動，各該負荷段分別由該軌條及該滑座共同形成，沿著正交於該滑座的軸向的方向上，該滑座拘束滾動通過各該負荷段的各該滾珠，從而限制通過各該負荷段的各該滾珠，據此降低該軌條生產過程的困難度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a ball linear guide rail with offset distribution ball channels and a corresponding slide seat. The ball linear guide rail comprises an elongated rail, a slide seat, and a plurality of balls. Two loop-shaped channels are respectively formed in the slide seat, each channel comprising a load section positioned between the rail and the slide seat. Each channel accommodates a plurality of the balls, which circulate and roll within the respective channel. Each load section is formed jointly by the rail and the slide seat. Along a direction orthogonal to an axial direction of the slide seat, the slide seat constrains the rolling of the balls through each load section, thereby limiting the movement of the balls through the load sections and reducing the manufacturing difficulty of the rail.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:軌條</p>  
        <p type="p">21:第一珠槽</p>  
        <p type="p">22:第一槽口</p>  
        <p type="p">23:第一抵靠面</p>  
        <p type="p">30:滑座</p>  
        <p type="p">32:第二珠槽</p>  
        <p type="p">33:第二槽口</p>  
        <p type="p">34:第二抵靠面</p>  
        <p type="p">35:過渡部位</p>  
        <p type="p">40:滾珠</p>  
        <p type="p">54:負荷段</p>  
        <p type="p">C2:球形中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="459" publication-number="202628063"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628063.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板及其壞點屏蔽方法</chinese-title>  
        <english-title>DISPLAY PANEL AND METHOD FOR SHIELDING DEFECTIVE PIXEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G09G3/36</main-classification>  
        <further-classification edition="200601120250418B">G02F1/137</further-classification>  
        <further-classification edition="200601120250418B">G02F1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何雨璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YU HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林弘哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃孟秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MENG-CHIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板及其壞點屏蔽方法。顯示面板包括掃描線、資料線、共同電壓線、以及畫素電路。掃描線接收閘極電壓，資料線接收資料電壓，並且共同電壓線接收共同電壓。畫素電路具有電晶體以及膽固醇液晶電容，其中電晶體具有耦接資料線第一端、耦接掃描線的控制端、以及第二端。在畫素電路的壞點畫素電路中，膽固醇液晶電容耦接於電晶體的控制端與共同電壓線之間，並且設定這些資料電壓及共同電壓的電壓波形，使得壞點畫素電路的膽固醇液晶操作於焦點圓錐(focal conic)狀態或一焦點圓錐+平面(planar)狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An display panel and a method for shielding defective pixels are provided. The display panel includes scan lines, data lines, common voltage lines, and pixel circuits. The scan lines receive gate voltages, the data lines receive data voltages, and the common voltage line receives a common voltage. The pixel circuits each has a transistor and a cholesterol liquid crystal capacitor, wherein the transistor has a first end coupled to the data line, a control end coupled to the scan line, and a second end. In a defective pixel circuit of the pixel circuits, the cholesterol liquid crystal capacitor is coupled between the control terminal of the transistor and the common voltage line, and sets voltage waveforms of the data voltages and the common voltage such that cholesterol liquid crystals with the defective pixel circuit operate in a focal conic state or a focal conic + planar state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示面板</p>  
        <p type="p">Clc:膽固醇液晶電容</p>  
        <p type="p">ELpxl:畫素電極</p>  
        <p type="p">Lcom:共同電壓線</p>  
        <p type="p">Ldat:資料線</p>  
        <p type="p">Lsc:掃描線</p>  
        <p type="p">PXb:壞點畫素電路</p>  
        <p type="p">PXn:正常畫素電路</p>  
        <p type="p">T:電晶體</p>  
        <p type="p">Vcom:共同電壓</p>  
        <p type="p">VG:閘極電壓</p>  
        <p type="p">Vdata:資料電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="460" publication-number="202628529"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628529.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150427</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K7/18</main-classification>  
        <further-classification edition="201701120250418B">A47B88/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南俊國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張富田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FU-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊豐銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, FENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌裝置，包含：一第一滑軌總成，該第一滑軌總成至少包括一第一軌及一第二軌，該第二軌相對於該第一軌進行活動位移；一滑件，該滑件位在該第一軌之側面上，且該滑件相對於該第一軌之側面進行滑動；一擋件，該擋件設在該滑件上，且該擋件具有一導引體；以及一導軌件，該導軌件設在該第二軌上，且該導軌件具有一導引軌道，而該導引體在該導引軌道進行移動；藉此，當該導軌件移動於該導引軌道之第一位置，則該擋件連動該滑件進行第一滑動狀態，或當該導軌件移動於該導引軌道之第二位置，則該擋件連動該滑件進行第二滑動狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">100:第一滑軌總成</p>  
        <p type="p">110:第一軌</p>  
        <p type="p">111:第一定位孔</p>  
        <p type="p">112:第二定位孔</p>  
        <p type="p">113:第一導引孔</p>  
        <p type="p">114:第二導引孔</p>  
        <p type="p">120:第二軌</p>  
        <p type="p">130:滑件</p>  
        <p type="p">131:凸包</p>  
        <p type="p">132:彈力臂</p>  
        <p type="p">133:第一安裝孔</p>  
        <p type="p">134:滑孔</p>  
        <p type="p">140:擋件</p>  
        <p type="p">150:導軌件</p>  
        <p type="p">151:導引軌道</p>  
        <p type="p">152:第一導引塊</p>  
        <p type="p">153:第二導引塊</p>  
        <p type="p">160:第三軌</p>  
        <p type="p">161:通口</p>  
        <p type="p">170:第四軌</p>  
        <p type="p">200:鎖件</p>  
        <p type="p">210:第二安裝孔</p>  
        <p type="p">B:阻擋面</p>  
        <p type="p">P1:第一位置</p>  
        <p type="p">P2:第二位置</p>  
        <p type="p">FT:固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="461" publication-number="202628382"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628382.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於量子控制與讀取的訊號傳輸系統</chinese-title>  
        <english-title>SIGNAL TRANSMISSION SYSTEM FOR QUANTUM CONTROL AND READ-OUT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">H04B10/90</main-classification>  
        <further-classification edition="202201120250401B">G06N10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李哲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHE-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張博盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種用於量子控制與讀取的訊號傳輸系統，其包括控制模組、第一訊號轉換模組、塑膠波導單元、第二訊號轉換模組、以及量子位元。控制模組處於第一溫度下。第一訊號轉換模組連接控制模組。塑膠波導單元連接第一訊號轉換模組，並處於第二溫度下。第二訊號轉換模組連接塑膠波導單元。量子位元連接第二訊號轉換模組，並處於第二溫度下，其中第一訊號轉換模組以及第二訊號轉換模組用於轉換塑膠波導單元與量子位元之間的訊號。其中，第一溫度大於第二溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A signal transmission system for quantum control and read-out is provided, which includes a control module, a first signal transition module, a plastic waveguide unit, a second signal transition module, and a qubit. The control module is at the first temperature. The first signal transition module connects the control module. The plastic waveguide unit connects the first signal transition module and is at the second temperature. The second signal transition module connects the plastic waveguide unit and is at the second temperature. The qubit connects the second signal transition module and is at the second temperature, wherein the first signal transition module and the second signal transition module are used to converts a single between the plastic waveguide unit and the qubit. Among them, the first temperature is greater than the second temperature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:訊號傳輸系統</p>  
        <p type="p">10:控制模組</p>  
        <p type="p">11:第一訊號轉換模組</p>  
        <p type="p">110:第一混頻單元</p>  
        <p type="p">111:第一轉接單元</p>  
        <p type="p">12:塑膠波導單元</p>  
        <p type="p">13:第二訊號轉換模組</p>  
        <p type="p">130:第二轉接單元</p>  
        <p type="p">131:第二混頻單元</p>  
        <p type="p">14:量子位元</p>  
        <p type="p">CS1:第一控制訊號</p>  
        <p type="p">CS2:第二控制訊號</p>  
        <p type="p">RS1:第一讀取訊號</p>  
        <p type="p">RS2:第二讀取訊號</p>  
        <p type="p">TS1:第一傳輸訊號</p>  
        <p type="p">TS2:第二傳輸訊號</p>  
        <p type="p">T1,T2:溫度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="462" publication-number="202626908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種微波裂解廢輪胎再生碳黑的方法</chinese-title>  
        <english-title>A METHOD FOR MICROWAVE PYROLYSIS OF WASTE TIRES TO REGENERATE CARBON BLACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C08J11/12</main-classification>  
        <further-classification edition="200601120250501B">C09C1/48</further-classification>  
        <further-classification edition="200601120250501B">C10B19/00</further-classification>  
        <further-classification edition="200601120250501B">C10B53/07</further-classification>  
        <further-classification edition="200601120250501B">C10G1/00</further-classification>  
        <further-classification edition="200601120250501B">C10G1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEILIN HOLDINGS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林能源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁敏航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, MIN-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊茹媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種微波裂解廢輪胎再生碳黑的方法，其主要步驟包含：步驟(1)：將一大片廢輪胎置入一微波加熱腔體，該微波加熱腔體具有至少一進氣口與至少一出氣口，該出氣口藉由一管路連接到一外部抽氣裝置；步驟(2)：在該微波加熱腔體中經由該至少一進氣口通入含惰性氣體的一無氧氣氛，該大片廢輪胎進行一第一微波熱處理以形成複數個半完成碳黑與複數條表面有殘碳的金屬線；步驟(3)：在該微波加熱腔體中經由該至少一進氣口通入含混合空氣的一低氧氣氛下，該些半完成碳黑與該些表面有殘碳的金屬線進行一第二微波熱處理以形成複數個再生碳黑與複數條再生金屬線；以及步驟(4)：該些再生碳黑與該些再生金屬線由該微波加熱腔體中進入一冷卻容器中後進入一輸送帶以取出。該方法操作簡單方便，微波處理產生的再生碳黑為具有原碳黑的特性，為可利用的再生資源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a method for microwave pyrolysis of a method for microwave pyrolysis of waste tires to regenerate carbon black, main steps comprising: step (1): placing a large piece of waste tires into a microwave heating cavity, the microwave heating cavity having at least one air inlet and at least one air outlet, which is connected to an external air extraction device through a pipeline; step (2): through the at least one air inlet to inject an inert gas in a oxygen-free atmosphere into the microwave heating cavity, performing the large piece of waste tire a first microwave heat treatment in the microwave heating cavity to form a plurality of semi-finished carbon blacks and a plurality of metal lines with residual carbon on the surface; step (3): through the at least one air inlet to inject a containing mixed air in a low-oxygen atmosphere into the microwave heating cavity, performing the semi-finished carbon black and the metal lines with residual carbon on the surface a second microwave heat treatment in the microwave heating cavity to form a plurality of regenerated carbon black and a plurality of regenerated metal wires; and steps (4): entering the regenerated carbon black and the regenerated metal wires a cooling container from the microwave heating cavity and then entering a conveyor belt for removal. This method is simple and convenient to operate since the regenerated carbon black produced by microwave treatment has the characteristics of original carbon black and is an available renewable resource.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="463" publication-number="202626217"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626217.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種觸媒輔助微波裂解廢塑膠的方法</chinese-title>  
        <english-title>A METHOD FOR CATALYST-ASSISTED MICROWAVE PYROLYSIS OF WASTE PLASTIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">B09B3/50</main-classification>  
        <further-classification edition="200601120250401B">H05B6/64</further-classification>  
        <further-classification edition="200601120250401B">C08J11/12</further-classification>  
        <further-classification edition="202201320250401B">B09B101/75</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEILIN HOLDINGS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林能源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁敏航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, MIN-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊茹媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種觸媒輔助微波廢裂解塑膠的方法，其主要步驟包含步驟(1)：將一大片廢塑膠破碎成複數個廢塑膠片；步驟(2)：將該些廢塑膠片與一觸媒物質一起置入一微波加熱腔體後混合均勻；步驟(3)：在該微波加熱腔體中的一無氧氣氛，該些廢塑膠片進行一微波高溫處理以形成複數個固態碳材與氣體揮發物；以及步驟(4)：該些固態碳材由該微波加熱腔體中進入一冷卻容器中，且該氣體揮發物由該微波加熱腔體的該至少一出氣口中進入一冷凝管路後在一收集容器中形成一燃油。藉由觸媒輔助微波裂解，本方法在較低溫與常壓下從廢塑膠中，提高高價值碳材的回收率、縮短反應時間、簡化反應流程、節約能源、保護環境的需求下，同時實現高品質燃油的再生利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a method for catalyst-assisted microwave pyrolysis of waste plastic, the main steps comprising: step (1):crushing a large piece of waste plastic into a plurality of waste plastic pieces; step (2): combining the waste plastic pieces with a catalyst substance together into a microwave heating cavity and mixed evenly; step (3): in an oxygen-free atmosphere in the microwave heating cavity, subjecting the waste plastic sheets to a microwave high temperature treatment to form a plurality of solid carbon materials and gas volatiles; and step (4): entering the solid carbon materials to a cooling container from the microwave heating cavity and the gas volatiles a condensation tube from the at least one outlet of the microwave heating cavity to form a fuel oil in a collection container behind the condensation tube. Through catalyst-assisted microwave pyrolysis, this method can improve the recovery rate of high-value carbon materials at lower temperatures and normal pressures, shorten the reaction time, simplify the reaction process, save energy, and protect the environment, as well as achieve high quality fuel oil from waste plastics.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="464" publication-number="202626502"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626502.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種微波再生活性碳的方法</chinese-title>  
        <english-title>A METHOD FOR MICROWAVE PYROLYSIS OF WASTE TIRES TO REGENERATE CARBON BLACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250402B">C01B32/36</main-classification>  
        <further-classification edition="200601120250402B">H05B6/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEILIN HOLDINGS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林能源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁敏航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, MIN-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊茹媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種微波再生活性碳的方法，其主要步驟包含：步驟(1)：步驟(1)：將複數個廢活性碳材料置入一微波加熱腔體，該微波加熱腔體具有至少一進氣口與至少一出氣口，該出氣口藉由一管路連接到一外部抽氣裝置；步驟(2)：在該微波加熱腔體中經由該至少一進氣口通入壓縮空氣的一低氧氣氛，該複數個廢活性碳材料進行一微波低溫碳化熱處理以形成複數個碳化活性碳；步驟(3)：在該微波加熱腔體中經由該至少一進氣口通入含惰性氣體的一無氧氣氛下，該些碳化活性碳進行一微波活化處理以形成複數個再生活性碳；以及步驟(4)：該些再生活性碳由該微波加熱腔體中進入一冷卻容器中以取出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a method for a method for microwave regeneration of activated carbon, the main steps comprising: step (1): putting a plurality of waste activated carbon materials into a microwave heating cavity, the microwave heating cavity having at least an air inlet and at least one air outlet, the air outlet connected to an external air extraction device through a pipeline; step (2): through the at least one air inlet to inject an inert gas in a oxygen-free atmosphere into the microwave heating cavity, subjecting the plurality of waste activated carbon materials to a microwave low-temperature carbonization heat treatment to form a plurality of carbonized activated carbons; step (3): through the at least one air inlet to introduce the mixture containing the mixture under an oxygen-free atmosphere of air in the microwave heating cavity, subjecting the carbonized activated carbon a microwave activation treatment to form a plurality of regenerated activated carbon; and step (4): entering the regenerated activated carbon a cooling container from the microwave heating cavity to take out.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="465" publication-number="202627884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>針對資料不平衡的資料處理裝置及方法</chinese-title>  
        <english-title>DATA PROCESSING APPARATUS AND METHOD FOR DATA IMBALANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06N3/045</main-classification>  
        <further-classification edition="202301120250401B">G06N3/088</further-classification>  
        <further-classification edition="201901120250401B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優式資本股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UC CAPITAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉建華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, JIAN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林欣宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鼎杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種針對資料不平衡的資料處理裝置及方法被揭露於此。該資料處理裝置根據高斯分布分別計算出多數樣本資料以及少數樣本資料的超橢球體，並比對該超橢球體以及該另一超橢球體以界定一重疊區域。該資料處理裝置還透過一生成對抗網路模組避開該重疊區域對該少數樣本資料進行過採樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data processing apparatus and a data processing method for data imbalance are disclosed herein. The data processing apparatus calculates a hyper-ellipsoid for majority sample data and another hyper-ellipsoid for minority sample data according to a Gaussian distribution, and compare the two hyper-ellipsoids to define an overlapping region between the two hyper-ellipsoids. The data processing apparatus also performs oversampling on the minority sample data with a generative adversarial network module while avoiding the overlapping region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資料處理裝置</p>  
        <p type="p">11:儲存器</p>  
        <p type="p">13:處理器</p>  
        <p type="p">14:輸入/輸出介面</p>  
        <p type="p">111:多數樣本資料</p>  
        <p type="p">113:少數樣本資料</p>  
        <p type="p">115:生成對抗網路模組</p>  
        <p type="p">U1:使用者裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="466" publication-number="202628217"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628217.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150442</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有防火結構之大功率電池模組及其防止熱失控之操作方法</chinese-title>  
        <english-title>HIGH POWER BATTERY MODULE HAVING FIREPROOF STRUCTURE AND OPERATION METHOD THEREOF FOR PREVENTING THERMAL RUNAWAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250501B">H01M10/058</main-classification>  
        <further-classification edition="201401120250501B">H01M10/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合檥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITEK FIREPROOF CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王智杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒純忻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃大維</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種具有防火結構之大功率電池模組及其防止熱失控之操作方法，大功率電池模組包含電池外殼、第一功率電池組、第二功率電池組、防火隔熱緩衝片以及防火發泡膨脹阻燃片。電池外殼包含金屬殼體及散熱開口，散熱開口通過迂迴通道結構連通於金屬殼體內部。第一功率電池組包含第一電池電芯，第二電池組包含第二電池電芯，第一電池電芯的正極與第二電池電芯的負極的電芯朝向相同方向，電池組與金屬殼體之間具有通風管道。防火隔熱緩衝片設置於第一功率電池組與第二功率電池組之間，防火發泡膨脹阻燃片分別設置於通風管道及散熱開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high power battery module having a fireproof structure and an operation method thereof for preventing thermal runaway are disclosed. The high power battery module includes a battery case, a first power battery pack, a second power battery pack, a fireproof and heat insulating buffer sheet and a fireproof foaming expansion flame retardant sheet. The battery case includes a metal casing and a heat dissipation opening. The heat dissipation opening is connected to the inside of the metal case through a circuitous passage structure. The first power battery pack includes first battery cells and the second power battery pack includes second battery cells. The positive electrode of the first battery cell and the negative electrode of the second battery cell face the same direction. A ventilation duct is disposed between battery packs and the metal case. The fireproof and heat insulating buffer sheet is disposed between the first power battery pack and the second power battery pack. The fireproof foaming expansion flame retardant sheet is arranged respectively in the ventilation duct and the heat dissipation opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:大功率電池模組</p>  
        <p type="p">11:電池外殼</p>  
        <p type="p">12:第一功率電池組</p>  
        <p type="p">13:第二功率電池組</p>  
        <p type="p">14:防火隔熱緩衝片</p>  
        <p type="p">15:防火發泡膨脹阻燃片</p>  
        <p type="p">111:金屬殼體</p>  
        <p type="p">112:散熱開口</p>  
        <p type="p">113:金屬連接片</p>  
        <p type="p">114:金屬擋牆</p>  
        <p type="p">115:迂迴通道結構</p>  
        <p type="p">116:風扇</p>  
        <p type="p">121:第一電池電芯</p>  
        <p type="p">131:第二電池電芯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="467" publication-number="202628233"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628233.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有防火結構之電池模組及其防止熱失控之操作方法</chinese-title>  
        <english-title>BATTERY MODULE HAVING FIREPROOF STRUCTURE AND OPERATION METHOD THEREOF FOR PREVENTING THERMAL RUNAWAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250122B">H01M50/431</main-classification>  
        <further-classification edition="202101120250122B">H01M50/44</further-classification>  
        <further-classification edition="202101120250122B">H01M50/383</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合檥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITEK FIREPROOF CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王智杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒純忻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃大維</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種具有防火結構之電池模組及其防止熱失控之操作方法，電池模組包含電池外殼、電池組、防火隔熱緩衝片以及防火發泡膨脹隔熱片。電池外殼包含金屬殼體及散熱開口，散熱開口通過迂迴通道結構連通於金屬殼體內部。電池組包含複數個電池電芯的串聯、並聯或串並聯組合，設置於金屬殼體內部，電池組與金屬殼體之間具有通風管道。防火隔熱緩衝片設置於複數個電池電芯之間，防火發泡膨脹隔熱片分別設置於通風管道及散熱開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery module having a fireproof structure and an operation method thereof for preventing thermal runaway are disclosed. The battery module includes a battery case, a battery pack, a fireproof and heat insulating buffer sheet and a fireproof foaming expansion heat insulating sheet. The battery case includes a metal casing and a heat dissipation opening. The heat dissipation opening is connected to the inside of the metal case through a circuitous passage structure. The battery pack includes a plurality of battery cells connected in series, parallel, or a combination of series and parallel, and is arranged inside the metal case. A ventilation duct is disposed between the battery pack and the metal case. The fireproof and heat insulating buffer sheet is disposed between the plurality of battery cells, and fireproof foaming expansion heat insulating sheet is arranged respectively in the ventilation duct and the heat dissipation opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:具有防火結構之電池模組</p>  
        <p type="p">11:電池外殼</p>  
        <p type="p">12:電池組</p>  
        <p type="p">13:防火隔熱緩衝片</p>  
        <p type="p">14:防火發泡膨脹隔熱片</p>  
        <p type="p">111:金屬殼體</p>  
        <p type="p">112:散熱開口</p>  
        <p type="p">113:金屬連接片</p>  
        <p type="p">114:金屬擋牆</p>  
        <p type="p">115:迂迴通道結構</p>  
        <p type="p">116:風扇</p>  
        <p type="p">121:電池電芯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="468" publication-number="202627917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>倉儲管理之貨物定位系統、方法及其電腦可讀媒介</chinese-title>  
        <english-title>GOODS POSITIONING SYSTEM FOR WAREHOUSE MANAGEMENT, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250126B">G06Q10/087</main-classification>  
        <further-classification edition="202401120250126B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250126B">G06Q10/0875</further-classification>  
        <further-classification edition="202301120250126B">G06F18/213</further-classification>  
        <further-classification edition="200601120250126B">B65G1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關貿網路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRADE-VAN INFORMATION SERVICES CO.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炳嶽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PING YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李郁婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種倉儲管理之貨物定位系統及其方法，提供倉庫內儲位管理，其中，貨物與儲區分別建立對應之快速回應碼(QRCode)，推高載具上設置有擷取該快速回應碼的人工智慧辨識鏡頭，以於搬運貨物過程能取得貨物訊息與儲區訊息，並透過警示燈進行狀態顯示，該貨物訊息與該儲區訊息透過介接主機傳送至後端平台儲存，本發明採用QR碼以及長距離廣域網路，故能在低成本下進行整個倉庫貨物之管理，後端平台即時接收貨物或儲區的相關訊息，以減少誤判貨物位置或儲區空間之問題。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a goods positioning system for warehouse management and method thereof, and storage location management in the warehouse can be provided. QR Codes can be created for goods and storage areas respectively. The vehicle is equipped with an artificial intelligence recognition lens that captures the QR Codes, so that goods information and storage area information can be obtained during the transportation of goods, and status can be displayed through a warning light. The goods information and the storage area information are sent to a back-end platform for storage through an interface host. QR codes and long-distance wide area networks are used in the present invention, so it can manage goods in the entire warehouse at low cost. The back-end platform receives relevant information about goods or storage areas in real time, reducing the problem of misjudgment of goods locations or storage space. The present invention also provides a computer-readable medium for executing the method of the present invention.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:倉儲管理之貨物定位系統</p>  
        <p type="p">11:堆高載具</p>  
        <p type="p">111:人工智慧辨識鏡頭</p>  
        <p type="p">112:介接主機</p>  
        <p type="p">113:警示燈</p>  
        <p type="p">12:後端平台</p>  
        <p type="p">20:貨物快速回應碼</p>  
        <p type="p">21:儲區快速回應碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="469" publication-number="202628031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊資料補償方法</chinese-title>  
        <english-title>VIDEO DATA COMPENSATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G09G3/20</main-classification>  
        <further-classification edition="200601120250401B">G09G5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYDIUM SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林桂吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUEI-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡富全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, FU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳泓毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余捷如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIE-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於視訊資料補償的方法，包含：經由一接收端接收經配置以提供至一顯示器的一顯示資料，該顯示資料包括一消隱資訊；基於該消隱資訊以及該顯示器的一更新率，經由一補償模組以一虛擬補償資料對該顯示資料進行一第一補償處理；以及經由一輸出端(輸出經該第一補償處理的該顯示資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for video data compensation, comprising: receiving a display data configured to be provided to a display through a receiver, the display data includes a blanking information; based on the blanking information and an update rate of the display, performing a first compensation process on the display data using a dummy compensation data through a compensation module; and transmitting the display data processed by the first compensation process through a transmitter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:視訊資料補償方法</p>  
        <p type="p">S1、S2、S3:流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="470" publication-number="202626220"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626220.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可適用不同尺寸的彎管線工具</chinese-title>  
        <english-title>BENDER ADAPTED FOR DIFFERENT SIZES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250421B">B21D7/00</main-classification>  
        <further-classification edition="200601120250421B">B21D7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐州工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG CHOU INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉茂棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, MOU TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡侑芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可適用不同尺寸的彎管線工具包括有一個扳桿、一個工具頭及一個滑塊，工具頭連接於扳桿的一端，工具頭的一側設置有一個固定支點及一個彎折空間，滑塊可滑移地連接於工具頭，滑塊鄰近固定支點的一端設置有一個活動支點，彎折空間設置於固定支點與活動支點之間，滑塊相對工具頭移動時能夠改變固定支點與活動支點之間的距離，工具透過上述結構能供使用者依據管線直徑調整尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bender adapted for different sizes includes a lever, a tool head, and a sliding block. The tool head is connected to one end of the lever and features a fixed fulcrum and a bending space. The sliding block, slidably connected to the tool head, has a movable fulcrum at one end adjacent to the fixed fulcrum. The bending space is located between the fixed fulcrum and the movable fulcrum. By moving the sliding block relative to the tool head, the distance between the two fulcrums can be adjusted. This design allows the bender to adapt to pipes or cables of different sizes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工具</p>  
        <p type="p">20:扳桿</p>  
        <p type="p">21:第一樞耳</p>  
        <p type="p">30:工具頭</p>  
        <p type="p">32:彎折空間</p>  
        <p type="p">33:凸耳</p>  
        <p type="p">35:第二樞耳</p>  
        <p type="p">36:樞軸</p>  
        <p type="p">37:第三樞耳</p>  
        <p type="p">40:滑塊</p>  
        <p type="p">422:撥轉部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="471" publication-number="202626272"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626272.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調角度的彎管線工具</chinese-title>  
        <english-title>ADJUSTABLE ANGLE BENDING TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250218B">B25B5/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐州工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG CHOU INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉茂棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, MOU TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡侑芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可調角度的彎管線工具包括有一個扳桿、一個工具頭及一個樞軸，扳桿的一端設置有一個第一樞耳，第一樞耳設置有一個第一樞孔，工具頭設置有一個第二樞耳，第二樞耳設置有一個第二樞孔，工具頭連接於扳桿的一端，工具頭的一側設置有一個第一支點、一個第二支點及一個彎折空間，樞軸插接於第一樞孔與第二樞孔，使工具頭能以樞軸為中心相對扳桿樞轉擺動，第一支點面向相反於樞軸的方向，彎折空間設置於第一支點與第二支點之間，工具透過上述結構能供使用者調整角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adjustable angle bending tool includes a lever, a tool head, and a pivot. One end of the lever is provided with a first pivot ear, which is provided with a first pivot hole. The tool head is provided with a second pivot ear, which is provided with a second pivot hole. The tool head is connected to one end of the lever. One side of the tool head is configured with a first fulcrum, a second fulcrum, and a bending space. The pivot is inserted into the first pivot hole and the second pivot hole, allowing the tool head to pivot and swing relative to the lever around the pivot. The first fulcrum faces in a direction opposite to the pivot, and the bending space is positioned between the first fulcrum and the second fulcrum. Through the above structure, the tool enables the user to adjust the angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工具</p>  
        <p type="p">20:扳桿</p>  
        <p type="p">21:第一樞耳</p>  
        <p type="p">30:工具頭</p>  
        <p type="p">31:第二樞耳</p>  
        <p type="p">32:第一支點</p>  
        <p type="p">33:第二支點</p>  
        <p type="p">34:彎折空間</p>  
        <p type="p">35:第三樞耳</p>  
        <p type="p">37:凸柱</p>  
        <p type="p">40:樞軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="472" publication-number="202626273"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626273.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調角度的彎管線工具</chinese-title>  
        <english-title>ADJUSTABLE ANGLE BENDING TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250430B">B25B5/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐州工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG CHOU INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉茂棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, MOU TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡侑芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可調角度的彎管線工具包括有一個扳桿、一個工具頭及一個樞軸，扳桿的一端設置有一個第一樞耳，第一樞耳設置有一個第一樞孔，工具頭設置有一個第二樞耳，第二樞耳設置有一個第二樞孔，工具頭連接於扳桿的一端，工具頭的一側設置有一個第一支點及一個彎折空間，樞軸插接於第一樞孔與第二樞孔，使工具頭能以樞軸為中心相對扳桿樞轉擺動，樞軸沿其徑向的外周緣設置有一個第二支點，彎折空間設置於第一支點與第二支點之間，工具透過上述結構能供使用者調整角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adjustable angle bending tool includes a lever, a tool head, and a pivot. One end of the lever is provided with a first pivot ear, which is provided with a first pivot hole. The tool head is provided with a second pivot ear, which is provided with a second pivot hole. The tool head is connected to one end of the lever. One side of the tool head is configured with a first fulcrum and a bending space. The pivot is inserted into the first pivot hole and the second pivot hole, allowing the tool head to pivot and swing relative to the lever around the pivot. The outer periphery of the pivot along its radial direction is provided with a second fulcrum. The bending space is positioned between the first fulcrum and the second fulcrum. Through the above structure, the tool enables the user to adjust the angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工具</p>  
        <p type="p">20:扳桿</p>  
        <p type="p">21:第一樞耳</p>  
        <p type="p">30:工具頭</p>  
        <p type="p">31:第二樞耳</p>  
        <p type="p">32:第一支點</p>  
        <p type="p">33:彎折空間</p>  
        <p type="p">34:凸柱</p>  
        <p type="p">36:第三樞耳</p>  
        <p type="p">40:樞軸</p>  
        <p type="p">41:第二支點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="473" publication-number="202628016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可載入個人化專屬資料之教育元宇宙互動平台</chinese-title>  
        <english-title>EDUCATIONAL METAVERSE INTERACTION PLATFORM SYSTEM CAPABLE OF LOADING PERSONAL ASSOCIATED DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G09B5/06</main-classification>  
        <further-classification edition="200601120250418B">G06F3/01</further-classification>  
        <further-classification edition="201301120250418B">G06F21/32</further-classification>  
        <further-classification edition="201301120250418B">G06F21/64</further-classification>  
        <further-classification edition="201901120250418B">G06F16/9535</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF KAOHSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHENG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種教育元宇宙互動平台，用以解決習知互動平台功能過於單一的問題。係包含：外部處理模組、驗證裝置、外部使用者資料庫及使用者資料庫之間彼此耦接，當使用者透過驗證裝置偵測其生物資訊時，外部處理模組接收並判斷驗證裝置所偵測的生物資訊，是否與外部驗證資訊集中的生物資訊一致；當判斷為一致時，外部處理模組發出對應的控制指令，以將外部專屬資料集中對應使用者的外部專屬資料傳輸至教育元宇宙互動平台中的使用者資料庫儲存。本發明可以達成載入其他外部平台取得的專屬資訊的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An educational metaverse interaction platform system is adapted for solving the problem that the functionality of conventional platform system is limited. The system includes an external processing module, a verification device, an external user database and a user database are coupled with each other. When a biometric information of a user is detected through the verification device, the external processing module receives and determines whether the biometric information detected by the verification device matches the biometric information in an external verification information set. When a match is determined, the external processing module generates a corresponding control command to transmit the exclusively assigned data, corresponding to the user, from an external exclusive database to the user database within the educational metaverse interactive platform system for storage. This invention achieves the effect of loading exclusively assigned information obtained from other external platforms.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">EMIP:教育元宇宙互動平台</p>  
        <p type="p">1:處理模組</p>  
        <p type="p">2:影像投放設備</p>  
        <p type="p">462:關聯專屬資料集</p>  
        <p type="p">6:驗證裝置</p>  
        <p type="p">7:外部平台</p>  
        <p type="p">71:外部處理模組</p>  
        <p type="p">720:外部驗證資訊集</p>  
        <p type="p">721:外部專屬資料集</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="474" publication-number="202628017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於互動管理之教育元宇宙互動平台</chinese-title>  
        <english-title>EDUCATIONAL METAVERSE INTERACTION PLATFORM SYSTEM FOR INTERACTION MANAGEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G09B5/06</main-classification>  
        <further-classification edition="200601120260401B">G06F3/01</further-classification>  
        <further-classification edition="202601120260401B">G06Q10/00</further-classification>  
        <further-classification edition="201401120260401B">A63F13/87</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF KAOHSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHENG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種教育元宇宙互動平台，用以解決習知互動平台功能過於單一的問題。係包含：在一場景資訊所對應的一場景影像中，場景管控者透過管理權限，針對受管理使用者執行分組關聯、位置關聯、權限管理及狀態判定中的至少一者；所述分組關聯用於指定受管理使用者之間的組別；所述位置關聯用於指定受管理使用者移動到對應場景中的特定座標；所述權限管理用於控制受管理使用者在對應場景中的特定能力的操控性；所述狀態判定用於針對受管理使用者的一感興趣狀態進行判定。本發明可以達成在虛擬場景中便利管理互動活動的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An educational metaverse interaction platform system is adapted for solving the problem that the functionality of conventional platform system is limited. In a scene image corresponding to a scene information, the system is configured to provide a scene controller perform an interaction management including at least one of a group association, a location association, a permission management and a status determination on managed users. The group association is performed to assign one of the managed users into a group. The location association is performed to move one of the managed users to a specific coordinate in the scene image. The permission management is performed to enable or disable a specific operation for one of the managed users in the scene image. The status determination is performed to determine an interested status of one of the managed users. This invention can achieve the effect of facilitating the management of interactive activities within virtual scenes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">EMIP:教育元宇宙互動平台</p>  
        <p type="p">1:處理模組</p>  
        <p type="p">2:影像投放設備</p>  
        <p type="p">3:實體操作設備</p>  
        <p type="p">4:平台資料庫</p>  
        <p type="p">41:角色資料庫</p>  
        <p type="p">42:場景資料庫</p>  
        <p type="p">43:物件資料庫</p>  
        <p type="p">44:影音資料庫</p>  
        <p type="p">45:圖文資料庫</p>  
        <p type="p">46:使用者資料庫</p>  
        <p type="p">460:驗證資訊資料庫</p>  
        <p type="p">461:慣用設定紀錄</p>  
        <p type="p">462:關聯專屬資料集</p>  
        <p type="p">5:平台模組</p>  
        <p type="p">6:驗證裝置</p>  
        <p type="p">7:外部單元</p>  
        <p type="p">71:外部處理模組</p>  
        <p type="p">72:外部使用者資料庫</p>  
        <p type="p">720:外部驗證資訊集</p>  
        <p type="p">721:外部專屬資料集</p>  
        <p type="p">A:登入模組</p>  
        <p type="p">B:角色模組</p>  
        <p type="p">C:場景模組</p>  
        <p type="p">C1:交流場景</p>  
        <p type="p">C10:開放區域</p>  
        <p type="p">C11:限定區域</p>  
        <p type="p">C2:授課場景</p>  
        <p type="p">C3:直播場景</p>  
        <p type="p">C4:活動場景</p>  
        <p type="p">C5:使用者場景</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="475" publication-number="202628302"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628302.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變頻壓縮機之分配供電控制系統</chinese-title>  
        <english-title>A POWER DISTRIBUTION AND CONTROL SYSTEM FOR VARIABLE FREQUENCY COMPRESSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H02J3/18</main-classification>  
        <further-classification edition="202601120260401B">H02J3/38</further-classification>  
        <further-classification edition="200601120260401B">H02J7/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東元電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECO ELECTRIC &amp; MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳夢麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝仕奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHIHKUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓家仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, CHIA-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳皇嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUANG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭志弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種變頻壓縮機之分配供電控制系統，電性連接於變頻壓縮機，並且包含市電供電電路、光伏模組供電電路、逆變器與供電模式切換模組。市電供電電路包含市電電壓源、交流轉直流轉換器與市電轉換控制模組。光伏模組供電電路包含光伏模組、直流轉直流轉換器與光伏轉換控制模組。供電模式切換模組，設有日照充足電壓與日照不足電壓，用以感測光伏模組提供之光伏輸入電壓，在光伏輸入電壓大於日照充足電壓時，進入日照充足模式，在光伏輸入電壓小於日照不足電壓時，進入日照不足模式，並在光伏輸入電壓介於日照充足電壓與日照不足電壓之間時，進入混合供電模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power distribution and control system for variable frequency compressor, electrically connected to the variable frequency compressor, and includes a mains power supply circuit, a photovoltaic module power supply circuit, an inverter , and a power supply mode switching module. The mains power supply circuit includes a mains voltage source, an AC to DC converter , and a mains conversion control module. The photovoltaic module power supply circuit includes a photovoltaic module, a DC to DC converter and a photovoltaic conversion control module. The power supply mode switching module is provided with a sufficient sunshine voltage and an insufficient sunshine voltage for sensing the photovoltaic input voltage provided by the photovoltaic module. When the photovoltaic input voltage is greater than the sufficient sunshine voltage, it enters the sufficient sunshine mode. When the photovoltaic input voltage is less than the insufficient sunshine voltage, it enters the insufficient sunshine mode. And when the photovoltaic input voltage is between the sufficient sunshine voltage and the insufficient sunshine voltage, it enters the hybrid power supply mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:分配供電控制系統</p>  
        <p type="p">200:變頻壓縮機</p>  
        <p type="p">1:市電供電電路</p>  
        <p type="p">11:市電電壓源</p>  
        <p type="p">12:交流轉直流轉換器</p>  
        <p type="p">13:市電轉換控制模組</p>  
        <p type="p">131:市電感測單元</p>  
        <p type="p">132:市電控制單元</p>  
        <p type="p">2:光伏模組供電電路</p>  
        <p type="p">21:光伏模組</p>  
        <p type="p">22:直流轉直流轉換器</p>  
        <p type="p">23:光伏轉換控制模組</p>  
        <p type="p">231:光伏感測單元</p>  
        <p type="p">232:光伏控制單元</p>  
        <p type="p">3:逆變器</p>  
        <p type="p">4:供電模式切換模組</p>  
        <p type="p">41:切換感測單元</p>  
        <p type="p">42:切換控制單元</p>  
        <p type="p">5:逆變轉換控制模組</p>  
        <p type="p">51:逆變感測單元</p>  
        <p type="p">52:逆變控制單元</p>  
        <p type="p">V1:市電輸入電壓</p>  
        <p type="p">V2:市電輸出電壓</p>  
        <p type="p">V3:光伏輸入電壓</p>  
        <p type="p">V4:光伏輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="476" publication-number="202628018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有虛實整合系統之教育元宇宙互動平台</chinese-title>  
        <english-title>EDUCATIONAL METAVERSE INTERACTION PLATFORM SYSTEM WITH INTEGRATED SYSTEM FOR VIRTUAL REALITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">G09B5/06</main-classification>  
        <further-classification edition="201401120250324B">A63F13/87</further-classification>  
        <further-classification edition="200601120250324B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF KAOHSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHENG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種教育元宇宙互動平台，用以解決習知互動平台功能過於單一的問題。係包含：虛實整合系統與處理模組耦接，虛擬控制器用於供使用者在虛擬場景中生成輸入操作訊號；實體控制器接收輸入操作訊號，並根據輸入操作訊號控制實體裝置產生對應的作動。本發明可以達成在虛擬場景中控制真實世界中實際裝置作動的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An educational metaverse interaction platform system is adapted for solving the problem that the functionality of conventional platform system is limited. The system includes an integrated system coupled to a processing module. A virtual controller is configured to generate an input operation signal in a virtual scene by a user. A physical controller receives the input operation signal and controls physical devices to perform corresponding actions based on the input operation signal. This invention can achieve the effect of controlling the actions of a real-world physical device in a virtual scene.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">EMIP:教育元宇宙互動平台</p>  
        <p type="p">1:處理模組</p>  
        <p type="p">2:影像投放設備</p>  
        <p type="p">3:實體操作設備</p>  
        <p type="p">4:平台資料庫</p>  
        <p type="p">5:平台模組</p>  
        <p type="p">6:驗證裝置</p>  
        <p type="p">7:外部平台</p>  
        <p type="p">BI:基礎資訊</p>  
        <p type="p">IS:虛實整合系統</p>  
        <p type="p">RM:實體模組</p>  
        <p type="p">RD:實體裝置</p>  
        <p type="p">RC:實體控制器</p>  
        <p type="p">RS:實體感測器</p>  
        <p type="p">VM:虛擬模組</p>  
        <p type="p">VD:虛擬裝置</p>  
        <p type="p">VC:虛擬控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="477" publication-number="202627812"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627812.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體管理方法、人工智慧處理系統及電腦程式產品</chinese-title>  
        <english-title>MEMORY MANAGEMENT METHOD, ARTIFICIAL INTELLIGENCE PROCESSING SYSTEM AND COMPUTER PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250528B">G06F12/08</main-classification>  
        <further-classification edition="200601120250528B">G06F13/14</further-classification>  
        <further-classification edition="202301120250528B">G06N3/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群聯電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHISON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYU, JIAN PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鈺豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　皓智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉安城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, AN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體管理方法，包括：獲取人工智慧模型的多個架構參數；根據多個架構參數，獲取在人工智慧模型的訓練過程中所使用的記憶體配置大小；根據記憶體配置大小，於隨機存取記憶體中配置目標記憶體區域，其中人工智慧模型的訓練過程中的多個訓練處理階段共同使用目標記憶體區域；以及將對應人工智慧模型的訓練過程中的每個訓練處理階段的中繼資料暫存在目標記憶體區域，其中中繼資料被傳輸於加速處理器模組、隨機存取記憶體與儲存裝置之間。藉此，本發明可自動計算最適化的記憶體配置大小，並透過共用記憶體空間的設計，有效改善記憶體碎片化的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory management method, including: acquiring multiple architecture parameters of an artificial intelligence model; obtaining a memory allocation size used in a training process of the artificial intelligence model according to the multiple architecture parameters; configuring a target memory region in random access memory according to the memory allocation size, wherein train processing stage in the training process of the artificial intelligence model shares the target memory region; and temporarily storing intermediate data corresponding to each train processing stage of the training process of the artificial intelligence model in the target memory region, wherein the intermediate data is transferred between accelerator processor module, the random access memory, and a storage device. Thereby, the present invention can automatically calculate the optimized memory allocation size, and through the design of shared memory space, effectively improve memory fragmentation issues.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410:步驟(獲取一人工智慧模型的多個架構參數)</p>  
        <p type="p">S420:步驟(根據該些架構參數，獲取在該人工智慧模型的一訓練過程中所使用的記憶體配置大小)</p>  
        <p type="p">S430:步驟(根據該記憶體配置大小，於隨機存取記憶體中配置一目標記憶體區域，其中該人工智慧模型的該訓練過程中的多個訓練處理階段共同使用該目標記憶體區域)</p>  
        <p type="p">S440:步驟(將對應該人工智慧模型的該訓練過程中的每個訓練處理階段的中繼資料暫存在該目標記憶體區域，其中該中繼資料被傳輸於加速處理器模組、該隨機存取記憶體與儲存裝置之間)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="478" publication-number="202626254"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626254.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切屑過濾系統及其切屑過濾方法</chinese-title>  
        <english-title>CHIP FILTRATION SYSTEM AND CHIP FILTRATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">B23Q11/10</main-classification>  
        <further-classification edition="200601120250324B">B23Q11/14</further-classification>  
        <further-classification edition="200601120250324B">B24B55/03</further-classification>  
        <further-classification edition="200601120250324B">B24B57/02</further-classification>  
        <further-classification edition="200601120250324B">B01D21/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林思嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SZU-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, SHIH-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅世杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHI-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">切屑過濾系統包括水箱、噴嘴、過濾器、噴嘴幫浦、過濾器幫浦、濃度感測器及控制器。水箱用以容納切削液。噴嘴配置在水箱內。噴嘴幫浦連接噴嘴。過濾器幫浦連接過濾器。濃度感測器用以感測切削液之切屑濃度。控制器電性連接噴嘴幫浦、過濾器幫浦及濃度感測器且用以：判斷切屑濃度是否等於或大於預設濃度；當切屑濃度等於或大於預設濃度且切削液之切屑的切屑密度等於或大於預設密度，提高噴嘴幫浦之轉速；及，當切屑濃度等於或大於預設濃度且切削液之切屑的切屑密度小於預設密度，提高過濾器幫浦之轉速。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip filtration system includes a water tank, a nozzle, a filter, a nozzle pump, a filter pump, a concentration sensor and a controller. The water tank is configured to contain a cutting fluid. The nozzle is disposed in the water tank. The nozzle pump is connected to the nozzle. The filter pump is connected to the filter. The concentration sensor is configured to sense a chip concentration of the cutting fluid. The controller is electrically connected to the nozzle pump, the filter pump and the concentration sensor and is configured to: determine whether the chip concentration is equal to or greater than a preset concentration; when the chip concentration is equal to or greater than the preset concentration and a chip density of the cutting fluid is equal to or greater than a preset density, increase a rotation speed of the nozzle pump; and, when the chip concentration is equal to or greater than the preset concentration and the chip density of the cutting fluid chips is less than the preset density, increase a rotation speed of the filter pump.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:切屑過濾系統</p>  
        <p type="p">110,110’:水箱</p>  
        <p type="p">110b:底面</p>  
        <p type="p">120:噴嘴</p>  
        <p type="p">130:過濾器</p>  
        <p type="p">140:噴嘴幫浦</p>  
        <p type="p">150:過濾器幫浦</p>  
        <p type="p">160:濃度感測器</p>  
        <p type="p">170:控制器</p>  
        <p type="p">180:擾流板</p>  
        <p type="p">190:抽液管</p>  
        <p type="p">190A:抽液端</p>  
        <p type="p">195:幫浦</p>  
        <p type="p">C1:切屑</p>  
        <p type="p">D1:噴射方向</p>  
        <p type="p">L1,L2:切削液</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="479" publication-number="202626403"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626403.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低溫物流車低碳排之製冷裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">B60P3/20</main-classification>  
        <further-classification edition="200601120250328B">B60H1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冷研科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏毅明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴雅韻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係在提供一種低溫物流車低碳排之製冷裝置，主要係設有一蓄冷板箱，該蓄冷板箱內設有蓄冷空間，該蓄冷空間內設有數個供蓄冷板放置之隔間，該蓄冷板箱之壁面上設有一輸入口及一回風口，該輸入口與該回風口係分別連通於該蓄冷空間，如此，將該製冷裝置設於低溫物流車之貨車廂內，將液態二氧化碳由該輸入口注入於該蓄冷空間內，藉由該蓄冷空間的液態二氧化碳之低溫，進而將該蓄冷空間內的各該蓄冷板製冷變色後，即具備有持續保冷之功能，可達到節能減碳之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蓄冷板箱</p>  
        <p type="p">10:蓄冷空間</p>  
        <p type="p">11:蓄冷板</p>  
        <p type="p">12:隔間</p>  
        <p type="p">13:輸入口</p>  
        <p type="p">14:回風口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="480" publication-number="202628027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拼接顯示裝置</chinese-title>  
        <english-title>TILED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G09F9/302</main-classification>  
        <further-classification edition="200601120250418B">G09F9/33</further-classification>  
        <further-classification edition="201601120250418B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭聖諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾岳宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YUEH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐雅玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YA-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種拼接顯示裝置，包含多個顯示面板，各顯示面板包含呈陣列排列的多個畫素單元，各畫素單元包含X個接墊及Y個發光元件，X及Y為正整數，且 &lt;img align="absmiddle" height="35px" width="61px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。Y個發光元件包含發出不同色光的第一發光元件、第二發光元件及第三發光元件。顯示面板包含第一顯示面板及第二顯示面板，第一顯示面板與第二顯示面板間具有拼接線，於第一顯示面板的各畫素單元中，第一發光元件、第二發光元件及第三發光元件沿第一方向排列，於第二顯示面板的各畫素單元中，第一發光元件、第二發光元件及第三發光元件沿第二方向排列，且第二方向與第一方向夾180度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tiled display device includes multiple display panels. Each display panel includes multiple pixel units arranged in an array. Each pixel unit includes X pads and Y light emitting elements. X and Y are positive integers, and &lt;img align="absmiddle" height="35px" width="61px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. Y light emitting elements include first light emitting elements, second light emitting elements and third light emitting elements that emit light of different colors. The display panels include a first display panel and a second display panel, where a tiling line exists between the first display panel and the second display panel. In each pixel unit of the first display panel, the first light emitting element, the second light emitting element and the third light emitting element are arranged in a first direction. In each pixel unit of the second display panel, the first light emitting element, the second light emitting element and the third light emitting element are arranged in a second direction, and the second direction is 180 degrees from the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:拼接顯示裝置</p>  
        <p type="p">100:第一顯示面板</p>  
        <p type="p">200:第二顯示面板</p>  
        <p type="p">A:區域</p>  
        <p type="p">AA:顯示區</p>  
        <p type="p">TL:拼接線</p>  
        <p type="p">PA:週邊區</p>  
        <p type="p">PX:畫素單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="481" publication-number="202627345"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627345.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150475</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱帶結構</chinese-title>  
        <english-title>A HEATING BELT STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250317B">F16L53/38</main-classification>  
        <further-classification edition="200601120250317B">H05B3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高瞻科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGH SCOPE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鳳嬪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, FENG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫大龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種加熱帶結構，包括隔熱套管及導熱絕緣載體，該隔熱套管包含一繞設於該管路外周的絕緣基層及一包覆保護於該絕緣基層內的編織層以構成複合絕緣層，該編織層係由柔軟絕緣線材結合成編織結構，該導熱絕緣載體係容設於該隔熱套管內並具有一設於該編織層內側的絕緣保護層，及一被該絕緣保護層防水絕緣地包覆的電熱件組以在該絕緣保護層內產生均勻熱量，並經由該絕緣保護層均勻導熱至隔熱套管，藉由該導熱絕緣載體的絕緣保護層、該隔熱套管的編織層之設置，令該隔熱套管能與該管路外表面緊密貼附接觸，同時也適用於大小管徑管路表面及管路彎曲處，提供隔絕該管路温度散失之保溫效果，有效減少能源的浪費。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:隔熱套管</p>  
        <p type="p">10:絕緣基層</p>  
        <p type="p">20:編織層</p>  
        <p type="p">21:容置空間</p>  
        <p type="p">21A、21B:小空間</p>  
        <p type="p">201:隙孔</p>  
        <p type="p">4:導熱絕緣載體</p>  
        <p type="p">41:絕緣保護層</p>  
        <p type="p">42:電熱件組</p>  
        <p type="p">10P1:套管上側</p>  
        <p type="p">10P2:套管下側</p>  
        <p type="p">10T:連結部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="482" publication-number="202629042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於功率模組的成型保護結構、功率模組與形成功率模組的方法</chinese-title>  
        <english-title>MODULATED PROTECTIVE STRUCTURE USED FOR POWER MODULE, POWER MODULE, AND METHOD OF FORMING POWER MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/10</main-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能創半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張景堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於功率模組的成型保護結構包含銅箔與至少一燒結層。銅箔具有複數個第一孔洞。燒結層形成在銅箔上，且至少一燒結層與銅箔的第一孔洞在橫截面中不重疊，其中至少一燒結層配置以將銅箔接合至功率模組的晶片，且第一孔洞配置以在晶片的一極匯流線上，並在上視圖中，沿著閘極匯流線排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A modulated protective structure used for a power module includes a copper foil and at least a sintering layer. A copper foil has a plurality of first holes. The sintering layer is formed over the coper foil, and the at least a sintering layer does not overlap the first holes of the copper foil in a cross-section view. The at least a sintering layer is configured to bond the copper foil with a chip of the power module. The first holes are configured to be over a gate bus of the chip. In a top view, the first holes are arranged along the gate bus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:成型保護結構</p>  
        <p type="p">110:銅箔</p>  
        <p type="p">120、350:燒結層</p>  
        <p type="p">200:晶片</p>  
        <p type="p">210:半導體層</p>  
        <p type="p">220:源極墊</p>  
        <p type="p">240:閘極匯流線</p>  
        <p type="p">250:保護層</p>  
        <p type="p">260:汲極墊</p>  
        <p type="p">320:金屬層</p>  
        <p type="p">DB:固晶機</p>  
        <p type="p">H1:孔洞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="483" publication-number="202627366"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627366.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能板清潔系統</chinese-title>  
        <english-title>SOLAR PANEL CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250124B">F24S40/20</main-classification>  
        <further-classification edition="200601120250124B">A47L11/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, ZHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, ZHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種太陽能板清潔系統，用以清潔多個太陽能板所形成的一太陽能板群，其包含：至少一無人機；一控制模組及多個清潔機器人。控制模組，決定多個投放點S，而且該些投放點S分別位於太陽能板群內的相異位置。通過每一該清潔機器人形成一子清潔區塊，並且限制每一該清潔機器人在該子清潔區塊內移動。該至少一無人機分別將該些清潔機器人放置於該些投放點S，並且該些清潔機器人放置於該些投放點S後，該些子清潔區塊的組合形成清潔區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solar panel cleaning system is used to clean a solar panel group formed by multiple solar panels, which includes: at least one drone; a control module and multiple cleaning robots. The control module determines multiple placement points S, and these placement points S are located at different positions within the solar panel group. A sub-cleaning block is formed by each cleaning robot, and each cleaning robot is restricted from moving within the sub-cleaning block. The at least one drone places the cleaning robots at the delivery points S respectively. After the cleaning robots are placed at the delivery points S, the combination of the sub-cleaning blocks forms a cleaning area..</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:太陽能板</p>  
        <p type="p">102:太陽能板群</p>  
        <p type="p">140:清潔機器人</p>  
        <p type="p">240:子清潔區塊</p>  
        <p type="p">E:回收點</p>  
        <p type="p">S:投放點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="484" publication-number="202628368"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628368.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙通道選擇模塊、多通道選擇電路、電子晶片及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H03K19/20</main-classification>  
        <further-classification edition="200601120250401B">H03K17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雲鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種雙通道選擇模塊，其包括一解碼單元與一信號輸出單元，其中，該解碼單元耦接一包含1個使能位元的使能信號以及一包含一個選擇位元的選擇信號，且該信號輸出單元耦接該解碼單元、一第一輸入信號以及一第二輸入信號。依據本發明，該解碼單元被配置以依據該使能位元與該選擇信號產生複數個控制位元傳送至該信號輸出單元，使得該信號輸出單元基於該些控制位元的控制選擇該第一輸入信號或該第二輸入信號為一輸出信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雙通道選擇模塊</p>  
        <p type="p">101:解碼單元</p>  
        <p type="p">1011:第一反相器</p>  
        <p type="p">1012:第二反相器</p>  
        <p type="p">1013:第一及閘</p>  
        <p type="p">1014:或閘</p>  
        <p type="p">1015:第二及閘</p>  
        <p type="p">102:信號輸出單元</p>  
        <p type="p">1021:第三反相器</p>  
        <p type="p">1022:第四反相器</p>  
        <p type="p">1023:第五反相器</p>  
        <p type="p">1024:第六反相器</p>  
        <p type="p">1025:第七反相器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="485" publication-number="202628370"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628370.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>奇數分頻電路、電子晶片及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H03K23/66</main-classification>  
        <further-classification edition="200601120250401B">H03K21/10</further-classification>  
        <further-classification edition="200601120250401B">H03K21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雲鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種奇數分頻電路，應用於一電子晶片之中，且主要包括一分頻模塊以及一控制模塊，其中，該分頻模塊被配置用以對一參考時鐘信號執行一分頻處理以產生一第一時鐘信號，且在執行所述分頻處理的過程中產生複數個中間數據。值得注意的是，在該分頻模塊正常工作時，當該複數個中間數據的一位元組合符合一目標位元組合之時，該分頻模塊會出現分頻輸出等待或環路鎖定之現象。因此，在本發明中，該控制模塊被配置以在所述位元組合符合該目標位元組合的情況下產生一重置信號，並將該重置信號回傳該分頻模塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:奇數分頻電路</p>  
        <p type="p">11:分頻模塊</p>  
        <p type="p">12:控制模塊</p>  
        <p type="p">13:佔空比調整模塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="486" publication-number="202626291"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626291.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吊掛式工具收納架</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251030B">B25H3/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高瑞乾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高瑞乾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種吊掛式工具收納架包含一架體、一支撐掛件，及一緊固件，該架體包含有自該架體的開放端延伸的一滑軌，該支撐掛件可拆卸的固定於該架體的開放端，該支撐掛件包含有封閉於該架體的開放端並封閉該滑軌的一端板、支撐於該架體的後側的一鎖固板、自該鎖固板朝後延伸的一擋板、伸出該端板的一支撐板、貫穿該鎖固板的一連結孔，及貫穿該支撐板的一吊掛孔，該緊固件穿入該連結孔而將該支撐掛件鎖固於該架體，該支撐掛件能封閉該滑軌，方便吊掛及握持拿取，並且能避免緊固件直接碰觸桌面或牆面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:架體</p>  
        <p type="p">12:滑道</p>  
        <p type="p">15:定位板</p>  
        <p type="p">152:定位結構</p>  
        <p type="p">20:支撐掛件</p>  
        <p type="p">40:工具固定塊</p>  
        <p type="p">50:工具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="487" publication-number="202627324"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627324.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>剎車碟盤</chinese-title>  
        <english-title>BRAKE DISC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">F16D65/12</main-classification>  
        <further-classification edition="200601120250320B">F16D65/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台萬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARWI TAIWAN INDUSTRIAL CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王錫輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUN SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白政忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, CHENG CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WEN LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種剎車碟盤，包括：一本體及複數第一貫槽。該本體定義一軸向且包括於該軸向上相對之二側面、一外周面及一內周面，該外周面與該內周面分別連接於該二側面之間；各該第一貫槽凹設於其中一該側面且延伸貫穿於該外周面與該內周面之間，各該第一貫槽包括一位於該外周面之第一進氣端口及一位於該內周面之第一排氣端口，該第一進氣端口之一寬度大於該第一排氣端口之一寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a brake disc, including: a main body and a plurality of first through grooves. The main body defines an axial direction and includes two side surfaces opposite to each other in the axial direction, an outer peripheral surface and an inner peripheral surface, and the outer and inner peripheral surfaces are respectively connected between the two side surfaces. Each of the plurality of first through grooves is recessed on one of the two side surfaces and extends through and between the outer and inner peripheral surfaces. Each of the plurality of first through grooves includes a first intake port located on the outer peripheral surface and a first exhaust port located on the inner peripheral surface, and a width of the first intake port is greater than a width of the first exhaust port.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:剎車碟盤</p>  
        <p type="p">10:本體</p>  
        <p type="p">11:側面</p>  
        <p type="p">12:外周面</p>  
        <p type="p">13:內周面</p>  
        <p type="p">20:第一貫槽</p>  
        <p type="p">50:第二貫槽</p>  
        <p type="p">A:軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="488" publication-number="202628412"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628412.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於HDMI訊號接收端的音訊取樣頻率產生器及其運作方法</chinese-title>  
        <english-title>AN AUDIO SAMPLING FREQUENCY GENERATOR FOR A HDMI SINK END AND AN OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250401B">H04N5/44</main-classification>  
        <further-classification edition="200601120250401B">G09G5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>精拓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEATURE INTEGRATION TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊千柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIEN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種音訊取樣頻率產生器及其運作方法。音訊取樣頻率產生器包括頻率產生模組、控制模組以及調頻模組。頻率產生模組產生第一頻率訊號。控制模組基於調頻參數資料得到第一除頻參數、第二除頻參數及升頻參數。調頻模組基於第一除頻參數、第二除頻參數及升頻參數對輸入頻率訊號進行調頻以得到音訊取樣頻率訊號。藉此，本發明提出的音訊取樣頻率產生器及其運作方法可有效降低音訊取樣頻率訊號的抖動，使訊號接收端可基於還原的音訊取樣頻率訊號由接收的影音訊號中正確地取樣並還原音訊訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to an audio sampling frequency generator and an operation method thereof. The audio sampling frequency generator includes a frequency generation module, a control module and a frequency adjustment module. The frequency generation module generates a first frequency signal. The control module obtains a first frequency division parameter, a second frequency division parameter and a upconversion parameter based on the mixing parameter data. The frequency adjustment module adjusts an input frequency signal based on the first frequency division parameter, the second frequency division parameter and the upconversion parameter to obtain an audio sampling frequency signal. Thereby, the audio sampling frequency generator and its operating method proposed by the present disclosure effectively reduces the jitter of the audio sampling frequency signal. The signal receiving end may accurately sample and restore the audio signal from the received audio and video signal based on the restored audio sampling frequency signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:音訊取樣頻率產生器</p>  
        <p type="p">100:頻率產生模組</p>  
        <p type="p">200:調頻模組</p>  
        <p type="p">300:控制模組</p>  
        <p type="p">400:儲存模組</p>  
        <p type="p">CLKa:音訊取樣頻率訊號</p>  
        <p type="p">CLKi:輸入頻率訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="489" publication-number="202628383"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628383.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水下聲學傳接器</chinese-title>  
        <english-title>UNDERWATER ACOUSTIC TRANSCEIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H04B11/00</main-classification>  
        <further-classification edition="200601120250401B">H04L27/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TZUNG-JE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水下聲學傳接器包含一傳輸器及一接收器，其中該接收器藉由該QPSK科斯塔迴路同時達成解調變及載波回復的功效，可大幅提高可偵測之相位誤差，且由於該水下聲學傳接器之該傳輸器及該接收器的結構簡單，能夠降低該水下聲學傳接器的製作成本及功率消耗而相當適合水下環境之使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An underwater acoustic transceiver includes a transmitter and a receiver. The receiver utilizes a QPSK Costas loop to achieve demodulation and carrier recovery simultaneously, significantly enhancing detectable phase error. Additionally, due to the simple structure of the transmitter and receiver in this underwater acoustic transceiver, it can reduce production costs and power consumption, making it highly suitable for underwater environments.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水下聲學傳接器</p>  
        <p type="p">100:傳輸器</p>  
        <p type="p">110:QPSK調變裝置</p>  
        <p type="p">120:第一SPI裝置</p>  
        <p type="p">130:數位類比轉換器</p>  
        <p type="p">140:水下揚聲器</p>  
        <p type="p">150:功率放大器</p>  
        <p type="p">200:接收器</p>  
        <p type="p">210:水聽器</p>  
        <p type="p">220:類比前端</p>  
        <p type="p">230:第二SPI裝置</p>  
        <p type="p">240:QPSK科斯塔迴路</p>  
        <p type="p">250:解映器</p>  
        <p type="p">300:運算裝置</p>  
        <p type="p">400:時脈訊號產生單元</p>  
        <p type="p">410:時脈訊號產生器</p>  
        <p type="p">420:分頻器</p>  
        <p type="p">I_t:同相訊號</p>  
        <p type="p">Q_t:正交訊號</p>  
        <p type="p">S&lt;sub&gt;o&lt;/sub&gt;:調變輸出訊號</p>  
        <p type="p">D&lt;sub&gt;T&lt;/sub&gt;:傳輸資料訊號</p>  
        <p type="p">D&lt;sub&gt;a&lt;/sub&gt;:類比傳輸資料</p>  
        <p type="p">A&lt;sub&gt;o&lt;/sub&gt;:輸出聲波</p>  
        <p type="p">A&lt;sub&gt;i&lt;/sub&gt;:輸入聲波</p>  
        <p type="p">S&lt;sub&gt;ai&lt;/sub&gt;:接收聲波訊號</p>  
        <p type="p">D&lt;sub&gt;R&lt;/sub&gt;:接收資料訊號</p>  
        <p type="p">S&lt;sub&gt;r&lt;/sub&gt;:調變輸入訊號</p>  
        <p type="p">I_d:同相解調訊號</p>  
        <p type="p">Q_d:正交解調訊號</p>  
        <p type="p">S&lt;sub&gt;dm&lt;/sub&gt;:解映訊號</p>  
        <p type="p">f&lt;sub&gt;clk&lt;/sub&gt;:時脈訊號</p>  
        <p type="p">f&lt;sub&gt;s&lt;/sub&gt;:取樣時脈訊號</p>  
        <p type="p">f&lt;sub&gt;sclk&lt;/sub&gt;:串列時脈訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="490" publication-number="202627808"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627808.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊系統故障率量化系統及其方法</chinese-title>  
        <english-title>INFORMATION SYSTEM FAILURE RATE QUANTIFICATION SYSTEM AND METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250321B">G06F11/30</main-classification>  
        <further-classification edition="202501120250321B">G06F11/36</further-classification>  
        <further-classification edition="202301120250321B">G06Q10/06</further-classification>  
        <further-classification edition="202301120250321B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種資訊系統故障率量化系統，包括複數個業務群組及處理器。處理器包括使用者數據擷取模組、環境端數據擷取模組、臨界指標分析模組、故障因素分析模組及故障率產生模組。使用者數據擷取模組擷取複數個使用數據。環境端數據擷取模組擷取至少一環境異常數據。臨界指標分析模組初始化業務群組的初始健康指標。故障因素分析模組產生故障因素參數及臨界健康指標。故障率產生模組產生系統故障率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide an information system failure rate quantification system, including a plurality of business groups and a processor. The processor includes a user data acquisition module, an environment data acquisition module, a critical indicator analysis module, a failure factor analysis module and a failure rate generation module. The user data acquisition module extracts a plurality of usage data. The environment data acquisition module extracts at least one environmental abnormality data. The critical indicator analysis module initializes a initial health indicator of each of the business groups. The initializes the initial health indicators of the business group generates a fault factor parameter and a critical health indicator. The failure rate generation module generates a system failure rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資訊系統故障率量化系統</p>  
        <p type="p">10:業務群組</p>  
        <p type="p">110:伺服器硬體設備</p>  
        <p type="p">120:系統軟體</p>  
        <p type="p">20:處理器</p>  
        <p type="p">210:數據擷取模組</p>  
        <p type="p">212:使用者數據擷取模組</p>  
        <p type="p">214:環境端數據擷取模組</p>  
        <p type="p">220:數據處理模組</p>  
        <p type="p">222:臨界指標分析模組</p>  
        <p type="p">224:故障因素分析模組</p>  
        <p type="p">226:故障率產生模組</p>  
        <p type="p">228:故障率比對模組</p>  
        <p type="p">30:輸入輸出裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="491" publication-number="202628005"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628005.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水稻線蟲病害預警的方法及預警系統</chinese-title>  
        <english-title>RICE NEMATODE DISEASE HEALTH WARNING METHOD AND HEALTH WARNING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250324B">G06V10/764</main-classification>  
        <further-classification edition="202201120250324B">G06V10/25</further-classification>  
        <further-classification edition="201701120250324B">G06T7/00</further-classification>  
        <further-classification edition="200601120250324B">G01N21/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱彥煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳珮臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡蒨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁育臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YU-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種水稻線蟲病害預警的方法，包含：使用高光譜影像裝置拍攝水稻種子樣本，以獲得水稻種子樣本的胚芽區域的高光譜特徵樣本數值；使用該胚芽區域的該高光譜特徵樣本數值進行機器學習，以建立水稻線蟲病害分類模型；以及使用水稻線蟲病害分類模型根據高光譜特徵待測數值判斷待測水稻種子的所屬類別，以檢測待測水稻種子是否受線蟲感染。本發明還公開了一種水稻線蟲病害預警的系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rice nematode disease health warning method is disclosed by the present disclosure, comprising steps of: using a hyperspectral imaging device to photograph a rice seed sample to obtain hyperspectral feature sample values in a germ region of the rice seed sample; performing machine learning by using the hyperspectral feature sample values in the germ region to establish an rice nematode disease classification model; and determining a category of a rice seed to be tested by using the rice nematode disease classification model based upon the hyperspectral characteristic values, so as to detect whether the rice seed to be tested is infected by rice nematode. A health warning system is further disclosed by the present disclosure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01、S10、S11、S20、S30、S40、S50、S51、S60、S70、S80:本發明之水稻線蟲病害預警的方法的步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="492" publication-number="202626166"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626166.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於洗滌塔中減量二氧化碳排量的中藥型添加劑的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING TRADITIONAL CHINESE MEDICINE ADDITIVE FOR REDUCING CARBON DIOXIDE EMISSIONS IN SCRUBBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250106B">B01D11/04</main-classification>  
        <further-classification edition="200601120250106B">B01D53/62</further-classification>  
        <further-classification edition="200601120250106B">A61K36/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃義興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車金珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHE, CHIN CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃義興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車金珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHE, CHIN CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出了一種用於洗滌塔中減量二氧化碳排量的中藥型添加劑的製造方法，包含步驟：a) 取等重量的古銅藤、香蕉葉、棕櫚葉枝、艾草、仙人掌、勃樂葉、向日葵花瓣、大葉欖仁葉、油麻菜仔、海帶、丁香，清花桂、白花蛇舌草、蒲公英、苦參根、靈芝、三七、七葉膽、半技蓮、夏枯草、山豆根、黨參、海藻、白芷、麻黃、黃蓮與厚朴進行粉碎；b) 將粉狀的古銅藤、香蕉葉、棕櫚葉枝、艾草、仙人掌、勃樂葉、向日葵花瓣、大葉欖仁葉於常溫下進行水萃取以取得萃取物溶液；及c) 將其餘材料倒入該萃取物溶液中進行發酵，並於發酵後過濾懸浮物與殘渣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing traditional Chinese medicine additive for reducing carbon dioxide emissions in scrubbers is disclosed. The method includes steps of a) taking equal weights of bronze vine, banana leaves, palm leaf branches, mug wort, cactus, bole leaves, sunflower petals, terminalia leaves, rape seeds, kelp, cloves, osmanthus, hedyotis diffusa, dandelion, Sophora flavescens root, Ganoderma lucidum, Panax notoginseng, escinus gallbladder, semiglossum, Prunella vulgaris, Mountain root, codonopsis pilosula, seaweed, angelica dahurica, ephedra, astragalus and magnolia officinalis to be crushed; b) taking crushed powdered bronze vine, banana leaves, palm leaf branches, mugwort, cactus, bole leaves, sunflower petals, and terminalia leaves to be extracted with water at room temperature to obtain an extract solution; and c) pouring the remaining materials into the extract solution for fermentation and removing suspended matters and residues are by filtering after fermentation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="493" publication-number="202628962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150505</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直式真空加熱製程傳輸機構及其操作方法</chinese-title>  
        <english-title>VERTICAL VACUUM HEATING PROCESS CONVEYING MECHANISM AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P95/90</main-classification>  
        <further-classification edition="202601120260401B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞礱科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYNEXT SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何焱騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YEN-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許摶扶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳乃榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種垂直式真空加熱製程傳輸機構包括垂直升降腔體室以及製程腔體室。垂直升降腔體室具有垂直升降台。垂直升降台的第一放置區藉由進出閘板閥接收第一承載件，且垂直升降台接著移動使垂直升降台的第二放置區接著藉由進出閘板閥接收第二承載件。製程腔體室接收第一承載件並進行真空加熱製程。在第一承載件中的晶圓片完成真空加熱製程後，第一承載件於第一放置區進行冷卻降溫。當第一承載件於第一放置區未破真空進行冷卻降溫時，製程腔體室接收第二承載件並對第二承載件中的晶圓片進行真空加熱製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:垂直式真空加熱製程傳輸機構</p>  
        <p type="p">110:垂直升降腔體室</p>  
        <p type="p">111:進出閘板閥</p>  
        <p type="p">112:垂直升降台</p>  
        <p type="p">113:製程閘板閥</p>  
        <p type="p">115:輸送閘板閥</p>  
        <p type="p">120:製程腔體室</p>  
        <p type="p">130:橫向輸送裝置</p>  
        <p type="p">132:橫向抓取件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="494" publication-number="202627668"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627668.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光阻去除方法</chinese-title>  
        <english-title>PHOTORESIST REMOVAL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250325B">G03F1/82</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光阻去除方法，包括以下步驟：(S1)將晶圓浸沒於具有去光阻劑之容置槽中；(S2)自容置槽取出晶圓並放置於承載台上；(S3)於噴灑時間內旋轉承載台並利用噴灑單元以1 ml/sec至10 ml/sec之流量對晶圓噴灑去光阻劑；(S4)於反應時間內停止對晶圓噴灑去光阻劑；以及(S5)針對晶圓執行清洗及乾燥製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a photoresist removal method, which includes the following steps: (S1)soaking a wafer in a containment tank with a photoresist remover; (S2)taking out the wafer from the containment tank and placing the wafer on a support platform; (S3)rotating the support platform during a spraying period and spraying the photoresist remover onto the wafer at a flow rate of 1 ml/sec to 10 ml/sec via a spray unit; (S4)stopping the spray of the photoresist remover onto the wafer during a reaction period; and (S5)performing a rinsing and drying process on the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="495" publication-number="202627825"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627825.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>介面卡裝置及其修復方法</chinese-title>  
        <english-title>INTERFACE CARD DEVICE AND REPAIRING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F13/38</main-classification>  
        <further-classification edition="200601120250401B">G06F11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高峻偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張藝龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宛儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種介面卡裝置及其修復方法是關於一種介面卡裝置，其包含傳輸介面、計時模組及控制模組。傳輸介面電性連接於主機裝置。計時模組電性連接於傳輸介面。控制模組電性連接於傳輸介面及計時模組。傳輸介面包含至少一層，並且至少一層具有相對應之至少一有限狀態機。計時模組用以計時任一有限狀態機停止運作的一狀態停止時間，以及於狀態停止時間超過閾值時生成重置訊號以重置狀態停止時間。控制模組用以切換至少一有限狀態機之運作狀態，以及根據重置訊號將運作狀態切換為重置狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An interface card device and repairing method thereof is related to the interface card device including a transmission interface, a timing module, and a control module. The transmission interface is electrically connected to a host device. The timing module is electrically connected to the transmission interface. The control module is electrically connected to the transmission interface and the timing module. The transmission interface includes at least one layer corresponding to at least one finite state machine respectively. The timing module is configured to time a state-stop time that any of the at least one finite state machine continuously stops working, and to generate a reset signal when the state-stop time exceeds a threshold to reset the state-stop time. The control module is configured to switch a state of the at least one finite state machine, and to switch the state to a reset state according to the reset signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:介面卡裝置</p>  
        <p type="p">100:傳輸介面</p>  
        <p type="p">110:計時模組</p>  
        <p type="p">120:控制模組</p>  
        <p type="p">130:記憶體模組</p>  
        <p type="p">20:主機裝置</p>  
        <p type="p">RST:重置訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="496" publication-number="202627327"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627327.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑振裝置及具備該抑振裝置之電子設備</chinese-title>  
        <english-title>VIBRATION DAMPING DEVICE AND ELECTRONIC APPARATUS HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">F16F15/02</main-classification>  
        <further-classification edition="200601120250402B">F16F15/04</further-classification>  
        <further-classification edition="200601120250402B">B23Q11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PIN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖建智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHIEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何筱晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, HSIAO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JHENG-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種抑振裝置及具備該抑振裝置之電子設備。在一些實施例中，抑振裝置包括固定座、撓性件及質量塊。撓性件配置於固定座，而撓性件包括多個減振臂，其具有多個凹陷缺口。質量塊設置於減振臂。其中，該撓性件之剛性與該質量塊之質量的比值係介於1.5×10 &lt;sup&gt;6&lt;/sup&gt;至4×10 &lt;sup&gt;7&lt;/sup&gt;之間。在一些實施例中，電子設備包括電路板以及抑振裝置，而抑振裝置設置於電路板上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vibration damping device and an electronic apparatus having the vibration damping device are provided. In certain embodiments, the vibration damping device includes a base, a flexible member, and a mass block. The flexible member, comprising a plurality of damping arms with concave notches, is mounted on the base. The mass block is attached to the damping arms. In certain embodiments, the ratio of the stiffness of the flexible member to the mass of the mass block is between 1.5× 10⁶ to 4× 10⁷. In some embodiments, the electronic apparatus comprises a circuit board onto which the vibration damping device is mounted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:抑振裝置</p>  
        <p type="p">2:固定座</p>  
        <p type="p">3:撓性件</p>  
        <p type="p">4:質量塊</p>  
        <p type="p">31:減振臂</p>  
        <p type="p">311:凹陷缺口</p>  
        <p type="p">D1:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="497" publication-number="202627879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>AI客服應答的處理方法與伺服端</chinese-title>  
        <english-title>SERVER AND METHOD FOR PROCESSING AI CUSTOMER SERVICE RESPONESES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">G06F40/30</main-classification>  
        <further-classification edition="202001120250401B">G06F40/237</further-classification>  
        <further-classification edition="201901120250401B">G06N20/00</further-classification>  
        <further-classification edition="202301120250401B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐肯達思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKMASTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUO-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種AI客服應答的處理方法與伺服端，AI客服應答的處理方法包括在伺服端執行語意嵌入模型與大語言模型；語意嵌入模型接收客戶端發出的輸入要求；語意嵌入模型根據輸入要求產生語句特徵，並發送語句特徵至特徵向量資料庫；特徵向量資料庫根據語句特徵輸出查找結果；語意嵌入模型將查找結果發送至大語言模型；大語言模型修改，查找結果並輸出回應對話；伺服端發送回應對話至客戶端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server and method for processing ai customer service responses is provide. The method comprises executing a semantic embedding model and a large language model for AI customer service responses on the server; wherein the semantic embedding model receives input requests from the client; the semantic embedding model generates sentence features based on the input requests, and sends these features to a feature vector database; the feature vector database outputs lookup results derived from the sentence features; the semantic embedding model then sends the lookup results to the large language model; the large language model modifies the lookup results and generates response dialogues; the server subsequently sends the response dialogues back to the client.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理系統</p>  
        <p type="p">111:通訊單元</p>  
        <p type="p">112:儲存單元</p>  
        <p type="p">113:處理單元</p>  
        <p type="p">114:語意嵌入模型</p>  
        <p type="p">115:特徵向量資料庫</p>  
        <p type="p">116:大語言模型</p>  
        <p type="p">120:客戶端</p>  
        <p type="p">131:輸入要求</p>  
        <p type="p">136:回應對話</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="498" publication-number="202628717"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628717.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150514</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體及其製造方法</chinese-title>  
        <english-title>LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250430B">H10H20/814</main-classification>  
        <further-classification edition="202501120250430B">H10H20/824</further-classification>  
        <further-classification edition="202501120250430B">H10H20/83</further-classification>  
        <further-classification edition="202501120250430B">H10H20/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李岳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUEH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種發光二極體及其製造方法，發光二極體包含一永久基板、一磊晶複合層、一上部電極及一上部歐姆接觸層。其中，磊晶複合層，有發光波段為1100~1700奈米（nm）之一發光層，設置於永久基板上。上部電極設置於磊晶複合層上，電性連接至磊晶複合層。上部歐姆接觸層夾置於上部電極與磊晶複合層間，上部歐姆接觸層與上部電極間形成歐姆接觸且二者具有一相同截面水平寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting diode and a manufacturing method thereof are provided. The light-emitting diode comprises a permanent substrate, an epitaxial composite layer, an upper electrode and an upper ohmic contact layer. The epitaxial composite layer has a light-emitting layer with a light-emitting wavelength band of 1100 to 1700 nanometers, which is disposed on the permanent substrate. The upper electrode is disposed on the epitaxial composite layer and is electrically connected to the epitaxial composite layer. The upper ohmic contact layer is sandwiched between the upper electrode and the epitaxial composite layer. An ohmic contact is formed between the upper ohmic contact layer and the upper electrode, and both have the same cross-sectional horizontal width.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:上部歐姆接觸層</p>  
        <p type="p">103:第一化合物半導體層</p>  
        <p type="p">104:發光層</p>  
        <p type="p">105:第二化合物半導體層</p>  
        <p type="p">106:高摻雜化合物半導體層</p>  
        <p type="p">107:金屬疊層</p>  
        <p type="p">108:介電層</p>  
        <p type="p">109:透明導電層</p>  
        <p type="p">110:反射金屬層</p>  
        <p type="p">112:反射金屬層</p>  
        <p type="p">114:永久基板</p>  
        <p type="p">116:上部電極</p>  
        <p type="p">117:保護層</p>  
        <p type="p">118:下部電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="499" publication-number="202627959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627959.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150515</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供貸款評估建議的電子設備與處理方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND PROCESSING METHOD FOR PROVIDING LOAN ASSESSMENT RECOMMENDATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250107B">G06Q40/03</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐肯達思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKMASTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUO-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提供貸款評估建議的電子設備與處理方法，電子設備包括通訊單元、儲存單元與處理單元。通訊單元接收申請要求，申請要求具有指定額度、第一資訊與多筆第二資訊；儲存單元儲存融資單位模型，各融資單位模型具有過件評估資訊、額度評估資訊與預設額度；處理單元連接於通訊單元與處理單元，處理單元將申請要求載入融資單位模型，融資單位模型根據過件評估資訊與第一資訊產生過件結果或退件結果，處理單元根據過件結果選取出相應的融資單位模型，受選的融資單位模型為評估模型，評估模型根據第一資訊、第二資訊與預設額度產生額度推估結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and processing method for providing loan assessment recommendations. The electronic device comprises a communication unit, a storage unit, and a processing unit. The communication unit that receives an application, which includes a specified limit, multiple sets of primary information, and multiple sets of secondary information. The storage unit that stores at least one bank model, each bank model having approval criteria, limit assessment criteria, and a default limit. The processing unit connected to the communication unit and the storage unit, which loads the application into at least one bank model. Each bank model determines whether to approve or reject the application based on the approval criteria and primary information. The processing unit selects the appropriate bank models based on the approval results, designating the selected bank model as the evaluation model. The evaluation model calculates an estimated loan limit based on the primary information, secondary information, and default limit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理系統</p>  
        <p type="p">110:客戶端</p>  
        <p type="p">111:申請要求</p>  
        <p type="p">112:額度推估結果</p>  
        <p type="p">120:伺服端</p>  
        <p type="p">121:通訊單元</p>  
        <p type="p">122:儲存單元</p>  
        <p type="p">123:處理單元</p>  
        <p type="p">131:融資單位模型</p>  
        <p type="p">132:評估模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="500" publication-number="202627736"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627736.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>讀卡器</chinese-title>  
        <english-title>CARD READER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G06F1/16</main-classification>  
        <further-classification edition="200601120250501B">H05K7/14</further-classification>  
        <further-classification edition="200601120250501B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂傑國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGIC CONTROL TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉培中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PEI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種讀卡器,其包含有隱藏在本體中的二種規格之USB連接器，該二種USB連接器被旋轉地組合於本體中，使用者可以選擇將其中一種USB連接器旋轉出本體的一側並定位後與主電路板電性連接；本體的相對另一側設置卡片插槽，當旋轉出本體的其中一種USB連接器連接至電子裝置後，插入該卡片插槽的晶片卡可以和該電子裝置訊號連通；當不使用時可以將該二種USB連接器旋轉進入本體內並且斷開電性連接，以便於收納及攜帶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a card reader, which includes two USB connectors of two specifications hidden in the body. The two USB connectors are rotatably combined in the body, and an user can choose to use one of the USB connectors to rotate out one side of the body and position it to electrically connect to a main circuit board. A card slot is provided on the opposite side of the body. When one of the USB connectors is rotated out of the body and connected to an electronic device, a chip card inserted into the card slot can communicate with the electronic device. When not in use, the two USB connectors can be rotated into the body and the electrical connection is disconnected for easy storage and portability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:讀卡器</p>  
        <p type="p">100:本體</p>  
        <p type="p">10120:定位部</p>  
        <p type="p">10151:第一導電端子</p>  
        <p type="p">1020:開口</p>  
        <p type="p">20:座體</p>  
        <p type="p">30:第一USB連接器模組</p>  
        <p type="p">40:第二USB連接器模組</p>  
        <p type="p">50:第一旋轉件</p>  
        <p type="p">60:第二旋轉件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="501" publication-number="202627903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150520</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於操作量子處理器中的單自旋量子位元的方法、量子處理器以及電腦程式產品</chinese-title>  
        <english-title>QUANTUM PROCESSOR, COMPUTER PROGRAM, AND METHOD FOR OPERATING SINGLE-SPIN QUBIT IN QUANTUM PROCESSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251021B">G06N10/40</main-classification>  
        <further-classification edition="202201120251021B">G06N10/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台夫特理工大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNISCHE UNIVERSITEIT DELFT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾德霍斯特　門諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELDHORST, MENNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨德里克斯　尼可　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDRICKX, NICO WILLEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於操作一量子處理器中一單自旋量子位元之方法，該方法包括：製備該量子處理器之一第一量子點中一單自旋量子位元，其中該單自旋量子位元中之資訊係編碼於該第一量子點(如VI族半導體量子點(矽量子點或矽鍺量子點))之電荷載子的單自旋狀態中，如為一電洞之單自旋狀態；以及藉由調整該單自旋量子位元之量子化軸及/或能量分裂達一預定時間在該單自旋量子位元上執行一單量子位元閘操作，該量子化軸及/或能量分裂之調整係基於控制與該單自旋量子位元有關之一異向性g張量及/或局部施加至該單自旋量子位元之磁場。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for operating a single-spin qubit in a quantum processor is provided, wherein the method comprises: preparing a single-spin qubit in a first quantum dot of the quantum processor, wherein information in the single-spin qubit is encoded in the single spin states of a charge carrier, preferably the single spin states of a hole, in the first quantum dot, preferably a type IV semiconductor quantum dot such as a silicon quantum dot or a silicon-germanium quantum dot; and, executing a single qubit gate operation on the single-spin qubit by modifying the quantization axis and/or energy splitting of the single-spin qubit for a predetermined time, the modification of the quantization axis and/or energy splitting being based on controlling an anisotropic g-tensor associated with the single-spin qubit and/or a magnetic field locally applied to the single-spin qubit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">306&lt;sub&gt;1&lt;/sub&gt;~306&lt;sub&gt;3&lt;/sub&gt;:布洛赫(Bloch)球面</p>  
        <p type="p">308&lt;sub&gt;1&lt;/sub&gt;,308&lt;sub&gt;2&lt;/sub&gt;:量子化軸</p>  
        <p type="p">310&lt;sub&gt;1&lt;/sub&gt;:上升邊緣</p>  
        <p type="p">310&lt;sub&gt;2&lt;/sub&gt;:下降邊緣</p>  
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;,T&lt;sub&gt;2&lt;/sub&gt;:時間點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="502" publication-number="202627911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金融機構營業單位績效發展優化系統及其方法</chinese-title>  
        <english-title>FINANCIAL INSTITUTION BUSINESS UNIT PERFORMANCE DEVELOPMENT OPTIMIZATION SYSTEM AND METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250321B">G06Q10/0639</main-classification>  
        <further-classification edition="202301120250321B">G06Q10/06</further-classification>  
        <further-classification edition="202301120250321B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種金融機構營業單位績效發展優化系統，包括輸入輸出裝置及處理器。處理器包括戶政資料匯入模組及分行資料處理模組。戶政資料匯入模組自戶政系統匯入人口資料。分行資料處理模組自銀行伺服器匯入分行數據資料。分行資料處理模組更根據人口資料及分行數據資料並透過業務評核條件來綜合評估以設置分行的預期達成案件數、目標達成率或其組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a financial institution business unit performance development optimization system, including an input/output device and a processor. The processor includes a household registration data importing module and a branch data processing module. The household registration data importing module imports a plurality of population data from a household registration system. The branch data processing module imports a plurality of branch data from a bank server. The also comprehensively evaluates the population data and the branch data through a business evaluation condition to set an expected number of cases, a target achievement rate, or a combination thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:金融機構營業單位績效發展優化系統</p>  
        <p type="p">10:處理器</p>  
        <p type="p">110:戶政資料匯入模組</p>  
        <p type="p">120:分行資料處理模組</p>  
        <p type="p">130:業務案件匯入模組</p>  
        <p type="p">140:業務案件分析模組</p>  
        <p type="p">150:分行業績分析模組</p>  
        <p type="p">160:分行績效產生模組</p>  
        <p type="p">20:輸入輸出裝置</p>  
        <p type="p">30:戶政系統</p>  
        <p type="p">40:銀行伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="503" publication-number="202627957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銀行臨櫃交易檢核的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR CHECKING BANK OVER-THE-COUNTER TRANSACTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250321B">G06Q40/02</main-classification>  
        <further-classification edition="202301120250321B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種銀行臨櫃交易檢核的系統，包含：經辦的裝置和覆核的裝置。經辦的裝置包含：電性連接的通訊裝置、處理器和儲存裝置。儲存裝置包含：核驗身分單元和建檔單元。核驗身分單元配置以核驗臨櫃交易的客戶的身分。建檔單元配置以建立臨櫃交易的業務項目的檔案。其中建檔單元包含系統提示說明模組，用以提示建立該檔案的多個應注意事項。覆核的裝置與經辦的裝置通訊連接且包含檢查單元。檢查單元用以核對業務項目的檔案其包含檢查該些應注意事項，並顯示該檔案是放行狀況或退件狀況，其中當該檔案是退件狀況時，顯示退件原因。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for checking over-the-counter (OTC) transactions of banks includes a handling device and a review device. The handling device includes a communication device, a processor and a storage device which are electrically connected. The storage device includes a verification identification unit and a filing unit. The identity verification unit is configured to verify the identity of the customer of the OTC transaction. The filing unit is configured to create a file for a business item of the OTC transaction. The file creation unit includes a system prompt explanation module, which provides reminders on important considerations for creating the file. The review device is in communication connection with the handling device and includes a checking unit. The checking unit is used to check the file, which includes checking the reminders on important considerations, and display whether the file is in a release status or a return status. When the file is in a return status, the reason for the return is displayed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:銀行臨櫃交易檢核的系統</p>  
        <p type="p">20:內部客戶資料伺服器</p>  
        <p type="p">30:外部資訊查詢伺服器</p>  
        <p type="p">100:經辦的裝置</p>  
        <p type="p">110:通訊裝置</p>  
        <p type="p">120:處理器</p>  
        <p type="p">130:儲存裝置</p>  
        <p type="p">140:核驗身分單元</p>  
        <p type="p">150:建檔單元</p>  
        <p type="p">162:表單模板模組</p>  
        <p type="p">164:必填欄位模組</p>  
        <p type="p">166:檢核項目模組</p>  
        <p type="p">168:系統提示說明模組</p>  
        <p type="p">170:列印模組</p>  
        <p type="p">172:列印裝置</p>  
        <p type="p">200:覆核的裝置</p>  
        <p type="p">210:通訊裝置</p>  
        <p type="p">220:處理器</p>  
        <p type="p">230:儲存裝置</p>  
        <p type="p">240:檢查單元</p>  
        <p type="p">242:錯誤分析模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="504" publication-number="202628821"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628821.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>石英視窗及具有該石英視窗之電漿處理裝置</chinese-title>  
        <english-title>QUARTZ WINDOW AND PLASMA PROCESSING DEVICE HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P50/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種石英視窗，包括石英基材及至少一抗電漿反應薄膜。石英基材包括相對之第一表面及第二表面。至少一抗電漿反應薄膜係形成於石英基材之第一表面，其中至少一抗電漿反應薄膜係採用包括硫化物或硼化物之陶瓷材料製成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a quartz window, which includes a quartz substrate and at least one plasma-resistant film. The quartz substrate includes a first surface and a second surface positioned opposite each other. The at least one plasma-resistant film is formed on the first surface of the quartz substrate. The at least one anti-plasma reaction film is made of a ceramic material including sulfide or boride.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:石英視窗</p>  
        <p type="p">10:石英基材</p>  
        <p type="p">11:第一表面</p>  
        <p type="p">12:第二表面</p>  
        <p type="p">20:抗電漿反應薄膜</p>  
        <p type="p">21:第一抗電漿反應薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="505" publication-number="202628693"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628693.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆晶光電二極體整合結構及其製造方法</chinese-title>  
        <english-title>FLIP-CHIP PHOTODIODE INTEGRATED STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250227B">H10F30/00</main-classification>  
        <further-classification edition="202501120250227B">H10F71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏銘宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種覆晶光電二極體整合結構，包括第一覆晶光電二極體單元、第二覆晶光電二極體單元、第一共用電極及第二共用電極。第一覆晶光電二極體單元包括第一基底；第二覆晶光電二極體單元包括第二基底，其中第二覆晶光電二極體單元係與第一覆晶光電二極體單元鄰接設置，且第一基底之第一設置面及第二基底之第二設置面共平面；第一共用電極至少設置於第一設置面上；第二共用電極至少設置於第二設置面上，其中藉由電性導通第一共用電極及第二共用電極，使得第一覆晶光電二極體單元及第二覆晶光電二極體單元各自獨立且同時運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a flip-chip photodiode integrated structure, including a first flip-chip photodiode unit, a second flip-chip photodiode unit, a first shared electrode and a second shared electrode. The first flip-chip photodiode unit includes a first substrate. The second flip-chip photodiode unit includes a second substrate. The second flip-chip photodiode unit is arranged adjacent to the first flip-chip photodiode unit, so that a first mounting surface of the first substrate and a second mounting surface of the second substrate are coplanar. The first shared electrode is at least disposed on the first mounting surface, and the second common electrode is at least disposed on the second mounting surface. Electrical connecting between the first shared electrode and the second shared electrode enables the first flip-chip photodiode unit and the second flip-chip photodiode unit to operate independently and simultaneously.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:覆晶光電二極體整合結構</p>  
        <p type="p">10:第一覆晶光電二極體單元</p>  
        <p type="p">11:第一基底</p>  
        <p type="p">111:第一設置面</p>  
        <p type="p">112:第一受光面</p>  
        <p type="p">12:第一鍍膜層</p>  
        <p type="p">20:第二覆晶光電二極體單元</p>  
        <p type="p">21:第二基底</p>  
        <p type="p">211:第二設置面</p>  
        <p type="p">212:第二受光面</p>  
        <p type="p">22:第二鍍膜層</p>  
        <p type="p">30:第一共用電極</p>  
        <p type="p">40:第二共用電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="506" publication-number="202626408"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626408.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>駕駛事件檢測方法、高級駕駛輔助系統、車載裝置及車輛</chinese-title>  
        <english-title>METHODS CONFIGURED FOR DETECTING DRIVING EVENTS, ADVANCED DRIVING ASSISTANCE SYSTEMS, ONBOARD DEVICES, AND VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250602B">B60W30/08</main-classification>  
        <further-classification edition="202001120250602B">B60W60/00</further-classification>  
        <further-classification edition="202201120250602B">B60R1/00</further-classification>  
        <further-classification edition="202201120250602B">B60R1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富智捷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOBILE DRIVE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種駕駛事件檢測方法、高級駕駛輔助系統、車載裝置及車輛，涉及自動駕駛技術領域，旨在解決如何準確地檢測駕駛事件的問題。駕駛事件檢測方法包括：訓練駕駛事件檢測模型。擷取駕駛艙影像。將駕駛艙影像輸入駕駛事件檢測模型，得到與駕駛艙影像對應的駕駛事件。當駕駛事件為異常駕駛事件，發出警示資訊。由於駕駛事件檢測模型具自學習能力，因此其識別的駕駛事件具可擴展性和靈活性，從而支持在各種突發狀況下準確地判斷駕駛事件，進而提升行車安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a method configured for detecting driving events, an advanced driving assistance system, an onboard device, and a vehicle, which relates to a field of autonomous driving technology and aims to solve the problem of how to accurately detect driving events. The method comprises: training a driving event detection model; capturing a cockpit image; inputting the cockpit image into the driving event detection model to obtain a driving event corresponding to the cockpit image; when the driving event is an abnormal driving event, issuing a warning message. Driving events recognized by the driving event detection model have scalability and flexibility due to a self-learning ability of the driving event detection model, such that accurate judgment of driving events in various emergency situations may be supported and driving safety may be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101-S109:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="507" publication-number="202626389"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626389.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車載設備控制方法、電腦可讀存儲介質及車載裝置</chinese-title>  
        <english-title>VEHICLE EQUIPMENT CONTROL METHOD, COMPUTER-READABLE STORAGE MEDIUM, AND VEHICLE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250602B">B60K35/28</main-classification>  
        <further-classification edition="202401120250602B">B60K35/21</further-classification>  
        <further-classification edition="202401120250602B">B60K35/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富智捷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOBILE DRIVE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝朋諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種車載設備控制方法、電腦可讀存儲介質及車載裝置。車載設備包括音樂播放機及氛圍燈，該方法包括：獲取車輛內之乘客之間之互動資訊；根據互動資訊確定對應之情景模式；根據情景模式控制音樂播放機及氛圍燈工作。本申請提供之車載設備控制方法可於提升乘客用戶體驗之同時，降低安全風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a vehicle equipment control method, a computer-readable storage medium, and a vehicle device. The vehicle equipment comprises a music player and ambient lighting. The method comprises: acquiring interaction information between passengers inside the vehicle; determining corresponding scenario mode based on the interaction information; controlling the operation of the music player and ambient lighting according to the scenario mode. The vehicle equipment control method provided in this application enhances the passenger user experience while reducing safety risks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201-S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="508" publication-number="202627969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>教育機構平台系統</chinese-title>  
        <english-title>PLATFORM SYSTEM FOR EDUCATIONAL INSTITUTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250926B">G06Q50/20</main-classification>  
        <further-classification edition="202301120250926B">G06Q10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>知識指南針有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOWLEDGE COMPASS LTD.,</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉宸佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯明憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種教育機構平台系統，包括平台資料庫單元、伺服單元、客戶端連網裝置和業者端連網裝置。平台資料庫單元儲存有業者資訊群集和客戶資料群集。伺服單元根據業者資訊群集產生多個業者介面及對應各該業者介面的詢班觸發單元。客戶使用者透過客戶端連網裝置連接伺服單元，瀏覽業者介面，並可觸發詢班觸發單元發出詢班請求。伺服單元判斷客戶使用者是否已在客戶資料群集中。若否，則發出基本資料填寫請求。當客戶使用者對應於客戶資料群集時，伺服單元將其客戶資料發送至業者端連網裝置。通過本發明，客戶使用者可方便地搜尋教育機構資訊，業者使用者可有效接觸潛在客戶，提高招生效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an educational institution platform system, including a platform database unit, a server unit, a government database, an external map database, a parent terminal, and a business terminal. The platform database unit stores a business information cluster and a parent data cluster. The server unit generates multiple business interfaces based on the business information cluster, each business interface having a class inquiry trigger unit. Parent users connect to the server unit via the parent terminal to browse these business interfaces and can trigger the class inquiry trigger unit to send a class inquiry request. The server unit determines whether the parent user corresponds to the parent data cluster; if not, a basic data filling request is sent. When the parent user corresponds to the parent data cluster, the server unit sends the parent data to the business terminal. Through this invention, parent users can conveniently search, compare, and inquire about educational institution information, while business users can effectively manage class inquiry records, thereby improving enrollment efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:教育機構平台系統</p>  
        <p type="p">10:平台資料庫單元</p>  
        <p type="p">20:伺服單元</p>  
        <p type="p">30:政府資料庫</p>  
        <p type="p">40:外部地圖資料庫</p>  
        <p type="p">PT:客戶端連網裝置</p>  
        <p type="p">BT:業者端連網裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="509" publication-number="202626320"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626320.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣控閥</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250218B">B29C33/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富偉精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係設計一種應用在復動式油壓裝置，控制高壓油輸入、流出油壓室的氣動閥。主要係將一第一氣控閥和一第二氣控閥組合一體，從第一氣控閥流出的高壓油，接到位於活塞下側的第一油壓室，從第二氣控閥流出的高壓油接到位於活塞上側的第二油壓室，並透過電磁閥控制氣控閥的啟閉，打開不同油路。透過安裝本發明氣動閥，當復動式夾模器正處於施力夾住模具的狀態卻遇到非預期斷電時，可維持夾模器的夾力，經實際測試，可至少長達三個月之久，使模具不會因為突然的斷電而偏移甚至掉落，達到大幅提升安全性的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一氣控閥</p>  
        <p type="p">11:第一容置空間</p>  
        <p type="p">111:第一入油管</p>  
        <p type="p">112:第一回油管</p>  
        <p type="p">113:第一出油管</p>  
        <p type="p">12:第一雙鋼珠止逆閥</p>  
        <p type="p">121:第一鋼珠提動閥</p>  
        <p type="p">122:第二鋼珠提動閥</p>  
        <p type="p">13:第一氣壓缸</p>  
        <p type="p">131:第一提動桿</p>  
        <p type="p">132:第一活塞</p>  
        <p type="p">133:第一復位彈簧</p>  
        <p type="p">134:氣室</p>  
        <p type="p">20:第二氣控閥</p>  
        <p type="p">21:第二容置空間</p>  
        <p type="p">211:第二入油管</p>  
        <p type="p">212:第二回油管</p>  
        <p type="p">213:第二出油管</p>  
        <p type="p">22:第二雙鋼珠止逆閥</p>  
        <p type="p">221:第三鋼珠提動閥</p>  
        <p type="p">222:第四鋼珠提動閥</p>  
        <p type="p">23:第二氣壓缸</p>  
        <p type="p">231:第二提動桿</p>  
        <p type="p">232:第二活塞</p>  
        <p type="p">233:第二復位彈簧</p>  
        <p type="p">234:氣室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="510" publication-number="202626374"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626374.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子列印裝置及製造金屬列印物品的方法</chinese-title>  
        <english-title>ELECTRONIC PRINTING DEVICE AND A METHOD FOR PRODUCING METAL PRINT ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250805B">B33Y30/00</main-classification>  
        <further-classification edition="201501120250805B">B33Y50/02</further-classification>  
        <further-classification edition="202001120250805B">B33Y70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林舜茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHUN-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許行遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏仰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚怡安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, I-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子列印裝置，包括列印基板、陰極板、容置槽以及電解液。陰極板與列印基板相對設置。列印基板及電解液設置於容置槽中，且電解液包含金屬的離子。其中列印基板包含基板、列印單元及感測線。基板具有主動區及周邊區，其中主動區鄰近周邊區。列印單元設置於基板上且位於主動區內，其中列印單元包含列印電極。感測線設置於基板上，且電性連接列印電極，其中感測線與主動區至少部分重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic printing device is provided. The electronic printing device includes a print board, a cathode board, a storage tank and an electrolyte. The cathode board is disposed opposite to the print board. The print board and the electrolyte are disposed in the storage tank, and the electrolyte includes metal ions. Wherein, the print board includes a substrate, a print unit and a sensing line. The substrate includes an active region and a border region, and the active region is adjacent to the border region. The print unit is disposed on the substrate within the active region, wherein the print unit includes print electrode. The sensing line is disposed on the substrate, and is electrically connected to the print electrode, wherein at least a part of the sensing line is overlapped to the active region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子列印裝置</p>  
        <p type="p">2:列印基板</p>  
        <p type="p">3:陰極板</p>  
        <p type="p">4:容置槽</p>  
        <p type="p">5:電解液</p>  
        <p type="p">8:感測驅動器</p>  
        <p type="p">9:控制單元</p>  
        <p type="p">10:馬達元件</p>  
        <p type="p">11:金屬列印物品</p>  
        <p type="p">21:基板</p>  
        <p type="p">22:列印單元</p>  
        <p type="p">23:列印電極</p>  
        <p type="p">C&lt;sub&gt;test&lt;/sub&gt;:偵測電容值</p>  
        <p type="p">24:感測電極</p>  
        <p type="p">24A:感測電極的第一部分</p>  
        <p type="p">24B:感測電極的第二部分</p>  
        <p type="p">110A、110B:位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="511" publication-number="202627634"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627634.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光模組</chinese-title>  
        <english-title>BACKLIGHT MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇慧汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HUI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許瑋宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種背光模組，包含：導光板，具有入光面和出光面；光源，鄰近導光板的入光面設置；第一光學膜片，設置於導光板上且具有第一稜鏡結構；第二光學膜片，設置於第一光學膜片上且具有第二稜鏡結構；以及第三光學膜片，設置於第二光學膜片上且具有第三稜鏡結構；其中，於俯視方向上，第二稜鏡結構的第二稜線的投影沿第二延伸方向延伸，且第二延伸方向與入光面的夾角為第二夾角，第三稜鏡結構的第三稜線的投影沿第三延伸方向延伸，且第三延伸方向與入光面的夾角為第三夾角，其中，第二夾角與第三夾角的差值不等於90度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module is provided, which comprises: a light guide having a light incident surface and a light emitting surface; a light source disposed adjacent to the light incident surface of the light guide; a first optical film disposed on the light guide and having a first prism structure; a second optical film disposed on the first optical film and having a second prism structure; and a third optical film disposed on the second optical film and having a third prism structure; wherein in a top view direction, a projection of a second ridge line of the second prism structure extends along a second extension direction, and an angle between the second extension direction and the light incident surface is a second included angle, a projection of a third ridge line of the third prism structure extends along a third extension direction, and an angle between the third extension direction and the incident surface is a third included angle, wherein a difference between the second included and the third included angle is not equal to 90 degrees.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導光板</p>  
        <p type="p">1s1:入光面</p>  
        <p type="p">1s2:出光面</p>  
        <p type="p">2:光源</p>  
        <p type="p">21:發光元件</p>  
        <p type="p">3:第一光學膜片</p>  
        <p type="p">3s1:下表面</p>  
        <p type="p">3s2:上表面</p>  
        <p type="p">31:第一稜鏡結構</p>  
        <p type="p">32:基材</p>  
        <p type="p">33:光學微結構</p>  
        <p type="p">4:第二光學膜片</p>  
        <p type="p">41:第二稜鏡結構</p>  
        <p type="p">42:基材</p>  
        <p type="p">5:第三光學膜片</p>  
        <p type="p">51:第三稜鏡結構</p>  
        <p type="p">52:基材</p>  
        <p type="p">6:反射元件</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:俯視方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="512" publication-number="202626313"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626313.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>棒狀食材切斷裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">B26D7/18</main-classification>  
        <further-classification edition="200601120250930B">B26D3/16</further-classification>  
        <further-classification edition="200601120250930B">B26D1/02</further-classification>  
        <further-classification edition="200601120250930B">B26D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴茂器工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉崎健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIZAKI, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺川祥織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAKAWA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種棒狀食材切斷裝置，係具備：可動台，係以使棒狀食材在搭載位置與取出位置之間往復移動自如地設置於殼體，並朝向複數隻切斷刀具按壓棒狀食材；棒狀食材切斷裝置係藉由可動台之朝向切斷刀具之按壓動作將棒狀食材切斷成複數個；棒狀食材切斷裝置係具有：驅動單元，係使可動台在搭載位置與取出位置之間往復移動；開閉蓋，係將與可動台的取出位置對應地設置於殼體的取出口開閉；製品偵測感測器，係偵測棒狀食材已經移動至取出位置之情事；以及控制部，係在製品偵測感測器偵測到棒狀食材從取出位置取出時，使可動台驅動至搭載位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:左側壁板</p>  
        <p type="p">1b:右側壁板</p>  
        <p type="p">2:殼體</p>  
        <p type="p">3:搭載口</p>  
        <p type="p">4:取出口</p>  
        <p type="p">5:可動台</p>  
        <p type="p">7a:底板部</p>  
        <p type="p">7b:立起部</p>  
        <p type="p">8:細縫</p>  
        <p type="p">10:保護罩</p>  
        <p type="p">11:操作開關</p>  
        <p type="p">12:開閉蓋</p>  
        <p type="p">M:捲壽司切斷裝置(棒狀食材切斷裝置)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="513" publication-number="202628064"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628064.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶顯示器調節方法與電路系統</chinese-title>  
        <english-title>METHOD FOR MODULATING LIQUID CRYSTAL DISPLAY AND CIRCUIT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250421B">G09G3/36</main-classification>  
        <further-classification edition="200601120250421B">G09G5/10</further-classification>  
        <further-classification edition="201701120250421B">G06T7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露書提出一種液晶顯示器調節方法與執行所述方法的電路系統，在液晶顯示器調節方法中，電路系統自影像來源取得影像數據，從中逐幀切分為多個區塊，經逐幀分析影像數據後，根據各畫素值得出各區塊的最大亮度值以及亮度平均值，以能根據各區塊的最大亮度值與亮度平均值決定背光模組的目標背光值，再根據背光模組各區或是全區的目標背光值產生驅動背光模組各區發光的控制訊號。接著，再根據電路系統設定的目標亮度與背光模組的目標背光值，得出顯示面板的一組碼值，即可決定達到目標亮度的各區塊內每個畫素對應的碼值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for modulating a liquid crystal display and a circuit system used to perform the method are provided. In the method, the circuit system receives image data from an image source, and each of the frames of the image data is divided into multiple blocks. After the image data is frame-by-frame analyzed, a maximum brightness and an average brightness of each of pixels of the blocks are obtained. Accordingly, a target backlight value of a backlight module can be determined and a control signal is generated for driving each of the blocks of the backlight module to illuminate according to the target backlight value. A set of code values for a display panel can be obtained according to target brightness and the target backlight value, so that the code value for reaching the target brightness corresponding to every pixel in the block can be determined.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:影像來源</p>  
        <p type="p">203:電路系統</p>  
        <p type="p">231:影像分析單元</p>  
        <p type="p">233:背光決定單元</p>  
        <p type="p">235:光線分布建立單元</p>  
        <p type="p">237:畫素補償單元</p>  
        <p type="p">205:顯示器</p>  
        <p type="p">251:背光模組</p>  
        <p type="p">253:顯示面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="514" publication-number="202627826"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627826.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制晶片及控制系統</chinese-title>  
        <english-title>CONTROL CHIP AND CONTROL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250527B">G06F13/38</main-classification>  
        <further-classification edition="200601120250527B">G06F13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂結盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, CHIEH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昌宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHANG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡亞翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YA-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種控制晶片，設置於一主機板上，並包括一第一檢測接腳、一第二檢測接腳、一偵測電路以及一判斷電路。第一檢測接腳用以耦接一第一外部裝置。第一外部裝置具有一第一發光模組。第二檢測接腳用以耦接一第二外部裝置。第二外部裝置具有一第二發光模組。偵測電路偵測第一及第二檢測接腳的電壓，用以產生一第一偵測信號以及一第二偵測信號。判斷電路根據第一及第二偵測信號，判斷第一及第二外部裝置是否已接上主機板。當第一及第二外部裝置均已接上主機板時，判斷電路控制第一及第二發光模組所呈現的燈光效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control chip disposed in a motherboard and including a first detection pin, a second detection pin, a detection circuit and an determination circuit is provided. The first detection pin is configured to be coupled to a first external device which comprises a first light-emitting module. The second detection pin is configured to be coupled to a second external device which comprises a second light-emitting module. The detection circuit detects the voltages of the first and second detection pins to generate a first detection signal and a second detection signal. The determination circuit determines whether the first and second external devices have been connected to the motherboard according to the first and second detection signals. When both the first and second external devices are connected to the motherboard, the judgment circuit controls the lighting effects presented by the first and second light-emitting modules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:控制系統</p>  
        <p type="p">110A:主機板</p>  
        <p type="p">120A:控制晶片</p>  
        <p type="p">CP_1、CP_2:檢測接腳</p>  
        <p type="p">LCP_1、LCP_2:控制接腳</p>  
        <p type="p">121A:控制電路</p>  
        <p type="p">130、150:外部裝置</p>  
        <p type="p">140、160:插槽</p>  
        <p type="p">T_1~T_4:接觸端</p>  
        <p type="p">P1~P4:接腳</p>  
        <p type="p">131、151:發光模組</p>  
        <p type="p">SCM_1、SCM_2:燈效指令</p>  
        <p type="p">LT_1~LT_8:發光元件</p>  
        <p type="p">R1、R2、132、152:電阻</p>  
        <p type="p">VDD:操作電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="515" publication-number="202628069"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628069.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示綠色標籤的方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DISPLAYING GREEN LABLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G09G5/395</main-classification>  
        <further-classification edition="200601120250512B">G09G5/39</further-classification>  
        <further-classification edition="200601120250512B">G06F3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范桂禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, KUEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫瑞佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, RUI-ZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴裕宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YU-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉昌霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, CHANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示綠色標籤的方法，由一系統所執行，包括：藉由上述系統的一電子裝置產生上述系統的一顯示裝置的綠色標籤；藉由上述電子裝置執行上述顯示裝置的一開機流程；藉由上述顯示裝置於上述開機流程中顯示上述顯示裝置的一商標；以及在上述商標消失後，藉由上述顯示裝置顯示上述綠色標籤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for displaying green labels is provided. The method is executed by a system, and includes: generating, by an electronic device of the system, green labels of a display device of the system; executing, by the electronic device, a boot process of the display device; displaying, by the display device, a trademark of the display device during the boot process; and displaying, by the display device, the green labels after the trademark disappears.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">S205,S210,S215,S220:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="516" publication-number="202627827"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627827.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接埠提示系統及方法</chinese-title>  
        <english-title>CONNECTING PORT INDICATION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">G06F13/38</main-classification>  
        <further-classification edition="200601120250526B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳貴閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUEI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖哲賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TSE-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接埠提示系統，包含多個連接埠、多個發光元件、輸入裝置及控制裝置，其中控制裝置連接於發光元件及輸入裝置，發光元件分別對應於連接埠。輸入裝置用於取得關聯於指定埠類型的輸入訊號。控制裝置用於在根據輸入訊號判斷連接埠中存在符合指定埠類型的目標埠時，控制發光元件中對應於目標埠之至少一者的發光狀態。一種連接埠提示方法，適用於分別對應於多個連接埠的多個發光元件，包含：取得關聯於指定埠類型的輸入訊號，及當根據輸入訊號判斷連接埠中存在符合指定埠類型的目標埠時，控制發光元件中對應於目標埠之至少一者的發光狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connecting port indication system includes a plurality of connecting ports, a plurality of light-emitting elements, an input device and a control device, wherein the control device is connected to the plurality of light-emitting elements and the input device, and the plurality of light-emitting elements are respectively corresponded to the connecting ports. The input device is configured to obtain an input signal associated with a specified port type. The control device is configured to control a light-emitting state of at least one of the plurality of light-emitting elements corresponding to at least one of target ports when determining that at least one of target ports conforms to the specified port type in the plurality of connecting ports according to the input signal. A connecting port indication method, applicable for a plurality of light-emitting elements respectively corresponded to a plurality of connecting ports, includes: obtaining an input signal associated with a specified port type, and controlling a light-emitting state of at least one of the plurality of light-emitting elements corresponding to at least one of target ports when determining that at least one of target ports conforms to the specified port type in the plurality of connecting ports according to the input signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接埠提示系統</p>  
        <p type="p">10:連接埠</p>  
        <p type="p">11:發光元件</p>  
        <p type="p">12:輸入裝置</p>  
        <p type="p">13:控制裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="517" publication-number="202627858"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627858.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子系統和塗膠路徑規劃方法</chinese-title>  
        <english-title>ELECTRONIC SYSTEM AND METHOD OF GLUE PATH PLANNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250512B">G06F30/20</main-classification>  
        <further-classification edition="200601120250512B">G05B19/18</further-classification>  
        <further-classification edition="200601120250512B">B05B13/04</further-classification>  
        <further-classification edition="201801120250512B">B05B12/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉育維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔如心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, JU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昀安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊溫志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇育正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電子系統，包括記憶體、塗膠路徑規劃處理器以及噴塗裝置。噴塗裝置根據順序資料在一表面進行塗膠噴塗。塗膠路徑規劃處理器接收模式選擇訊號和來自記憶體的第一膠重、塗膠高度、塗佈資料、黏滯係數以及表面張力係數。根據模式選擇訊號和塗佈資料，以至少三個節點中之一者為起始來計算路徑長。根據塗膠高度、塗佈資料、黏滯係數、表面張力係數以及路徑長計算第二膠重。當第二膠重不等於第一膠重時，調整塗佈資料。當第二膠重等於第一膠重時，產生代表路徑規劃結束的規劃結果，並根據規劃結果和最佳化判斷訊號產生順序資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic system including memory, processor for glue path planning, and coating device is provided. The coating device performs glue coating on a surface based on a sequence data. The processor receives a first glue weight, glue height, coating data, viscosity coefficient, and surface tension coefficient from the memory and a mode selection signal. Calculates a distance with one of at least three nodes as starting point based on the mode selection signal and the coating data. Calculates a second glue weight based on glue height, coating data, viscosity coefficient, surface tension coefficient, and the distance. When the second glue weight does not equal the first glue weight, modify the coating data. When the second glue weight equals the first glue weight, generates a planning result that indicates path planning is finished, and generates the sequence data based on the planning result and a optimization signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:記憶體</p>  
        <p type="p">40:噴塗裝置</p>  
        <p type="p">100:塗膠路徑規劃處理器</p>  
        <p type="p">110:路徑規劃模組</p>  
        <p type="p">120:覆蓋路徑規劃模組</p>  
        <p type="p">125,135:計算模組</p>  
        <p type="p">130:框線路徑規劃模組</p>  
        <p type="p">140:區域順序最佳化模組</p>  
        <p type="p">150:物理參數模組</p>  
        <p type="p">G:膠重</p>  
        <p type="p">W:膠寬</p>  
        <p type="p">H:塗膠高度</p>  
        <p type="p">D:間距</p>  
        <p type="p">η:黏滯係數</p>  
        <p type="p">σ:表面張力係數</p>  
        <p type="p">PRG:模式選擇訊號</p>  
        <p type="p">OPT:最佳化判斷訊號</p>  
        <p type="p">FPRG:規劃失敗訊號</p>  
        <p type="p">SPRG1,SPRG2:規劃結果</p>  
        <p type="p">OPRG:順序資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="518" publication-number="202627499"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627499.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試路徑規劃裝置、晶圓測試裝置與晶圓測試方法</chinese-title>  
        <english-title>TEST PATH PLANNING DEVICE, WAFER TEST DEVICE AND WAFER TEST METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260401B">G01R31/26</main-classification>  
        <further-classification edition="202601120260401B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪健哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIEN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種測試路徑規劃裝置，測試路徑規劃裝置包括地圖獲取模組與判讀模組。地圖獲取模組用於根據輸入的產品號與批號，提供晶圓對應於現行測試階段的現行測試地圖，其中現行測試地圖為包括晶圓之複數個待測裸晶與複數個瑕疵裸晶的地圖影像。判讀模組電性連接地圖獲取模組，用於獲取現行測試地圖，並使用判讀模型根據現行測試地圖決定對應於現行測試地圖的測試製具圖樣與測試路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A test path planning device is provided. The test path planning device includes a map merging module and a determination module. The map merging module is used to provide a current test map of a wafer corresponding to a current test stage based on an input product number and an input batch number. The current test map is a map image that includes a plurality of dies to be tested and a plurality of defective dies of the wafer. The determination module is electrically connected to the map merging module, and is used to obtain the current test map, and based on the current test map, uses a determination model to determine a test tool pattern and a test path corresponding to the current test map.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:測試路徑規劃裝置</p>  
        <p type="p">111:地圖獲取模組</p>  
        <p type="p">112:判讀模組</p>  
        <p type="p">12:控制模組</p>  
        <p type="p">13:測試裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="519" publication-number="202627800"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627800.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝置控制方法與電子裝置</chinese-title>  
        <english-title>DEVICE CONTROL METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260401B">G06F9/4401</main-classification>  
        <further-classification edition="201801120260401B">G06F9/44</further-classification>  
        <further-classification edition="200601120260401B">G06F9/06</further-classification>  
        <further-classification edition="202601120260401B">G06F11/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和碩聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGATRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程上福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHANG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置控制方法與電子裝置。所述方法包括：偵測電子裝置的狀態；當電子裝置處於關機狀態時，由電子裝置的控制電路對電子裝置的記憶體所儲存的至少一參數資料執行資料整理操作，以釋放出記憶體的額外儲存空間；以及當電子裝置從關機狀態切換為開機狀態時，在不執行所述資料整理操作的情況下，啟動電子裝置的作業系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device control method and an electronic device are disclosed. The method includes: detecting a status of the electronic device; when the electronic device is in a powered-off state, performing, by a control circuit of the electronic device, a data sorting operation on at least one parameter data stored in a memory of the electronic device to release a storage space in the memory; and when the electronic device is switched from the powered-off state to a powered-on state, starting an operation system of the electronic device without performing the data sorting operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301~S303:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="520" publication-number="202628119"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628119.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多模態化合物生成系統、方法與多模態客製化化合物生成系統</chinese-title>  
        <english-title>MULTIMODAL COMPOUND GENERATION SYSTEM, METHOD AND MULTIMODAL CUSTOMIZED COMPOUND GENERATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250805B">G16B5/00</main-classification>  
        <further-classification edition="201901120250805B">G16B15/20</further-classification>  
        <further-classification edition="201901120250805B">G16B30/10</further-classification>  
        <further-classification edition="201901120250805B">G16B40/20</further-classification>  
        <further-classification edition="201901120250805B">G16B50/20</further-classification>  
        <further-classification edition="202301120250805B">G06N3/08</further-classification>  
        <further-classification edition="202201120250805B">G06F3/0484</further-classification>  
        <further-classification edition="201801120250805B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡翔崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HSIANG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王書凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴政國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHENG-KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許凱程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, KAI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露透過多模態化合物生成系統與方法，可同時考慮目標蛋白質不同維度的特性以生成化合物，此化合物相較於過往僅考慮單一維度所產出的分子與目標蛋白質存在更強的結合特性。除此之外，還可由已知的化合物分子產出修飾後的化合物，並藉此訓練神經網路模型以提升在未來的化合物產出的品質。本揭露還提供多模態客製化化合物生成系統供使用者輸入預期的參數，以產出符合使用者預期的化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure uses a multimodal compound generation system and method that can simultaneously consider the characteristics of different dimensions of the target protein to generate compounds. Compared with the molecules produced by only considering a single dimension in the past, this provided compound by this disclosure has stronger binding affinity to the target protein. In addition, modified compounds can be produced from known compound molecules, and neural network models can be trained to improve the quality of future compound production. The present disclosure also provides a multimodal customized compound generation system for users to input expected parameters to produce compounds that meet the user's expectations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多模態化合物生成系統</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:儲存器</p>  
        <p type="p">121:神經網路模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="521" publication-number="202627617"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627617.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體成像裝置</chinese-title>  
        <english-title>STEREOSCOPIC IMAGING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">G02B27/18</main-classification>  
        <further-classification edition="202001120250123B">G02B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳喻翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種立體成像裝置，包括光源、控制機構及透光片。透光片耦接於控制機構，且設置於光源的一側。透光片包含第一圖案區與第二圖案區，且控制機構用以控制透光片產生位移，以由第一圖案區接收來自光源的光線或轉換為由第二圖案區接收來自光源的光線，從而顯示不同的立體影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stereoscopic imaging device including a light source, a control mechanism, and a light-transmitting plate is provided. The light-transmitting plate is coupled to the control mechanism and positioned at one side of the light source. The light-transmitting plate includes a first pattern area and a second pattern area, and the control mechanism is configured to control a displacement of the light-transmitting plate, allowing the plate to either receive light from the light source via the first pattern area or switch to receiving light through the second pattern area, thereby displaying different stereoscopic images.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:控制機構</p>  
        <p type="p">100:立體成像裝置</p>  
        <p type="p">110:光源</p>  
        <p type="p">111:光線</p>  
        <p type="p">120:透光片</p>  
        <p type="p">121:第一圖案區</p>  
        <p type="p">121a:第一浮空立體影像</p>  
        <p type="p">122:第二圖案區</p>  
        <p type="p">122a:第二浮空立體影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="522" publication-number="202628735"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628735.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素結構</chinese-title>  
        <english-title>PIXEL STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250421B">H10H29/37</main-classification>  
        <further-classification edition="202501120250421B">H10D30/67</further-classification>  
        <further-classification edition="202501120250421B">H10D62/10</further-classification>  
        <further-classification edition="202501120250421B">H10H29/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何毅達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YI-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素結構設置於基板上且包括第一電晶體以及第二電晶體。第一電晶體包括第一導電層、第一導電層之上的第一半導體層、第一半導體層之上的第一閘極、第一閘極與第一半導體層之間的第一閘極絕緣層、以及電性連接第一半導體層的第一源極/汲極。第二電晶體電性連接第一電晶體且包括第一半導體層之上的第二半導體層、第二半導體層之上的第二閘極、第二閘極與第二半導體層之間的第二閘極絕緣層、以及電性連接第二半導體層的第二源極/汲極。第二半導體層於基板的正投影完全重疊第一導電層於基板的正投影，且第二半導體層於基板的正投影位於第一閘極於基板的正投影之外。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel structure disposed on a substrate includes a first transistor and a second transistor. The first transistor includes a first conductive layer, a first semiconductor layer over the first conductive layer, a first gate over the first semiconductor layer, a first gate insulating layer between the first gate and the first semiconductor layer, and a first source/drain electrically connecting the first semiconductor layer. The second transistor is electrically connected to the first transistor and includes a second semiconductor layer over the first semiconductor layer, a second gate over the second semiconductor layer, a second gate insulating layer between the second gate and the second semiconductor layer, and a second source/drain electrically connecting the second semiconductor layer. An orthographic projection of the second semiconductor layer on the substrate is completely overlapped with an orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the second semiconductor layer on the substrate is outside an orthographic projection of the first gate on the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:畫素結構</p>  
        <p type="p">122,142:導電層</p>  
        <p type="p">124,144:半導體層</p>  
        <p type="p">128,148:閘極</p>  
        <p type="p">A-A’,B-B’:剖面線</p>  
        <p type="p">SP1:子畫素</p>  
        <p type="p">T1,T2:電晶體</p>  
        <p type="p">V1,V2,V3,V4,Va:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="523" publication-number="202627222"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627222.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陰極結構與氣相電化學模組</chinese-title>  
        <english-title>CATHODE STRUCTURE AND GAS PHASE ELECTROCHEMICAL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250402B">C25B11/032</main-classification>  
        <further-classification edition="202101120250402B">C25B11/052</further-classification>  
        <further-classification edition="202101120250402B">C25B11/073</further-classification>  
        <further-classification edition="202101120250402B">C25B1/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃萌祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高端環</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, TUNE-HUNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周敏傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MIN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂曼寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MAN-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氣相電化學模組包括隔離膜、以及位於隔離膜兩側的陰極結構與陽極結構。陰極結構包括陰極電極板、及陰極電極板上的氣體擴散膜與陰極觸媒層。氣體擴散膜遠離陰極電極板的部分為親水結構。陰極觸媒層形成於氣體擴散膜的親水結構中，且陰極觸媒層滲透於氣體擴散膜的深度大於10μm。陰極觸媒層的金屬含量大於95%。陰極觸媒層包括第一鍍層以及位於該第一鍍層表面的第二鍍層，且第一鍍層為銅金屬層。第二鍍層為單層或多層構造，其中第二鍍層的材料包括銀、金、銦或其合金。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gas phase electrochemical module includes a separation membrane, and a cathode structure and an anode structure located on both sides of the separation membrane. The cathode structure includes a cathode electrode plate, a gas diffusion layer (GDL) on the cathode electrode plate, and a cathode catalyst layer. A portion of the GDL away from the cathode electrode plate is a hydrophilic structure. The cathode catalyst layer is formed in the hydrophilic structure of the GDL, and a depth of the cathode catalyst layer penetrating into the GDL is greater than 10 μm. The metal content of the cathode catalyst layer is greater than 95%. The cathode catalyst layer contains a first coating layer and a second coating layer on the surface of the first coating layer, and first coating layer is a copper metal layer. The second coating layer is a single-layer or multi-layer structure, wherein a material of the second coating layer includes silver, gold, indium, or an alloy thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:陰極結構</p>  
        <p type="p">102:陰極電極板</p>  
        <p type="p">104:氣體擴散膜</p>  
        <p type="p">106:親水結構</p>  
        <p type="p">108:陰極觸媒層</p>  
        <p type="p">d1:深度</p>  
        <p type="p">t1:厚度</p>  
        <p type="p">II:放大部位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="524" publication-number="202628139"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628139.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設備及其解鎖方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND UNLOCKING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01F7/06</main-classification>  
        <further-classification edition="200601120250401B">G06F1/16</further-classification>  
        <further-classification edition="200601120250401B">E05C19/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉書瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子設備及其解鎖方法。所述方法包括：由電子設備產生電磁力，其中電磁力用以將電子設備磁吸鎖定於磁性目標物上；偵測輸入事件；判斷輸入事件是否符合預設條件；以及若輸入事件符合預設條件，減弱電磁力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic apparatus and an unlocking method thereof are provided. The method includes: generating an electromagnetic force by the electronic apparatus, wherein the electromagnetic force is configured to magnetically lock the electronic apparatus onto a magnetic target; detecting an input event; determining whether the input event meets preset conditions; and if the input event meets the preset conditions, weakening the electromagnetic force.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="525" publication-number="202628785"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628785.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容器結構及其製造方法</chinese-title>  
        <english-title>CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250103B">H10N97/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許明智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電容器結構，包括基底、第一支撐層與電容器。第一支撐層位於基底上。電容器位於基底上。電容器包括底電極、頂電極與介電層。底電極包括第一部分與第二部分。第一部分位於貫穿第一支撐層的多個電容孔上。第二部分電性連接於第一部分，且覆蓋第一支撐層的底表面。頂電極位於底電極上。介電層位於底電極與頂電極之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A capacitor structure including a substrate, a first support layer, and a capacitor is provided. The first support layer is located on the substrate. The capacitor is located on the substrate. The capacitor includes a bottom electrode, a top electrode, and a dielectric layer. The bottom electrode includes a first portion and a second portion. The first portion is located on capacitor holes passing through the first support layer. The second portion is electrically connected to the first portion and covers a bottom surface of the first support layer. The top electrode is located on the bottom electrode. The dielectric layer is located between the bottom electrode and the top electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電容器結構</p>  
        <p type="p">100:基底</p>  
        <p type="p">102:導電板</p>  
        <p type="p">104,128a:介電層</p>  
        <p type="p">106:終止層</p>  
        <p type="p">110,114:支撐層</p>  
        <p type="p">118a,126a,130a,132a,134a:電極層</p>  
        <p type="p">C1:電容器</p>  
        <p type="p">E1:底電極</p>  
        <p type="p">E2:頂電極</p>  
        <p type="p">EC1:平面結構</p>  
        <p type="p">OP1:電容孔</p>  
        <p type="p">OP2:開口</p>  
        <p type="p">S1,S2:頂表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="526" publication-number="202627522"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627522.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>警示裝置</chinese-title>  
        <english-title>WARNING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">G01S13/93</main-classification>  
        <further-classification edition="200601120250401B">G01S13/88</further-classification>  
        <further-classification edition="200601120250401B">G08G1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鼎天國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROYALTEK COMPANY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許哲銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHE MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃畊富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KENG FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種結合雷達模組與電子控制技術的警示裝置，能準確偵測周邊物體的速度與距離，並提供動態警示（閃爍或蜂鳴）。雷達模組安裝於電子元件盒內，與地面保持預設距離，避免地面回波干擾，以降低收集到的數據點雲資訊的雜訊。控制器在數據點雲資訊中提取目標物的位置與相對速度，並篩選出接近的動態點，再根據動態點判斷目標物的相對距離與方向，根據目標物的接近程度，動態調整警示燈的閃爍頻率或啟動蜂鳴器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a warning device that integrates a radar module and electronic control technology, capable of accurately detecting the speed and distance of surrounding objects while providing dynamic warnings (flashing lights or beeping sounds). The radar module is installed within an electronic component box and maintains a preset distance from the ground to avoid ground echo interference, thereby reducing noise in the collected point cloud data. The controller extracts the position and relative speed of the target from the point cloud data, filters out approaching dynamic points, and determines the relative distance and direction of the target based on these points. Depending on the proximity of the target, the controller dynamically adjusts the flashing frequency of the warning lights or activates the buzzer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:警示裝置</p>  
        <p type="p">110:燈具載板</p>  
        <p type="p">112:警示燈</p>  
        <p type="p">120:支撐架</p>  
        <p type="p">121:框架</p>  
        <p type="p">122:腳架</p>  
        <p type="p">130:電子元件盒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="527" publication-number="202628150"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628150.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋁電解電容器與其電解液</chinese-title>  
        <english-title>ALUMINUM ELECTROLYTIC CAPACITOR AND　ELECTROLYTE SOLUTION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">H01G9/02</main-classification>  
        <further-classification edition="200601120250402B">H01G9/035</further-classification>  
        <further-classification edition="200601120250402B">H01G9/045</further-classification>  
        <further-classification edition="200601120250402B">H01G9/145</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘哲威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHE WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡麗端</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, LI-DUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鋁電解電容器與其電解液，此電解液包括電解質、有機溶劑以及機能性添加劑，其中機能性添加劑包括介電常數≧7的金屬氧化物。介電常數≧7的金屬氧化物的重量至多佔所述電解液總重量的3 wt%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aluminum electrolytic capacitor and an electrolyte solution thereof are provided. The electrolyte solution for aluminum electrolytic capacitor comprises an electrolyte, an organic solvents and a functional additive, wherein the functional additive includes a metal oxide with dielectric constant ≧7. The weight-percent of the metal oxide with dielectric constant ≧7 is up to 3 wt%, based on total weight of the electrolyte solution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鋁電解電容器</p>  
        <p type="p">20:素子</p>  
        <p type="p">22:陽極箔</p>  
        <p type="p">24:陰極箔</p>  
        <p type="p">26:隔離膜</p>  
        <p type="p">28:固定材</p>  
        <p type="p">30:容器</p>  
        <p type="p">40:電解液</p>  
        <p type="p">50:正/負極</p>  
        <p type="p">60:上蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="528" publication-number="202627839"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627839.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產品不良率的預測方法及預測系統</chinese-title>  
        <english-title>PREDICTING METHOD AND PREDICTING SYSTEM FOR PRODUCT DEFECT RATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F17/18</main-classification>  
        <further-classification edition="202001120250401B">G06F30/27</further-classification>  
        <further-classification edition="202301120250401B">G06Q10/04</further-classification>  
        <further-classification edition="201201120250401B">G06Q50/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許尚哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHANG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUN-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐珮晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PEI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種產品不良率的預測方法，包括：提供資料集，資料集中的每筆資料分別對應一個設計組合，並包括至少一第一類資料欄位以及至少一第二類資料欄位；使用一部分資料集的第一類資料欄位訓練第一模型並使用第二類資料欄位訓練第二模型；將另一部分資料集匯入訓練後的第一／第二模型來獲得多個第一預測結果及多個第二預測結果；使用多個第一預測結果及多個第二預測結果訓練集成預測模型；及，將新資料匯入第一模型及第二模型來獲得新第一預測結果及新第二預測結果，並將兩個預測結果匯入集成預測模型來獲得新資料的不良率預測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A predicting method for product defect rate, including: providing a data-set having multiple data each corresponding to one design combination and having at least one first-type data columns and at least one second-type data columns; respectively using the first-type data columns and the second-type data columns of a part of the data-set to train a first model and a second model; importing another part of the data-set to the trained first/second model to obtain multiple first predicted results and multiple second predicted results; using the multiple first/second predicted results to train an integrated predict model; and, importing a new data to the first/second model to obtain a new first predicted result and a new second predicted result, and importing the two new results to the integrated predict model to obtain a defect rate predicted result for the new data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:資料集</p>  
        <p type="p">201:第一階段訓練資料</p>  
        <p type="p">202:第二階段訓練資料</p>  
        <p type="p">211:離散型欄位</p>  
        <p type="p">212:連續型欄位</p>  
        <p type="p">5:離散型資料預測模型</p>  
        <p type="p">51:離散型資料預測結果</p>  
        <p type="p">6:連續型資料預測模型</p>  
        <p type="p">61:連續型資料預測結果</p>  
        <p type="p">7:集成預測模型</p>  
        <p type="p">71:不良率預測結果</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="529" publication-number="202627938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品組合標籤產生方法與零售系統</chinese-title>  
        <english-title>METHOD FOR GENERATING COMPOSITE TAGS FOR PRODUCT AND RETAIL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06Q30/0207</main-classification>  
        <further-classification edition="202301120250401B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250401B">G06Q10/08</further-classification>  
        <further-classification edition="200601120250401B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>九易宇軒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>91APP(TAIWAN), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何英圻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昆謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUEN-MOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪翊書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YI-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種商品組合標籤產生方法與零售系統。零售系統包括提供消費者商品資訊的零售系統前台、提供廠商設定商品文本的零售系統後台、資料庫以及運算伺服器，運算伺服器用以執行商品組合標籤產生方法。在產生商品組合標籤的方法中，先自商品文本庫中取得商品的文本，對文本進行斷詞後取得多個關鍵詞，形成商品的多個屬性標籤，再組合多個屬性標籤形成商品的多組候選組合標籤，經排除重複的組合標籤後，產生關聯商品的多組組合標籤，最後通過零售系統前台呈現多個商品，以及個別商品的多組組合標籤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for generating composite tags for products and a retail system are provided. The retail system includes a retail system frontend that provides consumers the product information, a retail system backend that provides providers to set product texts, a database and a computing server. The computing server performs the method for generating composite tags for products. In the method for generating composite tags for products, the texts of a product is retrieved from a product text library, the text is segmented for obtaining multiple keywords that form attribute tags of the product, and the multiple attribute tags are then combined to form multiple sets of candidate composite tags for the product. After duplicate attribute tags are excluded, multiple sets of composite tags for the product are generated. The retail system frontend shows multiple products and the multiple sets of composite tags with respect to each of the products.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:後台</p>  
        <p type="p">12:前台</p>  
        <p type="p">13:資料庫一</p>  
        <p type="p">14:伺服器</p>  
        <p type="p">15:資料庫二</p>  
        <p type="p">16:應用程式介面</p>  
        <p type="p">101:零售系統後台</p>  
        <p type="p">103:零售系統前台</p>  
        <p type="p">105:商品文本庫</p>  
        <p type="p">107:商品屬性標籤庫</p>  
        <p type="p">109:零售字典</p>  
        <p type="p">110:黑白名單</p>  
        <p type="p">111:運算伺服器</p>  
        <p type="p">113:商品/分類頁組合標籤庫</p>  
        <p type="p">115:快取記憶模組</p>  
        <p type="p">117:標籤推薦應用程式介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="530" publication-number="202627721"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627721.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>設備管理系統及設備管理方法</chinese-title>  
        <english-title>EQUIPMENT MANAGEMENT SYSTEM AND EQUIPMENT MANAGEMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G05B23/02</main-classification>  
        <further-classification edition="202301120250602B">G06Q10/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐家瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳鴻材</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HUNG-TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許銘翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種設備管理系統及其方法，所述系統包括多個感測器及一伺服器，所述伺服器具備儲存裝置、輸入/輸出裝置及處理器，所述處理器執行多個程式模組以實現設備管理方法。該方法包括：經由資料接收模組獲取第一維護日誌並整合感測資料；經由故障歸納模組對第二維護日誌進行故障類別歸納；經由故障整合模組執行相似度分析並整合為第二故障類別；獲取目標設備的當前目標感測資料；經由故障判斷模組判斷目標設備是否發生故障，並提供對應的目標維修指引資訊。可自動化建立系統化的維修知識庫，有效提升設備維護管理的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides an equipment management system and method thereof. The system comprises multiple sensors and a server, wherein the server includes a storage device, an input/output device, and a processor, and wherein the processor executes multiple program modules to implement an equipment management method. The method comprises: obtaining first maintenance logs and integrating sensor data via a data receiving module; performing fault category classification on second maintenance logs via a fault classification module; executing similarity analysis and integrating into second fault categories via a fault integration module; acquiring current target sensor data of a target equipment; determining whether the target equipment has experienced a fault via a fault determination module, and providing corresponding target maintenance guidance information. The disclosure enables automated establishment of a systematic maintenance knowledge database, thereby effectively improving the efficiency of equipment maintenance management.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410、S420、S430、S440、S450、S460:設備管理方法的步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="531" publication-number="202627598"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627598.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學攝像透鏡組、成像裝置及電子裝置</chinese-title>  
        <english-title>OPTICAL IMAGING LENS, IMAGING DEVICE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">G02B11/32</main-classification>  
        <further-classification edition="202101120250402B">G02B7/02</further-classification>  
        <further-classification edition="200601120250402B">G02B3/00</further-classification>  
        <further-classification edition="202101120250402B">G03B17/12</further-classification>  
        <further-classification edition="202101120250402B">G03B17/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紘立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETERGE OPTO-ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中揚光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG YANG TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祖孟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TSU-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯家儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHIA YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡、第二透鏡、光圈、第三透鏡、第四透鏡、第五透鏡及第六透鏡；該光學攝像透鏡組，由物側至像側依序包含一第一透鏡，具有負屈折力，其物側面為凸面，其像側面為凹面；一第二透鏡，具有正屈折力，其物側面為凸面，其像側面為凹面；一光圈；一第三透鏡，具有正屈折力，其物側面為凸面，其像側面為凸面；一第四透鏡，具有正屈折力，其物側面為凸面，其像側面為凸面；一第五透鏡，具有正屈折力，其物側面為凸面，其像側面為凸面；一第六透鏡，具有負屈折力，其物側面為凹面，其像側面為凹面；其中，該光學攝像透鏡組之透鏡總數為六片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens including a first lens element, a second lens element, an aperture, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element arranged in sequence from an object side to an image side along an optical axis is provided. The optical imaging lenses include, from an object side to an image side, the first lens having negative refractive power and including an object-side surface being convex and an image-side surface being concave, the second lens having positive refractive power and including an object-side surface being convex and an image-side surface being concave, the aperture, the third lens having positive refractive power and including an object-side surface being convex and an image-side surface being convex, the forth lens having positive refractive power and including an object-side surface being convex and an image-side surface being convex, the fifth lens having positive refractive power and including an object-side surface being convex and an image-side surface being convex, and the sixth lens having negative refractive power and including an object-side surface being concave and an image-side surface being concave. The optical imaging lenses include a total of six elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學攝像透鏡組</p>  
        <p type="p">11:第一透鏡</p>  
        <p type="p">12:第二透鏡</p>  
        <p type="p">13:第三透鏡</p>  
        <p type="p">14:第四透鏡</p>  
        <p type="p">15:第五透鏡</p>  
        <p type="p">16:第六透鏡</p>  
        <p type="p">17:濾光元件</p>  
        <p type="p">18:保護玻璃</p>  
        <p type="p">101:成像面</p>  
        <p type="p">11a:第一透鏡之物側面</p>  
        <p type="p">11b:第一透鏡之像側面</p>  
        <p type="p">12a:第二透鏡之物側面</p>  
        <p type="p">12b:第二透鏡之像側面</p>  
        <p type="p">13a:第三透鏡之物側面</p>  
        <p type="p">13b:第三透鏡之像側面</p>  
        <p type="p">14a:第四透鏡之物側面</p>  
        <p type="p">14b:第四透鏡之像側面</p>  
        <p type="p">15a:第五透鏡之物側面</p>  
        <p type="p">15b:第五透鏡之像側面</p>  
        <p type="p">16a:第六透鏡之物側面</p>  
        <p type="p">16b:第六透鏡之像側面</p>  
        <p type="p">17a、17b:濾光元件之二表面</p>  
        <p type="p">18a、18b:保護玻璃之二表面</p>  
        <p type="p">102:影像感測元件</p>  
        <p type="p">I:光軸</p>  
        <p type="p">ST:光圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="532" publication-number="202628561"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628561.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150597</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250324B">H10B12/00</main-classification>  
        <further-classification edition="202501120250324B">H10D64/27</further-classification>  
        <further-classification edition="202501120250324B">H10D64/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱永漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體結構及其形成方法。半導體結構包括基板、邏輯閘極結構、蓋層、層間介電層、阻障層及第一接觸物。基板包括周邊區及陣列區。邏輯閘極結構設置於周邊區中，且設置於基板上。蓋層設置於邏輯閘極結構上。層間介電層設置於蓋層上。阻障層包括位於周邊區的第一部分及位於陣列區的第二部分。第一部分設置於層間介電層上且位於邏輯閘極結構的正上方。第一接觸物設置於層間介電層中且接觸基板。其中，邏輯閘極結構的寬度小於第一部分的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure and a formation method thereof are provided. The semiconductor structure includes a substrate, a logical gate structure, a capping layer, an interlayer dielectric layer, a barrier layer, and a first contact. The substrate includes a peripheral area and an array area. The logical gate structure is disposed in the peripheral area and is disposed on the substrate. The capping layer is disposed on the logical gate structure. The interlayer dielectric layer is disposed on the capping layer. The barrier layer includes a first portion located in the peripheral area and a second portion located in the array area. The first portion is disposed on the interlayer dielectric layer and is located directly above the logical gate structure. The first contact is disposed in the interlayer dielectric layer and is in contact with the substrate. Wherein, a width of the logical gate structure is smaller than a width of the first portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體結構</p>  
        <p type="p">100:基板</p>  
        <p type="p">110:隔離結構</p>  
        <p type="p">120:蓋層</p>  
        <p type="p">200:層間介電層</p>  
        <p type="p">300:阻障層</p>  
        <p type="p">300a:第一部分</p>  
        <p type="p">300a1:第一側壁</p>  
        <p type="p">300a2:第一底部</p>  
        <p type="p">300b:第二部分</p>  
        <p type="p">300b1:第二側壁</p>  
        <p type="p">300b2:第二底部</p>  
        <p type="p">310:平坦化層</p>  
        <p type="p">310B:底表面</p>  
        <p type="p">310S:側表面</p>  
        <p type="p">410:第一接觸物</p>  
        <p type="p">d2:第二距離</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">LGS:邏輯閘極結構</p>  
        <p type="p">PA:周邊區</p>  
        <p type="p">t1:第一厚度</p>  
        <p type="p">t2:第二厚度</p>  
        <p type="p">w1:第一寬度</p>  
        <p type="p">w1’:總寬度</p>  
        <p type="p">w2:第二寬度</p>  
        <p type="p">w5:第五寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="533" publication-number="202628297"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628297.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150599</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過電壓保護電路</chinese-title>  
        <english-title>OVER VOLTAGE PROTECTION CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H02H3/20</main-classification>  
        <further-classification edition="200601120250303B">H02H9/04</further-classification>  
        <further-classification edition="200601120250303B">H02H7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輝創電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHETRON ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁瑞鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, JUI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許維宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種過電壓保護電路，用以解決習知保護電路元件成本高昂且易損壞問題。係包含：第一開關的第一端耦接電源輸入端、第二端耦接電源輸出端、第三端耦接接地端；第二開關的第四端耦接電源輸入端、第五端耦接電阻模組、第六端耦接接地端；電阻模組的第七端耦接電源輸入端、第八端耦接第五端；第一穩壓二極體的第九端耦接電源輸入端、第十端耦接接地端；第二穩壓二極體的第十一端耦接電源輸入端、第十二端耦接第五端與第八端之間；第三穩壓二極體的第十三端耦接電阻模組、第十四端耦接接地端。本發明可以避免過電壓損壞電路中元件的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An over voltage protection circuit is adapted for solving the problem of high component costs and susceptibility to damage in conventional protection circuits. The over voltage protection circuit includes a first switch, a second switch, a resistor module, a first Zener diode, a second Zener diode and a third Zener diode. The first switch has a first end coupled to a power input terminal, a second end coupled to a power output terminal, and a third end couple to a ground terminal. The second switch has a fourth end coupled to the power input terminal, a fifth end coupled to the resistor module, and a sixth end coupled to the ground terminal. The resistor module has a seventh end coupled to the power input terminal and an eighth end coupled to the fifth end. The first Zener diode has a ninth end coupled to the power input terminal and a tenth end coupled to the ground terminal. The second Zener diode has an eleventh end coupled to the power input terminal and a twelfth end coupled between the fifth end and the eighth end. The third Zener diode has a thirteenth end coupled to the resistor module and a fourteenth end coupled to the ground terminal. The invention can achieve the effect of preventing from damages to circuit components caused by overvoltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">GND:接地端</p>  
        <p type="p">P1:電源逆接保護元件</p>  
        <p type="p">P2:靜電保護元件</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">Ra:輔助電阻</p>  
        <p type="p">RM:電阻模組</p>  
        <p type="p">S1:第一開關</p>  
        <p type="p">S2:第二開關</p>  
        <p type="p">T1:第一端</p>  
        <p type="p">T2:第二端</p>  
        <p type="p">T3:第三端</p>  
        <p type="p">T4:第四端</p>  
        <p type="p">T5:第五端</p>  
        <p type="p">T6:第六端</p>  
        <p type="p">T7:第七端</p>  
        <p type="p">T8:第八端</p>  
        <p type="p">T9:第九端</p>  
        <p type="p">T10:第十端</p>  
        <p type="p">T11:第十一端</p>  
        <p type="p">T12:第十二端</p>  
        <p type="p">T13:第十三端</p>  
        <p type="p">T14:第十四端</p>  
        <p type="p">Tm:中間端</p>  
        <p type="p">Vin:電源輸入端</p>  
        <p type="p">Vout:電源輸出端</p>  
        <p type="p">Z1:第一穩壓二極體</p>  
        <p type="p">Z2:第二穩壓二極體</p>  
        <p type="p">Z3:第三穩壓二極體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="534" publication-number="202625886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>繁殖貝類之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD OF BREEDING SHELLFISH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250501B">A01K61/50</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>農業部水產試驗所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾福生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱惠真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜金蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金映玥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘泰安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂子玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種繁殖貝類之裝置，包括一浴槽、一網架、複數個第一容器、一框架以及一可移動工作單元。該浴槽配置以容置一第一溶液，該一網架設置於該浴槽中，配置以定義出相分隔之複數個區域。該些第一容器，分別地設置於該些區域之中，其中該些容器中之每一者係配置以容置一第二溶液及僅一種貝。該框架配置以環繞該浴槽，該框架包括跨越地設置於該浴槽上之一可移動橫樑。該可移動工作單元，設置於該可移動橫樑上，該可移動工作單元係配置以在該可移動橫樑上移動地執行該種貝之觀察、催生或環境維持。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:平台</p>  
        <p type="p">12:浴槽</p>  
        <p type="p">14:網架</p>  
        <p type="p">16:第一容器</p>  
        <p type="p">20:第一溶液</p>  
        <p type="p">22:第二溶液</p>  
        <p type="p">24:種貝</p>  
        <p type="p">30:框架</p>  
        <p type="p">32:可移動橫樑</p>  
        <p type="p">40:可移動工作單元</p>  
        <p type="p">50:循環單元</p>  
        <p type="p">54:出口</p>  
        <p type="p">56:管路</p>  
        <p type="p">58:管路</p>  
        <p type="p">70:繁殖單元</p>  
        <p type="p">80:溫度感測元件</p>  
        <p type="p">90:控制單元</p>  
        <p type="p">100:繁殖貝類之裝置</p>  
        <p type="p">A:區域</p>  
        <p type="p">S:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="535" publication-number="202628336"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628336.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動力系統</chinese-title>  
        <english-title>POWER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">H02P3/02</main-classification>  
        <further-classification edition="201601120251105B">H02P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉榮井</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, JUNG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動力系統，包括一電控模組、一動力模組及一驅動輪。動力模組設置於電控模組之外，並包括一馬達單元與一減速單元。馬達單元具有一第一殼體及一第一動力輸出軸。減速單元具有一第二殼體及一第二動力輸出軸。第一動力輸出軸連接減速單元，第二殼體鄰接第一殼體。驅動輪套設於第二動力輸出軸，並受第二動力輸出軸驅動而轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power system includes an electronic control module, a power module, and a driving wheel. The power module is disposed outside the electronic control module and includes a motor unit and a speed reduction unit. The motor unit has a first housing and a first power output shaft. The speed reduction unit has a second housing and a second power output shaft. The first power output shaft is connected to the speed reduction unit, and the second housing is closely connected to the first housing. The driving wheel is sleeved on the second power output shaft and is driven by the second power output shaft to rotate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:動力系統</p>  
        <p type="p">100,100’:子動力系統</p>  
        <p type="p">110:電控模組</p>  
        <p type="p">112:防水盒體</p>  
        <p type="p">120:動力模組</p>  
        <p type="p">130:馬達單元</p>  
        <p type="p">132:第一殼體</p>  
        <p type="p">140:減速單元</p>  
        <p type="p">142:第二殼體</p>  
        <p type="p">150:驅動輪</p>  
        <p type="p">162:承載輪</p>  
        <p type="p">164:張力輪</p>  
        <p type="p">166:履帶</p>  
        <p type="p">172:架體</p>  
        <p type="p">190:固定座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="536" publication-number="202627272"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627272.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免拆模牆體之建築方法及免拆模牆體結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">E04B2/84</main-classification>  
        <further-classification edition="200601120250402B">E04G21/14</further-classification>  
        <further-classification edition="200601120250402B">E04G17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡幸美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡幸美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作免拆模牆體之建築方法包含將安裝桿設置於預設基礎、將板模拉桿設置於安裝桿、將飾板組件設置於安裝桿並使飾板組件之飾板本體緊密排列、將板模件設置於板模拉桿而使板模件與飾板本體之間形成澆注空間以及澆注混凝土於該澆注空間中並待混凝土凝固形成混凝土牆體。所述建築方法透過以飾板組件作為免拆模牆體的一側之板模，能夠減少牆體之建築過程中使用的板模件數量，減少廢棄物、節省整體作業時間、降低成本及節約能源，達到環保的目的，本創作免拆模牆體結構的飾板組件設置於安裝桿上，有效提升飾板本體的建置強度以避免脫落。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:安裝桿</p>  
        <p type="p">20:板模拉桿</p>  
        <p type="p">21:墊片</p>  
        <p type="p">30:飾板組件</p>  
        <p type="p">31:飾板本體</p>  
        <p type="p">32:扣件</p>  
        <p type="p">40:緊固件</p>  
        <p type="p">50:板模件</p>  
        <p type="p">70:混凝土牆體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="537" publication-number="202628583"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628583.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150615</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構之形成方法</chinese-title>  
        <english-title>METHOD FOR FORMING SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250109B">H10B41/30</main-classification>  
        <further-classification edition="202301120250109B">H10B41/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王景擁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構的形成方法，包含提供基板，依序形成第一浮置閘極層及遮罩層於基板上方，以及蝕刻基板以形成溝槽且定義基板中的主動區。方法包含形成第一隔離結構於溝槽中且延伸至基板之中，形成間隔物於遮罩層的側壁上，以形成第一開口於第一隔離結構上方，以及形成第二隔離結構以填充第一開口。方法包含移除遮罩層及間隔物以形成第二開口，形成第二浮置閘極層以填充第二開口，移除第二隔離結構以露出第一隔離結構的頂表面，順應地形成閘間介電層於基板上方，以及形成控制閘極層於閘間介電層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a semiconductor structure, including providing a substrate, sequentially forming a first floating gate layer and a mask layer over the substrate, and etching the substrate to form a trench to define an active region in the substrate. The method includes forming a first isolation structure in the trench and extending into the substrate, forming a spacer on a sidewall of the mask layer to form a first opening over the first isolation structure, and forming a second isolation structure to fill the first opening. The method includes removing the mask layer and the spacer to form a second opening, forming a second floating gate layer to fill the second opening, removing the second isolation structure to expose a top surface of the first isolation structure, conformally forming an inter-gate dielectric layer over the substrate, and forming a control gate layer on the inter-gate dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體結構</p>  
        <p type="p">100:基板</p>  
        <p type="p">102:主動區</p>  
        <p type="p">105:穿隧氧化層</p>  
        <p type="p">110:第一浮置閘極層</p>  
        <p type="p">135:第一隔離結構</p>  
        <p type="p">180:第二浮置閘極層</p>  
        <p type="p">185:閘間介電層</p>  
        <p type="p">190:控制閘極層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="538" publication-number="202627874"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627874.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>函文處理輔助系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">G06F40/10</main-classification>  
        <further-classification edition="201201120250401B">G06Q40/08</further-classification>  
        <further-classification edition="201201120250401B">G06Q50/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國泰人壽保險股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亭萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅奕丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種函文處理輔助系統，適用於一機器人流程自動化系統，並包含一處理裝置，及電連接該處理裝置的一通訊裝置與一資料庫。該資料庫儲存已事先訓練的一生成式人工智慧模型。該處理裝置在接收到來自該機器人流程自動化系統的一電子公文資料時，將該電子公文資料輸入該生成式人工智慧模型，以獲得該電子公文資料的一函文類型、一執行對象、一需提供資訊、一不予扣押條件、一預定單位收文日期、及一法院發文日期，並將其轉換為一預定格式檔案作儲存，故能夠取代人工判讀，進而加快函文的處理流程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理裝置</p>  
        <p type="p">2:資料庫</p>  
        <p type="p">3:通訊裝置</p>  
        <p type="p">9:機器人流程自動化系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="539" publication-number="202628296"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628296.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150627</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>剝線器結構</chinese-title>  
        <english-title>WIRE STRIPPER STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">H02G1/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日崟興業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUSHARP INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林重江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHONG-JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種剝線器結構，包含：一本體，具有一安裝部、一鄰接該安裝部的線槽、及一設在該安裝部的限位刀槽；一刀片，具有一插置在該限位刀槽的刀體部、一連接該刀體部且位在該線槽的刀刃部、及一設在該刀體部的定位刀孔；以及一組定位組件，能夠拆離的設在該安裝部，並具有一穿置在該定位刀孔的定位部；藉由該本體的限位刀槽設計，限制了該刀片在剝線時旋轉的發生，並透過一組定位組件將該刀片穩固地定位在該本體的安裝部，因此，本發明僅藉由單組定位組件即可使該刀片達到定位與防止旋轉的功能，藉以提升更換該刀片的簡易性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wire stripper structure includes a body having a mounting portion, a wire slot adjacent to the mounting portion and a limiting blade slot located in the mounting portion, a blade having a blade body inserted in the limiting blade slot, a blade edge connected to the blade body and located in the wire slot and a positioning blade hole defined in the blade body, and a set of positioning assemblies detachably located in the mounting portion and provided with a positioning portion inserting through the positioning blade hole, thereby, the designing of the limiting blade slot of the body limits the rotation of the blade, and the set of positioning assembly firmly positions the blade to the mounting portion of the body, such that the blade can be positioned and prevented from rotation only by the single set of positioning assembly, so as to enhance the ease of replacing the blade.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:本體</p>  
        <p type="p">21:安裝部</p>  
        <p type="p">22:線槽</p>  
        <p type="p">23:握持部</p>  
        <p type="p">24:限位刀槽</p>  
        <p type="p">241:槽口</p>  
        <p type="p">242:限位凹部</p>  
        <p type="p">25:安裝孔</p>  
        <p type="p">26:貯藏槽</p>  
        <p type="p">30:刀片</p>  
        <p type="p">31:刀體部</p>  
        <p type="p">32:刀刃部</p>  
        <p type="p">33:刀端部</p>  
        <p type="p">34:定位刀孔</p>  
        <p type="p">41:定位桿件</p>  
        <p type="p">411:定位部</p>  
        <p type="p">412:第一鎖固部</p>  
        <p type="p">42:定位鈕</p>  
        <p type="p">421:第二鎖固部</p>  
        <p type="p">422:鎖固鈕部</p>  
        <p type="p">50:抗力件</p>  
        <p type="p">60:貯刀件</p>  
        <p type="p">62:卡臂部</p>  
        <p type="p">63:貯刀槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="540" publication-number="202628443"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628443.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能助聽器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">H04R25/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀華谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種智能助聽器，主體為一個可投射關鍵字、關鍵圖像於鏡片的眼鏡組，該眼鏡組包含一鏡架和相結合的二鏡片，於鏡架的側方內部設有一控制裝置，而控制裝置包含有一智能晶片和一投影器，該智能晶片可接收外部傳來的言語聲，判斷並選擇其中的關鍵字，再利用投影器，把「關鍵字」、「關鍵圖像」字投射在鏡片上，提供聽覺障礙人士，在使用助聽器還未能了解他人說話語意時，配合視覺可看到的「關鍵字」、「關鍵圖像」，加速其理解他人的意思，同時，該智能晶片可對所接收的外部言語聲，經由轉換為合成音，傳送到使用者的助聽器，提供清晰無雜音的對話聲，而更助益使用者的了解他人真意，以利其與他人的即時溝通，獲致功效者。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">11:鏡片</p>  
        <p type="p">2:控制裝置</p>  
        <p type="p">21:智能晶片</p>  
        <p type="p">22:投影器</p>  
        <p type="p">23:關鍵字</p>  
        <p type="p">24:合成音</p>  
        <p type="p">3:言語聲</p>  
        <p type="p">4:助聽器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="541" publication-number="202625891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150633</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>養殖槽升降式換水系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A01K63/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>農業部水產試驗所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱元南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王郁峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種養殖槽升降式換水系統，該系統設置於一鄰近外部養殖槽的機台上，包含：一升降機組、一滾筒機組、一換水機組、以及一控制模組，該滾筒機組至少包含一能隨著升降機組位移升降的滾筒式濾網，以及一能驅動該滾筒式濾網旋轉的旋轉動力單元；透過該控制模組的控制，當滾筒式濾網被帶動下降半沉在該養殖槽水面並且旋轉時，養殖槽水體可進入該滾筒式濾網內，讓養殖生物被阻隔在濾網的外部，並透過該換水機組將進入濾網內的養殖槽水體抽出；當濾網被帶動上升遠離養殖槽水面時，則可避免該滾筒式濾網生長生物膜，不但方便將濾網拆卸清洗，還可藉由該控制模組的控制自動化升降換水，大幅節省人力，提升產業競爭力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:養殖槽</p>  
        <p type="p">200:升降機組</p>  
        <p type="p">300:滾筒機組</p>  
        <p type="p">400:換水機組</p>  
        <p type="p">500:控制模組</p>  
        <p type="p">10:機台</p>  
        <p type="p">11:軸桿</p>  
        <p type="p">20:懸臂</p>  
        <p type="p">30:升降動力單元</p>  
        <p type="p">40:滾筒式濾網</p>  
        <p type="p">50:旋轉動力單元</p>  
        <p type="p">60:抽水管件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="542" publication-number="202625945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625945.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動煮茶機</chinese-title>  
        <english-title>AUTOMATIC TEA MAKING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">A47J31/44</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣飲子自動化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN AUTOMATIC BEVERAGE MACHINES CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玟妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MIN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHI QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳顯侯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIAN HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝孟成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, MENG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種自動煮茶機，主要包括：一中控單元、一儲料裝置以及一煮茶裝置，該中控單元內建複數茶種之煮茶程式，並依據接收之一茶品指令選擇對應茶種之煮茶程式，該儲料裝置用以存放複數茶種之茶包，以一輸送機構依據該煮茶程式選取一對應茶種之茶包並輸出至一輸送通道，該煮茶程式控制該煮茶裝置進行注水、將水加熱滲泡茶包、醒茶及排出茶包等過程以取得茶湯，並將醒茶後之茶湯輸出，全程自動化以確保整個過程高效且衛生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an automatic tea-making machine, which mainly includes: a central control unit, a storage device and a tea-making device. The central control unit has built-in tea-making programs for multiple tea types and receives a tea product instruction. Select a tea brewing program corresponding to the tea type. The storage device is used to store tea bags of multiple tea types. A conveying mechanism selects a tea bag corresponding to the tea type according to the tea brewing program and outputs it to a conveying channel. The tea brewing device The program controls the tea brewing device to fill the water, heat the water to soak the tea bags, wake up the tea, and discharge the tea bags to obtain the tea soup, and output the tea soup after waking up. The entire process is automated to ensure that the entire process is efficient and hygienic.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(1):自動煮茶機</p>  
        <p type="p">(2):機架</p>  
        <p type="p">(21):補料閘門</p>  
        <p type="p">(24):散熱器</p>  
        <p type="p">(6):煮茶裝置</p>  
        <p type="p">(61):煮茶桶</p>  
        <p type="p">(62):泡茶器</p>  
        <p type="p">(64):旋轉器</p>  
        <p type="p">(B1):回收桶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="543" publication-number="202625911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>落料機</chinese-title>  
        <english-title>BLANKING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250203B">A23P10/20</main-classification>  
        <further-classification edition="201601120250203B">A23P10/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣飲子自動化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玟妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MIN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHI QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳顯侯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIAN HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝孟成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, MENG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種落料機，包括一容器、一驅動馬達、一螺旋桿體、及一落料管。該容器具有一入料口、一出料口、及一導料通道，該出料口位於該容器底壁，該導料通道由前向後且由上而下斜向設置於該容器底部，以界定出該導料通道之上端及下端，且該導料通道之下端與該出料口相通；該螺旋桿體設置於該導料通道內，且連接該驅動馬達之動力輸出端；該落料管銜接於該上端，且該落料管之落料口朝下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A blanking machine includes a container, a driving motor, a screw rod body, and a blanking tube. The container has a material inlet, a material outlet, and a material guide channel. The material outlet is located on the bottom wall of the container. The material guide channel is disposed obliquely at the bottom of the container from front to back and from top to bottom. To define the upper end and lower end of the material guide channel, and the lower end of the material guide channel is connected with the discharge port; the screw rod body is arranged in the material guide channel and connected to the power output end of the drive motor; the blanking The pipe is connected to the upper end, and the blanking port of the blanking pipe faces downward.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:容器</p>  
        <p type="p">11:入料口</p>  
        <p type="p">14:握把</p>  
        <p type="p">17:前側</p>  
        <p type="p">40:落料管</p>  
        <p type="p">50:收集容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="544" publication-number="202627889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維粗粒度可重構陣列架構系統及三維粗粒度可重構陣列架構系統的控制方法</chinese-title>  
        <english-title>THREE-DIMENSIONAL COARSE-PARTICLE RECONFIGURABLE ARRAY CONSTRUCTION SYSTEM AND CONTROL METHOD OF THREE-DIMENSIONAL COARSE-PARTICLE RECONFIGURABLE ARRAY CONSTRUCTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250704B">G06N3/06</main-classification>  
        <further-classification edition="200601120250704B">G06N3/02</further-classification>  
        <further-classification edition="200601120250704B">G06F17/16</further-classification>  
        <further-classification edition="200601120250704B">G06F15/173</further-classification>  
        <further-classification edition="202001120250704B">G06F30/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊家驤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIA-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉星宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, XING-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提出一種三維粗粒度可重構陣列架構系統及其控制方法。該系統包含多個第一陣列及多個第二陣列，其中每個第一陣列包含多個第一運算單元、多個第一儲存單元及多個第一切換器，每個第二陣列包含多個第二運算單元、多個第二儲存單元及多個第二切換器。該系統採用交錯堆疊方式排列第一陣列與第二陣列，並透過配置控制器動態管理各單元的啟用及禁用狀態，以執行神經網路模型的運算任務。本公開的技術方案可顯著提升資料傳輸效率、增加資源使用靈活性，並實現硬體資源的最佳化配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a three-dimensional coarse-grained reconfigurable array architecture system and its control method. The system includes multiple first arrays and multiple second arrays, wherein each first array includes multiple first processing elements, multiple first storage units, and multiple first switches, and each second array includes multiple second processing elements, multiple second storage units, and multiple second switches. The system employs an interleaved stacking arrangement for the first arrays and second arrays, and dynamically manages the activation and deactivation states of various units through a configuration controller to execute neural network model computation tasks. The technical solution of the present disclosure can significantly improve data transmission efficiency, increase resource utilization flexibility, and achieve optimal allocation of hardware resources.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:粗粒度可重構陣列架構系統</p>  
        <p type="p">110:配置控制器</p>  
        <p type="p">121:第一陣列</p>  
        <p type="p">122:第二陣列</p>  
        <p type="p">130:輸入/輸出介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="545" publication-number="202627890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料融合同步輸出電路以及資料融合同步輸出方法</chinese-title>  
        <english-title>DATA FUSION SYNCHRONIZATION OUTPUT CIRCUIT AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06N3/06</main-classification>  
        <further-classification edition="202301120250401B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的較佳實施例關於一種資料融合同步輸出電路以及資料融合同步輸出方法，此資料融合同步輸出方法包括：依照一接收時脈，觸發一類比數位轉換器輸出一數位資料；依照該接收時脈，暫存一第一像素資料、一第二像素資料以及一第三像素資料以及該數位資料至一緩衝同步儲存電路；依照一卷積神經網路的資料需求，對該第一像素資料、該第二像素資料、該第三像素資料以及該數位資料進行一指定運算；以及依照該卷積神經網路的資料需求，對指定運算後的該第一像素資料、該第二像素資料、該第三像素資料以及該數位資料進行資料融合，輸出一指定格式資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The preferred embodiment of the present invention describes a data fusion synchronization output circuit and a method thereof. The method includes: triggering an ADC to output a digital data according to a receiving clock; temporally storing a first, a second, a third pixel data and the digital data to a buffer storage; performing a specific operation to the first, second, third pixel data and the digital data according to a requirement of a CNN; and performing a data fusion to the first, second, third pixel data and the digital data with the specific operation to output a specific form data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ADC:類比數位轉換器</p>  
        <p type="p">CCAP:攝像機影像擷取介面控制電路</p>  
        <p type="p">101:控制電路</p>  
        <p type="p">102:緩衝同步儲存電路</p>  
        <p type="p">103:資料運算選擇單元</p>  
        <p type="p">104:資料合成單元</p>  
        <p type="p">R:紅色像素</p>  
        <p type="p">G:綠色像素</p>  
        <p type="p">B:藍色像素</p>  
        <p type="p">HSYNC:水平同步訊號</p>  
        <p type="p">VSYNC:垂直同步訊號</p>  
        <p type="p">PCLK:像素時脈訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="546" publication-number="202627723"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627723.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載具系統及其載具控制方法</chinese-title>  
        <english-title>VEHICLE SYSTEM AND VEHICLE CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250423B">G05D1/43</main-classification>  
        <further-classification edition="202001120250423B">G01S17/93</further-classification>  
        <further-classification edition="200601120250423B">G01S17/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳孟懷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MENG-HUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭世賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, SH-XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈威廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, WEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭彥嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YEN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯文清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, WEN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李士畦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種載具系統及其載具控制方法。使用一光學掃描元件掃描周圍環境以獲取複數個掃描數據。對該些掃描數據進行座標系轉換。對複數個區間內的該些掃描數據進行處理以產生該載具的一移動路徑，其中，於該載具的兩側設置複數個興趣區域，並將各該些興趣區域切分成該些區間。根據該載具的一車頭偏擺量與一航向偏差來進行模糊控制以控制該載具沿著該移動路徑而進行移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application discloses a vehicle system and a vehicle control method thereof. An optical scanning element is used to scan the surrounding environment, obtaining multiple sets of scan data. These scan data undergo coordinate transformation. The scan data within a plurality of segments are processed to generate a movement path for the vehicle, wherein multiple regions of interest area are set on both sides of the vehicle, and each region of interest is divided into several segments. Fuzzy control is applied based on the vehicle’s yaw angle and heading deviation to guide the vehicle along the movement path for movement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210-230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="547" publication-number="202627440"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627440.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>零件測試裝置</chinese-title>  
        <english-title>COMPONENT TEST DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">G01N3/38</main-classification>  
        <further-classification edition="200601120250613B">G05B11/42</further-classification>  
        <further-classification edition="202301120250613B">G06N3/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巨克富科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEF SI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何寬賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, KUAN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯怡仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, I-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種零件測試裝置，用以對至少一待測零件進行測試。零件測試裝置包含即時控制器、伺服驅動器、第一電動缸模組及第二電動缸模組。即時控制器應用人工智慧提供包含至少一最適合的比例-積分-微分(PID)控制參數的即時控制信號。伺服驅動器耦接即時控制器，配置以根據即時控制信號產生第一驅動信號及第二驅動信號。第一電動缸模組與第二電動缸模組耦接伺服驅動器，分別受第一驅動信號及第二驅動信號驅動而根據該至少一最適合的PID控制參數對待測零件施加第一力量及第二力量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A component testing device for testing at least one component to be tested is disclosed. The component to be tested includes a real-time controller, a servo driver, a first electric cylinder module and a second electric cylinder module. The real-time controller applies artificial intelligence to provide a real-time control signal including at least one most suitable proportional-integral-derivative (PID) control parameter. The servo driver is coupled to the real-time controller and configured to generate a first driving signal and a second driving signal according to the real-time control signal. The first electric cylinder module and the second electric cylinder module are coupled to the servo driver and driven by the first driving signal and the second driving signal to apply a first force and a second force to the component to be tested respectively according to the at least one most suitable PID control parameter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:零件測試裝置</p>  
        <p type="p">20:即時控制器</p>  
        <p type="p">22:伺服驅動器</p>  
        <p type="p">24:第一電動缸模組</p>  
        <p type="p">26:第二電動缸模組</p>  
        <p type="p">CP:待測零件</p>  
        <p type="p">SC:即時控制信號</p>  
        <p type="p">SD1:第一驅動信號</p>  
        <p type="p">SD2:第二驅動信號</p>  
        <p type="p">F1:第一力量</p>  
        <p type="p">F2:第二力量</p>  
        <p type="p">FB1:第一回授信號</p>  
        <p type="p">FB2:第二回授信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="548" publication-number="202626394"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626394.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燃油機車之動態節能方法</chinese-title>  
        <english-title>DYNAMIC ENERGY SAVING METHOD FOR FUEL LOCOMOTIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250317B">B60L58/12</main-classification>  
        <further-classification edition="200601120250317B">B60W10/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仁豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許翰林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEU, HAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張敏鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種燃油機車之動態節能方法，所述燃油機車包括一引擎、一發電單元、一電瓶以及一負載，引擎電連接一引擎控制單元並與一啟動馬達透過軸樞轉，發電單元包括一發電機以及一與發電機電連接之整流器，整流器內設置有一整流器開關並電連接一電門，電瓶電連接整流器及啟動馬達，並於電瓶與整流器之電路間電連接負載。藉此，透過本發明之燃油機車之動態節能方法，當電瓶電壓與啟動壓降穩定時，電瓶判斷為滿電下，即透過電路邏輯將整流器開關斷開而不進行發電，進而降低引擎的負載，俾能達到增加引擎動力或節省油耗的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a dynamic energy saving method for a fuel locomotive. The fuel locomotive includes an engine, a power generation unit, a battery and a load. The engine is electrically connected to an engine control unit and pivots with a starter motor through a shaft. The power generation unit includes a generator and a rectifier electrically connected to the generator. The rectifier is equipped with a rectifier switch and is electrically connected to an electric door. The battery is electrically connected to the rectifier and the starter motor, and the circuit between the battery and the rectifier is electrically connected to the load. As such, through the dynamic energy saving method of the fuel locomotive of the present invention, when the battery voltage and the starting voltage drop are stable, the battery is judged to be fully charged, the rectifier switch is turned off through circuit logic without generating electricity, thereby reducing the engine load to achieve the function of increasing engine power or saving fuel consumption.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A~G:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="549" publication-number="202626006"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626006.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環保燙髮包</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">A61K8/18</main-classification>  
        <further-classification edition="200601120250422B">A45D2/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭全易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳竑宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊允綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宥瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭全易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳竑宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊允綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宥瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田國健</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環保燙髮包，包括發熱材料和除味劑，發熱材料與除味劑之質量比爲95:2，其中發熱材料之組分包括煅燒牡蠣殼粉和氯化鈣，煅燒牡蠣殼粉與氯化鈣之質量比爲7:1。本發明充分利用廢棄牡蠣殼爲資源，將廢棄牡蠣殼經高溫煅燒後製得的牡蠣殼粉作爲主要供熱源，輔以氯化鈣以補充熱量提高加熱效果，同時增強整體保存時的吸濕性能，延長保質期，並以除味劑吸附氣味，改善消費者的體驗感受。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1、2:曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="550" publication-number="202628864"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628864.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P72/00</main-classification>  
        <further-classification edition="200601120260401B">B08B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博達企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾進賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾彥維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾翊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾筠筑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板處理裝置，適用於處理一基板，並包含一機架、一安裝於該機架用於承載該基板的載台、一安裝於該機架並包括一夾持塊的支撐單元、一安裝於該夾持塊並沿一平行於該基板的第一方向延伸的機械臂，及一噴淋單元。該噴淋單元包括一連接座、一支架及至少一噴頭；該連接座安裝於該機械臂並可沿該第一方向移動；該支架安裝於該連接座；該至少一噴頭呈可轉動地樞接於該支架並朝向該基板。本發明可以調整該至少一噴頭相對於該基板在平行方向的位置，加上該至少一噴頭可轉動，能調整該至少一噴頭相對於該基板之噴淋角度，如此，具備能將該至少一噴頭調整至準確的噴淋位置，進而可提升處理效果的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機架</p>  
        <p type="p">2:承載單元</p>  
        <p type="p">21:旋轉件</p>  
        <p type="p">22:載台</p>  
        <p type="p">3:支撐單元</p>  
        <p type="p">31:夾持塊</p>  
        <p type="p">32:固定座</p>  
        <p type="p">33:線性滑軌</p>  
        <p type="p">331:滑座</p>  
        <p type="p">34:動力件</p>  
        <p type="p">4:機械臂</p>  
        <p type="p">5:噴淋單元</p>  
        <p type="p">50:連接座</p>  
        <p type="p">60:支架</p>  
        <p type="p">80:噴頭</p>  
        <p type="p">82:噴嘴</p>  
        <p type="p">100:基板</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="551" publication-number="202627335"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627335.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多通道流向調節閥</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">F16K11/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博達企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾進賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾彥維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾翊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, I-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾筠筑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YUN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多通道流向調節閥，包含一閥單元及複數壓缸組， 該閥單元包括一第一閥座、一第二閥座及一流動空間，該第一閥座具有一第一主體，及複數沿一安裝方向延伸並位於該第一主體且連通該流動空間的第一流道，該第二閥座具有一第二主體、一沿該安裝方向貫穿該第二主體並連通該流動空間的第二流道，及複數沿該安裝方向貫穿該第二主體的裝設孔， 每一壓缸組包括一穿設於各自的該裝設孔的調節活塞，該調節活塞可受驅動而於一封閉狀態及一未封閉狀態之間變化，使該調節活塞封閉或不封閉各自的該第一流道，以使該第一閥座、該第二閥座及該等壓缸組便於製作及安裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:第一閥座</p>  
        <p type="p">211:第一主體</p>  
        <p type="p">212:第一流道</p>  
        <p type="p">213:環部</p>  
        <p type="p">214:頸區</p>  
        <p type="p">22:第二閥座</p>  
        <p type="p">221:第二主體</p>  
        <p type="p">222:第二流道</p>  
        <p type="p">223:裝設孔</p>  
        <p type="p">224:大徑段</p>  
        <p type="p">225:小徑段</p>  
        <p type="p">23:流動空間</p>  
        <p type="p">231:中心區</p>  
        <p type="p">232:導引區</p>  
        <p type="p">233:連通區</p>  
        <p type="p">3:閥管</p>  
        <p type="p">41:調節活塞</p>  
        <p type="p">411:活塞部</p>  
        <p type="p">412:延伸部</p>  
        <p type="p">42:氣缸件</p>  
        <p type="p">51:閥座密封環</p>  
        <p type="p">52:閥座環槽</p>  
        <p type="p">53:活塞密封環</p>  
        <p type="p">54:活塞環槽</p>  
        <p type="p">55:抵壓密封環</p>  
        <p type="p">56:抵壓環槽</p>  
        <p type="p">X:安裝方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="552" publication-number="202628322"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628322.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自電解永續氫能源感應馬達</chinese-title>  
        <english-title>SELF-ELECTROLYZED SUSTAINABLE HYDROGEN ENERGY INDUCTION MOTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">H02K21/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本項發明創作屬於一種可自電解供電作馬達氫能運轉之新穎氫能源感應馬達，係在一感應馬達可設一電解線圈、一氫能線圈及一電解電池、一貯氫容器、一氫燃料電池，以共同組成一「自電解永續氫能源感應馬達」。該感應馬達設有鐵心繞組轉子及轉動軸，於該感應馬達內部設該電解線圈及該氫能線圈，於該感應馬達外部設該電解電池、該貯氫容器及該氫燃料電池，該感應馬達外部另設一交直流轉換器、一直交流轉換器及一氣閥。該永續氫能源感應馬達利用一外部氫經由該氣閥、該貯氫容器及該氫燃料電池可供電予該氫能線圈，並藉該氫能線圈與該鐵心繞組轉子間之電磁作用，帶動該鐵心繞組轉子轉動以利用該轉動軸驅動一負載工作。該永續氫能源感應馬達並藉由該鐵心繞組轉子之轉動使該電解線圈可產生一高電壓，該高電壓再供電予該電解電池並利用一外部水以電解產氫，該電解氫經由該貯氫容器及該氫燃料電池可續供電予該氫能線圈(自電解供電)。該電解線圈、該電解電池、該貯氫容器與該氫燃料電池、該氫能線圈構成一「自電解氫能供電結構」，使該氫燃料電池可供電予該氫能線圈以作馬達運轉，並且，該電解線圈、該電解電池、該貯氫容器可供氫予該氫燃料電池以作馬達持續運轉，而不影響該永續氫能源感應馬達之負載工作。如此，運用本項發明創作中，由一感應馬達之一電解線圈、一氫能線圈及一電解電池、一貯氫容器及一氫燃料電池構成之「自電解永續氫能源感應馬達」，令該電解線圈、該氫能線圈與該電解電池、該氫燃料電池可作馬達氫能運轉，利用本創作新式之自電解氫能供電結構，將可達到感應馬達可自電解氫能供電之用電特性，落實電力節能減碳及永續發展的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">11:永續氫能源感應馬達</p>  
        <p type="p">111:鐵心繞組轉子</p>  
        <p type="p">112:轉動軸</p>  
        <p type="p">1131:三極電解線圈</p>  
        <p type="p">1132:三極電解線圈</p>  
        <p type="p">1141:三極氫能線圈</p>  
        <p type="p">1142:三極氫能線圈</p>  
        <p type="p">12:負載</p>  
        <p type="p">13:電解電池</p>  
        <p type="p">14:貯氫容器</p>  
        <p type="p">15:氫燃料電池</p>  
        <p type="p">16:交直流轉換器</p>  
        <p type="p">17:直交流轉換器</p>  
        <p type="p">18:氣閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="553" publication-number="202627316"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627316.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鑽尾螺絲</chinese-title>  
        <english-title>DRILLING SCREW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">F16B25/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>順通國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>S&amp;T FASTENING INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, PO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明鑽尾螺絲，其主要在鑽體上開設有至少一導屑槽，同時每一導屑槽呈傾斜延伸設置且延伸於二排屑槽之間；是以，該鑽體進行鑽削時，可利用該導屑槽以減少切削刃與一鎖合物件間之接觸面積，並且透過該導屑槽亦可快速將該等切削刃鑽削該鎖合物件所產生之切屑予以排出，以達快速排屑，不僅有效提升該鑽尾螺絲之鎖合速度，更避免該切屑於鑽削過程中之過度堆積、及避免該鎖合物件產生裂材之缺失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A drilling screw mainly includes at least one guiding slot formed on a drill body. Each guiding slot is inclinedly extended and extended between two discharging slots. When the drill body conducts a drilling operation, the guiding slot helps reduce an area where cutting edges are in contact with a workpiece during the drilling operation. The guiding slot also helps a quick removal of debris caused by cutting the workpiece with the cutting edges to attain a quick debris-removing effect, thereby increasing the drilling speed of the drilling screw efficiently, preventing the undue accumulation of debris during the drilling operation, and preventing the cracking problem of the workpiece.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:鑽尾螺絲</p>  
        <p type="p">31:螺頭</p>  
        <p type="p">32:桿體</p>  
        <p type="p">33:螺牙</p>  
        <p type="p">34:鑽尾部</p>  
        <p type="p">341:鑽體</p>  
        <p type="p">342:鑽尖</p>  
        <p type="p">343:排屑槽</p>  
        <p type="p">344:切削刃</p>  
        <p type="p">345:導屑槽</p>  
        <p type="p">346:開口</p>  
        <p type="p">35:導引面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="554" publication-number="202627834"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627834.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及圖像搜索方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND IMAGE SEARCH METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250401B">G06F16/53</main-classification>  
        <further-classification edition="201901120250401B">G06F16/532</further-classification>  
        <further-classification edition="201901120250401B">G06F16/51</further-classification>  
        <further-classification edition="201901120250401B">G06F16/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種圖像搜索方法包括：提供人機交互介面接收使用者輸入；根據從人機交互介面所傳送的使用者輸入來進行圖像物件偵測操作來產生特定圖像；根據特定圖像來進行圖像轉語意操作以對特定圖像進行不可逆加密編碼來產生特定語意向量；發送特定語意向量至雲端伺服器的雲端語意搜索引擎，使得雲端語意搜索引擎根據特定語意向量來搜索雲端伺服器所儲存之多個語意向量以選出近似語意向量所對應的圖像資訊並發送近似語意向量所對應之圖像資訊至人機交互介面；以及控制人機交互介面顯示圖像資訊給使用者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image search method includes: providing a human-machine interface to receive an input of a user; performing an image object detection operation according to the input of the user sent from the human-machine interface to generate a specific image; performing an image-to-semantic operation based on the specific image to perform an irreversible encryption encoding upon the specific image to generate a specific semantic vector; sending the generated specific semantic vector into a cloud semantic search engine of a cloud server so that the cloud semantic search engine searches multiple semantic vectors stored in the cloud server according to the specific semantic vector so as to select image information corresponding to an approximate semantic vector and send the image information into the human-machine interface; and, controlling the human-machine interface to display the image information for the user.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:圖像搜索系統</p>  
        <p type="p">101:電子裝置</p>  
        <p type="p">102:雲端伺服器</p>  
        <p type="p">103:雲端語意搜索引擎</p>  
        <p type="p">105:人機交互介面</p>  
        <p type="p">110:中央控制器</p>  
        <p type="p">115:物件偵測電路</p>  
        <p type="p">120:圖像轉語意電路</p>  
        <p type="p">125:本地資料庫</p>  
        <p type="p">130:本地語意搜索引擎</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="555" publication-number="202627836"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627836.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自適應性繞線控制演算法</chinese-title>  
        <english-title>ADAPTIVE WINDING CONTROL ALGORITHM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250502B">G06F17/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林熊徵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIUNG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭彥皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YAN HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種自適應性繞線控制演算法，其係先取得收線軸之軸長，即可獲得線性馬達驅動滑台的移動範圍，再決定繩索線徑尺寸，於相除後會得到收線軸每一層能捲繞的圈數，再設定伺服馬達對應收線軸旋轉一圈360°的參數，以透過收線軸累積的單位量來得到收線軸目前累積的圈數，再將兩者相除後，可得到收線軸累積的層數；藉此，可根據不同尺寸自動調整繩索捲入位置，且可進行繞線速度上的調變，達成捲線機自動化的運轉模式，除可大幅節省人力需求之外，亦可有效提高捲線機之繞線速度、穩定性及品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to an adaptive winding control algorithm. By first obtaining a length of a winding shaft, a movement range of a linear motor-driven sliding platform can be determined. Diameter of a rope diameter is then specified, and by dividing the shaft length by the rope diameter, the number of turns that can be wound per layer on the winding shaft is calculated. Parameters for the servo motor corresponding to a 360° rotation of the winding shaft are then set. Using the cumulative unit amount on the winding shaft, the total number of accumulated turns is determined. Dividing this by the number of turns per layer yields the current number of layers on the winding shaft. With this process, the rope winding position can be automatically adjusted based on different sizes, and the winding speed can be modulated, achieving an automated winding operation for the winding machine. This not only significantly reduces labor requirements but also effectively improves the winding speed, stability, and quality of the winding machine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:伺服驅動器</p>  
        <p type="p">31:伺服馬達</p>  
        <p type="p">32:線性馬達</p>  
        <p type="p">4:可程式控制器</p>  
        <p type="p">5:人機介面</p>  
        <p type="p">6:I/O擴充模組</p>  
        <p type="p">7:編碼器</p>  
        <p type="p">8:張力感測器</p>  
        <p type="p">9:光學測微計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="556" publication-number="202626474"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626474.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雲端電梯運行監測與健康狀態管理戰情系統</chinese-title>  
        <english-title>CLOUD ELEVATOR OPERATION MONITORING AND HEALTH CONDITION MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">B66B5/00</main-classification>  
        <further-classification edition="200601120250228B">B66B5/02</further-classification>  
        <further-classification edition="200601120250228B">B66B1/06</further-classification>  
        <further-classification edition="200601120250228B">B66B13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林熊徵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIUNG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭彥皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YAN HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種雲端電梯運行監測與健康狀態管理戰情系統，其主要係戰情管理系統設有震動與訊號傳輸晶片模組電性連接有震動感測器供感測電梯車廂之震動狀態，設有重量感測器感測電梯車廂重量訊號，令重量感測器所感測的重量訊號經由載重晶片模組接收後傳輸至震動與訊號傳輸晶片模組，震動與訊號傳輸晶片模組供執行震動區域分割法［vibration region segmentation algorithm］的數學運算模型以進行電梯健康預警機制，於震動與訊號傳輸晶片模組電性連接有網路連線模組，網路連線模組則透過網路與網路交換器連線，而於網路交換器分別與雲端伺服器及人機操作介面連線；藉此，能經由感測電梯車廂運行過程中的震動狀態及載重訊息，予以對該電梯車廂之健康狀態進行預警，以讓該電梯車廂使用上更具安全性，而在其整體施行使用上更增實用功效特性者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention elates to a cloud elevator operation monitoring and health condition management system, which consists of a vibration and signal transmission chip module electrically connected with a vibration sensor for sensing the vibration state of the elevator car, and a weight sensor for sensing the weight signal of the elevator car, so that the weight signal sensed by the weight sensor is received by the weight-carrying chip module and transmitted to the vibration and signal transmission chip module, which is used to execute the mathematical calculation model of the vibration region segmentation algorithm to perform the elevator health warning mechanism. The vibration and signal transmission chip module is electrically connected to a network connection module, which connects to a network switch through the network, and the network switch is connected to a cloud server and a human-machine operation interface. By sensing the vibration status and load information during the operation of the elevator car, the health status of the elevator car can be forewarned, so as to make the elevator car safer to use and increase the practicality and efficacy of the overall implementation of the use of the elevator car.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:戰情管理系統</p>  
        <p type="p">11:震動與訊號傳輸晶片模組</p>  
        <p type="p">12:震動感測器</p>  
        <p type="p">13:重量感測器</p>  
        <p type="p">14:載重晶片模組</p>  
        <p type="p">15:網路連線模組</p>  
        <p type="p">16:網路交換器</p>  
        <p type="p">161:防火牆</p>  
        <p type="p">17:雲端伺服器</p>  
        <p type="p">18:人機操作介面</p>  
        <p type="p">2:電梯車廂</p>  
        <p type="p">21:電梯控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="557" publication-number="202628073"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628073.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於交通工具的聲音辨識系統與聲音辨識方法</chinese-title>  
        <english-title>SOUND RECOGNITION SYSTEM AND SOUND RECOGNITION METHOD FOR TRANSPORTATION MEANS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250321B">G10L17/26</main-classification>  
        <further-classification edition="201301120250321B">G10L25/30</further-classification>  
        <further-classification edition="201301120250321B">G10L25/54</further-classification>  
        <further-classification edition="200601120250321B">G10L15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APACECORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種聲音辨識系統與聲音辨識方法。此方法包括：通過設置在交通工具的多個麥克風接收在行駛環境的多個聲音訊號；根據機器學習模型辨識這些聲音訊號是否包含屬於預設車輛類別的聲音訊號；以及若上述的聲音訊號包含屬於預設車輛類別的聲音訊號，根據預設車輛類別的聲音訊號計算聲音源的空間資訊，並將空間資訊顯示在交通工具上的顯示裝置上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a sound recognition system and a sound recognition method. This method includes: receiving multiple sound signals in a driving environment through multiple microphones installed on transportation means; identifying whether these sound signals contain a sound signal belonging to a predetermined vehicle category based on a machine learning model; and if the aforementioned sound signals contain the sound signal belonging to the predetermined vehicle category, calculating spatial information of a sound source according to the sound signal of the predetermined vehicle category, and displaying the spatial information on a display device on the transportation means.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201~207,210,220:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="558" publication-number="202627840"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627840.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>家譜的整合編輯方法及其系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">G06F17/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧明賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧明賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種家譜的整合編輯方法，先預備一以一目標體系編輯的現有家譜，及一整合編輯系統。該家譜的整合編輯系統包括一資料庫、一資訊連接該資料庫並用以進行檢索的檢索模組，及一資訊連接該檢索模組並用以根據檢索條件輸出一參考資料的處理模組。接著取得一以一編輯體系編撰的待新增資料，並匯入該家譜的整合編輯系統，再使用該檢索模組輸入有關一家族資訊的檢索條件對該待新增資料進行檢索，使該處理模組提供一有關於該編輯體系及該家族資訊的參考資料，並根據該參考資料將該待新增資料與該現有家譜整合編輯一採用該目標體系的新編家譜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:預備步驟</p>  
        <p type="p">12:蒐集步驟</p>  
        <p type="p">13:檢索步驟</p>  
        <p type="p">14:整合步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="559" publication-number="202625965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主動脈血壓量測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250515B">A61B5/021</main-classification>  
        <further-classification edition="200601120250515B">G01S13/88</further-classification>  
        <further-classification edition="200601120250515B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂發電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ST&amp;T ELECTRIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶德和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, TEH-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李棟樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TUNG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡東賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種主動脈血壓量測方法。所述主動脈血壓量測方法包括：以脈衝雷達感測器擷取升主動脈容積變化訊號波形；從升主動脈容積變化訊號波形上取得複數個收縮容積波峰、複數個收縮容積波谷及複數個舒張逆向血流容積波峰；利用所述複數個收縮容積波峰、所述複數個收縮容積波谷及所述複數個舒張逆向血流容積波峰計算出複數個收縮期時距(SP)、複數個心動週期時距(HP)、複數個舒張逆向血流容積波峰至基線的距離(DB)及複數個收縮容積波峰至收縮容積波谷的距離(DPV)；利用(SP)之平均值、(HP)之平均值、(SP/HP)的平均值及(DB/DPV)的平均值計算出升主動脈之收縮壓及脈壓；以及利用收縮壓及脈壓計算出舒張壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">L1~L9:收縮容積波谷</p>  
        <p type="p">M1~M9:舒張逆向血流容積波峰</p>  
        <p type="p">T1~T9:收縮容積波峰</p>  
        <p type="p">W:升主動脈容積變化訊號波形</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="560" publication-number="202627816"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627816.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體管理方法、記憶體儲存裝置與記憶體控制電路單元</chinese-title>  
        <english-title>MEMORY MANAGEMENT METHOD, MEMORY STORAGE DEVICE AND MEMORY CONTROL CIRCUIT UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250526B">G06F12/0866</main-classification>  
        <further-classification edition="200601120250526B">G06F13/14</further-classification>  
        <further-classification edition="200601120250526B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群聯電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHISON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種記憶體管理方法、記憶體儲存裝置以及記憶體控制電路單元。記憶體管理方法包括：紀錄多個第一實體單元中每一者的隨機讀取計數，其中每個第一實體單元儲存有效資料；啟動資料整併程序；根據隨機讀取計數從第一實體單元中挑選多個來源實體單元；將來源實體單元中的有效資料搬移至目標實體單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention proposes a memory management method, a memory storage device, and a memory control circuit unit. The memory management method includes: recording a random read count for each of first physical units, where each first physical unit stores valid data; initiating a data merging process; selecting multiple source physical units from the first physical units based on the random read counts; and moving the valid data from the source physical units to a target physical unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">701~705:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="561" publication-number="202627627"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627627.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">G02F1/01</main-classification>  
        <further-classification edition="200601120250422B">G02F1/1335</further-classification>  
        <further-classification edition="200601120250422B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王澄光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱敏軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, MIN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭瑋銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括顯示面板、電控相位延遲器與第一偏光片。顯示面板具有顯示面。電控相位延遲器重疊顯示面板的顯示面設置。第一偏光片設置在電控相位延遲器背對顯示面板的一側，且具有第一吸收軸。第一吸收軸的軸向垂直於顯示面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus including a display panel, an electrically controlled phase retarder and a first polarizer is provided. The display panel has a display surface. The electrically controlled phase retarder is disposed overlapping the display surface of the display panel. The first polarizer is disposed on one side of the electrically controlled phase retarder facing way from the display panel, and has a first absorption axis. An axial direction of the first absorption axis is perpendicular to the display surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">100:顯示面板</p>  
        <p type="p">121、122:偏光片</p>  
        <p type="p">140:電控相位延遲器</p>  
        <p type="p">141、142:基板</p>  
        <p type="p">145:液晶層</p>  
        <p type="p">APX1:第一防窺軸向</p>  
        <p type="p">APX2:第二防窺軸向</p>  
        <p type="p">AX1、AX2:吸收軸</p>  
        <p type="p">DS:顯示面</p>  
        <p type="p">L1、L2:光線</p>  
        <p type="p">P1、P2:線偏振態</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="562" publication-number="202626263"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626263.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨墊以及研磨方法</chinese-title>  
        <english-title>POLISHING PAD AND POLISHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250122B">B24B37/24</main-classification>  
        <further-classification edition="201201120250122B">B24B37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智勝科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IV TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林照興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHAO HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳恒毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HENG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂良池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, LIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種研磨墊，包括研磨層，其中：於頻率1.6 Hz下進行的動態黏彈性測定中，所述研磨層在15℃至120℃之溫度範圍內不具有損失係數（tanδ）峰值溫度，且在15℃至120℃之溫度範圍內的tanδ值依照以下式子求出的tanδ值變化率為20%以下， &lt;br/&gt;tanδ值變化率=|(15℃至120℃之溫度範圍內的tanδ之最大值) - (15℃至120℃之溫度範圍內的tanδ之最小值)| / (15℃至120℃之溫度範圍內的tanδ之最大值)×100%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polishing pad including a polishing layer is provided. In a dynamic viscoelasticity measurement that is performed under a frequency of 1.6 Hz, the polishing layer does not have a loss coefficient (tanδ) peak temperature in a temperature range of 15℃ to 120℃. And, a tanδ change rate of a tanδ value in the temperature range of 15℃ to 120℃ is equal to or less than 20% which is obtained from an equation of: &lt;br/&gt;tanδ change rate=|(a maximum value of tan δ in the temperature range of 15℃ to 120℃) - (a minimum value of tan δ in the temperature range of 15℃ to 120℃)| / (the maximum value of tan δ in the temperature range of 15℃ to 120℃)×100%.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="563" publication-number="202626159"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626159.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抓物遊戲機之抓爪</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">A63F9/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊忠波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊忠波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐治民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種抓物遊戲機之抓爪，包含有一驅動本體及若干的夾爪；其中，該驅動本體係與該些夾爪連接，該驅動本體可控制驅動該些夾爪作夾合、鬆開之動作；該夾爪包含有一支撐臂，該支撐臂係與驅動本體連接，該支撐臂外側端穿套有一連接臂，並令該連接臂與該支撐臂間呈直線伸縮式設置，該連接臂不會脫離該支撐臂；該連接臂外側端穿套有一夾持臂，該夾持臂與連接臂間呈直線伸縮式設置，該夾持臂不會脫離該連接臂；令該夾爪可依需求調整伸縮連接臂及夾持臂，且該夾爪可受驅動本體之控制而可作夾合、鬆開之動作；藉此，俾提供一種可依據需求伸縮調整抓爪之爪臂長度，進而可調整抓爪整體尺寸之抓爪結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:夾爪</p>  
        <p type="p">31:支撐臂</p>  
        <p type="p">311:定位元件</p>  
        <p type="p">312:限位孔</p>  
        <p type="p">32:連接臂</p>  
        <p type="p">321:定位槽</p>  
        <p type="p">322:定位元件</p>  
        <p type="p">323:凹槽</p>  
        <p type="p">324:彈簧</p>  
        <p type="p">325:限位件</p>  
        <p type="p">326:限位孔</p>  
        <p type="p">33:夾持臂</p>  
        <p type="p">331:定位槽</p>  
        <p type="p">332:凹槽</p>  
        <p type="p">333:彈簧</p>  
        <p type="p">334:限位件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="564" publication-number="202626279"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626279.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有輔助裝置的接桿工具</chinese-title>  
        <english-title>CONNECTION ROD WITH AUXILIARY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">B25B23/08</main-classification>  
        <further-classification edition="200601120250324B">B25B13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林擇銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSE-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林擇銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSE-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種具有輔助裝置的接桿工具，其包括有一接桿及一輔助裝置。接桿沿一軸線設有相反設置的一銜接端及一驅動端，銜接端與驅動端之間設有一桿部沿著軸線延伸；輔助裝置具有一適配部及一便於手部握持使用的握持部，適配部設置於桿部且能夠沿著軸線任意調整位移。藉此，在作業中工作人員能夠手握輔助裝置，避免手部直接接觸桿部，防止摩擦產生高溫導致受傷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connection rod with auxiliary device includes a connection rod and an auxiliary device. The connection rod has a connecting end and an opposite driving end disposed along an axis, with a rod part extending therebetween along the axis. The auxiliary device has a combination part and a handgrip part for easy handhold. The combination part is disposed on the rod part and allowed to be freely movable thereon along the axis. Thus, the user is able to grip the auxiliary device during operation without the necessity of directly contacting the rod part, thereby preventing injury due to high temperature caused by friction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:接桿工具</p>  
        <p type="p">10:接桿</p>  
        <p type="p">11:銜接端</p>  
        <p type="p">111:銜接孔</p>  
        <p type="p">12:驅動端</p>  
        <p type="p">13:桿部</p>  
        <p type="p">20:輔助裝置</p>  
        <p type="p">21:筒件</p>  
        <p type="p">22:適配部</p>  
        <p type="p">23:握持部</p>  
        <p type="p">L:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="565" publication-number="202628021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>語言學習之教育用品</chinese-title>  
        <english-title>EDUCATIONAL TOOL FOR LANGUAGE LEARNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250126B">G09B19/06</main-classification>  
        <further-classification edition="200601120250126B">G09B1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣雙母語學殿股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SHEPHERD MILINGUALL PALACE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭文乾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, WEN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種語言學習之教育用品。語言學習之教育用品以供使用者使用。語言學習之教育用品包括N個轉盤及中心連接件。其中N個轉盤大小不同，各轉盤上具有複數之單字，其中2＜=N＜=15。其中N個轉盤依序由小至大由中心連接件樞接，使N個轉盤可以各自獨立旋轉；藉由上述之構造，使用者可旋轉N個轉盤，使不同轉盤上之至少一單字可以組成句子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An educational tool for language learning is disclosed. The educational tool for language learning is designed for a user. The educational tool includes N rotating discs and a central connector. The N rotating discs are of different sizes, each disc featuring a multiple of words, where 2 ≤ N ≤ 15. The N rotating discs are sequentially pivoted from smallest to largest by the central connector, allowing the discs to rotate independently. With this structure, the user can rotate the discs, enabling at least one word from different discs to form a sentence.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:語言學習之教育用品</p>  
        <p type="p">11:第一轉盤</p>  
        <p type="p">12:第二轉盤</p>  
        <p type="p">13:第三轉盤</p>  
        <p type="p">20:中心連接件</p>  
        <p type="p">30:單字</p>  
        <p type="p">40:定位標誌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="566" publication-number="202626210"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626210.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴嘴座與風嘴座之分離裝置及其操作方法</chinese-title>  
        <english-title>SEPARATION DEVICE FOR A SPRAY NOZZLE AND AN AIR NOZZLE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250422B">B05B15/14</main-classification>  
        <further-classification edition="201801120250422B">B05B15/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竑騰科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORNG TERNG AUTOMATION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴嘴座與風嘴座之分離裝置及其操作方法，該分離裝置包括一固定座、能轉動地裝設在該固定座上的一驅動轉輪、固設在該固定座的上支撐部的一托座、一頂出件與二夾掣件，該頂出件係能縱向移動地穿設在該固定座及該托座中，該夾掣件係能橫向移動地裝設在該托座上，待分離之該噴嘴座與該風嘴座設於該頂出件的冠部。使用者藉由按壓該二夾掣件來固定該噴嘴座以及轉動該驅動轉輪來推動該風嘴座，便能穩定地推動該風嘴座脫離該噴嘴座，過程中不會摩擦到該風嘴座或該噴嘴座，故不會導致該噴嘴座和該風嘴座產生變形或因刮傷而產生毛邊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a separation device for a spray nozzle and an air nozzle and operation method thereof, and the separation device includes a stationary seat, a driving wheel rotatably mounted on the stationary seat, a supporting seat securely mounted on an upper support of the stationary seat, a pushing element and two holding elements. The pushing element is mounted through the stationary seat and the supporting seat and is longitudinally movable. The holding elements are mounted on the supporting seat and are transversely movably. The spray nozzle and the air nozzle to be separated are mounted on a head of the pushing element. A user pushes the two holding elements to hold the spray nozzle and rotates the driving wheel to push the air nozzle, such that the air nozzle can be stably separated from the spray nozzle. The air nozzle or the spray nozzle would not be rubbed. Accordingly, the spray nozzle and the air nozzle would not be deformed and no burrs would be formed on the spray nozzle and the air nozzle due to scratches.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:固定座</p>  
        <p type="p">11:上支撐部</p>  
        <p type="p">14:下止動部</p>  
        <p type="p">20:驅動轉輪</p>  
        <p type="p">30:托座</p>  
        <p type="p">43:容置槽</p>  
        <p type="p">50:夾掣件</p>  
        <p type="p">51:夾爪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="567" publication-number="202626211"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626211.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴霧閥之噴嘴組件及其正位組裝方法</chinese-title>  
        <english-title>SPRAY NOZZLE ASSEMBLY OF A SPRAY VALVE AND ALIGNMENT ASSEMBLING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250422B">B05B15/68</main-classification>  
        <further-classification edition="201801120250422B">B05B15/65</further-classification>  
        <further-classification edition="201801120250422B">B05B15/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竑騰科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORNG TERNG AUTOMATION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧紹軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHAO-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴霧閥之噴嘴組件及其正位組裝方法，該噴嘴組件包括一噴嘴座與一風嘴座，該噴嘴座具有錐體狀的一對位部，該風嘴座具有錐形的對位槽，當將該噴嘴座置於該風嘴座中，該對位部位在該對位槽內，使該對位槽的內錐面與該對位部的外錐面對應相抵。該噴嘴座與該風嘴座之間無須經由螺紋結構便能相互結合，能有效減少兩者間的間隙與公差，該外錐面和該內錐面則能在組裝時令該噴嘴座自動相對該風嘴座滑動至定位，使該噴嘴座與該風嘴座之間具有高同心度，進而達到後續使用時能均勻噴膠的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a spray nozzle assembly of a spray valve and alignment assembling method thereof, and the spray nozzle assembly includes a spray nozzle and an air nozzle. The spray nozzle has a cone-shaped alignment portion. The air nozzle has a tapered alignment recess. When the spray nozzle is placed in the air nozzle, the alignment portion is disposed in the alignment recess, so that an inner conical surface defined around the alignment recess abuts on an outer conical surface of the alignment portion. The spray nozzle and the air nozzle can be connected with each other without threaded structure, and gap and tolerance therebetween can be reduced. With the inner conical surface and the outer conical surface, the spray nozzle would slide to a pre-determined position, making concentricity between the spray nozzle and the air nozzle high, such that glue can be sprayed evenly during subsequent process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:噴嘴座</p>  
        <p type="p">11:噴嘴冠部</p>  
        <p type="p">12:對位部</p>  
        <p type="p">121:外錐面</p>  
        <p type="p">13:噴霧嘴</p>  
        <p type="p">20:風嘴座</p>  
        <p type="p">21:風嘴本體</p>  
        <p type="p">22:風嘴冠部</p>  
        <p type="p">30:安裝座</p>  
        <p type="p">31:底板</p>  
        <p type="p">311:穿孔</p>  
        <p type="p">32:環側壁</p>  
        <p type="p">41:閥體</p>  
        <p type="p">411:外螺紋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="568" publication-number="202628155"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628155.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>開關控制裝置及其操作方法</chinese-title>  
        <english-title>SWITCH CONTROL DEVICE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H01H13/50</main-classification>  
        <further-classification edition="201601120250418B">H02P29/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑽全實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASSO INDUSTRY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, JYUN-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種開關控制裝置及其操作方法，開關控制裝置包括一扳機開關、一自保持電路及一控制單元，在扳機開關被按壓的情況下，在扳機開關被按壓的情況下，透過控制單元操作使自保持電路停止供電，進而對控制單元的供電來源形成穩定的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A switch control device and an operation method thereof are provided. The switch control device comprises a trigger switch, a self-maintaining circuit, and a control unit. When the trigger switch is pressed, the control unit is operated to stop the self-maintaining circuit to supply power, thereby stabilizing the power source of the control unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:扳機開關</p>  
        <p type="p">3:自保持電路</p>  
        <p type="p">Q1:第一開關</p>  
        <p type="p">Q2:第二開關</p>  
        <p type="p">R:連接電阻</p>  
        <p type="p">4:控制單元</p>  
        <p type="p">41:控制器</p>  
        <p type="p">42:電壓轉換器</p>  
        <p type="p">5:電池</p>  
        <p type="p">6:馬達驅動電路</p>  
        <p type="p">7:馬達</p>  
        <p type="p">P1、P2、P3:節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="569" publication-number="202628213"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628213.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氫燃料電池的機械模組之測試模擬系統及其操作方法</chinese-title>  
        <english-title>TEST SIMULATION SYSTEM OF MECHANICAL MODULES OF A HYDROGEN FUEL CELL AND OPERATION METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250613B">H01M8/04992</main-classification>  
        <further-classification edition="201601120250613B">H01M8/0438</further-classification>  
        <further-classification edition="201601120250613B">H01M8/04746</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾惠君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HUI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖禾溱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, MAN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳加恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用以測試待測幫浦的氫燃料電池的機械模組之測試模擬系統包含氫氣供應器、氫氣循環管路、氫氣旁通管路及控制器。氫氣循環管路透過氫氣輸入管線連通氫氣供應器。氫氣循環管路包含第一氫氣調節閥。待測幫浦設置於第一氫氣調節閥與氫氣輸入管線之間。氫氣旁通管路連通氫氣輸入管線與氫氣循環管路。氫氣旁通管路包含第二氫氣調節閥及設置於第二氫氣調節閥與氫氣輸入管線之間的氫氣幫浦。控制器電性連接並控制第一與第二氫氣調節閥，分別調節進入氫氣循環管路與氫氣旁通管路的氫氣壓降力與氫氣流量，模擬氫燃料電池的氫氣壓降及氫氣消耗量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A test simulation system of mechanical modules of a hydrogen fuel cell is configured to test a pump to be tested. The test simulation system of mechanical modules of a hydrogen fuel cell includes a hydrogen supply, a hydrogen circulation tube, a hydrogen by-pass tube, and a controller. The hydrogen supply is configured to provide hydrogen. The hydrogen circulation tube connects with the hydrogen supply through a hydrogen input tube. The hydrogen circulation tube includes a first hydrogen modulating valve. The pump to be tested is disposed between the first hydrogen modulating valve and the hydrogen input tube. The hydrogen by-pass tube respectively connects the hydrogen input tube and the hydrogen circulation tube. The hydrogen by-pass tube includes a second hydrogen modulating valve and a hydrogen pump. The hydrogen pump is disposed between the second hydrogen modulating valve and the hydrogen input tube. The controller is electrically connected with the first hydrogen modulating valve and the second hydrogen modulating valve and is configured to control the first hydrogen modulating valve to modulate a pressure drop of the hydrogen gas in the hydrogen circulation tube so as to simulate the pressure drop of the hydrogen fuel cell pile. The controller is configured to control the second hydrogen modulating valve to modulate a flow of the hydrogen gas in the hydrogen by-pass tube to simulate the hydrogen consuming quantity of the hydrogen fuel cell pile.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:氫燃料電池的機械模組之測試模擬系統</p>  
        <p type="p">110:氫氣供應器</p>  
        <p type="p">112:氫氣輸入管線</p>  
        <p type="p">126:第一閥門</p>  
        <p type="p">120:氫氣循環管路</p>  
        <p type="p">122:第一氫氣調節閥</p>  
        <p type="p">124:待測幫浦</p>  
        <p type="p">130:氫氣旁通管路</p>  
        <p type="p">132:第二氫氣調節閥</p>  
        <p type="p">134:氫氣幫浦</p>  
        <p type="p">136:第二閥門</p>  
        <p type="p">140:控制器</p>  
        <p type="p">A1,A2:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="570" publication-number="202627110"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627110.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具球狀碳化物組織之鋼材及其製造方法</chinese-title>  
        <english-title>STEEL WITH SPHERICAL CARBIDE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">C21D1/00</main-classification>  
        <further-classification edition="200601120251105B">C21D1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王元聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUAN-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種具球狀碳化物組織之鋼材的製造方法，包含：將熱軋後之待處理鋼材再直接進行熱處理，該待處理鋼材包含碳、矽、錳、磷、硫、鉻及鉬等成分，並且該熱處理包含以下步驟：使該待處理鋼材在（A &lt;sub&gt;C1&lt;/sub&gt;-5）℃至（A &lt;sub&gt;C1&lt;/sub&gt;-120）℃下持溫0.1至3小時，其中A &lt;sub&gt;C1&lt;/sub&gt;為鋼材相變態溫度；以1至5 ℃/s之速率對該待處理鋼材加熱至（A &lt;sub&gt;C1&lt;/sub&gt;+5）℃至（A &lt;sub&gt;C1&lt;/sub&gt;+50）℃，並且持溫1至5小時；以及以-1至-15 ℃/s之速率將該待處理鋼材降溫至（A &lt;sub&gt;C1&lt;/sub&gt;-5）℃至（A &lt;sub&gt;C1&lt;/sub&gt;-60）℃，以獲得具有球狀碳化物組織之鋼材。本發明還公開了一種具球狀碳化物組織之鋼材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing steel with spherical carbide structure is disclosed by the present disclosure. The method comprises a step of directly conducting a heat treatment for a hot-rolled steel. The steel comprises components such as carbon, silicon, manganese, phosphorus, sulfur, chromium, and molybdenum, and the heat treatment comprises the following steps: maintaining the steel at a temperature of (A &lt;sub&gt;C1&lt;/sub&gt;-5) ℃ to (A &lt;sub&gt;C1&lt;/sub&gt;-120) ℃ for 0.1 to 3 hours, where A &lt;sub&gt;C1&lt;/sub&gt;is a phase transition temperature of the steel; heating the steel to a temperature of (A &lt;sub&gt;C1&lt;/sub&gt;+5) ℃ to (A &lt;sub&gt;C1&lt;/sub&gt;+50) ℃ at a rate of 1 to 5 ℃/s, and maintaining the temperature for 1 to 5 hours; and cooling the steel to a temperature of (AC1-5) ℃ to (AC1-60) ℃ at a rate of -1 to -15 ℃/s, so as to obtain a steel with spherical carbide structure. A steel with spherical carbide structure is further disclosed by the present disclosure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10至S50:具球狀碳化物組織之鋼材的製造方法的步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="571" publication-number="202628718"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628718.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>孤島基板結構、及其製成的電子裝置、燈條、及其製造方法</chinese-title>  
        <english-title>AN ISOLATED CIRCUIT BOARD, AN ELECTRONIC DEVICE AND LIGHT STRIP MADE THEREOF, AND METHOD FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250512B">H10H20/819</main-classification>  
        <further-classification edition="202501120250512B">H10H20/858</further-classification>  
        <further-classification edition="202501120250512B">H10H29/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福思材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VECTOR FLUX TECHNOLOGY CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李坤錐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUN-CHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鼎為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李欣樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHIN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豫宛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種孤島基板結構，包括一金屬層結構、以及一設置在該金屬層結構的一面上的介電層結構。該金屬層結構係包括複數個孤立且相互絕緣的金屬層單元。該介電層結構係非完全覆蓋的連接於每一該金屬層單元的該一面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an isolated circuit board structure, which comprises a metal layer structure and a dielectric layer structure disposed on one side of the metal layer structure. The metal layer structure comprises multiple isolated and mutually insulated metal layer units. The dielectric layer structure is partially connected to one side of each metal layer unit. &lt;br/&gt;​</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:孤島基板結構</p>  
        <p type="p">10:金屬層結構</p>  
        <p type="p">11:金屬層單元</p>  
        <p type="p">111:第一裸露面</p>  
        <p type="p">112:第二裸露面</p>  
        <p type="p">113:覆蓋區</p>  
        <p type="p">20:介電層結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="572" publication-number="202625942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燈條及包括該燈條的裝飾製品</chinese-title>  
        <english-title>LIGHT STRING AND ORNAMENTAL ARTICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250917B">A47G33/06</main-classification>  
        <further-classification edition="200601120250917B">A47G33/08</further-classification>  
        <further-classification edition="200601120250917B">F21V33/00</further-classification>  
        <further-classification edition="201501120250917B">F21V23/00</further-classification>  
        <further-classification edition="200601120250917B">F21V23/06</further-classification>  
        <further-classification edition="200601120250917B">F21V19/00</further-classification>  
        <further-classification edition="201601120250917B">F21S4/10</further-classification>  
        <further-classification edition="200601320250917B">F21W121/04</further-classification>  
        <further-classification edition="201601320250917B">F21Y115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳信衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳信衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSIN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種燈條及包括該燈條的裝飾製品。該裝飾製品包括支撐結構、連接至該支撐結構的多個針葉以及燈條。該燈條包括固定至該等針葉上的柔性導線以及多個光源。每個光源都包括至少兩個電連結至該柔性導線之引線。配置在該裝飾製品不同高度處的光源之引線包括不同長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure proposes an article, which includes a support structure, a plurality of needles connected to the support structure, and a light string. The light string includes a flexible conductive wire affixed to the needles and a plurality of light sources. Each of the light sources includes at least two leads electrically coupled to the flexible conductive wire. The leads of the light sources arranged at different heights of the article include different lengths.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:製品</p>  
        <p type="p">102:主體</p>  
        <p type="p">104:基座</p>  
        <p type="p">110:支撐結構</p>  
        <p type="p">112:針葉</p>  
        <p type="p">116:表面</p>  
        <p type="p">120:燈條</p>  
        <p type="p">122:柔性導線</p>  
        <p type="p">124:光源</p>  
        <p type="p">126:連接器</p>  
        <p type="p">130:電池</p>  
        <p type="p">140:電源插座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="573" publication-number="202628366"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628366.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘極驅動控制電路及元件</chinese-title>  
        <english-title>GATE DRIVE CONTROL CIRCUITRY AND COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250509B">H03K17/687</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>即思創意股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAST SIC SEMICONDUCTOR INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許甫任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏誠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHENG-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪湘婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, HSIANG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閘極驅動控制電路，包括一場效電晶體、一驅動器及一電路。該場效電晶體包括一閘極端、一汲極端及一源極端。該驅動器包括一被配置為從一控制器接收一輸入電壓的輸入端、一連接到該場效電晶體的該閘極端的輸出端、一連接到該場效電晶體的該源極端的接地端及一電源端。該電路被結構化以通過該驅動器的該電源端向該驅動器提供一電源。其中，該電路連接至一位於該汲極端與一汲極接腳之間的第一路徑及一位於該輸入端與該控制器之間的第二路徑的至少一個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gate drive control circuitry comprises a field-effect transistor, a driver, and a circuit. The field-effect transistor includes a gate terminal, a drain terminal, and a source terminal. The driver includes an input terminal configured to receive an input voltage from a controller, an output terminal connected to the gate terminal of the field-effect transistor, a ground terminal connected to the source terminal of the field-effect transistor, and a power supply terminal. The circuit is structured to supply a power to the driver through the power supply terminal of the driver, wherein the circuit is connected to at least one of a first path between the drain terminal and a drain pin and a second path between the input terminal and the controller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1’:半導體晶片</p>  
        <p type="p">1:開關電路</p>  
        <p type="p">1a:汲極接腳</p>  
        <p type="p">1b:輸入接腳</p>  
        <p type="p">1c:源極接腳</p>  
        <p type="p">1d:第一電流路徑</p>  
        <p type="p">1e:第二電流路徑</p>  
        <p type="p">10:開關元件</p>  
        <p type="p">10a:汲極端</p>  
        <p type="p">10b:源極端</p>  
        <p type="p">10c:閘極端</p>  
        <p type="p">20:閘極驅動電路</p>  
        <p type="p">21:閘極驅動器</p>  
        <p type="p">21a:輸入端</p>  
        <p type="p">21b:輸出端</p>  
        <p type="p">21c:電源端</p>  
        <p type="p">21d:接地端</p>  
        <p type="p">30:功率轉換電路</p>  
        <p type="p">31:第一電源提取電路</p>  
        <p type="p">32:第二電源提取電路</p>  
        <p type="p">33:電壓調節器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="574" publication-number="202627599"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627599.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150755</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學攝像透鏡組、成像裝置及電子裝置</chinese-title>  
        <english-title>OPTICAL IMAGING LENS, IMAGING DEVICE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">G02B11/32</main-classification>  
        <further-classification edition="202101120250402B">G02B7/02</further-classification>  
        <further-classification edition="200601120250402B">G02B3/00</further-classification>  
        <further-classification edition="202101120250402B">G03B17/12</further-classification>  
        <further-classification edition="202101120250402B">G03B17/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紘立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETERGE OPTO-ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中揚光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG YANG TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祖孟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TSU-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯家儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHIA YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡、第二透鏡、光圈、第三透鏡、第四透鏡、第五透鏡及第六透鏡；該光學攝像透鏡組，由物側至像側依序包含一第一透鏡，具有負屈折力，其物側面為凸面，其像側面為凹面；一第二透鏡，具有正屈折力，其物側面為凸面，其像側面為凸面；一光圈；一第三透鏡，具有正屈折力，其物側面為凹面，其像側面為凸面；一第四透鏡，具有負屈折力，其物側面為凹面，其像側面為凹面；一第五透鏡，具有正屈折力，其物側面為凸面，其像側面為凸面；一第六透鏡，具有負屈折力，其物側面為凸面，其像側面為凹面；其中，該光學攝像透鏡組之透鏡總數為六片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens including a first lens element, a second lens element, an aperture, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element arranged in sequence from an object side to an image side along an optical axis is provided. The optical imaging lenses include, from an object side to an image side, the first lens having negative refractive power and including an object-side surface being convex and an image-side surface being concave, the second lens having positive refractive power and including an object-side surface being convex and an image-side surface being convex, the aperture, the third lens having positive refractive power and including an object-side surface being concave and an image-side surface being convex, the forth lens having negative refractive power and including an object-side surface being concave and an image-side surface being concave, the fifth lens having positive refractive power and including an object-side surface being concvex and an image-side surface being convex, and the sixth lens having negative refractive power and including an object-side surface being concvex and an image-side surface being concave. The optical imaging lenses include a total of six elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學攝像透鏡組</p>  
        <p type="p">11:第一透鏡</p>  
        <p type="p">12:第二透鏡</p>  
        <p type="p">13:第三透鏡</p>  
        <p type="p">14:第四透鏡</p>  
        <p type="p">15:第五透鏡</p>  
        <p type="p">16:第六透鏡</p>  
        <p type="p">17:濾光元件</p>  
        <p type="p">18:保護玻璃</p>  
        <p type="p">101:成像面</p>  
        <p type="p">11a:第一透鏡之物側面</p>  
        <p type="p">11b:第一透鏡之像側面</p>  
        <p type="p">12a:第二透鏡之物側面</p>  
        <p type="p">12b:第二透鏡之像側面</p>  
        <p type="p">13a:第三透鏡之物側面</p>  
        <p type="p">13b:第三透鏡之像側面</p>  
        <p type="p">14a:第四透鏡之物側面</p>  
        <p type="p">14b:第四透鏡之像側面</p>  
        <p type="p">15a:第五透鏡之物側面</p>  
        <p type="p">15b:第五透鏡之像側面</p>  
        <p type="p">16a:第六透鏡之物側面</p>  
        <p type="p">16b:第六透鏡之像側面</p>  
        <p type="p">17a、17b:濾光元件之二表面</p>  
        <p type="p">18a、18b:保護玻璃之二表面</p>  
        <p type="p">102:影像感測元件</p>  
        <p type="p">I:光軸</p>  
        <p type="p">ST:光圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="575" publication-number="202628135"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628135.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150763</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電裝置及液冷電纜組件</chinese-title>  
        <english-title>CHARGING DEVICE AND LIQUID COOLED CABLE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250226B">H01B7/42</main-classification>  
        <further-classification edition="201901120250226B">B60L53/302</further-classification>  
        <further-classification edition="201901120250226B">B60L53/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華新麗華股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALSIN LIHWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王詩翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古詣帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, YI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林端毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DUAN-YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王詩瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種充電裝置及液冷電纜組件，液冷電纜組件包含液冷電纜及充電槍。液冷電纜包含第一絕緣管體、第二絕緣管體、包帶、線體及披覆體。第一絕緣管體具有第一通道。第二絕緣管體包含絕緣層、第二通道、電源導體及隔離件。隔離件設於電源導體外。包帶包覆第一絕緣管體及第二絕緣管體。線體位於包帶內。披覆體包覆包帶。充電槍包含槍接頭，槍接頭包含第一水套、第一接頭部、第一套筒部及第一端子部。第一水套包含第一連通空間、第二連通空間與槍連通道。第一接頭部連接於第一水套。第一套筒部連接於第一水套。第一端子部連接於第一水套。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Charging Device And Liquid Cooled Cable Assembly. The liquid cooled cable assembly includes a liquid cooled cable and a charging gun. The liquid cooled cable includes a first insulating tube, a second insulating tube, a taping, a line body, and a covering body. The first insulating tube includes a first channel. The second insulating tube includes an insulating layer, a second channel, a power conductor, and a spacer. The spacer is disposed around the power conductor. The taping wraps the first insulating tube and the second insulating tube. The line body is located inside the taping. The covering body wraps the taping. The charging gun includes a gun connector. The gun connector comprises a first water jacket, a first connector portion, a first sleeve portion, and a first terminal portion. The first water jacket includes a first connected space, a second connected space, and a gun connected channel. The first connector portion is connected to the first water jacket. The first sleeve portion is connected to the first water jacket. The first terminal portion is connected to the first water jacket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:第一絕緣管體</p>  
        <p type="p">140:第二絕緣管體</p>  
        <p type="p">141:絕緣層</p>  
        <p type="p">142:電源導體</p>  
        <p type="p">143:隔離件</p>  
        <p type="p">210:槍接頭</p>  
        <p type="p">211:第一水套</p>  
        <p type="p">211a:第一連通空間</p>  
        <p type="p">211b:第二連通空間</p>  
        <p type="p">211c1:第一開口</p>  
        <p type="p">212:第一接頭部</p>  
        <p type="p">213:第一套筒部</p>  
        <p type="p">213a:第一凸緣</p>  
        <p type="p">214:第一端子部</p>  
        <p type="p">215:第一密封件</p>  
        <p type="p">216:第一防水環墊</p>  
        <p type="p">217:第一背托環</p>  
        <p type="p">218a:第二防水環</p>  
        <p type="p">218b:第二防水環</p>  
        <p type="p">219:第一C形扣環</p>  
        <p type="p">219a:第一缺口</p>  
        <p type="p">220:第一防水環</p>  
        <p type="p">221:第一替換帽蓋</p>  
        <p type="p">222:簧片</p>  
        <p type="p">d:絞距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="576" publication-number="202628022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>語言發音教育物品</chinese-title>  
        <english-title>LANGUAGE PRONUNCIATION EDUCATIONAL OBJECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">G09B19/06</main-classification>  
        <further-classification edition="200601120250402B">G09B19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣雙母語學殿股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SHEPHERD MILINGUALL PALACE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭文乾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, WEN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">語言發音教育物品包括N個轉盤和一中心連接件。N個轉盤大小不同，各轉盤上具有複數之發音符號，其中2＜=N＜=15。N個轉盤依序由小至大由中心連接件樞接，使N個轉盤可以各自獨立旋轉。藉由上述之構造，一學習者可旋轉N個轉盤，使得不同轉盤上之其中一發音符號彼此對齊而組成一音節發音順序，以引導學習者根據音節發音順序發音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A language pronunciation educational object includes N turntables and a central connecting unit. The N turntables have different sizes, and each turntable has a plurality of pronunciation symbols, wherein 2＜=N＜=15. The N turntables are pivotally connected by the central connecting unit in order from small to large, such that the N turntables can rotate respectively. Via the abovementioned structure, a learner can rotate the N turntables, such that one of the pronunciation symbols on different turntables can be aligned with each other to form a syllable pronunciation sequence, to guide the learner to pronounce according to the syllable pronunciation sequence.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:語言發音教育物品</p>  
        <p type="p">11:第一轉盤</p>  
        <p type="p">12:第二轉盤</p>  
        <p type="p">13:第三轉盤</p>  
        <p type="p">20:中心連接件</p>  
        <p type="p">30:發音符號</p>  
        <p type="p">40、40a、40b:定位標誌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="577" publication-number="202627909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150766</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>營業單位法令遵循及業務評核分數管理系統與方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR MANAGING BUSINESS UNIT REGULATION COMPLIANCE AND PAY-FOR-PERFORMANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250109B">G06Q10/06</main-classification>  
        <further-classification edition="202301120250109B">G06Q40/00</further-classification>  
        <further-classification edition="201201120250109B">G06Q50/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何柏霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, BO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種營業單位法令遵循及業務評核分數管理系統，包含評分規則資料庫以及與評分規則資料庫連接的處理器。處理器包含比對模組、連接至比對模組的權重核算模組、連接至權重核算模組的評分模組，以及連接至評分模組的評分報告產出模組。比對模組設置以將營業單位稽核報表與評分規則進行比對以得到關鍵字數量並傳送至權重核算模組進行判定以得到關鍵字權重分，權重核算模組基於關鍵字權重分決定是否將營業單位稽核報表所對應的評分規則傳送至評分模組，以使評分報告產出模組產出包含營業單位稽核報表所對應的該評分規則的評分報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for managing business unit regulation compliance and pay-for-performance includes a scoring rule database and a processor connecting to the scoring rule database. The processor includes a comparison module, a weighting module connecting to the comparison module, a scoring module connecting to the weighting module, and a scoring report generating module connecting to the scoring module. The comparison module is configured to compare a business unit audit data with the scoring rules to obtain a keyword count. The keyword count is sent to the weighting module to obtain a keyword weighting score. The weighting module decide whether to send a corresponding scoring rule of the business unit audit data to the scoring module based on the keyword weighting score. The scoring report generating module is configured to generate a scoring report that includes corresponding scoring rule of the business unit audit data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:營業單位法令遵循及業務評核分數管理系統</p>  
        <p type="p">101:處理器</p>  
        <p type="p">110:法規命令資料庫</p>  
        <p type="p">112:法規命令匯入端</p>  
        <p type="p">114:分類模組</p>  
        <p type="p">120:評分規則資料庫</p>  
        <p type="p">122:評分規則匯入端</p>  
        <p type="p">124:提取模組</p>  
        <p type="p">126:套用模組</p>  
        <p type="p">128:標記模組</p>  
        <p type="p">130:比對模組</p>  
        <p type="p">140:權重核算模組</p>  
        <p type="p">150:評分模組</p>  
        <p type="p">160:評分報告產出模組</p>  
        <p type="p">170:營業單位稽核報表匯入端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="578" publication-number="202625962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150770</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>穿戴式生理訊號感測系統</chinese-title>  
        <english-title>WEARABLE SENSING SYSTEM FOR DETECTING PHYSIOLOGICAL SIGNALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250425B">A61B5/02</main-classification>  
        <further-classification edition="202101120250425B">A61B5/256</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽響先創科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECENTRALIZED BIOTECHNOLOGY INTELLIGENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周耀聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YAO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孝義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜林毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, LIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇偉盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周研瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YEN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種穿戴式生理訊號感測系統，包括一系統電路板，具有上、下表面，一聽診器設置於下表面，用於感測使用者的心音訊號，複數個心電電極設置於下表面且鄰近聽診器，用於感測使用者的心電訊號，一血氧計，設置於上表面，用於感測使用者的血氧濃度及脈搏波訊號。上述系統電路板，電性連接聽診器、複數個心電電極以及血氧計，上述系統電路板透過比對上述心電訊號與上述脈搏波訊號或是比對上述心音訊號與上述脈搏波訊號，獲得使用者的脈搏波傳遞時間，並據以推算使用者的連續性血壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a wearable sensing system for detecting physiological signals, which includes a system circuit board with upper and lower surfaces, a stethoscope disposed on the lower surface for sensing the user's heart sound signal, and a plurality of electrocardiographic electrodes disposed on the lower surface and adjacent to the stethoscope used to sense the user's ECG signal, and an oximeter disposed on the upper surface to sense the user's blood oxygen concentration and pulse wave signal. The system circuit board is electrically connected to the stethoscope, the plurality of ECG electrodes and the oximeter. The system circuit board obtains the user's pulse transit time (PPT) by comparing the ECG signal with the pulse wave signal or by comparing the heart sound signal with the pulse wave signal. The PPT is used to calculate the user's continuous blood pressure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:使用者</p>  
        <p type="p">300:穿戴式生理訊號感測系統</p>  
        <p type="p">301:電路板</p>  
        <p type="p">301a:第一表面</p>  
        <p type="p">301b:第二表面</p>  
        <p type="p">302:聽診器</p>  
        <p type="p">302a:振膜</p>  
        <p type="p">302b:膠框(隔音環)</p>  
        <p type="p">302c:壓電感測器</p>  
        <p type="p">304:複數個心電貼片</p>  
        <p type="p">306:血氧計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="579" publication-number="202627371"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627371.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行動式製冷設備及其電源供應系統</chinese-title>  
        <english-title>MOBILE REFRIGERATION APPARATUS AND ITS POWER SUPPLY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">F25D3/08</main-classification>  
        <further-classification edition="200601120260302B">F25D11/00</further-classification>  
        <further-classification edition="200601120260302B">F25D23/00</further-classification>  
        <further-classification edition="200601120260302B">H02J7/34</further-classification>  
        <further-classification edition="202601120260302B">H02J7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADATA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江在民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TSAI MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江昱承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種行動式製冷設備及其電源供應系統。其中，電源供應系統包括一電源轉換單元、一隔離單元、一控制單元以及一主電源供應單元。電源轉換單元用於將由一交流輸入端輸入的一交流電轉換為一直流電而由一直流輸出端輸出。隔離單元具有電氣隔離之一輸入端及多個輸出端，並用於將直流電傳輸至該些輸出端。控制單元係與隔離單元電性連接，以控制輸入端的直流電以電磁耦合的方式傳輸至該些輸出端。主電源供應單元係分別與一可充電電池及該隔離單元之該些輸出端之一第一輸出端電性連接，並輸出一升壓電源對含鋰金屬之可充電電池供電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mobile refrigeration apparatus and its power supply system are disclosed. The power supply system includes a power conversion unit, an isolation unit, a control unit, and a main power supply unit. The power conversion unit is to convert AC power input from an AC input terminal into DC power and output it from a DC output terminal. The isolation unit has an electrically isolated input terminal and multiple output terminals, and it is used to transmit DC power to these output terminals. The control unit is electrically connected to the isolation unit to control the transmission of DC power from the input terminal to the output terminals via electromagnetic coupling. The main power supply unit is electrically connected to a rechargeable battery and one of the output terminals of the isolation unit, and it outputs a boosted power supply to charge the rechargeable battery containing lithium metal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電源供應系統</p>  
        <p type="p">211:電源轉換單元</p>  
        <p type="p">211a:交流輸入端</p>  
        <p type="p">211b:直流輸出端</p>  
        <p type="p">212:隔離單元</p>  
        <p type="p">212a:輸入端</p>  
        <p type="p">212b:第一輸出端</p>  
        <p type="p">212c:第二輸出端</p>  
        <p type="p">212d:第三輸出端</p>  
        <p type="p">212e:第四輸出端</p>  
        <p type="p">213:控制單元</p>  
        <p type="p">214:主電源供應單元</p>  
        <p type="p">215:輔助電源供應單元</p>  
        <p type="p">216:迴授單元</p>  
        <p type="p">217:過壓保護單元</p>  
        <p type="p">218:啟動單元</p>  
        <p type="p">219:浪湧吸收單元</p>  
        <p type="p">220:狀態檢測單元</p>  
        <p type="p">221:關斷單元</p>  
        <p type="p">222:屏蔽單元</p>  
        <p type="p">400:可充電電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="580" publication-number="202627914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧物流排程系統</chinese-title>  
        <english-title>INTELLIGENT LOGISTICS SCHEDULING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250109B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250109B">G06Q10/047</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADATA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑜婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡毓軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭軍緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, JUN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧物流排程系統，包括：數據收集與分析模組，用以收集歷史配送數據與配送環境數據，及分析歷史配送數據與配送環境數據以產生配送趨勢參數；自動排程模組，用以根據配送趨勢參數以產生每一車輛的個別配送計畫；路線優化模組，用以根據每一車輛的個別配送計畫以產生每一車輛的配送路線與訂單配送順序；即時監控與調整模組，用以追蹤每一車輛的位置、配送進度與路況變化以動態調整每一車輛的配送路線；導出結果模組，用以根據每一車輛的配送路線以導出所有車輛的最終排程方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent logistics scheduling system is provided, which includes: a data collection and analysis module for collecting historical delivery data and delivery environment data, and analyzing the historical delivery data and the delivery environment data to generate delivery trend parameters; an automatic scheduling module for generating an individual delivery plan of each vehicle based on the delivery trend parameters; a route optimization module for generating a delivery route and an order delivery sequence of each vehicle based on the individual delivery plan of each vehicle; a real-time monitoring and adjustment module for tracking a location, a delivery progress and road condition changes of each vehicle to dynamically adjust a delivery route of each vehicle; and an export result module for deriving a final schedule plan of all vehicles based on the delivery route of each vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:智慧物流排程系統</p>  
        <p type="p">2:數據收集與分析模組</p>  
        <p type="p">3:自動排程模組</p>  
        <p type="p">4:路線優化模組</p>  
        <p type="p">5:即時監控與調整模組</p>  
        <p type="p">6:導出結果模組</p>  
        <p type="p">7:數據庫</p>  
        <p type="p">8:通訊模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="581" publication-number="202627973"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627973.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150773</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧化碳排放量計算系統</chinese-title>  
        <english-title>INTELLIGENT CARBON EMISSION CALCULATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250204B">G06Q50/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADATA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡毓軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, POCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧化碳排放量計算系統，包括車載數據收集模組、環境數據擷取模組、充電站數據收集模組、數據融合處理模組、碳排放量計算模組、碳排放量優化建議模組，其中車載數據收集模組收集車輛即時運行數據、環境數據擷取模組獲取運行路線環境數據、充電站數據收集模組收集充電站電網數據、數據融合處理模組處理車輛即時運行數據、運行路線環境數據、與充電站電網數據以獲取融合數據、碳排放量計算模組輸入融合數據至碳排放量預測模型以產生計算結果、碳排放量優化建議模組根據碳排放量預測模型的計算結果以產生優化建議。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent carbon emission calculation system is provided, which includes a vehicle data collection module, an environmental data acquisition module, a charging station data collection module, a data fusion processing module, a carbon emission calculation module, and a carbon emission optimization suggestion module, wherein the vehicle data collection module collects real-time vehicle operation data, the environmental data acquisition module obtains operating route environmental data, the charging station data collection module collects charging station power grid data, the data fusion processing module processes the real-time vehicle operation data, operating route environment data, and charging station power grid data to obtain fused data, the carbon emission calculation module inputs the fusion data into the carbon emission prediction model to generate calculation results, and the carbon emission optimization suggestion module generates optimization suggestions based on the calculation results of the carbon emission prediction model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:智慧化碳排放量計算系統</p>  
        <p type="p">2:車載數據收集模組</p>  
        <p type="p">3:環境數據擷取模組</p>  
        <p type="p">4:充電站數據收集模組</p>  
        <p type="p">5:數據融合處理模組</p>  
        <p type="p">6:碳排放量計算模組</p>  
        <p type="p">7:碳排放量優化建議模組</p>  
        <p type="p">8:數據庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="582" publication-number="202627967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧減碳系統及智慧減碳方法</chinese-title>  
        <english-title>INTELLIGENT CARBON REDUCTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250126B">G06Q50/06</main-classification>  
        <further-classification edition="202301120250126B">G06Q10/04</further-classification>  
        <further-classification edition="202301120250126B">G06Q10/0631</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADATA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡毓軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, POCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開智慧減碳系統及方法，其應用於通過多個交通載具配送物品。減碳系統包含轉運策略模組、碳排分析模組、路徑規劃模組、智慧裝載模組及整合模組。轉運策略模組根據配送需求決定多個交通載具的使用比率。碳排分析模組分析行駛行為和碳排放的關係，產生碳排因子資料。行駛行為包括駕駛習慣、駕駛模式、載具能耗資料及路徑資料。路徑規劃模組根據交通資料和空氣品質資料生成交通路徑，並關聯於碳排放數據。智慧裝載模組根據物品資訊生成配送資料。整合模組根據載具使用比率、碳排因子資料、交通路徑及配送資料產生調度資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses an intelligent carbon reduction system and method, which is applied to the distribution of objects through multiple transportation vehicles. The carbon reduction system includes a transportation strategy module, a carbon emission analysis module, a route planning module, an intelligent loading module, and an integration module. The transportation strategy module determines the usage ratio of multiple transportation vehicles according to the distribution needs. The carbon emission analysis module analyzes the relationship between driving behavior and carbon emissions to generate carbon emission factor data. The driving behavior includes driving habits, driving modes, vehicle energy consumption data, and route data. The route planning module generates transportation routes based on traffic data and air quality data, and associates them with carbon emission data. The intelligent loading module generates distribution data according to the item information. The integration module generates scheduling data based on the vehicle usage ratio, carbon emission factor data, the route with the lowest carbon emissions, and the distribution data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:智慧減碳系統</p>  
        <p type="p">110:轉運策略模組</p>  
        <p type="p">120:碳排分析模組</p>  
        <p type="p">130:路徑規劃模組</p>  
        <p type="p">140:智慧裝載模組</p>  
        <p type="p">150:整合模組</p>  
        <p type="p">160:動態調度模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="583" publication-number="202626583"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626583.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離型膜及氧化物固態電解質膜</chinese-title>  
        <english-title>RELEASE FILM AND OXIDE SOLID ELECTROLYTE MEMBRANE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250326B">C07C69/15</main-classification>  
        <further-classification edition="200601120250326B">C08J5/18</further-classification>  
        <further-classification edition="201801120250326B">C09J7/20</further-classification>  
        <further-classification edition="201801120250326B">C09J7/25</further-classification>  
        <further-classification edition="201001120250326B">H01M10/0562</further-classification>  
        <further-classification edition="201901120250326B">B32B7/06</further-classification>  
        <further-classification edition="200601120250326B">B32B27/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芯量科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLIDEDGE SOLUTION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高敬凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, JING-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曾隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TSENG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種氧化物固態電解質膜之離型膜，所述離型膜包括一離型基材層以及塗佈在所述離型基材層表面的EVA官能化塗層， 所述EVA官能化塗層的醋酸乙烯酯含量介於10%~50%之間。另外，本發明還提供一種氧化物固態電解質膜，所述氧化物固態電解質膜包括如上所述的固態電解質膜之離型膜、氧化物固態電解質膜體以及載材，所述氧化物固態電解質膜體位於所述離型膜與所述載材之間，所述離型膜通過所述EVA官能化塗層貼合於所述氧化物固態電解質膜體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a release film of an oxide solid electrolyte membrane. The release film includes a release substrate layer and an EVA functional coating coated on the surface of the release substrate layer. The vinyl acetate content of the EVA functional coating ranges from 10% to 50%. In addition, the present invention also provides an oxide solid electrolyte membrane. The oxide solid electrolyte membrane includes the release film of the solid electrolyte membrane as described above, an oxide solid electrolyte membrane body and a carrier material. The membrane body is located between the release film and the carrier material, and the release film is impregnated with the oxide solid electrolyte membrane body through the EVA functional coating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:氧化物固態電解質膜之離型膜</p>  
        <p type="p">301:離型基材層</p>  
        <p type="p">302:EVA官能化塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="584" publication-number="202628156"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628156.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>開關裝置</chinese-title>  
        <english-title>SWITCH DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">H01H13/705</main-classification>  
        <further-classification edition="200601120250123B">H03K17/969</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康忠輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHUNGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔志國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUI, CHIHKUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑞玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康忠輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHUNGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔志國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUI, CHIHKUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑞玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種開關裝置包含下蓋、上蓋、滑動件、至少一彈性件以及高阻抗導電板。下蓋設置於電路板上。上蓋設置於下蓋上。上蓋以及下蓋形成容置空間。滑動件穿過上蓋並配置以沿著一方向相對於上蓋滑動。至少一彈性件位於容置空間中。高阻抗導電板連接至少一彈性件之一端。高阻抗導電板接受來自滑動件之按壓力而產生形變。形變致使高阻抗導電板之電阻值變化。高阻抗導電板響應於形變產生開關訊號。形變與高阻抗導電板之電阻值相關聯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A switch device includes a lower cover, an upper cover, a sliding part, at least one elastic part, and a high resistance conductive plate. The lower cover is disposed on a circuit board. The upper cover is disposed on the lower cover. The upper cover and the lower cover form an accommodating space. The sliding part passes through the upper cover and is configured to slide relative to the upper cover along a direction. The at least one elastic part is located in the accommodating space. The high resistance conductive plate is connected to an end of the at least one elastic part. The high resistance conductive plate receives a pressing force from the sliding part and generates a deformation. The deformation enables a resistance value of the high resistance conductive plate to vary. The high resistance conductive plate generates a switch signal in response to the deformation. The deformation is related to the resistance value of the high resistance conductive plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:開關裝置</p>  
        <p type="p">110:下蓋</p>  
        <p type="p">120A,120B:彈性件</p>  
        <p type="p">130:高阻抗導電板</p>  
        <p type="p">130a,Pa:頂面</p>  
        <p type="p">130b:底面</p>  
        <p type="p">140:滑動件</p>  
        <p type="p">142:按壓部</p>  
        <p type="p">144:抵靠部</p>  
        <p type="p">150:上蓋</p>  
        <p type="p">AS:容置空間</p>  
        <p type="p">H:開孔</p>  
        <p type="p">OP:開口</p>  
        <p type="p">PCB1:電路板</p>  
        <p type="p">TH:通孔</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="585" publication-number="202627628"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627628.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150784</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250917B">G02F1/01</main-classification>  
        <further-classification edition="200601120250917B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙建閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, CHIEN-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包含：一可切換的光調變元件，包含：一光調變結構，包含一光調變層以及用於驅動該光調變層的一電極；以及一振動元件，鄰近該光調變結構的至少一側設置；其中，該振動元件於驅動下用以擾動該光調變層，且該振動元件與該電極之間間隔至少一絕緣材料以使彼此電性絕緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided, which comprises: a switchable light modulation element comprising: a light modulation structure comprising a light modulation layer and an electrode for driving the light modulation layer; and a vibration element disposed adjacent to at least one side of the light modulation structure; wherein the vibration element is used to disturb the light modulation layer when driven, and at least one insulating material is spaced between the vibration element and the electrode to electrically insulate each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可切換的光調變元件</p>  
        <p type="p">1:光調變結構</p>  
        <p type="p">11:光調變層</p>  
        <p type="p">12:第一電極</p>  
        <p type="p">13:第二電極</p>  
        <p type="p">14:第一配向層</p>  
        <p type="p">15:第二配向層</p>  
        <p type="p">2:振動元件</p>  
        <p type="p">31:絕緣層</p>  
        <p type="p">41:第一基板</p>  
        <p type="p">42:第二基板</p>  
        <p type="p">200:控制系統</p>  
        <p type="p">201:調光系統</p>  
        <p type="p">202:振動系統</p>  
        <p type="p">C:電路板</p>  
        <p type="p">W:導線</p>  
        <p type="p">X、Y:方向</p>  
        <p type="p">Z:俯視方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="586" publication-number="202627645"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627645.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">G02F1/137</main-classification>  
        <further-classification edition="201901120250926B">G02F1/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚怡安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, I-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIUNN-SHYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李為政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種電子裝置，包括：一反射式面板，具有彼此相對的一第一側與一第二側；一穿透率切換元件，設置於反射式面板的第一側上：以及一光吸收元件，設置於反射式面板的第二側上；其中，反射式面板包括至少一膽固醇液晶層，且至少一膽固醇液晶層於一反射態下用以反射可見光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided, wherein the electronic device compries a reflective panel having a first side and a second side opposite to each other; a transmittance switching element disposed on the first side of the reflective panel; and a light absorbing element disposed on the second side of the reflective panel. The reflective panel comprises at least one cholesterol liquid crystal layer, and the at least one cholesterol liquid crystal layer is used to reflect visible light in a reflective state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:反射式面板</p>  
        <p type="p">11:第一子面板</p>  
        <p type="p">111:第一基板</p>  
        <p type="p">112:第二基板</p>  
        <p type="p">113:第一膽固醇液晶層</p>  
        <p type="p">114:第一電極層</p>  
        <p type="p">115:第二電極層</p>  
        <p type="p">12:第二子面板</p>  
        <p type="p">121:第三基板</p>  
        <p type="p">122:第四基板</p>  
        <p type="p">123:第二膽固醇液晶層</p>  
        <p type="p">124:第三電極層</p>  
        <p type="p">125:第四電極層</p>  
        <p type="p">13:第三子面板</p>  
        <p type="p">131:第五基板</p>  
        <p type="p">132:第六基板</p>  
        <p type="p">133:第三膽固醇液晶層</p>  
        <p type="p">134:第五電極層</p>  
        <p type="p">135:第六電極層</p>  
        <p type="p">2:穿透率切換元件</p>  
        <p type="p">21:第七基板</p>  
        <p type="p">22:第八基板</p>  
        <p type="p">23:調控層</p>  
        <p type="p">231:離子儲存層</p>  
        <p type="p">232:電致變色層</p>  
        <p type="p">233:電解質層</p>  
        <p type="p">24:第七電極層</p>  
        <p type="p">25:第八電極層</p>  
        <p type="p">3:光吸收元件</p>  
        <p type="p">6:黏著層</p>  
        <p type="p">C:調控區</p>  
        <p type="p">P:像素區</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="587" publication-number="202627387"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627387.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浸沒式散熱設備</chinese-title>  
        <english-title>IMMERSED HEAT DISSIPATION EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">F28D1/04</main-classification>  
        <further-classification edition="200601120250402B">F28D15/02</further-classification>  
        <further-classification edition="200601120250402B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技鋼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃進權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許馨華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHIN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃肇湘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種浸沒式散熱設備，包括工作槽、工作流體以及第一散熱單元。工作流體設置在工作槽中，且電子裝置適於浸沒在工作流體中；第一散熱單元包括第一冷凝排以及第一冷水管，其中第一冷凝排設置在工作槽中並浸沒在工作流體中；連通於第一冷凝排的第一側的第一冷水管同樣也設置在工作槽中，且第一冷水管完全浸沒在工作流體中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An immersed heat dissipation equipment includes a working tank, a working fluid and a first heat dissipation unit is provided. The working fluid is arranged in the working tank, and the electronic device is adapted to be immersed in the working fluid. The first heat dissipation unit includes a first condensation element and a first cold water pipe, wherein the first condensation element is arranged in the working tank and immersed in the working fluid. The first cold water pipe connected to a first side of the first condensation element is also arranged in the working tank, and the first cold water pipe is completely immersed in the working fluid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:浸沒式散熱設備</p>  
        <p type="p">110:工作槽</p>  
        <p type="p">110a:第一區</p>  
        <p type="p">110b:第二區</p>  
        <p type="p">120:第一散熱單元</p>  
        <p type="p">121:第一冷凝排</p>  
        <p type="p">122:第一冷水管</p>  
        <p type="p">124:入水/出水單元</p>  
        <p type="p">125:第一冷水連接管</p>  
        <p type="p">130:內隔板</p>  
        <p type="p">F:工作流體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="588" publication-number="202627887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卷積加速器、卷積運算的控制方法及微控制電路</chinese-title>  
        <english-title>CONVOLUTION ACCELERATOR, CONTROL METHOD AND MICRO-CONTROLLER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250321B">G06N3/0464</main-classification>  
        <further-classification edition="202301120250321B">G06N3/063</further-classification>  
        <further-classification edition="200601120250321B">G06T1/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪紹恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, SHAO-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種卷積加速器，用以對一儲存電路所儲存的資料進行複數層的卷積運算，並包括複數卷積計算電路、一偵測電路以及一控制電路。每一卷積計算電路被開啟時，進行一卷積運算。偵測電路偵測儲存電路在一固定時間內的一存取狀態，用以產生一偵測信號。控制電路根據偵測信號，動態調整每一層的卷積運算所要開啟的卷積計算電路的數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A convolution accelerator for performing complex-layer convolution operations on data stored in a memory is provided. The convolution accelerator includes a plurality of convolution calculation circuit, a detection circuit and a control circuit. When each convolution calculation circuit is turned on, a convolution operation is performed. The detection circuit detects an access status of the memory within a fixed period of time to generate a detection signal. The control circuit dynamically adjusts the number of convolution calculation circuits to be turned on for each layer of convolution operation according to the detection signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120、133:儲存電路</p>  
        <p type="p">130:卷積加速器</p>  
        <p type="p">131:控制電路</p>  
        <p type="p">132:偵測電路</p>  
        <p type="p">CV_1~CV_4:卷積計算電路</p>  
        <p type="p">SD:偵測信號</p>  
        <p type="p">SO1~SO4:開啟信號</p>  
        <p type="p">211、221、231、241:輸入緩衝器</p>  
        <p type="p">212、222、232、242:處理引擎電路</p>  
        <p type="p">213、223、233、243:累加器</p>  
        <p type="p">214、224、234、244:輸出緩衝器</p>  
        <p type="p">DI_1~DI_4:資料</p>  
        <p type="p">DW_1~DW_4:權重值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="589" publication-number="202627707"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627707.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成式田口方法之最佳化方法</chinese-title>  
        <english-title>OPTIMIZATION APPROACH OF GENERATIVE TAGUCHI METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G05B19/02</main-classification>  
        <further-classification edition="200601120250401B">G05B19/418</further-classification>  
        <further-classification edition="202301120250401B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍華科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳詩豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈庭緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴宗毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, ZONG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊萬騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WAN-GYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊定學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TING-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李郡凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡俊聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊育瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉和昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立陞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃丞安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林古糧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, GU-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡焱棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, YAN-QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, BO-WUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種生成式田口方法（Taguchi methods）之最佳化方法，其步驟包含：透過生成式AI，以生成一田口方法實驗之控制因子、訊號因子及雜訊因子，並生成對應之直交表；對應進行該田口方法實驗，並將控制因子及其實驗參數輸入直交表；計算該直交表中所述實驗數據之信噪比（S/N 比），並透過變異數分析（ANOVA）求得信噪比最大值及顯著之所述過程參數；透過反向傳播神經網路構建信噪比預測器（BPNNS/N_{S/N}S/N）及品質預測器（BPNNQ_{Q}Q）；並對該信噪比預測器及該品質預測器進行優化，以將變異值最小化，並對應優化所述控制因子，獲得優化後之最佳過程參數；藉此，本發明係可藉以界定出最佳化之控制因子及過程參數，並可應用於各式領域，以可有效自動生成並選定田口方法控制因子之選定及決策，以避免仰賴設計人員須透過經驗及試誤方式決定田口方法之因子，藉可有效提升進行田口方法試驗之效率及品質者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an optimization approach of Generative Taguchi Methods. The steps includes using generative AI to generate control factors, signal factors, and noise factors for a Taguchi methods experiment, and creating the corresponding orthogonal array; performing the Taguchi methods experiment and inputting the control factors and their experimental parameters into the orthogonal array; calculating the signal-to-noise ratio (S/N ratio) of the experimental data in the orthogonal array, and using analysis of variance (ANOVA) to determine the maximum S/N ratio and the significant process parameters; constructing a signal-to-noise ratio predictor（BPNNS/N_{S/N}S/N） and a quality predictor （BPNNQ_{Q}Q）through backpropagation neural networks; optimizing the signal-to-noise ratio predictor and quality predictor to minimize variability, and corresponding optimization of the control factors to obtain the optimized best process parameters. Thus, this invention allows for the definition of optimized control factors and process parameters and can be applied in various fields. It effectively automates the selection and decision-making of control factors for the Taguchi methods, avoiding reliance on designers to determine the factors based on experience and trial-and-error. This approach leads to significant improvements in the efficiency and quality of Taguchi methods experiments.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S010~S072:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="590" publication-number="202626464"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626464.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>彈性製造系統及其彈性製造方法</chinese-title>  
        <english-title>FLEXIBLE MANUFACTURING SYSTEM AND FLEXIBLE MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">B65G47/52</main-classification>  
        <further-classification edition="200601120250423B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇耀南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YAO-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種彈性製造系統，包括一起始入料平台、一第一段流水線、一第二段流水線、一終端出料平台以及一搬運機。該第一段流水線包括複數個第一工作機台以及一第一輸送機構，其中，該起始入料平台對該第一段流水線投放一工件，該第一輸送機構輸送該工件。該第二段流水線包括複數個第二工作機台以及一第二輸送機構，該第二輸送機構輸送該工件。該工件從該第二段流水線被移動至該終端出料平台以進行出料。該搬運機適於從該第一段流水線或該第二段流水線取起該工件，並對該工件進行搬運。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flexible manufacturing system includes a starting feed platform, a first conveyor line, a second conveyor line, a terminal discharge platform, and a transfer machine. The first conveyor line includes a plurality of first workstations and a first conveying mechanism, wherein the starting feed platform introduces a workpiece to the first conveyor line, and the first conveying mechanism transports the workpiece. The second conveyor line includes a plurality of second workstations and a second conveying mechanism, which transports the workpiece. The workpiece is transferred from the second conveyor line to the terminal discharge platform for discharge. The transfer machine is configured to pick up the workpiece from either the first or the second conveyor line and transport it accordingly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一段流水線</p>  
        <p type="p">11:第一工作機台</p>  
        <p type="p">111:第一工作區</p>  
        <p type="p">12:第一輸送機構</p>  
        <p type="p">121:第一輸送滾輪</p>  
        <p type="p">2:第二段流水線</p>  
        <p type="p">21:第二工作機台</p>  
        <p type="p">211:第二工作區</p>  
        <p type="p">22:第二輸送機構</p>  
        <p type="p">221:第二輸送滾輪</p>  
        <p type="p">31:起始入料平台</p>  
        <p type="p">32:中間出料平台</p>  
        <p type="p">33:中間入料平台</p>  
        <p type="p">34:終端出料平台</p>  
        <p type="p">4:搬運機</p>  
        <p type="p">8:異常件收料機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="591" publication-number="202625979"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625979.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>力量偵測骨釘裝置</chinese-title>  
        <english-title>FORCE DETECTION BONE SCREW DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">A61B17/86</main-classification>  
        <further-classification edition="200601120250114B">G01L5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, FU-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詩萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱德義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, DE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佩宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種力量偵測骨釘裝置，包括骨釘本體、承力結構、偵測模組及天線模組。骨釘本體包括柱體。承力結構、偵測模組與天線模組分別設於柱體內的容置部，承力結構包括本體、承受部、固定部及至少一彎矩應變結構。本體之一端連接承受部，本體之另一端連接固定部，固定部固設於柱體之內。承受部之一側用以連接於縫線。各個彎矩應變結構分別設於本體，本體具有一軸向方向，每一個彎矩應變結構具有與軸向方向不同的至少一個方向的變形。偵測模組包括至少一應變元件及感測組件，各個應變元件用以量測彎矩應變結構所產生彎矩應變的應力，感測組件連接應變元件。天線模組連接感測組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A force detection bone screw device is provided. The force detection bone screw device includes a bone screw body, a spring structure, a detection module, and an antenna module. The bone screw body includes of a column. The spring structure, the detection module, and the antenna module are respectively arranged in an accommodation portion within the column. The spring structure includes a body, a load-bearing portion, a fixing section, and at least one bending moment strain structure. One end of the body is connected to the load-bearing portion, while the other end is connected to the fixing portion, which is fixed within the column. One side of the load-bearing portion is used to connect to the suture. Each bending moment strain structure is arranged on the body, which has an axial direction, and each bending moment strain structure has deformation in at least one direction that is different from the axial direction. The detection module includes at least one strain element and a sensing component. The strain element are used to measure the bending moment strain and the stress generated by the bending moment strain structure. The sensing component is connected to the strain element. The antenna module is connected to the sensing module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:縫線</p>  
        <p type="p">60:硬體設備</p>  
        <p type="p">100:力量偵測骨釘裝置</p>  
        <p type="p">110:骨釘本體</p>  
        <p type="p">112:柱體</p>  
        <p type="p">112A:開口端</p>  
        <p type="p">112B:插置端</p>  
        <p type="p">114:螺紋</p>  
        <p type="p">120:承力結構</p>  
        <p type="p">122:本體</p>  
        <p type="p">124:承受部</p>  
        <p type="p">126:固定部</p>  
        <p type="p">130:偵測模組</p>  
        <p type="p">132:應變元件</p>  
        <p type="p">134:感測元件</p>  
        <p type="p">140:天線模組</p>  
        <p type="p">AX:軸向方向</p>  
        <p type="p">BX:垂直方向</p>  
        <p type="p">CA:容置部</p>  
        <p type="p">DA:力量數據</p>  
        <p type="p">FA:能量</p>  
        <p type="p">SA:彎矩應變結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="592" publication-number="202627068"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627068.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150802</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>小球藻外泌體的分離製備及其應用方法</chinese-title>  
        <english-title>PREPARATION AND APPLICATION OF THE CHRORELLA EXOSOMES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C12M1/12</main-classification>  
        <further-classification edition="200601120250501B">C12M1/26</further-classification>  
        <further-classification edition="200601120250501B">C12N5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台建生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI JIAN BIOTECH CO,. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱建民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, CHIEN-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王舒眉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHU-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁庭彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, TING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高健育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏福楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種小球藻外泌體的分離製備及其應用方法，從該分離製備方法所得的產物經電子顯微鏡、奈米粒子追蹤分析技術與西法墨點法證實為外泌體，並外泌體經實驗證明可有效調節發炎因子IL-1β及TNF-α的表現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention related to the preparation and application of the Chrorella exosomes. Product for the preparation was confirmed as exosomes by the electron microscopy, Nanoparticle Tracking Analysis and Western blot. The exosomes were proved that being able to adjust the expression of the inflammatory factor IL-1β and TNF-α.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="593" publication-number="202628125"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628125.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>器官勾勒之影像處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251103B">G16H30/40</main-classification>  
        <further-classification edition="201701120251103B">G06T7/00</further-classification>  
        <further-classification edition="201701120251103B">G06T7/11</further-classification>  
        <further-classification edition="200601120251103B">A61B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長佳智能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVER FORTUNE.AI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王帝皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種器官勾勒之影像處理系統，包含一影像處理模組、一勾勒模組、一影像顯示模組、一反饋模組與一再訓練模組。影像處理模組對一醫療影像進行一預處理，以形成一輸入影像。勾勒模組依據一勾勒模型對輸入影像進行預測並產生一勾勒影像。影像顯示模組顯示勾勒影像。反饋模組包括一操作單元與一評估單元，操作單元供使用者手動調整勾勒影像中的勾勒結果，形成一人工標記結果，評估單元依據人工標記結果對勾勒結果進行評分；當一評分分數低於一閾值分數時，評估單元將產生一再訓練資料。再訓練模組依據再訓練資料對勾勒模型進行再訓練。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:影像處理系統</p>  
        <p type="p">10:影像處理模組</p>  
        <p type="p">20:勾勒模組</p>  
        <p type="p">30:影像顯示模組</p>  
        <p type="p">40:反饋模組</p>  
        <p type="p">42:操作單元</p>  
        <p type="p">44:評估單元</p>  
        <p type="p">50:再訓練模組</p>  
        <p type="p">200:醫療影像來源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="594" publication-number="202627635"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627635.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其製造方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250124B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹彩光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚正宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, CHENG HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種顯示裝置，其包含疊層設置的複數選擇性光反射模組以及設置最底部的一光吸收層。此些選擇性光反射模組的每一者包含一顯示層及至少一光配向層。顯示層包含複數像素，光配向層設置於顯示層。此些選擇性光反射模組的一者的光配向層對此些選擇性光反射模組的此者的像素提供一配向方向，且此些選擇性光反射模組的另一者的光配向層對此些選擇性光反射模組的另一者的像素提供另一配向方向。配向方向相異於另一配向方向。藉此，可有效地提升在不同視角下反射率的均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device is proposed and includes a plurality of selective light-reflecting modules stacked on top of each other and a light-absorbing layer at the bottom. Each selective light-reflecting module includes a display layer and at least one photo-alignment layer. The display layer includes a plurality of pixels, and the photo-alignment layer is disposed on the display layer. The photo-alignment layer of one of the selective light-reflecting modules provides an alignment direction to the pixels in the one of the selective light-reflecting modules, and the photo-alignment layer of another selective light-reflecting module provides another alignment direction to the pixels in the another selective light-reflecting module. The alignment direction is different from another alignment direction. Thus, the uniformity of reflectivity under different viewing angles can be effectively improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">100,200:選擇性光反射模組</p>  
        <p type="p">101:黏膠層</p>  
        <p type="p">110,210:第一透明基板</p>  
        <p type="p">111,211:第一透明基材</p>  
        <p type="p">112,212:第一透明電極層</p>  
        <p type="p">120,220:第二透明基板</p>  
        <p type="p">121,221:第二透明基材</p>  
        <p type="p">122,222:第二透明電極層</p>  
        <p type="p">130,230:顯示層</p>  
        <p type="p">141,241:第一光配向層</p>  
        <p type="p">142,242:第二光配向層</p>  
        <p type="p">300:光吸收層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="595" publication-number="202625975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150808</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>心電訊號監測系統、心電訊號監測方法、心電訊號分析系統及心電訊號分析方法</chinese-title>  
        <english-title>ELECTROCARDIOGRAPH SIGNAL MONITORING SYSTEM, ELECTROCARDIOGRAPH SIGNAL MONITORING METHOD, ELECTROCARDIOGRAPH SIGNAL ANALYSIS SYSTEM AND ELECTROCARDIOGRAPH SIGNAL ANALYSIS METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250422B">A61B5/308</main-classification>  
        <further-classification edition="202101120250422B">A61B5/318</further-classification>  
        <further-classification edition="202101120250422B">A61B5/346</further-classification>  
        <further-classification edition="202101120250422B">A61B5/349</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳國瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, GUO-ZUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種心電訊號監測系統，包含至少三個電極、導程分析電路及導程生成電路。該些電極用以取得複數個電極訊號。導程分析電路用以根據該些電極訊號計算複數個第一心電訊號。導程生成電路耦接於導程分析電路，用以根據該些第一心電訊號產生複數個第二心電訊號，且用以將該些第一心電訊號及該些第二心電訊號整合為十二導程心電資料。導程生成電路包含至少一個訊號生成器。訊號生成器包含多個資料過濾器，該些資料過濾器用以擷取該些第一心電訊號中對應於不同取樣頻率的複數個訊號特徵，以使至少一訊號生成器產生該些第二心電訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrocardiograph signal monitoring system includes at least three electrodes, a lead analysis circuit and a lead generation circuit. The electrodes are configured to obtain multiple electrode signals. The lead analysis circuit is configured to calculate multiple first electrocardiograph signals according to the electrode signals. The lead generation circuit is coupled to the lead analysis circuit and configured to generate multiple second electrocardiograph signals according to the first electrocardiograph signals. The lead generation circuit is coupled to integrate the first electrocardiograph signals and the second electrocardiograph signals into a twelve-lead electrocardiograph data. The lead generation circuit includes at least one signal generator. The signal generator includes multiple data filters. The data filters are configured to capture multiple signal characteristics corresponding to different sampling frequencies in the first electrocardiograph signals, so that the signal generator generates the second electrocardiograph signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401-S408:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="596" publication-number="202627072"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627072.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提升聚酮類化合物或其衍生物產量之基因改質微生物以及生產聚酮類化合物或其衍生物的方法</chinese-title>  
        <english-title>GENETICALLY MODIFIED MICROORGANISM THAT ENHANCES PRODUCTION OF POLYKETIDES OR DERIVATIVES THEREOF AND METHOD FOR PRODUCING POLYKETIDES OR DERIVATIVES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">C12N1/21</main-classification>  
        <further-classification edition="200601120250114B">C12N15/70</further-classification>  
        <further-classification edition="200601120250114B">C12N9/12</further-classification>  
        <further-classification edition="200601120250114B">C12P17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁克明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, KE-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雅琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偕倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIE-LEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張珮菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PEI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種提升聚酮類化合物或其衍生物產量之基因改質微生物，包含以下任一者或兩者的基因修飾：(a) 經剔除之內源性 &lt;i&gt;pta&lt;/i&gt;基因，其編碼磷酸乙醯轉移酶，其中經剔除之內源性 &lt;i&gt;pta&lt;/i&gt;基因的磷酸乙醯轉移酶的表現量低於其野生型的表現量；以及(b) 經添加之第一外源性核苷酸序列以及第二外源性核苷酸序列，其中第一外源性核苷酸序列編碼轉胺酶，第二外源性核苷酸序列編碼還原酶。本揭露亦提供一種藉由前述基因改質微生物生產聚酮類化合物或其衍生物的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A genetically modified microorganism that enhances the production of polyketides or derivatives thereof, including genetic modifications of either or both of the following: (a) a deleted endogenous &lt;i&gt;pta&lt;/i&gt;gene encoding phosphate acetyltransferase, wherein the expression level of the phosphate acetyltransferase of the deleted endogenous &lt;i&gt;pta&lt;/i&gt;gene is lower than that of a wild type; and (b)an added first exogenous nucleic acid sequence and an added second exogenous nucleic acid sequence, wherein the first exogenous nucleic acid sequence encodes a transaminase, and the second exogenous nucleic acid sequence encodes a reductase. A method for producing polyketides or derivatives thereof by using the aforementioned genetically modified microorganism is also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="597" publication-number="202626834"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626834.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及封裝結構</chinese-title>  
        <english-title>COMPOSITION AND PACKAGING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C08G59/14</main-classification>  
        <further-classification edition="200601120250402B">C08G59/50</further-classification>  
        <further-classification edition="200601120250402B">C08L63/00</further-classification>  
        <further-classification edition="200601120250402B">C08L67/04</further-classification>  
        <further-classification edition="200601120250402B">G02F1/1339</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周菁慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉佩青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PEI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝添壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIEH, TIEN-SHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-SYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包郁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAO, YU-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種組合物及封裝結構。該組合物包含一第一寡聚物、一第二寡聚物、以及一核殼硬化劑。該核殼硬化劑包含一核心及一殼層，其中該核心係具有咪唑基(imidazolyl group)的化合物、具有咪唑啉基(imidazolinyl group)的化合物、或上述組合，以及該殼層包含聚己內酯，其中該聚己內酯的重量平均分子量係70,000克/mol至90,000克/mol。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition and a packaging structure are provided. The composition includes a first oligomer, a second oligomer, and a core-shell curing agent. The core-shell curing agent includes a core and a shell, wherein the core includes a compound having an imidazolyl group and a compound having an imidazolinyl group, or a combination thereof, and the shell includes a polycaprolactone having a weight-average molecular weight of 70,000 g/mol to 90,000 g/mol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:核殼硬化劑</p>  
        <p type="p">20:核心</p>  
        <p type="p">30:殼層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="598" publication-number="202627462"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627462.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源焦點位置量測系統和量測光源焦點位置的方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR LIGHT SOURCE FOCAL POINT POSITION MEASUREMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250512B">G01N23/04</main-classification>  
        <further-classification edition="200601120250512B">G02B27/44</further-classification>  
        <further-classification edition="200601120250512B">G01B11/27</further-classification>  
        <further-classification edition="200601120250512B">G01M11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊富程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種光源焦點位置量測系統，包括一光源、一影像偵測器以及第一和第二二維振幅光柵。光源位於一光路徑上。其中，第一二維振幅光柵位於光源和第二二維振幅光柵之間，且第二二維振幅光柵位於第一二維振幅光柵和該影像偵測器之間，且第一和第二二維振幅光柵的中心點位於光路徑上。光源透過第一和第二二維振幅光柵產生具有二維週期圖樣的一影像，二維週期圖樣具有一週期以及第一和第二相位偏移。影像偵測器根據該週期以及第一和第二相位偏移，產生光源之一焦點位置坐標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for light source focal point measurement is provided, which includes light source, image sensor, and first and second two-dimension (2D) amplitude gratings. The light source is on a light path. The first 2D amplitude grating is between the light source and the second 2D amplitude grating, the second 2D amplitude grating is between the first 2D amplitude grating and the image sensor, and centers of the first and second 2D amplitude gratings are on the light path. The light source generates an image having 2D periodic pattern through the first and second 2D amplitude grating. The 2D periodic pattern has a period and first and second phase shifts. The image sensor generates a focal point coordinate of the light source based on the period and the first and second phase shifts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光源焦點位置量測系統</p>  
        <p type="p">110:光源</p>  
        <p type="p">120:處理器</p>  
        <p type="p">130:影像偵測器</p>  
        <p type="p">140a,140b,140c:光路徑</p>  
        <p type="p">G1,G2:二維振幅光柵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="599" publication-number="202626292"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626292.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁吸式工具盒</chinese-title>  
        <english-title>MAGNETIC TOOL BOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251104B">B25H3/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仕興機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OAV EQUIPMENT AND TOOLS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, WEN LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種磁吸式工具盒，包括：一本體、至少一磁吸件及至少一止滑件。該本體包括一固定面及複數凹槽，該固定面供面向一設置面，該複數凹槽供容設至少一物件且具有至少三種相異之規格；該至少一磁吸件設於該固定面以供磁吸於該設置面；該至少一止滑件設於該固定面以供夾抵於該固定面與該設置面之間。藉此，該磁吸式工具盒可供放置該至少一物件，且可靈活地移動以提供便利的工具管理效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a magnetic tool box, including: a main body, at least one magnetic member, and at least one anti-slip member. The main body comprises a fixing surface and a plurality of grooves, the fixing surface is configured to face toward a mounting surface, and the plurality of grooves are configured to receive at least one object and have at least three different specifications. The at least one magnetic member is disposed on the fixing surface and configured to be magnetically attached to the mounting surface. The at least one anti-slip member is disposed on the fixing surface and configured to be abutted against and between the fixing surface and the mounting surface. Therefore, the magnetic tool box can hold the at least one object and be easily moved to provide a convenient tool management effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:磁吸式工具盒</p>  
        <p type="p">121:第一凹槽</p>  
        <p type="p">122:第二凹槽</p>  
        <p type="p">123:第三凹槽</p>  
        <p type="p">18:抵凸</p>  
        <p type="p">L:縱向方向</p>  
        <p type="p">W:橫向方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="600" publication-number="202627574"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627574.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學式探針對矽光子多點高維同步對位耦光之系統及其方法</chinese-title>  
        <english-title>SYSTEM OF OPTICAL PROBE FOR MULTI-POINT HIGH-DIMENSIONAL SYNCHRONOUS COUPLING ALIGNMENT OF SILICON PHOTONICS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">G02B6/34</main-classification>  
        <further-classification edition="200601120250926B">G02B6/27</further-classification>  
        <further-classification edition="200601120250926B">G01N21/21</further-classification>  
        <further-classification edition="200601120250926B">G01N21/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉維彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, WEI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高明貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, MING-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙芙涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, FU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學式探針對矽光子多點高維同步對位耦光之系統，其用以對一矽光子晶圓進行對位耦光。光學式探針對矽光子多點高維同步對位耦光之系統包含一光學式探針陣列以及一移動裝置。光學式探針陣列包含複數光學式探針，此些光學式探針朝向矽光子晶圓設置。移動裝置連接光學式探針陣列，並用以移動光學式探針陣列。此些光學式探針在一時間點同步對矽光子晶圓之複數耦合點分別發射複數入射光，以進行多點對位耦光。藉此，利用多點並行處理能力緩解耦合效率與通量之間的矛盾，有效提升了矽光子器件的生產效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system of an optical probe for multi-point high-dimensional synchronous coupling alignment of silicon photonics is proposed. The system is configured for coupling alignment of a silicon photonics wafer, includes an optical probe array and a moving device. The optical probe array includes a plurality of optical probes. The optical probes are disposed toward the silicon photonics wafer. The moving device is connected to the optical probe array and configured to move the optical probe array. The optical probes simultaneously emit a plurality of incident lights to a plurality of coupling points of the silicon photonics wafer respectively at one time point, thereby performing multi-point coupling alignment. Therefore, the system of the present disclosure utilizes multi-point parallel processing capabilities to alleviate the contradiction between coupling efficiency and flux, thus effectively improving the production efficiency of silicon photonic devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學式探針對矽光子多點高維同步對位耦光之系統</p>  
        <p type="p">110:矽光子晶圓</p>  
        <p type="p">112:耦合點</p>  
        <p type="p">200:光學式探針陣列</p>  
        <p type="p">210:光學式探針</p>  
        <p type="p">212:入射光</p>  
        <p type="p">300:移動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="601" publication-number="202628356"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628356.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音頻放大裝置</chinese-title>  
        <english-title>AUDIO AMPLIFICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03F3/181</main-classification>  
        <further-classification edition="200601120250303B">H03F1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶豪科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊子翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYONG, ZIH-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曜洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ISAAC Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種音頻放大裝置包含一電荷泵電路及一運算放大器。該電荷泵電路接收到一上電重置信號時，產生一輸出電壓。該運算放大器具有一接收一第一輸入信號的第一輸入端、一接收一第二輸入信號的第二輸入端、一接收該輸出電壓的第三輸入端、一接收一切換信號輸出的第四輸入端，及一輸出端。該運算放大器根據該第一輸入信號、該第二輸入信號、該輸出電壓及該切換信號輸出在該輸出端產生一放大信號並輸出至一負載電路，當該上電重置信號的準位由一高邏輯準位變為一低邏輯準位時，該運算放大器受該切換信號輸出控制而將該輸出端的電位拉低至零電位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An audio amplification device includes a charge pump circuit and an operational amplifier. The charge pump circuit generates an output voltage when receiving a power-on reset signal. The operational amplifier has a first input terminal for receiving a first input signal, a second input terminal for receiving a second input signal, a third input terminal for receiving the output voltage, a fourth input terminal for receiving a switching signal output, and an output terminal. The operational amplifier generates an amplified signal at the output terminal according to the first input signal, the second input signal, the output voltage and the switching signal output and outputs it to a load circuit. When the level of the power-on reset signal changes from a high logic level to a low logic level, the operational amplifier is controlled by the switching signal output to pull down the level of the output terminal to zero potential.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:音頻放大裝置</p>  
        <p type="p">20:負載電路</p>  
        <p type="p">21:電荷泵電路</p>  
        <p type="p">22:運算放大器</p>  
        <p type="p">Am:放大信號</p>  
        <p type="p">AVSS:輸出電壓</p>  
        <p type="p">POR:上電重置信號</p>  
        <p type="p">So:切換信號輸出</p>  
        <p type="p">Vin:第二輸入信號</p>  
        <p type="p">Vip:第一輸入信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="602" publication-number="202627520"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627520.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>信號特徵之自適應調整系統</chinese-title>  
        <english-title>SELF-ADAPTIVE SIGNAL FEATURE ADJUSTMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G01S7/48</main-classification>  
        <further-classification edition="200601120250401B">G01S7/493</further-classification>  
        <further-classification edition="200601120250401B">G01S17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　招慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JAO CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　招慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JAO CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧宇勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宜誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種信號特徵自適應調整系統包含一發射單元發射一雷射光束，一接收單元接收該雷射光束於該目標物反射後的一反射雷射光束，當該發射單元發射該雷射光束時，該控制模組透過一處理單元自發射固定的一發射電流並做為一參考信號，同時該處理單元將該反射雷射光束轉換為一電信號，再透過一數據採集單元自動判讀及比對該參考信號以及該電信號，當處於惡劣的該環境時，該參考信號不會受該環境的影響，故可以精確比對該電信號，大幅減少測距誤差，從而提升高準確性的該距離結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A self-adaptive signal feature adjustment system includes a transmission unit that emits a laser beam and a reception unit that receives the reflected laser beam from the target object. When the transmission unit emits the laser beam, the control module, through a processing unit, generates a reference signal from a fixed transmission current. Simultaneously, the processing unit converts the reflected laser beam into an electrical signal, which is then automatically analyzed and compared with the reference signal by a data acquisition unit. In harsh environments, the reference signal is not affected by the environment, allowing for precise comparison with the electrical signal, significantly reducing distance measurement errors and thereby improving the accuracy of the distance results.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:發射單元</p>  
        <p type="p">11:雷射光束</p>  
        <p type="p">12:反射雷射光束</p>  
        <p type="p">20:接收單元</p>  
        <p type="p">30:控制模組</p>  
        <p type="p">31:處理單元</p>  
        <p type="p">32:數據採集單元</p>  
        <p type="p">33:數字信號處理器</p>  
        <p type="p">34:記憶模組</p>  
        <p type="p">40:輸入介面</p>  
        <p type="p">41:電源開關</p>  
        <p type="p">42:模式選擇</p>  
        <p type="p">43:發射鈕</p>  
        <p type="p">50:顯示輸出模組</p>  
        <p type="p">51:模式</p>  
        <p type="p">52:狀態</p>  
        <p type="p">53:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="603" publication-number="202627417"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627417.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學測距器工作點補償系統</chinese-title>  
        <english-title>OPTICAL DISTANCE METER OPERATING POINT COMPENSATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G01C3/06</main-classification>  
        <further-classification edition="200601120250418B">G01R19/32</further-classification>  
        <further-classification edition="200601120250418B">G01R19/10</further-classification>  
        <further-classification edition="200601120250418B">G01R19/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　招慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JAO CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　招慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JAO CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧宇勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宜誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學測距器工作點補償系統，其包含一控制中心、一發射單元以及一接收單元，該控制中心予一發射指令於該發射單元進行光源輸出，該接收單元轉換接收的一光反射訊號至一數位訊號傳遞至該控制中心；該控制中心包含一記憶模組、一判斷模組以及一電流感測模組，本發明透過該電流感測模組於使用該光學測距器前量測電流以及電壓變化，以調整至最佳工作電壓，進而實現響應時間快速、測距訊號穩定以及低能耗之效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A optical distance meter operating point compensation system includes a control center, a transmitting unit, and a receiving unit. The control center sends a transmission command to the transmitting unit for light source output. The receiving unit converts the received reflected light signal into a digital signal and transmits it to the control center. The control center comprises a memory module, a judgment module, and a current sensing module. This invention measures uses the current sensing module to measure current and voltage changes before operating the optical distance meter, allowing adjustment to the optimal operating voltage for rapid response, stable distance measurement, and low energy consumption.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:控制中心</p>  
        <p type="p">11:記憶模組</p>  
        <p type="p">12:判斷模組</p>  
        <p type="p">13:電流感測模組</p>  
        <p type="p">20:發射單元</p>  
        <p type="p">30:接收單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="604" publication-number="202628889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150847</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移載裝置及包含其的設備前端模組</chinese-title>  
        <english-title>TRANSFER DEVICE AND EQUIPMENT FRONT END MODULE (EFEM) HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>由田新技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTECHZONE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒嘉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴憲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HSIEN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仲誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種移載裝置，用以搬運一晶圓，包括一本體以及一拾取組件。拾取組件活動地連接本體，並可於一第一檢測狀態以及一第二檢測狀態之間切換。拾取組件包括一第一牙叉元件以及一第二牙叉元件，當拾取組件處於第一檢測狀態時，第一牙叉元件支撐晶圓，且第二牙叉元件未接觸晶圓，當拾取組件處於第二檢測狀態時，第二牙叉元件支撐晶圓，且第一牙叉元件未接觸晶圓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transfer device for moving a wafer is provided, including a main body and a pick-up assembly. The pick-up assembly is movably connected to the main body, and is transformable between a first inspection state and a second inspection state. The pick-up assembly includes a first fork blade and a second fork blade. When the pick-up assembly is in the first inspection state, the wafer is supported by the first fork blade, and the second fork blade is separated from the wafer. When the pick-up assembly is in the second inspection state, the wafer is supported by the second fork blade, and the first fork blade is separated from the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:移載裝置</p>  
        <p type="p">111:本體</p>  
        <p type="p">12:外觀檢測裝置</p>  
        <p type="p">121:第一攝像頭</p>  
        <p type="p">122:第二攝像頭</p>  
        <p type="p">A:檢測區域</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">F:拾取組件</p>  
        <p type="p">F1:第一牙叉元件</p>  
        <p type="p">F2:第二牙叉元件</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="605" publication-number="202627210"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627210.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陰離子交換膜及其製造方法</chinese-title>  
        <english-title>ANION EXCHANGE MEMBRANE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250507B">C25B1/04</main-classification>  
        <further-classification edition="202101120250507B">C25B9/19</further-classification>  
        <further-classification edition="202201120250507B">C09K23/18</further-classification>  
        <further-classification edition="200601120250507B">B01D61/42</further-classification>  
        <further-classification edition="200601120250507B">B01D61/46</further-classification>  
        <further-classification edition="200601120250507B">B01J39/14</further-classification>  
        <further-classification edition="201701120250507B">B01J41/05</further-classification>  
        <further-classification edition="201701120250507B">B01J41/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人石材暨資源產業研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE &amp; RESOURCE INDUSTRY R&amp;D CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林倞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳輔庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, FU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許紘瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種陰離子交換膜的製造方法，包含(a).使包含矽鋁無機鹽、鹼性活化劑的反應物形成無機聚合物前驅物；(b).使載體與無機聚合物前驅物經第一含浸處理形成雙層結構體；(c).使烷氧基矽烷與水基溶液形成經反應液；(d).使雙層結構體與經反應液經第二含浸處理形成多層結構體；及(e).使多層結構體經第三含浸處理製得陰離子交換膜。因(a)使用含矽鋁無機鹽與鹼性活化劑及(b)的第一含浸處理，使無機聚合物層具有良好強鹼耐受性，並配合(d)的第二含浸處理及(e)的第三含浸處理，使製得的陰離子交換膜不僅具有良好強鹼耐受性而在強鹼下具有良好使用壽命且能吸引陰離子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an anion exchange membrane includes: (a) forming a geopolymer precursor by using a reaction mixture containing a silicon–aluminum inorganic salt and an alkaline activator; (b) subjecting a matrix and the geopolymer precursor to a first impregnation treatment so as to form a double-layer structure; (c) reacting an alkoxysilane with an aqueous solution to form a reaction solution; (d) subjecting the double-layer structure and the reaction solution to a second impregnation treatment to form a multilayer structure; and (e) subjecting the multilayer structure to a third impregnation treatment to obtain the anion exchange membrane. Because step (a) uses the silicon–aluminum inorganic salt and the alkaline activator, and step (b) includes the first impregnation treatment, the resulting geopolymer layer exhibits excellent resistance to strong bases. In combination with the second impregnation treatment of step (d) and the third impregnation treatment of step (e), the obtained anion exchange membrane not only maintains its high-pH stability and achieves a prolonged service life under strongly alkaline conditions but also effectively conducts anions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="606" publication-number="202627787"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627787.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視窗管理方法及電腦系統</chinese-title>  
        <english-title>WINDOW MANAGEMENT METHOD AND COMPUTER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">G06F3/0481</main-classification>  
        <further-classification edition="201301120250401B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優派國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIEWSONIC INTERNATIONAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧敏曜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MIN-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申希明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, HSI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧偉捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, WEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種視窗管理方法，包括提供一虛擬桌面之一視窗管理設定檔，該虛擬桌面包括複數個虛擬視窗，每一虛擬視窗對應至一可執行檔案物件；響應於一使用者輸入而於一作業系統之複數個桌面之一桌面中選取該視窗管理設定檔；從複數個顯示裝置或該作業系統之複數個桌面當中決定出一目標顯示介面；以及基於選取該視窗管理設定檔，根據該視窗管理設定檔於該目標顯示介面顯示該虛擬桌面之該複數個虛擬視窗並且針對每一虛擬視窗將對應於該虛擬視窗之該可執行檔案物件的內容顯示於該虛擬視窗中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A window management method is provided, which includes providing a window management configuration file of a virtual desktop, the virtual desktop including a plurality of virtual windows, each virtual window corresponding to an executable file object, in response to a user input, selecting the window management configuration file in one of a plurality of desktops of an operating system, determining a target display interface from a plurality of display devices or the plurality of desktops of the operating system, and based on that the window management configuration file is selected, displaying the plurality of virtual windows of the virtual desktop on the target display interface according to the window management configuration file, and for each virtual window, displaying contents of the execution file object corresponding to the virtual window on the virtual window according to the window management configuration file.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:流程</p>  
        <p type="p">S200,S202,S204,S206,S208,S210:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="607" publication-number="202627809"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627809.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>監控事件分析系統及監控事件分析方法</chinese-title>  
        <english-title>MONITORING EVENT ANALYSIS SYSTEM AND MONITORING EVENT ANALYSIS METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F11/30</main-classification>  
        <further-classification edition="200601120250401B">G06F11/28</further-classification>  
        <further-classification edition="200601120250401B">G06F11/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏正自動科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATEN INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝承志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHENG CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林琨傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種監控事件分析方法，包含：取得監控影像及複數個操作指令，其中該些操作指令具有操作順序；自監控影像擷取複數個操作畫面，其中該些操作指令的每一者對應於該些操作畫面的對應一者；根據操作順序，將該些操作指令及該些操作畫面作為複數個操作動作，且將該些操作動作與監控事件相比對；以及在該些操作動作與監控事件的複數個監控指令及複數個監控畫面相符時，將該些操作動作儲存為監控紀錄。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A monitoring event analysis method, including: obtaining a monitoring image and multiple operation instructions, wherine the operation instructions have an operation sequence; capturing multiple operation screens from the monitoring image, wherein each of the operation instructions corresponds to a corresponding one of the operation screens; using the operation instructions and the operation screens as multiple operation actions according to the operation sequence, and comparing the operational actions with at least one monitoring event; and when the operation actions match multiple monitoring instructions and multiple monitoring screens of one monitoring event, storing the operation actions as a monitoring record.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301-S305:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="608" publication-number="202628205"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628205.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150852</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高安全性碳材的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING A HIGH-SAFETY CARBON MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250114B">H01M4/583</main-classification>  
        <further-classification edition="201001120250114B">H01M10/0565</further-classification>  
        <further-classification edition="201001120250114B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣中油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CPC CORPORATION, TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-SHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴佳閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIA MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種高安全性碳材的製造方法，其係包含：步驟(A)，將碳材、鍍膜材料、戊二醛、及溶液以100：2~6：0.2~0.6：100~300的重量比混合，以形成混合漿料，其中，該碳材為軟碳及/或人工石墨，該鍍膜材料為幾丁聚醣及/或硫化幾丁聚醣；步驟(B)，將該混合漿料攪拌均勻，並在70 &lt;sup&gt;°&lt;/sup&gt;C~90 &lt;sup&gt;°&lt;/sup&gt;C下進行加熱，以形成蒸乾漿料；步驟(C)，將該蒸乾漿料於70 &lt;sup&gt;°&lt;/sup&gt;C~90 &lt;sup&gt;°&lt;/sup&gt;C下加熱24小時以上，接著降溫至室溫，以形成高安全性碳材。藉由本發明的方法，有助於獲得一種高安全性碳材，其能夠減緩固態電解質介面膜分解時的大量放熱，防止固態電解質介面膜分解產生的熱量觸發整個熱失控機制，並能夠提升負極材料在電池使用之安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a high-safety carbon material, which comprises: step (A), mixing a carbon material, a coating material, glutaraldehyde and a solution with a weight ratio of 100:2-6:0.2-0.6:100-300 to form a mixed slurry, wherein the carbon material is soft carbon and/or artificial graphite, and the coating material is chitosan and/or sulfated chitosan; step (B), stirring the mixed slurry evenly and heating at 70 &lt;sup&gt;°&lt;/sup&gt;C-90 &lt;sup&gt;°&lt;/sup&gt;C to form a steamed dry slurry; step (C), heating the steamed dry slurry at 70 &lt;sup&gt;°&lt;/sup&gt;C-90 &lt;sup&gt;°&lt;/sup&gt;C for 24 hours or more, and then cooling to room temperature to form a high-safety carbon material. Through the method of the present disclosure, it is helpful to obtain a high-safety carbon material, which can slow down a large amount of heat release when a solid-state electrolyte interface membrane decomposes, prevent the heat generated by the decomposition of the solid-state electrolyte interface membrane from triggering the whole thermal runaway mechanism, and can improve the safety of an anode material in the use of the battery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A~C:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="609" publication-number="202627115"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627115.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>回收鐵離子及製備磷酸鐵的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250107B">C22B3/42</main-classification>  
        <further-classification edition="200601120250107B">C22B3/46</further-classification>  
        <further-classification edition="200601120250107B">C01G49/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翰立科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳順玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種回收鐵離子及製備磷酸鐵的方法，其包含步驟(a)：提供一溶有鐵離子之溶液，該溶有鐵離子之溶液包含一氯化鐵溶液、一硫酸鐵溶液或其組合；步驟(b)：將該溶有鐵離子之溶液通過螯合型陽離子交換樹脂，以獲得吸附離子之樹脂；步驟(c)：將磷酸溶液通過該吸附離子之樹脂，以獲第二流出液；其中，第二流出液包含三價鐵離子及磷酸根離子，該磷酸溶液的濃度為10 wt%至45 wt%；及步驟(d)：加熱第二流出液，以獲得磷酸鐵沉澱物。所述方法能夠回收鐵離子並用於製備磷酸鐵，同時亦能減少回收過程中的廢液產生，且降低成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:步驟</p>  
        <p type="p">S2:步驟</p>  
        <p type="p">S3:步驟</p>  
        <p type="p">S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="610" publication-number="202626255"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626255.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軸類工件複雜加工面的修護校正方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">B23Q17/22</main-classification>  
        <further-classification edition="200601120250423B">B23B25/06</further-classification>  
        <further-classification edition="200601120250423B">B23P6/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈孟輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昱寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂建陞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭哲宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軸類工件複雜加工面的修護校正方法，其用於大型軸類工件的複雜加工面修護作業，其步驟主要係在軸類工件修護範圍內之平面處的X軸向兩端各安裝校正塊，使用加工機具將X軸向兩端的校正塊分別切削加工至同一圓心基準的二基準圓，利用量測校正塊上的二基準圓校正軸類工件之X軸向平行度及Z軸方向垂直度；在軸類工件的修護範圍內Ｘ軸向兩端之平面處加工Ｘ軸向及Ｚ軸向之校正基準面，接續修護範圍內的複雜加工面的粗加工以及銲補，以及使用加工機具進行精加工等，藉此，提升校正精度，縮短校正作業時間，並能避免銲補後變形產的誤差，提高加工面尺寸精度，確保後續配件的順利安裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="611" publication-number="202628360"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628360.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>波形產生電路、控制晶片及波形產生方法</chinese-title>  
        <english-title>WAVEFORM GENERATION CIRCUIT, CONTROL CHIP AND WAVEFORM GENERATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H03K4/02</main-classification>  
        <further-classification edition="200601120250401B">H03K5/22</further-classification>  
        <further-classification edition="200601120250401B">H03M5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭盟煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, MENG-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種波形產生電路，包括一儲存電路、一計數器、一第一數位類比轉換電路、一第二數位類比轉換電路以及一邏輯電路。儲存電路儲存複數數位值。計數器調整一計數值。第一數位類比轉換電路依序轉換複數第一輸入值，用以產生一第一波形。第二數位類比轉換電路依序轉換複數第二輸入值，用以產生一第二波形。每當計數值等於一初始值時，邏輯電路選擇一數位值作為一第一輸入值。在計數值等於一臨界值的次數達一預設次數後，每當計數值等於臨界值時，邏輯電路選擇一數位值作為一第二輸入值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A waveform generation circuit including a storage circuit, a counter, a first digital-to-analog converter (DAC) circuit, a second DAC circuit, and a logic circuit is provided. The storage circuit stores a plurality of digital values. The counter adjusts a counting value. The first DAC circuit sequentially converts a plurality of first input values to generate a first waveform. The second DAC circuit sequentially converts a plurality of second input values to generate a second waveform. Each when the counting value is equal to an initial value, the logic circuit selects a digital value among the digital values as one of the first input values. After the number of times that the counting value is equal to a threshold value arrives a predetermined value, each when the counting value is equal to the threshold value, the logic circuit selects a digital value among the digital values as one of the second input values.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:波形產生電路</p>  
        <p type="p">210:計數器</p>  
        <p type="p">220:暫存器電路</p>  
        <p type="p">230:邏輯電路</p>  
        <p type="p">240:儲存電路</p>  
        <p type="p">251~253:數位類比轉換電路</p>  
        <p type="p">B&lt;sub&gt;CLK&lt;/sub&gt;:時脈信號</p>  
        <p type="p">C&lt;sub&gt;T&lt;/sub&gt;:計數值</p>  
        <p type="p">TR&lt;sub&gt;21&lt;/sub&gt;、TR&lt;sub&gt;31&lt;/sub&gt;:臨界值</p>  
        <p type="p">W1~W3:波形</p>  
        <p type="p">I1_1~I1_32、I2_1~I2_32、I3_1~I3_32:輸入值</p>  
        <p type="p">A1_1~A1_32、A2_1~A2_32、A2_1~A2_32:類比信號</p>  
        <p type="p">260:運算電路</p>  
        <p type="p">S_PH:相位信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="612" publication-number="202627117"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627117.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含鋁材料製成的複合物及其用途</chinese-title>  
        <english-title>ALUMINUM-CONTAINING COMPOSITE AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250430B">C22B7/04</main-classification>  
        <further-classification edition="202301120250430B">C22C1/04</further-classification>  
        <further-classification edition="200601120250430B">C22C21/00</further-classification>  
        <further-classification edition="200601120250430B">B21C23/08</further-classification>  
        <further-classification edition="200601120250430B">B21C23/10</further-classification>  
        <further-classification edition="200601120250430B">B21C23/12</further-classification>  
        <further-classification edition="202201120250430B">B22F1/065</further-classification>  
        <further-classification edition="200601120250430B">B29B11/10</further-classification>  
        <further-classification edition="200601120250430B">B32B15/02</further-classification>  
        <further-classification edition="200601120250430B">C22C1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行富投資股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HF INVESTMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李健豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種含鋁材料製成的複合物，該複合物包含一基底金屬以及一第二相金屬，其中: 該基底金屬為一連續相金屬，其包含一鋁金屬材料； 該第二相金屬為複數個顆粒金屬排列或堆疊形成，其包含複數個含鐵顆粒；以及至少一部分之該第二相金屬分布於該基底金屬之中或該基底金屬外周圍之至少一部份；透過固態擠型之製程以及於該複合物的外圍沿該長度方向設置該含鐵顆粒所構成的該第二相金屬，增加該複合物之整體合金強度、韌性、耐磨性、抗腐蝕性以及該徑向方向之強度，且兼顧具備該含鋁材料之高導電與導熱性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aluminum-containing composite, comprising a base metal and a secondary metal, wherein the base metal including aluminum-containing material is continuously arranged; the secondary metal is formed by the arrangement or stacking of multiple metal particles, with these metal particles comprising iron-containing elements; and at least a portion of the secondary phase metal is distributed within the base metal or arranged around at least a portion of the exterior of the base metal. By using a solid-state extrusion process and incorporating the secondary phase metal along the perimeter of the aluminum-containing composite, the material's overall alloy strength, toughness, wear resistance, corrosion resistance, and radial strength are improved, while retaining the high electrical and thermal conductivity of the aluminum.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:複合物</p>  
        <p type="p">11:基底金屬</p>  
        <p type="p">12:第二相金屬</p>  
        <p type="p">121:含鐵顆粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="613" publication-number="202627502"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627502.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片檢測系統及其檢測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G01R31/28</main-classification>  
        <further-classification edition="202001120250501B">G01R31/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>正基科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>速連通訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏瀅洳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范文松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張元壢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賜鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜兆唐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔祥琨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎮臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張惠民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡銘甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡展源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣育宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪秉謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片檢測系統及其檢測方法，係包含有一檢測機具、一控制器、一測試器、一數位量測器及一電子裝置，其中將一待測晶片本體置放於該檢測機具之晶片測試插座上，並透過該電子裝置發出指令，用以切換該待測晶片本體之藍芽功能模組或/及該WIFI功能模組的開啟及關閉狀態，並再控制該數位量測器進行量測該基板電壓值，若是判斷該基板電壓值小於該一設定值，該電子裝置則判斷該待測晶片本體係為一異常晶片；反之，若是該基板電壓值高於或等於該設定值，該測試應用程式係判斷該待測晶片本體係為一正常晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢測機具</p>  
        <p type="p">2:控制器</p>  
        <p type="p">3:測試器</p>  
        <p type="p">4:數位量測器</p>  
        <p type="p">5:電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="614" publication-number="202628589"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628589.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250526B">H10B43/20</main-classification>  
        <further-classification edition="202301120250526B">H10B41/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂呈瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置包括堆疊結構、垂直通道柱、第一插塞與第二插塞。堆疊結構包括交替堆疊的多個絕緣層和多個導體層。垂直通道柱垂直貫穿堆疊結構，其中垂直通道柱包括絕緣柱、環繞絕緣柱的通道層以及環繞通道層的電荷儲存結構。第一插塞與第二插塞設置於絕緣柱兩側並與通道層相接。在一俯視圖中，第一插塞的中心與第二插塞的中心之間的距離大於垂直通道柱的半徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a stacked structure, a vertical channel pillar, a first plug and a second plug. The stacked structure includes a plurality of insulating layers and a plurality of conductive layers that are alternately stacked. The vertical channel pillar vertically penetrates the stacked structure, wherein the vertical channel pillar includes an insulating column, a channel layer surrounding the insulating column, and a charge storage structure surrounding the channel layer. The first plug and the second plug are arranged on both sides of the insulating column and connected with the channel layer. In a top view, the distance between the center of the first plug and the center of the second plug is greater than the radius of the vertical channel pillar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">104:導體層</p>  
        <p type="p">106:第二絕緣柱</p>  
        <p type="p">108:第一絕緣柱</p>  
        <p type="p">110:絕緣柱</p>  
        <p type="p">112:通道層</p>  
        <p type="p">114:外絕緣層</p>  
        <p type="p">CS:電荷儲存結構</p>  
        <p type="p">d1、d2、d3:直徑</p>  
        <p type="p">DP:第二插塞</p>  
        <p type="p">N1:氮化物層</p>  
        <p type="p">O1、O2:氧化物層</p>  
        <p type="p">r1:半徑</p>  
        <p type="p">s1:距離</p>  
        <p type="p">SP:第一插塞</p>  
        <p type="p">VC:垂直通道柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="615" publication-number="202627877"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627877.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輿情分析系統及其方法</chinese-title>  
        <english-title>PUBLIC OPINION ANALYSIS SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250204B">G06F40/284</main-classification>  
        <further-classification edition="201901120250204B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上海商業儲蓄銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE SHANGHAI COMMERCIAL &amp; SAVINGS BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝碧芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, PI-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種輿情分析系統及其方法。輿情分析系統包括資料庫及處理裝置。資料庫儲存來自於多個資料源的輿情資料。處理裝置耦接資料庫，並且包括接收模組、提取模組及運算模組。接收模組用以接收查詢資訊。提取模組用以根據查詢資訊自資料庫提取對應的輿情資料。運算模組用以將對應的輿情資料輸入生成式AI模型及深度學習模型，以分別獲得第一情感評分及第二情感評分，然後將第一情感評分及第二情感評分以權重比例進行加權處理，以獲得輿情分析結果，其中權重比例為對應生成式AI模型的權重值與對應深度學習模型的權重值的比例。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A public opinion analysis system and a method thereof are provided. The public opinion analysis system includes a database and a processing device. The database is stored with public opinion data from a plurality of data sources. The processing device is coupled to the database and includes a receiving module, an extraction module and a computing module. The receiving module is configured to receive query information. The extraction module is configured to extract corresponding public opinion data from the database based on the query information. The computing module is used to input the corresponding public opinion data into a generative AI model and a deep learning model to obtain a first sentiment score and a second sentiment score, respectively, and then weight the first sentiment score and the second sentiment score according to a weight ratio to obtain a public opinion analysis result, in which the weight ratio is a ratio of a weight value corresponding to the generative AI model to a weight value corresponding to the deep learning model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:資料庫</p>  
        <p type="p">20:處理裝置</p>  
        <p type="p">21:接收模組</p>  
        <p type="p">22:提取模組</p>  
        <p type="p">23:運算模組</p>  
        <p type="p">24:訓練模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="616" publication-number="202628754"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628754.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250124B">H10K59/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳巍中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林辰崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張若蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, RUO-LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括基板、多個顯示元件、多個集束井、出光結構以及填充層。多個顯示元件設置在基板上且包括多個第一色顯示元件以及多個第二色顯示元件。多個集束井設置在多個顯示元件上。多個集束井中的每一個重疊於對應的至少一個第一色顯示元件以及對應的至少一個第二色顯示元件。多個集束井中的每一個具有面向基板的第一表面以及面向出光結構的第二表面，且第一表面在基板上的正投影面積大於第二表面在基板上的正投影面積。出光結構設置在多個集束井上。填充層位於多個集束井之間，其中填充層的折射率小於多個集束井的折射率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a substrate, display elements, light-mixing wells, a light exit structure and a filling layer. The display elements are disposed on the substrate and include first-color display elements and second-color display elements. The light-mixing wells are disposed on the display elements. Each light-mixing well overlaps at least one corresponding first-color display element and at least one corresponding second-color display element. Each light-mixing well has a first surface facing the substrate and a second surface facing the light exit structure, and an orthographic projection area of the first surface on the substrate is greater than an orthographic projection area of the second surface on the substrate. The light exit structure is disposed on the light-mixing wells. The filling layer is located between the light-mixing wells, wherein a refractive index of the filling layer is smaller than a refractive index of the light-mixing wells.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:顯示元件</p>  
        <p type="p">12:集束井</p>  
        <p type="p">13:出光結構</p>  
        <p type="p">14:填充層</p>  
        <p type="p">111:第一色顯示元件</p>  
        <p type="p">112:第二色顯示元件</p>  
        <p type="p">113:第三色顯示元件</p>  
        <p type="p">130:微透鏡</p>  
        <p type="p">B:交界</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">IL:介面層</p>  
        <p type="p">L:混光</p>  
        <p type="p">L1:第一光</p>  
        <p type="p">L2:第二光</p>  
        <p type="p">L3:第三光</p>  
        <p type="p">P1、P2:正投影</p>  
        <p type="p">S1:第一表面</p>  
        <p type="p">S2:第二表面</p>  
        <p type="p">S3:側壁面</p>  
        <p type="p">θ:夾角</p>  
        <p type="p">I-I’:剖線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="617" publication-number="202628756"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628756.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">H10K59/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿生光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOCARE OPTOELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳沛志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PEI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括基板、畫素單元、第一覆晶薄膜以及第二覆晶薄膜。基板具有彼此相對的第一側與第二側。畫素單元設置於基板上。第一覆晶薄膜設置於第一側上且透過第一導線電性連接至畫素單元。第二覆晶薄膜設置於第一側上且透過第二導線電性連接至畫素單元。第一覆晶薄膜與第二覆晶薄膜分別具有不同的功能。第一覆晶薄膜至少部分重疊於第二覆晶薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a substrate, a pixel unit, a first chip on film and a second chip on film. The substrate has a first side and a second side opposite to each other. The pixel unit is disposed on the substrate. The first chip on film is disposed on the first side and is electrically connected to the pixel unit through a first wire. The second chip on film is disposed on the first side and is electrically connected to the pixel unit through a second wire. The first chip on film and the second chip on film respectively have different functions. The first chip on film at least partially overlaps the second chip on film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:第一側</p>  
        <p type="p">112:第二側</p>  
        <p type="p">113:第三側</p>  
        <p type="p">114:第四側</p>  
        <p type="p">120:畫素單元</p>  
        <p type="p">130:電路層</p>  
        <p type="p">131:第一導線</p>  
        <p type="p">132:第二導線</p>  
        <p type="p">133:第三導線</p>  
        <p type="p">134:第四導線</p>  
        <p type="p">141:第一覆晶薄膜</p>  
        <p type="p">142:第二覆晶薄膜</p>  
        <p type="p">143:第三覆晶薄膜</p>  
        <p type="p">144:第四覆晶薄膜</p>  
        <p type="p">145:第五覆晶薄膜</p>  
        <p type="p">151:第一印刷電路板</p>  
        <p type="p">152:第二印刷電路板</p>  
        <p type="p">161:第一可撓性印刷電路板</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">C1:第一晶片</p>  
        <p type="p">C2:第二晶片</p>  
        <p type="p">C3、C4、C5:晶片</p>  
        <p type="p">PA:周邊區</p>  
        <p type="p">R1:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="618" publication-number="202625926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可撓曲錶鏈裝置</chinese-title>  
        <english-title>FLEXIBLE BRACELET DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">A44C5/02</main-classification>  
        <further-classification edition="200601120250930B">A44C11/00</further-classification>  
        <further-classification edition="200601120250930B">G04B47/04</further-classification>  
        <further-classification edition="200601120250930B">G04B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連鋐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN HONG ART CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峰誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FENG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可撓曲錶鏈裝置，用以供一可撓曲螢幕設置；包括一固定組件、一潰縮組件、複數錶鏈結構、以及複數支撐架；固定組件具有一第一端本體，潰縮組件具有一第二端本體，錶鏈結構排列為二排並分別樞接於第一端本體與第二端本體之間，支撐架則設於錶鏈結構所排列的所述二排之間，以供可撓曲螢幕設於支撐架上；其中，潰縮組件於第二端本體與鏈結構間更包含一潰縮板、一連接板、以及至少一彈性元件，且潰縮板結合於可撓曲螢幕一端，並與連接板作潰縮方向之相對位移，而彈性元件則彈性抵靠於潰縮板與連接板之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flexible bracelet device used for arranging a flexible screen including a fixing assembly, a shrink assembly, a plurality of bracelet structures, and a plurality of supporting flame. The fixing assembly has a first end-body. The shrink assembly has a second end-body. The bracelet structures are arranged in two rows and pivoted between the first end-body and the second end-body. The supporting flame is arranged between the two rows arranged by the bracelet structures such that the flexible screen may be arranged on the supporting flame. The shrink has a shrink plate, a connecting plate, and at least one elastic member between the second end-body and the bracelet structures. The shrink plate is combined to one end of the flexible screen and move along a shrink direction relative to the connecting plate. The elastic member is elastically abutted against between the shrink plate and the connecting plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固定組件</p>  
        <p type="p">10:第一端本體</p>  
        <p type="p">100:第一連接部</p>  
        <p type="p">101:第一連接槽</p>  
        <p type="p">11:第一飾板</p>  
        <p type="p">2:潰縮組件</p>  
        <p type="p">20:第二端本體</p>  
        <p type="p">200:收容臂</p>  
        <p type="p">201:第二連接槽</p>  
        <p type="p">21:潰縮板</p>  
        <p type="p">210:聯結部</p>  
        <p type="p">211:定位槽</p>  
        <p type="p">22:連接板</p>  
        <p type="p">220:第二連接部</p>  
        <p type="p">221:限位槽</p>  
        <p type="p">222:突緣</p>  
        <p type="p">23:彈性元件</p>  
        <p type="p">24:第二飾板</p>  
        <p type="p">3:錶鏈結構</p>  
        <p type="p">4:支撐架</p>  
        <p type="p">6:可撓曲螢幕</p>  
        <p type="p">60:無效端</p>  
        <p type="p">61:穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="619" publication-number="202628082"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628082.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具支援多序列存在檢測設定之記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE THAT SUPPORTS MULTIPLE SERIAL PRESENCE DETECT SETTINGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G11C5/02</main-classification>  
        <further-classification edition="200601120250502B">G11C5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>十銓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEAM GROUP INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭熙霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSI LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王威祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張錦峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIN FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具支援多序列存在檢測設定之記憶體裝置，其係一序列存在檢測模組設置於一基板上並電性連接複數個記憶體單元，該序列存在檢測模組電性連接一儲存元件，該儲存元件之一第一記憶體設定資料以及一第二記憶體設定資料分別支援一第一處理單元以及一第二處理單元，該第一處理單元以及該第二處理單元係不同運算處理電路，當該序列存在檢測模組電性連接該第一處理單元或該第二處理單元時，該序列存在檢測模組對應讀取該第一記憶體設定資料或該第二記憶體設定資料至支援之處理單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a memory device that supports multiple serial presence detect settings. It has a sequence presence detection module disposed on a substrate and electrically connected to a plurality of memory units. The sequence presence detection module is electrically connected. A storage element, a first memory setting data and a second memory setting data of the storage element respectively support a first processing unit and a second processing unit, the first processing unit and the second processing unit They are different computing processing circuits. When the sequence presence detection module is electrically connected to the first processing unit or the second processing unit, the sequence presence detection module correspondingly reads the first memory setting data or the second memory setting data. Memory configuration data to supported processing units.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:記憶體單元</p>  
        <p type="p">30:序列存在檢測模組</p>  
        <p type="p">32:儲存元件</p>  
        <p type="p">322:第一記憶體設定資料</p>  
        <p type="p">324:第二記憶體設定資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="620" publication-number="202625973"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625973.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編織物、應用其之穿戴式生理訊號偵測裝置及其生理訊號校正方法</chinese-title>  
        <english-title>BRAID FABRIC, WEARABLE PHYSIOLOGICAL SIGNAL DETECTION DEVICE USING THE SAME AND PHYSIOLOGICAL SIGNAL CORRECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241231B">A61B5/24</main-classification>  
        <further-classification edition="202101120241231B">A61B5/256</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鳴亜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MING-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李若屏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳譽元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉柏彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹竣宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙俊超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JUN-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">穿戴式生理訊號偵測裝置包括編織物、數個電極、生理訊號分析單元及應變訊號分析單元。編織物包括彈性纖維層及應變感測纖維層。應變感測纖維層與彈性纖維層結合。電極配置在編織物。生理訊號分析單元可從此些電極取得生理訊號。應變訊號分析單元電性連接於生理訊號分析單元及應變感測纖維層且可依據應變感測纖維層所感測之一應變感測訊號，取得一增益值，以及依據增益值，校正生理訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wearable physiological signal detection device includes a braid fabric, a plurality of electrodes, a physiological signal analysis unit and a strain signal analysis unit. The braided fabric includes an elastic fiber layer and a strain sensing fiber layer. The strain sensing fiber layer is combined with the elastic fiber layer. The electrodes are disposed on the braid. The physiological signal analysis unit may obtain physiological signals from the electrodes. The strain signal analysis unit is electrically connected to the physiological signal analysis unit and the strain sensing fiber layer, and may obtain a gain value based on a strain sensing signal sensed by the strain sensing fiber layer, and correct the physiological signal based on the gain value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:穿戴式生理訊號偵測裝置</p>  
        <p type="p">112:應變感測纖維層</p>  
        <p type="p">120:電極</p>  
        <p type="p">130:生理訊號分析單元</p>  
        <p type="p">140:應變訊號分析單元</p>  
        <p type="p">G:增益值</p>  
        <p type="p">V:應變感測訊號</p>  
        <p type="p">R:應變訊號與增益值關係</p>  
        <p type="p">S,S’:生理訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="621" publication-number="202626405"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626405.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有充電功能之機車</chinese-title>  
        <english-title>MOTORCYCLE WITH CHARGING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">B60R16/00</main-classification>  
        <further-classification edition="200601120250402B">B60K1/00</further-classification>  
        <further-classification edition="201901120250402B">B60L50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泊琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有充電功能之機車，包括一車殼、一充電座以及一防水蓋。該車殼包括一車殼開口。充電座設於該車殼開口之內，其中，該充電座包括一充電埠。防水蓋從該車殼開口內延伸至該車殼開口之外，並適於覆蓋該充電座之該充電埠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motorcycle with charging function is provided. The motorcycle includes a housing, a charging port and a waterproof cover. The housing includes a housing opening. The charging port is positioned within the housing opening and includes a charging interface. The waterproof cover extends from inside the housing opening to the outside and is configured to cover the charging interface of the charging port.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:車殼開口</p>  
        <p type="p">111:開口上緣</p>  
        <p type="p">112:開口下緣</p>  
        <p type="p">12:遮膝蓋</p>  
        <p type="p">3:防水蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="622" publication-number="202627436"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627436.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓力感測裝置</chinese-title>  
        <english-title>PRESSURE SENSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G01L7/08</main-classification>  
        <further-classification edition="200601120260401B">G01L9/04</further-classification>  
        <further-classification edition="202601120260401B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許忠龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUNG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曠舉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUANG-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種壓力感測裝置，位於承載晶圓之上，包括空腔、壓力感測膜及至少一柱狀結構。空腔位於承載晶圓內。壓力感測膜與空腔接觸，包括埋藏氧化層，以及裝置層，位於埋藏氧化層之上。柱狀結構位於空腔內，支撐壓力感測膜，以防止壓力感測膜在製程中及使用時破裂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a pressure sensing device, located on a handling wafer, including a cavity, a pressure sensing membrane and at least one pillar structure. The cavity is within the handling wafer. The pressure sensing membrane contacts the cavity, including a BOX layer and a device layer above the BOX layer. The pillar structure is within the cavity and supports the pressure sensing membrane to prevent the pressure sensing membrane from breaking in the manufacturing process and in usage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403:柱狀結構</p>  
        <p type="p">404:BOX層</p>  
        <p type="p">406:裝置層</p>  
        <p type="p">410:空腔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="623" publication-number="202628308"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628308.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池管理系統及用於更新電池管理系統的從裝置的韌體的方法</chinese-title>  
        <english-title>BATTERY MANAGEMENT SYSTEM AND METHOD FOR UPDATING FIRMWARE OF SLAVE DEVICES OF BATTERY MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250501B">H02J7/02</main-classification>  
        <further-classification edition="201901120250501B">G06F1/3212</further-classification>  
        <further-classification edition="200601120250501B">G06F13/38</further-classification>  
        <further-classification edition="201901120250501B">G01R31/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連恩微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRACE CONNECTION MICROELECTRONICS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳培煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的一方面提供一種用於藉由電池管理系統中的主裝置更新各從裝置的韌體的方法，包括：由主裝置接收用於更新的韌體映像，並發送韌體映像至多個從裝置；由接收到韌體映像的從裝置轉發至其他從裝置，直到預定順序中的最後一個從裝置接收到韌體映像，並回傳確認訊息至主裝置。具有該韌體映像的從裝置使用韌體映像對從裝置的本身進行韌體更新。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for updating firmware of each slave device by a master device, in a battery management system, is provided by an aspect of the present disclosure. The method comprises: receiving a firmware image for updating by the master device, and transmitting the firmware image to one of the salve devices; the slave device forwarding the received firmware image to another slave device until the last slave device in the predetermined order receiving the firmware image and replying a acknowledge information to the master device. Each slave device with the firmware image updates its own firmware by using the firmware image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200M:主控制裝置</p>  
        <p type="p">200S&lt;sub&gt;1&lt;/sub&gt;~200S&lt;sub&gt;N&lt;/sub&gt;:電池監測裝置</p>  
        <p type="p">400:韌體映像</p>  
        <p type="p">400-1~400-M:片段</p>  
        <p type="p">500,500-1~500-M:確認訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="624" publication-number="202627757"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627757.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池管理系統及用於電池管理系統的省電模式的操作方法</chinese-title>  
        <english-title>BATTERY MANAGEMENT SYSTEM AND OPERATING METHOD FOR POWER-SAVING MODE OF BATTERY MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250501B">G06F1/3212</main-classification>  
        <further-classification edition="201601120250501B">H02J7/02</further-classification>  
        <further-classification edition="200601120250501B">G06F13/38</further-classification>  
        <further-classification edition="201901120250501B">G01R31/396</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連恩微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRACE CONNECTION MICROELECTRONICS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳培煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於電池管理系統的省電模式操作方法。操作方法包括：由主裝置發送省電模式命令至其中一從裝置；由從裝置轉發所接收的省電模式命令至其他從裝置，且從裝置根據省電模式命令進入深眠模式；以及其他從裝置繼續轉發省電模式命令及進入深眠模式，直到位於預定順序中的最後一個從裝置接收到省電模式命令，並進入深眠模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An operating method for power-saving mode of battery management system. The operating method comprises: the master device transmitting a power-saving mode command to one of slave devices; the one of salve devices forwarding the power-saving mode command to another slave device, and entering a deep sleep mode; another slave device keeps forwarding the power-saving mode command, and entering a deep sleep mode until the last slave device in the predetermined order receiving the power-saving mode command, and entering the deep sleep mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200M:主控制裝置</p>  
        <p type="p">200S&lt;sub&gt;1&lt;/sub&gt;~200S&lt;sub&gt;N&lt;/sub&gt;:電池監測裝置</p>  
        <p type="p">400:訊息</p>  
        <p type="p">500:確認訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="625" publication-number="202626426"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626426.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150934</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">B62K21/00</main-classification>  
        <further-classification edition="200601120250402B">B62K21/26</further-classification>  
        <further-classification edition="200601120250402B">B62J7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰川工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRONBLA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉斯穆森　比亞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RASMUSSEN, BJARKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡銘韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭文昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖益正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自行車包含一車體及一轉向系統，該車體包含一車架、一後車輪以及一前車輪，該車架包含由後向前依序連接的一車架主體、一貨架以及一前叉，該後車輪結合於該車架主體後側，該車架主體前側具有一轉軸管，該貨架樞接於該車架主體的前側，該貨架的前側具有一頭管，該前叉可轉動地穿置於該頭管，該前車輪結合於該前叉；該轉向系統包含一轉軸、一車手把以及一轉向連動裝置，該轉軸可轉動地穿置於該轉軸管，該車手把結合於該轉軸上端，該轉向連動裝置連接該轉軸與該前叉，配合該貨架可相對於該車架主體旋轉的設計，以降低該自行車的迴轉半徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:自行車</p>  
        <p type="p">20:車體</p>  
        <p type="p">22:車架</p>  
        <p type="p">222:車架主體</p>  
        <p type="p">222a:轉軸管</p>  
        <p type="p">224:貨架</p>  
        <p type="p">224a:頭管</p>  
        <p type="p">224b:第一軸套</p>  
        <p type="p">224c:第二軸套</p>  
        <p type="p">224d:底座</p>  
        <p type="p">224e:收摺桿</p>  
        <p type="p">226:前叉</p>  
        <p type="p">24:後車輪</p>  
        <p type="p">26:前車輪</p>  
        <p type="p">40:轉向系統</p>  
        <p type="p">42:轉向連動裝置</p>  
        <p type="p">43:車手把</p>  
        <p type="p">44:貨架轉向裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="626" publication-number="202626867"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626867.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150936</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高遮蔽及高白度之聚醯亞胺膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">C08G73/10</main-classification>  
        <further-classification edition="200601120250113B">C08J5/18</further-classification>  
        <further-classification edition="200601120250113B">C08K3/22</further-classification>  
        <further-classification edition="200601120250113B">C08K3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達邁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIMIDE TECHNOLOGY INCOPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡家量</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳治諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種高遮蔽及高白度之聚醯亞胺膜，係包括：一聚醯亞胺聚合物，係由二胺單體與二酐單體反應所得，該二胺單體為苯二胺(PDA)及2,2'-雙(三氟甲基)聯苯胺(TFMB)，且該二酐單體為3,3',4,4'-聯苯四羧酸二酸酐(BPDA)；其中，以該二胺單體之總莫耳數為基準，PDA為16至25mole%，而TFMB為75至84mole%；以及多種呈色填料，係分佈於該聚醯亞胺聚合物中。該聚醯亞胺具有低光澤度gloss：3-10 GU，且L*值為80-90,b*值為1.8-5.5，穿透度為3-15%。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="627" publication-number="202626376"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626376.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150937</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴墨印刷頭</chinese-title>  
        <english-title>INKJET PRINTHEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250528B">B41J2/175</main-classification>  
        <further-classification edition="200601120250528B">B41J2/135</further-classification>  
        <further-classification edition="200601120250528B">B41J2/14</further-classification>  
        <further-classification edition="200601120250528B">B41J2/06</further-classification>  
        <further-classification edition="200601120250528B">B05B5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商恩傑特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENJET CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邊渡泳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, DO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柄直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, BYUNGJIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里　沙希爾莫希丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHALIL, SHAHEER MOHIUDDIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成百訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEONG, BAEK HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭在祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOUNG, JAEWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔在鎔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JAEYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種噴墨印刷頭，其特徵在於，包括：印刷頭部，形成有多個噴嘴；多個第一電極，對於多個噴嘴中的每個噴嘴，形成在噴嘴的內部；第二電極，形成在該印刷頭部的內部，並被施加透過電流體動力學方式噴射溶液的電壓；電壓控制器，用於對該第二電極施加規定的電壓；及控制部，對於多個噴嘴中的每個噴嘴，控制該第一電極接地或不被電連接，該控制部用於當該第一電極接地時使得溶液不被噴射，並且當該第一電極未被電連接時使得在該第一電極上產生感應電壓來噴射溶液，從而對各噴嘴獨立地控制溶液噴射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:噴嘴</p>  
        <p type="p">110:第一噴嘴層</p>  
        <p type="p">111:凸出部</p>  
        <p type="p">112:第一腔室</p>  
        <p type="p">113:噴嘴孔</p>  
        <p type="p">120:第二噴嘴層</p>  
        <p type="p">122:第二腔室</p>  
        <p type="p">130:第一電極</p>  
        <p type="p">140:第二電極</p>  
        <p type="p">150:開關</p>  
        <p type="p">160:電壓控制器</p>  
        <p type="p">170:第三電極</p>  
        <p type="p">200:接地電極</p>  
        <p type="p">A:距離</p>  
        <p type="p">B:距離</p>  
        <p type="p">S:被印刷物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="628" publication-number="202626363"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626363.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶高分子膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">B32B27/08</main-classification>  
        <further-classification edition="201901120250402B">B32B7/02</further-classification>  
        <further-classification edition="200601120250402B">C08G73/10</further-classification>  
        <further-classification edition="200601120250402B">H05K1/03</further-classification>  
        <further-classification edition="200601120250402B">H05K3/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達邁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIMIDE TECHNOLOGY INCOPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佳勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐仲彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHONG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種液晶高分子膜，用於貼合銅箔使其具有接著力大於0.8Kgf/cm，該膜具有於頻率10GHz、相對濕度為100%條件下之介電損耗小於0.005、50~200℃條件下之熱膨脹係數0~30ppm/℃；液晶高分子膜包括有一液晶高分子層與聚醯亞胺層，液晶高分子層具有在頻率10GHz、相對濕度為100%條件下之介電損耗小於0.005、50~200℃條件下之熱膨脹係數為0~30ppm/℃；聚醯亞胺層分別配置於上述液晶高分子層上下，且其在頻率10GHz、相對濕度為100%條件下之介電損耗小於0.005。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:液晶高分子膜</p>  
        <p type="p">11:液晶高分子層</p>  
        <p type="p">12:聚醯亞胺層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="629" publication-number="202625910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>菱角剝殼輔助裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250126B">A23N5/00</main-classification>  
        <further-classification edition="200601120250126B">B02C23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立屏東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪芝青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIH-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐弘力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳郁欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種菱角剝殼輔助裝置，用以解決以往菱角剝殼不易的問題。本發明的菱角剝殼輔助裝置包含：一基座，包括一底座及一立架；一菱角架設台，包括一工作台及一夾固器，該工作台固設於該底座，該工作台具有一鑿刺空間鄰接一抵持部，該夾固器適於彈性抵接一菱角外殼，並將該菱角外殼夾固於該夾固器與該抵持部之間，且該菱角外殼至少有局部對位於該鑿刺空間；及一鑿刺模組，包括一刀座及一手柄，該刀座適於組裝一鑿刺刀，該手柄樞接於該立架，並可連動該刀座朝該工作台的鑿刺空間靠近或遠離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基座</p>  
        <p type="p">11:底座</p>  
        <p type="p">12:立架</p>  
        <p type="p">2:菱角架設台</p>  
        <p type="p">21:工作台</p>  
        <p type="p">215:冷風管</p>  
        <p type="p">22:夾固器</p>  
        <p type="p">3:鑿刺模組</p>  
        <p type="p">31:刀座</p>  
        <p type="p">32:手柄</p>  
        <p type="p">34:第二導桿</p>  
        <p type="p">35:連動桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="630" publication-number="202628472"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628472.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高光譜邊緣運算系統及邊緣運算裝置</chinese-title>  
        <english-title>HYPERSPECTRAL EDGE COMPUTING SYSTEM AND EDGE COMPUTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250512B">H04W88/02</main-classification>  
        <further-classification edition="200601120250512B">G01J3/28</further-classification>  
        <further-classification edition="202201120250512B">G06V10/77</further-classification>  
        <further-classification edition="200601120250512B">G06N3/06</further-classification>  
        <further-classification edition="202301120250512B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳博勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, ZHI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯文清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, WEN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露有關於一種邊緣運算裝置，包括：輸入輸出介面，用於接收高光譜影像陣列，高光譜影像陣列包含對應多個波長的多張高光譜影像；處理器，耦接至輸入輸出介面；記憶體，耦接至處理器及輸入輸出介面及用於儲存高光譜影像陣列，且高光譜影像陣列於記憶體中具有第一資料量；深度學習加速器，耦接至處理器及記憶體及用於執行至少一機器學習演算法。處理器控制深度學習加速器存取記憶體中的高光譜影像陣列，並使用至少一機器學習演算法對高光譜影像陣列中的多張高光譜影像進行特徵截取，以形成降維高光譜影像資料並儲存於記憶體。降維高光譜影像資料於記憶體中具有第二資料量，且第二資料量小於第一資料量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to an edge computing device including: an I/O configured for receive a hyperspectral image array including multiple hyperspectral images corresponding to multiple wavelengths; a processor coupled to the I/O; a memory coupled to the processor and the I/O and configured to store the hyperspectral image array with a first data volume; a DLA coupled to the processor and the memory and configured to perform at least one ML algorithm. The processor controls the DLA to access the hyperspectral image array stored in the memory, and perform the at least one ML algorithm to extract features from the multiple hyperspectral images of the hyperspectral image array, to obtain a dimension-reduction hyperspectral image data for storing in the memory. The dimension-reduction hyperspectral image data has a second data volume, and the second data volume is less than the first data volume.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:邊緣運算裝置</p>  
        <p type="p">111:處理器</p>  
        <p type="p">112:記憶體</p>  
        <p type="p">113:DLA</p>  
        <p type="p">114:GPU</p>  
        <p type="p">115:儲存裝置</p>  
        <p type="p">116:輸入/輸出介面116</p>  
        <p type="p">117:匯流排/介面</p>  
        <p type="p">118:加法乘法數位電路</p>  
        <p type="p">119:比較器電路</p>  
        <p type="p">120:高光譜感測器</p>  
        <p type="p">200:高光譜影像陣列</p>  
        <p type="p">300:降維高光譜影像資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="631" publication-number="202626143"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626143.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生殖器光療裝置及其穿戴式光療罩</chinese-title>  
        <english-title>PHOTOTHERAPY DEVICE FOR GENITALIA AND WEARABLE PHOTOTHERAPY COVER THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">A61N5/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳崇揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳崇揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生殖器光療裝置，包含一充電底座以及一光療罩。充電底座係具有一供電模組，該供電模組具有二供電端子。光療罩係可分離地對接於該充電底座，並且包含一外殼罩、一透明內罩以及一電路模組。透明內罩係固定於該外殼罩內，與該外殼罩圍構出一罩體容置空間，並開設有二充電孔，且該透明內罩之內表面設有複數個光擴散導引凸塊。電路模組係設置於該罩體容置空間，具有複數個發光元件與二充電接點，該些發光元件係分別對準該些光擴散導引凸塊，該二充電接點係分別對應地自該二充電孔露出，藉以在該光療罩對接於該充電底座時，分別對應地電性連接該二供電端子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A phototherapy device for genitalia includes a charging base and a phototherapy cover. The charging base is equipped with a power supply module that has two power terminals. The phototherapy cover is detachably connected to the charging base and consists of an outer shell, a transparent inner cover, and a circuit module. The transparent inner cover is fixed inside the outer shell, forming a containment space between the two, and it has two charging holes. The inner surface of the transparent inner cover is equipped with multiple light diffusion guide bumps. The circuit module, located in the containment space, includes several light-emitting elements and two charging contacts. These light-emitting elements are aligned with the light diffusion guide bumps, and the two charging contacts are exposed through the two charging holes, enabling an electrical connection with the two power terminals when the phototherapy cover is docked onto the charging base.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:生殖器光療裝置</p>  
        <p type="p">1:充電底座</p>  
        <p type="p">11:底座本體</p>  
        <p type="p">1121:消毒燈孔</p>  
        <p type="p">1122:電源燈孔</p>  
        <p type="p">1123:端子通孔</p>  
        <p type="p">122:消毒燈</p>  
        <p type="p">124:供電端子</p>  
        <p type="p">125:連接埠</p>  
        <p type="p">2:光療罩</p>  
        <p type="p">221:光擴散導引凸塊</p>  
        <p type="p">222:充電孔</p>  
        <p type="p">247:充電接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="632" publication-number="202628032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘極驅動器</chinese-title>  
        <english-title>GATE DRIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250106B">G09G3/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵昌民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, CHANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅睿騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, JUI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種閘極驅動器。閘極驅動器電連接於顯示面板，且閘極驅動器包含N級閘極驅動電路。第n級閘極驅動電路包含：內節點設定電路、內節點穩壓電路、下拉模組與輸出信號產生模組。內節點設定電路在啟動期間接收啟動脈衝，以及在結束期間接收結束脈衝。啟動期間早於結束期間，且啟動期間與結束期間等長。內節點穩壓電路選擇性將第一供應電壓傳導至第一內節點。下拉模組選擇性將第二供應電壓傳導至第一內節點。輸出信號產生模組選擇性將列選取時脈信號傳導至像素閘極信號線與當級續傳信號線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gate driver is provided. The gate driver is electrically connected to a display panel, and the gate driver includes N stage gate driving circuits. An n-th stage gate driving circuit among the N stage gate driving circuits includes an internal node setting circuit, an internal node stabilizing circuit, a pull-down module, and an output signal generation module. The internal node setting circuit receives a starting pulse during a start duration and receives an end pulse during an end duration. The start duration is earlier than the end duration. The start duration and the end duration have the same length. The internal node stabilizing circuit selectively conducts a first supply voltage to the first internal node. The pull-down module selectively conducts a second supply voltage to the first internal node. The output signal generation module selectively conducts a row selection timing signal to a pixel-gating signal line and a current stage transmission line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">goaCKT[n]-1A:閘極驅動電路</p>  
        <p type="p">RST:重置信號(線)</p>  
        <p type="p">ST[n-p]:前級續傳信號(線)</p>  
        <p type="p">ST[n+q],ST[n+p]:後級續傳信號(線)</p>  
        <p type="p">U2D,D2U:啟用方向設定信號(線)</p>  
        <p type="p">VGH:正供應電壓(線)</p>  
        <p type="p">VGL:負供應電壓(線)</p>  
        <p type="p">insCKT[n]:內節點設定電路</p>  
        <p type="p">ND&lt;sub&gt;I&lt;/sub&gt;[n],ND&lt;sub&gt;P&lt;/sub&gt;[n],ND&lt;sub&gt;Q&lt;/sub&gt;[n]:內節點</p>  
        <p type="p">dbstCKT[n]:單向升壓電路</p>  
        <p type="p">ggCKT[n]:閘極信號產生電路</p>  
        <p type="p">stgCKT[n]:續傳信號產生電路</p>  
        <p type="p">outMDL[n]:輸出信號產生模組</p>  
        <p type="p">HC[k]:列選取時脈信號(線)</p>  
        <p type="p">ST[n]:當級續傳信號(線)</p>  
        <p type="p">G[n]:像素閘極信號(線)</p>  
        <p type="p">XDONB:全閘極反向啟用信號(線)</p>  
        <p type="p">pdMDL:下拉模組</p>  
        <p type="p">npdCKT[n]:內節點下拉電路</p>  
        <p type="p">opdCKT[n]:輸出信號下拉電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="633" publication-number="202627352"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627352.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸頂燈接電結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250124B">F21V23/06</main-classification>  
        <further-classification edition="200601120250124B">F21V17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞眾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王承威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種吸頂燈接電結構，具有一燈體及一接電座，燈體具有由一內導電環及一外導電環構成之插座，而接電座具有可與燈體之插座相互對接的套環部，其中：套環部上設有一第一導電片及一第二導電片，第一導電片具有延伸至內、外導電環之間的第一彈抵段，且於第一彈抵段上形成有與外導電環之內周緣曲度相符之第一靠抵弧面，而第二導電片具有延伸至內導電環內部之第二彈抵段，且於第二彈抵段上形成有與內導電環之內周緣曲度相符之第二靠抵弧面，使燈體以其插座與接電座之套環部相互對接時，第一導電片與第二導電片可分別與外導電環及內導電環之內周緣構成面接觸之接電型態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:燈體</p>  
        <p type="p">12:安裝槽</p>  
        <p type="p">14:插座</p>  
        <p type="p">141:內導電環</p>  
        <p type="p">142:外導電環</p>  
        <p type="p">21:接電座</p>  
        <p type="p">22:套環部</p>  
        <p type="p">223:組設座</p>  
        <p type="p">31:第一導電片</p>  
        <p type="p">32:第二導電片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="634" publication-number="202628399"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628399.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150951</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊行為的診斷系統、裝置及方法</chinese-title>  
        <english-title>DIAGNOSTIC SYSTEM, DEVICE AND METHOD FOR COMMUNICATION BEHAVIOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">H04L43/02</main-classification>  
        <further-classification edition="202201120250401B">H04L43/04</further-classification>  
        <further-classification edition="200901120250401B">H04W24/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>四零四科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOXA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖崑霳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, KUN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉興漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSING-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種通訊行為的診斷系統。上述診斷系統包括一無線元件，配置以與一內部網路通訊，以及一診斷裝置。上述診斷裝置包括一數據接收模組，配置以接收來自上述無線元件的至少一日誌紀錄；一特徵識別模組，配置以接收並識別上述日誌紀錄是否具有至少一關鍵特徵資料；一事件偵測模組，配置以匹配出對應於上述關鍵特徵資料的至少一事件；以及，一處理模組，配置以執行對應於上述事件的至少一特定操作。上述事件表示上述無線元件的通訊行為。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diagnostic system for communication behavior is provided. The diagnostic system includes a wireless device configured to communicate with an intranet, and a diagnostic device. The diagnostic device includes a data receiving module configured to receive at least one log data from the wireless device; a feature identification module configured to receive the log data and identify whether the log data has at least one key feature data; an event detection module configured to obtain an event corresponding to the key feature data; and a processing module configured to perform a specific operation corresponding to the event. The event represents a communication behavior of the wireless device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:診斷系統</p>  
        <p type="p">105:網路</p>  
        <p type="p">110:無線元件</p>  
        <p type="p">120:診斷裝置</p>  
        <p type="p">130:數據接收模組</p>  
        <p type="p">135:通訊介面電路</p>  
        <p type="p">140:特徵識別模組</p>  
        <p type="p">142,152,162:記憶體</p>  
        <p type="p">150:事件偵測模組</p>  
        <p type="p">160:處理模組</p>  
        <p type="p">Action_Set:操作設定</p>  
        <p type="p">Data_Log:日誌紀錄</p>  
        <p type="p">E:事件</p>  
        <p type="p">P:關鍵特徵資料</p>  
        <p type="p">Table_E:事件表</p>  
        <p type="p">Table_P:特徵表</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="635" publication-number="202627968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合式能源最佳化調度方法及系統</chinese-title>  
        <english-title>A METHOD AND SYSTEM FOR OPTIMAL SCHEDULING OF COMPOSITE ENERGY SOURCES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260302B">G06Q50/06</main-classification>  
        <further-classification edition="202301120260302B">G06Q10/04</further-classification>  
        <further-classification edition="202601120260302B">H02J3/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧陽能控股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREEN SHEPHERD CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宇翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温啟良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, QI LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種複合式能源最佳化調度方法及系統，係經由使用者選擇以最大利潤、最小成本、最低碳排量或最大強韌其中一種優化目標的能源調度方案，經過動態線性規劃取得複合式能源中，如光電能源、儲能能源、市電能源、低碳發電機能源的供電排序及所分配的電能，使複合式能源依此供電排序及各能源被分配的電能供給設備端；據此，達到符合使用者所希冀之優化目標需求的複合式能源最佳調度功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method and system for optimal scheduling of composite energy sources, in which a user selects an energy scheduling scheme that maximizes profit, minimizes cost, minimizes carbon emissions, or maximizes toughness for one of the optimization goals, and obtains the sequencing of power supply and the allocated power for composite energy sources such as photovoltaic power, energy storage, utility power, and low carbon power generator energy sources through dynamic linear planning, so that composite energy sources can be supplied to the equipment side according to the power supply sequencing and the allocated power for each energy source. Based on this, the optimal scheduling effect of composite energy that meets the optimization target requirements desired by the user is achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:優化目標選擇單元</p>  
        <p type="p">2:資料庫</p>  
        <p type="p">3:動態線性規劃單元</p>  
        <p type="p">5:複合式能源控制單元</p>  
        <p type="p">6:設備端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="636" publication-number="202625986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>植入物</chinese-title>  
        <english-title>IMPLANT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61F2/44</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KUO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佩宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃馨怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉淑芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHU-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詩萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林登泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DEN-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范瑋倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種植入物，包括本體、限位部及填充部。本體具有第一端部、相對於第一端部的第二端部及中間部設置於第一端部與第二端部之間。限位部包括第一實心結構且位於第一端部。填充部包括一彈性結構，且位於中間部至第二端部。本體的第一端部的徑長大於中間部的徑長，且第二端部的徑長大於中間部的徑長。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An implant is provided, and the implant includes a body, a limiting portion and a filling portion. The body has a first end portion, a second end opposite to the first end portion, and a middle portion disposed between the first end portion and the second end portion. The limiting portion includes a first solid structure and located at the first end portion. The filling part includes an elastic structure and located from the middle portion to the second end portion. A diameter of the first end portion of the body is greater than a diameter of the middle portion, and a diameter of the second end portion is greater than the diameter of the middle portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:植入物</p>  
        <p type="p">10:本體</p>  
        <p type="p">11a:限位部</p>  
        <p type="p">12a:填充部</p>  
        <p type="p">13:多孔隙結構</p>  
        <p type="p">14:鏤空結構</p>  
        <p type="p">111:第一實心結構</p>  
        <p type="p">121:彈性結構</p>  
        <p type="p">122:內縮部</p>  
        <p type="p">124a:開放部</p>  
        <p type="p">131:孔洞結構</p>  
        <p type="p">1221:第一區域</p>  
        <p type="p">1222:第二區域</p>  
        <p type="p">1223:第三區域</p>  
        <p type="p">1224,1225:箭頭</p>  
        <p type="p">1311:孔隙</p>  
        <p type="p">d1:最小直徑</p>  
        <p type="p">d2,d3:最大直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="637" publication-number="202627989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體物件偵測方法與立體物件偵測系統</chinese-title>  
        <english-title>3D OBJECT DETECTION METHOD AND 3D OBJECT DETECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250401B">G06T7/70</main-classification>  
        <further-classification edition="201701120250401B">G06T7/73</further-classification>  
        <further-classification edition="202201120250401B">G06V20/58</further-classification>  
        <further-classification edition="202201120250401B">G06V20/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹巧同</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHIAO-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像立體物件偵測方法包含使用相機偵測物件的複數個特徵點；利用地圖資訊以獲得複數個之地圖特徵點初始值；利用粗匹配相機偵測點群和地圖初始特徵點群計算相機的低維定位；利用被偵測出之特徵點與相機的複數個參數形成角錐網格集合；利用角錐網格集合修正地圖特徵點初始值，以獲得複數個偵測出之匹配立體特徵點與相機的精確定位；以及利用上述計算結果以及地圖特徵獲得其餘未被匹配之物件的立體位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for 3D object detection in images involves the following steps: using a camera image to detect multiple feature points from surrounding objects; leveraging map data to obtain a set of initial map feature points; calculating the camera's low-dimensional position by performing coarse matching between the detected feature points and the initial map feature points; constructing a pyramid mesh set based on the detected feature points and various camera parameters; refining the initial map feature points using the pyramid mesh set to accurately determine the positions of the 3D feature points and the precise location of the camera; and finally, the calculation results and map features were used to obtain the 3D positions of the remaining unmatched objects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:立體物件偵測系統</p>  
        <p type="p">110:相機</p>  
        <p type="p">120:地圖資訊模組</p>  
        <p type="p">130:粗匹配模組</p>  
        <p type="p">140:計算模組</p>  
        <p type="p">150:匹配模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="638" publication-number="202627444"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627444.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過潤滑油檢測陶胚裂縫之方法</chinese-title>  
        <english-title>METHOD FOR INSPECTING CRACKS ON GREENWARE USING LUBRICANT OIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G01N19/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王振興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JENN SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勛平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSUN PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃晢文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHE WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王柏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王介勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIE YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種透過潤滑油檢測陶胚裂縫之方法，將聚乙二醇加水混練於一陶土材料中，其混練比例係採用重量百分比為1~5之該聚乙二醇，重量百分比為10~35之該水，餘量則為該陶土材料；將混練有該聚乙二醇之陶土材料成型為陶胚；將該陶胚放入於潤滑油中，使得潤滑油均勻的滲入該陶胚內，並與該聚乙二醇反應形成為一膨潤材，該陶胚及該潤滑油浸泡之重量比例係為1：7~9；對該陶胚加熱至50℃~150℃；該膨潤材受熱後膨脹，經由該陶胚表面的裂縫處擠出，並於表面堆積形成隆起凸出物，藉以作為該陶胚的裂縫之標示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="639" publication-number="202626564"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626564.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判斷陶坯中聚乙二醇分布的方法</chinese-title>  
        <english-title>METHOD FOR DETERMINING DISTRIBUTION OF POLYETHYLENE GLYCOL IN GREENWARE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">C04B41/82</main-classification>  
        <further-classification edition="200601120250613B">C04B35/634</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王振興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JENN SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勛平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSUN PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃晢文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHE WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王柏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王介勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIE YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種判斷陶坯中聚乙二醇分布的方法，包含：將一聚乙二醇、一水以及一陶土以一混合參數混合成型為一陶坯；將該陶坯部分或全部接觸一液態油體，並在攝氏45度至145度保持10分鐘至4小時，使該液態油體滲入該陶坯內反應而形成一反應區；觀察該陶坯中該反應區內的顏色分布；當該陶坯在該反應區內存在有一色差，判斷該聚乙二醇在該反應區內集中分布；當該陶坯在該反應區內不存在有該色差，判斷該聚乙二醇在該反應區內均勻分布。藉此，即可在油煮之後輕鬆以肉眼判斷聚乙二醇的分布。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="640" publication-number="202627470"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627470.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水質檢測系統</chinese-title>  
        <english-title>WATER QUALITY DETECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">G01N33/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>總翔企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANATEK ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪德裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TE-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張健國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN-KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高靜瑢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, JING-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種非採用人工取樣分析的水質檢測系統，該水質檢測系統係包括一水樣檢測設備、一水樣容器與一水樣檢測控制模組。該水樣容器係可容納一水樣。該水樣檢測控制模組係可令該水樣容器對該水樣檢測控制模組提供定量的該水樣，使該水樣檢測設備可依據規範要求檢測該水樣的水質，以解決習知透過人工取樣方析方式達成水質檢測的種種技術問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A water quality detection system that does not rely on manual sampling and analysis. This water quality detection system includes a water sample detection device, a water sample container, and a water sample detection control module. The water sample container is designed to hold a water sample. The water sample detection control module enables the water sample container to provide a quantified amount of the water sample to the detection control module, allowing the water sample detection device to test the water quality in accordance with regulatory requirements. This system addresses various technical issues associated with conventional water quality detection methods that rely on manual sampling and analysis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:水質檢測系統</p>  
        <p type="p">11:水樣檢測設備</p>  
        <p type="p">111:水樣濾材</p>  
        <p type="p">12:水樣容器</p>  
        <p type="p">121:水樣流入通道</p>  
        <p type="p">1211:水樣流入引導結構</p>  
        <p type="p">122:水樣容納空間</p>  
        <p type="p">HL:水樣檢測高水位</p>  
        <p type="p">LL:水樣檢測低水位</p>  
        <p type="p">13:水樣提供模組</p>  
        <p type="p">131:水樣增壓設備</p>  
        <p type="p">14:連續式水位量測設備</p>  
        <p type="p">151:水樣檢測控制模組</p>  
        <p type="p">1511:水樣檢測計時設備</p>  
        <p type="p">152:水樣排出控制模組</p>  
        <p type="p">16:水樣流入引導構件</p>  
        <p type="p">17:水樣排出模組</p>  
        <p type="p">181:水樣檢測啟閉設備</p>  
        <p type="p">182:水樣排出啟閉設備</p>  
        <p type="p">183:水樣提供啟閉設備</p>  
        <p type="p">184:氣體洩除通道啟閉設備</p>  
        <p type="p">185:氣體提供通道啟閉設備</p>  
        <p type="p">19:壓力調整模組</p>  
        <p type="p">1911:氣體提供通道</p>  
        <p type="p">1912:氣體提供設備</p>  
        <p type="p">1921:氣體洩除通道</p>  
        <p type="p">1922:氣體洩除設備</p>  
        <p type="p">10:壓力感測設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="641" publication-number="202627471"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627471.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水質檢測系統</chinese-title>  
        <english-title>WATER QUALITY DETECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">G01N33/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>總翔企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANATEK ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪德裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TE-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張健國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN-KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高靜瑢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, JING-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡崑山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, KUN-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種非採用人工取樣分析的水質檢測系統，該水質檢測系統係包括一水樣檢測設備、一水樣容納空間、一壓力調整模組與一水樣檢測控制模組。該水樣容納空間係可容納一水樣。該壓力調整模組係可調整該水樣容納空間的氣體壓力值，使該水樣容納空間所容納的該水樣的水壓符合規範。該水樣檢測控制模組係可令該水樣容納空間對該水樣檢測模組提供水壓符合規範的該水樣，以解決習知透過人工取樣方析方式達成水質檢測的種種技術問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A water quality detection system that does not rely on manual sampling and analysis. This water quality detection system comprises a water sample detection device, a water sample containment space, a pressure adjustment module, and a water sample detection control module. The water sample containment space is designed to hold a water sample. The pressure adjustment module can regulate the air pressure within the water sample containment space to ensure that the water pressure of the contained water sample meets the required standards. The water sample detection control module enables the water sample containment space to provide the water sample with the regulated water pressure to the detection module, addressing various technical issues associated with conventional water quality detection methods that rely on manual sampling and analysis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:水質檢測系統</p>  
        <p type="p">11:水樣檢測設備</p>  
        <p type="p">111:水樣濾材</p>  
        <p type="p">12:水樣容器</p>  
        <p type="p">121:水樣流入通道</p>  
        <p type="p">1211:水樣流入引導結構</p>  
        <p type="p">122:水樣容納空間</p>  
        <p type="p">HL:水樣檢測高水位</p>  
        <p type="p">LL:水樣檢測低水位</p>  
        <p type="p">13:水樣提供模組</p>  
        <p type="p">131:水樣增壓設備</p>  
        <p type="p">14:水位量測設備</p>  
        <p type="p">151:水樣檢測控制模組</p>  
        <p type="p">1511:水樣檢測計時設備</p>  
        <p type="p">152:水樣排出控制模組</p>  
        <p type="p">16:水樣流入引導構件</p>  
        <p type="p">17:水樣排出模組</p>  
        <p type="p">181:水樣檢測設備啟閉設備</p>  
        <p type="p">182:水樣排出啟閉設備</p>  
        <p type="p">183:水樣提供啟閉設備</p>  
        <p type="p">184:氣體洩除通道啟閉設備</p>  
        <p type="p">185:氣體提供通道啟閉設備</p>  
        <p type="p">19:壓力調整模組</p>  
        <p type="p">1911:氣體提供通道</p>  
        <p type="p">1912:氣體提供設備</p>  
        <p type="p">1921:氣體洩除通道</p>  
        <p type="p">1922:氣體洩除設備</p>  
        <p type="p">10:壓力感測設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="642" publication-number="202627382"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627382.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150966</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷散熱模組及具有該液冷散熱模組的電子裝置</chinese-title>  
        <english-title>LIQUID COOLING HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE HAVING THE LIQUID COOLING HEAT DISSIPATION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">F28D1/00</main-classification>  
        <further-classification edition="200601120250422B">G06F1/20</further-classification>  
        <further-classification edition="200601120250422B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>建準電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張名嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳寶生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PAO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液冷散熱模組，用以解決習知冷卻循環模組導致增加整個電子裝置厚度的問題。係包含：一吸熱件，該吸熱件具有一流道，該流道具有一入液孔及一出液孔；及一散熱件，該散熱件具有一流道，該散熱件的流道具有一入液孔及一出液孔，該吸熱件與該散熱件具有相對高低差，該散熱件的入液孔由一第一液流通道連通該吸熱件的出液孔，該散熱件的出液孔由一第二液流通道連通該吸熱件的入液孔。本發明另關於一種具有該液冷散熱模組的電子裝置。藉此可以避免該電子裝置整體厚度的增加。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid cooling heat dissipation module is used to solve the problem of increasing the thickness of the entire electronic device caused by the conventional cooling cycle module. Includes: a heat-absorbing member having a first-flow channel, the flow channel having a liquid inlet hole and a liquid outlet hole; and a heat-dissipating member having a first-flow channel, and the flow channel of the heat-dissipating member having a liquid inlet hole. hole and a liquid outlet hole. The heat-absorbing element and the heat-dissipating element have a relative height difference. The liquid-inlet hole of the heat-radiating element is connected to the liquid outlet hole of the heat-absorbing element through a first liquid flow channel. The liquid outlet hole of the heat-radiating element is connected to the liquid inlet hole of the heat absorbing member through a second liquid flow channel. The present invention also relates to an electronic device having the liquid cooling heat dissipation module. This can avoid an increase in the overall thickness of the electronic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:吸熱件</p>  
        <p type="p">1a,2a:第一板</p>  
        <p type="p">1b,2b:第二板</p>  
        <p type="p">11:流道</p>  
        <p type="p">11a,21a:入液孔</p>  
        <p type="p">11b,21b:出液孔</p>  
        <p type="p">12:泵浦</p>  
        <p type="p">12a:入液口</p>  
        <p type="p">12b:出液口</p>  
        <p type="p">13:開口</p>  
        <p type="p">2:散熱件</p>  
        <p type="p">21:流道</p>  
        <p type="p">M:液冷散熱模組</p>  
        <p type="p">H:熱源</p>  
        <p type="p">T:鰭片組件</p>  
        <p type="p">F:風扇</p>  
        <p type="p">Y:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="643" publication-number="202628006"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628006.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150968</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混紡材料之高光譜分析方法</chinese-title>  
        <english-title>HYPERSPECTRAL SIGNAL ANALYSIS OF BLENDED MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250512B">G06V10/764</main-classification>  
        <further-classification edition="202201120250512B">G06V10/82</further-classification>  
        <further-classification edition="202201120250512B">G06V10/26</further-classification>  
        <further-classification edition="201401120250512B">G01N21/359</further-classification>  
        <further-classification edition="202101120250512B">D03D15/283</further-classification>  
        <further-classification edition="202101120250512B">D03D15/217</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人印刷創新科技研究發展中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRINTING TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世錩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>闕家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEH, CHIA-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉康宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHON-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳士煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃翔雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種混紡材料之高光譜分析方法，其步驟包含：利用影像擷取單元擷取待測物之第一資訊並傳輸至控制單元，該第一資訊係包含：光學影像以及光譜反射率，控制單元將第一資訊進行前處理並產生第二資訊，控制單元利用卷積神經網路取得第二資訊之複數個特徵值，並透過深度學習模型以及該些個特徵值進行判斷並產生判斷結果，控制單元依據判斷結果對待測物進行分類，以此將待測物之聚酯纖維與純棉之比例。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method of hyperspectral signal analysis of blended materials, the steps of which include: using an image acquisition unit to capture the first information of the test object and transmit it to a control unit, the first information includes: an optical image and a spectral reflectance, the control unit pre-processes the first information and generates the second information, the control unit utilizes a convolutional neural network to obtain the complex number of feature values of the second information and makes a judgment and generates a judgment result by means of a deep learning model and these feature values. The control unit uses a convolutional neural network to obtain a complex number of eigenvalues of the second information, and through a deep learning model and these eigenvalues to make a judgment and generate a judgment result, and the control unit classifies the object to be tested according to the judgment result, so as to classify the ratio of polyester fibers to pure cotton of the object to be tested.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10-S60:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="644" publication-number="202628141"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628141.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150971</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電感器結構及其製法</chinese-title>  
        <english-title>INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01F17/02</main-classification>  
        <further-classification edition="200601120250401B">H01F41/02</further-classification>  
        <further-classification edition="200601120250401B">H05K1/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恆勁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHOENIX PIONEER TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周保宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PAO HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電感器結構包括：至少二焊墊；繞線螺旋線圈，設置於該至少二焊墊的上表面上，且該繞線螺旋線圈之二端點分別電性連接該至少二焊墊；以及包覆層，包覆該繞線螺旋線圈及該至少二焊墊，且外露該至少二焊墊的下表面。本揭露更提供該電感器結構之製法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inductor structure is provided, the inductor structure comprises: at least two pads; a wound spiral coil provided on a top surface of the pads, wherein two ends of the wound spiral coil are electronically connected to the at least two pads; and an encapsulation layer covered the wound spiral coil and the at least two pads and a bottom surface of the at least two pads are exposed from the encapsulation layer. The disclosure further provides a manufacturing method of the inductor structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電感器結構</p>  
        <p type="p">21:焊墊</p>  
        <p type="p">21a:上表面</p>  
        <p type="p">21b:下表面</p>  
        <p type="p">22:繞線螺旋線圈</p>  
        <p type="p">221:端點</p>  
        <p type="p">23:包覆層</p>  
        <p type="p">24:表面處理層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="645" publication-number="202628264"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628264.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷插接連接器及其連接裝置</chinese-title>  
        <english-title>LIQUID-COOLING CONNECTOR AND CONNECTING DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">H01R13/52</main-classification>  
        <further-classification edition="200601120250324B">H01R13/639</further-classification>  
        <further-classification edition="200601120250324B">H01R13/627</further-classification>  
        <further-classification edition="200601120250324B">F16L37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳必琪國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JPC CONNECTIVITY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊勝合</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHENG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范詠智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, YUNG CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸皇成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HUANG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液冷插接連接器及其連接裝置，連接裝置包括液冷插接連接器與一對接連接器；液冷插接連接器則包括一插接本體、一解鎖套件、一逆止套件與一鎖固元件，插接本體上具有一插口，且插接本體於相對插口的周圍處外設有一作動孔；解鎖套件以彈力活動套接於插接本體外；逆止套件設於內作阻隔；而鎖固元件活動設於作動孔內，並具有一限位部、以及由限位部向下突伸而出並能於作動孔內作軸向位移的一卡掣部，且鎖固元件於卡掣部上具有一作動面、以及與作動面相背對的一卡掣面；其中，解鎖套件內具有一逆止面，且逆止面以彈力推抵限位部使鎖固元件於作動孔內朝軸向外位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid-cooling connector and a connecting device having the liquid-cooling connector and a corresponding connector are provided. The liquid-cooling connector includes a plugging body, an unlock assembly, a backstop assembly, and a lock member. The plugging body has a socket and an operating hole relative to a periphery of the socket. The unlock assembly is elastically adapted to sheathe the plugging body. The backstop assembly is arranged in the plugging body in insolation. The lock member is movably arranged in the operating hole and has a limiting portion, a fixing portion extended from the limiting portion downward to move along an axial direction in the operating hole, an operating surface on the fixing portion, and a fixing surface opposite to the operating surface. The unlock assembly has a stopping surface elastically abutted against the limiting portion to make the lock member to move along the axial direction in the operating hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液冷插接連接器</p>  
        <p type="p">10:插接本體</p>  
        <p type="p">10a:本體部</p>  
        <p type="p">10b:接管部</p>  
        <p type="p">10c:管接口</p>  
        <p type="p">100:中空區</p>  
        <p type="p">101:插口</p>  
        <p type="p">11:解鎖套件</p>  
        <p type="p">11a:彈性元件</p>  
        <p type="p">110:逆止面</p>  
        <p type="p">12:逆止套件</p>  
        <p type="p">120:活塞</p>  
        <p type="p">120a:彈性元件</p>  
        <p type="p">121:逆止件</p>  
        <p type="p">13:鎖固元件</p>  
        <p type="p">130a:抵靠面</p>  
        <p type="p">131a:作動面</p>  
        <p type="p">131b:卡掣面</p>  
        <p type="p">2:對接連接器</p>  
        <p type="p">200:基部</p>  
        <p type="p">201:對接部</p>  
        <p type="p">202:管接口</p>  
        <p type="p">203:推動部</p>  
        <p type="p">203a:推動面</p>  
        <p type="p">210:推抵件</p>  
        <p type="p">211:彈性元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="646" publication-number="202626550"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626550.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有膨潤材之陶坯的製作方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING GREENWARE INVOLVING EXPANSIVE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251106B">C04B33/13</main-classification>  
        <further-classification edition="200601120251106B">C04B33/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王振興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JENN SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勛平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSUN PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃晢文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHE WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王柏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王介勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIE YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有膨潤材之陶坯的製作方法，包含下列步驟：一陶坯成型體含有一陶土、一聚乙二醇(Polyethylene glycol，PEG)及一水，其中，該聚乙二醇的重量百分比為1至5，該水的重量百分比為10至35，該陶土的重量百分比為60至89，該聚乙二醇的分子量介於400至6000；將該陶坯成型體置入溫度介於26℃至145℃的一油品，放置時間介於0.1小時至336小時，而使部分之該油品滲入該陶坯成型體中與該聚乙二醇反應而成為一膨潤材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="647" publication-number="202626076"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626076.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>海木耳萃取物的萃取方法及用途</chinese-title>  
        <english-title>EXTRACTION METHOD AND USE OF SARCODIA MONTAGNEANA EXTRACT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">A61K36/04</main-classification>  
        <further-classification edition="200601120250114B">A61P1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣中油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CPC CORPORATION, TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭姝玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅珮純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, PEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁堉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種海木耳萃取物的萃取方法，包含：酵素水解步驟，將海木耳材料加入水及酵素進行水解處理，而得到酵素水解產物；熱水萃取步驟，對該酵素水解產物進行熱處理，而自該酵素水解產物萃取得到萃取產物；及分離步驟，將該萃取產物的固態成分去除以取得海木耳萃取物，該萃取物具有支鏈胺基酸(BCAAs)，係用以製作促進人類益生菌生長的組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Clamed is a extraction method of Sarcodia montagneana extract comprising an enzyme hydrolysis step adding water and enzyme to the Sarcodia montagneana material and performing hydrolysis treatment to obtain an enzyme hydrolyzate; a hot water extraction step performing heat treatment on the enzyme hydrolyzate to obtain an extraction product; and a separation step removing the solid components of the extraction product to obtain a Sarcodia montagneana extract, wherein the Sarcodia montagneana extract containing branched chain amino acids (BCAAs) and is used to produce a composition that promotes the growth of human probiotics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:酵素水解步驟</p>  
        <p type="p">S2:熱水萃取步驟</p>  
        <p type="p">S3:分離步驟</p>  
        <p type="p">S4:前處理步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="648" publication-number="202628482"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628482.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光模組及其顯示裝置</chinese-title>  
        <english-title>BACKLIGHT MODULE AND DISPLAY APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250204B">H05B45/20</main-classification>  
        <further-classification edition="202001120250204B">H05B45/3577</further-classification>  
        <further-classification edition="200601120250204B">G02B6/00</further-classification>  
        <further-classification edition="200601120250204B">G09F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅嘉恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUH, CHIA-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林羿廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種背光模組及其顯示裝置。背光模組包括白光發光二極體、第一發光二極體驅動器、以及第二發光二極體驅動器。白光發光二極體包括藍光晶粒、綠光晶粒以紅色色轉換材料。第一發光二極體驅動器基於第一控制信號提供驅動藍光晶粒的第一驅動電流。第二發光二極體驅動器基於第二控制信號提供驅動綠光晶粒的第二驅動電流。當白色背光的亮度大於等於預設亮度時，第二驅動電流對第一驅動電流的比值固定為預設比值。當白色背光的亮度小於預設亮度時，第二驅動電流對第一驅動電流的比值隨著亮度的下降而上升。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An backlight module and a display apparatus thereof are provided. The backlight module includes a white LED, a first LED driver, and a second LED driver. The white LED includes a blue-light die, a green-light die and a red conversion material. The first LED driver provides a first driving current for driving the blue light die based on a first control signal. The second LED driver provides a second driving current for driving the green light die based on a second control signal. When the brightness of the white backlight is greater than or equal to a preset brightness, the ratio of the second driving current to the first driving current is fixed to a preset ratio. When the brightness of the white backlight is less than the preset brightness, the ratio of the second driving current to the first driving current increases as the brightness decreases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主機系統</p>  
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:控制電路</p>  
        <p type="p">111:時序控制器</p>  
        <p type="p">120、130:發光二極體驅動器</p>  
        <p type="p">140:白光發光二極體</p>  
        <p type="p">141:藍光晶粒</p>  
        <p type="p">142:綠光晶粒</p>  
        <p type="p">143:紅色色轉換材料</p>  
        <p type="p">150:掃描驅動器</p>  
        <p type="p">160:資料驅動器</p>  
        <p type="p">170:顯示面板</p>  
        <p type="p">BLM1:背光模組</p>  
        <p type="p">Data_im:影像資料</p>  
        <p type="p">Data_p:顯示資料</p>  
        <p type="p">Idef1、Idef2:預設電流值</p>  
        <p type="p">Idr1、Idr2:驅動電流</p>  
        <p type="p">Lwb:白色背光</p>  
        <p type="p">PWMi1、PWMi2:脈波寬度信號</p>  
        <p type="p">PWMin:輸入脈波寬度信號</p>  
        <p type="p">Scan:掃描信號</p>  
        <p type="p">SETi1、SETi2:電流設定信號</p>  
        <p type="p">Vdata:資料電壓</p>  
        <p type="p">Xsc1、Xsc2:控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="649" publication-number="202627389"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627389.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱導管結構及其製作方法</chinese-title>  
        <english-title>HEAT PIPE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">F28D15/02</main-classification>  
        <further-classification edition="200601120250402B">F28D15/04</further-classification>  
        <further-classification edition="200601120250402B">G06F1/20</further-classification>  
        <further-classification edition="200601120250402B">B23P15/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種熱導管結構及其製作方法，該熱導管結構包含：一銅管，具有一冷卻端與一熱源端；一氣道，位於該銅管內側，由接近該冷卻端的一側延伸到接近該熱源端的一側；一網狀毛細結構，環繞該銅管內側且介於該氣道與該銅管之間，由接近該冷卻端的一側延伸到接近該熱源端的一側；一熱傳介質，被注入該氣道；其中該氣道的直徑與該銅管的直徑比介於1：2至3：5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat pipe structure and a manufacturing method thereof, the heat pipe structure includes: a copper tube including a cooling end and a heat source terminal; an air channel positioned inside the copper tube and extending from a side close to the cooling terminal to a side close to the heat source terminal; a mesh capillary structure surrounding an inside of the copper tube and between the air channel and the copper tube, extending from a side close to the cooling terminal to a side close to the heat source terminal; a heat transfer medium injected into the air channel; wherein a ratio of a diameter of the air channel to a diameter of the copper tube ranges between 1:2 to 3:5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:銅管</p>  
        <p type="p">L:冷卻端</p>  
        <p type="p">L1:冷卻封尾部</p>  
        <p type="p">H:熱源端</p>  
        <p type="p">H1:熱源</p>  
        <p type="p">20:網狀毛細結構</p>  
        <p type="p">30:氣道</p>  
        <p type="p">40:熱傳介質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="650" publication-number="202627636"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627636.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">G02F1/1335</main-classification>  
        <further-classification edition="200601120250328B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旻錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MIN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子芩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括畫素單元和光致發光層。畫素單元包括第一子畫素和第二子畫素。第一子畫素包括第一發光元件和第一濾光層。第一濾光層設置第一發光元件上方。第二子畫素包括第二發光元件和第二濾光層。第二濾光層設置第二發光元件上方。部分的光致發光層位於第一發光元件和第一濾光層之間且橫向地覆蓋第一發光元件的側壁。另一部份的光致發光層位於第二發光元件和第二濾光層之間且橫向地覆蓋第二發光元件的側壁。第一子畫素和第二子畫素被配置為發出不相同顏色的光線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a pixel unit and a photoluminescent layer. The pixel unit includes a first sub-pixel and a second sub-pixel. The first sub-pixel includes a first light-emitting element and a first filter layer. The first filter layer is disposed above the first light-emitting element. The second sub-pixel includes a second light-emitting element and a second filter layer. The second filter layer is disposed above the second light-emitting element. A portion of the photoluminescent layer is located between the first light-emitting element and the first filter layer and laterally covers a sidewall of the first light-emitting element. Another portion of the photoluminescent layer is located between the second light-emitting element and the second filter layer and laterally covers a sidewall of the second light-emitting element. The first sub-pixel and the second sub-pixels are configured to emit light of different colors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110A:畫素單元</p>  
        <p type="p">110:第一基板</p>  
        <p type="p">110T:頂面</p>  
        <p type="p">112:第一子畫素</p>  
        <p type="p">112A:第一發光元件</p>  
        <p type="p">112B:第一色轉換結構</p>  
        <p type="p">112C:第一濾光層</p>  
        <p type="p">114:第二子畫素</p>  
        <p type="p">114A:第二發光元件</p>  
        <p type="p">114B:第二色轉換結構</p>  
        <p type="p">114C:第二濾光層</p>  
        <p type="p">116:第三子畫素</p>  
        <p type="p">116A:第三發光元件</p>  
        <p type="p">116C:第三濾光層</p>  
        <p type="p">118:第四子畫素</p>  
        <p type="p">118A:第四發光元件</p>  
        <p type="p">118C:第四濾光層</p>  
        <p type="p">120:第二基板</p>  
        <p type="p">120B:底面</p>  
        <p type="p">BM:遮蔽元件</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">H:高度</p>  
        <p type="p">S:拼接縫</p>  
        <p type="p">WB:阻擋層</p>  
        <p type="p">W1、W2、W3、W4、W5:寬度</p>  
        <p type="p">YL:光致發光層</p>  
        <p type="p">YP:擴散粒子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="651" publication-number="202627771"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627771.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置以及其游標顯示控制方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND CURSOR DISPLAY CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">G06F3/033</main-classification>  
        <further-classification edition="201301120250401B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文韵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEN-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣宜芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YI-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雅婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YA-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有游標顯示控制方法的電子裝置和游標顯示控制方法，該游標顯示控制方法包括：響應於操作裝置移動，獲取顯示裝置的顯示資訊；根據顯示資訊計算出游標速度；以及使在顯示裝置上所顯示的游標按照游標速度進行移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device with a cursor display control method and the cursor display control method are provided. The cursor display control method includes: in response to movement of an operating device, acquiring display information of a display device; calculating a cursor speed based on the display information; and causing a cursor displayed on the display device to move according to the cursor speed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210、S220、S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="652" publication-number="202626145"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626145.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滅火系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">A62C3/07</main-classification>  
        <further-classification edition="200601120250109B">A62C37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海絲科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYFIBER TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂文裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滅火系統，適用於一車輛，該滅火系統包含一支架單元、一防火單元，及一驅動單元。該支架單元包括一沿著水平的一鋪設方向延伸的滑道，該滑道包括一第一區域及一第二區域。該防火單元包括一設置於該滑道上的捲軸，及一捲繞於該捲軸外的防火布。該驅動單元包括至少一設置於該第一區域附近且能賦予該防火單元動力的驅動件，該驅動單元能相對於該支架單元在一正常位置及一滅火位置間改變，該驅動單元由該正常位置移至該滅火位置時，該捲軸被該至少一驅動件驅動而自該第一區域移至該第二區域，該防火布被展開並脫離該捲軸以披覆於該車輛。因此，該滅火系統無需人力即可完成該防火布覆蓋於該車輛的滅火作業，相當安全。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支架單元</p>  
        <p type="p">11:滑道</p>  
        <p type="p">111:第一區域</p>  
        <p type="p">112:第二區域</p>  
        <p type="p">12:架體</p>  
        <p type="p">121:導引部</p>  
        <p type="p">122:擋止部</p>  
        <p type="p">2:防火單元</p>  
        <p type="p">21:捲軸</p>  
        <p type="p">22:防火布</p>  
        <p type="p">221:第一布端</p>  
        <p type="p">222:第二布端</p>  
        <p type="p">3:阻擋單元</p>  
        <p type="p">31:側桿</p>  
        <p type="p">32:擋桿</p>  
        <p type="p">4:驅動單元</p>  
        <p type="p">41:驅動件</p>  
        <p type="p">5:控制單元</p>  
        <p type="p">51:感測器</p>  
        <p type="p">52:控制器</p>  
        <p type="p">81:壁面</p>  
        <p type="p">82:頂面</p>  
        <p type="p">83:地面</p>  
        <p type="p">9:車輛</p>  
        <p type="p">X:鋪設方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="653" publication-number="202627852"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627852.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>情資管理系統</chinese-title>  
        <english-title>INTELLIGENCE MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">G06F21/57</main-classification>  
        <further-classification edition="201301120250401B">G06F21/55</further-classification>  
        <further-classification edition="202201120250401B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竣盟科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BILLOWS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭加海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIA-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李思穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SZU YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種情資管理系統包括：情資蒐集模組，用以接收情資資料；情資訂閱服務模組，用以提供資安設備來訂閱情資管理服務；情資資料庫，耦接情資蒐集模組與情資訂閱服務模組，用以接收來自情資蒐集模組的情資資料與提供情資至情資訂閱服務模組；以及情資品質控管模組，耦接情資資料庫，用以執行情資的情資品質控管，其中情資品質控管模組包括：情資生命週期管理單元，用以預測目標情資的生命週期階段；威脅情資可信度評級單元，用以評估目標情資的可信度；以及威脅情資風險評級單元，用以評估目標情資於特定時間點的風險評級。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligence management system is provided, which includes: an intelligence collection module for receiving intelligence data; an intelligence subscription service module for providing intelligence security equipments to subscribe to intelligence management services; an intelligence database for coupling the intelligence collection module and the intelligence subscription service module to receive the intelligence data from the intelligence collection module and provide intelligence to the intelligence subscription service module; and an intelligence quality control module for coupling to the intelligence database to perform intelligence quality control of the intelligence. The intelligence quality control module includes: an intelligence life cycle management unit, used to predict a life cycle stage of a target intelligence; a threat intelligence credibility rating unit, used to evaluate a credibility of the target intelligence; and a threat intelligence risk rating unit, used to evaluate a risk rating of the target intelligence at a specific time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:情資管理系統</p>  
        <p type="p">2:情資蒐集模組</p>  
        <p type="p">3:情資訂閱服務模組</p>  
        <p type="p">4:情資資料庫</p>  
        <p type="p">5:情資品質控管模組</p>  
        <p type="p">6:資安設備</p>  
        <p type="p">7:情資資料來源</p>  
        <p type="p">51:情資生命週期管理單元</p>  
        <p type="p">52:威脅情資可信度評級單元</p>  
        <p type="p">53:威脅情資風險評級單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="654" publication-number="202626524"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626524.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>海水淡化方法及海水淡化系統</chinese-title>  
        <english-title>SEAWATER DESALINATION METHOD AND SEAWATER DESALINATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250114B">C02F1/22</main-classification>  
        <further-classification edition="202301120250114B">C02F1/58</further-classification>  
        <further-classification edition="200601120250114B">B01D9/02</further-classification>  
        <further-classification edition="200601320250114B">C02F103/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣中油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CPC CORPORATION, TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁堉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾裕峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSZENG, YUN-FONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種海水淡化方法，包括：冷凍脫鹽步驟，以冷凍脫鹽單元將海水藉由液化天然氣回復到氣態時的冷能以凍結而分離為低鹽度部分及高鹽度部分；電透析脫鹽步驟，以電透析脫鹽單元對該低鹽度部分進行電透析脫鹽處理以取得淡水及鹵水；以及正滲透脫鹽步驟，以正滲透脫鹽單元對該高鹽度部分進行正滲透脫鹽處理以取得淡水及鹵水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a seawater desalination method comprising a freezing desalination step using a freezing desalination unit to separate the seawater into low-salinity parts and high-salinity parts by cold energy when the liquefied natural gas returns to the gaseous state; an electrodialysis desalination step using an electrodialysis desalination unit to perform electrodialysis desalination treatment on the low-salinity part to obtain fresh water and brine; and a forward osmosis desalination step using a forward osmosis desalination unit to perform forward osmosis desalination treatment on the high-salinity part to obtain fresh water and brine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:冷凍脫鹽步驟</p>  
        <p type="p">S2:電透析脫鹽步驟</p>  
        <p type="p">S3:正滲透脫鹽步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="655" publication-number="202625977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調整式微創手術牽引器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">A61B17/02</main-classification>  
        <further-classification edition="200601120250114B">A61B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山醫學大學附設醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG SHAN MEDICAL UNIVERSITY HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭連雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許立松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可調整式微創手術牽引器，包括：一身部，具第一抵接面；一夾持部，活動設於身部上，具相對於第一抵接面之第二抵接面，可於第一初始位置及第一工作位置間移動，分別使第二抵接面遠離或靠近第一抵接面；一連動部，連接夾持部；一作用部，其一端連接連動部，另一端遠離夾持部，作用部可於第二初始位置及第二工作位置間移動，分別使第二端位於預設位置或遠離預設位置；一驅動部，設於身部上，用以驅動連動部，進而同步帶動夾持部及作用部作動。據此，本發明係提供易於單人操作的手術器械，能夠通過單一操作同時實現器械的挾持定位和連動牽引功能，從而簡化手術過程中的操作複雜性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:身部</p>  
        <p type="p">11:第一本體</p>  
        <p type="p">20:夾持部</p>  
        <p type="p">21:第二抵接面</p>  
        <p type="p">22:連接臂</p>  
        <p type="p">221:第二本體</p>  
        <p type="p">2211:第三端</p>  
        <p type="p">2212:第四端</p>  
        <p type="p">23:工作夾臂</p>  
        <p type="p">30:作用部</p>  
        <p type="p">33:牽引附件</p>  
        <p type="p">50:驅動部</p>  
        <p type="p">51:旋鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="656" publication-number="202625978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微創手術牽引器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">A61B17/02</main-classification>  
        <further-classification edition="200601120250114B">A61B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山醫學大學附設醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG SHAN MEDICAL UNIVERSITY HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭連雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許立松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所提供一種微創手術牽引器，其包括一夾持部、一作用部、一第一驅動部及一第二驅動部，其中，該夾持部具有一第一夾爪及一第二夾爪，該第二夾爪以一端可活動地與該第一夾爪相連接，而可使該第二夾爪能相對該第一夾爪於一夾持位置及一釋放位置之間移動；其中，當該第二夾爪位於該夾持位置上時，係使該第二夾爪之一工作端與該第一夾爪間的距離，小於而當該第二夾爪位於該釋放位置上時，該第二夾爪之該工作端與該第一夾爪之距離；該作用部具有一扇形牽引件，該扇形牽引件具有複數相互疊合且呈長條狀之板體，並以一第一樞接件樞設於該夾持部上，使該些板體得分別以該第一樞接件為轉軸於彼此分開的一展開位置、或彼此疊合的一收合位置之間作動；該第一驅動部設於該第一夾爪上，可對該作用部施加作用力，以驅動該些板體於該展開位置與該收合位置間移動；該第二驅動部，可對該夾持部施加作用力，以驅動該夾持部於由該釋放位置朝該夾持位置移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:夾持部</p>  
        <p type="p">11:第一夾爪</p>  
        <p type="p">111:第一殼體</p>  
        <p type="p">12:第二夾爪</p>  
        <p type="p">121:第二殼體</p>  
        <p type="p">122:開口</p>  
        <p type="p">123:工作端</p>  
        <p type="p">20:作用部</p>  
        <p type="p">21:扇形牽引件</p>  
        <p type="p">211:板體</p>  
        <p type="p">2111:扇臂</p>  
        <p type="p">30:第一驅動部</p>  
        <p type="p">322:環齒輪</p>  
        <p type="p">3222:施力面</p>  
        <p type="p">50:資訊部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="657" publication-number="202627850"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627850.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151015</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數位雙生系統</chinese-title>  
        <english-title>DIGITAL TWIN SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">G06F21/55</main-classification>  
        <further-classification edition="201301120250401B">G06F21/57</further-classification>  
        <further-classification edition="202201120250401B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竣盟科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BILLOWS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭加海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIA-HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李思穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SZU YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種數位雙生系統，包括：攻擊軌跡預測分析模組，用以接收來自情資資料庫的情資資料與來自企業網路的區域網路拓樸資訊及資安監控告警資訊，以及根據情資資料、區域網路拓樸資訊及資安監控告警資訊提供目標情資的模擬攻擊軌跡與企業網路中每一節點的被攻擊機率；對策方案建議模組，用以根據情資資料、區域網路拓樸資訊及資安監控告警資訊提供目標情資的因應處理對策；以及攻擊潛勢顯示模組，用以整合並顯示企業網路的區域網路拓樸資訊、模擬攻擊軌跡、每一節點的被攻擊機率與因應處理對策。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A digital twin system is provided, which includes: an attack trajectory prediction analysis module, used to receive intelligence data from an intelligence database and local network topology information and intelligence security monitoring alarm information from an enterprise network, and provide simulated attack trajectories of a target intelligence and an attack probability of each node in the enterprise network based on the intelligence data, the local network topology information and the intelligence security monitoring alarm information; a countermeasures suggest module, used to provide countermeasures for the target intelligence based on intelligence data, local network topology information and intelligence security monitoring alarm information; and an attack potential display module, used to integrate and display the local network topology information, the simulated attack trajectories, the attack probability of each node, and countermeasures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:數位雙生系統</p>  
        <p type="p">2:攻擊軌跡預測分析模組</p>  
        <p type="p">3:對策方案建議模組</p>  
        <p type="p">4:攻擊潛勢顯示模組</p>  
        <p type="p">5:情資資料庫</p>  
        <p type="p">6:企業網路</p>  
        <p type="p">21:入侵威脅指標辨識單元</p>  
        <p type="p">22:網路節點異常分析單元</p>  
        <p type="p">23:攻擊軌跡預測單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="658" publication-number="202628397"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628397.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服叢集的管理系統與方法</chinese-title>  
        <english-title>MANAGEMENT SYSTEM AND METHOD FOR SERVER CLUSTERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">H04L41/042</main-classification>  
        <further-classification edition="202201120250401B">H04L41/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技鋼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡後瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HOU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫佩傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, PEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王紹宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種伺服叢集的管理系統與方法，管理系統包括伺服叢集與主伺服器。伺服叢集具有多台從伺服器，從伺服器配置相應的網路區段；主伺服器連接伺服叢集，主伺服器具有前端管理程式，前端管理程式根據新增要求將外部伺服器加入伺服叢集，並對外部伺服器配置相應的網路區段；主伺服器根據存取要求選取相應的從伺服器，並通過受選的從伺服器獲取在網路區段中的指定資料；前端管理程式向各從伺服器發送偵測要求，確認從伺服器是否離線；主伺服器偵測存取要求相應的從伺服器為離線，主伺服器執行警報程式並向指定端發送警報通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A management system and method for server clusters, comprising a server cluster and a master server. The server cluster comprises a plurality of slave servers, with each slave server configured with corresponding network segments. The master server connects to the server cluster and includes a front-end management program. Based on addition requests, the front-end management program adds external servers to the server cluster and configures corresponding network segments for these external servers. The master server selects appropriate slave servers according to access requests and obtains specified data from the network segments through the selected slave servers. The front-end management program sends detection requests to each slave server to confirm whether they are offline. When the master server detects that a slave server corresponding to an access request is offline, it executes an alert program and sends alert notifications to designated endpoints.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:主伺服器</p>  
        <p type="p">111:第一網路單元</p>  
        <p type="p">112:第一儲存單元</p>  
        <p type="p">113:第一處理單元</p>  
        <p type="p">114:前端管理程式</p>  
        <p type="p">115:警報程式</p>  
        <p type="p">116:主資料庫</p>  
        <p type="p">117:網段對應表</p>  
        <p type="p">118:待配置網段</p>  
        <p type="p">220:從伺服器</p>  
        <p type="p">221:第二網路單元</p>  
        <p type="p">222:第二儲存單元</p>  
        <p type="p">223:第二處理單元</p>  
        <p type="p">224:後端程式</p>  
        <p type="p">225:從資料庫</p>  
        <p type="p">241:感測設備</p>  
        <p type="p">242:設備資訊</p>  
        <p type="p">410:新增要求</p>  
        <p type="p">420:存取要求</p>  
        <p type="p">430:偵測要求</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="659" publication-number="202627296"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627296.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低溫熱氣發電裝置</chinese-title>  
        <english-title>LOW TEMPERATURE THERMAL UPDRAFT POWER GENERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">F03D7/04</main-classification>  
        <further-classification edition="200601120250325B">F03D1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大羚羊區塊鏈金融科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELAND BLOCKCHAIN FINTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳景淞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種低溫熱氣發電裝置包含進氣增壓組件、進氣風扇、感應定子、感應轉盤及轉子組件。進氣增壓組件具有氣流入口及氣流出口。進氣風扇位於氣流入口處。轉子組件包含轉軸、轉子及相位差產生器。轉軸之一端連接於進氣風扇，另一端連接於轉子。轉子位於氣流出口與感應定子之間。相位差產生器連接於轉子與轉軸之間。當進氣氣流驅動轉子產生第二旋轉，並於第二旋轉的轉動過程中形成預設相位角度差時，相位差產生器啟動轉軸產生第一旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a low temperature thermal updraft power generator, which includes a boosting intake assembly, an intake fan, an induction stator, an induction turntable, and a rotor assembly. The intake boosting assembly has an airflow inlet and an airflow outlet. The intake fan is located at the air inlet. The rotor component includes a shaft, a rotor, and a phase difference generator. One end of the shaft is connected to the intake fan, and the other end is connected to the rotor. The induction turntable is located between the air outlet and the stator component. The phase difference generator is connected between the induction turntable and the shaft. Driven by an intake airflow, the induction turntable generates a second rotation. When a predetermined phase angle difference is formed during the second rotation, the phase difference generator drives the shaft to generate a first rotation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:低溫熱氣發電裝置</p>  
        <p type="p">102:進氣增壓組件</p>  
        <p type="p">103:進氣風扇</p>  
        <p type="p">104:轉子組件</p>  
        <p type="p">105:進氣閥本體</p>  
        <p type="p">106:感應定子</p>  
        <p type="p">107:外殼體</p>  
        <p type="p">109:風扇殼體</p>  
        <p type="p">112:感應模組</p>  
        <p type="p">116:感應轉盤</p>  
        <p type="p">118:轉子</p>  
        <p type="p">122:磁性件</p>  
        <p type="p">131:排氣開口</p>  
        <p type="p">132:盤體</p>  
        <p type="p">150:鐵芯盤體</p>  
        <p type="p">158:鐵芯</p>  
        <p type="p">160:環型繞組</p>  
        <p type="p">164:固定連桿</p>  
        <p type="p">A:剖面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="660" publication-number="202627806"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627806.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料異步備援的處理系統與方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR ASYNCHRONOUS DATA BACKUP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">G06F11/14</main-classification>  
        <further-classification edition="200601120260302B">G06F11/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技鋼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡後瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HOU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫佩傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, PEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王紹宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料異步備援的處理系統與方法，處理系統包括伺服叢集與主伺服器。伺服叢集具有多台從伺服器，每一從伺服器具有後端程式與從資料庫；主伺服器連接伺服叢集，主伺服器具有前端管理程式與主資料庫，前端管理程式偵測主資料庫與從資料庫的狀態為在線或離線；主資料庫的狀態為離線，前端管理程式從從資料庫中選擇其中之一，受選的從資料庫為目標資料庫；前端管理程式根據存取要求對目標資料庫進行存取並產生存取結果；主資料庫的狀態為在線，前端管理程式存取主資料庫並產生存取結果，前端管理程式將存取結果同步寫入其餘從資料庫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for asynchronous data backup is provided. The processing system comprises a server cluster and a primary server. The server cluster includes multiple secondary servers, each equipped with a backend program and a secondary database. The primary server is connected to the server cluster and comprises a frontend management program and a primary database. The frontend management program detects the status of the primary database and the secondary databases as either online or offline. When the primary database is offline, the frontend management program selects one of the secondary databases as the target database. The frontend management program accesses the target database based on access requests and generates access results. When the primary database is online, the frontend management program accesses the primary database to generate access results and synchronizes the access results to the remaining secondary databases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310,S320,S330,S340,S350,S360:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="661" publication-number="202626152"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626152.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具計算運動當量之運動器材偵測系統</chinese-title>  
        <english-title>SPORTS EQUIPMENT DETECTION SYSTEM WITH MOTION EQUIVALENT CALCULATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">A63B24/00</main-classification>  
        <further-classification edition="200601120250422B">A63B21/005</further-classification>  
        <further-classification edition="201901120250422B">G06F17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弘昇健康科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昌祐科技國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐘賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣琦瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玉婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何漢斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳朝泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林侑良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴奇均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具計算運動當量之運動器材偵測系統，該運動器材偵測系統安裝於預設的運動器材上，設置有一偵測裝置介面，該偵測裝置介面內建有運算單元，該運算單元為安裝有其對應安裝的運動器材的運動係數數據，並以訊號裝置連結雲端網路、感應件藉以讀取操作者運動過程中的運動次數、阻力等資訊，並運算得出運動成果，該偵測裝置介面運行有一訓練模組，該訓練模組至少運行有一運動資訊選項及一運動處方選項，其中所述的偵測裝置介面內建有一代謝當量運算單元，該代謝當量運算單元係為偵測並運算出包含下述數據：預估的最大攝氧量，計算單分鐘代謝當量，預估的運動者最大攝氧量及單分鐘卡洛里消耗量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sports equipment detection system with motion equivalent calculation, the sports equipment detection system is installed on preset sports equipment and is provided with a detection device interface, said detection device interface has a built-in computing unit, the computing unit is equipped with motion coefficient data corresponding to the sports equipment installed, and uses a signaling device to connect to the network and sensing elements to read the number of movements, resistance and other information during the operator's exercise, and calculate the exercise results, the training module at least runs an exercise information option and an exercise prescription option, wherein the detection device interface is built with a metabolic equivalent calculation unit, and the metabolic equivalent calculation unit detects and calculates the estimated maximum intake Oxygen volume, calculation of metabolic equivalents per minute, estimated maximum oxygen uptake of athletes and caloric consumption per minute.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:偵測裝置介面</p>  
        <p type="p">C:雲端網路</p>  
        <p type="p">S1:登入模組</p>  
        <p type="p">S14:登入欄</p>  
        <p type="p">S141:設定</p>  
        <p type="p">S142:資訊</p>  
        <p type="p">S143:登出</p>  
        <p type="p">S2:訓練模組</p>  
        <p type="p">S21:運動資訊</p>  
        <p type="p">S22:運動處方</p>  
        <p type="p">S3:測試模組</p>  
        <p type="p">S31:運動測試</p>  
        <p type="p">S32:歷史紀錄</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="662" publication-number="202627439"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627439.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續式病理染色機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250126B">G01N1/31</main-classification>  
        <further-classification edition="200601120250126B">G01N1/30</further-classification>  
        <further-classification edition="200601120250126B">G01N1/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇君生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUCHUN BIOTECHNOLOGY CO., LTD.,</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝治宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瓏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐梓崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴柊赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, ZHONG-HE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連續式病理染色機，適用於搭配玻片支架與染色槽體使用。該連續式病理染色機包含一基座裝置及一驅動裝置。該驅動裝置包括一設置於該基座裝置的調移機構，及一設置在該調移機構的連結件。該連結件可被控制而可脫離地連結於其中一該玻片支架。該調移機構可被控制而傳動該連結件位移，並可被控制傳動該連結件將相連結的該玻片支架移入或移出其中一該染色槽體。藉由該連結件在將該玻片支架移送至預定位置後，就可被控制脫離該玻片支架，而用以連結並移送另一該玻片支架，有助於增加連續染色處理多批玻片時的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:玻片支架</p>  
        <p type="p">12:染色槽體</p>  
        <p type="p">2:基座裝置</p>  
        <p type="p">21:底座</p>  
        <p type="p">22:支架</p>  
        <p type="p">3:驅動裝置</p>  
        <p type="p">4:調移機構</p>  
        <p type="p">5:連結件</p>  
        <p type="p">6:調移模組</p>  
        <p type="p">61:第一驅動單元</p>  
        <p type="p">611:第一螺桿</p>  
        <p type="p">612:第一驅動器</p>  
        <p type="p">62:承載單元</p>  
        <p type="p">621:移動座</p>  
        <p type="p">622:導引件</p>  
        <p type="p">623:第二螺桿</p>  
        <p type="p">624:承載座</p>  
        <p type="p">625:第二驅動器</p>  
        <p type="p">7:升降模組</p>  
        <p type="p">71:直立架</p>  
        <p type="p">711:架體</p>  
        <p type="p">712:升降導引桿</p>  
        <p type="p">72:升降台</p>  
        <p type="p">73:升降驅動器</p>  
        <p type="p">74:升降傳動單元</p>  
        <p type="p">741:升降螺桿</p>  
        <p type="p">742:升降驅動環</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="663" publication-number="202626153"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626153.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環狀運動系統登入與資訊界面</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250430B">A63B24/00</main-classification>  
        <further-classification edition="200601120250430B">A63B22/06</further-classification>  
        <further-classification edition="202401120250430B">G06Q50/00</further-classification>  
        <further-classification edition="200601120250430B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弘昇健康科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昌祐科技國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐘賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣琦瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玉婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何漢斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳朝泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林侑良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴奇均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種環狀運動系統登入與資訊界面，安裝於預設的運動器材上裝設有一操作裝置介面，該操作裝置介面內建有運算單元，該運算單元為安裝有其對應安裝的運動器材的運動係數數據，該操作裝置介面運行有一訓練模組及一測試模組內建程式，該操作裝置介面顯示有：一運動資訊選項、一運動處方選項、一運動測試選項，該啟動測試後可點選測試偵測介面，該測試偵測介面會顯示測量靜息心率視窗，該啟動測試顯示一相應顯示的測試心率欄及測試心率區間欄，該啟動測試顯示測試資訊介面並進行運動測試，測試資訊介面顯示有一測試轉速欄。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:操作裝置介面</p>  
        <p type="p">S211:目標轉速欄</p>  
        <p type="p">S212:目標瓦特欄</p>  
        <p type="p">S213:儲備心率欄</p>  
        <p type="p">S2131:心率區間欄</p>  
        <p type="p">S214:代謝當量欄</p>  
        <p type="p">S215:運動數據欄</p>  
        <p type="p">S216:圖表</p>  
        <p type="p">S217:阻力值欄</p>  
        <p type="p">S218:運動模式欄</p>  
        <p type="p">S21A:一般顯示模式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="664" publication-number="202626537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱形眼鏡模具</chinese-title>  
        <english-title>CONTACT LENS MOLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">C03B11/08</main-classification>  
        <further-classification edition="200601120251105B">B29D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詠豪科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACME TOOLING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUO-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡文修</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種隱形眼鏡模具，其包括：一第一模具及一第二模具。第一模具具有一弧形凸部、一第一抵靠部及一第二抵靠部，而第二模具具有一弧形凹部及一第二組裝部。當第一模具與第二模具相互配合，弧形凸部與弧形凹部之間形成一成型空間，第一抵靠部與該第二組裝部的一側相互擠壓而使第一模具與第二模具穩定結合，以及第二抵靠部抵靠於第二組裝部的另一側，而可限制第二組裝部沿徑向變形。本發明兼具防止模具變形、確保隱形眼鏡製作精度及提升製程良率等優點及功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a contact lens mold comprising a first mold and a second mold. The first mold includes an arcuate protrusion, a first abutment portion, and a second abutment portion, while the second mold comprises an arcuate recess and a second assembly portion. When the first mold and the second mold are engaged, a molding space is formed between the arcuate protrusion and the arcuate recess. The first abutment portion and one side of the second assembly portion are pressed against each other to stably combine the first and second molds. Additionally, the second abutment portion abuts against the other side of the second assembly portion to restrict its radial deformation. This invention offers advantages such as preventing mold deformation, ensuring the manufacturing precision of contact lenses</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一模具</p>  
        <p type="p">11:弧形凸部</p>  
        <p type="p">12:第一組裝部</p>  
        <p type="p">121:第一抵靠部</p>  
        <p type="p">1211:凸塊</p>  
        <p type="p">122:第二抵靠部</p>  
        <p type="p">123:第一組裝槽</p>  
        <p type="p">20:第二模具</p>  
        <p type="p">21:弧形凹部</p>  
        <p type="p">22:第二組裝部</p>  
        <p type="p">23:限位結構</p>  
        <p type="p">231:延伸段</p>  
        <p type="p">232:限位段</p>  
        <p type="p">233:第二組裝槽</p>  
        <p type="p">S:成型空間</p>  
        <p type="p">D1:軸向</p>  
        <p type="p">D2:徑向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="665" publication-number="202627607"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627607.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光掃描系統、光達以及車輛</chinese-title>  
        <english-title>OPTICAL SCANNING SYSTEM, LIDAR AND VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250310B">G02B26/10</main-classification>  
        <further-classification edition="200601120250310B">G02B27/28</further-classification>  
        <further-classification edition="200601120250310B">G01S7/481</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾永昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種光掃描系統，包括偏光轉換器、偏振分光鏡、相位延遲元件以及掃描元件。偏光轉換器接收具有第一偏振態之第一光與具有第二偏振態之第二光，偏光轉換器用於將第一光之偏振態轉換為第二偏振態，並與第二光一起作為具有第二偏振態之第三光出射。偏振分光鏡接收並且反射第三光。相位延遲元件用於接收第三光並出射具有第三偏振態之第四光。掃描元件用於接收第四光並朝相位延遲元件出射具有第四偏振態之第五光。本申請還提供一種應用上述光掃描系統之光達以及一種車輛。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an optical scanning system. The optical scanning system includes a polarizer, a polarization splitter, a phase delay element and a scanning element. The polarizer receives the first light with the first polarization state and the second light with the second polarization state. The polarizer is used to convert the polarization state of the first light to the second polarization state to exit together with the second light as the third light with the second polarization state. The polarizing splitter receives and reflects the third light. The phase delay element is used to receive the third light and emit the fourth light with the third polarization state. The scanning element is used to receive the fourth light and emit the fifth light with the fourth polarization state towards the phase delay element. The present disclosure also provides a LiDAR applying the optical scanning system and a vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光掃描系統</p>  
        <p type="p">1:偏光轉換器</p>  
        <p type="p">2:偏振分光鏡</p>  
        <p type="p">20:直角稜鏡</p>  
        <p type="p">21:偏振分光介質膜</p>  
        <p type="p">3:相位延遲元件</p>  
        <p type="p">4:掃描元件</p>  
        <p type="p">6:聚焦鏡</p>  
        <p type="p">L1:第一光</p>  
        <p type="p">L2:第二光</p>  
        <p type="p">L3:第三光</p>  
        <p type="p">L4:第四光</p>  
        <p type="p">L5:第五光</p>  
        <p type="p">LS:掃描光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="666" publication-number="202626531"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626531.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>海水淡化濃縮液資源化之方法及設備</chinese-title>  
        <english-title>METHOD AND EQUIPMENT OF RECLAIMING SEA WATER DESALINATED CONCENTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250114B">C02F1/44</main-classification>  
        <further-classification edition="200601120250114B">B01D61/02</further-classification>  
        <further-classification edition="200601120250114B">B01D61/14</further-classification>  
        <further-classification edition="200601320250114B">C02F103/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科進栢誠工程顧問股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WSP ENGINEERING CONSULTANTS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHEN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張高僑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAO-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種海水淡化濃縮液資源化之方法及設備。此方法包含對海水進行第一預處理步驟，以獲得第一濃縮液及第一海淡水；對第一濃縮液進行第一循環操作；對海水進行複數次第二預處理操作，以獲得第二濃縮液及第二海淡水；以及對第二濃縮液進行複數次第二循環操作，其中藉由第二循環操作包含回流部分純水或外加純水至再濃縮槽中。藉此，可將第二濃縮液中的一價離子重複進行分離，故可高效率地分離海水中的二價離子及一價離子，並回收高純度的二價離子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and an equipment of reclaiming sea water desalinated concentrate are provided. The method includes performing a first pretreatment step on the sea water to obtain a first concentrated solution and a first desalinated water; performing a first loop operation on the first concentrated solution; performing a second pretreatment step on the sea water to obtain a second concentrated solution and a second desalinated water; and performing plural second loop operations on the second concentrated solution. The second loop operations include adding pure water by recycling or additionally adding into a reconcentrated tank. Thus, the monovalent ions can be separated repeatedly, so the divalent ions and monovalent ions of the sea water can be effectively separated, and the divalent ions with high purity can be reclaimed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110,120,130,140:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="667" publication-number="202628977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及晶片封裝結構</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND CHIP PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10W20/40</main-classification>  
        <further-classification edition="202601120260401B">H10W76/60</further-classification>  
        <further-classification edition="200601120260401B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王侑信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種電子裝置及晶片封裝結構。所述晶片封裝結構包含一封裝載板，其包含一絕緣層及埋置於所述絕緣層的兩個金屬層。其中一個所述金屬層鄰近於所述絕緣層的外表面且包含一天線佈局段及多個頻率調整墊。所述天線佈局段自邊緣凹設形成一槽孔天線及分別位於所述槽孔天線相反兩側的多個配置孔。多個所述頻率調整墊分別位於多個所述配置孔之內且未接觸所述天線佈局段。多個所述頻率調整墊裸露於所述外表面。所述天線佈局段具有裸露於所述外表面的多個槽型調整墊，其鄰近於所述槽孔天線的底壁且分別位於所述槽孔天線的所述相反兩側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an electronic device and a chip package structure. The chip package structure has a packaging carrier, which includes an insulating layer and two metal layers embedded in the insulating layer. One of the two metal layers is arranged adjacent to an outer surface and includes an antenna layout segment and a plurality of frequency adjustment pads. The antenna layout segment has a slot antenna recessed from an edge thereof and a plurality of layout holes that are located at two opposite sides of the slot antenna. The frequency adjustment pads are respectively located in the layout holes and are not in contact with the antenna layout segments. The frequency-adjustment pads are exposed from the outer surface. The antenna layout segment has a plurality of slot-shape adjustment pads that are exposed from the outer surface. The slot-shape adjustment pads are arranged adjacent to a bottom of the slot antenna and are located at the two opposite sides of the slot antenna.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:電子裝置</p>  
        <p type="p">100:晶片封裝結構</p>  
        <p type="p">1:封裝載板</p>  
        <p type="p">11:絕緣層</p>  
        <p type="p">111:內表面</p>  
        <p type="p">112:外表面</p>  
        <p type="p">1212:槽孔天線</p>  
        <p type="p">1213:槽型調整墊</p>  
        <p type="p">1213-1:第一槽型調整墊</p>  
        <p type="p">1213-2:第二槽型調整墊</p>  
        <p type="p">1214:配置孔</p>  
        <p type="p">1215:接地墊</p>  
        <p type="p">122:頻率調整墊</p>  
        <p type="p">122-1:第一頻率調整墊</p>  
        <p type="p">122-2:第二頻率調整墊</p>  
        <p type="p">2:匹配元件</p>  
        <p type="p">3:封裝體</p>  
        <p type="p">200:電路板</p>  
        <p type="p">201:接地層</p>  
        <p type="p">2011:避讓孔</p>  
        <p type="p">202:調整線路</p>  
        <p type="p">203:基板</p>  
        <p type="p">T:厚度方向</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="668" publication-number="202627749"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627749.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源供應裝置及其操作方法</chinese-title>  
        <english-title>POWER SUPPLY DEVICE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F1/26</main-classification>  
        <further-classification edition="201901120250203B">G06F1/32</further-classification>  
        <further-classification edition="201901120250203B">G06F1/3206</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃順治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛黛娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, TAI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林立凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電源供應裝置及其操作方法。電源供應裝置包括周邊控制電路、周邊直流直流轉換電路、閂鎖電路以及USB連接器。周邊直流直流轉換電路供電給周邊控制電路。響應於周邊控制電路輸出觸發訊息給閂鎖電路以進入節能模式，閂鎖電路進入並保持於閂鎖態以禁能周邊直流直流轉換電路進而停止供電給周邊控制電路。響應於USB連接器將外部USB電源電壓傳輸給閂鎖電路，閂鎖電路解除閂鎖態以致能周邊直流直流轉換電路進而恢復供電給周邊控制電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a power supply device and an operation method thereof. The power supply device includes a peripheral control circuit, a peripheral DC-DC conversion circuit, a latch circuit, and a USB connector. The peripheral DC-DC conversion circuit supplies power to the peripheral control circuit. In response to the peripheral control circuit outputting a trigger signal to the latch circuit for entering an energy-saving mode, the latch circuit enters and remains in a latch state to disable the peripheral DC-DC conversion circuit and thereby stops the peripheral DC-DC conversion circuit from supplying power to the peripheral control circuit. In response to the USB connector transmitting an external USB power voltage to the latch circuit, the latch circuit unlocks the latch state to enable the peripheral DC-DC conversion circuit to resume power to the peripheral control circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統電路</p>  
        <p type="p">20:交流電能</p>  
        <p type="p">100:電源供應裝置</p>  
        <p type="p">110:交流直流轉換電路</p>  
        <p type="p">120:電力控制電路</p>  
        <p type="p">130:周邊直流直流轉換電路</p>  
        <p type="p">140:通用序列匯流排(USB)連接器</p>  
        <p type="p">150:閂鎖電路</p>  
        <p type="p">160:周邊控制電路</p>  
        <p type="p">170:個性化裝置</p>  
        <p type="p">VOUT_1、VOUT_2、VOUT_n:直流電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="669" publication-number="202627656"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627656.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明投影膜結構</chinese-title>  
        <english-title>TRANSPARENT PROJECTION FILM STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250512B">G03B21/60</main-classification>  
        <further-classification edition="200601120250512B">G02B6/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳喻翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU- HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒泓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種透明投影膜結構。透明投影膜結構包含基材層及多個導光微結構，導光微結構設置於基材層之上。每個導光微結構具有至少一斜面，斜面與基材層的夾角定義為第一角度，且導光微結構沿著第一軸所定義的方向與第二軸所定義的方向排列。透明投影膜結構也包含多個反射層，反射層設置於導光微結構之上。每個導光微結構於基材層上的正投影的一邊與第一軸的夾角定義為第二角度，第二角度是可變的且介於-35°至+35°。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent projection film structure is provided. The transparent projection film structure includes a substrate layer and multiple light-guiding microstructures disposed on the substrate layer. Each microstructure has at least one inclined surface, the included angle between the inclined surface and the substrate layer defines a first angle. The microstructures are arranged along a first axis and a second axis. The transparent projection film structure also includes multiple reflective layers disposed on the microstructures. An included angle between one side of the orthographic projection of each microstructure on the substrate layer and the first axis defines a second angle, which is variable between -35° and +35°.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:透明投影膜結構</p>  
        <p type="p">10:基材層</p>  
        <p type="p">20:導光微結構</p>  
        <p type="p">40:反射層</p>  
        <p type="p">PJ:投影機</p>  
        <p type="p">U:使用者</p>  
        <p type="p">Y,Z:坐標軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="670" publication-number="202627733"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627733.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>校正晶片中時脈訊號因時間造成漂移的電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE THAT CORRECTS DRIFT OF CLOCK SIGNAL IN CHIP DUE TO TIME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F1/10</main-classification>  
        <further-classification edition="200601120250401B">H03L7/085</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括邏輯控制器、時間數位轉換器，和時脈調整電路。邏輯控制器接收時脈訊號，且依據時脈訊號產生第一訊號和第二訊號。第一訊號領先第二訊號第一時間差。時間數位轉換器包括複數延時電路，接收第一訊號和第二訊號，透過延時電路使得第二訊號花費第二時間差追上第一訊號。時脈調整電路依據時脈訊號的前後週期中所分別計算出的第一時間差和第二時間差的總和，對應調整時脈訊號的頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a logic controller, a time-to-digital converter, and a clock trimming circuit. The logic controller receives a clock signal and generates a first signal and a second signal according to the clock signal. The first signal leads the second signal by a first time difference. The time-to-digital converter includes a plurality of delay circuits, receives the first signal and the second signal, and uses the delay circuits to enable the second signal to spend a second time difference to catch up with the first signal. The clock trimming circuit adjusts a frequency of the clock signal accordingly based on the sum of the first time difference and the second time difference respectively calculated in a preceding period and a following period of the clock signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">102:邏輯控制器</p>  
        <p type="p">104:時間數位轉換器</p>  
        <p type="p">106:計數器</p>  
        <p type="p">108:緩衝器</p>  
        <p type="p">110:比較器</p>  
        <p type="p">112:時脈產生器</p>  
        <p type="p">114:時脈調整電路</p>  
        <p type="p">116:事件偵測器</p>  
        <p type="p">120:時脈訊號</p>  
        <p type="p">122:第一訊號</p>  
        <p type="p">124:第二訊號</p>  
        <p type="p">126:指示訊號</p>  
        <p type="p">128,132:圈數訊號</p>  
        <p type="p">130:觸發訊號</p>  
        <p type="p">134:比較結果</p>  
        <p type="p">136,146,148:控制訊號</p>  
        <p type="p">138:事件</p>  
        <p type="p">140:致能訊號</p>  
        <p type="p">142:偵測週期設定</p>  
        <p type="p">144:調整值設定</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="671" publication-number="202628578"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628578.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250204B">H10B41/00</main-classification>  
        <further-classification edition="202301120250204B">H10B41/30</further-classification>  
        <further-classification edition="202301120250204B">H10B43/00</further-classification>  
        <further-classification edition="202301120250204B">H10B43/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴明宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭毓書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體記憶體裝置，包括：基底及設置於基底的記憶體單元區的複數個疊層結構。每一疊層結構包括：閘極堆疊、蓋層堆疊、第一及第二間隙壁以及第一及第二保護層。蓋層堆疊設置於閘極堆疊上。第一間隙壁具有覆蓋閘極堆疊與蓋層堆疊的側壁的垂直部以及自垂直部的底部橫向延伸的水平部。第二間隙壁覆蓋垂直部的側壁。第一保護層覆蓋蓋層堆疊的上表面，而第二保護層覆蓋水平部的一側壁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device is provided and includes a semiconductor substrate and stacked structures disposed on a memory cell region of the substrate. Each stacked structure includes a gate stack, a capping layer stack, first and second spacers, and first and second protective layers. The capping layer stack is disposed on the gate stack. The first gate spacer has a vertical portion covering sidewalls of the gate stack and the capping layer stack and a horizontal portion laterally extending from the bottom of the vertical portion. The second spacer covers the sidewall of the vertical portion. The first protective layer covers the upper surface of the capping layer stack, and the second protective layer covers the sidewall of the horizontal portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">100a:主動區</p>  
        <p type="p">102:穿隧介電層</p>  
        <p type="p">104,108,204:閘極層</p>  
        <p type="p">106:閘間介電層</p>  
        <p type="p">110,201:閘極堆疊</p>  
        <p type="p">120:導電蓋層</p>  
        <p type="p">122,124:絕緣蓋層</p>  
        <p type="p">130:蓋層堆疊</p>  
        <p type="p">132,206:第一間隙壁</p>  
        <p type="p">132h:水平部</p>  
        <p type="p">132v:垂直部</p>  
        <p type="p">134,208:第二間隙壁</p>  
        <p type="p">136,212,213:金屬矽化物層</p>  
        <p type="p">152,160,216:保護層</p>  
        <p type="p">202:閘極介電層</p>  
        <p type="p">210:第三間隙壁</p>  
        <p type="p">R1:記憶體單元區</p>  
        <p type="p">R2:週邊區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="672" publication-number="202628065"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628065.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及顯示裝置檢測方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND DISPLAY DEVICE DETECTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250124B">G09G3/36</main-classification>  
        <further-classification edition="200601120250124B">G02F1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹彩光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡錦誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHIN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊武璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WU CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭振隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHEN LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包含顯示面板、第一測試模組及第二測試模組。顯示面板包含複數像素、第一基板及第二基板。第一基板設有分為第一奇數電極及第一偶數電極的複數第一電極。第二基板設有分為第二奇數電極及第二偶數電極的複數第二電極。第一測試模組耦接第一奇數電極及第一偶數電極。第二測試模組耦接第二奇數電極及第二偶數電極。第一、第二測試模組的一者提供第一時序訊號，另一者提供第二時序訊號及第三時序訊號，使像素顯示複數線條。當線條中相鄰的二者呈現灰階線時，對應灰階線的二第一電極或二第二電極為短路缺陷。藉此提高不良檢出率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a display panel, a first test module and a second test module. The display panel includes a plurality of pixels, a first substrate and a second substrate. The first substrate is provided with a plurality of first electrodes divided into a plurality of first odd electrodes and a plurality of first even electrodes. The second substrate is provided with a plurality of second electrodes divided into a plurality of second odd electrodes and a plurality of second even electrodes. The first test module is coupled to the first odd electrodes and the first even electrodes. The second test module is coupled to the second odd electrodes and the second even electrodes. One of the first and second test modules provides a first timing signal, and the other provides a second timing signal and a third timing signal, so that the pixels display a plurality of lines. When the two adjacent lines present a gray scale line, the two first electrodes or the two second electrodes corresponding to the gray scale line are short-circuit defects. Thus, the defect detection rate can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:顯示面板</p>  
        <p type="p">111:第一基板</p>  
        <p type="p">112:第二基板</p>  
        <p type="p">120:第一測試模組</p>  
        <p type="p">121:第一奇數測試電路</p>  
        <p type="p">122:第一偶數測試電路</p>  
        <p type="p">130:第二測試模組</p>  
        <p type="p">131:第二奇數測試電路</p>  
        <p type="p">132:第二偶數測試電路</p>  
        <p type="p">141,142:第一晶片封裝結構</p>  
        <p type="p">151,152:第二晶片封裝結構</p>  
        <p type="p">1611,1621:第一扇出導線</p>  
        <p type="p">1711,1721:第二扇出導線</p>  
        <p type="p">CP1,CP2:導電膠結構</p>  
        <p type="p">D1,D2,D3:方向</p>  
        <p type="p">F:框膠結構</p>  
        <p type="p">P:像素</p>  
        <p type="p">R1,R2:框選區域</p>  
        <p type="p">Xr:第一電極</p>  
        <p type="p">X&lt;sub&gt;1&lt;/sub&gt;,X&lt;sub&gt;3&lt;/sub&gt;,X&lt;sub&gt;M-1&lt;/sub&gt;:第一奇數電極</p>  
        <p type="p">X&lt;sub&gt;2&lt;/sub&gt;,X&lt;sub&gt;4&lt;/sub&gt;,X&lt;sub&gt;M&lt;/sub&gt;:第一偶數電極</p>  
        <p type="p">Yc:第二電極</p>  
        <p type="p">Y&lt;sub&gt;1&lt;/sub&gt;,Y&lt;sub&gt;3&lt;/sub&gt;,Y&lt;sub&gt;N&lt;/sub&gt;_&lt;sub&gt;1&lt;/sub&gt;:第二奇數電極</p>  
        <p type="p">Y&lt;sub&gt;2&lt;/sub&gt;,Y&lt;sub&gt;4&lt;/sub&gt;,Y&lt;sub&gt;N&lt;/sub&gt;:第二偶數電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="673" publication-number="202628441"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628441.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耳機</chinese-title>  
        <english-title>EARPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250107B">H04R5/02</main-classification>  
        <further-classification edition="200601120250107B">H04R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美律電子(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張均鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉致宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋柏勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, PO HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耳機，適於配戴於一耳朵。耳機包括一聲學件及一配戴件。配戴件連接於聲學件，聲學件及配戴件共同形成一聲學腔室。配戴件包括一定位部、一出音面及一聲學出音孔，聲學出音孔位於出音面且連通於聲學腔室。當耳機配戴於耳朵時，定位部伸入耳朵且抵靠耳朵的一耳甲腔，出音面面向耳朵的一耳道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An earphone adapted for being worn on an ear is provided. The earphone includes an acoustical component and a wearing component. The wearing component is connected to the acoustical component, and the acoustical component and the wearing component together form an acoustic chamber. The wearing component includes a positioning portion, a sound output surface and an acoustic sound output hole. The acoustic sound output hole is located on the sound output surface and connected to the acoustic chamber. When the earphone is worn on the ear, the positioning portion extends into the ear and abuts against a cavum conchae of the ear, and the sound output surface faces an ear canal of the ear.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">G:中空構造</p>  
        <p type="p">P:聲學腔室</p>  
        <p type="p">100:耳機</p>  
        <p type="p">110:聲學件</p>  
        <p type="p">120:配戴件</p>  
        <p type="p">121:定位部</p>  
        <p type="p">122:出音面</p>  
        <p type="p">123:聲學出音孔</p>  
        <p type="p">125:支撐結構</p>  
        <p type="p">1252:第二部分</p>  
        <p type="p">200:耳朵</p>  
        <p type="p">210:耳甲腔</p>  
        <p type="p">220:耳道</p>  
        <p type="p">221:耳道入口</p>  
        <p type="p">230:耳屏</p>  
        <p type="p">240:外耳殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="674" publication-number="202627503"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627503.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試裝置及其測試方法</chinese-title>  
        <english-title>TEST DEVICE AND TEST METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G01R31/28</main-classification>  
        <further-classification edition="202001120250501B">G01R31/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李進福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅泓翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, HONG-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUNG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林沛澐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PEI-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種測試裝置及其測試方法被提出。測試裝置包括多個連接線、多個第一測試電路以及多個第二測試電路。多個第一測試電路依據多個第一測試資料以分別產生多個檢測信號，並將多個檢測信號分別傳送至多個連接線。多個第二測試電路由多個連接線接收多個檢測信號，多個第二測試電路使多個第二測試資料分別與多個檢測信號相互比較以產生多個測試結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A test device and a test method thereof are provided. The test device includes a plurality of connection lines, a plurality of first test circuits and a plurality of second test circuits. The plurality of first test circuits respectively generate a plurality of detection signals according to a plurality of first test data, and transmit the plurality of detection signals to the plurality of connection lines respectively. The plurality of second test circuits receive the plurality of detection signals through the plurality of connection lines, and the plurality of second test circuits compare the plurality of second test data with the plurality of detection signals to generate a plurality of test results.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:測試裝置</p>  
        <p type="p">110、210:列測試型樣產生器</p>  
        <p type="p">120、220:行測試型樣產生器</p>  
        <p type="p">130、230:控制器</p>  
        <p type="p">240:移位暫存器</p>  
        <p type="p">250:位址解碼器</p>  
        <p type="p">AR1、AR2:測試電路陣列</p>  
        <p type="p">CLK:時脈信號</p>  
        <p type="p">CSTX、CSRX、Y1~YN:控制信號</p>  
        <p type="p">CL1~CLM:行測試線</p>  
        <p type="p">DS11~DSNM:檢測信號</p>  
        <p type="p">C[0]~C[P]、DOUT:測試結果</p>  
        <p type="p">MODE:模式選擇信號</p>  
        <p type="p">P11~PNM:連接線</p>  
        <p type="p">RST:重置信號</p>  
        <p type="p">RL1~RLN:列測試線</p>  
        <p type="p">ST:啟始信號</p>  
        <p type="p">TX11~TXNM、RX11~RXNM:測試電路</p>  
        <p type="p">TC1~TCM:測試行</p>  
        <p type="p">TRP1~TRPN、TCP1~TCPM、TAP1~TAPN、TBP1~TBPM:測試資料</p>  
        <p type="p">TR1~TRN:測試列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="675" publication-number="202627794"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627794.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>庫間相容性驗證方法及其系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR VERIFYING COMPATIBILITY BETWEEN LIBRARIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250620B">G06F8/20</main-classification>  
        <further-classification edition="201801120250620B">G06F8/65</further-classification>  
        <further-classification edition="201801120250620B">G06F8/70</further-classification>  
        <further-classification edition="201801120250620B">G06F8/72</further-classification>  
        <further-classification edition="200601120250620B">G06F9/52</further-classification>  
        <further-classification edition="200601120250620B">G06F9/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李艷鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種庫間相容性驗證方法及其系統。該方法包括如下步驟：接收包括直接模組的第一庫；接收包括由該直接模組引用的間接模組的第二庫；和判斷該直接模組中包括的位元組碼單位的元件是否包括在該間接模組中，從而驗證庫之間的相容性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided a method and system for verifying compatibility between libraries. The method includes receiving a first library including a direct module, receiving a second library including an indirect module referenced by the direct module, and verifying compatibility between the first library and the second library by deciding whether a component of a byte code unit included in the direct module is included in the indirect module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="676" publication-number="202628437"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628437.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耳機</chinese-title>  
        <english-title>EARPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H04R1/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美律電子(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉致宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張均鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耳機，適於配戴於一耳朵。耳機包括一配戴件及一聲學件。配戴件包括一後定位部及一聲學出音通道。聲學件連接於配戴件，聲學件包括一聲學腔室，聲學腔室連通於聲學出音通道。當耳機配戴於耳朵時，配戴件位於耳朵的一耳甲腔內，後定位部對耳甲腔的一後緣施加一定位力，以使耳機定位於耳朵。聲學出音通道對應於耳朵的一耳道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An earphone adapted to be worn on an ear is provided. The earphone includes a wearing component and an acoustical component. The wearing component includes a rear positioning portion and an acoustic channel. The acoustical component is connected to the wearing component, and the acoustical component includes an acoustic chamber, and the acoustic chamber is connected to the acoustic channel. When the earphone is worn on the ear, the wearing component is located in a cavum conchae of the ear, and the rear positioning portion exerts a positioning force on a rear edge of the cavum conchae, so that the earphone is positioned in the ear. The acoustic channel corresponds to an ear canal of the ear.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">F:定位力</p>  
        <p type="p">G:中空構造</p>  
        <p type="p">L1、L2:延伸軸線</p>  
        <p type="p">P:聲學腔室</p>  
        <p type="p">100:耳機</p>  
        <p type="p">110:聲學件</p>  
        <p type="p">121:後定位部</p>  
        <p type="p">122:聲學出音通道</p>  
        <p type="p">1221:聲學出音孔</p>  
        <p type="p">123:前定位部</p>  
        <p type="p">124:配戴本體</p>  
        <p type="p">126:出音面</p>  
        <p type="p">200:耳朵</p>  
        <p type="p">210:耳甲腔</p>  
        <p type="p">211:後緣</p>  
        <p type="p">220:耳道</p>  
        <p type="p">221:耳道入口</p>  
        <p type="p">230:耳屏</p>  
        <p type="p">240:外耳殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="677" publication-number="202628438"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628438.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耳機</chinese-title>  
        <english-title>EARPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H04R1/10</main-classification>  
        <further-classification edition="200601120260302B">H04R1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美律電子(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉致宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張均鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耳機，適於配戴於一耳朵。耳機包括一配戴件及一聲學件。配戴件包括一前定位結構及一聲學出音通道，聲學出音通道位於前定位結構。聲學件連接於配戴件，聲學件包括一聲學腔室，聲學腔室連通於聲學出音通道。當耳機配戴於耳朵時，配戴件位於耳朵的一耳甲腔內，耳機中鄰近耳甲腔的一底部的表面位於一基準面上，聲學件及前定位結構位於基準面的一第一側，底部位於基準面的一第二側，第一側相對於第二側。前定位結構抵靠耳朵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An earphone adapted to be worn on an ear is provided. The earphone includes a wearing component and an acoustical component. The wearing component includes a front positioning structure and an acoustic channel, and the acoustic channel is located in the front positioning structure. The acoustical component is connected to the wearing component, and the acoustical component includes an acoustic chamber, and the acoustic chamber is connected to the acoustic channel. When the earphone is worn on the ear, the wearing component is located in a cavum conchae of the ear, a surface of the earphone adjacent to a bottom of the concha cavity is located on a datum plane, and the acoustical component and the front positioning structure are located on a first side of the datum plane. The bottom of the concha cavity is located on a second side of the base plane, and the first side is relative to the second side. The front positioning structure is against the ear.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">F:定位力</p>  
        <p type="p">G:中空構造</p>  
        <p type="p">L1、L2:延伸軸線</p>  
        <p type="p">P:聲學腔室</p>  
        <p type="p">S:基準面</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p>  
        <p type="p">100:耳機</p>  
        <p type="p">110:聲學件</p>  
        <p type="p">1201:前定位結構</p>  
        <p type="p">1202:後定位結構</p>  
        <p type="p">121:後定位部</p>  
        <p type="p">122:聲學出音通道</p>  
        <p type="p">1221:聲學出音孔</p>  
        <p type="p">123:前定位部</p>  
        <p type="p">124:配戴本體</p>  
        <p type="p">126:出音面</p>  
        <p type="p">200:耳朵</p>  
        <p type="p">210:耳甲腔</p>  
        <p type="p">211:後緣</p>  
        <p type="p">214:底部</p>  
        <p type="p">220:耳道</p>  
        <p type="p">221:耳道入口</p>  
        <p type="p">230:耳屏</p>  
        <p type="p">240:外耳殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="678" publication-number="202628439"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628439.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耳機</chinese-title>  
        <english-title>EARPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H04R1/10</main-classification>  
        <further-classification edition="200601120260302B">H04R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美律電子(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉致宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張均鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耳機，適於配戴於一耳朵。耳機包括一配戴件及一聲學件。配戴件包括一前定位部及一聲學出音通道，前定位部位於配戴件的一延伸軸線上。聲學件連接於配戴件，聲學件包括一聲學腔室，聲學腔室連通於聲學出音通道。當耳機配戴於耳朵時，前定位部被耳朵的一耳屏覆蓋且對耳屏施加一第一定位力，以將配戴件定位於耳朵的一耳甲腔內，聲學出音通道對應於耳朵的一耳道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An earphone adapted to be worn on an ear is provided. The earphone includes a wearing component and an acoustical component. The wearing component includes a front positioning portion and an acoustic channel. The front positioning portion is located on an extension axis of the wearing component. The acoustical component is connected to the wearing component, and the acoustical component includes an acoustic chamber, and the acoustic chamber is connected to the acoustic channel. When the earphone is worn on the ear, the front positioning portion is covered by a tragus of the ear and exerts a first positioning force on the tragus, so that the wearing component is positioned in a cavum conchae of the ear. The acoustic channel corresponds to an ear canal of the ear.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">F1:第一定位力</p>  
        <p type="p">F2:第二定位力</p>  
        <p type="p">G:中空構造</p>  
        <p type="p">L1、L2:延伸軸線</p>  
        <p type="p">P:聲學腔室</p>  
        <p type="p">100:耳機</p>  
        <p type="p">110:聲學件</p>  
        <p type="p">121:後定位部</p>  
        <p type="p">122:聲學出音通道</p>  
        <p type="p">1221:聲學出音孔</p>  
        <p type="p">123:前定位部</p>  
        <p type="p">124:配戴本體</p>  
        <p type="p">126:出音面</p>  
        <p type="p">200:耳朵</p>  
        <p type="p">210:耳甲腔</p>  
        <p type="p">211:後緣</p>  
        <p type="p">220:耳道</p>  
        <p type="p">221:耳道入口</p>  
        <p type="p">230:耳屏</p>  
        <p type="p">240:外耳殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="679" publication-number="202625957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像元件之清潔裝置及其操作方法</chinese-title>  
        <english-title>IMAGING ELEMENT CLEANING DEVICE AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">A61B1/00</main-classification>  
        <further-classification edition="200601120250423B">B08B9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐智誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂世傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昆達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUN-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種成像元件之清潔裝置，用以清潔成像元件之透鏡，清潔裝置包含：包含清潔元件以及驅動組件。清潔元件包含柔性套部係呈中空狀且包含相對的遠端與近端、清潔部部分覆蓋柔性套部的遠端、以及狹縫部貫設於清潔部。驅動組件包含套管，套管包含相對設置的一遠端與一近端，且供成像元件穿設，清潔元件的柔性套部套設於套管的遠端，其中當驅動組件被驅動以移動清潔元件時，成像元件的透鏡穿過狹縫部以藉清潔部進行清潔並有效地清潔透鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging element cleaning device cleaning device for cleaning a lens of an imaging element is provided, including a cleaning element and a driving component. The cleaning element includes a flexible sleeve that is hollow and a distal end and a proximal end opposite to the distal end, the cleaning part partially covering the distal end of the flexible sleeve, and a slit part penetrating through the cleaning part. The driving component includes a tube, including a distal end and a proximal end opposite to the distal end, for the imaging element to insert through, and the flexible sleeve of the cleaning element is sleeved on a distal end of the tube, wherein when the driving component is driven to move the cleaning element, the lens of the imaging element is inserted through the slit part to be cleaned by the cleaning part and the lens is effectively cleaned.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:成像元件之清潔裝置</p>  
        <p type="p">100:清潔元件</p>  
        <p type="p">110:柔性套部</p>  
        <p type="p">111:遠端</p>  
        <p type="p">113:近端</p>  
        <p type="p">120:清潔部</p>  
        <p type="p">130:狹縫部</p>  
        <p type="p">200:驅動組件</p>  
        <p type="p">210:套管</p>  
        <p type="p">211:遠端</p>  
        <p type="p">212:近端</p>  
        <p type="p">220:導引元件</p>  
        <p type="p">230:導引滑槽</p>  
        <p type="p">231:主滑槽</p>  
        <p type="p">2311:遠端</p>  
        <p type="p">2312:近端</p>  
        <p type="p">232:第一卡扣槽</p>  
        <p type="p">233:第二卡扣槽</p>  
        <p type="p">2331:槽底</p>  
        <p type="p">240:控制握把</p>  
        <p type="p">AX:中軸</p>  
        <p type="p">θ:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="680" publication-number="202627112"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627112.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>合金鋼球化盤元及其製造方法</chinese-title>  
        <english-title>ALLOY STEEL SPHEROIDIZED WIRE ROD AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">C21D1/32</main-classification>  
        <further-classification edition="200601120250423B">C21D7/02</further-classification>  
        <further-classification edition="200601120250423B">C21D1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪一正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, I-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭世明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪敏雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MING-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, MING-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種合金鋼球化盤元及其製造方法。此方法包含對合金鋼胚進行粗軋操作，以獲得粗軋鋼材；對粗軋鋼材進行精軋操作，以獲得精軋鋼材，其中精軋操作的精軋溫度為770°C至870°C；對精軋鋼材進行盤捲操作，以獲得合金鋼捲；對合金鋼捲進行冷卻操作，以獲得熱軋盤元，其中冷卻操作的冷卻速率為0.5°C/s至1.5°C/s；以及對熱軋盤元進行球化退火操作，以獲得合金鋼球化盤元。藉此，可製得具有良好球化率及硬度的合金鋼球化盤元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An alloy steel spheroidized wire rod and a method of manufacturing the same are provided. The method includes performing a rough rolling operation on an alloy steel billet to obtain a rough-rolled steel; performing a finishing milling operation on the rough-rolled steel to obtain a finishing-milled steel, in which a finishing mill temperature of the finishing milling operation is 770°C to 870°C; performing a rolling operation to the finishing-milled steel to obtain an alloy steel coil; performing a cooling operation on the alloy steel coil to obtain a hot-rolled wire rod, in which a cooling rate of the cooling operation is 0.5°C/s to 1.5°C/s; and performing a spheroidizing annealing operation on the hot-rolled wire rod to obtain the alloy steel spheroidized wire rod. Thus, the alloy steel spheroidized wire rod with great spheroidization rate and hardness can be manufactured.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110,120,130,140,150:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="681" publication-number="202628494"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628494.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱結構及電路板模組</chinese-title>  
        <english-title>HEAT DISSIPATION STRUCTURE AND CIRCUIT BOARD MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">H05K1/02</main-classification>  
        <further-classification edition="200601120250423B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃順治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖昌斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHANGBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭許成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, XUCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>於錦雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JINYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭春亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱結構，適於對設置於一基板的一熱源散熱。散熱結構包括一絕緣層、一防漏層、一導熱材料以及一散熱器。絕緣層連接於該基板且具有一第一開孔，熱源位於第一開孔內。防漏層連接於絕緣層，且具有一第二開孔。第二開孔對應於第一開孔。導熱材料位於第二開孔內且接觸熱源。散熱器覆蓋第二開孔。防漏層位於散熱器與絕緣層之間。熱源的熱適於經由導熱材料而傳導至散熱器。一種電路板模組亦被提及。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation structure is adapted to dissipate heat from a heat source which is disposed on a base board. The heat dissipation structure includes an insulation layer, an anti-leak layer, a thermal conductive material and a heat sink. The insulation layer is connected to the base board and has a first opening hole. The heat source is located inside the first opening hole. The anti-leak layer is connected to the insulation layer and has a second opening hole. The second opening hole is corresponding to the first opening hole. The thermal conductive material is located inside the second opening hole and contact to the heat source. The heat sink covers the second opening hole. The anti-leak layer is located between the heat sink and the insulation layer. The heat of the heat source is adapted to conduct from the thermal conductive material to the heat sink. A circuit board module is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板模組</p>  
        <p type="p">110:處理器</p>  
        <p type="p">111:基板</p>  
        <p type="p">1111:電子元件</p>  
        <p type="p">113:熱源</p>  
        <p type="p">120:散熱結構</p>  
        <p type="p">121:絕緣層</p>  
        <p type="p">1211:第一開孔</p>  
        <p type="p">122:防漏層</p>  
        <p type="p">1221:第二開孔</p>  
        <p type="p">123:導熱材料</p>  
        <p type="p">124:散熱器</p>  
        <p type="p">130:電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="682" publication-number="202628079"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628079.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音頻式資料傳輸系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">G10L21/06</main-classification>  
        <further-classification edition="200601120250401B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皓博科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARBOR TECHNOLOGY SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂宏益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HUNG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種音頻式資料傳輸系統，包含至少一資料傳輸端、一第一轉換模組、一第二轉換模組、至少一資料接收端，該第一轉換模組可將原始數位資料之數位格式轉換為數位音頻格式，該第二轉換模組可將數位音頻資料格式轉化為該原始數位資料，並應用數位音頻格式本身之多聲道架構，使得在傳輸該數位音頻資料時，可在該第一轉換模組、該第二轉換模組之間形成至少一通道，而該數位音頻資料可於該通道中進行傳輸。藉此，達到快速傳輸資料之功效，特別的是本發明將原始數位資料之數位格式轉換為數位音頻格式以進行資料傳輸之技術，相對於習用麥克風收到音頻後，應用類比音頻轉換為數位音頻之後進行傳輸，最後再將數位音頻轉換回聲音並播放之轉換技術係明顯不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:資料傳輸端</p>  
        <p type="p">20:第一轉換模組</p>  
        <p type="p">21:第一接收單元</p>  
        <p type="p">22:第一處理單元</p>  
        <p type="p">23:第一傳輸單元</p>  
        <p type="p">30:第二轉換模組</p>  
        <p type="p">31:第二接收單元</p>  
        <p type="p">32:第二處理單元</p>  
        <p type="p">33:第二傳輸單元</p>  
        <p type="p">40:資料接收端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="683" publication-number="202626231"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626231.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151113</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>刀具加工訊號異常偵測方法及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250310B">B23C3/02</main-classification>  
        <further-classification edition="200601120250310B">G05B19/404</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍華科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊定學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TING-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹中丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳詩豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊萬騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴宗毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖剛佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃丞安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡焱棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種刀具加工訊號異常偵測方法，利用一電腦系統來執行以下步驟：獲得一加工訊號；根據一時間閾值將該加工訊號切分為一第一訊號部分及一第二訊號部分，並利用一訊號分類模型，獲得一第一分類結果及一第二分類結果，據以獲得一初步判定結果；對該第一訊號部分及該第二訊號部分分別進行特徵提取，以獲得一第一特徵資料及一第二特徵資料；根據該第一特徵資料及一連續切削群集的群集中心獲得一第一距離，且根據該第二特徵資料及一斷續切削群集的群集中心獲得一第二距離；及根據該第一距離及該第二距離獲得一最終判定結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S31~S37:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="684" publication-number="202627983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件瑕疵分析方法及其運算裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250401B">G06T7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍華科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊定學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TING-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊萬騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳詩豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈庭緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李郡凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡俊聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立陞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉和昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈姿儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪唯峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林古糧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種工件瑕疵分析方法，利用一電腦系統來執行以下步驟：獲得有關於一待測工件的多張圖像；對於每一圖像，利用目標檢測技術，將該圖像中該待測工件所在的一圖像部分截取出來，並從該圖像部分中截取出與瑕疵有關的一目標圖像區域；將每一目標圖像區域平均切分成N(N≥1)個待測圖像區塊；對於每一待測圖像區塊，利用一異常檢測模型，獲得一區塊異常分數；根據所有區塊異常分數獲得一工件異常分數；根據一預設閾值及該工件異常分數，獲得一第一分析結果；及根據該待測工件的該等圖像中的任一者，利用一瑕疵辨識模型，獲得一第二分析結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S18:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="685" publication-number="202627273"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627273.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卡扣式拼接地板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">E04F15/02</main-classification>  
        <further-classification edition="200601120250402B">E04F15/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拿舍家居股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEXUS HOME&amp;HARDWOOD CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡耀鋐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種卡扣式拼接地板，其包含有一基材本體以及一封邊結構。基材本體具有複數個端面與一形成於複數個端面之結合槽，每一個端面形成一階部。封邊結構設置於基材本體之複數個端面，封邊結構具有一形成於內側面的肋部與一形成於外側面的卡扣件，肋部會嵌入於基材本體之結合槽。藉此，封邊結構與基材本體得以有緊密的結合，讓封邊結構不容易與基材本體脫離，於長時間使用下亦可保持卡扣式拼接地板的完整性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:卡扣式拼接地板</p>  
        <p type="p">20:基材本體</p>  
        <p type="p">30:封邊結構</p>  
        <p type="p">32:卡扣件</p>  
        <p type="p">321:第一卡扣部</p>  
        <p type="p">322:第二卡扣部</p>  
        <p type="p">323:第三卡扣部</p>  
        <p type="p">324:第四卡扣部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="686" publication-number="202627259"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627259.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>仿羽絨複合結構及其用品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250126B">D04H1/541</main-classification>  
        <further-classification edition="201201120250126B">D04H1/4382</further-classification>  
        <further-classification edition="200601120250126B">B32B5/02</further-classification>  
        <further-classification edition="200601120250126B">B32B33/00</further-classification>  
        <further-classification edition="200601120250126B">B32B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新麗企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡榮富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭忠山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾楷智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱秉瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一仿羽絨複合結構，其包含基底層及仿羽絨層，以仿羽絨複合結構之總重量計，基底層重量為9重量%至27重量%，仿羽絨層重量為73重量%至91重量%；其中基底層與仿羽絨層分別包含芯鞘纖維、超細纖維及三維捲曲纖維；基底層由前述纖維交叉鋪疊而成，密度為14 gsm至40 gsm；仿羽絨層位於基底層上，由前述纖維以絮亂方式堆疊而成，密度為30 gsm至400 gsm；超細纖維的細度為0.1 D至1.5 D；三維捲曲纖維的中空度為5%至30%且捲曲率為2%至25%。本發明之仿羽絨複合結構的壓縮回復率為90%以上。此外本發明亦提供該仿羽絨複合結構製作的衣物及用品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:仿羽絨複合結構</p>  
        <p type="p">10:基底層</p>  
        <p type="p">11:仿羽絨層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="687" publication-number="202625971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非侵入式血糖量測方法及其量測裝置</chinese-title>  
        <english-title>NON-INVASIVE METHOD FOR ESTIMATING BLOOD GLUCOSE AND THE DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250126B">A61B5/1477</main-classification>  
        <further-classification edition="200601120250126B">A61B5/145</further-classification>  
        <further-classification edition="200601120250126B">G01N33/49</further-classification>  
        <further-classification edition="202101120250126B">A61B5/0533</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恆達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGH DISTINCTION OPTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳禎祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種非侵入式血糖量測裝置，包含一基板，其上設置有一光源、一接收器、一隔牆、一電源、一電流調整器、一控制單元以及一計算單元。該光源提供一偵測光照射受測者皮膚，該電流調整器改變該電源提供給該光源之電流，使該光源產生不同光強度之偵測光，以使該等偵測光到達皮膚下不同的深度。該接收器偵測該等偵測光之反射光，並傳送給該計算單元。該計算單元經預定之處理後產生一血糖之預估值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A non-invasive device for estimating blood glucose includes a substrate, on which a light source, a receiver, a wall, a power source, a current controller, a control unit, and a calculating unit are provided. The light source emits a detecting light to the skin of a subject, while the current controller changes the current provided to the light source to make the light source emit the detecting lights with different intensities that makes the detect lights go to different depths under the skin. The receiver senses the reflected lights of the detecting lights and transmits them to the calculating unit. The calculating unit processes the reflected lights to obtain an estimated value of blood glucose.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:血糖量測裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">12:光源</p>  
        <p type="p">14:接收器</p>  
        <p type="p">16:隔牆</p>  
        <p type="p">18:電源</p>  
        <p type="p">20:電流調整器</p>  
        <p type="p">22:控制單元</p>  
        <p type="p">24:計算單元</p>  
        <p type="p">S:皮膚</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="688" publication-number="202627848"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627848.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組織特徵辨識系統與辨識方法</chinese-title>  
        <english-title>IDENTITY AUTHENTICATION SYSTEM BY DETECTING SUBCUTANEOUS TISSUE AND THE AUTHENTICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250423B">G06F21/32</main-classification>  
        <further-classification edition="202201120250423B">G06V10/60</further-classification>  
        <further-classification edition="202201120250423B">G06V40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恆達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGH DISTINCTION OPTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳禎祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組織特徵辨識系統，包含有一偵測單元以及一比對單元。該偵測單元包含有一光源模組與一感測模組；其中該光源模組產生複數個偵測光照射一使用者特定位置的皮膚，令該等偵測光會到達皮膚下方組織的不同位置後被反射；該感測模組偵測該等偵測光的反射光，並據以轉換為複數個偵測訊號後形成一組織特徵訊號；以及一比對單元，接收該偵測單元之該後形成一組織特徵訊號，並比對該後形成一組織特徵訊號與一認證使用者組織訊號，據以產生一比對結果；其中，如該比對結果為該組織特徵訊號與該使用者特徵訊號相同，則該使用者通過身分認證。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An identity authentication system includes a detecting unit and an authenticating unit. The detecting unit has a light module and a sensing module, wherein the light module provides sensing lights to different positions of the subcutaneous tissue of a subject, and the sensing module senses reflections of the sensing lights and coverts them into a tissue signal. The authenticating unit receives the tissue signal and compare the tissue signal with an identified user signal to form a comparison result. The subject passes identity authentication if the identified result shows the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:智慧戒指</p>  
        <p type="p">12:車輛</p>  
        <p type="p">14:電路板</p>  
        <p type="p">16:偵測單元</p>  
        <p type="p">18:電源</p>  
        <p type="p">20:傳送單元</p>  
        <p type="p">22:光源模組22</p>  
        <p type="p">24:感測模組</p>  
        <p type="p">26:光源</p>  
        <p type="p">28:電流調整器</p>  
        <p type="p">30:感測器</p>  
        <p type="p">32:處理器</p>  
        <p type="p">34:基板</p>  
        <p type="p">36:隔牆</p>  
        <p type="p">38:接收單元</p>  
        <p type="p">40:比對單元</p>  
        <p type="p">42:控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="689" publication-number="202626188"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626188.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫控混料裝置及應用於溫控混料裝置的待混料裝置</chinese-title>  
        <english-title>THERMAL MIXER AND DEVICE HAVING FLUIDS TO BE MIXED USED IN THERMAL MIXER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250423B">B01F33/452</main-classification>  
        <further-classification edition="202201120250423B">B01F35/221</further-classification>  
        <further-classification edition="202201120250423B">B01F35/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐新怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昌周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林央正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林立信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶坤彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIEH, KUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王羽淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈欣欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, HSIN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種溫控混料裝置，用於對待混料裝置之待混料流體於預定溫度進行攪拌，待混料裝置包含收容於其中的磁性攪拌子。溫控混料裝置包括：熱交換模組、磁力攪拌模組以及控制模組。熱交換模組包括：熱交換單元及致冷及/或加熱元件。磁力攪拌模組包括：磁力組件及驅動組件。驅動組件與磁力組件傳動連接。控制模組用於控制致冷及/或加熱元件以對應調控待混料裝置之待混料流體位於預定溫度，以及驅動該驅動組件帶動磁力組件旋轉以對應使磁力組件藉由磁吸力帶動磁性攪拌子轉動以對待混料流體進行混料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermal mixer used to stir fluids to be mixed in a device to be mixed at a predetermined temperature. The device to be mixed includes a magnetic stirrer contained therein. The thermal mixer includes a heat exchange module, a magnetic stirring module and a control module. The heat exchange module includes a heat exchange unit and refrigeration and/or heating elements. The magnetic stirring module includes a magnetic component and a drive component. The driving component is transmission connected with the magnetic component. The control module is used to control the refrigeration and/or heating elements to correspondingly regulate the fluid to be mixed in the device to be mixed at a predetermined temperature, and to drive the drive component to drive the magnetic component to rotate, so that so that the magnetic component drives the magnetic stirrer to rotate to mix the fluids to be mixed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:溫控混料裝置</p>  
        <p type="p">110:熱交換模組</p>  
        <p type="p">111:熱交換單元</p>  
        <p type="p">111A:熱傳導元件</p>  
        <p type="p">111B:熱隔絕元件</p>  
        <p type="p">112:致冷及/或加熱元件</p>  
        <p type="p">113:散熱單元</p>  
        <p type="p">113A:均熱板</p>  
        <p type="p">113B:風扇組合</p>  
        <p type="p">113C:熱管組合</p>  
        <p type="p">113D:鰭片組合</p>  
        <p type="p">121A:環狀轉子</p>  
        <p type="p">122:驅動組件</p>  
        <p type="p">122A:轉軸</p>  
        <p type="p">122B:皮帶</p>  
        <p type="p">122C:皮帶驅動輪</p>  
        <p type="p">122D:驅動馬達</p>  
        <p type="p">123A:承載座</p>  
        <p type="p">123A1:載台</p>  
        <p type="p">123B:垂直支架</p>  
        <p type="p">123C:固持件</p>  
        <p type="p">123CB:本體部</p>  
        <p type="p">123CH:固持部</p>  
        <p type="p">123T:安裝板</p>  
        <p type="p">124:升降組件</p>  
        <p type="p">124A:第一滑動件</p>  
        <p type="p">124B:第二滑動件</p>  
        <p type="p">124C:升降驅動機構</p>  
        <p type="p">124D:導槽</p>  
        <p type="p">140A2:推桿</p>  
        <p type="p">140B:待混料流體</p>  
        <p type="p">140C:磁性攪拌子</p>  
        <p type="p">151B:托架</p>  
        <p type="p">151C:支撐件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="690" publication-number="202626333"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626333.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無縫雙金屬結合的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">B29C65/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩摩亞商大煜國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIANT GLORY INTERNATIONAL LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>WS</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭承平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHENG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無縫雙金屬結合的方法，包含一粗化步驟、一成型步驟，及一熔接步驟。該粗化步驟是準備一第一金屬塊體及一第二金屬塊體，並將兩者的表面進行粗化。該成型步驟是準備具有一下模及一模蓋的模具，該第一金屬塊體置入該下模，並於第一金屬塊體的第一連接面形成由高分子材料構成的一連接單元、一第一尖點部，及一第二尖點部。該熔接步驟是利用該模蓋壓覆該第二金屬塊並進行超音波熔接形成一結合塊體。本發明通過超音波熔接來熔融該第一尖點部與該第二尖點部，填滿該第一金屬塊體、該第二金屬塊體與該連接單元間的縫隙以達成無縫接合的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第一金屬塊體</p>  
        <p type="p">21:底部</p>  
        <p type="p">211:第一連接面</p>  
        <p type="p">22:側部</p>  
        <p type="p">3:第二金屬塊體</p>  
        <p type="p">4:模具</p>  
        <p type="p">41:下模</p>  
        <p type="p">42:模蓋</p>  
        <p type="p">5:連接單元</p>  
        <p type="p">51:連接體</p>  
        <p type="p">511:第一平面</p>  
        <p type="p">512:第二平面</p>  
        <p type="p">52:第一尖點部</p>  
        <p type="p">53:第二尖點部</p>  
        <p type="p">54:填縫部</p>  
        <p type="p">6:噴漆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="691" publication-number="202626355"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626355.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151150</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合電極的製備方法</chinese-title>  
        <english-title>A METHOD OF PREPARING A COMPOSITE ELECTRODE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250614B">B32B23/04</main-classification>  
        <further-classification edition="201501120250614B">B33Y10/00</further-classification>  
        <further-classification edition="201001120250614B">H01M4/587</further-classification>  
        <further-classification edition="201001120250614B">H01M10/0562</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明志科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴怡廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張愉智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-JR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合電極的製備方法，包含以下步驟：(a)纖維素原料與四甲基哌啶氧化物發生氧化反應而生成反應產物，使該反應產物中的固形物被收集而成為纖維素衍生膜；(b)讓氧化石墨烯與金屬前驅物分散於該纖維素衍生膜，得到半成品；(c)將該半成品進行乾燥，得到待加工品；及(d)對該待加工品進行雷射燒結，製得複合電極。透過本發明複合電極的製備方法，使製得的該複合電極適用於移除水中的磷酸鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of preparing a composite electrode comprising the following steps: (a) cellulose raw material and tetramethylpiperidine oxide undergo an oxidation reaction to generate a reaction product, so that solids in the reaction product are collected to form a cellulose-derived film; (b) a graphene oxide and a metal precursor are dispersed in the cellulose-derived film to obtain a semi-finished product; (c) the semi-finished product is dried to obtain a product to be processed; and (d) the product to be processed is subjected to laser sintering to produce a composite electrode. By the method of preparing a composite electrode of the present invention, the resulting composite electrode is suitable for removing phosphate from water.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="692" publication-number="202627776"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627776.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控面板的感測方法</chinese-title>  
        <english-title>SENSING METHOD FOR A TOUCH PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F3/041</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義隆電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾玄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSUAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹益先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, YI-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖唐緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TANG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方弈為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, YI-WWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸亦翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YI-SHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊程富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊易霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪瑋廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, WEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控面板的感測方法，該觸控面板具有多個獨立的電極，該感測方法包括下列步驟：A.決定在該觸控面板的一特殊區域，其中該特殊區域包括一非有意接觸物件的接觸區域；以及B. 在步驟A之後，進入一第一掃描模式以掃描該觸控面板，其中，在該第一掃描模式下，對於待感測的電極及其相鄰的電極以及在該特殊區域外的其他電極施加同相的驅動信號，該特殊區域內至少一部份電極不被施加同相的驅動信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sensing method for a touch panel with a plurality of independent sensing electrodes, the sensing method includes the following steps: A. determining a special region wherein the special region includes a contact area of an unintentionally touching object; and B. After the step A, enter a first scan mode to scan the touch pane. In the first scan mode, a in-phase drive signal is applied to the electrode to be sensed, its adjacent electrodes, and other electrodes outside the special region, and at least a part of the electrodes in the special region is not subjected to the in-phase drive signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:步驟</p>  
        <p type="p">S11:步驟</p>  
        <p type="p">S12:步驟</p>  
        <p type="p">S13:步驟</p>  
        <p type="p">S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="693" publication-number="202627796"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627796.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種適於動態修補與擴充原有指令集的可重組電路架構</chinese-title>  
        <english-title>RECONFIGURABLE CIRCUIT ARCHITECTURE CONFIGURED FOR DYNAMICALLY CORRECTING AND EXTENDING AN EXISTING INSTRUCTION SET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F9/06</main-classification>  
        <further-classification edition="201801120250401B">G06F9/30</further-classification>  
        <further-classification edition="200601120250401B">G06F15/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭良加</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, LIANG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUEN-WEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種適於動態修補與擴充原有指令集的可重組電路架構包含嵌入式現場可程式化邏輯閘陣列及微處理單元。該嵌入式現場可程式化邏輯閘陣列用以支援動態部分配置技術而被配置預設位元流或將預設位元流(Bitstream)用於更新當前指令，並在執行該更新後的當前指令的執行邏輯而輸出實際功能，其中該更新包含當前指令中存在執行邏輯的錯誤或擴充在原有指令集所伴隨相應功能以外的新增功能。該微處理單元用以在判定該實際功能與一預設功能不一致時，自記憶單元中查找位元流集合中與該預設功能一致的位元流以作為該預設位元流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A reconfigurable circuit architecture configured for dynamically correcting and extending an existing instruction set includes an embedded Field-Programmable Gate Array (eFPGA) and a microprocessor. The embedded FPGA supports dynamic partial reconfiguration technology to configure a predefined bitstream or apply the predefined bitstream for updating a current instruction, and executing the execution logic of the updated current instruction to produce an actual function after the updated current instruction. This update may involve correcting errors in the execution logic of the current instruction or expanding functionalities beyond those originally associated with the existing instruction se. When the actual function is determined to be inconsistent with a predefined function, the microprocessor searches a bitstream set stored in a memory unit for a bitstream consistent with the predefined function to serve as the predefined bitstream.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:可重組電路架構</p>  
        <p type="p">100:嵌入式現場可程式化邏輯閘陣列</p>  
        <p type="p">200:微處理單元</p>  
        <p type="p">300:記憶單元</p>  
        <p type="p">C:核心電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="694" publication-number="202628608"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628608.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率半導體元件</chinese-title>  
        <english-title>POWER SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250526B">H10D12/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李岳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUEH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪德麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, DE-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種功率半導體元件，其主要具有於一第一導電型高摻雜基板上形成一第二導電型接觸區，該接觸區內係具一高摻雜區與一低摻雜區之一雙層摻雜結構，使元件主動區域成為具第二導電型高摻雜區、第二導電型輕摻雜區、本質半導體磊晶層、第一導電型輕摻雜層、第一導電型高摻雜基板之一種五層結構，提升元件之崩潰電壓。此外，在元件正、背面導入金屬矽化物，並與正、背面的金屬層間形成歐姆接觸，以縮短元件之反向恢復時間。元件正面之金屬電極外觀為多個環狀設計，包括至少一第二導電型金屬環及一第一導電型金屬環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power semiconductor device is provided. The power semiconductor device mainly comprises a first conductive-type and highly-doped substrate and a second conductive-type contact region formed thereon. The contact region has a pair of a highly-doped region and a lightly-doped region. Accordingly, the active area of the power device has a five-layer structure of a second conductive-type and highly-doped layer, a second conductive-type and lightly-doped layer, an intrinsic epitaxial layer, a first conductive-type and lightly-doped layer, and a first conductive-type and highly-doped substrate for improving the breakdown voltage of the power device. In addition, metal silicide layers are introduced on the front side and back side of the device and forms ohmic contact with the metal layers thereof to shorten the reverse recovery time (t &lt;sub&gt;rr&lt;/sub&gt;) of the device. The appearance of the metal electrode on the front of the device is a plurality of ring-shaped designs, including at least one second conductive-type metal ring and one first conductive-type metal ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:功率半導體元件</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:第一導電型輕摻雜磊晶層</p>  
        <p type="p">12:本質半導體磊晶層</p>  
        <p type="p">13:中央第二導電型摻雜區</p>  
        <p type="p">14:環狀第二導電型摻雜區</p>  
        <p type="p">15:環狀第一導電型摻雜區</p>  
        <p type="p">16:氧化層</p>  
        <p type="p">21:第二導電型輕摻雜區</p>  
        <p type="p">22:第二導電型高摻雜區</p>  
        <p type="p">23:第一金屬矽化物層</p>  
        <p type="p">24:第二金屬矽化物層</p>  
        <p type="p">30:上部金屬層</p>  
        <p type="p">31:中央金屬層</p>  
        <p type="p">32:環狀金屬層</p>  
        <p type="p">33:外層環狀金屬層</p>  
        <p type="p">40:下部金屬層</p>  
        <p type="p">50:鈍化層</p>  
        <p type="p">60:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="695" publication-number="202627281"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627281.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調式門夾</chinese-title>  
        <english-title>AN ADJUSTABLE PATCH FITTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">E06B3/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易定芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種可調式門夾，包括：固定架、軸件、第一移動件以及第二移動件，該固定架具有操作面以及調整面，該軸件設置在該調整面，而該操作面還具有第一調整件以及第二調整件分別連接該第一移動件以及該第二移動件，軸件能隨著第一移動件以及第二移動件的運動進行位置調整，當第一移動件運動時，能同時帶動第二移動件及軸件進行水平位移；當第二移動件運動時，則能進一步帶動軸件進行垂直位移，使得木門安裝過程中水平及垂直方向的精確調整，且木門與門框的對齊更加便利且高效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is related to an adjustable patch fitting, which comprises a fixing frame, a shaft member, a first moving member and a second moving member. The fixing frame includes an operating surface and an adjusting surface. The shaft member is arranged on the adjusting surface. A first adjusting member and a second adjusting member are arranged on the operating surface for connecting to the first moving member and the second moving member respectively. The shaft member is capable of being adjusted position according to the movement of the first moving member and the second moving member. The second moving member and the shaft member are moved along a horizontal direction synchronously when the first moving member is moved by the first adjusting member. The shaft member is moved along a vertical direction when the second moving member is moved by the second adjusting member. Therefore, users can accurately adjust a horizontal position and a vertical position of a door during an assembling process of the adjustable patch fitting, so that the door is more convenient and efficient to align the door case.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:可調式門夾</p>  
        <p type="p">4:固定架</p>  
        <p type="p">42:操作面</p>  
        <p type="p">421:通孔</p>  
        <p type="p">422:辨識符號</p>  
        <p type="p">43:調整面</p>  
        <p type="p">431:第一開口</p>  
        <p type="p">44:夾板</p>  
        <p type="p">5:軸件</p>  
        <p type="p">51:外凸端</p>  
        <p type="p">52:連接端</p>  
        <p type="p">53:插銷</p>  
        <p type="p">6:第一移動件</p>  
        <p type="p">62:第二開口</p>  
        <p type="p">63:軌道部</p>  
        <p type="p">7:第二移動件</p>  
        <p type="p">71:第三開口</p>  
        <p type="p">72:移動板</p>  
        <p type="p">73:軌跡部</p>  
        <p type="p">8:第一調整件</p>  
        <p type="p">81:第一螺絲</p>  
        <p type="p">811:第一頭部</p>  
        <p type="p">812:第一螺紋部</p>  
        <p type="p">813:凹孔</p>  
        <p type="p">9:第二調整件</p>  
        <p type="p">91:第二螺絲</p>  
        <p type="p">911:第二頭部</p>  
        <p type="p">912:第二螺紋部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="696" publication-number="202626364"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626364.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151174</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>巨量轉移膜及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B32B27/08</main-classification>  
        <further-classification edition="201901120260302B">B32B7/02</further-classification>  
        <further-classification edition="200601120260302B">C09J201/00</further-classification>  
        <further-classification edition="201801120260302B">C09J7/29</further-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification>  
        <further-classification edition="202501120260302B">H10H20/01</further-classification>  
        <further-classification edition="202501120260302B">H10H20/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三芳化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAN FANG CHEMICAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林至逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭國光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣其晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴文信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, WEN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊慶豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, QING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡東賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種巨量轉移膜及其製造方法。所述巨量轉移膜包括基材層及黏著層。基材層包括支撐層及緩衝層。緩衝層設置於支撐層上。黏著層設置於基材層之緩衝層上。與現有技術相比，本發明提供的巨量轉移膜，可防止晶粒過度陷入黏著層內、使晶粒易於剝離、避免破片情形發生及避免晶粒剝離後留有殘膠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:巨量轉移膜</p>  
        <p type="p">10:基材層</p>  
        <p type="p">11:支撐層</p>  
        <p type="p">12:緩衝層</p>  
        <p type="p">20:黏著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="697" publication-number="202626892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以回收熱塑性高分子複合材料製成可循環再利用建築用角材、板材之製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250805B">C08J5/10</main-classification>  
        <further-classification edition="200601120250805B">C08J11/04</further-classification>  
        <further-classification edition="200601120250805B">C08J11/18</further-classification>  
        <further-classification edition="200601120250805B">B29B11/12</further-classification>  
        <further-classification edition="200601120250805B">B29B17/04</further-classification>  
        <further-classification edition="200601120250805B">B29C51/30</further-classification>  
        <further-classification edition="200601120250805B">B29C51/42</further-classification>  
        <further-classification edition="200601120250805B">B29C70/10</further-classification>  
        <further-classification edition="200601120250805B">B29C70/24</further-classification>  
        <further-classification edition="202201320250805B">B09B101/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台捷精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉興朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉興朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種以回收熱塑性高分子複合材料製成可循環再利用建築用角材、板材之製作方法，採用占比至少70%的再生聚苯乙烯(rPS）做為基材，並加入有適量的相容性改質彈性塑料、發泡劑以及功能性添加劑拌合構成一混合材料，接著透過一螺桿押出機對混合材料進行加熱及攪拌分流後成為一熱塑性高分子複合共聚混合物，再以一冷卻模具對熱塑性高分子複合共聚混合物進行逐步冷卻定型到常溫熟成後，即可製成一體成型且可循環再利用之建築用角、板材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="698" publication-number="202627750"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627750.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多段式負載線的供電調整裝置、主機板及供電調整方法</chinese-title>  
        <english-title>POWER SUPPLY ADJUSTMENT DEVICE WITH MULTI-SEGMENT LOAD LINE, MOTHERBOARD, AND POWER SUPPLY ADJUSTMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F1/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諶宏政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖哲賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TSE-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種供電調整方法，適用於處理器及供電控制器，且包含：取得處理器的工作電流，根據工作電流從預存多段式負載線取得目標供電參數，以及根據目標供電參數控制供電控制器提供電力至處理器，其中該預存多段式負載線指示多個預設電流與多個預設供電參數之間的關係，且包含對應於不同電流範圍且具有不同斜率的多個線段。一種具有多段式負載線的供電調整裝置，適用於處理器及供電控制器，且包含讀取線路及控制電路。一種具有多段式負載線的主機板，包含供電控制器及處理器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply adjustment method, applicable for a processor and a power supply controller, includes: getting working current of the processor, acquiring a target power parameter from a pre-stored multi-segment load line according to the working current, and controlling the power supply controller to supply power to the processor according to the target power parameter. The pre-stored multi-segment load line indicate the relationship between a plurality of preset currents and a plurality of preset power parameters, and includes a plurality of segments corresponding to different current ranges and having different slopes. A power supply adjustment device with multi-segment load line, applicable to a processor and a power supply controller, includes a reading wire and a control circuit. A motherboard with multi-segment load line includes a power supply controller and a processor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S3,S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="699" publication-number="202626189"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626189.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微膠囊及包含其之熱固化組合物</chinese-title>  
        <english-title>MICROCAPSULE AND THERMAL CURING COMPOSITION EMPLOYING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250117B">B01J13/02</main-classification>  
        <further-classification edition="200601120250117B">C08K5/56</further-classification>  
        <further-classification edition="200601120250117B">C08K5/57</further-classification>  
        <further-classification edition="200601120250117B">C08L75/02</further-classification>  
        <further-classification edition="202001320250117B">G06F113/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳意君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳禹玎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEU-DING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種微膠囊及包含其之組合物。該微膠囊包含一有機金屬促進劑、以及一聚脲，其中該聚脲包覆(encapsulated)該有機金屬促進劑。該有機金屬促進劑的含量可為5wt%至50wt%，以該微膠囊的總重為基準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microcapsule and a composition employing the same are provided. The microcapsule includes an organometallic promoter and a polyurea, wherein the polyurea is encapsulated the organometallic promoter. The amount of the organometallic promoter in the microcapsule is 5wt% to 50wt%, based on the weight of the microcapsule.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="700" publication-number="202626552"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626552.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陶瓷材料及其製備方法</chinese-title>  
        <english-title>CERAMIC MATERIAL AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250120B">C04B35/01</main-classification>  
        <further-classification edition="200601120250120B">C04B35/04</further-classification>  
        <further-classification edition="201701120250120B">C01B32/205</further-classification>  
        <further-classification edition="200601120250120B">H05B6/64</further-classification>  
        <further-classification edition="200601120250120B">C09K21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃天恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TIEN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱國創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUO-CHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓麗卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, LI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉日翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, JIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種陶瓷材料，包含：氧化鎂及摻雜氧化物，其中摻雜氧化物包含四氧化三鈷、三氧化二銪或二氧化錳，並且氧化鎂及摻雜氧化物的重量比為97.0:1.0至85.0:12.0。此外，本發明亦提供一種製備陶瓷材料的方法，包含：混合氧化鎂粉體及摻雜氧化物粉體；以及以溫度1300℃至1650℃進行燒結混合後的氧化鎂粉體及摻雜氧化物粉體以獲得陶瓷材料，其中摻雜氧化物粉體包含四氧化三鈷粉體、三氧化二銪粉體或二氧化錳粉體，以及氧化鎂粉體及摻雜氧化物粉體的重量比為99.9:0.1至92.0:8.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ceramic material, including: a magnesium oxide and a doped oxide, wherein the doped oxide includes cobalt tetroxide, europium trioxide or manganese dioxide, and the weight ratio of the magnesium oxide and the doped oxide is 97.0:1.0 to 85.0:12.0. In addition, the present disclosure also provides a method of preparing the ceramic material, including: mixing a magnesium oxide powder and a doped oxide powder; and sintering the mixed magnesium oxide powder and the doped oxide powder at a temperature of 1300°C to 1650°C to obtain the ceramic material, wherein the doped oxide powder includes cobalt tetroxide powder, europium trioxide powder or manganese dioxide powder, and the weight ratio of magnesium oxide powder to the doped oxide powder is 99.9:0.1 to 92.0:8.0.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="701" publication-number="202626521"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626521.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鐵粉、其製造方法、包含氧化鐵粉的鐵氧體磁石及其製造方法</chinese-title>  
        <english-title>FERRIC OXIDE POWDER, METHOD OF FORMING THE SAME, FERRITE MAGNET INCLUDING THE FERRIC OXIDE POWDER AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">C01G49/02</main-classification>  
        <further-classification edition="200601120250108B">H01F1/11</further-classification>  
        <further-classification edition="200601120250108B">C04B35/622</further-classification>  
        <further-classification edition="200601120250108B">C04B35/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝中瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪永熊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YUNG-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱軍浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHUNHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氧化鐵粉、其製造方法、包含氧化鐵粉的鐵氧體磁石及其製造方法。氧化鐵粉的製造方法包含研磨鐵鏽皮，以獲得鐵鏽細粉，其中鐵鏽皮包含60 wt%至70 wt%的氧化亞鐵及不大於40 wt%的氧化鐵，且鐵鏽細粉的平均粒徑不大於3 μm。方法還包含在腔體中，對鐵鏽細粉進行氧化製程，以獲得氧化鐵粉，其中氧化製程的溫度為700°C至850°C，且氧化鐵粉包含不小於95 wt%的氧化鐵。藉此，可有效地簡化製程步驟，且不需限制所使用的原料成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Ferric oxide powder, a method of forming the same, a ferrite magnet including the ferric oxide powder and a method of forming the same provided. The method of forming the ferric oxide powder includes grinding mill-scale to obtain mill-scale fine powders. The mill-scale includes ferrous oxide of 60 wt% to 70 wt% and ferric oxide of not greater than 40 wt%. An average particle size of the mill-scale fine powders is not greater than 3 μm. The method further includes performing an oxidation process to the mill-scale fine powders in a chamber, thereby obtaining the ferric oxide powder. A temperature of the oxidation process is 700°C to 850°C. The ferric oxide powder includes ferric oxide of not less than 95 wt%. Therefore, the process steps are effectively simplified, and raw ingredients are not necessary to be limited.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="702" publication-number="202628363"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628363.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈寬調變控制裝置以及超音波控制系統及方法</chinese-title>  
        <english-title>PULSE WIDTH MODULATION CONTROL DEVICE AND ULTRASOUND CONTROL SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H03K7/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李桂銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳承學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANDRA, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宛龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WAN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭吟翎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YIN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種脈寬調變控制裝置以及超音波控制系統及方法。脈寬調變控制裝置包含第一及第二暫存器、加法器、鋸齒波產生器以及比較器。第一暫存器儲存目標脈衝數。第二暫存器儲存餘數。加法器將目標脈衝數與餘數相加以得到總和值，當總和值小於最大脈衝數時，以總和值取代第二暫存器的餘數，且當總和值大於或等於最大脈衝數時，以總和值與最大脈衝數之間的差值取代第二暫存器的餘數並產生脈衝觸發訊號。鋸齒波產生器基於脈衝觸發訊號產生鋸齒波訊號。比較器根據鋸齒波訊號與超音波控制訊號之間的比較結果決定脈衝寬度以輸出脈寬調變訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure proposes a pulse width modulation control device and ultrasound control system and method. The pulse width modulation control device includes a first register, a second register, an adder, a sawtooth wave generator and a comparator. The first register stores a target pulse count. The second register stores a remainder. The adder adds the target pulse count and the remainder to obtain a summed value. When the summed value is less than a maximum pulse count, the adder replaces the remainder in the second register with the summed value, and when summed value is greater than or equal to the maximum pulse count, the adder replaces the remainder in the second register with a difference value between the summed value and the maximum pulse count, and generates a pulse trigger signal. The sawtooth wave generator generates a sawtooth wave signal based on the pulse trigger signal. The comparator determines a pulse width according to a comparison result between the sawtooth wave signal and an ultrasound control signal to output a pulse width modulation signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:脈寬調變控制裝置</p>  
        <p type="p">101:第一暫存器</p>  
        <p type="p">102:第二暫存器</p>  
        <p type="p">103:加法器</p>  
        <p type="p">104:鋸齒波產生器</p>  
        <p type="p">105:比較器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="703" publication-number="202627410"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627410.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151196</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>齒輪輪廓量測系統及方法</chinese-title>  
        <english-title>GEAR PROFILE MEASUREMENT SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">G01B11/24</main-classification>  
        <further-classification edition="201901120250225B">G01M13/021</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張為杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李峻華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIUN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張珀瑝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, BO-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種齒輪輪廓量測系統及方法。齒輪輪廓量測方法，適用於裝設於旋轉軸上的齒輪，齒輪輪廓量測方法包含：以共焦感測器朝感測方向進行感測以取得第一距離資料，其中感測方向通過齒輪的初始齒部，根據第一距離資料取得初始齒部的初始座標，將初始座標加入座標組，控制旋轉軸轉動預設角度以使目標齒部位於感測方向上，以共焦感測器對位於感測方向上的目標齒部進行量測以取得第二距離資料，根據第二距離資料取得目標齒部的目標座標，根據目標座標與預設角度取得目標齒部的原始座標，及將原始座標加入座標組，以及根據座標組產生齒輪的輪廓資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure proposes a gear profile measurement system and method. The gear profile measurement method is applicable to a gear mounted on a rotating shaft. The method includes: using a confocal sensor to sense along a sensing direction to obtain first distance data, wherein the sensing direction passes through an initial tooth of the gear, determining initial coordinates of the initial tooth based on the first distance data, adding the initial coordinates to a coordinate set; controlling the rotating shaft to rotate by a preset angle to position a target tooth of the gear in the sensing direction; measuring the target tooth in the sensing direction by using the confocal sensor to obtain second distance data, determining target coordinates of the target tooth based on the second distance data, obtaining original coordinates of the target tooth based on the target coordinates and the preset angle, adding the original coordinates to the coordinate set, and generating profile data of the gear based on the coordinate set.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107,S108,S109,S111,S113,S115:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="704" publication-number="202627597"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627597.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>攝影光學系統、取像裝置及電子裝置</chinese-title>  
        <english-title>PHOTOGRAPHING OPTICAL SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">G02B11/30</main-classification>  
        <further-classification edition="202101120250402B">G02B7/02</further-classification>  
        <further-classification edition="200601120250402B">G02B3/00</further-classification>  
        <further-classification edition="202101120250402B">G03B17/12</further-classification>  
        <further-classification edition="202101120250402B">G03B17/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱君武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHUN-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖冠智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, GUAN-JR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種攝影光學系統，包含五片透鏡。五片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡以及第五透鏡。五片透鏡分別具有朝向物側方向的物側表面與朝向像側方向的像側表面。第一透鏡具有正屈折力。第二透鏡物側表面於近光軸處為凹面。第五透鏡具有負屈折力，且第五透鏡像側表面於近光軸處為凹面。當滿足特定條件時，攝影光學系統能同時滿足微型化和高成像品質的需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photographing optical system includes five lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. Each of the five lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The first lens element has positive refractive power. The object-side surface of the second lens element is concave in a paraxial region thereof. The fifth lens element has negative refractive power, and the image-side surface of the fifth lens element is concave in a paraxial region thereof. When specific conditions are satisfied, the requirements of compatctness and high image quality can be met by the photographing optical system, simultaneously.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:取像裝置</p>  
        <p type="p">ST:光圈</p>  
        <p type="p">S1:光闌</p>  
        <p type="p">E1:第一透鏡</p>  
        <p type="p">E2:第二透鏡</p>  
        <p type="p">E3:第三透鏡</p>  
        <p type="p">E4:第四透鏡</p>  
        <p type="p">E5:第五透鏡</p>  
        <p type="p">E6:濾光元件</p>  
        <p type="p">IMG:成像面</p>  
        <p type="p">IS:電子感光元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="705" publication-number="202628123"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628123.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於飲食分析之智慧穿戴裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250228B">G16H20/60</main-classification>  
        <further-classification edition="201801120250228B">G16H20/00</further-classification>  
        <further-classification edition="200601120250228B">A61B5/00</further-classification>  
        <further-classification edition="200601120250228B">G06F3/00</further-classification>  
        <further-classification edition="200601120250228B">G08C17/02</further-classification>  
        <further-classification edition="200601120250228B">A61B5/024</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉晶雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉晶雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於飲食分析之智慧穿戴裝置，其包含有一鏡架框體，鏡架框體之鏡框部設有一鏡頭模組，鏡頭模組拍攝食物並輸出一影像訊號至一微處理器，微處理器對影像訊號進行特徵提取、辨識及營養成分估算，輸出一飲食分析結果，一無線傳輸模組將飲食分析結果上傳至一雲端伺服器，同時傳輸至一顯示模組，顯示模組顯示飲食分析結果方便用戶查看。供電模組則電性連接於微處理器，以提供各模組單元運作電力。本發明以鏡頭模組即時獲取食物特徵，透過特徵比對及計算，及時獲取食物營養成分，方便用戶立即調整飲食搭配，以滿足自身健康需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鏡頭模組</p>  
        <p type="p">11:多軸感測器</p>  
        <p type="p">2:微處理器</p>  
        <p type="p">21:營養數據庫</p>  
        <p type="p">22:影像處理單元</p>  
        <p type="p">221:深度學習模型</p>  
        <p type="p">23:行為分析單元</p>  
        <p type="p">3:無線傳輸模組</p>  
        <p type="p">4:顯示模組</p>  
        <p type="p">41:操作部</p>  
        <p type="p">5:供電模組</p>  
        <p type="p">6:收音模組</p>  
        <p type="p">7:雲端伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="706" publication-number="202626238"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626238.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工裝置及雷射加工方法</chinese-title>  
        <english-title>LASER PROCESSING EQUIPMENT AND LASER PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250423B">B23K26/066</main-classification>  
        <further-classification edition="200601120250423B">B23K26/067</further-classification>  
        <further-classification edition="200601120250423B">B23K26/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射加工裝置包括第一雷射光源、暫存基板及載台，第一雷射光源用以提供第一線雷射光束，載台用以承載加工元件，第一線雷射光束於載台上形成第一雷射光斑，加工元件對應設置於第一雷射光斑分佈的位置，加工元件位於暫存基板與載台之間，第一雷射光斑的沿第一方向的長度和第一雷射光斑沿第二方向的寬度的比例是落在3.3至25範圍。一種雷射加工方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser processing device includes a first laser light source, a temporary substrate, and a carrier. The first laser light source is configured to provide a first laser line beam. The carrier is configured to carry a processing component. The first laser line beam forms a first laser spot on the carrier and the processing component is arranged corresponding to a position of the first laser spot. The processing component is located between the temporary substrate and the carrier. A ratio of a length of the first laser spot along a first direction and a width of the first laser spot along a second direction is in a range of 3.3 to 25. A laser processing method has also been proposed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:雷射加工裝置</p>  
        <p type="p">110:載台</p>  
        <p type="p">120:第一基板</p>  
        <p type="p">130:第一膜層</p>  
        <p type="p">132:加工元件</p>  
        <p type="p">140:暫存基板</p>  
        <p type="p">B1:第一線雷射光束</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">LC1:第一雷射光斑</p>  
        <p type="p">LD1:第一雷射光源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="707" publication-number="202627446"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627446.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真菌影像檢測方法及真菌染色套組</chinese-title>  
        <english-title>FUNGAL IMAGING DETECTION METHOD AND FUNGUS STAINING KIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G01N21/25</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊惠如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HUEI-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭俊昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUN-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭詠琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡全基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHUAN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高榮駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAU, RUNG-JIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡書憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SHU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李士畦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種真菌影像檢測方法及真菌染色套組。該真菌影像檢測方法包括：（a）提供一潛在具有共生真菌之植物根部，將該植物根部進行預處理，該預處理包括鹼處理；（b） 將（a）步驟的該植物根部浸入一第一染色溶液一第一預定時間後，進行退染，該第一染色溶液具有一第一顏色的染劑；（c） 將（b）步驟的該植物根部浸入一第二染色溶液一第二預定時間後，進行退染，該第二染色溶液具有一第二顏色的染劑；以及（d）以一辨識手段辨識（c）步驟的該植物根部，以評估該植物根部是否與真菌共生，其中該真菌為叢枝菌根菌（arbuscular mycorrhizal fungi，AMF）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fungal imaging detection method and a fungal staining kit are provided. The fungal imaging detection method includes: (a) providing a plant root with potential symbiotic fungi s, and subjecting the plant root to a pretreatment , the pretreatment comprising alkaline treatment; (b) the plant root in step (a) is immersed in a first staining solution for a first predetermined time, and then destained, and the first staining solution has a dye of a first color; (c) the plant root in step (b) is immersed in a second staining solution for a second predetermined time, and then destained, and the second staining solution has a dye of a second color; and (d) identifying the plant roots in step (c) using an identification means to identify whether the plant root is symbiotic with the fungus, wherein the fungus is arbuscular mycorrhizal fungi (AMF).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110~S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="708" publication-number="202627885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可降低錯誤選擇的多輸出資料之ＡＩ智能系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06N3/045</main-classification>  
        <further-classification edition="202301120250401B">G06N3/08</further-classification>  
        <further-classification edition="201901120250401B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐斯逖科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林毓琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪振雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可降低錯誤選擇的多輸出資料之AI智能系統，其包含：一註冊模組，該註冊模組係供輸入一使用者註冊的一設備類型或一付費類型；一初始化模組，該初始化模組連接該註冊模組，該初始化模組係根據該設備類型或該付費類型配置複數個不同的人工智能模型，且各該人工智能模型是基於大型語言模型(Large Language Model,LLM)；一輸入模組，該輸入模組連接該初始化模組，該輸入模組係供輸入一使用者請求；一處理模組，該處理模組連接該輸入模組，該處理模組係將該使用者請求分配到該複數個不同的人工智能模型；一結果生成模組，該結果生成模組連接該處理模組，該結果生成模組係將該使用者請求由該複數個不同的人工智能模型生成複數個結果；以及一結果展示模組，該結果展示模組連接該結果生成模組，該結果展示模組係展示該複數個結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:註冊模組</p>  
        <p type="p">2:初始化模組</p>  
        <p type="p">3:輸入模組</p>  
        <p type="p">4:處理模組</p>  
        <p type="p">5:結果生成模組</p>  
        <p type="p">6:結果展示模組</p>  
        <p type="p">7:儲存模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="709" publication-number="202628483"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628483.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體燈串的控制電路及設定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250627B">H05B45/30</main-classification>  
        <further-classification edition="202001120250627B">H05B45/54</further-classification>  
        <further-classification edition="201601120250627B">F21S4/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安沛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANAPEX TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭世忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHIH-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴啓民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宗文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光二極體燈串的控制電路及設定方法，該燈串包括n個串接的發光二極體單元，先向該發光二極體單元發出一包括有m &lt;sub&gt;i&lt;/sub&gt;個位元的設定訊號，接著，該發光二極體單元對該設定訊號的位元數m &lt;sub&gt;i&lt;/sub&gt;進行計數，重複共x次，x為從1至不大於n-1的整數，i從1至x，該發光二極體單元對每次的該計數進行累加，第x個該發光二極體單元收到第x-1個的該設定訊號後，將已累加的該計數寫入該發光二極體單元的一暫存元件，然後，該控制器向該發光二極體單元發出一燒錄訊號，該發光二極體單元將儲存於該暫存元件之中的該計數寫入該發光二極體單元的一儲存元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:控制電路</p>  
        <p type="p">10:控制器</p>  
        <p type="p">11:輸出端</p>  
        <p type="p">20:發光二極體燈串</p>  
        <p type="p">21:發光二極體單元</p>  
        <p type="p">21a:輸入端</p>  
        <p type="p">21b:雙向端</p>  
        <p type="p">21c:輸出端</p>  
        <p type="p">211:驅動電路</p>  
        <p type="p">212:發光二極體晶片</p>  
        <p type="p">213:計數器</p>  
        <p type="p">214:暫存元件</p>  
        <p type="p">215:儲存元件</p>  
        <p type="p">22:第一線路</p>  
        <p type="p">23:第二線路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="710" publication-number="202628019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>教案執行裝置、訓練系統及與其相關之教案執行方法</chinese-title>  
        <english-title>PROGRAM EXECUTION DEVICE, TRAINING SYSTEM, AND ASSOCIATED PROGRAM EXECUTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">G09B7/08</main-classification>  
        <further-classification edition="200601120250926B">G09B5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎和欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HO-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪雋皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種教案執行裝置、訓練系統及與其相關之教案執行方法。訓練系統包含感測裝置與教案執行裝置。教案執行裝置包含：教案執行模組、專心度計算模組和教案選取模組。教案執行模組在第(z-1)段教案訓練期間執行第s個系統可選教案。感測裝置產生與第(z-1)段教案訓練期間對應的第(z-1)局感測結果。專心度計算模組根據第(z-1)局感測結果計算第(z-1)局訓練期間專心度。教案選取模組根據第(z-1)局訓練期間專心度和預設專心度門檻的比較結果，選擇第t個系統可選教案由教案執行模組在第z段教案訓練期間執行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A program execution device, training system, and associated program execution method are provided. The training system includes a sensing device and the program execution device. The program execution device includes a program execution module, a concentration calculation module, and a program selection module. The program execution module executes an s-th system program option during a (z-1)-th program training duration. The sensing device generates (z-1)-th round sensing results corresponding to the (z-1)-th program training duration. The concentration calculation module calculates a (z-1)-th round training concentration according to the (z-1)-th round sensing results. The program selection module selects a t-th system program option to be executed by the program execution device during a z-th program training duration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10,trnSYS:訓練系統</p>  
        <p type="p">11:教案執行裝置</p>  
        <p type="p">111:教案選取模組</p>  
        <p type="p">111a:選取策略判斷模組</p>  
        <p type="p">111c:亂數產生器</p>  
        <p type="p">111e:異質性教案選取模組</p>  
        <p type="p">40:複合式教案選取模組</p>  
        <p type="p">112:計時器</p>  
        <p type="p">113:教案執行模組</p>  
        <p type="p">50:訓練結果計算模組</p>  
        <p type="p">118:教案相似度計算模組</p>  
        <p type="p">117:教案完成度計算模組</p>  
        <p type="p">115:計數器</p>  
        <p type="p">116:專心度計算模組</p>  
        <p type="p">13:儲存裝置</p>  
        <p type="p">15:輸入裝置</p>  
        <p type="p">17:播放裝置</p>  
        <p type="p">19:感測裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="711" publication-number="202628054"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628054.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151222</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素電路</chinese-title>  
        <english-title>PIXEL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250123B">G09G3/3233</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煒力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種像素電路，包含：發光二極體、第一/第二內節點設定電晶體與亮度控制電晶體。發光二極體電連接於供應電壓線。第一內節點設定電晶體電連接於發光二極體與第一內節點。第二內節點設定電晶體電連接於第二內節點與資料信號線。資料信號線在資料電壓寫入期間的電壓值等於像素資料電壓值。在像素發光期間，像素電流自供應電壓線流經發光二極體、第一內節點設定電晶體與亮度控制電晶體至接地電壓線。像素電流的電流值與第一內節點和第二內節點在像素發光期間的電壓值相關。第二內節點在像素發光期間的電壓值與臨界電壓和像素資料電壓值相關。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel circuit including an LED, a first/second internal node setting transistor, and a brightness control transistor is provided. The LED is electrically connected to a supply voltage line. The first internal node setting transistor is electrically connected to the LED and a first internal node. The second internal node setting transistor is electrically connected to a second internal node and a data signal line. The voltage of the data signal line during a data voltage writing duration is equivalent to a pixel data setting voltage. During a pixel emission duration, a pixel current starting from a supply voltage line to a ground voltage line flows through the LED, the first internal setting transistor, and the brightness control transistor. The current value of the pixel current is related to the voltage of the first internal node and the voltage of the second internal node during the pixel emission duration. The voltage of the second internal node during the pixel emission duration is related to the threshold voltage of the brightness control transistor and the pixel data setting voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Vdd:供應電壓(線)</p>  
        <p type="p">Vss:接地電壓(線)</p>  
        <p type="p">PXLa(m,n):像素電路</p>  
        <p type="p">WS[n]:像素資料寫入用閘極信號(線)</p>  
        <p type="p">RS[n]:重置閘極信號(線)</p>  
        <p type="p">EM[n]:發光致能閘極信號(線)</p>  
        <p type="p">Tgset1,Tgset2,Tsset1,Tsset2,Tqset1,Tqset2:內節點設定電晶體</p>  
        <p type="p">Vini:預設電壓(線)</p>  
        <p type="p">DAT[m]:資料信號(線)</p>  
        <p type="p">Tled(m,n):亮度控制電晶體</p>  
        <p type="p">NDg(m,n),NDq(m,n),NDs(m,n):內節點</p>  
        <p type="p">C(m,n):電容</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="712" publication-number="202627514"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627514.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微型發光二極體驅動電路及其測試方法</chinese-title>  
        <english-title>ΜLED DRIVING CIRCUIT AND TEST METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250204B">G01R31/44</main-classification>  
        <further-classification edition="202201120250204B">H05B45/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾岳宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YUEH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭聖諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐雅玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YA-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖烝賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種微型發光二極體驅動電路及其測試方法。回應於完成製造一第一既定金屬層，形成一第一測試路徑，該第一測試路徑通過一測試電路的一第一測試電晶體與一驅動電路，以測試在製造該第一既定金屬層之前的至少一第一缺陷。回應於完成製造一第二既定金屬層，形成一第二測試路徑，該第二測試路徑通過該測試電路的一第二測試電晶體與該驅動電路，以檢測在製造該第一既定金屬層之後所出現的至少一第二缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application discloses a micro light-emitting diode (micro-LED) driving circuit and its testing method. In response to completing the fabrication of a first predetermined metal layer, a first testing path is formed. This first testing path passes through a first test transistor of a testing circuit and a driving circuit to detect at least one first defect prior to the fabrication of the first predetermined metal layer. In response to completing the fabrication of a second predetermined metal layer, a second testing path is formed. This second testing path passes through a second test transistor of the testing circuit and the driving circuit to detect at least one second defect that arises after the fabrication of the first predetermined metal layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:μLED驅動電路</p>  
        <p type="p">110:灰階控制電路</p>  
        <p type="p">120:驅動電路</p>  
        <p type="p">130:測試電路</p>  
        <p type="p">140:發光控制電路</p>  
        <p type="p">150:結合區</p>  
        <p type="p">150_1與150_2:墊</p>  
        <p type="p">Data:資料信號</p>  
        <p type="p">SN、SN-1:閘極驅動信號</p>  
        <p type="p">T_AT_M2、T_AT_Final:測試電晶體</p>  
        <p type="p">AT_M2、AT_Final:測試信號</p>  
        <p type="p">EM:發光控制信號</p>  
        <p type="p">T_AM_1:發光電晶體</p>  
        <p type="p">P1、P2:測試路徑</p>  
        <p type="p">V:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="713" publication-number="202625888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>投料系統控制方法</chinese-title>  
        <english-title>A METHOD OF CONTROLLING A FEEDING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250126B">A01K61/80</main-classification>  
        <further-classification edition="200601120250126B">A01K63/04</further-classification>  
        <further-classification edition="202401120250126B">G06Q50/02</further-classification>  
        <further-classification edition="202201120250126B">G06V20/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江誌偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江誌偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明投料系統控制方法，其主要運用於養殖池之投料餵食，其控制方法包含有準備步驟、投餵料步驟及監測分析步驟等，其中，該準備步驟主要具有充填飼料之料桶、升降器、攝影機、控制器等構件，而於該投餵料步驟時，利用該控制器控制該料桶出料數量，以便將該料桶之飼料投置於一活動平台上，並且該活動平台受到該升降器作用下降至水面下進行餵食，最後於該監控分析步驟，再將該活動平台置放一段時間後予以上升，且配合該攝影機拍攝殘留於該活動平台上之剩餘飼料狀況的影像，並傳遞至該控制器分析，以判斷該飼料之餵食相關資訊，藉以做為後續該料桶之該飼料出料數量之依據，以達到精準投料，從而有效降低養殖成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of controlling a feeding system is mainly applied to a feeding operation in a breeding pond. The method includes a preparation step, a feeding step, and a monitoring and analyzing step. The preparation step mainly includes preparing a feed bucket filled with feed, a lifting and descending device, a camera, and a controller. The feeding step includes using the controller to control the outputting amount of the feed bucket for introducing the feed of the feed bucket to a movable platform and making the movable platform descend into an area under a water surface by the operation of the lifting and descending device for conducting the feeding operation. When the feeding operation lasts for a predetermined period of time, the monitoring and analyzing step includes obtaining images of remaining feed left on the movable platform with the camera after lifting the movable platform and sending the images to the controller for analyzing and determining the feeding information of the feed. The determination can serve as a basis for the following outputting amount of the feed of the feed bucket, thereby attaining an accurate feeding effect and decreasing feeding costs efficiently.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:投料系統控制方法</p>  
        <p type="p">31:準備步驟</p>  
        <p type="p">32:投餵料步驟</p>  
        <p type="p">33:監測分析步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="714" publication-number="202627297"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627297.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多角度球型化發電單元</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250314B">F03G7/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾佳龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾佳龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉元琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一種多角度球型化發電單元，係至少包含：一球狀殼體、複數發電組件、至少一最大功率點追蹤單元、至少一整流單元與至少一蓄電單元，該等發電組件、最大功率點追蹤單元、整流單元與蓄電單元均設於該球狀殼體內，且該等發電組件係以多個角度分別圍繞該球狀殼體的中心排列設置，令該等發電組件可受任意方向的外力進行發電，該最大功率點追蹤單元係連接整合該等發電組件，令該等發電組件以最大功率進行發電，該整流單元可將該等發電組件的發電電流進行整流，該蓄電單元可將整流後的電流進行儲存，藉此達到可利用每個角度的外力有效進行發電之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:球狀殼體</p>  
        <p type="p">20:發電組件</p>  
        <p type="p">30:最大功率點追蹤單元</p>  
        <p type="p">40:整流單元</p>  
        <p type="p">50:蓄電單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="715" publication-number="202628685"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628685.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低互補式金氧半場效電晶體功率消耗的方法及其電晶體</chinese-title>  
        <english-title>METHOD FOR REDUCING POWER CONSUMPTION OF CMOSFET AND CMOSFET UTILIZING THE METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250310B">H10D84/85</main-classification>  
        <further-classification edition="202501120250310B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣富成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONG, FUH CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣富成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONG, FUH CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種降低互補式金氧半場效電晶體功率消耗的方法及其電晶體，前述方法包含：將N型金氧半場效電晶體(nMOS)的閘極與P型金氧半場效電晶體(pMOS)的閘極皆電性連接至輸入電壓，將pMOS的源極電性連接至最高電壓；將nMOS的汲極與該pMOS的汲極彼此電性連接，將nMOS的源極電性連接至最低電壓；使|VTN| + |VTP| ≧ (|VSP - VSN|) * 90%，VTN為nMOS之截止電壓，VTP為pMOS之截止電壓，VSN為nMOS之源極電壓，VSP為pMOS之源極電壓。藉此，就可以大幅降低互補式金氧半場效電晶體的功率消耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1:負載電容及寄生電容</p>  
        <p type="p">M1:N型金氧半場效電晶體</p>  
        <p type="p">M2:P型金氧半場效電晶體</p>  
        <p type="p">VDD:電源電壓</p>  
        <p type="p">VG:輸入電壓</p>  
        <p type="p">Vout:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="716" publication-number="202627962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧型溫室氣體碳排之預測與碳交易管理方法及其系統</chinese-title>  
        <english-title>AN INTELLIGENT GREENHOUSE GAS CARBON EMISSION FORECASTING AND CARBON TRADING MANAGEMENT METHOD AND A SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250401B">G06Q40/04</main-classification>  
        <further-classification edition="202301120250401B">G06Q40/00</further-classification>  
        <further-classification edition="202301120250401B">G06Q10/04</further-classification>  
        <further-classification edition="202301220250401B">G06Q30/0202</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧陽能控股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREEN SHEPHERD CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宇翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温啟良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, QI LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種智慧型溫室氣體碳排之預測與碳交易管理方法及其系統，其主要係令使用者對碳排內部因素資料庫分別輸入生產量、耗電量、勞工數量、碳排係數相關數據，及對碳權外部因素資料庫分別輸入市場碳權供需影響係數、氣候預測影響係數、能源價格影響係數、匯率影響係數相關數據，讓碳排預測量模組依據碳排內部因素資料庫所輸入的各項相關數據進行碳排預測量計算，及讓碳權價格預測模組依據碳權外部因素資料庫所輸入的各項相關數據進行碳權價格預測計算，再分別將所預測計算出的數值傳輸至碳權交易決策模組，以令碳權交易決策模組依據所預測計算出的碳排量及碳權價格而進行相對應所設定的決策；藉此，能依找所輸入的各種參數數據，分別預測出碳排量及碳權價格，再依照所預測出的碳排量及碳權價格進行相對應所設定的碳權交易決策，以方便相關人員進行各種碳權交易決策之制定，而在其整體施行使用上更增實用功效特性者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to an intelligent greenhouse gas carbon emission forecasting and carbon trading management method and a system thereof, which enables the user to input the data related to production volume, electricity consumption, labor force, and carbon emission coefficients into the database of internal factors of carbon emission respectively, and input the data related to the coefficient of influence of supply and demand of carbon rights in the market, the coefficient of influence of climate forecast, the coefficient of influence of energy price, the coefficient of influence of exchange rate into the carbon right external factor database to enable the carbon emission forecasting module to carry out carbon emission forecasting and calculation based on the data inputted from the database of internal factors of carbon emission and the carbon right price prediction module will calculate the carbon right price prediction based on the data entered in the carbon right external factor database, and then transmit the calculated values to the carbon right trading decision making module to enable the carbon right trading decision making module to conduct the carbon emission and carbon right price forecasting and calculation process according to the calculated carbon emissions and carbon right price prediction respectively. Accordingly, the carbon emissions and carbon right price can be forecasted according to the input data of various parameters, and the carbon right trading decision can be made according to the forecasted carbon emissions and carbon right price, so as to facilitate the related personnel to make various carbon right trading decisions, and to increase the practical efficacy and effectiveness in the overall implementation and utilization.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:碳排預測量模組</p>  
        <p type="p">11:碳排內部因素資料庫</p>  
        <p type="p">2:碳權價格預測模組</p>  
        <p type="p">21:碳權外部因素資料庫</p>  
        <p type="p">3:碳權交易決策模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="717" publication-number="202626477"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626477.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>昇降機直流馬達電池插座轉向裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">B66D1/24</main-classification>  
        <further-classification edition="200601120250324B">B66B11/04</further-classification>  
        <further-classification edition="200601120250324B">B66B1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立豐達實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林重佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林重宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佐偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係揭露一種昇降機直流馬達電池插座轉向裝置，包括一馬達殼、一直流馬達、及一銜接機構。該馬達殼具預設輪廓。該直流馬達，組設於馬達殼內具有一傳動軸且穿伸至馬達殼外側。該銜接機構，係與傳動軸套接，傳遞直流馬達輸出之動力。藉由上述構件組成，透過直流馬達具有體積小且精準步進等特性，精簡昇降機整體才積與昇降控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:馬達殼</p>  
        <p type="p">S:變速機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="718" publication-number="202626074"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626074.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151250</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含乳酸菌之組合物及用於降低二氫睪固酮、改善高雄激素血症的用途</chinese-title>  
        <english-title>COMPOSITION CONTAINING LACTIC ACID BACTERIA AND THE USE FOR REDUCING DIHYDROTESTOSTERONE AND IMPROVING ANDROGENEMIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250501B">A61K35/744</main-classification>  
        <further-classification edition="200601120250501B">A61P5/26</further-classification>  
        <further-classification edition="200601120250501B">A61P17/00</further-classification>  
        <further-classification edition="200601120250501B">A61P17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葡萄王生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRAPE KING BIO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勁初</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炎鍊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詩偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王啟憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CI-SIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯毓欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡侑珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YOU-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石仰慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YANG-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林靜雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雅君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YA-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江佳琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JIA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳姿和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, ZI-HE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含乳酸菌之組合物，其可以用於降低二氫睪固酮，並具有改善高雄激素血症的效果。該乳酸菌包含瑞士乳酸菌( &lt;i&gt;Lactobacillus&lt;/i&gt;&lt;i&gt;helveticus&lt;/i&gt;)GKS3、短乳桿菌( &lt;i&gt;Lactobacillus&lt;/i&gt;&lt;i&gt;brevis&lt;/i&gt;)GKL9、約氏乳酸桿菌( &lt;i&gt;Lactobacillus&lt;/i&gt;&lt;i&gt;johnsonii&lt;/i&gt;)GKJ2、乳酸片球菌( &lt;i&gt;Pediococcus&lt;/i&gt;&lt;i&gt;acidilactici&lt;/i&gt;)GKA4或其組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a composition containing lactic acid bacteria, which can be used to reduce dihydrotestosterone and has the effect of improving androgenemia. The lactic acid bacteria includes &lt;i&gt;Lactobacillus&lt;/i&gt;&lt;i&gt;helveticus&lt;/i&gt;GKS3, &lt;i&gt;Lactobacillus&lt;/i&gt;&lt;i&gt;brevis&lt;/i&gt;GKL9, &lt;i&gt;Lactobacillus&lt;/i&gt;&lt;i&gt;johnsonii&lt;/i&gt;GKJ2, &lt;i&gt;Pediococcus&lt;/i&gt;&lt;i&gt;acidilactici&lt;/i&gt;GKA4, or combinations thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="719" publication-number="202628277"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628277.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151251</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>板對板之電連接器及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250304B">H01R13/648</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商信音科技（香港）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂俊成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李毓庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張朝坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為有關一種板對板之電連接器及其製造方法，該電連接器於基座二側罩覆屏蔽蓋體，且基座之絕緣本體內部穿設有端子組、二側分別設有組裝部、二組裝部之間形成橋接段，可供端子組之複數端子二側複數對接側分別露出於二側組裝部處，而於組裝部與二側複數對接側之間成型有具緩衝作用之軟質襯墊，再以二屏蔽蓋體分別罩覆於二側組裝部，藉由銜接部分別對位於各組裝部位置，可供基座二側複數對接側分別電性連接組裝於二預設電路板之間，亦可配合二預設電路板的共平面或非共平面設置，調整基座的橋接段之設置，達到僅利用單一連接器電性連接二預設電路板之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基座</p>  
        <p type="p">11:絕緣本體</p>  
        <p type="p">101:第一座板</p>  
        <p type="p">102:第二座板</p>  
        <p type="p">1022:第二組裝孔</p>  
        <p type="p">111:組裝部</p>  
        <p type="p">112:橋接段</p>  
        <p type="p">13:軟質襯墊</p>  
        <p type="p">132:第二襯墊</p>  
        <p type="p">14:限位部</p>  
        <p type="p">140:卡槽</p>  
        <p type="p">141:彈片</p>  
        <p type="p">2:屏蔽蓋體</p>  
        <p type="p">21:銜接部</p>  
        <p type="p">210:第三組裝孔</p>  
        <p type="p">211:螺釘</p>  
        <p type="p">3:電路板</p>  
        <p type="p">30:第四組裝孔</p>  
        <p type="p">31:金屬接點</p>  
        <p type="p">32:支撐座</p>  
        <p type="p">320:第五組裝孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="720" publication-number="202626232"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626232.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效的雙金屬鑽尾螺絲高強度焊接生產方法</chinese-title>  
        <english-title>HIGHLY EFFICIENT HIGH-STRENGTH WELDING FABRICATING METHOD FOR BIMETALLIC DRILL SCREWS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">B23G1/00</main-classification>  
        <further-classification edition="200601120250328B">F16B25/10</further-classification>  
        <further-classification edition="200601120250328B">C21D1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮梅綾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONG, MEI LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮梅綾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONG, MEI LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於複合螺絲製造方法領域，尤其涉及一種高效的雙金屬鑽尾螺絲高強度焊接生產方法，通過感應加熱線圈以500kHz-2MkHz的高周波電磁頻率，同時對兩種母材相互靠近的兩端進行加熱，直至兩種母材端面的熱區達到各自熔點溫度的前10-50℃，加熱速度快效率高，並保證母材的熱區位於端面淺層1-2mm，以減少對接時熱區處的翻卷變形，提高材料利用率，加熱完畢後，對兩種母材施加壓力並超聲波振動，使得兩者加熱後的端部對接拼合，熔接成為一體形成螺絲坯料，與此同時，對兩種母材施加振動頻率為每秒2萬次的超聲波振動，增加兩種母材的熔接牢固性，並消除母材內殘餘內應力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention belongs to the field of composite screw manufacturing methods, and particularly relates to an efficient high-strength welding production method for bimetallic drill tail screws. The invention uses an induction heating coil to use a high-frequency electromagnetic frequency of 500kHz-2MkHz to simultaneously weld the two ends of two base materials that are close to each other. Heating is performed until the hot zones on the end faces of the two base materials reach 10-50℃ within the first 10-50℃ of their respective melting points. The heating speed is fast and efficient, and the hot zone of the base metal is ensured to be located 1-2mm shallow on the end face to reduce the hot zone during docking. The rolling deformation at the position improves the material utilization. After the heating is completed, pressure is applied to the two base materials and ultrasonic vibration is applied, so that the heated ends of the two are butt jointed and welded together to form a screw blank. At the same time, the two base materials are The base material is subjected to ultrasonic vibration with a vibration frequency of 20,000 times per second, which increases the welding strength of the two base materials and eliminates residual internal stress in the base material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:不銹鋼母材</p>  
        <p type="p">11:合金母材</p>  
        <p type="p">12a、12b:熱區</p>  
        <p type="p">13:螺絲坯料</p>  
        <p type="p">14:鑽尾</p>  
        <p type="p">15:螺紋</p>  
        <p type="p">16:成品螺絲</p>  
        <p type="p">17:毛刺</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="721" publication-number="202626975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>染料組合物的製造方法及染料組合物</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING DYE COMPOSITION AND DYE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">C09B67/26</main-classification>  
        <further-classification edition="200601120250402B">C09B67/44</further-classification>  
        <further-classification edition="200601120250402B">C09B67/54</further-classification>  
        <further-classification edition="200601120250402B">C09B1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰鋒染化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIENTAL GIANT DYES &amp; CHEMICAL IND. CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱灯松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TENG-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種染料組合物的製造方法及染料組合物，該方法包括將提供的藍色染料原料加入大量冷水進行脫鹽純化程序，使經過該脫鹽純化程序處理的該藍色原料溶液中的鹽類含量為未經過該脫鹽純化程序處理的該藍色原料溶液中的鹽類含量的35%以下，之後加入助溶劑與共溶劑，得到該染料組合物，該助溶劑提高藍色染料的溶解度，並且該共溶劑將染料的溶解度維持在一定水平之上，使用該方法製備而得的染料組合物具有高溶解度，在保持一定溶解度的情形下，具有較佳的色牢度以及上色率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for manufacturing dye composition and the manufactured dye composition thereof. The method includes adding a large amount of cold water to a blue dye raw material for desalination and purification, so that the salt content in the blue raw material solution that has been processed by the desalination and purification process is less than 35% of the salt content in the blue raw material solution that has not been processed by the desalination and purification process, and then adding an auxiliary agent and co-solvent to obtain the dye composition. The auxiliary agent increases the solubility of the blue dye, and the co-solvent maintains the solubility of the dye above a certain level. The dye composition manufactured by this method has high solubility, and has desirable color fastness and uptake while maintaining a certain solubility.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S40:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="722" publication-number="202627655"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627655.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態光源裝置、投影設備及固態光源裝置的組裝方法</chinese-title>  
        <english-title>SOLID STATE LIGHT SOURCE DEVICE, PROJECTION APPARATUS AND ASSEMBLING METHOD FOR SOLID STATE LIGHT SOURCE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250326B">G03B21/16</main-classification>  
        <further-classification edition="200601120250326B">G03B21/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中強光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭根滕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, KEN-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種固態光源裝置、投影設備及固態光源裝置的組裝方法，固態光源裝置包括液冷器與光源模組，該液冷器包括腔室、液體入口與液體出口，腔室的頂面形成開口，液體入口位於腔室的側壁，且液體出口位於腔室的另一側壁，而光源模組設置於液冷器的頂面，且光源模組覆蓋開口。藉由開口，光源模組可直接與腔室內的液體接觸，使得光源模組產生的熱被液體帶走，因此固態光源裝置的散熱效率被提升。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a solid state light source device, a projection apparatus and an assembling method for solid state light source device. The sloid state light source device includes a cooler and a light source module. The cooler includes a chamber, a fluid inlet and a fluid outlet. An opening is formed on a top surface of the chamber. The fluid inlet is located on one side wall of the chamber. The fluid outlet is located on another side wall of the chamber. The light source module is disposed on a top surface of the cooler. The light source module covers over the opening. Therefore, through the opening, the light source module contacts to a fluid of the chamber such that heat generated by the light source module is taken away by the liquid. The efficiency of heat dissipation of the light source module may improve.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固態光源裝置</p>  
        <p type="p">10:液冷器</p>  
        <p type="p">12:液體入口</p>  
        <p type="p">13:液體出口</p>  
        <p type="p">20:光源模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="723" publication-number="202627427"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627427.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151284</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自供電寬頻光偵測元件及其製造方法</chinese-title>  
        <english-title>SELF-POWERED BROADBAND PHOTO-DETECTING DEVICE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250704B">G01J5/34</main-classification>  
        <further-classification edition="200601120250704B">H01J37/26</further-classification>  
        <further-classification edition="201101120250704B">B82Y40/00</further-classification>  
        <further-classification edition="201101120250704B">B82Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明志科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勝吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫　馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHESH, KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿迪穆蒂　沙惟能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADHIMOORTHY, SARAVANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BOHR-RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫琿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自供電寬頻光偵測元件及其製造方法。本發明之自供電寬頻光偵測元件包含由基材、複數根奈米柱以及複數個奈米片簇。複數根奈米柱係形成於基材的上表面上。複數根奈米柱係由一金屬之氧化合物所形成。每一個奈米片簇係形成於該複數個奈米柱中之一根奈米柱之各自的頂端上。複數個奈米片簇係由該金屬之硫屬化合物所形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a self-powered broadband photo-detecting device and a method of fabricating the same. The self-powered broadband photo-detecting device according to the invention includes a substrate, a plurality of nanorods and a plurality of nanoflake clusters. The plurality of nanorods are formed on an upper surface of the substrate. The plurality of nanorods are formed of an oxide of a metal. Each nanoflake cluster is formed on a respective top of one of the plurality of nanorods. The plurality of nanoflake clusters are formed of a chalcogenide of the metal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:自供電寬頻光偵測元件</p>  
        <p type="p">10:基材</p>  
        <p type="p">102:上表面</p>  
        <p type="p">12:奈米柱</p>  
        <p type="p">14:奈米片簇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="724" publication-number="202628131"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628131.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151321</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頭頸癌預後風險分析系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250331B">G16H50/30</main-classification>  
        <further-classification edition="201801120250331B">G16H50/20</further-classification>  
        <further-classification edition="201801120250331B">G16H50/50</further-classification>  
        <further-classification edition="200601120250331B">A61B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長佳智能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVER FORTUNE.AI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊哲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種頭頸癌預後風險分析系統包括數據收集模組、數據處理模組、模型訓練模組、分析模組、風險分組模組及臨床應用模組；數據收集模組用於收集頭頸癌患者的臨床數據和影像數據；數據處理模組用於對收集的數據進行預處理；模型訓練模組使用機器學習算法對數據進行訓練並建立預測模型；分析模組用於對待分系患者之資訊以預測模型進行分析並產生預測結果；風險分組模組用於根據模型預測結果將患者分為高、中、低風險組；臨床應用介面用於將預測結果與分組應用於臨床，幫助醫生制定個人化的治療方案，進而達到精準醫療之效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:頭頸癌預後風險分析系統</p>  
        <p type="p">10:數據收集模組</p>  
        <p type="p">12:資料庫</p>  
        <p type="p">20:數據處理模組</p>  
        <p type="p">30:模型訓練模組</p>  
        <p type="p">40:模型驗證模組</p>  
        <p type="p">50:分析模組</p>  
        <p type="p">60:風險分組模組</p>  
        <p type="p">70:臨床應用模組</p>  
        <p type="p">72:螢幕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="725" publication-number="202627718"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627718.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數位孿生感測器及其應用的控制系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G05B19/418</main-classification>  
        <further-classification edition="200601120250401B">G06F3/01</further-classification>  
        <further-classification edition="200601120250401B">B25J13/00</further-classification>  
        <further-classification edition="200601120250401B">G06F3/16</further-classification>  
        <further-classification edition="201301120250401B">G10L15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫東翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, DONG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫東翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, DONG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳濟行</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種數位孿生感測器及其應用的控制系統，其包括特徵輸入模組、孿生模型載入模組及人機交互運算模組。特徵輸入模組可對動作特徵或語音進行辨識處理而產生相應的特徵資訊，其中，該動作特徵係選自手勢、手形、肢體姿態、機器設備狀態、人機介面上的畫面或數值、感應器的回饋數值、機構狀態改變、機械手臂姿態行為以及機械輸送帶設備運動狀態的其中至少一種。孿生模型載入模組用以載入數位孿生模型，每一數位孿生模型包含映射特徵資料，映射特徵資料定義特徵資訊具有特定意義表示的定義資訊，每一定義資訊設定有控制指令。人機交互運算模組用以接收映射特徵資料，並將即時產生之特徵資訊代入映射特徵資料，再依據映射結果將符合的控制指令輸出，俾能藉由數位孿生感測器的機能設置，以對現實工業與醫療照護行為進行觀察與建模，並協助執行協作。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:數位孿生感測器</p>  
        <p type="p">20:機電控制模組</p>  
        <p type="p">30:電氣設備</p>  
        <p type="p">50:雲端伺服平台</p>  
        <p type="p">60:聯網通訊系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="726" publication-number="202627833"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627833.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>文件檢索系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR DOCUMENT SEARCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250602B">G06F16/33</main-classification>  
        <further-classification edition="202001120250602B">G06F40/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叡揚資訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALAXY SOFTWARE SERVICES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張芳瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIA-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪文君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NI, WEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種文件檢索系統，包含分塊模組、向量轉換模組、資料庫模組及檢索模組。分塊模組對各複數篇特殊領域文件中預先定義的重點部分執行分塊流程，以獲得重點部分的複數個文字區塊。向量轉換模組使用嵌入模型，將各重點部分的複數個文字區塊轉換為對應的複數個檢索嵌入向量，並儲存於資料庫模組。向量轉換模組使用嵌入模型將檢索內容轉換為檢索內容嵌入向量，檢索模組計算檢索內容嵌入向量與資料庫模組中每一檢索嵌入向量的相似度，並據以產生檢索結果。本文亦揭示對應的文件檢索方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a system for document search, comprising a chunking module, an embedding module, a database module and a search module. The chunking module performs a chunking process on a predefined key part of each of multiple documents in a special field to obtain a plurality of chunks of the key part. The embedding module uses an embedding model to transform the chunks of each key part into corresponding search embeddings, and stores them in the database module. The embedding module uses the embedding model to transform a search content into a search content embedding. The search module calculates a similarity between the search content embedding and each of the search embeddings in the database module, and generates a search result accordingly. Also disclosed is a corresponding method for document search.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:針對特殊領域文件之文件檢索系統</p>  
        <p type="p">110:分塊模組</p>  
        <p type="p">120:向量轉換模組</p>  
        <p type="p">130:資料庫模組</p>  
        <p type="p">140:檢索模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="727" publication-number="202627637"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627637.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃騰緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃美蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MEI-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭家斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHIA-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括畫素陣列基板、彩色濾光基板及相機模組。畫素陣列基板包括多條掃描線、多條資料線、多個顯示區子畫素以及多個相機區子畫素。彩色濾光基板包括重疊於相機區的第一濾光區以及重疊於顯示區的第二濾光區。彩色濾光基板包括多個掃描線遮蔽結構以及子畫素分隔結構。掃描線遮蔽結構重疊於掃描線。子畫素分隔結構重疊於資料線，且包括在第一方向上排列的第一遮光部以及第二遮光部。掃描線遮蔽結構針對可見光的穿透率不同於第二遮光部針對可見光的穿透率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a pixel array substrate, a color filter substrate and a camera module. The pixel array substrate includes scan lines, data lines, display area sub-pixels, and camera area sub-pixels. The color filter substrate includes a first filter area overlapping the camera area and a second filter area overlapping the display area. The color filter substrate includes scan line shielding structures and a sub-pixel separation structure. The scan line shielding structure overlaps the scan lines. The sub-pixel separation structure overlaps the data lines and includes a first light-shielding portion and a second light-shielding portion arranged in a first direction. The transmittance of the scan line shielding structure for visible light is different from that of the second light shielding portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:顯示裝置</p>  
        <p type="p">100A:畫素陣列基板</p>  
        <p type="p">102:相機區</p>  
        <p type="p">104:顯示區</p>  
        <p type="p">110:第一基板</p>  
        <p type="p">120,130,140,150:絕緣層</p>  
        <p type="p">200A:彩色濾光基板</p>  
        <p type="p">202:第一濾光區</p>  
        <p type="p">204:第二濾光區</p>  
        <p type="p">210:第二基板</p>  
        <p type="p">222A:第一遮光部</p>  
        <p type="p">222a:第一底層</p>  
        <p type="p">222b:第一覆蓋層</p>  
        <p type="p">224A:第二遮光部</p>  
        <p type="p">224a:第二底層</p>  
        <p type="p">224b:第二覆蓋層</p>  
        <p type="p">226A:第三遮光部</p>  
        <p type="p">226a:第三底層</p>  
        <p type="p">226b:第三覆蓋層</p>  
        <p type="p">260:保護層</p>  
        <p type="p">310:相機模組</p>  
        <p type="p">400A:液晶層</p>  
        <p type="p">402:液晶分子</p>  
        <p type="p">410:背光模組</p>  
        <p type="p">412:燈板</p>  
        <p type="p">414:光學膜片</p>  
        <p type="p">420:第一偏光片</p>  
        <p type="p">430:第二偏光片</p>  
        <p type="p">440:間隔物</p>  
        <p type="p">CE:共用電極</p>  
        <p type="p">CF1:第一色濾光圖案</p>  
        <p type="p">CF2:第二色濾光圖案</p>  
        <p type="p">CF3:第三色濾光圖案</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">PE:畫素電極</p>  
        <p type="p">SP1:顯示區子畫素</p>  
        <p type="p">SP2:相機區子畫素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="728" publication-number="202628043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素電路</chinese-title>  
        <english-title>PIXEL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250109B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧名揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, MING-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊銘宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素電路。畫素電路包括發光二極體、第一驅動電晶體、第二驅動電晶體、脈波振幅調變電路、以及脈波寬度調變電路。第一驅動電晶體具有第一端、接收振幅控制信號的控制端、以及第二端。第二驅動電晶體具有耦接第一驅動電晶體的第二端的第一端、接收寬度控制信號的控制端、以及耦接發光二極體的陰極的第二端，第二驅動電晶體的通道極性不同於第一驅動電晶體。脈波振幅調變電路基於發光信號以及振幅資料電壓提供振幅控制信號。脈波寬度調變電路基於發光信號、擺盪信號以及寬度資料電壓提供寬度控制信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel circuit is provided. The pixel circuit includes a LED, a first driving transistor, a second driving transistor, a pulse amplitude modulation circuit, and a pulse width modulation circuit. The first driving transistor has a first terminal, a control terminal receiving an amplitude control signal, and a second terminal. The second driving transistor has a first terminal coupled to the second terminal of the first driving transistor, a control terminal receiving a width control signal, and a second terminal coupled to the cathode of the LED, the channel polarity of the second driving transistor is different from that of the first drive transistor. The pulse amplitude modulation circuit provides the amplitude control signal based on an emission signal and an amplitude data voltage. The pulse width modulation circuit provides the width control signal based on the emission signal, a swing signal and a width data voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1~C3:電容</p>  
        <p type="p">CTpam:脈波振幅調變電路</p>  
        <p type="p">CTpwm:脈波寬度調變電路</p>  
        <p type="p">CTtest:測試電路</p>  
        <p type="p">EPWM(n):發光信號</p>  
        <p type="p">LD1:發光二極體</p>  
        <p type="p">PX:畫素電路</p>  
        <p type="p">SET(n):電壓設定信號</p>  
        <p type="p">SP(n):畫素設定信號</p>  
        <p type="p">Sweep(n):擺盪信號</p>  
        <p type="p">Sweep_VGH:擺盪高電壓</p>  
        <p type="p">T1~T21:電晶體</p>  
        <p type="p">VDD_PAM、VDD_PWM:系統高電壓</p>  
        <p type="p">VGA:振幅控制信號</p>  
        <p type="p">VGW:寬度控制信號</p>  
        <p type="p">VPAM:振幅資料電壓</p>  
        <p type="p">Vresult:測試結果電壓</p>  
        <p type="p">VSET:設定電壓</p>  
        <p type="p">Vsig(m):灰階資料電壓</p>  
        <p type="p">VSS:系統低電壓</p>  
        <p type="p">VST(n):起始電壓信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="729" publication-number="202627609"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627609.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含超穎表面結構之近眼顯示模組</chinese-title>  
        <english-title>NEAR-EYE DISPLAY MODULE WITH METASURFACE STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250507B">G02B27/01</main-classification>  
        <further-classification edition="201101120250507B">B82Y20/00</further-classification>  
        <further-classification edition="200601120250507B">B82B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余沛慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, PEICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林傳恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUANEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊宜璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, I HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁文鐙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, WENTENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種含超穎表面結構之近眼顯示模組包含鏡片基板、光耦入-耦出結構以及至少一超穎表面結構。超穎表面結構位於鏡片基板的第一表面上，超穎表面結構的功能包含聚焦與二維擴瞳。其中聚焦超穎表面結構具有中心，聚焦超穎表面結構包含複數個第一超穎原子，第一超穎原子的每一者的第一直徑沿超穎表面結構的外側往超穎表面結構的中心的方向上漸變。二維擴瞳超穎表面結構包含複數個第二超穎原子，第二超穎原子的每一者為圓柱或橢圓柱，且圓柱的每一者的第二直徑或橢圓柱的每一者的長軸的長度沿光行進方向漸變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display module includes a lens substrate, a light incouple-outcouple structure and at least a metasurface structure. The metasurface structure is located on a first surface of the lens substrate. The functions of the metasurface structure include focusing and two-dimensional exit pupil expansion. The focusing metasurface structure is located on the first surface of the lens substrate, in which the focusing metasurface structure has a center. The metasurface structure includes a plurality of first meta-atoms. A first diameter of each of the first meta-atoms changes gradually along a direction from an outside of the metasurface structure toward the center of the metasurface structure. The two-dimensional exit pupil expansion metasurface structure includes a plurality of second meta-atoms. Each of the second meta-atoms is a cylinder or an elliptic cylinder, and a second diameter of the cylinder or a length of a long axis of the elliptic cylinder changes gradually along a light propagating direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:超穎表面結構</p>  
        <p type="p">200:光耦入-耦出結構</p>  
        <p type="p">210:入射光區</p>  
        <p type="p">220:出射光區</p>  
        <p type="p">300:顯示模組</p>  
        <p type="p">310:鏡片基板</p>  
        <p type="p">311:第一表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="730" publication-number="202628362"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628362.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不受溫度影響的時脈產生電路及其運作方法</chinese-title>  
        <english-title>A TEMPERATURE-INDEPENDENT CLOCK GENERATION CIRCUIT AND AN OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">H03K5/04</main-classification>  
        <further-classification edition="200601120250303B">H03K5/26</further-classification>  
        <further-classification edition="200601120250303B">G06F1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>精拓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEATURE INTEGRATION TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍玉麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, YU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何維哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEI-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種不受溫度影響的時脈產生電路及其運作方法。該時脈產生電路包括一溫度感測模組、一控制模組以及一時脈產生模組。該溫度感測模組用以感測該時脈產生電路的環境溫度以產生一感測溫度訊號。該控制模組使該感測溫度訊號與該比對溫度訊號進行比對以產生一比對結果。當該比對結果指示該感測溫度訊號與該比對溫度訊號為相同時，該控制模組基於該比對溫度訊號確認一感測溫度，且基於該感測溫度產生一時脈產生控制訊號。該時脈產生模組用以根據該時脈產生控制訊號產生相應的時脈訊號。該時脈訊號在不同的該感測溫度下具有固定的時脈頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to a temperature-independent clock generation circuit and an operating method thereof. The clock generation circuit includes a temperature sensing module, a control module and a clock generation module. The temperature sensing module senses the temperature of the environment of the clock generation circuit to generate a sensed temperature signal. The control module compares the sensed temperature signal with a comparison temperature signal to generate a comparison result. When the comparison result indicates that the sensed temperature signal and the comparison temperature signal are the same, the control module confirms a sensed temperature based on the comparison temperature signal and generates a clock generation control signal based on the sensed temperature. The clock generation module generates a corresponding clock signal according to the clock generation control signal. The clock signal has a fixed clock frequency under different sensed temperatures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:時脈產生電路</p>  
        <p type="p">100:溫度感測模組</p>  
        <p type="p">110:放大單元</p>  
        <p type="p">200:控制模組</p>  
        <p type="p">210:比較單元</p>  
        <p type="p">220:控制單元</p>  
        <p type="p">300:時脈產生模組</p>  
        <p type="p">310:電流源單元</p>  
        <p type="p">320:時脈產生單元</p>  
        <p type="p">330:反向器</p>  
        <p type="p">Clk:時脈訊號</p>  
        <p type="p">DAC:數位類比轉換單元</p>  
        <p type="p">R1:第一電阻</p>  
        <p type="p">R2:第二電阻</p>  
        <p type="p">R3:第三電阻</p>  
        <p type="p">R4:第四電阻</p>  
        <p type="p">R5:第五電阻</p>  
        <p type="p">R6:第六電阻</p>  
        <p type="p">R7:第七電阻</p>  
        <p type="p">R8:第八電阻</p>  
        <p type="p">S1:感測溫度訊號</p>  
        <p type="p">S2:比對溫度訊號</p>  
        <p type="p">Sc:控制訊號</p>  
        <p type="p">Sf:時脈產生控制訊號</p>  
        <p type="p">VDD:第一電源電壓</p>  
        <p type="p">VSS:第二電源電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="731" publication-number="202625958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多模態掃描裝置、其成像系統及其操作方法</chinese-title>  
        <english-title>MULTIMODAL SCANNING DEVICE, IMAGING SYSTEM AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250423B">A61B1/05</main-classification>  
        <further-classification edition="200601120250423B">A61B8/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, FU-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂世傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳順成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHUEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種多模態掃描裝置，包含外套管、第一影像掃描模組、第二影像掃描模組以及光學相干斷層掃描模組。外套管包括彼此間隔的第一通道、第二通道以及第三通道。第一影像掃描模組設置於第一通道內，用以對待檢測區擷取第一影像。第二影像掃描模組設置於第二通道內，用以對該待檢測區擷取第二影像。光學相干斷層掃描模組穿設於第三通道內，並用以對該待檢測區中的待檢測位點擷取光學相干斷層掃描影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-modal scanning device is provided, including an outer tube, a first imaging module, a second imaging module, and an optical coherence tomography module. The outer tube includes a first channel, a second channel, and a third channel spaced apart from each other. The first imaging module is disposed in the first channel and is configured to capture a first image of an area under test. The second imaging module is disposed in the second channel and is configured to capture a second image of the area under test. The optical coherence tomography module is disposed in the third channel and is configured to capture an optical coherence tomography image of a site under test in the area under test.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多模態掃描裝置</p>  
        <p type="p">10:外套管</p>  
        <p type="p">11:端面</p>  
        <p type="p">12:第一通道</p>  
        <p type="p">14:第二通道</p>  
        <p type="p">16:第三通道</p>  
        <p type="p">162:第一滑移件</p>  
        <p type="p">164:內側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="732" publication-number="202628432"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628432.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>攝影機自動運鏡的方法</chinese-title>  
        <english-title>METHOD FOR AUTOMATIC CAMERA MOTION CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">H04N23/60</main-classification>  
        <further-classification edition="202101120250401B">G03B13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圓展科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVER INFORMATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝仁堡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, REN-PAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昀龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIE, YUN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出一種以處理器執行的攝影機自動運鏡的方法，包括：取得攝影機拍攝的初始影像，利用預訓練取景模型分析初始影像以產生多個第一推薦框，依據多個運鏡參數中的至少一第一參數從這些第一推薦框中選擇一第一候選框，以及依據第一候選框的攝影機參數取得並輸出對應於第一候選框的影像。所述多個運鏡參數包括第一推薦框中的物件類別、數量、大小和位置及第一推薦框的大小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for automatic camera motion control performed by a processor is proposed, which includes: obtaining an initial image captured by the camera, analyzing the initial image using a pre-trained framing model to generate a plurality of first recommendation frames, selecting a first candidate frame from these first recommendation frames based on at least one first parameter from a plurality of motion control parameters, and acquiring and outputting the image corresponding to the first candidate frame based on its camera parameter. The plurality of motion control parameters includes object category, quantity, size, and position within the first recommendation frames, as well as the size of the first recommendation frames.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1-S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="733" publication-number="202628339"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628339.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁式伺服馬達編碼器</chinese-title>  
        <english-title>ELECTROMAGNETIC SERVO MOTOR ENCODER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250512B">H02P25/08</main-classification>  
        <further-classification edition="200601120250512B">G01D5/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聖鎰精密實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEN.I PRECISION INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭俐瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種電磁式伺服馬達編碼器，其至少包含一電源電路、一通訊介面、一伺服馬達控制器、一MCU控制單元與一電磁式數位角度傳感器。前述通訊介面為前述MCU控制單元與前述伺服馬達控制器的連接介面，讓前述MCU控制單元與前述伺服馬達控制器之間產生訊號互通連接。前述伺服馬達控制器係接收來自前述MCU控制單元的信號，以驅動一伺服馬達運作。前述MCU控制單元係用於設定前述伺服馬達的運作模式，並經由前述通訊介面以與前述伺服馬達控制器連接。前述電磁式數位角度傳感器係為一硬體元件，並連接前述MCU控制單元，前述電磁式數位角度傳感器係藉由電磁感應原理將自前述伺服馬達測得的信號轉換成線圈的自感係數和互感係數的變化， 使伺服馬達可更為精準地運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to an electromagnetic servo motor encoder, which includes at least a power circuit, a communication interface, a servo motor controller, an MCU control unit and an electromagnetic digital angle sensor. Said communication interface is a connection interface between said MCU control unit and said servo motor controller, and allowing signal connection between said MCU control unit and said servo motor controller. Said servo motor controller receives signals from said MCU control unit to drive a servo motor to operate. Said MCU control unit is used to set the operation mode of said servo motor and is connected to said servo motor controller through said communication interface. Said electromagnetic digital angle sensor is a hardware component and is connected to said MCU control unit. Said electromagnetic digital angle sensor uses the principle of electromagnetic induction to convert the signal measured from said servo motor into changes in the self-inductance coefficient and mutual-inductance coefficient of the coil, so that the servo motor can operate more accurately.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電源電路</p>  
        <p type="p">2:通訊介面</p>  
        <p type="p">3:伺服馬達控制器</p>  
        <p type="p">4:MCU控制單元</p>  
        <p type="p">5:電磁式數位角度傳感器</p>  
        <p type="p">6:伺服馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="734" publication-number="202626448"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626448.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＭＤＩ棧板適合輸送帶之構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250307B">B65D19/31</main-classification>  
        <further-classification edition="200601120250307B">B65D19/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳鑑顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖少雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳鑑顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖少雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種MDI棧板適合輸送帶之構造，以回收或加工剩餘木材、木屑、秸稈等為原料，經機具處理破碎、烘乾，將木料碎屑與亞甲基二苯基二異氰酸酯(MDI)膠水混合，以模具高溫熱壓一體成型製成；其外觀主要為四方型，包括一棧板本體、三個長方形托腳、多個加強筋、多個作業孔和多個條碼區塊，其中之長方形托腳內部向下凹陷、外部突出，使棧板能在輸送帶上運送，多個加強筋增加棧板承載力和止滑機能，多個作業孔方便油壓車等設備作業，多個條碼區塊可供貼上條碼辨識，提升倉儲物流效率，並有專為鐵桶貨物設計之構造。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">01:棧板本體</p>  
        <p type="p">05:作業孔</p>  
        <p type="p">21:長方形托腳</p>  
        <p type="p">22:長方形托腳</p>  
        <p type="p">23:長方形托腳</p>  
        <p type="p">S300:加強筋</p>  
        <p type="p">C301:條碼區塊</p>  
        <p type="p">B01:條碼(Barcode)</p>  
        <p type="p">Q01:二維條碼(QR Code)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="735" publication-number="202628170"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628170.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空電漿蝕刻之薄板定位裝置</chinese-title>  
        <english-title>THIN-PLATE POSITIONING DEVICE FOR VACUUM PLASMA ETCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">H01J37/32</main-classification>  
        <further-classification edition="200601120250109B">H01J37/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>暉盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許嘉元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種真空電漿蝕刻之薄板定位裝置，係主要於一電漿刻蝕設備其機體的真空反應腔內設有一偏壓載台，又於該偏壓載台上設置有一定位框，藉此，當使用時係將一待加工的薄板放置於機體之偏壓載台上，再將一定位框壓制於該薄板上，利用該定位框重量的壓制，即可使薄板緊密貼合於偏壓載台，避免對偏壓載台施加偏壓時，薄板發生浮起情況，據此，俾使薄板蝕刻時產生的高溫熱能確實傳導至偏壓載台後散熱，以有效防止現有薄板實施非等向性蝕刻時易產生爆板情形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a thin-plate positioning device for vacuum plasma etching. The device primarily includes a bias carrier platform installed within a vacuum reaction chamber of a plasma etching machine. A positioning frame is arranged on the bias carrier platform. During use, the thin plate to be processed is placed on the bias carrier platform of the machine, and the positioning frame is pressed onto the thin plate. Utilizing the weight of the positioning frame, the thin plate is firmly secured against the bias carrier platform, preventing it from lifting when a bias is applied. Consequently, the high thermal energy generated during the etching process is effectively conducted to the bias carrier platform and dissipated. This design effectively mitigates cracking issues commonly observed during anisotropic etching of thin plates in conventional systems.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:偏壓載台</p>  
        <p type="p">31:冷卻通道</p>  
        <p type="p">8:定位框</p>  
        <p type="p">81:金屬框體</p>  
        <p type="p">82:絕緣層</p>  
        <p type="p">83:金屬導帶</p>  
        <p type="p">9:薄板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="736" publication-number="202627970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有評分共識的輔助評分系統及其方法</chinese-title>  
        <english-title>AUXILIARY SCORING SYSTEM WITH SCORING CONSENSUS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250512B">G06Q50/20</main-classification>  
        <further-classification edition="202301120250512B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈佑璉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YU-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣岳珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YUE-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有評分共識的輔助評分方法，包含：提供複數個答題資料與對應複數個答題資料之複數個評分資料作為輸入資料集；將輸入資料集輸入至神經網路模型，以訓練神經網路模型；驗證神經網路模型，並評估神經網路模型之輸出預測之準確性以建立人工智慧模型；使用人工智慧模型生成複數個注意力圖及/或複數個特徵圖；基於複數個注意力圖及/或複數個特徵圖獲得評分共識資訊；以及將評分共識資訊可視化，並使用不同顏色標示評分共識資訊之共識區塊及非共識區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An auxiliary scoring method with scoring consensus, including: providing a plurality of answer data and a plurality of score data corresponding to the plurality of answer data as an input data set; inputting the input data set into a neural network model to train the neural network model; verify the neural network model, and evaluate the accuracy of the output prediction of the neural network model to establish an artificial intelligence model; using the artificial intelligence model to generate a plurality of attention maps and/or a plurality of feature maps; obtaining a scoring consensus information from based on the plurality of attention maps and/or the plurality of feature maps; and visualize the scoring consensus information, and use different colors to mark consensus blocks and non-consensus blocks of the scoring consensus information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:具有評分共識的輔助評分系統</p>  
        <p type="p">110:資料預處理模組</p>  
        <p type="p">111:資料數位化模組</p>  
        <p type="p">112:資料轉換模組</p>  
        <p type="p">120:人工智慧模型模組</p>  
        <p type="p">121:人工智慧模型</p>  
        <p type="p">122:訓練模組</p>  
        <p type="p">123:驗證模組</p>  
        <p type="p">124:輸出模組</p>  
        <p type="p">125:評分推論模組</p>  
        <p type="p">126:神經網路模型</p>  
        <p type="p">130:評分共識計算模組</p>  
        <p type="p">140:電腦視覺模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="737" publication-number="202628495"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628495.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其晶片保護裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND WAFER PROTECTING DEVICE THEROF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">H05K1/02</main-classification>  
        <further-classification edition="200601120250328B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃順治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛黛娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, TAI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭春亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括基板及晶片保護裝置。基板具有板表面，板表面上具有晶片。晶片保護裝置包含偵測器及擋牆組件。偵測器包含第一電極及第二電極，第一電極與第二電極連接於板表面並環圍於晶片，第二電極位於該晶片與第一電極之間。擋牆組件連接於板表面並位於偵測器與晶片之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a substrate and a wafer protecting device. The substrate has a plate surface with wafers on the plate surface. The wafer protecting device includes a detector and a retaining wall assembly. The detector includes a first electrode and a second electrode. The first electrode and the second electrode are connected to between the plate surface and surround the wafer. The second electrode is located between the wafer and the first electrode. The retaining wall assembly is connected to the plate surface and is located between the detector and the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:晶片保護裝置</p>  
        <p type="p">106:板表面</p>  
        <p type="p">108:晶片</p>  
        <p type="p">109:發熱面</p>  
        <p type="p">110:偵測器</p>  
        <p type="p">112:擋牆組件</p>  
        <p type="p">114:第一電極</p>  
        <p type="p">116:第二電極</p>  
        <p type="p">122:吸附擋牆</p>  
        <p type="p">126:氧化擋牆</p>  
        <p type="p">132:彈性擋牆</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="738" publication-number="202628998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路及其突波抑制電路</chinese-title>  
        <english-title>INTEGRATED CIRCUIT AND SPIKE SUPPRESSION CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W42/60</main-classification>  
        <further-classification edition="200601120260302B">H02H9/04</further-classification>  
        <further-classification edition="200601120260302B">H02H7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘均宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, JIUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種積體電路及其突波抑制電路。積體電路包含一第一接腳及一第二接腳。該突波抑制電路包含一開關以及一偵測電路。開關耦接於該第一接腳與該第二接腳之間。偵測電路耦接該第一接腳及該開關之一控制端，用來偵測該第一接腳上的一突波。當該偵測電路偵測到該突波時，該偵測電路控制該開關導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit and a spike suppression circuit thereof are provided. The integrated circuit includes a first pin and a second pin. The spike suppression circuit includes a switch and a detection circuit. The switch is coupled between the first pin and the second pin. The detection circuit is coupled to the first pin and a control terminal of the switch and is used to detect a spike on the first pin. When the detection circuit detects the spike, the detection circuit controls the switch to conduct.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:積體電路</p>  
        <p type="p">210,220:接腳</p>  
        <p type="p">205:突波電流吸收元件</p>  
        <p type="p">230:突波抑制電路</p>  
        <p type="p">232:開關</p>  
        <p type="p">234:控制電路</p>  
        <p type="p">236:偵測電路</p>  
        <p type="p">240:放電路徑</p>  
        <p type="p">C1:電容器</p>  
        <p type="p">Enb:控制訊號</p>  
        <p type="p">GND:參考電壓</p>  
        <p type="p">Nc:控制端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="739" publication-number="202628266"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628266.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>面板連接器的固定支架及使用其之機殼組件</chinese-title>  
        <english-title>FIXING BRACKET FOR A PANEL CONNECTER AND CASING ASSEMBLY HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">H01R13/62</main-classification>  
        <further-classification edition="200601120250407B">H05K7/12</further-classification>  
        <further-classification edition="200601120250407B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康舒科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACBEL POLYTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李岳峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUEH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林振家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高農晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, NUNG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡嘉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種面板連接器的固定支架及使用其之機殼組件，固定支架包含一固定部，其用以套設於面板連接器且貼靠其二端面及二側壁面中的至少三個面；一上連接部，其自固定部的一端彎折並延伸，上連接部貫穿有一上穿孔；一前連接部，其自固定部的另一端彎折，延伸一段距離後再朝向遠離固定部的方向延伸，前連接部貫穿有一前穿孔；面板連接器穿設於機殼組件的安裝面，藉由固定支架的固定部抵靠固定，因此可使得面板連接器穩固的定位於機殼組件的安裝面上，當連接器受到外力時，不會產生晃動、傾斜或偏位，避免產生斜插的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a fixing bracket for a panel connector and a casing assembly having the same. The fixing bracket includes: a fixing portion configured to be mounted around the panel connector and contact at least three surface of its two end surfaces and two side surfaces of the panel connector; an upper connecting portion bent and extending from an end of the fixing portion and having an upper through-hole; and a front connecting portion bent from another end of the fixing portion, extending a certain distance, and bent again and extending away from the fixing portion, wherein the front connecting portion has a front through-hole. The panel connector is mounted on an installation surface of the casing assembly with the fixing portion of the fixing bracket pressing against the panel connector to secure the panel connector in place. Thus, the panel connector is securely positioned on the installation surface, preventing wobbling, tilting, or shifting when external force exerted on the panel connector and misaligned insertion can also be avoided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:固定支架</p>  
        <p type="p">11:固定部</p>  
        <p type="p">111:固定槽</p>  
        <p type="p">112:缺口</p>  
        <p type="p">12:上連接部</p>  
        <p type="p">121:上穿孔</p>  
        <p type="p">122:導槽</p>  
        <p type="p">13:前連接部</p>  
        <p type="p">131:前穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="740" publication-number="202627458"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627458.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板光學檢測系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G01N21/956</main-classification>  
        <further-classification edition="200601120260302B">G01N21/63</further-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔚華科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊燿州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李峯杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙彥錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁玉芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體基板光學檢測系統及方法，將樣品放置於檢測位置，導入激發光源在樣品中進行量測，當光源正向進入樣品後會產生之激發訊號稱之為正向激發訊號，當光源進入樣品後再經樣品另一界面反射後產生之激發訊號稱之為反向激發訊號；系統收集正、反向激發訊號，再經由訊號處理及圖像生成模組生成高辨識度微孔孔壁形狀及缺陷圖像，實現對微孔內部結構的精確檢測。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:樣品</p>  
        <p type="p">11:正面</p>  
        <p type="p">12:背面</p>  
        <p type="p">30:光源模組</p>  
        <p type="p">31:界面</p>  
        <p type="p">33:光偵測器</p>  
        <p type="p">34:訊號處理及圖像生成模組</p>  
        <p type="p">35:激發光</p>  
        <p type="p">36:反向激發光</p>  
        <p type="p">50:載台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="741" publication-number="202627751"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627751.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置與其適應性電源管理方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND ADAPTIVE POWER MANAGEMENT METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F1/26</main-classification>  
        <further-classification edition="202201120250401B">G06V30/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱建珽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置與其適應性電源管理方法。此方法適用於包括影像擷取裝置的電子裝置，並包括下列步驟。透過影像擷取裝置朝一電源適配器擷取一目標影像。根據目標影像獲取電源適配器的適配器規格資訊。由一嵌入式控制器根據電源適配器的適配器規格資訊導通多個供電路徑中的一選定供電路徑。多個供電路徑耦接於系統負載與電源適配器之間，且多個供電路徑分別對應於不同的多個電阻值。透過電源適配器經由選定供電路徑輸出一負載電流至電子裝置的系統負載。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and an adaptive power management method thereof are provided. The method adapted to the electronic device including an image capture device and includes the following steps. A target image is captured toward a power adapter through the image capture device. Adapter specification information of the power adapter is obtained based on the target image. An embedded controller conducts a selected power supply path among multiple power supply paths according to the adapter specification information of the power adapter. The power supply paths are coupled between the system load and the power adapter, and the power supply paths respectively correspond to different resistance values. The power adapter outputs a load current to the system load of the electronic device through the selected power supply path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="742" publication-number="202627958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151364</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合共享雨傘之功能的自動櫃員機系統與使用方法</chinese-title>  
        <english-title>SYSTEM INTEGRATING SHARING UMBRELLA AND AUTOMATIC TELLER MACHINE AND OPERAING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250109B">G06Q40/02</main-classification>  
        <further-classification edition="202301120250109B">G06Q30/015</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合作金庫商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合共享雨傘之功能的自動櫃員機系統，包含自動櫃員機機台以及共享雨傘平台。自動櫃員機機台包含中控處理器、連接至中控處理器並配置以輸入處理需求的輸入介面，以及連接至中控處理器並配置以因應處理需求顯示處理畫面的顯示螢幕。共享雨傘平台連接至中控處理器，共享雨傘平台包含複數個雨傘儲存器以及設置於雨傘儲存器中的雨傘。中控處理器因應處理需求發出解鎖訊號至共享雨傘平台，共享雨傘平台在收到解鎖訊號後解鎖雨傘儲存器中對應的其中一個雨傘儲存器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system integrating sharing umbrella and automatic teller machine includes an automatic teller machine and a sharing umbrella platform. The automatic teller machine includes a center controller, an input interface connected to the center controller and configured to input a process task, a display connected to the center controller and configured to display a processing image corresponding to the process task. The sharing umbrella platform is connected to the center controller. The sharing umbrella platform includes a plurality of umbrella storages and umbrellas disposed in the umbrella storages. The center controller sends an unlock signal corresponding to the process task to the sharing umbrella platform, and the sharing umbrella platform unlocks the corresponding one of the umbrella storages after receiving the unlock signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:整合共享雨傘之功能的自動櫃員機系統</p>  
        <p type="p">100:自動櫃員機機台</p>  
        <p type="p">110:中控處理器</p>  
        <p type="p">120:操作介面</p>  
        <p type="p">130:顯示螢幕</p>  
        <p type="p">140:卡片讀取槽</p>  
        <p type="p">150:生物特徵辨識器</p>  
        <p type="p">200:共享雨傘平台</p>  
        <p type="p">210:雨傘儲存器</p>  
        <p type="p">220:雨傘</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="743" publication-number="202627550"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627550.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光模組</chinese-title>  
        <english-title>BACKLIGHT MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G02B6/00</main-classification>  
        <further-classification edition="200601120250418B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達運精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤建智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JIAN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YU-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈文臺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, WEN-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">背光模組包括以下特徵。防窺片設置於光源組件的光束的傳遞路徑上。導光板設置於防窺片的背對光源組件的一側，並具有入光面、表面與多個光學微結構。入光面與發光元件相對，表面朝向防窺片並連接入光面。光學微結構凹陷或凸出於表面，並分別具有第一凸曲面、第二凸曲面及圓角。第一凸曲面及第二凸曲面立於表面，且圓角連接第一凸曲面及第二凸曲面。每一第一凸曲面與表面的第一夾角介於30°～70°，且圓角的曲率半徑介於0.001 mm～0.005 mm。當光學微結構凹陷於表面時，第一凸曲面朝向入光面。當光學微結構凸出於表面時，第一凸曲面背對入光面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module includes the following features. A privacy film is disposed on a transmission path of a light beam of a light source assembly. A light guide plate is disposed on a side of the privacy film facing away from the light source assembly, and has a light incident surface, a surface and a plurality of optical microstructures. The light incident surface is opposite to a light-emitting element, and the surface faces the privacy film and is connected to the light incident surface. The optical microstructures are concave or protruding from the surface, and respectively have a first convex surface, a second convex surface and a rounded corner. The first convex surface and the second convex surface stand on the surface, and the rounded corner is connected to the first convex surface and the second convex surface. The first angle between each of the first convex surface and the surface is between 30° and 70°, and the radius of curvature of the rounded corner is between 0.001 mm and 0.005 mm. When the optical microstructures are concave from the surface, the first convex surface faces the light incident surface. When the optical microstructures protrude from the surface, the first convex surface faces away from the light incident surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:背光模組</p>  
        <p type="p">110:光源組件</p>  
        <p type="p">111:第二導光板</p>  
        <p type="p">112:第二發光元件</p>  
        <p type="p">120:防窺片</p>  
        <p type="p">130:第一發光元件</p>  
        <p type="p">140:第一導光板</p>  
        <p type="p">141:第一入光面</p>  
        <p type="p">143:光學微結構</p>  
        <p type="p">144:出光面</p>  
        <p type="p">150:反射片</p>  
        <p type="p">E1:第一邊</p>  
        <p type="p">E2:第二邊</p>  
        <p type="p">E3:第三邊</p>  
        <p type="p">ES:出光面</p>  
        <p type="p">IS:第二入光面</p>  
        <p type="p">L1、L2:光束</p>  
        <p type="p">S、142:表面</p>  
        <p type="p">S1:第一凸曲面</p>  
        <p type="p">S2:第二凸曲面</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="744" publication-number="202628902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151369</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固晶裝置適應基板角度的固晶方法</chinese-title>  
        <english-title>DIE-BONDING METHOD THAT ALLOWS DIE-BONDING DEVICE TO ADAPT TO ANGLE OF SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P72/50</main-classification>  
        <further-classification edition="202601120260401B">H10P72/30</further-classification>  
        <further-classification edition="202601120260401B">H10P72/00</further-classification>  
        <further-classification edition="202201120260401B">G06V10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梭特科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAULTECH TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種固晶裝置適應基板角度的固晶方法，包括下列步驟：固晶裝置設於移載裝置的腔室中，固晶裝置的頂部的側邊抵靠於移載裝置的底部上，固晶裝置的底部穿過移載裝置的底部的開口並藉由負壓吸附晶粒，且移載裝置提供正壓作用於固晶裝置的頂部；將移載裝置移動至基板的上方，且晶粒對準晶粒放置區；將移載裝置向下移動，晶粒接觸晶粒放置區，且基板提供反作用力透過晶粒作用於固晶裝置；以及在正壓環境中，固晶裝置藉由反作用力在腔室和開口中浮動以適應基板的角度，直至晶粒完全貼合於晶粒放置區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A die-bonding method that allows a die-bonding device to adapt to an angle of a substrate includes the following steps: the die-bonding device is located in a chamber of a transfer device, sides of a top portion of the die-bonding device are against a bottom of a transfer device, a bottom of the die-bonding device passes through an opening at the bottom of the transfer device and absorbs a die by negative pressure, and the transfer device provides positive pressure on the top portion of the die-bonding device; move the transfer device above a substrate, and align the die with a die placement area of the substrate; move the transfer device downward, and the die contact the die placement area, and the substrate provides a reaction force to act on the die-bonding device through the die; and the die-bonding device floats in the chamber and opening through the reaction force to adapt to an angle of the substrate until the die fits perfectly into the die placement area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S60:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="745" publication-number="202628499"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628499.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板組件及其製造方法</chinese-title>  
        <english-title>CIRCUIT BOARD ASSEMBLY AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H05K1/11</main-classification>  
        <further-classification edition="200601120250203B">H05K7/02</further-classification>  
        <further-classification edition="200601120250203B">H05K3/46</further-classification>  
        <further-classification edition="200601120250203B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐筱婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSIAO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何明展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, MING-JAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種電路板組件及其製造方法。電路板組件包含二線路板、二光電轉換元件、彈性傳輸層和二複合材料結構。每一個線路板包含線路層。所述光電轉換元件分別裝設在所述線路層。彈性傳輸層連接所述線路板，且具有傳輸通道。傳輸通道用於傳輸光信號。所述光電轉換元件和傳輸通道位於光信號的傳遞路徑上。複合材料結構分別設置在彈性傳輸層的兩相對側。每一個複合材料結構包含二柔性層，且此些柔性層的熱膨脹係數不同。彈性傳輸層的兩相對側分別鄰近不同熱膨脹係數的柔性層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board assembly and a fabricating method of the same are provided. The circuit board includes two circuit boards, two photoelectric conversion elements, an elastic transmission layer and two composite material structures. Each of the circuit boards includes a wiring layer. The photoelectric conversion elements are mounted on the wiring layers. The elastic transmission layer is connected to the circuit boards. The elastic transmission layer includes a transmission channel that is used for optical signal transmission. The photoelectric conversion elements and the transmission channel are located on the transmission path of the optical signal. The composite material structures are respectively disposed on two opposite sides of the elastic transmission layer. Each of the composite material structures includes two flexible layers with different coefficients of thermal expansion. The two opposite sides of the elastic transmission layer are adjacent to the flexible layers with different coefficients of thermal expansion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板組件</p>  
        <p type="p">200,300:線路板</p>  
        <p type="p">211~214,311~314:線路層</p>  
        <p type="p">221~223,321~323:介電層</p>  
        <p type="p">231,232,331,332:覆蓋層</p>  
        <p type="p">250,340:凹槽</p>  
        <p type="p">410,420:光電轉換元件</p>  
        <p type="p">450,460:晶片</p>  
        <p type="p">510:彈性傳輸層</p>  
        <p type="p">511,512:連接區</p>  
        <p type="p">513:伸縮彎折區</p>  
        <p type="p">514,515:缺口</p>  
        <p type="p">516,517:斜面</p>  
        <p type="p">518:傳輸通道</p>  
        <p type="p">520,530:平整層</p>  
        <p type="p">540,550:反射層</p>  
        <p type="p">560,570:複合材料結構</p>  
        <p type="p">561,571:第一柔性層</p>  
        <p type="p">562,572:第二柔性層</p>  
        <p type="p">580,590:導電層</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="746" publication-number="202626123"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626123.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>普通輸血輸液器通用連接之安全控制器</chinese-title>  
        <english-title>SAFETY CONTROLLER FOR UNIVERSAL CONNECTION OF ORDINARY BLOOD TRANSFUSION SETS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250126B">A61M5/168</main-classification>  
        <further-classification edition="200601120250126B">A61M5/14</further-classification>  
        <further-classification edition="200601120250126B">A61M5/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪崧園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SONG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪崧園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SONG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江進傳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種普通輸血輸液器通用連接之安全控制器，其係由一上滴杯、下滴杯，以及一設於該下滴杯內的浮杯組成一安全控制器，該上滴杯上端凸設有一套管部，該套管部內緣形成中空的進液口，且該套管部的進液口內徑係大於該輸血輸液器下端凸設的外管部的外徑，令該安全控制器可利用該套管部直接與輸血輸液器的外管部套組結合，又該下滴杯上端的杯緣與上滴杯內緣之間可設一止擋件，該止擋件係位於該浮杯於該下滴杯內浮動的路徑上，用以限制該浮杯浮動的高度，令該浮杯更穩定、確實的阻隔該下滴杯內出液口的液體流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A safety controller universally connected to ordinary blood transfusion infusion sets. It is composed of an upper drip cup, a lower drip cup, and a floating cup located in the lower drip cup. A safety controller is formed on the upper end of the upper drip cup. There is a sleeve part, the inner edge of the sleeve part forms a hollow liquid inlet, and the inner diameter of the liquid inlet of the sleeve part is larger than the outer diameter of the outer tube part protruding from the lower end of the blood transfusion set, so that the safety controller can The sleeve part is directly combined with the outer tube part of the blood transfusion set, and a stopper can be set between the edge of the upper end of the lower drip cup and the inner edge of the upper drip cup. The stopper is located on the float. The cup floats on a path in the drip cup to limit the floating height of the float cup, making the float cup more stable and reliably blocking the flow of liquid from the liquid outlet in the drip cup.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(10):安全控制器</p>  
        <p type="p">(20):輸血輸液器</p>  
        <p type="p">(22):針管</p>  
        <p type="p">(23):外管部</p>  
        <p type="p">(24):注藥部</p>  
        <p type="p">(30):上滴杯</p>  
        <p type="p">(31):套管部</p>  
        <p type="p">(32):進液口</p>  
        <p type="p">(40):下滴杯</p>  
        <p type="p">(50):浮杯</p>  
        <p type="p">(51):翼片</p>  
        <p type="p">(60):止擋件</p>  
        <p type="p">(61):肋片</p>  
        <p type="p">(62):穿空部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="747" publication-number="202627777"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627777.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控板的單指觸控之控制方法</chinese-title>  
        <english-title>SINGLE-FINGER TOUCH CONTROL METHOD FOR A TOUCHPAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F3/041</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義隆電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊學偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HSUEH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡書慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳嘉敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種觸控板的單指觸控之控制方法，其係利用觸控板的力感應偵測功能，藉由判斷單指觸控時的下壓力是否連續超過第一及第二門檻值，並配合判斷超過第一及第二門檻值之時間，來發送足夠的連續按鍵下壓訊號及按鍵釋放訊號，以觸發雙擊功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a single-finger touch control method for a touchpad, utilizing the pressure-sensing detection function of the touchpad. By determining whether the pressure applied during single-finger touch continuously exceeds the first and second threshold values and considering the duration of time exceeding these thresholds, the system generates sufficient continuous key-click signals and key-release signals to trigger the double-click function.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S&lt;sub&gt;u&lt;/sub&gt;:按鍵下壓訊號</p>  
        <p type="p">S&lt;sub&gt;d&lt;/sub&gt;:按鍵釋放訊號</p>  
        <p type="p">T&lt;sub&gt;2&lt;/sub&gt;:時間差值</p>  
        <p type="p">T&lt;sub&gt;3&lt;/sub&gt;:時間差值</p>  
        <p type="p">TH&lt;sub&gt;1&lt;/sub&gt;:第一門檻值</p>  
        <p type="p">TH&lt;sub&gt;2&lt;/sub&gt;:第二門檻值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="748" publication-number="202626306"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626306.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人控制方法、機器人控制裝置、機器人及存儲介質</chinese-title>  
        <english-title>ROBOT CONTROL METHOD, ROBOT CONTROL DEVICE, ROBOT AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">B25J13/00</main-classification>  
        <further-classification edition="200601120250407B">B25J9/18</further-classification>  
        <further-classification edition="200601120250407B">B25J9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉揚偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YOUNG-WAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭錦斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧志德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIH-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊榮浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宗瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TSUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡瑜萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周育楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種機器人控制方法、機器人控制裝置、機器人及存儲介質，方法包括：基於所述機器人對應之預設資訊，確定所述機器人之運動狀態；若所述運動狀態為非平衡狀態，則確定所述平衡輔助元件對應之運動規劃；基於所述運動規劃，控制所述平衡輔助元件運動，使得所述機器人處於平衡狀態。利用本申請，能夠提高機器人之平衡效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application provides a robot control method, a robot control device, a robot, and a storage medium. The method includes: determining the motion state of the robot based on preset information corresponding to the robot; if the motion state is unbalanced, determining the motion plan corresponding to the balance assist component; based on the motion planning, controlling the motion of the balance assist component to ensure that the robot is in a balanced state. By utilizing the application, the balance effect of the robot can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11-S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="749" publication-number="202627103"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627103.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151386</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以固定化生產羥基乙酸的方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING GLYCOLIC ACID BY IMMOBILIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C12P1/04</main-classification>  
        <further-classification edition="200601120250501B">C12P7/42</further-classification>  
        <further-classification edition="200601120250501B">C12N9/02</further-classification>  
        <further-classification edition="200601120250501B">C12N15/63</further-classification>  
        <further-classification edition="200601120250501B">C12N15/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奕成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁梓桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, TZU-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡良榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, LIANG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種以固定化生產羥基乙酸的方法。以固定化生產羥基乙酸的方法包括提供改質菌株，所述改質菌株包括SEQ ID NO: 1、SEQ ID NO: 2及SEQ ID NO: 3的基因序列、製作聚乙烯醇菌粒，所述聚乙烯醇菌粒包含所述改質菌株；以及將碳源供應至所述聚乙烯醇菌粒，以利用所述改質菌株將所述碳源轉化為羥基乙酸。所述聚乙烯醇菌粒與輔助溶液混合，將所述碳源供應至所述聚乙烯醇菌粒的同時通入空氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for producing glycolic acid by immobilization. The method for producing glycolic acid by immobilization includes providing a modified strain, the modified strain includes the gene sequences of SEQ ID NO: 1, SEQ ID NO: 2 and SEQ ID NO: 3, and producing polyvinyl alcohol bacteria particles, said The polyvinyl alcohol bacteria pellet includes the modified strain; and a carbon source is supplied to the polyvinyl alcohol bacteria pellet to convert the carbon source into glycolic acid using the modified strain. The polyvinyl alcohol bacteria pellets are mixed with the auxiliary solution, and the carbon source is supplied to the polyvinyl alcohol bacteria pellets and air is introduced at the same time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100~S300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="750" publication-number="202626951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151392</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高耐寒性的聚酯可塑劑及包括其的聚氯乙烯組成物</chinese-title>  
        <english-title>POLYESTER PLASTICIZER HAVING HIGH COLD RESISTANCE AND POLYVINYL CHLORIDE COMPOSITION INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250614B">C08L67/02</main-classification>  
        <further-classification edition="200601120250614B">C08G63/16</further-classification>  
        <further-classification edition="200601120250614B">C08K5/10</further-classification>  
        <further-classification edition="200601120250614B">C08F2/44</further-classification>  
        <further-classification edition="200601320250614B">B29K227/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂雯華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳其霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種具有高耐寒性的聚酯可塑劑及包括其的聚氯乙烯組成物。本發明的聚酯可塑劑是通過二酸成分與二醇成分的酯化反應並經封端劑封端而獲得。其中所述二酸成分為癸二酸，所述二醇成分包括第一二醇組分及第二二醇組分，所述第一二醇組分為二乙二醇，且所述第二二醇組分為具有矽氧結構單元的二醇、具有直鏈結構的二醇或具有分支鏈結構的二醇。因此，本發明的聚酯可塑劑可應用於聚氯乙烯組成物，以改善PVC軟質製品的耐低溫和耐曲折性能以及吐油現象。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polyester plasticizer having high cold resistance and a polyvinyl chloride composition including the same are provided. The polyester plasticizer is obtained by an esterification reaction of a diacid component with a diol component and is capped with an end-capping agent. The diacid component sebacic acid. The diol component includes a first diol and a second diol. The first diol is diethylene glycol, and the second diol is a glycol having a silicon-oxygen structural unit, a linear chain structure, or a branched chain structure. The polyester plasticizer can be used in a polyvinyl chloride composition, so as to improve low temperature, bending, and oil extraction resistances of a resulting PVC soft product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:入料步驟</p>  
        <p type="p">S2:酯化反應步驟</p>  
        <p type="p">S3:封端反應步驟</p>  
        <p type="p">S4:減壓純化步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="751" publication-number="202627104"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627104.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151398</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將碳源轉化為羥基乙酸的方法</chinese-title>  
        <english-title>METHOD FOR CONVERTING CARBON SOURCE INTO GLYCOLIC ACID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C12P1/04</main-classification>  
        <further-classification edition="200601120250501B">C12P7/42</further-classification>  
        <further-classification edition="200601120250501B">C12N9/02</further-classification>  
        <further-classification edition="200601120250501B">C12N15/63</further-classification>  
        <further-classification edition="200601120250501B">C12N15/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奕成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁梓桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, TZU-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡良榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, LIANG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種將碳源轉化為羥基乙酸的方法。所述將碳源轉化為羥基乙酸的方法包括：提供一質體，所述質體包括SEQ ID NO: 1、SEQ ID NO: 2及SEQ ID NO: 3的基因序列；將所述質體轉殖至一菌株中以得到一改質菌株；以及對所述改質菌株提供所述碳源，以使所述改質菌株將所述碳源轉化為羥基乙酸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for converting carbon source into glycolic acid. The method for converting carbon source into glycolic acid includes: providing a plastid with gene sequences of SEQ ID NO: 1, SEQ ID NO: 2 and SEQ ID NO: 3; transforming the plastid into a bacterial cell to obtain a modified bacterial cell; and providing the carbon source to the modified bacterial cell so that the modified bacterial cell converts the carbon source into glycolic acid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="752" publication-number="202628375"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628375.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料壓縮方法、資料壓縮電路、資料解壓縮方法、資料解壓縮電路及資料處理系統</chinese-title>  
        <english-title>DATA COMPRESSION METHOD AND CIRCUIT, DATA DECOMPRESSION METHOD AND CIRCUIT, AND DATA PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H03M7/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天鈺科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FITIPOWER INTEGRATED TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李基德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHI-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝逸儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, YI-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳式倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料壓縮方法，用於一原始資料，該原始資料包含複數個字符。該資料壓縮方法包含：依序取得該原始資料之一字符包裹數量之一第一連續字符；比較該第一連續字符之每一字符是否相同以取得一比較結果；當該比較結果指示該第一連續字符均為相同的一重複字符時，產生一第一編碼格式之一封包，或當該比較結果指示該第一連續字符包含相異字符時，產生一第二編碼格式之該封包；以及輸出該封包；其中，該第一編碼格式之該封包與該第二編碼格式之該封包具有相同封包長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data compression method for an original data containing a plurality of characters is disclosed. The data compression method includes sequentially obtaining first consecutive characters from the original data, where the number of characters of the first consecutive characters is a character packing number; comparing each character of the first consecutive characters to obtain a comparison result; generating a packet in a first encoding format when the comparison result indicates that the first consecutive characters are repetitions of a repeated character, and generating the packet in a second encoding format when the comparison result indicates that the first consecutive characters comprises different characters; and outputting the packet; wherein the packet in the first encoding format and the packet in the second encoding format have the same length.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:第一編碼格式</p>  
        <p type="p">21_1:旗標資料</p>  
        <p type="p">21_2:重複字符資料</p>  
        <p type="p">21_3:重複次數資料</p>  
        <p type="p">22:第二編碼格式</p>  
        <p type="p">22_1:旗標資料</p>  
        <p type="p">22_2:字符資料</p>  
        <p type="p">22_3:填充資料</p>  
        <p type="p">
        &lt;i&gt;N&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;:旗標資料長度</p>  
        <p type="p">
        &lt;i&gt;N&lt;/i&gt;
        &lt;sub&gt;2&lt;/sub&gt;:字符資料長度</p>  
        <p type="p">
        &lt;i&gt;N&lt;/i&gt;
        &lt;sub&gt;3&lt;/sub&gt;:重複次數資料長度</p>  
        <p type="p">
        &lt;i&gt;N&lt;/i&gt;
        &lt;sub&gt;4&lt;/sub&gt;:填充資料長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="753" publication-number="202627241"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627241.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>維護基板及鍍覆裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C25D21/04</main-classification>  
        <further-classification edition="200601120260302B">C25D17/00</further-classification>  
        <further-classification edition="200601120260302B">C25D17/06</further-classification>  
        <further-classification edition="200601120260302B">C25D7/12</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山﨑岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASAKI, GAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">［課題］本發明係一邊抑制基板固持器的內部發生汙染一邊大範圍地清洗供電接點。&lt;br/&gt;［解決手段］用以清洗鍍覆裝置之供電接點的維護基板MWF包含：維護基板本體290；及清洗構件292，其配置於維護基板本體290的接觸區域243a，該接觸區域243a在將維護基板本體290夾持於具有供電接點之基板固持器時與供電接點接觸。清洗構件292係由可保持清洗液的彈性體形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">243a:接觸區域</p>  
        <p type="p">243W:接觸區域的寬度</p>  
        <p type="p">290:維護基板本體</p>  
        <p type="p">292:清洗構件</p>  
        <p type="p">292EG:清洗構件的外端</p>  
        <p type="p">292W:清洗構件的寬度</p>  
        <p type="p">294:外周區域</p>  
        <p type="p">MWF:維護基板</p>  
        <p type="p">WEG:維護基板本體的外端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="754" publication-number="202628786"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628786.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具物理不可複製功能之半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH PHYSICAL UNCLONABLE FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">H10N97/00</main-classification>  
        <further-classification edition="202601120260401B">H10W42/00</further-classification>  
        <further-classification edition="201301120260401B">G06F21/73</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉奇青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王炳琨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PING-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍順醴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, SHUN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林銘哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鶴軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, HE-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具物理不可複製功能之半導體裝置，包括：基底；物理不可複製功能(PUF)結構；以及邏輯電路，被配置為判斷PUF結構的邏輯值和運算邏輯值，以生成隨機亂數。PUF結構包含：第一導電層，位於基底上方；絕緣層，位於第一導電層上；第二導電層，位於絕緣層上；和導孔，貫穿絕緣層並連接第二導電層與第一導電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device with a physical unclonable function includes: a substrate; a physical unclonable function (PUF) structure; and a logic circuit configured to determine logic values of the PUF structure and operate the logic values to generate random numbers. The PUF structure includes: a first conductive layer over the substrate; an insulating layer on the first conductive layer; a second conductive layer on the insulating layer; and a conductive via penetrating the insulating layer and connecting the second conductive layer and the first conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底</p>  
        <p type="p">15,161,162:絕緣層</p>  
        <p type="p">20:PUF結構</p>  
        <p type="p">21:第一導電層</p>  
        <p type="p">23,231,232:第二導電層</p>  
        <p type="p">25,251,252:導孔</p>  
        <p type="p">25a,251a,252a:頂表面</p>  
        <p type="p">25b,251b,252b:底表面</p>  
        <p type="p">211:第一端部</p>  
        <p type="p">212:第二端部</p>  
        <p type="p">A1:第一晶粒區域</p>  
        <p type="p">A2:第二晶粒區域</p>  
        <p type="p">A&lt;sub&gt;LS&lt;/sub&gt;:切割線區域</p>  
        <p type="p">D:汲極</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">E1,E2:電子元件</p>  
        <p type="p">G:閘極</p>  
        <p type="p">GD:閘極介電層</p>  
        <p type="p">S:源極</p>  
        <p type="p">S&lt;sub&gt;IC&lt;/sub&gt;:內連線結構</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="755" publication-number="202626252"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626252.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樞擺式刀庫系統</chinese-title>  
        <english-title>PIVOTAL PENDULUM TOOL CHANGER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">B23Q3/155</main-classification>  
        <further-classification edition="200601120250114B">B23Q3/157</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡和勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露為一種樞擺式刀庫系統，其設置於一加工機，樞擺式刀庫系統包括一位於儲刀區之儲刀裝置及一位於換刀區之一換刀裝置。儲刀裝置具有至少一個置刀組件及一轉向模組，置刀組件樞擺連接於轉向模組，轉向模組能驅使置刀組件沿一XY平面進行樞擺，從而讓置刀組件於儲刀區的一第一位置與換刀區的一第二位置之間切換；當置刀組件位於第二位置時，換刀裝置能沿一X軸向驅使置刀組件移動於第二位置與換刀區的一換刀位置之間切換，讓主軸得由置刀組件取下或還回刀具；另本揭露進一步包含一旋轉裝置可使置刀組件的一支架旋轉進而使刀具符合主軸的換刀方向；藉此，以達多方向換刀，增加更換刀具之效率，並且存放多組刀具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pivotal pendulum tool changer system, which comprises a tool storage device and a tool change device . The tool storage device has at least one tool setting assembly and a steering module, the tool setting assembly is connected to the steering module, and the steering module can drive the tool setting assembly to pivot along an XY plane, so that the tool setting assembly can switch between the first position and the second positions ; When the tool setting assembly is located in the second position, the tool change device can drive the tool setting assembly to move along an X-axis to switch between the second position and the first tool change position , so that the spindle can be removed or returned by the tool setting assembly; Thus , the tool can be changed in multiple directions, the efficiency of tool change can be increased, and multiple sets of tools can be stored.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:樞擺式刀庫系統</p>  
        <p type="p">1:加工機</p>  
        <p type="p">2:刀具</p>  
        <p type="p">1a:主軸</p>  
        <p type="p">1b:工作平台</p>  
        <p type="p">10:儲刀裝置</p>  
        <p type="p">11:置刀組件</p>  
        <p type="p">111:換向齒輪</p>  
        <p type="p">112:支架</p>  
        <p type="p">113:刀夾座</p>  
        <p type="p">114:導引軌</p>  
        <p type="p">12:轉向模組</p>  
        <p type="p">121:第一動力單元</p>  
        <p type="p">122:驅動齒輪</p>  
        <p type="p">13:升降模組</p>  
        <p type="p">131:第二動力單元</p>  
        <p type="p">132:升降座</p>  
        <p type="p">20:換刀裝置</p>  
        <p type="p">21:推移模組</p>  
        <p type="p">22:上下模組</p>  
        <p type="p">30:旋轉裝置</p>  
        <p type="p">C:換刀區</p>  
        <p type="p">E1:第一端</p>  
        <p type="p">E2:第二端</p>  
        <p type="p">P1:第一位置</p>  
        <p type="p">P2:第二位置</p>  
        <p type="p">S:儲刀區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="756" publication-number="202628668"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628668.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D84/83</main-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202501120260302B">H10D62/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊閔媞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MIN-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪慶文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先形成一閘極結構於一基底上，然後形成一第一源極電極於該閘極結構一側，形成一第二源極電極於該閘極結構另一側，形成一第一接觸插塞於該第一源極電極上，形成一第二接觸插塞於該第二源極電極上，形成一場極板於該第一接觸插塞以及該第二接觸插塞上，再形成一汲極電極於該基底背面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a semiconductor device includes the steps of first forming a gate structure on a substrate, forming a first source electrode adjacent to one side of the gate structure, forming a second source electrode adjacent to another side of the gate structure, forming a first contact plug on the first source electrode, forming a second contact plug on the second source electrode, forming a field plate on the first contact plug and the second contact plug, and forming a drain electrode on a backside of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基底</p>  
        <p type="p">14:飄移區</p>  
        <p type="p">16:第一井區</p>  
        <p type="p">18:第二井區</p>  
        <p type="p">20:第一摻雜區</p>  
        <p type="p">22:第二摻雜區</p>  
        <p type="p">24:第三摻雜區</p>  
        <p type="p">26:第四摻雜區</p>  
        <p type="p">28:閘極介電層</p>  
        <p type="p">30:閘極結構</p>  
        <p type="p">32:閘極結構</p>  
        <p type="p">34:第一源極電極</p>  
        <p type="p">36:第二源極電極</p>  
        <p type="p">38:介電層</p>  
        <p type="p">40:層間介電層</p>  
        <p type="p">42:第一接觸插塞</p>  
        <p type="p">44:第二接觸插塞</p>  
        <p type="p">46:第三接觸插塞</p>  
        <p type="p">48:場極板</p>  
        <p type="p">50:金屬間介電層</p>  
        <p type="p">52:汲極電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="757" publication-number="202627856"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627856.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>側通道攻擊防止裝置、方法與使用其的電子裝置</chinese-title>  
        <english-title>SIDE CHANNEL ATTACK PREVENTING APPARATUS, METHOD AND ELECTRONIC APPARATUS USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">G06F21/70</main-classification>  
        <further-classification edition="201301120250401B">G06F21/71</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張恒愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HEN KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種側通道攻擊防止裝置，係設置於電子裝置或測試裝置中，且具有控制器與機器學習模組。在電子裝置的機敏資料處理裝置與/或加解密裝置運行時，控制器使用電源波形調整方式改變電子裝置的電源波形。機器學習模組電性連接控制器，在電子裝置的加解密裝置與/機敏資料處理裝置運行時，獲取電源波形，並且使用經訓練的機器學習模型判讀電源波形具有特定特徵的可信度。電源波形調整方式為控制器自複數個電源波形調整方式之先前未被選取者中所選取的一者，且於可信度大於等於門檻值時，控制器重新自複數個電源波形調整方式之先前未被選取者中選取一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A side channel attack prevention apparatus used in an electronic device or a testing device has a controller and a machine learning module. When a secure data processing device and/or an encryption/decryption device of the electronic device is running, the controller uses a power waveform adjustment manner to change a power waveform of the electronic device. The machine learning module is electrically connected to the controller, acquires the power waveform when the encryption/decryption device and/or the secure data processing device of the electronic device is running, and uses a trained machine learning model to determine credibility of the power waveform having at least a specific characteristic. The power waveform adjustment manner is one selected by the controller from previously unselected ones among a plurality of power waveform adjustment manners, and when the credibility is greater than or equal to a threshold value, the controller reselects one from the previously unselected ones among a plurality of power waveform adjustment manners</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:機器學習模組</p>  
        <p type="p">102:控制器</p>  
        <p type="p">103:加解密裝置</p>  
        <p type="p">104:機敏資料處理裝置</p>  
        <p type="p">105~107:硬體裝置</p>  
        <p type="p">108:電源轉換裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="758" publication-number="202627731"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627731.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電流源電路和產生零溫度係數電流的方法</chinese-title>  
        <english-title>CURRENT SOURCE CIRCUIT AND METHOD FOR GENERATING ZERO TEMPERATURE COEFFICIENT CURRENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G05F3/30</main-classification>  
        <further-classification edition="200601120250501B">G05F3/26</further-classification>  
        <further-classification edition="200601120250501B">G05F3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勝瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電流源電路，包括電流鏡、偏壓電阻、第一電晶體、第二電晶體以及第一電流源。電流鏡耦接在供應電壓端、第一節點以及第二節點之間，且被配置以將第一電流和第二電流分別輸出至第一節點和第二節點。偏壓電阻耦接在第一節點和第三節點之間，以根據第一節點和第三節點的電壓差控制第一電流。第一電晶體耦接在第三節點和參考電壓端之間。第二電晶體耦接在第二節點和參考電壓端之間。第一電流源被配置以將第三電流輸出至第二節點以產生第四電流。其中，第三電流具有負溫度係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A current source circuit including a current mirror, a bias resistor, a first transistor, a second transistor and a first current source is provided. The current mirror is coupled between a supply voltage terminal, a first node, and a second node and outputs a first current and a second current to the first node and the second node respectively. The bias resistor is coupled between the first node and a third node and controls the first current according to a voltage difference between the first node and the third node. The first transistor is coupled between the third node and a reference voltage terminal. The second transistor is connected between the second node and the reference voltage terminal. The first current source outputs a third current to the second node to generate a fourth current. The third current has negative temperature coefficient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電流源電路</p>  
        <p type="p">110:電流鏡</p>  
        <p type="p">115:運算放大器</p>  
        <p type="p">120:偏壓電阻</p>  
        <p type="p">M1,M2,Q1,Q2:電晶體</p>  
        <p type="p">N1,N2,N3:節點</p>  
        <p type="p">I0,I1,I2,I3,I4,I5:電流</p>  
        <p type="p">IS1,IS2:電流源</p>  
        <p type="p">VDD:供應電壓端</p>  
        <p type="p">VSS:參考電壓端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="759" publication-number="202626249"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626249.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>夾持力感測裝置</chinese-title>  
        <english-title>CLAMPING FORCE SENSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">B23Q3/06</main-classification>  
        <further-classification edition="200601120250324B">B23Q7/04</further-classification>  
        <further-classification edition="200601120250324B">B23Q15/06</further-classification>  
        <further-classification edition="200601120250324B">B23Q17/09</further-classification>  
        <further-classification edition="200601120250324B">G01L1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張詠翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉哲愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHE-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉建南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHIEN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃肇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種夾持力感測裝置，其包括本體、多個應變感測器及多個夾頭。本體具有二個第一貫通孔、一第二貫通孔及外周側面。第一貫通孔及第二貫通孔沿平行於旋轉軸的軸向貫穿本體，使得旋轉軸通過本體之質心及外周側面之形心。第二貫通孔的內表面由第一內表面及第二內表面接合而成。第一內表面較第二內表面接近第一貫通孔。各第一貫通孔沿軸向的第一投影面積小於第二貫通孔沿軸向的第二投影面積。應變感測器設置於本體。一應變感測器位於一第一貫通孔與第一內表面之間。另一應變感測器位於另一第一貫通孔與第一內表面之間。夾頭固定於本體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A clamping force sensing apparatus includes a body, a plurality of strain sensors and a plurality of chucks. The body has two first through holes, a second through hole and a peripheral surface. The first through holes and the second through hole penetrate the body along an axial direction parallel to a rotation axis, so that the rotation axis passes through a mass center of the body and a shape center of the peripheral surface. An inner surface of the second through hole is formed by a first inner surface and a second inner surface. The first inner surface is closer to the first through holes than the second inner surface. Along the axial direction, a first projecting area of each of the first through holes is smaller than a second projecting area of the second through hole. The strain sensors are installed on the body. One of the strain sensors is located between one of the first through holes and the first inner surface. Another of the strain sensors is located between the other of the first through holes and the first inner surface. The chucks are fixed to the body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:夾持力感測裝置</p>  
        <p type="p">11:本體</p>  
        <p type="p">11s1:上表面</p>  
        <p type="p">11s2:下表面</p>  
        <p type="p">121,122:應變感測器</p>  
        <p type="p">131,133,134:夾頭</p>  
        <p type="p">14:電路單元</p>  
        <p type="p">15:電路容置件</p>  
        <p type="p">15a:容置槽</p>  
        <p type="p">16:電源</p>  
        <p type="p">17:開關</p>  
        <p type="p">18:面板</p>  
        <p type="p">19:背板</p>  
        <p type="p">101:第一固定件</p>  
        <p type="p">102:第二固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="760" publication-number="202627823"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627823.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>介面控制器、介面控制方法與電子裝置</chinese-title>  
        <english-title>INTERFACE CONTROLLER, INTERFACE CONTROLLING METHOD AND ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">G06F13/14</main-classification>  
        <further-classification edition="200601120250526B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種介面控制器，電性連接於資料儲存裝置與匯流排系統之間。介面控制器可自資料儲存裝置讀取與緩存資料區塊的第一資料或與資料區塊關聯的關聯資料區塊的第二資料，並用於將緩存的第一資料或第二資料送至匯流排系統。介面控制器更用於使用預測模型預測資料區塊是否與複數個其他資料區塊的其中一者有關聯，其中若資料區塊與複數個其他資料區塊的其中一者有關聯，且資料區塊之全部的第一資料被介面控制器讀取完畢 ，則介面控制器自資料儲存裝置讀取關聯資料區塊的第二資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An interface controller is electrically connected between a data storage device and a bus system. The interface controller can read and buffer a first data of a data block or a second data of a related data block which is related to the data block, from the data storage device, and be used to transmit the buffered first data or second data to the bus system. The interface controller is further used to use a prediction model to predict whether the data block is related to one of a plurality of other data blocks. If the data block is related to one of the other data blocks, and all of the plurality of the first data of the data block have been read by the interface controller, the interface controller will read the second data of the related data block from the data storage device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:資料儲存裝置</p>  
        <p type="p">12:介面控制器</p>  
        <p type="p">13:匯流排系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="761" publication-number="202626410"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626410.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於車輛駕駛的示警方法及示警系統</chinese-title>  
        <english-title>WARNING METHOD AND WARNING SYSTEM FOR VEHICLE DRIVING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250424B">B60W40/02</main-classification>  
        <further-classification edition="201201120250424B">B60W40/09</further-classification>  
        <further-classification edition="200601120250424B">G08B21/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衡上鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENG, SHANG JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIH HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳芊樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周顥恭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HAO GONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於車輛駕駛的示警方法及示警系統。取得車輛資訊。將車輛資訊轉換成一或多個車輛特徵。決定車輛特徵對應的統計值。依據統計值產生警示資訊。車輛資訊是透過偵測車輛周遭的鄰車所得到的。車輛特徵代表車輛與鄰車的相對關係。統計值是反應於車輛特徵符合對應的危險條件而累計。警示資訊用於提示車輛與鄰車的相對關係。藉此，可提升駕駛安全。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A warning method and a warning system for vehicle driving are provided. Vehicle information is obtained. Vehicle information is converted into one or more vehicle characteristics. The statistical values corresponding to vehicle characteristics are determined. Alert information is generated based on the statistical values. The vehicle information is obtained by detecting neighboring vehicles around the vehicle. The vehicle characteristics represent the relative relationship between the vehicle and neighboring vehicles. The statistical values are accumulated in response to vehicle characteristics meeting corresponding hazard conditions. The warning information is used to indicate the relative relationship between the vehicle and neighboring vehicles. Therefore, the driving safety could be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="762" publication-number="202628626"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628626.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250314B">H10D30/60</main-classification>  
        <further-classification edition="202501120250314B">H10D62/60</further-classification>  
        <further-classification edition="202501120250314B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏志泓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳華茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUA-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體元件，此半導體元件包括:半導體基板；N型飄移層、P-通道層與N+層依序堆疊於半導體基板上；溝槽式閘極，位於N+層、P-通道層與N型飄移層中；P型超寬能隙磊晶層，位於溝槽式閘極的下方；以及閘極絕緣層，包圍溝槽式閘極的底部與側壁，且介於溝槽式閘極與P型超寬能隙磊晶層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device is provided. The semiconductor device includes a semiconductor substrate; N-type drift layer, P-channel layer and N+ layer sequentially stacked on the semiconductor substrate; trench gate in the N+ layer, the P-channel layer and the N-type drift layer; a P-type ultra-wide energy gap epitaxial layer below the trench gate; and the gate insulating layer surrounds a bottom and side walls of the trench gate, and between the trench gate and the P-type ultra-wide energy gap epitaxial layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體元件</p>  
        <p type="p">100:半導體基板</p>  
        <p type="p">200:N型飄移層</p>  
        <p type="p">300:P-通道層</p>  
        <p type="p">400:N+層</p>  
        <p type="p">500:P型超寬能隙磊晶層</p>  
        <p type="p">BG、BT:底部</p>  
        <p type="p">D:深度</p>  
        <p type="p">G:溝槽式閘極</p>  
        <p type="p">GOX:閘極絕緣層</p>  
        <p type="p">OX:氧化層</p>  
        <p type="p">SG、ST:側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="763" publication-number="202627251"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627251.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合纖維的製備方法、複合纖維以及農業用複合纖維網</chinese-title>  
        <english-title>PREPARATION METHOD OF COMPOSITE FIBER, COMPOSITE FIBER AND COMPOSITE FIBER MESH FOR AGRICULTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">D01F9/08</main-classification>  
        <further-classification edition="200601120250328B">D01F1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泳彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUNG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仕欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉佩宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭怡君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種複合纖維的製備方法。複合纖維的製備方法包括：提供經摻雜的氧化鋅，且對其進行研磨以形成經研磨的摻雜氧化鋅；將經研磨的摻雜氧化鋅與表面改質劑進行反應，以形成經表面改質的摻雜氧化鋅分散液；提供經摻雜的氧化鎢，對其進行研磨以形成經研磨的摻雜氧化鎢，且將經研磨的摻雜氧化鎢與經表面改質的摻雜氧化鋅分散液混合，以形成無機粉體分散液；對無機粉體分散液進行噴霧乾燥處理，以形成無機粉體；將無機粉體分散於聚合物中，以形成複合纖維組成物；將複合纖維組成物進行紡絲製程，以獲得複合纖維。本發明另提供一種複合纖維以及農業用複合纖維網。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A preparation method of a composite fiber is provided. The preparation method of a composite fiber includes: providing a doped zinc oxide and grinding it to form a ground doped zinc oxide; reacting the ground doped zinc oxide with a surface modifier agent to form a surface modified doped zinc oxide dispersion; providing a doped tungsten oxide and grinding it to form a ground doped tungsten oxide, and then mixing it with the surface modified doped zinc oxide dispersion to form an inorganic powder dispersion; performing a spray dry process on the inorganic powder dispersion to form an inorganic powder; dispersing the inorganic powder in a polymer to form a composite fiber composition; and subjecting the composite fiber composition to a spinning process to obtain a composite fiber. A composite fiber and a composite fiber mesh for agriculture are also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="764" publication-number="202628122"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628122.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>個人化衛教提供系統與方法</chinese-title>  
        <english-title>PERSONALIZED HEALTH EDUCATION PROVISION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250401B">G16H20/00</main-classification>  
        <further-classification edition="200601120250401B">G09B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昶億</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎和欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HO-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪上智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, SHANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露透過個人化衛教提供系統與方法，可在病患需要衛教服務時提供適合病患的個人化衛教資訊。如此一來，可避免醫護人員提供的衛教內容太過廣泛而不適用於個人外，還可避免病患無法接收醫護人員講述太過專業的詞彙而導致衛教效果不彰。透過本揭露透過個人化衛教提供系統與方法，病患可在適當的時機取得適合於自身的衛教資訊，以達到更好的衛教效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides personalized health education provision system and method to help patients provide personalized health education information suitable for patients when they need health education services. In this way, it can be avoided that the health education content provided by medical staff is too broad and not applicable to individuals, and it can also prevent patients from being unable to accept the overly professional vocabulary explained by medical staff, resulting in ineffective health education. Through personalized health education provision system and method, patients can obtain health education information suitable for themselves at the appropriate time to achieve better health education results.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:個人化衛教提供系統</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:儲存器</p>  
        <p type="p">121:查詢模組</p>  
        <p type="p">130:收發器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="765" publication-number="202627762"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627762.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>校正追蹤資訊的方法及追蹤系統</chinese-title>  
        <english-title>METHOD AND TRACKING SYSTEM FOR CORRECTING TRACKING INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F3/01</main-classification>  
        <further-classification edition="201101120250401B">G06T19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文杉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶聖輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, SHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供一種校正追蹤資訊的方法及追蹤系統。所述方法包括：在追蹤資訊校正程序中，由主機取得主機在第一時間區間內收集的多個主機關鍵幀；由追蹤器取得追蹤器在第一時間區間內收集的多個追蹤器關鍵幀及多個追蹤器地圖點；以及由主機或追蹤器至少基於多個主機關鍵幀校正多個追蹤器關鍵幀及多個追蹤器地圖點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of the disclosure provides a method and tracking system for correcting tracking information. The method includes: during a tracking information correction process, obtaining, by a host, a plurality of host keyframes collected by the host within a first time interval; obtaining, by a tracker, a plurality of tracker keyframes and a plurality of tracker map points collected by the tracker within the first time interval; and correcting, by the host or tracker, the plurality of tracker keyframes and the plurality of tracker map points at least based on the plurality of host keyframes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S610~S630:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="766" publication-number="202627743"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627743.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置與包含其的顯示卡模組</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE AND GRAPHICS CARD MODULE HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250508B">G06F1/20</main-classification>  
        <further-classification edition="200601120250508B">F28F3/12</further-classification>  
        <further-classification edition="200601120250508B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃順治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛黛娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, TAI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭春亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱裝置包含一均溫板件以及一延伸導熱板件。均溫板件具有一熱接觸面。延伸導熱板件連接於均溫板件並朝遠離均溫板件的方向延伸，且延伸導熱板件具有一鏤空結構。其中，至少部分延伸導熱板件的延伸方向與熱接觸面夾一銳角。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device includes a vapor chamber component and an extended thermal plate component. The vapor chamber component has a thermal contact surface. The extended thermal plate component is connected to the vapor chamber component and extends in a direction away from the vapor chamber component, and the extended thermal plate component has a hollow structure. In addition, at least a portion of the extended thermal plate component extends at an acute angle relative to the thermal contact surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:均溫板件</p>  
        <p type="p">20:延伸導熱板件</p>  
        <p type="p">210:導熱板體</p>  
        <p type="p">220:連通管</p>  
        <p type="p">H1:鏤空結構</p>  
        <p type="p">S2:散熱面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="767" publication-number="202626204"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626204.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸水性樹脂及其製造方法</chinese-title>  
        <english-title>SUPERABSORBENT POLYMERS AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250206B">B02C18/30</main-classification>  
        <further-classification edition="200601120250206B">C08F2/10</further-classification>  
        <further-classification edition="200601120250206B">C08F2/44</further-classification>  
        <further-classification edition="200601120250206B">C08J3/24</further-classification>  
        <further-classification edition="200601120250206B">C08L101/14</further-classification>  
        <further-classification edition="200601120250206B">B01J20/28</further-classification>  
        <further-classification edition="200601120250206B">B01J20/30</further-classification>  
        <further-classification edition="200601120250206B">C08L33/02</further-classification>  
        <further-classification edition="200601120250206B">C09K5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMOSA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雅琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種吸水性樹脂及其製造方法。此方法包含對吸水性樹脂組成物進行自由基聚合反應，以獲得凝膠體，其中吸水性樹脂組成物包含不飽和單體水溶液、聚合反應引發劑及自由基聚合反應交聯劑。此方法還包含利用絞碎機剪切凝膠體，以獲得多個吸水性樹脂顆粒，其中絞碎機絞碎機的出料口包含刀片及孔盤，該刀片之截面為平行四邊形，且孔盤包含多個孔洞。方法還包含對吸水性樹脂顆粒進行表面交聯反應，以獲得吸水性樹脂。藉此，可提升所製得之吸水性樹脂的表面孔隙率、吸收速度及液體傳導性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A superabsorbent polymers and a method of forming the same are provided. The method includes performing a free radical polymerization reaction to a superabsorbent polymer component to obtain a colloid gel. The colloid gel is cut by using a pulverizer to obtain superabsorbent polymer particles. An outlet of the pulverizer has a special blade and a perforated plate, in which a section of the blade is a parallelogram, and the perforated plate has several holes. The method further includes performing a surface cross-linking reaction on the superabsorbent polymer particles to obtain the superabsorbent polymer. Therefore, a surface porosity, an absorption rate and a liquid permeability of the obtained superabsorbent polymer can be increased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110,120,130:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="768" publication-number="202627752"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627752.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提高能源使用效率的系統與方法</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR IMPROVING POWER USING EFFICIENCY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F1/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴威甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEI FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的較佳實施例關於一種提高能源使用效率的系統與方法，此方法包括：週期性地根據多數個週邊單元的負載狀態，將對應的一負載資料提供給一類神經網路單元；根據該負載資料，該類神經網路單元運算出電源運作預測分數；根據該類神經網路單元所提供的該電源運作預測分數，決定一運作模式，控制該些週邊單元的啟動與關閉；以及根據該運作模式，調整一時脈速率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The preferred embodiment of the present invention describes a method and system for improving power using efficiency. The method includes: periodically providing corresponding load data to a neural network unit based on the load states of multiple peripheral units; calculating a power operation prediction score by the neural network unit based on the load data; determining an operation mode based on the power operation prediction score provided by the neural network unit, and controlling the activation and deactivation of the peripheral units; adjusting a clock rate according to the operation mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S407:本發明一較佳實施例的提高能源使用效率的方法之流程步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="769" publication-number="202626131"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626131.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於刺激人眼細胞提升專注度的LED發光裝置</chinese-title>  
        <english-title>LED LIGHT EMITTING DEVICE FOR ENHANCING HUMAN EYES FOCUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">A61M21/02</main-classification>  
        <further-classification edition="202501120250418B">H10H20/851</further-classification>  
        <further-classification edition="200601120250418B">C09K11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾笛森光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDISON OPTO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊凱竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, KAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸元祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YUAN-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於刺激人眼細胞提升專注度的LED發光裝置包括導線架、發光二極體組件與混合式螢光體。導線架具有牆體，牆體圍繞出開口。發光二極體組件位於導線架上，且位於牆體圍繞的開口中。混合式螢光體位於牆體圍繞的開口中且覆蓋發光二極體組件。發光二極體組件與混合式螢光體的組合配置以在480nm至490nm的波長範圍中形成相對光譜的第一峰值強度，且配置以發出相對於日光對黑視素細胞的刺激比在0.55至1.04的範圍中的光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An LED light emitting device for enhancing human eyes focus includes a lead frame, a light emitting diode assembly, and a mixed phosphor body. The lead frame has a wall body surrounding to form an opening. The light emitting diode assembly is located on the lead frame and in the opening surrounded by the wall body. The light emitting diode assembly is located in the opening surrounded by the wall body and covers the light emitting diode assembly. The combination of the light emitting diode assembly and the mixed phosphor body is configured to form a first peak intensity of a relative spectrum in a wavelength range from 480 nm to 490 nm, and is configured to emit light with a melanopic daylight efficacy ratio (DER) in a range from 0.55 to 1.04.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:LED發光裝置</p>  
        <p type="p">110:導線架</p>  
        <p type="p">112:牆體</p>  
        <p type="p">114:電極</p>  
        <p type="p">120:發光二極體組件</p>  
        <p type="p">122:第一發光二極體</p>  
        <p type="p">124:第二發光二極體</p>  
        <p type="p">130:混合式螢光體</p>  
        <p type="p">132:第一螢光粉</p>  
        <p type="p">134:第二螢光粉</p>  
        <p type="p">136:第三螢光粉</p>  
        <p type="p">138:第四螢光粉</p>  
        <p type="p">O:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="770" publication-number="202627851"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627851.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151462</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>惡意軟體檢測裝置、方法與使用其的電子裝置</chinese-title>  
        <english-title>MALWARE DETECTION APPARATUS, METHOD AND ELECTRONIC APPARATUS USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250401B">G06F21/56</main-classification>  
        <further-classification edition="200601120250401B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZONG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種惡意軟體檢測裝置，惡意軟體檢測裝置包括處理器以及加速處理器，其中加速處理器電性連接處理器。處理器可運行於第一模式或第二模式中，其中第一模式的第一權限高於第二模式的第二權限。加速處理器被第一模式下的處理器觸發，以自非信任區塊讀取代碼區塊，使用判讀模型根據代碼區塊判讀代碼區塊對應的程式軟體是否為惡意軟體，並產生判讀結果給處理器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A malware detection device is disclosed. The malware detection device includes a processor and an acceleration processor, wherein the acceleration processor is electrically connected to the processor. The processor can operate in a first mode or a second mode, wherein a first authority of the first mode is higher than a second authority of the second mode. The acceleration processor is triggered by the processor operated in the first mode to read a code block from an untrusted memory block, use a classification model to determine whether a program software corresponding to the code block is a malware based on the code block, and generate an interpretation result to the processor accordingly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:處理器</p>  
        <p type="p">102:加速處理器</p>  
        <p type="p">103、104:記憶單元</p>  
        <p type="p">105、106:儲存單元</p>  
        <p type="p">107:界面控制器</p>  
        <p type="p">M1:第一模式</p>  
        <p type="p">M2:第二模式</p>  
        <p type="p">R1:高全線區域</p>  
        <p type="p">R2:低權限區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="771" publication-number="202628290"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628290.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>面射型雷射裝置及其製造方法</chinese-title>  
        <english-title>SURFACE EMITTING LASER DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250204B">H01S5/0225</main-classification>  
        <further-classification edition="200601120250204B">H01S5/042</further-classification>  
        <further-classification edition="200601120250204B">H01S5/065</further-classification>  
        <further-classification edition="200601120250204B">H01S5/125</further-classification>  
        <further-classification edition="200601120250204B">H01S5/183</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪瑜亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, YU-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭浩中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HAO-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤信介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HSIN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉惠慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, HUI-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種面射型雷射裝置，包括一第一型分布式布拉格反射層、一活性層、一第二型分布式布拉格反射層及一氧化層。活性層配置於第一型分布式布拉格反射層上，第二型分布式布拉格反射層配置於活性層上。氧化層配置於第二型分布式布拉格反射層靠近活性層的一側，氧化層具有一開口，活性層發出的光通過開口。第二型分布式布拉格反射層內具有多個孔洞，這些孔洞位於開口的上方，且位於活性層發出的光的出光路徑上。一種面射型雷射裝置的製造方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface emitting laser device including a first type distributed Bragg reflective layer, an active layer, a second type distributed Bragg reflective layer, and an oxide layer is provided. The active layer is disposed on the first type distributed Bragg reflective layer. The second type distributed Bragg reflective layer is disposed on the active layer. The oxide layer is disposed at a side of the second type distributed Bragg reflective layer adjacent to the active layer. The oxide layer has an opening, and light emitted by the active layer passes through the opening. The second type distributed Bragg reflective layer has a plurality of holes therein. The holes are located above the opening and on a light path of the light emitted by the active layer. A manufacturing method of a surface emitting laser device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:面射型雷射裝置</p>  
        <p type="p">110:第一型分布式布拉格反射層</p>  
        <p type="p">120:活性層</p>  
        <p type="p">122:雷射光</p>  
        <p type="p">130:第二型分布式布拉格反射層</p>  
        <p type="p">131:開口</p>  
        <p type="p">132、134:氧化層</p>  
        <p type="p">140:上電極</p>  
        <p type="p">150:下電極</p>  
        <p type="p">160:保護層</p>  
        <p type="p">170:基板</p>  
        <p type="p">D1:直徑</p>  
        <p type="p">H:孔洞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="772" publication-number="202625976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生理訊號之處理方法及裝置及使用其之電刺激治療系統</chinese-title>  
        <english-title>METHOD AND DEVICE FOR PROCESSING A PHYSIOLOGICAL SIGNAL AND ELECTRICAL STIMULATION THERAPY SYSTEM USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250122B">A61B5/308</main-classification>  
        <further-classification edition="200601120250122B">A61N1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王怡珺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生理訊號之處理方法，包括下列步驟。以一標準生理訊號作為一第一模板，對一待測主體之一原始生理訊號進行一第一匹配濾波，以得到一第一濾波後生理訊號。對第一濾波後生理訊號進行相關性評估，並基於評估結果判斷干擾是否被充分消除。當判斷出干擾並未被充分消除時，以待測主體之一自身生理訊號作為一第二模板，對第一濾波後生理訊號進行一第二匹配濾波，以得到一第二濾波後生理訊號。根據第二濾波後生理訊號，得到待測主體之一生理參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing a physiological signal includes the following steps. By using a standard physiological signal as a first template, a first match filtering procedure is performed on an original physiological signal of a subject to be measured to obtain a first filtered physiological signal. Correlation evaluation is performed on the first filtered physiological signal, and based on the evaluation result, it is determined whether the interference has been sufficiently eliminated. When it is determined that the interference has not been sufficiently eliminated, a second match filtering procedure is performed on the first filtered physiological signal by using a subject's own physiological signals as a second template to obtain a second filtered physiological signal. According to the second filtered physiological signal, a physiological parameter of the subject to be measured is obtained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102~108:流程步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="773" publication-number="202627269"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627269.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>洩壓式防水工程的施工方法及施工結構</chinese-title>  
        <english-title>CONSTRUCTION METHOD AND STRUCTURE FOR PRESSURE RELIEF TYPE WATERPROOFING WORKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250310B">E02D31/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慶泰樹脂化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHING-TAI RESINS CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡朝嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHAO-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉明昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種洩壓式防水工程的施工結構適於設置在一物體的施工面，該施工面設有一落水孔，該施工結構包含：至少一洩壓端管，設置在該施工面的一溝槽網路中且將該溝槽網路連通至該落水孔；一溝槽封層，設置在該槽網路上，以遮蔽該溝槽網路，且該溝槽封層與該溝槽網路的槽底面相隔開；以及一防水層，設置在該施工面和該溝槽封層的封層頂面。藉此，可確保防水品質、延長防水時效並避免施作材料膨鼓凸起，同時增進施工效率及節省刨除舊覆蓋層和清運廢棄物的成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A construction structure for pressure relief type waterproofing works is suitably done onto a work surface of an object with a drain hole, and includes: at least one pressure relieving pipe disposed in a groove net and connecting the groove net to the drain hole; a covering layer disposed at the groove net to hide the groove net, and the bottom of the covering layer spaced from the bottom surface of the groove net; and a waterproofing layer disposed on the work surface of the object and the top of the covering layer. Therefore, it is possible to ensure waterproof quality, extend waterproof ageing, prevent the waterproof construction from generating bulges, enhance the construction efficiency, and save the costs of skimming old construction and clearing and transporting wastes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:物體</p>  
        <p type="p">11:施工面</p>  
        <p type="p">12:落水孔</p>  
        <p type="p">13:槽底面</p>  
        <p type="p">14:洩壓溝槽</p>  
        <p type="p">20:地漏裝置</p>  
        <p type="p">30:排水管</p>  
        <p type="p">40:洩壓端管</p>  
        <p type="p">50:溝槽封層</p>  
        <p type="p">51:封層底面</p>  
        <p type="p">52:封層頂面</p>  
        <p type="p">60:防水層</p>  
        <p type="p">S:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="774" publication-number="202626132"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626132.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於緩解緊張情緒的LED發光裝置</chinese-title>  
        <english-title>LED LIGHT EMITTING DEVICE FOR REDUCING ANXIETY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">A61M21/02</main-classification>  
        <further-classification edition="202501120250418B">H10H20/851</further-classification>  
        <further-classification edition="200601120250418B">C09K11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾笛森光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDISON OPTO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊凱竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, KAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸元祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YUAN-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於緩解緊張情緒的LED發光裝置包括第一導線架、第一發光二極體組件、第一混合式螢光體、第二導線架、第二發光二極體組件與第二混合式螢光體。第一發光二極體組件與第一混合式螢光體的組合配置以發出相對於日光對黑視素細胞的刺激比在0.8至0.9的範圍中的第一光線。第二發光二極體組件與第二混合式螢光體的組合配置以發出相對於日光對黑視素細胞的刺激比在0.15至0.25的範圍中的第二光線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An LED light emitting device for reducing anxiety includes a first lead frame, a first light emitting diode assembly, a first mixed phosphor body, a second lead frame, a second light emitting diode assembly, and a second mixed phosphor body. The combination of the first light emitting diode assembly and the first mixed phosphor body is configured emit a first light with a melanopic daylight efficacy ratio (DER) in a range from 0.8 to 0.9. The combination of the second light emitting diode assembly and the second mixed phosphor body is configured emit a second light with a melanopic daylight efficacy ratio (DER) in a range from 0.15 to 0.25.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:LED發光裝置</p>  
        <p type="p">106:控制器</p>  
        <p type="p">110:第一導線架</p>  
        <p type="p">112:牆體</p>  
        <p type="p">114:電極</p>  
        <p type="p">116:電極</p>  
        <p type="p">118:絕緣部</p>  
        <p type="p">120:第一發光二極體組件</p>  
        <p type="p">122:第一發光二極體</p>  
        <p type="p">124:第二發光二極體</p>  
        <p type="p">126:第三發光二極體</p>  
        <p type="p">130:第一混合式螢光體</p>  
        <p type="p">140:第二導線架</p>  
        <p type="p">142:牆體</p>  
        <p type="p">144:電極</p>  
        <p type="p">146:電極</p>  
        <p type="p">148:絕緣部</p>  
        <p type="p">150:第二發光二極體組件</p>  
        <p type="p">152,154,156:發光二極體</p>  
        <p type="p">160:第二混合式螢光體</p>  
        <p type="p">2-2,3-3:線段</p>  
        <p type="p">O1:第一開口</p>  
        <p type="p">O2:第二開口</p>  
        <p type="p">W:導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="775" publication-number="202627299"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627299.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓力錶之壓力機構</chinese-title>  
        <english-title>PRESSURE MECHANISM OF PRESSURE GAUGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">F04B33/00</main-classification>  
        <further-classification edition="200601120250225B">G01L19/16</further-classification>  
        <further-classification edition="200601120250225B">F04B39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雙餘實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETO ENGINEERING &amp; MARKETING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王羅平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LOPIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓力錶之壓力機構，包含有：一主體；一滑道，設於該主體內；一進氣口，設於該主體，並連通該滑道；一活塞單元，具有同軸設置之一低壓活塞與一高壓活塞，該高壓活塞穿設於該低壓活塞中，該活塞單元裝設於該主體之該滑道中，可受壓力氣體推動而於該滑道中位移；該低壓活塞具有一有限的行程，於該低壓活塞到達該有限的行程後，該高壓活塞仍可位移；一彈性單元，其彈性能係使該活塞單元保持往該滑道前端位移。藉此，該壓力機構之該活塞單元於高壓及低壓時可改變受力面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pressure mechanism of a pressure gauge, including: a main body; a slideway provided in the main body; an air inlet provided in the main body and connected to the slideway; a piston unit having a low pressure piston and a high pressure piston coaxially disposed, the high pressure piston is installed in the low pressure piston, the piston unit is installed in the slideway of the main body and can be pushed by pressure gas to move in the slideway; the low pressure piston has a limited stroke, when the low pressure piston reaches the limited stroke, the high-pressure piston can still be displaced; and an elastic unit, the elastic energy of which keeps the piston unit displacing toward a front end of the slideway. Thereby, the piston unit of the pressure mechanism can change the force-bearing area at high and low pressures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:壓力機構</p>  
        <p type="p">20:主體</p>  
        <p type="p">201:環圈</p>  
        <p type="p">22:滑道</p>  
        <p type="p">221:前端</p>  
        <p type="p">222:後端</p>  
        <p type="p">24:進氣口</p>  
        <p type="p">25:開槽</p>  
        <p type="p">26:蓋部</p>  
        <p type="p">27:螺孔</p>  
        <p type="p">28:調整件</p>  
        <p type="p">29:透槽</p>  
        <p type="p">30:活塞單元</p>  
        <p type="p">31:低壓活塞</p>  
        <p type="p">32:通孔</p>  
        <p type="p">33:活塞環唇</p>  
        <p type="p">34:擋止件</p>  
        <p type="p">35:高壓活塞</p>  
        <p type="p">36:活塞環唇</p>  
        <p type="p">37:連動部</p>  
        <p type="p">38:肩部</p>  
        <p type="p">S:距離</p>  
        <p type="p">40:彈性元件</p>  
        <p type="p">60:洩壓機構</p>  
        <p type="p">65:轉軸</p>  
        <p type="p">66:齒</p>  
        <p type="p">70:壓力錶</p>  
        <p type="p">71:殼體</p>  
        <p type="p">72:空間</p>  
        <p type="p">73:止擋部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="776" publication-number="202627717"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627717.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離系統、應用其之分離方法及其電腦程式產品</chinese-title>  
        <english-title>SEPARATING SYSTEM, SEPARATING METHOD USING THE SAME, AND COMPUTER READABLE MEDIUM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">G05B19/408</main-classification>  
        <further-classification edition="200601120250325B">G05B19/401</further-classification>  
        <further-classification edition="200601120250325B">G05B19/418</further-classification>  
        <further-classification edition="200601120250325B">B25J15/06</further-classification>  
        <further-classification edition="200601120250325B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳春弟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宗洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TSUNG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱佑宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YU-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂健瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">分離系統包括數個吸盤、真空吸力提供裝置及控制器。分離系統用以分離二片狀件。此些吸盤用以吸附二片狀件。真空吸力提供裝置連通此該些吸盤且用以提供真空吸力給此些吸盤。控制器連接真空吸力提供裝置且用以：取得二片狀件之抗拉拔強度值；決定預設分離長度；基於預設分離長度及抗拉拔強度值，取得分離二片狀件之分離力值；基於預設分離長度、抗拉拔強度值及分離力值，取得分離二片狀件之分離應力值；及，基於預設分離長度及分離應力值，決定此些吸盤之吸盤配置參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A separation system includes a plurality of suction cups, a vacuum suction providing device and a controller. The separation system is configured to separate two sheet-shaped parts. These the suction cups are configured to suck the two sheet-shaped parts. The vacuum suction providing device communicates with the suction cups and is configured to provide a vacuum suction force to the suction cups. The controller is connected to the vacuum suction providing device and is configured to: obtain an anti-separation strength value of the two sheet-shaped parts; determine a preset separation length; obtain a separation force value ​​for separating the two sheet-shaped parts based on the preset separation length and the anti-separation strength value; obtain a separation stress value ​​for separating the two sheet-shaped parts based on the preset separation length, the anti-separation strength value and the separation force value; and determine a suction cup configuration parameter of the suction cups based on the preset separation length and separation stress value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:分離系統</p>  
        <p type="p">110:吸盤</p>  
        <p type="p">120:真空吸力提供裝置</p>  
        <p type="p">130:控制器</p>  
        <p type="p">140:噴射器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="777" publication-number="202626133"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626133.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鼻胃管固定構造及其固定件</chinese-title>  
        <english-title>NASOGASTRIC TUBE FIXATION STRUCTURE AND FIXATION MEMBER THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250125B">A61M25/02</main-classification>  
        <further-classification edition="200601120250125B">A61J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>好達特生技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOD DOCTOR BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林碧吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PI-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鼻胃管固定構造及其固定件，用以解決習知之鼻胃管固定膠布醜化使用者外觀及固定後無法改變鼻胃管固定位置的問題。係包含：一管體，一端具有一伸入端，另一端具有一餵食部，該伸入端及該餵食部與該管體相連通；及一固定件，具有一座體及一固定部，該座體具有相對的上表面與下表面，在至少一表面係具有一黏貼層，該固定部與該座體相連接，該固定部用以結合該管體。係具有使用美觀及方便、迅速地結合及改變鼻胃管固定位置功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nasogastric tube fixation structure and a fixation member thereof are used to solve the problem that the customary nasogastric tube fixation tape is ugly to the user's appearance and the fixation position of the nasogastric tube cannot be changed after fixation. It comprises: a tube body, one end has an extension end, the other end has a feeding portion, the extension end and the feeding portion are connected to the tube body; and a fixation member, has a body and a fixation portion, the body has an opposing upper surface and a lower surface, and has an adhesive layer on at least one of the surfaces, and the fixation portion is connected to the body, and the fixation portion is used to combine the tube body. The nasogastric tube fixation structure and the fixation member thereof are aesthetically pleasing and convenient to use, and are effective in quickly combining and changing the fixation position of the nasogastric tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:管體</p>  
        <p type="p">11:伸入端</p>  
        <p type="p">12:餵食部</p>  
        <p type="p">13:刻度</p>  
        <p type="p">2:固定件</p>  
        <p type="p">21:座體</p>  
        <p type="p">22:黏貼層</p>  
        <p type="p">23:固定部</p>  
        <p type="p">24:容置空間</p>  
        <p type="p">25:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="778" publication-number="202627737"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627737.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250109B">G06F1/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周聖勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHENG-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何恕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪偉倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括第一面板、第一可拉伸膜與第一膠層。第一可拉伸膜設置在第一面板的一側。第一膠層連接第一面板與第一可拉伸膜。第一面板的楊氏模量對第一膠層的楊氏模量的比值大於或等於1000。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus including a first panel, a first stretchable film and a first adhesive layer is provided. The first stretchable film is disposed on one side of the first panel. The first adhesive layer connects the first panel and the first stretchable film. A ratio of the Young’s modulus of the first panel and the Young’s modulus of the first adhesive layer is greater than or equal to 1000.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可拉伸面板</p>  
        <p type="p">100s:操作面</p>  
        <p type="p">111:第一面板</p>  
        <p type="p">111t、131t、132t:厚度</p>  
        <p type="p">121:第一可拉伸膜</p>  
        <p type="p">122:第二可拉伸膜</p>  
        <p type="p">131:第一膠層</p>  
        <p type="p">132:第二膠層</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="779" publication-number="202628523"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628523.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固定結構</chinese-title>  
        <english-title>FIXING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">H05K7/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何雅婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YA-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種固定結構適用於顯示器，包括導光板、光學膜片以及單面膠。導光板具有第一基材及第一耳部。第一耳部連接第一基材。光學膜片具有第二基材及第二耳部。第二耳部連接第二基材並鄰接第一耳部。單面膠具有貼合面。貼合面貼合於第一耳部及第二耳部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fixing structure is adapted to display, including a light guide plate, an optical film and a single-side tape. The light guide plate has a first substrate and a first lug portion. The first lug portion is connected to the first substrate. The optical film has a second substrate and a second lug portion. The second lug portion is connected to the second substrate and adjacent to the first lug portion. The single-side tape has a bonding surface. The bonding surface bonds the first lug portion and the second lug portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:顯示器</p>  
        <p type="p">51:發光元件</p>  
        <p type="p">52:入光側</p>  
        <p type="p">100:固定結構</p>  
        <p type="p">112a:延伸部</p>  
        <p type="p">112a1:第一表面</p>  
        <p type="p">113:定位柱</p>  
        <p type="p">120:第一光學膜片</p>  
        <p type="p">122:第二耳部</p>  
        <p type="p">122a:第二表面</p>  
        <p type="p">130:第二光學膜片</p>  
        <p type="p">132:第三耳部</p>  
        <p type="p">132a:第三表面</p>  
        <p type="p">140:第三光學膜片</p>  
        <p type="p">141:第四基材</p>  
        <p type="p">142:第四耳部</p>  
        <p type="p">142a:第四表面</p>  
        <p type="p">150:單面膠</p>  
        <p type="p">151:第一貼合段</p>  
        <p type="p">152:第二貼合段</p>  
        <p type="p">153:第三貼合段</p>  
        <p type="p">154:第四貼合段</p>  
        <p type="p">155:貼合面</p>  
        <p type="p">156:連接段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="780" publication-number="202627073"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627073.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>促進黑色素生產效率之基因改質微生物以及產生黑色素的方法</chinese-title>  
        <english-title>GENETICALLY MODIFIED MICROORGANISM FOR ENHANCING MELANIN PRODUCTION EFFICIENCY AND METHOD FOR PRODUCING MELANIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">C12N1/21</main-classification>  
        <further-classification edition="200601120250114B">C12N9/02</further-classification>  
        <further-classification edition="200601120250114B">C12P17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林忠德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JHONG-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖弘玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱向元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, HSIANG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種促進黑色素生產效率之基因改質微生物，包括：一第一外源性核酸，其包括一編碼外泌型左旋胺基酸連接酶(L-amino acid ligase)之核酸，其中該外泌型左旋胺基酸連接酶具有將兩個胺基酸連接以形成一雙胜肽(dipeptide)之能力；以及一第二外源性核酸，其包括一編碼酪胺酸酶(tyrosinase)之核酸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A genetically modified microorganism for enhancing melanin production efficiency is provided. The genetically modified microorganism for enhancing melanin production efficiency includes a first exogenous nucleic acid and a second exogenous nucleic acid. The first exogenous nucleic acid includes a nucleic acid encoding an exocrine L-amino acid ligase, wherein exocrine L-amino acid ligase is capable of linking two amino acids to form a dipeptide. The second exogenous nucleic acid includes a nucleic acid encoding tyrosinase.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="781" publication-number="202627679"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627679.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物、正型光阻組合物、與形成圖案化光阻層的方法</chinese-title>  
        <english-title>POLYMER, POSITIVE PHOTORESIST COMPOSITION, AND METHOD FOR FORMING PATTERNED PHOTORESIST LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250326B">G03F7/004</main-classification>  
        <further-classification edition="200601120250326B">G03F7/032</further-classification>  
        <further-classification edition="200601120250326B">G03F7/039</further-classification>  
        <further-classification edition="200601120250326B">C08F212/08</further-classification>  
        <further-classification edition="200601120250326B">C08F220/18</further-classification>  
        <further-classification edition="200601120250326B">C08F220/30</further-classification>  
        <further-classification edition="200601120250326B">H05K3/06</further-classification>  
        <further-classification edition="200601120250326B">G03G13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許玉瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張德宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TE-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAO-JHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉逸芩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種聚合物、正型光阻組合物、與形成圖案化光阻層的方法。該聚合物包含一第一重複單元以及一第二重複單元。該第一重複單元具有式(I)所示之結構，該第二重複單元具有式(II)所示之結構 &lt;br/&gt;&lt;img align="absmiddle" height="374px" width="553px" file="ed10075.JPG" alt="ed10075.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;，其中R &lt;sup&gt;1&lt;/sup&gt;、R &lt;sup&gt;2&lt;/sup&gt;、R &lt;sup&gt;3&lt;/sup&gt;、R &lt;sup&gt;4&lt;/sup&gt;、Ar、n、以及m如說明書所定義。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polymer, positive photoresist composition, and method for forming patterned photoresist layer are provided. The polymer includes a first repeating unit and a second repeating unit. The first repeating unit has a structure of Formula (I) and the second repeating unit has a structure of Formula (II) &lt;br/&gt;&lt;img align="absmiddle" height="392px" width="632px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;, wherein R &lt;sup&gt;1&lt;/sup&gt;, R &lt;sup&gt;2&lt;/sup&gt;, R &lt;sup&gt;3&lt;/sup&gt;, R &lt;sup&gt;4&lt;/sup&gt;, Ar, n, and m are as defined in the specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:形成圖案化光阻層的方法</p>  
        <p type="p">12、14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="782" publication-number="202626219"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626219.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>去除土壤中石油碳氫化合物的方法</chinese-title>  
        <english-title>METHOD FOR REMOVING PETROLEUM HYDROCARBONS (PHS) FROM SOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250125B">B09C1/00</main-classification>  
        <further-classification edition="200601120250125B">B09C1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大仁科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳上權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHANG-CYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴文亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂汶君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WEN-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭安宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, AN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種去除土壤中石油碳氫化合物的方法，用以解決習知去除土壤中石油碳氫化合物的方法之效率不佳的問題。該去除土壤中石油碳氫化合物的方法包含：提供一汙染土壤，該汙染土壤包含石油碳氫化合物；於該汙染土壤中加入米糠，以形成一混合物；及將黑水虻幼蟲加入該混合物中，使該黑水虻幼蟲攝入該汙染土壤，以去除該汙染土壤中石油碳氫化合物。藉此可以達成提升土壤中石油碳氫化合物的去除速率之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for removing petroleum hydrocarbons from soil is used to solve the problem of the conventional method with poor efficiency. The method comprises: providing contaminated soil with petroleum hydrocarbons, forming a mixture by adding rice brans to the contaminated soil, and removing the petroleum hydrocarbons from the contaminated soil by adding the larva of &lt;i&gt;Hermetia illucens&lt;/i&gt;to the mixture. Accordingly, the petroleum hydrocarbons in the contaminated soil can be removed and improved.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="783" publication-number="202627074"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627074.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>專一性血球辨識材料與純化分離方法</chinese-title>  
        <english-title>A MATERIAL FOR IDENTIFYING SPECIFIC BLOOD CELLS AND THE RELATED PURIFICATION AND SEPARATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250303B">C12N5/0781</main-classification>  
        <further-classification edition="200601120250303B">G01N33/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中原大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG YUAN CHRISTIAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳福龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種專一性血球辨識材料與純化分離方法。具體地，該專一性血球辨識材料的組成包含一蛋白質、一溫度響應型高分子和一抗體，該蛋白質藉由一化學鍵結錨定在該溫度響應型高分子上，和該抗體以非共價鍵結合該蛋白質，藉此構成所述的專一性血球辨識材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a material for identifying specific blood cells and the related purification and separation method. The material for identifying specific blood cells comprises a protein, a temperature-responsive polymer and an antibody. The protein is immobilized on the temperature-responsive polymer via chemical bonds and the antibody bind to the protein by non-covalent bond to form the material for identifying specific blood cells.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="784" publication-number="202628055"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628055.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250122B">G09G3/3233</main-classification>  
        <further-classification edition="202001120250122B">H05B45/325</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王弘毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUNG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林匯峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖硯韜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YEN-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括顯示面板及控制電路。顯示面板包括多個像素驅動電路。每一像素驅動電路包括發光元件及開關元件。開關元件用以控制流過發光元件的驅動電流。控制電路耦接到顯示面板。控制電路用以提供控制開關元件的控制信號。控制信號的每一幀包括多個脈衝。控制電路根據顯示面板的刷新率及亮度至少其中之一調整脈衝的第一準位及第二準位的寬度比例。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device including a display panel and a control circuit is provided. The display panel includes a plurality of pixel driving circuits. Each pixel driving circuit includes a light emitting element and a switching element. The switching element controls a driving current flowing through the light emitting element. The control circuit is coupled to the display panel. The control circuit provides a control signal for controlling the switching element. Each frame of the control signal includes multiple pulses. The control circuit adjusts a width ratio of the first level and the second level of the pulses according to at least one of the refresh rate and the brightness of the display panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:控制電路</p>  
        <p type="p">120:顯示面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="785" publication-number="202627325"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627325.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於車輛之煞車散熱裝置</chinese-title>  
        <english-title>BRAKE HEAT DISSIPAITON DEVICE FOR VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">F16D65/847</main-classification>  
        <further-classification edition="200601120250224B">F16D65/78</further-classification>  
        <further-classification edition="200601120250224B">B60T5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種用於車輛之煞車散熱裝置，所述車輛具有一車體結構及設置於車體結構之一煞車裝置、一輪子及一煞車散熱裝置。其中，煞車散熱裝置包括有一裝設部以及一管狀結構。裝設部組設於車輛，管狀結構連結裝設部並使管狀結構鄰接煞車裝置，係由複數導風罩所組合而成且具有複數開口。複數開口之一導入口大致朝向車輛之前進方向，複數開口之一第一導出口大致朝向煞車裝置。藉此，透過塑膠射出成形製作，所有複數導風罩可由一模多穴之模具於單次射出成形一次產出，並使管狀結構鄰接煞車裝置，利用車輛前進時撞風及管狀結構之引導氣流，加強煞車裝置之散熱效率，同時可達到簡化模具、降低製造難易度及成本之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a brake heat dissipation device for a vehicle. The vehicle has a vehicle body structure, a braking device arranged on the vehicle body structure, a wheel and a brake heat dissipation device. Wherein, the brake heat dissipation device includes a mounting part and a tubular structure. The mounting part is assembled on the vehicle, and the tubular structure connects the mounting part and adjoins the braking device. The tubular structure is composed of a plurality of air guide covers and has a plurality of openings. An inlet of the plurality of openings is generally facing the forward direction of the vehicle, and a first outlet of the plurality of openings is generally facing the braking device. As such, through plastic injection molding, all the plurality of air guide covers can be produced in a single injection molding with a multi-cavity mold, and the tubular structure is adjacent to the braking device, taking advantage of the wind and the guidance of the tubular structure when the vehicle is moving forward. The airflow enhances the heat dissipation efficiency of the braking device, while simplifying the mold and reducing manufacturing difficulty and cost.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:煞車散熱裝置</p>  
        <p type="p">2:裝設部</p>  
        <p type="p">21:裝設結合部</p>  
        <p type="p">3:管狀結構</p>  
        <p type="p">30:導風罩</p>  
        <p type="p">300:開口</p>  
        <p type="p">301:導入口</p>  
        <p type="p">31:外導風罩</p>  
        <p type="p">312:遮蔽件</p>  
        <p type="p">32:內導風罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="786" publication-number="202627876"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627876.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧化文件表格處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">G06F40/166</main-classification>  
        <further-classification edition="201901120250401B">G06F16/93</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑克商業自動化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JACKSOFT COMMERCE AUTOMATION LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃秀鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧化文件表格處理方法，利用一運算裝置來執行以下步驟：獲得一包括多個頁面的可攜式文件格式文件；獲得該等頁面中存在的所有表格及每一表格所對應的表格編號；對於每一表格，將該表格識別為一有標題表格或一無標題表格；對於每一無標題表格，產生該無標題表格的一標題，以使該無標題表格成為該有標題表格；對於每一有標題表格，獲得一資料類型辨識結果；對所有有標題表格進行分群，以獲得至少一表格群集；及對於每一表格群集，將該表格群集中所有有標題表格依序進行合併，以獲得一表格合併結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S19:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="787" publication-number="202626207"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626207.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁浮霧化器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">B05B3/02</main-classification>  
        <further-classification edition="201801120250225B">B05B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林毓祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林毓祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁浮霧化器，包含一霧化裝置，以及一浮子裝置。該霧化裝置包括一機殼、設於該機殼內的一噴霧模組、可在一低點位置及一高點位置之間上下移動地設於該機殼內的一升降模組，以及用以驅動該噴霧模組及該升降模組的一控制模組，該機殼具有位於頂部且具有一置放區的一頂壁，以及位於頂部且圍繞該頂壁的該置放區的一環狀噴出口，該噴霧模組用以產生自該環狀噴出口噴出的噴霧，該升降模組包括一磁力單元及一無線輸電單元。該浮子裝置包括一外殼、設於該外殼內的一浮子磁鐵，以及設於該外殼內的一無線收電單元，以及設於該無線收電單元且被該無線收電單元驅動的一風扇，該外殼具有位於底部的一進氣口，以及一出氣口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:磁浮霧化器</p>  
        <p type="p">1:霧化裝置</p>  
        <p type="p">11:機殼</p>  
        <p type="p">111:主殼體</p>  
        <p type="p">111a:頂壁</p>  
        <p type="p">111b:置放區</p>  
        <p type="p">111d:環繞壁</p>  
        <p type="p">111e:軌道</p>  
        <p type="p">112:導流蓋</p>  
        <p type="p">113:底蓋</p>  
        <p type="p">114:環狀噴出口</p>  
        <p type="p">12:噴霧模組</p>  
        <p type="p">13:升降模組</p>  
        <p type="p">131:升降殼體</p>  
        <p type="p">131a:滑動部</p>  
        <p type="p">131b:螺孔</p>  
        <p type="p">132:上蓋</p>  
        <p type="p">133:磁力單元</p>  
        <p type="p">134:無線輸電單元</p>  
        <p type="p">135:第一鎖定磁鐵</p>  
        <p type="p">14:控制模組</p>  
        <p type="p">141:馬達</p>  
        <p type="p">142:轉子</p>  
        <p type="p">142a:螺紋</p>  
        <p type="p">2:浮子裝置</p>  
        <p type="p">21:外殼</p>  
        <p type="p">211:進氣口</p>  
        <p type="p">212:出氣口</p>  
        <p type="p">22:浮子磁鐵</p>  
        <p type="p">23:第二鎖定磁鐵</p>  
        <p type="p">24:無線收電單元</p>  
        <p type="p">25:風扇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="788" publication-number="202627729"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627729.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源轉換器的控制器</chinese-title>  
        <english-title>CONTROLLER OF POWER CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">G05F1/565</main-classification>  
        <further-classification edition="200601120250526B">H02M3/156</further-classification>  
        <further-classification edition="200601120250526B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力智電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UPI SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳銀康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳東霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DONG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王敏慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MIN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種電源轉換器的控制器，用以提供控制訊號使電源轉換器產生輸出電壓。控制器包括誤差放大器、補償電路、比較電路、調整電路及控制訊號產生電路。誤差放大器耦接電源轉換器且根據輸出電壓產生誤差訊號。補償電路耦接誤差放大器且根據誤差訊號產生補償訊號。補償電路包括補償電阻。比較電路耦接補償電路且根據補償訊號產生觸發訊號。調整電路耦接補償電阻的兩端且根據補償電阻的兩端之間的電壓差產生調整訊號。控制訊號產生電路耦接比較電路及調整電路且根據觸發訊號及調整訊號產生控制訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A controller of a power converter provides a control signal to cause the power converter to generate an output voltage. The controller includes an error amplifier, a compensation circuit, a comparison circuit, an adjustment circuit and a control signal generation circuit. The error amplifier is coupled to the power converter and generates an error signal according to the output voltage. The compensation circuit is coupled to error amplifier and generates a compensation signal according to error signal. The compensation circuit includes a compensation resistor. The comparison circuit is coupled to the compensation circuit and generates a trigger signal according to the compensation signal. The adjustment circuit generates an adjustment signal according to a cross-voltage between two terminals of the compensation resistor. The control signal generation circuit is coupled to the comparison circuit and adjustment circuit and generates a control signal according to the trigger signal and adjustment signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:控制器</p>  
        <p type="p">20:誤差放大器</p>  
        <p type="p">+:正輸入端</p>  
        <p type="p">-:負輸入端</p>  
        <p type="p">VFB:回授電壓</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">SE:誤差訊號</p>  
        <p type="p">22:補償電路</p>  
        <p type="p">R&lt;sub&gt;COMP&lt;/sub&gt;:補償電阻</p>  
        <p type="p">C&lt;sub&gt;COMP&lt;/sub&gt;:補償電容</p>  
        <p type="p">V&lt;sub&gt;COMP&lt;/sub&gt;:補償訊號</p>  
        <p type="p">GND:接地端</p>  
        <p type="p">VN:節點電壓</p>  
        <p type="p">ΔV:電壓差</p>  
        <p type="p">24:比較電路</p>  
        <p type="p">RAMP:斜坡訊號</p>  
        <p type="p">ST:觸發訊號</p>  
        <p type="p">26:調整電路</p>  
        <p type="p">ITONCH:調整訊號</p>  
        <p type="p">28:控制訊號產生電路</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">280:導通時間產生單元</p>  
        <p type="p">TON:第一導通時間</p>  
        <p type="p">TON’:第二導通時間</p>  
        <p type="p">282:邏輯控制單元</p>  
        <p type="p">SC:控制訊號</p>  
        <p type="p">3:電源轉換器</p>  
        <p type="p">30:驅動電路</p>  
        <p type="p">V&lt;sub&gt;UG&lt;/sub&gt;:第一開關訊號</p>  
        <p type="p">V&lt;sub&gt;LG&lt;/sub&gt;:第二開關訊號</p>  
        <p type="p">32:輸出級</p>  
        <p type="p">M1:第一開關</p>  
        <p type="p">M2:第二開關</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">PH:相位節點</p>  
        <p type="p">L:電感</p>  
        <p type="p">IL:電感電流</p>  
        <p type="p">DCR:電阻</p>  
        <p type="p">R&lt;sub&gt;ESR&lt;/sub&gt;:電阻</p>  
        <p type="p">C&lt;sub&gt;L&lt;/sub&gt;:電容</p>  
        <p type="p">R&lt;sub&gt;FB1&lt;/sub&gt;:第一分壓電阻</p>  
        <p type="p">R&lt;sub&gt;FB2&lt;/sub&gt;:第二分壓電阻</p>  
        <p type="p">OUT:輸出端</p>  
        <p type="p">FB:分壓節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="789" publication-number="202626229"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626229.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具機頭座組</chinese-title>  
        <english-title>TOOL HEAD BASE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">B23B31/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新虎將機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENTIGER MACHINERY INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHIN CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王舒柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHU PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳麗芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種工具機頭座組，其包括：一座體及一軸套組件。該座體包含有一組接孔，該組接孔定義有一軸向與一徑向；該軸套組件沿該軸向插接於該組接孔地連接於該座體，該軸套組件包含有一軸套主體與至少一隔熱體，該軸套主體供主軸插接，該至少一隔熱體於該徑向上夾掣於該軸套主體之一外環壁與圍構該組接孔之一孔壁之間。透過該至少一隔熱體可以有效隔絕主軸運轉時大量熱量傳遞予該座體，確保於長時間使用下，該座體之結構強度不會受熱弱化、變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a tool head base assembly, which includes: a base body and a shaft sleeve assembly. The base body includes a set of connecting holes, and the set of connecting holes defines an axial direction and a radial direction. The bushing assembly is inserted into the set of connecting holes along the axial direction and is connected to the base body. The bushing assembly includes a bushing body and at least one heat insulator. The main body of the bushing is for the main shaft to be plugged into. The at least one heat insulator is clamped in the radial direction between an outer ring wall of the bushing body and a hole wall surrounding the set of connecting holes. The at least one heat insulator can effectively isolate a large amount of heat from being transferred to the base when the spindle is running. Ensure that the structural strength of the base will not be weakened or deformed by heat during long-term use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:座體</p>  
        <p type="p">11:組接孔</p>  
        <p type="p">12:孔壁</p>  
        <p type="p">2:軸套組件</p>  
        <p type="p">21:軸套主體</p>  
        <p type="p">22:外環壁</p>  
        <p type="p">23:第一貫孔</p>  
        <p type="p">24:環體</p>  
        <p type="p">25:管體</p>  
        <p type="p">3:隔熱體</p>  
        <p type="p">31:第二貫孔</p>  
        <p type="p">4:溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="790" publication-number="202626501"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626501.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具電磁遮蔽石墨烯複合薄膜及其製備方法</chinese-title>  
        <english-title>GRAPHENE COMPOSITE FILM WITH ELECTROMAGNETIC SHIELDING AND METHOD FOR PREPARATION THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250614B">C01B32/198</main-classification>  
        <further-classification edition="200601120250614B">B32B9/04</further-classification>  
        <further-classification edition="200601120250614B">H01C1/06</further-classification>  
        <further-classification edition="201901120250614B">B32B7/025</further-classification>  
        <further-classification edition="200601120250614B">H01G4/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳以文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃沂榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊婷伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具電磁遮蔽石墨烯複合薄膜，包含一石墨烯基材，表面上附著有一奈米金屬氧化物，該具電磁遮蔽石墨烯複合薄膜的電磁波吸收性能在頻率介於5~15GHz中具有電磁波穿透率不超過60dB，且電磁波反射率介於0~10dB，即含有奈米金屬氧化物之石墨烯基材具有遮蔽電磁波的效果；在另一實施例提供的具電磁遮蔽石墨烯複合薄膜製備方法，係將一金屬板材浸置在一氧化石墨烯溶液進行反應，在該金屬板材上生成有自組裝的一石墨烯基材，最後將該金屬基材從該氧化石墨烯溶液中取出，以稀鹽酸對該金屬基材進行脫膜處理以剝離該石墨烯基材，即獲得該具電磁遮蔽石墨烯複合薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A graphene composite film with electromagnetic shielding comprises a graphene substrate, the graphene substrate surface attached with a nano metal oxides. The electromagnetic wave absorption performance of the graphene composite film exhibits an electromagnetic wave transmission rate not exceeding 60 dB within the frequency range of 5 to 15 GHz and a reflection rate between 0 to 10 dB. Therefore, the graphene substrate contained the nano metal oxides effectively shields electromagnetic waves. In another embodiment, the method for preparing the graphene composite film includes immersing a metal sheet in a graphene oxide solution for a reaction, wherein a self-assembled graphene substrate forms on the metal sheet. Subsequently, the metal substrate is removed from the graphene oxide solution and subjected to a membrane removal process using dilute hydrochloric acid to peel off the graphene substrate, thereby obtaining the graphene composite film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="791" publication-number="202627401"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627401.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>間隙量測治具及其組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250507B">G01B7/14</main-classification>  
        <further-classification edition="200601120250507B">G01R1/073</further-classification>  
        <further-classification edition="200601120250507B">G01R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣銓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃汶祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種間隙量測治具及其組件，其設置於一探針卡，間隙量測治具包含一框架，其設置於探針卡的一側面；複數感測器，其設置於框架且相對於探針卡的另一側面；一傳輸元件，其設置於探針卡且電性連接各感測器；一定位裝置，其設置於探針卡且相對於框架的另一側面，定位裝置設置有複數定位梢；配合一針測機、一測試機及一顯示器使用時，間隙量測治具設置於針測機上，透過針測機的針對焦相機調整平台直至水平，測試機設置有橋樑並自上方下降直至橋樑與間隙量測治具接觸，透過顯示器確認各感測器接觸狀況直至間隙量測治具的間隙為正確，藉此達到兼具快速量測間隙及確認平台的平面度是否符合規格之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:間隙量測治具</p>  
        <p type="p">10:框架</p>  
        <p type="p">11:感測部</p>  
        <p type="p">111:長桿體</p>  
        <p type="p">112:短桿體</p>  
        <p type="p">12:側架部</p>  
        <p type="p">20:感測器</p>  
        <p type="p">30:傳輸元件</p>  
        <p type="p">50:探針卡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="792" publication-number="202627497"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627497.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151505</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶圓測試設備的冷卻系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">G01R1/44</main-classification>  
        <further-classification edition="202001120250407B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣銓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪汝誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作提出一種用於晶圓測試設備的冷卻系統，其包含：一低溫製造機、一乾燥空氣機、及一減量模組。低溫製造機具有一低溫模式及一非低溫模式。乾燥空氣機流體連通且輸出空氣至低溫製造機。減量模組流體連通且輸出空氣至乾燥空氣機，且減量模組用以接收一空氣來源。減量模組在低溫製造機處於非低溫模式時所輸出至乾燥空氣機的空氣量小於減量模組在低溫製造機處於低溫模式時所輸出至乾燥空氣機的空氣量。本創作使輸入至乾燥空氣機的空氣在非低溫模式時減少流量，故當測試環境不需要低溫時，不必維持壓縮空氣全量輸送、也不必持續耗費能源壓縮空氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:低溫製造機</p>  
        <p type="p">20:乾燥空氣機</p>  
        <p type="p">30:減量模組</p>  
        <p type="p">32:控制單元</p>  
        <p type="p">A:晶圓測試設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="793" publication-number="202626147"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626147.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車鋰電池著火防火毯自動披覆裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">A62C8/06</main-classification>  
        <further-classification edition="200601120250422B">A62C31/28</further-classification>  
        <further-classification edition="200601120250422B">A62C37/38</further-classification>  
        <further-classification edition="200601120250422B">A62C3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣智能機器人科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN INTELLIGENT ROBOTICS COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴彥竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YEN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯信賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, SHIN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種電動車鋰電池著火防火毯自動披覆裝置，包含防火毯匣、防火毯與至少一氣動裝置；防火毯匣具有防火毯匣倉，防火毯匣更具有控制單元；防火毯設於防火毯匣倉；氣動裝置設於防火毯匣，並且耦接防火毯的四邊角處，氣動裝置訊號連接控制單元。若電動車著火時，氣動裝置立即將防火毯朝向停放有電動車的停車格的四邊角或電動車之車體的四邊角噴出，藉以使得防火毯覆蓋電動車整個車體，並阻隔電動車與空氣之間的接觸，藉以撲滅電動車的火勢。本發明的啟動機制係利用感測或上位系統觸發，以使得防火毯能夠及時與即時將防火毯披覆於著火的車輛。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:防火毯匣</p>  
        <p type="p">100:第一門片</p>  
        <p type="p">101:第二門片</p>  
        <p type="p">102:插座</p>  
        <p type="p">103:安全鎖</p>  
        <p type="p">104:警示燈</p>  
        <p type="p">105:防火毯匣倉</p>  
        <p type="p">11:防火毯</p>  
        <p type="p">12:氣動裝置</p>  
        <p type="p">20:固定條</p>  
        <p type="p">21:減震器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="794" publication-number="202627558"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627558.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G02B6/122</main-classification>  
        <further-classification edition="200601120250502B">G02B6/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳海明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林長佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊佩蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PEI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳紀翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林弘毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置。該電子裝置包括一光子組件及一強化模組。該強化模組安置於該光子組件之一第一表面上方，且經組態以減小該光子組件之一翹曲。該強化模組包括一功能元件及一非功能元件。該功能元件及該非功能元件在實質上平行於該光子組件之該第一表面的一方向上共同地建構一連續結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes a photonic component and a reinforcement module. The reinforcement module is disposed over a first surface of the photonic component and is configured to reduce a warpage of the photonic component. The reinforcement module includes a functional element and a non-functional element. The functional element and the non-functional element collectively construct a continuous structure in a direction substantially parallel to the first surface of the photonic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">20P:懸垂部分</p>  
        <p type="p">20v:導孔</p>  
        <p type="p">50:電子組件</p>  
        <p type="p">60:光學組件</p>  
        <p type="p">70:強化模組</p>  
        <p type="p">70F:功能元件</p>  
        <p type="p">70N:非功能元件</p>  
        <p type="p">80:散熱片</p>  
        <p type="p">91:電接點</p>  
        <p type="p">91u:保護元件</p>  
        <p type="p">95:黏接層</p>  
        <p type="p">110:導電襯墊</p>  
        <p type="p">130:導電襯墊</p>  
        <p type="p">200:基板層</p>  
        <p type="p">200A:基板層</p>  
        <p type="p">201:表面</p>  
        <p type="p">202:表面</p>  
        <p type="p">210c:導電層</p>  
        <p type="p">220:導電襯墊</p>  
        <p type="p">220c:導電層</p>  
        <p type="p">222:障壁層</p>  
        <p type="p">240:光學通道</p>  
        <p type="p">261:介電層</p>  
        <p type="p">262:介電層</p>  
        <p type="p">263:介電層</p>  
        <p type="p">501:表面</p>  
        <p type="p">502:表面</p>  
        <p type="p">TC1:熱通道</p>  
        <p type="p">T1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="795" publication-number="202627421"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627421.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151514</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器模組用連接器</chinese-title>  
        <english-title>CONNECTOR FOR A SENSOR MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">G01D11/24</main-classification>  
        <further-classification edition="200601120250422B">H01R13/66</further-classification>  
        <further-classification edition="200601120250422B">G01L19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禾昌興業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>P-TWO INDUSTRIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張君瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范若明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, JO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感測器模組用連接器，包括：內殼體，具有供連接對象物沿第一方向插入的嵌合開口；複數個接觸件，由該內殼體保持，每一個接觸件具有延伸進入該嵌合開口的接觸部及與該接觸部相對的連接終端部；電纜，具有複數個導線及包覆該複數個導線的電纜護套，該複數個導線的導體分別固定在該複數個接觸件並與該複數個接觸件電連接；以及外殼體，該外殼體係以嵌入射出成形方式形成，以局部包覆該內殼體。藉由上述的連接器的構成，能使感測器模組的組裝容易進行且可防止水或濕氣侵入感測器模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector for a sensor module is provided, which comprises: an inner housing having a mating opening for insertion of a connecting object in a first direction; a plurality of contacts held by the inner housing, each contact member having a contact portion extending into the mating opening and a connection terminal portion opposite to the contact portion; a cable having a plurality of wires and a cable sheath enclosing the wires, conductors of the plurality of wires being respectively fixed to the plurality of contacts and electrically connected to the plurality of contacts; and an outer housing formed by insert molding for partially enclosing the inner housing. By means of the configuration of the above-described connector, assembling of the sensor module can be easily performed and water or moisture ingress into the sensor module can be prevented.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:感測器模組用連接器</p>  
        <p type="p">11:內殼體</p>  
        <p type="p">110:本體部</p>  
        <p type="p">111:凸台</p>  
        <p type="p">1110:嵌合開口</p>  
        <p type="p">12:外殼體</p>  
        <p type="p">121:夾緊表面</p>  
        <p type="p">123:安裝孔</p>  
        <p type="p">124:安裝孔</p>  
        <p type="p">13a:第一接觸件</p>  
        <p type="p">13b:第二接觸件</p>  
        <p type="p">13c:第三接觸件</p>  
        <p type="p">13d:第四接觸件</p>  
        <p type="p">13G:接觸件群組</p>  
        <p type="p">14:電纜</p>  
        <p type="p">140:電纜護套</p>  
        <p type="p">141:導線</p>  
        <p type="p">1410:導線護套</p>  
        <p type="p">1411:導體</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="796" publication-number="202625969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聽力檢測系統</chinese-title>  
        <english-title>HEARING DETECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">A61B5/12</main-classification>  
        <further-classification edition="201801120250325B">G16H50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, UEI SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, UEI SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泰廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAI TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作特別適用於嬰兒或有特殊需求的患者，無需語言表達即可進行檢測。亦可應用於偏鄉地區，只需簡單的攝影設備，即可將影像數據傳送至專業機構進行分析，並由聽力師確認結果。 &lt;br/&gt;本創作提供了一種聽力檢測系統，包括攝影模組、測量模組和人工智能分析模組。攝影模組以捕捉被檢測對象的臉部影像，並將影像數據傳送至測量模組。測量模組對臉部影像進行分析，檢測眼睛、眉毛和嘴部的微小變化，並轉換為測量數據。人工智能分析模組根據這些數據，藉由推測被檢測對象對聲音刺激的反應，並評估其聽力狀況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a hearing detection system, including a photography module, a measurement module, and an artificial intelligence analysis module. The photography module captures facial images of the subject and transmits the image data to the measurement module. The measurement module analyzes the facial images, detecting subtle changes in the eyes, eyebrows, and mouth, and converts these changes into measurement data. The artificial intelligence analysis module uses this data to infer the subject's response to sound stimuli and assess their hearing condition. This system is particularly suitable for infants or patients with special needs, allowing for testing without the need for verbal communication. It is also applicable in remote areas, where simple photographic equipment can be used to send image data to a professional institution for analysis, with the results confirmed by an audiologist.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:聽力檢測系統</p>  
        <p type="p">11:攝影模組</p>  
        <p type="p">12:測量模組</p>  
        <p type="p">13:人工智能分析模組</p>  
        <p type="p">131:訓練單元</p>  
        <p type="p">132:比對單元</p>  
        <p type="p">14:存儲模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="797" publication-number="202628033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250113B">G09G3/20</main-classification>  
        <further-classification edition="200601120250113B">G09G3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱冠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>來漢中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HAN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許明祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括多個畫素結構。每一畫素結構包括多個接墊組、多個發光元件、第一金屬件及第二金屬件。每一接墊組包括接墊。多個發光元件分別接合至多個接墊組。第一金屬件及第二金屬件設置於多個接墊組外且彼此交錯。第一金屬件的線寬大於第二金屬件的線寬。第一金屬件在第一方向上延伸，且接墊的長邊與第一方向交錯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus includes pixel structures. Each of the pixel structures includes pad groups, light-emitting elements, a first metal element and a second metal element. Each of the pad groups includes a pad. The light-emitting elements are respectively bonded to the pad groups. The first metal element and the second metal element are disposed outside the pad groups and staggered with each other. A line width of the first metal element is greater than a line width of the second metal element. The first metal element extends in a first direction, and a long side of the pad intersects with the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">120:接墊組</p>  
        <p type="p">122:接墊</p>  
        <p type="p">122a:第一接墊</p>  
        <p type="p">122b:第二接墊</p>  
        <p type="p">122L:長邊</p>  
        <p type="p">130:發光元件</p>  
        <p type="p">130B:第三發光元件</p>  
        <p type="p">130G:第二發光元件</p>  
        <p type="p">130R:第一發光元件</p>  
        <p type="p">130n:正常發光元件</p>  
        <p type="p">130r:修補用發光元件</p>  
        <p type="p">160:金屬層</p>  
        <p type="p">162:第一金屬件</p>  
        <p type="p">164:第二金屬件</p>  
        <p type="p">D3、D4:距離</p>  
        <p type="p">d1:第一方向</p>  
        <p type="p">d2:第二方向</p>  
        <p type="p">PX:畫素結構</p>  
        <p type="p">PXr:經修補畫素結構</p>  
        <p type="p">R:區域</p>  
        <p type="p">VSS:共用電極</p>  
        <p type="p">W162、W164:線寬</p>  
        <p type="p">X:交錯處</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="798" publication-number="202627552"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627552.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G02B6/12</main-classification>  
        <further-classification edition="200601120260302B">G02B6/13</further-classification>  
        <further-classification edition="202601120260302B">H10W74/00</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁家圃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHIA-PU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JUN-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯沛瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, PEI HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佳熹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA HSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊舒萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHU PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，主要提供一承載結構，並將光電裝置設於該承載結構上，其中，該光電裝置包含有封裝模組，設於該封裝模組中之半導體元件，以及接置於封裝模組上之光學元件，且令該光學元件與其連接之光元件(光纖或光纖接頭)得以平穩的接觸結合於該承載結構上，藉以增加光纖支撐保護，使光纖傳輸訊號穩固。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package and manufacturing method thereof which provide a carrier structure and set an optoelectronic device on the carrier structure. The optoelectronic device includes a package module, a semiconductor component in the package module, and an optical component connected to the package module, so that the optical component and connected optical element (fiber or fiber connector) can be stably contacted and combined with the carrier structure, thereby increasing the optical fiber protection and make fiber transmission signals stable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子封裝件</p>  
        <p type="p">20:承載結構</p>  
        <p type="p">21:光電裝置</p>  
        <p type="p">22:光元件</p>  
        <p type="p">23:銲線</p>  
        <p type="p">24:電子元件</p>  
        <p type="p">26:包覆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="799" publication-number="202628390"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628390.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151525</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有殭屍網路偵測功能的控制器、殭屍網路偵測方法與物連網通訊系統</chinese-title>  
        <english-title>CONTROLLER WITH FUNCTION OF DETECTING BOTNET, BOTNET DETECTION METHOD AND INTERNET OF THINGS COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">H04L9/40</main-classification>  
        <further-classification edition="200601120250401B">G06N3/02</further-classification>  
        <further-classification edition="202301120250401B">G06N3/08</further-classification>  
        <further-classification edition="202201120250401B">H04L69/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物連網通訊系統，其具有控制器、第一連網裝置、交換機與路由裝置，其中交換機通訊連接第一連網裝置與控制器，路由裝置通訊連接交換機與第二連網裝置。控制器具有殭屍網路偵測功能，並具有計算單元、儲存單元與網路介面。儲存單元電性連接計算單元，並儲存有複數個程式碼。網路介面用於取得第一連網裝置傳遞至第二連網裝置的複數個封包。計算單元執行複數個程式碼，以用於獲取複數個封包的複數個標頭，以及用於複數個標頭的複數個特徵參數判讀第一連網裝置是否被感染惡意程式而變成殭屍網路的一員。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An Internet of Things (IoT) communication system has a controller, an first networking device, a switch and a routing device, wherein the switch is communicatively connected to the first networking device and the controller, and the routing device is communicatively connected to the switch and the external networking device. The controller has a function of detecting a botnet, and has a computing unit, a storage unit and a network interface. The storage unit is electrically connected to the computing unit and stores a plurality of program codes. The network interface is used to obtain multiple packets transmitted from the first networking device to the external networking device. The computing unit executes the program codes for obtaining headers of the packets, and for determining whether the first networking device is infected with a malicious program and becomes a member of the botnet based on a plurality of characteristic parameters ​​of the headers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:控制器</p>  
        <p type="p">11:網路介面</p>  
        <p type="p">12:標頭獲取單元</p>  
        <p type="p">13:分類模型單元</p>  
        <p type="p">2:交換機</p>  
        <p type="p">31、32、33:第一連網裝置</p>  
        <p type="p">4:路由裝置</p>  
        <p type="p">5:無線接取點裝置</p>  
        <p type="p">61、62:第二連網裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="800" publication-number="202625893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於自動化有機廢棄物處理和蛋白質生產的幼蟲培育系統及幼蟲培育方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR AUTOMATED CULTIVATION OF LARVAE FOR ORGANIC WASTE PROCESSING AND PROTEIN PRODUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251104B">A01K67/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游振德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHEN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於自動化培育幼蟲的幼蟲培育系統和幼蟲培育方法，用以將有機廢棄物轉化為高蛋白飼料產品。該系統包括進料準備模組、餵食單元、溫控培育模組、環境控制單元、轉運系統、收穫模組和乾燥模組。進料準備模組接收並處理有機廢棄物以生成均質飼料，該飼料被分配至受控環境中的培育托盤，以優化幼蟲的生長。環境控制單元管理熱量、濕度和異味，確保幼蟲的最佳生長條件。該系統進一步自動化了托盤的移動、收穫以及將幼蟲與殘留有機物料分離，從而減少人工干預。乾燥後的幼蟲產品可作為高蛋白動物飼料。本發明提供了一種高效、可擴展且環境友好的有機廢棄物管理和蛋白質生產解決方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a system and method for the automated cultivation of larvae for converting organic waste into high-protein feed products. The system includes a feed preparation module, a feeding unit, a temperature-controlled cultivation module, an environmental control unit, a transfer system, a harvesting module, and a drying module. The feed preparation module receives and processes organic waste to create a homogeneous feedstock, which is distributed to cultivation trays in a controlled environment to optimize larvae growth. The environmental control unit manages heat, humidity, and odor, ensuring optimal conditions for the larvae. The system further automates the movement of trays, harvesting, and separation of larvae from residual organic material, minimizing manual intervention. The dried larvae product serves as a high-protein ingredient for animal feed. This invention provides an efficient, scalable, and environmentally sustainable solution for organic waste management and protein production.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:幼蟲培育系統</p>  
        <p type="p">110:進料準備模組</p>  
        <p type="p">120:餵食單元</p>  
        <p type="p">122:自動分配系統</p>  
        <p type="p">124:飼料液位監控系統</p>  
        <p type="p">130:培育模組</p>  
        <p type="p">132:培育托盤</p>  
        <p type="p">134:翻動機構</p>  
        <p type="p">138:濕度感測器</p>  
        <p type="p">140:環境控制單元</p>  
        <p type="p">142:負壓排氣系統</p>  
        <p type="p">145:加濕器</p>  
        <p type="p">146:除濕器</p>  
        <p type="p">150:轉運系統</p>  
        <p type="p">151:軌道移動機構</p>  
        <p type="p">152:導軌</p>  
        <p type="p">153:可編程邏輯控制器</p>  
        <p type="p">160:收穫模組</p>  
        <p type="p">162:傾倒機構</p>  
        <p type="p">164:分離單元</p>  
        <p type="p">1641:振動篩</p>  
        <p type="p">170:乾燥模組</p>  
        <p type="p">172:微波乾燥系統</p>  
        <p type="p">174:溫度感測器</p>  
        <p type="p">176:濕度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="801" publication-number="202626468"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626468.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理承載有機物料負載的培育托盤的移轉裝置</chinese-title>  
        <english-title>TRANSFER APPARATUS FOR HANDLING CULTIVATION TRAYS LOADED WITH ORGANIC MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">B65G47/90</main-classification>  
        <further-classification edition="200601120250203B">B65G47/24</further-classification>  
        <further-classification edition="202501120250203B">A01K67/362</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游振德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHEN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種處理培育托盤上負載的移轉裝置，特別適用於涉及有機材料和昆蟲幼蟲的環境。該移轉裝置包括一個可置於培養模組附近的框架結構、一個配置為從較低位置提升培育托盤的垂直提升組件，以及一個可將培育托盤從平放狀態旋轉至實質倒置狀態的傾斜機構。為維持結構完整性並確保在約300公斤的重大負載下的穩定性，移轉裝置可能包括如置於培育托盤上方的加強杆等加強構件。在某些實施方式中，配備感測器的控制系統協調提升和傾斜操作，以增強可靠性並減少手動勞動。此配置可高效且完整地排出培育托盤內容物，同時最小化溢出、變形和停機時間，使該系統非常適用於農業、廢物處理和蛋白質生產應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transfer apparatus for handling loads on cultivation trays, particularly suitable for environments involving organic materials and insect larvae. The transfer apparatus includes a frame structure positionable near a cultivation module, a vertical lifting assembly configured to raise the cultivation tray from a lower position, and a tilting mechanism operable to rotate the cultivation tray from a flat orientation to a substantially inverted orientation. To maintain structural integrity and ensure stability under substantial loads of approximately 300 kilograms, the transfer apparatus may include reinforcement members such as overhead rods positioned above the cultivation tray. In certain embodiments, a control system equipped with sensors coordinates the lifting and tilting operations to enhance reliability and reduce manual labor. This configuration allows for the efficient and complete discharge of the cultivation tray's contents while minimizing spillage, deformation, and downtime, making the system highly suitable for agricultural, waste processing, and protein production applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:移轉裝置</p>  
        <p type="p">102:框架結構</p>  
        <p type="p">1022:垂直立柱</p>  
        <p type="p">1024:水平橫樑</p>  
        <p type="p">12:培育托盤</p>  
        <p type="p">130:支撐框架</p>  
        <p type="p">1302:第一部分</p>  
        <p type="p">1304:第二部分</p>  
        <p type="p">140:加強構件</p>  
        <p type="p">142:延長桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="802" publication-number="202627673"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627673.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓印方法</chinese-title>  
        <english-title>IMPRINT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G03F7/00</main-classification>  
        <further-classification edition="201201120250512B">G03F1/20</further-classification>  
        <further-classification edition="200601120250512B">B29C51/34</further-classification>  
        <further-classification edition="200601120250512B">B29C59/02</further-classification>  
        <further-classification edition="201101120250512B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡易霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YI LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯志賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種壓印方法，其包括以下步驟。提供包括第一突出圖案以及第二突出圖案的第一主模具，其中第一突出圖案的寬度小於第二突出圖案的寬度。提供包括第三突出圖案的第二主模具，其中第三突出圖案的寬度小於第一突出圖案的寬度。利用第一主模具以對形成於複製模具上的第一光阻層進行第一壓印步驟。利用剩餘的第一光阻層對複製模具進行第一蝕刻步驟，以形成第一凹陷部以及第二凹陷部。利用第二主模具以對形成於複製模具上的第二光阻層進行第二壓印步驟。利用剩餘的第二光阻層對複製模具進行第二蝕刻步驟，以形成第三凹陷部，其中第三凹陷部與第一凹陷部重疊。利用複製模具對形成於基板上的第三光阻層進行第三壓印步驟。利用剩餘的第三光阻層對基板進行第三蝕刻步驟，以形成所需的圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imprint method including the following steps is provided. Providing a first master mold including a first protruding pattern and a second protruding pattern, wherein a width of the first protruding pattern is less than a width of the second protruding pattern. Providing a second master mold including a third protruding pattern, wherein a width of the third protruding pattern is less than the width of the first protruding pattern. Performing a first imprint step on a first resist layer formed on a replica mold by using the first master mold. Performing a first etching step on the replica mold by using the remained first resist layer, so as to form a first recess portion and a second recess portion. Performing a second imprint step on a second resist layer formed on the replica mold by using the second master mold. Performing a second etching step on the replica mold by using the remained second resist layer, so as to form a third recess portion, wherein the third recess portion overlaps the first recess portion. Performing a third imprint step on a third resist layer formed on a substrate by using the replica mold. Performing a third etching step on the substrate by using the remained third resist layer, so as to form a desired pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:所需的圖案</p>  
        <p type="p">12:第一圖案</p>  
        <p type="p">14:第二圖案</p>  
        <p type="p">SB:基板</p>  
        <p type="p">T12、T14:厚度</p>  
        <p type="p">X、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="803" publication-number="202627922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>刷卡操作系統及方法</chinese-title>  
        <english-title>CARD SWIPE OPERATING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250401B">G06Q20/24</main-classification>  
        <further-classification edition="201201120250401B">G06Q20/38</further-classification>  
        <further-classification edition="201201120250401B">G06Q20/34</further-classification>  
        <further-classification edition="202301120250401B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華南商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA NAN COMMERCIAL BANK, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHR-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范姜士恭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN CHIANG, SHIH-KUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周廷翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOU, TYNG-HANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種刷卡操作系統，包含輸入輸出裝置、儲存裝置及處理裝置。處理裝置連接於輸入輸出裝置及儲存裝置。輸入輸出裝置用於接收信用卡的刷卡請求。儲存裝置儲存通訊軟體、信用卡持卡人在通訊軟體中的用戶帳號、預設拒絕條件及已綁定帳號。處理裝置判斷刷卡請求符合預設拒絕條件中的目標條件時，判斷目標條件是否屬於允許自動申請類別並判斷用戶帳號是否為已綁定帳號，在目標條件屬於允許自動申請類別且用戶帳號為已綁定帳號時，使用通訊軟體透過輸入輸出裝置發送通知至用戶帳號，並根據輸入輸出裝置接收之回應於通知的刷卡申請，執行刷卡作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A card swipe operating system includes an input-output device, a storage device, and a processing device. The processing device is connected to the input-output device and the storage device. The input-output device is configured to receive a swipe request for swiping a credit card. The storage device stores communication software, the user account of the credit cardholder in the communication software, preset rejection conditions, and bound accounts. When determining the swipe request meets a target condition of the preset rejection conditions, the processing device determines whether the target condition belongs to the category of allowed automatic applications and whether the user account is a bound account. When the target condition belongs to the category of allowed automatic applications and the user account is a bound account, the processing device uses the communication software to send a notification to the user account through the input-output device and execute the swipe card operation based on swipe submission in response to the notification received by the input-output device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:刷卡操作系統</p>  
        <p type="p">2:行動裝置</p>  
        <p type="p">11:輸入輸出裝置</p>  
        <p type="p">12:儲存裝置</p>  
        <p type="p">13:處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="804" publication-number="202627510"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627510.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料傾印電路、感應與鎖定電路與偵錯電路</chinese-title>  
        <english-title>DATA DUMPING CIRCUIT, SENSING AND LOCKING CIRCUIT AND DEBUGGING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G01R31/317</main-classification>  
        <further-classification edition="200601120250401B">H03K3/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泳成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料傾印電路，耦接一組合邏輯電路，並且包括一感應與鎖定電路與一掃描鏈電路。感應與鎖定電路感應組合邏輯電路之一特徵值，並且在判斷特徵值改變時，產生一掃描致能訊號。掃描鏈電路耦接至複數正反器，並且響應於掃描致能訊號操作在一掃描模式。在掃描模式中，掃描鏈電路依序將儲存在各正反器之一數值輸出作為一傾印資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data dumping circuit coupled to a combinational logic circuit and includes a sensing and locking circuit and a scan chain circuit. The sensing and locking circuit senses a characteristic value of the combinational logic circuit and generates a scan enable signal when determining that the characteristic value has been changed. The scan chain circuit is coupled to a plurality of flip-flops and operates in a scan mode in response to the scan enable signal. In the scan mode, the scan chain circuit sequentially outputs a value stored in each flip-flop as dump data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:偵錯電路</p>  
        <p type="p">210:資料傾印電路</p>  
        <p type="p">220:感應與鎖定電路</p>  
        <p type="p">230:掃描鏈電路</p>  
        <p type="p">240:處理器電路</p>  
        <p type="p">250:組合邏輯電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="805" publication-number="202625894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蟲卵收集系統</chinese-title>  
        <english-title>BUG EGG COLLECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250206B">A01K67/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游振德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHEN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種有效收集蟲卵的蟲卵收集系統，以提升飼養效率。該蟲卵收集裝置包括沿中心軸排列的多個平面部件，這些平面部件通過間隔件隔開，以形成適合產卵的中間間隙。每個平面部件設有開口，用於擴散來自相鄰容器的誘引氣味，吸引蟲在間隙中產卵。該裝置還包括一支撐桿、一用於間隔彈性的彈簧機構及一振動機構，用以促進平面部件上的卵脫落至收集片上。此外，還設有一帶有保持濕潤覆蓋物的孵化容器，用於控制卵的孵化。該發明在重複使用性、操作便利性、勞動減少及大規模黑水虻飼養操作的效率提升方面具有顯著優勢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a system for efficiently collecting eggs of bugs to enhance breeding practices. The system includes a plurality of planar members arranged along a central axis, spaced apart by spacers to create interstitial gaps optimized for egg-laying. Each planar member includes openings to disperse attractant odors from a container positioned adjacent to the members, attracting flies to lay eggs within the gaps. The system further includes a support rod, a spring mechanism for spacing resilience, and a vibration mechanism that facilitates egg dislodgement from the planar members onto a collection surface. A hatching container with a moisture-retentive cover is also provided for controlled egg hatching. The invention offers advantages in reusability, ease of operation, labor reduction, and enhanced efficiency in large-scale black soldier fly breeding operations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:蟲卵收集裝置</p>  
        <p type="p">102:中間間隙</p>  
        <p type="p">104:收集片</p>  
        <p type="p">110:支撐桿</p>  
        <p type="p">120:平面部件</p>  
        <p type="p">124:附加開口</p>  
        <p type="p">116:螺帽</p>  
        <p type="p">130:間隔件</p>  
        <p type="p">134:墊片</p>  
        <p type="p">140:誘引劑容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="806" publication-number="202627763"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627763.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光控指令拓展裝置與指令集</chinese-title>  
        <english-title>LIGHT CONTROL INSTRUCTION EXTENSION DEVICE AND INSTRUCTION SET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F3/01</main-classification>  
        <further-classification edition="201801120250401B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>益實實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELKA INTERNATIONAL LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭怡傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥佟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光控指令拓展裝置包含輸入介面、處理單元以及輸出介面。輸入介面經配置以自光控指令源接收光控指令。處理單元經配置以接收光控指令，並輸出經拓展光控指令。其中光控指令對應第一數量的發光元件，經拓展光控指令對應第二數量的發光元件，並且其中第一數量小於第二數量。輸出介面經配置以輸出經拓展光控指令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light control instruction extension device includes an input interface, a processing unit, and an output interface. The input interface is configured to receive a light control instruction from a light control instruction source. The processing unit is configured to receive the light control instruction and output an extended light control instruction. The light control instruction corresponds to a first number of light-emitting elements, and the extended light control instruction corresponds to a second number of light-emitting elements. Wherein the first number is smaller than the second number. The output interface is configured to output the extended light control instruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光控指令拓展裝置</p>  
        <p type="p">110:輸入介面</p>  
        <p type="p">120:處理單元</p>  
        <p type="p">130:輸出介面</p>  
        <p type="p">CI:光控指令</p>  
        <p type="p">ECI:經拓展光控指令</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="807" publication-number="202628149"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628149.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層陶瓷電容器</chinese-title>  
        <english-title>LAMINATED CERAMIC CAPACITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01G4/30</main-classification>  
        <further-classification edition="200601120250401B">C04B35/468</further-classification>  
        <further-classification edition="202501120250401B">H10D1/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禾伸堂企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLY STONE ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長井淳夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, ATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清野敬介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEINO, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種積層陶瓷電容器，包含複數偏析粒子，其尺寸為10微米以下，並存在於一有效容量部中；其中，所述複數偏析粒子大多數與內部電極層直接接觸，所述複數偏析粒子之成分包含矽元素、鹼土金屬和稀土元素，且包含矽元素之所述複數偏析粒子之濃度大於包含鹼土金屬之所述複數偏析粒子之濃度，以及包含鹼土金屬之所述複數偏析粒子之濃度大於包含稀土元素之所述複數偏析粒子之濃度。本發明之積層陶瓷電容器能維持高電容，並避免高溫或高電壓所致之絕緣電阻劣化，而具有優異的高溫負載壽命和可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a laminated ceramic capacitor, comprising a plurality of segregated particles with a size of 10 microns or less in an effective capacitance part; wherein the segregated particles are most in direct contact with the internal electrode layers, and the segregated particles have ingredients comprising Si, an alkaline earth metal, a rare earth element or a combination thereof. The segregated particles comprising Si are in a higher concentration than that of the segregated particles comprising the alkaline earth metal, and the segregated particles comprising the alkaline earth metal are in a higher concentration than that of the segregated particles comprising the rare earth element. The laminated ceramic capacitor of the present invention can maintain a high capacitance and avoid insulation resistance degradation resulting from a high temperature or a high voltage, thereby demonstrating a good high-temperature operating life and good reliability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:介電體層</p>  
        <p type="p">3:內部電極層</p>  
        <p type="p">3a:有效電極部</p>  
        <p type="p">3b:非連續部</p>  
        <p type="p">7:偏析粒子</p>  
        <p type="p">7a:複合氧化物</p>  
        <p type="p">7b:單一氧化物</p>  
        <p type="p">A,B:觀察區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="808" publication-number="202626425"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626425.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車零件之製造方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING BICYCLE PART</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250304B">B62K19/02</main-classification>  
        <further-classification edition="200601120250304B">B62K19/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台萬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARWI TAIWAN INDUSTRIAL CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白政忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, CHENG CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WEN LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡鵬年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PENG NIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種自行車零件之製造方法，包括以下步驟：在一自行車零件主體上形成至少一待黏貼區塊，該至少一待黏貼區塊之材質係為塑料，該至少一待黏貼區塊包含有一待加工表面；對該待加工表面進行等離子處理以活化得到一黏合表面，該黏合表面之表面能係大於該待加工表面之表面能；令至少一黏貼物覆設貼合於該黏合表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method of manufacturing a bicycle part, including following steps: forming at least one bonding area on a bicycle part main body, wherein a material of the bonding area is plastic, and the bonding area includes a surface to be processed; performing plasma treatment on the surface to be processed to activate it, thereby obtaining a bonding surface with a surface energy greater than that of the surface to be processed; and attaching at least one adhered object onto the bonding surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:自行車零件主體</p>  
        <p type="p">11:待黏貼區塊</p>  
        <p type="p">4:膠體</p>  
        <p type="p">5:黏貼物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="809" publication-number="202627525"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627525.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151542</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖像生成算法之訓練方法、存儲介質、光達以及車輛</chinese-title>  
        <english-title>TRAINING METHOD OF IMAGE GENERATION ALGORITHM, STORAGE MEDIUM, LIDAR AND VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250401B">G01S17/93</main-classification>  
        <further-classification edition="202001120250401B">G01S17/86</further-classification>  
        <further-classification edition="200601120250401B">G01S17/88</further-classification>  
        <further-classification edition="202201120250401B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉純為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種圖像生成算法之訓練方法，所述圖像生成算法用於將點雲資料轉換為二維圖像，包括：提供多組待測目標之點雲資料；提供多組所述待測目標之圖像資料；將多組所述點雲資料對應轉化為多組二維資料；利用多組所述二維資料以及對應之多組所述圖像資料，對所述圖像生成算法進行機器學習訓練；輸出訓練後之所述圖像生成算法。本申請還提供一種存儲介質、一種光達以及一種車輛。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a training method of an image generation algorithm. The training method of an image generation algorithm is used to convert point cloud data into two-dimensional images. The training method of an image generation algorithm includes providing point cloud data of multiple groups of objects to be tested and providing image data of a plurality of groups of the objects to be tested. The multiple sets of point cloud data are correspondingly converted into multiple sets of two-dimensional data. The image generation algorithm is trained by machine learning using the multiple sets of two-dimensional data and corresponded multiple sets of image data. The trained image generation algorithm is output. The present disclosure also provides a storage medium, a LiDAR and a vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400、S500:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="810" publication-number="202627788"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627788.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲存裝置</chinese-title>  
        <english-title>STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F3/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇瞻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APACER TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIUNN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案為一種儲存裝置，包含:儲存模組，用以供存取而進行資料讀取/寫入的操作；以及控制模組，與儲存模組電連接，控制模組控制儲存裝置的傳輸速度，且控制儲存模組之運作，其中控制模組預設複數個不同運作模式，並且從複數個運作模式中擇一運作模式執行，每一運作模式對應設定了儲存裝置的傳輸速度，且在控制模組執行任一運作模式下，儲存裝置的傳輸速度不同於控制模組執行其它運作模式時的傳輸速度。透過本發明之儲存裝置，可透過不同的運作模式來調整儲存裝置的存取效能，進而符合各種在不同能耗應用下之存取需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A storage device is disclosed. The storage device includes a storage module and a control module. The storage module is used for accessing and performing data reading/writing operations. The control module is electrically connected to the storage module, and the control module controls the transmission speed of the storage device and controls the operation of the storage module, wherein the control module presets a plurality of different operation modes, and selects one operation mode from the plurality of operation modes to execute. Each operation mode corresponds to a set transmission speed of the storage device, and when the control module executes any operation mode, the transfer speed of the storage device is different from the transfer speed when the control module executes other operating modes. Through the storage device of the present invention, the access performance of the storage device can be adjusted through different operating modes to meet various access requirements under different energy consumption applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:儲存裝置</p>  
        <p type="p">2:控制模組</p>  
        <p type="p">3:外部觸發模組</p>  
        <p type="p">4:處理單元</p>  
        <p type="p">5:傳輸介面</p>  
        <p type="p">6:處理單元</p>  
        <p type="p">fv:外部命令</p>  
        <p type="p">30:選擇設定單元</p>  
        <p type="p">31:通用輸入/輸出引腳</p>  
        <p type="p">fc:選擇信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="811" publication-number="202626141"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626141.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生理訊號偵測及電刺激系統、其電刺激裝置及其方法</chinese-title>  
        <english-title>PHYSIOLOGICAL SIGNAL DETECTION AND ELECTRICAL STIMULATION SYSTEM, ELECTRICAL STIMULATION DEVICE THEREOF AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250507B">A61N1/36</main-classification>  
        <further-classification edition="200601120250507B">A61N1/08</further-classification>  
        <further-classification edition="200601120250507B">A61N1/04</further-classification>  
        <further-classification edition="200601120250507B">A61B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪鳴亜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MING-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林楨喨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳譽元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉柏彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹竣宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙俊超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JUN-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電刺激裝置包括N個電極、N個第一電極開關、N個第二電極開關、第一控制模組及第二控制模組。N為等於或大於2的正整數。N個第一電極開關分別耦接於N個電極。N個第二電極開關分別耦接於N個電極。第一控制模組耦接N個第一電極開關。第二控制模組耦接N個第二電極開關。N個第一電極開關與第一控制模組共接點，而N個第二電極開關與第二控制模組共接點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical stimulation device includes N electrodes, N first electrode switches, N second electrode switches, a first control module and a second control module. N is a positive integer equal to or greater than 2. The N first electrode switches are respectively coupled to the N electrodes. The N second electrode switches are respectively coupled to the N electrodes. The first control module is coupled to the N first electrode switches. The second control module is coupled to the N second electrode switches. The N first electrode switches and the first control module are coupled to a common contact point, and the N second electrode switches and the second control module are coupled to a common contact point.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電刺激裝置</p>  
        <p type="p">110:第一控制模組</p>  
        <p type="p">120:第二控制模組</p>  
        <p type="p">111:第一驅動電路</p>  
        <p type="p">1111:第一非反相器</p>  
        <p type="p">1112:第一驅動器</p>  
        <p type="p">112:第二驅動電路</p>  
        <p type="p">1121:第一反相器</p>  
        <p type="p">1122:第二驅動器</p>  
        <p type="p">121:第三驅動電路</p>  
        <p type="p">1211:第二非反相器</p>  
        <p type="p">1212:第三驅動器</p>  
        <p type="p">122:第四驅動電路</p>  
        <p type="p">1221:第二反相器</p>  
        <p type="p">1222:第四驅動器</p>  
        <p type="p">E&lt;sub&gt;1&lt;/sub&gt;~E&lt;sub&gt;N&lt;/sub&gt;:電極</p>  
        <p type="p">ES&lt;sub&gt;1_1&lt;/sub&gt;~ES&lt;sub&gt;1_N&lt;/sub&gt;:第一電極開關</p>  
        <p type="p">ES&lt;sub&gt;2_1&lt;/sub&gt;~ES&lt;sub&gt;2_N&lt;/sub&gt;:第二電極開關</p>  
        <p type="p">G:接地電位</p>  
        <p type="p">I:電流</p>  
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;:第一輸入埠</p>  
        <p type="p">P&lt;sub&gt;2&lt;/sub&gt;:第二輸入埠</p>  
        <p type="p">SW1:第一開關</p>  
        <p type="p">SW2:第二開關</p>  
        <p type="p">SW3:第三開關</p>  
        <p type="p">SW4:第四開關</p>  
        <p type="p">V&lt;sub&gt;S&lt;/sub&gt;:電壓源</p>  
        <p type="p">V1:第一位準電壓</p>  
        <p type="p">V2:第二位準電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="812" publication-number="202628540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於資料中心多個高功率晶片模組的具有整合均勻流的液體冷卻組件</chinese-title>  
        <english-title>LIQUID COOLING ASSEMBLY WITH INTEGRATED UNIFORM FLOW FOR MULTIPLE HIGH-POWER CHIP MODULES ADAPTED FOR DATA CENTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K7/20</main-classification>  
        <further-classification edition="200601120250418B">F28D7/06</further-classification>  
        <further-classification edition="200601120250418B">F28F3/06</further-classification>  
        <further-classification edition="200601120250418B">F28F1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩摩亞商得樂士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELUXE POINT LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>WS</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育閎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉芸婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯　席然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳朝榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種適用於資料中心多個高功率晶片模組的具有整合均勻流的液體冷卻組件，其包含：複數個冷板，其中每個所述冷板專用於一晶片裝置的散熱；複數個歧管，連接至所述冷板，使每一個冷板具有一或多個所述歧管；複數個連接管路，連接各所述歧管以供一冷卻液體流至所述複數個冷板及所述複數個歧管；其中，所述冷板的其中相鄰兩者配置呈非齊平，以匹配一電路板上的晶片裝置布局，從而分別貼合所述晶片裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:液體冷卻組件</p>  
        <p type="p">101:第一管路</p>  
        <p type="p">102:第二管路</p>  
        <p type="p">111:第一歧管</p>  
        <p type="p">112:第二歧管</p>  
        <p type="p">113:第三歧管</p>  
        <p type="p">114:第四歧管</p>  
        <p type="p">115:第五歧管</p>  
        <p type="p">116:第六歧管</p>  
        <p type="p">117:第七歧管</p>  
        <p type="p">121:第一連接管路</p>  
        <p type="p">122:第二連接管路</p>  
        <p type="p">123:第三連接管路</p>  
        <p type="p">124:第四連接管路</p>  
        <p type="p">125:第五連接管路</p>  
        <p type="p">126:第六連接管路</p>  
        <p type="p">127:第七連接管路</p>  
        <p type="p">130:第一冷板</p>  
        <p type="p">131:第二冷板</p>  
        <p type="p">140:第三冷板</p>  
        <p type="p">150:第四冷板</p>  
        <p type="p">151:第五冷板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="813" publication-number="202628364"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628364.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於FPGA之高解析PWM的信號產生器</chinese-title>  
        <english-title>HIGH-RESOLUTION PWM SIGNAL GENERATOR BASED ON FPGA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250528B">H03K7/08</main-classification>  
        <further-classification edition="201401120250528B">H03K5/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷智吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, CHIH-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭崇廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHONG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾裕峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於FPGA之高解析PWM的信號產生器，包含：載波比較模組、選擇模組及延遲模組。載波比較模組基於第一數值產生第一PWM信號，以及基於第二數值產生第一時序控制信號及第二時序控制信號。選擇模組基於第一時序控制信號選擇性地將第一PWM信號不延遲或延遲一系統時脈週期的半週期以作為輸出信號。延遲模組依據第二時序控制信號設定小於該半週期的一延時期間，以基於輸出信號及延時期間提供一高解析PWM信號。藉此，僅需單一個延遲模組，電路架構得以簡化，系統時脈也無需提高，達到一種低成本的PWM信號產生器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-resolution PWM signal generator based on FPGA, comprising: a carrier comparison module, a selection module, and a delay module. The carrier comparison module generates a first PWM signal based on a first value and produces a first timing control signal and a second timing control signal based on a second value. The selection module selectively outputs the first PWM signal without delay or delayed by a half-cycle of the system clock as an output signal, based on the first timing control signal. The delay module sets a delay period shorter than the half-cycle according to the second timing control signal, and provides a high-resolution PWM signal based on the output signal and the delay period. By requiring only a single delay module, the circuit architecture is simplified, and the system clock does not need to be increased, achieving a low-cost PWM signal generator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">DC1:第一時序控制信號</p>  
        <p type="p">DC2:第二時序控制信號</p>  
        <p type="p">P3:第一PWM信號</p>  
        <p type="p">P:高解析PWM信號</p>  
        <p type="p">PS:輸出信號</p>  
        <p type="p">S1:第一數值</p>  
        <p type="p">S2:第二數值</p>  
        <p type="p">110:載波比較模組</p>  
        <p type="p">120:選擇模組</p>  
        <p type="p">130:延遲模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="814" publication-number="202627473"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627473.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快篩試劑裝置及聚醯胺基胺-膠金-抗體複合物之製造方法</chinese-title>  
        <english-title>RAPID TEST KIT DEVICE AND METHOD FOR MANUFACTURING POLYAMIDOAMINE-GOLD-ANTIBODY COMPLEX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250114B">G01N33/543</main-classification>  
        <further-classification edition="200601120250114B">G01N33/577</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光大科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA VISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許芝旖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁儀珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, YI SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游雅傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YA CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種快篩試劑裝置，其包括：一樣品墊、一膠金墊、一反應墊及一吸收墊，該膠金墊具有複數聚醯胺基胺-膠金-抗體複合物。本發明另關於一種聚醯胺基胺-膠金-抗體複合物之製造方法，其包括：將複數聚醯胺基胺(Polyamidoamine, PAMAM)與複數膠金結合，形成一聚醯胺基胺-膠金複合物；及將複數抗體結合至該聚醯胺基胺-膠金複合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rapid test kit device is provided, including: a sample pad, a gold conjugate pad, a reaction pad, and an absorbent pad, the gold conjugate pad including a plurality of polyamidoamine-gold-antibody complexes. The invention is further provided a method for manufacturing a polyamidoamine-gold-antibody complex, including: combining a plurality of polyamidoamines (Polyamidoamine, PAMAM) with a plurality of gold nanoparticles to form a polyamidoamine-gold complex; and binding a plurality of antibodies to the polyamidoamine-gold complex.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:快篩試劑裝置</p>  
        <p type="p">2:待測檢體</p>  
        <p type="p">11:樣品墊</p>  
        <p type="p">12:膠金墊</p>  
        <p type="p">13:反應墊</p>  
        <p type="p">14:吸收墊</p>  
        <p type="p">30:測試線</p>  
        <p type="p">31:控制線</p>  
        <p type="p">L1:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="815" publication-number="202628541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱系統及其控制方法</chinese-title>  
        <english-title>HEAT DISSIPATION SYSTEM AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250425B">H05K7/20</main-classification>  
        <further-classification edition="200601120250425B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱柏凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PO-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王婷鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳堯舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAO-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱系統，包括功率模組及至少一散熱結構。功率模組具有相對的頂面及底面。頂面及底面的至少其中之一連接至少一散熱結構。各至少一散熱結構包括基底及多個散熱鰭片。這些散熱鰭片設置於基底上並形成多個流道。此外，一種散熱系統的控制方法亦被提及。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation system includes a power module and at least one heat dissipation structure. The power module has a top surface and a bottom surface opposite to each other. The at least one of the top surface or the bottom surface is connected to the at least one heat dissipation structure. Each of the at least one heat dissipation structure includes a base and a plurality of heat dissipation fins. The plurality of heat dissipation fins are disposed on the base and form a plurality of flow channels. In addition, a control method of the heat dissipation system is also mentioned.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:散熱系統</p>  
        <p type="p">50:功率模組</p>  
        <p type="p">52:頂面</p>  
        <p type="p">54:底面</p>  
        <p type="p">56:側面</p>  
        <p type="p">100:散熱結構</p>  
        <p type="p">110:基底</p>  
        <p type="p">120:散熱鰭片</p>  
        <p type="p">124:流道</p>  
        <p type="p">130:蓋體</p>  
        <p type="p">140:歧管組件</p>  
        <p type="p">142:入口分支管路</p>  
        <p type="p">1422:入口端</p>  
        <p type="p">144:出口分支管路</p>  
        <p type="p">1442:出口端</p>  
        <p type="p">146:源頭</p>  
        <p type="p">148:閥體組件</p>  
        <p type="p">F:流入方向</p>  
        <p type="p">N:法線方向</p>  
        <p type="p">R1,R2:入口管徑</p>  
        <p type="p">r1,r2:出口管徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="816" publication-number="202626128"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626128.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>霧化器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250125B">A61M11/00</main-classification>  
        <further-classification edition="200601120250125B">A61M11/04</further-classification>  
        <further-classification edition="200601120250125B">A61M15/00</further-classification>  
        <further-classification edition="200601120250125B">A61M31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳士輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳士輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慧玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種霧化器包括：液體預儲容器、霧化模組及氣嘴組件。霧化模組具有篩孔霧化片及霧化晶片，篩孔霧化片設置於液體預儲容器之出口，霧化晶片用以作動篩孔霧化片將液體預儲容器中的液體製劑霧化。氣嘴組件具有銜接管件及氣嘴，氣嘴藉由銜接管件連通篩孔霧化片，令被霧化之液體製劑得以經過氣嘴噴出。特別地是，銜接管件設置有感測口，感測口的最佳設置於篩孔霧化片的下方，感測口連接至一氣壓感測晶片，氣壓感測晶片電性連接霧化晶片。當使用者對氣嘴呼氣時產生氣壓，氣壓由感測口經過感測通道至氣壓感測晶片，得以啟動霧化晶片作動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:霧化器</p>  
        <p type="p">110:主體</p>  
        <p type="p">150:氣嘴組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="817" publication-number="202628299"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628299.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子保險絲電路及保險絲電路系統</chinese-title>  
        <english-title>ELECTRONIC FUSE CIRCUIT AND FUSE CIRCUITRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H02H5/04</main-classification>  
        <further-classification edition="200601120250512B">H02H3/02</further-classification>  
        <further-classification edition="200601120250512B">H02H3/08</further-classification>  
        <further-classification edition="200601120250512B">H02H3/24</further-classification>  
        <further-classification edition="200601120250512B">G05B13/02</further-classification>  
        <further-classification edition="200601120250512B">G01R19/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能創半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供的電子保險絲電路包含保險絲開關及電流控制電路。保險絲開關耦接主控制節點，並據以產生輸出電流。電流控制電路耦接主控制節點，並包含開關、開關控制電路及控制致能電路。開關耦接主控制節點及子控制節點，並產生沉入電流以向下調整主控制節點的電壓位準。開關控制電路耦接子控制節點，並依據輸出電流、平均電流電壓與溫度相依電壓控制開關。控制致能電路耦接子控制節點，並在多個預設條件中的至少一者滿足時，致能開關控制電路控制開關。多個預設條件包含輸出電流超過電流閾值及保險絲開關的接面溫度超過溫度閾值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an electronic fuse circuit including a fuse switch and a current control circuit. The fuse switch is coupled to a main control node, and generates an output current accordingly. The current control circuit is coupled to the main control node, and includes a switch, a switch control circuit and a control enabling circuit. The switch is coupled to the main control node and a sub control node and generates a sinking current to adjust downwards a voltage level of the main control node. The switch control circuit is coupled to the sub control node and controls the switch according to the output current, an average current voltage and a temperature dependent voltage. The control enabling circuit is coupled to the sub control node and enables the switch control circuit to control the switch when at least one of multiple preset conditions is satisfied. The preset conditions include the output current exceeding a current threshold and a junction temperature of the fuse switch exceeding a temperature threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">71:開關控制電路</p>  
        <p type="p">73:控制致能電路</p>  
        <p type="p">107:電流控制電路</p>  
        <p type="p">371,374:放大器</p>  
        <p type="p">372,375,377:電晶體</p>  
        <p type="p">373,376:電阻</p>  
        <p type="p">378:放大器電路</p>  
        <p type="p">379:開關</p>  
        <p type="p">380:比例電路</p>  
        <p type="p">382:電壓源</p>  
        <p type="p">383,384:比較器</p>  
        <p type="p">385,386,387:反閘</p>  
        <p type="p">388:及閘</p>  
        <p type="p">389:或閘</p>  
        <p type="p">390:子開關</p>  
        <p type="p">391,395:參考節點</p>  
        <p type="p">392,396:子控制節點</p>  
        <p type="p">393,394:溫度相依電流</p>  
        <p type="p">397,398:節點</p>  
        <p type="p">701:電流產生電路</p>  
        <p type="p">703:指示電路</p>  
        <p type="p">721:電流鏡電路</p>  
        <p type="p">723:指示電路</p>  
        <p type="p">741:緩衝電路</p>  
        <p type="p">743:指示電路</p>  
        <p type="p">761:壓差產生電路</p>  
        <p type="p">763:子開關控制電路</p>  
        <p type="p">CL:限電流電壓</p>  
        <p type="p">CS:電流感測電壓</p>  
        <p type="p">IBMON:緩衝後平均電流電壓</p>  
        <p type="p">IMON:平均電流電壓</p>  
        <p type="p">ISINK1:沉入電流</p>  
        <p type="p">SS_OK:指示訊號</p>  
        <p type="p">V△I:溫度相依電壓差</p>  
        <p type="p">VC1:開關控制訊號</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">VSC:子開關控制訊號</p>  
        <p type="p">VSI1:指示訊號</p>  
        <p type="p">VSI2:指示訊號</p>  
        <p type="p">VSI3:指示訊號</p>  
        <p type="p">VTEMP:溫度監測電壓</p>  
        <p type="p">V_TJ:溫度相依電壓</p>  
        <p type="p">△VT:預設電壓差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="818" publication-number="202628002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於梯度差分累加非負矩陣分解之影像處理方法及裝置</chinese-title>  
        <english-title>IMAGE PROCESSING METHOD AND DEVICE BASED ON GRADIENT DIFFERENCE ACCUMULATION NONNEGATIVE MATRIX FACTORIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">G06V10/70</main-classification>  
        <further-classification edition="202201120250401B">G06V10/77</further-classification>  
        <further-classification edition="200601120250401B">G06F17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伯煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳映萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余奕賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於梯度差分累加（Gradient Difference Accumulation）非負矩陣分解（Nonnegative Matrix Factorization，NMF）之影像處理方法及裝置，通過計算利普希茨（Lipschitz）常數並迭代優化影像數據集矩陣的因數（Factor）矩陣，生成用於圖像特徵提取的基底（Basis）矩陣和係數矩陣。該技術通過引入利普希茨梯度代理（Surrogate）函數和梯度差分累加技術，提高了更新過程的平滑性和穩定性，減少了梯度變異性，提升了模型還原效果。與傳統非負矩陣分解技術相比，該技術無需引入額外複雜約束，提高了模型的穩定性和適應性，同時減少了計算量和對參數設置的依賴性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image processing method and device based on gradient difference accumulation and nonnegative matrix decomposition (NMF). By calculating the Lipschitz constant and iteratively optimizing the factor matrices of the image dataset matrix, a base matrix and a coefficient matrix for image feature extraction are generated. This technology improves the smoothness and stability of the update process, reduces gradient variability, and enhances the model restoration effect by introducing the Lipschitz gradient surrogate function and the gradient difference accumulation technology. Compared with traditional NMF technology, this technology does not require the introduction of additional complex constraints, subsequently improving the stability and adaptability of the model, while reducing computational complexity and dependence on parameter settings.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:利普希茨梯度代理函數模組</p>  
        <p type="p">102:樣本平均近似法模組</p>  
        <p type="p">103:因數矩陣初始化模組</p>  
        <p type="p">104:主迭代控制模組</p>  
        <p type="p">105:因數矩陣更新模組</p>  
        <p type="p">106:收斂檢查</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="819" publication-number="202628003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶洩露最小最大凹懲罰之監督式雜湊影像識別方法與裝置</chinese-title>  
        <english-title>SUPERVISED HASH IMAGE RECOGNITION METHOD AND DEVICE WITH LEAKY MINIMAX CONCAVE PENALTIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250401B">G06V10/70</main-classification>  
        <further-classification edition="202201120250401B">G06V10/77</further-classification>  
        <further-classification edition="202301120250401B">G06N3/088</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳伯煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬筠雰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YUN-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余奕賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種帶洩露最小最大凹懲罰（Leaky Minimax Concave Penalty，LMCP）之監督式雜湊（Supervised Hash）影像識別方法與裝置，執行以下步驟：輸入影像數據，應用徑向基函數（Radial Basis Function，RBF）映射，構建相似度矩陣；初始化雜湊編碼和投影矩陣，設置相關超參數和學習率，進行梯度（Gradient）下降學習；迭代更新編碼和矩陣直至收斂或達到迭代限制；輸出訓練集雜湊編碼和投影矩陣，用於測試數據映射和影像識別。本方法使用LMCP損失函數，提高參數穩定性，尤其在雜訊環境下，能增強分類準確性和效率。LMCP函數在保持雜湊碼強健性方面表現優異，特別是在處理雜訊數據時。本發明還確保投影矩陣精確擬合數據。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A supervised hash image recognition method and device with Leaky Minimax Concave Penalty (LMCP) loss, which performs the following steps: 1) Input image data, apply radial basis function (RBF) mapping to transform the data, subsequently constructing a similarity matrix to represent relationships between images; 2) Initialize hash encodings and the projection matrix, set hyperparameters, and define the learning rate.; 3) Iteratively update the encoding and matrix until convergence or the maximum number of iterations is reached; 4) Generate the hash encodings and projection matrix from the training data. Use these to map test data for image recognition. . This method uses the LMCP loss to improve parameter stability, especially in noisy environments, which can enhance classification accuracy and efficiency. The LMCP function performs excellently in maintaining the robustness of hash codes, especially when dealing with noisy data. The present invention also ensures that the projection matrix accurately fits the data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:半定鬆弛化簡約束並由低秩半定規劃改寫雜湊目標函數模組</p>  
        <p type="p">102:多數最小化演算法構建凸替代函數並由交替方向乘子演算法更新雜湊碼模組</p>  
        <p type="p">103:多數最小化演算法構建凸替代函數並由交替方向乘子演算法更新投影矩陣模組</p>  
        <p type="p">104:演算法是否達到最大迭代次數判斷模組</p>  
        <p type="p">105:輸出雜湊編碼及投影矩陣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="820" publication-number="202628447"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628447.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可重構智慧反射面的波束管理與追蹤的系統及方法</chinese-title>  
        <english-title>BEAM MANAGEMENT AND TRACKING SYSTEM AND METHOD FOR RECONFIGURABLE INTELLIGENT SURFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250602B">H04W24/10</main-classification>  
        <further-classification edition="200901120250602B">H04W24/08</further-classification>  
        <further-classification edition="201701120250602B">H04B7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍紹勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SAU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱新栗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, HSIN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯俊先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種智慧反射面的波束管理與追蹤的方法，包括:藉由基地台測量或接收使用者裝置的測量報告；基於測量報告及使用者裝置的數目，計算使用者裝置的位置以及提供至使用者裝置的波束；基於該數目、位置以及量測報告計算第一波束配置週期的週期長度以及第二波束配置週期的週期長度；在第一波束配置週期中，藉由反射面產生第一波束群以對使用者裝置進行追蹤；以及在第二波束配置週期中，藉由反射面產生的第二波束群提供波束服務使用者裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a method for beam management and tracking for reconfigurable intelligent surface (RIS), comprising: receiving measurement reports from a base station or from user devices by a base station; calculating positions of the user devices and RIS beams provided to the user devices based on the measurement reports and a number of the user devices; calculating a first beam configuration period length and a second beam configuration period length according to the number, the positions and the measurement reports; generating a first grid of beams by reflective surfaces to track the user devices in the first beam configuration period and a second grid of beams by the reflective surfaces to serve the user devices in the second beam configuration period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">510、520、530、540、550、560、570:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="821" publication-number="202627138"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627138.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濺鍍設備的反應腔室內的構件的表面塗層結構</chinese-title>  
        <english-title>SURFACE COATING STRUCTURE OF COMPONENTS IN THE REACTION CHAMBER OF SPUTTERING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250424B">C23C14/14</main-classification>  
        <further-classification edition="200601120250424B">C23C14/34</further-classification>  
        <further-classification edition="200601120250424B">C23C14/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>世禾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳學哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERN, SHYUE-JER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種濺鍍設備的反應腔室內的構件的表面塗層結構，適用以鉭或鎢作為濺鍍靶材的濺鍍射備，表面塗層結構包括一鋁熔射層以及一鎳鋁熔射層。該鋁熔射層設置於該濺鍍設備的反應腔室內的構件的外表面，且其厚度介於200～350 &lt;img align="absmiddle" height="47px" width="79px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。該鎳鋁熔射層設置於該鋁熔射層的外表面，且其厚度介於50～150 &lt;img align="absmiddle" height="47px" width="79px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。藉此，因為本發明的表面塗層結構在鋁熔射層的外表面增加鎳鋁熔射層，且濺鍍設備是以鉭或鎢作為濺鍍靶材，因此由鎳鋁熔射層能提高與濺鍍靶材的附著效果，延長附著時間，從而讓濺鍍設備的清洗作業的周期延較長，清洗作業次數下降，減少清洗作業成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface coating structure of components in a reaction chamber of sputtering equipment is suitable for sputtering equipment using tantalum or tungsten as a sputtering target. The surface coating structure includes an aluminum spray layer and a nickel-aluminum spray layer. The aluminum spray layer is disposed on the outer surface of the components in the reaction chamber of the sputtering equipment, and its thickness is between 200 and 350 &lt;img align="absmiddle" height="47px" width="79px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The nickel-aluminum spray layer is disposed on the outer surface of the aluminum spray layer, and its thickness is between 50 and 150 &lt;img align="absmiddle" height="47px" width="79px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. Such that, because the surface coating structure of the present invention adds a nickel-aluminum spray layer on the outer surface of the aluminum spray layer, and the sputtering equipment uses tantalum or tungsten as the sputtering target, the nickel-aluminum spray layer can improve the adhesion effect to the sputtering target and prolong the adhesion time. Therefore, the cleaning operation cycle of the sputtering equipment is longer, the number of cleaning operations is reduced, and the cost of cleaning operations is reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:表面塗層結構</p>  
        <p type="p">20:濺鍍設備的反應腔室內的構件</p>  
        <p type="p">21:濺鍍圓盤</p>  
        <p type="p">22:濺鍍圓環</p>  
        <p type="p">23:濺鍍彎刀</p>  
        <p type="p">24:濺鍍防著環</p>  
        <p type="p">25:濺鍍外防著環</p>  
        <p type="p">26:濺鍍內防著環</p>  
        <p type="p">27:濺鍍支棒</p>  
        <p type="p">28:濺鍍套筒</p>  
        <p type="p">29:濺鍍支撐棒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="822" publication-number="202627975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供銀行應用程式叫車並於分行取號之裝置及方法</chinese-title>  
        <english-title>DEVICE FOR PROVIDING BANK APPLICATION TO CALL TAXI AND DRAWING NUMBER OF BANK BRANCH AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250109B">G06Q50/47</main-classification>  
        <further-classification edition="202301120250109B">G06Q40/02</further-classification>  
        <further-classification edition="202301120250109B">G06Q30/015</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣中小企業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN BUSINESS BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡育呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提供銀行應用程式叫車並於分行取號之裝置及方法，其透過銀行應用程式傳送使用者輸入之叫車資訊與待辦業務給銀行伺服器，並由銀行伺服器將叫車資訊轉送給派車伺服器以進行叫車後，銀行伺服器接收派車伺服器所傳回的抵達時間，並判斷叫車資訊中之目的地點為銀行分行且抵達時間為銀行分行之營業時間時，傳送抵達時間給分行服務主機，使分行服務主機依據抵達時間、待辦業務之當前等待人數與平均等待時間決定取號時間，並於取號時間取得預約號碼之技術手段，可以在乘車時便完成預約抽號，達成減少到銀行辦理業務之等待時間的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for providing a bank application to call a taxi and drawing a number of a bank branch and a method thereof are provided. By sending a ride-hailing information and to-do business input by the user to the bank server from a bank application, transferring the ride-hailing information to a dispatch server from the bank server, receiving an arrival time returned from the dispatch server by the bank server, sending the arrival time to a branch service host from the bank server when a destination in the ride-hailing information is a bank branch and the arrival time is business hours of the bank branch, determining a pick-up time based on the arrival time, current number of people waiting for service of the to-do business and average waiting time of the service of the to-do business by the branch service host, and obtaining a reservation number at the pick-up time by the branch service host, the device and the method can complete draw a number while riding, and can achieve the effect of reducing waiting time for bank business.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:客戶端所執行之銀行應用程式取得叫車資訊及待辦業務，並傳送叫車資訊及待辦業務至銀行伺服器</p>  
        <p type="p">步驟310:銀行伺服器傳送叫車資訊至派車伺服器，派車伺服器依據叫車資訊產生並傳送派車訊息至派遣車輛</p>  
        <p type="p">步驟320:派車伺服器依據派遣車輛之預定行車路線取得派遣車輛抵達目的位置之抵達時間，並傳送抵達時間至銀行伺服器</p>  
        <p type="p">步驟330:銀行伺服器判斷目的位置為銀行分行且抵達時間為銀行分行之營業時間時，傳送抵達時間與待辦業務至分行服務主機</p>  
        <p type="p">步驟350:分行服務主機依據抵達時間、待辦業務之當前等待人數與平均等待時間決定取號時間，並於取號時間取得與待辦業務對應之預約號碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="823" publication-number="202627976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供銀行應用程式叫車並推薦銀行服務之裝置及方法</chinese-title>  
        <english-title>DEVICE FOR PROVIDING BANK APPLICATION TO CALL TAXI AND RECOMMEND BANKING SERVICE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250109B">G06Q50/47</main-classification>  
        <further-classification edition="202301120250109B">G06Q40/02</further-classification>  
        <further-classification edition="202301120250109B">G06Q30/015</further-classification>  
        <further-classification edition="201201120250109B">G06Q10/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣中小企業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN BUSINESS BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡育呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提供銀行應用程式叫車並推薦銀行服務之裝置及方法，其透過客戶端所執行之銀行應用程式傳送含起點位置與目的位置之叫車資訊至銀行伺服器後，銀行伺服器分析與目的位置相關的銀行業務並產生與該銀行業務對應的服務推薦訊息，使客戶端輸出服務推薦訊息給銀行客戶之技術手段，可以達成有效給予使用者與叫車服務之目的地相關之銀行業務的資訊之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for providing a bank application to call a taxi and recommend a banking service and a method thereof are provided. By sending a ride-hailing information including a starting location and a destination location to a bank server from a bank application executed by a client, analyzing a banking service related to the destination location and generating a service recommendation message corresponding to the banking service by the bank server, and outputting the service recommendation message to a bank customer using the client by the bank application, the device and the method can achieve the effect of providing users with banking information related to destination of the ride-hailing service.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:客戶端所執行之銀行應用程式取得叫車資訊，並傳送叫車資訊至銀行伺服器</p>  
        <p type="p">步驟310:銀行伺服器解析目的位置之地點類型，並判斷與地點類型相關之銀行業務</p>  
        <p type="p">步驟330:銀行伺服器產生與銀行業務對應之服務推薦訊息，並傳送服務推薦訊息至客戶端</p>  
        <p type="p">步驟350:客戶端透過語音或文字輸出服務推薦訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="824" publication-number="202627926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依據信用卡消費資料推薦銀行服務之裝置及方法</chinese-title>  
        <english-title>DEVICE FOR RECOMMENDING BANKING SERVICE BASED ON CREDIT CARD CONSUMPTION INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250109B">G06Q30/015</main-classification>  
        <further-classification edition="202301120250109B">G06Q30/02</further-classification>  
        <further-classification edition="202301120250109B">G06Q30/0241</further-classification>  
        <further-classification edition="202301120250109B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣中小企業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN BUSINESS BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡育呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種依據信用卡消費資料推薦銀行服務之裝置及方法，其透過分析銀行客戶之信用卡消費資料以判斷銀行客戶可能的銀行業務需求後，產生與銀行業務需求對應的服務推薦訊息，使客戶端的銀行應用程式輸出服務推薦訊息給銀行客戶之技術手段，可以減少造成銀行客戶困擾的推播訊息，並達成依據銀行客戶之消費狀況主動給予相關銀行業務辦理訊息的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for recommending a banking service based on credit card consumption information and a method thereof are provided. By analyzing credit card consumption information of a bank customer to determine possible banking business needs of the bank customer, generating a service recommendation message corresponding to the banking business needs, and outputting the service recommendation message to the bank customer by a banking application executed on a client, the device and the method can reduce push messages that cause confusion to bank customers, and can achieve the effect of proactively providing relevant banking business information based on the consumption status of bank customer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:取得銀行客戶之信用卡消費資料</p>  
        <p type="p">步驟305:取得銀行客戶使用客戶端上所執行之銀行應用程式註冊時所記錄之對應關係依據對應關係</p>  
        <p type="p">步驟310:分析信用卡消費資料以判斷銀行客戶之銀行業務需求</p>  
        <p type="p">步驟320:產生與銀行業務對應之服務推薦訊息，並依據對應關係傳送服務推薦訊息至銀行應用程式</p>  
        <p type="p">步驟330:銀行應用程式透過語音或文字輸出服務推薦訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="825" publication-number="202627931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依據刷卡記錄與使用者對話以推薦商品之系統及方法</chinese-title>  
        <english-title>DEVICE FOR COMMUNICATING WITH USER BASED ON CREDIT CARD TRANSACTION RECORDS TO RECOMMEND PRODUCTS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250109B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250109B">G06Q30/0241</further-classification>  
        <further-classification edition="202301120250109B">G06Q30/06</further-classification>  
        <further-classification edition="202301120250109B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣中小企業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN BUSINESS BANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡育呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種依據刷卡記錄與使用者對話以推薦商品之系統及方法，其透過銀行伺服器分析銀行客戶之歷史刷卡資料以產生消費趨勢訊息後，使用生成式語言模型產生對話訊息以使銀行應用程式使用語音或文字輸出對話訊息與使用者互動，並依據與使用者的互動內容調整消費趨勢訊息中之主流商品的權重值，及依據調整後之主流商品的權重值確定推薦使用者購買的主流商品之技術手段，可以讓銀行端推薦符合銀行客戶之購買需求的商品，並達成提高銀行客戶購買銀行端推薦商品之意願的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for communicating with a user based on credit card transaction records to recommend products and a method thereof are provided. By analyzing historical credit card transaction records of bank customers to generate consumption trend information by a bank server, using a generative language model to generate dialogue messages by the bank server, using voice and/or text to output the dialogue messages to interact with the user by a bank application after the bank application receives the dialogue messages from the bank server, adjusting weight of products in the consumer trend information based on the interaction with the user by the bank server, and determining recommend products that the user is recommended to purchase based on the adjusted weight of the products by the bank server, the device and the method can meet bank recommend products and purchasing needs of bank customers, and can achieve the effect of increasing bank customers’ willingness to purchase bank-recommended products.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:銀行伺服器取得銀行客戶之歷史刷卡記錄</p>  
        <p type="p">步驟310:銀行伺服器分析銀行客戶之歷史刷卡資料以產生消費趨勢訊息，消費趨勢訊息包含主流商品之商品資訊</p>  
        <p type="p">步驟330:銀行伺服器分析使用者之銀行客戶資料以產生潛在需求</p>  
        <p type="p">步驟340:銀行伺服器依據潛在需求中之需求商品與主流商品之相似度設定主流商品之權重值</p>  
        <p type="p">步驟350:銀行伺服器提供主流商品之商品資訊與權重值給生成式語言模型</p>  
        <p type="p">步驟360:銀行伺服器使用生成式語言模型產生對話訊息，使銀行應用程式以語言及/或文字輸出對話訊息以持續與使用者進行互動，且銀行伺服器依據使用者在互動中之回應訊息調整主流商品之權重值，並向生成式語言模型更新調整後之主流商品之權重值</p>  
        <p type="p">步驟370:銀行伺服器依據主流商品之權重值確定推薦商品</p>  
        <p type="p">步驟380:銀行應用程式推薦使用者購買推薦商品</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="826" publication-number="202627732"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627732.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有漏電流補償的能帶隙參考電壓電路</chinese-title>  
        <english-title>BANDGAP REFERENCE CIRCUIT WITH LEAKAGE CURRENT COMPENSATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G05F3/30</main-classification>  
        <further-classification edition="200601120250501B">G05F3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施銘憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, MING-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張岱瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TAI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種能帶隙參考電壓產生電路包括：第一及第二雙極性接面電晶體(BJT)，以第一及第二電流密度偏置，藉此第一及第二雙極性接面電晶體之基極-射極電壓具有基極-射極電壓差，其中第一BJT用以決定負溫度係數訊號；壓差感測電阻，自接地電位與第二雙極性接面電晶體串聯耦接以形成子支路，壓差感測電阻位於靠近接地電位側；及迴授電路，用以控制子支路與第一雙極性接面電晶體具有相同跨壓，藉此壓差感測電阻上的跨壓包括基極-射極電壓差，進而決定正溫度係數訊號；迴授電路更根據正溫度係數訊號與負溫度係數訊號產生具有溫度係數為0的參考電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bandgap reference circuit includes: first and second bipolar junction transistors (BJT) biased at first and second current densities respectively, such that the base-emitter voltages of the first and second BJTs have a base-emitter voltage difference. The first BJT is configured to determine a negative temperature coefficient (CTAT) signal. A differential sensing resistor is series-coupled between ground potential and the second BJT to form a sub-branch, with the differential sensing resistor located closer to the ground potential side. A feedback circuit is configured to control the sub-branch and the first BJT to have the same voltage drop, such that the voltage drop across the differential sensing resistor includes the base-emitter voltage difference, thereby determining a positive temperature coefficient (PTAT) signal. The feedback circuit further generates a reference voltage with a zero temperature coefficient based on the PTAT signal and the CTAT signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:能帶隙參考電壓產生電路</p>  
        <p type="p">401:迴授電路</p>  
        <p type="p">430:子支路</p>  
        <p type="p">440:回授放大電路</p>  
        <p type="p">D1:Q1集極-體極間之寄生二極體</p>  
        <p type="p">D2:Q2集極-體極間之寄生二極體</p>  
        <p type="p">Ictat1:負溫度係數電流</p>  
        <p type="p">Iptat2:正溫度係數電流</p>  
        <p type="p">Iq1sl,Iq2sl:漏電流</p>  
        <p type="p">N:Q1與Q2面積比參數</p>  
        <p type="p">Q1,Q2:雙極性接面電晶體</p>  
        <p type="p">R3:壓差感測電阻</p>  
        <p type="p">Sctat:負溫度係數訊號</p>  
        <p type="p">Sptat:正溫度係數訊號</p>  
        <p type="p">VA,VB:跨壓</p>  
        <p type="p">Vbg:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="827" publication-number="202625931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151573</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>凹形方管置物架</chinese-title>  
        <english-title>CONCAVE SQUARE TUBE STORAGE SHELF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250225B">A47B47/00</main-classification>  
        <further-classification edition="200601120250225B">A47B96/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盈太企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROTREND CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳順義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種凹形方管置物架，包括複數個立柱組、多個置物層及多個層板。這些立柱組分別包括凹形方管及多個凸型被扣件，這些凸型被扣件每隔一段距離分別組設於凹形板件，且凸型被扣件包括被扣件本體、凸塊及兩組裝缺口，凸塊連接於被扣件本體，凸塊之兩側具有組裝缺口。置物層包括層架及多個扣件，這些扣件設於層架，這些扣件分別扣合於相對應之組裝缺口，以將這些置物層固定於這些立柱組之間。這些層板分別設於相對應之置物層之上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A concave square tube storage shelf is provided. The concave square tube storage shelf includes a plurality of post components, several storage layers, and multiple shelves. These post components includes a concave square tube and multiple convex fasteners. These convex fasteners are arranged at intervals along the concave tube, with each fastener comprising a main body, a convex block, and two assembly notches. The convex block is connected to the main body of the fastener, with assembly notches on both sides of the convex block. The storage layers include a frame and multiple fasteners. These fasteners are attached to the frame, and they engage with corresponding assembly notches to secure the storage layers between the post components. The shelves are placed on top of the corresponding storage layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:凹形方管置物架</p>  
        <p type="p">110:立柱組</p>  
        <p type="p">110A:第一種立柱組</p>  
        <p type="p">110B:第二種立柱組</p>  
        <p type="p">112:凹形方管</p>  
        <p type="p">120:置物層</p>  
        <p type="p">130:層板</p>  
        <p type="p">132:層板本體</p>  
        <p type="p">134:缺口部</p>  
        <p type="p">170:腳柱</p>  
        <p type="p">L1:堆疊方向</p>  
        <p type="p">L2:第一組裝方向</p>  
        <p type="p">LA:升降方向</p>  
        <p type="p">LB:橫向方向</p>  
        <p type="p">T1:上端</p>  
        <p type="p">T2:下端</p>  
        <p type="p">TA:組裝端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="828" publication-number="202628263"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628263.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151574</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>端子保護蓋及具有該端子保護蓋的電子設備</chinese-title>  
        <english-title>TERMINAL PROTECTION COVER AND ELECTRONIC APPARATUS WITH THE TERMINAL PROTECTION COVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250210B">H01R13/44</main-classification>  
        <further-classification edition="200601120250210B">H01R13/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳欣伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾裕峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係為一種端子保護蓋，用於可拆地組裝至電子裝置以遮蓋其上的連接部，以使連接部及其上的端子被遮蔽與隔離，防止使用者或維護人員因誤觸暴露的高功率或高電壓端子，端子保護蓋包含本體及擋板，本體包括遮蓋部及二組裝部，二組裝部用於與電子裝置可拆地固定在一起，二組裝部與遮蓋部之間界定一容置區，且遮蓋部與二組裝部在容置區的二側形成第一走線窗及第二走線窗；擋板可拆地安裝於本體上，以供第一走線窗及第二走線窗選擇式地開放或被封閉，具備使用上的靈活性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure pertains to a terminal protection cover configured to be detachably assembled onto an electronic device to cover its connection portion, thereby shielding and isolating the connection portion and its terminals. This prevents users or maintenance personnel from accidentally contacting exposed high-power or high-voltage terminals. The terminal protection cover includes a main body and a baffle. The main body comprises a covering portion and two assembly portions. The two assembly portions are configured to be detachably secured to the electronic device. A receiving region is defined between the two assembly portions and the covering portion, and the covering portion and the two assembly portions form a first wiring window and a second wiring window on both sides of the receiving region. The baffle is detachably installed on the main body to selectively open or close the first and second wiring windows, offering flexibility in use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:端子保護蓋</p>  
        <p type="p">110:本體</p>  
        <p type="p">111:遮蓋部</p>  
        <p type="p">112,113:組裝部</p>  
        <p type="p">120:擋板</p>  
        <p type="p">123:肋條</p>  
        <p type="p">R:容置區</p>  
        <p type="p">E1:第一邊緣</p>  
        <p type="p">E2:第二邊緣</p>  
        <p type="p">W1:第一走線窗</p>  
        <p type="p">W2:第二走線窗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="829" publication-number="202625928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>牙刷及其製造方法</chinese-title>  
        <english-title>TOOTHBRUSH AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250125B">A46B9/04</main-classification>  
        <further-classification edition="200601120250125B">A46B5/02</further-classification>  
        <further-classification edition="200601120250125B">A46B5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍昌兄弟股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACUMEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃守仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHOU REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種牙刷，包含握把以及刷頭，刷頭具有底座以及複數間隔配置之筒體，複數筒體分別以外徑較小之連接部連接於底座之正面，且具有一貫穿孔貫穿於筒體、連接部以及底座，另有可撓性座體覆設於底座之背面，且延伸有充填於貫穿孔內之填充部，本發明透過各自獨立的筒體來固定刷毛組，且利用可撓性的填充部讓複數筒體可左右晃動，因此當使用者在使用本發明時，刷毛組在抵靠到牙齒而彎曲後，筒體也會一併產生形變而彎曲，進而使刷毛組的彎曲程度能夠提高，具有較佳的潔牙效果及供使用者操作的方便性，同時可撓性填充部吸收使用者施加之過大力量，進而避免牙齦受損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a toothbrush comprising a handle and a brush head. The brush head includes a base and multiple cylindrical bodies arranged at intervals. Each cylindrical body is connected to the front surface of the base via a connecting section with a smaller outer diameter and has a through-hole that penetrates the cylindrical body, connecting section, and base. Additionally, a flexible seating element is mounted on the back surface of the base, extending into the through-holes as filling sections. This invention secures the bristle assemblies using the independent cylindrical bodies and allows the cylindrical bodies to sway laterally via the flexible filling sections. When users employ this toothbrush, the bristle assemblies bend upon contact with teeth, and the cylindrical bodies deform and bend accordingly. This enhances the bending degree of the bristle assemblies, resulting in improved cleaning performance and ease of use. Furthermore, the flexible filling sections absorb excessive force applied by the user, thereby preventing gum damage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:握把</p>  
        <p type="p">21:底座</p>  
        <p type="p">212:背面</p>  
        <p type="p">22:筒體</p>  
        <p type="p">221:凹槽</p>  
        <p type="p">23:可撓性座體</p>  
        <p type="p">231:本體</p>  
        <p type="p">232:填充部</p>  
        <p type="p">24:連接部</p>  
        <p type="p">25:貫穿孔</p>  
        <p type="p">31:刷毛</p>  
        <p type="p">311:彎折段</p>  
        <p type="p">32:固定金屬片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="830" publication-number="202625929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>牙刷之刷頭及其製造方法</chinese-title>  
        <english-title>TOOTHBRUSH HEAD AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250331B">A46B9/04</main-classification>  
        <further-classification edition="200601120250331B">A46B7/00</further-classification>  
        <further-classification edition="200601120250331B">A46B5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍昌兄弟股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACUMEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃守仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHOU REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種牙刷之刷頭，牙刷具有一握把以及一刷頭，刷頭具有一底座、複數筒體以及一可撓性座體，底座係由握把一體延伸，複數筒體係相互間隔配置於底座之上且與底座之間具有間距，而可撓性座體則可填充於間距以連接複數筒體與底座，本發明透過各自獨立配置的筒體來固定刷毛組，且利用可撓性座體連接複數筒體與底座讓筒體可左右晃動，因此當使用者在使用本發明時，刷毛組在抵靠到牙齒而彎曲後，筒體也會一併產生形變而彎曲，進而使刷毛組的彎曲程度能夠提高，具有較佳的潔牙效果及供使用者操作的方便性，同時可撓性填充部吸收使用者施加之過大力量，進而避免牙齦受損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a toothbrush head, where the toothbrush includes a handle and a head. The toothbrush head consists of a base, multiple cylindrical bodies, and a flexible seating element. The base extends integrally from the handle, and the cylindrical bodies are arranged at intervals on the base, creating gaps between them and the base. The flexible seating element fills these gaps, connecting the cylindrical bodies to the base. This invention secures the bristle assemblies using individually arranged cylindrical bodies and connects the cylindrical bodies to the base via the flexible seating element, allowing the cylindrical bodies to sway laterally. When the user employs the toothbrush, the bristle assemblies bend upon contact with the teeth, and the cylindrical bodies deform and bend simultaneously. This increases the bending degree of the bristle assemblies, enhancing cleaning efficiency and user convenience. Moreover, the flexible seating element absorbs excessive force applied by the user, preventing gum damage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:握把</p>  
        <p type="p">20:刷頭</p>  
        <p type="p">21:底座</p>  
        <p type="p">213:第一穿孔</p>  
        <p type="p">22:筒體</p>  
        <p type="p">221:第二穿孔</p>  
        <p type="p">222:段差部</p>  
        <p type="p">23:可撓性座體</p>  
        <p type="p">231:本體</p>  
        <p type="p">232:填充部</p>  
        <p type="p">24:間距</p>  
        <p type="p">31:刷毛</p>  
        <p type="p">32:熱熔部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="831" publication-number="202628610"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628610.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151582</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溝槽式功率半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250307B">H10D30/01</main-classification>  
        <further-classification edition="202501120250307B">H10D30/60</further-classification>  
        <further-classification edition="202501120250307B">H10D62/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創圓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPWELL TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林靖璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種溝槽式功率半導體裝置，包括一半導體基材、一漂移層、一第一溝槽、一第一摻雜區、一第二摻雜區及一閘極，該漂移層設置在該半導體基材且具有一主表面，該第一溝槽形成於該漂移層，該第一摻雜區設置於該漂移層且包括一第一部分及一第二部分，該第一部分相鄰於該主表面，該第二部分相鄰於該第一溝槽，該第二摻雜區設置於該第一摻雜區且包括一第三部分及一第四部分，分別位於該第一部分及該第二部分。該閘極設置於該第一溝槽，該第一溝槽的一底部角落與該第一溝槽下方的該第一摻雜區的一側向邊緣之間形成一橫向錯位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:N+型基板</p>  
        <p type="p">901:N-型漂移層</p>  
        <p type="p">902:P型區域</p>  
        <p type="p">902a:第一P型部分</p>  
        <p type="p">902b:第二P型部分</p>  
        <p type="p">903:N+型區域</p>  
        <p type="p">903a:第一N+型部分</p>  
        <p type="p">903b:第二N+型部分</p>  
        <p type="p">904:P+型柱</p>  
        <p type="p">904a:第一P+型柱</p>  
        <p type="p">904b:第二P+型柱</p>  
        <p type="p">905:閘極氧化物</p>  
        <p type="p">906:閘極</p>  
        <p type="p">907:氧化物層</p>  
        <p type="p">908:金屬層</p>  
        <p type="p">TR1:第一溝槽</p>  
        <p type="p">TR2:第二溝槽</p>  
        <p type="p">SW:側壁</p>  
        <p type="p">D:橫向錯位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="832" publication-number="202627615"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627615.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於核酸檢測裝置之照明系統及光學檢測系統</chinese-title>  
        <english-title>ILLUMINATION SYSTEM AND ILLUMINATION DETECTING SYSTEM FOR NUCLEIC ACID DETECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250408B">G02B27/09</main-classification>  
        <further-classification edition="200601120250408B">G02B27/10</further-classification>  
        <further-classification edition="200601120250408B">G02B5/20</further-classification>  
        <further-classification edition="200601120250408B">G01N21/84</further-classification>  
        <further-classification edition="200601120250408B">G01N33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商台達電子國際（新加坡）私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　勃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　景開</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEONG, JING KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種適用於核酸檢測裝置之照明系統及光學檢測系統，照明系統包含：光源模組、場鏡系統、激發濾光輪及照明稜鏡模組。照明稜鏡模組包含：分束器、多個反射鏡、至少二個道威稜鏡及至少二個傾斜反射鏡。其中，光源模組發射一光束至場鏡系統進行光束整直及整形，再經由激發濾光輪進行濾光，並使光束進入照明稜鏡模組之分束器，以區分為至少兩道光束，並透過多個反射鏡調整至少兩道光束之方向，使其分別經過至少二個道威稜鏡，再透過至少二傾斜反射鏡，使至少兩道光束以不同方向照射至樣本之照明區域上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An illumination system and an illumination detecting system for a nucleic acid detection device are disclosed. The illumination system includes a light source module, a field lens system, an excitation filter wheel and an illumination prism module. The illumination prism module includes a beam splitter, a plurality of mirrors, at least two dove prisms, and at least two tilting mirrors, wherein the light source module emits a light beam to the field lens system for beam straightening and shaping, and then passes through the excitation filter wheel for filtering. The light beam then enters the beam splitter of the illumination prism module to separate it into at least two beams. After that, the directions of the at least two light beams are adjusted through the plurality of mirrors, pass through the at least two dove prisms respectively, and then are reflected by the at least two tilting mirrors and converge on an illumination area of ​​the sample in different directions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:照明系統</p>  
        <p type="p">2:光源模組</p>  
        <p type="p">21:雷射驅動之白光源套件</p>  
        <p type="p">3:場鏡系統</p>  
        <p type="p">30:長形套管</p>  
        <p type="p">31:稜鏡</p>  
        <p type="p">4:激發濾光輪</p>  
        <p type="p">5:照明稜鏡模組</p>  
        <p type="p">51:第一反射鏡</p>  
        <p type="p">52:分束器</p>  
        <p type="p">53:反射鏡</p>  
        <p type="p">54:道威稜鏡</p>  
        <p type="p">55:傾斜反射鏡</p>  
        <p type="p">550:鏡座</p>  
        <p type="p">553:精細調整螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="833" publication-number="202626387"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626387.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車用系統</chinese-title>  
        <english-title>VEHICLE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250407B">B60K35/00</main-classification>  
        <further-classification edition="202201120250407B">B60R1/20</further-classification>  
        <further-classification edition="200601120250407B">B60H1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐立恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, LI-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃騰瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TENG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧俊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴保勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PAO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種車用系統。所述車用系統包括中控台、駕駛側電子鏡以及處理器。中控台包括暖通空調裝置。駕駛側電子鏡包括監控攝影機，其中處理器接收車輛內部參數，其中車輛內部參數包括駕駛疲勞值以及駕駛視線，其中處理器通過監控攝影機來接收駕駛疲勞值以及駕駛視線；處理器利用車輛內部參數以及車輛外部參數來設置暖通空調裝置的溫度、風量以及風向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vehicle system is provided. The vehicle system includes a CID, a driver side E-Mirror and a processor. The CID includes a HVAC device. The driver side E-Mirror includes a monitoring camera, wherein the processor receives a vehicle internal parameter, wherein the vehicle internal parameter includes a driving fatigue value and a driving sight line, wherein the processor receives the driving fatigue value and the driving sight line through the monitoring camera; the processor uses the vehicle internal parameter and a vehicle external parameter to configure a temperature, an air volume, and an air direction of the HVAC device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:車用系統</p>  
        <p type="p">110:中控台</p>  
        <p type="p">111:暖通空調裝置</p>  
        <p type="p">112:車用資訊娛樂裝置</p>  
        <p type="p">120:駕駛側電子鏡</p>  
        <p type="p">121:監控攝影機</p>  
        <p type="p">130:處理器</p>  
        <p type="p">140:儀表板</p>  
        <p type="p">150:乘客側電子鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="834" publication-number="202628500"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628500.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傳感器線路板及其製造方法</chinese-title>  
        <english-title>TRANSDUCER WIRE BOARD AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05K1/11</main-classification>  
        <further-classification edition="200601120260401B">H05K1/16</further-classification>  
        <further-classification edition="200601120260401B">H05K3/46</further-classification>  
        <further-classification edition="202601120260401B">H05K3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李成佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種傳感器線路板及其製造方法，包含活動單元、限位單元及固定單元。活動單元包含中心區塊、第一彈性區塊、第二彈性區塊及設置於中心區塊上的活動線路層。第一彈性區塊沿X軸向設置於中心區塊的兩側，第二彈性區塊沿Y軸向設置於中心區塊的兩側。活動線路層沿Y軸向設置於中心區塊的兩側。限位單元包含沿X軸向設置於第一彈性區塊兩側的X軸限位區塊及沿Y軸向設置於第二彈性區塊兩側的Y軸限位區塊。固定單元間隔設置於活動單元周圍，並包含設置於第一彈性區塊相對兩側的固定線路層及設置於此固定線路層上的另一固定線路層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transducer wire board and a method for manufacturing the same are provided. The transducer wire board includes movable unit, limiting unit and fixed unit. The movable unit includes a central region, a first elastic region, a second elastic region and a movable circuit layer arranged on the central region. The first elastic region is arranged on both sides of the central region along with the X-axis, and the second elastic region is arranged on both sides of the central region along with the Y-axis. The movable circuit layer is arranged on both sides of the central region along with the Y-axis. The limiting unit includes an X-axis limiting region arranged on both sides of the first elastic region along with the X-axis and a Y-axis limiting region arranged on both sides of the second elastic region along with the Y-axis. The fixed unit is spaced around the movable unit and includes fixed circuit layers disposed on opposite sides of the first elastic region and another fixed circuit layer disposed on the fixed circuit layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:傳感器線路板</p>  
        <p type="p">110:活動單元</p>  
        <p type="p">111:中心區塊</p>  
        <p type="p">112a,112b,114a,114b:彈性區塊</p>  
        <p type="p">113a,113b,115a,115b:活動線路層</p>  
        <p type="p">117a,117b,137a,137b:絕緣層</p>  
        <p type="p">119a,119b,139a,139b:接合層</p>  
        <p type="p">120:限位單元</p>  
        <p type="p">122a,122b:X軸限位區塊</p>  
        <p type="p">124a,124b:Y軸限位區塊</p>  
        <p type="p">130:固定單元</p>  
        <p type="p">130f:第一表面</p>  
        <p type="p">130s:第二表面</p>  
        <p type="p">135,138:開口</p>  
        <p type="p">131a,131b,132a,132b,133a,133b:固定線路層</p>  
        <p type="p">150:電子元件</p>  
        <p type="p">g1:間隙</p>  
        <p type="p">X:X軸向</p>  
        <p type="p">Y:Y軸向</p>  
        <p type="p">w1,w2,w3,w4:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="835" publication-number="202628936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶粒高壓檢測模組及其設備</chinese-title>  
        <english-title>HIGH VOLTAGE DIE TESTING MODULE, DEVICE HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P74/00</main-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification>  
        <further-classification edition="200601120260302B">G01R1/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施博倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PO-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭修瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSIU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶粒高壓檢測設備，包括晶粒高壓檢測模組及載台，晶粒高壓檢測模組包括固定環、活動環及基板，活動環耦接固定環，基板耦接固定環，其中固定環、活動環以及基板形成壓力腔，基板的複數探針位於壓力腔內。另外，載台位於活動環下方，其中活動環作用於載台之向下作用力大於壓力腔內之氣體壓力所提供氣壓反力，活動環抵靠於載台。因此，活動環可抵靠載台形成密閉腔室進行高壓檢測，以維持腔內壓力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high voltage die testing device comprises a high voltage die testing module and a chuck. The high voltage die testing module comprises a fixed ring, a movable ring, and a base plate. The movable ring is coupled to the fixed ring. The base plate is coupled to the fixed ring, wherein the fixed ring, the movable ring, and the base plate are formed as a pressure chamber. Probes of the base plate is inside of the pressure chamber. Besides, the chuck is under the movable ring. A downward force of the movable ring against the chuck is greater than an air pressure reaction force provided by air pressure in the pressure chamber, and the movable ring abuts onto the chuck. As a result, through the movable ring abutting onto the chuck, a sealed chamber for high-pressure testing can be provided to maintain the pressure in the pressure chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶粒高壓檢測模組</p>  
        <p type="p">10:晶粒高壓檢測設備</p>  
        <p type="p">100:壓力腔</p>  
        <p type="p">12:壓力感測器</p>  
        <p type="p">13:溫度調節器</p>  
        <p type="p">2:載台</p>  
        <p type="p">3:待測裸晶粒</p>  
        <p type="p">50:活動環</p>  
        <p type="p">60:固定環</p>  
        <p type="p">70:基板</p>  
        <p type="p">71:探針</p>  
        <p type="p">D1:下降方向</p>  
        <p type="p">P:氣體壓力</p>  
        <p type="p">G1:間隙</p>  
        <p type="p">F1:向下作用力</p>  
        <p type="p">F2:氣壓反力</p>  
        <p type="p">P1:起始位置</p>  
        <p type="p">P2:接觸位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="836" publication-number="202627397"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627397.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷散熱系統及其溫度控制閥</chinese-title>  
        <english-title>LIQUID COOLING SYSTEM AND ITS TEMPERATURE CONTROL VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">F28F13/14</main-classification>  
        <further-classification edition="200601120250303B">G05D23/12</further-classification>  
        <further-classification edition="200601120250303B">H05K7/20</further-classification>  
        <further-classification edition="200601120250303B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃順治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛黛娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, TAI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭春亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液冷散熱系統包括溫度控制閥，溫度控制閥包括閥體與溫感調節件，閥體包括第一流體入口、第二流體入口、流體出口、第一流道及第二流道，第一流道與第二流道位於閥體的內部，第一流道連通於第一流體入口與流體出口，第二流道連通於第二流體入口與流體出口。溫感調節件設置於閥體內部且位於第一流道與第二流道之間，溫感調節件響應第一流道內的溫度大於第二流道內的溫度而朝第二流道方向偏移，使第一流道內的體積大於第二流道內的體積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid cooling system includes a temperature control valve. The temperature control valve includes a valve body and a temperature sensing adjustment element. The valve body includes a first fluid inlet, a second fluid inlet, a fluid outlet, a first flow channel, and a second flow channel. The first and second flow channels are located inside the valve body. The first flow channel is connected to the first fluid inlet and the fluid outlet, and the second flow channel is connected to the second fluid inlet and the fluid outlet. The temperature sensing adjustment element is disposed inside the valve body and between the first and second flow channels. In response to the temperature in the first flow channel being greater than the temperature in the second flow channel, the temperature sensing adjustment element deviates toward the second flow channel, so that a volume in the first flow channel is greater than a volume in the second flow channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液冷散熱系統</p>  
        <p type="p">10:第一液冷頭</p>  
        <p type="p">11:第一入液口</p>  
        <p type="p">12:第一出液口</p>  
        <p type="p">20:第二液冷頭</p>  
        <p type="p">21:第二入液口</p>  
        <p type="p">22:第二出液口</p>  
        <p type="p">31:第一入液管</p>  
        <p type="p">32:第一出液管</p>  
        <p type="p">33:第二入液管</p>  
        <p type="p">34:第二出液管</p>  
        <p type="p">35:第一連接管</p>  
        <p type="p">36:第二連接管</p>  
        <p type="p">40:溫度控制閥</p>  
        <p type="p">50:分流閥</p>  
        <p type="p">61:第一發熱件</p>  
        <p type="p">62:第二發熱件</p>  
        <p type="p">63:第一外殼</p>  
        <p type="p">64:第二外殼</p>  
        <p type="p">70:散熱模組</p>  
        <p type="p">71:風扇</p>  
        <p type="p">72:散熱板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="837" publication-number="202627744"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627744.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示卡與其散熱處理方法</chinese-title>  
        <english-title>DISPLAY CARD AND HEAT DISSIPATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">G06F1/20</main-classification>  
        <further-classification edition="200601120250526B">H05K7/20</further-classification>  
        <further-classification edition="201901120250526B">G06F1/3215</further-classification>  
        <further-classification edition="200601120250526B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃順治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛黛娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, TAI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭春亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示卡與其散熱處理方法，用以調整風扇的散熱效率。顯示卡包括主供電端、外部供電端、控制單元與處理單元。主供電端連接於處理單元與風扇，主供電端提供運作電力至處理單元；外部供電端連接於風扇與控制單元；處理單元連接於主供電端與控制單元，風扇配置於處理單元的接觸側面，處理單元接收運作電力，處理單元根據供電策略選擇從運作電力分流第一電力至風扇，或驅動控制單元使外部供電端提供第二電力至風扇；風扇根據第一電力匹配於第一轉速，或根據第二電力匹配於第二轉速。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display card and heat dissipation method for adjusting the efficiency of a fan. The display card comprises a main power provider, an external power provider, a control unit, and a processing unit. The main power provider connects to the processing unit and the fan. The main power provider provides a working power to the processing unit. The external power provider connects to the fan and the control unit The processing unit connects to the main power provider, and the control unit. The fan configures to the contact side of the processing unit. The processing unit receives the working power. The processing unit selects to either divert a first power from the working power to the fan or drive the control unit to have the external power provider provide a second power to the fan according to a power supply strategy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主機板</p>  
        <p type="p">200:電源供應器</p>  
        <p type="p">210:第一電源</p>  
        <p type="p">220:第二電源</p>  
        <p type="p">300:顯示卡</p>  
        <p type="p">310:風扇</p>  
        <p type="p">320:主供電端</p>  
        <p type="p">330:外部供電端</p>  
        <p type="p">340:控制單元</p>  
        <p type="p">350:處理單元</p>  
        <p type="p">360:供電策略</p>  
        <p type="p">410:運算資料</p>  
        <p type="p">420:運作電力</p>  
        <p type="p">421:第一電力</p>  
        <p type="p">422:第二電力</p>  
        <p type="p">423:第三電力</p>  
        <p type="p">430:切換要求</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="838" publication-number="202626304"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626304.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬運機器人及搬運機器人之運作方法</chinese-title>  
        <english-title>TRANSPORT ROBOT AND OPERATION METHOD OF TRANSPORT ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">B25J11/00</main-classification>  
        <further-classification edition="200601120250407B">B25J9/02</further-classification>  
        <further-classification edition="200601120250407B">B25J9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慧娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張立光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, LIH-GUONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃婉茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WAN-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳盛祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種搬運機器人，包含機器人及拖吊機構。拖吊機構包含：基座、夾緊機構、及舉臂機構。基座通過固定元件固定在機器人上。夾緊機構包含：馬達、十字轉向機、線性滑軌、及舉臂底座。舉臂機構包含：主臂、輔臂、腕部機構、及線性致動器。一種搬運機器人之運作方法，包含：設置拖吊機構在機器人上，拖吊機構包含有夾緊機構及舉臂機構；由機器人移動至籠車前；控制夾緊機構夾緊籠車；控制舉臂機構抬高籠車；由機器人將籠車載運至指定地點；控制舉臂機構降低籠車；以及控制夾緊機構鬆脫籠車。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transport robot comprises a robot and a towing mechanism. The towing mechanism comprising: a base, a clamping mechanism, and a lifting arm mechanism. The base is fixed to the robot by a fastening component. The clamping mechanism comprises: a motor, a crossed steering mechanism, a linear slide rail, and a lifting arm base. The lifting arm mechanism comprises: a main arm, a secondary arm, a wrist mechanism, and a linear actuator. An operation method of the transport robot, comprising: installing a towing mechanism on the robot, wherein the towing mechanism includes the clamping mechanism and the lifting arm mechanism; moving the robot to the front of a cage trolley; controlling the clamping mechanism to clamp the cage trolley; controlling the lifting arm mechanism to lift the cage trolley; transporting the cage trolley to a designated location by the robot; controlling the lifting arm mechanism to lower the cage trolley; and controlling the clamping mechanism to release the cage trolley.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:搬運機器人</p>  
        <p type="p">102:機器人</p>  
        <p type="p">110:基座</p>  
        <p type="p">120:夾緊機構</p>  
        <p type="p">121:馬達</p>  
        <p type="p">122:十字轉向機</p>  
        <p type="p">123:線性滑軌</p>  
        <p type="p">1231:滑軌</p>  
        <p type="p">1232:滑動組件</p>  
        <p type="p">124:舉臂底座</p>  
        <p type="p">130:舉臂機構</p>  
        <p type="p">131:主臂</p>  
        <p type="p">132:輔臂</p>  
        <p type="p">133:腕部機構</p>  
        <p type="p">134:線性致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="839" publication-number="202627358"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627358.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排煙管帽罩連接結構之改良</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250304B">F24C15/20</main-classification>  
        <further-classification edition="200601120250304B">F24C15/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統領工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張金發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳行一</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種排煙管帽罩連接結構之改良，主要係包含一罩體以及供連接於該罩體之排煙管體。其中，該罩體係設有一半球狀之帽部，於帽部設有一開孔，帽部周緣則向外延伸適當寬度之垣片，並由垣片延伸一管狀之套置部，於該套置部底緣設有向內拗折之扣合部；該排煙管體係於一端設有向外拗折且對應於該扣合部之勾持部。俾於組裝時，將罩體固定於牆孔，再藉由勾持部與扣合部的相互扣持，使排煙管體與套置部緊密結合，達到防止雨水、雜物或蟲鳥進入排煙管體之目的，且藉由勾持部與扣合部的緊密扣持，以構成氣密狀態，進而防止油漬外洩沾污罩體及牆面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:罩體</p>  
        <p type="p">61:帽部</p>  
        <p type="p">611:開孔</p>  
        <p type="p">62:垣片</p>  
        <p type="p">63:套置部</p>  
        <p type="p">64:扣合部</p>  
        <p type="p">65:濾網</p>  
        <p type="p">7:排煙管體</p>  
        <p type="p">71:勾持部</p>  
        <p type="p">72:長形剖孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="840" publication-number="202627553"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627553.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151594</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學電路板組件及其製造方法</chinese-title>  
        <english-title>OPTICAL CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250508B">G02B6/12</main-classification>  
        <further-classification edition="200601120250508B">G02B6/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林原宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭凌宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, LINGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學電路板組件及其製造方法。光學電路板包括第一電路板、電子元件、軟性電路板、多個導電釘、光通訊模組與包封體。電子元件電性連接於第一電路板。軟性電路板包覆於電子元件，並電性連接於第一電路板。這些導電釘設置於電子元件上，並貫穿軟性電路板而電性連接電子元件。光通訊模組設置於軟性電路板與電子元件上。包封體覆蓋於電子元件與軟性電路板，並位於第一電路板。上述光學電路板因使用導電釘，來連接光通訊模組、軟性電路板與電子元件，有助於提升信號傳輸品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical circuit board assembly and method of manufacturing the same are provided. The optical circuit board assembly includes a first circuit board, an electronic element, a Flexible Print Circuit (FPC), a plurality of conductive rivets, an optical communication module, and an encapsulant. The electronic element is electrically connected to the first circuit board. The FPC covers with the electronic element and is electrically connected to the first circuit board. These conductive rivets are placed on the electronic element, inserted though the FPC and electrically connected to the electronic element. The optical communication module is placed on the FPC and the electronic element. The encapsulant covers the electronic element and the FPC and is located on the first circuit board. The mentioned optical circuit board assembly utilizes the conductive rivets, and is connected to the optical communication module, the FPC and the electronic element, helping to improve the quality of signal transmission.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學電路板組件</p>  
        <p type="p">110:第一電路板</p>  
        <p type="p">120:電子元件</p>  
        <p type="p">130:軟性電路板</p>  
        <p type="p">132:第一子板</p>  
        <p type="p">134:第二子板</p>  
        <p type="p">135:第三子板</p>  
        <p type="p">140:導電釘</p>  
        <p type="p">150:第二電路板</p>  
        <p type="p">160:支撐板</p>  
        <p type="p">170:光通訊模組</p>  
        <p type="p">172:光電元件</p>  
        <p type="p">174:光纖</p>  
        <p type="p">180:包封體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="841" publication-number="202628473"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628473.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151600</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>戶外通訊設備及其維修操作方法</chinese-title>  
        <english-title>OUTDOOR COMMUNICATION APPARATUS AND MAINTENANCE OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250203B">H04W88/08</main-classification>  
        <further-classification edition="200901120250203B">H04W24/04</further-classification>  
        <further-classification edition="201801120250203B">H04W4/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇峰慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, FENG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煜軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種戶外通訊設備及其維修操作方法，其中戶外通訊設備包括通訊裝置、翻轉機構、轉動機構、基座、以及控制模組。翻轉機構設置於通訊裝置，用以轉動通訊裝置。轉動機構設置於翻轉機構，用以轉動翻轉機構。基座設置於轉動機構。控制模組電性連接翻轉機構以及轉動機構。控制模組依據維修訊號驅動翻轉機構以及轉動機構將通訊裝置轉動至維修位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An outdoor communication apparatus and a maintenance operation method thereof is provided. The outdoor communication apparatus includes a communication device, a flipping mechanism, a rotation mechanism, a base, and a control module. The flipping mechanism is disposed on the communication device, used to rotate the communication device. The rotation mechanism is disposed on the flipping mechanism, and used to rotate the flipping mechanism. The base is disposed on the rotation mechanism. The control module is electrically connected to the flipping mechanism and the rotation mechanism. The control module drives the flipping mechanism and the rotation mechanism to rotate the communication device to a maintenance position according to a maintenance signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基座</p>  
        <p type="p">11:導軌</p>  
        <p type="p">12:安裝面</p>  
        <p type="p">13:滑槽</p>  
        <p type="p">20:固定結構</p>  
        <p type="p">40:移動機構</p>  
        <p type="p">41:螺桿</p>  
        <p type="p">42:第一馬達</p>  
        <p type="p">50:轉動機構</p>  
        <p type="p">51:滑動件</p>  
        <p type="p">512:限制槽</p>  
        <p type="p">513:穿槽</p>  
        <p type="p">52:轉動件</p>  
        <p type="p">524:環狀齒部</p>  
        <p type="p">53:連接件</p>  
        <p type="p">54:轉動臂</p>  
        <p type="p">56:限位柱</p>  
        <p type="p">60:翻轉機構</p>  
        <p type="p">61:翻轉件</p>  
        <p type="p">611:弧形凹槽</p>  
        <p type="p">612:固定邊</p>  
        <p type="p">621:翻轉齒輪</p>  
        <p type="p">70:警示裝置</p>  
        <p type="p">80:照明裝置</p>  
        <p type="p">A20:支架裝置</p>  
        <p type="p">AX1:第一虛擬軸</p>  
        <p type="p">AX2:第二虛擬軸</p>  
        <p type="p">D1:移動方向</p>  
        <p type="p">D2:排列方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="842" publication-number="202628557"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628557.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板組件標注方法、系統、電子設備及電腦存儲介質</chinese-title>  
        <english-title>METHOD OF LABELING PRINTED CIRCUIT BOARD ASSEMBLY, SYSTEM, ELECTRONIC DEVICE, AND COMPUTER STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">H05K13/08</main-classification>  
        <further-classification edition="200601120250501B">H05K3/00</further-classification>  
        <further-classification edition="202001120250501B">G06F30/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鴻富錦精密工業（武漢）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGFUJIN PRECISION INDUSTRY (WUHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊麗芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LI-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JENG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙志航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, CHIH-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉海誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, HAI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉富明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, FU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板組件標注方法及相關設備。電路板組件標注方法包括：獲取電路板組件的圖像和電路板組件的測試參數資訊；基於電路板組件的尺寸參數生成與電路板組件對應的外框圖形；基於電路板組件的尺寸參數和測試點參數確定與每一測試點對應的編號的位置；基於外框圖形、電路板組件的測試點參數以及與每一測試點對應的編號的位置，生成與電路板組件對應的標注圖；基於電路板組件的圖像和標注圖生成電路板組件的測試點標注圖片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of labeling printed circuit board assembly (PCBA) and related equipment employing method are provided. The method includes: obtaining an image of a PCBA and test parameter information of the PCBA; generating a corresponding frame image of the PCBA based on size parameters of the PCBA; determining a position of a number corresponding to each test point based on the size parameters of the PCBA and test point parameters; generating a corresponding label diagram of the PCBA based on the frame image, the test point parameters of the PCBA and the position of the number corresponding to each test point; generating a test point label image of the PCBA based on the image of the PCBA and the label diagram of the PCBA.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S3、S4、S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="843" publication-number="202627638"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627638.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光板</chinese-title>  
        <english-title>BACKLIGHT PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王何立穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG HE, LI-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭依濠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林耿賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種背光板，包含基板、多個第一結構及多個第二結構。所述多個第一結構設置於所述基板的一面，而所述多個第二結構設置於所述基板的同一面，且位於所述多個第一結構之間，其中所述多個第二結構與所述多個第一結構具有不同輪廓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight panel comprises a substrate, a plurality of first structures, and a plurality of second structures. The plurality of first structures are disposed on one surface of the substrate, and the plurality of second structures are disposed on the same surface of the substrate and positioned between the plurality of first structures, wherein the plurality of second structures has a different profile from the plurality of first structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:背光板</p>  
        <p type="p">11:基板</p>  
        <p type="p">111:面</p>  
        <p type="p">A:第一結構</p>  
        <p type="p">B:第二結構</p>  
        <p type="p">S:部分結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="844" publication-number="202626193"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626193.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合材料、其製備方法與去除雜原子的方法</chinese-title>  
        <english-title>COMPOSITE MATERIAL, PREPARATION METHOD THEREOF, AND HETEROATOMS-REMOVING METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250402B">B01J20/02</main-classification>  
        <further-classification edition="200601120250402B">B01J20/06</further-classification>  
        <further-classification edition="200601120250402B">B01J20/22</further-classification>  
        <further-classification edition="200601120250402B">B01J20/28</further-classification>  
        <further-classification edition="200601120250402B">B01J20/30</further-classification>  
        <further-classification edition="202301120250402B">C02F1/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉俊毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, JYUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭乃嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, NAI-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳朝煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合材料，包含金屬氧化物載體、金屬有機骨架，以及配置於金屬氧化物載體及該金屬有機骨架之間的介面結晶層，其中介面結晶層具有0.290奈米至0.360奈米的晶面間距(d-spacing)。此外，本發明亦提供所述複合材料的製備方法及用於去除雜原子的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite material, including: a metal oxide support, a metal organic framework, and an interface crystalline layer disposed between the metal oxide support and the metal organic framework, wherein the interface crystalline layer has a d-spacing of 0.290 nm to 0.360 nm. In addition, the present disclosure also provides a preparation method thereof and a heteroatoms-removing method using the same.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="845" publication-number="202628524"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628524.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主機殼及伺服器</chinese-title>  
        <english-title>CABINET AND SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250526B">H05K7/14</main-classification>  
        <further-classification edition="200601120250526B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顔曉麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, XIAO-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊方興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FANG-XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張亞尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YA-NI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文字</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, QING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇宸毫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷翔宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, XIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳麗萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-ZHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種主機殼及伺服器，主機殼包括殼體、滑板及支架。殼體包括側殼板，殼體內於側殼板旁形成安裝空間，殼體之前側設有開口，側殼板設有導向槽，導向槽具有依次相連之下槽段、傾斜段及上槽段，下槽段與上槽段水平。滑板可相對側殼板水平滑動，滑板可藉由開口滑出或滑入安裝空間。支架用於容納風扇，支架設於滑板之尾端並可相對滑板上下移動，支架設有銷件，銷件可滑動地位於導向槽中，當銷件於傾斜段滑動時，支架相對滑板上下移動。當需要拆下風扇時，將滑板拉出安裝空間，使支架從下層高度升至上層高度，無需拆開主機殼之外殼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cabinet and a server, wherein the cabinet includes a shell, a slide plate and a bracket. The shell includes a side shell plate, and an installation space is formed inside the shell beside the side shell plate. An opening is provided on the front side of the shell, and a guide groove is provided on the side shell plate. The guide groove has a lower groove section, an inclined section and an upper groove section connected in sequence, and the lower groove section is horizontal with the upper groove section. The slide plate can slide horizontally relative to the side shell plate, and the slide plate can slide out of or into the installation space through the opening. The bracket is used to accommodate the fan, and the bracket is arranged at the rear end of the slide plate and can move up and down relative to the slide plate. The bracket is provided with a pin, and the pin can be slidably located in the guide groove. When the pin slides in the inclined section, the bracket moves up and down relative to the slide plate. When the fan needs to be removed, the slide plate is pulled out of the installation space to raise the bracket from the lower layer height to the upper layer height without disassembling the shell of the cabinet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主機殼</p>  
        <p type="p">200:伺服器</p>  
        <p type="p">300:風扇</p>  
        <p type="p">400:硬碟機架</p>  
        <p type="p">10:殼體</p>  
        <p type="p">10a:卡扣</p>  
        <p type="p">20:滑板</p>  
        <p type="p">30:支架</p>  
        <p type="p">50:定位架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="846" publication-number="202628519"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628519.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主機殼及伺服器</chinese-title>  
        <english-title>CABINET AND SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250401B">H05K5/10</main-classification>  
        <further-classification edition="200601120250401B">H05K7/18</further-classification>  
        <further-classification edition="200601120250401B">H05K7/20</further-classification>  
        <further-classification edition="200601120250401B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顔曉麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, XIAO-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張亞尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YA-NI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊方興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FANG-XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文字</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, QING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇宸毫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷翔宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, XIANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳麗萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-ZHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種主機殼及伺服器，主機殼具有銷件，主機殼包括滑板、支架、定位件及彈性件。滑板設有滑槽，滑槽容納銷件，使滑板可相對主機殼滑動，滑板之尾端具有插板。支架用於安裝風扇，支架設於滑板之尾端，支架之後側之底部具有插槽，插板插入插槽。定位件設於滑板並位於支架之前側，定位件具有壓板，壓板下壓支架之前側之頂部以將支架壓於滑板上。每個彈性件設有凸起，滑板設有定位槽，凸起插入定位槽以將定位件鎖於滑板上，彈性件受壓變形後可將凸起從定位槽拔出，以從滑板拆下定位件及支架，維修或更換風扇時無需打開主機殼之外殼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cabinet and a server, wherein the cabinet includes a slide plate, a bracket, a positioning member, an elastic member and a pin. The slide plate is provided with a slide groove, the slide groove accommodates the pin, the slide plate can slide relative to the cabinet, and the tail end of the slide plate has a plug plate. The bracket is used to install the fan, the bracket is provided at the tail end of the slide plate, the bottom of the rear side of the bracket has a slot, and the plug plate is inserted into the slot. The positioning member is provided on the slide plate and located at the front side of the bracket, and the positioning member has a pressing plate, and the pressing plate presses down the top of the front side of the bracket to press the bracket onto the slide plate. The elastic member is provided with a protrusion, and the slide plate is provided with a positioning groove, and the protrusion is inserted into the positioning groove to lock the positioning member on the slide plate. There is no need to open the outer shell of the cabinet when repairing or replacing the fan.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:伺服器</p>  
        <p type="p">201:主機殼主體</p>  
        <p type="p">202:硬碟機架</p>  
        <p type="p">204:腔室</p>  
        <p type="p">205:開口</p>  
        <p type="p">100:主機殼</p>  
        <p type="p">10:滑板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="847" publication-number="202626413"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626413.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151829</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用影像判斷車頭與車廂間轉向角度的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250418B">B60W40/10</main-classification>  
        <further-classification edition="202201120250418B">B60R1/22</further-classification>  
        <further-classification edition="202401120250418B">G06T3/02</further-classification>  
        <further-classification edition="202201120250418B">G06V10/25</further-classification>  
        <further-classification edition="202201120250418B">G06V10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帷享科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUTOEQUIPS TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王婷芃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉活木</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用影像判斷車頭與車廂間轉向角度的方法，主要係應用於聯結車輛，步驟包括：提供至少一安裝於該車頭旁側朝側後方拍攝的影像擷取裝置；由一影像處理裝置接收該影像擷取裝置拍攝的影像，並生成能顯示於一顯示裝置的平面影像；於該影像處理裝置設定該車廂同側之一區域為一特徵點，並生成複數筆基於該特徵點之轉向角度與影像座標間相互對應的數據資料；當該聯結車輛行駛且朝該側轉彎時，該影像處理裝置係能即時辨識出該平面影像中之該特徵點，並獲得該特徵點在該平面影像中的水平座標，再根據該些數據資料中水平座標最接近之至少兩筆數據資料推得該車頭相對於該車廂的轉向角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">S01~S05:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="848" publication-number="202628239"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628239.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151830</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>筆電外殼的腔體天線</chinese-title>  
        <english-title>CAVITY ANTENNA FOR LAPTOP COVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">H01Q1/22</main-classification>  
        <further-classification edition="200601120250224B">H01Q1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泓博無線通訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGBO WIRELESS COMMUNICATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-YOW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧宜鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YI-FONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏紅方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, HONG-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種筆電外殼的腔體天線，包括機殼蓋、腔體、雙面印刷電路板以及同軸線。機殼蓋的材質為金屬，具有長方形開口區。腔體安裝於機殼蓋，形狀為長方體，鑲嵌於機殼蓋的長方形開口區而埋設於筆電之內。腔體具有四個金屬側面、一個金屬底面及一個開口面，開口面與金屬底面彼此相對，開口面與長方形開口區在相同平面。雙面印刷電路板的尺寸相符於開口面，雙面印刷電路板具有饋入面與耦合面，且以饋入面重合開口面而疊合於腔體之上，其中雙面印刷電路板的四周皆焊接於腔體的四個金屬側面。同軸線貫通其中一個金屬側面，且以中心導體連接饋入面的激發線路，且以外層導體連接饋入面的接地線路，接地線路導通四個金屬側面。激發線路耦合耦合面的槽線區塊、第一高頻區塊與第二高頻區塊，其中槽線區塊連接四個金屬側面的其中之一，第一高頻區塊與第二高頻區塊都是浮接。據此，天線可減少屏蔽效應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cavity antenna for a laptop cover comprises a cover, a cavity, a double-layer PCB and a coaxial cable. The cover is made of metal having a rectangular opening region. The cavity is installed to the cover. The shape of the cavity is a cuboid. The cavity is embedded in the rectangular opening region of the cover for being embedded in the laptop. The cavity has four metal sides, a metal bottom side and an opening side. The opening side faces the bottom side. The opening side and the rectangular opening region are at the same surface. The size of the double-layer PCB fits the opening side. The double-layer PCB, having a feeding surface and a coupling surface, stacks on the cavity with the feeding surface overlapped to the opening side, wherein the edges of the double-layer PCB are welded to the mentioned four metal sides. The coaxial cable penetrates one of the four metal sides. The coaxial cable is connected to an exciting trace of the feeding surface with a central conductor. The coaxial cable is connected to a grounding trace of the feeding surface with an outer conductor. The grounding trace conducts the four metal sides. The exciting trace couples a slot-line block, a first high-frequency block, and a second high-frequency block of the coupling surface, wherein the slot-line block connects to one of the four metal sides. The first high-frequency block and the second high-frequency block are floating. Thus, the antenna the shielding effect can be reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:雙面印刷電路板</p>  
        <p type="p">4:同軸線</p>  
        <p type="p">21:第一金屬側面</p>  
        <p type="p">22:第二金屬側面</p>  
        <p type="p">23:第三金屬側面</p>  
        <p type="p">24:第四金屬側面</p>  
        <p type="p">25:金屬底面</p>  
        <p type="p">26:開口面</p>  
        <p type="p">31:饋入面</p>  
        <p type="p">32:耦合面</p>  
        <p type="p">X、Y、Z:軸</p>  
        <p type="p">41:中心導體</p>  
        <p type="p">311:激發線路</p>  
        <p type="p">42:外層導體</p>  
        <p type="p">312:接地線路</p>  
        <p type="p">321:槽線區塊</p>  
        <p type="p">322:第一高頻區塊</p>  
        <p type="p">323:第二高頻區塊</p>  
        <p type="p">27:開槽區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="849" publication-number="202628963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種微波退火裝置與方法</chinese-title>  
        <english-title>A MICROWAVE ANNEALING MACHINE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P95/90</main-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification>  
        <further-classification edition="202601120260302B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEILIN HOLDINGS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林能源科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁敏航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, MIN-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊茹媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, RU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李武燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WU-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛百誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, PAI YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種微波退火裝置，包含：一加熱腔體，該加熱腔體的一殼體上設置有複數個微波功率源，用以提供被加熱的整合電子元件達到所需的一微波加熱參數；一冷卻溫控模組，用於提供被加熱的整合電子元件達到一溫度參數；一氣體管路模組，用以提供被加熱的整合電子元件達到一氣體參數；一操作介面模組，用於提供一工程人員對該微波退火裝置設定複數個製程參數；以及一控制模組，係控制該些該些微波電源、該冷卻溫控模組與該氣體管路模組的啟動與關閉。本發明更揭示一種微波退火的方法。根據本發明的微波退火裝置與方法，能夠提供多片的整合電子元件快速穩定且均勻化加熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a microwave annealing machine, comprising: a heating cavity, a plurality of microwave power sources provided on the cavity shell of the heating cavity for providing the integrated devices to be heated to reach a required microwave power state; a cooling temperature control module for providing the integrated devices to be heated to reach a temperature state; a gas pipeline module for providing the integrated devices to be heated to reach a required gas state; an operation interface module for providing an operator to set a plurality of process parameters for the microwave annealing machine; and a control module for controlling the microwave power sources, the cooling temperature control module and the gas pipe to be started and closed. The present invention also discloses a microwave annealing method. The microwave annealing machine and method according to this invention can provide rapid, stable and uniform heating of multiple integrated devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:微波退火裝置</p>  
        <p type="p">10:加熱腔體</p>  
        <p type="p">12:殼體</p>  
        <p type="p">14:冷卻溫控模組</p>  
        <p type="p">15:升降器</p>  
        <p type="p">16:承載座</p>  
        <p type="p">17:支撐架</p>  
        <p type="p">18:整合電子元件</p>  
        <p type="p">20a,20b,20c,20d:微波功率源</p>  
        <p type="p">22:微波電源</p>  
        <p type="p">30:控制模組</p>  
        <p type="p">32:進氣孔</p>  
        <p type="p">34:氣體管路模組</p>  
        <p type="p">36:真空抽氣管路</p>  
        <p type="p">38:真空模組</p>  
        <p type="p">40:操作介面模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="850" publication-number="202627594"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627594.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">G02B11/20</main-classification>  
        <further-classification edition="202101120250317B">G02B7/02</further-classification>  
        <further-classification edition="200601120250317B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董傳博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, CHUANBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱清智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, QINGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUNG-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側在光軸上依序包含有第一透鏡、第二透鏡、第三透鏡以及第四透鏡。第一透鏡的像側面的光軸區域為凸面、第二透鏡具有正屈光率、第三透鏡的物側面的圓周區域為凸面、第四透鏡的物側面的圓周區域為凹面。光學成像鏡頭的透鏡只有上述四片透鏡，且滿足以下條件式：（EFL+TTL）/D22t32≧33.000。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens includes a first lens element, a second lens, a third lens element and a fourth lens element from an object side to an image side in order along an optical axis. An optical axis region of the image -side surface of the first lens element is convex, the second lens element has positive refracting power, a periphery region of the object-side surface of the third lens element is convex and a periphery region of the object-side surface of the fourth lens element is concave. The lens elements included by the optical imaging lens are only the four lens elements described above to satisfy: (EFL+TTL)/D22t32≥33.000.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學成像鏡頭</p>  
        <p type="p">2:光圈</p>  
        <p type="p">3:濾光片</p>  
        <p type="p">4:成像面</p>  
        <p type="p">5:光學轉折元件</p>  
        <p type="p">11、21、31、41:物側面</p>  
        <p type="p">12、22、32、42:像側面</p>  
        <p type="p">13、16、23、26、33、36、43、46:光軸區域</p>  
        <p type="p">14、17、24、27、34、37、44、47:圓周區域</p>  
        <p type="p">10:第一透鏡</p>  
        <p type="p">20:第二透鏡</p>  
        <p type="p">30:第三透鏡</p>  
        <p type="p">40:第四透鏡</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="851" publication-number="202627595"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627595.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">G02B11/20</main-classification>  
        <further-classification edition="200601120250317B">G02B13/02</further-classification>  
        <further-classification edition="202101120250317B">G02B7/02</further-classification>  
        <further-classification edition="200601120250317B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電(廈門)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽松林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SONG LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃頌超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SONGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUNG-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側在光軸上依序包含有第一透鏡、第二透鏡、第三透鏡以及第四透鏡。第三透鏡具有負屈光率，第三透鏡的物側面的一圓周區域為凸面，第三透鏡的像側面的一光軸區域為凹面，第四透鏡具有負屈光率，第四透鏡的像側面的一光軸區域為凸面。光學成像鏡頭的透鏡只有上述四片透鏡，且滿足以下條件式: HFOV/TL ≤ 4.000度/毫米</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens includes a first lens element, a second lens, a third lens element and a fourth lens element from an object side to an image side in order along an optical axis. The third lens element has negative refracting power, a periphery region of the object-side surface of the third lens element is convex, an optical axis region of the image-side surface of the third lens element is concave, the fourth lens element has negative refracting power, and an optical axis region of the image-side surface of the fourth lens element is convex. The lens elements included by the optical imaging lens are only the four lens elements described above to satisfy: HFOV/TL ≤ 4.000 degrees/mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學成像鏡頭</p>  
        <p type="p">2:光圈</p>  
        <p type="p">3:濾光片</p>  
        <p type="p">4:成像面</p>  
        <p type="p">5:光學轉折元件</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p>  
        <p type="p">11、21、31、41:物側面</p>  
        <p type="p">12、22、32、42:像側面</p>  
        <p type="p">13、16、23、26、33、36、43、46:光軸區域</p>  
        <p type="p">14、17、24、27、34、37、44、47:圓周區域</p>  
        <p type="p">10:第一透鏡</p>  
        <p type="p">20:第二透鏡</p>  
        <p type="p">30:第三透鏡</p>  
        <p type="p">40:第四透鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="852" publication-number="202627841"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627841.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以提供商品之頁面之方法、裝置及記錄有命令之記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM STORING INSTRUCTIONS FOR SUPPLYING A PAGE ABOUT AN ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F17/40</main-classification>  
        <further-classification edition="201301120250602B">G06F3/048</further-classification>  
        <further-classification edition="202301120250602B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250602B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申恩珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, EUNJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　寶藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BO RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種方法，其係藉由電子裝置而提供商品之頁面者，其包括如下步驟：自用戶之終端獲得請求連接至電子商務服務中處理之目標商品之頁面的連接請求；響應於上述連接請求，產生用以展現上述目標商品之頁面之頁面資訊；及將上述頁面資訊傳輸至上述用戶之終端；且上述目標商品之頁面包括第1區域及第2區域，該第1區域係交替地展現上述目標商品之影像資訊、及針對上述目標商品而撰寫之一個以上之評論之評論資訊者，該第2區域係指示上述影像資訊或上述評論資訊中之顯示於上述第1區域中之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:用戶終端</p>  
        <p type="p">120:電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="853" publication-number="202629029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100175</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W72/50</main-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="200601120260302B">B08B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林立涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, LI HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡昌儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHANG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構的製造方法，其包括以下步驟。於基底上形成導電層。於所述導電層上形成保護層，其中所述保護層包括多個第一孔隙，且所述第一孔隙暴露出部分的所述導電層。通過所述第一孔隙對所述導電層的暴露部分進行氮化處理，以在所述導電層的頂面處形成氮化物部分。於所述保護層上形成介電層，其中所述介電層包括多個第二孔隙。對所述介電層進行清洗處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor structure is provided. The method includes the following steps. A conductive layer is formed on a substrate. A protection layer is formed on the conductive layer, wherein the protection layer includes a plurality of first pores, and the first pores expose portions of the conductive layer. A nitridation treatment is performed on the exposed portions of the conductive layer through the first pores to form nitride portions at a top surface of the conductive layer. A dielectric layer is formed on the protection layer, wherein the dielectric layer includes a plurality of second pores. A clean treatment is performed on the dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">102:導電層</p>  
        <p type="p">102a:氮化物部分</p>  
        <p type="p">104:保護層</p>  
        <p type="p">104a:第一孔隙</p>  
        <p type="p">106:氮化處理</p>  
        <p type="p">P1:路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="854" publication-number="202627403"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627403.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學相位分析系統、光學相位分析方法及光學量測裝置</chinese-title>  
        <english-title>OPTICAL PHASE ANALYZING SYSTEM, OPTICAL PHASE ANALYZING METHOD, AND OPTICAL MEASUREMENT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250314B">G01B9/02</main-classification>  
        <further-classification edition="200601120250314B">G02B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳銘安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, GUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃星瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學相位分析系統及光學相位分析方法。光學相位分析系統包含光源組件、光學量測裝置及處理裝置。光學相位量測裝置包含偏振分光鏡組、干涉偏振鏡組及偏極化攝像器。偏振分光鏡組用以將偏振態光線分離成相差90°極化角度的參考光束及量測光束，量測光束經過待測超穎透鏡形成相位分析光束。干涉偏振鏡組用以將參考光束及相位分析光束干涉並圓偏振以形成圓偏振光束。偏極化攝像器用以接收圓偏振光束以產生待分析圖像處理裝置用以依據待分析圖像獲得超穎透鏡相位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and a system for optical phase analyzing are provided. The optical phase analyzing system includes a light source assembly, an optical measurement device, and a processing device. The optical measurement device includes a polarizing beam splitting assembly, an interference and polarizing lens assembly, and a polarization camera. The polarizing beam splitting assembly is configured to polarize and split a light from the light source to form a reference beam and a measurement beam. The reference beam and the measurement beam have a polarization angle difference of 90 degrees. The measurement beam passes a to-be-measured meta-lens to from a phase analyzing beam. The interference and polarizing lens assembly is configured to intervene the reference beam with the phase analyzing beam and circularly polarize the intervened beam to form a circularly polarized beam. The polarization camera is configured to receive the circularly polarized beam to generate a corresponding image. The processing device is configured to obtain a meta-lens phase of the to-be-measured meta-lens according to the corresponding image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3,S4,S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="855" publication-number="202627842"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627842.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以提供商品之頁面之方法、裝置及記錄有命令之記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM STORING INSTRUCTIONS FOR SUPPLYING A PAGE ABOUT AN ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F17/40</main-classification>  
        <further-classification edition="201301120250602B">G06F3/048</further-classification>  
        <further-classification edition="202301120250602B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250602B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申恩珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, EUNJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維潭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, YOUDAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金妍才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YEONJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　寶藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BO RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種藉由電子裝置而提供商品之頁面之方法，該方法包括如下步驟：自用戶終端獲得連接請求，該連接請求係請求連接至電子商務服務中處置之對象商品之頁面者；響應於上述連接請求，產生用以展露上述對象商品之頁面之頁面資訊；及將上述頁面資訊傳輸至上述用戶終端；且上述對象商品之頁面包括用以展露第1資訊之對象區域，該第1資訊係於存在同一購買者購買過上述對象商品2次以上之再次購買歷史之情形時指示存在上述再次購買歷史者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:用戶終端</p>  
        <p type="p">120:電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="856" publication-number="202627940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以提供商品之頁面之方法、裝置及記錄有命令之記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM STORING INSTRUCTIONS FOR SUPPLYING A PAGE ABOUT AN ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250620B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250620B">G06Q10/08</further-classification>  
        <further-classification edition="200601120250620B">G06F17/40</further-classification>  
        <further-classification edition="201301120250620B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申恩珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, EUNJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　寶藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BO RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種方法，其係藉由電子裝置而提供之提供商品之頁面的方法，其包括如下步驟：自用戶之終端獲得請求連接至電子商務服務中處置之目標商品之頁面的連接請求；響應於上述連接請求，產生用以展現上述目標商品之頁面之頁面資訊；及將上述頁面資訊傳輸至上述用戶之終端；且上述目標商品之頁面包括：第1區域，其顯示一個以上之購買者對上述目標商品之一個以上之目標屬性資訊之評價指標；及第2區域，其顯示與上述一個以上之目標屬性資訊之評價相關之表情符號(emoji)；不於上述第1區域及上述第2區域之間之區域配置文本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:用戶之終端</p>  
        <p type="p">120:電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="857" publication-number="202627589"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627589.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>潛望式馬達、攝像頭模組和電子設備</chinese-title>  
        <english-title>PERISCOPE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250317B">G02B7/09</main-classification>  
        <further-classification edition="202101120250317B">G03B13/34</further-classification>  
        <further-classification edition="201601120250317B">H02K11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新煒科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁盛傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, SHENG-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李靜偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIA-QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁國鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, GUO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡值源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, ZHI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種潛望式馬達、攝像頭模組和電子設備。本申請通過在底座的側表面設置第一凹槽和固定於第一凹槽的滾軸，並在安裝座的側表面設置與第一凹槽對應的第二凹槽，側表面的滾軸限制了安裝座的上下移動，因此能夠降低安裝座向上或向下撞擊與其相鄰結構的概率，從而能減少產生微粒的風險，並能降低底座產生凹坑的概率，進而能降低成像時產生黑影、黑點或對焦不良的概率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a periscope motor, a camera module, and an electronic device. By arranging a first groove on the lateral surface of the base and a roller shaft fixed to the first groove, and by setting a second groove corresponding to the first groove on the lateral surface of the mounting base, the roller shaft can restrict the vertical movement of the mounting base. Therefore, the probability of the mounting base hitting adjacent structures upwards or downwards can be reduced, thereby lowering the risk of particle generation and dent formation on the base. Consequently, it can decrease the likelihood of shadows, dark spots, or poor focusing during imaging.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:安裝座</p>  
        <p type="p">30:滾軸</p>  
        <p type="p">40:驅動組件</p>  
        <p type="p">50:光轉向組件</p>  
        <p type="p">11:底座</p>  
        <p type="p">110:第一凹槽</p>  
        <p type="p">111:底板</p>  
        <p type="p">112:第一側板</p>  
        <p type="p">113:第二側板</p>  
        <p type="p">114:第一擋板</p>  
        <p type="p">115:第二擋板</p>  
        <p type="p">116:通槽</p>  
        <p type="p">12:上蓋</p>  
        <p type="p">120:開窗</p>  
        <p type="p">21:第一安裝部</p>  
        <p type="p">22:第二安裝部</p>  
        <p type="p">23:第三安裝部</p>  
        <p type="p">201:第二凹槽</p>  
        <p type="p">41:線圈</p>  
        <p type="p">42:磁性件</p>  
        <p type="p">43:電路板</p>  
        <p type="p">421:第一部分</p>  
        <p type="p">422:第二部分</p>  
        <p type="p">423:連接部</p>  
        <p type="p">51:支撐座</p>  
        <p type="p">52:稜鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="858" publication-number="202627932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品資訊篩選方法及其系統</chinese-title>  
        <english-title>PRODUCT INFORMATION FILTERING METHOD AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250402B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250402B">G06Q30/0241</further-classification>  
        <further-classification edition="202301120250402B">G06Q30/0251</further-classification>  
        <further-classification edition="202301120250402B">G06Q30/0282</further-classification>  
        <further-classification edition="202301120250402B">G06Q30/0601</further-classification>  
        <further-classification edition="200601120250402B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭奕庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露一實施例的商品資訊篩選方法，透過計算裝置執行，可以包括如下步驟：渲染用於顯示使用者添加到購物車的商品的購物車頁面；從該使用者接收對於與該商品相關的多個資訊中的要顯示在該購物車頁面的至少一個或多個資訊的選擇；和在該購物車頁面上顯示與該商品相關的該多個資訊中的該至少一個或多個資訊，並隱藏除該至少一個或多個資訊之外的剩餘資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A product information filtering system is performed by a computing device, and may include rendering a shopping cart page for displaying a product added to a shopping cart by a user, receiving a selection of one or more information to be displayed on the shopping cart page among a plurality of information related to the product from the user, and displaying the one or more information of the plurality of information related to the product on the shopping cart page and hiding the remaining information excluding the one or more information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110、S120、S130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="859" publication-number="202627600"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627600.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100422</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">G02B11/32</main-classification>  
        <further-classification edition="202101120250324B">G02B7/02</further-classification>  
        <further-classification edition="200601120250324B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱清智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, QINGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙啟達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, QIDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何媚婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, MEITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUNG-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭包括第一透鏡至第六透鏡。第一透鏡的像側面的圓周區域為凸面、第二透鏡的像側面的圓周區域為凹面、第四透鏡的物側面的光軸區域為凸面、第四透鏡的物側面的圓周區域為凹面且第四透鏡的像側面的圓周區域為凹面、以及第五透鏡的物側面的光軸區域為凹面。光學成像鏡頭的透鏡只有上述六片，滿足(T5+BFL)/(T1+G12)≥4.390。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens includes a first lens element to a sixth lens element. A periphery region of the image-side surface of a first lens element is convex, a periphery region of the image-side surface of the second lens element is concave, an optical axis region of the object-side surface of the fourth lens element is convex, a periphery region of the object-side surface of the fourth lens element is concave, a periphery region of the image-side surface of the fourth lens element is concave, and an optical axis region of the object-side surface of the fifth lens element is concave. Lens elements included by the optical imaging lens are only six lens elements described above to satisfy (T5+BFL)/(T1+G12)≥4.390.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學成像鏡頭</p>  
        <p type="p">2:光圈</p>  
        <p type="p">3:濾光片</p>  
        <p type="p">4:成像面</p>  
        <p type="p">11、21、31、41、51、61:物側面</p>  
        <p type="p">12、22、32、42、52、62:像側面</p>  
        <p type="p">13、16、23、26、33、36、43、46、53、56、63、66:光軸區域</p>  
        <p type="p">14、17、24、27、34、37、44、47、54、57、64、67:圓周區域</p>  
        <p type="p">10:第一透鏡</p>  
        <p type="p">20:第二透鏡</p>  
        <p type="p">30:第三透鏡</p>  
        <p type="p">40:第四透鏡</p>  
        <p type="p">50:第五透鏡</p>  
        <p type="p">60:第六透鏡</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="860" publication-number="202627948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>購物車商品顯示方法及其系統</chinese-title>  
        <english-title>SHOPPING CART PRODUCT DISPLAY METHOD AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250303B">G06Q30/02</further-classification>  
        <further-classification edition="200601120250303B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭奕庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露一實施例的購物車商品顯示方法透過計算裝置執行，可以包括如下步驟：渲染用於顯示使用者添加至購物車的一個或多個商品的購物車頁面；在該購物車頁面上渲染用於顯示與該一個或多個商品分別對應的圖示的第一微件；和回應於該使用者對於該圖示的選擇，移動至該購物車頁面上的顯示與該圖示對應的商品的區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shopping cart product display method is performed by a computing device, and may include rendering a shopping cart page for displaying one or more products added to a shopping cart by a user, rendering a first widget for displaying an icon corresponding to each of the one or more products on the shopping cart page, and moving to an area on the shopping cart page where a product corresponding to the icon is displayed in response to a selection of the icon by the user.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110、S120、S130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="861" publication-number="202627738"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627738.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主機殼及電腦系統</chinese-title>  
        <english-title>CABINET AND COMPUTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250425B">G06F1/16</main-classification>  
        <further-classification edition="200601120250425B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴俊霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, JUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石東和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, TUNG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種主機殼及電腦系統，主機殼包括風扇支架，風扇支架包括第一架體與第二架體，第一架體用於安裝風扇，第一架體包括底板、延伸台及接頭，延伸台設於底板之底面，接頭設於延伸台之前側面，接頭與風扇電連接。第二架體包括頂板及前側板，連接器設於前側板之前側面，前側板設有插口，插口向後露出連接器，頂板設有避位口，避位口之前後總長度大於延伸台之前後總長度。於組裝時，延伸台藉由避位口伸入頂板下方，再向前移動第一架體，直至接頭穿過插口並插入連接器，於實現風扇被墊高之基礎上，可充分地利用風扇底部之空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cabinet and a computing system, wherein the cabinet includes a fan bracket, the fan bracket includes a first frame body and a second frame body, the first frame body is used to mount a fan, the first frame body includes a base plate, an extension table and a connector, the extension table is provided on a bottom surface of the base plate, the connector is provided on a front side of the extension table, and the connector is electrically connected to the fan. The second frame body includes a top plate and a front side plate, the connector is disposed on the front side of the front side plate, the front side plate is provided with a socket, the socket exposing the connector rearwardly, the top plate is provided with a position-avoiding port, and the front and rear total lengths of the position-avoiding port are greater than the front and rear total lengths of the extension table. During assembly, the extension table is extended under the top plate through the position-avoiding port, and then the first frame body is moved forward until the connector passes through the socket and is inserted into the connector, so that the space at the bottom of the fan can be fully utilized while realizing that the fan is padded.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:風扇支架</p>  
        <p type="p">200:風扇</p>  
        <p type="p">300:連接器</p>  
        <p type="p">400:電腦系統</p>  
        <p type="p">401:主機殼</p>  
        <p type="p">10:第一架體</p>  
        <p type="p">20:第二架體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="862" publication-number="202627590"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627590.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬收光組件以及包含有金屬收光組件的光學成像鏡頭模組</chinese-title>  
        <english-title>METAL LIGHT COLLECTING COMPONENT, AND OPTICAL IMAGING LENS MODULE INCLUDING THE METAL LIGHT COLLECTING COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250602B">G02B7/182</main-classification>  
        <further-classification edition="200601120250602B">G02B13/00</further-classification>  
        <further-classification edition="201501120250602B">G02B1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電(廈門)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡偉森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, WEISEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹海斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, HAIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種金屬收光組件以及包含有上述金屬收光組件的光學成像鏡頭模組，其中金屬收光組件包含一金屬片，以及一具有開孔的遮光片，該遮光片設置在該金屬片的一表面上，其中位於該遮光片的該開口附近區域，且位於該金屬片與該遮光片之間的間隙被定義為一收光空間，該收光空間具有可衰減透過該開口而進入該收光空間的雜散光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a metal light collecting component and an optical imaging lens module comprising the metal light collecting component, wherein the metal light collecting component comprises a metal sheet and a light shielding sheet with an opening, and the light shielding sheet is arranged on a surface of the metal sheet, wherein a light collecting space is defined, wherein the light collecting space is located a region near the opening of the light shielding sheet, and located in a gap between the metal sheet and the light shielding sheet. The light collecting space has the effect of attenuating stray light entering the light collecting space through the opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學成像鏡頭模組</p>  
        <p type="p">2:鏡筒</p>  
        <p type="p">3:光學成像鏡頭</p>  
        <p type="p">4:金屬收光組件</p>  
        <p type="p">5:光反射元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="863" publication-number="202627596"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627596.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">G02B11/20</main-classification>  
        <further-classification edition="202101120250407B">G02B7/02</further-classification>  
        <further-classification edition="200601120250407B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃頌超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SONGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖華濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HUABIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽松林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SONGLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUNG-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從一物側至一像側沿一光軸依序包括一第一透鏡、一第二透鏡、一第三透鏡以及一第四透鏡，且第一透鏡至第四透鏡各自包括朝向物側且使一成像光線通過的一物側面及朝向像側且使成像光線通過的一像側面。其中第三透鏡的像側面的一光軸區域為凹面，第四透鏡的物側面的一圓周區域為凸面，第四透鏡的像側面的一光軸區域為凹面，第四透鏡的像側面的一圓周區域為凸面，且光學成像鏡頭的透鏡只有上述四片透鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens including a first, a second, a third and a fourth lens element sequentially along an optical axis from an object-side to an image-side is provided. The first to the fourth lens element each includes an object-side surface facing toward the object-side and allowing an imaging ray to pass through as well as an image-side facing toward the image-side and allowing the imaging rays to pass through. Wherein an optical axis region of the image-side surface of the third lens element is concave, a periphery region of the object-side surface of the fourth lens element is convex, an optical axis region of the image-side surface of the fourth lens element is concave, a periphery region of the image-side surface of the fourth lens element is convex, and the lens elements of the optical imaging lens has only the four lens elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">0:光圈</p>  
        <p type="p">1:第一透鏡</p>  
        <p type="p">2:第二透鏡</p>  
        <p type="p">3:第三透鏡</p>  
        <p type="p">4:第四透鏡</p>  
        <p type="p">8:濾光片</p>  
        <p type="p">9:保護蓋板</p>  
        <p type="p">10:光學成像鏡頭</p>  
        <p type="p">15,25,35,45,85,95:物側面</p>  
        <p type="p">16,26,36,46,86,96:像側面</p>  
        <p type="p">99:成像面</p>  
        <p type="p">151,161,251,261,351,361,451,461:光軸區域</p>  
        <p type="p">153,163,253,263,353,363,453,463:圓周區域</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="864" publication-number="202627604"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627604.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學鏡頭</chinese-title>  
        <english-title>OPTICAL LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G02B13/22</main-classification>  
        <further-classification edition="200601120260302B">G02B13/14</further-classification>  
        <further-classification edition="200601120260302B">G02B11/06</further-classification>  
        <further-classification edition="200601120260302B">G02B9/12</further-classification>  
        <further-classification edition="202101120260302B">G02B7/02</further-classification>  
        <further-classification edition="200601120260302B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃福棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, FUTANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊劍鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIANPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張加欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIA-SIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬靜如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供之光學鏡頭包括一鏡筒及複數透鏡。透鏡係從一物側到一像側沿一光軸依序於鏡筒內設置，透鏡具有一朝向物側且使光線通過的物側面以及一朝向像側且使光線通過的像側面，透鏡包含至少一個可吸收可見光透鏡。光學鏡頭更滿足至少兩個條件式，以在節省成本並縮小體積的前提下，同時提供良好的光學品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical lens is provided by the present invention. The optical lens comprises a barrel and a plurality of lens elements. Each of the lens elements comprises an object-side surface facing an object side and an image-side surface facing an image side. The lens elements comprise at least one visible-light absorbable lens element. The optical lens may satisfy at least two inequalities to save cost, reduce sizes and provide good optical quality as well.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1、2、3:透鏡</p>  
        <p type="p">4、5:遮光片</p>  
        <p type="p">6:固定環</p>  
        <p type="p">7:鏡筒</p>  
        <p type="p">8:玻璃蓋板</p>  
        <p type="p">9:感測元件</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="865" publication-number="202627745"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627745.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱器以及終端裝置</chinese-title>  
        <english-title>RADIATOR AND TERMINAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251029B">G06F1/20</main-classification>  
        <further-classification edition="200601120251029B">F28D1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻準精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>符猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝錦榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, JIN-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅富升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, FU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱器，包括進液接頭、出液接頭以及至少一散熱組件。散熱組件包括多個散熱板和分液器，每一散熱板包括第一蓋板和第二蓋板，第一蓋板包括本體部和加強筋，本體部和第二蓋板形成收容空間，加強筋位於收容空間中，並將收容空間劃分為相互連通的第一流道和第二流道；分液器位於多個散熱板的同一側，分液器包括進液口、出液口、多個出口和多個入口；進液口連通進液接頭，出液口連通出液接頭，進液口和多個出口連通，出液口和多個入口連通，出口和第一流道連通，入口和第二流道連通。本申請還提供一種終端裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radiator includes a liquid inlet connector, a liquid outlet connector, and at least one heat dissipation assembly. The heat dissipation assembly includes a plurality of heat dissipation plates and a liquid distributor. Each heat dissipation plate includes a first cover plate and a second cover plate. The first cover plate includes a body portion and a reinforcing rib. The body portion and the second cover plate form a receiving space. The reinforcing rib is located in the receiving space, and divides the receiving space into a first flow channel and a second flow channel communicating with each other. The liquid divider is located on the same side of the heat dissipation plates. The liquid divider includes a liquid inlet, a liquid outlet, a plurality of outlets, and a plurality of inlets. The liquid inlet communicates with the liquid inlet connector. The liquid outlet communicates with the liquid outlet connector. The liquid inlet communicates with the outlets, the liquid outlet communicates with the inlets, the outlet communicates with the first flow channel, and the inlet communicates with the second flow channel. The present disclosure also provides a terminal device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:出液接頭</p>  
        <p type="p">41:第一蓋板</p>  
        <p type="p">414:加強筋</p>  
        <p type="p">4142:第一彎折段</p>  
        <p type="p">4144:第二彎折段</p>  
        <p type="p">4146:第三彎折段</p>  
        <p type="p">45:收容空間</p>  
        <p type="p">452:第一流道</p>  
        <p type="p">454:第二流道</p>  
        <p type="p">50:分液器</p>  
        <p type="p">53:出口</p>  
        <p type="p">54:入口</p>  
        <p type="p">55:第一收容槽</p>  
        <p type="p">56:第二收容槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="866" publication-number="202627797"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627797.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微件可見性集成控制方法及其系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR INTEGRATED CONTROL OF WIDGET VISIBILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F9/06</main-classification>  
        <further-classification edition="201801120250602B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露一實施例的微件可見性集成控制方法，透過計算系統執行，其包括如下步驟：對於第一微件識別使用者許可權資訊；對於該第一微件識別與可見性確定相關的業務條件；基於該使用者許可權資訊和該業務條件，識別該第一微件與不同於該第一微件的第二微件之間是否衝突；如果識別到發生衝突，則確定該第一微件與該第二微件之間的優先順序；以及在該第一微件和該第二微件中，使確定的優先順序高的微件可見，使確定的優先順序低的微件不可見。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment of the disclosed widget visibility integration control method, executed by a computing system, the method comprises the following steps: Identifying user permission information for a first widget; Identifying business conditions related to visibility determination for the first widget; Identifying whether a conflict exists between the first widget and a second widget, which is different from the first widget, based on the user permission information and the business conditions; If a conflict is identified, determining the priority order between the first widget and the second widget; and Making the widget with the higher determined priority visible while making the widget with the lower determined priority invisible.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S610、S620、S630、S640、S650:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="867" publication-number="202627941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101239</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>確定商品之不可訂購地區之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS, AND RECORDING MEDIUM FOR DETERMINING NON-DELIVERABLE REGION OF THE PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250701B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏世康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, SHIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種用以確定商品之不可訂購地區之技術。本發明之一個態樣之藉由電子裝置而實行之確定商品之不可訂購地區之方法可包括如下步驟：確定與發送商品之賣場之位置對應之第1位置、及距上述第1位置為預定之距離內之目標地區；確定包括於上述目標地區內且與配送地對應之第2位置；設定第1不可訂購線；及基於上述第1位置、上述第2位置及上述第1不可訂購線，確定上述第2位置是否為上述賣場之不可訂購地區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:第1位置</p>  
        <p type="p">520:單位地區</p>  
        <p type="p">522:第2位置</p>  
        <p type="p">530:第1不可訂購線</p>  
        <p type="p">540:第1線</p>  
        <p type="p">550:交點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="868" publication-number="202627639"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627639.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101373</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光模組</chinese-title>  
        <english-title>BACKLIGHT MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250123B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商友達光電（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種背光模組包括多個光學膜片、單面膠帶、膠材與至少兩個固定柱。這些光學膜片包括第一光學膜片與多個第二光學膜片。這些第二光學膜片彼此堆疊，其中第一光學膜片覆蓋這些第二光學膜片，但不覆蓋各第二光學膜片的邊緣區域的至少一部分。單面膠帶覆蓋並貼合於各第二光學膜片的邊緣區域。膠材連接於第一光學膜片與相鄰的第二光學膜片的邊緣區域之間。至少兩個固定柱設置於這些光學膜片的周圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module includes a plurality of optical films, a single-sided tape, an adhesive material and at least two fixed pillars. The optical films include a first optical film and a plurality of second optical films. The second optical films stack each other, in which the first optical film covers the second optical films, but doesn’t cover at least a part of an edge region of each second optical film. The single-sided tape covers and is attached to the edge region of each second optical film. The adhesive material is connected between the first optical film and the edge region of the adjacent second optical film. The at least two fixed pillars are provided around the optical films.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:背光模組</p>  
        <p type="p">110:第一光學膜片</p>  
        <p type="p">120、130:第二光學膜片</p>  
        <p type="p">140:固定柱</p>  
        <p type="p">150:膠材</p>  
        <p type="p">152、172:膠面</p>  
        <p type="p">170:單面膠帶</p>  
        <p type="p">173:無膠面</p>  
        <p type="p">210:導光板</p>  
        <p type="p">220:出光面</p>  
        <p type="p">230:側面</p>  
        <p type="p">250:發光元件</p>  
        <p type="p">160:邊緣區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="869" publication-number="202627341"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627341.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管接頭裝置</chinese-title>  
        <english-title>TUBE FITTING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250425B">F16L19/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商一諾迪思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNODIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴海申</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HEA SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNG JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鐘聲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明一實施例的管接頭裝置包括：主體，連接管道以輸送流體；螺母，加壓所述主體的外周面的同時緊固於所述主體的一側，並且配置有螺母凸起，所述螺母凸起朝向緊固方向呈放射狀凸出；接合件，配置在所述主體與所述螺母之間，並且配備有接合凸起，所述接合凸起凸出成與所述螺母凸起相向，在緊固所述螺母的過程中利用在所述螺母凸起接觸所述接合凸起而產生的摩擦音，預測所述螺母的緊固程度；所述接合件包括：結合部，結合於所述主體與所述螺母之間；支撐部，支撐所述螺母的緊固側端部；及彈性部，在所述接合凸起側間隔狹槽貫通所述支撐部一部分的同時空間上隔開並彈性支撐所述螺母凸起，並且在配備有所述接合凸起的部分配備成帶狀區間；在所述間隔狹槽上，在與所述接合凸起對應的位置配備有連接所述結合部與所述彈性部的加強筋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主體</p>  
        <p type="p">110:短管本體</p>  
        <p type="p">120:短節</p>  
        <p type="p">122:螺紋部</p>  
        <p type="p">130:安放部</p>  
        <p type="p">132:掛接槽</p>  
        <p type="p">150:連接管</p>  
        <p type="p">200:螺母</p>  
        <p type="p">210:螺紋部</p>  
        <p type="p">220:螺母掛接棱</p>  
        <p type="p">222:螺母凸起</p>  
        <p type="p">230:外周凸起</p>  
        <p type="p">300:接合件</p>  
        <p type="p">310:結合部</p>  
        <p type="p">312:卡棱</p>  
        <p type="p">320:支撐部</p>  
        <p type="p">322:間隔狹槽</p>  
        <p type="p">324:接合凸起</p>  
        <p type="p">326:彈性部</p>  
        <p type="p">330:加強筋</p>  
        <p type="p">340:緊固鉤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="870" publication-number="202628415"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628415.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管理視覺內容的方法、主機及電腦可讀儲存媒體</chinese-title>  
        <english-title>METHOD FOR MANAGING VISUAL CONTENT, HOST, AND COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250401B">H04N13/189</main-classification>  
        <further-classification edition="201801120250401B">H04N13/106</further-classification>  
        <further-classification edition="200601120250401B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴堯瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YAO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供一種管理視覺內容的方法、主機及電腦可讀儲存媒體。所述方法包括：在用於記錄3D視覺內容的記錄階段中，記錄關聯於3D視覺內容的內容資訊，其中關聯於3D視覺內容的內容資訊包括發生於輸入裝置上的輸入事件、目標物件的物件姿態及對應於3D內容物件的3D物件資訊的至少其中之一；以及在用於回放經記錄的3D視覺內容的回放階段中，依據經記錄的3D視覺內容的內容資訊回放經記錄的3D視覺內容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments of the disclosure provide a method for managing visual content, a host, and a computer-readable storage medium. The method includes, during a recording phase for recording 3D visual content, recording content information associated with the 3D visual content, wherein the content information associated with the 3D visual content includes at least one of following: an input event occurring on an input device, an object pose of a target object, and 3D object information corresponding to a 3D content object; and during a playback phase for playing back the recorded 3D visual content, playing back the recorded 3D visual content based on the content information of the recorded 3D visual content.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210,S220:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="871" publication-number="202627846"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627846.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以保護解耦之個人識別資訊之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR PROTECTING DECOUPLED PERSONALLY IDENTIFIABLE INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250701B">G06F21/30</main-classification>  
        <further-classification edition="200601120250701B">H04L9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏世康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, SHIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之方法係藉由伺服器而實行者，其包括如下步驟：自第1設備接收第1資料；將上述第1資料加密為複數個用戶資訊符記並儲存；將上述複數個用戶資訊符記發送至上述第1設備；自第2設備接收連接通行符記之產生請求，該第2設備係自上述第1設備接收到上述複數個用戶資訊符記者；產生上述連接通行符記並發送至上述第2設備；自上述第2設備接收上述連接通行符記之解碼請求；及響應於上述解碼請求，將上述連接通行符記解碼為第2資料，上述第2資料包括上述第1資料及上述複數個用戶資訊符記。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401:伺服器</p>  
        <p type="p">402:加密模組</p>  
        <p type="p">403:第1設備</p>  
        <p type="p">404:第2設備</p>  
        <p type="p">405:連接通行符記產生模組</p>  
        <p type="p">406:解碼模組</p>  
        <p type="p">407:第1資料</p>  
        <p type="p">408:連接通行符記</p>  
        <p type="p">409:第2資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="872" publication-number="202626198"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626198.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸媒材料的應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">B01J23/755</main-classification>  
        <further-classification edition="200601120250407B">B01D53/86</further-classification>  
        <further-classification edition="200601120250407B">B01J32/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHYI DING TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉祐誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張庭芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡鴻源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種觸媒材料及其應用。該觸媒材料包括一載體；以及分別以單原子的型態擔載於該載體之一第一過渡金屬及一第二過渡金屬；其中，該載體係選自由鐵鎳氧化物、矽鋁氧化物、氧化鋁、及氧化鈦所組成的群組中之一；該第一過渡金屬為Fe、Cu、Ir或Pt，該第二過渡金屬為Pd、Ni或Co，以該觸媒材料為100wt%計，該第一、第二過渡金屬的重量百分比和為0.2wt%至2.5wt%；且以該第二及該第一過渡金屬之莫爾分率的和為100%計，該第二過渡金屬與該第一過渡金屬之莫爾分率比值為1倍至2倍，以實現處理ppb至ppm級濃度的揮發性污染物，顯著提升處理效率之觸媒材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="873" publication-number="202626815"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626815.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組合物、其製品及其用途</chinese-title>  
        <english-title>RESIN COMPOSITION, ARTICLE MADE THEREFROM AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08F222/10</main-classification>  
        <further-classification edition="200601120260302B">C08F285/00</further-classification>  
        <further-classification edition="200601120260302B">C08L35/02</further-classification>  
        <further-classification edition="200601120260302B">C08L47/00</further-classification>  
        <further-classification edition="200601120260302B">C08K5/5435</further-classification>  
        <further-classification edition="200601120260302B">C09D4/06</further-classification>  
        <further-classification edition="201801120260302B">C09D7/63</further-classification>  
        <further-classification edition="200601120260302B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台光電子材料(昆山)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RONGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣雪燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XUEYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及樹脂組合物、其製品及其用途，所述樹脂組合物包括：(A) 100重量份的馬來酸酐改質聚烯烴；(B) 1~30重量份的脂環式環氧改質矽氧烷，所述脂環式環氧改質矽氧烷具有兩個以上的脂環式環氧基；以及(C) 20~100重量份的丙烯酸酯單體、其寡聚物或其組合，所述丙烯酸酯單體具有兩個以上的不飽和碳碳雙鍵。本發明所述樹脂組合物及其製品至少在以下特性取得了顯著改善：有機物揮發份、對銅箔拉力、介電損耗係數以及Z軸熱膨脹率。本發明所述樹脂組合物可應用在印刷電路板樹脂填塞製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a resin composition, article made therefrom and use thereof. The resin composition includes (A) 100 parts by weight of a maleic anhydride-modified polyolefin, (B) 1 to 30 parts by weight of cycloaliphatic epoxy-modified siloxane, and (C) 20 to 100 parts by weight of an acrylate monomer, its oligomer or combination thereof. The cycloaliphatic epoxy-modified siloxane has at least two cycloaliphatic epoxy groups. The acrylate monomer has at least two unsaturated carbon-carbon double bonds. The resin composition and article made therefrom of the present disclosure have improvements in one or more properties including percent of organic volatile matters, copper foil peeling strength, dissipation factor, and percent of thermal expansion at Z-axis. The resin composition of the present disclosure may be applied to the resin filling process of printed circuit boards.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="874" publication-number="202625947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃機及包含其的清掃機系統</chinese-title>  
        <english-title>CLEANER AND CLEANER SYSTEM INCLUDING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250318B">A47L5/24</main-classification>  
        <further-classification edition="200601120250318B">A47L9/16</further-classification>  
        <further-classification edition="200601120250318B">A47L9/20</further-classification>  
        <further-classification edition="200601120250318B">A47L9/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金翰信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAN SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金詩容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓在勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JAEHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃仁揆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, INKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JUNHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供能藉由抽吸含有灰塵的外部空氣並從空氣中分離灰塵以進行清掃的清掃機及包含該清掃機的清掃機系統。根據本發明一態樣的清掃機包括：主體，包含配置以儲存灰塵的集塵槽；抽吸部件，配置以導引含有灰塵的外部空氣進入集塵槽中；旋風部件，配置以從透過抽吸部件引入的空氣中分離出灰塵；前置過濾器部件，設置在空氣移動路徑中，並配置以從穿過旋風部件的空氣中過濾掉灰塵；及過濾器清潔部件，配置以將由前置過濾器部件收集的灰塵從前置過濾器部件移除。過濾器清潔部件包含：清潔器支撐件，設置在前置過濾器部件內；及過濾器清潔器，配置以在前置過濾器部件的內周表面與清掃機支撐件的外周表面之間垂直移動，並除去收集在前置過濾器部件中的灰塵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a cleaner capable of performing cleaning by suctioning external air containing dust and separating dust from the air, and a cleaner system including the same. A cleaner according to an aspect of the present disclosure includes: a main body including a dustbin configured to store dust; a suction part configured to guide external air containing dust into the dustbin; a cyclone part configured to separate dust from air introduced through the suction part; a pre-filter part provided in an air moving path and configured to filter out dust from air passing through the cyclone part; and a filter cleaning part configured to remove dust collected by the pre-filter part from the pre-filter part. The filter cleaning part includes: a cleaner support provided inside the pre-filter part; and a filter cleaner configured to move vertically between an inner circumferential surface of the pre-filter part and an outer circumferential surface of the cleaner support, and to dislodge dust collected in the pre-filter part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主體</p>  
        <p type="p">110:集塵槽</p>  
        <p type="p">130:手把</p>  
        <p type="p">140:電池</p>  
        <p type="p">150:操作部件</p>  
        <p type="p">200:抽吸部件</p>  
        <p type="p">300:旋風部件</p>  
        <p type="p">400:前置過濾器部件</p>  
        <p type="p">500:過濾器清潔部件</p>  
        <p type="p">510:過濾器清潔器</p>  
        <p type="p">600:抽吸馬達部件</p>  
        <p type="p">700:灰塵清潔部件</p>  
        <p type="p">1000:清掃機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="875" publication-number="202627831"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627831.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搜索引擎模塊的索引遷移方法及支持其的電子裝置</chinese-title>  
        <english-title>METHOD FOR MIGRATING INDEX OF SEARCH ENGINE MODULE AND ELECTRONIC DEVICE SUPPORTING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250401B">G06F16/20</main-classification>  
        <further-classification edition="201901120250401B">G06F16/90</further-classification>  
        <further-classification edition="202201120250401B">H04L67/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一實施例的通過至少一個處理器運行的搜索引擎模塊的索引遷移方法可包括如下步驟：以使得與搜索引擎模塊有關的服務通過代理調用第一集群的方式在服務與第一集群之間設定代理；將通過代理從服務提供的寫入請求路由至第一集群，將與寫入請求有關的資料記錄在存儲器；將第一集群的索引遷移至第二集群；以及響應于完成遷移，將與記錄在存儲器的寫入請求有關的資料資料同步到第二集群。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, executed by at least one processor, for migrating index of search engine module according to an embodiment of the disclosure includes setting a proxy between a service related to the search engine module and a first cluster so that the service invokes the first cluster via the proxy, routing a write request provided from the service via the proxy to the first cluster and recording data related to the write request to a storage, migrating an index of the first cluster to a second cluster, and in response to completion of the migration, synchronizing the data related to the write request recorded in the storage to the second cluster.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:搜索引擎模塊的索引遷移方法</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="876" publication-number="202628044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250626B">G09G3/32</main-classification>  
        <further-classification edition="200601120250626B">G09G5/10</further-classification>  
        <further-classification edition="202001120250626B">H05B45/325</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃一釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括光源模組和處理電路。光源模組包括多個正常發光二極體（LED）單元和目標LED單元。處理電路耦接到光源模組。處理電路用以選擇至少一正常LED單元，並調整用於驅動所述至少一正常LED單元的脈衝寬度調變信號的工作週期和電流值至少其中之一，以補償目標LED單元。所述至少一正常LED單元鄰近目標LED單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus including a light source module and a processing circuit is provided. The light source module includes a plurality of normal light-emitting diode (LED) units and a target LED unit. The processing circuit is coupled to the light source module. The processing circuit is configured to select at least one normal LED unit, and adjust at least one of a duty cycle and a current value of a pulse width modulation signal for driving the at least one normal LED unit to compensate the target LED unit. The at least one normal LED unit is adjacent to the target LED unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:處理電路</p>  
        <p type="p">120:驅動電路</p>  
        <p type="p">120_1、120_2、120_N:LED驅動器</p>  
        <p type="p">130:光源模組</p>  
        <p type="p">132、132_1、132_4、132_5:LED單元</p>  
        <p type="p">134:區域</p>  
        <p type="p">ch_1、ch_2、ch_x:通道</p>  
        <p type="p">P1:第一像素間距</p>  
        <p type="p">P2:第二像素間距</p>  
        <p type="p">S1:PWM信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="877" publication-number="202627450"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627450.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>缺陷檢測方法和缺陷檢測設備</chinese-title>  
        <english-title>DEFECT DETECTION METHOD AND DEFECT DETECTION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G01N21/88</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬樹德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, SU TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種缺陷檢測設備，用以檢測包括週期結構的樣本。缺陷檢測設備包括光源、影像偵測器和控制器。光源用以提供入射在週期結構上的光束，其中週期結構將此光束轉換成干涉光束。影像偵測器設定在干涉光束的路徑上，其中干涉光束在影像偵測器上形成干涉強度分布。控制器電性連接至影像偵測器，且用以透過判斷干涉強度分布是否有正常的波形來判斷週期結構是否有缺陷。一種缺陷檢測方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A defect detection apparatus configured to detect a sample including a periodical structure. The defect detection apparatus includes a light source, an image detector, and a controller. The light source is configured to provide a light beam incident on the periodical structure, wherein the periodical structure converts the light beam into an interference beam. The image detector is disposed on a path of the interference beam, wherein the interference beam forms an interference intensity distribution on the image detector. The controller is electrically connected to the image detector and configured to determine whether the periodical structure has a defect by determining whether the interference intensity distribution has a normal waveform. A defect detection method is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:樣本</p>  
        <p type="p">110:週期結構</p>  
        <p type="p">120:膜層</p>  
        <p type="p">200:缺陷檢測設備</p>  
        <p type="p">210:光源</p>  
        <p type="p">212:光束</p>  
        <p type="p">214:干涉光束</p>  
        <p type="p">220:影像偵測器</p>  
        <p type="p">230:控制器</p>  
        <p type="p">240:濾波器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="878" publication-number="202628413"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628413.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料採集系統及資料採集方法</chinese-title>  
        <english-title>DATA ACQUISITION SYSTEM AND DATA ACQUISITION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H04N7/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鼎捷數智股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIGIWIN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鼎新數智股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DATA SYSTEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張乃心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, NAIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝麗霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, LIXIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李驍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐玲玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, LINGLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊葉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YEWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種資料採集系統及資料採集方法。資料採集系統包括攝影裝置、儲存裝置、主機裝置以及伺服器。主機裝置耦接攝影裝置以及儲存裝置，並且用以透過攝影裝置取得監控影像，且將監控影像備份至儲存裝置。伺服器耦接主機裝置以及儲存裝置，用以從主機裝置或儲存裝置讀取監控影像，並且根據預設識別框從監控影像取得監控資料。伺服器執行目標檢測模組來識別監控資料中的數值，並且伺服器判斷數值的可信度是否大於或等於第一可信度閾值。當伺服器判斷數值的可信度大於或等於第一可信度閾值時，伺服器判斷數值是否在安全範圍內。當伺服器判斷數值未在安全範圍內時，伺服器生成異常通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data acquisition system and a data acquisition method are provided. The data acquisition system includes a photographing device, a storage device, a host device and a server. The host device is coupled to the photographing device and the storage device, and is used to obtain a monitoring image through the photographing device and back up the monitoring image to the storage device. The server is coupled to the host device and the storage device, and is used to read the monitoring image from the host device or the storage device, and obtain monitoring data from the monitoring image according to a preset identification frame. The server executes a target detection module to identify a numerical value in the monitoring data, and the server determines whether the confidence of the numerical value is greater than or equal to a first confidence threshold. When the server determines that the confidence of the numerical value is greater than or equal to the first confidence threshold, the server determines whether the numerical value is within a safe range. When the server determines that the value is not within the safe range, the server generates an exception notification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:資料採集系統</p>  
        <p type="p">110:主機裝置</p>  
        <p type="p">120:攝影裝置</p>  
        <p type="p">130:伺服器</p>  
        <p type="p">140:儲存裝置</p>  
        <p type="p">200:終端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="879" publication-number="202628101"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628101.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及其讀取方法</chinese-title>  
        <english-title>MEMORY DEVICE AND READING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C11/413</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立鴻半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FS-SEMI SEMICONDUCTOR CORPORATION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王研臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YANZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置被揭露，其包含一個四電晶體(4T-SRAM)單元和一感測電路。該4T-SRAM 單元包含兩個用於資料位元儲存的P型MOSFET裝置和兩個用於存取開關的N型MOSFET裝置，4T-SRAM 單元的優點是具有較少數量的MOSFET裝置，可實現更小的單元尺寸和低漏電流。該感測電路包含一開關裝置、一感測閂鎖器和一放電裝置。耦接在該感測閂鎖器和接地電壓軌之間的該開關裝置，被設計為：通過切斷感測閂鎖器中的NMOSFET電晶體到接地電壓軌的通道漏電流路徑，來減少感測電路對4T SRM單元的讀取干擾。通過增加感測時間，來增強用於讀取儲存在 4T SRAM單元中的數位資料的差動電壓訊號。然後，4T SRAM 的讀取裕度得到極大改善，從而實現出色且可靠的讀取。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device is disclosed, comprising a 4T-SRAM cell and a sensing circuit. The 4T-SRAM cell comprising two P-type MOSFET devices for a data bit storage and two N-type MOSFET devices for accessing switches has benefits of less numbers of MOSFET devices for smaller cell size and low leakage current. The sensing circuit comprises a switch device, a sensing latch and a discharge device. The switch device coupled between the sensing latch and the ground voltage rail is designed to reduce the read disturbance to 4T SRAM cell from the sensing circuit by cutting the channel leakage current paths of NMOS transistors in the sensing latch to the ground voltage rail. The differential voltage signals for the reading digital data stored in 4T SRAM cells are enhanced by increasing the sensing period. The read margins for 4T SRAM are then greatly improved leading to excellent reliable reading.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:4T SRAM單元</p>  
        <p type="p">13、14、15、16、23、24、311、313、314、516:NMOSFET裝置</p>  
        <p type="p">11、12、21、22、312:PMOSFET裝置</p>  
        <p type="p">550:感測電路</p>  
        <p type="p">BL 321:位元線</p>  
        <p type="p">
        &lt;img align="absmiddle" height="21px" width="28px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt; 322:互補位元線</p>  
        <p type="p">n3、n4:儲存節點</p>  
        <p type="p">C&lt;sub&gt;BL&lt;/sub&gt; 341、C&lt;sub&gt;BL&lt;/sub&gt; 342:負載電容</p>  
        <p type="p">315:三態緩衝器</p>  
        <p type="p">BLrst:電壓脈衝訊號</p>  
        <p type="p">55、56、57、331、332、534:節點</p>  
        <p type="p">WL 334:字元線</p>  
        <p type="p">Sn:電壓訊號</p>  
        <p type="p">5a、5b:反相器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="880" publication-number="202627232"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627232.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>方形基板真空潤濕裝置及基板雙面去泡潤濕方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250415B">C25D5/00</main-classification>  
        <further-classification edition="200601120250415B">C25D17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴豐科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉怡顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李夢夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉建新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛寬寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供方形基板真空潤濕裝置及基板雙面去泡潤濕方法，潤濕裝置包括主箱體、上蓋板、循環噴淋泵和抽真空單元。主箱體上端開口，主箱體內設有豎向設置的隔板，隔板將主箱體內部空間分隔為噴淋池和溢流池，噴淋池的中部設有掛具安裝架，兩側分別設有一個噴淋管單元；抽真空單元用於對上蓋板和主箱體之間形成的密閉空間抽取真空。在負壓作用下，基板微孔內的氣泡能順利轉移至微孔的口部，方形基板兩側噴淋管單元的噴淋孔朝上，能在基板兩面產生自下向上的液流，液流的推動力能將積存在基板微孔口部的氣泡順利帶出微孔並隨液流向上排出，能顯著減少或避免方形基板兩表面微結構內殘留氣穴，顯著提升潤濕效果，確保基板後續電鍍品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主箱體</p>  
        <p type="p">11:隔板</p>  
        <p type="p">15:循環水入口</p>  
        <p type="p">17:進水口</p>  
        <p type="p">20:掛具安裝架</p>  
        <p type="p">21:掛具</p>  
        <p type="p">30:噴淋管單元</p>  
        <p type="p">40:上蓋板</p>  
        <p type="p">50:液位監測裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="881" publication-number="202627239"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627239.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面電鍍掛具、方形玻璃基板或有機封裝載板的裝載方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C25D17/08</main-classification>  
        <further-classification edition="200601120260302B">C25D21/10</further-classification>  
        <further-classification edition="200601120260302B">C25D7/12</further-classification>  
        <further-classification edition="202601120260302B">H10W76/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴豐科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉怡顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李夢夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉建新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛寬寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供雙面電鍍掛具、方形玻璃基板或有機封裝載板的裝載方法。掛具包括主機板體、回形蓋板和軟排線板；主機板體的基板載持部設有第一方形口，第一方形口的週邊邊部設有第一回形密封圈、定位凸起、第一導電片和外回形密封圈；回形蓋板設有第二方形口，位於第二方形口的週邊邊部設有第二回形密封圈和第二導電片；軟排線板用於主機板體和回形蓋板之間導電傳輸。本發明掛具採用適於方形基板的方形口，提高了方形基板的可用面積占比；方形基板兩面均透過直接接觸式的四周導電片經導線與陰極插頭直連，提高導電可靠性，確保電鍍過程電流穩定性；透過軟排線板實現可靠導電的同時減少回形蓋板開蓋時的分離阻力，提高掛具使用壽命和可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主機板體</p>  
        <p type="p">11:掛具掛持部</p>  
        <p type="p">12:陰極插頭</p>  
        <p type="p">21:基板載持部</p>  
        <p type="p">30:回形蓋板</p>  
        <p type="p">50:軟排線板</p>  
        <p type="p">60:方形基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="882" publication-number="202627933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>會員優惠信息提供方法及計算裝置</chinese-title>  
        <english-title>METHOD AND COMPUTING DEVICE FOR PROVIDING MEMBERSHIP BENEFIT INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250701B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金周賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜河羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宥菈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOO RA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供的會員優惠信息提供方法由至少一個處理器執行。該方法包括如下步驟：針對注册在提供給用戶終端的應用程序上的用戶賬號，識別與用戶賬號的會員使用歷史相關的會員使用信息；基于會員使用信息，生成與會員提供的優惠相關的第一信息；以及將第一信息輸出在與用戶賬號相關的第一頁面上，第一信息包括與提供給用戶賬號的金額優惠相關的信息或與會員提供的優惠類型相關的信息中的至少一個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for providing membership benefit information performed by at least one processor is disclosed. The method includes, identifying membership usage information associated with a history of membership usage for a user account registered on an application provided to a user terminal, generating first information related to benefits provided by the membership based on the membership usage information, and outputting the first information on a first page associated with the user account, wherein the first information includes at least one of information on monetary benefits provided to the user account or information on the types of benefits provided by the membership.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:用戶終端</p>  
        <p type="p">120:第一頁面</p>  
        <p type="p">122:我的標簽按鈕</p>  
        <p type="p">124:用于引導用戶賬號訂閱會員的文本</p>  
        <p type="p">130:第一信息</p>  
        <p type="p">140:第二信息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="883" publication-number="202627584"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627584.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103033</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250320B">G02B7/02</main-classification>  
        <further-classification edition="200601120250320B">G02B13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀志忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, ZHIZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕鈿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIDIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，包括一外罩、一鏡筒、及設置在鏡筒內的多個透鏡。其中，鏡筒的前端部包含一鏡筒物側開孔，鏡筒的後端部包含一鏡筒像側開孔，鏡筒物側開孔的內徑小於鏡筒像側開孔的內徑。外罩呈圓錐狀，設置於鏡筒的前端部的外表面。外罩包含一個外罩物側開孔與一外罩像側開孔，外罩物側開孔的最大外徑小於外罩像側開孔的最大外徑。外罩在光軸上的長度大於鏡筒光軸上的長度的40%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens includes an outer cover, a lens barrel, and a plurality of lens elements arranged in the lens barrel is provided. A front end part of the lens barrel includes a lens barrel object-side opening, and a back end part of the lens barrel includes a lens barrel image-side opening. The inner diameter of the lens barrel object-side opening is smaller than the inner diameter of the lens barrel image-side opening. The outer cover is cone-shaped and is disposed on an outer surface of the front end part of the lens barrel. The outer cover includes an outer cover object-side opening and an outer cover image -side opening. The maximum outer diameter of the outer cover object-side opening is smaller than the maximum outer diameter of the outer cover image-side opening. The length of the outer cover on an optical axis is greater than 40% of the length of the lens barrel on the optical axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">99:成像面</p>  
        <p type="p">100:光學成像鏡頭</p>  
        <p type="p">110:外罩</p>  
        <p type="p">120:鏡筒</p>  
        <p type="p">122:前端部</p>  
        <p type="p">124:後端部</p>  
        <p type="p">130:感壓膠</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">B:夾角</p>  
        <p type="p">D1,D2,Dinmax,Dinmin:內徑</p>  
        <p type="p">Dcvon,Dcvox,Dcv,Dbr:外徑</p>  
        <p type="p">D3,D4:長度</p>  
        <p type="p">Tcv:厚度</p>  
        <p type="p">Wbr:寬度</p>  
        <p type="p">E:參考平面</p>  
        <p type="p">I:光軸</p>  
        <p type="p">L:透鏡</p>  
        <p type="p">O11:外罩物側開孔</p>  
        <p type="p">O12:外罩像側開孔</p>  
        <p type="p">O21:鏡筒物側開孔</p>  
        <p type="p">O22:鏡筒像側開孔</p>  
        <p type="p">S11:外罩環形平面</p>  
        <p type="p">S12:內環圓錐面</p>  
        <p type="p">S13:外罩圓錐面</p>  
        <p type="p">S21:鏡筒環形平面</p>  
        <p type="p">S22:外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="884" publication-number="202626271"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626271.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保持壓力的夾具</chinese-title>  
        <english-title>CLAMP FOR MAINTAINING PRESSURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250414B">B25B5/04</main-classification>  
        <further-classification edition="200601120250414B">B25B5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔晶晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, JING JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭昱甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YU FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHE MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦萍萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, PINGPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張筱嬋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIAO CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於對一部件保持壓力的夾具，夾具包括：一上蓋；一載具，載具與上蓋鉸接；一第一壓合行程控制柱，第一壓合行程控制柱設置於上蓋及/或載具上；及一第二壓合行程控制柱，第二壓合行程控制柱設置於上蓋及/或載具上；其中，第一壓合行程控制柱與第二壓合行程控制柱分別具有不同的一高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A clamp for maintaining pressure on a component, the clamp including: a cover; a carrier, the carrier being hinged to the cover; a first pressing path control post, the first pressing path control post being arranged on the cover and/or the carrier; and a second pressing path control post, the second pressing path control post being arranged on the cover and/or the carrier; wherein a height of the first pressing path control post and a height of the second pressing path control post are different from each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:夾具</p>  
        <p type="p">102:上蓋</p>  
        <p type="p">104:載具</p>  
        <p type="p">106:定位柱</p>  
        <p type="p">108:壓合行程控制柱</p>  
        <p type="p">110:卡勾</p>  
        <p type="p">112:卡合結構</p>  
        <p type="p">114:鉸接件</p>  
        <p type="p">116:仿部件結構</p>  
        <p type="p">118:避讓結構</p>  
        <p type="p">120:容置槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="885" publication-number="202627905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物流運輸服務管理方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR MANAGING LOGISTICS TRANSPORTATION SERVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250508B">G06Q10/04</main-classification>  
        <further-classification edition="202301120250508B">G06Q10/047</further-classification>  
        <further-classification edition="202301120250508B">G06Q10/0631</further-classification>  
        <further-classification edition="202301120250508B">G06Q10/0633</further-classification>  
        <further-classification edition="202401120250508B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250508B">G06Q10/087</further-classification>  
        <further-classification edition="202301120250508B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250508B">G06Q50/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金素美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金明經</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MYOUNGKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴哉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JEMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜金男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JINNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, STACY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李順鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明包括的物流運輸服務管理方法由至少一個處理器執行。本方法包括如下步驟：設定多個出發據點集貨中心及分別與多個出發據點集貨中心相關的取貨覆蓋範圍區域；設定位於多個出發據點集貨中心與多個到達倉儲中心（FC，Fulfillment Center）之間的一個以上途經據點集貨中心；確認與物流運輸相關的訂單列表；基於所確認的訂單列表的取貨出庫地信息向多個出發據點集貨中心分配物流量；基於所分配的物流量設定多個出發據點集貨中心的取貨物流量；對所設定的途經據點集貨中心設定物流量；以及基於所設定的取貨物流量及所設定的途經據點集貨中心的物流量，執行多個出發據點集貨中心與多個到達倉儲中心之間的路線調度（Route Scheduling）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure includes a method for managing logistics transportation services performed by at least one processor. The method comprises setting a plurality of departure hub consolidation centers and pickup coverage areas associated with each of the plurality of departure hub consolidation centers, setting at least one intermediate hub consolidation center located between the plurality of departure hub consolidation centers and a plurality of destination fulfillment centers (FCs), verifying an order list associated with logistics transportation, allocating logistics volumes to the plurality of departure hub consolidation centers based on pickup origin information in the verified order list, determining pickup logistics volumes for the plurality of departure hub consolidation centers based on the allocated logistics volumes, determining logistics volumes for the set intermediate hub consolidation center, and performing route scheduling from the plurality of departure hub consolidation centers to the plurality of destination fulfillment centers based on the determined pickup logistics volumes and the determined logistics volumes of the set intermediate hub consolidation center.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:賣家</p>  
        <p type="p">120:出發據點集貨中心</p>  
        <p type="p">130:第一倉儲中心</p>  
        <p type="p">140:途經據點集貨中心</p>  
        <p type="p">150:第二倉儲中心</p>  
        <p type="p">160:第三倉儲中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="886" publication-number="202627432"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627432.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103598</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>評估虛擬溫度曲線準確率方法、執行設備及存儲介質</chinese-title>  
        <english-title>METHODS, EXECUTION DEVICES, AND STORAGE MEDIUMS CONFIGURED FOR EVALUATING ACCURACIES OF VIRTUAL TEMPERATURE CURVES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250502B">G01K13/00</main-classification>  
        <further-classification edition="201901120250502B">G06F17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉紹玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張軍輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JUN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭智元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種評估虛擬溫度曲線準確率方法、執行設備及存儲介質。評估虛擬溫度曲線準確率方法包括：獲取虛擬溫度曲線的目標係數；獲取預設條件下目標產品的實測溫度曲線和虛擬溫度曲線，預設條件用於指示加熱設備的條件和/或送入加熱設備的目標物件的條件；針對每一預設條件，對比預設條件下的實測溫度曲線和虛擬溫度曲線，得到對比結果；根據各個預設條件下的對比結果得到虛擬溫度曲線的準確率。本申請可以驗證這些虛擬的溫度曲線的準確性，減少焊接缺陷以及提高產品可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a method, an execution device, and a storage medium configured for evaluating accuracies of virtual temperature curves. The method comprises: obtaining a target coefficient of a virtual temperature curve; obtaining a measured temperature curve and the virtual temperature curve of a target product under preset conditions, where the preset conditions are used to indicate conditions of a heating equipment and/or conditions of a target object fed into the heating equipment; comparing the measured temperature curve and the virtual temperature curve under each preset condition to obtain a comparison result; obtaining an accuracy of the virtual temperature curve based on the comparison result under various preset conditions. Accuracies of virtual temperature curves can be verified by this disclosure, such that reducing welding defects and improving products reliabilities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401-S405:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="887" publication-number="202627974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>途經據點集貨中心設定方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR CONFIGURING INTERMEDIATE HUB CONSOLIDATION CENTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250423B">G06Q50/40</main-classification>  
        <further-classification edition="202301120250423B">G06Q30/0601</further-classification>  
        <further-classification edition="202401120250423B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250423B">G06Q10/06</further-classification>  
        <further-classification edition="201301120250423B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金素美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金明經</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MYOUNGKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴哉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JEMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜金男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JINNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, STACY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李順鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的途經據點集貨中心設定方法由至少一個處理器執行，用於在圖形用戶界面（GUI，Graphic User Interface）上設定途經據點集貨中心。該方法包括如下步驟：將與途經據點集貨中心的設定相關的畫面顯示在圖形用戶界面上；接收用於將畫面中的多個據點集貨中心的一個設定為途經據點集貨中心的用戶輸入；接收用於設定向所設定的途經據點集貨中心移動物流的一個以上出發據點集貨中心的用戶輸入；以及接收用於設定物流從設定的途經據點集貨中心所移動到的一個以上到達倉儲中心（FC）的用戶輸入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure includes a method, performed by at least one processor, for setting an intermediate hub consolidation center on a graphic user interface (GUI). The method comprises displaying a screen associated with the setting of the intermediate hub consolidation center on the GUI, receiving a user input selecting one of a plurality of hub consolidation centers as the intermediate hub consolidation center from the screen, receiving a user input setting one or more departure hub consolidation centers that move logistics to the set intermediate hub consolidation center, and receiving a user input setting one or more destination fulfillment centers (FC) to which logistics from the set intermediate hub consolidation center are moved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:物流運輸地圖</p>  
        <p type="p">110:取貨覆蓋範圍區域</p>  
        <p type="p">112:出發據點物流中心</p>  
        <p type="p">120:途經據點物流中心</p>  
        <p type="p">130、142:倉儲中心</p>  
        <p type="p">140:覆蓋範圍區域</p>  
        <p type="p">R1:第一路徑</p>  
        <p type="p">R2:第二路徑</p>  
        <p type="p">R3:第三路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="888" publication-number="202628562"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628562.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250423B">H10B12/00</main-classification>  
        <further-classification edition="202501120250423B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜序</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括中介層和多個記憶體晶粒。中介層具有第一表面和與第一表面相對的第二表面。中介層包括鄰近第一表面的第一接合墊。多個記憶體晶粒以陣列方式排列在中介層的第一表面上。多個記憶體晶粒中的每一個包括第二接合墊，且第二接合墊與對應的第一接合墊直接接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes an interposer and a plurality of memory dies. The interposer has a first surface and a second surface opposite to the first surface. The interposer includes first bonding pads adjacent to the first surface. The plurality of memory dies are arranged in an array on the first surface of the interposer. Each of the plurality of memory dies includes second bonding pads, and the second bonding pads are in direct contact with the corresponding first bonding pads.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:中介層</p>  
        <p type="p">100a:第一表面</p>  
        <p type="p">100b:第二表面</p>  
        <p type="p">110:中介層基板</p>  
        <p type="p">120:重佈線結構</p>  
        <p type="p">122,222:導電層</p>  
        <p type="p">124,144,224,244:介電層</p>  
        <p type="p">126:導電通孔</p>  
        <p type="p">130:第一接合層</p>  
        <p type="p">132:第一接合墊</p>  
        <p type="p">134:第一接合介電層</p>  
        <p type="p">140:穿基底通孔</p>  
        <p type="p">150:導電連接件</p>  
        <p type="p">200:記憶體晶粒</p>  
        <p type="p">200a:第一記憶體晶粒</p>  
        <p type="p">200b:第二記憶體晶粒</p>  
        <p type="p">202:包封層</p>  
        <p type="p">210:基底</p>  
        <p type="p">210a:正面</p>  
        <p type="p">210b:背面</p>  
        <p type="p">220:互連結構</p>  
        <p type="p">230:第二接合層</p>  
        <p type="p">232:第二接合墊</p>  
        <p type="p">234:第二接合介電層</p>  
        <p type="p">240:記憶單元</p>  
        <p type="p">300:封裝基板</p>  
        <p type="p">310:導電端子</p>  
        <p type="p">R1:第一區域</p>  
        <p type="p">R2:第二區域</p>  
        <p type="p">x,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="889" publication-number="202629011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構與其形成方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/62</main-classification>  
        <further-classification edition="202601120260323B">H10W74/10</further-classification>  
        <further-classification edition="202601120260323B">H10W40/22</further-classification>  
        <further-classification edition="202601120260323B">H10W90/20</further-classification>  
        <further-classification edition="202601120260323B">H10B80/00</further-classification>  
        <further-classification edition="202601120260323B">H10D80/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭竣翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, JYUN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周孟緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡毓祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>言　瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, KATHY WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法包括提供中介層結構，其含有多個導電路徑；形成多個微凸塊於中介層結構上，以連接至導電路徑；接合第一晶粒與第二晶粒至微凸塊上；形成成型化合物於第一晶粒與第二晶粒之上與周圍；進行平坦化製程以露出第二晶粒的上表面；形成溝槽於成型化合物中，以露出第一晶粒的上表面；形成熱界面材料層於溝槽之中與第二晶粒的上表面之上；接合中介層結構至基板；以及貼合散熱器至熱界面材料層上。第一晶粒具有第一高度，第二晶粒具有第二高度，且第二高度大於第一高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes providing an interposer structure including conductive paths, forming micro bumps over the interposer structure and connected to the conductive paths, bonding a first die and a second die onto the micro bumps, forming a molding compound over and around the first die and the second die, performing a planarization process to expose a top surface of the second die, forming a trench in the molding compound to expose a top surface of the first die, forming a thermal interface material (TIM) layer in the trench and over the top surface of the second die, bonding the interposer structure to a substrate, and attaching a heat sink onto the TIM layer. The first die has a first height and the second die has a second height greater than the first height.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:結構</p>  
        <p type="p">202:中介層</p>  
        <p type="p">220,230,240:裝置晶粒</p>  
        <p type="p">260:成型化合物</p>  
        <p type="p">264:控制塌陷晶片連接凸塊</p>  
        <p type="p">274:熱界面材料</p>  
        <p type="p">276:背側金屬結構</p>  
        <p type="p">278:封裝基板</p>  
        <p type="p">280:底填層</p>  
        <p type="p">282:散熱器</p>  
        <p type="p">282a:伸長突起物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="890" publication-number="202628403"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628403.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網路封包處理裝置以及網路封包處理方法</chinese-title>  
        <english-title>NETWORK PACKET PROCESSING APPARATUS AND NETWORK PACKET PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250303B">H04L49/90</main-classification>  
        <further-classification edition="202201120250303B">H04L49/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商達發科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種網路封包處理裝置，包含接收環形緩衝器、傳送環形緩衝器及複數個第一處理器核心。該接收環形緩衝器包含複數個儲存區塊，每一儲存區塊用以於一網路封包被處理之前暫存該網路封包的一接收封包描述元。該傳送環形緩衝器包含複數個儲存區塊，每一儲存區塊用以於該網路封包被處理之後暫存該網路封包的一傳送封包描述元。該複數個第一處理器核心用以從該接收環形緩衝器平行地讀取複數個網路封包的複數個接收封包描述元，平行地處理該複數個網路封包，以及將該複數個網路封包的複數個傳送封包描述元平行地寫入至該傳送環形緩衝器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A network packet processing apparatus includes a receive (RX) ring buffer, a transmit (TX) ring buffer, and a plurality of first processor cores. The RX ring buffer includes a plurality of storage blocks, each arranged to buffer an RX packet descriptor of a network packet before the network packet is processed. The TX ring buffer includes a plurality of storage blocks, each arranged to buffer a TX packet descriptor of the network packet after the network packet is processed. The first processor cores retrieve RX packet descriptors of a plurality of network packets from the RX ring buffer in parallel, process the plurality of network packets in parallel, and write TX packet descriptors of the plurality of network packets into the TX ring buffer in parallel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:網路封包處理裝置</p>  
        <p type="p">102:接收環形緩衝器</p>  
        <p type="p">104:傳送環形緩衝器</p>  
        <p type="p">106_1,106_2,106_P,108:處理器核心</p>  
        <p type="p">110:軟體環形緩衝器</p>  
        <p type="p">112,114:網路連接埠</p>  
        <p type="p">116:動態隨機存取記憶體</p>  
        <p type="p">118:封包緩衝器</p>  
        <p type="p">120:網路封包</p>  
        <p type="p">RXD:接收封包描述元</p>  
        <p type="p">TXD:傳送封包描述元</p>  
        <p type="p">SE:狀態元素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="891" publication-number="202628602"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628602.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104033</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D1/60</main-classification>  
        <further-classification edition="202501120260302B">H10D1/68</further-classification>  
        <further-classification edition="202601120260302B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳祥麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林杏芝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉克群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KO CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例涉及包括基底和電容結構的積體電路（integrated circuit，IC）裝置。電容結構包括設置在基底之上的第一導電元件，其中第一導電元件包括多個溝渠從第一導電元件的上側向基底向下延伸。第一導電元件在相鄰的多個溝渠之間的厚度大於或等於多個溝渠的深度。電容結構更包括設置在第一導電元件的上側上並延伸到多個溝渠中的介電元件，以及設置在介電元件上並延伸到多個溝渠中的第二導電元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to an integrated circuit (IC) device that includes a substrate and a capacitor structure. The capacitor structure includes a first conductive element disposed over the substrate, where the first conductive element includes a plurality of trenches extending downward from an upper side of the first conductive element toward the substrate. A thickness of the first conductive element between adjacent ones of the plurality of trenches is greater than or equal to a depth of the plurality of trenches. The capacitor structure further includes a dielectric element disposed on the upper side of the first conductive element and extending into the plurality of trenches, and a second conductive element disposed on the dielectric element and extending into the plurality of trenches.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:3D-MIM電容結構</p>  
        <p type="p">101:介電結構</p>  
        <p type="p">102:塊材導電元件</p>  
        <p type="p">103:導電元件</p>  
        <p type="p">104:&lt;b&gt;介電&lt;/b&gt;元件</p>  
        <p type="p">105:溝渠</p>  
        <p type="p">106A:第一電極</p>  
        <p type="p">106B:第二電極</p>  
        <p type="p">108:導電阻障層</p>  
        <p type="p">109:外壁</p>  
        <p type="p">110:蝕刻停止層</p>  
        <p type="p">H:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="892" publication-number="202628325"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628325.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>開關功率電晶體截止控制電路及驅動晶片</chinese-title>  
        <english-title>CIRCUIT FOR TURNING OFF SWITCHING POWER TRANSISTOR AND DRIVING CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H02M1/08</main-classification>  
        <further-classification edition="200601120250701B">G05F1/565</further-classification>  
        <further-classification edition="200601120250701B">H03K17/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商上海新進芯微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BCD SHANGHAI MICRO-ELECTRONICS COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周敬旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JINGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應征</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫偉光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEIGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉俊豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JUNFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案提供一種開關功率電晶體截止控制電路及驅動晶片，且係關於電力電子技術領域。該電路包含：一第一可控開關、一電壓降偵測電路及一開關控制器。該第一可控開關與該開關功率電晶體耦合，且在該第一可控開關導通時控制該開關功率電晶體截止。該開關控制器經組態以接收該電壓降偵測電路所輸出之一強制導通信號以及一輸入導通信號，並基於時間最長之一信號來控制該第一可控開關導通之一持續時間。在本申請案中，該電壓降偵測電路經組態以偵測用於在該第一可控開關導通時驅動開關功率電晶體之一輸出電流，以確保在關斷該第一可控開關以切換該開關功率電晶體之一通斷狀態時該輸出電流足夠小，從而降低一寄生電感器上產生之一振盪電壓，並且能夠充分地將一容性負載放電，由此改良該開關功率電晶體之一驅動晶片之使用安全性及壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a circuit for turning off a switching power transistor and a driving chip, and relates to the technical field of power electronics. The circuit includes a first controllable switch, a voltage drop detection circuit, and a switch controller. The first controllable switch is coupled with the switching power transistor, and the switching power transistor is turned off when the first controllable switch is turned on. The switch controller is configured to receive a forced conduction signal outputted by the voltage drop detection circuit and an input conduction signal, and control a duration for which the first controllable switch is turned on based on a signal with the longest time. In the application, the voltage drop detection circuit is configured to detect an output current for driving switching power transistor when the first controllable switch is turned on, in order to ensure that the output current is small enough when the first controllable switch is turned off to switch an on/off state of the switching power transistor, reducing an oscillation voltage generated on a parasitic inductor, and fully discharging a capacitive load, thereby improving the safety and service life of a driving chip for the switching power transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一可控開關</p>  
        <p type="p">20:電壓降偵測電路</p>  
        <p type="p">30:開關控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="893" publication-number="202626515"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626515.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於塑膠之經MCT油塗覆之二氧化鈦顏料</chinese-title>  
        <english-title>MCT OIL-COATED TITANIUM DIOXIDE PIGMENT FOR USE IN PLASTICS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260120B">C01G23/047</main-classification>  
        <further-classification edition="200601120260120B">C08K3/22</further-classification>  
        <further-classification edition="200601120260120B">A61K47/14</further-classification>  
        <further-classification edition="200601120260120B">C09B67/10</further-classification>  
        <further-classification edition="200601120260120B">C09C1/36</further-classification>  
        <further-classification edition="200601120260120B">C09D5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商東納斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRONOX LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>粟　權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高帕拉吉　凡卡塔　拉瑪　羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPARAJU, VENKATA RAMA RAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史東　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE, KEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯特　查理斯　史都華　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRIST,CHARLES STEWART, JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於產生用於聚合物組合物中之經處理之二氧化鈦顏料之方法。該方法包括提供複數個二氧化鈦顏料顆粒，該等顆粒中之各者均具有一表面，及將有機處理劑以於基於該等顏料顆粒之重量計約0.2重量%至約2重量%之範圍內之量沉積於該等顏料顆粒之該等表面上。該有機處理劑包括至少一種中鏈三酸甘油酯。亦提供一種用於聚合物組合物中之經處理之二氧化鈦顏料、及一種聚合物組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a treated, titanium dioxide pigment for use in a polymer composition is provided. The process comprises providing a plurality of titanium dioxide pigment particles, each of the particles having a surface, and depositing an organic treating agent on the surfaces of the pigment particles in an amount in the range of from about 0.2% to about 2% by weight, based on the weight of the pigment particles. The organic treating agent includes at least one medium-chain triglyceride. A treated, titanium dioxide pigment for use in a polymer composition, and a polymer composition, are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="894" publication-number="202629039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體晶粒堆疊及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DIE STACKS AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/01</main-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification>  
        <further-classification edition="202601120260302B">H10W74/10</further-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉醇鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TZUAN-HORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇安治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, AN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體組件，其包括含基板穿孔（TSV）的半導體晶粒、黏著層和半導體載體基板。含基板穿孔（TSV）的半導體晶粒包括第一半導體基板，其中形成基板穿孔（TSV）結構、第一半導體元件和位於第一半導體基板前側的前側連接墊，以及位於第一半導體基板背側的背側金屬內連線結構。半導體組件可使用晶粒貼附膜附著到載體晶圓上。半導體載體基板和黏著層可從半導體組件移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor assembly is provided, which includes a through-substrate-via-containing semiconductor die, an adhesive layer, and a semiconductor carrier substrate. The through-substrate-via-containing semiconductor die includes a first semiconductor substrate having through-substrate-via structures formed therein, first semiconductor devices, and front connection pads located on a front side of the first semiconductor substrate, and backside metal interconnect structures located on a backside of the first semiconductor substrate. The semiconductor assembly may be attached to a carrier wafer using a die attachment film. The semiconductor carrier substrate and the adhesive layer may be removed from the semiconductor assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:元件半導體晶粒</p>  
        <p type="p">110:半導體基板</p>  
        <p type="p">120:第二半導體元件</p>  
        <p type="p">150:第二介電材料層</p>  
        <p type="p">160:第二金屬內連線結構</p>  
        <p type="p">180:連接級介電層</p>  
        <p type="p">188:連接金屬墊</p>  
        <p type="p">190:凸塊級介電層</p>  
        <p type="p">198:第二凸塊結構</p>  
        <p type="p">300:含基板穿孔的半導體晶粒</p>  
        <p type="p">302:絕緣間隙壁</p>  
        <p type="p">304:基板穿孔結構</p>  
        <p type="p">310:第一半導體基板</p>  
        <p type="p">316:背側絕緣層</p>  
        <p type="p">320:第一半導體元件</p>  
        <p type="p">340:第一背側金屬內連線結構</p>  
        <p type="p">350:第一介電材料層</p>  
        <p type="p">360:第一金屬內連線結構</p>  
        <p type="p">370:第一前側介電頂蓋層</p>  
        <p type="p">372:第二前側介電頂蓋層</p>  
        <p type="p">378:前側連接墊</p>  
        <p type="p">397:第一模製化合物矩陣</p>  
        <p type="p">460:第一介電接合層</p>  
        <p type="p">480:第一接合級金屬內連線結構</p>  
        <p type="p">493:焊料部分</p>  
        <p type="p">495:底部填充劑材料部分</p>  
        <p type="p">497:第二模製化合物矩陣</p>  
        <p type="p">498:第一凸塊結構</p>  
        <p type="p">560:第二介電接合層</p>  
        <p type="p">580:第二接合級金屬內連線結構</p>  
        <p type="p">593:焊料球</p>  
        <p type="p">598:金屬凸塊結構</p>  
        <p type="p">800:複合晶粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="895" publication-number="202626816"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626816.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含磷聚合物、包含其的樹脂組合物及其製品</chinese-title>  
        <english-title>PHOSPHORUS-CONTAINING POLYMER, RESIN COMPOSITION INCLUDING THE SAME, AND ARTICLE MADE THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C08F222/22</main-classification>  
        <further-classification edition="200601120250501B">C08F226/06</further-classification>  
        <further-classification edition="200601120250501B">C08F230/02</further-classification>  
        <further-classification edition="200601120250501B">C08L25/02</further-classification>  
        <further-classification edition="200601120250501B">C08L25/10</further-classification>  
        <further-classification edition="200601120250501B">C08L35/02</further-classification>  
        <further-classification edition="200601120250501B">C08L39/04</further-classification>  
        <further-classification edition="200601120250501B">C08L43/02</further-classification>  
        <further-classification edition="200601120250501B">C08L47/00</further-classification>  
        <further-classification edition="200601120250501B">C08L53/02</further-classification>  
        <further-classification edition="200601120250501B">C08L61/32</further-classification>  
        <further-classification edition="200601120250501B">C08L65/00</further-classification>  
        <further-classification edition="200601120250501B">C08L71/12</further-classification>  
        <further-classification edition="200601120250501B">C08L79/04</further-classification>  
        <further-classification edition="200601120250501B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台光電子材料（昆山）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RENSONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅兆鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, ZHAOPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉程松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENGSONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛軼強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, YIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及含磷聚合物、包含其的樹脂組合物及其製品。所述含磷聚合物是由來源於第一單體的結構單元和來源於第二單體的結構單元組成的含磷聚合物，所述第一單體為含磷單體；所述含磷聚合物的磷含量為2.5~8.5wt%。包含該含磷聚合物的樹脂組合物及其製品具有優異的阻燃性同時兼具優異的吸濕耐熱性、優異的PP耐沾黏性、更高的玻璃轉化溫度、更高的剝離強度、更好的基板外觀和更低的介電損耗係數等特性中的一種以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a phosphorus-containing polymer, resin composition including the same, and article made therefrom. The phosphorus-containing polymer is a phosphorus-containing polymer consists of a structural unit derived from a first monomer and a structural unit derived from a second monomer, the first monomer is a phosphorus-containing monomer; the phosphorus content of the phosphorus-containing polymer is 2.5 to 8.5 wt%. The resin composition comprising the phosphorus-containing polymer and articles made therefrom have excellent flame resistance while having at least one property including excellent heat resistance after moisture absorption, excellent prepreg stickiness resistance, a higher glass transition temperature, a higher peel strength, an improved substrate appearance, and a lower dissipation factor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="896" publication-number="202626803"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626803.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組合物及其製品</chinese-title>  
        <english-title>RESIN COMPOSITION AND ARTICLE MADE THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C08F212/34</main-classification>  
        <further-classification edition="200601120250501B">C08F212/36</further-classification>  
        <further-classification edition="200601120250501B">C08F230/02</further-classification>  
        <further-classification edition="200601120250501B">C08L25/02</further-classification>  
        <further-classification edition="200601120250501B">C08L25/10</further-classification>  
        <further-classification edition="200601120250501B">C08L43/02</further-classification>  
        <further-classification edition="200601120250501B">C08L47/00</further-classification>  
        <further-classification edition="200601120250501B">C08L53/02</further-classification>  
        <further-classification edition="200601120250501B">C08L61/32</further-classification>  
        <further-classification edition="200601120250501B">C08L65/00</further-classification>  
        <further-classification edition="200601120250501B">C08L71/12</further-classification>  
        <further-classification edition="200601120250501B">C08L79/04</further-classification>  
        <further-classification edition="200601120250501B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台光電子材料（昆山）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RENSONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈晨宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RONGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛軼強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, YIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及樹脂組合物及其製品。本發明的樹脂組合物包含：成分(A)：100重量份的含不飽和碳碳雙鍵的聚苯醚樹脂和/或馬來醯亞胺樹脂和/或聚烯烴，以及成分(B)：20~80重量份的含磷聚合物。本發明的樹脂組合物及其製品具有優異的阻燃性，同時兼具更高的玻璃轉化溫度、更高的剝離強度、更優異的吸濕耐熱性、更低的介電損耗係數等特性中的一種以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a resin composition and an article made therefrom. The resin composition according to the present disclosure comprises component (A): 100 parts by weight of an unsaturated carbon-carbon double bond-containing polyphenylene ether resin and/or maleimide resin and/or polyolefin, and component (B): 20 to 80 parts by weight of the phosphorus-containing polymer. The resin composition according to the present disclosure and the article made therefrom have excellent flame resistance while having at least one property including higher glass transition temperature, higher peel strength, better moisture-absorbed heat resistance, and lower dissipation factor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="897" publication-number="202629030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W72/50</main-classification>  
        <further-classification edition="202601120260302B">H10P34/40</further-classification>  
        <further-classification edition="202601120260302B">H10W70/60</further-classification>  
        <further-classification edition="202601120260302B">H10W20/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游秋山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, CHUE-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　學理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, HARRY-HAK-LAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧立峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, LI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳偉成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置的裝置層和互連層形成為分離的半導體結構（例如，在不同半導體基底上），然後，在形成裝置層和互連層之後，分離的半導體結構被接合在一起。在一些實施例中，對包括互連層的第一半導體結構執行電荷減少製程（例如UV光固化製程），使得形成互連層的電漿處理所產生的電荷可在包括互連層的第一半導體結構與包括裝置層的第二半導體結構接合之前被移除。由於電荷移除，與裝置層和互連層依序形成在相同半導體基底上的情況相比，可減少和/或防止裝置層中的介電層（例如閘極氧化層）中的電流流動，以及由此導致的電漿引起的介電層損壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device layer and an interconnect layer of a semiconductor device are formed as separate semiconductor structures (e.g., on different semiconductor substrates) and then, following formation of the device and interconnect layers, the separate semiconductor structures are bonded together. In some implementations, a charge reduction process (e.g., an ultraviolet (UV) light curing process) is performed on a first semiconductor structure including the interconnect layer so that charges resulting from plasma processing to form the interconnect layer can be removed prior to bonding the first semiconductor structure including the interconnect layer to a second semiconductor structure including the device layer. As a result of the charge removal, current flow in dielectric layers (e.g., gate oxide layers) in a device layer, and resulting plasma-induced damage to the dielectric layers, can be reduced and/or prevented in comparison to when the device layer and interconnect layer are sequentially formed on the same semiconductor substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:製程</p>  
        <p type="p">810、820、830、840、850、860、870:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="898" publication-number="202627551"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627551.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置及製造方法</chinese-title>  
        <english-title>OPTICAL DEVICES AND METHODS OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250714B">G02B6/04</main-classification>  
        <further-classification edition="201301120250714B">H04B10/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪靖傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡侑廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YOU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈維晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊沛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光纖陣列單元的製造和使用的裝置和方法。在實施例中，第一凹槽形成在光纖陣列單元基底內，第一凹槽具有與光纖陣列單元基底的第一側相鄰的第一寬度和與光纖陣列單元基底的第二側相鄰的第二寬度，第一寬度與第二寬度不同。第一光纖放置在第一凹槽內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Devices and methods of manufacture and use of a fiber array unit are presented. In embodiments a first groove is formed within a fiber array unit substrate, the first groove having a first width adjacent to a first side of the fiber array unit substrate and a second width adjacent to a second side of the fiber array unit substrate, the first width different from the second width. A first optical fiber is placed within the first groove.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光纖陣列單元</p>  
        <p type="p">101:第一部分</p>  
        <p type="p">103:基底</p>  
        <p type="p">105:第一凹槽</p>  
        <p type="p">107:第一光纖</p>  
        <p type="p">109:第一側</p>  
        <p type="p">111:第二側</p>  
        <p type="p">F&lt;sub&gt;C109&lt;/sub&gt;、F&lt;sub&gt;C111&lt;/sub&gt;:通道</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:第一長度</p>  
        <p type="p">t&lt;sub&gt;a&lt;/sub&gt;、t&lt;sub&gt;b&lt;/sub&gt;:位置</p>  
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;:第一寬度</p>  
        <p type="p">W&lt;sub&gt;2&lt;/sub&gt;:第二寬度</p>  
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;:第一角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="899" publication-number="202627991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多視角影像之動態標定方法</chinese-title>  
        <english-title>DYNAMIC CALIBRATION METHOD FOR IMAGES WITH MULTIPLE VIEWING DIRECTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250303B">G06T7/80</main-classification>  
        <further-classification edition="201701120250303B">G06T7/20</further-classification>  
        <further-classification edition="201801120250303B">H04N13/246</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商輝創電子科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHETRON ELECTRONICS (SUZHOU)CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李夢瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MENG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳加增</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-TSENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多視角影像之動態標定方法，用以解決習知靜態標定法不便利的問題。係包含：各影像擷取單元在各視角上擷取多個運動位置的擷取影像，對應實際場景中的參考特徵點，生成對應的影像特徵點；將影像特徵點轉換為投影特徵點；及根據投影特徵點基於當前初始外參的一當前分布關係，與基於已標定外參的一理想分布關係的差異，標定各影像擷取單元的x、y及z軸向傾角；及標定各影像擷取單元的初始外參中的x、y及z軸向位置，使各視角中對應同一參考特徵點的投影特徵點重疊。本發明可以達成便利且精準標定各視角影像擷取單元外參的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dynamic calibration method for images with multiple viewing directions is adapted for solving the inconvenient problem of the conventional static calibrating method. The dynamic calibration method includes the following steps. Multiple image capturing unit each captures captured images with multiple moving positions in a respective viewing direction. In each one of the captured images, referencing points in an environment are respectively formed into image points. The image points are converted into projected points. According to differences between a current arrangement of the projected points formed from initial extrinsic parameters and an idea arrangement of the projected points formed from calibrated extrinsic parameters, a rotation parameter of x-axis, a rotation parameter of y-axis and a rotation parameter of z-axis of each image capturing unit are calibrated, and a translation parameter of x-axis, a translation parameter of y-axis and a translation parameter of z-axis of each image capturing unit are calibrated, so that the projected points of each viewing direction generated from the same one of the referencing points are overlapped. This invention can achieve the effect of conveniently and accurately calibrating the extrinsic parameters for the capturing image units with different viewing directions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="900" publication-number="202628989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104652</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體冷卻裝置、半導體部件、半導體冷卻裝置的製造方法、及半導體部件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W40/25</main-classification>  
        <further-classification edition="202601120260302B">H10W40/22</further-classification>  
        <further-classification edition="202601120260302B">H10W40/10</further-classification>  
        <further-classification edition="202601120260302B">H10W40/00</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPIDUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本圭司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, KEISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川清久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, KIYOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供更改善放熱特性的半導體冷卻裝置(1)。半導體冷卻裝置(1)，係接合至半導體裝置(100)的一主面即第1半導體裝置主面(401)，其中，具備：基材部(16)、及由具有比矽還高的熱傳導率的材料形成的熱傳導部(10)；將從半導體裝置(100)的另一主面即第2半導體裝置主面(402)向第1半導體裝置主面(401)的方向作為第1層積方向(301)的情形，熱傳導部(10)，包含：鄰接至第1半導體裝置主面(401)，並在與第1半導體裝置主面(401)平行的方向擴展的第2熱傳導部(14)、及從第2熱傳導部(14)在第1層積方向(301)延伸的第1熱傳導部(12)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體冷卻裝置</p>  
        <p type="p">10:熱傳導部</p>  
        <p type="p">12:第1熱傳導部</p>  
        <p type="p">14:第2熱傳導部</p>  
        <p type="p">16:基材</p>  
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:半導體裝置基板</p>  
        <p type="p">121:裏面配線層</p>  
        <p type="p">131:表面元件層</p>  
        <p type="p">133:表面配線層</p>  
        <p type="p">135:接合層</p>  
        <p type="p">190:半導體裝置連接層</p>  
        <p type="p">200:半導體部件</p>  
        <p type="p">300:層積方向</p>  
        <p type="p">301:第1層積方向</p>  
        <p type="p">302:第2層積方向</p>  
        <p type="p">304:第1面方向</p>  
        <p type="p">311:絕緣膜厚度</p>  
        <p type="p">401:第1半導體裝置主面</p>  
        <p type="p">402:第2半導體裝置主面</p>  
        <p type="p">411:第1半導體裝置基板主面</p>  
        <p type="p">412:第2半導體裝置基板主面</p>  
        <p type="p">1100:有機基板</p>  
        <p type="p">1200:再配線層</p>  
        <p type="p">1210:再配線層連接層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="901" publication-number="202628481"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628481.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>LED驅動系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250317B">H05B45/10</main-classification>  
        <further-classification edition="202001120250317B">H05B45/30</further-classification>  
        <further-classification edition="202001120250317B">H05B45/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晏軍榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種發光二極體（Light Emitting Diode，LED）驅動系統，包括變壓器、LED驅動晶片、最低亮度控制電阻、以及採樣調整電路。LED驅動晶片包括功率電晶體，功率電晶體的汲極連接到變壓器的一次繞組，功率電晶體的源極經由最低亮度控制電阻連接到電路參考地。採樣調整電路包括基礎調整電阻、多個電流感測電阻、以及多個撥碼調光開關，基礎調整電阻連接在功率電晶體的源極和LED驅動晶片的電流感測端子之間，多個電流感測電阻中的任意一個電流感測電阻與多個撥碼調光開關中的相應一個撥碼調光開關串聯組成電流感測單元連接在LED驅動晶片的電流感測端子和電路參考地之間。LED驅動晶片的電流感測端子用於接收表徵流過變壓器的一次繞組的一次側電流的電流感測信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:LED驅動系統</p>  
        <p type="p">202:LED驅動晶片</p>  
        <p type="p">204:採樣調整電路</p>  
        <p type="p">AC:交流</p>  
        <p type="p">Co:輸出電容</p>  
        <p type="p">CS:電流感測端子</p>  
        <p type="p">Drain:汲極端子</p>  
        <p type="p">GND:地</p>  
        <p type="p">HV:輸入高壓源</p>  
        <p type="p">Lp:一次繞組</p>  
        <p type="p">Ls:次級電感</p>  
        <p type="p">M1:功率電晶體</p>  
        <p type="p">OVP:過壓保護</p>  
        <p type="p">RH:基礎調整電阻</p>  
        <p type="p">RL1,RL2,...,RLn:電流感測電阻</p>  
        <p type="p">Rs:最低亮度控制電阻</p>  
        <p type="p">S1,S2,...,Sn:撥碼調光開關</p>  
        <p type="p">Source:源極端子</p>  
        <p type="p">T:變壓器</p>  
        <p type="p">VDD:電源電壓</p>  
        <p type="p">V&lt;sub&gt;LED&lt;/sub&gt;:LED電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="902" publication-number="202628978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104725</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體裝置及其形成方法</chinese-title>  
        <english-title>INTEGRATED DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/40</main-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification>  
        <further-classification edition="202301120260302B">H10N97/00</further-classification>  
        <further-classification edition="202501120260302B">H10D1/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡錫翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, SI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">有關於一種積體裝置，包括：基底上方的互連結構；以及互連結構中的電容，電容包括：具有上部部分、第一底表面、第二底表面和第三底表面的底部電極、絕緣層以及頂部電極；其中第一底表面、第二底表面和第三底表面分別藉由第一套筒部分、第二套筒部分和第三套筒部分耦合到上部部分；其中第一套筒部分與第二套筒部分和第三套筒部分在第一方向上測量間隔第一距離；且其中第二套筒部分與第三套筒部分在垂直於第一方向的第二方向上測量間隔第二距離，第二距離大於第一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to an integrated device, including: an interconnect structure over a substrate; and a capacitor in the interconnect structure, the capacitor including: a bottom electrode having an upper portion, a first bottom surface, a second bottom surface, and a third bottom surface, an insulative layer, and a top electrode; where the first bottom surface, the second bottom surface, and the third bottom surface are coupled to the upper portion by a first sleeve portion, a second sleeve portion, and a third sleeve portion respectively; where the first sleeve portion is spaced from the second sleeve portion and the third sleeve portion by a first distance measured in a first direction; and where the second sleeve portion is spaced from the third sleeve portion by a second distance measured in a second direction perpendicular to the first direction, the second distance being greater than the first distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100b:剖視圖</p>  
        <p type="p">102:電容</p>  
        <p type="p">104:層間介電層</p>  
        <p type="p">106:第一多個突出部</p>  
        <p type="p">106a:第一底表面</p>  
        <p type="p">106b:第一套筒部分</p>  
        <p type="p">108:第二多個突出部</p>  
        <p type="p">108a:第二底表面</p>  
        <p type="p">108b:第二套筒部分</p>  
        <p type="p">112:第一方向</p>  
        <p type="p">114:第二方向</p>  
        <p type="p">115:第三方向</p>  
        <p type="p">120:第一厚度</p>  
        <p type="p">124:上部部分</p>  
        <p type="p">126:第一線層</p>  
        <p type="p">128:互連結構</p>  
        <p type="p">130:蝕刻停止層</p>  
        <p type="p">132:介電層</p>  
        <p type="p">A-A’:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="903" publication-number="202628611"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628611.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D30/01</main-classification>  
        <further-classification edition="202501120260302B">H10D30/60</further-classification>  
        <further-classification edition="202501120260302B">H10D62/10</further-classification>  
        <further-classification edition="202601120260302B">H10D86/01</further-classification>  
        <further-classification edition="202501120260302B">H10D86/40</further-classification>  
        <further-classification edition="202301120260302B">H10K59/125</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉凌彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, LING YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏勢錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, SHIH-CI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括基板、位於基板上的介電層、設置在介電層上的氧化物半導體層、閘極絕緣層、閘極電極、保護層以及多個源/汲極電極層。閘極絕緣層形成於氧化物半導體層的表面上。閘極電極形成於閘極絕緣層的表面上。保護層從閘極絕緣層的邊緣沿著氧化物半導體層的表面延伸形成。源/汲極電極層位於閘極電極兩側的氧化物半導體層與保護層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate, a dielectric layer over the substrate, an oxide semiconductor layer disposed on the dielectric layer, a gate insulating layer, a gate electrode, a protection layer, and a plurality of source/drain electrode layers. The gate insulating layer is formed over a surface of the oxide semiconductor layer. The gate electrode is formed over a surface of the gate insulating layer. The protection layer is formed extending from an edge of the gate insulating layer along the surface of the oxide semiconductor layer. The source/drain electrode layers are disposed on the oxide semiconductor layer and the protection layer at two sides of the gate electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:介電層</p>  
        <p type="p">104:閘極電極</p>  
        <p type="p">104s、S2:側壁</p>  
        <p type="p">106:閘極絕緣層</p>  
        <p type="p">106a:邊緣</p>  
        <p type="p">106s、S1:表面</p>  
        <p type="p">108:保護層</p>  
        <p type="p">110a、110b:源/汲極電極層</p>  
        <p type="p">112:層間介電層</p>  
        <p type="p">L1、L2:長度</p>  
        <p type="p">P1:第一部分</p>  
        <p type="p">P2:第二部分</p>  
        <p type="p">OS:氧化物半導體層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="904" publication-number="202627928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以顯示品牌認證徽章之裝置、方法及記錄有命令之記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING COMMANDS FOR DISPLAYING BRAND AUTHENTICATION BADGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">G06Q30/018</main-classification>  
        <further-classification edition="202301120251001B">G06Q30/0601</further-classification>  
        <further-classification edition="201901120251001B">G06F16/957</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳高盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, GAOSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, SE IN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種於應用程式頁面中提供認證徽章之方法。本發明之一實施例之方法可包括如下步驟：隨著藉由外部裝置而執行用以展現電子商務服務內之應用程式頁面之原始碼，自上述外部裝置接收識別與上述應用程式頁面有關之品牌之認證徽章之徽章識別符；基於上述徽章識別符，獲得上述認證徽章之徽章屬性值，上述徽章屬性值包括表示上述認證徽章之第1圖像資料之路徑資訊、及指示上述認證徽章之尺寸之尺寸資訊；基於上述路徑資訊而獲得上述第1圖像資料；及將上述第1圖像資料與上述尺寸資訊傳輸至上述外部裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">102:用戶終端</p>  
        <p type="p">103:外部裝置</p>  
        <p type="p">104:管理者終端</p>  
        <p type="p">110:頁面請求</p>  
        <p type="p">112:動作</p>  
        <p type="p">113:動作</p>  
        <p type="p">114:動作</p>  
        <p type="p">120:動作</p>  
        <p type="p">130:動作</p>  
        <p type="p">140:動作</p>  
        <p type="p">170:動作</p>  
        <p type="p">180:動作</p>  
        <p type="p">190:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="905" publication-number="202627373"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627373.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔熱箱及具備該隔熱箱的電冰箱、以及隔熱箱的生產方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">F25D23/00</main-classification>  
        <further-classification edition="200601120260325B">F25D11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立環球生活方案股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI GLOBAL LIFE SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村考作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KOSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野謙治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供可使隅角部中的強度比以往更加充分提高的隔熱箱。 &lt;br/&gt;[解決手段]隔熱箱係具備：箱體(10)，其係在側表面部(10a)的內部具有真空隔熱材(11)；及間隔構件(20)，其係連接於箱體(10)的內側而將箱體(10)的內側作間隔，箱體(10)與間隔構件(20)係具有將箱體(10)的側表面部(10a)的內部與間隔構件(20)的內部相互相連的孔部(22、23)，間隔構件(20)係具有將發泡隔熱材(13)填充在間隔構件(20)的內部的注入口(21)，在間隔構件(20)的內部與箱體(10)的側表面部(10a)的內部係具有透過孔部(22、23)而相連為一體的發泡隔熱材(13)，孔部(22、23)係分別配設在比側表面部(10a)的內部的真空隔熱材(11)較為前方及後方，發泡隔熱材(13)係沿著側表面部(10a)的內部的真空隔熱材(11)的前緣及後緣的各個延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:箱體</p>  
        <p type="p">10a:側表面部</p>  
        <p type="p">10c:隅角部</p>  
        <p type="p">11:真空隔熱材</p>  
        <p type="p">12:成形隔熱材</p>  
        <p type="p">20:間隔構件</p>  
        <p type="p">21:間隔開口(注入口)</p>  
        <p type="p">22:孔部</p>  
        <p type="p">23:孔部</p>  
        <p type="p">R:補強框架</p>  
        <p type="p">1H:隔熱箱</p>  
        <p type="p">Us:發泡原液</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="906" publication-number="202628731"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628731.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其製造方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260317B">H10H29/30</main-classification>  
        <further-classification edition="202501120260317B">H10H29/855</further-classification>  
        <further-classification edition="202501120260317B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIAO-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李玟擇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEN-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳勇勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUNG-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖士福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SHIH-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種顯示裝置及其製造方法。顯示裝置包含：電路基板；發光單元，設置於電路基板上，發光單元包含第一發光單元和第二發光單元；以及集光結構，包含第一集光結構和第二集光結構，第一集光結構對應於第一發光單元，第二集光結構對應於第二發光單元；於俯視方向上，第一發光單元的中心與第一集光結構的中心之間具有第一距離，第二發光單元的中心與第二集光結構的中心之間具有第二距離，第一集光結構具有第一直徑，第一距離、第二距離和第一直徑滿足以下公式： &lt;br/&gt;&lt;img align="absmiddle" height="40px" width="192px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;C1為第一距離，C2為第二距離，D1為第一直徑且C1和C2不等於0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device and a manufacturing method thereof are provided. The display device comprises: a circuit substrate; light emitting units disposed on the circuit substrate, the emitting light units comprising a first light emitting unit and a second light emitting unit; and light collection structures comprising a first light collection structure and a second light collection structure, the first light collection structure corresponding to the first light emitting unit, and the second light collection structure corresponding to the second light emitting unit; wherein in a top view direction, there is a first distance between a center of the first light emitting unit and a center of the first light collection structure, there is a second distance between a center of the second light emitting unit and a center of the second light collection structure, the first light collection structure has a first diameter, and the first distance, the second distance and the first diameter satisfy the following formula: &lt;br/&gt;&lt;img align="absmiddle" height="40px" width="189px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein C1 is the first distance, C2 is the second distance, D1 is the first diameter, and C1 and C2 are not equal to 0.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:發光單元</p>  
        <p type="p">12A:第一發光單元</p>  
        <p type="p">12B:第二發光單元</p>  
        <p type="p">12C:第三發光單元</p>  
        <p type="p">231:集光結構</p>  
        <p type="p">231A:第一集光結構</p>  
        <p type="p">231B:第二集光結構</p>  
        <p type="p">231C:第三集光結構</p>  
        <p type="p">P:像素</p>  
        <p type="p">S1:間隔件</p>  
        <p type="p">C1:第一距離</p>  
        <p type="p">C2:第二距離</p>  
        <p type="p">C3:第三距離</p>  
        <p type="p">D1:第一直徑</p>  
        <p type="p">D2:第二直徑</p>  
        <p type="p">D3:第三直徑</p>  
        <p type="p">D4、D5、D6:尺寸</p>  
        <p type="p">ED1:第一延伸方向</p>  
        <p type="p">ED2:第二延伸方向</p>  
        <p type="p">ED3:第三延伸方向</p>  
        <p type="p">P1:像素間距</p>  
        <p type="p">P2:第一子像素間距</p>  
        <p type="p">P3:第二子像素間距</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:俯視方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="907" publication-number="202627924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理結算卡之折扣優惠資訊之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PROCESSING DISCOUNT BENEFIT INFORMATION OF PAYMENT CARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250801B">G06Q20/38</main-classification>  
        <further-classification edition="201201120250801B">G06Q20/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許乃京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAEKYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴在乙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JAEEUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金藝恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YAEEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具璉靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOO, YEONJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明一實施例，可提出一種處理結算卡之折扣優惠資訊之裝置。本發明之裝置可以如下方式構成：自用戶之終端接收對與目標商品相關聯之第1頁面之請求資訊；識別用作上述目標商品之結算方式時對上述目標商品之結算金額提供折扣優惠之一個以上之候選結算卡；基於上述用戶之結算方式管理歷史，於上述一個以上之候選結算卡中確定擬推薦給上述用戶之目標結算卡；基於上述目標結算卡對上述目標商品之上述結算金額之折扣優惠，產生上述目標商品之折扣價格資訊；產生用以展現上述第1頁面之第1展現資訊並傳輸至上述用戶之終端，該第1頁面包括上述目標商品之上述折扣價格資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:終端</p>  
        <p type="p">120:裝置</p>  
        <p type="p">130:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="908" publication-number="202627925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供結算卡之折扣優惠資訊之方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM FOR PROVIDING DISCOUNT BENEFIT INFORMATION OF PAYMENT CARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250801B">G06Q20/38</main-classification>  
        <further-classification edition="201201120250801B">G06Q20/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許乃京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAEKYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴在乙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JAEEUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金藝恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YAEEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具璉靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOO, YEONJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之提供結算卡之折扣優惠資訊之方法可包括如下步驟：自用戶之終端接收與第1商品相關聯之第1頁面之第1請求資訊；隨著接收到上述第1請求資訊，基於上述用戶之結算方式管理歷史來識別基準結算卡，該基準結算卡係於用作上述第1商品之結算方式時針對上述第1商品之結算金額而提供折扣優惠之；基於上述基準結算卡針對上述第1商品之上述結算金額之折扣優惠，產生上述第1商品之第1折扣價格資訊；及產生第1展現資訊並傳輸至上述用戶之終端，該第1展現資訊係用於展現包括上述第1折扣價格資訊之上述第1頁面者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:終端</p>  
        <p type="p">120:裝置</p>  
        <p type="p">130:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="909" publication-number="202629035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及形成其的方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/00</main-classification>  
        <further-classification edition="202601120260302B">H10W20/20</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李兆偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHAO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佩璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PEI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝政吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡毓祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>言　瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, KATHY WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種封裝結構和形成其的方法。封裝結構包括電路基底、設置在電路基底上且與電路基底電性連接的封裝單元、設置在電路基底上的模製層、設置在封裝單元上的熱界面材料（TIM）、設置在TIM上且通過TIM黏附到封裝單元的金屬蓋。模製層環繞封裝單元且覆蓋封裝單元的側壁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure and a method of forming the same are provided. The package structure includes a circuit substrate, a package unit disposed on and electrically connected to the circuit substrate, a molding layer disposed on the circuit substrate, a thermal interface material (TIM) disposed on the package unit; a lid disposed on the TIM and adhered to the package unit through the TIM. The molding layer surrounds the package unit and covers sidewalls of the package unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:封裝單元</p>  
        <p type="p">12T:背側表面</p>  
        <p type="p">20:電路基底</p>  
        <p type="p">20T:頂表面</p>  
        <p type="p">25:連接端子</p>  
        <p type="p">30:被動元件</p>  
        <p type="p">102、104:晶粒</p>  
        <p type="p">103、107:底膠</p>  
        <p type="p">105:封裝體</p>  
        <p type="p">106:重分佈層</p>  
        <p type="p">108:中介層</p>  
        <p type="p">302:凹槽</p>  
        <p type="p">310:模製層</p>  
        <p type="p">320:熱界面材料/TIM</p>  
        <p type="p">330:黏合劑</p>  
        <p type="p">340:金屬蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="910" publication-number="202628787"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628787.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P10/00</main-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202601120260302B">H10P14/60</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification>  
        <further-classification edition="202601120260302B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇淑慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SHU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭新立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HSIN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐英傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUI, FELIX YINGKIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">犧牲測試墊形成於半導體晶粒中，用於測試操作，然後在測試操作完成後移除。移除犧牲測試墊消除了可能由多次測試探針的使用對犧牲測試墊造成損壞而導致的任何不利影響（例如，對半導體晶粒的結構和/或接合的影響）。例如，在形成互連層的部分和形成接合區域之前移除犧牲測試墊，防止了可能由犧牲測試墊上的標記、凹槽、突起和/或其他缺陷造成的任何不平整表面、增加的氧化和/或蝕刻污染。因此，可以隨後形成金屬化結構、互連結構和接合結構，而不會出現可能歸因於損壞的測試墊的缺陷。與測試操作相關的測試互連結構可能保留在半導體晶粒中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Sacrificial test pads are formed in a semiconductor die, used for testing operations, and then removed after the testing operations have been completed. The removal of the sacrificial test pads eliminates any adverse effects (e.g., on structures and/or bonding of the semiconductor die) that may have been caused by damage to the sacrificial test pads from multiple test probe applications. For example, the removal of the sacrificial test pads prior to forming portions of an interconnect layer and forming a bonding region prevents any uneven surfaces, increased oxidation, and/or etching contamination that could have been caused by marks, recesses, protrusions, and/or other imperfections in the sacrificial test pads. As a result, metallization structures, interconnect structures, and bonding structures may be subsequently formed without defects that may have been attributed to damaged test pads. Testing interconnect structures used in connection with the testing operations may remain in the semiconductor die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:製程</p>  
        <p type="p">610、620、630、640、650、660、670:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="911" publication-number="202628639"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628639.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105033</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260323B">H10D62/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張智杭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖珮君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊慧文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HUEI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了形成半導體封裝的方法。在第一半導體晶粒上形成具有凹槽的間隙填充層。將第二半導體晶粒放置在凹槽中。在第二半導體晶粒和間隙填充層之間保留間隙。將第一半導體晶粒和第二半導體晶粒接合在一起。形成填充間隙的上部區域的密封層。間隙的下部區域作為氣隙，沒有填充固體材料。還公開了如此形成的半導體封裝，以及將這種封裝用於各種應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for forming a semiconductor package are disclosed. A gap fill layer with a recess is formed on a first semiconductor die. A second semiconductor die is placed in the recess. A gap remains between the second semiconductor die and the gap fill layer. The first semiconductor die and the second semiconductor die are bonded together. A sealant layer is formed that fills an upper region of the gap. The lower region of the gap serves as an air gap, and is not filled with a solid material. Semiconductor packages so formed are also disclosed, as well as using such packages for various applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:第一方法</p>  
        <p type="p">305、310、315、320、325、330、335、340、345、350、355、360:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="912" publication-number="202627778"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627778.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105039</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控裝置及其用於提升能效的方法</chinese-title>  
        <english-title>TOUCH DEVICE AND METHOD THEREOF FOR ENHANCING ENERGY EFFICIENCY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">G06F3/041</main-classification>  
        <further-classification edition="201901120250303B">G06F1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林浚弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛元富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, YUAN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉雲翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YUN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於觸控裝置操作觸控面板的方法包括將觸控面板的第一區配置給觸控控制電路，並對第一區進行二維掃描。所述方法還包括將觸控面板的第二區配置給觸控控制電路，並對第二區應用與第一區不同的掃描方法或掃描率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for use by a touch device to operate a touch panel includes allocating a first area of the touch panel to a touch control circuit, and performing a 2-dimentional scan on the first area. The method further includes allocating a second area of the touch panel to the touch control circuit, and applying a scan method or scan rate to the second area different from the first area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">S302至S308:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="913" publication-number="202627482"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627482.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶粒測試結構</chinese-title>  
        <english-title>DIE TESTING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G01R1/04</main-classification>  
        <further-classification edition="200601120260302B">G01R1/073</further-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification>  
        <further-classification edition="202601120260302B">H10W46/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王垂堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUEI-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張道生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TAO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳金達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　錦興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KAM HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多個單片化晶粒測試結構及其形成方法。在一些實施例中，測試結構包括位於對準平台上方的冷板，對準平台包括複數個晶粒測試位置、複數個感測器、複數個加熱器以及複數個真空子通道。每一個加熱器可以位於對應的感測器下方。真空通道可以連接到位於每一個感測器之間的複數個真空子通道。測試結構可更包括多個單片化晶粒保持器，其包括晶粒凹槽。在一些實施例中，多個單片化晶粒保持器包括高熱導材料層以及低熱導材料層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multiple singulated die testing structure and methods for forming the same. In some embodiments, the testing structure includes a cold plate located above an alignment stage that includes a plurality of die testing locations, a plurality of sensors, a plurality of heaters, and a plurality of vacuum sub-channels. Each heater may be located below a corresponding sensor. A vacuum channel may connect to the plurality of vacuum sub-channels located between each sensor. The testing structure may further include a multiple singulated die holder that include die grooves. In some embodiments, the multiple singulated die holder includes a high thermal conductivity material layer and a low thermal conductivity material layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:多個單片化晶粒測試結構</p>  
        <p type="p">106:冷板</p>  
        <p type="p">108:真空通道</p>  
        <p type="p">110:真空子通道</p>  
        <p type="p">112:加熱器</p>  
        <p type="p">114:感測器</p>  
        <p type="p">116:晶粒</p>  
        <p type="p">118:對準平台</p>  
        <p type="p">120:固定真空子通道</p>  
        <p type="p">122:單片化晶粒保持器</p>  
        <p type="p">123:基板</p>  
        <p type="p">140:真空子通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="914" publication-number="202628603"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628603.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體晶片和其形成方法</chinese-title>  
        <english-title>INTEGRATED CHIP AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251023B">H10D1/66</main-classification>  
        <further-classification edition="202501120251023B">H10D1/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, GUANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李名哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊哲維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHE WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李璧伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, BI-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昇照</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-CHAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">積體晶片包括第一導電內連線、介電結構和溝槽電容器。第一導電內連線在半導體基底上方。介電結構包括多個介電層在第一導電內連線上方。溝槽電容器在介電結構上方並延伸於介電結構側壁之間到第一導電內連線。溝槽電容器包括底部電極層、頂部電極層在底部電極層上方、以及第一絕緣層在底部電極層和頂部電極層之間。第一絕緣層下表面在介電結構側壁之間並間隔在第一導電內連線上表面上方。底部電極層包括第一金屬化合物，其從第一絕緣層下表面延伸到第一導電內連線上表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated chip including a first conductive interconnect, a dielectric structure, and a trench capacitor. The first conductive interconnect is over a semiconductor substrate. The dielectric structure includes a plurality of dielectric layers over the first conductive interconnect. The trench capacitor is over the dielectric structure and extends between sidewalls of the dielectric structure to the first conductive interconnect. The trench capacitor includes a bottom electrode layer, a top electrode layer over the bottom electrode layer, and a first insulator layer between the bottom electrode layer and the top electrode layer. A lower surface of the first insulator layer is between the sidewalls of the dielectric structure and spaced over an upper surface of the first conductive interconnect. The bottom electrode layer includes a first metal compound which extends from the lower surface of the first insulator layer to the upper surface of the first conductive interconnect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:剖面圖</p>  
        <p type="p">102、110、114、118:層間介電層</p>  
        <p type="p">104:導電內連線</p>  
        <p type="p">104a、106c、122a、122b、122c、124d、124e、124f:上表面</p>  
        <p type="p">106:介電結構</p>  
        <p type="p">106a、106b、122d、122e、124g、124h:側壁</p>  
        <p type="p">108、112、116:介電蝕刻停止層</p>  
        <p type="p">120:溝槽電容器</p>  
        <p type="p">122:底部電極層</p>  
        <p type="p">124:第一絕緣層</p>  
        <p type="p">124a、124i、124j:下表面</p>  
        <p type="p">124b、124c:外側壁</p>  
        <p type="p">126:頂部電極層</p>  
        <p type="p">126a:表面</p>  
        <p type="p">128:空腔</p>  
        <p type="p">130:介電封頂層</p>  
        <p type="p">132:介電層</p>  
        <p type="p">134:接觸件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="915" publication-number="202627494"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627494.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體測試設備及半導體測試方法</chinese-title>  
        <english-title>SEMICONDUCTOR TESTING APPARATUS AND SEMICONDUCTOR TESTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R1/073</main-classification>  
        <further-classification edition="200601120260102B">G01R1/20</further-classification>  
        <further-classification edition="200601120260102B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王敏哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MILL-JER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林霈青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PEI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　錦興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KAM HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體測試設備，包括探針卡、至少一開關以及診斷結構。探針卡包括電路板，電路板具有第一側和與第一側相對的第二側。至少一開關配置在電路板的第一側與第二側中的至少一者上，其中至少一開關電性連接於電路板。診斷結構可拆卸地設置於電路板上，且電性連接電路板與至少一開關中的至少一者，以診斷探針卡與至少一開關中的至少一者的電性特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor testing apparatus includes a probe card, at least one switch and a diagnosis structure. The probe card includes a circuit board, the circuit board has a first side and a second side opposite to the first side. The at least one switch is disposed on at least one of the first side and the second side of the circuit board, wherein the at least one switch is electrically connected to the circuit board. The diagnosis structure is detachably disposed on the circuit board and electrically connected to at least one of the circuit board and the at least one switch to diagnose electrical properties of at least one of the probe card and the at least one switch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:半導體測試設備</p>  
        <p type="p">110a:探針卡</p>  
        <p type="p">112:電路板</p>  
        <p type="p">114、116:導電性連接件</p>  
        <p type="p">120a、120b、120c、120d:開關</p>  
        <p type="p">130:診斷結構</p>  
        <p type="p">132:開關診斷板</p>  
        <p type="p">134:彈簧頭</p>  
        <p type="p">136:彈簧針</p>  
        <p type="p">140:固定組合件</p>  
        <p type="p">142:第一固定元件</p>  
        <p type="p">144:第二固定元件</p>  
        <p type="p">H:高度</p>  
        <p type="p">L11、L12、L13:環迴路徑</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="916" publication-number="202626170"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626170.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體晶圓的製造方法及液體化學品供應系統</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER AND LIQUID CHEMICAL SUPPLY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B01D35/06</main-classification>  
        <further-classification edition="200601120260302B">B03C1/02</further-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李育青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YU-CING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹育智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, YU-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳連芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LIEN-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供方法。該方法包括：使液體化學品流過主體中定義的開口，液體化學品具有分散其中的磁性顆粒；形成經清潔的液體化學品，包括藉由安裝到主體的磁性裝置在開口中形成磁場；使經清潔的液體化學品流向半導體處理工具；以及藉由半導體處理工具使用經清潔的液體化學品在半導體晶圓上執行半導體製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method is provided. The method includes: flowing a liquid chemical through an opening defined in a body, the liquid chemical having magnetic particles dispersed therein; forming cleaned liquid chemical, including forming a magnetic field in the opening by a magnetic device mounted to the body; flowing the cleaned liquid chemical to a semiconductor processing tool; and performing a semiconductor process on a semiconductor wafer by the semiconductor processing tool by the cleaned liquid chemical.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:傳輸線路</p>  
        <p type="p">210:入口</p>  
        <p type="p">212:第一線路</p>  
        <p type="p">214:第二線路</p>  
        <p type="p">216:出口</p>  
        <p type="p">220:第一傳輸線區段</p>  
        <p type="p">222:第四傳輸線區段</p>  
        <p type="p">224:磁性裝置</p>  
        <p type="p">230:第二傳輸線區段</p>  
        <p type="p">232:第五傳輸線區段</p>  
        <p type="p">240,242,280,282,2522,2622:排洩口</p>  
        <p type="p">250,252,260,262:過濾器組件</p>  
        <p type="p">270:第三傳輸線區段</p>  
        <p type="p">272:第六傳輸線區段</p>  
        <p type="p">290:選擇器</p>  
        <p type="p">2520:外殼</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="917" publication-number="202627915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物品資訊提供方法及用於其之電子裝置</chinese-title>  
        <english-title>METHOD FOR PROVIDING ITEM INFORMATION AND ELECTRONIC APPARATUS THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250801B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/06</further-classification>  
        <further-classification edition="201301120250801B">G06F3/048</further-classification>  
        <further-classification edition="200601120250801B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種物品資訊提供方法及用於其之電子裝置。本發明之藉由電子裝置而實行之物品資訊提供方法可包括如下步驟：自用戶終端接收查閱第1頁面之請求，該第1頁面係提供第1物品之資訊者；對應於查閱請求，選擇與第1頁面對應之第1頁面模板，第1頁面模板包括如下資訊，即，基於查閱請求所包括之資訊中之至少一部分，將要素之顯示位置及屬性值映射至構成第1頁面之複數個要素各者；及控制用戶終端基於選擇之第1頁面模板顯示第1頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="918" publication-number="202628699"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628699.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有電容器的積體電路裝置及其製作方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE HAVING CAPACITOR AND METHOD OF MAKING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250610B">H10F39/12</main-classification>  
        <further-classification edition="202501120250610B">H10F39/18</further-classification>  
        <further-classification edition="202501120250610B">H10D1/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傑恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEH-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁世汎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, SHYH-FANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例涉及三維（3D）金屬-絕緣體-金屬（MIM）電容器，其具有導電連接到第一導電板的第一組導電棒、導電連接到第二導電板的第一組相應的導電套筒、以及包覆第一組相應導電套筒的導電周界和填充物。導電周界和填充物導電連接到第一導電板。第一導電板與第二導電板電氣隔離。對於第一組導電棒的每個導電棒和第一組相應導電套筒的相應導電套筒，導電棒被相應導電套筒側向包覆，且導電棒通過介電阻障與相應導電套筒電氣隔離。第一組導電套筒通過介電阻障與導電周界和填充物電氣隔離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to a three-dimensional (3D) metal-insulator-metal (MIM) capacitor having a first set of conductive rods conductively connected to a first conductive plate, a first set of corresponding conductive sleeves conductively connected to a second conductive plate, and a conductive perimeter and filler enveloping the first set of corresponding conductive sleeves. The conductive perimeter and filler are conductively connected to the first conductive plate. The first conductive plate is electrically isolated from the second conductive plate. For each conductive rod of the first set of conductive rods and corresponding conductive sleeve of the first set of corresponding conductive sleeves, the conductive rod is laterally enveloped by the corresponding conductive sleeve, and the conductive rod is electrically isolated from the corresponding conductive sleeve by a dielectric barrier. The first set of conductive sleeves is electrically isolated from the conductive perimeter and filler by the dielectric barrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、120:段部</p>  
        <p type="p">101:電容器</p>  
        <p type="p">102:層間介電層(ILD)/ILD層</p>  
        <p type="p">103:蝕刻停止層</p>  
        <p type="p">104:阻障層</p>  
        <p type="p">105、106:金屬互連件/金屬特徵</p>  
        <p type="p">107、141:導電板/金屬特徵</p>  
        <p type="p">108:頂部電極</p>  
        <p type="p">109:底部電極</p>  
        <p type="p">110:氧化物層</p>  
        <p type="p">111:導電互連件</p>  
        <p type="p">112、116、118:通孔部分</p>  
        <p type="p">113、115、117:溝渠部分</p>  
        <p type="p">114:互連件</p>  
        <p type="p">119:通孔/金屬特徵</p>  
        <p type="p">121:第一層/層</p>  
        <p type="p">122:第二層/層</p>  
        <p type="p">123:導電阻障/導電阻障層</p>  
        <p type="p">124:介電阻障</p>  
        <p type="p">133:氮化物層</p>  
        <p type="p">142:導電棒/棒</p>  
        <p type="p">143:周界</p>  
        <p type="p">144:間隙導電填充物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="919" publication-number="202629003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構之形成方法以及裝置結構</chinese-title>  
        <english-title>METHOD OF FORMING SEMICONDUCTOR STRUCTURE AND DEVICE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10W70/05</main-classification>  
        <further-classification edition="202601120260327B">H10P34/42</further-classification>  
        <further-classification edition="202601120260327B">H10P30/28</further-classification>  
        <further-classification edition="202601120260327B">H10W10/10</further-classification>  
        <further-classification edition="202601120260327B">H10W70/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳承先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN-SHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳旭賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧胤龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊曜群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JYUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之一些實施例提供一種半導體結構。半導體結構可藉由以下操作提供，包括：在一基板之一上方部分中形成一半導體裝置；在基板之上方部分中形成複數個基板通孔結構；藉由自一背側移除基板之複數個材料部分而薄化基板，從而暴露出基板通孔結構之複數個背側端的表面；將至少一種非電摻雜元素的離子植入至基板之一背側部分而形成至少一層背側隔離層；在基板通孔結構之背側端的表面上形成複數個背側凸塊結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure may be provided by: forming a semiconductor device in an upper portion of a substrate; forming through-substrate via structures in the upper portion of the substrate; thinning the substrate by removing material portions of the substrate from a backside, whereby backside end surfaces of the through-substrate via structures are exposed; forming at least one backside isolation layer by implanting ions of at least one non-electrical dopant element into a backside portion of the substrate; and forming backside bump structures on the backside end surfaces of the through-substrate via structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1910:步驟</p>  
        <p type="p">1920:步驟</p>  
        <p type="p">1930:步驟</p>  
        <p type="p">1940:步驟</p>  
        <p type="p">1950:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="920" publication-number="202628563"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628563.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱彥和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YEN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置的製造方法，包括：形成一基底層和位於基底層上方的一墊層；在基底層和墊層中形成一隔離層，其中隔離層將基底層和墊層分隔成一第一基底層和位於第一基底層上方的一第一墊層，以及一第二基底層和位於第二基底層上方的一第二墊層； 移除第二墊層；降低第二基底層的一頂表面；以及在第二基底層上形成一半導體層，其中半導體層的一頂表面與第一基底層的一頂表面基本上齊平。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of fabricating a semiconductor device includes forming a substrate layer and a pad layer over the substrate layer; forming an isolation layer in the substrate layer and the pad layer, in which the isolation layer separates the substrate layer and the pad layer into a first substrate layer and a first pad layer over the first substrate layer, and a second substrate layer and a second pad layer over the second substrate layer; removing the second pad layer; lowering a top surface of the second substrate layer; and forming a semiconductor layer on the second substrate layer, in which a top surface of the semiconductor layer is substantially level with a top surface of the first substrate layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基底層</p>  
        <p type="p">100A:第一基底層</p>  
        <p type="p">100B:第二基底層</p>  
        <p type="p">400:隔離層</p>  
        <p type="p">400A:第一部分</p>  
        <p type="p">400B:第二部分</p>  
        <p type="p">500A:第一區域</p>  
        <p type="p">500B:第二區域</p>  
        <p type="p">700:半導體層</p>  
        <p type="p">800A:閘極結構</p>  
        <p type="p">800B:閘極結構</p>  
        <p type="p">801:閘極介電層</p>  
        <p type="p">802:高k介電層</p>  
        <p type="p">803:第一導電層</p>  
        <p type="p">804:第二導電層</p>  
        <p type="p">805:第三導電層</p>  
        <p type="p">806:介電覆蓋層</p>  
        <p type="p">900:閘極間隔物</p>  
        <p type="p">901:第一閘極間隔層</p>  
        <p type="p">902:第二閘極間隔層</p>  
        <p type="p">903:第三閘極間隔層</p>  
        <p type="p">1000A:源極/汲極區</p>  
        <p type="p">1000B:源極/汲極區</p>  
        <p type="p">TR1:第一半導體裝置</p>  
        <p type="p">TR2:第二半導體裝置</p>  
        <p type="p">1100:層間介電層(ILD層)</p>  
        <p type="p">1200A:第一源極/汲極電極</p>  
        <p type="p">1200B:第二源極/汲極電極</p>  
        <p type="p">S1200:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="921" publication-number="202626228"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626228.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有含三個切削齒的切削部的螺紋車削嵌件及切削刀具</chinese-title>  
        <english-title>THREAD TURNING CUTTING INSERT HAVING A CUTTING PORTION WITH THREE CUTTING TEETH AND CUTTING TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B23B27/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商艾斯卡公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISCAR LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐倫　維塔利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OREN, VITALY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索爾金　尤瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SORKIN, YURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科倫　弗拉基米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOREN, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於螺紋切削之切削刀具具有一螺紋車削嵌件，該螺紋車削嵌件藉由一緊固部件可釋放地保持在一嵌件凹穴中。該螺紋車削嵌件具有一螺紋切削部，該螺紋切削部具有三個間隔開之切削齒及凹入一嵌件上表面中之一切屑形成溝槽。該切屑形成溝槽包括靠近該等切削齒之一近齒腹溝槽表面及更遠離該等切削齒之遠齒腹溝槽表面。該螺紋切削部包含形成在該嵌件上表面及一嵌件周邊表面之相交部處之三個切削刃。各切削刃定位於一各自切削齒上。該螺紋切削部包含定位於該嵌件上表面上之三個平坦刃帶表面。各刃帶表面從一各自切削刃之一整個長度延伸至該近齒腹溝槽表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cutting tool for thread cutting has a thread turning cutting insert releasably retained in an insert pocket by a fastening member. The thread turning cutting insert has a thread cutting portion having three spaced apart cutting teeth. and a chip forming groove recessed in an insert upper surface. The chip forming groove includes a near-flank groove surface close to the cutting teeth and far-flank grove surface further away from the cutting teeth. The thread cutting portion includes three cutting edges formed at the intersection of the insert upper surface and an insert peripheral surface. Each cutting edge is located on a respective cutting tooth. The thread cutting portion includes three planar land surfaces located on the insert upper surface. Each land surface extends from an entire length of a respective cutting edge to the near-flank groove surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:切削刀具</p>  
        <p type="p">22:螺紋車削嵌件</p>  
        <p type="p">24:嵌件座</p>  
        <p type="p">26:嵌件凹穴</p>  
        <p type="p">82:座前端</p>  
        <p type="p">84:座前端表面</p>  
        <p type="p">86:座周邊表面</p>  
        <p type="p">88:座頂部表面</p>  
        <p type="p">89:座底部表面</p>  
        <p type="p">90:座側表面</p>  
        <p type="p">92:座凹穴凹槽表面</p>  
        <p type="p">94:座凹穴開口表面</p>  
        <p type="p">96:凹穴開口</p>  
        <p type="p">100:凹穴周邊表面</p>  
        <p type="p">102:墊片</p>  
        <p type="p">104:螺紋孔</p>  
        <p type="p">112:緊固部件</p>  
        <p type="p">B:座縱向軸線</p>  
        <p type="p">C:嵌件中心軸線</p>  
        <p type="p">D&lt;sub&gt;F&lt;/sub&gt;:向前方向</p>  
        <p type="p">D&lt;sub&gt;R&lt;/sub&gt;:向後方向</p>  
        <p type="p">E:凹穴中心軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="922" publication-number="202626481"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626481.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105548</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250611B">B81B7/02</main-classification>  
        <further-classification edition="200601120250611B">B81C1/00</further-classification>  
        <further-classification edition="202301120250611B">H10N30/063</further-classification>  
        <further-classification edition="202301120250611B">H10N30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱昭宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHAO-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張儀賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃士芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括位於基底相對側上的佈線層和壓電結構。佈線層和壓電結構的電極透過互連結構連接，此互連結構在基底的相對側之間延伸穿過基底。與在基底的同一側形成佈線層和壓電結構相比，佈線層和壓電結構的佈置使得半導體裝置在製造期間無需平坦化或只需較少的平坦化即可製造。因此，半導體裝置的金屬類的佈線層（例如，銅類的和/或鋁類的佈線層）可以被製造為具有鈍化層覆蓋，而不會導致壓電結構中不希望的電流洩漏、電荷缺陷和/或開關電荷的變化，與佈線層和壓電結構在同一側形成相比，可以提高壓電結構的可靠性和性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes routing layers and piezoelectric structures on opposite sides of a substrate. The routing layers and electrodes of the piezoelectric structures are connected by interconnect structures which extend through the substrate between the opposite the sides of the substrate. The arrangement of the routing layers and piezoelectric structures enables the semiconductor devices to be manufactured without planarization or with less planarization during fabrication than if the routing layers and piezoelectric structures were formed on the same side of the substrate. Consequently, metal-based routing layers of the semiconductor device (e.g., copper-based and/or aluminum-based routing layers) may be fabricated with passivation layer coverage without causing unwanted current leakage, charge defects, and/or changes in switching charge in the piezoelectric structures, enabling increased reliability and performance of the piezoelectric structures to be achieved relative to if the routing layers and piezoelectric structures were formed on the same side of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102:第一半導體層</p>  
        <p type="p">104:絕緣體層</p>  
        <p type="p">106:第二半導體層</p>  
        <p type="p">108:基部絕緣體層</p>  
        <p type="p">110:絕緣體黏著層</p>  
        <p type="p">112:第一電極</p>  
        <p type="p">114:第二電極</p>  
        <p type="p">116:壓電層</p>  
        <p type="p">118:第一黏著層</p>  
        <p type="p">120、136:鈍化層</p>  
        <p type="p">122:第二黏著層</p>  
        <p type="p">124:底部絕緣體層</p>  
        <p type="p">126:襯絕緣體層</p>  
        <p type="p">128:阻障層</p>  
        <p type="p">130、130a、130b:互連填充層</p>  
        <p type="p">132:導電黏著層</p>  
        <p type="p">134、134a、134b:導電佈線層</p>  
        <p type="p">138:開口</p>  
        <p type="p">140:第一孔穴</p>  
        <p type="p">142:第二孔穴</p>  
        <p type="p">A:左側部分</p>  
        <p type="p">B:右側部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="923" publication-number="202627949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以提供頁面之電子裝置及其動作方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS FOR PROVIDING PAGE AND ITS OPERATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120251001B">G06Q30/06</further-classification>  
        <further-classification edition="201901120251001B">G06F16/958</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之於電子裝置中進行之頁面提供方法的特徵在於包括如下步驟：確認用戶之識別資訊及包括至少一個組件原型之組件原型清單；基於組件原型清單而產生頁面模板；基於用戶之識別資訊及頁面模板而產生頁面實例；及將基於頁面實例而產生之第1頁面提供至用戶終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="924" publication-number="202628592"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628592.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">H10B43/35</main-classification>  
        <further-classification edition="202301120260323B">H10B43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉守</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田光彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, MITSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泉田貴士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUMIDA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中塚圭祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATSUKA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂野純哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKANO, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嶌根猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANE, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芳賀太史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGA, TAISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體裝置中，第1絕緣體位於較第1基板更朝第1方向。第1導電體位於第1絕緣體中。第2基板位於較第1絕緣體更朝第1方向。第1井區域具有第1導電型，設置於第2基板中，且具有第1雜質濃度。第1雜質區域具有第1導電型，於第2基板中在較第1井區域更朝第2方向上與第1井區域相接，且具有第1雜質濃度之4倍以上且1×10&lt;sup&gt;8&lt;/sup&gt;倍以下之第2雜質濃度。第2井區域具有第2導電型，於第2基板中在較第1雜質區域更朝第2方向上與第1雜質區域相接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">25,26,SP:絕緣體</p>  
        <p type="p">CS2,CS5,C5,C7:觸點</p>  
        <p type="p">DA:雜質區域</p>  
        <p type="p">GC:閘極電極</p>  
        <p type="p">GO:閘極絕緣體</p>  
        <p type="p">L3:導電體</p>  
        <p type="p">nw:n井區域</p>  
        <p type="p">pw:p井區域</p>  
        <p type="p">SD_n,SD_p:源極/汲極區域</p>  
        <p type="p">STI:構造</p>  
        <p type="p">SW:側壁絕緣體</p>  
        <p type="p">Tr2_p:p型電晶體</p>  
        <p type="p">Tr2_n:n型電晶體</p>  
        <p type="p">TS:通孔</p>  
        <p type="p">W2:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="925" publication-number="202628695"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628695.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路、單光子雪崩二極體及積體電路的形成方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT, SINGLE PHOTON AVALANCHE DIODE AND METHOD FOR FORMING INTEGRATED CIRCUIT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10F30/225</main-classification>  
        <further-classification edition="202501120250801B">H10F77/00</further-classification>  
        <further-classification edition="202501120250801B">H10F77/14</further-classification>  
        <further-classification edition="202501120250801B">H10F77/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖英凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YIN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉人誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林杏芝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱怡欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YI-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳祥麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江欣益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, SIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃陳嵩文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG CHEN, SUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林榮義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JUNG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例涉及包括雪崩光電二極體（APD）元件陣列的影像感測器積體電路（IC）。陣列中的第一APD元件包括具有鍺半導體的吸收區和包括矽半導體二極體的倍增區。吸收區配置為響應入射光子產生電荷載子。倍增區配置為響應產生的電荷載子漂移進入倍增區而產生電荷載子的雪崩電流。第一APD元件還包括：用於收集雪崩電流電荷載子的第一型摻雜區、包圍吸收區的網格結構以及具有與第一型摻雜區接觸的深接觸部分和連接到網格結構的相應部分的網格部分的對接接觸件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to an image-sensor integrated circuit (IC) that includes an array of avalanche photodiode (APD) elements. A first APD element of the array of APD elements includes an absorption region having a germanium semiconductor and a multiplication region including a diode of a silicon semiconductor. The absorption region is configured to generate a charge carrier in response to an incident photon. The multiplication region is configured to generate an avalanche current of charge carriers in response to the generated charge carrier drifting into the multiplication region. The first APD element further includes: a first-type-doped region for collecting charge carriers of the avalanche current, a mesh structure enclosing the absorption region, and a butted contact having a deep contact section in contact with the first-type-doped region and a mesh section connected to a corresponding portion of the mesh structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:網格結構</p>  
        <p type="p">400:剖面圖</p>  
        <p type="p">401:光子</p>  
        <p type="p">501:矽層</p>  
        <p type="p">502:P型隔離層</p>  
        <p type="p">601:N型區</p>  
        <p type="p">701:深N型井結構</p>  
        <p type="p">801:側壁部分</p>  
        <p type="p">901、1102:P型區</p>  
        <p type="p">1101:N型通道</p>  
        <p type="p">1201:重摻雜N型區</p>  
        <p type="p">1301:重摻雜P型區</p>  
        <p type="p">1601:吸收區</p>  
        <p type="p">1602:蓋層部分</p>  
        <p type="p">1701:矽蓋</p>  
        <p type="p">1801:間隙壁氧化物層</p>  
        <p type="p">1901:間隙壁氮化物層</p>  
        <p type="p">2201:光阻保護氧化物層</p>  
        <p type="p">2301:氮化物層</p>  
        <p type="p">2401:介電層</p>  
        <p type="p">2521、2522:接觸件</p>  
        <p type="p">2601:BDTI結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="926" publication-number="202627554"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627554.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置及確定其參數的方法</chinese-title>  
        <english-title>OPTICAL DEVICE AND METHOD FOR DETERMINING PARAMETERS OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250704B">G02B6/12</main-classification>  
        <further-classification edition="200601120250704B">G02B6/125</further-classification>  
        <further-classification edition="200601120250704B">G02B6/34</further-classification>  
        <further-classification edition="200601120250704B">G01J3/30</further-classification>  
        <further-classification edition="200601120250704B">G02F1/015</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江嘉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉勝凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHENG KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王紹達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHAO-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂聯威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, LIAN WEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施啟元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊沛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張澤恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TSE-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於確定包括第一波導和共振器的光學裝置的參數的方法。該方法包括將光信號從第一波導耦合到共振器。共振器包括第一P/N接面和環形波導，第一P/N接面被配置為調變共振器的共振頻率直到光信號在共振器中共振。該方法更包括從第一波導的直通埠檢測光信號的共振光譜，並根據光信號的共振光譜來確定光學裝置的參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for determining parameters of an optical device including a first waveguide and a resonator is provided. The method includes coupling a light signal from the first waveguide to the resonator. The resonator includes a first P/N junction and a ring waveguide, and the first P/N junction is configured to modulate a resonant frequency of the resonator until the light signal is resonant in the resonator. The method further includes detecting a resonant spectrum of the light signal from a through port of the first waveguide, and determining parameters of the optical device based on the resonant spectrum of the light signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製程流程</p>  
        <p type="p">S110、S120、S130、S140:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="927" publication-number="202628649"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628649.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路及製造其的方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D64/01</main-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202501120260302B">H10D30/01</further-classification>  
        <further-classification edition="202501120260302B">H10D64/27</further-classification>  
        <further-classification edition="202501120260302B">H10D84/83</further-classification>  
        <further-classification edition="202501120260302B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊富雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FU-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉思賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SZU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體結構和製造所述結構方法包括在半導體基底的裝置區中形成包含一個或多個鰭式場效電晶體（finFET）的鰭區以及形成鄰近鰭區的高壓（HV）平面區，每個裝置區的finFET包括一個或多個鰭片，所述鰭片形成為具有距離鰭狀基板區的第一高度處的鰭狀頂部。HV平面區包括第一HV平面區及第二HV平面區，所述第一HV平面區距離鰭狀基板區的大於第一高度的第二高度處，所述第二HV平面區具有將第一HV平面區與鰭區隔離的HV隔離結構，所述HV隔離結構包括具有距離鰭狀基板區的第三高度處的中間台階的邊界緩衝區，第三高度等於或大於第一高度且小於第二高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure and method of fabricating same structure includes forming, in a device region of a semiconductor substrate, a fin region including one or more fin field-effect transistors (finFETs), each device region finFET including one or more fins formed to have a fin top at a first height from a finFET base region adjacent to the finFET fin; and forming a high voltage (HV) planar region adjacent to the fin region. The HV planar region including a first HV planar region at a second height from the finFET base region, the second height greater than the first height, and the HV planar region including a second HV planar region having a HV isolation structure isolating the first HV planar region from the fin region, the HV isolation structure including a boundary buffer area having an intermediate step at a third height from the finFET base region that is equal to or greater than the first height and less than the second height.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">113、212B、213C、214C:井</p>  
        <p type="p">115:STI材料/區</p>  
        <p type="p">116、116A1、116A2、116B1、116B2:鰭片</p>  
        <p type="p">117A:多晶矽閘極</p>  
        <p type="p">118:鰭狀基板區</p>  
        <p type="p">119:鰭狀頂部</p>  
        <p type="p">215I、215J、215K:STI</p>  
        <p type="p">231:頂表面</p>  
        <p type="p">H1、H2、H3、H4、H5、H6:高度</p>  
        <p type="p">L1:長度</p>  
        <p type="p">S1:斜率</p>  
        <p type="p">x、y、z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="928" publication-number="202628890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動化物料搬運系統及自動化物料搬運方法</chinese-title>  
        <english-title>AUTOMATED MATERIAL HANDLING SYSTEM AND AUTOMATED MATERIAL HANDLING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/30</main-classification>  
        <further-classification edition="200601120260302B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠羣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUANCYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝鎮暘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHEN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張慶榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種自動化物料搬運系統。自動化物料搬運系統包括儲料設備，其包括多個擱架單元。自動化物料搬運系統包括上覆於一個或多個擱架單元的氣流整流結構。自動化物料搬運系統包括一個或多個擱架單元下方的真空單元，其中氣流整流結構被配置為沿一個或多個流動路徑引導空氣到真空單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automated material handling system is provided. The automated material handling system includes a stocking apparatus including a plurality of shelving units. The automated material handling system includes an airflow rectification structure overlying one or more of the plurality of shelving units. The automated material handling system includes a vacuum unit under one or more of the plurality of shelving units, wherein the airflow rectification structure is configured to conduct air along one or more flow paths to the vacuum unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:物料搬運系統</p>  
        <p type="p">102:儲料載具</p>  
        <p type="p">104:儲料設備</p>  
        <p type="p">106:控制器</p>  
        <p type="p">108、109:方向</p>  
        <p type="p">110:軌道</p>  
        <p type="p">114、115:牆</p>  
        <p type="p">116a:第一流動路徑</p>  
        <p type="p">116b:第二流動路徑</p>  
        <p type="p">116c:第三流動路徑</p>  
        <p type="p">116d:第四流動路徑</p>  
        <p type="p">116e:第五流動路徑</p>  
        <p type="p">116f:第六流動路徑</p>  
        <p type="p">118:真空單元</p>  
        <p type="p">118a:第一真空單元</p>  
        <p type="p">118b:第二真空單元</p>  
        <p type="p">118c:第三真空單元</p>  
        <p type="p">118d:第四真空單元</p>  
        <p type="p">118e:第五真空單元</p>  
        <p type="p">118f:第六真空單元</p>  
        <p type="p">119a、119b、119c、119d、119e、119f:入口</p>  
        <p type="p">120:氣流整流結構</p>  
        <p type="p">130a、130b、130c:行</p>  
        <p type="p">132:腔室</p>  
        <p type="p">134a、134b:擱架單元</p>  
        <p type="p">134c:第三擱架單元</p>  
        <p type="p">134d:第四擱架單元</p>  
        <p type="p">138a:第一空氣顆粒感測器</p>  
        <p type="p">138b:第二空氣顆粒感測器</p>  
        <p type="p">138c:第三空氣顆粒感測器</p>  
        <p type="p">138f:第六空氣顆粒感測器</p>  
        <p type="p">138g:第七空氣顆粒感測器</p>  
        <p type="p">140a、140b、140c、140d、140e、140f:列</p>  
        <p type="p">150:儲料環境</p>  
        <p type="p">162a、162b:產品單元</p>  
        <p type="p">180:風扇單元</p>  
        <p type="p">180a:第一風扇單元</p>  
        <p type="p">180b:第二風扇單元</p>  
        <p type="p">180c:第三風扇單元</p>  
        <p type="p">202a:第一空氣傳導板</p>  
        <p type="p">202b:第二空氣傳導板</p>  
        <p type="p">202c:第三空氣傳導板</p>  
        <p type="p">202d:第四空氣傳導板</p>  
        <p type="p">202e:第五空氣傳導板</p>  
        <p type="p">202f:第六空氣傳導板</p>  
        <p type="p">202g:第七空氣傳導板</p>  
        <p type="p">302:擋風件</p>  
        <p type="p">302a:第一擋風件</p>  
        <p type="p">302b:第二擋風件</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">T1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="929" publication-number="202627865"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627865.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>評估積體電路（ＩＣ）電阻的方法和系統及設計ＩＣ的方法</chinese-title>  
        <english-title>METHOD AND SYSTEM OF EVALUATING RESISTANCE OF INTEGRATED CIRCUIT (IC), AND METHOD OF DESIGNING IC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260401B">G06F30/33</main-classification>  
        <further-classification edition="202601120260401B">H10P74/00</further-classification>  
        <further-classification edition="200601120260401B">G01R27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許源佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUAN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種評估積體電路（IC）裝置設計中電阻的方法包括識別IC裝置設計中的導電結構；識別導電結構中一個或多個規則圖案；將一個或多個規則圖案從導電結構的一個或多個剩餘部分分割，一個或多個剩餘部分為一個或多個不規則圖案；對於一個或多個規則圖案和一個或多個不規則圖案：確定圖案的旋轉角度；以垂直於旋轉角度的方向將圖案切割成一個或多個多邊形；以及總和一個或多個多邊形中每一者的個別電阻以提供圖案的電阻；以及總和一個或多個規則圖案和一個或多個不規則圖案的電阻以提供導電結構的估計電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of evaluating resistance in an integrated circuit (IC) device design includes identifying a conductive structure in the IC device design; identifying one or more regular patterns in the conductive structure; partitioning the one or more regular patterns from one or more remaining portions of the conductive structure, the one or more remaining portions being one or more irregular patterns; for the one or more regular patterns and the one or more irregular patterns: determining a rotation angle of the pattern; slicing the pattern, in a direction perpendicular to the rotation angle, into one or more polygons; and summing individual resistances of each of the one or more polygons to provide a resistance of the pattern; and summing the resistances of the one or more regular patterns and the one or more irregular patterns to provide an estimated resistance of the conductive structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200A:方法</p>  
        <p type="p">210、220、230、240、242、244、246、250、260:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="930" publication-number="202628564"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628564.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊記憶體單元結構及其形成方法</chinese-title>  
        <english-title>STACKED MEMORY CELL STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B12/00</main-classification>  
        <further-classification edition="202601120260302B">H10D88/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴昇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, SHENG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, KEN-ICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野謙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體記憶體單元結構和製造相同結構方法包括一個或多個位元胞，包括堆疊讀取電晶體和寫入電晶體，每個位元胞更包括讀取位元線、讀取字元線、寫入位元線、寫入字元線，以及與其他位元胞結構隔離儲存節點。位元胞更包括讀取字元線到儲存節點電壓耦合結構，其鄰近位於讀取字元線和儲存節點附近，且電壓耦合被配置為翼狀閘極或包覆讀取字元線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory cell structure and method of fabricating same structure includes one or more bit cells including a stacked read transistor and write transistor, each bit cell further including read bit line(s), read word line(s), write bit line(s), write word line(s), and a storage node isolated from other bit cell structures. The bit cell(s) further include a read word line to storage node voltage coupler structure which is proximately located near the read word line and storage node, and the voltage coupler is configured as a winged gate or a wraparound read word line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">701、702:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="931" publication-number="202628669"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628669.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105945</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體電路、半導體電晶體以及形成半導體電晶體的方法</chinese-title>  
        <english-title>SEMICONDUCTOR CIRUIT, SEMICONDUCTOR TRANSISTOR, AND A METHOD FOR FABRICATING A SEMICONDUCTOR TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10D84/83</main-classification>  
        <further-classification edition="202601120260325B">H10D84/01</further-classification>  
        <further-classification edition="202501120260325B">H10D30/62</further-classification>  
        <further-classification edition="202301120260325B">H10B10/00</further-classification>  
        <further-classification edition="201101120260325B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳於貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-BEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一半導體電路，包括一第一電晶體和一第二電晶體。第一電晶體包括在一第一源極結構之上並與之耦接的一第一源極接點，在一第一汲極結構之上並與之耦接的一第一汲極接點，以及耦接在第一源極接點和第一汲極接點之間的一第一閘極結構。第二電晶體包括在一第二源極結構之上並與之耦接的一第二源極接點，在一第二汲極結構之上並與之耦接的一第二汲極接點，以及耦接在第二源極接點和第二汲極接點之間的一第二閘極結構。第一汲極接點耦接至一位元線並且在一側壁周圍有一第一空氣間隔物。第一源極接點或第二源極接點的一側壁周圍沒有空氣間隔物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor circuit for a SRAM cell includes a first transistor and a second transistor on a substrate. The first transistor includes a first source contact over and coupled to a first source structure, a first drain contact over and coupled to a first drain structure, and a first gate structure laterally coupled between the first source contact and the first drain contact. The second transistor includes a second source contact over and coupled to a second source structure, a second drain contact over and coupled to a second drain structure, and a second gate structure laterally coupled between the second source contact and the second drain contact. The first drain contact is coupled to a bit line and has an air spacer on a sidewall thereof. The first source contact or the second source contact has no air spacer on a sidewall thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:正電源電壓</p>  
        <p type="p">V&lt;sub&gt;ss&lt;/sub&gt;:負電源電壓</p>  
        <p type="p">450:空氣間隔物</p>  
        <p type="p">460:擴散阻障層</p>  
        <p type="p">500:電路</p>  
        <p type="p">WS,W1:寬度</p>  
        <p type="p">522,552:汲極接點</p>  
        <p type="p">532,542:源極接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="932" publication-number="202627875"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627875.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料處理系統及資料處理方法</chinese-title>  
        <english-title>DATA PROCESSING SYSTEM AND DATA PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250804B">G06F40/10</main-classification>  
        <further-classification edition="201901120250804B">G06F16/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商湖州鼎捷軟件有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鼎捷數智股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIGIWIN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鼎新數智股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DATA SYSTEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳兆麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHAO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫國鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, GUOXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種資料處理系統及其方法。資料處理系統包括儲存裝置以及處理器。處理器根據輸入資料生成完整請求資料。處理器將完整請求資料輸入至大型語言模型，以生成標準化的完整請求資料。處理器將標準化的完整請求資料輸入至自然語言理解模型，以生成意圖資料。處理器根據標準化的完整請求資料以及意圖資料進行任務邊界判斷，以生成應用程式介面任務資料、應用程式介面參數資料以及結果資料。處理器根據輸入資料、標準化的完整請求資料、應用程式介面任務資料、應用程式介面參數資料以及結果資料生成回覆任務結果資料。處理器通過使用者介面顯示回覆任務結果資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data processing system and a data processing method are provided. The data processing system includes a storage device and a processor. The processor generates complete request data based on input data. The processor inputs the complete request data into a large language model to generate standardized complete request data. The processor inputs the standardized complete request data into a natural language understanding model to generate intent data. The processor makes task boundary judgment based on the standardized complete request data and intent data to generate application program interface task data, application program interface parameter data and result data. The processor generates reply task result data according to the input data, the standardized complete request data, the application program interface task data, the application program interface parameter data and the result data. The processor displays the reply task result data through an user interface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S260:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="933" publication-number="202628554"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628554.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦主機殼用電源的風扇裝置及安裝方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H05K13/04</main-classification>  
        <further-classification edition="200601120250401B">H05K7/20</further-classification>  
        <further-classification edition="200601120250401B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞市宸精電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林振華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹開明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>餘前雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊延壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種電腦主機殼用電源的風扇裝置及安裝方案，其包括電源殼體和安裝在電源殼體內的電源本體和散熱風扇，電源殼體具有外側面，外側面上開設有供散熱風扇插入並容置的插槽，並且在插槽內設置有殼體定位結構和與電源主體電性連接的供電電極；所述的散熱風扇包括：風扇框體、樞接在風扇框體上的扇葉以及驅動單元，於風扇框體上設置有與殼體定位結構配合的風扇定位結構以及與供電電極對應的接觸電極；所述的散熱風扇自外向內插入插槽過程中，當風扇定位結構運行到殼體定位機構位置後，通過風扇定位結構與殼體定位機構的配合令散熱風扇定位安裝在插槽內，並且此狀態下供電電極與接觸電極實現電性接觸連接。本發明結構簡單，可實現快捷的更換維修電源風扇裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">1:電源殼體</p>  
        <p type="p">111:主機殼電源插頭</p>  
        <p type="p">112:主機殼電源開關</p>  
        <p type="p">113:散熱小孔</p>  
        <p type="p">3:散熱風扇</p>  
        <p type="p">6:主機殼</p>  
        <p type="p">10:插槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="934" publication-number="202627746"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627746.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可配置管道、附接方法、以及計算系統</chinese-title>  
        <english-title>CONFIGURABLE DUCT, METHOD OF ATTACHING, AND COMPUTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F1/20</main-classification>  
        <further-classification edition="200601120250401B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢耀宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSORNG, YAW-TZORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉振嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, JEN-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游傅鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, FU-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可配置管道，用於一電腦機箱，可配置管道包括一固定部以及一可動部。固定部包括一第一基底壁、一第一側壁、以及一第二側壁。第一基底壁、第一側壁、以及第二側壁形成可配置管道的三側的一部分。第一基底壁配置以附接至電腦機箱。可動部包括一第二基底壁，可動部可旋轉地附接至固定部。可動部可在一第一配置與一第二配置之間旋轉。在第一配置中，第二基底壁大致平行於第一基底壁並擋住對電腦機箱的一部分的進接。在第二配置中，可動部旋轉並遠離電腦機箱的部分，使電腦機箱的部分顯露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A configurable duct for a computer chassis includes a fixed part and a movable part. The fixed part includes a first base wall, a first side wall, and a second side wall. The first base wall, the first side wall, and the second side wall form a portion of three sides of the configurable duct. The first base wall is configured to attach to the computer chassis. The movable part includes a second base wall, and is rotatably attached to the fixed part. The movable part is rotatable between a first configuration and a second configuration. In the first configuration, the second base wall is generally parallel to the first base wall and blocks access to a portion of the computer chassis. In the second configuration, the movable part is rotated away from the portion of the computer chassis such that the portion of the computer chassis is exposed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:空氣管道/可配置管道</p>  
        <p type="p">110:固定部</p>  
        <p type="p">120:可動部</p>  
        <p type="p">122:旋轉鉸鏈</p>  
        <p type="p">124:支柱</p>  
        <p type="p">126:孔</p>  
        <p type="p">130:第一基底壁</p>  
        <p type="p">132:第一邊緣</p>  
        <p type="p">134:第二邊緣</p>  
        <p type="p">140:第一側壁</p>  
        <p type="p">150:第二側壁</p>  
        <p type="p">160:第二基底壁</p>  
        <p type="p">162:第三邊緣</p>  
        <p type="p">164:第四邊緣</p>  
        <p type="p">170:第三側壁</p>  
        <p type="p">175:凹坑孔</p>  
        <p type="p">177:凹坑鎖</p>  
        <p type="p">180:第四側壁</p>  
        <p type="p">190:端壁</p>  
        <p type="p">195:空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="935" publication-number="202627942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其資訊提供方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND PROVIDING INFORMATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯娜京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAE KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泰華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAE HOA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YOU JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置之資訊提供方法。資訊提供方法可包括如下步驟：確認購物車清單中包括之目標物品；確認目標物品之基準時點；基於目標物品之基準時點之價格及目標物品之當前價格，確認價格變化是否對應於設定之條件；及於價格變化對應於設定之條件之情形時，提供包括目標物品之價格變動指示資訊之購物車清單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p>  
        <p type="p">S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="936" publication-number="202628408"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628408.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>路由請求之方法、電子裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, ELECTRONIC APPARATUS AND RECORDING MEDIUM FOR ROUTING REQUEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250801B">H04L65/1045</main-classification>  
        <further-classification edition="202201120250801B">H04L67/025</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之電子裝置路由請求之方法包括如下步驟：自用戶之終端接收與應用程式相關聯之請求；基於請求所包括之資訊，確認一個以上之閘道器子模組中之與請求對應之第1子模組；及將請求路由至第1子模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:順序圖</p>  
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="937" publication-number="202627764"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627764.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主機、追蹤系統以及追蹤方法</chinese-title>  
        <english-title>HOST, TRACKING SYSTEM, AND TRACKING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F3/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TSUNG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶聖輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, SHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述主機、追蹤系統和追蹤方法。儲存電路被配置成儲存程式碼。處理器耦接到儲存電路並被配置成訪問程式碼，以執行：將真實世界的真實座標系統，與虛擬世界的虛擬座標系統對齊；通過物體感測器，取得真實世界中真實物體的偵測狀態；取得真實世界中的參考狀態；響應於對真實物體的觸摸動作，將偵測狀態與參考狀態進行比較；以及響應於偵測狀態與參考狀態之間的狀態差異大於閾值，校準虛擬物體的虛擬物體座標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A host, a tracking system, and a tracking method are described herein. A storage circuit is configured to store a program code. A processor is coupled to the storage circuit and configured to access the program code to execute: aligning a real coordinate system of a real world with a virtual coordinate system of a virtual world; obtaining a detecting status of a real object in the real world through an object sensor; obtaining a reference status in the real world; in response to a touch action to the real object, comparing the detecting status with the reference status; and in response to a status difference between the detecting status and the reference status being greater than a threshold value, calibrating a virtual object coordinate of a virtual object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:追蹤方法</p>  
        <p type="p">S510、S520、S530、S540、S550:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="938" publication-number="202627705"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627705.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106420</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理資訊以實行測試之裝置及其方法</chinese-title>  
        <english-title>APPARATUS FOR PROCESSING INFORMATION TO PERFORM TESTS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G05B15/02</main-classification>  
        <further-classification edition="200601120250801B">G01R1/00</further-classification>  
        <further-classification edition="202201120250801B">H04L61/5007</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種於電子裝置中處理資訊以實行測試之方法，其包括如下步驟：自終端接收用以測試應用程式之第1請求；基於第1請求而確認將實行測試之測試器單元；確認對測試器單元之測試實行進行管理之管理裝置；及基於第1請求而將用以實行測試之第2請求傳輸至管理裝置；且測試係藉由管理裝置之控制而於測試器單元中實行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:終端</p>  
        <p type="p">130:管理裝置</p>  
        <p type="p">140:測試器單元</p>  
        <p type="p">201:動作</p>  
        <p type="p">202:動作</p>  
        <p type="p">203:動作</p>  
        <p type="p">204:動作</p>  
        <p type="p">205:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="939" publication-number="202627950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>終端裝置及其物品清單管理方法</chinese-title>  
        <english-title>TERMINAL DEVICE AND METHOD OF MANAGING ITEM LIST THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/0601</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭奕庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YITING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之終端裝置之物品清單管理方法可包括如下步驟：顯示物品清單頁面，該物品清單頁面包括基於用戶之物品選擇輸入而選擇之至少一個物品；響應於接收到與用以排列上述至少一個物品之物品排列基準相關之用戶之排列輸入，產生基於上述至少一個物品及上述排列輸入之排列提示；將上述排列提示輸入至根據機器學習演算法而構建之物品排列模型；及基於自上述物品排列模型輸出之排列資料，更新上述物品清單頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">100:終端裝置</p>  
        <p type="p">200:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="940" publication-number="202627943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106424</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置之動作方法及支持其之電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本文所揭示之實施例，資訊提供方法可包括如下步驟：確認用戶對第1物品進行之行動；確認與上述第1物品相關之其他用戶之行動歷史資訊；及對應於用戶對上述第1物品進行之行動，提供基於上述行動歷史資訊之反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:伺服器設備</p>  
        <p type="p">200:用戶設備</p>  
        <p type="p">210:輸入/輸出部</p>  
        <p type="p">220:收發器</p>  
        <p type="p">230:儲存器</p>  
        <p type="p">240:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="941" publication-number="202628995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造半導體裝置結構的方法及沉積設備</chinese-title>  
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE STRUCTURE AND DEPOSITION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W42/20</main-classification>  
        <further-classification edition="202601120260302B">H10W29/00</further-classification>  
        <further-classification edition="202601120260302B">H10W74/10</further-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭禮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, LI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王卜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例的半導體裝置結構可以通過以下方式製造：將半導體封裝配置在封裝托盤上，其中所述封裝托盤包括托盤基座部分、托盤台面部分和支架形支撐部分，所述托盤基座部分在所述半導體封裝下方橫向延伸，所述托盤台面部分從所述托盤基座部分向上突出並包括連續的台面部分側壁組，所述支架形支撐部分包括連續的支撐部分外側壁組，在平面圖中，所述支撐部分外側壁相對於由所述半導體封裝的所有側壁所定義的封裝區域向內側橫向偏移；以及在所述半導體封裝的所有側壁組以及所述半導體封裝的頂表面上異向沉積電磁干擾（EMI）屏蔽膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device structure may be manufactured by: disposing a semiconductor package on a package tray, wherein the package tray includes a tray base portion which laterally extends underneath the semiconductor package, a tray mesa portion which protrudes upward from the tray base portion and including a contiguous set of mesa-portion sidewalls, and a frame-shaped support portion including a continuous set of support-portion outer sidewalls that is laterally offset inward from a package area that is defined by a set of all sidewalls of the semiconductor package in a plan view; and anisotropically depositing an electromagnetic interference (EMI) shielding film on the set of all sidewalls of the semiconductor package and on a top surface of the semiconductor package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1610、1620:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="942" publication-number="202626868"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626868.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氟化聚醯亞胺半互穿網狀結構隔膜及其製備方法和應用</chinese-title>  
        <english-title>FLUORINATED POLYIMIDE SEMI-INTERPENETRATING NETWORK STRUCTURE SEPARATOR AND PREPARATION METHOD AND APPLICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250922B">C08G73/10</main-classification>  
        <further-classification edition="200601120250922B">C08J5/22</further-classification>  
        <further-classification edition="200601120250922B">C08F8/20</further-classification>  
        <further-classification edition="200601120250922B">B32B27/34</further-classification>  
        <further-classification edition="201601120250922B">H01M8/1067</further-classification>  
        <further-classification edition="202101120250922B">H01M50/403</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商亞安頂材有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMIDEMASTER CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾吉永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHI YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱楗洺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, JIAN MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王秀慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHIU HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊杰凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於電池材料領域，具體涉及氟化聚醯亞胺半互穿網狀結構隔膜及其製備方法和應用。氟化聚醯亞胺半互穿網狀結構隔膜的製備方法包括以下步驟：將包括氟化聚醯亞胺纖維、網狀結構聚醯亞胺和第一溶劑的混合漿料製成氟化聚醯亞胺半互穿網狀結構隔膜；所述氟化聚醯亞胺纖維由第一二胺類單體、無氟二酐類單體和含氟二酐類單體反應製成；所述網狀結構聚醯亞胺由第二二胺類單體、二酐類單體和三聚氰胺在催化劑催化下反應製成。隔膜的半互穿網狀結構增強整體機械強度的同時不損失其對電解液的吸收效果，氟元素有效提高隔膜對電解液相容性的同時保持其他物性不降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention belongs to the field of battery materials and specifically relates to a fluorinated polyimide semi-interpenetrating network structure separator, and preparation method and application thereof. The preparation method of the fluorinated polyimide semi-interpenetrating network structure separator includes the following steps: preparing a fluorinated polyimide semi-interpenetrating network structure separator from a mixed slurry comprising fluorinated polyimide fibers, network-structured polyimide, and a first solvent. The fluorinated polyimide fibers are formed by the reaction of a first diamine monomer with a non-fluorinated dianhydride monomer and a fluorinated dianhydride monomer. The network-structured polyimide is synthesized by the reaction of a second diamine monomer, a dianhydride monomer, and melamine under catalytic conditions. The semi-interpenetrating network structure of the separator enhances the overall mechanical strength without compromising its electrolyte absorption capability. The introduction of fluorine effectively improves the electrolyte compatibility of the separator while maintaining its other physical properties.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="943" publication-number="202627483"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627483.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試設備及其使用方法</chinese-title>  
        <english-title>TESTING APPARATUS AND METHODS OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250804B">G01R1/04</main-classification>  
        <further-classification edition="202001120250804B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林源澧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, I-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭又銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於半導體結構的測試設備包括插座，所述插座包括凸緣部分、中央部分、第一導電連接件以及第二導電連接件。中央部分被凸緣部分包圍，其中中央部分包括分別穿透中央部分的第一開口和第二開口，且第一開口的尺寸小於第二開口的尺寸。第一導電連接件透過第一開口穿透中央部分。第二導電連接件透過第二開口穿透中央部分。第一導電連接件和第二導電連接件配置為發送電訊號，用於測試半導體結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A testing apparatus for a semiconductor structure includes a socket including a flange portion, a central portion, a first conductive connector, and a second conductive connector. The central portion is surrounded by the flange portion, where the central portion includes a first opening and a second opening respectively penetrating the central portion, and a size of the first opening is less than a size of the second opening. The first conductive connector penetrates through the central portion through the first opening. The second conductive connector penetrates through the central portion through the second opening. The first conductive connector and the second conductive connector are configured to transmit electric signals for testing the semiconductor structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:測試電路結構</p>  
        <p type="p">110:基底</p>  
        <p type="p">120:導電接點</p>  
        <p type="p">1000:測試設備</p>  
        <p type="p">1100:固持元件</p>  
        <p type="p">1200:電路板結構</p>  
        <p type="p">1222、1222a、1222b、1222c、1222d:介電層</p>  
        <p type="p">1224、1224a、1224b、1224c、1224d:金屬通孔</p>  
        <p type="p">1226、1226a、1226b、1226c、1226d:金屬跡線</p>  
        <p type="p">1300:插座</p>  
        <p type="p">1300a、OP1、OP2、OP3、OP4:開口</p>  
        <p type="p">1310:凸緣部分</p>  
        <p type="p">1320:中央部分</p>  
        <p type="p">1322:第一部分</p>  
        <p type="p">1324:第二部分</p>  
        <p type="p">1326:第三部分</p>  
        <p type="p">1330、1332、1334、13341、13342:導電連接件</p>  
        <p type="p">1332a、1332c、1334a、1334c:端部分</p>  
        <p type="p">1332b、1334b:主體部分</p>  
        <p type="p">13343:介面結構</p>  
        <p type="p">1400:蓋體</p>  
        <p type="p">200:控制器</p>  
        <p type="p">W3、W4:側向尺寸</p>  
        <p type="p">G1、G2:間隙</p>  
        <p type="p">R1:空間</p>  
        <p type="p">R2、R3:開口空孔</p>  
        <p type="p">S110、S1200:表面</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="944" publication-number="202627810"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627810.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106640</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其測試環境管理方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND TEST ENVIRONMENT MANAGEMENT METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251028B">G06F11/30</main-classification>  
        <further-classification edition="202501120251028B">G06F11/36</further-classification>  
        <further-classification edition="200601120251028B">G06F11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置之測試環境管理方法，其包括如下步驟：確認實行應用程式測試之至少一個測試單元、及管理上述至少一個測試單元之管理裝置；基於自上述管理裝置接收到之第1資訊而確認上述至少一個測試單元之第1狀態資訊；及將上述第1狀態資訊提供至終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="945" publication-number="202627843"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627843.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置之動作方法及支援該動作方法之電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251028B">G06F17/40</main-classification>  
        <further-classification edition="201301120251028B">G06F3/048</further-classification>  
        <further-classification edition="202301120251028B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本文中揭示之實施例，於電子裝置中提供資訊之方法可包括如下步驟：自終端獲得對第1頁面中包括之內容之請求資訊；基於上述請求資訊，確認與上述請求對應之內容之品質資訊；及向上述終端傳輸用以將基於上述品質資訊而確認之上述內容顯示於上述終端上之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="946" publication-number="202628698"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628698.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250515B">H10F30/28</main-classification>  
        <further-classification edition="202501120250515B">H10F39/18</further-classification>  
        <further-classification edition="202501120250515B">H10F71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余治寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪豐基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, FENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉人誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊敦年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAUNG, DUN-NIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">畫素感測器包括位於第一半導體晶粒上傳輸電晶體與第二半導體晶粒上源極隨耦器閘極之間的電晶體。電晶體的排列可降低源極隨耦器閘極的輸入電容，這導致在多個半導體晶粒影像感測器裝置的低光照條件下（例，高轉換增益模式）增加轉換增益。在耦合到傳輸電晶體的第一浮接擴散節點與耦合到源極隨耦器閘極的第二浮接擴散節點之間的電晶體，可在從源極隨耦器閘極讀出訊號期間關閉，阻擋電晶體與傳輸電晶體之間的信號路徑。這防止來自信號路徑的寄生電容延遲和/或減少從第二浮接擴散節點到源極隨耦器閘極的光電流放電。結果，實質上全部光電流可施加到源極隨耦器閘極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel sensor includes a transistor between a transfer transistor on a first semiconductor die and a source-follower gate on a second semiconductor die. The arrangement of the transistor may reduce input capacitance to the source-follower gate, which results in increased conversion gain in low-lighting conditions (e.g., high conversion gain mode) of a multiple semiconductor die image sensor device. A transistor between a first floating diffusion node coupled to the transfer transistor, and a second floating diffusion node coupled to the source-follower gate, may be turned off during signal readout from the source-follower gate, which blocks the signal path between the transistor and the transfer transistor. This prevents parasitic capacitance from the signal path from delaying and/or reducing the discharge of photocurrent from the second floating diffusion node onto the source-follower gate. As a result, substantially the full magnitude of the photocurrent can be applied to the source-follower gate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:畫素感測器</p>  
        <p type="p">102:感測區</p>  
        <p type="p">104:控制電路區域</p>  
        <p type="p">106:光電二極體</p>  
        <p type="p">108:傳輸閘</p>  
        <p type="p">110:浮接擴散節點</p>  
        <p type="p">112:重置電晶體</p>  
        <p type="p">114:供應電壓</p>  
        <p type="p">116:源極隨耦器閘極</p>  
        <p type="p">118:列選擇閘極</p>  
        <p type="p">120:影像處理電路</p>  
        <p type="p">122:中間電晶體</p>  
        <p type="p">124:浮接擴散節點</p>  
        <p type="p">126:轉換增益電晶體</p>  
        <p type="p">128:電容器</p>  
        <p type="p">130:轉換增益電路</p>  
        <p type="p">202、204、252:半導體晶粒</p>  
        <p type="p">Vref:參考電壓源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="947" publication-number="202627303"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627303.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有壓入配合式葉輪的微型軸向泵</chinese-title>  
        <english-title>MICRO-AXIAL PUMP WITH PRESS-FIT IMPELLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">F04D3/02</main-classification>  
        <further-classification edition="200601120260320B">F04D29/38</further-classification>  
        <further-classification edition="200601120260320B">F04D29/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商慧與發展有限責任合夥企業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷斯特　蘿拉　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LESTER, LAURA SOFIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡法　班傑明　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUFAHL, BENJAMIN JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倫斯曼　哈維　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNSMAN, HARVEY JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於傳送液態冷媒以冷卻一電子裝置之軸向泵包含一導管、該導管中之一葉輪、一軸桿、一轉子及一馬達定子。該導管界定由該導管之一入口至該導管之一出口的一流路。該轉子係設置在該葉輪之一中空內部且包含磁性部份、一前軸承殼體及一後軸承殼體。該前與後軸承殼體包含將該轉子旋轉地耦接至該軸桿之軸承。該馬達定子係組配成驅動該轉子環繞該軸桿旋轉，且該葉輪與該轉子一起環繞與該流路平行地延伸之一旋轉軸旋轉。該轉子係藉由將該前軸承殼體壓入配合附接在該葉輪上而耦接至該葉輪。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An axial pump for delivering liquid coolant to cool an electronic device comprises a conduit, an impeller in the conduit, a shaft, a rotor, and a motor stator. The conduit defines a flow path from an inlet of the conduit to an outlet of the conduit. The rotor is disposed in a hollow interior of the impeller and comprises magnetic portions, a front bearing housing, and a rear bearing housing. The front and rear bearing housing comprising bearings rotatably coupling the rotor to the shaft. The motor stator is configured to drive rotation of the rotor about the shaft, with the impeller rotating along with the rotor about an axis of rotation extending parallel to the flow path. The rotor is coupled to the impeller by a press-fit attachment of the front bearing housing to the impeller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:泵</p>  
        <p type="p">101:液體流路</p>  
        <p type="p">110:殼體</p>  
        <p type="p">120:馬達定子；定子</p>  
        <p type="p">120a:第一定子部份</p>  
        <p type="p">120b:第二定子部份</p>  
        <p type="p">125:控制電路</p>  
        <p type="p">130:導管</p>  
        <p type="p">131:泵入口部份；入口</p>  
        <p type="p">132:泵出口部份；出口</p>  
        <p type="p">133:葉輪腔室；葉輪腔室部份</p>  
        <p type="p">134:元件</p>  
        <p type="p">136:調整機構</p>  
        <p type="p">139:軸</p>  
        <p type="p">140:葉輪</p>  
        <p type="p">141:葉片</p>  
        <p type="p">142:轉子</p>  
        <p type="p">143:軸桿</p>  
        <p type="p">144:前支持件</p>  
        <p type="p">145:葉輪本體</p>  
        <p type="p">145a:壓入配合銜接部份</p>  
        <p type="p">146:磁性部份</p>  
        <p type="p">148:後軸承殼體</p>  
        <p type="p">149:前軸承殼體</p>  
        <p type="p">151:後支持件</p>  
        <p type="p">170:輥紋</p>  
        <p type="p">174:葉輪/轉子次總成</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="948" publication-number="202627765"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627765.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路元件及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G06F3/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱昭宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHAO-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林璟暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃富駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, FU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張儀賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YI-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭創仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃士芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIH-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉柏辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PO-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例涉及觸覺回饋積體電路（IC）元件，其包括基底結構和第一及第二壓電結構。基底結構包括從基底結構上側向下延伸的空腔。第一和第二壓電結構配置在基底結構內基底結構相對側側，並向彼此朝空腔側向延伸。各壓電結構包括第一電極、配置在第一電極上的壓電元件、以及配置在壓電元件上的第二電極。元件更包括配置在空腔中的流體，以及耦合到基底結構上側的薄膜，薄膜密封空腔並保留流體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to a haptic response integrated circuit (IC) device that includes a substrate structure and first and second piezoelectric structures. The substrate structure includes a cavity extending downward from an upper side of the substrate structure. The first and second piezoelectric structures are disposed within the substrate structure at opposing lateral sides of the substrate structure and extend laterally into the cavity toward each other. Each piezoelectric structure includes a first electrode, a piezoelectric element disposed on the first electrode, and a second electrode disposed on the piezoelectric element. The device further includes a fluid disposed in the cavity, and a membrane coupled to the upper side of the substrate structure, the membrane sealing the cavity and retaining the fluid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路元件</p>  
        <p type="p">302:壓電結構</p>  
        <p type="p">502:基底</p>  
        <p type="p">504:薄膜</p>  
        <p type="p">506:流體</p>  
        <p type="p">600:致動預接合結構</p>  
        <p type="p">602:基底</p>  
        <p type="p">603:黏合劑</p>  
        <p type="p">604:絕緣體結構</p>  
        <p type="p">606:障壁/黏著結構</p>  
        <p type="p">608:電極</p>  
        <p type="p">610:壓電元件</p>  
        <p type="p">612:電極</p>  
        <p type="p">614、616:導電墊片</p>  
        <p type="p">618:接合墊</p>  
        <p type="p">620:鈍化層</p>  
        <p type="p">622、624:凸塊墊片結構</p>  
        <p type="p">626:絕緣/黏著結構</p>  
        <p type="p">630:空腔</p>  
        <p type="p">632:溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="949" publication-number="202626375"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626375.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有具備關閉功能的可移動門的模板印刷機蓋</chinese-title>  
        <english-title>STENCIL PRINTER COVER HAVING MOVABLE DOOR WITH CLOSING FEATURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B41F15/08</main-classification>  
        <further-classification edition="200601120260323B">B41F15/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊利諾工具工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬妥羅　巴斯Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTERO, PATSY A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　肯尼士Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, KENNETH J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">模板印刷機的蓋鉸接安裝在框架上，且可在關閉位置與打開位置之間移動。該蓋包括：細長開口，形成在該蓋中；及可移動門，用以選擇性關閉該細長開口。該細長開口經定尺寸以使該模板及/或工具托盤能夠穿過。控制器用以控制該可移動門在關閉位置與打開位置之間移動。感測器組件靠近該細長開口。該感測器組件耦合至該控制器，且用以在將該可移動門移動至該關閉位置時偵測該細長開口內的物體。該感測器用以在偵測到該細長開口內的物體時向控制器產生訊號。在接收到來自該感測器的該訊號後，該控制器用以將該可移動門移動至該打開位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cover of a stencil printer is hingedly mounted to a frame, and movable between a closed and open positions. The cover includes an elongate opening formed therein and a movable door configured to selectively close the elongate opening. The elongate opening is sized to enable the stencil and/or a tooling tray to pass through. A controller is configured to control movement of the movable door between a closed position and an open position. A sensor assembly is proximate the elongate opening. The sensor assembly is coupled to the controller and configured to detect an object within the elongate opening when moving the movable door to the closed position. The sensor is configured to generate a signal to the controller when detecting an object within the elongate opening. The controller, upon receiving the signal from the sensor, is configured to move the movable door to the open position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">154:可移動門</p>  
        <p type="p">300:線性電阻壓力感測器</p>  
        <p type="p">310:泡沫層板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="950" publication-number="202627916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>終端及其物品資訊提供方法</chinese-title>  
        <english-title>TERMINAL AND METHOD OF PROVIDING ITEM INFORMATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250801B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250801B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯娜京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAE KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泰華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAE HOA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YOU JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白承珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, SEUNG JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之終端之物品資訊提供方法可包括如下步驟：顯示包括基於用戶之物品選擇輸入而選擇之至少一個物品之物品清單頁面；識別上述至少一個物品中符合指定之條件之物品集；及將包括與上述物品集相關之第1資訊及與上述指定之條件相關之第2資訊的橫幅顯示於上述物品清單頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">100:終端</p>  
        <p type="p">200:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="951" publication-number="202628306"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628306.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設備充電倉</chinese-title>  
        <english-title>CHARGING COMPARTMENT FOR ELECTRONIC EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H02J7/00</main-classification>  
        <further-classification edition="201601120260302B">H02J50/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江西立訊智造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGXI LUXSHARE INTELLIGENT MANUFACTURE CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃稱勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小珣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOXUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊修維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIUWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍小湧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, XIAOYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應惟志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, WEIZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種電子設備充電倉。其中電子設備充電倉的盒本體包括收納腔和設備腔，收納腔放置電子設備，盒本體內設置有選擇性延伸出設備腔的資料線；功能單元設置於設備腔，包括控制元件和與控制元件電連接的蓄電池，蓄電池供置於收納腔的電子設備充電，或對外部設備無線充電，資料線的一端與控制元件電連接，當資料線的另一端與外部設備電連接時，蓄電池對外部設備放電，和/或控制元件與外部設備傳輸資料；功能單元還包括操作按鈕，操作按鈕與控制元件通訊連接。本發明電子設備充電倉的功能更加多樣，應用場景多，且更加便攜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a charging compartment for electronic equipment. A box body of the charging compartment of the electronic equipment includes a receiving cavity and an equipment cavity. The electronic equipment is placed in the receiving cavity, and the box body is provided with a data line that selectively extends out of the equipment cavity. A functional unit is disposed in the equipment cavity and includes a control element and an accumulator battery electrically connected to the control element. The accumulator battery can be used to charge the electronic equipment placed in the receiving cavity or wirelessly charge external equipment. One end of the data line is electrically connected to the control element. When the other end of the data line is electrically connected to the external equipment, the accumulator battery discharges to the external equipment, and/or the control element and the external equipment transmit data to each other. The functional unit further includes an operation button, and the operation button is communicated with the control element. The charging compartment for the electronic equipment of the present invention has more diverse functions, more application scenarios, and is more portable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:盒本體</p>  
        <p type="p">110:盒蓋</p>  
        <p type="p">120:設備腔</p>  
        <p type="p">300:資料線</p>  
        <p type="p">412:操作按鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="952" publication-number="202627880"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627880.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單手操作型觸發裝置</chinese-title>  
        <english-title>ONE-HAND OPERATION TYPE TRIGGER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G06K7/01</main-classification>  
        <further-classification edition="200601120250418B">G06K7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宣德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPEED TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃英彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭建林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉軒如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSUAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種單手操作型觸發裝置，其包括開關組件、基座組件、按壓組件和限位加壓機構。基座組件的多個第一延伸件在第二方向上設於支撐件的相對兩側且沿第一方向靠近開關組件的第二接點部件延伸。按壓組件的抵接件抵接開關組件的第一接點部件，多個第二延伸件在第二方向上設於按壓本體的相對兩側且沿第一方向靠近第一接點部件延伸。限位加壓機構包括設於多個第一延伸件和多個第二延伸件的多個抵接凸件和多個抵接槽孔。施力於按壓本體一側，其相對一側的抵接凸件抵接抵接槽孔的孔壁，抵接件推動第一接點部件沿第一方向移動與第二接點部件接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A one-hand operation type trigger device is disclosed. The one-hand operation type trigger device includes a switch component, a base component, a pressing component and a limiting pressure mechanism. A plurality of first extension elements of the base component are disposed on two opposite sides of a support element in the second direction and extend close to a second contact part of the switch component along the first direction. An abutting element of the pressing component is abutted against a first contact part of the switch component. A plurality of second extension elements are disposed on two opposite sides of a pressing body in the second direction and extend close to the first contact part along the first direction. The limiting pressure mechanism includes a plurality of abutting protrusions and a plurality of abutting slots disposed on the plurality of first extension elements and the plurality of second extension elements. By applying force to one side of the pressing body, the abutting protrusions on the opposite side of the pressing body are abutted against the wall of the abutting slots. The first contact part is pushed through the abutting element to move along the first direction and contact the second contact part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:開關組件</p>  
        <p type="p">11:第一接點部件</p>  
        <p type="p">13:第一導線</p>  
        <p type="p">14:第二導線</p>  
        <p type="p">15:電路板</p>  
        <p type="p">20:基座組件</p>  
        <p type="p">21:支撐件</p>  
        <p type="p">212:支撐凸肋</p>  
        <p type="p">213:定位柱</p>  
        <p type="p">214:卡扣件</p>  
        <p type="p">215:線槽</p>  
        <p type="p">216:穿孔</p>  
        <p type="p">22:第一延伸件</p>  
        <p type="p">30:按壓組件</p>  
        <p type="p">31:按壓本體</p>  
        <p type="p">33:第二延伸件</p>  
        <p type="p">40:限位加壓機構</p>  
        <p type="p">41:抵接凸件</p>  
        <p type="p">42:抵接槽孔</p>  
        <p type="p">50:裝置容置組件</p>  
        <p type="p">51:容置件</p>  
        <p type="p">511:底壁</p>  
        <p type="p">511a:開槽</p>  
        <p type="p">512:外周壁</p>  
        <p type="p">514:卡合槽</p>  
        <p type="p">52:電連接件</p>  
        <p type="p">521:電連接件本體</p>  
        <p type="p">522:電連接結構</p>  
        <p type="p">53:卡合定位件</p>  
        <p type="p">531:第二卡合端部</p>  
        <p type="p">5311:導引斜面</p>  
        <p type="p">532:應力變形缺口</p>  
        <p type="p">533:結合槽</p>  
        <p type="p">54:導線定位件</p>  
        <p type="p">L1:第一方向</p>  
        <p type="p">L2:第二方向</p>  
        <p type="p">L3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="953" publication-number="202627892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人工智慧裝置及其神經處理器與操作方法</chinese-title>  
        <english-title>ARTIFICIAL INTELLIGENCE DEVICE AND ITS NEURAL NETWORK PROCESSING UNIT AND OPERATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250501B">G06N3/063</main-classification>  
        <further-classification edition="200601120250501B">G06T1/40</further-classification>  
        <further-classification edition="201801120250501B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭元博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUAN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種人工智慧裝置、神經處理器與操作方法。人工智慧裝置包括主機電路、記憶體以及神經處理器。神經處理器耦接至主機電路與記憶體。神經處理器向主機電路建立傳輸連接。人工智慧模型的模型權重集包括第一權重子集與第二權重子集。在神經處理器執行人工智慧模型前的初始化期間，主機電路將第一權重子集預載至記憶體。在神經處理器執行人工智慧模型的執行期間，神經處理器從記憶體接收第一權重子集以及從主機電路接收第二權重子集，以執行人工智慧模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an AI (Artificial Intelligence) device, a NPU (Neural network Processing Unit), and an operation method. The AI device includes a host circuit, a memory, and the NPU. The NPU is coupled to the host circuit and the memory. The NPU establishes a transmission connection to the host circuit. A model weight set of an AI model includes a first weight subset and a second weight subset. During an initialization period before the NPU executes the AI model, the host circuit preloads the first weight subset into the memory. During an execution period when the NPU executes the AI model, the NPU receives the first weight subset from the memory and the second weight subset from the host circuit for executing the AI model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410、S420:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="954" publication-number="202625959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625959.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙目視覺功能系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">A61B3/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼康依視路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKON-ESSILOR CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門馬司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONMA, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的雙目視覺功能系統用以進行雙眼單視的評價，包括：視線誘導部，將受驗者的頭部固定於第一方向，並且使所述受驗者的左眼及右眼的視線方向朝向與所述第一方向不同的第二方向；及處理部，在空間上分開地向所述視線方向被所述視線誘導部誘導至第二方向的受驗者的左眼及右眼提示圖像，所述圖像具有作為表示視覺特性的指標的特徵量，作為向所述左眼提示的所述圖像的所述左眼用圖像的所述特徵量不同於作為向所述右眼提示的所述圖像的所述右眼用圖像的所述特徵量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雙目視覺功能系統</p>  
        <p type="p">200:視線誘導部</p>  
        <p type="p">201:視線誘導裝置</p>  
        <p type="p">202:頭部固定部</p>  
        <p type="p">300:顯示裝置</p>  
        <p type="p">400:資訊處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="955" publication-number="202627944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供頁面之方法及用於該方法之電子裝置</chinese-title>  
        <english-title>METHOD FOR PROVIDING PAGE AND ELECTRONIC DEVICE THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250801B">G06Q10/08</further-classification>  
        <further-classification edition="201301120250801B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯娜京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAE KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南允貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, YOON JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YOU JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種於電子裝置中提供頁面之方法。具體而言，於電子裝置中提供頁面之方法可包括如下步驟：自用戶之終端接收與物品清單相關之頁面之請求；確認物品清單中包括之至少一個物品；確認第1子物品清單及第2子物品清單，該第1子物品清單包括至少一個物品中之添加於物品清單設定之期間以內之至少一個第1物品，該第2子物品清單包括至少一個物品中之添加於物品清單設定之期間以後之至少一個第2物品；及提供包括物品清單之區域之頁面，該物品清單之區域包括第1子物品清單之第1子區域與第2子物品清單之第2子區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="956" publication-number="202627789"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627789.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體控制器、快閃記憶體控制器的控制方法及其應用的電子裝置</chinese-title>  
        <english-title>FLASH MEMORY CONTROLLER, CONTROL METHOD OF FLASH MEMORY CONTROLLER, AND ELECTRONIC DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G06F3/06</main-classification>  
        <further-classification edition="200601120250401B">G06F12/02</further-classification>  
        <further-classification edition="200601120250401B">G11C16/26</further-classification>  
        <further-classification edition="200601120250401B">G11C11/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHI-XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種快閃記憶體控制器，其包括記憶體以及處理器。記憶體係儲存多個讀取電壓表格與索引暫存器。處理器係通過多個通道對快閃記憶體模組執行讀取操作。當使用多個讀取電壓表格其中之一對第一通道的讀取操作發生錯誤時，再選擇多個讀取電壓表格其中另一者通過第一通道執行讀取操作，並且當第一通道的讀取操作成功時，將多個讀取電壓表格其中另一者定義為目標讀取電壓表格，並於隨後使用目標讀取電壓表格通過第二通道執行讀取操作。此外，本發明還公開一種快閃記憶體控制器的控制方法及其應用的電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a flash memory controller, which is used to connect to a flash memory module through multiple channels. The flash memory controller includes a memory and a processor. The memory is used to store multiple read voltage tables and index registers. The processor is used to perform read operations on the flash memory module through multiple channels. When an error occurs in the read operation of the first channel using one of the multiple read voltage tables, another of the multiple read voltage tables is selected to perform the read operation through the first channel, and when the read operation of the first channel is successful, the other of the multiple read voltage tables is defined as the target read voltage table, and the target read voltage table is subsequently used to perform the read operation through the second channel. Additionally, the present invention also discloses a control method of the flash memory controller and an electronic device using the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:記憶裝置</p>  
        <p type="p">110:快閃記憶體模組</p>  
        <p type="p">120:快閃記憶體控制器</p>  
        <p type="p">121:處理器</p>  
        <p type="p">122:記憶體</p>  
        <p type="p">ID0~IDn:索引暫存器</p>  
        <p type="p">TA:映射表格</p>  
        <p type="p">TB0~TBk:讀取電壓表格</p>  
        <p type="p">123:記憶體介面</p>  
        <p type="p">124:主機介面</p>  
        <p type="p">130:主機端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="957" publication-number="202628647"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628647.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10D62/17</main-classification>  
        <further-classification edition="202501120250801B">H10D62/13</further-classification>  
        <further-classification edition="202501120250801B">H10D64/27</further-classification>  
        <further-classification edition="202501120250801B">H10D30/62</further-classification>  
        <further-classification edition="202501120250801B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朵爾伯斯　荷爾本</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOORNBOS, GERBEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達爾　馬可　范</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DAL, MARCUS JOHANNES HENRICUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬迪瓦拉　維拉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADHIWALA, VIRAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋理安尼堤斯　喬治奧斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELLIANITIS, GEORGIOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鰭基電晶體包括與鰭基電晶體源極/汲極區垂直排列的閘極結構。閘極結構可包覆鰭基電晶體鰭結構的頂部和側面，且鰭基電晶體的源極/汲極區位於鰭結構底部。鰭基電晶體的源極/汲極接觸件位於鰭結構底部上方的源極/汲極區上。這使得閘極結構和源極/汲極接觸件能夠位於鰭結構的垂直相對側，從而使鰭基電晶體能夠省略閘極間隔件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fin-based transistor includes a gate structure that is vertically-arranged with source/drain regions of the fin-based transistor. The gate structure may wrap around the top and sides of a fin structure of the fin-based transistor, and source/drain regions of the fin-based transistor are located on a bottom of the fin structure. Source/drain contacts of the fin-based transistor are located on the source/drain regions over the bottom of the fin structure. This enables the gate structure and the source/drain contacts to be located on vertically opposing sides of the fin structure, thereby enabling gate spacers to be omitted from the fin-based transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:半導體裝置</p>  
        <p type="p">302:鰭結構</p>  
        <p type="p">606:閘極結構</p>  
        <p type="p">700:示例實施例</p>  
        <p type="p">714、726:ILD層</p>  
        <p type="p">716:源極/汲極區</p>  
        <p type="p">718:源極/汲極接觸件</p>  
        <p type="p">720:源極/汲極互連</p>  
        <p type="p">722:閘極互連</p>  
        <p type="p">724:互連層</p>  
        <p type="p">728:導電結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="958" publication-number="202628612"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628612.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10D30/01</main-classification>  
        <further-classification edition="202601120260325B">H10P14/60</further-classification>  
        <further-classification edition="202501120260325B">H10D30/00</further-classification>  
        <further-classification edition="202501120260325B">H10D64/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高魁佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, KUEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, TING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓瓊玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, CHIUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露描述半導體裝置結構及其形成方法。該方法包括：在基板之上形成鰭結構，以及在鰭結構的一部分上沉積一個或多個間隔件。一個或多個間隔件被沉積在鰭結構的側壁上。該方法還包括：移除一個或多個間隔件的第一部分以露出鰭結構並使鰭結構凹陷。第一副產物層形成在一個或多個間隔件的第二部分上。該方法還包括：使第一副產物層鈍化，使第一副產物層軟化，移除第一副產物層的部分以露出凹陷的鰭結構，以及進一步使鰭結構凹陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device structure and methods of forming the same are described. The method includes forming a fin structure over a substrate and depositing one or more spacers on a portion of the fin structure. The one or more spacers are deposited on sidewalls of the fin structure. The method further includes removing a first portion of the one or more spacers to expose the fin structure and recessing the fin structure. A first byproduct layer is formed on a second portion of the one or more spacers. The method further includes passivating the first byproduct layer, softening the first byproduct layer, removing a portion of the first byproduct layer to expose the recessed fin structure, and further recessing the fin structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">101:基板</p>  
        <p type="p">104:半導體層堆疊</p>  
        <p type="p">106:第一半導體層</p>  
        <p type="p">108:第二半導體層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="959" publication-number="202628565"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628565.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260331B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄　河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOANG, HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾和展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸田将也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TODA, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土井拓馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOI, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江田拓己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠原佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAHARA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上遠野一広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATONO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地巧也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安齊廷玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANZAI, TADAMOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦川聖市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URAKAWA, SEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村嘉教</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大谷百華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTANI, MOMOKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電晶體特性優異之半導體裝置。&lt;br/&gt;實施形態之半導體裝置具備：第1電極；第2電極；第1電極與第2電極間之第1氧化物半導體層；第2氧化物半導體層，其於與連結第1電極與第2電極之第1方向垂直之第2方向，與第1氧化物半導體層隔開；閘極電極，其包圍第1氧化物半導體層及第2氧化物半導體層，於第2方向延伸；及閘極絕緣層。閘極電極包含第1部分與第2部分。第1部分於第2方向上與第1氧化物半導體層對向，與閘極絕緣層相接，具有第1方向之第1長度，第2部分於第2方向上自第1氧化物半導體層離開第1氧化物半導體層和第2氧化物半導體層間之距離之1/2之距離，具有第1方向之第2長度。第1長度長於第2長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:下部電極(第1電極)</p>  
        <p type="p">13:下部電極(第3電極)</p>  
        <p type="p">14:上部電極(第2電極)</p>  
        <p type="p">15:上部電極(第4電極)</p>  
        <p type="p">16:氧化物半導體層(第1氧化物半導體層)</p>  
        <p type="p">17:氧化物半導體層(第2氧化物半導體層)</p>  
        <p type="p">18:閘極電極</p>  
        <p type="p">18a:第1部分</p>  
        <p type="p">18b:第2部分</p>  
        <p type="p">20:閘極絕緣層</p>  
        <p type="p">22:層間絕緣層</p>  
        <p type="p">26:第2配線層</p>  
        <p type="p">100:電晶體(半導體裝置)</p>  
        <p type="p">100x:電晶體</p>  
        <p type="p">d:距離</p>  
        <p type="p">L1:第1長度</p>  
        <p type="p">L2:第2長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="960" publication-number="202627811"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627811.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107971</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>計算機系統及其資料轉存方法</chinese-title>  
        <english-title>COMPUTER SYSTEM AND ITS DATA MIGRATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250805B">G06F11/30</main-classification>  
        <further-classification edition="202501120250805B">G06F11/36</further-classification>  
        <further-classification edition="201601120250805B">G06F12/08</further-classification>  
        <further-classification edition="200601120250805B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張均林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種計算機系統，其由記憶體單元、多個處理單元及邏輯控制單元配合應用。記憶體單元具有多個用於儲存資料的記憶體區段。邏輯控制單元在發生異常時分配處理單元協同執行記憶體區段的資料轉存工作，並且包括分段模組、動態分配模組以及容錯模組。分段模組用於將記憶體區段依據優先級分別賦予權重值。動態分配模組用於依據權重值和轉存狀態分配處理單元執行記憶體區段的資料轉存工作。容錯模組用於記錄未完成資料轉存工作的記憶體區段，並分配其他處理單元執行未完成轉存的記憶體區段的轉存工作。本發明還公開一種資料轉存方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer system includes a memory unit, a plurality of processing units, and a logic control unit. The memory unit has a plurality of memory segments for storing data. The logic control unit has a segmentation module, a dynamic allocation module, and a fault-tolerant module and allocates the processing units to cooperate in performing a data migration task of the memory segments in case of an abnormality. The segmentation module is used to assign weight values to the memory segments based on their priority. The dynamic allocation module allocates the processing units to perform the data migration task of the memory segments according to the weight values and migration status. The fault-tolerant module records the memory segments where the data migration task is incomplete and allocates other processing units to perform the remaining data migration tasks for these memory segments. The invention also discloses a method for data migration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:計算機系統</p>  
        <p type="p">11:電子裝置</p>  
        <p type="p">12:主機端裝置</p>  
        <p type="p">111:第一處理單元</p>  
        <p type="p">112:第二處理單元</p>  
        <p type="p">113:記憶體單元</p>  
        <p type="p">1131~113k:記憶體區段</p>  
        <p type="p">114:邏輯控制單元</p>  
        <p type="p">1141:分段模組</p>  
        <p type="p">1142:動態分配模組</p>  
        <p type="p">1143:容錯模組</p>  
        <p type="p">115:主機介面單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="961" publication-number="202628952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107984</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板結構</chinese-title>  
        <english-title>SUBSTRATE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P95/00</main-classification>  
        <further-classification edition="202601120260401B">H10W76/136</further-classification>  
        <further-classification edition="202601120260401B">H10W74/40</further-classification>  
        <further-classification edition="202601120260401B">H10W72/00</further-classification>  
        <further-classification edition="200601120260401B">H05K3/02</further-classification>  
        <further-classification edition="201901120260401B">B32B7/022</further-classification>  
        <further-classification edition="201901120260401B">G02F1/1516</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣興電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾子章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, TZYY-JANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王金勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚瑞敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIN, RA-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬光華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, GUANG-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板結構，包括一無核心基底以及一第一增層結構層。無核心基底包括至少一第一介電層以及至少一第一導電圖案層。第一增層結構層配置於無核心基底上，且包括至少一第二介電層以及至少一第二導電圖案層。至少一第二介電層的熱膨脹係數小於至少一第一介電層的熱膨脹係數。至少一第二導電圖案層電性連接至少一第一導電圖案層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate structure includes a coreless substrate and a first build-up structure layer. The coreless substrate includes at least one first dielectric layer and at least one first conductive pattern layer. The first build-up structure layer is disposed on the coreless substrate and includes at least one second dielectric layer and at least one second conductive pattern layer. A coefficient of thermal expansion of the at least one second dielectric layer is less than a coefficient of thermal expansion of the at least one first dielectric layer. The at least one second conductive pattern layer is electrically connected to the at least one first conductive pattern layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:基板結構</p>  
        <p type="p">110:無核心基底</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">112:第一介電層</p>  
        <p type="p">113:第二表面</p>  
        <p type="p">114:第一導電圖案層</p>  
        <p type="p">116:導電孔</p>  
        <p type="p">120:第一增層結構層</p>  
        <p type="p">121:外表面</p>  
        <p type="p">122:第二介電層</p>  
        <p type="p">123:內表面</p>  
        <p type="p">124:第二導電圖案層</p>  
        <p type="p">126:導電孔</p>  
        <p type="p">130:接合層</p>  
        <p type="p">135:導電件</p>  
        <p type="p">T1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="962" publication-number="202627886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訓練圖像生成模型的電子設備和方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND METHOD FOR TRAINING AN IMAGE GENERATION MODEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">G06N3/045</main-classification>  
        <further-classification edition="202301120260302B">G06N3/088</further-classification>  
        <further-classification edition="202601120260302B">G06T11/00</further-classification>  
        <further-classification edition="201901120260302B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石明于</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, MING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泰惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TAI-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠㞶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉治能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-NENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳良其</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈子齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, TZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供訓練圖像生成模型和電子設備和方法，該方法包括以下步驟。通過將訓練圖像輸入第一教師模型和第二教師模型來獲得第一教師模型的多個第一層輸出和第二教師模型的多個第二層輸出。將訓練圖像輸入學生模型以獲得學生模型的多個第三層輸出。根據多個第一損失權重決定第一層輸出和第三層輸出之間的第一損失。決定第二層輸出和第三層輸出之間的第二損失。使用第一損失和第二損失更新學生模型以訓練學生模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a method for training an image generation model and an electronic apparatus, and the method includes the following steps. A plurality of first layer outputs of a first teacher model and a plurality of second layer outputs of a second teacher model are obtained by inputting a training image to the first teacher model and the second teacher model. The training image is input to a student model to obtain a plurality of third layer outputs of the student model. A first loss between the first layer outputs and the third layer outputs is determined according to a plurality of first loss weights. A second loss between the second layer outputs and the third layer outputs is determined. The student model is updated by using the first loss and the second loss to train the student model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="963" publication-number="202627945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627945.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供頁面之方法及用於該方法之電子裝置</chinese-title>  
        <english-title>METHOD FOR PROVIDING PAGE AND ELECTRONIC DEVICE THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯娜京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAE KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金娜妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, NA YEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南允貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, YOON JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YOU JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慧珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種於電子裝置中提供頁面之方法。具體而言，於電子裝置中提供頁面之方法可包括如下步驟：確認包括由終端之用戶選擇之至少一個第1物品之第1物品清單；自第1物品清單中刪除至少一個第1物品中之自添加至第1物品清單之時點起經過第1設定之時間的第2物品並添加至第2物品清單；自終端接收對與第1物品清單相關之頁面之請求；及提供包括第1物品清單之第1區域、第2物品清單之第2區域及第3區域之頁面，該第3區域係表示第2物品已添加至第2物品清單者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="964" publication-number="202628980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10W20/41</main-classification>  
        <further-classification edition="202601120260318B">H10W20/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛敬涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, CHING HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昭郡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JAU-JIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石健學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIEN-HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在半導體裝置的互連層中的互連結構的最底層上方形成導電材料的層，並且蝕刻導電材料的層以從導電材料的層定義金屬化結構的最底層。為了降低獨立式金屬化結構塌陷的可能性，獨立式金屬化結構的暴露側壁表面可以被氧化以形成獨立式金屬化結構的金屬氧化物側壁。可以使用自對準氧化技術來形成金屬氧化物側壁，該自對準氧化技術專門針對獨立式金屬化結構的側壁來進行氧化。金屬氧化物側壁可以由增加獨立式金屬化結構的機械強度的金屬氧化物材料形成，這使得獨立式金屬化結構能夠抵抗塌陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A layer of conductive material is formed above a bottom-most layer of interconnect structures in an interconnect layer of a semiconductor device, and the layer of conductive material is etched to define the bottom-most layer of metallization structures from the layer of conductive material. To reduce the likelihood of collapse of the free-standing metallization structures, the exposed sidewall surfaces of the free-standing metallization structures may be oxidized to form metal-oxide sidewalls for the free-standing metallization structures. The metal-oxide sidewalls may be formed using a self-aligned oxidation technique that specifically targets the sidewalls of the free-standing metallization structures for oxidation. The metal-oxide sidewalls may be formed of a metal-oxide material that increases the mechanical strength of the free-standing metallization structures, which enables the free-standing metallization structures to resist collapsing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:製程</p>  
        <p type="p">410:框</p>  
        <p type="p">420:框</p>  
        <p type="p">430:框</p>  
        <p type="p">440:框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="965" publication-number="202627946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627946.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示購物車畫面之方法、其用戶終端、及儲存有用以實行該方法之電腦程式之非暫時性電腦可讀記錄媒體</chinese-title>  
        <english-title>METHOD OF DISPLAYING SHOPPING CART SCREEN, USER TERMINAL THEREOF, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM STORING COMPUTER PROGRAM FOR PERFORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250901B">G06Q30/06</main-classification>  
        <further-classification edition="202301120250901B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯娜京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAE KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南允貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, YOON JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YOU JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施例，可提供一種根據電子商務服務中提供之物品之配送類型來將物品之資訊顯示於購物車頁面中之方法、實行方法之用戶終端或記錄有用以實行方法之電腦程式之非暫時性電腦可讀記錄媒體，上述方法包括如下步驟：獲得請求顯示購物車頁面之請求信號；確定與複數個配送類型中之第1配送類型相關之至少一個第1物品；基於是否滿足預先確定之複數個條件中之至少一者，根據針對複數個條件各者指定之顯示形式來確定第1區域之顯示形式；及基於所確定之顯示形式來顯示第1區域，該第1區域包括至少一個第1物品各者之至少一個縮略影像、表示滿足以第1配送類型進行配送所需之條件之程度之圖表、及至少一個第1物品各者之詳細資訊中之至少一者；且至少一個縮略影像各者錨定至購物車頁面中包括之至少一個第1物品之詳細資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="966" publication-number="202627907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>路徑規劃方法、電子設備及儲存介質</chinese-title>  
        <english-title>PATH PLANNING METHOD, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250602B">G06Q10/047</main-classification>  
        <further-classification edition="200601120250602B">G01C21/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JIAN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳榮堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RONG-JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙喆祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, ZHE-QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張利權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LI-QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊煒達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEI-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種路徑規劃方法、電子設備及儲存介質，其中，所述方法包括：基於多個導航車中每個導航車在行駛過程的環境資料，獲取目標物件的監測資料；根據所述監測資料，基於深度Q網路獲得所述多個導航車的多個初始優化路徑；基於多目標蟻群演算法，從所述多個初始優化路徑中確定每個導航車的目標優化路徑。本申請可以實現自動路徑規劃，提高路徑規劃的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a path planning method, an electronic device and a storage medium. The method includes: obtaining monitoring data of a target object based on environmental data of each navigation vehicle among a plurality of navigation vehicles during a driving process; obtaining a plurality of initial optimization paths of the plurality of navigation vehicles based on a Deep Q Network according to the monitoring data; determining a target optimization path of each navigation vehicle from the plurality of initial optimization paths based on a multi-objective ant colony algorithm. This application can realize automatic path planning and improve the efficiency of path planning.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="967" publication-number="202625968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適應性輔助裝置及方法</chinese-title>  
        <english-title>ADAPTIVE ASSISTIVE DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">A61B5/11</main-classification>  
        <further-classification edition="200601120251201B">A61B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TSUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛　詠琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEK, YOONG KEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃清煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供的適應性輔助裝置及方法，可提供帕金森氏症患者音樂或者振動以提示患者跟著節奏行走，而不出現小碎步或者步態凝結的情形。同時，適應性輔助裝置還可接收病患踩踏的訊號回饋，來調整輸出音樂或者振動的頻率。如此一來，病患可得到個人化的療程，並且因即時的反饋，病患更不易發生跌倒的風險，還可以在走路的步態上得到進步。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The adaptive assistive device and method provided by the present disclosure can provide music or vibration to patients with Parkinson's disease to prompt the patient to walk with the rhythm without causing small steps or gait condensation. At the same time, the adaptive auxiliary device can also receive signal feedback from the patient's pedaling to adjust the frequency of the output music or vibration. In this way, patients can receive personalized treatment. And with immediate feedback, patients are less likely to fall and can improve their walking gait.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:適應性輔助裝置</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:收發器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="968" publication-number="202627544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶通濾波器、包含其的光學結構及其製造方法</chinese-title>  
        <english-title>BANDPASS FILTER, OPTICAL STRUCTURE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G02B5/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>采鈺科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISERA TECHNOLOGIES COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古士良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, SHIH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石明倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, MING-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">帶通濾波器包括第一反射器層、設置在第一反射器層上的第二反射器層以及在第一方向上設置在第一反射器層和第二反射器層之間的間隔層。間隔層包括複數個微結構和圍繞微結構的基底層。複數個微結構包括第一材料，基底層包括基底材料，且基底材料的折射率與第一材料的折射率不同。微結構以不同的密度排列在基底層的不同部分，與所述基底層的不同部分相對應之間隔層的部分的有效折射率彼此不同。透過包含間隔層，帶通濾波器可從單帶通濾波器轉變為多帶通濾波器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bandpass filter includes a first reflector layer, a second reflector layer disposed on the first reflector layer, and a space layer disposed between the first reflector layer and the second reflector layer in a first direction. The space layer includes a plurality of microstructures including a first material and a base layer surrounding the microstructures and including a base material with a refractive index that is different from that of the first material. The microstructures are arranged in different portions of the base layer at different densities, the effective refractive indices of portions of the space layer corresponding to the different portions of the base layer will be different from each other. By including the space layer, the bandpass filter can be transformed from a single bandpass filter to a multi-bandpass filter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:帶通濾波器</p>  
        <p type="p">11:第一反射器層</p>  
        <p type="p">12:間隔層</p>  
        <p type="p">121:基底層</p>  
        <p type="p">121O:開口</p>  
        <p type="p">123:微結構</p>  
        <p type="p">13:第二反射器層</p>  
        <p type="p">P:間距</p>  
        <p type="p">P1:第一間距</p>  
        <p type="p">P2:第二間距</p>  
        <p type="p">R1:第一區域</p>  
        <p type="p">R2:第二區域</p>  
        <p type="p">A1:第一部分</p>  
        <p type="p">A2:第二部分</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="969" publication-number="202627817"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627817.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體控制器、快閃記憶體控制器的控制方法及其應用的電子裝置</chinese-title>  
        <english-title>FLASH MEMORY CONTROLLER, CONTROL METHOD OF FLASH MEMORY CONTROLLER, AND ELECTRONIC DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250804B">G06F12/0866</main-classification>  
        <further-classification edition="201601120250804B">G06F12/08</further-classification>  
        <further-classification edition="200601120250804B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張均林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快閃記憶體控制器包括緩衝暫存器以及微處理器。緩衝暫存器具有讀取指令映射區域及寫入指令保留區域，且第一部分映射表暫存於讀取指令映射區域及部分的寫入指令保留區域。微處理器執行對快閃記憶體模組的存取。微處理器根據主機端裝置發送的邏輯位址搜尋暫存在緩衝暫存器中的第一部分映射表是否存在對應於邏輯位址的映射資料。當映射資料未存在時，由微處理器觸發加載指令，並由映射表將對應於邏輯位址的第二部分映射資料加載到讀取指令映射區域與寫入指令保留區域。此外，本發明還公開快閃記憶體控制器的控制方法及其應用的電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory controller includes a buffer register and a microprocessor. The buffer register has a read command mapping area and a write command reserved area. A first part of a mapping table is temporarily stored in the read command mapping area and part of the write command reserved area. The microprocessor is used to perform access to the flash memory module. The microprocessor searches whether the mapping data corresponding to the logical address exists in the first part of the mapping table temporarily stored in the buffer register, based on the logical address sent by the host device. When the mapping data does not exist, the microprocessor triggers a loading command and loads the second part of the mapping data corresponding to the logical address from the mapping table to the read command mapping area and the write command reserved area. Additionally, the invention discloses a control method for the flash memory controller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:記憶裝置</p>  
        <p type="p">110:快閃記憶體模組</p>  
        <p type="p">111:系統區</p>  
        <p type="p">112:資料區</p>  
        <p type="p">113:備用區</p>  
        <p type="p">120:快閃記憶體控制器</p>  
        <p type="p">121:微處理器</p>  
        <p type="p">122:唯讀記憶體</p>  
        <p type="p">122C:程式碼</p>  
        <p type="p">123:記憶體介面</p>  
        <p type="p">124:緩衝暫存器</p>  
        <p type="p">124A:讀取指令映射區域</p>  
        <p type="p">124B:指令保留區域</p>  
        <p type="p">125:主機介面</p>  
        <p type="p">130:主機端裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="970" publication-number="202628066"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628066.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改良的顯示裝置</chinese-title>  
        <english-title>IMPROVED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G09G3/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商賽歐泰克有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCIOTEQ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐哥　尤根　海克特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOGHE, JURGEN HECTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲爾史翠特　蘭納特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERSTRAETE, REINERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種平板主動矩陣或被動矩陣顯示器，較佳地為液晶顯示器，其包含：一單一背基板，其被分成多個電隔離或非隔離的可單獨定址功能性顯示區段，較佳地，在該些多個顯示區段之間沒有可見接縫；界定一組行之一組源極信號線、界定一組列之一組閘極信號線，以及配置成列及行之矩陣的一組像素單元，使得各像素單元可被由一源極信號線及一閘極信號線組成之一對應SG對定址；至少一第一源極驅動電路及一第二源極驅動電路，該第一源極驅動電路耦接至該些源極信號線之與一第一顯示區段相對應之一第一部分，該第二源極驅動電路耦接至該些源極信號線之與一第二顯示區段相對應之一第二部分；至少一第一閘極驅動電路，其耦接至該些閘極信號線之一第一部分，藉此在正常操作期間，各像素單元經組態以當與該像素單元相對應之該SG對之該閘極信號線被啟動時，利用由與該像素單元相對應之該SG對之該源極信號線提供的一像素相依性電信號進行充電，且藉此根據關於該第一顯示區段之指令，該第一顯示區段之各像素單元經組態以採用由與該像素單元相對應之該SG對之該源極信號線提供的一預設電信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention concerns a flat panel active-matrix or passive-matrix display, preferably a liquid crystal display, comprising: a single back substrate divided into multiple electrically isolated or non- isolated, separately addressable, functional display sections, preferably having no visible seam between said multiple display sections, a set of source signal lines defining a set of columns, a set of gate signal lines defining a set of rows, and a set of pixel cells arranged in a matrix of rows and columns such that each pixel cell is addressable by a corresponding SG pair which consists of a source signal line and a gate signal line, at least a first source driver circuit coupled to a first portion of the source signal lines corresponding to a first display section and a second source driver circuit coupled to a second portion of the source signal lines corresponding to a second display section, at least a first gate driver circuit coupled to a first portion of the gate signal lines, whereby, during normal operation, each pixel cell is configured to be charged with a pixel-dependent electrical signal provided by the source signal line of the SG pair corresponding to said pixel cell when the gate signal line of the SG pair corresponding to said pixel cell is activated, and whereby, upon instructions with respect to the first display section, each pixel cell of said first display section is configured to adopt a default electrical signal provided by the source signal line of the SG pair corresponding to said pixel cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第一源極驅動電路</p>  
        <p type="p">3:第二源極驅動電路</p>  
        <p type="p">4:第一閘極驅動電路</p>  
        <p type="p">5:第二閘極驅動電路</p>  
        <p type="p">6:源極信號線</p>  
        <p type="p">7:源極信號線</p>  
        <p type="p">20:左失效控制器/失效控制器</p>  
        <p type="p">21:右失效控制器</p>  
        <p type="p">23:VCOM多工器(VCOM mux)/左VCOM mux</p>  
        <p type="p">26:VCOM mux/右VCOM mux</p>  
        <p type="p">40:閘極mux開關</p>  
        <p type="p">41:閘極mux開關</p>  
        <p type="p">48:閘極信號線/閘極線/左閘極線</p>  
        <p type="p">49:閘極信號線/工作閘極線/閘極線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="971" publication-number="202626329"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626329.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於自訂衝浪場次的方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR CUSTOMISING A SURF SESSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">B29C45/76</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商英司坦運動有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTANT SPORT, S.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩格思土梅　荷西曼紐歐里歐佐拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAGASTUME, JOSE MANUEL ODRIOZOLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於自訂在設有由控制器(201)控制的波浪W產生器系統(1)之設施中運行的衝浪場次之方法及系統。該方法包括定義一組自訂偏好；在衝浪場次期間偵測事件及使用者輸入，並且根據自訂偏好修改正在進行的場次之程式，進而產生輸出(400)以作用於波浪產生器系統(1)來反映那些偏好。本發明允許即時根據偵測到的事件、控制器(201)的自動決策及衝浪者的偏好之組合來自訂衝浪場次。這些偏好可以在衝浪場次期間進行修改，與傳統控制系統相比，提高衝浪場次的自訂程度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method and system for customising a surf session running in a facility provided with a wave W generator system (1) controlled by a controller (201). The method includes defining a set of customised preferences, detecting events and user input during the surf session and modifying the programming of the ongoing session based on the customised preferences, generating an output (400) to act on the wave generator system (1) to reflect those preferences. The invention allows customisation of the surf session in real time, based on a combination of detected events, automatic decisions of the controller (201) and surfer preferences. These preferences may be modified during the surf session, improving the degree of customisation of the surf session compared to conventional control systems.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="972" publication-number="202627832"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627832.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢索控制系統、檢索控制方法及資訊記憶媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250801B">G06F16/248</main-classification>  
        <further-classification edition="201901120250801B">G06F16/538</further-classification>  
        <further-classification edition="202001120250801B">G06F40/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李依玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　放</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳庭熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TINGXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　廣達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUANGDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之檢索控制系統之提示產生部(46)基於自終端(14)受理之聊天訊息，產生向語言模型之提示。提示輸出部(48)將提示輸出至語言模型。顯示控制部(56)將基於來自語言模型對於提示之回答的聊天訊息輸出至終端(14)。第1檢索中介部(50a)基於與終端(14)之間之聊天訊息之往來記錄，產生檢索查詢。第1檢索中介部(50a)將檢索查詢輸出至第1檢索系統(12a)。顯示控制部(56)將根據檢索查詢被輸出至第1檢索系統(12a)而自第1檢索系統(12a)受理之檢索結果輸出至終端(14)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:檢索控制系統</p>  
        <p type="p">12a:第1檢索系統</p>  
        <p type="p">12b:第2檢索系統</p>  
        <p type="p">14:終端</p>  
        <p type="p">40:記錄記憶部</p>  
        <p type="p">42:聊天訊息受理部</p>  
        <p type="p">44:意圖判定部</p>  
        <p type="p">46:提示產生部</p>  
        <p type="p">48:提示輸出部</p>  
        <p type="p">50a:第1檢索中介部</p>  
        <p type="p">50b:第2檢索中介部</p>  
        <p type="p">52:一般往來部</p>  
        <p type="p">54:聊天訊息產生部</p>  
        <p type="p">56:顯示控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="973" publication-number="202627947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢索控制系統、檢索控制方法及資訊記憶媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/06</main-classification>  
        <further-classification edition="201901120250801B">G06F16/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李依玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　放</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳庭熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TINGXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　廣達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUANGDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之檢索控制系統之檢索中介部(50)基於給定之檢索查詢、及就複數個檢索系統各者的該檢索系統執行之檢索所使用之查詢之履歷，自複數個檢索系統之中決定至少1個目標系統。檢索中介部(50)向至少1個目標系統各者輸出檢索查詢。檢索中介部(50)自至少1個目標系統各者，受理與檢索查詢相應之檢索結果。顯示控制部(54)顯示示出自至少1個目標系統各者受理之檢索結果之畫面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:檢索控制系統</p>  
        <p type="p">12a:第1檢索系統</p>  
        <p type="p">12b:第2檢索系統</p>  
        <p type="p">12c:第3檢索系統</p>  
        <p type="p">14:終端</p>  
        <p type="p">40:日誌記憶部</p>  
        <p type="p">42:受理部</p>  
        <p type="p">44:提示產生部</p>  
        <p type="p">46:提示輸出部</p>  
        <p type="p">48:執行畢查詢履歷收集部</p>  
        <p type="p">50:檢索中介部</p>  
        <p type="p">52:聊天訊息產生部</p>  
        <p type="p">54:顯示控制部</p>  
        <p type="p">56:檢索結果畫面產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="974" publication-number="202625948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸入嘴及吸塵器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">A47L5/24</main-classification>  
        <further-classification edition="200601120260321B">A47L9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高市翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAICHI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上幹允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, MOTOCHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布施野裕介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSENO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的吸入嘴具備：吸嘴罩殼，形成向下開口的吸入空間，以藉由吸引源的吸引力使地板面上的塵埃流入；驅動部，產生旋轉力；旋轉刷，在吸入空間內在左右方向上延伸設置，藉由驅動部的旋轉力而旋轉來刮取地板面上的塵埃；及捲繞限制部，限制塵埃捲繞於旋轉刷。捲繞限制部具有限制肋部，前述限制肋部在旋轉刷的軸方向上延伸並咬入旋轉刷的外周部，以在旋轉刷的旋轉方向上將塵埃壓制在捲繞限制部的上游側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:吸入嘴</p>  
        <p type="p">131:連接管部</p>  
        <p type="p">132:吸嘴罩殼</p>  
        <p type="p">133:吸入空間</p>  
        <p type="p">134:流出路徑</p>  
        <p type="p">135:後區劃壁</p>  
        <p type="p">136:前區劃壁</p>  
        <p type="p">137:上區劃壁</p>  
        <p type="p">138:右區劃壁</p>  
        <p type="p">139:左區劃壁</p>  
        <p type="p">167:安裝孔</p>  
        <p type="p">171:右容置部</p>  
        <p type="p">173:左容置部</p>  
        <p type="p">180:捲繞限制部</p>  
        <p type="p">182:限制肋部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="975" publication-number="202627866"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627866.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片儲存模組設計驗證方法及非暫態電腦可讀取儲存媒體</chinese-title>  
        <english-title>CHIP MEMORY BLOCK DESIGN VERIFICATION METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250805B">G06F30/33</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商創意電子（南京）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL UNICHIP (NANJING) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖有軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, YOU-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, WEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片儲存模組設計驗證方法，包含：(a)基於多個儲存單元產生網表；(b)對網表執行內建自我測試，以將多個儲存單元分類為多個內建自我測試群組；(c)對內建自我測試群組執行功率分析，以獲得內建自我測試群組在工藝電壓溫度角下所對應的功率值；(d)設定轉換時間並根據功率值及轉換時間計算多個電流值；(e)響應於多個電流值中的至少一者大於相關於晶片儲存模組設計的電流閾值，調整網表的邏輯設計，再次執行步驟(a)；以及(f)響應於多個電流值等於或小於電流閾值，輸出晶片儲存模組設計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip memory block design verification method suitable for the chip design of a plurality of memory macros is provided in the present disclosure. The chip design verification method comprises: (a) generating, by a computing circuit, a netlist based on the plurality of memory macros, wherein the netlist indicates the logic design of the plurality of memory macros; (b) classifying, by the computing circuit performing a built-in self-test (BIST) on the netlist, the plurality of memory macros into a plurality of BIST groups; (c) obtaining, by the computing circuit performing a power analysis on the plurality of BIST groups, a plurality of power values corresponding to the plurality of BIST groups under a process voltage temperature corner; (d) setting, by the computing circuit, a transition time, and calculating a plurality of current values based on the plurality of power values and the transition time; (e) in response to at least one of the plurality of current values being greater than a current threshold, adjusting, by the computing circuit, the logic design of the netlist, and step (a) is performed again, wherein the current threshold is related to the chip memory block design; and (f) in response to the plurality of current values being equal to or lower than the current threshold, outputting, by the computing circuit, the chip memory block design.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片儲存模組設計驗證方法</p>  
        <p type="p">S110,S120,S130,S140:步驟</p>  
        <p type="p">S150,S160,S170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="976" publication-number="202628301"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628301.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>建築物用電設備之節能控制器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H02J3/00</main-classification>  
        <further-classification edition="202601120260302B">H02J3/14</further-classification>  
        <further-classification edition="200601120260302B">G05B15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊進村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIN-TSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊進村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIN-TSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為有關一種建築物用電設備之節能控制器，結構包括有至少一控制裝置、複數電源輸入部、複數輸出控制部、一控制開關、至少一連動開關、一定時裝置、及一模式設定單元。藉上述結構，在配電箱側增設控制裝置，以針對公共設備將其控制電源與訊號輸入部分別連結電源輸入部及輸出控制部，以由控制開關統一控制所有非核心公共設備的啟閉，並可利用連動開關從遠處操作控制開關，可簡單快速的一鍵關閉無使用需求的公設，減少能源浪費，並可利用定時裝置及模式設定單元進行自動控制，滿足不同場景需求、避免每日重複操作的麻煩。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">100:控制裝置</p>  
        <p type="p">1:電源輸入部</p>  
        <p type="p">2:輸出控制部</p>  
        <p type="p">3:控制開關</p>  
        <p type="p">4:連動開關</p>  
        <p type="p">5:定時裝置</p>  
        <p type="p">51:模式設定單元</p>  
        <p type="p">7:配電箱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="977" publication-number="202626504"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626504.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無機奈米粒子核-聚合物殼構造色材、粒子膜、及奈米粒子膜之製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C01B33/02</main-classification>  
        <further-classification edition="200601120260401B">C09C1/00</further-classification>  
        <further-classification edition="200601120260401B">C09C3/10</further-classification>  
        <further-classification edition="201401120260401B">C09D11/037</further-classification>  
        <further-classification edition="200601120260401B">A61K8/02</further-classification>  
        <further-classification edition="200601120260401B">A61K8/25</further-classification>  
        <further-classification edition="200601120260401B">A61Q1/00</further-classification>  
        <further-classification edition="201101120260401B">B82Y20/00</further-classification>  
        <further-classification edition="201101120260401B">B82Y30/00</further-classification>  
        <further-classification edition="201101120260401B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人神戶大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉本泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMOTO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明目的在於提供使奈米粒子核不直接相接而大幅抑制二聚物或團簇的形成，且在目的波長帶中可獲得明亮顯色之附高分子殼之奈米粒子及奈米粒子膜。 &lt;br/&gt;使用具有40~300nm之粒徑且折射率3以上之無機奈米結晶的周圍形成有20~200nm之厚度之聚合物殼之無機奈米粒子核-聚合物殼構造色材。形成於無機奈米結晶的周圍之聚合物殼是藉由鍵結或吸附於無機奈米結晶表面的羥基或經表面修飾的官能基而形成。例如將矽表面的親水性OH基(羥基)取代為疏水性基，將N-異丙基丙烯醯胺(NIPAM)於矽表面修飾並被覆。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:構造色材</p>  
        <p type="p">2:Si奈米粒子</p>  
        <p type="p">3:聚合物殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="978" publication-number="202628550"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628550.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設備</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250424B">H05K9/00</main-classification>  
        <further-classification edition="200601120250424B">H05K7/02</further-classification>  
        <further-classification edition="200601120250424B">H05K5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱書敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, SHUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例公開了一種電子設備，該電子設備包括外殼、金屬裝飾件、安裝支架、導電部和柔性電路板，金屬裝飾件連接在外殼上的第一安裝通孔內，安裝支架設置在外殼內，安裝支架上設置有連接通孔，導電部設置在安裝支架的兩側和連接通孔內，柔性電路板設置在安裝支架遠離外殼的一側並通過導電部與金屬裝飾件電連接，從而將金屬裝飾件上產生的靜電放電傳導至接地點。該電子設備中金屬裝飾件的接地方式簡單，零件數量少，簡化了組裝流程且實現了靜電防護的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments of the present invention disclose an electronic device, which includes a housing, a metal decoration, a mounting bracket, a conductive part, and a flexible circuit board. The metal decoration is connected within a first mounting through-hole on the housing. The mounting bracket is installed inside the housing and has a connection through-hole. The conductive part is arranged on both sides of the mounting bracket and within the connection through-hole. The flexible circuit board is positioned on the side of the mounting bracket away from the housing and is electrically connected to the metal decoration through the conductive part, thereby conducting electrostatic discharge (ESD) from the metal decoration to a grounding point. This electronic device features a simple grounding method for the metal decoration, with fewer components, which simplifies the assembly process and achieves effective electrostatic protection..</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:外殼</p>  
        <p type="p">11:腔體</p>  
        <p type="p">12:第一安裝通孔</p>  
        <p type="p">13:第二安裝通孔</p>  
        <p type="p">2:金屬裝飾件</p>  
        <p type="p">3:安裝支架</p>  
        <p type="p">35:第一連接通孔</p>  
        <p type="p">4:導電部</p>  
        <p type="p">5:柔性電路板</p>  
        <p type="p">6:彈性導電柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="979" publication-number="202628542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線充電裝置</chinese-title>  
        <english-title>WIRELESS CHARGING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H05K7/20</main-classification>  
        <further-classification edition="200601120250602B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致伸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線充電裝置。無線充電裝置包括一殼體、一主板、一導風罩、一第一連動結構以及一第二連動結構。主板包括一第一充電模組、一第二充電模組以及一風扇，其中，第一充電模組以及第二充電模組設置於主板的一頂側，風扇設置於主板的一底側。導風罩組裝於主板的底側。導風罩包括一進風口、一容置區、一第一導流通道、一第一鰭片組、一第二導流通道以及一第二鰭片組。當待充電物件放置於無線充電裝置上時，會觸發第一連動結構或是第二連動結構，進而允許風扇所產生的氣流導引至待充電物件的底部以及兩側，達到降溫散熱的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless charging device is provided. The wireless charging device includes a casing, a mainboard, a wind guide cover, a first linkage structure and a second linkage structure. The mainboard includes a first charging module, a second charging module and a fan. The first charging module and the second charging module are arranged on a top side of the mainboard, and the fan is arranged on a bottom side of the mainboard. The wing guide cover is assembled on the bottom side of the motherboard. The wind guide cover includes an air inlet, an accommodation area, a first wind guide channel, a first fin set, a second wind guide channel and a second fin set. When the object to be charged is placed on the wireless charging device, the first linkage structure or the second linkage structure will be triggered, thereby allowing the air flow generated by the fan to be directed to the bottom and both sides of the object to be charged, thereby achieving a cooling effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:第二分流罩</p>  
        <p type="p">51:左分流道</p>  
        <p type="p">52:右分流道</p>  
        <p type="p">63:風扇</p>  
        <p type="p">721:第一端部</p>  
        <p type="p">733:鏤空部</p>  
        <p type="p">734:連接部</p>  
        <p type="p">81:第二凸輪</p>  
        <p type="p">821:第一端部</p>  
        <p type="p">92:容置區</p>  
        <p type="p">93:第一鰭片組</p>  
        <p type="p">941:內側通道</p>  
        <p type="p">942:中央通道</p>  
        <p type="p">943:外側通道</p>  
        <p type="p">95:第二鰭片組</p>  
        <p type="p">961:內側通道</p>  
        <p type="p">962:中央通道</p>  
        <p type="p">963:外側通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="980" publication-number="202627653"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627653.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔熱罩以及具有該隔熱罩的攝影機</chinese-title>  
        <english-title>HEAT SHIELD AND CAMERA HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250422B">G03B17/56</main-classification>  
        <further-classification edition="202101120250422B">G03B17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神基科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭成仕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHENG-SHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種隔熱罩以及一種具有該隔熱罩的攝影機。隔熱罩包括一套管體、以及一卡扣抵頂件。套管體具有兩管口、一管壁以及兩限位側部。兩管口是相對設置於管壁的兩端。兩限位側部是相對設置於管壁的兩側，且通過管壁與兩限位側部界定出一容置空間。卡扣抵頂件是設置於管壁的其中一兩端上，並靠近其中一兩管口的位置。攝影機包括一第一殼體、第二殼體以及隔熱罩。隔熱罩是配置於第一殼體上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a heat shield and a camera having the same. The heat shield includes a casing body and a snap-fit abutting element. The casing body has two pipe openings, a pipe wall and two limiting side parts. The two pipe openings are arranged oppositely at two ends of the pipe wall. The two limiting side parts are arranged oppositely on both sides of the pipe wall, and an accommodation space is defined by the pipe wall and the two limiting side parts. The snap-fit abutting element is arranged at one of the two ends of the pipe wall and is close to one of the two pipe openings. The camera includes a first shell, a second shell and the heat shield. The heat shield is disposed on the first shell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">H:隔熱罩</p>  
        <p type="p">CP:容置空間</p>  
        <p type="p">NP:卡扣空間</p>  
        <p type="p">S1:內表面</p>  
        <p type="p">10:套管體</p>  
        <p type="p">11:管口</p>  
        <p type="p">111:卡止部</p>  
        <p type="p">12:管壁</p>  
        <p type="p">121:削切面</p>  
        <p type="p">13:限位側部</p>  
        <p type="p">131:中間段</p>  
        <p type="p">14:凸肋</p>  
        <p type="p">15:鏤孔</p>  
        <p type="p">20:卡扣抵頂件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="981" publication-number="202626869"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626869.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C08G73/10</main-classification>  
        <further-classification edition="200601120260324B">C08L79/08</further-classification>  
        <further-classification edition="200601120260324B">C08K5/18</further-classification>  
        <further-classification edition="200601120260324B">C08K5/21</further-classification>  
        <further-classification edition="200601120260324B">C08K5/33</further-classification>  
        <further-classification edition="200601120260324B">G03F7/004</further-classification>  
        <further-classification edition="200601120260324B">G03F7/20</further-classification>  
        <further-classification edition="200601120260324B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白川三千紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAKAWA, MICHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物、使上述樹脂組成物硬化而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法的半導體元件之製造方法及包含上述硬化物之半導體元件，該樹脂組成物包含樹脂A、感光劑B及溶劑C，其中，樹脂A包含選自包括醯胺酸酯結構及醯胺酸結構之群組中的至少1個，將上述樹脂組成物調整為38℃之後經過3天時的黏度變化率為±10%以內，樹脂A中所包含之中和點的pH在7.0～12.0的範圍內之酸基的酸值在0.0010～0.3000mmol/g的範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="982" publication-number="202628566"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628566.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製備方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B12/00</main-classification>  
        <further-classification edition="202601120260302B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃則堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSE-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體元件，包含一源/汲極結構、一介電層、複數個第一接點結構、一多晶矽堆疊以及一第二接點結構。該源/汲極結構係設置在一半導體基底上。該介電層係設置在該源/汲極結構上。該複數個第一接點結構貫穿該介電層和該源/汲極結構。該第二接點結構係設置在該多晶矽堆疊上。該多晶矽堆疊和該第二接點結構係設置在該複數個第一接點結構中的兩者之間。該複數個第一接點結構中的每一者包含一第一襯墊以及由該第一襯墊環繞的一第一導電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor device including a source/drain structure, a dielectric layer, first contact structures, a polysilicon stack, and a second contact structure. The source/drain structure is disposed over a semiconductor substrate. The dielectric layer is disposed over the source/drain structure. The first contact structures penetrate through the dielectric layer and the source/drain structure. The second contact structure is disposed over the polysilicon stack. The polysilicon stack and the second contact structure are disposed between two of the plurality of first contact structures. Each of the first contact structures includes a first liner and a first conductive layer surrounding by the first liner.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100B:半導體元件</p>  
        <p type="p">101:半導體基底</p>  
        <p type="p">103:磊晶層</p>  
        <p type="p">105:矽化物層</p>  
        <p type="p">107:介電層</p>  
        <p type="p">109:源/汲極結構</p>  
        <p type="p">133:第一多晶矽層</p>  
        <p type="p">135:第二多晶矽層</p>  
        <p type="p">139:多晶矽堆疊</p>  
        <p type="p">153:阻障層</p>  
        <p type="p">153L:下部分</p>  
        <p type="p">155:導電層</p>  
        <p type="p">159:接點結構</p>  
        <p type="p">201:第一襯墊</p>  
        <p type="p">201BT:厚度</p>  
        <p type="p">201ST:厚度</p>  
        <p type="p">203:第二襯墊</p>  
        <p type="p">203BT:厚度</p>  
        <p type="p">203ST:厚度</p>  
        <p type="p">205:導電層</p>  
        <p type="p">205W:寬度</p>  
        <p type="p">207:接點結構</p>  
        <p type="p">207D:深度</p>  
        <p type="p">DA:陣列區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="983" publication-number="202627994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於近眼顯示器的物件定位系統與方法</chinese-title>  
        <english-title>OBJECT POSITIONING SYSTEM AND METHOD FOR NEAR-EYE DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250502B">G06T15/00</main-classification>  
        <further-classification edition="201101120250502B">G06T19/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商沃彌股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOMII INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴俊穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, JIUNN-YIING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種近眼顯示器系統，包括第一影像裝置與第二影像裝置，用於分別地擷取周圍環境的第一影像與第二影像，該第一影像裝置與該第二影像裝置係被提供在不同的空間位置上，其中該第一影像與該第二影像包括一真實物件的影像，該真實物件的第一空間座標係根據接收該真實物件之影像的點陣圖單元對所確認，該點陣圖單元對分別地對應於第一影像裝置與第二影像裝置之影像感測器的至少二位置，其中該真實物件的第一空間座標係根據使用者與第一影像裝置及第二影像裝置的相對位置而轉換為第二空間座標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A near-eye display system, comprising a first imaging device and a second imaging device, for respectively capturing a first image and a second image of a surrounding environment, the first image device and the second imaging device being provided at different spatial locations, wherein the first image and the second image comprise an image of an real object, a first spatial coordinate of the real object is determined based on bitmap unit pair receiving the image of the real object, the bitmap unit pair corresponds to at least two positions respectively on image sensors of the first imaging device and the second imaging device, wherein the first spatial coordinate of the real object is transformed to a second spatial coordinate based on a relative position of the user to the first imaging device and the second imaging device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CA1,CA2:匯聚角</p>  
        <p type="p">d1,d2:相對水平距離</p>  
        <p type="p">L1,L1’:左光像素</p>  
        <p type="p">L12,L22:矩陣</p>  
        <p type="p">P1,P2:位置</p>  
        <p type="p">R1,R1’:右光像素</p>  
        <p type="p">R22,R32:矩陣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="984" publication-number="202626079"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626079.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療糖尿病腎病的複方中藥組合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">A61K36/48</main-classification>  
        <further-classification edition="200601120250602B">A61K36/284</further-classification>  
        <further-classification edition="200601120250602B">A61K36/40</further-classification>  
        <further-classification edition="200601120250602B">A61K36/54</further-classification>  
        <further-classification edition="200601120250602B">A61K36/487</further-classification>  
        <further-classification edition="200601120250602B">A61K36/804</further-classification>  
        <further-classification edition="200601120250602B">A61K36/46</further-classification>  
        <further-classification edition="200601120250602B">A61K36/21</further-classification>  
        <further-classification edition="200601120250602B">A61K36/79</further-classification>  
        <further-classification edition="200601120250602B">A61K36/185</further-classification>  
        <further-classification edition="200601120250602B">A61P13/12</further-classification>  
        <further-classification edition="200601120250602B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商天津天士力數智中醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIANJIN TASLY DIGITAL INTELLIGENCE CHINESE MEDICINE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡蘊慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YUN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張夢瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MENG-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鵬程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周水平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, SHUI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閆凱境</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, KAI-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及治療糖尿病腎臟病的複方中藥組合物及其應用，本發明提供一種治療糖尿病腎臟病的中藥組合物1，所述中藥組合物1由黃芪、白術、山茱萸、肉桂、補骨脂、生地黃、杜仲、牛膝、五味子製備而成，本發明進一步提供一種治療糖尿病腎臟病的中藥組合物2，所述中藥組合物2由黃芪、白術、山茱萸、肉桂、補骨脂、生地黃、杜仲、牛膝、五味子、通關藤製備而成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="985" publication-number="202626876"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626876.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08G73/12</main-classification>  
        <further-classification edition="200601120260323B">C08L79/08</further-classification>  
        <further-classification edition="200601120260323B">C08K5/18</further-classification>  
        <further-classification edition="200601120260323B">G03F7/004</further-classification>  
        <further-classification edition="200601120260323B">G03F7/027</further-classification>  
        <further-classification edition="200601120260323B">G03F7/20</further-classification>  
        <further-classification edition="200601120260323B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白川三千紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAKAWA, MICHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物、由上述樹脂組成物硬化而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法的半導體元件之製造方法及包含上述硬化物之半導體元件，上述樹脂組成物包含樹脂A及感光劑B，其中，樹脂A包含醯胺酸酯結構及醯胺酸結構，進而包含選自包括由式（AY1）表示之結構及由式（DY1）表示之結構之群組中的至少1個結構，樹脂A中的醯胺酸酯結構的莫耳量相對於醯胺酸結構及醯胺酸酯結構的合計莫耳量為90.00～99.90%，樹脂A的胺值為0.0010～0.3000mmol/g。&lt;br/&gt;&lt;img align="absmiddle" height="220px" width="426px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="986" publication-number="202629020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10W70/685</main-classification>  
        <further-classification edition="202601120260318B">H10W70/69</further-classification>  
        <further-classification edition="202601120260318B">H10W74/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪柏揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, PO-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁景隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, CHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃榮書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LUNG-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭惟元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括至少一第一電子單元、一模封層以及一電路結構。模封層圍繞第一電子單元。電路結構設置在模封層的一側且電連接到第一電子單元。電路結構包括一第一部分和一第二部分，在電子裝置的一法線方向上，第二部分設置在第一部分與第一電子單元之間。第一部分包括一第一絕緣層，第二部分包括一第二絕緣層和一第三絕緣層，第二絕緣層設置在第一絕緣層與第三絕緣層之間，第三絕緣層設置在第二絕緣層與模封層之間，而第二絕緣層的介電損耗小於第一絕緣層的介電損耗和第三絕緣層的介電損耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a first electronic unit, a molding layer and a circuit structure. The molding layer surrounds the first electronic unit. The circuit structure is disposed at a side of the molding layer and be electrically connected to the first electronic unit. The circuit structure includes a first portion and a second portion, and the second portion is disposed between the first portion and the first electronic unit in a normal direction. The first portion includes a first insulating layer, the second portion includes a second insulating layer and a third insulating layer, the second insulating layer is disposed between the first insulating layer and the third insulating layer, the third insulating layer is disposed between the second insulating layer and the molding layer, and a dielectric loss of the second insulating layer is less than dielectric losses of the first insulating layer and the third insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CE1:第一連接元件</p>  
        <p type="p">CE2:第二連接元件</p>  
        <p type="p">CL,MA,MB:導電層</p>  
        <p type="p">CP1:第一導電墊</p>  
        <p type="p">CP2:第二導電墊</p>  
        <p type="p">CS:電路結構</p>  
        <p type="p">DI1:第一介電層</p>  
        <p type="p">DI2:第二介電層</p>  
        <p type="p">ED:電子裝置</p>  
        <p type="p">I1:第一絕緣層</p>  
        <p type="p">I21,I22:第二絕緣層</p>  
        <p type="p">I3:第三絕緣層</p>  
        <p type="p">M1,M1’:第一導電層</p>  
        <p type="p">M2:第二導電層</p>  
        <p type="p">M3:第三導電層</p>  
        <p type="p">M4:第四金屬層</p>  
        <p type="p">P1:第一部分</p>  
        <p type="p">P2:第二部分</p>  
        <p type="p">T4,T5,T1,T2,T3,T6,T7,T8,T9,T10,T11:厚度</p>  
        <p type="p">V1,V2,V3,V4:穿孔</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="987" publication-number="202627631"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627631.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中控平台</chinese-title>  
        <english-title>CENTRAL CONTROL PLATFORM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250508B">G02F1/1333</main-classification>  
        <further-classification edition="201901120250508B">B32B7/022</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹科學園區新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周聖勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHENG-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何恕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪偉倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括第一面板、第一可拉伸膜與第一膠層。第一可拉伸膜設置在第一面板的一側。第一膠層連接第一面板與第一可拉伸膜。第一面板的楊氏模量對第一膠層的楊氏模量的比值大於或等於1000。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus including a first panel, a first stretchable film and a first adhesive layer is provided. The first stretchable film is disposed on one side of the first panel. The first adhesive layer connects the first panel and the first stretchable film. A ratio of the Young’s modulus of the first panel and the Young’s modulus of the first adhesive layer is greater than or equal to 1000.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可拉伸面板</p>  
        <p type="p">100s:操作面</p>  
        <p type="p">111:第一面板</p>  
        <p type="p">111t、131t、132t:厚度</p>  
        <p type="p">121:第一可拉伸膜</p>  
        <p type="p">122:第二可拉伸膜</p>  
        <p type="p">131:第一膠層</p>  
        <p type="p">132:第二膠層</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="988" publication-number="202628009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>姿態估計系統及其方法</chinese-title>  
        <english-title>POSTURE ESTIMATION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251103B">G06V40/20</main-classification>  
        <further-classification edition="202201120251103B">G06V10/10</further-classification>  
        <further-classification edition="200601120251103B">G06T1/00</further-classification>  
        <further-classification edition="202201120251103B">G06V10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏墩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-DUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇泰維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, TAI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝仁得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, REN-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BOYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王韋鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種姿態估計系統及其方法，系統包括毫米波雷達、攝影機以及處理裝置。毫米波雷達用以獲取包括使用者的點雲資訊。攝影機用以對實體場景進行影像擷取，以獲取包括使用者的影像資訊。處理裝置連接至毫米波雷達以及攝影機，用以分別自毫米波雷達以及攝影機取得點雲資訊以及影像資訊。處理裝置用以對點雲資訊進行點雲資訊前處理，對影像資訊進行影像資訊前處理，並且藉由姿態估計模型獲取使用者的人體骨架的各關鍵點的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A posture estimation system and method thereof are provided, the system includes a millimeter wave radar, a camera and a processing device. The millimeter wave radar is used to obtain point cloud information including a user. The camera is used to capture images of physical scene to obtain image information including the user. The processing device is connected to the millimeter wave radar and the camera to obtain the point cloud information and the image information from the millimeter wave radar and the camera respectively. The processing device is used to perform point cloud information pre-processing on the point cloud information, perform image information pre-processing on the image information, and obtain the positions of each key point of the user's human skeleton through a posture estimation model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:姿態估計系統</p>  
        <p type="p">110:毫米波雷達</p>  
        <p type="p">120:攝影機</p>  
        <p type="p">130:處理裝置</p>  
        <p type="p">132:記憶體</p>  
        <p type="p">134:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="989" publication-number="202628670"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628670.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260323B">H10D84/83</main-classification>  
        <further-classification edition="202501120260323B">H10D30/00</further-classification>  
        <further-classification edition="202501120260323B">H10D30/01</further-classification>  
        <further-classification edition="202501120260323B">H10D62/10</further-classification>  
        <further-classification edition="202501120260323B">H10D62/13</further-classification>  
        <further-classification edition="202501120260323B">H10D64/23</further-classification>  
        <further-classification edition="202601120260323B">H10D84/01</further-classification>  
        <further-classification edition="202601120260323B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓相宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SANGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃圭晩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, KYUMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴宰賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JAE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴柱勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹鎭燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, JINCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭在原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JAE WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包括在第一方向上間隔開並在與第一方向不同的第二方向上延伸的主動圖案；位於主動圖案上並在第二方向上交替排列的下通道圖案和下源極/汲極圖案；位於下通道圖案上的上通道圖案，以及位於下源極/汲極圖案上的上源極/汲極圖案；在第一方向上延伸並位於下通道圖案和上通道圖案上的閘極圖案；位於下源極/汲極圖案和上源極/汲極圖案與另一下源極/汲極圖案和另一上源極/汲極圖案之間在第二方向上的分離圖案；以及在第二方向上延伸穿過閘極圖案以分離閘極圖案的閘極切割圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes an active pattern spaced apart in a first direction, and extending in a second direction different from the first direction; a lower channel pattern and a lower source/drain pattern located on the active pattern and alternately arranged in the second direction; an upper channel pattern on the lower channel pattern, and an upper source/drain pattern on the lower source/drain pattern; a gate pattern extending in the first direction and located on the lower channel pattern and the upper channel pattern; a separation pattern located between the lower source/drain pattern and the upper source/drain pattern and another lower source/drain pattern and another upper source/drain pattern in the second direction; and a gate cutting pattern extending in the second direction across the gate pattern to separate the gate pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">520:分離圖案</p>  
        <p type="p">521:本體部分</p>  
        <p type="p">522:突出部分</p>  
        <p type="p">600:閘極切割圖案</p>  
        <p type="p">610:絕緣襯層</p>  
        <p type="p">620:間隙填充絕緣層</p>  
        <p type="p">650:通孔</p>  
        <p type="p">651:第一孔部分</p>  
        <p type="p">652:第二孔部分</p>  
        <p type="p">653:第三孔部分</p>  
        <p type="p">aCA:上源極/汲極接點</p>  
        <p type="p">AR1:第一主動區</p>  
        <p type="p">AR2:第二主動區</p>  
        <p type="p">D1,D2,D3:方向</p>  
        <p type="p">GE:閘極圖案</p>  
        <p type="p">USD1:上源極/汲極圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="990" publication-number="202627271"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627271.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>盛水裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">E03C1/24</main-classification>  
        <further-classification edition="200601120250418B">E03C1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾偉特有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾偉鉑廚衛有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVERPRO KITCHEN AND BATH INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張勉行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凉庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉安鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種盛水裝置，包含有：一盆體，具有一盆主體、一盛水空間、一頂孔、一底孔及一階部，該盛水空間係自該盆主體之頂面往下凹陷而成，該頂孔係自該盛水空間之內周面底部位置向下凹陷而成，該底孔係自該盆主體之底面往上延伸而成，該底孔與該頂孔連通，該頂孔之孔徑與該底孔之孔徑不同，使於該頂孔與該底孔間形成為該階部；一排水器，具有一法蘭主體、一彈跳芯、一止水壓蓋及一鎖緊螺帽，該法蘭主體置於該盆體之底孔中，該法蘭主體之頂端並向側邊彎曲延伸有一抵接部，該抵接部係抵接於該階部上，該彈跳芯係設置於該法蘭主體之內部，該止水壓蓋係連接於該彈跳芯之頂端上，該鎖緊螺帽係鎖接於該法蘭主體之底端周圍上，並抵接於該盆體之盆主體底面上，該彈跳芯可受外力按壓而帶動該止水壓蓋上、下位移，以開啟該頂孔與封閉該頂孔；藉此，本創作具有避免讓使用者產生噁心、不適之感覺及避免造成皮膚不適等功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:盆體</p>  
        <p type="p">11:盆主體</p>  
        <p type="p">12:盛水空間</p>  
        <p type="p">13:頂孔</p>  
        <p type="p">14:底孔</p>  
        <p type="p">15:階部</p>  
        <p type="p">16:擴槽</p>  
        <p type="p">17:溢流孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="991" publication-number="202627623"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627623.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112252</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>彩妝隱形眼鏡及隱形眼鏡</chinese-title>  
        <english-title>MAKEUP CONTACT LENS AND CONTACT LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">G02C7/04</main-classification>  
        <further-classification edition="200601120250930B">G02C11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶碩光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGAVISION CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃逸芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUO-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種彩妝隱形眼鏡及隱形眼鏡。所述隱形眼鏡具有呈球狀的一前表面及用於配戴在眼睛且呈球狀的一後表面，並且所述隱形眼鏡包含一弧形配重區段、一漸變平衡區段、及一常規區段。所述弧形配重區段位於所述隱形眼鏡的下半部且沿其外輪廓配置。所述漸變平衡區段相連於所述弧形配重區段與所述常規區段之間，並且所述漸變平衡區段的厚度自所述弧形配重區段朝所述常規區段的方向呈遞減狀。所述隱形眼鏡具有用於供所述眼睛觀看的一光學部。於所述隱形眼鏡的一俯視圖之中，所述漸變平衡區段重疊於所述光學部的5%～45%面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a makeup contact leans and a contact lens. The contact lens has a spherical front surface and a spherical rear surface that is configured for being worn on an eye. The contact lens includes an arced counterweight segment, a gradient balance segment, and a normal segment. The arced counterweight segment is arranged on a lower half part of the contact lens along an outer contour of the contact lens. The gradient balance segment is connected in-between the arced counterweight segment and the normal segment, and a thickness of the gradient balance segment gradually decreases in a direction from the arced counterweight segment to the normal segment. The contact lens has an optical zone for providing a viewing of the eye. In a top view of the contact lens, the gradient balance segment is overlapped with 5% to 45% of an area of the optical zone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:隱形眼鏡</p>  
        <p type="p">1:光學部</p>  
        <p type="p">2:配戴部</p>  
        <p type="p">3:弧形配重區段</p>  
        <p type="p">31:內邊緣</p>  
        <p type="p">32:外邊緣</p>  
        <p type="p">33:末端</p>  
        <p type="p">4:漸變平衡區段</p>  
        <p type="p">41:校正末端</p>  
        <p type="p">5:常規區段</p>  
        <p type="p">6:邊緣區段</p>  
        <p type="p">C:中心軸</p>  
        <p type="p">P1:第一參考面</p>  
        <p type="p">P2:第二參考面</p>  
        <p type="p">Q1:第一象限</p>  
        <p type="p">Q2:第二象限</p>  
        <p type="p">Q3:第三象限</p>  
        <p type="p">Q4:第四象限</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="992" publication-number="202629014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/63</main-classification>  
        <further-classification edition="202601120260323B">H10W70/68</further-classification>  
        <further-classification edition="202601120260323B">H10W90/20</further-classification>  
        <further-classification edition="200601120260323B">G02B6/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜政勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JUNGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝包括：一第一基體，其具有位於與該第一基體之一頂部表面不同之垂直層級處的一第一及第二底部表面；一第一半導體晶片，其在該第一基體之該頂部表面上；一第二半導體晶片，其在該第一底部表面上且包括一光子積體電路；以及一第二基體，其在該第二底部表面上以覆蓋該第二半導體晶片。該第一基體包括：一第一通孔，其垂直地穿透該第一基體且將該第一半導體晶片電氣連接至該第二半導體晶片；一第二通孔，其垂直地穿透該第一基體且將該第一半導體晶片電氣連接至該第二基體；以及一光學波導，其在該第一底部表面上。從該頂部表面到該第一底部表面之一第一距離小於從該頂部表面到該第二底部表面之一第二距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a first substrate having a first and second bottom surfaces located at different vertical levels from a top surface of the first substrate, a first semiconductor chip on the top surface of the first substrate, a second semiconductor chip on the first bottom surface and including a photonic integrated circuit, and a second substrate on the second bottom surface to cover the second semiconductor chip. The first substrate includes: a first via vertically penetrating the first substrate and electrically connecting the first semiconductor chip to the second semiconductor chip; a second via vertically penetrating the first substrate and electrically connecting the first semiconductor chip to the second substrate; and an optical waveguide on the first bottom surface. A first distance from the top surface to the first bottom surface is smaller than a second distance from the top surface to the second bottom surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一基體</p>  
        <p type="p">110u:頂部表面</p>  
        <p type="p">102:第一基體墊</p>  
        <p type="p">104:第二基體墊</p>  
        <p type="p">110:第一核心部分</p>  
        <p type="p">11011:第一底部表面、底部表面</p>  
        <p type="p">11012:第二底部表面、底部表面</p>  
        <p type="p">112:水平部分</p>  
        <p type="p">112A,114A:側表面</p>  
        <p type="p">114:突出部分</p>  
        <p type="p">116:波導</p>  
        <p type="p">117:插座</p>  
        <p type="p">120:互連層</p>  
        <p type="p">122:第一絕緣層</p>  
        <p type="p">124:第一互連部分</p>  
        <p type="p">200:第一半導體晶片</p>  
        <p type="p">210:第一晶片基底層</p>  
        <p type="p">220:第一晶片互連層</p>  
        <p type="p">222:第一晶片絕緣圖案</p>  
        <p type="p">224:第一晶片互連圖案</p>  
        <p type="p">230:第一連接端子</p>  
        <p type="p">240:下填充層</p>  
        <p type="p">300:第二半導體晶片</p>  
        <p type="p">300A:外側表面</p>  
        <p type="p">310:第二晶片基底層</p>  
        <p type="p">320:第二晶片互連層</p>  
        <p type="p">322:第二晶片絕緣圖案</p>  
        <p type="p">324:第二晶片互連圖案</p>  
        <p type="p">330:第二連接端子</p>  
        <p type="p">350:感測器單元</p>  
        <p type="p">400:覆蓋部分</p>  
        <p type="p">500:第二基體</p>  
        <p type="p">510:第三基體墊</p>  
        <p type="p">520:第三連接端子</p>  
        <p type="p">R1:第一區</p>  
        <p type="p">R2:第二區</p>  
        <p type="p">RS:凹部區</p>  
        <p type="p">TGV1:第一通孔</p>  
        <p type="p">TGV2:第二通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="993" publication-number="202629005"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629005.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>引線架、半導體封裝及形成基材的方法</chinese-title>  
        <english-title>LEADFRAME, SEMICONDUCTOR PACKAGE AND METHODS FOR FORMING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪麗娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LIJUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴里亞斯　伊恩　塞阿紮爾　巴卡翁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARIAS, IAN CEAZAR BUCAYON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>左晶晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUO, JINGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛新月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, XINYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種引線架之實施方案可包括：一基材附接部分，其包括一第一最大平坦表面、及位在與該第一最大平坦表面相對之一側上的一第二最大平坦表面；及一基材開口，其係形成在該基材附接部分之該第一最大平坦表面的一材料中。該基材開口可經組態以接收一基材的一周長於其中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations of a leadframe may include a substrate attach portion including a first largest planar surface and a second largest planar surface on a side opposing the first largest planar surface; and a substrate opening formed in a material of the first largest planar surface of the substrate attach portion. The substrate opening may be configured to receive a perimeter of a substrate therein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">18:引線架面板</p>  
        <p type="p">20:晶粒附接墊/基材附接部分</p>  
        <p type="p">22:引線</p>  
        <p type="p">24:第一最大平坦表面</p>  
        <p type="p">26:基材開口</p>  
        <p type="p">28:第二最大平坦表面</p>  
        <p type="p">30:周長</p>  
        <p type="p">32:聯結桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="994" publication-number="202626905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自聚矽氧烷黏著劑廢料回收熱導性填料之方法</chinese-title>  
        <english-title>METHOD FOR RECYCLING THERMALLY CONDUCTIVE FILLERS FROM SILICONE ADHESIVE WASTES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08J11/08</main-classification>  
        <further-classification edition="201801120260323B">C08K3/013</further-classification>  
        <further-classification edition="202201120260323B">B09B3/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢高股份有限及兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種自聚矽氧烷黏著劑廢料回收熱導性填料之方法，其包括以下步驟：a)將該等聚矽氧烷黏著劑廢料浸泡於溶劑中，b)對自上述獲得之混合物實施超音波振動，c)使用醇洗滌所得溶液，及d)乾燥該等填料。本發明亦提供藉由該方法獲得之熱導性填料及包括該等熱導性填料之聚矽氧烷黏著劑組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for recycling thermally conductive fillers from silicone adhesive wastes, comprising steps of: a) soaking the silicone adhesive wastes in a solvent, b) conducting an ultrasonic vibration as to the mixture obtained from the above, c) washing off the resultant solution with an alcohol, and d) drying the fillers. The present invention also provides thermally conductive fillers obtained by the method, and a silicone adhesive composition comprising the thermally conductive fillers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="995" publication-number="202628630"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628630.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於具有組合源極與井接觸之電晶體之方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR TRANSISTOR WITH COMBINED SOURCE AND WELL CONTACT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D30/65</main-classification>  
        <further-classification edition="202501120260302B">H10D84/82</further-classification>  
        <further-classification edition="202501120260302B">H10D30/01</further-classification>  
        <further-classification edition="202601120260302B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商達爾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIODES INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德里斯科爾　珍妮佛　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRISCOLL, JENNIFER A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示之一種金屬氧化物半導體(MOS)電晶體包含：一基板，其包含一井區；一絕緣體層，其耦合至該基板；以及一源極，其包含一源極區、穿過該絕緣體層及該源極區之一源極觸點，以及安置於該井區中之一歐姆觸點。該MOS電晶體亦包含：一閘極區，其包含一閘極絕緣體層及一閘極觸點；以及一汲極，其包含一汲極區及穿過該絕緣體層通至該汲極區之一汲極觸點。該MOS電晶體可係一LDMOS電晶體，例如，一LNDMOS或LPDMOS電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metal-oxide-semiconductor (MOS) transistor includes a substrate including a well region, an insulator layer coupled to the substrate, and a source including a source region, a source contact passing through the insulator layer and the source region, and an ohmic contact disposed in the well region. The MOS transistor also includes a gate region including a gate insulator layer and a gate contact and a drain including a drain region and a drain contact passing through the insulator layer to the drain region. The MOS transistor can be an LDMOS transistor, for example, an LNDMOS or LPDMOS transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:橫向擴散式金屬氧化物半導體電晶體</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:井區</p>  
        <p type="p">104:源極區</p>  
        <p type="p">105:基板平面</p>  
        <p type="p">106:汲極區</p>  
        <p type="p">108:矽化物層</p>  
        <p type="p">110:絕緣體層</p>  
        <p type="p">120:源極觸點</p>  
        <p type="p">122:源極觸點襯裡</p>  
        <p type="p">124:源極觸點插塞</p>  
        <p type="p">130:閘極區</p>  
        <p type="p">132:閘極觸點</p>  
        <p type="p">134:經輕摻雜汲極源極</p>  
        <p type="p">138:閘極氧化物絕緣體層</p>  
        <p type="p">140:汲極觸點</p>  
        <p type="p">142:汲極觸點襯裡</p>  
        <p type="p">144:汲極觸點插塞</p>  
        <p type="p">147:第一預定距離</p>  
        <p type="p">148:歐姆觸點</p>  
        <p type="p">149:第二預定距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="996" publication-number="202627434"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627434.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>面壓顯示裝置、面壓顯示方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G01L5/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島誠人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之面壓顯示裝置具備：接收部，其從通至搬送基板之搬送路徑之面壓測定工具接收檢測資料；及運算部，其基於檢測資料計算對基板賦予之面壓；運算部根據基於接收部所接收到之檢測資料之時間變化算出之搬送速度，對於複數個壓力檢測部之沿搬送路徑之寬度方向排列之各行，特定出在互不相同之各時刻的搬送方向之位置，將在各時刻特定出之各行之檢測信號按照搬送方向之位置之順序重新排列，並基於與搬送方向之位置對應之各行之檢測信號而產生面壓圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">t:時間</p>  
        <p type="p">t&lt;sub&gt;1&lt;/sub&gt;,t&lt;sub&gt;2&lt;/sub&gt;,t&lt;sub&gt;3&lt;/sub&gt;:取樣時間</p>  
        <p type="p">x:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="997" publication-number="202627576"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627576.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件保持方法及保持機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250414B">G02B6/36</main-classification>  
        <further-classification edition="200601120250414B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉恒惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭育昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種保持機構，適用於保持一光纖陣列元件，該光纖陣列元件設有一光耦部、一插座部、及連接於該光耦部與該插座部之間的一光纖部，該保持機構設有一保持組件。該保持組件設有一保持件。該保持件設有一第一保持部，及與該第一保持部相隔間距的一第二保持部，該第一保持部適用於保持該光纖陣列元件的該光耦部，該第二保持部適用於保持該光纖陣列元件的該插座部。利用上述設計，該保持組件能穩固地保持該光纖陣列元件。本發明還供一種元件保持方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支架</p>  
        <p type="p">12:氣道</p>  
        <p type="p">13:支架連接部</p>  
        <p type="p">2:保持組件</p>  
        <p type="p">3:對接組件</p>  
        <p type="p">4:驅動組件</p>  
        <p type="p">5:固化組件</p>  
        <p type="p">501:第一固化件</p>  
        <p type="p">502:第二固化件</p>  
        <p type="p">d1:第一方向</p>  
        <p type="p">d2:第二方向</p>  
        <p type="p">d3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="998" publication-number="202627581"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627581.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保持機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G02B6/42</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉恒惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭育昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種保持機構，適用於保持一光纖陣列元件並設有一保持組件及一對接組件。該保持組件設有可保持該光纖陣列元件的一保持件。該對接組件設有與一量測單元連結的一對接件。該對接件可與該保持件間作相對移動而選擇性地與該光纖陣列元件對接或不對接。利用上述設計，該對接組件能選擇性地與該光纖陣列元件對接或不對接，利於量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支架</p>  
        <p type="p">12:氣道</p>  
        <p type="p">13:支架連接部</p>  
        <p type="p">2:保持組件</p>  
        <p type="p">3:對接組件</p>  
        <p type="p">4:驅動組件</p>  
        <p type="p">5:固化組件</p>  
        <p type="p">501:第一固化件</p>  
        <p type="p">502:第二固化件</p>  
        <p type="p">d1:第一方向</p>  
        <p type="p">d2:第二方向</p>  
        <p type="p">d3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="999" publication-number="202626914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>填料及樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250426B">C08K3/013</main-classification>  
        <further-classification edition="201801120250426B">C08K3/105</further-classification>  
        <further-classification edition="200601120250426B">C08K3/26</further-classification>  
        <further-classification edition="200601120250426B">C08K3/34</further-classification>  
        <further-classification edition="202201120250426B">C01F7/785</further-classification>  
        <further-classification edition="200601120250426B">C01B39/18</further-classification>  
        <further-classification edition="202201120250426B">C01F7/022</further-classification>  
        <further-classification edition="200601120250426B">B29B7/30</further-classification>  
        <further-classification edition="200601120250426B">C08K5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＧＸ　ＭＩＮＥＲＡＬＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GX MINERALS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田隆男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永田員也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種填料，包含縱橫比（中值粒徑/平均厚度）為8以上的極性板狀粉末及所述縱橫比為18以上的非極性板狀粉末，相對於所述極性板狀粉末及非極性板狀粉末的合計而言的所述非極性板狀粉末的含量為10質量%～90質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1000" publication-number="202628671"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628671.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置和其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202601120260327B">H10D84/01</further-classification>  
        <further-classification edition="202601120260327B">H10B80/00</further-classification>  
        <further-classification edition="201101120260327B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一實施例中，半導體裝置包括複數個第一奈米結構在複數個第一源極/汲極區之間延伸、複數個第二奈米結構在第一奈米結構上方且在複數個第二源極/汲極區之間延伸、第一閘極堆疊圍繞第一奈米結構、第二閘極堆疊在第一閘極堆疊上方且設置在第二奈米結構周圍，其中第二閘極堆疊的第一部分設置在第二奈米結構上方、複數個閘極間隔物在第二閘極堆疊的第一部分的複數個側壁上方、以及第一金屬接觸件物理性接觸第二源極/汲極區中的第一源極/汲極區，其中氣隙設置在第一金屬接觸件的側壁和閘極間隔物的第一閘極間隔物的側壁之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a semiconductor device includes a plurality of first nanostructures, the plurality of first nanostructures extending between first source/drain regions, a plurality of second nanostructures over the plurality of first nanostructures, the plurality of second nanostructures extending between second source/drain regions, a first gate stack around the plurality of first nanostructures, a second gate stack over the first gate stack and disposed around the plurality of second nanostructures, where a first portion of the second gate stack is disposed above the plurality of second nanostructures, gate spacers on sidewalls of the first portion of the second gate stack, and a first metal contact that is in physical contact with a first source/drain region of the second source/drain regions, where an air-gap is disposed between a sidewall of the first metal contact and a sidewall of a first gate spacer of the gate spacers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">66L:下半導體奈米結構</p>  
        <p type="p">66M:中半導體奈米結構</p>  
        <p type="p">66U:上半導體奈米結構</p>  
        <p type="p">90:閘極間隔物</p>  
        <p type="p">95:第一區</p>  
        <p type="p">97:第二區</p>  
        <p type="p">98:內部間隔物</p>  
        <p type="p">99:第三區</p>  
        <p type="p">100:隔離結構</p>  
        <p type="p">108L:下磊晶源極/汲極區</p>  
        <p type="p">108U:上磊晶源極/汲極區</p>  
        <p type="p">112:第一接觸蝕刻停止層</p>  
        <p type="p">114:第一層間介電</p>  
        <p type="p">126:蝕刻停止層</p>  
        <p type="p">120:半導體裝置</p>  
        <p type="p">128:第三層間介電</p>  
        <p type="p">132:閘極介電</p>  
        <p type="p">134L:下閘極電極</p>  
        <p type="p">134U:上閘極電極</p>  
        <p type="p">137:保護層</p>  
        <p type="p">140:間隔物</p>  
        <p type="p">142:金屬半導體合金區</p>  
        <p type="p">144:金屬接觸件</p>  
        <p type="p">146:氣隙</p>  
        <p type="p">149:位元線</p>  
        <p type="p">150:介電層</p>  
        <p type="p">151:蝕刻停止層</p>  
        <p type="p">152:接觸穿孔</p>  
        <p type="p">154:蝕刻停止層</p>  
        <p type="p">156:層間介電</p>  
        <p type="p">162:間隔物</p>  
        <p type="p">164:金屬半導體合金區</p>  
        <p type="p">166:金屬接觸件</p>  
        <p type="p">168:氣隙</p>  
        <p type="p">170:介電層</p>  
        <p type="p">172:導電線</p>  
        <p type="p">174:介電層</p>  
        <p type="p">176:導電線</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">W3:寬度</p>  
        <p type="p">W4:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1001" publication-number="202626224"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626224.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉印型片狀接合材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260324B">B22F1/10</main-classification>  
        <further-classification edition="202201120260324B">B22F1/054</further-classification>  
        <further-classification edition="200601120260324B">B22F7/08</further-classification>  
        <further-classification edition="200601120260324B">H01B1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大陽日酸股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO NIPPON SANSO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三好健太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOSHI, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山脇直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAWAKI, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高田克則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKADA, KATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五十嵐弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARASHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種轉印型片狀接合材，其（I）即便在不進行銅粒子的燒結的緩慢的轉印條件下亦可獲得優異的轉印性，且（II）即便為250℃以下的低溫接合亦可穩定地確保充分的接合強度。一種轉印型片狀接合材，為將包含銅粒子、還原劑、樹脂及溶媒的糊劑塗佈於樹脂基板上並進行乾燥而成的糊劑乾燥膜，其特徵在於，具有0.5質量%以上且2.0質量%以下的溶媒含液率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1002" publication-number="202626178"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626178.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱交換器及使用其之排氣處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250510B">B01D53/34</main-classification>  
        <further-classification edition="200601120250510B">B01D53/46</further-classification>  
        <further-classification edition="200601120250510B">F23G7/06</further-classification>  
        <further-classification edition="200601120250510B">F23J15/08</further-classification>  
        <further-classification edition="200601120250510B">H05B3/40</further-classification>  
        <further-classification edition="200601120250510B">H05B3/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商康肯環保設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANKEN TECHNO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今村啟志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAMURA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所欲解決的問題在於提供一種即便在排熱回收的對象氣體是腐蝕性極高的氣體中也能夠長期間連續且穩定地進行熱回收之熱交換器及使用這種熱交換器之排氣處理裝置。為了解決此問題，本發明的熱交換器，其特徵在於具備：阻隔壁板(14)，由耐火澆注料構成，以低溫側流體(LF)和高溫側流體(HF)成為逆向流的方式劃分殼體(12)內；及，實心的導熱棒材(16)，由自氧化鋁、氧化鋯、碳化矽、氮化矽、矽化鉬及亞鉻酸鑭構成的群選出至少一種的陶瓷構成；複數個導熱棒材(16)，配設為氣密地貫穿上述阻隔壁板(14)的表面和背面且橫跨低溫側流體(LF)的流路和高溫側流體(HF)的流路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:熱交換器</p>  
        <p type="p">12:殼體</p>  
        <p type="p">14:阻隔壁板</p>  
        <p type="p">16:導熱棒材</p>  
        <p type="p">LF:低溫側流體</p>  
        <p type="p">HF:高溫側流體</p>  
        <p type="p">E:排氣</p>  
        <p type="p">T:(阻隔壁板的)厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1003" publication-number="202626392"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626392.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251204B">B60L53/56</main-classification>  
        <further-classification edition="201901120251204B">B60L50/30</further-classification>  
        <further-classification edition="201901120251204B">B60L50/60</further-classification>  
        <further-classification edition="201901120251204B">B60L58/18</further-classification>  
        <further-classification edition="201901120251204B">B60L58/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甲斐尚任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤慶泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YOSHIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甲斐尚任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電動車輛，能夠通過車輛的行駛對副電池進行充電，當主電池蓄電容量減少時能夠從主電池切換到副電池而繼續行駛。本發明的電動車輛具備：驅動用電機，使驅動輪旋轉；發電用電機，通過從動輪的旋轉來發電；主電池，向驅動用電機供給電力；副電池，能夠儲存發電用電機發電的電力；電池狀態檢測部，測量主電池和副電池的剩餘電量；切換開關，在主電池和副電池之間切換向驅動用電機的供電；以及斷路開關，切斷向副電池的充電，當所述主電池的電力由於車輛的行駛而變得比閾值小時，通過斷路開關切斷向副電池的充電，並且切換開關從主電池切換到副電池。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:前輪</p>  
        <p type="p">2:後輪</p>  
        <p type="p">3:主體</p>  
        <p type="p">4:發電用電機</p>  
        <p type="p">5:驅動用電機</p>  
        <p type="p">6:主電池</p>  
        <p type="p">7:副電池</p>  
        <p type="p">22:警告燈</p>  
        <p type="p">23:警告燈</p>  
        <p type="p">100:電動車輛</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1004" publication-number="202627342"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627342.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管路的止水機構</chinese-title>  
        <english-title>PIPE LEAK PREVENTION MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">F16L25/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本維克利克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE VICTAULIC COMPANY OF JAPAN LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森川幸典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIKAWA, YUKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸伸晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHI, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於對橡膠圈33進行保持的分割殼體30A、分割殼體30B不沿軸線方向脫離。在第一凸緣11A的第一螺栓開口13及第二凸緣12A的第二螺栓開口14插入螺栓15，利用螺母16將螺栓15緊固。螺栓側墊圈21的止擋墊圈22及螺母側墊圈25的止擋墊圈26分別與分割殼體30A、分割殼體30B的側面32卡合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To prevent axial detachment of divided housings 30A, 30B that hold a rubber ring 33. A bolt 15 is inserted into a first bolt hole 13 of a first flange 11A and a second bolt hole 14 of a second flange 12A, and the bolt is tightened by a nut 16. A stopper washer 22 of a bolt-side washer 21 and a stopper washer 26 of a nut-side washer 25 are respectively engaged with side surfaces 32 of divided housings 30A, 30B.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:管路的止水機構</p>  
        <p type="p">12:第二管路</p>  
        <p type="p">15:螺栓</p>  
        <p type="p">15b:螺栓軸部</p>  
        <p type="p">16:螺母</p>  
        <p type="p">26:止擋墊圈</p>  
        <p type="p">30A、30B:分割殼體</p>  
        <p type="p">31:外周面</p>  
        <p type="p">32:側面</p>  
        <p type="p">33:橡膠圈</p>  
        <p type="p">35:連結螺栓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1005" publication-number="202626200"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626200.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>亞氧化氮分解觸媒之製造方法及亞氧化氮分解觸媒</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B01J37/03</main-classification>  
        <further-classification edition="200601120260323B">B01J37/08</further-classification>  
        <further-classification edition="200601120260323B">B01J23/755</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科納維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADEVIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水香奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, KANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庄野恵美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHONO, EMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西亜美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, TSUGUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井一輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日数谷進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIKAZUDANI, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日野尚荣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINO, NAOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西田侑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIDA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤岡公一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIOKA, KOHICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">對排氣中的亞氧化氮進行分解的亞氧化氮分解觸媒之製造方法包括製備步驟，所述製備步驟中製備包含含有下述式（1）所表示的複合金屬氧化物的活性成分以及含有鹼金屬元素的不純成分的生成物，在製備步驟中，藉由使用包含鹼金屬元素的共沈澱劑的共沈澱法，製備包含活性成分以及不純成分的生成物。另外，在生成物中，相對於活性成分以及不純成分的主元素總量而言的鹼金屬元素的含有比例為0.45質量%以上且4.50質量%以下。&lt;br/&gt;&lt;br/&gt;Ni&lt;sub&gt;X&lt;/sub&gt;A&lt;sub&gt;1&lt;/sub&gt;-&lt;sub&gt;X&lt;/sub&gt;Co&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;4&lt;/sub&gt;（1）&lt;br/&gt;&lt;br/&gt;（式（1）中，A是選自由Fe、Mn、Ce、Zr、La及鹼土金屬所組成的群組中的至少一者；另外，X超過0且小於1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1006" publication-number="202627773"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627773.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑鼠墊</chinese-title>  
        <english-title>MOUSE PAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250613B">G06F3/039</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXIN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧賀隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉奕辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種滑鼠墊其包含全平面接觸面、接觸板體、導光片體、底座及發光模組。全平面接觸面位於滑鼠墊的側面。滑鼠能於全平面接觸面的任一位置移動。接觸板體的一側面構成全平面接觸面的全部。導光片體位於接觸板體及底座之間。導光片體具有多個導光孔，各個導光孔貫穿導光片體設置。發光模組包含電路板及多個發光單元。電路板位於導光片體及底座之間。多個發光單元設置於電路板，且對應位於多個導光孔中。多個發光單元所發出的光束能通過導光片體的導引，由導光片體的邊緣向外射出。各個發光單元的頂面，被接觸板體遮蔽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This present invention discloses a mouse pad, which comprises a full-plane contact surface, a contact plate, a light-guiding plate, a base, and a light-emitting module. The full-plane contact surface is located on a side of the mouse pad, and a mouse can move over any position of the full-plane contact surface. One side of the contact plate forms the entirety of the full-plane contact surface. The light-guiding plate is disposed between the contact plate and the base. The light-guiding plate is provided with a plurality of light-guiding holes, each penetrating through the light-guiding plate. The light-emitting module includes a circuit board and a plurality of light-emitting units. The circuit board is disposed between the light-guiding plate and the base. The plurality of light-emitting units is disposed on the circuit board and respectively corresponds to the plurality of light-guiding holes. Beams emitted from the light-emitting units pass through and are guided by the light-guiding plate, then exit outwardly from the edges of the light-guiding plate. The top surfaces of the light-emitting units are covered (obscured) by the contact plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:滑鼠墊</p>  
        <p type="p">2:接觸板體</p>  
        <p type="p">2A:全平面接觸面</p>  
        <p type="p">2B:底面</p>  
        <p type="p">3:導光片體</p>  
        <p type="p">3A:頂面</p>  
        <p type="p">3B:底面</p>  
        <p type="p">33:連接器缺口</p>  
        <p type="p">34:遮光件容槽</p>  
        <p type="p">4:發光模組</p>  
        <p type="p">41:電路板</p>  
        <p type="p">43:殼體</p>  
        <p type="p">431:連接口</p>  
        <p type="p">44:充電連接器</p>  
        <p type="p">5:底座</p>  
        <p type="p">51:缺口</p>  
        <p type="p">6:遮光件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1007" publication-number="202626199"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626199.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>亞氧化氮分解觸媒之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B01J37/02</main-classification>  
        <further-classification edition="200601120260323B">B01J37/08</further-classification>  
        <further-classification edition="200601120260323B">B01J23/78</further-classification>  
        <further-classification edition="200601120260323B">B01J23/755</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科納維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADEVIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水香奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, KANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庄野恵美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHONO, EMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西亜美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, TSUGUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">對排氣中的亞氧化氮進行分解的亞氧化氮分解觸媒之製造方法包括：準備步驟；準備包含活性成分、無機黏合劑及分散劑的漿料；以及塗敷步驟，將漿料塗敷於基材。另外，無機黏合劑包含金屬氫氧化物，分散劑包含羧酸及/或水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1008" publication-number="202627688"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627688.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統、投影曝光裝置及投影曝光系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G03F7/20</main-classification>  
        <further-classification edition="200601120260324B">G02B5/10</further-classification>  
        <further-classification edition="200601120260324B">G02B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>學校法人沖繩科學技術大學院大學學園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKINAWA INSTITUTE OF SCIENCE AND TECHNOLOGY SCHOOL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新竹積</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINTAKE, TSUMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光學系統20係配置於遮罩40與晶圓W之間之投影曝光裝置10的光學系統20，其具備：一對第1鏡21，各自受到來自光源31的照明光線L0使之反射至遮罩40；以及投影系統22，其接收在遮罩40反射之反射光L1並引導至晶圓W之鏡的數量為2個；其中投影系統22具有：第2鏡221，鄰接於一對第1鏡21而配置；第3鏡222，相對於第2鏡221配置於晶圓W側且具有與第2鏡221的第1光學面S1相向而對的第2光學面S2；一對第1鏡21之間的中心部C、第2鏡221及第3鏡222位於同一直線上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:投影曝光系統</p>  
        <p type="p">10:投影曝光裝置</p>  
        <p type="p">20:光學系統</p>  
        <p type="p">21:第1鏡</p>  
        <p type="p">22:投影系統</p>  
        <p type="p">221:第2鏡</p>  
        <p type="p">222:第3鏡</p>  
        <p type="p">223:遮光部</p>  
        <p type="p">30:照明系統</p>  
        <p type="p">31:光源</p>  
        <p type="p">32:收集鏡</p>  
        <p type="p">33:準直器</p>  
        <p type="p">34:透明窗</p>  
        <p type="p">35:第4鏡</p>  
        <p type="p">36:線掃描狹縫</p>  
        <p type="p">40:遮罩</p>  
        <p type="p">F:焦點面</p>  
        <p type="p">IF:中間焦點</p>  
        <p type="p">L0:照明光線</p>  
        <p type="p">L1:反射光</p>  
        <p type="p">S1:第1光學面</p>  
        <p type="p">S2:第2光學面</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1009" publication-number="202627009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏合片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260324B">C09J7/30</main-classification>  
        <further-classification edition="201801120260324B">C09J7/40</further-classification>  
        <further-classification edition="201901120260324B">B32B7/06</further-classification>  
        <further-classification edition="201901120260324B">B32B7/022</further-classification>  
        <further-classification edition="200601120260324B">C09J11/08</further-classification>  
        <further-classification edition="200601120260324B">C09J133/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商日東電工(上海松江)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO (SHANGHAI SONGJIANG) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁坤遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, KUNYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉村敏正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMURA, TOSHIMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種黏合片。本發明的黏合片具有優良的黏合性、經時霧度穩定性、防靜電性、貼合保存性及耐溫性，並且在使用之後可容易剝離而不產生殘膠污染。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基材層</p>  
        <p type="p">10B:第二面</p>  
        <p type="p">20:黏著劑層</p>  
        <p type="p">30:離型膜</p>  
        <p type="p">30A:第五面</p>  
        <p type="p">100:黏合片捲繞體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1010" publication-number="202627993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移動裝置</chinese-title>  
        <english-title>MOBILE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">G06T11/60</main-classification>  
        <further-classification edition="202601120260302B">G06T11/00</further-classification>  
        <further-classification edition="202401120260302B">G06T3/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉軒銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XUANMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張一凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YIFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王飛虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FEIHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚嘉祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, JIAQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯妍君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YENCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於一種移動裝置，其中的影像處理電路電性連接至兩個匯流排。處理器透過第二匯流排傳送指令給影像處理電路，此指令用以指示對輸入影像執行影像處理程序，影像處理程序包含幾何變換程序與混和程序。在接收到指令以後，影像處理電路用以根據輸出像素的座標計算出輸入像素的座標，藉此透過第一匯流排從記憶體讀取輸入像素。影像處理電路還用以執行影像處理程序並透過第一匯流排將輸出像素寫入至記憶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a mobile device in which an image processing circuit is electrically connected to two buses. A processor sends an instruction to the image processing circuit through the second bus. The instruction indicates execution of an image processing procedure, including a geometric transformation process and a blending process, on input images. Upon receiving the instruction, the image processing circuit calculates the coordinates of input pixels based on the coordinate of an output pixel, thereby reading the input pixels from a memory through the first bus. The image processing circuit also executes the image processing procedure and writes the output pixel into the memory through the first bus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:移動裝置</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:第一匯流排</p>  
        <p type="p">130:橋接器</p>  
        <p type="p">140:第二匯流排</p>  
        <p type="p">150:非同步橋接器</p>  
        <p type="p">160:顯示器控制器</p>  
        <p type="p">170:影像處理電路</p>  
        <p type="p">181~183:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1011" publication-number="202626438"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626438.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>海下錨及錨定</chinese-title>  
        <english-title>SUBSEA ANCHOR AND ANCHORING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B63B21/26</main-classification>  
        <further-classification edition="200601120260327B">E02D27/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商文特拉有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENTERRA LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史藍達密　盧茲貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRANDAMI, ROOZBEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉迪尼　法布里茲歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARDINI, FABRIZIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑟斯洋桑　因卓賽南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THUSYANTHAN, INDRASENAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種提供至少一個固定支撐件之方法、用於固定浮式平台之設備，及一種提供海下錨之方法。用於將浮式平台固定於相對於海下海底表面之所要相對位置處之該設備包括：複數個固定支撐件，其等經由以預定型樣打入海下海底表面中之各別複數個摩擦樁部件之突出自由端區域提供；及錨體部件，其包括基座、各經安置以接納各別固定支撐件之自由端區域之複數個護套元件，及各用於連接至至少一條繫泊索之至少一個連接元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of providing at least one fixation support, apparatus for securing a floating platform, and a method of providing a subsea anchor are disclosed. The apparatus for securing a floating platform at a desired relative position with respect to a subsea seafloor surface comprises a plurality of fixation supports provided via protruding free end regions of a respective plurality of friction pile members driven into a subsea seafloor surface in a predetermined pattern; and an anchor body member comprising a base, a plurality of sheath elements each disposed to receive a free end region of a respective fixation support and at least one connection element each for connecting to at least one mooring line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:離岸位置/離岸環境</p>  
        <p type="p">105:海底/海床</p>  
        <p type="p">300&lt;sub&gt;1&lt;/sub&gt;:錨</p>  
        <p type="p">300&lt;sub&gt;2&lt;/sub&gt;:錨</p>  
        <p type="p">322&lt;sub&gt;1&lt;/sub&gt;:連接元件</p>  
        <p type="p">322&lt;sub&gt;2&lt;/sub&gt;:連接元件</p>  
        <p type="p">910:浮式平台/結構</p>  
        <p type="p">920:海面/表面</p>  
        <p type="p">930&lt;sub&gt;1&lt;/sub&gt;:纜繩</p>  
        <p type="p">930&lt;sub&gt;2&lt;/sub&gt;:纜繩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1012" publication-number="202627555"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627555.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114446</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片結構及包括晶片結構之半導體封裝</chinese-title>  
        <english-title>CHIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G02B6/12</main-classification>  
        <further-classification edition="202601120260317B">H10W70/62</further-classification>  
        <further-classification edition="202601120260317B">H10W90/22</further-classification>  
        <further-classification edition="200601120260317B">G02B6/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JING CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張容華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JUNG HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所提供者為一種晶片結構，其包括：一重佈結構；一電子積體電路晶片，其在該重佈結構之一上表面上；以及一光子積體電路晶片，其包括：一第一基體，其在該電子積體電路晶片之一上表面上，且包含一主動表面及與該主動表面相對之一非主動表面；一第一反射器，其在該第一基體之該非主動表面上；以及一第一佈線結構，其在該第一基體之該主動表面上，該第一佈線結構包含一波導、一光柵耦接器及一第二反射器， 其中該光柵耦接器之一圖案化表面面對該重佈結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a chip structure including a redistribution structure, an electronic integrated circuit chip on an upper surface of the redistribution structure, and a photonic integrated circuit chip including a first substrate on an upper surface of the electronic integrated circuit chip and comprising an active surface and an inactive surface opposite to the active surface, a first reflector on the inactive surface of the first substrate, and a first wiring structure on the active surface of the first substrate, the first wiring structure comprising a waveguide, a grating coupler, and a second reflector, wherein a patterned surface of the grating coupler faces the redistribution structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:晶片結構</p>  
        <p type="p">200_S1,231_S1:第一側表面</p>  
        <p type="p">200_S2,231_S2:第二側表面</p>  
        <p type="p">210:重佈結構</p>  
        <p type="p">220:電子積體電路(EIC)晶片，EIC晶片</p>  
        <p type="p">221:第二基體</p>  
        <p type="p">221_A,231_A:主動表面</p>  
        <p type="p">221_V:第二貫通孔</p>  
        <p type="p">222:第二佈線結構</p>  
        <p type="p">2221:第二佈線圖案</p>  
        <p type="p">2221_L:第二佈線線</p>  
        <p type="p">2221_V:第二佈線通孔</p>  
        <p type="p">2222:第二佈線絕緣層</p>  
        <p type="p">227:上墊</p>  
        <p type="p">230:光子積體電路(PIC)晶片，PIC晶片</p>  
        <p type="p">230_P:光學組件</p>  
        <p type="p">231:第一基體</p>  
        <p type="p">231_L:下表面</p>  
        <p type="p">231_U:上表面</p>  
        <p type="p">231_UA:非主動表面</p>  
        <p type="p">232:波導</p>  
        <p type="p">232_GC:光柵耦接器</p>  
        <p type="p">233:第一反射器</p>  
        <p type="p">234:第二反射器</p>  
        <p type="p">235:第一佈線結構</p>  
        <p type="p">2351:第一佈線圖案</p>  
        <p type="p">2351_L:第一佈線線</p>  
        <p type="p">2351_V:第一佈線通孔</p>  
        <p type="p">2352:第一佈線絕緣層</p>  
        <p type="p">238:下墊</p>  
        <p type="p">240:保護層</p>  
        <p type="p">500:光纖單元</p>  
        <p type="p">510:光纖</p>  
        <p type="p">520:框架</p>  
        <p type="p">AD:光學黏合膜</p>  
        <p type="p">CT2:連接端子</p>  
        <p type="p">GC_P:圖案化表面</p>  
        <p type="p">GC_UP:非圖案化表面</p>  
        <p type="p">ML1:第一模製層</p>  
        <p type="p">RD:重佈絕緣層</p>  
        <p type="p">RL:重佈線</p>  
        <p type="p">RP:重佈圖案</p>  
        <p type="p">RV:重佈通孔</p>  
        <p type="p">TR1:第一溝槽</p>  
        <p type="p">TR1_L:底部</p>  
        <p type="p">TR1_S:側表面</p>  
        <p type="p">X:第一水平方向</p>  
        <p type="p">Y:第二水平方向</p>  
        <p type="p">Z:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1013" publication-number="202627310"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627310.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內循環散熱式風扇</chinese-title>  
        <english-title>INTERNAL CIRCULATION HEAT DISSIPATION FAN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250612B">F04D25/08</main-classification>  
        <further-classification edition="200601120250612B">F04D29/24</further-classification>  
        <further-classification edition="200601120250612B">F04D29/30</further-classification>  
        <further-classification edition="200601120250612B">F04D29/40</further-classification>  
        <further-classification edition="200601120250612B">H02K9/06</further-classification>  
        <further-classification edition="200601120250612B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏偉哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李坤洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王邑銣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, I-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種內循環散熱式風扇，其包括一定子及一葉輪。定子包含一線圈組。葉輪包含一輪轂及環繞輪轂配置的複數扇葉，輪轂具有一內罩殼以及套疊在內罩殼的一外罩殼，線圈組容置在內罩殼內，內罩殼及外罩殼之間形成一內流道，內流道的一側連通內罩殼之內且另一側連通至外罩殼之外，內流道之內設置有複數散熱葉片，該些散熱葉片環列配置且每一散熱葉片上的一側緣連接內罩殼及外罩殼的其中之一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides an internal circulation heat dissipation fan having a stator and an impeller. The impeller has a hub and multiple blades arranged around the hub, the hub having an inner shell and an outer shell sheathing the inner shell, the stator is accommodated in the inner shell, an internal flow channel is defined between the inner shell and the outer shell, the internal flow channel has side communicated to a space in the inner shell and another side communicated to outside of the outer shell, multiple heat dissipation vents are arranged in the internal flow channel and annually disposed. Each heat dissipation vent has two opposite edges respectively connected to the inner shell and the outer shell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:底座</p>  
        <p type="p">110:導流翼</p>  
        <p type="p">200:葉輪</p>  
        <p type="p">201:轉軸</p>  
        <p type="p">202:底部開口</p>  
        <p type="p">204:內流道</p>  
        <p type="p">205:連通口</p>  
        <p type="p">210:輪轂</p>  
        <p type="p">211:內罩殼</p>  
        <p type="p">212:外罩殼</p>  
        <p type="p">2121:外筒</p>  
        <p type="p">2122:頂蓋</p>  
        <p type="p">220:扇葉</p>  
        <p type="p">230:散熱葉片</p>  
        <p type="p">231,232:側緣</p>  
        <p type="p">240:轉子磁圈</p>  
        <p type="p">300:線圈組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1014" publication-number="202627804"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627804.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於多層堆疊半導體裝置之記憶體配對系統及其修復方法</chinese-title>  
        <english-title>MEMORY-PAIRED SYSTEM FOR MULTIPLE STACKED SEMICONDUCTOR DEVICES AND REPAIR METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G06F11/10</main-classification>  
        <further-classification edition="200601120250502B">G11C29/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊達人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, DA-ZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝品秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, PIN-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多層堆疊半導體裝置的記憶體配對系統及其修復方法。記憶體配對系統具有一配對單元，配對單元具有至少兩設計相同的晶片。配對單元的至少兩晶片中各晶片具有用於部署用於修復的記憶體資源的記憶體資源模組和配置以執行記憶體資源分配的配對控制模組，其係當該記憶體資源模組修復該晶片的故障單元的記憶體資源已經被分配時，向該配對單元的該至少兩晶片中的另一晶片發送請求；或根據該配對單元中存在故障單元的晶片的請求，向該配對單元中的該晶片提供該記憶體資源模組的備用記憶體資源，以使該記憶體資源模組的該備用記憶體資源修復該晶片的故障單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a memory-paired system for multiple stacked semiconductor devices and its repair method. The memory-paired system has a paired unit having at least two chips that are identical design. Each of the at least two chips of the paired unit has a memory resources module configured for deploying memory resources for repair and a paired control module configured for executing allocation of memory resources by sending a request to another one chip of the at least two chips of the paired unit when memory resource of the memory resource module that the request points have been allocated, or providing spare memory resource of the memory resource module to one chip of the paired unit based on a request from the one chip that has a failed unit existing, so the spare memory resource of the memory resource module repairs the failed unit of the one chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:晶片1</p>  
        <p type="p">2000:晶片2</p>  
        <p type="p">P:配對單元</p>  
        <p type="p">S201~S205:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1015" publication-number="202627556"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627556.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114864</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路封裝組件和其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND FABRICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G02B6/12</main-classification>  
        <further-classification edition="200601120260327B">G02B6/13</further-classification>  
        <further-classification edition="202601120260327B">H10W70/63</further-classification>  
        <further-classification edition="202601120260327B">H10W70/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泰鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓聯洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, LAN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯蘇　斯帝芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSU, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的實施例提供一種包括光子積體電路裝置及電子積體電路裝置的積體電路封裝組件。光子積體電路裝置包括複數個光子元件。光子元件用以接收來自積體電路封裝組件的第一側的光。電子積體電路裝置自積體電路封裝組件的第二側接合至光子積體電路裝置。第二側與第一側相對。電子積體電路裝置包括含有電路系統的一層，電路系統用以與光子積體電路裝置的光子元件相互作用。電子積體電路裝置亦包括電力輸送網路結構。電子積體電路裝置含有電路系統的一層安置於光子積體電路與電子積體電路的電力輸送網路結構之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit(IC) package assembly includes a photonic integrated circuit(PIC) device and an electronic integrated circuit(EIC) device. The PIC device includes a plurality of photonic components. The photonic components are configured to receive light from a first side of the IC package assembly. The EIC device is bonded to the PIC device from a second side of the IC package assembly. The second side is opposite the first side. The EIC device includes a layer that contains electrical circuitry configured to interact with the photonic components of the PIC device. The EIC device also includes a power delivery network (PDN) structure. The layer is disposed between the PIC and the PDN structure of the EIC.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:積體電路封裝組件</p>  
        <p type="p">310:光子積體電路裝置</p>  
        <p type="p">320:電子積體電路裝置</p>  
        <p type="p">350:光子輸入/輸出結構</p>  
        <p type="p">360:互連結構</p>  
        <p type="p">380:接合膜</p>  
        <p type="p">390:導電通孔/通孔</p>  
        <p type="p">440:側</p>  
        <p type="p">441:側</p>  
        <p type="p">460:層</p>  
        <p type="p">480:接合膜</p>  
        <p type="p">490:導電通孔/通孔</p>  
        <p type="p">530:間隙填充材料</p>  
        <p type="p">550:電力輸送網路結構</p>  
        <p type="p">570:貫穿介電通孔結構</p>  
        <p type="p">580:介電層</p>  
        <p type="p">590:通孔</p>  
        <p type="p">610:導電凸塊</p>  
        <p type="p">710:積體電路晶粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1016" publication-number="202627270"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627270.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雨水處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250911B">E03B3/02</main-classification>  
        <further-classification edition="200601120250911B">E03B3/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商生態工廠有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECO FACTORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上尊宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TAKANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">雨水處理系統(1)，具備：初期雨水分離槽(10)、第1過濾槽(20)、雨水路徑(30)、調整儲存槽(40)、第2過濾槽(50)以及儲水槽(60)。初期雨水分離槽(10)，與用於將積存於建造物的屋頂的雨水排入於道路的側溝槽及河川之上部雨水管(7)及下部雨水管(8)連通。第1過濾槽(20)，將從初期雨水分離槽(10)供給的雨水過濾而生成過濾水。雨水路徑(30)，從初期雨水分離槽(10)往第1過濾槽(20)導入雨水。調整儲存槽(40)，儲存從第1過濾槽(20)供給的過濾水。第2過濾槽(50)，將從第1過濾槽(20)及調整儲存槽(40)供給的過濾水進一步過濾而生成純水。儲水槽(60)，儲存過濾水被進一步過濾所得的純水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雨水處理系統</p>  
        <p type="p">2:過濾水路</p>  
        <p type="p">2A:第1水平部</p>  
        <p type="p">2D:垂直部</p>  
        <p type="p">2F:第4水平部</p>  
        <p type="p">2G:排水垂直部</p>  
        <p type="p">2I:第5水平部</p>  
        <p type="p">2J:第6水平部</p>  
        <p type="p">2K:排水龍頭</p>  
        <p type="p">4:第2過濾槽用閥</p>  
        <p type="p">5:儲水槽用閥</p>  
        <p type="p">6:地表面</p>  
        <p type="p">7:上部雨水管</p>  
        <p type="p">8:下部雨水管</p>  
        <p type="p">10:初期雨水分離槽</p>  
        <p type="p">11:第1垂直水路</p>  
        <p type="p">12:第2垂直水路</p>  
        <p type="p">13:第3垂直水路</p>  
        <p type="p">14:第1垂直水路用閥</p>  
        <p type="p">20:第1過濾槽</p>  
        <p type="p">22B:外部連通端部</p>  
        <p type="p">23:排放龍頭</p>  
        <p type="p">24:基礎支架</p>  
        <p type="p">30:雨水路徑</p>  
        <p type="p">40:調整儲存槽</p>  
        <p type="p">41:過濾水導出入口</p>  
        <p type="p">50:第2過濾槽</p>  
        <p type="p">58:上端位置線</p>  
        <p type="p">60:儲水槽</p>  
        <p type="p">61:取水路</p>  
        <p type="p">62:取水龍頭</p>  
        <p type="p">70:溢流水路</p>  
        <p type="p">71:循環路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1017" publication-number="202628932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置以及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P72/76</main-classification>  
        <further-classification edition="202601120260323B">H10P72/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田文彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, FUMIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於：一邊以能充分承受基板的旋轉之吸附力來吸附保持基板，一邊藉由處理液進行處理。針對上述課題之解決手段，在本發明中，夾具本體的吸附區域係被襯墊的環狀彈性部所圍繞。在基板的下表面中央與夾具本體的吸附區域抵接之前，環狀彈性部係一邊圍繞著基板的下表面中央一邊追隨變形而密接於基板的下表面。如此一來，變得不易發生吸附洩漏，在無翹曲的情形時當然能藉由吸附區域來吸附保持基板，即便有翹曲也能藉由吸附區域來吸附保持基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:自轉基座(夾具本體)</p>  
        <p type="p">25:自轉軸</p>  
        <p type="p">50:襯墊</p>  
        <p type="p">51:外嵌部</p>  
        <p type="p">52:環狀彈性部</p>  
        <p type="p">212:吸附溝</p>  
        <p type="p">213:吸附區域</p>  
        <p type="p">HP0:剛搬入後之基板的高度位置</p>  
        <p type="p">HP1:環狀彈性部剛抵接後之基板的高度位置</p>  
        <p type="p">S:基板</p>  
        <p type="p">Sb:(基板的)下表面</p>  
        <p type="p">Sf:(基板的)上表面</p>  
        <p type="p">SP:圍起的空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1018" publication-number="202628691"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628691.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電放電（ESD）保護電路及其操作方法</chinese-title>  
        <english-title>ELECTROSTATIC DISCHARGE (ESD) PROTECTION CIRCUIT AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250604B">H10D89/60</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台積電（中國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳煥能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUAN-NENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李紹宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHAO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳村村</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CUNCUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及靜電放電（ESD）保護電路及其操作方法。積體電路包括耦合在第一節點和第二節點之間的緩衝器電路、耦合到緩衝器電路的輸入/輸出（IO）焊墊、耦合在IO焊墊和第二節點之間的第一箝位電路以及耦合在IO焊墊和第一節點之間的第二箝位電路。緩衝器電路被配置為向IO焊墊輸出第一信號。第一箝位電路被配置為箝位在IO焊墊或第二節點處的第一靜電放電（ESD）事件。第二箝位電路被配置為箝位在IO焊墊或第一節點處的第二ESD事件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a buffer circuit coupled between a first node and a second node, an input/output (IO) pad coupled to the buffer circuit, a first clamp circuit coupled between the IO pad and the second node, and a second clamp circuit coupled between the IO pad and the first node. The buffer circuit is configured to output a first signal to the IO pad. The first clamp circuit is configured to clamp a first electrostatic discharge (ESD) event at the IO pad or the second node. The second clamp circuit is configured to clamp a second ESD event at the IO pad or the first node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:積體電路</p>  
        <p type="p">102:內部電路</p>  
        <p type="p">104:電壓源節點</p>  
        <p type="p">106:參考電壓源節點</p>  
        <p type="p">108:輸入/輸出焊墊</p>  
        <p type="p">109:電壓源軌</p>  
        <p type="p">110:標頭電路</p>  
        <p type="p">112:電力箝位器</p>  
        <p type="p">114:電力箝位器</p>  
        <p type="p">116:緩衝器電路</p>  
        <p type="p">120以及130:ESD箝位器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1019" publication-number="202628672"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628672.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202601120260327B">H10D84/01</further-classification>  
        <further-classification edition="202601120260327B">H10P50/20</further-classification>  
        <further-classification edition="202601120260327B">H10P14/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張廷祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖書翎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SHU LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林頌恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SUNG-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李資良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TZE-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述一種半導體裝置結構以及其形成方法。此結構包括與基板部分相鄰設置的第一半導體層及設置在第一半導體層上的第二半導體層。第一半導體層與第二半導體層彼此不同。結構進一步包括設置在第二半導體層上的介電層、設置在介電層上的源極/汲極區、設置在源極/汲極區上方的層間介電層、及穿過層間介電層設置的第一導電特徵。第一導電特徵電連接至源極/汲極區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device structure, along with methods of forming such, are described. The structure includes a first semiconductor layer disposed adjacent a substrate portion and a second semiconductor layer disposed on the first semiconductor layer. The first and second semiconductor layers are distinct from each other. The structure further includes a dielectric layer disposed on the second semiconductor layer, a source/drain region disposed on the dielectric layer, an interlayer dielectric layer disposed over the source/drain region, and a first conductive feature disposed through the interlayer dielectric layer. The first conductive feature is electrically connected to the source/drain region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構/半導體裝置</p>  
        <p type="p">102:基板部分</p>  
        <p type="p">104:半導體層堆疊</p>  
        <p type="p">106:半導體層/第一半導體層</p>  
        <p type="p">108:第二半導體層</p>  
        <p type="p">150:半導體材料/半導體層</p>  
        <p type="p">154:半導體層</p>  
        <p type="p">156:介電層</p>  
        <p type="p">158:源極/汲極區/S/D區</p>  
        <p type="p">302:N型金屬-氧化物-半導體區/NMOS區</p>  
        <p type="p">304:P型金屬-氧化物-半導體區/PMOS區</p>  
        <p type="p">416:介電間隔物</p>  
        <p type="p">X:X軸</p>  
        <p type="p">Z:Z軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1020" publication-number="202627739"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627739.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運算系統及硬體設備之安裝方法</chinese-title>  
        <english-title>COMPUTING SYSTEM AND METHOD OF MOUNTING HARDWARE EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G06F1/16</main-classification>  
        <further-classification edition="202601120260302B">G06F1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢耀宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSORNG, YAW-TZORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王銘龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MING-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡緯鋼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEI-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種將硬體設備可調節地安裝至安裝結構之安裝裝置。安裝裝置可包含耦合於可安裝之硬體設備之至少一側的一或多個軌道，其中此一或多個軌道中之每一者包含具有一或多個止動表面的數個位置止動部；一或多個安裝耳，每個安裝耳包含安裝插銷；以及包含一或多個閂鎖固持件的閂鎖。閂鎖可配置以使此一或多個閂鎖固持件與一或多個止動表面接合，而固定可安裝之硬體設備的位置。透過對閂鎖施加壓力，閂鎖可壓縮且可滑動到所需之安裝深度。當壓力釋放時，閂鎖可在垂直方向上展開並將閂鎖固持件與止動表面接合，以將硬體固定就位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mounting device for adjustably mounting hardware equipment to a mounting structure is provided. The mounting device may include one or more rails coupled to at least one side of the mountable hardware equipment, wherein each of the one or more rails includes a plurality of position stops with one or more stop surfaces; one or more mounting ears that each comprise a mounting pin; and a latch comprising one or more latch holders. The latch may be configured to cause the one or more latch holders to interface with the one or more stop surfaces, arresting the position of the mountable hardware equipment. By applying pressure to the latch, it can compress and slide to a desired installation depth. When pressure is released, the latch can expand in a vertical direction and engage the latch holders with the stop surfaces to fix the hardware in position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:硬體設備</p>  
        <p type="p">104:安裝結構</p>  
        <p type="p">106:安裝柱</p>  
        <p type="p">108:安裝耳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1021" publication-number="202626972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆蓋有聚矽氧樹脂之聚矽氧彈性體粒子及其製造方法、以及有機樹脂用添加劑及其他用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C08L83/07</main-classification>  
        <further-classification edition="200601120260324B">C08L83/05</further-classification>  
        <further-classification edition="200601120260324B">C08L63/00</further-classification>  
        <further-classification edition="202001120260324B">C08J7/04</further-classification>  
        <further-classification edition="200601120260324B">C09D183/07</further-classification>  
        <further-classification edition="200601120260324B">C09D183/05</further-classification>  
        <further-classification edition="200601120260324B">C09D163/00</further-classification>  
        <further-classification edition="202601120260324B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商陶氏東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOW TORAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤　大淵萌萌子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO OFUCHI, MOMOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早田達央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUDA, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口裕子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, HIROKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀誠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORI, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種覆蓋有聚矽氧樹脂之聚矽氧彈性體粒子，其係包含聚矽氧彈性體粒子、及覆蓋該聚矽氧彈性體粒子表面之一部分或全部之聚矽氧樹脂覆蓋層的覆蓋有聚矽氧樹脂之聚矽氧彈性體粒子， &lt;br/&gt;前述聚矽氧彈性體粒子具有至少兩個矽原子藉由碳數2至20之矽伸烷基交聯之結構， &lt;br/&gt;前述聚矽氧樹脂覆蓋層包含由選自 &lt;br/&gt;i)      由R&lt;sub&gt;3&lt;/sub&gt;SiO&lt;sub&gt;1/2&lt;/sub&gt;（R為一價有機基）表示之M矽氧烷單元； &lt;br/&gt;ii)     由R&lt;sub&gt;2&lt;/sub&gt;SiO&lt;sub&gt;2/2&lt;/sub&gt;（R為一價有機基）表示之D矽氧烷單元； &lt;br/&gt;iii)    由RSiO&lt;sub&gt;3/2&lt;/sub&gt;（R為一價有機基）表示之T矽氧烷單元；及 &lt;br/&gt;iv)    由SiO&lt;sub&gt;4/2&lt;/sub&gt;表示之Q矽氧烷單元 &lt;br/&gt;中之一種或兩種以上之組合構成之聚矽氧樹脂中選擇之一種以上的聚矽氧樹脂（但不包括僅由T矽氧烷單元構成之聚矽氧樹脂）， &lt;br/&gt;前述聚矽氧樹脂於該聚矽氧樹脂之i)至iii)之矽氧烷單元中選擇之矽氧烷單元中具有含環氧基之烴基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1022" publication-number="202628521"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628521.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃基板塞孔夾具系統</chinese-title>  
        <english-title>A GLASS SUBSTRATE PLUGGING FIXTURE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">H05K7/12</main-classification>  
        <further-classification edition="202601120260302B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市深逸通電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄俊祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種玻璃基板塞孔夾具系統，包括擋邊夾具模組、下擋邊模組和滑動夾板模組，擋邊夾具模組包括擋邊元件、機架元件和夾緊元件，夾緊元件設置在機架元件上，擋邊元件設置在夾緊元件上，擋邊元件包括擋邊框架和彈性夾緊擋邊件，通過彈性夾緊擋邊件，玻璃基板固定在擋邊框架上，通過夾緊元件夾緊擋邊框架和驅動彈性夾緊擋邊件夾緊和鬆開玻璃基板，下擋邊模組和滑動夾板模組設置在塞孔機中，下擋邊元件用於夾緊位於擋邊框架上的玻璃基板的下端，滑動夾板模組用於夾緊固定有玻璃基板的擋邊框架的上端。本發明能夠實現對玻璃基板的自動夾緊和固定，提高了加工效率和操作便捷性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass substrate plugging fixture system comprises a side guard fixture module, a lower side guard module and a sliding clamping plate module. The side guard fixture module comprises a side guard element, a frame element and a clamping element. The clamping element is arranged on the frame element, and the side guard element is arranged on the clamping element. The side guard element comprises a side guard frame and an elastic clamping side guard member. The glass substrate is fixed on the side guard frame by means of the elastic clamping side guard member. The side guard frame is clamped by the clamping element and the elastic clamping side guard member is driven to clamp and release the glass substrate. The lower side guard module and the sliding clamping plate module are arranged in a plugging machine. The lower side guard assembly is used for clamping the lower end of the glass substrate located on the side guard frame. The sliding clamping plate module is used for clamping the upper end of the side guard frame to which the glass substrate is fixed. The present invention can realize automatic clamping and fixing of a glass substrate, thereby improving processing efficiency and operating convenience.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:擋邊夾具模組</p>  
        <p type="p">120:機架元件</p>  
        <p type="p">131:大板</p>  
        <p type="p">1312:手扣槽</p>  
        <p type="p">135:回轉夾緊氣缸</p>  
        <p type="p">400:玻璃基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1023" publication-number="202628310"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628310.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充放電控制方法、電路和充放電一體槍</chinese-title>  
        <english-title>CHARGE AND DISCHARGE CONTROL METHOD, CIRCUIT AND CHARGE AND DISCHARGE INTEGRATED GUN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H02J7/04</main-classification>  
        <further-classification edition="201901120250701B">B60L53/14</further-classification>  
        <further-classification edition="201901120250701B">B60L53/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業（江蘇）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY (JIANGSU)CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭龍龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, LONGLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫學銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XUERUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余萬里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WANLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種充放電控制方法、電路和充放電一體槍。充放電控制電路包括第一接口模組、第二接口模組和處理器。充放電控制方法包括：當第一接口模組與電源電連接時，控制車端進入充電模式；控制車端進入充電模式，包括：檢測第一接口模組的訊號端是否有第一PWM訊號；若第一接口模組的訊號端有第一PWM訊號，則控制車端進入充電樁充電模式；若第一接口模組的訊號端無第一PWM訊號，則控制車端進入電網充電模式。本發明實施例提供的技術方案，能夠滿足充電樁充電或電網充電的需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure is related to a charge and discharge control method, circuit and charge and discharge integrated gun. The charge and discharge control circuit includes a first interface module, a second interface module and a processor. The charge and discharge control methods include: when the first interface module is electrically connected to the power supply, the vehicle is controlled to enter the charging mode. The step of the vehicle is controlled to enter the charging mode includes: detecting whether a signal terminal of the first interface module has a first PWM signal; when the signal terminal of the first interface module has the first PWM signal, the vehicle is controlled to enter a charging pile charging mode; when the signal terminal of the first interface module does not have the first PWM signal, the vehicle end is controlled to enter a grid charging mode. The technical solution provided by the embodiment of the disclosure may meet the needs of charging at a charging pile or from the grid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110、120、130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1024" publication-number="202626390"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626390.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充放電控制方法、電路和充放電一體槍</chinese-title>  
        <english-title>CHARGE AND DISCHARGE CONTROL METHOD, CIRCUIT AND CHARGE AND DISCHARGE INTEGRATED GUN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250627B">B60L53/16</main-classification>  
        <further-classification edition="201901120250627B">B60L55/00</further-classification>  
        <further-classification edition="200601120250627B">H02J7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業（江蘇）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY (JIANGSU)CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭龍龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, LONGLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫學銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XUERUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余萬里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WANLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種充放電控制方法、電路和充放電一體槍，充放電控制電路包括第一接口模組、開關模組、第二接口模組和處理器；充放電控制方法包括：檢測第一接口模組的L端、N端的電壓訊號和第二接口模組的L端、N端的電壓訊號；若第一接口模組的L端、N端存在電壓訊號，且第二接口模組的L端、N端不存在電壓訊號，則控制車端進入充電模式；若第一接口模組L端、N端不存在電壓訊號，且第二接口模組的L端、N端存在電壓訊號，則控制車端進入放電模式。本發明實施例提供的技術方案，能夠實現多種充放電方式的兼容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure is related to a charge and discharge control method, circuit and charge and discharge integrated gun. The charge and discharge control circuit includes a first interface module, a switch module, a second interface module and a processor. The charge and discharge control methods include: detecting voltage signals at a L and N terminals of the first interface module and voltage signals at a L and N terminals of the second interface module; if there is a voltage signal at the L terminal and the N terminal of the first interface module and there is no voltage signal at the L terminal and the N terminal of the second interface module, the vehicle end is controlled to enter a charging mode; if there is no voltage signal at the L terminal and the N terminal of the first interface module, and there is a voltage signal at the L terminal and the N terminal of the second interface module, the vehicle end is controlled to enter a discharge mode. The technical solution provided by the embodiment of the disclosure may achieve compatibility with multiple charging and discharging modes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、120、130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1025" publication-number="202626327"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626327.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塑膠成型轉印方法及塑膠成型轉印設備</chinese-title>  
        <english-title>PLASTIC MOLDING TRANSFER METHOD AND PLASTIC MOLDING TRANSFER APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250813B">B29C45/14</main-classification>  
        <further-classification edition="200601120250813B">B29C45/73</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商微盟電子（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSI ELECTRONICS (KUN SHAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>微星科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRO-STAR INT'L CO., LIMITED.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張禎育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉克超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KE-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任紅雙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN, HUNG-SHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李湘福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HSIANG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡自豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TZU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張正權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提出一種塑膠成型轉印方法及塑膠成型轉印設備，塑膠成型轉印方法包括：射出成型製程，利用注塑機台進行一次合模，以將塑膠通過射出工藝成型為未印刷產品，塑膠的熔點為第一溫度；模內轉印製程，利用注塑機台進行另一次合模，以將印刷薄膜上的裝飾圖案經由加溫和加壓方式轉印至未印刷產品上，以得到印刷產品，轉印時的溫度為第二溫度，第二溫度低於第一溫度。通過上述設計，本公開能夠避免因印刷薄膜或裝飾圖案的油墨無法承受塑膠熔融時的高溫高壓而導致的進點處破膜、破墨、沖墨等不良現象，並且能夠避免由印刷薄膜自身導致的模具分界線易出毛邊、褶皺的問題，同時，本公開無需對產品的塑膠原料的材質和產品的肉厚進行特殊考慮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plastic molding transfer method includes an injection molding process, in which a mold clamping operation is performed by an injection molding machine to mold a plastic material into a non-printed product through an injection molding technique. The melting point of the plastic material corresponds to a first temperature. An in-mold transfer process, in which another mold clamping operation is performed by the injection molding machine to transfer a decorative pattern from a printed film onto the non-printed product by means of heating and pressing to obtain a printed product. The transfer temperature corresponds to a second temperature. The second temperature is lower than the first temperature. Through the above design, the present invention can prevent defects such as film rupture, ink breakage, and ink flushing at the injection point, which may otherwise occur due to the inability of the printed film or the decorative pattern’s ink to withstand the high temperature and pressure during plastic melting. Furthermore, the present invention can avoid burrs and wrinkles that may result from the mold parting line caused by the printed film. Additionally, the present invention does not require special consideration of the plastic material or wall thickness of the product.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1026" publication-number="202628497"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628497.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板結構</chinese-title>  
        <english-title>SUBSTRATE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">H05K1/03</main-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣興電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾子章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, TZYY-JANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王金勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚瑞敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIN, RA-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬光華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, GUANG-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板結構，包括一基底以及至少一增層結構層。基底包括一介電核心板以及貫穿介電核心板的至少一第一導電通孔。至少一增層結構層配置於基底上，且包括一介電層以及貫穿介電層的至少一第二導電通孔。介電層的熱膨脹係數小於介電核心板的熱膨脹係數。至少一第二導電通孔電性連接至少一第一導電通孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate structure includes a base and at least one build-up structure layer. The base includes a dielectric core plate and at least one first conductive through hole penetrating the dielectric core plate. The at least one build-up structure layer is disposed on the base and includes a dielectric layer and at least one second conductive through hole penetrating the dielectric layer. A coefficient of thermal expansion of the dielectric layer is less than a coefficient of thermal expansion of the dielectric core plate. The at least one second conductive through hole is electrically connected to the at least one first conductive through hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:基板結構</p>  
        <p type="p">110:基底</p>  
        <p type="p">111:第一表面</p>  
        <p type="p">112:介電核心板</p>  
        <p type="p">113:第二表面</p>  
        <p type="p">114:第一導電通孔</p>  
        <p type="p">114a:第一端</p>  
        <p type="p">114b:第二端</p>  
        <p type="p">120:增層結構層</p>  
        <p type="p">121:外表面</p>  
        <p type="p">122:介電層</p>  
        <p type="p">123:內表面</p>  
        <p type="p">124:第二導電通孔</p>  
        <p type="p">124a:第一端</p>  
        <p type="p">124b:第二端</p>  
        <p type="p">130:接合層</p>  
        <p type="p">135:第三導電通孔</p>  
        <p type="p">T1、T2、T3:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1027" publication-number="202628993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合式天線裝置及其製造方法</chinese-title>  
        <english-title>INTEGRATED ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W42/00</main-classification>  
        <further-classification edition="200601120260302B">H01Q1/22</further-classification>  
        <further-classification edition="200601120260302B">H01Q1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稜研科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳致賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐紹鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳帛軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許哲維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHE WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合式天線裝置，包括一基板、至少一天線、一射頻積體電路、多個金屬柱、一包封體及一導熱結構。天線與射頻積體電路分別設置於基板的一第一表面與一第二表面，射頻積體電路的一第三表面朝向第二表面。這些金屬柱的多個第一端設置於第二表面，且這些金屬柱圍繞射頻積體電路。包封體設置於第二表面，且包封射頻積體電路的至少一部分與這些金屬柱的每一者的至少一部分。導熱結構設置於射頻積體電路的一第四表面上方，且熱耦合於射頻積體電路，導熱結構的一外表面與這些金屬柱的多個第二端齊平，且外表面與這些第二端外露於包封體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated antenna device includes a substrate, at least one antenna, a RFIC, metal pillars, an encapsulant and a thermal conductive structure. The antenna and the RFIC are respectively disposed on a first surface and a second surface of the substrate, and a third surface of the RFIC faces the second surface. First ends of the metal pillars are disposed on the second surface, and the metal pillars surround the RFIC. The encapsulant is disposed on the second surface and encapsulant at least a portion of the RFIC and at least a portion of each of the metal pillars. The thermal conductive structure is disposed above a fourth surface of the RFIC and is thermally coupled to the RFIC. An outer surface of the thermally conductive structure is flush with second ends of the metal pillars and the outer surface and the second ends are exposed from the encapsulant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:整合式天線裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">112:第一表面</p>  
        <p type="p">114:第二表面</p>  
        <p type="p">115:電氣接點</p>  
        <p type="p">119:焊球</p>  
        <p type="p">120:天線</p>  
        <p type="p">130:射頻積體電路</p>  
        <p type="p">131:波束成型積體電路</p>  
        <p type="p">132:第三表面</p>  
        <p type="p">134:第四表面</p>  
        <p type="p">140:金屬柱</p>  
        <p type="p">144:第二端</p>  
        <p type="p">150:包封體</p>  
        <p type="p">160:導熱結構</p>  
        <p type="p">170:熱中介層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1028" publication-number="202628865"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628865.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title>APPARATUS FOR PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification>  
        <further-classification edition="201801120260302B">B05B12/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫炳國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, BYOUNG GUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韓妃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAN BEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及基板處理裝置。本實施例的基板處理裝置包括：基座，包含以一定間隔隔開而使得基板位於複數個製程區域的複數個基板支撐模組，並且能夠旋轉；以及複數個分離氣體噴射部，噴射用於區分複數個製程區域的分離氣體。所述複數個分離氣體噴射部根據所述基座的旋轉及停止，噴射具有不同噴射流量的分離氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板處理裝置</p>  
        <p type="p">100:製程腔室</p>  
        <p type="p">110:處理空間</p>  
        <p type="p">110a:腔室壁</p>  
        <p type="p">120:蓋</p>  
        <p type="p">200:氣體噴射結構體</p>  
        <p type="p">210:第一製程氣體噴射部</p>  
        <p type="p">230:第三製程氣體噴射部</p>  
        <p type="p">250a:第一製程氣體供給模組</p>  
        <p type="p">250c:第三製程氣體供給模組</p>  
        <p type="p">270:分離氣體供給模組</p>  
        <p type="p">300:基板支架</p>  
        <p type="p">310:基座</p>  
        <p type="p">320:旋轉軸</p>  
        <p type="p">400-1:第一基板支撐模組(基板支撐模組)</p>  
        <p type="p">400-3:第三基板支撐模組(基板支撐模組)</p>  
        <p type="p">450:加熱器</p>  
        <p type="p">500:排氣部</p>  
        <p type="p">530:排氣線路</p>  
        <p type="p">540:真空泵</p>  
        <p type="p">600:控制部</p>  
        <p type="p">A1:第一製程區域(製程區域)</p>  
        <p type="p">A3:第三製程區域(製程區域)</p>  
        <p type="p">B5:分離區域</p>  
        <p type="p">H1:中空</p>  
        <p type="p">V:閥</p>  
        <p type="p">S1:第一基板</p>  
        <p type="p">S3:第三基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1029" publication-number="202628604"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628604.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D1/68</main-classification>  
        <further-classification edition="202301120260302B">H10N97/00</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭茹雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, RU-SHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余科京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KEJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭安皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, ANHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包括：基板；設置在基板上的第一層間介電質；以及設置在第一層間介電質中的金屬-絕緣體-金屬(MIM)電容器。MIM電容器包含：設置在基板上的第一金屬層；第一絕緣體層，包含水平部分和側壁部分；第二金屬層，其中第一絕緣體層的水平部分設置在介於第一金屬層和第二金屬層之間，並且第一絕緣體層的側壁部分水平地圍繞第二金屬層；第二絕緣體層其圍繞第一絕緣體層的側壁部分；至少一個金屬觸點，垂直地延伸穿過第二絕緣體層，其中至少一個金屬觸點的下端與第一金屬層接觸；以及至少一個空氣間隔物其水平地圍繞至少一個金屬觸點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes: a substrate; a first interlayer dielectric (ILD) disposed on the substrate; and a metal-insulator-metal (MIM) capacitor disposed in the first ILD. The MIM capacitor comprises: a first metal layer disposed on the substrate; a first insulator layer comprising a horizontal portion and a sidewall portion; a second metal layer, wherein the horizontal portion of the first insulator layer is disposed between the first metal layer and the second metal layer, and the sidewall portion of the first insulator layer horizontally surrounding the second metal layer; a second insulator layer surrounding the sidewall portion of the first insulation layer; at least one metal contact extending vertically through the second insulator layer, wherein a lower end of the at least one metal contact is in contact with the first metal layer; and at least one air spacer horizontally surrounding the at least one metal contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片</p>  
        <p type="p">102:場效電晶體區域(場效電晶體)</p>  
        <p type="p">103:場效電晶體</p>  
        <p type="p">104:前段製程MIM電容器區域(MIM電容器)</p>  
        <p type="p">105:前段製程MIM電容器(MIM電容器)</p>  
        <p type="p">122:氧化物擴散區域(OD)</p>  
        <p type="p">124:源極/汲極區域(S/D)</p>  
        <p type="p">126:金屬閘極(金屬閘極結構、MG)</p>  
        <p type="p">128:間隔物結構(間隔物)</p>  
        <p type="p">130:第一層間介電質(層間介電質、ILD 0)</p>  
        <p type="p">132:第一金屬層(MIM金屬1)</p>  
        <p type="p">134:第一絕緣體層(MIM絕緣體1)</p>  
        <p type="p">136:第二金屬層(MIM金屬2)</p>  
        <p type="p">138:第二絕緣體層(MIM絕緣體2)</p>  
        <p type="p">140:第二層間介電質(層間介電質、ILD 1)</p>  
        <p type="p">142:金屬觸點(CT)</p>  
        <p type="p">142a:第一金屬觸點(金屬觸點)</p>  
        <p type="p">142b:第二金屬觸點(金屬觸點)</p>  
        <p type="p">142c:金屬觸點</p>  
        <p type="p">142d:金屬觸點</p>  
        <p type="p">144:金屬間介電質</p>  
        <p type="p">146:M1層金屬導軌(M1金屬導軌)</p>  
        <p type="p">150a:第一空氣間隔物(空氣間隔物)</p>  
        <p type="p">150b:第二空氣間隔物(空氣間隔物)</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1030" publication-number="202628613"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628613.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構的製造方法及半導體結構</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D30/01</main-classification>  
        <further-classification edition="202501120260327B">H10D30/62</further-classification>  
        <further-classification edition="202501120260327B">H10D62/83</further-classification>  
        <further-classification edition="202501120260327B">H10D64/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YAN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁聖勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, SHENG-SYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造方法，包括：經由移除犧牲磊晶層材料而在包括交替的犧牲磊晶層及通道磊晶層之一磊晶堆疊中，形成一凹部；在鄰近於該犧牲磊晶層材料之該凹部中形成包括硼化矽(SiB)之一第一內間隔件層；在鄰近於該第一內間隔件層之該凹部中形成包括碳氮氧化矽(SiOCN)之一第二內間隔件層；形成鄰近於該第二內間隔件層之一源極/汲極形貌體；以及以一金屬閘極層替換該犧牲磊晶層材料，其中該第一內間隔件層在以該金屬閘極層替換該犧牲磊晶層材料時，減少內間隔件損失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fabrication method, includes: forming a recess in an epitaxial stack including alternating sacrificial epitaxial layers and channel epitaxial layers through removing sacrificial epitaxial layer material; forming a first inner spacer layer including silicon boride (SiB) in the recess adjacent to the sacrificial epitaxial layer material; forming a second inner spacer layer including silicon oxycarbonitride (SiOCN) in the recess adjacent to the first inner spacer layer; forming a source/drain feature adjacent to the second inner spacer layer; and replacing the sacrificial epitaxial layer material with a metal gate layer, wherein the first inner spacer layer reduces inner spacer loss while the sacrificial epitaxial layer material is replaced with the metal gate layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">216:(通道)磊晶層，磊晶生長層，奈米片</p>  
        <p type="p">220:鰭片</p>  
        <p type="p">240:(磊晶)S/D形貌體</p>  
        <p type="p">260:(金屬)閘極結構</p>  
        <p type="p">262:雙內間隔件層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1031" publication-number="202628784"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628784.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有截止狀態電壓均衡器之串聯相變材料開關及其形成方法</chinese-title>  
        <english-title>SERIES PHASE CHANGE MATERIAL SWITCHES WITH OFF-STATE VOLTAGE EQUALIZERS AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">H10N70/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUO-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泓儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUNG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁裕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可藉由下列來形成一裝置結構：在一基體上形成介電層，其具有形成於其中之金屬互連結構；在該等介電層上形成至少一加熱器元件，該至少一加熱器中之每一者包括一條帶部分、一第一端子部分以及一第二端子部分；在該至少一加熱器元件中之一者上形成至少一加熱器覆蓋板堆疊，其包括一電氣絕緣及熱傳導板，其包括一第一材料，以及一半導板，其包括具有比該第一材料更低的一電阻率的一第二材料；以及在該至少一加熱器覆蓋板堆疊上沉積並圖案化一相變材料層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device structure may be formed by: forming dielectric layers with metal interconnect structures formed therein on a substrate; forming at least one heater element over the dielectric layers, each of the at least one heater element including a strip portion, a first terminal portion, and a second terminal portion; forming at least one heater-cover plate stack including a electrically-insulating and thermally-conductive plate including a first material and a semiconducting plate including a second material having a lower electrical resistivity than the first material over a one of the at least one heater element; and depositing and patterning a phase change material layer over the at least one heater-cover plate stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:金屬板</p>  
        <p type="p">4_1:第一金屬板</p>  
        <p type="p">4_2:第二金屬板</p>  
        <p type="p">4_(N+1):第(N+1)金屬板</p>  
        <p type="p">7:部分</p>  
        <p type="p">7_1:第一部分</p>  
        <p type="p">7_2:第二部分</p>  
        <p type="p">7_N:第N部分</p>  
        <p type="p">8:金屬通孔結構，基體</p>  
        <p type="p">9:半導體材料層</p>  
        <p type="p">10:PCM開關，射頻開關，RF開關</p>  
        <p type="p">10_1:第一RF開關</p>  
        <p type="p">10_2:第二RF開關</p>  
        <p type="p">10_N:第NRF開關</p>  
        <p type="p">21:信號節點連接通孔結構，連接通孔結構</p>  
        <p type="p">24:通孔層級介電層</p>  
        <p type="p">26:電極層級介電層</p>  
        <p type="p">28:電氣絕緣及熱傳導板</p>  
        <p type="p">29:半導板</p>  
        <p type="p">42:金屬阻障板</p>  
        <p type="p">44:主要金屬板</p>  
        <p type="p">55:條帶部分</p>  
        <p type="p">64S:散熱片</p>  
        <p type="p">70:第一相變材料部分，第二相變材料部分，第N相變材料部分，第i相變材料部分，相變材料部分</p>  
        <p type="p">72:第一覆蓋介電板</p>  
        <p type="p">74:第二覆蓋介電板</p>  
        <p type="p">80:PCM層級介電層</p>  
        <p type="p">90:線路層級介電層</p>  
        <p type="p">600:第一介電層，介電層</p>  
        <p type="p">601:接點層級介電層</p>  
        <p type="p">610:第一互連層級介電層</p>  
        <p type="p">612:裝置接點通孔結構</p>  
        <p type="p">618:第一金屬線路結構</p>  
        <p type="p">620:第二互連層級介電層</p>  
        <p type="p">622:第一金屬通孔結構</p>  
        <p type="p">628:第二金屬線路結構</p>  
        <p type="p">630:第三互連層級介電層</p>  
        <p type="p">632:第二金屬通孔結構</p>  
        <p type="p">638:第三金屬線路結構</p>  
        <p type="p">640:第四互連層級介電層</p>  
        <p type="p">642:第三金屬通孔結構</p>  
        <p type="p">648:第四金屬線路結構</p>  
        <p type="p">700:半導體電路</p>  
        <p type="p">701:功率放大器</p>  
        <p type="p">702:低雜訊放大器</p>  
        <p type="p">720:淺溝槽隔離結構</p>  
        <p type="p">732:源極區</p>  
        <p type="p">735:半導體通道</p>  
        <p type="p">738:汲極區</p>  
        <p type="p">741:源極側金屬半導體合金區</p>  
        <p type="p">748:汲極側金屬半導體合金區</p>  
        <p type="p">750:閘極結構</p>  
        <p type="p">752:閘極介電層</p>  
        <p type="p">754:閘極電極</p>  
        <p type="p">756:介電閘極間隔物</p>  
        <p type="p">758:閘極帽蓋介電質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1032" publication-number="202628094"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628094.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非揮發性積體電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G11C11/16</main-classification>  
        <further-classification edition="200601120251001B">G11C7/06</further-classification>  
        <further-classification edition="200601120251001B">G11C7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東北大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHOKU UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏井雅典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATSUI, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田知生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TOMOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羽生貴弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANYU, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鑑於間歇性計算所存在之問題點，本發明的課題為提供一種能夠大幅降低能量開銷之非揮發性積體電路。藉由一種非揮發性暫存器解決了上述課題，其係使在供電時複數個正反器所記憶保持之各位元資訊在斷電時退避到非揮發性記憶區域而保持之非揮發性積體電路，其特徵為，係具備：複數個非揮發性記憶元件，係與前述複數個正反器個別對應地寫入狀態並讀取狀態；及參照元件，係不與前述複數個正反器個別對應，前述非揮發性記憶元件僅連接於對應之正反器之互補輸出中之一者之輸出，前述參照元件對前述複數個正反器的自然數分之一的正反器共同地讀取狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:位元資訊記憶部</p>  
        <p type="p">2:共享讀出電路</p>  
        <p type="p">3:控制器電路</p>  
        <p type="p">4:備份電路</p>  
        <p type="p">11:正反器</p>  
        <p type="p">12:資料保持用MTJ元件</p>  
        <p type="p">13:感測放大器</p>  
        <p type="p">21:參照MTJ元件</p>  
        <p type="p">22:MTJ選擇器電路</p>  
        <p type="p">100:非揮發性暫存器</p>  
        <p type="p">A,B:矩形區域</p>  
        <p type="p">LB:訊號</p>  
        <p type="p">S1,S2,S3,S4,SN:位元選擇訊號</p>  
        <p type="p">WB:訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1033" publication-number="202626052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116011</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大環化合物及其藥物組合物和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260309B">A61K31/5355</main-classification>  
        <further-classification edition="200601120260309B">A61K31/506</further-classification>  
        <further-classification edition="200601120260309B">A61K31/501</further-classification>  
        <further-classification edition="200601120260309B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260309B">A61K31/44</further-classification>  
        <further-classification edition="200601120260309B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260309B">A61K31/4188</further-classification>  
        <further-classification edition="200601120260309B">A61K31/4184</further-classification>  
        <further-classification edition="200601120260309B">A61K31/352</further-classification>  
        <further-classification edition="200601120260309B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣天映泰（上海）生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTELLIGEN THERAPEUTICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國廣天映泰生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTELLIGEN THERAPEUTICS INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　進華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜晶晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, JINGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石璞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, PU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種大環化合物及其藥物組合物和用途。本發明提供了式(I)所示化合物、其溶劑化物、其藥學上可接受的鹽、或其藥學上可接受的鹽的溶劑化物。本公開的化合物可用作TNFα抑制劑，並可用於治療炎症和自身免疫性疾病。 &lt;br/&gt;&lt;img align="absmiddle" height="226px" width="239px" file="ed12346.JPG" alt="ed12346.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1034" publication-number="202627004"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627004.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化膜黏著劑</chinese-title>  
        <english-title>CURED FILM ADHESIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C09J4/00</main-classification>  
        <further-classification edition="200601120260324B">C09J11/06</further-classification>  
        <further-classification edition="200601120260324B">C09J11/04</further-classification>  
        <further-classification edition="200601120260324B">C08K5/17</further-classification>  
        <further-classification edition="200601120260324B">C08K3/36</further-classification>  
        <further-classification edition="200601120260324B">C08K3/26</further-classification>  
        <further-classification edition="200601120260324B">C09J5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢高股份有限及兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉莫茲　詹尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMMERTZ, JANIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特里克　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRICKER, LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔夫　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAPF, STEFANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔登　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADEN, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席拉夫　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIELAFF, PATRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種固化膜黏著劑，其藉由固化雙組分(2K)組合物來獲得，該雙組分(2K)組合物包括： &lt;br/&gt;第一組分，其包括： &lt;br/&gt;a)具有至少兩個(甲基)丙烯酸酯基團並具有至多600道爾頓之重量平均分子量(Mw)之至少一種化合物；及 &lt;br/&gt;視情況b)與a)之該(等)化合物不同之至少一種烯系不飽和化合物；及 &lt;br/&gt;第二組分，其包括： &lt;br/&gt;c)具有至少一個一級胺基團之至少一種化合物， &lt;br/&gt;其中該雙組分(2K)組合物進一步包括： &lt;br/&gt;d)包括非導電填充劑、導電填充劑或其混合物之流變控制劑；且 &lt;br/&gt;另外，其中該雙組分(2K)組合物之特徵在於(甲基)丙烯酸酯基團對一級胺基團之莫耳比為3:1至1:1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cured film adhesive obtained by the curing of a two-component (2K) composition comprising: &lt;br/&gt;a first component comprising: &lt;br/&gt;a) at least one compound having at least two (meth)acrylate groups and having a weight average molecular weight (Mw) of at most 600 Daltons; and, &lt;br/&gt;optionally b) at least one ethylenically unsaturated compound which is distinct from said compound(s) of a); and, &lt;br/&gt;a second component comprising: &lt;br/&gt;c) at least one compound having at least one primary amine group, &lt;br/&gt;wherein the two-component (2K) composition further comprises: &lt;br/&gt;d) a rheology control agent comprising electrically non-conductive fillers, electrically conductive fillers or mixtures thereof; and, &lt;br/&gt;further wherein the two-component (2K) composition is characterized in that the molar ratio of (meth)acrylate groups to primary amine groups is from 3:1 to 1:1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1035" publication-number="202627144"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627144.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及其驅動方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND METHOD OF DRIVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C14/56</main-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔棟旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DONG UK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫炳國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, BYOUNG GUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李仁奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, IN GYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種基板處理裝置。根據本發明一實施例的基板處理裝置包括：製程腔室、基板支撐結構體及氣體噴射結構體。製程腔室包括處理複數個基板的複數個製程區域。基板支撐結構體位於製程腔室的下部，並支撐複數個基板，且可進行旋轉及升降，以使複數個基板依次經過複數個製程區域。氣體噴射結構體位於製程腔室的上部，以與基板支撐結構體相互面對。氣體噴射結構體包括複數個製程氣體噴射部及複數個吹掃氣體噴射部，複數個製程氣體噴射部在複數個製程區域的每一製程區域各配置有一個，以向對面的基板分別噴射製程氣體，複數個吹掃氣體噴射部在複數個製程區域的每一製程區域構成為包圍複數個製程氣體噴射部並噴射吹掃氣體。連接複數個吹掃氣體噴射部的下部表面的第一水平延長線位於比連接複數個製程氣體噴射部的下部表面的第二水平延長線更加鄰近於基板支撐結構體的位置，在複數個製程區域的每一製程區域配置有氣體限制區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:基板支撐結構體</p>  
        <p type="p">210:基座板</p>  
        <p type="p">220:軸</p>  
        <p type="p">230a:第一基板支撐模組(基板支撐模組)</p>  
        <p type="p">230c:第三基板支撐模組(基板支撐模組)</p>  
        <p type="p">310a:第一製程氣體噴射部</p>  
        <p type="p">310c:第三製程氣體噴射部</p>  
        <p type="p">330:簾氣噴射部</p>  
        <p type="p">340a:第一吹掃氣體噴射部</p>  
        <p type="p">340c:第三吹掃氣體噴射部</p>  
        <p type="p">GC1:第一氣體限制區域</p>  
        <p type="p">GC3:第三氣體限制區域</p>  
        <p type="p">L1~L3:第一水平延長線~第三水平延長線</p>  
        <p type="p">PH1:第一放置槽</p>  
        <p type="p">PH3:第三放置槽</p>  
        <p type="p">S1:第一基板(基板)</p>  
        <p type="p">S3:第三基板(基板)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1036" publication-number="202628866"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628866.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR PROCESSING OF SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="202601120260302B">H10P14/694</further-classification>  
        <further-classification edition="200601120260302B">C23C16/52</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="200601120260302B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尙燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG YEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔我榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, AH YEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志旼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JI MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金猷悳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YU DEUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林栽甲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JAE GAB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李定俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理裝置，可包括：形成處理空間的製程腔室及控制該製程腔室的控制器。所述控制器在所述製程腔室內的基座上裝載的基板的一面形成將主層及緩衝層至少交替層疊一次的翹曲補償層，並可控制緩衝層的密度低於主層的密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:基板結構</p>  
        <p type="p">301:基板</p>  
        <p type="p">301a:第一面</p>  
        <p type="p">301b:第二面</p>  
        <p type="p">303:翹曲補償層</p>  
        <p type="p">303A:主層</p>  
        <p type="p">303B:緩衝層</p>  
        <p type="p">WPG21:翹曲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1037" publication-number="202628650"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628650.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D64/01</main-classification>  
        <further-classification edition="202601120260302B">H10P50/28</further-classification>  
        <further-classification edition="202601120260302B">H10P14/692</further-classification>  
        <further-classification edition="202501120260302B">H10D30/01</further-classification>  
        <further-classification edition="202501120260302B">H10D62/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SHU-UEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳中書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊裕隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張銘慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種形成半導體裝置的方法。方法包括在基板上形成堆疊。堆疊包括多個彼此透過間隙隔開的半導體部分。接下來，用介電氧化物材料填滿間隙。然後用蝕刻氣體組合物橫向蝕刻沉積的介電氧化物材料的末端部分，以形成橫向開口。蝕刻氣體成分包括含鹵素化合物、氨和胺。在多個半導體部分的相鄰半導體部分之間的橫向開口中形成內間隔物之後，移除間隙中沉積的介電氧化物材料的剩餘部分。然後在間隙中形成閘極堆疊以環繞堆疊的通道區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method for forming semiconductor devices. This method includes forming a stack over a substrate. The stack includes multiple semiconductor portions spaced apart from one another by gaps. Next, the gaps are filled with a dielectric oxide material. End portions of the deposited dielectric oxide material are then laterally etched by an etch gas composition to form lateral openings. The etch gas composition includes a halogen-containing compound, ammonia and an amine. After forming inner spacers in the lateral openings between the adjacent semiconductor portions of the multiple semiconductor portions, the remaining portions of the deposited dielectric oxide material in the gaps are moved. A gate stack is then formed in the gaps to surround a channel region of the stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:操作</p>  
        <p type="p">104:操作</p>  
        <p type="p">106:操作</p>  
        <p type="p">108:操作</p>  
        <p type="p">110:操作</p>  
        <p type="p">112:操作</p>  
        <p type="p">114:操作</p>  
        <p type="p">116:操作</p>  
        <p type="p">118:操作</p>  
        <p type="p">120:操作</p>  
        <p type="p">122:操作</p>  
        <p type="p">124:操作</p>  
        <p type="p">126:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1038" publication-number="202626993"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626993.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於耐久性聚矽氧塗層的水連續組成物</chinese-title>  
        <english-title>WATER-CONTINUOUS COMPOSITION FOR A DURABLE SILICONE COATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C09D183/04</main-classification>  
        <further-classification edition="200601120260331B">C09D183/06</further-classification>  
        <further-classification edition="202001120260331B">C08J7/046</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商陶氏有機矽公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOW SILICONES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈國棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, GUODONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水連續塗層組成物，其含有：(a)液體聚矽氧樹脂，其具有矽結合烷氧基、矽結合苯基、及矽結合烷基；(b)固體聚矽氧樹脂，其具有Si-OH、矽結合苯基、及矽結合烷基；(c)可選的不黏添加劑；(d)界面活性劑，其在暴露於280℃之溫度持續30分鐘時經歷大於90 wt%的重量損失，且係選自具有以下結構的一種界面活性劑或組合或多於一種界面活性劑：R”-(OCH&lt;sub&gt;2&lt;/sub&gt;CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;e&lt;/sub&gt;A；其中R”係具有10至18個碳原子的烴基，下標e係10至15範圍內的值；且A係選自-OH及-O&lt;sup&gt;-&lt;/sup&gt;，其中-O&lt;sup&gt;-&lt;/sup&gt;可選地與陽離子性相對離子締合；(e)水；且其中矽結合苯基與矽結合烷基的莫耳比係0.8至1.2，且Si-OH基團與Si-OZ基團的莫耳比係0.2或更高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A water-continuous coating composition contains: (a) liquid silicone resin with silicon-bound alkoxy, silicon-bound phenyl, and silicon-bound alkyl; (b) solid silicone resin with Si-OH, silicon-bound phenyl, and silicon-bound alkyl; (c) optionally, a non-stick additive; (d) a surfactant that experiences greater than 90 wt% weight-loss when exposed to a temperature of 280 °C for 30 minutes and that is selected from one or a combination or more than one surfactant having the following structure: R”-(OCH&lt;sub&gt;2&lt;/sub&gt;CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;e&lt;/sub&gt;A; where R” is a hydrocarbyl having from 10 to 18 carbon atoms, subscript e is a value in a range of 10 to 15; and A is selected from -OH and -O&lt;sup&gt;-&lt;/sup&gt;, where -O&lt;sup&gt;-&lt;/sup&gt;is optionally associated with a cationic counterion; (e) water; and wherein the mole ratio of silicon-bound phenyl groups to silicon-bound alkyl groups is 0.8 to 1.2 and the mole ratio of Si-OH groups to Si-OZ groups that is 0.2 or higher.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1039" publication-number="202627992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>上肢同動鏡像復健系統及方法</chinese-title>  
        <english-title>MIRROR-IMAGE MOVEMENT REHABILITATION SYSTEM AND METHOD FOR UPPER LIMBS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250822B">G06T7/80</main-classification>  
        <further-classification edition="201801120250822B">G16H20/30</further-classification>  
        <further-classification edition="200601120250822B">A61H1/02</further-classification>  
        <further-classification edition="200601120250822B">A61B5/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TSUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛　詠琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEK, YOONG KEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種上肢同動鏡像復健系統，包含顯示器、音訊裝置、握持機構、影像擷取裝置、復健資料庫及處理器。其中處理器包含：復健指示模組及分析回饋模組。其中顯示器用以顯示復健指示影像，音訊裝置用以播放音樂。握持機構用以使使用者根據復健指示影像及音樂之節拍以雙手分別抓握並移動其鏡像同動之第一把手及第二把手，而雙手移動之動作影像由影像擷取裝置擷取。復健指示模組用以根據復健資料庫中之復健資料產生復健指示影像及音樂，且分析回饋模組用以分析動作影像以計算雙手之動作穩定度，而復健指示模組根據動作穩定度調整音樂之節拍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mirror-image movement rehabilitation system for upper limbs includes a display, an audio device, a gripping mechanism, an image capture device, a rehabilitation database, and a processor. The processor includes a rehabilitation instruction module and an analysis feedback module. The display used for displaying a rehabilitation instruction image and the audio device is used for playing a music. The gripping mechanism is used for enabling a user to grasp and move mirror-image-moving first and second grips with hands according to the rehabilitation instruction image and a tempo of the music, and a motion image of the hands is captured with an image capture device. The rehabilitation instruction module is used for generating the rehabilitation instruction image and the music according to the rehabilitation data in the rehabilitation database, and the analysis feedback module is used for analyzing the motion image to calculate a motion stability of the hands, and the rehabilitation instruction module adjusts the tempo of the music according to the motion stability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:上肢同動鏡像復健系統</p>  
        <p type="p">110:處理器</p>  
        <p type="p">111:復健指示模組</p>  
        <p type="p">112:分析回饋模組</p>  
        <p type="p">120:影像擷取裝置</p>  
        <p type="p">130:復健資料庫</p>  
        <p type="p">140:顯示器</p>  
        <p type="p">150:音訊裝置</p>  
        <p type="p">160:握持機構</p>  
        <p type="p">161:第一把手</p>  
        <p type="p">162:第二把手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1040" publication-number="202628686"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628686.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10D84/85</main-classification>  
        <further-classification edition="202601120260325B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在實施例中，一種方法包括半導體裝置，該半導體裝置包括：第一單元，該第一單元包括第一有源區及與第一有源區相鄰的第二有源區，其中第一有源區及第二有源區中的每一者包括在第一源極/汲極區之間延伸的第一奈米結構及在第一奈米結構上方的第二奈米結構，該第二奈米結構在第二源極/汲極區之間延伸；及第一閘極堆疊，該第一閘極堆疊在第一有源區的第一奈米結構及第二有源區的第一奈米結構周圍；及第二閘極堆疊，該第二閘極堆疊在第一閘極堆疊上方且安置在第一有源區的第二奈米結構及第二有源區的第二奈米結構周圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a method includes a semiconductor device including a first cell including a first active region and a second active region adjacent to the first active region, where each of the first active region and the second active region includes a first nanostructure extending between first source/drain regions, and a second nanostructure over the first nanostructure, the second nanostructure extending between second source/drain regions, and a first gate stack around the first nanostructure of the first active region and the first nanostructure of the second active region, and a second gate stack over the first gate stack and disposed around the second nanostructure of the first active region and the second nanostructure of the second active region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">66L:下部半導體奈米結構</p>  
        <p type="p">66U:上部半導體奈米結構</p>  
        <p type="p">108L:下部磊晶源極/汲極區</p>  
        <p type="p">108U:上部磊晶源極/汲極區</p>  
        <p type="p">132:閘極介電質</p>  
        <p type="p">134L:下部閘極電極</p>  
        <p type="p">134U:上部閘極電極</p>  
        <p type="p">A-A'、B-B'、C-C':剖面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1041" publication-number="202627010"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627010.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫時固定用膠帶，及使用該暫時固定用膠帶之零件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260327B">C09J7/30</main-classification>  
        <further-classification edition="200601120260327B">C09J153/02</further-classification>  
        <further-classification edition="202601120260327B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺大亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種暫時固定用膠帶，其具有伸長剝離性，伸長前能夠固定並保持被黏物，在拉伸過程中能夠在低伸長率區域容易地剝離被黏物。本發明的暫時固定用膠帶至少具有包含：伸長結晶性樹脂、以及聚合性化合物的聚合物的黏著劑層，具備以下任一項中的特徵。特徵1：相對於上述伸長結晶性樹脂100質量份，上述黏著劑層的上述聚合性化合物和上述聚合性化合物的聚合物的總含量為4質量份以上且小於50質量份。特徵2：上述黏著劑層的100%模量與300%模量之差的絕對值為0.5以上。特徵3：上述黏著劑層的100%模量為4.5以下，上述黏著劑層的300%模量大於1.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:暫時固定用膠帶</p>  
        <p type="p">2:基材</p>  
        <p type="p">3:黏著劑層</p>  
        <p type="p">5:零件</p>  
        <p type="p">D:拉伸的方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1042" publication-number="202627011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫時固定用膠帶，及使用該暫時固定用膠帶之零件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260327B">C09J7/30</main-classification>  
        <further-classification edition="200601120260327B">C09J153/02</further-classification>  
        <further-classification edition="200601120260327B">C09J11/08</further-classification>  
        <further-classification edition="200601120260327B">C09J11/04</further-classification>  
        <further-classification edition="202601120260327B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺大亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種暫時固定用膠帶以及使用該暫時固定用膠帶的零件的製造方法，上述暫時固定用膠帶能夠在低伸長率區域容易地剝離被黏物、且能夠抑制剝離的被黏物的再貼附。本發明的暫時固定用膠帶的一個樣態至少具有黏著劑層，上述黏著劑層至少包含伸長結晶性樹脂和填料，上述黏著劑層中的上述填料的含量為5體積%以上，和/或200%伸長時的上述黏著劑層的表面的算術平均高度（Sa&lt;sub&gt;200&lt;/sub&gt;）為0.5&lt;i&gt;μ&lt;/i&gt;m以上。另外，本發明的暫時固定用膠帶的另一樣態至少具有黏著劑層，在200%伸長時，對SUS方形材料的10mm見方的面的面黏接力P&lt;sub&gt;200&lt;/sub&gt;為12N/cm&lt;sup&gt;2&lt;/sup&gt;以下，和/或上述黏著劑層的100%模量與300%模量之差的絕對值為0.6MPa以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:暫時固定用膠帶</p>  
        <p type="p">2:基材</p>  
        <p type="p">3:黏著劑層</p>  
        <p type="p">5:零件</p>  
        <p type="p">D:拉伸的方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1043" publication-number="202626310"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626310.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>法蘭連接及機器人手臂</chinese-title>  
        <english-title>FLANGE CONNECTION AND ROBOT ARM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">B25J15/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商諾拉機器人學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEURA ROBOTICS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨斯克斯　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENSKES, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈茲　詹尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOEZ, JANNIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬爾扎恩　喬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALZAHN, JOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種法蘭連接件(10)，用於將第一機器人手臂零件(12)連接至第二機器人手臂零件(14)，&lt;br/&gt; 具有法蘭縱軸(16)、第一法蘭元件(18)、第二法蘭元件(20)、及至少一個夾緊本體(22)，&lt;br/&gt; 其中第一法蘭元件(18)包含：&lt;br/&gt; 法蘭肩部(24)，及&lt;br/&gt; 第一法蘭突出部(26)，具有至少一個第一夾緊延伸部(28)，&lt;br/&gt; 其中第二法蘭元件(20)包含：&lt;br/&gt; 至少一個第二法蘭突出部(30)，具有第二夾緊延伸部(32)，&lt;br/&gt; 且其中第一法蘭元件(18)及第二法蘭元件(20)係相對彼此佈置，使得藉由將至少一個夾緊本體(22)插入至少一個第一夾緊延伸部(28)與第二夾緊延伸部(32)之間，可建立第二夾緊延伸部(32)與法蘭肩部(24)的摩擦及/或貼合形狀之連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flange connection (10) for connecting a first robot arm part (12) to a second robot arm part (14),&lt;br/&gt; having a flange longitudinal axis (16), a first flange element (18), a second flange element (20) and at least one clamping body (22),&lt;br/&gt; wherein the first flange element (18) comprises&lt;br/&gt; a flange shoulder (24), and&lt;br/&gt; a first flange projection (26) having at least one first clamping extension (28),&lt;br/&gt; wherein the second flange element (20) comprises&lt;br/&gt; at least one second flange projection (30) having a second clamping extension (32),&lt;br/&gt; and wherein the first flange element (18) and the second flange element (20) are arranged relative to one another such that, by inserting the at least one clamping body (22) between the at least one first clamping extension (28) and the second clamping extension (32), a frictional and/or form-fitting connection of the second clamping extension (32) with the flange shoulder (24) can be established.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:法蘭連接件</p>  
        <p type="p">12:第一機器人手臂零件</p>  
        <p type="p">13:機器人手臂</p>  
        <p type="p">14:第二機器人手臂零件</p>  
        <p type="p">16:法蘭縱軸</p>  
        <p type="p">18:第一法蘭元件</p>  
        <p type="p">20:第二法蘭元件</p>  
        <p type="p">22:夾緊本體</p>  
        <p type="p">23:機器人手臂縱軸</p>  
        <p type="p">24:法蘭肩部</p>  
        <p type="p">26:第一法蘭突出部</p>  
        <p type="p">28:第一夾緊延伸部</p>  
        <p type="p">32:第二夾緊延伸部</p>  
        <p type="p">34:圓周方向</p>  
        <p type="p">38:第二夾緊表面</p>  
        <p type="p">46:夾緊表面</p>  
        <p type="p">48:撓性舌片</p>  
        <p type="p">50:肩部接觸表面</p>  
        <p type="p">52:摩擦板片</p>  
        <p type="p">54:夾緊螺絲</p>  
        <p type="p">56:穿通孔</p>  
        <p type="p">58:螺紋孔</p>  
        <p type="p">60:螺絲基座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1044" publication-number="202628658"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628658.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10D84/01</main-classification>  
        <further-classification edition="202501120260325B">H10D30/00</further-classification>  
        <further-classification edition="202501120260325B">H10D30/01</further-classification>  
        <further-classification edition="202501120260325B">H10D30/43</further-classification>  
        <further-classification edition="202501120260325B">H10D62/10</further-classification>  
        <further-classification edition="202501120260325B">H10D62/13</further-classification>  
        <further-classification edition="202501120260325B">H10D64/01</further-classification>  
        <further-classification edition="202501120260325B">H10D84/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石哲齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHE CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：形成一晶圓，該晶圓包含：一基板；一犧牲層，位於該基板上；及一多層堆疊，位於該犧牲層上。該方法進一步包括以下步驟：對該多層堆疊及該犧牲層執行一第一蝕刻製程以形成一經圖案化的多層堆疊；用一底部介電隔離層替換該經圖案化的多層堆疊中的該犧牲層的一部分；對該經圖案化的多層堆疊執行一第二蝕刻製程以形成一源極/汲極凹部，其中該底部介電隔離層的一表面暴露於該源極/汲極凹部；及在該源極/汲極凹部中形成一下部源極/汲極區域及一上部源極/汲極區域。移除該基板以顯露出該底部介電隔離層。移除該底部介電隔離層的一部分以形成一背側接觸開口。在該背側接觸開口中形成一源極/汲極矽化物層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a wafer comprising a substrate, a sacrificial layer over the substrate, and a multilayer stack over the sacrificial layer. The method further includes performing a first etching process on the multilayer stack and the sacrificial layer to form a patterned multilayer stack, replacing a part of the sacrificial layer in the patterned multilayer stack with a bottom dielectric isolation layer, performing a second etching process on the patterned multilayer stack to form a source/drain recess, wherein a surface of the bottom dielectric isolation layer is exposed to the source/drain recess, and forming a lower source/drain region and an upper source/drain region in the source/drain recess. The substrate is removed to reveal the bottom dielectric isolation layer. A portion of the bottom dielectric isolation layer is removed to form a backside contact opening. A source/drain silicide layer is formed in the backside contact opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:製程流程</p>  
        <p type="p">202、204、206、208、210、212、214、216、218、220、222、224、226、228、230、232、234、236、238、240、242:製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1045" publication-number="202626244"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626244.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116631</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊料膏及接合體的製造方法</chinese-title>  
        <english-title>SOLDER PASTE AND METHOD FOR MANUFACTURING JOINTED BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B23K35/26</main-classification>  
        <further-classification edition="200601120260327B">B23K35/14</further-classification>  
        <further-classification edition="200601120260327B">C22C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商千住金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENJU METAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木滋人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, SHIGETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡直正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, NAOMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小賀俊輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松藤貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUFUJI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙木朋子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, TOMOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之焊料膏包含第一焊料合金粉末、第二焊料合金粉末、及助熔劑，其中，第一焊料合金粉末是含有Sn、Ag及In且Ag之含量為3.9質量%以上的合金的粉末，第二焊料合金粉末是含有Sn、Ag及Cu的合金的粉末。依據如此的焊料膏，可提高膏之熔融性，並謀求焊料接合部之破壞模式及高速剪切強度之適當化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The solder paste of the present invention comprises a first solder alloy powder, a second solder alloy powder, and a flux, wherein the first solder alloy powder is an alloy powder containing Sn, Ag, and In, with the Ag content being 3.9% by mass or more, and the second solder alloy powder is an alloy powder containing Sn, Ag, and Cu. According the solder paste, the meltability of the paste can be improved, and the fracture mode and high-speed shear strength of the solder joint part can be optimized.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1046" publication-number="202628614"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628614.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成半導體裝置的方法</chinese-title>  
        <english-title>METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D30/01</main-classification>  
        <further-classification edition="202601120260327B">H10P14/20</further-classification>  
        <further-classification edition="202601120260327B">H10P76/00</further-classification>  
        <further-classification edition="202601120260327B">H10P95/90</further-classification>  
        <further-classification edition="202601120260327B">H10P50/00</further-classification>  
        <further-classification edition="202601120260327B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SZU-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙　竹軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHA, CHU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫偉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOON, WEI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：形成下源極/汲極區域；在該下源極/汲極區域上方形成上源極/汲極區域；在該上源極/汲極區域上方形成接觸蝕刻終止層；及在該接觸蝕刻終止層上方形成層間介電層。該方法進一步包括以下步驟：使該層間介電層凹陷以形成第一凹槽；在該第一凹槽中形成第一硬遮罩；及在該第一凹槽中及該第一硬遮罩上方形成第二硬遮罩。移除該第二硬遮罩旁邊的虛設閘極堆疊以形成第二凹槽，且犧牲材料沈積至該第二凹槽中。對該犧牲材料進行化學機械研磨(CMP)製程，其中該犧牲材料的剩餘部分留在該第二凹槽中以形成犧牲區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a lower source/drain region, forming a upper source/drain region over the lower source/drain region, forming a contact etch stop layer over the upper source/drain region, and forming an inter-layer dielectric over the contact etch stop layer. The method further includes recessing the inter-layer dielectric to form a first recess, forming a first hard mask in the first recess, and forming a second hard mask in the first recess and over the first hard mask. A dummy gate stack aside of the second hard mask is removed to form a second recess, and a sacrificial material is deposited into the second recess. A chemical mechanical polish (CMP) process is performed on the sacrificial material, wherein remaining portion of the sacrificial material is left in the second recess to form a sacrificial region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:製程流程</p>  
        <p type="p">202、204、205、206、208、210、212、214、216、218、220、222、224、226、228、230、232、234、236、238、240:製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1047" publication-number="202628103"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628103.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G11C16/02</main-classification>  
        <further-classification edition="200601120260302B">G11C7/12</further-classification>  
        <further-classification edition="200601120260302B">G11C7/14</further-classification>  
        <further-classification edition="200601120260302B">G11C8/08</further-classification>  
        <further-classification edition="202301120260302B">H10B69/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本寿文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, TOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明將提高記憶裝置之動作特性。 實施方式之記憶裝置具備：第1串，其包含第1記憶胞與第1電晶體；第2串，其包含第2記憶胞與第2電晶體；字元線，其連接於上述第1及上述第2記憶胞之閘極；第1配線，其連接於上述第1電晶體之閘極；第2配線，其連接於上述第2電晶體之閘極，且與上述第1配線相鄰；及控制電路，其控制上述第1及第2串之動作；且上述控制電路於對上述第1串執行動作時，對上述字元線施加正的第1電壓，對上述第1配線施加正的第2電壓，對上述第2配線施加負的第3電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">MP:記憶體柱</p>  
        <p type="p">SGD0,SGD1,SGD2,SGD3:汲極側選擇閘極線</p>  
        <p type="p">SGD-SEL:選擇汲極側選擇閘極線</p>  
        <p type="p">SGD-USEL1:相鄰汲極側選擇閘極線</p>  
        <p type="p">SGD-USEL2:非選擇汲極側選擇閘極線</p>  
        <p type="p">SGS0,SGS1,SGS2,SGS3:源極側選擇閘極線</p>  
        <p type="p">SGS-SEL:選擇源極側選擇閘極線</p>  
        <p type="p">SGS-USEL1:相鄰源極側選擇閘極線</p>  
        <p type="p">SGS-USEL2:非選擇源極側選擇閘極線</p>  
        <p type="p">SU0,SU1,SU2,SU3:串單元</p>  
        <p type="p">VOFF1:電壓</p>  
        <p type="p">VOFF2:電壓(非選擇電壓)</p>  
        <p type="p">VON:電壓(選擇電壓)</p>  
        <p type="p">WL0~WL7:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1048" publication-number="202628673"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628673.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置和形成半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202601120260327B">H10D84/01</further-classification>  
        <further-classification edition="202601120260327B">H10P14/00</further-classification>  
        <further-classification edition="201101120260327B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何士融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHIH-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括第一源極/汲極區域；在第一源極/汲極區域上的第一矽化物區域；與第一源極/汲極區域鄰近的第一奈米結構；與第一源極/汲極區域重疊的第二源極/汲極區域；以及在第二源極/汲極區域上的第二矽化物區域。第一矽化物區域包含第一金屬其不同於第二矽化物區域所包含的第二金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a first source/drain region; a first silicide region on the first source/drain region; first nanostructures adjacent to the first source/drain region; a second source/drain region overlapping the first source/drain region; and a second silicide region on the second source/drain region. The first silicide region comprises a first metal that is different from a second metal comprised by the second silicide region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:蝕刻停止層</p>  
        <p type="p">106:第三層間介電質</p>  
        <p type="p">110:觸點間隔物</p>  
        <p type="p">112L:下部矽化物區域</p>  
        <p type="p">118:上部矽化物區域</p>  
        <p type="p">120:上部源極/汲極觸點(源極/汲極觸點)</p>  
        <p type="p">122:裝置層</p>  
        <p type="p">128:前側互連結構</p>  
        <p type="p">130:觸點導孔</p>  
        <p type="p">132:觸點間隔物</p>  
        <p type="p">134:背側互連結構</p>  
        <p type="p">45:鰭片間隔物</p>  
        <p type="p">62L:下部外延的源極/汲極區域</p>  
        <p type="p">62U:上部外延的源極/汲極區域</p>  
        <p type="p">66:第一接觸蝕刻停止層</p>  
        <p type="p">68:第一層間介電質</p>  
        <p type="p">70:第二接觸蝕刻停止層</p>  
        <p type="p">72:第二層間介電質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1049" publication-number="202627559"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627559.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其操作方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G02B6/122</main-classification>  
        <further-classification edition="200601120260325B">G02B6/34</further-classification>  
        <further-classification edition="200601120260325B">G02B6/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒家翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，其包括形成光子引擎。光子引擎的形成包括：接收包括多個光柵耦合器的光子晶片，以及將多個微透鏡貼附到光子晶片。多個光柵耦合器和多個微透鏡被配置為以一對一對應關係進行光學互耦合。光纖組裝單元被貼附到光子引擎。光纖組裝單元包括光纖以及雷射合併單元，且雷射合併單元被配置以光學互耦合多個微透鏡和光纖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a photonic engine. The formation of the photonic engine includes receiving a photonic die including a plurality of grating couplers, and a plurality of micro lenses attached to the photonic die. The plurality of grating couplers and the plurality of micro lenses are configured to be optically inter-coupled in a one-to-one correspondence. A fiber assembly unit is attached to the photonic engine. The fiber assembly unit includes an optical fiber, and a laser merging unit configured to optically inter-couple the plurality of micro lenses and the optical fiber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">84-1-1、84-2-1、84-3-1、84-4-1:微透鏡</p>  
        <p type="p">104:封裝</p>  
        <p type="p">106:光纖組裝單元</p>  
        <p type="p">107:雷射合併單元</p>  
        <p type="p">112:光纖</p>  
        <p type="p">114、114A、114B、114C、114D:雷射光束</p>  
        <p type="p">120、126:反射器</p>  
        <p type="p">122、122A、122B、122C、122D:帶通濾波器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1050" publication-number="202628605"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628605.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116830</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的形成方法</chinese-title>  
        <english-title>FORMING METHOD OF SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D1/68</main-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭榮賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, JUNG TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置的形成方法包含形成延伸於第一方向的多個第一圖案在基板上的第一硬遮罩層中，其中第一圖案中的每一者包含第一中央區段以及兩第一末端區段；形成延伸於不同於第一方向的第二方向的多個第二圖案在基板上的第二硬遮罩層中，其中第二圖案中的每一者包含第二中央區段以及兩第二末端區段；透過使用第一圖案與第二圖案形成孔洞圖案於第三硬遮罩層中，其中第三硬遮罩層位在基板上方以及位在第一硬遮罩層與第二硬遮罩層下方；形成光阻層以覆蓋第二圖案的第二中央區段；以及移除第一圖案的第一末端區段以及第二圖案的第二末端區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A forming method of a semiconductor device includes forming multiple first patterns extending along a first direction in a first hard mask layer on a substrate, forming multiple second patterns extending along a second direction in a second hard mask layer on the substrate, forming a hole pattern in a third hard mask layer by using the first patterns and the second patterns, forming a resist layer covering the first center sections of the first patterns, and the second center sections of the second patterns, and removing the end sections of the first patterns and the end sections of the second patterns. Each of the first patterns and the second patterns includes a first center section and two first end sections.&lt;br/&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">142:孔洞圖案</p>  
        <p type="p">180:光阻層</p>  
        <p type="p">182:第一邊緣</p>  
        <p type="p">184:第二邊緣</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">L1:第一距離</p>  
        <p type="p">L2:第二距離</p>  
        <p type="p">8B-8B:線段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1051" publication-number="202627005"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627005.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260326B">C09J7/00</main-classification>  
        <further-classification edition="201801120260326B">C09J7/38</further-classification>  
        <further-classification edition="200601120260326B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田哲士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福井悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西改美希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIKAI, MIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>形見普史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAMI, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本真也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於貼合於被黏著體而彎折時，不易於彎折部產生折痕之黏著片。 &lt;br/&gt;黏著片10至少具備黏著劑層1。黏著劑層1於同一面內具有分別為一條線狀之第一區域11及第二區域12。第一區域11與第二區域12平行，第一區域11與第二區域12之物性不同。第一區域11與第二區域12較佳為硬度不同。第一區域11及第二區域12亦可分別為一條直線狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:黏著劑層</p>  
        <p type="p">2:剝離襯墊</p>  
        <p type="p">10:黏著片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1052" publication-number="202628615"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628615.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">H10D30/01</main-classification>  
        <further-classification edition="202501120260318B">H10D30/62</further-classification>  
        <further-classification edition="202601120260318B">H10P32/10</further-classification>  
        <further-classification edition="202601120260318B">H10P95/90</further-classification>  
        <further-classification edition="201101120260318B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育樟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游明華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括形成一多層堆疊，該多層堆疊包括複數個半導體奈米結構及複數個犧牲層。該些半導體奈米結構及該些犧牲層經交替地定位。該方法進一步包括：使該些犧牲層側向凹入以形成側向凹部；執行一摻雜製程以將一第一摻雜劑摻雜至該些側向凹部中；在該些側向凹部中形成內部間隔物；執行一退火製程以將該第一摻雜劑擴散至該些內部間隔物中；及形成接觸該些內部間隔物的一源極/汲極區，其中該源極/汲極區電耦接至該些半導體奈米結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a multilayer stack, which includes a plurality of semiconductor nanostructures and a plurality of sacrificial layers. The plurality of semiconductor nanostructures and the plurality of sacrificial layers are located alternatingly. The method further includes laterally recessing the plurality of sacrificial layers to form lateral recesses, performing a doping process to dope a first dopant into the lateral recesses, forming inner spacers in the lateral recesses, performing an anneal process to diffuse the first dopant into the inner spacers, and forming a source/drain region contacting the inner spacers, wherein the source/drain region is electrically coupled to the plurality of semiconductor nanostructures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板</p>  
        <p type="p">22B:第二層/半導體層/奈米結構</p>  
        <p type="p">28:鰭片/橫截面</p>  
        <p type="p">29:橫截面</p>  
        <p type="p">30:虛設閘極堆疊/橫截面</p>  
        <p type="p">31:橫截面</p>  
        <p type="p">38:閘極間隔物</p>  
        <p type="p">44:內部間隔物</p>  
        <p type="p">47:區</p>  
        <p type="p">48:源極/汲極區</p>  
        <p type="p">48’:部分/LDD區</p>  
        <p type="p">48A:半導體層</p>  
        <p type="p">48B:部分/源極/汲極區/半導體層</p>  
        <p type="p">48C:頂蓋層</p>  
        <p type="p">50:接觸蝕刻終止層(CESL)</p>  
        <p type="p">52:層間介電質(ILD)</p>  
        <p type="p">62:閘極介電質</p>  
        <p type="p">68:閘極電極</p>  
        <p type="p">70:閘極堆疊</p>  
        <p type="p">82:電晶體</p>  
        <p type="p">114:富摻雜劑層</p>  
        <p type="p">114B,114C:部分/富摻雜劑層</p>  
        <p type="p">114B&lt;sub&gt;L&lt;/sub&gt;:部分</p>  
        <p type="p">114B&lt;sub&gt;S&lt;/sub&gt;:部分</p>  
        <p type="p">114B&lt;sub&gt;U&lt;/sub&gt;:部分</p>  
        <p type="p">120:箭頭</p>  
        <p type="p">H&lt;sub&gt;114&lt;/sub&gt;:高度/厚度/值</p>  
        <p type="p">H&lt;sub&gt;22B&lt;/sub&gt;:值</p>  
        <p type="p">H&lt;sub&gt;INSP&lt;/sub&gt;:值</p>  
        <p type="p">L&lt;sub&gt;A&lt;/sub&gt;:長度/值</p>  
        <p type="p">L&lt;sub&gt;B&lt;/sub&gt;:值</p>  
        <p type="p">L&lt;sub&gt;INSP&lt;/sub&gt;:值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1053" publication-number="202626527"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626527.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用了廢酸或廢鹼的離子交換樹脂之再生系統及再生方法</chinese-title>  
        <english-title>ION EXCHANGE RESIN REGENERATION SYSTEM AND REGENERATION METHOD USING WASTE ACID OR WASTE ALKALI</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260327B">C02F1/42</main-classification>  
        <further-classification edition="201701120260327B">B01J49/53</further-classification>  
        <further-classification edition="201701120260327B">B01J49/57</further-classification>  
        <further-classification edition="201701120260327B">B01J39/05</further-classification>  
        <further-classification edition="201701120260327B">B01J41/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本浩一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤沙耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, SAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤美和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, MIWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可藉由簡便之方法製得穩定品質之處理水的、使用了廢酸或廢鹼的離子交換樹脂之再生系統。離子交換樹脂之再生系統的特徵為具有：槽1，其貯存包含雜質之廢酸或廢鹼；測量設備，其測量廢酸或廢鹼中的雜質之濃度；判定設備，其依據雜質之濃度，判斷可否再利用廢酸或廢鹼；及再生設備3，其使用由判定設備判斷為可再利用之廢酸或廢鹼再生離子交換樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide an ion exchange resin regeneration system which uses waste acid or waste alkali and is capable of obtaining a treated water of stable quality using a simple method. The ion exchange resin regeneration system of the invention has a tank 1 which stores a waste acid or waste alkali containing impurities, a measurement device which measures the concentration of impurities in the waste acid or waste alkali, a judgment device which determines whether or not the waste acid or waste alkali can be reused based on the concentration of the impurities, and a regeneration device 3 which regenerates the ion exchange resin using the waste acid or waste alkali determined as reusable by the judgment device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:廢液槽</p>  
        <p type="p">2:再利用化學液槽</p>  
        <p type="p">3:再生設備；陽離子交換樹脂塔；陰離子交換樹脂塔</p>  
        <p type="p">L1,L2,L3,L4,L5:流路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1054" publication-number="202629043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置以及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10W74/10</main-classification>  
        <further-classification edition="202601120260330B">H10W74/01</further-classification>  
        <further-classification edition="202601120260330B">H10W70/62</further-classification>  
        <further-classification edition="202601120260330B">H10W70/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳易良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何家齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JENG-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，其包括電子元件、封裝層、電路結構與接合元件。封裝層圍繞電子元件。電路結構電性連接電子元件，電路結構包括導電圖案。接合元件重疊導電圖案，並設置於導電圖案的凹槽中。導電圖案包括第一部分、第二部分以及第三部分，第三部分連接第一部分與第二部分，接合元件重疊第三部分，且第一部分的寬度不同於第二部分的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes an electronic component, a packaging layer, a circuit structure and a bonding component. The packaging layer surrounds the electronic component. The circuit structure is electrically connected to the electronic component, and the circuit structure includes a conductive pattern. The bonding component overlaps the conductive pattern and disposed in a recess of the conductive pattern. The conductive pattern includes a first portion, a second portion and a third portion, the third portion is connected to the first portion and the second portion, the bonding component overlaps the third portion, and a width of the first portion is different from a width of the second portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:電子元件</p>  
        <p type="p">120:電路結構</p>  
        <p type="p">122,124,126,160:導電層</p>  
        <p type="p">122P:導電圖案</p>  
        <p type="p">122Pa:第一部分</p>  
        <p type="p">122Pb:第二部分</p>  
        <p type="p">122Pc:第三部分</p>  
        <p type="p">122S:凹槽</p>  
        <p type="p">122Sw:側壁</p>  
        <p type="p">126D:連接墊</p>  
        <p type="p">128a,128b,128c:絕緣層</p>  
        <p type="p">130:連接件</p>  
        <p type="p">140:封裝層</p>  
        <p type="p">150:接合元件</p>  
        <p type="p">DH:深度</p>  
        <p type="p">TH:厚度</p>  
        <p type="p">W1,W2,W3:寬度</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1055" publication-number="202628616"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628616.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構與其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260330B">H10D30/01</main-classification>  
        <further-classification edition="202501120260330B">H10D30/43</further-classification>  
        <further-classification edition="202501120260330B">H10D30/62</further-classification>  
        <further-classification edition="202501120260330B">H10D62/10</further-classification>  
        <further-classification edition="202601120260330B">H10P50/24</further-classification>  
        <further-classification edition="202601120260330B">H10P14/20</further-classification>  
        <further-classification edition="202601120260330B">H10P95/90</further-classification>  
        <further-classification edition="202601120260330B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹舜翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHAN, SHUN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋學昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, HSUEH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游明華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李啟弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHII-HORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體結構及其製造方法。一種根據本揭示之方法包含：基板及包含與通道層交錯之犧牲層的一鰭狀結構；在鰭狀結構上方形成虛設閘極堆疊；沿著虛設閘極堆疊之側壁形成閘極間隔物層；在鰭狀結構中形成源極/汲極溝槽；部分地蝕刻犧牲層以形成內部間隔物凹槽；在內部間隔物凹槽中形成內部間隔物特徵；在源極/汲極溝槽中形成源極/汲極特徵；移除虛設閘極堆疊；選擇性蝕刻犧牲層以釋放通道層成為通道部件；清洗複數個通道部件；在通道部件上方磊晶沉積半導體層；對半導體層進行退火；以及形成環繞通道部件中之各者的閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor structures and methods of forming the same are provided. A method according to the present disclosure includes a substrate and a fin-shaped structure that include sacrificial layers interleaved by channel layers, forming a dummy gate stack over the fin-shaped structure, forming a gate spacer layer along sidewalls of the dummy gate stack, forming source/drain trenches in the fin-shaped structure, partially etching the sacrificial layers to form inner spacer recesses, forming inner spacer features in the inner spacer recesses, forming source/drain features in the source/drain trenches, removing the dummy gate stack, selectively etching the sacrificial layers to release the channel layer as channel members, cleaning the plurality of channel members, epitaxially depositing a semiconductor layer over the channel members, annealing the semiconductor layer, and forming a gate structure to wrap around each of the channel members.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:方塊</p>  
        <p type="p">104:方塊</p>  
        <p type="p">106:方塊</p>  
        <p type="p">108:方塊</p>  
        <p type="p">110:方塊</p>  
        <p type="p">112:方塊</p>  
        <p type="p">114:方塊</p>  
        <p type="p">116:方塊</p>  
        <p type="p">118:方塊</p>  
        <p type="p">120:方塊</p>  
        <p type="p">122:方塊</p>  
        <p type="p">124:方塊</p>  
        <p type="p">126:方塊</p>  
        <p type="p">128:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1056" publication-number="202628068"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628068.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在觸控感測中用於校正及同步的驅動系統及驅動電路</chinese-title>  
        <english-title>DRIVING SYSTEM AND DRIVER CIRCUIT FOR CALIBRATION AND SYNCHRONIZATION IN TOUCH SENSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250905B">G09G5/18</main-classification>  
        <further-classification edition="200601120250905B">G09G3/20</further-classification>  
        <further-classification edition="200601120250905B">G02F1/133</further-classification>  
        <further-classification edition="200601120250905B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐崇毓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張婉茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種驅動系統，包含有串接的複數個驅動電路，其中每一驅動電路透過一主控端及一從屬端連接於一或二個相鄰的驅動電路。該複數個驅動電路包含有一第一驅動電路及一第二驅動電路。該第一驅動電路用來透過該主控端輸出一第一同步訊號。該第二驅動電路用來在透過該主控端接收到該第一同步訊號時，透過該從屬端輸出一第二同步訊號。其中，該第二驅動電路相對應的一補償時間係根據該第一同步訊號之一輸出時間點及該第二同步訊號之一接收時間點來計算。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving system includes a plurality of driver circuits connected in series, wherein each of the plurality of driver circuits is connected to one or two adjacent driver circuits through a master terminal and a slave terminal. The plurality of driver circuits include a first driver circuit and a second driver circuit. The first driver circuit outputs a first synchronization signal through the master terminal. The second driver circuit outputs a second synchronization signal through the slave terminal when receiving the first synchronization signal through the master terminal. A compensation time corresponding to the second driver circuit is calculated according to an output time point of the first synchronization signal and a reception time point of the second synchronization signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:驅動系統</p>  
        <p type="p">102:主控電路</p>  
        <p type="p">104,106,108,110:從屬電路</p>  
        <p type="p">M_ML,M_MR,SL1_MR,SL2_ML,SL2_MR,SR1_ML,SR2_ML,SR2_MR:主控端</p>  
        <p type="p">M_SL,M_SR,SL1_SR,SL2_SL,SL2_SR,SR1_SL,SR2_SL,SR2_SR:從屬端</p>  
        <p type="p">SCTL:同步控制器</p>  
        <p type="p">SYNC1_L,SYNC2_L,SYNC1_R,SYNC2_R:同步訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1057" publication-number="202628968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117408</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/00</main-classification>  
        <further-classification edition="202601120260302B">H10P14/40</further-classification>  
        <further-classification edition="202601120260302B">H10W20/20</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="200601120260302B">C23C16/42</further-classification>  
        <further-classification edition="200601120260302B">C23C16/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王謙和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEN-HE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許仲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIU, JUNG-HAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏孝寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, HSIAO-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露呈現半導體裝置及其製造方法，方法包括：在半導體基板上方形成多個金屬化層；在該些金屬化層上方形成第一重分佈層；在第一重分佈層上方沉積蝕刻終止層，形成蝕刻終止層包括形成第一富矽區及形成第一富氮區；及穿過蝕刻終止層形成第一接合襯墊通孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices and methods of manufacture are presented which includes: forming metallization layers over a semiconductor substrate; forming a first redistribution layer over the metallization layers; depositing an etch stop layer over the first redistribution layer, the forming the etch stop layer including: forming a first silicon rich region; and forming a first nitrogen rich region; and forming a first bond pad via through the etch stop layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:半導體基板</p>  
        <p type="p">103:金屬化層</p>  
        <p type="p">105:第一阻障層</p>  
        <p type="p">107:第一RDL</p>  
        <p type="p">111:頂部金屬層</p>  
        <p type="p">113:混雜區</p>  
        <p type="p">303:第一蝕刻終止層</p>  
        <p type="p">401:第一鈍化層</p>  
        <p type="p">403:第二鈍化層</p>  
        <p type="p">405:第三鈍化層</p>  
        <p type="p">501:第二蝕刻終止層</p>  
        <p type="p">503:第四鈍化層</p>  
        <p type="p">505:第三蝕刻終止層</p>  
        <p type="p">507:第五鈍化層</p>  
        <p type="p">509:第六鈍化層</p>  
        <p type="p">901:第二阻障層</p>  
        <p type="p">903:導電材料</p>  
        <p type="p">1001:第一接合襯墊通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1058" publication-number="202627518"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627518.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於UWB測距功能實現的車輛精確定位方法</chinese-title>  
        <english-title>PRECISE VEHICLE POSITIONING METHOD BASED ON UWB RANGING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">G01S5/14</main-classification>  
        <further-classification edition="200601120250703B">G08G1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商輝創電子科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHETRON ELECTRONICS (SUZHOU)CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫傳亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHUANLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尚飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHANGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余奕賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於UWB測距功能實現的車輛精確定位方法，改變傳統的定位方法，將錨點設定在停車位的感應線圈上，同時對應車輛本身的外形錨點，從而實現車輛定位，同時定位充電用感應線圈。本發明的車輛精確定位方法利用車端錨點比傳統利用車位錨點的方法可以更加精確的定位充電線圈的位置，減少位置誤差，且在車輛原有的UWB系統中就可以實現，不需要在重新佈置定位系統，降低使用成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A precise vehicle positioning method is based on the UWB ranging function. The method changes the traditional positioning method by setting the anchor points on the induction coil of the parking space and corresponding to the shape anchor points of the vehicle itself, thereby achieving vehicle positioning and the charging induction coil positioning at the same time. The precise vehicle positioning method of the present invention uses anchor point on the vehicle end, and has the function that the position of the charging coil can be more accurately positioned and the position error can be greater reduced than the traditional method using anchor points on the parking space. The present invention can be implemented in the original UWB system of the vehicle without the need to rearrange the positioning system, thereby reducing the use cost.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1059" publication-number="202627030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117599</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>撥水劑組成物</chinese-title>  
        <english-title>WATER REPELLENT COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C09K3/18</main-classification>  
        <further-classification edition="200601120260326B">D06M15/643</further-classification>  
        <further-classification edition="200601120260326B">D06M15/53</further-classification>  
        <further-classification edition="200601120260326B">C08L83/04</further-classification>  
        <further-classification edition="200601120260326B">C09D183/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福本可奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, KANAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀川希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIKAWA, NOZOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井置正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IOKI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種撥水劑組成物，係含有合成纖維之纖維製品用的撥水劑組成物， &lt;br/&gt;前述撥水劑組成物含有由聚矽氧油及聚矽氧樹脂所構成之聚矽氧化合物， &lt;br/&gt;於前述聚矽氧化合物的GPC圖中，在分子量1500以上的區域中存在有頂峰， &lt;br/&gt;前述聚矽氧化合物中，分子量1500以上的成分含有胺基改性聚矽氧以外的聚矽氧油， &lt;br/&gt;相對於聚矽氧化合物，前述聚矽氧樹脂的量為32重量%以下。本揭示之撥水劑組成物可將良好的撥水與良好的抗白粉斑性賦予至基材(尤其是纖維製品)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a water-repellent composition for fibrous products comprising synthetic fibers. &lt;br/&gt;The water-repellent composition comprises a silicone compound including a silicone oil and a silicone resin. &lt;br/&gt;In the GPC chromatogram of the silicone compound, a peak is present in the region of 1500 or higher molecular weight. &lt;br/&gt;Among the silicone compound, components with a molecular weight of 1500 or higher comprises a silicone oil other than amino-modified silicone. &lt;br/&gt;The amount of the silicone resin is 32% by weight or less relative to the silicone compound. The water-repellent composition of the present disclosure is capable of imparting excellent water repellency and good anti-white spot properties to a substrate (particularly a fibrous product).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1060" publication-number="202628674"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628674.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117640</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置和其形成的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202601120260327B">H10D84/01</further-classification>  
        <further-classification edition="202501120260327B">H10D62/10</further-classification>  
        <further-classification edition="202501120260327B">H10D62/60</further-classification>  
        <further-classification edition="201101120260327B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李益誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, TA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游明華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括在基板上方形成n型奈米結構的堆疊；在基板上方形成p型奈米結構的堆疊；對n型奈米結構的堆疊和p型奈米結構的堆疊執行修整製程，其中修整製程以第一速率來蝕刻n型奈米結構的表面，並以不同於第一速率的第二速率來蝕刻p型奈米結構的表面；在n型奈米結構的堆疊上形成第一閘極結構；以及在p型奈米結構的堆疊上形成第二閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a stack of n-type nanostructures over a substrate; forming a stack of p-type nanostructures over the substrate; performing a trim process on the stack of n-type nanostructures and the stack of p-type nanostructures, wherein the trim process etches surfaces of the n-type nanostructures at a first rate and etches surfaces of the p-type nanostructures at a second rate that is different from the first rate; forming a first gate structure on the stack of n-type nanostructures; and forming a second gate structure on the stack of p-type nanostructures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:源極/汲極區域</p>  
        <p type="p">50N:n型區域</p>  
        <p type="p">50P:p型區域</p>  
        <p type="p">66:奈米結構</p>  
        <p type="p">98:內部間隔物</p>  
        <p type="p">HN:高度差異</p>  
        <p type="p">HP:高度差異</p>  
        <p type="p">L1:長度</p>  
        <p type="p">LN0:片長度</p>  
        <p type="p">LP0:片長度</p>  
        <p type="p">T0:厚度</p>  
        <p type="p">TN0:厚度</p>  
        <p type="p">TP0:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1061" publication-number="202629034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629034.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10W72/90</main-classification>  
        <further-classification edition="202601120260316B">H10W46/00</further-classification>  
        <further-classification edition="202601120260316B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫成旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, SEONGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李圭夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KYUHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣妵希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JOOHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體封裝包括：半導體晶片；第一接合層，包括沿豎直方向依序堆疊於半導體晶片上的第一內部接合層及第一外部接合層；第一內部接合墊及第一內部對準鍵圖案，所述第一內部接合墊在基板的接合區上容納於第一內部接合層中，所述第一內部對準鍵圖案在基板的對準鍵區上容納於第一內部接合層中；第一外部接合墊及第一外部對準鍵圖案，所述第一外部接合墊在基板的接合區上容納於第一外部接合層中，所述第一外部對準鍵圖案在基板的接合區上容納於第一外部接合層中；第二接合層，包括沿豎直方向依序堆疊於第一接合層上的第二外部接合層及第二內部接合層；以及第二半導體晶片，設置於第二接合層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The semiconductor package includes a semiconductor chip; a first bonding layer including a first inner bonding layer and a first outer bonding layer sequentially stacked on the semiconductor chip along a vertical direction; first inner bonding pads accommodated in the first inner bonding layer on the bonding region of the substrate, and first inner align key patterns accommodated in the first inner bonding layer on the align key region of the substrate; first outer bonding pads accommodated in the first outer bonding layer on the bonding region of the substrate and first outer align key patterns accommodated in the first outer bonding layer on the bonding region of the substrate; a second bonding layer including a second outer bonding layer and a second inner bonding layer sequentially stacked on the first bonding layer along the vertical direction; and a second semiconductor chip disposed on the second bonding layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一半導體晶片</p>  
        <p type="p">110:第一基板</p>  
        <p type="p">114:第二表面</p>  
        <p type="p">120:第一貫穿電極</p>  
        <p type="p">200:第二半導體晶片</p>  
        <p type="p">210:第二基板</p>  
        <p type="p">212:第一表面</p>  
        <p type="p">220:第二貫穿電極</p>  
        <p type="p">230:第二絕緣間層</p>  
        <p type="p">231:第二電路圖案</p>  
        <p type="p">233:第二配線結構</p>  
        <p type="p">710:第一接合層</p>  
        <p type="p">710a:第一內部接合層</p>  
        <p type="p">710b:第一外部接合層</p>  
        <p type="p">715、725:接合墊</p>  
        <p type="p">715a:第一內部接合墊</p>  
        <p type="p">715b:第一外部接合墊</p>  
        <p type="p">717:第一對準鍵圖案</p>  
        <p type="p">717a:第一內部對準鍵圖案</p>  
        <p type="p">717b:第一外部對準鍵圖案</p>  
        <p type="p">720:第二接合層</p>  
        <p type="p">720a:第二內部接合層</p>  
        <p type="p">720b:第二外部接合層</p>  
        <p type="p">725a:第二內部接合墊</p>  
        <p type="p">725b:第二外部接合墊</p>  
        <p type="p">727:第二對準鍵圖案</p>  
        <p type="p">727a:第二內部對準鍵圖案</p>  
        <p type="p">727b:第二外部對準鍵圖案</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p>  
        <p type="p">T3:第三厚度</p>  
        <p type="p">T4:第四厚度</p>  
        <p type="p">X:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1062" publication-number="202628926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10P72/72</main-classification>  
        <further-classification edition="200601120260330B">H02N13/00</further-classification>  
        <further-classification edition="200601120260330B">H05B3/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木健介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中尾詩織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAO, SHIORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅津智樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMETSU, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可進行利用加熱器進行的精密的溫度調整之靜電吸盤。。&lt;br/&gt;本發明的解決手段為一種靜電吸盤10，包含：介電質基板100；將介電基板100加熱之加熱器單元300。在俯視下，加熱器單元300在彼此不重疊而被劃分的複數個區域HA的各個中，具有個別地且被圈繞成線狀的導體之發熱部331。複數個區域HA包含：配置於成為最外周側的位置之第一區域HA1；配置於成為比第一區域HA1還靠內周側的位置之第二區域HA2。在第一區域HA1中被圈繞的發熱部331的線寬小於在第二區域HA2中被圈繞的發熱部331的線寬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">330:副加熱器層</p>  
        <p type="p">331:發熱部</p>  
        <p type="p">332、333:墊部</p>  
        <p type="p">HA:區域</p>  
        <p type="p">HA1:第一區域</p>  
        <p type="p">HA2:第二區域</p>  
        <p type="p">D11、D12:尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1063" publication-number="202628675"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628675.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202601120260327B">H10D84/01</further-classification>  
        <further-classification edition="202501120260327B">H10D89/10</further-classification>  
        <further-classification edition="202601120260327B">H10P50/60</further-classification>  
        <further-classification edition="202601120260327B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何士融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHIH-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王冠人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, GUAN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅弘焜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, HUNG-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石哲齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHE CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江育賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的一個態樣是關於一種方法。方法包括在基板上方形成堆疊半導體裝置，堆疊半導體裝置具有位於底部電晶體上方的頂部電晶體。第一中間層介電(ILD)層垂直地安置於頂部電晶體與底部電晶體之間。方法包括形成穿過頂部電晶體的頂部源極/汲極(S/D)特徵且穿過第一ILD層的溝槽，以暴露底部電晶體的底部S/D特徵。方法包括在溝槽中的第一ILD層的側壁上方形成保護層。方法包括在形成保護層之後在溝槽中執行預清洗蝕刻步驟，及在溝槽中形成金屬觸點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the present disclosure pertains to a method. The method includes forming a stacked semiconductor device over a substrate, the stacked semiconductor device has a top transistor over a bottom transistor. A first interlayer dielectric (ILD) layer is vertically disposed between the top and the bottom transistors. The method includes forming a trench through a top source/drain (S/D) feature of the top transistor and through the first ILD layer to expose a bottom S/D feature of the bottom transistor. The method includes forming a protection layer over sidewalls of the first ILD layer in the trench. The method includes performing a pre-cleaning etch step in the trench after the protection layer is formed and forming a metal contact in the trench.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1200:方法</p>  
        <p type="p">1202、1204、1206、1208、1210、1212:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1064" publication-number="202627999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物體抓取控制方法及系統</chinese-title>  
        <english-title>CONTROL METHOD AND SYSTEM FOR GRASPING OBJECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250801B">G06V10/46</main-classification>  
        <further-classification edition="201701120250801B">G06T7/564</further-classification>  
        <further-classification edition="202201120250801B">G06V10/774</further-classification>  
        <further-classification edition="200601120250801B">B25J13/08</further-classification>  
        <further-classification edition="200601120250801B">B25J19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商富聯裕展科技（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULIAN YUZHAN PRECISION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖弼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-PI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊家榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIA-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳瑞霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪譽禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種物體抓取控制方法及系統，所述方法包括：接收第一圖像以及第二圖像；將第一圖像輸入姿態檢測模型得到複數圖像特徵點；基於複數圖像特徵點確定的點雲與第二圖像的模型特徵點，計算的轉換矩陣；基於轉換矩陣、物體模型上標記的虛擬位置、攝像設備相對於機械手的位置，得到複數第一抓取位置；確定每個第一抓取位置相應的第一抓取姿態；基於機器人的當前姿態，確定抓取角度；基於抓取角度，從複數第一抓取位置中確定目標抓取位置；驅動機器人控制機械手在目標抓取位置抓取物體。上述方法能夠提高機器人抓取物體的效率與準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a control method and system for grasping objects . The method includes: receiving a first image and a second image; inputting the first image into a pose detection model and obtaining a plurality of image feature points; calculating a transformation matrix based on a point cloud determined by the image feature points and model feature points of the second image; determining a plurality of preliminary grasping positions using the transformation matrix, virtual markers on an object model, and a camera's position that is related to a robotic arm; determining a grasping pose corresponding to each of the preliminary grasping positions; calculating a grasping angle based on a current pose of a robot; selecting an optimized grasping position from the preliminary grasping positions according to the grasping angle; and driving the robot to control the robotic arm to grasp the object at the optimized grasping position. The above method enhances the efficiency and accuracy of robotic for grasping objects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S209:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1065" publication-number="202626967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱軟化性熱傳導性組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C08L83/04</main-classification>  
        <further-classification edition="200601120260327B">C08L83/07</further-classification>  
        <further-classification edition="200601120260327B">C08K3/22</further-classification>  
        <further-classification edition="200601120260327B">C08K3/08</further-classification>  
        <further-classification edition="200601120260327B">C09K5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣中裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRONAKA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村一晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, ISSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今泉圭司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAIZUMI, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種相較於以往產品熔融時的黏度較低、熱阻也較低的熱軟化性熱傳導性組合物。 &lt;br/&gt;一種包含下述(A)成分、(B)成分及(C)成分的熱軟化性熱傳導性組合物。 &lt;br/&gt;(A)苯基改質矽酮樹脂，T單元及D單元在(A)成分中含有90～100mol%，苯基改質率為30～60mol% &lt;br/&gt;(B)加水分解性有機聚矽氧烷，以下述式(1)所表示 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="157px" width="458px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sup&gt;3&lt;/sup&gt;為碳原子數6～10的芳基，R&lt;sup&gt;4&lt;/sup&gt;為碳原子數1～10的烷基，x為2或3，n為0≤n≤15的數，m為2≤m≤60的數) &lt;br/&gt;(C)熱導性填充材，具有10W/(m・K)以上的熱傳導率、平均粒徑為0.3～20μm</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1066" publication-number="202627007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>補強膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260327B">C09J7/29</main-classification>  
        <further-classification edition="200601120260327B">B32B7/10</further-classification>  
        <further-classification edition="200601120260327B">C09J133/00</further-classification>  
        <further-classification edition="200601120260327B">C09J175/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西野智哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHINO, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種補強膜，其能夠於被黏著體之搬送時表現出良好之搬送性，並且例如於搬送後，能夠容易地實現無需補強之區域之剝離去除與需要補強之區域之黏著維持。 &lt;br/&gt;本發明之實施方式之補強膜係包含基材層A1與含有黏著劑a2之黏著劑層A2之1個以上之黏著膜A與包含基材層B1與含有黏著劑b2之黏著劑層B2之1個以上之黏著膜B以具有間隙之配置積層於包含基材層C1與含有黏著劑c2之黏著劑層C2之載體膜C上而成，該基材層A1與該基材層B1係直接積層於該黏著劑層C2上，並且黏著劑a2、黏著劑b2、黏著劑c2滿足特定條件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:基材層A1</p>  
        <p type="p">10B:基材層B1</p>  
        <p type="p">10C:基材層C1</p>  
        <p type="p">20A:黏著劑層A2</p>  
        <p type="p">20B:黏著劑層B2</p>  
        <p type="p">20C:黏著劑層C2</p>  
        <p type="p">200:載體膜C</p>  
        <p type="p">300A:黏著膜A</p>  
        <p type="p">300B:黏著膜B</p>  
        <p type="p">1000:補強膜</p>  
        <p type="p">2000:積層體</p>  
        <p type="p">3000:被黏著體</p>  
        <p type="p">4000:遮蔽板</p>  
        <p type="p">5000:活性能量線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1067" publication-number="202627014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117864</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面保護膜及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260327B">C09J7/40</main-classification>  
        <further-classification edition="200601120260327B">B32B7/12</further-classification>  
        <further-classification edition="201901120260327B">B32B7/06</further-classification>  
        <further-classification edition="200601120260327B">B32B27/20</further-classification>  
        <further-classification edition="200601120260327B">C09J133/00</further-classification>  
        <further-classification edition="201501120260327B">G02B1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山形真人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGATA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種表面保護膜，其依序具有基材層、黏著劑層及剝離襯墊，能夠防止將剝離襯墊剝離前之誤取，能夠防止使用時忘記將剝離襯墊剝離，且光學檢查性優異。又，提供一種包含此種表面保護膜之光學器件及電子器件。 &lt;br/&gt;本發明之實施方式之表面保護膜係依序具有基材層、黏著劑層及剝離襯墊者，且該表面保護膜整體之b*值為0.70以上，該表面保護膜整體之波長550 nm之光之透過率為85%以上，自該表面保護膜去除了該剝離襯墊之積層體之b*值未達0.50。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:剝離襯墊</p>  
        <p type="p">20:黏著劑層</p>  
        <p type="p">30:基材層</p>  
        <p type="p">100:表面保護膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1068" publication-number="202627893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251008B">G06N3/063</main-classification>  
        <further-classification edition="200601120251008B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊浩志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊浩志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木淳弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">現代是人工智慧（AI）的時代。目前支持人工智慧的半導體技術具有特殊規格和高性能，但功耗太大。若人工智慧的使用持續擴展，不僅電力的產生不足供應，而且人工智慧本身的使用也可能導致氣候變化。鑒於這種情況，本發明提出一種專用於人工智慧的半導體技術，可以大大降低功耗。傳統的人工智慧半導體晶片是擅長平行運算多個乘積和運算的處理器。高速且大規模並行化的處理器的功耗不斷增加。在本發明中，將該乘積和運算置換為專用嵌入電路而不是處理器，能夠大規模地抑制功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1069" publication-number="202626856"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626856.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伸萘基醚樹脂、樹脂組成物、硬化物、預浸體、電路基板、增層膜、半導體密封材、半導體裝置、及伸萘基醚樹脂的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G65/34</main-classification>  
        <further-classification edition="200601120260401B">C08G65/48</further-classification>  
        <further-classification edition="200601120260401B">C08L71/10</further-classification>  
        <further-classification edition="200601120260401B">C08J5/24</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="200601120260401B">H05K3/46</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迫雅樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZAMA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於：提供伸萘基醚樹脂，其可獲得低介電特性及低彈性特性優異之硬化物；及包含該伸萘基醚樹脂之樹脂組成物；以及低介電特性及低彈性特性優異之硬化物。 &lt;br/&gt;本發明之解決課題之技術手段係一種伸萘基醚樹脂，其由通式（1）表示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1070" publication-number="202628114"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628114.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>唯讀記憶體（ROM）裝置和方法</chinese-title>  
        <english-title>READ-ONLY MEMORY (ROM) DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C17/08</main-classification>  
        <further-classification edition="202301120251103B">H10B20/20</further-classification>  
        <further-classification edition="202001120251103B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大坪弘昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUBO, HIROMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建盈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯伊斯　小普雷西利亞諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUIZ JR., PRECILIANO ASINAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇野和正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNO, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小嶋英充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, HIDEMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱泰德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, TAI-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種唯讀記憶體（ROM）裝置包括沿第一方向延伸的主動區域，以及沿與第一方向交錯的第二方向延伸橫跨並在主動區域之上的多個閘極。多個閘極與主動區域一起對應配置成多個電晶體。多個電晶體中的每一者被配置為儲存資料。主動區域連續地延伸穿過多個閘極中的超過四個導電閘極並在其下方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A read-only memory (ROM) device includes an active region extending along a first direction, and a plurality of gates extending across and over the active region, along a second direction transverse to the first direction. The plurality of gates correspondingly configures, together with the active region, a plurality of transistors. Each of the plurality of transistors is configured to store a datum. The active region extends continuously across and under more than four conductive gates among the plurality of gates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700D:方法</p>  
        <p type="p">740、742、744:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1071" publication-number="202627674"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627674.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造奈米壓印微影術複製品的方法以及製造半導體裝置的方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING A NANOIMPRINT LITHOGRAPHY REPLICA AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">G03F7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧宇倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, YU-LUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李心源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂宣瑾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HSUAN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林華泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUA-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIEH, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈育佃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YU-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">製造奈米壓印微影術複製品的方法包括在基板上方沈積第一抗蝕劑層，及選擇性地暴露第一抗蝕劑層至第一光化輻射。顯影選擇性暴露之第一抗蝕劑層以在第一抗蝕劑層中形成圖案。將第一抗蝕劑層中之圖案延伸至基板中以在基板中形成模具。自基板移除第一抗蝕劑層。在複製品坯料上方沈積第二抗蝕劑層。使第二抗蝕劑層與模具接觸。將第二抗蝕劑層暴露至第二光化輻射。分離模具與經暴露的第二抗蝕劑層。圖案形成於經暴露的第二抗蝕劑層中。第二抗蝕劑層中之圖案延伸至複製品坯料中，且第二抗蝕劑層自複製品坯料移除以形成複製品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method of manufacturing a nanoimprint lithography replica includes depositing a first resist layer over a substrate and selectively exposing the first resist layer to a first actinic radiation. The selectively exposed first resist layer is developed to form a pattern in the first resist layer. The pattern in the first resist layer is extended into the substrate to form a mold in the substrate. The first resist layer is removed from the substrate. A second resist layer deposited over a replica blank. The second resist layer is contacted with the mold. The second resist layer is exposed to a second actinic radiation. The mold and the exposed second resist layer are separated. A pattern is formed in the exposed second resist layer. The pattern in the second resist layer is extended into the replica blank, and the second resist layer is removed from the replica blank to form a replica.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:光罩</p>  
        <p type="p">25:光化輻射/部分/輻射</p>  
        <p type="p">35:光學件</p>  
        <p type="p">40:模具基板</p>  
        <p type="p">50’:模具特徵</p>  
        <p type="p">50:模具/模具特徵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1072" publication-number="202627314"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627314.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接組件、連接系統及模具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">F16B12/14</main-classification>  
        <further-classification edition="200601120260323B">F16B12/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商精諾科技研究（廣東）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曉群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIAOQUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曉歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIAOHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇偉生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEISHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭玉武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUWU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種連接組件、連接系統及模具，卡槽件包括卡槽件本體，所述卡槽件本體的前側面形成有前凹槽，所述卡槽件本體的後側面形成有後凹槽，所述前凹槽的後側槽底的至少一部分與所述後凹槽的前側槽底的至少一部分相連通，所述前凹槽的上側內壁和/或所述後凹槽的上側內壁形成有解鎖部，所述解鎖部包括從上往下逐漸向後傾斜的解鎖面，所述前凹槽的左側內壁和/或右側內壁和/或下側內壁形成有凸緣部；其中，所述前凹槽用於配合模具沿前後方向脫模件，所述後凹槽用於配合模具沿前後方向脫模，所述卡槽件和所述伸縮卡榫相連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:卡槽件</p>  
        <p type="p">11:前凹槽</p>  
        <p type="p">13:解鎖部</p>  
        <p type="p">131:解鎖面</p>  
        <p type="p">14:凸緣部</p>  
        <p type="p">141:左傾斜面</p>  
        <p type="p">142:右傾斜面</p>  
        <p type="p">15:穿孔</p>  
        <p type="p">17:卡部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1073" publication-number="202628617"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628617.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成半導體裝置的方法</chinese-title>  
        <english-title>METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251020B">H10D30/01</main-classification>  
        <further-classification edition="202501120251020B">H10D64/01</further-classification>  
        <further-classification edition="202501120251020B">H10D62/10</further-classification>  
        <further-classification edition="202501120251020B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋學昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, HSUEH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余德偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, DE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鰭片輪廓調制方法包括形成一對通道結構，該對通道結構具有沿半導體裝置第一橫向方向的側壁，這些側壁的輪廓調制沉積在其上的閘極材料中第一孔隙的位置。方法包括在這些通道結構上沉積閘極材料以包裹第一孔隙。方法包括垂直於第一橫向方向對閘極材料進行圖案化以形成複數個虛設閘極結構，這些虛設閘極結構包含與第一孔隙的部分相對應的複數個第二孔隙。方法包括在半導體裝置上沉積間隔材料，且沉積至這些第二孔隙中。移除這些虛設閘極結構以形成由間隔材料界定的開口，這些開口包含間隔材料的剩餘部分。方法包括在開口中形成主動閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fin profile modulation method includes forming a pair of channel structures with sidewalls along a first lateral direction of a semiconductor device, a profile of the sidewalls modulating a position of a first void in a gate material deposited thereover. The method includes depositing the gate material over the channel structures to envelop the first void. The method includes patterning, perpendicular to the first lateral direction, the gate material to form a plurality of dummy gate structures comprising a plurality of second voids corresponding to portions of the first void. The method includes depositing a spacer material over the semiconductor device, and into the plurality of second voids. The dummy gate structures are removed to form openings defined by the spacer material, the openings comprising a remaining portion of the spacer material. The method includes forming an active gate structure in the opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:STI區域</p>  
        <p type="p">306:開口</p>  
        <p type="p">404:高度</p>  
        <p type="p">406:側壁</p>  
        <p type="p">408:間距</p>  
        <p type="p">410:第一寬度</p>  
        <p type="p">412:第二寬度</p>  
        <p type="p">416:第三寬度</p>  
        <p type="p">Y:第二橫向方向</p>  
        <p type="p">Z:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1074" publication-number="202626957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乳液及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08L71/00</main-classification>  
        <further-classification edition="200601120260318B">D06M15/53</further-classification>  
        <further-classification edition="200601120260318B">C09K3/18</further-classification>  
        <further-classification edition="200601120260318B">C08J3/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼歐斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEOS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市原豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIHARA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山根銀太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANE, GINTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠利用簡便之方法進行製備之全氟聚醚磷酸酯之乳液。&lt;br/&gt; 一種乳液，包含：&lt;br/&gt; (A)下述式(I)所示之全氟聚醚磷酸酯化合物、&lt;br/&gt; (B)鹼性化合物、&lt;br/&gt; (C)醇、及&lt;br/&gt; (D)水；&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="66px" width="589px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，Rf為碳數1～4之全氟烷基；X為氟基或三氟甲基；Y為碳數1～10之二價基；m為5～60；n為1或2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1075" publication-number="202626336"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626336.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118468</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體及積層體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B32B3/30</main-classification>  
        <further-classification edition="200601120260327B">B32B15/04</further-classification>  
        <further-classification edition="200601120260327B">B23K1/14</further-classification>  
        <further-classification edition="202601120260327B">H10W40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渋谷弘毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBUYA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>良尊弘幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYOSON, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙奕靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YIJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積層體，其依次具有第1接合層、金屬層以及第2接合層，上述金屬層在上述第1接合層側的第1面和上述第2接合層側的第2面上，具有與上述金屬層的外周緣連通的凹部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:積層體</p>  
        <p type="p">11:第1接合層</p>  
        <p type="p">12:金屬層</p>  
        <p type="p">13:凹部</p>  
        <p type="p">111:第1接合層</p>  
        <p type="p">112:第2接合層</p>  
        <p type="p">131:第1面的凹部</p>  
        <p type="p">132:第2面的凹部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1076" publication-number="202628651"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628651.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D64/01</main-classification>  
        <further-classification edition="202501120251103B">H10D30/01</further-classification>  
        <further-classification edition="202501120251103B">H10D64/27</further-classification>  
        <further-classification edition="202501120251103B">H10D62/832</further-classification>  
        <further-classification edition="202501120251103B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏邦廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, BANG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁姮彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, HENG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建億</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIEN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游明華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李啟弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHII-HORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在實施例中，一種方法包括以下步驟：在基板上方形成複數個半導體層，該些半導體層包含交替的第一半導體層及第二半導體層；將半導體層圖案化為鰭片；蝕刻鰭片以形成第一凹槽；在第一凹槽中形成磊晶區域，形成磊晶區域之步驟包含以下步驟：在第二半導體層的側壁上方形成第一磊晶層；在第一磊晶層上方形成第二磊晶層；在第二磊晶層上方形成形狀固定層；及在形狀固定層上方形成體磊晶層。方法更包括移除第一半導體層以在第二半導體層之間形成第二凹槽；及在第二凹槽中形成閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a method includes: forming a plurality of semiconductor layers over a substrate, the plurality of semiconductor layers comprising alternating first semiconductor layers and second semiconductor layers; patterning the plurality of the semiconductor layers into a fin; etching the fin to form a first recess; forming an epitaxial region in the first recess, forming the epitaxial region comprising: forming first epitaxial layers over sidewalls of the second semiconductor layers; forming second epitaxial layers over the first epitaxial layers; forming shape fixing layers over the second epitaxial layers; and forming a bulk epitaxial layer over the shape fixing layers. The method further includes removing the first semiconductor layers to form a second recess between the second semiconductor layers; and forming a gate structure in the second recess.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50N:n型區域</p>  
        <p type="p">50P:p型區域</p>  
        <p type="p">54:第二奈米結構</p>  
        <p type="p">66:鰭片</p>  
        <p type="p">72:犧牲材料</p>  
        <p type="p">90:內間隔物</p>  
        <p type="p">92A:第一磊晶層</p>  
        <p type="p">92B:第二磊晶層</p>  
        <p type="p">92C:第三磊晶層</p>  
        <p type="p">92X:形狀固定層</p>  
        <p type="p">100:閘極介電層</p>  
        <p type="p">102:閘極電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1077" publication-number="202627659"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627659.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微影遮罩、其製造方法及製造微影的反射多層結構的方法</chinese-title>  
        <english-title>LITHOGRAPHY MASK, METHOD OF MANUFACTURING THE SAME AND METHOD OF FABRICATING A REFLECTIVE MULTILAYER STRUCTURE FOR LITHOGRAPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260318B">G03F1/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許倍誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張思偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝艮軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">多層反射結構設置於基板上方。非晶體覆蓋層設置於該多層反射結構上方，且包括鉑(Pt)、銥(Ir)、銠(Rh)、或與Pt、Ir、或Rh成合金的釕(Ru)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-layer reflective structure is disposed over a substrate. An amorphous capping layer is disposed over the multi-layer reflective structure and includes platinum (Pt), iridium (Ir), rhenium (Rh), or ruthenium (Ru) alloyed with Pt, Ir, or Rh.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">18:EUV微影遮罩/遮罩</p>  
        <p type="p">30:基板</p>  
        <p type="p">32:導電層</p>  
        <p type="p">34:多層反射結構</p>  
        <p type="p">42:下側</p>  
        <p type="p">44:前側/側</p>  
        <p type="p">50:非晶體層</p>  
        <p type="p">100:覆蓋層</p>  
        <p type="p">110:覆蓋層形成製程</p>  
        <p type="p">120:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1078" publication-number="202628659"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628659.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10D84/01</main-classification>  
        <further-classification edition="202501120260302B">H10D84/83</further-classification>  
        <further-classification edition="200601120260302B">B82B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佑祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YOU-SHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳盈淙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐怡琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種形成半導體裝置的方法包括形成奈米結構、在奈米結構上方形成導電閘極結構、在導電閘極結構上方形成介電蝕刻停止層、在介電蝕刻停止層上方形成非晶層、及在非晶層上方形成圖案化遮罩結構。該方法更包括蝕刻非晶層、介電蝕刻停止層及導電閘極結構以形成開口，該開口將導電閘極結構分成彼此電性斷開的第一閘極部分及第二閘極部分；以絕緣材料填充開口；及執行平坦化操作以去除圖案化遮罩結構並在介電蝕刻停止層停止平坦化操作。根據各種實施例，介電蝕刻停止層包括1 nm至3 nm的厚度，且平坦化操作不會去除任何導電閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a semiconductor device includes forming a nanostructure, forming a conductive gate structure over the nanostructure, forming a dielectric etch-stop layer over the conductive gate structure, forming an amorphous layer over the dielectric etch-stop layer, and forming a patterned mask structure over the amorphous layer. The method further includes etching the amorphous layer, the dielectric etch-stop layer, and the conductive gate structure to form an opening that divides the conductive gate structure into a first gate portion and a second gate portion that are electrically disconnected from one another; filling the opening with an insulating material; and performing a planarization operation to remove the patterned mask structure and stopping the planarization operation at the dielectric etch-stop layer. According to various embodiments, the dielectric etch-stop layer includes a thickness between 1 nm and 3 nm and none of the conductive gate structure is removed by the planarization operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10f:結構</p>  
        <p type="p">70:開口</p>  
        <p type="p">101:GAAFET/GAAFET結構</p>  
        <p type="p">102:閘極結構</p>  
        <p type="p">104:通道結構</p>  
        <p type="p">106:源極/汲極結構</p>  
        <p type="p">108:間隔件</p>  
        <p type="p">110:蝕刻停止層</p>  
        <p type="p">112:層間電介質/層間介電層/ILD層/ILD</p>  
        <p type="p">D1,D2:方向</p>  
        <p type="p">E-E',X-X',Y1-Y1',Y2-Y2':線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1079" publication-number="202626976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鈦粒子及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251016B">C09C1/36</main-classification>  
        <further-classification edition="200601120251016B">B01J21/06</further-classification>  
        <further-classification edition="200601120251016B">C01G23/07</further-classification>  
        <further-classification edition="202001120251016B">C01F17/206</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>氏家和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UJIIE, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井宏輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鹿山進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAYAMA, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氧化鈦粒子之製造方法，其包含：反應步驟，將含有四氯化鈦及惰性氣體之原料氣體(G1)、與含有氧氣及水蒸氣之至少1種以及惰性氣體之氧化性氣體(G2)導入至反應管中而生成反應氣體；冷卻步驟，藉由導入冷卻介質來冷卻反應氣體而獲得原料氧化鈦粒子；第1脫氯步驟，一邊使原料氧化鈦粒子與水蒸氣接觸一邊於300℃以上600℃以下進行加熱，其中，水與原料氧化鈦粒子的質量比(水的質量/原料氧化鈦粒子的質量)為0.01以上；以及第2脫氯步驟，一邊使經過第1脫氯步驟之原料氧化鈦粒子與水蒸氣接觸一邊於30℃以上且未達100℃進行加熱，其中，水與原料氧化鈦粒子的質量比(水的質量/原料氧化鈦粒子的質量)為0.01以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:反應管</p>  
        <p type="p">3:冷卻介質吹出口</p>  
        <p type="p">4:反應管中心</p>  
        <p type="p">5:吹掃介質吹出口</p>  
        <p type="p">P:吹掃介質</p>  
        <p type="p">Q:冷卻介質</p>  
        <p type="p">α:吹掃介質的吹出角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1080" publication-number="202628085"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628085.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路及其操作方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G11C5/14</main-classification>  
        <further-classification edition="200601120251103B">G11C5/02</further-classification>  
        <further-classification edition="200601120251103B">G11C7/12</further-classification>  
        <further-classification edition="200601120251103B">G11C7/06</further-classification>  
        <further-classification edition="200601120251103B">G11C8/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張盟昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路，包括用以供應第一供應電壓的第一電源導軌，用以供應第二供應電壓的第二電源導軌，耦接至第一及第二電源導軌且用以接收第一控制信號、第一或第二供應電壓的第一記憶體電路，及第一核心電路。第二供應電壓具有第一值或不同於第一值的第二值。第一記憶體電路包括第一標頭電路及第一記憶體單元陣列，第一標頭電路耦接至第二電源導軌且用以回應於第一控制信號供應第二供應電壓至第一節點，第一記憶體單元陣列藉由第一節點耦接至第一標頭電路且用以儲存資料之第一集合，並從第一標頭電路接收第二供應電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a first power rail configured to supply a first supply voltage, a second power rail configured to supply a second supply voltage, a first memory circuit coupled to the first and second power rail, and configured to receive a first control signal, the first or second supply voltage, and a first core circuit. The second supply voltage has a first value or a second value different from the first value. The first memory circuit includes a first header circuit coupled to the second power rail, and configured to supply the second supply voltage to a first node in response to the first control signal, and a first memory cell array coupled to the first header circuit by the first node, and configured to store a first set of data, and to receive the second supply voltage from the first header circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:方法</p>  
        <p type="p">802~818:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1081" publication-number="202629048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W76/10</main-classification>  
        <further-classification edition="202601120260302B">H10W76/60</further-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202601120260302B">H10W90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李孟燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MENG-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許立翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, LI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇安治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, AN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置包括基底封裝件，其包含元件基底和環繞並位於元件基底之間的第一包封體。晶圓封裝件附接到基底封裝件的第一側，並包括積體電路裝置和環繞並位於積體電路裝置之間的第二包封體。電壓調節器附接到基底封裝件的第二側，元件基底將電壓調節器電性連接至積體電路裝置。外部連接件也附接到基底封裝件的第二側，元件基底將外部連接件電性連接至積體電路裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a substrate package comprising component substrates and a first encapsulant around and between the component substrates. A wafer package is attached to a first side of the substrate package and includes integrated circuit devices and a second encapsulant around and between the integrated circuit devices. Voltage regulators are attached to a second side of the substrate package, with the component substrates electrically connecting the voltage regulators to the integrated circuit devices. External connectors are also attached to the second side of the substrate package, with the component substrates electrically connecting the external connectors to the integrated circuit devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓封裝件</p>  
        <p type="p">164、316:凸塊下金屬(UBMs)</p>  
        <p type="p">200:元件基底</p>  
        <p type="p">254:阻焊層</p>  
        <p type="p">300:系統封裝件</p>  
        <p type="p">306:包封體</p>  
        <p type="p">310:重分佈結構</p>  
        <p type="p">320:基底封裝件</p>  
        <p type="p">322:導電連接件</p>  
        <p type="p">324:電壓調節器</p>  
        <p type="p">326:外部連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1082" publication-number="202627404"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627404.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>位置測量方法及裝置</chinese-title>  
        <english-title>POSITION MEASUREMENT METHOD AND DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250603B">G01B9/02</main-classification>  
        <further-classification edition="202201120250603B">G01B9/02055</further-classification>  
        <further-classification edition="200601120250603B">G01B11/14</further-classification>  
        <further-classification edition="200601120250603B">G01B11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亮紫科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHTEST TECHNOLOGY TAIWAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　俊紳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, KUO-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐成瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHENGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃斾齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PEI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董　中華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, ZHONGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種位置測量方法包括：執行一校正操作；以及根據一映射表，測量一載台的位置，以便控制所述載台在一檢測操作中的移動。執行所述校正操作包括：沿著一軸移動該載台；測量N組第一數值，其中每一組第一數值包括第一鏡面與第一雷射干涉儀間的第一距離，以及第一鏡面與第二雷射干涉儀間的第二距離；測量N組第二數值，其中每一組第二數值包括第二鏡面與第三雷射干涉儀間的第三距離，以及第二鏡面與第四雷射干涉儀間的第四距離；根據該第一數值及該第二數值，獲得所述第一鏡面沿該軸的平坦度分布曲線；以及根據所述平坦度分布曲線產生映射表。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A position measurement method includes: performing a calibration operation; and measuring a position of a stage according to a mapping table so as to control movement of the stage during an inspection operation. Performing the calibration operation includes: moving the stage along an axis; measuring N sets of first values, wherein each set of first values includes a first distance between a first mirror and a first laser interferometer and a second distance between the first mirror and a second laser interferometer; measuring N sets of second values, wherein each set of second values includes a third distance between a second mirror and a third laser interferometer and a fourth distance between the second mirror and a fourth laser interferometer; obtaining a flatness profile of the first mirror along the axis according to the first values and the second values; and generating the mapping table according to the flatness profile.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">70:位置測量方法</p>  
        <p type="p">S71:操作</p>  
        <p type="p">S72:操作</p>  
        <p type="p">S73:操作</p>  
        <p type="p">S74:操作</p>  
        <p type="p">S75:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1083" publication-number="202628676"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628676.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202601120260327B">H10D84/01</further-classification>  
        <further-classification edition="202501120260327B">H10D62/10</further-classification>  
        <further-classification edition="202601120260327B">H10P50/00</further-classification>  
        <further-classification edition="202601120260327B">H10W10/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳述文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊德智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIUNG, TE-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁致遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露描述一種形成具有細長觸點結構的半導體裝置的方法。該方法包括在基板上形成源極/汲極（S/D）結構。S/D結構的第一側與第一觸點結構接觸。該方法更包括在S/D結構的第二側上形成圖案化光阻劑。第二側相對於第一側，且圖案化光阻劑包括具有沿著第一方向的第一寬度及沿著第二方向的第二寬度的開口。該方法更包括沿著第一方向蝕刻圖案化光阻劑中的開口以增加開口的第一寬度，及在開口中形成第二觸點結構。第二觸點結構延伸穿過基板並與S/D結構的第二側接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure describes a method to form a semiconductor device having an elongated contact structure. The method includes forming a source/drain (S/D) structure on a substrate. A first side of the S/D structure is in contact with a first contact structure. The method further includes forming a patterned photoresist on a second side of the S/D structure. The second side is opposite to the first side and the patterned photoresist includes an opening having a first width along a first direction and a second width along a second direction. The method further includes etching the opening in the patterned photoresist along the first direction to increase the first width of the opening and forming a second contact structure in the opening. The second contact structure extends through the substrate and is in contact with the second side of the S/D structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102A,102B:電晶體/FET</p>  
        <p type="p">104:基板</p>  
        <p type="p">110A1,110A2:S/D結構</p>  
        <p type="p">110b:背面</p>  
        <p type="p">110f:正面</p>  
        <p type="p">112:閘極結構</p>  
        <p type="p">121:內間隔件</p>  
        <p type="p">122:奈米結構</p>  
        <p type="p">130A1,130A2:觸點結構</p>  
        <p type="p">132:覆蓋層</p>  
        <p type="p">134,138,144,146:介電層</p>  
        <p type="p">136,142:蝕刻停止層/ESL</p>  
        <p type="p">140:金屬通孔</p>  
        <p type="p">150,160:金屬線</p>  
        <p type="p">630A3,630B2:開口</p>  
        <p type="p">652:硬遮罩層</p>  
        <p type="p">654:底層</p>  
        <p type="p">656:中間層</p>  
        <p type="p">658:光阻劑</p>  
        <p type="p">X,Y,Z:方向/軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1084" publication-number="202628653"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628653.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構和其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D64/27</main-classification>  
        <further-classification edition="202501120260302B">H10D62/10</further-classification>  
        <further-classification edition="202501120260302B">H10D30/62</further-classification>  
        <further-classification edition="202601120260302B">H10P54/00</further-classification>  
        <further-classification edition="202601120260302B">H10P50/20</further-classification>  
        <further-classification edition="202601120260302B">H10W10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂佳燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIA-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王亮智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LIANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃上碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHANG-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的實施例提供一種方法，包括提供垂直延伸於基板上方的複數個鰭片及延伸於鰭片上方的連續閘極結構，及形成位於連續閘極結構中且具有一對鰭片之間的金屬閘極切口的開口，其中形成開口包括蝕刻至現有深度的局部開口和執行蝕刻循環，蝕刻循環包括在局部開口的側壁上沉積保護層和透過蝕刻將局部開口延伸現有深度下方的預定擴增深度。方法還包括重複至少10次的蝕刻循環以達到期望的閘極切口長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes: providing a plurality of fins that extend vertically above a substrate and a contiguous gate structure that extends over the plurality of fins; forming an opening in the contiguous gate structure with a metal gate cut between a pair of fins, wherein forming the opening includes etching a partial opening to a current depth and performing an etching cycle including: depositing a protective layer on sidewalls of the partial opening; and extending, via etching, the partial opening a predetermined incremental depth below the current depth; and repeating the etching cycle for at least 10 cycles to achieve a desired gate cut length.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2104:奈米片</p>  
        <p type="p">2124:開口</p>  
        <p type="p">2126:切口長度</p>  
        <p type="p">2128:中間臨界尺寸</p>  
        <p type="p">2130:金屬閘極切口</p>  
        <p type="p">2134:閘極切口長度</p>  
        <p type="p">2136:距離</p>  
        <p type="p">2138:第一閘極區段</p>  
        <p type="p">2140:第二閘極區段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1085" publication-number="202627675"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627675.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於疊對計量之雙共軛成像之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR DUAL-CONJUGATE IMAGING FOR OVERLAY METROLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G03F7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　安卓　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, ANDREW V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多勒夫　伊多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLEV, IDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼葛瑞　戴瑞亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGRI, DARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉哈夫　奧倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAHAV, OREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於對諸如具有用於測量疊對之計量目標之半導體裝置之樣本成像之計量系統。在實施例中，一多通道成像系統經組態以使用一共同偵測器以相同放大率同時對一樣本之兩個相關間隔層成像。在實施例中，該多通道成像系統包含用於在一第一深度處對該計量目標成像之一第一成像光及用於在一第二深度處對該計量目標成像之一第二成像光，其中該等第一及第二成像光藉由分裂自該樣本收集之光而產生，且其中與該等各別第一及第二成像光相關聯之第一及第二子影像用於產生計量測量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metrology system for imaging samples such as semiconductor devices having metrology targets for measuring overlay. In embodiments, a multi-channel imaging system is configured to image two relevant spaced layers of a sample simultaneously at the same magnification using a common detector. In embodiments, the multi-channel imaging system includes a first imaging light for imaging the metrology target at a first depth, and a second imaging light for imaging the metrology target at a second depth, wherein the first and second imaging lights are generating by splitting collected light from the sample, and wherein first and second sub-images associated with the respective first and second imaging lights are used to generate metrology measurements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:計量系統</p>  
        <p type="p">102:多通道成像系統</p>  
        <p type="p">104:照明源</p>  
        <p type="p">106:物鏡</p>  
        <p type="p">108:光束分裂器</p>  
        <p type="p">110:偵測器</p>  
        <p type="p">112:管透鏡</p>  
        <p type="p">114:雙遠心影像中繼器</p>  
        <p type="p">116:控制器</p>  
        <p type="p">118:處理器</p>  
        <p type="p">120:記憶體裝置</p>  
        <p type="p">200:樣本</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1086" publication-number="202628640"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628640.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D62/10</main-classification>  
        <further-classification edition="202501120260302B">H10D64/20</further-classification>  
        <further-classification edition="202601120260302B">H10D86/01</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10W10/00</further-classification>  
        <further-classification edition="202601120260302B">H10P54/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳又豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁崇銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李惠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HUI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管瑞豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN, JUI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇安治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, AN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種半導體裝置。半導體裝置包括透過基底與電性主動區熱耦合的矽光子區，電性主動區包括第一電晶體。第一電晶體的源/汲極區與包括第一材料的熱接觸件耦合。第一電晶體的源/汲極區與包括與第一材料不同的第二材料的電接觸件耦合。半導體裝置包括耦合到電接觸件的第一裝置端子。半導體裝置包括耦合到熱接觸件的第二裝置端子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device is provided. The semiconductor device includes a silicon-photonic region thermally coupled with an electrical active region via a substrate, the electrical active region including a first transistor. A source/drain region of the first transistor is coupled with a thermal contact including a first material. The source/drain region of the first transistor is coupled with an electrical contact including a second material, different from the first material. The semiconductor device includes a first device terminal coupled with the electrical contact. The semiconductor device includes a second device terminal coupled with the thermal contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:半導體裝置</p>  
        <p type="p">201:主動表面</p>  
        <p type="p">202:基底</p>  
        <p type="p">302:熱接觸件</p>  
        <p type="p">402:氧化物擴散區</p>  
        <p type="p">1804:BOX區</p>  
        <p type="p">1806:STI區</p>  
        <p type="p">1810:熱流路徑</p>  
        <p type="p">2512:第一端</p>  
        <p type="p">2502:矽光子區</p>  
        <p type="p">2504:電性主動區</p>  
        <p type="p">2506:金屬化層</p>  
        <p type="p">2508:TSV</p>  
        <p type="p">2510:端子</p>  
        <p type="p">2514:第二端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1087" publication-number="202627869"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627869.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>設計方法、程式產品、及半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251001B">G06F30/392</main-classification>  
        <further-classification edition="202301120251001B">H10B41/30</further-classification>  
        <further-classification edition="202301120251001B">H10B43/30</further-classification>  
        <further-classification edition="202001320251001B">G06F115/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川島裕嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASHIMA, HIROTSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於抑制到達深度不同之複數個接觸孔上之抗蝕劑圖案之層厚之偏差。 &lt;br/&gt;實施形態之設計方法係用於決定到達深度不同之複數個孔之配置之設計方法，於存在1個以上之設計上之制約事項之情形時，於形成有覆蓋具有滿足1個以上之制約事項之第1配置之複數個孔之樹脂層之情形時，於複數個孔上之樹脂層中，運算因樹脂層之一部分流入複數個孔內而產生之第1層厚差；判定第1層厚差是否為指定之上限值以下；於第1層厚差超過上限值時，將複數個孔之配置變更為滿足1個以上之制約事項之第2配置，於該情形時，運算於複數個孔上之樹脂層中產生之第2層厚差；判定第2層厚差是否為上限值以下；於第2層厚差為上限值以下時，採納第2配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S109:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1088" publication-number="202627012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119516</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260331B">C09J7/30</main-classification>  
        <further-classification edition="200601120260331B">C09J133/10</further-classification>  
        <further-classification edition="200601120260331B">C09J133/02</further-classification>  
        <further-classification edition="200601120260331B">C09J11/06</further-classification>  
        <further-classification edition="200601120260331B">C09J11/08</further-classification>  
        <further-classification edition="200601120260331B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本友也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤史哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本瞭太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, RYOUTAROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧尻絢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIJIRI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種具有優異之耐熱性且對各種衝擊之耐衝擊性優異之黏著帶。 &lt;br/&gt;本發明之黏著帶具有使用黏著劑組成物而形成之黏著劑層，上述黏著劑層以測定頻率1 Hz、測定溫度範圍-40℃以上200℃以下藉由動態黏彈性測定測得之玻璃轉移溫度為0℃以上，上述黏著劑層以測定頻率1 Hz、測定溫度範圍-40℃以上200℃以下藉由動態黏彈性測定測得之損耗正切之波峰之半值寬度為38℃以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1089" publication-number="202627018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑組成物、黏著帶、電子機器零件或車載機器零件之固定方法、及電子機器或車載機器之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C09J133/10</main-classification>  
        <further-classification edition="201801120260327B">C09J7/30</further-classification>  
        <further-classification edition="200601120260327B">C09J11/06</further-classification>  
        <further-classification edition="200601120260327B">C09J11/08</further-classification>  
        <further-classification edition="200601120260327B">B32B7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤史哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本友也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新井祥人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, YOSHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本瞭太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, RYOUTAROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧尻絢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIJIRI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種成為能夠兼顧高剪切接著力及輕壓接性之黏著帶之材料之黏著劑組成物。 &lt;br/&gt;本發明之黏著劑組成物含有：包含多於30質量%之源自(甲基)丙烯酸1-甲基庚酯之結構單元且包含0.01質量%以上50質量%以下之源自(甲基)丙烯酸正庚酯之結構單元之丙烯酸共聚物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1090" publication-number="202628115"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628115.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、記憶體陣列、以及操作記憶體段的方法</chinese-title>  
        <english-title>MEMORY DEVICE, MEMORY ARRAY, AND METHOD FOR OPERATING MEMORY SEGMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G11C17/16</main-classification>  
        <further-classification edition="200601120260302B">G11C7/18</further-classification>  
        <further-classification edition="200601120260302B">G11C8/14</further-classification>  
        <further-classification edition="202501120260302B">H10D62/10</further-classification>  
        <further-classification edition="202501120260302B">H10D64/20</further-classification>  
        <further-classification edition="202601120260302B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張盟昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置及陣列架構以傳輸閘極及轉發器為特徵，以增強訊號完整性及效能。該裝置包括各自經由傳輸閘極連接至一解碼器的多個記憶體段及沿著字元線定位的一轉發器電路。該些段內的記憶體單元可為處於各種組態的電子熔絲單元，包括2T/1R及1T/1R。經設計為具有P通道金屬氧化物半導體電晶體及N通道金屬氧化物半導體電晶體的兩級反相器的該些轉發器經戰略性地置放，以確保穩健的訊號傳播。在轉發器將相鄰記憶體單元分離的情況下，該記憶體陣列包含多條字元線及位元線，且包括用於電壓位準移位的解碼器。該架構支援各種臨限值電壓轉發器，從而確保不同操作條件下的靈活性及效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device and array architecture feature transmission gates and repeaters to enhance signal integrity and performance. The device includes multiple memory segments, each connected to a decoder through transmission gates, and a repeater circuit positioned along word lines. Memory cells within the segments can be eFuse cells in various configurations, including 2T/1R and 1T/1R. The repeaters, designed as two-stage inverters with a P-channel metal oxide semiconductor transistor and an N-channel metal oxide semiconductor transistor, are strategically placed to ensure robust signal propagation. The memory array comprises multiple word and bit lines, with repeaters separating adjacent memory cells, and includes decoders for voltage level shifting. The architecture supports various threshold voltage repeaters, ensuring flexibility and efficiency in different operating conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">102:第一陣列/主陣列</p>  
        <p type="p">104:第一傳輸閘極/傳輸閘極</p>  
        <p type="p">106:位元線解碼器</p>  
        <p type="p">108:字元線解碼器</p>  
        <p type="p">110:第一記憶體段/記憶體段</p>  
        <p type="p">112:轉發器/兩級反相器</p>  
        <p type="p">114:讀出放大器</p>  
        <p type="p">116:控制器</p>  
        <p type="p">118:電源/功率</p>  
        <p type="p">CTRL:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1091" publication-number="202628692"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628692.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D89/60</main-classification>  
        <further-classification edition="202601120260302B">H10P14/40</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="200601120260302B">H01C7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商巨大森林股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIC FOREST CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒木新一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKI, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在提供ESD耐受性的同時，提供有利於半導體裝置的小型化的技術。 &lt;br/&gt;　　半導體裝置具有半導體基板、配置於前述半導體基板上的配線構造、及壓敏電阻。前述配線構造包含有包含焊盤的焊盤區域與電路區域，前述焊盤區域及前述電路區域各自包含複數配線層、配置於前述複數配線層之間的層間絕緣膜、及相互連接前述複數配線層的通孔導通柱，前述壓敏電阻電性連接於前述焊盤，前述壓敏電阻配置於前述電路區域中，且位於前述半導體基板的上表面之上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">BB:接合球</p>  
        <p type="p">BP:焊盤</p>  
        <p type="p">BW:接合線</p>  
        <p type="p">CR:電路區域</p>  
        <p type="p">ILIF:層間絕緣膜</p>  
        <p type="p">PR:焊盤區域</p>  
        <p type="p">SS:半導體基板</p>  
        <p type="p">Tr:電晶體</p>  
        <p type="p">V:壓敏電阻</p>  
        <p type="p">VP:通孔導通柱</p>  
        <p type="p">WL:配線層</p>  
        <p type="p">WLF:最遠配線層</p>  
        <p type="p">WP:配線圖案</p>  
        <p type="p">WS:配線構造</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1092" publication-number="202626366"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626366.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氟樹脂片狀素材及含有其之積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B32B27/30</main-classification>  
        <further-classification edition="200601120260327B">B32B15/082</further-classification>  
        <further-classification edition="200601120260327B">C08J5/18</further-classification>  
        <further-classification edition="201901120260327B">B32B7/02</further-classification>  
        <further-classification edition="200601120260327B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲場沙織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INABA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下雅量</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森安礼奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIYASU, REINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松信之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氟樹脂片狀素材，其於以氟樹脂之熔點以下之溫度接著時，與金屬層之接著性亦優異。 &lt;br/&gt;本發明係一種氟樹脂片狀素材，其於至少一表面，滿足以下之（1）及（2）之至少一者： &lt;br/&gt;（1）藉由原子力顯微鏡對表面狀態測定時之最大峰高（Rp）為30～150 nm； &lt;br/&gt;（2）藉由原子力顯微鏡對表面狀態測定時之最大峰深（Rv）為－30～－120 nm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1093" publication-number="202626367"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626367.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氟樹脂片狀素材及含有其之積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B32B27/30</main-classification>  
        <further-classification edition="200601120260327B">B32B15/082</further-classification>  
        <further-classification edition="201901120260327B">B32B7/02</further-classification>  
        <further-classification edition="200601120260327B">C08J5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森安礼奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIYASU, REINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下雅量</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲場沙織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INABA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松信之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種氟樹脂片狀素材，其面內均勻無差異，且具有優異之接著性。又，本發明之目的在於提供一種氟樹脂片狀素材，其於片狀素材為捲筒狀之情形時，片狀素材之搬送性良好，且捲筒之外觀亦得到改善。 &lt;br/&gt;本發明係一種氟樹脂片狀素材，其係包含氟樹脂之片狀素材，且於至少一表面，對於10 cm見方之片狀素材之縱向、橫向、斜向各者，下述10點逐一藉由掃描式X射線光電子光譜分析測定（XPS）對氧元素比率測定時，於任一方向，氧元素比率之平均值均為1.35 atomic%以上，且（MAX－MIN）/Avg.均為40%以下， &lt;br/&gt;縱向之10點：於距左端1.5 cm之直線上，將距上方1.5 cm之部位設為第1點，以8 mm為間隔之10點； &lt;br/&gt;橫向之10點：於距上端1.5 cm之直線上，將距左端1.5 cm之部位設為第1點，以8 mm為間隔之10點； &lt;br/&gt;斜向之10點：仿照縱向及橫向，於下述長方形之長邊之上方5 mm之直線上，將距長方形之長邊上端1.5 cm之部位設為第1點，以8 mm為間隔之10點；上述長方形係將自片狀素材右下角沿縱向6.5 cm、沿橫向6.5 cm之各邊上的點連接之直線設為長邊，並將短邊設為1 cm者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1094" publication-number="202628667"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628667.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119725</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">H10D84/60</main-classification>  
        <further-classification edition="202601120260401B">H10D89/00</further-classification>  
        <further-classification edition="202501120260401B">H10D1/40</further-classification>  
        <further-classification edition="202501120260401B">H10D89/60</further-classification>  
        <further-classification edition="202501120260401B">H10D84/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商巨大森林股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIC FOREST CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒木新一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKI, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在提供ESD耐受性的同時，提供有利於半導體裝置的小型化的技術。 　　半導體裝置具有半導體基板、配置於前述半導體基板上的配線構造、及電子零件。前述配線構造包含有包含焊盤的焊盤區域與電路區域，前述焊盤區域及前述電路區域各自包含複數配線層、配置於前述複數配線層之間的層間絕緣膜、及相互連接前述複數配線層的通孔導通柱，前述電子零件是主動元件，前述電子零件電性連接於前述焊墊，並且前述電子零件配置於前述電路區域中，且位於前述半導體基板的上表面更靠上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:半導體層</p>  
        <p type="p">311:射極</p>  
        <p type="p">312:基極</p>  
        <p type="p">313:集極</p>  
        <p type="p">321:第1電極</p>  
        <p type="p">322:第2電極</p>  
        <p type="p">331:絕緣膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1095" publication-number="202628034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628034.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素渲染方法及顯示驅動晶片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250704B">G09G3/20</main-classification>  
        <further-classification edition="201601120250704B">G09G3/3208</further-classification>  
        <further-classification edition="200601120250704B">G09G3/36</further-classification>  
        <further-classification edition="200601120250704B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商格科微電子（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊學炎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡礽哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣昕佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種像素渲染方法及顯示驅動晶片，該方法準備至少兩種不同的渲染基準單元，所述渲染基準單元除由至少兩個顏色不同的子像素組成外，其還通過向與其相近的若干子像素借色以形成白點，並且所述渲染基準單元內的每一子像素還向外借出顏色用於相近的渲染基準單元渲染形成白點；其中，所述渲染基準單元內的任意目標子像素至少往三個方向借出顏色用於相近的渲染基準單元的像素渲染；而且，所有的渲染基準單元中，任意目標子像素的渲染滿足公式Ax+By=1，以提升像素渲染效果，改善顯示均勻性，提高顯示圖像的保真度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1096" publication-number="202628035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種節省面積的驅動電路、方法及觸控顯示驅動晶片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">G09G3/20</main-classification>  
        <further-classification edition="200601120250701B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商格科微電子（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁啟源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣昕佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種節省面積的驅動電路、方法及觸控顯示驅動晶片。所述驅動電路包括公共電極驅動電路，在顯示驅動時段，所述公共電極驅動電路輸出用於驅動公共電極的公共電壓，在觸控感測時段，所述公共電極驅動電路輸出用於驅動補償電容的補償電壓，所述補償電容用於補償感測路徑上的寄生電容。本發明通過採用所述公共電極驅動電路在觸控感測時段驅動補償電容，省略了用於驅動補償電容的額外驅動電路，降低了觸控顯示驅動晶片上的驅動電路的複雜度和電路面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1097" publication-number="202627779"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627779.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種節省面積的驅動電路、方法及觸控顯示驅動晶片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250606B">G06F3/041</main-classification>  
        <further-classification edition="201601120250606B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商格科微電子（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁啟源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣昕佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種節省面積的驅動電路、方法及觸控顯示驅動晶片，所述驅動電路包括觸控感測電路、公共電極驅動電路和若干補償電容，在觸控感測時段，所述補償電容用於補償感測路徑上的寄生電容，通過所述公共電極驅動電路輸出的補償電壓驅動所述補償電容抵消感測路徑上的寄生電容；在顯示驅動時段，所述補償電容復用為維持公共電壓穩定的存儲電容。本發明通過復用補償電容和公共電極驅動電路，減小了驅動電路在觸控顯示驅動晶片上的佔用面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1098" publication-number="202628618"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628618.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D30/01</main-classification>  
        <further-classification edition="202601120260302B">H10P10/00</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202501120260302B">H10D30/60</further-classification>  
        <further-classification edition="200601120260302B">B81C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何士融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHIH-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃浩欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：在源極/汲極區域旁形成導電特徵；曝露該導電特徵的第一表面及該源極/汲極區域的第一表面；在該導電特徵上形成金屬氧化物層且在該源極/汲極區域上形成氧化矽層；移除該氧化矽層，其中移除該氧化矽層會曝露該源極/汲極區域的第二表面；在該源極/汲極區域的該第二表面上形成矽化物區域；移除該金屬氧化物層，其中移除該金屬氧化物層會曝露該導電特徵的第二表面；及在該矽化物區域及該導電特徵的該第二表面上沈積第一導電材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a conductive feature next to a source/drain region; exposing a first surface of the conductive feature and a first surface of the source/drain region; forming a metal oxide layer on the conductive feature and a silicon oxide layer on the source/drain region; removing the silicon oxide layer, wherein removing the silicon oxide layer exposes a second surface of the source/drain region; forming a silicide region on the second surface of the source/drain region; removing the metal oxide layer, wherein removing the metal oxide layer exposes a second surface of the conductive feature; and depositing a first conductive material on the silicide region and on the second surface of the conductive feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板</p>  
        <p type="p">20':半導體條</p>  
        <p type="p">32:介電隔離區域</p>  
        <p type="p">45:鰭狀間隔物</p>  
        <p type="p">62L:下源極/汲極區域</p>  
        <p type="p">62U:上源極/汲極區域</p>  
        <p type="p">66:第一CESL</p>  
        <p type="p">68:第一ILD</p>  
        <p type="p">70:第二CESL</p>  
        <p type="p">72:第二ILD</p>  
        <p type="p">114、124:介電襯墊</p>  
        <p type="p">116、140:接觸插塞</p>  
        <p type="p">118:蝕刻終止層</p>  
        <p type="p">120:介電層</p>  
        <p type="p">130:矽化物區域</p>  
        <p type="p">132:殘留層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1099" publication-number="202628660"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628660.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10D84/01</main-classification>  
        <further-classification edition="202501120260302B">H10D84/80</further-classification>  
        <further-classification edition="202501120260302B">H10D30/01</further-classification>  
        <further-classification edition="202501120260302B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊曜滕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YAO-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSUNG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　志安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUI, CHI ON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在形成半導體裝置之閘極結構期間，在半導體裝置的不同區中的閘極介電材料上形成包含不同偶極形成元素及/或具有不同厚度的偶極層。接下來執行偶極驅入製程(例如，熱製程)，以將偶極層之偶極形成元素驅入閘極介電材料中。驅入閘極介電材料中的偶極形成元素與閘極介電材料之某一元素形成偶極。偶極用來調整閘極結構之臨限電壓，並針對半導體裝置之不同區中形成的閘極結構達成不同的臨限電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">During the formation of the gate structures of a semiconductor device, dipole layers comprising different dipole-forming elements and/or having different thicknesses are formed on the gate dielectric material in different regions of the semiconductor device. A dipole drive-in process (e.g., a thermal process) is performed next to drive the dipole-forming elements of the dipole layers into the gate dielectric material. The dipole-forming elements driven into the gate dielectric material form dipoles with certain element of the gate dielectric material. The dipoles are used to adjust the threshold voltages of the gate structures, and to achieve different threshold voltages for gate structures formed in the different regions of the semiconductor device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:閘極介電層</p>  
        <p type="p">124':偶極形成元素</p>  
        <p type="p">125:介面層</p>  
        <p type="p">126':偶極形成元素</p>  
        <p type="p">128':偶極形成元素</p>  
        <p type="p">150A~150D:區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1100" publication-number="202627355"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627355.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119985</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排氣處理爐及使用其之排氣處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250603B">F23G7/06</main-classification>  
        <further-classification edition="200601120250603B">F23G5/44</further-classification>  
        <further-classification edition="200601120250603B">F23G5/50</further-classification>  
        <further-classification edition="200601120250603B">B01D53/34</further-classification>  
        <further-classification edition="200601120250603B">B01D53/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商康肯環保設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANKEN TECHNO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今村啓志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAMURA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種排氣處理爐，相較於先前更小型，能夠謀求電力能源的有效率的利用且能夠顯著提升由半導體製造排氣般各種類的減排對象物構成的排氣的減排效率。該排氣處理爐，具備爐本體(12)，在內部具有氣體處理空間(12a)，在底壁面中央部穿設有氣體排出口(12b)；電熱加熱器(14)，自該爐本體(12)的天花板面中央部垂設；及，陶瓷內筒構件(16)，以基端部圍繞氣體排出口(12b)的周緣的方式安裝於爐本體(12)的內部底面，前端部在靠近於爐本體(12)的天花板面的位置開口並圍繞電熱加熱器(14)的外周。再者，在爐本體(12)的天花板壁面或底壁面的任一壁面穿設有氣體導入口(12c)，以使氣體處理空間(12a)內的排氣(E)的流動為在陶瓷內筒構件(16)的外周面側沿著其軸方向流動後反轉且沿著該陶瓷內筒構件(16)的內周面側流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:排氣處理爐</p>  
        <p type="p">12:爐本體</p>  
        <p type="p">12a:氣體處理空間</p>  
        <p type="p">12b:氣體排出口</p>  
        <p type="p">12c:氣體導入口</p>  
        <p type="p">12d:加熱器插入口</p>  
        <p type="p">12e:隔熱材</p>  
        <p type="p">14:電熱加熱器</p>  
        <p type="p">14a:發熱體</p>  
        <p type="p">16:陶瓷內筒構件</p>  
        <p type="p">20:入口洗滌器</p>  
        <p type="p">20a:洗滌器本體</p>  
        <p type="p">20b:噴嘴</p>  
        <p type="p">20c:填充材</p>  
        <p type="p">22:出口洗滌器</p>  
        <p type="p">22a:洗滌器本體</p>  
        <p type="p">22b:噴嘴</p>  
        <p type="p">22c:填充材</p>  
        <p type="p">24:儲藏槽</p>  
        <p type="p">24a:阻隔壁</p>  
        <p type="p">26:導入配管</p>  
        <p type="p">28:排出配管</p>  
        <p type="p">30:排氣導管</p>  
        <p type="p">32:循環泵</p>  
        <p type="p">34:大氣排出配管系</p>  
        <p type="p">36:排氣風扇</p>  
        <p type="p">38:熱交換器</p>  
        <p type="p">E:排氣</p>  
        <p type="p">X:排氣處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1101" publication-number="202628579"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628579.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10B41/20</main-classification>  
        <further-classification edition="202301120251201B">H10B41/30</further-classification>  
        <further-classification edition="202301120251201B">H10B41/35</further-classification>  
        <further-classification edition="202301120251201B">H10B43/20</further-classification>  
        <further-classification edition="202301120251201B">H10B43/30</further-classification>  
        <further-classification edition="202301120251201B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧村祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林茂樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可提高半導體記憶裝置之積體度。 &lt;br/&gt;實施方式之半導體記憶裝置具備：第1記憶胞陣列之第1配線層及複數個第2配線層、以及第2記憶胞陣列之第3配線層及複數個第4配線層，其等以於第1方向上依此順序重疊之方式設置；第1接點，其與第2記憶胞陣列之複數個第4配線層中之1個之階台部分連接，且沿第1方向延伸；第2接點，其於第1方向上貫通第1記憶胞陣列之複數個第2配線層之橋接部分；第3接點，其與第1記憶胞陣列之複數個第2配線層中之1個之階台部分連接，且沿第1方向延伸；以及第1及第2記憶柱，其等在第1方向上分別貫通第1及第2記憶胞陣列各自之複數個第2及第4配線層而設置；且第1接點與第2接點設置於在第1方向上重疊之位置且相互電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:半導體記憶裝置</p>  
        <p type="p">10-1,10-2:記憶胞陣列</p>  
        <p type="p">21,22,23,24,25,26,28,29,71,72,73,74,75,76:配線層</p>  
        <p type="p">51,52,53,70:絕緣體層</p>  
        <p type="p">100:控制電路層</p>  
        <p type="p">200:第1記憶層</p>  
        <p type="p">300:第2記憶層</p>  
        <p type="p">400:配線層</p>  
        <p type="p">B1,B2,B3,B4:接合層</p>  
        <p type="p">BP1,BP2,BP3,BP4:接合墊</p>  
        <p type="p">CC,CX,C0,C1,C2,C3,C4,C5:接點</p>  
        <p type="p">DR:雜質擴散區域</p>  
        <p type="p">GC:閘極電極</p>  
        <p type="p">HA:引出區域</p>  
        <p type="p">MA1:記憶區域</p>  
        <p type="p">MP:記憶柱</p>  
        <p type="p">STI:絕緣體</p>  
        <p type="p">TR:電晶體</p>  
        <p type="p">W1:半導體基板</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z1:方向</p>  
        <p type="p">Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1102" publication-number="202625899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三段式培養綜合酵母菌液及麵團的發酵方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">A21D8/04</main-classification>  
        <further-classification edition="201601120260302B">A23L7/104</further-classification>  
        <further-classification edition="202601120260302B">C12N1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李安倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, ANLUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李安倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, ANLUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種三段式培養綜合酵母菌液，包括三段式培養方法，分別為葡萄種菌液製備，原種老麵培養法製備以及使用中種老麵培養法製備來進行製備酵母菌液，其中的含鹽葡萄種液按照以下組成進行製備，以重量進行計算製備，通過採用無油葡萄乾33g，二砂糖25-30g，岩鹽0-5g，水100g以及老菌水0.001g。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1103" publication-number="202628575"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628575.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B20/25</main-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張盟昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包括在半導體之前側上的主動區。主動區包括反熔絲控制單元，該反熔絲控制單元包括複數個第一電晶體。半導體裝置包括與複數個第一電晶體耦接的前側金屬化層。半導體裝置包括在半導體裝置之背側上的一次可程式電路。一次可程式電路包括與反熔絲控制單元之程式化字元線(WLP)接線耦接的第二電晶體。一次可程式電路包括與反熔絲控制單元之讀取字元線(WLR)接線耦接的第三電晶體。半導體裝置包括與第二及第三電晶體耦接的背側金屬化層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes an active region on a frontside of the semiconductor. The active region includes an anti-fuse control cell including a plurality of first transistors. The semiconductor device includes a frontside metallization layer coupled with the plurality of first transistors. The semiconductor device includes a one-time-programmable circuit on a backside of the semiconductor device. The one-time-programmable circuit includes a second transistor coupled with a programing wordline (WLP) line of the anti-fuse control cell. The one-time-programmable circuit includes a third transistor coupled with a read wordline (WLR) line of the anti-fuse control cell. The semiconductor device includes a backside metallization layer coupled with the second and third transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">108:前側金屬化層</p>  
        <p type="p">114:背側電源軌道</p>  
        <p type="p">206:位元線(BL)</p>  
        <p type="p">402:GAAFET或電晶體</p>  
        <p type="p">404:電晶體</p>  
        <p type="p">406:電晶體</p>  
        <p type="p">408:源極/汲極區</p>  
        <p type="p">410:半導體通道</p>  
        <p type="p">411:閘極結構</p>  
        <p type="p">412:基板</p>  
        <p type="p">414:氧化物層</p>  
        <p type="p">415:VB</p>  
        <p type="p">416:觸點</p>  
        <p type="p">418:BM0層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1104" publication-number="202628576"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628576.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置與製造半導體裝置的方法</chinese-title>  
        <english-title>MEMORY DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B20/25</main-classification>  
        <further-classification edition="200601120251103B">G11C17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張盟昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置，包括基板及記憶體單元。基板包括前側及與前側相對的後側。記憶體單元包括程式化電晶體、讀取電晶體、及後側通孔。程式化電晶體設置在基板之前側或後側中之第一者上。讀取電晶體設置在基板之前側或後側中與程式化電晶體相對的第二者上。後側通孔從基板之後側延伸至前側，從而以串聯的方式將程式化電晶體耦接至讀取電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a substrate and a memory cell. The substrate includes a frontside and a backside opposite to the frontside. The memory cell includes a programming transistor, a reading transistor, and a backside via. The programming transistor is disposed on a first one of the frontside or the backside of the substrate. The reading transistor is disposed a second one of the frontside or the backside of the substrate opposite to the programming transistor. The backside via extends from the backside to the frontside of the substrate, thereby coupling the programming transistor to the reading transistor in series.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105A:記憶體單元</p>  
        <p type="p">120:程式化電晶體</p>  
        <p type="p">120d:源極/汲極端子</p>  
        <p type="p">120g:閘極端子</p>  
        <p type="p">120s:源極/汲極端子</p>  
        <p type="p">122:程式化電晶體</p>  
        <p type="p">122d:源極/汲極端子</p>  
        <p type="p">122g:閘極端子</p>  
        <p type="p">122s:源極/汲極端子</p>  
        <p type="p">124:讀取電晶體</p>  
        <p type="p">124d:源極/汲極端子</p>  
        <p type="p">124g:閘極端子</p>  
        <p type="p">124s:源極/汲極端子</p>  
        <p type="p">126:讀取電晶體</p>  
        <p type="p">126d:源極/汲極端子</p>  
        <p type="p">126g:閘極端子</p>  
        <p type="p">126s:源極/汲極端子</p>  
        <p type="p">400A:記憶體裝置</p>  
        <p type="p">401:基板</p>  
        <p type="p">402:主動區</p>  
        <p type="p">403:前側</p>  
        <p type="p">405:後側</p>  
        <p type="p">412:閘極結構</p>  
        <p type="p">414:閘極結構</p>  
        <p type="p">421:源極/汲極結構</p>  
        <p type="p">422:MD</p>  
        <p type="p">423:源極/汲極結構</p>  
        <p type="p">424:MD</p>  
        <p type="p">425:源極/汲極結構</p>  
        <p type="p">426:MD</p>  
        <p type="p">432:金屬軌道</p>  
        <p type="p">434:金屬軌道</p>  
        <p type="p">436:金屬軌道</p>  
        <p type="p">442:後側通孔</p>  
        <p type="p">444:後側通孔</p>  
        <p type="p">452:金屬軌道</p>  
        <p type="p">454:金屬軌道</p>  
        <p type="p">456:金屬軌道</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BM0:後側金屬化層</p>  
        <p type="p">MD:源極/汲極觸點結構</p>  
        <p type="p">M0:前側金屬化層</p>  
        <p type="p">WLP:字元線</p>  
        <p type="p">WLR&lt;sub&gt;10&lt;/sub&gt;、WLR&lt;sub&gt;11&lt;/sub&gt;:字元線</p>  
        <p type="p">VD1~VD2:中間端通孔結構</p>  
        <p type="p">VG1~VG2:閘極觸點結構</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1105" publication-number="202628525"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628525.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設備</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250625B">H05K7/14</main-classification>  
        <further-classification edition="200601120250625B">H05K7/02</further-classification>  
        <further-classification edition="200601120250625B">H05K5/02</further-classification>  
        <further-classification edition="200601120250625B">H05K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱書敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, SHUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚魏强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, WEIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例公開了一種電子設備，該電子設備包括殼體、金屬連接件、主控板、固定支架、導電層、彈性導電接頭和柔性線路板，金屬連接件連接在殼體上的安裝槽內，固定支架和主控板設置在殼體內，導電層採用PDS製程形成在固定支架頂面、連接面和外側面上，彈性導電接頭的兩端分別與金屬連接件和導電層電連接，柔性線路板的一端與導電層電連接，柔性線路板的另一端與主控板電連接，從而將金屬連接件上產生的靜電通過柔性線路板放電傳導至主控板的接地點。該電子設備中金屬連接件的接地方式簡單，零件數量少，簡化了組裝流程且實現了靜電防護的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of the present invention discloses an electronic device, which includes a housing, a metal connector, a main control board, a fixing bracket, a conductive layer, an elastic conductive connector, and a flexible circuit board. The metal connector is installed in a mounting slot on the housing. The fixing bracket and the main control board are arranged inside the housing. The conductive layer is formed on the top surface, connection surface, and outer surface of the fixing bracket using PDS technology. Both ends of the elastic conductive connector are electrically connected to the metal connector and the conductive layer, respectively. One end of the flexible circuit board is electrically connected to the conductive layer, while the other end is electrically connected to the main control board, thereby discharging and conducting static electricity generated on the metal connector to the grounding point of the main control board through the flexible circuit board. This grounding method for the metal connector in the electronic device is simple, reduces the number of parts, simplifies the assembly process, and effectively provides electrostatic protection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">11:空腔</p>  
        <p type="p">14:限位塊</p>  
        <p type="p">4:固定支架</p>  
        <p type="p">6:柔性線路板</p>  
        <p type="p">8:抵接支架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1106" publication-number="202628090"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628090.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體、製造記憶體的方法、及從記憶體讀取的方法</chinese-title>  
        <english-title>MEMORY, METHOD OF MANUFACTURING MAMORY, AND METHOD OF READING FROM MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G11C7/22</main-classification>  
        <further-classification edition="200601120260302B">G11C11/4193</further-classification>  
        <further-classification edition="202601120260302B">H10D88/00</further-classification>  
        <further-classification edition="202601120260302B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商台積電（中國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耿陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯妍婧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YANJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳經緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了具有束寬存取線的記憶體及其讀取方法和製造方法。一種記憶體包括相對於第一方向彼此堆疊並且對應地包括記憶體單元的第一組、第二組、第三組和第四組。第一組至第四組中的每個組包括相對於第一方向通過局部存取管理器彼此分開的第一分區和第二分區。（A）第一組和第二組以及（B）第三組和第四組被組織為對應的第一束和第二束。該記憶體還包括相對於第一方向將第一束和第二束分開的全域存取管理器。全域存取管理器通過對應的第一束寬寫入線和第二束寬寫入線或對應的第一束寬讀取線和第二束寬讀取線分別耦合到第一束和第二束。全域存取管理器被配置為在互斥的基礎上選擇性地對第一束和第二束存取。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory includes first, second, third and fourth banks stacked on each other relative to a first direction and correspondingly including memory cells. Each of first to fourth banks includes first and second partitions separated from each other by a local access manager relative to the first direction. The (A) the first and second banks and (B) the third and fourth banks are organized as corresponding first and second bundles. The memory further includes a global access manager separating the first and second bundles relative to the first direction. The global access manager being separately coupled to the first and second bundles by corresponding first and second bundle-wide write lines or corresponding first and second bundle-wide read lines. The global access manager is configured to selectively access the first and second bundles on a mutually exclusive basis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體</p>  
        <p type="p">102(1):束</p>  
        <p type="p">102(2):束</p>  
        <p type="p">104:全域存取管理器</p>  
        <p type="p">106(1):組</p>  
        <p type="p">106(2):組</p>  
        <p type="p">106(3):組</p>  
        <p type="p">106(4):組</p>  
        <p type="p">108:分區</p>  
        <p type="p">110:分區</p>  
        <p type="p">112:局部存取管理器/存取管理器</p>  
        <p type="p">114:全域控制器</p>  
        <p type="p">116:全域輸入/輸出電路</p>  
        <p type="p">120:本地控制器</p>  
        <p type="p">122:本地輸入/輸出電路</p>  
        <p type="p">124:本地輸入/輸出電路</p>  
        <p type="p">126:列解碼器&amp;amp;寫入線驅動器/列解碼器/DEC &amp;amp; WL驅動器</p>  
        <p type="p">128:記憶體單元陣列/陣列</p>  
        <p type="p">130:記憶體單元陣列/陣列</p>  
        <p type="p">132(1):組寬存取線/存取線/組寬信號線</p>  
        <p type="p">132(2):組寬存取線/存取線/組寬信號線</p>  
        <p type="p">134(1):束寬存取線/存取線/束寬信號線</p>  
        <p type="p">134(2):束寬存取線/存取線/束寬信號線</p>  
        <p type="p">136(1):束寬存取線/存取線/束寬信號線</p>  
        <p type="p">136(2):束寬存取線/存取線/束寬信號線</p>  
        <p type="p">140:對稱軸/折線/全域折線</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1107" publication-number="202628431"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628431.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120544</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於攝影機模組之電子裝置及其製造方法及攝影機模組</chinese-title>  
        <english-title>ELECTRONIC DEVICE FOR A CAMERA MODULE, METHOD FOR MANUFACTURING THE SAME, AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260316B">H04N23/54</main-classification>  
        <further-classification edition="202301120260316B">H04N23/57</further-classification>  
        <further-classification edition="202501120260316B">H10F39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商派克科技　包裝科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAC TECH - PACKAGING TECHNOLOGIES GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費特克　馬蒂亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FETTKE, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露是關於一種用於攝影機模組(1)之電子裝置(12)及其製造方法及攝影機模組，該攝影機模組具有形成入光孔(4)之殼體(2)，該電子裝置(12)包括：基板(14)，其具有第一側(18)及第二側(20)，該第一側被配置在該殼體(2)中以面向該入光孔(4)，並且該第二側與該第一側(18)相對；及影像感測器(16)，其具有光敏部分，並且被設計為覆晶晶片，並被安裝至該第二側(20)。該基板(14)形成為至少在該影像感測器(16)之該光敏部分之區域中是半透明的。本揭露進一步是關於一種包括該電子裝置之攝影機模組(1)及一種用於製造該電子裝置(12)之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an electronic device (12) for a camera module (1), a method for manufacturing the same and a camera module, wherein the camera module has a housing (2) forming a light-incident opening (4), and the electronic device (12) comprises: a substrate (14) having a first side (18), which is to be arranged in the housing (2) to face the light-incident opening (4), and a second side (20), which is opposite to the first side (18); and an image sensor (16), which has a light-sensitive portion, is designed as a flip chip, and is mounted to the second side (20). The substrate (14) is formed to be translucent at least in the area of the light-sensitive portion of the image sensor (16). The disclosure further relates to a camera module (1) comprising the electronic device and a method for manufacturing the electronic device (12).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:攝影機模組</p>  
        <p type="p">2:殼體</p>  
        <p type="p">4:入光孔</p>  
        <p type="p">6:透鏡鏡筒</p>  
        <p type="p">8:透鏡</p>  
        <p type="p">10:光</p>  
        <p type="p">12:電子裝置</p>  
        <p type="p">14:基板</p>  
        <p type="p">16:影像感測器</p>  
        <p type="p">18:第一側</p>  
        <p type="p">20:第二側</p>  
        <p type="p">22、24:接點墊</p>  
        <p type="p">26:焊料</p>  
        <p type="p">28:開口</p>  
        <p type="p">30:半透明元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1108" publication-number="202628157"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628157.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>校準電子束之著陸角度的方法</chinese-title>  
        <english-title>METHODS OF CALIBRATING A LANDING ANGLE OF AN ELECTRON BEAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">H01J37/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫昱坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YUKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種校準一電子束之一著陸角度之方法包含：製造一著陸角度標準結構；判定該著陸角度標準結構相對於一參考平面的一傾斜角度；掃描該著陸角度標準結構以產生該著陸角度標準結構之複數個影像；判定形成於該著陸角度標準結構上之一第一側壁與形成於該著陸結構上之一第二側壁之間之一寬度差；使用該第一側壁與該第二側壁之間之該寬度差來判定該電子束之一射束傾斜；藉由比較該電子束之該射束傾斜與該著陸角度標準結構之該傾斜角度來判定該電子束之該著陸角度；及調整該電子束，使得該電子束之該著陸角度法向於該著陸角度標準結構之一表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of calibrating a landing angle of an electron beam includes fabricating a landing angle standard structure, determining a tilt angle of the landing angle standard structure relative a reference plane, scanning the landing angle standard structure to generate a plurality of images of the landing angle standard structure, determining a width difference between a first sidewall formed on the landing angle standard structure and a second sidewall formed on the landing structure, determining, using the width difference between the first sidewall and the second sidewall, a beam tilt of the electron beam, determining, by comparing the beam tilt of the electron beam to the tilt angle of the landing angle standard structure, the landing angle of the electron beam, and adjusting the electron beam, such that the landing angle of the electron beam is normal to a surface of the landing angle standard structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:結構</p>  
        <p type="p">12:表面</p>  
        <p type="p">22:第一目標點</p>  
        <p type="p">22a:第一目標點高度</p>  
        <p type="p">24:第二目標點</p>  
        <p type="p">24a:第二目標點高度</p>  
        <p type="p">B:電子束</p>  
        <p type="p">R:參考平面</p>  
        <p type="p">T&lt;sub&gt;d&lt;/sub&gt;:目標點距離</p>  
        <p type="p">Θ&lt;sub&gt;LA&lt;/sub&gt;:著陸角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1109" publication-number="202627560"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627560.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件、封裝件以及形成半導體封裝件的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE, PACKAGE AND METHOD OF FORMING SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G02B6/122</main-classification>  
        <further-classification edition="200601120260302B">G02B6/132</further-classification>  
        <further-classification edition="200601120260302B">G02B6/24</further-classification>  
        <further-classification edition="202601120260302B">H10W74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒家翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體封裝件包括耦合到封裝件基板的第一側的光子封裝件以及設置在光子封裝件和封裝件基板的第一側之間的第一導電連接件。光子封裝件包括半導體基板、在半導體基板的頂面上且具有第一曲率半徑的第一耦合透鏡、在半導體基板的頂面上且具有第二曲率半徑的第二耦合透鏡以及設置在半導體基板下方的多個耦合器。第一導電連接件附接到在封裝件基板的第一側的第一接合墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a photonic package coupled to a first side of a package substrate and first conductive connectors disposed between the photonic package and the first side of the package substrate. The photonic package includes a semiconductor substrate, a first coupling lens on a top surface of the semiconductor substrate and having a first radius of curvature, a second coupling lens on the top surface of the semiconductor substrate and having a second radius of curvature, and a plurality of couplers disposed below the semiconductor substrate. The first conductive connectors are attached to first bond pads on the first side of the package substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:封裝組件</p>  
        <p type="p">100:光學中介物</p>  
        <p type="p">101:第一基板</p>  
        <p type="p">103:第一絕緣層</p>  
        <p type="p">201:第一主動層</p>  
        <p type="p">203:第一光學構件</p>  
        <p type="p">204:光柵耦合器</p>  
        <p type="p">401:第二絕緣層</p>  
        <p type="p">501:第一金屬化層</p>  
        <p type="p">503:第二光學構件</p>  
        <p type="p">505:第一接合層</p>  
        <p type="p">507:第一接合墊</p>  
        <p type="p">509:第一介電材料</p>  
        <p type="p">511:第三光學構件</p>  
        <p type="p">601:第一半導體元件</p>  
        <p type="p">603:半導體基板</p>  
        <p type="p">605:主動元件</p>  
        <p type="p">607:內連線結構</p>  
        <p type="p">609:第二接合層</p>  
        <p type="p">611:第二接合墊</p>  
        <p type="p">613:間隙填充材料</p>  
        <p type="p">701:支撐基板</p>  
        <p type="p">703:耦合透鏡/第一耦合透鏡/第二耦合透鏡</p>  
        <p type="p">704:區域</p>  
        <p type="p">707:抗反射塗布(ARC)膜</p>  
        <p type="p">R1:曲率半徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1110" publication-number="202627641"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627641.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>密封層形成用片及密封有多個發光元件的構件</chinese-title>  
        <english-title>SHEET FOR FORMING SEALING LAYER, AND MEMBER WITH A PLURALITY OF LIGHT EMITTING ELEMENTS SEALED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250626B">G02F1/13357</main-classification>  
        <further-classification edition="200601120250626B">G09F9/30</further-classification>  
        <further-classification edition="200601120250626B">G09F9/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松戸和規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDO, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山蕗夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, ROMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草野大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSANO, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南方克哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAKATA, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種密封層形成用片以及提供一種具有耐遷移性及所述邊界的不可視性優異的密封層的構件。本公開的密封層形成用片是用於填埋將多個發光元件（7）作為光源的顯示器用的發光元件（7）彼此之間，且被覆多個發光元件（7）的密封層形成用片（1），且密封層形成用片（1）依次配置有第一膜（2）、密封層前體（α）、及第二膜（5），密封層前體（α）的水蒸氣透過度小於100[g/（m&lt;sup&gt;2&lt;/sup&gt;·24小時）]，吸濕率為1.5%質量以下，密封層前體（α）具有折射率為1.51±0.03的嵌入用無色樹脂組合物層（3）及折射率為1.53±0.03的水蒸氣阻擋層（4）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:密封層形成用片</p>  
        <p type="p">2:第一膜</p>  
        <p type="p">3:樹脂組合物層</p>  
        <p type="p">3':硬化物</p>  
        <p type="p">4:水蒸氣阻擋層</p>  
        <p type="p">5:第二膜</p>  
        <p type="p">6:基板</p>  
        <p type="p">7:元件</p>  
        <p type="p">8:構件</p>  
        <p type="p">β1:密封對象</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1111" publication-number="202626275"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626275.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120818</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖緊及釋放工具</chinese-title>  
        <english-title>ANCHOR AND RELEASE TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B25B13/08</main-classification>  
        <further-classification edition="200601120260323B">B25B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商葛利普控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIP HOLDINGS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫庫克　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKUCKA, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫庫克　湯瑪士史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKUCKA, THOMAS STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫庫克　西蒙Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKUCKA, SIMEON B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳洲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鎖緊及釋放工具，其使用一對咬齒，被設計來實質地消除滑移並且將扭力轉移到扣件。本發明的工具包含：一個扳手扭力工具本體、及至少一個咬合元件。扳手扭力工具本體包括：複數個內側面、一個第一工具本體基面、及一個第二工具本體基面。咬合元件側向地結合於一個特定內側面，並且提供額外的夾咬作用。為達成上述的功能，每一個咬合元件更包含：一個第一咬齒、及一個第二咬齒。第一咬齒及第二咬齒彼此分開，並且沿著一個側面基面分佈。第一咬齒是一個夾咬齒，其係設計來夾咬住扣件，尤其是從遠離公扣件的凸角的位置，夾咬住六角公扣件。第二咬齒是一個釋放齒，其係設計來從扣件釋放工具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anchor and release tool that utilizes a pair of teeth designed to virtually eliminate slippage and facilitate torque transfer to a fastener. The tool includes a wrench torque-tool body and at least one engagement element. The wrench torque-tool body includes a plurality of internal sidewalls, an engagement first base, and an engagement second base. The engagement element is laterally integrated into a specific sidewall to provide additional gripping action. To perform this function, each engagement element further includes a first tooth and a second tooth. Both the first tooth and the second tooth are positioned offset from each other, along a sidewall base surface. The first tooth is the anchoring tooth, designed to grip the fastener specifically from off the corner off a male hex fastener. In contrast, the second tooth is the releasing tooth, designed to release the tool from the fastener.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:扳手扭力工具本體</p>  
        <p type="p">2:內側面</p>  
        <p type="p">3:第一側邊</p>  
        <p type="p">4:第二側邊</p>  
        <p type="p">5:側面基面</p>  
        <p type="p">7:第一咬齒</p>  
        <p type="p">8:第二咬齒</p>  
        <p type="p">13:第一工具本體基面</p>  
        <p type="p">14:第二工具本體基面</p>  
        <p type="p">15:樞軸</p>  
        <p type="p">16:咬合元件</p>  
        <p type="p">21:特定內側面</p>  
        <p type="p">22:相對內側面</p>  
        <p type="p">23:中間內側面</p>  
        <p type="p">30:扣件容納開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1112" publication-number="202628982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120847</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/43</main-classification>  
        <further-classification edition="202601120260302B">H10W70/60</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10P14/69</further-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林裕峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, YU-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭羽婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HONG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪敏修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MIN-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZIH-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了半導體裝置及形成方法。半導體裝置的電介質層可被使用氧化處理製程進行處理以調整電介質層的介電常數。例如，半導體裝置的互連層中的蝕刻停止層（ESL）可以由高介電常數（高k）電介質材料形成，其為ESL提供了相對於互連層中的其他電介質層的蝕刻選擇性。可以穿過ESL並穿過電介質層形成凹部，並且可以在凹部中形成導電結構。在形成導電結構之前，可以執行氧化處理操作以氧化ESL在凹部中的的暴露端部。氧化處理可以降低ESL的端部的介電常數，這可使得ESL的端部不易受到隧道效應、熱載流子注入及／或熱電子發射而帶來的電流洩漏的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dielectric layer of a semiconductor device may be treated using an oxidation treatment process to tune the dielectric constant of the dielectric layer. For example, an etch stop layer (ESL) in an interconnect layer of the semiconductor device may be formed of a high dielectric constant (high-k) dielectric material, which provides etch selectivity for the ESL relative to other dielectric layers in the interconnect layer. A recess may be formed through the ESL and through the dielectric layers, and a conductive structure may be formed in the recess. Prior to formation of the conductive structure, an oxidation treatment operation may be performed to oxidize the exposed ends of the ESL in the recess. The oxidation treatment may lower the dielectric constant of the ends of the ESL, which may result in the ends of the ESL being less susceptible to current leakage through tunneling, hot-carrier injection, and／or thermionic emission.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102:裝置層</p>  
        <p type="p">104:互連層</p>  
        <p type="p">106:基板層</p>  
        <p type="p">108:電介質層</p>  
        <p type="p">110:積體電路裝置</p>  
        <p type="p">112:源極/汲極區域</p>  
        <p type="p">114:閘極電介質層</p>  
        <p type="p">116:閘極結構</p>  
        <p type="p">118:通道層</p>  
        <p type="p">120a:側壁間隔件</p>  
        <p type="p">120b:內部間隔件</p>  
        <p type="p">122:源極/汲極接觸結構</p>  
        <p type="p">124:襯墊層</p>  
        <p type="p">126:層間電介質(ILD)層</p>  
        <p type="p">128:蝕刻停止層(ESL)</p>  
        <p type="p">130:金屬化結構</p>  
        <p type="p">132:互連結構</p>  
        <p type="p">134:源極/汲極互連結構</p>  
        <p type="p">136:閘極互連結構</p>  
        <p type="p">138:氧化物區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1113" publication-number="202628487"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628487.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源裝置及壓力操作機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">H05G2/00</main-classification>  
        <further-classification edition="200601120260323B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商牛尾電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USHIO DENKI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芦澤則孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHIZAWA, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] &lt;br/&gt;　　提供一種藉由簡便構成，而能夠操作發光點的氣體壓力的光源裝置及壓力操作機構。 &lt;br/&gt;[解決手段] &lt;br/&gt;　　本發明的一形態的光源裝置，係藉由能量的注入將原料電漿化以產生放射線的光源裝置，具備有腔室、原料供給部、能量源、及壓力操作機構。壓力操作機構，具備有放射線射出部及氣體導入部。放射線射出部，連接於形成電漿生成空間的殼體，前端為突出於電漿生成空間的筒狀，於前端具有連通於電漿生成空間並且相對於能量注入位置的開口，形成內徑從開口隨著遠離能量注入位置而增大的放射線射出空間。氣體導入部，係將氣體導入於電漿生成空間及放射線射出空間的至少一者的氣體導入部，氣體噴出方向朝向供氣體導入部連接的壁面相對的壁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:真空腔室</p>  
        <p type="p">106:原料供給部</p>  
        <p type="p">107:壓力操作機構</p>  
        <p type="p">120:旋轉體</p>  
        <p type="p">120a:旋轉面</p>  
        <p type="p">134:殼體</p>  
        <p type="p">134a:第1壁面</p>  
        <p type="p">134b:第2壁面</p>  
        <p type="p">137:電漿生成空間</p>  
        <p type="p">141:放射線射出部</p>  
        <p type="p">141a:前端</p>  
        <p type="p">142:氣體導入部</p>  
        <p type="p">143:流量控制部</p>  
        <p type="p">151:第1開口</p>  
        <p type="p">152:第2開口</p>  
        <p type="p">153:側壁部</p>  
        <p type="p">153a:第3壁面</p>  
        <p type="p">153b:第4壁面</p>  
        <p type="p">154:放射線射出空間</p>  
        <p type="p">155:第1氣體導入口</p>  
        <p type="p">156:第2氣體導入口</p>  
        <p type="p">157:第1配管</p>  
        <p type="p">158:第2配管</p>  
        <p type="p">D:內徑</p>  
        <p type="p">H:法線</p>  
        <p type="p">K:距離</p>  
        <p type="p">I:注入位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1114" publication-number="202628661"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628661.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120968</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及形成積體晶片封裝的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTEGRATED CIRCUIT PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10D84/01</main-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10W70/60</further-classification>  
        <further-classification edition="202601120260302B">H10W90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林頌恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SUNG EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林振昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史朝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, KUO-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在實施例中，方法包含包括形成多個底部晶粒的晶圓，多個底部晶粒包含第一底部晶粒以及第二底部晶粒，第一底部晶粒以及第二底部晶粒以第一距離側向移位；以面對面組態將第一頂部晶粒接合至第一底部晶粒；以面對面組態將第二頂部晶粒接合至第二底部晶粒，第一頂部晶粒以及第二頂部晶粒以第二距離側向移位，第二距離不同於第一距離；以及以面對面組態將內連線晶粒接合至第一底部晶粒以及至第二底部晶粒，內連線晶粒夾置於第一頂部晶粒以及第二頂部晶粒之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a method includes forming a wafer comprising a plurality of bottom dies, the plurality of bottom dies comprising a first bottom die and a second bottom die, the first bottom die and the second bottom die being laterally displaced by a first distance; bonding a first top die to the first bottom die in a face-to-face configuration; bonding a second top die to the second bottom die in a face-to-face configuration, the first top die and the second top die being laterally displaced by a second distance, the second distance being different from the first distance; and bonding an interconnection die to the first bottom die and to the second bottom die in a face-to-face configuration, the interconnection die being interposed between the first top die and the second top die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:積體晶片封裝</p>  
        <p type="p">123、223:接合墊</p>  
        <p type="p">132:封裝體</p>  
        <p type="p">150、150A、250、350、350D:晶粒</p>  
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;、P&lt;sub&gt;2&lt;/sub&gt;、P&lt;sub&gt;3&lt;/sub&gt;:路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1115" publication-number="202628641"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628641.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的單元區及其製造方法</chinese-title>  
        <english-title>CELL REGION OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D62/10</main-classification>  
        <further-classification edition="202501120260302B">H10D62/60</further-classification>  
        <further-classification edition="202501120260302B">H10D62/80</further-classification>  
        <further-classification edition="202501120260302B">H10D64/27</further-classification>  
        <further-classification edition="202501120260302B">H10D30/60</further-classification>  
        <further-classification edition="202601120260302B">H10W10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖丰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敬餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃元昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUAN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈孟弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, MENG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, JIANN-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">（半導體裝置的）單元區包括：第一和第二主動區在第一參考線相對側上，並且相對於第一參考線相鄰，並且被相應地用不同摻雜劑摻雜；以及虛設閘極段，每個虛設閘極段重疊主動區；主動區對應AR部分被定義在相鄰虛設閘極段之間；第一和第二主動區中每個包括相鄰第一和第二AR部分；第一和第二AR部分定義第一和第二AR段；第一和第二AR段中每個具有第一和第二剖面，相應地靠近和遠離第一參考線；以及第一和第二AR段中每個靠近剖面為平面；以及第一或第二AR段遠離剖面為階梯狀，使得第一或第二AR段為凹多邊形形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cell region (of a semiconductor device) includes: first and second active regions on opposite sides of, and adjacent relative to, a first reference line, and being doped correspondingly with different dopants; and dummy gate segments each of which overlapping the active regions; corresponding AR-portions of the active regions being defined between adjacent ones of the dummy gate segments; each of the first and second active regions including adjacent first and second ones of the AR-portions; the first and second AR-portions defining first and second AR-sections; each of the first and second AR-sections having first and second profiles that correspondingly are proximal and distal to the first reference line; and the proximal profile of each of the first and second AR-sections being planar; and the distal profile of the first or second AR-section being stepped such that the first or second AR-section is a concave polygon shape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202A:單元區</p>  
        <p type="p">204N(1)、204P(1):AR段</p>  
        <p type="p">205(1):N井</p>  
        <p type="p">206(1)、206(2)、206(3)、206(4):介電結構</p>  
        <p type="p">208N(1)、208P(1):主動區</p>  
        <p type="p">210(1)、210(2):閘極段</p>  
        <p type="p">212(1)、212(2)、212(3):虛設閘極段</p>  
        <p type="p">214(1)、214(2)、214(3)、214(4):金屬化結構</p>  
        <p type="p">218N(1)、218N(2)、218P(1)、218P(2):AR部分</p>  
        <p type="p">220(1)、220(2):內角</p>  
        <p type="p">222(1):參考線</p>  
        <p type="p">Hcr:高度</p>  
        <p type="p">Wnom、Ws:寬度</p>  
        <p type="p">DNarp、DParp、Dovhmin:距離</p>  
        <p type="p">Sarp:尺寸</p>  
        <p type="p">sde_21、sde_22、sde_23、sde_24、sde_25、sde_26、sde_27、sde_28:側面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1116" publication-number="202628567"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628567.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體記憶裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250901B">H10B12/00</main-classification>  
        <further-classification edition="202501120250901B">H10D30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地巧也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電晶體特性優異的半導體裝置。實施方式的半導體裝置包括：第一電極、第二電極、第一電極與第二電極之間的氧化物半導體層、閘極電極、第一電極與閘極電極之間的第一絕緣層、閘極電極與第二電極之間的第二絕緣層、以及閘極電極、第一絕緣層及第二絕緣層與氧化物半導體層之間的閘極絕緣層。在將第一絕緣層與氧化物半導體層之間的閘極絕緣層的厚度設為第一厚度，將第二絕緣層與氧化物半導體層之間的閘極絕緣層的厚度設為第二厚度，將閘極電極的第一電極之側的第一端部與氧化物半導體層之間的閘極絕緣層的厚度設為第三厚度，將閘極電極的第二電極之側的第二端部與氧化物半導體層之間的閘極絕緣層的厚度設為第四厚度的情況下，第二厚度較第一厚度厚，或者第四厚度較第三厚度厚。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:下部電極(第一電極)</p>  
        <p type="p">14:上部電極(第二電極)</p>  
        <p type="p">16:氧化物半導體層</p>  
        <p type="p">18a:第一部分</p>  
        <p type="p">18b:第二部分</p>  
        <p type="p">20:閘極絕緣層</p>  
        <p type="p">22a:第三部分</p>  
        <p type="p">22b:第四部分</p>  
        <p type="p">24a:第五部分</p>  
        <p type="p">24b:第六部分</p>  
        <p type="p">100:電晶體(半導體裝置)</p>  
        <p type="p">d1:第一距離</p>  
        <p type="p">d2:第二距離</p>  
        <p type="p">E1:第一端部</p>  
        <p type="p">E2:第二端部</p>  
        <p type="p">P1:第一位置</p>  
        <p type="p">P2:第二位置</p>  
        <p type="p">P3:第三位置</p>  
        <p type="p">P4:第四位置</p>  
        <p type="p">t1:第一厚度</p>  
        <p type="p">t2:第二厚度</p>  
        <p type="p">t3:第三厚度</p>  
        <p type="p">t4:第四厚度</p>  
        <p type="p">w1:第一寬度</p>  
        <p type="p">w2:第二寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1117" publication-number="202627511"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627511.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路診斷裝置與方法</chinese-title>  
        <english-title>CIRCUIT DIAGNOSIS DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">G01R31/3185</main-classification>  
        <further-classification edition="200601120250901B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕帝達　安基達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIDAR, ANKITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈埃爾　桑迪庫馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOEL, SANDEEP KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路診斷裝置，包括一掃描鍊以及一裝置電路。掃描鍊包括複數序列元件以及一診斷硬體電路。序列元件以串聯方式連接，並分組為複數區段。診斷硬體電路包括複數電路元件，各自連接至相應的一區段中的一個序列元件。診斷硬體電路在一診斷模式中辨識出一不良區段。測試型樣資料在診斷模式中被連續傳遞通過掃描鍊，以隔絕不良區段中的故障序列元件。裝置電路連接至掃描鍊，實施一或多種電路功能，並產出運作資料，運作資料在功能模式中被依序傳遞通過掃描鍊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit diagnosis device includes a scan chain and a device circuit. The scan chain includes a plurality of sequential elements and a diagnostic hardware circuit. The sequential elements are connected in series and grouped into a plurality of segments. The diagnostic hardware circuit includes a plurality of circuit components, each connected to one sequential element of a respective segment. The diagnostic hardware circuit identifies a defective segment of the scan chain during a diagnostic mode. Test pattern data is serially shifted through the scan chain to isolate the faulty sequential element of the defective segment during the diagnostic mode. The device circuit is connected to the scan chain, performs one or more circuit functions, and generates functional data that is sequentially shifted through the scan chain during a functional mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">110:輸入端</p>  
        <p type="p">120:掃描鍊</p>  
        <p type="p">130:裝置電路</p>  
        <p type="p">140:輸出端</p>  
        <p type="p">150:序列元件</p>  
        <p type="p">160:診斷硬體電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1118" publication-number="202626187"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626187.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細緻氣泡生成器、處理液供給裝置以及基板處理裝置</chinese-title>  
        <english-title>FINE BUBBLE GENERATOR, PROCESSING LIQUIS SUPPLYING APPARATUS AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260330B">B01F23/23</main-classification>  
        <further-classification edition="202201120260330B">B01F23/2375</further-classification>  
        <further-classification edition="202201120260330B">B01F25/45</further-classification>  
        <further-classification edition="202201120260330B">B01F35/71</further-classification>  
        <further-classification edition="202601120260330B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中根慎悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANE, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種即使在液體的流量已經變動之情形中亦能使細緻氣泡的生成效率穩定之技術。細緻氣泡生成器係具備第一管部(21)、狹窄管部(23)、第二管部(25)以及多流路閥機構(27)。狹窄管部(23)係位於比第一管部(21)還靠下游側，並具有流路剖面積朝向下游而變小之複數個狹窄流路(231)。第二管部(25)係位於比狹窄管部(23)還靠下游側。多流路閥機構(27)係因應第一管部(21)的流量變更複數個狹窄流路(231)中之連通於第一管部(21)以及第二管部(25)之流路的數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:細緻氣泡生成器</p>  
        <p type="p">21:第一管部</p>  
        <p type="p">23:狹窄管部</p>  
        <p type="p">25:第二管部</p>  
        <p type="p">27:多流路閥機構</p>  
        <p type="p">31:內筒</p>  
        <p type="p">33:施力部</p>  
        <p type="p">211:外筒</p>  
        <p type="p">213,213a,213b:連通孔</p>  
        <p type="p">230:連結構件</p>  
        <p type="p">231,231a,231b:狹窄流路</p>  
        <p type="p">311,311a,311b:貫通孔</p>  
        <p type="p">A1:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1119" publication-number="202626257"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626257.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨裝置、研磨方法及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260302B">B24B37/005</main-classification>  
        <further-classification edition="201201120260302B">B24B37/07</further-classification>  
        <further-classification edition="201201120260302B">B24B37/04</further-classification>  
        <further-classification edition="202601120260302B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒川岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKAWA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種提高了基板表面的平坦性的研磨裝置、研磨方法及半導體裝置的製造方法。一實施方式的研磨裝置包括：基板保持部，對基板進行保持；旋轉壓盤，對與所述基板相向的研磨墊進行保持並進行旋轉；液體供給部，向所述研磨墊上供給液體；以及控制構件，包括設置於所述旋轉壓盤與所述研磨墊之間且與所述研磨墊的外周部對應的位置並具有撓性的構件，對所述研磨墊的外周部的變形進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體單元陣列基板</p>  
        <p type="p">200:控制電路基板</p>  
        <p type="p">C100、C200:連接面</p>  
        <p type="p">e1:外周</p>  
        <p type="p">e100、e200:滾降區域的中心側</p>  
        <p type="p">x100、x200:滾降寬度</p>  
        <p type="p">Z:方向</p>  
        <p type="p">z100、z200:滾降量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1120" publication-number="202627663"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627663.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微影之幾何負載效應修正</chinese-title>  
        <english-title>GEOMETRIC LOADING EFFECT CORRECTION FOR LITHOGRAPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250917B">G03F1/70</main-classification>  
        <further-classification edition="201201120250917B">G03F1/22</further-classification>  
        <further-classification edition="200601120250917B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｄ2Ｓ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D2S, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申瑞　阿彼錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENDRE, ABHISHEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法及系統涉及複數個圖案，該複數個圖案中之各圖案包含複數個邊緣。方法及系統亦涉及針對該複數個圖案判定一鄰域開放區域密度；判定一幾何負載效應修正，其中該幾何負載效應修正包含自該複數個圖案中之一圖案之一邊緣的一經計算偏移，且其中該經計算偏移係使用該鄰域開放區域密度來判定；及使用該幾何負載效應修正來調整該複數個圖案中之該圖案之該邊緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems involve a plurality of patterns, each pattern in the plurality of patterns comprising a plurality of edges. Methods and systems also involve determining a neighborhood open area density for the plurality of patterns; determining a geometric loading effect correction, wherein the geometric loading effect correction comprises a calculated offset from an edge of a pattern in the plurality of patterns, and wherein the calculated offset is determined using the neighborhood open area density; and adjusting the edge of the pattern in the plurality of patterns using the geometric loading effect correction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:方法</p>  
        <p type="p">802、810、816、814、820:方塊</p>  
        <p type="p">805:圖案資訊</p>  
        <p type="p">818:經調整邊緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1121" publication-number="202628252"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628252.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器用電路板</chinese-title>  
        <english-title>CIRCUIT BOARD FOR CONNECTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250730B">H01R12/52</main-classification>  
        <further-classification edition="201101120250730B">H01R12/62</further-classification>  
        <further-classification edition="201101120250730B">H01R12/72</further-classification>  
        <further-classification edition="201101120250730B">H01R12/73</further-classification>  
        <further-classification edition="200601120250730B">H05K1/11</further-classification>  
        <further-classification edition="200601120250730B">H05K1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明諦顧問有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN DI CONSULTANTS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN-LIN, LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佶諦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI-DI, LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳修閘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於高頻與高速資料傳輸用之電路板，該電路板上的差分對電路(differential pair circuits)採用緊密佈局，使得電路板一端佔用的面積高度降低，形成窄端與寬端之漏斗形狀。本發明的電路板的窄端，適用於電性耦合至ASIC基板；本發明電路板的寬端，適用於電性耦合至至少一個乙太網路埠(Ethernet port)，本發明的電路板適於做成ASIC與乙太網路埠間極短距（XSR）的介面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board designed for high-frequency and high-speed data transmission is disclosed. The circuit board features a compact layout for differential pair circuits with less elevation occupied on one end, resulting in a circuit board shaped with a narrow side and a wide side. The narrow side is adapted for electrical coupling with an ASIC substrate, while the wide side is adapted for electrical coupling with at least one Ethernet port. This circuit board creates an extremely short-range (XSR) interface between the ASIC and the Ethernet port.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">205:差分對電路</p>  
        <p type="p">205P:平行電路走線</p>  
        <p type="p">206:矩形金屬墊片</p>  
        <p type="p">207:圓形金屬墊片</p>  
        <p type="p">304:電路板</p>  
        <p type="p">E1:高度</p>  
        <p type="p">E2:高度</p>  
        <p type="p">NS:窄側</p>  
        <p type="p">WS:寬側</p>  
        <p type="p">V11:金屬通孔</p>  
        <p type="p">V12:金屬通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1122" publication-number="202627684"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627684.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>底層成分及製造半導體元件的方法</chinese-title>  
        <english-title>UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G03F7/11</main-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/26</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭彥佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>訾安仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZI, AN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅元志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YUAN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭雅如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YAHRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於製造半導體元件的方法包括在基板上方形成抗蝕劑底層。抗蝕劑底層包括：底層成分，包括具有側鏈光酸產生劑(pendant photoacid generator, PAG)基團、側鏈熱酸產生劑(pendant thermal acid generator, TAG)基團、或側鏈PAG及側鏈TAG基團的組合的第一聚合物；以及交聯基團。包括光阻劑成分的光阻劑層在抗蝕劑底層上方形成。將光阻劑層選擇性暴露於光化輻射，並且顯影選擇性暴露的光阻劑層以在光阻劑層中形成圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a semiconductor device includes forming a resist underlayer over a substrate. The resist underlayer includes an underlayer composition, including a first polymer with pendant photoacid generator (PAG) groups, pendant thermal acid generator (TAG) groups, or a combination of pendant PAG and pendant TAG groups; and a crosslinking group. A photoresist layer including a photoresist composition is formed over the resist underlayer. The photoresist layer is selectively exposed to actinic radiation, and the selectively exposed photoresist layer is developed to form a pattern in the photoresist layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製程流程</p>  
        <p type="p">S110:操作</p>  
        <p type="p">S120:操作</p>  
        <p type="p">S130:操作</p>  
        <p type="p">S140:操作</p>  
        <p type="p">S150:操作</p>  
        <p type="p">S160:操作</p>  
        <p type="p">S170:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1123" publication-number="202627648"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627648.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拍攝裝置以及檢查裝置</chinese-title>  
        <english-title>IMAGING APPARATUS AND INSPECTION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260320B">G03B5/02</main-classification>  
        <further-classification edition="202101120260320B">G03B15/06</further-classification>  
        <further-classification edition="200601120260320B">G01N21/64</further-classification>  
        <further-classification edition="200601120260320B">G01N21/47</further-classification>  
        <further-classification edition="201401120260320B">G01N21/55</further-classification>  
        <further-classification edition="200601120260320B">G01N21/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤本力夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMOTO, RIKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水田靖生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTA, YASUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">拍攝裝置2係具備：台21，係保持對象物；第一出射部3，係出射第一出射光，該第一出射光為紫外光；第二出射部4，係出射第二出射光，該第二出射光為波長帶域與紫外光不同的光；十字二向色稜鏡5，為具有第一側面51至第四側面54之四角柱，將入射至第一側面51的第一出射光從第三側面53出射並導引至對象物上的拍攝區域90，並且將入射至第二側面52的第二出射光從第三側面53出射並導引至拍攝區域90；以及拍攝部7，係在第一出射光照射至拍攝區域90之情形中接收在拍攝區域90處所產生的螢光，並且在第二出射光照射至拍攝區域90之情形中接收在拍攝區域90中的第二出射光的反射光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The imaging apparatus 2 comprises a stage 21 for holding an object, a first emission part 3 for emitting first emission light which is ultraviolet light, a second emission part 4 for emitting second emission light which is light in a wavelength range different from the ultraviolet light, a cross dichroic prism 5 which is a rectangular prism having first to fourth side faces 51 to 54 and emits the first emission light, which is incident on the first side face 51, from the third side face 53 and guides it to an imaging area 90 on the object, and emits the second emission light, which is incident on the second side face 52, from the third side face 53 and guides it to the imaging area 90, and an imaging part 7 which receives fluorescence generated in the imaging area 90 when the first emission light is irradiated onto the imaging area 90, and receives reflected light of the second emission light in the imaging area 90 when the second emission light is irradiated onto the imaging area 90.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢查裝置</p>  
        <p type="p">2:拍攝裝置</p>  
        <p type="p">3:第一出射部</p>  
        <p type="p">4:第二出射部</p>  
        <p type="p">5:X稜鏡(十字二向色稜鏡)</p>  
        <p type="p">6:圓頂型照明部</p>  
        <p type="p">7:拍攝部</p>  
        <p type="p">9:印刷基板</p>  
        <p type="p">10:電腦</p>  
        <p type="p">11:檢查部</p>  
        <p type="p">21:台</p>  
        <p type="p">22:台移動機構</p>  
        <p type="p">31,41,62:光源部</p>  
        <p type="p">32,42:光學系統</p>  
        <p type="p">51:第一側面(十字二向色稜鏡的側面)</p>  
        <p type="p">52:第二側面(十字二向色稜鏡的側面)</p>  
        <p type="p">53:第三側面(十字二向色稜鏡的側面)</p>  
        <p type="p">54:第四側面(十字二向色稜鏡的側面)</p>  
        <p type="p">56:第一鏡膜(鏡膜)</p>  
        <p type="p">57:第二鏡膜(鏡膜)</p>  
        <p type="p">61:圓頂本體</p>  
        <p type="p">71:拍攝元件</p>  
        <p type="p">72:拍攝光學系統</p>  
        <p type="p">90:拍攝區域(區域)</p>  
        <p type="p">610:開口部</p>  
        <p type="p">611:圓頂內表面</p>  
        <p type="p">612:環狀鍔部</p>  
        <p type="p">621:光源</p>  
        <p type="p">J1:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1124" publication-number="202626853"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626853.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚碳酸酯系樹脂組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08G64/18</main-classification>  
        <further-classification edition="200601120260323B">C08L69/00</further-classification>  
        <further-classification edition="200601120260323B">C08G77/448</further-classification>  
        <further-classification edition="200601120260323B">C08L83/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商出光興產股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保昌浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井手田一茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDETA, KAZUSHIGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小草優希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGUSA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明藉由下述聚碳酸酯系樹脂組合物，提供一種製造時之消泡性能優異並且透明性優異之聚碳酸酯系樹脂組合物，上述聚碳酸酯系樹脂組合物包含聚碳酸酯-聚有機矽氧烷共聚物(A)、及羥值為15 mgKOH/g以上且未達50 mgKOH/g之甲醇改性聚矽氧(B)，並且 &lt;br/&gt;上述聚碳酸酯-聚有機矽氧烷共聚物(A)包含聚碳酸酯嵌段及含有下述通式(1)所表示之結構單元(A-1)之聚有機矽氧烷嵌段。 &lt;br/&gt;&lt;img align="absmiddle" height="86px" width="190px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[通式(1)中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子、鹵素原子、碳數1～10之烷基、碳數1～10之烷氧基、碳數6～12之芳基或碳數7～22之烷基芳基]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1125" publication-number="202628568"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628568.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔珍銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIN MYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安東浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, DONGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹敏瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, MINSEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎭宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括：一位元線，其在一第一方向上延伸；一模結構，其在一第二方向上延伸且具有在該第一方向上彼此相對之一第一側表面及一第二側表面；以及一第一垂直半導體圖案及一第二垂直半導體圖案，其等在該位元線上且分別在該模結構之該第一側表面及該第二側表面上。該模結構之該第一側表面及該第二側表面中之每一者具有一非線性部分，且該第一垂直半導體圖案沿著該第一側表面之該非線性部分延伸，且該第二垂直半導體圖案沿著該第二側表面之該非線性部分延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a bit line extending in a first direction, a mold structure extending in a second direction and having a first side surface and a second side surface opposed to each other in the first direction, and a first vertical semiconductor pattern and a second vertical semiconductor pattern that are on the bit line and are respectively on the first side surface and the second side surface of the mold structure. Each of the first side surface and the second side surface of the mold structure has a nonlinear portion, and the first vertical semiconductor pattern extends along the nonlinear portion of the first side surface, and the second vertical semiconductor pattern extends along the nonlinear portion of the second side surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BL:位元線</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">GE:閘極電極</p>  
        <p type="p">GE1:第一閘極電極</p>  
        <p type="p">GE2:第二閘極電極</p>  
        <p type="p">GI:閘極絕緣圖案</p>  
        <p type="p">LP:焊著墊</p>  
        <p type="p">MS:模結構</p>  
        <p type="p">RS1:第一凹入側表面</p>  
        <p type="p">RS2:第二凹入側表面</p>  
        <p type="p">S1:第一側表面</p>  
        <p type="p">S2:第二側表面</p>  
        <p type="p">VSP1:第一垂直半導體圖案，半導體圖案</p>  
        <p type="p">VSP2:第二垂直半導體圖案，半導體圖案</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W2:第二寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1126" publication-number="202628096"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628096.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121534</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及記憶體系統</chinese-title>  
        <english-title>MEMORY DEVICE AND MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251118B">G11C11/40</main-classification>  
        <further-classification edition="200601120251118B">G11C11/54</further-classification>  
        <further-classification edition="200601120251118B">G11C15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾柏皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PO-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栢添賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BO, TIAN-CIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體裝置包含複數個記憶體區塊，記憶體區塊用以儲存第一儲存資料，並用以比較第一儲存資料及第一輸入資料以產生一第一電流信號，記憶體區塊包含彼此耦接的複數個記憶體字串，用以產生複數個字串電流信號，其中記憶體區塊用以將字串電流信號相加以產生第一電流信號，以及第一電流信號的電流準位正比於第一輸入資料的一輸入值及第一儲存資料的一儲存值之間的一差值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a plurality of memory blocks configured to store first stored data, and configured to compare the first stored data and first input data to generate a first current signal. The plurality of memory blocks includes a plurality of memory strings coupled with each other, and configured to generate a plurality of string current signals, in which the plurality of memory blocks are configured to sum the plurality of string current signals to generate the first current signal, and a current level of the first current signal is proportional to a difference between an input value of the first input data and a stored value of the first stored data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">IS1_1~IS4_8:字串電流信號</p>  
        <p type="p">WL0~WL191:字元線信號</p>  
        <p type="p">SSL1_1~SSL4_8:字串選擇線信號</p>  
        <p type="p">VREAD:讀取電壓準位</p>  
        <p type="p">VPASS:通過電壓準位</p>  
        <p type="p">IT1:電流信號</p>  
        <p type="p">SDT0~SDT191:儲存資料</p>  
        <p type="p">IDT:輸入資料</p>  
        <p type="p">ISL1:電流準位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1127" publication-number="202627351"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627351.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">F21V8/00</main-classification>  
        <further-classification edition="200601120260317B">G02B17/00</further-classification>  
        <further-classification edition="200601120260317B">G02B27/14</further-classification>  
        <further-classification edition="202001120260317B">G02B30/40</further-classification>  
        <further-classification edition="200601120260317B">G09F13/12</further-classification>  
        <further-classification edition="200601120260317B">G09F13/14</further-classification>  
        <further-classification edition="200601120260317B">G09F19/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商雷蛇（亞太）私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAZER (ASIA-PACIFIC) PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虞　華龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HUALONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據各種實施例，可以提供一種顯示裝置。該顯示裝置可包括第一面板和第二面板、以及光傳輸體和光源。光傳輸體可經組態以引導由光源發射的光，通過光傳輸體從光輸入面到達光傳輸體的主要光輸出部分，以使光經由第二面板的至少一透光區域，朝向第一面板穿透過第二面板，以藉由第一面板的至少一部分反射區域對光進行部分反射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to various embodiments, there may be provided a display device. The display device may include a first panel and a second panel, as well as a light-transmission body and a light source. The light-transmission body may be configured to channel light that is emitted by the light source, through the light-transmission body from a light-input face to a primary light-output portion of the light-transmission body, to cause the light to pass through the second panel, via at least one light-transmissive region of the second panel, towards the first panel for partial reflection of the light by at least one partially reflective region of the first panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:顯示裝置</p>  
        <p type="p">301:外殼</p>  
        <p type="p">310:第一面板</p>  
        <p type="p">320:第二面板</p>  
        <p type="p">322:透光區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1128" publication-number="202628654"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628654.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D64/27</main-classification>  
        <further-classification edition="202501120251103B">H10D64/68</further-classification>  
        <further-classification edition="200601120251103B">H01B3/10</further-classification>  
        <further-classification edition="202501120251103B">H10D30/62</further-classification>  
        <further-classification edition="202501120251103B">H10D64/01</further-classification>  
        <further-classification edition="202501120251103B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴蓓盈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PEI YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯承浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, CHENG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUI, CHI ON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許嘉芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIA-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">形成半導體裝置結構的方法包括在第一及第二裝置區形成IL圍繞半導體通道層；在IL上形成HK介電層；在HK介電層上形成包含用於具有第一導電性的裝置的元素的調諧層；在第一及第二裝置區的調諧層上形成偶極層，其中調諧層及偶極層在處理腔室中順序形成而不破壞真空，且偶極層包含適合用於具有第一導電性類型的裝置的元素；在第二裝置區移除半導體通道層上的偶極層；在第一裝置區調諧層經熱處理將元素從調諧層驅入HK介電層中；在第一裝置區移除半導體通道層上的偶極層及調諧層；及在第一及第二裝置區形成閘電極層圍繞各半導體通道層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a semiconductor device structure includes forming an IL to surround each semiconductor channel layer at first and second device regions, forming a HK dielectric layer over the IL, forming a tuning layer over the HK dielectric layer, the tuning layer comprising elements for devices having a first conductivity, forming a dipole layer over the tuning layer at the first and second device regions, wherein the tuning layer and the dipole layer are sequentially formed in a processing chamber without breaking the vacuum, and the dipole layer comprises elements suitable for devices having the first conductivity type, removing the dipole layer over the semiconductor channel layers at the second device region, subjecting the tuning layer to a thermal treatment to drive elements from the tuning layer into the HK dielectric layer at the first device region, removing the dipole layer and the tuning layer over the semiconductor channel layers at the first device region, and forming a gate electrode layer to surround each semiconductor channel layer at the first and second device regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:半導體層</p>  
        <p type="p">129:混合層</p>  
        <p type="p">150:IL</p>  
        <p type="p">153:區</p>  
        <p type="p">155:區</p>  
        <p type="p">160:HK介電層</p>  
        <p type="p">160':HK介電層</p>  
        <p type="p">165:閘電極層</p>  
        <p type="p">T1、T2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1129" publication-number="202626182"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626182.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超純水製造裝置的控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01D61/22</main-classification>  
        <further-classification edition="202301120260401B">C02F1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栩内優仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOCHINAI, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的超純水製造裝置的控制方法中，在UF膜9的回收配管13具有流量計21及手動閥22，在所述手動閥22的下游側設置控制閥23，所述控制閥23能夠藉由未圖示的控制部件並基於流量計21的測量值對其開度進行控制。在UF膜9的供給水的流量發生變動的情況下，濃縮水W3增加，但藉由利用流量計21對UF膜9的濃縮水W3的流量進行測量，並對控制閥23的開度進行調節以使所述流量恆定，而能夠抑制將UF膜9的供給水作為濃縮水W3過剩地排出至系統外的量。藉由此種超純水製造裝置的控制方法，能夠提高純水製造裝置的超濾膜中的水回收率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:一次純水供給管</p>  
        <p type="p">9:超濾膜(UF膜)</p>  
        <p type="p">13:回收配管</p>  
        <p type="p">21:流量計(測量部件)</p>  
        <p type="p">22:手動閥</p>  
        <p type="p">23:控制閥(控制部件)</p>  
        <p type="p">W3:濃縮水</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1130" publication-number="202628344"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628344.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121739</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用增益提升的低雜訊晶體振盪器與其產生振盪訊號的方法</chinese-title>  
        <english-title>LOW-NOISE CRYSTAL OSCILLATOR USING GAIN BOOSTING AND METHOD FOR GENERATING OSCILLATION SIGNAL THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H03B5/04</main-classification>  
        <further-classification edition="200601120260401B">H03B5/12</further-classification>  
        <further-classification edition="200601120260401B">H03B5/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　嘉亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶體振盪器包括：第一PMOS電晶體，其閘極、源極端及汲極端分別連接至閘極節點、源極節點及源極節點；直流耦合網路配置以耦合閘極節點至第一偏壓節點；NMOS電晶體，其閘極端、源極端及汲極端分別連接至第二偏壓節點、第二直流節點及汲極節點；第二PMOS電晶體，其閘極端、源極端及汲極端分別連接至汲極節點、第一直流節點及源極節點；回授電容，配置於源極節點與閘極節點之間；並聯電容，配置於接地節點與電源節點中的一者與源極節點之間；以及晶體，配置於接地節點與電源節點中的一者與閘極節點之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A crystal oscillator includes a first PMOS (p-channel metal-oxide semiconductor) transistor having its gate, source, and drain terminals connected to a gate node, a source node, and a drain node , respectively; a DC (direct current) coupling network configured to couple the gate node to a first bias node; a NMOS (n-channel metal-oxide semiconductor) transistor having its gate, source, and drain terminals connected to a second bias node, a ground node, and the drain node, respectively; a second PMOS transistor having its gate, source, and drain terminals connected to the drain node, a power supply node, and the source node, respectively; a feedback capacitor positioned between the source node and the gate node; a shunt capacitor positioned between the source node and one of the power supply node and the ground node; and a crystal positioned between the gate node and one of the ground node and the power supply node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:晶體振盪器</p>  
        <p type="p">211:第一PMOS(P通道金屬氧化物半導體)電晶體</p>  
        <p type="p">212:NMOS(N通道金屬氧化物半導體)電晶體</p>  
        <p type="p">213:第二PMOS電晶體</p>  
        <p type="p">220:晶體</p>  
        <p type="p">241:回授電容</p>  
        <p type="p">243:並聯電容</p>  
        <p type="p">250:直流耦合網路</p>  
        <p type="p">251:NMOS電晶體</p>  
        <p type="p">252:電阻</p>  
        <p type="p">IBIAS:偏壓電流</p>  
        <p type="p">IFB:回授電流</p>  
        <p type="p">ND:汲極節點</p>  
        <p type="p">NG:閘極節點</p>  
        <p type="p">NS:源極節點</p>  
        <p type="p">VB1:第一偏壓節點</p>  
        <p type="p">VB2:第二偏壓節點</p>  
        <p type="p">VD:汲極電壓</p>  
        <p type="p">VDD:電源節點</p>  
        <p type="p">VG:閘極電壓</p>  
        <p type="p">VS:源極電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1131" publication-number="202626104"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626104.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遞送藥劑穿過生物屏障之方法</chinese-title>  
        <english-title>METHOD FOR DELIVERY OF AN AGENT ACROSS BIOLOGICAL BARRIERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251001B">A61K47/42</main-classification>  
        <further-classification edition="201701120251001B">A61K47/69</further-classification>  
        <further-classification edition="201701120251001B">A61K47/62</further-classification>  
        <further-classification edition="202501120251001B">A61K9/127</further-classification>  
        <further-classification edition="200601120251001B">A61P25/28</further-classification>  
        <further-classification edition="200601120251001B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慈濟學校財團法人慈濟大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZU CHI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張新侯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIN-HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫德珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, DER-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種蛋白質-囊泡結合物，其包含表現於囊泡之表面上或與囊泡之表面結合的一或多種分泌蛋白或其片段及視情況選用之藥劑，以及一種用於將藥劑與該蛋白質-囊泡結合物一起遞送穿過生物屏障到達細胞及含有該細胞之組織的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a protein-vesicle conjugate, comprising one or more secretory proteins or a fragment thereof expressed on or conjugated to a surface of a vesicle and optionally an agent, and a method for delivery of an agent with the protein-vesicle conjugate across a biological barrier to a cell and tissue containing the cell.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1132" publication-number="202626704"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626704.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含分泌蛋白表現於其表面的囊泡及其用於將藥劑遞送至處於細胞壓力與受調控細胞死亡狀態下之細胞的用途</chinese-title>  
        <english-title>VESICLES COMPRISING SECRETORY PROTEINS EXPRESSED ON THE SURFACE AND USES THEREOF FOR DELIVERY OF AN AGENT TO CELLS UNDER CELLULAR STRESS AND REGULATED CELL DEATH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C07K14/705</main-classification>  
        <further-classification edition="202501120260204B">A61K9/1273</further-classification>  
        <further-classification edition="200601120260204B">A61P25/00</further-classification>  
        <further-classification edition="200601120260204B">A61P37/00</further-classification>  
        <further-classification edition="200601120260204B">A61P9/00</further-classification>  
        <further-classification edition="200601120260204B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慈濟學校財團法人慈濟大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZU CHI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張新侯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIN-HOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫德珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, DER-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種蛋白質-囊泡結合物，其包含表現於囊泡之表面上或與囊泡之表面結合的一或多種分泌蛋白或其片段及視情況選用之藥劑，以及一種用於將藥劑與該蛋白質-囊泡結合物一起遞送至自噬及/或凋亡細胞及含有該細胞之組織的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a protein-vesicle conjugate, comprising one or more secretory proteins or a fragment thereof expressed on or conjugated to a surface of a vesicle and optionally an agent, and a method for delivery of an agent with the protein-vesicle conjugate to an autophagic and/or apoptotic cell and a tissue containing the cell.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1133" publication-number="202626184"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626184.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離膜元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B01D63/10</main-classification>  
        <further-classification edition="200601120260323B">B01D63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商空調服股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUCHOFUKU CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市谷弘司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIGAYA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">針對分離膜元件，為了容易抑制因分離膜之黏著部分所導致之有效面積減少。 &lt;br/&gt;　　分離膜元件(100)，在袋狀體(11)的端面形成有用於防止供應側流體與穿透側流體混合之密封部(113)。分離膜元件(100)之製造方法包含：將分離膜(111)、作為用於確保流體的流路之流路材發揮作用之絲線(12)及不織布(112)積層而形成圓筒狀積層體(1)之積層工序，及在積層工序之後在袋狀體(11)的端面形成用於防止供應側流體與穿透側流體混合的密封部(113)之密封工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:袋狀體</p>  
        <p type="p">111:分離膜</p>  
        <p type="p">112:不織布(第2流路材)</p>  
        <p type="p">1111:分離膜主體</p>  
        <p type="p">1112:支承層</p>  
        <p type="p">1131:軸向密封部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1134" publication-number="202628086"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628086.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統、記憶體裝置複製及執行讀取操作的方法</chinese-title>  
        <english-title>MEMORY SYSTEM, MEMORY DEVICE REPLICA AND METHOD OF PERFORMING READ OPERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G11C7/06</main-classification>  
        <further-classification edition="200601120251204B">G11C7/12</further-classification>  
        <further-classification edition="200601120251204B">G11C7/14</further-classification>  
        <further-classification edition="200601120251204B">G11C7/22</further-classification>  
        <further-classification edition="200601120251204B">G11C7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林毓誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池育德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIH, YU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王健帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIEN-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范耀翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, YAO XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包括記憶體裝置及記憶體複製。記憶體裝置包括複數個記憶體單元、輸入輸出多工器、輸入輸出讀出放大器及儲存器元件。輸入輸出多工器回應於選擇信號而選擇記憶體單元中的一者。輸入輸出讀出放大器產生表示儲存在記憶體單元中所選擇的一個記憶體單元中的位元的資料輸出信號。儲存器元件回應於資料鎖存信號而鎖存資料輸出信號，並輸出對應於資料輸出信號的位元。記憶體裝置複製模仿記憶體裝置的行為並產生資料鎖存信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes a memory device and a memory replica. The memory device includes a plurality of memory cell, an input-output multiplexer, an input-output sense amplifier, and a storage element. The input-output multiplexer selects one of the memory cells in response to a select signal. The input-output sense amplifier generates a data output signal representing a bit stored in the selected one of the memory cells. The storage element latches the data output signal in response to a data latch signal and outputs a bit that corresponds to the data output signal. The memory device replica mimics the behavior of the memory device and generates the data latch signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">210:記憶體裝置</p>  
        <p type="p">220:記憶體裝置</p>  
        <p type="p">230:記憶體裝置</p>  
        <p type="p">240:記憶體裝置複製</p>  
        <p type="p">250:記憶體單元</p>  
        <p type="p">260:參考單元</p>  
        <p type="p">270:電阻元件</p>  
        <p type="p">CTRL:控制信號</p>  
        <p type="p">GND:接地</p>  
        <p type="p">LAT_B:資料鎖存信號</p>  
        <p type="p">SA_B:資料輸出信號</p>  
        <p type="p">SEL2:選擇信號</p>  
        <p type="p">SEL1:選擇信號</p>  
        <p type="p">PCH:預充電信號</p>  
        <p type="p">Q:位元</p>  
        <p type="p">FF:儲存器元件</p>  
        <p type="p">VSS:節點</p>  
        <p type="p">R MUX:參考多工器</p>  
        <p type="p">IO MUX:輸入輸出多工器</p>  
        <p type="p">R SA:參考讀出放大器</p>  
        <p type="p">IO SA:輸入輸出讀出放大器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1135" publication-number="202628822"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628822.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿切割之方法</chinese-title>  
        <english-title>METHOD OF PLASMA DICING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P50/20</main-classification>  
        <further-classification edition="202601120260302B">H10P14/60</further-classification>  
        <further-classification edition="202601120260302B">H10P54/00</further-classification>  
        <further-classification edition="201401120260302B">B23K26/364</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＳＰＴＳ科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPTS TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯特　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CROOT, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍普金斯　珍娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOPKINS, JANET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安塞爾　奧利薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANSELL, OLIVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慕文福德　羅蘭德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUMFORD, ROLAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡茲米　薩米拉　賓特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAZEMI, SAMIRA BINTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，提供一種對包含一化合物半導體基板之一工件進行電漿切割之方法，該方法包含： &lt;br/&gt;提供包含一化合物半導體基板之一工件； &lt;br/&gt;將一遮罩結構設置於該工件上，該遮罩結構包含包括一硬遮罩材料之一上層以及位於該上層與該工件之正面之間的一下層釋放層，其中該遮罩結構限定一或多個切割道；及 &lt;br/&gt;藉由包含沿該等切割道至少部分地電漿蝕刻該化合物半導體基板之一製程來對該工件進行電漿切割。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to the invention there is provided a method of plasma dicing a workpiece comprising a compound semiconductor substrate, the method comprising: &lt;br/&gt;providing a workpiece comprising a compound semiconductor substrate; &lt;br/&gt;providing a mask structure on the workpiece, the mask structure comprising an upper layer comprising a hard mask material and a lower release layer between the upper layer and the front side of the workpiece, wherein the mask structure defines one or more dicing lanes; and &lt;br/&gt;plasma dicing the workpiece by a process which comprises plasma etching at least partially through the compound semiconductor substrate along the dicing lanes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">45:電漿</p>  
        <p type="p">50:垂直路徑</p>  
        <p type="p">55:晶粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1136" publication-number="202628258"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628258.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>待接端導電構件</chinese-title>  
        <english-title>RECEIVING-END CONDUCTIVE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260126B">H01R13/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐虞企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARNG YU ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞唐虞電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN TARNG YU ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳盈仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃睦容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導電構件總成及其待接端導電構件與對接端導電構件，該待接端導電構件係具有一待接端導電構件膠芯對接槽，該對接端導電構件係具有一對接端導電構件膠芯對接頭，該對接端導電構件膠芯對接頭係可對準該待接端導電構件膠芯對接槽，從而進入該待接端導電構件膠芯對接槽，使得該導電構件總成在使用時，該對接端導電構件與該待接端導電構件能夠處於正常對接的狀況，讓該導電構件總成可以適應電子設備縮小尺寸且電性特性符合預期，而滿足電子設備的特殊需求及發展。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrically conductive component assembly and its mating-end and receiving-end conductive components are disclosed. The receiving-end conductive component includes a receiving-end conductive core docking slot, while the mating-end conductive component includes a mating-end conductive core docking plug. The docking plug of the mating-end conductive component is configured to align with and insert into the docking slot of the receiving-end conductive component.&lt;br/&gt;This design ensures that, during use, the mating-end and receiving-end conductive components are properly mated, allowing the conductive component assembly to accommodate the trend toward miniaturization in electronic devices while maintaining the desired electrical performance—thus meeting the specific requirements and development needs of modern electronic equipment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導電構件總成</p>  
        <p type="p">11:待接端導電構件</p>  
        <p type="p">111:待接端導電構件膠芯</p>  
        <p type="p">1111:待接端導電構件膠芯對接槽</p>  
        <p type="p">1112:待接端導電構件膠芯對接引導孔</p>  
        <p type="p">112:待接端導電構件上方端子</p>  
        <p type="p">1121:待接端導電構件上方端子對接結構</p>  
        <p type="p">1122:待接端導電構件上方端子搭接結構</p>  
        <p type="p">1123:待接端導電構件上方端子銜接結構</p>  
        <p type="p">11231:待接端導電構件上方端子銜接結構折彎延伸段</p>  
        <p type="p">113:待接端導電構件下方端子</p>  
        <p type="p">1131:待接端導電構件下方端子對接結構</p>  
        <p type="p">1132:待接端導電構件下方端子搭接結構</p>  
        <p type="p">1133:待接端導電構件下方端子銜接結構</p>  
        <p type="p">11331:待接端導電構件下方端子銜接結構折彎延伸段</p>  
        <p type="p">12:對接端導電構件</p>  
        <p type="p">121:對接端導電構件膠芯</p>  
        <p type="p">1211:對接端導電構件膠芯對接頭</p>  
        <p type="p">122:對接端導電構件上方端子</p>  
        <p type="p">1221:對接端導電構件上方端子對接結構</p>  
        <p type="p">1222:對接端導電構件上方端子彈性結構</p>  
        <p type="p">1223:對接端導電構件上方端子搭接結構</p>  
        <p type="p">1224:對接端導電構件上方端子銜接結構</p>  
        <p type="p">12241:對接端導電構件上方端子銜接結構直線延伸段</p>  
        <p type="p">123:對接端導電構件下方端子</p>  
        <p type="p">1231:對接端導電構件下方端子對接結構</p>  
        <p type="p">1232:對接端導電構件下方端子彈性結構</p>  
        <p type="p">1233:對接端導電構件下方端子搭接結構</p>  
        <p type="p">1234:對接端導電構件下方端子銜接結構</p>  
        <p type="p">12341:對接端導電構件下方端子銜接結構直線延伸段</p>  
        <p type="p">125:對接引導體</p>  
        <p type="p">1251:對接引導結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1137" publication-number="202628254"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628254.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122082</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對接端導電構件</chinese-title>  
        <english-title>MATING-END CONDUCTIVE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251028B">H01R12/72</main-classification>  
        <further-classification edition="200601120251028B">H01R13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐虞企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARNG YU ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞唐虞電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN TARNG YU ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳盈仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃睦容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導電構件總成及其待接端導電構件與對接端導電構件，該待接端導電構件係具有一待接端導電構件膠芯對接槽，該對接端導電構件係具有一對接端導電構件膠芯對接頭，該對接端導電構件膠芯對接頭係可對準該待接端導電構件膠芯對接槽，從而進入該待接端導電構件膠芯對接槽，使得該導電構件總成在使用時，該對接端導電構件與該待接端導電構件能夠處於正常對接的狀況，讓該導電構件總成可以適應電子設備縮小尺寸且電性特性符合預期，而滿足電子設備的特殊需求及發展。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrically conductive component assembly and its mating-end and receiving-end conductive components are disclosed. The receiving-end conductive component includes a receiving-end conductive core docking slot, while the mating-end conductive component includes a mating-end conductive core docking plug. The docking plug of the mating-end conductive component is configured to align with and insert into the docking slot of the receiving-end conductive component.&lt;br/&gt;This design ensures that, during use, the mating-end and receiving-end conductive components are properly mated, allowing the conductive component assembly to accommodate the trend toward miniaturization in electronic devices while maintaining the desired electrical performance—thus meeting the specific requirements and development needs of modern electronic equipment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導電構件總成</p>  
        <p type="p">11:待接端導電構件</p>  
        <p type="p">111:待接端導電構件膠芯</p>  
        <p type="p">1111:待接端導電構件膠芯對接槽</p>  
        <p type="p">1112:待接端導電構件膠芯對接引導孔</p>  
        <p type="p">112:待接端導電構件上方端子</p>  
        <p type="p">1121:待接端導電構件上方端子對接結構</p>  
        <p type="p">1122:待接端導電構件上方端子搭接結構</p>  
        <p type="p">1123:待接端導電構件上方端子銜接結構</p>  
        <p type="p">11231:待接端導電構件上方端子銜接結構折彎延伸段</p>  
        <p type="p">113:待接端導電構件下方端子</p>  
        <p type="p">1131:待接端導電構件下方端子對接結構</p>  
        <p type="p">1132:待接端導電構件下方端子搭接結構</p>  
        <p type="p">1133:待接端導電構件下方端子銜接結構</p>  
        <p type="p">11331:待接端導電構件下方端子銜接結構折彎延伸段</p>  
        <p type="p">12:對接端導電構件</p>  
        <p type="p">121:對接端導電構件膠芯</p>  
        <p type="p">1211:對接端導電構件膠芯對接頭</p>  
        <p type="p">122:對接端導電構件上方端子</p>  
        <p type="p">1221:對接端導電構件上方端子對接結構</p>  
        <p type="p">1222:對接端導電構件上方端子彈性結構</p>  
        <p type="p">1223:對接端導電構件上方端子搭接結構</p>  
        <p type="p">1224:對接端導電構件上方端子銜接結構</p>  
        <p type="p">12241:對接端導電構件上方端子銜接結構直線延伸段</p>  
        <p type="p">123:對接端導電構件下方端子</p>  
        <p type="p">1231:對接端導電構件下方端子對接結構</p>  
        <p type="p">1232:對接端導電構件下方端子彈性結構</p>  
        <p type="p">1233:對接端導電構件下方端子搭接結構</p>  
        <p type="p">1234:對接端導電構件下方端子銜接結構</p>  
        <p type="p">12341:對接端導電構件下方端子銜接結構直線延伸段</p>  
        <p type="p">125:對接引導體</p>  
        <p type="p">1251:對接引導結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1138" publication-number="202626106"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626106.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改良型ＴＲＯＰ２耦合生物分子、醫藥組合物、及其應用</chinese-title>  
        <english-title>IMPROVED TROP2 CONJUGATED BIOLOGICAL MOLECULES, PHARMACEUTICAL COMPOSITIONS AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260124B">A61K47/68</main-classification>  
        <further-classification edition="201701120260124B">A61K47/60</further-classification>  
        <further-classification edition="200601120260124B">C07K16/28</further-classification>  
        <further-classification edition="200601120260124B">A61K47/26</further-classification>  
        <further-classification edition="200601120260124B">A61K47/12</further-classification>  
        <further-classification edition="200601120260124B">C12N9/24</further-classification>  
        <further-classification edition="200601120260124B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣浩鼎生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBI PHARMA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慧君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HWEI-GENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴明添</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, MING-TAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鐙毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昱超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王南絢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, NAN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雅琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種連接子-負載物複合體，其包含一生物正交基團及一親水基團。用於抗體耦合的該改良型連接子-負載物以及改良的抗體藥物複合體(ADC)表現出在血液循環中更高的穩定性，並且在目標細胞表現出增強的藥物遞送與藥物釋放效率。本揭露還涉及TROP2的抗體及其抗原結合片段，以及包含TROP2抗體藥物複合體的醫藥組合物。本揭露亦描述使用TROP2抗體藥物複合體治療病態狀況之受試者的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides linker-payload conjugates including a bioorthogonal group and a hydrophilic moiety. The improved linker-payloads for antibody conjugation and improved antibody drug conjugates (ADCs) exhibit greater stability in blood circulation and enhanced drug delivery and drug release efficiencies in target cells. The present disclosure also relates to antibodies and antigen-binding fragments thereof targeting TROP2, as well as pharmaceutical compositions including TROP2 ADCs. Also described herein are methods of using TROP2 ADCs for treatment of subjects associated with pathological conditions.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1139" publication-number="202628652"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628652.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造半導體裝置的方法</chinese-title>  
        <english-title>METHOD OF FABRICATING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260109B">H10D64/01</main-classification>  
        <further-classification edition="200601120260109B">B81C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅弘焜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, HUNG-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHANG, JIN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體裝置及其形成方法。一種例示性方法包括在基板上方形成底部奈米結構及頂部奈米結構，在底部奈米結構周圍形成第一閘極介電層，在頂部奈米結構周圍形成第二閘極介電層，在第一及第二閘極介電層上依序沉積偶極層、圖案層、自組裝單層(SAM)及虛設層，平坦化虛設層，移除SAM、虛設層、偶極層及圖案層的在第二閘極介電層上方的部分，移除SAM、虛設層及圖案層的剩餘部分，從而留下偶極層的在第一閘極介電層上的一部分，及執行處理以將偶極摻雜劑物種從偶極層之該部分驅入至第一閘極介電層中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices and methods of forming the same are provided. An exemplary method includes forming a bottom nanostructure and a top nanostructure over a substrate, forming a first gate dielectric layer around the bottom nanostructure and a second gate dielectric layer around the top nanostructure, sequentially depositing a dipole layer, a pattern layer, a self-assembled monolayer (SAM), and a dummy layer on the first and second gate dielectric layers, planarizing the dummy layer, removing portions of the SAM, the dummy layer, the dipole layer and the pattern layer over the second gate dielectric layer, removing remaining portions of the SAM, the dummy layer, and the pattern layer, thereby leaving a portion of the dipole layer on the first gate dielectric layer, and performing a treatment to drive a dipole dopant species from the portion of the dipole layer to the first gate dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102、104、106、108、110、112、114、116、118、120、122、124、126、128、130、132、134:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1140" publication-number="202627564"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627564.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置與製造方法</chinese-title>  
        <english-title>OPTICAL DEVICES AND METHODS OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G02B6/13</main-classification>  
        <further-classification edition="200601120251103B">G02B6/125</further-classification>  
        <further-classification edition="200601120251103B">G02B6/122</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒家翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在此描述一種形成光學裝置的方法以及光學裝置，其中調變裝置是接合到光子積體電路。光子積體電路具有調變器，該調變器可被使用以調變來自光子積體電路的光學訊號，並且調變器是使用鈮酸鋰形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming an optical device as well as the optical device itself are described herein in which a modulator device is bonded to a photonic integrated circuit. The photonic integrated circuit has a modulator that can be used to modulate optical signals from the photonic integrated circuit and the modulator is formed using lithium niobate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:第一介電層</p>  
        <p type="p">205:背側光學元件</p>  
        <p type="p">300:光子積體電路</p>  
        <p type="p">323:通路</p>  
        <p type="p">401:第一半導體元件</p>  
        <p type="p">413:第一間隙填充材料</p>  
        <p type="p">415:第一支撐基板</p>  
        <p type="p">600:調變裝置</p>  
        <p type="p">701:第二間隙填充材料</p>  
        <p type="p">703:第三介電層</p>  
        <p type="p">800:第一光學封裝</p>  
        <p type="p">801:第一裝置穿孔</p>  
        <p type="p">803:鈍化層</p>  
        <p type="p">804:第二金屬化層</p>  
        <p type="p">813:第一外部連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1141" publication-number="202626221"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626221.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122447</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄片狀銅粉末及含有該薄片狀銅粉末的導電膏</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260202B">B22F1/00</main-classification>  
        <further-classification edition="200601120260202B">B22F9/04</further-classification>  
        <further-classification edition="200601120260202B">H01B1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福田金屬箔粉工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA METAL FOIL &amp; POWDER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>真鍋拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANABE, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上林景太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIBAYASHI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山入端遙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANIHA, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤信行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種薄片狀銅粉末，所述薄片狀銅粉末的表觀密度低，在塗膜中強烈地向水平方向取向，因此以所述薄片狀銅粉末為導電填料的導電膏由於導電填料彼此的接觸點變多，因此即使導電填料的比率低，也能以300℃左右的低溫焙燒來形成導電網絡，成為表現高導電性的導電膏。所述薄片狀銅粉末由雷射繞射粒度分布測定裝置測定出的中值粒徑(D50)為0.3μm以上且35μm以下，表觀密度(AD)為0.1g/cm&lt;sup&gt;3&lt;/sup&gt;以上且1.8g/cm&lt;sup&gt;3&lt;/sup&gt;以下，且所述薄片狀銅粉末在塗膜中強烈地向水平方向取向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1142" publication-number="202627616"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627616.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用幾何相位光學元件的相移式相位檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G02B27/10</main-classification>  
        <further-classification edition="200601120260323B">G02B27/28</further-classification>  
        <further-classification edition="202201120260323B">G01B9/02</further-classification>  
        <further-classification edition="200601120260323B">G01N21/59</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＩ系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSI SYSTEM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, YEONG HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開適用幾何相位光學器件的相移方式的相位檢測裝置。根據本實施例的一實施方式，提供相位檢測裝置，其特徵在於，包括使具有通過干涉儀生成的不同的圓形偏振光的物體光及參照光相移的光學掩膜，上述光學掩膜包括：光學陣列，包括使上述物體光及上述參照光以規定的光軸旋轉角度的兩倍相位延遲的幾何相位光學像素，以及圓偏振光分束器，使透射上述光學陣列的圓偏振光成分中一部分圓偏振光成分透射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:相位檢測系統</p>  
        <p type="p">110:相位檢測裝置</p>  
        <p type="p">120:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1143" publication-number="202628903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122597</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置、接合方法、及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/50</main-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification>  
        <further-classification edition="200601120260302B">G05B19/404</further-classification>  
        <further-classification edition="200601120260302B">G05B19/402</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水田吉郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTA, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於改善半導體裝置的良率。實施方式的接合裝置包括第一載台及第二載台以及處理器。第一載台具有主體部、對主體部進行加熱的加熱器以及主體部上的多個載台銷，且構成為能夠保持第一基板。第二載台構成為能夠保持第二基板。處理器執行將第一基板與第二基板接合的接合處理。關於多個載台銷中沿第一方向排列的多個第一銷，位於第一載台的中心部的第一銷與位於外周部的第一銷的面積及長度中的至少一者不同。關於多個載台銷中沿與第一方向不同的第二方向排列的多個第二銷，位於第一載台的中心部的第二銷與位於外周部的所述第二銷的面積及長度中的至少一者大致相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">41:肋部</p>  
        <p type="p">42:載台銷</p>  
        <p type="p">230:下載台</p>  
        <p type="p">R1:直徑</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1144" publication-number="202627255"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627255.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>花呢風格毛巾織物及花呢風格毛巾織物之織製方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251031B">D03D27/08</main-classification>  
        <further-classification edition="200601120251031B">D03D27/00</further-classification>  
        <further-classification edition="200601120251031B">D03D11/00</further-classification>  
        <further-classification edition="200601120251031B">D06M11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商七福毛巾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHICHIFUKU TOWEL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河北泰三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKITA, TAIZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具備毛巾織物所要求之吸水性、輕柔之肌膚觸感、速乾性及穩固性、以及作為花呢織物之特徵之多彩之層次、斜紋織風格之表現、粗糙之穩重感的花呢風格毛巾織物及花呢風格毛巾織物之織製方法。 &lt;br/&gt;絨毛非形成部1以使色緯紗41、42、43、44、45、46、47、48、49與絨毛經紗91、92、93、94纏繞而成之緯緞紋織物組織為基本，使底經紗31、32之配設位置發生變化，藉此將緯緞紋織物組織露出部6、底經紗露出部7、及不規則緞紋織物組織部8沿著緯方向不規則地配設。將絨毛非形成部1與絨毛形成部2沿著經方向交替配設，而整體呈現花呢風格。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絨毛非形成部</p>  
        <p type="p">2:絨毛形成部</p>  
        <p type="p">6:緯緞紋織物組織露出部</p>  
        <p type="p">31、32:底經紗</p>  
        <p type="p">41、42、43、44、45、46、47、48、49:色緯紗</p>  
        <p type="p">51、52、53、54、55、56、57、58、59:底緯紗</p>  
        <p type="p">91、92、93、94:絨毛經紗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1145" publication-number="202629031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W72/50</main-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202601120260302B">H10W40/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification>  
        <further-classification edition="202601120260302B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, KUO-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉松峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SUNG-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋大豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, TA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王佳琨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIA-KUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, LI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方翎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在用於形成半導體封裝的接合製程期間，超薄接合層（例如，具有在5埃與2500埃之間的厚度）被使用在接合介面處，以取代在不含本揭示內容所揭示的結構的半導體封裝中，在接合介面處所使用的一個或兩個接合層。可進行電漿製程以活化其中一個接合表面，且在一些範例中，藉由在接合表面的材料之間的化學反應，在接合介面處形成中間化合物層。中間化合物層為超薄接合層提供增強的附著力。超薄接合層增強的附著力、超薄厚度以及優異的平坦度大幅改善所形成的半導體封裝中的散熱效率。額外的優點包括半導體封裝降低的高度，以及為半導體封裝的某些元件使用較不昂貴的材料的能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">During a bonding process for forming a semiconductor package, an ultra-thin bonding layer (e.g., with a thickness between 5 angstroms and 2500 angstroms) is used at the bonding interface to replace one or both of the bonding layers used at the bonding interface in semiconductor packages without the presently disclosed structures. A plasma process may be performed to activate one of the bonding surfaces, and an intermediate compound layer is formed at the bonding interface by chemical reaction between the materials of the bonding surfaces, in some examples. The intermediate compound layer provides enhanced adhesion for the ultra-thin bonding layer. The enhanced adhesion, ultra-thin thickness, and superior planarity of the ultra-thin bonding layer greatly improves the efficiency of heat dissipation in the semiconductor package formed. Additional advantages include reduced height of the semiconductor package, and the ability to use less expensive material for certain components of the semiconductor package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">1010、1020、1030、1040、1050、1060:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1146" publication-number="202628330"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628330.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以使電源轉換器正常啟動的控制器及其操作方法</chinese-title>  
        <english-title>CONTROLLER FOR MAKING A POWER CONVERTOR START UP NORMALLY AND OPERATIONAL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120250704B">H02M1/36</main-classification>  
        <further-classification edition="200601120250704B">H02M1/08</further-classification>  
        <further-classification edition="200601120250704B">H02M3/335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>通嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEADTREND TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昭志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHAO-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒明璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, MING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林銘彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭筠賡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUN-KENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用以使電源轉換器正常啟動的控制器包含偵測電路、上橋供電預充電電路和驅動信號產生電路。該偵測電路在該電源轉換器啟動期間，偵測回授電壓且根據該回授電壓調整該電源轉換器的下橋開關的下橋開關驅動信號的下橋開啟時間。該上橋供電預充電電路根據該下橋開啟時間產生該下橋開關驅動信號且當該回授電壓符合第一預定條件時，停止產生該下橋開關驅動信號。當該上橋供電預充電電路停止產生該下橋開關驅動信號後，該驅動信號產生電路產生該下橋開關驅動信號至該下橋開關和上橋開關驅動信號至該電源轉換器的上橋開關使該電源轉換器正常運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A controller for making a power convertor start up normally includes a detection circuit, an upper-bridge power supply pre-charge circuit and a driving signal generation circuit. During the power convertor starting up, the detection circuit detects a feedback voltage and adjusts the lower-bridge turning-on time of a lower-bridge switch driving signal of a lower-bridge switch of the power convertor according to the feedback voltage. The upper-bridge power supply pre-charge circuit generates the lower-bridge switch driving signal according to the lower-bridge turning-on time and stops generating the lower-bridge switch driving signal when the feedback voltage meets a first predetermined condition. When the upper-bridge power supply pre-charge circuit stops generating the lower-bridge switch driving signal, the driving signal generation circuit generates the lower-bridge switch driving signal to the lower-bridge switch and an upper-bridge switch driving signal to an upper-bridge switch of the power convertor to make the power convertor operate normally.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源轉換器</p>  
        <p type="p">102:下橋開關</p>  
        <p type="p">104:充電路徑</p>  
        <p type="p">106:諧振電容</p>  
        <p type="p">108:輔助繞組</p>  
        <p type="p">110:一次側繞組</p>  
        <p type="p">112、114:二次側繞組</p>  
        <p type="p">116:上橋開關</p>  
        <p type="p">200:控制器</p>  
        <p type="p">202:偵測電路</p>  
        <p type="p">204:上橋供電預充電電路</p>  
        <p type="p">206:驅動信號產生電路</p>  
        <p type="p">208:頻率控制器</p>  
        <p type="p">210:箝位電路</p>  
        <p type="p">2002:下橋電壓準位轉換器</p>  
        <p type="p">2004:下橋閘極驅動器</p>  
        <p type="p">2006:上橋電壓準位轉換器</p>  
        <p type="p">2008:上橋閘極驅動器</p>  
        <p type="p">2022:時間控制器</p>  
        <p type="p">2024:電壓位準偵測器</p>  
        <p type="p">CHVCC:上橋供電儲能電容</p>  
        <p type="p">CLK:控制器時脈</p>  
        <p type="p">FB:回授接腳</p>  
        <p type="p">GND1、GND2:地電壓</p>  
        <p type="p">HG:上橋開關驅動信號</p>  
        <p type="p">HVCC:上橋供電電壓</p>  
        <p type="p">HGND:上橋地電壓</p>  
        <p type="p">ICR:諧振電容電流</p>  
        <p type="p">LG:下橋開關驅動信號</p>  
        <p type="p">LGOT:下橋開啟時間</p>  
        <p type="p">PRI:一次側</p>  
        <p type="p">SEC:二次側</p>  
        <p type="p">SS:停止信號</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VO:輸出電壓</p>  
        <p type="p">VCC:供電電壓</p>  
        <p type="p">VHVCC:上橋供電電壓</p>  
        <p type="p">VCR:諧振電容電壓</p>  
        <p type="p">VAUX:輔助繞組電壓</p>  
        <p type="p">VFB:回授電壓</p>  
        <p type="p">VFBM:回授峰值電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1147" publication-number="202626073"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626073.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鎖酒和解酒的胃內駐留凝膠組合物、其製備方法及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251212B">A61K35/741</main-classification>  
        <further-classification edition="200601120251212B">A61K47/38</further-classification>  
        <further-classification edition="200601120251212B">A61K47/36</further-classification>  
        <further-classification edition="200601120251212B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州糖吉醫療科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU TANGJI MEDICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>束妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及解酒物質技術領域，具體而言，涉及用於鎖酒和解酒的胃內駐留凝膠組合物、其製備方法及其應用。胃內駐留凝膠組合物的原料選自羧甲基纖維類原料、海藻酸類原料、能轉化酒精的益生菌或其發酵產物和鈣源；且所述原料中各成分的質量關係滿足：W1＝m2/(m1+m2)×100%，且13%≤ W1≤25%；W2=m3/(m1+m2+m3)×100%，且W2≥5%；f＝m4/m5，0.2≤f≤1.5。該凝膠組合物不僅僅能大量吸附胃內的酒精，減少酒精進入血液的量，同時，還可以將酒精轉換為乙酸，最終乙酸經人體代謝為二氧化碳和水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1148" publication-number="202628969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置封裝體及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE PACKAGES AND METHODS FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/00</main-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification>  
        <further-classification edition="202601120260302B">H10W74/10</further-classification>  
        <further-classification edition="202601120260302B">H10W74/40</further-classification>  
        <further-classification edition="200601120260302B">H05K1/03</further-classification>  
        <further-classification edition="202601120260302B">H10W76/136</further-classification>  
        <further-classification edition="202601120260302B">H10W40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾馬　安吉特　布山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, ANKIT BHUSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一大致態樣中，一半導體裝置封裝體包括一基材，該基材包括一非導電材料及設置在該非導電材料中的一散熱器。該散熱器的一第一表面透過該非導電材料的一第一側而暴露。該封裝體進一步包括一半導體晶粒，其設置在該非導電材料之與該第一側相對的一第二側中所界定的一空腔中。該半導體晶粒在該散熱器之與該第一表面相對的一第二表面中所界定的一凹部中與該散熱器電耦接。該凹部與該非導電材料中之該空腔對應。該封裝體亦包括一圖案化金屬層，其係與該半導體晶粒或該散熱器中之至少一者電耦接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a general aspect, a semiconductor device package includes a substrate including a non-conductive material, and a heat spreader disposed in the non-conductive material. A first surface of the heat spreader is exposed through a first side of the non-conductive material. The package further includes a semiconductor die disposed in a cavity defined in a second side of the non-conductive material opposite the first side. The semiconductor die is electrically coupled with the heat spreader in a recess defined in a second surface of the heat spreader opposite the first surface. The recess corresponds with the cavity in the non-conductive material. The package also includes a patterned metal layer that is electrically coupled with at least one of the semiconductor die or the heat spreader.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:半導體裝置封裝體</p>  
        <p type="p">105:基材</p>  
        <p type="p">106:非導電材料</p>  
        <p type="p">107:空腔</p>  
        <p type="p">107a:側壁</p>  
        <p type="p">108a:DBM基材</p>  
        <p type="p">109a:絕緣層</p>  
        <p type="p">109b:第一金屬層</p>  
        <p type="p">109c:第二金屬層</p>  
        <p type="p">109d:凹部</p>  
        <p type="p">110:半導體晶粒</p>  
        <p type="p">110a:頂側金屬化層</p>  
        <p type="p">110b:底側金屬化層</p>  
        <p type="p">110c:側壁</p>  
        <p type="p">115:導電接合材料</p>  
        <p type="p">125:金屬化層</p>  
        <p type="p">125a:第一部分</p>  
        <p type="p">125b:第二部分</p>  
        <p type="p">130:層壓材料</p>  
        <p type="p">135a:開口</p>  
        <p type="p">135b:開口</p>  
        <p type="p">140a:導電通孔</p>  
        <p type="p">140b:導電通孔</p>  
        <p type="p">140c:導電通孔</p>  
        <p type="p">145:金屬層</p>  
        <p type="p">145a:第一部分/金屬層部分</p>  
        <p type="p">145b:第二部分/金屬層部分</p>  
        <p type="p">145c:第三部分/金屬層部分</p>  
        <p type="p">D1:深度</p>  
        <p type="p">D2:深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1149" publication-number="202629044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置總成以及用於生產其之方法和設備</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD AND APPARATUS FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/10</main-classification>  
        <further-classification edition="202601120260302B">H10W40/10</further-classification>  
        <further-classification edition="200601120260302B">C09J9/02</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification>  
        <further-classification edition="200601120260302B">B22F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林承園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, SEUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白鐘煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, JONGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜東旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, DONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一大致態樣中，一種半導體裝置總成包括一散熱裝置及一半導體裝置封裝，半導體裝置封裝具有由一封裝材料及透過封裝材料而暴露的一金屬層所界定的一主表面。總成進一步包括一導電黏著劑，其將主表面的金屬層與散熱裝置的一第一部分耦接。總成亦包括一間隔物材料，其係設置在主表面的封裝材料與散熱裝置的一第二部分之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a general aspect, a semiconductor device assembly includes a heat dissipation device, and a semiconductor device package having a primary surface defined by an encapsulant material and a metal layer exposed through the encapsulant material. The assembly further includes a conductive adhesive coupling the metal layer of the primary surface with a first portion of the heat dissipation device. The assembly also includes a spacer material disposed between the encapsulant material of the primary surface and a second portion of the heat dissipation device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:散熱裝置</p>  
        <p type="p">140:凸起部分</p>  
        <p type="p">141:上表面</p>  
        <p type="p">150:間隔物材料</p>  
        <p type="p">210:半導體裝置封裝</p>  
        <p type="p">400:半導體裝置總成</p>  
        <p type="p">T1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1150" publication-number="202627086"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627086.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123097</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向ＳＡＲＭ１的ＲＮＡｉ劑及其醫藥用途</chinese-title>  
        <english-title>RNAI AGENT TARGETING SARM1 AND THE PHARMACEUTICAL USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260202B">C12N15/113</main-classification>  
        <further-classification edition="200601120260202B">A61K31/713</further-classification>  
        <further-classification edition="200601120260202B">A61P25/00</further-classification>  
        <further-classification edition="200601120260202B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海拓界生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUOJIE BIOTECH (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴翠翠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, CUICUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIAOYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李云飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及靶向SARM1的RNAi劑及其醫藥用途。具體地，本揭露還涉及包含該RNAi劑的醫藥組成物、細胞或試劑盒，以及該RNAi劑用於治療和/或預防患相關障礙的受試者的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to RNAi agent targeting SARM1 and the pharmaceutical use thereof. Specifically, the present disclosure also relates to pharmaceutical composition, cells or kit comprising the RNAi agent, and method for treating and/or preventing subjects suffering from related disorders by using the RNAi agent.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1151" publication-number="202627353"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627353.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燃燒爐、鍋爐、發電設備及燃燒爐的控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260219B">F23C1/04</main-classification>  
        <further-classification edition="200601120260219B">F23C5/00</further-classification>  
        <further-classification edition="200601120260219B">F23N1/00</further-classification>  
        <further-classification edition="200601120260219B">F22B1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘利猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMARI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下登敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大浦康二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OURA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙山明正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAYAMA, AKIMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 適當地防止未燃燒的氨或一氧化二氮的滯留。 &lt;br/&gt;　　[解決手段] 提供一種燃燒爐(11)，使微粉末燃料及氨燃料之燃燒所產生的燃燒氣體在燃燒爐(11)中、於流通方向(FD)上流通，從而排出至外部；燃燒爐(11)具備控制部，其在執行從複數個燃燒燃燒器(100B、100D、100F)的至少任意一個噴射微粉末燃料、並且從複數個氨燃燒燃燒器(100A、100C、100E)的至少任意一個噴射氨燃料的混燒運轉時，控制固體燃料調整部及氨燃料調整部，以使在流通方向(FD)的最上游側所噴射的燃料為微粉末燃料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鍋爐</p>  
        <p type="p">11:燃燒爐</p>  
        <p type="p">11f:爐底</p>  
        <p type="p">12:燃燒裝置</p>  
        <p type="p">39:附加空氣噴嘴</p>  
        <p type="p">100A,100C,100E:燃燒燃燒器、氨燃料燃燒器</p>  
        <p type="p">100B,100D,100F:燃燒燃燒器、固體燃料燃燒器</p>  
        <p type="p">FD:流通方向</p>  
        <p type="p">P1a,P1b,P1c:第一配置位置</p>  
        <p type="p">P2a,P2b,P2c:第二配置位置</p>  
        <p type="p">VD:鉛直方向</p>  
        <p type="p">Z:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1152" publication-number="202627676"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627676.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於監控及最佳化製程控制之自動模型項選擇</chinese-title>  
        <english-title>AUTOMATED MODEL TERM SELECTION FOR MONITORING AND OPTIMIZED PROCESS CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G03F7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厄里奇　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EHRLICH, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅杰　菲力普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROEGER, PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">自動模型項選擇可使用lasso迴歸用於選擇模型項及使用一交叉驗證方案來最佳化該lasso迴歸之一正則化參數。可藉由使用一樣本之計量量測跨一可能值範圍交叉驗證該正則化參數來選擇該正則化參數之一值。可使用該迴歸基於該等計量量測及該正則化參數之該值來產生一模型化校正。該迴歸可減小該模型化校正與該等計量量測之間的一殘差。該等模型項可包含直至一最大階之可能模型項之一子集。自該等可能模型項選擇該等模型項可防止過擬合該模型化校正。該正則化參數可控制所選擇之該等模型項之數目。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Automated model term selection may use lasso regression for selecting model terms and a cross-validation scheme to optimize a regularization parameter of the lasso regression. A value of the regularization parameter may be selected by cross-validating the regularization parameter across a range of possible values using metrology measurements of a sample. A modeled correction may be generated based on the metrology measurements and the value of the regularization parameter using the regression. The regression may reduce a residual between the modeled correction and the metrology measurements. The model terms may include a sub-set of possible model terms up to a maximum order. Selecting the model terms from the possible model terms may prevent overfitting the modeled correction. The regularization parameter may control the number of the model terms which are selected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">210:步驟</p>  
        <p type="p">220:步驟</p>  
        <p type="p">230:步驟</p>  
        <p type="p">240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1153" publication-number="202626621"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626621.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種芳雜環化合物及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/14</main-classification>  
        <further-classification edition="200601120260401B">A61K31/496</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P13/12</further-classification>  
        <further-classification edition="200601120260401B">A61P5/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翊石醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOVSTONE THERAPEUTICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋云龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, YUNLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉天琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TIANQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段云霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUAN, YUNXIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪笛莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇紅艶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOU, HONGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王越</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苗新園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, XINYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆永釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, YONGZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種CYP11B2抑制劑化合物、其立體異構體、互變異構體或藥學上可接受的鹽。所述化合物及其藥物組合物具有製備治療及/或預防CYP11B2介導的疾病的藥物的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1154" publication-number="202628732"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628732.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250709B">H10H29/30</main-classification>  
        <further-classification edition="202501120250709B">H10H29/37</further-classification>  
        <further-classification edition="202501120250709B">H10H29/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱冠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>來漢中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HAN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許明祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括基板及多個畫素結構。多個畫素結構設置於基板上。每一畫素結構包括多個接墊組、多個發光元件及驅動線路結構。接墊組具有接墊組幾何中心。發光元件分別接合至接墊組。驅動線路結構夾設於基板與接墊組。每一畫素結構設置於畫素區內。畫素區的有效面積為畫素區的總面積與畫素區內的接墊組的面積的差。在畫素區內，驅動線路結構具有位於接墊組外的低吸收區。低吸收區對雷射的吸收率小於接墊組對雷射的吸收率，低吸收區的面積大於有效面積的60%且小於有效面積的90%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus includes a substrate and a plurality of pixel structures. The pixel structures are disposed on the substrate. Each of the pixel structures includes a plurality of pad groups, a plurality of light-emitting elements and a driving circuit structure. The pad groups have a pad group geometric center. The light-emitting elements are respectively connected to the pad groups. The driving circuit structure is sandwiched between the substrate and the pad groups. Each of the pixel structures is disposed in a pixel area. An effective area of ​​the pixel area is the difference between a total area of ​​the pixel area and an area of the pad groups in the pixel area. In the pixel area, the driving circuit structure has a low absorption region located outside the pad groups. A laser absorption rate of the low absorption region is less than a laser absorption rate of the pad groups. The area of ​​the low absorption region is greater than 60% of the effective area and less than 90% of the effective area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10a:顯示裝置</p>  
        <p type="p">110s:非穿透材料區</p>  
        <p type="p">110t:穿透區</p>  
        <p type="p">120a:接墊組</p>  
        <p type="p">122:接墊</p>  
        <p type="p">130:發光元件</p>  
        <p type="p">160a:驅動線路結構</p>  
        <p type="p">C:接墊組幾何中心</p>  
        <p type="p">A1、A2、A3、A4:距離</p>  
        <p type="p">C-C’:剖線</p>  
        <p type="p">d1:第一方向</p>  
        <p type="p">d2:第二方向</p>  
        <p type="p">d3:第三方向</p>  
        <p type="p">d4:第四方向</p>  
        <p type="p">L1:第一擬直線</p>  
        <p type="p">L2:第二擬直線</p>  
        <p type="p">L3:第三擬直線</p>  
        <p type="p">L4:第四擬直線</p>  
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;:第一間距</p>  
        <p type="p">P&lt;sub&gt;2&lt;/sub&gt;:第二間距</p>  
        <p type="p">PX2:畫素結構</p>  
        <p type="p">R2:畫素區</p>  
        <p type="p">R2a:低吸收區</p>  
        <p type="p">R2b:高吸收區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1155" publication-number="202626449"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626449.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123419</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>袋體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">B65D33/02</main-classification>  
        <further-classification edition="200601120260317B">B65D77/22</further-classification>  
        <further-classification edition="200601120260317B">B65D30/20</further-classification>  
        <further-classification edition="200601120260317B">B65D30/22</further-classification>  
        <further-classification edition="200601120260317B">B65D33/08</further-classification>  
        <further-classification edition="200601120260317B">B65D33/18</further-classification>  
        <further-classification edition="200601120260317B">B65D71/16</further-classification>  
        <further-classification edition="200601120260317B">B65D77/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＫＹ7股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KY7 INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林裕義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, HIROYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種袋體，其作為袋體能夠通過簡單的操作簡單且穩定地保持容器，並且即使是在飲料從容器漏出的情形下，也能大幅減少液體弄濕袋體之情事。 &lt;br/&gt;袋體具有本體，該本體具有底部、和在該底部周緣處與該底部相連的周壁部，該本體形成由該底部和該周壁部所包圍且可容納內容物的空間部、以及供該內容物插入該空間部的開口部。該本體設有位置限制構件，該位置限制構件具有限制壁部以限制該空間部之內部中的該內容物之移動。該位置限制構件至少接合於該周壁部的內表面，當以由該限制壁部限制該移動的方式將內容物配置於該空間部時，若將該限制壁部的面中的與該內容物相向的面設為相對面，則該限制壁部構成為，能夠形成為該相對面形成凹狀面的第1形狀狀態、和該相對面形成凸狀面的第2形狀狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:袋體</p>  
        <p type="p">20:本體</p>  
        <p type="p">21:周壁部</p>  
        <p type="p">21A:內表面</p>  
        <p type="p">22:底部</p>  
        <p type="p">23:空間部</p>  
        <p type="p">24:開口部</p>  
        <p type="p">25:壁面部</p>  
        <p type="p">25A:第1壁面部</p>  
        <p type="p">25B:第2壁面部</p>  
        <p type="p">26:側壁面部</p>  
        <p type="p">28:角落部</p>  
        <p type="p">29:本體摺邊部</p>  
        <p type="p">30:位置限制構件</p>  
        <p type="p">31:限制壁部</p>  
        <p type="p">32:接合餘量部</p>  
        <p type="p">ST2:第2形狀狀態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1156" publication-number="202628867"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628867.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頂銷的位置偵測方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P72/00</main-classification>  
        <further-classification edition="202601120260325B">H10P72/50</further-classification>  
        <further-classification edition="202601120260325B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤池宗明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAIKE, MUNEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下幸孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YUKITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末木英人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEKI, HIDEHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦知久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TOMOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>町山彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHIYAMA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為容易實施頂銷的待機位置的教示。 &lt;br/&gt;頂銷係配置在開口於供載置基板的載置台的載置面之銷孔中，沿上下方向延伸，具有細軸部與設置在比細軸部更上方且直徑比細軸部大的粗軸部，並在從粗軸部變化成細軸部的部位形成有第1段差；另外，頂銷係連接於使該頂銷沿上下方向移動的驅動機構；銷孔係沿上下方向穿設，具有大徑部與設置在比大徑部更下方且直徑比大徑部小的小徑部，並在從大徑部變化成小徑部的部位形成有第2段差；根據驅動機構的負荷的指標來偵測使頂銷上升之後再下降時第1段差與第2段差的抵接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">G:玻璃基板</p>  
        <p type="p">10:基板處理裝置</p>  
        <p type="p">11:處理容器</p>  
        <p type="p">12:底壁</p>  
        <p type="p">13:側壁</p>  
        <p type="p">14:蓋體</p>  
        <p type="p">15:載置台</p>  
        <p type="p">16:基材</p>  
        <p type="p">17:靜電吸盤</p>  
        <p type="p">18:電極</p>  
        <p type="p">19:直流電源</p>  
        <p type="p">20:供電線</p>  
        <p type="p">21:頂銷裝置</p>  
        <p type="p">22:銷孔</p>  
        <p type="p">23:頂銷</p>  
        <p type="p">24:驅動部</p>  
        <p type="p">25:噴淋頭</p>  
        <p type="p">26:氣體擴散空間</p>  
        <p type="p">27:氣體噴出孔</p>  
        <p type="p">28:氣體導入口</p>  
        <p type="p">29:氣體供應管</p>  
        <p type="p">30:氣體供應源</p>  
        <p type="p">31:排氣用開口</p>  
        <p type="p">32:排氣管</p>  
        <p type="p">33:排氣裝置</p>  
        <p type="p">34:搬出入口</p>  
        <p type="p">35:閘閥</p>  
        <p type="p">36:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1157" publication-number="202628606"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628606.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容器及其形成方法</chinese-title>  
        <english-title>CAPACITOR AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D1/68</main-classification>  
        <further-classification edition="202301120251103B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈香谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, HSIANG-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周世晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括形成第一電極，包括沉積導電材料的第一層以及在導電材料的第一層上沉積導電材料的第二層；在導電材料的第二層上形成第一絕緣層；以及形成第二電極，包括在第一絕緣層上方沉積導電材料的第三層以及在導電材料的第三層上方沉積導電材料的第四層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a first electrode, including depositing a first layer of a conductive material and depositing a second layer of the conductive material on the first layer of the conductive material; forming a first insulator layer on the second layer of the conductive material; and forming a second electrode, including depositing a third layer of the conductive material over the first insulator layer and depositing a fourth layer of the conductive material over the third layer of the conductive material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">146:電容器</p>  
        <p type="p">201:特徵</p>  
        <p type="p">202:導電特徵</p>  
        <p type="p">204:介電層</p>  
        <p type="p">206:蝕刻終止層</p>  
        <p type="p">208:介電層、上覆介電層</p>  
        <p type="p">212:電極、雙層電極、叉指電極</p>  
        <p type="p">212A:電極、第一電極、底部電極</p>  
        <p type="p">212B:電極、第二電極、中間電極</p>  
        <p type="p">212C:電極、第三電極、頂部電極</p>  
        <p type="p">216A:絕緣體、第一絕緣體、底部絕緣體</p>  
        <p type="p">216B:絕緣體、第二絕緣體、頂部絕緣體</p>  
        <p type="p">220:介電層</p>  
        <p type="p">226:接觸插塞</p>  
        <p type="p">228:導電線</p>  
        <p type="p">230:鈍化層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1158" publication-number="202628662"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628662.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHODS OF FORMING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10D84/01</main-classification>  
        <further-classification edition="202501120260302B">H10D62/17</further-classification>  
        <further-classification edition="202601120260302B">H10P14/24</further-classification>  
        <further-classification edition="202601120260302B">H10P14/40</further-classification>  
        <further-classification edition="202501120260302B">H10D84/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　沛樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, OLIVIA PEI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃浩欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　煒業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOH, WEI-YIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王菘豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法包括提供包含底部源極/汲極特徵、底部源極/汲極特徵上安置的底部層間介電(ILD)層、底部ILD層及底部源極/汲極特徵上安置的頂部源極/汲極特徵及頂部源極/汲極特徵上安置的頂部ILD層的結構。方法還包括形成延伸至頂部ILD層及底部ILD層的溝槽。溝槽暴露頂部源極/汲極特徵頂面及側壁及底部源極/汲極特徵頂面。方法還包括在頂部源極/汲極特徵的頂面及側壁與底部源極/汲極特徵的頂面上形成第一矽化物層，在第一矽化物層上形成第二矽化物層，及在溝槽中形成金屬填充層。第一矽化物層及第二矽化物層具有不同組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes providing a structure including a bottom source/drain feature, a bottom interlayer dielectric (ILD) layer disposed over the bottom source/drain feature, a top source/drain feature disposed over the bottom ILD layer and the bottom source/drain feature, and a top ILD layer disposed over the top source/drain feature. The method further includes forming a trench extending in the top ILD layer and the bottom ILD layer. The trench exposes a top surface and a sidewall of the top source/drain feature and a top surface of the bottom source/drain feature. The method further includes forming first silicide layers on the top surface and the sidewall of the top source/drain feature and the top surface of the bottom source/drain feature, forming second silicide layers on the first silicide layers, and forming a metal fill layer in the trench. The first silicide layers and the second silicide layers have different compositions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:結構</p>  
        <p type="p">230:源極/汲極特徵</p>  
        <p type="p">230-1:底部源極/汲極特徵</p>  
        <p type="p">230-2:底部源極/汲極特徵</p>  
        <p type="p">230-3:底部源極/汲極特徵</p>  
        <p type="p">244:源極/汲極特徵</p>  
        <p type="p">244-1:頂部源極/汲極特徵</p>  
        <p type="p">244-2:頂部源極/汲極特徵</p>  
        <p type="p">244-3:頂部源極/汲極特徵</p>  
        <p type="p">278:金屬填充層</p>  
        <p type="p">C:部分</p>  
        <p type="p">E:部分</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1159" publication-number="202628326"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628326.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多相電源轉換器及其控制方法</chinese-title>  
        <english-title>MULTI-PHASE POWER CONVERTER AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260309B">H02M1/08</main-classification>  
        <further-classification edition="200601120260309B">H02M3/158</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴富祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, FU-SHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳緯權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴鼎容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, TING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多相電源轉換器，包含：複數功率級電路，用以將輸入電壓轉換為輸出電壓，其中複數功率級電路分別耦接於輸入電壓，並各自透過其中至少一開關，控制對應之一電感，所述電感將能量傳送至該輸出電壓；電流感測電路，耦接於複數功率級電路，用以感測每一功率級電路中，流經每一電感之電感電流；以及控制電路，包括瞬時電流響應模組，用以於至少一電感電流超過瞬時電流閾值時，觸發瞬時電流響應，以增加或減少複數功率級電路之操作相位數量，進而抑制輸出電壓的過衝或欠衝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-phase power converter includes: a plurality of power stage circuits, configured to convert an input voltage to an output voltage, wherein the plurality of power stage circuits are respectively coupled to the input voltage, each power stage circuit including at least one switch controlling a corresponding inductor, wherein the inductors deliver energy to the output voltage; a current sensing circuit, coupled to the plurality of power stage circuits, and configured to sense an inductor current flowing through each inductor in each power stage circuit; and a control circuit, comprising an instantaneous current response module configured to trigger an instantaneous current response to increase or decrease a number of operating phases of the plurality of power stage circuits when at least one of the inductor currents exceeds an instantaneous current threshold, thereby suppressing an overshoot or an undershoot of the output voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多相電源轉換器</p>  
        <p type="p">11:負載電路</p>  
        <p type="p">101,102,103,104:功率級電路</p>  
        <p type="p">111:電流感測電路</p>  
        <p type="p">120:控制電路</p>  
        <p type="p">121:瞬時電流響應模組</p>  
        <p type="p">IL1,IL2,IL3,IL4:電感電流</p>  
        <p type="p">ILOAD:負載電流</p>  
        <p type="p">ITL:瞬時電流訊號</p>  
        <p type="p">L1,L2,L3,L4:電感</p>  
        <p type="p">SW1,SW2,SW3,SW4:開關</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VO:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1160" publication-number="202628677"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628677.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構與其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D84/83</main-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202501120260302B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RUI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪昕揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, HSIN YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何士融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHIH-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤韋翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, WEI-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容的一個態樣涉及一種結構。結構包括：第一層間介電(ILD)層；導電特徵，設置在第一ILD層中；蝕刻終止層(ESL)，設置在第一ILD層上；第二ILD層，設置在ESL上；及金屬特徵，設置在第二ILD層中且與導電特徵接觸，其中金屬特徵藉由氣隙與ESL橫向隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the present disclosure pertains to a structure. The structure includes a first interlayer dielectric (ILD) layer; a conductive feature disposed in the first ILD layer; an etch stop layer (ESL) disposed on the first ILD layer; a second ILD layer disposed on the ESL; and a metal feature disposed in the second ILD layer and in contact with the conductive feature, where the metal feature is laterally separated from the ESL by an air gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置，裝置</p>  
        <p type="p">101:基板</p>  
        <p type="p">105:內間隔物</p>  
        <p type="p">106:半導體堆疊</p>  
        <p type="p">106a:通道</p>  
        <p type="p">106b:S/D特徵，S/D磊晶特徵</p>  
        <p type="p">108:閘極結構</p>  
        <p type="p">108a:底部分</p>  
        <p type="p">108b:頂部分</p>  
        <p type="p">109:閘極間隔物</p>  
        <p type="p">110:第一ILD層，ILD層</p>  
        <p type="p">111、115、125:ESL</p>  
        <p type="p">113:阻障層</p>  
        <p type="p">116:S/D觸點</p>  
        <p type="p">118:閘極觸點</p>  
        <p type="p">120:第二ILD層，ILD層</p>  
        <p type="p">130:第三ILD層，ILD層</p>  
        <p type="p">141:氣隙</p>  
        <p type="p">150:IC結構</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1161" publication-number="202627870"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627870.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以對積體電路佈局執行驗證之運算裝置及驗證方法</chinese-title>  
        <english-title>COMPUTING DEVICE AND VERIFICATION METHOD FOR PERFORMING VERIFICATION ON LAYOUT OF INTEGRATED CIRCUITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251201B">G06F30/398</main-classification>  
        <further-classification edition="202001120251201B">G06F30/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇載英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SO, JAE-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂知珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEO, JIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李勇錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YONG-SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUNSEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林熙宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HEEJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭珉鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, MIN-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由一電腦裝置執行之用於一積體電路之一佈局的驗證方法包括：比較對應於該積體電路之一示意圖的一第一網路連線表與對應於該積體電路之一第一佈局的一第二網路連線表；回應於判定該第一網路連線表及該第二網路連線表彼此對應，藉由將一預輸入重定規則應用於該第一佈局而產生一第二佈局；自該第一佈局產生包括該第一佈局中包括之層中之各者之座標資料的一第一文字檔案；自該第二佈局產生包括該第二佈局中包括之層中之各者之座標資料的一第二文字檔案；以及基於該第一文字檔案及該第二文字檔案，輸出指示該第一佈局與該第二佈局之間的一差異是否對應於預儲存特徵資料之驗證資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A verification method for a layout of an integrated circuit performed by a computer device includes comparing a first netlist corresponding to a schematic diagram of the integrated circuit and a second netlist corresponding to a first layout of the integrated circuit, generating a second layout by applying a pre-input retarget rule to the first layout in response to determining that the first netlist and the second netlist correspond to each other, generating a first text file, including coordinate data for each of layers included in the first layout, from the first layout, generating a second text file, including coordinate data for each of layers included in the second layout, from the second layout, and outputting verification information indicating whether a difference between the first layout and the second layout corresponds to pre-stored feature data, based on the first text file and the second text file.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:驗證工具</p>  
        <p type="p">221:LVS工具</p>  
        <p type="p">222:佈局產生工具</p>  
        <p type="p">FDT:特徵資料表</p>  
        <p type="p">IC:積體電路</p>  
        <p type="p">LO1:第一佈局</p>  
        <p type="p">LO2:第二佈局</p>  
        <p type="p">SC:示意圖</p>  
        <p type="p">T1:第一文字檔案，文字檔案</p>  
        <p type="p">T2:第二文字檔案，文字檔案</p>  
        <p type="p">VI:驗證資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1162" publication-number="202628992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體積體封裝、積體封裝方法及積體封裝系統</chinese-title>  
        <english-title>SEMICONDUCTOR INTEGRATED PACKAGE, METHODS FOR INTEGRATED PACKAGING AND INTEGRATED PACKAGE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10W40/47</main-classification>  
        <further-classification edition="202601120260317B">H10W40/22</further-classification>  
        <further-classification edition="202601120260317B">H10W70/65</further-classification>  
        <further-classification edition="202601120260317B">H10W70/63</further-classification>  
        <further-classification edition="202601120260317B">H10W72/00</further-classification>  
        <further-classification edition="202601120260317B">H10W95/00</further-classification>  
        <further-classification edition="202601120260317B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　又坪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, WOOPOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了半導體積體封裝、積體封裝方法及積體封裝系統。半導體積體封裝包括:中介層具有頂表面和底表面；第一電路層藉由第一接合設置於頂表面上並具有至少一個第一電路；第二電路層藉由第二接合設置於第一電路層上並具有至少一個第二電路；以及具有嵌入式液體冷卻通道的散熱層接合於第二電路層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor integrated package, a method for an integrated package and an integrated package system are disclosed. The semiconductor integrated package device includes: an interposer has a top surface and a bottom surface, a first circuit layer is disposed on the top surface by a first bonding and has at least one first circuit, a second circuit layer is disposed on the first circuit layer by a second bonding and has at least one second circuit, and a thermal layer having an embedded liquid cooling channel is bonded on the second circuit layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">190:積體封裝</p>  
        <p type="p">205:凸塊/互連元件</p>  
        <p type="p">210:中介層</p>  
        <p type="p">215:矽穿孔/TSV</p>  
        <p type="p">222,224:層間電介質/ILD</p>  
        <p type="p">225:互連</p>  
        <p type="p">227:積體堆疊電容器/ISC</p>  
        <p type="p">230:第一電路層</p>  
        <p type="p">240:第二電路層</p>  
        <p type="p">232,234:第一電路</p>  
        <p type="p">242,244:第二電路</p>  
        <p type="p">235:區域</p>  
        <p type="p">252,254,256:分離介電材料</p>  
        <p type="p">260:散熱層</p>  
        <p type="p">265:液體冷卻通道/嵌入式液體冷卻通道</p>  
        <p type="p">270:背面電源層</p>  
        <p type="p">275:電源通孔</p>  
        <p type="p">280:電晶體層</p>  
        <p type="p">290:信號層</p>  
        <p type="p">295:訊號通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1163" publication-number="202626932"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626932.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹼性顯影型固化性樹脂組合物、乾膜、固化物以及電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">C08L23/0869</main-classification>  
        <further-classification edition="200601120260318B">C08F2/44</further-classification>  
        <further-classification edition="200601120260318B">C08F2/50</further-classification>  
        <further-classification edition="200601120260318B">C08F220/18</further-classification>  
        <further-classification edition="200601120260318B">C08F220/06</further-classification>  
        <further-classification edition="201801120260318B">C08K3/013</further-classification>  
        <further-classification edition="200601120260318B">G03F7/004</further-classification>  
        <further-classification edition="200601120260318B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商太陽油墨（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO INK (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫雲祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YUNXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤賢治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鹼性顯影型固化性樹脂組合物、具有由該樹脂組合物形成的樹脂層的乾膜、由該樹脂組合物形成的固化物以及具有該固化物的電子零件。該鹼性顯影型固化性樹脂組合物及其固化物的耐酸性、耐化學鍍金性、電解鍍金性以及耐化錫性優異，並且不容易出現返粗。該鹼性顯影型固化性樹脂組合物包含(A)含羧基樹脂、(B)光聚合起始劑、(C)抗氧化劑、(D)硫酸鋇以及(E)滑石，前述(C)抗氧化劑的相對分子量為600g/mol以上至1200g/mol以下，並且熔點為100℃以上至130℃以下，前述(D)硫酸鋇為使用胺類物質進行了表面處理之平均粒徑為0.5μm以下的硫酸鋇。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1164" publication-number="202625995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>按摩單元及椅子型按摩機</chinese-title>  
        <english-title>MASSAGE UNIT AND CHAIR-TYPE MASSAGE MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250910B">A61H7/00</main-classification>  
        <further-classification edition="200601120250910B">A61H11/02</further-classification>  
        <further-classification edition="200601120250910B">A61H15/00</further-classification>  
        <further-classification edition="200601120250910B">A61H21/00</further-classification>  
        <further-classification edition="200601120250910B">A61H23/02</further-classification>  
        <further-classification edition="200601120250910B">A47C1/031</further-classification>  
        <further-classification edition="200601120250910B">A47C7/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大東電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAITO ELECTRIC MACHINE INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳煒偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張震海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHENHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水新策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]根據施療部改變按摩感的強弱。&lt;br/&gt; [解決手段]按摩單元具有：左右一對的按摩構件，設置在基台上；及驅動機構，使前述左右一對的按摩構件接近或分離以對施療部產生揉按動作；&lt;br/&gt; 前述驅動機構具有：旋轉軸，被驅動為繞朝水平方向的軸旋轉；驅動部，驅動前述旋轉軸旋轉；及揉按動作轉換部，將前述旋轉軸的旋轉運動轉換為左右方向的擺動運動，&lt;br/&gt; 配置為左右一對的前述按摩構件具有：臂部，基端被前述揉按動作轉換部支撐；及施療件，配置於前述臂部的頂端；&lt;br/&gt; 前述施療件具有：第一施療件，設置於前述臂部的頂端的上部；及第二施療件，設置於前述臂部的頂端的下部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The strength of a feeling of massage is changed in accordance with a treatment target. A massage unit includes a pair of left and right massage members disposed on a base, and a drive mechanism configured to perform kneading operation on a treatment target by bringing or separating the pair of left and right massage members close to or from each other. The drive mechanism includes a rotary shaft to be rotationally driven about an axis extending horizontally, a driver configured to rotationally drive the rotary shaft, and a kneading operation conversion portion configured to convert rotating motion of the rotary shaft into swinging motion in a left-right direction. The pair of left and right massage members each include an arm portion having a proximal end supported by the kneading operation conversion portion, and a treatment element disposed on a distal end of the arm portion. The treatment element includes a first treatment element disposed on an upper side of the distal end of the arm portion, and a second treatment element disposed on a lower side of the distal end of the arm portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:按摩單元</p>  
        <p type="p">6:導軌</p>  
        <p type="p">7:齒條部</p>  
        <p type="p">10:基台</p>  
        <p type="p">13:殼體</p>  
        <p type="p">14:臂部</p>  
        <p type="p">14L:左臂部</p>  
        <p type="p">15L:左側施療件</p>  
        <p type="p">15R:右側施療件</p>  
        <p type="p">16L:左側第一施療件</p>  
        <p type="p">16R:右側第一施療件</p>  
        <p type="p">17R:右側第二施療件</p>  
        <p type="p">18:第一接觸面</p>  
        <p type="p">20:旋轉軸</p>  
        <p type="p">28:突起</p>  
        <p type="p">29:抓捏施療件</p>  
        <p type="p">29L:左側抓捏施療件</p>  
        <p type="p">29R:右側抓捏施療件</p>  
        <p type="p">35:抓捏臂部</p>  
        <p type="p">35L:左側抓捏臂部</p>  
        <p type="p">35R:右側抓捏臂部</p>  
        <p type="p">39:動作轉換部</p>  
        <p type="p">39L:左側動作轉換部</p>  
        <p type="p">39R:右側動作轉換部</p>  
        <p type="p">40:抓捏動作轉換部</p>  
        <p type="p">40L:左側抓捏動作轉換部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1165" publication-number="202627052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱解油之氫化處理</chinese-title>  
        <english-title>HYDROPROCESSING OF PYROLYSIS OILS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C10G45/38</main-classification>  
        <further-classification edition="200601120260316B">C10G67/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商托普索公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPSOE A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登辛　阿舍溫　辛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENSINGH, ASHWIN SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於諸如熱解油之液體油的氫化處理之領域，更特定言之，係關於在藉由進一步氫化處理進行升級之前藉由氫化處置來使該液體油穩定化。更特定言之，本發明係關於含有可聚合反應性化合物之熱解油之穩定化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the field of hydroprocessing of liquid oils such as pyrolysis oils, more specifically to the stabilization of the liquid oil by hydrotreating prior to being upgraded by further hydroprocessing. More particularly, the invention relates to the stabilization of pyrolysis oil containing polymerisable reactive compounds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:(PPO)進料</p>  
        <p type="p">1A:第一物料流</p>  
        <p type="p">1B:第二物料流</p>  
        <p type="p">5:混合物料流</p>  
        <p type="p">8:富氫物料流</p>  
        <p type="p">9:再循環物料流</p>  
        <p type="p">10:固定床反應器</p>  
        <p type="p">10A:第一反應器床</p>  
        <p type="p">10B:第二反應器床</p>  
        <p type="p">11:第一烴物料流</p>  
        <p type="p">15:熱交換器</p>  
        <p type="p">20:裝料加熱器</p>  
        <p type="p">21:第二烴物料流</p>  
        <p type="p">30:氫化處置反應器</p>  
        <p type="p">31:第三烴物料流</p>  
        <p type="p">35:固定床反應器合併進料/氫化處置反應器流出物交換器</p>  
        <p type="p">40:熱分離器</p>  
        <p type="p">41:氣體餾分</p>  
        <p type="p">42:液體餾分</p>  
        <p type="p">45:氫化處置反應器流出物蒸汽產生器</p>  
        <p type="p">46:輸出蒸汽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1166" publication-number="202628627"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628627.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123989</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251120B">H10D30/60</main-classification>  
        <further-classification edition="202501120251120B">H10D64/68</further-classification>  
        <further-classification edition="202501120251120B">H10D62/10</further-classification>  
        <further-classification edition="202501120251120B">H10D30/01</further-classification>  
        <further-classification edition="202501120251120B">H10D64/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤韋翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, WEI-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">互補式場效電晶體(complementary field effect transistor, CFET)裝置的頂層設置複數個第一電晶體。第一接合層設置在此頂層裝置上方。此第一接合層包括第一介電層及嵌入在此第一介電層中的複數個第一導電元件。此CFET的底層裝置包括複數個第二電晶體。第二接合層設置在第二裝置上方。此第二接合層包括第二介電層及嵌入在此第二介電層中的複數個第二導電元件。此等第一導電元件中的每一者與此等第二導電元件中的各別一者對準且耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A top tier device of a complementary field effect transistor (CFET) device comprises a plurality of first transistors. A first bonding layer disposed over the top tier device. The first bonding layer includes a first dielectric layer and a plurality of first conductive components embedded in the first dielectric layer. A bottom tier device of the CFET includes a plurality of second transistors. A second bonding layer is disposed over the second device. The second bonding layer includes a second dielectric layer and a plurality of second conductive components embedded in the second dielectric layer. Each of the first conductive components is aligned with, and coupled to, a respective one of the second conductive components.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">270:源極/汲極區</p>  
        <p type="p">275:源極/汲極觸點</p>  
        <p type="p">280:導電通孔</p>  
        <p type="p">290:導電通孔</p>  
        <p type="p">300:頂層裝置</p>  
        <p type="p">310:側面</p>  
        <p type="p">311:側面</p>  
        <p type="p">320:後段製程互連結構</p>  
        <p type="p">321:中段製程互連結構</p>  
        <p type="p">330:介電層</p>  
        <p type="p">380:接合元件</p>  
        <p type="p">381:接合元件</p>  
        <p type="p">400:底層裝置</p>  
        <p type="p">410:側面</p>  
        <p type="p">411:側面</p>  
        <p type="p">420:後段製程互連結構</p>  
        <p type="p">421:中段製程互連結構</p>  
        <p type="p">430:介電層</p>  
        <p type="p">480:接合元件</p>  
        <p type="p">481:接合元件</p>  
        <p type="p">490:接合製程</p>  
        <p type="p">495:部分</p>  
        <p type="p">500:平行式互補式場效電晶體裝置</p>  
        <p type="p">X:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1167" publication-number="202627333"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627333.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥芯、閥結構及車輛</chinese-title>  
        <english-title>VALVE CORE, VALVE STRUCTURE, AND VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">F16K1/46</main-classification>  
        <further-classification edition="200601120251124B">F16K1/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商比亞迪股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYD COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓啟凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHUO, QIFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雪豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XUEHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳漢元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HANYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋品豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, PINHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種閥芯、閥結構及車輛，閥芯設置在閥結構內，閥芯包括相互連接的連接部及加壓部且被配置為打開或關閉閥結構；其中，加壓部的外輪廓的至少一部分凸出於與連接部的外輪廓；在本發明實施例中，由於閥芯的加壓部的外輪廓的至少一部分凸出於連接部的外輪廓，在閥結構處於關閉狀態下，閥結構內的高壓強會向加壓部的外輪廓凸出於連接部的外輪廓的表面上施加一定壓力，從而確保閥結構在處於關閉狀態下時閥芯的密封效果，避免閥芯發生活動而導致閥結構的密封性不佳的問題出現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a valve core, a valve structure, and a vehicle. The valve core is disposed within the valve structure and includes a connecting portion and a pressurizing portion that are connected to each other, and is configured to open or close the valve structure; wherein at least a part of the outer contour of the pressurizing portion protrudes beyond the outer contour of the connecting portion. In the embodiments of e present invention, because at least a part of the outer contour of the pressurizing portion protrudes beyond the outer contour of the connecting portion, when the valve structure is in a closed state, the high pressure inside the valve structure applies pressure to the protruding surface of the pressurizing portion, thereby ensuring the sealing effect of the valve core when the valve structure is closed and preventing poor sealing due to movement of the valve core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:閥芯</p>  
        <p type="p">21:連接環</p>  
        <p type="p">22:進口</p>  
        <p type="p">4:閥體</p>  
        <p type="p">41:閥座組件</p>  
        <p type="p">411:閥座</p>  
        <p type="p">412:密封件</p>  
        <p type="p">42:閥殼</p>  
        <p type="p">43:閥本體</p>  
        <p type="p">44:閥蓋</p>  
        <p type="p">5:閥腔</p>  
        <p type="p">6:閥口</p>  
        <p type="p">7:驅動組件</p>  
        <p type="p">71:輸出部</p>  
        <p type="p">72:第一彈性件</p>  
        <p type="p">73:限位件</p>  
        <p type="p">74:安裝座</p>  
        <p type="p">75:轉動件</p>  
        <p type="p">76:連接件</p>  
        <p type="p">77:第二彈性件</p>  
        <p type="p">8:安裝腔</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Y:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1168" publication-number="202628663"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628663.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10D84/01</main-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202501120260302B">H10D84/83</further-classification>  
        <further-classification edition="200601120260302B">B82B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RUI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪昕揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, HSIN YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SZU-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何士融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHIH-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括形成第一半導體層及與第一半導體層重疊的第二半導體層。第二半導體層藉由介電隔離層與第一半導體層間隔開。方法包括執行第一磊晶製程以在第一半導體層的旁邊形成下源極/汲極區域，在下源極/汲極區域上形成虛設接觸蝕刻終止層，在虛設接觸蝕刻終止層上形成虛設層間介電質，以及執行第二磊晶製程以在第二半導體層的旁邊形成上源極/汲極區域，上源極/汲極區域在虛設層間介電質上。去除虛設層間介電質及虛設接觸蝕刻終止層，以在上源極/汲極區域與下源極/汲極區域之間形成間隙。形成介電區域以填充間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a first semiconductor layer and a second semiconductor layer overlapping the first semiconductor layer. The second semiconductor layer is spaced apart from the first semiconductor layer by a dielectric isolation layer. The method includes performing a first epitaxy process to form a lower source/drain region aside of the first semiconductor layer, forming a dummy contact etch stop layer over the lower source/drain region, forming a dummy inter-layer dielectric over the dummy contact etch stop layer, and performing a second epitaxy process to form an upper source/drain region aside of the second semiconductor layer, The upper source/drain region is over the dummy inter-layer dielectric. The dummy inter-layer dielectric and the dummy contact etch stop layer are removed to form a gap between the upper source/drain region and the lower source/drain region. A dielectric region is formed to fill the gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:CFET</p>  
        <p type="p">10U:上奈米結構FET</p>  
        <p type="p">20:基板</p>  
        <p type="p">20':半導體條</p>  
        <p type="p">26'L:下半導體奈米結構</p>  
        <p type="p">26'M:中間半導體奈米結構</p>  
        <p type="p">26'U:上半導體奈米結構</p>  
        <p type="p">44:閘極間隔物</p>  
        <p type="p">54:內部間隔物</p>  
        <p type="p">56:介電隔離層</p>  
        <p type="p">62U:上源極/汲極區域</p>  
        <p type="p">70A:CESL</p>  
        <p type="p">72A:ILD</p>  
        <p type="p">78:閘極介電質</p>  
        <p type="p">80L:下閘極電極</p>  
        <p type="p">80U:上閘極電極</p>  
        <p type="p">90:替代閘極堆疊</p>  
        <p type="p">90L:閘極堆疊</p>  
        <p type="p">90U:閘極堆疊</p>  
        <p type="p">120:孔隙</p>  
        <p type="p">122:蝕刻終止層</p>  
        <p type="p">124:ILD</p>  
        <p type="p">134:介電襯墊</p>  
        <p type="p">142A:矽化物層</p>  
        <p type="p">142B:矽化物層</p>  
        <p type="p">144:接觸插塞</p>  
        <p type="p">144A:接觸插塞</p>  
        <p type="p">144B:接觸插塞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1169" publication-number="202626807"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626807.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹼可溶性樹脂、感光性樹脂組成物、感光性著色組成物，及彩色濾光片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F220/06</main-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/22</further-classification>  
        <further-classification edition="200601120251201B">C08F220/26</further-classification>  
        <further-classification edition="200601120251201B">C08F226/12</further-classification>  
        <further-classification edition="200601120251201B">C09D17/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/033</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G02B5/20</further-classification>  
        <further-classification edition="200601120251201B">G02B5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGI, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下健宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鹼可溶性樹脂，其具有式(1)表示之結構單元(a-1)，該結構單元(a-1)具有鹵素取代苯基，酸價係10~300mgKOH/g； &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="206px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，X係氫原子、碳原子數1~4之烷基或鹵素原子，Y係單鍵或2價之有機基，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;，及R&lt;sup&gt;5&lt;/sup&gt;各自獨立地係H、Br；或I，但是R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;，及R&lt;sup&gt;5&lt;/sup&gt;之中至少1個係Br或I。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1170" publication-number="202626934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有懸浮材料的可膨脹負型光阻以及使用可膨脹負型光阻減少間隔物氧化物中的喇叭形狀的方法</chinese-title>  
        <english-title>EXPANDABLE NEGATIVE PHOTORESIST WITH SUSPENSION MATERIAL AND METHOD FOR REDUCING HORN SHAPES IN SPACER OXIDE USING EXPANDABLE NEGATIVE PHOTORESIST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L25/18</main-classification>  
        <further-classification edition="200601120260401B">C08K5/00</further-classification>  
        <further-classification edition="200601120260401B">C08K5/59</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/30</further-classification>  
        <further-classification edition="200601120260401B">G03F7/38</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="202601120260401B">H10P14/692</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子喻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, TZU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志楹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露一種可膨脹負型光阻以及利用此可膨脹負型光阻調整間隔物氧化物剖面輪廓的方法。該可膨脹負型光阻包括一高分子材料、一懸浮材料及一光酸產生劑。該懸浮材料包含複數個可膨脹分子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses an expandable negative photoresist and a method for adjusting a profile of a spacer oxide using the expandable negative photoresist. The expandable negative photoresist comprises a polymer material, a suspension material and a photoacid generator. The suspension material contains a plurality of expandable molecules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體基板</p>  
        <p type="p">102:底層</p>  
        <p type="p">314:光阻層</p>  
        <p type="p">316:可膨脹層</p>  
        <p type="p">318':間隔物氧化物層</p>  
        <p type="p">321:熱製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1171" publication-number="202628729"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628729.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明顯示裝置及拼接顯示裝置的製作方法</chinese-title>  
        <english-title>TRANSPARENT DISPLAY DEVICE AND MANUFACTURING METHOD OF TILED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10H29/20</main-classification>  
        <further-classification edition="200601120260302B">G09F9/302</further-classification>  
        <further-classification edition="202501120260302B">H10H29/01</further-classification>  
        <further-classification edition="202601120260302B">H10W46/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾佺翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHUAN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴名柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, MING-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳勇勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUNG-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張俊翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜育維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種透明顯示裝置及拼接顯示裝置的製作方法。透明顯示裝置包含一基板、多個單元以及一第一對位記號。基板具有一顯示區。單元設置於顯示區內，沿一第一方向及一第二方向重複排列，且單元的其中每一個包含至少一像素區及至少一穿透區，其中單元的其中每一個包含至少一發光元件，對應於像素區。第一對位記號設置於顯示區，且第一對位記號由至少兩層圖案層所形成，其中圖案層的其中至少一層包含金屬，且於俯視方向上，第一對位記號設置於單元的其中一個內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent display device and a manufacturing method of a tiling display device are provided. The transparent display device includes a substrate, a plurality of units, and a first alignment mark. The substrate has a display region. The units are disposed in the display region and sequentially arranged in a first direction and in a second direction, and each of the units includes a pixel region and a transparent region, in which each of the units includes at least one light emitting element corresponding to the pixel region. The first alignment mark is disposed in the display region and formed of at least two patterned layers, in which at least one of the patterned layers includes metal, and in a top view, the first alignment mark is disposed in one of the units.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基板</p>  
        <p type="p">14:單元</p>  
        <p type="p">16a,16b,16c:發光元件</p>  
        <p type="p">1a:透明顯示裝置</p>  
        <p type="p">AL:抗反射層</p>  
        <p type="p">AMR:對位記號區</p>  
        <p type="p">DR:顯示區</p>  
        <p type="p">L1:第一導線</p>  
        <p type="p">L2:第二導線</p>  
        <p type="p">LS1:第一導線組</p>  
        <p type="p">LS2:第二導線組</p>  
        <p type="p">M1:第一對位記號</p>  
        <p type="p">MR:光罩區</p>  
        <p type="p">NAMR:非對位記號區</p>  
        <p type="p">NDR:非顯示區</p>  
        <p type="p">P1:第一條狀部</p>  
        <p type="p">P2:第二條狀部</p>  
        <p type="p">PP:像素部</p>  
        <p type="p">PXR:像素區</p>  
        <p type="p">SP1:塊狀部</p>  
        <p type="p">TR1:穿透區</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1172" publication-number="202628911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓載置台</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P72/70</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上靖也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久野達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平田夏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA, NATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高津克朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKATSU, KATSUTOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶圓載置台10包括陶瓷板20、基底板30、基底板貫穿孔34、絕緣管50、樹脂管60、與供電構件70。陶瓷板20內置靜電電極22。基底板30在內部有冷媒流路32。基底板貫穿孔34在上下方向貫穿基底板30，有細徑長的孔上部34a、粗徑長的孔下部34b與孔階梯差部34c，且孔下部34b設於比冷媒流路32更下方。絕緣管50收納於孔上部34a。樹脂管60收納於孔下部34b，上面61經由黏著層80而黏著於孔階梯差部34c，且比絕緣管50徑長更粗。供電構件70係上面連接於靜電電極22，且插入於絕緣管50與樹脂管60。在樹脂管60的上面61，設有確保間隙G的凸環62。黏著層80填充於間隙G。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓載置台</p>  
        <p type="p">20:陶瓷板</p>  
        <p type="p">21:晶圓載置面</p>  
        <p type="p">22:靜電電極</p>  
        <p type="p">23:下面</p>  
        <p type="p">24:陶瓷板有底孔</p>  
        <p type="p">30:基底板</p>  
        <p type="p">32:冷媒流路</p>  
        <p type="p">32a:形成區域</p>  
        <p type="p">34:基底板貫穿孔</p>  
        <p type="p">34a:孔上部</p>  
        <p type="p">34b:孔下部</p>  
        <p type="p">34c:孔階梯差部</p>  
        <p type="p">44:貼合層貫穿孔</p>  
        <p type="p">50:絕緣管</p>  
        <p type="p">50a:下端</p>  
        <p type="p">54:絕緣管貫穿孔</p>  
        <p type="p">60:樹脂管</p>  
        <p type="p">61:上面</p>  
        <p type="p">62:凸環</p>  
        <p type="p">63:階梯差槽</p>  
        <p type="p">64:樹脂管貫穿孔</p>  
        <p type="p">70:供電構件</p>  
        <p type="p">80:黏著層</p>  
        <p type="p">G:間隙</p>  
        <p type="p">S:空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1173" publication-number="202628797"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628797.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P14/24</main-classification>  
        <further-classification edition="202601120260302B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雨華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露一種半導體元件及其製造方法。一半導體元件包含一基底、一閘極結構、一間隙結構和一密封層。該閘極結構位於該基底上。該間隙結構包括一第一間隙物、一第二間隙物、一第三間隙物和一氣隙。該第一間隙物配置在該閘極結構的一側壁上，且該氣隙位於該第一間隙物和該第二間隙物之間。該氣隙透過該第一間隙物、該第二間隙物、該第三間隙物和該密封層封閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the same. The semiconductor device comprises a substrate, a gate structure, a spacer structure, and a sealing layer. The gate structure is positioned on the substrate. The spacer structure includes a first spacer, a second spacer, a third spacer, and an air gap. The first spacer is disposed on a sidewall of the gate structure, and the air gap is located between the first spacer and the second spacer. The air gap is enclosed by the first spacer, the second spacer, the third spacer, and the sealing layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體元件</p>  
        <p type="p">100:基底</p>  
        <p type="p">100TS:頂部表面</p>  
        <p type="p">203:介電層</p>  
        <p type="p">205:介電層</p>  
        <p type="p">207:金屬層</p>  
        <p type="p">209:金屬化合物層</p>  
        <p type="p">211:金屬層</p>  
        <p type="p">213:介電層</p>  
        <p type="p">215:介電層</p>  
        <p type="p">215TS:頂部表面</p>  
        <p type="p">217:間隙物</p>  
        <p type="p">217TS:頂部表面</p>  
        <p type="p">217-1:垂直部分</p>  
        <p type="p">217-2:傾斜部分</p>  
        <p type="p">217-2S2:傾斜側壁</p>  
        <p type="p">217-3:水平部分</p>  
        <p type="p">217-4:部分</p>  
        <p type="p">219:間隙物</p>  
        <p type="p">219S2:側壁</p>  
        <p type="p">219T:最頂點</p>  
        <p type="p">219-1:部分</p>  
        <p type="p">219-2:部分</p>  
        <p type="p">220:氣隙</p>  
        <p type="p">220B:最低點</p>  
        <p type="p">220BS:傾斜底部表面</p>  
        <p type="p">220S1:側壁</p>  
        <p type="p">220TS:頂部表面</p>  
        <p type="p">221:間隙物</p>  
        <p type="p">221S2:側壁</p>  
        <p type="p">221T:最頂點</p>  
        <p type="p">223:密封層</p>  
        <p type="p">250:閘極結構</p>  
        <p type="p">250TS:頂部表面</p>  
        <p type="p">250S:側壁</p>  
        <p type="p">270:間隙結構</p>  
        <p type="p">D1:距離</p>  
        <p type="p">VL1:垂直位準</p>  
        <p type="p">VL2:垂直位準</p>  
        <p type="p">W:寬度</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:厚度</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1174" publication-number="202628970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構的形成方法</chinese-title>  
        <english-title>METHOD FOR FORMING SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃浩欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴廷軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　煒業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOH, WEI-YIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括提供包括底部裝置及在此底部裝置上方的頂部裝置的結構，形成延伸穿過此頂部裝置並進入此底部裝置中的溝槽，及在此溝槽中形成導電插塞。此溝槽包括具有第一寬度的底部部分及具有第二寬度的頂部部分，此第一寬度小於此第二寬度。在此溝槽中形成此導電插塞包括在此結構上方沉積金屬前驅物，從而在此溝槽的此等頂部及底部部分中形成金屬層，對此金屬層的頂部部分進行回蝕製程，在此溝槽中填充金屬填充層，及對此結構進行平坦化製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes providing a structure including a bottom device and a top device over the bottom device, forming a trench extending through the top device and into the bottom device, and forming a conductive plug in the trench. The trench includes a bottom portion having a first width and a top portion having a second width, the first width is less than the second width. Forming the conductive plug in the trench includes depositing a metal precursor over the structure, thereby forming a metal layer in the top and bottom portions of the trench, performing an etch-back process to a top portion of the metal layer, filling a metal fill layer in the trench, and performing a planarization process to the structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:結構</p>  
        <p type="p">200':替代結構</p>  
        <p type="p">218B:底部源極/汲極特徵</p>  
        <p type="p">218T:頂部源極/汲極特徵</p>  
        <p type="p">264:介電質襯墊</p>  
        <p type="p">266:矽化物層</p>  
        <p type="p">268:金屬晶種層</p>  
        <p type="p">270:金屬層</p>  
        <p type="p">272':剩餘金屬填充層</p>  
        <p type="p">276:第一源極/汲極觸點</p>  
        <p type="p">278:第二源極/汲極觸點</p>  
        <p type="p">B:部分</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1175" publication-number="202627753"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627753.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自適應充電系統</chinese-title>  
        <english-title>ADAPTIVE CHARGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G06F1/26</main-classification>  
        <further-classification edition="200601120260323B">G06F1/28</further-classification>  
        <further-classification edition="200601120260323B">G06F13/38</further-classification>  
        <further-classification edition="200601120260323B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪笙科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANNVOLT TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DONG SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳思源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自適應充電系統，包含具控制電路與電源轉換器之充電器，以及設有儲存裝置專屬充電參數之記憶體之電氣裝置。本自適應充電系統主要基於USB Type-C介面，亦可藉由轉接器兼容其他連接型式。充電器之控制電路可先透過專用通訊線自裝置記憶體讀取充電參數；若讀取記憶體失敗，則判斷所連裝置支援標準USB PD協議。所述充電參數可包含目標電壓、電流上限、溫度門檻及安全保護值。充電器可根據不同裝置動態調整輸出，實現自訂充電曲線、軟啟動、過壓／過流／過溫保護及防火花斷開等功能。此自適應充電系統主要是針對具電池之電氣裝置進行直接充電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adaptive charging system is provided, comprising a charger that includes a control circuit and a power converter, and an electrical device that incorporates a memory storing device-specific charging parameters. The system operates chiefly through a USB Type-C interface, while remaining compatible with other connector types by means of adapters. Before charging begins, the control circuit first attempts to obtain the charging parameters from the device memory via a dedicated communication line; if this read operation fails, the charger determines whether the connected device supports the standard USB Power Delivery (PD) protocol and, when applicable, conducts PD power negotiation. The stored parameters may include target voltages, current limits, temperature thresholds, and safety protection values. Based on these parameters, the charger dynamically adjusts its output to deliver a customized charging curve and implements soft-start, over-voltage, over-current, over-temperature, and anti-spark disconnection protection. The adaptive charging system is particularly suited for directly charging battery-powered electrical devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:充電系統</p>  
        <p type="p">100:充電器</p>  
        <p type="p">102:連接器</p>  
        <p type="p">110:電源轉換器</p>  
        <p type="p">112:開關</p>  
        <p type="p">120:控制電路</p>  
        <p type="p">200:電氣裝置</p>  
        <p type="p">202:連接器</p>  
        <p type="p">210:記憶體</p>  
        <p type="p">213:下拉電阻</p>  
        <p type="p">220:控制電路</p>  
        <p type="p">230:電池</p>  
        <p type="p">240:熱敏電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1176" publication-number="202626452"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626452.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124808</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護具及保護對象物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">B65D81/05</main-classification>  
        <further-classification edition="200601120260127B">B65D81/113</further-classification>  
        <further-classification edition="200601120260127B">B65D85/68</further-classification>  
        <further-classification edition="200601120260127B">B65D5/50</further-classification>  
        <further-classification edition="200601120260127B">F25D23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立環球生活方案股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI GLOBAL LIFE SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野謙治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天坂拓人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENSAKA, TAKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種以瓦楞紙板形成之保護具、且為降低彎折部分之復原力、且減小保護對象物本體之露出部分之面積而抑制保護對象物本體之損傷者及將該保護具附設於保護對象物本體之保護對象物。&lt;br/&gt;本發明之保護具係藉由覆蓋具有稜部之保護對象物本體之至少一部分而對保護對象物本體進行保護者，且包含具有孔之瓦楞紙板板材；且孔配置為與瓦楞紙板板材之彎折部重疊；彎折部設置為與保護對象物本體之稜部重疊；孔於對瓦楞紙板板材之平面部在與該平面部正交之方向觀察時，具有形成孔之周之有關瓦楞紙板板材之第一凹部及第一凸部以相鄰之方式連接之形狀，且具有形成孔之周之有關瓦楞紙板板材之第二凸部及第二凹部以相鄰之方式連接之形狀；第一凹部與第二凸部配置為空開構成孔之一部分之間隙地嚙合；第二凹部與第一凸部配置為空開構成孔之一部分之間隙地嚙合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:保護具</p>  
        <p type="p">10f:彎折部</p>  
        <p type="p">20:孔</p>  
        <p type="p">20a:凹部(第一凹部)</p>  
        <p type="p">20b:凸部(第一凸部)</p>  
        <p type="p">20c:凸部(第二凸部)</p>  
        <p type="p">20d:凹部(第二凹部)</p>  
        <p type="p">20e,20f:間隙</p>  
        <p type="p">30:缺口部</p>  
        <p type="p">D:間隔</p>  
        <p type="p">L:長度</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1177" publication-number="202627194"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627194.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基座組件、真空吸盤及薄膜沉積裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C23C16/54</main-classification>  
        <further-classification edition="200601120260318B">C23C16/46</further-classification>  
        <further-classification edition="200601120260318B">C23C16/455</further-classification>  
        <further-classification edition="202601120260318B">H10P72/78</further-classification>  
        <further-classification edition="202601120260318B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊宇峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付海濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔岳俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種基座組件、真空吸盤及薄膜沉積裝置，基座組件包含：真空吸盤，其具有用於承載襯底的承載面，承載面上開設有環形氣槽，環形氣槽上設有真空吸孔，真空吸孔連通真空源，以通過環形氣槽吸附襯底；真空吸盤還開設有容納升降頂針的多個通孔，通孔與環形氣槽彼此設置位置不重合；加熱裝置，其設置於真空吸盤的下方；通孔與環形氣槽之間通過連接通道連通。其優點是：本發明通過連接通道將通孔中攜帶熱量的氣體輸送到環形氣槽中，以疏散通孔中聚集的高溫氣體，從而降低通孔區域的溫度，該方式有助於提升襯底溫度分佈的均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">131:真空吸盤</p>  
        <p type="p">134:通孔</p>  
        <p type="p">137:環形氣槽</p>  
        <p type="p">138:連接通道</p>  
        <p type="p">139:真空吸孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1178" publication-number="202628581"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628581.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124936</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251209B">H10B41/27</main-classification>  
        <further-classification edition="202301120251209B">H10B43/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下城義朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOJO, YOSHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>妹尾駿一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENO, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廉也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAKI, RENYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本實施形態，係有關於半導體記憶裝置及其製造方法。 &lt;br/&gt;　　記憶體，係具備有：第1層積體，係使電極膜與第1絕緣膜交互地在第1方向上被作層積。第2層積體，係與第1層積體相鄰接地而被作設置，並使第1絕緣膜與第2絕緣膜交互地在第1方向上被作層積。第3層積體，係在與第1方向相正交之第1面內而從第1層積體之端部來朝向第2方向延伸，並使電極膜與第1絕緣膜交互地在第1方向上被作層積。第1柱狀體，係包含有於第1方向上貫通第1層積體地而被作設置之半導體層。第1柱狀體，係在自身與電極膜之間之交叉部分處而構成以該電極膜作為閘極電極之複數之記憶體胞。接點，係在第2層積體內或者是第3絕緣膜內，而於第1方向上延伸，並且一直被設置至第3層積體之複數之電極膜之各者之深度處。連接層，係將複數之接點和分別與該些之各者相對應之複數之電極膜之間分別作電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:記憶體胞陣列</p>  
        <p type="p">BLK:區塊</p>  
        <p type="p">DMC:虛設柱狀體</p>  
        <p type="p">Rwlhu:區域</p>  
        <p type="p">Rmc:胞區域</p>  
        <p type="p">51_1:第1層積體</p>  
        <p type="p">51_2:第2層積體</p>  
        <p type="p">51_3:第3層積體</p>  
        <p type="p">ST_WLC,ST_LWI,ST_CELL:細縫</p>  
        <p type="p">26:間隔物</p>  
        <p type="p">27d,27e,27f,27g:連接層</p>  
        <p type="p">CL:柱狀體</p>  
        <p type="p">OP:開口部</p>  
        <p type="p">WLCd,WLCe,WLCf,WLCg:字元線接點</p>  
        <p type="p">ST_CELL:細縫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1179" publication-number="202627801"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627801.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全球跨時區算力調度方法</chinese-title>  
        <english-title>GLOBAL CROSS-TIMEZONE COMPUTING POWER SCHEDULING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G06F9/50</main-classification>  
        <further-classification edition="200601120250801B">G06F9/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣智慧技術研發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN INTELLIGENCE RESEARCH AND DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周允成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳騰瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾舜宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂承哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂芯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林凱鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決如何更有效的利用不同時區的算力資源的問題，本發明提供一種全球跨時區算力調度方法，算力平台執行包括：步驟一、接收至少一個時區的算力需求資訊並儲存於儲存模組；步驟二、根據目標式、限制式令基於啟發式演算法、機器學習演算法或深度學習演算法其中之一的該機器學習模組去計算符合該算力平台之最大化利潤率與稼動率之算力調度方案；步驟三、根據該算力調度方案調度至少一個時區的GPU資源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To address the issue of more efficient utilization of computing resources across different time zones, this invention provides a global cross-time-zone computing power scheduling method. The computing platform performs the following steps:　Receive computing power demand information from at least one time zone and store it in a storage module. According to objective functions and constraints, use the machine learning module, based on the machine learning algorithm, the heuristic algorithm, or deep learning algorithm module to calculate a computing power scheduling plan that maximizes the profitability and utilization rate of the computing platform.　Allocate GPU resources in at least one time zone according to the computing power scheduling plan.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1180" publication-number="202628216"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628216.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125191</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電解液用組成物、電化學裝置、二次電池及鋰離子二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">H01M10/052</main-classification>  
        <further-classification edition="201001120260401B">H01M10/0567</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0568</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0569</further-classification>  
        <further-classification edition="200601120260401B">H01M4/38</further-classification>  
        <further-classification edition="201001120260401B">H01M4/48</further-classification>  
        <further-classification edition="201301120260401B">H01G11/60</further-classification>  
        <further-classification edition="201301120260401B">H01G11/62</further-classification>  
        <further-classification edition="201301120260401B">H01G11/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎穣輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHIGEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷明範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANI, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下岡俊晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOOKA, TOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林奈緒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, NAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供：可提高於高溫保存時之容量維持率之電解液用組成物、以及使用有該電解液用組成物之電化學裝置、二次電池及鋰離子二次電池。本發明係一種電解液用組成物，其含有下述式（E）所表示之氟化醚（E）、及下述式（L）所表示之羧酸鋰鹽（L）。 &lt;br/&gt;（E）Rf&lt;sup&gt; 1&lt;/sup&gt;-O-R &lt;br/&gt;（式中，Rf&lt;sup&gt; 1&lt;/sup&gt;係碳數1～6之氟烷基，R係H或碳數1～6之烷基。R之烷基亦可具有醚鍵及/或氟） &lt;br/&gt;（L）Rf&lt;sup&gt; 2&lt;/sup&gt;-COOLi &lt;br/&gt;（式中，Rf&lt;sup&gt; 2&lt;/sup&gt;係碳數1～6之氟烷基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1181" publication-number="202627538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性菲涅耳透鏡</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G02B3/08</main-classification>  
        <further-classification edition="201501120260323B">G02B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>惣島暢昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOJIMA, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">菲涅耳透鏡1具備基材2、及形成在基材2的至少一側的表面上的線性菲涅耳透鏡構造3。線性菲涅耳透鏡構造3包含：菲涅耳透鏡面4，為複數個並沿著X方向延伸，並且在Y方向上配置排列；及凹凸構造10，形成於上升面5，前述上升面5連接在Y方向上相鄰的菲涅耳透鏡面4、4。凹凸構造10具有複數個凸部12，前述凸部12是在上升面5上沿著X方向以預定的間距P重複設置。凸部12包含：第1擴散面14，連接於在Y方向上相鄰的菲涅耳透鏡面4、4當中的一個之第1菲涅耳透鏡面4的上邊4a，並且相對於XY平面而傾斜；及第2擴散面16，連接另一個第2菲涅耳透鏡面4的下邊4b與第1擴散面14。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:線性菲涅耳透鏡</p>  
        <p type="p">3:線性菲涅耳透鏡構造</p>  
        <p type="p">4:菲涅耳透鏡面</p>  
        <p type="p">4a:上邊</p>  
        <p type="p">4b:下邊</p>  
        <p type="p">5:上升面</p>  
        <p type="p">10:凹凸構造</p>  
        <p type="p">12:凸部</p>  
        <p type="p">14:傾斜擴散面(第1擴散面)</p>  
        <p type="p">15:邊界線</p>  
        <p type="p">16:垂直擴散面(第2擴散面)</p>  
        <p type="p">H:高度</p>  
        <p type="p">P,Py:間距</p>  
        <p type="p">X:X方向</p>  
        <p type="p">Y:Y方向</p>  
        <p type="p">Z:Z方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1182" publication-number="202628971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/00</main-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W20/44</further-classification>  
        <further-classification edition="202501120260302B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王聖璁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒孟桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAO, MENG-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂旻軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MIN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭承珞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHEN-LUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇煥傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體結構的形成方法包括形成多個奈米結構；形成閘極結構於奈米結構上；形成源極/汲極結構以與閘極結構相鄰；形成源極/汲極接點結構於源極/汲極結構上；形成介電層於閘極結構與源極/汲極接點結構上；蝕刻介電層以形成第一開口於閘極結構上並形成第二開口於源極/汲極接點結構上；形成金屬襯墊層於第一開口與第二開口中；移除金屬襯墊層的部分以形成多個金屬襯墊於第一開口與第二開口的底部上；以及沉積導電材料層於金屬襯墊上以填入第一開口與第二開口，而形成第一通孔接點結構於第一開口中並形成第二通孔接點結構於第二開口中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a semiconductor structure includes forming a plurality of nanostructures, forming a gate structure on the nanostructures, forming a source/drain feature adjacent to the gate structure, forming a source/drain contact feature on the source/drain feature, forming a dielectric layer on the gate structure and the source/drain contact feature, etching the dielectric layer to form a first opening on the gate structure and a second opening on the source/drain contact feature, forming a metal liner layer in the first opening and the second opening, removing portion of the metal liner layer to form metal liners on bottoms of the first opening and the second opening, and depositing a conductive material layer on the metal liners to fill the first opening and the second opening to form a first via contact feature in the first opening and a second via contact feature in the second opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:全繞式閘極裝置</p>  
        <p type="p">202:基板</p>  
        <p type="p">208C:通道奈米結構</p>  
        <p type="p">210B:基底部分</p>  
        <p type="p">226:閘極間隔物</p>  
        <p type="p">234:內側間隔物</p>  
        <p type="p">240:源極/汲極結構</p>  
        <p type="p">250:層間介電層</p>  
        <p type="p">260:閘極結構</p>  
        <p type="p">262:界面層</p>  
        <p type="p">264:閘極介電層</p>  
        <p type="p">266:閘極</p>  
        <p type="p">272:矽化物結構</p>  
        <p type="p">274:源極/汲極接點結構</p>  
        <p type="p">278:接點蝕刻停止層</p>  
        <p type="p">280,296:接點層的介電層</p>  
        <p type="p">286L:金屬襯墊</p>  
        <p type="p">292A,292B,292C,294A,294B,294C:接點結構</p>  
        <p type="p">297:擴散阻障層</p>  
        <p type="p">299:導電插塞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1183" publication-number="202628284"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628284.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同軸電連接器及電連接器組裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260317B">H01R24/38</main-classification>  
        <further-classification edition="200601120260317B">H01R9/05</further-classification>  
        <further-classification edition="200601120260317B">H01R13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商廣瀨電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSE ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川毅史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相原理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIHARA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] &lt;br/&gt;　　提供一種能夠良好地避免在連接器連接方向上的大型化的同軸電連接器及電連接器組裝體。 &lt;br/&gt;[解決手段] &lt;br/&gt;　　彈性體(70)，可將彈性力賦予前方推壓部(56)及後方推壓部(61A)，使耦合構件(50)處於前進位置及後退位置之間的中立位置，耦合構件(50)，具有從該耦合構件(50)的內周面突出的中間突部(51)，在中間突部(51)的前方與殼體構件(10)的外周面之間形成前方空間(53)，並且在中間突部(51)的後方與殼體構件(10)的外周面之間形成後方空間(55)，球構件(80)能夠藉由孔部(11)的內周緣限制在前後方向的移動，並且能夠在連接器(1)的徑方向上移動，能夠藉由從孔部(11)朝徑方向內側突出的一部分與設置於對象連接器(2)的卡止部(152A-1)卡止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接器</p>  
        <p type="p">1A:連接器本體</p>  
        <p type="p">1B:纜線安裝部</p>  
        <p type="p">2:對象連接器</p>  
        <p type="p">2A:端凹部</p>  
        <p type="p">10:殼體構件</p>  
        <p type="p">10A:前方筒部</p>  
        <p type="p">10A-1:外嵌合部</p>  
        <p type="p">10B:中間筒部</p>  
        <p type="p">10C:後方筒部</p>  
        <p type="p">10D:前方內部空間</p>  
        <p type="p">10D-1:承接空間</p>  
        <p type="p">10E:中間內部空間</p>  
        <p type="p">10F:後方內部空間</p>  
        <p type="p">10G:容納空間</p>  
        <p type="p">11:孔部</p>  
        <p type="p">12:階梯部</p>  
        <p type="p">13:定位部</p>  
        <p type="p">13A:小突部</p>  
        <p type="p">14:前方支撐部</p>  
        <p type="p">15:後方支撐部</p>  
        <p type="p">16:抵接部</p>  
        <p type="p">20:外部導體</p>  
        <p type="p">21:後部</p>  
        <p type="p">22:前部</p>  
        <p type="p">30:介電體</p>  
        <p type="p">31:後部</p>  
        <p type="p">32:前部</p>  
        <p type="p">32A:內嵌合部</p>  
        <p type="p">40:中心導體</p>  
        <p type="p">41:連接部</p>  
        <p type="p">42:接觸部</p>  
        <p type="p">43:連結部</p>  
        <p type="p">50:耦合構件</p>  
        <p type="p">51:中間突部</p>  
        <p type="p">52:前方突部</p>  
        <p type="p">53:前方空間</p>  
        <p type="p">54:後方突部</p>  
        <p type="p">55:後方空間</p>  
        <p type="p">56:前方推壓部</p>  
        <p type="p">60:後方推壓部</p>  
        <p type="p">61:筒狀部</p>  
        <p type="p">61A:後方推壓部</p>  
        <p type="p">62:伸出部</p>  
        <p type="p">70:彈性體</p>  
        <p type="p">71:彈簧構件</p>  
        <p type="p">72:前方環</p>  
        <p type="p">73:後方環</p>  
        <p type="p">80:球構件</p>  
        <p type="p">90:夾具</p>  
        <p type="p">91:階梯部</p>  
        <p type="p">100:橡膠環</p>  
        <p type="p">110:墊圈</p>  
        <p type="p">120:緊固件</p>  
        <p type="p">130:介在環</p>  
        <p type="p">140:介在墊片</p>  
        <p type="p">150:對象外部導體</p>  
        <p type="p">151:基部</p>  
        <p type="p">152:筒狀部</p>  
        <p type="p">152A:對象外嵌合部</p>  
        <p type="p">152A-1:卡止部</p>  
        <p type="p">152B:定位突部</p>  
        <p type="p">152C:階梯部</p>  
        <p type="p">153:承接空間</p>  
        <p type="p">160:對象介電體</p>  
        <p type="p">161:中間筒部</p>  
        <p type="p">161A:階梯部</p>  
        <p type="p">162:對象內嵌合部</p>  
        <p type="p">163:延出部</p>  
        <p type="p">170:對象中心導體</p>  
        <p type="p">171:對象連接部</p>  
        <p type="p">172:對象接觸部</p>  
        <p type="p">173:對象連結部</p>  
        <p type="p">180:止動環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1184" publication-number="202628696"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628696.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像感測裝置及包括其的成像系統</chinese-title>  
        <english-title>IMAGE SENSING DEVICE AND IMAGING SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250709B">H10F30/225</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張在亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAE HYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了影像感測裝置和成像系統。在實施方式中，一種影像感測裝置包括：第一像素組和第二像素組，第一像素組和第二像素組中的每一個包括第一像素和第二像素，第一像素包括具有第一區域尺寸的第一有源區域，第二像素包括具有小於第一區域尺寸的第二區域尺寸的第二有源區域。第一像素和第二像素中的每一個可以包括雪崩二極體、設置在雪崩二極體上的抗反射層以及設置在抗反射層上的光接收圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Image sensing devices and imaging systems are disclosed. In an embodiment, an image sensing device includes: a first pixel group and a second pixel group, each of which includes a first pixel including a first active region with a first region size and a second pixel including a second active region with a second region size smaller than the first region size. Each of the first pixel and the second pixel may include an avalanche diode, an antireflective layer disposed on the avalanche diode, and a light receiving pattern disposed on the antireflective layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:成像系統</p>  
        <p type="p">100:影像感測裝置</p>  
        <p type="p">110:像素陣列</p>  
        <p type="p">120:像素驅動器</p>  
        <p type="p">130:時序控制器</p>  
        <p type="p">140:光源驅動器</p>  
        <p type="p">150:讀出電路</p>  
        <p type="p">200:影像訊號處理器</p>  
        <p type="p">300:光感測器</p>  
        <p type="p">d:預定距離</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">L1:第一光束</p>  
        <p type="p">L2:第二光束</p>  
        <p type="p">LM:光接收圖案</p>  
        <p type="p">LS:光源</p>  
        <p type="p">MLS:參考脈衝訊號</p>  
        <p type="p">SP:像素</p>  
        <p type="p">TO:目標物體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1185" publication-number="202628983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10W20/44</main-classification>  
        <further-classification edition="202601120260316B">H10P14/24</further-classification>  
        <further-classification edition="200601120260316B">H05H1/24</further-classification>  
        <further-classification edition="200601120260316B">C23C16/34</further-classification>  
        <further-classification edition="200601120260316B">C23C16/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元京勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WON, GYEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種在基板上形成電子裝置的方法包含在基板上噴射含有III族元素的氣體的步驟，透過在基板上噴射含有V族元素的氣體並形成含有氮元素的第一電漿來形成含有III-V族元素的第一層的步驟，以及在含有III-V族元素的第一層上形成含有氮元素的第二電漿的步驟，其中第一電漿不包含氫原子，及由上述方法製造的電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of forming an electronic device on a substrate comprising a step of injecting a gas containing a Group III element on the substrate, a step of forming a first layer containing a Group III-V element by injecting a gas containing a Group V element onto the substrate and forming a first plasma containing a nitrogen element, and a step of forming a second plasma containing a nitrogen element on the first layer containing the Group III-V element, wherein the first plasma does not include a hydrogen atom, and an electronic device manufactured by the above method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">110:第一層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1186" publication-number="202627863"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627863.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體設計系統及半導體設計方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260202B">G06F30/30</main-classification>  
        <further-classification edition="202001120260202B">G06F30/337</further-classification>  
        <further-classification edition="202001120260202B">G06F30/398</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPIDUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本通高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, MICHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體設計系統，係取得由客戶所設計的半導體之設計資料，並基於所取得的設計資料，來得到用以製造半導體之半導體設計資料。半導體設計系統，係具備有：製造條件最佳化部，係取得由客戶所設計之設計資料，並得到進行了製造條件最佳化後之設計資料；和設計環境最佳化處理部，係取得藉由製造條件最佳化部而被進行了製造條件最佳化之設計資料，並得到進行了設計環境最佳化之變更內容資料，並且將所得到的變更內容資料對於客戶作送訊，該半導體設計系統，係構成為從客戶來取得基於變更內容資料而被進行了變更之設計資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:客戶(設計者)</p>  
        <p type="p">101:第1半導體設計部</p>  
        <p type="p">102:第2半導體設計部</p>  
        <p type="p">200:晶圓代工廠(製造者)</p>  
        <p type="p">201:製造條件最佳化部</p>  
        <p type="p">202:設計環境最佳化部</p>  
        <p type="p">203:半導體製造裝置</p>  
        <p type="p">204:巨量資料(big data)</p>  
        <p type="p">D1,D2,D4:設計資料</p>  
        <p type="p">D3:變更內容資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1187" publication-number="202626757"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626757.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>著色硬化性樹脂組成物、彩色濾光片、顯示裝置、及固體攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08F2/44</main-classification>  
        <further-classification edition="200601120260325B">C08F265/06</further-classification>  
        <further-classification edition="200601120260325B">C09B11/28</further-classification>  
        <further-classification edition="200601120260325B">C09B35/03</further-classification>  
        <further-classification edition="200601120260325B">C09B67/20</further-classification>  
        <further-classification edition="200601120260325B">C09B67/22</further-classification>  
        <further-classification edition="200601120260325B">C09B67/46</further-classification>  
        <further-classification edition="200601120260325B">G03F7/004</further-classification>  
        <further-classification edition="200601120260325B">G03F7/027</further-classification>  
        <further-classification edition="200601120260325B">G03F7/031</further-classification>  
        <further-classification edition="200601120260325B">G03F7/038</further-classification>  
        <further-classification edition="200601120260325B">G02B5/20</further-classification>  
        <further-classification edition="200601120260325B">G02B5/22</further-classification>  
        <further-classification edition="200601120260325B">G02F1/1335</further-classification>  
        <further-classification edition="200601120260325B">G09F9/30</further-classification>  
        <further-classification edition="202301120260325B">H10K59/10</further-classification>  
        <further-classification edition="202301120260325B">H10K59/38</further-classification>  
        <further-classification edition="202301120260325B">H10K85/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>幸則孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKI, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種能夠降低彩色濾光片的串擾的著色硬化性樹脂組成物。本發明是有關於一種著色硬化性樹脂組成物，含有著色劑、樹脂、聚合性化合物及聚合起始劑，著色劑包含C.I.顏料黃185、氧雜蒽色素、以及選自由紅色顏料及橙色顏料所組成的群組中的至少一種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1188" publication-number="202627660"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627660.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>極紫外光光罩、反射性光罩及其製造方法</chinese-title>  
        <english-title>EUV PHOTOMASK, REFLECTIVE PHOTOMASK AND NUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251127B">G03F1/24</main-classification>  
        <further-classification edition="201201120251127B">G03F1/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛文章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, WEN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥巽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAN-SYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造光罩的方法包括在基板之上形成反射性多層堆疊，及在反射性多層堆疊之上形成封蓋層。在封蓋層之上形成吸收層，且在吸收層之上形成硬罩幕。在硬罩幕中形成開口，以曝光吸收層。使用硬罩幕作為蝕刻罩幕來蝕刻吸收層。蝕刻吸收層包括將第一蝕刻氣體施加至吸收層；接通偏壓功率及源功率；關斷偏壓功率及源功率；將第二蝕刻氣體施加至吸收層，其中第一蝕刻氣體及第二蝕刻氣體係不同的；及接通源功率而不接通偏壓功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a photomask includes forming a reflective multilayer stack over a substrate and forming a capping layer over the reflective multilayer stack. An absorber layer is formed over the capping layer and a hard mask is formed over the absorber layer. An opening is formed in the hard mask exposing the absorber layer. The absorber layer is etched using the hard mask as an etching mask. The etching the absorber layer includes applying a first etching gas to the absorber layer, turning on a bias power and a source power, turning off the bias power and the source power, applying a second etching gas to the absorber layer, wherein the first etching gas and the second etching gas are different, and turning on the source power without turning on the bias power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:多層Mo/Si堆疊，Mo/Si多層堆疊，多層堆疊</p>  
        <p type="p">20:封蓋層</p>  
        <p type="p">22:保護層</p>  
        <p type="p">25:吸收層</p>  
        <p type="p">42:圖案</p>  
        <p type="p">65:蝕刻副產物側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1189" publication-number="202628972"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628972.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/00</main-classification>  
        <further-classification edition="202501120260302B">H10D30/01</further-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　沛樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, OLIVIA PEI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王菘豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃治融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JHIH-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹　敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括提供一種結構。此結構包括具有通道區及相鄰於通道區的源極/汲極區的主動區、在通道區上方的閘極結構、在源極/汲極區上方的源極/汲極特徵、在源極/汲極特徵上方的接觸蝕刻終止層(CESL)、及在CESL上方的層間介電(ILD)層。此方法進一步包括在CESL及ILD層中形成溝槽以曝露源極/汲極特徵，在溝槽中提供金屬前驅物及磷源，從而在源極/汲極特徵上方形成金屬磷化物層，在金屬磷化物層上方形成矽化物層，及在溝槽中形成金屬填充層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes providing a structure. The structure includes an active region having a channel region and a source/drain region adjacent to the channel region, a gate structure over the channel region, a source/drain feature over the source/drain region, a contact etch stop layer (CESL) over the source/drain feature, and an interlayer dielectric (ILD) layer over the CESL. The method further includes forming a trench in the CESL and the ILD layer to expose the source/drain feature, providing a metal precursor and a phosphorus source in the trench, thereby forming a metal phosphide layer over the source/drain feature, forming a silicide layer on the metal phosphide layer, and forming a metal fill layer in the trench.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:結構、半導體結構、半導體裝置、前驅物結構</p>  
        <p type="p">218B:底部源極/汲極特徵</p>  
        <p type="p">218T:頂部源極/汲極特徵、上覆頂部源極/汲極特徵、源極/汲極特徵、原始源極/汲極特徵</p>  
        <p type="p">266:第一矽化物層</p>  
        <p type="p">268:金屬磷化物層</p>  
        <p type="p">268':金屬磷化物殘留層</p>  
        <p type="p">270:第二矽化物層</p>  
        <p type="p">270':金屬矽化物殘留層</p>  
        <p type="p">272:金屬襯墊</p>  
        <p type="p">274':源極/汲極觸點插座</p>  
        <p type="p">276:源極/汲極觸點</p>  
        <p type="p">276-1:第一源極/汲極觸點</p>  
        <p type="p">276-2:第二源極/汲極觸點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1190" publication-number="202628569"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628569.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林漢鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HANJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體記憶體裝置包括：一基體，其具有一上表面；一作用區，其與該基體在垂直於該基體之該上表面之一垂直方向上間隔開，且在平行於該基體之該上表面之一第一側向方向上延伸；一字元線，其至少部分環繞該作用區，且在平行於該基體之該上表面且垂直於該第一側向方向之一第二側向方向上延伸；一電容器，其包括連接至該作用區之一第一電極；以及一絕緣環，其在該第一側向方向上從該電容器之該第一電極朝向該字元線突出，該絕緣環環繞該作用區之一部分且包括一金屬元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device includes a substrate having an upper surface; an active region spaced apart from the substrate in a vertical direction that is perpendicular to the upper surface of the substrate, and extending in a first lateral direction that is parallel to the upper surface of the substrate; a word line at least partially surrounding the active region and extending in a second lateral direction that is parallel to the upper surface of the substrate and perpendicular to the first lateral direction; a capacitor including a first electrode connected to the active region; and an insulating loop protruding from the first electrode of the capacitor toward the word line in the first lateral direction, the insulating loop surrounding a portion of the active region and including a metal element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體記憶體裝置</p>  
        <p type="p">106A:通道區</p>  
        <p type="p">129:絕緣結構</p>  
        <p type="p">130:閘極介電膜</p>  
        <p type="p">172:絕緣襯裡</p>  
        <p type="p">173:隱埋絕緣膜</p>  
        <p type="p">174S:氧化物襯裡</p>  
        <p type="p">184:金屬矽化物膜</p>  
        <p type="p">186:第一電極</p>  
        <p type="p">187:介電膜</p>  
        <p type="p">187P:突出部</p>  
        <p type="p">188:第二電極</p>  
        <p type="p">190:板電極</p>  
        <p type="p">190A:中心部分</p>  
        <p type="p">190B:指狀部分</p>  
        <p type="p">AC:作用區</p>  
        <p type="p">BC:隱埋接點</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CAP:電容器</p>  
        <p type="p">DC:直接接點</p>  
        <p type="p">EX1:部分區</p>  
        <p type="p">EX1A:部分</p>  
        <p type="p">STL:含金屬絕緣環</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">X:第一側向方向、方向</p>  
        <p type="p">Y:第二側向方向、方向</p>  
        <p type="p">Y2-Y2',Y3-Y3':線</p>  
        <p type="p">Z:垂直方向、方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1191" publication-number="202627819"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627819.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251107B">G06F12/10</main-classification>  
        <further-classification edition="200601120251107B">G06F12/02</further-classification>  
        <further-classification edition="200601120251107B">G11C11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥田浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUDA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅野伸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANNO, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和泉樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUMI, TATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實現一種可抑制對非揮發性記憶體的存取性能的降低的記憶體系統。根據實施形態，記憶體系統包括分別包含多個第一區塊的多個記憶體晶片以及控制器。控制器將對多個記憶體晶片的並行存取以多個並行存取單元進行控制。各並行存取單元中所含的多個第二區塊分別為自各記憶體晶片中逐個分配的多個第一區塊內的1個。控制器對規定成各並行存取單元內的初期不良區塊的數量為容許數以下的每個記憶體晶片的轉換資訊進行管理。控制器對應於各並行存取單元而生成表示各再構成並行存取單元內的不良區塊的數量是否為容許數以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">53A、53B、53C、53D:管理表</p>  
        <p type="p">600、601、602、603:再構成超級區塊</p>  
        <p type="p">CHIP#0、CHIP#1、CHIP#2~CHIP#N-2、CHIP#N-1:記憶體晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1192" publication-number="202627235"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627235.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125711</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C25D7/12</main-classification>  
        <further-classification edition="200601120260302B">H05K3/42</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZU-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾嘉平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIA-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范俊欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, CHUN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置及其製造方法。電子裝置的製造方法包括：提供基板；形成通孔貫穿基板；提供晶種層，且晶種層延伸至通孔中；進行第一次鍍膜步驟以形成第一鍍膜在晶種層的表面上，且第一鍍膜填充通孔的一部分；以及進行第二次鍍膜步驟以形成第二鍍膜在晶種層的一部分的表面上，第二鍍膜填充通孔的另一部分，且第二鍍膜連接第一鍍膜。其中，第一次鍍膜步驟使用的電流密度大於第二次鍍膜步驟使用的電流密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes: providing a substrate; forming a through hole penetrating the substrate; providing a seed layer, the seed layer extending into the through hole; performing a first coating step to form a fist coating on a surface of the seed layer, the first coating filling a portion of the through hole; and performing a second coating step to form a second coating on a portion of the surface of the seed layer, the second coating filling another portion of the through hole and connected to the first coating. A current density used in the first coating step is greater than a current density used in the second coating step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S200,S300,S400,S500,S310,S410,S510:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1193" publication-number="202627951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實行Ａ／Ｂ測試之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR PERFORMING A/B TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120260202B">G06Q10/087</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, HYUNJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之裝置可包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；且上述裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：獲得指示藉由第1商品頁面而產生之第1用戶組之第1商品之銷售量的第1資訊；獲得指示藉由第2商品頁面而而產生之第2用戶組之上述第1商品之銷售量的第2資訊；基於上述第1用戶組及上述第2用戶組之上述第1商品之銷售量之間的比較結果，確定向如下用戶顯示上述第1商品之資訊之第3類型，該用戶係屬於上述第2用戶組之用戶中之屬於第1子組者；產生用以展露第3商品頁面之第3展露資訊，該第3商品頁面係根據上述第3類型而顯示上述第1商品之資訊者；將上述第3展露資訊傳輸至屬於上述第1子組之用戶之用戶終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p>  
        <p type="p">S340:步驟</p>  
        <p type="p">S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1194" publication-number="202627064"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627064.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125929</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用於去除硬化光阻劑之合理化溶劑組成</chinese-title>  
        <english-title>RATIONAL SOLVENT FORMULATION FOR CURED PHOTORESIST REMOVAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C11D7/32</main-classification>  
        <further-classification edition="200601120260330B">C11D7/50</further-classification>  
        <further-classification edition="200601120260330B">G03F7/42</further-classification>  
        <further-classification edition="200601120260330B">C11D1/72</further-classification>  
        <further-classification edition="202601120260330B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宇耕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU GENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, ZHI JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種配製成可溶解半導體表面上之硬化光阻劑的溶劑組成物。 &lt;br/&gt;　　該溶劑組成物含有約1～30質量%之至少1種鏈烷醇胺、約10～95質量%之至少1種乙二醇醚，及0～約1質量%之N,N-二取代羥胺。N,N-二取代羥胺係依據至少1種鏈烷醇胺而選擇。具體而言，N,N-二取代羥胺係於含有N-甲基二乙醇胺之任意溶劑組成物中由鏈烷醇進行取代。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solvent composition formulated to dissolve cured photoresist on a semiconductor surface comprises about 1 to 30% by mass of at least one alkanolamine; about 10 to 95% by mass of at least one ethylene glycol ether; and zero to about 1% by mass of an N,N-disubstituted hydroxylamine. The N,N-disubstituted hydroxylamine is selected based on the at least one alkanolamine. In particular, the N,N-disubstituted hydroxylamine is alkanol-substituted in any solvent composition comprising N-methyldiethanolamine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">602:半導體表面</p>  
        <p type="p">604:圖型</p>  
        <p type="p">606:銅(Cu)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1195" publication-number="202626522"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626522.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自混合鎳源之鋰鎳氧化物合成</chinese-title>  
        <english-title>LITHIUM NICKEL OXIDE SYNTHESIS FROM MIXED NICKEL SOURCES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260331B">C01G53/42</main-classification>  
        <further-classification edition="201001120260331B">H01M4/131</further-classification>  
        <further-classification edition="201001120260331B">H01M4/525</further-classification>  
        <further-classification edition="201001120260331B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞比馬利股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBEMARLE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁諾里奇　安德魯Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINOLICH, ANDREW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　吟之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YINZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案係關於生產鋰鎳氧化物(Li&lt;sub&gt;2&lt;/sub&gt;NiO&lt;sub&gt;2&lt;/sub&gt;)及其陽離子及/或陰離子該鋰鎳氧化物(Li&lt;sub&gt;2&lt;/sub&gt;NiO&lt;sub&gt;2&lt;/sub&gt;)可藉由以下操作來生產：將鋰源與第一鎳源及不同於該第一鎳源之第二鎳源混合；及加熱該混合物，由此由該鋰源與該第一鎳源及該第二鎳源之間的反應來生產包含Li&lt;sub&gt;2&lt;/sub&gt;NiO&lt;sub&gt;2&lt;/sub&gt;之產物粉末。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is directed to systems and methods of producing lithium nickel oxide (Li&lt;sub&gt;2&lt;/sub&gt;NiO&lt;sub&gt;2&lt;/sub&gt;) and cation and/or anion doped counterparts thereof. The lithium nickel oxide (Li&lt;sub&gt;2&lt;/sub&gt;NiO&lt;sub&gt;2&lt;/sub&gt;) can be produced by mixing a lithium source with a first nickel source and a second nickel source different from the first nickel source; and heating the mixture, thereby producing a product powder comprising Li&lt;sub&gt;2&lt;/sub&gt;NiO&lt;sub&gt;2&lt;/sub&gt; from the reaction between the lithium source with the first and second nickel sources.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1196" publication-number="202626339"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626339.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層光學薄膜及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">B32B7/02</main-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">C09J133/00</further-classification>  
        <further-classification edition="200601120251201B">C09J4/00</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G09F9/33</further-classification>  
        <further-classification edition="202301120251201B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三木慎太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積層光學薄膜，係透過接著劑層至少積層有碘系偏光件及光學薄膜者；其中，接著劑層為碘系偏光件側之第1接著劑層與光學薄膜側之第2接著劑層的2層結構；第1接著劑層係以第1接著劑組成物的第1硬化物層形成，且第1接著劑組成物所含有之單體成分利用莫耳分率之加權平均所得之表示辛醇/水分配係數之logPow為2.5以上；並且，第2接著劑層係以第2接著劑組成物的第2硬化物層形成，且第2接著劑組成物所含有之單體成分利用莫耳分率之加權平均所得之表示辛醇/水分配係數之logPow小於2.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:影像顯示裝置</p>  
        <p type="p">1:碘系偏光件</p>  
        <p type="p">2:相位差薄膜</p>  
        <p type="p">3:接著劑層</p>  
        <p type="p">31:第1接著劑層</p>  
        <p type="p">32:第2接著劑層</p>  
        <p type="p">4:黏著劑層</p>  
        <p type="p">5:第3接著劑層</p>  
        <p type="p">6:透明保護薄膜</p>  
        <p type="p">7:有機發光二極體面板</p>  
        <p type="p">10:積層光學薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1197" publication-number="202626977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二次電池及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C09C1/48</main-classification>  
        <further-classification edition="201001120260319B">H01M10/0525</further-classification>  
        <further-classification edition="201001120260319B">H01M10/0562</further-classification>  
        <further-classification edition="200601120260319B">H01M4/70</further-classification>  
        <further-classification edition="200601120260319B">C25B1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狩野巌大郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANO, GENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大谷拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTANI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池尻純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEJIRI, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姫井久美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMEI, KUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種生產性優異、且不易於正極側集電構件與負極側集電構件之間產生短路之二次電池。 &lt;br/&gt;一種二次電池1，其係具備具有正極層6、負極層7及固態電解質層5之蓄電元件2、正極側集電體層3、及負極側集電體層4之全固態電池；且於俯視時，正極層6及負極層7之外周緣6a、7a配置於較固態電解質層5之外周緣5a靠內側；於俯視時，正極側集電體層3具備配置於較固態電解質層5之外周緣5a靠內側之正極側集電體本體部8、與自正極側集電體本體部8之端面8b突出之正極側集電體突出部9，正極側集電體突出部9具有以與固態電解質層5之端面5b對齊之方式配置之正極側集電體突出端面9a；於俯視時，負極側集電體層4具備配置於較固態電解質層5之外周緣5a靠內側之負極側集電體本體部10、與自負極側集電體本體部10之端面10b突出之負極側集電體突出部11，負極側集電體突出部11具有以與固態電解質層5之端面5b對齊之方式配置之負極側集電體突出端面11a；於俯視時，正極側集電體突出端面9a與負極側集電體突出端面11a不具有重疊部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:二次電池</p>  
        <p type="p">2:蓄電元件</p>  
        <p type="p">3:正極側集電體層</p>  
        <p type="p">4:負極側集電體層</p>  
        <p type="p">5:固態電解質層</p>  
        <p type="p">5a,6a,7a,8a,10a:外周緣</p>  
        <p type="p">5b,8b,10b:端面</p>  
        <p type="p">6:正極層</p>  
        <p type="p">7:負極層</p>  
        <p type="p">8:正極側集電體主體部</p>  
        <p type="p">8c,10c:角部</p>  
        <p type="p">9:正極側集電體突出部</p>  
        <p type="p">9a:正極側集電體突出端面</p>  
        <p type="p">9b,11b:連接端面</p>  
        <p type="p">10:負極側集電體本體部</p>  
        <p type="p">11:負極側集電體突出部</p>  
        <p type="p">11a:負極側集電體突出端面</p>  
        <p type="p">12A:正極側集電體定位構件</p>  
        <p type="p">12B:負極側集電體定位構件</p>  
        <p type="p">13,14:極耳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1198" publication-number="202628748"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628748.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層光學薄膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251220B">H10K50/00</main-classification>  
        <further-classification edition="200601120251220B">B32B27/30</further-classification>  
        <further-classification edition="200601120251220B">G09F9/00</further-classification>  
        <further-classification edition="200601120251220B">G02B5/30</further-classification>  
        <further-classification edition="200601120251220B">H05B33/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三木慎太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積層光學薄膜之製造方法，包含以下步驟：照射步驟，係對第1光學薄膜之自由基聚合性硬化性組成物之塗敷面照射活性能量線，將自由基聚合性硬化性組成物之至少一部分硬化，藉此製造第1光學薄膜上積層有機能層之附機能層之第1光學薄膜；貼合步驟，係貼合附機能層之第1光學薄膜之機能層面及第2光學薄膜之接著劑組成物之塗敷面；及，接著步驟，係從附機能層之第1光學薄膜側或第2光學薄膜側照射活性能量線，使至少接著劑組成物硬化藉此形成接著劑層，並透過前述接著劑層使附機能層之第1光學薄膜及前述第2光學薄膜接著。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:影像顯示裝置</p>  
        <p type="p">1:碘系偏光件</p>  
        <p type="p">2:障壁層</p>  
        <p type="p">3:接著劑層</p>  
        <p type="p">4:相位差薄膜</p>  
        <p type="p">5:黏著劑層</p>  
        <p type="p">6:第2接著劑層</p>  
        <p type="p">7:透明保護薄膜</p>  
        <p type="p">8:有機發光二極體面板</p>  
        <p type="p">10:積層光學薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1199" publication-number="202626346"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626346.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層光學薄膜及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B32B7/12</main-classification>  
        <further-classification edition="200601120251201B">C08F220/18</further-classification>  
        <further-classification edition="200601120251201B">C08F220/28</further-classification>  
        <further-classification edition="200601120251201B">C08F220/40</further-classification>  
        <further-classification edition="200601120251201B">C08F220/58</further-classification>  
        <further-classification edition="200601120251201B">C08F222/10</further-classification>  
        <further-classification edition="200601120251201B">C09J4/00</further-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三木慎太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇秀太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKI, SHUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積層光學薄膜，係透過接著劑層至少積層有碘系偏光件及光學薄膜者；接著劑層係至少含有(甲基)丙烯酸酯化合物及光聚合引發劑之接著劑組成物的硬化物層；接著劑組成物為令前述(甲基)丙烯酸酯化合物之總量為100質量份時，含有70質量份以上之分子內具有環狀烴骨架之(甲基)丙烯酸酯(A)者。(甲基)丙烯酸酯(A)宜為構成分子內具有之環狀烴骨架之碳數為5~12之化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:影像顯示裝置</p>  
        <p type="p">1:碘系偏光件</p>  
        <p type="p">2:光學薄膜(相位差薄膜)</p>  
        <p type="p">3:接著劑層</p>  
        <p type="p">4:黏著劑層</p>  
        <p type="p">5:第2接著劑層</p>  
        <p type="p">6:透明保護薄膜</p>  
        <p type="p">7:有機發光二極體面板</p>  
        <p type="p">10:積層光學薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1200" publication-number="202626342"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626342.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125955</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層光學薄膜及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260212B">B32B7/023</main-classification>  
        <further-classification edition="200601120260212B">B32B7/12</further-classification>  
        <further-classification edition="201801120260212B">C09J7/30</further-classification>  
        <further-classification edition="200601120260212B">C09J9/00</further-classification>  
        <further-classification edition="200601120260212B">G02B5/30</further-classification>  
        <further-classification edition="202301120260212B">H10K77/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三木慎太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇秀太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKI, SHUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積層光學薄膜，其係透過接著劑層至少積層有碘系偏光件及光學薄膜者；接著劑層係至少含有(甲基)丙烯酸酯化合物及光聚合引發劑之接著劑組成物的硬化物層；硬化物層在60℃-90%濕度下之儲存彈性模數為1.0×10&lt;sup&gt;8&lt;/sup&gt;Pa以上，且透濕度為150g/m&lt;sup&gt;2&lt;/sup&gt;・24小時以下。硬化物層在相對濕度90%下之玻璃轉移點宜為65℃以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:影像顯示裝置</p>  
        <p type="p">1:碘系偏光件</p>  
        <p type="p">2:光學薄膜(相位差薄膜)</p>  
        <p type="p">3:接著劑層</p>  
        <p type="p">4:黏著劑層</p>  
        <p type="p">5:第2接著劑層</p>  
        <p type="p">6:透明保護薄膜</p>  
        <p type="p">7:有機發光二極體面板</p>  
        <p type="p">10:積層光學薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1201" publication-number="202626771"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626771.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附機能層之光學薄膜之製造方法及積層光學薄膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C08F2/50</main-classification>  
        <further-classification edition="201801120260317B">C09J7/22</further-classification>  
        <further-classification edition="200601120260317B">G02B5/30</further-classification>  
        <further-classification edition="200601120260317B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三木慎太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種附機能層之光學薄膜之製造方法，前述附機能層之光學薄膜係光學薄膜上積層有機能層者；前述附機能層之光學薄膜之製造方法係具有以下步驟者：塗敷步驟，係於光學薄膜塗敷自由基聚合性硬化性組成物；及，照射步驟，係對光學薄膜之自由基聚合性硬化性組成物之塗敷面照射活性能量線，藉此將自由基聚合性硬化性組成物之至少一部分硬化；照射步驟係一在氧濃度為5%以上之氣體環境下照射活性能量線之步驟；自由基聚合性硬化性組成物係含有選自於由胺系光聚合引發劑及硫醇化合物所構成群組中之至少1種者；且，機能層之厚度小於5µm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:影像顯示裝置</p>  
        <p type="p">1:碘系偏光件</p>  
        <p type="p">2:障壁層</p>  
        <p type="p">3:接著劑層</p>  
        <p type="p">4:相位差薄膜</p>  
        <p type="p">5:黏著劑層</p>  
        <p type="p">6:第2接著劑層</p>  
        <p type="p">7:透明保護薄膜</p>  
        <p type="p">8:有機發光二極體面板</p>  
        <p type="p">10:積層光學薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1202" publication-number="202626858"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626858.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G65/48</main-classification>  
        <further-classification edition="200601120260401B">C08L71/10</further-classification>  
        <further-classification edition="200601120260401B">C08K5/12</further-classification>  
        <further-classification edition="200601120260401B">C08K5/1575</further-classification>  
        <further-classification edition="201801120260401B">C08K3/013</further-classification>  
        <further-classification edition="200601120260401B">C08J3/20</further-classification>  
        <further-classification edition="200601120260401B">B32B27/20</further-classification>  
        <further-classification edition="200601120260401B">B32B27/28</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滑方奈那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMEKATA, NANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中沢正和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZAWA, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是提供帶來顯示優異的介電特性及優異的密合性的固化物的樹脂組成物。本發明的解决手段是一種樹脂組成物，其含有：(1A)具有下述式(A-1)所示的結構單元和下述式(A-2)所示的結構單元的自由基聚合系樹脂、(B)液態固化劑、以及(C)無機填充材料。 &lt;br/&gt;&lt;img align="absmiddle" height="114px" width="377px" file="ed10083.JPG" alt="ed10083.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(A-1)及式(A-2)中，R&lt;sup&gt;1&lt;/sup&gt;各自獨立地為以選自碳原子、氫原子、氧原子、氮原子、矽原子和硫原子中的原子作為構成原子的一價有機基，並且R&lt;sup&gt;1&lt;/sup&gt;具有自由基聚合系官能基，R&lt;sup&gt;1&lt;/sup&gt;所具有的芳香環為2個以下，A各自獨立地表示具有亦可被氫化的雙酚骨架的二價有機基)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1203" publication-number="202628025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及顯示裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G09F9/00</main-classification>  
        <further-classification edition="200601120260323B">G09F9/40</further-classification>  
        <further-classification edition="200601120260323B">G02B3/00</further-classification>  
        <further-classification edition="200601120260323B">G02B3/06</further-classification>  
        <further-classification edition="200601120260323B">G02B3/08</further-classification>  
        <further-classification edition="201601120260323B">F21S2/00</further-classification>  
        <further-classification edition="201801120260323B">F21V5/00</further-classification>  
        <further-classification edition="200601120260323B">F21V5/04</further-classification>  
        <further-classification edition="201601320260323B">F21Y105/10</further-classification>  
        <further-classification edition="201601320260323B">F21Y115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>足達功太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADACHI, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野哲朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, TETSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前川巖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEKAWA, IWAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 將從發光部所射出且在覆蓋發光部的構件的端部發生反射而到達於使用者的眼之光的亮度抑制為小。 &lt;br/&gt;　　[解決手段] 顯示裝置(1)，具備：發光基板(10)，其具有半導體層(11)與發光部(13)；以及光學片(20)。光學片(20)，具有複數個單位透鏡(21)。於第1剖面中，使第1邊(131)的長度為H1，使第2方向上的遮蓋部(2)的端部(2a)與發光部(13)的距離為D1，使單位透鏡(21)的透鏡面(21a)與發光部(13)的距離為Y1時，以下任一者成立：遮蓋部(2)的折射率n為1.4以上並比1.5小且滿足式(1)；遮蓋部(2)的折射率n為1.5以上並比1.6小且滿足式(2)；以及遮蓋部(2)的折射率n為1.6以上且滿足式(3)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:遮蓋部</p>  
        <p type="p">2a:端部</p>  
        <p type="p">2b:第1端部</p>  
        <p type="p">10:發光基板</p>  
        <p type="p">10a:單位區域</p>  
        <p type="p">10c:單位區域第2方向行</p>  
        <p type="p">11:半導體層</p>  
        <p type="p">13:發光部</p>  
        <p type="p">13a:符號</p>  
        <p type="p">20:光學片</p>  
        <p type="p">21:單位透鏡</p>  
        <p type="p">21a:透鏡面</p>  
        <p type="p">21b:單位透鏡端部</p>  
        <p type="p">23:主體部</p>  
        <p type="p">40:封止層</p>  
        <p type="p">50:黏著層</p>  
        <p type="p">131:第1邊</p>  
        <p type="p">131a:端部側第1邊</p>  
        <p type="p">131b:相反側第1邊</p>  
        <p type="p">132:第2邊</p>  
        <p type="p">132a:透鏡面側第2邊</p>  
        <p type="p">132b:發光基板側第2邊</p>  
        <p type="p">A1:目視確認方向</p>  
        <p type="p">d3:厚度方向</p>  
        <p type="p">d2:第2方向</p>  
        <p type="p">L1:邊界</p>  
        <p type="p">L2,L3,L10,L13:光</p>  
        <p type="p">P1:頂點</p>  
        <p type="p">P2,P3,P4:點</p>  
        <p type="p">P5:交點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1204" publication-number="202627199"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627199.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基板之非沉浸式濕式化學處理之設備與方法及用於保持基板之裝置</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR NON-IMMERSIVE WET-CHEMICAL TREATMENT OF A SUBSTRATE AND DEVICE FOR HOLDING THE SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C23C18/16</main-classification>  
        <further-classification edition="202601120260330B">H10P72/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商德國艾托特克有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATOTECH DEUTSCHLAND GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑋恩霍德　瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEINHOLD, RAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾琳格　瑪席亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLINGER, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高盧　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUL, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯勒　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHLER, PHILLIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於將至少一個平面基板(1、2)保持於用於該基板(1、2)之非沉浸式濕式化學處理之一設備中之裝置包括位於用於容納至少一個基板(1)之一邊緣區之一空間(28；55；93)之對置側上之一對導流面(23、24；50、51；88、89)。該等導流面(23、24；50、51；88、89)在一第一方向(&lt;i&gt;-z&lt;/i&gt;)上延伸至各自邊緣(25、26；52、53；90、91)且在橫向於該第一方向(&lt;i&gt;-z&lt;/i&gt;)之一第二方向(&lt;i&gt;y&lt;/i&gt;)上延伸。該等邊緣(25、26；52、53；90、91)之各者定界用於將至少一個基板(1)之一邊緣區插入至該空間(28；55；93)中之一間隙(27；54；92)。該空間(28；55；93)在橫向於該第一及第二方向(&lt;i&gt;-z&lt;/i&gt;、&lt;i&gt;y&lt;/i&gt;)之一第三方向(&lt;i&gt;x&lt;/i&gt;)上之一尺寸在該空間(28；55；93)之該第一方向(&lt;i&gt;-z&lt;/i&gt;)上之一範圍之至少部分內在該第一方向(&lt;i&gt;-z&lt;/i&gt;)上減小。該裝置包括突出接合特徵之至少一個第一陣列(15；44；76)及突出接合特徵之至少一個第二陣列(16；45；77)，其等分別自第一及第二接合特徵支撐件(19；20；47；49；81；84)朝向彼此突出。該第一及第二陣列(15、16；44、45；76、77)在該第二方向(&lt;i&gt;y&lt;/i&gt;)上延伸。該等接合特徵支撐件(19；20；47；49；81；84)可至少部分地相對於彼此移動以在該第三方向(&lt;i&gt;x&lt;/i&gt;)上移動該第一及第二陣列(15、16；44、45；76、77)。該等突出接合特徵位於該空間(28；55；93)中在與該第一方向(&lt;i&gt;-z&lt;/i&gt;)相反之方向(&lt;i&gt;z&lt;/i&gt;)上距該等邊緣(25、26；52、53；90、91)之一距離處。液體可在與該第一方向(&lt;i&gt;-z&lt;/i&gt;)相反之方向(&lt;i&gt;z&lt;/i&gt;)上距該等邊緣(25、26；52、53；90、91)之一距離處進入該空間(28；55；93)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for holding at least one planar substrate (1,2) in an apparatus for non-immersive wet-chemical treatment of the substrate (1,2) comprises a pair of flow guide surfaces (23,24;50,51;88,89) on opposite sides of a space (28;55;93) for accommodating an edge region of at least one substrate (1). The flow guide surfaces (23,24;50,51;88,89) extend in a first direction (&lt;i&gt;-z&lt;/i&gt;) to respective edges (25,26;52,53;90,91) and extend in a second direction (&lt;i&gt;y&lt;/i&gt;) transverse to the first direction (&lt;i&gt;-z&lt;/i&gt;). Each of the edges (25,26;52,53;90,91) bounds a gap (27;54;92) for insertion of an edge region of at least one substrate (1) into the space (28;55;93). A dimension of the space (28;55;93) in a third direction (&lt;i&gt;x&lt;/i&gt;) transverse to the first and second directions (&lt;i&gt;-z&lt;/i&gt;,&lt;i&gt;y&lt;/i&gt;) decreases in the first direction (&lt;i&gt;-z&lt;/i&gt;) over at least part of an extent in the first direction (&lt;i&gt;-z&lt;/i&gt;) of the space (28;55;93). The device comprises at least one first array (15;44;76) of protruding engagement features and at least one second array (16;45;77) of protruding engagement features, protruding towards each other from first and second engagement feature supports (19;20;47;49;81;84), respectively. The first and second arrays (15,16;44,45;76,77) extend in the second direction (&lt;i&gt;y&lt;/i&gt;). The engagement feature supports (19;20;47;49;81;84) are at least partially movable with respect to each other to move the first and second arrays (15,16;44,45;76,77) in the third direction (&lt;i&gt;x&lt;/i&gt;). The protruding engagement features are located in the space (28;55;93) at a distance from the edges (25,26;52,53;90,91) in opposite direction (&lt;i&gt;z&lt;/i&gt;) to the first direction (&lt;i&gt;-z&lt;/i&gt;). The space (28;55;93) is accessible to liquid at a distance from the edges (25,26;52,53;90,91) in opposite direction (&lt;i&gt;z&lt;/i&gt;) to the first direction (&lt;i&gt;-z&lt;/i&gt;).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:接合特徵之第一陣列</p>  
        <p type="p">16:接合特徵之第二陣列</p>  
        <p type="p">17:第一銷</p>  
        <p type="p">18:第二銷</p>  
        <p type="p">19:第一主體</p>  
        <p type="p">23:第一導流面</p>  
        <p type="p">24:第二導流面</p>  
        <p type="p">25:第一邊緣</p>  
        <p type="p">26:第二邊緣</p>  
        <p type="p">27:間隙</p>  
        <p type="p">28:空間</p>  
        <p type="p">29:擋板</p>  
        <p type="p">30a,30b:端板</p>  
        <p type="p">31:第一外表面</p>  
        <p type="p">32:第二外表面</p>  
        <p type="p">36:第一堤壁區段</p>  
        <p type="p">37:第二堤壁區段</p>  
        <p type="p">38:收集空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1205" publication-number="202628144"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628144.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線圈結構</chinese-title>  
        <english-title>COIL STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01F27/28</main-classification>  
        <further-classification edition="200601120250902B">H01F38/14</further-classification>  
        <further-classification edition="201601120250902B">H02J50/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龢諧科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLTRAWARE SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許致維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JR UEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃培維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃程揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐梓育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TZU YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪明順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MING SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈毓豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YU HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線圈結構應用於無線充電領域。該線圈結構包含電路板以及導體。導體設置於電路板上。導體包含複數匝線圈、入線端、出線端以及複數個第一電容結構。複數匝線圈相對於中心點環繞形成。入線端連接複數匝線圈的最外圈一者。出線端連結複數匝線圈的最內圈一者並越過複數匝線圈的其餘每一者。複數個第一電容結構設置於複數匝線圈的每一者。第一電容結構與出線端的距離小於第一電容結構與入線端的距離，而第一電容結構不與出線端重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coil structure applied in the field of wireless charging is provided. The coil structure comprises a circuit board and a conductor. The conductor is arranged on the circuit board. The conductor comprises a plurality of coil turns, an input terminal, an output terminal, and a plurality of first capacitor structures. The coil turns are formed around a center point. The input terminal is connected to an outermost turns of the coil turns. The outlet terminal is connected to an innermost turns of the coil turns and crosses over the remaining turns of the plurality of turns of the coil. Each of the first capacitor structures is arranged on a corresponding one of the coil turns. A distance between the first capacitor structures and the output terminal is smaller than a distance between the first capacitor structures and the input terminal, and the first capacitor structures do not overlap with the output terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:線圈結構</p>  
        <p type="p">110:電路板</p>  
        <p type="p">120:導體</p>  
        <p type="p">120_1,120_2,120_3,120_4:線圈</p>  
        <p type="p">C1,C2,C3,C4:第一電容結構</p>  
        <p type="p">IT1:入線端</p>  
        <p type="p">OT1:出線端</p>  
        <p type="p">CEN1:中心點</p>  
        <p type="p">D1:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1206" publication-number="202626808"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626808.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126079</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具內外層官能基分布差異的軟式隱形眼鏡及其製造方法</chinese-title>  
        <english-title>SOFT CONTACT LENS WITH DIFFERENTIATED INNER AND OUTER FUNCTIONAL GROUP DISTRIBUTION, AND METHOD FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08F220/06</main-classification>  
        <further-classification edition="200601120260325B">C08F220/28</further-classification>  
        <further-classification edition="200601120260325B">C08F220/54</further-classification>  
        <further-classification edition="200601120260325B">C08F222/10</further-classification>  
        <further-classification edition="200601120260325B">C08F226/10</further-classification>  
        <further-classification edition="200601120260325B">C08F230/08</further-classification>  
        <further-classification edition="200601120260325B">C08J7/00</further-classification>  
        <further-classification edition="200601120260325B">G02B1/04</further-classification>  
        <further-classification edition="200601120260325B">G02C7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶碩光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEGAVISION CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊德勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張漢宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳君涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯彥均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔祥禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, HSIANG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉瑋安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, WEI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁凱茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, KAI-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIEH-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種具內外層官能基分布差異的軟式隱形眼鏡以及其製造方法。軟式隱形眼鏡包含一鏡片本體，為水膠軟式鏡片或矽水膠軟式鏡片。鏡片本體的外凸弧面形成有第一官能基分布層，並且第一官能基分布層上形成有第二官能基分布層。其中，第一官能基分布層具第一碳含量、第一氧含量和第一氮含量，並且第二官能基分布層具第二碳含量、第二氧含量和第二氮含量。其中，第二氧含量相較第一氧含量高出10%至200%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a soft contact lens with differentiated inner and outer functional group distribution and a method for manufacturing the same. The soft contact lens comprises a lens body, which may be a hydrogel soft lens or a silicone hydrogel soft lens. A first functional group distribution layer is formed on a convex outer surface of the lens body, and a second functional group distribution layer is formed on the first layer. The first functional group distribution layer has a first carbon content, a first oxygen content, and a first nitrogen content. The second functional group distribution layer has a second carbon content, a second oxygen content, and a second nitrogen content, in which the second oxygen content is 10% to 200% higher than the first oxygen content.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">E:軟式隱形眼鏡</p>  
        <p type="p">1:鏡片本體</p>  
        <p type="p">21:第一官能基分布層</p>  
        <p type="p">22:第二官能基分布層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1207" publication-number="202626611"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626611.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水系環氧樹脂用硬化劑、水系環氧樹脂組成物及其硬化物</chinese-title>  
        <english-title>CURING AGENT FOR AQUEOUS EPOXY RESIN, AQUEOUS EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C07D233/16</main-classification>  
        <further-classification edition="200601120260317B">C08G59/10</further-classification>  
        <further-classification edition="200601120260317B">C08F2/10</further-classification>  
        <further-classification edition="200601120260317B">C08F2/32</further-classification>  
        <further-classification edition="200601120260317B">C08L63/02</further-classification>  
        <further-classification edition="200601120260317B">C09D5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川島裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASHIMA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種水系環氧樹脂用硬化劑、摻合該硬化劑而成之水系環氧樹脂組成物及其硬化物。該水系環氧樹脂用硬化劑含有：包含下述通式(1)表示之化合物與環氧烷之反應產物的反應組成物(A)。 &lt;br/&gt;H&lt;sub&gt;2&lt;/sub&gt;N-CH&lt;sub&gt;2&lt;/sub&gt;-X-CH&lt;sub&gt;2&lt;/sub&gt;-NH&lt;sub&gt;2&lt;/sub&gt;&lt;sub&gt;   &lt;/sub&gt;(1) &lt;br/&gt;式(1)中，X係單鍵或碳數1~6之2價烴基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A curing agent for aqueous epoxy resin comprising a reaction composition (A) containing a reaction product of a compound represented by the following general formula (1) and an alkylene oxide; an aqueous epoxy resin composition containing said curing agent; and a cured product thereof. &lt;br/&gt;(1)H₂N–CH₂–X–CH₂–NH₂&lt;br/&gt; (In formula (1), X represents a single bond or a divalent hydrocarbon group having 1 to 6 carbon atoms.)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1208" publication-number="202627063"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627063.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超臨界處理用組成物、超臨界處理方法、超臨界處理裝置及容器</chinese-title>  
        <english-title>COMPOSITION FOR SUPERCRITICAL TREATMENT, METHOD FOR SUPERCRITICAL TREATMENT, APPARATUS FOR SUPERCRITICAL TREATMENT, AND CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C11D7/30</main-classification>  
        <further-classification edition="200601120260319B">C07C21/18</further-classification>  
        <further-classification edition="200601120260319B">C09K13/08</further-classification>  
        <further-classification edition="200601120260319B">C07C21/12</further-classification>  
        <further-classification edition="202201120260319B">B09B3/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>速水洋輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAMIZU, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及：一種超臨界處理用組成物，包含碳數2之鹵化烯烴與二氧化碳，且相對於前述碳數2之鹵化烯烴與前述二氧化碳之合計量，前述二氧化碳之含有率為76.4質量%以上；並且，本發明還涉及：使用其之超臨界處理方法及超臨界處理裝置，以及，包含前述超臨界處理用組成物之容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1209" publication-number="202629019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126187</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及在扇出重分佈層中製造周邊壁結構的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MAKING A PERIPHERAL WALL STRUCTURE IN FAN-OUT REDISTRIBUTION LAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/655</main-classification>  
        <further-classification edition="202601120260323B">H10W70/63</further-classification>  
        <further-classification edition="202601120260323B">H10W74/01</further-classification>  
        <further-classification edition="202601120260323B">H10W74/10</further-classification>  
        <further-classification edition="202601120260323B">H10W74/15</further-classification>  
        <further-classification edition="202601120260323B">H10W90/20</further-classification>  
        <further-classification edition="200601120260323B">G02B6/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　全豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEO, SWAIN HONG ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　奕祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAY, YI XIANG JASPER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>左健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUO, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　佩燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUA, LINDA PEI EE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　貴忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KAI CHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，其具有堆積互連結構。開口穿過該堆積互連結構而形成。周邊壁結構圍繞該開口而形成。光子半導體晶粒安置於該堆積互連結構上方，其中該光子半導體晶粒之光子電路對準至該開口。間隙在該周邊壁結構上方保留於該堆積互連結構與光子半導體晶粒之間。底膠或囊封物沉積於該堆積互連結構與光子半導體晶粒之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device has a build-up interconnect structure. An opening is formed through the build-up interconnect structure. A peripheral wall structure is formed around the opening. A photonic semiconductor die is disposed over the build-up interconnect structure with a photonic circuit of the photonic semiconductor die aligned to the opening. A gap remains between the build-up interconnect structure and photonic semiconductor die over the peripheral wall structure. An underfill or encapsulant is deposited between the build-up interconnect structure and photonic semiconductor die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:光子半導體晶粒</p>  
        <p type="p">108:非主動表面</p>  
        <p type="p">110:光子電路</p>  
        <p type="p">112:接觸襯墊</p>  
        <p type="p">114:導電微柱</p>  
        <p type="p">120:互連結構</p>  
        <p type="p">122:絕緣或鈍化層</p>  
        <p type="p">124a:導電層部分</p>  
        <p type="p">124b:導電層部分</p>  
        <p type="p">126:絕緣層</p>  
        <p type="p">130:微柱或其他互連結構</p>  
        <p type="p">132:焊料或焊蓋</p>  
        <p type="p">136:開口</p>  
        <p type="p">150:周邊壁結構</p>  
        <p type="p">152:間隙</p>  
        <p type="p">160:底膠</p>  
        <p type="p">164:囊封物或模製化合物</p>  
        <p type="p">170:半導體封裝</p>  
        <p type="p">172:UBM或接觸襯墊/導電層</p>  
        <p type="p">174:焊料凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1210" publication-number="202627257"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627257.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於促進冷卻的紡織品</chinese-title>  
        <english-title>TEXTILE CONFIGURED TO PROMOTE COOLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">D04B21/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商耐克創新有限合夥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKE INNOVATE C.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪金森　凱倫　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAWKINSON, KAREN A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩根　丹尼爾　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORGAN, DANIEL P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文各方面涉及一種紡織品，該紡織品包括由第一多根紗線或纖維形成的第一層。該第一層包括第一組孔口，每個孔口具有第一開口大小。該紡織品還包括由第二多根紗線或纖維形成的第二層。該第二層包括第二組孔口。該第二組孔口中的每個孔口與第一組孔口中的對應孔口軸向對準。第二組孔口中的每個孔口具有第二開口大小，該第二開口大小小於第一組孔口中的孔口的第一開口大小。第一層比第二層相對更親水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects herein are directed to textile that includes a first layer formed from a first plurality of yarns or fibers. The first layer includes a first set of apertures, each aperture having a first opening size. The textile further includes a second layer formed from a second plurality of yarns or fibers. The second layer includes a second set of apertures. Each aperture in the second set of apertures is axially aligned with a corresponding aperture in the first set of apertures. Each aperture in the second set of apertures has a second opening size that is smaller than the first opening size of apertures in the first set of apertures. The first layer is relatively more hydrophilic than the second layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:針織間隔紡織品</p>  
        <p type="p">110:第一針織層</p>  
        <p type="p">112:第二針織層</p>  
        <p type="p">113:第二多根紗線</p>  
        <p type="p">114:多根系結紗線</p>  
        <p type="p">115:通常從視圖中隱藏的系結紗線114的各部分代表系結紗線114的與分別形成第一針織層110和第二針織層112的紗線相互串套的那些區域</p>  
        <p type="p">116:第一組孔口</p>  
        <p type="p">116a:孔口</p>  
        <p type="p">118:第一開口大小</p>  
        <p type="p">120:第二組孔口</p>  
        <p type="p">120a:孔口</p>  
        <p type="p">122:第二開口大小</p>  
        <p type="p">124:軸向對準線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1211" publication-number="202628705"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628705.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素結構及其形成方法</chinese-title>  
        <english-title>PIXEL STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251023B">H10F39/18</main-classification>  
        <further-classification edition="202501120251023B">H10F30/222</further-classification>  
        <further-classification edition="202501120251023B">H10F77/12</further-classification>  
        <further-classification edition="202501120251023B">H10F71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩淵信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWABUCHI, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供畫素結構及其形成方法。畫素結構包括半導體基板、溝渠隔離件、半導體層以及摻雜區。溝渠隔離件設置在半導體基板中。半導體層設置在半導體基板中並被溝渠隔離件圍繞。半導體層具有第一導電型並且光電二極體形成在半導體層中。摻雜區設置在溝渠隔離件和半導體層之間並且具有與第一導電型相反的第二導電型。摻雜區在半導體基板的第一表面和與第一表面相對的第二表面之間延伸，並且摻雜區的寬度隨著摻雜區更接近第一表面而減少。畫素結構可以優化滿井容量和電荷轉移效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel structure and a method of forming the same are provided. The pixel structure includes a semiconductor substrate, a trench isolation, a semiconductor layer and a doped region. The trench isolation is disposed in the semiconductor substrate. The semiconductor layer is disposed in the semiconductor substrate and surrounded by the trench isolation. The semiconductor layer has a first conductive type and a photodiode is formed in the semiconductor layer. The doped region is disposed between the trench isolation and the semiconductor layer and has a second conductive type opposite to the first conductive type. The doped region extends between a first surface and a second surface opposite to the first surface of the semiconductor substrate, and a width of the doped region decreases as the doped region becomes closer to the first surface. The pixel structure may optimize full well capacity and charge transfer efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:畫素</p>  
        <p type="p">12:半導體基板</p>  
        <p type="p">14:半導體層</p>  
        <p type="p">14-1:第一區域</p>  
        <p type="p">14-2:第二區域</p>  
        <p type="p">15:光電二極體</p>  
        <p type="p">16,30:摻雜區</p>  
        <p type="p">18:前表面區域/前表面p型區域</p>  
        <p type="p">20:浮置擴散區</p>  
        <p type="p">22:井區/井隔離</p>  
        <p type="p">24:傳輸閘極</p>  
        <p type="p">24a:平面閘極電極</p>  
        <p type="p">24b:垂直閘極電極</p>  
        <p type="p">26:溝渠隔離件</p>  
        <p type="p">30-1,30-2:部分</p>  
        <p type="p">A:第一表面</p>  
        <p type="p">B:第二表面</p>  
        <p type="p">AF:抗反射層</p>  
        <p type="p">CF:彩色濾光片</p>  
        <p type="p">CFL:彩色濾光片層</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">Dp1:第一深度</p>  
        <p type="p">Dp2:第二深度</p>  
        <p type="p">ML:微透鏡層</p>  
        <p type="p">SP:分離圖案</p>  
        <p type="p">TN:轉折點/寬度轉換點</p>  
        <p type="p">TP:虛線</p>  
        <p type="p">W1,W1’,W2,W2’:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1212" publication-number="202626553"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626553.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化物燒結體、濺鍍靶材、氧化物膜、薄膜電晶體、及電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C04B35/01</main-classification>  
        <further-classification edition="200601120260325B">C04B35/14</further-classification>  
        <further-classification edition="200601120260325B">C04B35/48</further-classification>  
        <further-classification edition="200601120260325B">C23C14/08</further-classification>  
        <further-classification edition="200601120260325B">C23C14/34</further-classification>  
        <further-classification edition="202501120260325B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商出光興產股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山正嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OYAMA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>糸瀨麻美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITOSE, MAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種減少色不均之產生並且減少白點之產生之氧化物燒結體、具備該氧化物燒結體之濺鍍靶材、使用該濺鍍靶材之氧化物膜、包含該氧化物膜之薄膜電晶體、及包含該薄膜電晶體之電子機器。本發明提供一種氧化物燒結體，其包含In、規定之X元素或Z元素作為主成分，In、Ga、Al、及上述X元素或Z元素之原子比滿足規定之條件，且包含方鐵錳礦結晶相及藉由X射線(Cu-Kα射線)繞射測定於下述(A)至下述(C)之入射角(2θ)之範圍內觀測到繞射峰且於下述(G')及(J)之至少一個入射角(2θ)之範圍內可未觀測到繞射峰之結晶相。 &lt;br/&gt;36°～39°          … (A) &lt;br/&gt;53°～56°          … (B) &lt;br/&gt;62°～66°          … (C) &lt;br/&gt;14°～16°          … (G') &lt;br/&gt;8°～10°            … (J)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1213" publication-number="202627867"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627867.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可編程電路板及其使用方法</chinese-title>  
        <english-title>PROGRAMMABLE CIRCUIT BOARD AND METHOD OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260326B">G06F30/34</main-classification>  
        <further-classification edition="202001120260326B">G06F30/20</further-classification>  
        <further-classification edition="200601120260326B">H05K3/00</further-classification>  
        <further-classification edition="200601120260326B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商奧堤森先見公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTISAN INSIGHT, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫柏　愛希利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOPER, ASHLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗亞斯特倫　麥提斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FJALLSTROM, MATTIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威斯羅　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WITHROW, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可編程電路板，其較佳包含：基座、貯存器及工作金屬，其中基座較佳包含由基板堆疊及一組驅動器元件協同界定的一組單元格。一種用於對電路板動態編程之方法，其較佳包含：接收電路板設計；確定單元格定位圖；定位工作金屬；可選地組裝電路板之其餘部分；可選地測試經組裝的PCB模擬件；及/或可選地更新實體PCB模擬件配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A programmable circuit board, preferably including: a rig, a reservoir, and working metal, wherein the rig preferably includes a set of unit cells cooperatively defined by a stack of substrates and a set of driver elements. A method for dynamically programming a circuit board, preferably including: receiving a circuit board design; determining a unit cell map; positioning working metal; optionally assembling a remainder of circuit board components; optionally testing the assembled PCB analog; and/or optionally updating the physical PCB analog configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140’:工作金屬之液滴</p>  
        <p type="p">201:導電層</p>  
        <p type="p">202:電子構件</p>  
        <p type="p">300:印刷電路板模擬件</p>  
        <p type="p">301:走線模擬件</p>  
        <p type="p">302:過孔模擬件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1214" publication-number="202628887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及利用該裝置的基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P72/10</main-classification>  
        <further-classification edition="202601120260327B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李大成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DAE SEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張源準</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, WON JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, MYUNG KEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金周燮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JOO SUOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安元植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, WON SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安海振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, HAE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及基板處理裝置及利用該裝置的基板處理方法。本發明的基板處理裝置包括：基板支撐單元(100)，包括支撐複數個基板(1)而使其在上下方向層疊的晶舟(110)；基板裝載部(200)，形成基板(1)被晶舟(110)裝載及卸載的裝載空間(S1)；反應管部(300)，內部形成與裝載空間(S1)連通且用於處理被晶舟(110)導入的基板(1)的處理空間(S2)；晶舟驅動部(400)，在裝載空間(S1)與處理空間(S2)之間使基板支撐單元(100)上下移動，使得晶舟(110)以垂直方向的虛擬旋轉軸為中心而旋轉；及控制部，透過晶舟驅動部(400)控制晶舟(110)的驅動，其中，控制部在當晶舟(110)向上升及下降中的至少一個上下方向移動時，控制晶舟(110)旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板支撐單元</p>  
        <p type="p">110:晶舟</p>  
        <p type="p">120:螺帽墊圈</p>  
        <p type="p">200:基板裝載部</p>  
        <p type="p">300:反應管部</p>  
        <p type="p">310:反應管</p>  
        <p type="p">320:溫度控制部</p>  
        <p type="p">400:晶舟驅動部</p>  
        <p type="p">410:上下驅動部</p>  
        <p type="p">411:軸部</p>  
        <p type="p">412:移動塊</p>  
        <p type="p">420:旋轉驅動部</p>  
        <p type="p">500:冷卻氣體供給部</p>  
        <p type="p">510:風扇過濾器單元</p>  
        <p type="p">520:冷卻氣體供應管道</p>  
        <p type="p">530:冷卻氣體供給閥</p>  
        <p type="p">600:氣體噴射部</p>  
        <p type="p">1:基板</p>  
        <p type="p">S1:裝載空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1215" publication-number="202626478"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626478.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自律行駛搬送車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B66F9/06</main-classification>  
        <further-classification edition="200601120260327B">B65G67/02</further-classification>  
        <further-classification edition="200601120260327B">B60P1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商昕芙旎雅股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINFONIA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小﨑守</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKI, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹本聖那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMOTO, SEINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡弘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供謀求複數貨物的同時搬送與移載所需的時間的縮短化，能低價且迅速對應搬送經路的佈局變更的自律行駛搬送車輛。 &lt;br/&gt;　　[解決手段]自律行駛搬送車輛(1)，具備：具有能自律行駛的台車部(21)的行駛機器人部(2)、設於行駛機器人部(2)上能收容複數貨物(A)的貨物室部(3)、及設於貨物室部(3)內並將貨物(A)在外部的裝卸部(B)之間進行移載的移載部(4)；移載部(4)，具有：以不同高度位置個別保持貨物(A)的複數保持部(6)、使保持部(6)在貨物室部(3)內與裝卸部(B)之間個別前後移動的進退部(7)、及使各保持部(6)及各進退部(7)在貨物室部(3)內進行升降動作的升降部(5)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:自律行駛搬送車輛</p>  
        <p type="p">2:行駛機器人部</p>  
        <p type="p">3:貨物室部</p>  
        <p type="p">4:移載部</p>  
        <p type="p">5:升降部</p>  
        <p type="p">22:驅動輪</p>  
        <p type="p">51,52:升降軸</p>  
        <p type="p">63a,63b:叉部</p>  
        <p type="p">73a,73b:固定臂</p>  
        <p type="p">74a,74b:可動臂</p>  
        <p type="p">A:容器</p>  
        <p type="p">B:裝載端口</p>  
        <p type="p">B1:載置台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1216" publication-number="202626082"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626082.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療患有糖尿病及肥胖症的個體之方法</chinese-title>  
        <english-title>METHODS OF TREATING SUBJECTS HAVING DIABETES AND OBESITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K38/26</main-classification>  
        <further-classification edition="200601120260401B">C07K14/605</further-classification>  
        <further-classification edition="200601120260401B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商信達生物製藥(蘇州)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOVENT BIOLOGICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周潤澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, RUNZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢鐳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示了使用 GLP-1R 及 GCGR 雙重靶向促效劑瑪仕度肽(Mazdutide)或其醫藥上可接受之鹽治療患有糖尿病及肥胖症二者的個體的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods of using GLP-1R and GCGR dual targeting agonist Mazdutide or a pharmaceutically acceptable salt thereof in the treatment of subjects having both diabetes and obesity.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1217" publication-number="202626315"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626315.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂成形裝置、及樹脂成形品的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B29B15/08</main-classification>  
        <further-classification edition="200601120260302B">B29B15/04</further-classification>  
        <further-classification edition="202601120260302B">H10W74/40</further-classification>  
        <further-classification edition="200601320260302B">B29K703/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>是永康晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORENAGA, YASUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠減少自一個料筒供給至多個模腔的樹脂材料的填充完成的時間差的樹脂成形裝置。在成形模中形成有：澆道部，由所述中間模的上表面與所述上模的下表面形成，並對自所述料筒供給的樹脂材料進行引導；澆口部，形成於所述中間模，將樹脂材料自所述澆道部引導至所述中間模的下表面；第一模腔，由所述下模的上表面與所述中間模的下表面形成，與所述澆口部接連，且形成為自所述澆口部朝向接近所述料筒區塊的接近方向延伸的長條狀；以及第二模腔，由所述下模的上表面與所述中間模的下表面形成，與所述澆口部接連，且形成為自所述澆口部朝向遠離所述料筒區塊的遠隔方向延伸的長條狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:引線框架</p>  
        <p type="p">122:料筒區塊</p>  
        <p type="p">171:樹脂積存部</p>  
        <p type="p">172:節流部</p>  
        <p type="p">173:第一模腔部</p>  
        <p type="p">174:第二模腔部</p>  
        <p type="p">175:第一通氣孔</p>  
        <p type="p">176:第二通氣孔</p>  
        <p type="p">187:槽部</p>  
        <p type="p">188:澆口部</p>  
        <p type="p">C1:第一模腔(模腔)</p>  
        <p type="p">C2:第二模腔(模腔)</p>  
        <p type="p">E:排氣路</p>  
        <p type="p">B、F、L、R:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1218" publication-number="202628158"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628158.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於帶電粒子顯微術網格收容器的真空模擬</chinese-title>  
        <english-title>VACUUM SIMULATION FOR CHARGED-PARTICLE MICROSCOPY GRID RECEPTACLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H01J37/02</main-classification>  
        <further-classification edition="200601120260330B">H01J37/16</further-classification>  
        <further-classification edition="200601120260330B">H01J37/18</further-classification>  
        <further-classification edition="200601120260330B">H01J37/20</further-classification>  
        <further-classification edition="200601120260330B">H01J37/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里維　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVI, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　西蒙　皮埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, SIMON-PIERRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　宰弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAE HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈格舍納斯　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGHSHENAS, ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於促進用於帶電粒子顯微術網格收容器之真空模擬的系統/技術。在各種實施例中，一種設備可包含一定位機構，該定位機構經組態以耦接至一帶電粒子顯微鏡的一真空室。在各種態樣中，該設備可包含一可調整施力器，該可調整施力器耦接至該定位機構且經組態以藉由機械地按壓該真空室之一負載鎖門的一外表面來模擬位於該負載鎖門的一內表面上之一顯微術網格收容器的一真空。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems/techniques are provided for facilitating vacuum simulation for charged-particle microscopy grid receptacles. In various embodiments, an apparatus can comprise a positioning mechanism configured to be coupled to a vacuum chamber of a charged-particle microscope. In various aspects, the apparatus can comprise an adjustable force applicator coupled to the positioning mechanism and configured to simulate a vacuum for a microscopy grid receptacle located on an inner surface of a load-lock door of the vacuum chamber by mechanically pressing against an outer surface of the load-lock door.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:科學儀器模組</p>  
        <p type="p">104:第一邏輯</p>  
        <p type="p">106:第二邏輯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1219" publication-number="202626361"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626361.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合多孔質體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B32B27/06</main-classification>  
        <further-classification edition="200601120260401B">B32B27/30</further-classification>  
        <further-classification edition="200601120260401B">B32B9/04</further-classification>  
        <further-classification edition="200601120260401B">B32B5/32</further-classification>  
        <further-classification edition="200601120260401B">B01D71/02</further-classification>  
        <further-classification edition="200601120260401B">B01D71/36</further-classification>  
        <further-classification edition="200601120260401B">B01D71/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野野村和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONOMURA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種複合多孔質體，其具備：具有第一面之基材、被覆上述第一面之至少一部分之奈米碳管層、及被覆上述奈米碳管層之至少一部分之聚乙烯醇層，且上述基材包含具有上述第一面之包含聚四氟乙烯多孔質體之第一層，上述聚乙烯醇層包含聚乙烯醇之非多孔質體，上述聚乙烯醇層之平均孔徑為1 nm以上5 nm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:複合多孔質體</p>  
        <p type="p">2:基材</p>  
        <p type="p">2h:孔隙</p>  
        <p type="p">2A:第一層</p>  
        <p type="p">2B:第二層</p>  
        <p type="p">3:奈米碳管層</p>  
        <p type="p">4:聚乙烯醇層</p>  
        <p type="p">5:聚乙烯醇</p>  
        <p type="p">6:奈米碳管</p>  
        <p type="p">21:第一面</p>  
        <p type="p">22:第二面</p>  
        <p type="p">30:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1220" publication-number="202626362"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626362.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合多孔質體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B32B27/06</main-classification>  
        <further-classification edition="200601120260401B">B32B27/28</further-classification>  
        <further-classification edition="200601120260401B">B32B27/30</further-classification>  
        <further-classification edition="200601120260401B">B32B9/04</further-classification>  
        <further-classification edition="200601120260401B">B32B5/32</further-classification>  
        <further-classification edition="200601120260401B">B01D71/02</further-classification>  
        <further-classification edition="200601120260401B">B01D71/36</further-classification>  
        <further-classification edition="200601120260401B">B01D71/38</further-classification>  
        <further-classification edition="200601120260401B">B01D71/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野野村和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONOMURA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種複合多孔質體，其具備：具有第一面之支持體、被覆上述第一面之至少一部分之中間層、及被覆上述中間層之至少一部分之被覆層，且上述中間層由聚乙烯醇之非多孔質體所構成，上述被覆層由具有-Si-X-Si-鍵之無機有機混成膜所構成，上述X表示1個以上氫可經取代之直鏈狀飽和烴鏈或直鏈狀不飽和烴鏈，上述中間層之NaCl阻擋率未達10%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:複合多孔質體</p>  
        <p type="p">2:支持體</p>  
        <p type="p">2h:孔隙</p>  
        <p type="p">2A:第一支持體</p>  
        <p type="p">3:中間層</p>  
        <p type="p">4:被覆層</p>  
        <p type="p">21:第一面</p>  
        <p type="p">30:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1221" publication-number="202628678"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628678.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260323B">H10D84/83</main-classification>  
        <further-classification edition="202501120260323B">H10D30/01</further-classification>  
        <further-classification edition="202501120260323B">H10D62/10</further-classification>  
        <further-classification edition="202501120260323B">H10D62/13</further-classification>  
        <further-classification edition="202501120260323B">H10D64/23</further-classification>  
        <further-classification edition="202601120260323B">H10D84/01</further-classification>  
        <further-classification edition="202601120260323B">H10W20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔宇現</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, WOOHYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴奎南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KYUNAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴雨錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WOOSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐昌德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, CHANGDEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜明一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, MYUNGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔道永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路裝置可包括：至少一個第一半導體圖案，其在一第一水平方向上延伸；一第一源極/汲極區，其在該第一水平方向上連接至該至少一個第一半導體圖案之一端部；至少一個第二半導體圖案，其在該第一水平方向上延伸且在一第二水平方向上與該至少一個第一半導體圖案間隔開；一第二源極/汲極區，其在該第一水平方向上連接至該至少一個第二半導體圖案之一端部；以及一絕緣壁，其位於一絕緣壁開口中，該絕緣壁開口在該至少一個第一半導體圖案與該至少一個第二半導體圖案之間以及該第一源極/汲極區與該第二源極/汲極區之間在該第一水平方向上延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit device may include at least one first semiconductor pattern extending in a first horizontal direction, a first source/drain region connected to an end of the at least one first semiconductor pattern in the first horizontal direction, at least one second semiconductor pattern extending in the first horizontal direction and spaced apart from the at least one first semiconductor pattern in a second horizontal direction, a second source/drain region connected to an end of the at least one second semiconductor pattern in the first horizontal direction, and an insulating wall in an insulating wall opening that extends in the first horizontal direction, between the at least one first semiconductor pattern and the at least one second semiconductor pattern and between the first source/drain region and the second source/drain region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">122:閘極電極</p>  
        <p type="p">124:閘極絕緣層</p>  
        <p type="p">126:罩蓋層</p>  
        <p type="p">DW:絕緣壁</p>  
        <p type="p">GS:閘極結構</p>  
        <p type="p">LV0:位階</p>  
        <p type="p">LV1:第一豎直位階</p>  
        <p type="p">LV2:第二豎直位階</p>  
        <p type="p">NS:半導體圖案</p>  
        <p type="p">RX1:第一主動區</p>  
        <p type="p">RX2:第二主動區</p>  
        <p type="p">SD:源極/汲極區</p>  
        <p type="p">SD1:第一源極/汲極區</p>  
        <p type="p">SD2:第二源極/汲極區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1222" publication-number="202627713"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627713.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126817</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器的校正方法、移動體、控制裝置及控制程式</chinese-title>  
        <english-title>SENSOR CALIBRATION METHOD, MOBILE OBJECT, CONTROL DEVICE, AND CONTROL PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G05B19/19</main-classification>  
        <further-classification edition="200601120260102B">G05B19/401</further-classification>  
        <further-classification edition="200601120260102B">G05B19/408</further-classification>  
        <further-classification edition="200601120260102B">G06F7/548</further-classification>  
        <further-classification edition="200601120260102B">G06F17/16</further-classification>  
        <further-classification edition="201801120260102B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羽鳥優平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATORI, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有馬俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的感測器的校正方法係校正對象感測器，該對象感測器係安裝於進行自主移動之移動體100的移動體本體1，且以點群資料的形式檢測周圍的物體，該感測器的校正方法係包含：取得移動體本體1之周圍的點群地圖之步驟；藉由對象感測器檢測移動體本體1之周圍的物體之步驟；將藉由對象感測器所檢測的點群資料之各點在對象感測器的感測器座標系統的位置予以座標轉換成基準座標系統，從而求得點群資料之各點在基準座標系統的位置之步驟；及以使在基準座標系統之點群地圖與點群資料之間的對應點彼此間的位置偏移減少的方式來校正感測器座標系統之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sensor calibration method according to the present invention calibrates a target sensor that is installed on a mobile main body 1 of an autonomously moving mobile object 100 and that detects surrounding objects in the form of point cloud data. The method includes: acquiring a point cloud map of the surroundings of the mobile main body 1; detecting objects surrounding the mobile main body 1 by using the target sensor; determining the position of each point of the point cloud data detected by the target sensor in a reference coordinate system by coordinate-transforming the position of each point in a sensor coordinate system of the target sensor into the reference coordinate system; and calibrating the sensor coordinate system so as to reduce positional deviations between corresponding points in the reference coordinate system between the point cloud map and the point cloud data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S102,S103,S104,S105,S106:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1223" publication-number="202628985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W40/22</main-classification>  
        <further-classification edition="202601120260302B">H10W76/01</further-classification>  
        <further-classification edition="200601120260302B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓心半導體異質整合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳書賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊智超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余思燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SZU-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置及其製造方法。電子裝置包括至少一電子單元、連接基板以及加固件。連接基板與電子單元電性連接且包括第一基層結構以及設置在第一基層結構和電子單元之間的第二基層結構。加固件環繞連接基板。第一基層結構包括第一絕緣層以及設置在第一絕緣層中的第一散熱結構。第二基層結構包括第二絕緣層以及設置在第二絕緣層中的第二散熱結構。第一散熱結構與第二散熱結構重疊，且第一散熱結構及第二散熱結構與加固件的至少一部分接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes at least one electronic unit, a connection substrate electrically connected to the electronic unit and including a first base structure and a second base structure disposed between the first base structure and the electronic unit, and a stiffener surrounding the connection substrate. The first base structure includes a first insulation layer and a first heat dissipation structure disposed in the first insulation layer. The second base structure includes a second insulation layer and a second heat dissipation structure disposed in the second insulation layer. The first heat dissipation structure overlaps with the second heat dissipation structure, and the first heat dissipation structure and the second heat dissipation structure are in contact with at least a portion of the stiffener.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:連接基板</p>  
        <p type="p">200:外部組件</p>  
        <p type="p">300:散熱件</p>  
        <p type="p">302:散熱基板</p>  
        <p type="p">304:散熱結構</p>  
        <p type="p">ADL1:第一調整層</p>  
        <p type="p">ADL2:第二調整層</p>  
        <p type="p">BS1:第一基層結構</p>  
        <p type="p">BS2:第二基層結構</p>  
        <p type="p">CE1:導電元件</p>  
        <p type="p">CP1、CP2、CP3:接墊</p>  
        <p type="p">EU1、EU2:電子單元</p>  
        <p type="p">HD1:第一散熱結構</p>  
        <p type="p">HDL1:散熱層</p>  
        <p type="p">HDV1:散熱通孔</p>  
        <p type="p">HD2:第二散熱結構</p>  
        <p type="p">HDL2:散熱層</p>  
        <p type="p">HDV2:散熱通孔</p>  
        <p type="p">IL1:第一絕緣層/絕緣層</p>  
        <p type="p">IL2:第二絕緣層/絕緣層</p>  
        <p type="p">SR1:加固件</p>  
        <p type="p">t1、t2:厚度</p>  
        <p type="p">TIM1:熱介面層</p>  
        <p type="p">UF1:底部填充劑</p>  
        <p type="p">WS1a:第一配線結構/配線結構</p>  
        <p type="p">WS1b、WS2b:配線結構</p>  
        <p type="p">WS2a:第二配線結構/配線結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1224" publication-number="202629006"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629006.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高壓堆疊電晶體的半導體封裝</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE HAVING HIGH-VOLTAGE STACKED TRANSISTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10W70/40</main-classification>  
        <further-classification edition="202601120260325B">H10W70/04</further-classification>  
        <further-classification edition="202601120260325B">H10W74/10</further-classification>  
        <further-classification edition="202501120260325B">H10D84/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIU, ZHIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　隆慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LONG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁嘉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, JIA-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛　彥迅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, YAN XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瀟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種具有高壓堆疊電晶體的半導體封裝。其中，所述半導體封裝包括一個引線框架、一個第一高壓場效應電晶體（FET）、一個源極夾、一個閘極夾、一個第二高壓FET、一個汲極夾或一個鍵合線以及一個模製封裝。所述製造方法包括以下步驟：提供引線框架；安裝第一高壓FET；連接源極夾和閘極夾；安裝第二高壓FET；連接汲極夾或鍵合線，形成模製封裝；以及應用分割工藝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package comprises a lead frame, a first high-voltage field-effect transistor(FET), a source clip, a gate clip, a second high-voltage FET, a drain clip or a bond wire, and a molding encapsulation. A method comprises the steps of providing a lead frame; mounting a first high-voltage FET; attaching a source clip and a gate clip; mounting a second high-voltage FET; attaching a drain clip or a bond wire, forming a molding encapsulation; and applying a singulation process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">122:管芯墊</p>  
        <p type="p">124:源極墊</p>  
        <p type="p">126:閘極墊</p>  
        <p type="p">150:源極夾</p>  
        <p type="p">160:閘極夾</p>  
        <p type="p">180:汲極夾</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1225" publication-number="202627340"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627340.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126872</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可鉚接安裝的管接頭及其組件與安裝方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">F16L15/00</main-classification>  
        <further-classification edition="200601120260128B">F16L15/04</further-classification>  
        <further-classification edition="200601120260128B">F16L41/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商賓科精密部件（中國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEM (CHINA) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡盛保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, SHENGBAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段大鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUAN, DAPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉仁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可鉚接安裝至待鉚接構件之管接頭，其包括：內部設置有通孔之主體，其包括：連接部，該連接部包括用於連接管路之近端及相對遠離近端之遠端；變形部，該變形部之近端與連接部之遠端相連接，其中連接部之遠端的外徑大於變形部的外徑，並且變形部在外力作用下能夠徑向向外突出，以與連接部之遠端協同夾持待鉚接構件；以及限位部，連接部藉由該限位部與變形部連接，限位部的外徑大於變形部的外徑，且小於連接部之遠端的外徑，該限位部被設置為，在變形部被插入待鉚接構件上之開口，以將管接頭鉚接至待鉚接構件的過程中，限位部與開口相抵接，以限制管接頭繞其通孔延伸方向之軸線旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:管接頭</p>  
        <p type="p">102:待鉚接構件</p>  
        <p type="p">103:流體通道</p>  
        <p type="p">104:管壁</p>  
        <p type="p">105:開口</p>  
        <p type="p">110:主體</p>  
        <p type="p">111:通孔</p>  
        <p type="p">112:連接部</p>  
        <p type="p">113:變形部</p>  
        <p type="p">114:限位部</p>  
        <p type="p">115:拉鉚部</p>  
        <p type="p">121:近端</p>  
        <p type="p">122:遠端</p>  
        <p type="p">123:外端面</p>  
        <p type="p">124:密封元件</p>  
        <p type="p">125:凹槽</p>  
        <p type="p">128:內螺紋</p>  
        <p type="p">153:內螺紋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1226" publication-number="202627415"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627415.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實現決定半導體取樣深度剖面的方法和系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS ENABLING DETERMINATION OF A DEPTH PROFILE OF A SEMICONDUCTOR SPECIMEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G01B15/00</main-classification>  
        <further-classification edition="201801120260325B">G01N23/04</further-classification>  
        <further-classification edition="201801120260325B">G01N23/18</further-classification>  
        <further-classification edition="201801120260325B">G01N23/2251</further-classification>  
        <further-classification edition="201901120260325B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商應用材料以色列公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古奇克　維迪恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUCHIK, VADIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿蘇林　伊泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASSULIN, ITAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊芬特　包里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVANT, BORIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅格比　冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YACOBY, RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊塔　瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAY, RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供的系統和方法包括獲取表示給定取樣的像素強度剖面的資料D&lt;sub&gt;pixel_intensity&lt;/sub&gt;，將資料D&lt;sub&gt;pixel_intensity&lt;/sub&gt;提供給機器學習模型，以根據資料D&lt;sub&gt;pixel_intensity&lt;/sub&gt;決定表示給定取樣的深度的資料，其中該機器學習模型已用訓練集進行過訓練，其中訓練集的至少一部分是基於可操作的模型產生的，該模型基於一或多個表示取樣的參數，預測表示該取樣的像素強度剖面的資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided systems and methods comprising obtaining data D&lt;sub&gt;pixel_intensity&lt;/sub&gt; informative of a pixel intensity profile of a given specimen, feeding the data D&lt;sub&gt;pixel_intensity&lt;/sub&gt; to a machine learning model to determine, based on the data D&lt;sub&gt;pixel_intensity&lt;/sub&gt;, data informative of a depth of the given specimen, wherein the machine learning model has been trained with a training set, wherein at least part of the training set has been generated based on a model operative to predict, based on one or more parameters informative of a specimen, data informative of a pixel intensity profile of the specimen.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:操作</p>  
        <p type="p">210:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1227" publication-number="202626844"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626844.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活性酯樹脂、樹脂組成物、硬化物及其用途以及含酚性羥基之樹脂</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C08G63/133</main-classification>  
        <further-classification edition="200601120260317B">C08G59/48</further-classification>  
        <further-classification edition="200601120260317B">C08G8/18</further-classification>  
        <further-classification edition="200601120260317B">C08L79/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀口雅弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIGUCHI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迫雅樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZAMA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明要解決的課題在於，提供硬化物的相對介電常數高、介電損耗角正切低的活性酯樹脂、含有該活性酯樹脂的樹脂組成物、藉由將該樹脂組成物硬化而得到的硬化物、以及高頻裝置。 &lt;br/&gt;[解決手段]使用使含酚性羥基的樹脂（A）與芳香族（多元）羧酸或其醯鹵化物（B）反應而獲得的活性酯樹脂，前述含酚性羥基的樹脂（A）以含酚性羥基的化合物（a1）和含順丁烯二醯亞胺基的化合物（a2）作為必需的反應原料。進而，使用含有該活性酯樹脂的樹脂組成物和藉由將該樹脂組成物硬化而得到的硬化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1228" publication-number="202626991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過反應組成物的調配物來控制表面聚合速率</chinese-title>  
        <english-title>CONTROL OF SURFACE POLYMERIZATION RATE BY FORMULATION OF REACTION COMPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C09D151/06</main-classification>  
        <further-classification edition="200601120260326B">C08F2/38</further-classification>  
        <further-classification edition="200601120260326B">C08F112/08</further-classification>  
        <further-classification edition="200601120260326B">C08F120/18</further-classification>  
        <further-classification edition="200601120260326B">C08G61/04</further-classification>  
        <further-classification edition="200601120260326B">C08F120/32</further-classification>  
        <further-classification edition="200601120260326B">B01J31/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商易爾德工程系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利勒索魯普　米　布洛姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILLETHORUP, MIE BLOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉斯穆森　西塞　霍爾姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RASMUSSEN, SISSE HOLM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿格加德　阿斯格　霍爾姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGERGAARD, ASGER HOLM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼古拉森　雅各　帕格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKOLAJSEN, JAKOB PAGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑森　尼可拉　伊努瓜克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JESSEN, NICOLAJ INUNNGUAQ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼達爾　喬伊德布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANDAL, JOYDEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　炳成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, BYUNG SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示用於控制與基板表面聚合物形成相關之聚合速率的方法，以及用於執行該等方法的系統。揭示反應組成物之調配物，以便提供可控的表面聚合速率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for controlling polymerization rate in relation to the formation of surface polymers on a substrate as well as systems for carrying out the methods are disclosed herein. The formulation of reaction compositions so as to provide a controlled rate of surface polymerization are disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:基板位移裝置</p>  
        <p type="p">104:反應組成物容器</p>  
        <p type="p">105:反應組成物</p>  
        <p type="p">106:容器</p>  
        <p type="p">107:聚合起始劑化學處理</p>  
        <p type="p">109:退火爐</p>  
        <p type="p">111:氣體環境</p>  
        <p type="p">114:清洗容器</p>  
        <p type="p">116:清洗劑/清洗裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1229" publication-number="202627481"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627481.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉接板的固定裝置</chinese-title>  
        <english-title>FIXING DEVICE FOR ADAPTER PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G01R1/02</main-classification>  
        <further-classification edition="202001120260319B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳宏芯宇電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSIN GLOBAL ELECTRONICS CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種轉接板的固定裝置，包括電路板、插槽、金手指和固定裝置；電路板設有多個鏤空槽，固定裝置活動設置於多個鏤空槽內，且鏤空槽之間的電路板用於放置晶片；固定裝置包括環狀體和固定部；環狀體設於多個鏤空槽內，環狀體用於在多個鏤空槽內活動；固定部用於固定環繞晶片的環狀體。本發明包括固定裝置，並在電路板上設有鏤空槽，並在鏤空槽內設有環狀體，通過轉動和移動固定部的方式，將晶片夾持於固定部和環狀體之間；在需要將晶片從電路板上取下時，則旋轉固定部使固定部復位，晶片能夠從環狀體中取出。靈活度較高，操作較為簡單，耗時較短，能夠提高測試效率，適用於大規模量產的晶片測試。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a fixing device for an adapter board, including a circuit board, a slot, a gold finger and a fixing device; the circuit board is provided with a plurality of openwork slots, the fixing device is movably located in the plurality of openwork slots and the circuit board between the openwork slots is used for placing chip; the fixing device comprises a ring and a fixing portion; the ring is located in a plurality of openwork slots, and the ring is movable inside the plurality of openwork slots; the fixing portion is used to fix a ring which is wrapped around a chip. The present invention comprises a mounting device and a retaining portion. The present invention comprises a fixing device with openwork slots on a circuit board and a ring inside the openwork slots, in which the chip is held between the fixing part and the ring by rotating and moving the fixing part; when the chip needs to be removed from the circuit board, the fixing part is reset by rotating the fixing part, and the chip is able to be removed from the ring. Higher flexibility, simpler operation, shorter time consuming, higher testing efficiency, suitable for large scale mass production chip testing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電路板</p>  
        <p type="p">101:鏤空槽</p>  
        <p type="p">2:插槽</p>  
        <p type="p">3:金手指</p>  
        <p type="p">4:固定裝置</p>  
        <p type="p">401:環狀體</p>  
        <p type="p">402:固定部</p>  
        <p type="p">5:晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1230" publication-number="202626787"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626787.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>羥基化甲基丙烯酸環氧丙酯材料及使用方法</chinese-title>  
        <english-title>HYDROXYLATED GLYCIDYL (METH)ACRYLATE MATERIAL AND METHODS OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F20/32</main-classification>  
        <further-classification edition="202001120260401B">C08J7/04</further-classification>  
        <further-classification edition="200601120260401B">C08J7/12</further-classification>  
        <further-classification edition="202301120260401B">C02F1/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商帷幕公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩姆斯阿巴蒂　阿瑪德　阿拉比</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAMSABADI, AHMAD ARABI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含式（I）或式（II）之甲基丙烯酸環氧丙酯或其鹽的材料、製造該材料之方法及使用該材料之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A material is provided comprising a glycidyl (meth)acrylate of Formula (I) or Formula (II), or a salt thereof, a method of making the material, and a method of using the material.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1231" publication-number="202628543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以檢查檢查對象物的電氣特性的探測器及其控制方法</chinese-title>  
        <english-title>PROBER AND CONTROL METHOD THEREOF FOR INSPECTING ELECTRICAL CHARACTERISTICS OF INSPECTION OBJECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H05K7/20</main-classification>  
        <further-classification edition="202601120260330B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO SEIMITSU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新堀剛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIBORI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐々木寛弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, HIROYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋武孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TAKENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能在廣泛的溫度範圍內進行精確溫度控制的探測器及其控制方法。此探測器係用以檢查檢查對象物的電氣特性的探測器，包括：卡盤部，用以吸附該檢查對象物；以及冷卻液流路，係建構成可控制該卡盤部表面的溫度，並能使冷卻液至少在該卡盤部的傳熱面以沸騰的狀態循環供應。藉由以沸騰的狀態進行循環，可利用沸騰狀態下的相變化能量來執行冷卻，因此能夠在廣泛的溫度範圍內進行精確的溫度控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detector capable of precise temperature control over a wide temperature range and a control method thereof are provided. The detector is a detector for inspecting the electrical characteristics of an inspection object. The detector includes: a chuck portion configured to adsorb the inspection object; and a coolant flow path constructed to control the temperature of the chuck portion surface and to circulate and supply the coolant in a boiling state at least on the heat transfer surface of the chuck portion. By circulating the coolant in a boiling state, the phase change energy in the boiling state can be utilized to perform cooling, thereby enabling precise temperature control over a wide temperature range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:探測器</p>  
        <p type="p">10:卡盤</p>  
        <p type="p">11:卡盤本體</p>  
        <p type="p">12:保持面</p>  
        <p type="p">13:加熱器</p>  
        <p type="p">14:冷卻液流路</p>  
        <p type="p">20:探針卡</p>  
        <p type="p">30:測試器</p>  
        <p type="p">31:測試器本體</p>  
        <p type="p">32:介面</p>  
        <p type="p">40:冷卻液供應部</p>  
        <p type="p">41:供應路</p>  
        <p type="p">42:排出路</p>  
        <p type="p">50:控制部</p>  
        <p type="p">PS1,PS2:壓力感測器</p>  
        <p type="p">TSi,Tso,TS1:溫度感測器</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1232" publication-number="202629036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/00</main-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沼田英夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUMATA, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明容易向密封構件上引出電極。 &lt;br/&gt;實施方式之半導體裝置具備配線基板、積層體、密封構件、以及貫通電極。積層體包含第1至第3半導體晶片，該等第1至第3半導體晶片之第1面相對於配線基板傾斜地配置於與配線基板對向之位置。第1至第3半導體晶片分別於第1面之端部具有電極墊，於第1半導體晶片之上一層，第2半導體晶片以不與第1半導體晶片之電極墊重疊之方式積層於第1方向上，於第2半導體晶片之上一層，第3半導體晶片以不與第2半導體晶片之電極墊重疊之方式積層於第1方向上。覆蓋積層體之密封構件於積層體之電極墊側具有第3面，該第3面與包含至少2個半導體晶片之電極墊之平面平行。複數個貫通電極自電極墊於密封構件內沿著與第1方向正交之第2方向延伸，且與配線基板連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">100a:支持體</p>  
        <p type="p">110:板狀部</p>  
        <p type="p">111:板面</p>  
        <p type="p">120:基底部</p>  
        <p type="p">121:垂直面</p>  
        <p type="p">122:傾斜面</p>  
        <p type="p">200a:積層體</p>  
        <p type="p">210-1~210-p,220:半導體晶片</p>  
        <p type="p">211,221:主面</p>  
        <p type="p">212,213,215:端部</p>  
        <p type="p">222,232:背面</p>  
        <p type="p">240,250:電極墊</p>  
        <p type="p">300a:密封構件</p>  
        <p type="p">310a:面</p>  
        <p type="p">400a:垂直導線</p>  
        <p type="p">410a:上端部</p>  
        <p type="p">500:配線基板</p>  
        <p type="p">510:電極</p>  
        <p type="p">520:絕緣層</p>  
        <p type="p">530:導電層</p>  
        <p type="p">600,800:金屬凸塊</p>  
        <p type="p">700:配線層</p>  
        <p type="p">900:接著劑</p>  
        <p type="p">SFA:平面</p>  
        <p type="p">θ:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1233" publication-number="202628868"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628868.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理系統</chinese-title>  
        <english-title>SUBSTRATE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="200601120260302B">G05D23/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東鶴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG HAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴昭映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供的基板處理系統包括：製程腔室，內部形成反應空間；基板支撐部，結合到所述製程腔室以支撐基板；以及含硼前體供給裝置，用於向所述製程腔室內的所述反應空間供給含硼前體氣體，其中，所述含硼前體供給裝置包括：濾罐，內部填滿由儲罐供給的含硼前體液體，接收載氣而從其內部的含硼前體液體生成含硼前體氣體並排出；以及氣體輸送管道，連接到所述濾罐與所述製程腔室之間，以從所述濾罐向所述製程腔室輸送含硼前體氣體，並且加熱到指定溫度以防止含硼前體氣體液化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:基板處理系統</p>  
        <p type="p">110:製程腔室</p>  
        <p type="p">1102:主體部</p>  
        <p type="p">1104:頂蓋</p>  
        <p type="p">112:反應空間</p>  
        <p type="p">114:排氣管路</p>  
        <p type="p">117:節流閥</p>  
        <p type="p">120:氣體噴射部</p>  
        <p type="p">122:流入口</p>  
        <p type="p">124:噴射板</p>  
        <p type="p">130:基板支撐部</p>  
        <p type="p">132:上板</p>  
        <p type="p">135:軸</p>  
        <p type="p">140a:含硼前體供給裝置</p>  
        <p type="p">141:濾罐</p>  
        <p type="p">142、143:氣體輸送管道</p>  
        <p type="p">146:儲罐</p>  
        <p type="p">147:冷卻箱</p>  
        <p type="p">148:熱交換器</p>  
        <p type="p">CG:載氣</p>  
        <p type="p">BPL:含硼前體液體</p>  
        <p type="p">BPG:含硼前體氣體</p>  
        <p type="p">MFC1、MFC2:流量調節器</p>  
        <p type="p">S:基板</p>  
        <p type="p">V1:閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1234" publication-number="202629007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置、中介件及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE, INTERPOSER AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W70/60</main-classification>  
        <further-classification edition="202601120260302B">H10W70/62</further-classification>  
        <further-classification edition="202601120260302B">H10W40/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓心半導體異質整合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡均祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊智超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱景裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳書賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置、中介件及其製造方法。中介件包括封裝結構。封裝結構包括多個連接單元、第一封裝層以及第一電路結構。多個連接單元彼此間隔開來且以陣列方式排列，其中各連接單元包括基底層以及設置在基底層中的第一導電元件。第一封裝層圍繞多個連接單元。第一電路結構設置在第一封裝層的第一側處且電性連接至多個連接單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an electronic device, an interposer and a method for manufacturing the same. The interposer includes a package structure including a plurality of connection units spaced apart from each other and arranged in an array, a first package layer surrounding the plurality of connection units, and a first circuit structure disposed at a first side of the first package layer and electrically connected to the plurality of connection units. Each connection unit includes a base layer and a first conductive element disposed in the base layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝結構</p>  
        <p type="p">100:連接單元</p>  
        <p type="p">102:基底層</p>  
        <p type="p">103、105:絕緣層</p>  
        <p type="p">104:第一導電元件/導電元件</p>  
        <p type="p">106、108:第二導電元件/導電元件</p>  
        <p type="p">110:第一封裝層</p>  
        <p type="p">110S1:第一側</p>  
        <p type="p">110S2:第二側</p>  
        <p type="p">200:外部組件</p>  
        <p type="p">CE1、CE2、CE3、CE4:連接元件</p>  
        <p type="p">CS1:第一電路結構</p>  
        <p type="p">CS2:第二電路結構</p>  
        <p type="p">ED1:電子裝置</p>  
        <p type="p">EU1:電子單元</p>  
        <p type="p">H1、H2:高度</p>  
        <p type="p">IL1、IL2:絕緣層</p>  
        <p type="p">IP1:中介件</p>  
        <p type="p">ML1:第二封裝層</p>  
        <p type="p">TMV1、TMV2:導電通孔</p>  
        <p type="p">UF1:第一底部填充劑</p>  
        <p type="p">UF2:第二底部填充劑</p>  
        <p type="p">WS1、WS2:配線結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1235" publication-number="202627495"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627495.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針卡以及探針卡的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G01R1/073</main-classification>  
        <further-classification edition="200601120260317B">G01R3/00</further-classification>  
        <further-classification edition="202001120260317B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRONICS JAPAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原正登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">探針卡(1)係具備：配線基板(10)，係具有複數個端子部(11)；導引構件(20)，係固定於配線基板(10)，且於與複數個端子部(11)對向的位置形成有複數個貫通孔(20a)；以及複數個探針(30)，係能夠插拔地插入至複數個貫通孔(20a)，且與複數個端子部(11)接合；於導引構件(20)的表面的至少一部分設有：導熱膜(60)，係導熱率比導引構件(20)的母材更高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:探針卡</p>  
        <p type="p">10:配線基板</p>  
        <p type="p">11:端子部</p>  
        <p type="p">20:導引構件</p>  
        <p type="p">20a:貫通孔</p>  
        <p type="p">21:導引本體</p>  
        <p type="p">21A:對向面</p>  
        <p type="p">21B:非對向面</p>  
        <p type="p">21C:側面</p>  
        <p type="p">30:探針</p>  
        <p type="p">40:接合部</p>  
        <p type="p">41:接合材料</p>  
        <p type="p">60:導熱膜</p>  
        <p type="p">61:開口部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1236" publication-number="202629053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>引線上晶片裝置及製造方法</chinese-title>  
        <english-title>CHIP ON LEAD DEVICE AND MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10W90/00</main-classification>  
        <further-classification edition="202601120260325B">H10W70/60</further-classification>  
        <further-classification edition="202601120260325B">H10W70/02</further-classification>  
        <further-classification edition="202601120260325B">H05K1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商德州儀器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEXAS INSTRUMENTS INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波達爾　阿寧迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PODDAR, ANINDYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置，其包括：一非導電晶粒附接膜，其位於一導電引線之一側上；一半導體晶粒，其具有一第一側及一側面，該第一側位於該非導電晶粒附接膜上，且該側面包括條紋；及一封裝結構，其圍封該半導體晶粒及該導電引線之一部分。一種方法包括：單體化一載體上之一非導電晶粒附接膜的部分；將一晶圓之一背側附接至該非導電晶粒附接膜之該等經單體化部分；及在該晶圓之該背側附接至該非導電晶粒附接膜之該等經單體化部分的情況下，單體化該晶圓之半導體晶粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a non-conductive die attach film on a side of a conductive lead, a semiconductor die having a first side and a lateral side, the first side on the non-conductive die attach film, and the lateral side including striations, and a package structure enclosing the semiconductor die and a portion of the conductive lead. A method includes singulating portions of a non-conductive die attach film on a carrier, attaching a backside of a wafer to the singulated portions of the non-conductive die attach film, and singulating semiconductor dies of the wafer while the backside of the wafer is attached to the singulated portions of the non-conductive die attach film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置/引線上晶片(COL)封裝式電子裝置</p>  
        <p type="p">101:第一側</p>  
        <p type="p">102:第二側</p>  
        <p type="p">103:第三側</p>  
        <p type="p">104:第四側</p>  
        <p type="p">107:導電引線</p>  
        <p type="p">108:封裝結構</p>  
        <p type="p">109:非導電晶粒附接膜/晶粒附接膜部分/經圖案化晶粒附接部分/經圖案化非導電晶粒附接膜部分</p>  
        <p type="p">110:半導體晶粒</p>  
        <p type="p">111:導電特徵</p>  
        <p type="p">112:接合線</p>  
        <p type="p">114:拐角部分</p>  
        <p type="p">116:條紋</p>  
        <p type="p">121:底側或第一側</p>  
        <p type="p">122:頂側或第二側/前側</p>  
        <p type="p">123:側面</p>  
        <p type="p">124:側面</p>  
        <p type="p">130:電路板</p>  
        <p type="p">132:導電特徵</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">D2:第二距離</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1237" publication-number="202628749"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628749.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光元件，顯示裝置，電子裝置，以及照明裝置</chinese-title>  
        <english-title>LIGHT-EMITTING ELEMENT, DISPLAY DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260325B">H10K50/00</main-classification>  
        <further-classification edition="202301120260325B">H10K50/11</further-classification>  
        <further-classification edition="202301120260325B">H10K50/12</further-classification>  
        <further-classification edition="202301120260325B">H10K59/00</further-classification>  
        <further-classification edition="202301120260325B">H10K85/30</further-classification>  
        <further-classification edition="202301120260325B">H10K85/60</further-classification>  
        <further-classification edition="200601120260325B">C09K11/06</further-classification>  
        <further-classification edition="200601120260325B">G01N21/64</further-classification>  
        <further-classification edition="202301320260325B">H10K101/10</further-classification>  
        <further-classification edition="202301320260325B">H10K101/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬尾哲史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋辰義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TATSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡部剛吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATABE, TAKEYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光森智美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUMORI, SATOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種發光效率高的發光元件。本發明的一個實施方式是包括第一有機化合物、第二有機化合物以及客體材料的發光元件。第一有機化合物的LUMO能階低於第二有機化合物的LUMO能階，第一有機化合物的HOMO能階低於第二有機化合物的HOMO能階。客體材料的HOMO能階高於第二有機化合物的HOMO能階。客體材料的LUMO能階與客體材料的HOMO能階之間的能量差大於第一有機化合物的LUMO能階與第二有機化合物的HOMO能階之間的能量差。客體材料具有能夠將三重激發能轉換成發光的功能。第一有機化合物與第二有機化合物的組合形成激態錯合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting element with high emission efficiency. The light-emitting element includes a first organic compound, a second organic compound, and a guest material. The LUMO level of the first organic compound is lower than the LUMO level of the second organic compound. The HOMO level of the first organic compound is lower than the HOMO level of the second organic compound. The HOMO level of the guest material is higher than the HOMO level of the second organic compound. The energy difference between the LUMO level of the guest material and the HOMO level of the guest material is larger than the energy difference between the LUMO level of the first organic compound and the HOMO level of the second organic compound. The guest material has a function of converting triplet excitation energy into light emission. The first organic compound and the second organic compound form an exciplex.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">131_1:有機化合物</p>  
        <p type="p">131_2:有機化合物</p>  
        <p type="p">132:客體材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1238" publication-number="202627211"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627211.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹼性水電解用隔膜及其製造方法、以及鹼性水電解槽</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260324B">C25B1/04</main-classification>  
        <further-classification edition="202101120260324B">C25B9/13</further-classification>  
        <further-classification edition="200601120260324B">C25B13/08</further-classification>  
        <further-classification edition="200601120260324B">B01D69/06</further-classification>  
        <further-classification edition="200601120260324B">C08K3/22</further-classification>  
        <further-classification edition="201801120260324B">C09J7/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤隆文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川七彩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, NANASE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下村育生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOMURA, IKUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀井裕次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEI, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">將鹼性水電解槽之配置有陽極之陽極室與配置有陰極之陰極室隔開之鹼性水電解用隔膜具備高分子多孔質膜，該高分子多孔質膜一體地具有於鹼性水電解槽中被槽構成構件夾住之密封區域、及配置於密封區域之內周側之隔離件（seperator）區域，隔離件區域具有小於該隔離件區域且夾於陽極與陰極之間的電極間區域、及密封區域與電極間區域之間的非約束區域，高分子多孔質膜具有寬度跨越密封區域、非約束區域、及電極間區域之框狀之塊狀部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:槽本體</p>  
        <p type="p">4:鹼性水電解用隔膜</p>  
        <p type="p">21:陽極室框</p>  
        <p type="p">21a,22a:框面</p>  
        <p type="p">22:陰極室框</p>  
        <p type="p">23:分隔件</p>  
        <p type="p">24,25,26:襯墊</p>  
        <p type="p">31:陽極</p>  
        <p type="p">32:陽極導電板</p>  
        <p type="p">42:塊狀部</p>  
        <p type="p">48:陽極室</p>  
        <p type="p">49:陰極室</p>  
        <p type="p">71:陰極</p>  
        <p type="p">72:陰極導電板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1239" publication-number="202627523"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627523.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維複合感測系統與三維複合感測方法</chinese-title>  
        <english-title>HYBRID THREE-DIMENSIONAL SENSING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260326B">G01S17/894</main-classification>  
        <further-classification edition="202001120260326B">G01S17/89</further-classification>  
        <further-classification edition="200601120260326B">G01B11/25</further-classification>  
        <further-classification edition="202001120260326B">G02B30/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳旻謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MIN-CHIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡政哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王清穩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">三維複合感測系統包括飛時測距投射器、結構光投射器、飛時測距感測器、飛時測距處理器與結構光處理器。於飛時測距模式，飛時測距投射器將調變光投射在物件上。於結構光模式，結構光投射器將結構光投射在物件上。飛時測距感測器從物件接收反射且相應地產生視訊資料。飛時測距處理器接收視訊資料且於飛時測距模式根據視訊資料產生飛時測距深度資訊。結構光處理器從飛時測距處理器接收二維影像且於結構光模式根據二維影像產生結構光深度資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hybrid 3D sensing system including a time-of-flight (ToF) projector, a structured light (SL) projector, a ToF sensor, a ToF processor, and an SL processor. The ToF projector projects a modulated light on an object in a ToF mode. The SL projector projects a structured light on the object in an SL mode. The ToF sensor receives reflections from the object and correspondingly generates video data. The ToF processor receives the video data and generates ToF depth information according to the video data in the ToF mode. The SL processor receives a 2D image from the ToF processor and generates SL depth information according to the 2D image in the SL mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11,S12,S13,S14,S15:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1240" publication-number="202628515"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628515.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>殼體結構、終端設備及殼體結構的加工方法</chinese-title>  
        <english-title>HOUSING STRUCTURE, TERMINAL DEVICE, AND PROCESSING METHOD FOR THE HOUSING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">H05K5/02</main-classification>  
        <further-classification edition="200601120260331B">H05K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商富聯裕展科技（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULIAN YUZHAN PRECISION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許正剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, ZHENG-GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳楚輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING-BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種殼體結構、終端設備及殼體結構的加工方法，殼體結構包括中框、接頭件以及絕緣件。中框具有接頭孔。接頭件至少部分位於接頭孔內，接頭件與接頭孔之間具有間隙。絕緣件設置於接頭件與接頭孔之間。殼體結構還包括第一限位部、第二限位部、第三限位部及第四限位部，第一限位部設置於接頭孔的內壁面，第二限位部設置於絕緣件朝向接頭孔的內壁面的表面，第一限位部與第二限位部配合；第三限位部設置於接頭件的外壁面，第四限位部設置於絕緣件朝向接頭件的外壁面的表面，第三限位部與第四限位部配合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a housing structure, a terminal device, and a processing method for the housing structure. The housing structure comprises a middle frame, an interface member, and an insulating member. The middle frame defines a through hole. At least a segment of the interface member is disposed within the through hole, wherein a gap exists between an outer engagement surface of the interface member and the inner surface of the through hole. The insulating member is interposed between an outer engagement surface of the interface member and the inner surface of the through hole. The housing structure further comprises a first stop portion, a second stop portion, a third stop portion, and a fourth stop portion. The first stop portion is disposed within the inner surface of the through hole. The second stop portion is disposed within an engagement surface of the insulating member, wherein the engagement surface is opposing the inner surface of the through hole. The first and second stop portions operatively engage to substantially constrain a relative displacement between the insulating member and the middle frame. The third stop portion is disposed within the outer engagement surface of the interface member, and the fourth stop portion is disposed within an engagement surface of the insulating member, wherein the engagement surface is opposing the outer surface of the interface member. The third stop portion and the fourth stop portion operatively engage to substantially constrain a relative displacement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">001:殼體結構</p>  
        <p type="p">100:中框</p>  
        <p type="p">110:接頭孔</p>  
        <p type="p">120:話筒孔</p>  
        <p type="p">130:揚聲孔</p>  
        <p type="p">142:拉料孔</p>  
        <p type="p">200:接頭件</p>  
        <p type="p">210:插拔孔</p>  
        <p type="p">300:絕緣件</p>  
        <p type="p">312:拉料柱</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1241" publication-number="202628619"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628619.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊半導體裝置及製造堆疊半導體裝置的方法</chinese-title>  
        <english-title>STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE STACKED SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D30/01</main-classification>  
        <further-classification edition="202501120260327B">H10D64/01</further-classification>  
        <further-classification edition="202601120260327B">H10D84/01</further-classification>  
        <further-classification edition="202501120260327B">H10D84/83</further-classification>  
        <further-classification edition="202601120260327B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴起丙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KIBYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　康一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, KANG-ILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">堆疊半導體裝置包括：基底；基底上的第一源極/汲極區；以及垂直在第一源極/汲極區上方的第二源極/汲極區，第二源極/汲極區垂直重疊第一源極/汲極區的第一部分和第二部分中的第一部分，其中基底的頂表面的第一部分垂直在第一源極/汲極區的第一部分下方以及基底的頂表面的第二部分垂直在第一源極/汲極區的第二部分下方為共面或對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a stacked semiconductor device which includes: a substrate; a 1&lt;sup&gt;st&lt;/sup&gt; source/drain region on the substrate; and a 2&lt;sup&gt;nd&lt;/sup&gt; source/drain region vertically above the 1&lt;sup&gt;st&lt;/sup&gt; source/drain region, the 2&lt;sup&gt;nd&lt;/sup&gt; source/drain region vertically overlapping a 1&lt;sup&gt;st&lt;/sup&gt; portion, among the 1&lt;sup&gt;st&lt;/sup&gt; portion and a 2&lt;sup&gt;nd&lt;/sup&gt; portion, of the 1&lt;sup&gt;st&lt;/sup&gt; source/drain region, wherein a 1&lt;sup&gt;st&lt;/sup&gt; portion of a top surface of the substrate vertically below the 1&lt;sup&gt;st&lt;/sup&gt; portion of the 1&lt;sup&gt;st&lt;/sup&gt; source/drain region and a 2&lt;sup&gt;nd&lt;/sup&gt; portion of the top surface of the substrate vertically below the 2&lt;sup&gt;nd&lt;/sup&gt; portion of the 1&lt;sup&gt;st&lt;/sup&gt; source/drain region are coplanar or aligned.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10':中間半導體裝置</p>  
        <p type="p">103:淺溝槽隔離(STI)結構</p>  
        <p type="p">122:通道層/第二通道層</p>  
        <p type="p">D1、D2、D3:方向</p>  
        <p type="p">I-I’:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1242" publication-number="202628664"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628664.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊裝置結構及其製造方法</chinese-title>  
        <english-title>STACKED DEVICE STRUCTURES AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10D84/01</main-classification>  
        <further-classification edition="202501120260302B">H10D84/83</further-classification>  
        <further-classification edition="202501120260302B">H10D30/62</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202601120260302B">H10W10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余建霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括接收堆疊結構，堆疊結構包括第一多層堆疊、第二多層堆疊和第一絕緣結構；在第一多層堆疊中形成源極/汲極溝槽的第一部分；在源極/汲極溝槽的第一部分中形成虛設側壁遮罩後，源極/汲極溝槽延伸至第一絕緣結構和第二多層堆疊中，使源極/汲極溝槽的第二部分在第一絕緣結構中，而源極/汲極溝槽的第三部分在第二多層堆疊中；在源極/汲極溝槽的第三部分中形成第一源極/汲極；從源極/汲極溝槽的第一部分移除虛設側壁遮罩後，在源極/汲極溝槽的第二部分中形成第二絕緣結構；在源極/汲極溝槽的第一部分中形成第二源極/汲極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An exemplary method includes receiving a stacked structure that includes a first multilayer stack, a second multilayer stack, and a first insulation structure; forming a first portion of a source/drain trench in the first multilayer stack; after forming dummy sidewall masks in the first portion of the source/drain trench, extending the source/drain trench into the first insulation structure and the second multilayer stack, such that a second portion of the source/drain trench is in the first insulation structure and a third portion of the source/drain trench is in the second multilayer stack; forming a first source/drain in the third portion of the source/drain trench; after removing the dummy sidewall masks from the first portion of the source/drain trench, forming a second insulation structure in the second portion of the source/drain trench; and forming a second source/drain in the first portion of the source/drain trench.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:方法</p>  
        <p type="p">102:區塊</p>  
        <p type="p">104:區塊</p>  
        <p type="p">106:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1243" publication-number="202628634"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628634.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＬＤＭＯＳ電晶體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260320B">H10D30/66</main-classification>  
        <further-classification edition="202501120260320B">H10D62/10</further-classification>  
        <further-classification edition="202501120260320B">H10D62/13</further-classification>  
        <further-classification edition="202501120260320B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種LDMOS電晶體及其製造方法，所述LDMOS電晶體包括：沿第一方向分佈的本質區域和終端區域，所述本質區域包括：第一摻雜類型的井區；位於所述井區中的第二摻雜類型的體區；位於所述井區中的漂移區，所述漂移區包括至少一層第一摻雜類型的第一注入層和至少一層第二摻雜類型的第二注入層；位於所述體區中的第一摻雜類型的源區，以及位於所述井區中的第一摻雜類型的汲極區；所述終端區域包括與所述第二注入層接觸的第二摻雜類型的第三注入區，其中，所述源區指向所述汲極區的方向設置為第二方向，所述井區的下表面指向所述井區的上表面的方向設置為第三方向，所述第一方向，第二方向，第三方向相互垂直，所述第二注入層設置為與所述體區分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">203:第二注入區</p>  
        <p type="p">204:體區</p>  
        <p type="p">220:第二摻雜區</p>  
        <p type="p">221:第二井區</p>  
        <p type="p">223:導體層</p>  
        <p type="p">300:本質區域</p>  
        <p type="p">400:終端區域</p>  
        <p type="p">F1:第一方向</p>  
        <p type="p">F2:第二方向</p>  
        <p type="p">F3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1244" publication-number="202628631"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628631.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127487</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電晶體結構及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260324B">H10D30/65</main-classification>  
        <further-classification edition="202501120260324B">H10D30/01</further-classification>  
        <further-classification edition="202501120260324B">H10D62/10</further-classification>  
        <further-classification edition="202501120260324B">H10D64/27</further-classification>  
        <further-classification edition="202601120260324B">H10W20/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒲松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫肇峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電晶體結構及其製造方法，所述電晶體結構包括：位於井區中的源極區和汲極區；位於所述井區上表面的閘極介電層；位於所述井區上的場隔離阻擋層，從所述閘極介電層至少延伸至所述汲極區的上方，並覆蓋所述汲極區的上表面，並且，所述場隔離阻擋層在所述汲極區的上表面至少具有一個汲極區通孔；以及汲極，填充所述汲極區通孔，以與所述汲極區接觸。本發明提供的電晶體結構不需要考慮以及汲極和金屬矽化物阻擋層之間的間距，因此會減小裝置的尺寸，進而減小裝置的比導通電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:襯底</p>  
        <p type="p">102:井區</p>  
        <p type="p">103:體區</p>  
        <p type="p">104:汲極區</p>  
        <p type="p">105:源極區</p>  
        <p type="p">106:閘極介電層</p>  
        <p type="p">107:閘極導體</p>  
        <p type="p">108:場隔離阻擋層</p>  
        <p type="p">109:汲極</p>  
        <p type="p">110:金屬矽化物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1245" publication-number="202626454"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626454.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物品容置設備</chinese-title>  
        <english-title>ARTICLE STORAGE FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B65G1/02</main-classification>  
        <further-classification edition="200601120260323B">E06C9/06</further-classification>  
        <further-classification edition="200601120260323B">E06C7/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東村真吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGASHIMURA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小柳貴由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYANAGI, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在物品容置設備中，於X方向上分開地配置之一對容置架各自具備有配置排列於Y方向的複數個配列構件。立足部具備有卡止構造4，前述卡止構造4在前述立足部配置成跨設於一對容置架的X方向之間的狀態下，卡止於一對容置架的每一個，卡止構造4具備有限制立足部的Y方向的移動之Y方向限制構造4Y。Y方向限制構造4Y具備有第1相向部41與第2相向部42，前述第1相向部41是從Y方向第1側Y1與第1配列構件11A相向，前述第2相向部42是從Y方向第2側Y2與第2配列構件11B相向，前述第1配列構件11A是一對容置架各自的1個配列構件，前述第2配列構件11B是一對容置架各自的第1配列構件11A或與第1配列構件11A不同的配列構件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:軌道</p>  
        <p type="p">4:卡止構造</p>  
        <p type="p">4Y:Y方向限制構造</p>  
        <p type="p">5:間隔調整機構</p>  
        <p type="p">11A:第1配列構件</p>  
        <p type="p">11B:第2配列構件</p>  
        <p type="p">22:連結部</p>  
        <p type="p">30b:底面部</p>  
        <p type="p">31:支架</p>  
        <p type="p">41:第1相向部</p>  
        <p type="p">42:第2相向部</p>  
        <p type="p">50:長孔</p>  
        <p type="p">71:第1限制構件</p>  
        <p type="p">72:第2限制構件</p>  
        <p type="p">B1:第1螺栓</p>  
        <p type="p">B2:第2螺栓</p>  
        <p type="p">X:X方向</p>  
        <p type="p">Y:Y方向</p>  
        <p type="p">X1:X方向第1側</p>  
        <p type="p">X2:X方向第2側</p>  
        <p type="p">Y1:Y方向第1側</p>  
        <p type="p">Y2:Y方向第2側</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">Z1:上側</p>  
        <p type="p">Z2:下側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1246" publication-number="202626986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>著色硬化性樹脂組合物、彩色濾光片及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C09D133/10</main-classification>  
        <further-classification edition="200601120260324B">C09B67/22</further-classification>  
        <further-classification edition="200601120260324B">C08K5/10</further-classification>  
        <further-classification edition="200601120260324B">G03F7/027</further-classification>  
        <further-classification edition="200601120260324B">G02B5/20</further-classification>  
        <further-classification edition="200601120260324B">G02F1/1335</further-classification>  
        <further-classification edition="202501120260324B">H10H29/851</further-classification>  
        <further-classification edition="202301120260324B">H10K59/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹花祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEHANA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種即便不添加無機微粒子亦能夠形成具有霧度之彩色濾光片之著色硬化性樹脂組合物。 &lt;br/&gt;本發明之著色硬化性樹脂組合物包含著色劑、樹脂、聚合性化合物、聚合起始劑及溶劑，上述聚合性化合物包含單官能單體及多官能單體，上述單官能單體包含式(1)所表示之化合物， &lt;br/&gt;&lt;img align="absmiddle" height="57px" width="228px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中， &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;表示氫原子或甲基， &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt;表示碳數7～22之直鏈或支鏈烷基]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1247" publication-number="202626755"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626755.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物及光阻圖案之形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08F2/40</main-classification>  
        <further-classification edition="200601120251201B">C08F2/44</further-classification>  
        <further-classification edition="200601120251201B">C08F2/50</further-classification>  
        <further-classification edition="200601120251201B">C08F257/02</further-classification>  
        <further-classification edition="200601120251201B">C08F265/00</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/027</further-classification>  
        <further-classification edition="200601120251201B">G03F7/028</further-classification>  
        <further-classification edition="200601120251201B">G03F7/031</further-classification>  
        <further-classification edition="200601120251201B">G03F7/033</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/09</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">H05K3/06</further-classification>  
        <further-classification edition="200601120251201B">H05K3/18</further-classification>  
        <further-classification edition="200601120251201B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>春名開友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARUNA, KAITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之感光性樹脂組成物係含有：&lt;br/&gt; （A）鹼可溶性高分子、（B）具有乙烯性不飽和鍵之化合物、&lt;br/&gt; （C）光聚合起始劑、（D）增感劑、及（E）聚合抑制劑；&lt;br/&gt; 前述（C）光聚合起始劑係含有選自2,4,5-三芳基咪唑二聚物及吖啶化合物中一種或兩種以上；相對於前述感光性樹脂組成物的固體成分總質量，前述（C）光聚合起始劑的含量為5.0質量%以上；前述（D）增感劑係含有以由下述式（D1-1）表示之化合物為代表之特定化合物；且前述（E）聚合抑制劑係包含（E1）選自亞硝基化合物及硝醯自由基之第一聚合抑制劑、及（E2）該第一聚合抑制劑以外的第二聚合抑制劑。&lt;br/&gt;&lt;img align="absmiddle" height="251px" width="481px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1248" publication-number="202628594"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628594.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127624</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非揮發性積體電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251203B">H10B61/00</main-classification>  
        <further-classification edition="200601120251203B">G11C7/20</further-classification>  
        <further-classification edition="200601120251203B">G11C5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東北大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHOKU UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏井雅典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATSUI, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田知生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TOMOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羽生貴弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANYU, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種能夠大幅降低能量開銷之新的非揮發性積體電路。藉由非揮發性積體電路解決了上述課題，前述非揮發性積體電路使在供給電源時複數個正反器所記憶保持之各位元資訊在切斷電源時退避並保持於非揮發性記憶區域，其特徵為，前述非揮發性積體電路由N位元構成，前述非揮發性記憶區域由N+1個磁穿隧接合元件構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:正反器</p>  
        <p type="p">2:讀出電路</p>  
        <p type="p">3:控制器電路</p>  
        <p type="p">4:備份電路</p>  
        <p type="p">5:初始化電路</p>  
        <p type="p">100:非揮發性暫存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1249" publication-number="202626940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光波導用樹脂組成物、以及使用其之乾膜、附樹脂之薄膜、液狀材料及光波導</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08L63/00</main-classification>  
        <further-classification edition="200601120260330B">C08G59/30</further-classification>  
        <further-classification edition="200601120260330B">C08G59/32</further-classification>  
        <further-classification edition="200601120260330B">G02B6/122</further-classification>  
        <further-classification edition="200601120260330B">G02B1/04</further-classification>  
        <further-classification edition="200601120260330B">C08F2/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑田麻稀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, MAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦岡祐輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URAOKA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金津</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗副潤子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIZOE, JUNKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口敦史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光波導用樹脂組成物含有折射率為1.52以下之低折射率化合物(A)與折射率大於1.52且在1.75以下之高折射率化合物(B)，低折射率化合物(A)包含脂肪族環氧化合物、含矽原子之環氧化合物及含氟原子之環氧化合物中之至少1種，高折射率化合物(B)包含茀型環氧化合物、聯苯型環氧化合物及乙烯基硫醚化合物中之至少1種，高折射率化合物(B)之含量為7.5質量份以上且55質量份以下，從式：(低折射率化合物(A)之折射率×低折射率化合物(A)之含量+高折射率化合物(B)之折射率×高折射率化合物(B)之含量)/(低折射率化合物(A)與高折射率化合物(B)之合計含量)算出之值為1.52以上且小於1.60。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:包覆件用乾膜</p>  
        <p type="p">2:芯件用乾膜</p>  
        <p type="p">3:包覆件</p>  
        <p type="p">3a:下包覆件</p>  
        <p type="p">3b:上包覆件</p>  
        <p type="p">4:芯件</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:電路</p>  
        <p type="p">12:狹縫</p>  
        <p type="p">13:遮罩</p>  
        <p type="p">A:光波導</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1250" publication-number="202626340"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626340.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明導電性薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260324B">B32B7/02</main-classification>  
        <further-classification edition="200601120260324B">B32B9/00</further-classification>  
        <further-classification edition="200601120260324B">G06F3/041</further-classification>  
        <further-classification edition="200601120260324B">H01B5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多多見央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATAMI, NAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋知大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種持續輸入耐久性、抗黏連性、外觀及銀密合性皆優良的透明導電性薄膜。&lt;br/&gt; 本發明之透明導電性薄膜，其係在透明塑膠薄膜基材上的至少一面積層銦-錫複合氧化物的透明導電膜而成的透明導電性薄膜，其特徵為：&lt;br/&gt; 該透明導電膜的平均算術平均高度(AVSa)為2nm以上50nm以下；&lt;br/&gt; 該透明導電膜的平均最大峰高度(AVSp)為150nm以上1000nm以下；&lt;br/&gt; 從試驗方法1求出的該透明導電膜側表面及與積層有該透明導電膜的面相反側的表面的平均突起寬度為12μm以下；&lt;br/&gt; 從試驗方法2求出的該透明導電膜的層合強度為450mN/15mm以上；&lt;br/&gt; 從試驗方法A求出的該透明導電膜的銀密合性為95%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:透明導電膜</p>  
        <p type="p">6:硬化型樹脂層</p>  
        <p type="p">7:透明塑膠薄膜基材</p>  
        <p type="p">8:機能層</p>  
        <p type="p">20:透明導電性薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1251" publication-number="202627031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低熱阻抗相變熱界面材料</chinese-title>  
        <english-title>LOW THERMAL IMPEDANCE PHASE CHANGE THERMAL INTERFACE MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C09K5/06</main-classification>  
        <further-classification edition="200601120260324B">B32B25/20</further-classification>  
        <further-classification edition="200601120260324B">C08L101/12</further-classification>  
        <further-classification edition="201801120260324B">C08K3/014</further-classification>  
        <further-classification edition="200601120260324B">C08K3/08</further-classification>  
        <further-classification edition="200601120260324B">C08K3/22</further-classification>  
        <further-classification edition="200601120260324B">C07C51/225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商哈尼威爾國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONEYWELL INTERNATIONAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖露</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIO, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀詩銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, SHIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種相變熱界面材料，其包括導熱填料、相變蠟、偶合劑、及聚合物基質材料。基於該相變熱界面材料之總重量，該導熱填料包括自約50 wt. %至約70 wt. %鋁粉；自約19 wt. %至約30 wt. %氧化鋁；以及自約1 wt. %至約9 wt. %氧化鋅。該相變熱界面材料具有自約0.02℃cm&lt;sup&gt;2&lt;/sup&gt;/W至約0.04℃cm&lt;sup&gt;2&lt;/sup&gt;/W的熱阻抗，如由ASTM D5470判定的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A phase change thermal interface material including a thermally conductive filler, a phase change wax, a coupling agent, and a polymer matrix material. The thermally conductive filler includes from about 50 wt. % to about 70 wt. % aluminum powder; from about 19 wt. % to about 30 wt. % aluminum oxide; and from about 1 wt. % to about 9 wt. % zinc oxide, based on the total weight of the phase change thermal interface material. The phase change thermal interface material has a thermal impedance from about 0.02 °Ccm&lt;sup&gt;2&lt;/sup&gt;/W to about 0.04 °Ccm&lt;sup&gt;2&lt;/sup&gt;/W, as determined by ASTM D5470.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:熱界面材料</p>  
        <p type="p">10B:熱界面材料</p>  
        <p type="p">32:散熱片</p>  
        <p type="p">34:電子晶片</p>  
        <p type="p">36:散熱器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1252" publication-number="202628171"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628171.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種電漿處理設備及其射頻控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H01J37/32</main-classification>  
        <further-classification edition="200601120260318B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　如彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電漿處理設備及其射頻控制裝置，通過向承載待處理基片的基座施加偏置射頻功率，在基片表面形成偏置電壓，對電漿中離子到達基片的能量進行控制。射頻控制裝置中，由一個或多個射頻信號發生器提供的射頻信號，通過電阻傳遞到功率放大器進行放大；第一二極體的第一端連接至電阻與功率放大器輸入端之間，第一二極體的第二端接地或連接第一直流電壓源，對射頻信號進行篩選整形。本發明可以針對電漿處理工藝的要求，對元件選擇及其佈置方式等進行調控，以精確控制射頻控制裝置的輸出信號，產生工藝所需的脈衝波形，對離子能量分佈函數進行有效控制，獲得理想的基片處理效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基座</p>  
        <p type="p">C:電容</p>  
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;、D&lt;sub&gt;2&lt;/sub&gt;、D&lt;sub&gt;3&lt;/sub&gt;:二極體</p>  
        <p type="p">DC&lt;sub&gt;2&lt;/sub&gt;:直流電壓源</p>  
        <p type="p">n&lt;sub&gt;1&lt;/sub&gt;:第一節點</p>  
        <p type="p">n&lt;sub&gt;2&lt;/sub&gt;:第二節點</p>  
        <p type="p">PA:功率放大器</p>  
        <p type="p">R:電阻</p>  
        <p type="p">RF&lt;sub&gt;1&lt;/sub&gt;、RF&lt;sub&gt;2&lt;/sub&gt;、RF&lt;sub&gt;3&lt;/sub&gt;:射頻信號發生器</p>  
        <p type="p">w:基片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1253" publication-number="202628835"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628835.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體器件的蝕刻工藝</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P50/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳善龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種半導體器件的蝕刻工藝，至少包含以下步驟：提供一矽襯底，矽襯底放置於反應腔內；向反應腔內通入蝕刻氣體和鈍化氣體，對矽襯底進行蝕刻，以形成溝槽；蝕刻氣體為含鹵素氣體，鈍化氣體為C&lt;sub&gt;x&lt;/sub&gt;H&lt;sub&gt;y&lt;/sub&gt;F&lt;sub&gt;z&lt;/sub&gt;氣體，其中，x，y，z分別為碳、氫、氟的原子個數；鈍化氣體的流量隨著蝕刻時間脈衝式遞減。本發明的蝕刻工藝既保證了可以在溝槽的上半段形成符合標準的保護層，在溝槽的下半段不會產生不規則的形貌，使得半導體器件尺寸可控；又使得反應腔內總氣體量脈衝式減少，使得蝕刻作用和側壁保護作用更加精確。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1254" publication-number="202626952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態聚合聚酯樹脂及其製造方法</chinese-title>  
        <english-title>SOLID-STATE POLYMERIZED POLYESTER RESIN AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08L67/02</main-classification>  
        <further-classification edition="200601120260325B">C08L101/08</further-classification>  
        <further-classification edition="200601120260325B">C08L101/12</further-classification>  
        <further-classification edition="200601120260325B">C08G63/85</further-classification>  
        <further-classification edition="200601120260325B">C08J3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃多榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, DA-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳泫遇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYUN-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種固態聚合聚酯樹脂、其製備方法及由其製備之製品。由於該固態聚合聚酯樹脂具有成型過程及/或再循環過程中所需之結晶度，同時在製備過程中使熔合最小化，因此其可具有極佳的生產率、可成型性、可循環性及其類似性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a solid-state polymerized polyester resin, to a process for preparing the same, and to an article prepared therefrom. Since the solid-state polymerized polyester resin has a crystallinity required in a molding process and/or a recycling process while fusion is minimized during the preparation process, it can have excellent productivity, moldability, recyclability, and the like.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S(1),S(2),S(3):步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1255" publication-number="202628642"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628642.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置以及包括半導體裝置的資料儲存系統</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D62/10</main-classification>  
        <further-classification edition="202501120260302B">H10D64/20</further-classification>  
        <further-classification edition="202601120260302B">H10D88/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W10/00</further-classification>  
        <further-classification edition="200601120260302B">G11C7/18</further-classification>  
        <further-classification edition="200601120260302B">G11C7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李吉成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GILSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭率美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, SOLMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈載株</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIM, JAEJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昇埈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張韓星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, HANBYEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭洙贊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, SOOCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃賢永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, HYUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，其包括：一第一基體結構，其包括一基體及電路元件；以及一第二基體結構，其在該第一基體結構上，其中該第二基體結構包括：閘極電極，其在一第一方向上堆疊，層間絕緣層，其與該等閘極電極交替堆疊；通道結構，其延伸至該等閘極電極中且分別包括一通道層及在該通道層之一側表面上之一通道介電層；以及一源極結構，其在該等通道結構上且包括一水平區以及從該水平區延伸且接觸該通道層之一接觸區，其中該接觸區延伸至該等通道結構中之每一者之該通道介電層的一部分中，且該接觸區之一下表面係與該通道結構及該層間絕緣層接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes: a first substrate structure including a substrate and circuit elements and a second substrate structure on the first substrate structure, wherein the second substrate structure includes gate electrodes stacked in a first direction, interlayer insulating layers alternately stacked with the gate electrodes, channel structures that extend into the gate electrodes and respectively include a channel layer and a channel dielectric layer on a side surface of the channel layer, and a source structure that is on the channel structures and includes a horizontal region and a contact region extending from the horizontal region and contacting the channel layer, where the contact region extend into a portion of the channel dielectric layer of each of the channel structures, and a lower surface of the contact region is in contact with the channel structure and the interlayer insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">120:層間絕緣層</p>  
        <p type="p">120_L:最下層間絕緣層</p>  
        <p type="p">120_M:中間層間絕緣層</p>  
        <p type="p">120_U:最上層間絕緣層</p>  
        <p type="p">130:閘極電極、上閘極電極、下閘極電極</p>  
        <p type="p">140:通道層</p>  
        <p type="p">145:通道介電層</p>  
        <p type="p">147:通道隱埋絕緣層</p>  
        <p type="p">149:通道墊</p>  
        <p type="p">150:上絕緣層</p>  
        <p type="p">160:源極結構</p>  
        <p type="p">162:水平區</p>  
        <p type="p">164:接觸區</p>  
        <p type="p">170:柱</p>  
        <p type="p">180:位元線</p>  
        <p type="p">182:胞元接觸插塞</p>  
        <p type="p">184:胞元互連線</p>  
        <p type="p">190:胞元區絕緣層</p>  
        <p type="p">195:第二接合通孔</p>  
        <p type="p">198:第二接合墊</p>  
        <p type="p">201:基體</p>  
        <p type="p">205:源極/汲極區、雜質區</p>  
        <p type="p">210:元件隔離層</p>  
        <p type="p">220:電路元件</p>  
        <p type="p">222:電路閘極介電層</p>  
        <p type="p">224:間隔件層</p>  
        <p type="p">225:電路閘極電極</p>  
        <p type="p">270:電路接觸插塞、胞元接觸插塞、分開胞元接觸插塞</p>  
        <p type="p">280:電路互連線</p>  
        <p type="p">290:周邊區絕緣層、胞元區絕緣層</p>  
        <p type="p">295:第一接合通孔、第二接合通孔</p>  
        <p type="p">298:第一接合墊、第二接合墊</p>  
        <p type="p">299:第一接合絕緣層</p>  
        <p type="p">I-I’:切割線</p>  
        <p type="p">A:區</p>  
        <p type="p">CH:通道結構</p>  
        <p type="p">CH1:第一通道結構</p>  
        <p type="p">CH2:第二通道結構</p>  
        <p type="p">GS1:第一堆疊結構</p>  
        <p type="p">GS2:第二堆疊結構</p>  
        <p type="p">MS:分開區、閘極分開區</p>  
        <p type="p">S1:第一基體結構、第一半導體結構</p>  
        <p type="p">S2:第二基體結構、第二半導體結構</p>  
        <p type="p">SE:縫</p>  
        <p type="p">US:上分開區</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1256" publication-number="202626684"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626684.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127808</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經改質之共軛二烯系聚合物，製備彼之方法，以及包括彼之橡膠組成物</chinese-title>  
        <english-title>MODIFIED CONJUGATED DIENE-BASED POLYMER, METHOD FOR PREPARING THE SAME, AND RUBBER COMPOSITION INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F7/18</main-classification>  
        <further-classification edition="200601120260401B">C08C19/22</further-classification>  
        <further-classification edition="200601120260401B">C08C19/25</further-classification>  
        <further-classification edition="200601120260401B">C08F236/10</further-classification>  
        <further-classification edition="201801120260401B">C08K3/013</further-classification>  
        <further-classification edition="200601120260401B">C08L15/00</further-classification>  
        <further-classification edition="200601120260401B">B60C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慶煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, KYOUNG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹亨源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HYUNG WOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李羲承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HE SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善槿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUN KEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李周列</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JU YEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於高度分支及高分子量經改質之共軛二烯系聚合物，製備彼之方法，以及包括彼之橡膠組成物，以及提供經改質之共軛二烯系聚合物，製備彼之方法，以及包括彼之橡膠組成物，其中，經改質之共軛二烯系聚合物包括共軛二烯系單體衍生之單元，以及衍生自由式1所代表之化合物的改質部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a highly-branched and high molecular weight modified conjugated diene-based polymer, a method for preparing the same, and a rubber composition including the same, and provides a modified conjugated diene-based polymer, a method for preparing the same, and a rubber composition including the same, wherein the modified conjugated diene-based polymer includes a conjugated diene-based monomer-derived unit, and a modification portion derived from a compound represented by Formula 1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1257" publication-number="202628679"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628679.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D84/83</main-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202501120260302B">H10D30/62</further-classification>  
        <further-classification edition="202601120260302B">H10P10/00</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了半導體結構及其形成方法。示例性方法包括接收一個工件，該工件包括鰭狀結構和設置在鰭狀結構上方的虛設閘極堆疊。此鰭狀結構包括鰭狀基底、底部半導體堆疊、位於底部半導體堆疊上方的中間介電層以及頂部半導體堆疊。頂部和底部半導體堆疊均包括由犧牲層交錯的通道層。此方法還包括:使部分虛設閘極堆疊凹陷以形成溝槽，從而暴露鰭狀結構；從溝槽中去除頂部和底部半導體堆疊中的犧牲層；從溝槽中去除頂部和底部半導體堆疊中的通道層；以及在溝槽中沉積介電特徵。介電特徵環繞中間介電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor structures and methods of forming the same are provided. An exemplary method includes receiving a workpiece that includes a fin-shaped structure and a dummy gate stack disposed over the fin-shaped structure. The fin-shaped structure includes a fin-shaped base, a bottom semiconductor stack, a middle dielectric layer over the bottom semiconductor stack, and a top semiconductor stack. Each of the top and bottom semiconductor stacks including channel layers interleaved by sacrificial layers. The method further includes recessing a portion of the dummy gate stack to form a trench to expose the fin-shaped structure, removing the sacrificial layers in the top and bottom semiconductor stacks from the trench, removing the channel layers in the top and bottom semiconductor stacks from the trench, and depositing a dielectric feature in the trench. The dielectric feature wraps around the middle dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置(C-FET)</p>  
        <p type="p">10L:下部裝置</p>  
        <p type="p">10U:上部裝置</p>  
        <p type="p">26’L:通道層</p>  
        <p type="p">26’U:通道層</p>  
        <p type="p">62L:源極/汲極特徵</p>  
        <p type="p">62U:源極/汲極特徵</p>  
        <p type="p">78:閘極介電層</p>  
        <p type="p">80L:閘電極層</p>  
        <p type="p">80U:閘電極層</p>  
        <p type="p">90:隔離層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1258" publication-number="202627391"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627391.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三層式散熱結構及使用其之散熱器</chinese-title>  
        <english-title>THREE-LAYER HEAT DISSIPATION STRUCTURE AND HEAT SINK USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">F28F1/10</main-classification>  
        <further-classification edition="200601120260202B">F28F21/02</further-classification>  
        <further-classification edition="200601120260202B">F28F21/06</further-classification>  
        <further-classification edition="200601120260202B">F28F21/08</further-classification>  
        <further-classification edition="200601120260202B">B32B15/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立聯合大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNITED UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明新學校財團法人明新科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINGHSIN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾仕君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, SHIH CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宏營</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HUNG-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翼弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王進安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宇晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, YU CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三層式散熱結構包含：一鋁基材料層；一複合材料層，位於鋁基材料層上，並且包含燒結在一起的碳材料和不鏽鋼材料；及一碳層，位於複合材料層上。一種使用上述三層式散熱結構的散熱器亦一併提供，以在增強結構強度的情況下，改善散熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-layer heat dissipation structure comprises: an aluminum-based material layer; a composite material layer being positioned on the aluminum-based material layer and comprising a carbon material and a stainless steel material that are sintered together; and a carbon layer positioned on the composite material layer. A heat sink utilizing the aforementioned three-layer heat dissipation structure is also provided to improve heat dissipation efficiency while enhancing structural strength.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Y、Z:座標軸</p>  
        <p type="p">10:鋁基材料層</p>  
        <p type="p">20:複合材料層</p>  
        <p type="p">30:碳層</p>  
        <p type="p">100:三層式散熱結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1259" publication-number="202628704"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628704.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢測及計量之具有正弦重置、雜訊消除及非脈衝電荷轉移之影像感測器</chinese-title>  
        <english-title>IMAGE SENSORS WITH SINUSOIDAL RESET, NOISE CANCELLATION, AND NON-PULSED CHARGE TRANSFER FOR INSPECTION AND METROLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10F39/15</main-classification>  
        <further-classification edition="202501120260325B">H10F39/18</further-classification>  
        <further-classification edition="202301120260325B">H04N25/60</further-classification>  
        <further-classification edition="202301120260325B">H04N25/711</further-classification>  
        <further-classification edition="202301120260325B">H04N25/768</further-classification>  
        <further-classification edition="202301120260325B">H04N25/773</further-classification>  
        <further-classification edition="202301120260325B">H04N25/75</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　勇和　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YUNG-HO ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康塔多　迪維斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONTARATO, DEVIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾登　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIELDEN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種影像感測器。該影像感測器可包含經電連接至電路之至少一個電路之複數個感測節點，該等感測節點相鄰於該等電路形成於一矽層之第一側上。各感測節點可包含經連接至該等電路之至少一個通道之一者及一輸出電路之一浮動擴散結構。各感測節點可包含經組態以自該浮動擴散結構移除一電荷之一電荷重置結構。各感測節點可包含相鄰於該浮動擴散結構且經組態以由一雜訊消除信號驅動之一雜訊消除閘極電極。該影像感測器可包含經組態用於直流電或非脈衝信號之至少一者之一電阻閘極電極。各感測節點之一電荷重置結構可用依循一正弦波形之一電壓驅動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensor is disclosed. The image sensor may include a plurality of sensing nodes electrically connected to at least one circuit of the circuits, the sensing nodes formed on the first side of a silicon layer adjacent to the circuits. Each sensing node may include a floating diffusion structure connected to one of at least one channel of the circuits and an output circuit. Each sensing node may include a charge reset structure configured to remove a charge from the floating diffusion structure. Each sensing node may include a noise-cancellation gate electrode adjacent to the floating diffusion structure and configured to be driven by a noise-cancellation signal. The image sensor may include a resistive gate electrode configured for at least one of direct current or non-pulsed signals. A charge reset structure of each sensing node may be driven with a voltage following a sinusoidal waveform.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:矽層/矽磊晶層</p>  
        <p type="p">203:薄p+層</p>  
        <p type="p">204:通道</p>  
        <p type="p">205:p+層</p>  
        <p type="p">206:源極及汲極植入物</p>  
        <p type="p">207:通道植入物</p>  
        <p type="p">208:介電層</p>  
        <p type="p">208a:結構</p>  
        <p type="p">209:閘極介電質</p>  
        <p type="p">210:閘極電極</p>  
        <p type="p">211:電連接</p>  
        <p type="p">212:電連接</p>  
        <p type="p">215:電連接</p>  
        <p type="p">216:電連接</p>  
        <p type="p">217:電連接</p>  
        <p type="p">220:閘極電極</p>  
        <p type="p">221:電連接</p>  
        <p type="p">222:閘極電極</p>  
        <p type="p">223:電連接</p>  
        <p type="p">224:閘極電極</p>  
        <p type="p">225:電連接</p>  
        <p type="p">226:閘極電極</p>  
        <p type="p">227:電連接</p>  
        <p type="p">250:感測節點</p>  
        <p type="p">251:電連接</p>  
        <p type="p">252:重置閘極電極</p>  
        <p type="p">253:電連接</p>  
        <p type="p">255:汲極</p>  
        <p type="p">256:電連接</p>  
        <p type="p">257:雜訊消除閘極電極</p>  
        <p type="p">258:區域</p>  
        <p type="p">259:電連接</p>  
        <p type="p">260:影像感測器</p>  
        <p type="p">270:緩衝閘極電極/電阻閘極電極</p>  
        <p type="p">271:電連接</p>  
        <p type="p">272:電連接</p>  
        <p type="p">275:閘極電極</p>  
        <p type="p">276:電連接</p>  
        <p type="p">280:後側塗層</p>  
        <p type="p">299:光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1260" publication-number="202627448"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627448.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>定量方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260325B">G01N21/35</main-classification>  
        <further-classification edition="200601120260325B">G01N1/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤一臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KAZUOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平原均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAHARA, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種在樣品測定時被檢物質的量會在測定裝置內增減此類測定體系中，更正確地對被檢物質進行定量的方法。一種定量方法，其為對包含被檢物質的樣品中的該被檢物質進行定量的方法，其中其包括：(1)使用測定裝置對同一所述樣品進行多次測定，得到所述樣品中的所述被檢物質的多個定量值的工序；及，(2)由所述多個定量值計算出由所述測定裝置帶來的所述被檢物質的增減量，利用所述增減量對所述多個定量值中的至少1個進行修正，得到所述被檢物質的真實的定量值的工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1261" publication-number="202628014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬幣收納單元及硬幣處理裝置</chinese-title>  
        <english-title>COIN STORAGE UNIT AND COIN PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260319B">G07D11/32</main-classification>  
        <further-classification edition="201901120260319B">G07D11/18</further-classification>  
        <further-classification edition="201901120260319B">G07D11/235</further-classification>  
        <further-classification edition="200601120260319B">G07D3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本金錢機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志原開</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIHARA, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川慶騎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種硬幣收納單元(151)、(152)，其為具有用以儲存每個種類的硬幣用之複數個收納空間(1511)、(1512)。硬幣收納單元具備有：記憶硬幣之每個種類的排出個數、硬幣收納單元之馬達(153)的旋轉數、硬幣收納單元的版本資訊中之至少任一種的記憶體(1712)；以及用以與安裝有硬幣收納單元之硬幣處理裝置(100)的控制單元(190)進行數據連接用之通訊連接器(1713)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides coin storage units (151), (152), which comprise a plurality of storage spaces (1511), (1512) for stocking coins by type. The coin storage units are provided with a memory (1712) for storing at least one of the number of coins to be dispensed by type, the number of rotations of the motor (153) of the coin storage unit, and version information of the coin storage unit, and a communication connector (1713) for data connection with the control unit (190) of the coin processing device (100) in which the coin storage units are set.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:硬幣處理裝置</p>  
        <p type="p">151:上收納單元</p>  
        <p type="p">152:下收納單元</p>  
        <p type="p">153:馬達</p>  
        <p type="p">157:螺線管</p>  
        <p type="p">158Y:硬幣偵測感測器</p>  
        <p type="p">171:記憶單元</p>  
        <p type="p">1712:記憶體</p>  
        <p type="p">1713:連接器</p>  
        <p type="p">1714:連接器</p>  
        <p type="p">190:控制基板</p>  
        <p type="p">191:CPU</p>  
        <p type="p">192:記憶體</p>  
        <p type="p">193:連接器</p>  
        <p type="p">194:連接器</p>  
        <p type="p">196:通訊介面</p>  
        <p type="p">200:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1262" publication-number="202628742"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628742.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127984</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設備、其製造方法及包含其之電子設備</chinese-title>  
        <english-title>DISPLAY APPARATUS, ELECTRONIC APPARATUS INCLUDING DISPLAY APPARATUS, AND METHOD OF MANUFACTURING DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">H10H29/80</main-classification>  
        <further-classification edition="202501120260401B">H10H29/39</further-classification>  
        <further-classification edition="202501120260401B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全亨一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, HYUNGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李揆汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GYUJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太昌一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAE, CHANGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種顯示設備，包含：一遮罩層，該遮罩層包含彼此分隔開設置的一第一遮罩層及一第二遮罩層；一基板，設置在該第一遮罩層及該第二遮罩層上；一像素電路層，設置在該基板上，並且與該第一遮罩層重疊；一布線層，設置在該基板上，並且與該第二遮罩層重疊；以及一發光二極體，設置在該像素電路層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a display apparatus including a mask layer including a first mask layer and a second mask layer disposed apart from each other, a substrate disposed on the first mask layer and the second mask layer, a pixel circuit layer which is disposed on the substrate and overlaps the first mask layer, a wiring layer which is disposed on the substrate and overlaps the second mask layer, and a light-emitting diode which is disposed on the pixel circuit layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示設備</p>  
        <p type="p">100:基板</p>  
        <p type="p">101:第一基底層</p>  
        <p type="p">102:第一障蔽層</p>  
        <p type="p">103:第二基底層</p>  
        <p type="p">104:第二障蔽層</p>  
        <p type="p">11:第一島部分</p>  
        <p type="p">111:緩衝層</p>  
        <p type="p">113:閘極絕緣層</p>  
        <p type="p">115:第一層間絕緣層</p>  
        <p type="p">117:第二層間絕緣層</p>  
        <p type="p">119:第一有機絕緣層</p>  
        <p type="p">12:第一橋部分</p>  
        <p type="p">121:第二有機絕緣層</p>  
        <p type="p">123:第三有機絕緣層</p>  
        <p type="p">230:無機發光二極體</p>  
        <p type="p">231:第一半導體層</p>  
        <p type="p">232:第二半導體層</p>  
        <p type="p">233:中間層</p>  
        <p type="p">235:第一電極</p>  
        <p type="p">238:第二電極</p>  
        <p type="p">241:第一電極焊墊</p>  
        <p type="p">242:第二電極焊墊</p>  
        <p type="p">Act:半導體層</p>  
        <p type="p">CE1:第一電極</p>  
        <p type="p">CE2:第二電極</p>  
        <p type="p">CM1:第一連接電極</p>  
        <p type="p">CM2:第二連接電極</p>  
        <p type="p">CS1:第一開口</p>  
        <p type="p">Cst:儲存電容器</p>  
        <p type="p">DE:汲極電極</p>  
        <p type="p">GE:閘極電極</p>  
        <p type="p">IOL:無機絕緣層</p>  
        <p type="p">LED:發光二極體</p>  
        <p type="p">MLY:遮罩層</p>  
        <p type="p">MLY1:第一遮罩層</p>  
        <p type="p">MLY2:第二遮罩層</p>  
        <p type="p">OL:絕緣層</p>  
        <p type="p">PC:像素驅動電路</p>  
        <p type="p">PCL:像素電路層</p>  
        <p type="p">SE:源極電極</p>  
        <p type="p">TFT:薄膜電晶體</p>  
        <p type="p">VSSL:第二電壓線</p>  
        <p type="p">WL:布線</p>  
        <p type="p">WL1:第一布線</p>  
        <p type="p">WL2:第二布線</p>  
        <p type="p">WL3:第三布線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1263" publication-number="202628172"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628172.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體製造設施廢氣處理的電感耦合等離子反應器</chinese-title>  
        <english-title>INDUCTIVELY COUPLED PLASMA REACTOR FOR EXHAUST GAS TREATMENT OF SEMICONDUCTOR MANUFACTURING FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251205B">H01J37/32</main-classification>  
        <further-classification edition="200601120251205B">B01D53/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＯＴ　ＣＥＳ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOT CES CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵辰鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JIN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻材</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MIN JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李侑珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金亨俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，提供一種用於一半導體製造設施的廢氣處理的一電感耦合等離子反應器，該電感耦合等離子反應器透過產生電感耦合等離子來處理從一半導體製程腔室排放的廢氣，其中，該半導體製程腔室利用製程氣體進行一半導體製造製程。該電感耦合等離子反應器包含：一腔室主體；以及一點火器，安裝在該腔室主體中並激發等離子。其中，該腔室主體包含彼此間隔開的一氣體入口及一氣體出口，以及一第一連接管路部分及一第二連接管路部分，係在一寬度方向上彼此間隔開並將該氣體入口連通至該氣體出口。一氣體入口通道形成在該氣體入口處，而一氣體出口通道形成在該氣體出口處；一第一連接通道形成在該第一連接管路部分，一第二連接通道形成在該第二連接管路部分，並且該點火器位於該氣體入口或該氣體出口的該寬度方向上的該第一連接通道及該第二連接通道的外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to the present invention, there is provided an inductively coupled plasma reactor for exhaust gas treatment of a semiconductor manufacturing facility, as an inductively coupled plasma reactor which treats the exhaust gas discharged from a semiconductor process chamber in which a semiconductor manufacturing process using process gases is to be performed, by generating inductively coupled plasma, the inductively coupled plasma reactor including: a chamber body; and an igniter installed in the chamber body and igniting plasma, wherein the chamber body includes a gas inlet and a gas outlet, which are spaced apart from each other, and a first connection pipe portion and a second connection pipe portion, which are spaced apart from each other in a width direction and connect the gas inlet to the gas outlet, and a gas inlet passage is formed in the gas inlet, and a gas outlet passage is formed in the gas outlet, and a first connection passage is formed in the first connection pipe portion, and a second connection passage is formed in the second connection pipe portion, and the igniter is positioned outside the first connection passage and the second connection passage in the width direction in the gas inlet or the gas outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:等離子反應腔室</p>  
        <p type="p">120:腔室主體</p>  
        <p type="p">130:氣體入口</p>  
        <p type="p">131:氣體入口通道</p>  
        <p type="p">132:入口側通道分隔部分</p>  
        <p type="p">140:氣體出口</p>  
        <p type="p">155:蓋子</p>  
        <p type="p">160:第二連接管路部分</p>  
        <p type="p">120a:第一腔室主體</p>  
        <p type="p">120b:第二腔室主體</p>  
        <p type="p">133b:入口側後階梯部分</p>  
        <p type="p">A,A',B,B':線</p>  
        <p type="p">F:前後方向</p>  
        <p type="p">H:高度方向</p>  
        <p type="p">W:寬度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1264" publication-number="202629004"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629004.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超低輪廓ＲＤＬ層疊封裝</chinese-title>  
        <english-title>ULTRA LOW PROFILE RDL PACKAGE-ON-PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10W70/05</main-classification>  
        <further-classification edition="202601120260317B">H10W70/652</further-classification>  
        <further-classification edition="202601120260317B">H10W74/10</further-classification>  
        <further-classification edition="202601120260317B">H10W74/01</further-classification>  
        <further-classification edition="202601120260317B">H10W90/22</further-classification>  
        <further-classification edition="202601120260317B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比拉吉　阿克夏伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BILAGI, AKSHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維穆拉　洛希特　庫馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEMULA, LOHITH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尚杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG-JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示半導體封裝。一種半導體封裝可包括：第一晶粒，其由模具囊封；及第二晶粒，其直接位於該模具上。一或多個導電柱可在該模具中形成。可在該模具的下表面上提供前側重分布層(RDL)。該第一晶粒與該第二晶粒之間的電信號可透過該等柱及該前側RDL承載。不需要背側RDL及背側球柵陣列。此可顯著降低該半導體封裝的高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are semiconductor packages. A semiconductor package may include a first die encapsulated by a mold, and a second die directly on the mold. One or more conductive posts may be formed in the mold. A frontside redistribution layer (RDL) may be provided on a lower surface of the mold. Electrical signals between the first and second dies may be carried through the posts and the frontside RDL. There is no need for backside RDL and backside ball grid array. This can significantly reduce the height of the semiconductor package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:半導體封裝</p>  
        <p type="p">210:第一晶粒</p>  
        <p type="p">215:第一晶粒凸塊</p>  
        <p type="p">220:柱</p>  
        <p type="p">230:模具</p>  
        <p type="p">240:前側重分布層</p>  
        <p type="p">242:前側金屬層</p>  
        <p type="p">244:前側鈍化層</p>  
        <p type="p">250:前側球柵陣列</p>  
        <p type="p">252:前側球柵陣列球</p>  
        <p type="p">280:第二晶粒</p>  
        <p type="p">285:第二晶粒凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1265" publication-number="202626536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃製造設備、其電氣法蘭及密封方法</chinese-title>  
        <english-title>GLASS MANUFACTURING APPARATUS, ELECTRICAL FLANGES THEREFOR, AND METHODS OF SEALING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C03B7/07</main-classification>  
        <further-classification edition="200601120260316B">C03B5/435</further-classification>  
        <further-classification edition="200601120260316B">C03B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金振洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　艾瑞克李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, ERIC LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕爾默　布萊恩邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALMER, BRIAN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種玻璃製造設備包括一導管，該導管上附接有一電氣法蘭，該電氣法蘭具有一第一環及一第二環，該第一環由一第一金屬形成，該第二環在該第一環內部、附接至該導管上且由不同於該第一金屬之一第二金屬形成。該第二環包括一第一部分、一第二部分及一第三部分，該第三部分將該第一部分與該第二部分接合且經組態以使得該第一部分之一平面與該第二部分之一平面間隔開，並且其中該第三部分之一線性部分與該第一部分之該平面形成的一角度在約115度至約125度之一範圍內。亦揭示了一種接合一玻璃製造設備之子系統的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass manufacturing apparatus includes a conduit with an electrical flange attached to the conduit, the electrical flange having a first ring formed from a first metal and a second ring inside the first ring, attached to the conduit, and formed from a second metal different from the first metal. The second ring includes a first portion, a second portion, and a third portion joining the first portion to the second portion and configured such that a plane of the first portion is spaced apart from a plane of the second portion, and wherein an angle of a linear part of the third portion forms an angle with the plane of the first portion in an range from about 115 degrees to about 125 degrees. A method of joining subsystems of a glass manufacturing apparatus is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">80:電氣法蘭</p>  
        <p type="p">82:主體部分</p>  
        <p type="p">84:電極部分</p>  
        <p type="p">86:導管</p>  
        <p type="p">88:連接點</p>  
        <p type="p">90:電導體</p>  
        <p type="p">92:第一最外部環/第一環</p>  
        <p type="p">94:第二最內部環/第二環</p>  
        <p type="p">96:冷卻裝置/冷卻管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1266" publication-number="202626316"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626316.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用廢舊輪胎製造橡膠精粉的方法和設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR MANUFACTURING REFINED RUBBER POWDER BY USING WASTE TIRES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250814B">B29B17/02</main-classification>  
        <further-classification edition="200601120250814B">B29B17/04</further-classification>  
        <further-classification edition="202201120250814B">B09B3/30</further-classification>  
        <further-classification edition="202201120250814B">B09B3/35</further-classification>  
        <further-classification edition="200601120250814B">B02C19/06</further-classification>  
        <further-classification edition="202201320250814B">B09B101/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商青島鑫聚路資源科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高行遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路凌俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種利用廢舊輪胎製造橡膠精粉的方法和設備，屬於膠粉製造技術領域，為了解決現有機械粉碎後橡膠粉中鐵屑雜質含量高的問題，所述利用廢舊輪胎製造橡膠精粉的方法依次包括以下步驟：步驟1、將廢舊輪胎從胎側與胎肩之間分離，得到輪胎環帶；步驟2、破碎水刀對輪胎環帶施加水射流，並切割出絮狀橡膠結構；磨削組件對輪胎環帶表面的所述絮狀橡膠結構磨削，形成橡膠精粉。所述利用廢舊輪胎製造橡膠精粉的方法將水射流破碎和磨削破碎相結合，能夠高效的利用廢舊輪胎進行橡膠粉加工，並且製得的橡膠粉鐵屑雜質含量低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a method and an apparatus for manufacturing refined rubber powder by using waste tires, and belongs to the technical field of rubber powder manufacturing. In order to solve the problem of a high content of scrap iron impurities in existing rubber powder after mechanical crushing, the method for manufacturing refined rubber powder by using waste tires sequentially includes the following steps: step 1, separating the waste tires from the sidewall and shoulder of the tires to obtain a tire circumferential belt; step 2, applying a water jet to the tire circumferential belt by a water jet crusher, and cutting out a flocculent rubber structure; and grinding the flocculent rubber structure on the surface of the tire circumferential belt by using a grinding assembly to form refined rubber powder. The method for manufacturing refined rubber powder by using waste tires combines water jet crushing and grinding crushing, so that the waste tires can be efficiently used for processing rubber powder, and the content of scrap iron impurities in the prepared rubber powder is low.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">71:活動輥軸</p>  
        <p type="p">72:固定輥軸</p>  
        <p type="p">91:破碎水刀</p>  
        <p type="p">1001:磨削輪</p>  
        <p type="p">1103:輪胎環帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1267" publication-number="202627984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理器實施方法及具有影像品質評估之設備</chinese-title>  
        <english-title>PROCESSOR-IMPLEMENTED METHOD AND APPARATUS WITH IMAGE QUALITY ASSESSMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">G06T7/00</main-classification>  
        <further-classification edition="201901120251201B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇世煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KI, SEHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺榮鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YOUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康恩熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, EUNHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫智秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JISOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炯旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYONG EUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有影像品質評估之方法及設備。一種方法包括：基於對應於不同品質等級及相關視覺資訊的一影像對之第一模態資料產生一第一模態特徵；基於該第一模態資料，產生對應於預定品質指數之一第一相對品質值；產生對應於基於該第一相對品質值之一查詢的第二模態資料；基於該第一模態特徵及第二模態特徵，自包含第一影像品質評估資料之片段之一資料集擷取第二影像品質評估資料之至少一個片段，其中該第二模態特徵係基於該第二模態資料而產生；藉由將該第一模態特徵及該第二模態特徵以及該第二影像品質評估資料之至少一個片段應用於一擴增型語言模型，產生對應於該影像對之第三影像品質評估資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus with image quality assessment are provided. A method includes generating a first modality feature based first modality data corresponding to an image pair of different levels of quality and related visual information, generating, based on the first modality data, a first relative quality value corresponding to predetermined quality indices, generating second modality data corresponding to a query that is based on the first relative quality value, retrieving, based on the first and second modality features, at least one piece of second image quality assessment data from a dataset comprising pieces of first image quality assessment data, where the second modality feature is generated based on the second modality data, generating third image quality assessment data corresponding to the image pair by applying the first and second modality features and the at least one piece of second image quality assessment data to an augmented language model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:計算設備</p>  
        <p type="p">205:影像對，第一模態資料，第一模態</p>  
        <p type="p">205-1:影像，第一影像</p>  
        <p type="p">205-2:影像，第二影像</p>  
        <p type="p">210:影像品質評估模型，影像評估模型</p>  
        <p type="p">215:第一相對品質值</p>  
        <p type="p">220:提示模型</p>  
        <p type="p">225:第二模態資料</p>  
        <p type="p">230:文字編碼模型，文字編碼模組，提示模型</p>  
        <p type="p">235:第二模態特徵</p>  
        <p type="p">240:影像編碼模型，影像編碼模組</p>  
        <p type="p">245:第一模態特徵</p>  
        <p type="p">250:資料集</p>  
        <p type="p">260:多模態擷取模型，多模型擷取模型</p>  
        <p type="p">265:第二影像品質評估資料</p>  
        <p type="p">270:擴增型語言模型</p>  
        <p type="p">275:第三影像品質評估資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1268" publication-number="202628680"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628680.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202501120260327B">H10D64/20</further-classification>  
        <further-classification edition="202601120260327B">H10W20/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔瀚結</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HANGYEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張星旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SUNGUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金容塡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YONGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安商燻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, SANGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安星柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, SUNGJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李敏卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINKYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李禹鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WOOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括：一基體；電晶體結構，其在該基體上；一層間絕緣層，其覆蓋該等電晶體結構；以及一佈線結構，其在該層間絕緣層上，其中該佈線結構包含：複數個佈線層，其在一第一方向上彼此間隔開，其中該第一方向平行於該基體之一表面；一分開結構，其在該等複數個佈線層中之一對鄰近佈線層之間，其中該分開結構包含一下分開圖案及一上分開圖案，其中該上分開圖案在該下分開圖案上面；以及一接觸通孔，其在該對鄰近佈線層中之一第一佈線層上，其中該下分開圖案之一上表面包括朝向該層間絕緣層之一上表面彎曲之一碟形區，且其中該上分開圖案在由該碟形區形成之一凹部內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate, transistor structures on the substrate, an interlayer insulating layer covering the transistor structures, and a wiring structure on the interlayer insulating layer, wherein the wiring structure comprises a plurality of wiring layers spaced apart from each other in a first direction, wherein the first direction is parallel to a surface of the substrate, a separation structure between a pair of adjacent wiring layers of the plurality of wiring layers, wherein the separation structure comprises a lower separation pattern and an upper separation pattern, wherein the upper separation pattern is above the lower separation pattern, and a contact via on a first wiring layer of the pair of adjacent wiring layers, wherein an upper surface of the lower separation pattern includes a dishing region that is curved toward an upper surface of the interlayer insulating layer, and wherein the upper separation pattern is within a recess formed by the dishing region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基體</p>  
        <p type="p">100:電晶體結構</p>  
        <p type="p">140:通道圖案</p>  
        <p type="p">141:覆蓋層</p>  
        <p type="p">142:閘極間隔件</p>  
        <p type="p">150:源極/汲極圖案</p>  
        <p type="p">160:閘極結構</p>  
        <p type="p">161,161a:子閘極結構</p>  
        <p type="p">161b:子閘極絕緣層</p>  
        <p type="p">163:主閘極結構</p>  
        <p type="p">163a:主閘極電極</p>  
        <p type="p">163b:主閘極絕緣層</p>  
        <p type="p">177,277:層間絕緣層</p>  
        <p type="p">191:接觸電極</p>  
        <p type="p">193,293:接觸通孔</p>  
        <p type="p">251:下分開圖案</p>  
        <p type="p">253:上分開圖案</p>  
        <p type="p">257:第二絕緣襯裡</p>  
        <p type="p">281:黏合層</p>  
        <p type="p">285:第一絕緣襯裡</p>  
        <p type="p">286:蝕刻停止層</p>  
        <p type="p">289:障壁層</p>  
        <p type="p">291:佈線層</p>  
        <p type="p">A:區</p>  
        <p type="p">AG:空氣間隙</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1269" publication-number="202626330"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626330.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128180</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加工模具</chinese-title>  
        <english-title>PROCESSING MOLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250910B">B29C45/26</main-classification>  
        <further-classification edition="200601120250910B">B29C45/33</further-classification>  
        <further-classification edition="200601120250910B">B29C45/40</further-classification>  
        <further-classification edition="201901120250910B">B29C48/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝冠魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, GUANKUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種加工模具，其包括上模和下模，用於加工零件，零件放置於下模，且零件側面設有朝向下模延伸的翻邊，加工模具還包括斜頂、平移組件和分模組件，斜頂包括座體和沿豎直方向滑動設於座體的成型段，成型段朝向上模設置，並與翻邊的形狀適配；平移組件沿水平方向滑動設於下模，座體沿水平方向滑動設於平移組件；分模組件驅動平移組件相對於座體水平移動，以使成型段沿豎直方向與翻邊分離，並驅動平移組件和座體相對於下模移動，以使斜頂沿水平方向遠離零件。本發明可加工形成具有朝向下側延伸的翻邊的零件，同時實現水平後退脫模。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a processing mold. The processing mold includes an upper mold and a lower mold, which are used to process a part. The part is positioned on the lower mold, and the side of the part is provided with a flanging extending toward the lower mold. The processing mold also includes a sloping top, a translation component and a parting component. The sloping top includes a base and a forming segment slidably disposed on the base along a vertical direction. The forming segment is disposed toward the upper mold, and the shape of the forming segment is matched to the shape of the flanging. The translation component is slidably disposed on the lower mold along a horizontal direction. The base is slidably disposed on the translation component along the horizontal direction. The parting component drives the translation component to move horizontally relative to the base. So that the forming segment is separated from the flanging along the vertical direction. The translation component and the base are driven to move relative to the lower mold. So that the sloping top is moved away from the part. The disclosure processes and forms the part with the flanging extending toward the lower mold, and achieves horizontal demolding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:零件</p>  
        <p type="p">11:翻邊</p>  
        <p type="p">110:上模</p>  
        <p type="p">120:下模</p>  
        <p type="p">200:斜頂</p>  
        <p type="p">210:座體</p>  
        <p type="p">220:成型段</p>  
        <p type="p">230:傾斜段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1270" publication-number="202628700"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628700.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128222</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括在影像感測器中的具有垂直傳輸閘極的畫素</chinese-title>  
        <english-title>PIXEL INCLUDED IN IMAGE SENSOR AND HAVING VERTICAL TRANSFER GATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10F39/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冨田隆治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMITA, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山智史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上郁子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, IKUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包括在影像感測器中的畫素包括半導體基板、介電層、光電二極體、浮置擴散區以及垂直傳輸閘極。所述介電層設置在所述半導體基板上。所述光電二極體形成在所述半導體基板中。所述浮置擴散區形成在所述半導體基板中且與所述光電二極體分離。所述垂直傳輸閘極設置為耦合所述光電二極體至所述浮置擴散區，且進一步設置為從所述介電層延伸深度進入所述半導體基板中，其中所述垂直傳輸閘極包括導電材料和圍繞所述導電材料的閘極介電層，且所述閘極介電層設置在所述半導體基板中並與所述半導體基板的表面齊平。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel included in an image sensor includes a semiconductor substrate, a dielectric layer, a photodiode, a floating diffusion and a vertical transfer gate. The dielectric layer is disposed on the semiconductor substrate. The photodiode is formed in the semiconductor substrate. The floating diffusion is formed in the semiconductor substrate and separated from the photodiode. The vertical transfer gate is disposed coupling the photodiode to the floating diffusion and further disposed extending from the dielectric layer a depth into in the semiconductor substrate, wherein the vertical transfer gate includes a conductive material and a gate dielectric surrounding the conductive material, and the gate dielectric is disposed in the semiconductor substrate and levelled with a surface of the semiconductor substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:導電材料</p>  
        <p type="p">30a:底面</p>  
        <p type="p">30s,116s:側壁</p>  
        <p type="p">32:閘極介電層</p>  
        <p type="p">32a:上表面</p>  
        <p type="p">32s:側壁</p>  
        <p type="p">34:閘極電極</p>  
        <p type="p">36:閘極絕緣層</p>  
        <p type="p">42:接點</p>  
        <p type="p">42a:第一表面</p>  
        <p type="p">42b:第二表面</p>  
        <p type="p">44:介電層</p>  
        <p type="p">44a,44b,116a:表面</p>  
        <p type="p">48:鈍化層</p>  
        <p type="p">50:淺溝渠隔離件</p>  
        <p type="p">60:半導體基板</p>  
        <p type="p">101:影像感測器</p>  
        <p type="p">104:畫素</p>  
        <p type="p">114:光電二極體</p>  
        <p type="p">116b:剖面表面</p>  
        <p type="p">116G:閘極</p>  
        <p type="p">117A:第一部分</p>  
        <p type="p">117B:第二部分</p>  
        <p type="p">118:浮置擴散區</p>  
        <p type="p">119:介面</p>  
        <p type="p">D1:距離</p>  
        <p type="p">IN:介面/表面</p>  
        <p type="p">LD:橫向距離</p>  
        <p type="p">M1:金屬配線</p>  
        <p type="p">W1,W2:橫向寬度</p>  
        <p type="p">θ:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1271" publication-number="202627442"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627442.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提高材料生產效能之雜質含量監測的方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR MONITORING IMPURITY CONTENT TO IMPROVE MATERIAL PRODUCTION EFFICIENCY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260401B">G01N15/075</main-classification>  
        <further-classification edition="200601120260401B">G01N1/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邑流微測股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLOWVIEW TEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鈺凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡幸芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIN-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提高材料生產效能之雜質含量監測的方法，包括：剝除一金屬塊的表層的吸附性雜質與氧化物；以硝酸與鹽酸的混合溶液溶解金屬塊，但不溶解金屬塊中的雜質，以產生一待測液；使待測液通過一透明流道；以一光學系統記錄透明流道中的待測液的雜質的顆粒影像；以及利用影像辨識分析顆粒影像，並藉此統計金屬塊的單位質量所含的雜質的濃度。一種提高材料生產效能之雜質含量監測的裝置亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for monitoring impurity content to improve material production efficiency includes: removing adsorbent impurities and oxides on the surface of a metal block; dissolving the metal block with a mixed solution of nitric acid and hydrochloric acid but not dissolving impurities in the metal block to produce a test liquid; passing the test liquid through a transparent flow channel; recording a particle image of the impurities in the test liquid in the transparent flow channel with an optical system; and analyzing the particle image by image recognition to thereby calculate a concentration of impurities contained in a unit mass of the metal block. An apparatus for monitoring impurity content to improve material production efficiency is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">52:透明流道</p>  
        <p type="p">60:待測液</p>  
        <p type="p">70:液體出口</p>  
        <p type="p">300:提高材料生產效能之雜質含量監測的裝置</p>  
        <p type="p">310:透明流道裝置</p>  
        <p type="p">320:粒徑篩選裝置</p>  
        <p type="p">330:樣品容器</p>  
        <p type="p">332:液位偵測器</p>  
        <p type="p">340:三通管路切換閥</p>  
        <p type="p">350:泵浦</p>  
        <p type="p">360:空氣中粒子過濾器</p>  
        <p type="p">370:液體填滿偵測器</p>  
        <p type="p">400:光學系統</p>  
        <p type="p">410:光源</p>  
        <p type="p">412:光束</p>  
        <p type="p">420:空間光調制器</p>  
        <p type="p">430:物鏡</p>  
        <p type="p">440:空間濾波器</p>  
        <p type="p">442:第一透鏡</p>  
        <p type="p">444:針孔板</p>  
        <p type="p">446:第二透鏡</p>  
        <p type="p">450:陣列式光感測器</p>  
        <p type="p">460:消色差準直鏡</p>  
        <p type="p">510:處理器</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1272" publication-number="202626750"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626750.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為用於製備水性聚合物分散體之乳化劑的嵌段共聚物及所製得之聚合物分散體</chinese-title>  
        <english-title>BLOCK COPOLYMERS AS EMULSIFIERS FOR PREPARATION OF AQUEOUS POLYMER DISPERSIONS AND POLYMER DISPERSIONS AS SUCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08F2/20</main-classification>  
        <further-classification edition="200601120260325B">C08F2/38</further-classification>  
        <further-classification edition="200601120260325B">C08F287/00</further-classification>  
        <further-classification edition="200601120260325B">C08F293/00</further-classification>  
        <further-classification edition="200601120260325B">C08F8/40</further-classification>  
        <further-classification edition="200601120260325B">C08F212/08</further-classification>  
        <further-classification edition="200601120260325B">C08F220/14</further-classification>  
        <further-classification edition="200601120260325B">C08F220/18</further-classification>  
        <further-classification edition="200601120260325B">C08F220/20</further-classification>  
        <further-classification edition="200601120260325B">C09D133/08</further-classification>  
        <further-classification edition="200601120260325B">C09D151/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商開麥妥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMETALL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　克拉斯　亨里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOEVELMANN, CLAAS HENRIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基爾弗拉　納瓦勒　蘇爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHELFALLAH, NAWEL SOUAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施耐德　布莉塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNIEDERS, BRITTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種可自至少一種(甲基)丙烯酸單體之聚合獲得之至少一種聚合物P的水性分散體，該聚合在至少一種含有至少兩個嵌段B1及B2之嵌段共聚物的存在下發生，B1包含具有至少一個含磷部分體之結構單元SU1，且B2包含可自至少一種(甲基)丙烯酸單體之聚合獲得的結構單元SU2，該水性分散體包含呈聚合物核之形式之聚合物P，其中嵌段共聚物BC藉助於其嵌段B2之至少一部分結合至該聚合物核之表面的至少一部分上；關於一種用於製備該水性分散體之方法；關於一種該嵌段共聚物BC作為乳化劑及/或界面活性劑之用途；關於一種用於製備該至少一種嵌段共聚物BC之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an aqueous dispersion of at least one polymer P obtainable from a polymerization of at least one (meth)acrylic monomer taking place in the presence of at least one block copolymer BC containing at least two blocks B1 and B2, B1 comprising structural units SU1 having at least one phosphorous containing moiety, and B2 comprising structural units SU2 being obtainable from polymerization of at least one (meth)acrylic monomer, said aqueous dispersion comprising polymer P in form of a polymeric core, wherein block copolymer BC is bound to at least part of the surface of the polymeric core by means of at least part of its block B2, to a method for preparing the aqueous dispersion, to a use of the block copolymer BC as emulsifier and/or surfactant, to a method for preparing the at least one block copolymer BC.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1273" publication-number="202626992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於永久性塗料應用之包含(甲基)丙烯酸聚合物的水性組合物</chinese-title>  
        <english-title>AQUEOUS COMPOSITIONS COMPRISING (METH)ACRYLIC POLYMER SUITABLE FOR PERMANENT COATING APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C09D153/00</main-classification>  
        <further-classification edition="200601120260316B">C09D127/24</further-classification>  
        <further-classification edition="200601120260316B">C09D133/10</further-classification>  
        <further-classification edition="200601120260316B">C09D5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商開麥妥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMETALL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基爾弗拉　納瓦勒　蘇爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHELFALLAH, NAWEL SOUAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯帕爾　克里斯托夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASPER, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅施　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROTH, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾南德斯　維拉　莉迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERNANDEZ VILA, LIDIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於水性塗料組合物，其包含Zr、Ti及Hf陽離子中之至少一者a1)；適於錯合a1)之至少一種錯合劑a2)；至少一種聚合物P作為a3)，該聚合物可自至少一種(甲基)丙烯酸單體在至少一種嵌段共聚物BC存在下之聚合來獲得，且該BC作為a4)，其中BC含有至少兩種嵌段B1及B2，B1包含結構單元SU1，其中SU1之至少一部分含有至少一個含磷部分，且B2包含結構單元SU2，SU2可自至少一種(甲基)丙烯酸單體之聚合獲得；關於用於藉由使用水稀釋來產生該水性塗料組合物之濃縮物；用於塗覆視情況經預塗覆之金屬基板之方法，該方法利用該水性塗料組合物；可藉由該方法獲得之經塗覆基板；及與該水性塗料組合物及/或其成分中之至少一者相關之若干用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an aqueous coating composition comprising at least one of Zr, Ti and Hf cations a1), at least one complexing agent a2) suitable for complexing a1), at least one polymer P as a3), which is obtainable from a polymerization of at least one (meth)acrylic monomer in the presence of at least one block copolymer BC, and said BC as a4), wherein BC contains at least two blocks B1 and B2, B1 comprising structural units SU1, wherein at least a part of SU1 contains at least one phosphorous containing moiety, and B2 comprising structural units SU2, which are obtainable from a polymerization of at least one (meth)acrylic monomer, a concentrate for producing the aqueous coating composition by dilution with water, a method for coating an optionally pre-coated metallic substrate, which makes use of said aqueous coating composition, to a coated substrate obtainable by said method, and to several uses related to the aqueous coating composition and/or at least one of its ingredients.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1274" publication-number="202626183"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626183.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中空絲膜元件、中空絲膜模組、脫氣方法及氣體加成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B01D63/02</main-classification>  
        <further-classification edition="200601120260318B">B01D61/00</further-classification>  
        <further-classification edition="200601120260318B">B01D63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙石昂汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAISHI, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於：降低液體之壓力損失。 &lt;br/&gt;本發明之中空絲膜元件2具備：液體流通管21，其形成有複數個開口21d；複數個中空絲膜22，其等以覆蓋複數個開口21d之方式，配置於液體流通管21之周圍；第一固定部24及第二固定部25，其等將複數個中空絲膜22固定於液體流通管21；擋板26，其於元件中間部2c，將液體流通管21之中空部21a封堵；及空間形成構件23，其配置於液體流通管21與複數個中空絲膜22之間，形成有複數個貫通孔23a；且空間形成構件23形成與液體流通管21之間之連通空間23b，該連通空間23b將複數個開口21d中位於延伸方向D之擋板26與第一固定部24之間的至少一個開口21d與複數個貫通孔23a連通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:中空絲膜元件</p>  
        <p type="p">2a:第一元件端部</p>  
        <p type="p">21:液體流通管</p>  
        <p type="p">21a:中空部</p>  
        <p type="p">21b:第一端液體流通管開口</p>  
        <p type="p">21d:開口</p>  
        <p type="p">21f:端部</p>  
        <p type="p">22:中空絲膜</p>  
        <p type="p">22a:中空部</p>  
        <p type="p">22b:第一端中空絲膜開口</p>  
        <p type="p">23:空間形成構件</p>  
        <p type="p">23a:貫通孔</p>  
        <p type="p">23b:連通空間</p>  
        <p type="p">24:第一固定部</p>  
        <p type="p">D:延伸方向</p>  
        <p type="p">D1:第一延伸方向</p>  
        <p type="p">D2:第二延伸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1275" publication-number="202628713"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628713.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合的分佈式布拉格反射器的光學發射器結構</chinese-title>  
        <english-title>OPTICAL EMITTER STRUCTURES WITH INTEGRATED DISTRIBUTED BRAGG REFLECTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260330B">H10H20/01</main-classification>  
        <further-classification edition="202501120260330B">H10H20/833</further-classification>  
        <further-classification edition="202501120260330B">H10H20/841</further-classification>  
        <further-classification edition="202501120260330B">H10H20/857</further-classification>  
        <further-classification edition="202501120260330B">H10H29/01</further-classification>  
        <further-classification edition="202501120260330B">H10H29/14</further-classification>  
        <further-classification edition="202501120260330B">H10H29/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, OLIVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴　燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供光電子發光裝置，其具有直接接合電路系統，諸如控制或驅動電路系統。這些光電子發光裝置併入有分佈式布拉格反射器（DBR）層，這些DBR層可經調諧以反射一特定波長之光，並促進光電子發光裝置基板（晶圓或晶粒）與控制電路系統之間的直接接合及電接觸。在一些具體實例中，這些DBR層提供直接接合界面，諸如混合接合表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optoelectronic light emitting devices are provided with directly bonded circuitry, such as control or driver circuitry. The optoelectronic light emitting devices incorporate distributed Bragg reflector (DBR) layers that can be tuned to reflect the light of a particular wavelength, and that facilitate direct bonding and electrical contact between optoelectronic light emitting device substrates (wafers or dies) and control circuitry. In some embodiments the DBR layers provide direct bonding interfaces, such as hybrid bonding surfaces.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">206:n型半導體</p>  
        <p type="p">208:主動區域</p>  
        <p type="p">210:p型半導體</p>  
        <p type="p">212:第一電極</p>  
        <p type="p">214:第二電極</p>  
        <p type="p">216:微型LED裝置</p>  
        <p type="p">220:分佈式布拉格反射器</p>  
        <p type="p">224:觸點</p>  
        <p type="p">226:表面</p>  
        <p type="p">228:電路系統元件</p>  
        <p type="p">230:觸點</p>  
        <p type="p">234:接合界面</p>  
        <p type="p">236:電路系統</p>  
        <p type="p">300:微型LED陣列組裝件</p>  
        <p type="p">302:表面</p>  
        <p type="p">304:紋理化表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1276" publication-number="202628586"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628586.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及半導體記憶裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260325B">H10B41/35</main-classification>  
        <further-classification edition="202301120260325B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森伸二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有高信賴性之半導體記憶裝置。 &lt;br/&gt;　　半導體記憶裝置，係具備有：層積體，係具有導電層與絕緣層，並使導電層以及絕緣層在第1方向上被交互作層積；和複數之記憶體柱，係在層積體內而延伸存在於第1方向上；和構造體，係將複數之記憶體柱作分斷，並在層積體內而延伸存在於前述第1方向上。構造體，係具有：結晶性導電體，係於層積體內而延伸存在於第1方向上；和第1絕緣膜，係被設置在層積體與結晶性導電體之間；和結晶性半導體膜，係被設置在結晶性導電體與第1絕緣膜之間，並含有矽；和第2絕緣膜，係被設置在結晶性半導體膜與結晶性導電體之側面之間，並含有矽與氧。結晶性導電體，係具有：第1結晶區域，係與結晶性半導體膜相接，並含有鍺；和第2結晶區域，係被設置在第1結晶區域之上，並於與第1方向相垂直之第2方向上與第2絕緣膜相接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">26:層積體</p>  
        <p type="p">31:導電層</p>  
        <p type="p">32:絕緣層</p>  
        <p type="p">37:半導體層</p>  
        <p type="p">301:結晶性導電體</p>  
        <p type="p">301A:結晶區域</p>  
        <p type="p">301B:結晶區域</p>  
        <p type="p">302:絕緣膜</p>  
        <p type="p">303:結晶性半導體膜</p>  
        <p type="p">304:絕緣膜</p>  
        <p type="p">BS:構造體</p>  
        <p type="p">T1:第1階層</p>  
        <p type="p">T2:第2階層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1277" publication-number="202627139"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627139.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含矽烯層的矽基板及其製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C14/14</main-classification>  
        <further-classification edition="200601120260401B">C23C14/34</further-classification>  
        <further-classification edition="200601120260401B">C23C14/58</further-classification>  
        <further-classification edition="200601120260401B">C23C16/24</further-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="200601120260401B">C23C28/00</further-classification>  
        <further-classification edition="202501120260401B">H10D30/01</further-classification>  
        <further-classification edition="202501120260401B">H10D30/47</further-classification>  
        <further-classification edition="202501120260401B">H10D30/67</further-classification>  
        <further-classification edition="202501120260401B">H10D48/01</further-classification>  
        <further-classification edition="202501120260401B">H10D62/13</further-classification>  
        <further-classification edition="202501120260401B">H10D62/80</further-classification>  
        <further-classification edition="202501120260401B">H10D62/83</further-classification>  
        <further-classification edition="202501120260401B">H10D64/68</further-classification>  
        <further-classification edition="202601120260401B">H10D84/01</further-classification>  
        <further-classification edition="202601120260401B">H10P14/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上東洋太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHIGASHI, YOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種含矽烯層的矽基板及其製作方法，該含矽烯層的矽基板具有：矽基板上的第1碳摻雜矽層、該第1碳摻雜矽層上的矽烯層、及該矽烯層上的第2碳摻雜矽層。藉此，提供一種含矽烯層的矽基板，其於絕緣層上形成有矽烯層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:含矽烯層的矽基板</p>  
        <p type="p">2:矽基板</p>  
        <p type="p">3:第1碳摻雜矽層</p>  
        <p type="p">4:Ag層</p>  
        <p type="p">5:矽烯層</p>  
        <p type="p">6:第2碳摻雜矽層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1278" publication-number="202627017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C09J125/08</main-classification>  
        <further-classification edition="201901120260325B">B32B7/06</further-classification>  
        <further-classification edition="200601120260325B">B32B7/12</further-classification>  
        <further-classification edition="202601120260325B">H10P72/70</further-classification>  
        <further-classification edition="200601120260325B">B32B27/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂井傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, SUGURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵜野和英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNO, KAZUHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種支持體與器件層經由接著層貼合而成之積層體，其翹曲量較小，能夠抑制對於外力之變形，並且接著層之洗淨去除性良好。 &lt;br/&gt;本發明採用積層體100，其為支持體12、第1接著層3A、第2接著層3B及器件層45依序積層而成者，第1接著層3A係由將支持體12與器件層45貼合時之溫度條件下之彈性模數顯示0.1 MPa以下之第1材料形成之層，第2接著層3B係由含有熱塑性樹脂、並且260℃下之彈性模數顯示20 MPa以上之第2材料形成之層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支持基體</p>  
        <p type="p">2:分離層</p>  
        <p type="p">3A:第1接著層</p>  
        <p type="p">3B:第2接著層</p>  
        <p type="p">4:基板</p>  
        <p type="p">5:密封材料層</p>  
        <p type="p">45:器件層</p>  
        <p type="p">100:積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1279" publication-number="202626264"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626264.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拋光墊、其製備方法及使用其之半導體裝置的製備方法</chinese-title>  
        <english-title>POLISHING PAD, PREPARATION METHOD THEREOF AND PREPARATION METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260320B">B24B37/26</main-classification>  
        <further-classification edition="201201120260320B">B24B37/24</further-classification>  
        <further-classification edition="201201120260320B">B24B37/10</further-classification>  
        <further-classification edition="201201120260320B">B24B37/04</further-classification>  
        <further-classification edition="201201120260320B">B24B37/02</further-classification>  
        <further-classification edition="200601120260320B">B24D3/00</further-classification>  
        <further-classification edition="200601120260320B">B24D18/00</further-classification>  
        <further-classification edition="202601120260320B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商恩普士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENPULSE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申有眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YUJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金京煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹鍾旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐章源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JANGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的具體實例，有提供一種拋光墊、製備該拋光墊的方法及使用該拋光墊來製備半導體裝置的方法。該拋光墊包含一子墊及一配置在該子墊上且包含具有不同密度的第一區域及第二區域之頂墊，其中在該第一區域的密度與該第二區域的密度間之差異係0.03克/立方公分或更多。可在欲拋光的物體之中央區域中提供高抛光率，及可在該欲拋光的物體之邊緣區域中提供提高的拋光平度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to embodiments of the present invention, there are provided a polishing pad, a process for preparing a polishing pad, and a process for preparing a semiconductor device using the polishing pad. The polishing pad comprises a sub pad and a top pad disposed on the sub pad and comprising a first region and a second region having different densities, wherein the difference between the density of the first region and the density of the second region is 0.03 g/cm&lt;sup&gt;3&lt;/sup&gt; or more. A high polishing rate can be provided in the central region of an object to be polished, and enhanced polishing flatness can be provided in the edge region of the object to be polished.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:拋光墊</p>  
        <p type="p">110:頂墊</p>  
        <p type="p">112:第一區域，第一頂墊層</p>  
        <p type="p">114:第二區域，第二頂墊層</p>  
        <p type="p">120:子墊</p>  
        <p type="p">130:黏著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1280" publication-number="202626483"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626483.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在基板晶圓之正面施加反射層及對基板晶圓之暴露表面進行鈍化的方法</chinese-title>  
        <english-title>METHOD FOR APPLYING A REFLECTIVE LAYER TO A FRONT SIDE OF A SUBSTRATE WAFER AND FOR PASSIVATING EXPOSED SURFACES OF THE SUBSTRATE WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B81C1/00</main-classification>  
        <further-classification edition="200601120260331B">C23C16/00</further-classification>  
        <further-classification edition="201501120260331B">G02B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平特　史堤方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINTER, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種在基板晶圓（10）之正面（12）施加反射層（110）及對該基板晶圓（10）之暴露表面（44）進行鈍化之方法。在此情況下，執行至少以下方法步驟：根據a），在該基板晶圓（10）之該正面（12）上引入溝槽（36），且將ALD塗層（46）至少施加至這些溝槽之側壁（40）上。隨後，根據b），用填充層（50，52）暫時填充根據a）引入之溝槽（36）。根據c），將包含反射層（110）及導電保護層（62）之塗層施加至該基板晶圓（10）之該正面（12），且根據d），將保護晶圓（66）暫時施加至已根據c）塗覆之該正面（12）且使用ALD塗層（46，82）對所有暴露表面（44）進行鈍化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for applying a reflective layer (110) to a front side (12) of a substrate wafer (10) and for passivating exposed surfaces (44) of the substrate wafer (10). In this case, at least the following method steps are run through: According to a) trenches (36) are introduced on the front side (12) of the substrate wafer (10) and an ALD coating (46) is applied at least to the sidewalls (40) thereof. Subsequently, according to b) trenches (36) introduced according to a) are temporarily filled with a filling layer (50, 52). According to c) a coating comprising a reflective layer (110) and an electrically conductive protective layer (62) is applied to the front side (12) of the substrate wafer (10) and according to d) a protective wafer (66) is temporarily applied to the front side (12) already coated according to c) and all exposed surfaces (44) are passivated using an ALD coating (46, 82).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板晶圓</p>  
        <p type="p">14:背面</p>  
        <p type="p">20:矽材料</p>  
        <p type="p">22:氧化矽</p>  
        <p type="p">36:溝槽</p>  
        <p type="p">46:ALD塗層</p>  
        <p type="p">58:布拉格塗層</p>  
        <p type="p">62:導電保護層</p>  
        <p type="p">66:保護晶圓</p>  
        <p type="p">68:底部部分</p>  
        <p type="p">78:鏡面元件</p>  
        <p type="p">80:通道</p>  
        <p type="p">82:ALD塗層</p>  
        <p type="p">88:內埋陰影遮罩</p>  
        <p type="p">90:開口</p>  
        <p type="p">98:拆卸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1281" publication-number="202627642"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627642.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於背光模組的二次光學透鏡</chinese-title>  
        <english-title>SECONDARY OPTICAL LENS FOR BACKLIGHT MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G02F1/13357</main-classification>  
        <further-classification edition="200601120260318B">G02B5/30</further-classification>  
        <further-classification edition="201501120260318B">G02B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穎台科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTIRE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張裕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚佳吟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, CHIA YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾仁鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JEN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種可提高亮度的背光模組，可搭配液晶顯示器使用。該背光模組包括了能將LED發出的光適當地配光的二次光學透鏡、以及具獨特光擴散效果的擴散板。本發明的背光模組，不僅在LED上設置折反射式二次光學透鏡來對LED發出的光進行適當地配光，且搭配在擴散板入光面設置微結構，以及在擴散板中還添加擴散粒子，並以發泡技術押出使擴散板內包含均勻分佈的微氣泡。藉此，可將LED的光線做最佳化的配光與擴散，進而達到遮蔽MURA，以產生一個輝度提高且均勻的面光源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A backlight module capable of enhancing brightness can be used with a Liquid Crystal Display (LCD). The backlight module comprises a secondary optical lens that can appropriately distribute the light emitted by the LED, and a diffusion plate with a unique light diffusion effect. The backlight module not only provides a catadioptric secondary optical lens on the LED to appropriately distribute the light emitted by the LED, but also provides a plurality of microstructures on the light-inlet surface of the diffuser plate, and provides a plurality of diffusion particles in the diffuser plate, and also provides a plurality of microbubbles evenly distributed in the diffuser plate by using extruding foaming technology. In this way, the light of the LED can be optimally distributed and diffused, thereby shielding the MURA to produce a surface light source with increased brightness and uniformity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:擴散板</p>  
        <p type="p">10:板體</p>  
        <p type="p">101:主板層</p>  
        <p type="p">1011、1021、1031:擴散粒子</p>  
        <p type="p">1012:微氣泡</p>  
        <p type="p">102、103:表層</p>  
        <p type="p">1032:微結構</p>  
        <p type="p">151:光學膜</p>  
        <p type="p">152:增亮膜</p>  
        <p type="p">153:偏光增亮膜</p>  
        <p type="p">20:二次光學透鏡</p>  
        <p type="p">91:基板</p>  
        <p type="p">911:頂面</p>  
        <p type="p">92:發光元件</p>  
        <p type="p">93:液晶顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1282" publication-number="202627062"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627062.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體用洗淨液及使用該洗淨液之半導體基板之洗淨方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C11D7/26</main-classification>  
        <further-classification edition="200601120260325B">C11D7/32</further-classification>  
        <further-classification edition="200601120260325B">C11D1/62</further-classification>  
        <further-classification edition="200601120260325B">C08K5/053</further-classification>  
        <further-classification edition="200601120260325B">C09K3/32</further-classification>  
        <further-classification edition="202601120260325B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阪本藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO YAKUHIN KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶田舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJITA, SHUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種在化學性機械性研磨步驟，對於所形成之配線層，不會給予腐蝕所代表之損害，將污染物質從基板上去除，去除污染物質後，可將洗淨液所包含之成分在純水的淋洗輕易洗掉，於下一步驟之前，用以將基板表面成為清淨的狀態之洗淨液組成物。 &lt;br/&gt;　　本發明的解決手段為藉由使用含有(A)重量平均分子量為5,000以下之(聚)甘油、(B)螯合化劑、(C)水、(D)pH調整劑的半導體基板之洗淨液組成物，解決上述課題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1283" publication-number="202626965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水電解液二次電池用積層隔離件形成用之組成物及其利用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08L79/08</main-classification>  
        <further-classification edition="200601120260323B">C08F267/10</further-classification>  
        <further-classification edition="200601120260323B">C07C211/50</further-classification>  
        <further-classification edition="201001120260323B">H01M10/0563</further-classification>  
        <further-classification edition="202101120260323B">H01M50/423</further-classification>  
        <further-classification edition="202101120260323B">H01M50/449</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古川洵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井大雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, TAIGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑田貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWATA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]可提供一種非水電解液二次電池用積層隔離件形成用之組成物，其使積層隔離件的透氣度降低，且可提升非水電解液二次電池的倍率特性。 &lt;br/&gt;　　[解決手段]本揭示之非水電解液二次電池用積層隔離件形成用之組成物，包含具有醯胺鍵及芳香環之樹脂，前述樹脂中之具有羧基之芳香環相對於全芳香環的比例為0.2~2.0 mol%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1284" publication-number="202627134"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627134.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128732</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基材的製造方法及配線基材的製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C14/04</main-classification>  
        <further-classification edition="200601120260401B">C23C14/14</further-classification>  
        <further-classification edition="200601120260401B">C23C14/34</further-classification>  
        <further-classification edition="200601120260401B">C23C14/58</further-classification>  
        <further-classification edition="200601120260401B">C25D3/38</further-classification>  
        <further-classification edition="200601120260401B">C25D5/50</further-classification>  
        <further-classification edition="200601120260401B">C25D7/00</further-classification>  
        <further-classification edition="200601120260401B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商牛尾電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USHIO DENKI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水昭宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>深田和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKADA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一形態之配線基材的製造方法，包含：對構成基材的表面的絕緣層進行改質的工程、在前述絕緣層上藉由濺鍍形成包含銅的種子層的工程、進行對形成有前述種子層的前述基材在非活性氣體氣氛中加熱的第1退火處理的工程、在進行前述第1退火處理之後，在前述種子層上藉由電解電鍍形成電鍍層的工程、及進行對形成有前述電鍍層的前述基材加熱的第2退火處理的工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1285" publication-number="202626777"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626777.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用多孔質觸媒之氫化聚合物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08F8/04</main-classification>  
        <further-classification edition="200601120260325B">C08F12/00</further-classification>  
        <further-classification edition="200601120260325B">B01J23/44</further-classification>  
        <further-classification edition="200601120260325B">B01J32/00</further-classification>  
        <further-classification edition="202401120260325B">B01J35/61</further-classification>  
        <further-classification edition="202401120260325B">B01J35/63</further-classification>  
        <further-classification edition="202401120260325B">B01J35/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤英之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下海瑠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, MIRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木悠斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠以更短時間完成之氫化方法，亦即藉由氫化反應之反應速度提升而能夠以更短時間完成氫化反應之氫化方法。根據本發明之一態樣，提供一種製造方法，其為藉由將芳香族乙烯基化合物系聚合物的芳香環進行氫化之氫化聚合物的製造方法，其包含：使用芳香族乙烯基化合物系聚合物、溶劑及氫化觸媒進行氫化反應，氫化觸媒為多孔質觸媒，多孔質觸媒之具有50~300Å之細孔徑之細孔的總容積為0.17~1.00mL/g。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1286" publication-number="202626941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128740</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08L63/00</main-classification>  
        <further-classification edition="200601120260330B">H01F1/37</further-classification>  
        <further-classification edition="200601120260330B">C08G59/18</further-classification>  
        <further-classification edition="200601120260330B">C08K5/17</further-classification>  
        <further-classification edition="200601120260330B">C08L101/12</further-classification>  
        <further-classification edition="200601120260330B">H05K9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安井景樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUI, KEIJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中孝幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可得到高相對磁導率、低損失係數且耐藥液性為優異的硬化物的樹脂組成物等。一種樹脂組成物，包含：(A)環氧樹脂、(B)磁性粉體及(C)有機填充材，其中，若將樹脂組成物中的不揮發成分設為100質量%時的(B)成分的含有量設為B&lt;sub&gt;m&lt;/sub&gt;，若將樹脂組成物中的不揮發成分設為100質量%時的(C)成分的含有量設為C&lt;sub&gt;m&lt;/sub&gt;，B&lt;sub&gt;m&lt;/sub&gt;/C&lt;sub&gt;m&lt;/sub&gt;為50以上且500以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1287" publication-number="202626509"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626509.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氫化處理催化劑載體組合物、其製造方法及其用途</chinese-title>  
        <english-title>HYDROTREATING CATALYST CARRIER COMPOSITIONS, METHODS FOR PRODUCTION THEREOF, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260319B">C01F7/026</main-classification>  
        <further-classification edition="200601120260319B">C01G23/053</further-classification>  
        <further-classification edition="200601120260319B">C01B25/168</further-classification>  
        <further-classification edition="200601120260319B">B01J21/04</further-classification>  
        <further-classification edition="202201120260319B">C01F7/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商先進精鍊科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED REFINING TECHNOLOGIES LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊因　達瑞爾Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLEIN, DARRYL P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼托　麥可約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANTO, MICHAEL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福斯特　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSTER, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製備包括氧化鋁、鈦及磷之經改質的氧化鋁粉末之方法，其包括提供一硫酸鋁的水溶液；將一鈦化合物及一磷化合物加入至該硫酸鋁的水溶液以提供一混合物；讓該混合物與一包含鹼沉澱劑的水溶液接觸以提供一沉澱物；分離該沉澱物作為經分離的沉澱物；及乾燥該沉澱物以提供該經改質的氧化鋁粉末。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for preparing a modified alumina powder, that includes alumina, titanium, and phosphorus, includes providing an aqueous solution of aluminum sulfate; adding a titanium compound and a phosphorus compound to the aqueous solution of aluminum sulfate to provide a mixture; contacting the mixture with an aqueous solution comprising a base precipitation agent to provide a precipitate; isolating the precipitate as an isolated precipitate; and drying the precipitate to provide the modified alumina powder.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1288" publication-number="202626516"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626516.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128872</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於固態電池電解質的化合物</chinese-title>  
        <english-title>COMPOUND FOR A SOLID-STATE BATTERY ELECTROLYTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C01G25/00</main-classification>  
        <further-classification edition="201001120260401B">H01M10/0562</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商微軟技術授權有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳馳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特洛伊爾　馬蒂亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TROYER, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比洛多　布萊恩亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BILODEAU, BRIAN ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　納森安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKER, NATHAN ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯姆　丹尼斯偉青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOM, DENNIS WAI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露了化合物&lt;img align="absmiddle" height="35px" width="236px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中x大於0且小於3，並且其中y大於0且小於1。其中x=1且y=0.75時，化合物為&lt;img align="absmiddle" height="30px" width="200px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。化合物可用作為固態電池的有效固體電解質。固體電解質可將鋰離子及/或鈉離子利用作為電荷載體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is the compound &lt;img align="absmiddle" height="32px" width="233px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, where x is greater than 0 and less than 3 and where y is greater than 0 and less than 1. Where x = 1 and y = 0.75, the compound is &lt;img align="absmiddle" height="36px" width="195px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The compound is usable as an effective solid electrolyte for a solid-state battery. The solid electrolyte can utilize lithium ions and/or sodium ions as charge carriers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:電池</p>  
        <p type="p">302:陽極</p>  
        <p type="p">304:陰極</p>  
        <p type="p">306a:第一固體電解質</p>  
        <p type="p">306b:第二固體電解質</p>  
        <p type="p">308:外部電路</p>  
        <p type="p">310:集流器</p>  
        <p type="p">312:集流器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1289" publication-number="202628778"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628778.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250917B">H10K77/00</main-classification>  
        <further-classification edition="200601120250917B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安炯光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, HYEONGGWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳智淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JI-SOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禹相珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOO, SANGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAEWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車宗石</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, JONGSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信石</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIN-SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李南錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, NAM-SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種顯示裝置。根據本揭露各實施例的一種顯示裝置可包含：包含一摺疊區與一非摺疊區的一顯示面板，且顯示面板的至少一部分為可摺疊的；重疊於顯示面板的後表面的一第一翼板；至少部分重疊於第一翼板的一覆蓋件；具有彎曲形狀並插入於第一翼板與覆蓋件之間的一連結臂；以及連接至連結臂並重疊於顯示面板的後表面一第二翼板。當顯示面板被摺疊時，該第二翼板的至少一部分可依據彎曲形狀旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclpsure relates to a display device. A display device according to exemplary embodiments of the present disclosure may include a display panel including a folding area and a non-folding area, at least a portion of the display panel being foldable; a first wing plate overlapping the rear surface of the display panel; a cover overlapping at least a portion of the first wing plate; a link arm having a curved shape and inserted between the first wing plate and the cover; and a second wing plate connected to the link arm and overlapping the rear surface of the display panel. As the display panel is folded, at least a portion of the second wing plate may rotate in accordance with the curved shape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:顯示面板</p>  
        <p type="p">120:樞軸結構</p>  
        <p type="p">210:第一翼板</p>  
        <p type="p">230:第一附接部</p>  
        <p type="p">250:覆蓋件</p>  
        <p type="p">270:連結臂</p>  
        <p type="p">290:第二翼板</p>  
        <p type="p">310:第二附接部</p>  
        <p type="p">330:樞軸臂</p>  
        <p type="p">350:樞軸殼體</p>  
        <p type="p">370:樞軸蓋件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1290" publication-number="202627545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及顯示系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G02B5/30</main-classification>  
        <further-classification edition="200601120260317B">G02B17/08</further-classification>  
        <further-classification edition="201501120260317B">G02B1/11</further-classification>  
        <further-classification edition="200601120260317B">G02B27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口光貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田昌邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, MASAKUNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在提升VR護目鏡之視辨性的同時耐濕性優異之光學積層體。光學積層體依序具有偏光構件、第一λ/4構件、接著劑層及其他相位差層；偏光構件包含含碘之偏光膜與保護層；第一λ/4構件係與偏光膜鄰接配置，且在40℃及92%RH下之透濕度為100g/m&lt;sup&gt;2&lt;/sup&gt;・24小時以下；且，接著劑層之厚度為2.0µm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學積層體</p>  
        <p type="p">13:偏光構件</p>  
        <p type="p">13a:偏光膜</p>  
        <p type="p">13b:保護層</p>  
        <p type="p">20:第一λ/4構件</p>  
        <p type="p">21:第一相位差構件</p>  
        <p type="p">23:其他相位差層</p>  
        <p type="p">30:保護構件</p>  
        <p type="p">41:第一黏著劑層</p>  
        <p type="p">42:第二黏著劑層</p>  
        <p type="p">50:接著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1291" publication-number="202628807"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628807.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於頻率轉換之晶體之建構的方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR CONSTRUCTION OF CRYSTALS FOR FREQUENCY CONVERSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P30/20</main-classification>  
        <further-classification edition="200601120260318B">C30B29/64</further-classification>  
        <further-classification edition="200601120260318B">G02B3/00</further-classification>  
        <further-classification edition="200601120260318B">G02B5/08</further-classification>  
        <further-classification edition="200601120260318B">C30B33/08</further-classification>  
        <further-classification edition="200601120260318B">G01N21/33</further-classification>  
        <further-classification edition="201401120260318B">B23K26/362</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛瑟　凱莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAUSER, KELLY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　勇和　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YUNG-HO ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾登　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIELDEN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　學峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XUEFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張百鋼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BAIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁　丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, DING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於建構一經週期性極化之非線性晶體之方法可包含在一均勻深度處將離子植入四硼酸鍶(SBO)或三硼酸鋰(LBO)之一塊狀晶體中以產生一損壞層，將一手柄材料附接至該塊狀晶體之表面，在該損壞層處劈開該塊狀晶體以產生一薄板，及將該薄板拋光至適合於準相位匹配(QPM)之一厚度以產生具有在約120 nm至200 nm之範圍內之波長之雷射輸出光。使依此方式產生之薄板之表面光學接觸，且切割及配置所得堆疊以產生多層QPM晶體。亦描述併入雷射總成之方法、檢測系統、微影系統及切割系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for constructing a periodically-poled nonlinear crystal may include implanting ions in a bulk crystal of strontium tetraborate (SBO) or lithium triborate (LBO) to generate a damaged layer at a predetermined depth, attaching a handle material to the surface of the bulk crystal, cleaving the bulk crystal at the damaged layer to generate a thin plate, and polishing the thin plate to a thickness suitable for quasi-phase-matching (QPM) to generate laser output light having wavelengths in the range of about 120-200 nm. The surfaces of thin plates generated in this way are optically contacted, and resulting stacks are diced and arranged to generate many-layered QPM crystals. Methods, inspection systems, lithography systems and cutting systems incorporating the laser assembly are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學系統</p>  
        <p type="p">102:照明源</p>  
        <p type="p">103:光學件</p>  
        <p type="p">104:偵測器總成</p>  
        <p type="p">106:感測器</p>  
        <p type="p">108:樣本</p>  
        <p type="p">112:載台總成</p>  
        <p type="p">114:控制器</p>  
        <p type="p">116:載體媒體</p>  
        <p type="p">118:程式指令</p>  
        <p type="p">121:收集光瞳孔徑</p>  
        <p type="p">122:收集鏡筒透鏡</p>  
        <p type="p">131:照明光瞳孔徑</p>  
        <p type="p">132:照明鏡筒透鏡</p>  
        <p type="p">134:分束器/反射鏡</p>  
        <p type="p">135:分束器/反射鏡</p>  
        <p type="p">136:反射鏡</p>  
        <p type="p">137:反射鏡</p>  
        <p type="p">138:反射鏡</p>  
        <p type="p">150:物鏡</p>  
        <p type="p">151:透鏡</p>  
        <p type="p">152:透鏡</p>  
        <p type="p">200-0:雷射</p>  
        <p type="p">L&lt;sub&gt;in&lt;/sub&gt;:照明光</p>  
        <p type="p">L&lt;sub&gt;INT&lt;/sub&gt;:光</p>  
        <p type="p">L&lt;sub&gt;Obl&lt;/sub&gt;:傾斜入射角</p>  
        <p type="p">L&lt;sub&gt;OUT&lt;/sub&gt;:光</p>  
        <p type="p">L&lt;sub&gt;R/S/T&lt;/sub&gt;:光</p>  
        <p type="p">L&lt;sub&gt;spec&lt;/sub&gt;:鏡面反射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1292" publication-number="202625966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主動脈血壓量測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">A61B5/021</main-classification>  
        <further-classification edition="200601120251001B">G01S13/88</further-classification>  
        <further-classification edition="200601120251001B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂發電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ST&amp;T ELECTRIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶德和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, TEH-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李棟樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TUNG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡東賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種主動脈血壓量測方法。所述主動脈血壓量測方法包括：以脈衝雷達感測器擷取升主動脈容積變化訊號波形；從升主動脈容積變化訊號波形上取得複數個收縮容積波峰、複數個收縮容積波谷及複數個舒張逆向血流容積波峰；利用所述複數個收縮容積波峰、所述複數個收縮容積波谷及所述複數個舒張逆向血流容積波峰計算出複數個收縮期時距(SP)、複數個心動週期時距(HP)、複數個舒張逆向血流容積波峰至基線的距離(DB)及複數個收縮容積波峰至收縮容積波谷的距離(DPV)；利用(SP)之平均值、(HP)之平均值、(SP/HP)的平均值及(DB/DPV)的平均值計算出升主動脈之收縮壓及脈壓；以及利用收縮壓及脈壓計算出舒張壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">L1~L9:收縮容積波谷</p>  
        <p type="p">M1~M9:舒張逆向血流容積波峰</p>  
        <p type="p">T1~T9:收縮容積波峰</p>  
        <p type="p">W:升主動脈容積變化訊號波形</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1293" publication-number="202628347"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628347.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用自定時間歇式直流耦合進行偏壓的低雜訊晶體振盪器</chinese-title>  
        <english-title>LOW-NOISE CRYSTAL OSCILLATOR USING SELF-TIMED INTERMITTENT DC COUPLING FOR BIASING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H03B5/36</main-classification>  
        <further-classification edition="200601120260330B">H03H9/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　嘉亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶體振盪器包含：P型金屬氧化物半導體電晶體、 N型金屬氧化物半導體電晶體、設置於第一與第二閘極節點中的一者與源極節點之間的回授電容；設置於電源節點及接地節點中的一者之間與源極節點的分流電容；設置於第一節點與第二閘極節點之間的交流耦合電容；設置於第一閘極節點與第二閘極節點中的一者與接地節點與電源節點中的一者之間的晶體；第一直流耦合網路，其根據該第一閘極節點的第一閘極電壓狀態將第一偏壓節點耦合至第一閘極節點；以及第二直流耦合網路，其根據該第二閘極節點的第二閘極電壓狀態將第二偏壓節點耦合至第二閘極節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A crystal oscillator having a PMOS, an NMOS transistor, a feedback capacitor positioned between the source node and one of the first gate node and the second gate node; a shunt capacitor positioned between the source node and one of the power supply node and the ground node, an AC coupling capacitor positioned between the first gate node and the second gate node, and a crystal positioned between one of the first gate node and the second gate node and one of the ground node and the power supply node. A first DC coupling network couples a first bias node to the first gate node according to a state of a first gate voltage at the first gate node, and a second DC coupling network couples a second bias node to the second gate node according to a state of a second gate voltage at the second gate node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:晶體振盪器</p>  
        <p type="p">211,212:電晶體</p>  
        <p type="p">220:晶體</p>  
        <p type="p">241:回授電容</p>  
        <p type="p">242:交流(AC)耦合電容</p>  
        <p type="p">243:分流電容</p>  
        <p type="p">250,260:基於二極體的直流耦合網路</p>  
        <p type="p">251:電晶體</p>  
        <p type="p">252:第一電阻</p>  
        <p type="p">261:電晶體</p>  
        <p type="p">262:第二電阻</p>  
        <p type="p">NG1:第一閘極節點</p>  
        <p type="p">NG2:第二閘極節點</p>  
        <p type="p">NS:源極節點</p>  
        <p type="p">VB1:第一偏壓節點</p>  
        <p type="p">VB2:第二偏壓節點</p>  
        <p type="p">VDD:電源節點</p>  
        <p type="p">VG1:第一閘極電壓</p>  
        <p type="p">VG2:第二閘極電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1294" publication-number="202626258"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626258.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板研磨方法、及基板研磨裝置</chinese-title>  
        <english-title>SUBSTRATE POLISHING METHOD AND SUBSTRATE POLISHING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260317B">B24B37/005</main-classification>  
        <further-classification edition="201201120260317B">B24B37/08</further-classification>  
        <further-classification edition="201201120260317B">B24B37/013</further-classification>  
        <further-classification edition="201201120260317B">B24B37/015</further-classification>  
        <further-classification edition="200601120260317B">B24B49/14</further-classification>  
        <further-classification edition="200601120260317B">B24B57/02</further-classification>  
        <further-classification edition="202601120260317B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠抑制在研磨後之基板之品質上發生不均勻之基板研磨方法。本揭示之基板研磨方法包含：第1工序(S1)，其將表示基板之形狀之基板形狀指標、與研磨基板時之研磨記錄資料分別建立對應關係並取得複數個，使用該等而產生基板形狀推定函數；第2工序(S2)，其在初始研磨條件下開始被加工基板之研磨；第3工序(S3)，其取得被加工基板之研磨記錄資料，使用該取得之研磨記錄資料及基板形狀推定函數，推定被加工基板之基板形狀；及第4工序(S4)，其根據推定出之被加工基板之基板形狀與上次推定出之被加工基板之基板形狀之差分Δa、及推定出之被加工基板之基板形狀與目標基板形狀之偏離量Δb，對研磨機進行回饋控制；且重複第3工序與第4工序，以使被加工基板之基板形狀接近目標基板形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1295" publication-number="202626922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129064</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全像記錄媒體用組合物、全像記錄媒體用硬化物、及全像記錄媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08K5/29</main-classification>  
        <further-classification edition="200601120260401B">C08K5/30</further-classification>  
        <further-classification edition="200601120260401B">C08K5/32</further-classification>  
        <further-classification edition="200601120260401B">C08K5/33</further-classification>  
        <further-classification edition="200601120260401B">C08K5/101</further-classification>  
        <further-classification edition="200601120260401B">C08L67/04</further-classification>  
        <further-classification edition="200601120260401B">G02B5/32</further-classification>  
        <further-classification edition="200601120260401B">G03H1/02</further-classification>  
        <further-classification edition="200601120260401B">G11B7/0065</further-classification>  
        <further-classification edition="201301120260401B">G11B7/24044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田了輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水尭紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種全像記錄媒體用組合物，其能夠抑制源自肟酯光聚合起始劑之著色體/發光體之生成，能夠不大幅地降低全像特性而有效地抑制光之損耗、顯示影像之色調之變化等不佳之現象。本發明之全像記錄媒體用組合物含有下述成分(a)～(f)。 &lt;br/&gt;成分(a)：不含芳香環及甲基丙烯酸酯基之異氰酸酯化合物 &lt;br/&gt;成分(b)：聚己內酯多元醇 &lt;br/&gt;成分(c)：丙烯酸酯單體 &lt;br/&gt;成分(d)：肟酯光聚合起始劑 &lt;br/&gt;成分(e)：具有硝醯自由基及異氰酸酯反應性官能基之化合物 &lt;br/&gt;成分(f)：具有異氰酸基及甲基丙烯酸酯基之化合物、或具有異氰酸酯反應性官能基及甲基丙烯酸酯基之化合物</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BPF:帶通濾波器</p>  
        <p type="p">IS:積分球</p>  
        <p type="p">LD:半導體雷射光源</p>  
        <p type="p">PD1,PD2:光偵測器</p>  
        <p type="p">S:全像記錄媒體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1296" publication-number="202627083"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627083.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於降低蛋白酶活性的方法</chinese-title>  
        <english-title>METHOD FOR REDUCING PROTEASE ACTIVITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N9/64</main-classification>  
        <further-classification edition="200601120260401B">C12P21/02</further-classification>  
        <further-classification edition="201001120260401B">C12N5/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安進公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMGEN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍達爾　丹尼爾　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOODALL, DANIEL WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邦達倫可　帕佛　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONDARENKO, PAVEL V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪普　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIEP, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文葛瑞　拉恰納　蘇德哈珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENGARAI, RACHANA SUDHARSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於經修飾以具有降低的AEP蛋白酶活性的哺乳動物細胞。此類細胞可用於生產重組蛋白。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to mammalian cells modified to have reduced AEP protease activity. Such cells can be used for producing recombinant proteins.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1297" publication-number="202627569"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627569.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">G02B6/26</main-classification>  
        <further-classification edition="200601120260331B">G02B6/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷傳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, TSUTARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施形態之連接器零件配置於光IC基板之基板面。連接器零件包含：反射零件，其將朝與基板面交叉之第1方向出射之光，朝沿著基板面之第2方向反射；光零件，其與自反射零件朝第2方向出射之光進行光耦合；插座，其保持反射零件且供拆裝光零件；及定位部，其進行光零件相對於插座之定位。定位部係配置於與朝第2方向出射之光之光路沿著第1方向排列之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接器零件</p>  
        <p type="p">2:光IC基板</p>  
        <p type="p">2b:基板面</p>  
        <p type="p">10:光零件</p>  
        <p type="p">11:光纖</p>  
        <p type="p">12j:突起</p>  
        <p type="p">14:第1槽</p>  
        <p type="p">15:導銷</p>  
        <p type="p">20:插座</p>  
        <p type="p">21:第1板部</p>  
        <p type="p">22:第2板部</p>  
        <p type="p">23:第2槽</p>  
        <p type="p">30:定位部</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">D3:第3方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1298" publication-number="202627828"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627828.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、記憶體、系統及資料處理方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE, MEMORY, SYSTEM, AND DATA PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G06F13/38</main-classification>  
        <further-classification edition="200601120251103B">G06F13/14</further-classification>  
        <further-classification edition="200601120251103B">G11C11/401</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長江存儲科技控股有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE MEMORY TECHNOLOGIES HOLDING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, CHUNYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍宗亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUO, ZONGLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟文杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, WENJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了半導體裝置、記憶體、系統及資料處理方法，半導體裝置包括：層疊設置的邏輯裸晶和多個存儲裸晶，邏輯裸晶包括：多個資料處理單元，每個資料處理單元包括：串並轉換電路和介面電路，串並轉換電路耦接到至少一個存儲裸晶和介面電路；串並轉換電路用於對至少一個存儲裸晶輸出的位元寬為M的第一讀出資料進行序列化處理，得到位元寬為N的第二讀出數據；介面電路用於將第二讀出資料輸出到處理器；介面電路還用於接收來自處理器的位元寬為N的第一寫入資料，並傳輸至串並轉換電路；以及，串並轉換電路還用於對第一寫入資料進行並行化處理，得到位元寬為M的第二寫入資料並傳輸到至少一個存儲裸晶；其中，M和N是正整數，且M/N大於或等於2。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor device, a memory, a system, and a data processing method. The semiconductor device includes: a logic die and a plurality of storage die that are stacked. The logic die includes a plurality of data processing units; each data processing unit includes: a serial-parallel conversion circuit and an interface circuit; the serial-parallel conversion circuit is coupled to at least one storage die and the interface circuit. The serial-parallel conversion circuit is used to perform a serializing process on a first readout data with a bit width of M output from the at least one storage die to obtain a second readout data with a bit width of N. The interface circuit is used to output the second readout data to a processor. The interface circuit is also used to receive a first writing data with a bit width of N from the processor and transmit the first writing data to the serial-parallel conversion circuit. The serial-parallel conversion circuit is also used to perform a parallelizing process on the first writing data to obtain a second writing data with a bit width of M, and transmit the second writing data to the at least one storage die. M and N are positive integers, and M/N is greater than or equal to 2.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:半導體裝置</p>  
        <p type="p">500:邏輯裸晶</p>  
        <p type="p">510:資料處理單元</p>  
        <p type="p">511:串並轉換電路</p>  
        <p type="p">512:介面電路</p>  
        <p type="p">520:第一焊盤</p>  
        <p type="p">521:第一資料焊盤</p>  
        <p type="p">530:第二焊盤</p>  
        <p type="p">531:第二數據焊盤</p>  
        <p type="p">600:存儲裸晶</p>  
        <p type="p">700:電連接體</p>  
        <p type="p">710:穿矽通孔</p>  
        <p type="p">720:凸塊</p>  
        <p type="p">CH1、CH2、CHi:通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1299" publication-number="202628281"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628281.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>第一端子模組以及電連接器</chinese-title>  
        <english-title>FIRST TERMINAL MODULE AND ELECTRICAL CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260323B">H01R13/6585</main-classification>  
        <further-classification edition="200601120260323B">H01R13/42</further-classification>  
        <further-classification edition="200601120260323B">H01R13/514</further-classification>  
        <further-classification edition="200601120260323B">H01R13/516</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚坤磷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KUNLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申歡歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, HUANHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種第一端子模組包括第一導電殼體、第一導電蓋板以及第一端子模組。前述第一導電蓋板位於前述第一導電殼體的內側。前述第一端子模組包括第一訊號端子。前述第一訊號端子包括第一中間部、第一訊號彈臂部以及第一尾部。前述第一導電殼體沿前述第一訊號端子的長度方向覆蓋前述第一訊號端子的前述第一訊號彈臂部、前述第一中間部以及前述第一尾部，從而改善了對前述第一訊號端子的屏蔽效果。本發明還揭示了一種具有前述第一端子模組的電連接器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A first terminal module includes a first conductive housing, a first conductive cover plate and a first terminal module. The first conductive cover plate is located on an inner side of the first conductive housing. The first terminal module includes a first signal terminal. The first signal terminal includes a first middle portion, a first signal elastic arm portion and a first tail portion. The first conductive housing covers the first signal elastic arm portion, the first middle portion and the first tail portion of the first signal terminal along a length direction of the first signal terminal, thereby improving the shielding effect of the first signal terminal. The present invention also discloses an electrical connector having the first terminal module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:對接插槽</p>  
        <p type="p">110:第一端子安裝槽</p>  
        <p type="p">111:第一主體部</p>  
        <p type="p">112:第一對接部</p>  
        <p type="p">113:第一延伸部</p>  
        <p type="p">120:第二端子安裝槽</p>  
        <p type="p">130:第三端子安裝槽</p>  
        <p type="p">140:第四端子安裝槽</p>  
        <p type="p">21:第一導電蓋板</p>  
        <p type="p">211:第一凸伸部</p>  
        <p type="p">22:第二導電蓋板</p>  
        <p type="p">23:第三導電蓋板</p>  
        <p type="p">24:第四導電蓋板</p>  
        <p type="p">31:第一端子模組</p>  
        <p type="p">3121:第一中間部</p>  
        <p type="p">3121a:第一前端部</p>  
        <p type="p">3121b:第一傾斜部</p>  
        <p type="p">3121c:第一平直部</p>  
        <p type="p">3121d:第二傾斜部</p>  
        <p type="p">3122:第一訊號彈臂部</p>  
        <p type="p">3123:第一尾部</p>  
        <p type="p">32:第二端子模組</p>  
        <p type="p">33:第三端子模組</p>  
        <p type="p">34:第四端子模組</p>  
        <p type="p">41:第一絕緣塊</p>  
        <p type="p">42:第二絕緣塊</p>  
        <p type="p">43:第三絕緣塊</p>  
        <p type="p">44:第四絕緣塊</p>  
        <p type="p">515:第一抵接部</p>  
        <p type="p">M1:第一端子模組</p>  
        <p type="p">M2:第二端子模組</p>  
        <p type="p">M3:第三端子模組</p>  
        <p type="p">M4:第四端子模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1300" publication-number="202628420"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628420.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料解碼裝置、及記憶體系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251103B">H04N19/42</main-classification>  
        <further-classification edition="201401120251103B">H04N19/436</further-classification>  
        <further-classification edition="200601120251103B">H03M7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>住吉正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMIYOSHI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西圭里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, KEIRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實現能夠提高處理量的資料解碼裝置。根據實施方式，資料解碼裝置包括第一記憶部、第二記憶部、解碼部、第一選擇部、及第二選擇部。第一記憶部記憶包括一個以上的第一區塊的資料流，所述一個以上的第一區塊分別包括第一型的資料部及第二型的資料部。第二記憶部能夠記憶第二型的資料部。解碼部解碼第二型的資料部。第一選擇部切換自第一記憶部傳輸第二型的資料部的傳輸目的地。第二選擇部切換將第二型的資料部傳輸至解碼部的傳輸來源。在一個以上的第一區塊內的第二區塊為資料流中的最終區塊的情況下，第一選擇部將第二區塊所包括的第二型的第二資料部自第一記憶部傳輸至第二記憶部，第二選擇部將儲存於第二記憶部的第二資料部傳輸至解碼部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:壓縮流</p>  
        <p type="p">9:LAST訊號</p>  
        <p type="p">15:資料解碼裝置</p>  
        <p type="p">30:輸入資料接收部</p>  
        <p type="p">31:移位暫存器</p>  
        <p type="p">32:標頭解碼部</p>  
        <p type="p">33:DEMUX</p>  
        <p type="p">34:MUX</p>  
        <p type="p">35:資料緩衝區</p>  
        <p type="p">36:有效負載解碼部</p>  
        <p type="p">40:標頭</p>  
        <p type="p">41:有效負載</p>  
        <p type="p">42:編碼表</p>  
        <p type="p">43:解碼資料</p>  
        <p type="p">44:最終區塊資訊</p>  
        <p type="p">45:EOB符號</p>  
        <p type="p">46:標頭消耗碼量</p>  
        <p type="p">47:有效負載消耗碼量</p>  
        <p type="p">321:最終區塊判定部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1301" publication-number="202628118"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628118.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料儲存設備及其操作方法</chinese-title>  
        <english-title>DATA STORAGE APPARATUS AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">G11C29/52</main-classification>  
        <further-classification edition="200601120251008B">G11C5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金世中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SE JOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金辰杓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN PYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料儲存設備，包括：非揮發性記憶體設備和控制器。所述控制器被配置成當所述資料儲存設備進入電力損失保護模式時設置與電力損失保護操作相關聯的第一閾值時間，並且在外部電力損失之後達到所述第一閾值時間時備份除錯資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data storage apparatus includes a nonvolatile memory apparatus and a controller. The controller is configured to set a first threshold time associated with a power loss protection operation when the data storage apparatus enters a power loss protection mode and to back up debug data upon reaching the first threshold time after the external power loss.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子系統</p>  
        <p type="p">100:外部設備</p>  
        <p type="p">200:資料儲存設備</p>  
        <p type="p">210:控制器</p>  
        <p type="p">220:非揮發性記憶體設備</p>  
        <p type="p">220-0~220-k:非揮發性記憶體設備</p>  
        <p type="p">230:緩衝記憶體設備</p>  
        <p type="p">240:電源</p>  
        <p type="p">241:輔助電源</p>  
        <p type="p">250:電力損失保護(PLP)管理器</p>  
        <p type="p">1101:訊號連接器</p>  
        <p type="p">1103:電力連接器</p>  
        <p type="p">ADDR:位址訊號</p>  
        <p type="p">CH0~CHk:通道</p>  
        <p type="p">CMD:命令訊號</p>  
        <p type="p">DT:資料</p>  
        <p type="p">PL1~PLt:電力線</p>  
        <p type="p">VES1~VESt:外部電源電壓</p>  
        <p type="p">VIS1~VISn:內部電源電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1302" publication-number="202628687"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628687.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">H10D84/85</main-classification>  
        <further-classification edition="202501120260318B">H10D30/43</further-classification>  
        <further-classification edition="202501120260318B">H10D62/13</further-classification>  
        <further-classification edition="202501120260318B">H10D64/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁正吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNGGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金洞院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">積體電路裝置包括在基底上沿第一方向縱向延伸的主動區域、包括閘極線、高介電層、以及界面介電層的閘極結構，其在主動區域上沿垂直於第一水平方向的第二方向縱向延伸、配置在主動區域的鰭頂表面上並與閘極結構接觸的奈米片、配置在主動區域上並與奈米片接觸的源極/汲極區、以及在垂直於第一方向和第二方向兩者的方向上位於源極/汲極區下方，配置在從主動區域的鰭頂表面延伸的源極/汲極凹槽中的下部絕緣間隔件，其中界面介電層包括在奈米片上延伸的第一部分、以及在源極/汲極區上延伸的第二部分，以及其中第一部分的第一厚度不同於第二部分的第二厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit device includes an active region extending lengthwise in a first direction on a substrate, a gate structure including a gate line, a high dielectric layer, and an interface dielectric layer, which extend lengthwise in a second direction perpendicular to the first horizontal direction on the active region, a nanosheet arranged on a fin upper surface of the active region and contacting the gate structure, a source/drain region arranged on the active region and contacting the nanosheet, and under the source/drain region in a direction perpendicular to both the first direction and the second direction, a lower insulating spacer arranged in a source/drain recess extending from the fin upper surface of the active region, wherein the interface dielectric layer includes a first portion extending on the nanosheet, and a second portion extending on the source/drain region, and wherein a first thickness of the first portion is different from a second thickness of the second portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路裝置</p>  
        <p type="p">F1:主動區域</p>  
        <p type="p">X1-X1、Y1-Y1:線</p>  
        <p type="p">NSS:奈米片堆疊</p>  
        <p type="p">CA:源極/汲極接觸件</p>  
        <p type="p">130:源極/汲極區、第一汲極區</p>  
        <p type="p">160:閘極線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1303" publication-number="202628836"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628836.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鉬填充的特徵部內平坦化</chinese-title>  
        <english-title>IN FEATURE PLANARIZATION FOR MOLYBDENUM FILL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P50/24</main-classification>  
        <further-classification edition="200601120260318B">C23F1/26</further-classification>  
        <further-classification edition="200601120260318B">C09K13/04</further-classification>  
        <further-classification edition="200601120260318B">H05H1/24</further-classification>  
        <further-classification edition="200601120260318B">C23C16/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧完雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOH, WANWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張馳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　舉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, JUWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾許地安尼　凱翰　阿畢迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHTIANI, KAIHAN ABIDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>繆靜慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, JINGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅正錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, JEONG-SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬亨德卡　納溫　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHENDERKAR, NAVEEN KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供用於鉬(Mo)沉積之特徵部內平坦化的方法及設備。該方法涉及氧化或氮化部含鉬材料之一部分，以形成氧化鉬或氮化鉬，並選擇性地蝕刻氧化鉬或氮化鉬。該方法可用於減少特徵部內部或特徵部之間的變異。例如，可改善線間變異、線內粗糙度及線彎曲。本文所述方法可用於邏輯及記憶體應用，並可用於在半導體基板中沉積鉬，半導體基板具有例如貫孔、字元線 (例如動態隨機存取記憶體(DRAM)埋入式字元線(bWL)) 及溝槽之特徵部。該方法可用於沉積鉬以填充特徵部，作為襯層及/或填充特徵部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods and apparatus for in-feature planarization of molybdenum (Mo) deposition. The method involves oxidizing or nitriding a portion of the molybdenum-containing material to form molybdenum oxide or molybdenum nitride, and selectively etching the molybdenum oxide or molybdenum nitride. The method may be used to reduce variations within the feature or between the features. For example, line-to-line variation, in-line roughness, and line bending may be improved. The methods described herein may be used for logic and memory applications and may be used to deposit molybdenum in a semiconductor substrate with features such as vias, wordlines such as dynamic random-access memory (DRAM) buried wordline (bWL), and trenches. The method may be used to deposit molybdenum to fill features as liner layer and/or fill features.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">511:基板</p>  
        <p type="p">513:特徵部開口</p>  
        <p type="p">515:含鉬材料</p>  
        <p type="p">516:氧化鉬或氮化鉬</p>  
        <p type="p">517:深度</p>  
        <p type="p">519:深度</p>  
        <p type="p">520:表面改質製程</p>  
        <p type="p">527:均勻含鉬材料</p>  
        <p type="p">530:選擇性蝕刻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1304" publication-number="202628750"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628750.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光元件</chinese-title>  
        <english-title>LIGHT-EMITTING ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260325B">H10K50/00</main-classification>  
        <further-classification edition="202301120260325B">H10K50/11</further-classification>  
        <further-classification edition="202301120260325B">H10K50/12</further-classification>  
        <further-classification edition="202301120260325B">H10K85/00</further-classification>  
        <further-classification edition="202301120260325B">H10K85/30</further-classification>  
        <further-classification edition="202301120260325B">H10K85/60</further-classification>  
        <further-classification edition="202301120260325B">H10K59/00</further-classification>  
        <further-classification edition="202301320260325B">H10K102/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下垣智子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHITAGAKI, SATOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀨尾哲史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大澤信晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHSAWA, NOBUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上英子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, HIDEKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木邦彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種外部量子效率高的發光元件。此外，本發明提供一種壽命長的發光元件。本發明提供一種發光元件，包括：一對電極之間的包含磷光化合物、第一有機化合物以及第二有機化合物的發光層，其中，第一有機化合物和第二有機化合物的組合是形成激基複合物的組合。該發光元件由於利用激基複合物的發射光譜與磷光化合物的吸收光譜的重疊並進行能量轉移，所以能量轉移效率高。因此，可以實現外部量子效率高的發光元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting element having high external quantum efficiency is provided. A light-emitting element having a long lifetime is provided. A light-emitting element is provided which includes a light-emitting layer containing a phosphorescent compound, a first organic compound, and a second organic compound between a pair of electrodes, in which a combination of the first organic compound and the second organic compound forms an exciplex (excited complex). The light-emitting element transfers energy by utilizing an overlap between the emission spectrum of the exciplex and the absorption spectrum of the phosphorescent compound and thus has high energy transfer efficiency. Therefore, a light-emitting element having high external quantum efficiency can be obtained.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1305" publication-number="202625998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣按摩裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61H9/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林稔彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉田陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURATA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兒島猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河本實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示是提供一種在不使用時或收納時易於謀求小型化之空氣按摩裝置。本揭示之空氣按摩裝置1是按摩腳L0。空氣按摩裝置1是具備：排列於一個方向之第1氣囊3及第2氣囊4、空氣供給裝置20、空氣軟管與固定構件。第1氣囊3及第2氣囊4是藉由空氣的供氣排氣而膨脹收縮。第1氣囊3及第2氣囊4是筒狀。空氣供給裝置20是對第1氣囊3及第2氣囊4進行空氣的供氣排氣。空氣軟管是連接空氣供給裝置20、與第1氣囊3及第2氣囊4。固定構件是將空氣供給裝置20、第1氣囊3、與第2氣囊4固定。空氣按摩裝置1是構成為能以沿著一個方向之折痕折疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:空氣按摩裝置</p>  
        <p type="p">20:空氣供給裝置</p>  
        <p type="p">24:操作面板</p>  
        <p type="p">3:第1氣囊</p>  
        <p type="p">32,42,521:插入口</p>  
        <p type="p">33,43:開口</p>  
        <p type="p">4:第2氣囊</p>  
        <p type="p">5:外形輪廓構件</p>  
        <p type="p">53:緩衝構件</p>  
        <p type="p">53A:第1緩衝構件</p>  
        <p type="p">53B:第2緩衝構件</p>  
        <p type="p">511:第2端</p>  
        <p type="p">522:開口部</p>  
        <p type="p">523:端部</p>  
        <p type="p">L0:腳</p>  
        <p type="p">L01:足部</p>  
        <p type="p">L02:小腿部</p>  
        <p type="p">L03:大腿部</p>  
        <p type="p">L1:右腳</p>  
        <p type="p">L2:左腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1306" publication-number="202626599"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626599.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129371</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於能量儲存裝置之溴化亞硫酸酯阻燃添加劑</chinese-title>  
        <english-title>BROMINATED SULFITE FLAME RETARDANT ADDITIVES FOR ENERGY STORAGE DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C301/00</main-classification>  
        <further-classification edition="200601120260401B">C07D327/10</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0567</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞比馬利股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBEMARLE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛　忠新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, ZHONGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　艾瑞克莫瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, ERIC MAURICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於能量儲存裝置之非水電解質溶液，該溶液包含i)非質子有機溶劑系統；ii)鹼金屬鹽；及iii)至少一種溴化亞硫酸酯基阻燃添加劑化合物。鹵化亞硫酸酯阻燃劑增加非水電解質溶液之阻燃性及/或熱失控抑制能力，而不會明顯影響非水電解質溶液之電化學效能。提供用於製備此類非水電解質溶液之方法及製程以及含有此類非水電解質溶液之能量儲存裝置。亦提供具有此等增強性質之電能儲存裝置，該等增強之性質包括增強之阻燃性及熱失控抑制能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nonaqueous electrolyte solution for an energy storage device, the solution comprises i) an aprotic organic solvent system; ii) an alkali metal salt; and iii) at least one brominated sulfite-based flame-retardant additive compound. The halogenated sulfite flame retardant increases the flame retardancy and/or thermal runaway inhibitory capacity of the nonaqueous electrolyte solution without appreciably impacting the electrochemical performance of the nonaqueous electrolyte solution. Methods and processes for making such nonaqueous electrolyte solutions and energy storage devices containing the same are provided. Electrical energy storage devices with these enhanced properties, including enhanced flame retardancy and thermal runaway inhibitory capacity, are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1307" publication-number="202627100"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627100.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改良基因插入之方法及在細胞株中之表現</chinese-title>  
        <english-title>METHODS FOR IMPROVED GENE INSERTION AND EXPRESSION IN CELL LINES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N15/85</main-classification>  
        <further-classification edition="200601120260401B">C12N15/90</further-classification>  
        <further-classification edition="200601120260401B">C12N5/10</further-classification>  
        <further-classification edition="200601120260401B">C07K16/00</further-classification>  
        <further-classification edition="200601120260401B">C12P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＲＰ先靈爾科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>R.P. SCHERER TECHNOLOGIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商克拉里斯生物醫療股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLARIS BIOTHERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊克　格雷戈里Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLECK, GREGORY T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰森　卡爾Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, KARL F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於編碼不同基因產物諸如蛋白質之表現構築體以規定比率引入含有用於插入核酸構築體之多個對接位點的宿主細胞株中，且係關於需要表現至少兩種基因產物諸如酶及該酶之受質的蛋白質之產生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the introduction of expression constructs encoding different gene products such as proteins at defined ratios into host cell lines containing multiple dock sites for insertion of the nucleic acid construct, and to the production of proteins that require expression of at least two gene products such as an enzyme and a substrate for the enzyme.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1308" publication-number="202626054"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626054.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GIP受體促效劑化合物</chinese-title>  
        <english-title>GIP RECEPTOR AGONIST COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K31/5375</main-classification>  
        <further-classification edition="200601120260324B">A61K31/506</further-classification>  
        <further-classification edition="200601120260324B">A61K31/438</further-classification>  
        <further-classification edition="200601120260324B">A61K31/437</further-classification>  
        <further-classification edition="200601120260324B">A61K31/4365</further-classification>  
        <further-classification edition="200601120260324B">A61K31/42</further-classification>  
        <further-classification edition="200601120260324B">A61K31/4155</further-classification>  
        <further-classification edition="200601120260324B">A61P3/00</further-classification>  
        <further-classification edition="200601120260324B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯坦　裘利　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASTIAN, JOLIE ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢歐錢普　湯瑪斯　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAUCHAMP, THOMAS JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝赫納　道格拉斯　卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEHENNA, DOUGLAS CARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布特勒　瑪麗亞　德　皮拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUTELER, MARIA DEL PILAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢伯思　瑞秋　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAMBERS, RACHEL KATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　界豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIEHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　招根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHAOGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜蘭　堤摩西　巴瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DURHAM, TIMOTHY BARRETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哲亞古　弗群　奧圖寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DZEAGU, FORTUNE OTUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲爾茲　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIELDS, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢恩　派崔克　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAHN, PATRIC JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢柏　艾瑞克　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEMBRE, ERIK JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃有銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YOUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫利許　史蒂芬　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKLISH, STEVEN LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅培茲　葛西亞　荷西　艾德瓦多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOPEZ GARCIA, JOSE EDUARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅根諾　伊森　林德賽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGNO, ETHAN LINDSAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩爾　麥斯威爾　強森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORE, MAXWELL JOHNSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路克　保羅　文生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUCKER, PAUL VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="19"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史奇米特　丹尼爾　科普立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITT, DANIEL COPLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="20"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史崔斯費德　丹尼爾　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRASSFELD, DANIEL AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="21"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維德勒　路易斯　羅賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIDLER, LEWIS ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="22"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙改英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GAIYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供下式之化合物： &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="226px" file="ed11156.JPG" alt="ed11156.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及其醫藥學上可接受之鹽，以及包含此等化合物之醫藥組合物及其治療II型糖尿病及肥胖症之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides compounds of the formula: &lt;br/&gt;&lt;img align="absmiddle" height="130px" width="232px" file="ed11157.JPG" alt="ed11157.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and their pharmaceutically acceptable salts, as well as pharmaceutical compositions comprising these compounds and their use in the treatment of type II diabetes mellitus and obesity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1309" publication-number="202626608"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626608.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種含芳香稠環的化合物、其藥物組合物和應用</chinese-title>  
        <english-title>COMPOUND CONTAINING AROMATIC FUSED RINGS, PHARMACEUTICAL COMPOSITIONS AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D217/22</main-classification>  
        <further-classification edition="200601120260401B">A61K31/472</further-classification>  
        <further-classification edition="200601120260401B">A61P25/08</further-classification>  
        <further-classification edition="200601120260401B">A61P25/22</further-classification>  
        <further-classification edition="200601120260401B">A61P25/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江西科睿藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGXI KERUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊康敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KANGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴守升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHOUSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邰正福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, ZHENGFU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種含芳香稠環的化合物、其藥物組合物和應用。具體提供了化合物I’或其藥學上可接受的鹽，其具有如下一個或多個效果優勢：（1）結構新穎；（2）對KCNQ2/3通道具有良好的開放作用；（3）對KCNQ4、KCNQ5開放活性相對較弱；（4）具有良好的KCNQ2/3選擇性；（5）毒副作用小；（6）體內藥效好，具有良好的抗癲癇發作效果；（7）具有優異的安全窗；（8）具有良好的腦血比和（9）具有良好的腦、血濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a class of compounds containing aromatic fused rings, pharmaceutical compositions and applications thereof. Specifically, the present invention provides a compound I' or pharmaceutically acceptable salts thereof, which have one or more of the following advantages: (1) novel structure; (2) good opening effect on KCNQ2/3 channels; (3) relatively weak opening activity on KCNQ4 and KCNQ5; (4) good KCNQ2/3 selectivity; (5) low toxicity; (6) good in vivo efficacy and good anti-epileptic effect; (7) excellent safety window; (8) good brain-blood ratio and (9) good brain and blood concentrations.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1310" publication-number="202628806"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628806.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以提供局部CD均勻性的相對碳遮罩之選擇性蝕刻</chinese-title>  
        <english-title>SELECTIVE ETCH WITH RESPECT TO CARBON MASK TO PROVIDE LOCAL CD UNIFORMITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10P14/61</main-classification>  
        <further-classification edition="202601120260317B">H10P50/28</further-classification>  
        <further-classification edition="200601120260317B">C09K13/08</further-classification>  
        <further-classification edition="200601120260317B">C23C8/04</further-classification>  
        <further-classification edition="200601120260317B">C23C8/06</further-classification>  
        <further-classification edition="200601120260317B">H05H1/24</further-classification>  
        <further-classification edition="202601120260317B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋伯　葛瑞格里　克林頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEBER, GREGORY CLINTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　南科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, NANKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勾帕拉達蘇　普拉伯哈克拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPALADASU, PRABHAKARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄　天樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, MERRETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧澤爾　塔內爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZEL, TANER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供在含碳遮罩下方之堆疊中蝕刻凹陷特徵部的方法。提供不具有碳的蝕刻氣體，該不具有碳的蝕刻氣體包含氟化氫及不具有碳的鈍化劑。將不具有碳的蝕刻氣體轉變成電漿。將堆疊暴露於電漿，其中電漿係相對含碳遮罩選擇性蝕刻堆疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of etching recessed features in a stack below a carbon containing mask is provided. A carbon free etch gas comprising hydrogen fluoride and a carbon free passivant is provided. The carbon free etch gas is transformed into a plasma. The stack is exposed to the plasma wherein the plasma selectively etches the stack with respect to the carbon containing mask.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">204:步驟</p>  
        <p type="p">208:步驟</p>  
        <p type="p">212:步驟</p>  
        <p type="p">216:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1311" publication-number="202627357"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627357.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微波爐加熱用治具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">F24C7/02</main-classification>  
        <further-classification edition="200601120260316B">B65D81/34</further-classification>  
        <further-classification edition="200601120260316B">A47J27/00</further-classification>  
        <further-classification edition="200601120260316B">H05B6/64</further-classification>  
        <further-classification edition="200601120260316B">B65D25/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大和製罐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIWA CAN COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>犬丸彰子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INUMARU, AYAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野美空</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, MIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村保昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YASUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種技術，其在被容納於金屬製罐容器的物品透過微波爐來加熱時，可抑制由金屬引起的缺陷之產生。微波爐加熱用治具(10A)為非金屬製的微波爐加熱用治具，使用於透過微波爐將被容納在金屬製罐容器(21)的物品(22)進行加熱時，將前述金屬製罐容器(21)以與前述微波爐的庫內底面(W1)的距離擴大的狀態下設置在庫內；包含：支承部(11)，具有筒形狀；以及平板狀的補強部(12)，被連接至前述支承部(11)的一方的開口；在將前述支承部(11)與前述補強部(12)相連接的稜線部(13)之位置處，具有一個以上的凹部(R)，其各別地向前述微波爐加熱用治具(10A)的內側凹陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:治具附屬罐頭製品</p>  
        <p type="p">10A:微波爐加熱用治具</p>  
        <p type="p">11:支承部</p>  
        <p type="p">11b:下部</p>  
        <p type="p">11p:凸部</p>  
        <p type="p">11t:上部</p>  
        <p type="p">12:補強部</p>  
        <p type="p">20:罐頭製品</p>  
        <p type="p">21:金屬製罐容器</p>  
        <p type="p">21a:罐體</p>  
        <p type="p">21b:罐底</p>  
        <p type="p">21c:罐蓋</p>  
        <p type="p">21c1’:罐蓋本體</p>  
        <p type="p">22:物品</p>  
        <p type="p">22a:第一食品</p>  
        <p type="p">22b:第二食品</p>  
        <p type="p">112:底板</p>  
        <p type="p">P:凸部</p>  
        <p type="p">R:凹部</p>  
        <p type="p">W1:庫內底面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1312" publication-number="202626528"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626528.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陰離子交換裝置中之性能降低的原因之推定方法及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR ESTIMATING THE CAUSE OF REDUCED PERFORMANCE IN AN ANION EXCHANGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260318B">C02F1/42</main-classification>  
        <further-classification edition="201701120260318B">B01J49/85</further-classification>  
        <further-classification edition="200601120260318B">G01N27/06</further-classification>  
        <further-classification edition="200601120260318B">G01N30/00</further-classification>  
        <further-classification edition="200601120260318B">G05D21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本浩一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木田卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIDA, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田雅司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種推定在交互進行脫鹽處理與再生處理之陰離子交換裝置中之性能降低的原因的原因推定方法，具有：在脫鹽處理的實施中，就差壓的測定值及處理水的水質相關的測定值之至少一者取得時間系列數據的步驟；以及將從進行再生處理後到進行下個再生處理為止所進行之1次的脫鹽處理的期間作為1循環，並將各循環分割為預定數量的平均化期間，從依各平均化期間而構成時間系列數據的各個測定值算出平均值的步驟。依各循環而對於其循環內之平均化期間從前頭依序分配順序，並基於在重複循環時之平均值的變遷來推定陰離子交換裝置中之性能降低的原因。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cause estimation method which estimates the cause of reduced performance in an anion exchange device in which desalination treatments and regeneration treatments are conducted in an alternate manner, the method including: a step of acquiring, during each desalination treatment, time series data relating to measurement values for at least one or other of the differential pressure and the water quality of the treated water; and a step in which, when one cycle is deemed the duration of one desalination treatment from completion of one regeneration treatment until the start of the next regeneration treatment, each cycle is divided into a predetermined number of averaged periods and an average value is calculated from the measurement values that constitute the time series data for each averaged period. The cause of reduced performance in the anion exchange device is estimated on the basis of the change in the average over repeated cycles, with the averaged periods in each cycle being assigned an order that is counted from the beginning of that cycle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21,24:儲存槽</p>  
        <p type="p">22,25,41:泵浦</p>  
        <p type="p">23:過濾器</p>  
        <p type="p">26:活性碳塔</p>  
        <p type="p">30:離子交換處理部</p>  
        <p type="p">42:逆滲透膜裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1313" publication-number="202627243"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627243.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>石英玻璃坩鍋</chinese-title>  
        <english-title>QUARTZ GLASS CRUCIBLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C30B15/10</main-classification>  
        <further-classification edition="200601120251222B">C03C3/06</further-classification>  
        <further-classification edition="200601120251222B">C03B19/09</further-classification>  
        <further-classification edition="200601120251222B">C03B20/00</further-classification>  
        <further-classification edition="200601120251222B">C30B35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北原賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAHARA, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷部幸太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEBE, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北原江梨子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAHARA, ERIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸弘史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種在拉晶步驟中的高溫下不易發生向內塌陷的石英玻璃坩鍋。 &lt;br/&gt;[解決手段]本發明的石英玻璃坩鍋1具有圓筒狀的側壁部10a、彎曲的底部10b、以及具有大於上述底部的曲率且設置於側壁部10a與底部10b之間的角落部10c，相對於側壁部10a的外半徑的坩鍋的外表面10o的底部10b側的曲率變化點P&lt;sub&gt;b&lt;/sub&gt;的徑方向的相對位置在0.59～0.72的範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">[Problem]To provide a quartz glass crucible that is resistant to inward deformation at high temperatures during the crystal pulling process. &lt;br/&gt;[Solution]The quartz glass crucible 1 of the present invention includes a cylindrical sidewall portion 10a, a curved bottom portion 10b, and a corner portion 10c having a curvature greater than that of the bottom portion and provided between the sidewall portion 10a and the bottom portion 10b. The radial relative position of the curvature change point Pb on the bottom-side of the outer surface 10o of the crucible, relative to the outer radius of the sidewall portion 10a, is within a range of 0.59 to 0.72.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:石英玻璃坩鍋</p>  
        <p type="p">10a:側壁部</p>  
        <p type="p">10b:底部</p>  
        <p type="p">10c:角落部</p>  
        <p type="p">10e:邊緣部(側壁部的上端)</p>  
        <p type="p">R:直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1314" publication-number="202629037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129625</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及基板單元</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/00</main-classification>  
        <further-classification edition="202601120260302B">H10W70/60</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202301120260302B">H10B12/00</further-classification>  
        <further-classification edition="200601120260302B">G11C5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新妻和幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIITSUMA, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">其中一個實施形態之半導體記憶裝置，係具有第1基板、和第2基板。前述第1基板，係具有第1部分、和較前述第1部分而更薄之第2部分、以及被設置在前述第2部分處之複數之第1導通部。前述第2基板，係具有複數之第2導通部。前述複數之第2導通部，係在從身為前述第1基板之厚度方向之第1方向來作觀察的情況時，會與前述複數之第1導通部相重疊。前述複數之第2導通部之各者，係藉由焊錫而被與前述複數之第1導通部作連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板單元</p>  
        <p type="p">21:基板</p>  
        <p type="p">21e1:第1端部</p>  
        <p type="p">21e2:第2端部</p>  
        <p type="p">21h:固定孔</p>  
        <p type="p">22:連接連接器</p>  
        <p type="p">22a:金屬端子</p>  
        <p type="p">23:控制器</p>  
        <p type="p">24:DRAM</p>  
        <p type="p">25:NAND(半導體記憶體)</p>  
        <p type="p">26:電源控制零件</p>  
        <p type="p">27:電容器</p>  
        <p type="p">30:第1基板</p>  
        <p type="p">30p:訊號線</p>  
        <p type="p">31:第1部分</p>  
        <p type="p">31a:第1面</p>  
        <p type="p">31b:第2面</p>  
        <p type="p">32:第2部分</p>  
        <p type="p">32a:第1面</p>  
        <p type="p">32b:第2面</p>  
        <p type="p">32h:固定孔(第1孔)</p>  
        <p type="p">40:第2基板</p>  
        <p type="p">40p:訊號線</p>  
        <p type="p">41:第3部分</p>  
        <p type="p">41a:第1面</p>  
        <p type="p">41b:第2面</p>  
        <p type="p">42:第4部分</p>  
        <p type="p">42a:第1面</p>  
        <p type="p">42b:第2面</p>  
        <p type="p">42h:固定孔(第2孔)</p>  
        <p type="p">50:墊片(第1導通部)</p>  
        <p type="p">60:凸面(第2導通部)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1315" publication-number="202626758"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626758.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129638</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物，膜形成方法及物品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">C08F122/10</further-classification>  
        <further-classification edition="201401120260401B">C09D11/101</further-classification>  
        <further-classification edition="200601120260401B">G03F7/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">B29C59/02</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田栄一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, EIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田彩乃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASHIDA, AYANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種硬化性組成物，其包含：聚合性化合物(a)、光聚合起始劑(b)、添加劑(c)及溶劑(d)，其特徵在於，相對於前述硬化性組成物全體之前述溶劑(d)的含量大於5體積%，且為95體積%以下，前述溶劑(d)的沸點在1氣壓下為100℃以上、未滿250℃，前述添加劑(c)為由碳、氧及氫所構成之化合物，或由碳、氮、氧及氫所構成之化合物，前述添加劑(c)以格里芬法計算之HLB值為2.0以上、8.4以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1316" publication-number="202626241"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626241.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129691</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法及光學檢測系統</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND OPTICAL INSPECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260302B">B23K26/53</main-classification>  
        <further-classification edition="200601120260302B">G01N21/88</further-classification>  
        <further-classification edition="202601120260302B">H10W70/692</further-classification>  
        <further-classification edition="202601120260302B">H10W70/63</further-classification>  
        <further-classification edition="201701120260302B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁景隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, CHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樊光明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, KUANG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電子裝置的製造方法，包含提供基板；對基板的至少一部分執行第一改質步驟；產生第一側向入射光，以使第一側向入射光導入基板內部；檢查經過第一改質步驟後的基板，以獲得與基板狀態相關的檢測資訊；以及根據檢測資訊，判斷是否需要進行重工處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device includes providing a substrate; performing a first modification step on at least a portion of the substrate; generating a first side-incident light to introduce the first side-incident light into an interior of the substrate; inspecting the substrate after the first modification step to acquire detection information related to a state of the substrate; and based on the detection information, determining whether a rework process is required.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100至S109:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1317" publication-number="202626882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱導性組合物、熱導膠及其用途</chinese-title>  
        <english-title>THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE GEL, AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08G77/18</main-classification>  
        <further-classification edition="200601120260325B">C08G77/12</further-classification>  
        <further-classification edition="200601120260325B">C08G77/442</further-classification>  
        <further-classification edition="200601120260325B">C08G77/20</further-classification>  
        <further-classification edition="201801120260325B">C08K3/014</further-classification>  
        <further-classification edition="200601120260325B">C08K3/04</further-classification>  
        <further-classification edition="200601120260325B">C09K5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢高股份有限及兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于恒達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HENGDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康建國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JIANGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種熱導性組合物、一種由此固化之熱導膠、一種用於製備該膠之方法、一種包含該膠之製品及其用途。由本發明之熱導性組合物固化之熱導膠顯示良好抗分層性質，同時維持極佳之流動性及熱導率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a thermally conductive composition, a thermally conductive gel cured therefrom, a process for preparing the gel, an article comprising the gel, and the use thereof. The thermally conductive gel cured from the thermally conductive composition of the present invention exhibits good anti-delamination property, while maintaining excellent flowability and thermal conductivity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1318" publication-number="202626772"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626772.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著片、光學積層體、影像顯示裝置、部分聚合物、單體漿、光硬化性黏著劑組成物、及黏著片之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08F2/50</main-classification>  
        <further-classification edition="200601120260319B">G02B5/30</further-classification>  
        <further-classification edition="200601120260319B">C09J133/10</further-classification>  
        <further-classification edition="201801120260319B">C09J7/24</further-classification>  
        <further-classification edition="200601120260319B">C09J11/06</further-classification>  
        <further-classification edition="200601120260319B">B01J13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山翔平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野寬大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, HIROTOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種耐久性獲得改善之黏著片。&lt;br/&gt; 本發明實施形態之黏著片係由含單體漿之光硬化性黏著劑組成物形成。該單體漿包含單體成分M1與該單體成分M1之部分聚合物。該部分聚合物具有源自具有芳香環之單體a1的結構單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:黏著片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1319" publication-number="202628823"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628823.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129732</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P50/20</main-classification>  
        <further-classification edition="200601120260327B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊倉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAKURA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹小弓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASA, KOYUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一個例示性實施方式中，蝕刻方法包含如下步驟：(a)將基板提供至腔室內之基板支持部上，基板具備具有凹部之第1膜、及第1膜上之第2膜，第1膜包含金屬元素及/或非金屬元素，第2膜具有與凹部對應之開口；(b)藉由自第1處理氣體產生之第1電漿對凹部之側壁進行改質；及(c)藉由自與第1處理氣體不同之第2處理氣體產生之第2電漿對凹部之底部進行蝕刻，並且於第2膜上形成含金屬沉積物，第2處理氣體包含含鹵素氣體及含金屬氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">MT1:蝕刻方法</p>  
        <p type="p">ST1~ST8:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1320" publication-number="202627426"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627426.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129793</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紅外線檢測元件、紅外線感測器、及紅外線檢測元件之製造方法</chinese-title>  
        <english-title>INFRARED DETECTION DEVICE, INFRARED SENSOR, AND METHOD FOR PRODUCING INFRARED DETECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G01J1/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原口靖史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARAGUCHI, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒田剛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東筋俊行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGASISUJI, TOSIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>足立博史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADACHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於謀求紅外線檢測元件之高感度化。紅外線檢測元件(10)具備熱電體基板(1)、第1電極(2)、第2電極(3)及紅外線吸收層(4)。熱電體基板(1)於厚度方向(D1)上具有第1面(11)及第2面(12)。第1電極(2)設置於熱電體基板(1)之第1面(11)上。第2電極(3)以於厚度方向(D1)上與第1電極(2)重疊之方式設置於熱電體基板(1)之第2面(12)上。紅外線吸收層(4)設置於第1電極(2)上。熱電體基板(1)具有沿厚度方向(D1)貫通熱電體基板(1)之貫通孔(19)。貫通孔(19)於熱電體基板(1)中形成於夾在第1電極(2)與第2電極(3)之間之部分即特定部(13)之周圍。貫通孔(19)具有第1面(11)側之寬度較第2面(12)側窄之錐形構造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熱電體基板</p>  
        <p type="p">2:第1電極</p>  
        <p type="p">3:第2電極</p>  
        <p type="p">4:紅外線吸收層</p>  
        <p type="p">11:第1面</p>  
        <p type="p">12:第2面</p>  
        <p type="p">13:特定部</p>  
        <p type="p">15:規定部分</p>  
        <p type="p">16:支持部分</p>  
        <p type="p">19:貫通孔</p>  
        <p type="p">21:上表面</p>  
        <p type="p">23:側面</p>  
        <p type="p">43:側面</p>  
        <p type="p">100:檢測部</p>  
        <p type="p">D1:厚度方向</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1321" publication-number="202626209"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626209.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二流體噴嘴吐出裝置及使用此的旋轉處理方法</chinese-title>  
        <english-title>TWO-FLUID NOZZLE DISCHARGE DEVICE AND SPIN PROCESSING METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B05B7/00</main-classification>  
        <further-classification edition="200601120260323B">B05B7/08</further-classification>  
        <further-classification edition="200601120260323B">B05B7/14</further-classification>  
        <further-classification edition="202601120260323B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三益半導體工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIMASU SEMICONDUCTOR INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日下部恭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAKABE, KYOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小笠原俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGASAWARA, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供二流體噴嘴吐出裝置及使用此的旋轉處理方法，不僅可在二流體噴嘴的液體入口側，無脈動且均勻地以比以往還高壓地壓送液體，還可防止從前述二流體噴嘴吐出混合流體之際的脈動。 &lt;br/&gt;　　[解決手段]二流體噴嘴吐出裝置，包含：二流體噴嘴本體；氣體壓送系統，其具備氣體加壓用調節器，用來將加壓後的惰性氣體輸送至前述二流體噴嘴本體；液體壓送系統，其具備：為了將加壓後的液體輸送至前述二流體噴嘴本體而使溫度調節過的液體循環的循環槽、將來自前述循環槽的液體予以壓送的泵；以及液體推進系統，其具備液體加壓用調節器，對於前述壓送過來的液體，送入加壓後的惰性氣體藉此進一步施加壓力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本發明的二流體噴嘴吐出裝置</p>  
        <p type="p">12:旋轉處理裝置</p>  
        <p type="p">14:液體回收機構</p>  
        <p type="p">16:二流體噴嘴本體</p>  
        <p type="p">18:氣體加壓用調節器</p>  
        <p type="p">20:氣體壓送系統</p>  
        <p type="p">22:循環槽</p>  
        <p type="p">24,50:泵</p>  
        <p type="p">26:液體壓送系統</p>  
        <p type="p">28:液體加壓用調節器</p>  
        <p type="p">30:液體推進系統</p>  
        <p type="p">40,42,44,45,47,48:配管</p>  
        <p type="p">46:液體回收系統</p>  
        <p type="p">52:加熱器</p>  
        <p type="p">54:過濾器構件</p>  
        <p type="p">56:第一閥</p>  
        <p type="p">58:第二閥</p>  
        <p type="p">60:第三閥</p>  
        <p type="p">62:第四閥</p>  
        <p type="p">64:第五閥</p>  
        <p type="p">66:第六閥</p>  
        <p type="p">68:耐壓槽</p>  
        <p type="p">70:空檢測感測器</p>  
        <p type="p">72:滿檢測感測器</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1322" publication-number="202628199"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628199.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129817</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>準分子燈</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H01J61/24</main-classification>  
        <further-classification edition="200601120260330B">H01J61/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商牛尾電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USHIO DENKI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田尚樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡稜河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, RYOGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀部大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBE, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹添法𨺓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEZOE, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠木邦雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAGI, KUNIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有川一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIKAWA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種準分子燈，能夠容易地抑制製造工序中的污垢且作業性高。準分子燈的特徵在於具備：外側管，沿管軸方向延伸；內側管，在前述外側管的內側在前述管軸方向上延伸配置；發光管，前述外側管和前述內側管在前述管軸方向上的端部被密封而成；發光氣體，封入於由前述外側管和前述內側管夾著的發光空間；外側電極，配置於前述外側管的外壁面；內側電極，配置於前述內側管的內壁面；基座，呈在前述管軸方向上凹陷的形狀，具有供前述發光管的管軸方向上的端部插入的凹部區域；及排氣管剩餘部，在位於前述凹部區域內的前述外側管的外壁面上具有基部，向與前述管軸方向不同的方向突出，前述排氣管剩餘部的前端部位於比前述基座的外壁面還靠發光管側處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:準分子燈</p>  
        <p type="p">3:發光管</p>  
        <p type="p">5:內側電極</p>  
        <p type="p">7:外側電極</p>  
        <p type="p">9a,9b:基座</p>  
        <p type="p">11:外側管</p>  
        <p type="p">12:內側管</p>  
        <p type="p">13,14:密封部</p>  
        <p type="p">15,16:排氣管剩餘部</p>  
        <p type="p">21:貫通孔</p>  
        <p type="p">25:彈性構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1323" publication-number="202626613"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626613.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＰＩ３Ｋ－α結合化合物及其用途</chinese-title>  
        <english-title>PI3K-ALPHA BINDING COMPOUNDS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D241/04</main-classification>  
        <further-classification edition="200601120260401B">C07D401/12</further-classification>  
        <further-classification edition="200601120260401B">C07D403/12</further-classification>  
        <further-classification edition="200601120260401B">C07D409/12</further-classification>  
        <further-classification edition="200601120260401B">C07D405/12</further-classification>  
        <further-classification edition="200601120260401B">C07D413/12</further-classification>  
        <further-classification edition="200601120260401B">C07D487/04</further-classification>  
        <further-classification edition="200601120260401B">C07D417/12</further-classification>  
        <further-classification edition="200601120260401B">C07D471/04</further-classification>  
        <further-classification edition="200601120260401B">C07D487/08</further-classification>  
        <further-classification edition="200601120260401B">C07D401/14</further-classification>  
        <further-classification edition="200601120260401B">C07D417/14</further-classification>  
        <further-classification edition="200601120260401B">C07D405/14</further-classification>  
        <further-classification edition="200601120260401B">A61K31/497</further-classification>  
        <further-classification edition="200601120260401B">A61K31/495</further-classification>  
        <further-classification edition="200601120260401B">A61K31/496</further-classification>  
        <further-classification edition="200601120260401B">A61K31/501</further-classification>  
        <further-classification edition="200601120260401B">A61K31/506</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4995</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商新領域醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRONTIER MEDICINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿利亞加斯　伊格納西奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALIAGAS, IGNACIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康威　約翰　Ｈ　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONWAY, JOHN H., JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道特珊柯　艾琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOTSENKO, IRINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾藍森　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERLANSON, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方　蘇珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONG, SUSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克法登　雷恩　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCFADDEN, RYAN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕泰爾　史納赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, SNAHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽德爾　弗雷德里克　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIDL, FREDERICK J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王程鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENGPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　煒如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEIRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊德利　艾琳　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADLEY, ERIN K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德蘭斯菲爾德　保羅　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRANSFIELD, PAUL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供可用作癌症治療劑之PI3Kα-KRAS&lt;sup&gt;G12C&lt;/sup&gt;相互作用之小分子共價抑制劑。不希望受理論束縛，本文所揭示之化合物破壞，且在某些實施例中阻礙或抑制PI3Kα-KRAS&lt;sup&gt;G12C&lt;/sup&gt;相互作用，但導致對PI3Kα之活性位點之干擾最小。阻斷該PI3Kα之活性位點之現有PI3Kα抑制劑導致有害副作用，諸如高糖血症。相反，如所揭示之該等抑制劑破壞PI3Kα-KRAS&lt;sup&gt;G12C&lt;/sup&gt;相互作用且破壞PI3Kα/Akt路徑，而不導致高糖血症或其他不期望之脫靶效應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are small molecule covalent inhibitors of the PI3Kα-KRAS&lt;sup&gt;G12C&lt;/sup&gt; interaction which are useful as cancer therapeutics. Without wishing to be bound by theory, the compounds disclosed herein disrupt, and in certain embodiments, impede or inhibit PI3Kα-KRAS&lt;sup&gt;G12C&lt;/sup&gt; interaction, but cause minimal interference with the active site of PI3Kα. Existing PI3Kα inhibitors which block the active site of PI3Kα cause deleterious side effects such as hyperglycemia. In contrast, the inhibitors as disclosed disrupt PI3Kα-KRAS&lt;sup&gt;G12C&lt;/sup&gt; interaction and disrupt the PI3Kα/Akt pathway without causing hyperglycemia or other undesirable off-target effects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1324" publication-number="202625936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>床墊</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">A47C27/15</main-classification>  
        <further-classification edition="200601120251128B">A47C27/16</further-classification>  
        <further-classification edition="200601120251128B">A47C31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛維福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIRWEAVE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野信吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高尾直幹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠在維持所需的耐久性的同時追求睡眠舒適度的優良度的床墊。一種床墊，具有分別包含長絲三維結合體的上層、中間層及下層的各層沿上下的厚度方向積層而成的積層體，所述床墊中，所述各層中最厚的層的厚度與所述積層體的厚度之比、和所述各層中最薄的層的厚度與所述積層體的厚度之比的差為0.2以下，所述中間層的體積密度與所述上層的體積密度之比、和所述中間層的體積密度與所述下層的體積密度之比的差為-0.1以上，所述中間層的體積密度與所述上層的體積密度之比、及所述中間層的體積密度與所述下層的體積密度之比分別大於1.0且小於1.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:積層體</p>  
        <p type="p">101:上層(層)</p>  
        <p type="p">102:中間層(層)</p>  
        <p type="p">103:下層(層)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1325" publication-number="202627170"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627170.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、半導體裝置之製造方法、程式及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C23C16/448</main-classification>  
        <further-classification edition="200601120260323B">C23C16/455</further-classification>  
        <further-classification edition="202601120260323B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野原慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOHARA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石橋清久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIBASHI, KIYOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山根耀真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANE, YOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江端慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBATA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係具有：a)經由具有第1儲存部之第1氣體供給系統，以第1壓力對基板供給處理氣體的步驟；b)經由具有第2儲存部之第2氣體供給系統，以較上述第1壓力低之第2壓力對上述基板供給上述處理氣體的步驟；c)在a)之後進行b)的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1326" publication-number="202626894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚丙烯系薄膜及使用其之包裝用積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08J5/18</main-classification>  
        <further-classification edition="200601120260325B">C08L23/14</further-classification>  
        <further-classification edition="201901120260325B">B32B7/035</further-classification>  
        <further-classification edition="200601120260325B">B32B27/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗薄膜先端加工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY ADVANCED FILM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, YOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德田浩忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUDA, HIROTADA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中上和城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUJO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田一生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, ISSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種遮光性、耐低溫衝擊性、低溫熱封性、高溫耐黏連性、二次加工性優異的聚丙烯系薄膜及使用其之包裝用積層體。一種聚丙烯系薄膜，其係由基底層(A)與密封層(B)的至少2層所構成，其中基底層(A)係以熔解溫度峰為140℃以上的聚丙烯系樹脂作為主要成分，密封層(B)係以熔解溫度峰為130～145℃的聚丙烯系樹脂作為主要成分，表面的依據粗糙度曲線要素之高度0.3μm以上的波峰的波峰計數Rpc為100個/20mm&lt;sup&gt;2&lt;/sup&gt;以上，薄膜的總透光率為50%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1327" publication-number="202626246"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626246.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子零件安裝基板之製造方法、焊料糊與助焊劑之組合品、及助焊劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">B23K35/363</main-classification>  
        <further-classification edition="202601120260324B">H05K3/34</further-classification>  
        <further-classification edition="200601120260324B">H05K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>境忠彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TADAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉岡祐樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIOKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示之製造方法包含以下步驟：焊料預塗層形成步驟，係於基板之複數個焊盤塗佈焊料糊後將焊料糊加熱熔融，藉此於複數個焊盤上形成各自之表面被塗層覆蓋之複數個焊料預塗層；助焊劑塗佈步驟，係於塗層塗佈助焊劑；電子零件配置步驟，係隔著塗層及助焊劑將複數個電子零件之端子配置於複數個焊料預塗層上；以及，焊接步驟，係使複數個焊料預塗層熔融，藉此將複數個電子零件焊接於複數個焊盤。塗層係由焊料糊之殘渣所構成。焊料糊中之第1松香系樹脂與助焊劑中之第2松香系樹脂相同。焊料糊中之第1溶劑與助焊劑中之第2溶劑相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:焊盤</p>  
        <p type="p">3:焊料預塗層</p>  
        <p type="p">4:塗層</p>  
        <p type="p">5:助焊劑</p>  
        <p type="p">11:電子零件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1328" publication-number="202628501"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628501.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板及半導體封裝</chinese-title>  
        <english-title>CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H05K1/11</main-classification>  
        <further-classification edition="202601120260327B">H05K1/18</further-classification>  
        <further-classification edition="202601120260327B">H10W70/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權奇胎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, KI TAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙顯東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYUN DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種電路板和半導體封裝。關於本電路板包括：第一絕緣層；設置於該第一絕緣層上並包括一第一通孔的第二絕緣層；以及設置於該第二絕緣層上並包括沿垂直於該第一通孔的方向重疊之一第二通孔的第三絕緣層。其中，該第二絕緣層設置於該第一絕緣層上並包括沿垂直於該第二通孔的方向重疊的一第三通孔，並且該第二通孔的內壁沿垂直方向與至少一部分該第一通孔的內壁重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present embodiment relates to a circuit board and a semiconductor package. A circuit board according to one aspect comprises a first insulating layer; a second insulating layer disposed on the first insulating layer and including a first through-hole; and a third insulating layer disposed on the second insulating layer and including a second through-hole overlapped in a direction perpendicular to the first through-hole, wherein the second insulating layer is disposed on the first insulating layer and includes a third through-hole overlapped in a direction perpendicular to the second through-hole, and the inner wall of the second through-hole overlaps at least a portion of the inner wall of the first through-hole in a vertical direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電路板</p>  
        <p type="p">101:第一絕緣層</p>  
        <p type="p">102:第二絕緣層</p>  
        <p type="p">103:第三絕緣層</p>  
        <p type="p">104:第四絕緣層</p>  
        <p type="p">105:第五絕緣層</p>  
        <p type="p">106:第六絕緣層</p>  
        <p type="p">107:第七絕緣層</p>  
        <p type="p">108:第八絕緣層</p>  
        <p type="p">111:第一佈線部</p>  
        <p type="p">112:第二佈線部</p>  
        <p type="p">113:第三佈線部</p>  
        <p type="p">114:第四佈線部</p>  
        <p type="p">115:第五佈線部</p>  
        <p type="p">116:第六佈線部</p>  
        <p type="p">117:第七佈線部</p>  
        <p type="p">118:第八佈線部</p>  
        <p type="p">119:第九佈線部</p>  
        <p type="p">121:第二過孔部</p>  
        <p type="p">122:第三過孔部</p>  
        <p type="p">123:第一過孔部</p>  
        <p type="p">124:第四過孔部</p>  
        <p type="p">125:第五過孔部</p>  
        <p type="p">126:第六過孔部</p>  
        <p type="p">127:第七過孔部</p>  
        <p type="p">128:第八過孔部</p>  
        <p type="p">141:內壁</p>  
        <p type="p">143:內壁</p>  
        <p type="p">150:腔體</p>  
        <p type="p">151:第一通孔</p>  
        <p type="p">152:第二通孔</p>  
        <p type="p">158:連接焊盤</p>  
        <p type="p">190:第一保護層</p>  
        <p type="p">192:孔洞</p>  
        <p type="p">195:第三通孔</p>  
        <p type="p">198:第二保護層</p>  
        <p type="p">199:孔洞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1329" publication-number="202627766"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627766.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>地圖對齊方法、多裝置系統及非暫態電腦可讀取儲存媒體</chinese-title>  
        <english-title>MAP ALIGNMENT METHOD, MULTI-DEVICE SYSTEM AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">G06F3/01</main-classification>  
        <further-classification edition="201701120250901B">G06T7/73</further-classification>  
        <further-classification edition="201701120250901B">G06T7/70</further-classification>  
        <further-classification edition="200601120250901B">G01C21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃群凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供地圖對齊方法、多裝置系統及非暫態電腦可讀取儲存媒體。多裝置系統用以在實體環境中被操作，並包含主機裝置以及客戶裝置，而地圖對齊方法包含：藉由主機裝置與客戶裝置，分別在預設時間點取得主機端關鍵幀及客戶端關鍵幀；藉由主機裝置，依據主機端關鍵幀產生第一客戶端姿態；以及藉由客戶裝置，依據第一客戶端姿態，將客戶裝置偵測實體環境所建立的客戶端地圖與主機裝置偵測實體環境所建立的主機端地圖進行對齊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a map alignment method, a multi-device system and a non-transitory computer readable storage medium. The multi-device system is operable in a physical environment and includes a host device and a client device. The map alignment method includes: obtaining, by the host device and the client device, a host key frame and a client key frame at a preset time point, respectively; generating, by the host device, a first client pose according to the host key frame; and aligning, by the client device, a client map established by the client device detecting the physical environment with a host map established by the host device detecting the physical environment according to the first client pose.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:地圖對齊方法</p>  
        <p type="p">S201~S205:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1330" publication-number="202626713"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626713.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調節β鏈介導免疫的方法及組成物</chinese-title>  
        <english-title>METHODS AND COMPOSITIONS FOR MODULATING BETA CHAIN MEDIATED IMMUNITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商健生生物科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSSEN BIOTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓森　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSEN, MICHAEL RIIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋納桑　萊杰庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANESAN, RAJKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞沃　伊奎博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREWAL, IQBAL S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供靶向Vβ17和DLL3的雙特異性分子、編碼所述分子的核酸和表現載體、含有所述載體的重組細胞以及包含所述分子的組成物。還提供了製備抗體的方法和使用所述抗體殺死癌細胞的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to bispecific molecules targeting Vβ17 and DLL3, nucleic acids and expression vectors encoding said molecules, recombinant cells containing the vectors, and compositions comprising the molecules. Methods of making the antibodies, and methods of using the antibodies to kill cancer cells, are also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1331" publication-number="202628701"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628701.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像感測器及其製造方法</chinese-title>  
        <english-title>IMAGE SENSOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10F39/12</main-classification>  
        <further-classification edition="202601120260302B">H10W10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾尼茨基　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALNITSKY, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威尼斯　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENEZIA, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格蘭特　林賽　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANT, LINDSAY ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">影像感測器的製造方法包括以下步驟。提供半導體基板，半導體基板具有正面表面和與正面表面相對的背面表面。在半導體基板中形成光敏區域。形成鄰近光敏區域的浮置擴散區域，用於從光敏區域接收影像電荷。在半導體基板的正面表面上形成介電層。在介電層中形成閘極電極，閘極電極電耦合至光敏區域和浮置擴散區域。通過蝕刻製程形成鄰近光敏區域的深溝渠隔離結構。深溝渠隔離結構從半導體基板的正面表面上的介電層朝向背面表面延伸。深溝渠隔離結構具有與介電層的頂表面齊平的上表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of an image sensor includes the following steps. A semiconductor substrate having a frontside surface and a backside surface opposite to the frontside surface is provided. A photosensitive region is formed in the semiconductor substrate. A floating diffusion region is formed proximately to the photosensitive region for receiving image charges therefrom. A dielectric layer is formed on the frontside surface of the semiconductor substrate. A gate electrode is formed in the dielectric layer to couple the photosensitive region and the floating diffusion region. A deep trench isolation structure is formed adjacent to the photosensitive region through an etching process. The DTI structure extends from the dielectric layer on the frontside surface toward the backside surface of the semiconductor substrate. The DTI structure has an upper surface leveled with a top surface of the dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:影像感測器</p>  
        <p type="p">111:正面表面</p>  
        <p type="p">112:磊晶層</p>  
        <p type="p">113’:背面表面</p>  
        <p type="p">114:光敏區域</p>  
        <p type="p">122:HTO層</p>  
        <p type="p">152:氧化層</p>  
        <p type="p">154,214,216:高κ介電層</p>  
        <p type="p">160:深溝渠隔離結構</p>  
        <p type="p">162:反射金屬材料</p>  
        <p type="p">164:製程空洞</p>  
        <p type="p">165:背面</p>  
        <p type="p">172:介電材料層</p>  
        <p type="p">174:金屬接觸件</p>  
        <p type="p">182,186:接合層</p>  
        <p type="p">190:邏輯基板</p>  
        <p type="p">212:薄氧化層</p>  
        <p type="p">218:緩衝氧化層</p>  
        <p type="p">222:彩色濾光片</p>  
        <p type="p">224:複合網格</p>  
        <p type="p">230:微透鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1332" publication-number="202626370"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626370.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疊層體</chinese-title>  
        <english-title>LAMINATED BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">B32B27/34</main-classification>  
        <further-classification edition="200601120260317B">C08L79/08</further-classification>  
        <further-classification edition="200601120260317B">B32B37/14</further-classification>  
        <further-classification edition="200601120260317B">C08J5/18</further-classification>  
        <further-classification edition="202601120260317B">H10P14/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安孫子洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABIKO, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤利樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, RIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米浜伸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEHAMA, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種疊層體，在經烷氧基矽烷化合物進行表面改質之基材上具有聚醯亞胺樹脂層，該烷氧基矽烷化合物係選自於由具有琥珀酸酐結構之化合物及具有1級胺基之化合物構成之群組中之至少1者，構成該聚醯亞胺樹脂層之聚醯亞胺樹脂具有下述通式(3)之結構單元，該聚醯亞胺樹脂之玻璃轉移溫度為350℃以上。 &lt;br/&gt;&lt;img align="absmiddle" height="133px" width="203px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laminated body having a polyimide resin layer on a substrate whose surface has been modified with an alkoxysilane compound, &lt;br/&gt;wherein the alkoxysilane compound is at least one selected from the group consisting of a compound having a succinic anhydride structure and a compound having a primary amino group, &lt;br/&gt;the polyimide resin layer constituting the polyimide resin has a structural unit of the general formula (3) below, and &lt;br/&gt;the glass transition temperature of the polyimide resin is 350°C or higher. &lt;br/&gt;&lt;img align="absmiddle" height="189px" width="253px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1333" publication-number="202626776"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626776.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>凹陷構造的形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C08F4/70</main-classification>  
        <further-classification edition="202601120260326B">H10P50/61</further-classification>  
        <further-classification edition="200601120260326B">C01B6/02</further-classification>  
        <further-classification edition="200601120260326B">C23C16/40</further-classification>  
        <further-classification edition="200601120260326B">G03F7/038</further-classification>  
        <further-classification edition="201101120260326B">B82Y40/00</further-classification>  
        <further-classification edition="202001320260326B">G06F115/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木宏太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲富裕一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INATOMI, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土橋和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOBASHI, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] &lt;br/&gt;　　提供一種能夠減少觸媒層所含有的貴金屬擴散至基板的技術。 &lt;br/&gt;[解決手段] &lt;br/&gt;　　本揭示的一態樣的凹陷構造的形成方法，具有：在基板上形成阻障膜；在上述阻障膜上形成含有貴金屬的觸媒層；在上述觸媒層上形成光阻圖案；將上述光阻圖案作為蝕刻遮罩，對上述觸媒層進行蝕刻；及藉由透過金屬輔助蝕刻對被上述觸媒層覆蓋的區域的上述基板進行蝕刻，以在上述基板形成凹陷構造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1334" publication-number="202626237"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626237.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工裝置、半導體生產物之製造方法、及雷射加工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260316B">B23K26/062</main-classification>  
        <further-classification edition="201401120260316B">B23K26/53</further-classification>  
        <further-classification edition="201401120260316B">B23K26/55</further-classification>  
        <further-classification edition="201401120260316B">B23K26/064</further-classification>  
        <further-classification edition="200601120260316B">G02B5/18</further-classification>  
        <further-classification edition="200601120260316B">G02B5/30</further-classification>  
        <further-classification edition="200601120260316B">G02F1/01</further-classification>  
        <further-classification edition="202601120260316B">H10P95/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤晴康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, HARUYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田丈史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈良康永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARA, YASUNAGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本剛志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡崎茂俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAZAKI, SHIGETOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之雷射加工裝置1A包含光產生部3A、集光光學系統5、及控制部6A。光產生部3A產生徑向偏光或角向偏光且具有螺旋相位分佈之雷射光L。集光光學系統5將雷射光L集光至作為單軸性之雙折射晶體之加工對象物11內之集光位置。控制部6A使集光位置在加工對象物11內移動，形成用於切斷加工對象物11之改質區域12。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:假想面</p>  
        <p type="p">16:周緣區域</p>  
        <p type="p">20:晶錠</p>  
        <p type="p">20a:主面</p>  
        <p type="p">20b:側面</p>  
        <p type="p">30:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1335" publication-number="202628927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理裝置、清洗方法、及靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P72/72</main-classification>  
        <further-classification edition="202601120260316B">H10P70/00</further-classification>  
        <further-classification edition="200601120260316B">H02N13/00</further-classification>  
        <further-classification edition="200601120260316B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤恭久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, YASUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種處理裝置，其係具備：腔室、靜電吸盤、第一電源、及控制部。靜電吸盤係被設在腔室內，並載置有基板。第一電源係藉由將為RF(Radio Frequency)電力及DC(Direct Current)脈衝的至少任一者之電訊號供給至腔室內，將腔室內的氣體電漿化。此外，靜電吸盤係具有：靜電吸盤本體、第一電極、及第二電極。第一電極係沿著靜電吸盤本體的外側壁以環狀配置在靜電吸盤本體內。第二電極係沿著載置有基板的靜電吸盤本體的面而被設在靜電吸盤本體內，且周圍被第一電極包圍。控制部係以後述方式構成：在腔室內的清洗中，藉由以將電訊號供給至第一電極的方式來控制第一電源，在腔室內將清洗氣體電漿化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P:電漿</p>  
        <p type="p">W’:基板</p>  
        <p type="p">1110:基台</p>  
        <p type="p">1111:靜電吸盤</p>  
        <p type="p">112:環組件</p>  
        <p type="p">30:電源</p>  
        <p type="p">50:靜電吸盤本體</p>  
        <p type="p">50a:突條</p>  
        <p type="p">50b:上表面</p>  
        <p type="p">50c:外側壁</p>  
        <p type="p">51:空間</p>  
        <p type="p">52:凸部</p>  
        <p type="p">54:切換部</p>  
        <p type="p">55a,55b:電極</p>  
        <p type="p">57a,57b:電源單元</p>  
        <p type="p">60:沈積物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1336" publication-number="202626322"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626322.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130154</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱壓用緩衝材及多層基板的製造方法</chinese-title>  
        <english-title>HOT PRESSING CUSHIONING MATERIAL AND MANUFACTURING METHOD OF MULTILAYER SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B29C43/32</main-classification>  
        <further-classification edition="200601120260318B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商山內股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAUCHI CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾関孝充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZEKI, TAKAMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭人文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於：銷層壓方式的熱壓合中所使用的緩衝材，藉由避免導銷插入時的破損，使其可利用於長期間重複的熱壓合。 &lt;br/&gt;熱壓用緩衝材1係平板形狀，且在將位置對合用的導銷51插入設於壓合對象物的貫通孔而進行熱壓合之銷層壓方式的熱壓合中所使用者。熱壓用緩衝材1係具備：緩衝材本體2，係在外緣2d附近之預定的位置沿厚度方向形成有供導銷51插入的複數個貫通孔2a；及阻蔽構件4，具有與貫通孔2a的側面相接的外側面；並且，還具備固定構件5，固定阻蔽構件4的外側面和貫通孔2a的側面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The objective of the present invention is to make the cushioning material used in pin lamination-type hot pressing of hot pressing that is capable of utilizing for long periods of repeated hot pressing by avoiding damage when inserting guide pin. &lt;br/&gt;A hot pressing cushioning material 1 is flat plate-shaped and used in pin lamination-type hot pressing that is performed by inserting a guide pin 51 for position aligning into a through-hole disposed on workpiece. the hot pressing cushioning material 1 includes a cushioning material body 2 with a plurality of through-holes 2a for inserting the guide pin 51 formed along thickness direction at predetermined positions near an outer edge 2d, a cover member 4 having an outer side surface that contacts the side surface of the through-hole 2a, and includes a fixing member 5 that fixes the outer side surface of the cover member 4 and the side surface of the through-hole 2a.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:緩衝材本體</p>  
        <p type="p">2a:貫通孔</p>  
        <p type="p">2b:緩衝材本體的表面(表面)</p>  
        <p type="p">3b:離型片</p>  
        <p type="p">3c:接合劑，接合構件</p>  
        <p type="p">4:阻蔽構件</p>  
        <p type="p">5:固定構件</p>  
        <p type="p">51:導銷</p>  
        <p type="p">T:厚度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1337" publication-number="202627058"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627058.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物及其使用方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C11D3/20</main-classification>  
        <further-classification edition="200601120260318B">C11D3/30</further-classification>  
        <further-classification edition="200601120260318B">C11D1/66</further-classification>  
        <further-classification edition="200601120260318B">C11D3/39</further-classification>  
        <further-classification edition="200601120260318B">C11D3/28</further-classification>  
        <further-classification edition="200601120260318B">C23G1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商富士軟片電子材料美國股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　燕南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YANNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃亭凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TING-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范涵育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, HANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴　紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIAO, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容係關於一種組成物，其包括至少一種表面粗糙度控制劑；至少一種pH調節劑；至少一種顆粒分散劑；至少一種螯合劑；至少一種腐蝕抑制劑；以及一水溶劑，其中該組成物具有約7至約14之一pH。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to a composition that includes at least one surface roughness controller; at least one pH adjuster; at least one particle dispersion agent; at least one chelating agent; at least one corrosion inhibitor; and an aqueous solvent, in which the composition has a pH of from about 7 to about 14.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200,202,204,206,208:步驟</p>  
        <p type="p">203:工作流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1338" publication-number="202628151"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628151.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蓄電元件及其製造方法、蓄電裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01G9/048</main-classification>  
        <further-classification edition="200601120251201B">H01G9/02</further-classification>  
        <further-classification edition="200601120251201B">H01G9/06</further-classification>  
        <further-classification edition="200601120251201B">H01G9/07</further-classification>  
        <further-classification edition="200601120251201B">H01G9/008</further-classification>  
        <further-classification edition="200601120251201B">H01G9/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横溝仁道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOMIZO, MASAMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成田晃之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARITA, TERUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嶋本匠吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMAMOTO, SYOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可實現用於安裝的設計自由度的提高的蓄電元件及其製造方法與蓄電裝置及其製造方法。一實施方式的蓄電元件包括積層體，所述積層體積層地設有帶狀的第一電極構件與帶狀的第二電極構件，且具有第一區域及與所述第一區域不同的第二區域。積層體具有：第一捲繞部，繞第一捲繞軸捲繞有第一區域；以及第二捲繞部，繞與所述第一捲繞軸不同的第二捲繞軸捲繞有第二區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蓄電元件</p>  
        <p type="p">100:積層體</p>  
        <p type="p">150:元件固定帶</p>  
        <p type="p">210:陽極引線</p>  
        <p type="p">220:陰極引線</p>  
        <p type="p">AX1:第一捲繞軸</p>  
        <p type="p">AX2:第二捲繞軸</p>  
        <p type="p">D1:第一捲繞方向</p>  
        <p type="p">D2:第二捲繞方向</p>  
        <p type="p">WD1:第一捲繞部</p>  
        <p type="p">WD2:第二捲繞部</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1339" publication-number="202628869"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628869.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理液供給單元之調整方法、壓力損失調整單元及基板處理裝置</chinese-title>  
        <english-title>METHOD OF ADJUSTING PROCESSING LIQUID SUPPLY UNIT, PRESSURE LOSS ADJUSTMENT UNIT, AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P72/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相原友明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIHARA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永田博史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田原真二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAHARA, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可簡便地再現就每一基板處理工廠不同之配管之壓力損失的處理液供給單元之調整方法、壓力損失調整單元及基板處理裝置。 &lt;br/&gt;在基板處理裝置1中，基板處理單元100與處理液供給單元200藉由送液配管50連接。於送液配管50介插有壓力損失調整單元300。壓力損失調整單元300包含第1壓力計301、第5調節器302、第2壓力計303、第1控制部304、第1記憶部305、算出部306。第1控制部304根據自第1壓力計301與第2壓力計303獲得之值之差分而算出第5調節器302之前後之送液配管50之壓力損失即第2資訊。第1控制部304以與預設之壓力損失相關之資訊即第1資訊與第2資訊成為相同之方式，控制第5調節器302之開度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">50:送液配管</p>  
        <p type="p">51:返回配管</p>  
        <p type="p">100:基板處理單元</p>  
        <p type="p">200:處理液供給單元</p>  
        <p type="p">201:處理液供給部</p>  
        <p type="p">202:純水補充部</p>  
        <p type="p">202a:配管</p>  
        <p type="p">202b:第1調節器</p>  
        <p type="p">202c:第1開閉閥</p>  
        <p type="p">202d:第1流量計</p>  
        <p type="p">203:藥液補充部</p>  
        <p type="p">203a:配管</p>  
        <p type="p">203b:第2調節器</p>  
        <p type="p">203c:第2開閉閥</p>  
        <p type="p">203d:第2流量計</p>  
        <p type="p">204:槽</p>  
        <p type="p">205:循環部</p>  
        <p type="p">205a:循環配管</p>  
        <p type="p">205b:泵</p>  
        <p type="p">205c:泵</p>  
        <p type="p">205d:溫度計</p>  
        <p type="p">205e:過濾器</p>  
        <p type="p">205f:濃度計</p>  
        <p type="p">205g:第3調節器</p>  
        <p type="p">205h:第3調節器</p>  
        <p type="p">205i:第4開閉閥</p>  
        <p type="p">205j:分支配管</p>  
        <p type="p">206:排出部</p>  
        <p type="p">206a:排液配管</p>  
        <p type="p">206b:第5開閉閥</p>  
        <p type="p">206c:第4調節器</p>  
        <p type="p">207:第2記憶部</p>  
        <p type="p">208:第2控制部</p>  
        <p type="p">300:壓力損失調整單元</p>  
        <p type="p">301:第1壓力計</p>  
        <p type="p">302:第5調節器</p>  
        <p type="p">303:第2壓力計</p>  
        <p type="p">304:第1控制部</p>  
        <p type="p">305:第1記憶部</p>  
        <p type="p">306:算出部</p>  
        <p type="p">400:第3控制部</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1340" publication-number="202628772"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628772.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260317B">H10K59/40</main-classification>  
        <further-classification edition="202501120260317B">H10H29/37</further-classification>  
        <further-classification edition="202501120260317B">H10H29/39</further-classification>  
        <further-classification edition="201601120260317B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商京東方科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商成都京東方光電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京京東方技術開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张跳梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, TIAOMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李若湘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUOXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郑海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板，包括公共電極（163），公共電極（163）在段差處被隔斷，形成導電部（164）和懸空部（165），懸空部（165）可以減小非顯示區（200）的電腐蝕，保證正常的顯示效果。導電部（164）在襯底基板（11）上的正投影、發光控制走線（24）在襯底基板（11）上的正投影和/或有效觸控部（1821）在襯底基板（11）上的正投影在第一區域（2003）交疊，懸空部（165）在襯底基板（11）上的正投影位於第二區域（2004）。觸控走線與背板走線之間的導電部（164）起到遮罩作用，避免觸控走線與背板走線之間的串擾，從而減小或消除對觸控信號的干擾，防止出現觸控式螢幕報點浮動。還提供了一種包括上述顯示面板的顯示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示區</p>  
        <p type="p">11:襯底基板</p>  
        <p type="p">12:緩衝層</p>  
        <p type="p">13:驅動電路層</p>  
        <p type="p">131:主動層</p>  
        <p type="p">1321:第一閘極絕緣層</p>  
        <p type="p">1322:第二閘極絕緣層</p>  
        <p type="p">1331:第一閘極</p>  
        <p type="p">1332:第二閘極</p>  
        <p type="p">134:層間介質層</p>  
        <p type="p">135:第一源極</p>  
        <p type="p">136:汲極/源汲極</p>  
        <p type="p">137:保護層</p>  
        <p type="p">138:第二源極</p>  
        <p type="p">14:平坦化層</p>  
        <p type="p">141:第一平坦化層</p>  
        <p type="p">142:第二平坦化層</p>  
        <p type="p">15:像素界定層</p>  
        <p type="p">151:像素開口</p>  
        <p type="p">152:第一隔斷開口</p>  
        <p type="p">16:發光層</p>  
        <p type="p">161:像素電極</p>  
        <p type="p">162:發光元件</p>  
        <p type="p">1621:共通層</p>  
        <p type="p">1622:發光層組</p>  
        <p type="p">163:公共電極</p>  
        <p type="p">164:導電部</p>  
        <p type="p">165:懸空部</p>  
        <p type="p">1651:第一懸空部</p>  
        <p type="p">1652:第二懸空部</p>  
        <p type="p">1653:第三懸空部</p>  
        <p type="p">1654:第四懸空部</p>  
        <p type="p">1655:第五懸空部</p>  
        <p type="p">17:封裝層</p>  
        <p type="p">171:第一無機封裝層</p>  
        <p type="p">172:有機封裝層</p>  
        <p type="p">173:第二無機封裝層</p>  
        <p type="p">181:第一鈍化層</p>  
        <p type="p">182:第一觸感控制層</p>  
        <p type="p">1821:有效觸控部</p>  
        <p type="p">1822:觸控網格層</p>  
        <p type="p">1823:有效觸控走線</p>  
        <p type="p">1824:虛擬觸控走線</p>  
        <p type="p">183:第二鈍化層</p>  
        <p type="p">184:第二觸感控制層</p>  
        <p type="p">19:覆蓋層</p>  
        <p type="p">20:阻擋壩</p>  
        <p type="p">200:非顯示區</p>  
        <p type="p">2001:第一子非顯示區</p>  
        <p type="p">2002:第二子非顯示區</p>  
        <p type="p">201:第一絕緣層</p>  
        <p type="p">202:第二絕緣層</p>  
        <p type="p">203:第三絕緣層</p>  
        <p type="p">211:第一隔離單元</p>  
        <p type="p">212:第二隔離單元</p>  
        <p type="p">24:發光控制走線</p>  
        <p type="p">241:閘極信號線</p>  
        <p type="p">242:資料信號線</p>  
        <p type="p">25:隔斷層</p>  
        <p type="p">251:防串擾隔斷部</p>  
        <p type="p">252:防腐隔斷部</p>  
        <p type="p">253:第一凹槽</p>  
        <p type="p">254:第二凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1341" publication-number="202628582"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628582.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置和製造半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B41/27</main-classification>  
        <further-classification edition="202301120251103B">H10B41/35</further-classification>  
        <further-classification edition="202301120251103B">H10B43/23</further-classification>  
        <further-classification edition="202301120251103B">H10B43/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔正達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JUNG DAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴寅洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, IN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁娜英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, NA YEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晶植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JUNG SHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括：閘極結構，其包括源極選擇線、汲極選擇線以及堆疊在源極選擇線和汲極選擇線之間的字元線；第二通道層，其穿透源極選擇線並且包括多晶矽；第三通道層，其穿透汲極選擇線並且包括多晶矽；第一通道層，其穿透字元線，連接在第二通道層和第三通道層之間，並且包括二硫化鉬（MoS&lt;sub&gt;2&lt;/sub&gt;）；以及絕緣核心，其設置在第一通道層內部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a gate structure including a source select line, a drain select line, and word lines stacked between the source select line and the drain select line; a second channel layer penetrating through the source select line and including polysilicon; a third channel layer penetrating through the drain select line and including polysilicon; a first channel layer penetrating through the word lines, connected between the second channel layer and the third channel layer, and including molybdenum disulfide (MoS&lt;sub&gt;2&lt;/sub&gt;); and an insulating core disposed inside the first channel layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:源極結構</p>  
        <p type="p">10A:第一源極層</p>  
        <p type="p">10B:第二源極層</p>  
        <p type="p">10C:第三源極層</p>  
        <p type="p">11:導電層</p>  
        <p type="p">12:絕緣層</p>  
        <p type="p">13:記憶體層</p>  
        <p type="p">13A:阻擋層</p>  
        <p type="p">13B:數據儲存層</p>  
        <p type="p">13C:隧穿層</p>  
        <p type="p">14:第一通道層</p>  
        <p type="p">17:絕緣核心</p>  
        <p type="p">18:通道襯墊</p>  
        <p type="p">DSL:汲極選擇線</p>  
        <p type="p">GST:閘極結構</p>  
        <p type="p">SSL:源極選擇線</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1342" publication-number="202628051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260121B">G09G3/3225</main-classification>  
        <further-classification edition="201601120260121B">G09G3/3275</further-classification>  
        <further-classification edition="200601120260121B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含：時序控制器，基於一輸入影像產生影像資料；資料驅動器，基於該影像資料產生資料訊號，並且將該資料訊號輸出至資料線；以及顯示面板，包含連接至該資料線的像素，其中，該時序控制器基於該輸入影像產生第一影像及第二影像，透過調整第一影像的至少一部分區域的灰階來產生第三影像，並且產生與該第二影像及該第三影像中的每一個對應的影像資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a timing controller which generates image data based on an input image, a data driver which generates a data signal based on the image data and outputs the data signal to a data line and a display panel which includes a pixel connected to the data line, wherein the timing controller generates a first image and a second image based on the input image, generates a third image by adjusting a gray scale of at least a partial area of the first image, and generates image data corresponding to the second image and the third image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:時序控制器</p>  
        <p type="p">120:閘極驅動器</p>  
        <p type="p">130:資料驅動器</p>  
        <p type="p">140:顯示面板</p>  
        <p type="p">CS:輸入控制訊號</p>  
        <p type="p">DATA:影像資料</p>  
        <p type="p">DCS:資料控制訊號</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">GCS:閘極控制訊號</p>  
        <p type="p">GL:閘極線</p>  
        <p type="p">PX:像素</p>  
        <p type="p">RGB:輸入影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1343" publication-number="202628570"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628570.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>犧牲金屬訊號或電力線</chinese-title>  
        <english-title>SACRIFICIAL METAL SIGNAL OR POWER LINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260324B">H10B12/00</main-classification>  
        <further-classification edition="202601120260324B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　智君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐鍾汎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JONGBEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪伯恩　菲德里克大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHBURN, FREDRICK DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本技術包括用於形成先進記憶體結構及由此產生的裝置的方法和系統。該等方法包括在一或多個特徵的第一側壁、第二側壁和底表面上方形成虛擬材料層，其中該第一側壁與該第二側壁間隔開，並且該底表面設置於該第一側壁與該第二側壁之間。該等方法包括用犧牲隔離材料填充在該第一側壁上的該虛擬材料與該第二側壁上的低電阻率材料之間形成的間隙。該等方法包括移除該底表面的至少一部分，暴露出該虛擬材料和該犧牲隔離材料的至少一部分。該等方法包括移除公司犧牲隔離材料及該虛擬材料的至少一部分，以及在該虛擬材料的剩餘部分上選擇性地沉積導電材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present technology includes methods and systems for forming advanced memory structures, and devices therefrom. Methods include forming a dummy material layer over a first sidewall, a second sidewall, and a bottom surface, of one or more features, where the first sidewall is spaced apart from the second sidewall and the bottom surface is disposed between the first sidewall and the second sidewall. Methods include filling a gap formed between the dummy material on the first sidewall and the low resistivity material on the second sidewall with a sacrificial isolation material. Methods include removing at least a portion of the bottom surface, exposing at least a portion of the dummy material and the sacrificial isolation material. Methods include removing the sacrificial isolation material and at least a portion of the dummy material and selectively depositing a conductive material on a remaining portion of the dummy material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:結構/基板</p>  
        <p type="p">302:通道/材料</p>  
        <p type="p">306:介電材料/虛擬材料</p>  
        <p type="p">308:虛擬材料/導電材料層</p>  
        <p type="p">312:插座/材料</p>  
        <p type="p">314:最終間隙填充材料</p>  
        <p type="p">316:介電插座</p>  
        <p type="p">332:元件/方框</p>  
        <p type="p">334:次級基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1344" publication-number="202628953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130364</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及半導體製造系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P95/00</main-classification>  
        <further-classification edition="202201120260323B">G06F3/0481</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村貴正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TAKAMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之顯示裝置具備：記憶用於使半導體製造裝置進行相互不同動作之複數個指示鍵的記憶部；依據使用者輸入之文字，從前述記憶部檢索並抽出與前述文字相關之前述指示鍵的檢索部；及以可由使用者選擇之狀態顯示由前述檢索部所抽出之前述指示鍵的顯示部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111(111A,111B):集合顯示</p>  
        <p type="p">131:指示鍵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1345" publication-number="202628721"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628721.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130399</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於引線框架上的發光二極體晶片的晶粒附接結構</chinese-title>  
        <english-title>DIE ATTACH STRUCTURES FOR LIGHT-EMITTING DIODE CHIPS ON LEAD FRAMES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260317B">H10H20/85</main-classification>  
        <further-classification edition="202501120260317B">H10H20/852</further-classification>  
        <further-classification edition="202601120260317B">H10W72/00</further-classification>  
        <further-classification edition="202601120260317B">H10W72/20</further-classification>  
        <further-classification edition="202601120260317B">H10W72/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科銳ＬＥＤ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREELED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴爾基　賽斯　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALKEY, SETH JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯　彼得　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREWS, PETER SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示發光二極體（LED）裝置，且更特定言之，揭示用於LED封裝件中之引線框架上之LED晶片的晶粒附接結構。例示性引線框架結構在LED晶片之晶粒附接區處具備選擇性電鍍金屬層。所述選擇性電鍍金屬層之金屬經定位以與對於LED晶片之晶粒附接所採用之接合材料形成合金及/或介金屬化合物。所得合金及/或介金屬化合物在對於LED裝置中之LED封裝件之後續附接所利用之溫度及高於所述溫度形成不可回焊金屬結構，藉此為LED晶片之晶粒附接提供增加的機械及電完整性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Light-emitting diode （LED） devices and more particularly die attach structures for LED chips on lead frames in LED packages are disclosed. Exemplary lead frame structures are provided with selectively plated metal layers at die attach regions for LED chips. The metal of the selectively plated metal layers is positioned to form alloys and/or intermetallic compounds with bonding materials employed for die attach of LED chips. The resulting alloys and/or intermetallic compounds form non-reflowable metal structures at and above temperatures utilized for subsequent attachment of LED packages in LED devices, thereby providing increased mechanical and electrical integrity of die attach for LED chips.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1B-1B:截面線</p>  
        <p type="p">10:LED封裝件</p>  
        <p type="p">12:引線框架結構</p>  
        <p type="p">14-1:引線</p>  
        <p type="p">14-2:引線</p>  
        <p type="p">16:主體/殼體</p>  
        <p type="p">16&lt;sub&gt;F&lt;/sub&gt;:凹部底面</p>  
        <p type="p">16&lt;sub&gt;R&lt;/sub&gt;:凹部</p>  
        <p type="p">18-1:金屬墊</p>  
        <p type="p">18-2:金屬墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1346" publication-number="202627381"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627381.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐火物的壽命預測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">F27D21/00</main-classification>  
        <further-classification edition="200601120260327B">F27D1/00</further-classification>  
        <further-classification edition="200601120260327B">F27B3/14</further-classification>  
        <further-classification edition="200601120260327B">B22D41/02</further-classification>  
        <further-classification edition="200601120260327B">B22D41/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田奈雄登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本高男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">耐火物的壽命預測方法是在內襯於鋼液容器的表面存在附著物的狀態下與熔融金屬相接的耐火物的壽命預測方法，包括：獲取由感測器測定的表示耐火物的表面狀態的測定資料的步驟（S22）；根據測定資料與表示基準的表面狀態的表面基準資料的差值算出厚度資料的步驟（S23）；對基於過去的厚度資料算出的表示最小厚度的最小厚度資料與厚度資料進行比較，算出表示附著物的厚度的附著厚度資料的步驟（S24）；以及藉由將附著厚度資料輸入至壽命推定模型來預測耐火物的壽命的步驟（S26）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21、S22、S23、S24、S25、S26:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1347" publication-number="202627489"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627489.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有繫留結構的垂直型微機電系統探針及其製造方法</chinese-title>  
        <english-title>VERTICAL MEMS PROBE HAVING TETHERING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G01R1/067</main-classification>  
        <further-classification edition="200601120251001B">C23F1/02</further-classification>  
        <further-classification edition="200601120251001B">B81B7/02</further-classification>  
        <further-classification edition="200601120251001B">B81B3/00</further-classification>  
        <further-classification edition="200601120251001B">B81C3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商宇德曼斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WITHMEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丘璜燮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOO, HWANG SUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉錫奐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, SEOK HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夫鐘郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BU, JONG-UK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相協</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANGHYEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方鎬燮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANG, HO SUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車在祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, JAEWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種具有繫留結構的垂直型微機電系統探針及其製造方法。根據本發明的具有繫留結構的垂直型微機電系統探針，其特征在於，包括：針體，包括與兩端中的至少一個以上接觸之接觸以及通過該兩端之間的彈性復原力對施加到該接觸部的接觸荷重進行支撐的彈性部；外殼，形成有使得該接觸部裸露到外部的貫通部並對該彈性部進行覆蓋；以及繫留體（Tether），在該接觸部與該外殼之間進行連接，或在該彈性部與該外殼之間進行連接；可對該接觸部或該彈性部與該繫留體之間的第一連接部、該外殼與該繫留體之間的第二連接部或該繫留體進行分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1348" publication-number="202628173"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628173.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H01J37/32</main-classification>  
        <further-classification edition="200601120260317B">H05H1/46</further-classification>  
        <further-classification edition="202601120260317B">H10P72/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早坂徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASAKA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">第一加熱器係設置於靜電吸盤內部的與第一區域對應之處。第一溫度感測器係用於測量靜電吸盤內部的與第一區域對應之處的溫度。第二加熱器係設置於靜電吸盤內部的與第二區域對應之處。第二溫度感測器係用於測量靜電吸盤內部的與第二區域對應之處的溫度。控制基板係配置於基台的空間內，並具有測量電路，該測量電路係使用第一溫度感測器及第二溫度感測器來測量溫度。至少一第一遮罩係設置於靜電吸盤內的第一加熱器與基台之間。至少一第二遮罩係設置於靜電吸盤內的支撐面與第一加熱器之間。第一遮罩與第二遮罩係經由含有導體的導電性構件而電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10b:底部(電漿處理裝置)</p>  
        <p type="p">11:基板支撐部</p>  
        <p type="p">111:主體部</p>  
        <p type="p">1110:基台</p>  
        <p type="p">1110a:基台主體</p>  
        <p type="p">1110b:覆蓋構件</p>  
        <p type="p">1110c:流路</p>  
        <p type="p">1111:靜電吸盤</p>  
        <p type="p">1111b:靜電電極</p>  
        <p type="p">1111c:加熱器</p>  
        <p type="p">1111c1:配線</p>  
        <p type="p">1111d:感測器</p>  
        <p type="p">1111d1:配線</p>  
        <p type="p">2:控制部</p>  
        <p type="p">50a:遮罩</p>  
        <p type="p">50b:遮罩</p>  
        <p type="p">51:配線</p>  
        <p type="p">52:配線</p>  
        <p type="p">70:功率供應裝置</p>  
        <p type="p">71:RF去除濾波器</p>  
        <p type="p">72:配線</p>  
        <p type="p">74:配線</p>  
        <p type="p">80:控制基板</p>  
        <p type="p">80a:空間</p>  
        <p type="p">800:元件</p>  
        <p type="p">800a:配線</p>  
        <p type="p">801a:間隔層</p>  
        <p type="p">801b:間隔層</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1349" publication-number="202628912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置用構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P72/70</main-classification>  
        <further-classification edition="200601120260318B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上靖也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久野達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山越晶太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKOSHI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本寛大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, KANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶圓載置台10包含：內置靜電電極22的陶瓷板20；經由接合層40接合於陶瓷板20下表面23，且內置冷媒流路32的基板30；於不干涉冷媒流路32的位置沿上下方向貫通基板30，且於陶瓷板20側具有C0.5以上C倒角開口部34c的基板貫通孔34；插入基板貫通孔34的絕緣管50；插入絕緣管50且前端與靜電電極22電性連接的供電構件70；以及設置於包含C倒角開口部34c的基板貫通孔34的內周面34b與絕緣管50的外周面50b之間的接著層60。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓載置台</p>  
        <p type="p">20:陶瓷板</p>  
        <p type="p">21:晶圓載置面</p>  
        <p type="p">22:靜電電極</p>  
        <p type="p">23:下表面</p>  
        <p type="p">24:陶瓷板有底孔</p>  
        <p type="p">30:基板</p>  
        <p type="p">32:冷媒流路</p>  
        <p type="p">34:基板貫通孔</p>  
        <p type="p">34b:內周面</p>  
        <p type="p">34c:開口部</p>  
        <p type="p">34c1:外緣</p>  
        <p type="p">40:接合層</p>  
        <p type="p">44:接合層貫通孔</p>  
        <p type="p">44a:內周面</p>  
        <p type="p">50:絕緣管</p>  
        <p type="p">50a:上表面</p>  
        <p type="p">50b:外周面</p>  
        <p type="p">50c:內周面</p>  
        <p type="p">54:絕緣管貫通孔</p>  
        <p type="p">60:接著層</p>  
        <p type="p">61:絕緣管上表面接著部</p>  
        <p type="p">62:絕緣管外周面接著部</p>  
        <p type="p">62a:特定接著部</p>  
        <p type="p">63:絕緣管內周面接著部</p>  
        <p type="p">70:供電構件</p>  
        <p type="p">x:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1350" publication-number="202628504"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628504.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130493</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H05K1/14</main-classification>  
        <further-classification edition="200601120250902B">H05K1/11</further-classification>  
        <further-classification edition="200601120250902B">H05K3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐怡華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾名駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, MING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃浩榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAO-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛立維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括電路基板、第一基板、電子元件、驅動單元以及內電連接結構。第一基板與電路基板重疊。電子元件設置在第一基板上。驅動單元設置在第一基板上並與電子元件電連接。內電連接結構設置在電路基板與第一基板之間且包括第一導電端子和第二導電端子，其中第一導電端子和第二導電端子分別電連接第一基板和電路基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a circuit substrate, a first substrate, an electronic element, a drive unit, and an internal electrical connection structure. The first substrate overlaps the circuit substrate. The electronic element is disposed on the first substrate. The drive unit is disposed on the first substrate and electrically connected to the electronic element. The internal electrical connection structure is disposed between the circuit substrate and the first substrate and includes a first conductive terminal and a second conductive terminal, wherein the first conductive terminal and the second conductive terminal are electrically connected to the first substrate and the circuit substrate, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">10:電路基板</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">12:電子元件</p>  
        <p type="p">13:驅動單元</p>  
        <p type="p">14:內電連接結構</p>  
        <p type="p">15:積體電路</p>  
        <p type="p">16:可撓印刷電路板</p>  
        <p type="p">17:載板</p>  
        <p type="p">18:閘極驅動電路</p>  
        <p type="p">19:接點</p>  
        <p type="p">141:第一導電端子</p>  
        <p type="p">142:第二導電端子</p>  
        <p type="p">D1、D2、D3:方向</p>  
        <p type="p">S1:第一表面</p>  
        <p type="p">S2:第二表面</p>  
        <p type="p">I-I’:剖線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1351" publication-number="202628010"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628010.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理裝置、監控系統以及監控方法</chinese-title>  
        <english-title>PROCESSING DEVICE, MONITORING SYSTEM AND MONITORING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250902B">G06V40/20</main-classification>  
        <further-classification edition="200601120250902B">G08B21/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帝濶智慧科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECLOAK INTELLIGENCES CO.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒耀東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, YAO-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種處理裝置、監控系統以及監控方法。監控系統包括影像擷取裝置以及處理裝置。影像擷取裝置擷取原始影像。處理裝置耦接影像擷取裝置。處理裝置用以執行：取得原始影像；辨識原始影像中的多個監視目標的多個目標影像；對原始影像中的多個目標影像執行去識別化處理，以產生去識別化影像；以及對去識別化影像中的多個去識別化物件執行姿態偵測，以產生多個姿態偵測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processing device, a monitoring system and a monitoring method are provided. The monitoring system includes an image capture device and a processing device. The image capture device captures an original image. The processing device is coupled to the image capture device. The processing device is configured to perform: obtaining the original image; identifying a plurality of target images of a plurality of monitoring targets in the original image; performing de-identification processing on the plurality of target images in the original image to generate a plurality of de-identified images; and performing posture detection on a plurality of de-identified objects in the plurality of de-identified images to generate a plurality of posture detection results.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:監控系統</p>  
        <p type="p">110:處理裝置</p>  
        <p type="p">111:處理器</p>  
        <p type="p">112:儲存裝置</p>  
        <p type="p">120:影像擷取裝置</p>  
        <p type="p">130:監控主機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1352" publication-number="202627710"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627710.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>狀態判定裝置、狀態判定方法及狀態判定程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G05B19/18</main-classification>  
        <further-classification edition="200601120260318B">G05B19/401</further-classification>  
        <further-classification edition="201901120260318B">G06N20/20</further-classification>  
        <further-classification edition="201901120260318B">G06N20/00</further-classification>  
        <further-classification edition="202601120260318B">H10P95/90</further-classification>  
        <further-classification edition="202601120260318B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩永修児</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWANAGA, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德山奈緒美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA, NAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供可精度良好地地判定加熱器之異常的技術。 &lt;br/&gt;　　[解決手段] 本揭示之一態樣的狀態判定裝置，係具備有記憶部、取得部、輸出部及判定部。記憶部，係記憶「使用基於載置複數個基板後的加熱器之溫度變化所算出的第1特徵量與加熱器之故障資訊進行了學習」的學習完畢模型。取得部，係取得載置新的基板後之第1特徵量。輸出部，係基於學習完畢模型與藉由取得部所取得的第1特徵量，輸出與加熱器之故障相關的推論資訊。判定部，係基於藉由輸出部所輸出的推論資訊，判定加熱器之異常狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1353" publication-number="202628643"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628643.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">H10D62/10</main-classification>  
        <further-classification edition="202501120251230B">H10D62/80</further-classification>  
        <further-classification edition="202501120251230B">H10D62/40</further-classification>  
        <further-classification edition="202501120251230B">H10D89/10</further-classification>  
        <further-classification edition="200601120251230B">G11C5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祝祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩崎剛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大坊忠臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIBOU, TADAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松克伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, KATSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施方式係關於一種記憶裝置。 實施方式之記憶裝置具備記憶胞，上述記憶胞包括第1導電層與第3導電層之間之開關層、及第3導電層與第2導電層之間之電阻變化層。開關層包含：選自Mg、Y、La、Ce、Zr、Hf、Al、Ti、及Si中之第1元素之第1氧化物；選自Zn、Ga、In、Sn、及Bi中之第2元素；選自P、As、Sb、Bi、S、Se、及Te中之第3元素；及選自由V、Nb、Ta、Cr、B、Ga、及Si所組成之群中之第4元素。開關層包括第1區域、第2區域、及第3區域，第1區域設置於第2區域與第3區域之間。第1區域包含第1氧化物，第2區域及第3區域包含第4元素之第4氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:下部電極(第1導電層)</p>  
        <p type="p">20:上部電極(第2導電層)</p>  
        <p type="p">30:中間電極(第3導電層)</p>  
        <p type="p">40:開關層</p>  
        <p type="p">41:內部區域(第1區域)</p>  
        <p type="p">42a:第1側壁區域(第2區域)</p>  
        <p type="p">42b:第2側壁區域(第3區域)</p>  
        <p type="p">50:電阻變化層</p>  
        <p type="p">51:固定層</p>  
        <p type="p">52:穿隧層</p>  
        <p type="p">53:自由層</p>  
        <p type="p">55:側壁絕緣層(絕緣層)</p>  
        <p type="p">55a:第1部分</p>  
        <p type="p">55b:第2部分</p>  
        <p type="p">MC:記憶胞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1354" publication-number="202627039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130587</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藥液、被處理物之處理方法、半導體器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K13/08</main-classification>  
        <further-classification edition="202601120260401B">H10P50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎広輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋智威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋和敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種藥液，其能夠從具有組成不同之兩種含矽鍺物的被處理物中選擇性地去除鍺濃度較高的含矽鍺物。又，本發明提供一種上述藥液所涉及的被處理物之處理方法及半導體器件之製造方法。本發明之藥液用於具有鍺濃度不同之兩種含矽-鍺物的被處理物，並去除鍺濃度較高的上述含矽-鍺物之至少一部分，其中，所述藥液包含：氟化物離子源；氧化劑；含有雙鍵或三鍵的特定不飽和化合物；以及水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1355" publication-number="202627081"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627081.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經修飾的MTM1基因及其用途</chinese-title>  
        <english-title>MODIFIED MTM1 GENES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N9/16</main-classification>  
        <further-classification edition="200601120260401B">C12N15/86</further-classification>  
        <further-classification edition="200601120260401B">A61K48/00</further-classification>  
        <further-classification edition="200601120260401B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特克　邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEC, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩凡尼斯　埃萬耶洛斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEFANIS, EVANGELOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫拉萊斯　萊昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORALES, LEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡米萊理　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMILLERI, ANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供經修飾核酸，其包含經修飾MTM1基因、經修飾肌肉特異性啟動子(例如&lt;i&gt;MHCK7&lt;/i&gt;)或其組合。本文亦提供表現匣、AAV載體基因體及包含該等AAV載體基因體之AAV顆粒。本文進一步提供將MTM1遞送至肌細胞之方法及治療XLMTM之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are modified nucleic acids comprising modified MTM1 genes, modified muscle-specific promoters, e.g., &lt;i&gt;MHCK7&lt;/i&gt;, or a combination thereof. Also provided herein are expression cassettes, AAV vector genomes, and AAV particles comprising the same. Further provided herein are methods of delivering MTM1 to a muscle cell and methods of treating XLMTM.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1356" publication-number="202629021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有階式堆疊基材結構的電子封裝</chinese-title>  
        <english-title>ELECTRONIC PACKAGE HAVING STEPPED STACKED SUBSTRATE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/685</main-classification>  
        <further-classification edition="202601120260323B">H10W40/22</further-classification>  
        <further-classification edition="202601120260323B">H10W90/20</further-classification>  
        <further-classification edition="202601120260323B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾德雷特　馬努埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALDRETE, MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　安尼基特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ANIKET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　拉傑尼希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, RAJNEESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　皮尤什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, PIYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一態樣中，一種電子裝置包括複數個堆疊基材，各基材包括第一平面表面及與該第一平面表面相對的第二平面表面。相鄰基材經堆疊以使得該等相鄰基材的各上部基材的該第二平面表面延伸至該等相鄰基材的各下部基材的該第一平面表面之外，以便在該等相鄰基材的該上部基材的該第二平面表面處形成平面連接表面。再分布層下伏於該等堆疊基材。導電柱在垂直於該等相鄰基材的各上部基材的該平面連接表面的方向上延伸，以便將各上部基材的該等電子組件電氣連接至該再分布層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an aspect, an electronic device includes a plurality of stacked substrates, each substrate includes a first planar surface and a second planar surface opposite the first planar surface. Adjacent substrates are stacked so that the second planar surface of each upper substrate of the adjacent substrates extends beyond the first planar surface of each lower substrate of the adjacent substrates to form planar connection surfaces at the second planar surface of the upper substrate of the adjacent substrates, A redistribution layer underlies the stacked substrates. Conductive pillars extend in a direction perpendicular to the planar connection surface of each upper substrate of the adjacent substrates to electrically connect the electronic components of each upper substrate to the redistribution layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電子封裝</p>  
        <p type="p">202:記憶體基材</p>  
        <p type="p">204:處理器基材</p>  
        <p type="p">206,208,210:記憶體基材</p>  
        <p type="p">212:第一平面表面</p>  
        <p type="p">214:第二平面表面</p>  
        <p type="p">215:黏著層</p>  
        <p type="p">216:平面連接表面</p>  
        <p type="p">218:再分布層</p>  
        <p type="p">220:導電柱</p>  
        <p type="p">222:終端</p>  
        <p type="p">224:包覆成型材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1357" publication-number="202626609"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626609.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130613</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種鉀通道調節劑、其製備方法、藥物組合物和應用</chinese-title>  
        <english-title>POTASSIUM CHANNEL MODULATOR, PREPARATION METHODS, PHARMACEUTICAL COMPOSITIONS AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D217/22</main-classification>  
        <further-classification edition="200601120260401B">C07D405/04</further-classification>  
        <further-classification edition="200601120260401B">C07D409/04</further-classification>  
        <further-classification edition="200601120260401B">C07D413/04</further-classification>  
        <further-classification edition="200601120260401B">C07D417/04</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4725</further-classification>  
        <further-classification edition="200601120260401B">A61P25/08</further-classification>  
        <further-classification edition="200601120260401B">A61P25/22</further-classification>  
        <further-classification edition="200601120260401B">A61P25/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江西科睿藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGXI KERUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊康敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KANGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴守升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHOUSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邰正福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, ZHENGFU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種鉀通道調節劑、其製備方法、藥物組合物和應用。具體提供了如式V所示的化合物或其藥學上可接受的鹽。本發明的鉀通道調節劑化合物具有如下效果優勢中的一個或多個：（1）結構新穎；（2）具有良好的KCNQ2/3通道開放活性；（3）對KCNQ4、KCNQ5開放活性弱，KCNQ2/3選擇性高；（4）體內藥效好，對癲癇發作具有良好的保護效果；（5）神經運動毒性低；（6）具有高腦血比；（7）具有高血漿、腦組織濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a potassium channel modulator, preparation methods, pharmaceutical compositions and applications thereof. Specifically, the present invention provides compounds represented by formula V or pharmaceutically acceptable salts thereof. The potassium channel modulator compounds of the present invention have one or more of the following advantages: (1) novel structure; (2) good KCNQ2/3 channel opening activity; (3) weak opening activity for KCNQ4 and KCNQ5, and high selectivity for KCNQ2/3; (4) good in vivo efficacy and protective effect against epileptic seizures; (5) low neuromotor toxicity; (6) high brain-blood ratio; (7) high plasma and brain tissue concentrations.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1358" publication-number="202628973"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628973.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/00</main-classification>  
        <further-classification edition="202601120260302B">H10W20/20</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202601120260302B">H10W70/692</further-classification>  
        <further-classification edition="200601120260302B">C09K13/02</further-classification>  
        <further-classification edition="200601120260302B">C09K13/08</further-classification>  
        <further-classification edition="200601120260302B">C03C15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭晨芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHEN-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊舜儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊孟軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, MENG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIH-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置的製造方法，其包括以下步驟。提供基板，其中基板具有彼此相對的第一表面與第二表面。對基板的多個局部區域進行改質。執行第一蝕刻步驟以使多個局部區域中形成多個孔洞。執行第二蝕刻步驟以使多個孔洞形成多個通孔。在沿著基板的法線方向上，多個孔洞中的任一者具有第一深度，多個通孔中的任一者具有第二深度，且第一深度與所述第二深度符合以下關係式(a)。&lt;br/&gt; [關係式(a)]&lt;br/&gt; 0.5*T2≦T1≦T2，其中T1為第一深度，且T2為第二深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of an electronic device including the following steps is provided. Providing a substrate having a first surface and a second surface facing each other. Modifying a plurality of localized regions of the substrate. Performing a first etching step to form a plurality of holes in the plurality of localized regions. Performing a second etching step to form a plurality of through-holes from the plurality of holes. Along a normal direction of the substrate, any one of the plurality of holes has a first depth, and any one of the plurality of through-holes has a second depth, and the first depth and the second depth satisfy the following equation (a).&lt;br/&gt; [Equation (a)]&lt;br/&gt; 0.5*T2 ≤ T1 ≤ T2, where T1 is the first depth, and T2 is the second depth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(1)、(2)、(3)、(4)、(5)、(6)、(7):步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1359" publication-number="202627317"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627317.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺栓軸力推定方法及螺栓軸力推定系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250828B">F16B31/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石塚典男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHITSUKA, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芦田喜章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHIDA, KISHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三木裕介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可高精度地評估螺栓之應變變化之螺栓軸力推定方法及螺栓軸力推定系統。 &lt;br/&gt;本發明之螺栓軸力推定方法係藉由在軸向之中央或較中央靠被緊固體側配置有複數個應變計之螺帽與螺栓緊固被緊固體之緊固構件之螺栓軸力推定方法，其特徵在於包含：計測步驟，其藉由在螺帽外側面之外側面3個部位以120度間隔自前述被緊固體與螺帽接觸面等距離地安裝之前述應變計，計測前述螺帽之應變量；算出步驟，其根據前述應變量而算出應變量平均值；及推定步驟，其根據前述應變量平均值、與預先準備之應變與螺栓軸力之關係而推定螺栓軸力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:螺帽</p>  
        <p type="p">7:A面</p>  
        <p type="p">8:B面</p>  
        <p type="p">9:C面</p>  
        <p type="p">10:D面</p>  
        <p type="p">11:E面</p>  
        <p type="p">12:F面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1360" publication-number="202626942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08L63/00</main-classification>  
        <further-classification edition="200601120260325B">C08G59/20</further-classification>  
        <further-classification edition="200601120260325B">C08G59/42</further-classification>  
        <further-classification edition="201801120260325B">C08K3/013</further-classification>  
        <further-classification edition="200601120260325B">C08K3/22</further-classification>  
        <further-classification edition="200601120260325B">C08K3/36</further-classification>  
        <further-classification edition="200601120260325B">C08K5/07</further-classification>  
        <further-classification edition="200601120260325B">C08K9/06</further-classification>  
        <further-classification edition="200601120260325B">C08J5/18</further-classification>  
        <further-classification edition="200601120260325B">C08J5/24</further-classification>  
        <further-classification edition="200601120260325B">H05K1/03</further-classification>  
        <further-classification edition="202601120260325B">H10W70/695</further-classification>  
        <further-classification edition="202601120260325B">H10W74/40</further-classification>  
        <further-classification edition="202601120260325B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊真俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種有助於硬化物之低介電損耗正切化之樹脂組合物，特別是有助於實現即使在高溫(100℃)環境下亦顯示更低之介電損耗正切之硬化物的樹脂組合物。 &lt;br/&gt;本發明之樹脂組合物含有：(A)四員環以下之環狀醚化合物、(B)硬化劑、(C)無機填充材料及(1D)鋁錯合物，且(A)成分包含(A1)具有陽離子聚合性之四員環以下之環狀醚化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1361" publication-number="202626646"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626646.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>IL-17A抑制劑</chinese-title>  
        <english-title>IL-17A INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/04</main-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">A61K31/53</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商戴斯阿爾法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DICE ALPHA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉貝德　哈桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELABED, HASSANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭特　蓋瑞　愛德華　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDT, GARY EDWARD LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇克倫德　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHYRKLUND, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑟麗　保羅　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATHEREE, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗萊德伯格　麥可　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREIDBERG, MICHAEL DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴利　莫琳　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REILLY, MAUREEN KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供某些式I之二甲基四氫吡喃-咪唑并三嗪化合物作為IL-17A抑制劑、其醫藥組合物及使用式I之化合物治療牛皮癬、類風濕性關節炎、多發性硬化、全身性硬化、牛皮癬性關節炎、軸型脊椎關節炎、關節黏連性脊椎炎、化膿性汗腺炎、全身性紅斑狼瘡、掌蹠膿疱病(PPP)、異位性皮膚炎、氣喘、非感染性眼色素層炎或COPD之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="214px" width="307px" file="ed10190.JPG" alt="ed10190.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides certain dimethyltetrahydropyran-imidazotriazine compounds of formula I as IL-17A inhibitors, pharmaceutical compositions thereof, and methods of using a compound of formula I to treat psoriasis, rheumatoid arthritis, multiple sclerosis, systemic sclerosis, psoriatic arthritis, axial spondyloarthritis, ankylosing spondylitis, hidradenitis suppurativa, systemic lupus erythematosus, palmoplantar pustulosis (PPP), atopic dermatitis, asthma, non-infectious uveitis, or COPD. &lt;br/&gt;&lt;img align="absmiddle" height="201px" width="314px" file="ed10191.JPG" alt="ed10191.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1362" publication-number="202626057"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626057.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>IL-17A抑制劑</chinese-title>  
        <english-title>IL-17A INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K31/55</main-classification>  
        <further-classification edition="200601120260324B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260324B">A61K31/4188</further-classification>  
        <further-classification edition="200601120260324B">A61K31/4155</further-classification>  
        <further-classification edition="200601120260324B">A61K31/351</further-classification>  
        <further-classification edition="200601120260324B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商戴斯阿爾法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DICE ALPHA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉貝德　哈桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELABED, HASSANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭特　蓋瑞　愛德華　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDT, GARY EDWARD LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇克倫德　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHYRKLUND, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑟麗　保羅　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATHEREE, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗萊德伯格　麥可　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREIDBERG, MICHAEL DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴利　莫琳　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REILLY, MAUREEN KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供某些式I之二氟四氫吡喃-咪唑并三嗪化合物作為IL-17A抑制劑、其醫藥組合物及使用式I之化合物治療牛皮癬、類風濕性關節炎、多發性硬化、全身性硬化、牛皮癬性關節炎、軸型脊椎關節炎、關節黏連性脊椎炎、化膿性汗腺炎、全身性紅斑狼瘡、掌蹠膿疱病(PPP)、異位性皮膚炎、氣喘、非感染性眼色素層炎或COPD之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="200px" width="311px" file="ed10179.JPG" alt="ed10179.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides certain difluorotetrahydropyran-imidazotriazine compounds of formula I as IL-17A inhibitors, pharmaceutical compositions thereof, and methods of using a compound of formula I to treat psoriasis, rheumatoid arthritis, multiple sclerosis, systemic sclerosis, psoriatic arthritis, axial spondyloarthritis, ankylosing spondylitis, hidradenitis suppurativa, systemic lupus erythematosus, palmoplantar pustulosis (PPP), atopic dermatitis, asthma, non-infectious uveitis, or COPD. &lt;br/&gt;&lt;img align="absmiddle" height="192px" width="336px" file="ed10180.JPG" alt="ed10180.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1363" publication-number="202626647"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626647.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130652</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>IL-17A抑制劑</chinese-title>  
        <english-title>IL-17A INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/04</main-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">A61K31/53</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5383</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商戴斯阿爾法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DICE ALPHA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉貝德　哈桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELABED, HASSANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭特　蓋瑞　愛德華　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDT, GARY EDWARD LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇克倫德　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHYRKLUND, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑟麗　保羅　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATHEREE, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗萊德伯格　麥可　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREIDBERG, MICHAEL DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴利　莫琳　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REILLY, MAUREEN KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供某些式I或II之四氫吡喃-咪唑并三嗪化合物作為IL-17A抑制劑、其醫藥組合物及使用式I或II之化合物治療牛皮癬、類風濕性關節炎、多發性硬化、全身性硬化、牛皮癬性關節炎、軸型脊椎關節炎、關節黏連性脊椎炎、化膿性汗腺炎、全身性紅斑狼瘡、掌蹠膿疱病(PPP)、異位性皮膚炎、氣喘、非感染性眼色素層炎或COPD之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="222px" width="290px" file="ed10606.JPG" alt="ed10606.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides certain tetrahydropyran-imidazotriazine compounds of formula I or II as IL-17A inhibitors, pharmaceutical compositions thereof, and methods of using a compound of formula I or II to treat psoriasis, rheumatoid arthritis, multiple sclerosis, systemic sclerosis, psoriatic arthritis, axial spondyloarthritis, ankylosing spondylitis, hidradenitis suppurativa, systemic lupus erythematosus, palmoplantar pustulosis (PPP), atopic dermatitis, asthma, non-infectious uveitis, or COPD. &lt;br/&gt;&lt;img align="absmiddle" height="231px" width="290px" file="ed10607.JPG" alt="ed10607.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1364" publication-number="202626053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>IL-17A抑制劑</chinese-title>  
        <english-title>IL-17A INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K31/537</main-classification>  
        <further-classification edition="200601120260324B">A61K31/53</further-classification>  
        <further-classification edition="200601120260324B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260324B">A61K31/4188</further-classification>  
        <further-classification edition="200601120260324B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商戴斯阿爾法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DICE ALPHA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉貝德　哈桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELABED, HASSANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭特　蓋瑞　愛德華　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDT, GARY EDWARD LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇克倫德　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHYRKLUND, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑟麗　保羅　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATHEREE, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗萊德伯格　麥可　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREIDBERG, MICHAEL DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴利　莫琳　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REILLY, MAUREEN KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供某些式I之咪唑并三嗪化合物作為IL-17A抑制劑、其醫藥組合物及使用式I或II之化合物治療牛皮癬、類風濕性關節炎、多發性硬化、全身性硬化、牛皮癬性關節炎、軸型脊椎關節炎、關節黏連性脊椎炎、化膿性汗腺炎、全身性紅斑狼瘡、掌蹠膿疱病(PPP)、異位性皮膚炎、氣喘、非感染性眼色素層炎或COPD之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="218px" width="295px" file="ed10465.JPG" alt="ed10465.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides certain imidazotriazine compounds of formula I as IL-17A inhibitors, pharmaceutical compositions thereof, and methods of using a compound of formula I or II to treat psori asis, rheumatoid arthritis, multiple sclerosis, systemic sclerosis, psoriatic arthritis, axial spondyloarthritis, ankylosing spondylitis, hidradenitis suppurativa, systemic lupus erythematosus, palmoplantar pustulosis (PPP), atopic dermatitis, asthma, non-infectious uveitis, or COPD. &lt;br/&gt;&lt;img align="absmiddle" height="207px" width="300px" file="ed10466.JPG" alt="ed10466.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1365" publication-number="202626648"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626648.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130654</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>IL-17A抑制劑</chinese-title>  
        <english-title>IL-17A INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/53</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商戴斯阿爾法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DICE ALPHA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉貝德　哈桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELABED, HASSANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭特　蓋瑞　愛德華　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDT, GARY EDWARD LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇克倫德　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHYRKLUND, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法瑟麗　保羅　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATHEREE, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗萊德伯格　麥可　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREIDBERG, MICHAEL DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴利　莫琳　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REILLY, MAUREEN KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供某些式I之四氫吡喃-咪唑并三嗪化合物作為IL-17A抑制劑、其醫藥組合物及使用式I之化合物治療牛皮癬、類風濕性關節炎、多發性硬化、全身性硬化、牛皮癬性關節炎、軸型脊椎關節炎、關節黏連性脊椎炎、化膿性汗腺炎、全身性紅斑狼瘡、掌蹠膿疱病(PPP)、異位性皮膚炎、氣喘、非感染性眼色素層炎或COPD之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="257px" width="404px" file="ed10182.JPG" alt="ed10182.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides certain tetrahydropyran-imidazotriazine compounds of formula I as IL-17A inhibitors, pharmaceutical compositions thereof, and methods of using a compound of formula I to treat psoriasis, rheumatoid arthritis, multiple sclerosis, systemic sclerosis, psoriatic arthritis, axial spondyloarthritis, ankylosing spondylitis, hidradenitis suppurativa, systemic lupus erythematosus, palmoplantar pustulosis (PPP), atopic dermatitis, asthma, non-infectious uveitis, or COPD. &lt;br/&gt;&lt;img align="absmiddle" height="247px" width="414px" file="ed10183.JPG" alt="ed10183.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1366" publication-number="202628488"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628488.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液滴穩定性增強</chinese-title>  
        <english-title>DROPLET STABILITY ENHANCEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H05G2/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>提卡切　恩頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TKACHEV, ANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉翀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威克　雅倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WELK, ARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液滴產生器可形成一穩定液滴鏈。液滴產生器可使用一噴嘴、一多級撇渣器及/或氣體分配環來增強液滴鏈之穩定性。該噴嘴可包含可控制一靶材流形成一射流且隨後聚結成液滴之一噴嘴孔口及過濾器。撇渣器可包含沿液滴鏈之路徑軸向配置以撇去一環境氣體流之孔隙及/或毛細管。氣體分配環可包含用於均勻氣體分配之一組孔，以改良一中間室內之環境氣體流。該液滴產生器亦可包含氣體、電、壓力感測器及/或溫度感測器介面。液滴產生器亦可包含夾箝以連接中間室與噴嘴及撇渣器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A droplet generator may form a stable chain of droplets. The droplet generator may enhance the stability of the chain of droplets using a nozzle, a multi-stage skimmer, and/or gas-distribution ring. The nozzle may include a nozzle orifice and filter which may control a target-material flow forming a jet and subsequently coalescing into droplets. The skimmer may include apertures and/or capillaries which are arranged axially along the path of the chain of droplets to skim off a flow of ambient gas. The gas-distribution ring may include a set of holes for even gas distribution, improving the flow of ambient gas within an intermediate chamber. The droplet generator may also include gas, electrical, pressure-sensor, and/or temperature-sensor interfaces. The droplet generator may also include clamps to connect the intermediate chamber with the nozzle and skimmer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:液滴產生器</p>  
        <p type="p">102:中間室</p>  
        <p type="p">104:支撐環</p>  
        <p type="p">106:噴嘴</p>  
        <p type="p">110:腔室至環夾箝</p>  
        <p type="p">112:腔室至撇渣器夾箝</p>  
        <p type="p">114:噴嘴入口</p>  
        <p type="p">120:傳輸線</p>  
        <p type="p">122:電介面</p>  
        <p type="p">128:氣體介面</p>  
        <p type="p">134:壓力感測器介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1367" publication-number="202626479"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626479.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送車</chinese-title>  
        <english-title>TRANSPORT VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B66F9/12</main-classification>  
        <further-classification edition="200601120260323B">B66F9/20</further-classification>  
        <further-classification edition="200601120260323B">B62D7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉永和治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINAGA, KAZUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村和誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種搬送車，具備用以支撐托板P的叉件15、升降裝置、行走驅動裝置13、第1車輪11及用以支撐一對第2車輪12的車體30，將基於支撐在設定於叉件15的基準位置的托板P中之從車體迴旋軸心C2起算最遠的端部和車體迴旋軸心C2的距離而決定的半徑為基準半徑R1，車體30是形成為收納於在上下方向視角下從車體迴旋軸心C2起算基準半徑R1以內的區域E1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第1車輪</p>  
        <p type="p">12:第2車輪</p>  
        <p type="p">13:行走驅動裝置</p>  
        <p type="p">14:車輪驅動源</p>  
        <p type="p">15:叉件</p>  
        <p type="p">15a:前端部</p>  
        <p type="p">15b:基端面</p>  
        <p type="p">18:導引軌道</p>  
        <p type="p">22b:第2被導引構件</p>  
        <p type="p">30:車體</p>  
        <p type="p">30a:最前表面</p>  
        <p type="p">31:本體部</p>  
        <p type="p">32:腳部</p>  
        <p type="p">32a:兩外側端部</p>  
        <p type="p">33:迴旋支撐部</p>  
        <p type="p">33a:迴旋部</p>  
        <p type="p">33b:固定部</p>  
        <p type="p">34:軌道支撐部</p>  
        <p type="p">35:保險桿</p>  
        <p type="p">37:迴旋位置感測器</p>  
        <p type="p">38:被檢出部</p>  
        <p type="p">39:翻倒防止用支撐構件</p>  
        <p type="p">100:搬送車</p>  
        <p type="p">A1:第1旋轉軸心</p>  
        <p type="p">A2:第2旋轉軸心</p>  
        <p type="p">C1:第1迴旋軸心</p>  
        <p type="p">C2:車體迴旋軸心</p>  
        <p type="p">E1:區域</p>  
        <p type="p">K1:距離</p>  
        <p type="p">K2:距離</p>  
        <p type="p">K6:距離</p>  
        <p type="p">K7:分開距離</p>  
        <p type="p">K8:分開距離</p>  
        <p type="p">K9:距離</p>  
        <p type="p">P:托板</p>  
        <p type="p">R1:基準半徑</p>  
        <p type="p">T1:迴旋軌跡</p>  
        <p type="p">T1a:迴旋軌跡中之前側的端部</p>  
        <p type="p">X:前後方向</p>  
        <p type="p">X1:前側</p>  
        <p type="p">X2:後側</p>  
        <p type="p">Y:寬度方向</p>  
        <p type="p">Y1:寬度方向第1側</p>  
        <p type="p">Y2:寬度方向第2側</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">Z1:上側</p>  
        <p type="p">Z2:下側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1368" publication-number="202626086"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626086.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療癌症之方法、治療劑及用途</chinese-title>  
        <english-title>METHODS, THERAPIES AND USES FOR TREATING CANCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴迪布希　娜塔莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARDY BOUXIN, NATHALIE ANNIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝瑞　艾路莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARRY, ELOISA VIRGINIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克海斯欽　強恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAKE-HASKINS, JOHN ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　永年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, GEOFFREY WING-LYNN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃梅利吉　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELMELIEGY, MOHAMED A</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫魯巴　海克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRUPKA, HEIKE IRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　鎧信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, KAI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范德利　艾里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANDENDRIES, ERIK RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維克瑞亞　安德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIQUEIRA, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威塞爾　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISSEL, PAUL STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊佛　安妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YVER, ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露單一劑及組合療法及用於治療癌症及/或癌症相關疾病之用途。該單一劑及組合療法包括BCMA抗體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure describes single agent and combination therapies and uses for the treatment of cancer and/or cancer-associated diseases. The single agent and combinations therapies include a BCMA antibody.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1369" publication-number="202627708"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627708.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130748</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有感測器之可程式化陣列的工具儲存系統</chinese-title>  
        <english-title>TOOL STORAGE SYSTEM WITH PROGRAMMABLE ARRAY OF SENSORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G05B19/045</main-classification>  
        <further-classification edition="200601120260325B">G05B19/048</further-classification>  
        <further-classification edition="200601120260325B">B25H3/06</further-classification>  
        <further-classification edition="200601120260325B">B25F1/02</further-classification>  
        <further-classification edition="200601120260325B">B23Q3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商實耐寶工具新加坡私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNAP-ON TOOLS SINGAPORE PTE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　文權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, MUN KUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之一第一態樣，提供一種工具儲存系統，其包括：具有一感測器陣列之一板，各感測器可配置以保留用於工具儲存或空位；一解碼器，其用於監視該感測器陣列之使用；一遠端終端機，其用於處理由該解碼器接收之訊號，該遠端終端機經配置以：自在該板之初始化期間接收之這些訊號得知保留感測器及空位感測器的一位置；接收提供儲存於這些保留感測器上之該工具之細節的輸入；自該板被使用時之這些訊號偵測工具自這些保留感測器之移除及工具至這些保留感測器之返回；以及在該解碼器轉送這些保留感測器中之至少一者在該工具返回期間被不正確地觸發時，判定是否傳輸一錯誤工具被返回的一訊息；以及一資料儲存器，其用於保存由這些保留感測器儲存的該工具之細節、這些保留感測器之該位置及這些空位感測器之該位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to a first aspect of the present invention, there is provided a tool storage system including a board with an array of sensors, each configurable to be reserved for tool storage or vacant; a decoder to monitor usage of the array of sensors; a remote terminal to process signals received by the decoder, the remote terminal configured to: learn a location of the reserved sensors and the vacant sensors from the signals received during initialisation of the board; receive input providing details of the tool stored on the reserved sensors; detect, from the signals when the board is used, for removal of tools from and return of tools to the reserved sensors; and determine whether to transmit a message that a wrong tool is returned when the decoder relays that at least one of the reserved sensors is triggered incorrectly during the tool return; and a data storage to save details of the tool stored by the reserved sensors, the location of the reserved sensors, and the location of the vacant sensors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:板/經訓練之板</p>  
        <p type="p">104:感測器</p>  
        <p type="p">106:解碼器</p>  
        <p type="p">108:遠端終端機/計算終端機</p>  
        <p type="p">110:保留感測器</p>  
        <p type="p">112:空位感測器</p>  
        <p type="p">114:感測器</p>  
        <p type="p">116:工具</p>  
        <p type="p">120:資料儲存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1370" publication-number="202628092"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628092.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、操作記憶體裝置的方法、以及記憶體系統</chinese-title>  
        <english-title>MEMORY DEVICE, METHOD OF OPERATING MEMORY DEVICE, AND MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">G11C8/04</main-classification>  
        <further-classification edition="200601120251008B">G11C8/10</further-classification>  
        <further-classification edition="200601120251008B">G11C8/16</further-classification>  
        <further-classification edition="200601120251008B">G11C8/18</further-classification>  
        <further-classification edition="200601120251008B">G11C8/20</further-classification>  
        <further-classification edition="200601120251008B">G11C7/24</further-classification>  
        <further-classification edition="202301120251008B">H10B10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙誠慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SUNGHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李恩愛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, EUNAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李起準</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MYUNGKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高藝俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YEJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成珍宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEONG, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫敎民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOHN, KYOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種記憶體裝置、操作記憶體裝置的方法、以及記憶體系統。所述記憶體裝置包括：記憶體儲存體，包括記憶體胞元陣列，所述記憶體胞元陣列包括設置於所述記憶體胞元陣列中的多個記憶體胞元列，且記憶體儲存體各自包括連接至所述多個記憶體胞元列的列解碼器；列錘擊管理電路，被配置成產生列錘擊位址；再新控制器，被配置成基於列錘擊位址向列解碼器提供用於正常再新操作的正常再新位址及用於列錘擊再新操作的列錘擊再新位址中的一者作為再新位址；控制邏輯電路，被配置成對列解碼器、列錘擊管理電路及再新控制器進行控制，其中所述多個記憶體胞元列中的每一者包括被配置成對與存取次數對應的計數資料進行儲存的計數胞元，其中計數資料包括N個位元的低位資料及M個位元的第一高位資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device, method of operating a memory device and memory system are provided. The memory device includes memory banks including a memory cell array including a plurality of memory cell rows disposed therein, and each including a row decoder connected to the plurality of memory cell rows; a row hammer management circuit configured to generate a row hammer address; a refresh controller configured to provide one of a normal refresh address for a normal refresh operation, and a row hammer refresh address for a row hammer refresh operation based on the row hammer address to the row decoder as a refresh address; a control logic circuit configured to control the row decoder, the row hammer management circuit, and the refresh controller, wherein each of the plurality of memory cell rows includes count cells configured to store count data corresponding to the number of accesses, wherein the count data includes N bits of lower data and M bits of first upper data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:計數資料</p>  
        <p type="p">510:低位資料</p>  
        <p type="p">520:高位資料</p>  
        <p type="p">監測CNT:監測計數值</p>  
        <p type="p">PRAC CNT:PRAC計數值</p>  
        <p type="p">隨機CNT:隨機計數值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1371" publication-number="202627478"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627478.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多重雷射脈衝重複率激發之基於原子力顯微鏡的紅外線光譜學</chinese-title>  
        <english-title>ATOMIC FORCE MICROSCOPE BASED INFRARED SPECTROSCOPY WITH MULTIPLE LASER PULSE REPETITION RATE EXCITATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260325B">G01Q60/32</main-classification>  
        <further-classification edition="201001120260325B">G01Q30/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商布魯克奈米公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUKER NANO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋格納　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAGNER, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德沃夫　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE WOLF, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達季　亞麗山得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAZZI, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　春增</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUNZENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用原子力顯微鏡(AFM)來表徵樣品之次微米區域之設備，包含該AFM之探針，其具有與樣品相互作用之尖端。光源，被提供以用以使用在至少二脈衝重複率下的光脈衝照射尖端-樣品區域，以誘導對應的樣品改變。檢測器，量測至少由於所誘導之該樣品改變的對應的探針偏轉，並產生對應至該光誘導探針偏轉變化的訊號。該AFM包含至少一控制器，該控制器從所量測之該探針偏轉中，提取對該光脈衝的至少二樣品響應。並且，該系統根據該至少二樣品響應，推導出實質上獨立於阻尼的光誘導表面脈衝力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for characterizing sub-micron regions of a sample with an atomic force microscope (AFM) includes a probe of the AFM having a tip that interacts with a sample. A light source is provided to illuminate a tip-sample region with light pulses at least two pulse repetition rates to induce corresponding sample modifications. A detector measures corresponding probe deflection due to the induced sample modifications and generates signals corresponding to the light induced probe deflection changes. The AFM includes at least one controller, the controller extracting at least two sample responses to the light pulses from the measured probe deflection. And from the at least two sample responses, the system deduces a light induced surface pulse force that is substantially independent of damping.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:實驗設置</p>  
        <p type="p">201:探針</p>  
        <p type="p">202:懸臂</p>  
        <p type="p">203:尖端</p>  
        <p type="p">204:樣品</p>  
        <p type="p">206:平台</p>  
        <p type="p">208:壓電器</p>  
        <p type="p">210:二極體雷射</p>  
        <p type="p">212:位置感測器</p>  
        <p type="p">214:控制器</p>  
        <p type="p">216:光源</p>  
        <p type="p">218:雷射脈衝</p>  
        <p type="p">220:聚焦元件</p>  
        <p type="p">222:光束</p>  
        <p type="p">224:空間掃描</p>  
        <p type="p">226:波長相依奈米級局部光譜</p>  
        <p type="p">230:驅動器</p>  
        <p type="p">232:光學控制器</p>  
        <p type="p">234:任意波形產生器</p>  
        <p type="p">236:混頻器</p>  
        <p type="p">238:工作站</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1372" publication-number="202627040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藥液、被處理物之處理方法、半導體器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K13/08</main-classification>  
        <further-classification edition="202601120260401B">H10P50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎広輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋智威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋和敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種藥液、被處理物之處理方法、及半導體器件之製造方法，該藥液能夠抑制從具有鍺濃度不同之兩種含矽-鍺物及含有氧原子而不含鍺原子之含矽物的被處理物中去除含有氧原子而不含鍺原子之含矽物，並能夠從該被處理物中選擇性地去除鍺濃度較高的含矽鍺物。本發明之藥液含有氟化物離子源、氧化劑、溶媒、及特定不飽和化合物，並滿足以下條件1及條件2中之至少一者。（條件1）：上述特定不飽和化合物為含有雙鍵且不具有醯胺基的化合物；上述藥液進一步含有選自矽烷化合物、醯胺化合物、及含氮聚合物中的特定化合物。（條件2）：上述特定不飽和化合物為含有三鍵的化合物；上述藥液進一步含有含氮聚合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1373" publication-number="202629015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W70/63</main-classification>  
        <further-classification edition="202601120260302B">H10W70/652</further-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾嘉平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIA-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宏文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUNG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置及其製造方法。電子裝置的製造方法包括：提供基板，其中基板具有第一表面以及相對第一表面的第二表面；形成通孔貫穿基板，其中通孔的側壁連接第一表面與第二表面；形成第一保護層在第一表面、第二表面以及側壁上；形成導電層在第一保護層上並使得導電層的一部分設置在通孔中；進行薄化步驟，以移除導電層的另一部分；以及對基板進行檢測以獲得基板的一厚度變異值，其中厚度變異值為小於或等於20微米。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes: providing a substrate having a first surface and a second surface opposite to the first surface; forming a through hole penetrating the substrate, a side wall of the through hole connected with the first surface and the second surface; forming a first protective layer on the first surface, the second surface and the side wall; forming a conductive layer on the first protective layer and making a portion of the conductive layer disposed in the through hole; performing a thinning step to remove another portion of the conductive layer; and performing an inspection of the substrate to obtain a thickness variation value of the substrate, the thickness variation value being less than or equal to 20 micrometers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S200,S300,S310,S400,S500,S510,S600:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1374" publication-number="202628644"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628644.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括背側佈線層的積體電路</chinese-title>  
        <english-title>INTEGRATED CIRCUIT INCLUDING BACK-SIDE WIRE LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10D62/10</main-classification>  
        <further-classification edition="202501120260302B">H10D64/20</further-classification>  
        <further-classification edition="202501120260302B">H10D30/60</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10P54/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/20</further-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴志䛵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JISOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正韓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNGHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴判濟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, PANJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柄成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNGSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千寬永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, KWANYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容提供了一種積體電路，該積體電路使得電力能夠在一胞元邊界中穩定流動，並且包括能夠減小裝置之間的耦合干擾之一背側佈線層，該積體電路包括：一背側佈線層，其包括背側金屬線，各條背側金屬線在一第一方向上延伸且在垂直於該第一方向之一第二方向上彼此間隔開；一場效電晶體(FET)，其安置在該背側佈線層上方；以及一前側佈線層，其安置在該FET上方，並且包括在該第一方向上延伸且在該第二方向上彼此間隔開之前側金屬線，一數目n條前側金屬線在該第二方向上以一第一間距配置在一胞元中，並且一數目m條背側金屬線在該第二方向上以一第二間距配置在該胞元中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit, enables power to flow stably in a cell boundary and includes a back-side wire layer capable of reducing coupling interference between devices, includes a back-side wire layer including back-side metal lines each extending in a first direction and spaced apart from each other in a second direction perpendicular to the first direction, a field effect transistor (FET) disposed above the back-side wire layer, and a front-side wire layer disposed above the FET and including front-side metal lines that extend in the first direction and are spaced apart from each other in the second direction, an n-number of front-side metal lines are arranged in a cell in the second direction at a first pitch, and an m-number of back-side metal lines are arranged in the cell in the second direction at a second pitch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路</p>  
        <p type="p">110:背側佈線層</p>  
        <p type="p">110P-1:第一背側電源線</p>  
        <p type="p">110P-2:第二背側電源線</p>  
        <p type="p">110S:背側信號線</p>  
        <p type="p">120:前側佈線層</p>  
        <p type="p">120P-1:第一前側電源線</p>  
        <p type="p">120P-2:第二前側電源線</p>  
        <p type="p">120S:前側信號線</p>  
        <p type="p">140:閘極線</p>  
        <p type="p">140D:虛設閘極線</p>  
        <p type="p">150:背側接點</p>  
        <p type="p">152:金屬板通孔</p>  
        <p type="p">155:背側通孔</p>  
        <p type="p">160:接點</p>  
        <p type="p">165:通孔</p>  
        <p type="p">ACT:主動區</p>  
        <p type="p">ACT1:第一主動區</p>  
        <p type="p">ACT2:第二主動區</p>  
        <p type="p">B-S:背側</p>  
        <p type="p">CB:胞元邊界</p>  
        <p type="p">CH:胞元高度</p>  
        <p type="p">CPP:接觸多晶矽間距</p>  
        <p type="p">FET1:第一FET</p>  
        <p type="p">FET2:第二FET</p>  
        <p type="p">F-S:前側</p>  
        <p type="p">PTC:電源分接頭胞元</p>  
        <p type="p">VDD:第一電力</p>  
        <p type="p">VSS:第二電力</p>  
        <p type="p">I-I':線</p>  
        <p type="p">x,y,z:方向</p>  
        <p type="p">m,n:整數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1375" publication-number="202627247"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627247.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在基板邊緣區域控制膜缺陷之腔室與方法</chinese-title>  
        <english-title>CHAMBER AND METHOD FOR CONTROLLING FILM DEFECTS AT AN EDGE AREA OF A SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C30B25/10</main-classification>  
        <further-classification edition="200601120260319B">C30B25/12</further-classification>  
        <further-classification edition="200601120260319B">C30B25/14</further-classification>  
        <further-classification edition="202601120260319B">H10P14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝　瑞英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, RUIYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾薩蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER SATYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北島知彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAJIMA, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>督比　阿布希雪克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUBE, ABHISHEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢　者澎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONG, ZHEPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基申海特爾　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRSCHENHEITER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　作明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZUOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫拉迪安　雅拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORADIAN, ALA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪登納朵賈奇亞　馬里貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALDONADO-GARCIA, MARIBEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德萊昂桑切斯　艾瑞卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE LEON SANCHEZ, ERICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JENN-YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處揭露一種處理腔室。在一個實施例中，該處理腔室包括基板支撐組件，該基板支撐組件包括：基座，經配置以支撐基板，該基板位於處理腔室內的處理區域中；沉積氣體通道，經配置為在基板的上表面上流動沉積氣體；輔助氣體通道，經配置為將輔助氣體流向基板的邊緣區域；以及分隔器，在沉積氣體通道與輔助氣體通道之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a processing chamber. In one embodiment, the processing chamber includes a substrate support assembly comprising a susceptor configured to support a substrate within a processing region within the processing chamber, a deposition gas channel configured to flow a deposition gas across an upper surface of the substrate, an auxiliary gas channel configured to flow an auxiliary gas toward an edge area of the substrate, and a separator disposed between the deposition gas channel and the auxiliary gas channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:基座</p>  
        <p type="p">206:邊緣環</p>  
        <p type="p">216:排氣口</p>  
        <p type="p">250:基板</p>  
        <p type="p">266:側主體</p>  
        <p type="p">304:邊緣區域</p>  
        <p type="p">308:主表面區域</p>  
        <p type="p">400:輔助氣流系統</p>  
        <p type="p">402:側氣體通道</p>  
        <p type="p">404:沉積氣體通道</p>  
        <p type="p">406:分隔器</p>  
        <p type="p">408:沉積氣體/輔助氣體</p>  
        <p type="p">410:稀釋氣體</p>  
        <p type="p">412:分隔器</p>  
        <p type="p">414:側氣體通道</p>  
        <p type="p">424:底座</p>  
        <p type="p">426:底部部分</p>  
        <p type="p">428:邊緣牆</p>  
        <p type="p">430:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1376" publication-number="202626061"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626061.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低以EGFR/MET雙特異性抗體治療之患者之皮膚不良事件之方法</chinese-title>  
        <english-title>METHODS FOR REDUCING DERMATOLOGIC ADVERSE EVENTS IN PATIENTS TREATED WITH EGFR/MET BISPECIFIC ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/65</main-classification>  
        <further-classification edition="200601120260401B">A61K31/7056</further-classification>  
        <further-classification edition="200601120260401B">A61K31/164</further-classification>  
        <further-classification edition="200601120260401B">A61K31/155</further-classification>  
        <further-classification edition="200601120260401B">A61K31/315</further-classification>  
        <further-classification edition="200601120260401B">A61K31/573</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商健生生物科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSSEN BIOTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西莫斯　賈伊羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMOES, JAIRO AMORIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬哈德維亞　帕提烏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHADEVIA, PARTHIV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼馬提亞　薩馬尼　梅赫里根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMATIAN-SAMANI, MEHREGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係涉及降低以抗表皮生長因子受體(EGFR)/肝細胞生長因子受體(c-Met)抗體及EGFR酪胺酸激酶抑制劑治療之對象的皮膚不良事件(dermatologic adverse event, DAE)之發生或嚴重性之方法，其包含向該對象(a)投予（一種或多種）抗生素；(b)投予（一種或多種）防腐劑；及(c)投予非致粉刺保濕劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to methods of reducing occurrence or severity of dermatologic adverse events (DAEs) in a subject treated with an anti-epidermal growth factor receptor (EGFR)/hepatocyte growth factor receptor (c-Met) antibody and EGFR tyrosine kinase inhibitor, comprising (a) administering an antibiotic(s); (b) administering an antiseptic(s); and (c) administering a non-comedogenic moisturizer to the subject.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1377" publication-number="202626070"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626070.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>食用凝膠組合物、其製備方法及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">A61K31/717</main-classification>  
        <further-classification edition="200601120251001B">A61K31/734</further-classification>  
        <further-classification edition="200601120251001B">A61K33/10</further-classification>  
        <further-classification edition="200601120251001B">A61K33/42</further-classification>  
        <further-classification edition="200601120251001B">A61K31/19</further-classification>  
        <further-classification edition="200601120251001B">A61K9/06</further-classification>  
        <further-classification edition="200601120251001B">A61K33/06</further-classification>  
        <further-classification edition="200601120251001B">A61P39/02</further-classification>  
        <further-classification edition="201601120251001B">A23L33/125</further-classification>  
        <further-classification edition="201601120251001B">A23L33/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杭州糖吉醫療科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU TANGJI MEDICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>束妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及解酒產品技術領域，具體而言，涉及用於吸附酒精的食用凝膠組合物、其製備方法及其應用。所述食用凝膠組合物的原料包括羧甲基纖維素類原料、海藻酸類原料和鈣源，且所述原料中各成分的質量關係滿足：W1＝m2/(m1+m2)×100%，且12%≤W1≤35%；f＝m4/m3，且0.1≤f≤1.2；其中，m1為羧甲基纖維素類原料的質量，m2為海藻酸類原料的質量，m3為海藻酸類原料中羧基的質量，m4為鈣源中的Ca&lt;sup&gt;2+&lt;/sup&gt;的質量。食用凝膠組合物對酒精具有顯著的吸附特性，能夠快速吸附胃內的酒精，延遲酒精進入血液的速度和時間，減輕酒精對身體的代謝負擔，進一步減輕酒精對神經系統造成的損害。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1378" publication-number="202628637"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628637.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳化矽電晶體</chinese-title>  
        <english-title>SILICON CARBIDE TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260316B">H10D48/01</main-classification>  
        <further-classification edition="202501120260316B">H10D62/832</further-classification>  
        <further-classification edition="202601120260316B">H10P14/40</further-classification>  
        <further-classification edition="202601120260316B">H10P30/20</further-classification>  
        <further-classification edition="202601120260316B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格里菲斯大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIFFITH UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪米特里傑夫　西瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIMITRIJEV, SIMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈斯曼　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAASMANN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示關於一種增強型電晶體，其包含：源極；汲極；閘極，其位於該源極與該汲極之間；SiC層，其連接該源極與該汲極且經組態以在該電晶體之關斷狀態下在該源極與該汲極之間提供歐姆絕緣，及在由該閘極提供之電場的影響下在該電晶體之導通狀態下在該源極與該汲極之間傳導電荷載子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to an enhancement type transistor comprising a source; a drain; a gate between the source and the drain; a SiC layer connecting the source with the drain and configured to provide Ohmic insulation between the source and the drain in an off-state of the transistor, and conduct charge carriers between the source and the drain in an on-state of the transistor under the influence of an electric field provided by the gate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:增強型電晶體</p>  
        <p type="p">101:SiC層</p>  
        <p type="p">102:源極電極</p>  
        <p type="p">103:汲極電極</p>  
        <p type="p">104:閘極電極</p>  
        <p type="p">105:閘極絕緣層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1379" publication-number="202626433"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626433.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130946</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於將電池固定至框架的裝置、以及包括此種裝置的電動車輛</chinese-title>  
        <english-title>DEVICE FOR FIXING A BATTERY TO A FRAME, AND ELECTRIC VEHICLE INCLUDING SUCH A DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260317B">B62M6/90</main-classification>  
        <further-classification edition="201001120260317B">B62M6/80</further-classification>  
        <further-classification edition="202001120260317B">B62J43/28</further-classification>  
        <further-classification edition="202001120260317B">B62J43/23</further-classification>  
        <further-classification edition="200601120260317B">B62H5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商戴卡特隆有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECATHLON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩蒂特曼奇　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETITDEMANGE, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種用於將電池固定至框架的裝置，所述裝置包括安裝於電池外殼上的第一接口構件（16）及安裝於框架上的第一支撐件（20）。第一接口構件（16）包括：可伸縮止動件（36），具有被稱為外殼保持位置的第一位置及被稱為外殼移除位置的第二位置；以及彈性構件（40），用於將所述可伸縮止動件定位於第一位置中。第一支撐件（20）包括致動構件（50），致動構件（50）被配置成將所述可伸縮止動件定位於第二位置中，且第一支撐件（20）被配置成使得所述使用者能夠將所述手的手掌放於第一接口構件（16）附近且實質上垂直於外殼的移除方向而進行定向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a device for fixing a battery to a frame, comprising a first interface means (16) mounted on a battery case, and a first support (20) mounted on the frame. The first interface means (16) includes: a retractable stop (36) having a first position called case retention position, and a second position called case removal position; and an elastic means (40) for positioning said retractable stop in the first position. The first support (20) includes an actuation means (50) configured to position said retractable stop in the second position, and is configured to allow said user to have the palm of said hand in the vicinity of the first interface means (16) and oriented substantially perpendicularly to a direction of removal of the case.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">16:第一接口構件</p>  
        <p type="p">20:支撐件/第一支撐件</p>  
        <p type="p">24:間隔件</p>  
        <p type="p">26:內壁</p>  
        <p type="p">27、44:本體</p>  
        <p type="p">28:外壁/止動件</p>  
        <p type="p">32:軌條</p>  
        <p type="p">34:手柄</p>  
        <p type="p">36:可伸縮止動件</p>  
        <p type="p">37:臂</p>  
        <p type="p">38、54:軸線/旋轉軸線</p>  
        <p type="p">40:彈簧/彈性構件</p>  
        <p type="p">41:協作表面</p>  
        <p type="p">46:外壁</p>  
        <p type="p">48:貫穿孔/開口</p>  
        <p type="p">50:致動構件</p>  
        <p type="p">52:致動表面/臂</p>  
        <p type="p">56:致動表面</p>  
        <p type="p">58:指狀物</p>  
        <p type="p">64:阻擋指狀物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1380" publication-number="202626195"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626195.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於二氧化碳捕集之負載型固體吸附劑化合物</chinese-title>  
        <english-title>SUPPORTED SOLID SORBENT COMPOUNDS FOR CARBON DIOXIDE CAPTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">B01J20/28</main-classification>  
        <further-classification edition="200601120260316B">B01J20/30</further-classification>  
        <further-classification edition="200601120260316B">B01D53/02</further-classification>  
        <further-classification edition="200601120260316B">C01B33/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納斯維拉　泰瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASSIVERA, TERRY W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫特　納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTL, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛蘭特　柴克瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANT, ZACHARY R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於負載型固體吸附劑材料及無機多孔載體材料作為固體吸附劑化合物的載劑/載體材料之用途，以及其生產方法。本文中之化合物可用於從空氣或氣體環境中分離二氧化碳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to supported solid sorbent materials and use of inorganic porous support material as carrier/support material for the solid sorbent compounds, and production processes thereof. The compounds herein can be used for the separation of carbon dioxide from air or from a gaseous environment.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1381" publication-number="202626805"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626805.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改質之高ＲＩ聚乙酸乙烯酯</chinese-title>  
        <english-title>MODIFIED HIGH RI POLYVINYL ACETATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08F218/08</main-classification>  
        <further-classification edition="200601120260318B">C08F216/38</further-classification>  
        <further-classification edition="200601120260318B">C08F8/28</further-classification>  
        <further-classification edition="200601120260318B">B32B17/10</further-classification>  
        <further-classification edition="200601120260318B">C03C27/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊士曼化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EASTMAN CHEMICAL COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣德　薇妮妲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDE, VINITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　布萊恩　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, BRIAN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　文杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種包含環狀乙烯基共聚單體殘基之改質聚乙烯縮醛樹脂，其用於形成用於製造層合玻璃之中間層。如本文所述之中間層展現合意之光學及聲學性質，且比不含該改質聚乙烯縮醛樹脂之中間層更容易回收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A modified polyvinyl acetal resin comprising residues of a cyclic vinyl comonomer is provided for use in forming interlayers for making laminated glass. Interlayers as described herein exhibit desirable optical and acoustic properties and are more easily recycled than those without the modified polyvinyl acetal resin.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1382" publication-number="202626784"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626784.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用側基改質之高ＲＩ　ＰＶＢ柱</chinese-title>  
        <english-title>HIGH RI PVB POST MODIFIED WITH SIDE GROUPS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08F16/38</main-classification>  
        <further-classification edition="200601120260318B">C08F8/28</further-classification>  
        <further-classification edition="200601120260318B">B32B17/10</further-classification>  
        <further-classification edition="200601120260318B">C03C27/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊士曼化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EASTMAN CHEMICAL COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣德　薇妮妲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDE, VINITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　布萊恩　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, BRIAN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　文杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種包含芳族側鏈之改質聚乙烯縮醛樹脂，其用於形成用於製造層合玻璃之中間層。如本文所述之中間層展現合意之光學及聲學性質，且比不含該改質聚乙烯縮醛樹脂之中間層更容易回收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A modified polyvinyl acetal resin comprising aromatic side chains is provided for use in forming interlayers for making laminated glass. Interlayers as described herein exhibit desirable optical and acoustic properties and are more easily recycled than those without the modified polyvinyl acetal resin.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1383" publication-number="202626968"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626968.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜用無溶劑加成反應硬化型有機聚矽氧烷組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08L83/04</main-classification>  
        <further-classification edition="200601120260330B">C08G77/08</further-classification>  
        <further-classification edition="200601120260330B">C08G77/12</further-classification>  
        <further-classification edition="200601120260330B">C08G77/20</further-classification>  
        <further-classification edition="200601120260330B">C09D183/04</further-classification>  
        <further-classification edition="201801120260330B">C09J7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井原俊明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IHARA, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白神健人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAKAMI, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林亮廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種薄膜用無溶劑加成反應硬化型有機聚矽氧烷組成物，其含有下述(A)、(B)及(C)成分，且於25℃之動黏度為1~60mm&lt;sup&gt;2&lt;/sup&gt;/s。 &lt;br/&gt;　　(A)具有鍵結於矽原子之烯基，且於25℃之動黏度為2~400mm&lt;sup&gt;2&lt;/sup&gt;/s之有機聚矽氧烷：100質量份、 &lt;br/&gt;　　(B)具有鍵結於矽原子之氫原子(Si-H基)的有機氫聚矽氧烷：相對於(A)成分中之烯基的莫耳數而言，Si-H基之莫耳數為相當於0.1~3倍之量、 &lt;br/&gt;　　(C)鉑族金屬系觸媒：相對於組成物總量而言，以鉑族金屬之質量換算計，為1~500ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1384" publication-number="202629012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有成形之電性路徑的機械強健複合結構</chinese-title>  
        <english-title>MECHANICALLY ROBUST COMPOSITE STRUCTURES WITH FORMED ELECTRICAL PATHS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10W70/62</main-classification>  
        <further-classification edition="202601120260324B">H10W70/63</further-classification>  
        <further-classification edition="202601120260324B">H10W70/66</further-classification>  
        <further-classification edition="202601120260324B">H10W70/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAY, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃茲尼　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOZNY, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕布　戈帕拉克里希納Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRABHU, GOPALAKRISHNA B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯特　馬文路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERNT, MARVIN LOUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的數個實施例說明一種方法，包括設置一電性絕緣體材料於一陶瓷基底材料的一層上。陶瓷基底材料的層具有數個貫孔及數個固體部。此些固體部位在此些貫孔之間。此些貫孔填充有一導電金屬，導電金屬形成通過陶瓷基底材料的層的數個電性路徑。一複合結構係形成而包括電性絕緣體材料的數個部分，此些部分固定於陶瓷基底材料的層的此些固體部。複合結構更包括數個區域，此些區域位於電性絕緣體材料的此些部分之間。電性絕緣體材料具有一第一CTE，導電金屬具有一第二CTE，及陶瓷基底材料具有一第三CTE。第三CTE大於第一CTE且小於第二CTE。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure describe a method that includes disposing an electrical insulator material over a layer of a ceramic-based material having vias and solid portions between the vias. The vias are filled with an electrically conductive metal that forms electrical paths through the layer of the ceramic-based material. A composite structure is formed that includes portions of the electrical insulator material that are fixed to the solid portions of the layer of the ceramic-based material. The composite structure further includes regions positioned between the portions of the electrical insulator material. The electrical insulator material has a first coefficient of thermal expansion (CTE), the electrically conductive metal has a second CTE, and the ceramic-based material has a third CTE that is greater than the first CTE and less than the second CTE.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:層</p>  
        <p type="p">108:固體部</p>  
        <p type="p">108-1:第一端</p>  
        <p type="p">108-2:第二端</p>  
        <p type="p">110:電性路徑</p>  
        <p type="p">602,612:電性絕緣體材料</p>  
        <p type="p">604,614:部分</p>  
        <p type="p">606,616:孔</p>  
        <p type="p">622:導電金屬</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1385" publication-number="202628429"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628429.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像鏡頭驅動模組、相機模組與電子裝置</chinese-title>  
        <english-title>IMAGING LENS DRIVING MODULE, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260325B">H04N23/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇恆毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾奕華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YI HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾德生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, TE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像鏡頭驅動模組，其包含鏡頭載體、成像鏡頭、第一框架元件、可變光圈元件、電路板、彈性導線片、第一驅動單元以及第二驅動單元。成像鏡頭設置於鏡頭載體，並透過第一球元件設置於第一框架元件的第一軌道。可變光圈元件固定於鏡頭載體。電路板設置於成像鏡頭的像側。彈性導線片與電路板及鏡頭載體耦合固定。第一驅動單元用以驅動可變光圈元件的旋動部相對固定部旋動，使葉片旋動而讓通光孔擴大或縮小。第二驅動單元用以驅動鏡頭載體沿著第一方向位移。透過彈性導線片與可變光圈元件共同位移的配置，有助於達成自動對焦的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens driving module includes a lens assembly carrier, an imaging lens assembly, a first frame element, an adjustable aperture element, a circuit board, a flexible wire plate, a first driving element and a second driving element. The imaging lens assembly is disposed in the lens assembly carrier, and disposed against a first track of the first frame element via a first ball element. The adjustable aperture element is connected to the lens assembly carrier. The circuit board is disposed on an image side of the imaging lens assembly. The flexible wire plate is coupled to the circuit board and the lens assembly carrier. The first driving element is for driving a fixing portion of the adjustable aperture element to rotate relative to the rotating portion thereof so as to drive to blades for expanding or reducing an aperture hole. The second driving element is for driving the lens assembly carrier to move along a first direction. It is favorable for achieving the effect of auto-focuing by co-moving the flexible wire plate and the adjustable aperture element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:相機模組</p>  
        <p type="p">102:成像鏡頭</p>  
        <p type="p">110:鏡頭載體</p>  
        <p type="p">120:第一框架元件</p>  
        <p type="p">130:可變光圈元件</p>  
        <p type="p">150:彈性導線片</p>  
        <p type="p">172:第二磁石</p>  
        <p type="p">190:第三框架元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1386" publication-number="202626900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改質聚矽氮烷硬化覆膜之製造方法、以及改質聚矽氮烷硬化覆膜</chinese-title>  
        <english-title>METHOD FOR PRODUCING MODIFIED POLYSILAZANE CURED COATING, AND MODIFIED POLYSILAZANE CURED COATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260320B">C08J7/048</main-classification>  
        <further-classification edition="200601120260320B">B05D3/06</further-classification>  
        <further-classification edition="200601120260320B">C09D183/14</further-classification>  
        <further-classification edition="200601120260320B">C08G77/54</further-classification>  
        <further-classification edition="200601120260320B">C08L83/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人山形大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>硯里善幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZURI, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兼子達朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, TATSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種改質聚矽氮烷硬化覆膜之製造方法、以及藉由該製造方法而獲得之改質聚矽氮烷硬化覆膜，該製造方法係使由聚矽氮烷化合物所構成之膜在短時間內緻密化，變得可在短時間內製造水蒸氣穿透率變成充分低的膜。解決手段係於使聚矽氮烷化合物硬化時，對包含聚矽氮烷化合物之塗佈物以特定之範圍的照射強度照射真空紫外光(VUV)。具體而言，係包含：塗佈步驟，係將包含下述通式(1)所示之聚矽氮烷化合物的溶液塗佈於基材而形成塗佈物；以及硬化步驟，係對前述塗佈物照射Xe準分子光而將前述聚矽氮烷化合物予以改質，形成改質聚矽氮烷化合物之硬化覆膜；將前述硬化步驟中之前述Xe準分子光的照度設為280mW/cm&lt;sup&gt;2&lt;/sup&gt;至450mW/cm&lt;sup&gt;2&lt;/sup&gt;之範圍。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="151px" width="347px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for producing a modified polysilazane cured coating, which makes it possible to densify a coating made of a polysilazane compound in a short period of time and produce a coating having a sufficiently low water vapor transmission rate in a short period of time, and a modified polysilazane cured coating obtained by the production method are provided.&lt;br/&gt; In curing the polysilazane compound, a coating containing the polysilazane compound is irradiated with vacuum ultraviolet light (VUV) at an irradiation intensity within a specific range. Specifically, the method includes an application step for applying a base material with a solution containing a polysilazane compound represented by the following general formula (1) to form a coating, and a curing step for irradiating the coating with Xe excimer light to modify the polysilazane compound and form a cured coating of the modified polysilazane compound, and the illuminance of the Xe excimer light in the curing step is set to a range of 280 to 450 mW/cm&lt;sup&gt;2&lt;/sup&gt;.&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="142px" width="350px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1387" publication-number="202626373"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626373.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接著物之拆解方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B32B43/00</main-classification>  
        <further-classification edition="200601120260401B">B32B7/12</further-classification>  
        <further-classification edition="200601120260401B">C09J5/00</further-classification>  
        <further-classification edition="200601120260401B">C08G59/04</further-classification>  
        <further-classification edition="200601120260401B">C08G59/20</further-classification>  
        <further-classification edition="200601120260401B">C08G59/50</further-classification>  
        <further-classification edition="200601120260401B">C09J163/00</further-classification>  
        <further-classification edition="200601120260401B">C09J11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大津理人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSU, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有田和郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARITA, KAZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田駿介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種接著性、柔軟性及拆解性優良的接著物之拆解方法。具體而言為一種將基材A與基材B透過接著劑層而被接合之接著物予以拆解的方法。該接著劑層為相分離結構，該方法包含將該接著物進行感應加熱或微波加熱的加熱步驟。該接著劑層為環氧樹脂組成物的硬化物，該相分離結構係藉由該環氧樹脂組成物的硬化而產生者，該環氧樹脂組成物較佳為含有具有特定結構之環氧當量500～10,000g/當量的環氧樹脂(A)與環氧當量100～300g/當量的環氧樹脂(B)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1388" publication-number="202627998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊料檢查裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260325B">G06V10/40</main-classification>  
        <further-classification edition="202201120260325B">G06V10/82</further-classification>  
        <further-classification edition="200601120260325B">G01N21/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＣＫＤ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CKD CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池和義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, KAZUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]&lt;br/&gt; 提供一種可進行考量了刮板的移動方向之精度佳的檢查之焊料檢查裝置。&lt;br/&gt; [解決手段]&lt;br/&gt; 對令既定的類神經網路僅以良品的焊膏的影像資料作為學習資料進行學習而生成的AI模型101，輸入檢查用影像資料而取得重建影像資料，藉由將檢查用影像資料及重建影像資料作比較，以判定焊膏的良否。AI模型101係僅以刮板的移動方向共通之焊膏的影像資料作為學習資料進行學習而生成。檢查部79係對AI模型101輸入該檢查用影像資料，該AI模型101之已學習的學習資料中之刮板的移動方向成為與包含於檢查用影像資料之和檢查對象的焊膏相關之刮板的移動方向共通的方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:焊料檢查裝置</p>  
        <p type="p">31:輸送機構</p>  
        <p type="p">32:檢查單元</p>  
        <p type="p">32a:第一照明裝置</p>  
        <p type="p">32b:第二照明裝置</p>  
        <p type="p">32c:第三照明裝置</p>  
        <p type="p">32d:相機</p>  
        <p type="p">32e:X軸移動機構</p>  
        <p type="p">32f:Y軸移動機構</p>  
        <p type="p">33:控制裝置</p>  
        <p type="p">55:輸入部</p>  
        <p type="p">56:顯示部</p>  
        <p type="p">57:記憶部</p>  
        <p type="p">58:通訊部</p>  
        <p type="p">71:主控制部</p>  
        <p type="p">72:照明控制部</p>  
        <p type="p">73:相機控制部</p>  
        <p type="p">74:影像取得部</p>  
        <p type="p">75:資料處理部</p>  
        <p type="p">76:移動機構控制部</p>  
        <p type="p">77:學習部</p>  
        <p type="p">78:檢查部</p>  
        <p type="p">79:輸送機構控制部</p>  
        <p type="p">101:AI模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1389" publication-number="202627204"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627204.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附覆膜之金屬材料的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C23C22/73</main-classification>  
        <further-classification edition="200601120260330B">C23C22/82</further-classification>  
        <further-classification edition="200601120260330B">C01B13/32</further-classification>  
        <further-classification edition="200601120260330B">B32B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本帕卡瀨精股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHON PARKERIZING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望月優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIZUKI, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田勇太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所欲解決的問題在於，提供一種在藉由批次處理進行的化學轉化處理中不易產生外觀不佳的附覆膜之金屬材料的製造方法。作為解決手段係一種附覆膜之金屬材料的製造方法，其依序包含(a)覆膜化學轉化處理步驟與(b)水洗處理步驟。(a)覆膜化學轉化處理步驟及(b)水洗處理步驟以批次處理實行，由單次批次處理所處理的金屬材料的個數為100個以上且1000000個以下，當將(a)覆膜化學轉化處理步驟與(b)水洗處理步驟之間的時間設為A分鐘，並將由單次批次處理所處理的金屬材料的個數設為B個時，滿足以下的公式(1)：A&lt;sup&gt;6.5&lt;/sup&gt;×log(B)×0.00001＜118。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1390" publication-number="202626087"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626087.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結合ＭＡＳＰ－２的絲氨酸蛋白酶結構域的治療性抗體及其用途</chinese-title>  
        <english-title>THERAPEUTIC ANTIBODIES THAT BIND TO THE SERINE PROTEASE DOMAIN OF MASP-2 AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">C07K16/40</further-classification>  
        <further-classification edition="200601120260401B">A61P7/02</further-classification>  
        <further-classification edition="200601120260401B">A61P13/12</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商歐米諾斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMEROS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達德勒　湯馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUDLER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯佩特　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VON SPECHT, PETER KURT NOLLERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢吹宗久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABUKI, MUNEHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞辛　薩達姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASEEN, SADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IQ</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了分離的單克隆抗體及其抗原結合片段，其特異性地結合在人MASP-2的絲氨酸蛋白酶結構域內的表位。在某些實施方案中，所述抗體或其抗原結合片段抑制凝集素途徑補體活化。還提供了編碼公開的單克隆抗體或其抗原結合片段的多核苷酸以及包含這樣的多核苷酸的克隆載體或表達盒。進一步提供了抑制凝集素途徑補體活化的方法和治療凝集素途徑疾病和障礙的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Isolated monoclonal antibodies and antigen-binding fragments thereof are provided that specifically bind to an epitope within the serine protease domain of human MASP-2. In some embodiments, the antibodies or antigen-binding fragments thereof inhibit lectin pathway complement activation. Also provided are polynucleotides encoding the disclosed monoclonal antibodies or antigen-binding fragments thereof, and cloning vectors or expression cassettes comprising such polynucleotides. Further provided are methods of inhibiting lectin pathway complement activation and methods of treating lectin pathway diseases and disorders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1391" publication-number="202627246"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627246.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有碳摻雜矽磊晶層之基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C30B25/02</main-classification>  
        <further-classification edition="200601120260331B">C30B29/06</further-classification>  
        <further-classification edition="202601120260331B">H10P95/40</further-classification>  
        <further-classification edition="200601120260331B">C23C16/26</further-classification>  
        <further-classification edition="200601120260331B">C23C16/42</further-classification>  
        <further-classification edition="202601120260331B">H10P14/24</further-classification>  
        <further-classification edition="202301120260331B">H10K30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松原壽樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBARA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上東洋太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHIGASHI, YOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種含有碳摻雜矽磊晶層之基板及其製造方法，該含有碳摻雜矽磊晶層之基板具有矽基板上的碳摻雜矽磊晶層、與該碳摻雜矽磊晶層上的非碳摻雜矽磊晶層，其中，前述碳摻雜矽磊晶層的碳濃度由前述矽基板側朝向前述非碳摻雜矽磊晶層側連續地或階梯狀地減少。藉此，提供一種含有碳摻雜矽磊晶層之基板及其製造方法，其兼顧良好的吸雜特性與結晶性良好之高品質矽磊晶層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:含有碳摻雜矽磊晶層之基板</p>  
        <p type="p">2:矽基板</p>  
        <p type="p">3:碳摻雜矽磊晶層</p>  
        <p type="p">4:非碳摻雜矽磊晶層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1392" publication-number="202626916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131191</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導熱性膜用組成物及導熱性膜、以及導熱性膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08K3/04</main-classification>  
        <further-classification edition="200601120260318B">C08K7/02</further-classification>  
        <further-classification edition="200601120260318B">C08K3/22</further-classification>  
        <further-classification edition="200601120260318B">B32B27/18</further-classification>  
        <further-classification edition="201901120260318B">B32B7/027</further-classification>  
        <further-classification edition="200601120260318B">C08L83/04</further-classification>  
        <further-classification edition="200601120260318B">C08J5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>在間弘朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAIMA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種導熱性膜用組成物，其係磁性體粒子附著於碳材料而成之縱橫比為1.40以上之磁性、導熱性填料以特定之少量分散於硬化性樹脂中而成。本發明係一種導熱性膜及其製造方法，其中，上述導熱性膜係磁性體粒子附著於碳材料而成之縱橫比為1.40以上之磁性、導熱性填料以特定之少量分散於黏合劑樹脂中而成，厚度方向之導熱率為0.60 W/m·K以上，厚度方向之導熱率相對於面方向之導熱率之比之值為1.06以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1393" publication-number="202628788"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628788.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131196</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置及接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P10/00</main-classification>  
        <further-classification edition="202601120260318B">H10P72/50</further-classification>  
        <further-classification edition="200601120260318B">G06T5/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊木敬一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIKI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾祐平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種可提升將基板接合時的對準之精度的技術。 &lt;br/&gt;　　[解決手段]本揭示之一態樣的接合裝置，係接合第1基板與第2基板。接合裝置，係具備有：第1保持部；第2保持部；攝像部；及控制部。第1保持部，係保持第1基板。第2保持部，係保持第2基板。攝像部，係拍攝被保持於第1保持部的第1基板或被保持於第2保持部的第2基板。控制部，係從藉由攝像部所拍攝到的圖像中，選擇包含有被設置於第1基板及第2基板的至少任一者之對準標記的對象區域。而且，控制部，係基於與所選擇的對象區域之灰階值相關的灰階值資訊，設定被使用於針對圖像之伽瑪修正的伽瑪值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">70:控制裝置</p>  
        <p type="p">71:控制部</p>  
        <p type="p">71a:攝像處理部</p>  
        <p type="p">71b:調整處理部</p>  
        <p type="p">71c:設定部</p>  
        <p type="p">72:記憶部</p>  
        <p type="p">72a:區域資訊</p>  
        <p type="p">72b:灰值資訊</p>  
        <p type="p">72c:伽瑪值資訊</p>  
        <p type="p">235:上部攝像部</p>  
        <p type="p">236:下部攝像部</p>  
        <p type="p">256:調整部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1394" publication-number="202626685"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626685.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>親水性組成物、塗覆劑及被覆物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F7/18</main-classification>  
        <further-classification edition="200601120260401B">C09D183/04</further-classification>  
        <further-classification edition="200601120260401B">C03C17/30</further-classification>  
        <further-classification edition="200601120260401B">C09K3/00</further-classification>  
        <further-classification edition="200601120260401B">C01B33/12</further-classification>  
        <further-classification edition="200601120260401B">C01B33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木一憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀莉里花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORI, RIRIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣神宗直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROKAMI, MUNENAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種親水性組成物，其會賦予耐久性優異之親水性被膜，該親水性組成物包含選自由下述式(1)所示之有機矽化合物、該有機矽化合物之縮合物，及該有機矽化合物與金屬氧化物粒子之反應物所成群組之1種以上。 &lt;br/&gt;&lt;img align="absmiddle" height="84px" width="316px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sup&gt;1&lt;/sup&gt;分別獨立表示氫原子、碳數1~10之烷基或碳數6~10之芳基，R&lt;sup&gt;2&lt;/sup&gt;分別獨立表示碳數1~10之烷基或碳數6~10之芳基，X表示氫原子、k價之金屬陽離子或銨陽離子，k為1或2，但X為氫原子或銨陽離子時則k為1，m為1~10之整數，n為1~3之整數。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1395" publication-number="202626966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物及電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C08L81/02</main-classification>  
        <further-classification edition="200601120260317B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商太陽控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山茂義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYAMA, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関口翔也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIGUCHI, SHOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三島翔子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISHIMA, SHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉田侑生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGITA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川信広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, NOBUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供具有優異介電特性，且適合在清漆狀態下之塗覆之樹脂組成物，以及由該樹脂組成物所得之硬化物及電子零件。本發明之一個態樣之樹脂組成物包含具有下述式(1)所示構造之聚醯亞胺硫醚與溶劑，且前述聚醯亞胺硫醚之數平均分子量為5,000以上。 &lt;br/&gt;&lt;img align="absmiddle" height="243px" width="519px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;{式(1)中，R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;分別獨立為2價有機基，分別可為相同之基，也可為相異之基，R&lt;sub&gt;3&lt;/sub&gt;~R&lt;sub&gt;6&lt;/sub&gt;分別獨立為氫原子、烷基。}</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1396" publication-number="202628986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131217</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有雙散熱板的半導體封裝組件</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE ASSEMBLY WITH DUAL HEAT SINK PLATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10W40/22</main-classification>  
        <further-classification edition="202601120260324B">H10W70/65</further-classification>  
        <further-classification edition="202601120260324B">H10W72/00</further-classification>  
        <further-classification edition="202601120260324B">H10W72/20</further-classification>  
        <further-classification edition="202601120260324B">H10W95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李知宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JISEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明恩喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYUNG, EUNHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝組件包括：第一半導體封裝，以及從其前表面露出的第一半導體元件和第一組導電圖案；經由一組互連結構安裝在第一半導體封裝前表面上的中介層，其中所述中介層在其後表面處包括第二組導電圖案，第二組導電圖案與所述第一組導電圖案對準以通過所述一組互連結構彼此電連接；所述中介層還包括穿過中介層的至少一個開口；第二半導體封裝，其安裝在所述中介層的前表面上；以及散熱器，包括後散熱板，其安裝於所述第一半導體封裝與所述中介層之間且與所述第一半導體元件熱耦合；前散熱板，其安裝於所述中介層與所述第二半導體封裝之間且與所述中介層的前表面接觸；以及散熱板連接件，其延伸穿過所述至少一個開口並連接後散熱板和前散熱板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體封裝組件</p>  
        <p type="p">101:第一半導體封裝</p>  
        <p type="p">102:第一襯底</p>  
        <p type="p">104:半導體元件</p>  
        <p type="p">106:焊料凸塊</p>  
        <p type="p">110:模蓋</p>  
        <p type="p">112:中介層</p>  
        <p type="p">114:熱界面材料層</p>  
        <p type="p">118:第二半導體封裝</p>  
        <p type="p">120:第一開口</p>  
        <p type="p">122:第二開口</p>  
        <p type="p">124:後散熱板</p>  
        <p type="p">126:前散熱板</p>  
        <p type="p">128:散熱板連接件</p>  
        <p type="p">130:熱界面材料層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1397" publication-number="202627918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>狀態確認系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260318B">G06Q10/087</main-classification>  
        <further-classification edition="200601120260318B">B65G1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林一騎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上哲司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, TETSUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">狀態確認系統具備收集裝置、與顯示終端機。收集裝置，是收集包含在物流設施行走的行走車的位置數據的運作數據、以及設置在前述行走車的攝影機拍攝所生成的攝影機影像數據。顯示終端機，是接收運作數據、以及攝影機影像數據，並播放運作影像數據與攝影機影像數據，該運作影像數據，是在表示物流設施的虛擬空間上，使行走車的3維模型根據運作數據行走。顯示終端機，使發生異常的行走車的異常發生時間帶中的運作影像數據與攝影機影像數據的時刻同步並播放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:顯示終端</p>  
        <p type="p">31:攝影機影像視窗</p>  
        <p type="p">32:感測器資料視窗</p>  
        <p type="p">41:第1搜索條</p>  
        <p type="p">42:第2搜索條</p>  
        <p type="p">43:第3搜索條</p>  
        <p type="p">44:異常標記</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1398" publication-number="202627319"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627319.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖緊螺帽結構體及面板安裝機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">F16B37/08</main-classification>  
        <further-classification edition="200601120260327B">F16B37/04</further-classification>  
        <further-classification edition="200601120260327B">F16B39/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＩＤＥＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長江哲彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAE, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>境井貴行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川瀨祐輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASE, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石見崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAMI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉健廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種可效率良好地進行裝卸之鎖緊螺帽結構體。 &lt;br/&gt;本發明之鎖緊螺帽結構體1中，係設有：螺帽部2，係於周方向至少具有一個間隙2a，構成為能夠縮徑且能夠擴徑，並於內周具有內螺紋部20；鎖緊部3，係從外周嵌合於螺帽部2，並相對於螺帽部2於軸方向移動，藉此使螺帽部2成為縮徑狀態或擴徑狀態，並且相對於螺帽部2於周方向移動，藉此使螺帽部2之內螺紋部20相對於螺合於其之外部之外螺紋部101成為鎖緊狀態。於螺帽部2之外周面，係設有複數個卡合突起24，於鎖緊部3之內周面，係設有各個卡合突起24可卡合之複數個卡合溝30a。各個卡合溝30a，係具有沿著軸方向延伸之軸方向溝30a&lt;sub&gt;1&lt;/sub&gt;、及與其連通並沿著周方向延伸之周方向溝30a&lt;sub&gt;2&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鎖緊螺帽結構體</p>  
        <p type="p">2:螺帽部</p>  
        <p type="p">2a:間隙</p>  
        <p type="p">20:內螺紋部</p>  
        <p type="p">22:彈性部</p>  
        <p type="p">24:卡合突起</p>  
        <p type="p">25:凸緣部</p>  
        <p type="p">25a:上表面</p>  
        <p type="p">3:鎖緊部</p>  
        <p type="p">30:筒狀部</p>  
        <p type="p">30a:卡合溝</p>  
        <p type="p">30a&lt;sub&gt;1&lt;/sub&gt;:軸方向溝</p>  
        <p type="p">30a&lt;sub&gt;2&lt;/sub&gt;:周方向溝</p>  
        <p type="p">31:基部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1399" publication-number="202626692"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626692.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>1’-氰基核苷之製備方法</chinese-title>  
        <english-title>METHODS OF PREPARING 1'-CYANO NUCLEOSIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C07H1/00</main-classification>  
        <further-classification edition="200601120260316B">C07H7/06</further-classification>  
        <further-classification edition="200601120260316B">C07D487/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴達洛夫　帕佛　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BADALOV, PAVEL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷默　史黛西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREMNER, STACY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢　馬修　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, MATTHEW R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　地天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, DETIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貴格斯　諾蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIGGS, NOLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希曼　拉斯　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEUMANN, LARS V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　佳仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIAJEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾本　羅伯特　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILBURN, ROBERT R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆罕　桑卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAN, SANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼維爾　席恩　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEVILLE, SEAN T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石　兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史帝芬斯　安卓　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEVENS, ANDREW C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏利格　尼可拉斯　Ａ　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UHLIG, NICHOLAS A.J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維艾拉　泰戈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIEIRA, TIAGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫德斯奇　托德　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENDERSKI, TODD A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明大體上描述1’-氰基核苷(諸如式(I)化合物)之製備方法。例如，式(I)化合物可自式(II-a)化合物在流動反應器中製備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure generally describes methods of preparing 1’-cyano nucleosides, such as a compound of Formula (I). For example, the compound of Formula (I) can be prepared from a compound of Formula (II-a) in a flow reactor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一進料混合物</p>  
        <p type="p">111:預冷卻迴路#1</p>  
        <p type="p">120:第二進料混合物</p>  
        <p type="p">130:交叉點#1</p>  
        <p type="p">135:第一輸入混合物</p>  
        <p type="p">140:第一流動反應器</p>  
        <p type="p">145:第一輸出混合物</p>  
        <p type="p">150:第三進料混合物</p>  
        <p type="p">151:預冷卻迴路#2</p>  
        <p type="p">160:交叉點#2</p>  
        <p type="p">165:第二輸入混合物</p>  
        <p type="p">170:第二流動反應器</p>  
        <p type="p">180:第二輸出混合物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1400" publication-number="202628456"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628456.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者設備與通訊系統</chinese-title>  
        <english-title>USER EQUIPMENT AND COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W52/04</main-classification>  
        <further-classification edition="202301120251201B">H04W72/0453</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔勝鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SEUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權陽秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, YANGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓雄在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, WOONGJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文鐘建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, JONGGUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　裕鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YOOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種功率效率得到改善的使用者設備以及包括所述使用者設備的系統。使用者設備包括：射頻（RF）電路，被配置成自基地台接收訊息；記憶體，儲存頻譜效率集，所述頻譜效率集包括對應於接收天線數目的頻譜效率候選項；以及處理器，被配置成自訊息獲得流量資訊，藉由使用人工智慧模型而基於流量資訊計算所需頻譜效率，將所需頻譜效率與頻譜效率集進行比較，以及根據將所需頻譜效率與頻譜效率集進行比較的結果來確定具有第一數目個接收天線的第一頻譜效率候選項。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a user equipment with improved power efficiency and a system including the same. The user equipment includes a radio frequency (RF) circuit configured to receive a message from a base station, a memory storing a spectral efficiency set, the spectral efficiency set including spectral efficiency candidates corresponding to a number of reception antennas, and a processor configured to obtain traffic information from the message, calculate a required spectral efficiency based on the traffic information by using an artificial intelligence model, compare the required spectral efficiency with the spectral efficiency set, and determine a first spectral efficiency candidate with a first number of reception antennas according to a result of comparing the required spectral efficiency with the spectral efficiency set.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:使用者設備(UE)</p>  
        <p type="p">210:處理器</p>  
        <p type="p">220:射頻積體電路(RFIC)</p>  
        <p type="p">230:記憶體</p>  
        <p type="p">240:天線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1401" publication-number="202628262"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628262.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131294</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器</chinese-title>  
        <english-title>CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251016B">H01R13/40</main-classification>  
        <further-classification edition="200601120251016B">H01R13/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾威勒電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾瑟拉　吉米安立奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACERA, JIMMY ENRIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏立永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, LI-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器包含絕緣殼體以及至少一導電組件。絕緣殼體包含外殼、至少一第一導引部以及至少一第一卡扣部，外殼定義相連通之容置空間以及第一開口，第一導引部與第一卡扣部分別連接外殼。導電組件包含導電主體、第二導引部以及第二卡扣部，導電主體至少部分位於容置空間並穿越第一開口，第二導引部與第二卡扣部分別設置於導電主體，第二導引部配置以耦合第一導引部，第二卡扣部配置以卡扣第一卡扣部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector includes an insulating casing and at least one conductive component. The insulating casing includes an outer shell, at least one first guiding portion and at least one first snapping portion. The outer shell defines an accommodation space and a first opening communicated with the accommodation space. The first guiding portion and the first snapping portion are respectively connected with the outer shell. The conductive component includes a conductive body, a second guiding portion and a second snapping portion. The conductive body is at least partially located in the accommodation space and penetrates through the first opening. The second guiding portion and the second snapping portion are respectively disposed on the conductive body. The second guiding portion is configured to couple with the first guiding portion. The second snapping portion is configured to snap with the first snapping portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:絕緣殼體</p>  
        <p type="p">111:外殼</p>  
        <p type="p">112:第一導引部</p>  
        <p type="p">1121:限位件</p>  
        <p type="p">113:第一卡扣部</p>  
        <p type="p">113s:抵壓面</p>  
        <p type="p">120:導電組件</p>  
        <p type="p">121:導電主體</p>  
        <p type="p">1211:端子部</p>  
        <p type="p">1211a:外側端子</p>  
        <p type="p">1211b:內側端子</p>  
        <p type="p">1211c:導電片</p>  
        <p type="p">1212:導電部</p>  
        <p type="p">122:第二導引部</p>  
        <p type="p">1221:第一固定件</p>  
        <p type="p">1222:導引件</p>  
        <p type="p">123:第二卡扣部</p>  
        <p type="p">1231:第二固定件</p>  
        <p type="p">1232:彈性片</p>  
        <p type="p">1232a:固定端</p>  
        <p type="p">1232b:自由端</p>  
        <p type="p">B-B:線段</p>  
        <p type="p">DM:連接方向</p>  
        <p type="p">OP1:第一開口</p>  
        <p type="p">OP2:第二開口</p>  
        <p type="p">SP:容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1402" publication-number="202628913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131319</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>批次式基板處理裝置</chinese-title>  
        <english-title>BATCH-TYPE SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P72/70</main-classification>  
        <further-classification edition="202601120260323B">H10P72/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商尤金科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EUGENE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金勁勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南成珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, SUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔圭鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, GYU HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任敏赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, MIN HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及批次式基板處理裝置，其能夠確保基板處理製程的均勻性。一種設置在批次式基板處理裝置中的基板載具可包括：彼此面對的上支撐板和下支撐板；以及多個支撐柱，多個支撐柱介於上支撐板和下支撐板之間並構成為提供多個基板分別安置在其上的多個基板安置表面。多個支撐柱連接到上支撐板和下支撐板，以從上支撐板和下支撐板部分地向外突出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a batch-type substrate processing apparatus, which is capable of securing uniformity of a substrate processing process. A substrate boat provided in the batch-type substrate processing apparatus may include: an upper support plate and a lower support plate, which face each other; and a plurality of support pillars interposed between the upper support plate and the lower support plate and configured to provide a plurality of substrate seating surfaces on which the plurality of substrates are seated, respectively. The plurality of support pillars are connected to the upper support plate and the lower support plate to partially protrude outward from the upper support plate and the lower support plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應管</p>  
        <p type="p">120:加熱部件</p>  
        <p type="p">200:基板載具</p>  
        <p type="p">300:中空分歧管、分歧管</p>  
        <p type="p">310:排氣部件</p>  
        <p type="p">320:密封構件</p>  
        <p type="p">400:密封蓋部件</p>  
        <p type="p">410:密封蓋法蘭</p>  
        <p type="p">420:密封蓋板</p>  
        <p type="p">500:噴嘴部件</p>  
        <p type="p">510:外部製程氣體供應源</p>  
        <p type="p">520:噴嘴部件固定構件</p>  
        <p type="p">600:旋轉驅動部件</p>  
        <p type="p">610:旋轉軸</p>  
        <p type="p">700:裝載腔室</p>  
        <p type="p">710:移動軸</p>  
        <p type="p">720:線性移動構件、移動構件</p>  
        <p type="p">730:閘極</p>  
        <p type="p">800:基座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1403" publication-number="202628870"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628870.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體材料的保形蝕刻</chinese-title>  
        <english-title>CONFORMAL ETCH OF SEMICONDUCTOR MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10P72/00</main-classification>  
        <further-classification edition="202601120260317B">H10P72/70</further-classification>  
        <further-classification edition="202601120260317B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬塞爾懷特　那森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSSELWHITE, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙里亞蒂　裕蘇夫　阿布拉里姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARIATI, YUSEF ABDURRAHEEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　濟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口　直志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, MARK NAOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中描述的各種實施例係關於蝕刻半導體基板以將目標材料從基板表面移除的方法及設備。整體而言，本文中描述的技術係不依賴使用電漿的熱技術。在數個實施例中，特定氣體混合物係被提供至反應腔室以與該目標材料反應。該氣體混合物可以包含如氟化氫(HF)的鹵素源，以及添加劑的組合。該氣體混合物可以任選包含有機溶劑和/或水，和/或承載氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments described herein relate to methods and apparatus for etching a semiconductor substrate to remove a target material from a surface of the substrate. Generally, the techniques described herein are thermal techniques that do not rely on the use of plasma. In a number of embodiments, a particular gas mixture is provided to the reaction chamber to react with the target material. The gas mixture may include a combination of a halogen source such as hydrogen fluoride (HF), and an additive. The gas mixture may optionally include an organic solvent and/or water, and/or a carrier gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201,203,205,207,209,210,211:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1404" publication-number="202628904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無接觸晶圓定位載具設計</chinese-title>  
        <english-title>CONTACTLESS WAFER POSITIONING CARRIER DESIGN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P72/50</main-classification>  
        <further-classification edition="200601120260331B">H01F7/02</further-classification>  
        <further-classification edition="200601120260331B">H01F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富爾福德　亨利　吉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULFORD, HENRY JIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加德納　馬克　Ｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARDNER, MARK I.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富爾福德　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULFORD, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶圓處理用的方法包含在真空板上的晶圓卡盤上之晶圓載具上提供晶圓。晶圓載具包含永久磁鐵。晶圓卡盤包含電磁鐵。藉由使電流流過電磁鐵，以使晶圓載具從晶圓卡盤被排斥但晶圓維持在晶圓載具上，而以逆重力方向升高晶圓。當維持升高晶圓時，藉由移動晶圓卡盤、晶圓載具、或兩者而調整晶圓對準。將電流減小至零以使晶圓載具接觸晶圓卡盤。晶圓係經由晶圓卡盤的第一真空腔及晶圓載具的第三真空腔連接至真空板。晶圓載具係經由晶圓卡盤的第二真空腔連接至真空板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of wafer handling includes providing a wafer on a wafer carrier on a wafer chuck on a vacuum plate. The wafer carrier includes a permanent magnet. The wafer chuck includes an electromagnet. The wafer is raised against a gravity direction by flowing an electrical current through the electromagnet so that the wafer carrier is repelled from the wafer chuck while the wafer remains on the wafer carrier. While keeping the wafer raised, wafer alignment is adjusted by moving the wafer chuck, the wafer carrier or both. The electrical current is reduced to zero so that the wafer carrier contacts the wafer chuck. The wafer is connected to the vacuum plate via a first vacuum cavity of the wafer chuck and a third vacuum cavity of the wafer carrier. The wafer carrier is connected to the vacuum plate via the second vacuum cavity of the wafer chuck.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:程序</p>  
        <p type="p">S510、S520、S530、S540、S550:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1405" publication-number="202628416"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628416.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>解碼裝置、編碼裝置、解碼方法及編碼方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260330B">H04N19/105</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商松下電器(美國)知識產權公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　漢文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEO, HAN BOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　宗順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, CHONG SOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高晶英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, JINGYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　景元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THONG, JING YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　申益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SHEN YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞達夫　普拉文　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YADAV, PRAVEEN KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安倍清史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KIYOFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西孝啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉尾敏康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIO, TOSHIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日下部敏彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAKABE, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">解碼裝置對已解碼的第1圖像，應用使用了類神經網路之NN(neural network)處理(S301)，不參照NN處理後的第1圖像，而是參照NN處理前的第1圖像，來將解碼順序比第1圖像晚之第2圖像解碼(S302)，參照NN處理後的第1圖像，來將解碼順序比第2圖像晚之第3圖像解碼(S303)。例如，解碼裝置亦可與第2圖像的解碼處理並行地進行對第1圖像的NN處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301~S303:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1406" publication-number="202626906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二羥基化合物之製造方法及再生樹脂之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C08J11/08</main-classification>  
        <further-classification edition="200601120260331B">C08J11/14</further-classification>  
        <further-classification edition="200601120260331B">C08J11/22</further-classification>  
        <further-classification edition="200601120260331B">C07C37/84</further-classification>  
        <further-classification edition="200601120260331B">C07C39/16</further-classification>  
        <further-classification edition="200601120260331B">C07C29/09</further-classification>  
        <further-classification edition="200601120260331B">C08G64/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤宣之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, NORIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂木篤志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTEGI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供將含有合成樹脂及有機雜質的廢樹脂組成物進行再循環(Recycle)之方法。 &lt;br/&gt;　　一種二羥基化合物之製造方法，其係由廢樹脂組成物製造二羥基化合物之方法， &lt;br/&gt;　　其包含：步驟(a1)，係處理包含廢樹脂組成物、酮系溶劑和水之鹼溶液，從而得到包含二羥基化合物之混合物和酮系溶劑之反應溶液；該廢樹脂組成物含有具有選擇自下述通式(1)~(4)構成之群組中至少2個結構單元之樹脂；該二羥基化合物之混合物含有選擇自下述通式(1’)~(4’)構成之群組之第1二羥基化合物及選擇自前述通式(1’)~(4’)構成之群組中至少1個其他二羥基化合物、及 &lt;br/&gt;　　步驟(b1)，係在前述反應溶液中添加醇系溶劑，並從得到的結晶化溶液將前述第1二羥基化合物進行晶析； &lt;br/&gt;&lt;img align="absmiddle" height="1440px" width="1195px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="1400px" width="1208px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1407" publication-number="202626034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626034.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>葡萄糖依賴性促胰島素多肽受體拮抗劑及其用途</chinese-title>  
        <english-title>GLUCOSE-DEPENDENT INSULINOTROPIC POLYPEPTIDE RECEPTOR ANTAGONISTS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K31/44</main-classification>  
        <further-classification edition="200601120260324B">A61K31/4025</further-classification>  
        <further-classification edition="200601120260324B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲力奇　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FILIPSKI, KEVIN JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李維　薩繆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVI, SAMUEL MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普利歐　湯姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PULEO, THOMAS RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞斯　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REESE, MATTHEW R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙蒙斯　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMMONS, MATTHEW FORREST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述式I之化合物： &lt;br/&gt;&lt;img align="absmiddle" height="302px" width="404px" file="ed10172.JPG" alt="ed10172.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　及其醫藥上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;cy&lt;/sup&gt;、L&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;1&lt;/sup&gt;、T&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;3&lt;/sup&gt;、T&lt;sup&gt;4&lt;/sup&gt;、n1、t1、t2、及t3係在本文中定義；其作為GIPR拮抗劑之用途；含有此等化合物及鹽之醫藥組成物；及此等化合物及鹽用於治療或預防例如肥胖、體重增加、及/或T2DM之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are compounds of Formula I: &lt;br/&gt;&lt;img align="absmiddle" height="290px" width="377px" file="ed10173.JPG" alt="ed10173.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;and their pharmaceutically acceptable salts, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;cy&lt;/sup&gt;, L&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;1&lt;/sup&gt;, T&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;3&lt;/sup&gt;, T&lt;sup&gt;4&lt;/sup&gt; , n1, t1, t2, and t3 are defined herein; their use as GIPR antagonists; pharmaceutical compositions containing such compounds and salts; and the use of such compounds and salts to treat or prevent, for example, obesity, weight gain, and/or T2DM.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1408" publication-number="202626901"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626901.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變溫燒結</chinese-title>  
        <english-title>VARIOTHERMAL SINTERING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08J9/16</main-classification>  
        <further-classification edition="200601120260318B">C08J9/232</further-classification>  
        <further-classification edition="200601120260318B">B29C44/04</further-classification>  
        <further-classification edition="200601120260318B">B29C44/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特瑞瑟　克利斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRASSL, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種製造以聚(甲基)丙烯醯亞胺為基礎的成型發泡體之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a process for producing shaped foam bodies based on poly(meth)acrylimide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1409" publication-number="202628106"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628106.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G11C16/06</main-classification>  
        <further-classification edition="200601120251204B">G11C16/12</further-classification>  
        <further-classification edition="200601120251204B">G11C16/10</further-classification>  
        <further-classification edition="200601120251204B">G11C16/08</further-classification>  
        <further-classification edition="200601120251204B">G11C16/24</further-classification>  
        <further-classification edition="200601120251204B">G11C16/32</further-classification>  
        <further-classification edition="200601120251204B">G11C16/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤光司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體記憶裝置，其能抑制記憶胞之可靠性惡化。 &lt;br/&gt;一實施方式之半導體記憶裝置具備：第1字元線；第2字元線；第1記憶胞，其連接於第1字元線；第2記憶胞，其連接於第2字元線；及控制電路，其執行向第1記憶胞及第2記憶胞之資料之寫入動作。於寫入動作中，依序執行各自包含編程動作及驗證動作之複數個編程循環。控制電路於針對第1記憶胞之驗證動作中，於要對第2字元線施加第1電壓時且對第1字元線施加第2電壓後，對第1字元線施加與寫入狀態對應之第3電壓，並隨著複數個編程循環之推進而改變第2電壓之電壓位準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AV,DV,EV,FV,GV:驗證電壓</p>  
        <p type="p">t1~t6,t11~t28:時刻</p>  
        <p type="p">VPGM,Vpr,Vsp,VSS,Vuk,Vwl:電壓</p>  
        <p type="p">WLsel:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1410" publication-number="202627474"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627474.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢測與監測癌症的運甲狀腺素蛋白生物標記物</chinese-title>  
        <english-title>TRANSTHYRETIN BIOMARKERS FOR DETECTING AND MONITORING CANCERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">G01N33/5752</main-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification>  
        <further-classification edition="200601120260401B">G01N27/447</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昇捷生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN JET BIOTECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡有光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAY, YEOU-GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種診斷一患者之癌症健康狀態、或癌症健康狀態變化之方法，或用於診斷一患者癌症變化或存在的風險之方法，其包含：自該患者之一血漿樣本中測定對應於含運甲狀腺素蛋白之複合結構的一或多個生物標記物值；以及基於該等生物標記物值，判定該患者罹患或未罹患癌症、或具有或不具有癌症健康狀態之變化，或具有或不具有癌症風險，其中該癌症較佳為肺癌（lung cancer，LC）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for diagnosing a cancer health state, or a change in cancer health state in a patient, or for diagnosing a risk of the change or presence of a cancer in a patient, comprising determining, in a plasma sample from said patient, one or more biomarker values that correspond to transthyretin-containing complex structures, and assigning the patient as having or not having cancer, or having or not having a change in cancer health state, or having or not having a risk of cancer based on said biomarker values, wherein said cancer is preferably lung cancer (LC).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1411" publication-number="202628593"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628593.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131462</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">H10B51/30</main-classification>  
        <further-classification edition="202301120260323B">H10B51/10</further-classification>  
        <further-classification edition="202301120260323B">H10B51/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安世衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, SEHYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全寅鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, INTAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔在亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JAEHYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置可包括：基板；導電線，在第一水平方向上彼此間隔開，導電線在與第一水平方向相交的第二水平方向上延伸；至少一個閘極電極，在第一水平方向上位於導電線之間，至少一個所述閘極電極在豎直方向上延伸；通道層，環繞至少一個所述閘極電極，通道層在豎直方向上彼此間隔開；介電層，位於通道層與至少一個所述閘極電極之間；金屬層，位於通道層與介電層之間；閘極絕緣層，位於通道層與金屬層之間；以及至少一個介面層，環繞至少一個所述閘極電極，至少一個所述介面層位於通道層與至少一個所述閘極電極之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include: a substrate; conductive lines spaced apart from each other in a first horizontal direction, the conductive lines extending in a second horizontal direction intersecting the first horizontal direction; at least one gate electrode between the conductive lines in the first horizontal direction, the at least one gate electrode extending in a vertical direction; channel layers surrounding the at least one gate electrode, the channel layers spaced apart from each other in the vertical direction; a dielectric layer between the channel layers and the at least one gate electrode; a metal layer between the channel layers and the dielectric layer; a gate insulating layer between the channel layers and the metal layer; and at least one interfacial layer surrounding the at least one gate electrode, the at least one interfacial layer being between the channel layers and the at least one gate electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:第一絕緣圖案</p>  
        <p type="p">121:通道層</p>  
        <p type="p">123:閘極絕緣層</p>  
        <p type="p">125:金屬層</p>  
        <p type="p">130:側壁絕緣圖案</p>  
        <p type="p">140:導電線</p>  
        <p type="p">151:介電層</p>  
        <p type="p">152:第一介面層</p>  
        <p type="p">160:閘極電極</p>  
        <p type="p">SS:堆疊結構</p>  
        <p type="p">X:第一水平方向</p>  
        <p type="p">Y:第二水平方向</p>  
        <p type="p">Z:豎直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1412" publication-number="202626989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬質塗覆用硬化性組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C09D133/26</main-classification>  
        <further-classification edition="200601120260317B">C09D4/02</further-classification>  
        <further-classification edition="200601120260317B">C08L33/10</further-classification>  
        <further-classification edition="200601120260317B">G03F7/028</further-classification>  
        <further-classification edition="200601120260317B">G03F7/038</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇田健吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKITA, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種於低溫焙燒條件下可獲得除了具備顯影性以外，還較先前技術更高透明且高硬度之硬化膜之硬質塗覆用硬化性組合物。 &lt;br/&gt;本發明提供一種能夠形成圖案之硬質塗覆用硬化性組合物，其包含作為(A)成分之於1分子中具有至少1個(甲基)丙烯醯基之單體化合物或單體化合物之混合物、作為(B)成分之光聚合起始劑及作為(C)成分之有機溶劑，且(A)成分之化合物或混合物之羥值為超過170 mgKOH/g之值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1413" publication-number="202628174"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628174.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多模電感耦合電漿</chinese-title>  
        <english-title>MULTI-MODE INDUCTIVELY COUPLED PLASMA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H01J37/32</main-classification>  
        <further-classification edition="200601120260317B">H03H7/01</further-classification>  
        <further-classification edition="200601120260317B">H03H7/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雨暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿札德　ＡＮＭ瓦塞科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZAD, A N M WASEKUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬斯瓦米　卡提克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMASWAMY, KARTIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊特　尼可拉斯約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHT, NICOLAS JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電感耦合電漿腔室的方法和裝置允許分割並聯線圈組以相同或不同的RF頻率通電。ICP源可能包括與線圈組件的第一線圈組相連的第一頻率的第一RF功率，以及與第二線圈組相連的第二頻率的第二RF功率，其中第一線圈組具有圍繞第一內線圈同心放置的第一內線圈和第一外線圈，第一內線圈和第一外線圈以串聯方式電連接，第二線圈組具有圍繞第二內線圈同心放置的第二內線圈和第二外線圈，第二內線圈和第二外線圈以串聯方式電連接，並且第一線圈組和第二線圈組彼此獨立進行通電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for inductively coupled plasma chambers allow for split parallel coil sets to be energized with the same or different RF frequencies. An ICP source may comprise a first RF power with a first frequency connected to a first coil set of the coil assembly, a second RF power with a second frequency connected to a second coil set where the first coil set has a first inner coil and a first outer coil positioned concentrically about the first inner coil, the first inner coil and the first outer coil are electrically connected in series, the second coil set has a second inner coil and a second outer coil positioned concentrically about the second inner coil, the second inner coil and the second outer coil are electrically connected in series, and the first coil set and the second coil set are electrically energized separately from each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:ICP腔室</p>  
        <p type="p">902:腔室壁</p>  
        <p type="p">904:內部處理空間</p>  
        <p type="p">906:泵送系統</p>  
        <p type="p">908:氣體分配系統</p>  
        <p type="p">910:噴嘴</p>  
        <p type="p">912:平坦的頂蓋</p>  
        <p type="p">914:複數個交錯內線圈組</p>  
        <p type="p">916:複數個交錯外線圈組</p>  
        <p type="p">918:第一RF電漿源</p>  
        <p type="p">920:底座</p>  
        <p type="p">922:上部</p>  
        <p type="p">924:下部</p>  
        <p type="p">926:垂直運動</p>  
        <p type="p">928:升舉裝置</p>  
        <p type="p">930:波紋管</p>  
        <p type="p">946:控制器</p>  
        <p type="p">948:CPU</p>  
        <p type="p">950:記憶體</p>  
        <p type="p">952:支援電路</p>  
        <p type="p">954:升舉銷</p>  
        <p type="p">960:第二RF電漿源</p>  
        <p type="p">962:分割線圈組件</p>  
        <p type="p">980:ICP產生系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1414" publication-number="202626397"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626397.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可旋轉且可移除的嬰兒汽車座椅</chinese-title>  
        <english-title>ROTATABLE AND REMOVABLE INFANT CAR SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B60N2/28</main-classification>  
        <further-classification edition="200601120260323B">B60N2/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茱莉亞　龐澤克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JULIA, PONZEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞繆爾　吉爾哈特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMUEL, GEARHART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科林Ｆ　埃格特　克羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLIN F, EGGERT-CROWE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱爾Ｓ　梅森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYLE S, MASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兒童約束系統包括一支撐底座，該支撐底座可安裝至一車輛座椅。該支撐底座具有一收納組件。一兒童座椅可以可移除地連接至該支撐底座。當該兒童座椅連接至該支撐底座時，該兒童座椅可相對於該支撐底座圍繞一旋轉軸線旋轉。一安裝組件配置在該兒童座椅處並且可與該收納組件接合，以將該兒童座椅連接至該支撐底座。該安裝組件可在該兒童座椅之圍繞該旋轉軸線之實質上任何位置處連接至該收納組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child restraint system includes a support base mountable to a vehicle seat. The support base has a receiving component. A child seat is removably connectable to the support base. The child seat is rotatable relative to the support base about an axis of rotation when the child seat is connected to the support base. A mounting component is arranged at the child seat and is engageable with the receiving component to connect the child seat to the support base. The mounting component is connectable to the receiving component at substantially any position of the child seat about the axis of rotation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">220:兒童約束系統</p>  
        <p type="p">222:支撐底座</p>  
        <p type="p">230:上表面</p>  
        <p type="p">232:前端</p>  
        <p type="p">234:後端</p>  
        <p type="p">236:第一橫向側</p>  
        <p type="p">240:兒童座椅</p>  
        <p type="p">242:前端</p>  
        <p type="p">246:第一橫向側</p>  
        <p type="p">248:第二橫向側</p>  
        <p type="p">250:定位總成</p>  
        <p type="p">252:收納組件</p>  
        <p type="p">270:安裝組件</p>  
        <p type="p">272:內部空腔</p>  
        <p type="p">C2:中心線</p>  
        <p type="p">C2s:中心線</p>  
        <p type="p">L2s:中心縱向軸線</p>  
        <p type="p">M2:中心軸線</p>  
        <p type="p">R2:中心軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1415" publication-number="202626877"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626877.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水系二次電池正極用黏合劑組成物、非水系二次電池正極用組成物、非水系二次電池用正極及非水系二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G73/14</main-classification>  
        <further-classification edition="201001120260401B">H01M4/136</further-classification>  
        <further-classification edition="201001120260401B">H01M4/58</further-classification>  
        <further-classification edition="200601120260401B">H01M4/62</further-classification>  
        <further-classification edition="201001120260401B">H01M10/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城崎丈雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIZAKI, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮下夏己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASHITA, NATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種對電解液之耐久性或正極活性物質之分散穩定性優異、能夠形成充放電效率及容量保持率等電池特性優異之二次電池的非水系二次電池正極用黏合劑組成物、含有該正極用黏合劑組成物之非水系二次電池正極用組成物、由該正極用組成物形成之非水系二次電池用正極、以及具有該正極之二次電池。研究之結果，完成了非水系二次電池正極用黏合劑組成物之發明，該非水系二次電池正極用黏合劑組成物含有具有下述化學式（1）所表示之重複單元之聚醯胺醯亞胺。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="148px" width="445px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（化學式（1）中，R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;、R&lt;sub&gt;3&lt;/sub&gt;分別獨立地為氫原子或甲基，且至少一者為甲基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1416" publication-number="202628914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131542</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓載置台</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P72/70</main-classification>  
        <further-classification edition="200601120260327B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇佐美太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USAMI, TARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久野達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶圓載置台10包括：陶瓷板20，在上表面具有晶圓載置面21，並且內置有電極22；導電板30，配置於陶瓷板20的下表面側；接合層40，接合陶瓷板20以及導電板30；陶瓷板貫通部50，貫穿陶瓷板20；緻密質塞55，設置於陶瓷板貫通部50，並且容許氣體通過；以及氣體導入通路60，至少設置於接合層40以及導電板30的內部，並且連通於陶瓷板貫通部50。接合層40具有將第一絕緣體層41、第二絕緣體層42與第一導電體層45層積的構造，第一導電體層45露出於接合層貫通部64，接合層貫通部64為貫通接合層40的部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓載置台</p>  
        <p type="p">20:陶瓷板</p>  
        <p type="p">21:晶圓載置面</p>  
        <p type="p">22:電極</p>  
        <p type="p">30:導電板</p>  
        <p type="p">31:凹槽</p>  
        <p type="p">32:冷媒流路</p>  
        <p type="p">40:接合層</p>  
        <p type="p">40a:絕緣體層</p>  
        <p type="p">40b:導電體層</p>  
        <p type="p">41:第一絕緣體層</p>  
        <p type="p">42:第二絕緣體層</p>  
        <p type="p">45:第一導電體層</p>  
        <p type="p">50:陶瓷板貫通部</p>  
        <p type="p">55:緻密質塞</p>  
        <p type="p">55a:氣體內部流路</p>  
        <p type="p">60:氣體導入通路</p>  
        <p type="p">61:氣體第一通路</p>  
        <p type="p">62:氣體第二通路</p>  
        <p type="p">64:接合層貫通部</p>  
        <p type="p">64a,64b,64c:貫通孔</p>  
        <p type="p">70:導電氣體通過部</p>  
        <p type="p">71:被覆層</p>  
        <p type="p">71a:孔</p>  
        <p type="p">72:板簧</p>  
        <p type="p">72a:上表面</p>  
        <p type="p">72b:下表面</p>  
        <p type="p">73:折返部</p>  
        <p type="p">73a:第一折返部</p>  
        <p type="p">73b:第二折返部</p>  
        <p type="p">L1,L2:距離</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1417" publication-number="202626929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輸送帶用橡膠組成物、輸送帶用橡膠材料及輸送帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08L7/00</main-classification>  
        <further-classification edition="200601120260318B">C08L21/00</further-classification>  
        <further-classification edition="200601120260318B">C08K3/36</further-classification>  
        <further-classification edition="200601120260318B">C08K5/548</further-classification>  
        <further-classification edition="200601120260318B">F16G1/08</further-classification>  
        <further-classification edition="200601120260318B">B65G15/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本友樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDOU, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種耐磨耗性、斷裂強度、斷裂伸長率及抗疲勞龜裂性之間具優良平衡性的輸送帶用橡膠材料、及、適合用於製造該輸送帶用橡膠材料的輸送帶用橡膠組成物。其解決手段為一種輸送帶用橡膠組成物，包含：相對於選自由天然橡膠及合成橡膠所組成的群組的至少1個的橡膠成分100質量份，親水性氣相二氧化矽3質量份以上且40質量份以下、碳黑10質量份以上且50質量份以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1418" publication-number="202627689"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627689.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附有多層反射膜之基板、反射型光罩基底、反射型光罩基底之製造方法、反射型光罩</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">G03F7/20</main-classification>  
        <further-classification edition="200601120260320B">C03C17/34</further-classification>  
        <further-classification edition="200601120260320B">C23C14/00</further-classification>  
        <further-classification edition="200601120260320B">C23F1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎正弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阪田一真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>半澤智佳子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANZAWA, CHIKAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市川雄太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIKAWA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於基準標記之測定座標之再現性優異的附有多層反射膜之基板。 &lt;br/&gt;一種附有多層反射膜之基板，其具備基板及多層反射膜，且於上述多層反射膜之表面配置有成為基準標記之凹部，上述凹部之傾斜角度超過45.0°且為80.0°以下，於上述凹部之底面具有凸部，上述凹部之開口位置至上述凸部之表面的平均深度D相對於上述凸部之平均高度H之比即D/H比為80.0以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:附有多層反射膜之基板</p>  
        <p type="p">14:多層反射膜</p>  
        <p type="p">20:凹部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1419" publication-number="202628891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體剛性晶片級封裝及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR RIGID CHIP-SCALE PACKAGE AND METHOD OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P72/30</main-classification>  
        <further-classification edition="202601120260323B">H10W42/00</further-classification>  
        <further-classification edition="202601120260323B">H10P14/40</further-classification>  
        <further-classification edition="202601120260323B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊震</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周曙華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, SHUHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　隆慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LONG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝，包括：半導體基板，具有正面和與半導體基板正面相對的背面；多個接觸墊，附接至半導體基板正面；第一厚金屬層，具有正面和與第一厚金屬層正面相對的背面，第一厚金屬層的正面通過一種子層附接至半導體基板的背面；以及第二厚金屬層，具有正面和與第二厚金屬層正面相對的背面，第二厚金屬層的正面附接至第一厚金屬層的背面；其中第一厚金屬層和第二厚金屬層被配置為具有相反應力狀態的兩層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a seed layer, a first thick metal layer, a second thick metal layer, and a coating metal layer. Direct attachment of the first thick metal layer and the second thick metal layer comprises bonded metal atoms. The first thick metal layer and the second thick metal layer are bonded by an SAB process. A method comprises the steps of providing an upper device portion, providing a lower carrier portion, applying an SAB process, applying a de-bonding process, applying a tape, applying a singulation process, and removing the tape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體封裝</p>  
        <p type="p">120:半導體基板</p>  
        <p type="p">122:正面</p>  
        <p type="p">124:背面</p>  
        <p type="p">127:鎳層</p>  
        <p type="p">129:金層</p>  
        <p type="p">130:接觸墊</p>  
        <p type="p">132:鋁段</p>  
        <p type="p">134:鈍化段</p>  
        <p type="p">140:種子層</p>  
        <p type="p">150:第一厚金屬層</p>  
        <p type="p">152:正面</p>  
        <p type="p">154:背面</p>  
        <p type="p">170:第二厚金屬層</p>  
        <p type="p">172:正面</p>  
        <p type="p">174:背面</p>  
        <p type="p">190:外金屬層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1420" publication-number="202625956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擦洗墊及其製造方法</chinese-title>  
        <english-title>SCOURING PAD AND METHOD FOR MANUFACTURING SCOURING PAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">A47L17/08</main-classification>  
        <further-classification edition="200601120260318B">D04H3/08</further-classification>  
        <further-classification edition="201201120260318B">D04H3/14</further-classification>  
        <further-classification edition="200601120260318B">D06M15/233</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商3Ｍ新設資產公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金銀實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YINSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHEN TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金政敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, CHUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種擦洗墊及其製造方法，該擦洗墊包括：第一纖維；第二纖維；及塗層組成物，包括至少50%至90%之黏合樹脂，其中該第二纖維之厚度係該第一纖維之厚度的至少兩倍，該第二纖維與該第一纖維之比例(重量/重量)在5：5至9：1之範圍內，該擦洗墊之挺度小於400gm，且該第一纖維及該第二纖維之總重量佔該擦洗墊重量之45%至65%。本揭露之擦洗墊具有優異的清潔與發泡性能、柔軟的手感、及適合半拋棄式使用的耐久性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a scouring pad and a manufacturing method thereof, the scouring pad including: a first fiber; a second fiber; and a coating composition including a binding resin of at least 50 to 90%, wherein a thickness of the second fiber is at least twice a thickness of the first fiber, a ratio of the second fiber to the first fiber (weight/weight) ranges from 5:5 to 9:1, a stiffness of the scouring pad is less than 400 gm, and a total weight of the first fiber and the second fiber ranges from 45 to 65% of a weight of the scouring pad. The scouring pad of the disclosure has excellent cleaning and foaming performance, soft hand feeling, and durability suitable for semi-disposable use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1421" publication-number="202626551"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626551.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊陶瓷電容器用黏結劑組成物、堆疊陶瓷電容器用漿料組成物、堆疊陶瓷電容器用堆疊體及堆疊陶瓷電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C04B35/00</main-classification>  
        <further-classification edition="200601120260319B">C04B35/634</further-classification>  
        <further-classification edition="200601120260319B">H01G4/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木智一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, TOMOKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明以提供能夠製備能夠將優異的耐破裂性賦予介電質層等同時分散穩定性優異之堆疊陶瓷電容器用漿料組成物的堆疊陶瓷電容器用黏結劑組成物為目的。本發明之堆疊陶瓷電容器用黏結劑組成物包含粒子狀聚合物及溶媒，其中前述粒子狀聚合物具有：具備核部及覆蓋前述核部之外表面之至少一部分之殼部的核殼結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1422" publication-number="202628167"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628167.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131615</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於線性加速器的功率饋通總成及離子植入機</chinese-title>  
        <english-title>POWER FEEDTHROUGH ASSEMBLY FOR LINEAR ACCELERATOR AND ION IMPLANTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01J37/317</main-classification>  
        <further-classification edition="200601120260325B">H01J37/08</further-classification>  
        <further-classification edition="200601120260325B">H05H7/22</further-classification>  
        <further-classification edition="200601120260325B">H05H9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯內卡特爾　路奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONECUTTER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉恩斯　克里斯汀　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROUNDS, KRISTEN STEPHANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於線性加速器的功率饋通總成。功率饋通總成可包括絕緣殼體，其包含彎曲陶瓷殼，以及導電桿，耦合以傳送射頻電壓至線性加速器的給定加速級，其中導電桿延伸通過絕緣殼體中的孔。功率饋通總成還可包括凸緣，耦合以機械地連接絕緣殼體至線性加速器的壁。如此，絕緣殼體可包括耦合結構，耦合結構將絕緣殼體耦合至導電桿與凸緣，其中耦合結構包含至少一個突出部，至少一個突出部被配置成與位於凸緣或導電桿中的外部結構耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power feedthrough assembly for a linear accelerator. The power feedthrough assembly may include an insulating housing, comprising a curved ceramic shell, and a conductive rod, coupled to deliver an RF voltage to a given acceleration stage of the linear accelerator, where the conductive rod extends through an aperture in the insulating housing. The power feedthrough assembly may also include a flange, coupled to mechanically connect the insulating housing to a wall of the linear accelerator. As such, the insulating housing may include a coupling structure that couples the insulating housing to the conductive rod and to the flange, wherein the coupling structure comprises at least one protrusion configured to couple with an external structure that is located in the flange or the conductive rod.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:真空包殼</p>  
        <p type="p">200:功率饋通總成</p>  
        <p type="p">202:諧振器包殼</p>  
        <p type="p">204:絕緣殼體</p>  
        <p type="p">206:彎曲陶瓷殼</p>  
        <p type="p">208:導電桿</p>  
        <p type="p">209:孔</p>  
        <p type="p">210:凸緣</p>  
        <p type="p">212:屏蔽件</p>  
        <p type="p">214:漂移管電極</p>  
        <p type="p">220:活塞式水封</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1423" publication-number="202626309"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626309.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131624</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人系統及機器人系統的控制方法</chinese-title>  
        <english-title>ROBOT SYSTEM AND CONTROL METHOD FOR THE ROBOT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B25J13/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸林央樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUBAYASHI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的機器人系統係具備：機器人，係含有複數個關節及保持工件的機器手；扭矩檢測部，係配置於複數個關節中的預定的關節，檢測預定的關節的繞旋轉軸線的檢測扭矩值；及控制部，係進行下述控制：在藉由機器手保持工件並令其移動的動作的期間，根據檢測扭矩值的時間變異或位置變異來識別：機器人與物體之間的碰撞、和由機器手對工件的保持。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A robot system according to the present disclosure is comprised of a robot that includes a plurality of joints and a hand for holding a workpiece; a torque detection unit that is disposed at a predetermined joint among the plurality of joints and detects a torque value around a rotation axis of the predetermined joint; and a control unit that performs control to distinguish a collision between the robot and an object from the holding of the workpiece by the hand based on changes in the detected torque value over time or position during the operation of holding and moving the workpiece with the hand.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1424" publication-number="202627685"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627685.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗蝕劑底層組成物以及使用組成物形成圖案的方法</chinese-title>  
        <english-title>RESIST UNDERLAYER COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G03F7/11</main-classification>  
        <further-classification edition="200601120260319B">G03F7/027</further-classification>  
        <further-classification edition="200601120260319B">C08F212/14</further-classification>  
        <further-classification edition="200601120260319B">C08F220/30</further-classification>  
        <further-classification edition="200601120260319B">C08F220/36</further-classification>  
        <further-classification edition="200601120260319B">C08F220/10</further-classification>  
        <further-classification edition="200601120260319B">C08F220/32</further-classification>  
        <further-classification edition="202601120260319B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陣和英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, HWAYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺雅羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, AHRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李恩受</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, EUNSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SOOJEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文情寅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUN, JUNGIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭盛宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, SUNGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔有廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YOOJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李智惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抗蝕劑底層組成物、利用抗蝕劑底層組成物形成圖案的方法、利用抗蝕劑底層組成物形成圖案的系統、以及抗蝕劑底層組成物的抗蝕劑底層。抗蝕劑底層組成物可包括包含由化學式1表示的結構單元和由化學式2表示的結構單元的聚合物以及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="508px" width="248px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resist underlayer composition, a method of forming a pattern utilizing the resist underlayer composition, a system of forming a pattern utilizing the resist underlayer composition, and a resist underlayer of the resist underlayer composition are disclosed. The resist underlayer composition may include a polymer including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2 and a solvent. &lt;br/&gt;&lt;b/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="487px" width="426px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基材</p>  
        <p type="p">102:薄膜</p>  
        <p type="p">104:抗蝕劑底層</p>  
        <p type="p">106a:曝光區域</p>  
        <p type="p">106b:未曝光區域</p>  
        <p type="p">106:光刻膠膜</p>  
        <p type="p">108:光刻膠圖案</p>  
        <p type="p">110:曝光掩模</p>  
        <p type="p">112:有機薄膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1425" publication-number="202627036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131660</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅蝕刻用之水性組成物、使用其之蝕刻方法及半導體封裝體用基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K13/04</main-classification>  
        <further-classification edition="200601120260401B">C23F1/18</further-classification>  
        <further-classification edition="202601120260401B">H10P50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王舶紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本望圭紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONMO, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾家俊行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIE, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於可選擇性地蝕刻利用濺鍍法或無電解鍍敷而形成之含有銅或銅合金之晶種層的蝕刻用之水性組成物。本發明之水性組成物，係銅蝕刻用之水性組成物，其特徵在於：含有(A)過氧化氫、(B)選自於磷酸及膦酸中之至少1種、及(C)氯離子，(A)過氧化氫與(B)選自於磷酸及膦酸中之至少1種的質量比(A)/(B)為0.03~0.7的範圍，(C)氯離子之含量以前述水性組成物之總量基準計為1~500ppm，不含具有雙硫鍵或巰基之化合物，或者前述具有雙硫鍵或巰基之化合物之含量為未達0.1質量%，pH值為-1.0~1.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1426" publication-number="202626818"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626818.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>丙烯基樹脂、組成物、硬化物、印刷配線基板、半導體密封材料及增層膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08F290/00</main-classification>  
        <further-classification edition="200601120260318B">C08F210/12</further-classification>  
        <further-classification edition="200601120260318B">C08F212/32</further-classification>  
        <further-classification edition="200601120260318B">C08F2/60</further-classification>  
        <further-classification edition="200601120260318B">G01R33/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>猪狩匡人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARI, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]根據本發明，可以得到丙烯基樹脂、含有該丙烯基樹脂的組成物及其硬化物，該丙烯基樹脂在與硬化劑、例如具有不飽和雙鍵的硬化劑混合時具有優異的成形流動性(特別是螺旋流)、且在硬化時兼具優異的硬化性(特別是凝膠時間)和耐熱性(特別是玻璃轉移溫度)。 &lt;br/&gt;[解決手段]本發明為通式(1)所表示的丙烯基樹脂、以及含有順丁烯二醯亞胺樹脂和上述通式(1)所表示的丙烯基樹脂的樹脂組成物、該組成物的硬化物、使用該組成物而成的印刷配線基板、使用該組成物而成的半導體密封材料、以及使用該組成物而成的增層膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1427" publication-number="202628837"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628837.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131669</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括初始蝕刻和快速蝕刻的基板處理、及相關方法、設備、系統與腔室</chinese-title>  
        <english-title>SUBSTRATE PROCESSING INCLUDING INITIAL ETCHING AND FAST ETCHING, AND RELATED METHODS, APPARATUS, SYSTEMS, AND CHAMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P50/24</main-classification>  
        <further-classification edition="202601120260316B">H10P14/20</further-classification>  
        <further-classification edition="202601120260316B">H10P72/70</further-classification>  
        <further-classification edition="202601120260316B">H10P95/90</further-classification>  
        <further-classification edition="200601120260316B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃奕樵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-CHIAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬普拉　索拉布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOPRA, SAURABH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖威爾　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEWELL, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施例通常涉及半導體元件的製造，特定而言是包括初始蝕刻和快速蝕刻的系統和方法。在一或多個實施例中，基板處理方法包括在第一壓力和包含氯化氫的第一組成下蝕刻基板的層。該蝕刻包括以第一流動速率流動第一組成達第一時間段。該方法包括在第二壓力和包含氯氣（Cl2）的第二組成下蝕刻該層，並且該蝕刻包括以第二流動速率流動第二組成達第二時間段，該第二時間段少於第一時間段，且第二流動速率少於第一流動速率。第二時間段與第一時間段成一時間比率，且該時間比率為1:15或更少。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein generally relate to semiconductor device fabrication, and more particularly, to systems and methods that include initial etching and fast etching. In one or more embodiments, a method of substrate processing includes etching a layer of a substrate using a first pressure and a first composition including hydrogen chloride. The etching includes flowing the first composition for a first time period and at a first flow rate. The method includes etching the layer using a second pressure and a second composition including chlorine (Cl2) gas, and the etching includes flowing the second composition for a second time period less than the first time period and at a second flow rate less than the first flow rate. The second time period is a time ratio of the first time period, and the time ratio is 1:15 or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">410:操作</p>  
        <p type="p">420:操作</p>  
        <p type="p">430:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1428" publication-number="202629049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131679</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10W76/13</main-classification>  
        <further-classification edition="202601120260330B">H10W76/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高岩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAIWA, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於在藉由蓋部覆蓋搭載於配線基板上之半導體晶片之類型之半導體裝置中，謀求半導體晶片之小型化。 &lt;br/&gt;本發明之半導體裝置包含：半導體晶片；配線基板，其供搭載半導體晶片，在與搭載有半導體晶片之側之面即正面為相反側之面即背面側形成有用於與外部進行電性連接之外部連接端子；及蓋部，其藉由形成於半導體晶片之外緣部之接著構件而與半導體晶片接著，覆蓋半導體晶片上；且接著構件之一部分溢出至較半導體晶片之外緣端靠外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">2:半導體晶片</p>  
        <p type="p">3:配線基板</p>  
        <p type="p">3a:正面</p>  
        <p type="p">3b:背面</p>  
        <p type="p">4:蓋部</p>  
        <p type="p">5:接合層</p>  
        <p type="p">6:接著構件</p>  
        <p type="p">8:密封部</p>  
        <p type="p">8a:第一密封部</p>  
        <p type="p">8b:第二密封部</p>  
        <p type="p">21:像素</p>  
        <p type="p">22:像素形成區域</p>  
        <p type="p">B:焊球</p>  
        <p type="p">C:空腔</p>  
        <p type="p">P2:區域</p>  
        <p type="p">pb:墊</p>  
        <p type="p">pc:晶片側墊</p>  
        <p type="p">pw:基板側墊</p>  
        <p type="p">W:接合線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1429" publication-number="202628502"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628502.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND A METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H05K1/11</main-classification>  
        <further-classification edition="202601120260327B">H05K1/185</further-classification>  
        <further-classification edition="200601120260327B">H05K3/40</further-classification>  
        <further-classification edition="202601120260327B">H05K3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王茹立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃進明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高克毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, KER-YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置及其製造方法。電子裝置包括基板、第一電子單元、導電元件以及電路結構。基板包括在第一方向上彼此相對的第一表面和第二表面，其中基板包括凹槽以及貫穿第一表面和第二表面的穿孔。第一電子單元設置在凹槽中。導電元件設置在穿孔中且電性連接至第一電子單元，其中導電元件包括晶種層圖案以及自晶種層圖案沿第一方向延伸的導電柱。電路結構設置在基板的第一表面上且電性連接第一電子單元和導電元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction and including a cavity and a through-hole penetrating the first and second surfaces, a first electronic unit disposed in the cavity, a conductive element disposed in the through hole and electrically connected to the first electronic unit and including a seed layer pattern and a conductive pillar extending from the seed layer pattern along the first direction, and a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:電子裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">100c:凹槽</p>  
        <p type="p">100m:標記/對準標記</p>  
        <p type="p">100s1:第一表面</p>  
        <p type="p">100s2:第二表面</p>  
        <p type="p">110、120、184、CL1a、CL1b:導電層</p>  
        <p type="p">132:導體</p>  
        <p type="p">140:第一電子單元</p>  
        <p type="p">142:基礎層</p>  
        <p type="p">144:電路層</p>  
        <p type="p">150:附著件</p>  
        <p type="p">160:底部填充劑</p>  
        <p type="p">170:第二電子單元</p>  
        <p type="p">172:基礎層</p>  
        <p type="p">174:電路層</p>  
        <p type="p">180:連接墊</p>  
        <p type="p">182:晶種層</p>  
        <p type="p">190:連接元件</p>  
        <p type="p">BE1:接合元件</p>  
        <p type="p">CE2:導電元件</p>  
        <p type="p">CS1:電路結構</p>  
        <p type="p">IL1、IL1a、IL1b:絕緣層</p>  
        <p type="p">ML1:封裝層</p>  
        <p type="p">PL1:促進層</p>  
        <p type="p">SL1a、SL1b:晶種層</p>  
        <p type="p">SP1:晶種層圖案</p>  
        <p type="p">WS1、WS1a、WS1b:配線結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1430" publication-number="202629045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝和用於其製造的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10W74/10</main-classification>  
        <further-classification edition="202601120260324B">H10W70/65</further-classification>  
        <further-classification edition="202601120260324B">H10W72/00</further-classification>  
        <further-classification edition="202601120260324B">H10W74/01</further-classification>  
        <further-classification edition="202601120260324B">H10W95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGTAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔涬喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HANGCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙南柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, NAMJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李喜秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HEESOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種半導體封裝，其限定中心軸線，包括：第一單元，其包括：基底；形成於所述基底上的中介層堆疊，其包括多個堆疊在一起的中介層且在所述中介層堆疊的側邊上限定階梯結構，所述階梯結構包括暴露於所述中介層堆疊中的相應中介層的至少兩個階梯表面；在所述基底上堆疊在一起的多個半導體裸片並且鄰近於所述中介層堆疊的階梯結構，所述多個半導體裸片中的每個半導體裸片部分地附接在所述基底上，或附接在所述階梯結構的階梯表面中的一個階梯表面上；以及形成於所述基底上的密封劑層，其密封所述中介層堆疊和所述多個半導體裸片；以及具有與所述第一單元的結構基本上相同的結構的第二單元，二者相對於所述中心軸線對稱地並且同時地形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體封裝</p>  
        <p type="p">100-1:單元</p>  
        <p type="p">100-2:單元</p>  
        <p type="p">110:基底</p>  
        <p type="p">120:中介層堆疊</p>  
        <p type="p">121:焊料凸塊</p>  
        <p type="p">122-1:中介層</p>  
        <p type="p">122-2:中介層</p>  
        <p type="p">122-3:中介層</p>  
        <p type="p">123:焊料凸塊</p>  
        <p type="p">124:導電圖案</p>  
        <p type="p">125:連接結構</p>  
        <p type="p">130:階梯結構</p>  
        <p type="p">131-1:階梯表面</p>  
        <p type="p">131-2:階梯表面</p>  
        <p type="p">131-3:階梯表面</p>  
        <p type="p">132-1:豎立表面</p>  
        <p type="p">132-2:豎立表面</p>  
        <p type="p">132-3:豎立表面</p>  
        <p type="p">140-1:半導體裸片</p>  
        <p type="p">140-2:半導體裸片</p>  
        <p type="p">140-3:半導體裸片</p>  
        <p type="p">140-4:半導體裸片</p>  
        <p type="p">150:密封劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1431" publication-number="202626485"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626485.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體製造系統及氣體製造系統之運轉方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">C01B3/02</main-classification>  
        <further-classification edition="201701120260401B">C01B32/40</further-classification>  
        <further-classification edition="202101120260401B">C25B1/042</further-classification>  
        <further-classification edition="202101120260401B">C25B9/00</further-classification>  
        <further-classification edition="200601120260401B">B01J12/00</further-classification>  
        <further-classification edition="200601120260401B">B01J19/24</further-classification>  
        <further-classification edition="200601120260401B">B01J7/00</further-classification>  
        <further-classification edition="200601120260401B">F28D21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内藤皓貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAITO, TERUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩田有波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOTA, ARUFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大友順一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOMO, JUNICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供能量效率較高的氣體製造系統。 &lt;br/&gt;本發明係具備有：反應器2、氫產生器3、原料氣體供應路徑41、還原氣體供應路徑42、生成氣體排出路徑43、再利用氣體排出路徑44、供應氣體切換部60、及排出氣體切換部70；而，該反應器2係具有將原料氣體還原而生成出生成氣體的還原劑；該氫產生器3係產生含有供將還原劑予以還原用之氫的還原氣體；該原料氣體供應路徑41係朝反應器輸送原料氣體；該還原氣體供應路徑42係從氫產生器將還原氣體輸送給反應器；該生成氣體排出路徑43係將由反應器所生成的生成氣體予以排出；該再利用氣體排出路徑44係將含有由還原氣體進行還原之還原劑，所產生水蒸氣的再利用氣體，從反應器中排出後輸送給氫產生器；該供應氣體切換部60係將朝反應器輸送氣體的路徑切換為原料氣體供應路徑與還原氣體供應路徑中之一個路徑；該排出氣體切換部70係將從反應器中排出氣體的路徑切換為生成氣體排出路徑與再利用氣體排出路徑中之一個路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:氣體製造系統</p>  
        <p type="p">2:反應器</p>  
        <p type="p">3:氫產生器</p>  
        <p type="p">4:原料氣體供應部</p>  
        <p type="p">5:生成氣體排出部</p>  
        <p type="p">31:原料氣體加熱器</p>  
        <p type="p">32:還原氣體加熱器</p>  
        <p type="p">41:原料氣體供應路徑</p>  
        <p type="p">42:還原氣體供應路徑</p>  
        <p type="p">43:生成氣體排出路徑</p>  
        <p type="p">44:再利用氣體排出路徑</p>  
        <p type="p">51,52,53:送風機</p>  
        <p type="p">60:供應氣體切換部</p>  
        <p type="p">61:原料氣體開關閥</p>  
        <p type="p">62:還原氣體開關閥</p>  
        <p type="p">70:排出氣體切換部</p>  
        <p type="p">71:生成氣體開關閥</p>  
        <p type="p">72:氣體開關閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1432" publication-number="202628960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱蝕刻用的設備及技法</chinese-title>  
        <english-title>APPARATUSES AND TECHNIQUES FOR THERMAL ETCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P95/70</main-classification>  
        <further-classification edition="202601120260324B">H10P72/72</further-classification>  
        <further-classification edition="202601120260324B">H10P50/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬塞爾懷特　那森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSSELWHITE, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯尼　布奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERNEY, BUTCH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕里米　文卡塔　沙拉特　錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARIMI, VENKATA SHARAT CHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滿天星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAN, TIANXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩阿　阿比納夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAH, ABHINAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口　直志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, MARK NAOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於熱蝕刻一基板的半導體處理系統。一些系統具有：一處理腔室；一靜電卡盤，在一腔室內部之中且具有：一支撐板，用以支撐一基板；一加熱器，建構以將該支撐板及該基板加熱；一條以上流體導管，熱連接至該支撐板且建構以接收於一第三溫度的一第一流體、及在大於該第三溫度的一第四溫度的一第二流體；一邊緣環；一碗部，圍繞一中心軸線而延伸，位在該邊緣環下方且與該邊緣環熱接觸，且具有一碗部加熱器；及一個以上電極，建構以接收DC電壓，且對一基板施加一夾持力；一噴淋頭，具有：一面板；一背板，在該面板的相反側；及一噴淋頭加熱器；及至少三條製程化學品輸送導管，流體連接至該噴淋頭且在其上游。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor processing systems for thermal etching a substrate are provided. Some systems have a processing chamber, an electrostatic chuck in a chamber interior and having a support plate to support a substrate, a heater configured to heat the support plate and substrate, one or more fluid conduits thermally connected to the support plate and configured to receive a first fluid at a third temperature and a second fluid at a fourth temperature greater than the third temperature, an edge ring, a bowl extending around a center axis, positioned below and in thermal contact with the edge ring, and having a bowl heater, and one or more electrodes configured to receive DC voltage and apply a clamping force on a substrate, a showerhead having a faceplate, a backplate opposite the faceplate, and a showerhead heater, and at least three process chemistry delivery conduits fluidically connected to and upstream of the showerhead.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:腔室</p>  
        <p type="p">102:壁</p>  
        <p type="p">104:底部</p>  
        <p type="p">106:頂部</p>  
        <p type="p">108:腔室內部</p>  
        <p type="p">110:靜電卡盤</p>  
        <p type="p">112:基板</p>  
        <p type="p">113:支撐表面</p>  
        <p type="p">114:支撐板</p>  
        <p type="p">115:加熱器</p>  
        <p type="p">116:溫度控制板</p>  
        <p type="p">118:流體導管</p>  
        <p type="p">119:流體輸送導管</p>  
        <p type="p">120:邊緣環</p>  
        <p type="p">122:出口</p>  
        <p type="p">122:中心軸線</p>  
        <p type="p">124:碗部</p>  
        <p type="p">126:碗部加熱器</p>  
        <p type="p">128:支撐柱</p>  
        <p type="p">130:電極</p>  
        <p type="p">132:噴淋頭</p>  
        <p type="p">134:面板</p>  
        <p type="p">136:背板</p>  
        <p type="p">138:噴淋頭加熱器</p>  
        <p type="p">139:輸送系統</p>  
        <p type="p">140A,140B,140C:化學品</p>  
        <p type="p">142A,142B,142C:流動路徑</p>  
        <p type="p">144:側壁加熱器</p>  
        <p type="p">145:加熱器</p>  
        <p type="p">146:熱中斷件</p>  
        <p type="p">150:閥</p>  
        <p type="p">152:前級管線</p>  
        <p type="p">154:前級管線加熱器</p>  
        <p type="p">156:節流閥</p>  
        <p type="p">158:閥加熱器</p>  
        <p type="p">160:排放部</p>  
        <p type="p">162:渦輪分子泵</p>  
        <p type="p">164:雙重冷卻器</p>  
        <p type="p">166:控制器</p>  
        <p type="p">168:處理器</p>  
        <p type="p">170:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1433" publication-number="202628628"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628628.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260317B">H10D30/60</main-classification>  
        <further-classification edition="202501120260317B">H10D30/67</further-classification>  
        <further-classification edition="202501120260317B">H10D30/01</further-classification>  
        <further-classification edition="202601120260317B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原紘司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松﨑陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAKI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤慈規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置之製造方法，包含：準備具有閘極電極膜的構造體之程序；在前述構造體之上形成平坦化膜的程序；在前述平坦化膜之上利用微影程序而形成圖案之程序；以及使用前述圖案將前述閘極電極膜進行圖案化之程序。在形成前述平坦化膜的程序，在前述構造體之上配置硬化性組成物的複數個液滴，使前述複數個液滴進行結合而形成液膜，將前述液膜予以硬化從而獲得前述平坦化膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:半導體基板</p>  
        <p type="p">104:STI(Shallow trench isolation:淺溝槽隔離)</p>  
        <p type="p">106a:第1絕緣膜</p>  
        <p type="p">110:第2絕緣膜</p>  
        <p type="p">111:第3絕緣膜</p>  
        <p type="p">112:閘極電極膜</p>  
        <p type="p">114:平坦化膜</p>  
        <p type="p">CE:能量</p>  
        <p type="p">SS:超直具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1434" publication-number="202626088"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626088.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131729</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＬＤＮ４－抗ＣＤ１３７雙特異性抗體之與鉑系藥劑的組合在癌治療之用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">A61K31/555</further-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07K16/46</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商安斯泰來製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTELLAS PHARMA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤雅人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供以治療對象之癌為目的而與鉑系藥劑組合使用之抗CLDN4-抗CD137雙特異性抗體或含有該雙特異性抗體之醫藥組成物，或提供包含將抗CLDN4-抗CD137雙特異性抗體與鉑系藥劑投予至對象的癌之治療方法。 &lt;br/&gt;　　其解決手段：於表現人類CLDN4之小鼠癌細胞之荷癌小鼠中，抗CLDN4-抗CD137雙特異性抗體與奧沙利鉑之併用，相較於單獨投予抗CLDN4-抗CD137雙特異性抗體或奧沙利鉑的情況而言，顯示出統計上顯著之抗腫瘤效果。進一步地，於表現人類CLDN4之小鼠癌細胞之荷癌小鼠中，於奧沙利鉑與抗VEGFR抗體的二劑併用之上追加抗CLDN4-抗CD137雙特異性抗體之三劑併用的情況時，亦相較於二劑併用觀察到較強的抗腫瘤效果。由此結果，暗示了抗CLDN4-抗CD137雙特異性抗體與鉑系藥劑之組合，有用於表現CLDN4之癌的治療。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1435" publication-number="202628928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131732</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板吸附狀態檢測方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P72/72</main-classification>  
        <further-classification edition="202601120260318B">H10P50/20</further-classification>  
        <further-classification edition="202601120260318B">H10P14/24</further-classification>  
        <further-classification edition="200601120260318B">H02N13/00</further-classification>  
        <further-classification edition="200601120260318B">C23C16/458</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松崎賢二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAKI, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種檢測基板的吸附狀態之基板吸附狀態檢測方法及基板處理裝置。 &lt;br/&gt;一種基板吸附狀態檢測方法，係在具備靜電吸盤及吸盤電源的基板處理裝置中檢測被吸附保持在該靜電吸盤的基板的吸附狀態，該靜電吸盤係具有介電質層及埋設在該介電質層的吸盤電極，該吸盤電源係對該吸盤電極施加吸附電壓，該介電質層係具有供載置該基板的載置面；該基板吸附狀態檢測方法係具有下述工序：檢測該吸附電壓從第1施加狀態往第2施加狀態的電壓的時間變化；判定在該電壓的時間變化的中途是否已暫時性地發生朝反方向的電壓變化；以及當判定為已發生該朝反方向的電壓變化的情形，則判定該基板的吸附狀態已從第1吸附狀態變化成第2吸附狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1436" publication-number="202627256"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627256.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紡織機械用清紗機</chinese-title>  
        <english-title>KNOT CATCHER FOR TEXTILE MACHINES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260329B">D04B15/48</main-classification>  
        <further-classification edition="200601120260329B">B65H63/06</further-classification>  
        <further-classification edition="200601120260329B">B65H51/22</further-classification>  
        <further-classification edition="200601120260329B">D04B35/02</further-classification>  
        <further-classification edition="200601120260329B">D04B15/68</further-classification>  
        <further-classification edition="200601120260329B">D02H13/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商美名格　艾羅有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEMMINGER-IRO GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊因多普　馬庫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLEINDORP, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於紡織機械用的清紗機（9），特別是針織機械用的清紗機，清紗機（9）包括一基部（18），該基部由具有均勻板厚（s）的金屬板坯料製成並形成一固定區段（19）及一清紗機區段（20），其中該清紗機區段（20）具有一紗線穿線開口（24），該紗線穿線開口於邊緣開口並呈狹縫形態，其中該紗線穿線開口（24）在其端部包括一第一開口區段（25），該第一開口區段尤其沿直線延伸並具有一第一槽縫寬度（b&lt;sub&gt;1&lt;/sub&gt;），該第一槽縫寬度在該第一開口區段（25）的長度上係恆定的，且當沿一紗線穿線方向（X）觀察該清紗機區段（20）時，該第一槽縫寬度係適配於或可適配於在該紡織機的預期操作期間穿過該第一開口區段（25）的一紗線（F）的厚度（sF），以及其中該紗線穿線開口（24）形成一第二開口區段（26），該第二開口區段從該第一開口區段（25）延伸至該清紗機區段（20）的邊緣，以便將該紗線（F）插入該第一開口區段（25）中，其中該第二開口區段（26）具有一第二槽縫寬度（b&lt;sub&gt;2&lt;/sub&gt;），當沿一紗線穿線方向（X）觀察該清紗機區段（20）時，該第二槽縫寬度在該第二開口區段（26）的長度上變化，其特徵在於：該第二開口區段（26）的該第二槽縫寬度（b&lt;sub&gt;2&lt;/sub&gt;）在形成於該基部（18）上的一舌狀突起（28）的一自由端區域中係最小值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a knot catcher (9) for textile machines, in particular for knitting machines, comprising a base part (18) which is produced from a sheet metal blank of uniform sheet thickness (s) and which forms a fastening section (19) and a knot catcher section (20), wherein the knot catcher section (20) has a thread feed-through opening (24) which is accessible at the edge and is formed in the manner of a slot, wherein the thread feed-through opening (24) comprises at its end a first opening section (25) extending in particular in a straight line and having a first slot width (b&lt;sub&gt;1&lt;/sub&gt;) which is constant over the length of the first opening section (25) and which, looking at the knot catcher section (20) in a thread feed-through direction (X), is adapted or adaptable to the thickness (sF) of a thread (F) passing through the first opening section (25) during the intended operation of the textile machine, and wherein the thread feed-through opening (24) forms a second opening section (26) which extends from the first opening section (25) to the edge of the knot catcher section (20) in order to insert the thread (F) into the first opening section (25), wherein the second opening section (26), has a second slit width (b&lt;sub&gt;2&lt;/sub&gt;) which, looking at the knot catcher section (20) in a thread feed-through direction (X), changes over the length of the second opening section (26), characterized in that the second slit width (b&lt;sub&gt;2&lt;/sub&gt;) of the second opening section (26) is minimal in the region of a free end of a tongue-like projection (28) formed on the base part (18).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:送紗裝置</p>  
        <p type="p">2:支撐單元</p>  
        <p type="p">3:固定夾具</p>  
        <p type="p">4:送紗輪</p>  
        <p type="p">5:軸</p>  
        <p type="p">6:皮帶輪</p>  
        <p type="p">7:把手</p>  
        <p type="p">8:入紗眼</p>  
        <p type="p">9:清紗機</p>  
        <p type="p">10:紗線煞車</p>  
        <p type="p">11:入紗感測器</p>  
        <p type="p">12:支撐臂</p>  
        <p type="p">13:第一殼體部</p>  
        <p type="p">14:第二殼體部</p>  
        <p type="p">15:輸出元件</p>  
        <p type="p">16:出紗元件</p>  
        <p type="p">17:出紗感測器</p>  
        <p type="p">F:紗線</p>  
        <p type="p">X:紗線穿線方向</p>  
        <p type="p">sF:紗線厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1437" publication-number="202626161"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626161.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種模組化遊戲裝置</chinese-title>  
        <english-title>MODULAR GAME DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251104B">A63F13/23</main-classification>  
        <further-classification edition="201401120251104B">A63F13/24</further-classification>  
        <further-classification edition="201401120251104B">A63F13/98</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭明仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, MING-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及遊戲手柄技術領域，更具體地說，涉及一種模組化遊戲裝置。本發明提供了一種模組化遊戲裝置，包括：一個固定底座，所述固定底座至少配備一個卡槽；至少一個可更換的遊戲外設模組，每個所述遊戲外設模組的底部至少配備一個卡盤；其中，所述卡盤透過旋轉方式與卡槽配合固定，以實現所述遊戲外設模組與固定底座的連接。本發明提供的模組化遊戲裝置，透過模組化設計、通用接口和自動辨別功能，實現了遊戲外設模組的快速拆卸和替換，極大提高了設備的靈活性和兼容性，提升了用戶的使用體驗和外設設備的擴展性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the field of game controller technology, and more particularly, to a modular game device. The present invention provides a modular game device including a fixed chassis, the fixed chassis being equipped with at least one card slot; at least one replaceable game peripheral module, each of the game peripheral modules being equipped with at least one cartridge at the bottom; wherein the cartridge is fixed in cooperation with the card slot by rotation to achieve connection between the game peripheral module and the fixed chassis. The modular game device provided by the present invention, through modular design, universal interface and automatic identification function, realizes the fast disassembly and replacement of the game peripheral module, greatly improving the flexibility and compatibility of the device, and enhancing the user experience and the scalability of the peripheral device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11,12,13,14,15,16,17,18,19:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1438" publication-number="202626245"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626245.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131762</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>助焊劑組合物、連接構造體及連接構造體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B23K35/26</main-classification>  
        <further-classification edition="200601120260318B">B23K35/363</further-classification>  
        <further-classification edition="202601120260318B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保井秀文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUI, HIDEFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野元颯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMOTO, HAYATE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下清人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, KIYOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可提高所獲得之連接構造體之冷熱循環耐性之助焊劑組合物。 &lt;br/&gt;本發明之助焊劑組合物係包含環氧化合物、酸酐、二官能酚化合物、及硬化促進劑之助焊劑組合物，且上述助焊劑組合物100重量%中，上述酸酐之含量為5.0重量%以上32.0重量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1439" publication-number="202626714"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626714.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131796</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＤ７３抗體、偶聯物和使用方法</chinese-title>  
        <english-title>ANTI-CD73 ANTIBODIES, CONJUGATES, AND METHODS OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07F9/6587</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商衛材Ｒ&amp;Ｄ企管股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EISAI R&amp;D MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史彼戴爾　傑瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPIDEL, JARED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井謙三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, KENZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古内惠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUUCHI, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾本　厄爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBONE, EARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鏑木洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABURAGI, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　大式</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAE-SHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山根義伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANE, YOSHINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了結合CD73的抗體、抗原結合片段及其偶聯物（例如，抗體-藥物偶聯物）。本揭露進一步關於用於藉由投與本文提供的組成物來治療例如癌症的方法和組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Antibodies, antigen-binding fragments, and conjugates (&lt;i&gt;e.g.&lt;/i&gt;, antibody-drug conjugates) thereof that bind CD73 are disclosed. The disclosure further relates to methods and compositions for use in the treatment of, &lt;i&gt;e.g.&lt;/i&gt;, cancer by administering the compositions provided herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1440" publication-number="202628645"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628645.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251203B">H10D62/10</main-classification>  
        <further-classification edition="202501120251203B">H10D62/80</further-classification>  
        <further-classification edition="202501120251203B">H10D64/20</further-classification>  
        <further-classification edition="202501120251203B">H10D84/80</further-classification>  
        <further-classification edition="200601120251203B">B82B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安素榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, SOYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具奉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUH, BONGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李商文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANGMOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種示例性積體電路裝置，其包括：一主動區，其在一基體上在一第一水平方向上延伸；一通道層，其配置於該主動區上以在一豎直方向上隔開且在該第一水平方向上延伸；一閘極線，其在該主動區上在與該第一水平方向相交之一第二水平方向上延伸且環繞該通道層；一源極/汲極區，其配置於該主動區上與該通道層接觸；以及氧化物層，其配置於該通道層與該閘極線之間。該通道層包含過渡金屬二硫族化物(TMD)，且該氧化物層包含高介電常數(高k)氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example integrated circuit device includes an active region extending in a first horizontal direction on a substrate, a channel layer arranged on the active region to be apart in a vertical direction and extending in the first horizontal direction, a gate line extending in a second horizontal direction intersecting the first horizontal direction on the active region and surrounding the channel layer, a source/drain region arranged on the active region in contact with the channel layer, and an oxide layer arranged between the channel layer and the gate line. The channel layer comprises transition metal dichalcogenides (TMD), and the oxide layer comprises high dielectric constant (high-k) oxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路裝置</p>  
        <p type="p">130:源極/汲極區</p>  
        <p type="p">160:閘極線</p>  
        <p type="p">CA:源極/汲極接點</p>  
        <p type="p">F1:主動區</p>  
        <p type="p">NSS:奈米片堆疊</p>  
        <p type="p">X,Y,Z:方向</p>  
        <p type="p">X1-X1',Y1-Y1',Y2-Y2':線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1441" publication-number="202627287"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627287.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於轉子引擎、壓縮機或泵的轉子定子組件，以及具有該組件的轉子引擎以及升降單元和裝置</chinese-title>  
        <english-title>ROTOR-STATOR ASSEMBLY FOR A ROTARY ENGINE, COMPRESSOR OR PUMP, A ROTARY ENGINE AND A LIFTING UNIT AND DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">F01C21/08</main-classification>  
        <further-classification edition="200601120260302B">F01C19/02</further-classification>  
        <further-classification edition="200601120260302B">F02B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃里尼　史塔西諾普盧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STASSINOPOULOU, EIRINI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃萊尼　史塔西諾普盧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STASSINOPOULOU, ELENI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬治　史塔西諾普洛斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STASSINOPOULOS, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於轉子引擎、壓縮機或泵的轉子-定子組件，包括佈置成在定子腔(1、2)中偏心旋轉的轉子(3、4)。轉子(3、4)的幾何形狀被配置成在轉子(3、4)的外周表面和定子腔(1、2)的內周壁之間的最接近區域提供第一流體密封，藉此第二流體密封由與轉子一起旋轉的部件(15)提供，該部件的一端通過軸承永久連接到定子腔(1，2)的內表面並沿著定子腔(1，2)的內表面滑動，該部件的另一端以可徑向移動的方式容納在轉子(3，4)的容座中，該第一和第二流體密封界定出定子腔(1、2)的第一腔室部分和第二腔室部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rotor-stator assembly for a rotary engine, compressor or pump, comprises a rotor (3, 4) arranged to rotate eccentrically in a stator chamber (1, 2), the geometry of the rotor (3, 4) being configured to provide a first fluid seal at a region of maximum proximity between the outer peripheral surface of the rotor (3, 4) and the inner peripheral wall of the stator chamber (1, 2), whereby a second fluid seal is provided by means of a component (15) rotating with the rotor, one end of which is permanently connected to the inner surface of the stator chamber (1, 2) by means of bearings and slides along the inner surface of the stator chamber (1, 2), and the other end of which is accommodated in a radially movable manner in a receptacle of the rotor (3, 4), the first and second fluid seals delimiting a first chamber portion and a second chamber portion of the stator chamber (1, 2).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:定子腔</p>  
        <p type="p">2:定子腔</p>  
        <p type="p">3:轉子</p>  
        <p type="p">4:轉子</p>  
        <p type="p">5:主軸</p>  
        <p type="p">6:滾子軸承</p>  
        <p type="p">7:閥盤</p>  
        <p type="p">8:開口</p>  
        <p type="p">11:開口</p>  
        <p type="p">12:開口</p>  
        <p type="p">16:偏心旋轉導軌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1442" publication-number="202628744"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628744.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝片、其製造方法以及具有樹脂組合物層的顯示器</chinese-title>  
        <english-title>SEALING SHEET, PRODUCING METHOD THEREOF, AND DISPLAY HAVING RESIN COMPOSITION LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10H29/854</main-classification>  
        <further-classification edition="202501120260302B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南方克哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAKATA, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松戸和規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDO, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山蕗夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, ROMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草野大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSANO, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種不易產生樹脂組合物層的端部的厚度不均或外觀不良、不易在凹部的底面或角部產生空隙的封裝片、其製造方法及使用所述封裝片的顯示器。一種封裝片，用於封裝在將光半導體作為光源的顯示器中使用的光半導體，所述封裝片包括第一膜、以及積層在所述第一膜的正上方的封裝層形成用的樹脂組合物層，在說明書中記載的條件下測定的所述第一膜的收縮率為1.2%以下，所述第一膜在將所述第一膜的拉伸模式下的150℃下的儲存彈性模量設為E'&lt;sub&gt;150&lt;/sub&gt;[×10&lt;sup&gt;8&lt;/sup&gt; Pa]、將所述第一膜的厚度設為T&lt;sub&gt;1&lt;/sub&gt;[μm］時，滿足&lt;img align="absmiddle" height="29px" width="217px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，所述第一膜與所述樹脂組合物層之間的剝離力P&lt;sub&gt;1&lt;/sub&gt;為8 mN/25 mm～150 mN/25 mm，所述第一膜的厚度T&lt;sub&gt;1&lt;/sub&gt;為20 μm～120 μm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:樹脂組合物層</p>  
        <p type="p">12:第一膜</p>  
        <p type="p">13:第二膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1443" publication-number="202627102"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627102.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用耳畸蛋白雙載體系統治療感覺神經性聽力損失之組合物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR TREATING SENSORINEURAL HEARING LOSS USING OTOFERLIN DUAL VECTOR SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N15/864</main-classification>  
        <further-classification edition="200601120260401B">C07K14/47</further-classification>  
        <further-classification edition="200601120260401B">A61K48/00</further-classification>  
        <further-classification edition="200601120260401B">A61P27/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商迪賽博治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECIBEL THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯恩斯　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURNS, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾莉絲　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELLIS, KATHRYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉勃遜　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBSON, TYLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴勒摩　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALERMO, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史汪達　馬汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWANDER, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輝頓　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITTON, JONATHON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙賓　利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SABIN, LEAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱拉梭斯　克里斯托斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYRATSOUS, CHRISTOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴蒙德　梅根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRUMMOND, MEGHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案之特徵在於藉助OTOF基因療法治療感覺神經性聽力損失及聽神經病變、尤其與耳畸蛋白(OTOF)突變相關之疾病形式之組合物及方法。本揭示案提供多種組合物，其包括含有編碼OTOF同功型5蛋白之N端部分之多核苷酸之第一核酸載體及含有編碼OTOF同功型5蛋白之C端部分之多核苷酸之第二核酸載體。該等載體可用於增加個體、例如患有感覺神經性聽力損失之人類個體中OTOF之表現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure features compositions and methods for the treatment of sensorineural hearing loss and auditory neuropathy, particularly forms of the disease that are associated with a mutation in otoferlin (OTOF), by way of OTOF gene therapy. The disclosure provides a variety of compositions that include a first nucleic acid vector that contains a polynucleotide encoding an N-terminal portion of an OTOF isoform 5 protein and a second nucleic acid vector that contains a polynucleotide encoding a C-terminal portion of an OTOF isoform 5 protein. These vectors can be used to increase the expression of OTOF in a subject, such as a human subject suffering from sensorineural hearing loss.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1444" publication-number="202628237"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628237.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層基板及天線模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">H01P3/00</main-classification>  
        <further-classification edition="200601120260323B">H05K3/46</further-classification>  
        <further-classification edition="201501120260323B">H01Q5/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上知倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TOMOMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田慎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可靠性高且發揮優異之傳送特性之多層基板及天線模組。 &lt;br/&gt;本技術之一形態之多層基板具備複數個導體層、及層間連接部。前述複數個導體層具有：具有共面線路之線路導體層、及與前述線路導體層相鄰之一對相鄰導體層。前述層間連接部具有將前述複數個導體層相互連接之複數個柱狀導體。前述多層基板以於前述共面線路之使用頻帶中抑制由在前述共面線路與前述一對相鄰導體層之間經由前述柱狀導體流通之前述返回電流所致之傳送損失之方式，構成返回電流之路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:共面線路</p>  
        <p type="p">12:導體層</p>  
        <p type="p">16:柱狀導體</p>  
        <p type="p">20:第1導體部</p>  
        <p type="p">21:連接墊</p>  
        <p type="p">22:開口部</p>  
        <p type="p">30:線路用柱狀導體</p>  
        <p type="p">31:連接用柱狀導體</p>  
        <p type="p">32:連結用柱狀導體</p>  
        <p type="p">100:多層基板</p>  
        <p type="p">L1:第1導體層/導體層/表層</p>  
        <p type="p">L2:第2導體層/導體層</p>  
        <p type="p">L3:第3導體層/導體層</p>  
        <p type="p">L4:第4導體層/導體層</p>  
        <p type="p">V1:內側柱狀導體</p>  
        <p type="p">V2:上側柱狀導體</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1445" publication-number="202628067"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628067.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示基板、顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G09G3/36</main-classification>  
        <further-classification edition="202301120260325B">H10K59/00</further-classification>  
        <further-classification edition="200601120260325B">G09F9/35</further-classification>  
        <further-classification edition="202501120260325B">H10D86/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商京東方科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商成都京東方光電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张元其</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUANQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>刘庭良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TINGLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐鹏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张玉欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露實施例提供一種顯示基板、顯示裝置。顯示基板包括位於顯示區域的多個子像素、多條數據線、多條第一信號線；與第一信號線電連接的第一信號提供線組，位於第一類邊框區域並延伸至第一邊框區域中的綁定區域；位於綁定區域的至少一個第一信號引腳組和至少一個積體電路引腳組，在第一方向上，至少一個第一信號引腳組位於至少一個積體電路引腳組的至少一側，第一信號引腳組與對應的第一信號提供線組位於至少一個積體電路引腳組的同一側，第一信號引腳組中的第一信號引腳設置為與對應的第一信號提供線組中的第一信號提供線電連接。本揭露實施例提供的技術方案，可以避免因顯示基板解決了因第一信號提供線電阻較大導致顯示區域存在橫紋的技術問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一扇出區</p>  
        <p type="p">12:彎折區</p>  
        <p type="p">13:第二扇出區</p>  
        <p type="p">14:綁定區域</p>  
        <p type="p">141:驅動晶片區</p>  
        <p type="p">142:第三扇出區</p>  
        <p type="p">143:綁定電極區</p>  
        <p type="p">201:引腳連接線</p>  
        <p type="p">42:第二柵極驅動電路信號線</p>  
        <p type="p">51:第一電源引腳</p>  
        <p type="p">52:第二電源引腳</p>  
        <p type="p">54:第一信號引腳組</p>  
        <p type="p">55:測試引腳組</p>  
        <p type="p">61:積體電路引腳組</p>  
        <p type="p">71:測試電路</p>  
        <p type="p">81:測試引線</p>  
        <p type="p">A1:第一區域</p>  
        <p type="p">A2:第二區域</p>  
        <p type="p">A3:第三區域</p>  
        <p type="p">B1:第一邊框區域</p>  
        <p type="p">C1-C1,C2-C2,C3-C3,C4-C4,C5-C5:位置</p>  
        <p type="p">DL1:第一數據連接線</p>  
        <p type="p">DL2:第二數據連接線</p>  
        <p type="p">DL3:第三數據連接線</p>  
        <p type="p">PL11:第一電源連接線</p>  
        <p type="p">PL12:第一電源連接結構</p>  
        <p type="p">PL21:第二電源連接線</p>  
        <p type="p">PL22:第二電源連接結構</p>  
        <p type="p">VDD0:第一電源信號提供線</p>  
        <p type="p">VL10:第一信號提供線組</p>  
        <p type="p">VL11:第一信號提供線</p>  
        <p type="p">Vinit0:初始信號提供線</p>  
        <p type="p">VSS0:第二電源信號提供線</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1446" publication-number="202626028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含羅替戈汀之貼附劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/381</main-classification>  
        <further-classification edition="200601120260401B">A61K9/70</further-classification>  
        <further-classification edition="200601120260401B">A61K47/04</further-classification>  
        <further-classification edition="200601120260401B">A61K47/14</further-classification>  
        <further-classification edition="200601120260401B">A61K47/22</further-classification>  
        <further-classification edition="200601120260401B">A61K47/32</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商久光製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISAMITSU PHARMACEUTICAL CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小泉尚央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIZUMI, NAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙木裕香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, YUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒川隆夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKAWA, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種含羅替戈汀之貼附劑，其具備支持體層及黏著劑層，且上述黏著劑層含有選自由羅替戈汀及羅替戈汀之藥學上所容許之鹽所組成之群中之至少1種、橡膠系黏著基劑及抗氧化劑，上述抗氧化劑包含沒食子酸丙酯、抗壞血酸棕櫚酸酯及焦亞硫酸鈉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1447" publication-number="202628815"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628815.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及蝕刻裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P50/00</main-classification>  
        <further-classification edition="202601120260316B">H10P95/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉本蕗人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURAMOTO, FUKITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋信博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, NOBUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今村健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAMURA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為一邊抑制形成於基板的背面的含矽膜的蝕刻，一邊蝕刻形成於該基板的表面的氧化矽膜。 &lt;br/&gt;本揭露之蝕刻方法係包含下述工序：反覆由第1工序與第2工序所構成的循環，該第1工序係向會收容分別在表面形成有氧化矽膜且在背面形成有含矽膜的基板的處理容器內供應處理氣體，以生成該氧化矽膜與該處理氣體的反應生成物，該第2工序係在已停止向該處理容器內供應該處理氣體的狀態下對該處理容器內進行排氣以去除該反應生成物；以及使各該循環中的第1次循環中的第1工序在與後續的循環中的第1工序不同的處理條件下進行，以去除該含矽膜被氧化而形成的氧化層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1448" publication-number="202626089"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626089.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由阻斷ＩＬ－１３和ＴＳＬＰ治療高風險氣喘</chinese-title>  
        <english-title>TREATMENT OF HIGH-RISK ASTHMA BY BLOCKING IL-13 AND TSLP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">C07K16/24</further-classification>  
        <further-classification edition="200601120260401B">A61P11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈汀　梅根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARDIN, MEGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬利　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALEY, JASON H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史陶丁格　赫里伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAUDINGER, HERIBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇拉特　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURATT, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了用於在治療具有氣喘加重的高風險的輕度至中度氣喘中使用的化合物，其中所述化合物結合細胞激素IL-13和TSLP。根據特定生物標誌物，特別是吐氣一氧化氮（FeNO）位準升高和血液中嗜酸性球計數升高來評估氣喘加重的高風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides compounds for use in the treatment of mild-to-moderate asthma with a high risk of asthma exacerbations, wherein said compounds binds bind the cytokines IL-13 and TSLP. High risk of asthma exacerbations is assessed according to specific biomarkers, in particular elevated levels of fractional exhaled nitric oxide (FeNO) and an elevated eosinophil count in blood.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1449" publication-number="202627803"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627803.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種根因定位方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G06F11/07</main-classification>  
        <further-classification edition="200601120251001B">G06F11/30</further-classification>  
        <further-classification edition="202301120251001B">G06F18/22</further-classification>  
        <further-classification edition="202301120251001B">G06F18/27</further-classification>  
        <further-classification edition="202301320251001B">G06F123/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟仲宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAI, ZHONGXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供了一種根因定位方法及裝置，可應用於電腦技術領域，在該根因定位方法中，針對獲得的告警維度集合中的每個告警維度，分別執行以下操作：獲取一個告警維度下的多個影響因素，將多個影響因素作為整體集合，將多個影響因素進行組合，獲得多個因素子集；獲取整體集合的預測值和實際值之間的第一變化程度，以及每個因素子集的預測值和實際值之間的第二變化程度；基於多個因素子集的第二變化程度，分別與第一變化程度之間的相似程度，從多個因素子集中選取一個告警維度的候選根因子集；在多個告警維度的候選根因子集構建的搜索空間中進行搜索，獲得多個告警維度的目標根因組合，實現了對異常根因的快速定位，提高根因定位的準確性和時效性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201-203:步驟</p>  
        <p type="p">2021-2023:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1450" publication-number="202626795"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626795.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>供薄膜自組裝應用之具備新穎架構之新的富含碳與矽之高chi嵌段共聚物</chinese-title>  
        <english-title>CARBON AND SILICONE ENRICHED NEW HIGH-CHI BLOCK COPOLYMERS OF NOVEL ARCHITECTURES FOR THIN-FILM SELF-ASSEMBLY APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F212/08</main-classification>  
        <further-classification edition="200601120260401B">C08F212/32</further-classification>  
        <further-classification edition="200601120260401B">C08F293/00</further-classification>  
        <further-classification edition="200601120260401B">C08F297/00</further-classification>  
        <further-classification edition="200601120260401B">C08F297/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴卡朗　杜拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASKARAN, DURAIRAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達曼加覃　迪佩克　凡須奴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DHARMANGADAN, DEEPAK VISHNU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包巴德　薩欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOBADE, SACHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕達卡姆里　哥文達雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATAKAMURI, GOVINDAIAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙雷亞爾　維多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONREAL, VICTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉普朗　達芙雅　基茲姆里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARAPPURAM, DIVYA KIZHMURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜南谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, NAMGOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG-OOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種結構(I)嵌段共聚物，其包含藉由陰離子聚合製備之第一共聚物嵌段鏈段A、藉由金屬催化之開環聚合製備之第二聚合物嵌段鏈段B、介於該第一共聚物嵌段鏈段A與該第二聚合物嵌段鏈段B之間的連接部分Z，及第一及第二端基E&lt;sub&gt;1&lt;/sub&gt;及E&lt;sub&gt;2&lt;/sub&gt;。本發明亦描述包含該結構(I)共聚物之組合物及於微影方法中使用該組合物，該等微影方法採用自組裝或定向自組裝(DSA)來製造IC裝置。 &lt;br/&gt;&lt;img align="absmiddle" height="51px" width="188px" file="ed10407.JPG" alt="ed10407.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; </p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described is a block copolymer of structure (I) comprising a first copolymer block segment A prepared by anionic polymerization, a second polymer block segments B, prepared by metal catalyzed ring opening polymerization, a linking moiety Z between said first copolymer block segment A, and said second polymer block segment B, and a first and second end groups E&lt;sub&gt;1&lt;/sub&gt; and E&lt;sub&gt;2&lt;/sub&gt;. Also described is a composition comprised the copolymer of structure (I) and using said composition in lithographic processes which employ self-assembly or directed self-assembly (DSA) in the manufacture of IC devices. &lt;br/&gt;&lt;img align="absmiddle" height="30px" width="112px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt; (I)</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1451" publication-number="202628374"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628374.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其控制方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H03M1/12</main-classification>  
        <further-classification edition="200601120260318B">H03M1/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商瑞薩電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯塚洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIZUKA, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森下玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISHITA, FUKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭示內容之半導體裝置包含複數取樣保持(sample-and-hold)電路，其在不同時序對類比輸入訊號之電壓取樣，並分別將其保持為複數輸入電壓；斜坡訊號產生電路，其產生斜坡訊號，該斜坡訊號之電位呈線性變化；計數器，其觸發斜坡訊號之線性變化的開始，並執行計數操作；複數AD轉換電路，其在複數輸入電壓之各者與斜坡訊號之電壓匹配之時點，將計數器之計數值作為對應於複數輸入電壓之複數數位訊號而輸出；以及控制電路，其根據計數器之計數值控制斜坡訊號之線性變化的斜率及計數器之計數值的變化量。複數數位訊號係作為輸入訊號的AD轉換結果而輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device according to the present disclosure includes a plurality of sample-and-hold circuits that sample voltages of an analog input signal at different timings and respectively hold them as a plurality of input voltages, a ramp signal generation circuit that generates a ramp signal whose potential changes linearly, a counter that triggers a start of the linear change in the ramp signal and perform a counting operation, a plurality of AD conversion circuits that output a count value of the counter at a timing where each of the plurality of input voltages matches the voltage of the ramp signal as a plurality of digital signals corresponding to the plurality of input voltages, and a control circuit that controls a slope of the linear change in the ramp signal and the amount of change in the count value of the counter according to the count value of the counter. The plurality of digital signals are output as a result of AD conversion of the input signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">11_1:AD轉換器</p>  
        <p type="p">11_2:AD轉換器</p>  
        <p type="p">11_m:AD轉換器</p>  
        <p type="p">12:斜坡訊號產生電路</p>  
        <p type="p">13:計數器</p>  
        <p type="p">14:控制電路</p>  
        <p type="p">15:暫存器</p>  
        <p type="p">Ci:數位碼</p>  
        <p type="p">Cs:數位碼</p>  
        <p type="p">IN1:輸入訊號</p>  
        <p type="p">IN2:輸入訊號</p>  
        <p type="p">INm:輸入訊號</p>  
        <p type="p">OUT1:AD轉換結果</p>  
        <p type="p">OUT2:AD轉換結果</p>  
        <p type="p">OUTm:AD轉換結果</p>  
        <p type="p">RS:斜坡訊號</p>  
        <p type="p">CNT:計數值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1452" publication-number="202628551"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628551.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁波屏蔽材、被覆材或外裝材及電氣、電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">H05K9/00</main-classification>  
        <further-classification edition="200601120260224B">B32B15/08</further-classification>  
        <further-classification edition="201901120260224B">B32B7/022</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＸ金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JX ADVANCED METALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石黒涼介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIGURO, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種成形性良好之電磁波屏蔽材。本發明係一種電磁波屏蔽材，其具備第1金屬層、第2金屬層、及設置於第1金屬層與第2金屬層之間的應力緩和層，且應力緩和層包含金屬層及/或樹脂層，應力緩和層之斷裂伸長率（%）相對於最大應力（MPa）之值為0.600以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1453" publication-number="202626649"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626649.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、膜、光學濾光器、固體攝像元件、圖像顯示裝置、紅外線感測器、相機模組及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C07D487/04</main-classification>  
        <further-classification edition="200601120260327B">C07D519/00</further-classification>  
        <further-classification edition="200601120260327B">C07F5/02</further-classification>  
        <further-classification edition="200601120260327B">C09B23/04</further-classification>  
        <further-classification edition="200601120260327B">C09B57/00</further-classification>  
        <further-classification edition="200601120260327B">C09B67/20</further-classification>  
        <further-classification edition="200601120260327B">G02B5/20</further-classification>  
        <further-classification edition="200601120260327B">G02B5/22</further-classification>  
        <further-classification edition="202301120260327B">H10K30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西信哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, NOBUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八木一成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGI, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組成物，其包含色材、硬化性化合物及溶劑，上述色材包含由式（1）表示之化合物。本發明亦提供一種使用前述之組成物之膜、光學濾光器、固體攝像元件、圖像顯示裝置、紅外線感測器及相機模組。 &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="361px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:固體攝像元件</p>  
        <p type="p">111:紅外線截止濾波器</p>  
        <p type="p">112:濾色器</p>  
        <p type="p">114:紅外線透射濾波器</p>  
        <p type="p">115:微透鏡</p>  
        <p type="p">116:平坦化層</p>  
        <p type="p">hν:入射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1454" publication-number="202627585"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627585.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132016</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260331B">G02B7/02</main-classification>  
        <further-classification edition="200601120260331B">G02B13/18</further-classification>  
        <further-classification edition="202101120260331B">G03B17/00</further-classification>  
        <further-classification edition="202101120260331B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電(廈門)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王福寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FUBAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉傳澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, CHUANZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，包括一外罩、一鏡筒及設置在鏡筒內的多個透鏡。其中，外罩呈圓錐狀且透光率小於10%，設置於鏡筒的前端部的外表面。鏡筒的前端部具有垂直於光軸且位於一參考平面上的一鏡筒環形平面。膠體設置在外罩與鏡筒之間，膠體在小於90℃時為固體，再次加熱至50~75℃時為軟化狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens includes an outer cover, a lens barrel, a colloid, and a plurality of lens elements arranged in the lens barrel is provided. The outer cover is cone-shaped and has a light transmittance of less than 10%, and is disposed on an outer surface of the front end part of the lens barrel. The front end of the lens barrel has an annular lens barrel surface perpendicular to the optical axis and located on a reference plane. The colloid is disposed between the outer cover and the lens barrel. The colloid is solid at temperatures below 90°C and softens when heated again to 50-75°C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">99:成像面</p>  
        <p type="p">100:光學成像鏡頭</p>  
        <p type="p">110:外罩</p>  
        <p type="p">120:鏡筒</p>  
        <p type="p">122:前端部</p>  
        <p type="p">124:後端部</p>  
        <p type="p">130:感壓膠</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">B:夾角</p>  
        <p type="p">D1,D2,Dinmax,Dinmin:內徑</p>  
        <p type="p">Dcvon,Dcvox,Dcv,Dbr:外徑</p>  
        <p type="p">D3,D4:長度</p>  
        <p type="p">Tcv:厚度</p>  
        <p type="p">Wbr:寬度</p>  
        <p type="p">E:參考平面</p>  
        <p type="p">I:光軸</p>  
        <p type="p">L:透鏡</p>  
        <p type="p">O11:外罩物側開孔</p>  
        <p type="p">O12:外罩像側開孔</p>  
        <p type="p">O21:鏡筒物側開孔</p>  
        <p type="p">O22:鏡筒像側開孔</p>  
        <p type="p">S11:外罩環形平面</p>  
        <p type="p">S12:內環圓錐面</p>  
        <p type="p">S13:外罩圓錐面</p>  
        <p type="p">S21:鏡筒環形平面</p>  
        <p type="p">S22:外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1455" publication-number="202627677"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627677.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以非恆定曝光速度進行的雷射寫入</chinese-title>  
        <english-title>LASER WRITING WITH A NON-CONSTANT EXPOSURE VELOCITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G03F7/00</main-classification>  
        <further-classification edition="200601120260316B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商麥可尼克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYCRONIC AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛林托夫特　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLIMTOFT, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦爾特　喬納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTHER, JONAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中揭示一種用於控制一雷射寫入器(100)之方法，其包括：使一列印頭(102)在一掃描方向(X)上相對於一列印基板(104)移動，其中該列印頭(102)之該移動具有一非恆定速度剖面；及引導一或多個雷射束(106)通過一空間光調變器SLM (108)且朝向該列印基板(104)。該方法包括根據對應於該列印頭(102)相對於該列印基板(104)之預定位置之一或多個位置觸發器來控制經引導通過該SLM (108)之該一或多個雷射束(106)之強度，使得當該列印頭(102)處於該列印基板(104)上之一位置時，該SLM (108)採用對應於待列印於該列印基板(104)上之該位置處之一列印圖案之一SLM陣列圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is disclosed herein a method for controlling a laser writer (100), comprising moving a printing head (102) in a scan direction (X) relative to a printing substrate (104), wherein the movement of the printing head (102) has a non-constant velocity profile, and directing one or more laser beams (106) through a spatial light modulator, SLM (108), and towards the printing substrate (104). The method comprises controlling the intensity of the one or more laser beams (106) directed through the SLM (108) according to one or more position triggers corresponding to predetermined positions of the printing head (102) relative to the printing substrate (104), such that the SLM (108) adopts an SLM array pattern corresponding to a printing pattern to be printed at a location on the printed substrate (104) when the printing head (102) is at said location on the printed substrate (104).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷射寫入器</p>  
        <p type="p">102:列印頭</p>  
        <p type="p">104:列印基板</p>  
        <p type="p">104a:光阻劑層</p>  
        <p type="p">104b:基底層</p>  
        <p type="p">106:雷射束</p>  
        <p type="p">108:空間光調變器(SLM)</p>  
        <p type="p">P&lt;sub&gt;E&lt;/sub&gt;:曝光像素</p>  
        <p type="p">P&lt;sub&gt;U&lt;/sub&gt;:未曝光像素</p>  
        <p type="p">V&lt;sub&gt;X&lt;/sub&gt;:速度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1456" publication-number="202627023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應性熱熔黏著劑組合物及其用途</chinese-title>  
        <english-title>REACTIVE HOT-MELT ADHESIVE COMPOSITION AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C09J175/06</main-classification>  
        <further-classification edition="200601120260325B">C08G18/72</further-classification>  
        <further-classification edition="200601120260325B">C09J4/04</further-classification>  
        <further-classification edition="200601120260325B">C07F7/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢高股份有限及兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>褚慧敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, HUIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種反應性熱熔黏著劑組合物、該組合物之固化產物、包含該固化組合物之物件、及該組合物之用途。該組合物含有PVAc及PU但不存在相容性問題，展現對難黏結(hard-to-bond)基板之高黏結強度及良好生坯強度，尤其是在Al基板及PET膜之黏結中、具有操作期間之良好黏度穩定性及熔融狀態下之適宜施覆黏度、及/或展現適宜開放時間及快速固化速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided in the present disclosure are a reactive hot-melt adhesive composition, a cured product of the composition, an article comprising the cured composition, and use of the composition. The composition contains PVAc and PU but without compatibility issue, exhibits high bonding strength and good green strength to hard-to-bond substrates, especially in the bonding of Al substrates and PET films, has good viscosity stability during operation and a suitably applicable viscosity in the molten state, and/or exhibits a suitable open time and a fast-curing speed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1457" publication-number="202627190"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627190.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直電漿源</chinese-title>  
        <english-title>VERTICAL PLASMA SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C23C16/513</main-classification>  
        <further-classification edition="200601120260319B">H05H1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇布拉馬尼　阿南塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUBRAMANI, ANANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉　卡羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERA, KALLOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法澤利　席德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAZELI, SEYYED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩胡　魯帕利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHU, RUPALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例包括電漿源，電漿源包含接地電極，接地電極包括複數個接地電極部分。電漿源還包括功率電極，功率電極包含複數個功率電極部分。功率電極部分中一些者與接地電極部分中一些者交錯排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein include a plasma source including a ground electrode including a plurality of ground electrode portions. The plasma source also includes a power electrode including a plurality of power electrode portions. Ones of the power electrode portions are interleaved with ones of the ground electrode portions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:圓形垂直電漿源</p>  
        <p type="p">202:拆解部分</p>  
        <p type="p">204:同心圓形感測器溝槽</p>  
        <p type="p">206:外殼</p>  
        <p type="p">208:RF熱電極</p>  
        <p type="p">210:RF接地(GND)電極</p>  
        <p type="p">212:電漿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1458" publication-number="202628933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經由基板接觸表面區域密度之局部增加的改良之晶圓溫度均勻性</chinese-title>  
        <english-title>IMPROVED WAFER TEMPERATURE UNIFORMITY VIA LOCALIZED INCREASE IN SUBSTRATE CONTACT SURFACE AREA DENSITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P72/76</main-classification>  
        <further-classification edition="202601120260324B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞義軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YIXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙姆龍　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMULON, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉賽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩雷斯　阿里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEREZ, ARIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬堤育斯金　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATYUSHKIN, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於在處理腔室中支撐基板的基板支撐件包括：主體，其包含密封帶，其中該密封帶配置成接觸基板且定義密封帶區域；第一平台(mesa)，其從主體向上延伸並配置成接觸基板；以及第二平台，其從主體在密封帶區域內向上延伸並配置成接觸基板。第二平台具有比第一平台更高的接觸表面區域密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate support to support a substrate in a processing chamber includes: a body including seal bands, where the seal bands are configured to contact the substrate and define a seal band area; first mesas extending upward from the body and configured to contact the substrate; and second mesas extending upward from the body in the seal band area and configured to contact the substrate. The second mesas have a higher contact surface area density than the first mesas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:基板</p>  
        <p type="p">202:基板支撐</p>  
        <p type="p">204:部分</p>  
        <p type="p">208:平台</p>  
        <p type="p">210:密封帶區域</p>  
        <p type="p">212:平台</p>  
        <p type="p">220:主體</p>  
        <p type="p">222:密封帶</p>  
        <p type="p">224:密封帶</p>  
        <p type="p">226:平面側</p>  
        <p type="p">228:邊緣</p>  
        <p type="p">230:平台</p>  
        <p type="p">240:冷卻槽</p>  
        <p type="p">D1-D3:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1459" publication-number="202626107"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626107.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗Ｂ７Ｈ３抗體藥物複合體用於治療癌症的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4745</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商蘇州宜聯生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDILINK THERAPEUTICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛彤彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, TONGTONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦　续科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, XUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>连炜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　家强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, JIAQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種治療癌症的方法，包括向有需要的受試者在每個給藥週期內單次或雙次施用治療有效量的抗B7H3抗體藥物複合體，基於合適的給藥週期，給藥劑量和給藥間隔充分發揮抗B7H3抗體藥物複合體的治療作用，從而提高用藥的安全性和患者的用藥順應性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1460" publication-number="202626108"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626108.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗Ｂ７Ｈ３抗體藥物複合體在製備小細胞肺癌（ＳＣＬＣ）藥物中的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4745</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商蘇州宜聯生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDILINK THERAPEUTICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛彤彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, TONGTONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦　续科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, XUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　家强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, JIAQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露屬於醫藥技術領域。具體而言，本發明涉及抗B7H3抗體藥物複合體、其藥學上可接受的鹽、立體異構體或代謝物或者前述各項的溶劑化物，以及用於治療一線治療後進展或復發的局限期或廣泛期小細胞肺癌（SCLC）的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1461" publication-number="202626354"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626354.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經組態以用於回應於人頭模型衝擊而使玻璃基板脫層的具有黏著層之玻璃製品</chinese-title>  
        <english-title>GLASS ARTICLE WITH ADHESIVE LAYER CONFIGURED FOR DELAMINATION OF GLASS SUBSTRATE IN RESPONSE TO HEADFORM IMPACT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">B32B17/10</main-classification>  
        <further-classification edition="200601120260319B">B32B7/12</further-classification>  
        <further-classification edition="200601120260319B">C09J133/00</further-classification>  
        <further-classification edition="200601120260319B">C09J163/00</further-classification>  
        <further-classification edition="200601120260319B">C09J175/04</further-classification>  
        <further-classification edition="202401120260319B">B60K35/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克　馬修李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLACK, MATTHEW LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉柏森三世　雷蓋吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBSON III, RAY GAGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼克博克　沃泰森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNICKERBOCKER, WARD TYSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊歐恩　卡利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAYOUN, KHALED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆魯　帕維塔特賈斯維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURRU, PAVITRA TEJASWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫羅許　尤瑟夫凱德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QAROUSH, YOUSEF KAYED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種玻璃製品之實施例。該玻璃製品包括一玻璃基板，該玻璃基板具有一第一主表面及一第二主表面。該第二主表面與該第一主表面相對。該玻璃製品亦包括：一框架，其具有一框架表面；及一黏著結構，其安置於該玻璃基板與該框架之間，將該玻璃基板黏合至該框架。在根據FMVSS 201用一人頭模型進行衝擊之後，該玻璃基板至少部分地自該黏著結構脫層，且該玻璃基板不會跨該第一主表面或該第二主表面斷裂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are embodiments of a glass article. The glass article includes a glass substrate having a first major surface and a second major surface. The second major surface is opposite to the first major surface. The glass article also includes a frame with a frame surface and an adhesive structure disposed between the glass substrate and the frame that bonds the glass substrate to the frame. After impact with a headform according to FMVSS 201, the glass substrate at least partially delaminates from the adhesive structure and the glass substrate does not break across the first major surface or the second major surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:玻璃物品</p>  
        <p type="p">102:玻璃基板</p>  
        <p type="p">104:第一主表面</p>  
        <p type="p">106:第二主表面</p>  
        <p type="p">108:次表面</p>  
        <p type="p">110:框架</p>  
        <p type="p">112:框架表面</p>  
        <p type="p">114:黏著結構</p>  
        <p type="p">116:第一黏著層</p>  
        <p type="p">118:聚合物支撐件</p>  
        <p type="p">120:第二黏著層</p>  
        <p type="p">122:第一支撐表面</p>  
        <p type="p">124:第二支撐表面</p>  
        <p type="p">t:參數/厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1462" publication-number="202626317"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626317.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離系統及分離方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B29B17/02</main-classification>  
        <further-classification edition="200601120260401B">C08J11/08</further-classification>  
        <further-classification edition="200601120260401B">C08J11/24</further-classification>  
        <further-classification edition="200601120260401B">B03D1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松原亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBARA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮田恭行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATA, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>源田稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENTA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤基文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, MOTOFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係將雜質適當地分離。本發明之分離系統具備：貯存部，其貯存包含聚酯溶液及雜質之溶解液，上述聚酯溶液係於源自羧酸之單體中溶解有聚酯者，上述雜質係除聚酯以外之成分；氣體供給部，其向貯存部內供給氣體，使溶解液中之雜質向上方移動；排出部，其排出貯存部內之雜質；及反應部，於其中導入已將雜質分離之聚酯溶液、及與聚酯反應之反應溶劑，使聚酯溶液中之聚酯解聚合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1463" publication-number="202628638"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628638.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過側壁摻雜之溝槽型超級接合結構</chinese-title>  
        <english-title>TRENCH-BASED SUPER JUNCTION STRUCTURES VIA SIDEWALL DOPING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10D62/00</main-classification>  
        <further-classification edition="202501120260316B">H10D64/00</further-classification>  
        <further-classification edition="202501120260316B">H10D64/27</further-classification>  
        <further-classification edition="202501120260316B">H10D30/60</further-classification>  
        <further-classification edition="202501120260316B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能本許　葉門哈森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOURBAKHSH, AMIRHASAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恰德席克　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUDZIK, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可藉由減少P型區域的寬度和增加摻雜濃度，同時提高整體裝置的高度來形成具有提高額定電壓的超級接合裝置。可為P型區域和相鄰的N型區域蝕刻出溝槽。如此可在維持可行的深寬比以填充溝槽的同時，提高整體裝置的高度。然後針對相對於溝槽剩餘寬度而言較薄的P型層，可透過對溝槽的側壁進行摻雜來形成P型材料。接著可用N型材料填充溝槽，使得P型區域填滿N型區域之間的空間，不留任何孔隙或接縫，同時擁有僅用傳統的蝕刻和填充方法無法實現的P型區域寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A super junction device with an increased voltage rating may be formed by decreasing the width of the P-type region and increasing the doping concentration, while also increasing the height of the overall device. A trench may be etched for both a P-type region and an adjacent N-type region. This allows the height of the overall device to be increased while maintaining a feasible aspect ratio to fill the trench. The P-type material may then be formed by doping the sidewalls of the trench for a P-type layer that is relatively thin compared to the remaining width of the trench. The trench may then be filled with N-type material such that the P-type region fills the space between the N-type regions without any voids or seams, while having a width that would be unattainable using traditional etch-and-fill methods for the P-type region alone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:結構</p>  
        <p type="p">402:閘極區域</p>  
        <p type="p">406:源區域</p>  
        <p type="p">408:第一N型區域</p>  
        <p type="p">412:第二N型區域</p>  
        <p type="p">416:其他N型區域</p>  
        <p type="p">424:高度</p>  
        <p type="p">426:基板</p>  
        <p type="p">451:P型區域</p>  
        <p type="p">453:溝槽</p>  
        <p type="p">454:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1464" publication-number="202626038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132067</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙網絡水凝膠及其製造與應用</chinese-title>  
        <english-title>DOUBLE NETWORK HYDROGEL AND PREPARATION AND APPLICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/4535</main-classification>  
        <further-classification edition="200601120260401B">A61K9/06</further-classification>  
        <further-classification edition="201701120260401B">A61K47/34</further-classification>  
        <further-classification edition="200601120260401B">A61K47/36</further-classification>  
        <further-classification edition="201701120260401B">A61K47/69</further-classification>  
        <further-classification edition="200601120260401B">A61L27/52</further-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史堤爾　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHTIL, MARIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯克斯　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROOKS, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥凱布　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCCABE, KEVIN P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種雙網絡水凝膠及其製備方法。具體而言，本揭露係關於用於眼用裝置之雙網絡水凝膠及其製備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a double network hydrogel and preparation methods thereof. In particular, the disclosure relates to double network hydrogel and preparation thereof for ophthalmic devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1465" publication-number="202626043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含交聯鹿角菜膠之可逆複合物的組成物及物品</chinese-title>  
        <english-title>COMPOSITIONS AND ARTICLES COMPRISING REVERSIBLE COMPLEXES OF CROSSLINKED CARRAGEENAN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/4709</main-classification>  
        <further-classification edition="200601120260401B">A61K31/35</further-classification>  
        <further-classification edition="200601120260401B">A61K31/495</further-classification>  
        <further-classification edition="200601120260401B">A61K31/454</further-classification>  
        <further-classification edition="200601120260401B">A61K47/36</further-classification>  
        <further-classification edition="201701120260401B">A61K47/69</further-classification>  
        <further-classification edition="200601120260401B">A61K9/06</further-classification>  
        <further-classification edition="200601120260401B">A61L27/52</further-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉斯基　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLASKY, AARON JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示包括交聯醫藥劑及鹿角菜膠之可逆複合物的組成物。具體而言，該等組成物包括交聯醫藥劑及鹿角菜膠之可逆複合物，其中該交聯醫藥劑充當交聯劑以形成該複合物。此等材料係適合用於眼用裝置及眼用組成物中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are compositions which include reversible complexes of crosslinking pharmaceutical agent and carrageenan. Particularly, the compositions include reversible complexes of crosslinking pharmaceutical agent and carrageenan where the crosslinking pharmaceutical agent acts as a crosslinking agent to form the complex. These materials are suitable for use in ophthalmic devices and ophthalmic compositions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1466" publication-number="202628162"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628162.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直立式安裝處理系統</chinese-title>  
        <english-title>VERTICALLY MOUNTED PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H01J37/20</main-classification>  
        <further-classification edition="200601120260317B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛溫　馬修　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GWINN, MATTHEW CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內格羅蒂　傑瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGROTTI, JERRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔索利　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONSOLI, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種處理晶圓的方法包含在設置於處理腔室中之翻轉組件上接收晶圓，該晶圓係以平行於處理腔室之底板的第一定向被接收，翻轉組件包含耦接至旋轉驅動部的旋轉桿。該方法更包含將晶圓從翻轉組件轉移至設置在處理腔室中的晶圓固持器，使得晶圓在處理腔室中沿著第二定向而設置，該第二定向與第一定向呈一角度，以及將第二定向上的晶圓暴露於材料通量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing a wafer includes receiving the wafer on a flip assembly disposed in a processing chamber, the wafer being received in a first orientation parallel to a floor of the processing chamber, the flip assembly including a rotary bar coupled to a rotary drive. The method further includes transferring the wafer from the flip assembly to a wafer holder disposed in the processing chamber such that the wafer is disposed along a second orientation in the processing chamber, the second orientation being angled to the first orientation, and exposing the wafer in the second orientation to a flux of material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:直立式安裝處理系統</p>  
        <p type="p">100:晶圓</p>  
        <p type="p">110:處理腔室</p>  
        <p type="p">112:翻轉組件</p>  
        <p type="p">120:掃描腔室</p>  
        <p type="p">122:第一旋轉驅動部</p>  
        <p type="p">124:第二旋轉驅動部</p>  
        <p type="p">125:第三桿連結件</p>  
        <p type="p">126:第四桿連結件</p>  
        <p type="p">127:第一桿連結件</p>  
        <p type="p">128:第二桿連結件</p>  
        <p type="p">129:掃描臂</p>  
        <p type="p">130:台座</p>  
        <p type="p">132:模組支架</p>  
        <p type="p">140:模組基部</p>  
        <p type="p">150:無塵室地板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1467" publication-number="202628163"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628163.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title>METHOD FOR SUBSTRATE PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H01J37/24</main-classification>  
        <further-classification edition="200601120260318B">H01J37/20</further-classification>  
        <further-classification edition="200601120260318B">H01J37/305</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商東京威力科創美國製造與工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼戈特　魯帕莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIGOTE, RUPALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪斯納　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEUSSNER, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板處理方法，該方法包含：利用處理束流(beam)或束狀流(flux)對於在處理腔室中設置的基板執行局部基板處理。該處理束流或束狀流係利用游離電流進行游離。在執行該局部基板處理時，測量該處理束流或束狀流的輸出電流。藉由將所測得的該輸出電流與該游離電流的乘積保持在所測得的該輸出電流與該游離電流的該乘積的設定點的公差內，從而控制該游離電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for substrate processing includes performing a local substrate process with a processing beam or flux on a substrate disposed in a process chamber. The processing beam or flux is ionized with an ionization current. An output current of the processing beam or flux is measured while performing the local substrate process. The ionization current for the local substrate process is controlled by keeping a product of the measured output current with the ionization current within a tolerance of a set point for the product of the measured output current with the ionization current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">1002,1004,1006:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1468" publication-number="202628824"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628824.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含矽邊緣區域的基於金屬之保護</chinese-title>  
        <english-title>METAL-BASED PROTECTION OF SILICON-CONTAINING EDGE REGION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P50/20</main-classification>  
        <further-classification edition="200601120260323B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列斐伏爾　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEFEVRE, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜拉吉恩　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAILLARGEON, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種保護基板的邊緣區域的方法包含接收基板至處理腔室中。該基板包含暴露的含矽邊緣區域(例如，晶圓基板的晶邊區域)，該暴露的含矽邊緣區域圍繞著在抗蝕劑層下方的內部區域。該方法更包含利用金屬鹵化物前驅物(例如，鎢鹵化物)處理該暴露的含矽邊緣區域及該抗蝕劑層，以將該暴露的含矽邊緣區域選擇性轉化為含金屬保護層(例如，包含金屬矽化物如鎢矽化物，和/或純金屬如鎢)。該含金屬保護層可配置以在後續處理，例如蝕刻處理(在此期間內部區域的暴露表面被蝕刻)保護基板的邊緣區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of protecting an edge region of a substrate includes receiving a substrate into a processing chamber. The substrate includes an exposed silicon-containing edge region (e.g., a bevel region of a wafer substrate) surrounding an interior region underlying a resist layer. The method further includes treating the exposed silicon-containing edge region and the resist layer with a metal halide precursor (such as a tungsten halide) to selectively convert the exposed silicon-containing edge region to a metal-containing protective layer (e.g., including a metal silicide such as tungsten silicide and/or a pure metal such as tungsten). The metal-containing protective layer may be configured to protect the edge region of the substrate during subsequent processing, such as an etch process during which exposed surfaces of the interior region are etched.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理</p>  
        <p type="p">103:轉化步驟</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:暴露邊緣區域</p>  
        <p type="p">112:含矽材料</p>  
        <p type="p">113:受保護邊緣區域</p>  
        <p type="p">114:抗蝕劑層</p>  
        <p type="p">115:受覆蓋內部區域</p>  
        <p type="p">120:含金屬保護層</p>  
        <p type="p">122:金屬鹵化物前驅物</p>  
        <p type="p">193:初始狀態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1469" publication-number="202626499"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626499.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傳熱片、半導體製造裝置、以及傳熱片的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260319B">C01B32/168</main-classification>  
        <further-classification edition="200601120260319B">C09K5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人静岡大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION SHIZUOKA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林義之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>照内怜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERUUCHI, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤功英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, KOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, YOKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種傳熱片，係配置於第一構件及第二構件之間，媒介第一構件及第二構件之間的熱交換。傳熱片係具備：複數個碳奈米管；及金屬膜。複數個碳奈米管，係沿著傳熱片的厚度方向而定向。金屬膜，係設置於各個碳奈米管的前端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:傳熱片</p>  
        <p type="p">102:CNT</p>  
        <p type="p">103:金屬膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1470" publication-number="202626759"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626759.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黑色分散液、紫外線硬化型黑色組成物、黑色硬化膜、彩色濾光片用黑色矩陣、彩色濾光片、隔牆材料、顯示裝置、固體攝像元件用遮光膜、固體攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F216/14</further-classification>  
        <further-classification edition="200601120260401B">C08F222/02</further-classification>  
        <further-classification edition="200601120260401B">C08K3/28</further-classification>  
        <further-classification edition="200601120260401B">C09D17/00</further-classification>  
        <further-classification edition="200601120260401B">C09D4/00</further-classification>  
        <further-classification edition="200601120260401B">G02B5/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/105</further-classification>  
        <further-classification edition="200601120260401B">G09F9/30</further-classification>  
        <further-classification edition="202501120260401B">H10F39/00</further-classification>  
        <further-classification edition="202501120260401B">H10F39/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料電子化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS ELECTRONIC CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新木啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAKI, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIBA, NAOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小見山昌三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMIYAMA, SHOZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>影山謙介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAGEYAMA, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤池寛人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAIKE, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本黑色分散液係含有溶媒、黑色顏料、及高分子分散劑，前述黑色顏料係包含氮化鋯，前述高分子分散劑係包含梳形聚合物，前述梳形聚合物係具有主鏈、結合於前述主鏈之第1末端之第1末端基、以及結合於前述主鏈之與前述第1末端相反側之第2末端之第2末端基，前述主鏈係具有：具有源自順丁烯二酸之結構或源自順丁烯二酸之縮合物之結構之第1重複單元、以及具有包含聚氧化乙烯結構之基之第2重複單元，前述第1末端基及前述第2末端基係分別為選自羧基及烷基中任一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1471" publication-number="202627171"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627171.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理工具用的擬碎形噴淋頭</chinese-title>  
        <english-title>PSEUDO-FRACTAL SHOWERHEAD FOR SUBSTRATE PROCESSING TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C23C16/455</main-classification>  
        <further-classification edition="200601120260318B">C23C16/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕蒂爾　拉維庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, RAVIKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍蘇爾　希瓦林格　高達　阿倫　庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSUR SHIVALINGE GOWDA, ARUN KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫巴沙德　沙青　阿拉馬普拉布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBASAD, SACHIN ALLAMAPRABHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕蒂爾　蘇尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, SUNEEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑟　卡爾　費德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEESER, KARL FREDERICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>為克拉曼　尼溫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIKRAMAN, NIVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迷思拉　謝卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISHRA, SHEKHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於基板處理工具的擬碎形噴淋頭包括用於接收處理氣體的氣體入口以及氣體分配結構。氣體分配結構包括設置於多個分層結構中的多個流道。氣體分配結構包括第一分層結構的流道，第二分層結構的流道，第二分層結構的流道依據擬碎形圖案從第一分層結構分支，以及連接第一分層結構以及第二分層結構的多個層間連接通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pseudo-fractal showerhead for a substrate processing tool includes a gas inlet to receive processing gas and a gas distribution structure. The gas distribution structure includes a plurality of flow channels arranged in a plurality of hierarchical layers. The gas distribution structure includes a first hierarchical layer of flow channels, a second hierarchical layer of flow channels branching from the first hierarchical layer according to a pseudo-fractal pattern, and a plurality of inter-layer connection channels connecting the first hierarchical layer to the second hierarchical layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400A:第一分層結構</p>  
        <p type="p">400B:第二分層結構</p>  
        <p type="p">400C:第三分層結構</p>  
        <p type="p">402:氣體入口</p>  
        <p type="p">404A:流道</p>  
        <p type="p">404B:流道</p>  
        <p type="p">406A:層間連接通道</p>  
        <p type="p">406B:層間連接通道</p>  
        <p type="p">408A:流道</p>  
        <p type="p">408B:流道</p>  
        <p type="p">408C:流道</p>  
        <p type="p">408D:流道</p>  
        <p type="p">410A:層間連接通道</p>  
        <p type="p">410B:層間連接通道</p>  
        <p type="p">412A:流道</p>  
        <p type="p">414A:層間連接通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1472" publication-number="202625900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乳質感提升之飲料及其製造方法、以及飲料之乳質感之提升方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A23C9/152</main-classification>  
        <further-classification edition="202101120260401B">A23L2/38</further-classification>  
        <further-classification edition="200601120260401B">A23L2/52</further-classification>  
        <further-classification edition="200601120260401B">A23F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商麒麟飲料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRIN BEVERAGE COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下亜希子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, AKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種含有乳成分及麥芽糖基海藻糖之飲料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1473" publication-number="202628974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>互連結構的形成方法</chinese-title>  
        <english-title>METHOD FOR FORMING INTERCONNECT STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10W20/00</main-classification>  
        <further-classification edition="202601120260317B">H10P50/28</further-classification>  
        <further-classification edition="202601120260317B">H10P14/40</further-classification>  
        <further-classification edition="202601120260317B">H10P50/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相澤宏一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIZAWA, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤凱鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KAI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種互連結構的形成方法包含使用沉積-蝕刻-沉積(DED)製程以釕填充穿過介電層的孔，在介電層上方形成釕層，以及以減法製程自釕層形成導電特徵部。採用DED製程的一或多個蝕刻步驟移除透過DED製程之沉積步驟沉積在介電層上方的孤立釕核。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming an interconnect structure includes filling a hole through a dielectric layer with ruthenium using a deposition-etch-deposition (DED) process, forming a ruthenium layer over the dielectric layer, and forming a conductive feature from the ruthenium layer with a subtractive process. One or more etch steps of the DED process remove isolated ruthenium nuclei deposited over the dielectric layer by deposition steps of the DED process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:導電特徵部</p>  
        <p type="p">106:底層</p>  
        <p type="p">108:第一介電層</p>  
        <p type="p">110:第一硬遮罩層</p>  
        <p type="p">112:第二介電層</p>  
        <p type="p">114:第二硬遮罩層</p>  
        <p type="p">116:開口</p>  
        <p type="p">120A:第一導電層</p>  
        <p type="p">120B:第二導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1474" publication-number="202628050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251210B">G09G3/3208</main-classification>  
        <further-classification edition="202301120251210B">H10K59/131</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李仁求</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, INGOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴世鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SEHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金杞彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李圭煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KYUHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括：基板，包括具有複數個子像素的複數個像素；發光區域，設置在該基板及該複數個子像素中的每個子像素上；以及配線，與該發光區域部分重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus comprises a substrate comprising a plurality of pixels having a plurality of subpixels; a light emission area provided on the substrate and each of the plurality of subpixels; and a wiring partially overlapping the light-emission area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:薄膜電晶體</p>  
        <p type="p">120:配線</p>  
        <p type="p">121:第一配線</p>  
        <p type="p">122:第二配線</p>  
        <p type="p">CA:電路區域</p>  
        <p type="p">DL:資料佈線</p>  
        <p type="p">DL1:第一資料佈線</p>  
        <p type="p">DL2:第二資料佈線</p>  
        <p type="p">DL3:第三資料佈線</p>  
        <p type="p">DL4:第四資料佈線</p>  
        <p type="p">EA:發光區域</p>  
        <p type="p">EVDD:像素電源佈線</p>  
        <p type="p">GL:閘極佈線</p>  
        <p type="p">NEA:非發光區域</p>  
        <p type="p">NEA1:第一非發光區域</p>  
        <p type="p">NEA2:第二非發光區域</p>  
        <p type="p">P:像素</p>  
        <p type="p">RL:參考佈線</p>  
        <p type="p">SP:子像素</p>  
        <p type="p">SP1:第一子像素、紅色子像素</p>  
        <p type="p">SP2:第二子像素、白色子像素</p>  
        <p type="p">SP3:第三子像素、藍色子像素</p>  
        <p type="p">SP4:第四子像素、綠色子像素</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Y:第一方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1475" publication-number="202626705"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626705.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎抗SEMA3A抗體及其用途</chinese-title>  
        <english-title>NOVEL ANTI-SEMA3A ANTIBODIES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/18</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P13/12</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商拜耳廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勳費爾德　多利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHONFELD, DORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德羅布納　卡洛琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DROBNER, KAROLINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威伯　恩斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEBER, ERNST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲拉斯基　凱薩琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FILARSKY, KATHARINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾林格　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELLINGER, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡利斯　艾瑟　菲奧娜拉　瑪麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCALEESE ESER, FIONNUALA MARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗拉姆　英格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAMME, INGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪德利奇　溫弗里德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUNDERLICH, WINFRIED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密特　安潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDT, ANTJE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽達加　亞爾達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEDAGHAT, YALDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　肯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUNG, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於結合於人類Sema3A之經分離之抗體或其抗原結合片段。根據本發明之經分離之抗體或抗原結合片段：i)以≤50 nM、≤20 nM、≤10 nM、≤1 nM或≤0.1 nM之解離常數(KD)結合於SEQ ID NO:600之序列之人類Sema3A；ii)與小鼠、食蟹獼猴、大鼠、豬及/或犬Sema3A交叉反應，特定言之，其中該經分離之抗體或其抗原結合片段以≤50 nM、≤20 nM、≤10 nM、≤1 nM或≤0.1 nM之解離常數(KD)結合於小鼠、食蟹獼猴、大鼠、豬及/或犬Sema3A；iii)以≥60%、≥70%、≥80%或≥90%之結合活性結合於SEQ ID NO:600之序列之人類Sema3A，如藉由表面電漿子共振(SPR)所量測；iv)在活體外腎小球膜細胞遷移分析法中以≤10 nM、≤5 nM、≤2.5 nM或≤1 nM之EC50抑制SEQ ID NO:600之序列之人類Sema3A之活性；v)在活體外生長錐塌陷分析法中以≤50 nM、≤25 nM、≤10 nM或≤5 nM之EC50抑制SEQ ID NO:600之序列之人類Sema3A之活性；vi)在活體外HUVEC排斥分析法中以≤1 nM或≤0.3 nM、≤0.1 nM、≤0.07 nM、≤0.06 nM之EC50抑制SEQ ID NO:600之序列之人類Sema3A之活性，及/或vii)呈現增加之針對SEQ ID NO:600之序列之細胞Sema3A誘導之HUVEC排斥之效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an isolated antibody or antigen-binding fragment thereof that binds to human Sema3A. The isolated antibody or antigen-binding fragment according to the present invention i) binds to human Sema3A of the sequence of SEQ ID NO: 600 with a dissociation constant (KD) ≤ 50 nM, ≤ 20 nM, ≤10 nM, ≤1 nM, or ≤ 0.1 nM; ii) cross-reacts with mouse, cynomolgus, rat, pig and/or dog Sema3A, particularly wherein said isolated antibody or antigen-binding fragment thereof binds to mouse, cynomolgus, rat, pig and/or dog Sema3A with a dissociation constant (KD) ≤ 50 nM, ≤ 20 nM, ≤10 nM, ≤1 nM, or ≤ 0.1 nM; iii) binds to human Sema3A of the sequence of SEQ ID NO: 600 with a binding activity as measured by surface plasmon resonance (SPR) of ≥ 60%, ≥ 70%, ≥ 80%, or ≥ 90%; iv) inhibits the activity of human Sema3A of the sequence of SEQ ID NO: 600 in an in vitro mesangial cell migration assay with an EC50 of ≤ 10 nM, ≤ 5 nM, ≤ 2.5 nM, or ≤ 1 nM; v) inhibits the activity of human Sema3A of the sequence of SEQ ID NO: 600 in an in vitro growth cone collapse assay with an EC50 of ≤ 50 nM, ≤ 25 nM, ≤ 10 nM, or ≤ 5 nM; vi) inhibits the activity of human Sema3A of the sequence of SEQ ID NO: 600 in an in vitro HUVEC repulsion assay with an EC50 of ≤ 1 nM, or ≤ 0.3 nM , ≤ 0,1 nM, ≤0,07 nM, ≤0,06nM and/or vii) exhibits an increased potency against cellular Sema3A, of the sequence of SEQ ID NO: 600, induced HUVEC repulsion.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1476" publication-number="202627680"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627680.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於可逆被覆晶圓圖案化之單體及聚合體組成物</chinese-title>  
        <english-title>MONOMER AND POLYMER COMPOSITIONS FOR REVERSIBLE OVERCOAT WAFER PATTERNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G03F7/004</main-classification>  
        <further-classification edition="200601120260319B">G03F7/027</further-classification>  
        <further-classification edition="200601120260319B">G03F7/20</further-classification>  
        <further-classification edition="200601120260319B">C08F220/30</further-classification>  
        <further-classification edition="200601120260319B">C08F220/34</further-classification>  
        <further-classification edition="202601120260319B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昆士蘭大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE UNIVERSITY OF QUEENSLAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>惠特克　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITTAKER, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克　易德立斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAKEY, IDRISS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭　輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬庫斯　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARKUS, JOSUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫山　ＭＤ　達烙爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSSAIN, MD DALOAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>墨菲　邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURPHY, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格熱希科維亞克　約迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRZESKOWIAK, JODI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特勒　夏洛特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUTLER, CHARLOTTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康克林　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONKLIN, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於圖案化基板的組成物包括單體。單體包括可聚合單元、熱或光化學可活化的交聯結構、及酸可裂解的解交聯結構。可聚合單元包括烯烴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition for patterning substrates includes a monomer. The monomer includes a polymerizable unit, a thermally or photochemically activatable crosslinking structure, and an acid-cleavable de-crosslinking structure. The polymerizable unit includes an olefin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:聚合體組成物</p>  
        <p type="p">218:聚合體</p>  
        <p type="p">220:有機骨幹</p>  
        <p type="p">222:解交聯結構</p>  
        <p type="p">224:交聯結構</p>  
        <p type="p">226:共聚物結構</p>  
        <p type="p">228:有機溶劑</p>  
        <p type="p">230:鹼淬滅劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1477" publication-number="202626669"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626669.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為NOX4抑制劑之雙環嘧啶酮</chinese-title>  
        <english-title>BICYCLIC PYRIMIDINONES AS INHIBITORS OF NOX4</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D513/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61P1/16</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格納姆　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GNAMM, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑沙茲　艾默</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUSCHATZ, ELMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布特諾　法蘭克　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUETTNER, FRANK H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格波特　西德克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODBOUT, CEDRICKX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希曼　安妮卡翠　夏綠蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIMANN, ANNEKATRIN CHARLOTTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍恩柯　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOENKE, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康帝斯　費倫茨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONTES, FERENC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫拉夫　克莉絲汀　安德里亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUTTRUFF, CHRISTIAN ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威登梅爾　戴特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEDENMAYER, DIETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷爾德穆斯　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILDERMUTH, RAPHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供雙環嘧啶酮衍生物，其為NOX4之抑制劑，且因此可用於治療可藉由抑制NOX4來治療之疾病。亦提供含有其之醫藥組合物，及製備該等化合物之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="391px" width="342px" file="ed10236.JPG" alt="ed10236.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides bicyclic pyrimidinone derivatives that are inhibitors of NOX4 and therefore useful for the treatment of diseases treatable by inhibition of NOX4. Also provided are pharmaceutical compositions containing the same, and processes for preparing said compounds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1478" publication-number="202627149"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627149.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用選擇性蝕刻的循環間隙填充</chinese-title>  
        <english-title>CYCLIC GAPFILL WITH SELECTIVE ETCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C23C16/04</main-classification>  
        <further-classification edition="200601120260319B">C23C16/40</further-classification>  
        <further-classification edition="200601120260319B">C23C16/455</further-classification>  
        <further-classification edition="200601120260319B">C23C16/56</further-classification>  
        <further-classification edition="202601120260319B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今出完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMADE, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾嘉沃　普爾基特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, PULKIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　喬納森　格蘭特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKER, JONATHAN GRANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露的示例係關於包含選擇性沉積及選擇性蝕刻的由下向上間隙填充的循環處理。一個示例提供一種填充基板上的特徵部的方法，該方法包含在該特徵部的側壁、該特徵部的底表面及該特徵部外側的場區上沉積一材料的一層。該方法進一步包含在該特徵部的該底表面上的該材料的該層上方沉積蝕刻停止層。該方法進一步包含從該特徵部的該側壁選擇性蝕刻該材料的該層。該方法進一步包含從該特徵部的該底表面去除該蝕刻停止層，藉此在該特徵部的該底表面及該特徵部外側的場區上留下該材料的該層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Examples are disclosed that relate to cyclic processes for bottom-up gapfill that includes selective deposition and selective etching. One example provides a method of filling a feature on a substrate, the method comprising depositing a layer of a material on a sidewall of the feature, a bottom surface of the feature, and a field region outside the feature. The method further comprises depositing an etch stop layer over the layer of the material on the bottom surface of the feature. The method further comprises selectively etching the layer of the material from the sidewall of the feature. The method further comprises removing the etch stop layer from the bottom surface of the feature, thereby leaving the layer of the material on the bottom surface of the feature and the field region outside the feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:計算系統</p>  
        <p type="p">602:邏輯子系統</p>  
        <p type="p">604:儲存子系統</p>  
        <p type="p">606:顯示子系統</p>  
        <p type="p">608:輸入子系統</p>  
        <p type="p">610:通信子系統</p>  
        <p type="p">612:指令</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1479" publication-number="202626063"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626063.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>STING促效劑及檢查點抑制劑之投與</chinese-title>  
        <english-title>ADMINISTRATION OF STING AGONIST AND CHECKPOINT INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K31/7084</main-classification>  
        <further-classification edition="200601120260324B">A61K39/395</further-classification>  
        <further-classification edition="200601120260324B">A61K45/06</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商武田藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA PHARMACEUTICAL COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊凱　艾瑞克　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIGHTCAP, ERIC SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供了用於治療有此需要之患者中癌症之方法、醫藥組成物及套組。該等方法包含向有需要之患者投與STING(干擾素基因之刺激物)促效劑諸如說明書中定義之化合物No. 14或其醫藥學上可接受之鹽與一或多種檢查點抑制劑組合。亦提供了用於治療癌症之藥物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods, pharmaceutical compositions, and kits for treating cancer in patients in need thereof. The methods comprise administering to a patient in need a STING (stimulator of interferon genes) agonist, such as Compound No. 14 as defined in the description, or a pharmaceutically acceptable salt thereof, in combination with one or more checkpoint inhibitors. Also provided are medicaments for use in treating cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1480" publication-number="202626804"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626804.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132234</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模芯用樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C08F216/06</main-classification>  
        <further-classification edition="200601120260327B">C08L33/10</further-classification>  
        <further-classification edition="200601120260327B">C01B33/42</further-classification>  
        <further-classification edition="200601120260327B">C08L29/04</further-classification>  
        <further-classification edition="200601120260327B">C08K3/04</further-classification>  
        <further-classification edition="201801120260327B">C08K3/016</further-classification>  
        <further-classification edition="200601120260327B">C08K3/22</further-classification>  
        <further-classification edition="200601120260327B">C08K5/107</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田義和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千東尚久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITOU, TAKAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種模芯用樹脂組成物，其可發揮高耐熱性，且能夠製造即便於超級工程塑膠（super engineering plastic）之成形條件亦不會熔融、變形之模芯。 &lt;br/&gt;本發明係一種模芯用樹脂組成物，其含有聚乙烯醇樹脂，並含有粒子填料（X）、及鱗片狀、板狀或層狀化合物（Y），且下述式（1）所表示之每單位質量模芯用樹脂組成物中的上述粒子填料（X）之總表面積A為10m&lt;sup&gt;2&lt;/sup&gt;/g以上。 &lt;br/&gt;&lt;img align="absmiddle" height="63px" width="295px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;A：粒子填料（X）之總表面積（m&lt;sup&gt;2&lt;/sup&gt;/g） &lt;br/&gt;B：粒子填料（X）之平均粒徑（m） &lt;br/&gt;D：模芯用樹脂組成物中粒子填料（X）之含量（質量%） &lt;br/&gt;E：粒子填料（X）之密度（g/m&lt;sup&gt;3&lt;/sup&gt;）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1481" publication-number="202626233"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626233.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺絲攻</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B23G5/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＯＳＧ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSG CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝口哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOGUCHI, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻匠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKI, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神谷秋志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYA, SHUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供已提高折損強度或扭轉剛性之具有倒錐的螺絲攻。&lt;br/&gt; 螺絲攻10具有吃入部18與完全牙部16，在完全牙部16中，螺牙之角度θ1會變化。隨著螺牙之角度θ1之變化的完全牙部16的底徑之減少量比外徑之減少量更小。藉由如此，在設置完全牙部的倒錐之形狀的同時，自引導性增加，並且，折損強度或扭轉剛性提高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:螺絲攻</p>  
        <p type="p">12:柄</p>  
        <p type="p">14:螺紋部</p>  
        <p type="p">16:完全牙部</p>  
        <p type="p">18:吃入部</p>  
        <p type="p">O:軸心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1482" publication-number="202627702"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627702.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>識別及定位單一影像內的多個對準標記</chinese-title>  
        <english-title>IDENTIFYING AND LOCATING MULTIPLE ALIGNMENT MARKS WITHIN A SINGLE IMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G03F9/00</main-classification>  
        <further-classification edition="201701120260316B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　啓銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊迪格　湯瑪斯Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAIDIG, THOMAS L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱莫迪能　恩泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEMELDINOV, AIDYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　國華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIE, FREDERICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫敏勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEN, MIN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">系統包括記憶體和至少一個操作性耦合至該記憶體的處理裝置，以在基板上複數個晶粒的影像中偵測到複數個對準標記，其中複數個晶粒的每一個晶粒包括複數個對準標記中至少一個對準標記，從複數個對準標記中選擇一對準標記，確定對準標記的身份，並確定對準標記的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes a memory and at least one processing device, operatively coupled to the memory, to detect, in an image of a plurality of dies on a substrate, a plurality of alignment marks, wherein each die of the plurality of dies includes at least one alignment mark of the plurality of alignment marks, select an alignment mark from the plurality of alignment marks, determine an identity of the alignment mark, and determine a location of the alignment mark.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">422-1:晶圓</p>  
        <p type="p">422-2:晶圓</p>  
        <p type="p">422-3:晶圓</p>  
        <p type="p">422-4:晶圓</p>  
        <p type="p">422-5:晶圓</p>  
        <p type="p">422-6:晶圓</p>  
        <p type="p">422-7:晶圓</p>  
        <p type="p">422-8:晶圓</p>  
        <p type="p">424-1:對準標記</p>  
        <p type="p">424-14:對準標記</p>  
        <p type="p">424-18:對準標記</p>  
        <p type="p">424-19:對準標記</p>  
        <p type="p">424-21:對準標記</p>  
        <p type="p">424-32:對準標記</p>  
        <p type="p">424-4:對準標記</p>  
        <p type="p">424-7:對準標記</p>  
        <p type="p">800:示意圖</p>  
        <p type="p">810-1:影像區域</p>  
        <p type="p">810-4:影像區域</p>  
        <p type="p">820:影像區域</p>  
        <p type="p">830:方框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1483" publication-number="202626324"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626324.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可回收，可生物降解，和可工業堆肥之發泡體及其製造方法</chinese-title>  
        <english-title>RECYCLABLE, BIODEGRADABLE, AND INDUSTRIALLY COMPOSTABLE FOAMS, AND METHODS OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">B29C44/34</main-classification>  
        <further-classification edition="200601120260319B">C08J9/12</further-classification>  
        <further-classification edition="200601120260319B">B29C44/08</further-classification>  
        <further-classification edition="200601120260319B">B29C44/60</further-classification>  
        <further-classification edition="201001120260319B">B29D35/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｏ２夥伴有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O2 PARTNERS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟文濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAI, WENTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於製造發泡體的方法，其包含：將聚合物預製件在高壓釜腔室中進行第一發泡階段以形成預膨脹的聚合物預製件；以及將預膨脹的聚合物預製件在高壓釜腔室中進行第二發泡階段以形成經膨脹的聚合物預製件。第一和第二發泡階段可以在不同的高壓釜溫度、壓力和保持時間下進行。經膨脹的聚合物預製件可以進一步進行壓縮模製製程以製造最終的發泡體產品。聚合物預製件可以包含一種或多種非交聯的熱塑性聚合物。一種或多種熱塑性聚合物可以是可生物降解和/或可回收的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for producing a foam includes subjecting a polymer pre-form to a first foaming stage within an autoclave chamber to form a pre-expanded polymer pre-form and subjecting the pre-expanded polymer pre-form to a second foaming stage within an autoclave chamber to form an expanded polymer pre-form. The first and second foaming stages may occur at different autoclave temperatures, pressures, and hold times. The expanded polymer pre-from may be further subjected to a compression molding process to produce a final foam product. The polymer pre-form may include one or more thermoplastic polymers that are not cross-linked. The one or more thermoplastic polymers may be biodegradable and/or recyclable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1484" publication-number="202626600"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626600.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物、阻劑圖型形成方法、高分子化合物及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C07C309/12</main-classification>  
        <further-classification edition="200601120260325B">C07C381/12</further-classification>  
        <further-classification edition="200601120260325B">C08F12/30</further-classification>  
        <further-classification edition="200601120260325B">G03F7/004</further-classification>  
        <further-classification edition="200601120260325B">G03F7/039</further-classification>  
        <further-classification edition="200601120260325B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井秀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, SHUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種阻劑組成物，其含有具有由通式(a0-1)所示之化合物所衍生之結構單元(a0)的樹脂成分(A1)(式中，W&lt;sup&gt;1&lt;/sup&gt;為含有聚合性基之基。Ar1為芳香族基。Ra&lt;sup&gt;01&lt;/sup&gt;為烷氧基或酸分解性基。Ra&lt;sup&gt;02&lt;/sup&gt;為取代基。Lf&lt;sup&gt;01&lt;/sup&gt;為2價的連結基。Lf&lt;sup&gt;02&lt;/sup&gt;為亦可具有取代基之伸烷基或亦可具有取代基之伸芳基。m為1以上的整數，M&lt;sup&gt;m+&lt;/sup&gt;表示m價的陽離子。)。 &lt;br/&gt;&lt;img align="absmiddle" height="246px" width="498px" file="ed10124.JPG" alt="ed10124.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1485" publication-number="202626259"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626259.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在化學機械拋光系統中尋找基板上的基板凹口</chinese-title>  
        <english-title>FINDING SUBSTRATE NOTCH ON SUBSTRATE IN A CHEMICAL MECHANICAL POLISHING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260316B">B24B37/005</main-classification>  
        <further-classification edition="201201120260316B">B24B37/28</further-classification>  
        <further-classification edition="200601120260316B">B24B49/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　浩權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, JUSTIN HO KUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　湯姆Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TOM C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧加森　艾蜜莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUGASON, EMILY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">拋光裝置具有拋光站、凹口尋找站，以及基板搬運系統，以在兩者之間移動基板。基板搬運系統包括承載裝置，用於在凹口尋找站上保持基板。凹口尋找站包括外殼，外殼包括地板和側壁，地板和側壁形成開口頂部的水庫，側壁具有下部和上部，上部的上邊緣比下部薄，還包括通道以向開口頂部的水庫引入液體，以形成延伸至基板的液體柱，並且包括光纖，光纖穿過外殼的地板，並被定位為在承載裝置於凹口尋找站保持基板時，將光束導向通過液體柱照射到基板上，並接收來自基板的光束反射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polishing apparatus has a polishing station, a notch finding station, and a substrate handling system to move a substrate therebetween. The substrate handling system includes a carrier to hold a substrate at the notch finding station. The notch finding station includes a housing including floor and sidewalls that form an open-topped reservoir, the sidewalls having a lower portion and an upper portion having an upper edge that is thinner than the lower portion, a passage to introduce a liquid into the open-topped reservoir to form a liquid column extending to the substrate, and an optical fiber extending through a floor of the housing and positioned to direct a light beam through the liquid column onto the substrate when held by the carrier at the notch finding station and to receive reflections of the light beam from the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">110:拋光站</p>  
        <p type="p">120:平臺</p>  
        <p type="p">140:承載頭/承載裝置/拋光頭</p>  
        <p type="p">142:扣環</p>  
        <p type="p">146:膜</p>  
        <p type="p">150:支撐結構</p>  
        <p type="p">152:軸</p>  
        <p type="p">154:驅動軸</p>  
        <p type="p">156:馬達</p>  
        <p type="p">200:凹口尋找站</p>  
        <p type="p">224:感測區域</p>  
        <p type="p">240:光學板或框架</p>  
        <p type="p">242:第二致動器</p>  
        <p type="p">302:外殼</p>  
        <p type="p">304:地板</p>  
        <p type="p">306:側壁</p>  
        <p type="p">308:水庫</p>  
        <p type="p">310:通道</p>  
        <p type="p">312:上部</p>  
        <p type="p">314:下部</p>  
        <p type="p">316:上邊緣/第二側壁</p>  
        <p type="p">320:液體柱</p>  
        <p type="p">340:距離</p>  
        <p type="p">350:控制器</p>  
        <p type="p">360:液體來源</p>  
        <p type="p">410:光束/柱</p>  
        <p type="p">420:光纖</p>  
        <p type="p">430:透鏡</p>  
        <p type="p">432:致動器</p>  
        <p type="p">440:組件</p>  
        <p type="p">440a:光源</p>  
        <p type="p">440b:偵測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1486" publication-number="202628004"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628004.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>解析支援裝置、解析支援方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260325B">G06V10/72</main-classification>  
        <further-classification edition="202201120260325B">G06V10/771</further-classification>  
        <further-classification edition="202201120260325B">G06V10/94</further-classification>  
        <further-classification edition="200601120260325B">G01N21/88</further-classification>  
        <further-classification edition="201901120260325B">G06F16/53</further-classification>  
        <further-classification edition="201801120260325B">G06F9/44</further-classification>  
        <further-classification edition="202601120260325B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田泰輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UETA, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小池弘人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIKE, HIROHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內田善久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIDA, YOSHIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種解析支援裝置，支援半導體上形成之圖案的解析，其具有記憶體和處理器。記憶體記憶對應資訊，對應資訊對應於解析目的，將圖案的檢查數據的複數個特徵條件各自與支援解析之顯示方案中使用的一個以上的參數及每個一個以上的參數的設定條件相對應。處理器，接受來自使用者的解析目的時，從對應資訊取得與所接受之解析目的對應之複數個特徵條件，參照對應資訊，判定解析對象的複數個檢查數據與複數個特徵條件中的哪個特徵條件相符合，將與判定之特徵條件對應的一個以上的參數及每個一個以上的參數的設定條件應用於複數個檢查數據，以作成顯示方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:解析支援裝置</p>  
        <p type="p">11:數據提取部</p>  
        <p type="p">12:顯示部</p>  
        <p type="p">13:顯示方案生成部</p>  
        <p type="p">14:第一記憶部</p>  
        <p type="p">15:輸入部</p>  
        <p type="p">16:歷史解析部</p>  
        <p type="p">17:第二記憶部</p>  
        <p type="p">18:顯示控制部</p>  
        <p type="p">20:伺服器</p>  
        <p type="p">21:數據庫</p>  
        <p type="p">22:數據儲存部</p>  
        <p type="p">30-1~30-m:檢查裝置</p>  
        <p type="p">201:解析支援系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1487" publication-number="202625904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>啤酒風味無酒精飲料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A23L2/52</main-classification>  
        <further-classification edition="200601120260401B">A23L2/56</further-classification>  
        <further-classification edition="200601120260401B">A23L2/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商麒麟控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRIN HOLDINGS KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川彩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種味道之複雜性及收斂味良好之新穎之啤酒風味無酒精飲料。根據本發明，提供一種乙偶姻之濃度為0.01 ppm以上之啤酒風味無酒精飲料。根據本發明，藉由以在規定濃度範圍內之方式使啤酒風味無酒精飲料中含有乙偶姻，能夠提供於該啤酒風味無酒精飲料中味道之複雜性及收斂味良好者，於可滿足消費者之多樣化嗜好或需求之方面有利。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1488" publication-number="202626085"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626085.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多價肺炎球菌多醣-蛋白質共軛物組成物</chinese-title>  
        <english-title>MULTIVALENT PNEUMOCOCCAL POLYSACCHARIDE-PROTEIN CONJUGATE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61K39/09</main-classification>  
        <further-classification edition="200601120260331B">A61K39/385</further-classification>  
        <further-classification edition="200601120260331B">A61K39/39</further-classification>  
        <further-classification edition="200601120260331B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK BIOSCIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽諾菲巴斯德股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI PASTEUR INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安京俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, KYUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>咸東洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAM, DONGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申珍煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JINHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍普費爾　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOPFER, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯辛格　理察　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENSINGER, RICHARD D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>覺　莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYAW, MOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔拉加　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TALAGA, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供含21種不同肺炎球菌莢膜多醣-蛋白質共軛物之混合載體、多價肺炎球菌共軛物組成物，其中各共軛物包括一種與破傷風類毒素(TT)或CRM&lt;sub&gt;197&lt;/sub&gt;共軛、來自不同肺炎鏈球菌血清型的莢膜多醣，其中該肺炎鏈球菌血清型係選自於1、3、4、5、6A、6B、7F、8、9N、9V、10A、11A、12F、14、15B、18C、19A、19F、22F、23F及33F，其中血清型1、3及5中的二者及血清型15B及22F中的一或二者之該莢膜多醣係與TT共軛且該剩餘的莢膜多醣係與CRM&lt;sub&gt;197&lt;/sub&gt;共軛。亦提供生產該混合載體、多價肺炎球菌共軛物組成物的方法以及於一個體內使用其用於預防肺炎鏈球菌感染或疾病的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are mixed carrier, multivalent pneumococcal conjugate compositions comprising 21 different pneumococcal capsular polysaccharide-protein conjugates, wherein each of the conjugates includes a capsular polysaccharide from a different serotype of Streptococcus pneumoniae conjugated to either tetanus toxoid (TT) or CRM&lt;sub&gt;197&lt;/sub&gt;, wherein the Streptococcus pneumoniae serotypes are selected from 1, 3, 4, 5, 6A, 6B, 7F, 8, 9N, 9V, 10A, 11A, 12F, 14, 15B, 18C, 19A, 19F, 22F, 23F, and 33F, where the capsular polysaccharides of two of serotypes 1, 3, and 5 and one or both of serotypes 15B and 22F are conjugated to TT and the remaining capsular polysaccharides are conjugated to CRM&lt;sub&gt;197&lt;/sub&gt;. Also provided are methods of producing the mixed carrier, multivalent pneumococcal conjugate compositions and methods of using the same for prophylaxis against Streptococcus pneumoniae infection or disease in a subject.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1489" publication-number="202626064"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626064.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以治療血管張力素原（ＡＧＴ）相關疾病的方法和組成物</chinese-title>  
        <english-title>METHODS AND COMPOSITIONS FOR TREATING AN ANGIOTENSINOGEN-(AGT-) ASSOCIATED DISORDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/713</main-classification>  
        <further-classification edition="201001120260401B">C12N15/113</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P13/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾拉倫製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALNYLAM PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈亞爾　尼滕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOYAL, NITENDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扎佩　迪昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAPPE, DION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　為農</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, WEINONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅赫羅特拉　尼丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEHROTRA, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫拉納　馬諾吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHURANA, MANOJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONGTAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUONG, ANH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹泫智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, HYUN GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴完洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WANSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅畢　加布里埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBBIE, GABRIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及在有需要的受試者中抑制血管張力素原(AGT)基因表達的雙鏈核糖核酸(dsRNA)劑或其鹽的RNAi抑制活性的方法；在有需要的受試者中，改善抑制AGT基因表達的dsRNA劑或其鹽的副作用之方法；和/或透過向受試者施用固定劑量的單鏈寡核苷酸及其組成物治療有需要的受試者，該受試者先前施用了抑制血管張力素原(AGT)基因表達的dsRNA劑或其鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods of inhibiting in a subject in need thereof, the RNAi inhibitory activity of a double stranded ribonucleic acid (dsRNA) agent, or a salt thereof, that inhibits the expression of an angiotensinogen(AGT)gene; ameliorating in a subject in need thereof, a side effect of a dsRNA agent, or a salt thereof, that inhibits the expression of an AGT gene; and/or treating a subject in need thereof, previously administered a dsRNA agent, or a salt thereof, that inhibits the expression of an angiotensinogen AGT gene, by administering to the subject a fixed dose of a single stranded oligonucleotide, and compositions thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1490" publication-number="202626707"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626707.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＰＣＳＫ９和ＡＮＧＰＴＬ３的結合蛋白及其用途</chinese-title>  
        <english-title>PCSK9 AND ANGPTL3 BINDING PROTEINS AND THEIR USES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/22</main-classification>  
        <further-classification edition="200601120260401B">C07K16/40</further-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P3/06</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P9/10</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅順濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHUNTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何亞軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YAJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張先慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIANHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉阿敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, AMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇東海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, DONGHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及PCSK9和ANGPTL3的結合蛋白及其用途。具體地，本發明涉及特異性結合PCSK9和ANGPTL3的雙特異性抗體或其抗原結合片段、包含其的醫藥組成物、編碼其的核酸分子以及其在疾病治療中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to PCSK9 and ANGPTL3 binding proteins and their uses. Specifically, the present invention relates to bispecific antibodies or antigen-binding fragments thereof that specifically bind to PCSK9 and ANGPTL3, pharmaceutical compositions comprising the same, nucleic acid molecules encoding the same, and their uses in treating diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1491" publication-number="202626897"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>捲筒狀長條玻璃布及預浸體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J5/24</main-classification>  
        <further-classification edition="200601120260401B">D03D1/00</further-classification>  
        <further-classification edition="200601120260401B">D03D13/00</further-classification>  
        <further-classification edition="202101120260401B">D03D15/267</further-classification>  
        <further-classification edition="200601120260401B">D06M10/00</further-classification>  
        <further-classification edition="200601120260401B">B65H18/28</further-classification>  
        <further-classification edition="200601120260401B">B65H75/08</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本優香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, YUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣瀬周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSE, AMANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種整個長條上之斷裂及毛羽較少之捲筒狀長條玻璃布及包含該玻璃布之捲筒狀長條預浸體。 &lt;br/&gt;根據本發明，提供一種捲繞於芯管之捲筒狀長條玻璃布、及包含該玻璃布之捲筒狀長條預浸體。上述玻璃布係將包含複數根玻璃長絲之玻璃紗作為經紗及緯紗而構成，上述捲筒狀長條玻璃布之拉伸強度之變動比Sb/Sa為0.6以上，將Sa設為上述捲筒狀長條玻璃布之內層之拉伸強度及表層之拉伸強度中較大者之值，將Sb設為較小者之值，上述表層係設為相對於上述玻璃布之捲繞量L(m)，距捲出處4%以上6%以下之位置，上述內層係設為94%以上96%以下之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1492" publication-number="202627301"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627301.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空泵及密封真空泵之方法</chinese-title>  
        <english-title>VACUUM PUMP AND METHOD OF SEALING A VACUUM PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">F04C27/00</main-classification>  
        <further-classification edition="200601120260327B">F04C25/02</further-classification>  
        <further-classification edition="200601120260327B">F16J15/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商愛德華有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍克利　羅賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOCKLEY, ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍布魯克　艾倫　恩尼斯特　基奈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLBROOK, ALAN ERNEST KINNAIRD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱樂山姆　西伯巴蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAILASAM, SIVABALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種密封一真空泵之方法(500)，其包括：提供(510)具有一第一端面及一第二端面之一定子，該定子包括用於附接在一起以界定至少一個泵送腔室之第一及第二定子組件；提供(520)用於分別附接至該定子之該等第一及第二端面之第一及第二端板；配置(530)至少部分地配置於該定子之該至少一個泵送腔室內之至少一個轉子；在該第一定子組件與該第二定子組件之間、在該第一端板與該第一端面之間及在該第二端板與該第二端面之間配置(540)一單件式密封墊片；配置(550)至少一個間隔件以在該第一端板與該第一端面之間及/或在該第二端板與該第二端面之間提供一間隙，其中該間隙至少部分地跨該第一端面及/或該第二端面延伸；及將該第一定子組件緊固(560)至該第二定子組件，將該第一端板緊固至該第一端面，且將該第二端板緊固至該第二端面。本發明亦係關於一種真空泵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method (500) of sealing a vacuum pump, comprising: providing (510) a stator having a first end face and a second end face, the stator comprising first and second stator components for attaching together to define at least one pumping chamber; providing (520) first and second end plates for attaching respectively to the first and second end faces of the stator; arranging (530) at least one rotor arranged at least partially within the at least one pumping chamber of the stator; arranging (540) a one-piece sealing gasket between the first stator component and the second stator component, between the first end plate and the first end face, and between the second end plate and the second end face; arranging (550) at least one spacer to provide a gap between the first end plate and the first end face and/or between the second end plate and the second end face, wherein the gap extends at least partially across the first end face and/or the second end face; and fastening (560) the first stator component to the second stator component, the first end plate to the first end face, and the second end plate to the second end face. Also relates to a vacuum pump.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">510:方法之步驟</p>  
        <p type="p">520:方法之步驟</p>  
        <p type="p">530:方法之步驟</p>  
        <p type="p">540:方法之步驟</p>  
        <p type="p">550:方法之步驟</p>  
        <p type="p">560:方法之步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1493" publication-number="202628595"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628595.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">H10B61/00</main-classification>  
        <further-classification edition="202301120260323B">H10N50/01</further-classification>  
        <further-classification edition="202301120260323B">H10N50/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山直紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYAMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙亨峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安炯祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, HYUNG-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島野拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有優異之特性及可靠性之磁性記憶裝置。 &lt;br/&gt;實施形態之磁性記憶裝置包含：下部構造；第1及第2積層構造，其等設置於下部構造上；第1及第2含硼層，其等沿著第1及第2積層構造之側面設置，含有硼(B)，且彼此分離；及第1及第2金屬氧化物層，其等沿著第1及第2積層構造之側面設置，含有規定金屬元素及氧(O)。第1及第2積層構造各者包含將基本部分11、具有導電性之下部分、及具有導電性之上部分沿第1方向積層而成之構造；基本部分包含將具有可變之磁化方向之第1磁性層、具有經固定之磁化方向之第2磁性層、及設置於第1磁性層與第2磁性層之間之非磁性層沿第1方向積層而成之構造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層構造</p>  
        <p type="p">11:基本部分</p>  
        <p type="p">11a:記憶層(第1磁性層)</p>  
        <p type="p">11b:參考層(第2磁性層)</p>  
        <p type="p">11c:穿隧障壁層(非磁性層)</p>  
        <p type="p">12:下部分</p>  
        <p type="p">13:上部分</p>  
        <p type="p">21:含硼層</p>  
        <p type="p">21e:延伸部分</p>  
        <p type="p">22:金屬氧化物層</p>  
        <p type="p">30:下部構造</p>  
        <p type="p">31:下部絕緣層</p>  
        <p type="p">31r:凹部</p>  
        <p type="p">32:電極</p>  
        <p type="p">33:含金屬層(殘渣層)</p>  
        <p type="p">40:配線/上部配線</p>  
        <p type="p">50:上部絕緣層</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1494" publication-number="202628681"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628681.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132319</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202501120260327B">H10D64/20</further-classification>  
        <further-classification edition="201101120260327B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李柗宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SONG JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪秀憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, SOO HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴世娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SE YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申翰璱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, HAN SEUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹炫棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HYUN KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括：基底；主動圖案，包括在基底的上表面上沿第一水平方向延伸並在第二水平方向上彼此間隔開的第一部分和第二部分；堆疊在第一部分上的第一多個奈米片；以及堆疊在第二部分上的第二多個奈米片。半導體裝置更包括接地結構，包括堆疊在第一部分和第二部分上的第三多個奈米片；以及在第三多個奈米片之間並包括矽鍺的半導體層；包圍第一多個奈米片和第二多個奈米片的第一閘極電極；在第二水平方向上覆蓋接地結構的上表面和側壁的接地閘極電極；以及在接地結構和接地閘極電極之間並包括金屬矽化物的接地矽化物層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes: a substrate; an active pattern including a first portion and a second portion that extend in a first horizontal direction on an upper surface of the substrate and are spaced apart from each other in a second horizontal direction; a first plurality of nanosheets stacked on the first portion; and a second plurality of nanosheets stacked on the second portion. The semiconductor device further includes a ground structure including a third plurality of nanosheets stacked on the first and second portions; and a semiconductor layer between the third plurality of nanosheets and including silicon germanium; a first gate electrode surrounding the first and second plurality of nanosheets; a ground gate electrode covering an upper surface and sidewalls of the ground structure in the second horizontal direction; and a ground silicide layer between the ground structure and the ground gate electrode including a metal silicide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101_1,102_1:第一部分</p>  
        <p type="p">101_2,102_2:第二部分</p>  
        <p type="p">101_3,102_3:第三部分</p>  
        <p type="p">101:第一主動圖案</p>  
        <p type="p">102:第二主動圖案</p>  
        <p type="p">A-A’,B-B’,C-C’,D-D’:線</p>  
        <p type="p">DR1:第一水平方向</p>  
        <p type="p">DR2:第二水平方向</p>  
        <p type="p">DR3:豎直方向</p>  
        <p type="p">G1:第一閘極電極</p>  
        <p type="p">G2:第二閘極電極</p>  
        <p type="p">GC1:第一閘極切口</p>  
        <p type="p">GC2:第二閘極切口</p>  
        <p type="p">GC3:第三閘極切口</p>  
        <p type="p">GC4:第四閘極切口</p>  
        <p type="p">GC5:第五閘極切口</p>  
        <p type="p">GG:接地閘極電極</p>  
        <p type="p">NW1,NW2,NW3,NW4,NW5,NW6,NW7,NW8,NW9,NW10:奈米片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1495" publication-number="202626033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療支氣管擴張或其他二肽基肽酶Ｉ（ＤＰＰ－Ｉ）介導疾病之患者的二肽基肽酶Ｉ抑制劑新結晶型、新醫藥組合物及劑量療法</chinese-title>  
        <english-title>NEW CRYSTALLINE FORMS, NEW PHARMACEUTICAL COMPOSITION AND DOSE REGIMEN OF A DIPEPTIDYL-PEPTIDASE I INHIBITOR FOR THE TREATMENT OF PATIENTS WITH BRONCHIECTASIS OR OTHER DPP-I MEDIATED DISEASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/439</main-classification>  
        <further-classification edition="200601120260401B">A61K9/28</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索特　維布克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAUTER, WIEBKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹丹婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, DANTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費奇　亞弗列德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FETSCHER, ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科格勒　哈拉德　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOEGLER, HARALD PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史蘭根　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHLANGEN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史米斯　約肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITZ, JOCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許奈德　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDER, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威茲爾　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WETZEL, KRISTIANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於式(I)二肽基肽酶I (DPPI或細胞自溶酶C)抑制劑，其可使用治療有效劑量用於預防及/或治療具有某些潛在病因之支氣管擴張、用於預防及/或治療抗嗜中性球細胞質抗體相關血管炎或化膿性汗腺炎；及化合物(I)之多形體，以及包括化合物(I)及其多形體之醫藥組合物。 &lt;br/&gt;&lt;img align="absmiddle" height="204px" width="382px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the dipeptidyl‑peptidase I (DPPI or Cathepsin C) inhibitor of formula (I), which is useful in the prevention and/or treatment of bronchiectasis with certain underlying aetiologies, in the prevention and/or treatment of anti-neutrophil cytoplasmic antibody-associated vasculitis or hidradenitis suppurativa using therapeutically efficacious dosages and to polymorphs of Compound (I) as well as to pharmaceutical compositions comprising Compound (I) and its polymorphs. &lt;br/&gt;&lt;img align="absmiddle" height="196px" width="389px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; </p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1496" publication-number="202627780"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627780.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有觸控感測器與觸覺裝置的輸入裝置</chinese-title>  
        <english-title>INPUT DEVICE WITH TOUCH SENSOR AND HAPTIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G06F3/041</main-classification>  
        <further-classification edition="200601120260316B">G06F3/01</further-classification>  
        <further-classification edition="201301120260316B">G06F3/039</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽納波狄克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNAPTICS INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚業成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, YEH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於具有觸覺感測器總成的輸入裝置的系統與方法。觸覺感測器總成包含一感測器附屬總成，具有一或多個觸控感測器裝置，其配置成提供響應來自一輸入物件的壓力的力感測。感測器附屬總成也包含一可撓性基板，其配置成響應來自該輸入物件的該壓力而變形。觸覺感測器總成更包含觸覺附屬總成，具有一或多個觸覺裝置，其配置成響應偵測該輸入物件，以提供觸覺回饋。觸覺附屬總成更包含一支架總成，包含一第一支架部分及一第二支架部分。該一或多個觸覺裝置係由該支架總成的該第二支架部分支撐。該支架總成的該第一支架部分係設置在該一或多個觸控感測器裝置下方並且配置成耦合至一參考電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for an input device with a haptic sensor assembly are provided. The haptic sensor assembly includes a sensor subassembly with one or more touch sensor devices configured to provide force sensing responsive to pressure from an input object. The sensor subassembly also includes a flexible substrate configured to deform in response to the pressure from the input object. The haptic sensor assembly further includes a haptic subassembly with one or more haptic devices configured to provide haptic feedback in response to detecting the input object. The haptic subassembly also includes a bracket assembly comprising a first bracket portion and a second bracket portion. The one or more haptic devices are supported by the second bracket portion of the bracket assembly. The first bracket portion of the bracket assembly is disposed below the one or more touch sensor devices and configured to be coupled to a reference voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">304:觸覺致動器</p>  
        <p type="p">412:可撓性基板</p>  
        <p type="p">414:支架部分</p>  
        <p type="p">416:支架部分</p>  
        <p type="p">432:覆蓋層/面板層</p>  
        <p type="p">500:分解圖</p>  
        <p type="p">502:第一層(黏著劑)</p>  
        <p type="p">504:第二層(黏著劑)</p>  
        <p type="p">506:掌托支架</p>  
        <p type="p">508:支架總成</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1497" publication-number="202626517"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626517.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分散粉、水分散液、母料組成物、母料、近紅外線遮蔽透明樹脂成形體、近紅外線遮蔽透明積層體、母料組成物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C01G41/00</main-classification>  
        <further-classification edition="200601120260319B">C08K3/22</further-classification>  
        <further-classification edition="202501120260319B">C08L23/26</further-classification>  
        <further-classification edition="200601120260319B">C08K5/19</further-classification>  
        <further-classification edition="200601120260319B">C08J5/18</further-classification>  
        <further-classification edition="202501120260319B">A01G13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友金屬礦山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長南武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONAN, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤孝郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分散粉，其包含:陽離子性表面活性劑、以及 &lt;br/&gt;具有六方晶的晶體結構的通式M&lt;sub&gt;x&lt;/sub&gt;WO&lt;sub&gt;y&lt;/sub&gt;(其中，M元素包含選自Li、Na、K、Rb、Cs、Fr、Be、Mg、Ca、Sr、Ba、Ra中的1種以上的元素，滿足0.1≦x≦1.0，2.0≦y＜4.0)所示的複合鎢氧化物粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水分散液</p>  
        <p type="p">11:複合鎢氧化物粒子</p>  
        <p type="p">12:水</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1498" publication-number="202626518"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626518.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分散粉、水分散液、母料組成物、母料、近紅外線遮蔽透明樹脂成形體、近紅外線遮蔽透明積層體、母料組成物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C01G41/00</main-classification>  
        <further-classification edition="200601120260325B">C08K3/22</further-classification>  
        <further-classification edition="202501120260325B">C08L23/02</further-classification>  
        <further-classification edition="202501120260325B">C08L23/26</further-classification>  
        <further-classification edition="200601120260325B">C08L67/04</further-classification>  
        <further-classification edition="200601120260325B">C08J3/22</further-classification>  
        <further-classification edition="200601120260325B">C08J5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友金屬礦山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長南武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONAN, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤孝郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分散粉，其包含:非離子性高分子分散劑、以及 &lt;br/&gt;具有六方晶的晶體結構的通式M&lt;sub&gt;x&lt;/sub&gt;WO&lt;sub&gt;y&lt;/sub&gt;(其中，M元素包含選自Li、Na、K、Rb、Cs、Fr、Be、Mg、Ca、Sr、Ba、Ra中的1種以上的元素，滿足0.1≦x≦1.0，2.0≦y＜4.0)所示的複合鎢氧化物粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水分散液</p>  
        <p type="p">11:複合鎢氧化物粒子</p>  
        <p type="p">12:水</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1499" publication-number="202626672"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626672.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種IRAK-4降解劑的多晶型</chinese-title>  
        <english-title>POLYMORPHS OF AN IRAK-4 DEGRADER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D519/00</main-classification>  
        <further-classification edition="200601120260401B">A61K31/5386</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐西坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁兆峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, ZHAOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高永宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, YONGHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范傳文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, CHUANWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>覃華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付　家勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, JIASHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢方超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BI, FANGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種IRAK-4降解劑的多晶型，具體地，本發明提供了一種如下式（I）所示的IRAK-4降解劑的多種晶型、鹽及其晶型、其藥物組合物、製備及用途。本發明提供的晶型可用於製備治療和/或預防由IRAK4介導的相關疾病的藥物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses polymorphs of an IRAK-4 degrader. Specifically, the present invention provides multiple polymorphs of the IRAK-4 degrader shown in formula (I), salts, pharmaceutical compositions, preparation methods and uses thereof. The polymorphs provided by the present invention can be used to prepare drugs for treating and/or preventing IRAK4-mediated diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1500" publication-number="202626009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132363</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含洛赫西定(chlorhexidine)及脫色錯合物之組成物</chinese-title>  
        <english-title>COMPOSITIONS COMPRISING CHLORHEXIDINE AND A DEPIGMENTING COMPLEX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/43</main-classification>  
        <further-classification edition="200601120260401B">A61K8/44</further-classification>  
        <further-classification edition="200601120260401B">A61K8/49</further-classification>  
        <further-classification edition="200601120260401B">A61K8/67</further-classification>  
        <further-classification edition="200601120260401B">A61Q11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商瑞瑟法瑪公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICERFARMA S.R.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切里尼　羅伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CERINI, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由硫辛酸或其鹽、螯合劑(例如乙二胺四乙酸(EDTA)之鹽或類似化合物)及具有長鏈脂肪酸之抗壞血酸酯，特別為棕櫚酸抗壞血酸酯所組成之錯合物，其抑制該由洛赫西定及其鹽所誘導之牙齒染色。除了脫色錯合物外，本發明之配方以凝膠、漱口水、牙膏或牙周噴霧等形式呈現時，可含有其他成分，例如玻尿酸或玻尿酸鹽、甘油磷酸膽鹼、甜味劑、香料、緩衝劑、增黏劑、黏膜黏附劑與成膜劑、溶劑、助溶劑及界面活性劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A complex consisting of lipoic acid or a salt thereof, a chelating agent such as a salt of ethylene diamine tetraacetic acid (EDTA) or analogous compounds and an ester of ascorbic acid with long-chain fatty acids, in particular ascorbyl palmitate inhibits the pigmentation of teeth induced by chlorhexidine and salts thereof. In addition to the depigmenting complex, the formulations of the invention, in the form of gels, mouthwashes, toothpastes or periodontal sprays, may contain other ingredients such as hyaluronic acid or hyaluronates, glycerophosphocholine, sweeteners, flavourings, buffering agents, viscosifying agents, mucoadhesive and filming agents, solvents, co-solvents, surfactants.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1501" publication-number="202628682"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628682.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D84/83</main-classification>  
        <further-classification edition="202501120260327B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李光永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KWANGYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIMYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪世基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, SEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括：閘極結構，在與半導體基板的上表面垂直的第一方向上延伸，閘極結構在與上表面平行的第二方向上排列，閘極結構在平行於上表面且垂直於第二方向的第三方向上延伸；主動區，設置於閘極結構的在第二方向上的兩側上；以及多個閘極內連線，電連接至閘極結構。所述多個閘極內連線包括在第一方向上設置於不同高度處的上部閘極互連線與下部閘極互連線，且半導體基板在第一方向上設置於上部閘極互連線與下部閘極互連線之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a gate structure extended in a first direction perpendicular to an upper surface of a semiconductor substrate, the gate structure being arranged in a second direction parallel to the upper surface, the gate structure extended in a third direction parallel to the upper surface and perpendicular to the second direction, active regions disposed on both sides of the gate structure in the second direction, and a plurality of gate interconnection lines electrically connected to the gate structure. The plurality of gate interconnection lines include an upper gate interconnection line and a lower gate interconnection line disposed at different heights in the first direction, and the semiconductor substrate is disposed between the upper gate interconnection line and the lower gate interconnection line in the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110、115:主動區/第一主動區</p>  
        <p type="p">120、125:主動區/第二主動區</p>  
        <p type="p">130:閘極結構</p>  
        <p type="p">131:閘極結構/閘極電極層</p>  
        <p type="p">132:閘極結構/閘極絕緣層</p>  
        <p type="p">133:閘極結構/閘極間隔件層</p>  
        <p type="p">140:上部閘極接觸件</p>  
        <p type="p">145:下部閘極接觸件</p>  
        <p type="p">X、Z:軸</p>  
        <p type="p">Y:軸/輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1502" publication-number="202626090"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626090.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用抗　FCRH5/抗　CD3　雙特異性抗體進行治療之給藥</chinese-title>  
        <english-title>DOSING FOR TREATMENT WITH ANTI-FCRH5/ANTI-CD3 BISPECIFIC ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K39/395</main-classification>  
        <further-classification edition="200601120260324B">C07K16/18</further-classification>  
        <further-classification edition="200601120260324B">C07K16/46</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商建南德克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENENTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范恩　伯納德　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINE, BERNARD MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>住吉亭子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMIYOSHI, TEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　夢松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MENGSONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫柏　詹姆士　尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOPER, JAMES NIALL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供使用抗片段可結晶受體樣 5 (FcRH5)/抗分化簇 3 (CD3) 雙特異性抗體治療癌症，諸如多發性骨髓瘤之給藥方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides methods of dosing for the treatment of cancers, such as multiple myelomas, with anti-fragment crystallizable receptor-like 5 (FcRH5)/anti-cluster of differentiation 3 (CD3) bispecific antibodies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1503" publication-number="202628544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260121B">H05K7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾詠傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖文祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供電子裝置。電子裝置包括基板、電子元件、散熱片、電路板、第一導電件及第一散熱件。基板具有上表面及下表面。電子元件設置於基板的上表面上。散熱片設置於電子元件上。電路板設置於基板的下表面上。第一導電件貫穿基板，並電性連接電子元件與電路板。第一散熱件貫穿基板及電路板，其中第一散熱件與散熱片進行熱交換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes a substrate, an electronic element, a heat sink, a circuit board, a first conductive element, and a first thermal element. The substrate has a first surface and a second surface opposite to each other. The electronic element is disposed on the first surface of the substrate. The heat sink is disposed on the electronic element. The circuit board is disposed on the second surface of the substrate. The first conductive element penetrates the substrate and electrically connects the electronic element and the circuit board. The first thermal element penetrates the substrate and the circuit board, wherein the first thermal element thermally exchanges with the heat sink.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:電子裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">10S1,20S1:上表面</p>  
        <p type="p">10S2,20S2:下表面</p>  
        <p type="p">100,102:介電層</p>  
        <p type="p">101:核心層</p>  
        <p type="p">20:電子元件</p>  
        <p type="p">20S3:側表面</p>  
        <p type="p">30:散熱片</p>  
        <p type="p">300:水平延伸部</p>  
        <p type="p">300C:凹部</p>  
        <p type="p">301:垂直延伸部</p>  
        <p type="p">40:電路板</p>  
        <p type="p">50:第一導電件</p>  
        <p type="p">51:第二導電件</p>  
        <p type="p">500:水平延伸件</p>  
        <p type="p">501:垂直延伸件</p>  
        <p type="p">60:第一散熱件</p>  
        <p type="p">600:第一部分</p>  
        <p type="p">601:第二部分</p>  
        <p type="p">70:黏接件</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1504" publication-number="202626744"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626744.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物、包含其的組合物、其用途及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08B37/08</main-classification>  
        <further-classification edition="200601120260401B">C08L5/08</further-classification>  
        <further-classification edition="200601120260401B">A61K8/73</further-classification>  
        <further-classification edition="200601120260401B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＥＬＣ　管理有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELC MANAGEMENT LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚继宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, JIZONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邓彬蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, BINWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹丰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周奂君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HUANJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於聚合物、包含其的組合物、所述聚合物或所述組合物用於個人護理品的用途及所述聚合物或所述組合物的製備方法。所述聚合物具有下式I的結構，其中R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;、R&lt;sub&gt;3&lt;/sub&gt;、R&lt;sub&gt;4&lt;/sub&gt;、R&lt;sub&gt;5&lt;/sub&gt;、Z如本文中定義，n的取值使得所述聚合物的數量平均分子量Mn為20,000至50,000，並且在所述聚合物中Se元素的原子含量為0.10%至10.00%，基於所述聚合物中除氫以外的原子的總量計。發明人發現，具有上述結構的改質多糖類聚合物(如透明質酸)除多糖類聚合物自身的性能(如保濕性能)之外還具有顯著改善的抗氧化能力。此外，通過將其與相同或類似結構但分子量不同的聚合物組合，二者在抗氧化方面產生協同作用。 &lt;br/&gt;&lt;img align="absmiddle" height="205px" width="289px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1505" publication-number="202626715"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626715.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132407</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗密連蛋白－ＴＬＲ促效劑免疫結合物及其用途</chinese-title>  
        <english-title>ANTI-CLAUDIN, TLR AGONIST IMMUNOCONJUGATES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07D223/18</further-classification>  
        <further-classification edition="200601120260401B">C07D495/04</further-classification>  
        <further-classification edition="200601120260401B">C07D487/04</further-classification>  
        <further-classification edition="200601120260401B">C07D471/04</further-classification>  
        <further-classification edition="200601120260401B">C07D513/04</further-classification>  
        <further-classification edition="200601120260401B">C07D491/048</further-classification>  
        <further-classification edition="200601120260401B">C07D498/04</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博特生物治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOLT BIOTHERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿克曼　雪莉　艾琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACKERMAN, SHELLEY ERIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿隆索　麥克　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALONSO, MICHAEL N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅　其林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, CHI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊爾　納森　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IHLE, NATHAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫迪爾卡　羅瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDIRKA, ROMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥特　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLET, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫尼爾　賈斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONNIER, JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博納特　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PONATH, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供式I免疫結合物，其包含藉由與一或多種類鐸受體(TLR)胺基-氮呯衍生物結合而連接之抗密連蛋白18.2抗體。本發明亦提供包含反應性官能基之TLR促效劑胺基-氮呯衍生物中間體組合物。此類中間體組合物為經由連接體或連接部分形成該等免疫結合物之適宜受質。本發明進一步提供用該等免疫結合物治療癌症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides immunoconjugates of Formula I comprising an anti-Claudin 18.2 antibody linked by conjugation to one or more toll-like receptor (TLR), amino-azepine derivatives. The invention also provides TLR agonist amino-azepine derivative intermediate compositions comprising a reactive functional group. Such intermediate compositions are suitable substrates for formation of the immunoconjugates through a linker or linking moiety. The invention further provides methods of treating cancer with the immunoconjugates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1506" publication-number="202627087"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627087.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>修飾的雙鏈核糖核酸及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商倍臻生物技術（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISIRNA THERAPEUTICS (SUZHOU) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸劍宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀輝君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HUIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒　曉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一類能夠增強抑制目標基因表現效果之dsRNA、其結合物、及其在製備治療相關疾病藥物中之應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1507" publication-number="202628937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測定方法、測定系統及檢查裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P74/00</main-classification>  
        <further-classification edition="202001120260324B">G01R31/26</further-classification>  
        <further-classification edition="200601120260324B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉金德蘭　蘇拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAJENDRAN, SOORAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種高精度地對測定對象與基準面的平行度進行測定之技術。 &lt;br/&gt;提供一種測定方法，係具有下述工序：將圖案投影到測定對象；接收由測定對象反射圖案後的第1反射圖案；將圖案投影到作為平行度的基準的基準面；接收由基準面反射圖案後的第2反射圖案；觀測第1反射圖案及第2反射圖案；以及根據第1反射圖案與第2反射圖案的差分對測定對象與基準面的平行度進行測定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1508" publication-number="202626472"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626472.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132419</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱形眼鏡包裝處理</chinese-title>  
        <english-title>CONTACT LENS PACKAGING PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B65G69/00</main-classification>  
        <further-classification edition="200601120260327B">B65G25/00</further-classification>  
        <further-classification edition="200601120260327B">B29D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比頓　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEATON, STEPHEN R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特蘭　董</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格洛弗　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOVER, JAMES D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勞福德　約瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRAWFORD, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉特　藍斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRATT, LANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">工業自動化系統可從隱形眼鏡包裝盒的本體分離其箔覆蓋片材以實現例如永續性措施（諸如回收、重新包裝盒、重新貼標、彈性儲存、及類似者）。該系統可包括壓機及夾具。該壓機可經組態以使一部分的包裝盒位移，以在包裝盒箔覆蓋片材與本體之間產生邊緣分離。該夾具可在邊緣分離處夾持片材及從本體拆離片材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An industrial automation system may separate a foil cover sheet of a contact lens package from its body to enable, for example, sustainable practices such as recycling, repackaging, relabeling, flexible storing, and the like. The system may include a press and a gripper. The press may be configured to displace a portion of the package to generate an edge separation between the package foil cover sheet and body. The gripper may grasp the sheet at the edge separation and detach the sheet from the body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:隱形眼鏡包裝盒</p>  
        <p type="p">302:本體</p>  
        <p type="p">304:覆蓋片材</p>  
        <p type="p">306:空腔</p>  
        <p type="p">310:周邊</p>  
        <p type="p">312:密封件</p>  
        <p type="p">316:空隙</p>  
        <p type="p">318:突片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1509" publication-number="202628620"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628620.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與奈米片介面之深度接觸</chinese-title>  
        <english-title>DEEP CONTACT WITH NANOSHEET INTERFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260326B">H10D30/01</main-classification>  
        <further-classification edition="202501120260326B">H10D30/67</further-classification>  
        <further-classification edition="202501120260326B">H10D64/66</further-classification>  
        <further-classification edition="202501120260326B">H10D62/10</further-classification>  
        <further-classification edition="202501120260326B">H10D62/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布瑞爾　尼可拉斯路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREIL, NICOLAS LOUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於形成環繞式閘極結構的源極-汲極接觸的方法包括在形成接觸的過程中暴露至少一部分奈米片。該方法可能包括去除源極-汲極材料，以形成至少一個奈米片材料的暴露部分，在源極-汲極材料及奈米片材料的暴露部分上形成磊晶接觸層，在至少磊晶接觸層上形成矽化物接觸層，以及在矽化物接觸層上形成金屬材料的接觸。在某些實施例中，奈米片材料的暴露部分包括至少一個奈米片的整個端部，單獨或與另一個奈米片的至少一部分結合，或與至少一個其他奈米片的整個端部結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a contact for a source-drain of a gate all around structure incorporates exposing at least a portion of a nanosheet during formation of the contact. A method may include removing a source-drain material to form an exposed portion of a nanosheet material of at least one nanosheet, forming epitaxial contact layers on the source-drain material and the exposed portion of the nanosheet material, forming a silicide contact layer on at least the epitaxial contact layers, and forming a contact with a metal material on the silicide contact layer. In some embodiments, an exposed portion of the nanosheet material comprises an entire end of at least one nanosheet alone or in conjunction with at least a portion of another nanosheet or in conjunction with an entire end of at least one other nanosheet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:基板</p>  
        <p type="p">204:閘極</p>  
        <p type="p">206:閘帽</p>  
        <p type="p">208:源極-汲極</p>  
        <p type="p">212:第二奈米片</p>  
        <p type="p">214:第三奈米片</p>  
        <p type="p">216:內部間隔物</p>  
        <p type="p">502:第一磊晶接觸層</p>  
        <p type="p">504:第二磊晶接觸層</p>  
        <p type="p">512:暴露的源極-汲極表面</p>  
        <p type="p">602:矽化物接觸層</p>  
        <p type="p">604:可用接觸寬度</p>  
        <p type="p">702:接觸金屬材料</p>  
        <p type="p">810:第一邊緣</p>  
        <p type="p">812:第二邊緣</p>  
        <p type="p">814:第三邊緣</p>  
        <p type="p">1000:視圖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1510" publication-number="202626049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>魯索替尼（ＲＵＸＯＬＩＴＩＮＩＢ）之醫藥學上可接受之鹽的局部皮膚調配物</chinese-title>  
        <english-title>TOPICAL SKIN FORMULATIONS OF A PHARMACEUTICALLY ACCEPTABLE SALT OF RUXOLITINIB</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/519</main-classification>  
        <further-classification edition="200601120260401B">A61K9/107</further-classification>  
        <further-classification edition="200601120260401B">A61K47/02</further-classification>  
        <further-classification edition="200601120260401B">A61K47/26</further-classification>  
        <further-classification edition="200601120260401B">A61K47/10</further-classification>  
        <further-classification edition="200601120260401B">A61K47/14</further-classification>  
        <further-classification edition="200601120260401B">A61K47/36</further-classification>  
        <further-classification edition="201701120260401B">A61K47/44</further-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英塞特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INCYTE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛利歐特　拉塞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELLIOTT, RUSSELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈　忠將</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, ZHONGJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞倫斯　蓋瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAWRENCE, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　平里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PINGLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　衛國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEIGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美樂尼　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELONI, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　永春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YONGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳惠方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HUIFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　家謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIACHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包括魯索替尼(ruxolitinib)之醫藥學上可接受之鹽之局部皮膚調配物，及用於治療皮膚病症之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to topical skin formulations comprising a pharmaceutically acceptable salt of ruxolitinib, and use in the treatment of skin disorders.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1511" publication-number="202626040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療方法</chinese-title>  
        <english-title>METHODS OF TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/454</main-classification>  
        <further-classification edition="200601120260401B">A61P25/18</further-classification>  
        <further-classification edition="200601120260401B">A61P25/16</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐羅克里生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　亞卡蘭　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, JASKARAN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供治療神經或精神疾病或病症之方法、治療與神經或精神疾病或病症相關聯之行為問題之方法、及改善有需要個體之神經或精神疾病或病症之行為及/或心理症狀的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are methods of treating a neurological or psychiatric disease or disorder, methods of treating behavioral problems associated with a neurological or psychiatric disease or disorder, and methods of improving behavioral and/or psychological symptoms of a neurological or psychiatric disease or disorder in a subject in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1512" publication-number="202628175"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628175.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高帶隙切換並聯電容器架構</chinese-title>  
        <english-title>HIGH BANDGAP SWITCHED SHUNT CAPACITOR ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">H01J37/32</main-classification>  
        <further-classification edition="200601120260324B">H03H7/38</further-classification>  
        <further-classification edition="200601120260324B">H03K17/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐文　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OWEN, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫姆　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMOU, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的實施例係關於一種裝置，該裝置包括具有第一端子、第一閘極和第二端子的第一電晶體。在實施例中，該裝置進一步包括具有第三端子、第二閘極和第四端子的第二電晶體。在實施例中，該第一電晶體的該第二端子藉由導電路徑與該第二電晶體的該第四端子電耦合，且該第三端子接地。在實施例中，電供應源與該第一電晶體的該第一端子電耦合。在實施例中，該裝置進一步包括與該導電路徑電耦合的電容器。在實施例中，電源與該導電路徑電耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a first transistor with a first terminal, a first gate, and a second terminal. In an embodiment, the apparatus further includes a second transistor with a third terminal, a second gate, and a fourth terminal. In an embodiment, the second terminal of the first transistor is electrically coupled to the fourth terminal of the second transistor by an electrically conductive path, and the third terminal is grounded. In an embodiment, a power supply is electrically coupled to the first terminal of the first transistor. In an embodiment, the apparatus further comprises a capacitor that is electrically coupled to the electrically conductive path. In an embodiment, a power source is electrically coupled to the electrically conductive path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108:接地線</p>  
        <p type="p">110:匹配</p>  
        <p type="p">112:板</p>  
        <p type="p">114:輸入</p>  
        <p type="p">115:級</p>  
        <p type="p">117:級</p>  
        <p type="p">118:輸出</p>  
        <p type="p">121:LC模組</p>  
        <p type="p">122:切換並聯電容器組</p>  
        <p type="p">123:切換並聯電容器組</p>  
        <p type="p">124:變容二極體</p>  
        <p type="p">125:切換並聯電容器組</p>  
        <p type="p">126:切換並聯電容器組</p>  
        <p type="p">127:切換並聯電容器組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1513" publication-number="202628996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>受遮蔽的互連結構及其形成方法、和半導體封裝件</chinese-title>  
        <english-title>SHIELDED INTERCONNECTION STRUCTURE, METHOD FOR FORMING THE SAME, AND SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10W42/20</main-classification>  
        <further-classification edition="202601120260324B">H10W70/60</further-classification>  
        <further-classification edition="202601120260324B">H10W70/65</further-classification>  
        <further-classification edition="202601120260324B">H10W74/10</further-classification>  
        <further-classification edition="202601120260324B">H10W74/01</further-classification>  
        <further-classification edition="202601120260324B">H10D80/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＪＣＥＴ星科金朋韓國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李喜秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HEESOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYEONCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及形成一種受遮蔽的互連結構、一種用於形成所述受遮蔽的互連結構的方法以及包括所述受遮蔽的互連結構的半導體封裝件。所述受遮蔽的互連結構可包括：介電基體，其具有頂表面、底表面和在所述頂表面與所述底表面之間延伸的側表面；多個導電柱，其延伸穿過所述介電基體；以及遮蔽層，其具有形成為整體的側向部分和頂部部分，其中所述遮蔽層的側向部分覆蓋所述介電基體的側表面，並且所述遮蔽層的頂部部分形成於所述介電基體的頂表面上以覆蓋所述多個導電柱中的第一組導電柱但暴露所述多個導電柱中的第二組導電柱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:互連結構</p>  
        <p type="p">122:介電基體</p>  
        <p type="p">124:導電柱</p>  
        <p type="p">126:遮蔽層</p>  
        <p type="p">126a:側向部分</p>  
        <p type="p">126b:頂部部分</p>  
        <p type="p">128:導電凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1514" publication-number="202626091"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626091.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＥｐＣＡＭ抗體、可活化抗體及免疫偶聯物以及其用途</chinese-title>  
        <english-title>EPCAM ANTIBODIES, ACTIVATABLE ANTIBODIES, AND IMMUNOCONJUGATES, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K39/395</main-classification>  
        <further-classification edition="200601120260324B">A61K39/00</further-classification>  
        <further-classification edition="200601120260324B">C07K16/28</further-classification>  
        <further-classification edition="200601120260324B">C07K16/18</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification>  
        <further-classification edition="201701120260324B">A61K47/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商免疫遺傳股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMMUNOGEN, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＣＹＴＯＭＸ生物製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYTOMX THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　義茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YIMAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希克斯　史都華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HICKS, STUART W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貴迪　辛西亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUIDI, CYNTHIA J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇立　尼拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHLI, NEERAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇滕登　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITTENDEN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍伯特　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMBERT, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>培德航加　瑪登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAIDHUNGAT, MADAN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽克特　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAGERT, JASON GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>提普頓　金柏利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIPTON, KIMBERLY ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　倩蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHANTY MARIATEGUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福克斯　伊蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX, ELLAINE ANNE MARIANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露大體係關於特異性結合人類EpCAM之抗體及抗體片段、EpCAM可活化抗體、及其免疫偶聯物，以及製備及使用該等抗體、抗體片段、可活化抗體及免疫偶聯物以用於診斷及治療疾病諸如癌症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure generally relates to antibodies and antibody fragments that specifically bind human EpCAM, EpCAM activatable antibodies, and immunoconjugates thereof, as well as, methods of making and using the antibodies, antibody fragments, activatable antibodies, and immunoconjugates, for the diagnosis and treatment of diseases such as cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1515" publication-number="202626041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>某些毒蕈鹼受體促效劑之投與方法</chinese-title>  
        <english-title>METHODS FOR ADMINISTRATION OF CERTAIN MUSCARINIC RECEPTOR AGONISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/454</main-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/18</further-classification>  
        <further-classification edition="200601120260401B">A61P25/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐羅克里生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　亞卡蘭　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, JASKARAN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供治療神經或精神疾病或病症之方法、治療與神經或精神疾病或病症相關聯之行為問題之方法、及改善有需要個體之神經或精神疾病或病症之行為及/或心理症狀的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are methods of treating a neurological or psychiatric disease or disorder, methods of treating behavioral problems associated with a neurological or psychiatric disease or disorder, and methods of improving behavioral and/or psychological symptoms of a neurological or psychiatric disease or disorder in a subject in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1516" publication-number="202628708"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628708.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有功率轉換結構之整合式微型ＬＥＤ顯示器</chinese-title>  
        <english-title>INTEGRATED MICROLED DISPLAY WITH POWER CONVERSION STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">H10F55/00</main-classification>  
        <further-classification edition="202501120260318B">H10F71/00</further-classification>  
        <further-classification edition="202501120260318B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商弗瑞爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUEREAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查吉　格拉姆瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAJI, GHOLAMREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於將功率轉換層或結構整合至實現微型LED的顯示器中。具體而言，本發明揭示三種主要的整合方法：將太陽能電池層壓至顯示器的背部，其中一單獨的太陽能電池層係層壓至該顯示器的底板表面，與透明像素區域對齊，以允許光採集；顯示器與太陽能電池共享的基材，其中顯示器層及太陽能電池層係在同一基材上製造，在同一側上或相反側上製造，降低厚度並簡化製造；及太陽能電池位在顯示器之頂部上，其中透明光伏材料係沉積在顯示器的前面上，在產生電力的同時作為保護層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to integration of power conversion layers or structure into the MicroLED enabled display. In particular, the invention discloses three principal integration methods, solar cell laminated to the back of the display wherein a separate solar cell layer is laminated to the display's backplane surface, aligned with transparent pixel areas to allow light harvesting, shared substrate for display and solar cell wherein display and solar cell layers are fabricated on the same substrate, either on the same side or on opposite sides, reducing thickness and simplifying manufacturing, and solar sell on top of the display wherein transparent photovoltaic materials are deposited on the front of the display, acting as a protective layer while generating power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:太陽能電池結構；基材；太陽能電池基材；太陽能電池</p>  
        <p type="p">104:基材；顯示器基材；共用基材；太陽能電池</p>  
        <p type="p">106:主動層；主動發光層</p>  
        <p type="p">108:透明區域</p>  
        <p type="p">110:主動層；太陽能電池主動層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1517" publication-number="202628235"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628235.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全固體二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260318B">H01M50/59</main-classification>  
        <further-classification edition="201001120260318B">H01M10/0562</further-classification>  
        <further-classification edition="201001120260318B">H01M10/0585</further-classification>  
        <further-classification edition="200601120260318B">H01M4/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角田啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUNODA, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山内英郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAUCHI, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>益田紀彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, NORIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永金知浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAKANE, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平塚雅史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATSUKA, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種不易於正極側集電構件與負極側集電構件之間產生短路之全固體二次電池。 &lt;br/&gt;本發明之全固體二次電池1具備：蓄電元件2，其具有固體電解質層3、正極層4、及負極層5；第1集電體層6，其設置於蓄電元件2之一側之主面上；第2集電體層7，其設置於蓄電元件2之另一側之主面上；及密封層8，其設置於第1集電體層6與第2集電體層7之間，將蓄電元件2密封；且於俯視下，密封層8之外周緣8a配置於較第1集電體層6之外周緣6a更外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1518" publication-number="202628236"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628236.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全固體二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260318B">H01M50/59</main-classification>  
        <further-classification edition="201001120260318B">H01M10/0562</further-classification>  
        <further-classification edition="201001120260318B">H01M10/0585</further-classification>  
        <further-classification edition="200601120260318B">H01M4/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角田啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUNODA, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山内英郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAUCHI, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>益田紀彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, NORIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永金知浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAKANE, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平塚雅史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATSUKA, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種不易於正極側集電體與負極側集電體之間產生短路之全固體二次電池。 &lt;br/&gt;本發明之全固體二次電池1具備：蓄電元件2，其具有固體電解質層3、正極層4、及負極層5；第1集電體層6，其設置於蓄電元件2之一側之主面2a上；第2集電體層7，其設置於蓄電元件2之另一側之主面2b上；及密封層8，其設置於第1集電體層6與第2集電體層7之間，將蓄電元件2密封；且密封層8具有第1密封層部分9、第2密封層部分10、及體積電阻高於第1密封層部分9及第2密封層部分10之絕緣層部分11，於密封層8之厚度方向上，於第1密封層部分9及第2密封層部分10之間設置有絕緣層部分11。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1519" publication-number="202628598"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628598.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有形成在其上的多組元件的插入器裝置</chinese-title>  
        <english-title>INTERPOSER DEVICES HAVING MULTIPLE SETS OF COMPONENTS FORMED THEREON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10B80/00</main-classification>  
        <further-classification edition="202601120260324B">H10W70/60</further-classification>  
        <further-classification edition="202601120260324B">H10W70/65</further-classification>  
        <further-classification edition="202601120260324B">H10W70/685</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇魯沃盧　希夫庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRUVOLU, SHIVKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班薩利　阿密特Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHANSALI, AMEET S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維哈佛貝可　史帝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERHAVERBEKE, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例涉及具有多組形成在其上的元件的插入器裝置。舉例來說，插入器裝置可以包括核心基板、形成在核心基板中的至少一個嵌入元件，以及至少一個重分配層（RDL），該重分配層位於核心基板的第一表面或相對於第一表面的第二表面之至少一個上。作為另一個例子，插入器裝置可以包括第一核心、與第一核心混合鍵合的第二核心、第一RDL和第二RDL。第一核心和第二核心位於第一RDL和第二RDL之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure relate to interposer devices with multiple sets of components formed thereon. For example, an interposer device can include a core substrate, at least one embedded component formed within the core substrate, and at least one redistribution layer (RDL) on at least one of a first surface of the core substrate or a second surface of the core substrate opposite the first surface. As another example, an interposer device can include a first core, a second core hybrid bonded to the first core, a first RDL, and a second RDL. The first core and the second core are located between the first RDL and the second RDL.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110-1:非嵌入元件</p>  
        <p type="p">110-2:非嵌入元件</p>  
        <p type="p">110-3:非嵌入元件</p>  
        <p type="p">110-4:非嵌入元件</p>  
        <p type="p">120-1:非嵌入元件</p>  
        <p type="p">120-2:非嵌入元件</p>  
        <p type="p">130:裝置</p>  
        <p type="p">132:核心基板</p>  
        <p type="p">134:RDL</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1520" publication-number="202627703"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627703.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132489</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發電廠控制系統、發電廠控制方法，以及發電廠控制程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G05B13/04</main-classification>  
        <further-classification edition="200601120260325B">G05B13/02</further-classification>  
        <further-classification edition="201901120260325B">G06N20/10</further-classification>  
        <further-classification edition="200601120260325B">F01K13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鹿島淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江﨑正敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESAKI, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊波　林得羅秀雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IHA, LEANDROHIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>照井拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERUI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案係關於一種發電廠控制系統，其用以控制以藉由鍋爐裝置所生成之蒸氣驅動連結至發電機之渦輪，而藉此能夠發電之發電廠。本系統，係使用藉由將發電廠之運轉資料作為學習資料之機械學習所架構之預測模型，預測對應於運轉資料之前述發電廠之流程值，並根據前述流程值使前述發電廠之操作條件最佳化，藉此求取最佳化操作條件。最佳化操作條件，係與發電廠之運轉狀態建立關聯對應並記憶於記憶部。在判定對應於記憶在記憶部之發電廠之運轉狀態的過去之最佳化操作條件，能夠運用作為操作條件之情形，將過去之最佳化操作條件設定作為前述操作條件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發電廠控制系統</p>  
        <p type="p">2:發電廠</p>  
        <p type="p">4:鍋爐</p>  
        <p type="p">6:蒸氣渦輪</p>  
        <p type="p">8:發電機</p>  
        <p type="p">10:燃料供給系統</p>  
        <p type="p">12:空氣供給系統</p>  
        <p type="p">16:冷凝器</p>  
        <p type="p">18:供水泵浦</p>  
        <p type="p">20:燃料溫度感測器</p>  
        <p type="p">22:空氣溫度感測器</p>  
        <p type="p">24:蒸氣溫度感測器</p>  
        <p type="p">26:蒸氣壓力感測器</p>  
        <p type="p">28:冷凝水溫度感測器</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">200:控制支援裝置</p>  
        <p type="p">202:運轉資料取得部</p>  
        <p type="p">204:預測模型架構部</p>  
        <p type="p">206:最佳化部</p>  
        <p type="p">208:記憶部</p>  
        <p type="p">210:操作條件設定部</p>  
        <p type="p">A:空氣</p>  
        <p type="p">D:發電指令值</p>  
        <p type="p">F:燃料</p>  
        <p type="p">S:蒸氣</p>  
        <p type="p">Ta:空氣A之溫度</p>  
        <p type="p">Tf:燃料F之溫度</p>  
        <p type="p">Tk:冷凝水之溫度</p>  
        <p type="p">Ps:蒸氣S之壓力</p>  
        <p type="p">Ts:蒸氣S之溫度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1521" publication-number="202626622"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626622.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>咪唑并[4,5-B]吡啶AKT1抑制劑之製備</chinese-title>  
        <english-title>PREPARATION OF IMIDAZO[4,5-B]PYRIDINE AKT1 INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/14</main-classification>  
        <further-classification edition="200601120260401B">C07D471/04</further-classification>  
        <further-classification edition="200601120260401B">C07F5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞特羅姆醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALTEROME THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞迪　賈亞錢德拉　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REDDY, JAYACHANDRA P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供用於製備AKT1調節劑及化學中間體之方法及試劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods and reagents for the preparation of AKT1 modulators and chemical intermediates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1522" publication-number="202626048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用嘧啶二酮化合物治療肥厚性心肌症</chinese-title>  
        <english-title>TREATMENT OF HCM WITH PYRIMIDINEDIONE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61K31/513</main-classification>  
        <further-classification edition="200601120260331B">A61P9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商邁奧卡迪亞公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MYOKARDIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽米葛恩　馬可　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMIGRAN, MARC J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　朱恩　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNE H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍賓　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMBING, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛林　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREEN, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾文奇克　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVANCHIK, MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾森　湯姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARLSON, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　中偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於治療肥厚性心肌症及舒張功能障礙之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are methods for treating hypertrophic cardiomyopathy and diastolic dysfunction.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1523" publication-number="202626191"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626191.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生氫氣的裝置、系統和方法</chinese-title>  
        <english-title>APPARATUSES, SYSTEMS, AND METHODS FOR GENERATING HYDROGEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B01J19/08</main-classification>  
        <further-classification edition="200601120260318B">B01J19/12</further-classification>  
        <further-classification edition="202601120260318B">C01B3/02</further-classification>  
        <further-classification edition="202101120260318B">C25B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商奎甫解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QWAVE SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴達克　傑弗瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BADAC, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康羅伊　韋斯利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONROY, WESLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬魯夫　納迪姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALUF, NADIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅利　克利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RALEIGH, CLIFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施萊格爾　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHLAEGLE, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯勞根豪　雅各</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLAUGENHAUPT, JACOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特羅亞諾　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TROIANO, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">製造產品之方法，諸如包含以電磁輻射照射感受器材料，以及使該感受器材料與流體接觸以製造產品之方法。照射感受器材料可產生電流、場、及/或產生熱，其可使流體或其組分發生化學反應。裝置及系統，其包含配置於容器中之感受器材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of producing a product, such as methods that include irradiating a susceptor material with electromagnetic radiation, and contacting the susceptor material and a fluid to produce the product. The irradiating of the susceptor material may produce an electric current, a field, and/or generate heat, which can effect a chemical reaction of the fluid or a component thereof. Apparatuses and systems, which include a susceptor material disposed in a container. &lt;b&gt;  &lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:感受器材料</p>  
        <p type="p">120:流體</p>  
        <p type="p">130:電磁輻射</p>  
        <p type="p">140:產品</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1524" publication-number="202626708"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626708.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療或預防骨質疏鬆症及低骨量之方法</chinese-title>  
        <english-title>METHODS OF TREATING OR PREVENTING OSTEOPOROSIS AND LOW BONE MASS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/22</main-classification>  
        <further-classification edition="200601120260401B">C07K16/18</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P19/00</further-classification>  
        <further-classification edition="200601120260401B">A61P19/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安濟盛有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANGITIA INCORPORATED LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登特　里卡多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENT, RICARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪爾　威拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DERE, WILLARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯　華珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, HUA ZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　宜龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯　娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, JUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案提供使用方法，具體而言治療人類個體之疾病、病症或疾患(例如低骨量疾患，諸如骨質疏鬆症)之方法，該等方法包括投與結合至骨硬化素及DKK-1兩者之新穎雙特異性抗體(例如抗骨硬化素×抗DKK-1雙特異性抗體)。本申請案亦提供增加人類個體之骨礦物質密度之方法，該等方法包括投與新穎抗骨硬化素×抗DKK-1雙特異性抗體。本申請案進一步提供降低人類個體之骨折(例如骨質疏鬆性骨折)風險之方法，該等方法包括投與新穎抗骨硬化素×抗DKK-1雙特異性抗體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides methods of use, specifically methods of treatment of a disease, disorder, or condition (e.g., a low bone mass condition such as osteoporosis) in a human individual, comprising administration of novel bispecific antibodies that bind to both sclerostin and DKK-1 (e.g., anti-Sclerostin × anti-DKK-1 bispecific antibodies). The present application also provides methods of increasing bone mineral density in a human individual comprising administration of novel anti-Sclerostin × anti-DKK-1 bispecific antibodies. The present application further provides methods of reducing risk of bone fracture (e.g., osteoporotic fracture) in a human individual comprising administration of novel anti-Sclerostin × anti-DKK-1 bispecific antibodies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1525" publication-number="202626840"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626840.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化劑組成物、收容有該硬化劑組成物之容器、熱硬化性組成物套組、熱硬化性組成物之製造方法、熱硬化性組成物之硬化物、以及硬化劑組成物之輸送及保存方法</chinese-title>  
        <english-title>CURING AGENT COMPOSITION, CONTAINER CONTAINING THE CURING AGENT COMPOSITION, THERMOSETTING COMPOSITION KIT, METHOD FOR PRODUCING A THERMOSETTING COMPOSITION, CURED PRODUCT OF A THERMOSETTING COMPOSITION, AND METHOD FOR TRANSPORTING AND STORING A CURING AGENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08G59/66</main-classification>  
        <further-classification edition="201601120260319B">C08G75/045</further-classification>  
        <further-classification edition="200601120260319B">C08K5/37</further-classification>  
        <further-classification edition="200601120260319B">C08L63/00</further-classification>  
        <further-classification edition="200601120260319B">C08L33/08</further-classification>  
        <further-classification edition="200601120260319B">B05D7/24</further-classification>  
        <further-classification edition="200601120260319B">C09K3/10</further-classification>  
        <further-classification edition="202601120260319B">H10W74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>目黒健斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEGURO, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩谷一希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAYA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可用於半導體裝置或電子零件用之雙液或多液型的熱硬化性組成物之硫醇系硬化劑組成物、收容有該硬化劑組成物之容器、熱硬化性組成物套組、熱硬化性組成物之製造方法、熱硬化性組成物之硬化物、以及硫醇系硬化劑組成物之輸送及保存方法。 &lt;br/&gt;提供一種硬化劑組成物、收容有該硬化劑組成物之容器、熱硬化性組成物套組、熱硬化性組成物之製造方法、熱硬化性組成物之硬化物、以及硬化劑組成物之輸送及保存方法，該硬化劑組成物係含有(A)不具有酯鍵之硫醇化合物、(B)熱潛性硬化觸媒、及(C)水之硬化劑組成物， &lt;br/&gt;前述硬化劑組成物中之前述(C)水的含量為10至15000ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a thiol-based curing agent composition for use in a two-component or multi-component thermosetting composition for semiconductor devices or electronic components, a container containing the curing agent composition, a thermosetting composition kit, a method for producing the thermosetting composition, a cured product of the thermosetting composition, and a method for transporting and storing the thiol-based curing agent composition. &lt;br/&gt;Provided are a curing agent composition, a container containing the curing agent composition, a thermosetting composition kit, a method for producing the thermosetting composition, a cured product of the thermosetting composition, and a method for transporting and storing the curing agent composition, wherein the curing agent composition comprises: (A) a thiol compound having no ester linkage; (B) a thermally latent curing catalyst; and (C) water, and wherein a content of the (C) water in the curing agent composition is 10 to 15,000 ppm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1526" publication-number="202627475"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627475.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132550</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療內皮功能障礙之DPP3結合劑</chinese-title>  
        <english-title>DPP3 BINDERS FOR THE TREATMENT OF ENDOTHELIAL DYSFUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G01N33/68</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">C07K16/40</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P13/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商4ＴＥＥＮ4製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>4TEEN4 PHARMACEUTICALS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯格曼　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERGMANN, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之標的為用於治療或預防患者之內皮功能障礙的DPP3結合劑，其中自該患者獲得之體液樣品中腎上腺髓素原或其片段之含量高於臨限值，以及對用DPP3結合劑治療患者進行療法指導或療法分層或療法監測之方法，該等方法包含：提供該患者之體液樣品；測定該樣品中腎上腺髓素原或其片段之含量；及將該腎上腺髓素原或其片段之含量與臨限值進行比較；其中該樣品中腎上腺髓素原或其片段之含量高於該臨限值係指示該患者需要用DPP3結合劑治療，或其中若該樣品中該腎上腺髓素原或其片段之含量高於該臨限值，則用DPP3結合劑治療該患者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Subject of the invention are DPP3 binders for use in therapy or prevention of endothelial dysfunction in a patient wherein the level of Pro-Adrenomedullin or a fragment thereof in a sample of bodily fluid obtained from said patient is above a threshold, as well as methods of therapy guidance or therapy stratification or therapy monitoring of a treatment of a patient with a DPP3 binder, the methods comprising: providing a sample of bodily fluid of said patient; determining the level of Pro-Adrenomedullin or a fragment thereof in said sample; and comparing said level of Pro-Adrenomedullin or a fragment thereof to a threshold; wherein the level of Pro-Adrenomedullin or a fragment thereof in said sample being above said threshold is indicative that said patient requires treatment with a DPP3 binder, or wherein if said level of Pro-Adrenomedullin or a fragment thereof in said sample is above said threshold, said patient is treated with a DPP3 binder.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1527" publication-number="202627539"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627539.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像鏡頭、相機模組及電子裝置</chinese-title>  
        <english-title>IMAGING LENS ASSEMBLY, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G02B5/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴昱辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YU-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾德生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, TE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像鏡頭，包含複數透鏡及一可調式光圈組。透鏡沿一光軸依序排列。可調式光圈組設置於透鏡的一物側，可調式光圈組包含複數可轉動遮光片，可轉動遮光片環繞光軸排列並形成一可調式通光孔，各可轉動遮光片包含一像側表面及一物側表面，像側表面面向透鏡，物側表面與像側表面相對設置。像側表面包含一漸縮面，設置於像側表面靠近光軸的一側，漸縮面沿靠近光軸的方向逐漸靠近物側表面。藉此，以降低透鏡被光圈損壞的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens assembly includes a plurality of lens elements and an adjustable aperture group. The lens elements are arranged in sequence along an optical axis. The adjustable aperture group is disposed on an object side of the lens elements. The adjustable aperture group includes a plurality of rotatable light blocking sheets, which are arranged around the optical axis and form an adjustable light-through hole. Each of the rotatable light blocking sheets includes an image-side surface and an object-side surface, the image-side surface faces the lens elements, and the object-side surface is disposed opposite to the image-side surface. The image-side surface includes a tapered surface, which is disposed on a side of the image-side surface close to the optical axis, and the tapered surface gradually approaches the object-side surface along a direction close to the optical axis. Therefore, the risk of the lens elements being damaged by the aperture is reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:相機模組</p>  
        <p type="p">101:成像鏡頭</p>  
        <p type="p">109:電子感光元件</p>  
        <p type="p">111:第一透鏡</p>  
        <p type="p">112:透鏡</p>  
        <p type="p">117:鏡筒</p>  
        <p type="p">120:可調式光圈組</p>  
        <p type="p">130:可轉動遮光片</p>  
        <p type="p">180:濾光片</p>  
        <p type="p">190:成像面</p>  
        <p type="p">Z1:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1528" publication-number="202626036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含HER2/mutEGFR抑制劑之結晶型式之穩定固體醫藥劑型及其製備方法</chinese-title>  
        <english-title>STABLE SOLID PHARMACEUTICAL DOSAGE FORM COMPRISING CRYSTALLINE FORM OF HER2/MUTEGFR INHIBITOR AND PROCESS FOR ITS PREPARATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/444</main-classification>  
        <further-classification edition="200601120260401B">A61K47/38</further-classification>  
        <further-classification edition="200601120260401B">A61K47/26</further-classification>  
        <further-classification edition="200601120260401B">A61K47/32</further-classification>  
        <further-classification edition="200601120260401B">A61K47/12</further-classification>  
        <further-classification edition="200601120260401B">A61K47/04</further-classification>  
        <further-classification edition="200601120260401B">A61K9/32</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商拜耳廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYER AKTIENGESELLSCHAFT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班克　羅克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIBANC, ROK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼加爾　哈里斯　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGAL, HARESS AHMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬瑟夫　詹　菲利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSEPH, JAN FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施韋達　珊卓　伊莎貝爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWEDA, SANDRA ISABEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於： &lt;br/&gt;●  一種錠劑調配物，其包含式(A)化合物3-(3-氯-2-甲氧基-苯胺基)-2-[3-[[(2S)-1,4-二㗁烷-2-基]甲氧基]-4-吡啶基]-1,5,6,7-四氫吡咯并[3,2-c]吡啶-4-酮的結晶水合物1變體A型式： &lt;br/&gt;&lt;img align="absmiddle" height="231px" width="145px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;&lt;br/&gt;●  其中，水含量大於該式(A)化合物之總重量的0% (w/w)、尤其大於0%且小於或等於4%； &lt;br/&gt;●  製備該錠劑調配物之方法，以及 &lt;br/&gt;●  該錠劑調配物在防治疾病及/或治療疾病中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates: &lt;br/&gt;● to a tablet formulation comprising crystalline Hydrate 1 Modification A form of the compound 3-(3-chloro-2-methoxy-anilino)-2-[3-[[(2S)-1,4-dioxan-2-yl]methoxy]-4-pyridyl]-1,5,6,7-tetrahydropyrrolo[3,2-c]pyridine-4-one, of formula (A): &lt;br/&gt;&lt;img align="absmiddle" height="231px" width="146px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;&lt;br/&gt;● wherein the content of water is greater than 0% (w/w), particularly greater than 0% and less than or equal to 4%, of the total weight of said compound of formula (A); &lt;br/&gt;● to methods of preparing said tablet formulation, and &lt;br/&gt;● to uses of said tablet formulation in the prophylaxis and/or treatment of diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1529" publication-number="202626943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>密封用樹脂組成物及半導體模組</chinese-title>  
        <english-title>SEALING RESIN COMPOSITION AND SEMICONDUCTOR MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08L63/00</main-classification>  
        <further-classification edition="200601120260319B">C08G59/62</further-classification>  
        <further-classification edition="200601120260319B">C08K5/5419</further-classification>  
        <further-classification edition="200601120260319B">C08K5/3415</further-classification>  
        <further-classification edition="202601120260319B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口翔平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野崎晃広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOZAKI, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種密封用樹脂組成物，含有：硬化性樹脂成分、無機填充材、彈性體成分、以及馬來醯亞胺化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sealing resin composition includes a curable resin component, an inorganic filler, an elastomer component, and a maleimide compound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:功率半導體晶片</p>  
        <p type="p">2:第一接合層</p>  
        <p type="p">3:金屬電路基板</p>  
        <p type="p">4:第二接合層</p>  
        <p type="p">5:金屬冷卻器</p>  
        <p type="p">6:密封材</p>  
        <p type="p">7:引線框架</p>  
        <p type="p">10:功率模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1530" publication-number="202628176"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628176.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置、電源系統及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H01J37/32</main-classification>  
        <further-classification edition="200601120260318B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輿水地塩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHIMIZU, CHISHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上坂友佑人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所揭示之電漿處理裝置包含腔室、基板支持部、RF電源、匹配器及控制部。匹配器包含連接於RF電源與高頻電極之間之可變電容器。RF電源構成為於電漿處理期間，根據源RF信號之反射程度，使源RF信號之源頻率變化，以降低該反射程度。控制部構成為控制可變電容器，以將匹配器之可變電容器之電容設定為以電漿處理期間內之至少穩定期間之源頻率之變動範圍包含於RF電源之源頻率之建議變動範圍內的方式預先設定之電容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">10:腔室</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">50:電源系統</p>  
        <p type="p">50c:控制部</p>  
        <p type="p">50m:記憶裝置</p>  
        <p type="p">50t:表</p>  
        <p type="p">51:RF電源</p>  
        <p type="p">52:偏壓電源</p>  
        <p type="p">53:匹配器</p>  
        <p type="p">54:匹配器</p>  
        <p type="p">55:感測器</p>  
        <p type="p">56:感測器</p>  
        <p type="p">531:可變電容器</p>  
        <p type="p">532:可變電容器</p>  
        <p type="p">EB:電偏壓</p>  
        <p type="p">HF:源RF信號</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1531" publication-number="202628056"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628056.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於LCD和OLED顯示器的閘極驅動器陣列（GOA）與像素電路中的薄膜電晶體（TFT）結構和電訊號連接</chinese-title>  
        <english-title>TFT STRUCTURES AND ELECTRICAL SIGNAL CONNECTIONS IN GOA AND PIXEL CIRCUITS FOR LCD AND OLED DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260325B">G09G3/3233</main-classification>  
        <further-classification edition="201601120260325B">G09G3/3266</further-classification>  
        <further-classification edition="202301120260325B">H10K59/121</further-classification>  
        <further-classification edition="202301120260325B">H10K59/131</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金正培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUNG BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任東吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, DONG KIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　壽永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴良浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, YANG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　魯德尼順良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, RODNEY SHUNLEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范德久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, DEJIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩西奇　米蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PESIC, MILAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾特蘭多　巴斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELTRANDO, BASTIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">該電路包括開關型薄膜電晶體（TFT），該開關型TFT具有基於直流（DC）電壓值的閾值電壓，與該開關型TFT耦接的驅動TFT，以及位於開關型TFT和驅動TFT之間的儲存電容，還有具有與驅動TFT耦接的陽極的有機發光二極體（OLED）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit includes a switching thin film transistor (TFT), the switching TFT having a threshold voltage that is based on a value of a direct current (DC) voltage, a driving TFT coupled to the switching TFT, a storage capacitor disposed between the switching TFT and the driving TFT, and an organic light-emitting diode (OLED) having an anode coupled to the driving TFT.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1300A:子像素電路</p>  
        <p type="p">C1:儲存電容</p>  
        <p type="p">C2:負載電容</p>  
        <p type="p">n1:節點</p>  
        <p type="p">T1:開關型TFT</p>  
        <p type="p">T1_BG:背閘電極</p>  
        <p type="p">T1_D:汲電極</p>  
        <p type="p">T1_S:源電極</p>  
        <p type="p">T1_TG:頂部閘電極</p>  
        <p type="p">V&lt;sub&gt;DATA&lt;/sub&gt;:資料訊號</p>  
        <p type="p">V&lt;sub&gt;DC&lt;/sub&gt;:直流電壓</p>  
        <p type="p">V&lt;sub&gt;SCAN1&lt;/sub&gt;:掃描訊號</p>  
        <p type="p">V&lt;sub&gt;SS1&lt;/sub&gt;:供應電壓</p>  
        <p type="p">V&lt;sub&gt;SS2&lt;/sub&gt;:供應電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1532" publication-number="202627690"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627690.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132630</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源設備、曝光設備及物品製造方法</chinese-title>  
        <english-title>LIGHT SOURCE APPARATUS, EXPOSURE APPARATUS, AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G03F7/20</main-classification>  
        <further-classification edition="202601120260316B">H10H29/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤真寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, MAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光源設備包括：元件陣列，在所述元件陣列中排列多個發光元件，其中，所述多個發光元件包括：第一發光元件；以及第二發光元件，其具有與所述第一發光元件的溫度特性不同的溫度特性，所述溫度特性指示元件溫度與峰值波長之間的關係，並且所述第一發光元件和所述第二發光元件是根據所述元件陣列中的溫度不均勻性而排列的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light source apparatus includes an element array in which a plurality of light emitting elements are arrayed, wherein the plurality of light emitting elements include a first light emitting element, and a second light emitting element having temperature characteristic, which indicates a relationship between an element temperature and a peak wavelength, different from a temperature characteristic of the first light emitting element, and the first light emitting element and the second light emitting element are arrayed in accordance with temperature unevenness in the element array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發光元件</p>  
        <p type="p">2:引線</p>  
        <p type="p">3:元件陣列</p>  
        <p type="p">4:電源</p>  
        <p type="p">7:控制器</p>  
        <p type="p">8:處理器</p>  
        <p type="p">9:儲存器</p>  
        <p type="p">10:光源設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1533" publication-number="202626852"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626852.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱塑性樹脂及含有其之光學透鏡</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C08G64/16</main-classification>  
        <further-classification edition="200601120260327B">G02B1/04</further-classification>  
        <further-classification edition="200601120260327B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤宣之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, NORIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西森克吏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMORI, KATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂木篤志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTEGI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原健太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福井聖志郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUI, KIYOSHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田祐太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於可提供含有來自下述一般式(1)所示二醇之構成單位(A)、來自下述一般式(2)所示二醇之構成單位(B)，以及來自下述一般式(3)所示二醇之構成單位(C)之熱塑性樹脂。 &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="330px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(一般式(1)中，R&lt;sub&gt;e&lt;/sub&gt;及R&lt;sub&gt;f&lt;/sub&gt;各自獨立表示氫原子、鹵素原子等，Y&lt;sub&gt;2&lt;/sub&gt;表示單鍵、可具有取代基的芴基等，E&lt;sub&gt;2&lt;/sub&gt;及F&lt;sub&gt;2&lt;/sub&gt;各自獨立表示可具有取代基的碳數1~5的伸烷基，t及u各自獨立表示0~4的整數，e及f各自獨立表示0~10的整數。) &lt;br/&gt;&lt;img align="absmiddle" height="106px" width="236px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(一般式(2)中，R表示氫原子，或碳數1~4的烷基。) &lt;br/&gt;&lt;img align="absmiddle" height="159px" width="255px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(一般式(3)中，Rz及Rx係各自獨立地表示氫原子，或碳數1~3的烷基，i表示2~16的整數，p表示1~600的整數。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1534" publication-number="202628871"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628871.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>第一基板與第二基板之接合方法、用於其之基板固持器及使用基板固持器之裝置</chinese-title>  
        <english-title>METHOD OF BONDING A FIRST SUBSTRATE TO A SECOND SUBSTRATE, SUBSTRATE HOLDER FOR SUCH A METHOD AND DEVICE WITH SUCH A SUBSTRATE HOLDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P72/00</main-classification>  
        <further-classification edition="202601120260316B">H10P72/76</further-classification>  
        <further-classification edition="202601120260316B">H10P72/70</further-classification>  
        <further-classification edition="202601120260316B">H10P10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EV GROUP E. THALLNER GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦根萊特那　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAGENLEITNER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇那　多民尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZINNER, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅琳格　哈拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROHRINGER, HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接合方法，用於將第一基板接合至第二基板，其中，當第一基板被接合至第二基板時，在第一子區段與第二子區段之間產生沿接合方向行進之接合波，在第一子區段中，第一基板與第二基板接合，且在第二子區段中，第一基板與第二基板待接合，其中，在第二子區段中，第一基板包含主要區段且第二基板包含次要區段，其中，藉由加壓元件，尤指區段性地，對主要區段及/或次要區段施加正向壓力，藉以使主要區段與次要區段彼此相向移動並在接合期間影響接合波之進程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for bonding a first substrate to a second substrate (10), wherein, when bonding the first substrate to the second substrate, a bond wave advancing along a bonding direction is generated between a first subsection, in which the first substrate and the second substrate are bonded, and a second subsection, in which the first substrate and the second substrate are to be bonded more, is formed, wherein in the second subsection the first substrate comprises a primary section and the second substrate comprises a secondary section, wherein by means of a pressure element positive pressure is exerted on the primary section and/or the secondary section at a side facing a substrate holder in order to move the primary section and the secondary section towards each other and to influence the course of the bond wave during bonding.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:加壓元件</p>  
        <p type="p">11r:右接合波片段</p>  
        <p type="p">11l:左接合波片段</p>  
        <p type="p">15:接觸元件</p>  
        <p type="p">21:主要區段</p>  
        <p type="p">22:次要區段</p>  
        <p type="p">T1:第一子區段</p>  
        <p type="p">T2:第二子區段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1535" publication-number="202627101"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627101.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對肝臟去靶向的肌肉向性殼體</chinese-title>  
        <english-title>LIVER DE-TARGETED MUSCLE TROPIC CAPSIDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N15/86</main-classification>  
        <further-classification edition="200601120260401B">C07K14/005</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱特治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATE THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯謝德里　沙奧拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SESHADRI, SAURAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔必包德巴爾　謝里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABEBORDBAR, SHARIF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了新型殼體變體，該新型殼體變體包含含有胺基酸序列RGDR（SEQ ID NO: 4286）或RGDY（SEQ ID NO: 4287）的第一胺基酸序列和含有胺基酸序列RGD的第二胺基酸序列。該等新型殼體變體對肝臟組織去靶向並且靶向肌肉和心臟組織。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides novel capsid variants comprising a first amino acid sequence comprising the amino acid sequence RGDR (SEQ ID NO: 4286) or RGDY (SEQ ID NO: 4287) and a second amino acid sequence comprising the amino acid sequence RGD. These novel capsid variants de-target liver tissue and target muscle and heart tissue.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1536" publication-number="202626658"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626658.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹枝狀聚合物偶聯物及其製備方法</chinese-title>  
        <english-title>DENDRITIC POLYMER CONJUGATE AND ITS PREPARATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C07D491/22</main-classification>  
        <further-classification edition="200601120260325B">C07K16/28</further-classification>  
        <further-classification edition="201701120260325B">A61K47/68</further-classification>  
        <further-classification edition="201701120260325B">A61K47/60</further-classification>  
        <further-classification edition="200601120260325B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州拓界醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU RENOLYNX THERAPEUTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祝令建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, LINGJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管忠俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUAN, ZHONGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楚占芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, ZHANFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁家琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, JIAQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任文明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, WENMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種樹枝狀聚合物偶聯物及其製備方法。具體地，本揭露涉及一種樹枝狀聚合物偶聯物或其可藥用鹽及其在醫藥上的應用。該偶聯物包含負載藥物及藥物代謝動力學修飾劑的樹枝狀聚合物，以及與樹枝狀聚合物偶聯的抗體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a dendritic polymer conjugate and its preparation method. Specifically, the present disclosure relates to a dendritic polymer conjugate or its pharmaceutically acceptable salt and its application in medicine. The conjugate comprises a dendritic polymer loaded with drugs and pharmacokinetic modifiers, as well as an antibody coupled to the dendritic polymer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1537" publication-number="202626693"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626693.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於肽之ＰＴＰ１Ｂ／ＮＣＫ１相互作用抑制劑及其製備與使用方法</chinese-title>  
        <english-title>PEPTIDE-BASED INHIBITORS OF PTP1B / NCK1 INTERACTION AND METHODS OF MAKING AND USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K7/06</main-classification>  
        <further-classification edition="201901120260401B">A61K38/08</further-classification>  
        <further-classification edition="200601120260401B">A61P3/04</further-classification>  
        <further-classification edition="200601120260401B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商拉德萊製藥有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RADELLA PHARMACEUTICALS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達安吉羅　瑟吉歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DALL'ANGELO, SERGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈默　梅根　瑪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMER, MEGHAN MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬汀　艾蜜莉　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, EMILY MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明大體上係關於結合NCK1之合成肽。本發明進一步係關於使用該等肽抑制NCK1與PTP1B之間的相互作用及治療與胰島素抗性相關之疾病或病症的方法，該疾病或病症包括2型糖尿病及肥胖症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates generally to synthetic peptides which bind NCK1. The invention further relates to methods of using the peptides for inhibiting an interaction between NCK1 and PTP1B, and for treating a disease or disorder associated with insulin resistance, including type 2 diabetes and obesity.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1538" publication-number="202626012"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626012.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有吸濕性之組成物及化妝料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/60</main-classification>  
        <further-classification edition="200601120260401B">A61K8/19</further-classification>  
        <further-classification edition="200601120260401B">A61K8/64</further-classification>  
        <further-classification edition="200601120260401B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早川悠貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAKAWA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森川優輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIKAWA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇木佳彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONOKI, YOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於含有(A)蔗糖及(B)氯化鈉的化妝料。可開發出能充分提升屬於皮膚屏障層之角質層的保水能力的保濕成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1539" publication-number="202626100"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626100.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132730</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療自體免疫及神經疾病之導向CD19之嵌合抗原受體細胞療法</chinese-title>  
        <english-title>CD19-DIRECTED CHIMERIC ANTIGEN RECEPTOR CELL THERAPY FOR TREATING AUTOIMMUNE AND NEUROLOGICAL DISEASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">A61K40/11</main-classification>  
        <further-classification edition="202501120260401B">A61K40/31</further-classification>  
        <further-classification edition="202501120260401B">A61K40/41</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商奇諾治療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNO THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科格爾　艾緒利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOEGEL, ASHLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎貝爾　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMPBELL, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克普　泰勒　喬丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOOP, TYLER JORDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍道佐　瑞尼　安　西希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANDAZZO, RENEE ANN SEHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥爾登　艾里克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELTON, ALEXIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬德里　布爾漢　紮法爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUDHRY, BURHAN ZAFAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古拉蒂　尼維德塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GULATI, NIVEDITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供過繼細胞療法及用途，其涉及投與一劑量之表現導向CD19之嵌合抗原受體的T細胞，用於治療患有自體免疫及神經疾病及病症之個體，以及相關的方法、組合物、用途及製品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are adoptive cell therapy methods and uses involving the administration of a dose of T cells expressing a CD19-directed chimeric antigen receptor for treating subjects with autoimmune and neurological disease and disorders and related methods, compositions, uses and articles of manufacture.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1540" publication-number="202627099"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627099.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132740</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療與葡萄糖神經醯胺酶β缺陷相關之神經病症的組合物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR THE TREATMENT OF NEUROLOGICAL DISORDERS RELATED TO GLUCOSYLCERAMIDASE BETA DEFICIENCY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C12N15/63</main-classification>  
        <further-classification edition="200601120260324B">C12N15/86</further-classification>  
        <further-classification edition="200601120260324B">C12N9/24</further-classification>  
        <further-classification edition="200601120260324B">A61K48/00</further-classification>  
        <further-classification edition="200601120260324B">A61P25/16</further-classification>  
        <further-classification edition="200601120260324B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商航海家醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOYAGER THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫里達倫　吉里達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURLIDHARAN, GIRIDHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾爾　伊麗莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOLL, ELISABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒顏群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, YANQUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾　凱莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALES, KELLY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯　金兆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, JINZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾德路易　艾德沃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADELUYI, ADEWALE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　布瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMAN, BRETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑格塔普　史密塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAGTAP, SMITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案係關於無論在活體外及/或活體內用於改變，例如增強GCase蛋白表現之組合物及方法。此類組合物包括腺相關病毒(AAV)粒子之遞送。本揭示案之組合物及方法適用於治療經診斷患有或疑似患有帕金森病(Parkinson Disease)或由GBA基因產物之量及/或功能缺陷或與GCase蛋白之表現或蛋白水準降低有關之相關病狀的個體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to compositions and methods for altering, &lt;i&gt;e.g.&lt;/i&gt;, enhancing, the expression of GCase proteins, whether &lt;i&gt;in vitro&lt;/i&gt; and/or &lt;i&gt;in vivo&lt;/i&gt;. Such compositions include delivery of an adeno-associated viral (AAV) particle. The compositions and methods of the present disclosure are useful in the treatment of subjects diagnosed with, or suspected of having Parkinson Disease or related condition resulting from a deficiency in the quantity and/or function of GBA gene product or associated with decreased expression or protein levels of GCase protein.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1541" publication-number="202626109"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626109.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種包含抗DLL3抗體藥物偶聯物的醫藥組成物</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITION COMPRISING ANTI-DLL3 ANTIBODY-DRUG CONJUGATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">A61K47/26</further-classification>  
        <further-classification edition="200601120260401B">A61K47/18</further-classification>  
        <further-classification edition="200601120260401B">A61K47/22</further-classification>  
        <further-classification edition="200601120260401B">A61K9/19</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州盛迪亞生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU SUNCADIA BIOPHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊健健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIANJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田晨敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, CHENMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種包含抗DLL3抗體藥物偶聯物的醫藥組成物。具體地，本揭露涉及包含抗DLL3抗體藥物偶聯物的醫藥組成物在製備用於治療或預防疾病的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a pharmaceutical composition comprising an anti-DLL3 antibody-drug conjugate. Specifically, the present disclosure relates to the use of the pharmaceutical composition comprising anti-DLL3 antibody-drug conjugates in preparing a medicament for the treatment or prevention of a disease.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1542" publication-number="202626760"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626760.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防硫化用硬化性組成物、黏著片及皮膜以及顯示裝置用構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08F2/44</main-classification>  
        <further-classification edition="200601120260319B">C09J133/00</further-classification>  
        <further-classification edition="200601120260319B">C09J11/06</further-classification>  
        <further-classification edition="200601120260319B">C08K5/524</further-classification>  
        <further-classification edition="201801120260319B">C09J7/30</further-classification>  
        <further-classification edition="200601120260319B">B32B15/082</further-classification>  
        <further-classification edition="200601120260319B">B32B27/30</further-classification>  
        <further-classification edition="200601120260319B">G09F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商王子控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OJI HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒田大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制硫化的防硫化用硬化性組成物、以及由該組成物獲得的黏著片及皮膜。本發明為一種用於防止金屬的硫化的硬化性組成物，含有主劑、以及亞磷酸酯化合物，所述主劑為選自由丙烯酸系聚合物及聚合性單體所組成的群組中的至少一種，所述亞磷酸酯化合物中，與亞磷酸部位鍵結的苯基部位的數量為兩個以下，在將所述亞磷酸酯化合物相對於所述主劑100質量份而言的含量設為A質量份，且將所述亞磷酸酯化合物中的亞磷酸部位的數量設為B時，滿足下述式（1） &lt;br/&gt;&lt;br/&gt;A×B≧0.5   （1）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1543" publication-number="202626520"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626520.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>強磁性強介電體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C01G49/00</main-classification>  
        <further-classification edition="200601120260325B">C04B35/26</further-classification>  
        <further-classification edition="200601120260325B">H01F1/10</further-classification>  
        <further-classification edition="200601120260325B">H01F10/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京科學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>地方獨立行政法人神奈川縣立產業技術總合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZUMA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三宅潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAKE, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑山華野</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAYAMA, KANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西久保匠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKUBO, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種強磁性強介電體，係具有強介電性與強磁性，包含以下述一般式(1)至(3)之任一者所表示的化合物；&lt;br/&gt; Bi&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;x&lt;/sub&gt;A&lt;sup&gt;2&lt;/sup&gt;&lt;sup&gt;＋&lt;/sup&gt;&lt;sub&gt;x&lt;/sub&gt;Fe&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;x&lt;/sub&gt;M&lt;sup&gt;4&lt;/sup&gt;&lt;sup&gt;＋&lt;/sup&gt;&lt;sub&gt;x&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;...(1)&lt;br/&gt; 上述一般式(1)中，A為Mg、Ca或Sr，M為可成為4價離子的4d元素或5d元素，x係滿足0.02≦x≦0.15；&lt;br/&gt; Bi&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;x&lt;/sub&gt;A&lt;sup&gt;＋&lt;/sup&gt;&lt;sub&gt;x&lt;/sub&gt;Fe&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;x&lt;/sub&gt;M&lt;sup&gt;5&lt;/sup&gt;&lt;sup&gt;＋&lt;/sup&gt;&lt;sub&gt;x&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;...(2)&lt;br/&gt; 上述一般式(2)中，A為Na或K，M為可成為5價離子的4d元素或5d元素，x係滿足0.02≦x≦0.15；&lt;br/&gt; Bi&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;2x&lt;/sub&gt;A&lt;sup&gt;2&lt;/sup&gt;&lt;sup&gt;＋&lt;/sup&gt;&lt;sub&gt;2x&lt;/sub&gt;Fe&lt;sub&gt;1&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;x&lt;/sub&gt;M&lt;sup&gt;5&lt;/sup&gt;&lt;sup&gt;＋&lt;/sup&gt;&lt;sub&gt;x&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;...(3)&lt;br/&gt; 上述一般式(3)中，A為Mg、Ca或Sr，M為可成為5價離子的4d元素或5d元素，x係滿足0.02≦x≦0.15。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1544" publication-number="202628257"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628257.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132818</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理的連接桿</chinese-title>  
        <english-title>CONNECTOR ROD FOR SEMICONDUCTOR PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">H01R13/11</main-classification>  
        <further-classification edition="200601120260326B">H01R13/533</further-classification>  
        <further-classification edition="201101120260326B">H01R13/646</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百林　派崔克　吉拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREILING, PATRICK GIRARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯瑪士　提摩西　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMAS, TIMOTHY SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗倫奇　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRENCH, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯列文　戴米恩　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLEVIN, DAMIEN MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍林斯沃思　喬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLINGSWORTH, JOEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體處理的射頻（RF）連接桿。部分RF連接桿具有管狀本體部、第一端部和第二端部，管狀本體部沿著中心軸延伸並具有沿著中心軸的第一中心孔及第一外徑，第一端部具有圍繞著中心軸排列並定義第二中心孔的複數手指，各手指沿著垂直於中心軸的第二軸具備順應性，第二端部位在第一端部對向並具有電連接器引腳區域，電連接器引腳區域具有第三中心孔、在管狀本體部處的近端引腳端、遠端引腳端以及具備小於第一外徑的第二外徑的整體圓柱形外表面，遠端引腳端和電連接器引腳區域的一部分被配置成插入至電氣插座。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Radio frequency （RF） connector rods for semiconductor processing are provided. Some RF connector rods have a tubular body portion extending along a center axis and having a first central bore along the center axis and a first outer diameter, a first end portion having a plurality of fingers arranged around the center axis and defining a second central bore, each finger compliant along a second axis perpendicular to the center axis, and a second end portion opposite the first end portion and having an electrical connector pin region having a third central bore, a proximal pin end at the tubular body portion, a distal pin end, and a unitary cylindrical outer surface with a second outer diameter smaller than the first outer diameter, the distal pin end and a portion of the electrical connector pin region being configured to be inserted into an electrical socket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體處理系統、系統</p>  
        <p type="p">102:處理腔室</p>  
        <p type="p">104:腔室內部</p>  
        <p type="p">106:氣體分配器</p>  
        <p type="p">108:基板支撐件</p>  
        <p type="p">109:製程容積</p>  
        <p type="p">110:晶圓</p>  
        <p type="p">112:電漿</p>  
        <p type="p">114:RF產生器</p>  
        <p type="p">116A、116B:電極</p>  
        <p type="p">118:支撐結構</p>  
        <p type="p">120A、120B:RF桿</p>  
        <p type="p">122:部分</p>  
        <p type="p">124:部分</p>  
        <p type="p">126A、126B:RF連接桿</p>  
        <p type="p">128A、128B:電連接插座</p>  
        <p type="p">130:電氣接觸部、電連接器</p>  
        <p type="p">170:RF連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1545" publication-number="202626923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造流動性提升劑之化合物之用途、流動性提升劑、樹脂組合物、及成形品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08K5/521</main-classification>  
        <further-classification edition="200601120260323B">C07F9/09</further-classification>  
        <further-classification edition="200601120260323B">C08L69/00</further-classification>  
        <further-classification edition="200601120260323B">C08L23/06</further-classification>  
        <further-classification edition="200601120260323B">C08L23/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商艾迪科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEKA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅木勉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEKI, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片桐龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAGIRI, RYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫昌洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, CHANGSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大村祐太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMURA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種下述通式(1)所表示之化合物之用途，其用於製造熱塑性樹脂用流動性提升劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="98px" width="234px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;通式(1)中，R&lt;sup&gt;1&lt;/sup&gt;表示碳原子數26～40之烷基、碳原子數26～40之烯基或下述通式(2)所表示之基，n表示1或2之整數。於n為2之情形時，存在複數個之R&lt;sup&gt;1&lt;/sup&gt;可相同亦可不同。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="86px" width="197px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;通式(2)中，R&lt;sup&gt;2&lt;/sup&gt;表示氫原子或碳原子數1～18之烷基，R&lt;sup&gt;3&lt;/sup&gt;表示碳原子數2～6之伸烷基，m表示通式(2)所表示之基之數量平均分子量為100～10,000之整數，*表示鍵結鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1546" publication-number="202628856"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628856.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗方法及清洗設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P70/00</main-classification>  
        <further-classification edition="200601120260316B">B08B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈照偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, ZHAOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸陳華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHENHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麻森朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, SENPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宏超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HONGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種清洗方法及清洗設備。一種清洗方法，用於清洗封裝結構，包括以下步驟：S1，提供待清洗的封裝結構至一清洗腔內；S2，調節清洗腔內的壓力至預定壓力，預定壓力為負壓；S3，向封裝結構噴灑第一流體，以對封裝結構進行負壓清洗；S4， 向封裝結構噴射高壓第二流體，以排出封裝結構中的殘留物。該清洗方法利用負壓條件下第一流體表面張力下降的原理促進第一流體在封裝結構的微小間隙中流動，以溶解封裝結構中的污染物；然後向封裝結構噴射高壓第二流體，使得封裝結構中殘留的第一流體和污染物等殘留物從封裝結構排出，有效提升清洗效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S3、S40、S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1547" publication-number="202626887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132830</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有芴骨架之聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G77/52</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口悠伍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, YUGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森裕土</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMORI, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供主鏈具有矽伸苯基骨架、聚矽氧烷骨架及芴骨架，且側鏈具有胺基甲酸酯鍵、羧基，及丙烯醯基或甲基丙烯醯基之聚合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1548" publication-number="202626023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晚期原發性膽汁性膽管炎的治療</chinese-title>  
        <english-title>TREATMENT OF ADVANCED PRIMARY BILIARY CHOLANGITIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/192</main-classification>  
        <further-classification edition="200601120260401B">A61K31/575</further-classification>  
        <further-classification edition="200601120260401B">A61P1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商ＧＥＮＦＩＴ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENFIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布爾曼　帕斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIRMAN, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅多特　愛麗絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROUDOT, ALICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安圖內斯　努諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTUNES, NUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤恩　克勞蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEIN, CLAUDIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯萊曼　馬文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLEIMAN, MARWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖阿迪　內森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOUATI, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種醫藥組合物，其包含選自由以下組成之群的化合物：艾拉菲諾、2-[2,6-二甲基-4-[3-[4-(甲硫基)苯基]-3-側氧基-丙基]苯氧基]-2-甲基丙酸(GFT1007)及艾拉菲諾或GFT1007之醫藥學上可接受之鹽，用於治療患有晚期原發性膽汁性膽管炎(PBC)之個體的原發性膽汁性膽管炎(PBC)之方法中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a pharmaceutical composition comprising a compound selected from the group consisting of elafibranor, 2-[2,6-dimethyl-4-[3-[4-(methylthio)phenyl]-3-oxo-propyl]phenoxy]-2-methylpropanoic acid (GFT1007), and a pharmaceutically acceptable salt of elafibranor or GFT1007, for use in a method for treating primary biliary cholangitis (PBC) in a subject having advanced stage primary biliary cholangitis (PBC).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1549" publication-number="202625908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可可塊替代酵母素材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260401B">A23L31/10</main-classification>  
        <further-classification edition="200601120260401B">A23L2/39</further-classification>  
        <further-classification edition="200601120260401B">A23G1/42</further-classification>  
        <further-classification edition="201601120260401B">A23L27/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朝日集團食品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI GROUP FOODS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川晴花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狩野貴弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANO, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種包含酵母素材之飲食品用組合物，其僅以酵母素材(尤其是製造酵母萃取物時之殘渣)為主原料，且製造亦容易，能夠對飲食品賦予可可或可可亞風味或能夠增強飲食品之可可或可可亞風味，或者能夠用作可可塊之替代材料。 &lt;br/&gt;本發明提供一種組合物及其製造方法，該組合物之特徵在於：其係包含食物纖維之含量為35質量%以上，麩胺酸之含量未達1質量%之酵母素材之飲食品用組合物，且該酵母素材包含以將5-壬酮作為內標準之情形時之內標準比計為2.0以上之4-羥基-2,5-二甲基-3(2H)-呋喃酮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1550" publication-number="202626044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由投予心臟肌節活化劑治療心臟衰竭之方法</chinese-title>  
        <english-title>METHODS FOR TREATING HEART FAILURE BY ADMINISTERING CARDIAC SARCOMERE ACTIVATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/496</main-classification>  
        <further-classification edition="200601120260401B">A61P9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商胞質動力學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYTOKINETICS, INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里克　法迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALIK, FADY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫普弗　斯圖爾特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUPFER, STUART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海特納　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEITNER, STEPHEN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪凡吉　普納格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIVANJI, PUNAG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述了用於治療心臟衰竭之方法。治療方法包括向有需要之個體投予心臟肌節活化劑(例如奧美卡替莫卡必爾(omecamtiv mecarbil)或其醫藥上可接受之鹽及/或水合物)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for treating heart failure are described herein. Treatment methods include administering a cardiac sarcomere activator (e.g., omecamtiv mecarbil, or a pharmaceutically acceptable salt and/or hydrate thereof) to a subject in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1551" publication-number="202626042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於多發性硬化症之治療性酪胺酸激酶抑制劑</chinese-title>  
        <english-title>THERAPEUTIC TYROSINE KINASE INHIBITORS FOR MULTIPLE SCLEROSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/4545</main-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普林斯匹亞生物製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRINCIPIA BIOPHARMA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜科維克　黛博拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUKOVIC, DEBORAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽義德　莎娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYED, SANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特納　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TURNER, TIMOTHY J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於用於治療患有多發性硬化症（multiple sclerosis，MS）的患者的治療性酪胺酸激酶抑制劑，特別是布魯頓酪胺酸激酶（Bruton tyrosine kinase，「BTK」）抑制劑的領域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to the field of therapeutic tyrosine kinase inhibitors, in particular, Bruton tyrosine kinase (“BTK”) inhibitors, for treatment of patients with multiple sclerosis (MS).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1552" publication-number="202627447"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627447.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試薄型可撓式壓電致動之電泳顯示器光學性能之方法及裝置</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR TESTING OPTICAL PERFORMANCE OF THIN, FLEXIBLE PIEZOELECTRIC-ACTIVATED ELECTROPHORETIC DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G01N21/25</main-classification>  
        <further-classification edition="200601120260317B">G01N21/27</further-classification>  
        <further-classification edition="201901120260317B">G02F1/167</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商電子墨水股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古　海燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, HAIYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　漢安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉蓋茲　艾佛雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELAZQUEZ, EFRAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　怡璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CRAIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬特斯　尤里波利索維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATUS, YURIY BORISOVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼克奈札　賽塔里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKNEZHAD, SETAREH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種用於測試一壓電致動之電泳顯示器樣本光學狀態之方法及系統。該樣本包含一電泳層，疊置於一壓電層上且電氣地連接至該壓電層。當該樣本被操作於平直與彎曲位置之間時，該電泳層改變光學狀態。該系統包含一彎曲裝置，用於在該等平直與彎曲位置之間固持且操作該樣本，以模擬該樣本在複數個彎曲循環中之手動操作。該系統亦包含一色彩感測器，與該彎曲裝置協同地操作，以偵測該樣本之該電泳層的一給定部在每一彎曲循環中該等平直與彎曲位置中的光學狀態。該系統進一步包含一控制系統，用於使該彎曲裝置與該色彩感測器之操作同步，及用於記錄藉該色彩感測器偵測到的光學狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems are disclosed for testing optical states of a piezoelectric-activated electrophoretic display sample. The sample includes an electrophoretic layer superposed on and electrically connected to a piezoelectric layer. The electrophoretic layer changes optical states when the sample is manipulated between flat and bent positions. The system includes a bending apparatus for adjustably holding and manipulating the sample between the flat and bent positions to mimic hand manipulation of the sample in a plurality of bending cycles. The system also includes a color sensor operating cooperatively with the bending apparatus to detect the optical state of a given portion of the electrophoretic layer of the sample in the flat and bent positions in each bending cycle. The system further includes a control system for synchronizing the operations of the bending apparatus and the color sensor and for recording the optical states detected by the color sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:壓電電泳顯示器</p>  
        <p type="p">200:測試系統</p>  
        <p type="p">202:彎曲裝置</p>  
        <p type="p">204:色彩感測器</p>  
        <p type="p">206:控制系統</p>  
        <p type="p">214:線性致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1553" publication-number="202626269"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626269.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分級裝置及衝擊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">B24C7/00</main-classification>  
        <further-classification edition="200601120260326B">B24C9/00</further-classification>  
        <further-classification edition="200601120260326B">B24C5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新東工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINTOKOGIO, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>見城維佐久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENJO, ISAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>家守修一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMORI, SHUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下恭司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KYOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本丈弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日比野一路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIBINO, KAZUMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之分級裝置具備：分選機構，其使用氣流對粉粒體群進行分選；集塵機，其產生氣流；導管，其將分選機構與集塵機之間可供氣流通過地連結；量測器，其於較集塵機更靠氣流之流路之上游，對包含粉粒體之空氣之壓力進行量測；及控制裝置，其基於由量測器量測出之量測值，進行控制氣流之速度之風速控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:衝擊處理裝置</p>  
        <p type="p">10:櫃</p>  
        <p type="p">20:投射裝置</p>  
        <p type="p">21:投射材貯槽</p>  
        <p type="p">22:閘口</p>  
        <p type="p">23:葉輪</p>  
        <p type="p">30:回收裝置</p>  
        <p type="p">31:螺旋輸送機</p>  
        <p type="p">32:滾筒篩</p>  
        <p type="p">33:鬥式提升機</p>  
        <p type="p">40:分級裝置</p>  
        <p type="p">41:分選機構</p>  
        <p type="p">41a:導入口</p>  
        <p type="p">41b:排出口</p>  
        <p type="p">42:導管</p>  
        <p type="p">43:導管</p>  
        <p type="p">44:集塵機</p>  
        <p type="p">45:量測器</p>  
        <p type="p">46:控制裝置</p>  
        <p type="p">51:殼體</p>  
        <p type="p">51a:吸入口</p>  
        <p type="p">51b:排氣口</p>  
        <p type="p">52:過濾器</p>  
        <p type="p">53:風扇馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1554" publication-number="202626636"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626636.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有GBA1及GCS雙控制劑之醫藥組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D417/14</main-classification>  
        <further-classification edition="200601120260401B">C07D223/08</further-classification>  
        <further-classification edition="200601120260401B">C07D417/12</further-classification>  
        <further-classification edition="200601120260401B">C07D403/12</further-classification>  
        <further-classification edition="200601120260401B">A61K31/55</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商小野藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤隆史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹内淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐姿漣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種含有在與GBA1及/或GCS相關之疾病之預防及/或治療中，具有GBA1及GCS雙控制活性之化合物之醫藥組合物。 &lt;br/&gt;本發明之式(I)： &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="153px" width="356px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，全部符號表示與說明書中記載之符號相同之含義)所表示之化合物、或其藥學上所容許之鹽具有GBA1及GCS雙控制活性，因此含有式(I)所表示之化合物、或其藥學上所容許之鹽之醫藥組合物可用作與GBA1及/或GCS相關之疾病之預防及/或治療劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1555" publication-number="202627069"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627069.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132867</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>培養方法、培養系統及活性種之導入裝置</chinese-title>  
        <english-title>CULTURE METHOD, CULTURE SYSTEM, AND ACTIVE SPECIES INTRODUCTION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12M1/34</main-classification>  
        <further-classification edition="200601120260401B">C12M1/42</further-classification>  
        <further-classification edition="200601120260401B">C12N1/00</further-classification>  
        <further-classification edition="200601120260401B">C12N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生駒篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKOMA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大下貴也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSHITA, TAKAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例，提供一種培養方法，其係 &lt;br/&gt;具備檢測製程與導入製程， &lt;br/&gt;在前述檢測製程中，從培養對象及/或培養培養對象的培養基中，檢測一個以上的特徵量， &lt;br/&gt;在此，前述培養對象包含選自由微生物及細胞所組成之群組中的一種以上， &lt;br/&gt;在前述導入製程中，將活性種導入前述培養基， &lt;br/&gt;在此，前述活性種包含選自由活性氧種、活性氮種及活性碳種所組成之群組中的一種以上，在前述導入製程中，基於所檢測到的前述一個以上的特徵量，控制前述活性種之導入方式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a culture method and the like that enables appropriate culturing. &lt;br/&gt;According to one aspect of the present invention, there is provided a culture method comprising a detection step and an introduction step. In the detection step, one or more feature quantities are detected from a culture subject and/or from a medium in which the culture subject is cultured. Here, the culture subject includes at least one selected from the group consisting of microorganisms and cells. In the introduction step, an active species is introduced into the medium. Here, the active species includes at least one selected from the group consisting of reactive oxygen species, reactive nitrogen species, and reactive carbon species. In the introduction step, the mode of introduction of the active species is controlled based on the detected one or more feature quantities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一培養容器</p>  
        <p type="p">2:第二培養容器</p>  
        <p type="p">3:資訊處理裝置</p>  
        <p type="p">4:感測器</p>  
        <p type="p">5:活性種導入部</p>  
        <p type="p">6:氣體導入部</p>  
        <p type="p">7:光照射部</p>  
        <p type="p">100:培養系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1556" publication-number="202627457"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627457.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可攜式處理工具診斷系統</chinese-title>  
        <english-title>PORTABLE PROCESS TOOL DIAGNOSTIC SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G01N21/95</main-classification>  
        <further-classification edition="200601120260318B">G01N21/21</further-classification>  
        <further-classification edition="201401120260318B">G01N21/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊根　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAN, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯南　梅德胡卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNA, MADHUKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孛帷蓋達　維斯瓦納坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAVIGADDA, VISWANATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費茲艾拉凡尼　梅迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAEZ-IRAVANI, MEHDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高許　沙納特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, SANAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克哈嘉　艾比杜亞西斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHAJA, ABDUL AZIZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述的實施例涉及一種設備，該設備包含帶門的外殼。在一個實施例中，基板固持件位於外殼內，並提供支撐基板固持件的工作台。在一個實施例中，該工作台是可位移的。在一個實施例中，該設備還包括位於外殼內的計量系統，該外殼配置為對放置在基板固持件上的基板進行量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a housing with a door. In an embodiment, a substrate holder is within the housing, and a stage is provided to support the substrate holder. In an embodiment, the stage is displaceable. In an embodiment, the apparatus further comprises a metrology system within the housing that is configured to take measurements of a substrate that is placed on the substrate holder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:診斷系統</p>  
        <p type="p">110:可攜式模組</p>  
        <p type="p">111:外殼</p>  
        <p type="p">112:線性工作台</p>  
        <p type="p">113:旋轉工作台</p>  
        <p type="p">114:基板固持件</p>  
        <p type="p">115:基板</p>  
        <p type="p">116:光源</p>  
        <p type="p">117:偏極片</p>  
        <p type="p">118:透鏡</p>  
        <p type="p">119:照相機系統</p>  
        <p type="p">120:支架</p>  
        <p type="p">121:光學路徑</p>  
        <p type="p">130:承載器</p>  
        <p type="p">131:外殼</p>  
        <p type="p">132&lt;sub&gt;A&lt;/sub&gt;:系統</p>  
        <p type="p">132&lt;sub&gt;B&lt;/sub&gt;:系統</p>  
        <p type="p">132&lt;sub&gt;C&lt;/sub&gt;:系統</p>  
        <p type="p">132&lt;sub&gt;D&lt;/sub&gt;:系統</p>  
        <p type="p">133:輪子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1557" publication-number="202628632"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628632.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260316B">H10D30/65</main-classification>  
        <further-classification edition="202501120260316B">H10D62/10</further-classification>  
        <further-classification edition="202501120260316B">H10D64/27</further-classification>  
        <further-classification edition="202501120260316B">H10D64/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TZUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘元甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YUAN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TUNG-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，包括基板；第一阱，具有第一導電類型；第二阱，具有第二導電類型；具有第一導電類型的第一摻雜區和具有第二導電類型的第二摻雜區，設置在該第一阱中；第三摻雜區，設置在該第二阱中，具有第二導電類型；以及分段閘極，其包括該第二導電類型的第一閘極電極段、該第一導電類型的第二閘極電極段和該第一導電類型的第三閘極電極段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor device, comprising a substrate; a first well having a first conductivity type; a second well having a second conductivity type; a first doped region having the first conductivity type and a second doped region having the second conductivity type, arranged in the first well; a third doped region, arranged in the second well and having the second conductivity type; and a segmented gate, comprising a first gate electrode segment of the second conductivity type, a second gate electrode segment of the first conductivity type and a third gate electrode segment of the first conductivity type.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500A:半導體裝置</p>  
        <p type="p">100,110:方向</p>  
        <p type="p">200:基板</p>  
        <p type="p">200T:上表面</p>  
        <p type="p">201-1,201-2,201-3,201-4:隔離部件</p>  
        <p type="p">PW:第一阱</p>  
        <p type="p">NW:第二阱</p>  
        <p type="p">P1-1:第一摻雜區</p>  
        <p type="p">N1-1:第二摻雜區</p>  
        <p type="p">N2-1:第三摻雜區</p>  
        <p type="p">F1A,F2A,F3A:界面</p>  
        <p type="p">250:分段閘極</p>  
        <p type="p">205-1,205-2,205-3:有源區</p>  
        <p type="p">250D:閘極介電層</p>  
        <p type="p">250G:閘極電極</p>  
        <p type="p">250N1:第一閘極電極段</p>  
        <p type="p">250P1:第二閘極電極段</p>  
        <p type="p">250N2:第三閘極電極段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1558" publication-number="202626065"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626065.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於抑制補體因子Ｂ（ＣＦＢ）基因表達之雙鏈核糖核酸及其綴合體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/713</main-classification>  
        <further-classification edition="201001120260401B">C12N15/113</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P13/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商倍臻生物技術私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISIRNA THERAPEUTICS PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　瓊爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, QIONGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于薇薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, WEIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸劍宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐小溪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIAOXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王明杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MINGJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒　曉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宏寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HONGKUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係關於一種抑制細胞中補體因子B (CFB)基因表現之RNA抑制劑，包含反義鏈，該反義鏈與編碼CFB之mRNA (SEQ ID NO: 8)中連續的至少15個核苷酸形成目標序列互補區域，該目標序列互補區域具有0、1、2、3、4或5個錯配，較佳地該互補區域長度為15-30個核苷酸對，更佳地為17-23個核苷酸對。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1559" publication-number="202627107"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627107.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>癌症生物標記物</chinese-title>  
        <english-title>CANCER BIOMARKERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260401B">C12Q1/6886</main-classification>  
        <further-classification edition="201801120260401B">C12Q1/6837</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商甘比特生物有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAMBIT BIO LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬蒂芬妮席婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, TIFFANY SEE-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇爾蓋斯　蘇珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KILGAS, SUSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳夕林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派龍　克利斯提亞諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERON, CRISTIANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於個體的諸如前列腺癌之癌症之早期高效診斷的方法，以及用於此類方法之陣列及套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for the early and efficient diagnosis of cancer, such as prostate cancer in an individual, as well as arrays and kits for use in such methods.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1560" publication-number="202626716"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626716.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗體及其用途</chinese-title>  
        <english-title>ANTIBODY AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊蘭迪爾實驗室公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EARENDIL LABS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冉昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAN, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　禎平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZHENPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供分離的抗原結合蛋白，其包括：第一抗原結合結構域和第二抗原結合結構域，其中該第一抗原結合結構域特異性地結合TNF樣蛋白A(TL1A)，以及該第一抗原結合結構域和該第二抗原結合結構域係不同的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides an isolated antigen-binding protein, comprising: a first antigen-binding domain and a second antigen-binding domain, wherein the first antigen-binding domain specifically binds to TNF-like protein A (TL1A), and the first antigen binding domain and the second antigen binding domain are different.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1561" publication-number="202626782"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626782.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑下層膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08F12/24</main-classification>  
        <further-classification edition="200601120260319B">C08F12/32</further-classification>  
        <further-classification edition="200601120260319B">C08F20/10</further-classification>  
        <further-classification edition="200601120260319B">C08G59/22</further-classification>  
        <further-classification edition="200601120260319B">C08G61/10</further-classification>  
        <further-classification edition="200601120260319B">C08G65/00</further-classification>  
        <further-classification edition="200601120260319B">G03F7/11</further-classification>  
        <further-classification edition="200601120260319B">G03F7/16</further-classification>  
        <further-classification edition="202601120260319B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德永光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUNAGA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部隼人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香西純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種阻劑下層膜形成用組成物，其為可藉由電漿處理或離子注入處理而形成可提高蝕刻耐性的阻劑下層膜之阻劑下層膜形成用組成物，其 &lt;br/&gt;　　含有具有芳香族烴環之樹脂(A)，與溶劑(B)， &lt;br/&gt;　　前述樹脂(A)為乙烯基系樹脂、聚酯系樹脂、聚醚系樹脂、側鏈具有醚鍵或酯鍵之樹脂、聚醯亞胺系樹脂及聚醯胺系樹脂之至少任一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1562" publication-number="202627261"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627261.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132955</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經賦予除臭性的纖維製品</chinese-title>  
        <english-title>DEODORIZED FIBER PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">D06M13/00</main-classification>  
        <further-classification edition="200601120260323B">D06M23/02</further-classification>  
        <further-classification edition="200601120260323B">C11D3/12</further-classification>  
        <further-classification edition="200601120260323B">C11D3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商布里希亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLISXIA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡部英基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井口暢子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOKUCHI, NOBUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永井淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係提供一種經金屬有機骨架所附著之纖維製品，其具有優異的除臭性及優異的洗滌耐性(對於汗及洗滌劑之穩定性)。 &lt;br/&gt;一種纖維製品，其經金屬離子與有機配位子配位鍵結而成之金屬有機骨架所附著，其中，金屬離子為鋯離子，有機配位子為至少包含下述式(I)所示之化合物： &lt;br/&gt;&lt;img align="absmiddle" height="138px" width="278px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，X係與說明書中之記載同義。]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the present invention is to provide a fiber product with having a metal organic framework is attached, the fiber product exhibiting excellent deodorizing properties as well as washing resistance (stability with respect to sweat and detergents). &lt;br/&gt;A fiber product with a metal organic framework formed by coordination bonding between metal ions and organic ligands are attached to the fiber product, wherein the metal ion is zirconium ion, and the organic ligand comprise at least a compound respresented by the following formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="293px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[In the formula, X has the same meaning as the description.]</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1563" publication-number="202628253"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628253.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260320B">H01R12/71</main-classification>  
        <further-classification edition="200601120260320B">H01R13/24</further-classification>  
        <further-classification edition="200601120260320B">H01R13/41</further-classification>  
        <further-classification edition="200601120260320B">H01R13/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭付金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, FU-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器，包括絕緣本體及至少一排端子，一排端子沿第一方向排列，端子沿垂直於第一方向的第二方向向前延伸，絕緣本體設有相對的第一、第二表面，貫穿第一、第二表面的收容槽及連通對應收容槽的固定槽，端子包括固定於固定槽內的基部及自基部延伸且穿過收容槽突伸出第一表面的第一彈性臂，以及自基部延伸且穿過收容槽突伸出第二表面的第二彈性臂；一排端子包括彼此交替排列的第一端子及第二端子，第一端子基部自第一表面插入固定槽，第二端子基部自第二表面插入固定槽。本發明的兩種端子能分別從絕緣本體兩不同表面安裝，方便快捷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector includes an insulating housing, at least one row of terminals rowed along a first direction, the terminals extend forward along a second direction perpendicular to the first direction. The insulating housing has a first face, a second face opposite to the first face, a receiving groove penetrates the first face and the second face and a fixing slot communicating with the receiving groove. Each terminal has a main portion fixed in the fixing slot, a first elastic arm extending upwardly and forward beyond the first face and a second elastic arm extending downwardly and forward beyond the second face. A row of the terminals includes a first terminal and a second terminal that are alternatively arranged , and the main portions of the first terminals are inserted into the fixing slots from the first face along an upper-lower direction, and the main portions of the second terminals are inserted into the fixing slots from the second face of the insulating housing along a lower-upper direction. It is convenient for assembling of the terminals by inserting the first terminals into the insulating housing from the first face and inserting the second terminals into the insulating housing from the second face respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電連接器</p>  
        <p type="p">10:絕緣本體</p>  
        <p type="p">101:第一表面</p>  
        <p type="p">103:端子槽</p>  
        <p type="p">1051:第一固定槽</p>  
        <p type="p">1052:第二固定槽</p>  
        <p type="p">201:第一彈性臂</p>  
        <p type="p">21:第一端子</p>  
        <p type="p">22:第二端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1564" publication-number="202626944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132984</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液狀樹脂組成物以及電子零件裝置及其製造方法</chinese-title>  
        <english-title>LIQUID RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08L63/00</main-classification>  
        <further-classification edition="200601120260319B">C08G59/50</further-classification>  
        <further-classification edition="200601120260319B">C08K3/22</further-classification>  
        <further-classification edition="201801120260319B">C08K3/013</further-classification>  
        <further-classification edition="200601120260319B">C08K5/3445</further-classification>  
        <further-classification edition="202601120260319B">H10W74/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉原佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIHARA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雨宮滋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMEMIYA, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">液狀樹脂組成物中，於以升溫速度為10℃/分鐘的條件測定的黏度分佈中，當將溫度A℃時的黏度設為ρA、將溫度（A+5）℃時的黏度設為ρ（A+5）時，ρ（A+5）/ρA所表示的傾斜度B成為1.5的最低溫度AL存在於103℃～140℃的範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid resin composition has, in a viscosity profile measured at a heating rate of 10°C per minute, a lowest temperature AL within a range of 103°C to 140°C. At the lowest temperature AL, a slope B represented by ρ(A+5)/ρA, where ρA is a viscosity at a temperature of A°C and ρ(A+5) is a viscosity at a temperature of (A+5)°C, is 1.5.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1565" publication-number="202626003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封蓋以及容器</chinese-title>  
        <english-title>CAP AND CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260326B">A61J1/00</main-classification>  
        <further-classification edition="200601120260326B">A61J1/05</further-classification>  
        <further-classification edition="202301120260326B">A61J1/14</further-classification>  
        <further-classification edition="200601120260326B">B65D43/02</further-classification>  
        <further-classification edition="200601120260326B">B65D41/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大成化工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAISEI KAKO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>染川剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMEKAWA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅﨑雅也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEZAKI, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上晃弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國井博誉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNII, HIROTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封蓋，安裝於包括具有朝向徑向外側之容器法蘭部的口部之容器本體，封蓋包括內周部件，在周向上圍繞口部；以及外周部件，在周向上圍繞內周部件；內周部件包括基部，為環狀，在周向上圍繞口部；內鎖定部，沿基部之中心軸線的方向從基部直立設置，並鎖定於容器法蘭部；以及內定位部，沿基部之中心軸線的方向從基部延伸設置，與外周部件接合以對內周部件相對於外周部件進行定位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a cap to be mounted to a container body including a mouth that has a container flange part extending radially outward. The cap includes: an inner circumferential member configured to surround the mouth in a circumferential direction; and an outer circumferential member surrounding the inner circumferential member. The inner circumferential member includes: a base part having an annular shape and configured to surround the mouth in the circumferential direction; an inner locking part erected from the base part along a central axis direction of the base part and configured to be locked to the container flange part; and an inner positioning part extending from the base part along the central axis direction of the base part and configured to engage with the outer circumferential member to position the inner circumferential member relative to the outer circumferential member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:容器</p>  
        <p type="p">2:容器本體</p>  
        <p type="p">3:封蓋</p>  
        <p type="p">4:內周部件</p>  
        <p type="p">5:外周部件</p>  
        <p type="p">6:栓部件</p>  
        <p type="p">7:蓋部件</p>  
        <p type="p">20:口部</p>  
        <p type="p">21:外容器部</p>  
        <p type="p">23:容器連結部</p>  
        <p type="p">24:容器肩部</p>  
        <p type="p">40:基部</p>  
        <p type="p">41:內鎖定部</p>  
        <p type="p">42:內定位部</p>  
        <p type="p">43:內段差部</p>  
        <p type="p">50:外定位部</p>  
        <p type="p">51:外上筒部</p>  
        <p type="p">52:外頂板部</p>  
        <p type="p">60:栓法蘭部</p>  
        <p type="p">61:栓本體部</p>  
        <p type="p">200:容器法蘭部</p>  
        <p type="p">201:開口</p>  
        <p type="p">202:頸部</p>  
        <p type="p">230:上段部</p>  
        <p type="p">231:下段部</p>  
        <p type="p">232:連結壁部</p>  
        <p type="p">400:凹部</p>  
        <p type="p">401:被推壓面</p>  
        <p type="p">410:前端鎖定部</p>  
        <p type="p">411:鎖定本體部</p>  
        <p type="p">420:內壁部</p>  
        <p type="p">421:軸向鎖定部</p>  
        <p type="p">422:周向鎖定部</p>  
        <p type="p">424:凸條</p>  
        <p type="p">425:切口部</p>  
        <p type="p">500:外壁部</p>  
        <p type="p">503:軸向被鎖定部</p>  
        <p type="p">504:貫通孔</p>  
        <p type="p">510:外本體部</p>  
        <p type="p">511:外突出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1566" publication-number="202626629"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626629.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備嘧啶衍生物之方法</chinese-title>  
        <english-title>PROCESS FOR THE PREPARATION OF PYRIMIDINE DERIVATIVES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D405/14</main-classification>  
        <further-classification edition="200601120260401B">C07D405/06</further-classification>  
        <further-classification edition="200601120260401B">C07D211/46</further-classification>  
        <further-classification edition="200601120260401B">C07D401/12</further-classification>  
        <further-classification edition="200601120260401B">C07D305/06</further-classification>  
        <further-classification edition="200601120260401B">A61K31/506</further-classification>  
        <further-classification edition="200601120260401B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡默療法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARMOT THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費杜　尼古拉斯　米凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEDOU, NICOLAS MICKAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加萊　蘇曼塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARAI,SUMANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU,BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU,LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN,BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　曉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG,XIAOMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種以技術規模製備式 (I) 化合物之新方法 &lt;br/&gt;&lt;img align="absmiddle" height="138px" width="352px" file="ed10155.JPG" alt="ed10155.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;及該化合物之新穎中間體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a new process for the preparation of a compound of formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="136px" width="353px" file="ed10156.JPG" alt="ed10156.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;at technical scale, as well as novel intermediates thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1567" publication-number="202627135"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627135.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬遮罩及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C23C14/04</main-classification>  
        <further-classification edition="202301120260319B">H10K71/16</further-classification>  
        <further-classification edition="202301120260319B">H10K71/20</further-classification>  
        <further-classification edition="202301120260319B">H10K59/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安在祐二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANZAI, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安楽岡浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASURAOKA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之金屬遮罩具有有效區域及周圍區域，前述有效區域包含複數個貫通孔，複數個前述貫通孔係第1面側之第1凹部與第2面側之第2凹部連通而成者，前述第1凹部之開口面積小於前述第2凹部之開口面積，前述第2凹部之開口形狀為四角形，前述第1凹部與前述第2凹部之連接部之形狀為圓形或大致圓形，於前述有效區域中，複數個前述貫通孔呈錯位狀排列，相鄰之前述第2凹部藉由頂部而分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20a:第1面</p>  
        <p type="p">20b:第2面</p>  
        <p type="p">22:有效區域</p>  
        <p type="p">25:貫通孔</p>  
        <p type="p">30:第1凹部</p>  
        <p type="p">31:第1壁面</p>  
        <p type="p">32:頂部</p>  
        <p type="p">35:第2凹部</p>  
        <p type="p">36:第2壁面</p>  
        <p type="p">41:連接部</p>  
        <p type="p">D1:寬度方向</p>  
        <p type="p">I-I’:線</p>  
        <p type="p">N:厚度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1568" publication-number="202626890"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626890.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水分散組成物之混合物的製造方法、浸漬成形體之製造方法及水分散組成物之混合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J3/21</main-classification>  
        <further-classification edition="200601120260401B">C08J5/02</further-classification>  
        <further-classification edition="200601120260401B">C08L23/34</further-classification>  
        <further-classification edition="200601120260401B">B29C41/00</further-classification>  
        <further-classification edition="200601120260401B">B29C41/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友精化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO SEIKA CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角髙育實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKUTAKA, IKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田晃平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種可製備氯磺化聚烯烴製品的手法，該氯磺化聚烯烴製品係盡可能不使用有機溶劑，且除了具有實用上可耐受的硬度及拉伸耐性之外，亦具有優異的強度。&lt;br/&gt; 具體而言，本揭示提供一種水分散組成物之混合物的製造方法，包含混合複數之水分散組成物，其等分別含有氯磺化聚烯烴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1569" publication-number="202628656"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628656.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子器件及電子器件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10D80/20</main-classification>  
        <further-classification edition="202501120260330B">H10D1/68</further-classification>  
        <further-classification edition="202601120260330B">H10P74/20</further-classification>  
        <further-classification edition="202601120260330B">H10W20/20</further-classification>  
        <further-classification edition="202601120260330B">H10W90/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛德萬測試股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANTEST CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京科學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅谷慎二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGATANI, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大場隆之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHBA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上原修治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHARA, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高桑真樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAKUWA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的解決手段提供一種電子器件，具備：連接基板，設有複數個電容結構部；電子元件，設於連接基板的上方；及連接配線，將電子元件與連接基板加以連接；複數個電容結構部具有：連接至連接配線的至少一個連接電容部，以及未連接至連接配線的至少一個非連接電容部。非連接電容部可為短路狀態或開路狀態的電容。連接基板可為第1半導體晶圓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:連接基板</p>  
        <p type="p">12-1~12-24:電容結構部</p>  
        <p type="p">13-1~13-16:連接電容部</p>  
        <p type="p">14-1~14-8:非連接電容部</p>  
        <p type="p">16:上表面</p>  
        <p type="p">17-1~17-4:貫穿通孔結構部</p>  
        <p type="p">18:下表面</p>  
        <p type="p">20-1~20-3:電子元件</p>  
        <p type="p">22-1~22-3:半導體晶片</p>  
        <p type="p">24:第1凸塊</p>  
        <p type="p">30:配線層</p>  
        <p type="p">32:連接配線</p>  
        <p type="p">34:第1連接電極</p>  
        <p type="p">36:第2連接電極</p>  
        <p type="p">37:上部電極</p>  
        <p type="p">38:感光材</p>  
        <p type="p">40:電路基板</p>  
        <p type="p">42:第2凸塊</p>  
        <p type="p">100:電子器件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1570" publication-number="202626024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體組成物</chinese-title>  
        <english-title>SOLID COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/192</main-classification>  
        <further-classification edition="200601120260401B">A61K31/195</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4535</further-classification>  
        <further-classification edition="200601120260401B">A61K9/14</further-classification>  
        <further-classification edition="200601120260401B">A61K9/20</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共健康事業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小梶優子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKAJI, YUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安達紗希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADACHI, SAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題在於提供一種性狀變化被抑制的包含布洛芬的固體組成物。 &lt;br/&gt;　　其解決手段為一種固體組成物，其包含以下的成分：(A)布洛芬、(B)選自由替哌啶及其鹽所成群組之至少1種，以及(C)選自由傳明酸及其鹽所成群組之至少1種；其中，該固體組成物不包括包含左西替利嗪或羅拉他定的固體組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide a solid composition containing ibuprofen that suppresses changes in physicochemical properties. &lt;br/&gt; Provided is a solid composition comprising: (A) ibuprofen; (B) at least one compound selected from the group consisting of tipepidine and salts thereof; and (C) at least one compound selected from the group consisting of tranexamic acid and salts thereof, wherein the solid composition excludes compositions comprising levocetirizine or loratadine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1571" publication-number="202628789"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628789.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基板接合的填充型料最佳化</chinese-title>  
        <english-title>FILL SHAPE OPTIMIZATION FOR SUBSTRATE BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H10P10/00</main-classification>  
        <further-classification edition="202001120260326B">G06F30/398</further-classification>  
        <further-classification edition="202601120260326B">H10P14/40</further-classification>  
        <further-classification edition="202601120260326B">H10W70/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑爾　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWER, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康克林　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONKLIN, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在基板上形成圖案化金屬層的方法，包括：識別金屬結構的設計圖案中造成基板之Z 方向位移的至少一變形區域，將金屬填充型料作為填充圖案插入設計圖案中，以減少至少一變形區域中的 Z 方向位移；以及在基板上形成金屬結構與金屬填充型料，作為圖案化金屬層。方法可更包括基於設計圖案與填充圖案計算基板的接合強度，並調整金屬填充型料的表面積以增加接合強度。接合基板結構可接著藉由將基板之圖案化金屬層的介電材料直接接合至額外基板被形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a patterned metal layer on a substrate includes identifying at least one distortion zone in a design pattern of metal structures causing a Z-direction displacement of the substrate, inserting metal fill shapes as a fill pattern into the design pattern to reduce the Z-direction displacement in the at least one distortion zone, and forming the metal structures and the metal fill shapes on the substrate as the patterned metal layer. The method may further include calculating bond strength of the substrate based on the design pattern and the fill pattern and adjusting surface area of the metal fill shapes to increase the bond strength. A bonded substrate structure may then be formed by directly bonding a dielectric material of the patterned metal layer of the substrate to an additional substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">101,102,103,104,107,108,109,117:步驟</p>  
        <p type="p">111:Z位移最小化方法</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1572" publication-number="202627701"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627701.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用化學改質自含金屬材料的鹵素除汙</chinese-title>  
        <english-title>HALOGEN DECONTAMINATION FROM METAL-CONTAINING MATERIALS USING CHEMICAL MODIFICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G03F7/42</main-classification>  
        <further-classification edition="202601120260319B">H10P50/24</further-classification>  
        <further-classification edition="200601120260319B">C09K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格熱希科維亞克　史帝芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRZESKOWIAK, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宇浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　志方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ERIC CHIH-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, AKITERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在不破真空的情況下，除污經處理的含金屬層中的殘留鹵素物種的方法，包括：使用含鹵素處理氣體處理含金屬層（如金屬氧化物層），以形成包含殘留鹵素物種的經處理的含金屬層，以及使用反應氣體對殘留鹵素物種進行化學改質，以形成改質的殘留物種，以除污殘留鹵素物種。除污可包含對殘留鹵素物種的中和及/或去除。含金屬層可為有機金屬氧化物光阻，且以含鹵素處理氣體的處理可形成具有殘留的鹵素物種汙染的圖案化光阻層。改質的殘留物種可更使用雙氮電漿（純氣體或有額外氣體）及/或額外的反應氣體被處理，兩者可與在處理期間維持較高或較低溫度結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for decontaminating residual halogen species in a processed metal-containing layer without breaking vacuum includes processing a metal-containing layer (such as a metal oxide layer) using a halogen-containing process gas to form a processed metal-containing layer that includes residual halogen species, and chemically modifying the residual halogen species to form modified residual species using a reactive gas to decontaminate the residual halogen species. Decontamination may include neutralization and/or removal of the residual halogen species. The metal-containing layer may be an organometal oxide photoresist and processing with the halogen-containing process gas may form a patterned photoresist layer contaminated with the residual halogen species. The modified residual species may be further treated using dinitrogen plasma (pure or with additional gases) and/or additional reactive gases, both of which may be combined with maintaining and higher or lower temperature during the treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鹵素除污處理</p>  
        <p type="p">101:處理步驟</p>  
        <p type="p">102:反應步驟</p>  
        <p type="p">110:基板</p>  
        <p type="p">112:含鹵素處理氣體</p>  
        <p type="p">113:已曝光的金屬氧化物材料</p>  
        <p type="p">114:金屬氧化物層</p>  
        <p type="p">115:經處理的金屬氧化物層</p>  
        <p type="p">116:未曝光的金屬氧化物材料</p>  
        <p type="p">118:鹵素污染區域</p>  
        <p type="p">120:下方層</p>  
        <p type="p">122:反應氣體</p>  
        <p type="p">125:經處理的金屬氧化物層</p>  
        <p type="p">126:殘留鹵素物種</p>  
        <p type="p">127:改質的殘留物種</p>  
        <p type="p">128:摻入的鹵素</p>  
        <p type="p">134:改質區域</p>  
        <p type="p">138:去除的含鹵素材料</p>  
        <p type="p">190:初始狀態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1573" publication-number="202629051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用熱的缺陷偵測方法</chinese-title>  
        <english-title>DEFECT DETECTION METHOD USING HEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10W80/00</main-classification>  
        <further-classification edition="200601120260331B">G01N25/72</further-classification>  
        <further-classification edition="200601120260331B">G01N21/88</further-classification>  
        <further-classification edition="202201120260331B">G01J5/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬萊耶夫　伊凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALEEV, IVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於偵測接合晶圓中之缺陷的方法包括：在晶圓架上接收該接合晶圓，該接合晶圓包括接合至一第二結構的一第一結構，該第一結構包括第一接觸點，該第二結構包括第二接觸點，且該第一結構接合至第二結構係在該第一接觸點與該第二接觸點之間形成包括金屬接觸點的一接合層。該方法更包括照明該第一結構的一部分一段第一時間長度，以將該第一結構的該部分加熱至一起始溫度；以及使用一光偵測器偵測該接合晶圓的一溫度圖，該溫度圖係在第二時間長度之後所偵測到。且該方法更包括根據該溫度圖判定該接合晶圓之該接合層中的該缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for detecting a defect in a bonded wafer includes receiving the bonded wafer on a wafer holder, the bonded wafer including a first structure bonded to a second structure, the first structure including first contacts, the second structure including second contacts, and the first structure bonded to the second structure forming a bonding layer including metal contacts between the first contacts and the second contacts. The method further includes illuminating a portion of the first structure for a first time duration to heat the portion of the first structure to a starting temperature, and detecting, using a light detector, a temperature map of the bonded wafer, the temperature map being detected after a second time duration. And the method further includes determining, based on the temperature map, the defect in the bonding layer of the bonded wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一結構</p>  
        <p type="p">20:第二結構</p>  
        <p type="p">100:接合晶圓(結構)</p>  
        <p type="p">102a-c:照明光</p>  
        <p type="p">104a-c:發射光</p>  
        <p type="p">106:第一基板</p>  
        <p type="p">108:底層</p>  
        <p type="p">110:第一接觸件</p>  
        <p type="p">112:第一層</p>  
        <p type="p">113:接合層</p>  
        <p type="p">114:第二層</p>  
        <p type="p">116:第二接觸件</p>  
        <p type="p">118:金屬接觸點</p>  
        <p type="p">120:空隙</p>  
        <p type="p">122:裂紋</p>  
        <p type="p">124:第二基板</p>  
        <p type="p">126:熱流箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1574" publication-number="202627076"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627076.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從冷凍保存的單採樣本中生產擴增的自然殺手細胞之方法及其用途</chinese-title>  
        <english-title>METHODS OF PRODUCING EXPANDED NATURAL KILLER CELLS FROM CRYOPRESERVED APHERESIS SAMPLES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N5/0783</main-classification>  
        <further-classification edition="202501120260401B">A61K35/17</further-classification>  
        <further-classification edition="202501120260401B">A61K40/15</further-classification>  
        <further-classification edition="202501120260401B">A61K40/42</further-classification>  
        <further-classification edition="200601120260401B">A61P31/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商凱迪斯醫藥荷蘭私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIADIS PHARMA NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷拉　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRELLA, ALEXANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特文特　沙拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STURTEVANT, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>非格羅亞　布魯諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIGUEROA, BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了從冷凍保存的血液樣本中生產擴增的自然殺手細胞之方法，包含藉由該等方法生產的自然殺手細胞之組成物及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods of producing expanded natural killer cells from cryopreserved blood samples, compositions comprising natural killer cells produced by the methods, and uses thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1575" publication-number="202626659"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626659.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎ＮＥＣＴＩＮ－４抗體、耦合生物分子、醫藥組合物、及其應用</chinese-title>  
        <english-title>NOVEL ANTI-NECTIN-4 ANTIBODIES, CONJUGATED BIOLOGICAL MOLECULES, PHARMACEUTICAL COMPOSITIONS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D491/22</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61K9/08</further-classification>  
        <further-classification edition="200601120260401B">A61K47/02</further-classification>  
        <further-classification edition="200601120260401B">A61K47/12</further-classification>  
        <further-classification edition="200601120260401B">A61K47/18</further-classification>  
        <further-classification edition="200601120260401B">A61K47/26</further-classification>  
        <further-classification edition="200601120260401B">A61K47/36</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣浩鼎生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBI PHARMA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴明添</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, MING-TAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鐙毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　婉瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, WOAN-ENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮嘉樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNG, KA-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王南絢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, NAN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雅琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種NECTIN-4的抗體或其抗原結合片段，以及將此NECTIN-4的抗體或其抗原結合片段共軛接上藥物單元製成的抗體藥物複合體(ADC)。本揭露亦描述使用此抗體或ADC抑制癌症細胞增生的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an antibody or an antigen-binding portion thereof that binds to Nectin-4. Also provided is an antibody-drug conjugate (ADC) including a drug moiety conjugated to the anti-Nectin-4 antibody or antigen-binding portion thereof. Also disclosed are methods of using the antibody or ADC for inhibiting cancer cell proliferation.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1576" publication-number="202626547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>速硬材及速硬性水泥</chinese-title>  
        <english-title>RAPID HARDENING MATERIAL AND RAPID HARDENING CEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C04B22/08</main-classification>  
        <further-classification edition="200601120260319B">C04B22/14</further-classification>  
        <further-classification edition="200601120260319B">C04B22/10</further-classification>  
        <further-classification edition="200601120260319B">C04B28/02</further-classification>  
        <further-classification edition="200601320260319B">C04B103/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辻村領祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUJIMURA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中舘悠登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKADATE, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二宮冬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINOMIYA, FUYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種速硬材，其包含：鋁酸鈣；石膏；及粒子A，包含碳酸鈉，前述粒子A之利用掃描型電子顯微鏡的觀察圖像得到之平均粒徑為30μm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rapid hardening material comprising calcium aluminate, gypsum, and particles A containing sodium carbonate, wherein the particles A have an average particle diameter of 30 μm or more as determined from observation images obtained with a scanning electron microscope.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1577" publication-number="202627191"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627191.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用無氧電漿的氧化物膜沉積</chinese-title>  
        <english-title>OXIDE FILM DEPOSITION USING OXYGEN FREE PLASMA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C23C16/513</main-classification>  
        <further-classification edition="200601120260317B">C23C16/40</further-classification>  
        <further-classification edition="200601120260317B">C23C16/04</further-classification>  
        <further-classification edition="202601120260317B">H10P14/69</further-classification>  
        <further-classification edition="202601120260317B">H10P50/28</further-classification>  
        <further-classification edition="202601120260317B">H10P76/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　求景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, KENT QIUJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧欣儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XINYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭雅云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YA YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　文揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSIANG, MICHAEL WENYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING-JER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎　紀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, CHI-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　立群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, LI-QUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕迪　迪內什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PADHI, DEENESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡卡塔拉曼　尚卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENKATARAMAN, SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">態樣通常涉及使用無氧電漿的氧化物膜沉積技術來處理基板的方法和系統。該方法包括在傳導層上形成蝕刻終止層，並使用含SiOCH的前驅物和載送氣體在該蝕刻終止層上沉積氧化物膜。在某個例子中，該載送氣體是氦。在另一個例子中，該載送氣體是氬。在其他例子中，該載送氣體與氫氣結合使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects generally relate to methods and systems for processing substrates using oxide film deposition techniques with oxygen free plasma. The method includes forming an etch stop layer on a conductive layer and depositing an oxide film on the etch stop layer using an SiOCH-containing precursor and a carrier gas. In one example, the carrier gas is helium. In another example, the carrier gas is argon. In other examples, the carrier gas is combined with a hydrogen gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:傳導層</p>  
        <p type="p">204:ESL</p>  
        <p type="p">206A:氧化物層</p>  
        <p type="p">206B:氧化物層</p>  
        <p type="p">206C:氧化物層</p>  
        <p type="p">210:擴展部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1578" publication-number="202628790"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628790.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置及接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P10/00</main-classification>  
        <further-classification edition="202601120260325B">H10P72/30</further-classification>  
        <further-classification edition="202601120260325B">H10P74/00</further-classification>  
        <further-classification edition="202601120260325B">H10P72/50</further-classification>  
        <further-classification edition="202601120260325B">H10P72/76</further-classification>  
        <further-classification edition="202601120260325B">H10P72/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山﨑穣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASAKI, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田之上隼斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANOUE, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田浩範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, HIRONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田井将紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZUKA, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]謀求接合裝置之構成的簡易化，並同時進行基板之位置調整。 &lt;br/&gt;　　[解決手段]本揭示之一態樣的接合裝置，係具有：第1保持部；第2保持部；至少3個攝像部；移動機構；及控制部。第1保持部，係保持第1基板。第2保持部，係保持第2基板。移動機構，係使第1保持部或第2保持部移動。控制部，係執行：第1攝像處理，使用至少3個攝像部，拍攝第1基板的外周部；及第2攝像處理，使用至少3個攝像部，拍攝第2基板的外周部。又，控制部，係執行：算出處理，基於在第1攝像處理及第2攝像處理中所拍攝到的圖像，算出第1基板與第2基板在水平方向上的位置偏差量；及水平位置調整處理，基於算出處理中之位置偏差量，控制移動機構，使第1保持部或第2保持部沿水平方向移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:第1保持部</p>  
        <p type="p">141:第2保持部</p>  
        <p type="p">170:本體部</p>  
        <p type="p">171:銷</p>  
        <p type="p">176:貫通孔</p>  
        <p type="p">177:貫通孔</p>  
        <p type="p">190:撞針</p>  
        <p type="p">191:推壓銷</p>  
        <p type="p">192:致動器部</p>  
        <p type="p">193:直接傳動機構</p>  
        <p type="p">200:本體部</p>  
        <p type="p">201:銷</p>  
        <p type="p">202:外周肋</p>  
        <p type="p">203:中央肋</p>  
        <p type="p">204:吸引口</p>  
        <p type="p">204a:吸引管</p>  
        <p type="p">205:吸引裝置</p>  
        <p type="p">301:外側吸附部</p>  
        <p type="p">302:內側吸附部</p>  
        <p type="p">500:攝像部</p>  
        <p type="p">510:第1攝像部</p>  
        <p type="p">530:第3攝像部</p>  
        <p type="p">R1:第1吸引區域</p>  
        <p type="p">R2:第2吸引區域</p>  
        <p type="p">W1:第1基板</p>  
        <p type="p">W2:第2基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1579" publication-number="202628892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260319B">H10P72/30</main-classification>  
        <further-classification edition="202601120260319B">H10P14/60</further-classification>  
        <further-classification edition="200601120260319B">C23C16/44</further-classification>  
        <further-classification edition="200601120260319B">C23C16/458</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤圭祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDOH, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田知希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 在處理複數基板的基板處理裝置中適切地進行基板的位置調整。 &lt;br/&gt;　　[解決手段] 基板處理裝置，具有：具有複數載置台，處理載置於載置台的基板的處理模組；向處理模組搬送基板的第1搬送模組；對能收容複數基板的收容容器搬送基板的第2搬送模組；設於第1搬送模組與第2搬送模組之間，能收容複數由第1搬送模組或第2搬送模組搬送的基板的裝載鎖定模組。裝載鎖定模組，具有：支持複數基板，能將中心位置作為旋轉軸旋轉的第1支持部；能將第1支持部在旋轉方向驅動的第1驅動機構；支持基板，能在通過中心位置的徑方向移動的第2支持部；能將第2支持部在徑方向驅動的第2驅動機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20a:裝載鎖定模組</p>  
        <p type="p">100:腔室</p>  
        <p type="p">120:緩衝板</p>  
        <p type="p">120c:中心</p>  
        <p type="p">140:載台</p>  
        <p type="p">150:對準器</p>  
        <p type="p">151:配向檢測部</p>  
        <p type="p">152:支持銷</p>  
        <p type="p">154:投光部</p>  
        <p type="p">B:徑方向</p>  
        <p type="p">R1~R4:載台區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1580" publication-number="202627088"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627088.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向ＡＰＯＣ３基因的ＲＮＡｉ劑及其用途</chinese-title>  
        <english-title>RNAI AGENT TARGETING APOC3 GENE AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/7088</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商翰森（上海）健康科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSOH (SHANGHAI) HEALTHTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴峻賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔正容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOE, JEONG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種靶向APOC3基因的RNAi劑及其用途。更特別地，提供了一種包括與APOC3 mRNA序列具有序列互補性的反義鏈和與該反義鏈具有序列互補性的有義鏈的RNAi劑，以及一種用於預防或治療脂質代謝相關疾病的包括該RNAi劑的醫藥組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are an RNAi agent targeting an apolipoprotein C-III (APOC3) gene, and use thereof. More specifically, provided are an RNAi agent including an antisense strand that has sequence complementarity to an APOC3 mRNA sequence and a sense strand that has sequence complementarity to the antisense strand, and a pharmaceutical composition for preventing or treating a lipid metabolism-related disease, including the RNAi agent.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1581" publication-number="202627015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133150</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性黏著劑組合物、黏著劑、附黏著劑之構件、黏著劑之製造方法、硬化體、構件及硬化體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09J11/02</main-classification>  
        <further-classification edition="200601120260401B">C09J133/00</further-classification>  
        <further-classification edition="200601120260401B">C09J201/02</further-classification>  
        <further-classification edition="200601120260401B">C09J4/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹原一輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAHARA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供之光硬化性黏著劑組合物包含單體成分M、單體成分M之聚合物、光起始劑、及著色劑。上述光硬化性黏著劑組合物中，聚合物相對於單體成分M與聚合物之合計之比率為7.5重量%以上。該光硬化性黏著劑組合物雖包含著色劑，但亦適於抑制硬化不良。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基材</p>  
        <p type="p">12:(黏著劑組合物A之)塗佈物</p>  
        <p type="p">13:光</p>  
        <p type="p">14:黏著劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1582" publication-number="202626039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體組成物及其製造方法</chinese-title>  
        <english-title>SOLID COMPOSITION AND METHOD FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/4535</main-classification>  
        <further-classification edition="200601120260401B">A61K31/165</further-classification>  
        <further-classification edition="200601120260401B">A61K36/48</further-classification>  
        <further-classification edition="200601120260401B">A61K9/20</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共健康事業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野宏大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]在於提供具有充分的硬度之包含選自由替哌啶及其鹽所成群組之至少1種的固體組成物。 &lt;br/&gt;　　[解決手段]一種固體組成物，其包含選自由替哌啶及其鹽所成群組之至少1種與甘草。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">[PROBLEM]&lt;b&gt;&lt;br/&gt;&lt;/b&gt; To provide a solid composition comprising at least one member selected from the group consisting of tipepidine and its salts, said composition having sufficient hardness. &lt;br/&gt;&lt;br/&gt;[SOLUTION]&lt;b&gt;&lt;br/&gt;&lt;/b&gt; A solid composition comprising at least one member selected from the group consisting of tipepidine and its salts, and Glycyrrhiza.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1583" publication-number="202626022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體組成物及其製造方法</chinese-title>  
        <english-title>SOLID COMPOSITION AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/167</main-classification>  
        <further-classification edition="200601120260401B">A61K31/198</further-classification>  
        <further-classification edition="200601120260401B">A61K36/484</further-classification>  
        <further-classification edition="200601120260401B">A61K9/20</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共健康事業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野宏大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題在於提供具有充分的硬度的包含乙醯胺酚的固體組成物。 &lt;br/&gt;　　其解決手段為一種固體組成物，其包含乙醯胺酚、甘胺酸及甘草。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide a solid composition containing acetaminophen that has sufficient hardness. &lt;br/&gt;Provided is a solid composition comprising acetaminophen, glycine, and licorice.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1584" publication-number="202626010"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626010.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>1劑式染髮料組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/49</main-classification>  
        <further-classification edition="200601120260401B">A61K8/39</further-classification>  
        <further-classification edition="200601120260401B">A61K8/41</further-classification>  
        <further-classification edition="200601120260401B">A61K8/86</further-classification>  
        <further-classification edition="200601120260401B">A61Q5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島津綾子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMAZU, AYAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川雄也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>家徳麻由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATOKU, MAYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩永優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWANAGA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種1劑式染髮料組成物，其能夠穩定地調配規定之黑色素前驅物、及特定之直接染料，其結果為，能夠實現毛髮之多彩之顏色表現，進而，處理後之毛髮之觸感良好。 &lt;br/&gt;即，本發明提供一種1劑式染髮料組成物，其含有以下成分(A)～(E)： &lt;br/&gt;(A)下述式(1)所表示之化合物或其鹽 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="152px" width="308px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，虛線表示存在或不存在π鍵；R&lt;sup&gt;1&lt;/sup&gt;表示羥基或乙醯氧基；R&lt;sup&gt;2&lt;/sup&gt;表示氫原子或-COOR(R為氫原子、甲基或乙基)；R&lt;sup&gt;3&lt;/sup&gt;表示氫原子、乙醯基、甲基或乙基) &lt;br/&gt;(B)中性或陰離子性之直接染料 &lt;br/&gt;(C)鹼劑 &lt;br/&gt;(D)非離子性界面活性劑 &lt;br/&gt;(E)陽離子性界面活性劑， &lt;br/&gt;上述成分(D)之含有質量相對於上述成分(B)之含有質量之比(D)/(B)為3.0以上30.0以下，上述1劑式染髮料組成物之pH值為8.0以上11.0以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1585" publication-number="202628120"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628120.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＣＲＩＳＰＲ修復活體外篩選（ＣＲＩＳ）脫靶評定</chinese-title>  
        <english-title>CRISPR REPAIR IN VITRO SCREEN (CRIS) OFF-TARGET ASSESSMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260401B">G16B20/20</main-classification>  
        <further-classification edition="201901120260401B">G16B30/10</further-classification>  
        <further-classification edition="201901120260401B">G16B40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商建南德克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENENTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦爾米　索倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARMING, SOREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴爾嘉瓦　維普爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHARGAVA, VIPUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藍　卡洛琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALAN, CAROLINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密凱　安德魯　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCKAY, ANDREW SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐　素英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧茲　薩洽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUTZ, SASCHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所揭示者為評定由 CRISPR Cas 核酸酶系統產生的脫靶位點之方法，其中該等方法相比習知策略需要較少細胞且可以提供穩健的相比於雜訊的訊號讀段。亦提供使用計算管線從所得讀段鑑定 Cas 核酸酶脫靶切割位點之方法，該計算管線包括在針對該 Cas 核酸酶的已知在靶及脫靶切割位點方面進行訓練的人工神經網路模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods to assess off-target sites resulting from CRISPR Cas nuclease systems wherein the methods require fewer cells than conventional strategies and can provide robust signal reads over noise. Also provided are methods of identifying Cas nuclease off-target cut-sites from the resulting reads using a computational pipeline including an artificial neural network model trained on known on-target and off-target cut-sites for the Cas nuclease.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1586" publication-number="202626637"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626637.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非晶形激酶抑制劑調配物及其使用方法</chinese-title>  
        <english-title>AMORPHOUS KINASE INHIBITOR FORMULATIONS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C07D471/04</main-classification>  
        <further-classification edition="200601120260319B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260319B">A61K9/14</further-classification>  
        <further-classification edition="200601120260319B">A61K9/20</further-classification>  
        <further-classification edition="200601120260319B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商迪賽孚爾製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECIPHERA PHARMACEUTICALS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>考夫曼　麥克　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAUFMAN, MICHAEL D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯姆　科里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOOM, COREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯恩　斯科特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONE, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬丹　弗雷德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JORDAN, FRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種式(I)表示之非晶型化合物： &lt;br/&gt;&lt;img align="absmiddle" height="202px" width="363px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b/&gt;&lt;b/&gt;&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;其有用於治療與c-KIT及PDGFRα激酶活性以及其致癌形式相關之病症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is an amorphous compound represented by Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="193px" width="362px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;b/&gt;&lt;br/&gt;which are useful in the treatment of disorders related to the activity of the c-KIT and PDGFRα kinases, and oncogenic forms thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1587" publication-number="202626673"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626673.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>SMARCA2抑制劑及其製備方法和用途</chinese-title>  
        <english-title>SMARCA2 INHIBITORS AND PREPARATION METHODS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D519/00</main-classification>  
        <further-classification edition="200601120260401B">C07D513/04</further-classification>  
        <further-classification edition="200601120260401B">C07D471/14</further-classification>  
        <further-classification edition="200601120260401B">A61K31/554</further-classification>  
        <further-classification edition="200601120260401B">A61K31/496</further-classification>  
        <further-classification edition="200601120260401B">A61K31/444</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4545</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5383</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260401B">A61K31/551</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HONGBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊純道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUNDAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢　文遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, WENYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸王釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WANGZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石穀沁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, GUQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐一鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　維梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEIMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　大慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, DAQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開屬於醫藥化學領域，具體涉及稠環類SMARCA2抑制劑及其製備方法和用途。該類化合物具有優異的SMARCA2抑制活性，能夠用於治療SMARCA2介導的疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure belongs to the field of medicinal chemistry and specifically relates to fused-ring SMARCA2 inhibitors and preparation methods and uses thereof. The compounds possess excellent SMARCA2 inhibitory activity and can be used to treat SMARCA2-mediated diseases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1588" publication-number="202626162"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626162.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遊戲系統、遊戲系統的動作方法以及程式</chinese-title>  
        <english-title>GAME SYSTEM, ACTION METHOD FOR GAME SYSTEM AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260318B">A63F13/533</main-classification>  
        <further-classification edition="201401120260318B">A63F13/79</further-classification>  
        <further-classification edition="201401120260318B">A63F13/825</further-classification>  
        <further-classification edition="201401120260318B">A63F13/46</further-classification>  
        <further-classification edition="200601120260318B">A63F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科樂美遊樂有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONAMI AMUSEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木庸輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤岩清太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAIWA, SEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中坂昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASAKA, NOBORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三登章裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITO, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種遊戲系統，其係提供適用第一遊戲要素的遊戲之遊戲系統，包括：控制部32，用以對複數個玩家的各者，將與第一遊戲要素相關的第一參數，基於該玩家的遊戲的進行來進行變更；以及接收部31，用以接收來自複數個玩家的第一遊戲要素的選擇；其中，接收部31基於玩家的第一參數，優先地接收複數個玩家的各者所進行的第一遊戲要素的選擇。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A game system provides a game to which a first game element is applied. The game system includes: a control unit 32 configured to change a first parameter related to the first game element for each of a plurality of players based on the progress of the game by the player; and an acceptance unit 31 configured to accept a selection of the first game element from the plurality of players. The acceptance unit 31 preferentially accepts the selection of the first game element by each of the plurality of players based on the first parameter of the player.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:遊戲系統</p>  
        <p type="p">10:控制系統</p>  
        <p type="p">11:控制裝置</p>  
        <p type="p">12:儲存裝置</p>  
        <p type="p">20:機臺</p>  
        <p type="p">P:玩家</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1589" publication-number="202627698"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627698.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title>SUBSTRATE TREATING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G03F7/30</main-classification>  
        <further-classification edition="200601120260318B">G03F7/004</further-classification>  
        <further-classification edition="200601120260318B">G03F7/32</further-classification>  
        <further-classification edition="202601120260318B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中友耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河原崎光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWARAZAKI, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野哲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, TEPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費蓋雷多多斯桑托斯　安德列婭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIGUEIREDO DOS SANTOS, ANDREIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡龍　埃爾克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARON, ELKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>燦德斯　韋斯利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANDERS, WESLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐秀梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIUMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供可適當地對基板進行處理的基板處理方法。 &lt;br/&gt;本發明係關於一種對基板W進行處理的基板處理方法。基板處理方法具備顯影步驟與處理液供給步驟與固化膜形成步驟與昇華步驟。於顯影步驟中，對基板W供給顯影液53。於處理液供給步驟中，對基板W供給處理液55。處理液55含有昇華性物質與溶媒。於固化膜形成步驟中，處理液之溶媒係從基板W上之處理液55蒸發。於固化膜形成步驟中，於基板W上形成固化膜57。固化膜57含有昇華性物質。於昇華步驟中，固化膜57進行昇華。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1590" publication-number="202628489"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628489.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在光源中之蝕刻的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS OF ETCHING IN LIGHT SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H05G2/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米特拉　皮塔姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITRA, PITAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　悅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史圖華特　約翰　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEWART, JOHN TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威克　約翰　查爾斯　赫希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WICK, JOHN CHARLES HIRSCHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃哈伊　達娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EHYAEI, DANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗倫澤爾　亞歷克斯　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRENZEL, ALEX JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪李奧基納　妮納　弗拉基米羅夫娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DZIOMKINA, NINA VLADIMIROVNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光源，其包括：一容器，其包含一第一襯裡，其中該第一襯裡具有一平截頭體形狀；一排出模組，其鄰近於該第一襯裡配置；一蝕刻組件，其鄰近於該排出模組配置；以及一氣體供應件，其耦接至該蝕刻組件。該蝕刻組件包括至少一個天線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light source includes a vessel containing a first liner, wherein the first liner has a frustum shape, an exhaust module arranged adjacent to the first liner, an etching component arranged adjacent to the exhaust module, and a gas supply coupled to the etching component. The etching component includes at least one antenna.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:光源</p>  
        <p type="p">501:腔室</p>  
        <p type="p">502:容器</p>  
        <p type="p">504:排出模組</p>  
        <p type="p">506:源材料遞送系統</p>  
        <p type="p">508:源材料</p>  
        <p type="p">510:輻照區</p>  
        <p type="p">512:雷射</p>  
        <p type="p">514:電漿</p>  
        <p type="p">516a:襯裡</p>  
        <p type="p">516b:襯裡</p>  
        <p type="p">516c:襯裡</p>  
        <p type="p">517:罩蓋結構</p>  
        <p type="p">518:收集器</p>  
        <p type="p">520:中間焦點</p>  
        <p type="p">521:碎屑</p>  
        <p type="p">522:氣體施配器</p>  
        <p type="p">523:通路</p>  
        <p type="p">526:洗滌器</p>  
        <p type="p">528:氣體冷卻器</p>  
        <p type="p">530:污染物通道</p>  
        <p type="p">530A:第一部分</p>  
        <p type="p">532:蝕刻組件</p>  
        <p type="p">533:區</p>  
        <p type="p">534:氣體供應件</p>  
        <p type="p">535:流體連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1591" publication-number="202625967"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625967.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經組態用於血壓估計的光聲裝置</chinese-title>  
        <english-title>PHOTOACOUSTIC DEVICES CONFIGURED FOR BLOOD PRESSURE ESTIMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61B5/021</main-classification>  
        <further-classification edition="200601120260401B">A61B5/0285</further-classification>  
        <further-classification edition="200601120260401B">A61B8/06</further-classification>  
        <further-classification edition="200601120260401B">A61B8/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞葛拉瓦　蘇密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGRAWAL, SUMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘查瓦赫　赫希凱什維傑庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANCHAWAGH, HRISHIKESH VIJAYKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯克斯　艾蜜莉凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROOKS, EMILY KATHRYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬爾傑夫　科斯塔丁季米特洛夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DJORDJEV, KOSTADIN DIMITROV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施耐德　約翰基斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDER, JOHN KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些所揭示的實例涉及由一設備的一控制系統控制該設備的一光源系統以提供光至該設備之一外表面上的一目標物體；及由該控制系統接收來自單一陣列中的複數個M個超音波接收器元件的各者的超音波接收器信號，該等超音波接收器信號對應於由該目標物體回應於該光而產生的超音波。一些所揭示的實例涉及由該控制系統基於該等超音波接收器信號而偵測該目標物體內的一動脈；及由該控制系統基於該等超音波接收器信號而估計該動脈內的一血壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some disclosed examples involve controlling, by a control system of an apparatus, a light source system of the apparatus to provide light to a target object on an outer surface of the apparatus and receiving, by the control system, ultrasonic receiver signals from each of a plurality of M ultrasonic receiver elements in a single array, the ultrasonic receiver signals corresponding to ultrasonic waves generated by the target object responsive to the light. Some disclosed examples involve detecting, by the control system, an artery within the target object based on the ultrasonic receiver signals and estimating, by the control system, a blood pressure within the artery based on the ultrasonic receiver signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">705,710,715,720:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1592" publication-number="202627186"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627186.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以維持穩定噴淋頭溫度來改善晶圓間效能的電漿加熱</chinese-title>  
        <english-title>PLASMA HEATING TO MAINTAIN STABLE SHOWERHEAD TEMPERATURE TO IMPROVE WAFER-TO-WAFER PERFORMANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C23C16/50</main-classification>  
        <further-classification edition="200601120260325B">C23C16/54</further-classification>  
        <further-classification edition="200601120260325B">C23C16/46</further-classification>  
        <further-classification edition="200601120260325B">C23C16/52</further-classification>  
        <further-classification edition="200601120260325B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯雨塵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, YUCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文係提供一種藉由電漿加熱來維護沉積室的方法。該電漿加熱可涉及在某些情況下，使用產生自一氧化二氮氣體的電漿來加熱噴淋頭及沉積室。該電漿加熱係在沉積室閒置且不包含基板時，於沉積製程之間進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods for maintaining a deposition chamber by plasma heating. The plasma heating can involve heating the showerhead and the deposition chamber, in some cases, using plasma generated from the nitrous oxide gas. The plasma heating is performed between the deposition（s） while the deposition chamber is idle and does not contain a substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">101、103、105、111、113:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1593" publication-number="202628039"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628039.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其驅動方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND A DRIVING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">G09G3/30</main-classification>  
        <further-classification edition="200601120260127B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程怡瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERNG, YI-SHIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳勇勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUNG-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種顯示裝置及其驅動方法。顯示裝置包含基板、多個像素、第一閘極驅動器、第二閘極驅動器以及控制電路。多個像素設置於基板上。第一閘極驅動器具有第一輸出端耦接至多個像素。第二閘極驅動器具有第二輸出端共同耦接至多個像素。控制電路電性耦接第一閘極驅動器，用以選擇性地停用第一閘極驅動器。其中當第一閘極驅動器被停用時，第一輸出端呈現浮接狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides a display device and a driving method thereof. The display device includes a substrate, a plurality of pixels, a first gate driver, a second gate driver, and a control circuit. The plurality of pixels are disposed on the substrate. The first gate driver has a first output terminal coupled to the plurality of pixels. The second gate driver has a second output terminal commonly coupled to the plurality of pixels. The control circuit is electrically coupled to the first gate driver for selectively disabling the first gate driver. When the first gate driver is disabled, the first output terminal is in a floating state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:顯示裝置</p>  
        <p type="p">20:基板</p>  
        <p type="p">22:像素</p>  
        <p type="p">30:第一閘極驅動器</p>  
        <p type="p">40:移位暫存器</p>  
        <p type="p">50:輸出級電路</p>  
        <p type="p">70:控制電路</p>  
        <p type="p">80:第二閘極驅動器</p>  
        <p type="p">90:電路</p>  
        <p type="p">100:源極驅動器</p>  
        <p type="p">A1、A2:輸出端</p>  
        <p type="p">Dn:閘極線</p>  
        <p type="p">OUT:閘極驅動訊號</p>  
        <p type="p">S1至Sm:資料線</p>  
        <p type="p">SG1、SG2:閘極訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1594" publication-number="202626970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機聚矽氧烷組成物、硬化物及積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08L83/05</main-classification>  
        <further-classification edition="200601120260323B">C09J183/07</further-classification>  
        <further-classification edition="200601120260323B">C08G77/398</further-classification>  
        <further-classification edition="200601120260323B">C08F4/80</further-classification>  
        <further-classification edition="200601120260323B">C08F2/40</further-classification>  
        <further-classification edition="200601120260323B">C08F2/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內田誠也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIDA, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種有機聚矽氧烷組成物，其特徵在於包含下述(A)至(C)成分：(A)含有與矽原子鍵結的烯基的直鏈狀有機聚矽氧烷；(B)含有與矽原子鍵結的氫原子的有機氫聚矽氧烷；(C)以下述式(1)所表示的鉑族金屬觸媒。藉此提供一種有機聚矽氧烷組成物，該有機聚矽氧烷組成物於常溫（約25～40℃左右）遮光下可長期儲存，且藉由紫外線照射而快速交聯。&lt;br/&gt;&lt;img align="absmiddle" height="175px" width="233px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1595" publication-number="202628825"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628825.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用鹵化碳的形貌選擇性蝕刻</chinese-title>  
        <english-title>TOPOGRAPHICALLY SELECTIVE ETCH WITH HALOGENATED CARBON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P50/20</main-classification>  
        <further-classification edition="202601120260325B">H10P14/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　喬納森　格蘭特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKER, JONATHAN GRANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾嘉沃　普爾基特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, PULKIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文的揭露範例關於利用形貌選擇性沉積和選擇性蝕刻來塑形特徵部。一範例提供在基板特徵部上塑形間隙填充材料膜的方法，該方法包括在基板的間隙填充材料的一部分上進行形貌選擇性碳膜沉積。方法更包括使用含鹵素蝕刻劑形成電漿，從而將含鹵素蝕刻劑中的鹵素物種摻入碳膜中，形成鹵化碳膜。方法更包括對碳膜進行灰化，從而導致在被鹵化碳膜覆蓋的位置處選擇性地藉由鹵素物種蝕刻間隙填充材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Examples are disclosed that relate to shaping a feature using a topologically selective deposition and selective etch. One example provides a method for shaping a film of a gapfill material on a feature of a substrate, the method comprising performing a topologically selective deposition of a carbon film on a portion of the gapfill material of the substrate. The method further comprising forming a plasma using a halogen-containing etchant to incorporate halogen species from the halogen-containing etchant into the carbon film to form a halogenated carbon film. The method further comprising ashing the carbon film to thereby cause etching of the gapfill material by the halogen species selectively at locations that were covered by the halogenated carbon film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">302-324:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1596" publication-number="202627490"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627490.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針及探針的製造方法</chinese-title>  
        <english-title>PROBE AND METHOD FOR MANUFACTURING THE PROBE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G01R1/067</main-classification>  
        <further-classification edition="200601120260317B">G01R1/073</further-classification>  
        <further-classification edition="200601120260317B">G01R3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈良勇斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福士直城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的探針係具備：本體部，係具有沿軸向伸縮的彈簧構造；及第一前端部，係連接於本體部之一方的端部。第一前端部係包含：在相互之間未固定且經電性連接的狀態下沿軸向依序配置的第一部分與第二部分。第一部分與第二部分係組合成能夠在第一部分的中心軸和第二部分的中心軸一致的狀態與傾斜地交叉的狀態之間變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe includes: a main body portion having a spring structure capable of expanding and contracting in an axial direction; and a first tip portion connected to one end portion of the main body portion. The first tip portion includes a first portion and a second portion which are arranged in order in the axial direction in a state where the first portion and the second portion are not fixed to each other and are electrically connected. The first portion and the second portion are combined so as to be changeable between a state in which a central axis of the first portion coincides with a central axis of the second portion and a state in which the central axes intersect obliquely.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:探針</p>  
        <p type="p">11:第一前端部</p>  
        <p type="p">11A:第一部分</p>  
        <p type="p">11B:第二部分</p>  
        <p type="p">12:第二前端部</p>  
        <p type="p">100:本體部</p>  
        <p type="p">101:凹部</p>  
        <p type="p">102:凸部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1597" publication-number="202626638"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626638.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一類吲唑衍生物的前藥及其製備方法和用途</chinese-title>  
        <english-title>PRODRUG OF INDAZOL DERIVATIVE, PREPARATION METHOD THEREFOR AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D471/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海亞虹醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIERIS PHARMACEUTICALS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇亞虹醫藥科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU YAHONG MEDITECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋海峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, HAIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖璐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張潤濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RUNTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一類吲唑衍生物的前藥及其製備方法和用途。具體而言，本發明涉及一種通式(I)所示的前藥化合物、其製備方法及含有該類化合物的醫藥組成物，以及其用於治療FGFR突變引起的疾病的用途。其中通式(I)中各基團如說明書中所定義。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="174px" width="296px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a prodrug of indazol derivative, preparation method therefor and use thereof. Specifically, the present invention relates to a prodrug compound represented by general formula (I), a preparation method therefor, a pharmaceutical composition containing the same, and a use thereof in the treatment of diseases caused by FGFR mutations. Each group in general formula (I) is defined in the description.</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="176px" width="300px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1598" publication-number="202628915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓狀物件的處理設備</chinese-title>  
        <english-title>APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P72/70</main-classification>  
        <further-classification edition="202601120260325B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商蘭姆研究股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊恩　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIEN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福斯　羅曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUCHS, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>剛柯斯　拉約什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANCS, LAJOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊姆　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLEMM, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶圓狀物件的處理設備，此處理設備包括：用於支撐晶圓狀物件的支撐件；以及加熱組件，加熱組件包括用於加熱由支撐件所支撐的晶圓狀物件的LED陣列；其中，LED配置為發出在波長大於或等於550 nm且小於或等於980 nm處具有最大強度的光線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus for processing wafer-shaped articles, the apparatus comprising: a support configured to support a wafer-shaped article; and a heating assembly comprising an array of LEDs configured to heat a wafer-shaped article supported by the support; wherein the LEDs are configured to emit light having a maximum intensity at a wavelength that is greater than or equal to 550nm and less than or equal to 980nm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:設備</p>  
        <p type="p">3:晶圓</p>  
        <p type="p">5:可旋轉卡盤</p>  
        <p type="p">7:卡盤本體</p>  
        <p type="p">9:基座</p>  
        <p type="p">11:旋轉軸</p>  
        <p type="p">13:夾持銷</p>  
        <p type="p">15:平板</p>  
        <p type="p">17:加熱組件</p>  
        <p type="p">19:LED</p>  
        <p type="p">21:平板</p>  
        <p type="p">23:電路板</p>  
        <p type="p">25:固定柱</p>  
        <p type="p">27:第一表面</p>  
        <p type="p">29:第二表面</p>  
        <p type="p">31:臂</p>  
        <p type="p">33:排出噴嘴</p>  
        <p type="p">34:腔室</p>  
        <p type="p">41:氣體供應通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1599" publication-number="202627929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於促進目標群組的行動的方法及其系統</chinese-title>  
        <english-title>METHOD FOR PROMOTING ACTIONS OF A TARGET GROUP AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260331B">G06Q30/018</main-classification>  
        <further-classification edition="202301120260331B">G06Q30/0208</further-classification>  
        <further-classification edition="202301120260331B">G06Q30/0211</further-classification>  
        <further-classification edition="201901120260331B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商奇森漢佛科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIESENHOFER TECH LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯　君剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAU, KWAN KONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於促進目標群組的行動的方法及其系統。在一個實施例中，所述方法是電腦實現的方法，其用於執行操作以促進目標群組利用設備讀取識別符。在一個實施例中，所述方法包括以下步驟：a)讀取與特定資料類別相關聯的所述識別符並檢驗其有效性，其中，所述識別符觸發資料處理硬體接收對所述識別符唯一的輸入資料；以及b)提供與所述特定資料類別配對的輸出R，其中，所述輸出值足以觸發所述目標群組在存在另一識別符時重複步驟(a)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a computer-implemented method to perform operations to promote a target group to read an identifier with a device. In one embodiment, said method, comprises the steps of: a) Reading and verifying validity of said identifier associated with a specific data class, wherein said identifier triggers a data processing hardware to receive an input data unique to said identifier; and b) Providing an output, 𝑅, paired with said specific data class, wherein said output is of sufficient value to trigger said target group to repeat step (a) when there is another identifier.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1600" publication-number="202626660"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626660.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎之喜樹鹼衍生物及其偶聯物、其製備方法及其應用</chinese-title>  
        <english-title>NOVEL CAMPTOTHECIN DERIVATIVE AND CONJUGATE THEREOF, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D491/22</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">A61K47/38</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商翰森生物有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSOH BIO LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　澤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZECHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雄浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIONGHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　瑾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種新穎喜樹鹼衍生物或其偶聯物、其製備方法及其在醫藥中的用途。具體而言，提供了一種通式（A）所示的化合物或其配體-藥物偶聯物、其製備方法，以及該配體-藥物偶聯物及其藥物組合物在製備用於治療癌症或免疫性疾病的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a novel camptothecin derivative or a conjugate thereof, and a preparation method therefor and an application thereof in medicine. Specifically, provided is a compound represented by general formula (A) or a ligand-drug conjugate thereof, a preparation method therefor, and an application of the ligand-drug conjugate and a pharmaceutical composition thereof in the preparation of a drug for the treatment of cancer or immunological diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1601" publication-number="202627699"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627699.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含金屬光刻膠顯影劑組成物及包括使用其顯影步驟的方法</chinese-title>  
        <english-title>DEVELOPER COMPOSITION FOR METAL-CONTAINING PHOTORESIST, AND METHOD INCLUDING DEVELOPING STEP USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G03F7/32</main-classification>  
        <further-classification edition="200601120260319B">G03F7/20</further-classification>  
        <further-classification edition="202601120260319B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛羅莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, ROSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炯朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HYUNGRANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扈鍾必</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, JONGPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭澤秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, TAEKSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴慶熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GYEONGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴時均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SI-KYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林恩英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, EUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具滋旼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, JAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於含金屬光刻膠的顯影劑組成物以及包括利用顯影劑組成物的顯影步驟的形成圖案的方法。用於含金屬光刻膠的顯影劑組成物可施加至具有暴露部分和未暴露部分的含金屬光刻膠並包括有機溶劑和添加劑，其中暴露部分包括包括金屬-氧-金屬鍵結的金屬氧化物，以及金屬氧化物在末端以羥基取代的，在暴露部分中，包括金屬-氧-金屬鍵結的金屬氧化物和有機溶劑之間的氫鍵數量與包括金屬-氧-金屬鍵結的金屬氧化物和添加劑之間的氫鍵數量的比例大於0且小於或等於關於4.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A developer composition for a metal-containing photoresist and a method of forming patterns including a developing step utilizing the developer composition are disclosed. The developer composition for a metal-containing photoresist may be applied to a metal-containing photoresist having an exposed portion and an unexposed portion and include an organic solvent and an additive, wherein the exposed portion includes a metal oxide including a metal-oxygen-metal bond, and a metal oxide is substituted with a hydroxyl group at the terminal end, in an exposed portion, a ratio of the number of hydrogen bonds between the metal oxide including the metal-oxygen-metal bond and the organic solvent to the number of hydrogen bonds between the metal oxide including the metal-oxygen-metal bond and the additive is greater than 0 and less than or equal to about 4.5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">110P:特徵圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1602" publication-number="202626786"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626786.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物組成物、相位差膜形成用組成物、配向膜形成用組成物及相位差材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F20/30</main-classification>  
        <further-classification edition="200601120260401B">C08K5/00</further-classification>  
        <further-classification edition="200601120260401B">C08L101/02</further-classification>  
        <further-classification edition="200601120260401B">G02B5/30</further-classification>  
        <further-classification edition="202301120260401B">H10K50/86</further-classification>  
        <further-classification edition="202301120260401B">H10K59/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉井友基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根木隆之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEGI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤耕平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚合物組成物，含有下述聚合物(P)及化合物(A&lt;sub&gt;C&lt;/sub&gt;)。 &lt;br/&gt;聚合物(P)：為具有來自具有感光性基(p)及聚合性不飽和鍵的單體化合物之結構單元(X)的聚合物，且前述聚合物與選自於由聚醯亞胺前驅物及為該聚醯亞胺前驅物之醯亞胺化物的醯亞胺化聚合物構成之群組中之聚合物不同。 &lt;br/&gt;化合物(A&lt;sub&gt;C&lt;/sub&gt;)：為具有羧基及鏈狀基，且選自於由下述化合物(A&lt;sub&gt;C&lt;/sub&gt;-1)～(A&lt;sub&gt;C&lt;/sub&gt;-2)構成之群組中之化合物 &lt;br/&gt;化合物(A&lt;sub&gt;C&lt;/sub&gt;-1)：不具有聚合性不飽和鍵的低分子化合物 &lt;br/&gt;化合物(A&lt;sub&gt;C&lt;/sub&gt;-2)：具有聚合性不飽和鍵的化合物(a&lt;sub&gt;C&lt;/sub&gt;)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1603" publication-number="202626789"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626789.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具環狀結構之（甲基）丙烯醯胺化合物、含有該化合物之聚合性組成物及其聚合物、以及含有該等成分之墨水、噴墨用墨水、三維造成用墨水、塗佈劑、黏著劑、接著劑、感光性樹脂、密封劑、牙科材料</chinese-title>  
        <english-title>METHACRYLAMIDE COMPOUND WITH RING STRUCTURE, POLYMER COMPOSITE CONTAINING THE COMPOUND AND POLYMER THEREOF, AND INK, INKJET INK, THREE-DIMENSIONAL MODELING INK, COATING AGENT, ADHESIVE AGENT, BONDING AGENT, PHOTOSENSITIVE RESIN, SEALINGAGENT, DENTAL MATERIAL CONTAINING THE COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C08F20/54</main-classification>  
        <further-classification edition="200601120260327B">C07C233/09</further-classification>  
        <further-classification edition="200601120260327B">C07C233/20</further-classification>  
        <further-classification edition="200601120260327B">C07D307/14</further-classification>  
        <further-classification edition="200601120260327B">C07D307/20</further-classification>  
        <further-classification edition="200601120260327B">C07D307/52</further-classification>  
        <further-classification edition="200601120260327B">C07D307/58</further-classification>  
        <further-classification edition="201401120260327B">C09D11/101</further-classification>  
        <further-classification edition="200601120260327B">C09D133/26</further-classification>  
        <further-classification edition="200601120260327B">C09J133/26</further-classification>  
        <further-classification edition="202001120260327B">B33Y70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科巨希化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KJ CHEMICALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古莊晴香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUSHO, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清貞俊次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIYOSADA, TOSHITSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田英樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種聚合性組成物，係能夠提供低臭氣、高透明性、具有優異的耐彎曲性之硬化物，且對於熱及/或活性能量線具有高硬化性與抗硬化收縮性。&lt;br/&gt; 作為解決手段，發現了一種聚合性組成物，係含有特定的N-取代(甲基)丙烯醯胺，或含有該特定的N-取代(甲基)丙烯醯胺作為結構單元。該N-取代(甲基)丙烯醯胺係具有於(甲基)丙烯醯胺基的氮原子經介2價的鏈狀有機基而鍵結有環狀結構之結構的化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a polymer composite that can form a cured product with low stench, high translucency and good bending resistance. The cured product exhibits high hardenability and anti-hardening shrinkage for thermal and/or active energy lines. &lt;br/&gt; As a solution, a polymer composite containing a specific N-substituted (meth)acrylamide or the specific N-substituted (meth)acrylamide as a structural unit was discovered. Wherein the N-substituted (meth)acrylamide is a compound having a structure where a nitrogen atom of the (meth)acrylamide group is bonded to a ring structure via a divalent chain organic group.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1604" publication-number="202627681"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627681.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133469</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬配線基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G03F7/004</main-classification>  
        <further-classification edition="200601120260317B">G03F7/023</further-classification>  
        <further-classification edition="200601120260317B">H05K3/00</further-classification>  
        <further-classification edition="202601120260317B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鷲見岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢吹峻作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABUKI, SHUNSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷優梨花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANI, YURIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海老澤和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBISAWA, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種金屬配線基板之製造方法，上述金屬配線基板中使用化學增幅型感光性組合物於基板上形成之金屬配線被絕緣膜所被覆，並且能夠於絕緣膜上進而設置其他構件，上述金屬配線基板之製造方法能夠抑制基板與絕緣膜之間之金屬配線之氧化。 &lt;br/&gt;本發明之金屬配線基板之製造方法包括下述步驟：於具有金屬表面之基板上積層包含化學增幅型感光性組合物之感光性層之步驟；以位置選擇性方式向感光性層照射活性光線或放射線而進行曝光之步驟；對曝光後之感光性層進行顯影，從而形成用於藉由鍍覆來形成金屬配線之鑄模之步驟；對形成有鑄模之基板實施鍍覆，從而形成金屬配線之步驟；及利用絕緣膜被覆金屬配線之步驟；化學增幅型感光性組合物包含藉由活性光線或放射線之照射而產生酸之酸產生劑(A)，酸產生劑(A)包含能產生含有特定結構之陰離子之酸之酸產生劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1605" publication-number="202626383"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626383.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單軌台車之水平輪之爆胎檢測方法及爆胎檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B60C23/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈斯納奧伊　巴德爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASNAOUI, BADR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原康介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>干鯛正隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDAI, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合田憲次郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODA, KENJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野修司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種既可將單軌車輛具備之台車之水平輪之爆胎抑制為較小之保養(維持管理)成本，又可簡單且正確地檢測的單軌台車之水平輪之爆胎檢測方法、及爆胎檢測裝置。 &lt;br/&gt;本發明之具備2個以上之具有與軌道樑之側面抵接之水平輪之台車的單軌車輛之水平輪之爆胎檢測方法具有：第1步驟，其檢測上述單軌車輛通過曲線軌道樑之起點；第2步驟，其檢測上述單軌車輛通過上述曲線軌道樑之終點；第3步驟，其取得於上述第1步驟之檢測至上述第2步驟之檢測之期間檢測之上述台車之台車框架之振動加速度之時刻歷程資料；及第4步驟，其基於上述第3步驟之處理結果，判定上述水平輪有無爆胎。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:步驟</p>  
        <p type="p">S20:步驟</p>  
        <p type="p">S30:步驟</p>  
        <p type="p">S40:步驟</p>  
        <p type="p">S50:步驟</p>  
        <p type="p">S60:步驟</p>  
        <p type="p">S70:步驟</p>  
        <p type="p">S80:步驟</p>  
        <p type="p">S90:步驟</p>  
        <p type="p">S100:步驟</p>  
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p>  
        <p type="p">S140:步驟</p>  
        <p type="p">S150:步驟</p>  
        <p type="p">S160:步驟</p>  
        <p type="p">S170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1606" publication-number="202627451"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627451.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板攝像裝置、基板處理裝置、基板攝像方法及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE IMAGING DEVICE, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE IMAGING METHOD AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">G01N21/88</main-classification>  
        <further-classification edition="200601120260320B">G01N21/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本周治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板攝像裝置具備照明部、攝像部及控制部。照明部對由基板保持裝置所保持之基板的上表面照射照明光。攝像部拍攝照明光所照射之基板的上表面。基於攝像部之輸出，獲取表示基板的上表面中之至少一部分區域之狀態的檢查圖像資料。檢查圖像資料係對應於基板所吸收之波長之光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate imaging device includes an illuminator, an imager and a controller. The illuminator irradiates an upper surface of a substrate held by a substrate holding device with illumination light. The imager captures an image of the upper surface of the substrate irradiated with the illumination light. Based on an output of the imager, inspection image data representing a state of at least a partial area of the upper surface of the substrate is acquired. The inspection image data corresponds to light having a wavelength, with the light being absorbed by the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:基板檢查裝置</p>  
        <p type="p">220:照明部</p>  
        <p type="p">240:攝像部</p>  
        <p type="p">241:第1線感測器</p>  
        <p type="p">242:第2線感測器</p>  
        <p type="p">243:第3線感測器</p>  
        <p type="p">250:基板保持裝置</p>  
        <p type="p">260:移動部</p>  
        <p type="p">270:方向檢測部</p>  
        <p type="p">280:控制部</p>  
        <p type="p">281:攝像控制部</p>  
        <p type="p">282:圖像資料生成部</p>  
        <p type="p">283:基板特性判定部</p>  
        <p type="p">284:檢查圖像資料獲取部</p>  
        <p type="p">285:檢查記憶部</p>  
        <p type="p">286:檢查部</p>  
        <p type="p">290:操作部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1607" publication-number="202627424"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627424.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於秤重裝置的支撐件</chinese-title>  
        <english-title>SUPPORT FOR USE IN A WEIGHING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260329B">G01G21/22</main-classification>  
        <further-classification edition="200601120260329B">G01G21/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆薩維　亞伯拉罕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOOSAVI, ABRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐文斯　山姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OWENS, SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾略特　格雷戈爾　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELLIOTT, GREGOR ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝利斯　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYLISS, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於秤重裝置的支撐件，該支撐件包含：一支撐部件，用於在一重量測量期間支撐一物體；一安裝部件，用於將該支撐件安裝於一秤重裝置上；一斷熱結構，設置在該支撐部件和該安裝部件之間；以及一導電部件或靜電耗散部件，圍繞著該斷熱結構的至少一部分設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A support for use in a weighing device, the support comprising: a support part for supporting an object during a weight measurement; a mounting part for mounting the support on a weighing device; a thermal break provided between the support part and the mounting part; and an electrically conductive part or electrostatically dissipative part provided around at least part of the thermal break.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">83:秤重拖盤</p>  
        <p type="p">85:拖盤部件</p>  
        <p type="p">87:荷重元介接銷</p>  
        <p type="p">89:軸</p>  
        <p type="p">91:導電部件</p>  
        <p type="p">93:導電彈簧、彈簧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1608" publication-number="202627172"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627172.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有氣體再循環的處理腔室</chinese-title>  
        <english-title>PROCESSING CHAMBER WITH GAS RECYCLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C23C16/455</main-classification>  
        <further-classification edition="200601120260323B">C23C16/458</further-classification>  
        <further-classification edition="200601120260323B">C23C16/44</further-classification>  
        <further-classification edition="200601120260323B">C23C16/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊斯　麥可羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICE, MICHAEL ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裘依　安納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOY, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘納瓦拉皮耶庫瑪藍庫提　哈尼許庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANAVALAPPIL KUMARANKUTTY, HANISH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納圖　加雅崔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATU, GAYATRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝吉　亞札拉巴斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAIG, AZARABBAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴撒法拉朱　阿布希雪克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASAVARAJU, ABHISHEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋科瓦德　法巴夫夏卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAIKWAD, VAIBHAV SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴沙法拉賈帕　歐普拉卡許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASAVARAJAPPA, OMPRAKASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬治　瓊安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORGE, JOANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇圖略普拉哈蘭德　普拉吉瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITLURE PRAHALLAD, PRAJWAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了具有再循環能力的半導體製造處理腔室及再循環化學前驅物的方法。該處理腔室包括具有基板支撐件的腔室主體。基板支撐件與腔室蓋間隔開以產生製程區域。氣體入口將氣體流提供到製程區域，並且包含第一再循環容積和第二再循環容積的再循環外殼與製程區域流體連通。至少一個第一排氣閥穿過第一再循環入口管線連接到第一再循環氣室，而至少一個第二排氣閥穿過第二再循環入口管線連接到第二再循環氣室。致動器在再循環外殼內移動可動壁，以改變第一再循環容積和第二再循環容積的容積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor manufacturing processing chambers with recycling capability and methods of recycling a chemical precursor are described. The processing chamber comprises a chamber body with a substrate support. The substrate support is spaced from the chamber lid to create a process region. A gas inlet provides a flow of gas to the process region and a recirculation housing comprising a first recirculation volume and a second recirculation volume is in fluid communication with the process region. At least one first exhaust valve is connected to the first recirculation plenum through a first recirculation inlet line and at least one second exhaust valve is connected to the second recirculation plenum through the second recirculation inlet line. An actuator moves a movable wall within the recirculation housing to change the volume of the first recirculation volume and the second recirculation volume.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體處理腔室</p>  
        <p type="p">102:腔室主體</p>  
        <p type="p">104:側壁</p>  
        <p type="p">106:底部</p>  
        <p type="p">108:腔室蓋</p>  
        <p type="p">109:內部體積</p>  
        <p type="p">110:基板支撐件</p>  
        <p type="p">114:半導體晶圓</p>  
        <p type="p">117:中心</p>  
        <p type="p">130:氣體入口</p>  
        <p type="p">132:背襯板</p>  
        <p type="p">145:真空源</p>  
        <p type="p">155:致動器</p>  
        <p type="p">200:排氣氣室</p>  
        <p type="p">202:再循環氣室</p>  
        <p type="p">203:再循環氣室延伸部</p>  
        <p type="p">220:再循環外殼</p>  
        <p type="p">221:下固定壁</p>  
        <p type="p">222:可動壁</p>  
        <p type="p">223:活塞泵側壁</p>  
        <p type="p">223i:內表面</p>  
        <p type="p">223o:外表面</p>  
        <p type="p">224:上固定壁</p>  
        <p type="p">225:側壁</p>  
        <p type="p">230:第一再循環容積</p>  
        <p type="p">232:第一再循環入口管線</p>  
        <p type="p">233:出口端管</p>  
        <p type="p">234:第二再循環入口管線</p>  
        <p type="p">235:出口端管</p>  
        <p type="p">240:第二再循環容積</p>  
        <p type="p">245:製程氣體源</p>  
        <p type="p">246:惰性氣體源</p>  
        <p type="p">247:製程氣體閥</p>  
        <p type="p">248:載送氣體閥</p>  
        <p type="p">249:氣體入口管線</p>  
        <p type="p">250:第一排氣閥</p>  
        <p type="p">260:第二排氣閥</p>  
        <p type="p">270:第一注入閥</p>  
        <p type="p">272:第一注入管線</p>  
        <p type="p">280:第二注入閥</p>  
        <p type="p">282:第二注入管線</p>  
        <p type="p">290:真空閥</p>  
        <p type="p">292:真空管線</p>  
        <p type="p">300:氣體歧管</p>  
        <p type="p">310:安瓿閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1609" publication-number="202628954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製程氣體輸送系統</chinese-title>  
        <english-title>PROCESS GAS DELIVERY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P95/00</main-classification>  
        <further-classification edition="200601120260325B">C23C16/455</further-classification>  
        <further-classification edition="200601120260325B">H01J37/32</further-classification>  
        <further-classification edition="200601120260325B">F16K51/02</further-classification>  
        <further-classification edition="200601120260325B">F16K31/126</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邦特　加烈夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONTHA, GAURAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬錢德拉亞　維賈亞庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMACHANDRAIAH, VIJAYAKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多達曼尼　阿維納什　高達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DODDAMANI, AVINASH GOUDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈亞希拉　阿比金　哈利格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAYASHEELA, ABHIJIN HALIGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯寧　李傑爾　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUENING, RIGEL MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處揭露一種製程氣體輸送系統，包含：一多渠道化學品輸送總成，至少包含一第一前驅物容器及一第二前驅物容器；一第一流量選擇閥，具有一第一入口埠，耦接至該多渠道化學品輸送總成的一第一出口渠道，其中該第一前驅物容器係耦接至該第一出口渠道；一第二流量選擇閥，具有一第二入口埠，耦接至該多渠道化學品輸送總成的一第二出口渠道，其中該第二前驅物容器係耦接至該第二出口渠道。該第一及第二流量選擇閥係耦接至一氣體輸送管線，其耦接至一製程真空腔室的一噴淋頭。該些流量選擇閥係耦接至一第一涓流驅淨管線及一第二涓流驅淨管線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a process gas delivery system comprising a multichannel chemistry delivery assembly, comprising at least a first precursor vessel and a second precursor vessel a first flow selector valve having a first inlet port coupled to a first outlet channel of the multichannel chemistry delivery assembly, wherein the first precursor vessel is coupled to the first outlet channel, a second flow selector valve having a second inlet port coupled to a second outlet channel of the multichannel chemistry delivery assembly, wherein the second precursor vessel is coupled to the second outlet channel. The first and second flow selector valves are coupled to a gas delivery line coupled to a showerhead of a process vacuum chamber. The flow selector valves are coupled to a first trickle purge line and a second trickle purge line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製程氣體輸送系統</p>  
        <p type="p">102:前驅物輸送總成</p>  
        <p type="p">104:前驅物容器</p>  
        <p type="p">106:前驅物容器</p>  
        <p type="p">108:管線</p>  
        <p type="p">110:流量選擇閥</p>  
        <p type="p">112:流量選擇閥</p>  
        <p type="p">114,116:涓流驅淨管線</p>  
        <p type="p">118:氣體輸送管線</p>  
        <p type="p">120:T接頭</p>  
        <p type="p">122:噴淋頭</p>  
        <p type="p">124:製程真空腔室</p>  
        <p type="p">126:分流閥</p>  
        <p type="p">128:分流閥</p>  
        <p type="p">130:分流管線</p>  
        <p type="p">132:分流管線</p>  
        <p type="p">134:腔室斷接區塊</p>  
        <p type="p">135:維護真空管線</p>  
        <p type="p">136:真空前級管線</p>  
        <p type="p">137:維護真空管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1610" publication-number="202626598"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626598.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗病毒組成物及其使用方法</chinese-title>  
        <english-title>ANTIVIRAL COMPOSITIONS AND METHODS OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C279/16</main-classification>  
        <further-classification edition="202601120260401B">C07K16/10</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P31/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商維爾生物科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIR BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔻迪　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORTI, DAVIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫蒙特　科里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOMONT, COREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森　蘿拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSEN, LAURA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤　大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, ROLAND D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史尼爾　宅爾吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNELL, GYORGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索菲耶夫　維拉得摩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOFIYEV, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　浚鉻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSE, WINSTON C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供藥物接合物或藥物Fc接合物，其用於治療及/或預防有需要之對象中之流感病毒感染。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides antibody-drug conjugates or drug-Fc conjugates for treating and/or preventing an influenza viral infection in a subject in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1611" publication-number="202628177"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628177.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RF返回路徑用蓋環</chinese-title>  
        <english-title>COVER RING FOR RF RETURN PATH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01J37/32</main-classification>  
        <further-classification edition="200601120260325B">H05H1/46</further-classification>  
        <further-classification edition="200601120260325B">H05H1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔琳鍈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, LINYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍藍德　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLAND, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供針對電漿製程腔室提供接地返回路徑的接地組件，該接地組件包含：配置成環繞基板支撐件的金屬接地環，該金屬接地環具有沿著金屬接地環之頂部定義的環形袋部；安置於環形袋部內的RF墊片環；矽蓋環，其覆蓋金屬接地環之頂部，並將RF墊片環密封於環形袋部內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ground assembly that provides a ground return path for a plasma process chamber is provided, including: a metal ground ring configured to surround a substrate support, the metal ground ring having an annular pocket defined along a top portion of the metal ground ring; an RF gasket ring seated within the annular pocket; a silicon cover ring that covers the top portion of the metal ground ring and seals the RF gasket ring within the annular pocket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:ESC</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:介電環</p>  
        <p type="p">106:邊緣環</p>  
        <p type="p">108:內接地環</p>  
        <p type="p">110:C形護罩</p>  
        <p type="p">112:蓋環</p>  
        <p type="p">114:RF墊片</p>  
        <p type="p">116:外接地環</p>  
        <p type="p">118:RF帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1612" publication-number="202627164"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627164.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133515</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C23C16/40</main-classification>  
        <further-classification edition="202501120260323B">H10D84/08</further-classification>  
        <further-classification edition="200601120260323B">C30B29/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上東洋太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHIGASHI, YOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松原壽樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBARA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤三千登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MICHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種半導體基板及其製造方法，該半導體基板的特徵在於具有：主面的面取向為(111)的Si基板、該Si基板上的3C-SiC層及該3C-SiC層上的GaO&lt;sub&gt;2&lt;/sub&gt;層。藉此可提供一種半導體基板，其係使高品質的GaO&lt;sub&gt;2&lt;/sub&gt;成長於大直徑的Si基板而成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體基板</p>  
        <p type="p">2,3:Si(111)基板</p>  
        <p type="p">4:3C-SiC層</p>  
        <p type="p">5:GaO&lt;sub&gt;2&lt;/sub&gt;層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1613" publication-number="202627662"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627662.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相位移空白光罩及相位移光罩之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260318B">G03F1/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮島千晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAJIMA, CHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">解決方式：一種相位移空白光罩，其具備相位移膜，與鄰接於相位移膜而形成之以含有鉻之材料來形成之遮光膜，其中，將相位移膜以含有矽且不含碳之材料來形成，將遮光膜以含有鉻、氧、氮及碳之材料來形成，將遮光膜以具有從遠離透明基板側起依序包含第1層、第2層、第3層及第4層之4層，或第1層、第3層、第2層及第4層之4層，第1層為自透明基板最遠離側之層，第4層為與相位移膜鄰接之層之積層構造的方式構成，將第2層設為含有碳之層，將與相位移膜鄰接之第4層設為不含碳之層。 &lt;br/&gt;　　效果：可將在相位移光罩之製造中使用之光阻膜薄膜化，此外，可提供難以產生霧靄，即使以含有硫酸之水溶液洗淨，相位移膜之光學特性亦難以變化之相位移光罩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:透明基板</p>  
        <p type="p">2:相位移膜</p>  
        <p type="p">3:遮光膜</p>  
        <p type="p">30:積層構造</p>  
        <p type="p">31:第1層</p>  
        <p type="p">32:第2層</p>  
        <p type="p">33:第3層</p>  
        <p type="p">34:第4層</p>  
        <p type="p">101:相位移空白光罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1614" publication-number="202626447"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626447.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133525</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>寵物食品製品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B65D1/34</main-classification>  
        <further-classification edition="200601120260401B">B65D77/20</further-classification>  
        <further-classification edition="200601120260401B">B65D85/72</further-classification>  
        <further-classification edition="201601120260401B">A23K10/00</further-classification>  
        <further-classification edition="201601120260401B">A23K50/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商優你　嬌美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNICHARM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>農端理壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOBATA, TADATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　雲怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, YUNYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]防止梅納反應物附著於容置有濕食品之杯狀容置部的底面。&lt;br/&gt; [解決手段]一種寵物食品製品之製造方法，前述寵物食品製品1具備：容器8，具有容置有濕食品7之杯狀容置部11；及蓋體(密封片材9)，覆蓋杯狀容置部11的開口11a，前述寵物食品製品之製造方法具有殺菌工序，前述殺菌工序是對容置在被蓋體(密封片材9)覆蓋開口11a之容器8的濕食品7進行殺菌釜殺菌。在殺菌工序中，是以將容器8的開口11a朝向上方的狀態進行殺菌釜殺菌。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:寵物食品製品</p>  
        <p type="p">11:杯狀容置部</p>  
        <p type="p">11a:開口</p>  
        <p type="p">11d:底部</p>  
        <p type="p">11f:外側底面</p>  
        <p type="p">12:保持部</p>  
        <p type="p">15:載置台(載置構件)</p>  
        <p type="p">15a:載置面</p>  
        <p type="p">7:濕食品</p>  
        <p type="p">8:容器</p>  
        <p type="p">9:密封片材(蓋體)</p>  
        <p type="p">9a:提拿部</p>  
        <p type="p">9b:內側表面</p>  
        <p type="p">P:平面</p>  
        <p type="p">R:梅納反應物</p>  
        <p type="p">V:空隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1615" publication-number="202628798"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628798.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽基板上具有SiGe層之基板及其製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P14/24</main-classification>  
        <further-classification edition="202601120260327B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大關正彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSEKI, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中佑宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上東洋太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHIGASHI, YOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松原壽樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBARA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋慶太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤三千登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MICHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種矽基板上具有SiGe層之基板的製作方法，其包含以下工序：在具有主表面、主背面及邊緣部之矽基板的前述主表面上、前述邊緣部上及前述主背面的與前述邊緣部鄰接的區域上氣相沉積SiGe層的工序；及，藉由研磨將氣相沉積於前述邊緣部上及前述主背面的與前述邊緣部鄰接的區域上的前述SiGe層去除，而使氣相沉積於前述主表面上的前述SiGe層殘留的工序。藉此，提供一種矽基板上具有SiGe層之基板的製作方法，其大幅改善基板的翹曲(BOW)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:SiGe基板(SiGe磊晶基板)</p>  
        <p type="p">2:矽基板(矽單晶基板)</p>  
        <p type="p">3:SiGe層</p>  
        <p type="p">4:邊緣部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1616" publication-number="202627082"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627082.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療Ｂ型肝炎之組成物與方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR TREATMENT OF HEPATITIS B</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N9/16</main-classification>  
        <further-classification edition="201001120260401B">C12N15/113</further-classification>  
        <further-classification edition="200601120260401B">A61K38/46</further-classification>  
        <further-classification edition="200601120260401B">A61K31/7105</further-classification>  
        <further-classification edition="200601120260401B">A61K9/51</further-classification>  
        <further-classification edition="200601120260401B">A61P31/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學醫學院附設醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關使用CRISPR基因編輯技術來修改B型肝炎病毒(HBV)基因體的組合物及方法，以治療受HBV感染的受試者。本發明亦有關經修改的HBV基因體的組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to compositions and methods for modifying the hepatitis B virus (HBV) genome using CRISPR gene editing technology to treat a subject suffering from HBV. The present invention is also related to compositions of modified HBV genomes.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1617" publication-number="202626027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療肌肉萎縮症之吉維諾司他鹽酸鹽一水合物</chinese-title>  
        <english-title>GIVINOSTAT HYDROCHLORIDE MONOHYDRATE FOR USE IN TREATING MUSCULAR DYSTROPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/27</main-classification>  
        <further-classification edition="200601120260401B">A61K31/573</further-classification>  
        <further-classification edition="200601120260401B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商義大利藥品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITALFARMACO S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝帝卡　保羅翁貝托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETTICA, PAOLO UMBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝蘭帝　法蘭切斯柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLANTI, FRANCESCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡查尼加　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAZZANIGA, SARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種在患者中治療肌肉萎縮症之經改善的方法，其包含投予吉維諾司他鹽酸鹽一水合物至需要此種治療之患者，其中投予至患者的吉維諾司他鹽酸鹽一水合物之每日量係取決於患者(他/她)自身的體重。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An improved method for treating muscular dystrophy in a patient is disclosed, comprising administering Givinostat hydrochloride monohydrate to a patient in need of such a treatment wherein the daily amount of Givinostat hydrochloride monohydrate which is administered to the patient depends on the body weight of the patient him/herself.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1618" publication-number="202626318"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626318.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離系統、控制裝置、分離方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B29B17/02</main-classification>  
        <further-classification edition="200601120260202B">C08J11/06</further-classification>  
        <further-classification edition="202201120260202B">B09B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>源田稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENTA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松原亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBARA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係將聚酯與植物性纖維適當地分離。一種分離系統，其具有：溶解部，係供給羧酸衍生之單體與包含聚酯及植物性纖維之聚酯原料，而生成單體中溶有聚酯的溶解液；檢出部，係檢出溶解液的溫度；及控制部，係控制包含聚酯原料及單體供給至溶解部後的時間之處理時間與溶解液的溫度之溶解條件，使以下式(1)所示之指標R&lt;sub&gt;0&lt;/sub&gt;成為2以上且未達4.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分離系統</p>  
        <p type="p">10:原料儲存部</p>  
        <p type="p">10a:導入管</p>  
        <p type="p">10b:調整部</p>  
        <p type="p">12:溶解部</p>  
        <p type="p">12a:導入管</p>  
        <p type="p">12a1:調整部</p>  
        <p type="p">12A:加熱部</p>  
        <p type="p">13:固液分離部</p>  
        <p type="p">14:反應溶劑儲存部</p>  
        <p type="p">14a:導入管</p>  
        <p type="p">14b:加熱升壓部</p>  
        <p type="p">16:反應部</p>  
        <p type="p">16a:導出管</p>  
        <p type="p">16A:第1反應部</p>  
        <p type="p">16A1,16A2:表面</p>  
        <p type="p">16b:排出管</p>  
        <p type="p">16B:第2反應部</p>  
        <p type="p">16C,16D:導入口</p>  
        <p type="p">16E:導出口</p>  
        <p type="p">16F:排出口</p>  
        <p type="p">18:分離部</p>  
        <p type="p">18A:第1分離部</p>  
        <p type="p">18Aa,18Ab:導出管</p>  
        <p type="p">18B:第2分離部</p>  
        <p type="p">18Ba,18Bb:導出管</p>  
        <p type="p">18C:第3分離部</p>  
        <p type="p">18Ca,18Cb,18Cc:導出管</p>  
        <p type="p">18Cd:導入管</p>  
        <p type="p">18Ce:調整部</p>  
        <p type="p">20:儲存部</p>  
        <p type="p">20a,20b:排出管</p>  
        <p type="p">20c,20c1,20c2,20c3:導入管</p>  
        <p type="p">22:排出部</p>  
        <p type="p">22a:第1排出部</p>  
        <p type="p">22b1,22b2:第2排出部</p>  
        <p type="p">24:導出部</p>  
        <p type="p">26:去除部</p>  
        <p type="p">26a:過濾機</p>  
        <p type="p">26a1:排出管</p>  
        <p type="p">26b:吸附塔</p>  
        <p type="p">30:控制部</p>  
        <p type="p">50:異物回收部</p>  
        <p type="p">60:檢出部</p>  
        <p type="p">D,E:單體</p>  
        <p type="p">M:反應溶劑</p>  
        <p type="p">M1:第1溶劑</p>  
        <p type="p">M2:第2溶劑</p>  
        <p type="p">P:聚酯溶液</p>  
        <p type="p">P1:第1解聚合聚酯</p>  
        <p type="p">P2:第2解聚合聚酯</p>  
        <p type="p">Pd:溶解液</p>  
        <p type="p">Pm:聚酯原料</p>  
        <p type="p">R:雜質</p>  
        <p type="p">R1:第1雜質</p>  
        <p type="p">R2:第2雜質</p>  
        <p type="p">R3:第3雜質</p>  
        <p type="p">Y1,Y2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1619" publication-number="202628178"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628178.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理腔室的多輻式屏蔽</chinese-title>  
        <english-title>MULTI-SPOKE SHIELD FOR A PROCESS CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬斯瓦米　卡提克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMASWAMY, KARTIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席門瑞　費南多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILVEIRA, FERNANDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿札德　Ａ　Ｎ　Ｍ瓦塞科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZAD, A N M WASEKUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雨暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣志敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, ZHIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本說明書提供了用於處理腔室的設備的實施例。在某些實施例中，用於處理腔室的設備包括其內設置有一或多個環形氣室的環形主體，且其上表面配置為可以與處理腔室的蓋子連接；從該環形主體徑向向內延伸的複數個輻條，朝向環形主體的中央軸；以及位於每個複數個輻條的不同徑向位置上的複數個氣體出口，其中這些複數個氣體出口與一或多個環形氣室流體連通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of apparatus for use in a process chamber are provided herein. In some embodiments, an apparatus for use in a process chamber includes an annular body having one or more annular plenums disposed therein and an upper surface configured to be coupled to a lid of the process chamber; a plurality of spokes extending radially inward from the annular body toward a central axis of the annular body; and a plurality of gas outlets disposed along different radial locations of each spoke of the plurality of spokes, wherein the plurality of gas outlets are fluidly coupled to the one or more annular plenums.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">101:遠端電漿設備</p>  
        <p type="p">102:腔室主體</p>  
        <p type="p">104:內部空間</p>  
        <p type="p">106:蓋子</p>  
        <p type="p">108:噴嘴</p>  
        <p type="p">110:RF源</p>  
        <p type="p">112:匹配網路</p>  
        <p type="p">114:功率分配器</p>  
        <p type="p">116:導電線圈</p>  
        <p type="p">118:第一導電線圈</p>  
        <p type="p">120:第二導電線圈</p>  
        <p type="p">122:氣源</p>  
        <p type="p">124:RF源</p>  
        <p type="p">126:多輻式屏蔽</p>  
        <p type="p">128:基板支撐</p>  
        <p type="p">132:真空源</p>  
        <p type="p">138:基板</p>  
        <p type="p">140:環形主體</p>  
        <p type="p">142:一或多個環形氣室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1620" publication-number="202625924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腳穿戴物、腳穿戴物的販售方法及腳穿戴物的販售系統</chinese-title>  
        <english-title>FOOTWEAR, SELLING METHOD FOR FOOTWEAR, AND SELLING SYSTEM FOR FOOTWEAR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">A43B13/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＢＭＺ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BMZ. INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, TAMOTSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋大悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, DAIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於，提供能夠在使左右的腳穿戴物本體的外觀不致有太大的差異的情況下對腳長差進行高度補償之腳穿戴物、腳穿戴物的販售方法及腳穿戴物的販售系統。 &lt;br/&gt;腳穿戴物係具備左右的腳穿戴物本體31、41；一方之腳穿戴物本體31係使用基準的楦頭製造，該基準的楦頭具有基準的高度，該一方之腳穿戴物本體31具備對應前述基準的高度之基準的深度D1；另一方之腳穿戴物本體41係使用預定的楦頭製造，該預定的楦頭具有比前述基準的高度還高之預定的高度，該另一方之腳穿戴物本體41係具備對應前述預定的高度之預定的深度D2；在前述另一方之腳穿戴物本體41，以填補前述預定的深度D2與前述基準的深度D1之差分的方式配置有鞋內底51。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a footwear, selling method for footwear, and selling system for footwear that is capable of compensating for a leg length discrepancy without causing a significant difference in appearance between left and right footwear bodies. &lt;br/&gt;The footwear includes left and right footwear bodies 31 and 41; one footwear body 31 is manufactured using a reference last having a reference height, and includes a reference depth D1 corresponding to the reference height; the other footwear body 41 is manufactured using a predetermined last having a predetermined height higher than the reference height, and includes a predetermined depth D2 corresponding to the predetermined height; an insole 51 is arranged in the other footwear body 41 so as to compensate for a difference between the predetermined depth D2 and the reference depth D1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:鞋跟、鞋底</p>  
        <p type="p">31:腳穿戴物本體(一方之腳穿戴物本體)</p>  
        <p type="p">41:腳穿戴物本體(另一方之腳穿戴物本體)</p>  
        <p type="p">51:鞋內底</p>  
        <p type="p">D1:基準的深度、深度</p>  
        <p type="p">D2:預定的深度、深度</p>  
        <p type="p">D3:差分的深度、深度</p>  
        <p type="p">H1:基準的高度、高度</p>  
        <p type="p">H2:預定的高度、高度</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1621" publication-number="202628666"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628666.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接觸孔的形成方法、半導體元件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260330B">H10D84/40</main-classification>  
        <further-classification edition="202601120260330B">H10W20/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松﨑陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAKI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川麻由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MAYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原紘司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種接觸孔的形成方法，其特徵在於，具有：於配置有電晶體的閘極電極的基板上，以上述閘極電極的上部的賦予量少於其以外的部分的方式，賦予第一前驅體，形成具有平坦上表面的第一膜的工程；及在形成上述接觸孔時對上述第一膜進行圖案化的工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:半導體基板</p>  
        <p type="p">302:源極汲極區域</p>  
        <p type="p">303:閘極電極</p>  
        <p type="p">305:第一膜</p>  
        <p type="p">306:第一光阻膜</p>  
        <p type="p">307:第一光阻圖案</p>  
        <p type="p">308:第一開口</p>  
        <p type="p">309:接觸孔</p>  
        <p type="p">9:板件</p>  
        <p type="p">P1:面</p>  
        <p type="p">P2:面</p>  
        <p type="p">IM1:第一材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1622" publication-number="202627488"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627488.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接觸件中間製品</chinese-title>  
        <english-title>CONTACTOR INTERMEDIATE PRODUCTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G01R1/06</main-classification>  
        <further-classification edition="202001120260317B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那須美佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASU, MIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEKI, ISAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村本剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAMOTO, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種接觸件中間製品，其可以在接觸件中間製品的製造時，吸收由溫度變化所導致的基材之變形量，並回避由熱應力所可能產生的裂痕等之損傷。 &lt;br/&gt;　　[解決手段]為了解決該課題，根據本發明的接觸件中間製品是特徵在於，具備：接觸件；以及板狀基材的突片，具有與該接觸件的一方的端部連結的連結部；其中，突片是具有緩衝部，其係使板狀基材的一部分相互地分離，並吸收該板狀基材的變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:接觸件中間製品</p>  
        <p type="p">3:緩衝部</p>  
        <p type="p">4:連結部</p>  
        <p type="p">5:連結部</p>  
        <p type="p">11:接觸件</p>  
        <p type="p">12:突片</p>  
        <p type="p">13:固定突片</p>  
        <p type="p">31:第一狹縫部</p>  
        <p type="p">32:第二狹縫部</p>  
        <p type="p">121:第一端部</p>  
        <p type="p">122:第二端部</p>  
        <p type="p">123:第三端部</p>  
        <p type="p">124:第四端部</p>  
        <p type="p">321:第一分歧部分</p>  
        <p type="p">322:第二分歧部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1623" publication-number="202626062"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626062.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>菸鹼醯胺腺嘌呤二核苷酸產生活化劑、Sirt-1活化劑、線粒體活化劑、GLS-1活性抑制劑、醫藥品、化妝品及食品或飲料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">A61K31/706</main-classification>  
        <further-classification edition="200601120260202B">A61K36/07</further-classification>  
        <further-classification edition="200601120260202B">A61P43/00</further-classification>  
        <further-classification edition="201701120260202B">A61K8/9728</further-classification>  
        <further-classification edition="200601120260202B">A61K8/60</further-classification>  
        <further-classification edition="200601120260202B">A61Q19/08</further-classification>  
        <further-classification edition="201601120260202B">A23L33/13</further-classification>  
        <further-classification edition="201601120260202B">A23L33/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本醫療製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN PHARMACEUTICAL MEDICINE CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早川久美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAKAWA, KUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明包含下述（i）或（ii）： &lt;br/&gt;（i） 金頂側耳或其處理物 &lt;br/&gt;（ii） 菸鹼醯胺單核苷酸及5-脫氮黃素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1624" publication-number="202626931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>延伸膜</chinese-title>  
        <english-title>STRETCHED FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">C08L23/08</main-classification>  
        <further-classification edition="200601120260318B">C08J5/22</further-classification>  
        <further-classification edition="200601120260318B">C07F17/02</further-classification>  
        <further-classification edition="200601120260318B">B29C55/04</further-classification>  
        <further-classification edition="200601120260318B">B32B27/08</further-classification>  
        <further-classification edition="200601120260318B">B32B27/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本他喜龍希愛股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C.I.TAKIRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹原一芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAHARA, KAZUFUSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森惠一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大島滉主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSHIMA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種延伸膜，其與密封膜（2）積層而形成積層體（1），延伸膜至少具有以密度為0.950g／cm&lt;sup&gt;3&lt;/sup&gt;以上的高密度聚乙烯為主要成分的基材層（3），延伸方向上的抗拉模量為2000MPa以上且小於5000MPa，延伸方向上的在130℃下加熱了10分鐘時的熱收縮率小於5％。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the present invention is to provides a stretched film is laminated with a sealant film (2) to form a laminate (1), the stretched film having at least a base layer (3) composed primarily of high-density polyethylene having a density of 0.950 g/cm&lt;sup&gt;3&lt;/sup&gt; or more, a tensile modulus in the stretching direction of 2000 MPa or more and less than 5000 MPa, and a thermal shrinkage rate of less than 5% when heated in the stretching direction at 130°C for 10 minutes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:包裝用積層體</p>  
        <p type="p">2:密封膜</p>  
        <p type="p">3:基材層(延伸膜)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1625" publication-number="202628278"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628278.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有電纜連接器模組的電子組件</chinese-title>  
        <english-title>ELECTRONIC ASSEMBLY HAVING A CABLE CONNECTOR MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H01R13/652</main-classification>  
        <further-classification edition="201101120260318B">H01R12/75</further-classification>  
        <further-classification edition="200601120260318B">H01R13/514</further-classification>  
        <further-classification edition="201101120260318B">H01R13/6591</further-classification>  
        <further-classification edition="201101120260318B">H01R13/6592</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰科電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧巴　布雷克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNBAR, BLAKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史陶弗　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAUFFER, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩根　查德　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORGAN, CHAD WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金繼旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, JIWANG (ARTHUR)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪克　麥可　尤金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRK, MICHAEL EUGENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍爾紐　桂格　沃倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORNUNG, CRAIG WARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉赫曼　茱莉亞　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LACHMAN, JULIA ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽波特　馬修　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYPOLT, MATTHEW JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史瓦茲包　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWARTZBAUGH, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電纜連接器模組(110)，其包括一外殼(300)，該外殼包括接點袋(320)和收納於該等對應接點袋中的接點模組(400)。每個接點模組都包括一接點固定架(410)，用於固定成對的接點(430)。該電纜連接器模組包括電纜(102)，其具有端接至該等接點模組的電纜端。該電纜連接器模組包括與該等電纜和該等對應接點模組相關聯的接地籠(500)。每個接地籠在該對應電纜的該電纜端和該等接點模組周圍提供環狀屏蔽。該接地籠已電連接至該對應電纜的該電纜屏蔽(106)，並且以機械方式耦接至該外殼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cable connector module (110) includes a housing (300) includes contact pockets (320) and contact modules (400) received in the corresponding contact pockets. Each contact module includes a contact holder (410) holding contacts (430) in pairs. The cable connector module includes cables (102) having cable ends terminated to the contact modules. The cable connector module includes ground cages (500) associated with the cables and the corresponding contact modules. Each ground cage provides circumferential shielding around the cable end of the corresponding cable and around the contact modules. The ground cage is electrically connected to the cable shield (106) of the corresponding cable and is mechanically coupled to the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:電纜</p>  
        <p type="p">104:訊號導體</p>  
        <p type="p">106:電纜屏蔽</p>  
        <p type="p">108:電纜護套</p>  
        <p type="p">109:排流線</p>  
        <p type="p">110:電纜連接器模組</p>  
        <p type="p">120:連接器外殼；外殼</p>  
        <p type="p">122:外殼腔體；腔體</p>  
        <p type="p">124:頂部</p>  
        <p type="p">126:底部</p>  
        <p type="p">128:緊固件</p>  
        <p type="p">130:正面</p>  
        <p type="p">132:背面</p>  
        <p type="p">134:側邊</p>  
        <p type="p">136:閂鎖部件</p>  
        <p type="p">138:護罩</p>  
        <p type="p">140:電路卡</p>  
        <p type="p">142:基板</p>  
        <p type="p">143:上表面</p>  
        <p type="p">144:接點墊</p>  
        <p type="p">145:下表面</p>  
        <p type="p">148:接地平面</p>  
        <p type="p">150:電纜組件</p>  
        <p type="p">160:電纜支撐結構</p>  
        <p type="p">162:電纜固定架</p>  
        <p type="p">164:電纜通道</p>  
        <p type="p">166:外殼體</p>  
        <p type="p">168:開口</p>  
        <p type="p">300:外殼</p>  
        <p type="p">320:接點袋</p>  
        <p type="p">400:接點模組</p>  
        <p type="p">410:接點固定架</p>  
        <p type="p">430:接點</p>  
        <p type="p">500:接地籠</p>  
        <p type="p">510:套圈</p>  
        <p type="p">550:蓋子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1626" publication-number="202628991"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628991.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣移動裝置</chinese-title>  
        <english-title>AIR MOVING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10W40/43</main-classification>  
        <further-classification edition="200601120260318B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商知微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XMEMS LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　馬丁喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, MARTIN GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅烱成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHIUNG C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任頡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, JYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　正耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JENGYAW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種空氣移動裝置，其包括膜結構、第一致動件與第二致動件。膜結構包括瓣片對，其中瓣片對包括彼此相對的第一瓣片與第二瓣片。第一致動件設置在第一瓣片上，第二致動件設置在第二瓣片上。第一致動件包括第一電極與第二電極，第二致動件包括第三電極與第四電極。第一電極接收第一解調訊號，且第三電極接收第二解調訊號，使得瓣片對執行差模運動。第二電極與第四電極接收調製訊號，使得瓣片對執行共模運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An air moving device includes a film structure, a first actuator and a second actuator. The film structure includes a flap pair, wherein the flap pair includes a first flap and a second flap opposite to each other. The first actuator is disposed on the first flap, and the second actuator is disposed on the second flap. The first actuator includes a first electrode and a second electrode, and the second actuator includes a third electrode and a fourth electrode. The first electrode receives a first demodulation signal and the third electrode receives a second demodulation signal, such that the flap pair performs a differential-mode movement. The second electrode and the fourth electrode receive a modulation signal, such that the flap pair performs a common-mode movement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:空氣移動裝置</p>  
        <p type="p">101,102:瓣片</p>  
        <p type="p">101A,102A:致動件</p>  
        <p type="p">112:開口</p>  
        <p type="p">12:膜結構</p>  
        <p type="p">122:瓣片對</p>  
        <p type="p">SM:調製訊號</p>  
        <p type="p">SV1,SV2:解調訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1627" publication-number="202626348"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626348.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體之製造方法、以及阻氣材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">B32B9/00</main-classification>  
        <further-classification edition="200601120260317B">B32B37/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人山形大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>硯里善幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZURI, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫鶴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, HE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋侶洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, LUYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種積層體之製造方法，係製造含有基材、樹脂層、及阻障層之積層體，且包含下列步驟：樹脂層形成步驟，係在基材或阻障層上塗佈含有樹脂之溶液而形成樹脂塗佈物，使樹脂塗佈物乾燥或硬化而形成樹脂層；以及阻障層形成步驟，係在基材或樹脂層上塗佈含有聚矽氮烷化合物之溶液而形成聚矽氮烷塗佈物，在氮氛圍下或在含有氧之氮氛圍下，對聚矽氮烷塗佈物照射波長200nm以下之能量線來使聚矽氮烷化合物硬化，而形成含有聚矽氮烷硬化物之阻障層；阻障層形成步驟中之能量線的照射強度為280mW/cm&lt;sup&gt;2&lt;/sup&gt;以上至450mW/cm&lt;sup&gt;2&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1628" publication-number="202627484"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627484.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體晶片測試的晶片插座組合件及包括其的半導體晶片測試設備</chinese-title>  
        <english-title>CHIP SOCKET ASSEMBLY FOR SEMICONDUCTOR CHIP TESTING AND SEMICONDUCTOR CHIP TESTING APPARATUS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G01R1/04</main-classification>  
        <further-classification edition="200601120260323B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＴＳＥ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金寶炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BO HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺海國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HAE GUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉基南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIL, GI NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於半導體晶片測試的晶片插座組合件及包括其的半導體晶片測試設備。該晶片插座組合件包括：具有晶片導引孔之晶片導引構件，通過晶片導引孔插入並導引在其一個表面上形成有複數個凸塊和複數個焊墊的晶片；具有至少一個凸塊導引孔的凸塊導引構件，經組態以導引凸塊中的至少一些的位置及至少一個焊墊暴露孔，經組態以暴露焊墊中的至少一些；具有開口的中間緊固構件，經組態以暴露晶片的形成有凸塊和焊墊的一個表面的至少一部分；及在其一個表面上設有複數個探針的晶片插座基板，複數個探針經組態以接觸焊墊中的至少一些。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a chip socket assembly for semiconductor chip testing and a semiconductor chip testing apparatus including the same. The chip socket assembly includes a chip guide member having a chip guide hole through which a chip having a plurality of bumps and a plurality of pads formed on one surface thereof is inserted and guided, a bump guide member having at least one bump guide hole configured to guide the positions of at least some of the bumps and at least one pad exposure hole configured to expose at least some of the pads, an intermediate fastening member having an opening configured to expose at least a part of the one surface of the chip on which the bumps and the pads are formed, and a chip socket substrate provided on one surface thereof with a plurality of probes configured to contact at least some of the pads.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片導引構件</p>  
        <p type="p">105:導引銷</p>  
        <p type="p">110:晶片導引孔</p>  
        <p type="p">130:緊固孔</p>  
        <p type="p">140:第一對準導引孔</p>  
        <p type="p">200:凸塊導引構件</p>  
        <p type="p">205:導引通孔</p>  
        <p type="p">210:凸塊導引孔</p>  
        <p type="p">210a:第一凸塊導引孔</p>  
        <p type="p">210b:第二凸塊導引孔</p>  
        <p type="p">220:焊墊暴露孔</p>  
        <p type="p">230、235、445:通孔</p>  
        <p type="p">240:第二對準導引孔</p>  
        <p type="p">300:中間緊固構件</p>  
        <p type="p">305:導引孔</p>  
        <p type="p">310:開口</p>  
        <p type="p">330:緊固元件</p>  
        <p type="p">335:凹槽</p>  
        <p type="p">340:第三對準導引孔</p>  
        <p type="p">345:插入孔</p>  
        <p type="p">400:晶片插座基板</p>  
        <p type="p">440:對準銷</p>  
        <p type="p">450:探針</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1629" publication-number="202628850"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628850.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、基板處理裝置、程式及電腦記錄媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P54/40</main-classification>  
        <further-classification edition="202601120260401B">H10P72/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長田創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSADA, SO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔光恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, KWANGEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関泰士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, TAIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福永信貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUNAGA, NOBUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井文也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理方法，於基板處理裝置中，將由第1基板與第2基板接合成的重合基板予以處理；該基板處理裝置，具有：基板固持部，將該重合基板固持；馬達，使該基板固持部旋轉；接觸構件；固持構件，將該接觸構件固持；水平移動機構，可使該固持構件相對於該基板固持部沿水平方向移動；以及壓力感測器，可測定對於該固持構件的至少水平方向之壓力；該基板處理方法，具有如下程序：藉由使該固持構件移動，而使該接觸構件，和受該基板固持部所固持的該重合基板之接觸對象部接觸；以及在該接觸構件接觸到該接觸對象部的狀態下，使該基板固持部旋轉；在使該接觸構件和該接觸對象部接觸的程序中，具有如下程序：在以該壓力感測器測定出之壓力值超過閾值的情況，判定為該接觸構件接觸到該接觸對象部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">MT2:邊緣修整</p>  
        <p type="p">St201~St203:邊緣修整MT2所包含之步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1630" publication-number="202628179"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628179.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶有基板旋轉的均勻像素化微波電漿源</chinese-title>  
        <english-title>UNIFORM PIXELATED MICROWAVE PLASMA SOURCE WITH SUBSTRATE ‎ROTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布考恩　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUBUCHON, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔　則敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUNG, TZA-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處描述的實施例涉及一種設備，該設備包括介電板及與該介電板耦合的複數個介電共振器。在一個實施例中，這些複數個介電共振器在介電板上以不對稱的圖案分佈，以便在該基板旋轉時為基板下方提供均勻的電漿通量密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a dielectric plate, and a plurality of dielectric resonators coupled to the dielectric plate. In an embodiment, the plurality of dielectric resonators are distributed across the dielectric plate in a pattern that is asymmetric in order to provide a plasma uniform flux density to an underlying substrate as the substrate is rotated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微波電漿源</p>  
        <p type="p">105:介電圓盤</p>  
        <p type="p">106:孔</p>  
        <p type="p">108:銷</p>  
        <p type="p">110:介電共振器</p>  
        <p type="p">115:微波功率放大器</p>  
        <p type="p">120:介電板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1631" publication-number="202628816"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628816.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及電漿處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260320B">H10P50/00</main-classification>  
        <further-classification edition="200601120260320B">C23F4/04</further-classification>  
        <further-classification edition="200601120260320B">H05H1/46</further-classification>  
        <further-classification edition="200601120260320B">H01J37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORI, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片平豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAHIRA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊倉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAKURA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之蝕刻方法包括： &lt;br/&gt;(a)於包含基板支持部之腔室內，在上述基板支持部上準備基板之步驟，其中上述基板具備包含選自由矽及金屬所組成之群中之至少1種之蝕刻對象膜、及上述蝕刻對象膜上之遮罩，上述遮罩具備使上述蝕刻對象膜露出之至少1個開口； &lt;br/&gt;(b)向上述腔室內供給處理氣體之步驟，其中上述處理氣體包含選自由F&lt;sub&gt;2&lt;/sub&gt;氣體、具有C-O鍵之含氟氣體、具有C=O鍵之含氟氣體、具有C=C鍵之含氟氣體、具有N-O鍵之含氟氣體、以及具有氟原子及除氟以外之鹵素原子之含氟氣體所組成之群中之至少1種第1氣體、以及以C&lt;sub&gt;m&lt;/sub&gt;H&lt;sub&gt;n&lt;/sub&gt;(此處，m表示0以上之整數，n表示2以上之整數)表示之第2氣體；及 &lt;br/&gt;(c)利用由上述處理氣體產生之電漿，經由上述開口對上述蝕刻對象膜進行蝕刻之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1632" publication-number="202628075"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628075.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於將聲音或聲場的高階保真立體音響（ＨＯＡ）表示予以解碼的方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR DECODING A HIGHER ORDER AMBISONICS (HOA) REPRESENTATION OF A SOUND OR SOUNDFIELD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260320B">G10L19/008</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商杜比國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY INTERNATIONAL AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯格　亞歷山德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRUEGER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科登　斯凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORDON, SVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">當壓縮一HOA資料框表示時，於進行知覺編碼(16)前，應用一增益控制(15、151)用於各聲道信號，依一差分方式傳送增益值作為邊資訊。然而，用以開始此類串流壓縮HOA資料框表示之解碼，需要絕對增益值，其應以最小位元數編碼。用以判定此類最低整數位元數，將HOA資料框表示(&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;))於空間域中呈現至位於一單位球面上之虛擬揚聲器信號，隨後進行HOA資料框表示(&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;))之正規化，接著將最低整數位元數設成&lt;img align="absmiddle" height="40px" width="312px" file="d10052.TIF" alt="其他非圖式ed10052.png" img-content="character" orientation="portrait" inline="no" giffile="ed10052.png"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">When compressing an HOA data frame representation, a gain control (15, 151) is applied for each channel signal before it is perceptually encoded (16). The gain values are transferred in a differential manner as side information. However, for starting decoding of such streamed compressed HOA data frame representation absolute gain values are required, which should be coded with a minimum number of bits. For determining such lowest integer number (β&lt;sub&gt;e&lt;/sub&gt;) of bits the HOA data frame representation (&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;)) is rendered in spatial domain to virtual loudspeaker signals lying on a unit sphere, followed by normalisation of the HOA data frame representation (&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;)). Then the lowest integer number of bits is set to&lt;img align="absmiddle" height="39px" width="307px" file="d10053.TIF" alt="其他非圖式ed10053.png" img-content="character" orientation="portrait" inline="no" giffile="ed10053.png"/&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:方向及向量估計處理步驟</p>  
        <p type="p">12:HOA分解處理步驟</p>  
        <p type="p">13:周圍分量修改處理步驟</p>  
        <p type="p">14:聲道指定步驟</p>  
        <p type="p">15,151:增益控制處理步驟</p>  
        <p type="p">16:知覺編碼器步驟</p>  
        <p type="p">17:邊資訊信號源編碼器步驟</p>  
        <p type="p">18:多工器</p>  
        <p type="p">
        &lt;img align="absmiddle" height="28px" width="86px" file="d10054.TIF" alt="其他非圖式ed10054.png" img-content="character" orientation="portrait" inline="no" giffile="ed10054.png"&gt;
        &lt;/img&gt;:輸出訊框</p>  
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;C&lt;/i&gt;
        &lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;):初始訊框</p>  
        <p type="p">C&lt;sub&gt;AMB&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):周圍HOA分量之訊框</p>  
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;C&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;M,A&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):修改周圍HOA分量</p>  
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;C&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;P,M,A&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):暫預測修改周圍HOA分量</p>  
        <p type="p">
        &lt;i&gt;e&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,&lt;i&gt;e&lt;/i&gt;&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):指數</p>  
        <p type="p">β&lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,β&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):異常旗標</p>  
        <p type="p">
        &lt;i&gt;M&lt;/i&gt;
        &lt;sub&gt;DIR&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;),&lt;i&gt;M&lt;/i&gt;&lt;sub&gt;VEC&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;),&lt;i&gt;M&lt;/i&gt;&lt;sub&gt;DIR&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1),&lt;i&gt;M&lt;/i&gt;&lt;sub&gt;VEC&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):元組集</p>  
        <p type="p">
        &lt;i&gt;v&lt;/i&gt;
        &lt;sub&gt;A,T&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):目標指定向量</p>  
        <p type="p">
        &lt;i&gt;v&lt;/i&gt;
        &lt;sub&gt;A&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):最終指定向量</p>  
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;X&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;PS&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):所有主要聲音信號框</p>  
        <p type="p">
        &lt;i&gt;y&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,&lt;i&gt;y&lt;/i&gt;&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):信號框</p>  
        <p type="p">
        &lt;i&gt;y&lt;/i&gt;
        &lt;sub&gt;P,1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1),...,&lt;i&gt;y&lt;/i&gt;&lt;sub&gt;P,&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1)):預測信號框</p>  
        <p type="p">
        &lt;i&gt;z&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,&lt;i&gt;z&lt;/i&gt;&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):信號</p>  
        <p type="p">
        &lt;img align="absmiddle" height="25px" width="205px" file="d10055.TIF" alt="其他非圖式ed10055.png" img-content="character" orientation="portrait" inline="no" giffile="ed10055.png"&gt;
        &lt;/img&gt;:編碼信號</p>  
        <p type="p">
        &lt;img align="absmiddle" height="30px" width="83px" file="d10056.TIF" alt="其他非圖式ed10056.png" img-content="character" orientation="portrait" inline="no" giffile="ed10056.png"&gt;
        &lt;/img&gt;:編碼邊資訊</p>  
        <p type="p">ζ(&lt;i&gt;k&lt;/i&gt;-1):預測參數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1633" publication-number="202626548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133679</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混凝土組成物、硬化體、及硬化體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C04B22/08</main-classification>  
        <further-classification edition="200601120260319B">C04B22/06</further-classification>  
        <further-classification edition="200601120260319B">C04B22/10</further-classification>  
        <further-classification edition="200601120260319B">C04B22/14</further-classification>  
        <further-classification edition="200601120260319B">C04B28/02</further-classification>  
        <further-classification edition="200601320260319B">C04B103/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中舘悠登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKADATE, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相澤一裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIZAWA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋口隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGUCHI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種混凝土組成物，含有：結合材、水硬性材料用硬化促進材、及水，其中，結合材摻合量為300kg/m&lt;sup&gt;3&lt;/sup&gt;以上，水結合材比為55%以下，該水硬性材料用硬化促進材添加量為1~50kg/m&lt;sup&gt;3&lt;/sup&gt;，該水硬性材料用硬化促進材含有甲酸鈣20.0~80.0質量%、無機鈣化合物15.0~70.0質量%、及排除硫酸鈣之無機硫酸鹽0.5~30.0質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1634" publication-number="202627622"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627622.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傳遞隱形眼鏡的方法</chinese-title>  
        <english-title>A METHOD OF TRANSFERRING A CONTACT LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G02C7/02</main-classification>  
        <further-classification edition="200601120260401B">A45C11/04</further-classification>  
        <further-classification edition="200601120260401B">B65D75/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢頓　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEATON, STEPHEN R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉特　藍斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRATT, LANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛洛佛　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOVER, JAMES D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特蘭　東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勞福德　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRAWFORD, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示用於將隱形眼鏡從經組態以支撐該隱形眼鏡之凹側之鏡片轉移端轉移至經組態以支撐該隱形眼鏡之凸側之鏡片轉移端之系統、方法、及工具，例如使得該隱形眼鏡之凸側在釋放時可經暴露。該隱形眼鏡之凹面朝下之定向可允許檢查該隱形眼鏡、處理該隱形眼鏡、及/或使配戴者更容易從容器中取出該隱形眼鏡（例如，以放置於眼睛上）。將隱形眼鏡操縱至凹面朝下之定向可能顯著增加包裝該隱形眼鏡之該程序的複雜性。特別是，隱形眼鏡可能需要在鏡片保持端之間進行精確交接（例如，用於檢查、處理、包裝）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, methods, and instrumentalities are disclosed for transferring a contact lens from a lens transfer tip configured to support a concave side of the contact lens to a lens transfer tip configured to support a convex side of the contact lens, for example such that a convex side of the contact lens may be exposed when released. A concave-down orientation of the contact lens may allow for inspection of the contact lens, treatment of the contact lens, and/or a wearer to remove the contact lens from a container more easily (e.g., for placement onto the eye). Manipulation of a contact lens to a concave-down orientation may add significant complexity to the process of packaging the contact lens. In particular, contact lenses may require a precise handoff between lens holding tips (e.g., for inspection, treatment, packaging).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:容器</p>  
        <p type="p">102:隱形眼鏡</p>  
        <p type="p">104:凹陷區域</p>  
        <p type="p">106:儲存溶液</p>  
        <p type="p">108:槽；碗</p>  
        <p type="p">110:蓋子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1635" publication-number="202627504"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627504.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>試驗方法、試驗系統及測試器系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G01R31/28</main-classification>  
        <further-classification edition="200601120260330B">G01R31/3183</further-classification>  
        <further-classification edition="202501120260330B">G06F11/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山克昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, KATSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小森大斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMORI, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制依據基於測試結果的動態測試模式來進行測試之測試器系統的處理負荷之技術。 &lt;br/&gt;  一種試驗方法，係使測試器對測試對象元件進行測試之測試器系統的試驗方法；測試器系統係進行下述動作：收集測試器依據測試模式所進行之測試的測試結果；將收集到的測試結果發送至分析系統；將分析系統根據測試結果所生成或選擇後的測試模式作為下一次進行的測試模式來接收；以及依據下一次進行的測試模式使測試器進行測試。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:測試器系統</p>  
        <p type="p">10:測試器</p>  
        <p type="p">12:輔助運算裝置</p>  
        <p type="p">14:分析系統</p>  
        <p type="p">20:測試對象元件</p>  
        <p type="p">22:接收部</p>  
        <p type="p">24:測試執行部</p>  
        <p type="p">26:收集部</p>  
        <p type="p">28:資料處理部</p>  
        <p type="p">30:發送部</p>  
        <p type="p">32:分析部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1636" publication-number="202628460"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628460.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於無線網路之動態傳輸控制</chinese-title>  
        <english-title>DYNAMIC TRANSMISSION CONTROL FOR A WIRELESS NETWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">H04W72/0446</main-classification>  
        <further-classification edition="200901120260323B">H04W84/06</further-classification>  
        <further-classification edition="202301120260323B">H04W72/1263</further-classification>  
        <further-classification edition="202301120260323B">H04W72/512</further-classification>  
        <further-classification edition="200901120260323B">H04W84/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾羅維羅門特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEROVIRONMENT, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉波斯基　約翰Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRABOWSKY, JOHN F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托古馬魯　菲利普Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUMARU, PHILLIP T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克尼斯肯　羅柏特傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNISKERN, ROBERT JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古倫斯　尼可拉斯Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURRENS, NICHOLAS S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴芬尼　艾倫萊斯特二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVINE JR., ALLAN LESTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個可能的實施例中，提供一種具有動態傳輸控制之無線網路，包括多個節點。這些節點包括一仲裁器和多個客戶端節點。仲裁器是配置以回應於來自該等客戶端節點之頻寬請求而控制該等客戶端節點之運作，其係透過定義通訊運作週期及以每週期為基礎分配一頻寬給該等客戶端節點之每者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one possible embodiment, a wireless network with dynamic transmission control is provided that includes a multiple of nodes. The nodes include an arbiter and multiple client nodes. The arbiter is configured to control an operation of the client nodes by defining communications operation cycles and allocating a bandwidth to each of the client nodes on a cycle by cycle basis in response to requests for bandwidth from the client nodes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:DDL環境</p>  
        <p type="p">15:DDL對話</p>  
        <p type="p">25:DDL對話</p>  
        <p type="p">100:DDL仲裁節點</p>  
        <p type="p">200:DDL節點</p>  
        <p type="p">205:手持控制器</p>  
        <p type="p">210:外部設備</p>  
        <p type="p">215:乙太網路連線</p>  
        <p type="p">300:DDL節點</p>  
        <p type="p">400:DDL節點</p>  
        <p type="p">405:手持控制器</p>  
        <p type="p">410:外部設備</p>  
        <p type="p">415:乙太網路連線</p>  
        <p type="p">500:DDL節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1637" publication-number="202628045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體顯示裝置及其控制方法</chinese-title>  
        <english-title>LED DISPLAY DEVICE AND METHOD FOR CONTROLLING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260317B">G09G3/32</main-classification>  
        <further-classification edition="202501120260317B">H10H29/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＸ半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LX SEMICON CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申允秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YOON SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金長洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JANG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鐘敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金知煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鎭鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明一實施例之一種發光二極體顯示裝置包含：多個LED子像素；N個通道群組，用於向該些LED子像素供應電流；以及M個掃描群組，用於執行掃描作業。特別地，M個掃描群組包含，例如，控制器，各控制器對應於一條預設掃描線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light emitting diode (LED) display device according to one embodiment of the present invention includes a plurality of LED sub-pixels, N channel groups configured to supply a current to the plurality of LED sub-pixels, and M scan groups configured to perform a scanning operation. Particularly, the M scan groups include, for example, controllers, each of which corresponds to one preset scan line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:第一通道</p>  
        <p type="p">302:第二通道</p>  
        <p type="p">303:第三通道</p>  
        <p type="p">304:第四通道</p>  
        <p type="p">305:第五通道</p>  
        <p type="p">306:第六通道</p>  
        <p type="p">307:第七通道</p>  
        <p type="p">308:第八通道</p>  
        <p type="p">309:第九通道</p>  
        <p type="p">311:第一脈衝寬度調變開關</p>  
        <p type="p">312:第二脈衝寬度調變開關</p>  
        <p type="p">313:第三脈衝寬度調變開關</p>  
        <p type="p">314:第四脈衝寬度調變開關</p>  
        <p type="p">315:第五脈衝寬度調變開關</p>  
        <p type="p">316:第六脈衝寬度調變開關</p>  
        <p type="p">317:第七脈衝寬度調變開關</p>  
        <p type="p">318:第八脈衝寬度調變開關</p>  
        <p type="p">319:第九脈衝寬度調變開關</p>  
        <p type="p">321:第一控制器</p>  
        <p type="p">322:第二控制器</p>  
        <p type="p">323:第三控制器</p>  
        <p type="p">324:第四控制器</p>  
        <p type="p">331:第一掃描開關</p>  
        <p type="p">332:第二掃描開關</p>  
        <p type="p">333:第三掃描開關</p>  
        <p type="p">334:第四掃描開關</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">C2:第二電容器</p>  
        <p type="p">CL:通道線</p>  
        <p type="p">CP_R:紅色子像素電容器</p>  
        <p type="p">CP_G:綠色子像素電容器</p>  
        <p type="p">CP_B:藍色子像素電容器</p>  
        <p type="p">SL:掃描線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1638" publication-number="202626958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配管構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L71/12</main-classification>  
        <further-classification edition="200601120260401B">C08L25/04</further-classification>  
        <further-classification edition="200601120260401B">F16L9/12</further-classification>  
        <further-classification edition="200601120260401B">F16L11/04</further-classification>  
        <further-classification edition="200601120260401B">F16L47/00</further-classification>  
        <further-classification edition="202601120260401B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭有機材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI YUKIZAI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田友晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, TOMOHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種配管構件，其能夠抑制從主要與常溫(未滿30℃)之液體接觸的配管構件之內表面溶出鈣及鋅而導致之液體的組成變化；本發明的配管構件(1)的特徵在於：接觸液體的內表面具備由含有聚苯醚系樹脂的樹脂組成物所構成之部分(3)，並且，在23℃的條件下，將溶出液與上述內表面接觸6天後之鈣及鋅的溶出量皆為5μg/m&lt;sup&gt;2&lt;/sup&gt;以下。聚苯醚系樹脂較佳為聚苯醚樹脂與苯乙烯樹脂的合金樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:配管構件</p>  
        <p type="p">3:第1管部</p>  
        <p type="p">5:外裝部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1639" publication-number="202626959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626959.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配管構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C08L71/12</main-classification>  
        <further-classification edition="200601120260331B">C08L53/02</further-classification>  
        <further-classification edition="200601120260331B">F16L9/12</further-classification>  
        <further-classification edition="200601120260331B">F16L9/128</further-classification>  
        <further-classification edition="200601120260331B">B32B1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭有機材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI YUKIZAI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田友晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, TOMOHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種耐衝擊性優異，且具有高強度之筒狀或管狀的配管構件；本發明的配管構件(1)的特徵在於：接觸液體的內表面具備由樹脂組成物所構成之部分(3)，該樹脂組成物含有聚苯醚系樹脂與苯乙烯系彈性體，苯乙烯系彈性體為選自苯乙烯-乙烯･丙烯-苯乙烯嵌段共聚物、苯乙烯-乙烯･丁烯-苯乙烯嵌段共聚物及苯乙烯･丁二烯･苯乙烯共聚物的至少1種，且相對於苯乙烯系彈性體，苯乙烯系彈性體中所含的苯乙烯單元量為25~65質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:配管構件</p>  
        <p type="p">3:第1管部</p>  
        <p type="p">5:外裝部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1640" publication-number="202626092"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626092.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＢＴＬＡ抗體及其用途</chinese-title>  
        <english-title>ANTI-BTLA ANTIBODIES AND USES OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商米羅比奧有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIROBIO LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴踏克　碧翠絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARTOK, BEATRIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐拉斯　艾瑞克　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOLLARS, ERIC S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述使用結合至BTLA之促效性抗體的用於自體免疫疾病或發炎性疾病之治療及預防、及抗BTLA抗體於製造用於治療或預防自體免疫疾病或發炎性疾病之藥劑的用途。本文亦描述藉由投予結合BTLA之促效性抗體來促效BTLA活性而不阻斷或阻止HVEM與BTLA之結合的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are treatments and preventions for autoimmune disease or inflammatory disease using agonistic antibodies that bind to BTLA, and uses of an anti-BTLA antibody in the manufacture of a medicament for the treatment or prevention of an autoimmune disease or inflammatory disease. Also described herein are methods of agonizing BTLA activity without blocking or preventing the binding of HVEM to BTLA by administering an agonistic antibody that binds to BTLA.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1641" publication-number="202626011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133764</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以形成用於可移除指甲增強體之多層指甲塗層的方法及組合物</chinese-title>  
        <english-title>METHODS AND COMPOSITIONS FOR FORMING MULTILAYER NAIL COATINGS FOR REMOVABLE NAIL ENHANCEMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/49</main-classification>  
        <further-classification edition="200601120260401B">A61K8/81</further-classification>  
        <further-classification edition="200601120260401B">A61K8/02</further-classification>  
        <further-classification edition="200601120260401B">A61Q3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商麗魁公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIQWD, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍克　克雷格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAWKER, CRAIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝茨　克里斯多福　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATES, CHRISTOPHER M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　阿拉尼斯　賈維爾　里德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE ALANIZ, JAVIER READ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝茨　摩根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATES, MORGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾巴尼斯　凱特琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBANESE, KAITLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述用於製備多層指甲塗層的方法及組合物，該等多層指甲塗層使形成於其上之指甲增強體能夠方便移除。該等指甲增強體在暴露於適合之移除刺激時變得可移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and compositions for preparing multilayer nail coatings that enable facile removal of nail enhancements formed thereon are described herein. The nail enhancements become removable upon exposure to a suitable removal stimulus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多層指甲塗層</p>  
        <p type="p">110:指甲底漆層</p>  
        <p type="p">120:指甲粉末層</p>  
        <p type="p">130:指甲增強體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1642" publication-number="202625961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>皮膚黏彈性指標的推測方法</chinese-title>  
        <english-title>METHODS FOR ESTIMATING SKIN VISCOELASTICITY INDICATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61B5/00</main-classification>  
        <further-classification edition="200601120260401B">G01N33/483</further-classification>  
        <further-classification edition="200601120260401B">G01N33/50</further-classification>  
        <further-classification edition="201701120260401B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芳珂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANCL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東崎健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHGASAKI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上麻佑子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMI, MAYUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種簡便地推測皮膚黏彈性指標之方法。作為本發明之解決手段係提供一種推測方法，其係從臉的拍攝影像所得之臉形狀參數作為指標，並推測皮膚黏彈性指標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a simple method for estimating skin viscoelasticity indicators. As a means for achieving this object, the present invention provides an estimation method that uses facial shape parameters obtained from facial images as indicators to estimate skin viscoelasticity indicators.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1643" publication-number="202628857"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628857.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓清洗裝置及晶圓清洗方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P70/00</main-classification>  
        <further-classification edition="202601120260324B">H10P72/00</further-classification>  
        <further-classification edition="202601120260324B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡韜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡海波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HAIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種晶圓清洗裝置及晶圓清洗方法。所述晶圓清洗方法應用於晶圓清洗裝置，所述晶圓清洗裝置包括對晶圓表面進行刷洗的清洗刷和用於承載晶圓並帶動晶圓旋轉的卡盤，所述晶圓清洗方法包括：旋轉晶圓，移動所述清洗刷對晶圓表面進行刷洗；在所述清洗刷移動的過程中，改變所述卡盤的轉速，使得所述清洗刷在晶圓中心時卡盤的轉速大於所述清洗刷在晶圓邊緣時卡盤的轉速。該方法增加了晶圓中心的離心力和線速度，使得晶圓中心的顆粒能夠更好地被清洗、去除，避免了大量顆粒聚集在晶圓中心，提升了晶圓的良品率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1644" publication-number="202628727"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628727.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133802</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆晶微發光二極體及匣配置</chinese-title>  
        <english-title>FLIP CHIP MICROLED AND CARTRIDGE ARRANGEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10H29/03</main-classification>  
        <further-classification edition="202501120260325B">H10H29/10</further-classification>  
        <further-classification edition="202601120260325B">H10H29/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商弗瑞爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUEREAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查吉　格拉姆瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAJI, GHOLAMREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於RGB墊之無干擾匣圖案化。本發明進一步係關於藉由圖案化或填充來在供體基板中配置微裝置，使得不存在與非接收墊之干擾且最大化該供體基板中之無干擾區。此使得能夠藉助較少步驟將微裝置轉印至接收器基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to non-interfering cartridge patterning for RGB pads. This disclosure is further related to arranging microdevices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of microdevices to a receiver substrate with fewer steps.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:陣列</p>  
        <p type="p">102:墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1645" publication-number="202627390"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627390.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通道大小隨機變化的振盪熱管</chinese-title>  
        <english-title>OSCILLATING HEAT PIPES WITH RANDOMLY VARYING CHANNEL SIZE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">F28F1/02</main-classification>  
        <further-classification edition="200601120260321B">F28F27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雷森公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYTHEON COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿拉亞里　阿巴斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAHYARI, ABBAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞茲達尼　米亞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAZDANI, MIAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾恩　傑森　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILNE, JASON G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">振盪熱管及其製造方法。該等振盪熱管包括冷凝器區域、蒸發器區域及配置於冷凝器區域與蒸發器區域之間的一組通道。該組通道界定用於工作流體之流體迴路的至少一部分。該組通道中之每一通道具有各別通道性質值，該各別通道性質值為相對於標稱通道性質值之百分比變化，且該組通道界定關於通道性質的一組非週期性通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Oscillating heat pipes and methods of making the same. The oscillating heat pipes include a condenser region, an evaporator region, and a set of channels arranged between the condenser region and the evaporator region. The set of channels define at least a portion of a fluid circuit for a working fluid. Each channel of the set of channels has a respective channel property value that is a percentage variation from a nominal channel property value and the set of channels defines an aperiodic set of channels with respect to the channel property.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:振盪熱管</p>  
        <p type="p">202:流體迴路</p>  
        <p type="p">204:傳熱區域</p>  
        <p type="p">206:絕熱區域</p>  
        <p type="p">208a-h:通道</p>  
        <p type="p">210a-d:彎管</p>  
        <p type="p">212a-h:通道直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1646" publication-number="202625954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗及／或烘乾機器等家用電器的消毒套件</chinese-title>  
        <english-title>DISINFECTING KIT FOR A DOMESTIC APPLIANCE SUCH AS A WASHING AND/OR DRYING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">A47L15/00</main-classification>  
        <further-classification edition="200601120260318B">D06F35/00</further-classification>  
        <further-classification edition="200601120260318B">A47L15/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商奈科斯特森斯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEXTSENSE S.R.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰斯蒂　喬瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TESTI, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特爾齊　曼弗雷迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERZI, MANFREDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡蒂埃　卡梅羅拉法埃萊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARTIERE, CARMELO RAFFAELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦萊斯　羅薩里奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALLES, ROSARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於洗滌及/或烘乾物體的機器（10）的消毒套件（75），其包括至少一發射單元（23），發射單元（23）包含一組三個主發射器（26A、26B、26C）以及次發射器（27）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disinfecting kit (75) for a machine (10) for washing and/or drying objects that includes at least one emitter unit (23) comprising a set of three of primary emitters (26A, 26B, 26C) and a secondary emitter (27).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機器</p>  
        <p type="p">11:運作腔室</p>  
        <p type="p">12:容置結構</p>  
        <p type="p">13:前開口</p>  
        <p type="p">14:底壁</p>  
        <p type="p">15:側壁</p>  
        <p type="p">16:底壁</p>  
        <p type="p">17:頂壁</p>  
        <p type="p">18:門</p>  
        <p type="p">22:容置座</p>  
        <p type="p">23:發射單元</p>  
        <p type="p">50:控制單元</p>  
        <p type="p">75:消毒套件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1647" publication-number="202628657"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628657.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GaN/SiC疊接功率裝置之封裝</chinese-title>  
        <english-title>PACKAGE OF GAN/SIC CASCODE POWER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10D80/20</main-classification>  
        <further-classification edition="202601120260317B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒　稷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於使用第一及第二電晶體群組形成的GaN/SiC疊接功率裝置。該第一電晶體群組具有一或多個低電壓常關型GaN高電子遷移率電晶體。該第二群組具有一或多個高電壓常開型SiC接面場效電晶體。骨架層機械支撐該兩個電晶體群組中之各別電晶體並在該等各別電晶體之間提供電連接。該骨架層係藉由在絕緣剛性層上或其內嵌入導電跡線網路所形成。該等各別電晶體安裝於該骨架層上並經由該導電跡線網路電連接。有利的是，在該兩個電晶體群組之間提供內部連接時並無接合線。不期望的互連電感顯著減小，從而抑制了在切換過程期間皆對該功率裝置產生過應力之切換損失及切換振盪。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A GaN/SiC cascode power device is formed with first and second transistor groups. The first transistor group has one or more low-voltage normally-off GaN high-electron-mobility transistors. The second group has one or more high-voltage normally-on SiC junction-field-effect transistors. A backbone layer mechanically supports respective transistors in the two transistor groups and provides electrical connectivity among the respective transistors. The backbone layer is formed by embedding a network of conductive traces on or within an insulating rigid layer. The respective transistors are mounted on the backbone layer and electrically connected via the network of conductive traces. Advantageously, bonding wires are absent in providing intra-connection between the two transistor groups. Undesirable interconnection inductances are considerably reduced such that switching loss and switching oscillation, both overstressing the power device during a switching process, are suppressed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:第一GaN/SiC疊接功率裝置</p>  
        <p type="p">201:LV常關型GaN HEMT</p>  
        <p type="p">202:DBC層</p>  
        <p type="p">203:金屬圖案</p>  
        <p type="p">204:金屬貫孔</p>  
        <p type="p">205:HV常開型SiC JFET</p>  
        <p type="p">234:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1648" publication-number="202626717"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626717.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多價FZD4、WNT共同受體及VEGF受體分子及其用途</chinese-title>  
        <english-title>MULTIVALENT FZD4, WNT CO-RECEPTOR, AND VEGF RECEPTOR MOLECULES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07K16/22</further-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默沙東有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商眼科生物技術公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EYEBIOTECH LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>半田　昌久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANDA, MASAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛克特夫　亞歷山大　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOKTEV, ALEXANDER V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維斯　邁克爾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIES, MICHAEL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　殷杉　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, YIN SHAN ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史蒂芬斯　保羅　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEPHENS, PAUL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供活化Wnt/β-連環蛋白信號傳導路徑之多價抗體結合分子，其包括FZD4受體結合域、LRP5共同受體結合域及VEGF結合域。本文亦闡述編碼該等分子之核酸及載體及其使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Herein are multivalent antibody binding molecules that activate a Wnt/β-catenin signaling pathway comprising a FZD4 receptor binding domain, an LRP5 co-receptor binding domain, and a VEGF binding domain. Also described herein are nucleic acids and vectors encoding said molecules and methods for their use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1649" publication-number="202626718"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626718.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多價FZD4、WNT共同受體及VEGF受體分子及其用途</chinese-title>  
        <english-title>MULTIVALENT FZD4, WNT CO-RECEPTOR, AND VEGF RECEPTOR MOLECULES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07K16/22</further-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默沙東有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商眼科生物技術公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EYEBIOTECH LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>半田　昌久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANDA, MASAHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛克特夫　亞歷山大　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOKTEV, ALEXANDER V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維斯　邁克爾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIES, MICHAEL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　殷杉　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, YIN SHAN ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史蒂芬斯　保羅　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEPHENS, PAUL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供活化Wnt/β-連環蛋白信號傳導路徑之多價抗體結合分子，其包括FZD4受體結合域、LRP5共同受體結合域及VEGF結合域。本文亦闡述編碼該等分子之核酸及載體及其使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Herein are multivalent antibody binding molecules that activate a Wnt/β-catenin signaling pathway comprising a FZD4 receptor binding domain, an LRP5 co-receptor binding domain, and a VEGF binding domain. Also described herein are nucleic acids and vectors encoding said molecules and methods for their use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1650" publication-number="202626323"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626323.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓縮成形方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250912B">B29C43/36</main-classification>  
        <further-classification edition="200601120250912B">B29C43/34</further-classification>  
        <further-classification edition="200601120250912B">B29C43/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本雅志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斉藤高志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即使工件為具有狹窄部的結構，亦可防止空隙的產生，可防止起因於空隙的成形不良的產生的壓縮成形方法。本發明的壓縮成形方法包括：樹脂準備步驟，準備規定形狀的片狀樹脂作為密封樹脂R；工件保持步驟，將使片狀樹脂R載置於電子零件Wb的狀態的工件W保持於密封模具202內的規定位置；第一閉模步驟，使第一模204與第二模206抵接而進行將密封模具202內密閉的密封模具202的閉模；減壓步驟，在第一閉模步驟之後對密封模具202內進行減壓；以及第二閉模步驟，在減壓步驟之後或在實施減壓步驟的同時進一步進行密封模具202的閉模，並利用片狀樹脂R將工件W密封而加工成成形品Wp。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:密封模具</p>  
        <p type="p">204:上模(第一模)</p>  
        <p type="p">204a:模具面</p>  
        <p type="p">205:工件保持部</p>  
        <p type="p">206:下模(第二模)</p>  
        <p type="p">208:模腔</p>  
        <p type="p">210:第一模槽</p>  
        <p type="p">224:第一夾持彈簧</p>  
        <p type="p">226:模腔模件</p>  
        <p type="p">228:第一夾具</p>  
        <p type="p">234:第二夾持彈簧</p>  
        <p type="p">238:第二夾具</p>  
        <p type="p">240:第二模槽</p>  
        <p type="p">242:板</p>  
        <p type="p">244、246:密封構件</p>  
        <p type="p">F:離型膜(膜)</p>  
        <p type="p">R:密封樹脂(片狀樹脂)</p>  
        <p type="p">W:工件</p>  
        <p type="p">Wa:基材</p>  
        <p type="p">Wb:電子零件</p>  
        <p type="p">X:方向(左右方向)</p>  
        <p type="p">Y:方向(前後方向)</p>  
        <p type="p">Z:方向(上下方向)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1651" publication-number="202627136"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627136.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化釔被膜及其成膜方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C23C14/08</main-classification>  
        <further-classification edition="200601120260317B">C23C14/24</further-classification>  
        <further-classification edition="200601120260317B">C23C14/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神戶製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本兼司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制了因以異物作為起點的異常成長而耐電漿性降低者的氧化釔被膜及其成膜方法。於基材上所形成的氧化釔被膜中，於該被膜之包含厚度方向的剖面中，使前述被膜中存在的以金屬釔為主體的複數個粒子各自以橢圓近似時的長徑/短徑之比的平均大於1.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:成膜裝置</p>  
        <p type="p">12:真空腔室</p>  
        <p type="p">12A:氣體導入口</p>  
        <p type="p">12B:排氣口</p>  
        <p type="p">14:旋轉台</p>  
        <p type="p">16:基材支架</p>  
        <p type="p">18:偏壓電源</p>  
        <p type="p">20:靶材</p>  
        <p type="p">22:電弧電源</p>  
        <p type="p">24:加熱器</p>  
        <p type="p">30:氬槽</p>  
        <p type="p">32:氧槽</p>  
        <p type="p">50:控制器</p>  
        <p type="p">P:真空泵</p>  
        <p type="p">W:功</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1652" publication-number="202627173"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627173.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於優化CVD反應器或用於在CVD反應器中沉積層之方法以及此種經優化之方法或CVD反應器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C23C16/455</main-classification>  
        <further-classification edition="200601120260317B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商愛思強歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIXTRON SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈恩　烏茲赫爾維格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAHN, UTZ HERWIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾柏格　馬塞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLLBERG, MARCEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道爾斯伯格　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAUELSBERG, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢　利文大衛理查約翰尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEE, LEVIN DAVID RICHARD JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費列　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAHLE, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種用於提高CVD反應器(1)之效率的方法以及一種藉由該方法之結果實施的塗佈方法或製成的CVD反應器，其中，該CVD反應器具有帶多個疊置的氣體入口區(6、7、8、9)之氣體入口構件(5)，最下方的氣體入口區(6)的高度(H1)會影響在CVD反應器(1)中沉積在基板上之層的生長率。應藉由一種優化方法來最大化生長率。為此，生長曲線之下降分枝(15''')應儘可能直線延伸並且具有最大值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:CVD反應器</p>  
        <p type="p">2:製程室</p>  
        <p type="p">3:製程室底部</p>  
        <p type="p">4:製程室頂部</p>  
        <p type="p">5:氣體入口構件</p>  
        <p type="p">6:第一氣體入口區</p>  
        <p type="p">6':第一排氣面</p>  
        <p type="p">6":排氣孔</p>  
        <p type="p">7:第二氣體入口區</p>  
        <p type="p">7':第二排氣面</p>  
        <p type="p">7":排氣孔</p>  
        <p type="p">8:第三氣體入口區</p>  
        <p type="p">8':第三排氣面</p>  
        <p type="p">8":排氣孔</p>  
        <p type="p">9:第四氣體入口區</p>  
        <p type="p">9':第四排氣面</p>  
        <p type="p">9":排氣孔</p>  
        <p type="p">10:第五氣體入口區</p>  
        <p type="p">10':第五排氣面</p>  
        <p type="p">10":排氣孔</p>  
        <p type="p">11:始流區</p>  
        <p type="p">12:生長區</p>  
        <p type="p">13:基板</p>  
        <p type="p">14:載位/基板架</p>  
        <p type="p">15:可用性曲線</p>  
        <p type="p">15':頂點</p>  
        <p type="p">15":上升邊緣</p>  
        <p type="p">15''':下降邊緣</p>  
        <p type="p">16:加熱裝置</p>  
        <p type="p">A:距離/第一距離</p>  
        <p type="p">B:距離/第二距離</p>  
        <p type="p">H1:高度/第一高度</p>  
        <p type="p">H2:高度/第二高度</p>  
        <p type="p">H3:高度</p>  
        <p type="p">H4:高度</p>  
        <p type="p">H5:高度</p>  
        <p type="p">Q1:第一氣體流量</p>  
        <p type="p">Q2:第二氣體流量</p>  
        <p type="p">Q3:第三氣體流量</p>  
        <p type="p">Q4:第四氣體流量</p>  
        <p type="p">Q5:第五氣體流量</p>  
        <p type="p">V:始流區的長度</p>  
        <p type="p">W:生長區的長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1653" publication-number="202626870"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626870.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組合物及經圖案化之聚醯亞胺樹脂膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G73/10</main-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海老澤和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBISAWA, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光微影特性及保管穩定性優異並且能夠形成機械特性及耐化學藥品性優異之聚醯亞胺樹脂膜之感光性樹脂組合物、及使用該感光性樹脂組合物之經圖案化之聚醯亞胺樹脂膜之製造方法。 &lt;br/&gt;本發明係一種感光性樹脂組合物，其包含：具有特定結構之結構單元之聚醯亞胺樹脂前驅物(A1)與具有(甲基)丙烯醯基之異氰酸酯化合物(A2)之反應物(A)；藉由加熱而產生咪唑之熱鹼產生劑(B)；及光自由基聚合起始劑(C)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1654" publication-number="202628872"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628872.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133872</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造設備的健康評估</chinese-title>  
        <english-title>HEALTH ASSESSMENT OF SEMICONDUCTOR FABRICATION EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P72/00</main-classification>  
        <further-classification edition="200601120260318B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙瓦拉尼　卡皮爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWLANI, KAPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里希那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁　帕特金　約翰　埃爾斯沃思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, PATGING JOHN ELSWORTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗蘭森　保羅　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANZEN, PAUL M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉比　拉福商</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RABBI, RAFSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了藉由監測指向半導體製造設備的感測配置的輸出來進行半導體製造設備的健康評估技術。感測配置包含聲學相位陣列以及射頻(RF)相位陣列的一或兩者。根據所監測的這些輸出，來進行半導體製造設備的健康評估。在一些實施方式中，這些技術包含響起警報、發訊給操作員、啟動軟關閉或中斷及/或建議進一步分析及/或校正動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for assessing health of semiconductor fabrication system equipment by monitoring outputs of a sensing arrangement directed toward the semiconductor fabrication equipment are disclosed. The sensing arrangement includes one or both of an acoustic phased array and a radio frequency (RF) phased array. From the monitored outputs, a health assessment of the semiconductor fabrication equipment is made. The techniques, in some implementations, include sounding an alarm, signaling an operator, initiating a soft-shutdown or abort, and/or recommending further analysis and/or corrective action.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">830:相位陣列</p>  
        <p type="p">840:流體管線組合件</p>  
        <p type="p">842:流體管線</p>  
        <p type="p">844A:絕緣套筒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1655" publication-number="202627463"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627463.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>解析裝置、系統、方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260302B">G01N23/201</main-classification>  
        <further-classification edition="201801120260302B">G01N23/2055</further-classification>  
        <further-classification edition="200601120260302B">G01B11/26</further-classification>  
        <further-classification edition="200601120260302B">G01B11/24</further-classification>  
        <further-classification edition="201701120260302B">G06T7/60</further-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商理學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGAKU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤義泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YOSHIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種解析試料表面之斜率之解析裝置、系統、方法及程式。本發明之解析裝置具備：二維輪廓取得部，其取得檢測於試料表面反射或繞射之雷射光之二維輪廓；譜線輪廓產生部，其針對二維輪廓中，複數個峰值直線狀排列之第1直線、及與第1直線正交且複數個峰值直線狀排列之第2直線，產生將內部包含第1直線及第2直線各自之至少一部分之指定區域，於與第1直線垂直之方向上積分之第1譜線輪廓，及於與第2直線垂直之方向上積分之第2譜線輪廓；反射位置決定部，其基於第1譜線輪廓及第2譜線輪廓，決定二維輪廓之反射位置；及斜率算出部，其基於反射位置算出試料表面之斜率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:解析裝置</p>  
        <p type="p">410:二維輪廓取得部</p>  
        <p type="p">420:二維輪廓產生部</p>  
        <p type="p">430:反射位置決定部</p>  
        <p type="p">440:斜率算出部</p>  
        <p type="p">510:輸入裝置</p>  
        <p type="p">520:顯示裝置</p>  
        <p type="p">L:匯流排</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1656" publication-number="202625898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>屬於葉蟎科之葉蟎之防治劑</chinese-title>  
        <english-title>CONTROL AGENT FOR SPIDER MITES BELONGING TO THE FAMILY TETRANYCHIDAE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260401B">A01N63/60</main-classification>  
        <further-classification edition="201001120260401B">C12N15/113</further-classification>  
        <further-classification edition="200601120260401B">A01P7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商石原產業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA SANGYO KAISHA, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努爾丁　加齊　貝爾法茲爾　努爾丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOURELDIN, GHAZY ABUELFADL NOURELDIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村𨺓秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, TAKAHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤枝貴行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIEDA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天野泰輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMANO, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種屬於葉蟎科之葉蟎之防治劑，其含有以下(a)~(c)中之任一者：(a)對於突觸融合蛋白(Syntaxin)基因及/或突觸融合蛋白12基因具有RNAi效果之雙股RNA、(b)針對突觸融合蛋白基因及/或突觸融合蛋白12基因之轉錄產物或其一部分之反義寡核苷酸(Antisense Oligonucleotide)、(c)在細胞內生成前述(a)或(b)之核酸構造、一種屬於葉蟎科之葉蟎之防治方法，其包含施用以下(a)~(c)中之任一者之步驟：(a)對於突觸融合蛋白基因及/或突觸融合蛋白12基因具有RNAi效果之雙股RNA、(b)針對突觸融合蛋白基因及/或突觸融合蛋白12基因之轉錄產物或其一部分之反義寡核苷酸、(c)在細胞內生成前述(a)或(b)之核酸構造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses, for example, a control agent for spider mites belonging to the family Tetranychidae, the control agent comprising any of (a) to (c) below: (a) a double-stranded RNA having an RNAi effect on a syntaxin gene and/or a syntaxin-12 gene; (b) an antisense nucleic acid against a transcript of a syntaxin gene and/or a syntaxin-12 gene, or a part thereof; and (c) a nucleic acid construct that intracellularly produces (a) or (b); a method for controlling spider mites belonging to the family Tetranychidae, the method comprising a step that involves application of any of (a) to (c) below: (a) a double-stranded RNA having an RNAi effect on a syntaxin gene and/or a syntaxin-12 gene; (b) an antisense nucleic acid against a transcript of a syntaxin gene and/or a syntaxin-12 gene, or a part thereof; and (c) a nucleic acid construct that intracellularly produces (a) or (b); and the like.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1657" publication-number="202628180"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628180.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿增強磊晶沉積腔室</chinese-title>  
        <english-title>PLASMA ENHANCED EPITAXIAL DEPOSITION CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H01J37/32</main-classification>  
        <further-classification edition="200601120260318B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　博慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAU, JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>露波默斯基　德米翠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUBOMIRSKY, DMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　怡利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIEH, ELLIE Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯日卡卡爾坎迪　拉胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOZHIKKALKANDI, RAHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎　艾德柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHAN, ADIB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例包括用於形成磊晶層的電漿處理腔室。該電漿處理腔室將包括基板支撐、位於基板支撐上方的腔室蓋、位於腔室蓋上方的第一電感耦合電漿源、基板偏壓源、安置在腔室蓋下方的氣體環，以及電漿處理腔室的下部，其包括具有對稱軸的封閉體。基板支撐包含設置在基板支撐主體內的電極，以及位於電極上方並在電漿處理腔室的電漿處理區域內的基板支撐表面。第一電感耦合電漿源包括：位於腔室蓋上方的第一線圈，其中該第一線圈包括第一端和第二端，且第一線圈的第二端接地，並且有第一射頻（RF）電源，其中第一RF電源的輸出節點耦接至第一線圈的第一端。基板偏壓源包括與基板支撐的電極耦接的第一電源。氣體環包括複數個噴嘴，這些噴嘴經配置以將氣體經由每個噴嘴的出口輸送至位於基板支撐表面上方的電漿處理區域的一部分。封閉體內形成的泵送埠和基板支撐相對於該封閉體的該對稱軸同心對齊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure include a plasma processing chamber for forming an epitaxial layer. The plasma processing chamber will include a substrate support, a chamber lid positioned over the substrate support, a first inductively coupled plasma source positioned over the chamber lid, a substrate bias source, a gas ring disposed under the chamber lid, and a lower portion of the plasma processing chamber comprising an enclosure having an axis of symmetry. The substrate support comprising an electrode disposed within a body of the substrate support, and a substrate supporting surface disposed over the electrode and in a plasma processing region of the plasma processing chamber. The first inductively coupled plasma source comprises: a first coil positioned over the chamber lid, wherein the first coil comprises a first end and a second end, and the second end of the first coil is coupled to ground, and a first radio frequency (RF) power source, wherein an output node of the first RF power source is coupled to the first end of the first coil. The substrate bias source comprises a first power source that is coupled to the electrode of the substrate support. The gas ring comprises a plurality of nozzles that are configured to deliver a gas through an outlet of each of the nozzles to a portion of the plasma processing region disposed over the substrate supporting surface. A pumping port formed in the enclosure and the substrate support are concentrically aligned about the axis of symmetry of the enclosure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2c:線</p>  
        <p type="p">2d:線</p>  
        <p type="p">20:上部</p>  
        <p type="p">30:下部</p>  
        <p type="p">200:腔室</p>  
        <p type="p">202:側壁</p>  
        <p type="p">202b:腔室主體側壁</p>  
        <p type="p">202c:腔室主體地板</p>  
        <p type="p">210:基板</p>  
        <p type="p">214:真空泵</p>  
        <p type="p">220:支撐件</p>  
        <p type="p">220a:底座</p>  
        <p type="p">220b:工件支撐表面</p>  
        <p type="p">220c:立柱</p>  
        <p type="p">220d:電極</p>  
        <p type="p">224:腔室蓋</p>  
        <p type="p">226:電漿源</p>  
        <p type="p">226a:電漿源/RF電源</p>  
        <p type="p">226b:線圈</p>  
        <p type="p">226c:匹配電路</p>  
        <p type="p">228:電漿源</p>  
        <p type="p">228a:電漿源/RF電源</p>  
        <p type="p">228b:線圈</p>  
        <p type="p">228c:匹配電路</p>  
        <p type="p">230:電漿源</p>  
        <p type="p">230a:電漿源/RF電源</p>  
        <p type="p">230b:線圈</p>  
        <p type="p">230c:匹配電路</p>  
        <p type="p">232:氣源</p>  
        <p type="p">236:頂部擋板/氣體擋板</p>  
        <p type="p">238:氣室區域</p>  
        <p type="p">240:噴嘴</p>  
        <p type="p">242:蓋襯墊</p>  
        <p type="p">246:處理區域</p>  
        <p type="p">247:可撓的波紋管</p>  
        <p type="p">248:襯墊</p>  
        <p type="p">248-1:上圓柱形部分</p>  
        <p type="p">248-2:下環形格網</p>  
        <p type="p">249:提升致動器</p>  
        <p type="p">252:遠端電漿源</p>  
        <p type="p">253:電漿處理區域</p>  
        <p type="p">260:腔室主體</p>  
        <p type="p">266:介電側窗</p>  
        <p type="p">278:基板偏壓源</p>  
        <p type="p">279a:RF電源</p>  
        <p type="p">279b:RF阻抗匹配網路/匹配電路</p>  
        <p type="p">279c:線纜</p>  
        <p type="p">282:包圍牆</p>  
        <p type="p">283:中心空間</p>  
        <p type="p">284:徑向支柱</p>  
        <p type="p">285:徑向進出通道</p>  
        <p type="p">286:抽氣區域</p>  
        <p type="p">286a:真空泵開口</p>  
        <p type="p">295:加熱組件</p>  
        <p type="p">296:加熱元件</p>  
        <p type="p">297:加熱源</p>  
        <p type="p">402:氣體環襯墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1658" publication-number="202628453"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628453.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於客戶端起始的無縫漫遊的傳訊及程序</chinese-title>  
        <english-title>SIGNALING AND PROCEDURES FOR CLIENT-INITIATED SEAMLESS ROAMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260331B">H04W36/18</main-classification>  
        <further-classification edition="200901120260331B">H04W36/36</further-classification>  
        <further-classification edition="200901120260331B">H04W48/08</further-classification>  
        <further-classification edition="200901120260331B">H04W84/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊希　喬瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHISCI, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　世耀當肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SAI YIU DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈克　高朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIK, GAURANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽里恩　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉歐　克里斯娜查坦亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAO, KRISHNA CHAITANYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛加特　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHOGAT, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈札利卡　吉恩藍詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZARIKA, GYANRANJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTERJADHI, ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉姆卡　桑凱特桑傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALAMKAR, SANKET SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾瓦　謝里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELWA, SHERIEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於針對客戶端起始的無縫漫遊的傳訊及程序之方法、組件、裝置、及系統。一些態樣更具體地係關於一無縫漫遊操作中之鄰域資訊的通訊。一服務AP可在初始關聯期間、漫遊期間、關聯之後、或漫遊之後向該客戶端裝置指示該鄰域資訊。該服務AP可經由一或多個資訊元素（諸如鄰域報告資訊元素或多鏈路資訊元素）來指示該鄰域資訊。該等資訊元素可處於信標訊框或關聯訊框中。該服務AP可經由一基本服務集(BSS)轉換管理(BTM)請求（諸如經徵求的或未經徵求的BTM請求）或在該RNR的一壓縮版本中指示該鄰域資訊。該客戶端可基於該鄰域資訊及該鏈路準備漫遊至該服務AP的該鄰域中的一候選AP。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, components, devices and systems for signaling and procedures for client-initiated seamless roaming. Some aspects more specifically relate to communication of neighborhood information in a seamless roaming operation. A serving AP may indicate the neighborhood information to the client device during initial association, during roaming, after association, or after roaming. The serving AP may indicate the neighborhood information via one or more information elements, such as neighborhood report information elements or multi-link information elements. The information elements may be in beacon frames or association frames. The serving AP may indicate the neighborhood information via a basic service set (BSS) transition management (BTM) request, such as a solicited or unsolicited BTM request, or in a compressed version of the RNR. The client may roam to a candidate AP in the neighborhood of the serving AP based on the neighborhood information and the link preparation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102-a:AP</p>  
        <p type="p">102-b:AP</p>  
        <p type="p">104:無線站台(STA)/STA</p>  
        <p type="p">202:SMD MLD</p>  
        <p type="p">300:程序流程</p>  
        <p type="p">302:步驟</p>  
        <p type="p">304:步驟</p>  
        <p type="p">306:步驟</p>  
        <p type="p">308:步驟</p>  
        <p type="p">310:步驟</p>  
        <p type="p">312:步驟</p>  
        <p type="p">314:步驟</p>  
        <p type="p">316:步驟</p>  
        <p type="p">318:步驟</p>  
        <p type="p">320:步驟</p>  
        <p type="p">322:步驟</p>  
        <p type="p">324:步驟</p>  
        <p type="p">326:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1659" publication-number="202627338"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627338.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>致動器、具有致動器的裝置及組裝方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">F16K31/04</main-classification>  
        <further-classification edition="200601120260318B">F16K31/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商西門斯瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIEMENS SCHWEIZ AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦藤霍夫　西弗林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATTENHOFER, SEVERIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡瑟　塞德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUESSER, CEDRIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海爾　約格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIL, JOERG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種致動器(1)，用於調節一(空氣)單向閥或一閥(100)之氣態或液態容積流量。該致動器(1)具有一被容納在致動器(1)基體內或上的驅動單元(2)以及一出口側的致動元件(4)，其中致動元件(4)具有一可對致動軸線(5)轉動之驅動套筒(6)，用以致動(空氣)單向閥或閥(100)。經由驅動軸頸(106)進入驅動套筒(6)，驅動套筒(6)可與(空氣)單向閥或閥(100)一可轉動的驅動軸頸(106)耦接，使得在一第一耦接位置一力矩可由驅動套筒(6)傳遞至驅動軸頸(106)，而在一第二耦接位置，力矩無法由驅動套筒(6)傳遞至驅動軸頸(106)。經由不同的耦接位置，致動器(1)在(空氣)單向閥或閥(100)上的組裝顯著簡化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:驅動套筒</p>  
        <p type="p">16:腹板</p>  
        <p type="p">106:驅動軸線</p>  
        <p type="p">116:槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1660" publication-number="202627236"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627236.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電鍍設備及電鍍方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C25D17/00</main-classification>  
        <further-classification edition="200601120260401B">C25D17/08</further-classification>  
        <further-classification edition="200601120260401B">C25D21/10</further-classification>  
        <further-classification edition="200601120260401B">C25D7/12</further-classification>  
        <further-classification edition="200601120260401B">B25J11/00</further-classification>  
        <further-classification edition="200601120260401B">B25J13/00</further-classification>  
        <further-classification edition="200601120260401B">B65G47/248</further-classification>  
        <further-classification edition="200601120260401B">B65G49/04</further-classification>  
        <further-classification edition="200601120260401B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶向宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, XIANGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宏超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HONGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈照偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, ZHAOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種電鍍設備及電鍍方法。電鍍設備包括：基板裝載端口、前端模塊、緩存模塊、處理模塊、前端機械手和工藝機械手，所述前端機械手用於在所述基板裝載端口和所述緩存模塊之間傳輸基板，所述處理模塊包括多個工藝腔，所述工藝機械手用於在所述多個工藝腔之間傳輸基板；所述緩存模塊設置在所述前端模塊和所述處理模塊之間，所述緩存模塊包括翻轉單元，用於翻轉基板以將基板的正面和背面位置互換。本申請在緩存模塊設置翻轉單元，以將基板進行180°的翻轉，便於基板在水平電鍍工藝中保持正面朝下。整個工藝過程中僅需將基板翻轉兩次，就能實現基板的水平電鍍，保證了面板級電鍍的效果及產品性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:端口</p>  
        <p type="p">2:前端模塊</p>  
        <p type="p">20:前端機械手</p>  
        <p type="p">3:緩存模塊</p>  
        <p type="p">4:處理模塊</p>  
        <p type="p">40:工藝機械手</p>  
        <p type="p">41:工藝腔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1661" publication-number="202626093"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626093.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>介白素2(IL-2)及CD123　NK細胞銜接體組合療法</chinese-title>  
        <english-title>INTERLEUKIN 2 (IL-2) AND CD123 NK CELL ENGAGER COMBINATION THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">A61K38/20</further-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07K14/55</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿巴德薩　喬瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABBADESSA, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱龍　瑪麗艾爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIRON, MARIELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗蘭克爾　保拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRAENKEL, PAULA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維羅內　奧多斯　安吉拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIRONE-ODDOS, ANGELA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於用結合蛋白和介白素2（IL-2）多肽的組合治療癌症之方法，該結合蛋白包含第一抗原結合結構域（antigen binding domain，ABD）和第二ABD，其中該第一ABD與人類CD123特異性結合並且該第二ABD與人類NKp46特異性結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods of treating cancer with the combination of a binding protein comprising a first and a second antigen binding domain (ABD), wherein the first ABD binds specifically to human CD123 and the second ABD binds specifically to human NKp46, and an interleukin 2 (IL-2) polypeptide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1662" publication-number="202626668"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626668.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為cGAS　抑制劑之環狀苯并咪唑衍生物</chinese-title>  
        <english-title>CYCLIC BENZIMIDAZOLE DERIVATIVES AS CGAS INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07D498/22</main-classification>  
        <further-classification edition="200601120260324B">A61K31/529</further-classification>  
        <further-classification edition="200601120260324B">A61P37/00</further-classification>  
        <further-classification edition="200601120260324B">A61P1/16</further-classification>  
        <further-classification edition="200601120260324B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希曼　安妮卡翠　夏綠蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIMANN, ANNEKATRIN CHARLOTTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德瑞爾　亞歷山德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DREYER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格納姆　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GNAMM, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格波特　西德克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODBOUT, CEDRICKX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛蘭德　馬克　亞力山德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRUNDL, MARC ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢斯屈　珊卓　盧思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANDSCHUH, SANDRA RUTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍恩柯　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOENKE, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克雷　喬格　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLEY, JOERG THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫拉夫　克莉絲汀　安德里亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUTTRUFF, CHRISTIAN ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞納特　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REINERT, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史杜伯　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STUBER, RAPHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於式&lt;b&gt;I&lt;/b&gt;化合物 &lt;br/&gt;&lt;img align="absmiddle" height="351px" width="338px" file="ed10369.JPG" alt="ed10369.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;b/&gt;， &lt;br/&gt;其中&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;A&lt;/b&gt;、&lt;b&gt;D&lt;/b&gt;、&lt;b&gt;E&lt;/b&gt;、&lt;b&gt;G&lt;/b&gt;、&lt;b&gt;J&lt;/b&gt;、&lt;b&gt;K&lt;/b&gt;及&lt;b&gt;L&lt;/b&gt;依技術方案1中所定義；以及其前藥、氘化類似物及醫藥學上可接受之鹽；其用於治療諸如全身性紅斑性狼瘡症、全身性硬化症(SSc)、干擾素病變、非酒精性脂肪變性肝炎(NASH)、間質性肺病(ILD)及特發性肺纖維化(IPF)之疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to compounds of formula &lt;b&gt;I&lt;/b&gt;&lt;br/&gt;&lt;img align="absmiddle" height="379px" width="335px" file="ed10370.JPG" alt="ed10370.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;wherein&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;A&lt;/b&gt;, &lt;b&gt;D&lt;/b&gt;, &lt;b&gt;E&lt;/b&gt;, &lt;b&gt;G&lt;/b&gt;, &lt;b&gt;J&lt;/b&gt;, &lt;b&gt;K &lt;/b&gt;and &lt;b&gt;L &lt;/b&gt;are defined as in claim 1, and prodrugs, deuterated analogues and pharmaceutical acceptable salts thereof, for the treatment of diseases such as systemic lupus erythematosus, systemic sclerosis (SSc), interferonopathies, non-alcoholic steatohepatitis (NASH), interstitial lung disease (ILD) and idiopathic pulmonary fibrosis (IPF).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1663" publication-number="202626450"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626450.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133936</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器封口裝置用密封蓋及容器封口裝置</chinese-title>  
        <english-title>SEALING CAP FOR A CONTAINER CLOSURE AND CONTAINER CLOSURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260329B">B65D41/04</main-classification>  
        <further-classification edition="200601120260329B">B65D55/06</further-classification>  
        <further-classification edition="200601120260329B">B65D41/58</further-classification>  
        <further-classification edition="200601120260329B">B65D39/08</further-classification>  
        <further-classification edition="200601120260329B">B65D41/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商普洛泰克納公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROTECHNA S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃梅爾斯多夫　詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOMMELSDORF, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮耶　卡爾　海因茨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PREE, KARL-HEINZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅梅爾　拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROMMEL, LARS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於容器塞（container plug）（23）之由塑膠材料製成的密封蓋（24），該容器塞插入至容器（13）之塞頸（bung neck）（20）中，該密封蓋具有蓋盤（25），該蓋盤具有連接至該蓋盤之下側（29）的緊固環（30），該緊固環具有用於實現在該容器塞上之鎖扣裝置（31）與配合鎖扣裝置（33）建立可拆卸嚙合連接，該蓋盤具有蓋條，該蓋條經由側向預定斷裂線與該蓋盤之鄰近區域分離且連接至安置於該蓋盤之圓周上的拉環（41），其中該嚙合連接能夠建立在該容器塞之插塞凹座（45）的外壁上，該蓋盤具有連接至該蓋盤之該下側且實現為安置於該插塞凹座中的導引突起（44）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a sealing cap (24) made of a plastic material for a container plug (23) inserted into a bung neck (20) of a container (13), the sealing cap having a lid disk (25) with a fastening ring (30) connected to an underside (29) of the lid disk, the fastening ring having a latching device (31) for establishing a detachable engagement connection with a mating latching device (33) realized on the container plug, the lid disk having a lid strip separated from adjacent areas of the lid disk via lateral predetermined breaking lines and connected to a pull tab (4 1 ) disposed on a circumference of the lid disk, wherein the engagement connection is capable of being established on an outer wall of a plug depression (45) of the container plug, the lid disk having a guide projection (44) connected to the underside of the lid disk and realized for being disposed in the plug depression.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:內部容器</p>  
        <p type="p">15:容器封口裝置</p>  
        <p type="p">16:容器開口</p>  
        <p type="p">17:封閉蓋</p>  
        <p type="p">20:塞頸</p>  
        <p type="p">21:開口邊緣</p>  
        <p type="p">22:上側</p>  
        <p type="p">23:容器塞</p>  
        <p type="p">24:密封蓋</p>  
        <p type="p">25:蓋盤</p>  
        <p type="p">26:邊緣裙部</p>  
        <p type="p">27:預定斷裂腹板</p>  
        <p type="p">29:下側</p>  
        <p type="p">30:緊固環</p>  
        <p type="p">32:徑向鎖扣溝槽</p>  
        <p type="p">33:配合鎖扣裝置</p>  
        <p type="p">41:拉環</p>  
        <p type="p">42:拉帶</p>  
        <p type="p">43:中心</p>  
        <p type="p">44:導引突起</p>  
        <p type="p">45:插塞凹座</p>  
        <p type="p">48:內壁</p>  
        <p type="p">49:旋轉軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1664" publication-number="202626663"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626663.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、組合物及方法</chinese-title>  
        <english-title>COMPOUNDS, COMPOSITIONS, AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D495/14</main-classification>  
        <further-classification edition="200601120260401B">C07D471/14</further-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">C07D471/22</further-classification>  
        <further-classification edition="200601120260401B">A61K31/444</further-classification>  
        <further-classification edition="200601120260401B">A61K31/538</further-classification>  
        <further-classification edition="200601120260401B">A61K31/437</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260401B">A61P19/00</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅空嘉閣生物公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACONCAGUA BIO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高振廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, ZHENTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李崔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧春良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUNLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, DING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張海鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAIZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　祖銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於調節降鈣素受體及/或澱粉素受體活性的化合物，以及包含本文所揭示之化合物的醫藥組合物。亦提供用於治療降鈣素受體及/或澱粉素受體相關疾病或病症的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides compounds for modulating calcitonin receptor and/or amylin receptor activity, as well as pharmaceutical compositions comprising the compounds disclosed herein. Also provided are methods for treating a calcitonin receptor and/or amylin receptor associated disease or disorder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1665" publication-number="202626222"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626222.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燒結性接合用膏及接合結構體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260401B">B22F1/00</main-classification>  
        <further-classification edition="202201120260401B">B22F1/16</further-classification>  
        <further-classification edition="200601120260401B">B22F7/08</further-classification>  
        <further-classification edition="202601120260401B">H10W72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大賽璐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上島稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UESHIMA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種燒結性接合用膏，其在用於燒結接合之情形時，可於低溫燒結，且能夠獲得難產生裂紋於燒結部擴展、或作為被接合物之Si或SiC等半導體元件或DBC等基板破裂等不良情況，導熱率亦優異之接合結構體。 &lt;br/&gt;本發明係一種燒結性接合用膏，其包含銀粉末（A）及表面具有矽氧化物之除銀以外之元素粒子（B），且特徵在於， &lt;br/&gt;包含或不包含樹脂及黏合劑，相對於銀粉末（A）及表面具有矽氧化物之除銀以外之元素粒子（B）之合計量100質量份，上述樹脂及上述黏合劑之合計含量為3質量份以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1666" publication-number="202626741"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626741.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙載荷抗體藥物偶聯物及其用途</chinese-title>  
        <english-title>DUAL-PAYLOAD ANTIBODY-DRUG CONJUGATES AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/32</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07H21/00</further-classification>  
        <further-classification edition="200601120260401B">C07D491/22</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰勵生物科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYLIGAND BIOSCIENCE (SHANGHAI) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲　伯禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, BOYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳光明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUANGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　彥濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, TONY YANTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董春蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, CHUNLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王孝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　延良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YANLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及雙載荷抗體-藥物偶聯物(ADC)以及含有該ADC分子的組成物及其治療應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to dual-payload antibody-drug conjugates (ADC), compositions containing the same and therapeutic uses of the same.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1667" publication-number="202627364"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627364.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133948</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料中心的剩餘熱能的利用</chinese-title>  
        <english-title>UTILIZATION OF A DATA CENTER’S RESIDUAL THERMAL ENERGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">F24F13/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩能巨蒂科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENERGETICO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福科森　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORKOSH, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝爾　亞伯拉罕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHER, ABRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">某些揭露的實施例允許將資料中心去中心化到更小的分散式位置，通過利用現有的HVAC安裝將計算設備產生的剩餘熱能重新用於場所供暖，從而降低能耗及碳排放。場所控制器與HVAC設備界接以實現此目標。此外，在一些實施例中，分散式資料中心中的多個網站通過雲端路由器使用光纖介質互連並進行遠端控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some disclosed embodiments allow to decentralize data centers into smaller distributed locations to reduce energy consumption and carbon emissions by utilizing existing HVAC installations to repurpose residual heat from computing equipment for heating premises. A premises controller interfaces with the HVAC equipment to achieve this. Additionally, in some embodiments, multiple sites in a distributed data center are interconnected and controlled remotely via a cloud router using fiber optic media.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:場所</p>  
        <p type="p">120:骨幹雲端</p>  
        <p type="p">121:光纖幹線</p>  
        <p type="p">210:資料中心部分(DCS)</p>  
        <p type="p">220:場所控制器</p>  
        <p type="p">221:CPU</p>  
        <p type="p">222:記憶體</p>  
        <p type="p">223:I/O模組</p>  
        <p type="p">224:網路介面卡(NIC)</p>  
        <p type="p">230:HVAC系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1668" publication-number="202627220"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627220.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用可回收製程熱之電解器</chinese-title>  
        <english-title>ELECTROLYZER USING RECOVERABLE PROCESS HEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260320B">C25B9/67</main-classification>  
        <further-classification edition="202101120260320B">C25B1/042</further-classification>  
        <further-classification edition="200601120260320B">F28D21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商先進離子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED IONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅森　查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASON, CHAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯普夫　理查　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEMPF, RICHARD SAMUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賓卡茲　伊格納西奧　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BINCAZ, IGNACIO CLAUDIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐納文　麥可　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONOVAN, MICHAEL E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫瑞　威廉　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURRAY, WILLIAM R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產氫氣的系統，其包含：一熱交換器模組，該熱交換器包含一加溫模組和一鍋爐；一轉換器模組，該轉換器模組包含一過熱器、汽化器和/或壓縮機；與該轉換器模組連通的一電解器，且該電解器與該熱交換器模組連通。一種用於生產氫氣之方法，其包含：將一工作流體送入到包含加溫模組和一鍋爐的一熱交換器模組中，以形成一氣相工作流體；將該氣相工作流體送入到包含一過熱器、汽化器和/或壓縮機的一轉換器模組中，以形成經轉換的工作流體；將該經轉換的工作流體送入到一電解器，以形成熱氫氣和熱氧氣；將該熱氧氣和/或熱氫氣送入到該熱交換器模組中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for producing hydrogen gas comprising: a heat exchanger module; the heat exchanger comprising: a warming module; and a boiler; a converter module; the converter module comprising a superheater, vaporizer, and/or compressor; an electrolyzer in communication with the converter module; and the electrolyzer in communication with the heat exchanger module. A method for producing hydrogen gas comprising: passing a working fluid into a heat exchanger module comprising warming module and a boiler to form a vapor-phase working fluid; passing the vapor-phase working fluid into a converter module comprising a superheater, vaporizer, and/or compressor to form a converted working fluid; passing the converted working fluid into an electrolyzer to form hot hydrogen gas and hot oxygen gas; passing the hot oxygen gas and/or hot hydrogen gas into the heat exchanger module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">36:(生產氫之)系統</p>  
        <p type="p">38:輸入反應物</p>  
        <p type="p">40:熱交換器模組</p>  
        <p type="p">42:加溫模組</p>  
        <p type="p">44:鍋爐</p>  
        <p type="p">46:過熱器</p>  
        <p type="p">48:(可回收/外部)製程熱</p>  
        <p type="p">50:輸入流</p>  
        <p type="p">52:熱電偶</p>  
        <p type="p">54:電解器</p>  
        <p type="p">56:功率輸入</p>  
        <p type="p">58:氫流</p>  
        <p type="p">60:氧流</p>  
        <p type="p">62:經冷卻氫流</p>  
        <p type="p">66:經冷卻氧流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1669" publication-number="202627437"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627437.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛載貨區碰撞測試滑台</chinese-title>  
        <english-title>CRASH TEST SLED FOR VEHICLE CARGO AREA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G01M7/08</main-classification>  
        <further-classification edition="200601120260318B">G01M17/007</further-classification>  
        <further-classification edition="200601120260318B">A01K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商居佳國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURTIS M., HARTENSTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭斯Ｊ　克萊默</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANCE J., CLEMMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞歷克斯　邁爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALEX, MYERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯林Ｆ　艾格特　克羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLIN F, EGGERT-CROWE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種碰撞測試滑台，其複製（replicating）車輛的後載貨區，用於測試後載貨區中的動物、該後載貨區前方車輛座椅上的乘客、或這兩者的安全性。該碰撞測試滑台包含一載貨區結構，其具有一底板、一壁部、位於該底板前方的一椅背平板、以及一頂板。該碰撞測試滑台另包含一感測器組件，其係配置為測定目標區域處的碰撞力，包含在一衝擊事件（例如碰撞）期間施加予椅背平板的衝擊力。可選地，該碰撞測試滑台另包含支撐該椅背平板的一水平構件或一連桿組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A crash test sled replicating the rear cargo area of a vehicle for testing safety of animals in the rear cargo area, occupants in a vehicle seat in front of the rear cargo area, or both, is disclosed. The crash test sled includes a cargo area structure having a floor, a wall, a seatback panel positioned forward of the floor, and a roof panel. The crash test sled further includes a sensor assembly configured to determine crash forces at areas of interest, including an impact force applied to the seatback panel during an impact event (e.g., crash). Optionally, the crash test sled further includes a horizontal member or a linkage assembly supporting the seatback panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20B:碰撞測試滑台</p>  
        <p type="p">22:椅背平板</p>  
        <p type="p">22A:椅背平板</p>  
        <p type="p">22B:椅背框架</p>  
        <p type="p">22C:椅背橫桿</p>  
        <p type="p">24:後載貨區結構</p>  
        <p type="p">26:底板</p>  
        <p type="p">52:水平構件</p>  
        <p type="p">64:橫桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1670" publication-number="202626773"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626773.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性著色樹脂組合物、硬化物、彩色濾光器、顯示裝置</chinese-title>  
        <english-title>PHOTOSENSITIVE COLORED RESIN COMPOSITION, CURED PRODUCT, COLOR FILTER AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C08F2/50</main-classification>  
        <further-classification edition="200601120260331B">C09B67/00</further-classification>  
        <further-classification edition="200601120260331B">C08K5/5415</further-classification>  
        <further-classification edition="200601120260331B">G03F7/004</further-classification>  
        <further-classification edition="200601120260331B">G03F7/027</further-classification>  
        <further-classification edition="200601120260331B">G02B5/20</further-classification>  
        <further-classification edition="202301120260331B">H10K59/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＮＰ精細化工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DNP FINE CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長井健朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, TAKERO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之感光性著色樹脂組合物含有色澱色材、分散劑、鹼可溶性樹脂、光聚合性化合物、光起始劑、下述通式(A)所表示之化合物、及溶劑。 &lt;br/&gt;通式(A) &lt;br/&gt;R&lt;sup&gt;x&lt;/sup&gt;R&lt;sup&gt;y&lt;/sup&gt;Si(OR&lt;sup&gt;z&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;&lt;br/&gt;(此處，R&lt;sup&gt;x&lt;/sup&gt;表示含有選自由(甲基)丙烯醯氧基、乙烯基、環氧基、胺基、巰基、脲基、及異氰酸基所組成之群中之至少一種官能基之烴基，R&lt;sup&gt;y&lt;/sup&gt;表示烴基，R&lt;sup&gt;z&lt;/sup&gt;分別獨立地表示氫原子、或烴基)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photosensitive colored resin composition comprising a lake color material, a dispersant, an alkali soluble resin, a photopolymerizable compound, a photoinitiator, a solvent and a compound represented by the following general formula (A): &lt;br/&gt;General Formula (A) &lt;br/&gt;R&lt;sup&gt;x&lt;/sup&gt;R&lt;sup&gt;y&lt;/sup&gt;Si(OR&lt;sup&gt;z&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;&lt;br/&gt;(where R&lt;sup&gt;x&lt;/sup&gt; represents a hydrocarbon group containing at least one functional group selected from the group consisting of a (meth)acryloyloxy group, a vinyl group, an epoxy group, an amino group, a mercapto group, a ureido group and an isocyanate group; R&lt;sup&gt;y&lt;/sup&gt; represents a hydrocarbon group; and each R&lt;sup&gt;z&lt;/sup&gt; independently represents a hydrogen atom or a hydrocarbon group.)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1671" publication-number="202627089"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627089.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調節PLP1之化合物及方法</chinese-title>  
        <english-title>COMPOUNDS AND METHODS FOR MODULATING PLP1</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/7088</further-classification>  
        <further-classification edition="200601120260401B">A61K31/712</further-classification>  
        <further-classification edition="200601120260401B">A61K31/7125</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＩＯＮＩＳ製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IONIS PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包爾斯　貝瑞特　伊麗莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERS, BERIT ELISSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗瑞爾　蘇珊　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREIER, SUSAN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比伊　賀恩　荷亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUI, HUYNH-HOA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里格　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGO, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於減少細胞或個體中之PLP1 RNA之量或活性且在某些情況下減少細胞或個體中之蛋白脂質蛋白1之量的化合物、方法及醫藥組合物。此等化合物、方法及醫藥組合物可用於改善腦白質失養症之至少一種症狀或標誌。此等症狀及標誌包括低張症、眼球震顫、視神經萎縮、呼吸窘迫、運動遲滯、認知功能障礙、言語功能障礙、痙攣、共濟失調、癲癇發作、舞蹈病樣舉動及死亡。此等腦白質失養症包括佩利措伊斯-梅茨巴赫病(Pelizaeus-Merzbacher disease)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are compounds, methods, and pharmaceutical compositions for reducing the amount or activity of PLP1 RNA in a cell or subject, and in certain instances reducing the amount of proteolipid protein 1 in a cell or subject. Such compounds, methods, and pharmaceutical compositions are useful to ameliorate at least one symptom or hallmark of a leukodystrophy. Such symptoms and hallmarks include hypotonia, nystagmus, optic atrophy, respiratory distress, motor delays, cognitive dysfunction, speech dysfunction, spasticity, ataxia, seizures, choreiform movements, and death. Such leukodystrophies include Pelizaeus-Merzbacher disease.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1672" publication-number="202627592"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627592.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統及相機模組</chinese-title>  
        <english-title>OPTICAL SYSTEM AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G02B9/64</main-classification>  
        <further-classification edition="200601120260318B">G02B15/14</further-classification>  
        <further-classification edition="200601120260318B">G02B13/00</further-classification>  
        <further-classification edition="200601120260318B">G02B1/04</further-classification>  
        <further-classification edition="200601120260318B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尙勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施例中所揭露之光學系統包括：一第一透鏡群組，其具有安置於一第一光軸上且具有一正(+)折射力之一第一透鏡；第二透鏡群組至第四透鏡群組，其具有在不同於該第一光軸之一第二光軸上依序序列對準之複數個透鏡；以及一反射部件構件，其安置於該第一透鏡群組與該第二透鏡群組之間，其中該第一透鏡具有該第一透鏡群組至該第四透鏡群組之該等透鏡之中心厚度之中當中之一最厚中心厚度，該第一透鏡之一物體側表面具有一凸形形狀，該第一透鏡之一有效長度大於該第二透鏡群組至該第四透鏡群組之該等透鏡之有效長度，且該第一透鏡之焦距之一絕對值可大於該第二透鏡群組至該第四透鏡群組之該等透鏡之焦距之一絕對值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The optical system disclosed in the embodiment of the invention: a first lens group having a first lens disposed on a first optical axis and having a positive (+) refractive power; second to fourth lens groups having a plurality of lenses sequentially aligned on a second optical axis different from the first optical axis; and a reflective member disposed between the first lens group and the second lens group, wherein the first lens has a thickest center thickness among the center thicknesses of the lenses of the first to fourth lens groups, an object-side surface of the first lens has a convex shape, an effective length of the first lens is greater than the effective lengths of the lenses of the second to fourth lens groups, and an absolute value of the focal length of the first lens may be greater than an absolute value of the focal lengths of the lenses of the second to fourth lens groups.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學系統</p>  
        <p type="p">111:第一透鏡</p>  
        <p type="p">112:第二透鏡</p>  
        <p type="p">113:第三透鏡</p>  
        <p type="p">114:第四透鏡</p>  
        <p type="p">115:第五透鏡</p>  
        <p type="p">116:第六透鏡</p>  
        <p type="p">117:第七透鏡</p>  
        <p type="p">118:透鏡/第八透鏡</p>  
        <p type="p">190:影像感測器</p>  
        <p type="p">192:光學濾波器</p>  
        <p type="p">BFL:光軸距離/中心距離</p>  
        <p type="p">CG4:中心距離</p>  
        <p type="p">CG6:光軸距離</p>  
        <p type="p">CT1:中心厚度</p>  
        <p type="p">CT5:中心厚度</p>  
        <p type="p">CT6:中心厚度</p>  
        <p type="p">CT7:中心厚度</p>  
        <p type="p">LG1:透鏡群組/第一透鏡群組</p>  
        <p type="p">LG2:透鏡群組/可移動透鏡群組/第二透鏡群組</p>  
        <p type="p">LG3:透鏡群組/第三透鏡群組/可移動透鏡群組</p>  
        <p type="p">LG4:第四透鏡群組/透鏡群組</p>  
        <p type="p">MG1:第一光軸距離/中心距離</p>  
        <p type="p">MG2:第二光軸距離/中心距離/距離</p>  
        <p type="p">ImgH:長度</p>  
        <p type="p">OA1:光軸/第一光軸</p>  
        <p type="p">OA2:光軸/第二光軸</p>  
        <p type="p">P1:反射部件</p>  
        <p type="p">PR1:反射表面</p>  
        <p type="p">PS1:入射表面</p>  
        <p type="p">PS2:出射表面</p>  
        <p type="p">S1:透鏡表面/第一表面/物體側表面</p>  
        <p type="p">S2:透鏡表面/感測器側第二表面/第二表面</p>  
        <p type="p">S3:透鏡表面/第三表面</p>  
        <p type="p">S4:透鏡表面/第四表面</p>  
        <p type="p">S5:透鏡表面/第五表面</p>  
        <p type="p">S6:透鏡表面/第六表面</p>  
        <p type="p">S7:透鏡表面/物體側第七表面/第七表面</p>  
        <p type="p">S8:透鏡表面/感測器側第八表面/第八表面</p>  
        <p type="p">S9:透鏡表面/第九表面</p>  
        <p type="p">S10:透鏡表面/第十表面</p>  
        <p type="p">S11:透鏡表面/第十一表面</p>  
        <p type="p">S12:透鏡表面/第十二表面</p>  
        <p type="p">S13:透鏡表面/第十三表面</p>  
        <p type="p">S14:透鏡表面/第十四表面</p>  
        <p type="p">S15:透鏡表面/第十五表面</p>  
        <p type="p">S16:感測器側表面/透鏡表面/第十六表面</p>  
        <p type="p">TD2:光軸距離</p>  
        <p type="p">TD3:光軸距離</p>  
        <p type="p">TD4:光軸距離</p>  
        <p type="p">TTL1:距離</p>  
        <p type="p">TTL2:距離</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1673" publication-number="202626377"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626377.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卡匣及卡匣的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B41J15/04</main-classification>  
        <further-classification edition="200601120260401B">B41J33/52</further-classification>  
        <further-classification edition="200601120260401B">B41J17/32</further-classification>  
        <further-classification edition="200601120260401B">B41J3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樫尾計算機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASIO COMPUTER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三井鄉史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本柳吉宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOYANAGI, YOSHIMUNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]&lt;br/&gt; 在介質從卡匣被搬送時抑制介質歪斜。&lt;br/&gt; [解決手段]&lt;br/&gt; 在將捲繞有捲筒狀帶狀介質的核心收容於內部的卡匣中，從卡匣的內側依序具備：核心、間隔件、彈性構件支承部、彈性構件、及構成卡匣的外表面之中的1個面，彈性構件係透過彈性構件支承部將核心朝介質的寬度方向按壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:卡匣</p>  
        <p type="p">11:基座構件</p>  
        <p type="p">11a:底面部</p>  
        <p type="p">11b:側面部</p>  
        <p type="p">11c:嵌合孔</p>  
        <p type="p">12:蓋部</p>  
        <p type="p">12a:上表面部</p>  
        <p type="p">12b:嵌合突起</p>  
        <p type="p">12c,12d,12e:插入孔</p>  
        <p type="p">13:收納空間</p>  
        <p type="p">14:凹部</p>  
        <p type="p">15:第1通過口</p>  
        <p type="p">16:第2通過口</p>  
        <p type="p">17:帶狀材導件</p>  
        <p type="p">18:核心支持軸</p>  
        <p type="p">19:第1捲軸</p>  
        <p type="p">20:第2捲軸</p>  
        <p type="p">20a:中心孔</p>  
        <p type="p">21:核心</p>  
        <p type="p">21a:外筒</p>  
        <p type="p">21b:內筒</p>  
        <p type="p">21c:連接部</p>  
        <p type="p">21d:間隙</p>  
        <p type="p">21e:中心孔</p>  
        <p type="p">22:帶捲</p>  
        <p type="p">23:保持薄片</p>  
        <p type="p">23a:中央開口</p>  
        <p type="p">24:保持薄片</p>  
        <p type="p">24a:中央開口</p>  
        <p type="p">25:薄膜片材</p>  
        <p type="p">25a:中央開口</p>  
        <p type="p">26:環形彈簧</p>  
        <p type="p">26a:中央開口</p>  
        <p type="p">26b:突出區域</p>  
        <p type="p">26c:支持區域</p>  
        <p type="p">T:帶狀材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1674" publication-number="202626094"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626094.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134067</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有IL-31拮抗劑作為有效成分之異位性皮膚炎的預防用及/或治療用醫藥組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K39/395</main-classification>  
        <further-classification edition="200601120260324B">C07K16/24</further-classification>  
        <further-classification edition="200601120260324B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中外製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子晃久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, AKIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩柳有起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAYANAGI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村秀智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, HIDETOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋口義信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGUCHI, YOSHINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下浩明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三原良介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIHARA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本裕美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, YUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤智久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TOMOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣川恵子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROKAWA, KEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於一非限定的實施態樣，提供一種含有IL-31拮抗劑作為有效成分之異位性皮膚炎的預防用及/或治療用醫藥組合物，前述IL-31拮抗劑係以0.1mg~1000mg/body/1日~12週，較佳為0.1mg~1000mg/body/2週、0.1mg~1000mg/body/4週、或0.1mg~1000mg/body/8週，對於罹患異位性皮膚炎、或有罹患異位性皮膚炎之風險之對象以等量且相同投予間隔重複投予。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1675" publication-number="202626898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J5/24</main-classification>  
        <further-classification edition="200601120260401B">C08K7/14</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">B32B15/08</further-classification>  
        <further-classification edition="200601120260401B">B32B27/20</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本克哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田悠仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMATA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, AMANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林宇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供預浸體、以及覆金屬箔疊層板、印刷配線板、及半導體裝置。本發明之預浸體，為一種預浸體，具有：樹脂組成物及/或樹脂組成物的半硬化物、及玻璃布；樹脂組成物含有熱硬化性化合物，玻璃布依據JIS C218：2007利用空腔諧振器擾動法測得的於頻率10GHz之介電常數為4.4以下，玻璃布中之SiO&lt;sub&gt;2&lt;/sub&gt;的比例為61~85質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1676" publication-number="202627505"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627505.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理電子元件的處理機及用於裝載電子元件的托盤</chinese-title>  
        <english-title>HANDLER FOR PROCESSING ELECTRONIC COMPONENTS AND TRAY FOR LOADING ELECTRONIC COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G01R31/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於處理電子元件的處理機。依據本發明，包括：第一處理單元，操縱憑藉黏合方式保持電子元件的第一裝載器；第二處理單元，操縱以安置於裝載槽的方式保持電子元件的第二裝載器；及，移動機械手，把第一裝載器上的電子元件移動到第二裝載器。依據本發明，能節約測試電子元件的整體系統時需要的設立成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:環托盤</p>  
        <p type="p">21:裝載板</p>  
        <p type="p">21a:裝載槽</p>  
        <p type="p">21b:安裝槽</p>  
        <p type="p">21c:退避槽</p>  
        <p type="p">22:支撐架</p>  
        <p type="p">22a:外緣肋</p>  
        <p type="p">24:固定器</p>  
        <p type="p">F:固定工具</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1677" publication-number="202626639"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626639.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半胱天冬酶—４抑制劑及其用途</chinese-title>  
        <english-title>CASPASE-4 INHIBITORS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D471/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凡特斯治療美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENTUS THERAPEUTICS U.S., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝魯布　瑪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERUBE, MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝弗里奇　拉姆齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEVERIDGE, RAMSAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西布拉　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIBLAT, STEPHANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西爾　派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYR, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多里奇　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DORICH, STEPHANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉爾　薩穆爾　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILL, SAMUEL C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉蒙東　薩穆爾　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLAMONDON, SAMUEL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聖　昂吉　米格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ST-ONGE, MIGUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾卡耶姆　伊萊德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELKAYAM,ELAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案係關於式(&lt;b&gt;I&lt;/b&gt;)化合物及其醫藥學上可接受之鹽， &lt;br/&gt;&lt;img align="absmiddle" height="166px" width="310px" file="ed11292.JPG" alt="ed11292.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ， &lt;br/&gt;其中環A、G&lt;sub&gt;1&lt;/sub&gt;、R&lt;sup&gt;C&lt;/sup&gt;、X、R&lt;sup&gt;D1&lt;/sup&gt;、R&lt;sup&gt;D2&lt;/sup&gt;及R&lt;sup&gt;D3&lt;/sup&gt;係如本文所闡述；製備方法及可用於該製備之中間體；治療及預防方法(例如治療及預防半胱天冬酶-4介導之疾病及病症之方法)；以及包含該等物質之醫藥組合物。式(&lt;b&gt;I&lt;/b&gt;)化合物及其醫藥學上可接受之鹽經設計為選擇性半胱天冬酶-4別位抑制劑，對半胱天冬酶-1無影響，且亦已發現對半胱天冬酶-5具有選擇性，且因此在實施例中，視為雙重半胱天冬酶-4/5抑制劑。本揭示案進一步係關於申請人對新的且為別位之人類半胱天冬酶-4結合口袋之發現；及與該結合口袋結合之方法(及抑制其活性之化合物)；治療及預防方法；以及包含此類化合物之醫藥組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to compounds of Formula (&lt;b&gt;I&lt;/b&gt;): &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="303px" file="ed11293.JPG" alt="ed11293.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;and pharmaceutically acceptable salts thereof, wherein Ring A, G1, R&lt;sup&gt;C&lt;/sup&gt;, X, R&lt;sup&gt;D1&lt;/sup&gt;, R&lt;sup&gt;D2&lt;/sup&gt;, and R&lt;sup&gt;D3&lt;/sup&gt; are as described herein, methods of preparation and intermediates useful in said preparation, methods of treatment and prevention (&lt;i&gt;e.g.&lt;/i&gt;, of Caspase-4 mediated diseases and disorders), and pharmaceutical compositions comprising same. Compounds of Formula (&lt;b&gt;I&lt;/b&gt;), and pharmaceutically acceptable salts thereof, are designed as selective Caspase-4 allosteric inhibitors, sparing Caspase-1, and have also been found to be selective against Caspase-5 and are thus, in embodiments, considered dual Caspase-4/5- &lt;br/&gt;inhibitors. The present disclosure further relates to the Applicant's discovery of a new and allosteric human Caspase-4 binding pocket, and methods of binding to (and compounds inhibiting the activity of) same, methods of treatment and prevention, and pharmaceutical compositions comprising such compounds.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1678" publication-number="202626130"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626130.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高通量精細液滴霧化器</chinese-title>  
        <english-title>HIGH-THROUGHPUT FINE-DROPLET NEBULIZER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">A61M16/14</main-classification>  
        <further-classification edition="200601120260318B">A61M11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＴＳＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓　熙疇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, HEE-SIEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯克蘭　奈森　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIRKELAND, NATHAN T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法默　肯尼斯　畢奧　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARMER, KENNETH (BEAU) R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在各種實施例中，所揭示標的係一種霧化器裝置，其具有：一氣體入口埠耦合件，其用於接收一經壓縮氣體；一液體入口埠，其用於接收含有用於產生氣溶膠粒子之一源之一液體；一第一級霧化器，其在該氣體入口埠之下游氣動耦合，該第一級霧化器具有一第一級孔口，該第一級孔口經定位於該液體入口埠之上游；一第二級霧化器，其在該第一級霧化器及該液體入口埠之下游氣動耦合，該第二級霧化器具有一第二級孔口；一氣溶膠出口埠，其在該第二級霧化器之下游氣動耦合；及一過量液體出口，其在該第二級霧化器及該氣溶膠出口埠之下游氣動耦合。揭示其他裝置及系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In various embodiments, the disclosed subject-matter is a nebulizer device having a gas-inlet port coupling to receive a compressed gas; a liquid-inlet port to receive a liquid containing a source to produce aerosol particles; a first-stage nebulizer, pneumatically coupled downstream of the gas-inlet port, the first-stage nebulizer having a first-stage orifice, the first-stage orifice located upstream from the liquid-inlet port; a second-stage nebulizer, pneumatically coupled downstream of the first-stage nebulizer and the liquid-inlet port, the second-stage nebulizer having a second-stage orifice; an aerosol-outlet port, pneumatically coupled downstream of the second-stage nebulizer; and an excess-liquid outlet, pneumatically coupled downstream of the second-stage nebulizer and the aerosol-outlet port. Other devices and systems are disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:氣體入口流噴流</p>  
        <p type="p">205:第一部分</p>  
        <p type="p">207:第二部分</p>  
        <p type="p">209:第三部分</p>  
        <p type="p">210:高效霧化器</p>  
        <p type="p">217:第一級孔口</p>  
        <p type="p">223:第二級孔口</p>  
        <p type="p">227:排放孔口</p>  
        <p type="p">229:過量液體出口流噴流</p>  
        <p type="p">230:側視圖</p>  
        <p type="p">231:補充流噴流</p>  
        <p type="p">233:補充流入口埠</p>  
        <p type="p">235:組合主要及補充流噴流</p>  
        <p type="p">237:氣溶膠出口埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1679" publication-number="202626623"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626623.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種調控PARP酶活性的化合物或其可藥用的鹽、其藥物組合物及其用途</chinese-title>  
        <english-title>A COMPOUND FOF REGULATING ACTIVITY OF PARP ENZYME, OR A PHARMACEUTICALLY ACCEPATBLE SALT THEREOF, A PHARMACEUTICAL COMPOSITION THEREFOR, AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/14</main-classification>  
        <further-classification edition="200601120260401B">C07D401/04</further-classification>  
        <further-classification edition="200601120260401B">C07D405/04</further-classification>  
        <further-classification edition="200601120260401B">C07D409/04</further-classification>  
        <further-classification edition="200601120260401B">C07D409/14</further-classification>  
        <further-classification edition="200601120260401B">C07D405/14</further-classification>  
        <further-classification edition="200601120260401B">C07D471/04</further-classification>  
        <further-classification edition="200601120260401B">A61K31/517</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川普銳特藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽　安樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ANLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余攀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何權鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, QUANHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李澤睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZERUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒廉鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, LIANXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊有</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周李波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, LIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣鴻偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, HONGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金松楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SONGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張德偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DEWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝雙翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, SHUANGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向籽熹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG, ZIXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜書文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, SHUWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　震宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇忠海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, ZHONGHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種調控PARP酶活性的式（I）所示的化合物、製備方法及其用途。具體而言，所述化合物涉及可用作藥物的調控PARP14酶活性的化合物、及其藥理上可接受的鹽、含有所述化合物或其鹽的組合物及其用於製備藥物用途，屬於醫藥化學領域。 &lt;br/&gt;&lt;img align="absmiddle" height="195px" width="384px" file="ed10619.JPG" alt="ed10619.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; </p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a compound represented by fomula (I) for regulating activity of PARP enzyme，a preparation method thereof，and a use thereof. More precisely, the compound as mentioned relates to a compound, a pharmaceutically acceptable salt thereof, a composition comprising the compound or the salt which can be used as a medicament for regulating activity of PARP14 enzyme, and use thereof in preparing a medicament, which belong to the filed of pharmaceutical chemistry. &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="384px" file="ed10620.JPG" alt="ed10620.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1680" publication-number="202627288"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627288.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134102</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於壓縮機的多主體轉子</chinese-title>  
        <english-title>MULTI BODY ROTOR FOR A COMPRESSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">F01D15/10</main-classification>  
        <further-classification edition="200601120260324B">F04D17/10</further-classification>  
        <further-classification edition="200601120260324B">F04D25/06</further-classification>  
        <further-classification edition="200601120260324B">F04D29/02</further-classification>  
        <further-classification edition="200601120260324B">H02K1/02</further-classification>  
        <further-classification edition="200601120260324B">H02K1/22</further-classification>  
        <further-classification edition="202201120260324B">H02K1/2706</further-classification>  
        <further-classification edition="200601120260324B">H02K1/28</further-classification>  
        <further-classification edition="200601120260324B">H02K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商亞特拉斯可波克氣動股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATLAS COPCO AIRPOWER, NAAMLOZE VENNOOTSCHAP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾黑延　史迪珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERHEYEN, STIJN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾哈根　肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERHAEGEN, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於壓縮機或膨脹機的轉子，該轉子由同軸連結在一起的多個部件組裝而成。轉子包括芯部部件(1)和端部部件，芯部部件(1)具有圓柱形套筒(3)和在套筒的端部處的端部帽(5)，端部部件具有中心同軸通路(7)。在安裝狀態下，轉子被配置成使得：端部帽與套筒軸向重疊，並且設置有中心同軸突起(11)，中心同軸突起(11)在通路中在徑向方向上相配合地相對於套筒沿軸向向外延伸，端部部件在其抵接芯部部件的側部上，設置有第一環形凹部(9)，第一環形凹部(9)徑向延伸到通路，並且突起在其外圓周處設置有第二環形凹部(10)，第二環形凹部在軸向方向上與端部部件部分地重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a rotor for compressors or expanders assembled from multiple parts that are coaxially joined together. The rotor comprises a core part (1) with a cylindrical sleeve (3) and end caps (5) at the ends of the sleeve, and end parts having a central coaxial passage (7). In mounted condition the rotor is configured such that:&lt;br/&gt; the end cap axially overlaps with the sleeve and is provided with a central coaxial protrusion (11) extending axially outwards of the sleeve fittingly in radial direction in the passage,&lt;br/&gt; the end part is at its side abutting the core part provided with a first annular recess (9) radially extending to the passage, and &lt;br/&gt; the protrusion is at its outer circumference provided with a second annular recess (10) which in axial direction partially overlaps with the end part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:芯部部件</p>  
        <p type="p">2:端部部件</p>  
        <p type="p">3:圓柱形套筒</p>  
        <p type="p">4:永磁體</p>  
        <p type="p">5:端部帽</p>  
        <p type="p">6:葉輪</p>  
        <p type="p">7:軸向中心通路</p>  
        <p type="p">14:緊螺栓/張力緊固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1681" publication-number="202626378"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626378.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於輻條輪的氣動力輻條，特別是用於自行車</chinese-title>  
        <english-title>AERODYNAMIC SPOKE FOR SPOKED WHEELS, IN PARTICULAR FOR BICYCLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B60B1/00</main-classification>  
        <further-classification edition="200601120260318B">B60B1/02</further-classification>  
        <further-classification edition="200601120260318B">B60B5/02</further-classification>  
        <further-classification edition="200601120260318B">B60B21/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商亞爾皮納瑞吉股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPINA RAGGI S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡佩洛托　圭多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAPPELLOTTO, GUIDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於有輻條輪的氣動輻條，特別是用於自行車，包括：一主幹，其在一主要方向上延長；以及一裝置，其在該主幹的表面上用於降低該輻條的空氣動力阻力。用於降低阻力的該裝置包括在該主幹的表面之至少一部分上的複數個起伏，該複數個起伏具有與該主要方向成橫向地延伸之脊部及谷部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aerodynamic spoke for spoked wheels, in particular for bicycles, comprises a stem elongated in a dominant direction and means on the surface of said stem for reducing the aerodynamic resistance of the spoke. Said means for reducing the resistance comprises a plurality of undulations on at least a portion of the surface of said stem, with ridges and valleys extended transversely to said dominant direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1682" publication-number="202627339"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627339.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘門及狹縫閥</chinese-title>  
        <english-title>GATE AND SLIT VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">F16K51/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＭＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMORI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">閘門(28)，具有：由金屬材料一體成形的閘門本體(42)、位於閘門本體(42)之寬度方向的中央且安裝有軸(38)的軸安裝孔(60)、形成在軸安裝孔(60)與密封面(46)之間且往寬度方向延伸的狹縫孔(58)、構成閘門本體(42)之前後方向之後部的後面(56)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gate (28) includes: a gate body (42) integrally formed of a metal material; a shaft attachment hole (60) formed at a center of the gate body (42) in a width direction to engage a shaft (38); a slit (58) extending in the width direction between the shaft attachment hole (60) and a sealing surface (46); and a rear surface (56) forming a rear part of the gate body (42) in a front-rear direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">28:閘門</p>  
        <p type="p">42:閘門本體</p>  
        <p type="p">44:密封構件</p>  
        <p type="p">46:密封面</p>  
        <p type="p">48:上端面</p>  
        <p type="p">50:下端面</p>  
        <p type="p">52:第1側端部</p>  
        <p type="p">54:第2側端部</p>  
        <p type="p">56:後面</p>  
        <p type="p">58:狹縫孔</p>  
        <p type="p">60:軸安裝孔</p>  
        <p type="p">62:締結孔</p>  
        <p type="p">64:密封槽</p>  
        <p type="p">66A:第1倒角部</p>  
        <p type="p">66B:第2倒角部</p>  
        <p type="p">66C:第3倒角部</p>  
        <p type="p">66D:第4倒角部</p>  
        <p type="p">78:軸安裝部</p>  
        <p type="p">92:上端壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1683" publication-number="202627090"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627090.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制素次單元βＥ相關之雙股寡核苷酸組合物及其相關方法</chinese-title>  
        <english-title>INHIBIN SUBUNIT BETA E-RELATED DOUBLE STRANDED OLIGONUCLEOTIDE COMPOSITIONS AND METHODS RELATING THERETO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">C07H21/00</further-classification>  
        <further-classification edition="200601120260401B">A61K31/7125</further-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商波濤生命科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAVE LIFE SCIENCES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　秀瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HSIU-CHIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦吉斯　錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VARGEESE, CHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩本直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAMOTO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸　科諾丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUU, KHOA NGOC DANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬拉帕　薩瑞曼尼恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARAPPAN, SUBRAMANIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本　智美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, TOMOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪堤納　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMATTINA, ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐文　阿德瑞娜　盧爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OWEN, ADRIANA LOURDES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯恩　邁克　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYRNE, MICHAEL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎德薩米　帕查穆索</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDASAMY, PACHAMUTHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　庫迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, KULDEEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古斯　阿南米塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, ANAMITRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古斯　迪曼克奇納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, DHIMANKRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海格勒　約瑟夫　安德魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAEGELE, JOSEPH ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供靶向人類抑制素次單元βE (INHBE)基因之雙股寡核苷酸、組合物，及其單獨或與額外治療劑組合使用以用於預防及/或治療各種INHBE相關病症的方法，包括維持所實現之體重減輕。在一些實施例中，所提供之雙股寡核苷酸包含某些化學修飾，例如立體特異性核苷酸間鍵聯修飾，且具有出人意料的有利特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides human inhibin subunit beta E (INHBE) gene-targeting double stranded oligonucleotides, compositions, and methods of using the same, either alone or in combination with additional therapeutics, for preventing and/or treating various INHBE-related disorders, including maintenance of weight loss achieved. In some embodiments, the provided double stranded oligonucleotides comprise certain chemistry modifications, e.g., stereospecific internucleotidic linkage modifications, and have unexpected advantageous properties.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1684" publication-number="202627614"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627614.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G02B27/02</main-classification>  
        <further-classification edition="200601120260323B">A61B3/113</further-classification>  
        <further-classification edition="200601120260323B">H04N5/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村太紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田寿雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, HISAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>初見亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATSUMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村有孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, TOMOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塚本洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKAMOTO, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種容易得到正確的視線資訊的電子裝置。該電子裝置包括顯示裝置、反射折射光學系統及發射紅外光的光源，顯示裝置在像素內包括發光元件及受光元件。反射折射光學系統形成眼睛表面-受光元件間以及發光元件-視網膜間的不同的兩個光路。在發光元件-視網膜間使用可見光，在眼睛表面-受光元件間使用紅外光。此外，將與光路無關的一個波長的光透過的半反射鏡用於各光路。由此，可以調整各光路的焦點距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:顯示面板</p>  
        <p type="p">21:像素</p>  
        <p type="p">22:子像素</p>  
        <p type="p">23:子像素</p>  
        <p type="p">30:反射折射光學系統</p>  
        <p type="p">33:半反射鏡</p>  
        <p type="p">34:半反射鏡</p>  
        <p type="p">36:反射偏光板</p>  
        <p type="p">40:眼睛</p>  
        <p type="p">41:視網膜</p>  
        <p type="p">42:瞳</p>  
        <p type="p">57:光軸</p>  
        <p type="p">80:光源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1685" publication-number="202628623"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628623.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260323B">H10D30/47</main-classification>  
        <further-classification edition="202501120260323B">H10D30/01</further-classification>  
        <further-classification edition="202601120260323B">H10D62/00</further-classification>  
        <further-classification edition="202501120260323B">H10D62/10</further-classification>  
        <further-classification edition="202501120260323B">H10D62/60</further-classification>  
        <further-classification edition="202501120260323B">H10D62/824</further-classification>  
        <further-classification edition="202501120260323B">H10D62/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電工器件創新股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小栗裕之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGURI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種能夠提高良率之半導體裝置及半導體裝置之製造方法。 &lt;br/&gt;本發明之半導體裝置具有：基板，其具有第1面及與上述第1面相反之第2面；第1氮化物半導體層，其具有與上述第2面接觸之第3面及與上述第3面相反之第4面，且於上述第4面形成有凹部；以及第2氮化物半導體層，其設置於上述凹部；且於上述基板及上述第1氮化物半導體層形成有開口部，該開口部貫通上述基板及上述第1氮化物半導體層，到達上述第2氮化物半導體層，於上述第2氮化物半導體層具有底面，上述半導體裝置具有第1金屬層，該第1金屬層覆蓋上述第1面及上述開口部之內壁面且於上述底面接觸上述第2氮化物半導體層，上述第2氮化物半導體層以1.0×10&lt;sup&gt;18&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;以上之濃度含有雜質原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基板</p>  
        <p type="p">11A:第1面</p>  
        <p type="p">11B:第2面</p>  
        <p type="p">12:半導體層</p>  
        <p type="p">12C:第3面</p>  
        <p type="p">12D:第4面</p>  
        <p type="p">13D,13S:凹部</p>  
        <p type="p">21D,21S:半導體層</p>  
        <p type="p">22:閘極電極</p>  
        <p type="p">30D:汲極電極</p>  
        <p type="p">31D:Ni層</p>  
        <p type="p">32D:Au層</p>  
        <p type="p">50,61D,61G,61S,62D:開口部</p>  
        <p type="p">51:背面電極</p>  
        <p type="p">52D:汲極配線</p>  
        <p type="p">61,62,63:絕緣膜</p>  
        <p type="p">71:底面</p>  
        <p type="p">72:內壁面</p>  
        <p type="p">100:半導體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1686" publication-number="202625909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於改善胃腸健康之組成物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR IMPROVING GASTROINTESTINAL HEALTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260401B">A23L33/125</main-classification>  
        <further-classification edition="201601120260401B">A23L33/19</further-classification>  
        <further-classification edition="200601120260401B">A23C9/152</further-classification>  
        <further-classification edition="201601120260401B">A23L33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商雀巢製品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOCIETE DES PRODUITS NESTLE S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡文　尚　巴提斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAVIN, JEAN-BAPTISTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩巴提爾　瑪加莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SABATIER, MAGALIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑蘭吉　克萊兒　羅倫斯　路錫　瑪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOULANGE, CLAIRE LAURENCE LUCIE MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高丁　珍　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODIN, JEAN-PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯汀　史蒂凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRISTEN, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩溫斯卡　奧加</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKWINSKA, OLGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於在有需要的個體中治療及/或預防胃腸病症及/或改善消化舒適度的方法及組成物，該組成物包含有包含半乳寡糖(GOS)之低糖、低乳糖、基於乳之組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and compositions for treating and/or preventing gastrointestinal disorders and/or improving digestive comfort in an individual in need thereof, the composition comprising a low sugar, low lactose, milk-based composition comprising galactooligosaccharide (GOS).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1687" publication-number="202627263"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627263.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>再生紙及製造其之方法</chinese-title>  
        <english-title>RECYCLED PAPER AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">D21H13/08</main-classification>  
        <further-classification edition="200601120260320B">D21H17/63</further-classification>  
        <further-classification edition="200601120260320B">D21H21/30</further-classification>  
        <further-classification edition="200601120260320B">D21C5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安秀彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, SUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜淍植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JU-SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴真姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JIN-HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張有美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田敏較</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, MINGYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙顯埈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYUN JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡熙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, HEE IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於再生紙及其製備方法。該再生紙包含源自於一廢棄織物之再循環程序的再生纖維素。該再生紙具有耐久性、強度、色彩特性及類似者，使其可用於各種領域中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to recycled paper and a process for preparing the same. The recycled paper comprises recycled cellulose derived from the recycling process of a waste textile. The recycled paper has durability, strength, color characteristics, and the like, so that it can be used in various fields.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1688" publication-number="202626655"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626655.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＪＡＫ２之吡咯并嗒嗪抑制劑</chinese-title>  
        <english-title>PYRROLO-PYRIDAZINE INHIBITORS OF JAK2</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/14</main-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5383</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/538</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5025</further-classification>  
        <further-classification edition="200601120260401B">A61K31/506</further-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅捷可斯治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJAX THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬西　克雷格　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASSE, CRAIG E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許嘉翊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIAYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘納克達　帕尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHANAKOTA, PHANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪馬可　凱文　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEMARCO, KEVIN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾達　蘇桑塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALDAR, SUSANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡柏　艾里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOOPER, ALICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛肯　菲利浦　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERKEN,PHILIP A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑟里恩　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THERRIEN,ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供可用於抑制JAK2之吡咯并嗒嗪化合物及其組合物。在一些實施例中，本揭示案提供一種式I化合物： &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="225px" file="ed12985.JPG" alt="ed12985.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥學上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;如本文中單獨及組合的類別及亞類中所定義。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides pyrrolo-pyridazine compounds and compositions thereof useful for inhibiting JAK2. In some embodiments, the present disclosure provides a compound of formula I: &lt;br/&gt;&lt;img align="absmiddle" height="183px" width="239px" file="ed12986.JPG" alt="ed12986.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, and R&lt;sup&gt;4&lt;/sup&gt; are as defined in classes and subclasses herein, both singly and in combination.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1689" publication-number="202626938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物，以及使用該組成物之絕緣接著膜、積層基板、電子零件及半導體裝置</chinese-title>  
        <english-title>RESIN COMPOSITION, AND INSULATING ADHESIVE FILM, LAMINATED BASE PLATE, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08L53/02</main-classification>  
        <further-classification edition="200601120260323B">C08K5/3477</further-classification>  
        <further-classification edition="200601120260323B">C08L71/12</further-classification>  
        <further-classification edition="200601120260323B">C08L63/00</further-classification>  
        <further-classification edition="201801120260323B">C09J7/30</further-classification>  
        <further-classification edition="200601120260323B">B32B7/10</further-classification>  
        <further-classification edition="200601120260323B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇佐美遼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USAMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種樹脂組成物，其係具有優異之對電子基板或電子元件周邊之埋入性及B階段狀態之膜的裁切性。 &lt;br/&gt;本發明之解決課題之手段係一種樹脂組成物，其包含：(A)熱硬化性樹脂、(B)具有含1,2–乙烯基之丁二烯骨架之化合物、及(C)具有異三聚氰酸環結構，且在分子末端具有1或2個雙鍵之化合物；上述(B)成分之數量平均分子量為1000至10000，較佳係最低熔融黏度為500至5000，較佳係上述(B)成分為具有苯乙烯骨架之化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a resin composition that exhibits excellent embeddability around electronic boards or electronic components and excellent slittability of the film in the B-stage state. &lt;br/&gt;As a means for attaining the objective of the present invention is a resin composition comprising (A) thermosetting resin, (B) compounds containing a butadiene backbone with 1,2-vinyl groups, and (C) a compound having an isocyanurate ring and having 1 or 2 double bonds at the molecular ends; The number-average molecular weight of the above component (B) is 1000 to 10000, preferably with a minimum melt viscosity of 500 to 5000, and preferably the above component (B) is a compound having a styrene backbone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1690" publication-number="202626742"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626742.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＨＥＲ２結合性免疫球蛋白單可變結構域、包含其的構築體及它們的用途</chinese-title>  
        <english-title>HER2 BINDING IMMUNOGLOBULIN SINGLE VARIABLE DOMAINS, CONSTRUCTS COMPRISING THE SAME AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/32</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商艾伯霖克斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABLYNX NV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯赫　愛德華多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUCH, EDUARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉漢　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALLAHAN, MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾特斯　雷塔莫佐　維爾娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORTEZ-RETAMOZO, VIRNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德塔維涅　伊芙琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE TAVERNIER, EVELYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, PETER SUNGWHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑怡遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAO, LILI I-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范奧弗貝克　沃特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN OVERBEKE, WOUTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫特姆　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VINTEM, ANA PAULA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞克　艾列克謝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAK, ALEXEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了HER2結合性免疫球蛋白單可變結構域（ISVD）、包含這樣的HER2結合性ISVD的多肽、以及包含這樣的HER2結合性ISVD和Fc區的多肽構築體。本文進一步提供了編碼所述ISVD、多肽和多肽構築體的核酸以及產生該等ISVD、多肽和多肽構築體的載體、宿主和方法。此外，本文關於利用根據本文的ISVD、多肽或多肽構築體進行治療的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present technology provides HER2-binding immunoglobulin single variable domains (ISVDs), polypeptides comprising such HER2-binding ISVDs, and polypeptide constructs comprising such HER2-binding ISVDs and an Fc region. The present technology further provides nucleic acids encoding said ISVDs, polypeptides, and polypeptide constructs as well as vectors, hosts and methods to produce these ISVDs, polypeptides, and polypeptide constructs. Moreover, the present technology relates to methods of treatment making use of the ISVDs, polypeptides or polypeptide constructs according to the present technology.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1691" publication-number="202628893"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628893.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬運機器人提昇配置及其輸送方法</chinese-title>  
        <english-title>SUBSTRATE HANDLING ROBOT LIFTING ARRANGEMENT AND TRANSPORTING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P72/30</main-classification>  
        <further-classification edition="200601120260325B">B66C1/34</further-classification>  
        <further-classification edition="200601120260325B">B66C7/08</further-classification>  
        <further-classification edition="200601120260325B">B66C15/00</further-classification>  
        <further-classification edition="200601120260325B">B25J5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西瓦拉曼　森蒂爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIVARAMAN, SENTHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡部平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKABE, TAIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種機器人提昇配置。該機器人提昇配置包括一機器人提昇起重機，該機器人提昇起重機經組態以將一基板搬運機器人提昇至一升高位置。該機器人提昇配置亦包括一軌道區段，該軌道區段可自平台上之一腔室延伸至一外部區域。機器人提昇起重機可將該機器人自該腔室提昇且沿著該軌道將其輸送至該外部區域以用於維修/維護，或將該機器人自該外部區域提昇且沿著該軌道將其輸送回至該腔室以用於安裝至該腔室中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A robot lifting arrangement is provided. The robot lifting arrangement includes a robot lifting crane that is configured to lift a substrate handling robot to an elevated position. The robot lifting arrangement also includes a track section that may extend from a chamber on the platform to an external area. Robot lifting crane may lift the robot from the chamber and transport it along the track to the external area for repair/maintenance or lift the robot from the external area and transport it along the track back to the chamber for installation into the chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:機器人提昇系統</p>  
        <p type="p">110:服務平台</p>  
        <p type="p">110-1:第二服務平台區域</p>  
        <p type="p">110-2:第一服務平台區域</p>  
        <p type="p">122:基板搬運腔室</p>  
        <p type="p">124:基板搬運腔室</p>  
        <p type="p">200:軌道</p>  
        <p type="p">300:基板搬運機器人</p>  
        <p type="p">500:機器人提昇起重機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1692" publication-number="202627274"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627274.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134217</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模組化梯系統、其部署方法以及防墜落系統</chinese-title>  
        <english-title>MODULAR LADDER SYSTEMS, METHODS OF DEPLOYING THE SAME AND FALL PREVENTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">E04G1/30</main-classification>  
        <further-classification edition="200601120260319B">E04G1/24</further-classification>  
        <further-classification edition="200601120260319B">E04G5/14</further-classification>  
        <further-classification edition="200601120260319B">E06C1/39</further-classification>  
        <further-classification edition="200601120260319B">E06C1/397</further-classification>  
        <further-classification edition="200601120260319B">E06C7/16</further-classification>  
        <further-classification edition="200601120260319B">E06C7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西瓦拉曼　森蒂爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIVARAMAN, SENTHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種模組化梯系統。該模組化梯系統包括一豎直梯總成，該豎直梯總成包括：一豎直支撐件，其具有經組態以與平台之一第一區段對接的一梯橋固定座；及一成角度梯。該豎直支撐件亦可包括一或多個可調適部分，該一或多個可調適部分經組態以根據處理模組之一形狀提供一防墜落屏障。該可調適部分可為一可摺疊鉸接台階蓋，該可摺疊鉸接台階蓋與該平台之一第二區段或一或多個護軌耦接，該一或多個護軌在一收起位置中擱置於該梯橋固定座下方且與該梯橋固定座耦接。此外，該豎直支撐件及該成角度梯可為可拆卸的。該成角度梯可包括一延伸板，該延伸板在該梯系統之梯橋固定座與一回旋式閘之間提供一橋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A modular ladder system is provided. The modular ladder system includes a vertical ladder assembly including a vertical support with a ladder bridge mount that is configured to dock with a first section of the platform and an angled ladder. The vertical support may also include one or more adaptable parts that is configured to provide a fall prevention barrier according to a shape of the process module. The adaptable part may be a foldable hinged step cover that couples with a second section of the platform or one or more guard rails that rest below the ladder bridge mount in a stowed position and is coupled with the ladder bridge mount. Further, the vertical support and the angled ladder may be detachable. The angled ladder may include an extension plate that provides a bridge between ladder bridge mount and a swing gate of the ladder system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:模組化梯系統</p>  
        <p type="p">110:回旋式閘</p>  
        <p type="p">112:第一側把手</p>  
        <p type="p">114-1:附接延伸部</p>  
        <p type="p">114-2:附接延伸部</p>  
        <p type="p">116:第二側把手</p>  
        <p type="p">120:梯區段</p>  
        <p type="p">122:台階</p>  
        <p type="p">130:基架</p>  
        <p type="p">132:後梯頂表面</p>  
        <p type="p">136:後支腿(支腿)</p>  
        <p type="p">140-2:支腿</p>  
        <p type="p">142:第一側表面(側)</p>  
        <p type="p">150:梯橋固定座</p>  
        <p type="p">152:頂表面</p>  
        <p type="p">250:可調適部分/台階蓋</p>  
        <p type="p">350:左側護軌</p>  
        <p type="p">410:豎直支撐件</p>  
        <p type="p">420:成角度梯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1693" publication-number="202627252"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627252.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳纖維束、其製造方法、碳纖預浸帶(towpreg)、積層體、碳纖維強化複合材料、旋轉電機保護環及旋轉電機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260322B">D01F9/22</main-classification>  
        <further-classification edition="200601120260322B">B29B11/16</further-classification>  
        <further-classification edition="200601120260322B">D01F6/18</further-classification>  
        <further-classification edition="200601120260322B">C08J5/04</further-classification>  
        <further-classification edition="200601120260322B">B29B15/14</further-classification>  
        <further-classification edition="200601120260322B">B29B15/08</further-classification>  
        <further-classification edition="200601120260322B">D06M15/55</further-classification>  
        <further-classification edition="200601320260322B">D06M101/40</further-classification>  
        <further-classification edition="200601320260322B">B29K105/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仙田貴滉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENDA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中文彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, FUMIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細川直史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOKAWA, NAOFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供在對含浸了基質樹脂之碳纖維束賦予高張力並同時穩定地積層為環狀時具有所必要之高束強度，且厚度較薄、厚度之變異係數較小的碳纖維束及其製造方法；本發明之碳纖維束係於測試長度500 mm之碳纖維束中，束強度為1.8~3.0 GPa、束強度之韋伯(Weibull)形狀係數為14~30；厚度為0.05~0.11 mm，厚度之變異係數為7.0%以下，實質上無撚。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:筒管</p>  
        <p type="p">2:驅動輥</p>  
        <p type="p">3:軋輥</p>  
        <p type="p">4:接觸輥</p>  
        <p type="p">5:芯</p>  
        <p type="p">6:積層體</p>  
        <p type="p">7:芯之旋轉方向</p>  
        <p type="p">8:軋輥與接觸輥間之路徑距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1694" publication-number="202627055"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627055.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械研磨後洗淨組合物及化學機械研磨後洗淨方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C11D1/00</main-classification>  
        <further-classification edition="200601120260401B">C11D3/12</further-classification>  
        <further-classification edition="200601120260401B">C11D3/20</further-classification>  
        <further-classification edition="202601120260401B">H10P52/40</further-classification>  
        <further-classification edition="202601120260401B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅野晴香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASANO, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠更有效率地減少研磨後之研磨對象物之表面殘留之鈰的化學機械研磨後洗淨組合物及化學機械研磨後洗淨方法。 &lt;br/&gt;本發明係關於一種化學機械研磨後洗淨組合物，其係用於藉由包含鈰化合物作為研磨粒之研磨用組合物實施了化學機械研磨(CMP)之研磨對象物即研磨後之研磨對象物之洗淨者，且含有二氧化矽及水溶性高分子。又，二氧化矽之濃度為0.5質量%以上10質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1695" publication-number="202628372"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628372.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>延長頂部LF　RF產生器之脈衝的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR EXTENDING PULSING OF A TOP LF RF GENERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">H03L7/00</main-classification>  
        <further-classification edition="200601120260320B">H03K5/00</further-classification>  
        <further-classification edition="200601120260320B">H05H1/00</further-classification>  
        <further-classification edition="200601120260320B">H01J37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智　賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪瑞卡塔諾　艾力西　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARAKHTANOV, ALEXEI M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥基　尼爾　馬卡拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACKIE, NEIL MACARAEG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　台昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAESEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炟聲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DASHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍藍德　約翰　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLAND, JOHN P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>露千西　肯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCCHESI, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於脈衝頂部低頻(LF)射頻(RF)產生器的系統。該系統包括主LF RF產生器，其產生第一RF訊號並耦接至電漿腔室之下電極。頂部LF RF產生器產生第二RF訊號並耦接至電漿腔室之頂部電極。該系統包括波形控制器，其耦接至主LF RF產生器及頂部LF RF產生器。波形控制器接收第一RF訊號的脈衝重複率及第一工作週期，控制頂部LF RF產生器，以將該脈衝重複率施加至第二RF訊號，並控制頂部LF RF產生器，使其具有大於第一工作週期之第二工作週期。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for pulsing a top low frequency (LF) radio frequency (RF) generator is described. The system includes a main LF RF generator that generates a first RF signal and is coupled to a lower electrode of a plasma chamber. The top LF RF generator generates a second RF signal and is coupled to a top electrode of the plasma chamber. The system includes a waveform controller coupled to the main LF RF generator and the top LF RF generator. The waveform controller receives a pulse repetition rate and a first duty cycle of the first RF signal, controls the top LF RF generator to apply the pulse repetition rate to the second RF signal, and controls the top LF RF generator to have a second duty cycle that is greater than the first duty cycle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:波形控制器</p>  
        <p type="p">104:主電腦</p>  
        <p type="p">105:傳輸纜線</p>  
        <p type="p">106:主低頻(LF)射頻(RF)產生器、主LF RFG</p>  
        <p type="p">108:主匹配器</p>  
        <p type="p">110:電漿腔室</p>  
        <p type="p">112:頂部低頻(LF)射頻(RF)產生器、頂部LF RFG</p>  
        <p type="p">114:高頻(HF)射頻(RF)產生器、HF RFG</p>  
        <p type="p">116:頂部匹配器</p>  
        <p type="p">118:處理器</p>  
        <p type="p">120:記憶體裝置</p>  
        <p type="p">122:基板支撐件</p>  
        <p type="p">124:上電極</p>  
        <p type="p">126:上電極延伸部</p>  
        <p type="p">128:絕緣環</p>  
        <p type="p">130:傳輸纜線</p>  
        <p type="p">132:傳輸纜線</p>  
        <p type="p">134:射頻(RF)纜線</p>  
        <p type="p">136:輸入</p>  
        <p type="p">138:輸出</p>  
        <p type="p">140:射頻(RF)傳輸線</p>  
        <p type="p">142:傳輸纜線</p>  
        <p type="p">144:傳輸纜線</p>  
        <p type="p">146:射頻(RF)纜線</p>  
        <p type="p">148:輸入</p>  
        <p type="p">150:輸出</p>  
        <p type="p">152:射頻(RF)傳輸線</p>  
        <p type="p">154:射頻(RF)纜線、間隙</p>  
        <p type="p">156:輸入</p>  
        <p type="p">160:高頻(HF)射頻(RF)訊號</p>  
        <p type="p">162:主配方訊號</p>  
        <p type="p">164:主射頻(RF)訊號</p>  
        <p type="p">166:頂部射頻(RF)訊號</p>  
        <p type="p">168:波形控制訊號</p>  
        <p type="p">S:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1696" publication-number="202626491"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626491.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學物質的製造方法及觸媒的使用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C01B3/40</main-classification>  
        <further-classification edition="200601120260401B">B01J23/83</further-classification>  
        <further-classification edition="200601120260401B">B01J37/08</further-classification>  
        <further-classification edition="200601120260401B">B01J37/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永長久寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EINAGA, HISAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>椿俊太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBAKI, SHUNTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>手塚記庸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEZUKA, NORIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤孝志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的化學物質的製造方法的一態樣是一種在觸媒的存在下對原料進行轉化以生成生成物的化學物質的製造方法，包括：使所述原料與經微波照射而加熱至400℃以下的所述觸媒接觸，所述原料及所述生成物中的至少任一者包含還原性的物質，所述觸媒包含選自下述通式（1）所表示的化合物中的至少一種金屬氧化物。 &lt;br/&gt;&lt;br/&gt;MaMbO&lt;sub&gt;3&lt;/sub&gt; … 通式（1） &lt;br/&gt;&lt;br/&gt;其中，在所述通式（1）中，Ma表示選自鹼土金屬及鑭系元素中的一種金屬元素，Mb表示選自Fe、Co、Ni、Mn、Cu及Ti中的至少一種金屬元素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1697" publication-number="202628689"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628689.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其設計方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF DESIGNING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10D89/10</main-classification>  
        <further-classification edition="202001120260325B">G06F30/392</further-classification>  
        <further-classification edition="202001320260325B">G06F115/08</further-classification>  
        <further-classification edition="202001320260325B">G06F117/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商瑞薩電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川昌宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在不引起成對元件的特性變化的情況下，抑制了開發成本和開發週期的增加。在平面圖中，多個MOS單元3Q彼此相鄰地佈置在半導體基板的主表面上，多個MOS單元中的每個MOS單元由至少一個MOSFET組成並且具有相同的結構。在多個MOS單元3Q上方，形成多層佈線層。在多層佈線層中的最上層佈線層中，形成佈線M8。多個MOS單元3Q中的每個MOS單元3Q包括作為成對元件構成差分電路的一部分的MOS單元1Q和MOS單元2Q。在平面圖中，由佈線M8覆蓋的MOS單元1Q的覆蓋率與由佈線M8覆蓋的MOS單元2Q的覆蓋率相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Without causing characteristic variations in paired elements, the increase in development cost and development period is suppressed. A plurality of MOS units 3Q are arranged adjacent to each other on a main surface of a semiconductor substrate in a plan view, each of the plurality of MOS unit is comprised of at least one MOSFET and has same structure. Above the plurality of MOS units 3Q, a multilayer wiring layer is formed. In an uppermost wiring layer of the multilayer wiring layer, wiring M8 is formed. Each of the plurality of MOS units 3Q includes MOS unit 1Q and MOS unit 2Q, which constitute a part of the differential circuit as paired elements. The coverage rate of MOS unit 1Q covered by wiring M8 is the same as the coverage rate of MOS unit 2Q covered by wiring M8 in the plan view.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">10:模擬IP</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1698" publication-number="202627537"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627537.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合透鏡</chinese-title>  
        <english-title>COMPOUND LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G02B3/02</main-classification>  
        <further-classification edition="200601120260316B">G02B9/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂宜隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, I LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王光儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUANG JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧兆展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, JAU JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合透鏡包括四個同軸對準的透鏡：（i）第一基板及第一透鏡，以及，按照距離其增加的順序且在其同一側上，（ii）第二透鏡、第二基板、第三透鏡、第三基板及第四透鏡。第一透鏡是負透鏡。第二透鏡、第三透鏡和第四透鏡是正透鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A compound lens includes four coaxially aligned lenses: (i) a first substrate, and a first lens and, in order of increasing distance therefrom, and on a same side thereof, (ii) a second lens, a second substrate, a third lens, a third substrate, and a fourth lens. The first lens is negative lens. The second lens, the third lens and the fourth lens are positive lenses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:複合透鏡</p>  
        <p type="p">201:光軸</p>  
        <p type="p">210:第一透鏡</p>  
        <p type="p">211,222,232,241,251,262,281,282,291,292:表面</p>  
        <p type="p">212:第一透鏡表面</p>  
        <p type="p">220:第二透鏡</p>  
        <p type="p">221:第二透鏡表面</p>  
        <p type="p">230:第三透鏡</p>  
        <p type="p">231:第三透鏡表面</p>  
        <p type="p">240:第四透鏡</p>  
        <p type="p">242:第四透鏡表面</p>  
        <p type="p">250:第一基板</p>  
        <p type="p">252:第一平面</p>  
        <p type="p">260:第二基板</p>  
        <p type="p">261:第二平面</p>  
        <p type="p">270:第三基板</p>  
        <p type="p">271:第三平面</p>  
        <p type="p">272:表面/第四平面</p>  
        <p type="p">280:濾光片</p>  
        <p type="p">290:蓋玻璃</p>  
        <p type="p">299:像平面</p>  
        <p type="p">MTH:最大厚度</p>  
        <p type="p">ST:光闌</p>  
        <p type="p">TH:厚度</p>  
        <p type="p">TTL:總軌道長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1699" publication-number="202627459"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627459.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置、光罩檢查裝置及反射型光罩之檢查方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G01N21/956</main-classification>  
        <further-classification edition="201201120260323B">G03F1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北澤大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAZAWA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柘植陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUGE, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井由紀子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, YUKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井部泰輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBE, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學裝置（10），其具備：照明光學系統（12），其以來自光源（11）之照明光（L1）照明物體（20）之表面；以及成像光學系統（13），其將來自藉由照明光學系統（12）照明之表面的光成像；成像光學系統（13）具備凹面反射鏡（PM1），該凹面反射鏡（PM1）形成有使來自最終光學構件（IOF）之照明光通過之開口部（15）且將來自表面之光（L2）聚光，上述最終光學構件（IOF）係構成照明光學系統（12）之光學構件之中、配置於照明光學系統（12）之照明光路上最靠物體（20）側者；凹面反射鏡（PM1）之反射面（16）形成於開口部（15）之周圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10(1):光學裝置</p>  
        <p type="p">11:光源</p>  
        <p type="p">12:照明光學系統</p>  
        <p type="p">13:成像光學系統</p>  
        <p type="p">14:檢測器</p>  
        <p type="p">14a:檢測面</p>  
        <p type="p">15:開口部</p>  
        <p type="p">16:反射面</p>  
        <p type="p">20:檢查對象物</p>  
        <p type="p">h:法線</p>  
        <p type="p">IF1、IF2:位置</p>  
        <p type="p">IO1:第1照明系統光學構件</p>  
        <p type="p">IO2:第2照明系統光學構件</p>  
        <p type="p">IOF:最終光學構件</p>  
        <p type="p">L1、L2:光</p>  
        <p type="p">PM1:凹面反射鏡</p>  
        <p type="p">PM2:第2成像系統光學構件</p>  
        <p type="p">PM3:第3成像系統光學構件</p>  
        <p type="p">PM4:第4成像系統光學構件</p>  
        <p type="p">S:光闌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1700" publication-number="202626302"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626302.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>教示操作盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B25J9/22</main-classification>  
        <further-classification edition="200601120260331B">B25J13/06</further-classification>  
        <further-classification edition="200601120260331B">B25J19/00</further-classification>  
        <further-classification edition="200601120260331B">G05B19/409</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種教示操作盤，可在不對操作性造成不良影響且不使能量消耗量增大的情形下溫暖作業人員的手。&lt;br/&gt; 提供用以教示機器人的動作或操作機器人的使用者介面之教示操作盤1具備輸入部30、顯示部20、控制部70、把持部50及加熱把持部50之加熱部100，加熱部100包含與控制部70連接之熱傳導部101。又，加熱部100亦可設為可進行加熱把持部50之加熱狀態與不進行加熱部100的加熱之加熱停止狀態的切換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:教示操作盤</p>  
        <p type="p">40:連接部</p>  
        <p type="p">50:把持部</p>  
        <p type="p">60:基板</p>  
        <p type="p">70:控制部</p>  
        <p type="p">100:加熱部</p>  
        <p type="p">101:熱傳導部</p>  
        <p type="p">A-A:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1701" publication-number="202626576"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626576.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不飽和醛製造用催化劑及使用其之不飽和醛之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C07C45/35</main-classification>  
        <further-classification edition="200601120260323B">B01J23/843</further-classification>  
        <further-classification edition="200601120260323B">C07C47/22</further-classification>  
        <further-classification edition="200601120260323B">C07C27/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本觸媒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三田村之裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITAMURA, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">課題&lt;br/&gt; 本發明提供一種改善不飽和醛之選擇率之方法。&lt;br/&gt; 解決手段&lt;br/&gt; 一種不飽和醛之製造方法，其係使用含有包含鉬、鉍、鐵、鈷之複合氧化物者作為催化劑，於固定床型多管式反應器中，於含分子狀氧之氣體之存在下，藉由將選自丙烯、異丁烯、三級醇之化合物進行接觸氣相氧化來製造不飽和醛之方法，且前述催化劑係藉由進行還原處理後進行氧化處理而得到之催化劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1702" publication-number="202626266"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626266.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134278</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件的周方向的厚度偏差的偵測方法</chinese-title>  
        <english-title>METHOD OF DETECTING VARIATIONS IN A CIRCUMFERENTIAL THICKNESS OF A WORKPIECE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">B24B49/12</main-classification>  
        <further-classification edition="201201120260320B">B24B37/00</further-classification>  
        <further-classification edition="200601120260320B">G01B21/00</further-classification>  
        <further-classification edition="202601120260320B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, ARASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>御厨俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKURIYA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可迅速地偵測藉由雙面研磨而產生的工件周方向的厚度偏差之工件的周方向的厚度偏差的偵測方法。雙面研磨裝置的上定盤或下定盤係，具有從前述上定盤或前述下定盤的上面貫穿至下面為止的一個以上的工件厚度計測用孔。工件的雙面研磨方法包括第一步驟以及第二步驟。第一步驟係，對於工件進行雙面研磨，且藉由在雙面研磨中藉由工件厚度計測器經由前述一個以上的工件厚度計測用孔即時地計測工件的厚度，而取得工件的厚度資料。第二步驟係，基於在前述雙面研磨步驟中至少在中期階段的工件的厚度資料的偏差，偵測工件的周方向的厚度偏差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of rapidly detecting variations in the circumferential thickness of a workpiece caused by double-sided polishing is provided. The upper platen or the lower platen of a double-sided polishing apparatus includes one or more workpiece thickness measurement holes. The workpiece thickness measurement holes extend through said upper or lower platen from the upper surface to the lower surface. The double-sided polishing method includes a first step and a second step. In the first step, a double-sided polishing process is performed on the workpiece. During the double-sided polishing process, the thickness of the workpiece is measured in real time, via the workpiece thickness measurement holes, using a workpiece thickness gauge, thereby obtaining thickness data for the workpiece. In the second step, the circumferential thickness variations in the workpiece are detected based on variations of the thickness data of the workpiece, at least in a mid-stage during the double-sided polishing step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雙面研磨裝置(裝置)</p>  
        <p type="p">2:上定盤</p>  
        <p type="p">3:下定盤</p>  
        <p type="p">4:旋轉定盤</p>  
        <p type="p">5:太陽齒輪</p>  
        <p type="p">6:內齒輪</p>  
        <p type="p">7:研磨墊</p>  
        <p type="p">8:工件保持孔</p>  
        <p type="p">9:載板</p>  
        <p type="p">10:工件厚度計測用孔(孔)</p>  
        <p type="p">11:工件厚度計測器</p>  
        <p type="p">12:控制部</p>  
        <p type="p">13:運算部</p>  
        <p type="p">W:工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1703" publication-number="202626179"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626179.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>最小化預電漿減量系統中的腐蝕</chinese-title>  
        <english-title>MINIMIZING CORROSION IN PRE-PLASMA ABATEMENT SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">B01D53/34</main-classification>  
        <further-classification edition="200601120260326B">B01D53/52</further-classification>  
        <further-classification edition="202601120260326B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲蘭基　菲紐格帕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELLANKI, VENUGOPAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　柱亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JU HYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯西堤　蘇希姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHTI, SUSHIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東尼　萊恩Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWNEY, RYAN T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例包含一種減少處理系統中泵排氣前級腐蝕的方法。該方法從操作電漿處理系統開始，並將含氟或氯的氣體作為流出物排入處理腔室排氣前級。流出物在真空環境中的電漿減量系統中，使用含氫試劑對該流出物進行減量減量。減量後的流出物在真空壓力下包含一或多種HF或HCl。控制器運行程序，以根據流出物的特性、流動速率和壓力來確定HCl或HF凝結的條件是否存在。不可凝氣體被注入流出物中。減量後的流出物被抽送至耦合於泵出口的泵排氣前級，其中泵排氣前級處於大氣壓下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments include a method for reducing corrosion in a pump exhaust foreline of a processing system. The method begins with the operation of a plasma processing system and evacuating a fluorine or chlorine containing gas into a processing chamber exhaust foreline as effluent. The effluent is abated in a plasma abatement system with a hydrogen containing reagent in a vacuum environment. The abated effluent contains one or more of HF or HCl at vacuum pressure. A controller runs a program to determine if a condition for condensation of HCl or HF exist based on a characteristic, flow rate and pressure of the effluent. A non-condensable gas is injected into the effluent. The abated effluent is pumped to a pump exhaust foreline coupled to an outlet of the pump, wherein the pump exhaust foreline is at atmospheric pressure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:製程流程</p>  
        <p type="p">210:操作</p>  
        <p type="p">220:操作</p>  
        <p type="p">230:操作</p>  
        <p type="p">240:操作</p>  
        <p type="p">250:操作</p>  
        <p type="p">260:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1704" publication-number="202627605"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627605.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統及相機模組</chinese-title>  
        <english-title>OPTICAL SYSTEM AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G02B15/14</main-classification>  
        <further-classification edition="200601120260325B">G02B13/00</further-classification>  
        <further-classification edition="200601120260325B">G02B13/18</further-classification>  
        <further-classification edition="200601120260325B">G02B9/64</further-classification>  
        <further-classification edition="200601120260325B">G02B3/00</further-classification>  
        <further-classification edition="202301120260325B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文聖民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, SUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施例中所揭露之相機模組包括：一第一透鏡群組，其具有一稜鏡及正(+)折射力；一第二透鏡群組，其安置於該第一透鏡群組之一感測器側上且具有負(-)折射力；一第三透鏡群組，其安置於該第二透鏡群組之一感測器側上且具有正(+)折射力；以及一第四透鏡群組，其安置於該第三透鏡群組之一感測器側上且具有負(-)折射力，其中該第一透鏡群組之一稜鏡之一出射表面以及該第二透鏡群組至該第四透鏡群組與一光軸對準，且該第三透鏡群組及該第四透鏡群組沿著該第二透鏡群組至該第四透鏡群組中之透鏡之該光軸移動以執行自一廣角模式至一長焦模式之一變焦放大率，且該第一透鏡群組之一焦距係FLG1，該第二透鏡群組之一焦距係FLG2，且可滿足一數學表達式：│FLG2│*4 ＜ FLG1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The camera module disclosed in the embodiment of the invention includes a first lens group having a prism and positive (+) refractive power; a second lens group disposed on a sensor side of the first lens group and having negative (-) refractive power; a third lens group disposed on a sensor side of the second lens group and having positive (+) refractive power; and a fourth lens group disposed on a sensor side of the third lens group and having negative (-) refractive power, wherein an exit surface of a prism of the first lens group and the second to fourth lens groups are aligned with an optical axis, and the third and fourth lens groups move along the optical axis of lenses in the second to fourth lens groups to perform a zoom magnification from a wide mode to a tele mode, and a focal length of the first lens group is FLG1, a focal length of the second lens group is FLG2, and a mathematical expression may satisfy: │ FLG2│*4 ＜ FLG1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:稜鏡</p>  
        <p type="p">111:第一透鏡</p>  
        <p type="p">112:第二透鏡</p>  
        <p type="p">113:第三透鏡</p>  
        <p type="p">114:第四透鏡</p>  
        <p type="p">115:第五透鏡</p>  
        <p type="p">116:第六透鏡</p>  
        <p type="p">117:第七透鏡</p>  
        <p type="p">118:最後一個透鏡/第八透鏡</p>  
        <p type="p">190:光學濾波器</p>  
        <p type="p">192:影像感測器</p>  
        <p type="p">BFL:光軸距離</p>  
        <p type="p">CG2:中心距離</p>  
        <p type="p">CG4:中心距離</p>  
        <p type="p">CG6:光軸距離/中心距離</p>  
        <p type="p">CT1:中心厚度</p>  
        <p type="p">CT5:中心厚度</p>  
        <p type="p">CT6:中心厚度</p>  
        <p type="p">CT7:中心厚度</p>  
        <p type="p">CT8:中心厚度</p>  
        <p type="p">H0:厚度</p>  
        <p type="p">LG1:透鏡群組/第一透鏡群組</p>  
        <p type="p">LG2:透鏡群組/可移動透鏡群組/第二透鏡群組</p>  
        <p type="p">LG3:透鏡群組/第三透鏡群組/可移動透鏡群組</p>  
        <p type="p">LG4:第四透鏡群組/透鏡群組</p>  
        <p type="p">ImgH:長度</p>  
        <p type="p">OA1:光軸/第一光軸</p>  
        <p type="p">OA2:光軸</p>  
        <p type="p">RS0:反射表面</p>  
        <p type="p">RT1:光軸距離</p>  
        <p type="p">RT2:光軸距離</p>  
        <p type="p">S1:第一表面/物體側表面</p>  
        <p type="p">S2:感測器側第二表面/第二表面/感測器側表面</p>  
        <p type="p">S3:物體側第三表面/第三表面/物體側表面</p>  
        <p type="p">S4:第四表面/感測器側表面</p>  
        <p type="p">S5:第五表面/物體側表面</p>  
        <p type="p">S6:第六表面</p>  
        <p type="p">S7:第七表面</p>  
        <p type="p">S8:第八表面</p>  
        <p type="p">S9:第九表面</p>  
        <p type="p">S10:第十表面</p>  
        <p type="p">S11:第十一表面</p>  
        <p type="p">S12:第十二表面</p>  
        <p type="p">S13:第十三表面</p>  
        <p type="p">S14:第十四表面</p>  
        <p type="p">S15:第十五表面</p>  
        <p type="p">S16:感測器側表面/第十六表面</p>  
        <p type="p">TTL1:距離</p>  
        <p type="p">TTL2:距離</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p>  
        <p type="p">ZL1:總體長度/總長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1705" publication-number="202627781"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627781.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層膜、積層片及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G06F3/041</main-classification>  
        <further-classification edition="200601120260327B">G02B5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大賽璐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財間俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAIMA, TOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横山将史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之積層膜具有： &lt;br/&gt;基材層； &lt;br/&gt;樹脂層：形成於上述基材層之上，與對向於上述基材層之面相反側之面為具有凹凸形狀之凹凸面；及 &lt;br/&gt;光散射層； &lt;br/&gt;上述光散射層滿足規定之要件，在安裝於217 ppi像素之OLED顯示器表面之狀態下，以為256灰階顯示之灰階影像且平均值成為170灰階之方式進行調整，依據JIS C 1006：2019測定之眩光值為15.0以下，上述樹脂層之算術平均粗糙度Ra為0.10 μm以上，去除外部霧度所測得之霧度為15.0%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層膜</p>  
        <p type="p">11:基材層</p>  
        <p type="p">13:樹脂層</p>  
        <p type="p">13a:凹凸面</p>  
        <p type="p">14:光散射層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1706" publication-number="202627516"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627516.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合式微型搜尋線圈磁感測器</chinese-title>  
        <english-title>INTEGRATED MICRO SEARCH COIL MAGNETIC SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G01R33/02</main-classification>  
        <further-classification edition="200601120260319B">H01F38/14</further-classification>  
        <further-classification edition="202501120260319B">H10D99/00</further-classification>  
        <further-classification edition="200601120260319B">H03F3/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔瓦科利　哈迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAVAKKOLI, HADI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾哈邁德　莫阿茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHMED, MOAAZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾馬克　艾明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERMAK, AMINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　貽昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-KUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有低雜訊儀表放大器之全整合式微型搜尋線圈磁強計(μSCM)用於1 Hz至1 kHz之範圍內之低頻磁場量測。將藉由堆疊平面螺旋電感器及使其等依同相組態串聯連接所形成之微型搜尋線圈用於磁場量測。平面螺旋電感器之臨界線寬及內徑經理論計算及實驗驗證以能夠開發獨特CMOS佈局。此佈局併入所計算之臨界內徑以顯著最佳化CMOS晶粒上之面積利用。另外，CMOS晶粒包含用於晶片上校準之多晶矽層電感器、用於DC磁場量測之霍爾效應感測器及用於增強功能性之溫度感測器。μSCM提供低頻磁場量測之緊湊、節能及高度靈敏解決方案，其勝過大部分市售霍爾效應感測器之效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fully integrated micro search coil magnetometer (µSCM) with a low-noise instrumentation amplifier is provided for low-frequency magnetic field measurements in the range of 1Hz to 1kHz. A micro search coil formed by stacking planar spiral inductors and serially connecting them with an in-phase configuration is used for magnetic field measurements. The critical line width and inner diameter of a planar spiral inductor are theoretically calculated and experimentally verified, enabling the development of a unique CMOS layout. This layout incorporates the calculated critical inner diameter, significantly optimizing the area utilization on the CMOS die. Additionally, the CMOS die includes a polysilicon-layer inductor for on-chip calibration, a Hall effect sensor for DC magnetic field measurement, and a temperature sensor for enhanced functionality. The µSCM delivers a compact, energy-efficient, and highly sensitive solution for low-frequency magnetic field measurements, surpassing the performance of most commercially available Hall effect sensors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微型搜尋線圈磁強計(μSCM)</p>  
        <p type="p">110:搜尋線圈</p>  
        <p type="p">118:感應電壓</p>  
        <p type="p">120:校準線圈/多晶矽電感器</p>  
        <p type="p">130:儀表放大器(INA)</p>  
        <p type="p">131:磁場感測信號</p>  
        <p type="p">140:溫度感測器</p>  
        <p type="p">150:霍爾效應感測器</p>  
        <p type="p">190:互補金屬氧化物半導體(CMOS)晶粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1707" publication-number="202628181"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628181.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態可變阻抗裝置及射頻源系統</chinese-title>  
        <english-title>SOLID STATE VARIABLE IMPEDANCE DEVICE AND RF SOURCE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01J37/32</main-classification>  
        <further-classification edition="200601120260325B">H03H7/40</further-classification>  
        <further-classification edition="200601120260325B">H03H11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫姆　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMOU, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐文　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OWEN, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施例係關於一種設備，包括電導體路徑及與該電導體路徑電性耦合的開關並聯電容器。在一個實施例中，該開關並聯電容器被配置為藉由包含第一電晶體和第二電晶體的半橋電路開關接通和關閉，其中RF扼流器位於第一電晶體與第二電晶體之間的電路路徑上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes an electrically conductive path and switched shunt capacitor electrically coupled to the electrically conductive path. In an embodiment, the switched shunt capacitor is configured to be switched on and off by a half-bridge circuit that includes a first transistor and a second transistor, and wherein an RF choke is on an electrical path between the first transistor and the second transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108:接地線</p>  
        <p type="p">110:匹配</p>  
        <p type="p">112:板</p>  
        <p type="p">114:輸入</p>  
        <p type="p">115:第二階段</p>  
        <p type="p">117:第一階段</p>  
        <p type="p">118:輸出</p>  
        <p type="p">121:LC模組</p>  
        <p type="p">122:開關並聯電容器組</p>  
        <p type="p">123:開關並聯電容器組</p>  
        <p type="p">124:變容器</p>  
        <p type="p">125:開關並聯電容器組</p>  
        <p type="p">126:開關並聯電容器組</p>  
        <p type="p">127:開關並聯電容器組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1708" publication-number="202627561"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627561.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有錐形波導的多層光子元件</chinese-title>  
        <english-title>MULTILAYERED PHOTONIC DEVICES WITH TAPERED WAVEGUIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G02B6/122</main-classification>  
        <further-classification edition="200601120260324B">G02F1/365</further-classification>  
        <further-classification edition="200601120260324B">H01P1/16</further-classification>  
        <further-classification edition="201301120260324B">H04B10/2507</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾斯史卡佩光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XSCAPE PHOTONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏斯特　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEST, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡瑞米拉海　薩米拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARIMELAHI, SAMIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋塔　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAETA, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉古納坦　維偉克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAGHUNATHAN, VIVEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李普森　米夏爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIPSON, MICHAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪亞斯　莉安凱瑟琳格魯納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIAS, LEANNE CATHERINE GRUNER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光子積體電路，該光子積體電路包括：基板、包覆層、由第一材料組成並佈置於該包覆層內的第一波導，該第一波導包括結束於該第一波導的一端部的錐形區段，該第一波導的該錐形區段包括分段，每一者分段具有隨不同函數變動的寬度；以及由第二材料組成並佈置於該包覆層內的第二波導，該第二波導包括結束於該第二波導的一端部的錐形區段，該第二波導的該錐形區段包括分段，每一者分段具有隨不同函數變動的寬度。該第一材料不同於該第二材料，該第一波導在垂直方向上偏移於該第二波導，且該第一波導的該錐形區段重疊該第二波導的該錐形區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photonic integrated circuit includes: a substrate; a cladding layer; a first waveguide composed of a first material and disposed within the cladding layer, the first waveguide including a tapered section that terminates at an end of the first waveguide, the tapered section of the first waveguide including segments each having a width that varies according to a different function; and a second waveguide composed of a second material and disposed within the cladding layer, the second waveguide including a tapered section that terminates at an end of the second waveguide, the tapered section of the second waveguide including segments each having a width that varies according to a different function. The first and second materials are different, the first and seconds waveguides are offset from each other in a vertical direction, and the tapered sections of the first and seconds waveguide overlap each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:元件</p>  
        <p type="p">502:波導</p>  
        <p type="p">504:波導</p>  
        <p type="p">506:重疊區域</p>  
        <p type="p">508a:錐形區段</p>  
        <p type="p">508b:錐形區段</p>  
        <p type="p">510:模態轉換器</p>  
        <p type="p">512:端部</p>  
        <p type="p">513:低階模態</p>  
        <p type="p">514:高階模態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1709" publication-number="202626025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體組成物</chinese-title>  
        <english-title>SOLID COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/192</main-classification>  
        <further-classification edition="200601120260401B">A61K31/195</further-classification>  
        <further-classification edition="200601120260401B">A61K36/484</further-classification>  
        <further-classification edition="200601120260401B">A61K47/36</further-classification>  
        <further-classification edition="200601120260401B">A61K9/20</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共健康事業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野宏大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於固體組成物。本發明的課題在於提供新型固體組成物。本發明的解決手段為提供包含由布洛芬與胺甲環酸形成的晶體與甘草之固體組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a solid composition. The object of the present invention is to provide a novel solid composition. The means of the present invention to attain the object is to provide a solid composition comprising a crystal composed of ibuprofen and tranexamic acid, and licorice.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1710" publication-number="202628182"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628182.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以大氣壓電漿自基體、晶粒及晶圓上之金屬接觸移除金屬氧化物之技術</chinese-title>  
        <english-title>REMOVING METAL OXIDE FROM METALLIC CONTACTS ON SUBSTRATES, DIES AND WAFERS WITH ATMOSPHERIC PRESSURE PLASMA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">H01J37/32</main-classification>  
        <further-classification edition="200601120260331B">H05H1/24</further-classification>  
        <further-classification edition="200601120260331B">B29C59/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瑟菲克斯科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURFX TECHNOLOGIES LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希克斯　羅伯特　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HICKS, ROBERT F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐丹諾　亞歷山大　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIORDANO, ALEXANDER MARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　湯瑪斯　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, THOMAS SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉孝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSIAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於在惰性氣體環境中以電漿將基體之表面改質之方法，包含：將該基體包封於一腔室中，該腔室具有環繞側壁及在該等環繞側壁上方的一可移動蓋板，其間有一間隙；將一電漿源固附至該可移動蓋板，該可移動蓋板具有透過該蓋板進入該腔室之一電漿出口；以足以使該腔室的氧濃度降低至比在空氣中低幾個數量級之惰性氣體吹掃該腔室；該惰性氣體透過一入口進入該腔室且透過一出口自該腔室離開；以及掃描及活化該電漿源，該電漿源固附至該基體上方之該蓋板，諸如使該基體之該表面暴露於透過該電漿出口遞送的由該電漿產生的一反應性物種。在整個掃描中將惰性氣體環境維持在該腔室內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for modifying a surface of a substrate with a plasma in an inert gas environment, comprises enclosing the substrate in a chamber having surrounding sidewalls and a movable coverplate above the surrounding sidewalls with a gap therebetween, affixing a plasma source to the movable coverplate having a plasma outlet through the coverplate into the chamber, purging the chamber with inert gas sufficient to reduce an oxygen concentration of the chamber to several orders of magnitude less than in air, the inert gas entering through and inlet to the chamber and exiting through an outlet from the chamber, and scanning and activating the plasma source affixed to the cover plate over the substrate, such as to expose the surface of the substrate to a reactive species generated by the plasma delivered through the plasma outlet. An inert gas environment is maintained within the chamber throughout the scanning.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">17:晶圓固持器</p>  
        <p type="p">18:矽晶圓</p>  
        <p type="p">25:惰性吹掃氣體流，吹掃氣體流，狹縫</p>  
        <p type="p">26:壁</p>  
        <p type="p">27:孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1711" publication-number="202627050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>供烯烴生產用之電及明火混合加熱器</chinese-title>  
        <english-title>HYBRID ELECTRIC AND FIRED HEATER FOR OLEFIN PRODUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C10G9/00</main-classification>  
        <further-classification edition="200601120260401B">C10G9/18</further-classification>  
        <further-classification edition="200601120260401B">C10G9/24</further-classification>  
        <further-classification edition="200601120260401B">C07C4/04</further-classification>  
        <further-classification edition="200601120260401B">C07C11/02</further-classification>  
        <further-classification edition="200601120260401B">C07C11/04</further-classification>  
        <further-classification edition="200601120260401B">H05B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商魯瑪斯科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑達蘭　肯達沙米　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDARAM, KANDASAMY M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅勞爾　湯瑪斯　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRONAUER, THOMAS WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史丹利　史蒂芬　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STANLEY, STEPHEN J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，其包括：將一烴進料預熱，將該經預熱烴流饋至第二預熱區以進行裂解，及將該裂解進料流饋至一輻射段中之一或多個盤管以回收一經裂解之烴產物。該方法包括注入過量空氣並在一輸送管線交換器中冷卻該經裂解之烴產物。該系統包括一熱解加熱器、該對流加熱區之第一及第二預熱區、及在該輻射加熱區中之一或多個盤管。該系統包括用於注入一過量空氣量的一或多個入口、在該輻射加熱區中之一或多個電氣加熱元件、以及用於將該經裂解之烴產物引導至一輸送管線交換器之一進料管線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process including preheating a hydrocarbon feed, feeding the preheated hydrocarbon stream to a second preheat zone for cracking, and feeding the cracking feed stream to one or more coils in a radiant section to recover a cracked hydrocarbon product. The process includes injecting excess air and cooling the cracked hydrocarbon product in a transfer line exchanger. The system includes a pyrolysis heater, a first and second preheat zone of the convection heating zone, and one or more coils in the radiant heating zone. The system includes one or more inlets for injecting an amount of excess air, one or more electrical heating elements in the radiant heating zone, and a feedline for directing the cracked hydrocarbon product to a transfer line exchanger.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:烴進料流，烴進料管線，烴流</p>  
        <p type="p">16:稀釋蒸汽</p>  
        <p type="p">18:混合烴-蒸汽流</p>  
        <p type="p">20:元件</p>  
        <p type="p">22:(過熱)蒸汽</p>  
        <p type="p">100:明火管式爐</p>  
        <p type="p">110:對流段</p>  
        <p type="p">120:輻射段</p>  
        <p type="p">122:處理管(輻射盤管)</p>  
        <p type="p">124:燃燒器噴嘴</p>  
        <p type="p">130:輸送管線交換器(TLE),TLE</p>  
        <p type="p">160:鍋爐給水蒸汽生成系統</p>  
        <p type="p">200:加熱元件，電氣加熱元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1712" publication-number="202626486"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626486.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134371</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氫的製造方法及烴的改質方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">C01B3/02</main-classification>  
        <further-classification edition="202601120260318B">C01B3/326</further-classification>  
        <further-classification edition="202501120260318B">C01G53/66</further-classification>  
        <further-classification edition="202501120260318B">C01G51/66</further-classification>  
        <further-classification edition="202201120260318B">B01F35/94</further-classification>  
        <further-classification edition="202001120260318B">C01F17/224</further-classification>  
        <further-classification edition="200601120260318B">C10G35/085</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永長久寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EINAGA, HISAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>椿俊太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBAKI, SHUNTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>手塚記庸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEZUKA, NORIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤孝志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的H&lt;sub&gt;2&lt;/sub&gt;的製造方法的一態樣包括：在包含選自CO&lt;sub&gt;2&lt;/sub&gt;、H&lt;sub&gt;2&lt;/sub&gt;O及N&lt;sub&gt;2&lt;/sub&gt;中的至少一種的氣體的氣氛下，對包含金屬及金屬氧化物的混合物照射微波；以及在包含選自CO&lt;sub&gt;2&lt;/sub&gt;、H&lt;sub&gt;2&lt;/sub&gt;O及N&lt;sub&gt;2&lt;/sub&gt;中的至少一種的氣體的氣氛下，使烴與正經所述微波照射的所述混合物接觸，所述金屬為包含選自Fe、Co、Ni、Mn、Cu及Ti中的至少一種金屬元素的金屬，所述金屬氧化物為選自通式（1）：MaMbO&lt;sub&gt;3&lt;/sub&gt;[Ma表示選自鹼土金屬及鑭系元素中的一種金屬元素，Mb表示與所述金屬所包含的金屬元素相同的金屬元素]所表示的化合物中的至少一種金屬氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1713" publication-number="202628838"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628838.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134421</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在基板上沉積碳化矽層之反應器及蝕刻碳化矽膜之方法</chinese-title>  
        <english-title>REACTOR FOR DEPOSITION OF SILICON CARBIDE LAYER ON SUBSTRATE AND METHOD FOR ETCHING SILICON CARBIDE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P50/24</main-classification>  
        <further-classification edition="202601120260323B">H10P14/20</further-classification>  
        <further-classification edition="202601120260323B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商ＬＰＥ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LPE S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法圖佐　克勞蒂亞　朱塞皮娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FATUZZO, CLAUDIA GIUSEPPINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦倫特　詹盧卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALENTE, GIANLUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於自適用於在一基板上沉積碳化矽層之一反應腔室之一或多個部件蝕刻一碳化矽膜的方法。該方法包含以下步驟：（i）在用於沉積碳化矽之一反應器之一反應腔室的一或多個部件上提供一碳化矽膜；（ii）執行一蝕刻製程之至少一個循環。該蝕刻製程包括一UV光子輔助化學蝕刻之至少一個循環。本發明進一步係關於一種經調適以執行該方法的反應器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for etching a silicon carbide film from one or more parts of a reaction chamber suitable for the deposition of silicon carbide layers on a substrate. The method comprises the steps of: (i) providing a silicon carbide film on one or more parts of a reaction chamber of a reactor for deposition silicon carbide; (ii) executing at least one cycle of an etching process. The etching process includes at least one cycle of a UV-photon assisted chemical etching. The present invention further relates to a reactor adapted to execute said method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:方法</p>  
        <p type="p">10:區塊</p>  
        <p type="p">20:區塊</p>  
        <p type="p">21:區塊</p>  
        <p type="p">22:區塊</p>  
        <p type="p">30:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1714" publication-number="202626819"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626819.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性樹脂材料、預浸體、樹脂薄膜、覆金屬積層板、印刷線路板、及半導體封裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08F290/12</main-classification>  
        <further-classification edition="200601120260330B">C08F299/00</further-classification>  
        <further-classification edition="200601120260330B">C08L25/00</further-classification>  
        <further-classification edition="200601120260330B">C08L65/00</further-classification>  
        <further-classification edition="200601120260330B">C08K5/523</further-classification>  
        <further-classification edition="200601120260330B">C08K5/5313</further-classification>  
        <further-classification edition="200601120260330B">C08K5/5399</further-classification>  
        <further-classification edition="200601120260330B">C08J5/18</further-classification>  
        <further-classification edition="200601120260330B">C08J5/24</further-classification>  
        <further-classification edition="200601120260330B">B32B15/08</further-classification>  
        <further-classification edition="200601120260330B">H05K1/03</further-classification>  
        <further-classification edition="202601120260330B">H10W74/10</further-classification>  
        <further-classification edition="202601120260330B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹口彩香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEGUCHI, AYAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>春日圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASUGA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登內駿介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONOUCHI, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻澤裕二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAZAWA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀨良祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>真藤祐二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種硬化性樹脂材料，其包含：樹脂(A)、及含磷原子的化合物(B)，該樹脂(A)包含茚環、乙烯基苯甲基及乙烯基苯甲基以外的芳基烷基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1715" publication-number="202626532"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626532.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>淨水系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR PURIFYING WATER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">C02F1/44</main-classification>  
        <further-classification edition="202301120260401B">C02F1/72</further-classification>  
        <further-classification edition="202301120260401B">C02F1/76</further-classification>  
        <further-classification edition="202301120260401B">C02F1/78</further-classification>  
        <further-classification edition="200601120260401B">B01D61/14</further-classification>  
        <further-classification edition="200601120260401B">B01D61/16</further-classification>  
        <further-classification edition="200601120260401B">G01N27/416</further-classification>  
        <further-classification edition="200601320260401B">C02F103/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商特薩諾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERSANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨斯佩格　史蒂夫Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENGSPERGER, STEVE L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一態樣中，本發明提供淨水系統，此系統包括進水口、於進水口下游的濾菌器、於濾菌器下游的流體出口，及流體連通濾菌器的入口的清潔流體源，以於濾菌器上游提供清潔流體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one aspect, the present disclosure provides a water purification system that includes a water inlet, a bacterial filter downstream of the water inlet, a fluid outlet downstream of the bacterial filter, and a source of a cleaning fluid in fluid communication with an inlet of the bacterial filter to provide the cleaning fluid upstream of the bacterial filter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:淨水系統</p>  
        <p type="p">102:水源</p>  
        <p type="p">104:清潔流體源</p>  
        <p type="p">106:濾菌器</p>  
        <p type="p">108a,108b:廢污</p>  
        <p type="p">110:淨水</p>  
        <p type="p">112,114,116,118:流體管道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1716" publication-number="202626265"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626265.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板研磨機的擋圈</chinese-title>  
        <english-title>RETAINING RING FOR SUBSTRATE POLISHER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260325B">B24B37/32</main-classification>  
        <further-classification edition="201201120260325B">B24B37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　正勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JEONGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤川孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKAWA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那更蓋斯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGENGAST, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">研磨頭適於處理面板基板，以對面板基板執行化學機械研磨操作。研磨頭的擋圈包括凹槽，以容納面板基板的轉角。凹槽防止擋圈的內側與面板基板的轉角接觸。在化學機械研磨操作期間，凹槽減輕透過來自擋圈的內側的撞擊而對基板轉角造成損傷的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polishing head is adapted to handle a panel substrate in order to perform a chemical mechanical polishing operation on the panel substrate. A retaining ring of the polishing head includes recesses that accommodate corners of the panel substrate. The recesses prevent inner sides of the retaining ring from contacting the corners of the panel substrate. During the chemical mechanical polishing operation, the recesses mitigate a risk of damaging the corners of the substrate through impacts from the inner sides of the retaining ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">152:間隙</p>  
        <p type="p">162A:主體</p>  
        <p type="p">172:內側</p>  
        <p type="p">174:內側</p>  
        <p type="p">182:外側</p>  
        <p type="p">184:外側</p>  
        <p type="p">212:邊</p>  
        <p type="p">214:邊</p>  
        <p type="p">250:基板</p>  
        <p type="p">252:轉角</p>  
        <p type="p">260:倒角</p>  
        <p type="p">262:過渡點</p>  
        <p type="p">266:過渡點</p>  
        <p type="p">500:擋圈</p>  
        <p type="p">502:轉角</p>  
        <p type="p">510:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1717" publication-number="202626761"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626761.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性元件、印刷線路板及印刷線路板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08F2/44</main-classification>  
        <further-classification edition="200601120260325B">C08F2/50</further-classification>  
        <further-classification edition="200601120260325B">C08F283/06</further-classification>  
        <further-classification edition="200601120260325B">C08F290/00</further-classification>  
        <further-classification edition="200601120260325B">C08K3/22</further-classification>  
        <further-classification edition="200601120260325B">C08K3/36</further-classification>  
        <further-classification edition="200601120260325B">C08K5/17</further-classification>  
        <further-classification edition="200601120260325B">C08K5/372</further-classification>  
        <further-classification edition="200601120260325B">C08K5/45</further-classification>  
        <further-classification edition="200601120260325B">C08K5/5397</further-classification>  
        <further-classification edition="200601120260325B">C08L63/00</further-classification>  
        <further-classification edition="200601120260325B">C08L101/00</further-classification>  
        <further-classification edition="200601120260325B">G03F7/004</further-classification>  
        <further-classification edition="200601120260325B">G03F7/027</further-classification>  
        <further-classification edition="200601120260325B">G03F7/031</further-classification>  
        <further-classification edition="200601120260325B">G03F7/038</further-classification>  
        <further-classification edition="200601120260325B">G03F7/09</further-classification>  
        <further-classification edition="200601120260325B">G03F7/20</further-classification>  
        <further-classification edition="200601120260325B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪岡諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKIOKA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部宏平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下直輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的一種永久抗蝕劑用之感光性樹脂組成物，其含有（A）酸改質含乙烯基樹脂、（B）光聚合性化合物、（C）光聚合起始劑、（D）無機填料及（E）聚合抑制劑，（C）光聚合起始劑包含選自由α-胺基苯乙酮系光聚合起始劑、二苯甲酮系光聚合起始劑、噻噸酮系光聚合起始劑、醯基氧化膦系光聚合起始劑及肟酯系光聚合起始劑組成的組中之至少一種，（D）無機填料包含折射率為1.500～1.700的無機填料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:感光性元件</p>  
        <p type="p">10:支撐膜</p>  
        <p type="p">20:感光層</p>  
        <p type="p">30:保護膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1718" publication-number="202628929"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628929.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用吸附感測器歸一化品質因數和主動吸附電壓控制的吸附狀態偵測</chinese-title>  
        <english-title>CHUCKING STATUS DETECTION WITH CHUCKING SENSOR NORMALIZED FIGURE OF MERIT AND ACTIVE CHUCKING VOLTAGE CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P72/72</main-classification>  
        <further-classification edition="200601120260327B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓蒙得四世　愛德華Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMOND, IV, EDWARD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧比歐　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUBIO, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西蒙斯　馬丁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEAMONS, MARTIN JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALASUBRAMANIAN, GANESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉萊許誠柯　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARACHTCHENKO, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘古德　阿布希吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANGUDE, ABHIJIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">監測基板的吸附狀態的方法，包括：向設置於基板基座的靜電吸盤供應吸附電壓，其中基板由基板基座支撐，向靜電吸盤的電極發送訊號於頻率範圍內，測量訊號的阻抗，將測得的阻抗與基準阻抗值進行比較以獲得吸附狀態值，並根據吸附狀態值確定基板的吸附狀態，其中吸附狀態包括未吸附、吸附不足、完全吸附或吸附過度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for monitoring a chucking status of a substrate, including: supplying chucking voltage to an electrostatic chuck disposed in a substrate pedestal, wherein a substrate is supported by the substrate pedestal, sending a signal to an electrode of an electrostatic chuck at a frequency range, measuring an impedance of the signal, comparing the measured impedance to a baseline impedance value to obtain a chucking status value, and determining a chucking status of the substrate based on the chucking status value, wherein the chucking status comprises not-chucked, under-chucked, fully-chucked, or over-chucked.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">401:操作</p>  
        <p type="p">402:操作</p>  
        <p type="p">403:操作</p>  
        <p type="p">404:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1719" publication-number="202628168"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628168.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離子植入系統及離子植入方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">H01J37/317</main-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification>  
        <further-classification edition="202601120260302B">H10P72/30</further-classification>  
        <further-classification edition="202601120260302B">H10P72/76</further-classification>  
        <further-classification edition="202601120260302B">H10P30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械離子科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>篠正光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINOZUKA, MASAMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提高離子植入工序的生產性。 &lt;br/&gt;　　[解決手段] 離子植入裝置(100)具備：植入處理室(14)，配置有第1保持裝置(40)和第2保持裝置(42)；第1加載互鎖室(121)；第2加載互鎖室(122)；第3加載互鎖室(123)；第4加載互鎖室(124)；第1真空搬運裝置(70)；第2真空搬運裝置(72)；第1盒(105)，收容第1被處理物及第2被處理物；第2盒(106)，收容第3被處理物及第4被處理物；及大氣搬運裝置(90)，在大氣環境下在第1盒(105)與第1加載互鎖室(121)或第3加載互鎖室(123)之間搬運第1被處理物或第3被處理物，在第2盒(106)與第2加載互鎖室(122)或第4加載互鎖室(124)之間搬運第2被處理物或第4被處理物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:離子植入裝置</p>  
        <p type="p">14:植入處理室</p>  
        <p type="p">40:第1保持裝置</p>  
        <p type="p">42:第2保持裝置</p>  
        <p type="p">70:第1真空搬運裝置</p>  
        <p type="p">72:第2真空搬運裝置</p>  
        <p type="p">74:第1搬運口</p>  
        <p type="p">76:第2搬運口</p>  
        <p type="p">90:大氣搬運裝置</p>  
        <p type="p">91:第1大氣搬運裝置</p>  
        <p type="p">92:第2大氣搬運裝置</p>  
        <p type="p">93:緩衝支撐台</p>  
        <p type="p">94:第1對準器</p>  
        <p type="p">95:第2對準器</p>  
        <p type="p">100:離子植入系統</p>  
        <p type="p">101:第1裝載端口</p>  
        <p type="p">102:第2裝載端口</p>  
        <p type="p">103:第3裝載端口</p>  
        <p type="p">104:第4裝載端口</p>  
        <p type="p">105:第1盒</p>  
        <p type="p">106:第2盒</p>  
        <p type="p">107:第3盒</p>  
        <p type="p">108:第4盒</p>  
        <p type="p">111:第1中間搬運室</p>  
        <p type="p">112:第2中間搬運室</p>  
        <p type="p">121:第1加載互鎖室</p>  
        <p type="p">122:第2加載互鎖室</p>  
        <p type="p">123:第3加載互鎖室</p>  
        <p type="p">124:第4加載互鎖室</p>  
        <p type="p">SB:掃描射束</p>  
        <p type="p">W1~W25:被處理物</p>  
        <p type="p">W26~W50:被處理物</p>  
        <p type="p">x3:水平方向</p>  
        <p type="p">y:垂直方向</p>  
        <p type="p">z3:射束行進方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1720" publication-number="202628817"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628817.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排氣系統控制</chinese-title>  
        <english-title>EXHAUST SYSTEM CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H10P50/00</main-classification>  
        <further-classification edition="200601120260326B">F16K31/12</further-classification>  
        <further-classification edition="200601120260326B">G05D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高普拉蘭　詹德拉康斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPULARAM, CHANDRAKANTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯庫斯　杜克丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUCKIUS, DUC DANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">系統、方法和設備包括以機器可讀媒體體現的排氣控制設計。其中一種方法包括測量半導體處理系統的氣體分配盤排氣路徑中的氣流；確定測量的氣流是否在定義範圍內；在確定測量的氣流超出定義範圍的情況下，選擇性地以增量方式打開或關閉排氣閘。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, methods, and apparatus including designs embodied in machine-readable media for exhaust control. One of the methods includes measuring an airflow through an exhaust path of a gas panel of a semiconductor processing system; determining whether the measured airflow is within a defined range; in response to determining that the measured airflow is outside of the defined range, selectively opening or closing the exhaust gate by an incremental amount.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:排氣控制系統</p>  
        <p type="p">202:氣體分配盤</p>  
        <p type="p">204:排氣線/氣流感測器</p>  
        <p type="p">206:氣流感測器</p>  
        <p type="p">208:排氣閘</p>  
        <p type="p">210:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1721" publication-number="202626459"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626459.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升降搬送裝置</chinese-title>  
        <english-title>ELAVATING TRANSPORT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">B65G1/127</main-classification>  
        <further-classification edition="200601120260330B">B65G17/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉永和治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINAGA, KAZUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種升降搬送裝置100，具備：複數個保持體1，保持搬送對象物；循環裝置，使保持體1沿著具備有升降區間之循環路徑CR循環；及複數個移交部3，在與保持體1之間進行搬送對象物的移交。循環裝置具備：無端狀的傳動構件21，沿著循環路徑CR配置；及引導機構22，沿著循環路徑CR引導傳動構件21。複數個移交部3是沿著升降區間而配置。複數個保持體1是以沿著循環路徑CR以一定間隔排列配置的方式連結於傳動構件21。複數個保持體1的第2間隔P2是設定為相鄰之移交部3的第1間隔P1的M分之1(M為1以上的整數)。傳動構件21的全長是設定為第1間隔P1的(2N+L/M)倍(N及L為1以上的整數)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:保持體</p>  
        <p type="p">11:支撐台</p>  
        <p type="p">111:載置面</p>  
        <p type="p">12:被引導機構</p>  
        <p type="p">21:傳動構件</p>  
        <p type="p">22:引導機構</p>  
        <p type="p">22A:對象旋轉體</p>  
        <p type="p">220:旋轉體</p>  
        <p type="p">221:引導軌道</p>  
        <p type="p">231:第1基座部</p>  
        <p type="p">232:第2基座部</p>  
        <p type="p">234:支柱</p>  
        <p type="p">235:橋接構造</p>  
        <p type="p">3:移交部</p>  
        <p type="p">31:第1移交部</p>  
        <p type="p">32:第2移交部</p>  
        <p type="p">33:通路面</p>  
        <p type="p">100:升降搬送裝置</p>  
        <p type="p">CR:循環路徑</p>  
        <p type="p">IV-IV:線</p>  
        <p type="p">P1:第1間隔</p>  
        <p type="p">P2:第2間隔</p>  
        <p type="p">R:徑方向</p>  
        <p type="p">R1:徑方向第1側</p>  
        <p type="p">R2:徑方向第2側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1722" publication-number="202626230"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626230.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔膜式的夾具裝置及工件固定裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B23B31/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商西鐵城精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CITIZEN MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢部晃一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABE, KOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大木篤夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHKI, ATSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所欲解決的問題在於提供一種隔膜式的夾具裝置，藉由肘桿機構來進行開閉動作。為了解決此問題，本發明的隔膜式的夾具裝置200，由肘桿機構20來使沿著主軸10的中心軸C方向配置的中間套筒25沿著中心軸C方向而在前後方向移動，且具有對應於中間套筒25的移動來進行開閉的夾具爪270；並且，對於主軸10為裝拆自如。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主軸</p>  
        <p type="p">10a:前端部</p>  
        <p type="p">10b:後端部</p>  
        <p type="p">20:肘桿機構</p>  
        <p type="p">21:線軸</p>  
        <p type="p">21a:外周環</p>  
        <p type="p">21b:內周環</p>  
        <p type="p">23:夾具動作爪</p>  
        <p type="p">23a:一端</p>  
        <p type="p">23b:另一端</p>  
        <p type="p">24:夾持力調整螺帽</p>  
        <p type="p">25:中間套筒</p>  
        <p type="p">25a:前端部</p>  
        <p type="p">25b:後端部</p>  
        <p type="p">26:鍵銷</p>  
        <p type="p">200:隔膜式的夾具裝置</p>  
        <p type="p">210:推桿</p>  
        <p type="p">210a:前端部</p>  
        <p type="p">210b:後端部</p>  
        <p type="p">220:適配器</p>  
        <p type="p">220c:鍵溝</p>  
        <p type="p">230:蓋頭螺帽</p>  
        <p type="p">240:壓縮線圈彈簧</p>  
        <p type="p">250:凸緣</p>  
        <p type="p">260:隔膜</p>  
        <p type="p">261:外周壁部</p>  
        <p type="p">262:內周壁部</p>  
        <p type="p">263:端面板部</p>  
        <p type="p">270:夾具爪</p>  
        <p type="p">281:螺栓</p>  
        <p type="p">282:螺栓</p>  
        <p type="p">400:工件固定裝置</p>  
        <p type="p">C:中心軸(軸)</p>  
        <p type="p">D:中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1723" publication-number="202627154"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627154.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳間隙填充層之形成</chinese-title>  
        <english-title>CARBON GAPFILL LAYER FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C23C16/26</main-classification>  
        <further-classification edition="200601120260325B">C23C16/50</further-classification>  
        <further-classification edition="200601120260325B">C23C16/56</further-classification>  
        <further-classification edition="202601120260325B">H10W10/00</further-classification>  
        <further-classification edition="202601120260325B">H10W10/17</further-classification>  
        <further-classification edition="202601120260325B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳立華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫許魯須薩　派瑞尚特庫馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULSHRESHTHA, PRASHANT KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴　贊道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, CHANDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼拉姆拉朱　巴拉蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEELAMRAJU, BHARATI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美諾　卡斯克蘇瑞希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENON, KARTHIK SURESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納拉亞南　拉賈雷姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARAYANAN, RAJARAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡良發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, LIANGFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董玉濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, YUTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞凱力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, KAILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈　造元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, ZAOYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河盛元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班傑明拉吉　戴米安拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENJAMIN RAJ, DAEMIAN RAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種形成間隙填充層的方法，包括：將基板置放在處理腔室的處理空間中，在基板上所安置的至少一個特徵中形成複數個第一間隙填充層，包括對於包含在複數個第一間隙填充層中的每個第一間隙填充層：通過將第一碳氫化合物前驅物氣體流入處理空間來在至少一個特徵中形成一層，並通過將第一蝕刻氣體流入處理空間來蝕刻該層，以及通過將第二碳氫化合物前驅物氣體與第二蝕刻氣體共同流入處理空間，在至少一個特徵中形成第二間隙填充層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a gapfill layer, comprising: positioning a substrate in a processing volume of a processing chamber, forming a plurality of first gapfill layers in at least one feature disposed on the substrate, comprising, for each first gapfill layer included in the plurality of first gapfill layers: forming a layer in the at least one feature by flowing a first hydrocarbon precursor gas into the processing volume and etching the layer by flowing a first etchant gas into the processing volume, and forming a second gapfill layer in the at least one feature by co-flowing a second hydrocarbon precursor gas and a second etchant gas into the processing volume.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">301:操作</p>  
        <p type="p">302:操作</p>  
        <p type="p">302a:操作</p>  
        <p type="p">302b:操作</p>  
        <p type="p">303:操作</p>  
        <p type="p">304:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1724" publication-number="202626083"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626083.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療糖尿病之方法</chinese-title>  
        <english-title>METHODS OF TREATING DIABETES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K38/28</main-classification>  
        <further-classification edition="200601120260401B">A61K47/04</further-classification>  
        <further-classification edition="200601120260401B">A61K47/10</further-classification>  
        <further-classification edition="200601120260401B">A61K9/08</further-classification>  
        <further-classification edition="200601120260401B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇蓋薩　伊曼紐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIGUTSA, EMMANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡悅玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, YUEH-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥普特　阿謝爾　理查　凱爾　奧古斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUPT, AXEL RICHARD KARL-AUGUST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　承財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHENG CAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾　莫莉　柯貝特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARR, MOLLY CORBETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加安　帕勞格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARHYAN, PARAG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述適合每週一次給藥之長效胰島素受體促效劑之固定劑量及給藥方案，諸如每週之基礎胰島素-Fc (BIF)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are fixed doses and dosing regimens for long-acting insulin receptor agonists suitable for once-weekly dosing, such as weekly basal insulin-Fc (BIF).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1725" publication-number="202628987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134468</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>上表面放熱型功率半導體模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W40/22</main-classification>  
        <further-classification edition="202601120260323B">H10W40/25</further-classification>  
        <further-classification edition="202601120260323B">H10W76/42</further-classification>  
        <further-classification edition="200601120260323B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤知希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤村敏行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWAMURA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中俊行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種上表面放熱型功率半導體模組，其係依序具備印刷基板、1個或複數個功率半導體封裝體、放熱性積層體、及散熱器者，上述1個或複數個功率半導體封裝體具有：功率半導體晶片，其設置於上述印刷基板上；及放熱板，其設置於上述功率半導體晶片之與上述印刷基板為相反側之面；上述放熱性積層體具有包含壓縮變形構件之層、及包含導熱性構件之層，上述包含壓縮變形構件之層之在25℃下於厚度方向上施加0.7 MPa時之壓縮率為1%以上90%以下，上述包含導熱性構件之層之依據ASTM D5470所測得之25℃下之厚度方向之熱導率為10 W/m・K以上，依據JIS C2110-1所測得之絕緣破壞電壓為4.0 kV以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:散熱器</p>  
        <p type="p">2:放熱性積層體</p>  
        <p type="p">3:功率半導體封裝體</p>  
        <p type="p">4:印刷基板</p>  
        <p type="p">11:鰭片</p>  
        <p type="p">12:平板狀部</p>  
        <p type="p">21:包含導熱性構件之層</p>  
        <p type="p">22:包含壓縮變形構件之層</p>  
        <p type="p">31:放熱板</p>  
        <p type="p">32:密封材</p>  
        <p type="p">33:外引線</p>  
        <p type="p">100:上表面放熱型功率半導體模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1726" publication-number="202626059"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626059.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>克拉司酮與米諾地爾之組合療法</chinese-title>  
        <english-title>CLASCOTERONE AND MINOXIDIL COMBINATION THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/573</main-classification>  
        <further-classification edition="200601120260401B">A61K31/506</further-classification>  
        <further-classification edition="200601120260401B">A61P17/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商卡斯歐皮亞股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASSIOPEA S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榮格　路易吉瑪利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONGO, LUIGI MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑羅尼　馬拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERLONI, MARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾塔利亞尼　克拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOTARIANNI, CLARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾頓　戈登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALTON, GORDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種在需要的受試者中治療落髮之方法，其包含局部投予至受試者有效量之皮甾酮-17α-丙酸酯及有效量之米諾地爾。本揭示進一步提供一種局部外用醫藥調配物，其包含皮甾酮-17α-丙酸酯、米諾地爾、及一種或多種醫藥上可接受的載劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of treating hair loss in a subject in need thereof, comprising topically administering to the subject an effective amount of cortexolone-17α-propionate and an effective amount of minoxidil. The present disclosure further provides a topical pharmaceutical formulation comprising cortexolone -17α-propionate, minoxidil, and one or more pharmaceutically acceptable carriers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1727" publication-number="202628955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134487</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用人工智慧對製造設備態樣進行分類</chinese-title>  
        <english-title>CLASSIFICATION OF ASPECTS OF MANUFACTURING EQUIPMENT USING ARTIFICIAL INTELLIGENCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P95/00</main-classification>  
        <further-classification edition="200601120260325B">G05B13/02</further-classification>  
        <further-classification edition="202301120260325B">G06N3/04</further-classification>  
        <further-classification edition="202301120260325B">G06N3/09</further-classification>  
        <further-classification edition="202301120260325B">G06N3/096</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴提亞　新哈斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATIA, SIDHARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞胡納森　安恩善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAGHUNATHAN, ANANTHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拜恩　史蒂芬愛德華多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BABAYAN, STEVEN EDUARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包含產生或接收AI模型的輸入。該輸入包含一組類別的描述，該組類別是製造系統的參數或元件可能屬於的類別。該輸入進一步包含多個實例，每個實例包含參數或元件名稱，以及該參數或元件所屬的類別指示。該輸入還包含待根據該組類別進行分類的目標參數或元件的名稱。該方法進一步包含使用AI模型處理該輸入以產生包含與目標參數或元件相關的類別的輸出。該方法進一步包含根據與目標參數或元件相關的類別執行更正行動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes generating or receiving an input for an AI model. The input includes a description of a set of categories to which a parameter or component of a manufacturing system may belong. The input further includes a number of examples each including a parameter or component name and an indication of which category of the set of categories the parameter or component belongs to. The input further includes a name of a target parameter or component to be categorized according to the set of categories. The method further includes processing the input using the AI model to generate an output including a category associated with the target parameter or component. The method further includes performing a corrective action in view of the category associated with the target parameter or component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400B:方法</p>  
        <p type="p">410:方塊</p>  
        <p type="p">412:方塊</p>  
        <p type="p">414:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1728" publication-number="202628153"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628153.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍵帽升降機構及長矩形按鍵結構</chinese-title>  
        <english-title>KEYCAP LIFTING MECHANISM AND LONG RECTANGULAR KEYSWITCH STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01H13/10</main-classification>  
        <further-classification edition="200601120260327B">H01H13/14</further-classification>  
        <further-classification edition="200601120260327B">H01H13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝銘元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡柏偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鍵帽升降機構，包含第一支架及第二支架。該第一支架包含長臂及自此長臂突出延伸的複數個支臂。該第二支架包含長臂及自此長臂突出延伸的複數個支臂。該第一支架及該第二支架經由這些支臂繞著樞轉軸線相互樞接，該些支臂沿該樞轉軸線交錯排列。該第一支架及該第二支架沿該樞轉軸線共同形成二支撐結構及位於其間的中間支撐結構。該中間支撐結構相對兩側的支臂未與位於外側的相鄰支臂樞接。一種長矩形按鍵結構，包含底板、鍵帽及前述鍵帽升降機構。一種長矩形按鍵結構，其鍵帽垂直遮蓋部分其開關電路板不同層電路的電連接結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A keycap lifting mechanism includes a first support and a second support. The first support includes a long arm and a plurality of support arms protruding from the long arm. The second support includes a long arm and a plurality of support arms protruding from the long arm. The first support and the second support are pivotally connected with each other around a pivot axis through the support arms of the first support and the second support that are staggered along the pivot axis. The first support and the second support jointly form two support structures and an intermediate support structure between them. The two support arms on two opposite sides of the intermediate support structure are not pivotally connected with the adjacent support arms outside the intermediate support structure. A long rectangular keyswitch structure includes a base plate, a keycap, and the above keycap lifting mechanism. In a keycap lifting mechanism, its keycap vertically covers part of an electrical connection structure of the circuits on different layers of its switch circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13a:第一支撐結構</p>  
        <p type="p">13b:第二支撐結構</p>  
        <p type="p">13c:中間支撐結構</p>  
        <p type="p">14:第一支架</p>  
        <p type="p">142:第一長臂</p>  
        <p type="p">144:第一支臂</p>  
        <p type="p">152:中軸</p>  
        <p type="p">16:第二支架</p>  
        <p type="p">162:第二長臂</p>  
        <p type="p">164:第二支臂</p>  
        <p type="p">164a:側面</p>  
        <p type="p">170:底孔</p>  
        <p type="p">172:穹孔</p>  
        <p type="p">A1:樞轉軸線</p>  
        <p type="p">D1:長邊方向</p>  
        <p type="p">D2:短邊方向</p>  
        <p type="p">Dv:垂直方向</p>  
        <p type="p">da,db:距離</p>  
        <p type="p">La,Lb,Lc,Wa,Wb,Wc1,Wc2:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1729" publication-number="202628873"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628873.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134497</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在多個處理腔室中排程基板處理</chinese-title>  
        <english-title>SCHEDULING SUBSTRATE PROCESSING OVER MULTIPLE PROCESSING CHAMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P72/00</main-classification>  
        <further-classification edition="200601120260325B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬修　羅尼大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATHEW, RONY DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐伯　安德魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUBER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了與半導體製造廠內生產排程相關的技術。處理腔室可能接收請求以在一時間週期內完成工作負載。該工作負載可以在處理腔室中進行排程，以最大化處理腔室處於睡眠模式的總時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Technologies related to production scheduling within semiconductor fabrication plant(s) are described. Processing chambers may receive requests to complete a workload over a period of time. The workload may be scheduled across the processing chambers to maximize an aggregate time that the processing chambers are in a sleep mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:處理腔室網路</p>  
        <p type="p">202:計算裝置</p>  
        <p type="p">204:排程邏輯</p>  
        <p type="p">206:處理腔室</p>  
        <p type="p">208:排程管理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1730" publication-number="202626017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於遞送核酸分子的脂質奈米顆粒</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K9/51</main-classification>  
        <further-classification edition="202501120260401B">A61K9/127</further-classification>  
        <further-classification edition="200601120260401B">A61K31/7088</further-classification>  
        <further-classification edition="200601120260401B">A61K47/14</further-classification>  
        <further-classification edition="200601120260401B">A61K47/24</further-classification>  
        <further-classification edition="200601120260401B">A61K47/28</further-classification>  
        <further-classification edition="200601120260401B">A61K39/00</further-classification>  
        <further-classification edition="200601120260401B">A61P31/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京劑泰醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州劑泰醫藥科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李蕾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉安東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ANDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉少利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHAOLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用於遞送核酸分子的脂質奈米顆粒、包含其的組合物以及所述脂質奈米顆粒和組合物在製備用於治療疾病的藥物或疫苗中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1731" publication-number="202626719"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626719.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＳＴＩＮＧ抗體及其使用方法</chinese-title>  
        <english-title>ANTI-STING ANTIBODIES AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商紐立慕公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEURIMMUNE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏卡　雷協</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UKA, REXHEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧伯提　達芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBERTI, DAFNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛萊斯沃　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRATHWOHL, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康巴魯茲爾　比諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMBALUZIER, BENOIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼錫　飛利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITSCH, PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫耶斯　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOESE, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格林　詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIMM, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龐特　梅里沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PONT, MELISSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案係關於特異性結合至人類干擾素基因刺激物(STING)之新穎抗體及其抗原結合片段，以及此等抗體及其抗原結合片段用於治療疾病及病症(例如發炎性疾病或自體免疫疾病)之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to novel antibodies and antigen-binding fragments thereof that specifically bind to human stimulator of interferon genes (STING), and uses of these antibodies and antigen-binding fragments thereof for treating diseases and disorders (&lt;i&gt;e.g.&lt;/i&gt;, inflammatory diseases or an autoimmune diseases).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1732" publication-number="202628779"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628779.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10K77/10</main-classification>  
        <further-classification edition="200601120260223B">G09F9/37</further-classification>  
        <further-classification edition="200601120260223B">H01F7/13</further-classification>  
        <further-classification edition="200601120260223B">H02K33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金佳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹章烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JANGYEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鎭宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIN WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電子裝置，包含一顯示設備，該顯示設備為可拉伸的，及一按壓單元，該按壓單元固定於該顯示設備，且將一力施加至該顯示設備，其中，該按壓單元包含：一框架部分；一板狀部分，設置於該框架部分上，且該板狀部分具有磁性；以及一衝程模組，設置於該框架部分及該板狀部分之間，且該衝程模組相對於該框架部分在一第一方向及與該第一方向相交的一第二方向上移動，以及該衝程模組包含一衝程單元，該衝程單元在具有磁性的一第一狀態及不具有磁性的一第二狀態之間切換，並在一第三-1方向上朝向該板狀部分移動，以及在一第三-2方向上遠離該板狀部分移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is an electronic device including a display apparatus which is stretchable and a pressing unit that is fixed to the display apparatus and applies a force to the display apparatus, wherein the pressing unit includes: a frame portion; a plate portion arranged on the frame portion and having magnetism; and a stroke module arranged between the frame portion and the plate portion and which moves in a first direction and a second direction crossing the first direction with respect to the frame portion, and the stroke module includes a stroke unit which is switched between a first state with magnetism and a second state with no magnetism and moves in a third-1 direction toward the plate portion and a third-2 direction away from the plate portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:按壓單元</p>  
        <p type="p">31:板狀部分</p>  
        <p type="p">311:第一區域</p>  
        <p type="p">312:第二區域</p>  
        <p type="p">32:按壓模組</p>  
        <p type="p">321:框架部分</p>  
        <p type="p">322:衝程模組</p>  
        <p type="p">3221:衝程單元</p>  
        <p type="p">3222:移動單元</p>  
        <p type="p">32221:第一移動部分</p>  
        <p type="p">32222:第二移動部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1733" publication-number="202626846"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626846.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯膜、真空成形體或壓空成形體、及真空成形用積層體或壓空成形用積層體、以及該等的用途</chinese-title>  
        <english-title>POLYESTER FILMS, VACUUM-FORMED BODIES OR PRESSURE-FORMED BODIES, LAMINATES FOR VACUUM OR PRESSURE FORMING, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C08G63/16</main-classification>  
        <further-classification edition="200601120260326B">C08G63/183</further-classification>  
        <further-classification edition="200601120260326B">C07C31/20</further-classification>  
        <further-classification edition="200601120260326B">C08J5/22</further-classification>  
        <further-classification edition="200601120260326B">B29C43/08</further-classification>  
        <further-classification edition="200601120260326B">B29C51/36</further-classification>  
        <further-classification edition="200601120260326B">B32B27/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大鐘聚酯製品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELL POLYESTER PRODUCTS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大和製罐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIWA CAN COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三瀬喜之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISE, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出藏剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEGURA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>窪健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種具備優異的真空成形性及／或壓空成形性之聚酯膜等。為了解決該課題，聚酯膜係含有 : &lt;br/&gt;第1聚酯樹脂，係包含對苯二甲酸單元之第1酸單元與包含1,4-丁二醇單元之第1醇單元的聚合物，以及， &lt;br/&gt;第2聚酯樹脂，係含有對苯二甲酸單元的第2酸單元與包含乙二醇單元之第2醇單元的聚合物。 &lt;br/&gt;第1聚酯樹脂之含量A與第2聚酯樹脂之含量B的質量比(A／B)為0.8至10。以昇溫速度10℃／分鐘、測定溫度範圍0℃至300℃進行示差掃描熱量測定時，具有顯示冷結晶化熱量之冷結晶化尖峰，且冷結晶化尖峰之面積為10J／g以上，尖峰頂部溫度為50℃至105℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The problem addressed by the present invention is to provide a polyester film and the like that exhibit excellent vacuum formability and/or pressure formability. &lt;br/&gt;To solve this problem, the polyester film contains: &lt;br/&gt;a first polyester resin, which is a polymer comprising a first acid unit containing a terephthalic acid unit and a first alcohol unit containing a 1,4-butanediol unit; and &lt;br/&gt;a second polyester resin, which is a polymer comprising a second acid unit containing a terephthalic acid unit and a second alcohol unit containing an ethylene glycol unit. &lt;br/&gt;The mass ratio (A/B) of the content A of the first polyester resin to the content B of the second polyester resin is from 0.8 to 10. &lt;br/&gt;When differential scanning calorimetry is performed at a heating rate of 10℃/min and over a measurement temperature range of 0℃ to 300℃, a cold crystallization peak corresponding to cold crystallization heat is observed, the area of the cold crystallization peak is 10 J/g or more, and the peak temperature is from 50℃ to 105℃.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1734" publication-number="202626060"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626060.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>維生素D治療之方法</chinese-title>  
        <english-title>METHODS OF VITAMIN D TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61K31/593</main-classification>  
        <further-classification edition="200601120260331B">A61K31/592</further-classification>  
        <further-classification edition="200601120260331B">A61P13/12</further-classification>  
        <further-classification edition="200601120260331B">A61P5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛爾蘭商歐科愛爾蘭全球控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPKO IRELAND GLOBAL HOLDINGS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾尼克　喬爾　Ｚ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELNICK, JOEL Z.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢夏普　查爾斯　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISHOP, CHARLES W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沛特考維奇　Ｐ　馬汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETKOVICH, P. MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特拉格奈爾　史蒂芬　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRUGNELL, STEPHEN A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示用於治療患有CKD之患者中維生素D不足及繼發性副甲狀腺高能症的方法，所述方法包括投與重複劑量之25-羥基維生素D。所述方法包括以有效地將所述患者之血清25-羥基維生素D含量安全地提高至大於90 ng/ml及/或將所述患者之25-羥基維生素D與24,25-二羥維生素D之血清比控制至小於20的量投與25-羥基維生素D。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for treating vitamin D insufficiency and secondary hyperparathyroidism in patients having CKD comprising administering repeat doses of 25-hydroxyvitamin D are disclosed. The methods comprise administering 25-hydroxyvitamin D in an amount effective to safely raise the patient’s serum 25-hydroxyvitamin D level to greater than 90 ng/ml and/or to control the patient’s serum ratio of 25-hydroxyvitamin D to 24,25-dihydroxyvitamin D to less than 20.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1735" publication-number="202627606"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627606.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯微授精支援裝置、顯微授精支援系統、顯微授精支援程式及卵子保持元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G02B21/00</main-classification>  
        <further-classification edition="200601120260318B">A61B17/43</further-classification>  
        <further-classification edition="200601120260318B">C12M3/00</further-classification>  
        <further-classification edition="200601120260318B">G01N33/48</further-classification>  
        <further-classification edition="200601120260318B">G01N33/483</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＲＣＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>棚瀬将康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANASE, MASAYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有簡便裝置構成之顯微授精支援裝置。本發明提供一種顯微授精支援裝置，其支援將保持於精子注入工具之精子注入由卵子保持元件保持之卵子中之顯微授精，且具備：獲取部，其獲取包含精子注入工具與卵子之相對位置關係之資訊；及控制部，其基於由獲取部獲取到之資訊，控制配置卵子保持元件之載物台之移動，以將精子注入卵子中來進行顯微授精。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯微授精支援系統</p>  
        <p type="p">2:顯微授精支援裝置</p>  
        <p type="p">3:精子注入工具</p>  
        <p type="p">11:載物台</p>  
        <p type="p">12:驅動部</p>  
        <p type="p">13:攝像部</p>  
        <p type="p">14:容器</p>  
        <p type="p">PO:卵子池</p>  
        <p type="p">PS:精子池</p>  
        <p type="p">x:軸</p>  
        <p type="p">y:軸</p>  
        <p type="p">z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1736" publication-number="202627147"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627147.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成膜裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C14/58</main-classification>  
        <further-classification edition="200601120260401B">C23C14/06</further-classification>  
        <further-classification edition="200601120260401B">C23C14/14</further-classification>  
        <further-classification edition="200601120260401B">C23C14/34</further-classification>  
        <further-classification edition="202601120260401B">H10P14/45</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧澤洋次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIZAWA, YOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松中繁樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAKA, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納齊夫　伊凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANACHEV, IVAN PETROV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野晴香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制製程氣體混入其他處理部的成膜裝置。成膜裝置1包括：腔室20；旋轉台31，設置於腔室20內，藉由旋轉而沿著圓周的搬送路徑L循環搬送工件10；成膜部40，使成膜材料堆積於由旋轉台31循環搬送的工件10來進行成膜；氮化處理部50，對包含氮氣的製程氣體進行電漿化，並使堆積於由旋轉台31循環搬送的工件10的成膜材料氮化；內壁部511，設置於氮化處理部50，界定被導入製程氣體並進行電漿處理的處理空間59，且具有與旋轉台31非接觸地相向的開口511a；以及壓力增加板511b，設置於內壁部511的下端，自內壁部511朝向處理空間59延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:工件</p>  
        <p type="p">11:托盤</p>  
        <p type="p">31:旋轉台</p>  
        <p type="p">52:窗構件</p>  
        <p type="p">59:處理空間</p>  
        <p type="p">511:內壁部</p>  
        <p type="p">511a:開口</p>  
        <p type="p">511b:壓力增加板</p>  
        <p type="p">511c:孔</p>  
        <p type="p">511d:延伸前端面</p>  
        <p type="p">C:中心線</p>  
        <p type="p">D1、D2:直徑</p>  
        <p type="p">G2:製程氣體</p>  
        <p type="p">HA:保持區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1737" publication-number="202626260"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626260.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置的狀態評價方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260325B">B24B37/005</main-classification>  
        <further-classification edition="200601120260325B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡瓦德　羅希特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWDE, ROHIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈特龐德　蕭納可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHATPANDE, SHAUNAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村顕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體製造裝置之狀態評價方法包含以下步驟：取得關於前述半導體製造裝置之指定處理參數的複數個基準時間序列資料；取得關於前述半導體製造裝置之前述指定處理參數的評價對象時間序列資料；計算顯示前述複數個基準時間序列資料間之變動的判定基準值；計算顯示前述評價對象時間序列資料對前述複數個基準時間序列資料之各個的偏差之評價值；將前述評價值與前述判定基準值作比較；及當前述評價值比前述判定基準值大時，判定為前述評價對象晶圓處理中之前述處理參數可能有異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">502、504、506、508、510、512、514、516、518、520、522、524、526:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1738" publication-number="202628319"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628319.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線電力轉移</chinese-title>  
        <english-title>WIRELESS POWER TRANSFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260327B">H02J50/12</main-classification>  
        <further-classification edition="201601120260327B">H02J50/80</further-classification>  
        <further-classification edition="202401120260327B">H04B5/72</further-classification>  
        <further-classification edition="202401120260327B">H04B5/79</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史戴林　安東尼爾斯　亞德瑞安　瑪莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STARING, ANTONIUS ADRIAAN MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿葛弗諾弗　阿列克謝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGAFONOV, ALEKSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾特曼　艾迪　葛瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELTMAN, EDDY GERRIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊班　哈吉　達曼　加森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBEN HAJ DAHMEN, GHASSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電力接收器(105)包含一接收器線圈(107)，該接收器線圈從一電力傳輸器(101)所產生的一電磁電力轉移信號提取電力。一可變負載(511)對該接收器線圈(107)施加調變負載。一資料傳輸器(509)藉由控制該可變負載(511)在通訊時間間隔期間對該電力轉移信號做負載調變，來傳輸資料符號到該電力傳輸器(101)，該等通訊時間間隔由非通訊時間間隔穿插，在該等非通訊時間間隔期間沒有資料被傳輸到該電力傳輸器(101)。該資料傳輸器(509)變化該可變負載(511)，以對各資料符號施加一調變負載型樣，其中各可能資料符號值的該調變負載型樣係不同的。該資料傳輸器控制該可變負載(511)在非通訊時間間隔期間施加一重複負載變化型樣。該重複負載變化型樣具有一功率譜密度，該功率譜密度與該等調變負載型樣的功率譜密度相差小於10dB，且因此頻譜形狀密切匹配。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power receiver (105) comprises a receiver coil (107) extracting power from an electromagnetic power transfer signal generated by a power transmitter (101). A variable load (511) applies modulation loading to the receiver coil (107). A data transmitter (509) transmits data symbols to the power transmitter (101) by controlling the variable load (511) to load modulate the power transfer signal during communication time intervals that are interspersed by non-communication time intervals during which no data is transmitted to the power transmitter (101). The data transmitter (509) varies the variable load (511) to apply a modulation loading pattern for each data symbol where the modulation loading pattern for each possible data symbol value is different. The data transmitter controls the variable load (511) to apply a repeating loading variation pattern during non-communication time intervals. The repeating loading variation pattern has a power spectral density differing less than 10dB from that of the modulation loading patterns and thus the spectral shapes are closely matching.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:電力接收器</p>  
        <p type="p">107:輸入電路；接收器線圈；電感器；電力接收線圈</p>  
        <p type="p">501:電力接收器控制器</p>  
        <p type="p">503:輸入電路；電容器</p>  
        <p type="p">505:負載</p>  
        <p type="p">507:開關</p>  
        <p type="p">509:資料傳輸器</p>  
        <p type="p">511:可變負載；調變負載</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1739" publication-number="202626710"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626710.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向ＩＬ—３１之抗體</chinese-title>  
        <english-title>ANTIBODIES TARGETING IL-31</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/24</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P17/04</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商諾華公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVARTIS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喜碧　里吉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEBE, REGIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科畢葛　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLBINGER, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科維瑞克　濟瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOVARIK, JIRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉合軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HEJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆勒　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULLER, KATHRIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅迪格　本</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROEDIGER, BEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅狄恩　珍　麥可　瑞恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RONDEAU,JEAN-MICHEL, RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於與IL-31結合的抗體，包括單特異性和多特異性，例如雙特異性抗體；產生該等抗體之方法；包含該等抗體的藥物組成物；以及使用該等抗體之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to antibodies that bind to IL-31, including monospecific and multispecific e.g., bispecific antibodies, methods of producing the antibodies, pharmaceutical compositions comprising the antibodies, and methods of using the antibodies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1740" publication-number="202627517"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627517.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於目標之地理位置的多點定位</chinese-title>  
        <english-title>MULTILATERATION FOR GEOLOCATION OF TARGETS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G01S5/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱奧斯工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAOS INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬爾　哈利　包恩　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARR, HARRY BOURNE JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAY, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍迪亞克　賈斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HODIAK, JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅斯克　馬克　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSKER, MARK JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞廷　雷恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RETTING, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多安　桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOAN, SON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道爾　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWER, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於判定至一目標之一距離之系統、方法及電腦程式。一種系統可包含經組態用於接收來自該目標之一第一信號之一第一接收器及經組態用於接收來自該目標之一第二信號之一第二接收器，該第二接收器與該第一接收器時間同步。一可程式化處理器可基於該第一信號在該第一接收器處及該第二信號在該第二接收器處之到達時間來判定至該目標之一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are systems, methods, and computer programs for determining a range to a target. A system can include a first receiver configured for receiving a first signal from the target and a second receiver configured for receiving a second signal from the target, the second receiver time-synchronized with the first receiver. A programmable processor can determine a range to the target based on arrival times of the first signal at the first receiver and the second signal at the second receiver.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:目標</p>  
        <p type="p">100:系統</p>  
        <p type="p">110:第一接收器</p>  
        <p type="p">112:第一信號</p>  
        <p type="p">120:第二接收器</p>  
        <p type="p">122:第二信號</p>  
        <p type="p">130:電腦系統/可程式化處理器</p>  
        <p type="p">132:中繼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1741" publication-number="202626534"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626534.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水處理設備、控制裝置、控制方法及程式</chinese-title>  
        <english-title>WATER TREATMENT FACILITY, CONTROL DEVICE, CONTROL METHOD, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260326B">C02F9/00</main-classification>  
        <further-classification edition="202301120260326B">C02F1/70</further-classification>  
        <further-classification edition="200601120260326B">G06F9/06</further-classification>  
        <further-classification edition="202401120260326B">G06Q50/06</further-classification>  
        <further-classification edition="200601320260326B">C02F101/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧口佳介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIGUCHI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村勇規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田響介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於防止處理水的品質降低。 &lt;br/&gt;解決手段為：具有：複數之反應槽400-1、400-2，包含尿素且彼此不同的被處理水分別流入其中；藥品注入部200，經由一條藥品注入管路而將藥品注入反應槽400-1、400-2；水質計500-1、500-2，測定分別儲存在反應槽400-1、400-2或者流入其中的被處理水的水質；及控制裝置100，基於水質計500-1、500-2所測定的水質，而算出反應槽400-1、400-2各自需要的藥品的注入條件，再控制藥品注入部200所注入的藥品的注入量，以滿足所算出的各項藥品的所有注入條件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to prevent deterioration in the quality of a treated water. &lt;br/&gt;The invention comprises a plurality of reaction chambers 400-1 and 400-2 into which flow different waters to be treated each containing urea, a chemical injection section 200 which injects chemicals into the reaction chambers 400-1 and 400-2 via a single chemical injection line, water quality meters 500-1 and 500-2 which measure the water quality of the waters to be treated that are stored in or flow into the reaction chambers 400-1 and 400-2 respectively, and a control device 100 which calculates the required chemical injection conditions for the reaction chambers 400-1 and 400-2 based on the water quality measured by the water quality meters 500-1 and 500-2 respectively, and controls the amount of chemicals injected by the chemical injection section 200 such that the calculated injection conditions are satisfied for all chemicals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水處理設備</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">200:藥品注入部</p>  
        <p type="p">300:藥品注入管路</p>  
        <p type="p">310-1,310-2:分歧管路</p>  
        <p type="p">400-1,400-2:反應槽</p>  
        <p type="p">500-1,500-2:水質計</p>  
        <p type="p">510-1,510-2:溫度計</p>  
        <p type="p">520-1,520-2:流量計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1742" publication-number="202627485"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627485.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134624</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試處理器</chinese-title>  
        <english-title>TEST HANDLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G01R1/04</main-classification>  
        <further-classification edition="200601120260319B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商泰克元有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種測試處理器。 具體而言，根據本發明之一實施例，包括：一測試插座導引器；以及一工作壓板，該工作壓板當電子組件放置於該測試插座導引器上時，用於將該電子組件加壓至該測試插座導引器，以使電子組件與該測試插座導引器電性連接，該工作壓板，包括：壓板基座；壓板蓋板，該壓板蓋板與該壓板基座結合，並形成有板貫穿孔；壓頭，該壓頭朝向該電子組件可進退地配置於該板貫穿孔中得以進出該板貫穿孔而設置；以及壓板彈性部件，該壓板彈性部件彈性支撐該壓頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a test handler. Specifically, according to one embodiment of the present invention, it includes: a test socket guide; and a working pressure plate, which is used to press an electronic component onto the test socket guide when the electronic component is placed on the test socket guide, so as to electrically connect the electronic component to the test socket guide. The working pressure plate includes: a pressure plate base; a pressure plate cover, which is combined with the pressure plate base and formed with a plate through hole; a pressure head, which is movably disposed in the plate through hole and can advance and retreat toward the electronic component to extend out of or retract into the plate through hole; and a pressure plate elastic component, which elastically supports the pressure head.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試處理器</p>  
        <p type="p">100:測試插座導引器</p>  
        <p type="p">110:插座基座</p>  
        <p type="p">120:插座蓋板</p>  
        <p type="p">125:插座壓入銷槽部</p>  
        <p type="p">130:浮動板</p>  
        <p type="p">160:套筒定位銷</p>  
        <p type="p">200:工作壓板</p>  
        <p type="p">210:壓板基座</p>  
        <p type="p">220:壓板蓋板</p>  
        <p type="p">222:壓板對準銷部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1743" publication-number="202627486"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627486.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試插座導向裝置</chinese-title>  
        <english-title>TEST SOCKET GUIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G01R1/04</main-classification>  
        <further-classification edition="200601120260319B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商泰克元有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種測試插座導向裝置。具體地，根據本發明一實施例，提供一種測試插座導向裝置，包括：插座底座；插座蓋，與該插座底座結合，形成可插入電子元件的插座開口部；浮動板，在該插座底座上可升降設置，並形成可安插該電子元件的插座安插部；以及彈性支撐體，設置在該插座底座和該浮動板之間，以彈性支撐該浮動板，該插座底座包括：插座銷，當該電子元件安插在該插座安插部上並通過外力下降時，該插座銷貫穿該插座安插部並與該電子元件電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a test socket guide. Specifically, according to an embodiment of the present invention, a test socket guide is provided, comprising: a socket base; a socket cover that is combined with the socket base to form a socket opening portion into which an electronic component can be inserted; a floating plate that is provided on the socket base so as to be capable of ascending and descending, and that forms a socket insertion portion into which the electronic component can be inserted; and an elastic support body that is provided between the socket base and the floating plate to elastically support the floating plate, wherein the socket base comprises: socket pins that, when the electronic component is inserted into the socket insertion portion and descends by an external force, penetrate the socket insertion portion and become electrically connected to the electronic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:測試插座導向裝置</p>  
        <p type="p">110:插座底座</p>  
        <p type="p">120:插座蓋</p>  
        <p type="p">130:浮動板</p>  
        <p type="p">160:插座對準銷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1744" publication-number="202629013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134631</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中介層及半導體封裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/62</main-classification>  
        <further-classification edition="202601120260323B">H10W72/20</further-classification>  
        <further-classification edition="200601120260323B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田貴志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於提供一種可防止內層構造體與外層構造體之剝離的中介層。&lt;br/&gt; 為此，本揭示的中介層係具備：內層構造體(7)，包含至少1層的內層配線層；第1外層構造體(5)，配置在前述內層構造體的第1面上；及第2外層構造體，配置在前述內層構造體的第2面上，其中&lt;br/&gt; 前述第1外層構造體(5)及前述第2外層構造體係具有比前述內層構造體(7)高的剛性，&lt;br/&gt; 且具備有：從前述內層構造體的前述第1面側朝向前述內層構造體的內側填充有前述第1外層構造體的一部分之填充部(21b)；及/或從前述內層構造體的前述第2面側朝向前述內層構造體的內側填充有前述第2外層構造體的一部分之填充部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:外部連接介層孔</p>  
        <p type="p">5:第1外層構造體</p>  
        <p type="p">6:第2絕緣樹脂層</p>  
        <p type="p">7:內層構造體</p>  
        <p type="p">8:第1絕緣樹脂層</p>  
        <p type="p">9:介層孔</p>  
        <p type="p">10:配線</p>  
        <p type="p">11:第2外層構造體</p>  
        <p type="p">12:第2絕緣樹脂層</p>  
        <p type="p">14:外部連接介層孔</p>  
        <p type="p">15:焊墊</p>  
        <p type="p">16:第1連接端子</p>  
        <p type="p">17:第2連接端子</p>  
        <p type="p">21b:填充部</p>  
        <p type="p">100:中介層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1745" publication-number="202626460"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626460.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送設備</chinese-title>  
        <english-title>TRANSPORT FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B65G1/137</main-classification>  
        <further-classification edition="200601120260331B">B65G1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉永和治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINAGA, KAZUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下雄司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, YUUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種搬送設備100，具備：搬送車1，搬送搬送對象物B；行走區2，供搬送車1行走；作業工作站3，進行對搬送車1所搬送來之搬送對象物B的作業；及移交工作站4，在與搬送車1之間進行搬送對象物B的移交。搬送車1具備：載置部，供搬送對象物B載置；及移載裝置，使已載置在載置部之搬送對象物B沿著特定的移載方向移動。搬送車1在行走於移交工作站4與作業場所30之間的情況下，是將搬送對象物B配置在載置部中的基準位置。搬送車1在作業場所30中，是使移載裝置動作，而將搬送對象物B配置到與基準位置不同之作業用位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搬送車</p>  
        <p type="p">2:行走區</p>  
        <p type="p">3:作業工作站</p>  
        <p type="p">31:收納部</p>  
        <p type="p">32:作業主體</p>  
        <p type="p">4:移交工作站</p>  
        <p type="p">41:搬入工作站</p>  
        <p type="p">42:搬出工作站</p>  
        <p type="p">10:控制系統</p>  
        <p type="p">30:作業場所</p>  
        <p type="p">40:移交場所</p>  
        <p type="p">100:搬送設備</p>  
        <p type="p">B:搬送對象物</p>  
        <p type="p">G:物品</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1746" publication-number="202628207"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628207.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燃料電池系統及其運作方法和加熱空氣的循環方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260401B">H01M8/04</main-classification>  
        <further-classification edition="201601120260401B">H01M8/04007</further-classification>  
        <further-classification edition="201601120260401B">H01M8/04029</further-classification>  
        <further-classification edition="201601120260401B">H01M8/04225</further-classification>  
        <further-classification edition="201601120260401B">H01M8/0432</further-classification>  
        <further-classification edition="201601120260401B">H01M8/04701</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本輝爾康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON FILCON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野祐司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤仙理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITOH, SENRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]在燃料電池的運作前加熱電池室的空氣加熱並熔解凍結的水。 &lt;br/&gt;　　[解決手段]燃料電池系統(100、200)，具備：由隔壁(11-16)畫定的電池室(60)、設置於電池室(60)的燃料電池(1)、通過設於隔壁(11-16)之中的區隔隔壁(11、13)的至少一開口(11a、13a)及另一開口(11b、13b)並連通至電池室(60)的導管(20a、20b)、及送出加熱空氣的預熱器(3)。至少電池室(60)、一開口(11a、13a)及另一開口(11b、13b)、還有導管(20a、20b)，構成從預熱器(3)送出的加熱空氣的暖氣循環路(30A、30B)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:預熱器</p>  
        <p type="p">8:開關裝置</p>  
        <p type="p">11b:另一開口</p>  
        <p type="p">13:第3隔壁(區隔隔壁)</p>  
        <p type="p">14:第4隔壁</p>  
        <p type="p">15:第5隔壁</p>  
        <p type="p">16:第6隔壁</p>  
        <p type="p">20a:導管</p>  
        <p type="p">30A:暖氣循環路</p>  
        <p type="p">43:發熱要素</p>  
        <p type="p">44:發熱要素</p>  
        <p type="p">100:燃料電池系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1747" publication-number="202626116"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626116.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合傳熱元件的紫外線輻照裝置</chinese-title>  
        <english-title>ULTRAVIOLET IRRADIATION APPARATUS WITH INTEGRAL THERMAL TRANSFER ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">A61L2/10</main-classification>  
        <further-classification edition="202301120260324B">C02F1/32</further-classification>  
        <further-classification edition="201501120260324B">F21V29/00</further-classification>  
        <further-classification edition="201501120260324B">F21V29/508</further-classification>  
        <further-classification edition="201501120260324B">F21V29/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商埃奎森斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AQUISENSE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫蘭　衛斯理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIN, WESLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恰爾魯克　喬納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CZARUK, JONATHON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕幹　珍妮佛　戈德溫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAGAN, JENNIFER GODWIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瓦爾　奧利弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAWAL, OLIVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種輻照裝置，其具有內部輻照反應器和被配置為通過輻照腔室的下壁中的開口發射紫外光的UV-LED發射源，用於液體流入和流出所述輻照反應器的第一液體端口和第二液體端口。第一連接端口連接到液體供應源或液體使用裝置，並且由具有外側壁的金屬管構成，所述外側壁沿其長度具有平坦部分。所述金屬管的外側壁的平坦部分提供了熱接觸表面，當其與UV-LED源的發熱表面對置接觸時，為UV-LED源產生的熱量提供散熱器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An irradiation apparatus having an interior irradiation reactor and a UV-LED emitting source configure to emit UV light through an opening in a lower wall of the irradiation chamber, a first liquid port and a second liquid port for liquid flow into and out of the irradiation reactor. A first connection port connects to either a liquid supply source or a liquid usage device, and consists of a metal tubing with an outer sidewall with a flattened portion along its length. The flattened portion of the outer sidewall of the metal tubing provides a thermal contact surface that when placed into confronting contact with a heat-emitting surface of the UV-LED source provides a heatsink for the heat generated by the UV-LED source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:輻照裝置</p>  
        <p type="p">11:第一連接端口</p>  
        <p type="p">12:第二連接端口</p>  
        <p type="p">10:反應器主體，輻照腔室</p>  
        <p type="p">20:基座組件</p>  
        <p type="p">21:基座主體</p>  
        <p type="p">32:過渡連接件</p>  
        <p type="p">36:擴口段</p>  
        <p type="p">70:金屬管</p>  
        <p type="p">78:管引導件</p>  
        <p type="p">80:電子殼體組件</p>  
        <p type="p">82:螺釘</p>  
        <p type="p">83:固定夾</p>  
        <p type="p">93:電源和控制接線盒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1748" publication-number="202625980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>癌症之免疫治療</chinese-title>  
        <english-title>IMMUNOLOGIC TREATMENT OF CANCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">A61B18/02</main-classification>  
        <further-classification edition="200601120260327B">A61K45/06</further-classification>  
        <further-classification edition="200601120260327B">A61K39/395</further-classification>  
        <further-classification edition="200601120260327B">A61K38/19</further-classification>  
        <further-classification edition="200601120260327B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＲＦＥＭＢ控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RFEMB HOLDINGS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧尼克　蓋瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONIK, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米艾蘇　吉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIESSAU, JIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保斯崔克　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOSTWICK, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供透過免疫化學治療劑與消融(ablation)技術的組合來治療癌症的新穎組合物、方法以及裝置。這些組合物可包括有助於引起免疫反應來治療腫瘤的免疫查核點抑制劑、細胞介素與核酸藥物。除了各種消融技術外，投予此等組合物提供癌細胞抗原呈遞至免疫系統和癌症的免疫靶向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are new compositions, methods, and devices to treat cancer through a combination of immunologic chemotherapeutic agents and ablation techniques. These compositions can include immune checkpoint inhibitors, cytokines and nucleic acid drugs that aid in eliciting an immune response to treat the tumor. The administration of these compositions in addition to various ablating techniques provides a presentation of the cancer cell antigens to the immune system and the immunologic targeting of the cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1749" publication-number="202626711"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626711.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134664</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含離子濃度依賴之抗原結合域的抗體、Fc區變體、IL-8結合抗體與其用途</chinese-title>  
        <english-title>ANTIBODIES COMPRISING AN ION CONCENTRATION DEPENDENT ANTIGEN-BINDING DOMAIN, FC REGION VARIANTS, IL-8-BINDING ANTIBODIES, AND USES THEROF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C07K16/24</main-classification>  
        <further-classification edition="200601120260331B">A61K39/395</further-classification>  
        <further-classification edition="200601120260331B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中外製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井川智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGAWA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田敦彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, ATSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原谷健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARAYA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橘達彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIBANA, TATSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩柳有起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAYANAGI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀裕次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORI, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一非排他的態樣提供一種分子，其係從能以離子濃度依賴方式結合於抗原的抗體改進而得。另一非排他的態樣提供安全及更有利的Fc區變體，其對於預先存在的ADA的結合降低。另一非排他的態樣提供新穎的IL-8抗體，其作為藥物係優越的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One nonexclusive aspect provides molecules further improved from antibodies that can bind to antigens in an ion concentration-dependent manner. An alternative nonexclusive aspect provides safe and more advantageous Fc region variants that have decreased binding to pre-existing ADA. An alternative nonexclusive aspect provides novel IL-8 antibodies that are superior as pharmaceuticals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1750" publication-number="202627042"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627042.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶性樹脂組合物及使用其之成形品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C09K19/20</main-classification>  
        <further-classification edition="200601120260326B">C08L67/03</further-classification>  
        <further-classification edition="200601120260326B">C08K7/26</further-classification>  
        <further-classification edition="200601120260326B">C08K7/28</further-classification>  
        <further-classification edition="200601120260326B">C08K3/22</further-classification>  
        <further-classification edition="200601120260326B">C08K5/21</further-classification>  
        <further-classification edition="200601120260326B">C08L101/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寶理塑料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPLASTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢上貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGAMI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安住竜太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZUMI, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磯野弘明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISONO, KOMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長永昭宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAE, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供流動性、介電性質、強度及分散性優異之液晶性樹脂組合物及使用其之成形品。一種液晶性樹脂組合物，其係包含：（A）液晶性樹脂、（B）玻璃纖維及（C）中空填料之液晶性樹脂組合物，在前述液晶性樹脂組合物的總量100質量%中，前述（B）玻璃纖維的含量為7～23質量%，前述（C）中空填料的含量為2～13質量%，構成前述（B）玻璃纖維之玻璃的在測量頻率1GHz中之相對介電常數為6以下，前述（C）中空填料的粒徑（D50）為大於20μm且55μm以下，前述（C）中空填料的粒徑（D90）為60μm以下，前述（C）中空填料的抗壓強度為85MPa以上且200MPa以下，前述（C）中空填料的基於JIS Z 8835所測量到之剪切黏著力C為0.1KPa以上且小於0.5kPa。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1751" publication-number="202625985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聲帶治療用植入物以及聲帶治療系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">A61F2/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松島康二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>公立大學法人橫濱市立大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUBLIC UNIVERSITY CORPORATION YOKOHAMA CITY UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商若吉製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKAYOSHI MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松島康二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>折舘伸彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIDATE, NOBUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西畑博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIHATA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村雅喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聲帶治療用植入物，係安裝於聲帶從而使用，並且具備：板，係藉由切口加工從而形成；以及間隔件，係安裝於板。板係具有：擠壓部；基部，係連接至擠壓部的第一端部；以及間隔件安裝部，係連接至擠壓部的第二端部。間隔件係具有：支承部；以及柱部，係從支承部延伸，並且被固定於間隔件安裝部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:板</p>  
        <p type="p">200,200A,200B,200C:間隔件</p>  
        <p type="p">210:支承部</p>  
        <p type="p">211:貫穿孔</p>  
        <p type="p">220:柱部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1752" publication-number="202628757"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628757.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光顯示裝置</chinese-title>  
        <english-title>LIGHT EMITTING DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10K59/12</main-classification>  
        <further-classification edition="202301120251229B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴恩智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, EUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘明昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAN, MYUNGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炅旼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鎔熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONGHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露的一個實施例，發光顯示裝置包括：基板、驅動元件層、第一平坦化層、第二平坦化層、陽極電極、發光層與陰極電極。基板包含多個像素。驅動元件層設置於基板上。第一平坦化層設置於驅動元件層上。第二平坦化層設置於第一平坦化層上的各個像素內部。陽極電極設置於第二平坦化層上。發光層設置於第一平坦化層、第二平坦化層與陽極電極上。陰極電極設置於發光層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light emitting display device according to an example of the present disclosure comprises: a substrate, a driving element layer, a first planarization layer, a second planarization layer, an anode electrode, an emission layer and a cathode electrode. The substrate includes a plurality of pixels. The driving element layer is disposed on the substrate. The first planarization layer is disposed on the driving element layer. the second planarization layer is disposed within each pixel on the first planarization layer. The anode electrode is disposed on the second planarization layer. The emission layer is disposed on the first planarization layer, the second planarization layer and the anode electrode. The cathode electrode is disposed on the emission layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">ANO:陽極電極</p>  
        <p type="p">CAT:陰極電極</p>  
        <p type="p">CF,CF(R),CF(G):彩色濾光片</p>  
        <p type="p">DA:半導體層</p>  
        <p type="p">DD:汲極電極</p>  
        <p type="p">DG:閘極電極</p>  
        <p type="p">DH:汲極接觸孔</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">DS:源極電極</p>  
        <p type="p">DT:驅動薄膜電晶體</p>  
        <p type="p">EL:發光層</p>  
        <p type="p">GI:閘極絕緣層</p>  
        <p type="p">IL:中間絕緣層</p>  
        <p type="p">OLE:發光二極體</p>  
        <p type="p">PAS:鈍化層</p>  
        <p type="p">PH:像素接觸孔</p>  
        <p type="p">PL1:第一平坦化層</p>  
        <p type="p">PL2:第二平坦化層</p>  
        <p type="p">SA:半導體層</p>  
        <p type="p">SD:汲極電極</p>  
        <p type="p">SG:閘極電極</p>  
        <p type="p">SL:掃描線</p>  
        <p type="p">ST:開關薄膜電晶體</p>  
        <p type="p">SS:源極電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1753" publication-number="202626849"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626849.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134714</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活性酯樹脂及其製造方法、環氧樹脂組成物、環氧樹脂組成物的硬化物、預浸體、樹脂片材、積層板以及電路基板用材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G63/199</main-classification>  
        <further-classification edition="200601120260401B">C08G63/78</further-classification>  
        <further-classification edition="200601120260401B">C08G59/42</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">C08J5/24</further-classification>  
        <further-classification edition="200601120260401B">B32B27/38</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日鐵化學材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宗正浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOH, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種所獲得的活性酯的溶劑溶解性優異、進而於硬化物中顯現出優異的耐熱性與介電特性的樹脂組成物。一種活性酯樹脂，包含：聚芳基氧基單元、單芳基氧基單元及聚芳基羰基單元，所述活性酯樹脂的特徵在於：聚芳基氧基單元含有下述式（1）所表示的芳香族多元羥基化合物來源的結構，聚芳基氧基單元中的下述式（1）所表示的芳香族多元羥基化合物來源的結構的含量超過10莫耳%且為60莫耳%以下。 &lt;br/&gt;&lt;img align="absmiddle" height="313px" width="495px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;此處，R&lt;sup&gt;1&lt;/sup&gt;分別獨立地表示碳數1～8的烴基。i為0～3的整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1754" publication-number="202626712"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626712.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＩＬ—１７結合蛋白、組成物、及其使用方法</chinese-title>  
        <english-title>IL-17 BINDING PROTEINS, COMPOSITIONS, AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/24</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商派拉岡醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARAGON THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關　拜倫　華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAN, BYRON HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里歐斯　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIOS, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米利根　雅各　柯爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLIGAN, JACOB COLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐　傑森　利成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JASON ZEE SEUG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏席恩　胡桑　席夏姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHEEN, HUSSAM HISHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄尼洛　羅柏特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DI NIRO, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費拉拉　福爾圖納托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERRARA, FORTUNATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊拉斯莫斯　麥可　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERASMUS, MICHAEL FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德里格茲　卡尼洛　路易斯　安東尼奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGUEZ-CARNERO, LUIS ANTONIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉古納坦　戈帕蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAGHUNATHAN, GOPALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">IL-17結合蛋白、相關組成物及相關使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">IL-17-binding proteins, related compositions, and related methods of use.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1755" publication-number="202627472"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627472.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於監測尿液狀態的系統</chinese-title>  
        <english-title>SYSTEM FOR MONITORING URINE STATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G01N33/493</main-classification>  
        <further-classification edition="200601120260318B">G01G17/04</further-classification>  
        <further-classification edition="200601120260318B">G01G19/18</further-classification>  
        <further-classification edition="200601120260318B">G01G23/18</further-classification>  
        <further-classification edition="200601120260318B">H04N7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巽晨國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLITRONIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游雅仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YA-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於監測液體容器中尿液的系統，包括一吊架、一秤重機、一照相機、一控制單元及一通訊模組。該吊架用於懸掛該流體容器。該秤重機測量懸掛在該吊架上的流體容器之重量。該照相機拍攝該流體容器之影像。該控制單元控制該照相機去拍攝該流體容器之影像。該通訊模組傳輸包括該重量及該影像中的至少一種的尿液資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for monitoring urine in a fluid container, including a hanger, a weight scale, a camera, a controlling unit and a communication module. The hanger is for hanging the fluid container. The weight scale measures weight of the fluid container hung by the hanger. The camera takes an image of the fluid container. The controlling unit controls the camera to take the image of the fluid container. The communication module transmits urine information including at least one of the weight and the image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:感測器</p>  
        <p type="p">111:主控制單元</p>  
        <p type="p">112:照相機</p>  
        <p type="p">113:通訊模組</p>  
        <p type="p">114:秤重機</p>  
        <p type="p">115:吊架</p>  
        <p type="p">2:流體容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1756" publication-number="202627085"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627085.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由阿爾戈（Ａｒｇｏｎａｕｔｅ）蛋白質靶向切割核酸</chinese-title>  
        <english-title>TARGETED CLEAVAGE OF NUCLEIC ACIDS BY ARGONAUTE PROTEINS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N15/10</main-classification>  
        <further-classification edition="200601120260401B">C12N9/22</further-classification>  
        <further-classification edition="201801120260401B">C12Q1/686</further-classification>  
        <further-classification edition="201801120260401B">C12Q1/6869</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商吉尼特維斯特智慧財產有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENETWISTER IP B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾克　麥可　約瑟夫斯　特雷西亞　範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EIJK, MICHAEL JOSEPHUS THERESIA VAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雷拉　史蒂芬努斯　約翰內斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERREIRA, STEPHANUS JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧泰因　馬爾傑　詹內克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUTEIJN, MAARTJE JANNEKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼蘭德　哈門　巴特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIJLAND, HARMEN BART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>範　沙伊克　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN SCHAIK, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於使用阿爾戈蛋白質(Argonaute protein)由dsDNA產生ssDNA引導分子的方法。該等引導分子可適用於如使用阿爾戈蛋白質選擇性地減少定序庫中之重複序列等應用。本發明亦關於切割核酸分子的方法、減少包含目標序列之核酸分子之數目的方法以及選擇性地富集樣品(如DNA定序庫)中之核酸分子及/或將該等核酸分子定序的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for generating ssDNA guides from dsDNA using an Argonaute protein. Said guides may be useful in applications, like selectively reducing repetitive sequences in sequencing libraries using Argonaute proteins. The invention further relates to a method for cleaving a nucleic acid molecule, a method for reducing the number of nucleic acid molecules comprising a target sequence and a method for selectively enriching and/or sequencing nucleic acid molecules in a sample, like a DNA sequencing library.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1757" publication-number="202628737"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628737.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250916B">H10H29/39</main-classification>  
        <further-classification edition="202501120250916B">H10H29/37</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, YOUNGIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李慧美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYEMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李素榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置包含電源線和驅動電晶體，分別包含第一電極和第二電極的多個發光元件，部分包圍多個發光元件側表面的第一平坦化層，設置於第一平坦化層上並配置為連接第一電極與驅動電晶體的第一連接電極，設置於第一平坦化層上的第二連接電極，設置於第一連接電極與第二連接電極上的鈍化層及設置於鈍化層上並配置為部分地圍繞該些發光元件之側表面的第二平坦化層，其中，鈍化層曝露出設置為圍繞其中一個發光元件之側表面的一部分之第一連接電極之末端；其中，第二平坦化層覆蓋第一連接電極之末端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The display device includes a power line and a driving transistor, a plurality of light-emitting elements respectively including a first electrode and a second electrode, a first planarization layer partially surrounding side surfaces of the plurality of light-emitting elements, a first connection electrode disposed on the first planarization layer and configured to connect the first electrode and the driving transistor, a second connection electrode disposed on the first planarization layer, a passivation layer disposed on the first connection electrode and the second connection electrode and a second planarization layer disposed on the passivation layer and configured to partially surround the side surfaces of the plurality of light-emitting elements, wherein the passivation layer exposes an end of the first connection electrode disposed to surround a part of a side surface of one of the light-emitting element, and wherein the second planarization layer covers the end of the first connection electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">LED:發光元件</p>  
        <p type="p">120:第一發光元件</p>  
        <p type="p">121:第一半導體層</p>  
        <p type="p">122:發光層</p>  
        <p type="p">123:第二半導體層</p>  
        <p type="p">124:第一電極</p>  
        <p type="p">125:第二電極</p>  
        <p type="p">126:鈍化膜</p>  
        <p type="p">CA1:第一接觸區域</p>  
        <p type="p">CA2:第二接觸區域</p>  
        <p type="p">APA:照明檢測區域</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:緩衝層</p>  
        <p type="p">112:閘極絕緣層</p>  
        <p type="p">113a:第一層間絕緣層</p>  
        <p type="p">113b:第二層間絕緣層</p>  
        <p type="p">114a:第一鈍化層</p>  
        <p type="p">114b:第二鈍化層</p>  
        <p type="p">115:覆蓋層</p>  
        <p type="p">116:接合層</p>  
        <p type="p">117a:第一平坦化層</p>  
        <p type="p">117b:第二平坦化層</p>  
        <p type="p">118:堤岸</p>  
        <p type="p">119:第三平坦化層</p>  
        <p type="p">DT:驅動電晶體</p>  
        <p type="p">ACT:主動層</p>  
        <p type="p">GE:閘極電極</p>  
        <p type="p">SE:源極電極</p>  
        <p type="p">DE:汲極電極</p>  
        <p type="p">RE:反射電極</p>  
        <p type="p">RE1:第一反射電極</p>  
        <p type="p">RE2:第二反射電極</p>  
        <p type="p">LS:遮光層</p>  
        <p type="p">LE:輔助電極</p>  
        <p type="p">CE1:第一連接電極</p>  
        <p type="p">CE2:第二連接電極</p>  
        <p type="p">CE3:第三連接電極</p>  
        <p type="p">Cst:電容器</p>  
        <p type="p">Cst1:第一電容器電極</p>  
        <p type="p">Cst2:第二電容器電極</p>  
        <p type="p">VDD:電源線</p>  
        <p type="p">TM:中間電極</p>  
        <p type="p">APP:照明檢測圖案</p>  
        <p type="p">PP:保護圖案</p>  
        <p type="p">CH1:第一接觸孔</p>  
        <p type="p">CH2:第二接觸孔</p>  
        <p type="p">CH3:第三接觸孔</p>  
        <p type="p">CH4:第四接觸孔</p>  
        <p type="p">CH5:第五接觸孔</p>  
        <p type="p">CH6:第六接觸孔</p>  
        <p type="p">CH7:第七接觸孔</p>  
        <p type="p">CH8:第八接觸孔</p>  
        <p type="p">OP1:第一開口部分</p>  
        <p type="p">OP2:第二開口部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1758" publication-number="202629018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>  
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/65</main-classification>  
        <further-classification edition="202601120260323B">H10W40/20</further-classification>  
        <further-classification edition="202601120260323B">H10W72/20</further-classification>  
        <further-classification edition="202601120260323B">H10W72/50</further-classification>  
        <further-classification edition="202601120260323B">H10W74/10</further-classification>  
        <further-classification edition="202601120260323B">H10W74/01</further-classification>  
        <further-classification edition="202601120260323B">H10W72/00</further-classification>  
        <further-classification edition="202601120260323B">H10W95/00</further-classification>  
        <further-classification edition="202601120260323B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴坤祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KYUNG ROK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀碧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUL BEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴喜永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HEE YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張熙俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, HEE JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿黛　喬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADAY, JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡利諾　米利特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARINO, MILLETE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錫納樂　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINER, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇利曼都　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLIMANDO, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個示例中，一種電子裝置包含第一基板、耦合到所述第一基板的一側的電子組件，以及耦合到所述第一基板的所述側的垂直互連結構。所述垂直互連結構包含耦合到所述第一基板的所述側的第一互連結構，以及具有耦合到所述第一互連結構的第一側的中間基板。所述中間基板包括限定腔的內側壁，其中所述電子組件延伸穿過所述腔。第二互連結構可以耦合到所述中間基板的與所述中間基板的所述第一側相對的第二側。囊封物可以安置在所述第一基板和所述中間基板之上、在所述電子組件周圍、在所述第一互連結構周圍、在所述第二互連結構周圍以及在所述中間基板周圍。本文還公開了其它示例和相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, an electronic device includes a first substrate, an electronic component coupled to a side of the first substrate, and a vertical interconnect structure coupled to the side of the first substrate. The vertical interconnect structure includes a first interconnect structure coupled to the side of the first substrate, and an intermediate substrate having a first side coupled to the first interconnect structure. The intermediate substrate comprises inner sidewalls defining a cavity with the electronic component extending through the cavity. A second interconnect structure can be coupled to a second side of the intermediate substrate opposite the first side of the intermediate substrate. An encapsulant can be disposed over the first substrate and the intermediate substrate, around the electronic component, around the first interconnect structure, around the second interconnect structure, and around the intermediate substrate. Other examples and related methods are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:基板</p>  
        <p type="p">106:引線</p>  
        <p type="p">108:囊封物</p>  
        <p type="p">110:電子組件</p>  
        <p type="p">111:互連結構</p>  
        <p type="p">112:核心結構</p>  
        <p type="p">114:可熔材料</p>  
        <p type="p">116:垂直互連件</p>  
        <p type="p">137:囊封物</p>  
        <p type="p">138:外部互連件</p>  
        <p type="p">200:導電結構</p>  
        <p type="p">202:介電結構</p>  
        <p type="p">204:導電結構</p>  
        <p type="p">206:外部端子</p>  
        <p type="p">240:導電結構</p>  
        <p type="p">242:介電結構</p>  
        <p type="p">244:內部端子</p>  
        <p type="p">246:外部端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1759" publication-number="202627348"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627348.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液化氣體儲存設施</chinese-title>  
        <english-title>LIQUEFIED-GAS STORAGE FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260322B">F17C3/02</main-classification>  
        <further-classification edition="200601120260322B">F17C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商蓋茲運輸科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAZTRANSPORT ET TECHNIGAZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲利浦　安托恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHILIPPE, ANTOINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪拉諾　賽巴斯丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELANOE, SEBASTIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種液化氣體儲存設施(1)， &lt;br/&gt;其中主要熱絕緣障壁(6)包括沿該拐角邊緣區(8)安置之一列主要拐角總成(14、140)及平面主要絕緣面板(15)，各主要拐角總成包括兩個主要拐角絕緣面板(16)，該等主要拐角絕緣面板(16)藉由一固定板(22)成對地固定至次要拐角結構(9)之一者，該固定板(22)定位於底部板材之橫向邊緣(21)上， &lt;br/&gt;其中該列主要拐角總成(14、140)包括一主要拐角附接總成(140)，該主要拐角附接總成(140)具有定位於距該底部板材(17)之該等橫向邊緣(21)一定距離處之一凹部(24)，該等平面主要絕緣面板(15)之一者藉由一錨固系統(25)附接至該主要拐角附接總成(140)，該錨固系統(25)包括一錨固板(26)，該錨固板(26)具有緊固至該平面主要絕緣面板之一第一部分(31)及定位於該凹部(24)中且附接至該底部板材(17)之一第二部分(32)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a liquefied gas storage facility (1), &lt;br/&gt;wherein the primary thermally insulating barrier (6) comprises a row of primary corner assemblies (14, 140) disposed along said corner-edge region (8) and planar primary insulating panels (15), each primary corner assembly comprising two primary corner insulating panels (16), the primary corner insulating panels (16) being fixed in pairs to one of the secondary corner structures (9) by means of a fixing plate (22) located on the transverse edges (21) of the bottom sheets, &lt;br/&gt;wherein the row of primary corner assemblies (14, 140) comprises a primary corner attachment assembly (140) having a recess (24) located at a distance from the transverse edges (21) of the bottom sheet (17), one of the planar primary insulating panels (15) being attached to the primary corner attachment assembly (140) by an anchoring system (25) comprising an anchor plate (26) having a first portion (31) secured to the planar primary insulating panel and a second portion (32) located in the recess (24) and attached to the bottom sheet (17).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:承載結構</p>  
        <p type="p">3:槽壁</p>  
        <p type="p">4:次要熱絕緣障壁</p>  
        <p type="p">5:次要密封膜</p>  
        <p type="p">10:平面次要絕緣面板</p>  
        <p type="p">11:金屬列板</p>  
        <p type="p">12:平面中心部分</p>  
        <p type="p">13:上翻邊緣</p>  
        <p type="p">14:主要拐角總成</p>  
        <p type="p">15:平面主要絕緣面板</p>  
        <p type="p">27:底部板材</p>  
        <p type="p">28:頂部板材</p>  
        <p type="p">29:絕緣發泡體板材</p>  
        <p type="p">30:拐角</p>  
        <p type="p">35:金屬角撐架</p>  
        <p type="p">36:絕緣填充物</p>  
        <p type="p">140:主要拐角總成</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1760" publication-number="202627610"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627610.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光導近眼顯示器的基於棱鏡的重影抑制</chinese-title>  
        <english-title>PRISM-BASED GHOST SUPPRESSION FOR LIGHTGUIDE NEAR-EYE DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G02B27/01</main-classification>  
        <further-classification edition="200601120260319B">G02B6/00</further-classification>  
        <further-classification edition="200601120260319B">G02B5/08</further-classification>  
        <further-classification edition="200601120260319B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商魯姆斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMUS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾森菲爾德　齊翁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EISENFELD, TSION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">近眼顯示器包括：具有相對的主表面的光導光學元件（Lightguide Optical Element，LOE）、圖像投影儀、具有部分反射表面的第一區域、以及具有耦出佈置的第二區域。為了抑制來自小平面或介面處的單次反射的重影，在第一主表面上設置細長的光偏轉結構，該細長的光偏轉結構鄰近於該小平面或介面。該結構被配置成使得：使來自眼動箱的原本會照射小平面/介面的逆向跟蹤的非引導的光線偏轉，使得該逆向跟蹤的非引導的光線不照射小平面/介面。第二主表面上的校正光偏轉結構可以反向偏轉光線以減少對周邊視覺的影響。光偏轉結構在沒有光焦度的情況下提供光束轉向，並且可以被實現為棱鏡或衍射/超表面或體全息元件，其被形成為連續膜的離散條帶或部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A near-eye display includes a lightguide optical element (LOE) with opposed major surfaces, an image projector, a first region having partially reflective surfaces, and a second region with an out-coupling arrangement. To suppress ghosts from single reflections at a facet or interface, an elongated light-deflecting structure is provided on the first major surface adjacent thereto. The structure is configured so that a reverse-traced unguided ray from an eye-motion box that would otherwise impinge the facet/interface is deflected so it does not impinge. A corrective light-deflecting structure on the second major surface may counter-deflect rays to reduce impact on the peripheral vision. The light-deflecting structures provide beam steering without optical power and may be implemented as prisms or as diffractive/metasurface or volume-holographic elements, formed as discrete strips or portions of a continuous film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:近眼顯示器</p>  
        <p type="p">12:光導光學元件(LOE)</p>  
        <p type="p">14:圖像投影儀</p>  
        <p type="p">16:第一區域</p>  
        <p type="p">18:第二區域</p>  
        <p type="p">20:支承結構</p>  
        <p type="p">22:控制器</p>  
        <p type="p">X,Y:軸(方向)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1761" publication-number="202626030"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626030.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中樞神經系統選擇性藥物活性之外周阻斷劑</chinese-title>  
        <english-title>PERIPHERAL BLOCKERS FOR CENTRAL NERVOUS SYSTEM-SELECTIVE DRUG ACTIVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/436</main-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蒙塔拉醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONTARA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　扎卡里　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, ZACHARY B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰斯通　肖恩　唐納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSTONE, SHAWN DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塞洛繆斯　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARTHOLOMEUS, JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡彭蒂爾　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARPENTIER, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒維克　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVESQUE, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱里克　史蒂文　韋克菲爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DJURIC, STEVAN WAKEFIELD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉基特　瑞希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKHIT, RISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欽　蘭德爾　馬塞洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, RANDALL MARCELO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫茲　尼可拉斯　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERTZ, NICHOLAS T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案之態樣係關於用於減少抗CNS疾病藥物之外周副作用的外周阻斷劑化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the disclosure related to peripheral blocker compounds for use in reducing peripheral side effects of anti-CNS disease drugs.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1762" publication-number="202626031"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626031.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依維莫司之中樞神經系統選擇性活性</chinese-title>  
        <english-title>CENTRAL NERVOUS SYSTEM-SELECTIVE ACTIVITY OF EVEROLIMUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/436</main-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蒙塔拉醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONTARA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　扎卡里　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, ZACHARY B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰斯通　肖恩　唐納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSTONE, SHAWN DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塞洛繆斯　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARTHOLOMEUS, JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡彭蒂爾　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARPENTIER, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒維克　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVESQUE, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱里克　史蒂文　韋克菲爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DJURIC, STEVAN WAKEFIELD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉基特　瑞希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKHIT, RISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欽　蘭德爾　馬塞洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, RANDALL MARCELO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫茲　尼可拉斯　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERTZ, NICHOLAS T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案之態樣係關於將依維莫司(everolimus)與外周阻斷劑化合物一起投與以用於減少外周副作用之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the disclosure relate to methods of administering everolimus with peripheral blocker compounds for use in reducing peripheral side effects.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1763" publication-number="202628930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置用構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/72</main-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification>  
        <further-classification edition="200601120260302B">B05B1/34</further-classification>  
        <further-classification edition="200601120260302B">C04B37/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇佐美太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USAMI, TARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久野達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">晶圓載置台10具備陶瓷板20、插栓配置孔24及插栓50。插栓50配置在插栓配置孔24，具有氣體流路52。氣體流路52具有自插栓本體51的上表面前側的位置朝斜上方前進延伸至出口的氣體流路上方部分。在觀察插栓50周邊部分的縱剖面時，當將出口的開口緣與氣體流路上方部分的底面之間的上下方向最大長度設為d1[μm]、將該晶圓支持面與插栓50的上表面之間的上下方向長度設為dr[μm]、將氣體流路52之中比氣體流路上方部分位於更上游側之上下方向最大長度設為d2[μm]、將d1及dr的和設為D[μm]時，滿足30≦d1≦100、10≦dr≦50、100≦d2≦200及｜d2－D｜≦50。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓載置台</p>  
        <p type="p">20:陶瓷板</p>  
        <p type="p">21:晶圓載置面</p>  
        <p type="p">21a:密封環帶</p>  
        <p type="p">21b:圓形小突起</p>  
        <p type="p">21c:基準面</p>  
        <p type="p">22:電極</p>  
        <p type="p">24:插栓配置孔</p>  
        <p type="p">26:FR載置面</p>  
        <p type="p">26a:FR支持面</p>  
        <p type="p">26b:凹部</p>  
        <p type="p">28:插栓配置孔</p>  
        <p type="p">30:基板</p>  
        <p type="p">32:冷媒通道</p>  
        <p type="p">34:氣孔</p>  
        <p type="p">34a:大徑部</p>  
        <p type="p">40:金屬接合層</p>  
        <p type="p">42:貫通孔</p>  
        <p type="p">50:插栓</p>  
        <p type="p">51:插栓本體</p>  
        <p type="p">52:氣體流路</p>  
        <p type="p">55:插栓</p>  
        <p type="p">56:插栓本體</p>  
        <p type="p">57:氣體流路</p>  
        <p type="p">60:對焦環</p>  
        <p type="p">62:圓周槽</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1764" publication-number="202627952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>匹配系統</chinese-title>  
        <english-title>MATCHING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">G06Q30/0601</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商責愛泰克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENETEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野憲二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤義仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTOH, YOSHIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供匹配系統等，其提供和生產能力對應之製造商的相關資訊。 &lt;br/&gt;匹配系統，具備：用戶終端機，用於設定訂購條件，包含用戶側輸入部與用戶側輸出部；以及資訊伺服器，經由網路而與該用戶終端機通訊。該訂購條件，至少包含訂購對象構件、及該訂購對象構件之訂購數量的相關資訊。該資訊伺服器，具備伺服器記錄部，其記錄包含製造商各自之生產能力的相關資訊之第1資料庫。該用戶側輸出部，依據經由該用戶側輸入部而設定之訂購條件、及該第1資料庫，施行該資訊伺服器與該用戶終端機的至少一方所識別出之和該訂購條件對應的製造商之列表的顯示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide a matching system or the like capable of providing information relating to a manufacturers concerning production capability. &lt;br/&gt;A matching system of the invention comprises a user terminal which is used to set order conditions and comprises a user side input section and a user side output section, and an information server which communicates with the user terminal. The order conditions include at least information about the component being ordered and the order quantity of the component being ordered. The information server includes a server storage section that stores a first database containing information relating to the production capabilities of individual manufacturers. The user side output section displays a list of manufacturers corresponding with the order conditions identified by at least one or other of the information server and the user terminal based on the order conditions set via the user side input section, and the first database.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">37:用戶側輸出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1765" publication-number="202626476"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626476.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有軌道搬送車系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260329B">B66C13/22</main-classification>  
        <further-classification edition="200601120260329B">B65G1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">有軌道搬送車系統係藉由沿軌道行駛之搬送車以搬送物品。有軌道搬送車系統具備有：監視裝置，其被搭載於搬送車，以監視搬送車之行駛空間的周圍狀況；及控制器，其對搬送車發送由監視裝置進行監視之意旨的監視指示，並且將監視結果與監視位置建立關聯地加以記憶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:高架搬送車(搬送車)</p>  
        <p type="p">2:框架單元</p>  
        <p type="p">3:行駛單元</p>  
        <p type="p">4:橫移單元</p>  
        <p type="p">6:升降驅動單元</p>  
        <p type="p">7:固持單元</p>  
        <p type="p">8:夾持器</p>  
        <p type="p">9,45,51:控制部</p>  
        <p type="p">40:監視單元(監視裝置)</p>  
        <p type="p">40a:殼體上表面</p>  
        <p type="p">40b:殼體下表面</p>  
        <p type="p">41:凸緣部</p>  
        <p type="p">43:通訊部</p>  
        <p type="p">47:距離感測器</p>  
        <p type="p">50:搬送車控制器(控制器)</p>  
        <p type="p">52:記憶部</p>  
        <p type="p">53:顯示部</p>  
        <p type="p">100:維護控制器</p>  
        <p type="p">200:軌道</p>  
        <p type="p">201:定位標記</p>  
        <p type="p">300:資料伺服器</p>  
        <p type="p">400:可攜式裝置</p>  
        <p type="p">B:傳送帶</p>  
        <p type="p">F:地板面</p>  
        <p type="p">S:搬送車系統(有軌道搬送車系統)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1766" publication-number="202628183"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628183.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光工具蒸氣乾燥器槽及其中使用的擴散器板</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING TOOL VAPOR DRYER TANK AND DIFFUSER PLATE FOR USE THEREIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克修　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCHUGH, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳永能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YONGNENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　建設</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, JIANSHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋奇　大衛麥斯威爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAGE, DAVID MAXWELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃迺傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, NAI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克修　保羅Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCHUGH, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾森　葛瑞格里Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILSON, GREGORY J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘恰派克森　亞美亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANCHAPAKESAN, AVYAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗加拉賈　傑更</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANGARAJAN, JAGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　布萊恩Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN, BRIAN J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在某一個實施例中，提供了一種用於半導體製造的擴散器。該擴散器包含限定內部腔體的主體、主體的擴散表面、複數個擴散孔、與擴散表面相對的後表面，以及擋板。該複數個擴散孔被安置為穿過擴散表面並與內部腔體進行流體連通。擋板安置於擴散表面與後表面之間。該擋板部分限定了內部腔體內的氣室。該氣室包含複數個擋板孔，該複數個擋板孔被安置為穿過擋板的一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one embodiment, a diffuser for semiconductor manufacturing is provided. The diffuser includes a body defining an internal cavity, a diffusion surface of the body, a plurality of diffusion apertures, a back surface opposite the diffusion surface, and a baffle. The plurality of diffusion apertures are disposed through the diffusion surface and in fluid communication with the internal cavity. The baffle is disposed between the diffusion surface and the back surface. The baffle partially defines a plenum within the internal cavity. The plenum includes a plurality of baffle apertures disposed through a portion of the baffle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:槽</p>  
        <p type="p">301:主體</p>  
        <p type="p">303:擴散器</p>  
        <p type="p">305:內表面</p>  
        <p type="p">307:腔體</p>  
        <p type="p">309:埠</p>  
        <p type="p">311:第一埠</p>  
        <p type="p">313:第二埠</p>  
        <p type="p">315:表面</p>  
        <p type="p">317:擴散表面</p>  
        <p type="p">319:擴散孔</p>  
        <p type="p">331:第一表面</p>  
        <p type="p">333:第一傾斜表面</p>  
        <p type="p">335:第二傾斜表面</p>  
        <p type="p">337:入口表面</p>  
        <p type="p">351:第一輪廓</p>  
        <p type="p">353:第二輪廓</p>  
        <p type="p">360:剖面</p>  
        <p type="p">361:第一寬度</p>  
        <p type="p">363:第二寬度</p>  
        <p type="p">365:第三寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1767" publication-number="202628766"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628766.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260320B">H10K59/131</main-classification>  
        <further-classification edition="202301120260320B">H10K59/124</further-classification>  
        <further-classification edition="202301320260320B">H10K102/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋性伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, SEONGBAIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴永祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YOUNGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAESIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珍雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炫旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板包含：一基底部件；複數個像素；複數個第一線，配置為將電性訊號傳輸至該複數個像素；一第一絕緣層，覆蓋該複數個第一線；一第二線，設置在該第一絕緣層上；一第二絕緣層，設置在該第一絕緣層上並覆蓋該第二線；複數個第三線，設置在該第二絕緣層上，其中，該複數個第三線中的至少一個與該複數個第一線重疊；一第三絕緣層，覆蓋該複數個第三線；以及一連接線，與該複數個第三線中的至少一個重疊，其中，該連接線配置為將該複數個第一線的一部分及該第二線彼此電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel includes: a base member; a plurality of pixels; a plurality of first lines configured to transfer an electrical signal to the plurality of pixels; a first insulating layer covering the plurality of first lines; a second line disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering the second line; a plurality of third lines disposed on the second insulating layer, wherein at least one of the plurality of third lines overlaps with the plurality of first lines; a third insulating layer covering the plurality of third lines; and a connection line overlapping with the at least one of the plurality of third lines, wherein the connection line is configured to electrically connect a portion of the plurality of first lines and the second line to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ACT:半導體圖案</p>  
        <p type="p">AE:陽極電極</p>  
        <p type="p">BF:緩衝層</p>  
        <p type="p">BL:基底部件</p>  
        <p type="p">BR:阻障層</p>  
        <p type="p">CE:陰極電極</p>  
        <p type="p">CL:電路層</p>  
        <p type="p">CVD1:第一無機層</p>  
        <p type="p">CVD2:第二無機層</p>  
        <p type="p">EL:電子控制層</p>  
        <p type="p">ELL:發光層</p>  
        <p type="p">EML:發光層</p>  
        <p type="p">GAT1:第一閘極電極圖案，閘極電極圖案</p>  
        <p type="p">GAT2:第二閘極電極圖案，閘極電極圖案</p>  
        <p type="p">GAT3:第三閘極電極圖案，閘極電極圖案</p>  
        <p type="p">GI1:第一閘極絕緣層，閘極絕緣層</p>  
        <p type="p">GI2:第二閘極絕緣層，閘極絕緣層</p>  
        <p type="p">GI3:第三閘極絕緣層，閘極絕緣層</p>  
        <p type="p">HL:電洞控制層</p>  
        <p type="p">ILD:層間絕緣層</p>  
        <p type="p">LD:發光二極體</p>  
        <p type="p">MN:有機層</p>  
        <p type="p">OP:開口部分</p>  
        <p type="p">PDL:像素定義膜</p>  
        <p type="p">SD1:第一源極汲極電極圖案</p>  
        <p type="p">SD2:第二源極汲極電極圖案</p>  
        <p type="p">TFE:封裝層</p>  
        <p type="p">VIA1:第一通孔絕緣層，通孔絕緣層</p>  
        <p type="p">VIA2:第二通孔絕緣層，通孔絕緣層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1768" publication-number="202626488"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626488.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>方法及設備</chinese-title>  
        <english-title>PROCESS AND PLANT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">C01B3/047</main-classification>  
        <further-classification edition="202601120260325B">C01B3/50</further-classification>  
        <further-classification edition="200601120260325B">C01B21/02</further-classification>  
        <further-classification edition="200601120260325B">C01B21/04</further-classification>  
        <further-classification edition="200601120260325B">B01J8/02</further-classification>  
        <further-classification edition="200601120260325B">B01D3/14</further-classification>  
        <further-classification edition="200601120260325B">B01D53/047</further-classification>  
        <further-classification edition="200601120260325B">F28D21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商強生瑪西大維科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON MATTHEY DAVY TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克法蘭　凱特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCFARLANE, KATE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯威尼　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWINNEY, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃頓　麥可　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTON, MICHAEL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於催化裂解液氨原料以產生裂解氣體流之方法，其包括以下步驟：i)藉由與液體熱交換介質熱交換來將該液氨原料加熱至中間溫度以產生經冷却之液體熱交換介質；及ii)使用中間溫度液氨原料來為一或多個下游製程提供冷却。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for the catalytic cracking of a liquid ammonia feedstock to produce a cracked gas stream, comprising the steps of i) heating the liquid ammonia feedstock to an intermediate temperature by heat exchange with a liquid heat exchange medium to produce a cooled liquid heat exchange medium; and ii) using the intermediate temperature liquid ammonia feedstock to provide cooling to one or more downstream processes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:液態氨</p>  
        <p type="p">20a:預加熱器</p>  
        <p type="p">20b:加熱構件</p>  
        <p type="p">30:氨裂解反應器</p>  
        <p type="p">31:熱交換器</p>  
        <p type="p">40:冷却器</p>  
        <p type="p">50:氨洗滌系統</p>  
        <p type="p">60:儲存槽</p>  
        <p type="p">70:蒸餾系統</p>  
        <p type="p">80:冷却器</p>  
        <p type="p">90:變壓吸附裝置</p>  
        <p type="p">95:壓縮</p>  
        <p type="p">201a:冷却迴路</p>  
        <p type="p">201b:冷却迴路</p>  
        <p type="p">202a:冷凍器迴路/液體熱交換介質</p>  
        <p type="p">202b:冷凍器迴路/液體熱交換介質</p>  
        <p type="p">202c:冷凍器迴路</p>  
        <p type="p">204:純氫流</p>  
        <p type="p">205:尾氣</p>  
        <p type="p">206:富氨流</p>  
        <p type="p">207:重級分</p>  
        <p type="p">208:富水流</p>  
        <p type="p">210a:氨原料</p>  
        <p type="p">210b:氨原料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1769" publication-number="202628184"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628184.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用多區域吸盤吸附高翹曲基板</chinese-title>  
        <english-title>CHUCKING OF HIGH-WARP SUBSTRATES USING MULTIZONAL CHUCKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">H01J37/32</main-classification>  
        <further-classification edition="202601120260319B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇柏拉曼央　普拉迪庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUBRAHMANYAN, PRADEEP KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李舍爾　Ｄ傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LISCHER, D. JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　元在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WONJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的系統和技術旨在改善在元件製造系統中對基板的吸附。該些技術包括識別基板的變形，並根據識別出的變形，對多區域吸盤施加複數個時間依賴的電壓訊號，以吸引基板至多區域吸盤。複數個時間依賴的電壓訊號中的每個電壓訊號都施加於多區域吸盤的一或多個電極。該些技術進一步包括對被吸引至多區域吸盤的基板執行一或多個處理操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed systems and techniques are directed to improving chucking of substrates in device manufacturing systems. The techniques include identifying deformation of a substrate and applying, based on the identified deformation, a plurality of time-dependent voltage signals to a multizonal chuck to attract the substrate to the multizonal chuck. Each voltage signal of the plurality of time-dependent voltage signals is applied to one or more electrodes of the multizonal chuck. The techniques further include performing one or more processing operations in association with the substrate attracted to the multizonal chuck.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:吸盤</p>  
        <p type="p">521:電極</p>  
        <p type="p">522:電極</p>  
        <p type="p">523:電極</p>  
        <p type="p">524:電極</p>  
        <p type="p">525:電極</p>  
        <p type="p">560:多區域吸盤系統</p>  
        <p type="p">561:單極雙擲(SPDT)開關</p>  
        <p type="p">562:單極雙擲開關</p>  
        <p type="p">563:單極雙擲開關</p>  
        <p type="p">564:單極雙擲開關</p>  
        <p type="p">565:單極雙擲開關</p>  
        <p type="p">568:DC電壓源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1770" publication-number="202626589"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626589.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維回收用處理劑及纖維之回收方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C211/63</main-classification>  
        <further-classification edition="200601120260401B">C07D233/58</further-classification>  
        <further-classification edition="200601120260401B">C07F9/54</further-classification>  
        <further-classification edition="200601120260401B">C08J11/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三洋化成工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYO CHEMICAL INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口俊一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, SHUNICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>満保章泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANBO, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榎健一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENOKI, KENICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種纖維回收用處理劑，其包含由含有氮原子或磷原子之陽離子及陰離子所構成之離子液體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1771" publication-number="202626471"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626471.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送車</chinese-title>  
        <english-title>TRANSPORT VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B65G49/07</main-classification>  
        <further-classification edition="200601120260325B">B66F9/075</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉永和治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINAGA, KAZUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村和誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在搬送車中，叉件是配置成從升降裝置朝向後側突出，車體具備：本體部，支撐行走驅動裝置5；及一對腳部，相對於叉件的升降軌跡在寬度方向的兩側中，配置成從本體部朝向後側突出，驅動輪41及檢測驅動輪41的旋轉之旋轉檢測裝置6是被行走驅動裝置5所支撐，旋轉檢測裝置6具備：從動輥61，配置成與驅動輪41的外周面相接，並且伴隨於驅動輪41的旋轉而旋轉；及旋轉感測器，檢測從動輥61的旋轉，從動輥61的旋轉軸心A2配置於比驅動輪41的旋轉軸心A1更上側且在行走方向T上與驅動輪41的旋轉軸心A1不同的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:車輪</p>  
        <p type="p">5:行走驅動裝置</p>  
        <p type="p">6:旋轉檢測裝置</p>  
        <p type="p">41:驅動輪</p>  
        <p type="p">51:第1支撐構件</p>  
        <p type="p">52:第2支撐構件</p>  
        <p type="p">53:第3支撐構件</p>  
        <p type="p">61:從動輥</p>  
        <p type="p">71:被檢測部</p>  
        <p type="p">311:旋繞支撐部</p>  
        <p type="p">311a:底面</p>  
        <p type="p">313:固定部</p>  
        <p type="p">314:旋繞部</p>  
        <p type="p">A1,A2:旋轉軸心</p>  
        <p type="p">C1:旋繞軸心</p>  
        <p type="p">L1,L2,L3:1點鏈線</p>  
        <p type="p">T:行走方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1772" publication-number="202627021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具超疏水性表面之複合材料及用於微結構表面之超疏水性後處理的塗料組合物</chinese-title>  
        <english-title>COMPOSITE MATERIAL WITH A SUPERHYDROPHOBIC SURFACE AND COATING COMPOSITION FOR SUPERHYDROPHOBIC POST-TREATMENT OF MICROSTRUCTURED SURFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C09J133/26</main-classification>  
        <further-classification edition="200601120260324B">C09K3/18</further-classification>  
        <further-classification edition="200601120260324B">C09D5/16</further-classification>  
        <further-classification edition="200601120260324B">C08F2/22</further-classification>  
        <further-classification edition="202201120260324B">B22F1/07</further-classification>  
        <further-classification edition="202401120260324B">B01J35/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫塗料有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF COATINGS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫内斯　羅蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOENES, ROLAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃克特　馬賽爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECKERT, MARCEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯何　尤爾根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUEHE, JUERGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康拉迪　魯帕特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONRADI, RUPERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊班博格　史凡　歐里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRABBENBORG, SVEN OLLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具超疏水性表面之複合材料，該超疏水性表面包括一級表面結構，其具有至少一個空間尺寸Δd&lt;sub&gt;micro&lt;/sub&gt;在1 × 10&lt;sup&gt;−3&lt;/sup&gt; m至1 × 10&lt;sup&gt;−6&lt;/sup&gt; m範圍內之凸起及/或凹陷；及二級表面層，其覆蓋該一級表面結構並包括疏水性奈米顆粒及至少部分交聯疏水性聚合物之聚集物，其中疏水性奈米顆粒總量對至少部分交聯疏水性聚合物總量之質量比在1:5至5:1範圍內，該二級表面層之平均厚度d&lt;sub&gt;nano&lt;/sub&gt;在25 nm至5000 nm範圍內，該二級表面層具有至少一個空間尺寸Δd&lt;sub&gt;nano&lt;/sub&gt;在5 nm至1000 nm範圍內之凸起，氟含量為小於1重量%，且其中該至少一個空間尺寸Δd&lt;sub&gt;micro&lt;/sub&gt;中之至少一者對該二級表面層之該平均厚度d&lt;sub&gt;nano&lt;/sub&gt;之比率為至少5:1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite material with a superhydrophobic surface comprising a first-level surface structure with elevations and/or depressions having at least one spatial dimension Δd&lt;sub&gt;micro&lt;/sub&gt; in the range of from 1 × 10&lt;sup&gt;−3&lt;/sup&gt; m to 1 × 10&lt;sup&gt;−6&lt;/sup&gt; m and a second-level surface layer covering the first-level surface structure and comprising aggregates of hydrophobic nanoparticles and at least partially crosslinked hydrophobic polymers, wherein the mass ratio of the total amount of hydrophobic nanoparticles to the total amount of at least partially crosslinked hydrophobic polymers is in the range of from 1:5 to 5:1, the average thickness of the second-level surface layer d&lt;sub&gt;nano&lt;/sub&gt; is in the range of from 25 nm to 5000 nm, the second-level surface layer has elevations having at least one spatial dimension Δd&lt;sub&gt;nano&lt;/sub&gt; in the range of from 5 nm to 1000 nm, the fluorine content is less than 1% by weight, and wherein the ratio of at least one of the at least one spatial dimension Δd&lt;sub&gt;micro &lt;/sub&gt;to the average thickness of the second-level surface layer d&lt;sub&gt;nano&lt;/sub&gt; is at least 5:1.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1773" publication-number="202626909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶聚酯解聚物之製造方法、再生液晶聚酯樹脂之製造方法、再生液晶聚酯成形體之製造方法、及化學再生方法</chinese-title>  
        <english-title>PRODUCTION METHODS FOR LIQUID CRYSTAL POLYESTER DEPOLYMERIZATION PRODUCT, RECYCLED LIQUID CRYSTAL POLYESTER RESIN AND RECYCLED LIQUID CRYSTAL POLYESTER FORMED BODY, AND CHEMICAL RECYCLING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J11/14</main-classification>  
        <further-classification edition="200601120260401B">C07C51/09</further-classification>  
        <further-classification edition="200601120260401B">C07C65/11</further-classification>  
        <further-classification edition="200601120260401B">C08G63/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢形太一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGATA, TAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井智貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山和之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, KAZUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種對於將液晶聚酯製品進行再生係有用的液晶聚酯解聚物之製造方法。前述液晶聚酯解聚物之製造方法係包含解聚合步驟，其係透過酯鍵的切斷而將液晶聚酯製品所含有的液晶聚酯進行解聚合以增加總單末端量的步驟，其中使用次臨界狀態的溶劑來使液晶聚酯製品進行解聚合反應，且解聚合後之液晶聚酯的總單末端量為50meq/kg以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method for producing a liquid crystal polyester depolymerization product useful for recycling a liquid crystal polyester product. The method includes a step of depolymerizing a liquid crystal polyester included in the liquid crystal polyester product by cleaving ester bonds so as to increase a total amount of one-end groups, wherein the liquid crystal polyester product is subjected to a depolymerization reaction with a subcritical solvent, and the total amount of one-end groups of a depolymerized liquid crystal polyester is 50 mEq/kg or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1774" publication-number="202628599"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628599.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓接合製程</chinese-title>  
        <english-title>WAFER BONDING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10B80/00</main-classification>  
        <further-classification edition="202601120260325B">H10W90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　怡利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIEH, ELLIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝奇亞里斯　尼可拉奧斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEKIARIS, NIKOLAOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中所描述的實施例涉及一種裝置，包含基板，其中該基板包含半導體材料。在實施例中，第一層在基板上，且該第一層包含第一介電材料。在實施例中，元件嵌入於第一層內。在實施例中，該裝置進一步包含嵌入於第一層內的第二層。在實施例中，該第二層包含第二介電材料，且第二層的側壁是暴露的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus, that includes a substrate, where the substrate includes a semiconductor material. In an embodiment, a first layer is on the substrate, and the first layer includes a first dielectric material. In an embodiment, a device is embedded within the first layer. In an embodiment, the apparatus further includes a second layer that is embedded within the first layer. In an embodiment, the second layer includes a second dielectric material, and a sidewall of the second layer is exposed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">560:製程</p>  
        <p type="p">561:操作</p>  
        <p type="p">562:操作</p>  
        <p type="p">563:操作</p>  
        <p type="p">564:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1775" publication-number="202628503"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628503.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H05K1/11</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖竟谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHING-KU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承磑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了包含基板結構及橫向偏移接地通孔和金屬球的半導體裝置。半導體裝置可能包括基板、複數個第一接地通孔和複數個第一金屬球。複數個第一接地通孔可能形成在基板內並圍繞複數個訊號通孔。複數個第一金屬球可能設置在基板上並電連接到複數個第一接地通孔。一個第一金屬球可能電連接到一個第一接地通孔。複數個第一接地通孔的一部分可能沿垂直於基板的方向相對於複數個第一金屬球的相應部分橫向偏移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Devices including a substrate structure with laterally offset ground vias and metal balls are provided. A device may include a substrate, a plurality of first ground vias, and a plurality of first metal balls. The plurality of first ground vias may be formed within the substrate and surrounding a plurality of signal vias. The plurality of first metal balls may be disposed on the substrate and electrically coupled to the plurality of first ground vias. One first metal ball may be electrically coupled to one first ground via. A part of the plurality of first ground vias may be laterally offset from a corresponding part of the plurality of first metal balls along a direction orthogonal to the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:半導體裝置</p>  
        <p type="p">210:中空部分</p>  
        <p type="p">211:基板</p>  
        <p type="p">212:第一接地通孔</p>  
        <p type="p">212A:特定第一接地通孔</p>  
        <p type="p">213:訊號通孔</p>  
        <p type="p">213A:特定訊號通孔</p>  
        <p type="p">214:第一金屬球</p>  
        <p type="p">214A:特定第一金屬球</p>  
        <p type="p">215:第二金屬球</p>  
        <p type="p">215A:特定第二金屬球</p>  
        <p type="p">P21:第一間距</p>  
        <p type="p">P22:第二間距</p>  
        <p type="p">S21:第一中心到中心距離</p>  
        <p type="p">S22:第二心到中心距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1776" publication-number="202629050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括封裝基板的面板</chinese-title>  
        <english-title>PANEL COMPRISING PACKAGING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W76/13</main-classification>  
        <further-classification edition="202601120260302B">H10W74/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹世漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, SEHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實例為包括封裝基板的面板，包括：玻璃芯，長或寬為10cm以上；以及上部層，配置於所述玻璃芯上，並在內部具有再分配線，單元作為在晶粒布局內配置半導體元件的部分，是被分離為獨立封裝基板的部分，在所述面板配置有多個所述單元，加強結構物為配置於所述上部層上，並包圍所述晶粒布局的至少一部分的結構物，第一單元包括第一晶粒布局及配置於所述第一晶粒布局的第一加強結構物，第二單元包括第二晶粒布局及配置於所述第二晶粒布局的第二加強結構物，所述第二單元並排配置於所述第一單元的一側，所述第一加強結構物和所述第二加強結構物相互分離地進行配置。在實例的面板配置有有利於進行大面積基板加工的加強部結構，從而可以提供可靠性得到提高的包括獨立封裝基板的面板。實例的面板可以提供具有可在進行大面積基板加工時抑制玻璃破碎，並減少彎曲的加強結構物的面板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to the embodiment, a panel comprises: a glass core having a width or length of 10 cm or more; and an upper layer disposed on the glass core and having redistribution lines therein. A unit refers to a portion in which a semiconductor element is disposed within a die layout and which is to be separated into an individual packaging substrate. A plurality of the units are disposed on the panel. A reinforcement structure is disposed on the upper layer and is configured to surround at least a portion of the die layout. A first unit comprises a first die layout and a first reinforcement structure disposed on the first die layout. A second unit comprises a second die layout and a second reinforcement structure disposed on the second die layout. The second unit is disposed adjacent to one side of the first unit, and the first reinforcement structure and the second reinforcement structure are disposed separately from each other. The panel according to the embodiment may provide a panel comprising individual packaging substrates in which a reinforcement structure advantageous for large-area substrate processing is disposed, thereby improving reliability. The panel according to the embodiment may provide a panel having a reinforcement structure that may suppress glass breakage and reduce warpage during large-area substrate processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:玻璃芯</p>  
        <p type="p">200:上部層</p>  
        <p type="p">900:面板</p>  
        <p type="p">20:單元</p>  
        <p type="p">50:加強結構物</p>  
        <p type="p">10:半導體元件</p>  
        <p type="p">A-A’:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1777" publication-number="202628854"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628854.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P58/00</main-classification>  
        <further-classification edition="201801120260323B">C09J7/38</further-classification>  
        <further-classification edition="200601120260323B">C09J133/06</further-classification>  
        <further-classification edition="200601120260323B">C09J201/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細野慶太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSONO, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村奏美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KANAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子知世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, TOMOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置之製造方法，其具備如下工序：準備積層體之工序，前述積層體具備：具備基材層、黏著劑層及接著劑層之切割晶粒接合一體型膜；及將半導體晶圓單片化而成之複數個半導體晶片；藉由使積層體的接著劑層在冷卻條件下擴張，將接著劑層單片化來製作附有接著劑片之半導體晶片之工序；從黏著劑層拾取附有接著劑片之半導體晶片之工序；及將具有半導體晶片及接著劑片之附有接著劑片之半導體晶片經由接著劑片接著於支撐構件上之工序。接著劑層含有熱固化性樹脂成分及彈性體，亦可以進一步含有無機填料。無機填料的含量以膜狀接著劑的總量為基準，為0～5質量%。彈性體包含規定的（甲基）丙烯酸酯聚合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1778" publication-number="202627019"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627019.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134971</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜狀接著劑、切割晶粒接合一體型膜、以及半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C09J133/10</main-classification>  
        <further-classification edition="200601120260317B">C09J163/02</further-classification>  
        <further-classification edition="200601120260317B">C09J163/04</further-classification>  
        <further-classification edition="200601120260317B">C08K3/36</further-classification>  
        <further-classification edition="200601120260317B">C08K7/16</further-classification>  
        <further-classification edition="202601120260317B">H10P54/92</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大河原奎佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWARA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑田孝博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔咳謐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HAEMIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種膜狀接著劑，其含有熱固化性樹脂成分及彈性體，並且可以進一步含有無機填料。無機填料的含量以膜狀接著劑的總量為基準，為0～5質量%。在升溫速度為10℃/分鐘及測定溫度範圍為30～300℃的條件下實施差示掃描量熱測定而獲得之膜狀接著劑之DSC曲線中，在該DSC曲線中觀測到之放熱峰的放熱量為155J/g以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:膜狀接著劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1779" publication-number="202626747"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626747.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜狀接著劑、切割晶粒接合一體型膜、以及半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C08F2/08</main-classification>  
        <further-classification edition="202601120260320B">H10P54/30</further-classification>  
        <further-classification edition="200601120260320B">C09J133/10</further-classification>  
        <further-classification edition="200601120260320B">C09J163/02</further-classification>  
        <further-classification edition="200601120260320B">C09J163/04</further-classification>  
        <further-classification edition="201801120260320B">C09J7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細野慶太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSONO, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村奏美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KANAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子知世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, TOMOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種膜狀接著劑，其含有熱固化性樹脂成分及彈性體，亦可以進一步含有無機填料。無機填料的含量以膜狀接著劑的總量為基準，為0～10質量%。藉由規定的分斷性評價方法來求出之膜狀接著劑的割斷係數m（單位：無量綱）超過0且55以下，前述規定的分斷性評價方法具備如下工序：從膜狀接著劑準備試樣之工序；使用壓入板，實施割斷試驗，藉此求出割斷功W（單位：N・mm）、割斷強度P（單位：N）、及試樣割斷時的長度L（單位：mm）之工序；及依據割斷功W、割斷強度P、及長度L，求出由式（X）表示之割斷係數m之工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:膜狀接著劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1780" publication-number="202626812"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626812.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜狀接著劑、切割晶粒接合一體型膜、以及半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F220/18</main-classification>  
        <further-classification edition="200601120260401B">C08F220/32</further-classification>  
        <further-classification edition="200601120260401B">C08F220/44</further-classification>  
        <further-classification edition="200601120260401B">C09J133/00</further-classification>  
        <further-classification edition="200601120260401B">C09J163/00</further-classification>  
        <further-classification edition="200601120260401B">C09J201/00</further-classification>  
        <further-classification edition="201801120260401B">C09J7/10</further-classification>  
        <further-classification edition="201801120260401B">C09J7/30</further-classification>  
        <further-classification edition="202601120260401B">H10P54/00</further-classification>  
        <further-classification edition="202601120260401B">H10W72/30</further-classification>  
        <further-classification edition="202601120260401B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大河原奎佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWARA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑田孝博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔咳謐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HAEMIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天野良洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMANO, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小宮山剛司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMIYAMA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種含有熱固化性樹脂成分及彈性體之膜狀接著劑。彈性體包含（甲基）丙烯酸酯聚合物，前述（甲基）丙烯酸酯聚合物包含來自於具有環氧基之（甲基）丙烯酸酯之結構單元。（甲基）丙烯酸酯聚合物滿足條件A、條件B、及條件C中的至少1個條件。（條件A）來自於具有環氧基之（甲基）丙烯酸酯之結構單元的含量以（甲基）丙烯酸酯聚合物的全部結構單元為基準，為6質量%以上。（條件B）（甲基）丙烯酸酯聚合物的環氧值為0.40eq/kg以上。（條件C）在（甲基）丙烯酸酯聚合物的紅外吸收光譜中，在將來自於環氧基的反對稱伸縮之吸收峰的面積設為P（A），並且將來自於羰基的伸縮振動之吸收峰的面積設為P（B）時，P（A）及P（B）滿足下述式（1）的條件。P（A）/P（B）≥0.0055   （1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:膜狀接著劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1781" publication-number="202626720"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626720.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗CD123抗體以及其結合物及衍生物</chinese-title>  
        <english-title>ANTI-CD123 ANTIBODIES AND CONJUGATES AND DERIVATIVES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07K16/28</main-classification>  
        <further-classification edition="200601120260324B">A61K39/395</further-classification>  
        <further-classification edition="201701120260324B">A61K47/68</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商免疫原公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMMUNOGEN, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯伏唐　葉蕾那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOVTUN, YELENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔法瑞　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAVARES, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路林元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUI, LINGYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>契坦頓　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITTENDEN, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明大體上係關於結合CD123抗原(介白素-3受體之α鏈或IL-3Rα)之抗體、其抗原結合片段、多肽及免疫結合物。本發明亦係關於使用此種CD123結合分子來診斷及治療諸如B細胞惡性病之疾病的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention generally relates to antibodies, antigen-binding fragments thereof, polypeptides, and immunoconjugates that bind to CD123 antigen (the α chain of the interleukine 3 receptor, or IL-3Rα). The present invention also relates to methods of using such CD123-binding molecules for diagnosing and treating diseases, such as B-cell malignancies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1782" publication-number="202627853"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627853.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示內容的處理方法、裝置及儲存介質</chinese-title>  
        <english-title>DISPLAY CONTENT PROCESSING METHOD, DEVICE AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251001B">G06F21/62</main-classification>  
        <further-classification edition="201301120251001B">G06F21/60</further-classification>  
        <further-classification edition="201301120251001B">G06F21/84</further-classification>  
        <further-classification edition="201801120251001B">G06F9/451</further-classification>  
        <further-classification edition="200601120251001B">G06F3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英華達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC APPLIANCES CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王劍菲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郁興佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, XING-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種顯示內容的處理方法、一種顯示內容的處理裝置及一種電腦可讀儲存介質。所述顯示內容的處理方法包括以下步驟：將所述顯示內容劃分為預設尺寸的多個顯示塊；對各所述顯示塊進行加密處理；以及按大於人眼識別頻率的預設頻率，交替地間隔輸出各所述顯示塊的第一顯示內容及第二顯示內容，並且通過驅動修改顯示記憶體位址。本發明可以用於在不影響肉眼觀看的情況下，防止拍照或截屏導致的資訊洩露。還可以用於避免截屏軟體或指令在後臺截屏或直接經由原位址讀取顯示內容導致的資訊洩露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for processing display content, a device for processing display content, and a computer-readable storage medium. The method for processing display content includes the following steps: dividing the display content into a plurality of display blocks of a preset size; encrypting each display block; and outputting the first display content and the second display content of each display block alternately at a preset frequency greater than the human eye recognition frequency, and modifying the display memory address segment by driving. The present invention can be used to prevent information leakage caused by taking photos or screenshots without affecting the viewing of the naked eye. It can also be used to avoid information leakage caused by screenshot software or instructions taking screenshots in the background or directly reading the display content through the original address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:流程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1783" publication-number="202626441"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626441.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於船隻水翼安全性斷離系統的系統和方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR SAFETY BREAKAWAY SYSTEM FOR BOAT HYDROFOILS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">B63B35/44</main-classification>  
        <further-classification edition="200601120260320B">B63B21/66</further-classification>  
        <further-classification edition="200601120260320B">F16F7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商恩夫高股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENVGO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威利克　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLICK, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉米　傑瑞特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLAMY, JERRETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本宣稱發表一種用於水翼水上載具的安全性斷離系統。其一個或多個水翼組合經由可斷切的連接器和鉸鏈安裝件而來附接至船體。在正常操作時，水翼是被堅固地保持，但如果其與障礙物碰撞而產生高於檻力時，其連接器則以可控形式而作失效，使允許水翼支柱作相對於船體的樞轉或分離。其該運作是為可指領的（例如，經由鉸鏈或連桿），以水翼向上擺動而使該力度不置於全施加在船體上。一個集成阻尼機制  ─  例如一個配有洩壓閥的液壓驅動器或一個處於船體內泡沫填充的凹槽  ─  其可在水翼收回時吸收該衝擊能量。這種分階段的應變是通過去解耦水翼及消散碰撞能量來保護其船隻結構。該系統可以通過重新固定或更換其連接器作復位，以允許其水上載具在受衝擊後作迅速之恢復操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A safety breakaway system for a hydrofoiling watercraft is disclosed. One or more hydrofoil assemblies are attached to the hull via shearable connectors and hinged mounts. During normal operation the hydrofoils are held rigid, but if a collision with an obstacle occurs above a threshold force, the connector fails in a controlled manner, allowing the hydrofoil strut to pivot or detach relative to the hull. The motion is guided (e.g., by a hinge or linkage) so that the foil swings upward instead of imparting full force to the hull. An integrated damping mechanism—such as a hydraulic actuator with a relief valve or a foam-filled recess in the hull—absorbs the impact energy as the foil retracts. This staged response protects the boat’s structure by decoupling the foil and dissipating collision energy. The system is resettable by re-securing or replacing the connector, allowing the watercraft to quickly resume operation after an impact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:水上載具</p>  
        <p type="p">101:船體</p>  
        <p type="p">105:通道</p>  
        <p type="p">110:平行支柱</p>  
        <p type="p">115:船尾水翼翼片</p>  
        <p type="p">120:支架</p>  
        <p type="p">121:點</p>  
        <p type="p">122:鉸鏈</p>  
        <p type="p">130:斷切銷</p>  
        <p type="p">140:液壓驅動器</p>  
        <p type="p">210:船頭支柱</p>  
        <p type="p">215:船頭水翼翼片</p>  
        <p type="p">221:鉸鏈安裝件</p>  
        <p type="p">230:鎖定銷</p>  
        <p type="p">250:能量吸收物質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1784" publication-number="202628874"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628874.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用還原氣體將半導體元件接合至基板的系統及相關方法</chinese-title>  
        <english-title>SYSTEMS FOR BONDING A SEMICONDUCTOR ELEMENT TO A SUBSTRATE USING REDUCING GAS AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P72/00</main-classification>  
        <further-classification edition="202601120260325B">H10W74/01</further-classification>  
        <further-classification edition="202601120260325B">H10W80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商庫利克和索夫工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULICKE AND SOFFA INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格蘭特　提摩西　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANT, TIMOTHY PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆提亞拉　迪拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTHYALA, DHIRAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕倫博　湯瑪斯　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALUMBO, THOMAS J</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔拉布爾斯基　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARABULSKI, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種將半導體元件接合至基板的接合系統。該接合系統包含一接合頭組件，其包含一接合工具，該結合工具配置為將該半導體元件接合至該基板。該接合系統亦包含一還原氣體傳送系統，其用於提供一還原氣體至該接合系統的一接合區域。該還原氣體傳送系統包含一歧管。該歧管包含一下表面，其界定：（i）一還原氣體通口，用於提供該還原氣體至該接合區域，以及（ii）一廢氣通口，用於從該接合區域移除一反應產物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bond head assembly including a bonding tool configured for bonding the semiconductor element to the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas to a bonding area of the bonding system. The reducing gas delivery system includes a manifold. The manifold includes a lower surface defining (i) a reducing gas port for providing the reducing gas to the bonding area, and (ii) an exhaust port for removing a reaction product from the bonding area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">122:歧管</p>  
        <p type="p">122a:下表面</p>  
        <p type="p">122a1:還原氣體通口</p>  
        <p type="p">122a2:廢氣通口</p>  
        <p type="p">122a3:屏蔽氣體通口</p>  
        <p type="p">122a4:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1785" publication-number="202626902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多孔質低介電性聚合物薄膜、積層體及配線電路基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J9/26</main-classification>  
        <further-classification edition="200601120260401B">B32B15/08</further-classification>  
        <further-classification edition="200601120260401B">B32B27/08</further-classification>  
        <further-classification edition="200601120260401B">B32B5/18</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永見直斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多孔質低介電性聚合物薄膜，其於由聚合物構成之薄膜中分散有中空粒子與微細空孔；且&lt;br/&gt; 相對介電常數為2.40以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多孔質低介電性聚合物薄膜</p>  
        <p type="p">11:聚合物</p>  
        <p type="p">12:中空粒子</p>  
        <p type="p">13:空孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1786" publication-number="202628185"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628185.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用降低功率及蝕刻化學品之電漿蝕刻</chinese-title>  
        <english-title>PLASMA ETCHING WITH REDUCED POWER AND ETCH CHEMISTRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H01J37/32</main-classification>  
        <further-classification edition="202601120260330B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立爾　托爾斯滕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILL, THORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　明梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MINGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　允鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, YOUN-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席恩　哈密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, HARMEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">設備包括基板支撐件，其用於在蝕刻期間將基板保持在低溫溫度下；電漿源，其配置成產生位於基板支撐件上方的電漿；離子加速格柵，其位於電漿源與基板支撐件之間，其中離子加速格柵係配置成施加在蝕刻期間使來自電漿之離子朝向基板支撐件加速的電位差；以及蝕刻劑製程氣體之入口，其中該入口位於離子加速格柵與基板支撐件之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus includes a substrate support for holding a substrate at a cryogenic temperature during etching, a plasma source configured to generate a plasma located above the substrate support, an ion acceleration grid located between the plasma source and the substrate support, wherein the ion acceleration grid is configured to apply a potential difference that, during etching, accelerates ions from the plasma toward the substrate support, and an inlet for an etchant process gas, wherein the inlet is located between the ion acceleration grid and the substrate support.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:製程</p>  
        <p type="p">310:操作</p>  
        <p type="p">320:操作</p>  
        <p type="p">330:操作</p>  
        <p type="p">340:操作</p>  
        <p type="p">350:操作</p>  
        <p type="p">360:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1787" publication-number="202628826"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628826.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用鈍化調校的選擇性蝕刻</chinese-title>  
        <english-title>SELECTIVE ETCH WITH PASSIVATION TUNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10P50/20</main-classification>  
        <further-classification edition="200601120260330B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋伯　葛瑞格里　克林頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEBER, GREGORY CLINTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄　天樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, MERRETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧澤爾　塔內爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZEL, TANER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　南科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, NANKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勾帕拉達蘇　普拉伯哈克拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOPALADASU, PRABHAKARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬蒂羅斯揚　瓦哈格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIROSYAN, VAHAGN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　怡然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種在遮罩下方之含碳堆疊中蝕刻凹陷特徵的方法。提供一蝕刻氣體。提供一黏附係數介於0.0001至0.25範圍內的鈍化氣體。將該蝕刻氣體與該鈍化氣體轉化為電漿。使該堆疊暴露於該電漿，其中該電漿相對於該遮罩選擇性地蝕刻該堆疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of etching recessed features in a carbon containing stack below a mask is provided. An etch gas is provided. A passivation gas with a sticking coefficient in a range of 0.0001 to 0.25 is provided. The etch gas and passivation gas are transformed into a plasma. The stack is exposed to the plasma wherein the plasma selectively etches the stack with respect to the mask.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">204,208,212,216,220:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1788" publication-number="202628100"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628100.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135078</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效能記憶體運算電容耦合式靜態隨機存取記憶體電路架構</chinese-title>  
        <english-title>ENERGY EFFICIENT COMPUTE-IN-MEMORY SRAM-C CIRCUIT ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G11C11/412</main-classification>  
        <further-classification edition="200601120260327B">G11C7/10</further-classification>  
        <further-classification edition="200601120260327B">G06F7/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商諾斯洛普格拉曼系統公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORTHROP GRUMMAN SYSTEMS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美國加利福尼亞大學董事會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE REGENTS OF THE UNIVERSITY OF CALIFORNIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班瑟　薩桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANSAL, SHASHANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切里夫　波柴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIF, BOUCHAIB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹文伯斯　傑特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAUWENBERGHS, GERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷塔　戈帕班篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOTA, GOPABANDHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　所米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, SOUMIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電容耦合式靜態隨機存取記憶體(SRAM-C)記憶體運算(CIM)電路包含：至少一個靜態隨機存取記憶體(SRAM)，其經組態以儲存一位元值；至少一個電容耦合式(CC)電路，其耦合至至少一個SRAM；及一能量回收邏輯(ERL)驅動器，其經組態以藉由利用一斜坡正弦熱時脈來回收信號能量。該CC電路包含一第一及第二電容器、一第一對、一第二對、一第三對、一第四對電晶體。各對電晶體包含彼此耦合之一第一及第二電晶體。該第一電容器耦合至該第一及第二對電晶體且該第二電容器耦合至該第三及第四對電晶體。該SRAM-C CIM電路提高該SRAM-C CIM電路之乘積累加(MAC)運算之效率及效力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The capacitively-coupled static random access memory (SRAM-C) compute-in-memory (CIM) circuit includes at least one static random access memory (SRAM) configured to store a bit value, at least one capacitively-coupled (CC) circuit coupled to at least one SRAM, and an energy recovery logic (ERL) driver configured to recover signal energy by utilizing a ramped sinusoidal hot clock. The CC circuit includes a first and second capacitors, a first pair, a second pair, a third pair, a fourth pair of transistors. Each pair of transistors include a first and second transistors coupled to one another. the first capacitor is coupled to the first and second pairs of transistors and the second capacitor is coupled to the third and fourth pairs of transistors. The SRAM-C CIM circuit enhances efficiency and effectiveness of multiply-and-accumulate (MAC) operations of the SRAM-C CIM circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電容耦合式靜態隨機存取記憶體(SRAM-C)記憶體運算(CIM)電路</p>  
        <p type="p">210:SRAM-C CIM單位單元</p>  
        <p type="p">221:列驅動器</p>  
        <p type="p">222:行驅動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1789" publication-number="202627320"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627320.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135079</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改良式鉸接組件及包含此組件之機械系統</chinese-title>  
        <english-title>IMPROVED HINGED COMPONENT, AND MECHANICAL SYSTEM COMPRISING SUCH A COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">F16C17/18</main-classification>  
        <further-classification edition="200601120260324B">F16C33/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商流體力學與摩擦公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYDROMECANIQUE ET FROTTEMENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬斯　伊曼紐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASSE, EMMANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納米斯爾　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMYSL, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種鉸接組件(1)，其具有一個自由度，僅包括兩個同心金屬環形物(3、4)，該兩個同心金屬環形物可繞著一中心軸線(X1)相對於彼此旋轉且在其間界定一摩擦界面(5)，該組件(1)包括：密封裝置，其包括：&lt;br/&gt; 一凸緣(7)及介於該內環形物(4)與該凸緣(7)之間的一第一墊圈(8)；以及&lt;br/&gt; 在該外環形物(3)內突出的一第一肩部(9)及介於該內環形物(4)與該第一肩部(9)之間一第二墊圈(10)，&lt;br/&gt; 該第一墊圈(8)及該第二墊圈(10)由自潤滑材料製成且被容納在該外環形物(3)的內徑中，&lt;br/&gt; 該凸緣(7)由鋼製成且固定在該外環形物(3)的邊緣中挖空的一第二肩部(11)中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a hinged component (1) having one degree of freedom, comprising just two concentric metal rings (3, 4) which are rotatable with respect to one another about a central axis (X1) and define a friction interface (5) therebetween, the component (1) comprising sealing means comprising:&lt;br/&gt; - a flange (7) and a first washer (8) interposed between the inner ring (4) and the flange (7), and;&lt;br/&gt; - a first shoulder (9) projecting inside the outer ring (3) and a second washer (10) interposed between the inner ring (4) and the first shoulder (9);&lt;br/&gt; the first washer (8) and the second washer (10) are made of a self-lubricating material and are received in the inner diameter of the outer ring (3),&lt;br/&gt; - the flange (7) is made of steel and is secured in a second shoulder (11) that is hollowed out in the edge of the outer ring (3).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:改良式鉸接組件</p>  
        <p type="p">3:環形物</p>  
        <p type="p">4:環形物</p>  
        <p type="p">5:摩擦界面</p>  
        <p type="p">6:裝置</p>  
        <p type="p">7:凸緣</p>  
        <p type="p">8:第一墊圈</p>  
        <p type="p">9:第一肩部</p>  
        <p type="p">10:第二墊圈</p>  
        <p type="p">11:第二肩部</p>  
        <p type="p">12:連續雷射焊縫</p>  
        <p type="p">X1:中心軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1790" publication-number="202626055"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626055.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>2-[6-(4-環丙基-4H-1,2,4-三唑-3-基)-2-吡啶基]-5-嗎啉羰基-1-異吲哚啉酮之注射劑型</chinese-title>  
        <english-title>INJECTABLE DOSAGE FORM OF 2-[6-(4-CYCLOPROPYL-4H-1,2,4-TRIAZOL-3-YL)-2-PYRIDYL]-5-MORPHOLINOCARBONYL-1-ISOINDOLINONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/5377</main-classification>  
        <further-classification edition="200601120260401B">A61K47/10</further-classification>  
        <further-classification edition="200601120260401B">A61K9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P1/16</further-classification>  
        <further-classification edition="200601120260401B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商ＧＥＮＦＩＴ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENFIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓思安　瑪麗讓娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOISSAINS, MARIE-JEANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂布特　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THIBOUT, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種注射劑型，其包含：(i)至少1.5 mg/mL的2-[6-(4-環丙基-4H-1,2,4-三唑-3-基)-2-吡啶基]-5-嗎啉羰基-1-異吲哚啉酮；(ii)溶劑，其選自由聚乙二醇300 (PEG300)、聚乙二醇400 (PEG400)及其混合物組成之群；以及(iii)共溶劑，其選自由PEG300、PEG400、丙二醇及其混合物組成之群。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an injectable form comprising: (i) At least 1.5 mg/mL of 2-[6-(4-cyclopropyl-4h-1,2,4-triazol-3-yl)-2-pyridyl]-5-morpholinocarbonyl-1-isoindolinone; (ii) a solvent selected from the group consisting of polyethylene glycol 300 (PEG300), polyethylene glycol 400 (PEG400), and mixtures thereof; and (iii) a co-solvent selected from the group consisting of PEG300, PEG400, propylene glycol, and mixtures thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1791" publication-number="202626921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護膜層用密封劑組成物及電子零件用保護膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08K5/1515</main-classification>  
        <further-classification edition="200601120260401B">C08K5/3417</further-classification>  
        <further-classification edition="200601120260401B">C08L61/06</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification>  
        <further-classification edition="202601120260401B">H10P14/68</further-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友金屬鑛山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向井哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">課題：提供一種樹脂製的保護膜層用密封劑組成物，其係以比由玻璃糊作成的覆蓋劑的燒成溫度低的溫度使其硬化。&lt;br/&gt; 解決手段：該保護膜層用密封劑組成物的特徵係包含在具有降莰烯骨架之醯亞胺基的氮原子上鍵結有2價的烴基(R&lt;sup&gt;1&lt;/sup&gt;)之下述化學式1所示之雙萘二醯亞胺化合物、酚樹脂、及具有1個以上的環氧基之反應性稀釋劑；使用該組成物能形成耐熱性優異的樹脂硬化膜，因此能作為晶片電阻器、晶片電容器等的保護膜層用密封劑使用。&lt;br/&gt;&lt;img align="absmiddle" height="176px" width="521px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; R&lt;sup&gt;1&lt;/sup&gt;為2價的烴基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1792" publication-number="202627189"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627189.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135102</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿增強化學氣相沉積方法</chinese-title>  
        <english-title>PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C23C16/511</main-classification>  
        <further-classification edition="200601120260331B">C23C16/34</further-classification>  
        <further-classification edition="200601120260331B">C23C16/40</further-classification>  
        <further-classification edition="200601120260331B">C23C16/455</further-classification>  
        <further-classification edition="200601120260331B">C23C16/458</further-classification>  
        <further-classification edition="200601120260331B">C23C16/52</further-classification>  
        <further-classification edition="200601120260331B">C23C16/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商國際商業機器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>可迪　代韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTY, DEVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科恩斯　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KERNS, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於處理基板的方法包含設有一電漿增強化學氣相沉積(PECVD)腔室，該PECVD腔室包含設置在其側壁上的側壁氣體入口以及設置在其頂板上的一頂部氣體入口。該方法進一步包含將該基板接收至設置在該PECVD腔室內之基板支架上，將前驅物氣體混合物以第一流速通過該側壁氣體入口流入該PECVD腔室，並以第二流速通過該頂部氣體入口流入該PECVD腔室。且該方法進一步包含施加源功率至該頂板，以自該前驅物氣體混合物形成電漿，以及將該基板暴露至該電漿，以在該基板上方沉積一介電層，該介電層在該基板之邊緣處具有邊緣厚度以及在該基板之中心區域具有中心厚度，該邊緣厚度不同於該中心厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing a substrate includes having a plasma-enhanced chemical vapor deposition (PECVD) chamber including sidewall gas inlets and a top gas inlet disposed on a top plate of the PECVD chamber. The method further includes receiving the substrate on a substrate holder disposed within the PECVD chamber, and flowing a precursor gas mixture into the PECVD chamber through the sidewall gas inlets at a first flow rate and the top gas inlet at a second flow rate. And the method further includes applying a source power to the top plate to form a plasma from the precursor gas mixture, and exposing the substrate to the plasma to deposit a dielectric layer over the substrate, the dielectric layer has an edge thickness at edges of the substrate and a center thickness in a center region of the substrate, the edge thickness is different from the center thickness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">102:基板基底</p>  
        <p type="p">104:第一介電層</p>  
        <p type="p">h&lt;sub&gt;c&lt;/sub&gt;:中心厚度</p>  
        <p type="p">h&lt;sub&gt;e&lt;/sub&gt;:邊緣厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1793" publication-number="202628442"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628442.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135110</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＭＥＭＳ麥克風</chinese-title>  
        <english-title>MEMS MICROPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H04R19/04</main-classification>  
        <further-classification edition="200601120260401B">H04R1/04</further-classification>  
        <further-classification edition="202601120260401B">H10W90/22</further-classification>  
        <further-classification edition="200601120260401B">B81B7/02</further-classification>  
        <further-classification edition="200601120260401B">H01G4/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金龍權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG KWEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明實施例的MEMS麥克風可包括：第一基板；堆疊於第一基板之上且其中形成有空腔的第二基板；設置於空腔內並與第一基板耦合的中介層；與第二基板耦合並在其中形成接收空間的殼體；設置於接收空間內、第二基板上表面的MEMS結構；以及設置於接收空間內、第二基板上表面且與MEMS結構間隔開的訊號處理元件；其中，一個或多個MEMS結構和訊號處理元件可以結合到中介層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The MEMS microphone according to an embodiment of the present invention may comprise: a first substrate; a second substrate stacked upon the first substrate and having a cavity formed therein; an interposer disposed within the cavity and coupled to the first substrate; a housing coupled to the second substrate and forming a receiving space therein; a MEMS structure disposed on the upper surface of the second substrate within the receiving space; and a signal processing element disposed on the upper surface of the second substrate within the receiving space, spaced apart from the MEMS structure; wherein one or more of the MEMS structure and the signal processing element may be bonded onto the interposer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:聲孔</p>  
        <p type="p">100:第一基板</p>  
        <p type="p">200:第二基板</p>  
        <p type="p">210:空腔</p>  
        <p type="p">300:MEMS結構</p>  
        <p type="p">310:本體</p>  
        <p type="p">320:振膜</p>  
        <p type="p">330:背板</p>  
        <p type="p">360:聲孔</p>  
        <p type="p">400:外殼</p>  
        <p type="p">500:訊號處理元件</p>  
        <p type="p">700:接合片</p>  
        <p type="p">800:中介層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1794" publication-number="202628478"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628478.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基座組件以及基板處理裝置</chinese-title>  
        <english-title>SUSCEPTOR ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">H05B6/10</main-classification>  
        <further-classification edition="200601120260320B">H05B6/14</further-classification>  
        <further-classification edition="202601120260320B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＴＥＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TES CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昱熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WOOK-HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種基座組件以及基板處理裝置，更詳細地涉及一種可以容易地調節基板的溫度而有效地進行對基板的蝕刻等製程的基座組件以及基板處理裝置。本發明的支承基板並調節所述基板的溫度的基座組件具備：基座，被安放所述基板，並加熱或者冷卻所述基板加且朝向所述基板供應懸浮氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:腔體</p>  
        <p type="p">110:腔體主體</p>  
        <p type="p">114:處理空間</p>  
        <p type="p">120:蓋</p>  
        <p type="p">122:氣體供應線</p>  
        <p type="p">124:擴散空間</p>  
        <p type="p">200:氣體供應單元</p>  
        <p type="p">210:蓋部</p>  
        <p type="p">212:狹縫</p>  
        <p type="p">230:燈</p>  
        <p type="p">300:基座組件</p>  
        <p type="p">305:基座</p>  
        <p type="p">310:上基座</p>  
        <p type="p">311:台階部</p>  
        <p type="p">314:供應孔</p>  
        <p type="p">316:脫離防止銷</p>  
        <p type="p">320:冷卻流路</p>  
        <p type="p">330:固定環</p>  
        <p type="p">350:下基座</p>  
        <p type="p">352:溫度調節流路</p>  
        <p type="p">354:容納空間</p>  
        <p type="p">370:支承桿</p>  
        <p type="p">410:第二區域加熱器</p>  
        <p type="p">430:第一區域加熱器</p>  
        <p type="p">1000:基板處理裝置</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1795" publication-number="202629016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝結構</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/63</main-classification>  
        <further-classification edition="202601120260323B">H10W90/22</further-classification>  
        <further-classification edition="202601120260323B">H10W40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭筌安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUAN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊博智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PO-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊挺立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TING-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃震麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種半導體封裝結構。該半導體封裝結構包括第一基板、第一半導體晶片以及第一記憶元件。該第一半導體晶片設置於該第一基板之上，且具有鄰近該第一基板的第一表面以及遠離該第一基板的第二表面。該第一半導體晶片包括設置於該第一半導體晶片第二表面上的第一鍵合層。該第一記憶元件設置於該第一半導體晶片之上。該第一記憶元件垂直重疊該第一半導體晶片。該第一記憶元件包括鄰近該第一半導體晶片第二表面的第二鍵合層。該第一記憶元件通過由該第一鍵合層和該第二鍵合層形成的第一連接結構與該第一半導體晶片耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package structure is provided. The semiconductor package structure includes a first substrate, a first semiconductor die, and a first memory component. The first semiconductor die is disposed over the first substrate and has a first surface adjacent to the first substrate and a second surface away from the first substrate. The first semiconductor die includes a first bonding layer disposed on the second surface of the first semiconductor die. The first memory component is disposed over the first semiconductor die. The first memory component vertically overlaps the first semiconductor die. The first memory component includes a second bonding layer adjacent to the second surface of the first semiconductor die. The first memory component is coupled to the first semiconductor die through a first connection structure formed by the first bonding layer and the second bonding layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體封裝結構</p>  
        <p type="p">102:基板</p>  
        <p type="p">102a:導電層</p>  
        <p type="p">102b:介電層</p>  
        <p type="p">102p:導電墊</p>  
        <p type="p">102s1:底表面</p>  
        <p type="p">102s2:頂表面</p>  
        <p type="p">102v:通孔</p>  
        <p type="p">104:導電材料</p>  
        <p type="p">105:填充材料</p>  
        <p type="p">106:被動元件</p>  
        <p type="p">108:被動元件</p>  
        <p type="p">110:導電結構</p>  
        <p type="p">202:基板</p>  
        <p type="p">202s1:第一表面</p>  
        <p type="p">202s2:第二表面</p>  
        <p type="p">204:橋接結構</p>  
        <p type="p">206:導電連接器</p>  
        <p type="p">207:底填</p>  
        <p type="p">208:導電連接器</p>  
        <p type="p">209:底填</p>  
        <p type="p">300:半導體晶片</p>  
        <p type="p">300-1:半導體晶片</p>  
        <p type="p">300-2:半導體晶片</p>  
        <p type="p">300-3:半導體晶片</p>  
        <p type="p">300s1:第一表面</p>  
        <p type="p">300s2:第二表面</p>  
        <p type="p">400:記憶元件</p>  
        <p type="p">407:介電層</p>  
        <p type="p">408:模塑化合物</p>  
        <p type="p">502:熱散層</p>  
        <p type="p">510:環形元件</p>  
        <p type="p">CR:核心</p>  
        <p type="p">FP:扇出封裝</p>  
        <p type="p">R1:區域</p>  
        <p type="p">RD-1:重分佈層</p>  
        <p type="p">RD-2:重分佈層</p>  
        <p type="p">TH:孔</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1796" publication-number="202628380"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628380.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測設備、偵測系統及偵測方法</chinese-title>  
        <english-title>DETECTING APPARATUS, DETECTING SYSTEM AND DETECTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260320B">H04B10/079</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商富克有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLUKE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫斯頓　威廉Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINSTON, WILLIAM F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示用於偵測光學訊號路徑中之傳輸器-接收器極性錯誤組態的技術。一種用於偵測極性錯誤組態的設備包括光源、傳輸埠、及光偵測器。傳輸埠經組態以傳輸使用光源產生的傳出光學訊號。光偵測器與傳輸埠光學通訊且經組態以經由傳輸埠偵測傳入光學訊號。在一些實施例中，設備回應於偵測到極性錯誤組態而產生警示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for detecting transmitter-receiver polarity misconfigurations in an optical signal path are disclosed. An apparatus for detecting polarity misconfigurations includes a light source, a transmitting port, and a photodetector. The transmitting port is configured to transmit an outgoing optical signal produced using the light source. The photodetector is in optical communication with the transmitting port and is configured to detect an incoming optical signal via the transmitting port. In some embodiments, the apparatus produces an alert in response to detecting a polarity misconfiguration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:光纜線</p>  
        <p type="p">102:收發器</p>  
        <p type="p">103:測試參考纜線</p>  
        <p type="p">104:診斷架構</p>  
        <p type="p">106:傳輸器</p>  
        <p type="p">108:偵測器</p>  
        <p type="p">110:接收器</p>  
        <p type="p">112:收發器</p>  
        <p type="p">113:測試參考纜線</p>  
        <p type="p">114:診斷架構</p>  
        <p type="p">116:傳輸器</p>  
        <p type="p">118:偵測器</p>  
        <p type="p">120:接收器</p>  
        <p type="p">122:運算裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1797" publication-number="202626015"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626015.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>口腔護理組合物</chinese-title>  
        <english-title>ORAL CARE COMPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/92</main-classification>  
        <further-classification edition="200601120260401B">A61K8/60</further-classification>  
        <further-classification edition="200601120260401B">A61Q11/00</further-classification>  
        <further-classification edition="201601120260401B">A23K20/163</further-classification>  
        <further-classification edition="201601120260401B">A23K10/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽洛麥翠克技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THERAMETRIC TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商塔塔盾寵物用品公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARTAR SHIELD PET PRODUCTS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡佛　奈森尼爾　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOOVER, NATHANIEL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡琳西　羅伯特　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARLINSEY, ROBERT L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示含有椰子油之口腔護理組合物，及製造並使用其之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Oral care compositions containing coconut oil are disclosed, and methods of making and using the same.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1798" publication-number="202628430"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628430.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有超構光學的緊湊型相機模組</chinese-title>  
        <english-title>COMPACT CAMERA MODULE WITH META OPTICS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260320B">H04N23/00</main-classification>  
        <further-classification edition="202101120260320B">G02B7/00</further-classification>  
        <further-classification edition="202101120260320B">G03B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商尼爾技術有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIL TECHNOLOGY APS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬廷森　弗雷德裏克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTINSON, FREDRIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密德林　莫里茨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDLIN, MORITZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包括提供光學堆疊的方法，其中光學堆疊包括第一超透鏡，第二超透鏡以及將第一超透鏡與第二超透鏡黏接在一起的第一黏接層，將相機模組間隔部分附接到光學堆疊的底側以形成相機模組的至少一部分，其中相機模組間隔部分包括間隔層，並且相機模組間隔部分配置為，在相機模組間隔部分附接到光學堆疊時，相機模組的物距基於相機模組間隔部分的調節長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:超透鏡相機模組，相機模組，系統，模組</p>  
        <p type="p">101:孔徑光闌</p>  
        <p type="p">102:光學堆疊，光學堆疊部分，堆疊</p>  
        <p type="p">104:相機模組間隔部分，間隔部分，部分</p>  
        <p type="p">106:圖像感測器部分</p>  
        <p type="p">107:圖案化層，層</p>  
        <p type="p">108:第一MOE基板，基板</p>  
        <p type="p">109:抗反射塗層(ARC)層，ARC層</p>  
        <p type="p">110:第二MOE基板,MOE基板</p>  
        <p type="p">111:封裝層</p>  
        <p type="p">112:黏合劑</p>  
        <p type="p">113:MOE</p>  
        <p type="p">114:黏合層</p>  
        <p type="p">115:圖案化層</p>  
        <p type="p">116:間隔層</p>  
        <p type="p">117:MOE</p>  
        <p type="p">118:黏合層，黏合劑</p>  
        <p type="p">120:覆蓋玻璃</p>  
        <p type="p">121:間隔</p>  
        <p type="p">122:支撐基板</p>  
        <p type="p">123:第二孔徑光闌，孔徑光闌</p>  
        <p type="p">124:外部電氣連接</p>  
        <p type="p">126:圖像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1799" publication-number="202628621"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628621.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造用於高電子移動性電晶體之基體的中間基體</chinese-title>  
        <english-title>INTERMEDIATE SUBSTRATE FOR MANUFACTURING A SUBSTRATE FOR A HIGH ELECTRON MOBILITY TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D30/01</main-classification>  
        <further-classification edition="202501120260327B">H10D30/47</further-classification>  
        <further-classification edition="202501120260327B">H10D62/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商索泰克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOITEC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上法蘭西理工大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITE POLYTECHNIQUE HAUTS-DE-FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法國國家科學研究中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法國里爾大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITE DE LILLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布戴　蒂埃里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUDET, THIERRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格蘭特皮耶隆　弗朗索瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANDPIERRON, FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美德加伯　法里德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDJDOUB, FARID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於製造一高電子移動性電晶體(HEMT)之中間基體(100)，其包含：&lt;br/&gt; ○ 一支撐基體(10)，其由多晶碳化矽製成，該多晶碳化矽具有介於1 Ω.cm與10 kΩ.cm之間的電阻率，以及&lt;br/&gt; ○ 一單晶GaN晶種層(20)，&lt;br/&gt; 該中間基體(100)介於該支撐基體(10)之該碳化矽與該晶種層(20)之間的添加或不添加材料的一直接接合界面(15)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an intermediate substrate (100) for manufacturing a high electron mobility transistor (HEMT), comprising:&lt;br/&gt; ○ a support substrate (10) made of polycrystalline silicon carbide having an electrical resistivity comprised between 1 Ω.cm and 10 kΩ.cm, and&lt;br/&gt; ○ a single-crystal GaN seed layer (20),&lt;br/&gt; said intermediate substrate (100) comprising a direct bonding interface (15) with or without the addition of material between the silicon carbide of the support substrate (10) and the seed layer (20).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐基體</p>  
        <p type="p">15:直接接合界面，接合界面</p>  
        <p type="p">35:緩衝層，均質單晶GaN或單晶AlGaN緩衝層</p>  
        <p type="p">40:通道，GaN通道，電晶體通道</p>  
        <p type="p">50:障壁層，障壁</p>  
        <p type="p">61:源極電極</p>  
        <p type="p">62:汲極電極</p>  
        <p type="p">63:閘極電極</p>  
        <p type="p">70:覆蓋層</p>  
        <p type="p">L&lt;sub&gt;GD&lt;/sub&gt;:距離，閘極-汲極距離，閘極至汲極距離</p>  
        <p type="p">L&lt;sub&gt;GS&lt;/sub&gt;:距離，閘極至源極距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1800" publication-number="202625889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於蛋生育力和性別檢測的系統和方法</chinese-title>  
        <english-title>SYSTEM AND METHOD OF EGG FERTILITY AND GENDER DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260320B">A01K63/00</main-classification>  
        <further-classification edition="200601120260320B">G01N33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商瑪崔斯帕克技術解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATRIXSPEC SOLUTIONS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩加迪　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了一種用於確定未孵化蛋的性別的系統和方法。該方法包括：將蛋從初始位置傾斜到成角度的中間位置，並保持所述中間位置第一預定時間段；將所述蛋從所述中間位置傾斜到水平位置，並保持所述水平位置第二預定時間段；操作至少一個相機以在所述蛋被光源照亮時捕獲所述蛋的至少一個圖像；並且處理所述至少一個圖像，以基於位於所述至少一個圖像中的至少一種生物標誌物來確定所述蛋的性別和/或生育力，其中，所述水平位置是相對於所述至少一個相機的成像平面來限定的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:相機</p>  
        <p type="p">104:光源</p>  
        <p type="p">106:蛋保持器</p>  
        <p type="p">108:輸送機</p>  
        <p type="p">110:電腦</p>  
        <p type="p">114:輸送機控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1801" publication-number="202626110"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626110.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135191</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗體藥物偶聯物聯合ＶＥＧＦＲ　ＴＫＩ和／或蒽環類藥物治療癌症的用途</chinese-title>  
        <english-title>THE USE OF ANTIBODY-DRUG CONJUGATES COMBINED WITH VEGFR TKI AND/OR ANTHRACYCLINES FOR CANCER TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07D491/22</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260401B">A61K31/704</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州恆邦藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU HANSOH PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫丹妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, DANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周遠鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YUANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用於預防和/或治療腫瘤疾病的治療劑組合。具體而言，本發明提供一種抗體藥物偶聯物，聯合VEGFR TKI，和/或聯合蒽環類藥物在製備用於預防和/或治療癌症藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a therapeutic agent combination for the prevention and/or treatment of tumor diseases. Specifically, the invention provides an antibody-drug conjugate, in combination with VEGFR TKIs, and/or in combination with anthracyclines for use in the preparation of drugs for the prevention and/or treatment of cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1802" publication-number="202626721"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626721.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＧＩＰＲ結合分子及醫藥用途</chinese-title>  
        <english-title>GIPR-BINDING MOLECULE AND THE PHARMACEUTICAL USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付雅媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, YAYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金薪盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, XINSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瀟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及GIPR結合分子及醫藥用途。具體而言，本揭露提供一種GIPR結合分子、醫藥組成物、製備方法，及用於治療代謝性疾病的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to GIPR-binding molecule and the pharmaceutical use thereof. Specifically, the disclosure provides a GIPR-binding molecule, a pharmaceutical composition, a preparation method, and a use thereof for the treatment of metabolic diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1803" publication-number="202626640"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626640.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種烯炔類化合物及其應用</chinese-title>  
        <english-title>AN ENE-YNE COMPOUND AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D471/04</main-classification>  
        <further-classification edition="200601120260401B">C07D411/12</further-classification>  
        <further-classification edition="200601120260401B">C07D411/14</further-classification>  
        <further-classification edition="200601120260401B">C07D413/14</further-classification>  
        <further-classification edition="200601120260401B">A61K31/444</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4436</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈敏強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, MINQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀菁菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JINGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種烯炔類化合物及其應用。具體而言，提供式I所示化合物或其可藥用鹽，其中官能團如文本中定義。還提供I所示化合物的製備方法及含有該類化合物的醫藥組成物以及其作為治療劑的用途，特別是作為SMARCA2抑制劑的用途和其在製備預防和/或治療癌症的藥物中的用途。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="123px" width="372px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an ene-yne compound and use thereof. Specifically, a compound of Formula I or a pharmaceutically acceptable salt thereof is provided, wherein the functional groups are as defined herein. Also provided are methods for preparing the compound of Formula I, pharmaceutical compositions containing the compound, and its use as a therapeutic agent, particularly as a SMARCA2 inhibitor and in the preparation of a medicament for the prevention and/or treatment of cancer.</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="119px" width="360px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1804" publication-number="202626722"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626722.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗Ｂ７－Ｈ３抗體及其醫藥用途</chinese-title>  
        <english-title>ANTI-B7-H3 ANTIBODY AND MEDICAL USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王曉唯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金薪盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, XINSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及抗B7-H3抗體及其醫藥用途。具體地，本揭露涉及抗B7-H3抗體在製備治療或預防與B7-H3相關的疾病或病症的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to an anti-B7-H3 antibody and medical use thereof. Specifically, the disclosure provides use of an anti-B7-H3 antibody in the preparation of a medicament for treating or preventing a disease or disorder associated with B7-H3.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1805" publication-number="202627143"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627143.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空處理裝置及台板腔室</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C23C14/35</main-classification>  
        <further-classification edition="200601120260320B">C23C14/24</further-classification>  
        <further-classification edition="200601120260320B">C23C16/44</further-classification>  
        <further-classification edition="200601120260320B">C23C16/54</further-classification>  
        <further-classification edition="200601120260320B">C23C16/56</further-classification>  
        <further-classification edition="202301120260320B">H10K71/16</further-classification>  
        <further-classification edition="202301120260320B">H10K71/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛發科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULVAC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之台板腔室具有：台板機構、底部、後方壁部、橫向側壁部、前方凸緣部、及曲頂部。前述台板機構係在能夠搬出搬入之橫向位置、與接近真空處理部且豎立為能夠真空處理之縱向位置之間，將基板在減壓下旋轉。前述後方壁部自前述底部之後方端向上方豎立設置，形成有搬出搬入前述基板之狹槽。前述橫向側壁部自前述底部之左右端向上方豎立設置，將後端連接於前述後方壁部。前述前方凸緣部自前述底部之前方端向上方豎立設置，連接於前述橫向側壁部之前方端，包圍向前述真空處理部開口之處理開口部之周圍。前述曲頂部分別連接於前述前方凸緣部、前述後方壁部及前述橫向側壁部之上端。前述橫向側壁部自前述曲頂部向前述底部呈外向凸狀圓曲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4a:搬送口</p>  
        <p type="p">10:台板腔室</p>  
        <p type="p">11:底部</p>  
        <p type="p">12:後方壁部</p>  
        <p type="p">13:連接凸緣部(前方凸緣部)</p>  
        <p type="p">14:右橫向側壁部(橫向側壁部)</p>  
        <p type="p">14h:貫通孔部</p>  
        <p type="p">14m:作業開口部</p>  
        <p type="p">15:左橫向側壁部(橫向側壁部)</p>  
        <p type="p">16:曲頂部</p>  
        <p type="p">76s1:外後補強肋部</p>  
        <p type="p">76s2:外前補強肋部</p>  
        <p type="p">B14:右下端邊界線</p>  
        <p type="p">B34:右前端邊界曲線</p>  
        <p type="p">B36:前上端邊界橫直線</p>  
        <p type="p">B46:右上端邊界曲線</p>  
        <p type="p">B56:左上端邊界曲線</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1806" publication-number="202626597"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626597.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接子部分</chinese-title>  
        <english-title>LINKER MOIETIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C07C275/14</main-classification>  
        <further-classification edition="200601120260331B">C07D491/22</further-classification>  
        <further-classification edition="200601120260331B">C07K16/00</further-classification>  
        <further-classification edition="201701120260331B">A61K47/68</further-classification>  
        <further-classification edition="200601120260331B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYERS, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦桑　拉賈維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, RAJAVEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱　思賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHOO, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供連接子部分，該連接子部分包含(a)用於與抗原結合部分偶聯之胺基基團；(b)用於連接包含酬載之部分之至少一個點擊基團；(c)脲基團： &lt;br/&gt;&lt;img align="absmiddle" height="130px" width="182px" file="ed10216.JPG" alt="ed10216.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中R&lt;sup&gt;N&lt;/sup&gt;係選自H及-(C&lt;sub&gt;1-5&lt;/sub&gt;伸烷基)-C(O)OH，其中一個CH&lt;sub&gt;2&lt;/sub&gt;單元可經-O-置換， &lt;br/&gt;a指示該胺基基團連接至該脲基團之處；且 &lt;br/&gt;b指示該至少一個點擊基團連接至該脲基團之處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided here are linker moieties comprising (a) an amino group for conjugation to an antigen-binding moiety; (b) at least one click group for connecting a payload comprising moiety; (c) a urea group: &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="180px" file="ed10217.JPG" alt="ed10217.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein R&lt;sup&gt;N&lt;/sup&gt; is selected from H and -(C&lt;sub&gt;1-5&lt;/sub&gt; alkylene)-C(O)OH, where one CH&lt;sub&gt;2&lt;/sub&gt; unit may be replaced by -O-, &lt;br/&gt;a indicates where the amino group is linked to the urea group; and &lt;br/&gt;b indicates where the at least one click group is linked to the urea group.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1807" publication-number="202626630"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626630.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135211</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機發光元件以及其的有機物層用組成物</chinese-title>  
        <english-title>ORGANIC LIGHT-EMITTING DEVICE AND ITS COMPOSITION FOR ORGANIC LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D405/14</main-classification>  
        <further-classification edition="200601120260401B">C07D409/14</further-classification>  
        <further-classification edition="200601120260401B">C09K11/06</further-classification>  
        <further-classification edition="202301120260401B">H10K85/60</further-classification>  
        <further-classification edition="202301120260401B">H10K50/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＴ素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LT MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴建裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GEON YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧永錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NO, YOUNG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔大赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DAE HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種有機發光元件以及其的有機物層用組成物，有機發光元件的有機物層包括：（1）選自由下述化學式1以及化學式2表示的雜環化合物所組成的群組的兩種雜環化合物以及選自由下述化學式3以及化學式4表示的雜環化合物所組成的群組的一種雜環化合物或者（2）選自由下述化學式1以及化學式2表示的雜環化合物所組成的群組的一種雜環化合物以及下述選自由下述化學式3以及化學式4表示的雜環化合物所組成的群組的兩種雜環化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">200:陽極</p>  
        <p type="p">300:有機物層</p>  
        <p type="p">400:陰極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1808" publication-number="202626202"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626202.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應匣總成及其使用方法</chinese-title>  
        <english-title>REACTION CARTRIDGE ASSEMBLY AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01L3/00</main-classification>  
        <further-classification edition="200601120260401B">C12M1/34</further-classification>  
        <further-classification edition="200601120260401B">C12M1/38</further-classification>  
        <further-classification edition="201801120260401B">C12Q1/686</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商麻雀生物公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPARROW BIO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　文定</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEM, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯利爾　瑞秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLLIER, RACHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布勒利斯　澤維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOULERICE, XAVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯賓遜　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBINSON, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈德　克里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARDER, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請尤其提供適用於執行諸如核酸擴增反應之反應的簡化反應匣總成。在一實施例中，一種反應匣總成包含：上接收貯槽；反應貯槽，該反應貯槽固定地或可拆卸地附接於該上接收貯槽以在其間提供流體連通；以及封閉蓋，該封閉蓋經設定尺寸且經組態以匹配該上接收貯槽，當蓋體位於該上接收貯槽中時，該封閉蓋用於密封該反應貯槽及/或用於將材料輸送至該反應貯槽中。亦提供使用匣總成執行諸如核酸擴增反應之反應的方法，該匣總成包含上接收貯槽、反應貯槽、以及封閉蓋，該反應貯槽固定地或可拆卸地附接於該上接收貯槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Among other things, the present application provides simplified reaction cartridge assemblies suitable for use in performing reactions, such as nucleic acid amplification reactions. In an embodiment, a reaction cartridge assembly comprises: an upper receiving reservoir; a reaction reservoir fixedly or removably attached to the upper receiving reservoir to provide fluid communication therebetween; and a closure cap, sized and configured to fit in the upper receiving reservoir, for sealing the reaction reservoir and/or for transferring materials into the reaction reservoir when the cap body is positioned in the upper receiving reservoir. Also provided are methods of performing a reaction, such as a nucleic acid amplification reaction, using a cartridge assembly that comprises an upper receiving reservoir, a reaction reservoir fixedly or removably attached to the upper receiving reservoir and a closure cap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:反應匣</p>  
        <p type="p">20:反應貯槽</p>  
        <p type="p">24:平面側壁/主要平面壁</p>  
        <p type="p">26:平面側壁/次要平面壁</p>  
        <p type="p">50:接收貯槽</p>  
        <p type="p">52:開口端殼體</p>  
        <p type="p">55:頂部開口端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1809" publication-number="202627070"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627070.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱循環裝置及總成</chinese-title>  
        <english-title>THERMAL CYCLING DEVICE AND ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12M1/38</main-classification>  
        <further-classification edition="200601120260401B">C12M1/36</further-classification>  
        <further-classification edition="200601120260401B">C12M1/40</further-classification>  
        <further-classification edition="200601120260401B">B01L7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商麻雀生物公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPARROW BIO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈德　克里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARDER, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　文定</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEM, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請尤其提供熱循環控制裝置設備及熱循環方法，該等設備及該等方法提供反應匣內之反應之加熱及冷卻。在某些實施例中，一種熱循環控制裝置總成包含：(a)熱源；以及(b)至少一個熱交換模組，該至少一個熱交換模組之各者包括：用於接收反應匣之熱套管，該熱套管包含殼體，該殼體由底面板及第一對相對的平面側面板形成，該第一對相對的平面側面板與第二對相對的平面側面板間隔開；用於將熱量自該熱源傳遞至該熱套管之構件；以及用於冷卻該熱套管之構件。亦提供一種適於與該熱循環控制裝置總成一起使用之反應匣及使用熱循環控制裝置總成來執行反應(例如，非等溫反應)，諸如核酸擴增反應(例如，非等溫核酸反應)之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Among other things, the present application provides thermal cycler apparatuses and thermal cycling methods that provides heating and cooling of reactions within a reaction cartridge. In certain embodiments, a thermal cycler assembly comprises: (a) a heat source; and (b) at least one heat-exchanging module, each of which include: a thermal well for receiving a reaction cartridge, said thermal well comprising a housing formed of a bottom panel and a first pair of opposing planar side panels spaced apart from a second pair of opposing planar side panels; means for transferring heat from the heat source to the thermal well; and means for cooling the thermal well. Also provided is a reaction cartridge suitable for use with the thermal cycler assembly and methods of using a thermal cycler assembly for performing reactions (e.g., non-isothermal reactions), such as nucleic acid amplification reactions (e.g., non-isothermal nucleic acid reactions).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:熱交換器模組/熱循環控制裝置總成</p>  
        <p type="p">20:熱套管</p>  
        <p type="p">22:上開口端</p>  
        <p type="p">32,34:鰭片散熱器</p>  
        <p type="p">36,38:風扇</p>  
        <p type="p">54:側面板</p>  
        <p type="p">60:熱電冷卻器</p>  
        <p type="p">70:濾色輪</p>  
        <p type="p">72:濾色片</p>  
        <p type="p">80:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1810" publication-number="202626631"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626631.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜環化合物、包括其的有機發光元件以及有機物層用組成物</chinese-title>  
        <english-title>HETEROCYCLIC COMPOUND, ORGANIC LIGHT-EMITTING DEVICE AND COMPOSITION FOR ORGANIC LAYER INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D405/14</main-classification>  
        <further-classification edition="200601120260401B">C07D409/14</further-classification>  
        <further-classification edition="200601120260401B">C09K11/06</further-classification>  
        <further-classification edition="202301120260401B">H10K85/60</further-classification>  
        <further-classification edition="202301120260401B">H10K50/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＴ素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LT MATERIALS CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴建裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GEON YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧永錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NO, YOUNG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔大赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DAE HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種由化學式1表示的雜環化合物、包括其的有機發光元件以及有機物層用組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">200:陽極</p>  
        <p type="p">300:有機物層</p>  
        <p type="p">400:陰極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1811" publication-number="202626635"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626635.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135222</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療代謝病症之組合物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR TREATING METABOLIC DISORDERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D417/12</main-classification>  
        <further-classification edition="200601120260401B">C07D285/135</further-classification>  
        <further-classification edition="200601120260401B">A61K31/433</further-classification>  
        <further-classification edition="200601120260401B">A61K31/496</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260401B">A61K31/454</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商赤道療法股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EQUATOR THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威得森　凱薩琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIDDOWSON, KATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希尼克　喬納　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINICK, JONAH DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏　西蒙　樂　庫恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VU,SIMON LE CUONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木純二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, JUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案概言之係關於亦可用於治療、預防、診斷及/或管理各種代謝病症之化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure generally relates compounds that can also be used for the treatment, prevention, diagnosis and/or management of various metabolic disorders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1812" publication-number="202626632"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626632.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件之製造方法及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D409/06</main-classification>  
        <further-classification edition="200601120260401B">C09K11/06</further-classification>  
        <further-classification edition="202301120260401B">H10K30/60</further-classification>  
        <further-classification edition="202301120260401B">H10K85/20</further-classification>  
        <further-classification edition="202301120260401B">H10K30/30</further-classification>  
        <further-classification edition="202301120260401B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和泉彩香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUMI, SAIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦寛記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米久田康智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKUTA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種對藍綠光的響應性的電場強度依賴性小的光電轉換元件。又，本發明提供一種與上述光電轉換元件有關之攝像元件、光感測器、攝像元件之製造方法及化合物。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜含有式（1）所表示之化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="218px" width="274px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10a:光電轉換元件</p>  
        <p type="p">11:導電性膜(下部電極)</p>  
        <p type="p">12:光電轉換膜</p>  
        <p type="p">15:透明導電性膜(上部電極)</p>  
        <p type="p">16A:電子阻擋膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1813" publication-number="202628496"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628496.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路基板用積層體及撓性多層電路基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">H05K1/02</main-classification>  
        <further-classification edition="200601120260323B">H05K1/03</further-classification>  
        <further-classification edition="200601120260323B">C09J9/00</further-classification>  
        <further-classification edition="200601120260323B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永見直斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路基板用積層體，具備金屬層、及配置於前述金屬層之厚度方向上之一面之絕緣層，前述絕緣層具有多孔質絕緣體區域及非多孔質絕緣體區域，前述絕緣層於前述絕緣層之剖面且為與前述厚度方向正交之剖面中，具有在長度方向上以前述多孔質絕緣體區域、前述非多孔質絕緣體區域及前述多孔質絕緣體區域之順序排列之部位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣層</p>  
        <p type="p">2:金屬層</p>  
        <p type="p">11:多孔質絕緣體區域</p>  
        <p type="p">12:非多孔質絕緣體區域</p>  
        <p type="p">A-A':剖面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1814" publication-number="202626709"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626709.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向血管生成因子及發炎因子之多特異性融合蛋白</chinese-title>  
        <english-title>MULTISPECIFIC FUSION PROTEINS TARGETING ANGIOGENIC AND INFLAMMATORY FACTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/22</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07K16/24</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification>  
        <further-classification edition="200601120260401B">A61P9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申　維勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, WEI YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　金忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JINZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種融合蛋白或其抗原結合片段或抗原結合域，其包含靶向且能夠結合VEGF家族成員中之至少一者、IL-6或IL-6R及Ang-2之結合構築體。抗體融合蛋白包含以下各者作為結合組分：VEGF抗體之一對重鏈及輕鏈、IL-6或IL-6R抗體之一對重鏈及輕鏈，以及與該VEGF抗體及該IL-6或IL-6R抗體中之各者連接的針對Ang-2之單域抗體或結合多肽，其中該VEGF抗體及該IL-6或IL-6R抗體之恆定域經修飾以增強融合蛋白之形成。該融合蛋白適用於治療或控制病因在於異常血管生成（包括過度血管生成）、血管滲漏增加及炎症中之至少一者的眼部或全身性疾病、病狀或病症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fusion protein or an antigen-binding fragment or domain thereof comprises a binding construct targeting and being capable of binding at least one of the VEGF family members, IL-6 or IL-6R, and Ang-2. The antibody fusion protein comprises, as binding components, a pair of heavy chain and light chain of a VEGF antibody, a pair of heavy chain and light chain of an IL-6 or IL-6R antibody, and a single domain antibody or binding polypeptide directed against Ang-2 that is linked to each of the VEGF antibody and the IL-6 or IL-6R antibody, wherein the constant domains of the VEGF antibody and the IL-6 or IL-6R antibody are modified to enhance the formation of the fusion protein. The fusion protein is useful in treating or controlling an ocular or systemic disease, condition, or disorder that has etiology in at least one of aberrant angiogenesis (including excessive angiogenesis), increased vascular leakage, and inflammation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1815" publication-number="202626176"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626176.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲存容器及儲存方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">B01D53/26</main-classification>  
        <further-classification edition="200601120260330B">B65D81/18</further-classification>  
        <further-classification edition="200601120260330B">B65D81/26</further-classification>  
        <further-classification edition="200601120260330B">F26B9/06</further-classification>  
        <further-classification edition="200601120260330B">F26B25/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商西部技研股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIBU GIKEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向山虹祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKIYAMA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤上彩子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKAMI, AYAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河口和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種儲存容器，其結構簡單且不需要電源，能夠將容器內長期維持於低露點環境，並且能夠容易搬運。本發明的儲存容器係具有門體和本體之氣密性儲存容器，藉由配置承載有吸附材之蜂巢式濾芯，來維持容器內的低露點環境。又，將蜂巢式濾芯設為可更換，並且收容於收容部中以可裝卸地安裝於儲存容器。此外，採用磁吸密封門體，雖然結構簡單，但氣密性優異，能夠容易地啟閉門體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:儲存容器</p>  
        <p type="p">2:門體</p>  
        <p type="p">3:本體</p>  
        <p type="p">4:鉸鏈</p>  
        <p type="p">5:磁吸密封條</p>  
        <p type="p">6:磁性金屬板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1816" publication-number="202626357"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626357.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135285</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層薄膜、半導體之製造方法、及半導體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B32B27/00</main-classification>  
        <further-classification edition="200601120260323B">B32B27/36</further-classification>  
        <further-classification edition="200601120260323B">B32B3/30</further-classification>  
        <further-classification edition="200601120260323B">C08J5/18</further-classification>  
        <further-classification edition="202001120260323B">C08J7/04</further-classification>  
        <further-classification edition="202601120260323B">H10W74/01</further-classification>  
        <further-classification edition="200601120260323B">B29C33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鹽見篤史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOMI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田龍太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMATA, RYUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木維允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TADAMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合田亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOUDA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積層薄膜，其係至少具有以聚酯為主構成成分之基材薄膜、與脫模層的積層薄膜，積層薄膜之至少一方的表面之中心面平均粗糙度SRa為0.01μm以上20.0μm以下，關於從積層薄膜之至少一方的脫模層側表面所測定之中心面平均粗糙度SRa，利用以下方法進行加熱壓製後之值比加熱壓製前之值降低50.0%以上。提供一種薄膜，其具有優異的真空吸附性等脫氣之特性，並且可防止異物往壓製區域內的滲入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1817" publication-number="202626723"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626723.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人類密連蛋白(CLAUDIN)　18.2結合劑及其用途</chinese-title>  
        <english-title>HUMAN CLAUDIN 18.2 BINDERS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默沙東有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯普納　愛德華　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPOONER, EDWARD T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗魯姆　卡琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VROOM, KARIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯　銀燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YINYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古鐵雷斯　內斯特　阿隆索</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUTIERREZ, NESTOR ALONSO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供人類密連蛋白18.2 (claudin 18.2；CLDN18.2)結合劑，以及相關多核苷酸、載體、宿主細胞、產生方法、組合物(例如醫藥組合物)、用途及例如用於治療癌症之使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Human claudin 18.2 (CLDN18.2) binders are provided, as well as related polynucleotides, vectors, host cells, methods of production, compositions (e.g., pharmaceutical compositions), uses, and methods of use, e.g., for treatment of cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1818" publication-number="202628964"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628964.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>原位清洗快速熱處理腔室</chinese-title>  
        <english-title>IN-SITU CLEAN RAPID THERMAL PROCESSING CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P95/90</main-classification>  
        <further-classification edition="202601120260327B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸海丰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, HAIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周慶剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, QING GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宸煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">處理腔室，包括腔室主體、反射鏡板、基底板和蓋子。腔室主體包含內部空間。反射鏡板位於腔室主體的內部空間內。基底板位於腔室主體的內部空間內，並位於反射鏡板之下。蓋子包覆反射鏡板和基底板，並將反射鏡板和基底板與腔室主體的其餘內部空間隔離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processing chamber, comprising a chamber body, a reflector plate, a base plate, and a cover. The chamber body comprises an interior volume. The reflector plate is disposed within the interior volume of the chamber body. The base plate is disposed within the interior volume of the chamber body and below the reflector plate. The cover encloses the reflector plate and the base plate and isolates the reflector plate and base plate from a remainder of the interior volume of the chamber body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:腔室</p>  
        <p type="p">11:腔室主體</p>  
        <p type="p">12:基板</p>  
        <p type="p">13:輻射加熱設備</p>  
        <p type="p">14:基板支撐</p>  
        <p type="p">15:反射鏡板</p>  
        <p type="p">16:溫度監測組件</p>  
        <p type="p">17:基底板</p>  
        <p type="p">18:進口</p>  
        <p type="p">19:排氣口</p>  
        <p type="p">20:進口內表面</p>  
        <p type="p">21:排氣口內表面</p>  
        <p type="p">22:開口</p>  
        <p type="p">23:開口內表面</p>  
        <p type="p">24:石英窗口</p>  
        <p type="p">25:環形支撐環</p>  
        <p type="p">26:邊緣唇</p>  
        <p type="p">27:可旋轉圓筒</p>  
        <p type="p">28:中心軸</p>  
        <p type="p">29:製程區域</p>  
        <p type="p">30:燈具</p>  
        <p type="p">31:對應的反射管</p>  
        <p type="p">32:反射腔</p>  
        <p type="p">33:溫度探頭</p>  
        <p type="p">34:光學端口</p>  
        <p type="p">35:控制器</p>  
        <p type="p">36:屏蔽罩組件</p>  
        <p type="p">37:腔室壁屏蔽罩</p>  
        <p type="p">38:反射鏡板屏蔽罩</p>  
        <p type="p">39:頂表面</p>  
        <p type="p">40:外表面</p>  
        <p type="p">41:泵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1819" publication-number="202626496"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626496.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>六方晶氮化硼粉末及六方晶氮化硼粉末的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C01B21/064</main-classification>  
        <further-classification edition="200601120260401B">C08K3/38</further-classification>  
        <further-classification edition="200601120260401B">C09K5/14</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台木祥太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柿木智行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKIGI, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實現一種用以獲得兼具優異的熱傳導率與絕緣耐力的樹脂組成物之六方晶氮化硼粉末等。本發明的六方晶氮化硼粉末的藉由根據JIS R 1655:2003的壓汞法所測定的，細孔直徑為0μm以上且1.0μm以下的範圍的第一累積氣孔體積與細孔直徑為大於1.0μm且5.0μm以下的範圍中的第二累積氣孔體積之比值(第一累積氣孔體積/第二累積氣孔體積)為0.50以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1820" publication-number="202626724"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626724.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>針對OX40之抗體及其組合物</chinese-title>  
        <english-title>ANTIBODIES TO OX40 AND COMPOSITIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商施維雅藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LES LABORATOIRES SERVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜蓋特　范妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUGUET, FANNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾　赫穆齊　賈米拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL HMOUZI, JAMILA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅蘭德　伊娃　瑪麗亞　卡爾森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELANDER, EVA MARIA CARLSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德加德　伊麗莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOENDERGAARD, ELISABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供結合至OX40之抗體，以及使用該等抗體調節有需要患者的免疫力及治療自體免疫性病症或免疫炎性病症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides antibodies that bind to OX40, and methods of using them to modulate immunity in a patient in need thereof and to treat autoimmune disorders or immunoinflammatory disorders.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1821" publication-number="202626620"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626620.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135373</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含ＮＲ２Ｂ　ＮＡＭ拮抗劑之固體形式</chinese-title>  
        <english-title>SOLID FORMS COMPRISING A NR2B NAM ANTAGONIST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/06</main-classification>  
        <further-classification edition="200601120260401B">C07C63/06</further-classification>  
        <further-classification edition="200601120260401B">C07C233/55</further-classification>  
        <further-classification edition="200601120260401B">C07C233/54</further-classification>  
        <further-classification edition="200601120260401B">C07C65/26</further-classification>  
        <further-classification edition="200601120260401B">C07C61/12</further-classification>  
        <further-classification edition="200601120260401B">C07D307/62</further-classification>  
        <further-classification edition="200601120260401B">C07D275/06</further-classification>  
        <further-classification edition="200601120260401B">C07J9/00</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260401B">A61P25/06</further-classification>  
        <further-classification edition="200601120260401B">A61P25/18</further-classification>  
        <further-classification edition="200601120260401B">A61P25/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐羅克里生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科斯達　克麗斯汀娜　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COSTA, CHRISTINA M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅文喬　維達茲可　卡塔里納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROVENCIO-VERDUZCO, CATALINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史登　斯考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STIRN, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供包含(4&lt;i&gt;S&lt;/i&gt;,5&lt;i&gt;S&lt;/i&gt;)-1-({6-[4-(二氟甲基)-2-氟苯氧基]吡啶-3-基}甲基)-4-羥基-5-甲基吡咯啶-2-酮(化合物(&lt;b&gt;I&lt;/b&gt;))之固體形式、包含其之組合物、及製備其及使用其(例如)預防或治療中樞神經系統疾病之方法。 &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="340px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Solid forms comprising (4&lt;i&gt;S&lt;/i&gt;,5&lt;i&gt;S&lt;/i&gt;)-1-({6-[4-(difluoromethyl)-2-fluorophenoxy]pyridin-3-yl}methyl)-4-hydroxy-5-methylpyrrolidine-2-one (Compound (&lt;b&gt;I&lt;/b&gt;)), compositions comprising the same, and methods of making and using the same, for example, in the prevention or treatment of a central nervous system disease. &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="343px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1822" publication-number="202626590"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626590.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括胺基醇之調配物及其於電氣與電子應用之用途</chinese-title>  
        <english-title>FORMULATIONS COMPRISING AMINO ALCOHOLS AND USE THEREOF IN ELECTRICAL AND ELECTRONIC APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C215/08</main-classification>  
        <further-classification edition="201001120260401B">H01M10/0525</further-classification>  
        <further-classification edition="201001120260401B">H01M4/131</further-classification>  
        <further-classification edition="201001120260401B">H01M4/1391</further-classification>  
        <further-classification edition="200601120260401B">H01M4/38</further-classification>  
        <further-classification edition="201001120260401B">H01M4/525</further-classification>  
        <further-classification edition="201001120260401B">H01M4/583</further-classification>  
        <further-classification edition="200601120260401B">H01M4/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安達偉勝公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCION CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒銀軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, YINJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈維爾卡　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAVELKA, KATHLEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奎恩　喬丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUINN, JORDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁勝穩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, SHENGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明技術大體上係關於包括式I化合物之組成物，&lt;br/&gt;&lt;img align="absmiddle" height="126px" width="184px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; 其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;各自獨立地為H或C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;未經取代之烷基；其限制條件為R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;中之至少一者不為H；且其限制條件為該化合物具有4個、5個、6個、7個、8個、9個或10個碳原子。詳言之，本發明技術係關於包括式I化合物之組成物，其用於製造電池組、半導體裝置及其他電子材料及電氣裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present technology relates generally to compositions comprising a compound of Formula I&lt;br/&gt;&lt;img align="absmiddle" height="129px" width="186px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; where R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, and R&lt;sup&gt;4&lt;/sup&gt; are each independently H or C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; unsubstituted alkyl; provided at least one of R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, and R&lt;sup&gt;4&lt;/sup&gt; is not H; and provided that the compound has 4, 5, 6, 7, 8, 9, or 10 carbon atoms. In particular, the present technology relates to compositions that comprise a compound of Formula I for the manufacture of batteries, semiconductor devices, and other electronic materials and electrical devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1823" publication-number="202626095"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626095.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含抗PLA2G2D抗體之組合療法及其用途</chinese-title>  
        <english-title>COMBINATION THERAPY COMPRISING ANTI-PLA2G2D ANTIBODIES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">C07K16/40</further-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商尖端免疫生醫公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APEXIMMUNE THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　麗芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, LI-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　冠瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅谷一久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMETANI, MICHIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　詩茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JULIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案提供治療個體之疾病或病況的方法，該方法包含投與抗PLA2G2D抗體及刺激吞噬作用之抑制劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides methods of treating diseases or conditions in an individual comprising administration of anti-PLA2G2D antibodies, and inhibitors that stimulate phagocytosis.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1824" publication-number="202627682"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627682.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135424</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜形成方法、可固化組成物及物品製造方法</chinese-title>  
        <english-title>FILM FORMING METHOD, CURABLE COMPOSITION, AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G03F7/027</main-classification>  
        <further-classification edition="200601120260325B">C08F2/50</further-classification>  
        <further-classification edition="200601120260325B">C08F220/18</further-classification>  
        <further-classification edition="200601120260325B">G03F7/004</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城野潤平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRONO, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松島雛子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, HINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種膜形成方法，包括：使用旋塗法將含有可聚合化合物及溶劑之可固化組成物配置在基板上，以及將配置在基板上之固化組成物平坦化形成膜，其中，將可固化組成物中去除溶劑後得到之組成物的黏度μ[mPa･s]小於由基板凹凸形狀的週期λ[μm]及該可固化組成物固化後之厚度d&lt;sub&gt;f &lt;/sub&gt;[nm]所決定之函數f的值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A film forming method including arranging a curable composition containing a polymerizable compound and a solvent on a substrate using a spin coating method, and planarizing the curable composition arranged on the substrate to form a film, wherein a viscosity μ [mPa･s] of a composition obtained by removing the solvent from the curable composition is smaller than a value of a function f determined by a period λ [μm] of a concave-convex shape of the substrate and a thickness d&lt;sub&gt;f&lt;/sub&gt; [nm] of the curable composition after curing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">103:底層膜/固化膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1825" publication-number="202627174"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627174.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於氣體活化和氣體分配的導流件配置以及相關腔室套件、方法及處理腔室</chinese-title>  
        <english-title>FLOW GUIDE ARRANGEMENTS FOR GAS ACTIVATION AND GAS DISTRIBUTION, AND RELATED CHAMBER KITS, METHODS, AND PROCESSING CHAMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C23C16/455</main-classification>  
        <further-classification edition="200601120260331B">C23C16/46</further-classification>  
        <further-classification edition="200601120260331B">C30B25/14</further-classification>  
        <further-classification edition="200601120260331B">C30B25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢　者澎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONG, ZHEPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿蘿拉　希瑪尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARORA, HIMANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳貞瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHEN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及用於氣體活化和氣體分配的導流件配置，以及相關的腔室套件、方法、及處理腔室。在一或多個實施例中，處理腔室包含：腔室主體，該腔室主體至少部分限定一個內部空間；一或多個熱源，該一或多個熱源可操作以用於加熱該內部空間；基板支撐，該基板支撐設置在該內部空間中；以及一或多個入口開口，該一或多個入口開口被配置用於將氣體引導穿過基板支撐上的氣流通道並流向一或多個排氣出口。該處理腔室包含設置在內部空間中的導流件。導流件包含第一導向塊、相對於氣流路徑與第一導向相對的第二導向塊，以及連接第一導向塊和第二導向塊的法蘭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to flow guide arrangements for gas activation and gas distribution, and related chamber kits, methods, and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume, one or more heat sources operable to heat the internal volume, a substrate support disposed in the internal volume, and one or more inlet openings configured to direct a gas across a gas flow path over the substrate support and to one or more exhaust outlets. The processing chamber includes a flow guide disposed in the internal volume. The flow guide includes a first guide block, a second guide block disposed opposite the first guide block with respect to the gas flow path, and a flange connecting the first guide block and the second guide block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:基板</p>  
        <p type="p">106:基板支撐</p>  
        <p type="p">230:導流件</p>  
        <p type="p">231:塊</p>  
        <p type="p">232:內表面</p>  
        <p type="p">233:上表面</p>  
        <p type="p">236:塊</p>  
        <p type="p">237:內表面</p>  
        <p type="p">238:上表面</p>  
        <p type="p">245:法蘭</p>  
        <p type="p">247:上表面</p>  
        <p type="p">250:排氣塊</p>  
        <p type="p">A:部分</p>  
        <p type="p">B:部分</p>  
        <p type="p">P1:製程氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1826" publication-number="202626650"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626650.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胰島素生長因子-1受體（IGF-1R）抑制劑及其使用方法</chinese-title>  
        <english-title>INSULIN GROWTH FACTOR-1 RECEPTOR (IGF-1R) INHIBITORS AND METHODS OF USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/04</main-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">C07D471/04</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61K31/53</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡提思治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHARTIS THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　羅伯特　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMAN, ROBERT L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法　波利諾　金裘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VA, PORINO JINJO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮曲曼　喬瑟夫　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINCHMAN, JOSEPH ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞森　約翰　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAWSON, JOHN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於調節或抑制IGF-1R之化合物、組合物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides for compounds, compositions, and methods for modulating or inhibiting IGF-1R.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1827" publication-number="202625896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物及抗菌方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A01N37/02</main-classification>  
        <further-classification edition="200601120260401B">A01N37/04</further-classification>  
        <further-classification edition="200601120260401B">A01N43/80</further-classification>  
        <further-classification edition="200601120260401B">A01P1/00</further-classification>  
        <further-classification edition="200601120260401B">A01P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧村和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井孝德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田裕輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係含有通式(1)表示的化合物(I)及抗菌劑(II)的組成物及抗菌方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1828" publication-number="202627346"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627346.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體管之修補方法及流體管之修補構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">F16L55/175</main-classification>  
        <further-classification edition="200601120260331B">F16L55/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橫濱市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOHAMA CITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大成機工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAISEI KIKO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加賀美慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAGAMI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田浩昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星野谷慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINOYA, MEGUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関澤但紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIZAWA, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡賢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之流體管之修補方法，其包含以下步驟：將排水體2經由包圍水管K之漏出孔K1之密封材1壓抵於水管K，成為自漏出孔K1漏出之水自排水體2之排出路徑20排出之狀態，藉由配置於密封材1之外周側之遮罩材7，於密封材1之外周側形成用於填充黏著劑6之空間SP1；通過連接空間SP1之內部與外部之至少1個填充路徑24而將黏著劑6填充於空間SP1；以及使填充於空間SP1內之黏著劑6硬化而將排水體2固定於水管K。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:密封材</p>  
        <p type="p">2:排水體</p>  
        <p type="p">3:外部管</p>  
        <p type="p">4:固定具</p>  
        <p type="p">5:排水塞(閉止構件)</p>  
        <p type="p">6:黏著劑</p>  
        <p type="p">7:遮罩材</p>  
        <p type="p">20:排出路徑</p>  
        <p type="p">24:填充路徑</p>  
        <p type="p">40:磁性部</p>  
        <p type="p">41:按壓具</p>  
        <p type="p">C1:軸</p>  
        <p type="p">K:水管(流體管)</p>  
        <p type="p">K1:漏出孔</p>  
        <p type="p">SP1:空間</p>  
        <p type="p">V1:螺栓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1829" publication-number="202627686"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627686.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硫基阻劑硬化</chinese-title>  
        <english-title>SULFUR BASED RESIST HARDENING‎</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">G03F7/11</main-classification>  
        <further-classification edition="200601120260320B">G03F7/004</further-classification>  
        <further-classification edition="200601120260320B">G03F7/039</further-classification>  
        <further-classification edition="200601120260320B">G03F7/20</further-classification>  
        <further-classification edition="200601120260320B">H05H1/24</further-classification>  
        <further-classification edition="202601120260320B">H10P50/20</further-classification>  
        <further-classification edition="202601120260320B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃特基　魯迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOJTECKI, RUDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄志宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文件中所述的實施例涉及一種將阻劑層中的圖案轉移至阻劑層下的圖案化堆疊的方法。在一個實施例中，該方法包括在阻劑層中形成圖案後，對阻劑層進行處理，該處理將硫併入到阻劑層的表面，並將阻劑層中的圖案轉移至圖案化堆疊中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to a method for transferring a pattern in a resist layer into a patterning stack under the resist layer. In an embodiment, the method includes treating the resist layer with a treatment that incorporates sulfur into a surface of the resist layer after the pattern is formed in the resist layer, and transferring the pattern in the resist layer into the patterning stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">670:製程</p>  
        <p type="p">671:操作</p>  
        <p type="p">672:操作</p>  
        <p type="p">673:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1830" publication-number="202626651"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626651.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氘化雙環雜芳基衍生物</chinese-title>  
        <english-title>DEUTERATED BICYCLIC HETEROARYL DERIVATIVES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/501</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P27/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅吉莉　莎明多　羅莎　瑪莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGUEZ SARMIENTO, ROSA MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維夫安　華特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIFIAN, WALTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具有通式 (I) 的新穎氘化雙環雜芳基化合物 &lt;br/&gt;&lt;img align="absmiddle" height="183px" width="468px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;其中 R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt; 及 R&lt;sup&gt;5&lt;/sup&gt; 係如本文所述；包括該等化合物之組成物；以及使用該等化合物之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides new deuterated bicyclic heteroaryl compounds having the general formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="456px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt; and R&lt;sup&gt;5&lt;/sup&gt; are as described herein, compositions including the compounds, and methods of using the compounds.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1831" publication-number="202627244"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627244.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單晶矽棒、單晶生長設備及單晶生長方法</chinese-title>  
        <english-title>MONOCRYSTAL SILICON INGOT, DEVICE AND METHOD OF MONOCRYSTAL GROWTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C30B15/10</main-classification>  
        <further-classification edition="200601120251001B">C30B35/00</further-classification>  
        <further-classification edition="200601120251001B">C30B29/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海新昇半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZING SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬靜如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種單晶矽棒產品、單晶生長設備及單晶生長方法，單晶生長設備包括爐體、坩堝、加熱器、絕緣支架、支撐桿、短路連接塊和驅動裝置，加熱器被短路連接塊分成發熱區和短路區，在長晶過程中，隨著坩堝的向上移動，使用驅動裝置驅動支撐桿，以使得短路連接塊緩慢上升，進而控制加熱器的發熱區的長度，從而增強對生長界面溫度梯度分佈的調控能力，提升生長界面V/G的均勻性，促進高品質的單晶矽棒產品的生長，此外，通過對加熱器發熱區長度的調節實現對加熱器的發熱面積的調整，拓展了加熱器的應用製程窗口，使得同一加熱器能夠滿足生產多種不同含氧量的單晶矽棒產品，且通過該單晶生長方法實現了含氧量為3 nppma~20 nppma的低氧含量的單晶矽棒產品的生產。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a monocrystal silicon ingot, and a device and a method of monocrystal growth. The device of monocrystal growth comprises a furnace body, a crucible, a heater, an insulating bracket, a supporting rod, a short-circuit connection block and a driving unit, wherein the heater is divided to a heating zone and a short-circuit zone by the short-circuit connection block. During the crystal growth, as the crucible moves upward, the driving unit drives the supporting rod to slowly raise the short-circuit connection block, thereby controlling the length of the heating zone of the heater. As such, the control of the temperature gradient distribution at the growth interface can be enhanced, the uniformity of V/G at the growth interface can be improved, and the growth of high-quality monocrystal silicon ingot can be achieved. Moreover, the heating area of the heater can be adjusted by adjusting the length of the heating zone, causing the extension of application process window. This allows the same heater to produce various monocrystal silicon ingots with different oxygen contents. In addition, the method enables the production of monocrystal silicon ingots with a low oxygen content of 3~20 nppma.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:爐體</p>  
        <p type="p">11:籽晶繩</p>  
        <p type="p">12:籽晶夾頭</p>  
        <p type="p">13:籽晶</p>  
        <p type="p">14:保溫腔</p>  
        <p type="p">15:坩堝</p>  
        <p type="p">151:內層坩堝</p>  
        <p type="p">152:外層坩堝</p>  
        <p type="p">16:加熱器</p>  
        <p type="p">18:短路連接塊</p>  
        <p type="p">19:支撐桿</p>  
        <p type="p">20:驅動裝置</p>  
        <p type="p">21:保溫蓋板</p>  
        <p type="p">22:導流筒</p>  
        <p type="p">23:熔融矽</p>  
        <p type="p">24:單晶矽棒</p>  
        <p type="p">25:支撐軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1832" publication-number="202628480"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628480.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高頻介電加熱裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H05B6/64</main-classification>  
        <further-classification edition="200601120251001B">H05B6/54</further-classification>  
        <further-classification edition="200601120251001B">H05B6/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部永寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, NAGAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種高頻介電加熱裝置，可抑制無助於被加熱物之加熱之電場的產生。高頻介電加熱裝置係構成為具備有：電極11、12，係被施加高頻電壓；及電波吸收體13，係以包含有電極11、12之方式配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:電極</p>  
        <p type="p">12:電極</p>  
        <p type="p">13:電波吸收體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1833" publication-number="202626683"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626683.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F7/10</main-classification>  
        <further-classification edition="200601120260401B">C07F7/18</further-classification>  
        <further-classification edition="200601120260401B">C09D183/04</further-classification>  
        <further-classification edition="200601120260401B">C09D183/08</further-classification>  
        <further-classification edition="200601120260401B">C09D5/00</further-classification>  
        <further-classification edition="200601120260401B">B05D1/00</further-classification>  
        <further-classification edition="200601120260401B">B05D5/08</further-classification>  
        <further-classification edition="200601120260401B">B05D7/24</further-classification>  
        <further-classification edition="200601120260401B">C09K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内田貴司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIDA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種具有顯示優異的撥水性和摩耗耐久性的表面層的含長鏈烷基之化合物的薄膜，特別是可藉由真空蒸鍍於物品的表面形成的薄膜。 &lt;br/&gt;其解決手段為一種薄膜，係以含長鏈烷基之化合物的硬化物形成而成的薄膜，所述含長鏈烷基之化合物的分子中一側的末端具有至少一個烷基，該烷基的總碳數為19以上，且另一側的末端具有基材密著性基，膜厚為2nm~5nm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1834" publication-number="202627557"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627557.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導光構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G02B6/12</main-classification>  
        <further-classification edition="200601120260325B">G02B5/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原淳弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAHARA, ATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細山田将士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOYAMADA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊﨑章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZAKI, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之導光構件具備：第1層10，其對光L2進行導光；及第2層11，其具有第1區域14A及第2區域14B，且沿積層方向積層於上述第1層10，上述第1區域14A配置有具有第1干擾條紋間隔之第1全像片，上述第2區域14B配置有具有與上述第1干擾條紋間隔不同之第2干擾條紋間隔之第2全像片，且自上述積層方向觀察時不與上述第1區域14A重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第1層</p>  
        <p type="p">11:第2層</p>  
        <p type="p">14A:第1區域</p>  
        <p type="p">14B:第2區域</p>  
        <p type="p">14C:第3區域</p>  
        <p type="p">20B:全像片區域</p>  
        <p type="p">L2,L2',L3,L3',LA2,LA3,LB2,LB3,LC2,LC3:光</p>  
        <p type="p">X,Y,Z:方向</p>  
        <p type="p">θA2,θB2,θC2:角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1835" publication-number="202625883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135490</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種可生成伴隨軸部長度之高產量的小花蕾之花椰菜植物及其加工品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260401B">A01H6/20</main-classification>  
        <further-classification edition="200601120260401B">A01H1/02</further-classification>  
        <further-classification edition="201801120260401B">A01H5/02</further-classification>  
        <further-classification edition="200601120260401B">C12N15/29</further-classification>  
        <further-classification edition="201801120260401B">C12Q1/6895</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商莎卡達種子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA SEED CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船曵知明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNABIKI, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種使適合在分成小花蕾之花椰菜加工品的伴隨軸部長度之高產量的小花蕾的生成變可能之花椰菜植物與其加工品。 &lt;br/&gt;　　本發明的解決手段為於核基因組內具有使伴隨軸部長度之高產量的小花蕾的生成變可能之有關小花蕾生成的基因之花椰菜植物，使得小花蕾加工處理變容易，分成商品價值高之小花蕾的花椰菜商品的提供變可能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1836" publication-number="202626607"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626607.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135534</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Ｎ－苯基－１，２－二氫喹啉－６－胺、Ｎ－苯基－１，２，３，４－四氫喹啉－６－胺，及其用於製備橡膠的方法</chinese-title>  
        <english-title>N-PHENYL-1,2-DIHYDROQUINOLIN-6-AMINES, NPHENYL-1,2,3,4-TETRAHYDROQUINOLIN-6-AMINES, AND PROCESSES FOR PREPARING THE SAME FOR USE IN RUBBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D215/38</main-classification>  
        <further-classification edition="200601120260401B">C08K5/34</further-classification>  
        <further-classification edition="200601120260401B">C08L7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商弗列克斯美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLEXSYS AMERICA L.P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢帕利特　朱帝寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAPELET, JUDICAEL JACQUES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢比　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMBY, TAYLOR BLUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩尼　喬納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENNEY, JONATHAN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔普萊二世　拉爾夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPLETT, II,RALPH D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉維　拉卡庫拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAVI, LAKKAKULA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬　南古諾里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, NANGUNOORI SAMPATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米歇力奇　塞繆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICHELICH, SAMUEL JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供N-苯基-1,2-二氫喹啉-6-胺、N-苯基-1,2,3, &lt;br/&gt;4-四氫喹啉-6-胺、製備N-苯基-1,2-二氫喹啉-6-胺的方法和製程，以及製備N-苯基-1,2,3,4-四氫喹啉-6-胺(其具有抗降解劑例如抗臭氧化劑、抗氧化劑及/或抗疲勞特性)的方法和製程。這些化合物為可用於硫化橡膠物件的添加物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides N-phenyl-1,2-dihydroquinolin-6-amines, N-phenyl-1,2,3,4-tetrahydroquinolin-6-amines, methods and processes for preparing N-phenyl-1,2-dihydroquinolin-6-amines, and methods and processes for preparing N-phenyl-1,2,3,4-tetrahydroquinolin-6-amines having antidegradant, e.g., antiozonant, antioxidant and/or antifatigue, properties. These compounds are useful additives for vulcanized rubber articles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1837" publication-number="202627091"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627091.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於抑制突觸核蛋白α（SNCA）表現之RNAi藥劑、其組合物及使用方法</chinese-title>  
        <english-title>RNAI AGENTS FOR INHIBITING EXPRESSION OF SYNUCLEIN ALPHA (SNCA), COMPOSITIONS THEREOF, AND METHODS OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="201701120260401B">A61K47/54</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛羅海德製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARROWHEAD PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬堤奈茲　雷登　帕洛瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ-REDONDO, PALOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾森　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARLSON, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊索　克莉絲丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESAU, CHRISTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴　濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEI, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛利波卡　安格尼斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLEBOCKA, AGNIESZKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述RNAi藥劑、包括RNAi藥劑之組合物及用於抑制突觸核蛋白α (SNCA)基因之方法。本文中所揭示之SNCA RNAi藥劑及RNAi藥劑結合物抑制SNCA基因之表現。該等SNCA RNAi藥劑結合至抗原結合蛋白，該抗原結合蛋白可藉由促進穿過血腦障壁(BBB)而實現該等RNAi藥劑之皮下遞送。本發明亦描述包括一或多種SNCA RNAi藥劑之醫藥組合物，其視情況具有一或多種額外治療劑。將所描述之SNCA RNAi藥劑活體內遞送至中樞神經系統(CNS)組織可實現SNCA基因表現之抑制及SNCA活性之降低，此可向包括人類個體在內之個體提供治療包括帕金森氏症(Parkinson's Disease)之各種疾病的治療益處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described are RNAi agents, compositions that include RNAi agents, and methods for inhibition of a synuclein alpha (SNCA) gene. The SNCA RNAi agents and RNAi agent conjugates disclosed herein inhibit the expression of an SNCA gene. The SNCA RNAi agents are conjugated to an antigen binding protein that may enable subcutaneous delivery of the RNAi agents by facilitating crossing of the blood brain barrier (BBB). Pharmaceutical compositions that include one or more SNCA RNAi agents, optionally with one or more additional therapeutics, are also described. Delivery of the described SNCA RNAi agents to central nervous system (CNS) tissue, &lt;i&gt;in vivo&lt;/i&gt;, provides for inhibition of SNCA gene expression and a reduction in SNCA activity, which can provide a therapeutic benefit to subjects, including human subjects, for the treatment of various diseases including Parkinson's Disease.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1838" publication-number="202628409"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628409.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135548</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行動電子裝置機架</chinese-title>  
        <english-title>MOBILE ELECTRONIC DEVICE MOUNTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">H04M1/04</main-classification>  
        <further-classification edition="200601120260326B">H04M1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商安納斯產品有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANNEX PRODUCTS PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得斯　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETERS, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫克　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUEK, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊恩　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYAN, LEIGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫塔傑爾　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUTAJAR, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉可米　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAKOMY, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特　特蘭特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARTER, TRENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沛爾　伊凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELL, EVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯恩斯　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURNS, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波特　麥特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTTER, MATT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲恩　洛德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENN, LLOYD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一行動電子裝置之配件，其包括一後壁及可安置於該後壁中之一鎖定機構。該鎖定機構可包含可相對於該後壁移動以將殼體鎖定至一機架(mount)之至少一個鎖定元件。在一些形式中，該配件呈用於一行動電子裝置之一殼體之形式。一旋轉元件可提供於該鎖定機構中以定位該至少一個鎖定元件以引起該鎖定機構採用一鎖定或解鎖狀態。亦提供了一種經構形以接收該殼體鎖定機構之至少部分之機架、一種包括該殼體及該機架之用於一行動電子裝置之安裝系統及一種將容納於一殼體內之一行動電子裝置安裝至一機架之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is an accessory for a mobile electronic device comprising a rear wall and a locking mechanism that may be disposed in the rear wall. The locking mechanism can include at least one locking element movable relative to the rear wall for locking the case to a mount. In some forms, the accessory is in the form of a case for a mobile electronic device. A rotary element may be provided in the locking mechanism to position the at least one locking element for causing the locking mechanism for adopting a locked or unlocked condition. Also provided is a mount configured to receive at least part of the case locking mechanism; a mounting system for a mobile electronic device comprising the case and the mount; and a method of mounting a mobile electronic device contained within a case to a mount.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">12:行動裝置</p>  
        <p type="p">14:後壁</p>  
        <p type="p">16:周邊壁</p>  
        <p type="p">16a:周邊壁</p>  
        <p type="p">16b:周邊壁</p>  
        <p type="p">18:內部空間</p>  
        <p type="p">22:後表面</p>  
        <p type="p">24:耦合器</p>  
        <p type="p">25:磁性元件/磁體</p>  
        <p type="p">26:凹槽</p>  
        <p type="p">28:內表面</p>  
        <p type="p">30:耦合表面</p>  
        <p type="p">30a:凹口</p>  
        <p type="p">32:機架</p>  
        <p type="p">32a:保持器部分</p>  
        <p type="p">33:安裝壁</p>  
        <p type="p">34:鎖定機構</p>  
        <p type="p">35:安裝邊緣</p>  
        <p type="p">36:致動器</p>  
        <p type="p">37:支腳</p>  
        <p type="p">38:鎖定元件</p>  
        <p type="p">46:周邊開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1839" publication-number="202628107"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628107.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在非揮發性記憶體中利用列對列閾值追蹤實現高效能讀取的系統與方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR HIGH PERFORMANCE READ WITH ROW-TO-ROW THRESHOLD TRACKING IN NVM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G11C16/26</main-classification>  
        <further-classification edition="202301120260325B">G06N3/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史戴納　阿維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEINER, AVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎特　奧菲爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANTER, OFIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞拉　阿薩夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SELLA, ASSAF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞代　埃維塔爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YADAI, EVIATAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼贊　埃亞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITZAN, EYAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷格曼　尼姆羅德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREGMAN, NIMROD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威恩蓋頓　哈南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEINGARTEN, HANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於快閃記憶體系統可以包括非揮發性記憶體和電路。該非揮發性記憶體可以包括一或多個區塊，各區塊包括多列的單元。用於對該非揮發性記憶體執行操作的電路可以取得一列識別符，其識別多列中的一目標頁之列。該電路可以透過機器學習模型，基於該列識別符，產生用於讀取操作的一或多個電壓閾值。該電路可以使用該一或多個電壓閾值，對該非揮發性記憶體的該目標頁執行該讀取操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a flash memory system may include a non-volatile memory and a circuit. The non-volatile memory may include one or more blocks, each block including a plurality of rows of cells. The circuit for performing operations on the non-volatile memory, may obtain a row identifier identifying a row of a target page, among the plurality of rows. The circuit may generate, by a machine learning model, one or more voltage thresholds for a read operation, based on the row identifier. The circuit may perform the read operation on the target page of the non-volatile memory with the one or more voltage thresholds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:過程</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1840" publication-number="202626656"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626656.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>TNFα活性抑制劑</chinese-title>  
        <english-title>INHIBITORS OF TNF ALPHA ACTIVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/18</main-classification>  
        <further-classification edition="201701120260401B">A61K47/55</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商弗沃德醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORWARD THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡諾尼　托費可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANOUNI, TOUFIKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>深瀬嘉之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKASE, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供TNF-α之抑制劑、包括該等抑制性化合物之醫藥組合物及使用該等TNF-α抑制性化合物治療疾病或病症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are inhibitors of TNF-α, pharmaceutical compositions comprising the inhibitory compounds, and methods for using the TNF-α inhibitory compounds for the treatment of diseases or disorders.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1841" publication-number="202627326"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627326.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減震器</chinese-title>  
        <english-title>VIBRATION DAMPENER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">F16F1/36</main-classification>  
        <further-classification edition="200601120260318B">F16F6/00</further-classification>  
        <further-classification edition="200601120260318B">F16F13/04</further-classification>  
        <further-classification edition="200601120260318B">F16F13/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商安納斯產品有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANNEX PRODUCTS PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔利　伊略特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STALEY, ELLIOT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊恩　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYAN, LEIGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍德　凱榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOOD, KIERON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於抑制自一車輛發出之震動之減震器，該減震器包括：一下底盤，其可直接或間接連接至該車輛之一部分；一上底盤，其與該下底盤間隔開；一震動阻尼器，其定位於該下底盤與該上底盤之間，該震動阻尼器適於抑制自該車輛發出且進入該下底盤之高頻震動；及一阻尼器致動器，其用於選擇性地將該震動阻尼器置於一非作用中組態及一作用中組態，在該非作用中組態中，該上底盤與該下底盤剛性地連接且該震動阻尼器處於非作用中，在該作用中組態中，該上底盤及該下底盤可相對於彼此獨立地移動且該震動阻尼器處於作用中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a vibration dampener for dampening vibrations emanating from a vehicle, the vibration dampener comprising: a lower chassis that is directly or indirectly connectable to a part of the vehicle; an upper chassis spaced apart from the lower chassis; a vibration-damper located between the lower chassis and the upper chassis, the vibration-damper suitable for dampening high-frequency vibrations that emanate from the vehicle and enter the lower chassis; and a damper actuator for selectively placing the vibration-damper into an inactive configuration in which the upper chassis and lower chassis are rigidly connected and the vibration-damper is inactive, and an active configuration in which the upper chassis and lower chassis are independently movable relative to each other and the vibration damper is active.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:減震器</p>  
        <p type="p">13:中心軸</p>  
        <p type="p">15:面向上嚙合結構</p>  
        <p type="p">17:突出部</p>  
        <p type="p">19:中心輪轂板</p>  
        <p type="p">30:環形震動阻尼索環</p>  
        <p type="p">38:上底盤</p>  
        <p type="p">40:第一圓形凸緣</p>  
        <p type="p">42:第二圓形凸緣</p>  
        <p type="p">44:圓周間隔之接合部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1842" publication-number="202628943"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628943.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置以及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P74/20</main-classification>  
        <further-classification edition="200601120260401B">G01N27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平田哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榊原匠海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAKIBARA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係實現一種能夠高精密度地偵測構件的劣化之基板處理裝置。基板處理裝置(100)係具備：基板保持部(20)，係在會被處理液(L)浸漬的部分中於基底構件(21)的表面層疊有導電材料層(22)以及保護層(23)；以及控制部(40)，係基於在導電材料層(22)與處理液(L)之間所生成的電位差之情形中的電流值以及電阻值中的至少任一者，偵測基板保持部(20)之異常的發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:處理槽</p>  
        <p type="p">13:處理液供給源</p>  
        <p type="p">15:噴出管</p>  
        <p type="p">17:溢流槽</p>  
        <p type="p">19:排放液回收部</p>  
        <p type="p">20:基板保持部</p>  
        <p type="p">26:載置部</p>  
        <p type="p">27:背板</p>  
        <p type="p">28:驅動機構</p>  
        <p type="p">30:計測部</p>  
        <p type="p">40:控制部</p>  
        <p type="p">41:CPU</p>  
        <p type="p">42:記憶體</p>  
        <p type="p">100:基板處理裝置</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1843" publication-number="202628951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過施加拉伸應力之線邊緣粗糙度減低</chinese-title>  
        <english-title>LINE EDGE ROUGHNESS REDUCTION THROUGH APPLICATION OF TENSILE STRESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10P76/20</main-classification>  
        <further-classification edition="200601120260330B">G03F7/004</further-classification>  
        <further-classification edition="200601120260330B">G03F7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡納卡沙巴帕斯　西法納迪哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAKASABAPATHY, SIVANANDHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄志宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃特基　魯迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOJTECKI, RUDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>娜娜雅卡拉　查瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANAYAKKARA, CHARITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪塔拉　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUTALA, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施例涉及一種方法，包含獲得基板，其中圖案化的阻劑層定位於圖案化堆疊上方，其中該圖案化的阻劑層包括第一低頻粗糙度。在實施例中，該方法進一步包含在該圖案化的阻劑層上形成覆蓋層。在實施例中，該圖案化的阻劑層的底部是暴露的，且在形成覆蓋層後，該圖案化的阻劑層具有第二低頻線邊緣粗糙度，該第二低頻線邊緣粗糙度低於第一低頻線邊緣粗糙度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to a method, that obtaining a substrate with a patterned resist layer positioned over a patterning stack, wherein the patterned resist layer comprises a first low frequency roughness. In an embodiment, the method further includes forming a capping layer on the patterned resist layer. In an embodiment, a bottom of the patterned resist layer is exposed, and the patterned resist layer has a second low frequency line edge roughness that is lower than the first low frequency line edge roughness after the capping layer is formed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">450:製程</p>  
        <p type="p">451:操作</p>  
        <p type="p">452:操作</p>  
        <p type="p">453:操作</p>  
        <p type="p">454:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1844" publication-number="202627540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135615</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造光學組件的方法、光學組件及半導體技術設備</chinese-title>  
        <english-title>METHOD FOR PRODUCING AN OPTICAL COMPONENT, OPTICAL COMPONENT AND SEMICONDUCTOR TECHNOLOGY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G02B5/08</main-classification>  
        <further-classification edition="200601120260325B">C03C27/06</further-classification>  
        <further-classification edition="200601120260325B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法斯　賽巴斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAAS, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒特　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHUETTER, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧伯特　菲利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBERT, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種製造光學組件的方法，較佳地為反射鏡，尤其是EUV反射鏡（Mi），其包含：提供至少兩個部分體（25、26），較佳地由玻璃材料製成，以及較佳地藉由高溫接合連接該至少兩個部分體（25、26）以形成該光學組件，同時提供至少一個接合面（29）。在該方法中，該光學組件在該高溫接合期間成形，特別是彎曲。本發明亦關於一種藉由該方法製造的光學組件，較佳地為反射鏡（Mi），以及關於一種包含至少一個此類光學組件的半導體技術設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for producing an optical component, preferably a mirror, in particular an EUV mirror （Mi）, comprising： &lt;br/&gt;providing at least two partial bodies （25, 26）, preferably made of a glass material, and connecting the at least two partial bodies （25, 26） to form the optical component while providing at least one joining face （29）, preferably by high-temperature bonding. In the method, the optical component is formed, in particular curved, during the high-temperature bonding. The invention also relates to an optical component, preferably a mirror （Mi）, produced by the method and to a semiconductor technology apparatus comprising at least one such optical component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">25:第一部分體</p>  
        <p type="p">25a:連接面(頂側)</p>  
        <p type="p">25b:外表面(底側)</p>  
        <p type="p">26:第二部分體</p>  
        <p type="p">26a:外表面(頂側)</p>  
        <p type="p">26b:連接面(底側)</p>  
        <p type="p">27:通道</p>  
        <p type="p">28:支撐件</p>  
        <p type="p">29:接合面</p>  
        <p type="p">30:形成表面</p>  
        <p type="p">31:光學有效表面</p>  
        <p type="p">32:條紋</p>  
        <p type="p">d:恆定間距</p>  
        <p type="p">H:最大高度</p>  
        <p type="p">Mi:EUV反射鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1845" publication-number="202628965"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628965.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板之高溫退火</chinese-title>  
        <english-title>HIGH TEMPERATURE ANNEALING OF SEMICONDUCTOR SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H10P95/90</main-classification>  
        <further-classification edition="202601120260326B">H10P72/76</further-classification>  
        <further-classification edition="200601120260326B">H05B6/10</further-classification>  
        <further-classification edition="200601120260326B">H05B6/36</further-classification>  
        <further-classification edition="200601120260326B">H05B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商易爾德工程系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊恩　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANE, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉克索寧　塔帕尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAAKSONEN, TAPANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史東　艾倫　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE, ALAN LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫德里阿夫采夫　弗拉基米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDRIAVTSEV, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一半導體基板之退火系統，其包含具有一中心軸線及一或多個處理區帶之一處理腔室。定位於該處理腔室中之一載體可經組態以在處理期間支撐該基板。一或多個感應加熱器可定位於該處理腔室中以在處理期間加熱該基板。該系統亦可包含具有一熱屏蔽之一可移除帽。該帽可經組態以透過處理腔室壁上之一開口插入該處理腔室及自該處理腔室移除。當使用該帽時，其可耦合至該處理腔室，使得其熱屏蔽安置於定位於該載體上之該基板上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An annealing system for a semiconductor substrate includes a process chamber having a central axis and one or more process zones. A carrier positioned in the process chamber may be configured to support the substrate during processing. One or more induction heaters may be positioned in the process chamber to heat the substrate during processing. The system may also include a removable cap with a heat shield. The cap may be configured to be inserted and removed from the process chamber through an opening on the process chamber wall. When the cap is used it may be coupled to the process chamber such that its heat shield is disposed above the substrate positioned on the carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:處理腔室</p>  
        <p type="p">12:腔室壁</p>  
        <p type="p">12A:金屬層</p>  
        <p type="p">12B:絕緣層</p>  
        <p type="p">14:腔室容積</p>  
        <p type="p">16:裝載/卸載埠</p>  
        <p type="p">16A:開口</p>  
        <p type="p">16B:門</p>  
        <p type="p">20:旋轉載體</p>  
        <p type="p">30:基板</p>  
        <p type="p">40A:處理區帶或裝載/攜載區帶</p>  
        <p type="p">40B:處理區帶/第一處理區帶</p>  
        <p type="p">40C:處理區帶/第二處理區帶</p>  
        <p type="p">40D:處理區帶/第三區帶</p>  
        <p type="p">100:設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1846" publication-number="202626762"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626762.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化性樹脂組合物、乾膜、固化物及電子部件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/032</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商太陽油墨（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO INK (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董思原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, SIYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, TARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三由忠大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOSHI, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤賢治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供具有高感光度、良好的指觸乾燥性且能得到柔韌性、耐焊接熱性能、截面形狀均優異的固化物的固化性樹脂組合物、乾膜、固化物、及電子部件。所述固化性樹脂組合物包含：(A)具有雙酚F骨架的含羧基樹脂、(B)光聚合引發劑、(C)感光性單體、(D)環氧樹脂、以及(E)無機填料，所述(B)光聚合引發劑包含(B1)胺基苯乙酮系光聚合引發劑和(B2)二苯甲酮系光聚合引發劑，所述(C)感光性單體包含(C1)具有聚丙二醇骨架的二(甲基)丙烯酸酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1847" publication-number="202628295"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628295.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自走式架空電線用走行機</chinese-title>  
        <english-title>SELF-PROPELLED TRAVELING MACHINE FOR OVERHEAD POWER LINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H02G1/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商永木精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAKI SEIKI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰　黎怀德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAI, LE HOAI DUC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野川保次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGAWA, YASUTSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種更有益之技術。根據本發明之一態樣，提供一種用於對架空電線進行維護或檢修之自走式架空電線用走行機，其具備本體部，本體部具有馬達、旋轉體及切斷部，馬達構成為用以對旋轉體賦予旋轉動力，旋轉體構成為用以與架空電線接觸而旋轉，藉此，架空電線用走行機構成為用以在架空電線上走行，切斷部構成為用以在架空電線用走行機於架空電線上走行之過程中，切斷安裝於架空電線上之對象物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:架空電線用走行機</p>  
        <p type="p">2:本體部</p>  
        <p type="p">3:驅動走行部</p>  
        <p type="p">6:防落蓋</p>  
        <p type="p">7:切斷部</p>  
        <p type="p">22:牽引部</p>  
        <p type="p">33:旋轉體</p>  
        <p type="p">61:第一防落蓋</p>  
        <p type="p">62:第二防落蓋</p>  
        <p type="p">Ln:架空電線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1848" publication-number="202626190"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626190.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續流微流體系統及自我組織化物質粒子的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">B01J19/00</main-classification>  
        <further-classification edition="202201120260320B">B01F33/30</further-classification>  
        <further-classification edition="200601120260320B">B01J13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人北海道大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤雅郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎裕之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGOE, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栄城正寿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEKI, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡慶次学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKESHI, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用以解決課題之手段為，一種連續流微流體系統，係用於微流體晶片連續流運轉的系統，其特徵在於該系統所形成的連續流的脈動率係5%以下。 &lt;br/&gt;　　若依據本發明的連續流微流體系統可發揮以下的效果，亦即，即使在以高壓力將作為流體的試料送入微流體晶片的情況下，亦能夠良好且穩定地製造尺寸均等性高的脂質奈米粒子等自我組織化物質粒子，並可實現該自我組織化物質粒子的大量製造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:微流體裝置</p>  
        <p type="p">3:微流體晶片</p>  
        <p type="p">4:排出流路</p>  
        <p type="p">11:第1連續流泵</p>  
        <p type="p">12:第2連續流泵</p>  
        <p type="p">51:樣品容器</p>  
        <p type="p">52:廢棄物容器</p>  
        <p type="p">112:第1儲液槽</p>  
        <p type="p">122:第2儲液槽</p>  
        <p type="p">521:廢棄物閥</p>  
        <p type="p">523:廢棄物回收流路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1849" publication-number="202626781"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626781.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性樹脂、含鹵乙基樹脂、硬化性樹脂之製造方法、硬化性組成物、硬化物、預浸體、電路基板、增層膜、半導體密封材及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08F12/00</main-classification>  
        <further-classification edition="200601120260302B">C08F299/02</further-classification>  
        <further-classification edition="200601120260302B">C08G61/10</further-classification>  
        <further-classification edition="200601120260302B">C08L25/00</further-classification>  
        <further-classification edition="200601120260302B">C08L65/00</further-classification>  
        <further-classification edition="200601120260302B">C08J5/24</further-classification>  
        <further-classification edition="200601120260302B">H05K1/03</further-classification>  
        <further-classification edition="200601120260302B">H05K3/46</further-classification>  
        <further-classification edition="202601120260302B">H10W70/695</further-classification>  
        <further-classification edition="202601120260302B">H10W74/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮璨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迫雅樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZAMA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸藤達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROFUJI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種硬化性樹脂，其能夠形成具有良好耐熱性之硬化物。 &lt;br/&gt;本發明之硬化性樹脂係將式（2A）所表示之鹵乙基苯與式（3A）所表示之乙烯基苄基鹵化物之反應產物進行脫鹵化氫反應而得者。 &lt;br/&gt;&lt;img align="absmiddle" height="223px" width="350px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1850" publication-number="202626103"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626103.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於遞送治療劑的可電離甾醇衍生物及其用途</chinese-title>  
        <english-title>IONIZABLE STEROL DERIVATIVES FOR DELIVERY OF THERAPEUTIC AGENTS AND THEIR USES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K47/28</main-classification>  
        <further-classification edition="200601120260401B">C07J41/00</further-classification>  
        <further-classification edition="200601120260401B">A61K47/24</further-classification>  
        <further-classification edition="200601120260401B">A61K47/14</further-classification>  
        <further-classification edition="200601120260401B">A61K9/51</further-classification>  
        <further-classification edition="202501120260401B">A61K9/127</further-classification>  
        <further-classification edition="200601120260401B">A61K31/7088</further-classification>  
        <further-classification edition="200601120260401B">A61K48/00</further-classification>  
        <further-classification edition="200601120260401B">A61P31/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京茵諾醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING INNO MEDICINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫潔芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, JIEFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及式A的可電離甾醇化合物、包含其的脂質奈米顆粒組成物及其醫藥用途。</p>  
        <p type="p">Z-L-(M)r A</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an ionizable sterol compound of Formula A, a lipid nanoparticle composition comprising the same, and its medical use.</p>  
        <p type="p">Z-L-(M)r A</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1851" publication-number="202626725"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626725.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135714</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新型雙特異性多肽複合物</chinese-title>  
        <english-title>NOVEL BISPECIFIC PEPTIDE COMPLEXES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商映恩生物科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUALITY BIOLOGICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱沛然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, PEIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李成剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENGGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花海清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, HAIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱忠遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZHONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及抗體藥物領域。具體地包括使用特定蛋白對替換CH1和CL結構域的新型抗體以及其應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to the field of antibody drugs. Specifically, it includes novel antibodies in which specific protein pairs replace the CH1 and CL domains, as well as their uses.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1852" publication-number="202626687"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626687.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135731</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含金屬光刻膠顯影劑組成物以及包括使用組成物的顯影方法的形成圖案方法</chinese-title>  
        <english-title>DEVELOPER COMPOSITION FOR METAL-CONTAINING PHOTORESIST, AND METHOD OF FORMING PATTERNS INCLUDING DEVELOPING METHOD USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F7/22</main-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扈鍾必</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, JONGPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炯朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HYUNGRANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴慶熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GYEONGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛羅莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, ROSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴時均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SI-KYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭澤秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, TAEKSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於含金屬光刻膠的顯影劑組成物以及包括利用顯影劑組成物的顯影方法的圖案形成方法。對於座標x，如通過顯影劑組成物的韓森溶解度參數（δd、δp、以及δh）所指定的，可以計算以座標a作為中心值的溶解度半徑Ra，可以計算以座標b作為中心值的溶解度半徑Rb，以及分別通過方程式1以及方程式2計算的座標x和座標a之間的距離（&lt;img align="absmiddle" height="23px" width="27px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;）以及座標x和座標b之間的距離（&lt;img align="absmiddle" height="23px" width="27px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;），可以具有關係&lt;img align="absmiddle" height="35px" width="70px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;以及&lt;img align="absmiddle" height="40px" width="59px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;  Rb。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="143px" width="406px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A developer composition for a metal-containing photoresist and a pattern forming method including a developing method utilizing the developer composition are disclosed. For the coordinate x, as specified by the Hansen solubility parameters (δd, δp, and δh) of the developer composition, a solubility radius R&lt;sub&gt;a&lt;/sub&gt; with a coordinate a as a center value may be calculated, a solubility radius R&lt;sub&gt;b&lt;/sub&gt; with a coordinate b as a center value may be calculated, and a distance (&lt;img align="absmiddle" height="30px" width="33px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;) between the coordinate x and the coordinate a and a distance (&lt;img align="absmiddle" height="29px" width="34px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;) between the coordinate x and the coordinate b, calculated by Equation 1 and Equation 2, respectively, may have the relationships &lt;img align="absmiddle" height="36px" width="94px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;  and &lt;img align="absmiddle" height="40px" width="94px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="129px" width="474px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">110P:特徵圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1853" publication-number="202628740"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628740.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自組裝基板及包含自組裝線之顯示裝置</chinese-title>  
        <english-title>SELF-ASSEMBLY SUBSTRATE AND DISPLAY DEVICE INCLUDING SELF-ASSEMBLY LINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10H29/49</main-classification>  
        <further-classification edition="202501120260302B">H10H29/37</further-classification>  
        <further-classification edition="202501120260302B">H10H29/80</further-classification>  
        <further-classification edition="202601120260302B">H10H29/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金剛鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KANG-HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自組裝基板及包含自組裝線之顯示裝置。自組裝基板包含於一第一方向與彼此相隔，且於與第一方向交叉的一第二方向延伸的一第一組裝線及一第二組裝線；位於第一組裝線及第二組裝線上的一絕緣層，絕緣層包含位於第一組裝線與第二組裝線之間的一組裝孔；位於第一組裝線與組裝孔之間的一第一組裝電極；以及位於第二組裝線與組裝孔之間一第二組裝電極，其中第一組裝電極與第二組裝電極分別包含透過組裝孔暴露的一第一側，以及連接至第一組裝線與第二組裝線的一第二側，以及其中第一側的每一端均位於組裝孔中，並與組裝孔的一邊緣相隔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A self-assembly substrate and a display device including a self-assembly line. The self-assembly substrate includes a first assembly line and a second assembly line spaced apart from each other in a first direction and extending in a second direction; an insulation layer on the first and second assembly lines, the insulation layer having an assembly hole between the first and second assembly lines; a first assembly electrode between the first assembly line and the assembly hole; and a second assembly electrode between the second assembly line and the assembly hole, wherein the first and second assembly electrodes respectively include a first side exposed by the assembly hole and a second side connected to the first and second assembly lines, and wherein each end of the first side is located within the assembly hole and spaced apart from an edge of the assembly hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">117h:組裝孔</p>  
        <p type="p">134:第一組裝線</p>  
        <p type="p">135:第一組裝電極</p>  
        <p type="p">135a:第一電極部分</p>  
        <p type="p">135b:第二電極部分</p>  
        <p type="p">135c:開口</p>  
        <p type="p">136:第二組裝線</p>  
        <p type="p">137:第二組裝電極</p>  
        <p type="p">137a:第一電極部分</p>  
        <p type="p">137b:第二電極部分</p>  
        <p type="p">137c:開口</p>  
        <p type="p">140:發光元件</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p>  
        <p type="p">X,Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1854" publication-number="202628746"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628746.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250924B">H10H29/855</main-classification>  
        <further-classification edition="202501120250924B">H10H29/37</further-classification>  
        <further-classification edition="202501120250924B">H10H29/39</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李柱昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOOHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全丙珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, BYOUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金光洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWANGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張祐榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, WOOYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種顯示裝置，包括包含非彎曲區域與彎曲區域的顯示面板，非彎曲區域包括設置有多個發光二極體的主動區域以及環繞主動區域的非主動區域，彎曲區域自非主動區域的一側延伸。顯示裝置更包括設置於非彎曲區域中的顯示面板上的偏光板。顯示裝置更包括設置於非彎曲區域中之顯示面板與偏光板之間的第一黏著層。顯示裝置更包括設置於彎曲區域中的顯示面板上的第一保護件。偏光板包括位於主動區域與彎曲區域之間的非主動區域第一區域中的至少一第一接觸孔，且第一保護件的一個端部延伸至第一區域的一部分以填充於該至少一第一接觸孔中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a display device. The display device includes a display panel which includes a non-bending area including an active area in which a plurality of light emitting diodes is disposed and a non-active area which encloses the active area and a bending area extending from one side of the non-active area. The display device further includes a polarization plate disposed on the display panel in the non-bending area. The display device further includes a first adhesive layer disposed between the display panel and the polarization plate in the non-bending area. The display device further includes a first protection member disposed on the display panel in the bending area. The polarization plate includes at least one first contact hole in a first area of the non-active area between the active area and the bending area and one end portion of the first protection member extends to a part of the first area to be filled in the at least one first contact hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AA:主動區域</p>  
        <p type="p">NA:非主動區域</p>  
        <p type="p">BA:彎曲區域</p>  
        <p type="p">NBA1:第一非彎曲區域</p>  
        <p type="p">NBA2:第二非彎曲區域</p>  
        <p type="p">101a:第一背板</p>  
        <p type="p">101b:第二背板</p>  
        <p type="p">105:支撐件</p>  
        <p type="p">110:顯示面板</p>  
        <p type="p">160:第一保護件</p>  
        <p type="p">161:電路元件</p>  
        <p type="p">171:偏光板</p>  
        <p type="p">171_CNT:接觸孔</p>  
        <p type="p">172a:第一黏著件</p>  
        <p type="p">172b:第二黏著件</p>  
        <p type="p">172c:第三黏著件</p>  
        <p type="p">172e:第五黏著件</p>  
        <p type="p">172f:第六黏著件</p>  
        <p type="p">173:第一黏著層</p>  
        <p type="p">175:覆蓋件</p>  
        <p type="p">177:第二黏著層</p>  
        <p type="p">178:附加障蔽膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1855" publication-number="202628506"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628506.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>完全３Ｄ列印的具高整合度之毫米波板嵌入式設計</chinese-title>  
        <english-title>FULLY 3D PRINTED MM-WAVE BOARD EMBEDDED DESIGNS WITH HIGH INTEGRATION LEVELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H05K3/14</main-classification>  
        <further-classification edition="201501120260325B">B33Y10/00</further-classification>  
        <further-classification edition="201501120260325B">B33Y80/00</further-classification>  
        <further-classification edition="200601120260325B">H05K1/16</further-classification>  
        <further-classification edition="200601120260325B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商諾斯拉普葛蘭門系統公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORTHROP GRUMMAN SYSTEMS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍　新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬特奧斯　阿圖羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATEOS, ARTURO J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤斯　潔西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TICE, JESSE B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德胡　雷珍達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANDHU, RAJINDER R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透過3D列印程序製造的印刷電路板(PCB)。所述PCB包括透過所述3D列印程序列印的基板，透過所述3D列印程序在所述基板上列印複數個堆疊介電質層，以及透過所述3D列印程序在整個所述基板和所述複數個介電質層上列印複數個嵌入式電路元件。所述PCB可以作為操作在毫米波頻率的裝置的一部分，諸如毫米波天線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A printed circuit board (PCB) that has been fabricated by a 3D printing process. The PCB includes a substrate printed by the 3D printing process, a plurality of stacked dielectric layers printed on the substrate by the 3D printing process, and a plurality of embedded electrical circuit components printed by the 3D printing process on and throughout the substrate and the plurality of dielectric layers. The PCB can be part of a device that operates at millimeter wave frequencies, such as a mm-wave antenna.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氣溶膠噴射印刷機器</p>  
        <p type="p">12:容器</p>  
        <p type="p">14:油墨材料</p>  
        <p type="p">16:入口</p>  
        <p type="p">18:氣溶膠</p>  
        <p type="p">20:管線</p>  
        <p type="p">22:閥門</p>  
        <p type="p">24:加熱器</p>  
        <p type="p">26:噴嘴</p>  
        <p type="p">28:鞘流氣</p>  
        <p type="p">30:入口</p>  
        <p type="p">32:基板</p>  
        <p type="p">34:印刷元件</p>  
        <p type="p">36:電腦</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1856" publication-number="202626667"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626667.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>巨環磺醯胺調節劑</chinese-title>  
        <english-title>MACROCYCLIC SULFONAMIDE MODULATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D498/20</main-classification>  
        <further-classification edition="200601120260401B">C07D498/04</further-classification>  
        <further-classification edition="200601120260401B">A61K31/436</further-classification>  
        <further-classification edition="200601120260401B">A61K31/407</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商維泰克斯製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERTEX PHARMACEUTICALS INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安　俊勉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, JUN MYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾倫　艾蜜莉　伊莉莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLEN, EMILY ELIZABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏博諾　大衛　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHARBONEAU, DAVID JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　明珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達金　雷斯里　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAKIN, LESLIE A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　布魯恩　柯普斯　克麗斯汀娜　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE BRUYN KOPS, CHRISTINA ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德拉諾　托維斯　強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELANO, TRAVIS JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛西亞　巴倫特　沛德洛　曼諾爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARCIA BARRANTES, PEDRO MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋瑞　藍諾　李　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREY, RONALD LEE, JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾納　梅根　伊莉莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOERRNER, MEGAN ELIZABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>娜米倫貝　雪拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMIREMBE, SHEILA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那雷亞奈　阿爾瓊　文卡特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARAYANAN, ARJUN VENKAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐森　潔西卡　霍華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSEN, JESSICA HOWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包爾斯　麥迪森　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERS, MADISON HENRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史考特　托尼　Ｚ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCOTT, TONY Z.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史東　史蒂芬　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE, STEVEN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯瑪斯　埃米爾　法蘭柯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMAS, EMIL FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王小徐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="19"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩訶曼　艾希莉　凱瑟琳　柔伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZACHMANN, ASHLEY KATHLEEN ZOEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="20"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩奇　馬里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAKY, MARIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="21"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張成龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHENLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示可用於預防或治療至少部分由食慾激素受體2介導之疾病的化合物、組合物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are compounds, compositions, and methods useful for preventing or treating a disease which is at least partially mediated by orexin receptor 2.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1857" publication-number="202628145"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628145.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>片狀電感器、印刷配線板、模組及導電性接著劑層的使用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260121B">H01F27/28</main-classification>  
        <further-classification edition="200601120260121B">H01F17/04</further-classification>  
        <further-classification edition="200601120260121B">H05K1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森祥太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">將片狀電感器製品（1A）中的脫模膜（13）剝離而用作片狀電感器（10A）。片狀電感器（10A）至少包括導電性接著劑層（11）。導電性接著劑層（11）藉由在不與形成於印刷配線板的接地用的導電圖案連接的情況下，將形成於所述印刷配線板的相互間隔開的第一導電圖案與第二導電圖案連結而作為電感發揮功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A、1B:片狀電感器製品</p>  
        <p type="p">10A、10B:片狀電感器</p>  
        <p type="p">11:導電性接著劑層</p>  
        <p type="p">13:脫模膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1858" publication-number="202628166"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628166.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於操縱複數第一個別帶電粒子束的多孔徑陣列以及包含該多孔徑陣列的多粒子束系統</chinese-title>  
        <english-title>MULTI-APERTURE ARRAY FOR MANIPULATING A PLURALITY OF FIRST INDIVIDUAL CHARGED PARTICLE BEAMS AS WELL AS MULTIPLE PARTICLE BEAM SYSTEM COMPRISING THE MULTI-APERTURE ARRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H01J37/28</main-classification>  
        <further-classification edition="200601120260330B">H01J37/26</further-classification>  
        <further-classification edition="200601120260330B">H01J37/12</further-classification>  
        <further-classification edition="200601120260330B">H01J37/04</further-classification>  
        <further-classification edition="202601120260330B">G21K1/00</further-classification>  
        <further-classification edition="200601120260330B">G21K7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司多重掃描電子顯微鏡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS MULTISEM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃格爾　珊卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOGEL, SANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛普史崔　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOOPSTRA, ERIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列德雷　迪瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEIDLER, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭示一種多孔徑陣列，其用於操縱多個第一個別帶電粒子束，包含以下各項：具有多個孔徑的一本體，其中在多孔徑陣列的操作期間，每個第一個別帶電粒子束都穿過一個孔徑；至少多個第一電極，其中每個第一電極設置在孔徑的其中一個處，以便單獨影響穿過該孔徑的第一個別粒子束，並且每個第一電極都連接至控制單元；其中該本體具有沿z方向的第一深度TG，該第一孔徑沿該z方向延伸穿過該本體；其中每個第一電極都沿z方向具有深度TE，該深度小於深度TG，因此TE＜TG；其中每個第一電極都以這樣的方式嵌入該本體中：它們暴露在鄰近該孔徑的區域中，並以形成孔徑的方式呈現，而其他部分則直接嵌入該本體中，因此不具有電絕緣層；以及其中該本體的材料包含玻璃或由玻璃製成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Multi-aperture array for manipulating a plurality of first individual charged particle beams, comprising the following: a main body having a plurality of apertures, wherein in each case one of the first individual charged particle beams passes through one aperture during operation of the multi-aperture array; at least a plurality of first electrodes, wherein each one of the first electrodes is arranged at one of the apertures in order to individually influence the first individual particle beam passing through the aperture, and wherein each one of the first electrodes is connected to a control unit; wherein the main body has a first depth TG in a z direction along which the first apertures extend through the main body; wherein the first electrodes each have a depth TE in the z direction that is smaller than the depth TG, thus TE ＜ TG; wherein the first electrodes are each embedded in the main body in such a way that they are exposed in a region adjacent to the aperture and in a manner forming the aperture and are otherwise embedded directly in the main body and thus without an electrical insulation layer; and wherein the material of the main body comprises a glass or is made of a glass.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:一次粒子束/第一個別粒子束</p>  
        <p type="p">82:多極電極</p>  
        <p type="p">86:導體軌道/導線</p>  
        <p type="p">350:多孔徑陣列</p>  
        <p type="p">351:孔徑</p>  
        <p type="p">360:本體</p>  
        <p type="p">370:本體頂側</p>  
        <p type="p">371:上放電層</p>  
        <p type="p">372:短路保護層</p>  
        <p type="p">379:側向放電層</p>  
        <p type="p">380:本體底側</p>  
        <p type="p">381:下放電層</p>  
        <p type="p">382:短路保護層</p>  
        <p type="p">389:接觸墊</p>  
        <p type="p">390:載體元件</p>  
        <p type="p">391:導體軌道</p>  
        <p type="p">392:載體頂側</p>  
        <p type="p">393:放電層</p>  
        <p type="p">394:載體底側</p>  
        <p type="p">395:放電層</p>  
        <p type="p">396:放電層</p>  
        <p type="p">A:剖面方向</p>  
        <p type="p">TE:電極在z方向的深度</p>  
        <p type="p">TG:本體在z方向的深度</p>  
        <p type="p">y:方向</p>  
        <p type="p">z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1859" publication-number="202627057"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627057.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、清洗完畢的被處理物之製造方法、電子裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C11D1/68</main-classification>  
        <further-classification edition="200601120260319B">C11D7/08</further-classification>  
        <further-classification edition="200601120260319B">C11D3/30</further-classification>  
        <further-classification edition="200601120260319B">C09G1/18</further-classification>  
        <further-classification edition="200601120260319B">C09K3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大內直子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHUCHI, NAOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上村哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIMURA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹下祐太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKESHITA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種組成物，其在適用於包含來自於實施了CMP處理之氧化膜或氮化膜等絕緣膜之親水性表面之被處理物時，粒子去除性及有機物去除性優異。又，提供一種清洗完畢的被處理物之製造方法及電子裝置之製造方法。本發明的組成物為用於對實施了化學機械研磨處理之被處理物進行清洗之組成物，其包含：非離子性高分子；及特定化合物（其中，不包括兩性離子化合物），選自由無機酸、胺基醇、有機酸、四級銨化合物及脂肪族多胺組成之群組，上述有機酸具有至少1個選自由羧酸基、膦酸基及磺酸基組成之群組中的基，相對於上述特定化合物的合計含量之上述非離子性高分子的含量的質量比為0.1～10000。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1860" publication-number="202627532"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627532.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135763</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像鏡頭模組、相機模組及電子裝置</chinese-title>  
        <english-title>IMAGING LENS ASSEMBLY MODULE, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260223B">G02B1/10</main-classification>  
        <further-classification edition="202101120260223B">G02B7/02</further-classification>  
        <further-classification edition="202101120260223B">G02B7/04</further-classification>  
        <further-classification edition="202101120260223B">G02B7/20</further-classification>  
        <further-classification edition="200601120260223B">G02B17/08</further-classification>  
        <further-classification edition="202101120260223B">G03B11/04</further-classification>  
        <further-classification edition="202101120260223B">G03B17/00</further-classification>  
        <further-classification edition="202101120260223B">G03B17/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡溫祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭秀儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, HSIU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周明達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MING-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱國強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, KUO-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像鏡頭模組包含至少一透鏡以及一鏡筒。所述至少一透鏡容置於鏡筒，且包含一低反射晶簇層。低反射晶簇層設置於鏡筒的一表面，其中低反射晶簇層的一組成包含一金屬元素及一氟元素。藉此，有助於降低反射光線之強度且提升成像品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens assembly module includes at least one lens and a lens barrel. The at least one lens is accommodated in the lens barrel, and includes an low reflective cluster layer. The low reflective cluster layer is disposed on a surface of the lens barrel. A composition of the low reflective cluster layer includes a metallic element and a fluorine element. Therefore, it is favorable for decreasing the intensity of the reflecting light and improving the imaging quality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像鏡頭模組</p>  
        <p type="p">110:光學元件</p>  
        <p type="p">120,130,140:遮光元件</p>  
        <p type="p">121,131,141:低反射晶簇層</p>  
        <p type="p">150:驅動部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1861" publication-number="202627079"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627079.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具提高之分泌能力之細胞及使用方法</chinese-title>  
        <english-title>CELL HAVING INCREASED SECRETION CAPABILITIES AND METHOD OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N5/10</main-classification>  
        <further-classification edition="200601120260401B">C12N15/85</further-classification>  
        <further-classification edition="200601120260401B">C12N15/90</further-classification>  
        <further-classification edition="200601120260401B">C12N9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商亞利斯貿易公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARES TRADING S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪雷納　路易莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARENA, LUISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦拉達　阿爾貝托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VARALDA, ALBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種具提高之分泌生物材料之能力之細胞，該等生物材料包含位於內源SCD1基因上游之外源組成型啟動子。該細胞允許SCD1之過度表現，藉此提高該細胞之分泌能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is a cell having increased capabilities for secreting biologic materials comprising an exogenous constitutive promoter located upstream of the endogenous SCD1 gene. This cell allows for overexpression of SCD1 thereby increasing the secretion capabilities of the cell.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1862" publication-number="202627562"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627562.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135773</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動化矽光子黏合界面增强</chinese-title>  
        <english-title>AUTOMATED SILICON PHOTONICS BONDING INTERFACE ENHANCEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G02B6/122</main-classification>  
        <further-classification edition="202001120260401B">G06F30/392</further-classification>  
        <further-classification edition="202001320260401B">G06F113/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商無蓋燈光電公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPENLIGHT PHOTONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛宰赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JAEHYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種矽光子裝置包含一基板，該基板由一含矽材料形成且經圖案化以包括界定一第一溝渠之一第一波導及一第二波導，該第一溝渠在該第一波導與該第二波導之間延伸。該第一波導及該第二波導之上部表面經暴露以黏合至一磊晶生長層。該第一溝渠暴露於該磊晶生長層。一支撑結構形成於該第一溝渠內且向上延伸至該第一波導及該第二波導之該等上部表面之一高度處之一上部表面。該支撑結構係光學非功能性的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A silicon photonic device includes a substrate formed from a silicon-containing material and patterned to comprise a first waveguide and a second waveguide defining a first trench extending between the first waveguide and the second waveguide. The first waveguide and second waveguide have upper surfaces exposed for bonding to an epitaxially grown layer. The first trench being exposed to the epitaxially grown layer. A support structure is formed within the first trench and extends upward to an upper surface at a height of the upper surfaces of the first waveguide and second waveguide. The support structure is optically non-functional.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:支撐結構</p>  
        <p type="p">202:矽光子裝置</p>  
        <p type="p">204:矽基板/經圖案化矽基板</p>  
        <p type="p">206:第一磊晶生長層</p>  
        <p type="p">208:第二磊晶生長層</p>  
        <p type="p">216:波導/第一波導</p>  
        <p type="p">218:波導/第二波導/實質上筆直第二波導</p>  
        <p type="p">220:第一溝渠/寬的第一溝渠</p>  
        <p type="p">226:上部表面</p>  
        <p type="p">Y:軸線</p>  
        <p type="p">Z:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1863" publication-number="202627460"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627460.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置以及檢查方法</chinese-title>  
        <english-title>INSPECTION APPARATUS AND INSPECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">G01N21/956</main-classification>  
        <further-classification edition="201201120260331B">G03F1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷射科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASERTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦大知</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>権平皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONDAIRA, KO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的實施形態的檢查裝置係包含：照明光學系統(100)，係以照明光(L10)照明對象物(400)；成像光學系統(200a)，係包含用以將來自被照明光(L10)照明的對象物(400)的光(L20)聚光之聚光構件(210)，並使被聚光構件(210)聚光的光(L20)成像至光檢測部(230)；以及處理部(300)，係基於成像至光檢測部(230)的影像檢查對象物(400)；在已將對象物平面(410)設定於對象物(400)與聚光構件(210)之間之情形中，對象物平面(410)係具有：聚光區域(520)，係包含第一聚光區域以及第二聚光區域；以及照明光區域(510)，係被第二聚光區域圍繞；第一聚光區域係對應於正反射光(L21)；第二聚光區域係對應於高次繞射光(L22)；第一聚光區域係被第二聚光區域圍繞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢查裝置</p>  
        <p type="p">100:照明光學系統</p>  
        <p type="p">110:光源</p>  
        <p type="p">120:光學構件</p>  
        <p type="p">200:檢測光學系統</p>  
        <p type="p">210:聚光構件</p>  
        <p type="p">211:聚集鏡</p>  
        <p type="p">212:孔</p>  
        <p type="p">220:中繼系統</p>  
        <p type="p">220a:成像光學系統</p>  
        <p type="p">230:光檢測部</p>  
        <p type="p">300:處理部</p>  
        <p type="p">400:對象物</p>  
        <p type="p">410:對象物平面</p>  
        <p type="p">L10:照明光</p>  
        <p type="p">L20:光</p>  
        <p type="p">L21:正反射光</p>  
        <p type="p">L22:高次繞射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1864" publication-number="202627285"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627285.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>建築結構遮蓋物</chinese-title>  
        <english-title>ARCHITECTURAL STRUCTURE COVERINGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">E06B9/06</main-classification>  
        <further-classification edition="200601120260320B">E06B9/56</further-classification>  
        <further-classification edition="200601120260320B">E06B9/68</further-classification>  
        <further-classification edition="200601120260320B">E04F10/04</further-classification>  
        <further-classification edition="200601120260320B">E04F10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亨特道格拉斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNTER DOUGLAS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安東尼　詹姆斯　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTHONY, JAMES M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　喬許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, JOSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷特　克里斯托佛　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITE, CHRISTOPHER M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷斯　克拉克　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRACE, CLARK D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱爾　德米特里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYLE, DMITRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個態樣中，一種建築結構遮蓋物包括一遮蓋物材料、一頂軌、定位於該頂軌中之一馬達及定位於該頂軌中之一升降站。該升降站可操作以升高及降低該遮蓋物材料。該建築結構遮蓋物亦包括一電池系統，該電池系統在該頂軌中定位於該馬達與該升降站之間，其中該電池系統包括一電池殼體，該電池殼體限定一驅動通道。另外，該建築結構遮蓋物包括：複數個電池，該複數個電池定位於該電池殼體中；及一驅動軸，該驅動軸透過該驅動通道自該馬達延伸至該升降站，其中該驅動軸經組態以基於該馬達之一操作來操作該升降站。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one aspect, an architectural structure covering includes a covering material, a headrail, a motor positioned in the headrail, and a lift station positioned in the headrail. The lift station is operable to raise and lower the covering material. The architectural structure covering also includes a battery system positioned in the headrail between the motor and the lift station, wherein the battery system includes a battery housing that defines a drive channel. Additionally, the architectural structure covering includes a plurality of batteries positioned in the battery housing and a drive shaft extending from the motor to the lift station through the drive channel, wherein the drive shaft is configured to operate the lift station based on an operation of the motor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:建築結構遮蓋物/建築結構遮蓋物總成</p>  
        <p type="p">102:蓋</p>  
        <p type="p">104:相鄰建築特徵</p>  
        <p type="p">106:垂直箭頭</p>  
        <p type="p">108:箭頭</p>  
        <p type="p">109:頂軌</p>  
        <p type="p">110:窗框</p>  
        <p type="p">112:附接件</p>  
        <p type="p">114:充電器</p>  
        <p type="p">116:連接器</p>  
        <p type="p">118:保持器</p>  
        <p type="p">120:延伸部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1865" publication-number="202626918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性樹脂片材及其製造方法、印刷電路板及半導體裝置</chinese-title>  
        <english-title>THERMOSETTING RESIN SHEET AND METHOD FOR MANUFACTURING THE SAME, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08K3/36</main-classification>  
        <further-classification edition="200601120260401B">C08K7/26</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠井渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一松恒生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIMATSU, TSUNEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本和美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KAZUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種熱硬化性樹脂片材及其製造方法、以及使用其之印刷電路板及半導體裝置，該熱硬化性樹脂片材可確保絕緣性，並且使佈線之嵌埋性良好，維持低介電常數及低介電損耗因數。本發明係一種熱硬化性樹脂片材及其製造方法、以及使用上述熱硬化性樹脂片材之印刷電路板及半導體裝置，該熱硬化性樹脂片材具有配置於基材側之第1面、及位於該第1面相反側之第2面，包含中空無機粒子，當將金屬元素及半金屬元素設為M時，該第1面之C/Si元素莫耳比相對於該第2面之C/M元素莫耳比的比為1.02～1.09，厚度為10～150 μm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1866" publication-number="202627496"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627496.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135868</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電性連接裝置</chinese-title>  
        <english-title>ELECTRICAL CONNECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G01R1/073</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川研</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村本剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAMOTO, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANO, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電性連接裝置，具備印刷基板；探針頭，保持複數個探針，該探針具有與印刷基板電性連接的基端部、及與晶圓(被檢查體)接觸的頂端部；及，固定基底，被設置在印刷基板的下側，且一部分被固定於探針頭的上面。固定基底與印刷基板，被設置為可對應於熱膨脹而進行相對移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:探針頭</p>  
        <p type="p">2:空間轉換器</p>  
        <p type="p">3:中介層</p>  
        <p type="p">4:印刷基板</p>  
        <p type="p">5:補強板</p>  
        <p type="p">6:固定基底</p>  
        <p type="p">7:懸吊構件</p>  
        <p type="p">11:探針</p>  
        <p type="p">21:晶圓</p>  
        <p type="p">21a:墊</p>  
        <p type="p">100:電性連接裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1867" publication-number="202628799"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628799.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於氣相沉積腔室的變電導邊緣環</chinese-title>  
        <english-title>VARIABLE CONDUCTANCE EDGE RING FOR VAPOR DEPOSITION CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260320B">H10P14/24</main-classification>  
        <further-classification edition="200601120260320B">C23C16/455</further-classification>  
        <further-classification edition="200601120260320B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿里ＭＡ　安舍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALI M.A, AZHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡許葉　迪力提曼蘇哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHYAP, DHRITIMAN SUBHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆斯塔法　姆漢納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSTAFA, MUHANNAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱塔爾　阿迪蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUTTAR, ADITYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了基板處理腔室氣體分配組件及利用其處理基板的方法。該氣體分配組件包括具有下表面及上表面的邊緣環，該下表面被配置為支撐於基板處理腔室底座上，該下表面與該上表面限定邊緣環厚度，該基板處理腔室邊緣環在環形主體的第一邊緣處具有第一邊緣環厚度，該第一邊緣環厚度大於該基板處理腔室邊緣環的與該第一邊緣相對的第二邊緣處的第二邊緣環厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Substrate processing chamber gas distribution assemblies and methods utilizing of processing substrates using the same are described. The gas distribution assembly includes an edge ring having a lower surface configured to be supported on a substrate processing chamber pedestal and an upper surface, the lower surface and the upper surface defining an edge ring thickness, the substrate processing chamber edge ring having a first edge ring thickness at a first edge of the ring-shaped body that is greater than a second edge ring thickness at a second edge opposite the first edge of the substrate processing chamber edge ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:腔室主體</p>  
        <p type="p">103:頂壁</p>  
        <p type="p">108:狹縫閥</p>  
        <p type="p">111:基板接收表面</p>  
        <p type="p">112:底座</p>  
        <p type="p">112p:外周部分</p>  
        <p type="p">125:氣體分配面板</p>  
        <p type="p">125b:底表面</p>  
        <p type="p">125t:頂表面</p>  
        <p type="p">160:底表面</p>  
        <p type="p">164:反應區域</p>  
        <p type="p">170:背板</p>  
        <p type="p">179:泵送襯墊</p>  
        <p type="p">200:泵</p>  
        <p type="p">201:氣體分配組件</p>  
        <p type="p">202s:邊緣環</p>  
        <p type="p">d&lt;sub&gt;3&lt;/sub&gt;:距離</p>  
        <p type="p">d&lt;sub&gt;4&lt;/sub&gt;:距離</p>  
        <p type="p">t&lt;sub&gt;3&lt;/sub&gt;:厚度</p>  
        <p type="p">t&lt;sub&gt;4&lt;/sub&gt;:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1868" publication-number="202626928"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626928.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醋酸纖維素聚合物組成物</chinese-title>  
        <english-title>CELLULOSE ACETATE POLYMER COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L1/12</main-classification>  
        <further-classification edition="200601120260401B">C08L67/00</further-classification>  
        <further-classification edition="200601120260401B">C08K3/22</further-classification>  
        <further-classification edition="200601120260401B">C08K5/098</further-classification>  
        <further-classification edition="200601120260401B">C08J3/12</further-classification>  
        <further-classification edition="200601120260401B">C08J3/20</further-classification>  
        <further-classification edition="200601120260401B">C08J5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大賽璐股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人九州工業大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYUSHU INSTITUTE OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻原拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGIWARA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤義人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, YOSHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在熔融捏合期間具有優異的流動性之醋酸纖維素聚合物組成物。醋酸纖維素聚合物組成物，其包含：聚合物，其中醋酸纖維素的至少一部分與聚酯的至少一部分相互結合；及鋅化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a cellulose acetate polymer composition having excellent fluidity during melt kneading. A cellulose acetate polymer composition containing: a polymer in which at least a portion of a cellulose acetate and at least a portion of a polyester are bound to each other; and a zinc compound.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1869" publication-number="202627080"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627080.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉位酶及其用途</chinese-title>  
        <english-title>TRANSPOSASES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N9/12</main-classification>  
        <further-classification edition="200601120260401B">C12N15/62</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">C12N15/10</further-classification>  
        <further-classification edition="200601120260401B">A61K38/45</further-classification>  
        <further-classification edition="200601120260401B">A61P7/04</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商波西達治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POSEIDA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧卡斯　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCAS, JOSEPH S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥迪遜　布萊爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADISON, BLAIR B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露一般涉及融合蛋白及其使用方法，該等融合蛋白包含靶向重複元件的TAL陣列及包含胺基末端缺失以及雙半胱胺酸富集域(CRD)的轉位酶域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure generally relates to fusion proteins comprising TAL Arrays targeting a repetitive element and a transposase domain comprising amino terminal deletions, as well as dual cysteine rich domains (CRD), and methods of use therefor.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1870" publication-number="202626701"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626701.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135936</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經化學修飾之肽及其用途</chinese-title>  
        <english-title>CHEMICALLY MODIFIED PEPTIDES AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K14/575</main-classification>  
        <further-classification edition="200601120260401B">A61K38/22</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐羅克里生物科學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUROCRINE BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅佐　亞當　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEZO, ADAM R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何榮軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, RONGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係關於經化學修飾之肽及其在治療某些疾病或病症中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to chemically modified peptides and uses thereof in treating certain diseases or disorders.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1871" publication-number="202628738"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628738.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135989</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及包含其之電子設備</chinese-title>  
        <english-title>DISPLAY DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10H29/39</main-classification>  
        <further-classification edition="202501120260302B">H10H29/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李仙花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁志薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹昭日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, SOIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鎭宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含一顯示區域、一第一區域及一第二區域，該第二區域位於該顯示區域及該第一區域之間。該顯示裝置包含：若干主島部分，位於該顯示區域內，且在一第一方向及與該第一方向相交的一第二方向上彼此分隔開；一第一部分，位於該第一區域中；若干第一周邊島部分，位於該第二區域內，且在該第一方向及該第二方向上彼此分隔開；若干第一周邊橋部分，分別連接在該第一方向上彼此相鄰的兩個第一周邊島部分；以及若干第二周邊橋部分，非別連接在該第二方向上彼此相鄰的兩個第一周邊島部分。各該複數個第二周邊橋部分包含在該第一方向上彼此分隔開的第一第二周邊橋部分及第二第二周邊橋部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a display area, a first region, and a second region between the display area and the first region. The display device includes: main island portions in the display area and apart from each other in a first direction and a second direction crossing the first direction; a first portion in the first region; first peripheral island portions in the second region and apart from each other in the first direction and the second direction; first peripheral bridge portions, each connecting two first peripheral island portions adjacent to each other in the first direction; and second peripheral bridge portions, each connecting two first peripheral island portions adjacent to each other in the second direction. Each of the plurality of second peripheral bridge portions includes a first second peripheral bridge portion and a second second peripheral bridge portion apart from each other in the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:第二周邊島部分</p>  
        <p type="p">40:第一部分</p>  
        <p type="p">A:區域</p>  
        <p type="p">A11:第一周邊島部分</p>  
        <p type="p">A12a:第一周邊橋部分</p>  
        <p type="p">A12b:第二周邊橋部分</p>  
        <p type="p">A12ba:第二-1周邊橋部分</p>  
        <p type="p">A12bb:第二-2周邊橋部分</p>  
        <p type="p">A13a:第一周邊開口</p>  
        <p type="p">A13b:第二周邊開口</p>  
        <p type="p">A13c:第三周邊開口</p>  
        <p type="p">A4:第四周邊區域</p>  
        <p type="p">B:區域</p>  
        <p type="p">B12:第一中間橋部分</p>  
        <p type="p">B12a:第一-1中間橋部分</p>  
        <p type="p">B12b:第一-2中間橋部分</p>  
        <p type="p">B13a:第一中間開口</p>  
        <p type="p">B13b:第二中間開口</p>  
        <p type="p">BA:中間區域</p>  
        <p type="p">D11:主島部分</p>  
        <p type="p">D12:主橋部分</p>  
        <p type="p">D13:主開口</p>  
        <p type="p">DA:顯示區域</p>  
        <p type="p">EA:延伸部分</p>  
        <p type="p">EA1:第一延伸部分</p>  
        <p type="p">EA2:第二延伸部分</p>  
        <p type="p">FA:可撓性區域</p>  
        <p type="p">HA:硬性區域</p>  
        <p type="p">MA:主部分</p>  
        <p type="p">NDA:非顯示區域</p>  
        <p type="p">NDA4:第四非顯示區域</p>  
        <p type="p">x,y,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1872" publication-number="202627565"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627565.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於矽光子積體電路之延伸埋入式氧化物層之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR AN EXTENDED BURIED OXIDE LAYER FOR SILICON PHOTONIC INTEGRATED CIRCUITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G02B6/13</main-classification>  
        <further-classification edition="200601120260323B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商覓可思科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIXX TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙維茲　瑞貝卡　凱拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEVITZ, REBECCA KAYLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉古拉曼　維維克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAGHURAMAN, VIVEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種製造具有整合光子及電子組件之一半導體裝置之裝置及方法。該方法可包含：提供具有一矽處置晶圓、一埋入式氧化物(BOX)層及一矽波導層之一絕緣體上矽(SOI)晶圓；形成包含該波導或一金屬層之一或多者之一光子積體電路(PIC)；移除該矽晶圓以暴露該BOX層；及藉由以下之一或多者來延伸該BOX層：將氧化物沈積至該BOX層上且平坦化以增加BOX層厚度至一延伸BOX層，或將一第二晶圓與一表面氧化物層熔化接合。該裝置可包含一光子積體電路(PIC)、一額外氧化物層及經定位以在一波導層內垂直反射或整形光學信號之一整合光學組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device and method of manufacturing a semiconductor device with integrated photonic and electronic components is described. The method may include: providing a silicon-on-insulator (SOI) wafer having a silicon handle wafer, a buried oxide (BOX) layer, and a silicon waveguide layer; forming a photonic integrated circuit (PIC) including one or more of the waveguide or a metal layer; removing the silicon wafer to expose the BOX layer; and extending the BOX layer by one or more of: depositing oxide and planarizing onto the BOX layer to increase BOX layer thickness to an extended BOX layer, or fusion bonding a second wafer with a surface oxide layer. The device may include a photonic integrated circuit (PIC), an additional oxide layer, and an integrated optical component positioned to reflect or reshape optical signals within a waveguide layer vertically.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:Si載體晶圓</p>  
        <p type="p">104:埋入式氧化物(BOX)層</p>  
        <p type="p">106:矽波導</p>  
        <p type="p">108:氧化物層</p>  
        <p type="p">110:氮化物層</p>  
        <p type="p">112:氧化物層</p>  
        <p type="p">114:後端金屬層/後端金屬堆疊</p>  
        <p type="p">202:Si處置晶圓</p>  
        <p type="p">204:氧化物層</p>  
        <p type="p">206:盲孔</p>  
        <p type="p">209:溝槽</p>  
        <p type="p">220:電子積體電路(EIC)</p>  
        <p type="p">222:反射鏡</p>  
        <p type="p">224:電連接</p>  
        <p type="p">300:矽光子橋(SPB)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1873" publication-number="202627542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光控膜</chinese-title>  
        <english-title>LIGHT CONTROL FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G02B5/22</main-classification>  
        <further-classification edition="200601120260223B">B32B3/30</further-classification>  
        <further-classification edition="200601120260223B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＭＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>咸文鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAM, MOON HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙長熹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, JANGHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宇鍾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WOOJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權藝弼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, YE-PIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李起昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, GI HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張柱賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JU HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權玟廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, MIN JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙相元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SANG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了光控膜。光控膜可包括百葉窗膜，百葉窗膜具有在其上交替地排列有光吸收部分和光透射部分的第一表面以及具有在第一表面的相對側上的光透射部分的第二表面。可針對光控膜調整線孔徑比和面積孔徑比。根據本說明書的公開內容，能夠根據需要控制光控膜的亮度特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:百葉窗膜</p>  
        <p type="p">1001:第一表面</p>  
        <p type="p">1002:第二表面</p>  
        <p type="p">T:光透射部分</p>  
        <p type="p">A:光吸收部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1874" publication-number="202628389"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628389.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過微控制器確保裝置認證之方法</chinese-title>  
        <english-title>METHOD FOR SECURING AUTHENTICATION OF A DEVICE BY A MICROCONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">H04L9/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商舍弗勒科技股份有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFFLER TECHNOLOGIES AG &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕斯奎爾　傑瑞米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASQUIER, JEREMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達內　貝特朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANET, BERTRAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞居伊　尚克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGUY, JEAN-CHRISTOPHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種透過一微控制器(11)確保一裝置(2)認證之方法，該微控制器包括一電子晶片(111)，該電子晶片包括至少一接腳(1111-A)、稱為「自由」接腳，未連接至該微控制器(11)之該等引線(112)中任一者，且產生無法在該微控制器(11)外側存取之一嘈雜訊號，該方法之步驟包括偵測(E2)一裝置(2)、藉一處理模組(1112)經由該自由接腳(111-A)接收(E3)一嘈雜訊號，由該接收到的嘈雜訊號產生一識別訊號，加密(E4)該識別訊號，傳輸(E5)該加密的識別訊號至該裝置(2)，解密(E6)該識別訊號，傳輸(E7)該解密的識別訊號至該微控制器(11)，比較(E8)該產生出的識別訊號與該解密的識別訊號及當該解密的識別訊號與該產生出的識別訊號對應時認證(E9)該裝置(2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for securing authentication of a device (2) by a microcontroller (11) comprising an electronic chip (111), comprising at least one pin (1111-A), called the "free" pin, not connected to any of the leads (112) of the microcontroller (11) and generating a noisy signal that is not accessible outside the microcontroller (11), said method comprising the steps of detection (E2) of a device (2), reception (E3), by a processing module (1112), of a noisy signal via the free pin (111-A), generation of a recognition signal from the received noisy signal, encryption (E4) of the recognition signal, transmission (E5) of the encrypted recognition signal to the device (2), decryption (E6) of the recognition signal, transmission (E7) of the decrypted recognition signal to the microcontroller (11), comparison (E8) of the generated recognition signal and of the decrypted recognition signal, and authentication (E9) of the device (2) when the decrypted recognition signal corresponds to the generated recognition signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:裝置</p>  
        <p type="p">11:微控制器</p>  
        <p type="p">12:收發器</p>  
        <p type="p">111:電子晶片</p>  
        <p type="p">1111-A:自由接腳</p>  
        <p type="p">1112:處理模組</p>  
        <p type="p">1113:加密模組</p>  
        <p type="p">1114:通訊模組</p>  
        <p type="p">E1:第一步驟</p>  
        <p type="p">E2:第二步驟</p>  
        <p type="p">E3:第三步驟</p>  
        <p type="p">E4:步驟</p>  
        <p type="p">E5:步驟</p>  
        <p type="p">E6:步驟</p>  
        <p type="p">E7:步驟</p>  
        <p type="p">E8:步驟</p>  
        <p type="p">E9:步驟</p>  
        <p type="p">E9*:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1875" publication-number="202626780"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626780.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、樹脂膜、預浸體、積層板、印刷線路板及半導體封裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F8/46</main-classification>  
        <further-classification edition="200601120260401B">C08K5/14</further-classification>  
        <further-classification edition="200601120260401B">C08L25/08</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">C08J5/24</further-classification>  
        <further-classification edition="200601120260401B">B32B15/08</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日高圭芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDAKA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田端栞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABATA, SHIORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森和彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本高士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種樹脂組成物，其可將在去膠渣處理後的表面產生的坑洞的尺寸抑制得較小或抑制產生坑洞本身，並且能形成玻璃轉移溫度(Tg)高的硬化物。具體而言，提供一種樹脂組成物，其含有：改質率2.5質量%以上的馬來酸酐改質苯乙烯系彈性體(A)、熱硬化性樹脂(B)及有機過氧化物(Z)，前述有機過氧化物(Z)的含量，相對於前述(B)成分100質量份為0.10質量份以上。進而還提供使用了前述樹脂組成物之樹脂膜、預浸體、積層板、印刷線路板及半導體封裝體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1876" publication-number="202626792"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626792.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、片狀材料、印刷線路板及半導體裝置</chinese-title>  
        <english-title>RESIN COMPOSITION, SHEET-SHAPED MATERIAL, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08F136/14</main-classification>  
        <further-classification edition="200601120260325B">C08F291/02</further-classification>  
        <further-classification edition="200601120260325B">C08G59/34</further-classification>  
        <further-classification edition="200601120260325B">C08L63/10</further-classification>  
        <further-classification edition="200601120260325B">C08L101/06</further-classification>  
        <further-classification edition="200601120260325B">C08K3/36</further-classification>  
        <further-classification edition="200601120260325B">H05K1/03</further-classification>  
        <further-classification edition="200601120260325B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHI, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛岡廣喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUZUOKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松佑太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樹脂組成物，其含有：環氧改質的含雙鍵之烴聚合物、熱塑性彈性體及無機填充材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition includes an epoxy-modified hydrocarbon polymer containing a double bond, a thermoplastic elastomer, and an inorganic filler.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1877" publication-number="202626641"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626641.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為組織胺受體抑制劑的吡啶並嘧啶衍生物</chinese-title>  
        <english-title>PYRIDOPYRIMIDINE DERIVATIVE AS HISTAMINE RECEPTOR INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D471/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商ＦＡＥＳ製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAES FARMA, S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑喬　馬丁內斯　伊格納西奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANCHO MARTINEZ, IGNACIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩雷茲　戈麥斯　安娜貝爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEREZ GOMEZ, ANABEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾維格斯　佩德羅　芭芭拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVERGES PEDRO, BARBARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧利弗拉　蒂茲內　羅伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLIVERA TIZNE, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安東納佐　索勒　馬里奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTONAZZO SOLER, MARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及式（I）化合物： &lt;br/&gt;&lt;img align="absmiddle" height="197px" width="209px" file="ed10124.JPG" alt="ed10124.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;或其鹽或溶劑化物、包含所述式（I）化合物或其鹽或溶劑化物的藥物組合物以及其在治療和/或預防由組織胺H4受體和/或由組織胺H1受體介導的疾病或障礙中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the compound of formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="218px" width="228px" file="ed10125.JPG" alt="ed10125.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;or a salt or solvate thereof, to a pharmaceutical composition comprising the same and to its use in the treatment and/or prevention of diseases or disorders mediated by histamine H4 receptor and/or by histamine H1 receptor.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1878" publication-number="202626955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組合物及成形品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C08L67/08</main-classification>  
        <further-classification edition="200601120260211B">C08G63/137</further-classification>  
        <further-classification edition="200601120260211B">C08L1/14</further-classification>  
        <further-classification edition="200601120260211B">C08K3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＫＨ新化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KH NEOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤祐樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於含有PHB及結晶成核劑之樹脂組合物，揭示了一種包含聚(3-羥基丁酸)(亦稱為「PHB」)、聚甘油不飽和脂肪酸酯及結晶成核劑之樹脂組合物，作為於射出成形時能夠抑制毛邊及翹曲產生之新穎之樹脂組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1879" publication-number="202626726"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626726.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Ｂ７—Ｈ３抗原結合分子</chinese-title>  
        <english-title>B7-H3 ANTIGEN-BINDING MOLECULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博伊德　柯克普　傑羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOYD-KIRKUP, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕西克維奇　康拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASZKIEWICZ, KONRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢森　布蘭登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSON, BRENDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　顯良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　潔瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEO, JACKLYN JIE YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤拉多　麥哲倫　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIRADO-MAGALLANES, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉丹　莫漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRADHAN, MOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了特異性結合B7-H3之抗原結合分子。亦提供了包含或編碼該等抗原結合分子之物品，以及此類分子/物品用於治療或預防疾病例如癌症之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are antigen-binding molecules that specifically bind B7-H3. Also provided are articles comprising or encoding said antigen-binding molecules, and the use of such molecules/articles for treating or preventing disease, e.g. cancer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1880" publication-number="202628381"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628381.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合式高速高信道數光收發器</chinese-title>  
        <english-title>INTEGRATED HIGH-SPEED HIGH-CHANNEL-COUNT OPTICAL TRANSCEIVERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260401B">H04B10/25</main-classification>  
        <further-classification edition="201301120260401B">H04B10/40</further-classification>  
        <further-classification edition="200601120260401B">G02B6/12</further-classification>  
        <further-classification edition="200601120260401B">G02B6/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商光程研創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTILUX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, NEIL Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝議緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIEH, ANDREW I.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴建彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, JIAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁哲夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHE-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳書履</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHU-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光鏈路包括光收發器。光收發器包括：發光器晶片，其具有被配置為並行發出第一光信號的多個光源、收光器晶片，其具有被配置為並行檢測第二光信號的多個光檢測器、以及電路系統晶片，其具有被配置為控制發光器晶片及收光器晶片的電路系統。收光器晶片堆疊在發光器晶片與電路系統晶片之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical link includes an optical transceiver. The optical transceiver includes an optical-emitter chip having multiple light sources configured to emit first optical signals in parallel, an optical-receiver chip having multiple photodetectors configured to detect second optical signals in parallel, and a circuitry chip having circuitry configured to control the optical-emitter chip and the optical-receiver chip. The optical-receiver chip is stacked between the optical-emitter chip and the circuitry chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:光鏈路</p>  
        <p type="p">120:光收發器</p>  
        <p type="p">170:光纖陣列單元</p>  
        <p type="p">210:發光器晶片</p>  
        <p type="p">220:收光器晶片</p>  
        <p type="p">230:電路系統晶片</p>  
        <p type="p">272:第一光纖陣列</p>  
        <p type="p">274:第二光纖陣列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1881" publication-number="202626727"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626727.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>B7-H3抗原結合分子</chinese-title>  
        <english-title>B7-H3 ANTIGEN-BINDING MOLECULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　華倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　潔瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEO, JIE YING, JACKLYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂拉多麥哲倫　羅伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIRADO-MAGALLANES, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢森　布倫登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSON, BRENDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波尹德　科庫普　傑洛米　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOYD-KIRKUP, JEROME DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕茲奇維斯　寇拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASZKIEWICZ, KONRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容係關於抗B7-H3抗原結合分子，以及編碼該等抗B7-H3抗原結合分子之核酸及表現載體，及包含該等抗B7-H3抗原結合分子之組成物。亦揭露使用該等分子及製品治療或預防疾病之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to anti-B7-H3 antigen-binding molecules, as well as nucleic acids and expression vectors encoding, and compositions comprising the anti-B7-H3 antigen-binding molecules. Methods of using said molecules and articles for treating or preventing disease are also disclosed.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1882" publication-number="202626035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136144</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與治療神經退化性疾病和精神疾病相關的方法和組合物</chinese-title>  
        <english-title>METHOD AND COMPOSITIONS RELATING TO THE TREATMENT OF NEURO-DEGENERATIVE AND PSYCHIATRIC DISEASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/4439</main-classification>  
        <further-classification edition="200601120260401B">A61K31/46</further-classification>  
        <further-classification edition="200601120260401B">A61K9/16</further-classification>  
        <further-classification edition="200601120260401B">A61K9/52</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/18</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡魯娜治療學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARUNA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿塔度　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATTARDO, GIORGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　振銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　安德魯　克雷格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, ANDRE CRAIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎迪　普拉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDI, PRAVEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史莫　大衛　史都華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMALL, DAVID STEWART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　際美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIMEI CRYSTAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中提供包括含有佔諾美林(xanomeline)或其鹽之立即釋放組分、含有曲司銨鹽(trospium salt)之立即釋放組分及含有佔諾美林或其鹽之經修飾釋放組分，用於治療患者之毒蕈鹼性病症之醫藥組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are pharmaceutical compositions comprising an immediate-release component comprising xanomeline or a salt thereof, an immediate-release component comprising a trospium salt, and a modified-release component comprising xanomeline or a salt thereof for treating muscarinic disorders in a patient.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1883" publication-number="202626596"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626596.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136152</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種喜樹鹼衍生物及其中間體的製備方法</chinese-title>  
        <english-title>A METHOD FOR PREPARING CAMPTOTHECIN DERIVATIVES AND THEIR INTERMEDIATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C271/22</main-classification>  
        <further-classification edition="200601120260401B">C07C269/06</further-classification>  
        <further-classification edition="200601120260401B">C07D491/22</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4745</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王入志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施林峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, LINFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓飛朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, FEIPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種喜樹鹼衍生物及其中間體的製備方法。具體而言，本揭露涉及一種式(IV)所示化合物或其鹽的製備方法，包括：式(VI)所示化合物製備式(V)所示化合物的步驟，以及式(V)所示化合物製備式(IV)所示化合物或其鹽的步驟。該方法收率高、反應條件溫和，適合工業化生產。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="125px" width="617px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a method for preparing camptothecin derivatives and their intermediates. Specifically, the disclosure relates to a method for preparing a compound or its salt represented by formula (IV), comprising the steps of preparing a compound represented by formula (V) from a compound represented by formula (VI), and preparing a compound represented by formula (IV) or its salt from a compound represented by formula (V). This method has high yield, mild reaction conditions, and is suitable for industrial production.</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="136px" width="617px" file="d10003.TIF" alt="化學式ed10003.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10003.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1884" publication-number="202626624"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626624.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜芳胺類化合物、其藥物組合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/14</main-classification>  
        <further-classification edition="200601120260401B">C07D471/04</further-classification>  
        <further-classification edition="200601120260401B">C07D487/04</further-classification>  
        <further-classification edition="200601120260401B">C07D401/04</further-classification>  
        <further-classification edition="200601120260401B">C07D403/04</further-classification>  
        <further-classification edition="200601120260401B">C07D471/10</further-classification>  
        <further-classification edition="200601120260401B">A61K31/444</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260401B">A61K31/506</further-classification>  
        <further-classification edition="200601120260401B">A61K31/55</further-classification>  
        <further-classification edition="200601120260401B">A61K31/553</further-classification>  
        <further-classification edition="200601120260401B">A61P1/00</further-classification>  
        <further-classification edition="200601120260401B">A61P1/04</further-classification>  
        <further-classification edition="200601120260401B">A61P1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商馬應龍藥業集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYINGLONG PHARMACEUTICAL GROUP CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周道年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, DAONIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付　健民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, JIANMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧　偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘祥俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, XIANGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鴻杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, HONGJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉紅亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HONGYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玉來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YULAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王金娥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王育杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮小路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, XIAOLU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易享炎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, XIANGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種雜芳胺類化合物、其藥物組合物及其應用。具體地，本發明公開了一種如式（I）所示的化合物、其藥學上可接受的鹽、其溶劑合物或其藥學上可接受的鹽的溶劑合物。本發明化合物具有以下一種或多種優點：（1）對5-羥色胺4受體具有優異的激動活性；（2）對5-羥色胺4受體具有良好的選擇激動活性；（3）可顯著降低 hERG通道抑制所致心臟毒性風險；（4）具有優異的腸道組織選擇性與低系統暴露，可降低循環系統安全風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1885" publication-number="202626512"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626512.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鹼性碳酸銅、氧化銅、鹼性碳酸銅之製造方法及氧化銅之製造方法</chinese-title>  
        <english-title>BASIC COPPER CARBONATE, COPPER OXIDE, METHOD FOR PRODUCING BASIC COPPER CARBONATE, AND METHOD FOR PRODUCING COPPER OXIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C01G3/02</main-classification>  
        <further-classification edition="200601120260401B">C01G3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤貴範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中澤美祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZAWA, MIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種鹼性碳酸銅、及氧化銅，該鹼性碳酸銅之利用氮吸附法所得之比表面積為2.9 m&lt;sup&gt;2&lt;/sup&gt;/g以上，該氧化銅之依據JIS Z2512：2012測定之振實密度未達1.1 g/cm&lt;sup&gt;3&lt;/sup&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1886" publication-number="202626813"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626813.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏合劑膜及包括其的光學顯示設備</chinese-title>  
        <english-title>ADHESIVE FILM AND OPTICAL DISPLAY APPARATUS COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F220/18</main-classification>  
        <further-classification edition="200601120260401B">C08F220/28</further-classification>  
        <further-classification edition="200601120260401B">C08F220/58</further-classification>  
        <further-classification edition="200601120260401B">C08F226/10</further-classification>  
        <further-classification edition="200601120260401B">C08F4/02</further-classification>  
        <further-classification edition="201801120260401B">C09J7/10</further-classification>  
        <further-classification edition="201801120260401B">C09J7/30</further-classification>  
        <further-classification edition="201801120260401B">C09J7/38</further-classification>  
        <further-classification edition="202301120260401B">H10K50/84</further-classification>  
        <further-classification edition="202301120260401B">H10K50/86</further-classification>  
        <further-classification edition="202301120260401B">H10K59/40</further-classification>  
        <further-classification edition="202301120260401B">H10K59/80</further-classification>  
        <further-classification edition="202301120260401B">H10K85/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珍泳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, SE MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金一鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, IL JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申東明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, DONG MYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳準基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JUN KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李光奐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GWANG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓智映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JI YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種黏合劑膜和一種包括黏合劑膜的光學顯示設備。黏合劑膜包括具有不同儲存模數的第一區域和第二區域，其中第一區域和第二區域滿足關係式1和關係式2： &lt;br/&gt;0.01 ≤ G'(25°C/B)/G'(25°C/A) ≤ 0.2，            ---（關係式1） &lt;br/&gt;0.1 ≤ G'(60°C/B)/G'(60°C/A) ≤ 0.5，              ---（關係式2） &lt;br/&gt;其中G'(25°C/A)表示第一區域在25°C下的儲存模數，且G'(25°C/B)表示第二區域在25°C下的儲存模數；以及 &lt;br/&gt;G'(60°C/A)表示第一區域在60°C的儲存模數，G'(60°C/B)表示第二區域在60°C的儲存模數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adhesive film and an optical display apparatus including the adhesive film are provided. The adhesive film includes a first region and a second region having different storage moduli, wherein the first region and the second region satisfy Relation 1 and Relation 2: &lt;br/&gt;0.01 ≤ G'(25°C/B)/G'(25°C/A) ≤ 0.2, ---(Relation 1) &lt;br/&gt;0.1 ≤ G'(60°C/B)/G'(60°C/A) ≤ 0.5, ---(Relation 2) &lt;br/&gt;where G'(25°C/A) denotes a storage modulus of the first region at 25 °C and G'(25°C/B) denotes a storage modulus of the second region at 25 °C; and &lt;br/&gt;G'(60°C/A) denotes a storage modulus of the first region at 60 °C and G'(60°C/B) denotes a storage modulus of the second region at 60 °C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一區域</p>  
        <p type="p">200:第二區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1887" publication-number="202627153"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627153.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成結晶矽層的方法及用其製造電子裝置的方法</chinese-title>  
        <english-title>METHOD OF FORMING CRYSTALLINE SILICON LAYER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C23C16/24</main-classification>  
        <further-classification edition="200601120260323B">C23C16/505</further-classification>  
        <further-classification edition="200601120260323B">C23C16/513</further-classification>  
        <further-classification edition="200601120260323B">C01B23/00</further-classification>  
        <further-classification edition="200601120260323B">C01B6/06</further-classification>  
        <further-classification edition="202601120260323B">H10P14/24</further-classification>  
        <further-classification edition="202501120260323B">H10D30/47</further-classification>  
        <further-classification edition="200601120260323B">C30B31/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李龍炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YONG-HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳法鍾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, BEOP-JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種在基板上形成結晶矽層的方法，包含(a)將含矽氣體和含氫氣體噴射至基板上並形成第一電漿的步驟；以及(b)藉由用氬氣、氫氣、氦氣和鍺氣其中一或多者形成第二電漿而於基板上形成結晶矽層的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method of forming a crystalline silicon layer to form a silicon layer on a substrate comprising (a) a step of injecting a silicon-containing gas and a hydrogen-containing gas onto the substrate and forming a first plasma; and (b) a step of forming a crystalline silicon layer on the substrate by forming a second plasma with one or more gases among argon (Ar) gas, hydrogen (H2) gas, helium (He) gas, and germanium (Ge) gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S20、S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1888" publication-number="202627506"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627506.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136187</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試電子元件的處理機</chinese-title>  
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G01R31/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於測試電子元件的處理機。&lt;br/&gt; 本發明的用於測試電子元件的處理機在轉移器的頭部安裝RFID讀取器和用於確認的攝影機中的至少某一個。&lt;br/&gt; 依據本發明，能防止HBM的不良生產。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">261g:夾持器</p>  
        <p type="p">262:垂直移動器</p>  
        <p type="p">263:水平移動器</p>  
        <p type="p">264:RFID讀取器</p>  
        <p type="p">265a:攝影機</p>  
        <p type="p">265b:攝影機</p>  
        <p type="p">265c:攝影機</p>  
        <p type="p">266:照明</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1889" publication-number="202627507"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627507.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試電子元件的處理機</chinese-title>  
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G01R31/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於測試電子元件的處理機。&lt;br/&gt; 本發明的用於測試電子元件的處理機包含：堆疊機機構，為了向測試台供應裝載著複數個需測試的電子元件的客戶托盤或者回收裝載著複數個測試完畢的電子元件的客戶托盤而能收納複數個客戶托盤；移送機構，把位於堆疊機機構的客戶托盤移送到供應位置或者把位於回收位置的客戶托盤移送到堆疊機單元；及，拾取機械手，把複數個需測試的電子元件從被移送機構移動到供應位置的客戶托盤移動到複數個臨時區域或者把位於測試台的複數個測試完畢的電子元件移動到回收位置。&lt;br/&gt; 依據本發明，可提供一種適合測試少量生產的電子元件的低單價的用於測試電子元件的處理機。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:測試台</p>  
        <p type="p">200:真空器</p>  
        <p type="p">210:接頭塊</p>  
        <p type="p">300:重新配置機構</p>  
        <p type="p">400:移動機構</p>  
        <p type="p">500:堆疊機機構</p>  
        <p type="p">510:供應堆疊機</p>  
        <p type="p">520:回收堆疊機</p>  
        <p type="p">600:移送機構</p>  
        <p type="p">610:供應支撐工具</p>  
        <p type="p">620:回收支撐工具</p>  
        <p type="p">630:轉移器</p>  
        <p type="p">700:拾取機械手</p>  
        <p type="p">800:控制器</p>  
        <p type="p">CT:客戶托盤</p>  
        <p type="p">TB:測試板</p>  
        <p type="p">TH:處理機</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1890" publication-number="202628767"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628767.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及顯示面板</chinese-title>  
        <english-title>DISPLAY DEVICE AND DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">H10K59/131</main-classification>  
        <further-classification edition="202301120251001B">H10K59/82</further-classification>  
        <further-classification edition="202301120251001B">H10K77/00</further-classification>  
        <further-classification edition="201601120251001B">G09G3/3225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張圭範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, GYU BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋旼奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, MINGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金會龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HOE YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳銘賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MYEONG HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE-HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種顯示裝置及顯示面板。顯示裝置可包含顯示面板及連接至此顯示面板之多個電路板，其中此顯示面板包含佈置於基板上之電極圖案及連接至該些電路板之接墊，其中此接墊可包含第一接墊，第一接墊設置於電極圖案上，以與電極圖案重疊，且其中此第一接墊可包含多條彼此間隔佈置之多條第一接墊導線。此結構可改善導線集中區域之電性連接及散熱效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a display device and a display panel. The display device may include a display panel and a plurality of circuit boards connected to the display panel. The display panel may include an electrode pattern disposed on a substrate and a pad electrically connected to the circuit boards. The pad may include a first pad arranged on the electrode pattern to overlap the electrode pattern. The first pad may include a plurality of first pad wires spaced apart from one another. This structure may allow for improved electrical connection and heat dissipation in regions where wire concentration is high.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示面板</p>  
        <p type="p">110:電極圖案</p>  
        <p type="p">120:接墊</p>  
        <p type="p">120a:第一接墊</p>  
        <p type="p">120b:第二接墊</p>  
        <p type="p">120c:第三接墊</p>  
        <p type="p">130:導線</p>  
        <p type="p">150:對準標記</p>  
        <p type="p">200:電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1891" publication-number="202626990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組合物、電子零件及電子零件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C09D133/26</main-classification>  
        <further-classification edition="200601120260326B">C08L63/02</further-classification>  
        <further-classification edition="200601120260326B">C08F2/50</further-classification>  
        <further-classification edition="200601120260326B">C08G59/18</further-classification>  
        <further-classification edition="201401120260326B">C09D11/30</further-classification>  
        <further-classification edition="200601120260326B">C09B13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本莉久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, RIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉沢佳史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGISAWA, YOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, TAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長野翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANO, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中智也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本　林野慎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO HAYASHINO, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種硬化性組合物，其1)能夠提昇硬化性，2)能夠降低硬化收縮率，3)能夠提昇所獲得之硬化物之硬度，4)能夠提昇所獲得之硬化物之冷熱循環特性。 &lt;br/&gt;本發明之硬化性組合物包含光硬化性化合物及光聚合起始劑，上述光硬化性化合物包含具有2個以上之(甲基)丙烯醯基且具有脂環式骨架之第1(甲基)丙烯酸酯化合物，硬化性組合物以未達10重量%之含量任意地包含熱硬化性成分，上述光聚合起始劑係(1)包含具有α-胺基苯烷酮骨架且分子量為800以上之光聚合起始劑，或(2)上述光聚合起始劑包含具有α-胺基苯乙酮骨架之光聚合起始劑，且於硬化性組合物100重量%中，上述具有α-胺基苯乙酮骨架之光聚合起始劑之含量為0.5重量%以上3重量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1892" publication-number="202626096"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626096.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高偶極矩之ISVD的調配物</chinese-title>  
        <english-title>FORMULATIONS FOR ISVDS WITH HIGH DIPOLE MOMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K39/395</main-classification>  
        <further-classification edition="200601120260401B">C07K16/24</further-classification>  
        <further-classification edition="200601120260401B">A61K47/18</further-classification>  
        <further-classification edition="200601120260401B">A61K47/02</further-classification>  
        <further-classification edition="200601120260401B">A61K47/10</further-classification>  
        <further-classification edition="200601120260401B">A61P11/06</further-classification>  
        <further-classification edition="200601120260401B">A61P17/04</further-classification>  
        <further-classification edition="200601120260401B">A61P11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　梅蘭尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFMANN, MELANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇亞雷斯　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOARES, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於多肽的醫藥組成物，例如免疫球蛋白單可變結構域醫藥組成物。本發明還關於該等組成物的製備方法、用於儲存該等組成物之方法以及該等組成物之用途。本發明進一步關於該等組成物的劑量單位形式和醫學用途。特別地，本發明關於包含lunsekimig和胺基酸，諸如精胺酸的醫藥組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to pharmaceutical compositions of polypeptides, e.g., immunoglobulin single variable domains. The present invention also relates to methods of preparation, methods for storage and uses of the compositions. The invention further relates to dosage unit forms and medical uses of the compositions. In particular, the present invention relates to pharmaceutical compositions comprising lunsekimig and an amino acid, such as arginine.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1893" publication-number="202625989"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625989.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有移除功能的格耳霍恩氏子宮托</chinese-title>  
        <english-title>GELLHORN PESSARY WITH REMOVAL FEATURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61F6/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商賽可私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAYCO PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUNG, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種格耳霍恩氏（Gellhorn）子宮托 10，包括：主體 11，包括基部 12 和從該基部延伸出的桿部 13；以及指拉件 14，與主體 11 關聯，用於容納使用者的至少一根手指，以便於取出格耳霍恩氏（Gellhorn）子宮托 10，其中，指拉件14 可在打開狀態與保持狀態之間活動，打開狀態便於取出格耳霍恩氏（Gellhorn）子宮托 10，保持狀態使指拉件相對於格耳霍恩氏（Gellhorn）子宮托 10 的桿部 13 保持固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a Gellhorn pessary 10 including a body 11 comprising a base 12 and a stem 13 extending therefrom. A finger-pull 14 is associated with the body 11 and is adapted to receive at least one finger of a user to facilitate removal of the Gellhorn pessary 10. The finger-pull 14 is moveable between an open orientation that facilitates removal of the Gellhorn pessary 10 and a retained orientation in which it is retained relative to the stem 13 of the Gellhorn pessary 10.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:主體</p>  
        <p type="p">12:基部</p>  
        <p type="p">13:桿部</p>  
        <p type="p">14:指拉件</p>  
        <p type="p">15:支撐網</p>  
        <p type="p">16:環</p>  
        <p type="p">19:遠端部分</p>  
        <p type="p">20:凹陷部分</p>  
        <p type="p">24:孔</p>  
        <p type="p">25:狹縫</p>  
        <p type="p">26:突出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1894" publication-number="202626007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於空氣拋光硬牙齒組織之表面的組合物</chinese-title>  
        <english-title>COMPOSITION FOR AIR-POLISHING THE SURFACE OF HARD DENTAL TISSUES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/20</main-classification>  
        <further-classification edition="200601120260401B">A61K8/34</further-classification>  
        <further-classification edition="200601120260401B">A61K8/44</further-classification>  
        <further-classification edition="200601120260401B">A61K8/25</further-classification>  
        <further-classification edition="200601120260401B">A61K8/37</further-classification>  
        <further-classification edition="200601120260401B">A61Q11/00</further-classification>  
        <further-classification edition="200601120260401B">A61C1/08</further-classification>  
        <further-classification edition="200601120260401B">A61C17/022</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商艾龍製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACTEON MANUFACTURING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙泰尼歐　羅曼伯特蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHATAIGNOUX, BERTRAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛瑞　文生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAURAT, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於空氣拋光硬牙齒組織之表面之組合物(1)，其至少包括： &lt;br/&gt;能夠拋光硬牙齒組織之第一磨料粉末，該第一粉末係以介於90%與99.5%之間之質量含量存在於該組合物中，及 &lt;br/&gt;不同於該第一粉末之至少一種抗結塊劑之第二粉末，其包括以介於0.5%與5%之間之質量含量存在於該組合物中且粒度D50介於5 µm與200 µm之間、例如介於10 µm與80 µm之間之至少一種硬脂基富馬酸鈉粉末，至少50%該第二粉末之組成顆粒具有大於100 nm之最小尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a composition (1) for air-polishing the surface of hard dental tissues, comprising at least: &lt;br/&gt;- a first abrasive powder capable of polishing hard dental tissues, the first powder being present in the composition in a mass content comprised between 90% and 99.5%, and &lt;br/&gt;- a second powder of at least one anti-caking agent, different from the first powder, comprising at least one sodium stearyl fumarate powder present, in the composition, in a mass content comprised between 0.5% and 5% and having a particle size D50 comprised between 5 µm and 200 µm, for example between 10 µm and 80 µm, at least 50% of the constituent particles of the second powder having a smallest dimension greater than 100 nm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:空氣拋光組合物</p>  
        <p type="p">10:空氣拋光工具</p>  
        <p type="p">11:噴嘴</p>  
        <p type="p">15:液體</p>  
        <p type="p">D:牙齒</p>  
        <p type="p">d1:距離</p>  
        <p type="p">S:擬去除之物質/沈積物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1895" publication-number="202627002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、清洗完畢的被處理物之製造方法、電子裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C09G1/16</main-classification>  
        <further-classification edition="200601120260317B">C08G69/36</further-classification>  
        <further-classification edition="200601120260317B">C11D1/72</further-classification>  
        <further-classification edition="200601120260317B">C11D7/08</further-classification>  
        <further-classification edition="200601120260317B">C11D3/33</further-classification>  
        <further-classification edition="201801120260317B">C08K3/015</further-classification>  
        <further-classification edition="200601120260317B">C09K3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上村哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIMURA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大内直子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHUCHI, NAOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹下祐太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKESHITA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種組成物，其在適用於包含來自於實施了CMP處理之氧化膜或氮化膜等絕緣膜之親水性表面之被處理物時，粒子去除性及有機物去除性優異。又，提供一種清洗完畢的被處理物之製造方法及電子裝置之製造方法。本發明的組成物為用於對實施了化學機械研磨處理之被處理物進行清洗之組成物，其包含：非離子界面活性劑，具有聚氧亞烷基鏈，親水性親油性平衡值為14～20；及特定化合物（其中，不包括兩性離子化合物），選自由無機酸、胺基醇、有機酸、四級銨化合物及脂肪族多胺組成之群組，上述有機酸具有至少1個選自由羧酸基、膦酸基及磺酸基組成之群組中的基，相對於上述特定化合物的合計含量之上述非離子界面活性劑的含量的質量比為0.1～10000。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1896" publication-number="202627150"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627150.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、修飾基板之製造方法、積層體之製造方法、電子器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C23C16/04</main-classification>  
        <further-classification edition="200601120260331B">C08G77/18</further-classification>  
        <further-classification edition="200601120260331B">C09D5/20</further-classification>  
        <further-classification edition="200601120260331B">C08F2/40</further-classification>  
        <further-classification edition="201801120260331B">C09D7/20</further-classification>  
        <further-classification edition="202601120260331B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下重直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOJU, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧本春樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIMOTO, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袴田旺弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAKAMATA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種組成物，所述組成物能夠形成可抑制產生缺陷且可充分抑制因原子層沉積處理而成膜的被膜。又，本發明提供一種修飾基板之製造方法、積層體之製造方法、及電子器件之製造方法。本發明的組成物用於形成抑制因原子層沉積處理而成膜的被膜，係包含化合物C1和含水溶媒，其中，所述化合物C1具有鍵結或吸附於基板的官能基A、以及聚氧伸烷基結構及甜菜鹼結構中之至少一者即特定結構B1，上述水的含量相對於上述含水溶媒的總質量為10質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1897" publication-number="202626538"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626538.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由多組份玻璃製成的玻璃環以及用於生產所述玻璃環之方法及裝置</chinese-title>  
        <english-title>GLASS RING MADE OF MULTI-COMPONENT GLASS AND METHOD AND DEVICE FOR PRODUCING SAID GLASS RING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C03B19/02</main-classification>  
        <further-classification edition="200601120260401B">C03C3/095</further-classification>  
        <further-classification edition="200601120260401B">H01J37/32</further-classification>  
        <further-classification edition="202601120260401B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商賀利氏石英玻璃有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS QUARZGLAS GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申克　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHENK, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科尼格　馬庫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONIG, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫策爾　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENTZEL, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一個目的是由一多組份玻璃生產近淨幾何環，具體而言具有多於10 mm壁厚度的厚壁環。為此，首先使用一鑄造程序由該多組份玻璃生產一環形坯料，其中由該多組份玻璃之一玻璃熔體製成的一鑄造束經饋送至具有環繞一中心軸線的一環形鑄造腔的一鑄造模具中。撞擊一衝擊區之該鑄造束分流成一右側子流及一左側子流，其中該等子流在該鑄造腔中之一併流區處會聚並填充該鑄造腔至該鑄造腔的高度的至少部分之上。在該玻璃熔體冷卻之後，獲得一環形坯料，該環形坯料進一步經處理成由該多組份玻璃製成的一玻璃環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One object of the invention is the production of near-net geometry rings from a multi-component glass, in particular thick-walled rings with wall thicknesses of more than 10 mm. For this purpose, a ring-shaped blank is first produced from the multi-component glass using a casting process, in which a casting strand made of a glass melt of the multi-component glass is fed into a casting mold with a ring-shaped casting cavity running around a center axis. The casting strand hitting an impact zone diverges into a right-hand substream and a left-hand substream, with the substreams converging at a merging zone in the casting cavity and filling the casting cavity over at least part of its height. After the glass melt cools, a ring-shaped blank is obtained, which is further processed into a glass ring made of the multi-component glass.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鑄造模具</p>  
        <p type="p">1a:鑄造腔</p>  
        <p type="p">2:框架</p>  
        <p type="p">2a,2b:線性單元</p>  
        <p type="p">2c:電可移動接頭</p>  
        <p type="p">3:座標系</p>  
        <p type="p">AA':線</p>  
        <p type="p">x,y,z:空間方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1898" publication-number="202627431"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627431.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260323B">G01K7/02</main-classification>  
        <further-classification edition="200601120260323B">G01K7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上陽子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, YOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木一聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">檢測系統1具備藉由溫度差而產生電動勢之熱電轉換元件2、及處理裝置6。處理裝置6執行：獲取步驟(S1)，其獲取熱電轉換元件2中產生之電動勢之值；及修正步驟，其於因外部氣溫之上升導致溫度差增大之情形時(S2：是(YES))，藉由下述修正式(1)對獲取步驟(S1)中所獲取之電動勢之值進行修正(S3)，且於因外部氣溫之上升導致溫度差減少之情形時(S2：否(NO))，藉由下述修正式(2)對獲取步驟(S1)中所獲取之電動勢之值進行修正(S4)。 &lt;br/&gt;修正式(1)：V&lt;sub&gt;2&lt;/sub&gt;＝V&lt;sub&gt;1&lt;/sub&gt;－S×(T&lt;sub&gt;A&lt;/sub&gt;－T&lt;sub&gt;A0&lt;/sub&gt;) &lt;br/&gt;修正式(2)：V&lt;sub&gt;2&lt;/sub&gt;＝V&lt;sub&gt;1&lt;/sub&gt;＋S×(T&lt;sub&gt;A&lt;/sub&gt;－T&lt;sub&gt;A0&lt;/sub&gt;) &lt;br/&gt;(於上述修正式(1)及上述修正式(2)中，V&lt;sub&gt;1&lt;/sub&gt;表示修正前之電動勢之值。V&lt;sub&gt;2&lt;/sub&gt;表示修正後之電動勢之值。S表示熱電轉換元件2之每存在溫度差1℃之電動勢之值。T&lt;sub&gt;A&lt;/sub&gt;表示外部氣溫之實際測量值。T&lt;sub&gt;A0&lt;/sub&gt;表示外部氣溫之基準值。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3,S4,S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1899" publication-number="202628840"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628840.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有摻雜劑選擇性之矽蝕刻</chinese-title>  
        <english-title>SILICON ETCH WITH DOPANT-TYPE SELECTIVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260320B">H10P50/60</main-classification>  
        <further-classification edition="202601120260320B">H10P50/64</further-classification>  
        <further-classification edition="200601120260320B">C09K13/00</further-classification>  
        <further-classification edition="200601120260320B">C08K5/00</further-classification>  
        <further-classification edition="202601120260320B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐伯　房世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAEKI, FUSAYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>露娜　莫妮卡　珍妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNA, MONICA JANET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋和裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種對於矽，提供帶來因應矽之摻雜劑型的蝕刻速度之蝕刻液組成物，及用以蝕刻具有n型之第1矽區域、與對於摻雜劑型，與前述第1矽區域不同的第2矽區域的表面之方法。 &lt;br/&gt;　　作為本發明的解決手段，蝕刻液組成物帶來對於矽，提供因應矽之摻雜劑型的蝕刻速度。蝕刻液組成物包含鹼、與和鹼不同之添加劑。添加劑具有每1分子為1～6個之碳原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1900" publication-number="202626602"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626602.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機鹽、包括其之阻劑組成物及使用該阻劑組成物的圖案形成方法</chinese-title>  
        <english-title>ORGANIC SALT, RESIST COMPOSITION INCLUDING THE SAME, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07C323/53</main-classification>  
        <further-classification edition="200601120260302B">C07C323/56</further-classification>  
        <further-classification edition="200601120260302B">C07C323/62</further-classification>  
        <further-classification edition="200601120260302B">C07C381/12</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/039</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification>  
        <further-classification edition="200601120260302B">G03F7/32</further-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田雅藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, ARAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻相</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINSANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林圭鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, KYUHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金揆丸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴成桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳廷均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JUNGKYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺元準</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, WONJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種由式1表示之有機鹽、一種包括其之阻劑組成物及一種使用該阻劑組成物的圖案形成方法：&lt;br/&gt; 式1&lt;br/&gt;&lt;img align="absmiddle" height="232px" width="539px" file="ed10060.JPG" alt="ed10060.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; 對於式1中之A&lt;sub&gt;11&lt;/sub&gt;、k11、L&lt;sub&gt;11&lt;/sub&gt;、L&lt;sub&gt;12&lt;/sub&gt;、A&lt;sub&gt;11&lt;/sub&gt;、a12、R&lt;sub&gt;11&lt;/sub&gt;、R&lt;sub&gt;12&lt;/sub&gt;、b11、n11及M&lt;sup&gt;+&lt;/sup&gt;的描述，應參考說明書。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are an organic salt represented by Formula 1, a resist composition including the same, and a pattern formation method using the resist composition:&lt;br/&gt; Formula 1&lt;br/&gt;&lt;img align="absmiddle" height="231px" width="546px" file="ed10061.JPG" alt="ed10061.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; For descriptions of A&lt;sub&gt;11&lt;/sub&gt;, k11, L&lt;sub&gt;11&lt;/sub&gt;, L&lt;sub&gt;12&lt;/sub&gt;, A&lt;sub&gt;11&lt;/sub&gt;, a12, R&lt;sub&gt;11&lt;/sub&gt;, R&lt;sub&gt;12&lt;/sub&gt;, b11, n11 and M&lt;sup&gt;+&lt;/sup&gt; in Formula 1, reference should be made to the specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1901" publication-number="202626871"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626871.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件及聚醯亞胺</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G73/10</main-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="202601120260401B">H10P14/68</further-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅川大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKAWA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田知樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物、硬化上述樹脂組成物而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法之半導體器件之製造方法及包含上述硬化物之半導體器件、以及包含由下述式（A-2）表示之重複單元及由式（A-3）表示之重複單元之聚醯亞胺，前述樹脂組成物包含聚醯亞胺，前述聚醯亞胺具有含有選自由羥基、烷氧基、羧基及酯基組成之群組中的至少1個基之結構作為來源於二胺之結構。 &lt;br/&gt;&lt;img align="absmiddle" height="156px" width="513px" file="ed10073.JPG" alt="ed10073.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1902" publication-number="202626749"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626749.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136388</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中空樹脂粒子、其製造方法、及其用途</chinese-title>  
        <english-title>HOLLOW RESIN PARTICLE, METHOD FOR MANUFACTURING THE SAME, AND USE OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08F2/18</main-classification>  
        <further-classification edition="200601120260325B">C08F2/44</further-classification>  
        <further-classification edition="200601120260325B">C08F212/08</further-classification>  
        <further-classification edition="200601120260325B">C08F212/12</further-classification>  
        <further-classification edition="200601120260325B">C08F212/36</further-classification>  
        <further-classification edition="200601120260325B">C08F290/06</further-classification>  
        <further-classification edition="200601120260325B">C08L25/00</further-classification>  
        <further-classification edition="200601120260325B">C08L71/12</further-classification>  
        <further-classification edition="200601120260325B">C08L101/00</further-classification>  
        <further-classification edition="200601120260325B">B01J13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化成品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI KASEI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安達彩花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDACHI, AYAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之實施方式之中空樹脂粒子，其係具有殼部及由該殼部所包圍之中空部分者，並且，該殼部包含具有特定之醚結構之聚合物（P1）、及非交聯性聚合物（P2），且將上述中空樹脂粒子10 wt%、聚苯醚樹脂、交聯劑、及聚合起始劑混合並硬化而得之厚度為1.0 mm之硬化物的厚度方向之全光線穿透率為20.00%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The hollow resin particle according to an embodiment of the present invention has a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion comprises a polymer (P1) having a specific ether structure and a non-crosslinkable polymer (P2), and the total light transmittance in the thickness direction of a cured product having a thickness of 1.0 mm, obtained by mixing and curing 10 wt% of the hollow resin particles, a polyphenylene ether resin, a cross-linking agent, and a polymerization initiator, is 20.00% or less.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1903" publication-number="202626558"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626558.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136396</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螢光體、其製造方法、發光裝置、圖像顯示裝置、顏料及紫外線吸收劑</chinese-title>  
        <english-title>PHOSPHOR, METHOD FOR PRODUCING SAME, LIGHTEMITTING DEVICE, IMAGE DISPLAY DEVICE, PIGMENT, AND ULTRAVIOLET ABSORBENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C04B35/453</main-classification>  
        <further-classification edition="202501120260326B">H10H20/823</further-classification>  
        <further-classification edition="202501120260326B">H10H20/825</further-classification>  
        <further-classification edition="200601120260326B">C09K11/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人物質　材料研究機構</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL INSTITUTE FOR MATERIALS SCIENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田隆史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>広崎尚登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSAKI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舟橋司朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNAHASHI, SHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即使在與小於450nm之LED組合的情形中發光強度亦高的螢光體、其製造方法、使用其之發光裝置、圖像顯示裝置、顏料及紫外線吸收劑。 &lt;br/&gt;本發明的螢光體包含下述無機結晶或無機化合物： &lt;br/&gt;該無機結晶含有Li元素、A元素、D元素、E元素及X元素(A係選自由Mg、Ca、Sr、Ba所組成之群中的至少一種元素，D係選自由Si、Ge、Sn、Ti，Zr所組成之群中的至少一種元素，E係選自由B、Al、Ga、In、Sc所組成之群中的至少一種元素，X係至少包含O的元素)，並且具有與Ba&lt;sub&gt;2&lt;/sub&gt;Li&lt;sub&gt;1&lt;/sub&gt;Al&lt;sub&gt;1&lt;/sub&gt;Si&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;8&lt;/sub&gt;所示之結晶之相同結晶結構，或， &lt;br/&gt;該無機化合物係在該固溶體結晶中固溶有M元素(M係選自由Mn、Ce、Pr、Nd、Sm、Eu、Tb、Dy、Yb所組成之群中的至少一種元素)而成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a phosphor having high light-emitting intensity even when combined with an LED of 450 nm or lower; a method for producing the phosphor; and a light-emitting device, an image display device, a pigment, and an ultraviolet absorbent using the phosphor. &lt;br/&gt;A phosphor of the present invention comprises an inorganic compound in which an M element (M is at least one element selected from the group consisting of Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, and Yb) is incorporated (as a solid solution) into an inorganic crystal having the same crystal structure as the crystal represented by Ba&lt;sub&gt;2&lt;/sub&gt;Li&lt;sub&gt;1&lt;/sub&gt;Al&lt;sub&gt;1&lt;/sub&gt;Si&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;8&lt;/sub&gt;, or, a solid solution crystal thereof, wherein the inorganic crystal or the solid solution crystal comprises at least an Li element, an A element, a D element, an E element, and an X element (A is at least one element selected from the group consisting of Mg, Ca, Sr, and Ba; D is at least one element selected from the group consisting of Si, Ge, Sn, Ti, and Zr; E is at least one element selected from the group consisting of B, Al, Ga, In, and Sc; and X is at least one element including O).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1904" publication-number="202628286"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628286.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種用於操作雷射設備和用於產生靶材電漿，並利用其進行微結構製造的方法，以及相應配置的雷射設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01S3/03</main-classification>  
        <further-classification edition="200601120260327B">H01S3/097</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEY, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史托普　拉爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOLP, LARS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種雷射設備 (1) 的操作方法 (18)。該方法在軟啟動階段 (15)施加電極 (4) 降低的射頻功率，以在氣態雷射介質 (3) 中產生自由電子，以便於電漿點火 (17)。隨後系統切換到連續運轉 (16)，此時電極 (4) 被施加較大的射頻功率。利用如此產生的雷射光束 (9)可以產生靶材 (11) 電漿，進而產生二次輻射 (12)。該二次輻射 (12) 可用於製造微晶片 (13) 或半導體中間產物 (13)。本發明也有關一種相應配置的雷射設備 (1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:軟啟動脈衝</p>  
        <p type="p">15:軟啟動階段</p>  
        <p type="p">16:連續運轉模式</p>  
        <p type="p">17:電漿點火</p>  
        <p type="p">P:功率</p>  
        <p type="p">P1:第一輸入功率</p>  
        <p type="p">P2:第二輸入功率</p>  
        <p type="p">R1:第一反射功率</p>  
        <p type="p">R2:第二反射功率</p>  
        <p type="p">t:時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1905" publication-number="202627322"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627322.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運動導引裝置</chinese-title>  
        <english-title>MOTION GUIDE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">F16C29/06</main-classification>  
        <further-classification edition="200601120260330B">F16C41/00</further-classification>  
        <further-classification edition="200601120260330B">F16C33/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＨＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋正和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大岡輝明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOKA, TERUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山越龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKOSHI, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川友貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮原莊志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAHARA, SOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田光真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, MITSUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種運動導引裝置，其係在循環路徑中交錯配置2行滾珠，而可謀求滑塊之小型化且提高保持器之耐久性。在包含滾動路徑(C1)、返回路徑(C2)、轉向路徑(C3)的循環路徑，其設有交錯配置2行滾珠(6)的至少1個保持器(71)。相對於包含滾動路徑(C1)及返回路徑(C2)的平面，自垂直方向觀察(參照圖7(a))，在轉向路徑(C3)之滾動路徑(C1)側之端部及返回路徑(C2)側之端部，第1行滾珠用的第1轉向路徑(21)被配置在較第2行滾珠用的第2轉向路徑(22)靠外側，並且在轉向路徑(C3)之頂部，第1轉向路徑(21)被配置在較第2轉向路徑(22)靠內側。保持器(71)具備有：2行滾珠(6)之間的中心帶(72)、及2行滾珠(6)之外側的2條側帶(73)。自保持器(71)之長度方向觀察時，2行滾珠(6)係分開狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a motion guide device with two columns of balls arranged within a circulation path in a staggered form for achieving compactness of a carriage and durability of a retainer. The circulation path, which comprises a rolling path (C1), a return path (C2) and a turn path (C3), is provided with at least one retainer (71) with two columns of balls (6) arranged therein in a staggered form. Viewing from a vertical direction relative to a plane consisting of the rolling path (C1) and the return path (C2) (referring to Fig. 7(a)), at an end of the rolling path (C1) of the turn path (C3) and an end of the return path (C2), a first turn path (21) for a first column of balls is arranged toward the outside more than a second turn path (22) for a second column of balls, and at a top of the turn path (C3), the first turn path (21) is arranged toward the inside more than the second turn path (22). The retainer (71) comprises a center band (72) between the two columns of balls (6), and two side bands (73) outside of the two columns of balls (6). Viewing from a longitudinal direction of the retainer (71), the two columns of balls (6) are separated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:滾珠</p>  
        <p type="p">71:保持器</p>  
        <p type="p">72:中心帶</p>  
        <p type="p">72a:傾斜部</p>  
        <p type="p">73:側帶</p>  
        <p type="p">74:第1滾珠收容部</p>  
        <p type="p">75:第2滾珠收容部</p>  
        <p type="p">76:第1行滾珠間之第1中間間隔件</p>  
        <p type="p">76a:球面狀凹部</p>  
        <p type="p">76b:平坦面</p>  
        <p type="p">76c:澆口位置</p>  
        <p type="p">77:第2行滾珠間之第2中間間隔件</p>  
        <p type="p">77a:球面狀凹部</p>  
        <p type="p">77b:平坦面</p>  
        <p type="p">77c:澆口位置</p>  
        <p type="p">78:第1端部間隔件</p>  
        <p type="p">78a:球面狀凹部</p>  
        <p type="p">79:第2端部間隔件</p>  
        <p type="p">79a:球面狀凹部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1906" publication-number="202627237"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627237.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電解鍍覆裝置的金屬離子供給系統及金屬離子供給方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C25D17/00</main-classification>  
        <further-classification edition="200601120260401B">C25D21/14</further-classification>  
        <further-classification edition="200601120260401B">C25D21/18</further-classification>  
        <further-classification edition="200601120260401B">C25D7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種金屬離子供給系統，可抑制鍍覆液循環室內鍍覆液稀釋。其用於電鍍裝置，具備：陽極室、設置在陽極室內的陽極、陰極室、設置在陰極室內的陰極、配置在陽極室與陰極室之間的鍍覆液循環室、配置在陽極室與鍍覆液循環室之間的第1隔膜及配置在陰極室與鍍覆液循環室之間的第2隔膜，鍍覆液循環室具備用於將鍍覆液向電鍍裝置排出的出口和用於將鍍覆液從電鍍裝置接收的入口以使鍍覆液能夠循環，第2隔膜的水的擴散滲透速度大於第1隔膜的水的擴散滲透速度，陽極室內填充有陽極電解液，陽極電解液含有與陽極含有的金屬相同的金屬的離子，陰極室內填充有陰極電解液，陰極電解液的滲透壓莫耳濃度高於鍍覆液循環室內的鍍覆液的滲透壓莫耳濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:陽極室</p>  
        <p type="p">1200:鍍覆液循環室</p>  
        <p type="p">1210:出口</p>  
        <p type="p">1220:入口</p>  
        <p type="p">1300:陰極室</p>  
        <p type="p">1400:第1隔膜</p>  
        <p type="p">1500:第2隔膜</p>  
        <p type="p">1700:陰極</p>  
        <p type="p">1800:散氣管</p>  
        <p type="p">1850:氣體</p>  
        <p type="p">1900:外部電源</p>  
        <p type="p">1600:陽極</p>  
        <p type="p">2000:金屬離子供給系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1907" publication-number="202629008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136497</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基板及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/60</main-classification>  
        <further-classification edition="200601120260323B">C09J9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商太陽控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋勉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川田早良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWADA, SARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今野開</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONNO, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種配線基板，該配線基板即便在實施了回焊處理之情況下仍能抑制翹曲，並且亦能抑制設成覆蓋一部分配線層之硬化物層產生裂痕。&lt;br/&gt; [解決手段]一種配線基板，其特徵在於具備：基板；配線層，其係設於前述基板之至少一個主面上；硬化物層，其係設成覆蓋一部分前述配線層；補強構件，其係隔著接著劑層設於前述硬化物層上；並且，前述補強構件具有矩形形狀，該矩形形狀具備露出半導體元件安裝區域之開口部；且在25℃之溫度條件下，令前述硬化物層之彈性模數為M&lt;sub&gt;sr&lt;/sub&gt;(MPa)，令前述接著劑層之彈性模數為M&lt;sub&gt;ad&lt;/sub&gt;(MPa)，且令前述補強構件之彈性模數為M&lt;sub&gt;st&lt;/sub&gt;(MPa)時，滿足下述式之關係：M&lt;sub&gt;st&lt;/sub&gt;＞M&lt;sub&gt;sr&lt;/sub&gt;＞M&lt;sub&gt;ad&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:配線基板</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:配線層</p>  
        <p type="p">30A,30B:硬化物層</p>  
        <p type="p">40:補強構件</p>  
        <p type="p">50:接著劑層</p>  
        <p type="p">401:半導體元件安裝區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1908" publication-number="202627405"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627405.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統、相對位置算出方法及處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260205B">G01B11/00</main-classification>  
        <further-classification edition="201701120260205B">G06T7/70</further-classification>  
        <further-classification edition="200601120260205B">G06T1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">處理裝置100具備：相機；穿透窗，由相機可以拍攝的光可穿透的穿透構件所構成；及運算裝置6，依據以相機所拍攝的包含至少2個拍攝對象物的圖像，進行預定的運算處理，至少2個拍攝對象物是存在於攝影距離不同的位置，穿透窗是構成為當相機透過該穿透窗拍攝至少2個拍攝對象物時，拍攝至少2個拍攝對象物皆已聚焦的1個圖像，運算裝置6作為預定的運算處理，依據由相機所拍攝的包含至少2個拍攝對象物的圖像，來算出第1構件P1及第2構件P2的相對位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:上方辨識光學單元</p>  
        <p type="p">3:頭部</p>  
        <p type="p">4:載台</p>  
        <p type="p">5:零件供給部</p>  
        <p type="p">6:運算裝置</p>  
        <p type="p">7:裝置架台</p>  
        <p type="p">15:第1穿透窗</p>  
        <p type="p">15A:第1穿透區域</p>  
        <p type="p">15B:第2穿透區域</p>  
        <p type="p">21:上方辨識相機單元</p>  
        <p type="p">22:構件</p>  
        <p type="p">31:零件保持部</p>  
        <p type="p">41:零件保持部</p>  
        <p type="p">42:載台傾斜補正部</p>  
        <p type="p">43:載台水平驅動部</p>  
        <p type="p">71:第1架台</p>  
        <p type="p">72:第2架台</p>  
        <p type="p">73:頭部水平移動導引件</p>  
        <p type="p">100:處理裝置</p>  
        <p type="p">M1:第1構件基準標記</p>  
        <p type="p">M2:第2構件基準標記</p>  
        <p type="p">M3:穿透窗標記</p>  
        <p type="p">P1:第1構件</p>  
        <p type="p">P2:第2構件</p>  
        <p type="p">X:X軸</p>  
        <p type="p">Y:Y軸</p>  
        <p type="p">Z:Z軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1909" publication-number="202627334"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627334.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥、操作隔膜閥之方法、及致動器</chinese-title>  
        <english-title>VALVE, METHOD OF OPERATING DIAPHRAGM VALVE, AND ACTUATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">F16K7/16</main-classification>  
        <further-classification edition="200601120260323B">F16K27/02</further-classification>  
        <further-classification edition="200601120260323B">F16K31/122</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海明格　漢內洛爾　阿佐拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEMMINGER, HANNELORE AZORA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種隔膜閥。閥體包括一閥通道，此閥通道包括一入口通道及一出口通道。此隔膜閥更包括鄰近於此閥通道之一閥座。此閥亦包括可移動以與此閥座分離或接觸之一隔膜。另外，此閥包括耦接至此隔膜之一活塞及耦接至此活塞之一撓曲總成。一輸入力可在一第一方向上施加至此活塞以輸出一合力，使得當此隔膜處於一常閉位置時，此合力將此隔膜移動至一開啟位置，且當此隔膜處於一常開位置時，此合力將此隔膜移動至一關閉位置。在一些實例中，此合力可在一第二方向上輸出，此第二方向可與此輸入力相反或垂直。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diaphragm valve is provided. The valve body includes a valve channel including an inlet channel and an outlet channel. The diaphragm valve further includes a valve seat adjacent to the valve channel. The valve also includes a diaphragm movable to separate from or contact with the valve seat. Further, the valve includes a piston coupled to the diaphragm and a flexure assembly coupled to the piston. An input force maybe applied to the piston in a first direction to output a resultant force such that when the diaphragm is in a normally closed position, the resultant force moves the diaphragm to an open position, and when the diaphragm is in a normally open position, the resultant force moves the diaphragm to a closed position. In some examples, the resultant force may be output in a second direction that may be opposite or perpendicular to the input force.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:隔膜閥</p>  
        <p type="p">102:閥體</p>  
        <p type="p">104:活塞</p>  
        <p type="p">106:葉片撓曲件</p>  
        <p type="p">108:可撓性隔膜</p>  
        <p type="p">112:非濕潤表面</p>  
        <p type="p">114:濕潤表面</p>  
        <p type="p">116:上表面</p>  
        <p type="p">118:閥座</p>  
        <p type="p">120:閥通道</p>  
        <p type="p">122:入口通道</p>  
        <p type="p">124:出口通道</p>  
        <p type="p">126:邊緣</p>  
        <p type="p">130:內部空間</p>  
        <p type="p">152:軸線</p>  
        <p type="p">152a:軸線</p>  
        <p type="p">152b:軸線</p>  
        <p type="p">154:軸線</p>  
        <p type="p">162:末端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1910" publication-number="202627767"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627767.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>位姿追蹤裝置及方法</chinese-title>  
        <english-title>POSTURE TRACKING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G06F3/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宛玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WANLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王隋賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SUI-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種位姿追蹤裝置及方法。該裝置擷取一使用者的一眼部影像。該裝置基於該眼部影像，計算一眼部位姿。該裝置擷取該眼部影像中的一反射影像。該裝置基於該反射影像以及該眼部位姿，計算該使用者的一頭部位姿。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A posture tracking apparatus and method are provided. The apparatus captures an eye image of a user. The apparatus calculates an eye posture based on the eye image. The apparatus captures a reflected image from the eye image. The apparatus calculates a head posture of the user based on the reflected image and the eye posture.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:位姿追蹤方法</p>  
        <p type="p">S201~S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1911" publication-number="202628558"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628558.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>後段製程(BEOL)靜態隨機存取記憶體(SRAM)裝置</chinese-title>  
        <english-title>BEOL SRAM DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260330B">H10B10/00</main-classification>  
        <further-classification edition="202501120260330B">H10D84/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛哈　薩烏拉布　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINHA, SAURABH P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苗欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述具有在頂側BEOL（後段製程(back end of line)）金屬層之間形成的記憶體電路的積體電路裝置。該等記憶體電路包括可形成在頂側金屬層之間的空間中的主動區域及源極/汲極。在某些情況下，該等記憶體電路形成在最遠離基材的金屬層之間。該等記憶體電路連接至該等電晶體上方或下方的信號及電力佈線。在各種情況下，該等記憶體電路的該等主動區域由薄通道材料所形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Integrated circuit devices with memory circuits formed between topside BEOL (back end of line) metal layers are described. The memory circuits include active regions and source/drains that can be formed in the spaces between topside metal layers. In certain instances, the memory circuits are formed in between metal layers furthest away from substrate. The memory circuits connect to signal and power routing either above or below the transistors. In various instances, the active regions of the memory circuits are formed by thin channel materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體電路</p>  
        <p type="p">110A:n型主動區域</p>  
        <p type="p">110B:n型主動區域</p>  
        <p type="p">120A:p型主動區域</p>  
        <p type="p">120B:p型主動區域</p>  
        <p type="p">140A:源極/汲極區域</p>  
        <p type="p">140B:源極/汲極區域</p>  
        <p type="p">140C:源極/汲極區域</p>  
        <p type="p">140D:源極/汲極區域</p>  
        <p type="p">140E:源極/汲極區域</p>  
        <p type="p">140F:源極/汲極區域</p>  
        <p type="p">140G:源極/汲極區域</p>  
        <p type="p">140H:源極/汲極區域</p>  
        <p type="p">150A:閘極</p>  
        <p type="p">150B:閘極</p>  
        <p type="p">150C:閘極</p>  
        <p type="p">150D:閘極</p>  
        <p type="p">160A:x耦接件</p>  
        <p type="p">160B:x耦接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1912" publication-number="202626465"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626465.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作業裝置以及搬入搬出裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">B65G47/52</main-classification>  
        <further-classification edition="200601120260330B">B65G47/90</further-classification>  
        <further-classification edition="200601120260330B">B66F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商平田機工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木健陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, YASUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田恭朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, YASUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東條拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOJO, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關作業裝置以及搬入搬出裝置。以比較簡單的結構實現高精度的搬出搬入。本發明的作業裝置具備：搬入搬出機構，用於進行基板的搬入搬出；以及一個以上的移動機構，用於使所述搬入搬出機構移動，其中，所述搬入搬出機構具備：基板支承部件，以能夠支承所述基板的方式沿搬入搬出方向延伸設置；進退機構，使基板支承部件在搬入搬出方向上進退；基板輸送機構，能夠在搬入搬出方向上輸送基板；以及升降機構，使基板輸送機構升降，進退機構具備：基端部支承部件，支承基板支承部件的基端部；以及動力源，產生用於使基端部支承部件在搬入搬出方向上移動的動力，藉由升降機構使基板輸送機構升降，在基板支承部件與基板輸送機構之間進行基板的交接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:作業裝置</p>  
        <p type="p">2:收納容器供給機構</p>  
        <p type="p">3:輸送作業單元</p>  
        <p type="p">7:收納容器</p>  
        <p type="p">8:台車</p>  
        <p type="p">9:控制單元</p>  
        <p type="p">10:外裝面板</p>  
        <p type="p">201:搬入搬出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1913" publication-number="202628683"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628683.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>BEOL電力開關裝置</chinese-title>  
        <english-title>BEOL POWER SWITCH DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">H10D84/83</main-classification>  
        <further-classification edition="202501120260401B">H10D89/10</further-classification>  
        <further-classification edition="202501120260401B">H10D64/27</further-classification>  
        <further-classification edition="202601120260401B">H10W20/43</further-classification>  
        <further-classification edition="202601120260401B">H10W20/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苗欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木伸吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛哈　薩烏拉布　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINHA, SAURABH P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述具有在頂側BEOL（後段製程(back end of line)）金屬層之間形成的電力開關電路的積體電路裝置。電力開關電路包括可形成在頂側金屬層之間的空間中的主動區域及源極/汲極。在某些情況下，電力開關電路形成在最遠離基材的金屬層之間。電力開關電路連接至電晶體上方或下方的控制信號及電力佈線。在各種情況下，電力開關電路的主動區域由薄通道材料形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Integrated circuit devices with power switch circuits formed between topside BEOL (back end of line) metal layers are described. The power switch circuits include active regions and source/drains that can be formed in the spaces between topside metal layers. In certain instances, the power switch circuits are formed in between metal layers furthest away from substrate. The power switch circuits connect to control signal and power routing either above or below the transistors. In various instances, the active regions of the power switch circuits are formed by thin channel materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">112A~112D:佈線</p>  
        <p type="p">120:頂側金屬層</p>  
        <p type="p">122A~122D:佈線</p>  
        <p type="p">150:電力開關電路</p>  
        <p type="p">160:主動區域</p>  
        <p type="p">180:源極</p>  
        <p type="p">185:通孔</p>  
        <p type="p">190:汲極</p>  
        <p type="p">195:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1914" publication-number="202626763"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626763.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件及聚醯亞胺</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F283/04</further-classification>  
        <further-classification edition="200601120260401B">C08F290/14</further-classification>  
        <further-classification edition="200601120260401B">C08G73/10</further-classification>  
        <further-classification edition="200601120260401B">C08G73/12</further-classification>  
        <further-classification edition="200601120260401B">C08L79/08</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">B32B15/08</further-classification>  
        <further-classification edition="202601120260401B">H10P14/68</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野崎敦靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOZAKI, ATSUYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾田和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOTA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樹脂組成物、硬化上述組成物而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體器件及其製造方法、以及新型聚醯亞胺，前述樹脂組成物包含具有由下述式（A-1）表示之結構之樹脂。 &lt;br/&gt;&lt;img align="absmiddle" height="166px" width="372px" file="ed10091.JPG" alt="ed10091.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1915" publication-number="202628013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬幣處理裝置</chinese-title>  
        <english-title>COIN PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260225B">G07D3/06</main-classification>  
        <further-classification edition="200601120260225B">G07D3/12</further-classification>  
        <further-classification edition="201901120260225B">G07D11/16</further-classification>  
        <further-classification edition="201901120260225B">G07D11/18</further-classification>  
        <further-classification edition="201901120260225B">G07D11/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本金錢機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村文秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, FUMIHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種硬幣處理裝置（100），其具備：接收並1個1個地送出硬幣用之收發部（110）；以及一邊從收發部1個1個地接收硬幣並使硬幣沿著圓弧移動，一邊判斷硬幣或金幣的種類並誘導至各個種類的通路之選別部（120）。收發部為包括設置於硬幣的出口部分並將硬幣誘導到外側用之誘導構件（114X）。選別部為包括第1槓桿（151），其為位於比誘導構件還更靠近硬幣的搬運方向中之上游側並施加將硬幣推回到選別部的外側之方向的附勢力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a coin processing device (100), which comprises a handling unit (110) for receiving coins and sending them out one by one, and a sorting unit (120) for receiving coins one by one from the handling unit, determining the type of coin or medal while moving the coins along an arc, and guiding them to a path for each type. The handling unit comprises a guide member (114X) provided at the coin outlet for guiding the coins outward. The sorting unit comprises a first lever (151) located upstream of the guide member in the coin transport direction and biased in a direction to push the coins back outward from the sorting unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:硬幣處理裝置</p>  
        <p type="p">109:識別選別部</p>  
        <p type="p">110:收發部</p>  
        <p type="p">111:基座</p>  
        <p type="p">112:側壁</p>  
        <p type="p">113X:孔</p>  
        <p type="p">114:導引銷</p>  
        <p type="p">114X:導引銷</p>  
        <p type="p">117:排出槓桿</p>  
        <p type="p">120:選別部</p>  
        <p type="p">121:搬運旋轉基座</p>  
        <p type="p">122:側壁</p>  
        <p type="p">123:搬運旋轉體</p>  
        <p type="p">123X:搬運銷</p>  
        <p type="p">129:導引槓桿</p>  
        <p type="p">151:第1槓桿</p>  
        <p type="p">151X:轉動軸</p>  
        <p type="p">151Y:槓桿本體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1916" publication-number="202628624"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628624.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氮化鎵電晶體之形成</chinese-title>  
        <english-title>GALLIUM NITRIDE TRANSISTOR FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260317B">H10D30/47</main-classification>  
        <further-classification edition="202601120260317B">H10P10/00</further-classification>  
        <further-classification edition="202501120260317B">H10D62/824</further-classification>  
        <further-classification edition="200601120260317B">H03F3/195</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得斯　邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETERS, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾庫里馬龍　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL KHOURY MAROUN, MICHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">形成電晶體結構的方法使用現有的氮化鎵形成製程來形成晶粒，然後將該等晶粒重組為較大晶圓格式，以賦能使用現有大型晶圓製造工具用於縮放。在一些實施例中，該方法包括藉由將具有氮化鎵(GaN)電晶體結構的晶粒接合到載體晶圓來形成重組晶圓，並將該重組晶圓與具有矽基電晶體控制結構的矽晶圓混合接合。該等晶粒可包括形成於例如矽基板、碳化矽基板或藍寶石基板上的高電子遷移率電晶體(HEMT)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming transistor structures uses existing gallium nitride formation processes to form dies that are then reconstituted into a larger wafer format to enable the use of existing large wafer manufacturing tooling for scaling. In some embodiments, the method comprises forming a reconstituted wafer by bonding dies having gallium nitride (GaN) transistor structures to a carrier wafer and hybrid bonding the reconstituted wafer to a silicon wafer having silicon-based transistor control structures. The dies may include high electron mobility transistors (HEMTs) formed on, for example, a silicon substrate, a silicon carbide substrate, or a sapphire substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">204:基板</p>  
        <p type="p">206:緩衝層</p>  
        <p type="p">208:通道層</p>  
        <p type="p">210:阻障層</p>  
        <p type="p">602:材料</p>  
        <p type="p">802:源極/汲極</p>  
        <p type="p">804:源極/汲極</p>  
        <p type="p">902:介電材料</p>  
        <p type="p">904:層</p>  
        <p type="p">1002:觸點</p>  
        <p type="p">1004:閘極觸點</p>  
        <p type="p">1102:矽晶圓</p>  
        <p type="p">1104:介電層</p>  
        <p type="p">1106:接合層</p>  
        <p type="p">1108:結構</p>  
        <p type="p">1110:觸點</p>  
        <p type="p">1112:觸點</p>  
        <p type="p">1202:接合晶圓</p>  
        <p type="p">1500:視圖</p>  
        <p type="p">1502:觸點</p>  
        <p type="p">1504:頂面</p>  
        <p type="p">1506:背面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1917" publication-number="202626764"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626764.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性元件、印刷線路板及印刷線路板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">C08F283/06</further-classification>  
        <further-classification edition="200601120260401B">C08F290/00</further-classification>  
        <further-classification edition="200601120260401B">C08K3/22</further-classification>  
        <further-classification edition="200601120260401B">C08K3/36</further-classification>  
        <further-classification edition="200601120260401B">C08K5/372</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification>  
        <further-classification edition="200601120260401B">C08L83/04</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/075</further-classification>  
        <further-classification edition="200601120260401B">G03F7/09</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部宏平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪岡諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKIOKA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下直輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之永久抗蝕劑用之感光性樹脂組成物含有（A）酸改質含乙烯基樹脂、（B）光聚合性化合物、（C）光聚合起始劑、（D）無機填料及（E）矽酮化合物，（E）矽酮化合物為具有選自由乙烯性不飽和基、烷基及芳基組成的組中之至少一種第1基和選自由烷氧基及矽烷醇基組成的組中之至少一種第2基之化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:感光性元件</p>  
        <p type="p">10:支撐膜</p>  
        <p type="p">20:感光層</p>  
        <p type="p">30:保護膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1918" publication-number="202629009"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629009.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其製造方法</chinese-title>  
        <english-title>PACKAGE STRUCTURES AND MANUFACTURING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W70/60</main-classification>  
        <further-classification edition="202601120260302B">H10W70/69</further-classification>  
        <further-classification edition="202601120260302B">H10W74/10</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李孟燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MENG-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許立翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, LI-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇安治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, AN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述封裝結構及其製造方法。封裝結構包括基底、中介結構、第一半導體結構和第二半導體結構。基底包括封裝基板單元和覆蓋封裝基板單元側壁的絕緣材料。中介結構設置在基底上。中介結構包括導電柱和側向包覆導電柱的包封材料。第一半導體結構設置在基底上並埋在包封材料中。第二半導體結構設置在中介結構上方並通過中介結構與第一半導體結構電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure and manufacturing methods thereof are described. The package structure includes a substrate, an intermediary structure, a first semiconductor structure and a second semiconductor structure. The substrate includes a package substrate unit and an insulating material covering sidewalls of the package substate unit. The intermediary structure is disposed on the substrate. The intermediary structure includes conductive pillars and an encapsulating material laterally wrapping the conductive pillars. The first semiconductor structure is disposed on the substrate and embedded in the encapsulating material. The second semiconductor structure is disposed over the intermediary structure and electrically connected with the first semiconductor structure through the intermediary structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝基板單元</p>  
        <p type="p">C1:載體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1919" publication-number="202627425"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627425.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器配置及監測技術設施狀態的方法</chinese-title>  
        <english-title>A SENSOR ARRANGEMENT AND A METHOD FOR MONITORING A STATUS OF A TECHNICAL FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G01H3/10</main-classification>  
        <further-classification edition="200601120260323B">G01H11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列支敦斯登商英飛康股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INFICON AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫維契柯　伊格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUVYCHKO, IGOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉皮多特　馬丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAPIDOT, MATAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於監測技術設施狀態的感測器配置及方法，此感測器配置包含一機械式致動器、至少一個聲音振動感測器及一操作地連接至聲音振動感測器之處理單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sensor arrangement and a method for monitoring a status of a technical facility, the sensor arrangement comprising a mechanical actuator, at least one acoustic vibration sensor and a processing unit operationally connected to the acoustic vibration sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1920" publication-number="202626319"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626319.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自樹脂去除致臭物質的方法</chinese-title>  
        <english-title>METHOD OF REMOVING ODOR-CAUSING SUBSTANCES FROM RESIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B29B17/02</main-classification>  
        <further-classification edition="200601120260401B">B29B7/48</further-classification>  
        <further-classification edition="200601120260401B">B29B7/60</further-classification>  
        <further-classification edition="200601120260401B">B29B7/72</further-classification>  
        <further-classification edition="200601120260401B">B29B7/84</further-classification>  
        <further-classification edition="200601120260401B">B29B7/86</further-classification>  
        <further-classification edition="200601120260401B">B29B7/94</further-classification>  
        <further-classification edition="200601120260401B">B01J3/00</further-classification>  
        <further-classification edition="200601120260401B">B01D11/02</further-classification>  
        <further-classification edition="200601120260401B">C08J11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓華思路信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜苑焌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, WON JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUN DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康喆巸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHUL EE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOU JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金雅琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, AH REUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種自樹脂去除致臭物質的方法。該方法包含：導入樹脂與次臨界/超臨界流體至雙螺桿擠出機中；在雙螺桿擠出機中形成經導入的樹脂與亞臨界/超臨界流體的混合物；以及自混合物萃取並去除致臭物質，其中次臨界/超臨界流體為選自醇、丙酮與水之中的一或多者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method of removing odor-causing substances from a resin. The method includes: introducing a resin and a sub/supercritical fluid into a twin-screw extruder; forming a mixture of the introduced resin and sub/supercritical fluid in the twin-screw extruder; and extracting and removing odor-causing substances from the mixture, wherein the sub/supercritical fluid is one or more selected from alcohol, acetone, and water.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:料斗</p>  
        <p type="p">2:幫浦或氣瓶</p>  
        <p type="p">10:雙螺桿擠出機</p>  
        <p type="p">11,12:進料口</p>  
        <p type="p">13:排氣口</p>  
        <p type="p">14:收集器</p>  
        <p type="p">15:幫浦</p>  
        <p type="p">16:排氣罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1921" publication-number="202627849"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627849.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136766</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>指紋註冊系統、指紋註冊方法及智慧卡</chinese-title>  
        <english-title>FINGERPRINT REGISTRATION SYSTEM, FINGERPRINT REGISTRATION METHOD AND SMART CARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260102B">G06F21/32</main-classification>  
        <further-classification edition="202201120260102B">G06V10/12</further-classification>  
        <further-classification edition="202201120260102B">G06V40/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義隆電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃榮壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUNG-SHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澤倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TSE-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡呈新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種指紋註冊系統，用以對一智慧卡進行指紋註冊，該智慧卡具有一第一指紋感測器。該指紋註冊系統包括一讀卡機以及一處理器。該讀卡機是用以讀寫該智慧卡，其中該讀卡機具有一第二指紋感測器，該第二指紋感測器是用以感測使用者的指紋以產生一指紋圖像，且該第二指紋感測器的面積大於該第一指紋感測器的面積。該處理器耦接該讀卡機，根據該指紋圖像產生至少一指紋註冊模板，並經由該讀卡機將該至少一指紋註冊模板寫入該智慧卡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fingerprint registration system for fingerprint registration of a smart card with a first fingerprint sensor. The fingerprint registration system includes a card reader and a processor. The card reader is used to read and write the smart card, wherein the card reader has a second fingerprint sensor, which is used to sense the user's fingerprint to generate a fingerprint image, and the area of the second fingerprint sensor is larger than the area of the first fingerprint sensor. The processor couples to the card reader, generates at least one fingerprint registration template based on the fingerprint image, and writes at least one fingerprint registration template to the smart card through the card reader.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:指紋註冊系統</p>  
        <p type="p">11:讀卡機</p>  
        <p type="p">111:指紋感測器</p>  
        <p type="p">12:處理器</p>  
        <p type="p">20:智慧卡</p>  
        <p type="p">21:指紋感測器</p>  
        <p type="p">22:處理器</p>  
        <p type="p">23:儲存單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1922" publication-number="202626838"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626838.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G59/32</main-classification>  
        <further-classification edition="200601120260401B">C08G59/50</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification>  
        <further-classification edition="200601120260401B">C08K5/5399</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮谷拓斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATANI, TAKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾貴文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供能夠得到平衡良好地兼具阻燃性、耐熱性、高伸長性的硬化物的樹脂組成物，該樹脂組成物在硬化前具有良好的樹脂流動性。 &lt;br/&gt;　　[解決手段]一種樹脂組成物，其包含(A)2官能以上的環氧樹脂、(B)硬化劑及(C)阻燃劑，其中，(B)成分包含(B-1)苯並噁嗪系硬化劑，(C)成分包含(C-1)具有酚性羥基的磷氮烯化合物，將樹脂組成物中的樹脂成分設為100質量%時，磷的含量為0.6質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1923" publication-number="202626440"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626440.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自主海上水面載具</chinese-title>  
        <english-title>AUTONOMOUS MARITIME SURFACE VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260326B">B63B35/00</main-classification>  
        <further-classification edition="202401120260326B">G05D1/221</further-classification>  
        <further-classification edition="200601120260326B">G01C21/20</further-classification>  
        <further-classification edition="201701120260326B">G06T7/593</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商薩羅尼克科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARONIC TECHNOLOGIES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾特卡　維布哈夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALTEKAR, VIBHAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯坎德拉　亞伯拉罕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKANDERA, ABRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里茲卡拉　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIZKALLA, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加爾朱洛　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARGIULO, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴伊　阿迪提亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAI, ADITYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基特森　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITSON, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭格　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福克斯　拉比諾維茨　約瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX-RABINOVITZ, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅里曼　雅各布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREEMAN, JACOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆罕默德　賈韋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAMED, JAVED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德賽　里希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESAI, RISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭伯特　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMBERT, DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘寧頓　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENNINGTON, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康利　理查德　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMLEY, RICHARD ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自主海上水面載具（AMSV）包括被動遙測系統且不包括或不操作任何船載主動遙測系統。被動遙測系統包括立體視覺系統。AMSV進一步包括：控制系統，其經組態以基於由被動遙測系統提供的資料而產生控制訊號；及運轉系統，其經組態以例如在AMSV正在水體上或水體中操作時回應於由控制系統產生的控制訊號而進行使AMSV移動或將其定向中之至少一者。在一些實施方式中，控制訊號不基於由AMSV上的任何主動遙測系統提供的任何資料。AMSV可自身自主地移動及/或定向，亦即，無需接收及/或利用來自其他載具及/或來自不在AMSV上之計算裝置或系統的任何控制訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An autonomous maritime surface vehicle (AMSV) includes a passive remote sensing system and excludes or does not operate any on-board active remote sensing system. The passive remote sensing system includes a stereovision system. The AMSV further includes a control system configured to generate a control signal based on data provided by the passive remote sensing system, and a locomotion system configured to at least one of move or orient the AMSV, e.g., while the AMSV is operating on or in a body of water, responsive to the control signal generated by the control system. In some implementations, the control signal is not based on any data provided by any active remote sensing system on-board the AMSV. The AMSV may move and/or orient itself autonomously, that is, without receiving and/or utilizing any control signals from other vehicles and/or from computing devices or systems which are not on-board the AMSV.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:海上環境/海洋</p>  
        <p type="p">14:衛星</p>  
        <p type="p">18:行動控制系統</p>  
        <p type="p">20a~20e:自主海上水面載具</p>  
        <p type="p">22b:目標船舶</p>  
        <p type="p">24:軍事船舶</p>  
        <p type="p">26a~26g:AMSV</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1924" publication-number="202627491"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627491.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用經修改之射頻測試器的電路板上之高速數位測試</chinese-title>  
        <english-title>HIGH-SPEED DIGITAL TESTING ON CIRCUIT BOARDS USING MODIFIED RF TESTERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G01R1/067</main-classification>  
        <further-classification edition="200601120260401B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｒ＆Ｄ電路公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>R&amp;D CIRCUITS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商精確邏輯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACCULOGIC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗尼崔瓦拉　奎德　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURNITUREWALA, QUAID JOHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HENRY WAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉斯羅普　馬修　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LATHROP, MATTHEW MACNEILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪赫柯第　卡里姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEHKORDI, KARIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉斯基夫　博格丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARASCHIV, BOGDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶　詠黎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, WING LAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余　幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　萬勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WAN SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　傑瑞米　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JEREMY NICHOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在各項實施例中，一種方法包含藉由一測試探針模組，相對於一受測裝置之一位置定位一探頭，其中該探頭及該測試探針模組係予以包括在一測試裝置中，藉由該測試裝置中所包括之一管道鏡，獲取一探頭位置相對於該受測裝置之該位置的一影像，以及藉由該探頭，接觸該受測裝置上之該位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In various embodiments, a method comprises positioning, by a testing probe module, a probe head relative to a location of a device under test, wherein the probe head and the testing probe module are included in a test device, acquiring, by a borescope included in the test device, an image of a probe head location relative to the location of the device under test, and contacting, by the probe head, the location on the device under test.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">702:步驟</p>  
        <p type="p">704:步驟</p>  
        <p type="p">706:步驟</p>  
        <p type="p">708:步驟</p>  
        <p type="p">710:步驟</p>  
        <p type="p">712:步驟</p>  
        <p type="p">714:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1925" publication-number="202627934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減免資源兌換方法、裝置、電子設備、介質和程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">G06Q30/02</main-classification>  
        <further-classification edition="202301120251103B">G06Q30/0601</further-classification>  
        <further-classification edition="202301120251103B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>才華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郜書鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭鈺君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種減免資源兌換方法、裝置、電子設備、介質和程式產品，可用於資料處理領域；該方法包括：確定商品所需的第一減免資源、購買所述商品的第一帳號以及所述第一減免資源所在的第一標識層級；根據所述第一帳號的帳號標識確定所述第一帳號關聯的用戶的身份標識，並根據所述身份標識確定所述用戶在所述第一標識層級持有的各個第二減免資源；確定每個所述第二減免資源兌換成所述第一減免資源的兌換比例，並在各個所述兌換比例中確定第一比例，所述第一比例用於指示小於預設閾值的兌換比例；將所述第一比例對應的第二減免資源兌換成第一減免資源。本發明中，提高了減免資源對用戶留存率的提升效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S102、S103、S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1926" publication-number="202627175"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627175.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由循環沉積製程或熱沉積在基板上沉積金屬氮化物層之方法及形成半導體結構之方法</chinese-title>  
        <english-title>METHODS FOR DEPOSITING METAL NITRIDE LAYERS ON A SUBSTRATE BY CYCLICAL DEPOSITION PROCESSES OR THERMAL DEPOSITION AND METHODS FOR FORMING SEMICONDUCTOR STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C23C16/455</main-classification>  
        <further-classification edition="200601120260323B">C23C16/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼蘇拉　米科　利安德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISULA, MIKKO LEANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德茲拉　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZELAH, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德明斯基　彼德洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEMINSKYI, PETRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　黃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, HOANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅梅羅　帕特里西奧　愛德華多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROMERO, PATRICIO EDUARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞拉里　埃姆雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YARALI, EMRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞雷西歐　維爾尼　吉賽佩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALESSIO VERNI, GIUSEPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布羅比　喬斯琳　科菲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROBBEY, JOCELYN KOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>贊布　塞爾吉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAMBOU, SERGES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CM</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡魯帕拉姆比爾　拉瑪錢德蘭　蘭吉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARUPARAMBIL RAMACHANDRAN, RANJITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬漢　阿迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUHAN, ADITYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊利貝里　安德里亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLIBERI, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊昂哈特　亞歷山德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEONHARDT, ALESSANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露採用包括環狀化合物之低溫循環沉積製程來沉積金屬氮化物層之方法。該循環沉積製程包括重複進行沉積循環，該沉積循環包括將金屬前驅體引入至反應室中，將氮反應物引入至反應室中，以及將包含環狀化合物之還原劑引入至反應室中。本文亦揭露金屬氮化物層及包括金屬氮化物層之半導體結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of depositing metal nitride layers employing low temperature cyclical deposition processes including cyclic compounds are disclosed. The cyclical deposition processes include repeatedly performing a deposition cycle including introducing a metal precursor into a reaction chamber, introducing a nitrogen reactant into the reaction chamber, and introducing a reducing agent comprising a cyclic compound into the reaction chamber. Metal nitride layers and semiconductor structures including metal nitride layers are also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:步驟</p>  
        <p type="p">104:循環沉積製程</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">110:步驟</p>  
        <p type="p">112:循環迴路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1927" publication-number="202627567"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627567.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物光波導及光模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G02B6/24</main-classification>  
        <further-classification edition="200601120260323B">G02B6/122</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三重野寛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIENO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之聚合物光波導具有芯部、及配置於芯部之周圍且折射率低於芯部之包層，並且於包層設置沿著芯部之周圍延伸且與形成於光電路基板之導槽卡合之突起部，突起部沿包層之寬度方向排列形成複數個，且在突起部各者之寬度方向中央部配置單一之芯部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:芯部</p>  
        <p type="p">15:耦合部</p>  
        <p type="p">16:耦合支持部</p>  
        <p type="p">17:突起部</p>  
        <p type="p">17a:角部</p>  
        <p type="p">17b:突出面</p>  
        <p type="p">18:連接部</p>  
        <p type="p">20:光電路基板</p>  
        <p type="p">21:基板側耦合部</p>  
        <p type="p">22:導槽</p>  
        <p type="p">22a:傾斜面</p>  
        <p type="p">22b:底部</p>  
        <p type="p">23:基板側連接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1928" publication-number="202628498"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628498.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線構件及眼鏡用配線構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H05K1/03</main-classification>  
        <further-classification edition="200601120260317B">H05K1/09</further-classification>  
        <further-classification edition="200601120260317B">G02C11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPS ALPINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山井知行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAI, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋壮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, SOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可謀求兼具提高導通配線之不可見性與低電阻化之配線構件、及眼鏡用配線構件。 &lt;br/&gt;本發明之一態樣係配線構件，其具備透光性絕緣基材、及設置於絕緣基材上之複數個配線圖案，複數個配線圖案具有以第1連接墊、第2連接墊、及連接第1連接墊與第2連接墊間之連接配線構成之第1配線圖案，連接配線具備具有互相分開之複數條金屬配線之並設部，於並設部中，相鄰之2條金屬配線之間隙寬於金屬配線之寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:配線構件</p>  
        <p type="p">10:絕緣基材</p>  
        <p type="p">10a:面</p>  
        <p type="p">20:配線圖案</p>  
        <p type="p">21:第1配線圖案</p>  
        <p type="p">22:第2配線圖案</p>  
        <p type="p">23:第3配線圖案</p>  
        <p type="p">32:第2連接墊</p>  
        <p type="p">35:第5連接墊</p>  
        <p type="p">40:配線保護層</p>  
        <p type="p">50:金屬配線</p>  
        <p type="p">201:連接配線</p>  
        <p type="p">202:並設部</p>  
        <p type="p">A:部</p>  
        <p type="p">D:裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1929" publication-number="202628242"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628242.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透光性構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">H01Q1/38</main-classification>  
        <further-classification edition="200601120260223B">H01Q1/48</further-classification>  
        <further-classification edition="200601120260223B">H05K3/10</further-classification>  
        <further-classification edition="200601120260223B">G02C7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPS ALPINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山井知行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAI, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可謀求兼具提高設置於透光性基材之天線之不可見性、及防止感度降低的透光性構件。 &lt;br/&gt;本發明之透光性構件具備透光性絕緣基材、複數個供電配線圖案、及金屬天線圖案，供電配線圖案具有以形成於絕緣基材之外緣側之外部連接墊、第1連接墊、及將外部連接墊與第1連接墊之間連接的連接配線構成之第1供電配線圖案，連接配線具備具有互相隔開之複數條金屬配線之並設部，並設部中，相鄰之2條金屬配線之間隙寬於金屬配線之寬度，金屬天線圖案具有延伸方向與並設部之複數條金屬配線相同、且互相隔開之複數條金屬細線，於第1供電配線圖案與金屬天線圖案之間，形成有於與延伸方向同一方向延伸之浮動之虛設金屬配線圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:透光性構件</p>  
        <p type="p">10:絕緣基材</p>  
        <p type="p">20:供電配線圖案</p>  
        <p type="p">21:第1供電配線圖案</p>  
        <p type="p">22:第2供電配線圖案</p>  
        <p type="p">23:第3供電配線圖案</p>  
        <p type="p">24:第4供電配線圖案</p>  
        <p type="p">25:第5供電配線圖案</p>  
        <p type="p">30A:第1外部連接墊</p>  
        <p type="p">30B:第2外部連接墊</p>  
        <p type="p">31:第1連接墊</p>  
        <p type="p">32:第2連接墊</p>  
        <p type="p">33:第3連接墊</p>  
        <p type="p">34:第4連接墊</p>  
        <p type="p">35:第5連接墊</p>  
        <p type="p">36:第6連接墊</p>  
        <p type="p">37:第7連接墊</p>  
        <p type="p">38:第8連接墊</p>  
        <p type="p">55:金屬天線圖案</p>  
        <p type="p">55a:天線用金屬細線</p>  
        <p type="p">57:天線用金屬連接配線</p>  
        <p type="p">58:天線用外部連接墊</p>  
        <p type="p">60:虛設金屬配線圖案</p>  
        <p type="p">60a:虛設金屬配線</p>  
        <p type="p">201:連接配線</p>  
        <p type="p">202:並設部</p>  
        <p type="p">A:部</p>  
        <p type="p">D:器件</p>  
        <p type="p">X:延伸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1930" publication-number="202627027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨用組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C09K3/14</main-classification>  
        <further-classification edition="200601120260320B">C09G1/02</further-classification>  
        <further-classification edition="200601120260320B">C08L29/04</further-classification>  
        <further-classification edition="202601120260320B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井春雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, HARUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向井貴俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中優己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種研磨後的表面之濕潤性良好、且可有效地抑制霧狀刮痕等缺陷之研磨用組合物。提供一種研磨用組合物，包括研磨粒、鹼性化合物、纖維素衍生物、改質聚乙烯醇系聚合物、界面活性劑及水。於此，上述纖維素衍生物相對於上述研磨粒的重量基準的含有量比大於0.06。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1931" publication-number="202628159"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628159.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子射線檢查裝置</chinese-title>  
        <english-title>ELECTRON BEAM INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H01J37/141</main-classification>  
        <further-classification edition="200601120260401B">H01J37/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上武司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的電子射線檢查裝置係具備使一次電子射線成像於試料上的物鏡，且要對試料施加負電位。物鏡係具有電磁透鏡、正電位電極、及接地電極。電磁透鏡係具有韋乃特電極及軛鐵，韋乃特電極係與試料相向配置且要被施加負電位，從韋乃特電極來觀察時，軛鐵係配置於試料的相反側，並且，軛鐵係與韋乃特電極磁性連接且電性絕緣，在韋乃特電極的內徑側端部與軛鐵的內徑側端部之間的間隙會形成磁場。從韋乃特電極來觀察時，正電位電極係配置於試料的相反側，且要被施加正電位。接地電極係配置於韋乃特電極與正電位電極之間並電性接地，阻礙從試料射出的背向散射電子碰撞正電位電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electron beam inspection device according to the present invention includes an objective lens that forms an image of a primary electron beam on a sample. A negative potential is applied to the sample. The objective lens includes: a Wehnelt electrode that is positioned opposite the sample and to which a negative potential is applied; an electromagnetic lens that is disposed on the opposite side of the sample when viewed from the Wehnelt electrode, that has a yoke magnetically connected to the Wehnelt electrode and electrically insulated, and that forms a magnetic field in a gap between an inner diameter end of the Wehnelt electrode and an inner diameter end of the yoke; a positive potential electrode that is positioned on the opposite side of the sample when viewed from the Wehnelt electrode and to which a positive potential is applied; a ground electrode that is positioned between the Wehnelt electrode and the positive potential electrode and is electrically grounded, to prevent backscattered electrons emitted from the sample from colliding with the positive potential electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">17:物鏡</p>  
        <p type="p">30:試料</p>  
        <p type="p">40:電磁透鏡</p>  
        <p type="p">41:韋乃特電極</p>  
        <p type="p">41a:內徑側端部</p>  
        <p type="p">42:軛鐵</p>  
        <p type="p">42a:內徑側端部</p>  
        <p type="p">43:線圈</p>  
        <p type="p">44:正電位電極</p>  
        <p type="p">45:接地電極</p>  
        <p type="p">50:背向散射電子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1932" publication-number="202627923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料處理方法、裝置、設備、電腦存儲介質及程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251103B">G06Q20/28</main-classification>  
        <further-classification edition="201201120251103B">G06Q20/40</further-classification>  
        <further-classification edition="202301120251103B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冉旭鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種資料處理方法、裝置、設備、電腦存儲介質及程式產品。該方法包括：接收對預付費卡的匯款充值請求；對發起所述匯款充值請求的用戶進行身份校驗；在校驗通過的情況下，提供所述預付費卡對應的收款帳戶資訊、收款機構資訊和收款機構的國際唯一標識，其中，所述預付費卡對應的收款帳戶資訊、收款機構資訊和所述國際唯一標識用於匯款帳戶向所述預付費卡對應的收款帳戶匯款，所述匯款帳戶為境外帳戶；接收針對所述預付費卡的匯款充值回應，生成所述預付費卡的匯款充值結果，解決境外人士使用預付費卡時的操作複雜、資金存入難度大的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210,220,230,240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1933" publication-number="202626565"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626565.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>烴之製造方法、裝置及程序</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07B61/00</main-classification>  
        <further-classification edition="200601120260102B">C07C1/04</further-classification>  
        <further-classification edition="200601120260102B">C07C1/12</further-classification>  
        <further-classification edition="200601120260102B">C10G2/00</further-classification>  
        <further-classification edition="200601120260102B">B01J8/00</further-classification>  
        <further-classification edition="200601120260102B">B01J8/22</further-classification>  
        <further-classification edition="200601120260102B">B01J21/08</further-classification>  
        <further-classification edition="200601120260102B">B01J23/75</further-classification>  
        <further-classification edition="200601120260102B">C07C9/06</further-classification>  
        <further-classification edition="200601120260102B">C07C9/08</further-classification>  
        <further-classification edition="200601120260102B">C07C9/10</further-classification>  
        <further-classification edition="200601120260102B">C07C11/04</further-classification>  
        <further-classification edition="200601120260102B">C07C11/06</further-classification>  
        <further-classification edition="200601120260102B">C07C11/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川崎康晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI, YASUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種藉由費托法製造烴之方法，其包括如下步驟：(a)在觸媒存在下，使原料氣體進行反應而獲得生成氣體；(b)將前述生成氣體供於分析，獲得與該生成氣體中的選自由乙烷及乙烯、丙烷及丙烯、以及丁烷及丁烯組成之群中之至少一種輕質烴的定量結果有關的第1資訊；(c)依據前述第1資訊，計算出選自由乙烯/乙烷比、丙烯/丙烷比及丁烯/丁烷比組成之群中之至少一種比率，從而獲得與該比率的計算值有關的第2資訊；及(d)依據前述第2資訊，獲得與碳數為5以上之烴的選擇率有關的第3資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:控制部</p>  
        <p type="p">41a:CPU</p>  
        <p type="p">41b:RAM</p>  
        <p type="p">41c:ROM</p>  
        <p type="p">41d:通訊部</p>  
        <p type="p">41e:輸入部</p>  
        <p type="p">41f:輸出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1934" publication-number="202628931"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628931.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製程套件的鞘及溫度控制</chinese-title>  
        <english-title>SHEATH AND TEMPERATURE CONTROL OF PROCESS KIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P72/72</main-classification>  
        <further-classification edition="202601120260323B">H10W10/10</further-classification>  
        <further-classification edition="200601120260323B">G05D23/00</further-classification>  
        <further-classification edition="200601120260323B">C04B35/10</further-classification>  
        <further-classification edition="200601120260323B">C04B35/581</further-classification>  
        <further-classification edition="200601120260323B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙在龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, JAEYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬斯瓦米　卡提克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMASWAMY, KARTIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比恩　丹尼爾桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, DANIEL SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王天鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TIANHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏茲　肯尼士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHATZ, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基爾科夫　基立爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRKOV, KIRIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普勞蒂　史蒂芬唐納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROUTY, STEPHEN DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若林　萊恩哲郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKABAYASHI, REYN TETSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴　約爾ＪＷ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YOEL JW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃劍秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIANQIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　阿卡迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, ARKADEEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯托弗　班傑明邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOVER, BENJAMIN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　卡拉頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, CARLATON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本說明書提供了基板支撐件的實施例。在某些實施例中，基板支撐件包括：陶瓷板，具有用於支撐基板的第一側和第二側，其中該陶瓷板包括嵌入於陶瓷板中的電極；耦接至該陶瓷板第二側的第一冷卻板；圍繞陶瓷板的陶瓷環，具有第一側和第二側，其中該陶瓷環包括一或多個吸附電極及設置在陶瓷環中的加熱元件，其中該陶瓷環與陶瓷板及第一冷卻板間隔開；耦接至該陶瓷環第二側的第二冷卻板，其中該第二冷卻板與第一冷卻板熱絕緣；以及位於陶瓷環與陶瓷板相鄰的密封元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of substrate supports are provided herein. In some embodiments, a substrate support includes: a ceramic plate having a first side configured to support a substrate and a second side, wherein the ceramic plate includes an electrode embedded in the ceramic plate; a first cooling plate coupled to the second side of the ceramic plate; a ceramic ring disposed about the ceramic plate and having a first side and a second side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate; a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is thermally isolated from the first cooling plate; and a sealing element disposed adjacent to the ceramic ring and the ceramic plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:腔室</p>  
        <p type="p">102:電漿</p>  
        <p type="p">104:蓋子</p>  
        <p type="p">105:屏蔽器</p>  
        <p type="p">106:腔室主體</p>  
        <p type="p">108:平台</p>  
        <p type="p">109:升舉銷</p>  
        <p type="p">110:波紋管組件</p>  
        <p type="p">111:軸</p>  
        <p type="p">112:中空支撐軸</p>  
        <p type="p">113:提升機構</p>  
        <p type="p">114:真空系統</p>  
        <p type="p">115:接地</p>  
        <p type="p">116:匹配網路</p>  
        <p type="p">117:偏壓電力供應</p>  
        <p type="p">118:製程氣體供應</p>  
        <p type="p">119:處理空間</p>  
        <p type="p">120:腔室內部空間</p>  
        <p type="p">122:基板</p>  
        <p type="p">124:基板支撐件</p>  
        <p type="p">126:底表面</p>  
        <p type="p">130:基板升舉裝置</p>  
        <p type="p">131:波紋管組件</p>  
        <p type="p">132:第二升舉機構</p>  
        <p type="p">136:冷卻板</p>  
        <p type="p">138:氣體分配通道</p>  
        <p type="p">140:吸附電力供應</p>  
        <p type="p">141:背部氣體供應</p>  
        <p type="p">142:氣體導管</p>  
        <p type="p">150:靜電吸盤</p>  
        <p type="p">152:陶瓷板</p>  
        <p type="p">154:電極</p>  
        <p type="p">164:下波紋管凸緣</p>  
        <p type="p">165:o形環</p>  
        <p type="p">170:RF電漿電力供應</p>  
        <p type="p">187:陶瓷環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1935" publication-number="202625996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>下肢用按摩機</chinese-title>  
        <english-title>LOWER LIMB MASSAGE MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260227B">A61H7/00</main-classification>  
        <further-classification edition="200601120260227B">A61H15/00</further-classification>  
        <further-classification edition="200601120260227B">A61H9/00</further-classification>  
        <further-classification edition="200601120260227B">A61H23/02</further-classification>  
        <further-classification edition="200601120260227B">A61H39/04</further-classification>  
        <further-classification edition="200601120260227B">A61H37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大東電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAITO ELECTRIC MACHINE INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水新策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]&lt;br/&gt; 提供一種能夠以簡單的控制來使施療構件移動之下肢用按摩機。&lt;br/&gt; [解決手段]&lt;br/&gt; 下肢用按摩機具備：施療構件37、38，對下肢進行按摩；及移動機構23，連結於施療構件37、38，使施療構件37、38沿下肢的長邊方向移動；其中，移動機構23具備：旋轉軸35；驅動部36，使旋轉軸35旋轉；支持框架22，將旋轉軸35以可沿下肢的長邊方向移動的方式支持；以及連桿機構66，連結旋轉軸35和支持框架22，且藉由旋轉軸35的旋轉而伸縮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a lower limb massage machine capable of moving a treatment member by simple control. The lower limb massage machine includes: a treatment member 37, 38 configured to massage a lower limb; and a movement mechanism 23 coupled to the treatment member 37, 38 and configured to move the treatment member 37, 38 in a longitudinal direction of the lower limb. The movement mechanism 23 includes: a rotation shaft 35; a driver 36 configured to rotate the rotation shaft 35; a support frame 22 supporting the rotation shaft 35 with the rotation shaft 35 movable in the longitudinal direction of the lower limb; and a linkage mechanism 66 coupling the rotation shaft 35 and the support frame 22 together, and expandable and contractible by rotation of the rotation shaft 35.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:殼體</p>  
        <p type="p">21a:後部蓋</p>  
        <p type="p">22:支持框架</p>  
        <p type="p">23:移動機構</p>  
        <p type="p">31:支持板</p>  
        <p type="p">32:導軌</p>  
        <p type="p">35:旋轉軸</p>  
        <p type="p">36:第1驅動部</p>  
        <p type="p">37:外側施療構件</p>  
        <p type="p">38:後施療構件</p>  
        <p type="p">41:第2驅動部</p>  
        <p type="p">45:電動馬達</p>  
        <p type="p">46:傳達部</p>  
        <p type="p">51:臂部</p>  
        <p type="p">52,57:施療件</p>  
        <p type="p">53:安裝軸</p>  
        <p type="p">66:連桿機構</p>  
        <p type="p">67:第1連桿構件</p>  
        <p type="p">68:第2連桿構件</p>  
        <p type="p">73:泵</p>  
        <p type="p">74:控制閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1936" publication-number="202627508"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627508.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137230</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試電子元件的處理機</chinese-title>  
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G01R31/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於測試電子元件的處理機。本發明的用於測試電子元件的處理機包括：測試台，在排列空間與測試空間之間移動；標識器，固定地配置於排列空間的上部側；移動攝影機，和測試台一起移動而拍攝標識器；及，控制器，從移動攝影機所拍攝的圖像掌握測試台的位置。依據本發明，準確地追蹤測試台的位置而使得測試台與測試板的位置精密地完全一致，從而確保測試的可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無。</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:搬運穿梭機</p>  
        <p type="p">110:搬運台</p>  
        <p type="p">210:第一拾取機械手</p>  
        <p type="p">300:測試台</p>  
        <p type="p">310:第二拾取機械手</p>  
        <p type="p">400:真空器</p>  
        <p type="p">500:重新配置機構</p>  
        <p type="p">600:移動機構</p>  
        <p type="p">710:鏡子</p>  
        <p type="p">720:移動攝影機</p>  
        <p type="p">800:控制器</p>  
        <p type="p">A1:第一領域</p>  
        <p type="p">A2:第二領域</p>  
        <p type="p">CP:連接區</p>  
        <p type="p">LU:裝卸區</p>  
        <p type="p">MP:移動區</p>  
        <p type="p">RP:重新配置區</p>  
        <p type="p">RS:重新配置領域</p>  
        <p type="p">TB:測試板</p>  
        <p type="p">TH:處理機</p>  
        <p type="p">TS:測試空間</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1937" publication-number="202628293"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628293.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有主動波長控制之雷射系統</chinese-title>  
        <english-title>LASER SYSTEM WITH ACTIVE WAVELENGTH CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">H01S5/32</main-classification>  
        <further-classification edition="200601120260326B">H01S5/30</further-classification>  
        <further-classification edition="200601120260326B">H01S5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萊特美特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIGHTMATTER, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦桑　斯里尼瓦桑　阿什溫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, SRINIVASAN ASHWYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森伯格　傑西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENBERG, JESSIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉特　克里希那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHARATH, KRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾　馬修　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLE, MATTHEW D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普夫努爾　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFNUER, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莎　比諾以</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, BINOY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉大鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DAPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　史丹利　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, STANLEY W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中闡述旨在使一分波多工(WDM)光源之發射波長穩定以對抗溫度波動之封裝及技術。一光源與一回饋迴路耦合，該回饋迴路監測發射波長對所指定WDM頻道網格之符合程度且動態地調整該源之操作參數以維持此種符合性。技術涉及粗略光譜對準與精細光譜對準之一組合。一光源使用一對熱電冷卻器(TEC)來輔助光譜對準程序。一第一TEC熱耦合至一雷射晶片。一第二TEC熱耦合至一多工器晶片，即監測發射波長對所指定WDM網格之符合度之一晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are packages and techniques aimed at stabilizing the wavelengths of emission of a wavelength division multiplexing (WDM) optical source against temperature fluctuations. An optical source is coupled with a feedback loop that monitors the degree to which the wavelengths of emission conform to the designated WDM channel grid and dynamically adjusts the operating parameters of the source to maintain such conformity. The technique involves a combination of coarse spectral alignment and fine spectral alignment. An optical source uses a pair of thermo-electric coolers (TEC) to aid in the spectral alignment process. A first TEC is thermally coupled to a laser chip. A second TEC is thermally coupled to a multiplexer chip – a chip that monitors compliance of the emission wavelengths with the designated WDM grid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:熱電冷卻器</p>  
        <p type="p">104:雷射晶片</p>  
        <p type="p">108:溫度感測器</p>  
        <p type="p">112:第一透鏡陣列/透鏡陣列</p>  
        <p type="p">113:熱電冷卻器連接器</p>  
        <p type="p">114:隔離器陣列</p>  
        <p type="p">116:第二透鏡陣列/透鏡陣列</p>  
        <p type="p">152:熱電冷卻器</p>  
        <p type="p">154:多工器晶片</p>  
        <p type="p">160:溫度感測器</p>  
        <p type="p">162:光電偵測器陣列/陣列</p>  
        <p type="p">169:輸出光纖/光纖</p>  
        <p type="p">180:控制器卡</p>  
        <p type="p">181:控制器晶片</p>  
        <p type="p">191:支撐件</p>  
        <p type="p">199:連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1938" publication-number="202626765"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626765.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、遮光膜及顯示裝置</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, LIGHT-SHIELDING FILM, AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">C08F290/14</further-classification>  
        <further-classification edition="200601120260401B">C08G59/17</further-classification>  
        <further-classification edition="200601120260401B">C08K3/36</further-classification>  
        <further-classification edition="200601120260401B">C08K5/33</further-classification>  
        <further-classification edition="200601120260401B">C08K5/5455</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/075</further-classification>  
        <further-classification edition="200601120260401B">G02B5/20</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日鐵化學材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤悠子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, YUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋優樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野悠樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供可兼具高遮光性與降低玻璃基板面側及膜面側雙方之反射率而且氟的使用量極少而亦可對應PFAS之規範等的要求而環境友善的感光性樹脂組成物及遮光膜等。 &lt;br/&gt;本發明之感光性樹脂組成物含有(A)至(F)成分且同時滿足下述(i)及(ii)。 &lt;br/&gt;(i) 在玻璃基板上以平均膜厚成膜為0.5至4.0μm的範圍形成該組成物的硬化膜，對於該膜的表面藉由XPS進行測定時，在Si2p3/2峰值的峰值擬合分析中，SiO&lt;sub&gt;2&lt;/sub&gt;之峰值面積A&lt;sub&gt;SiO2&lt;/sub&gt;與峰值面積A&lt;sub&gt;SiO&lt;/sub&gt;的比(A&lt;sub&gt;SiO2&lt;/sub&gt;/A&lt;sub&gt;SiO&lt;/sub&gt;)為0.10至 10.0。 &lt;br/&gt;(ii) 該膜表面中存在的F元素的量相對於Si、C、O及F元素之總量的比[F/(Si+C+O+F)]為5.0%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to provide a photosensitive resin composition and a light-shielding film that can simultaneously achieve high light-shielding properties and a reduction in the reflectivity on both the glass substrate side and the film surface side, while being environmentally friendly by using a very small amount of fluorine, thereby meeting regulations such as those for PFAS. &lt;br/&gt; A photosensitive resin composition of the present invention is characterized by containing components (A) to (F) and satisfying the following conditions (i) and (ii) simultaneously. &lt;br/&gt; (i) When a cured film of the composition is formed on a glass substrate with an average thickness in the range of 0.5 to 4.0 µm and the film's surface is measured by XPS, the ratio of the peak area of SiO&lt;sub&gt;2&lt;/sub&gt; to the peak area A&lt;sub&gt;SiO&lt;/sub&gt; (A&lt;sub&gt;SiO2&lt;/sub&gt;/A&lt;sub&gt;SiO&lt;/sub&gt;) in the peak fitting analysis of the Si2p3/2 peak is from 0.10 to 10.0. &lt;br/&gt; (ii) The amount of fluorine (F) element relative to the total amount of Si, C, O, and F elements present on the film surface [F/(Si+C+O+F)] is 5.0% or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1939" publication-number="202627158"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627158.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多晶碳化矽成形體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C16/32</main-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="200601120260401B">C23C16/56</further-classification>  
        <further-classification edition="200601120260401B">C30B28/14</further-classification>  
        <further-classification edition="200601120260401B">C30B29/36</further-classification>  
        <further-classification edition="200601120260401B">C30B33/00</further-classification>  
        <further-classification edition="202601120260401B">H10P14/24</further-classification>  
        <further-classification edition="202601120260401B">H10P90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東海碳素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKAI CARBON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今川真百合</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAGAWA, MAYURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田卓志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, TAKUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多晶碳化矽成形體及其製造方法，前述多晶碳化矽成形體係氮含量大於1000質量ppm且在5000質量ppm以下、電阻率為0.0100Ω・cm以下、及厚度為200μm～1000μm之板狀體，板狀體之第1主表面之碳化矽結晶之平均粒徑為6.0μm～25.0μm，板狀體之第2主表面之碳化矽結晶之平均粒徑為6.0μm～25.0μm，板狀體從第1主表面遍及至第2主表面之碳化矽結晶之平均粒徑為6.0μm～25.0μm，以及板狀體之第1主表面之碳化矽結晶之粒徑與第2主表面之碳化矽結晶之粒徑之差的平均值為0.1μm～1.5μm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1940" publication-number="202626253"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626253.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送機器人</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B23Q7/00</main-classification>  
        <further-classification edition="200601120260327B">B23Q7/04</further-classification>  
        <further-classification edition="200601120260327B">B25J13/00</further-classification>  
        <further-classification edition="200601120260327B">B65G47/24</further-classification>  
        <further-classification edition="202601120260327B">H10P72/30</further-classification>  
        <further-classification edition="202601120260327B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科儀器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC INSTRUMENTS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水谷卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTANI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">搬送機器人（1）具有：第一機械手（30），包括夾持工件（W）的外周端部進行保持的卡盤機構（37）；第一移動機構（31），使第一機械手（30）移動到能夠保持盒式殼體（2）的工件收容部（2a）中收容的工件（W）的前進位置（30A）、及比前進位置（30A）更遠離工件收容部（2a）的後退位置（30B）；第二機械手（40），包括吸附工件（W）的表面的吸附部（56）；第二移動機構（41），使第二機械手（40）移動到與後退位置（30B）上下重疊的交接位置（40B）；以及升降機構（48），使移動到交接位置（40B）的第二機械手（40）升降。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:第一機械手</p>  
        <p type="p">30B:後退位置</p>  
        <p type="p">36:第一機械手本體</p>  
        <p type="p">37:卡盤機構</p>  
        <p type="p">38:第一板</p>  
        <p type="p">39:襯墊</p>  
        <p type="p">40:第二機械手</p>  
        <p type="p">40B:交接位置</p>  
        <p type="p">40H:上升位置</p>  
        <p type="p">40L:下降位置</p>  
        <p type="p">47:第二機械手支撐部</p>  
        <p type="p">48:升降機構</p>  
        <p type="p">49:機械手調整機構</p>  
        <p type="p">50:第二機械手本體</p>  
        <p type="p">51:第二框架</p>  
        <p type="p">56:吸附部</p>  
        <p type="p">57:吸附襯墊</p>  
        <p type="p">S1、S2、S3、S4:步驟</p>  
        <p type="p">W:工件</p>  
        <p type="p">X、X1、X2、Z、Z1、Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1941" publication-number="202627292"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627292.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有帶保持器之活塞面的活塞總成</chinese-title>  
        <english-title>PISTON ASSEMBLY HAVING A PISTON FACE WITH RETAINERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">F02F3/28</main-classification>  
        <further-classification edition="200601120260323B">F02F5/00</further-classification>  
        <further-classification edition="200601120260323B">F16J9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商曼斯普林能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAINSPRING ENERGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塞克　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SVRCEK, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　凱文　廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KEVIN TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮耶托　卡洛斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIETO, CARLOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬斯科特　喬治　傑密爾　寇特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASCORT, GEORGE JAMIL KORT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱日嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中提供活塞及其總成，其具有包含不同特徵及幾何形狀之活塞面及台肩。本文所闡述之活塞面具有一中心部分及複數個保持器。該複數個保持器中之每一保持器相對於該中心部分徑向向外延伸。該複數個保持器中之至少一對毗鄰保持器在該至少一對毗鄰保持器之各別徑向向外端部處斷開連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Pistons, and assemblies thereof, are provided herein with piston faces and lands including different features and geometries. The piston faces described herewith have a central portion and a plurality of retainers. Each retainer of the plurality of retainers extends radially outward relative to the central portion. At least one pair of adjacent retainers of the plurality of retainers are disconnected at respective radially outward ends of the at least one pair of adjacent retainers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:活塞總成</p>  
        <p type="p">102:密封環總成</p>  
        <p type="p">104:活塞</p>  
        <p type="p">106:圓周凹槽</p>  
        <p type="p">108:活塞面</p>  
        <p type="p">110:中心部分</p>  
        <p type="p">112:徑向向外部分</p>  
        <p type="p">114:保持器</p>  
        <p type="p">116:端部</p>  
        <p type="p">118:軸向前台肩/前台肩</p>  
        <p type="p">120:軸向後台肩/後台肩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1942" publication-number="202625955"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625955.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壽司店管理系統、壽司店管理方法、搬送系統、及壽司設置部</chinese-title>  
        <english-title>SUSHI RESTAURANT MANAGEMENT SYSTEM, SUSHI RESTAURANT MANAGEMENT METHOD, CONVEYANCE SYSTEM, AND SUSHI PLACEMENT UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A47L15/00</main-classification>  
        <further-classification edition="200601120260330B">A47F10/06</further-classification>  
        <further-classification edition="200601120260330B">A47G23/08</further-classification>  
        <further-classification edition="200601120260330B">B65G47/52</further-classification>  
        <further-classification edition="200601120260330B">B65G53/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商藏壽司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURA SUSHI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中邦彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中林章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKABAYASHI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種壽司店管理系統、壽司店管理方法、搬送系統、及壽司設置部。搬送裝置（10）將通過一次性的包裝體包裝的壽司不經由需要清洗的餐盤而沿著搬送路徑（11）進行搬送。沿著搬送路徑（11）排列配置有顧客進行餐飲的多個餐飲位置（15）。管理裝置（40）根據感測器（30）的檢測結果執行以下操作：檢測通過搬送裝置（10）搬送的包裝好的壽司在被包裝體包裝的狀態下從搬送裝置（10）取出、以及確定多個餐飲位置（15）中的取出包裝好的壽司的餐飲位置即取出位置。管理裝置（40）在向確定的取出位置的顧客請求的請求金額中包含取出的壽司的銷售金額。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The transport apparatus 10 transports sushi packaged in disposable packaging along a transport path 11 without using plates that require washing. Along the transport path 11, a plurality of dining positions 15 at which customers eat and drink are arranged. A management device 40, based on detection results from a sensor 30, detects that packaged sushi being transported by the transport apparatus 10 has been taken out from the transport apparatus 10 while remaining packaged in the packaging, and identifies, among the plurality of dining positions 15, a take-out position that is the dining position from which the packaged sushi has been taken out. The management device 40 includes the sales price of the taken-out sushi in a billed amount charged to the customer at the identified take-out position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:壽司店管理系統</p>  
        <p type="p">5:壽司包裝機</p>  
        <p type="p">7:空閒情況報告部</p>  
        <p type="p">9:不正當行為防止用攝像頭</p>  
        <p type="p">10:搬送裝置</p>  
        <p type="p">11:搬送路徑</p>  
        <p type="p">15A~15I:餐飲位置</p>  
        <p type="p">20A~20J:分隔部</p>  
        <p type="p">30A~30J:感測器(攝像頭)</p>  
        <p type="p">40:管理裝置</p>  
        <p type="p">41:CPU</p>  
        <p type="p">42:ROM</p>  
        <p type="p">43:RAM</p>  
        <p type="p">44:NVM</p>  
        <p type="p">K:廚房</p>  
        <p type="p">G:客房</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1943" publication-number="202626554"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626554.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結構構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C04B35/01</main-classification>  
        <further-classification edition="201801120260302B">G01N23/207</further-classification>  
        <further-classification edition="202601120260302B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本村研一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOMURA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滝沢亮人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIZAWA, RYOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種保護膜對電漿的耐久性高之結構構件。 &lt;br/&gt; 本發明的解決手段為一種結構構件10，包含：基材100；覆蓋基材100的表面110之膜，且包含以氧化釔作為主成分之保護膜200。在使用X-射線繞射分析保護膜200的表面210得到的繞射圖樣中，當歸屬於立方晶的(622)面的尖峰(peak)的最大強度為P1，歸屬於立方晶的(211)面的尖峰的最大強度為P2，歸屬於立方晶的(222)面的尖峰的最大強度為P3，歸屬於立方晶的(400)面的尖峰的最大強度為P4，歸屬於立方晶的(440)面的尖峰的最大強度為P5，歸屬於立方晶的(541)面的尖峰的最大強度為P6時，在結構構件10中，P1/(P1+P2+P3+P4+P5+P6)＞0.015成立。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1944" publication-number="202628827"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628827.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體製造的微波介電體鈍化</chinese-title>  
        <english-title>PASSIVATING MICROWAVE DIELECTRICS FOR SEMICONDUCTOR MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P50/20</main-classification>  
        <further-classification edition="202601120260302B">H10P50/26</further-classification>  
        <further-classification edition="200601120260302B">H05H1/42</further-classification>  
        <further-classification edition="200601120260302B">H05H1/46</further-classification>  
        <further-classification edition="200601120260302B">H01J37/02</further-classification>  
        <further-classification edition="200601120260302B">H01J37/32</further-classification>  
        <further-classification edition="200601120260302B">C23C14/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　勁文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KELVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝察魯茲　艾斯特班</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEZA RUZ, ESTEBAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岳詩雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUE, SHIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅加爾瓦　亞瑟多瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, ASHUTOSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴魯札　桑傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALUJA, SANJEEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹下健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKESHITA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處描述的實施例涉及一種裝置，包括一個具有第一表面和與該第一表面相對的第二表面的介電板。在某一個實施例中，介電板的第二表面上有一個介電共振器。在某一個實施例中，該介電板的第一表面上有一層塗層，其中該塗層包含釔及/或鋯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a dielectric plate with a first surface and a second surface opposite from the first surface. In an embodiment, a dielectric resonators on the second surface of the dielectric plate. In an embodiment, a coating is on the first surface of the dielectric plate, where the coating includes yttrium and/or zirconium.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">315:介電板</p>  
        <p type="p">330:塗層</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1945" publication-number="202625960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137487</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置、資訊處理方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61B3/14</main-classification>  
        <further-classification edition="200601120260331B">A61B3/10</further-classification>  
        <further-classification edition="202201120260331B">G06V10/70</further-classification>  
        <further-classification edition="201801120260331B">G16H30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂敦製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROHTO PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商異能人股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOJIN, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>學校法人順天堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNTENDO EDUCATIONAL FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀田敏行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOTTA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木紀夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豬俣武範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOMATA, TAKENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">資訊處理裝置(1)具備：眼部狀態判斷部(30)，對第1學習模型(31)輸入使用者的眼部圖像(P2)，藉此來判斷使用者的眼部的狀態，前述第1學習模型(31)是依據對事先取得的複數個眼部圖像的每一個賦與顯示眼部的狀態之標註(annotation)而得到的教師資料，藉由機械學習而事先生成；及評分部(40)，依據由眼部狀態判斷部(30)所判斷的使用者的眼部的狀態，對使用者的眼部的狀態進行評分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資訊處理裝置</p>  
        <p type="p">10:臉部圖像取得部</p>  
        <p type="p">20:眼部圖像提取部</p>  
        <p type="p">30:眼部狀態判斷部</p>  
        <p type="p">31:第1學習模型</p>  
        <p type="p">40:評分部</p>  
        <p type="p">50:顯示部</p>  
        <p type="p">P1:臉部圖像</p>  
        <p type="p">P2:眼部圖像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1946" publication-number="202628164"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628164.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在線性加速器中的相位測量及控制</chinese-title>  
        <english-title>PHASE MEASUREMENT AND CONTROL IN LINEAR ACCLERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260225B">H01J37/244</main-classification>  
        <further-classification edition="200601120260225B">H01J37/24</further-classification>  
        <further-classification edition="200601120260225B">H05H9/00</further-classification>  
        <further-classification edition="200601120260225B">H05H7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊斯　約書亞馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONES, JOSHUA MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托爾　昂格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOE, AUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯克　麥可勞倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRK, MICHAEL LAWRENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇某　大衛Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMOU, DAVID J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬奇　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKI, JAMNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩茲施　史考特Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEITZSCH, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯揚　馬修Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENYON, MATTHEW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一個線性加速器。該線性加速器可包括一個整束器，以從帶電粒子束生成束狀粒子束，以及複數個加速階段，以加速該束狀粒子束。該線性加速器還可包括一個相控制系統，用以獨立地測量在第一頻率下施加於該複數個加速階段中某一特定加速階段的RF訊號的相位。相控制系統可包括一個RF訊號採集組件，包括複數個RF訊號偵測器，分別安裝於該複數個加速階段中。相控制系統還可包括一個相位測量電路，用以將從RF採集組件的RF訊號偵測器接收的RF採集訊號轉換為數位基頻訊號，以便確定RF訊號的相位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A linear accelerator. The linear accelerator may include a buncher to generate a bunched particle beam from a charged particle beam, and a plurality of acceleration stages, to accelerate the bunched particle beam. The linear accelerator may further include a phase control system, to individually measure a phase of an RF signal that is applied at a first frequency to a given acceleration stage of the plurality of acceleration stages. The phase control system may include an RF signal pickup assembly, comprising a plurality of RF signal detectors, arranged separately in the plurality of acceleration stages. The phase control system may further include a phase measurement circuit, to convert an RF pickup signal, received from an RF signal detector of the RF pickup assembly, into a digital baseband signal, for determining a phase of the RF signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:相位測量電路</p>  
        <p type="p">140:相控制器</p>  
        <p type="p">202:ADC</p>  
        <p type="p">204:第一混頻器</p>  
        <p type="p">206:第二混頻器</p>  
        <p type="p">208:數位合成電路</p>  
        <p type="p">210:第一低通濾波器</p>  
        <p type="p">212:第二低通濾波器</p>  
        <p type="p">214:第一降取樣電路</p>  
        <p type="p">216:第二降取樣電路</p>  
        <p type="p">218:相位轉換電路</p>  
        <p type="p">D&lt;sub&gt;C&lt;/sub&gt;:數位餘弦訊號</p>  
        <p type="p">D&lt;sub&gt;S&lt;/sub&gt;:數位正弦訊號</p>  
        <p type="p">F&lt;sub&gt;C&lt;/sub&gt;:數位餘弦訊號</p>  
        <p type="p">F&lt;sub&gt;S&lt;/sub&gt;:數位正弦訊號</p>  
        <p type="p">S:複數正弦訊號/振盪器訊號</p>  
        <p type="p">P:RF採集訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1947" publication-number="202628600"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628600.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用金屬誘導結晶之矽晶粒生長</chinese-title>  
        <english-title>GRAIN GROWTH OF SILICON BY METAL INDUCED CRYSTALLIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260309B">H10B80/00</main-classification>  
        <further-classification edition="200601120260309B">G11C7/18</further-classification>  
        <further-classification edition="200601120260309B">G11C8/14</further-classification>  
        <further-classification edition="202601120260309B">H10D88/00</further-classification>  
        <further-classification edition="202501120260309B">H10D62/10</further-classification>  
        <further-classification edition="202501120260309B">H10D62/40</further-classification>  
        <further-classification edition="202601120260309B">H10P95/90</further-classification>  
        <further-classification edition="202601120260309B">H10P14/20</further-classification>  
        <further-classification edition="202601120260309B">H10W10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜昌錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, CHANG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳學忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUEH CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾薩蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER SATYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德弗里斯　史考特Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVRIES, SCOTT A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種半導體元件的製造方法，方法改善多晶矽通道的粒度並抑制由殘留金屬含量所引發的負面影響。在沉積多晶矽通道層後，於多晶矽通道層上沉積覆蓋層。覆蓋層包括金屬鋁合金層。然後對元件進行退火以增大多晶矽通道層的粒度，然後移除覆蓋層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method of manufacturing a semiconductor device which improves the grain size of the polysilicon channel and suppresses adverse effects resulting from remaining metal contents. After deposition of the polysilicon channel layer, a capping layer is deposited on the polysilicon channel layer. The capping layer comprises a metal aluminum alloy layer. The device is then annealed to increase the grain size of the polysilicon channel layer, and then the capping layer is removed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">308:記憶體孔</p>  
        <p type="p">314:層</p>  
        <p type="p">314a:阻擋氧化物層</p>  
        <p type="p">314b:電荷捕獲層</p>  
        <p type="p">314c:隧道氧化物層</p>  
        <p type="p">315:放大圖</p>  
        <p type="p">320:結晶多晶矽通道層</p>  
        <p type="p">321:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1948" publication-number="202626924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種聚合物添加劑及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251021B">C08K5/5313</main-classification>  
        <further-classification edition="200601120251021B">C07F9/30</further-classification>  
        <further-classification edition="200601120251021B">C09K21/12</further-classification>  
        <further-classification edition="200601120251021B">C09D5/18</further-classification>  
        <further-classification edition="200601120251021B">D06M13/285</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海金發科技發展有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商金發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商遼寧金發生物材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李積德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳平緒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉南飆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>敬新柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚曉斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林姿瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於阻燃劑的技術領域，公開了一種聚合物添加劑及其製備方法和應用。所述聚合物添加劑包含結構式如下式（I）所示的二乙基次膦酸鋁以及結構式如下式（II）所示的乙基丁基次膦酸鋁；所述聚合物添加劑滿足由下式（1）定義的雙焓比ΔH：0.92≤ΔH≤1.06；以及滿足130℃≤T1≤155℃，165℃≤T2≤185℃；式（1）ΔH=H2/H1。所述聚合物添加劑具有較好的耐熱穩定性，使得聚合物添加劑在加工過程中更難分解，降低了其對金屬類生產設備的金屬加工部件的腐蝕；&lt;br/&gt;&lt;img align="absmiddle" height="181px" width="496px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1949" publication-number="202626925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物添加劑、阻燃劑、聚合物模塑材料及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C08K5/5313</main-classification>  
        <further-classification edition="200601120251223B">C07F9/30</further-classification>  
        <further-classification edition="202501120251223B">C08L23/025</further-classification>  
        <further-classification edition="200601120251223B">C08L75/04</further-classification>  
        <further-classification edition="200601120251223B">C09K21/12</further-classification>  
        <further-classification edition="200601120251223B">D06M13/285</further-classification>  
        <further-classification edition="200601120251223B">C09D5/18</further-classification>  
        <further-classification edition="200601120251223B">C08L77/00</further-classification>  
        <further-classification edition="200601320251223B">D06M101/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海金發科技發展有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商金發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商遼寧金發生物材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李積德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳平緒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉南飆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>敬新柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚曉斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林姿瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了聚合物添加劑、阻燃劑、聚合物模塑材料及其製備方法和應用。所述聚合物添加劑包括：二乙基次膦酸鋁和乙基丁基次膦酸鋁；所述聚合物添加劑滿足由下式（1）定義的雙焓比ΔH：0.90≤ΔH≤1.05；以及滿足135℃≤T1≤160℃，165℃≤T2≤185℃，180℃≤T3≤200℃；式（1）ΔH=（H2+H3）/H1。本發明提供的聚合物添加劑具有特定的晶型轉變狀態，添加有所述聚合物添加劑的聚合物模塑材料在模塑成型應用過程中具有更低的模塑收縮率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1950" publication-number="202626981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電轉換元件、墨水組成物及光電轉換元件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260330B">C09D11/30</main-classification>  
        <further-classification edition="201401120260330B">C09D11/38</further-classification>  
        <further-classification edition="200601120260330B">C09K11/06</further-classification>  
        <further-classification edition="202301120260330B">H10K50/15</further-classification>  
        <further-classification edition="202301120260330B">H10K50/16</further-classification>  
        <further-classification edition="202301120260330B">H10K50/80</further-classification>  
        <further-classification edition="202301120260330B">H10K85/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大倉工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKURA INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＣＨＥＭＩＰＡＺ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMIPAZ CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷澤克也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIZAWA, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植田恭弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UETA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供：可藉由塗佈步驟形成含有鈣鈦礦化合物之光電轉換元件之電極，且亦可抑制光電轉換元件之劣化的光電轉換元件、墨水組成物及光電轉換元件之製造方法。 &lt;br/&gt;本發明之解決手段：一種光電轉換元件，係具有第1電極20及第2電極70，以及配置於第1電極20與第2電極70之間、且含有具鈣鈦礦結晶構造之鈣鈦礦化合物的光電轉換層50；其中，第1電極20或第2電極70係藉由塗佈含有導電性奈米線與該導電性奈米線之分散溶媒的墨水組成物而形成；分散溶媒係含有鈣鈦礦化合物之貧溶媒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光電轉換元件</p>  
        <p type="p">10:基板</p>  
        <p type="p">20:第1電極</p>  
        <p type="p">30:電子輸送層</p>  
        <p type="p">40:多孔質層</p>  
        <p type="p">50:光電轉換層</p>  
        <p type="p">60:電洞輸送層</p>  
        <p type="p">70:第2電極</p>  
        <p type="p">80:配線層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1951" publication-number="202626500"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626500.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳奈米管漿料、電極用碳奈米管漿料及電極膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260330B">C01B32/174</main-classification>  
        <further-classification edition="201001120260330B">H01M4/133</further-classification>  
        <further-classification edition="200601120260330B">H01M4/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱鉛筆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田有亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門端孝太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADOHASHI, KOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田後慶一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGO, KEIICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧本恵莉子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIMOTO, ERIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包含碳奈米管、重量平均分子量為5萬以上60萬以下的羧基甲基纖維素或其金屬鹽或銨鹽，與水，前述碳奈米管係纖維長度為50μm以上、平均直徑為3nm以上20nm以下，進而，BET比表面積為70m&lt;sup&gt;2&lt;/sup&gt;/g以上180m&lt;sup&gt;2&lt;/sup&gt;/g以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1952" publication-number="202627582"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627582.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光模組及資訊機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G02B6/42</main-classification>  
        <further-classification edition="202101120260327B">H01S5/02251</further-classification>  
        <further-classification edition="202101120260327B">H01S5/02253</further-classification>  
        <further-classification edition="202501120260327B">H10F77/40</further-classification>  
        <further-classification edition="200601120260327B">H05K7/16</further-classification>  
        <further-classification edition="200601120260327B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木昌輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅野泰徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASANO, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能提高光纖之可靠性之光模組及資訊機器。本發明之光模組具備：基板，其具有主面；光元件，其配置於主面上；透鏡零件，其配置於主面上；光纖，其具有末端部及從末端部起連續之被覆部；被覆構件，其以使末端部露出之方式覆蓋被覆部；輔助構件；及接著部。透鏡零件具有：光纖保持部，其保持末端部；及透鏡部，其配置於光元件與光纖之末端部之間的光路上。輔助構件相對於光纖保持部配置於從光纖之末端部朝向被覆部之第1方向。接著部將被覆構件與輔助構件接著。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:光模組</p>  
        <p type="p">51:基板</p>  
        <p type="p">51b:後端</p>  
        <p type="p">51c:主面</p>  
        <p type="p">52:光元件</p>  
        <p type="p">53:透鏡零件</p>  
        <p type="p">53b:反射鏡部</p>  
        <p type="p">53c:透鏡部</p>  
        <p type="p">53d:表面</p>  
        <p type="p">53e:凹部</p>  
        <p type="p">55:光纖</p>  
        <p type="p">55a:末端部</p>  
        <p type="p">55b:被覆部</p>  
        <p type="p">56:被覆構件</p>  
        <p type="p">57:支持構件</p>  
        <p type="p">57a:前端</p>  
        <p type="p">57b:後端</p>  
        <p type="p">57c:角部</p>  
        <p type="p">57d:面</p>  
        <p type="p">58:接著部</p>  
        <p type="p">D1,D2,D3:方向</p>  
        <p type="p">L:光路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1953" publication-number="202626746"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626746.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137616</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、組成物之製造方法及成型體</chinese-title>  
        <english-title>COMPOSITION, METHOD FOR PRODUCING COMPOSITION, AND MOLDED BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/04</main-classification>  
        <further-classification edition="200601120260401B">C08F12/08</further-classification>  
        <further-classification edition="200601120260401B">C08L101/12</further-classification>  
        <further-classification edition="200601120260401B">C08L25/04</further-classification>  
        <further-classification edition="200601120260401B">C08L25/18</further-classification>  
        <further-classification edition="200601120260401B">C08L65/00</further-classification>  
        <further-classification edition="200601120260401B">C08K5/42</further-classification>  
        <further-classification edition="200601120260401B">C08J3/20</further-classification>  
        <further-classification edition="200601120260401B">C08J5/00</further-classification>  
        <further-classification edition="200601120260401B">H01B1/12</further-classification>  
        <further-classification edition="200601120260401B">H01B1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人山形大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木巴琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, HAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阪上元規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGAMI, MOTOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋辰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小村(鈴木)麻衣奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMURA(SUZUKI), MAINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田幸夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, SACHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田諒太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之一方面，提供一種組成物，含有：疏水性之聚合性化合物之聚合物、PEDOT：PSS、及界面活性劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the present disclosure provides a composition comprising a hydrophobic polymerizable compound aggregate, PEDOT:PSS, and a surfactant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1954" publication-number="202625887"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625887.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貝類之飼育方法</chinese-title>  
        <english-title>METHOD FOR REARING SHELLFISH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260323B">A01K61/50</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>ＮＯＶＥＬＧＥＮ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVELGEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保科亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小倉淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGURA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田園大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAZONO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案之課題在於提供一種可維持、甚至增加成貝之肉重之飼育方法。本案之課題在於提供一種可進一步提升成貝加熱得率之飼育方法。本案之課題在於提供一種可進一步提升成貝之外觀及風味･香氣之飼育方法。本案之一實施形態係一種貝類之飼育方法，其包含：藻類準備步驟，準備藻類濃度為0.3×10&lt;sup&gt;6&lt;/sup&gt;細胞/mL以上之藻類溶液；以及貝類浸漬步驟，將該貝類浸漬於上述藻類溶液中。上述貝類為成貝之飼育方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:飼育系統</p>  
        <p type="p">20:浸漬槽</p>  
        <p type="p">22:藻類溶液</p>  
        <p type="p">24:貝類</p>  
        <p type="p">30:藻類培養槽</p>  
        <p type="p">32:投入用藻類</p>  
        <p type="p">40:藻類導入管</p>  
        <p type="p">42:藻類導入用泵</p>  
        <p type="p">44:藻類導入用開關閥</p>  
        <p type="p">50:排出管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1955" publication-number="202626817"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626817.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>共聚物聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F283/12</main-classification>  
        <further-classification edition="200601120260401B">C08F290/06</further-classification>  
        <further-classification edition="200601120260401B">C08L83/10</further-classification>  
        <further-classification edition="200601120260401B">C08K3/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渋田薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBUTA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱亞爾　馬尼許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAYAL, MANISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門脇和生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADOWAKI, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田浩也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, HIROYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之共聚物聚合物具有：來自聚矽氧巨單體之特定結構之聚矽氧巨單體單元、及來自除上述聚矽氧巨單體以外之其他單體之單元，且上述其他單體具有與π共軛填料能夠相互作用之部位，上述共聚物聚合物之平均聚合度為2.5以上10以下，上述聚矽氧巨單體與上述其他單體之漢森溶解度參數（Hansen solubility parameter）的HSP距離（Ra）為5以上。 &lt;br/&gt;根據本發明，可提供一種共聚物聚合物，其對π共軛填料之吸附性較高，且能夠使π共軛填料於聚矽氧樹脂中之流動性提高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1956" publication-number="202626979"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626979.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造鋰離子電池之電極的可固化組成物</chinese-title>  
        <english-title>CURABLE COMPOSITIONS FOR THE MANUFACTURE OF ELECTRODES OF LITHIUM-ION BATTERIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09D4/00</main-classification>  
        <further-classification edition="201801120260401B">C09D7/61</further-classification>  
        <further-classification edition="200601120260401B">C09D5/24</further-classification>  
        <further-classification edition="201001120260401B">H01M4/58</further-classification>  
        <further-classification edition="200601120260401B">H01M4/62</further-classification>  
        <further-classification edition="201001120260401B">H01M4/136</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商阿科瑪法國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARKEMA FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢瑞亞　薩德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIRIA, SAEID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種呈漿液形式之組成物，其包含：一電極顆粒材料；一(甲基)丙烯酸酯寡聚物；一溶劑；一助黏劑，其包含一(甲基)丙烯酸酯化磷酸酯；及任擇地一(甲基)丙烯酸酯單體及/或一自由基光引發劑。該組成物適合用於製造鋰離子電池之電極。特定言之，該組成物可施於一集電器上再固化以形成陰極或陽極。已經發現，此組成物提供了具有均勻表面且無裂紋之電極，並且增強該電極顆粒材料對鋰離子電池所用集電器的黏著力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition in the form of a slurry comprises an electrode particulate material; a (meth)acrylate oligomer; a solvent; an adhesion promoter comprising a (meth)acrylated phosphate ester; and optionally a (meth)acrylate monomer and/or a free radical photoinitiator. This composition is suitable for use in the fabrication of electrodes of lithium-ion batteries. In particular, the composition may be applied to a current collector, then cured to form a cathode or an anode. It has been found that this composition provides electrodes having an homogeneous surface which is deprived of cracks and also enhanced adhesion of the electrode particulate material to current collectors used in lithium-ion batteries.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1957" publication-number="202626134"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626134.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微針結構體之製造方法以及微針結構體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A61M37/00</main-classification>  
        <further-classification edition="200601120260330B">A61M5/32</further-classification>  
        <further-classification edition="200601120260330B">A61B5/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高麗洋佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種微針結構體之製造方法，具備：製備包含造孔劑與水不溶性樹脂之針狀部形成樹脂組成物之步驟；製作微針中間體之步驟，前述微針中間體具有藉由針狀部形成樹脂組成物所形成之針狀部；以及藉由水來處理微針中間體以去除造孔劑，於針狀部形成多孔質結構的水處理步驟；造孔劑包含水溶性無機粒子及水溶性樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:微針結構體</p>  
        <p type="p">2:針狀部</p>  
        <p type="p">3:基部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1958" publication-number="202627336"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627336.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微閥密封件之環架懸臂式致動樑</chinese-title>  
        <english-title>GIMBALLED CANTILEVERED ACTUATING BEAM FOR MICRO-VALVE SEALING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">F16K13/00</main-classification>  
        <further-classification edition="200601120260324B">F16K31/02</further-classification>  
        <further-classification edition="200601120260324B">B41J2/14</further-classification>  
        <further-classification edition="200601120260324B">B81B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商馬修斯國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHEWS INTERNATIONAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯考克　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUSKIRK, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫斯　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HESS, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄恩　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEAN, DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜魯巴　肯尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUEBA, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈魯札克　查爾斯　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALUZAK, CHARLES C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖爾欽斯基　亞歷克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TULCHINSKY, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海德邁爾　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIDEMEYER, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於密封微閥之環架懸臂式致動樑。該微閥包括一孔口板及延伸穿過該孔口板之一孔口。一致動樑相對該孔口板分開地設置。該致動樑包含與該孔口板分開一預定距離之一基底部分及由該基底部分朝向該孔口延伸之一懸臂部分。該致動樑之一重疊部分與該孔口重疊且藉由至少一肋部可撓地固定在該懸臂部分之剩餘部分上，容許該重疊部分行環架動作。一密封結構設置在該重疊部分，當該致動樑在關閉位置時該密封結構密封該孔口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gimballed cantilevered actuating beam for sealing micro-valves is disclosed. The micro-valve includes an orifice plate and an orifice extending through the orifice plate. An actuating beam is disposed in spaced relation to the orifice plate. The actuating beam comprises a base portion separated from the orifice plate by a predetermined distance and a cantilevered portion extending from the base portion towards the orifice. An overlapping portion of the actuating beam overlaps the orifice and is flexibly affixed to the remainder of the cantilevered portion by at least one rib, allowing the overlapping portion to gimbal. A sealing structure is disposed at the overlapping portion, which seals the orifice when the actuating beam is in the closed position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:閥總成</p>  
        <p type="p">202:載體</p>  
        <p type="p">204:上部分</p>  
        <p type="p">206:殼體部分</p>  
        <p type="p">208:隔片</p>  
        <p type="p">210:輸入流體歧管</p>  
        <p type="p">212:第一通道</p>  
        <p type="p">214:第二通道</p>  
        <p type="p">216:撓性電路</p>  
        <p type="p">218:封裝膠</p>  
        <p type="p">220:焊線</p>  
        <p type="p">222:結構層</p>  
        <p type="p">224:突出部分</p>  
        <p type="p">230:微閥</p>  
        <p type="p">240:致動樑</p>  
        <p type="p">250:孔口板</p>  
        <p type="p">260:孔口</p>  
        <p type="p">270:閥座</p>  
        <p type="p">280:分隔構件</p>  
        <p type="p">290:密封構件</p>  
        <p type="p">292,314:部分</p>  
        <p type="p">294:電氣連接部分</p>  
        <p type="p">298:閥本體</p>  
        <p type="p">300:容室</p>  
        <p type="p">302:黏著劑層</p>  
        <p type="p">304:寬度</p>  
        <p type="p">306:基底部分</p>  
        <p type="p">308:懸臂部分</p>  
        <p type="p">310:本體</p>  
        <p type="p">312:長度</p>  
        <p type="p">316:內表面</p>  
        <p type="p">318:內孔</p>  
        <p type="p">320,322:厚度</p>  
        <p type="p">328,336,338,340:元件</p>  
        <p type="p">330:第一臂</p>  
        <p type="p">332:第二臂</p>  
        <p type="p">334:第三臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1959" publication-number="202626081"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626081.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含ＧＶ１００１肽的用於減低癌細胞的ＣＤ４７表達及增加巨噬細胞的吞噬作用的組成物及其用途</chinese-title>  
        <english-title>COMPOSITION FOR REDUCING CD47 EXPRESSION OF CANCER CELL AND INCREASING PHAGOCYTOSIS OF MACROPHAGE COMPRISING GV1001 PEPTIDE AND USE OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K38/10</main-classification>  
        <further-classification edition="200601120260401B">A61K38/45</further-classification>  
        <further-classification edition="201601120260401B">A23K20/147</further-classification>  
        <further-classification edition="201601120260401B">A23L33/18</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商珍白斯凱爾有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEMVAX &amp; KAEL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金商在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SANG JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種包含GV1001肽的用於減少癌細胞的CD47表達及增加巨噬細胞的吞噬作用的組成物及其用途。具體地，本發明涉及一種用於預防、治療或改善與CD47表達相關的癌症的組成物及其醫學、保健功能食品學及飼料學的用途。本發明的組成物在預防、治療或改善表達CD47的癌症，特別是頭頸癌、胃癌和結直腸癌和/或相關症狀方面表現出卓越效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a composition comprising the GV1001 peptide for reducing CD47 expression in cancer cells and increasing macrophage phagocytosis, and to the uses of the same. Specifically, the present invention relates to a composition for use in preventing, treating, or ameliorating cancers associated with CD47 expression, and to the medical use, health functional food use, or feed use of the same. The composition of the present invention exhibits excellent effects in preventing, treating, or ameliorating cancers expressing CD47, particularly head and neck cancer, stomach cancer, and colon cancer, and/or related symptoms.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1960" publication-number="202626140"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626140.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137683</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有共形電連接的換能器陣列</chinese-title>  
        <english-title>TRANSDUCER ARRAY WITH CONFORMAL-SHAPED ELECTRICAL CONNECTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">A61N1/04</main-classification>  
        <further-classification edition="200601120260323B">A61N1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商諾沃庫勒有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVOCURE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈拉維伊　諾亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALAVEE, NOA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅各比　艾利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAACOBI, ELIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>果龍　迪米崔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLOM, DMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於遞送腫瘤治療場的換能器設備包含：一電極元件陣列，所述陣列被配置以定位在一受試者的身體之上，其中一正面面對所述受試者的身體；連接所述電極元件陣列中的電極元件的電連接，並且所述電連接具有一面對所述受試者的身體的正面以及一背面；以及一非等向性材料層，其電耦接至所述電極元件陣列並且位在所述陣列的所述正面的一前側上，所述非等向性材料層包括一正面以及一背面，所述背面是面對所述電極元件陣列，其中，當在垂直且朝向所述非等向性材料層的所述背面的方向上觀看時，所述電極元件具有相關所述非等向性材料層的一周邊的凸形，並且所述電連接具有相關所述非等向性材料層的所述周邊的凹形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transducer apparatus for delivering tumor treating fields includes: an array of electrode elements, the array configured to be positioned over a subject’s body with a front face facing the subject’s body; electrical connections connecting the electrode elements and having a front face facing the subject’s body and a back face; and an anisotropic material layer electrically coupled to the array of electrode elements and located on a front side of the front face of the array, the anisotropic material layer comprising a front face and a back face, the back face facing the array of electrode elements, wherein, when viewed in a direction perpendicular to and toward the back face of the anisotropic material layer, the electrode elements have convex shapes with respect to a perimeter of the anisotropic material layer and the electrical connections have concave shapes with respect to the perimeter of the anisotropic material layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:換能器設備</p>  
        <p type="p">102A、102B、102C:電極元件</p>  
        <p type="p">104、104(1)、104(2):基板</p>  
        <p type="p">106:撓性的印刷電路板(PCB)</p>  
        <p type="p">110:非等向性材料層</p>  
        <p type="p">120:中心</p>  
        <p type="p">122:孔洞</p>  
        <p type="p">124:泡綿材料層</p>  
        <p type="p">126A、126B、126C:空白空間/空孔空間</p>  
        <p type="p">130A、130B、130C:PCB墊</p>  
        <p type="p">135A、135B:PCB橋接連接器/電連接</p>  
        <p type="p">143:背面</p>  
        <p type="p">150:PCB連接器</p>  
        <p type="p">1C-1C’:截面</p>  
        <p type="p">1D-1D’:截面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1961" publication-number="202626680"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626680.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、色轉換組成物、色轉換構件以及包含其的光源單元、顯示器及照明裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C07F5/02</main-classification>  
        <further-classification edition="200601120260325B">C08K5/55</further-classification>  
        <further-classification edition="200601120260325B">C08L101/00</further-classification>  
        <further-classification edition="200601120260325B">C09K11/06</further-classification>  
        <further-classification edition="202501120260325B">H10H20/851</further-classification>  
        <further-classification edition="201601120260325B">F21K9/64</further-classification>  
        <further-classification edition="200601120260325B">G09F9/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>境野裕健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAINO, HIROTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市橋泰宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIHASHI, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早朝愛美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAASA, MANAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">作為本發明的一態樣的化合物為下述的通式（1）所表示的化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="153px" width="434px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（於通式（1）中，R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;7&lt;/sup&gt;中至少一個為通式（2）所表示的基。於通式（2）中，L為m+1價的連結基。於通式（1）所鍵結的通式（2）所表示的基為兩個以上的情況下，全部L可相同亦可不同。其中，m為1以上的自然數。於m為2以上的情況下，全部A可相同亦可不同。於通式（2）中，A為通式（3-1）或通式（3-2）所表示的基） &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="295px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（於通式（3-1）及通式（3-2）的各自中，「**」表示與通式（2）中的L的鍵。n為1以上的自然數。環Z&lt;sub&gt;a&lt;/sub&gt;為n+1價的連結基。環Z&lt;sub&gt;b&lt;/sub&gt;為經氟原子或包含氟原子的至少一個取代基取代的環）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:色轉換構件</p>  
        <p type="p">10:基材層</p>  
        <p type="p">11:色轉換層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1962" publication-number="202626796"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626796.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂粒子、其製造方法及其用途</chinese-title>  
        <english-title>RESIN PARTICLES, PRODUCTION METHOD THEREOF, AND USES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260303B">C08F212/08</main-classification>  
        <further-classification edition="200601120260303B">C08F220/14</further-classification>  
        <further-classification edition="200601120260303B">C08F2/18</further-classification>  
        <further-classification edition="200601120260303B">C08F2/22</further-classification>  
        <further-classification edition="200601120260303B">C08F136/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化成品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI KASEI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向井健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施型態的樹脂粒子具有第1玻璃轉移溫度及第2玻璃轉移溫度，第1玻璃轉移溫度為-40℃至-20℃，第2玻璃轉移溫度為100℃至140℃，其在測定頻率10GHz的介電損耗正切為0.0050以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The resin particles according to an embodiment of the present invention have a first glass transition temperature and a second glass transition temperature, wherein the first glass transition temperature is in a range of −40°C to −20°C and the second glass transition temperature is in a range of 100°C to 140°C, and a dielectric loss tangent at a measurement frequency of 10 GHz is 0.0050 or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1963" publication-number="202627022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性胺基甲酸酯樹脂組成物、合成皮革、及合成皮革的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09J175/04</main-classification>  
        <further-classification edition="200601120260401B">C09J11/00</further-classification>  
        <further-classification edition="200601120260401B">B32B27/12</further-classification>  
        <further-classification edition="200601120260401B">B32B27/40</further-classification>  
        <further-classification edition="200601120260401B">B32B7/12</further-classification>  
        <further-classification edition="200601120260401B">D06N3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉄井智博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TETSUI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角谷凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITANI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種適用期長且具有優異的剝離強度及手感的水性胺基甲酸酯樹脂組成物。使用一種水性胺基甲酸酯樹脂組成物，含有：具有非離子性基的胺基甲酸酯樹脂（A）；水性介質（B）；粉體（C）；以及交聯劑（D），所述水性胺基甲酸酯樹脂組成物的特徵在於，所述胺基甲酸酯樹脂（A）的流動開始溫度為100℃以上，所述胺基甲酸酯樹脂（A）與所述水性介質（B）的質量比[（A）/（B）]為50/50～80/20的範圍，所述粉體（C）的體積密度為400 g/L以下，相對於所述胺基甲酸酯樹脂（A）100質量份，所述交聯劑（D）的使用量為0.1質量份～10質量份的範圍，所述交聯劑（D）為選自由異氰酸酯系交聯劑、碳二醯亞胺系交聯劑及環氧系交聯劑所組成的群組中的一種以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1964" publication-number="202628635"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628635.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D30/67</main-classification>  
        <further-classification edition="202501120260327B">H10D64/20</further-classification>  
        <further-classification edition="202601120260327B">H10P14/60</further-classification>  
        <further-classification edition="200601120260327B">G02F1/1368</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三宅博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAKE, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡崎健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAZAKI, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早川昌彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAKAWA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田慎平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, SHINPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是：提供一種具有電特性優良的電晶體的半導體裝置；提供一種孔徑比高且具有能夠增大電荷容量的電容元件的半導體裝置。一種半導體裝置，包括：閘極電極；與閘極電極重疊的氧化物半導體膜；與氧化物半導體膜接觸的氧化物絕緣膜；設置在閘極電極與氧化物半導體膜之間的第一阻氧膜；以及與第一阻氧膜接觸的第二阻氧膜，其中在第一阻氧膜及第二阻氧膜的內側設置有氧化物半導體膜及氧化物絕緣膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device including a transistor having excellent electrical characteristics is provided. Alternatively, a semiconductor device having a high aperture ratio and including a capacitor capable of increasing capacitance is provided. The semiconductor device includes a gate electrode, an oxide semiconductor film overlapping the gate electrode, an oxide insulating film in contact with the oxide semiconductor film, a first oxygen barrier film between the gate electrode and the oxide semiconductor film, and a second oxygen barrier film in contact with the first oxygen barrier film. The oxide semiconductor film and the oxide insulating film are provided on an inner side of the first oxygen barrier film and the second oxygen barrier film.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基板</p>  
        <p type="p">12:導電膜</p>  
        <p type="p">13:導電膜</p>  
        <p type="p">15:阻氧膜</p>  
        <p type="p">17:氧化物絕緣膜</p>  
        <p type="p">19a:氧化物半導體膜</p>  
        <p type="p">19b:具有導電性的膜</p>  
        <p type="p">21a:導電膜</p>  
        <p type="p">21b:導電膜</p>  
        <p type="p">21c:導電膜</p>  
        <p type="p">23:氧化物絕緣膜</p>  
        <p type="p">25:氧化物絕緣膜</p>  
        <p type="p">27:阻氧膜</p>  
        <p type="p">29:導電膜</p>  
        <p type="p">29a:導電膜</p>  
        <p type="p">41:開口部</p>  
        <p type="p">41a:開口部</p>  
        <p type="p">102a:電晶體</p>  
        <p type="p">105a:電容元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1965" publication-number="202627160"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627160.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於選擇性沉積之電漿處理製程</chinese-title>  
        <english-title>PLASMA TREATMENT PROCESSES FOR SELECTIVE DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C23C16/34</main-classification>  
        <further-classification edition="200601120260317B">C23C16/02</further-classification>  
        <further-classification edition="200601120260317B">C23C16/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高立剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, LIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈德西卡爾巴斯德西　瓦希迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHODSI KARBASDEHI, VAHID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝卡瓦特　安妮魯杜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEKHAWAT, ANIRUDDH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯林吉瓦迪　卡爾提克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLINJIVADI, KARTHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了在電子裝置的製造中採用的用於選擇性沉積之電漿處理製程。示範性方法包含將金屬氮化物層選擇性地沉積在第一表面上更甚於第二表面，該第一表面包括以下各者中的一或多者：矽、氧氮化矽、氮化矽、鎢或碳化鈦鋁，而該第二表面包括金屬氧化物，諸如例如以下各者中的一或多者：氧化矽、氧化鋁、氧化鉿或氧化鋯。在選擇性沉積金屬氮化物層之前，第一表面和第二表面均用電漿處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Plasma treatment processes for selective deposition that are employed in the manufacture of electronic devices are described. Exemplary methods include selectively depositing a metal nitride layer on a first surface comprising one or more of silicon, silicon oxynitride, silicon nitride, tungsten, or titanium aluminum carbide, over a second surface comprising a metal oxide, such as, for example, one or more of silicon oxide, aluminum oxide, hafnium oxide, or zirconium oxide. The first surface and the second surface are treated with a plasma prior to selectively depositing the metal nitride layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:方法</p>  
        <p type="p">11:操作</p>  
        <p type="p">12:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1966" publication-number="202626936"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626936.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C08L27/18</main-classification>  
        <further-classification edition="200601120260317B">C09K3/16</further-classification>  
        <further-classification edition="200601120260317B">B29C33/68</further-classification>  
        <further-classification edition="201901120260317B">B32B7/06</further-classification>  
        <further-classification edition="200601120260317B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小寺省吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTERA, SEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八百板隆俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAOITA, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福本奈生子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, NAOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種積層膜，該積層膜具備基材及設於前述基材之一面側的機能層；前述基材包含氟樹脂，且前述基材之另一面的算術平均粗度Ra為0.3~1.9µm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材</p>  
        <p type="p">1A:基材第1面(基材之一面)</p>  
        <p type="p">1B:基材第2面(基材之另一面)</p>  
        <p type="p">2:機能層</p>  
        <p type="p">10:積層膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1967" publication-number="202627577"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627577.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高速入口端接</chinese-title>  
        <english-title>HIGH SPEED ENTRANCE TERMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G02B6/38</main-classification>  
        <further-classification edition="200601120260324B">G02B6/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商柏克泰克有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERK-TEK LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康諾頓　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONNAUGHTON, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福特　大衛　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORD, DAVID P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利普克　迪恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIPKE, DEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷尼　傑克森　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANEY, JACKSON WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學端接托盤經構形以在不使用外部連接器主體之情況下藉由對套圈進行連接來同時連接多對光纖線纜，該等套圈端接該等線纜。該光學端接托盤可連接光纖線纜之套圈，而不需要將外部連接器殼體端接在各別線纜上。該托盤可以此種方式連接多對線纜，進而減少在高密度裝設區域處連接多根光纖線纜所需之時間量，同時維持可接受之插入損耗特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical termination tray is configured to connect multiple pairs of fiber optic cables simultaneously by connecting ferrules that terminate the cables without the use of an outer connector bodies. The optical termination tray can connect the ferrules of fiber optic cables without the need for outer connector housings to be terminated on the respective cables. The tray can connect multiple pairs of cables in this manner, reducing the amount of time needed to connect multiple fiber optic cables at high-density installation areas while maintaining acceptable insertion loss characteristics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:實例性光纖連接器總成</p>  
        <p type="p">106:連接器殼體/MMC連接器殼體/殼體</p>  
        <p type="p">112:光纖線纜/線纜</p>  
        <p type="p">118:套圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1968" publication-number="202626566"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626566.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>烷烴之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C07C1/20</main-classification>  
        <further-classification edition="200601120260325B">C07C9/00</further-classification>  
        <further-classification edition="200601120260325B">B01J23/44</further-classification>  
        <further-classification edition="200601120260325B">B01J29/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新日本理化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW JAPAN CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高井拓夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAI, HIROMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種烷烴之製造方法，其能夠於較低之反應壓力下進行醇與氫之連續反應，能夠抑制源自醇的碳減少，並且轉化率亦優異。 &lt;br/&gt;本發明係一種烷烴之製造方法，其係由碳數為8以上且22以下之醇製造烷烴，且具備以下述條件使上述醇與氫連續反應之步驟。 &lt;br/&gt;（i）於載持鈀之沸石載體之存在下進行反應，反應溫度為180℃以上，氫壓以表壓計為0 MPa以上且0.7 MPa以下。 &lt;br/&gt;（ii）氫相對於上述沸石載體上載持有鈀之觸媒之體積的空間速度（SV）為1200 h&lt;sup&gt;-1&lt;/sup&gt;以上且2400 h&lt;sup&gt;-1&lt;/sup&gt;以下。 &lt;br/&gt;（iii）上述醇相對於上述沸石載體上載持有鈀之觸媒之體積的空間速度（SV）為8 h&lt;sup&gt;-1&lt;/sup&gt;以下。 &lt;br/&gt;（iv）上述沸石載體為H-beta型、或H-ZSM-5型，二氧化矽（SiO&lt;sub&gt;2&lt;/sub&gt;）與氧化鋁（Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;）之莫耳比（SiO&lt;sub&gt;2&lt;/sub&gt;/Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;）為23以上且27以下，且鈀之載持量為0.1質量%以上且5質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1969" publication-number="202626578"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626578.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脂環式二羧酸之金屬鹽之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C51/41</main-classification>  
        <further-classification edition="200601120260401B">C07C61/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新日本理化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW JAPAN CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能減少廢棄損失，簡易且選擇率（順式異構物之莫耳比率）優異之脂環式二羧酸之金屬鹽（烷基取代-1,2-二羧酸之鈣鹽、羥基鋁鹽、二鈉鹽、或二鋰鹽）之製造方法。 &lt;br/&gt;本發明係一種脂環式二羧酸之金屬鹽之製造方法，其特徵在於：上述脂環式二羧酸為具有至少1個直接鍵結於環己烷環之烷基取代基之環己烷-1,2-二羧酸之金屬鹽，上述烷基取代基為碳數1～4之直鏈狀或支鏈狀之烷基，上述金屬鹽為鈣鹽、羥基鋁鹽、二鈉鹽、或二鋰鹽，且上述製造方法包括步驟（1）、（2）、（3）及（4）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1970" publication-number="202626424"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626424.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於自行車之位置檢測裝置</chinese-title>  
        <english-title>POSITION DETECTION DEVICE FOR A BICYCLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B62K19/00</main-classification>  
        <further-classification edition="202001120260325B">B62J45/00</further-classification>  
        <further-classification edition="200601120260325B">G01B7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商速聯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRAM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯庫克拉夫特　Ｒ　喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHOOLCRAFT, R JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉克斯利　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAKESLEE, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克吉　艾利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCGEE, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧拉普　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNLAP, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於自行車之位置檢測裝置可包括界定一內部及一外部之自行車組件。一可檢測元件可設置在該自行車組件之內部中且可相對於該自行車組件移動。至少一檢測元件係設置在該自行車組件之外部中，該至少一檢測元件可操作來檢測：該可檢測元件相對於該自行車組件之一第一位置以及該可檢測元件相對於該自行車組件之一第二位置，其中該第二位置與該第一位置不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A position detection device for a bicycle may include a bicycle component defining an interior and an exterior. A detectable element may be disposed in the interior of the bicycle component and movable relative to the bicycle component. At least one detecting element is disposed in the exterior of the bicycle component, the at least one detecting element operable to detect: a first position of the detectable element relative to the bicycle component, and a second position of the detectable element relative to the bicycle component, wherein the second position is different from the first position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:位置檢測裝置</p>  
        <p type="p">202:第一伸縮組件</p>  
        <p type="p">204:第二伸縮組件</p>  
        <p type="p">206:內部容積</p>  
        <p type="p">208:外部環境</p>  
        <p type="p">210:密封元件</p>  
        <p type="p">212:第一對準特徵</p>  
        <p type="p">214:第二對準特徵</p>  
        <p type="p">216:可檢測元件</p>  
        <p type="p">218:可檢測元件殼體</p>  
        <p type="p">219:可檢測元件夾具</p>  
        <p type="p">220:第一檢測元件</p>  
        <p type="p">222:第二檢測元件</p>  
        <p type="p">224:第三檢測元件</p>  
        <p type="p">226:電源</p>  
        <p type="p">228:處理器</p>  
        <p type="p">230:檢測殼體</p>  
        <p type="p">232:通訊介面</p>  
        <p type="p">234:第一行程止動件</p>  
        <p type="p">236:第二行程止動件</p>  
        <p type="p">C:壓縮方向</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">D2:第二距離</p>  
        <p type="p">D3:第三距離</p>  
        <p type="p">F:場</p>  
        <p type="p">F1:第一場軸線</p>  
        <p type="p">F2:第二場軸線</p>  
        <p type="p">FR:場伸距</p>  
        <p type="p">P:檢測平面</p>  
        <p type="p">P1:第一檢測軸線</p>  
        <p type="p">P2:第二檢測軸線</p>  
        <p type="p">P3:第三檢測軸線</p>  
        <p type="p">T:軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1971" publication-number="202628733"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628733.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">H10H29/30</main-classification>  
        <further-classification edition="202501120251230B">H10H29/39</further-classification>  
        <further-classification edition="202501120251230B">H10H29/80</further-classification>  
        <further-classification edition="202501120251230B">H10D62/10</further-classification>  
        <further-classification edition="202501120251230B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昇眩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNG-HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包含：顯示面板，包含第一區域及至少一個第二區域；閘極線，在第一區域及至少一個第二區域中沿第一方向佈置；第一資料線，在第一區域中沿垂直於第一方向之第二方向佈置；第二資料線，在至少一個第二區域中沿第二方向佈置且具有短於第一資料線之長度的長度；垂直聯絡線，在第一區域中沿第二方向佈置；以及水平聯絡線，在第一區域及至少一個第二區域中沿第一方向佈置，其中垂直聯絡線中之每一者透過相應的水平聯絡線電性連接至相應之第二資料線，且垂直聯絡線中之每一者具有與待連接之第二資料線之各自一者之長度成反比。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device in some examples includes a first area, a second area, gate lines arranged in a first direction in the first and second areas, first data lines arranged in a second direction perpendicular to the first direction in the first area, second data lines arranged in the second direction in the second area and having a length shorter than a length of the first data lines, vertical link lines arranged in the second direction in the first area, and horizontal link lines arranged in the first direction in the first and second areas. Each of the vertical link lines is electrically connected to the corresponding one second data line through the corresponding one horizontal link line, and each of the vertical link lines has a length inversely proportional to a length of the second data lines to be connected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">A1:第一區域</p>  
        <p type="p">A2:第二區域</p>  
        <p type="p">A3:第三區域</p>  
        <p type="p">AA:顯示區域</p>  
        <p type="p">BA:彎曲區域</p>  
        <p type="p">CNT1:第一接觸孔</p>  
        <p type="p">CNT2:第二接觸孔</p>  
        <p type="p">COLINK:補償聯絡線</p>  
        <p type="p">DL1,DL2,DL3:資料線</p>  
        <p type="p">DLINK:資料聯絡線</p>  
        <p type="p">HLINK:水平聯絡線</p>  
        <p type="p">NA,NA1,NA2:非顯示區域</p>  
        <p type="p">SLINK:訊號聯絡線</p>  
        <p type="p">SP,SP1,SP2,SP3:子像素</p>  
        <p type="p">VLINK:垂直聯絡線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1972" publication-number="202629010"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629010.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10W70/60</main-classification>  
        <further-classification edition="202601120260317B">H10W70/66</further-classification>  
        <further-classification edition="202601120260317B">H10W70/01</further-classification>  
        <further-classification edition="202601120260317B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPIDUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大井田充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOIDA, MITSURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種在進行連接時之製程窗口(process window)為廣並且能夠將連接節距縮窄之半導體裝置。半導體裝置(1)，係具有具備聚合物絕緣部(81)與金屬電極部(82)之聚合物配線層(70)，在聚合物絕緣部(81)處，係被形成有複數個的開口部，金屬電極部(82)，係為在開口部處而被填充有金屬材料之部分，前述金屬材料，係包含有銅以及焊錫，金屬材料，係在開口部處，從聚合物配線層(70)所被形成之半導體器件之主面起，而以銅、焊錫之順序來被作配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:3維半導體封裝</p>  
        <p type="p">11:第1半導體器件</p>  
        <p type="p">12:第1基板</p>  
        <p type="p">13:第1器件層</p>  
        <p type="p">15:第1矽貫通通孔</p>  
        <p type="p">20:第2半導體器件</p>  
        <p type="p">21:第1之第2半導體器件</p>  
        <p type="p">22:第2基板</p>  
        <p type="p">23:第2器件層</p>  
        <p type="p">25:第2矽貫通通孔</p>  
        <p type="p">31:第2之第2半導體器件</p>  
        <p type="p">32:第3基板</p>  
        <p type="p">33:第3器件層</p>  
        <p type="p">35:第3矽貫通通孔</p>  
        <p type="p">40:第3半導體器件</p>  
        <p type="p">41:第1之第3半導體器件</p>  
        <p type="p">42:第4基板</p>  
        <p type="p">43:第4器件層</p>  
        <p type="p">51:第2之第3半導體器件</p>  
        <p type="p">52:第5基板</p>  
        <p type="p">53:第5器件層</p>  
        <p type="p">70:聚合物配線層</p>  
        <p type="p">71:第1聚合物配線層</p>  
        <p type="p">72:第2聚合物配線層</p>  
        <p type="p">73:第3聚合物配線層</p>  
        <p type="p">74:第4聚合物配線層</p>  
        <p type="p">75:第5聚合物配線層</p>  
        <p type="p">76:第6聚合物配線層</p>  
        <p type="p">81:聚合物絕緣部</p>  
        <p type="p">82:金屬電極部</p>  
        <p type="p">111:第1基板主面</p>  
        <p type="p">112:第2基板主面</p>  
        <p type="p">113:第1器件層主面</p>  
        <p type="p">151:模封部</p>  
        <p type="p">153:模封部主面</p>  
        <p type="p">161:連接層</p>  
        <p type="p">162:電極部</p>  
        <p type="p">163:絕緣部</p>  
        <p type="p">201:第2半導體器件主面</p>  
        <p type="p">211:第3基板主面</p>  
        <p type="p">212:第4基板主面</p>  
        <p type="p">213:第2器件層主面</p>  
        <p type="p">311:第5基板主面</p>  
        <p type="p">312:第6基板主面</p>  
        <p type="p">313:第3器件層主面</p>  
        <p type="p">411:第7基板主面</p>  
        <p type="p">412:第8基板主面</p>  
        <p type="p">413:第4器件層主面</p>  
        <p type="p">511:第9基板主面</p>  
        <p type="p">512:第10基板主面</p>  
        <p type="p">513:第5器件層主面</p>  
        <p type="p">711:第1聚合物配線層主面</p>  
        <p type="p">721:第2聚合物配線層主面</p>  
        <p type="p">731:第3聚合物配線層主面</p>  
        <p type="p">741:第4聚合物配線層主面</p>  
        <p type="p">751:第5聚合物配線層主面</p>  
        <p type="p">761:第6聚合物配線層主面</p>  
        <p type="p">1011:第1方向</p>  
        <p type="p">1012:第2方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1973" publication-number="202626398"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626398.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安全帶增高座椅</chinese-title>  
        <english-title>HARNESS BOOSTER SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B60N2/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊德Ｓ　哈姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLYDE S, HARMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊夫　馬爾姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEIF, MALM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>珍妮佛Ｅ　謝爾德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENNIFER E, SHELDRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種兒童座椅組件，該兒童座椅組件包括：一座椅殼體，該座椅殼體具有一座椅底部及一座椅靠背；及一安全帶組件。該座椅靠背包括一支撐表面、一第一側壁及一第二側壁。該第一側壁及該第二側壁自該支撐表面向前延伸。至少一個凹部配置在該座椅殼體處靠近該第一側壁及該第二側壁中之至少一個側壁，且該安全帶組件之至少一部分在不使用時可定位在該至少一個凹部內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child seat assembly includes a seat shell having a seat bottom and a seat back and a harness assembly. The seat back includes a support surface, a first sidewall, and a second sidewall. The first sidewall and the second sidewall extending forward of the support surface. At least one recess is arranged at the seat shell proximate at least one of the first sidewall and the second sidewall and at least a portion of the harness assembly is positionable within the at least one recess when not in use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">122:兒童座椅</p>  
        <p type="p">124:座椅靠背</p>  
        <p type="p">126:座椅底部</p>  
        <p type="p">140:第二直立側構件</p>  
        <p type="p">141:表面</p>  
        <p type="p">143:遠端</p>  
        <p type="p">144b:開口</p>  
        <p type="p">202b:第二側部分</p>  
        <p type="p">204b:背面</p>  
        <p type="p">210b:第二凹部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1974" publication-number="202626529"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626529.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超純水供給系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">C02F1/42</main-classification>  
        <further-classification edition="202301120260401B">C02F1/44</further-classification>  
        <further-classification edition="202301120260401B">C02F9/00</further-classification>  
        <further-classification edition="200601120260401B">B01D61/14</further-classification>  
        <further-classification edition="201701120260401B">B01J47/00</further-classification>  
        <further-classification edition="200601120260401B">F16L9/12</further-classification>  
        <further-classification edition="200601120260401B">F16L11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, MOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種超純水供給系統，為包括一次純水裝置及二次純水裝置的超純水製造系統，其中所述二次純水裝置依次具有非再生式離子交換裝置以及超濾膜，至少較所述非再生式離子交換裝置更靠下游側處藉由非氟系且為非氯系的合成樹脂配管連接。作為非氟系且為非氯系的合成樹脂配管，使用聚丙烯或聚乙烯等聚烯烴系樹脂製配管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:原水槽</p>  
        <p type="p">2:預處理裝置</p>  
        <p type="p">3:過濾水槽</p>  
        <p type="p">4:一次純水裝置</p>  
        <p type="p">5:純水槽</p>  
        <p type="p">6、8、13、15、16、16A、18、35、37:配管</p>  
        <p type="p">7:脫氣膜裝置</p>  
        <p type="p">9:DO計</p>  
        <p type="p">10:TOC分解單元</p>  
        <p type="p">11:UV氧化器</p>  
        <p type="p">12:離子交換器(混床式、二床三塔式或四床五塔式等的任一種)</p>  
        <p type="p">14:閥門</p>  
        <p type="p">17:子罐</p>  
        <p type="p">20:二次純水裝置(子系統)</p>  
        <p type="p">36:使用點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1975" publication-number="202628706"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628706.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光偵測器及電子設備</chinese-title>  
        <english-title>PHOTODETECTOR AND ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">H10F39/18</main-classification>  
        <further-classification edition="202501120260318B">H10F77/14</further-classification>  
        <further-classification edition="202501120260318B">H10F77/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤幹記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, MIKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[目的] &lt;br/&gt;抑制光之色彩混合。 &lt;br/&gt;[解決方案] &lt;br/&gt;提供一種光偵測器，該光偵測器包含一像素陣列單元，其中包含包括針對一單一微透鏡形成之複數個光電轉換單元之一第一像素之複數個像素以一二維陣列形狀配置，其中該第一像素具備分離該複數個光電轉換單元之一第一分離部分，且該第一分離部分用形成於其上形成該複數個光電轉換單元之一半導體基板中之一雜質區分離對應於該微透鏡之一光聚集位置之一部分且藉由在形成於該半導體基板中之一溝渠中嵌入一物質而分離排除對應於該雜質區之部分之一部分。例如，本發明可應用於諸如一CMOS型影像感測器之一固態成像裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">[Object] &lt;br/&gt;To suppress color mixing of light. &lt;br/&gt;[Solution] &lt;br/&gt;A photodetector is provided, the photodetector including a pixel array unit in which a plurality of pixels including a first pixel including a plurality of photoelectric conversion units formed for a single microlens are arranged in a two-dimensional array shape, in which the first pixel is provided with a first separation portion separating the plurality of photoelectric conversion units, and the first separation portion separates a portion corresponding to a light concentration position of the microlens with an impurity region formed in a semiconductor substrate on which the plurality of photoelectric conversion units are formed, and separates a portion excluding the portion corresponding to the impurity region by embedding a substance in a trench formed in the semiconductor substrate. The present disclosure can be applied to, for example, a solid-state imaging device such as a CMOS-type image sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31B:像素</p>  
        <p type="p">31G:像素</p>  
        <p type="p">31R:像素</p>  
        <p type="p">51:微透鏡</p>  
        <p type="p">52B:藍色濾光器/彩色濾光器</p>  
        <p type="p">52G:綠色濾光器/彩色濾光器</p>  
        <p type="p">52R:紅色濾光器/彩色濾光器</p>  
        <p type="p">53:光電轉換單元</p>  
        <p type="p">53-1:光電轉換單元</p>  
        <p type="p">53-2:光電轉換單元</p>  
        <p type="p">61:雜質分離部分</p>  
        <p type="p">62:雜質分離部分</p>  
        <p type="p">71:像素間分離部分</p>  
        <p type="p">72:元件間分離部分</p>  
        <p type="p">73:元件間分離部分</p>  
        <p type="p">A1:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1976" publication-number="202628791"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628791.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138067</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板接合的方法</chinese-title>  
        <english-title>METHODS FOR SUBSTRATE BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10P10/00</main-classification>  
        <further-classification edition="200601120260330B">H05H1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪伍德　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHERWOOD, TYLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>司里尼瓦桑　拉格夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SREENIVASAN, RAGHAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈爾奇奇科　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GORCHICHKO, MARIIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩蓋葉　安哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, ANH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝巴德　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEPARD, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里許南　希達司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAN, SIDDARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恰德席克　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUDZIK, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">這裡揭露了處理基板的方法，包括處理該基板第一部分的表面，以產生一個具有處理過的第一部分和第二部分的處理基板，其中該處理過的第一部分與另一基板的接合速度與該第二部分與該另一基板的接合速度不同。還揭露了一種將第一基板接合到第二基板的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of processing a substrate are disclosed herein which include treating a surface of a first portion of the substrate to produce a treated substrate having a treated first portion and a second portion, wherein a bonding speed of the treated first portion to another substrate is different than a bonding speed of the second portion to the other substrate. A method of bonding a first substrate to a second substrate is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:頂層晶圓</p>  
        <p type="p">102:底層晶圓</p>  
        <p type="p">106:虛線</p>  
        <p type="p">108:啟動點</p>  
        <p type="p">110:外邊緣</p>  
        <p type="p">112:接合前沿</p>  
        <p type="p">114:箭頭</p>  
        <p type="p">116:部分</p>  
        <p type="p">118:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1977" publication-number="202628493"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628493.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離子植入機和操作離子植入機的方法</chinese-title>  
        <english-title>ION IMPLANTER AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H05H7/18</main-classification>  
        <further-classification edition="200601120260316B">H03J3/20</further-classification>  
        <further-classification edition="200601120260316B">H01G5/16</further-classification>  
        <further-classification edition="200601120260316B">H05H9/04</further-classification>  
        <further-classification edition="200601120260316B">H01J37/317</further-classification>  
        <further-classification edition="202601120260316B">H10P30/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞歷山德羅維奇　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALEXANDROVICH, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫魯尼西　彼得　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURUNCZI, PETER F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派滋許　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEITZSCH, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯內卡特爾　路奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONECUTTER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西尼爾　克勞格　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENIOR, KRAG R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩爾　喬納森　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORE, JONATHAN DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯拉尼克　大衛　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAHNIK, DAVID T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施耐德　馬克西米利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDER, MAXIMILIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席夢思　麥可　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMMONS, MICHAEL C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供離子植入機，包括離子源和擷取系統，配置以在第一離子能量產生連續離子束，以及線性加速器，配置以從連續離子束產生聚束離子束，並將聚束離子束加速至大於第一離子能量的第二離子能量。因此，線性加速器可包括多個加速級，其中線性加速器的給定加速級包括漂移管組件，配置以通過多個加速間隙加速聚束離子束。給定加速級亦可包括諧振器，配置以傳送射頻電壓信號至漂移管組件，以及諧振控制電路，具有可變電容器，可變電容器配置以調整諧振器的諧振器電容，以維持諧振器電路的諧振頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ion implanter is provided, including an ion source and extraction system, arranged to generate a continuous ion beam at a first ion energy, and a linear accelerator, arranged to generate a bunched ion beam from the continuous ion beam, and to accelerate the bunched ion beam to a second ion energy, greater than the first ion energy. As such, the linear accelerator may include a plurality of acceleration stages, where a given acceleration stage of the linear accelerator includes a drift tube assembly, arranged to accelerate the bunched ion beam through a plurality of acceleration gaps. The given acceleration stage may also include a resonator, arranged to deliver an RF voltage signal to the drift tube assembly, and a resonance control circuit, having a variable capacitor that is arranged to adjust a resonator capacitance of the resonator, in order to maintain a resonant frequency of the resonator circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">126A:諧振器</p>  
        <p type="p">128:諧振器外殼</p>  
        <p type="p">130A:諧振控制電路</p>  
        <p type="p">150:漂移管組件</p>  
        <p type="p">160:諧振器線圈</p>  
        <p type="p">210:可變電容器</p>  
        <p type="p">214:饋通</p>  
        <p type="p">216:高電壓射頻信號形式功率輸入</p>  
        <p type="p">218:電壓電流感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1978" publication-number="202628214"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628214.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水電解質二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260323B">H01M10/05</main-classification>  
        <further-classification edition="201001120260323B">H01M4/13</further-classification>  
        <further-classification edition="201001120260323B">H01M4/525</further-classification>  
        <further-classification edition="200601120260323B">H01M4/62</further-classification>  
        <further-classification edition="201001120260323B">H01M10/0569</further-classification>  
        <further-classification edition="200601120260323B">C25B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若林大倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKABAYASHI, HIROMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">非水電解質二次電池包含：電極體，隔著分隔件捲繞有呈帶狀且彼此極性不同的第1電極(11)及第2電極；及外裝體，容置電極體。第1電極(11)具有：芯體(30)；及合劑層(32)，形成於芯體(30)的表面。在第1電極(11)的表面形成有露出了芯體(30)之露出部(31)，並且在露出部(31)接合有電極耳片(19)。電極耳片(19)至少是重疊於露出部(31)之電極體的捲繞軸方向的前端面(19a)與接合於露出部(31)之接合面之間的角部已經有倒角。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">19:正極耳片</p>  
        <p type="p">19a:前端面</p>  
        <p type="p">19b,19c:角部</p>  
        <p type="p">19e:非接合面</p>  
        <p type="p">30:正極芯體</p>  
        <p type="p">31:正極芯體露出部</p>  
        <p type="p">32:正極合劑層</p>  
        <p type="p">x:長邊方向</p>  
        <p type="p">y:寬度方向</p>  
        <p type="p">z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1979" publication-number="202627714"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627714.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人程式編寫裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G05B19/401</main-classification>  
        <further-classification edition="200601120260401B">G05B19/4061</further-classification>  
        <further-classification edition="200601120260401B">G05B19/42</further-classification>  
        <further-classification edition="200601120260401B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米山寬之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEYAMA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">機器人程式編寫裝置具備：三維模型配置部，在虛擬空間內配置機器人模型、工具模型及工件模型；作業處指定部，在工件模型上指定作業處；工具接觸點座標系統設定部，在工具模型上接觸作業處之處設定工具接觸點座標系統；工具接觸點位置姿勢計算部，計算前述工具接觸點座標系統的原點接觸於作業處時之工具接觸點座標系統相對於機器人模型座標系統的位置及姿勢；工具基準點位置姿勢計算部，依據工具接觸點座標系統相對於機器人模型座標系統的位置及姿勢、以及設定於工具模型的基準點之工具基準點座標系統相對於工具接觸點座標系統的位置及姿勢，來計算工具接觸點座標系統的原點接觸於作業處時之工具基準點座標系統相對於機器人模型座標系統的位置及姿勢；及教示點生成部，根據預定的動作條件及計算出的工具基準點座標系統的位置及姿勢，來生成機器人程式的教示點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機器人程式編寫裝置</p>  
        <p type="p">11:處理器</p>  
        <p type="p">12:記憶部</p>  
        <p type="p">13:顯示部</p>  
        <p type="p">14:操作部</p>  
        <p type="p">111:虛擬空間製作部</p>  
        <p type="p">112:三維模型配置部</p>  
        <p type="p">113:作業處指定部</p>  
        <p type="p">114:工具接觸點座標系統設定部</p>  
        <p type="p">115:工具接觸點位置姿勢計算部</p>  
        <p type="p">116:工具基準點位置姿勢計算部</p>  
        <p type="p">117a:干擾檢測部</p>  
        <p type="p">117b:干擾迴避部</p>  
        <p type="p">118:動作條件指定部</p>  
        <p type="p">119:教示點生成部</p>  
        <p type="p">120:模擬執行部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1980" publication-number="202627268"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627268.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配有落管之岩石安裝船</chinese-title>  
        <english-title>ROCK INSTALLATION VESSEL WITH A FALL PIPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">E02D15/10</main-classification>  
        <further-classification edition="200601120260324B">B63B27/24</further-classification>  
        <further-classification edition="202001120260324B">B63B35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商巴格瑪夏皮波絲卡利斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAGGERMAATSCHAPPIJ BOSKALIS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內里森　羅蘭　費德里克　約翰尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEELISSEN, ROELAND FREDERIK JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　吉芬　伊科　克拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN GIFFEN, IKE KLAAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　德　瓦　雷蒙　簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DER WAL, REMMELT JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝弗爾　尼爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHEFFER, NIELS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於將岩石安裝至海床上之岩石安裝船，其中該岩石安裝船包含船體及懸掛於該船體上之落管，其中該落管包含遠端噴出管，該遠端噴出管具有界定噴出管通道之噴出管外壁，該噴出管通道具有噴出管中心線且結束於遠端噴出管出口，其中該噴出管以傾角配置，其中該噴出管在安裝方向上引導所述岩石通過該噴出管通道朝向並通過該噴出管出口，其中該岩石安裝船包含配有用於輸出水流之水流出口的水流產生器，其中該水流出口配置於該噴出管處以撞擊經過該噴出管通道之岩石。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a rock installation vessel for installing rocks onto a seabed, wherein the rock installation vessel comprises a hull and a fall pipe that is suspended from the hull, wherein the fall pipe comprises a distal ejection pipe having an ejection pipe outer wall defining an ejection pipe channel having an ejection pipe center line, and that ends in a distal ejection pipe outlet, wherein the ejection pipe is arranged under an inclination angle, wherein the ejection pipe guides the rocks through the ejection pipe channel towards and through the ejection pipe outlet in an installation direction, wherein the rock installation vessel comprises a water flow generator with a water flow outlet for outputting a water flow, wherein the water flow outlet is arranged at the ejection pipe to impact rocks passing through the ejection pipe channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:岩石安裝船</p>  
        <p type="p">2:落管</p>  
        <p type="p">3:海床</p>  
        <p type="p">4:海</p>  
        <p type="p">5:岩石</p>  
        <p type="p">6:岩石堆</p>  
        <p type="p">7:船體</p>  
        <p type="p">8:船尾</p>  
        <p type="p">9:主艙</p>  
        <p type="p">10:離岸結構/單樁</p>  
        <p type="p">11:支柱</p>  
        <p type="p">12:頂部</p>  
        <p type="p">13:漏斗</p>  
        <p type="p">14:落管連接器</p>  
        <p type="p">15:展開機構</p>  
        <p type="p">16:A形框架</p>  
        <p type="p">17:拉線</p>  
        <p type="p">18:纜線滑車</p>  
        <p type="p">19:甲板</p>  
        <p type="p">20:遠端噴出管</p>  
        <p type="p">40:輸送管</p>  
        <p type="p">50:離岸工地</p>  
        <p type="p">51:水線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1981" publication-number="202626878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯胺-醯亞胺系薄膜、其製備方法以及包含其之覆蓋窗及顯示裝置</chinese-title>  
        <english-title>POLYAMIDE-IMIDE-BASED FILM, PREPARATION METHOD THEREOF, AND COVER WINDOW AND DISPLAY DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08G73/14</main-classification>  
        <further-classification edition="200601120260319B">C08J5/22</further-classification>  
        <further-classification edition="200601120260319B">C07D249/18</further-classification>  
        <further-classification edition="200601120260319B">C08L79/08</further-classification>  
        <further-classification edition="201801120260319B">C09D7/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商邁克沃解決方案股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROWORKS SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李辰雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鎭龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐允喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YUN-HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭多宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, DAWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋基允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, KI YOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例旨在提供一種聚醯胺-醯亞胺系薄膜，該薄膜包含一無氟原子的聚醯胺-醯亞胺系聚合物，且基於50μm的薄膜厚度，其具有5GPa或更高的模量，因而其在光學性質、機械性質和紫外射線阻斷率上是優異的；一種用於製備該薄膜之方法；及包含該薄膜之覆蓋窗和顯示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments aim to provide a polyamide-imide-based film, which comprises a polyamide-imide-based polymer that is free of fluorine atoms and which has a modulus of 5 GPa or more based on a film thickness of 50 µm, whereby it is excellent in optical properties, mechanical properties, and ultraviolet ray blocking rates; a process for preparing the same; and a cover window and a display device comprising the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:聚醯胺-醯亞胺系薄膜</p>  
        <p type="p">102:第二側</p>  
        <p type="p">200:功能層</p>  
        <p type="p">300:覆蓋窗</p>  
        <p type="p">400:顯示單元</p>  
        <p type="p">500:黏著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1982" publication-number="202628093"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628093.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置及記憶體系統</chinese-title>  
        <english-title>MEMORY DEVICE AND MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G11C8/08</main-classification>  
        <further-classification edition="200601120260102B">G11C5/02</further-classification>  
        <further-classification edition="200601120260102B">G11C7/06</further-classification>  
        <further-classification edition="200601120260102B">G11C8/10</further-classification>  
        <further-classification edition="200601120260102B">G11C7/10</further-classification>  
        <further-classification edition="200601120260102B">G11C29/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白承旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, SEUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郑　会柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, HOIJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳意想</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, EUI SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置，包括：多個單元塊，沿列方向和行方向以陣列形式被排列，並被劃分為在列方向上共用多條子字元線的單元組；控制電路，被配置為在存取操作期間，激活在單元組之中被排列在第一單元組中的第一子字元線和被排列在第二單元組中的第二子字元線，並控制資料被輸入到第一單元組中的奇數號單元塊和第二單元組中的偶數號單元塊/從第一單元組中的奇數號單元塊和第二單元組中的偶數號單元塊被輸出，或者被輸入到第一單元組中的偶數號單元塊和第二單元組中的奇數號單元塊/從第一單元組中的偶數號單元塊和第二單元組中的奇數號單元塊被輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a plurality of cell blocks arranged in an array in a row direction and a column direction, and divided into cell groups that share a plurality of sub-word lines in the row direction; and a control circuit configured to, during an access operation, activate a first sub-word line arranged in a first cell group and a second sub-word line arranged in a second cell group, among the cell groups, and control data to be input/output to/from odd-numbered cell blocks in the first cell group and even-numbered cell blocks in the second cell group, or to/from even-numbered cell blocks in the first cell group and odd-numbered cell blocks in the second cell group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">110:核心區域</p>  
        <p type="p">112:記憶體單元陣列</p>  
        <p type="p">114:感測放大電路</p>  
        <p type="p">120:列控制電路</p>  
        <p type="p">130:行控制電路</p>  
        <p type="p">140:感測控制電路</p>  
        <p type="p">150:模式設置電路</p>  
        <p type="p">160:錯誤校正碼引擎</p>  
        <p type="p">162:ECC編碼器</p>  
        <p type="p">164:ECC解碼器</p>  
        <p type="p">170:資料輸入/輸出電路</p>  
        <p type="p">172:資料輸入電路</p>  
        <p type="p">174:資料輸出電路</p>  
        <p type="p">182:命令/位址緩衝器</p>  
        <p type="p">183:命令解碼器</p>  
        <p type="p">184:位址產生電路</p>  
        <p type="p">190:路徑控制電路</p>  
        <p type="p">192:序列選擇電路</p>  
        <p type="p">194:路徑設置電路</p>  
        <p type="p">ACT:激活命令</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLSA_EN:位元線感測控制訊號</p>  
        <p type="p">CADD:行位址</p>  
        <p type="p">C/A:命令/位址訊號</p>  
        <p type="p">DATA:資料</p>  
        <p type="p">DATA’:資料</p>  
        <p type="p">DQ:資料</p>  
        <p type="p">ECC:錯誤校正碼</p>  
        <p type="p">EVEN_DN:第二下部控制訊號</p>  
        <p type="p">EVEN_UP:第二上部控制訊號</p>  
        <p type="p">IADD:內部位址</p>  
        <p type="p">ICMD:內部命令</p>  
        <p type="p">LSAEN_EV#:第二局部感測控制訊號</p>  
        <p type="p">LSAEN_OD#:第一局部感測控制訊號</p>  
        <p type="p">LSA_EN:初步局部感測控制訊號</p>  
        <p type="p">MAT_SEL#:單元組選擇訊號</p>  
        <p type="p">MC:記憶體單元</p>  
        <p type="p">MRS:模式設置命令</p>  
        <p type="p">ODEN_DN:第一下部控制訊號</p>  
        <p type="p">ODEN_UP:第一上部控制訊號</p>  
        <p type="p">PCG:預充電命令</p>  
        <p type="p">RADD:列位址</p>  
        <p type="p">RADD_PAIR:配對列位址</p>  
        <p type="p">RD:讀取命令</p>  
        <p type="p">SEL_MD:模式選擇訊號</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">WT:寫入命令</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1983" publication-number="202627217"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627217.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電解槽、電解槽模組與流場模組</chinese-title>  
        <english-title>ELECTROLYZER CELL, ELECTROLYZER MODULE, AND FLOW FIELD MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260304B">C25B9/19</main-classification>  
        <further-classification edition="202101120260304B">C25B11/02</further-classification>  
        <further-classification edition="200601120260304B">C25B1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃靖穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許豐家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FENG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊又璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電解槽包含一本體、一第一電解堆疊單元、一第二電解堆疊單元以及一分流板。本體具有一第一端板以及一第二端板。第一電解堆疊單元以及第二電解堆疊單元設置於第一端板與第二端板之間。分流板設置於第一電解堆疊單元與第二電解堆疊單元之間，且分流板用以分配一電解液，使電解液分別進入第一電解堆疊單元與第二電解堆疊單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrolyzer cell includes a body, a first electrolytic stack unit, a second electrolytic stack unit, and a flow distribution plate. The body has a first end plate and a second end plate. The first electrolytic stack unit and the second electrolytic stack unit are disposed between the first end plate and the second end plate. The flow distribution plate is disposed between the first electrolytic stack unit and the second electrolytic stack unit, and is configured to distribute an electrolyte so that the electrolyte is respectively introduced into the first electrolytic stack unit and the second electrolytic stack unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電解槽</p>  
        <p type="p">10:本體</p>  
        <p type="p">11:第一電解堆疊單元</p>  
        <p type="p">12:第二電解堆疊單元</p>  
        <p type="p">13:分流板</p>  
        <p type="p">101:第一端板</p>  
        <p type="p">102:第二端板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1984" publication-number="202626530"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626530.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二次純水裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">C02F1/42</main-classification>  
        <further-classification edition="202301120260401B">C02F1/44</further-classification>  
        <further-classification edition="202301120260401B">C02F9/00</further-classification>  
        <further-classification edition="200601120260401B">B01D61/14</further-classification>  
        <further-classification edition="201701120260401B">B01J47/00</further-classification>  
        <further-classification edition="200601120260401B">F16L9/12</further-classification>  
        <further-classification edition="200601120260401B">F16L11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, MOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種二次純水裝置，為包括一次純水裝置及二次純水裝置的超純水製造系統中的二次純水裝置，其中所述二次純水裝置依次具有非再生式離子交換裝置以及超濾膜，至少較所述非再生式離子交換裝置更靠下游側處藉由非氟系且為非氯系的合成樹脂配管連接。作為非氟系且為非氯系的合成樹脂配管，使用聚丙烯或聚乙烯等聚烯烴系樹脂製配管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:原水槽</p>  
        <p type="p">2:預處理裝置</p>  
        <p type="p">3:過濾水槽</p>  
        <p type="p">4:一次純水裝置</p>  
        <p type="p">5:純水槽</p>  
        <p type="p">6、8、13、15、16、16A、18、35、37:配管</p>  
        <p type="p">7:脫氣膜裝置</p>  
        <p type="p">9:DO計</p>  
        <p type="p">10:TOC分解單元</p>  
        <p type="p">11:UV氧化器</p>  
        <p type="p">12:離子交換器(混床式、二床三塔式或四床五塔式等的任一種)</p>  
        <p type="p">14:閥門</p>  
        <p type="p">17:子罐</p>  
        <p type="p">20:二次純水裝置(子系統)</p>  
        <p type="p">36:使用點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1985" publication-number="202626985"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626985.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物、硬化膜及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C09D133/08</main-classification>  
        <further-classification edition="200601120260325B">C08L33/10</further-classification>  
        <further-classification edition="200601120260325B">C08F290/04</further-classification>  
        <further-classification edition="200601120260325B">C08F2/06</further-classification>  
        <further-classification edition="202301120260325B">H10K50/115</further-classification>  
        <further-classification edition="202601320260325B">C09K113/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩脇寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAWAKI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川直優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, NAOMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種保存穩定性提高的硬化性組成物、由該硬化性組成物形成的硬化膜、以及包含該硬化膜的顯示裝置。一種硬化性組成物，包含半導體粒子（A）及聚合性化合物（B），所述硬化性組成物中，所述聚合性化合物（B）包含兩種以上的二官能丙烯酸酯化合物、以及一種以上的三官能以上的(甲基)丙烯酸酯化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:堤部</p>  
        <p type="p">3:發光元件</p>  
        <p type="p">4:硬化膜(波長轉換膜、硬化膜畫素)</p>  
        <p type="p">5:彩色濾波器</p>  
        <p type="p">6:阻氣層</p>  
        <p type="p">10:顯示構件</p>  
        <p type="p">L1:垂直尺寸</p>  
        <p type="p">L2:水平尺寸</p>  
        <p type="p">L3:發光元件的水平尺寸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1986" publication-number="202626535"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626535.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">C02F9/00</main-classification>  
        <further-classification edition="202301120260401B">C02F1/00</further-classification>  
        <further-classification edition="202301120260401B">C02F1/20</further-classification>  
        <further-classification edition="202301120260401B">C02F1/28</further-classification>  
        <further-classification edition="202301120260401B">C02F1/32</further-classification>  
        <further-classification edition="202301120260401B">C02F1/42</further-classification>  
        <further-classification edition="202301120260401B">C02F1/44</further-classification>  
        <further-classification edition="202301120260401B">C02F3/00</further-classification>  
        <further-classification edition="200601120260401B">G01N33/18</further-classification>  
        <further-classification edition="200601320260401B">C02F101/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, MOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栩内優仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOCHINAI, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明具有：第一原水供給路徑；第二原水供給路徑；水處理裝置；水質檢測機構，對第二原水的水質進行檢測；以及送水目的地切換機構，切換第二原水的送水目的地。本發明包括僅對易分解性TOC成分進行檢測的第一TOC計、以及對易分解性TOC成分及難分解性TOC成分進行檢測的第二TOC計，基於所述第二TOC計檢測出的第二TOC值與第一TOC計檢測出的第一TOC值之差來切換送水目的地。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:預處理系統</p>  
        <p type="p">2、8、10、13、14、15:配管</p>  
        <p type="p">3:罐</p>  
        <p type="p">4:一次純水系統</p>  
        <p type="p">5:子罐</p>  
        <p type="p">6:子系統</p>  
        <p type="p">7:使用點</p>  
        <p type="p">9:回收水處理設備(處理設備)</p>  
        <p type="p">11:第一TOC計</p>  
        <p type="p">12:第二TOC計</p>  
        <p type="p">13a、14a、15a:開閉閥(閥)</p>  
        <p type="p">16:設備用水系統</p>  
        <p type="p">17:排水系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1987" publication-number="202627066"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627066.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗液、半導體基板的處理方法、電子元件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C11D17/00</main-classification>  
        <further-classification edition="200601120260401B">C11D1/34</further-classification>  
        <further-classification edition="200601120260401B">C11D1/62</further-classification>  
        <further-classification edition="200601120260401B">C11D3/28</further-classification>  
        <further-classification edition="200601120260401B">C11D7/32</further-classification>  
        <further-classification edition="200601120260401B">C23F11/14</further-classification>  
        <further-classification edition="202601120260401B">H10P52/00</further-classification>  
        <further-classification edition="202601120260401B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田新平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠抑制鎢的溶解且殘渣的去除性優異的清洗液。本發明的清洗液為在實施了化學機械研磨處理之含有鎢之半導體基板中所使用之清洗液，其含有：嘌呤化合物；及選自包括磷系陰離子性界面活性劑、陽離子性界面活性劑及胍化合物之群組中之1種以上，pH為8～12。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1988" publication-number="202626617"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626617.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D277/22</main-classification>  
        <further-classification edition="200601120260401B">C07D333/12</further-classification>  
        <further-classification edition="200601120260401B">C07D333/54</further-classification>  
        <further-classification edition="200601120260401B">C08K5/45</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">C09K9/02</further-classification>  
        <further-classification edition="200601120260401B">G02B5/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木一弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江面香織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EZURA, KAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片山由貴子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAYAMA, YUKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種組成物，其以質量%計包含2%以上20%以下之光致變色色素、3%以上15%以下之樹脂、及65%以上95%以下之溶劑，上述光致變色色素係選自下述式（1）所示之材料中之1種以上： &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="403px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，X表示氫原子、鹵素原子、或者任意地包含1個以上之氮原子、硫原子、氧原子之碳數1～10之直鏈狀、支鏈狀、或環狀之取代基，Y&lt;sup&gt;1&lt;/sup&gt;、Y&lt;sup&gt;2&lt;/sup&gt;表示碳原子或氮原子，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;表示氫原子、或者任意地包含1個以上之氮原子、硫原子、氧原子之碳數1～10之直鏈狀、支鏈狀、或環狀之取代基，其中，於具有R&lt;sup&gt;1&lt;/sup&gt;與R&lt;sup&gt;2&lt;/sup&gt;彼此鍵結之結構時，表示包含R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;之環狀之取代基，於具有R&lt;sup&gt;3&lt;/sup&gt;與R&lt;sup&gt;4&lt;/sup&gt;彼此鍵結之結構時，表示包含R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;之環狀之取代基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1989" publication-number="202627706"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627706.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理腔室內的氣體注入單元的開發的建模方法</chinese-title>  
        <english-title>MODELING APPROACH FOR DEVELOPMENT OF GAS INJECTION UNIT WITHIN PROCESSING CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G05B17/00</main-classification>  
        <further-classification edition="200601120260323B">C23C16/52</further-classification>  
        <further-classification edition="202001120260323B">G06F30/3308</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉潘　戴維拉格哈维</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEERAPPAN, DEVI RAGHAVEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德伍拉帕利　巴拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVULAPALLI, BALAJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴許　施里拉姆喬蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DASH, SHREERAM JYOTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波拉克里斯那　阿吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALAKRISHNA, AJIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭詹　亞洛克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANJAN, ALOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">帶有氣體注入單元的處理腔室模型用於根據不同參數值的組合進行模擬製程條件。模擬的製程條件對應於製程變數的不同測量，例如蝕刻副產物去除速率。根據模擬結果，確定一組最佳的參數值，以優化該變數。氣體注入單元是根據這組最佳參數值設計的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A model of a processing chamber with a gas injection unit is used to perform simulated process conditions based on different combinations of parameter values. The simulated process conditions correspond to different measurements of a process variable, such as a etch byproduct removal rate. Based on the simulations, an optimal set of parameter values is determined that optimizes the variable. The gas injection unit is designed in accordance with this optimal set of parameter values.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:近晶圓氣體注入(NWGI)單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1990" publication-number="202627041"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627041.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵電性向列型液晶介質</chinese-title>  
        <english-title>FERROELECTRIC NEMATIC LIQUID CRYSTALLINE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C09K19/04</main-classification>  
        <further-classification edition="200601120260323B">C09K19/12</further-classification>  
        <further-classification edition="200601120260323B">C09K19/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜賓　瑞秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUFFIN, RACHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, IZUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史坦澤　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEINZER, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷德　喬瑟菲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADE, JOSEFINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種新型LC介質，其在環境溫度下展現鐵電性向列(N&lt;sub&gt;F&lt;/sub&gt;)相。其包含至少一或多種具有兩個環之式I化合物， &lt;br/&gt;&lt;img align="absmiddle" height="101px" width="603px" file="ed10215.JPG" alt="ed10215.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; 其中可變基團具有本文及申請專利範圍中所指示之含義。該等液晶材料適用於電光、電子、機電應用及具有極高介電導電率之材料的其他應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The new LC media exhibit a ferroelectric nematic (N&lt;sub&gt;F&lt;/sub&gt;) phase at ambient temperature. They comprise at least one or more compounds of formula I having two rings, &lt;br/&gt;&lt;img align="absmiddle" height="96px" width="586px" file="ed10216.JPG" alt="ed10216.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; in which the variable groups have the meanings indicated in the text and in the claims. The liquid crystal materials are useful for electro-optics, electronics, electro-mechanic and other applications for materials with very high dielectric permittivity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1991" publication-number="202628810"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628810.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理腔室的可調鏡佈置及相關方法和設備</chinese-title>  
        <english-title>ADJUSTABLE MIRROR ARRANGEMENTS FOR PROCESS CHAMBERS, AND RELATED METHODS AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260309B">H10P34/42</main-classification>  
        <further-classification edition="202601120260309B">H10P74/20</further-classification>  
        <further-classification edition="202601120260309B">H10P72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷斯堤格　艾巴斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RASTEGAR, ABBAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種加熱設備，包括用於處理腔室的可調鏡，以及與半導體製造相關的方法和設備。在一或多個實施例中，處理腔室包括腔室主體，至少部分定義處理空間。在處理空間中設置了基板支撐件。複數個熱源可操作以加熱處理空間。支撐板設置在處理空間的外側。一或多個反射面安裝在支撐板上。一或多個反射面可操作以透過繞至少一個軸的移動，將輻射導向處理空間中的目標位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a heating apparatus including adjustable mirrors for process chambers, and related methods and apparatus for semiconductor manufacturing. In one or more embodiments, a process chamber includes a chamber body at least partially defining a processing volume. A substrate support is disposed in the processing volume. A plurality of heat sources are operable to heat the processing volume. A support plate is disposed outwardly of the processing volume. One or more reflective surfaces are mounted to the support plate. The one or more reflective surfaces are operable to direct radiation to a target location in the processing volume by moving about at least one axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">102:基板</p>  
        <p type="p">106:基板支撐</p>  
        <p type="p">107:升舉銷孔</p>  
        <p type="p">108:第一板</p>  
        <p type="p">110:板</p>  
        <p type="p">111:襯墊</p>  
        <p type="p">112:流量模組</p>  
        <p type="p">114:氣體進氣口</p>  
        <p type="p">116:氣體排氣口</p>  
        <p type="p">117:預熱環</p>  
        <p type="p">118:軸</p>  
        <p type="p">119:臂</p>  
        <p type="p">121:運動組件</p>  
        <p type="p">132:升舉銷</p>  
        <p type="p">134:升舉銷停止</p>  
        <p type="p">135:軸</p>  
        <p type="p">136:處理空間</p>  
        <p type="p">138:淨化空間</p>  
        <p type="p">139:臂</p>  
        <p type="p">141:熱源</p>  
        <p type="p">143:熱源</p>  
        <p type="p">145:熱源模組</p>  
        <p type="p">148:主體</p>  
        <p type="p">150:上表面</p>  
        <p type="p">151:製程氣體源</p>  
        <p type="p">153:清洗氣體源</p>  
        <p type="p">154:蓋板</p>  
        <p type="p">156:上部主體</p>  
        <p type="p">157:排氣泵</p>  
        <p type="p">161:頂表面</p>  
        <p type="p">162:淨化氣體源</p>  
        <p type="p">163:上襯墊</p>  
        <p type="p">164:淨化氣體進氣口</p>  
        <p type="p">171:反射體支撐/支撐板</p>  
        <p type="p">172:鏡</p>  
        <p type="p">173:反射面</p>  
        <p type="p">177:冷卻通道</p>  
        <p type="p">178:排氣系統</p>  
        <p type="p">190:控制器</p>  
        <p type="p">191:記憶體</p>  
        <p type="p">192:支援電路</p>  
        <p type="p">193:CPU</p>  
        <p type="p">195:下方感測器</p>  
        <p type="p">196:上方感測器</p>  
        <p type="p">A:變數</p>  
        <p type="p">P1:製程氣體</p>  
        <p type="p">P2:淨化氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1992" publication-number="202627155"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627155.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硼催化介電膜沉積</chinese-title>  
        <english-title>BORON CATALYZED DIELECTRIC FILM DEPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C16/30</main-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="200601120260401B">C23C16/52</further-classification>  
        <further-classification edition="202601120260401B">H10P14/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡路塔瑞奇　蘭卡摩Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALUTARAGE, LAKMAL C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩利　馬克Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALY, MARK J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布洋　巴斯卡爾喬帝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHUYAN, BHASKAR JYOTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩曼　莉莎Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENMAN, LISA J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯賽尼　希伊瑪哈穆德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSSEINI, SEYEDMAHMOUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹　阿爾卡普拉瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAN, ARKAPRAVA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　齊周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供在處理腔室中沉積介電膜的方法。這些方法包括將基板設置在位於處理腔室內的基座上。將第一含前驅物的氣體混合物提供至處理腔室中。第一含前驅物的氣體混合物包括含硼前驅物及載送氣體，該載送氣體選自由氬氣、氮氣及氦氣組成的群組。將第二含前驅物的氣體混合物提供至處理腔室中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods of depositing dielectric films in processing chambers. The methods include disposing a substrate on a susceptor disposed within a processing chamber. A first precursor-containing gas mixture is provided into the processing chamber. The first precursor-containing gas mixture includes a boron-containing precursor and a carrier gas selected from the group consisting of argon, nitrogen, and helium. A second precursor-containing gas mixture is provided into the processing chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">302:操作</p>  
        <p type="p">304:操作</p>  
        <p type="p">306:操作</p>  
        <p type="p">308:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1993" publication-number="202627711"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627711.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138321</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數值控制系統及機器人控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G05B19/18</main-classification>  
        <further-classification edition="200601120260330B">G05B19/402</further-classification>  
        <further-classification edition="200601120260330B">B25J9/16</further-classification>  
        <further-classification edition="200601120260330B">B25J13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今西一剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMANISHI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供能使運用效率提升、且能防止加工時間增加之數值控制系統及機器人控制裝置。數值控制系統，具備：數值控制裝置、及機器人控制裝置；上述機器人控制裝置，具備：取得部，取得對工件進行測量後之測量結果；第1變數記憶部，儲存包含上述測量結果之機器人控制用變數；以及第1資料傳送接收部，將儲存於上述第1變數記憶部之上述機器人控制用變數傳送至上述數值控制裝置；上述數值控制裝置，具備：程式解析部，解析儲存於第2變數記憶部之上述機器人控制用變數，並輸出包含於上述機器人控制用變數之上述測量結果；測量結果解析部，解析上述測量結果；以及加工執行部，根據由上述測量結果解析部對上述測量結果之解析結果來執行上述工作機械之加工。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:數值控制系統</p>  
        <p type="p">2:工作機械</p>  
        <p type="p">3:機器人</p>  
        <p type="p">4:數值控制裝置</p>  
        <p type="p">5:機器人控制裝置</p>  
        <p type="p">31:測量部</p>  
        <p type="p">40:記憶部</p>  
        <p type="p">41:程式輸入部</p>  
        <p type="p">42:程式解析部</p>  
        <p type="p">43:測量結果解析部</p>  
        <p type="p">44:加工執行部</p>  
        <p type="p">45:I/O控制部</p>  
        <p type="p">46:補間控制部</p>  
        <p type="p">47:伺服控制部</p>  
        <p type="p">48:變數記憶部(第2變數記憶部)</p>  
        <p type="p">49:資料傳送接收部(第2資料傳送接收部)</p>  
        <p type="p">51:記憶部</p>  
        <p type="p">52:程式輸入部</p>  
        <p type="p">53:輸入解析部</p>  
        <p type="p">54:軌跡控制部</p>  
        <p type="p">55:伺服控制部</p>  
        <p type="p">56:取得部</p>  
        <p type="p">57:變數記憶部(第1變數記憶部)</p>  
        <p type="p">58:資料傳送接收部(第1資料傳送接收部)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1994" publication-number="202626987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗料組成物及塗膜形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C09D133/14</main-classification>  
        <further-classification edition="200601120260318B">C08F2/10</further-classification>  
        <further-classification edition="200601120260318B">C09K3/30</further-classification>  
        <further-classification edition="201401120260318B">C09D11/40</further-classification>  
        <further-classification edition="201801120260318B">C09D7/40</further-classification>  
        <further-classification edition="200601120260318B">C09D5/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商關西塗料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANSAI PAINT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管本圭司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAMOTO, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中岡晴河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAOKA, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永井彰典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於提供一種噴出穩定性優異之塗料組成物。本揭示之塗料組成物具有以下構成。&lt;br/&gt; 本揭示之塗料組成物係含有含羥基樹脂(A)及硬化劑(B)且可以噴墨方式塗裝至被塗物者，前述塗料組成物於溫度23℃、頻率0.5Hz及應力測定範圍0.1～20Pa之條件下之動態黏彈性測定中，以應力為0.1Pa時之儲存彈性模數G'&lt;sub&gt;1&lt;/sub&gt;為基準，儲存彈性模數首次減少10%時之應力σ&lt;sub&gt;2&lt;/sub&gt;係於1.0～15Pa之範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1995" publication-number="202627712"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627712.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數值控制裝置及工具機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">G05B19/18</main-classification>  
        <further-classification edition="200601120260331B">G05B19/425</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立木伸吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIKI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">數值控制裝置根據加工程式來控制工具機，前述工具機具備：用於使保持工件的工作台進行旋轉定位之旋轉定位軸、用於使保持工具的工具頭與工作台相對地定位之複數個相對定位軸、用於夾持前述旋轉定位軸之夾持機構、及用於交換保持於前述工具頭的工具之工具交換裝置，前述數值控制裝置具備協調控制部，前述協調控制部是當驅動前述旋轉定位軸的指令與交換前述工具的指令同時被給予時，使前述相對定位軸之中的至少1個對象軸開始進行往預定的工具交換位置的移動，並且在與前述對象軸的移動開始的同時或移動中，使前述夾持機構開始進行前述旋轉定位軸的鬆開動作，在前述對象軸抵達預定的退避位置之後，使前述旋轉定位軸的動作開始。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:工具機</p>  
        <p type="p">11:工作台</p>  
        <p type="p">12:工具頭</p>  
        <p type="p">13:工具交換裝置</p>  
        <p type="p">14:夾持機構</p>  
        <p type="p">20:數值控制裝置</p>  
        <p type="p">21:協調控制部</p>  
        <p type="p">22:鬆開位置設定部</p>  
        <p type="p">23:退避位置設定部</p>  
        <p type="p">Ab:旋轉定位軸</p>  
        <p type="p">Ac:主軸</p>  
        <p type="p">Ax:X軸(相對定位軸)</p>  
        <p type="p">Ay:Y軸(相對定位軸)</p>  
        <p type="p">Az:Z軸(相對定位軸、對象軸)</p>  
        <p type="p">T:工具</p>  
        <p type="p">W:工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1996" publication-number="202626508"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626508.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138352</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低介電損耗樹脂組成物用填充劑、低介電損耗樹脂組成物、高頻設備用成形體及高頻設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C01F5/28</main-classification>  
        <further-classification edition="200601120260318B">C01G25/04</further-classification>  
        <further-classification edition="200601120260318B">C08K3/16</further-classification>  
        <further-classification edition="200601120260318B">C08L101/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯特拉化工公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STELLA CHEMIFA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原啓伍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, KEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鷹取浩明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKATORI, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊澤伸哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAZAWA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田理来</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, RIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤良憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上一孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷部類</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEBE, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西田哲郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIDA, TETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種熱膨脹率小、低介電特性及耐濕性優異的無機填充劑且係可適用於電路基板等電子零件及資訊通信設備等之低介電損耗樹脂組成物用填充劑、低介電損耗樹脂組成物、高頻設備用成形體及高頻設備。本發明為一種低介電損耗樹脂組成物用填充劑，其特徵在於：包含具有1×10&lt;sup&gt;-6&lt;/sup&gt;(1/K)以下之熱膨脹率的無機填充劑，無機填充劑的介電正切於頻率1GHz以上及溫度25℃時為0.002以下，並且在溫度85℃、相對濕度85%的環境下靜置48小時後，無機填充劑的質量變化率為0.5質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1997" publication-number="202627331"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627331.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空致動器、真空致動器之製造方法、旋轉導入機及機器人</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">F16J15/16</main-classification>  
        <further-classification edition="200601120260319B">F16C33/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納博特斯克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NABTESCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田孝治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾形直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之真空致動器具有：分隔壁，其將真空側空間與大氣側空間隔開；軸構件，其貫通前述分隔壁，傳遞驅動力；封接構件，其設置於前述分隔壁且相對於形成於前述軸構件之外周之滑動面滑動，將前述真空側空間與前述大氣側空間封接；及摩擦降低部，其形成於前述滑動面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:旋轉導入機</p>  
        <p type="p">20:封接分隔壁(分隔壁)</p>  
        <p type="p">21:貫通孔</p>  
        <p type="p">22:貫通構件</p>  
        <p type="p">23:壁部</p>  
        <p type="p">25:封接構件</p>  
        <p type="p">30:旋轉構件(軸構件)</p>  
        <p type="p">32:連接構件(軸構件)</p>  
        <p type="p">33:旋轉端部</p>  
        <p type="p">33b:螺栓</p>  
        <p type="p">35:封接構件</p>  
        <p type="p">50:封接機構</p>  
        <p type="p">100:旋轉輸入部(輸入部、變速機、減速機)</p>  
        <p type="p">A:大氣側空間(第1空間、大氣壓空間)</p>  
        <p type="p">F0:旋轉軸線</p>  
        <p type="p">T:環狀空間</p>  
        <p type="p">V:真空側空間(第2空間)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1998" publication-number="202627533"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627533.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260319B">G02B1/11</main-classification>  
        <further-classification edition="201901120260319B">B32B7/02</further-classification>  
        <further-classification edition="200601120260319B">B32B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼康依視路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKON-ESSILOR CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石村圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIMURA, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種於使用時可抑制重影（ghost）之產生之光學物品。本發明之光學物品依序具有第1抗反射膜、透鏡基材及第2抗反射膜，且於第1抗反射膜之反射光譜中，於波長400～510 nm內具有表示極小值之波長X1，於波長580～730 nm內具有表示極小值之波長X2，於波長X1與波長X2之間具有表示最大值之波長X3，於第2抗反射膜之反射光譜中，於波長400～510 nm內具有表示極小值之波長Y1，於波長580～730 nm內具有表示極小值之波長Y2，於波長Y1與波長Y2之間具有表示最大值之波長Y3，上述光學物品滿足下述要件1及要件2中之任一者。 &lt;br/&gt;要件1：波長X3與波長Y1之差及波長X3與波長Y2之差中之任一者為15 nm以下 &lt;br/&gt;要件2：波長Y3與波長X1之差及波長Y3與波長X2之差中之任一者為15 nm以下</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1999" publication-number="202628773"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628773.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251110B">H10K59/40</main-classification>  
        <further-classification edition="202301120251110B">H10K59/126</further-classification>  
        <further-classification edition="202301120251110B">H10K59/10</further-classification>  
        <further-classification edition="202301120251110B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹奎漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, KYUHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李多榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DAYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露，一種顯示裝置包含：顯示區域，包含多個子像素；非顯示區域，設置於顯示區域外側並包含邊框區域；多個堤壩結構，設置於邊框區域中；封裝部，設置於該些堤壩結構上；觸控構件，設置於封裝部上並包含觸控感測器、觸控絕緣層及鈍化層；透鏡，設置於觸控構件上；以及保護層，設置於透鏡上；其中鈍化層覆蓋延伸至邊框區域之觸控絕緣層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display device including a display area including a plurality of sub-pixels, a non-display area disposed outward of the display area and including a bezel area, a plurality of dams disposed in the bezel area, an encapsulation portion disposed on the plurality of dams, a touch member disposed on the encapsulation portion and including a touch sensor, a touch insulating layer, and a passivation layer, a lens disposed on the touch member, and a protective layer disposed on the lens, wherein the passivation layer covers the touch insulating layer extending to the bezel area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AA:顯示區域</p>  
        <p type="p">BDA:可彎曲區域</p>  
        <p type="p">BZA:邊框區域</p>  
        <p type="p">NAA:非顯示區域</p>  
        <p type="p">PD:接墊部分</p>  
        <p type="p">PDA:接墊區域</p>  
        <p type="p">TL:切割線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2000" publication-number="202627476"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627476.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢測與監測癌症的補體蛋白C8γ次單元生物標記物</chinese-title>  
        <english-title>COMPLEMENT PROTEIN C8 GAMMA BIOMARKERS FOR DETECTING AND MONITORING CANCERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G01N33/68</main-classification>  
        <further-classification edition="202601120260401B">G01N33/5752</further-classification>  
        <further-classification edition="200601120260401B">G01N27/447</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昇捷生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN JET BIOTECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡有光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAY, YEOU-GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭志玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種診斷一患者之癌症健康狀態或癌症健康狀態變化、或診斷一患者發生或存在一癌症之風險的方法，該方法包含：檢測來自該患者之一血漿樣本中對應於含補體蛋白C8γ次單元之複合結構的一或多個生物標記物數值；並根據該等生物標記物數值，判斷該患者是否罹患癌症、是否具有癌症健康狀態變化、或是否具有癌症風險，其中該癌症較佳為肺癌（LC）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for diagnosing a cancer health state, or a change in cancer health state in a patient, or for diagnosing a risk of the change or presence of a cancer in a patient, comprising determining, in a plasma sample from said patient, one or more biomarker values that correspond to complement protein C8 gamma-containing complex structures, and assigning the patient as having or not having cancer, or having or not having a change in cancer health state, or having or not having a risk of cancer based on said biomarker values, wherein said cancer is preferably lung cancer (LC).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2001" publication-number="202628808"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628808.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>束線離子植入機以及其對半導體層堆疊進行加工的方法</chinese-title>  
        <english-title>BEAM-LINE ION IMPLANTER AND METHODS OF PROCESSING A SEMICONDUCTOR LAYER STACK USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P30/20</main-classification>  
        <further-classification edition="202601120260331B">H10P30/22</further-classification>  
        <further-classification edition="202601120260331B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈塔拉　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUTALA, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蒂亞　斯瓦斯蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATIA, SWASTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴　輝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, HUIXIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種對半導體層堆疊進行加工的方法，所述半導體層堆疊包括以堆疊佈置形式設置的基板層、特徵層、硬遮罩層及光阻層，光阻層界定開口，所述方法包括：對半導體層堆疊實行離子植入製程，其中將由離子化摻雜劑物質形成的離子束引導至光阻層的頂表面處；以及對半導體層堆疊實行烘烤製程，由此使光阻層緻密化且更不容易受蝕刻的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of processing a semiconductor layer stack including a substrate layer, a feature layer, a hardmask layer, and a photoresist layer disposed in a stacked arrangement, the photoresist layer defining an opening, the method including performing an ion implantation process on the semiconductor layer stack, wherein an ion beam formed of an ionized dopant species is directed at a top surface of the photoresist layer, and performing a baking process on the semiconductor layer stack, whereby the photoresist layer is densified and is made less susceptible to etching.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、110、120、130、140、150、160、170、180:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2002" publication-number="202626396"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626396.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可調整腳踏板之兒童座椅</chinese-title>  
        <english-title>CHILD SEAT WITH ADJUSTABLE FOOTREST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B60N2/26</main-classification>  
        <further-classification edition="200601120260331B">B60N2/28</further-classification>  
        <further-classification edition="201801120260331B">B60N2/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊德Ｓ　哈姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLYDE S, HARMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊夫　馬爾姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEIF, MALM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯Ｊ　霍斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREW J, HORST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURTIS M., HARTENSTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於一車輛的兒童座椅系統，該兒童座椅系統包括：一兒童座椅，該兒童座椅具有一座椅底部，該座椅底部包括一座椅支撐表面；以及一腿托，該腿托經組態以支撐該兒童座椅之一乘坐者的一腿部之至少一部分。該腿托可以可移除地連接至該兒童座椅，並在連接至該座椅支撐表面時自該座椅支撐表面向前延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child seat system for use in a vehicle includes a child seat having a seat bottom including a seat support surface and a leg rest configured to support at least a portion of a leg of an occupant of the child seat. The leg rest is removably connectable to the child seat and extends forward from the seat support surface when connected to the seat support surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:兒童座椅系統</p>  
        <p type="p">22:支撐底座</p>  
        <p type="p">24:兒童座椅</p>  
        <p type="p">25:座椅外殼</p>  
        <p type="p">26:座椅靠背部分</p>  
        <p type="p">28:座椅底部</p>  
        <p type="p">30:直立支撐表面</p>  
        <p type="p">32:第一端或頂部</p>  
        <p type="p">34:第二相對端或底部</p>  
        <p type="p">36:第一直立側構件</p>  
        <p type="p">38:第一側</p>  
        <p type="p">40:第二直立側構件</p>  
        <p type="p">46:頭枕</p>  
        <p type="p">50:座椅支撐表面</p>  
        <p type="p">52:第一端或正面/前端</p>  
        <p type="p">58:第一側</p>  
        <p type="p">56:第一座椅側構件</p>  
        <p type="p">60:第二座椅側構件</p>  
        <p type="p">66a:第一槽</p>  
        <p type="p">66b:第二槽</p>  
        <p type="p">72:底座座椅部分</p>  
        <p type="p">74:底座靠背部分</p>  
        <p type="p">76:第一底座構件</p>  
        <p type="p">78:底表面</p>  
        <p type="p">80:第二底座構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2003" publication-number="202626399"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626399.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可旋轉兒童座椅</chinese-title>  
        <english-title>ROTATABLE CHILD SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B60N2/28</main-classification>  
        <further-classification edition="201801120260327B">B60N2/806</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扎卡里Ｃ　哈滕斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZACHARY C, HARTENSTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯Ｊ　霍斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREW J, HORST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯Ｊ　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREW J, TAYLOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施例，一種兒童座椅包括：一座椅殼體，該座椅殼體具有至少一個頭枕導軌；及一頭枕，該頭枕包括至少一個安裝臂，該至少一個安裝臂可收容在該至少一個頭枕導軌內。一鎖棘爪配置在該至少一個安裝臂處。該鎖棘爪經配置以在該至少一個安裝臂已經插入至該至少一個頭枕導軌中之後自動地防止該頭枕與該至少一個頭枕導軌分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment, a child seat includes a seat shell having at least one headrest guide track and a headrest including at least one mounting arm receivable within the at least one headrest guide track. A lock pawl is arranged at the at least one mounting arm. The lock pawl is arranged to automatically prevent separation of the headrest from the at least one headrest guide track after the at least one mounting arm has been inserted into the at least one headrest guide track.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">246:頭枕</p>  
        <p type="p">248:頭枕本體</p>  
        <p type="p">250:背部</p>  
        <p type="p">252:第一頭枕側構件</p>  
        <p type="p">254:第二頭枕側構件</p>  
        <p type="p">256:頭部收容空腔</p>  
        <p type="p">258:下部部分</p>  
        <p type="p">260:底端</p>  
        <p type="p">262a:第一安裝臂</p>  
        <p type="p">262b:第二安裝臂</p>  
        <p type="p">264a:遠端</p>  
        <p type="p">264b:遠端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2004" publication-number="202626751"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626751.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138550</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅奈米線之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C08F2/38</main-classification>  
        <further-classification edition="200601120260319B">C01G3/14</further-classification>  
        <further-classification edition="200601120260319B">C07D307/62</further-classification>  
        <further-classification edition="200601120260319B">B22F9/24</further-classification>  
        <further-classification edition="202201120260319B">B22F1/054</further-classification>  
        <further-classification edition="202201120260319B">B22F1/062</further-classification>  
        <further-classification edition="200601120260319B">C22C9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大林健人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBAYASHI, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種銅奈米線之製造方法，所獲得之銅奈米線之選擇率優異，且能夠以簡便之構成實施。 本發明之銅奈米線之製造方法包括下述步驟1。 步驟1：將包含氧化銅(a)、鹵離子(b)、非離子性高分子化合物(c)、烷基四級銨離子(d)、還原劑(e)及水(f)之混合液設為50℃以上，而使銅奈米線析出之步驟</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2005" publication-number="202625990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>眼罩</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">A61F9/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>町屋綾佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHIYA, AYAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種能夠提昇功能體之緊貼性之眼罩。 &lt;br/&gt;本發明之眼罩具備：本體部，其具有在佩戴時覆蓋佩戴者之至少眼睛周邊之形狀；功能體，其設置於本體部；及一對耳掛部，其等安裝於本體部之左右方向兩端部；本體部具有下側貫通部，該下側貫通部於本體部之左右方向之中央部，從本體部之下緣部向上緣部延伸且於本體部之前後方向貫通，功能體以至少一部分位於下側貫通部與至少一個耳掛部之間之方式設置於本體部，耳掛部具有可供佩戴者之耳朵插入之插入部，耳掛部相對於本體部之左右方向傾斜安裝，在左右方向上通過下側貫通部之上端之第1假想線與通過下側貫通部之上端及插入部之左右方向之前端之第2假想線所成的角為10°以上35°以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:眼罩</p>  
        <p type="p">10:本體部</p>  
        <p type="p">10A:第1本體部</p>  
        <p type="p">10B:第2本體部</p>  
        <p type="p">11:上緣部</p>  
        <p type="p">12:下緣部</p>  
        <p type="p">13:側緣部</p>  
        <p type="p">14:上側貫通部</p>  
        <p type="p">15:下側貫通部</p>  
        <p type="p">16:上側內緣部</p>  
        <p type="p">17:下側內緣部</p>  
        <p type="p">20:功能體</p>  
        <p type="p">30:耳掛部</p>  
        <p type="p">31:耳掛部本體</p>  
        <p type="p">31a:上邊</p>  
        <p type="p">31b:下邊</p>  
        <p type="p">31c:第1側邊</p>  
        <p type="p">31d:第2側邊</p>  
        <p type="p">32:插入部</p>  
        <p type="p">50:外表面片材</p>  
        <p type="p">A1:接合區域</p>  
        <p type="p">A2:非接合區域</p>  
        <p type="p">VL3:第3假想線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2006" publication-number="202626766"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626766.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性元件、印刷配線板及印刷配線板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">C08F283/06</further-classification>  
        <further-classification edition="200601120260401B">C08F290/00</further-classification>  
        <further-classification edition="200601120260401B">C08K3/22</further-classification>  
        <further-classification edition="200601120260401B">C08K3/36</further-classification>  
        <further-classification edition="200601120260401B">C08K5/17</further-classification>  
        <further-classification edition="200601120260401B">C08K5/372</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/09</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪岡諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKIOKA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部宏平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮坂昌宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASAKA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野尻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOJIRI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村彰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之感光性元件具備支撐膜及形成於前述支撐膜上之感光層，前述感光層含有酸改質含乙烯基樹脂、光聚合起始劑及無機填料，前述無機填料的折射率為1.48以上且1.75以下，前述感光層在380nm的波長下，每18μm厚度示出0.40以上且1.05以下的吸光度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:感光性元件</p>  
        <p type="p">10:支撐膜</p>  
        <p type="p">20:感光層</p>  
        <p type="p">30:保護膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2007" publication-number="202628842"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628842.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磨粒、漿料、研磨方法、零件之製造方法及半導體零件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P52/00</main-classification>  
        <further-classification edition="201201120260323B">B24B37/00</further-classification>  
        <further-classification edition="200601120260323B">C09K3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木快</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磨粒，其用於對氮化矽進行研磨，前述磨粒包含鈰系粒子，前述鈰系粒子經以矽烷化合物進行表面處理。一種漿料，其含有前述磨粒。一種研磨方法，其包括使用前述漿料對含有氮化矽之被研磨構件進行研磨之步驟。一種零件之製造方法，其包括使用藉由前述研磨方法進行了研磨之被研磨構件而獲得零件之步驟。一種半導體零件之製造方法，其包括使用藉由前述研磨方法進行了研磨之被研磨構件而獲得半導體零件之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2008" publication-number="202626526"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626526.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低超純水中ＴＯＣ之裝置</chinese-title>  
        <english-title>DEVICE FOR TOC REDUCTION IN ULTRAPURE WATER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">C02F1/32</main-classification>  
        <further-classification edition="202301120260401B">C02F1/72</further-classification>  
        <further-classification edition="200601120260401B">B01J19/12</further-classification>  
        <further-classification edition="200601120260401B">B01J19/24</further-classification>  
        <further-classification edition="200601320260401B">C02F101/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商沃威沃公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OVIVO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德維利爾斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVILLERS, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞辰　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYCHEN, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了藉由UV輻射減少TOC，在超純水生產過程中，一個由石英套管包圍的圓柱形UV反應器，其環形水流通道寬度不超過10 mm至15 mm。這使得水在環形區域內高度暴露於185 nm波長的UV輻射，以及所有其他小於200 nm的波長。為了最佳化該區域內水的混合，提供了多個位置的擋板或擾動器，以實現不同層液體的混合，從而促進水在石英管周圍的徑向運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">For TOC reduction by UV radiation, in the production of ultrapure water, a cylindrical UV reactor surrounded by a quartz sleeve radiates through an annular water flow channel no more than 10 mm to 15 mm wide. This causes the water to circulate in the annular zone highly exposed to the 185 nm wavelength of the UV radiation, as well as all other wavelengths under 200 nm. For optimization of mixing of the water in the zone, baffles or perturbators are provided at a series of locations to effect mixing of different layers of liquid thus promoting radial movement of the water around the quartz tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">16:擋板</p>  
        <p type="p">18:反應器管/圓柱形殼體</p>  
        <p type="p">22:石英套管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2009" publication-number="202627700"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627700.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138579</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於極紫外線（ＥＵＶ）阻劑層的乾式顯影的批次處理工具</chinese-title>  
        <english-title>BATCH PROCESSING TOOL FOR DRY DEVELOP OF EXTREME ULTRA VIOLET (EUV) RESIST LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G03F7/36</main-classification>  
        <further-classification edition="200601120260319B">G03F7/004</further-classification>  
        <further-classification edition="201201120260319B">G03F1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡贊姆　納斯琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAZEM, NASRIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃特基　魯迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOJTECKI, RUDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的實施例關於將基板上的阻劑層顯影的方法，該阻劑層已經過微影術製程選擇性暴露。在實施例中，該方法包括在腔室中將阻劑層暴露於包含有機酸或酮中的一者或兩者的氣體，暴露時間至少十分鐘，其中該氣體選擇性移除阻劑層的未暴露的部分，以在阻劑層中形成圖案，並且其中該阻劑層包含金屬。該方法還可以包括淨化腔室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to a method of developing a resist layer on a substrate that has been selectively exposed with a lithography process. In an embodiment the method includes exposing the resist layer to a gas including one or both of an organic acid or a ketone in a chamber with an exposure time that is at least ten minutes, where the gas selectively removes an unexposed portion of the resist layer to form a pattern in the resist layer, and where the resist layer includes a metal. The method may further include purging the chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">270:製程</p>  
        <p type="p">271:操作</p>  
        <p type="p">272:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2010" publication-number="202628828"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628828.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法</chinese-title>  
        <english-title>ETCHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P50/20</main-classification>  
        <further-classification edition="202601120260316B">H10P50/28</further-classification>  
        <further-classification edition="200601120260316B">C09K13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛發科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULVAC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長田大和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSADA, YAMATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隣嘉津彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONARI, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, YOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本篤明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, ATSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案係提供去除氮化矽膜的表面上所形成之自然氧化膜的蝕刻方法。該蝕刻方法包含: 對於蝕刻對象供給氟化氫氣體之後再供給自由基而藉此蝕刻氮化矽膜的表面氧化物層的步驟（步驟S13、步驟S14）以及重複進行多次對於表面氧化物層經蝕刻之蝕刻對象供給氟化氫氣體之後再供給自由基的循環（步驟S16至步驟S18），藉此相對於氧化矽膜選擇性蝕刻氮化矽膜；氮化矽膜相對於氧化矽膜的蝕刻量之比為選擇比，蝕刻表面氧化物層時的處理條件所具有的第1選擇比小於選擇性蝕刻氮化矽膜時的處理條件所具有的第2選擇比。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11、S12、S13、S14、S15、S16、S17、S18、S19:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2011" publication-number="202627687"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627687.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板熱處理裝置及塗覆設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G03F7/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耿其健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENG, QIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉暢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仰庶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳添喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TIANZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種基板熱處理裝置及塗覆設備。基板熱處理裝置包括：腔體，設置有可開閉地基板輸送口；熱板，設置於腔體內，用於承載和加熱基板；進氣機構，用於向腔體內輸送潔淨氣體；排氣機構，用於排出腔體內的氣體；其中，排氣機構包括整流板和排氣口，整流板設置在腔體內，並且位於熱板的上方，整流板與部分腔體圍設形成緩衝腔，整流板設置有若干通氣孔，排氣口與緩衝腔導通，排氣機構被配置為：將熱板與整流板之間的氣體通過若干通氣孔抽入緩衝腔，再由排氣口排出。本申請實現了改善基板熱處理裝置內的氣流氛圍，降低基板熱處理期間基板表面的塗覆層產生缺陷的風險的技術效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板熱處理裝置</p>  
        <p type="p">111:腔體</p>  
        <p type="p">1111:基板輸送口</p>  
        <p type="p">1112:下腔體</p>  
        <p type="p">1113:上腔體</p>  
        <p type="p">1114:升降機構</p>  
        <p type="p">112:熱板</p>  
        <p type="p">113:進氣機構</p>  
        <p type="p">1131:進氣管</p>  
        <p type="p">1134:進氣接口</p>  
        <p type="p">1135:進氣孔</p>  
        <p type="p">1136:邊緣進氣口</p>  
        <p type="p">114:排氣機構</p>  
        <p type="p">1141:整流板</p>  
        <p type="p">1142:排氣口</p>  
        <p type="p">1143:通氣孔</p>  
        <p type="p">1144:緩衝腔</p>  
        <p type="p">115:基板托舉機構</p>  
        <p type="p">20:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2012" publication-number="202626767"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626767.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、物品及馬達</chinese-title>  
        <english-title>COMPOSITION,ARTICLE,AND MOTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F279/02</further-classification>  
        <further-classification edition="200601120260401B">C08F291/02</further-classification>  
        <further-classification edition="200601120260401B">C09J133/00</further-classification>  
        <further-classification edition="200601120260401B">C09J151/04</further-classification>  
        <further-classification edition="200601120260401B">C09J4/00</further-classification>  
        <further-classification edition="200601120260401B">C09J11/06</further-classification>  
        <further-classification edition="202501120260401B">H02K15/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芹澤伸也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERIZAWA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組成物，其包含聚合性單體（A）、彈性體（B）、聚合起始劑（C）、還原劑（D）及金屬密接性賦予劑（E），前述組成物中，前述還原劑（D）含有包含選自由Fe、Ni、Co及Cu組成的群組中之1種或2種以上的過渡金屬元素之過渡金屬鹽，前述金屬密接性賦予劑（E）包含磷酸酯與胺的中和鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition comprising a polymerizable monomer (A), an elastomer (B), a polymerization initiator (C), a reducing agent (D), and a metal adhesion promoter (E), wherein the reducing agent (D) contains a transition metal salt including one or more transition metal elements selected from the group consisting of Fe, Ni, Co, and Cu, and the metal adhesion promoter (E) contains a neutralization salt of a phosphate ester and an amine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2013" publication-number="202625983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有客製化墊片的矯正托槽及其製造方法</chinese-title>  
        <english-title>ORTHODONTIC BRACKETS WITH CUSTOMIZED PAD AND MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61C7/02</main-classification>  
        <further-classification edition="200601120260331B">A61C13/07</further-classification>  
        <further-classification edition="200601120260331B">A61C7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商數珍科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEARL DIGITAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹　恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱永紳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　大文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林桓毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭露的托槽包括一個客製化的墊片，該墊片具有偏移定義的包絡面和複數固位結構。這些固位結構可以包括凸起、凹陷或離散的不連續結構，同時還包含至少一對斷裂結構和移除結構，以方便可控地移除托槽。這種結構設計增強了黏著劑的接觸，提高了黏合強度，並使矯正治療結束時托槽的移除更加容易和安全。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed bracket comprises a customized pad with an offset-defined envelope surface and a plurality of retentive features. These retentive features may include protrusions, depressions, or discrete discontinuous structures, while fracture features and removal features are incorporated to facilitate controlled debonding. Such structural designs enhance adhesive contact, improve bonding strength, and enable easier, safer bracket removal at the end of orthodontic treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:托槽</p>  
        <p type="p">11:墊片</p>  
        <p type="p">111:基底</p>  
        <p type="p">12:固位結構</p>  
        <p type="p">13:槽溝</p>  
        <p type="p">14:包絡面</p>  
        <p type="p">15:斷裂結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2014" publication-number="202627054"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627054.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138729</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含寡聚步驟及非均相寡聚步驟之用於自包含輕烯烴之進料製備燃油之方法</chinese-title>  
        <english-title>PROCESS FOR PRODUCING FUEL FROM A FEEDSTOCK COMPRISING LIGHT OLEFINS, COMPRISING AN OLIGOMERIZATION STEP AND A HETEROGENEOUS OLIGOMERIZATION STEP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C10G69/12</main-classification>  
        <further-classification edition="200601120260320B">C10G7/00</further-classification>  
        <further-classification edition="200601120260320B">C10G50/00</further-classification>  
        <further-classification edition="200601120260320B">C10L1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商ＩＦＰ新能源公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IFP ENERGIES NOUVELLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬治　皮耶　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORG, PIERRE-ANTOINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁　皮耶　伊凡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, PIERRE-YVES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮高瑞爾　傑羅姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIGOURIER, JEROME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布帕特　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUPAT, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維尼爾　丹尼爾　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VINEL, DANIEL-JEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於自烯烴進料製備航空燃油之方法，該方法包含以下步驟： &lt;br/&gt;a)對該進料進行分餾，且獲得至少如下物質的步驟： &lt;br/&gt;- 富含乙烯及丙烯之第一分餾產物； &lt;br/&gt;- 富含具有至少3個碳原子之烯烴化合物的第二分餾產物； &lt;br/&gt;b)對來自步驟a)之該第一分餾產物之至少一部分進行寡聚，且獲得至少一種第一流出物的第一步驟； &lt;br/&gt;c)對至少如下物質進行寡聚，且獲得第二流出物的第二步驟： &lt;br/&gt;- 來自步驟b)之該第一流出物的一部分， &lt;br/&gt;- 來自步驟a)之該第二分餾產物的一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a process for producing aviation fuel from an olefinic feedstock, said process comprising the following steps: &lt;br/&gt;a) a step of fractionating said feedstock and obtaining at least: &lt;br/&gt;- a first fraction rich in ethylene and propylene; &lt;br/&gt;- a second fraction rich in olefinic compounds having at least 3 carbon atoms; &lt;br/&gt;b) a first step of oligomerizing at least one portion of the first fraction from step a) and obtaining at least one first effluent; &lt;br/&gt;c) a second step of oligomerizing at least: &lt;br/&gt;- one portion of the first effluent from step b), &lt;br/&gt;- one portion of the second fraction from step a), and obtaining a second effluent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:進料/烯烴進料</p>  
        <p type="p">11:第一分餾產物</p>  
        <p type="p">12:第二分餾產物/分餾產物</p>  
        <p type="p">13:重分餾產物</p>  
        <p type="p">14:分餾產物</p>  
        <p type="p">15:分餾產物</p>  
        <p type="p">16:分餾產物</p>  
        <p type="p">18:分餾產物</p>  
        <p type="p">20:料流</p>  
        <p type="p">21:流出物</p>  
        <p type="p">22:料流</p>  
        <p type="p">23:排放流</p>  
        <p type="p">24:流出物</p>  
        <p type="p">25:氣體料流</p>  
        <p type="p">26:石腦油餾分</p>  
        <p type="p">27:航空燃油餾分</p>  
        <p type="p">28:製氣油餾分</p>  
        <p type="p">a:分餾步驟</p>  
        <p type="p">b:第一寡聚步驟/寡聚步驟</p>  
        <p type="p">c:寡聚步驟/非均相寡聚步驟</p>  
        <p type="p">d:烯烴氫化步驟</p>  
        <p type="p">e:分餾步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2015" publication-number="202626186"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626186.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微細氣泡供給系統、微細氣泡供給裝置及微細氣泡供給裝置的控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260331B">B01F23/20</main-classification>  
        <further-classification edition="202201120260331B">B01F25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商金星股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINBOSHI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林克義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KATSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津久井伸幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKUI, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井一史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, KAZUFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微細氣泡供給裝置，將包含微細氣泡的水供給至儲存槽，且具備；第一溫度感測器，測量儲存槽所儲存的水之水溫；泵，將儲存槽所儲存的水吸入並排出；產生器，供給有從泵排出的水，使所供給的水產生微氣泡及超細氣泡，且將用於儲存至儲存槽的包含微細氣泡的水輸出；以及控制裝置，基於前述第一溫度感測器所測量的水溫，對前述產生器所使前述供給的水產生的微氣泡的濃度及超細氣泡的濃度進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:微細氣泡供給裝置</p>  
        <p type="p">CNT:控制裝置</p>  
        <p type="p">G:產生器</p>  
        <p type="p">G1:第一產生器</p>  
        <p type="p">G2:第二產生器</p>  
        <p type="p">K:環境溫度調整裝置</p>  
        <p type="p">L1:第一配管</p>  
        <p type="p">L2:第二配管</p>  
        <p type="p">L2a:第一分歧部</p>  
        <p type="p">L2b:第二分歧部</p>  
        <p type="p">Lin:輸入部</p>  
        <p type="p">Lout:輸出部</p>  
        <p type="p">M:存儲部</p>  
        <p type="p">P:泵</p>  
        <p type="p">Pin:吸入口</p>  
        <p type="p">Po:排出口</p>  
        <p type="p">Po1:第一排出口</p>  
        <p type="p">Po2:第二排出口</p>  
        <p type="p">S1:第一溫度感測器</p>  
        <p type="p">S2:第二溫度感測器</p>  
        <p type="p">T:儲存槽</p>  
        <p type="p">V:水量用電動閥裝置</p>  
        <p type="p">V1:第一電動閥</p>  
        <p type="p">V2:第二電動閥</p>  
        <p type="p">Y:水溫調整裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2016" publication-number="202626862"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626862.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138748</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚脲、以及聚脲組成物及成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C08G71/02</main-classification>  
        <further-classification edition="200601120260317B">C08L75/02</further-classification>  
        <further-classification edition="200601120260317B">C08G12/38</further-classification>  
        <further-classification edition="200601120260317B">C08F2/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹野龍也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASANO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋宏昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, HIROMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川村理久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, RIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福原忠仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUHARA, TADAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中原淳裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAHARA, ATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚脲，其數量平均分子量Mn為6,000~50,000，在熔點+20℃測定之剪切速度0.1(1/s)的剪切黏度ηEa(Pa．s)相對於在熔點+20℃測定之剪切速度10(1/s)的剪切黏度ηEb(Pa．s)之比(ηEa/ηEb)為1.1~10.0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2017" publication-number="202626863"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626863.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚脲組成物及其製造方法、以及成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G71/02</main-classification>  
        <further-classification edition="200601120260401B">C08L75/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹野龍也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASANO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川村理久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, RIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋宏昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, HIROMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福原忠仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUHARA, TADAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中原淳裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAHARA, ATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">(1)一種聚脲組成物，其係包含聚脲與鎳元素之聚脲組成物，前述聚脲組成物中之前述鎳元素的含量為0.05~100質量ppm、或(2)一種聚脲組成物，其係包含聚脲與鈉元素之聚脲組成物，前述聚脲組成物中之前述鈉元素的含量為30~3,000質量ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2018" publication-number="202627829"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627829.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138784</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料傳輸</chinese-title>  
        <english-title>DATA TRANSFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G06F13/40</main-classification>  
        <further-classification edition="200601120260401B">G06F13/42</further-classification>  
        <further-classification edition="200601120260401B">G06F13/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾波科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHAWAVE SEMI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕斯卡雷拉　藍道約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASCARELLA, RANDALL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉米瑞茲　凱撒艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMIREZ, CESAR AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔瓦拉吉里　阿布希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAVARAGIRI, ABHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查克拉亞　維什瓦納特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAKRALA, VISWANATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖瑪拉　艾索克庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUMMALA, ASHOK KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢彌爾頓　崔維斯貝利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMILTON, TRAVIS BAILEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉費爾　查爾斯安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIEFER, CHARLES ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里希那穆提　戈皮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAMURTHY, GOPI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種包含橋接電路系統的設備，該橋接電路系統將處理電路系統耦合到複數個埠控制器的分配子集，用於將處理電路系統連接到鏈路夥伴。橋接電路系統經配置為根據頻寬配額在處理電路系統與分配子集之間執行資料傳輸。該設備具備控制電路系統，其接收識別分配子集的配置資訊，並且將頻寬份額分配到在分配子集中識別的每個埠控制器。控制電路系統經配置為基於配置資訊來決定頻寬份額。控制電路系統經配置為對於在分配子集中識別的每個給定埠控制器，根據分配到給定埠控制器的頻寬份額來實施限制以限制給定埠控制器與處理電路系統之間的資料傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided an apparatus comprising bridge circuitry to couple processing circuitry to an allocated subset of a plurality of port controllers for connecting the processing circuitry to link partners. The bridge circuitry is configured to perform a data transfer between the processing circuitry and the allocated subset according to a bandwidth quota. The apparatus is provided with control circuitry to receive configuration information identifying the allocated subset, and to allocate a bandwidth share to each port controller identified in the allocated subset. The control circuitry is configured to determine the bandwidth share based on the configuration information. The control circuitry is configured, for each given port controller identified in the allocated subset, to implement a restriction to limit the data transfer between the given port controller and the processing circuitry according to the bandwidth share allocated to the given port controller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:積體電路</p>  
        <p type="p">4:計算電路單元</p>  
        <p type="p">6:計算電路單元</p>  
        <p type="p">8:記憶體系統互連</p>  
        <p type="p">9:歸屬節點電路系統</p>  
        <p type="p">10:記憶體儲存電路系統</p>  
        <p type="p">12:橋接電路系統</p>  
        <p type="p">14:根埠</p>  
        <p type="p">16:外部通訊鏈路</p>  
        <p type="p">19:端點裝置</p>  
        <p type="p">20:交換機</p>  
        <p type="p">22:晶片到晶片鏈路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2019" publication-number="202626185"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626185.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滲透氣化膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">B01D69/02</main-classification>  
        <further-classification edition="200601120260330B">B01D69/08</further-classification>  
        <further-classification edition="200601120260330B">B01D69/10</further-classification>  
        <further-classification edition="200601120260330B">B01D69/12</further-classification>  
        <further-classification edition="200601120260330B">B01D71/06</further-classification>  
        <further-classification edition="200601120260330B">C07C29/76</further-classification>  
        <further-classification edition="200601120260330B">C07C31/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野依慎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOYORI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阪口彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGUCHI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">滲透氣化膜100具備包含多孔質粒子11之分離功能層10。多孔質粒子11之平均粒徑D(μm)相對於分離功能層10之厚度T(μm)之比為0.03以上且未達1.0。多孔質粒子11例如具有0.35 nm以上之平均細孔直徑P。多孔質粒子11例如包含選自由金屬有機結構體、氧化矽、及沸石所組成之群中之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:分離功能層</p>  
        <p type="p">11:多孔質粒子</p>  
        <p type="p">11p:細孔</p>  
        <p type="p">12:基質</p>  
        <p type="p">D:多孔質粒子之平均粒徑</p>  
        <p type="p">T:分離功能層之厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2020" publication-number="202627151"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627151.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用貴金屬催化劑之無鹵化物金屬膜沉積</chinese-title>  
        <english-title>DEPOSITION OF HALIDE-FREE METAL FILMS USING NOBLE METAL CATALYSTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C23C16/06</main-classification>  
        <further-classification edition="200601120260316B">C23C16/455</further-classification>  
        <further-classification edition="200601120260316B">C23C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊翁奇尼　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEONCINI, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金龍珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YONG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　杰叢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, JIECONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩利　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALY, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了在半導體基板上沉積金屬膜的方法。在基板上形成貴金屬層，貴金屬層作為隨後在貴金屬層上形成金屬膜的催化劑。貴金屬層暴露於有機金屬前驅物和氫源以形成金屬膜。這些暴露可以是依序進行或同時進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for depositing metal films on a semiconductor substrate are described. A noble metal layer is formed on the substrate and serves as a catalyst for subsequent formation of a metal film on the noble metal layer. The noble metal layer is exposed to an organometallic precursor and a hydrogen source to form the metal film. The exposures can be sequential or simultaneous.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:基板</p>  
        <p type="p">203:頂表面</p>  
        <p type="p">204:貴金屬層</p>  
        <p type="p">205:貴金屬表面</p>  
        <p type="p">206:金屬膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2021" publication-number="202627691"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627691.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制設備、定位設備、微影設備及物品製造方法</chinese-title>  
        <english-title>CONTROL APPARATUS, POSITIONING APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G03F7/20</main-classification>  
        <further-classification edition="200601120260330B">G03F9/00</further-classification>  
        <further-classification edition="200601120260330B">G05B13/00</further-classification>  
        <further-classification edition="200601120260330B">G05B11/42</further-classification>  
        <further-classification edition="200601120260330B">G05D3/12</further-classification>  
        <further-classification edition="202601120260330B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本拓海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草柳博一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAYANAGI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝倉康伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKURA, YASUNOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了控制設備、定位設備、微影設備、物品製造方法和儲存媒體。控制設備基於由前饋控制器產生的前饋操控變數來控制對象。設備包括確定器，該確定器進行操作以基於指示對象中的控制誤差的變化的控制誤差資料串以及指示在特定操控變數被提供給對象時的對象的響應特性的響應資料串來確定前饋控制器的增益。確定器基於多次獲取的多個控制誤差資料串來產生由各個時間的對象的控制誤差的代表值構成的代表值資料串，並且基於代表值資料串和響應資料串來確定增益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Control apparatuses, positioning apparatuses, lithography apparatuses, article manufacturing methods, and storage mediums are provided herein. A control apparatus controls an object based on a feedforward manipulated variable generated by a feedforward controller. The apparatus includes a determinator that operates to determine a gain of the feedforward controller based on a control error data string indicating a change in control error in the object and a response data string indicating a response characteristic of the object when a specific manipulated variable is provided to the object. The determinator generates a representative value data string constituted by representative values of control errors of the object at respective times based on a plurality of control error data strings acquired over a plurality of times and determines the gain based on the representative value data string and the response data string.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:控制設備</p>  
        <p type="p">210:處理器</p>  
        <p type="p">211:前饋控制器</p>  
        <p type="p">213:確定器</p>  
        <p type="p">214:減法器</p>  
        <p type="p">215:反饋控制器</p>  
        <p type="p">220:對象</p>  
        <p type="p">601:儲存單元</p>  
        <p type="p">602:處理單元</p>  
        <p type="p">603:算術單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2022" publication-number="202628545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於對具有自尋址之ＩＴ基礎設施進行直接液冷（ＤＬＣ）的系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">H05K7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商威圖公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RITTAL GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡喬　阿隆索　胡安　卡洛斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CACHO ALONSO, JUAN CARLOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施耐德　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDER, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坤巴　普拉尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMBAR, PRASHANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁鐵生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種用於IT基礎設施進行直接液冷(DLC)的總成，其中，該總成包括至少一個IT機架(1)，其具有多個用於直接液冷(DLC)及/或IT基礎設施之機架式設備(2.1)的插槽(2)，其中，該總成具有包括控制設備(9)的匯流排系統(40)，該控制設備具有包括多個用於連接直接液冷(DLC)之機架式設備(2.1)的資料介面(42)之匯流排(41)，其特徵在於，該匯流排系統(40)具有針對直接液冷(DLC)之可連接至該匯流排(41)上的機架式設備(2.1)之自尋址。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:IT機架</p>  
        <p type="p">2:插槽</p>  
        <p type="p">2.1:機架式設備</p>  
        <p type="p">3:直流電壓供給</p>  
        <p type="p">5:母線</p>  
        <p type="p">6.1:第一盲插連接器</p>  
        <p type="p">6.2:第二盲插連接器</p>  
        <p type="p">7:冷卻劑分配通道</p>  
        <p type="p">9:控制設備</p>  
        <p type="p">10:膨脹水箱</p>  
        <p type="p">13:殼體</p>  
        <p type="p">40:匯流排系統</p>  
        <p type="p">41:匯流排</p>  
        <p type="p">42:資料介面</p>  
        <p type="p">CDU:冷卻劑分配單元</p>  
        <p type="p">PSU:整流器</p>  
        <p type="p">R:背面</p>  
        <p type="p">X:插接方向</p>  
        <p type="p">Z:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2023" publication-number="202628590"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628590.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括記憶體胞元串列之三維垂直非依電性記憶體裝置、其驅動方法及包括其之電子設備</chinese-title>  
        <english-title>THREE-DIMENSIONAL VERTICAL NONVOLATILE MEMORY DEVICE INCLUDING MEMORY CELL STRINGS, METHOD OF DRIVING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10B43/27</main-classification>  
        <further-classification edition="202301120260223B">H10B63/00</further-classification>  
        <further-classification edition="202501120260223B">H10D30/69</further-classification>  
        <further-classification edition="200601120260223B">G11C16/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玄昇潭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYUN, SEUNGDAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金裕珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴可籃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GARAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李珉賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔碩訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SEOKHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許浩碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, HOSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包括記憶體胞元串列之三維垂直非依電性記憶體裝置、其驅動方法及包括其之電子設備。一種三維垂直非依電性記憶體裝置包括：一通道層，其在一第一方向上延伸；閘極電極及間隔體，其在該第一方向上交替，該等閘極電極中之每一者及該等間隔體中之每一者在與該第一方向相交之一第二方向上延伸；一電化學層，其在該通道層與該等閘極電極之間以及在該通道層與該等間隔體之間在該第一方向上延伸；以及一阻擋層，其在該電化學層與該等閘極電極之間以及在該電化學層與該等間隔體之間在該第一方向上延伸。該電化學層及該通道層根據施加至該等閘極電極之一電壓使離子從該電化學層移動至該通道層，或反之亦然。該阻擋層包括在該第一方向上延伸且組配來根據施加至該等閘極電極之該電壓來捕獲電荷之一電荷捕獲層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to THREE-DIMENSIONAL VERTICAL NONVOLATILE MEMORY DEVICE INCLUDING MEMORY CELL STRINGS, METHOD OF DRIVING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME. A three-dimensional vertical non-volatile memory device includes a channel layer extending in a first direction, gate electrodes and spacers alternating in the first direction, each of the gate electrodes and each of the spacers extending in a second direction crossing the first direction, an electrochemical layer extending in the first direction between the channel layer and the gate electrodes and between the channel layer and the spacers, and a blocking layer extending in the first direction between the electrochemical layer and the gate electrodes and between the electrochemical layer and the spacers. The electrochemical layer and the channel layer move ions from the electrochemical layer to the channel layer or vice versa according to a voltage applied to the gate electrodes. The blocking layer includes a charge trap layer that extends in the first direction and is configured to trap charges according to the voltage applied to the gate electrodes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">311:絕緣間隔體</p>  
        <p type="p">312:閘極電極</p>  
        <p type="p">321:絕緣支撐件、閘極電極</p>  
        <p type="p">322:通道層</p>  
        <p type="p">323:電化學層</p>  
        <p type="p">324:阻擋層</p>  
        <p type="p">324a:電荷捕獲層</p>  
        <p type="p">324b:第一障壁層</p>  
        <p type="p">324c:第二障壁層</p>  
        <p type="p">CS:記憶體胞元串列</p>  
        <p type="p">d1,d2,d3,d4:厚度</p>  
        <p type="p">MC:記憶體胞元</p>  
        <p type="p">t1,t2:高度</p>  
        <p type="p">X:第二方向、方向</p>  
        <p type="p">Z:第一方向、方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2024" publication-number="202627818"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627818.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料儲存裝置和計算系統</chinese-title>  
        <english-title>DATA STORAGE DEVICE AND COMPUTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G06F12/0875</main-classification>  
        <further-classification edition="201601120251201B">G06F12/10</further-classification>  
        <further-classification edition="200601120251201B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪希在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HUI JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露了一種資料儲存裝置和計算系統。資料儲存裝置中包括反轉頁面表，所述反轉頁面表包括資料儲存裝置中包括的用於處理主機裝置的資料的第一記憶體的實體位址與大小大於第一記憶體的第二記憶體的至少部分儲存區域的邏輯位址之間的映射資訊。可以向主機裝置提供儲存虛擬記憶體，並且透過擴展主機裝置識別的實體記憶體的大小，可以提高主機裝置的資料處理性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application discloses a data storage device and computing system. The data storage device includes an inverted page table including mapping information between a physical address of a first memory, included in a data storage device and used for processing data of a host device, and a logical address of at least a partial storage area of a second memory having a size larger than the first memory is disclosed. A storage virtual memory may be provided to the host device, and by expanding the size of a physical memory recognized by the host device, the performance of data processing of the host device may be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:資料儲存裝置</p>  
        <p type="p">110:第一記憶體</p>  
        <p type="p">120:第二記憶體</p>  
        <p type="p">130:儲存記憶體管理單元(SCMMU)</p>  
        <p type="p">200:主機裝置</p>  
        <p type="p">210:處理器</p>  
        <p type="p">220:記憶體管理單元(MMU)</p>  
        <p type="p">400:儲存虛擬記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2025" publication-number="202626618"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626618.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含碘之（甲基）丙烯酸酯化合物及含碘之聚合物</chinese-title>  
        <english-title>IODINE-CONTAINING (METH)ACRYLIC ACID ESTER COMPOUND AND IODINE-CONTAINING POLYMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D307/83</main-classification>  
        <further-classification edition="200601120260401B">C08F220/32</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原広一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀內淳矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIUCHI, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤𨺓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越後雅敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECHIGO, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[摘要]本發明之課題為提供一種能夠製造對曝光光源之感度更提升之光阻層形成材料之化合物。作為解決手段，為提供式(I)表示之化合物。環A表示芳香環；X表示 &lt;br/&gt;-O-、-S-、-NH-、-NR&lt;sup&gt;N&lt;/sup&gt;-、-N(COR&lt;sup&gt;N&lt;/sup&gt;)-、-CO-、-O-CO-、 &lt;br/&gt;-CO-O-、-S-CO-、-CO-S-、-NH-CO-、-CO-NH-、-NR&lt;sup&gt;N&lt;/sup&gt;-CO-、-CO-NR&lt;sup&gt;N&lt;/sup&gt;-、-N(COR&lt;sup&gt;N&lt;/sup&gt;)-CO-，或-CO-N(COR&lt;sup&gt;N&lt;/sup&gt;)-；R&lt;sup&gt;N&lt;/sup&gt;表示亦可具有取代基之烴基；R&lt;sup&gt;1&lt;/sup&gt;表示氫原子、甲基或鹵素原子；R&lt;sup&gt;2&lt;/sup&gt;表示氫原子或取代基；R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;各自獨立表示氫原子或取代基，或R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;會一起鍵結並形成亦可具有取代基之非芳香環；R&lt;sup&gt;5&lt;/sup&gt;各自獨立表示取代基；a表示1以上之整數；b表示0或1以上之整數。 &lt;br/&gt;&lt;img align="absmiddle" height="284px" width="279px" file="ed10174.JPG" alt="ed10174.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a compound that can be used to produce a photoresist layer-forming material with improved sensitivity to an exposure light source. &lt;br/&gt;The solution is a compound represented by formula (I): Ring A represents an aromatic ring; X represents -O-, -S-, -NH-, -NR&lt;sup&gt;N&lt;/sup&gt;-, -N(COR&lt;sup&gt;N&lt;/sup&gt;)-, -CO-, -O-CO-, -CO-O-, -S-CO-, -CO-S-, -NH-CO-, -CO-NH-, -NR&lt;sup&gt;N&lt;/sup&gt;-CO-, -CO-NR&lt;sup&gt;N&lt;/sup&gt;-, -N(COR&lt;sup&gt;N&lt;/sup&gt;)-CO-, or -CO-N(COR&lt;sup&gt;N&lt;/sup&gt;)-; R&lt;sup&gt;N&lt;/sup&gt; represents a hydrocarbon group which may have a substituent; R&lt;sup&gt;1&lt;/sup&gt; represents a hydrogen atom, a methyl group, or a halogen atom; R&lt;sup&gt;2&lt;/sup&gt; represents a hydrogen atom or a substituent; R&lt;sup&gt;3&lt;/sup&gt; and R&lt;sup&gt;4&lt;/sup&gt; each independently represent a hydrogen atom or a substituent, or R&lt;sup&gt;3&lt;/sup&gt; and R&lt;sup&gt;4&lt;/sup&gt; are joined together to form a non-aromatic ring which may have a substituent; each R&lt;sup&gt;5&lt;/sup&gt; independently represents a substituent; a represents an integer of 1 or greater; and b represents 0 or an integer of 1 or greater. &lt;br/&gt;&lt;img align="absmiddle" height="303px" width="282px" file="ed10175.JPG" alt="ed10175.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2026" publication-number="202627670"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627670.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138912</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置、檢查裝置、資訊處理方法、檢查方法以及學習方法</chinese-title>  
        <english-title>INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AND LEARNING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260326B">G03F1/84</main-classification>  
        <further-classification edition="202301120260326B">G06N3/08</further-classification>  
        <further-classification edition="200601120260326B">G06T5/50</further-classification>  
        <further-classification edition="200601120260326B">G01N21/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷射科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASERTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林瑞基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能提升對於容易產生雜訊的區域的應對之資訊處理裝置、檢查裝置、資訊處理方法、檢查方法以及學習方法。本實施形態的資訊處理裝置200係具備：學習部210，係使模型進行學習；撮像影像取得部220，係取得撮像影像CI；參照影像生成部230，係生成參照影像RI；以及評價部240，係基於參照影像RI與撮像影像CI的比較來評價對象物300；學習部210係具有：殘差算定部212，係比較推定影像PI與監督影像TI來算定殘差LS，該推定影像PI為從訓練過程的模型所輸出的影像，該監督影像TI係包含撮像影像；以及判定部213，係在殘差LS滿足預定的條件之情形中判定成模型的訓練已經完成；殘差算定部212係基於差分影像DI來算定殘差LS。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢查裝置</p>  
        <p type="p">100:撮像裝置</p>  
        <p type="p">200:資訊處理裝置</p>  
        <p type="p">300:對象物</p>  
        <p type="p">310:EUV罩</p>  
        <p type="p">CI:撮像影像</p>  
        <p type="p">D10:設計資料</p>  
        <p type="p">M10:渲染模型</p>  
        <p type="p">RI:參照影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2027" publication-number="202626806"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626806.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱形眼鏡用處理液</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F220/02</main-classification>  
        <further-classification edition="200601120260401B">C08F220/28</further-classification>  
        <further-classification edition="200601120260401B">C08F220/36</further-classification>  
        <further-classification edition="200601120260401B">C08F220/58</further-classification>  
        <further-classification edition="200601120260401B">C08F220/60</further-classification>  
        <further-classification edition="200601120260401B">C08F230/02</further-classification>  
        <further-classification edition="200601120260401B">C09D133/00</further-classification>  
        <further-classification edition="200601120260401B">C09D143/02</further-classification>  
        <further-classification edition="200601120260401B">A01N57/12</further-classification>  
        <further-classification edition="200601120260401B">A61L12/14</further-classification>  
        <further-classification edition="200601120260401B">A61L27/34</further-classification>  
        <further-classification edition="200601120260401B">B65B55/02</further-classification>  
        <further-classification edition="200601120260401B">G02C7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOF CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木彩乃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, AYANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五反田龍矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTANDA, RYUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩切規郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAKIRI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種兼顧隱形眼鏡表面的親水性的提高與親水性提高效果的持久的隱形眼鏡用處理液。隱形眼鏡用處理液包含共聚物（P），所述共聚物（P）具有源自式（1a）的單體（a）、式（1b）或式（2b）的單體（b）、式（1c）的單體（c）的結構單元。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="216px" width="525px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（R&lt;sup&gt;1&lt;/sup&gt;為氫原子或甲基，X為O或NR&lt;sup&gt;2&lt;/sup&gt;，R&lt;sup&gt;2&lt;/sup&gt;為H或碳數1～4的烷基） &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="231px" width="446px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（R&lt;sup&gt;3&lt;/sup&gt;為氫原子或甲基，Y&lt;sup&gt;1&lt;/sup&gt;為O或NR&lt;sup&gt;4&lt;/sup&gt;，R&lt;sup&gt;4&lt;/sup&gt;為H或碳數1～4的烷基） &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="225px" width="541px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（R&lt;sup&gt;5&lt;/sup&gt;為氫原子或甲基，Y&lt;sup&gt;2&lt;/sup&gt;為O或NR&lt;sup&gt;6&lt;/sup&gt;，R&lt;sup&gt;6&lt;/sup&gt;為H或碳數1～4的烷基） &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="249px" width="394px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（R&lt;sup&gt;7&lt;/sup&gt;為氫原子或甲基，R&lt;sup&gt;8&lt;/sup&gt;為碳數1～10的烷基，Z為O或NR&lt;sup&gt;9&lt;/sup&gt;，R&lt;sup&gt;9&lt;/sup&gt;為H或碳數1～4的烷基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2028" publication-number="202626930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138922</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L9/06</main-classification>  
        <further-classification edition="200601120260401B">C08L71/12</further-classification>  
        <further-classification edition="200601120260401B">C08L79/04</further-classification>  
        <further-classification edition="200601120260401B">C08J5/24</further-classification>  
        <further-classification edition="200601120260401B">B32B27/00</further-classification>  
        <further-classification edition="200601120260401B">B32B15/08</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀将太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊勢谷優仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISEYA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤尚人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供樹脂組成物、以及硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置。本揭示之樹脂組成物，包含2官能之馬來醯亞胺化合物及3官能以上之馬來醯亞胺化合物，且3官能以上之馬來醯亞胺化合物之馬來醯亞胺基當量係200~349g/eq.。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2029" publication-number="202626872"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626872.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯胺酸、印刷基板材料、天線用基板材料、傳輸線路電纜材料、組成物、聚醯亞胺、印刷基板、天線用基板及傳輸線路電纜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G73/10</main-classification>  
        <further-classification edition="200601120260401B">C08L79/08</further-classification>  
        <further-classification edition="200601120260401B">H01B7/02</further-classification>  
        <further-classification edition="200601120260401B">H01Q1/38</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤枝謙太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIEDA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端泰典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山有紗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, ARISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示是有關於一種聚醯胺酸，其包含二胺單元及四羧酸單元，選自由所述二胺單元及所述四羧酸單元所組成的群組中的至少一種包含單元（X），所述單元（X）具有包含至少一個非芳香族烴基、且所述至少一個非芳香族烴基的合計碳數為9以上的基（X），以所述二胺單元及所述四羧酸單元的合計量為基準，所述單元（X）的含有率為12.0莫耳%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2030" publication-number="202626888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138982</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G79/06</main-classification>  
        <further-classification edition="200601120260401B">C08L85/02</further-classification>  
        <further-classification edition="200601120260401B">C08J5/24</further-classification>  
        <further-classification edition="200601120260401B">B32B27/00</further-classification>  
        <further-classification edition="200601120260401B">B32B15/08</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀将太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊勢谷優仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISEYA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田原正浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODAWARA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡村翔真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMURA, SHOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供樹脂組成物，以及硬化物、樹脂複合片、預浸體、覆金屬箔疊層板、印刷配線板、及半導體裝置。本揭示之樹脂組成物，包含式(I)表示之化合物(A)、及熱固性化合物(B)，熱固性化合物(B)包含3官能以上之馬來醯亞胺化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="268px" width="480px" file="ed10073.JPG" alt="ed10073.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2031" publication-number="202628203"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628203.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極及蓄電裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260324B">H01M4/133</main-classification>  
        <further-classification edition="201001120260324B">H01M10/052</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本特殊陶業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITERRA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井嶺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦廣幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本肯尼詩和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, KENNETH KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫛田美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSHIDA, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]&lt;br/&gt; 提供能降低在高溫環境下的不可逆容量之電極及蓄電裝置。&lt;br/&gt; [解決手段]&lt;br/&gt; 一種電極，其具有包含碳材料之複合材料層，其中於複合材料層的表面，相對於從利用X射線光電子能譜法而得之源自C-C鍵的能譜、源自C-O鍵的能譜、源自O-C=O鍵的能譜、源自碳酸根離子的能譜及源自C-F鍵的能譜所求得的碳之合計原子濃度，從源自O-C=O鍵之能譜所求得的以O-C=O鍵存在的碳之原子濃度的比例為0.065以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電極(負極)</p>  
        <p type="p">11:集電體</p>  
        <p type="p">12:複合材料層</p>  
        <p type="p">13:表面</p>  
        <p type="p">14:碳材料</p>  
        <p type="p">15:導電材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2032" publication-number="202628800"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628800.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微電子元件製造的電漿處理製程</chinese-title>  
        <english-title>PLASMA TREATMENT PROCESSES FOR MICROELECTRONIC DEVICE MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P14/24</main-classification>  
        <further-classification edition="200601120260331B">C23C16/513</further-classification>  
        <further-classification edition="200601120260331B">C23C16/06</further-classification>  
        <further-classification edition="200601120260331B">C23C16/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周瑞楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, RUINAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琚正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岑嘉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEN, JIAJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡雪菲　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHEFI, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　弦龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HSIENLUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於微電子元件製造的電漿處理製程。亦描述作為微電子元件製造製程一部分的互連結構的製造方法。這些方法包括在基板上形成介電層，介電層包括至少一個特徵，特徵定義了具有側壁和於基板上之底部的間隙；使用電漿處理基板以形成經處理的底表面；藉由將基板暴露於阻擋物質，在經處理的底表面上形成阻擋層；選擇性地在側壁上沉積阻障層；選擇性地在側壁上的阻障層上沉積金屬襯墊；移除阻擋層；以及執行間隙填充製程，以用間隙填充材料填充間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Plasma treatment processes employed in the manufacture of microelectronic devices are described. Methods of manufacturing interconnect structures as part of a microelectronic device fabrication process are also described. The methods include forming a dielectric layer including at least one feature defining a gap having sidewalls and a bottom on a substrate; treating the substrate with a plasma to form a treated bottom surface; forming a blocking layer on the treated bottom surface by exposing the substrate to a blocking species; selectively depositing a barrier layer on the sidewalls; selectively depositing a metal liner on the barrier layer on the sidewalls; removing the blocking layer; and performing a gap fill process to fill the gap with a gapfill material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:方法</p>  
        <p type="p">11:操作</p>  
        <p type="p">12:操作</p>  
        <p type="p">13:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2033" publication-number="202627121"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627121.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138996</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快削性銅合金、及快削性銅合金之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C22C9/04</main-classification>  
        <further-classification edition="200601120260331B">C22F1/08</further-classification>  
        <further-classification edition="200601120260331B">C22C1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須崎孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZAKI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤弘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之快削性銅合金之特徵在於，該快削性銅合金包含特定量之Cu、Si、Pb及P，且作為任意元素包含特定量之Bi，剩餘部分包含Zn及不可避免雜質，前述不可避免雜質中Fe、Mn、Co及Cr之總計含量未達特定量，且Al含量未達特定量，從各元素之組成規定之組成關係式f1、從金屬組織之構成相之面積率規定之組織關係式f2、f3、f4分別設為特定範圍內，改質之β1相於在過氧化氫與氨水之混合液中蝕刻時可觀察到晶界。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2034" publication-number="202626880"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626880.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138998</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂、感光性樹脂組成物、及硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260324B">C08G75/024</main-classification>  
        <further-classification edition="200601120260324B">C08G59/24</further-classification>  
        <further-classification edition="200601120260324B">C08L63/00</further-classification>  
        <further-classification edition="200601120260324B">G03F7/004</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本觸媒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺田拓真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADA, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻信章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKI, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川知紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦洋樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>縄稚杏奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAWACHI, ANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於：提供一種能夠提供高折射率之硬化物之樹脂及感光性樹脂組成物。本發明係關於一種樹脂，其具有下述通式（1）所表示之結構、以及下述通式（2）所表示之硫化物結構及/或下述通式（3）所表示之二硫化物結構。（式（1）中，R&lt;sup&gt;1&lt;/sup&gt;表示可具有取代基之芳香族基；R&lt;sup&gt;2&lt;/sup&gt;表示氫原子或含羧基之基） &lt;img align="absmiddle" height="38px" width="160px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;（式（2）中，R&lt;sup&gt;21&lt;/sup&gt;及R&lt;sup&gt;22&lt;/sup&gt;相同或不同，表示可具有取代基之二價芳香族基） &lt;img align="absmiddle" height="34px" width="184px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;（式（3）中，R&lt;sup&gt;31&lt;/sup&gt;及R&lt;sup&gt;32&lt;/sup&gt;相同或不同，表示可具有取代基之二價芳香族基） &lt;br/&gt;&lt;img align="absmiddle" height="71px" width="425px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2035" publication-number="202628944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139000</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粗糙度決定</chinese-title>  
        <english-title>ROUGHNESS DETERMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10P74/20</main-classification>  
        <further-classification edition="200601120260317B">G01B15/08</further-classification>  
        <further-classification edition="200601120260317B">G06T5/50</further-classification>  
        <further-classification edition="202401120260317B">G06T5/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商應用材料以色列公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩丹　多爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADDAN, DOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一個粗糙度決定電腦化系統，包括（i）一個記憶單元，該記憶單元配置為儲存（i.1）一個結構元件的第一電子束影像，該第一電子束影像包含與第一獲取製程相關的時間噪聲成分，以及（i.2）時間噪聲相關的訊息，該時間噪聲相關的訊息包括以下各者中的至少一個：（a）透過應用第二獲取製程獲得的第二電子束影像，或（b）由與生成第一電子束影像所使用的電子束相關感測器不同的時間噪聲感測器生成的時間噪聲感應訊息；以及（ii）一個處理電路，配置為根據與第一電子束影像和時間噪聲相關的訊息相關之時間分析和空間分析，將時間噪聲成分從第一電子束影像中解耦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A roughness determining computerized system, including (i) a memory unit that is configured to store (i.1) a first electron beam image of the structural element, the first electron beam image includes a temporal noise component that is associated with a first acquisition process, and (i,2) temporal noise related information, the temporal noise related information includes at least one out of (a) a second electron beam image acquired by applying a second acquisition process, or (b) temporal noise sensed information generated by a temporal noise sensor that differs from an electron beam related sensor used for generating the first electron beam image; and (ii) a processing circuit configured to decouple the temporal noise component from the first electron beam image based on temporal analysis and spatial analysis related to the first electron beam image and the temporal noise related information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電腦化系統</p>  
        <p type="p">11:記憶單元</p>  
        <p type="p">12:處理電路</p>  
        <p type="p">15:電子光學元件</p>  
        <p type="p">50:帶電粒子工具</p>  
        <p type="p">101:第一電子束影像</p>  
        <p type="p">102:第二電子束影像</p>  
        <p type="p">111:時間噪聲相關的訊息</p>  
        <p type="p">113:時間噪聲感應訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2036" publication-number="202625882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>灌溉系統</chinese-title>  
        <english-title>AN IRRIGATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">A01G25/00</main-classification>  
        <further-classification edition="200601120260325B">G01C9/06</further-classification>  
        <further-classification edition="200601120260325B">G05B13/00</further-classification>  
        <further-classification edition="201801120260325B">B05B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商胡斯華納有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUSQVARNA AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德里奧夫　弗雷德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDRIOF, FREDERIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅克爾　馬汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERKLE, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種灌溉系統(100)包含：一噴灑器(200)，其用於澆灌至少一個預定義區域(A1, A2, A3)；及至少一個安裝結構(300)，其經組態使得該噴灑器(200)能夠以一經定義定向可移除地耦接至該至少一個安裝結構(300)。該灌溉系統(100)之特徵在於，該噴灑器(200)包含一位置判定裝置(230)，該位置判定裝置經組態以判定該噴灑器(200)之一基本定向。該灌溉系統(100)進一步包含一控制單元(224)，其經組態以當該噴灑器(200)可移除地耦接至該至少一個安裝結構(300)中之一者時，取決於該噴灑器(200)之經判定的基本定向來控制對該至少一個預定義區域(A)之該澆灌。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An irrigation system (100) comprises a sprinkler (200) for watering of at least one pre-defined area (A1, A2, A3), and at least one mounting structure (300) configured such that the sprinkler (200) is removably couplable in a defined orientation to the at least one mounting structure (300). The irrigation system (100) is characterized that the sprinkler (200) comprises a position determining device (230) configured to determine a cardinal orientation of the sprinkler (200). The irrigation system (100) further comprises a control unit (224) configured to control the watering of the at least one pre-defined area (A) dependent on the determined cardinal orientation of the sprinkler (200) when the sprinkler (200) is removably coupled to one of the at least one mounting structure (300).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:灌溉系統</p>  
        <p type="p">200:噴灑器</p>  
        <p type="p">230:位置判定裝置；羅盤</p>  
        <p type="p">300:安裝結構；地上板</p>  
        <p type="p">302:安裝溝槽</p>  
        <p type="p">A1,A2,A3:預定義區域</p>  
        <p type="p">P1,P2,P3:位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2037" publication-number="202627122"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627122.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快削性銅合金鑄件、及快削性銅合金鑄件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C22C9/04</main-classification>  
        <further-classification edition="200601120260318B">C22F1/08</further-classification>  
        <further-classification edition="202301120260318B">C22C1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須崎孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZAKI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤弘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之快削性銅合金鑄件之特徵在於，該快削性銅合金鑄件包含特定量之Cu、Si、Pb及P，且剩餘部分包含Zn及不可避免雜質，前述不可避免雜質中Fe、Mn、Co及Cr之合計含量未達特定量，且Al含量未達特定量，從各元素之組成規定之組成關係式f1、從金屬組織之構成相之面積率規定之組織關係式f2、f3、f4分別設為特定範圍內，改質之β1相於在過氧化氫與氨水之混合液中蝕刻時可觀察到晶界。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2038" publication-number="202626835"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626835.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139018</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>丙烯基系樹脂、組成物、硬化物、印刷配線基板、半導體密封材料及增層膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G59/14</main-classification>  
        <further-classification edition="200601120260401B">C08L61/14</further-classification>  
        <further-classification edition="200601120260401B">C08L63/10</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>猪狩匡人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARI, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供丙烯基系樹脂、樹脂組成物及其硬化物，該丙烯基系樹脂在硬化時能夠高程度地兼顧優異的耐熱性和低彈性模數。 &lt;br/&gt;[解決手段]一種丙烯基系樹脂，其含有通式(1)所示的丙烯基系化合物(通式(1)中，M&lt;sup&gt;1&lt;/sup&gt;和M&lt;sup&gt;2&lt;/sup&gt;各自獨立地表示2價有機基，n為0~9的整數，m為1~10的整數，n+m為1~10的整數，R&lt;sup&gt;1&lt;/sup&gt;和R&lt;sup&gt;2&lt;/sup&gt;各自獨立地為具有丙烯基的特定的芳香族烴基)。 &lt;br/&gt;&lt;img align="absmiddle" height="161px" width="615px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2039" publication-number="202626343"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626343.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗反射膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260401B">B32B7/023</main-classification>  
        <further-classification edition="201501120260401B">G02B1/115</further-classification>  
        <further-classification edition="201501120260401B">G02B1/18</further-classification>  
        <further-classification edition="200601120260401B">G09F9/00</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1335</further-classification>  
        <further-classification edition="202301120260401B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊聖彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長命翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOMEI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本幸大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之抗反射膜(1)朝向厚度方向一側依序具備基材膜(2)、密接層(3)、及抗反射層(4)。抗反射層(4)具備高折射率層(41)及低折射率層(42)。抗反射膜(1)中之厚度方向一側之露出表面之最大粗糙度Rz為0.1 μm以上。於抗反射膜(1)之厚度方向之剖面觀察中，高折射率層(41)與低折射率層(42)之界面中之第2界面長度相對於基材膜(2)與密接層(3)之界面中之第1界面長度之比率為1.06以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:抗反射膜</p>  
        <p type="p">2:基材膜</p>  
        <p type="p">3:密接層</p>  
        <p type="p">4:抗反射層</p>  
        <p type="p">10:積層體</p>  
        <p type="p">10a:第1積層體</p>  
        <p type="p">10b:第2積層體</p>  
        <p type="p">21:透明樹脂膜</p>  
        <p type="p">22:硬化樹脂層</p>  
        <p type="p">41:高折射率層</p>  
        <p type="p">41a:第1高折射率層</p>  
        <p type="p">41b:第2高折射率層</p>  
        <p type="p">42:低折射率層</p>  
        <p type="p">42a:第1低折射率層</p>  
        <p type="p">42b:第2低折射率層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2040" publication-number="202626584"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626584.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>（甲基）丙烯酸酯及（甲基）丙烯酸聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C69/54</main-classification>  
        <further-classification edition="200601120260401B">C08F20/18</further-classification>  
        <further-classification edition="200601120260401B">C08F2/44</further-classification>  
        <further-classification edition="200601120260401B">C08F265/06</further-classification>  
        <further-classification edition="201701120260401B">B29C64/112</further-classification>  
        <further-classification edition="201401120260401B">C09D11/30</further-classification>  
        <further-classification edition="202001120260401B">B33Y70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山北紘也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKITA, KOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺圭太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示有關下述式(M1)所示之(甲基)丙烯酸酯。 &lt;br/&gt;&lt;img align="absmiddle" height="187px" width="258px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2041" publication-number="202627176"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627176.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於化學蒸氣處理反應器之模組化注入總成</chinese-title>  
        <english-title>A MODULAR INJECTION ASSEMBLY FOR CHEMICAL VAPOR PROCESSING REACTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/455</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商皮寇桑公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PICOSUN OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布隆伯格　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOMBERG, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬漢　沙米爾辛格　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUHAN, SAMIRSINH GANPATSINH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆罕默德　薩夫達爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUHAMMAD, SAFDAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾馬　瓦倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, VARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一化學蒸氣反應器，諸如一ALD原子層沉積或CVD化學蒸氣沉積反應器之注入器模組、一種具有至少一個此注入器模組之注入總成及一種具有此類注入總成之反應器。該注入器具有：一注入入口；一圓柱形主體，其至少在一底端處開放，該圓柱形主體之側面包含與該注入入口流體連接之一注入開口；以及一界面，其位於該圓柱形主體之至少一端上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An injector module for a chemical vapor reactor, such as an ALD, atomic layer deposition, or CVD, chemical vapor deposition, reactor; an injection assembly having at least one such injector module and a reactor having such an injection assembly. The injector having: an injection inlet; a cylindrical body open at least at a bottom end, the side of the cylindrical body comprising an injection opening in fluid connection with the injection inlet; and an interface on at least one end of the cylindrical body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:注入器模組</p>  
        <p type="p">110:圓柱形主體</p>  
        <p type="p">115:注入開口</p>  
        <p type="p">119:界面</p>  
        <p type="p">137:注入入口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2042" publication-number="202627167"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627167.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於化學蒸氣處理反應器之注入總成及方法</chinese-title>  
        <english-title>AN INJECTION ASSEMBLY AND METHODS FOR CHEMICAL VAPOR PROCESSING REACTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260309B">C23C16/44</main-classification>  
        <further-classification edition="200601120260309B">C23C16/503</further-classification>  
        <further-classification edition="202601120260309B">H10P14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商皮寇桑公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PICOSUN OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布隆伯格　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOMBERG, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬漢　沙米爾辛格　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUHAN, SAMIRSINH GANPATSINH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆罕默德　薩夫達爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUHAMMAD, SAFDAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾馬　瓦倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, VARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一ALD原子層沉積或CVD化學蒸氣沉積反應器之注入總成、一種具有此類注入總成之反應器及一種清潔此類注入總成之方法。該注入總成具有：一圓柱形主體，其包含在一底端處之一開口，該圓柱形主體之側面包含至少一個注入開口；以及至少一個環形注入器，其包含一環形流動通道及用於接收以下中之至少一者的一注入入口：一電漿、一蝕刻氣體、一載體氣體或一前驅物，該環形注入器附連在該圓柱形主體周圍以包封該注入開口，使得該注入開口、該環形流動通道及該注入入口進行流體連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An injection assembly for an ALD, atomic layer deposition, or CVD, chemical vapor deposition, reactor; a reactor having such an injection assembly and a method of cleaning such an injection assembly. The injection assembly having a cylindrical body comprising an opening at a bottom end, the side of the cylindrical body comprising at least one injection opening, and at least one annular injector comprising an annular flow channel and an injection inlet for receiving at least one of a: plasma, etch gas, carrier gas or precursor, the annular injector being affixed around the cylindrical body to envelop the injection opening such that the injection opening, annular flow channel and injection inlet are in fluid connection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:注入總成</p>  
        <p type="p">110:圓柱形主體</p>  
        <p type="p">112:開口</p>  
        <p type="p">115:注入開口</p>  
        <p type="p">130:環形注入器</p>  
        <p type="p">135:環形流動通道</p>  
        <p type="p">137:注入入口</p>  
        <p type="p">170:基體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2043" publication-number="202626917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有奈米碳管的碳黑顆粒</chinese-title>  
        <english-title>CARBON BLACK PELLETS CONTAINING CARBON NANOTUBES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C08K3/04</main-classification>  
        <further-classification edition="200601120260320B">C09C1/60</further-classification>  
        <further-classification edition="201701120260320B">C01B32/16</further-classification>  
        <further-classification edition="200601120260320B">C08L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商大陸碳公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONTINENTAL CARBON COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維格　二世　艾德瓦多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEGA JR., EDUARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇菲亞尼　雷蒙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUFIANI, RAYMOND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡達維沙朗奇　迪　西法　拉山　馬度沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDAVITHARANAGE DE SILVA, LASHAN MADUSHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛德傑斯　麥可　布萊登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODGERS, MICHAEL BRENDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">將碳黑製成顆粒是為了最小化粉塵的產生並提高工廠處理品質。在造粒步驟中添加奈米碳管，是為了在奈米碳管與碳黑一起混入橡膠時，進一步提高奈米碳管的分散性和剝離性。此概念適用於所有等級的碳黑與所有類型的奈米碳管之造粒，包括單壁奈米碳管、多壁奈米碳管，以及長度從 25 奈米 (nm) 到 500 微米 (µm) 不等的奈米碳管，以及任何奈米碳管有機官能性。使用碳黑作為奈米碳管的載體，可以減緩奈米碳管粉塵的產生，帶來安全性的益處；最大化在橡膠複合物中的分散性，帶來加工上的益處；且透過添加奈米碳管來充分發揮橡膠複合物的材料性質之性能優勢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2044" publication-number="202626752"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626752.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139078</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、轉印膜、樹脂圖案的製造方法及導電圖案的製造方法</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, TRANSFER FILM, METHOD FOR PRODUCING A RESIN PATTERN, AND METHOD FOR PRODUCING A CONDUCTIVE PATTERN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/38</main-classification>  
        <further-classification edition="200601120260401B">C08F2/44</further-classification>  
        <further-classification edition="200601120260401B">C08F222/10</further-classification>  
        <further-classification edition="200601120260401B">C08F222/20</further-classification>  
        <further-classification edition="200601120260401B">C08F257/02</further-classification>  
        <further-classification edition="200601120260401B">C08F265/00</further-classification>  
        <further-classification edition="200601120260401B">C08F290/06</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/09</further-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/38</further-classification>  
        <further-classification edition="200601120260401B">B32B27/00</further-classification>  
        <further-classification edition="200601120260401B">B32B27/30</further-classification>  
        <further-classification edition="201901120260401B">B32B7/06</further-classification>  
        <further-classification edition="200601120260401B">H05K3/06</further-classification>  
        <further-classification edition="200601120260401B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬼塚悠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONITSUKA, HISASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠形成形狀不良得到改善且解析度優異的樹脂圖案之感光性樹脂組成物。前述感光性樹脂組成物等包含：鹼可溶性樹脂，包含具有雙鍵之交聯性基；多官能（甲基）丙烯酸酯；及聚合抑制劑，感光性樹脂組成物的固體成分中的總雙鍵含量相對於感光性樹脂組成物的固體成分的總量為2.00mmol/g以上，基於丙烯醯基之雙鍵數在感光性樹脂組成物的固體成分中的總雙鍵數中所佔之比例為10%～50%，聚合抑制劑的含量與基於丙烯醯基之雙鍵的含量之莫耳比率為0.001～0.015。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:偽支撐體</p>  
        <p type="p">12:轉印層</p>  
        <p type="p">13:熱塑性樹脂層</p>  
        <p type="p">15:中間層</p>  
        <p type="p">17:感光性樹脂層</p>  
        <p type="p">19:保護膜</p>  
        <p type="p">20:轉印膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2045" publication-number="202626591"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626591.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139079</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有茀化合物的組成物</chinese-title>  
        <english-title>COMPOSITION CONTAINING FLUORENE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C231/12</main-classification>  
        <further-classification edition="200601120260401B">C07C233/08</further-classification>  
        <further-classification edition="200601120260401B">C09K3/00</further-classification>  
        <further-classification edition="200601120260401B">C08K5/092</further-classification>  
        <further-classification edition="200601120260401B">C08K5/20</further-classification>  
        <further-classification edition="200601120260401B">C08L77/00</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">C08J3/20</further-classification>  
        <further-classification edition="200601120260401B">C08J3/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大阪瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSAKA GAS CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川智也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大内祐輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OUCHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神崎智至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANZAKI, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三嶋晋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISHIMA, SHINPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係調製一種組成物(A1)或組成物(A2)，組成物(A1)係至少含有下述式(1)所示的茀化合物(a1)與下述式(2)所示的醯胺化合物(a2)，其中，相對於前述茀化合物(a1)及前述醯胺化合物(a2)的總量，前述醯胺化合物(a2)的比率未達10質量%；組成物(A2)係至少含有茀化合物(a1)與羧酸成分(a3)，其中，前述羧酸成分(a3)含有碳原子數5以上的羧酸或其鹽。 &lt;br/&gt;&lt;img align="absmiddle" height="209px" width="575px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式中，R&lt;sup&gt;1&lt;/sup&gt;表示取代基，m1表示0至8的整數， &lt;br/&gt;R&lt;sup&gt;2a&lt;/sup&gt;、R&lt;sup&gt;2b&lt;/sup&gt;、R&lt;sup&gt;2c&lt;/sup&gt;及R&lt;sup&gt;2d&lt;/sup&gt;、R&lt;sup&gt;3a&lt;/sup&gt;及R&lt;sup&gt;3b&lt;/sup&gt;、R&lt;sup&gt;6&lt;/sup&gt;、以及R&lt;sup&gt;7&lt;/sup&gt;及R&lt;sup&gt;8&lt;/sup&gt;表示氫原子或烴基，X&lt;sup&gt;1a&lt;/sup&gt;及X&lt;sup&gt;1b&lt;/sup&gt;表示下述式(X1)所示之基。 &lt;br/&gt;&lt;img align="absmiddle" height="94px" width="255px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;表示氫原子或烴基，或表示R&lt;sup&gt;4&lt;/sup&gt;與R&lt;sup&gt;5&lt;/sup&gt;相互鍵結且與相鄰的氮原子一起形成之雜環。)] &lt;br/&gt;前述組成物(A1)及(A2)可形成不過度降低耐熱老化性(耐熱性或熱穩定性)且流動性(熔融流動性、成形性或加工性)優異之樹脂組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Preparing a composition(A1), comprising at least a fluorene compound(a1) represented by the following formula(1) and an amide compound(a2) represented by the following formula(2), wherein the percentage of the amide compound(a2) is less than 10% by mass, relative to the total amount of the fluorene compound(a1) and the amide compound(a2); or a composition(A2), comprising at least a fluorene compound(a1) and a carboxylic acid component(a3), wherein the carboxylic acid component(a3) contains a carboxylic acid having 5 or more carbon atoms or a salt thereof. &lt;br/&gt;&lt;img align="absmiddle" height="206px" width="582px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[In the formula, R&lt;sup&gt;1&lt;/sup&gt; represents a substituent, m1 represents an integer from 0 to 8, R&lt;sup&gt;2a&lt;/sup&gt;, R&lt;sup&gt;2b&lt;/sup&gt;, R&lt;sup&gt;2c&lt;/sup&gt; and R&lt;sup&gt;2d&lt;/sup&gt;, R&lt;sup&gt;3a &lt;/sup&gt;and R&lt;sup&gt;3b&lt;/sup&gt;, R&lt;sup&gt;6&lt;/sup&gt;, and R&lt;sup&gt;7 &lt;/sup&gt;and R&lt;sup&gt;8&lt;/sup&gt; each represent a hydrogen atom or a hydrocarbon group, X&lt;sup&gt;1a&lt;/sup&gt; and X&lt;sup&gt;1b&lt;/sup&gt; represents a group represented by the following formula(X1). &lt;br/&gt;&lt;img align="absmiddle" height="94px" width="263px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(In the formula, R&lt;sup&gt;4 &lt;/sup&gt;and R&lt;sup&gt;5&lt;/sup&gt; each represent a hydrogen atom or a hydrocarbon group, or R&lt;sup&gt;4 &lt;/sup&gt;and R&lt;sup&gt;5&lt;/sup&gt; are bonded together to form a heterocycle with the adjacent nitrogen atom.)] &lt;br/&gt;The compositions(A1) and (A2) can form a resin composition that does not excessively lower the thermal aging resistance(heat resistance or thermal stability) and exhibits excellent fluidity(melt flowability, moldability, or processability).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2046" publication-number="202627349"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627349.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139088</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液化氣體儲存設施</chinese-title>  
        <english-title>LIQUEFIED GAS STORAGE FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">F17C3/02</main-classification>  
        <further-classification edition="200601120260316B">F16J15/52</further-classification>  
        <further-classification edition="200601120260316B">B65D90/08</further-classification>  
        <further-classification edition="200601120260316B">E04H7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商蓋茲運輸科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAZTRANSPORT ET TECHNIGAZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧梭　埃馬紐埃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROUSSEAU, EMMANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴爾崔　布魯諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELETRE, BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩奎特　法比恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PESQUET, FABIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉格里　布萊斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAGREE, BRICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種液化氣體儲存設施(1)，其包括：一密封且熱絕緣槽，其安裝於該支撐結構中，該槽包括配置於該圓柱形支撐壁之一內部表面(13)上之一圓柱形槽壁(22)，絕緣障壁包括具有平行於母線方向之第一邊緣之複數個絕緣面板(21)，該等絕緣面板(21)圍繞該母線方向依次樞轉通過一刻面角，使得該等絕緣面板之一內部表面界定具有一多邊形準線曲線之一圓柱形表面， &lt;br/&gt;該密封隔膜包括複數個金屬板(30)，各金屬板包括：一波紋(27、35)，其平行於該母線方向，每次配置為與該間隙(24)成一直線；及兩個平面部分(34、36)，其等圍繞該母線方向成該刻面角且分別配置於藉由該間隙分離之兩個該等絕緣面板(21)上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a liquefied gas storage facility (1) comprising a sealed and thermally insulating tank installed in the supporting structure, the tank comprising a cylindrical tank wall (22) arranged on an inner surface (13) of the cylindrical supporting wall, the insulating barrier comprising a plurality of insulating panels (21) having first edges parallel to the generatrix direction, the insulating panels (21) being successively pivoted through a facetting angle about the generatrix direction such that an inner surface of the insulating panels defines a cylindrical surface having a polygonal directrix curve,: &lt;br/&gt;The sealed membrane comprising a plurality of metal plates (30), each metal plate comprising a corrugation (27, 35) parallel to the generatrix direction, arranged each time in line with a said gap (24), and two planar portions (34, 36) angulated by the facetting angle about the generatrix direction and arranged respectively on two said insulating panels (31) separated by the gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:垂直支撐壁</p>  
        <p type="p">14:次密封隔膜</p>  
        <p type="p">20:垂直列/絕緣面板列</p>  
        <p type="p">21:絕緣面板</p>  
        <p type="p">23:外表面</p>  
        <p type="p">24:間隙</p>  
        <p type="p">25:圓周帶</p>  
        <p type="p">26:橫向平行波紋/第二波紋</p>  
        <p type="p">27:垂直平行波紋</p>  
        <p type="p">29:內部表面</p>  
        <p type="p">31:縱向邊緣/第一邊緣</p>  
        <p type="p">40:金屬錨定板/金屬錨定部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2047" publication-number="202626571"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626571.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有六氟丙烯二聚物的組成物</chinese-title>  
        <english-title>HEXAFLUOROPROPENE DIMER-CONTAINING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C21/18</main-classification>  
        <further-classification edition="200601120260401B">C09K5/04</further-classification>  
        <further-classification edition="200601120260401B">C09K3/00</further-classification>  
        <further-classification edition="200601120260401B">C08J9/14</further-classification>  
        <further-classification edition="200601120260401B">C10M131/04</further-classification>  
        <further-classification edition="200601120260401B">C11D3/24</further-classification>  
        <further-classification edition="200601120260401B">C11D7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸川晋之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIKAWA, SHINNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木克親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, YOSHICHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孕石智大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARAMIISHI, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種作為新穎混合物之含有六氟丙烯二聚物的組成物。一種組成物，係含有C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;所示之六氟丙烯二聚物，及下述(A)、(B)或(C)。(A)相對於前述C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;所示之六氟丙烯二聚物的合計量100質量份，為0.0000001至5質量份的濃度之氟化物離子。(B)相對於前述C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;所示之六氟丙烯二聚物的合計量100質量份，為0.0001至0.1質量份的濃度之C&lt;sub&gt;6&lt;/sub&gt;HF&lt;sub&gt;11&lt;/sub&gt;所示的化合物。(C)相對於前述C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;所示之六氟丙烯二聚物的合計量100質量份，為0.0001至0.1質量份的濃度之水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hexafluoropropene dimer-containing composition is provided as a novel mixture. A composition contains a hexafluoropropene dimer represented by C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt; and the following (A), (B) or (C). (A) is fluoride ions at a concentration of 0.0000001 to 5 parts by mass relative to 100 parts by mass of the hexafluoropropene dimer represented by C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;. (B) is a compound represented by C6HF11 at a concentration of 0.0001 to 0.1 parts by mass relative to 100 parts by mass of the hexafluoropropene dimer represented by C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;. (C) is water at a concentration of 0.0001 to 0.1 parts by mass relative to 100 parts by mass of the hexafluoropropene dimer represented by C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2048" publication-number="202626475"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626475.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電梯異常檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B66B5/02</main-classification>  
        <further-classification edition="200601120260401B">B66B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東芝電梯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSHIBA ELEVATOR KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高柳緑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAYANAGI, MIDORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提高在電梯裝置中所使用的水冷式冷卻裝置的損壞的檢測精度。 &lt;br/&gt;　　[解決手段]實施形態的電梯異常檢測裝置具有：記憶部，是記憶正常時的泵的驅動電流的值、正常時的配管內的水壓值、正常時在配管內流動的水的流量值、正常時水冷式冷卻裝置發出的振動值、正常時水冷式冷卻裝置發出的聲音的值中的至少一個作為基準值進行記憶；以及異常檢測部，是比較乘載廂的每次升降時量測到的驅動電流值、配管內的水壓值、在配管流動的水的流量的值、水冷式冷卻裝置發出的振動的值、水冷式冷卻裝置發出的聲音中的至少一個值的量測值與基準值，並在量測值與基準值的差異超過預定的值時，檢測到在水冷式冷卻裝置發生異常的情況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">36:操作面板</p>  
        <p type="p">37:荷重感測器</p>  
        <p type="p">71:驅動單元控制部</p>  
        <p type="p">72:異常檢測裝置</p>  
        <p type="p">80:控制單元</p>  
        <p type="p">90:驅動單元</p>  
        <p type="p">100:輸入輸出裝置</p>  
        <p type="p">222:泵馬達控制部</p>  
        <p type="p">250:電流感測器</p>  
        <p type="p">251:振動感測器</p>  
        <p type="p">252:噪音感測器</p>  
        <p type="p">253:水壓感測器</p>  
        <p type="p">254:水流感測器</p>  
        <p type="p">721:運轉狀況監視部</p>  
        <p type="p">722:記憶部</p>  
        <p type="p">723:異常檢測部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2049" publication-number="202627692"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627692.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139110</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>確定系統、確定方法、儲存媒體及曝光設備組裝方法</chinese-title>  
        <english-title>DETERMINATION SYSTEM, DETERMINATION METHOD, STORAGE MEDIUM, AND EXPOSURE DEVICE ASSEMBLY METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G03F7/20</main-classification>  
        <further-classification edition="202201120260323B">G06V30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兼目弘巳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEMMOKU, HIROMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種用於做出關於在多個工作位置中的每個工作位置處由工作人員執行的工作的確定的確定系統。在該確定系統中，位置獲取單元獲取關於工作人員的位置的資訊，影像擷取單元捕獲由工作人員執行的工作的影像，接收單元接收從位置獲取單元獲得的位置資訊和從影像捕獲單元獲得的影像資訊，並且確定單元基於由接收單元接收到的位置資訊和影像資訊確定工作中的異常的存在或不存在。影像擷取單元在由工作人員攜帶的同時捕獲工作的影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a determination system for making a determination regarding work performed by a worker at each of a plurality of work positions. In this determination system, a position acquisition unit acquires information on a position of the worker, an image capture unit captures a video of the work performed by the worker, a reception unit receives position information obtained from the position acquisition unit and video information obtained from the image capture unit, and a determination unit determines the presence or absence of an abnormality in the work on the basis of the position information and the video information received by the reception unit. The image capture unit captures the video of the work while being carried by the worker.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:投影光學系統</p>  
        <p type="p">31:鏡筒結構部分</p>  
        <p type="p">32:鏡筒表面板</p>  
        <p type="p">36:參考點</p>  
        <p type="p">37:參考點</p>  
        <p type="p">38:參考點</p>  
        <p type="p">110:工作人員A</p>  
        <p type="p">111:圖像擷取裝置</p>  
        <p type="p">112:通訊設備</p>  
        <p type="p">120:工作人員B</p>  
        <p type="p">121:圖像擷取裝置</p>  
        <p type="p">122:通訊設備</p>  
        <p type="p">130:工作人員C</p>  
        <p type="p">131:圖像擷取裝置</p>  
        <p type="p">132:通訊設備</p>  
        <p type="p">210:區段E</p>  
        <p type="p">220:區段F</p>  
        <p type="p">230:區段G</p>  
        <p type="p">LA:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2050" publication-number="202626045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療轉移性去勢抵抗性前列腺癌之他拉唑帕尼(talazoparib)及恩雜魯胺(enzalutamide)之組合</chinese-title>  
        <english-title>COMBINATION OF TALAZOPARIB AND ENZALUTAMIDE IN THE TREATMENT OF METASTATIC CASTRATION-RESISTANT PROSTATE CANCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/5025</main-classification>  
        <further-classification edition="200601120260401B">A61K31/4166</further-classification>  
        <further-classification edition="200601120260401B">A61P5/24</further-classification>  
        <further-classification edition="200601120260401B">A61P13/08</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商安斯泰來製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTELLAS PHARMA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯尼迪　達娜　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENNEDY, DANA ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勒　瑪麗亞　德芮莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOEHLER, MARIA TERESA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米區　珊卓　金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEECH, SANDRA JEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　放</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於他拉唑帕尼(talazoparib)或其醫藥學上可接受之鹽與恩雜魯胺(enzalutamide)或其醫藥學上可接受之鹽的組合，其係用於治療同源重組修復(HRR)基因突變之轉移性去勢抵抗性前列腺癌；及延長同源重組修復(HRR)基因突變之轉移性去勢抵抗性前列腺癌之總存活期的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to talazoparib, or a pharmaceutically acceptable salt thereof, in combination with enzalutamide, or a pharmaceutically acceptable salt thereof, for the treatment of homologous recombination repair (HRR) gene-mutated metastatic castration-resistant prostate cancer and methods of increasing overall survival thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2051" publication-number="202626570"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626570.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有六氟丙烯二聚物的組成物</chinese-title>  
        <english-title>HEXAFLUOROPROPENE DIMER-CONTAINING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C19/08</main-classification>  
        <further-classification edition="200601120260401B">C07C21/18</further-classification>  
        <further-classification edition="200601120260401B">C09K5/04</further-classification>  
        <further-classification edition="200601120260401B">C08J9/14</further-classification>  
        <further-classification edition="200601120260401B">C10M131/04</further-classification>  
        <further-classification edition="200601120260401B">C11D3/24</further-classification>  
        <further-classification edition="200601120260401B">C11D7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸川晋之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIKAWA, SHINNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木克親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, YOSHICHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孕石智大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARAMIISHI, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種作為新穎混合物之含有六氟丙烯二聚物的組成物。一種組成物，係含有C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;所示之六氟丙烯二聚物的組成物，前述C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;所示之六氟丙烯二聚物中的至少一種為下述式(I)所示之化合物；於前述化合物的E體與Z體中，E體的存在比率E/(E+Z)超出0.5。 &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="345px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a hexafluoropropene dimer-containing composition as a novel mixture. The composition contains a hexafluoropropene dimer represented by C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt;, where at least one of the hexafluoropropene dimers represented by C&lt;sub&gt;6&lt;/sub&gt;F&lt;sub&gt;12&lt;/sub&gt; is a compound represented by formula (I) below. The abundance ratio of the E isomer to the E and Z isomers E/(E+Z) of the compound is greater than 0.5. &lt;br/&gt;&lt;img align="absmiddle" height="151px" width="381px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2052" publication-number="202626120"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626120.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>促進傷口癒合的敷料及用於製造所述敷料的方法</chinese-title>  
        <english-title>DRESSING FOR PROMOTING WOUND HEALING AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61L26/00</main-classification>  
        <further-classification edition="200601120260102B">A61L15/28</further-classification>  
        <further-classification edition="200601120260102B">A61L15/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聿健生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUJIAN INTERNATIONAL BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂耀仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YAO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宇珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭蕙蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HUI-LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅春蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHUN-LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭紀偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊翊鈴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI -LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊金昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃富源</last-name>  
                <first-name>桃園市中壢區延平路500號12樓之1　B室</first-name> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於製造促進傷口癒合的敷料之方法，其至少有以下的步驟：提供容器；將純淨水加入至容器中；將第一有效成分加入至容器中，其中第一有效成分為低分子量玻尿酸(HA)，其分子量在50萬道爾頓以下，且敷料整體的0.01至1重量百分比；以及將第二有效成分加入至容器中，其中第二有效成分為β-菸鹼醯胺單核苷酸(β-NMN)，其佔敷料整體的0.01至1重量百分比，或為植物幹細胞萃取液，其佔敷料整體的0.1至5重量百分比。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a dressing that promotes wound healing comprises at least the following steps: providing a container; adding purified water to the container; adding a first active ingredient to the container, wherein the first active ingredient is low molecular weight hyaluronic acid with a molecular weight of less than 500,000 Daltons and constitutes 0.01 to 1 weight percent of the dressing; and adding a second active ingredient to the container, wherein the second active ingredient is β-nicotinamide mononucleotide (β-NMN) and constitutes 0.01 to 1 weight percent of the dressing, or is plant stem cell extraction liquid and constitutes less than 0.1 to 5 weight percent of the dressing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S108:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2053" publication-number="202626563"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626563.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陶瓷片材燒結體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C04B35/64</main-classification>  
        <further-classification edition="200601120260327B">C04B41/87</further-classification>  
        <further-classification edition="200601120260327B">F27D3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林葵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, AOI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有馬峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種片狀格柵體，即便於暴露在1200℃以上之高溫下之情形時，亦能夠充分地抑制塗層之剝離。該課題藉由如下格柵體來解決，該格柵體係包含以下之(a)及(b)之片狀格柵體：(a)線條部層，其由按照規定間隔配置且各條沿一方向延伸之複數條線條部構成；及(b)線條部層，其由以與上述線條部之各條之上方相接並與其交叉之方式按照規定間隔配置且各條沿一方向延伸的複數條線條部構成；且於將格柵體載置在水平面上之情形時，將位於最上方之線條部層設為第1線條部層，將第1線條部層之正下方之線條部層設為第2線條部層，格柵體之至少一面中之構成第1線條部層之第1線條部各者具有塗層，上述塗層至少自頂部T&lt;sub&gt;0&lt;/sub&gt;至點T&lt;sub&gt;2&lt;/sub&gt;連續被覆第1線條部，C&lt;sub&gt;2&lt;/sub&gt;相對於C&lt;sub&gt;1&lt;/sub&gt;之比率為5%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2054" publication-number="202627697"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627697.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139207</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於化學放大光阻之顯影製程</chinese-title>  
        <english-title>DEVELOPING PROCESSES FOR CHEMICALLY AMPLIFIED RESISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G03F7/26</main-classification>  
        <further-classification edition="200601120260325B">G03F7/004</further-classification>  
        <further-classification edition="200601120260325B">G03F7/20</further-classification>  
        <further-classification edition="202601120260325B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪立坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LIKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡贊姆　納斯琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAZEM, NASRIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃特基　魯迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOJTECKI, RUDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　賴利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, LARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的實施例涉及一種用於顯影化學放大光阻（CAR）的方法，該光阻位於包含碳和氟的底層之上，且CAR已經經過微影術製程進行選擇性曝光以形成潛影像。在實施例中，該方法包括在微影術製程後將金屬納入CAR中，並顯影CAR以形成CAR中的開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to a method of developing a chemically amplified resist (CAR) that is provided over an underlayer that includes carbon and fluorine, where the CAR has been selectively exposed with a lithography process to form a latent image. In an embodiment, the method includes incorporating a metal into the CAR after the lithography process, and developing the CAR to form an opening in the CAR.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">250:製程</p>  
        <p type="p">251:操作</p>  
        <p type="p">252:操作</p>  
        <p type="p">253:操作</p>  
        <p type="p">254:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2055" publication-number="202627148"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627148.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用變化溫度製程之矽化物形成</chinese-title>  
        <english-title>SILICIDE FORMATION BY USING VARIATING TEMPERATURE PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C16/02</main-classification>  
        <further-classification edition="200601120260401B">C23C16/04</further-classification>  
        <further-classification edition="200601120260401B">C23C16/42</further-classification>  
        <further-classification edition="200601120260401B">C23C16/44</further-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="200601120260401B">C23C16/52</further-classification>  
        <further-classification edition="200601120260401B">C23C16/56</further-classification>  
        <further-classification edition="202301120260401B">H10B12/00</further-classification>  
        <further-classification edition="202601120260401B">H10P14/24</further-classification>  
        <further-classification edition="202601120260401B">H10P14/43</further-classification>  
        <further-classification edition="202601120260401B">H10P95/00</further-classification>  
        <further-classification edition="202601120260401B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江　瑩冰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YING-BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雨馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　正周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOUNG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛拉托斯　艾夫傑尼諾斯Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELATOS, AVGERINOS V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫　源中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, YUAN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余　湯姆Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, TOM H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岑羲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEN, XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在半導體結構中形成金屬矽化物層的方法包括在處理腔室中執行矽化物沉積製程，其中在半導體結構中形成的開口內的矽表面上形成金屬矽化物層，開口的內表面包括矽表面，其中矽化物沉積製程包括執行前劑量淨化製程，其中處理腔室抽空在第一壓力下，執行劑量製程，其中含金屬前驅物流入在高於第一壓力的第二壓力下的處理腔室，執行後劑量淨化製程，其中處理腔室在低於第二壓力的第三壓力下被淨化，以及在高於第二壓力的第四壓力下進行退火製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a metal silicide layer in a semiconductor structure includes performing a silicide deposition process in a processing chamber, in which a metal silicide layer is formed on silicon surfaces within an opening formed in a semiconductor structure, inner surfaces of the opening comprising the silicon surfaces, wherein the silicide deposition process including performing a pre-dose purging process, in which the processing chamber is evacuated at a first pressure, performing a dose process, in which a metal-containing precursor is flowed in the processing chamber at a second pressure that is higher than the first pressure, performing a post-dose purge process, in which the processing chamber is purged at a third pressure that is lower than the second pressure, and performing an anneal process at a fourth pressure that is higher than the second pressure.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2056" publication-number="202626915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化性樹脂組成物、固化性樹脂膜及印刷線路板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260401B">C08K3/013</main-classification>  
        <further-classification edition="200601120260401B">C08K5/00</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下直輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口佳歩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, KAHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山川有理紗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKAWA, ARISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤本颯人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWAMOTO, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村彰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種固化性樹脂組成物，其含有固化性樹脂，其中以固化性樹脂組成物的固體成分總量為基準，金屬含量為200質量ppm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固化性樹脂膜</p>  
        <p type="p">10:支撐膜</p>  
        <p type="p">20:固化性樹脂層</p>  
        <p type="p">30:保護膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2057" publication-number="202627837"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627837.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性吸附力算出方法及其算出程式</chinese-title>  
        <english-title>A METHOD FOR CALCULATING MAGNETIC ADSORPTION FORCE, AND TO A PROGRAM FOR PERFORMING SUCH CALCULATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G06F17/10</main-classification>  
        <further-classification edition="200601120260401B">B29C33/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商克斯美庫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSMEK LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田頌太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的為在磁性鎖模裝置中，於短時間內算出對模具的磁性吸附力。&lt;br/&gt; 在本發明的磁性吸附力算出方法中，表格資料係磁性鎖模裝置10的吸附面被劃分成列欄狀的單位區域，而單位區域的每一者作為1個儲存格以列欄座標進行特定。在與磁性墊對應的位置的儲存格係設定“0”以外的預定的數值，在其他儲存格係記入“0”或為空白。列欄座標計算部120係求取當模具2a的代表位置定位到模板3側的代表位置時，與位在模具2a的對角位置的頂點對應的儲存格的列欄座標。試算表部130係將被以所求得的列欄座標指定的長方形圍起的範圍的儲存格所記入的數值加總。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:列欄座標計算部</p>  
        <p type="p">130:試算表部</p>  
        <p type="p">140:磁性吸附力換算部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2058" publication-number="202626451"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626451.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器蓋</chinese-title>  
        <english-title>CONTAINER LID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B65D41/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本克樂嘉製蓋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON CLOSURES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田知</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市村克仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIMURA, KATSUHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菖蒲池魁士郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYOBUIKE, KAISHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種新穎的容器蓋，其雖然於裝著於容器的口頸部100之時，一對刻痕部18a及18b各自不易斷裂，但是於將容器的口頸部100開封時，一對刻痕部18a及18b各自卻容易斷裂。使一對刻痕部18a及18b各自的第一部分18a－1及18b－1的下部18a－1x及18b－1x的材料殘餘厚度成為較厚，並使上述下部18a－1x及18b－1x的上端位於把持片6的延展部22的上端附近。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a novel container lid including a pair of scores 18a and 18b that are less likely to rupture when the lid is attached to a mouth-neck section 100 of a container but easily rupture when the mouth-neck section 100 of the container is opened. The pair of scores 18a and 18b include first portions 18a-1 and 18b-1, respectively, whose material residual thicknesses at their lower parts 18a-1x and 18b-1x are relatively great. Upper ends of the lower parts 18a-1x and 18b-1x are located near an upper end of an extending portion 22 of a grip piece 6.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:容器蓋</p>  
        <p type="p">4:外殼</p>  
        <p type="p">6:把持片</p>  
        <p type="p">8:頂面壁</p>  
        <p type="p">10:側緣壁</p>  
        <p type="p">10a:弧狀部</p>  
        <p type="p">10b:直立狀部</p>  
        <p type="p">12a:垂直部</p>  
        <p type="p">16a,16b:切口</p>  
        <p type="p">18a,18b:刻痕部</p>  
        <p type="p">18a-1,18b-1:第一部分</p>  
        <p type="p">18a-1x,18b-1x:第一部分的下部</p>  
        <p type="p">18a-1y,18b-1y:第一部分的剩餘部分</p>  
        <p type="p">20:連接部</p>  
        <p type="p">22:延展部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2059" publication-number="202627360"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627360.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>除濕裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260306B">F24F1/0358</main-classification>  
        <further-classification edition="200601120260306B">F24F3/14</further-classification>  
        <further-classification edition="202101120260306B">F24F3/16</further-classification>  
        <further-classification edition="202101120260306B">F24F8/20</further-classification>  
        <further-classification edition="200601120260306B">F24F13/28</further-classification>  
        <further-classification edition="200601120260306B">F25B21/02</further-classification>  
        <further-classification edition="200601120260306B">B01D53/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山實希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATA, MIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口正太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">除濕裝置(1)具備：除濕風路(12)，供吸入的空氣(A2)通過；除濕部(20)，將通過除濕風路(12)的空氣(A2)除濕；次氯酸氣體供給風路(13)，從除濕部(20)的上游分歧，供通過除濕部(20)之前的空氣的一部分(空氣(B1))通過，且匯流於除濕部(20)的下游；及次氯酸氣體供給部(30)，將次氯酸氣體供給至通過次氯酸氣體供給風路(13)的空氣(B2)。通過除濕風路(12)的空氣(A3)與通過次氯酸氣體供給風路(13)的空氣(B7)會混合而吹出。次氯酸氣體供給部(30)設置水回收部(46)，通過次氯酸氣體供給風路(13)的空氣(B1)的至少一部分(空氣(B2))通過次氯酸氣體供給部(30)，且藉由水回收部(46)來回收水分，並與次氯酸氣體一起釋出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:除濕裝置</p>  
        <p type="p">10:吸入口</p>  
        <p type="p">11:吹出口</p>  
        <p type="p">12:除濕風路</p>  
        <p type="p">13:次氯酸氣體供給風路</p>  
        <p type="p">14:過濾器</p>  
        <p type="p">15:送風機</p>  
        <p type="p">20:除濕部</p>  
        <p type="p">21:蒸發器</p>  
        <p type="p">22:膨脹器</p>  
        <p type="p">23:凝結器</p>  
        <p type="p">24:壓縮器</p>  
        <p type="p">25:冷媒管</p>  
        <p type="p">30:次氯酸氣體供給部</p>  
        <p type="p">46:水回收部</p>  
        <p type="p">46a:冷卻部</p>  
        <p type="p">46b:散熱部</p>  
        <p type="p">A1,A2,A3,A5,B1,B2,B4,B5,B6,B7:空氣</p>  
        <p type="p">A4:混合空氣</p>  
        <p type="p">R:室內空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2060" publication-number="202627200"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627200.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無磷無電鍍鈀</chinese-title>  
        <english-title>PHOSPHORUS FREE ELECTROLESS PALLADIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C18/16</main-classification>  
        <further-classification edition="200601120260401B">C23C18/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商麥克達米德恩索龍股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACDERMID ENTHONE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗　歐內斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, ERNEST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑托斯　切瑞Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANTOS, CHERRY S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於在基材上無電鍍沉積鈀之程序，該程序包含下列步驟：(a)製備該基材以接受沉積在該基材上的無電鍍鈀；及(b)使該基材與無電鍍鈀組成物接觸，該無電鍍鈀組成物包含：(i)鈀離子源；(ii)一或多種錯合劑；(iii)還原劑；及(iv)鍍覆速率增強劑，其中該鍍覆速率增強劑包含銻離子源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for the electroless deposition palladium on a substrate, the process comprising the steps of: (a) preparing the substrate to accept electroless palladium deposited thereon; and (b) bringing the substrate into contact with an electroless palladium composition, the electroless palladium composition comprising: (i) a source of palladium ions; (ii) one or more complexing agents; (iii) a reducing agent; and (iv) a plating rate enhancer, wherein the plating rate enhancer comprises a source of antimony ions.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2061" publication-number="202628975"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628975.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有助於選擇性金屬生長及防止介電質損壞的電漿處理</chinese-title>  
        <english-title>PLASMA TREATMENT FACILITATING SELECTIVE METAL GROWTH AND PREVENTING DIELECTRIC DAMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260311B">H10W20/20</main-classification>  
        <further-classification edition="202601120260311B">H10W20/40</further-classification>  
        <further-classification edition="200601120260311B">C23C16/14</further-classification>  
        <further-classification edition="200601120260311B">H01J37/08</further-classification>  
        <further-classification edition="202301120260311B">H10B41/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張愛西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, AIXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHUANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岑嘉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEN, JIAJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亓智敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QI, ZHIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪榮軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RONGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例包括在半導體基板上沉積間隙填充材料的方法，包括：透過從遠端電漿源引入氫氣和氧氣及/或水至處理腔室，在接觸結構的表面上形成鈍化層，及在鈍化層的一部分上方沉積金屬間隙填充材料，以填充在半導體基板的表面中形成的特徵。接觸結構包括在半導體基板的表面中形成的特徵。該特徵包括由基板界定的開口、位於基板上方的下方介電材料、與位於下方介電材料上方的上方介電材料，及鈍化層形成在基板、下方介電材料和上方介電材料的上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure include a method of depositing a gap-fill material on a semiconductor substrate, comprising: forming a passivation layer on a surface of a contact structure by introducing a hydrogen gas and an oxygen gas and/or water from a remote plasma source to a processing chamber, and depositing a metal gap-fill material over a portion of the passivation layer to fill the feature formed in the surface of the semiconductor substrate. The contact structure includes a feature formed in a surface of the semiconductor substrate. The feature comprises an opening that is defined by a substrate, a lower dielectric material disposed over the substrate, and an upper dielectric material disposed over the lower dielectric material, and the passivation layer is formed over the substrate, the lower dielectric material, and the upper dielectric material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">314:間隙填充材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2062" publication-number="202627302"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627302.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具除害功能之真空泵</chinese-title>  
        <english-title>VACUUM PUMP WITH ABATEMENT FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">F04C29/12</main-classification>  
        <further-classification edition="200601120260327B">F04C25/02</further-classification>  
        <further-classification edition="200601120260327B">F23G7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁平慎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHEI, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>依田洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YODA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郡山日出人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORIYAMA, HIDETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎一知</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, KAZUTOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中敬二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穂積崇史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOZUMI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川敬太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具除害功能之真空泵，可更安全地進行除害。此具除害功能之真空泵具備：乾式泵，其將來自工具的排放氣體予以真空排氣；除害部，其將藉由前述乾式泵所真空排氣的排放氣體進行除害；連結管，其將前述乾式泵與前述除害部予以連結；及覆蓋構件，其將前述連結管予以覆蓋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a vacuum pump with an abatement function that performs abatement more safely. The vacuum pump with the abatement function comprises: a dry pump performing vacuum exhaust of exhaust gas from a tool; an abatement unit abating harmful components from the exhaust gas evacuated by the dry pump; a connecting pipe connecting the dry pump to the abatement unit; and a cover member covering the connecting pipe.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:乾式泵</p>  
        <p type="p">11:增壓泵</p>  
        <p type="p">12:主泵</p>  
        <p type="p">13:殼體</p>  
        <p type="p">1a:排氣口</p>  
        <p type="p">1b:排氣管</p>  
        <p type="p">1c:開口部</p>  
        <p type="p">2:除害部</p>  
        <p type="p">21:燃燒部</p>  
        <p type="p">22:槽</p>  
        <p type="p">23:洗滌塔</p>  
        <p type="p">24:殼體</p>  
        <p type="p">2a:排氣口</p>  
        <p type="p">2b:排氣管</p>  
        <p type="p">2c:開口部</p>  
        <p type="p">3:連結管</p>  
        <p type="p">4:覆蓋構件</p>  
        <p type="p">41:上部分</p>  
        <p type="p">42:下部分</p>  
        <p type="p">61:桌台</p>  
        <p type="p">61a:孔</p>  
        <p type="p">61b:腳輪</p>  
        <p type="p">62:排氣管件</p>  
        <p type="p">63:腳輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2063" publication-number="202627188"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627188.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直電極配置</chinese-title>  
        <english-title>VERTICAL ELECTRODE CONFIGURATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C23C16/507</main-classification>  
        <further-classification edition="202601120260324B">H10P14/24</further-classification>  
        <further-classification edition="202601120260324B">H10P14/43</further-classification>  
        <further-classification edition="200601120260324B">H01J37/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝拉　卡羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERA, KALLOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩胡　魯帕利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHU, RUPALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘塔　賽耀史威普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANTA, SATHYA SWAROOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅夫　沙西德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAUF, SHAHID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示的實施例包括用於電漿增強沉積製程的電極配置。在範例中，電極配置包括沿著垂直軸對齊的晶圓處理區域的堆疊。複數個電極圍繞晶圓處理區域的堆疊。複數個電極中的每個電極沿著垂直軸延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein include electrode configurations for a plasma-enhanced deposition process. In an example, an electrode configuration includes a stack of wafer processing regions aligned along a vertical axis. A plurality of electrodes is surrounding the stack of wafer processing regions. Each one of the plurality of electrodes is extending along the vertical axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理系統/處理腔室/垂直電極配置</p>  
        <p type="p">102:晶圓</p>  
        <p type="p">104:接地</p>  
        <p type="p">106:第一個垂直電極</p>  
        <p type="p">108:第二個垂直電極</p>  
        <p type="p">110:第三個垂直電極</p>  
        <p type="p">112:第四個垂直電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2064" publication-number="202628755"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628755.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板及包含其之電子裝置</chinese-title>  
        <english-title>DISPLAY PANEL AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">H10K59/10</main-classification>  
        <further-classification edition="200601120260401B">G02F1/13</further-classification>  
        <further-classification edition="200601120260401B">G09G3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李揆汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GYUJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全亨一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, HYUNG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太昌一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAE, CHANG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板，包含一基板，該基板包含複數個島區域及複數個橋區域，該複數個橋區域將鄰近的島區域彼此連接；複數個像素，配置在該複數個島區域中；複數個導線，配置在該複數個橋區域中；一第一有機層，覆蓋該複數個像素、該複數個導線以及該基板的一側表面；一第一電極層，覆蓋該第一有機層並界定複數個第一開口，以與該複數個像素重疊；一第二有機層，覆蓋該第一電極層的一上表面及一側表面；以及一第二電極層，覆蓋該第二有機層並界定複數個第二開口，以與該複數個像素重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel includes a substrate including a plurality of island areas and a plurality of bridge areas connecting neighboring island areas to each other, a plurality of pixels arranged in the plurality of island areas, a plurality of wires arranged in the plurality of bridge areas, a first organic layer covering the plurality of pixels, the plurality of wires, and a side surface of the substrate, a first electrode layer covering the first organic layer and defining a plurality of first openings to overlap the plurality of pixels, a second organic layer covering an upper surface and a side surface of the first electrode layer, and a second electrode layer covering the second organic layer and defining a plurality of second openings to overlap the plurality of pixels.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">451:第一部分</p>  
        <p type="p">452:第二部分</p>  
        <p type="p">453:第一部分</p>  
        <p type="p">454:第二部分</p>  
        <p type="p">CNT:接觸孔</p>  
        <p type="p">EC1:第一電極單元</p>  
        <p type="p">EC2:第二電極單元</p>  
        <p type="p">Eh:電極孔</p>  
        <p type="p">I,II,III:區域</p>  
        <p type="p">RE:第一觸控電極</p>  
        <p type="p">TE:第二觸控電極</p>  
        <p type="p">TSA:觸控感測區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2065" publication-number="202626857"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626857.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓邊緣保護膜形成用組成物、晶圓邊緣保護膜形成方法、及圖案形成方法</chinese-title>  
        <english-title>COMPOSITION FOR FORMING WAFER-EDGE-PROTECTION FILM, WAFER-EDGE-PROTECTION FILM FORMING METHOD, AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G65/40</main-classification>  
        <further-classification edition="200601120260401B">C08L71/10</further-classification>  
        <further-classification edition="200601120260401B">C09D171/10</further-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新井田恵介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIDA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供能提供可展現優良的乾蝕刻耐性，而且即使在難以被覆的晶圓邊緣上仍可展現優良的均勻塗佈性之晶圓邊緣保護膜的晶圓邊緣保護膜形成用組成物。 &lt;br/&gt;該課題之解決手段為提供一種晶圓邊緣保護膜形成用組成物，係用以在基板的周緣端部形成晶圓邊緣保護膜，其特徵為含有：下述通式(1)表示之聚合物(A)及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="194px" width="305px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，W為-SO&lt;sub&gt;2&lt;/sub&gt;-、-C(=O)-或-O-，R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;、R&lt;sub&gt;3&lt;/sub&gt;、R&lt;sub&gt;4&lt;/sub&gt;及R&lt;sub&gt;5&lt;/sub&gt;分別獨立地為鹵素原子、碳數1~3之1價有機基、或羥基，a、b、c、d及e分別獨立地為0~4之整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a composition for forming a wafer-edge-protection film for forming a wafer-edge-protection film on a peripheral edge of a substrate, including a polymer (A) represented by the following general formula (1) and a solvent. In the formula (1), “W” represents -SO&lt;sub&gt;2&lt;/sub&gt;-, -C(=O)-, or -O-; R&lt;sub&gt;1&lt;/sub&gt;, R&lt;sub&gt;2&lt;/sub&gt;, R&lt;sub&gt;3&lt;/sub&gt;, R&lt;sub&gt;4&lt;/sub&gt;, and R&lt;sub&gt;5&lt;/sub&gt; each independently represent a halogen atom, a monovalent organic group having 1 to 3 carbon atoms, or a hydroxy group; and “a”, “b”, “c”, “d”, and “e” each independently represent an integer of 0 to 4. This can provide a composition for forming a wafer-edge-protection film capable of providing a wafer-edge-protection film that can exhibit excellent dry etching resistance and excellent uniform coatablity, even on a wafer edge that is difficult to be coated. &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="382px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓(基板，被加工基板)</p>  
        <p type="p">1a:頂點(周緣端)</p>  
        <p type="p">1E:周緣端部(晶圓邊緣)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2066" publication-number="202627661"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627661.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型光罩空白基板、及反射型光罩的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260401B">G03F1/24</main-classification>  
        <further-classification edition="201201120260401B">G03F1/48</further-classification>  
        <further-classification edition="201201120260401B">G03F1/52</further-classification>  
        <further-classification edition="201201120260401B">G03F1/54</further-classification>  
        <further-classification edition="201201120260401B">G03F1/60</further-classification>  
        <further-classification edition="201201120260401B">G03F1/80</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川村亮人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, RYOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井敬佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三村祥平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIMURA, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[解決手段]一種反射型光罩空白基板，其具備：基板、反射曝光光的多層反射膜、多層反射膜的保護膜、及吸收曝光光並具有相位移功能的光吸收膜，光吸收膜含有64至74原子%的釕(Ru)及26至36原子%的鉻(Cr)，且不含有氧(O)及氮(N)，光吸收膜的厚度為40至44nm，光吸收膜之相對於曝光光的反射率為12至15%，相對於曝光光的相位差為200至230度。 &lt;br/&gt;　　[效果]作為反射型光罩時，可提供具有晶圓轉印特性高(NILS之值大)、遮蔽效應之影響小之更薄的光吸收膜之反射型光罩空白基板，例如，在晶圓上之經微細化的線與間隙圖案中，賦予良好的圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:多層反射膜</p>  
        <p type="p">3:保護膜</p>  
        <p type="p">4:光吸收膜</p>  
        <p type="p">100:反射型光罩空白基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2067" publication-number="202625997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>按摩裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A61H7/00</main-classification>  
        <further-classification edition="200601120260330B">A61H23/04</further-classification>  
        <further-classification edition="200601120260330B">A61H9/00</further-classification>  
        <further-classification edition="200601120260330B">A61H39/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大東電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAITO ELECTRIC MACHINE INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳燕青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳煒偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水新策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種按摩裝置，其在不使用泵的情況下可迅速地將空氣從氣囊排出。按摩裝置20具有：基座部21，設置於椅子的靠背部；按摩部22，以相對於使用者可進退的方式支撐於基座部；氣囊61，配置在基座部21和按摩部22之間，藉由空氣的供給而膨脹，使按摩部22向使用者側伸出；空氣供給部62，對氣囊61供給空氣；以及空氣排出部63，壓縮氣囊61並將空氣排出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:按摩裝置</p>  
        <p type="p">21:基座部</p>  
        <p type="p">22:按摩部</p>  
        <p type="p">24:本體部</p>  
        <p type="p">24a:中央部</p>  
        <p type="p">24b:側部</p>  
        <p type="p">28:升降軸</p>  
        <p type="p">31:殼體</p>  
        <p type="p">32:施療構件</p>  
        <p type="p">36:臂部</p>  
        <p type="p">37:施療件</p>  
        <p type="p">41:驅動軸</p>  
        <p type="p">61:氣囊</p>  
        <p type="p">63:空氣排出部</p>  
        <p type="p">68:伸縮構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2068" publication-number="202626000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>按摩裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260227B">A61H23/02</main-classification>  
        <further-classification edition="200601120260227B">A61H39/04</further-classification>  
        <further-classification edition="200601120260227B">A61H7/00</further-classification>  
        <further-classification edition="200601120260227B">A61H9/00</further-classification>  
        <further-classification edition="200601120260227B">A61H15/00</further-classification>  
        <further-classification edition="200601120260227B">A47C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大東電機工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAITO ELECTRIC MACHINE INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳燕青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳煒偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水新策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠進行更加強力的按摩的按摩裝置。按摩裝置(20)具有：基座部(21)，配置於椅子型按摩機(10)的靠背部(12)；以及按摩部(22)，具有對使用者進行按摩的施療構件(32)、支撐施療構件(32)的軸(41)、以及驅動施療構件(32)的驅動機構(33、34)。按摩部(22)係通過軸(41)而擺動自如地支撐於基座部(21)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:按摩裝置</p>  
        <p type="p">21:基座部</p>  
        <p type="p">22:按摩部</p>  
        <p type="p">24:本體部(可動框架)</p>  
        <p type="p">24a:中央部</p>  
        <p type="p">24b:側部</p>  
        <p type="p">28:升降軸</p>  
        <p type="p">31:殼體(按摩框架)</p>  
        <p type="p">32:施療構件</p>  
        <p type="p">36:臂部</p>  
        <p type="p">37:施療件</p>  
        <p type="p">41:驅動軸</p>  
        <p type="p">61:氣囊(致動器)</p>  
        <p type="p">63:空氣排出部</p>  
        <p type="p">68:伸縮構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2069" publication-number="202626820"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626820.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139447</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能量線硬化性聚合體、包含該聚合體的能量線硬化性樹脂組合物、塗布液、樹脂膜形成膜及積層體的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F290/12</main-classification>  
        <further-classification edition="200601120260401B">C08F299/00</further-classification>  
        <further-classification edition="200601120260401B">C08F8/30</further-classification>  
        <further-classification edition="200601120260401B">C08L33/08</further-classification>  
        <further-classification edition="200601120260401B">C08K5/31</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">C09D133/08</further-classification>  
        <further-classification edition="201801120260401B">C09D7/63</further-classification>  
        <further-classification edition="200601120260401B">C09J133/08</further-classification>  
        <further-classification edition="200601120260401B">C09J11/06</further-classification>  
        <further-classification edition="200601120260401B">B32B7/12</further-classification>  
        <further-classification edition="200601120260401B">B32B37/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>學校法人東京理科大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO UNIVERSITY OF SCIENCE FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中佑耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有光晃二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMITSU, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明的目的是提供一種成分混合時的均勻性高、具有所期望的延遲硬化性及膜形成性的能量線硬化性樹脂組合物。 &lt;br/&gt;[解決手段] 其解決手段為使用一種能量線硬化性聚合體，具有新穎地合成的(甲基)丙烯醯基及、包含β-二羰基構造的基作為能量線硬化性樹脂組合物的主成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:樹脂膜形成用片</p>  
        <p type="p">10:樹脂膜形成膜</p>  
        <p type="p">10a:主面</p>  
        <p type="p">10b:主面</p>  
        <p type="p">21:第1剝離膜</p>  
        <p type="p">22:第2剝離膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2070" publication-number="202628508"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628508.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子零件安裝基板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H05K3/34</main-classification>  
        <further-classification edition="200601120260327B">H05K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>境忠彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TADAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉岡祐樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIOKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的實施形態之電子零件安裝基板的製造方法具有以下步驟：第1步驟，在電路基板所具有的複數個第1焊盤的每一個的至少一部分配置焊料助焊劑；第2步驟，在複數個第1焊盤的每一個透過焊料助焊劑搭載JIS規格所規定之0402尺寸以下的第1電子零件；及第3步驟，將在第2步驟中搭載有第1電子零件的電路基板加熱，而將第1電子零件焊接於第1焊盤的每一個，第1電子零件具有電子零件本體與一對第1端子，前述電子零件本體具有一對端面、上表面、下表面及一對側面，前述一對第1端子配置於電子零件本體的至少一對端面及下表面，且在表面具有焊料鍍敷，一對第1端子是在前述第3步驟中使焊料鍍敷中所含之焊料熔融固化而焊接於第1焊盤，在複數個第1焊盤的每一個並未形成有焊料預塗層，與以互相相鄰之方式焊接於第1焊盤的第1電子零件的每一個對應之第1焊盤彼此之間的距離為0.02mm以上且0.10mm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2071" publication-number="202626466"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626466.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送設備</chinese-title>  
        <english-title>TRANSPORT FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260312B">B65G47/66</main-classification>  
        <further-classification edition="200601120260312B">B65G47/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村和誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田晃大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">搬送設備10具備：第1搬送車20，具有使第1支撐面20a在第1位置與第2位置之間進行昇降的第1昇降部；第2搬送車30，具有一對的第2台車腳部36；及支撐台50，具有被4根的支柱53支撐且在比第1位置的第1支撐面20a更下側Z1且比第2位置的第1支撐面20a更上側支撐搬送物W的搬送物支撐面50a，在4根的支柱53當中，將相鄰一對的支柱53定為第1支柱組，第1外側間隔C1是構成第1支柱組之一對的支柱53無法相對地進入一對之第2台車腳部36的內側的間隔，第1內側間隔C2比第1外尺寸A1更大，第2外側間隔D1比第2內尺寸B2更小，第2內側間隔D2是第1搬送車20無法通過的間隔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:搬送設備</p>  
        <p type="p">11:行走面</p>  
        <p type="p">20:第1搬送車</p>  
        <p type="p">20a:第1支撐面</p>  
        <p type="p">25:第1台車部</p>  
        <p type="p">30:第2搬送車</p>  
        <p type="p">31:第2支撐部</p>  
        <p type="p">35:第2台車本體部</p>  
        <p type="p">36:第2台車腳部</p>  
        <p type="p">50:支撐台</p>  
        <p type="p">50a:搬送物支撐面</p>  
        <p type="p">51:搬送物支撐部</p>  
        <p type="p">53:支柱</p>  
        <p type="p">55a:第1開口</p>  
        <p type="p">56:第2開口</p>  
        <p type="p">58:引導部</p>  
        <p type="p">A1:第1外尺寸</p>  
        <p type="p">A3:第3外尺寸</p>  
        <p type="p">B1:第2外尺寸</p>  
        <p type="p">B2:第2內尺寸</p>  
        <p type="p">B4:第4外尺寸</p>  
        <p type="p">C1:第1外側間隔</p>  
        <p type="p">C2:第1內側間隔</p>  
        <p type="p">D1:第2外側間隔</p>  
        <p type="p">D2:第2內側間隔</p>  
        <p type="p">E1:第3外側間隔</p>  
        <p type="p">E2:第3內側間隔</p>  
        <p type="p">F1:第4外側間隔</p>  
        <p type="p">F2:第4內側間隔</p>  
        <p type="p">Q1:轉向軌跡</p>  
        <p type="p">Ua:第1方向</p>  
        <p type="p">Ub:第2方向</p>  
        <p type="p">Xa:第1行走方向</p>  
        <p type="p">Xa1:第1行走方向第1側</p>  
        <p type="p">Xa2:第1行走方向第2側</p>  
        <p type="p">Xb:第2行走方向</p>  
        <p type="p">Xb1:第2行走方向第1側</p>  
        <p type="p">Xb2:第2行走方向第2側</p>  
        <p type="p">Ya:第1寬度方向</p>  
        <p type="p">Yb:第2寬度方向</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">Z1:上側</p>  
        <p type="p">Z2:下側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2072" publication-number="202626523"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626523.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫超純水製造系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260330B">C02F1/02</main-classification>  
        <further-classification edition="202201120260330B">F24H1/10</further-classification>  
        <further-classification edition="202301120260330B">C02F9/00</further-classification>  
        <further-classification edition="200601120260330B">G01N33/18</further-classification>  
        <further-classification edition="200601320260330B">C02F103/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栩内優仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOCHINAI, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福井長雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUI, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">溫超純水製造系統具有：超純水製造部，包括一次純水製造裝置及二次純水製造裝置1；溫超純水供給配管21，自所述超純水製造部向第二使用點25供給超純水W1；以及餘熱器22及加熱器23，對超純水W1進行加熱，自溫超純水供給配管21分支並連接有採水線31。溫超純水供給配管21包含重複單元中包含鹵素元素的高分子材料。採水線31包含重複單元中不含鹵素元素的高分子材料或金屬材料。若為此種溫超純水製造系統，則可包括可進行溫超純水的準確的水質評價、廉價且可預見穩定供給且容易獲得的構件所形成的採水線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:二次純水裝置(子系統、二次純水製造裝置)</p>  
        <p type="p">2:子罐</p>  
        <p type="p">2A:送水配管</p>  
        <p type="p">3:送水泵</p>  
        <p type="p">4:熱交換器</p>  
        <p type="p">5:紫外線氧化裝置</p>  
        <p type="p">6:過氧化氫分解裝置</p>  
        <p type="p">7:膜式脫氣裝置</p>  
        <p type="p">8:升壓泵</p>  
        <p type="p">9:非再生式離子交換樹脂裝置</p>  
        <p type="p">10、24:超濾膜(UF膜)</p>  
        <p type="p">11:超純水供給配管</p>  
        <p type="p">12:第一使用點</p>  
        <p type="p">13、26、27:返送配管</p>  
        <p type="p">21:溫超純水供給配管</p>  
        <p type="p">22:餘熱器(第一加熱部件)</p>  
        <p type="p">23:加熱器(第二加熱部件)</p>  
        <p type="p">25:第二使用點</p>  
        <p type="p">31:採水線</p>  
        <p type="p">32:開閉閥</p>  
        <p type="p">33:冷卻用的熱交換器(熱交換器)</p>  
        <p type="p">34:元件</p>  
        <p type="p">W:一次純水</p>  
        <p type="p">W1:超純水</p>  
        <p type="p">W2:溫超純水</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2073" publication-number="202627238"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627238.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電鍍裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C25D17/00</main-classification>  
        <further-classification edition="200601120260330B">C25D17/02</further-classification>  
        <further-classification edition="200601120260330B">C25D17/06</further-classification>  
        <further-classification edition="200601120260330B">C25D17/10</further-classification>  
        <further-classification edition="200601120260330B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商法西利迪有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FACILITY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸一之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHI, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種電鍍裝置，用以於至少一部份浸漬於鍍覆液中的狀態的基板的單面或雙面形成鍍覆層，能夠藉由遮蔽構件的筒狀之遮蔽部將形成於對象面的鍍覆層均一化，並且抑制整體大型化。 &lt;br/&gt;　　[解決手段] 其具備：陽極；保持器，將基板的形成鍍覆層的對象面以朝向陽極側的方式加以保持；電源，對該保持器保持的基板與陽極之間施加電壓以形成電場；以及多個遮蔽構件，配置於保持在保持器的基板與陽極之間，且遮蔽電場一部份。基板側的遮蔽構件在垂直穿過對象面的軸方向視圖中，具有沿著該基板周緣的周壁且其兩端側開口的筒狀之遮蔽部；陽極側的遮蔽構件則在垂直穿過對象面的軸方向視圖中，形成於覆蓋陽極之一部份的範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:基板側遮蔽構件</p>  
        <p type="p">7:陽極側遮蔽構件</p>  
        <p type="p">9a:連通口</p>  
        <p type="p">26:遮蔽部</p>  
        <p type="p">L:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2074" publication-number="202626790"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626790.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物、雷射切割用保護膜劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F20/54</main-classification>  
        <further-classification edition="200601120260401B">C09D133/24</further-classification>  
        <further-classification edition="201401120260401B">B23K26/38</further-classification>  
        <further-classification edition="201401120260401B">B23K26/70</further-classification>  
        <further-classification edition="202601120260401B">H10P54/20</further-classification>  
        <further-classification edition="202601120260401B">H10P54/92</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAWARA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小西淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種聚合物，其耐熱性優異，在摻合於半導體晶圓等之雷射切割加工用保護膜劑時，不易引起保護膜劑的劣化。 &lt;br/&gt;　　一種重量平均分子量未達100萬之聚合物，其包含下述式(1)所示之構成單位，且為(i)前述構成單位之均聚物，或，(ii)前述構成單位，與從選自由N-乙烯基羧酸醯胺、不飽和羧酸單體、不飽和羧酸單體之鹽、不飽和羧酸酯單體、乙烯基酯單體、不飽和腈單體所成群組之至少1種單體(稱為其他單體)所衍生之構成單位之共聚物的任一者； &lt;br/&gt;&lt;img align="absmiddle" height="155px" width="261px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，R&lt;sup&gt;1&lt;/sup&gt;~R&lt;sup&gt;5&lt;/sup&gt;表示氫原子、碳數1~8之烷基或羥基烷基之任一者)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2075" publication-number="202626748"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626748.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物、酸洗淨劑，及聚合物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/10</main-classification>  
        <further-classification edition="200601120260401B">C08F4/04</further-classification>  
        <further-classification edition="200601120260401B">C08F20/54</further-classification>  
        <further-classification edition="200601120260401B">C08F26/02</further-classification>  
        <further-classification edition="200601120260401B">C11D3/37</further-classification>  
        <further-classification edition="200601120260401B">C11D7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P52/00</further-classification>  
        <further-classification edition="202601120260401B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAWARA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小西淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種水溶性聚合物，其為低黏度，且能承受強酸性或強氧化力之過氧化氫等使用環境。 &lt;br/&gt;　　一種聚合物，其為包含下述式(1)所示之構成單位之聚合物，且10質量%之水溶液之黏度為10mPa･s以上。 &lt;br/&gt;&lt;img align="absmiddle" height="223px" width="414px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，m及n為0或1，m+n=1，R&lt;sup&gt;1&lt;/sup&gt;~R&lt;sup&gt;5&lt;/sup&gt;表示氫原子、碳數1~8之烷基或羥基烷基，及苯基之任一者)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2076" publication-number="202626791"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626791.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物及塗覆液、塗覆層</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F20/54</main-classification>  
        <further-classification edition="200601120260401B">C09D133/24</further-classification>  
        <further-classification edition="201801120260401B">C09D7/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAWARA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小西淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種聚合物，其係作為增黏劑、塗覆劑而使用於高耐熱性，且在高溫下能保持充分性能之塗覆液。 &lt;br/&gt;　　一種重量平均分子量100萬以上之聚合物，其包含下述式(1)所示之構成單位，且為(i)前述構成單位之均聚物，或，(ii)前述構成單位與從選自由N-乙烯基羧酸醯胺、不飽和羧酸單體、不飽和羧酸單體之鹽、不飽和羧酸酯單體、乙烯基酯單體、不飽和腈單體所成群組之至少1種單體(稱為其他單體)所衍生之構成單位之共聚物的任一者。 &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="332px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，R&lt;sup&gt;1&lt;/sup&gt;~R&lt;sup&gt;5&lt;/sup&gt;表示氫原子、碳數1~8之烷基或羥基烷基之任一者)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2077" publication-number="202627177"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627177.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於化學蒸氣處理反應器之饋入總成及方法</chinese-title>  
        <english-title>IN-FEED ASSEMBLIES AND METHODS FOR CHEMICAL VAPOR PROCESSING REACTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C23C16/455</main-classification>  
        <further-classification edition="200601120260331B">C23C16/54</further-classification>  
        <further-classification edition="202601120260331B">H10P14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商皮寇桑公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PICOSUN OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇雷什巴布　蘇瑞吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURESH BABU, SURAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡什亞普　德里曼　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHYAP, DHRITIMAN SUBHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍姆　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLM, NIKLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰勒　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAYLOR, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆罕默德　薩夫達爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUHAMMAD, SAFDAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬漢　沙米爾辛格　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAUHAN, SAMIRSINH GANPATSINH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮亞拉特　法比安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIALLAT, FABIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾馬　瓦倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, VARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於一化學蒸氣處理反應器之饋入部件、具有此類饋入部件之化學蒸氣處理器及其操作方法。該饋入部件界定一擴展空間，該擴展空間經組配以將反應物作為來自一電漿源之一頂部至底部流引導通過一反應腔室，該饋入部件具有：一主體，其包含一底部端處之一開口，該開口經組配以置放成靠近該反應腔室之一反應碗，該主體之側面包含用於接收以下中之至少一者的至少一個氣體入口：一載體氣體及一前驅物；一混合通道，其配置於該主體內或鄰近於該主體，使得該至少一個氣體入口與該混合通道流體連接，該混合通道之側面包含流體連接該混合通道與該擴展空間之一噴嘴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In-feed part for a chemical vapor processing reactor, chemical vapor processor having such an in-feed part and methods of operating the same. The in-feed part defining an expansion space which is configured to lead reactants as a top to bottom flow from a plasma source through a reaction chamber, the in-feed part having: a body comprising an opening at a bottom end configured to be placed proximate a reaction bowl of the reaction chamber, the side of the body comprising at least one gas inlet for receiving at least one of a: a carrier gas and a precursor; a mixing channel arranged within or adjacent to the body such that the at least one gas inlet is in fluid connection with the mixing channel, the side of the mixing channel comprising a nozzle fluidly connecting the mixing channel with the expansion space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:饋入部件，總成</p>  
        <p type="p">105:擴展空間</p>  
        <p type="p">110:主體</p>  
        <p type="p">111:元件</p>  
        <p type="p">121,122:開口</p>  
        <p type="p">131:氣體入口，入口</p>  
        <p type="p">133:噴嘴</p>  
        <p type="p">135:混合通道</p>  
        <p type="p">150:反應腔室，反應碗，碗</p>  
        <p type="p">152:排出口</p>  
        <p type="p">155:基體</p>  
        <p type="p">B:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2078" publication-number="202628091"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628091.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體設備</chinese-title>  
        <english-title>MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260112B">G11C7/22</main-classification>  
        <further-classification edition="200601120260112B">G11C8/18</further-classification>  
        <further-classification edition="200601120260112B">G11C11/4063</further-classification>  
        <further-classification edition="200601120260112B">G11C11/4094</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈東潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KA, DONG YOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴敏哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, MIN CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體設備包括：第一控制電路，其與資料輸入和輸出電路相鄰，並且第一控制電路基於在資料輸出操作開始之後產生的輸出控制脈衝來產生被驅動到第一內部電壓的輸出致能訊號，透過接收被驅動到第二內部電壓的延遲輸出致能訊號來透過中繼器從載入到全域線上的內部資料產生輸出資料，並且將該輸出資料輸出給資料輸入和輸出電路；資料儲存電路，其與第一控制電路相鄰，並且在資料輸出操作開始之後將內部資料輸出給全域線；以及第二控制電路，其與資料儲存電路相鄰，並且在資料輸出操作開始之後基於輸出致能訊號來產生延遲輸出致能訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a first control circuit that is adjacent to a data input and output circuit and that generates an output enable signal driven to a first internal voltage based on an output control pulse generated after the start of a data output operation, generates output data from internal data loaded onto a global line through a repeater by receiving a delay output enable signal driven to a second internal voltage, and outputs the output data to the data input and output circuit, a data storage circuit that is adjacent to the first control circuit and that outputs the internal data to the global line after the start of the data output operation, and a second control circuit that is adjacent to the data storage circuit and that generates the delay output enable signal based on the output enable signal after the start of the data output operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體系統</p>  
        <p type="p">10:控制器</p>  
        <p type="p">20:記憶體設備</p>  
        <p type="p">240:記憶體電路</p>  
        <p type="p">241:第一控制電路(1st CTR CT)</p>  
        <p type="p">242:第二控制電路(2nd CTR CT)</p>  
        <p type="p">243:資料儲存電路(SC)</p>  
        <p type="p">250:資料輸入和輸出電路(DATA I/O)</p>  
        <p type="p">CA:命令位址</p>  
        <p type="p">CLK:時脈</p>  
        <p type="p">DATA:資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2079" publication-number="202626671"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626671.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>海鞘素類化合物、其偶聯物及其製備方法和用途</chinese-title>  
        <english-title>TRABECTEDIN COMPOUNDS, THEIR CONJUGATES, AND METHODS FOR THEIR PREPARATION AND USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D515/22</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07K16/30</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商映恩生物科技（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUALITY BIOLOGICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林聖超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHENGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁力文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, LIWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花海清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, HAIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱忠遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZHONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種海鞘素類化合物、其偶聯物及其製備方法和用途，具體揭露了包含如式I所示結構的配體藥物偶聯物。本發明揭露的配體藥物偶聯物具有較好的腫瘤細胞增殖抑制活性或較好的體內抑瘤效果。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="252px" width="252px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a trabectedin compound, its conjugate, and methods for their preparation and use. In particular, it discloses ligand-drug conjugates comprising a structure represented by Formula I. The ligand-drug conjugates disclosed herein exhibit excellent tumor cell proliferation inhibitory activity and/or favorable in vivo antitumor efficacy.</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="238px" width="225px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2080" publication-number="202627683"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627683.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微影底層之不含ＰＦＡＳ之酸生成劑</chinese-title>  
        <english-title>PFAS-FREE ACID GENERATORS FOR LITHOGRAPHY UNDERLAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G03F7/039</main-classification>  
        <further-classification edition="200601120260324B">B01J27/24</further-classification>  
        <further-classification edition="200601120260324B">G03F7/11</further-classification>  
        <further-classification edition="200601120260324B">G03F7/16</further-classification>  
        <further-classification edition="200601120260324B">G03F7/20</further-classification>  
        <further-classification edition="202601120260324B">H10P14/00</further-classification>  
        <further-classification edition="202601120260324B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商布魯爾科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREWER SCIENCE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱林徽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, LINHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道爾提二世　理查　艾爾斯沃斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAUGHERTY JR., RICHARD ELSWORTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科扎　雅庫布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOZA, JAKUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂澎濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, PENGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里須納摩堤　凡達娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAMURTHY, VANDANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供修改不含PFAS的產品以使該等產品適合供於半導體微影製程中使用的方法。該修改方法包括形成該產品之分散液或溶液並於冷條件下儲存其以實現該產品之目標化合物（例如酸生成劑）之沉澱。接著可將該經修改產品用於種種類型的微影組成物以形成會滿足對於半導體元件製造的嚴格微影產業要求的所欲層（例如旋塗碳或其他富碳層、硬掩模層）同時最小化含PFAS材料之使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of modifying PFAS-free products to render those products suitable for use in semiconductor lithography processes is provided. The modification method involves forming a dispersion or solution of the product and storing it under cold conditions to effect precipitation of the target compound of the product (e.g., an acid generator). The modified product can then be used in various types of lithography compositions to form a desired layer (e.g., spin-on carbon or other carbon-rich layer, hardmask layer) that will meet stringent lithographic industry requirements for semiconductor device manufacture while minimizing use of PFAS-containing materials.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2081" publication-number="202626774"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626774.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08F2/50</main-classification>  
        <further-classification edition="200601120260323B">C08F290/06</further-classification>  
        <further-classification edition="200601120260323B">C08L33/10</further-classification>  
        <further-classification edition="200601120260323B">C08G63/84</further-classification>  
        <further-classification edition="201401120260323B">C09D11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川直優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, NAOMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩脇寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAWAKI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>名田敬之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NADA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種硬化性組成物，所述硬化性組成物包含半導體粒子與多官能的聚合性化合物且光學特性良好。本發明為一種硬化性組成物，其包含半導體粒子（A）與聚合性化合物（B），且所述硬化性組成物中，所述聚合性化合物（B）包含含有至少一個顯示出對於所述半導體粒子（A）的配位能力的官能基的聚合性化合物（B-1）、及不含有顯示出對於所述半導體粒子（A）的配位能力的官能基的多官能(甲基)丙烯酸酯即聚合性化合物（B-2），所述硬化性組成物100質量%中的所述半導體粒子（A）的含量為32質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2082" publication-number="202626194"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626194.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＣＯ吸附之混合連接體鋅—三唑—草酸鹽ＭＯＦ組成物</chinese-title>  
        <english-title>MIXED LINKER ZINC-TRIAZOLE-OXALATE MOF COMPOSITIONS FOR CO ADSORPTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01J20/22</main-classification>  
        <further-classification edition="200601120260401B">B01J20/28</further-classification>  
        <further-classification edition="200601120260401B">B01J20/30</further-classification>  
        <further-classification edition="200601120260401B">B01D53/04</further-classification>  
        <further-classification edition="200601120260401B">B01D53/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商紐麥特科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUMAT TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋口　布萊恩　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIGUCHI, BRIAN G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">MOF組成物係自包含鋅離子、草酸根及一或多種選自以下者之一的經取代環氮雜二價碳基化合物的反應混合物形成：(a)至少二種不同的環氮雜二價碳基化合物，其等中之每一者皆經至少單取代，或(b)至少一種經二取代的環氮雜二價碳基化合物。該MOF組成物可用於自含二氧化碳的氣體之混合物捕捉二氧化碳的方法。亦於本文揭露者係製造該MOF組成物的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A MOF composition is formed from a reaction mixture comprising zinc ions, oxalate, and one or more substituted cycloazocarbyl compounds selected from either (a) at least two different cycloazocarbyl compounds, each of which is at least mono-substituted, or (b) at least one cycloazocarbyl compound that is di-substituted. The MOF composition can be used in a method of capturing carbon dioxide from a mixture of gases containing carbon dioxide. Also disclosed herein is a method of making the MOF composition.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2083" publication-number="202626369"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626369.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層膜及顯示裝置</chinese-title>  
        <english-title>LAMINATED FILM AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">B32B27/32</main-classification>  
        <further-classification edition="200601120260317B">B32B7/10</further-classification>  
        <further-classification edition="200601120260317B">B32B3/30</further-classification>  
        <further-classification edition="200601120260317B">H05B33/02</further-classification>  
        <further-classification edition="200601120260317B">G02B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商柯尼卡美能達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONICA MINOLTA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森川雅弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIKAWA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大久保康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUBO, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松坂美香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSAKA, MIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮坂俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASAKA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小長啓人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONAGA, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南條崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANJIYOU, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎幸司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供不易與基材發生剝離，且能夠抑制光學不均的積層膜及顯示裝置。 &lt;br/&gt;本發明的積層膜係依序具備基材膜、接著層及硬化層；前述基材膜係至少含有環烯烴系樹脂或纖維素酯系樹脂中之任一種；前述接著層係含有(甲基)丙烯酸酯；由奈米壓痕法所算出的前述接著層的硬度HA與前述基材膜的硬度HB係滿足下式(1)及下式(2)；且前述硬化層的與前述接著層側為相反側的表面係具有微細凹凸構造。 &lt;br/&gt;式(1)   0.26≦HA≦0.50 [GPa] &lt;br/&gt;式(2)   0.20≦HB≦0.36 [GPa]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the present invention is to provide a laminated film and a display device capable of suppressing optical unevenness and being resistant to peeling from a substrate. &lt;br/&gt;A laminated film comprising a base film, an adhesive layer, and a cured layer in this order, wherein the base film contains at least one of a cycloolefin-based resin and a cellulose ester-based resin; the adhesive layer contains (meth)acrylate; a hardness HA of the adhesive layer and a hardness HB of the base film, calculated by a nanoindentation method, satisfy the following expression (1) and (2) below; and a surface of the cured layer on a side opposite to the adhesive layer has a fine uneven structure. &lt;br/&gt;Expression (1) 0.26≦HA≦0.50 [GPa] &lt;br/&gt;Expression (2) 0.20≦HB≦0.36 [GPa]&lt;b&gt;  &lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AL:接著層</p>  
        <p type="p">CF:載體膜</p>  
        <p type="p">L:硬化層</p>  
        <p type="p">LAL:黏著層(載體膜CF的黏著層)</p>  
        <p type="p">SF:基材膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2084" publication-number="202628288"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628288.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＥＵＶ驅動雷射器、具有ＥＵＶ驅動雷射器的設備、用途、產生放大光束的方法、將塗覆有感光塗層的半導體基板用ＥＵＶ光曝光的方法和生產微晶片或半導體中間體的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">H01S3/091</main-classification>  
        <further-classification edition="200601120260324B">H01S3/16</further-classification>  
        <further-classification edition="200601120260324B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾丹姆　提諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EIDAM, TINO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞普卡　法比安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIPKA, FABIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛勞斯　鈞瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRAUSS, GUENTHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾曼　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEUERMANN, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋達　克里斯欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAIDA, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓恩　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAHN, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於產生靶材(20)的發射EUV光(14)的電漿的EUV驅動雷射器(16)。該EUV驅動雷射器(16)具有射束源裝置(30)，該射束源裝置具有至少一個射束源(32)，該射束源(32)係經設計用於產生具有第一波長λ&lt;sub&gt;1&lt;/sub&gt;的光束(34)。此外，該EUV驅動雷射器(16)具有放大器裝置(36)，該放大器裝置(36)具有至少一個光學放大器(38)，該光學放大器(38)具有第一活性介質(48)，其中該光學放大器(38)係經設計用於將穿過該光學放大器(38)的該光束(34)的至少一部分光學放大為放大光束(18)。存在泵浦源裝置(40)，該泵浦源裝置(40)具有至少一個光學泵浦源單元(42)，該光學泵浦源單元具有第二活性介質(50)，其中該光學泵浦源單元(42)係經設計用於產生具有第二波長λ&lt;sub&gt;2&lt;/sub&gt;的泵浦射束(44)並向該光學放大器(38)供應光學泵浦能量。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img> 
        <p type="p">10:設備</p>  
        <p type="p">12:半導體基板</p>  
        <p type="p">14:EUV光</p>  
        <p type="p">16:EUV驅動雷射器</p>  
        <p type="p">18:放大光束</p>  
        <p type="p">20:靶材</p>  
        <p type="p">22:靶室</p>  
        <p type="p">24:靶材產生器</p>  
        <p type="p">26:EUV光收集設備</p>  
        <p type="p">28:EUV光導引設備</p>  
        <p type="p">30:射束源裝置</p>  
        <p type="p">32:射束源</p>  
        <p type="p">34:光束</p>  
        <p type="p">36:放大器裝置</p>  
        <p type="p">38:光學放大器</p>  
        <p type="p">40:泵浦源裝置</p>  
        <p type="p">42:光學泵浦源單元</p>  
        <p type="p">44:泵浦射束</p>  
        <p type="p">46:聚焦單元</p>  
        <p type="p">51a:分束器裝置</p>  
        <p type="p">51b:射束組合單元</p>  
        <p type="p">λ&lt;sub&gt;1&lt;/sub&gt;:第一波長</p>  
        <p type="p">λ&lt;sub&gt;2&lt;/sub&gt;:第二波長</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2085" publication-number="202626728"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626728.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗CD45抗體及其結合物</chinese-title>  
        <english-title>ANTI-CD45 ANTIBODIES AND CONJUGATES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07K16/28</main-classification>  
        <further-classification edition="200601120260324B">A61K39/395</further-classification>  
        <further-classification edition="201701120260324B">A61K47/54</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波坦諾　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOITANO, ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫克　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOKE, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克唐納　夏洛特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCDONAGH, CHARLOTTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕喬德禹立　拉胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALCHAUDHURI, RAHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瓦爾　拉吉芙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANWAR, RAJIV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩兒斯　布蘭德利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEARSE, BRADLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>偉德布姆　波爾　費德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIDBOOM, PAUL FREDRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫魯提　帕特瑞西亞　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRUITE, PATRICIA ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示特異性結合至人類CD45之抗CD45抗體、其抗原結合片段及抗體藥物結合物(ADC)。該等抗體及ADC可用於包括耗盡患者之CD45+細胞之方法在內之治療方法中。本文所述之組合物及方法可例如藉由耗盡CD45+癌細胞或自體免疫細胞群體用於直接治療病症。本文所述之組合物及方法亦可用於使患者為進行造血幹細胞移植療法作好準備，及藉由在移植程序之前選擇性耗盡內源CD45+細胞來改良造血幹細胞移植物之植入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are anti-CD45 antibodies, antigen binding fragments thereof, and antibody drug conjugates (ADCs) that specifically bind to human CD45. Such antibodies and ADCs are useful in therapeutic methods, including methods of depleting CD45+ cells from a patient. The compositions and methods described herein can be used to treat a disorder directly, for instance, by depleting a population of CD45+ cancer cells or autoimmune cells. The compositions and methods described herein can also be used to prepare a patient for hematopoietic stem cell transplant therapy, and to improve the engraftment of hematopoietic stem cell transplants, by selectively depleting endogenous CD45+ cells prior to the transplant procedure.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2086" publication-number="202627165"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627165.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用陳化來控制電弧</chinese-title>  
        <english-title>CONTROLLING ARCING WITH SEASON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C16/40</main-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="200601120260401B">C23C16/513</further-classification>  
        <further-classification edition="200601120260401B">C23C16/52</further-classification>  
        <further-classification edition="200601120260401B">H01J37/32</further-classification>  
        <further-classification edition="200601120260401B">H05H1/24</further-classification>  
        <further-classification edition="202601120260401B">H10P72/00</further-classification>  
        <further-classification edition="202601120260401B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚　亞利森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAU, ALLISON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅世晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, SHICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>札那　馬諾哲古瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANA, MANOJ KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>頓志淩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUN, ZHILING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于　航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕迪　迪內什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PADHI, DEENESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了腔室元件的陳化方法、基板的處理方法以及經過陳化的腔室元件。這些方法包含在沉積溫度下，將一或多種沉積前驅物流入收容半導體處理腔室元件的半導體處理腔室的基板處理區域。方法還包含基板處理區域，包含靜電夾盤，且該一或多種沉積前驅物一般不含氮化物前驅物。方法包含在半導體處理腔室元件上沉積至少一第一陳化層，其中該至少該第一陳化層的厚度大於0.5µm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of season chamber components, methods of processing substrates, and seasoned chamber components are provided. Methods include flowing one or more deposition precursors at a deposition temperature into a substrate processing region of a semiconductor processing chamber housing the semiconductor processing chamber component. Methods include where the substrate processing region includes an electrostatic chuck, and the one or more deposition precursors are generally free of a nitride precursor. Methods include depositing at least a first seasoning layer on the semiconductor processing chamber component, where the at least the first seasoning layer has a thickness of greater than 0.5 µm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:元件</p>  
        <p type="p">510:陳化層</p>  
        <p type="p">520:頂表面</p>  
        <p type="p">525:底表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2087" publication-number="202628945"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628945.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電子束互疊計量的層分離</chinese-title>  
        <english-title>LAYER SEPARATION FOR E-BEAM OVERLAY METROLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P74/20</main-classification>  
        <further-classification edition="201801120260327B">G01N23/2252</further-classification>  
        <further-classification edition="201701120260327B">G06T7/66</further-classification>  
        <further-classification edition="200601120260327B">H01J37/256</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商應用材料以色列公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾馬　桑卡爾普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERMA, SANKALP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫哈努拉胡納森　甘內許庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHANUR RAGHUNATHAN, GANESH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊圖納納莫爾蒂　巴拉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITHUGNANAMOORTHY, BALAJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案揭示一種用於電子束互疊計量的層分離的電腦化系統，其包括：配置為從由X光檢測器檢測到且回應於利用電子束照射晶圓產生的X光訊號的上層訊號成分和下層訊號成分中產生X光影像的處理和記憶體電路（PMC）。該晶圓包括：由第一材料組成的上層和由不同材料組成的下層。上層包括：複數個第一圖案，且下層包括：複數個第二圖案，其中該等第二圖案中的至少幾個第二圖案部分地或完全地被該等第一圖案中的幾個第一圖案遮蔽。上層訊號成分和下層訊號成分分別地代表在上層和下層中的圖案，且其中上層訊號成分和下層訊號成分可藉由取決於其各自的第一材料和第二材料的獨特的波長進行區分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computerized system for layer separation for e-beam overlay metrology that includes a processing and memory circuitry (PMC) configured to generate an X-ray image from an upper layer signal component and a lower layer signal component of an X-ray signal that is detected by an X-ray detector and is generated in response to illuminating a wafer with an e-beam. the wafer includes an upper layer composed of a first material and a lower layer composed of a different material. The the upper layer includes a plurality of first patterns and the lower layer includes a plurality of second patterns, wherein at least a few of the second patterns are partially or fully occluded by a few of the first patterns. The upper layer signal component and the lower-layer signal component represents the patterns in the upper and lower layers respectively, and wherein the upper layer and lower layer signal components are segregable by unique wavelengths that depend on their respective first and second materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401:電子束(e-beam)</p>  
        <p type="p">402:步驟</p>  
        <p type="p">403:X光影像</p>  
        <p type="p">404:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2088" publication-number="202627192"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627192.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139656</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用變溫製程之矽化物形成</chinese-title>  
        <english-title>SILICIDE FORMATION BY USING VARIATING TEMPERATURE PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C23C16/52</main-classification>  
        <further-classification edition="200601120260319B">C30B25/16</further-classification>  
        <further-classification edition="200601120260319B">C23C16/42</further-classification>  
        <further-classification edition="202601120260319B">H10P14/40</further-classification>  
        <further-classification edition="202601120260319B">H10P14/43</further-classification>  
        <further-classification edition="202501120260319B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江　瑩冰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YING-BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫　源中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, YUAN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雨馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　正周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOUNG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛拉托斯　艾夫傑尼諾斯Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELATOS, AVGERINOS V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在半導體結構中形成金屬矽化物層的方法包括在處理腔室中執行矽化物沉積製程，其中，金屬矽化物層形成在形成於半導體結構中的開口內的矽表面上，開口的內表面包括矽表面，其中矽化物沉積製程包括在處理腔室中以第一溫度流動含金屬前驅物，持續第一期間，以在開口的頂部區域的矽表面上沉積金屬矽化物層，並且在處理腔室中以第二溫度流動含金屬前驅物，持續第二期間，以在開口的底部區域的矽表面上沉積金屬矽化物層，其中第二溫度低於第一溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a metal silicide layer in a semiconductor structure Includes performing a silicide deposition process in a processing chamber, in which a metal silicide layer is formed on silicon surfaces within an opening formed in a semiconductor structure, inner surfaces of the opening comprising the silicon surfaces, wherein the silicide deposition process comprises flowing a metal-containing precursor in the processing chamber at a first temperature for a first duration, to deposit the metal silicide layer on the silicon surfaces at a top region of the opening, and flowing the metal-containing precursor in the processing chamber at a second temperature for a second duration, to deposit the metal silicide layer on the silicon surfaces at a bottom region of the opening, wherein the second temperature is lower than the first temperature.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2089" publication-number="202626926"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626926.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橡膠組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L1/02</main-classification>  
        <further-classification edition="200601120260401B">C08L9/00</further-classification>  
        <further-classification edition="200601120260401B">C08L23/16</further-classification>  
        <further-classification edition="200601120260401B">C08K3/04</further-classification>  
        <further-classification edition="200601120260401B">C08K5/14</further-classification>  
        <further-classification edition="200601120260401B">C08K7/02</further-classification>  
        <further-classification edition="201101120260401B">B82Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商山陽色素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYO COLOR WORKS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本玉直哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONTAMA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種橡膠組合物，在形成片狀時，紋理方向和與其正交的橫紋理方向上的拉伸物性之差小，能夠抑制通過成型加工在橡膠成型體中產生的各向異性。本發明的橡膠組合物包含：100質量份的含有三元乙丙橡膠（EPDM）和丁二烯橡膠（BR）的橡膠成分（A）；26.5質量份～69.5質量份的含有微原纖化纖維素和炭黑的填充劑成分（B）；2質量份～6質量份的有機過氧化物交聯劑（C），橡膠成分（A）中，EPDM為65質量份～88質量份，BR為12質量份～35質量份，填充劑成分（B）中，微原纖化纖維素為1.5質量份～4.5質量份，炭黑為25質量份～65質量份。當橡膠成分為EPDM和丁苯橡膠（SBR）時，EPDM為45質量份～82質量份，SBR為18質量份～55質量份，填充劑成分（B）中，微原纖化纖維素為1.5質量份～4.5質量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2090" publication-number="202627657"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627657.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遮罩寫入系統、光束成形模組及雷射光束處理方法</chinese-title>  
        <english-title>MASK WRITING SYSTEM, BEAM SHAPING MODULE AND METHOD OF LASER BEAM PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260401B">G03F1/22</main-classification>  
        <further-classification edition="201401120260401B">B23K26/064</further-classification>  
        <further-classification edition="201401120260401B">B23K26/0622</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　麥克東薛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MICHAEL DONGXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇斯利　李艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUSLEY, LEE ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊普利　約書亞邁爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEPLEY, JOSHUA MILES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">遮罩寫入系統可包括：雷射源，產生雷射光束、多光束調製器，接收輸入雷射光束並從該輸入雷射光束產生複數個調製雷射光束、掃描器，將複數個調製雷射光束引導到遮罩支架，以及雷射光束成形模組，設置於雷射源與多光束調製器之間。因此，雷射光束成形模組可包括多透鏡系統，多透鏡系統沿著主光束路徑設置。多透鏡系統可包括：第一透鏡，接收雷射光束並輸出第一會聚的雷射光束；第二透鏡，佈置以接收第一會聚的雷射光束並輸出第二會聚的雷射光束；以及第三透鏡，佈置以接收雷射光束的第二部分作為發散光束，並將準直光束輸出至多光束調製器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mask writing system may include a laser source to generate a laser beam, a multibeam modulator to receive an input laser beam and generate a plurality of modulated laser beams from the input laser beam, a scanner to direct the plurality of modulated laser beams to a mask holder, and a laser beam shaping module, disposed between the laser source and the multibeam modulator. As such, the laser beam shaping module may include a multi-lens system, disposed along a primary beam path. The multi-lens system may include a first lens to receive the laser beam and output a first converging laser beam; a second lens, arranged to receive the first converging laser beam and output a second converging laser beam; and a third lens, arranged to receive the second portion of the laser beam as a diverging beam, and to output a collimated beam to the multibeam modulator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷射處理系統</p>  
        <p type="p">102:雷射源</p>  
        <p type="p">104:光束指向元件</p>  
        <p type="p">106:光束成形模組</p>  
        <p type="p">108:多光束調製器</p>  
        <p type="p">110:聲光偏向器</p>  
        <p type="p">112:衍射光學元件</p>  
        <p type="p">114:聲光調製器</p>  
        <p type="p">116:柵格化器</p>  
        <p type="p">120:指向鏡</p>  
        <p type="p">122:刷子調整模組</p>  
        <p type="p">124:多面體</p>  
        <p type="p">126:透鏡系統</p>  
        <p type="p">128:遮罩支架</p>  
        <p type="p">130:可移動工作台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2091" publication-number="202626216"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626216.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造源自使用後之吸收性物品的回收構件之方法以及源自使用後之吸收性物品的回收構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260330B">B09B3/30</main-classification>  
        <further-classification edition="202201120260330B">B09B3/70</further-classification>  
        <further-classification edition="200601120260330B">C08J11/08</further-classification>  
        <further-classification edition="200601120260330B">B01J20/34</further-classification>  
        <further-classification edition="202201320260330B">B09B101/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商優你　嬌美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNICHARM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小西孝義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONISHI, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下晃吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗田範朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA, NORITOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於製造源自使用後之吸收性物品的回收構件之方法中，提供安全性高且洗淨效果高之方法。製造源自使用後之吸收性物品的回收構件之方法，係具備脫水洗淨步驟(S3)與分離步驟(S5，S7)。脫水洗淨步驟係攪拌混合液，該混合液係將包含源自使用後之吸收性物品的塑膠材料、高吸水性聚合物及紙漿纖維之混合物，與包含不燃性疏水性有機溶劑以及親水性有機溶劑及水中至少一者之處理液混合而成，以使高吸水性聚合物及紙漿纖維脫水。分離步驟係自混合液分離塑膠材料、高吸水性聚合物及紙漿纖維中至少一種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2092" publication-number="202626995"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626995.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鋯溶膠</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C09G1/02</main-classification>  
        <further-classification edition="202001120260317B">C01F17/206</further-classification>  
        <further-classification edition="200601120260317B">C01G25/02</further-classification>  
        <further-classification edition="200601120260317B">C09K3/14</further-classification>  
        <further-classification edition="200601120260317B">C09K3/30</further-classification>  
        <further-classification edition="202601120260317B">H10P52/40</further-classification>  
        <further-classification edition="200601120260317B">C01B33/148</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一稀元素化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI KIGENSO KAGAKU KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝日聖晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI, KIYOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高崎史進</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASAKI, FUMIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌倉宗太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMAKURA, SOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之研磨用分散液及研磨用粉末可用於SiC晶圓等之化學機械研磨(CMP)，且可用於半導體之製造程序等。本發明之氧化鋯溶膠包含於掃描電子顯微鏡圖像中呈現層狀結構之氧化鋯粒子群。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2093" publication-number="202626657"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626657.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為cGAS抑制劑之具有N-連接環狀取代基之吡啶衍生物</chinese-title>  
        <english-title>PYRIDINE DERIVATIVES WITH N-LINKED CYCLIC SUBSTITUENTS AS CGAS INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D491/048</main-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5386</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希曼　安妮卡翠　夏綠蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIMANN, ANNEKATRIN CHARLOTTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢斯屈　珊卓　盧思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANDSCHUH, SANDRA RUTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍恩柯　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOENKE, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格波特　西德克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODBOUT, CEDRICKX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格納姆　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GNAMM, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛洛斯　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROSS, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克雷　喬格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLEY, JOERG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫拉夫　克莉絲汀　安德里亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUTTRUFF, CHRISTIAN ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞納特　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REINERT, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史杜伯　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STUBER, RAPHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛蘭德　馬克　亞力山德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRUNDL, MARC ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰斯　席爾多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THEIS, THEODOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於作為cGAS抑制劑之新的式&lt;b&gt;(I)&lt;/b&gt;&lt;b&gt;之&lt;/b&gt;脯胺酸衍生物， &lt;br/&gt;&lt;img align="absmiddle" height="268px" width="258px" file="ed10428.JPG" alt="ed10428.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;b/&gt;，&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;其中 &lt;br/&gt;其中&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;4&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;5&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;6&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;7&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;8&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;9&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;10&lt;/sup&gt;&lt;/b&gt;&lt;b&gt;、&lt;/b&gt;&lt;b&gt;R&lt;sup&gt;11&lt;/sup&gt;&lt;/b&gt;及&lt;b&gt;G&lt;/b&gt;係如請求項1中所定義， &lt;br/&gt;及該等化合物之前藥或醫藥上可接受之鹽 &lt;br/&gt;其用於治療例如全身性紅斑狼瘡、全身性硬化(SSc)、非酒精性脂肪性肝炎(NASH)、間質性肺病(ILD)及特發性肺纖維化(IPF)等疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to new proline derivatives of formula &lt;b&gt;(I)&lt;/b&gt; as cGAS inhibitors, &lt;br/&gt;&lt;img align="absmiddle" height="283px" width="256px" file="ed10429.JPG" alt="ed10429.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;b/&gt;,&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;wherein &lt;br/&gt;wherein &lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;4&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;5 &lt;/sup&gt;&lt;/b&gt;,&lt;b&gt;&lt;sup/&gt;R&lt;sup&gt;6 &lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;7&lt;/sup&gt;&lt;/b&gt;,&lt;b&gt; R&lt;sup&gt;8 &lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;9&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;10&lt;/sup&gt;, R&lt;sup&gt;11&lt;/sup&gt;&lt;/b&gt;&lt;sup/&gt; and &lt;b&gt;G&lt;/b&gt; are defined as in claim 1, &lt;br/&gt;and prodrugs or pharmaceutically acceptable salts of these compounds &lt;br/&gt;for the treatment of diseases such as systemic lupus erythematosus, systemic sclerosis (SSc), non-alcoholic steatohepatitis (NASH), interstitial lung disease (ILD) and idiopathic pulmonary fibrosis (IPF).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2094" publication-number="202628507"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628507.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝用遮罩以及安裝用遮罩之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H05K3/328</main-classification>  
        <further-classification edition="202601120260317B">H10W80/00</further-classification>  
        <further-classification edition="201201120260317B">G03F1/62</further-classification>  
        <further-classification edition="200601120260317B">C23C18/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奔馬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BON MARK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>篠原忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINOHARA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種可提高柱部之配置自由度之安裝用遮罩。 &lt;br/&gt;[解決方案]安裝用遮罩4係具備薄板形成部10、第一柱部11、及第二柱部12。在薄板形成部10形成有用以供導電性物質通過之開口圖案6。第一柱部11係配置成在將導電性物質安裝於基板5時相對向於表面5a。第二柱部12係具有比第一柱部11之柱高h1更高之柱高h2，且配置成在將導電性物質安裝於基板5時相對向於表面5b。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:安裝用遮罩</p>  
        <p type="p">4b:對向面</p>  
        <p type="p">5b:表面</p>  
        <p type="p">6:開口圖案</p>  
        <p type="p">10:薄板形成部</p>  
        <p type="p">11:第一柱部</p>  
        <p type="p">12:第二柱部</p>  
        <p type="p">21:鍍覆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2095" publication-number="202626385"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626385.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車輛之輪內電機機械</chinese-title>  
        <english-title>IN-WHEEL ELECTRIC MACHINES FOR ELECTRIC VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">B60K7/00</main-classification>  
        <further-classification edition="200601120260317B">H02K3/28</further-classification>  
        <further-classification edition="202501120260317B">H02K15/066</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛沙尼亞商多納實驗開發公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONUT LAB DEVELOPMENT OU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮波　維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIIPPO, VILLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊特麻基　圖莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEHTIMAKI, TUOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MC</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯特　葛瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERTS, GARETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝斯特　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEST, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍爾特　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLT, OLIVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露了電動車輛之輪內電機機械(例如，電動機、發電機等)。實例輪內電機機械包括定子以及轉子。定子包括鐵磁性磁芯、圍繞鐵磁性磁芯圓周排列的複數個齒、以及耦接至複數個齒的複數個側繞線圈。複數個齒的個別一者從鐵磁性磁芯徑向向外方向延伸並藉由複數個槽的個別一者而彼此間隔。複數個側繞線圈的個別一者係徑向裝載在複數個齒的個別一者上。轉子係相對於該定子位於外部並係組態以相對於該定子旋轉。轉子包括以霍爾巴赫陣列排列的複數個永久磁鐵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In-wheel electric machines (e.g., electric motors, electric generators, etc.) for electric vehicles are disclosed. An example in-wheel electric machine includes a stator and a rotor. The stator includes a ferromagnetic core, a plurality of teeth circumferentially arranged about the ferromagnetic core, and a plurality of edgewise coils coupled to the plurality of teeth. Respective ones of the plurality of teeth extend in a radially outward direction from the ferromagnetic core and are spaced apart from one another by respective ones of a plurality of slots. Respective ones of the plurality of edgewise coils are radially loaded onto the respective ones of the plurality of teeth. The rotor is located externally relative to the stator and is configured to rotate relative to the stator. The rotor includes a plurality of permanent magnets arranged in a Halbach array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:定子</p>  
        <p type="p">502:鐵磁性磁芯</p>  
        <p type="p">504:齒</p>  
        <p type="p">506:槽</p>  
        <p type="p">602:平行壁</p>  
        <p type="p">700:側繞線圈</p>  
        <p type="p">706:扭矩產生區域</p>  
        <p type="p">800:徑向方向</p>  
        <p type="p">802:槽襯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2096" publication-number="202626384"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626384.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種具備路面適應性懸架的運輸車</chinese-title>  
        <english-title>TRANSPORT VEHICLE WITH ROAD-ADAPTIVE SUSPENSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">B60G7/00</main-classification>  
        <further-classification edition="200601120260320B">B60G3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＩＮＧ機器人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ING ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文明日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, MYUNG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具備路面適應性懸架的運輸車，其通過使用結構簡單的懸架實現行駛穩定性；能夠始終保持所有車輪以恆定的載荷與地面接觸，進一步提高形式穩定性；通過消除制動時前傾的現象，從而在運輸食品時也能防止溢出。&lt;br/&gt; 在本發明的運輸車，包括：第一樞軸，位於第一腳輪和驅動輪之間，以左右方向為軸線固定安裝於車體框架；第一連接臂，一端與第一樞軸可旋轉地連接，另一端安裝有第一腳輪；第二連接臂，可旋轉地安裝於驅動輪的旋轉中心軸，一端可旋轉地與第一樞軸連接；第二樞軸，位於第二腳輪和驅動輪之間，以左右方向為軸線固定安裝於車體框架；第三連接臂，可旋轉地安裝於第二樞軸，一端安裝有第二腳輪；及第四連接臂，可旋轉地連接第二連接臂和第三連接臂的另一端，以使第二連接臂和第三連接臂沿相互相反旋轉方向聯動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:車體框架</p>  
        <p type="p">12:第一腳輪</p>  
        <p type="p">13:第二腳輪</p>  
        <p type="p">14:驅動輪</p>  
        <p type="p">14a:旋轉中心軸</p>  
        <p type="p">21:第一樞軸</p>  
        <p type="p">22:第二樞軸</p>  
        <p type="p">31:第一連接臂</p>  
        <p type="p">32:第二連接臂</p>  
        <p type="p">33:第三連接臂</p>  
        <p type="p">34:第四連接臂</p>  
        <p type="p">41:第一彈性部件</p>  
        <p type="p">42:第二彈性部件</p>  
        <p type="p">43:第三彈性部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2097" publication-number="202626510"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626510.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139726</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於減少氧化物膜上之表面金屬之多層塗層</chinese-title>  
        <english-title>MULTILAYER COATINGS FOR REDUCED SURFACE METALS ON OXIDE FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260319B">C01F7/304</main-classification>  
        <further-classification edition="200601120260319B">C23C14/10</further-classification>  
        <further-classification edition="200601120260319B">C23C16/40</further-classification>  
        <further-classification edition="200601120260319B">B32B9/04</further-classification>  
        <further-classification edition="201801120260319B">G01N23/2258</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>理查茲　蓋文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHARDS, GAVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢迪克斯　布萊恩　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDRIX, BRYAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示包括用於減少表面金屬之多層塗層之組件及製造多層塗層之相關方法。一種塗層包括氧化物層及氧化鋁層。該氧化鋁層不同於該氧化物層。該氧化物層位於一組件與該氧化鋁層之間。當使用二次離子質譜法(SIMS)來量測時，與沒有該氧化物層之一對照塗層相比，該氧化物層及該氧化鋁層使該氧化鋁層中一雜質之濃度降低至少10%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Components comprising multilayer coatings for reducing surface metals and related methods of producing multilayer coatings are disclosed. A coating comprises an oxide layer and an aluminum oxide layer. The aluminum oxide layer is different than the oxide layer. The oxide layer is located between a component and the aluminum oxide layer. When measured using Secondary Ion Mass Spectrometry (SIMS), the oxide layer and the aluminum oxide layer reduce a concentration of an impurity in the aluminum oxide layer by at least 10% compared to a control coating without the oxide layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:塗層</p>  
        <p type="p">102:氧化物層</p>  
        <p type="p">104:氧化鋁層</p>  
        <p type="p">106:組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2098" publication-number="202627059"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627059.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件清洗液及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR ELEMENT CLEANING SOLUTION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C11D7/04</main-classification>  
        <further-classification edition="200601120260318B">C11D7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商東友精細化工有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGWOO FINE-CHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白成顥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, SUNG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓盛弼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNG-PIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹京花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KYUNG-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹伯鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, BAEK-HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任承赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, SEUNG-HYEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及半導體元件清洗液及其製造方法。該半導體元件清洗液的特徵在於，包含10ppb以下的酚類化合物，並且基於鐳射誘導擊穿檢測方法，單位脈衝鐳射照射次數的電漿產生次數的比率低於2%。該半導體元件清洗液是能夠通過有效控制半導體元件清洗液的製程中不可避免地產生的酚類化合物從而抑制半導體元件清洗中在清洗物件表面產生殘留物的高純度的半導體元件清洗液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2099" publication-number="202628315"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628315.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置中之電纜故障保護及電池快速啟動</chinese-title>  
        <english-title>CABLE FAILURE PROTECTION AND BATTERY KICKSTART IN AN ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H02J7/60</main-classification>  
        <further-classification edition="202601120260326B">H02J7/40</further-classification>  
        <further-classification edition="201101120260326B">H01R24/60</further-classification>  
        <further-classification edition="200601120260326B">H02H7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科沃美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QORVO US, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊圖龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TULONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁　文廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DINH, VAN LIEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕里西　卡門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARISI, CARMEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供電子裝置中之電纜故障保護及電池快速啟動。當電子裝置經由通用串列匯流排C型(USB-C)電纜附接至外部電源供應器時，重要的是保護電子裝置免因電纜故障而損壞。當電子裝置中之電池完全耗盡時，有必要在附接至通用串列匯流排C型電纜時快速啟動已耗盡電池之再充電。在本文中，功率管理積體電路(PMIC)設置在電子裝置中，並且根據USB-C標準組態以保護電子裝置免受電纜故障之影響，且快速啟動已耗盡電池之再充電。藉由將電纜故障保護及電池快速啟動功能整合至該PMIC中，有可能降低PMIC之成本及佔用空間，從而使得PMIC適合於小型化電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Cable failure protection and battery kickstart in an electronic device is provided. When the electronic device is attached to an external power supply via a universal serial bus type-C (USB-C) cable, it is important to protect the electronic device from being damaged by a cable failure (e.g., overcurrent, overtemperature, and/or faulty cable). Additionally, when a battery in the electronic device is fully depleted, it is necessary to kickstart recharging of the depleted battery upon attaching to the USB-C cable. Herein, a power management integrated circuit (PMIC) is provided in the electronic device and configured in accordance with the USB-C standard to protect the electronic device from the cable failure and kickstart recharging of the depleted battery. By integrating cable failure protection and battery kickstart functionalities into the PMIC, it is possible to reduce cost and footprint of the PMIC, thus making the PMIC suitable for small formfactor electronic devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2100" publication-number="202627534"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627534.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體、其製造方法、及抗反射膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260330B">G02B1/113</main-classification>  
        <further-classification edition="201901120260330B">B32B7/023</further-classification>  
        <further-classification edition="200601120260330B">C23C14/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雄二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, YUJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島一裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻田拓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉本皓輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMOTO, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長命翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOMEI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之積層體1朝向厚度方向一側依序具備基材2、保護層3、及氧化鈦膜4。氧化鈦膜4包含於利用穿透式電子顯微鏡觀察到之電子束繞射像中出現Ti&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;之繞射斑點群之結晶，且入射波長550 nm之光時之折射率超過2.50且為2.80以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:積層體</p>  
        <p type="p">2:基材</p>  
        <p type="p">3:保護層</p>  
        <p type="p">4:氧化鈦膜</p>  
        <p type="p">21:透明樹脂膜</p>  
        <p type="p">22:硬化樹脂層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2101" publication-number="202628688"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628688.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造絕緣體上矽基板的方法</chinese-title>  
        <english-title>METHOD OF FABRICATING A SILICON ON INSULATOR SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10D86/01</main-classification>  
        <further-classification edition="202601120260302B">H10P14/24</further-classification>  
        <further-classification edition="202601120260302B">H10P14/60</further-classification>  
        <further-classification edition="202601120260302B">H10P95/90</further-classification>  
        <further-classification edition="202601120260302B">H10P72/76</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="200601120260302B">C23C16/50</further-classification>  
        <further-classification edition="200601120260302B">B08B3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹海瑀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HAE WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李知慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI HYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一種製造SOI基板的方法，在犧牲晶圓上依次形成停止層、半導體層、絕緣埋層和第一接合絕緣層。在參考晶圓上形成第二接合絕緣層。第一接合絕緣層和第二接合絕緣層包括碳氮化矽(SiCN)材料。通過O&lt;sub&gt;2&lt;/sub&gt;電漿處理在第一接合絕緣層和第二接合絕緣層中形成Si-OH鍵。將犧牲晶圓接合至參考晶圓，使得第一接合絕緣層接觸第二接合絕緣層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to a method of fabricating an SOI substrate, a stopper layer, a semiconductor layer, a buried insulating layer and a first bonding insulation layer are sequentially formed on a sacrificial wafer. A second bonding insulation layer is formed on a reference wafer. The first and second bonding insulation layers include a Silicon Carbon Nitride (SiCN) material. Si-OH bonds are formed in the first bonding insulation layer and the second bonding insulation layer by an O2 plasma treatment. The sacrificial wafer is bonded to the reference wafer so that the first bonding insulation layer contacts the second bonding insulation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:步驟</p>  
        <p type="p">S20:步驟</p>  
        <p type="p">S30:步驟</p>  
        <p type="p">S40:步驟</p>  
        <p type="p">S50:步驟</p>  
        <p type="p">S60:步驟</p>  
        <p type="p">S70:步驟</p>  
        <p type="p">S80:步驟</p>  
        <p type="p">S90:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2102" publication-number="202626841"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626841.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性樹脂及其製造方法、硬化性樹脂組成物及其硬化物</chinese-title>  
        <english-title>CURABLE RESIN AND MANUFACTURING METHOD THEREOF, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G61/02</main-classification>  
        <further-classification edition="200601120260401B">C08L65/00</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本化藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠島隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHJIMA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関允諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川篤彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, ATSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供具有優異的低介電特性之硬化性樹脂及其製造方法、硬化性樹脂組成物及其硬化物。 &lt;br/&gt;本發明之硬化性樹脂，係下述式(1)所示。 &lt;br/&gt;&lt;img align="absmiddle" height="71px" width="377px" file="ed10054.JPG" alt="ed10054.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(1)中，R&lt;sub&gt;1&lt;/sub&gt;分別獨立地表示碳數1至5之飽和烴基。X分別獨立地為下述式(a0)所示的構造。m係0至4之整數。n係0至3之整數，n之平均值n&lt;sub&gt;ave&lt;/sub&gt;為0.1≦n&lt;sub&gt;ave&lt;/sub&gt;≦3。 &lt;br/&gt;&lt;img align="absmiddle" height="66px" width="358px" file="ed10055.JPG" alt="ed10055.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(a0)中，＊表示對式(1)之茚構造的5員環之鍵結位置。R&lt;sub&gt;2&lt;/sub&gt;分別獨立地表示碳數1至5之飽和烴基。q表示0至3之整數。q為0時，p係0至5之整數；q為1時，p係0至7之整數；q為2時，p係0至9；q為3時，p係0至11。j係0或1之整數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a curable resin with excellent low dielectric properties, a manufacturing method thereof, a curable resin composition, and a cured product thereof. &lt;br/&gt;A curable resin according to the present invention is represented by the following formula (1): &lt;br/&gt;&lt;img align="absmiddle" height="90px" width="342px" file="ed10056.JPG" alt="ed10056.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. &lt;br/&gt;In formula (1), each R&lt;sub&gt;1&lt;/sub&gt; independently represents a saturated hydrocarbon group having 1 to 5 carbon atoms. Each X independently represents a structure of the following formula (a0). m is an integer from 0 to 4. n is an integer from 0 to 3, and the average value of n, n&lt;sub&gt;ave&lt;/sub&gt;, is 0.01≦n&lt;sub&gt;ave&lt;/sub&gt;≦3. &lt;br/&gt;&lt;img align="absmiddle" height="175px" width="367px" file="ed10057.JPG" alt="ed10057.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;In formula (a0), * represents the bonding position to the five-membered ring of the indene structure in formula (1). Each R&lt;sub&gt;2&lt;/sub&gt; independently represents a saturated hydrocarbon group having 1 to 5 carbon atoms. q is an integer from 0 to 3. When q is o, p is an integer from 0 to 5; when q is 1, p is an integer from 0 to 7; when q is 2, p is an integer from 0 to 9; and when q is 3, p is an integer from 0 to 11. J is an integer of 0 or 1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2103" publication-number="202627611"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627611.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透視顯示器和鏡片</chinese-title>  
        <english-title>SEE-THROUGH DISPLAY AND LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G02B27/01</main-classification>  
        <further-classification edition="200601120260324B">G02B27/28</further-classification>  
        <further-classification edition="200601120260324B">G02B17/06</further-classification>  
        <further-classification edition="200601120260324B">G02F1/01</further-classification>  
        <further-classification edition="200601120260324B">G02F1/1343</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>源奇科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIQXTAL TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳松楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SUNG-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透視顯示器，包含有一骨架；一控制器，設置於該骨架上，用來傳送一控制訊號；以及一鏡片，設置於該骨架，包含有一偏振元件，用來限制一環境光的一偏振態；一部份反射鏡元件，用來反射和傳送該環境光，包含有一基底層；以及一鍍膜層；一偏振轉換器，設置於該偏振元件和該部份反射鏡元件之間，用來根據該控制訊號轉換穿過該偏振元件的該環境光的該偏振態；以及一電極，設置於該偏振轉換器和該基底層之間，用來接收該控制訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A see-through display, includes a frame; a controller, disposed on the frame, configured to transmit a control signal; and a lens, disposed on the frame, including a polarization component, configured to confine a polarization state of an ambient light; a partially reflecting mirror component, configured to reflect and transmit the ambient light, including a substrate; and a coating layer; a polarization converter, disposed between the polarization component and the partially reflecting mirror component, configured to convert the polarization state of the ambient light passing through the polarization component according to the control signal; and an electrode, disposed between the polarization converter and the substrate, configured to receive the control signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2063:部份反射鏡元件</p>  
        <p type="p">2064:鍍膜層</p>  
        <p type="p">SUB:基底層</p>  
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;、R&lt;sub&gt;A1&lt;/sub&gt;、R&lt;sub&gt;2&lt;/sub&gt;、R&lt;sub&gt;A2&lt;/sub&gt;:反射率</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2104" publication-number="202626745"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626745.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於設定衝擊共聚物聚丙烯生產之方法及系統以及用於生產衝擊共聚物聚丙烯之方法及系統</chinese-title>  
        <english-title>PROCESS AND SYSTEM FOR SETTING UP IMPACT COPOLYMER POLYPROPYLENE PRODUCTION AND PROCESS AND SYSTEM FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/01</main-classification>  
        <further-classification edition="200601120260401B">C08F2/34</further-classification>  
        <further-classification edition="200601120260401B">C08F210/06</further-classification>  
        <further-classification edition="200601120260401B">C08F210/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商魯瑪斯諾弗蘭科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMMUS NOVOLEN TECHNOLOGY GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班格斯　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANGERTH, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福洛里希　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FROELICH, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯爾　奧利佛　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUHL, OLIVER MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所揭露之實施態樣係關於一種在一丙烯原料中所含有之丙烷用於在至少兩個聚合區中設定衝擊共聚物聚丙烯生產之用途，其包含將該丙烷累積在一第一聚合區(2,5)中，在該第一聚合區(2,5)與一第二聚合區(7,10)之一並聯操作模式生產各自的丙烯聚合物期間。本文所揭露之實施態樣亦係關於一種用於設定衝擊共聚物聚丙烯生產之方法及系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein relate to a use of propane contained in a propylene feedstock for setting up impact copolymer polypropylene production in at least two polymerization zones comprising accumulating the propane in a first polymerization zone (2, 5) during a parallel operation mode of the first polymerization zone (2, 5) and a second polymerization zone (7, 10) producing respective propylene polymers. Embodiments disclosed herein also relate to a process and a system for setting up impact copolymer polypropylenes production.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:生產系統，系統</p>  
        <p type="p">1a:第一丙烯流</p>  
        <p type="p">1b:第一烯烴流，第一丙烯流</p>  
        <p type="p">2:第一聚合區，第一反應器，反應器，氣相反應器</p>  
        <p type="p">3a:第一產物</p>  
        <p type="p">3b:聚合物產物，第三產物</p>  
        <p type="p">4:第一反應器循環流，第一反應器循環管線，第一循環流</p>  
        <p type="p">5:第一循環氣體冷卻迴路，第一聚合區，第一循環氣體迴路，第一循環流體冷卻迴路</p>  
        <p type="p">6a:第二丙烯流</p>  
        <p type="p">6b:第二烯烴流，第二丙烯流</p>  
        <p type="p">7:第二聚合區，第二反應器，反應器，氣相反應器</p>  
        <p type="p">8a:第二產物</p>  
        <p type="p">8b:第四產物</p>  
        <p type="p">9:第二反應器循環流，第二反應器循環管線，第二循環流</p>  
        <p type="p">10:第二循環氣體冷卻迴路，第二聚合區，第二循環氣體迴路，第二循環流體冷卻迴路</p>  
        <p type="p">11:第二經冷卻循環氣體蒸氣</p>  
        <p type="p">12:液化氣體流，管線</p>  
        <p type="p">13:第一主要冷凝器</p>  
        <p type="p">14:第二主要冷凝器</p>  
        <p type="p">15:第一經冷卻循環氣體蒸氣</p>  
        <p type="p">16:次要冷凝器</p>  
        <p type="p">17:第二吹掃管線</p>  
        <p type="p">18:第三吹掃管線，吹掃管線</p>  
        <p type="p">19:第四吹掃管線</p>  
        <p type="p">20:輸送系統</p>  
        <p type="p">21:第一循環壓縮機</p>  
        <p type="p">22:第二循環壓縮機</p>  
        <p type="p">23:第一吹掃管線</p>  
        <p type="p">24:第二液化循環氣體</p>  
        <p type="p">25:第一液化循環氣體</p>  
        <p type="p">26:循環管線，載體流體循環流，載體氣體流，管線</p>  
        <p type="p">26’:管線，分支循環管線</p>  
        <p type="p">27:未反應單體，管線</p>  
        <p type="p">29:輸送管線</p>  
        <p type="p">30:第二壓縮機</p>  
        <p type="p">31:吹掃及載體氣體系統，載體及吹掃氣體回收單元</p>  
        <p type="p">32:惰性氣體</p>  
        <p type="p">33:脫氣容器</p>  
        <p type="p">34:固相</p>  
        <p type="p">35:吹掃容器</p>  
        <p type="p">36:烴回收單元</p>  
        <p type="p">37:經回收載體氣體流</p>  
        <p type="p">38:惰性氣體流</p>  
        <p type="p">39:吹掃管線</p>  
        <p type="p">40:污染物</p>  
        <p type="p">41:聚合物產物，管線</p>  
        <p type="p">42,44,45,48,49:管線</p>  
        <p type="p">43:第一壓縮機</p>  
        <p type="p">46:丙烷儲存器</p>  
        <p type="p">47:最終聚合物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2105" publication-number="202628762"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628762.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139808</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10K59/123</main-classification>  
        <further-classification edition="202301120251103B">H10K59/35</further-classification>  
        <further-classification edition="201601120251103B">G09G3/3233</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高永賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YOUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰滿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAEMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔聖主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SUNGJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳智煕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, JIHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了一種顯示裝置包含多個子像素；沿第一方向延伸並位於顯示裝置平面視角中的多個子像素中至少一第一對子像素之間的感測控制線；沿與第一方向交叉的第二方向延伸並位於多個子像素中至少一第二對子像素之間的參考線；以及多個包含於多個子像素且連接至感測控制線及參考線的感測薄膜電晶體，其中多個感測薄膜電晶體在平面視角下重疊感測控制線及參考線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display device comprising a plurality of subpixels, a sensing control line extending in a first direction between at least a first pair of subpixels among the plurality of subpixels in a plan view of the display device, a reference line extending in a second direction crossing the first direction between at least a second pair of subpixels among the plurality of subpixels in the plan view, and a plurality of sensing thin film transistors in the plurality of subpixels and connected to the sensing control line and the reference line, wherein the plurality of sensing thin film transistors overlap the sensing control line and the reference line in the plan view.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C:電容</p>  
        <p type="p">DL1,DL2:資料線</p>  
        <p type="p">GL1:第一閘極線</p>  
        <p type="p">GL2:第二閘極線</p>  
        <p type="p">OLED:有機發光元件</p>  
        <p type="p">RL:參考線</p>  
        <p type="p">SP1:第一子像素</p>  
        <p type="p">SP2:第二子像素</p>  
        <p type="p">SP3:第三子像素</p>  
        <p type="p">SP4:第四子像素</p>  
        <p type="p">SCL:感測控制線</p>  
        <p type="p">T1:切換薄膜電晶體</p>  
        <p type="p">T2:驅動薄膜電晶體</p>  
        <p type="p">T3:感測薄膜電晶體</p>  
        <p type="p">VDDL1,VDDL2:高電力線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2106" publication-number="202627053"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627053.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在沸石催化劑上經由輕質烯烴寡聚化生產生物或化石燃料之方法及用於生產其之系統</chinese-title>  
        <english-title>METHOD FOR PRODUCING BIO OR FOSSIL FUELS THROUGH LIGHT OLEFINS OLIGOMERIZATION OVER ZEOLITE CATALYSTS AND A SYSTEM FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C10G50/00</main-classification>  
        <further-classification edition="200601120260324B">C10G7/00</further-classification>  
        <further-classification edition="200601120260324B">C10G67/00</further-classification>  
        <further-classification edition="200601120260324B">B01J29/04</further-classification>  
        <further-classification edition="200601120260324B">B01J8/04</further-classification>  
        <further-classification edition="200601120260324B">B01J19/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商魯瑪斯科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　宇彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU,YUBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡布拉萊斯　弗雷迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CABRALES, FREDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥地那玻利瓦　潔克琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDINA BOLIVAR, JACKELINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏爾里希　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULRICH, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索姆　馬諾傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOM, MANOJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　志亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG,ZHILIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於生產生物或化石燃料之方法及系統。該方法包括：將混合烴進料至含有一沸石催化劑之一固定床反應器系統；操作該固定床反應器系統以進行一或多個C3-C8烴類的寡聚化以形成一寡聚化流出物；在一氣體/液體分離單元中將該寡聚化流出物分離成一C3餾分、一氣體流及一液體流；將該液體流的至少一第一部分進料至一蒸餾單元；將該液體流的至少一第二部分循環至該固定床反應器系統；在該蒸餾單元中將該液體流的該第一部分分離成一輕質餾分及一重質餾分；以及將該輕質餾分循環至該固定床反應器系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process and system for producing bio or fossil fuels is provided. The process includes: feeding mixed hydrocarbon to a fixed-bed reactor system containing a zeolite catalyst; operating the fixed-bed reactor system for oligomerization of one or more C3-C8 hydrocarbons to form an oligomerized effluent; separating the oligomerized effluent into a C3- fraction, a gas stream, and a liquid stream in a gas/liquid separation unit; feeding at least a first portion of the liquid stream to a distillation unit; recycling at least a second portion of the liquid stream to the fixed-bed reactor system; separating the first portion of the liquid stream in the distillation unit into, a light fraction and a heavy fraction; and recycling the light fraction to the fixed-bed reactor system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:混合烴進料</p>  
        <p type="p">1A:固定床反應器</p>  
        <p type="p">2:固定床反應器系統</p>  
        <p type="p">3:寡聚化流出物</p>  
        <p type="p">4:氣體/液體分離單元，分離單元</p>  
        <p type="p">5A:氣體流</p>  
        <p type="p">5B:液體流</p>  
        <p type="p">6:循環流</p>  
        <p type="p">7:蒸餾單元</p>  
        <p type="p">8:較重質餾分</p>  
        <p type="p">9:輕質餾分</p>  
        <p type="p">10:重質餾分</p>  
        <p type="p">11:氣體</p>  
        <p type="p">12:氫化單元</p>  
        <p type="p">13,14:重質支鏈石蠟烴</p>  
        <p type="p">15:分餾系統</p>  
        <p type="p">16:輕質氫化餾分</p>  
        <p type="p">17:噴氣/柴油餾分</p>  
        <p type="p">18:重質氫化餾分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2107" publication-number="202625879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>植物栽培設備</chinese-title>  
        <english-title>PLANT CULTIVATION FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A01G9/20</main-classification>  
        <further-classification edition="200601120260330B">A01G9/24</further-classification>  
        <further-classification edition="200601120260330B">A01G7/04</further-classification>  
        <further-classification edition="200601120260330B">A01G31/02</further-classification>  
        <further-classification edition="200601120260330B">A01G31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>名倉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北伸幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITA, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">植物栽培設備係例如具備：無端狀之繞行構件，其在具有第一區間、第二區間及二個第三區間之大致長圓狀之路徑上繞行移動，其中該第一區間係往橫向移動，該第二區間係相對於該第一區間位於上方而隔離，並在該第一區間重疊之位置，往與該第一區間相反之方向移動，該二個第三區間係在第一區間與第二區間之間一邊呈外凸狀地彎曲一邊移動；複數個移動架，其分別支持植物之栽培容器或具有該栽培容器，且在繞行構件之長度方向的預定間隔經由連接部安裝於繞行構件，一邊將栽培容器維持為大致固定之姿勢一邊伴隨著該繞行構件之繞行而移動；第一照明裝置，其在連接部及移動架沿著第一區間移動之期間，對於被該移動架所保持之植物照射栽培光；及第二照明裝置，其在連接部及移動架沿著第二區間移動之期間，對於被該移動架所保持之植物照射栽培光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plant cultivation facility includes, for example, an endless circulating member configured to circulate along a substantially oblong path having a first section, a second section, and two third sections, wherein the first section moves in a lateral direction, the second section is positioned above and spaced apart from the first section and moves in a direction opposite to that of the first section at a position overlapping the first section, and the two third sections are configured to move while curving outwardly between the first section and the second section; a plurality of movable racks, each supporting a plant cultivation container or provided with the cultivation container, and mounted to the circulating member via connecting portions at predetermined intervals in a longitudinal direction of the circulating member, the movable racks being configured to move together with circulation of the circulating member while maintaining the cultivation containers in a substantially fixed posture; a first lighting device configured to irradiate cultivation light onto plants held by the movable racks while the connecting portions and the movable racks move along the first section; and a second lighting device configured to irradiate cultivation light onto plants held by the movable racks while the connecting portions and the movable racks move along the second section.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鏈條(繞行構件)</p>  
        <p type="p">20:軌道</p>  
        <p type="p">30:連接部</p>  
        <p type="p">40:移動架(栽培容器)</p>  
        <p type="p">50:照明裝置</p>  
        <p type="p">50a:支持構件</p>  
        <p type="p">50b:LED單元</p>  
        <p type="p">51:照明裝置(第一照明裝置)</p>  
        <p type="p">52:照明裝置(第二照明裝置)</p>  
        <p type="p">63:槽道</p>  
        <p type="p">64,64A:給液管(給液機構)</p>  
        <p type="p">65A:排液回收管</p>  
        <p type="p">100:植物栽培設備</p>  
        <p type="p">D1:第一區間</p>  
        <p type="p">D2:第二區間</p>  
        <p type="p">D31,D32:第三區間</p>  
        <p type="p">D4,D41,D42:第四區間</p>  
        <p type="p">Pm1,Pm2:位置</p>  
        <p type="p">Pt:移動路徑</p>  
        <p type="p">W:作業者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2108" publication-number="202626674"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626674.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二烷基氨基烷基鋰引發劑之溶液及其用途、製備方法及合成彈性體及液態橡膠的製備方法</chinese-title>  
        <english-title>DIALKYLAMINOALKYL LITHIUM INITIATOR SOLUTIONS AND USE THEREOF, PROCESS FOR PREPARATION THEREOF AND PROCESS FOR PREPARATION OF SYNTHETIC ELASTOMERS AND LIQUID RUBBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F1/02</main-classification>  
        <further-classification edition="200601120260401B">C08F4/48</further-classification>  
        <further-classification edition="200601120260401B">C08F12/08</further-classification>  
        <further-classification edition="200601120260401B">C08F36/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商亞比馬利德國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBEMARLE GERMANY GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑里米斯　諾亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEREMIAS, NOAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里特邁爾　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RITTMEYER, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休伯納　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBNER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維特爾曼　烏瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIETELMANN, ULRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅　瑪麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAI, MARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克洛森納　約翰尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLOSENER, JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案係關於濃縮的二烷基氨基烷基鋰引發劑溶液，適合用作含烯烴單體的陰離子聚合引發劑，其中引發劑濃度在室溫下至少為0.3莫耳/公升。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to concentrated dialkylaminoalkyllithium initiator solutions which are suitable for use as anionic polymerization initiators for olefin-containing monomers and in which the initiator concentration is at least 0.3 mol/L at room temperature.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2109" publication-number="202627216"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627216.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水電解裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260401B">C25B9/17</main-classification>  
        <further-classification edition="202101120260401B">C25B9/19</further-classification>  
        <further-classification edition="202101120260401B">C25B1/04</further-classification>  
        <further-classification edition="200601120260401B">B01D19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科納維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADEVIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八巻昌宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村忠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的水電解裝置包括將由氫氣液分離器分離出的氫吹除水中所含的氫除去的脫氣筒。脫氣筒具有供氫吹除水流入的入口、以及設置於較該入口低的鉛垂方向上的高度位置的出口，藉由自入口流入的氫吹除水在脫氣筒的內部形成回旋流而使氫吹除水中所含的氫氣泡化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:氫氣液分離器</p>  
        <p type="p">13:氧氣液分離器</p>  
        <p type="p">19:吹除水管線</p>  
        <p type="p">19A:氫排氣管線</p>  
        <p type="p">19B:除去水管線</p>  
        <p type="p">20:電動閥(流量調整機構)</p>  
        <p type="p">21:平筒管(氣液分離機構)</p>  
        <p type="p">22:止回閥(逆流防止機構)</p>  
        <p type="p">30:脫氣筒</p>  
        <p type="p">30A:上端(上端部)</p>  
        <p type="p">31:主體</p>  
        <p type="p">31A:入口</p>  
        <p type="p">31B:出口</p>  
        <p type="p">32:脫氣箱</p>  
        <p type="p">33:連結部</p>  
        <p type="p">41:供給側配管</p>  
        <p type="p">42:排出側配管</p>  
        <p type="p">42A:立起部</p>  
        <p type="p">100:水電解裝置</p>  
        <p type="p">311:入口管</p>  
        <p type="p">312:出口管</p>  
        <p type="p">321:箱體</p>  
        <p type="p">322:浮子</p>  
        <p type="p">323:閥座</p>  
        <p type="p">324:排出口</p>  
        <p type="p">B:氫氣泡</p>  
        <p type="p">G:氣相部</p>  
        <p type="p">T:回旋流(渦流)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2110" publication-number="202627264"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627264.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐油紙</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">D21H17/28</main-classification>  
        <further-classification edition="200601120260318B">D21H17/34</further-classification>  
        <further-classification edition="200601120260318B">D21H19/54</further-classification>  
        <further-classification edition="200601120260318B">D21H21/14</further-classification>  
        <further-classification edition="200601120260318B">D21H21/16</further-classification>  
        <further-classification edition="200601120260318B">D21H27/00</further-classification>  
        <further-classification edition="200601120260318B">B65D65/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商王子控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OJI HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部一行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種耐油紙，係包含含有紙漿之紙基材、及附著於前述紙基材之疏水化澱粉，前述疏水化澱粉的直鏈澱粉含量為未達18質量%，相對於紙基材的總質量，前述疏水化澱粉所含之直鏈澱粉的量為0.5質量%至5.0質量%，王研式透氣度為未達20000秒鐘。前述疏水化澱粉可為酯化澱粉。前述酯化澱粉可為辛烯基丁二酸澱粉。前述紙漿中之10質量%以上可為針葉樹紙漿。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2111" publication-number="202627262"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627262.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐油紙</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">D21H11/00</main-classification>  
        <further-classification edition="200601120260401B">D21H19/14</further-classification>  
        <further-classification edition="200601120260401B">D21H19/18</further-classification>  
        <further-classification edition="200601120260401B">D21H21/14</further-classification>  
        <further-classification edition="200601120260401B">D21H27/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商王子控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OJI HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部一行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種耐油紙，係於含有紙漿之紙基材塗覆有塗料，前述紙漿含有闊葉樹紙漿，前述塗料含有油脂，前述紙基材的基重為10.0g/m&lt;sup&gt;2&lt;/sup&gt;至50.0g/m&lt;sup&gt;2&lt;/sup&gt;，相對於前述紙基材，前述塗料的塗覆量以固形成分換算計為1質量%至20質量%，且相對於前述塗料的固形成分，油脂的含量為60質量%以上。前述紙基材可含有濕潤紙力增強劑及上漿劑雙方。前述塗料可含有增黏劑及保水劑中之任一方或雙方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2112" publication-number="202626779"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626779.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醯胺類化合物、包含其的用於形成抗蝕劑底層膜的組合物及抗蝕劑底層膜</chinese-title>  
        <english-title>AMIDES COMPOUNDS, COMPOSITION FOR FORMING RESIST UNDERLAYER FILM COMPRISING THE SAME AND RESIST UNDERLAYER FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F8/32</main-classification>  
        <further-classification edition="200601120260401B">C08F22/06</further-classification>  
        <further-classification edition="200601120260401B">C08F22/38</further-classification>  
        <further-classification edition="200601120260401B">G03F7/11</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商東進世美肯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGJIN SEMICHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周東奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, DONG KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史錫允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SA, SEOK YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李周映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JU YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金株源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JU WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張奎賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, GYU HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韓松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HAN SOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金昇振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金台益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE IK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNG YOUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炫辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUN JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及能夠形成即使在少的曝光能量下也能實現質量優秀的圖案的抗蝕劑底層膜的醯胺類化合物、包含其的用於形成抗蝕劑底層膜的組合物及抗蝕劑底層膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2113" publication-number="202626239"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626239.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B23K26/18</main-classification>  
        <further-classification edition="201401120260331B">B23K26/00</further-classification>  
        <further-classification edition="200601120260331B">C03C23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諏訪出</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUWA, IZURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林悠波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YUHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>礒部衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOBE, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明兼顧抑制斷裂與抑制標記之視認性降低。玻璃基板(10)具有主面(10A)及主面(10B)，且於主面(10A)形成有標記，於將主面(10A)與端面(10C)之交界位置設為第1位置(PA)，將自第1位置(PA)向徑向內側離開1 mm之主面(10A)上之位置設為第2位置(PB)之情形時，第2位置(PB)位於較第1位置(PA)更靠Z1方向側，第1位置(PA)與第2位置(PB)於Z方向上之距離為0.102 μm以上2.01 μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:玻璃基板</p>  
        <p type="p">10A:主面</p>  
        <p type="p">10B:主面(第2主面)</p>  
        <p type="p">10C:端面</p>  
        <p type="p">100:標記</p>  
        <p type="p">AR:區域</p>  
        <p type="p">AR1:位置</p>  
        <p type="p">AR2:位置</p>  
        <p type="p">D0:直徑</p>  
        <p type="p">L1:距離</p>  
        <p type="p">L2:距離</p>  
        <p type="p">N:切口部</p>  
        <p type="p">P0:中心</p>  
        <p type="p">PA:第1位置</p>  
        <p type="p">PB:第2位置</p>  
        <p type="p">PL:平面</p>  
        <p type="p">Z:方向</p>  
        <p type="p">Z1:方向</p>  
        <p type="p">Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2114" publication-number="202626013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴霧型化妝品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/86</main-classification>  
        <further-classification edition="200601120260401B">A61K8/49</further-classification>  
        <further-classification edition="200601120260401B">A61K8/37</further-classification>  
        <further-classification edition="200601120260401B">A61K8/03</further-classification>  
        <further-classification edition="200601120260401B">A61K8/34</further-classification>  
        <further-classification edition="200601120260401B">A61Q17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商高絲股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下田俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMODA, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種紫外線防護效果、使用中的均勻噴出及不黏膩性優異的噴霧型化妝品。&lt;br/&gt; 具體而言，提供一種噴霧型化妝品，其係噴霧成霧狀而使用，含有以下的成分(A)～(F)：&lt;br/&gt; (A)HLB12以上的非離子性界面活性劑0.005～0.25質量%&lt;br/&gt; (B)水溶性紫外線吸收劑&lt;br/&gt; (C)水&lt;br/&gt; (D)一元低級醇&lt;br/&gt; (E)油溶性紫外線吸收劑&lt;br/&gt; (F)液狀油，且&lt;br/&gt; 前述成分(C)及成分(D)的合計量在化妝品總量中為40質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2115" publication-number="202628818"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628818.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱介質供給裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P50/00</main-classification>  
        <further-classification edition="202601120260302B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青山淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福住幸大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSUMI, YUKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種熱介質供給裝置，即便於壓縮機發生故障時亦可繼續向半導體製造用的多個處理腔室供給熱介質。熱介質供給裝置1包括：冷卻裝置3，對熱介質進行冷卻；熱介質輸送管線10，移送由冷卻裝置3冷卻並於多個處理腔室100的溫度調節中使用的熱介質；以及動作控制部5，以由熱介質供給溫度測量裝置58測量的熱介質的溫度被維持為規定的溫度的方式控制冷卻裝置3的動作。冷卻裝置3包括：蒸發器35，利用熱介質的熱使冷媒液蒸發而生成冷媒蒸氣；多個壓縮機36，壓縮冷媒蒸氣；以及冷凝器38，使壓縮後的冷媒蒸氣冷凝而生成冷媒液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熱介質供給裝置</p>  
        <p type="p">3:冷卻裝置</p>  
        <p type="p">5:動作控制部</p>  
        <p type="p">5a:儲存裝置</p>  
        <p type="p">5b:運算裝置</p>  
        <p type="p">7:熱介質泵</p>  
        <p type="p">10:熱介質輸送管線</p>  
        <p type="p">10a:分支輸送管線</p>  
        <p type="p">11:熱介質返回管線</p>  
        <p type="p">11a:合流返回管線</p>  
        <p type="p">15:熱介質罐</p>  
        <p type="p">16:液面檢測器</p>  
        <p type="p">30:壓縮式冷凍機(渦輪冷凍機)</p>  
        <p type="p">35:蒸發器</p>  
        <p type="p">36:壓縮機</p>  
        <p type="p">38:冷凝器</p>  
        <p type="p">40:冷媒配管</p>  
        <p type="p">41:膨脹閥</p>  
        <p type="p">45:葉輪</p>  
        <p type="p">48:電動機</p>  
        <p type="p">50:逆變器</p>  
        <p type="p">54:連結配管</p>  
        <p type="p">58:熱介質供給溫度測量裝置</p>  
        <p type="p">60:流量測定器</p>  
        <p type="p">61:熱介質流量控制閥</p>  
        <p type="p">63:熱介質返回溫度測量裝置</p>  
        <p type="p">100:處理腔室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2116" publication-number="202626203"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626203.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粉體定量採集裝置及粉體定量採集方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B01L3/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商武藏工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSASHI ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生島和正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKUSHIMA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於解決計量精度產生偏差的問題及附著於吸入計量具之剩餘粉體於意外之時間點落下的問題。 &lt;br/&gt;本發明之粉體分配裝置1之特徵在於，其具備：粉體定量採集裝置10，其具備吸入計量具，該吸入計量具係具有由過濾器131所區分之計量室133及被設置於前端之吸入口132；負壓產生裝置20，其經由過濾器131而使負壓作用於計量室133；振動裝置30，其具備對貯存粉體之粉體槽101賦予振動的振動賦予體31；及控制裝置，其控制負壓產生裝置20及振動裝置30之動作；且控制裝置係於粉體定量採集裝置10到達填充位置時執行填充步驟，於執行填充步驟時，在設定填充時間之期間，藉由負壓產生裝置20而對計量室133施加負壓，且藉由振動裝置30而使振動賦予體31振動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:粉體分配裝置</p>  
        <p type="p">2:機器人控制裝置</p>  
        <p type="p">10:粉體定量採集裝置</p>  
        <p type="p">31:振動賦予體</p>  
        <p type="p">101:粉體槽</p>  
        <p type="p">201:架台</p>  
        <p type="p">202:Y方向驅動裝置</p>  
        <p type="p">203:工件載台</p>  
        <p type="p">204:Z方向驅動裝置</p>  
        <p type="p">205:分注頭</p>  
        <p type="p">206:分注容器</p>  
        <p type="p">211:X方向</p>  
        <p type="p">212:Y方向</p>  
        <p type="p">213:Z方向(鉛直方向)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2117" publication-number="202626996"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626996.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>漿料、多液式漿料、研磨方法、零件的製造方法及半導體零件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09G1/02</main-classification>  
        <further-classification edition="200601120260401B">C09K3/14</further-classification>  
        <further-classification edition="201201120260401B">B24B37/00</further-classification>  
        <further-classification edition="202601120260401B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田遼平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, RYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>織田明博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORITA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五十嵐羽奏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARASHI, WAKANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種漿料，其含有磨粒、具有2個以下的芳香環的非離子性界面活性劑、及陽離子性聚合物。一種多液式漿料，前述漿料的構成成分至少分成第1液及第2液進行保存，前述第1液含有前述磨粒，前述第2液含有選自由前述非離子性界面活性劑及前述陽離子性聚合物組成的組中之至少一種。一種研磨方法，其具備使用前述漿料來研磨被研磨部件之步驟。一種零件的製造方法，其具備使用藉由前述研磨方法研磨後的被研磨部件而獲得零件之步驟。一種半導體零件的製造方法，其具備使用藉由前述研磨方法研磨後的被研磨部件來獲得半導體零件之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2118" publication-number="202627393"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627393.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱交換元件、熱交換元件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">F28F3/02</main-classification>  
        <further-classification edition="200601120260319B">F28D9/00</further-classification>  
        <further-classification edition="200601120260319B">B21D31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植田充彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, MITSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水野裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>住永健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMINAGA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凌廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LING, GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在熱交換元件中波板狀之傳熱構件30積層複數個，熱交換元件具有供氣風路與排氣風路與對向配置的對向流部。波板狀之傳熱構件30是於第1面60側突出之第1突出部64與於第2面62側突出之第2突出部66交互地排列。對向流部是使複數個傳熱構件30當中的1個傳熱構件30之第1突出部64、與鄰接於1個傳熱構件30之第1面60側的其他傳熱構件30之第2面62對向，並將1個傳熱構件30與其他傳熱構件30積層。複數個傳熱構件30各自具有可讓水分穿透的透濕性構件32、與用以維持波板狀之形狀的形狀保持構件34，形狀保持構件34之開口部70被透濕性構件32覆蓋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:傳熱構件</p>  
        <p type="p">32:透濕性構件</p>  
        <p type="p">34:形狀保持構件</p>  
        <p type="p">36a:第1平坦部</p>  
        <p type="p">36b:第2平坦部</p>  
        <p type="p">60:第1面</p>  
        <p type="p">62:第2面</p>  
        <p type="p">64:第1突出部</p>  
        <p type="p">66:第2突出部</p>  
        <p type="p">70:開口部</p>  
        <p type="p">72:第1端部</p>  
        <p type="p">74:第2端部</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2119" publication-number="202626568"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626568.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含氟芳香族化合物的製造方法、含氟苯并三唑鹽的製造方法、芳香族氟醚化合物及組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C17/32</main-classification>  
        <further-classification edition="200601120260401B">C07C22/04</further-classification>  
        <further-classification edition="200601120260401B">C07C22/08</further-classification>  
        <further-classification edition="200601120260401B">C07C41/14</further-classification>  
        <further-classification edition="200601120260401B">C07C43/225</further-classification>  
        <further-classification edition="200601120260401B">C07D249/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人名古屋工業大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGOYA INSTITUTE OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星谷尚亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHIYA, NAOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸川洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIKAWA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴田哲男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川井孔貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAI, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供含氟芳香族化合物的製造方法。 &lt;br/&gt;　　一種含氟芳香族化合物的製造方法，其包含藉由將N-氟烷氧基化合物與芳香族化合物於氧化還原觸媒存在下進行反應，而獲得生成物的步驟，前述N-氟烷氧基化合物為具有N-ORf部位(Rf表示碳數3以上之氟烷基)之化合物，前述生成物包含：選自由具有-ORf部位之芳香族氟醚化合物(E1)，及具有-Rf'部位(Rf'表示自Rf去除一個碳而成的氟烷基)之芳香族化合物(E2)所成群組中之至少1種含氟芳香族化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2120" publication-number="202628318"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628318.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線電力發送裝置</chinese-title>  
        <english-title>WIRELESS POWER TRANSMITTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251103B">H02J50/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龢諧科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLTRAWARE SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許致維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JR UEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃培維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PEI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃程揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐梓育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TZU YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪明順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MING SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈毓豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YU HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線電力發送裝置包含第一線圈結構以及控制電路。第一線圈結構包含第一電路板以及設置於第一電路板上的複數匝線圈導體。複數匝線圈導體包含至少一第一電容結構。第一電容結構與複數匝線圈導體之出線端的直線距離小於第一電容結構與複數匝線圈導體之入線端的直線距離，且第一電容結構的位置不與出線端的位置重疊。控制電路量測第一線圈結構以求出電力傳輸值，並透過電力傳輸值判斷異物是否進入無線電力發送裝置及接收裝置之間的電力傳輸範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless power transmitting device comprises a first coil structure and a control circuit. The first coil structure comprises a first circuit board and a plurality of turns of a coil conductor disposed on the first circuit board. The coil conductor comprises at least one first capacitor structure. Linear distance between the first capacitor structure and a output terminal of the coil conductor is shorter than the linear distance between the first capacitor structure and a input terminal of the coil conductor. Position of the first capacitor structure does not overlap with position of the output terminal. The control circuit measures the first coil structure to determine a power transfer value, and determine whether a foreign object has entered a power transmission range between the wireless power transmitting device and the receiving device according to the power transfer value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">TRA120:線圈結構</p>  
        <p type="p">BRD1:第一電路板</p>  
        <p type="p">120:線圈導體</p>  
        <p type="p">120_1,120_2,120_3,120_4:線圈</p>  
        <p type="p">C1:第一電容結構</p>  
        <p type="p">IT1:入線端</p>  
        <p type="p">OT1:出線端</p>  
        <p type="p">CEN1:中心點</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">STR1,STR2:量測端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2121" publication-number="202628202"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628202.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水電解質二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">H01M4/131</main-classification>  
        <further-classification edition="201001120260401B">H01M4/133</further-classification>  
        <further-classification edition="201001120260401B">H01M4/485</further-classification>  
        <further-classification edition="201001120260401B">H01M4/525</further-classification>  
        <further-classification edition="201001120260401B">H01M4/583</further-classification>  
        <further-classification edition="201001120260401B">H01M10/05</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0562</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0567</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0568</further-classification>  
        <further-classification edition="201001120260401B">H01M10/0569</further-classification>  
        <further-classification edition="201101120260401B">B82Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木翔太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北鹿渡秀嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAKADO, HIDETSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清森歩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIYOMORI, AYUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題係提供一種可提升循環特性，且可抑制內電阻的上升的非水電解質二次電池。 &lt;br/&gt;　　解決手段為一種非水電解質二次電池，其包含：負極，係包含具有負極活性物質粒子的負極活性物質；正極；及非水電解液，係包含非水溶劑與電解質鹽，其特徵為，前述負極活性物質粒子係包含三價以下之非晶狀的低價數奈米矽氧化物，前述非水電解液係包含氟矽烷化合物與腈化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電極體</p>  
        <p type="p">2:正極引線</p>  
        <p type="p">3:負極引線</p>  
        <p type="p">4:密合膜</p>  
        <p type="p">5:外裝構件</p>  
        <p type="p">10:鋰離子二次電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2122" publication-number="202626181"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626181.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114139999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結合的系統控制器和試劑輸送系統</chinese-title>  
        <english-title>COMBINED SYSTEM CONTROLLER AND REAGENT DELIVERY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01D53/79</main-classification>  
        <further-classification edition="200601120260401B">B01D53/76</further-classification>  
        <further-classification edition="200601120260401B">H01J37/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東尼　萊恩Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWNEY, RYAN T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種減排裝置，包括前級電漿反應器、試劑輸送系統，該試劑輸送系統配置為向與前級電漿反應器的上游耦接的前級提供一或多種試劑氣體，以及系統控制器，該系統控制器整合於試劑輸送系統中，並且該系統控制器配置為同時控制基板處理工具的多個腔室的試劑輸送和減排功能。系統控制器根據多個腔室的排放剖面來動態調整試劑氣體的流量。系統控制器調節向多個腔室中的每一者的試劑氣體輸送，同時管理減排過程以中和或捕獲副產品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an abatement device including a foreline plasma reactor, a reagent delivery system configured to provide one or more reagent gases to a foreline coupled upstream of the foreline plasma reactor, and a system controller incorporated within the reagent delivery system and configured to simultaneously control reagent delivery and abatement functions of multiple chambers of a substrate processing tool. The system controller dynamically adjusts a flow of reagent gases based on emission profiles of the multiple chambers. The system controller regulates reagent gas delivery to each of the multiple chambers while simultaneously managing abatement processes to neutralize or capture byproducts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:腔室</p>  
        <p type="p">107:連接</p>  
        <p type="p">110:系統控制器</p>  
        <p type="p">120:電漿反應器</p>  
        <p type="p">150:第一出口</p>  
        <p type="p">152:第二出口</p>  
        <p type="p">154:第三出口</p>  
        <p type="p">156:埠</p>  
        <p type="p">160:通道</p>  
        <p type="p">162:通道</p>  
        <p type="p">164:通道</p>  
        <p type="p">170:減排系統</p>  
        <p type="p">172:第一分配器</p>  
        <p type="p">174:第二分配器</p>  
        <p type="p">176:第三分配器</p>  
        <p type="p">182:第一入口</p>  
        <p type="p">184:第二入口</p>  
        <p type="p">186:第三入口</p>  
        <p type="p">200:系統</p>  
        <p type="p">215:客戶網路</p>  
        <p type="p">217:連接點</p>  
        <p type="p">222:第一試劑氣體</p>  
        <p type="p">224:第一流體</p>  
        <p type="p">226:第二試劑氣體</p>  
        <p type="p">228:電力</p>  
        <p type="p">230:閥</p>  
        <p type="p">234:閥</p>  
        <p type="p">236:流量計</p>  
        <p type="p">242:閥</p>  
        <p type="p">244:閥</p>  
        <p type="p">246:流量計</p>  
        <p type="p">250:閥</p>  
        <p type="p">254:閥</p>  
        <p type="p">256:流量計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2123" publication-number="202626175"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626175.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於加強二氧化碳捕集之成形蜂巢式接觸器及其裝置</chinese-title>  
        <english-title>FORMED HONEYCOMB CONTACTOR FOR ENHANCED CO2 CAPTURE AND APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01D53/08</main-classification>  
        <further-classification edition="200601120260401B">B01D53/62</further-classification>  
        <further-classification edition="200601120260401B">B01J20/00</further-classification>  
        <further-classification edition="200601120260401B">B01J20/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印度商百瑞亞（亞洲）私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRY-AIR (ASIA) PVT. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印度商國際除濕轉子私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESICCANT ROTORS INTERNATIONAL PVT. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瓦　迪帕克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAHWA, DEEPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瓦　瓦倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAHWA, VARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬達里　阿尼爾　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOUDHARY, ANIL KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索　尼婭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩奇戴夫　拉然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SACHDEV, RAJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘特　卡姆雷什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANT, KAMLESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬利克　庫爾迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALIK, KULDEEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於透過吸附劑的吸附從乾燥氣流和／或濕潤氣流中增強二氧化碳捕集、去除、分離的吸附劑複合的蜂巢式接觸器，其包括包含一基材的一3D結構，其中該3D結構的該基材與一吸附材料複合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to adsorbent compounded honeycomb contactor for enhanced CO&lt;sub&gt;2&lt;/sub&gt; capture/removal/separation from dry and/or wet gas stream through adsorption by the adsorbent, comprising a 3D structure comprising a substrate, wherein the substrate of the 3D structure is compounded with an adsorbent material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:成形蜂巢式接觸器、接觸器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2124" publication-number="202625930"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625930.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>牙刷</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A46B9/04</main-classification>  
        <further-classification edition="200601120251231B">A46D1/00</further-classification>  
        <further-classification edition="200601120251231B">A46D3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商獅子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LION CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川晃大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, KOUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田玲央奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, REONA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松室志歩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURO, SHIHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種能夠使軟質毛與剛性毛束的質感協調而無不適感地刷牙的牙刷。所述牙刷包括：軟質毛，由軟質樹脂形成為長絲形狀；剛性毛束，剛性較軟質毛大；以及頭部，軟質毛及剛性毛束在厚度方向的正面側沿與厚度方向正交的面方向排列。在面方向中的、頭部的長軸方向或與長軸方向正交的寬度方向上至少具有一個連續排列多個軟質毛的軟質組。軟質組及剛性毛束按照基於相鄰組合配置的軟質組與剛性毛束在刷牙時的相互作用所引起的質感的規定排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:牙刷</p>  
        <p type="p">2:柄體</p>  
        <p type="p">4:頭部</p>  
        <p type="p">5:植毛面</p>  
        <p type="p">6:孔(植毛孔)</p>  
        <p type="p">11:軟質組</p>  
        <p type="p">20:剛性毛束</p>  
        <p type="p">21:相向毛束</p>  
        <p type="p">22:非相向毛束</p>  
        <p type="p">A、B、C、D、d:線段</p>  
        <p type="p">a、b、c:線段(長度)</p>  
        <p type="p">E、e:區域</p>  
        <p type="p">X、Y、Z:軸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2125" publication-number="202627546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體</chinese-title>  
        <english-title>OPTICAL LAMINATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">G02B5/30</main-classification>  
        <further-classification edition="200601120260326B">G02F1/13363</further-classification>  
        <further-classification edition="202301120260326B">H10K59/50</further-classification>  
        <further-classification edition="200601120260326B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部峻也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本匡養</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松慶史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, YOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種光學積層體，其可抑制二色性色素從線性偏光片消失，且可抑制不均造成的視覺確認性降低。 &lt;br/&gt;本發明之解決手段為一種光學積層體，係依序具備第一保護層、線性偏光片、黏著劑層、及位相差層積層體。黏著劑層具有0.2至1.0MPa之25℃儲藏彈性模數、及2至25μm之厚度。位相差層積層體從前述黏著劑層側起依序具有第一液晶位相差層、具有20至200nm之厚度之接著劑層、及第二液晶位相差層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the present invention is to provide an optical laminate capable of suppressing the disappearance of dichroic dyes from a linear polarizer and suppressing the degradation of visibility caused by unevenness. &lt;br/&gt;The optical laminate of the present invention sequentially comprises a first protective layer, a linear polarizer, an adhesive layer, and a retardation layer laminate. The adhesive layer has a storage elastic modulus at 25°C of 0.2 to 1.0 MPa and a thickness of 2 to 25 μm. The retardation layer laminate sequentially comprises, from the side of the adhesive layer, a first liquid crystal retardation layer, a bonding layer having a thickness of 20 to 200 nm, and a second liquid crystal retardation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:第一液晶位相差層</p>  
        <p type="p">40:接著劑層</p>  
        <p type="p">50:第二液晶位相差層</p>  
        <p type="p">150:黏著劑層</p>  
        <p type="p">180:第一保護層</p>  
        <p type="p">220:線性偏光片</p>  
        <p type="p">300:位相差層積層體</p>  
        <p type="p">400:光學積層體(圓偏光板)</p>  
        <p type="p">500:外側黏著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2126" publication-number="202626582"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626582.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有乙基的碳酸酯的製造方法及甲醇的製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING A CARBONATE HAVING AN ETHYL GROUP AND METHOD FOR PRODUCING METHANOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260401B">C07C68/06</main-classification>  
        <further-classification edition="200601120260401B">C07C68/08</further-classification>  
        <further-classification edition="200601120260401B">C07C69/96</further-classification>  
        <further-classification edition="200601120260401B">C07C29/128</further-classification>  
        <further-classification edition="200601120260401B">C07C29/80</further-classification>  
        <further-classification edition="200601120260401B">C07C31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榎本美弥子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENOMOTO, MIYAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種碳酸甲乙酯的製造方法，其中具有：使包含碳酸二甲酯及乙醇的原料組成物進行反應，以獲得包含碳酸甲乙酯的反應組成物之反應步驟；藉由蒸餾塔將前述反應組成物的至少一部分分離為以甲醇作為主成分之餾分A&lt;sub&gt;L&lt;/sub&gt;，與以碳酸二甲酯及乙醇作為主成分之餾分A&lt;sub&gt;H&lt;/sub&gt;之第1分離步驟；前述餾分A&lt;sub&gt;H&lt;/sub&gt;作為原料組成物的一部分回送至前述反應步驟之步驟；前述餾分A&lt;sub&gt;H&lt;/sub&gt;係含有0.4wt%以上6.0wt%以下之甲醇，且，相對於前述原料組成物全部量，前述原料組成物係含有0.1wt%以上8.0wt%以下之甲醇。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for producing ethyl methyl carbonate includes a reaction step in which a raw material composition containing dimethyl carbonate and ethanol is reacted to obtain a reaction composition containing ethyl methyl carbonate; a first separation step in which at least a portion of the reaction composition is separated, using a distillation column, into a fraction A&lt;sub&gt;L&lt;/sub&gt; that contains methanol as a main component and a fraction A&lt;sub&gt;H&lt;/sub&gt; that contains dimethyl carbonate and ethanol as main components; and a step in which the fraction A&lt;sub&gt;H&lt;/sub&gt; is returned to the reaction step as part of the raw material composition. The fraction A&lt;sub&gt;H&lt;/sub&gt; contains 0.4 wt% to 6.0 wt% of methanol, and the raw material composition contains 0.1 wt% to 8.0 wt% of methanol based on a total amount of the raw material composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">0:蒸餾塔</p>  
        <p type="p">1:蒸餾塔</p>  
        <p type="p">2:蒸餾塔</p>  
        <p type="p">8:槽</p>  
        <p type="p">9:循環流徑</p>  
        <p type="p">R1:反應器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2127" publication-number="202627250"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627250.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>近紅外線吸收纖維、及纖維製品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">D01F1/10</main-classification>  
        <further-classification edition="200601120260326B">D01F6/00</further-classification>  
        <further-classification edition="200601120260326B">D06M11/48</further-classification>  
        <further-classification edition="200601320260326B">D06M101/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友金屬礦山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長南武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONAN, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤孝郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田純平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種近紅外線吸收纖維，其包含：纖維、和複合鎢氧化物顆粒，前述複合鎢氧化物顆粒用非離子性高分子分散劑進行改性，前述複合鎢氧化物顆粒配置在選自前述纖維的表面和內部中的1個以上的部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:近紅外線吸收纖維</p>  
        <p type="p">21:纖維</p>  
        <p type="p">21A:表面</p>  
        <p type="p">21B:內部</p>  
        <p type="p">22:複合鎢氧化物顆粒</p>  
        <p type="p">CA:中心軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2128" publication-number="202627547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體</chinese-title>  
        <english-title>OPTICAL LAMINATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G02B5/30</main-classification>  
        <further-classification edition="201901120260324B">B32B7/023</further-classification>  
        <further-classification edition="200601120260324B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本匡養</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部峻也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種光學積層體，即使僅於線性偏光片的單面側具有保護層，亦可抑制高溫高濕環境下二色性色素從線性偏光片消失，且改善視覺確認性(干涉不均及氣泡混入)。 &lt;br/&gt;本發明之解決手段為光學積層體係依序具備第一保護層、線性偏光片、第一接著劑層、及位相差層積層體。第一接著劑層為含有自由基聚合性化合物之硬化性組成物之硬化物層。位相差層積層體從前述第一接著劑層側起依序具有第一液晶位相差層、具有20至200nm之厚度之第二接著劑層、及第二液晶位相差層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the present invention is to provide an optical laminate hat, even when having a protective layer on only one side of a linear polarizer, can suppress the disappearance of dichroic dyes from the linear polarizer under high-temperature and high-humidity environments, and improve visibility (by reducing interference fringes and bubble inclusion). &lt;br/&gt;The optical laminate of the present invention sequentially comprises a first protective layer, a linear polarizer, a first adhesive layer, and a retardation layer laminate. The first adhesive layer is a cured layer of a curable composition containing a radical polymerizable compound. The retardation layer laminate sequentially comprises, from the side of the first adhesive layer, a first liquid crystal retardation layer, a second adhesive layer having a thickness of 20 to 200 nm, and a second liquid crystal retardation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:第一液晶位相差層</p>  
        <p type="p">40:第二接著劑層</p>  
        <p type="p">50:第二液晶位相差層</p>  
        <p type="p">150:第一接著劑層</p>  
        <p type="p">180:第一保護層</p>  
        <p type="p">220:線性偏光片</p>  
        <p type="p">300:位相差層積層體</p>  
        <p type="p">400:光學積層體(圓偏光板)</p>  
        <p type="p">500:外側黏著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2129" publication-number="202627046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻燃劑組成物</chinese-title>  
        <english-title>FLAME RETARDANT COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C09K21/12</main-classification>  
        <further-classification edition="200601120260317B">C08K5/3492</further-classification>  
        <further-classification edition="200601120260317B">C08L61/28</further-classification>  
        <further-classification edition="200601120260317B">C09D5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商坎斯菲立克布登漢兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMISCHE FABRIK BUDENHEIM KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁內斯　大衛加西亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ, DAVID GARCIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫謝爾　賽巴斯提安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOSCHEL, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫斯　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOSS, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富特勒　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUTTERER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡塔蘭　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATALAN, ANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於阻燃劑組成物、含有此阻燃劑組成物的塗覆膜及塗覆配方、生產此阻燃劑組成物的方法及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a flame retardant composition, a coating and a coating formulation comprising this flame retardant, a method for producing the flame retardant composition, and the use thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2130" publication-number="202627118"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627118.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極材料之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C22C1/02</main-classification>  
        <further-classification edition="200601120260401B">C22C3/00</further-classification>  
        <further-classification edition="200601120260401B">C22C19/00</further-classification>  
        <further-classification edition="200601120260401B">C22C21/00</further-classification>  
        <further-classification edition="200601120260401B">B01J25/02</further-classification>  
        <further-classification edition="202401120260401B">B01J35/50</further-classification>  
        <further-classification edition="200601120260401B">B01J37/00</further-classification>  
        <further-classification edition="200601120260401B">B01J37/02</further-classification>  
        <further-classification edition="200601120260401B">B01J37/12</further-classification>  
        <further-classification edition="202101120260401B">C25B11/031</further-classification>  
        <further-classification edition="202101120260401B">C25B11/089</further-classification>  
        <further-classification edition="202101120260401B">C25B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商豐田自動織機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOYOTA JIDOSHOKKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本重化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN METALS AND CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井敬介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡西岳太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKANISHI, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤孝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWA, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤勝幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤駿太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, SHUNTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相馬友樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUMA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水電解裝置之電極中所用的電極材料之製造方法，其包含得到雷氏鎳的步驟，該雷氏鎳係含於電極材料中，得到雷氏鎳的步驟包含藉由鹼性物質從NiAl合金中使鋁溶出的鹼處理步驟。NiAl合金除了不可避免的雜質外的成分組成係以組成式Al&lt;sub&gt;3.00&lt;/sub&gt;Ni&lt;sub&gt;(2.00-x)&lt;/sub&gt;Co&lt;sub&gt;x&lt;/sub&gt;(x係滿足0.00＜x＜0.50之值。)表示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2131" publication-number="202627223"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627223.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極材料之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260323B">C25B11/046</main-classification>  
        <further-classification edition="200601120260323B">H01M4/86</further-classification>  
        <further-classification edition="200601120260323B">H01M4/98</further-classification>  
        <further-classification edition="201601120260323B">H01M8/0232</further-classification>  
        <further-classification edition="200601120260323B">B01J25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商豐田自動織機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOYOTA JIDOSHOKKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本重化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN METALS AND CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井敬介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡西岳太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKANISHI, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤孝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWA, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤勝幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤駿太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, SHUNTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相馬友樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUMA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水電解裝置之電極中所用的電極材料之製造方法，其包含得到雷氏鎳的步驟，該雷氏鎳係含於電極材料中，得到雷氏鎳的步驟包含藉由鹼性物質從NiAl合金中使鋁溶出的鹼處理步驟。NiAl合金除了不可避免的雜質外的成分組成係以組成式Al&lt;sub&gt;3.00&lt;/sub&gt;Ni&lt;sub&gt;(2.00-x)&lt;/sub&gt;Cu&lt;sub&gt;x&lt;/sub&gt;(x為滿足0.00＜x＜0.30之值。)表示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2132" publication-number="202627129"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627129.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極材料之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C22C19/03</main-classification>  
        <further-classification edition="202101120260318B">C25B11/031</further-classification>  
        <further-classification edition="200601120260318B">H01M4/98</further-classification>  
        <further-classification edition="200601120260318B">B01J25/02</further-classification>  
        <further-classification edition="202101120260318B">C25B1/044</further-classification>  
        <further-classification edition="202201120260318B">B22F1/0655</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商豐田自動織機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOYOTA JIDOSHOKKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本重化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN METALS AND CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井敬介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡西岳太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKANISHI, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤孝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWA, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤勝幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤駿太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, SHUNTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相馬友樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUMA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水電解裝置之電極中所用的電極材料之製造方法，其包含得到雷氏鎳的步驟，該雷氏鎳係含於電極材料中，得到雷氏鎳的步驟包含藉由鹼性物質從NiAl合金中使鋁溶出的鹼處理步驟。NiAl合金除了不可避免的雜質外的成分組成係以組成式Al&lt;sub&gt;3.00&lt;/sub&gt;Ni&lt;sub&gt;(2.00-(x+y))&lt;/sub&gt;Cu&lt;sub&gt;x&lt;/sub&gt;Fe&lt;sub&gt;y&lt;/sub&gt;(x及y為滿足0.00＜x+y≦0.45、0.00＜x≦0.40、及0.00＜y≦0.30之值。)表示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2133" publication-number="202627221"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627221.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極之製造方法、以及用於其之電極的原料及漿體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260401B">C25B11/031</main-classification>  
        <further-classification edition="202101120260401B">C25B11/051</further-classification>  
        <further-classification edition="202101120260401B">C25B11/089</further-classification>  
        <further-classification edition="202101120260401B">C25B1/04</further-classification>  
        <further-classification edition="200601120260401B">B01J25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商豐田自動織機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOYOTA JIDOSHOKKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井敬介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡西岳太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKANISHI, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井海里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, KAIRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">水電解裝置之電極包含基材、與擔載於基材上之雷氏鎳。一種電極之製造方法，其包含得到雷氏鎳的步驟，得到雷氏鎳的步驟包含藉由鹼性物質從NiAl合金中使鋁溶出的鹼處理步驟。上述NiAl合金的剖面中，鋁的含量為45～70mol%的區域所佔的面積之比例為85%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2134" publication-number="202626280"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626280.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140097</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可切換式扭力扳手</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260329B">B25B23/142</main-classification>  
        <further-classification edition="200601120260329B">B25B23/14</further-classification>  
        <further-classification edition="200601120260329B">B25B13/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商維拉維克催格有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WERA WERKZEUGE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特勞克　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRAUCH, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧克　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCKER, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德　提莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROHDE, TIMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種具有驅動臂(2)的螺旋工具，在該驅動臂中佈置有扭矩限制裝置，用於設定限制扭矩。在超過施加至驅動臂(2)上的限制扭矩時，止擋側面(6)碰撞在止擋點(7)處，從而能聽見咔噠聲。透過移動切換文件(10)，可使此咔噠聲功能失效，具體方式在於，阻斷閉鎖體(9)的移動路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:頭部</p>  
        <p type="p">2:驅動臂</p>  
        <p type="p">3:從動銷、從動元件</p>  
        <p type="p">5:傳動臂</p>  
        <p type="p">6:止擋側面</p>  
        <p type="p">7:止擋點</p>  
        <p type="p">9:閉鎖體</p>  
        <p type="p">10:切換元件、滑塊</p>  
        <p type="p">11:力儲存器、壓力彈簧</p>  
        <p type="p">12:旋轉軸</p>  
        <p type="p">13:空腔</p>  
        <p type="p">15:套筒、內套筒</p>  
        <p type="p">16:凹部、環形槽、窗口</p>  
        <p type="p">24:傳動元件、傳動桿</p>  
        <p type="p">25:挺桿</p>  
        <p type="p">26:伸展桿</p>  
        <p type="p">26':鉸接點、鉸鏈銷</p>  
        <p type="p">26":鉸接點、鉸鏈銷</p>  
        <p type="p">27:調整元件</p>  
        <p type="p">28:內管</p>  
        <p type="p">30:指示套筒</p>  
        <p type="p">37:窗口</p>  
        <p type="p">38:滾動體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2135" publication-number="202627379"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627379.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燒成用架子</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">F27D3/12</main-classification>  
        <further-classification edition="200601120260317B">C04B35/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川波信一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANAMI, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望月大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIZUKI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有馬峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之燒成用架子包含：複數個支柱；及連結棒，其橫向延伸，將相鄰之2個支柱連結。支柱包含：支柱筒狀體，其沿上下方向呈筒狀延伸；支柱中空部，其形成於支柱筒狀體之內側；及支柱缺口部，其將支柱筒狀體之外周面切出缺口。支柱缺口部與支柱中空部連通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:燒成用架子</p>  
        <p type="p">2:架子組裝體</p>  
        <p type="p">10A:支柱</p>  
        <p type="p">10B:支柱</p>  
        <p type="p">11:支柱筒狀體</p>  
        <p type="p">12:支柱中空部</p>  
        <p type="p">13:支柱缺口部</p>  
        <p type="p">20A:連結棒</p>  
        <p type="p">20B:連結棒</p>  
        <p type="p">20C:連結棒</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2136" publication-number="202628186"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628186.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電源系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">H01J37/32</main-classification>  
        <further-classification edition="200601120260331B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊東祐里菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YURINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩佐琥偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASA, TORAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提高電漿處理裝置之電漿處理性能之技術。 &lt;br/&gt;本發明之電漿處理裝置具備腔室、基板支持部、下部電極、冷媒流路、氣體供給部、RF信號產生器、及電壓脈衝信號產生器。RF信號於複數個循環之各者中包含之第1期間具有第1電力位準，於複數個循環之各者中包含之第2期間具有第2電力位準，於複數個循環之各者中包含之第3期間具有第3電力位準，第2電力位準及第3電力位準小於第1電力位準。電壓脈衝信號於第1期間具有基準電壓位準，於第2期間具備具有第1電壓位準之電壓脈衝之序列，於第3期間具有基準電壓位準，第1電壓位準之絕對值大於基準電壓位準之絕對值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通訊介面</p>  
        <p type="p">10:腔室</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">12:電漿產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2137" publication-number="202626845"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626845.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯樹脂、樹脂組成物、硬化性樹脂組成物、硬化物、預浸體、電路基板、增層膜、半導體密封材料及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G63/133</main-classification>  
        <further-classification edition="200601120260401B">C08G59/42</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification>  
        <further-classification edition="200601120260401B">C08J5/24</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="200601120260401B">H05K3/46</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川崎渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI, AYUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮璨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迫雅樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAZAMA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供能夠表現出低介電損耗正切、熱膨脹小的聚酯樹脂、樹脂組成物、硬化性樹脂組成物及其硬化物。 &lt;br/&gt;[解決手段]一種聚酯樹脂，其為由芳香族多元羧酸或其鹵化物(A)、單羥基芳香族化合物(B)和多元羥基芳香族化合物(C)形成的聚酯樹脂，所述多元羥基芳香族化合物(C)在其結構中含有茀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2138" publication-number="202625941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬運系統、搬運方法以及搬運程式</chinese-title>  
        <english-title>TRANSPORT SYSTEM, TRANSPORT METHOD, AND TRANSPORT PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">A47G23/08</main-classification>  
        <further-classification edition="200601120260316B">B65G47/52</further-classification>  
        <further-classification edition="200601120260316B">B65G47/64</further-classification>  
        <further-classification edition="201201120260316B">G06Q50/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商藏壽司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURA SUSHI, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中邦彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中一真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠適當執行由活動執行裝置於搬運路上進行之活動的搬運系統、搬運方法以及搬運程式。循環搬運路具備第1客座往復搬運路、第2客座往復搬運路以及廚房搬運路。做為循環搬運路上之活動執行裝置的搬運通路，包含第1活動通路與第2活動通路。在第1客座往復搬運路上執行活動之情形下，於活動執行裝置經由第1活動通路到達活動執行餐桌之時點，控制部使活動開始進行。在第2客座往復搬運路上執行活動之情形下，於活動執行裝置經由第2活動通路到達活動執行餐桌之時點，控制部使活動開始進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the invention is to provide a transport system, a transport method, and a transport program, which is capable of appropriately executing an event on a transport path by an event execution device. A circulation transport path comprises a first customer-seat reciprocating transport path, a second customer-seat reciprocating transport path, and a kitchen transport path. A first event route and a second event route are included as transport routes of the event execution device on the circulation transport path. When executing an event on the first customer-seat reciprocating transport path, a controller starts the event at a timing when the event execution device reaches an event execution table via the first event route. When executing an event on the second customer-seat reciprocating transport path, the controller starts the event at a timing when the event execution device reaches the event execution table via the second event route.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搬運系統</p>  
        <p type="p">2A~2N:餐桌</p>  
        <p type="p">2P~2S:餐桌</p>  
        <p type="p">3A:第1作業空間</p>  
        <p type="p">3B:第2作業空間</p>  
        <p type="p">3C:第3作業空間</p>  
        <p type="p">5A:第1識別碼</p>  
        <p type="p">5B:第2識別碼</p>  
        <p type="p">5C:第3識別碼</p>  
        <p type="p">6:活動執行裝置</p>  
        <p type="p">10:搬運裝置</p>  
        <p type="p">11:搬運路</p>  
        <p type="p">12A:第1客座往復搬運路</p>  
        <p type="p">12B:第2客座往復搬運路</p>  
        <p type="p">12C:第3客座往復搬運路</p>  
        <p type="p">13:廚房搬運路</p>  
        <p type="p">13A:第1廚房搬運路</p>  
        <p type="p">13B:第2廚房搬運路</p>  
        <p type="p">13C:第3廚房搬運路</p>  
        <p type="p">15A:第1活動通路</p>  
        <p type="p">15B:第2活動通路</p>  
        <p type="p">15C:第3活動通路</p>  
        <p type="p">16A:第1投入區域</p>  
        <p type="p">16B:第2投入區域</p>  
        <p type="p">16C:第3投入區域</p>  
        <p type="p">17A1:客座側移送裝置(通路切換裝置)</p>  
        <p type="p">17A2:客座側移送裝置(通路切換裝置)</p>  
        <p type="p">17B1:客座側移送裝置(通路切換裝置)</p>  
        <p type="p">17B2:客座側移送裝置(通路切換裝置)</p>  
        <p type="p">17C1:客座側移送裝置(通路切換裝置)</p>  
        <p type="p">17C2:客座側移送裝置(通路切換裝置)</p>  
        <p type="p">20:店舖管理裝置</p>  
        <p type="p">30:訂單受理裝置</p>  
        <p type="p">40A:第1餐飲物訂單處理裝置</p>  
        <p type="p">40B:第2餐飲物訂單處理裝置</p>  
        <p type="p">40C:第3餐飲物訂單處理裝置</p>  
        <p type="p">50A:第1活動訂單處理裝置</p>  
        <p type="p">50B:第2活動訂單處理裝置</p>  
        <p type="p">50C:第3活動訂單處理裝置</p>  
        <p type="p">60:活動終端</p>  
        <p type="p">70:收容體</p>  
        <p type="p">E:從業人員</p>  
        <p type="p">K:廚房區域</p>  
        <p type="p">G:客座區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2139" publication-number="202627465"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627465.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三烷基硼烷－胺錯合物及胺化合物的組合之選定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G01N24/08</main-classification>  
        <further-classification edition="200601120260401B">C07F5/02</further-classification>  
        <further-classification edition="200601120260401B">C08K5/55</further-classification>  
        <further-classification edition="200601120260401B">C08K5/17</further-classification>  
        <further-classification edition="200601120260401B">C08K5/20</further-classification>  
        <further-classification edition="200601120260401B">C08K5/3412</further-classification>  
        <further-classification edition="200601120260401B">C08K5/357</further-classification>  
        <further-classification edition="200601120260401B">C09J11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川守崇司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMORI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田薰平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永昌大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種在含有三烷基硼烷-胺錯合物及胺化合物之接著劑組成物中，選定賦予充分的可使用時間之三烷基硼烷-胺錯合物及胺化合物的組合之選定方法。該選定方法具備：對三烷基硼烷-胺錯合物進行&lt;sup&gt;11&lt;/sup&gt;B-NMR光譜的測定，求出三烷基硼烷-胺錯合物的關於硼的第1化學位移值之工序；對三烷基硼烷-胺錯合物與胺化合物的混合物進行&lt;sup&gt;11&lt;/sup&gt;B-NMR光譜的測定，求出混合物的關於硼的第2化學位移值之工序；及依據第1化學位移值及第2化學位移值，判定三烷基硼烷-胺錯合物及胺化合物的組合的良否之工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2140" publication-number="202626557"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626557.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合燒結體</chinese-title>  
        <english-title>COMPOSITE SINTERED BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C04B35/443</main-classification>  
        <further-classification edition="200601120260401B">C04B35/581</further-classification>  
        <further-classification edition="202601120260401B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南樹生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAMI, TATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝口智久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOGUCHI, TOMOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山名啓太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANA, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昇和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOBORI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可達成體積電阻率之提升的複合燒結體。本發明之一實施形態的複合燒結體包含氮化鋁及尖晶石。該複合燒結體具備包含氮化鋁之多個晶粒與位於該多個晶粒之中彼此相鄰的晶粒之間的晶界。該晶界的至少一部分的厚度為0.6nm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide a composite sintered body that can provide improved volume resistivity. A composite sintered body according to one embodiment of the invention contains aluminum nitride and spinel. The composite sintered body comprises a plurality of crystal grains containing aluminum nitride, and grain boundaries located between mutually adjacent grains among the plurality of crystal grains. The thickness of at least a portion of the grain boundaries is 0.6 nm or greater.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:複合燒結體</p>  
        <p type="p">1a:陶瓷基板</p>  
        <p type="p">11:晶粒</p>  
        <p type="p">12:晶界</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2141" publication-number="202626961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140189</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由碳二亞胺及界面活性劑之組合增強熱塑性聚氨酯之水解保護</chinese-title>  
        <english-title>ENHANCED HYDROLYSIS PROTECTION OF THERMOPLASTIC POLYURETHANE BY A COMBINATION OF A CARBODIIMIDE AND SURFACTANT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08L75/04</main-classification>  
        <further-classification edition="200601120260330B">C07C267/00</further-classification>  
        <further-classification edition="200601120260330B">C08G18/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田恵介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEDA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪佛　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFER, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多門　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOHMEN, STEPHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯梅爾　馬克思　哈拉爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUEMEL, MARCUS HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉納烏　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIENAU, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡克索　法比安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUXOLL, FABIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧卡斯　弗雷德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCAS, FREDERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種組成物（C），其包含熱塑性彈性體（TPE-1）作為組分（C1）；碳二亞胺（CD），其量為以組成物（C）之組分總和計0.1至5重量%；及添加劑組成物（AC），其量為以組成物（C）之組分總和計0.1至2重量%，其包含至少一種添加劑（A）；其中添加劑組成物（AC）具有根據有機概念圖法測定之大於4.0之HLB值，以及一種用於製備該組成物之方法。此外，本發明關於一種根據本發明之組成物用於製備製品之用途，及包含碳二亞胺（CD）及包含至少一種添加劑（A）之添加劑組成物（AC）之混合物（M1）作為用於包含熱塑性彈性體之組成物之穩定劑之用途，其中添加劑組成物（AC）具有根據有機概念圖法測定之大於4.0之HLB值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a composition (C) comprising a thermoplastic elastomer (TPE-1) as component (C1); a carbodiimide (CD) in an amount of from 0.1 to 5% by weight based on the sum of components of composition (C); and an additive composition (AC) in an amount of from 0.1 to 2% by weight based on the sum of components of composition (C), comprising at least one additive (A); wherein the additive composition (AC) has an HLB value of greater than 4.0, determined according to the organic conception diagram method and a process for pre-paring said composition. Furthermore, the present invention relates to the use of the composition according to the present invention for the preparation of an article and the use of a mixture (M1) comprising a carbodiimide (CD) and an additive composition (AC) comprising at least one additive (A) as a stabilizer for a composition comprising a thermoplastic elastomer, wherein the additive composition (AC) has an HLB value of greater than 4.0, determined according to the organic conception diagram method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2142" publication-number="202628961"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628961.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體設備系統中的傘形結構可調氣體噴嘴(角度和流量可調)的設計</chinese-title>  
        <english-title>A DESIGN OF UMBRELLA ARCHITECTURE TUNABLE GAS NOZZLE (ANGLE AND FLUX ADJUSTABLE) IN SEMICONDUCTOR EQUIPMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P95/70</main-classification>  
        <further-classification edition="200601120260316B">C23C16/455</further-classification>  
        <further-classification edition="201801120260316B">B05B15/652</further-classification>  
        <further-classification edition="200601120260316B">B05B1/30</further-classification>  
        <further-classification edition="200601120260316B">B05B1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宣自月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUAN, ZIYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻世明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　述達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, SHUDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔翰林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, HANLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝孟雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, MENGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎彩麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, CAILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李迪帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DIFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凡昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐文藝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, WENYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於半導體處理系統的氣體分配組件包括縱向中心線、第一氣體噴嘴，第一氣體噴嘴具有第一管狀主體，第一管狀主體具有第一氣體接收端和第一氣體分配端、氣體匯流管、複數個第二氣體噴嘴，每個第二氣體噴嘴都有具有第二管狀主體，第二管狀主體具有第二氣體接收端和第二氣體分配端，並且每個第二氣體噴嘴至少具有相對於縱向中心線的第一角度定向和相對於縱向中心線的第二角度定向，第二角度定向與第一角度定向不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gas distribution assembly for a semiconductor processing system includes a longitudinal centerline, a first gas nozzle having a first tubular body having a first gas receiving end and a first gas dispensing end, a gas hub, a plurality of second gas nozzles, each having a second tubular body having a second gas receiving end and a second gas dispensing end, and each of the second gas nozzles having at least a first angular orientation with respect to the longitudinal centerline, and a second angular orientation with respect to the longitudinal centerline different than the first angular orientation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">114:蓋子</p>  
        <p type="p">116:處理空間</p>  
        <p type="p">206:扣件中央開口</p>  
        <p type="p">210:近端</p>  
        <p type="p">220:遠端</p>  
        <p type="p">409:匯流管主體</p>  
        <p type="p">1102:第二氣體流噴嘴</p>  
        <p type="p">1107:第一氣體流噴嘴</p>  
        <p type="p">1108:抗旋轉支柱</p>  
        <p type="p">1110:抗旋轉開口</p>  
        <p type="p">1113:扣件驅動軸</p>  
        <p type="p">1115:步進馬達</p>  
        <p type="p">1125:電源</p>  
        <p type="p">1126:電源連接線</p>  
        <p type="p">1150:致動器桿</p>  
        <p type="p">1161:氣體匯流管</p>  
        <p type="p">1162:遠端面向表面</p>  
        <p type="p">1163:近端面向表面</p>  
        <p type="p">1164:圓周側壁</p>  
        <p type="p">1165:中央開口</p>  
        <p type="p">1175:桿開口</p>  
        <p type="p">1191:鉸鏈組件</p>  
        <p type="p">1192:第一噴嘴端</p>  
        <p type="p">1194:第二噴嘴端</p>  
        <p type="p">1196:弧形</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2143" publication-number="202626980"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626980.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>油性原子筆用墨水組合物及使用其之油性原子筆</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09D11/18</main-classification>  
        <further-classification edition="200601120260401B">B43K7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商百樂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA PILOT CORPORATION (ALSO TRADING AS PILOT CORPORATION)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤秀憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDOU, HIDENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神林宏信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANBAYASHI, HIRONOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城下孝広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSHITA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種油性原子筆用墨水組合物，其特徵在於包含著色劑、β-烷氧基丙醯胺、沸點100℃以上200℃以下之溶劑、聚丙烯酸樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:墨水收容筒</p>  
        <p type="p">3:滾珠</p>  
        <p type="p">4:原子筆筆尖</p>  
        <p type="p">10:油性原子筆用墨水組合物</p>  
        <p type="p">100:原子筆</p>  
        <p type="p">X:延伸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2144" publication-number="202626177"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626177.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>引入電漿減量系統的下游端口氣體</chinese-title>  
        <english-title>DOWNSTREAM PORT GASES INTRODUCED INTO PLASMA ABATEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B01D53/32</main-classification>  
        <further-classification edition="200601120260325B">B01D53/34</further-classification>  
        <further-classification edition="200601120260325B">B01D53/76</further-classification>  
        <further-classification edition="200601120260325B">B01D53/68</further-classification>  
        <further-classification edition="202601120260325B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范高沛爾　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN GOMPEL, JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出了一種方法，將第一氣體供應至設置在前級真空管線中在半導體處理腔室與電漿源之間的第一進口端口，並將第二氣體供應至設置在前級真空管線中在電漿源與真空源之間的第二進口端口，其中第二氣體為含氫氣體及含氧氣體中之一者或兩者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure presents a method for supplying a first gas into a first inlet port disposed in a foreline between a semiconductor processing chamber and a plasma source and supplying a second gas into a second inlet port disposed in the foreline between the plasma source and a vacuum source, where the second gas is one or both of a hydrogen containing gas and an oxygen containing gas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:減量系統</p>  
        <p type="p">130:電漿源</p>  
        <p type="p">190:真空源</p>  
        <p type="p">202:氣體</p>  
        <p type="p">210:第一導管</p>  
        <p type="p">222:水源</p>  
        <p type="p">224:氧氣源</p>  
        <p type="p">226:氫氣源</p>  
        <p type="p">235:氣體</p>  
        <p type="p">242:電壓源</p>  
        <p type="p">250:第二導管</p>  
        <p type="p">262:氫氣源</p>  
        <p type="p">264:氧氣源</p>  
        <p type="p">275:氣體</p>  
        <p type="p">277:處理後的氣體</p>  
        <p type="p">290:第一感測器</p>  
        <p type="p">295:第二感測器</p>  
        <p type="p">A:物體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2145" publication-number="202626891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫態共聚物、其製備方法及包含該暫態共聚物之物件</chinese-title>  
        <english-title>TRANSIENT COPOLYMERS, PREPARATION METHODS THEREOF, AND ARTICLES COMPRISING SAID TRANSIENT COPOLYMERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08J5/00</main-classification>  
        <further-classification edition="200601120260330B">C08G63/16</further-classification>  
        <further-classification edition="200601120260330B">C08L67/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商Ｂ4塑料公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>B4PLASTICS BV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪　威爾德曼　史提芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE WILDEMAN, STEFAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙塞格　盧西亞諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONSEGUE, LUCIANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞利甚　約蘭德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CELIS, JOLANDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明概言之係關於可在預定時段內經歷化學或生物分解之暫態共聚物。更具體而言，本發明係關於暫態共聚物及其製備方法，該暫態共聚物包含至少兩種不同之大分子單體，其中第一大分子單體係聚酯；其中第二大分子單體係縮合聚合物；且其中該第一大分子單體與該第二大分子單體之莫耳比係大於4:1。本發明進一步關於包含該暫態共聚物之物件及暫態共聚物用於製備物件之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention generally relates to a transient copolymer that can undergo chemical or biological decomposition over a predetermined period. More specifically, the present invention relates to a transient copolymer, and preparation methods thereof, comprising at least two different macromers, wherein a first macromer is a polyester; wherein a second macromer is a condensation polymer; and wherein the molar ratio of the first macromer to the second macromer is more than 4:1. The present invention further relates to an article comprising the transient copolymer and the use of a transient copolymer for preparing an article.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2146" publication-number="202627411"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627411.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學薄膜的捲曲測定方法及光學薄膜的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G01B11/24</main-classification>  
        <further-classification edition="200601120260317B">G01N21/89</further-classification>  
        <further-classification edition="200601120260317B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村岡敦史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAOKA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>妙治一由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAEJI, KAZUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童迨維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, DAIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井孝証</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種可以在短時間內精度良好地測定捲曲值的光學薄膜的捲曲測定方法等。&lt;br/&gt; [解決手段]本發明之捲曲測定方法，是使用具備投光器11及光接收器12的光學感測器1，來測定表示單片狀的光學薄膜F的捲曲的程度之捲曲值的方法，具有：配置步驟ST21，將投光器配置於光學薄膜的側邊的其中一側，以與投光器相向的方式，讓光接收器夾著光學薄膜配置於光學薄膜的側邊的另一側；光投射接收步驟ST22，使用投光器，朝向光學薄膜投射在上下方向上延伸的光束L，使用光接收器，接收光束當中的沒有被光學薄膜遮擋而穿透的光；及捲曲值算出步驟ST23，基於穿透的光的上下方向的長度，算出光學薄膜的捲曲值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ST1:製造步驟</p>  
        <p type="p">ST2:檢查步驟</p>  
        <p type="p">ST3:分配步驟</p>  
        <p type="p">ST21:配置步驟</p>  
        <p type="p">ST22:光投射接收步驟</p>  
        <p type="p">ST23:捲曲值算出步驟</p>  
        <p type="p">ST24:判定步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2147" publication-number="202626227"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626227.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微粒子製造裝置、微粒子的製造方法、微粒子生成用單元、及微粒子生成用單元的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B22F9/24</main-classification>  
        <further-classification edition="202201120260401B">B22F1/052</further-classification>  
        <further-classification edition="202201120260401B">B22F1/054</further-classification>  
        <further-classification edition="200601120260401B">B01J13/00</further-classification>  
        <further-classification edition="200601120260401B">B01J19/12</further-classification>  
        <further-classification edition="201101120260401B">B82Y40/00</further-classification>  
        <further-classification edition="200601120260401B">G01N21/71</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ｉｌｌｕｍｉｎｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLUMINUS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村貴宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴田秀平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA, SHUUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒田陸斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, RIKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供謀求微粒子的量產性及生成效率穩定性的提升的微粒子製造裝置、微粒子的製造方法、微粒子生成用單元、及微粒子生成用單元的製造方法。 &lt;br/&gt;　　[解決手段]微粒子製造裝置(1)，係用於對混合包含金屬原子的前驅體的溶液(7)(前驅體溶液(71))照射飛秒脈衝雷射(30a)製造微粒子的裝置(1)，具備：在溶液(7)的流動方向(f)延長的微粒子生成用單元(2)、對在微粒子生成用單元(2)內流動的溶液(7)沿流動方向(f)照射飛秒脈衝雷射(30a)的照射部(3)。微粒子生成用單元(2)，亦可具有：第1收容部；從第1收容部使溶液(7)流出並穿設由照射部(3)集光飛秒脈衝雷射(30a)的流出孔的隔壁；收容經由流出孔從第1收容部流出的溶液(7)的第2收容部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:微粒子製造裝置</p>  
        <p type="p">2:微粒子生成用單元</p>  
        <p type="p">3:照射部</p>  
        <p type="p">4:投入部</p>  
        <p type="p">5:分析部</p>  
        <p type="p">6:回收部</p>  
        <p type="p">7:溶液</p>  
        <p type="p">20:本體部</p>  
        <p type="p">21:流入口</p>  
        <p type="p">22:流出口</p>  
        <p type="p">23:照射口板</p>  
        <p type="p">24:固定構件</p>  
        <p type="p">25:觀測用窗</p>  
        <p type="p">26:窗固定構件</p>  
        <p type="p">30:照射裝置</p>  
        <p type="p">30a:飛秒脈衝雷射</p>  
        <p type="p">31:透鏡</p>  
        <p type="p">41a:空氣壓縮機</p>  
        <p type="p">41b:空氣用管</p>  
        <p type="p">41c:加壓槽</p>  
        <p type="p">42a:磁力攪拌器</p>  
        <p type="p">42b:攪拌棒</p>  
        <p type="p">43a~43d:溶液用管</p>  
        <p type="p">44a,44b:異徑變換適配器</p>  
        <p type="p">45:針閥</p>  
        <p type="p">51:光譜觀察用流動池</p>  
        <p type="p">52:溶液用管</p>  
        <p type="p">53:光譜器</p>  
        <p type="p">53a:白色光</p>  
        <p type="p">54:照射裝置</p>  
        <p type="p">54a:奈秒脈衝雷射</p>  
        <p type="p">55:透鏡</p>  
        <p type="p">56:光譜器</p>  
        <p type="p">57:透鏡</p>  
        <p type="p">61:回收槽</p>  
        <p type="p">62:溶液用管</p>  
        <p type="p">71:前驅體溶液</p>  
        <p type="p">72:微粒子膠體溶液</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2148" publication-number="202627570"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627570.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光纜、光纜組件、光傳輸裝置及主動式光收發器</chinese-title>  
        <english-title>OPTICAL CABLE, OPTICAL CABLE ASSEMBLY, OPTICAL TRANSMISSION APPARATUS, AND ACTIVE OPTICAL TRANSCEIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G02B6/26</main-classification>  
        <further-classification edition="200601120260318B">G02B6/36</further-classification>  
        <further-classification edition="200601120260318B">G02B6/04</further-classification>  
        <further-classification edition="201301120260318B">H04B10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星系科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIP INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光纜組件及光傳輸裝置。光纜組件包括光纜及連接座。光傳輸裝置包括光纜組件及光耦合部件。光纜包括耦合頭及安裝於線纜元件的連接件，連接件包括多個連接壁及多個第一緊固部。連接座定義有緊固槽，並包括設置在緊固槽內的緊固件。多個第一緊固部與緊固件可拆卸地扣合。光耦合部件包括相對緊固槽設置的波導裝置，且波導裝置配置成與光纜中包含的多個光纖光學連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical cable assembly and an optical transmission apparatus are provided. The optical cable assembly includes an optical cable and a connecting base. The optical transmission apparatus includes the optical cable assembly and an optical coupling member. The optical cable includes a coupling head and a connecting member mounted to a cable member and including a plurality of connecting walls and first fastening portions. The connecting base defines a fastening groove and includes a fastening member disposed in the fastening groove. The first fastening portions are detachably fastened with the fastening member. The optical coupling member includes a waveguide device positioned to correspond to the fastening groove and configured in optical connection with optical fibers included in the optical cable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:光纜組件</p>  
        <p type="p">10:光纜</p>  
        <p type="p">11:連接件</p>  
        <p type="p">110:連接槽</p>  
        <p type="p">111:連接壁</p>  
        <p type="p">112:槽口</p>  
        <p type="p">113:第一緊固部</p>  
        <p type="p">115:定位槽</p>  
        <p type="p">12:耦合頭</p>  
        <p type="p">121:外罩</p>  
        <p type="p">122:套圈元件</p>  
        <p type="p">123:定位件</p>  
        <p type="p">15:線纜元件</p>  
        <p type="p">150:光纖</p>  
        <p type="p">151:端部</p>  
        <p type="p">153:線纜護套</p>  
        <p type="p">20:連接座</p>  
        <p type="p">21:緊固件</p>  
        <p type="p">210:緊固槽</p>  
        <p type="p">211:臂元件</p>  
        <p type="p">213:第二緊固部</p>  
        <p type="p">215:引導凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2149" publication-number="202627571"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627571.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主動式光纜及光收發器</chinese-title>  
        <english-title>ACTIVE OPTICAL CABLE AND OPTICAL TRANSCEIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G02B6/26</main-classification>  
        <further-classification edition="200601120260318B">G02B6/42</further-classification>  
        <further-classification edition="200601120260318B">G02B6/36</further-classification>  
        <further-classification edition="201301120260318B">H04B10/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星系科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIP INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種主動式光纜，包括可拆卸光纜及可拆卸地連接到可拆卸光纜的光收發器。可拆卸光纜包括光纖單元、圍繞光纖單元端部設置的護套元件、包括至少一固持元件的殼體結構、以及位於固持元件處的光耦合裝置。光收發器包括殼體單元、設置在殼體單元中的光電基板，以及設置在光電基板上的波導裝置。光耦合裝置可拆卸地設置在與波導裝置光學對準的位置，用於在波導裝置和光纖單元之間傳輸光訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An active optical cable includes a detachable optical cable and an optical transceiver detachably connected to the detachable optical cable. The detachable optical cable includes an optical fiber unit, a boot element disposed around an end portion of the optical fiber unit, a housing structure attached to an end of the boot element and including at least a holding element, and an optical coupling device positioned at the holding element. The optical transceiver includes a casing unit defining an insertion groove for insertion of the detachable optical cable, an optoelectronic substrate disposed in the casing unit, and a waveguide device disposed on the optoelectronic substrate. The optical coupling device is detachably positioned in optical alignment with the waveguide device for light signal transmission between the waveguide device and the optical fiber unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主動式光纜</p>  
        <p type="p">100:可拆卸光纜</p>  
        <p type="p">110:護套元件</p>  
        <p type="p">111:導套部</p>  
        <p type="p">120:可按壓緊固件</p>  
        <p type="p">140:光纖單元</p>  
        <p type="p">300:光收發器</p>  
        <p type="p">301:插槽</p>  
        <p type="p">301a:主槽部</p>  
        <p type="p">301b:槽壁</p>  
        <p type="p">310:第一殼體部</p>  
        <p type="p">320:第二殼體部</p>  
        <p type="p">330:固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2150" publication-number="202627329"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627329.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>諧波減速器、機械臂和清潔設備</chinese-title>  
        <english-title>HARMONIC REDUCER, ROBOTIC ARM, AND CLEANING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260329B">F16H49/00</main-classification>  
        <further-classification edition="200601120260329B">F16H55/08</further-classification>  
        <further-classification edition="200601120260329B">F16H55/06</further-classification>  
        <further-classification edition="200601120260329B">F16H55/17</further-classification>  
        <further-classification edition="201201120260329B">F16H57/021</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊澄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段傳林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUAN, CHUANLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, PEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例公開了一種諧波減速器、機械臂和清潔設備，諧波減速器包括了柔輪、連接部和輸出部，在諧波減速器製備過程中，通過在柔輪表面形成凸出的連接部，更加便於柔輪和連接部的生產和加工，能夠提高加工精度，如可以通過注塑工藝製備一體成型的柔輪和連接部，替代傳統技術中的連接孔工藝，能夠降低或杜絕連接部出現形變的機率，進而保障了諧波減速器的傳動精度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of this application discloses a harmonic reducer, a robotic arm, and cleaning equipment. The harmonic reducer includes a flexible wheel, a connecting part, and an output part. During the preparation process of the harmonic reducer, by forming a protruding connecting part on the surface of the flexible wheel, it facilitates the production and processing of both the flexible wheel and the connecting part. This can improve processing accuracy. For example, the flexible wheel and connecting part can be integrally molded through injection molding technology, replacing the connecting hole process in traditional technologies, thus reducing or eliminating the probability of deformation of the connecting part, ensuring the transmission accuracy of the harmonic reducer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:柔輪</p>  
        <p type="p">120:連接部</p>  
        <p type="p">130:輸出部</p>  
        <p type="p">150:剛輪</p>  
        <p type="p">160:滾動軸承</p>  
        <p type="p">170:波發生器</p>  
        <p type="p">180:輸入部</p>  
        <p type="p">131:第一限位件</p>  
        <p type="p">1321:輸出軸</p>  
        <p type="p">151:環部</p>  
        <p type="p">1561:蓋體</p>  
        <p type="p">1562:座體</p>  
        <p type="p">171:凸輪</p>  
        <p type="p">172:柔性軸承</p>  
        <p type="p">173:限位翻邊</p>  
        <p type="p">195:外連軸承</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2151" publication-number="202625912"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625912.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>米飯處理裝置以及米飯處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260330B">A23P10/20</main-classification>  
        <further-classification edition="201601120260330B">A23L7/10</further-classification>  
        <further-classification edition="201601120260330B">A23L5/10</further-classification>  
        <further-classification edition="201601120260330B">A23P30/10</further-classification>  
        <further-classification edition="200601120260330B">A47J43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴茂器工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺川祥織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAKAWA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種米飯處理裝置，係具備：貯藏部，係供貯藏米飯；分割形成部，係將前述貯藏部內的前述米飯分割而形成米飯塊；搬送部，係將被貯藏於前述貯藏部的米飯搬送至前述分割形成部；顯示部；輸入部，係供輸入使用者的操作；以及控制部，係控制前述輸入部以及前述顯示部；前述分割形成部係能夠形成由複數個柔軟度中所選擇的對象柔軟度的前述米飯塊；前述控制部係在從前述輸入部取得用以顯示選擇前述對象柔軟度的意旨之操作輸入之情形中，從前述輸入部取得用以顯示形成前述米飯塊的意旨之操作輸入時，使前述分割形成部形成前述對象柔軟度的前述米飯塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:收容部(貯藏部)</p>  
        <p type="p">2:米飯鬆開部</p>  
        <p type="p">3:蓋構件</p>  
        <p type="p">5:分割形成部</p>  
        <p type="p">6:轉台</p>  
        <p type="p">7:觸控面板</p>  
        <p type="p">8:控制部</p>  
        <p type="p">10:殼體</p>  
        <p type="p">10a:架台</p>  
        <p type="p">10b:剩餘量計測部</p>  
        <p type="p">11:投入部</p>  
        <p type="p">21:米飯供給筒</p>  
        <p type="p">22:鬆開構件</p>  
        <p type="p">22a:旋轉軸</p>  
        <p type="p">22b:鬆開葉片</p>  
        <p type="p">31:輥外殼</p>  
        <p type="p">51:閘門</p>  
        <p type="p">51a:可動齒輪</p>  
        <p type="p">51b:可動齒輪</p>  
        <p type="p">52:形成部</p>  
        <p type="p">52a:形成下模</p>  
        <p type="p">52b:形成上模</p>  
        <p type="p">52c:支持構件</p>  
        <p type="p">52d:支柱</p>  
        <p type="p">61:形成孔</p>  
        <p type="p">62:外周部</p>  
        <p type="p">71:顯示部</p>  
        <p type="p">72:操作部(輸入部)</p>  
        <p type="p">100:米飯處理裝置</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">X1:右方</p>  
        <p type="p">X2:左方</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Y1:前方</p>  
        <p type="p">Y2:後方</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">Z1:上方</p>  
        <p type="p">Z2:下方</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2152" publication-number="202625913"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625913.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>米飯處理裝置以及米飯管理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260330B">A23P10/20</main-classification>  
        <further-classification edition="201601120260330B">A23L7/10</further-classification>  
        <further-classification edition="201601120260330B">A23L5/10</further-classification>  
        <further-classification edition="201601120260330B">A23P30/10</further-classification>  
        <further-classification edition="200601120260330B">A47J43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴茂器工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺川祥織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAKAWA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇田川隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UDAGAWA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種米飯處理裝置，係具備：貯藏部，係供貯藏米飯；分割形成部，係將前述貯藏部內的前述米飯分割而形成米飯塊；搬送部，係將被貯藏於前述貯藏部的米飯搬送至前述分割形成部；剩餘量計測部，係計測被貯藏於前述貯藏部的前述米飯的剩餘量；顯示部；輸入部，係供輸入使用者的操作；以及控制部，係控制前述輸入部以及前述顯示部；前述控制部係於前述剩餘量計測部所計測的前述米飯的剩餘量為預定的分界量以上時，將顯示前述米飯被投入過多的意旨之警告圖像顯示於前述顯示部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:收容部(貯藏部)</p>  
        <p type="p">2:米飯鬆開部</p>  
        <p type="p">3:蓋構件</p>  
        <p type="p">5:分割形成部</p>  
        <p type="p">6:轉台</p>  
        <p type="p">7:觸控面板</p>  
        <p type="p">8:控制部</p>  
        <p type="p">10:殼體</p>  
        <p type="p">10a:架台</p>  
        <p type="p">10b:剩餘量計測部</p>  
        <p type="p">11:投入部</p>  
        <p type="p">21:米飯供給筒</p>  
        <p type="p">22:鬆開構件</p>  
        <p type="p">22a:旋轉軸</p>  
        <p type="p">22b:鬆開葉片</p>  
        <p type="p">31:輥外殼</p>  
        <p type="p">51:閘門</p>  
        <p type="p">51a:可動齒輪</p>  
        <p type="p">51b:可動齒輪</p>  
        <p type="p">52:形成部</p>  
        <p type="p">52a:形成下模</p>  
        <p type="p">52b:形成上模</p>  
        <p type="p">52c:支持構件</p>  
        <p type="p">52d:支柱</p>  
        <p type="p">61:形成孔</p>  
        <p type="p">62:外周部</p>  
        <p type="p">71:顯示部</p>  
        <p type="p">72:操作部(輸入部)</p>  
        <p type="p">100:米飯處理裝置</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">X1:右方</p>  
        <p type="p">X2:左方</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Y1:前方</p>  
        <p type="p">Y2:後方</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">Z1:上方</p>  
        <p type="p">Z2:下方</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2153" publication-number="202626800"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626800.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140329</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物、疊層體、圖案形成方法及阻劑組成物之製造方法</chinese-title>  
        <english-title>RESIST COMPOSITION, LAMINATE, PATTERNING PROCESS, AND METHOD FOR MANUFACTURING THE RESIST COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F212/14</main-classification>  
        <further-classification edition="200601120260401B">C08F220/06</further-classification>  
        <further-classification edition="200601120260401B">C08F220/30</further-classification>  
        <further-classification edition="200601120260401B">C07C69/63</further-classification>  
        <further-classification edition="200601120260401B">C07D347/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/09</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度及極限解析度優良的非化學增幅阻劑組成物、以及使用了該阻劑組成物之疊層體、圖案形成方法及前述阻劑組成物之製造方法。&lt;br/&gt; 該課題之解決手段為一種阻劑組成物，其含有：超原子價碘化合物、含羧基之聚合物及溶劑；前述阻劑組成物之特徵為前述含羧基之聚合物為含有下式(1)表示之羧酸衍生物重複單元的聚合物，且由該聚合物以凝膠滲透層析測得的重量平均分子量Mw及數目平均分子量Mn求得之分散度Mw/Mn為1.30以下。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="190px" width="113px" file="ed10318.JPG" alt="ed10318.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2154" publication-number="202625914"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625914.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>米飯處理裝置以及米飯管理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260330B">A23P10/20</main-classification>  
        <further-classification edition="201601120260330B">A23L7/10</further-classification>  
        <further-classification edition="201601120260330B">A23L5/10</further-classification>  
        <further-classification edition="201601120260330B">A23P30/10</further-classification>  
        <further-classification edition="200601120260330B">A47J43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴茂器工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺川祥織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAKAWA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種米飯處理裝置，係用以生成米飯塊，並具備：貯藏部，係供貯藏米飯；分割形成部，係將前述貯藏部內的前述米飯分割而形成前述米飯塊；搬送部，係將被貯藏於前述貯藏部的米飯搬送至前述分割形成部；剩餘量計測部，係計測被貯藏於前述貯藏部的前述米飯的剩餘量；顯示部；輸入部，係供輸入使用者的操作；以及控制部，係控制前述輸入部以及前述顯示部；前述控制部係從前述輸入部取得用以顯示使用者確認了前述米飯處理裝置為初期狀態的意旨之操作輸入，藉此能夠執行用以將前述剩餘量計測部的計測值歸零之歸零修正；前述控制部係在能夠執行前述歸零修正之情形中，從前述輸入部取得了用以顯示前述歸零修正的執行之操作輸入時，執行前述歸零修正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:收容部(貯藏部)</p>  
        <p type="p">2:米飯鬆開部</p>  
        <p type="p">3:蓋構件</p>  
        <p type="p">5:分割形成部</p>  
        <p type="p">6:轉台</p>  
        <p type="p">7:觸控面板</p>  
        <p type="p">8:控制部</p>  
        <p type="p">10:殼體</p>  
        <p type="p">10a:架台</p>  
        <p type="p">10b:剩餘量計測部</p>  
        <p type="p">11:投入部</p>  
        <p type="p">21:米飯供給筒</p>  
        <p type="p">22:鬆開構件</p>  
        <p type="p">22a:旋轉軸</p>  
        <p type="p">22b:鬆開葉片</p>  
        <p type="p">31:輥外殼</p>  
        <p type="p">51:閘門</p>  
        <p type="p">51a:可動齒輪</p>  
        <p type="p">51b:可動齒輪</p>  
        <p type="p">52:形成部</p>  
        <p type="p">52a:形成下模</p>  
        <p type="p">52b:形成上模</p>  
        <p type="p">52c:支持構件</p>  
        <p type="p">52d:支柱</p>  
        <p type="p">61:形成孔</p>  
        <p type="p">62:外周部</p>  
        <p type="p">71:顯示部</p>  
        <p type="p">72:操作部(輸入部)</p>  
        <p type="p">100:米飯處理裝置</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">X1:右方</p>  
        <p type="p">X2:左方</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Y1:前方</p>  
        <p type="p">Y2:後方</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">Z1:上方</p>  
        <p type="p">Z2:下方</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2155" publication-number="202626312"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626312.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>刀刃框架構件以及棒狀食材切斷裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B26D7/14</main-classification>  
        <further-classification edition="200601120260323B">B26D7/26</further-classification>  
        <further-classification edition="200601120260323B">B26D1/03</further-classification>  
        <further-classification edition="200601120260323B">B26D3/16</further-classification>  
        <further-classification edition="200601120260323B">B26D3/24</further-classification>  
        <further-classification edition="200601120260323B">B26D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴茂器工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>是永知賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORENAGA, TOMOKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種刀刃框架構件，係安裝於用以切斷棒狀食材的棒狀食材切斷裝置，並具備：複數個切斷刀刃，係沿著左右方向排列，且沿著與前述左右方向交差之縱方向延伸；第一支撐部，係保持前述複數個切斷刀刃的前述縱方向中之屬於一側的端部之第一端部；第二支撐部，係保持前述複數個切斷刀刃的前述縱方向中之屬於另一側的端部之第二端部；以及支撐框體，係與前述第一支撐部以及前述第二支撐部能夠拆卸地連接，且形成為能夠配置於前述棒狀食材切斷裝置之框架狀；前述第一支撐部與前述支撐框體係在前述左右方向中藉由配置於中間部之中調整螺絲以及夾著前述中調整螺絲而配置於兩側之側調整螺絲而被連接；前述第一支撐部係設置成：能夠藉由前述中調整螺絲以及前述側調整螺絲的鎖固量的變化而相對於前述支撐框體沿著前述縱方向相對位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:刀刃框架構件</p>  
        <p type="p">41:支撐框體</p>  
        <p type="p">42:切斷刀刃</p>  
        <p type="p">43:第一支撐部</p>  
        <p type="p">44:第二支撐部</p>  
        <p type="p">45a:中調整螺絲</p>  
        <p type="p">45b:右調整螺絲(側調整螺絲)</p>  
        <p type="p">45c:左調整螺絲(側調整螺絲)</p>  
        <p type="p">411:前緣面</p>  
        <p type="p">412:後緣面</p>  
        <p type="p">413:上邊緣構件(第一邊緣部)</p>  
        <p type="p">414:下邊緣構件</p>  
        <p type="p">415:右邊緣構件</p>  
        <p type="p">416:左邊緣構件</p>  
        <p type="p">417:把手構件</p>  
        <p type="p">418:嵌合突起</p>  
        <p type="p">D:切斷方向</p>  
        <p type="p">P3:弛緩狀態</p>  
        <p type="p">V:縱方向</p>  
        <p type="p">V1:上側(一側)</p>  
        <p type="p">V2:下側(另一側)</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">X1:右側</p>  
        <p type="p">X2:左側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2156" publication-number="202625915"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625915.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>米飯處理裝置以及米飯處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260330B">A23P10/20</main-classification>  
        <further-classification edition="201601120260330B">A23L7/10</further-classification>  
        <further-classification edition="201601120260330B">A23L5/10</further-classification>  
        <further-classification edition="201601120260330B">A23P30/10</further-classification>  
        <further-classification edition="200601120260330B">A47J43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴茂器工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATOU, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺川祥織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAKAWA, SAORIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇田川隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UDAGAWA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種米飯處理裝置，係具備：貯藏部，係供貯藏米飯；分割形成部，係將前述貯藏部內的前述米飯分割而形成米飯塊；搬送部，係將被貯藏於前述貯藏部的米飯搬送至前述分割形成部；剩餘量計測部，係計測被貯藏於前述貯藏部的前述米飯的剩餘量；顯示部；輸入部，係供輸入使用者的操作；以及控制部，係控制前述輸入部以及前述顯示部；前述控制部係將前述剩餘量計測部所計測的前述米飯的剩餘量作為剩餘量圖像而顯示於前述顯示部；前述剩餘量圖像為下述圖像：因應前述米飯的剩餘量值與從能夠在前述貯藏部貯藏的前述米飯的最大值減去前述剩餘量值後的值的比例，劃分圖像區域內部並顯示前述米飯的剩餘量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:收容部(貯藏部)</p>  
        <p type="p">2:米飯鬆開部</p>  
        <p type="p">3:蓋構件</p>  
        <p type="p">5:分割形成部</p>  
        <p type="p">6:轉台</p>  
        <p type="p">7:觸控面板</p>  
        <p type="p">8:控制部</p>  
        <p type="p">10:殼體</p>  
        <p type="p">10a:架台</p>  
        <p type="p">10b:剩餘量計測部</p>  
        <p type="p">11:投入部</p>  
        <p type="p">21:米飯供給筒</p>  
        <p type="p">22:鬆開構件</p>  
        <p type="p">22a:旋轉軸</p>  
        <p type="p">22b:鬆開葉片</p>  
        <p type="p">31:輥外殼</p>  
        <p type="p">51:閘門</p>  
        <p type="p">51a:可動齒輪</p>  
        <p type="p">51b:可動齒輪</p>  
        <p type="p">52:形成部</p>  
        <p type="p">52a:形成下模</p>  
        <p type="p">52b:形成上模</p>  
        <p type="p">52c:支持構件</p>  
        <p type="p">52d:支柱</p>  
        <p type="p">61:形成孔</p>  
        <p type="p">62:外周部</p>  
        <p type="p">71:顯示部</p>  
        <p type="p">72:操作部(輸入部)</p>  
        <p type="p">100:米飯處理裝置</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">X1:右方</p>  
        <p type="p">X2:左方</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Y1:前方</p>  
        <p type="p">Y2:後方</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">Z1:上方</p>  
        <p type="p">Z2:下方</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2157" publication-number="202626556"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626556.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C04B35/101</main-classification>  
        <further-classification edition="202601120260302B">H10P72/72</further-classification>  
        <further-classification edition="200601120260302B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大久保有馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUBO, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅津智樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMETSU, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可確保介電質基板與導電層之間的密著性之靜電吸盤。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：具有載置面之面110之介電質基板100；配設於介電質基板100的內部之加熱器140；配設於在介電質基板100的內部中成為比加熱器140還靠面110側的位置之吸附電極130。加熱器140及吸附電極130都在導體的內部配置有複數個陶瓷粒子CP。加熱器140比吸附電極130厚。在該靜電吸盤10中，配置於加熱器140的內部的陶瓷粒子CP的平均粒徑為配置於吸附電極130的內部的陶瓷粒子CP的平均粒徑的50%以上且150%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:吸附電極</p>  
        <p type="p">140:加熱器</p>  
        <p type="p">CP:陶瓷粒子</p>  
        <p type="p">D1、D2:平均粒徑</p>  
        <p type="p">T1、T2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2158" publication-number="202627008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260316B">C09J7/29</main-classification>  
        <further-classification edition="200601120260316B">C08L63/02</further-classification>  
        <further-classification edition="200601120260316B">B29C65/40</further-classification>  
        <further-classification edition="200601120260316B">B32B27/38</further-classification>  
        <further-classification edition="201901120260316B">B32B7/06</further-classification>  
        <further-classification edition="200601120260316B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山絵梨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新林良太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIBAYASHI, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種具有強固接著力之接合體。 &lt;br/&gt;　　本發明係關於將2個以上的基材藉著接著層進行接合而成的接合體，其中，前述接著層係，將以熱塑性樹脂作為主成分的固體接合劑配置於基材間，並經加熱及加壓而使其熔融者經硬化後所形成者，且下述式(1)為0.25以上且1.0以下者之接合體。 &lt;br/&gt;&lt;img align="absmiddle" height="70px" width="615px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　上述式(1)中，A為前述加壓時之壓力(MPa)，B為在前述加熱時之溫度中之前述固體接合劑的損耗角正切tanδ，且前述加熱時之溫度為前述固體接合劑的玻璃轉移點(Tg)以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2159" publication-number="202626601"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626601.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140363</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C309/42</main-classification>  
        <further-classification edition="200601120260401B">C07C309/43</further-classification>  
        <further-classification edition="200601120260401B">C07C309/73</further-classification>  
        <further-classification edition="200601120260401B">C07C381/00</further-classification>  
        <further-classification edition="200601120260401B">C07D327/08</further-classification>  
        <further-classification edition="200601120260401B">C07D333/76</further-classification>  
        <further-classification edition="200601120260401B">C09K3/00</further-classification>  
        <further-classification edition="200601120260401B">C08F212/14</further-classification>  
        <further-classification edition="200601120260401B">C08F212/32</further-classification>  
        <further-classification edition="200601120260401B">C08F220/38</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且LWR、CDU、EL、DOF等微影性能優良之化學增幅阻劑組成物中使用之鋶鹽型單體、含有來自該鋶鹽型單體之重複單元之聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。 &lt;br/&gt;本發明之解決手段係下式(A)表示之鋶鹽型單體。 &lt;br/&gt;&lt;img align="absmiddle" height="227px" width="615px" file="ed10521.JPG" alt="ed10521.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sulfonium salt monomer consists of a sulfonium cation having pentafluorosulfanyl and hydrocarbyloxycarbonyl groups and an aromatic sulfonic acid anion having a polymerizable group. A resist composition comprising a polymer comprising repeat units derived from the monomer exhibits a high solvent solubility, high sensitivity and high contrast and forms a small-size pattern having satisfactory lithography properties such as LWR, CDU, EL and DOF. &lt;br/&gt;&lt;img align="absmiddle" height="233px" width="636px" file="ed10522.JPG" alt="ed10522.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2160" publication-number="202626814"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626814.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140408</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水系二次電池電極用黏合劑組成物及其製造方法、非水系二次電池電極用組成物、非水系二次電池電極以及非水系二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C08F220/56</main-classification>  
        <further-classification edition="200601120260320B">C08F220/18</further-classification>  
        <further-classification edition="200601120260320B">C09D123/32</further-classification>  
        <further-classification edition="200601120260320B">C09J123/32</further-classification>  
        <further-classification edition="200601120260320B">H01M4/62</further-classification>  
        <further-classification edition="201001120260320B">H01M10/0569</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城崎丈雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIZAKI, TAKEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮下夏己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASHITA, NATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之非水系二次電池電極用黏合劑組成物係含有水溶性乙烯基聚合物者，該水溶性乙烯基聚合物包含：來自乙烯基單體（A）之構成單元（a），上述乙烯基單體（A）具有酸成分；來自乙烯基單體（B）之構成單元（b），上述乙烯基單體（B）對25℃之水100 g之溶解度為8 g以上300 g以下；及來自乙烯基單體（C）之構成單元（c），上述乙烯基單體（C）對25℃之水100 g之溶解度為1 g以上且未達8 g；且上述來自乙烯基單體（C）之構成單元（c）之含有比率相對於上述水溶性乙烯基聚合物之總單體單元為5莫耳%以上80莫耳%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2161" publication-number="202627418"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627418.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140409</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物件定位系統及物件定位方法</chinese-title>  
        <english-title>OBJECT LOCALIZATION SYSTEM AND METHOD FOR OBJECT LOCALIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G01C11/08</main-classification>  
        <further-classification edition="201701120251103B">G06T7/13</further-classification>  
        <further-classification edition="202401120251103B">G06T3/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許純寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHUEN-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIUN-SHIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種物件定位系統，包括一處理裝置、一感知相機以及一記憶體。所述感知相機耦接於所述處理裝置並安裝於一自走式裝置上，以生成影像幀。所述處理裝置執行存於記憶體中的電腦可讀程式碼，用以：生成影像幀中實體的遮罩並利用實例分割模型判定其類別；將該遮罩投影至全域座標系的鳥瞰圖平面以生成投影遮罩；辨識相對於感知相機的投影遮罩之前側邊緣；確定對應於該前側邊緣的參考位置；以及基於該參考位置與實體類別，在鳥瞰圖平面上生成實體的測量位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object localization system including a processing device, a perception camera, and a memory is provided. The perception camera couples to the processing device and is mounted on a self-propelled apparatus, wherein the perception camera is configured to generate an image frame. The processing device executes a computer-readable code included in the memory to: generate a mask of an entity within the image frame and determine a category of the entity using an instance segmentation model; project the mask onto a bird-eye-view (BEV) plane of a global coordinate system to generate a projected mask; identify a front-facing edge of the projected mask relative to the perception camera; determine a reference location corresponding to the front-facing edge; and generate a measured location of the entity on the BEV plane based on the reference location and the category of the entity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:自走式裝置</p>  
        <p type="p">12,14,16,18:感知相機</p>  
        <p type="p">22,24,26,28:實體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2162" publication-number="202627145"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627145.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜沉積裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C14/56</main-classification>  
        <further-classification edition="200601120260302B">C23C14/22</further-classification>  
        <further-classification edition="200601120260302B">C23C14/35</further-classification>  
        <further-classification edition="200601120260302B">C23C14/50</further-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李兆晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連增迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　狄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　身健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHENJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇宜龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子琛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王世成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旭彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種薄膜沉積裝置，該裝置的可移動邊緣環組件包含：環組件，其包括屏蔽環，屏蔽環具有軸向延伸的屏蔽筒；升降裝置，其與環組件電連接，升降裝置用於驅動環組件上下移動，使其在工藝位置和傳片位置間移動；環組件位於工藝位置時屏蔽筒環繞基片，以對屏蔽筒徑向內外電磁屏蔽；環組件位於傳片位置時遠離基片，使基片可從傳片口傳輸。其優點是：該裝置的可移動邊緣環組件僅通過升降裝置就可實現環組件的升降，無需基座和基片發生移動，減少了環組件升降過程中的不穩定因素，同時其通過屏蔽環在基片上方形成穩定的射頻電場環境。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">W:基片</p>  
        <p type="p">10:處理腔</p>  
        <p type="p">11:傳片口</p>  
        <p type="p">20:靶材</p>  
        <p type="p">30:基座組件</p>  
        <p type="p">31:基座</p>  
        <p type="p">32:支撐座</p>  
        <p type="p">33:邊緣環組件</p>  
        <p type="p">331:環組件</p>  
        <p type="p">332:升降裝置</p>  
        <p type="p">340:內襯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2163" publication-number="202628490"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628490.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射頻發生器、半導體處理設備及使用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H05H1/46</main-classification>  
        <further-classification edition="200601120251201B">H05H1/36</further-classification>  
        <further-classification edition="200601120251201B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商南昌中微半導體設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANCHANG ADVANCED MIRCO-FABRICATION EQUIPMENT INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王亞軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種射頻發生器、半導體處理設備及使用方法，所述射頻發生器，包括：電容器；高壓電源，其正極與電容器的第一極板連接，其負極與電容器的第二極板連接，其用於對電容器充電；電容器充電完成後輸出直流電壓訊號；第一開關，其正極與負載連接，其負極與第二極板連接；第一開關以預設頻率進行斷開和閉合，以將直流電壓訊號變換為第一高頻高壓脈衝訊號並施加至負載；第一二極體，其正極與第一開關和負載的連接線連接，其負極連接第一電位接點；第一二極體用於在第一開關斷開時釋放連接線上產生的第一反向電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:負載</p>  
        <p type="p">101:連接線</p>  
        <p type="p">110:電容器</p>  
        <p type="p">1101:第一極板</p>  
        <p type="p">1102:第二極板</p>  
        <p type="p">120:高壓電源</p>  
        <p type="p">A:第一電位接點</p>  
        <p type="p">D1:第一二極體</p>  
        <p type="p">K1:第一開關</p>  
        <p type="p">R1:第一限流電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2164" publication-number="202628875"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628875.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體供給裝置及成膜裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅稼昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳丹瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　世平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種氣體供給裝置及成膜裝置，氣體供給裝置包括：依次交替且間隔設置的第一源氣孔和第二源氣孔。第一源氣孔與第二源氣孔分別對應向反應腔內通入第一源氣體和第二源氣體。第一源氣體中的主原料氣體分子的分子量小於第二源氣體中的主原料氣體分子的分子量。第二出氣孔組包括若干個沿周向間隔設置的出氣孔區，出氣孔區設置在第一出氣孔組中最週邊的第一源氣孔周圍的至少部分區域；出氣孔區中出氣孔的徑向孔徑小於第一源氣孔的孔徑；出氣孔區用於向反應腔內通入吹掃氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:保護板</p>  
        <p type="p">400:第一中心源氣孔</p>  
        <p type="p">401:第一源氣孔</p>  
        <p type="p">402:第二中心源氣孔</p>  
        <p type="p">403:第二源氣孔</p>  
        <p type="p">4041:出氣孔</p>  
        <p type="p">R11:半徑</p>  
        <p type="p">R12:半徑</p>  
        <p type="p">R13:半徑</p>  
        <p type="p">R14:半徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2165" publication-number="202628894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理設備及其固態前驅體輸送系統和輸送方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/30</main-classification>  
        <further-classification edition="200601120260302B">C23C16/448</further-classification>  
        <further-classification edition="200601120260302B">C23C16/52</further-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊宇峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱泉松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫家鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體處理設備及其固態前驅體輸送系統和輸送方法，通過三段式充壓將氣體前驅體和惰性氣體混合，可以精確控制氣態前驅體的輸送量，利用惰性氣體稀釋氣態前驅體，能夠有效防止氣態前驅體發生冷凝，還能夠大幅降低加熱箱的溫度，防止位於加熱箱中的閥門和壓力計等器件遭到高溫損壞，同時防止氣態前驅體在高溫下腐蝕管道內壁造成顆粒污染。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理腔</p>  
        <p type="p">2:固態前驅體輸送系統</p>  
        <p type="p">21:固態前驅體源</p>  
        <p type="p">22:惰性氣體源</p>  
        <p type="p">23:控溫模組</p>  
        <p type="p">231:加熱箱</p>  
        <p type="p">2310:第一加熱裝置</p>  
        <p type="p">2311:第三加熱裝置</p>  
        <p type="p">2312:第二加熱裝置</p>  
        <p type="p">2313:氣體流量計</p>  
        <p type="p">2314:氣動閥</p>  
        <p type="p">232:儲氣罐</p>  
        <p type="p">233:第一管路</p>  
        <p type="p">234:第一閥門</p>  
        <p type="p">235:第二管路</p>  
        <p type="p">236:第二閥門</p>  
        <p type="p">237:第三管路</p>  
        <p type="p">238:第三閥門</p>  
        <p type="p">239:壓力計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2166" publication-number="202628187"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628187.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿約束環及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260114B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　如彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, RUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬越</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電漿約束環及電漿處理裝置，其中，電漿約束環包括：第一約束環本體；若干個第一氣體通道，貫穿所述第一約束環本體的厚度，且沿所述第一約束環本體的徑向排佈；其中，所述第一約束環本體的材料包括P型矽。所述電漿約束環能夠更好地約束電漿，減少電漿洩露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電漿約束環</p>  
        <p type="p">101:第一約束環本體</p>  
        <p type="p">102:第一氣體通道</p>  
        <p type="p">103:電漿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2167" publication-number="202628466"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628466.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140437</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於增強型長程傳輸的保護</chinese-title>  
        <english-title>PROTECTION FOR ENHANCED LONG RANGE TRANSMISSIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260326B">H04W74/0816</main-classification>  
        <further-classification edition="200901120260326B">H04W84/12</further-classification>  
        <further-classification edition="200901120260326B">H04W28/18</further-classification>  
        <further-classification edition="200901120260326B">H04W28/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTERJADHI, ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽里恩　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　宇韓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於增強型長程(enhanced long range,ELR)傳輸的保護的方法、組件、裝置、及系統。更具體而言，態樣係關於用於組態保護ELR RTS/CTS訊框免受干擾的ELR實體層協定資料單元(physical layer protocol data unit, PPDU)的請求發送(request to send, RTS)及清除發送(clear to send, CTS)傳訊交換。例如，一第一無線裝置可經由一第一訊框指示考慮一ELR訊框的一完整持續時間的一經修改網路分配向量(network allocation vector, NAV)逾時持續時間。在一些實例中，該經修改NAV逾時持續時間可經計算以解決該ELR訊框相對於非ELR訊框的資料速率上的一差異。例如，該第一無線裝置可在一ELR RTS/CTS訊框之前傳輸一第一訊框，且該第一訊框可經由一持續時間欄位指示係根據該ELR RTS/CTS訊框來計算的該經修改NAV逾時持續時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, components, devices and systems for protection for enhanced long range (ELR) transmissions. Aspects more specifically relate request to send (RTS) and clear to send (CTS) signaling exchanges for configuration of an ELR physical layer protocol data unit (PPDU) that protects ELR RTS/CTS frames from interference. For example, a first wireless device may indicate, via a first frame, a modified network allocation vector (NAV) timeout duration that accounts for a full duration of an ELR frame. In some examples, the modified NAV timeout duration may be calculated to account for a difference in data rate of the ELR frame relative to non-ELR frames. For example, the first wireless device may transmit a first frame prior to an ELR RTS/CTS frame, and the first frame may indicate, via a duration field, the modified NAV timeout duration that is calculated in accordance with the ELR RTS/CTS frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:時序圖</p>  
        <p type="p">602:AP</p>  
        <p type="p">604:ELR STA</p>  
        <p type="p">606:非徵求CTS訊框</p>  
        <p type="p">608:RTS訊框</p>  
        <p type="p">610:ELR CTS訊框</p>  
        <p type="p">612:資料</p>  
        <p type="p">614:NAV逾時持續時間</p>  
        <p type="p">616:經更新NAV逾時持續時間</p>  
        <p type="p">618:持續時間欄位</p>  
        <p type="p">620:接收器位址(RA)欄位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2168" publication-number="202626206"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626206.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140446</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成膜裝置</chinese-title>  
        <english-title>DEPOSITION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B05B3/00</main-classification>  
        <further-classification edition="200601120260318B">B05B1/06</further-classification>  
        <further-classification edition="200601120260318B">B05B17/06</further-classification>  
        <further-classification edition="200601120260318B">B05D1/02</further-classification>  
        <further-classification edition="200601120260318B">B05D1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMEIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平松孝浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAMATSU, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩尾有佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤洸聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTOH, KOHSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西優生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的目的在於提供一種實現了藉由霧供給配管搬送的原料溶液霧的品質及使用效率的提升之成膜裝置。此外，在本揭示的霧成膜裝置(51)中，超音波霧化器(1)係藉由搬送氣體(G4)將原料溶液霧(MT)經由霧供給配管(11)朝向噴嘴(7)的霧供給口(15)搬送。霧供給配管(11)的霧供給方向(D1)係含有兩個部分供給方向(D11及D12)。兩個部分供給方向(D11及D12)各自的仰角為正的值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure has an object of providing a deposition apparatus designed to improve the quality and the use efficiency of a source-solution mist transported through a mist supply pipe. In a mist deposition apparatus (51) of the present disclosure, an ultrasonic atomizer (1) transports a source-solution mist (MT) toward a mist supply port (15) of a nozzle (7) through a mist supply pipe (11) using a transport gas (G4). A mist supply direction (D1) of the mist supply pipe (11) includes two partial supply directions (D11 and D12). An elevation angle of each of the two partial supply directions (D11 and D12) is of a positive value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:超音波霧化器</p>  
        <p type="p">4:氣體供給部</p>  
        <p type="p">7:噴嘴</p>  
        <p type="p">11:霧供給配管</p>  
        <p type="p">15:霧供給口</p>  
        <p type="p">17:霧噴出口</p>  
        <p type="p">21:基材</p>  
        <p type="p">51:霧成膜裝置</p>  
        <p type="p">D1:霧供給方向</p>  
        <p type="p">D11,D12:部分供給方向</p>  
        <p type="p">G4:搬送氣體</p>  
        <p type="p">MT:原料溶液霧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2169" publication-number="202627492"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627492.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針器及其測量方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G01R1/067</main-classification>  
        <further-classification edition="202001120260325B">G01R31/26</further-classification>  
        <further-classification edition="200601120260325B">G01R31/28</further-classification>  
        <further-classification edition="202601120260325B">H10P74/00</further-classification>  
        <further-classification edition="202601120260325B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO SEIMITSU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西河秀平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田倉直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKURA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶浩幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一邊穩定地保持工件，一邊確保針測的精度。 &lt;br/&gt;探針器1具有於上表面形成有使吸附用之負壓作用之吸附槽之夾具。探針器之測量方法具備：將測量對象之工件載置於夾具之上表面之步驟；根據工件之特性或狀態來調整由負壓所引起之吸附力之步驟；以及使探針接觸於工件以進行測量之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">24:夾具</p>  
        <p type="p">50:本體</p>  
        <p type="p">52:載置面</p>  
        <p type="p">54:吸附槽</p>  
        <p type="p">56:連接端口</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2170" publication-number="202627854"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627854.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140471</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析裝置、狀態參照裝置、及由該等裝置執行之分析方法、參照方法、分析程式、參照程式及安全風險判定系統</chinese-title>  
        <english-title>ANALYSIS DEVICE, STATUS REFERENCE DEVICE, AND ANALYSIS METHOD, REFERENCE METHOD, ANALYSIS PROGRAM, REFERENCE PROGRAM AND SECURITY RISK JUDGMENT SYSTEM EXECUTED BY THESE DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260318B">G06F21/62</main-classification>  
        <further-classification edition="202201120260318B">G06F3/0481</further-classification>  
        <further-classification edition="201901120260318B">G06F16/957</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本網路倡議股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNET INITIATIVE JAPAN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水谷雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTANI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川晋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西康介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, KOHSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡冠彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明乃揭示一種分析裝置，具有一分析對象取得部，其取得分析對象網站的網站URL；一分析執行部，其對網站URL所發布之網站內的1個或多個頁面進行分析，提取由1個或多個頁面所發行之Cookie、所設定之網頁儲存器、或所發生之外部通訊的外部通訊URL；及一分析項目登錄部，其使網站URL與由網站內的頁面所發行之Cookie、網頁儲存器、或外部通訊URL對應，並以可藉由後述之利用服務識別裝置取得的方式登錄，藉此可提取由網站URL所發布之網站內的1個或多個頁面所發行之Cookie、所設定之網頁儲存器、或所發生之外部通訊的外部通訊URL，並以可由利用服務識別裝置針對每個網站取得該等資料的方式登錄。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention discloses an analysis comprising: an analysis target acquisition unit that acquires the website URL of the analysis target website; an analysis execution unit that analyzes one or more pages within the website published by the website URL, extracting cookies issued by one or more pages, set web storage, or external communication URLs of external communications occurring; and an analysis item registration unit that maps the website URL to cookies, web storage, or external communication URLs issued by pages within the website, and registers them in a manner obtainable by a service identification device as described later. This allows for the extraction of cookies issued by one or more pages within the website published by the website URL, set web storage, or external communication URLs of external communications occurring, and registration in a manner obtainable by a service identification device for each website.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:分析裝置</p>  
        <p type="p">11:分析對象取得部</p>  
        <p type="p">12:分析執行部</p>  
        <p type="p">13:分析項目登錄部</p>  
        <p type="p">14:狀態登錄部</p>  
        <p type="p">30:分析對象伺服器</p>  
        <p type="p">40:分析項目資料庫</p>  
        <p type="p">100:代理裝置</p>  
        <p type="p">121:網站存取部</p>  
        <p type="p">122:分析項目提取部</p>  
        <p type="p">123:腳本執行部</p>  
        <p type="p">124:連結提取部</p>  
        <p type="p">125:狀態提取部</p>  
        <p type="p">200:狀態資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2171" publication-number="202627855"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627855.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視窗生成裝置、客戶終端、視窗生成系統、視窗生成方法及視窗生成程式</chinese-title>  
        <english-title>WINDOW GENERATION DEVICE, CLIENT TERMINAL, WINDOW GENERATION SYSTEM, WINDOW GENERATION METHOD, AND WINDOW GENERATION PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260318B">G06F21/62</main-classification>  
        <further-classification edition="202201120260318B">G06F3/0481</further-classification>  
        <further-classification edition="201901120260318B">G06F16/957</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本網路倡議股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNET INITIATIVE JAPAN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水谷雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTANI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川晋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西康介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, KOHSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡冠彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種視窗生成裝置，其在從客戶終端90指定WEB頁面的URL並發送請求時，將回應回傳至客戶終端90而使其執行視窗生成功能單元10A，視窗生成功能單元10A具備：一視窗生成部12，其生成包含用戶可輸入之狀態確認介面的視窗；一視窗顯示部13，其將視窗顯示於客戶終端90，其中，視窗係在從客戶終端90指定WEB頁面的URL並向伺服器50發送請求時，顯示於客戶終端90的顯示器91；及一存取可否判定部14，其根據由客戶終端90的用戶輸入至狀態確認介面之狀態，判定是否允許對Web頁面進行存取。藉此，根據透過視窗中包含之狀態確認介面由客戶終端90的用戶所輸入之狀態，可在客戶終端90對後續的頁面進行存取之前過濾來自客戶終端90的存取。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A window generation device is provided, which returns a response to the client terminal 90 to execute a window generation function unit 10A when a request is sent from a client terminal 90 specifying the URL of a web page, wherein the window generation function unit 10A comprise a window generation unit 12 that generates a window including a status check interface that can be input by the user, and a window display unit 13 that displays the window on the client terminal 90, the window being displayed on a display 91 of the client terminal 90 when the client terminal 90 sends a request to a server 50 specifying the URL of the web page, and an access permission determination unit 14 that determines whether access to the web page is permitted based on the status input by the user of the client terminal 90 into the status check interface. This makes it possible to filter access from the client terminal 90 before the client terminal 90 accesses a subsequent page, based on the status input by the user of the client terminal 90 via the status check interface included in the window.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:視窗生成裝置</p>  
        <p type="p">10A:視窗生成功能單元</p>  
        <p type="p">11:所在地自動判定部</p>  
        <p type="p">12:視窗生成部</p>  
        <p type="p">13:視窗顯示部</p>  
        <p type="p">13:存取可否判定部</p>  
        <p type="p">15:生成規則管理部</p>  
        <p type="p">16:過濾規則管理部</p>  
        <p type="p">20:地理資訊資料庫</p>  
        <p type="p">30:過濾規則資料庫</p>  
        <p type="p">40:生成規則資料庫</p>  
        <p type="p">50:伺服器</p>  
        <p type="p">90:客戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2172" publication-number="202627512"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627512.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140497</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池診斷裝置及其方法</chinese-title>  
        <english-title>BATTERY DIAGNOSTIC DEVICE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260317B">G01R31/378</main-classification>  
        <further-classification edition="201901120260317B">G01R31/396</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪政杓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, JUNG PYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露內容的實施例的電池診斷裝置可包括連接至電池芯的第一子電路、連接至電池芯及第一子電路的第二子電路、連接至第一子電路及第二子電路的分流電阻、以及處理器，且處理器可識別當第一子電路操作時與分流電阻相關的第一電性資料、識別當第二子電路操作時與分流電阻相關的第二電性資料、基於第一電性資料及第二電性資料識別電池芯的直流內阻（DC-IR）、以及基於直流內阻識別電池芯的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery diagnostic device according to an embodiment of the present disclosure may include a first sub-circuit connected to a battery cell, a second sub-circuit connected to the battery cell and the first sub-circuit, a shunt resistor connected to the first sub-circuit and the second sub-circuit, and a processor, and the processor may identify first electrical data associated with the shunt resistor while the first sub-circuit is operating, identify second electrical data associated with the shunt resistor while the second sub-circuit is operating, identify a direct current-internal resistance (DC-IR) of the battery cell based on the first electrical data and the second electrical data, and identify a state of the battery cell based on the DC-IR.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電池診斷裝置</p>  
        <p type="p">210:處理器</p>  
        <p type="p">220:第一子電路</p>  
        <p type="p">230:第二子電路</p>  
        <p type="p">240:電阻器</p>  
        <p type="p">250:積體電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2173" publication-number="202629024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>  
        <english-title>ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10W72/20</main-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W76/63</further-classification>  
        <further-classification edition="202601120260401B">H10W76/136</further-classification>  
        <further-classification edition="202601120260401B">H10W76/01</further-classification>  
        <further-classification edition="202601120260401B">H10W90/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊基業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KI YEUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔恩彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, EUN BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實例中，一種電子裝置包含：基板，所述基板包含第一側、與所述第一側相對的第二側、介電結構和導電結構；第一電子組件，所述第一電子組件位於所述基板的所述第一側之上並耦合到所述導電結構；囊封物，所述囊封物位於所述基板的所述第一側之上並覆蓋所述第一電子組件的側面，其中所述囊封物具有背對所述基板的第一側和位於所述囊封物的所述第一側中的空腔；第二電子組件，所述第二電子組件位於所述第一電子組件之上且位於所述囊封物之上；垂直互連件，所述垂直互連件位於所述囊封物中並耦合到所述導電結構；以及連接器，所述連接器耦合到所述垂直互連件和所述第二電子組件，其中所述連接器位於所述空腔中。本文中還公開了其它實例和相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, an electronic device comprises a substrate comprising a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure, a first electronic component over the first side of the substrate and coupled to the conductive structure, an encapsulant over the first side of the substrate and covering a lateral side of the first electronic component, wherein the encapsulant has a first side facing away from the substrate, and a cavity in the first side of the encapsulant, a second electronic component over the first electronic component and over the encapsulant, a vertical interconnect in the encapsulant and coupled to the conductive structure, and a connector coupled to the vertical interconnect and the second electronic component, wherein the connector is in the cavity. Other examples and related methods are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:電子組件</p>  
        <p type="p">110a:電子組件</p>  
        <p type="p">110b:電子組件</p>  
        <p type="p">113:接觸件/接觸墊</p>  
        <p type="p">113a:接觸件/接觸墊</p>  
        <p type="p">113b:接觸件</p>  
        <p type="p">114:連接器</p>  
        <p type="p">114a:連接器</p>  
        <p type="p">114b:第二側</p>  
        <p type="p">120:基板</p>  
        <p type="p">121:第一側</p>  
        <p type="p">122:第二側</p>  
        <p type="p">123:介電結構</p>  
        <p type="p">124:導電結構</p>  
        <p type="p">124a:向內端子</p>  
        <p type="p">124b:向外端子</p>  
        <p type="p">130:垂直互連件</p>  
        <p type="p">140:囊封物</p>  
        <p type="p">141:第一側</p>  
        <p type="p">141a:上部水平部分</p>  
        <p type="p">142:空腔</p>  
        <p type="p">142a:垂直部分</p>  
        <p type="p">142b:下部水平部分</p>  
        <p type="p">150:外部互連件</p>  
        <p type="p">160:底部填充材料</p>  
        <p type="p">170:底部填充材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2174" publication-number="202627049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140516</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>爐溫控制裝置、爐溫控制方法以及焦炭的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C10B21/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加瀬寛人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASE, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武部嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEBE, SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本佳也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, YOSHINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島本拓幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMAMOTO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊田祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMADA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大後晃太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHSEDO, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種爐溫控制裝置包括儲存部及控制部，儲存部儲存第一模型及第二模型中的至少一者。控制部取得操作資訊，操作資訊包含多個燃燒室的溫度量測值、多個碳化室的溫度量測值、對於多個燃燒室的供給熱量的實際值、以及對於多個碳化室的煤炭填充狀況的實際值及預定值。控制部將操作資訊包含的資訊輸入至個別的第一模型，針對多個燃燒室的每個燃燒室，計算燃燒室的溫度預測值，或者，將操作資訊包含的資訊輸入至個別的第二模型，針對多個碳化室的每個碳化室，計算碳化室的溫度預測值。控制部基於燃燒室的目標溫度與計算出的燃燒室的溫度預測值，或者，基於碳化室的目標溫度與計算出的碳化室的溫度預測值，計算供給至多個燃燒室的每個燃燒室的熱量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:爐溫控制系統</p>  
        <p type="p">10:焦炭爐</p>  
        <p type="p">11-1~11-N:燃燒室</p>  
        <p type="p">12-1~12-(N-1):碳化室</p>  
        <p type="p">13-1~13-N:第一溫度計</p>  
        <p type="p">14-1~14-(N-1):第二溫度計</p>  
        <p type="p">15:調整閥</p>  
        <p type="p">16-1~16-(N-1):個別調整閥</p>  
        <p type="p">17:氣體主管</p>  
        <p type="p">18-1~18-(N-1):氣體支管</p>  
        <p type="p">20:爐溫控制裝置</p>  
        <p type="p">30:控制終端</p>  
        <p type="p">G:燃料氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2175" publication-number="202626293"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626293.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物品搬運系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B25J5/00</main-classification>  
        <further-classification edition="200601120260331B">B25J9/16</further-classification>  
        <further-classification edition="200601120260331B">B25J13/08</further-classification>  
        <further-classification edition="200601120260331B">B65G1/00</further-classification>  
        <further-classification edition="200601120260331B">B65G1/04</further-classification>  
        <further-classification edition="200601120260331B">B65G1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松原瑶太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSUBARA, YOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木忠則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TADANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口隼司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, SHUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物品搬運系統，為了有效地保護被搬入搬入場所的物品，以避免於搬運途中掉落造成破損之下，並搬運至搬出場所，物品搬運系統包括機器人、支撐座移動裝置及控制裝置。機器人被設置於被設置面，透過被組裝於前端的手部，拾取被搬入搬入場所的物品。支撐座移動裝置具有支撐座，可以相對於被設置面移動。控制裝置控制機器人及支撐座移動裝置，讓物品從搬入場所移動至搬出場所。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機器人</p>  
        <p type="p">2:支撐座升降裝置</p>  
        <p type="p">2a:支撐面</p>  
        <p type="p">3:控制裝置</p>  
        <p type="p">4:三維影像感測器</p>  
        <p type="p">11:基座</p>  
        <p type="p">12:旋轉臂</p>  
        <p type="p">13:第一臂</p>  
        <p type="p">14:第二臂</p>  
        <p type="p">15:手腕單元</p>  
        <p type="p">16:法蘭</p>  
        <p type="p">17:手部</p>  
        <p type="p">21:支撐座</p>  
        <p type="p">22:基座</p>  
        <p type="p">25:滑座</p>  
        <p type="p">26:馬達</p>  
        <p type="p">28:壁面</p>  
        <p type="p">100:物品搬運系統</p>  
        <p type="p">200:平托盤</p>  
        <p type="p">300:滾筒輸送機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2176" publication-number="202627786"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627786.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁屏之驅動方法及電磁輸入裝置</chinese-title>  
        <english-title>METHOD FOR DRIVING ELECTROMAGNETIC SCREEN AND ELECTROMAGNETIC INPUT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260309B">G06F3/046</main-classification>  
        <further-classification edition="201301120260309B">G06F3/0354</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商敦泰電子（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOCALTECH ELECTRONICS (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣新喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XIN-XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王天宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TIAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斯境</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SI-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾昭松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, ZHAO-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯偉辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種電磁屏之驅動方法及電磁輸入裝置，電磁屏包括A個輸入區域，每個輸入區域包括多條平行之發射線圈，A為大於等於1之正整數；驅動方法包括：於當前驅動週期，向j條第一發射線圈傳輸第一驅動訊號，及k條第二發射線圈傳輸第二驅動訊號，j與k為大於等於1之正整數，第一發射線圈與第二發射線圈之其中一同側端串聯；其中，第一驅動訊號與第二驅動訊號之相位相差180度，以使電磁屏之目的地區域形成疊加磁場對電磁筆進行充能；控制除第一發射線圈及第二發射線圈之外之其餘發射線圈處於浮空狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for driving electromagnetic screen and electromagnetic input device. The electromagnetic screen includes A input zones, each containing multiple parallel transmitter coils, where A is a positive integer greater than or equal to 1. The method includes：during the current drive cycle, transmit the first drive signal to j first transmit coils and the second drive signal to k second transmit coils, where j and k are positive integers greater than or equal to 1. The first transmit coils and the second transmit coils are connected in series on one side. The first drive signal and the second drive signal are phase-shifted by 180 degrees to create a superimposed magnetic field in the target area of the electromagnetic shield, thereby charging the electromagnetic pen. Keep all other transmission coils except the first and second transmission coils in a floating state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21~S22:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2177" publication-number="202626580"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626580.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋶鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>SULFONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C63/70</main-classification>  
        <further-classification edition="200601120260401B">C07C65/05</further-classification>  
        <further-classification edition="200601120260401B">C07C65/21</further-classification>  
        <further-classification edition="200601120260401B">C07C69/80</further-classification>  
        <further-classification edition="200601120260401B">C07C323/62</further-classification>  
        <further-classification edition="200601120260401B">C07C381/00</further-classification>  
        <further-classification edition="200601120260401B">C07D307/12</further-classification>  
        <further-classification edition="200601120260401B">C07D327/08</further-classification>  
        <further-classification edition="200601120260401B">C07D333/76</further-classification>  
        <further-classification edition="200601120260401B">C09K3/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供在使用能量射線之光微影中，為高感度，解析度優良，改善了LWR、CDU、EL、DOF等微影性能，又，可抑制阻劑圖案之崩塌的化學增幅阻劑組成物中使用之鎓鹽、化學增幅阻劑組成物及圖案形成方法。 &lt;br/&gt;本發明之解決手段係由下式(1A)表示之鋶陽離子及下式(1B)表示之芳香族羧酸陰離子構成之鋶鹽。 &lt;br/&gt;&lt;img align="absmiddle" height="365px" width="608px" file="ed10442.JPG" alt="ed10442.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sulfonium salt consisting of a sulfonium cation having the following formula (1A) and an aromatic carboxylate anion having the following formula (1B). &lt;br/&gt;&lt;img align="absmiddle" height="392px" width="586px" file="ed10443.JPG" alt="ed10443.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2178" publication-number="202626290"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626290.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作業工具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B25F5/02</main-classification>  
        <further-classification edition="200601120260325B">B24B23/02</further-classification>  
        <further-classification edition="200601120260325B">H03K17/96</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商歐姆龍股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩田直之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWATA, NAOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井昭宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原拓未</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIHARA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種作業工具，能夠在檢測使用者的手指與把持部接觸的情況的控制部配置於遠離把持部的位置的結構中，判別對把持部及/或把持部以外的部位的觸摸。作業工具10包括主體部11、把持部12、電極12a、電線16、電線17、檢測電路15、觸摸控制基板14。電線16與把持部12的電極12a連接。檢測電路15經由電線16而與電極12a連接，檢測對把持部12的觸摸。電線17在主體部11的規定位置沿著電線16配置，且具有不與電極12a連接的釋放端17a。檢測電路15與電線17連接，檢測對主體部11的規定位置的觸摸。觸摸控制基板14基於檢測電路15的檢測結果，進行對把持部12的觸摸的判定及對主體部11的規定位置的觸摸的判定中的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:作業工具</p>  
        <p type="p">11:主體部</p>  
        <p type="p">12:把持部</p>  
        <p type="p">12a:電極</p>  
        <p type="p">13:磨石(前端工具)</p>  
        <p type="p">14:觸摸控制基板(控制部)</p>  
        <p type="p">15:檢測電路(第一檢測電路、第二檢測電路)</p>  
        <p type="p">16:電線(第一電氣構件)</p>  
        <p type="p">17:電線(第二電氣構件)</p>  
        <p type="p">17a:釋放端</p>  
        <p type="p">18:驅動部</p>  
        <p type="p">18a:觸發開關</p>  
        <p type="p">19:電源部</p>  
        <p type="p">A、B:手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2179" publication-number="202628938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140599</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>缺陷圖像生成</chinese-title>  
        <english-title>DEFECT IMAGE GENERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P74/00</main-classification>  
        <further-classification edition="200601120260401B">G01N21/88</further-classification>  
        <further-classification edition="202001120260401B">G06F30/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛世計</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, SHIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　鶴璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HEXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　阿比納夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, ABHINAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，包括以下步驟：根據基板缺陷的使用者草圖以及與基板缺陷相關聯的文字描述，來識別基板缺陷的輸出圖像。該方法進一步包括以下步驟：根據使用者輸入來更新輸出圖像，以生成更新的輸出圖像。該方法進一步包括以下步驟：根據更新的輸出圖像，促使藉由基板處理系統執行與基板處理相關聯的修正動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes identifying an output image of a substrate defect based on a user sketch of the substrate defect and a text description associated with the substrate defect. The method further includes updating the output image based on user input to generate an updated output image. The method further includes causing, based on the updated output image, performance of a corrective action associated with substrate processing via a substrate processing system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400B:方法</p>  
        <p type="p">420:方塊</p>  
        <p type="p">422:方塊</p>  
        <p type="p">424:方塊</p>  
        <p type="p">426:方塊</p>  
        <p type="p">428:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2180" publication-number="202626337"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626337.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140600</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子構件貼附用黏著片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">B32B3/30</main-classification>  
        <further-classification edition="201901120260319B">B32B7/06</further-classification>  
        <further-classification edition="200601120260319B">B32B27/00</further-classification>  
        <further-classification edition="200601120260319B">B32B27/30</further-classification>  
        <further-classification edition="201801120260319B">C09J7/24</further-classification>  
        <further-classification edition="200601120260319B">C09J4/02</further-classification>  
        <further-classification edition="202601120260319B">H10P54/92</further-classification>  
        <further-classification edition="202601120260319B">H10P72/70</further-classification>  
        <further-classification edition="202601120260319B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末吉晴樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEYOSHI, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西嶋健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIJIMA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大西郷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONISHI, GO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>升本睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUMOTO, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可改變固持力之新結構之黏著片。一種電子構件貼附用黏著片，其具備：具有凹凸面之基材、及以容納形成於基材凹凸面上之複數個凸部之方式接觸於凹凸面而設置的黏著層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:黏著片</p>  
        <p type="p">110:基材</p>  
        <p type="p">120:黏著層</p>  
        <p type="p">130:非黏著部</p>  
        <p type="p">150:剝離層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2181" publication-number="202627359"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627359.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>除濕裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260325B">F24F1/0323</main-classification>  
        <further-classification edition="201901120260325B">F24F1/0358</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中裕基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內文香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, AYAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永津衣里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATSU, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>源水和夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENSUI, KAZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">除濕裝置(100)具備本體罩殼(1)，前述本體罩殼(1)具有空氣吸入口與空氣吹出口(4)。在本體罩殼(1)中，在本體罩殼(1)的前後方向上依序配置吸熱器(10)、熱交換器(11)、散熱器(8)及送風機(6)。除濕裝置(100)具有：第1除濕路徑，將從空氣吸入口吸入本體罩殼(1)內的吸入空氣(60)的第1部分(61)透過吸熱器(10)、熱交換器(11)的第1通路(17)及散熱器(8)從空氣吹出口(4)吹出到本體罩殼(1)外；及第2除濕路徑，將吸入空氣(60)的第2部分(62)透過熱交換器(11)的第2通路(18)及散熱器(8)從空氣吹出口(4)吹出到本體罩殼(1)外。第2通路(18)包含：吸熱器側通路，在吸熱器(10)側中從上側朝向下側；及散熱器側通路，在散熱器(8)側中從上側朝向下側。在散熱器側通路的入口開口的上側具備開口面積調節部(130)，前述開口面積調節部(130)抑制吸入空氣(60)的第2部分(62)朝散熱器側通路的流入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本體罩殼</p>  
        <p type="p">4:空氣吹出口</p>  
        <p type="p">5:除濕部</p>  
        <p type="p">6:送風機</p>  
        <p type="p">7:壓縮機</p>  
        <p type="p">8:散熱器</p>  
        <p type="p">8a:上部</p>  
        <p type="p">9:膨脹器</p>  
        <p type="p">10:吸熱器</p>  
        <p type="p">11:熱交換器</p>  
        <p type="p">12a:集水部</p>  
        <p type="p">12b:集水槽</p>  
        <p type="p">15:吸熱器間隙</p>  
        <p type="p">17:第1通路</p>  
        <p type="p">18:第2通路</p>  
        <p type="p">19:散熱器間隙</p>  
        <p type="p">22:前表面部</p>  
        <p type="p">23:後表面部</p>  
        <p type="p">31:百葉片</p>  
        <p type="p">32:馬達</p>  
        <p type="p">33:風扇</p>  
        <p type="p">34:空氣通路</p>  
        <p type="p">61:第1部分</p>  
        <p type="p">62:第2部分</p>  
        <p type="p">68:吸氣口</p>  
        <p type="p">71:第1風路</p>  
        <p type="p">72:第2風路</p>  
        <p type="p">80,83:冷媒配管</p>  
        <p type="p">88:特定部分</p>  
        <p type="p">100:除濕裝置</p>  
        <p type="p">130:開口面積調節部</p>  
        <p type="p">x,y,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2182" publication-number="202626994"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626994.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胺基改質矽酮乳液組成物及纖維處理劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09D183/08</main-classification>  
        <further-classification edition="200601120260401B">C09D183/12</further-classification>  
        <further-classification edition="201801120260401B">C09D7/45</further-classification>  
        <further-classification edition="201801120260401B">C09D7/63</further-classification>  
        <further-classification edition="200601120260401B">C09D5/02</further-classification>  
        <further-classification edition="200601120260401B">D06M13/188</further-classification>  
        <further-classification edition="200601120260401B">D06M13/207</further-classification>  
        <further-classification edition="200601120260401B">D06M15/53</further-classification>  
        <further-classification edition="200601120260401B">D06M15/643</further-classification>  
        <further-classification edition="200601120260401B">D06M15/647</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱嶋優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAJIMA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木俊司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, SHUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種胺基改質矽酮乳液組成物，其含有如下成分：&lt;br/&gt; (A)胺基改質矽酮，其由式(1)表示，&lt;img align="absmiddle" height="95px" width="662px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; [R&lt;sup&gt;1&lt;/sup&gt;為烴基，R&lt;sup&gt;2&lt;/sup&gt;為－R&lt;sup&gt;4&lt;/sup&gt;－(NR&lt;sup&gt;5&lt;/sup&gt;－R&lt;sup&gt;6&lt;/sup&gt;)&lt;sub&gt;f&lt;/sub&gt;－NR&lt;sup&gt;5&lt;/sup&gt;&lt;sub&gt;2&lt;/sub&gt;   (2)&lt;br/&gt; 表示的基團等(R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;為有機基，f為0～2，R&lt;sup&gt;5&lt;/sup&gt;為&lt;br/&gt; －CH&lt;sub&gt;2&lt;/sub&gt;－CH(OH)CH&lt;sub&gt;2&lt;/sub&gt;O－(C&lt;sub&gt;2&lt;/sub&gt;H&lt;sub&gt;4&lt;/sub&gt;O)&lt;sub&gt;g&lt;/sub&gt;－(C&lt;sub&gt;3&lt;/sub&gt;H&lt;sub&gt;6&lt;/sub&gt;O)&lt;sub&gt;h&lt;/sub&gt;－Z  (3)的聚氧伸烷基，Z為氫原子等，g為2～30，h為0～20)，R&lt;sup&gt;3&lt;/sup&gt;為R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、－OCH&lt;sub&gt;3&lt;/sub&gt;等]；&lt;br/&gt; (B)胺基改質矽酮，其由式(4)表示，&lt;img align="absmiddle" height="94px" width="661px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; [R&lt;sup&gt;1&lt;/sup&gt;為烴基，R&lt;sup&gt;7&lt;/sup&gt;為－R&lt;sup&gt;4&lt;/sup&gt;－(NH－R&lt;sup&gt;6&lt;/sup&gt;)&lt;sub&gt;f&lt;/sub&gt;－NH&lt;sub&gt;2&lt;/sub&gt;   (5)&lt;br/&gt; 表示的基團(R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;為有機基，f為0～2)，R&lt;sup&gt;8&lt;/sup&gt;為R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;7&lt;/sup&gt;、－OCH&lt;sub&gt;3&lt;/sub&gt;等]；&lt;br/&gt; (C)非離子性界面活性劑；&lt;br/&gt; (D)陰離子性界面活性劑；&lt;br/&gt; (E)有機酸；及，&lt;br/&gt; (F)水。&lt;br/&gt; 藉此，可提供一種胺基改質矽酮乳液，其穩定性優異且能夠對布料賦予高柔軟性、吸水性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2183" publication-number="202628434"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628434.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光偵測裝置及電子設備</chinese-title>  
        <english-title>LIGHT DETECTION DEVICE AND ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260326B">H04N25/47</main-classification>  
        <further-classification edition="202301120260326B">H04N25/79</further-classification>  
        <further-classification edition="202301120260326B">H04N25/707</further-classification>  
        <further-classification edition="202301120260326B">H04N25/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北野伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITANO, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種裝置，其可包含包括一光電二極體、一對數轉換電路之一部分、一電容器及一緩衝器之一上晶片。一裝置可包含包括一量化器及一減法器之一部分之一下晶片，其中該上晶片在一堆疊方向上堆疊於該下晶片上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device may include an upper chip including a photodiode, a portion of a logarithmic conversion circuit, a capacitor, and a buffer. A device may include a lower chip including a quantizer and a portion of a subtractor, wherein the upper chip is stacked on the lower chip in a stacking direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:固態影像感測器</p>  
        <p type="p">201:光接收晶片</p>  
        <p type="p">202:偵測晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2184" publication-number="202626691"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626691.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140630</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錯合物、方法及製程</chinese-title>  
        <english-title>COMPLEXES, METHOD, AND PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F15/00</main-classification>  
        <further-classification edition="200601120260401B">B01J31/22</further-classification>  
        <further-classification edition="200601120260401B">C07F7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商強生麥特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON MATTHEY PUBLIC LIMITED COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩理　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERRY, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ZA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾特舍夫　羅曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULTYSHEV, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布倫菲得　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOOMFIELD, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈特蘭　道格拉斯　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARTLINE, DOUGLAS ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道格拉斯　山謬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOUGLAS, SAMUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於鉑錯合物，其用作矽氫化反應中之預觸媒或觸媒，且其可使用熱或UV方法活化。本發明進一步係關於產生本發明鉑錯合物之方法及在矽氫化反應中使用本發明鉑錯合物之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to platinum complexes which find use as pre-catalysts or catalysts in hydrosilylation reactions, and which may be activated using thermal or UV methods. The invention further relates to a method of producing the platinum complexes of the invention and methods for using the platinum complexes of the invention in hydrosilylation reactions.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2185" publication-number="202626809"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626809.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及其硬化物、成形物、顯示裝置、以及固體攝像元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F220/06</main-classification>  
        <further-classification edition="200601120260401B">C08F220/18</further-classification>  
        <further-classification edition="200601120260401B">C08F220/32</further-classification>  
        <further-classification edition="200601120260401B">C08F226/12</further-classification>  
        <further-classification edition="200601120260401B">C08L39/04</further-classification>  
        <further-classification edition="200601120260401B">C08K5/45</further-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification>  
        <further-classification edition="200601120260401B">G09F9/30</further-classification>  
        <further-classification edition="200601120260401B">G09F9/00</further-classification>  
        <further-classification edition="202501120260401B">H10F39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺津悠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASATSU, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出崎光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEZAKI, HIKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河西裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANISHI, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種組合物，其能夠形成顯示出較高之折射率，進而顯示出較高之透明性之硬化物。 &lt;br/&gt;本發明提供一種組合物，其含有：化合物(A)，其具有環硫乙烷基或環硫丙烷基；及樹脂(B)。樹脂(B)包含樹脂(B1)，該樹脂(B1)包含來自具有咔唑環之不飽和化合物之結構單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2186" publication-number="202627891"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627891.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有與記憶體晶粒異質整合之計算單元的人工智慧加速器</chinese-title>  
        <english-title>ARTIFICIAL INTELLIGENCE ACCELERATOR HAVING COMPUTING UNITS HETEROGENEOUSLY INTEGRATED WITH MEMORY DIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G06N3/06</main-classification>  
        <further-classification edition="202601120260401B">H10W70/01</further-classification>  
        <further-classification edition="201801120260401B">G06F9/44</further-classification>  
        <further-classification edition="200601120260401B">G06F13/38</further-classification>  
        <further-classification edition="201601120260401B">G06F12/08</further-classification>  
        <further-classification edition="200601120260401B">G06T1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR TECHNOLOGIES LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常　旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, XU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬森蓋爾　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASSENGALE, ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　承赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了半導體積體電路（IC）裝置的架構，更具體而言，一種人工智慧（AI）加速器。該AI加速器包括彼此橫向並排安置且位於共同基板之上的處理區塊、記憶體區塊，及垂直插入在該共同基板與該記憶體區塊之間的邏輯基底晶粒。該處理區塊包括計算晶粒，該計算晶粒包括用於處理人工智慧演算法的複數個平行處理核心。該記憶體區塊經由在該共同基板中形成的電性連接部與該處理區塊異質整合。該記憶體區塊包括記憶體堆疊，該記憶體堆疊包括一或多個垂直堆疊的記憶體晶粒層。該邏輯基底晶粒包括該記憶體區塊與該處理區塊之間的一或多個資料通訊介面。這些資料通訊介面至少包含晶片上網路，該晶片上網路經配置以將該記憶體區塊與每一處理核心電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are architectures of semiconductor integrated circuit (IC) device, more specifically an artificial intelligence (AI) accelerator. The AI accelerator comprises a processing block, a memory block disposed laterally side-by-side to each other and over a common substrate, and a logic base die vertically interposed between the common substrate and the memory block. The processing block comprises a computing die that comprises a plurality of parallel processing cores for processing artificial intelligence algorithms. The memory block heterogeneously integrated with the processing block through electrical connections formed in the common substrate. The memory block comprises a memory stack that comprises one or more vertically stacked memory die layers. The logic base die comprises one or more data communication interfaces between the memory block and the processing block. The data communication interfaces include at least a network on chip configured to electrically connect the memory block with each processing core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:AI加速器</p>  
        <p type="p">110:記憶體區塊</p>  
        <p type="p">112A,112B,112C,112D:堆疊式記憶體</p>  
        <p type="p">114A:記憶體邏輯晶粒</p>  
        <p type="p">120:處理區塊</p>  
        <p type="p">130A:邏輯基底晶粒</p>  
        <p type="p">140:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2187" publication-number="202626579"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626579.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C59/135</main-classification>  
        <further-classification edition="200601120260401B">C07C65/28</further-classification>  
        <further-classification edition="200601120260401B">C07C69/78</further-classification>  
        <further-classification edition="200601120260401B">C07C309/73</further-classification>  
        <further-classification edition="200601120260401B">C07C381/00</further-classification>  
        <further-classification edition="200601120260401B">C07D327/08</further-classification>  
        <further-classification edition="200601120260401B">C07D333/76</further-classification>  
        <further-classification edition="200601120260401B">C09K3/00</further-classification>  
        <further-classification edition="200601120260401B">C08F212/14</further-classification>  
        <further-classification edition="200601120260401B">C08F212/32</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且EL、LWR、CDU、DOF等微影性能優良，以及微細圖案形成中亦抗圖案崩塌，蝕刻耐性亦優良之化學增幅阻劑組成物中使用之鋶鹽型單體、含有來自該鋶鹽型單體之重複單元之聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。 &lt;br/&gt;本發明之解決手段係一種鋶鹽型單體，係以下式(a)表示。 &lt;br/&gt;&lt;img align="absmiddle" height="234px" width="602px" file="ed10485.JPG" alt="ed10485.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polymer comprising repeat units derived from a sulfonium salt consisting of a carboxylate anion having a styrene or vinylnaphthalene structure as a polymerizable group and iodine and a sulfonium cation having pentafluorosulfanyl and hydrocarbyloxycarbonyl groups is useful as a polymer-bound quencher. A resist composition comprising the polymer exhibits a high solvent solubility, high sensitivity and high contrast and forms a small-size pattern having satisfactory lithography properties such as EL, LWR, CDU and DOF as well as collapse resistance and etching resistance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2188" publication-number="202628208"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628208.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>診斷燃料電池催化劑狀態的方法</chinese-title>  
        <english-title>Method for diagnosing a catalyst state in a fuel cell</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260325B">H01M8/04313</main-classification>  
        <further-classification edition="201601120260325B">H01M8/0444</further-classification>  
        <further-classification edition="201601120260325B">H01M8/04537</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉哈德　戈茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REINHARDT, GOETZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊樂　哈特維希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEHLE, HARTWIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於診斷設置於燃料電池中的至少一種催化劑（20）之狀態的方法，更特定言之，該至少一種催化劑設置於高溫燃料電池中或以至少一個堆疊之形式串聯佈置的固態氧化物燃料電池中，其包含以下步驟： &lt;br/&gt;- 建立該堆疊之穩定操作狀態，更特定言之，熱穩定操作點； &lt;br/&gt;- 斷開或降低該堆疊之負載，使其進入空載狀態，更特定言之，降至零負載； &lt;br/&gt;- 量測及評估 &lt;br/&gt;-- 每個燃料電池之空載電壓，及 &lt;br/&gt;-- 在堆疊入口處供應之氣體燃料在堆疊出口處之殘餘濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for diagnosing the state of at least one catalyst (20) which is provided in fuel cells, more particularly in high-temperature fuel cells or in solid oxide fuel cells arranged serially in the form of at least one stack, comprising the following steps: &lt;br/&gt;- establishing a stable operating state, more particularly a thermally stable operating point, of the stack; &lt;br/&gt;- switching off or running down the load of the stack into a no-load state, more particularly to zero; &lt;br/&gt;- measuring and evaluating &lt;br/&gt;-- the no-load voltage per fuel cell and &lt;br/&gt;-- the residual concentration at the stack exit of the gaseous fuel supplied at the stack entry.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2189" publication-number="202628215"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628215.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水電解質二次電池及非水電解質二次電池用電極之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260331B">H01M10/05</main-classification>  
        <further-classification edition="201001120260331B">H01M10/058</further-classification>  
        <further-classification edition="201001120260331B">H01M10/0587</further-classification>  
        <further-classification edition="201001120260331B">H01M4/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>作花勇也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKKA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福井昂佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若林大倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKABAYASHI, HIROMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤剛也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">正極(11)具備：正極芯體(30)；正極合劑層(32)，其形成於正極芯體(30)表面；正極芯體露出部(31)，其露出正極芯體(30)；保護層(50)，其形成於正極芯體露出部(31)表面；及正極耳片(20)，其配置於保護層(50)表面。保護層(50)具有低於正極耳片(20)之彈性模數，且正極耳片(20)與正極芯體露出部(31)透過形成於保護層(50)內之連結部(51)連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:正極</p>  
        <p type="p">20:正極耳片</p>  
        <p type="p">30:正極芯體</p>  
        <p type="p">31:正極芯體露出部</p>  
        <p type="p">32:正極合劑層</p>  
        <p type="p">50:保護層</p>  
        <p type="p">51:連結部</p>  
        <p type="p">E1,E2:邊緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2190" publication-number="202627130"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627130.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140671</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、電子零件及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C22C19/05</main-classification>  
        <further-classification edition="200601120260318B">C01G15/00</further-classification>  
        <further-classification edition="202201120260318B">B22F1/05</further-classification>  
        <further-classification edition="200601120260318B">C09K5/14</further-classification>  
        <further-classification edition="200601120260318B">C04B35/582</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的組成物，其包含：(A)Ga或Ga合金、(B)熱傳導性陶瓷填料與(C)熔點為900℃以上之金屬粉。 &lt;br/&gt;　　依據本發明，在包含Ga(鎵)或Ga合金、與熱傳導性陶瓷填料之組成物之中，可提供操作性･作業性優異之組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2191" publication-number="202626954"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626954.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結晶型聚酯樹脂及包含其之物品</chinese-title>  
        <english-title>CRYSTALLINE POLYESTER RESIN AND ARTICLE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08L67/03</main-classification>  
        <further-classification edition="200601120260330B">C08G63/183</further-classification>  
        <further-classification edition="200601120260330B">C08J11/04</further-classification>  
        <further-classification edition="200601120260330B">B29B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃多榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, DA-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳泫遇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYUN-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種結晶型聚酯樹脂及其製備方法。由於該結晶型聚酯樹脂具有在模製過程及/或再循環過程中所需水平之結晶度，同時使製造過程中之熔合最小化，因此其可具有極佳生產率、可模製性、可再循環性及其類似優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a crystalline polyester resin and to a process for preparing the same. Since the crystalline polyester resin has crystallinity at a level required in a molding process and/or a recycling process while fusion in the manufacturing process is minimized, it can have excellent productivity, moldability, recyclability, and the like.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2192" publication-number="202628916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體晶圓檢測裝置</chinese-title>  
        <english-title>INSPECTION APPARATUS FOR SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P72/70</main-classification>  
        <further-classification edition="202601120260327B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商奔創科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEMTRON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺哲熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, CHEOL-HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任琮彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JONG-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔熏宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HOON-JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體晶圓檢測裝置。該檢測裝置具有一用於承載半導體晶圓之晶圓夾盤、一用於對晶圓夾盤上所載半導體晶圓進行成像之成像單元、一具有水平體段及自水平體段向上延伸之垂直體段之本體、一用於支撐成像單元而使安裝於其上之成像單元可沿橫斷方向往復移動之水平移動模組、一耦接於水平體段上板表面而可圍繞垂直方向軸線旋轉預設角度之晶圓支架及一耦接於垂直體段前板表面而可圍繞縱貫方向軸線旋轉預設角度之成像支架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體晶圓檢測裝置</p>  
        <p type="p">100:本體</p>  
        <p type="p">110:水平體段</p>  
        <p type="p">120:垂直體段</p>  
        <p type="p">200:晶圓夾盤</p>  
        <p type="p">300:成像單元</p>  
        <p type="p">310:二維相機模組</p>  
        <p type="p">320:三維相機模組</p>  
        <p type="p">400:水平移動模組</p>  
        <p type="p">460:導軌</p>  
        <p type="p">470:垂直驅動單元</p>  
        <p type="p">500:晶圓支架</p>  
        <p type="p">600:成像支架</p>  
        <p type="p">D:縱貫方向</p>  
        <p type="p">H:垂直方向</p>  
        <p type="p">W:橫斷方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2193" publication-number="202628294"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628294.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體絕緣開閉裝置</chinese-title>  
        <english-title>GAS-INSULATED SWITCHGEAR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251127B">H02B13/035</main-classification>  
        <further-classification edition="200601120251127B">H01H33/66</further-classification>  
        <further-classification edition="200601120251127B">H01H33/666</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河西克紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANISHI, KATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永敏宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, TOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森隆広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西園寺嶺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIONJI, REI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">氣體絕緣開閉裝置(101)具備：第一可動接觸件(19)，設於可動側圓柱導體(17)的內部，並與可動側桿(21)接觸且與可動側桿(21)電連接，而且與可動側桿(21)一起沿接觸分離方向移動；及第二可動接觸件(20)，設於可動側圓柱導體(17)的內部，並與第一可動接觸件(19)以及可動側圓柱導體(17)的內面接觸，而且與第一可動接觸件(19)電連接，並且，與可動側桿(21)及第一可動接觸件(19)一起一邊與可動側圓柱導體(17)接觸一邊沿接觸分離方向移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gas-insulated switchgear (101) according to the present invention includes a first movable contact (19), and a second movable contact (20); wherein the first movable contact (19) is mounted inside a movable cylinder conductor (17), in contact with and electrically connected to a movable rod (21), and movable in approaching and separating directions together with the movable rod (21); and wherein the second movable contact (20) is provided inside the movable cylinder conductor (17), in contact with the first movable contact (19) and an inner surface of the movable cylinder conductor (17), electrically connected to the first movable contact (19), and movable in approaching and separating directions together with the movable rod (21) and the first movable contact (19) while contacting the movable cylinder (17).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:槽</p>  
        <p type="p">2:外側凸緣</p>  
        <p type="p">3:內側凸緣</p>  
        <p type="p">4:中間室</p>  
        <p type="p">5:密封構件</p>  
        <p type="p">6:氣體密度監測器</p>  
        <p type="p">7:可動側母線導體</p>  
        <p type="p">8:固定側母線導體</p>  
        <p type="p">11:操作部</p>  
        <p type="p">13:可動側支持絕緣物</p>  
        <p type="p">14,15:嵌入金屬件</p>  
        <p type="p">16:絕緣桿</p>  
        <p type="p">17:可動側圓柱導體</p>  
        <p type="p">18:圓柱密封件</p>  
        <p type="p">19:第一可動接觸件</p>  
        <p type="p">20:第二可動接觸件</p>  
        <p type="p">21:可動側桿</p>  
        <p type="p">22:真空閥</p>  
        <p type="p">23:可動側電極</p>  
        <p type="p">24:固定側電極</p>  
        <p type="p">25:波紋管</p>  
        <p type="p">26:固定側連接導體</p>  
        <p type="p">27:固定側支持絕緣物</p>  
        <p type="p">28,29:連接部</p>  
        <p type="p">30,31,32:貫通孔</p>  
        <p type="p">101:氣體絕緣開閉裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2194" publication-number="202627294"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627294.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橫流風箏發電系統及其方法</chinese-title>  
        <english-title>CROSS-FLOW KITE POWER SYSTEM AND METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">F03D5/06</main-classification>  
        <further-classification edition="202001120260316B">B64C31/06</further-classification>  
        <further-classification edition="200601120260316B">F03B17/06</further-classification>  
        <further-classification edition="200601120260316B">F03B13/26</further-classification>  
        <further-classification edition="200601120260316B">B63B21/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹哲之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHE-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮安萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, AN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述了一種橫流風箏發電系統的新配置概念及其操作方法。本發明開發了一種分析模型作為系統設計的分析與設計方法，特別是用於設計發電機渦輪機以與風箏匹配，從而獲得最大功率輸出。藉由這些分析與設計，本發明描述了一種較佳的風箏-渦輪機系統，其使用流速通過比（velocity transit ratio）遠高於貝茲極限（Betz limit）對應值之渦輪機，使風箏能飛得更快且系統能獲取更多功率。本發明亦包含一種分離模組（Split-Module）之風箏發電系統配置，以及一種在共同繫纜上串聯繫泊多個風箏發電系統單元的新排列方式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention describes the concept of a new configuration of cross-flow kite power system and its operation method. An analytical model was developed as an analysis and design method for the design of the system and, especially, to design the generator turbine to match the kite in order to obtain maximal power. By these analysis and design, this invention describes a preferred kite-turbine system that uses a turbine of a power coefficient much lower than the Betz limit but can capture higher power. This invention also comprises a new spit-module configuration of kite power system and a new arrangement for mooring multiple units of kite power system in series.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:風箏模組</p>  
        <p type="p">101:風箏</p>  
        <p type="p">110:浮力中心位移機構</p>  
        <p type="p">111、112:可移動浮標</p>  
        <p type="p">122:水平尾翼</p>  
        <p type="p">200:發電機模組</p>  
        <p type="p">201:渦輪機</p>  
        <p type="p">202:浮標</p>  
        <p type="p">311:風箏繫纜</p>  
        <p type="p">321:渦輪機繫纜</p>  
        <p type="p">600:控制艙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2195" publication-number="202626352"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626352.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疊層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">B32B15/08</main-classification>  
        <further-classification edition="200601120260324B">B32B27/36</further-classification>  
        <further-classification edition="200601120260324B">C08G63/181</further-classification>  
        <further-classification edition="200601120260324B">C09J167/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内山翔子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIYAMA, SHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種保存穩定性及層間黏接性優異的疊層體。 &lt;br/&gt;本發明係一種疊層體，按順序包含：基材層(A)、及交聯聚酯樹脂層(B)，該基材層(A)為包含選自於由鋁、鋼鐵、不鏽鋼、銅、及玻璃構成之群組中之至少1種之層，該交聯聚酯樹脂層(B)為包含係側鏈具有羧基之聚酯樹脂(C)與環氧化合物(D)的反應產物之交聯聚酯樹脂(b)、及酯交換觸媒(E)之層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2196" publication-number="202626873"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626873.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、液晶配向膜及液晶顯示元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G73/10</main-classification>  
        <further-classification edition="200601120260401B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木朋哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的為提供不會發生液晶之配向不均的液晶配向膜。進一步，本發明之目的為提供用以製作該液晶配向膜之液晶配向劑、及具有該液晶配向膜之液晶顯示元件。 &lt;br/&gt;本發明為一種液晶配向劑，含有下述(A)成分及(B)成分、或下述(A)成分及(C)成分。 &lt;br/&gt;(A)成分：使式[A-CA]與二胺成分反應，且與式[EA-1a]~式[EA-2b]之二羧酸酐或單環氧化合物反應而得到的聚醯亞胺系聚合物。 &lt;br/&gt;(B)成分：使式[B-CA]與二胺成分反應而得到的聚醯亞胺系聚合物。 &lt;br/&gt;(C)成分：使式[B-CA]與二胺成分反應，且與式[EB-1a]~式[EB-3b]之二羧酸酐或單環氧化合物反應而得到的聚醯亞胺系聚合物。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="140px" width="377px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(上式之各記號如說明書中所定義。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:橫電場液晶顯示元件</p>  
        <p type="p">2:梳齒電極基板</p>  
        <p type="p">2a:基板</p>  
        <p type="p">2b:線狀電極</p>  
        <p type="p">2c:液晶配向膜</p>  
        <p type="p">3:液晶</p>  
        <p type="p">4:相向基板</p>  
        <p type="p">4a:液晶配向膜</p>  
        <p type="p">4b:基板</p>  
        <p type="p">L:電力線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2197" publication-number="202625934"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625934.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>椅子及用於椅子的空氣產生設備</chinese-title>  
        <english-title>CHAIR AND AIR-GENERATION APPARATUS FOR THE CHAIR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">A47C7/62</main-classification>  
        <further-classification edition="200601120260204B">A47C7/72</further-classification>  
        <further-classification edition="200601120260204B">A47C7/74</further-classification>  
        <further-classification edition="200601120260204B">A47C7/40</further-classification>  
        <further-classification edition="200601120260204B">A47C15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商雷蛇（亞太）私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAZER (ASIA-PACIFIC) PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　民亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, MIN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庄　汶心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONG, BOON SIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甄　維良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, WOOI LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　煒杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, WEIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　孫德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOH, SOON TECK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　川良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHUANLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞魯尤　吉爾伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALUYO, GILBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虞　華龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HUALONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據各種實施例，可提供一種用於椅子的空氣產生設備。空氣產生設備可包括可耦接到椅子的氣流歧管，氣流歧管包括空氣入口配置、空氣出口配置及氣流導管。空氣產生設備可進一步包括耦接到氣流歧管的風扇單元，風扇單元可操作以引導空氣流入氣流歧管的空氣入口配置，用於使空氣沿著氣流導管流動並經由空氣出口配置流出。根據各種實施例，可以引導流出氣流歧管的空氣出口配置的至少一部分空氣能流動過椅子的靠背的方式，使氣流歧管可耦接到椅子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to various embodiments, there may be provided an air-generation apparatus for a chair. The air-generation apparatus may include an airflow manifold couplable to the chair, the airflow manifold comprising an air inlet arrangement, an air outlet arrangement, and an airflow. The air-generation apparatus may further include a fan unit coupled to the airflow manifold, the fan unit operable to direct the air to enter the air inlet arrangement of the airflow manifold for the air to flow along the airflow conduit and exit via the air outlet arrangement. According to various embodiments, the airflow manifold may be couplable to the chair in a manner so as to direct at least a portion of the air exiting the air outlet arrangement of the airflow manifold to flow over a backrest of the chair.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:空氣產生設備</p>  
        <p type="p">110:氣流歧管</p>  
        <p type="p">111:氣流導管</p>  
        <p type="p">113:空氣入口配置</p>  
        <p type="p">116:空氣出口配置</p>  
        <p type="p">120:風扇單元</p>  
        <p type="p">130:附加外殼</p>  
        <p type="p">131:進氣口</p>  
        <p type="p">132:排氣口</p>  
        <p type="p">160:溫度感測器</p>  
        <p type="p">170:控制器</p>  
        <p type="p">181:加熱元件</p>  
        <p type="p">182:冷卻元件</p>  
        <p type="p">190:椅子</p>  
        <p type="p">191:靠背部分</p>  
        <p type="p">1000:椅子系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2198" publication-number="202628841"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628841.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140796</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P50/60</main-classification>  
        <further-classification edition="202601120260318B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野英嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, HIDETSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於適當地判斷在對基板表面進行蝕刻時有無異常。為了達成上述目的，本發明提供一種基板處理方法，其對基板進行處理，其特徵為包含以下步驟：根據設定蝕刻條件，將包含氟酸、磷酸以及硝酸的至少其中任一種在內的蝕刻液供給到基板的表面，以對該基板的表面進行蝕刻；導出蝕刻後的基板表面的複數個基準點的實際蝕刻量；針對每個基準點，比較「實際蝕刻量和事前取得的正常蝕刻量的差分」與「預先設定好的閾值」；以及根據比較的結果，判斷實際蝕刻量的狀態以及用以將蝕刻液供給到基板表面的蝕刻液供給環境的狀態；正常蝕刻量，係事前以設定蝕刻條件對基板表面進行蝕刻並在該蝕刻被正常實行時所取得的複數個基準點的蝕刻量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">St1~St14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2199" publication-number="202628917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P72/70</main-classification>  
        <further-classification edition="200601120260331B">G05G21/00</further-classification>  
        <further-classification edition="200601120260331B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　班哲明　康尼剛達　亨利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMEETS, BENJAMIN CUNNEGONDA HENRICUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　仰山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YANG-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種系統，其包含用於支撐一基板之一載物台及用於控制該載物台之移動之一控制系統。該控制系統經組態以判定該基板之一原位質量，且取決於該基板之經判定原位質量而控制該載物台之一位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention concerns a system, comprising a stage for supporting a substrate and a control system for controlling movement of the stage. The control system is configured to determine an in-situ mass of the substrate, and control a position of the stage depending on the determined in-situ mass of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主體</p>  
        <p type="p">11:上表面</p>  
        <p type="p">20:瘤節</p>  
        <p type="p">50:銷釘/升降銷釘</p>  
        <p type="p">W:基板</p>  
        <p type="p">WT:載物台/基板支撐件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2200" publication-number="202626886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚矽氧系共聚物及包含其之表面改質劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08G77/46</main-classification>  
        <further-classification edition="201801120260302B">C09D7/47</further-classification>  
        <further-classification edition="200601120260302B">C09D4/02</further-classification>  
        <further-classification edition="200601120260302B">C09D175/16</further-classification>  
        <further-classification edition="200601120260302B">B32B27/18</further-classification>  
        <further-classification edition="200601120260302B">B32B27/30</further-classification>  
        <further-classification edition="200601120260302B">B32B27/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼歐斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEOS COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內規貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平松信志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAMATSU, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠對塗膜之硬化膜賦予調平性及再塗佈性之化合物。&lt;br/&gt; 本發明係關於一種共聚物，其包含源自聚矽氧化合物之聚矽氧系單元及源自親水性偶氮化合物之親水性單元(但是，前述聚矽氧系單元除外)作為重複單位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2201" publication-number="202626462"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626462.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>波焊指偵測系統與方法</chinese-title>  
        <english-title>WAVE SOLDER FINGER DETECTION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B65G29/00</main-classification>  
        <further-classification edition="200601120260401B">B65G43/00</further-classification>  
        <further-classification edition="200601120260401B">B23K3/08</further-classification>  
        <further-classification edition="202601120260401B">H05K3/341</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊利諾工具工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希伯　傑克森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHIEBER, JACKSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道騰翰　強納生Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAUTENHAHN, JONATHAN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">波焊機包括波焊站，該波焊站配置成產生焊波，用於在印刷電路板上執行波焊操作。該波焊機還包括一個指輸送系統，用於將印刷電路板輸送到波焊站。此指輸送系統包括至少一個鏈輸送器，該鏈輸送器包括一條具有複數個指的鏈，該指用於支撐印刷電路板的邊緣。此指輸送系統還包括指偵測系統，該系統具有張力輥組件，該張力輥組件配置成與複數個指中的每個指接合。該張力輥組件也配置成回應於與處於非操作位置的指接合而移動。該指輸送系統還包括一個感測器，該感測器配置用於偵測張力輥組件移動到非操作位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wave soldering machine includes a wave soldering station configured to create a solder wave used to perform the wave soldering operation on the printed circuit board. The wave soldering machine further includes a finger conveyor system configured to deliver a printed circuit board to the wave soldering station. The finger conveyor system includes at least one chain conveyor including a chain having a plurality of fingers configured to support an edge of the printed circuit board. The finger conveyor system further includes a finger detection system having a tension roller assembly configured to engage each finger of the plurality of fingers. The tension roller assembly further is configured to move in response to engaging a finger in a non-operational position. The finger conveyor system further includes a sensor configured to detect movement of the tension roller assembly to the non-operational position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:印刷電路板</p>  
        <p type="p">30:指輸送系統</p>  
        <p type="p">34:鏈</p>  
        <p type="p">36:鏈輪</p>  
        <p type="p">38:指</p>  
        <p type="p">50:指偵測系統</p>  
        <p type="p">52:框架構件</p>  
        <p type="p">54:支架</p>  
        <p type="p">64:張力輥組件</p>  
        <p type="p">66:感測器</p>  
        <p type="p">32a:第一鏈輸送器</p>  
        <p type="p">32b:第二鏈輸送器</p>  
        <p type="p">38a:位移指</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2202" publication-number="202628273"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628273.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>端子模組及具有端子模組的電連接器</chinese-title>  
        <english-title>CONTACT ASSEMBLY AND ELECTRICAL CONNECTOR HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260330B">H01R13/646</main-classification>  
        <further-classification edition="200601120260330B">H01R13/40</further-classification>  
        <further-classification edition="200601120260330B">H01R13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特倫斯　Ｆ　李托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERRANCE F, LITTLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　杰禧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JESSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐乙民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種端子模組，其用於電連接器，所述端子模組包括：一排信號端子，所述一排信號端子具有多個接觸部和多個安裝部；絕緣件，所述絕緣件固定所述一排信號端子；上遮罩片，所述上遮罩片位於所述一排信號端子的一側；及下遮罩片，所述下遮罩片位於所述一排信號端子的另一側；其中，所述上遮罩片和下遮罩片均具有多個接地安裝部，所述上遮罩片和下遮罩片的一個上的所述接地安裝部與所述上遮罩片和下遮罩片中的另一個遮罩片接觸，所述上遮罩片和下遮罩片中的另一個的接地安裝部與所述一排信號端子的多個安裝部對齊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A contact assembly for an electrical connector comprises: a row of signal contacts having plural contacting portions and plural mounting portions; an insulator secured to the row of signal contacts; and an upper ground plate and a lower ground plate surrounding the row of signal contacts; wherein each of the upper ground plate and the lower ground plate integrally has a plurality of ground mounting portions; and the plurality of ground mounting portions of one of the upper ground plate and the lower ground plate contact the other one of the upper ground plate and the lower ground plate, and the plurality ground mounting portions of the other one of the upper ground plate and the lower ground plate are aligned with the plurality of mounting portions of the row of signal contacts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2121、2221:接地安裝部</p>  
        <p type="p">2140、2240:上遮罩片</p>  
        <p type="p">2141、2241:下遮罩片</p>  
        <p type="p">524、525:接地安裝部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2203" publication-number="202627156"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627156.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬氟化物塗料</chinese-title>  
        <english-title>METAL FLUORIDE COATINGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C16/30</main-classification>  
        <further-classification edition="200601120260401B">C23C16/40</further-classification>  
        <further-classification edition="200601120260401B">C04B41/52</further-classification>  
        <further-classification edition="200601120260401B">C04B41/89</further-classification>  
        <further-classification edition="200601120260401B">G01L9/12</further-classification>  
        <further-classification edition="200601120260401B">G01L19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列支敦斯登商英飛康股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INFICON AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布爾曼　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUEHLMANN, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德烈亞斯　伯恩哈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREAUS, BERNHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬塔奧索羅　斯塔沃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATA OSORO, GUSTAVO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史普林　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPRING, PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於測量壓力之感應器之薄膜上的固態塗料，其包含至少一層金屬氧化物、及至少一層金屬氟化物或金屬氧氟化物，一種塗有本發明塗料之薄膜，一種將該塗料用於保護薄膜的用途，以及一種將薄膜以瞬間塗料塗覆之方法，其特定而言用於保護基材對抗侵蝕、腐蝕、氧化、或氟化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solid coating on a membrane of a sensor for measuring pressure comprising at least one layer of a metal oxide and at least one layer of a metal fluoride or metal oxyfluoride, a membrane coated with the present coating, a use of the coating for protecting a membrane and a method for coating a membrane with the instant coating, in particular for protecting the substrate against erosion, corrosion, oxidation or fluorination.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固態多層配置</p>  
        <p type="p">2:第一層</p>  
        <p type="p">3:第二層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2204" publication-number="202628271"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628271.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於工業電力設備的HV連接器</chinese-title>  
        <english-title>HV CONNECTOR FOR INDUSTRIAL POWER EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01R13/631</main-classification>  
        <further-classification edition="200601120260327B">H01R13/639</further-classification>  
        <further-classification edition="200601120260327B">H01R13/52</further-classification>  
        <further-classification edition="201101120260327B">H01R24/28</further-classification>  
        <further-classification edition="200601120260327B">H01J37/02</further-classification>  
        <further-classification edition="200601120260327B">H05H1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波蘭商創浦霍廷格股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF HUETTINGER SP. Z O. O.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丘羅曼斯基　佛西許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOROMANSKI, WOJCIECH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路卡希維克　傑克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUKASIEWICZ, JACEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫克　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRUK, MICHAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞奇維克　麥特茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYNKIEWICZ, MATEUSZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高壓連接器（1，11），&lt;br/&gt; 用於工業電力設備，該高壓連接器被配置成引導高電流並且承受高壓，特別地可用於電漿處理設備，&lt;br/&gt; 該HV連接器（1，11）被形成為適配到對應的插頭（121）中並且包括：&lt;br/&gt; 插頭連接端部（6）和內端部（7），&lt;br/&gt; 連接元件（2），&lt;br/&gt; 至少部分地圍繞連接元件（2）的絕緣本體（3），&lt;br/&gt; 連接元件（2）具有從插頭連接端部（6）擴展到內端部（7）的桿形狀，連接元件（2）包括桿直徑改變點（8），在所述桿直徑改變點處，連接元件（2）的直徑從朝向插頭連接端部（6）的方向上的第一桿直徑（21）改變到朝向內端部（7）的方向上的第二桿直徑（22），&lt;br/&gt; 絕緣本體（3）具有帶有孔（23）的形狀，孔（23）形成為圍繞連接元件（2），孔（23）具有孔直徑改變點（9），在所述孔直徑改變點處，孔（23）的孔直徑從朝向插頭連接端部（6）的方向上的第一孔直徑（24）改變到朝向內端部（7）的方向上的第二孔直徑（25），其中，第一孔直徑（24）等於第一桿直徑（21），並且第二孔直徑（25）等於第二桿直徑（22），使得絕緣本體（3）緊密地適配在連接元件（2）上，並且&lt;br/&gt; 絕緣本體（3）以使其孔直徑改變點（9）與連接元件（2）的桿直徑改變點（8）相鄰的方式定位，使得連接元件（2）和絕緣本體（3）在兩個直徑處形成沒有間隙的複合結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">High voltage connector (1,11) for an industrial power equipment configured to lead high current and withstand high voltage in particular usable for a plasma process equipment, the HV connector (1,11) is formed to fit into a corresponding plug (121) and comprises:&lt;br/&gt; a plug-connecting-end (69 and an inner-end (7), &lt;br/&gt; a connecting element (2), &lt;br/&gt; an insulator body (3) surrounding the connecting element (2) at least partially, &lt;br/&gt; the connecting element (2) having a rod shape which expands from the plug-connecting-end (6 to an inner-end (7), the connecting element (2) comprises a rod-diameter-changing-point 8, where the diameter of the connecting element (2) changes from a first rod-diameter (21) in direction to the plug-connecting-end (6) to a second rod-diameter (22) in direction to the inner-end (7), &lt;br/&gt; the insulator body (3) having a shape with a hole (23), the hole (23) formed to surround the connecting element (2), the hole (23) having a hole-diameter-changing-point (9), where the hole-diameter of the hole (23) changes from a first hole-diameter (24) in direction to the plug-connecting-end (6) to a second hole-diameter (25) in direction to the inner-end (7), wherein the first hole-diameter (24) is equal to the first rod-diameter (21) and the second hole-diameter (25) is equal to the second rod-diameter (22), so that the insulator-body (3) fits tightly on the connecting element (2), and&lt;br/&gt; the insulator body (3) is positioned in such a way that its hole-diameter-changing-point (9) is adjacent to the rod-diameter-changing-point (8) of the connecting element (2), so that the connecting element (2) and the insulator body (3) build a compound without free distance at both diameters</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:高壓(HV)連接器</p>  
        <p type="p">13:液體</p>  
        <p type="p">2:連接元件</p>  
        <p type="p">21:第一桿直徑</p>  
        <p type="p">22:第二桿直徑</p>  
        <p type="p">23:孔</p>  
        <p type="p">24:第一孔直徑</p>  
        <p type="p">25:第二孔直徑</p>  
        <p type="p">26:徑向平面</p>  
        <p type="p">28:連接銷</p>  
        <p type="p">3:絕緣本體</p>  
        <p type="p">37:O形環</p>  
        <p type="p">39:外部結構</p>  
        <p type="p">4:金屬殼體</p>  
        <p type="p">43:內徑</p>  
        <p type="p">44:緊固凹槽</p>  
        <p type="p">46:半徑</p>  
        <p type="p">47:矩形擴張環</p>  
        <p type="p">48:管</p>  
        <p type="p">5:絕緣環</p>  
        <p type="p">51:第三桿直徑</p>  
        <p type="p">54:第三孔直徑</p>  
        <p type="p">58:第二桿直徑改變點</p>  
        <p type="p">59:第二孔直徑改變點</p>  
        <p type="p">6:插頭連接端部</p>  
        <p type="p">7:內端部</p>  
        <p type="p">71:櫃壁</p>  
        <p type="p">8:桿直徑改變點</p>  
        <p type="p">9:孔直徑改變點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2205" publication-number="202628905"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628905.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板中心自我檢查刃片</chinese-title>  
        <english-title>SUBSTRATE CENTER SELF CHECK BLADE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10P72/50</main-classification>  
        <further-classification edition="202601120260317B">H10P74/00</further-classification>  
        <further-classification edition="202601120260317B">H10P72/70</further-classification>  
        <further-classification edition="202601120260317B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝孟雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, MENGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李洋輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宣自月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUAN, ZIYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻世明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凡昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔翰林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, HANLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許述達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, SHUDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎彩麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, CAILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐文藝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, WENYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李迪帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DIFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比恩　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施方式涉及一種裝置，該裝置包括具有第一表面和面向遠離第一表面的第二表面的刃片。在一個實施方式中，複數個相機連接到刃片上，其中每個複數個相機的視場面向遠離第一表面。在一個實施方式中，第二表面被設計用來支撐基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a blade with a first surface and a second surface facing away from the first surface. In an embodiment, a plurality of cameras are coupled to the blade, where the plurality of cameras each have a field of view that faces away from the first surface. In an embodiment, the second surface is configured to support a substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">220:基板</p>  
        <p type="p">230:刃片</p>  
        <p type="p">231:第一臂</p>  
        <p type="p">232:第二臂</p>  
        <p type="p">233:孔</p>  
        <p type="p">235:相機</p>  
        <p type="p">236:相機</p>  
        <p type="p">237:相機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2206" publication-number="202626270"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626270.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種化學機械拋光機的流體輸送裝置</chinese-title>  
        <english-title>A FLUID DELIVERY APPARATUS FOR CHEMICAL MECHANICAL POLISHER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B24C7/00</main-classification>  
        <further-classification edition="200601120260401B">B24C5/04</further-classification>  
        <further-classification edition="200601120260401B">B24B57/02</further-classification>  
        <further-classification edition="201201120260401B">B24B37/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿拉文登　阿克謝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAVINDAN, AKSHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古魯薩米　傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURUSAMY, JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫斯塔法　沙米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSTAFA, SAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁尼斯　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ, RICARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昊晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAOSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希賈許　派翠克Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGASHI, PATRICK A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於化學機械拋光的流體輸送裝置包含具有複數個噴嘴座的外殼。歧管設置在複數個噴嘴座的上方。複數個噴嘴設置在相應噴嘴座中，並與歧管流體連通。複數個噴嘴具有與外殼的底表面平齊佈置的底表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fluid delivery apparatus for use in chemical mechanical polishing includes a housing having a plurality of nozzle pockets. A manifold is disposed above the plurality of nozzle pockets. A plurality of nozzles are disposed in a respective nozzle pocket and are in fluid communication with the manifold. The plurality of nozzles have a bottom surface in a flush arrangement with a bottom surface of the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:外殼</p>  
        <p type="p">313:流體孔</p>  
        <p type="p">314:座</p>  
        <p type="p">315:頂表面</p>  
        <p type="p">320:歧管</p>  
        <p type="p">321:近端</p>  
        <p type="p">323:歧管主體</p>  
        <p type="p">324:出口孔</p>  
        <p type="p">325:軸向孔</p>  
        <p type="p">330:分配臂</p>  
        <p type="p">340:噴嘴</p>  
        <p type="p">360:歧管噴嘴</p>  
        <p type="p">371:唇部</p>  
        <p type="p">415:底表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2207" publication-number="202628394"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628394.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種通信方法、通信裝置及通信系統</chinese-title>  
        <english-title>A COMMUNICATION METHOD, COMMUNICATION APPARATUS AND COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H04L27/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PANPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊特拉卡　羅杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITRAKAR, ROJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種通信方法、通信裝置及通信系統。該方法中，由於資訊位元流中的第一位元值和第二位元值均被調製成方波信號，因此第一位元值對應的載波信號的頻譜相較於第一載波信號的頻譜進行了搬移且搬移距離為第一週期的倒數（即第一頻率），第二位元值對應的載波信號的頻譜相較於第一載波信號的頻譜也進行了搬移且搬移距離為第二週期的倒數（即第二頻率）。由於資訊位元流中的位元值（即第一位元值和第二位元值）對應的載波信號的頻譜相較於第一載波信號的頻譜進行了搬移，因此避免了第一載波信號與第二載波信號之間的相互干擾，解決了AMP單站背反射遭受嚴重的自干擾的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method, a communication apparatus and a communication system. In the method, since both a first bit value and a second bit value in an information bit stream are modulated into square wave signals, the spectrum of a carrier signal corresponding to the first bit value has been shifted compared to that of a first carrier signal, and the shift distance is the reciprocal of a first period (i.e., a first frequency). The spectrum of a carrier signal corresponding to the second bit value has also been shifted compared to that of the first carrier signal, and the shift distance is the reciprocal of a second period (i.e., a second frequency). Because the spectrums of the carrier signals corresponding to the bit values (i.e., the first bit value and the second bit value) in the information bit stream has been shifted compared to that of the first carrier signal, the mutual interference between the first carrier signal and the second carrier signal is avoided, and the problem of severe self-interference suffered by AMP single-station backreflection is solved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">501、502:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2208" publication-number="202626592"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626592.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法、化合物、及聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07C235/12</main-classification>  
        <further-classification edition="200601120260302B">C07D305/12</further-classification>  
        <further-classification edition="200601120260302B">C07D307/33</further-classification>  
        <further-classification edition="200601120260302B">C07D307/93</further-classification>  
        <further-classification edition="200601120260302B">C07D309/30</further-classification>  
        <further-classification edition="200601120260302B">C07D493/08</further-classification>  
        <further-classification edition="200601120260302B">C07D493/18</further-classification>  
        <further-classification edition="200601120260302B">C08F220/36</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/038</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification>  
        <further-classification edition="200601120260302B">G03F7/32</further-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>氷上裕一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIKAMI, YUUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三好宏和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOSHI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部祐大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種於圖案形成時可以充分的水準發揮感度或LWR、MEEF、顯影缺陷抑制性、CDU的感放射線性組成物、圖案形成方法、化合物、及聚合物。一種感放射線性組成物，含有：聚合物（A），包含源自下述式（1）所表示的化合物的結構單元（M）；以及溶劑（D）。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="173px" width="434px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（1）中，R&lt;sup&gt;1&lt;/sup&gt;為氫原子、氟原子、甲基、或三氟甲基。L&lt;sup&gt;1&lt;/sup&gt;為碳數1～5的二價連結基。R&lt;sup&gt;2&lt;/sup&gt;為氫原子或碳數1～20的一價有機基。R&lt;sup&gt;3&lt;/sup&gt;為於碳-碳間包含酯鍵的碳數3～20的一價有機基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2209" publication-number="202628300"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628300.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140920</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙極獨立直流電力傳輸系統</chinese-title>  
        <english-title>BIPOLAR- INDEPENDENT DC POWER DELIVERY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H02J1/00</main-classification>  
        <further-classification edition="202601120260330B">H02J4/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡伯雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, BOXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　汝錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉柏毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙極獨立直流電力傳輸系統包括並網電力電子轉換器、雙極直流電力母線槽和電力轉換單元。並網電力電子轉換器連接到中壓配電網，並將配電網電壓轉換為兩個振幅相同、極性相反的獨立直流電壓。雙極直流電力母線槽將並網電力電子轉換器產生的兩個獨立直流電壓連接到電力轉換單元。電力轉換單元可以從一個或兩個獨立直流電壓接收或發送電力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bipolar-independent DC power delivery system including a grid-tied power electronics converter, a bipolar DC power busway, and a power conversion unit. The grid-tied power electronics converter connects to a medium-voltage distribution grid and converts the distribution grid voltage to two independent DC voltages with same magnitude and opposite polarities. The bipolar DC power busway connects two independent DC voltages generated from the grid-tied power electronics converter to the power conversion unit. The power conversion unit can receive or send electric power from one or two independent DC voltage(s).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2210" publication-number="202628146"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628146.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電感組件</chinese-title>  
        <english-title>INDUCTIVE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">H01F27/34</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰商泰達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇拉普雷查庫　柴維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURAPRECHAKUL, CHAIWICHIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　作偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONGSASULUX, JAKRAPONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　振發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, CHIN HUAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種電感組件，包含第一磁芯、第二磁芯、內磁芯及扁平繞組部。第一磁芯及第二磁芯以相反的方向相互組接以形成封閉空間，第一磁芯包含第一蓋部及第一側部，第二磁芯包含第二蓋部及第二側部，第一側部與第二側部相互連接，第一蓋部與第二蓋部相互間隔。內磁芯設置於第一磁芯與第二磁芯之間且容置於封閉空間內。內磁芯包含本體部以及連接於本體部之兩個相異端之兩個突出部。扁平繞組部容置於封閉空間內並纏繞於內磁芯上。內磁芯的兩個突出部分別與第一蓋部及第二蓋部形成第一間隙及第二間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an inductive component including a first and a second magnetic cores, an inner core and a flat winding portion. The first and second magnetic cores are assembled to form an enclosed space. The first magnetic core includes a first cap portion and a first side portion, the second magnetic core includes a second cap portion and a second side portion. The inner core is accommodated in the enclosed space. The inner core includes a body portion and two extruding portions. A first gap and a second gap are provided between the two extruding portions and the first cap portion and the second cap portion respectively along a direction parallel to a winding plane of the flat winding portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電感組件</p>  
        <p type="p">2:第一磁芯</p>  
        <p type="p">20:第一蓋部</p>  
        <p type="p">21:第一側部</p>  
        <p type="p">201:第一凹面</p>  
        <p type="p">202:第一凹壁</p>  
        <p type="p">203:第一邊緣表面</p>  
        <p type="p">3:第二磁芯</p>  
        <p type="p">30:第二蓋部</p>  
        <p type="p">31:第二側部</p>  
        <p type="p">301:第二凹面</p>  
        <p type="p">302:第二凹壁</p>  
        <p type="p">303:第二邊緣表面</p>  
        <p type="p">4:內磁芯</p>  
        <p type="p">40:本體部</p>  
        <p type="p">41:突出部</p>  
        <p type="p">411:外表面</p>  
        <p type="p">412:外壁</p>  
        <p type="p">413:內表面</p>  
        <p type="p">5:扁平繞組部</p>  
        <p type="p">g1:第一間隙</p>  
        <p type="p">g2:第二間隙</p>  
        <p type="p">g3:第三間隙</p>  
        <p type="p">g4:第四間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2211" publication-number="202628445"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628445.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物理不可複製功能可識別的對等網路作為區塊鏈之可靠資料提供方</chinese-title>  
        <english-title>PHYSICAL UNCLONABLE FUNCTION IDENTIFIABLE PEER TO PEER NETWORK AS A RELIABLE DATA SUPPLIER TO A BLOCKCHAIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260401B">H04W12/06</main-classification>  
        <further-classification edition="200601120260401B">H04L9/32</further-classification>  
        <further-classification edition="200601120260401B">H04L12/66</further-classification>  
        <further-classification edition="201301120260401B">G06F21/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商橫杆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CROSSBAR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙星賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係通過不安全網路連接，利用計算設備實現安全對等網路。每個計算設備可包含或耦合來源證明硬體。來源證明硬體可通過可信伺服器等公開可用資料、有效來源證明資料的安全儲存或其他方式進行驗證。對等節點在對等網路上通過驗證後，可提供或接收網路服務，例如區塊鏈服務、鏈下資料預言機服務、支持智慧型合約的服務、分布式資料預言機服務、分布式網路閘道器服務等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A secure peer-to-peer network is implemented with computing devices over unsecure network connections. Each computing device can include or be coupled to a proof of origin hardware. The proof of origin hardware can be validated by publicly available data, such as a trusted server or by secure storage of valid proof of origin data, or other modality. Once validated on the peer-to-peer network, peer nodes can provide or can receive network services, such as blockchain services, off-chain data oracle services, smart contract-enabled services, distributed data oracle services, distributed network gateway services, among others.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:P2P網路</p>  
        <p type="p">402A:個人電腦、計算設備、電腦</p>  
        <p type="p">402B:計算設備、電腦</p>  
        <p type="p">402C:計算設備、電腦</p>  
        <p type="p">402D:計算設備、電腦</p>  
        <p type="p">402E:計算設備、電腦</p>  
        <p type="p">402F:計算設備、電腦</p>  
        <p type="p">412A:來源證明(PoO)設備、PoO設備</p>  
        <p type="p">412B:來源證明(PoO)設備、PoO設備</p>  
        <p type="p">412C:來源證明(PoO)設備、PoO設備</p>  
        <p type="p">412D:來源證明(PoO)設備、PoO設備</p>  
        <p type="p">412E:來源證明(PoO)設備、PoO設備</p>  
        <p type="p">412F:來源證明(PoO)設備、PoO設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2212" publication-number="202625984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於口腔衛生裝置的具有核心穩定性的間隙刷</chinese-title>  
        <english-title>EMBRASURE BRUSHES WITH CORE STABILITY FOR AN ORAL HYGIENE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A61C15/00</main-classification>  
        <further-classification edition="200601120260330B">A46B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史萊特牙科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLATE DENTAL, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯奈德　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANIEL, SNYDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種口腔衛生系統，其包含一種牙線器頭部配件，該牙線器頭部配件具有基座部分，基座部分帶有延伸的臂部來支撐間隙清潔部件和牙線細絲。該牙線細絲跨越於臂部和頭部配件，且該間隙清潔部件位於牙線細絲的末端與頭部配件的臂部相接。間隙清潔部件逐漸縮小並具有間隙形狀的橫截面。由此，間隙清潔部件可以透過牙線細絲在使用牙線時滑入和滑出間隙。間隙清潔部件可包含圍繞間隙清潔部件橫截面的彈性肋條。間隙清潔部件可由核心結構支撐，以在製造和使用過程中提供穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An oral hygiene system including a flosser headpiece with a base portion with arms extending to support an embrasure cleaning feature and flossing filament. The floss filament spans between the arms of the headpiece, and the embrasure cleaning features are located at the ends of the floss filament that meet the headpiece arms. The embrasure cleaning features are tapered and have embrasure-shaped cross-sections. As such, the embrasure cleaning features may slide into and out of embrasures during flossing via the floss filament. The embrasure cleaning features may include flexible ribbings surrounding the cross-sections of the embrasure cleaning features. The embrasure cleaning features may be supported by core structures that provide stability during manufacturing and use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:口腔護理裝置</p>  
        <p type="p">102:頭部配件</p>  
        <p type="p">104:手把或手把部分</p>  
        <p type="p">106:基座部分</p>  
        <p type="p">108:臂部</p>  
        <p type="p">110:間隙刷</p>  
        <p type="p">112:細絲</p>  
        <p type="p">114:頸部配件</p>  
        <p type="p">116:連鎖裝置</p>  
        <p type="p">118:刮削器</p>  
        <p type="p">200:頂部</p>  
        <p type="p">210:右側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2213" publication-number="202626988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140950</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬塗層形成用組成物、硬塗層、偏光板及影像顯示裝置</chinese-title>  
        <english-title>COMPOSITION FOR FORMING HARD COATING LAYER, HARD COATING LAYER, POLARIZING PLATE, AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09D133/14</main-classification>  
        <further-classification edition="200601120260401B">C09D4/00</further-classification>  
        <further-classification edition="201801120260401B">C09D7/63</further-classification>  
        <further-classification edition="201501120260401B">G02B1/14</further-classification>  
        <further-classification edition="200601120260401B">G02B5/30</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1335</further-classification>  
        <further-classification edition="200601120260401B">G09F9/00</further-classification>  
        <further-classification edition="200601120260401B">H05B33/02</further-classification>  
        <further-classification edition="202301120260401B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田謙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種硬塗層形成用組成物，其係用以形成可抑制偏光板中發生紅變的硬塗層。 &lt;br/&gt;本發明之硬塗層形成用組成物包含單體成分(a)、自由基聚合起始劑及具有環氧基之聚合物(X)；前述單體成分(a)含有具有兩個以上之(甲基)丙烯醯基的單體(a-1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a composition for forming a hard coating layer capable of suppressing the occurrence of reddening in a polarizing plate. &lt;br/&gt;The composition for forming a hard coating layer comprises a monomer component (a), a radical polymerization initiator, and an epoxy group-containing polymer (X); wherein the monomer component (a) contains a monomer (a-1) having two or more (meth)acryloyl groups.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:偏光板</p>  
        <p type="p">11:偏光鏡</p>  
        <p type="p">12:第一保護膜</p>  
        <p type="p">13:第二保護膜</p>  
        <p type="p">14:第一貼合層</p>  
        <p type="p">15:第二貼合層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2214" publication-number="202628274"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628274.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>端子模組</chinese-title>  
        <english-title>CONTACT ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260330B">H01R13/646</main-classification>  
        <further-classification edition="200601120260330B">H01R13/40</further-classification>  
        <further-classification edition="200601120260330B">H01R13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特倫斯　Ｆ　李托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERRANCE F, LITTLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐乙民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種端子模組，所述端子模組包括：一排信號端子；所述一排信號端子具有多個接觸部和多個安裝部；絕緣件，所述絕緣件固定所述一排信號端子；上遮罩片，所述上遮罩片位於所述一排信號端子的一側；及下遮罩片，所述下遮罩片位於所述一排信號端子的另一側；其中，所述上遮罩片和所述下遮罩片中的至少一個設有多個接地安裝部，所述接地安裝部與所述一排信號端子的所述多個安裝部對齊，所述上遮罩片和下遮罩片中的至少一個具有多個遮罩體，每個遮罩體位於所述一排信號端子的至少一對差分信號端子和相鄰的信號端子之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A contact assembly for an electrical connector comprises: a row of signal contacts having plural contacting portions and plural mounting portions, the row of signal contacts including at least one pair of differential signal contacts; an insulator secured to the row of signal contacts; and an upper ground plate and a lower ground plate surrounding the row of signal contacts; wherein at least one of the upper ground plate and the lower ground plate integrally has a plurality of ground mounting portions aligned with the plurality of mounting portions of the row of signal contacts; and at least one of the upper ground plate and the lower ground plate has a plurality of shields each located between the at least one pair of differential signal contacts and an adjacent signal contact of the row of signal contacts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6140:上遮罩片</p>  
        <p type="p">6141:下遮罩片</p>  
        <p type="p">70:遮罩體</p>  
        <p type="p">710:第一部分</p>  
        <p type="p">720:第二部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2215" publication-number="202626149"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626149.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>健身器材及其折疊方法</chinese-title>  
        <english-title>FITNESS DEVICE AND FOLDING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">A63B22/04</main-classification>  
        <further-classification edition="200601120251124B">A63B23/04</further-classification>  
        <further-classification edition="200601120251124B">F16G9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商熱情股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASSIONATE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具秀漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, SUHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種健身器材及其折疊方法。健身器材包括支撐機構、設置為與該支撐機構連接的踏板驅動組件、兩個踏板組件、與該兩個踏板組件連接的踏板牽引組件。踏板驅動組件包括環狀配置的第一滑輪組以及環繞該第一滑輪組的第一傳動件。兩個踏板組件設置於該支撐機構上且與該第一傳動件連接，以由該第一傳動件帶動而以彼此相反方向沿著該支撐機構進行一往復運動。踏板牽引組件包括第二傳動件以及裝設組件，裝設組件用以裝設該第二傳動件且連接於該踏板組件，俾利該兩個踏板組件在進行往復運動時相互牽引。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a fitness device and a folding method thereof. The fitness device includes a support structure, a pedal drive assembly connected to the support structure, two pedal assemblies, and a pedal traction assembly connected to the two pedal assemblies. The pedal drive assembly includes a first pulley assembly arranged in an annular shape and a first transmission member surrounding the first pulley assembly. The two pedal assemblies are arranged on the support structure and connected to the first transmission member so as to be driven by the first transmission member to perform reciprocating motion along the support structure in opposite directions. The pedal traction assembly includes a second transmission member and a mounting assembly. The mounting assembly is used to mount the second transmission member and is connected to the pedal assemblies, enabling the two pedal assemblies to pull each other during the reciprocating motion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">221:導軌</p>  
        <p type="p">222:第一橫桿</p>  
        <p type="p">223:第二橫桿</p>  
        <p type="p">224:中空橫桿</p>  
        <p type="p">30:踏板驅動組件</p>  
        <p type="p">31:第一滑輪組</p>  
        <p type="p">311:第一上滑輪</p>  
        <p type="p">312:第一下滑輪</p>  
        <p type="p">32:第一傳動件</p>  
        <p type="p">41:踏板裝設架</p>  
        <p type="p">44:管狀連接件</p>  
        <p type="p">45:第二滑輪裝設架</p>  
        <p type="p">50:踏板牽引組件</p>  
        <p type="p">51:第二滑輪組</p>  
        <p type="p">511:第二滑輪</p>  
        <p type="p">52:第二傳動件</p>  
        <p type="p">70:阻擋元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2216" publication-number="202625895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腳釘罩及具備該腳釘罩的折疊式支架</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">A01K97/10</main-classification>  
        <further-classification edition="200601120251130B">A01K87/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古洛布萊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBERIDE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西守雅人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMORI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可防止零件的丟失，並且可舒適地使用之用於折疊式支架的腳釘罩及具備該腳釘罩的折疊式支架。&lt;br/&gt; 本發明的解決手段為一種腳釘罩4，在具有複數個腳部3的折疊式支架的腳部3的頂端側覆蓋腳釘23，腳釘罩4具備：第一蓋部31，在腳部3之中一個腳部的軸向上可移動而配設，並且在折疊時覆蓋腳釘23；複數個第二蓋部32、33，連結於第一蓋部31，並且在將腳部3折疊時覆蓋其他複數個腳部的腳釘23，第二蓋部32、33具有插拔腳部3的頂端的缺口部44。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:連結本體部</p>  
        <p type="p">3:腳部</p>  
        <p type="p">3A:中央腳部</p>  
        <p type="p">4:腳釘罩</p>  
        <p type="p">15:釣錘懸吊部</p>  
        <p type="p">21:內筒</p>  
        <p type="p">22:外筒</p>  
        <p type="p">23:腳釘</p>  
        <p type="p">24:調節桿</p>  
        <p type="p">25、26:凹槽</p>  
        <p type="p">27a:端面</p>  
        <p type="p">32、33:第二蓋部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2217" publication-number="202626883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光電子裝置的絕緣膜、光電子裝置及可固化組合物</chinese-title>  
        <english-title>INSULATING FILM FOR OPTOELECTRONIC DEVICE, OPTOELECTRONIC DEVICE AND CURABLE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C08G77/20</main-classification>  
        <further-classification edition="200601120260316B">C08G77/52</further-classification>  
        <further-classification edition="200601120260316B">C08G77/54</further-classification>  
        <further-classification edition="200601120260316B">C08L83/04</further-classification>  
        <further-classification edition="200601120260316B">C08F2/06</further-classification>  
        <further-classification edition="200601120260316B">C09D5/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商赫拉化學科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERACHEM TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹榮熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, YOUNG HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁奇錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KI SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之態樣提供一種用於光電子裝置的絕緣膜，其即使在高溫固化條件下也能防止裂紋形成，並且在固化之後可呈現優異的耐久性；及一種製造該絕緣膜的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aspect of the present disclosure provides an insulating film for an optoelectronic device that may prevent crack formation even under high-temperature curing conditions and may exhibit excellent durability after curing, and a method for manufacturing the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2218" publication-number="202625935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於椅子的空氣產生設備及椅子組件</chinese-title>  
        <english-title>AIR-GENERATION APPARATUS FOR A CHAIR AND CHAIR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A47C7/62</main-classification>  
        <further-classification edition="200601120260331B">A47C7/74</further-classification>  
        <further-classification edition="200601120260331B">A47C7/40</further-classification>  
        <further-classification edition="200601120260331B">A47C15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商雷蛇（亞太）私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAZER (ASIA-PACIFIC) PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　川良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHUANLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種空氣產生設備，其包括可耦接至椅子的氣流歧管。氣流歧管包括進氣結構、出氣結構、及氣流導管以引導空氣從進氣結構至出氣結構。空氣產生設備包括風扇單元，用以導引空氣流經氣流歧管；溫度調控單元，用以調控從氣流歧管排出的空氣的溫度；溫度感測裝置，用以感測空氣的溫度；氣流感測裝置，設置以感測空氣的流量；風扇控制模組，用以基於來自氣流感測裝置的空氣的確定流量來控制風扇單元的轉速；以及溫度控制模組，配置為基於來自溫度感測裝置的空氣的確定溫度來控制溫度調控單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An air-generation apparatus including an airflow manifold couplable to a chair. The airflow manifold includes an air inlet formation, an air outlet formation, and an airflow conduit to guide the air from the air inlet formation to the air outlet formation. The air-generation apparatus includes a fan unit to direct the air through the airflow manifold; a temperature regulating unit to regulate a temperature of the air exiting the airflow manifold; a temperature sensing arrangement to sense a temperature of the air; an airflow sensing arrangement disposed to sense a rate of flow of the air; a fan control module to control a speed of the fan unit based on a determined rate of flow of the air from the airflow sensing arrangement; and a temperature control module configured to control the temperature regulating unit based on a determined temperature of the air from the temperature sensing arrangement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:椅子組件</p>  
        <p type="p">102:空氣產生設備</p>  
        <p type="p">110:氣流歧管</p>  
        <p type="p">111:氣流導管</p>  
        <p type="p">113:進氣結構</p>  
        <p type="p">116:出氣結構</p>  
        <p type="p">120:風扇單元</p>  
        <p type="p">122:馬達</p>  
        <p type="p">124:風扇葉片</p>  
        <p type="p">130:氣流感測裝置</p>  
        <p type="p">140:風扇控制模組</p>  
        <p type="p">150:溫度調控單元</p>  
        <p type="p">152:熱交換元件</p>  
        <p type="p">160:溫度感測裝置</p>  
        <p type="p">170:溫度控制模組</p>  
        <p type="p">180:環境溫度感測裝置</p>  
        <p type="p">190:椅子</p>  
        <p type="p">191:靠背部</p>  
        <p type="p">192:座位部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2219" publication-number="202626969"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626969.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光電子裝置的絕緣膜、光電子裝置及可固化組合物</chinese-title>  
        <english-title>INSULATING FILM FOR OPTOELECTRONIC DEVICE, OPTOELECTRONIC DEVICE AND CURABLE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C08L83/04</main-classification>  
        <further-classification edition="200601120260318B">C08J5/18</further-classification>  
        <further-classification edition="200601120260318B">C08K5/544</further-classification>  
        <further-classification edition="200601120260318B">H01B3/46</further-classification>  
        <further-classification edition="202301120260318B">H10K50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商赫拉化學科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERACHEM TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹榮熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, YOUNG HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁奇錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KI SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之態樣提供一種用於光電子裝置的絕緣膜，其即使在高溫固化條件下也能防止裂紋形成，並且在固化之後可呈現優異的耐久性；及一種製造該絕緣膜的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aspect of the present disclosure provides an insulating film for an optoelectronic device that may prevent crack formation even under high-temperature curing conditions and may exhibit excellent durability after curing, and a method for manufacturing the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2220" publication-number="202628858"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628858.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於清潔用於半導體基板之運送及大氣儲存的輸送容器之方法和工作站</chinese-title>  
        <english-title>METHOD AND STATION FOR CLEANING A TRANSPORT ENCLOSURE FOR CONVEYING AND ATMOSPHERIC STORAGE OF SEMICONDUCTOR SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P70/00</main-classification>  
        <further-classification edition="200601120260401B">B08B3/04</further-classification>  
        <further-classification edition="200601120260401B">B08B5/02</further-classification>  
        <further-classification edition="202601120260401B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商普發真空公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFEIFFER VACUUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝雷　伯翠德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLET, BERTRAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴舍利爾　尼古拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BACHELLIER, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邦努爾　朱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUNOUAR, JULIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於清潔用於半導體基板之運送及大氣儲存的輸送容器(2)之方法(100)，包含以下接續的步驟： &lt;br/&gt;　　第一、潤濕步驟(101)，在此步驟期間，輸送容器(2)之殼體(3)的內壁係以少於200 ml/m&lt;sup&gt;2&lt;/sup&gt;(0.0002 m&lt;sup&gt;3&lt;/sup&gt;/m&lt;sup&gt;2&lt;/sup&gt;)[諸如少於100 ml/m&lt;sup&gt;2&lt;/sup&gt;(0.0001 m&lt;sup&gt;3&lt;/sup&gt;/m&lt;sup&gt;2&lt;/sup&gt;)]之預定量的液態水潤濕； &lt;br/&gt;　　第二、連續脫濕步驟(102)，藉由噴灑一加壓氣體射流，在此噴灑期間控制關節式機械手臂(23)之操控，以便沿著一條軌跡並以氣體射流允許此加壓氣體射流將沉積於內壁上之液體驅動至殼體(3)外側的取向，在此殼體(3)中位移氣體噴灑裝置(26)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for cleaning (100) a transport chamber (2) for conveying and atmospheric storage of semiconductor substrates comprising the following succession of steps:&lt;br/&gt; - a first, wetting step (101) during which the internal walls of an casing (3) of the transport enclosure (2) are wetted with a predetermined quantity of liquid water of less than 200 ml/m&lt;sup&gt;2&lt;/sup&gt; (0.0002m&lt;sup&gt;3&lt;/sup&gt;/m&lt;sup&gt;2&lt;/sup&gt;), such as less than 100ml/m&lt;sup&gt;2&lt;/sup&gt; (0.0001m&lt;sup&gt;3&lt;/sup&gt;/m&lt;sup&gt;2&lt;/sup&gt;); &lt;br/&gt;- a second, successive de-wetting step (102) by spraying of a jet of pressurised gas, during which the piloting of an articulated arm (23) is controlled in order to displace the gas spraying device (26) in the casing (3), along a trajectory and in an orientation of the gas jet allowing the jet of pressurised gas to drive the liquid deposited on the internal walls outside the casing (3).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:清潔站</p>  
        <p type="p">2:輸送容器</p>  
        <p type="p">3:殼體</p>  
        <p type="p">9:可拆卸之門件</p>  
        <p type="p">10:清潔室</p>  
        <p type="p">11:機器人</p>  
        <p type="p">12:介面</p>  
        <p type="p">13:內部載入埠</p>  
        <p type="p">16:夾緊鉗</p>  
        <p type="p">18:存在感測器</p>  
        <p type="p">19:光纖</p>  
        <p type="p">20:門件致動器</p>  
        <p type="p">21:緩衝室</p>  
        <p type="p">22:外部載入埠</p>  
        <p type="p">23:關節式機械手臂</p>  
        <p type="p">24:頭部</p>  
        <p type="p">25:基座</p>  
        <p type="p">26:氣體噴灑裝置</p>  
        <p type="p">27:裝置</p>  
        <p type="p">28:位移裝置</p>  
        <p type="p">29:存放架</p>  
        <p type="p">32:液壓管路</p>  
        <p type="p">35:氣體管道</p>  
        <p type="p">36:氣體淋洗裝置</p>  
        <p type="p">37:吹掃裝置</p>  
        <p type="p">40:控制單元</p>  
        <p type="p">X1:第一軸</p>  
        <p type="p">X2:第二軸</p>  
        <p type="p">X3:第三軸</p>  
        <p type="p">X4:第四軸</p>  
        <p type="p">X5:第五軸</p>  
        <p type="p">X6:第六軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2221" publication-number="202627367"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627367.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調節的太陽能排放夾</chinese-title>  
        <english-title>ADJUSTABLE SOLAR DRAIN CLIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260331B">F24S40/44</main-classification>  
        <further-classification edition="201401120260331B">H02S40/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商班狄特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDUIT CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調節的太陽能排放夾，用於從太陽能板框架和太陽能板上清除水、污垢和碎屑。該可調節的太陽能排放夾包括排放夾主體和排放夾閂鎖。排放夾主體包括上部構件，該上部構件具有從該上部構件的中心延伸的脊部。多個指狀部從上部構件的頂部延伸。排放夾閂鎖包括基部構件，該基部構件帶有兩個閂鎖構件和從基部構件前部延伸的彎曲夾持墊。排放夾閂鎖通過互鎖的齒可調節地固定到排放夾主體的脊部，以形成可調節的太陽能排放夾。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:太陽能排放夾</p>  
        <p type="p">30:排放夾主體</p>  
        <p type="p">32:上部構件</p>  
        <p type="p">50:脊部</p>  
        <p type="p">70:指狀部</p>  
        <p type="p">100:排放夾閂鎖</p>  
        <p type="p">110:柔性閂鎖構件</p>  
        <p type="p">146:釋放凸片</p>  
        <p type="p">150:彎曲夾持墊</p>  
        <p type="p">152:凸肋部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2222" publication-number="202628421"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628421.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊編碼方法、視訊解碼方法以及使用視訊編碼方法的解碼器</chinese-title>  
        <english-title>VIDEO DECODING METHOD, VIDEO ENCODING METHOD FOR REMOTE RENDERING AND DECODER USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/44</main-classification>  
        <further-classification edition="201401120251201B">H04N19/537</further-classification>  
        <further-classification edition="201401120251201B">H04N19/105</further-classification>  
        <further-classification edition="201401120251201B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王聖博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於遠端渲染的視訊編碼方法包括：一種編碼方法，其取得第一影像畫面和第二影像畫面，使用深度資訊執行區域式分割，產生包含視角轉換矩陣、控制點和用於描述影像畫面轉換的移動向量之轉換資料，並輸出第一影像畫面和轉換資料；以及解碼方法，其透過基於控制點執行視角轉換和變形操作，使用第一影像畫面和轉換資料來重建第二影像畫面。此方法透過利用三維資訊進行區域式預測，使得已渲染內容能夠有效編碼，使得所提供的方法能夠在維持深度一致性的同時有效追蹤相機移動和物件變形，從而相較於傳統方法減少在遠端渲染中要傳輸的視訊串流大小，並降低傳輸負載。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A video coding method for remote rendering includes: an encoding method that obtains a first frame and a second frame, performs region-based segmentation using depth information, generates transition data comprising view transformation matrices, control points, and moving vectors for describing frame transitions, and outputs the first frame with the transition data; and a decoding method that reconstructs the second frame using the first frame and transition data through view transformation and deformation operations based on the control points. This approach enables efficient coding of rendered content by leveraging three-dimensional information for region-based prediction, such that the provided methods efficiently tracks both camera movements and object deformations while maintaining depth consistency, thereby reducing the size of the video stream to be transferred in the remote rendering system compared to traditional approaches, and decreasing the transmission load on the system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210-S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2223" publication-number="202626910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含對苯二甲酸雙（２－羥基乙基）酯的再循環原料組成物及用於製備其之方法</chinese-title>  
        <english-title>RECYCLED RAW MATERIAL COMPOSITION COMPRISING BIS(2-HYDROXYETHYL) TEREPHTHALATE AND METHOD FOR PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J11/24</main-classification>  
        <further-classification edition="200601120260401B">C07C67/03</further-classification>  
        <further-classification edition="200601120260401B">C07C67/56</further-classification>  
        <further-classification edition="200601120260401B">C07C69/82</further-classification>  
        <further-classification edition="200601120260401B">B01J31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ化學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳佳姈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, GAYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金芝勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李仲基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOONG KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於製備再循環原料組成物的方法，其包含根據由廢聚酯解聚合獲得的對苯二甲酸雙(2-羥基乙基)酯溶液中所殘留發色團的組成來分批添加吸附劑，可最大化吸附效率，藉此能夠將發色團去除到單次吸附難以達到的位準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for preparing a recycled raw material composition, which comprises dividing the addition of an adsorbent according to the composition of chromophores remaining in a bis(2-hydroxyethyl) terephthalate solution obtained by depolymerizing waste polyester, can maximize adsorption efficiency, whereby it is possible to remove chromophores to a level that is difficult to achieve with a single adsorption.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2224" publication-number="202626729"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626729.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗體藥物結合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C07K16/28</main-classification>  
        <further-classification edition="200601120260331B">C07H21/00</further-classification>  
        <further-classification edition="201701120260331B">A61K47/68</further-classification>  
        <further-classification edition="200601120260331B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津田敏史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUDA, TOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田淵俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABUCHI, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊秀昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林宏行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石崎雅之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZAKI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原香生子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, KYOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田悌司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, TEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井雅巳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, MASAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係冀望開發：具有STING促效劑活性的新穎CDN衍生物、及使用了該新穎CDN衍生物之與STING促效劑活性有關的疾病之治療劑及/或治療法。又，冀望開發：可將該新穎CDN衍生物特異性地送達至目的之細胞或臓器之與STING促效劑活性有關的疾病之治療劑及/或治療法。 &lt;br/&gt;本發明之解決手段係藉由本發明，提供具有強的STING促效劑活性的新穎CDN衍生物、含有新穎CDN衍生物的抗體CDN衍生物結合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2225" publication-number="202628126"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628126.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141110</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生切片檢查計劃的方法和系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR GENERATING A BIOPSY PLAN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260309B">G16H30/40</main-classification>  
        <further-classification edition="202401120260309B">G06T3/147</further-classification>  
        <further-classification edition="202401120260309B">G06T3/02</further-classification>  
        <further-classification edition="201701120260309B">G06T7/593</further-classification>  
        <further-classification edition="202301120260309B">G06F18/25</further-classification>  
        <further-classification edition="200601120260309B">G06F17/10</further-classification>  
        <further-classification edition="201801120260309B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商生物機器人醫療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOBOT SURGICAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢國譽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, GUOYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅　蘭英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POH, LAN ENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀　有為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEE, YEW HWEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　佳蘊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEE, JIA YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於產生一切片檢查計劃的方法包括自複數個經儲存切片檢查模板中取得一經選擇切片檢查模板。該經選擇切片檢查模板包含一器官之一第一三維(3D)模型及在空間上分佈在該第一3D模型上的複數個切片檢查芯位置。基於來自一患者的該器官之影像資料來產生該器官之一第二3D模型。應用一融合演算法而將來自該第一3D模型的該複數個切片檢查芯位置中之每個切片檢查芯位置映射到該第二3D模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for generating a biopsy plan includes retrieving a selected biopsy template from a plurality of stored biopsy templates. The selected biopsy template comprises a first 3-dimensional (3D) model of an organ and a plurality of biopsy core positions spatially distributed on the first 3D model. A a second 3D model of the organ is generated based on image data of the organ from a patient. A fusion algorithm is applied to map each of the plurality of biopsy core positions from the first 3D model to the second 3D model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:流程圖</p>  
        <p type="p">102、104、106:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2226" publication-number="202627161"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627161.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用化學鍵合劑來形成薄膜的方法</chinese-title>  
        <english-title>METHOD OF FORMING THIN FILM USING CHEMICAL BONDING AGENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C16/34</main-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="202301120260401B">H10B12/00</further-classification>  
        <further-classification edition="202501120260401B">H10D1/68</further-classification>  
        <further-classification edition="202501120260401B">H10D64/01</further-classification>  
        <further-classification edition="202501120260401B">H10D64/66</further-classification>  
        <further-classification edition="202601120260401B">H10P14/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＧＴＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGTM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹圭鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KYU HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金才玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAE MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓智娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JI YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐德炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, DUCK HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭主煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JU HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韓彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAN BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金明鎰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MYEONG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泰英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAE YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明之一實施例，一種使用π鍵合材料來形成薄膜的方法包含：一π鍵合材料供應步驟，其係將π鍵合材料供應至放置有一基材之腔室中且使該π鍵合材料吸附到該基材上；一吹掃該腔室之內部的步驟；一金屬前驅物供應步驟，其係將金屬前驅物供應至該腔室中且使該金屬前驅物吸附到該基材上；一吹掃該腔室之內部的步驟；及一薄膜形成步驟，其係將反應材料供應至該腔室中以與被吸附的金屬前驅物反應並形成一薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment of the present invention, a method of forming a thin film using a pi‑bonding material comprises: a pi‑bonding material supply step of supplying a pi‑bonding material into a chamber in which a substrate is placed and adsorbing the pi‑bonding material on the substrate; a step of purging the inside of the chamber; a metal precursor supply step of supplying a metal precursor into the chamber and adsorbing the metal precursor on the substrate; a step of purging the inside of the chamber; and a thin film forming step of supplying a reaction material into the chamber to react with the adsorbed metal precursor and form a thin film.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2227" publication-number="202626842"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626842.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>交聯物</chinese-title>  
        <english-title>CROSS-LINKED ARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G61/08</main-classification>  
        <further-classification edition="200601120260401B">C08J3/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寶理塑膠贏創有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPLASTICS-EVONIK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川友紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>六田充輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTSUDA, MITSUTERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>落合拓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHIAI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種交聯物，其係聚辛烯體之交聯物，上述聚辛烯體具有下述式(1)所表示之結構，上述交聯物不含有機過氧化物。 &lt;br/&gt;&lt;img align="absmiddle" height="107px" width="333px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a cross-linked article, the above cross-linked article is a cross-linked article of polyoctenamer, wherein the above poyoctenamer has a structure represented by following formula (1) and the above cross-linked article does not contain organic peroxide. &lt;br/&gt;&lt;img align="absmiddle" height="95px" width="310px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。  &lt;br/&gt;本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2228" publication-number="202627212"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627212.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔離件、電解單元、及氫製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260320B">C25B1/04</main-classification>  
        <further-classification edition="202101120260320B">C25B9/21</further-classification>  
        <further-classification edition="201601120260320B">H01M8/023</further-classification>  
        <further-classification edition="201601120260320B">H01M8/0241</further-classification>  
        <further-classification edition="201601120260320B">H01M8/0202</further-classification>  
        <further-classification edition="200601120260320B">H01B3/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福壽陸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUJU, RIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池上雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGAMI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田勇人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鳥谷和正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯屋谷和志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYATANI, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島隆芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASHIMA, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮脇秀旗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAWAKI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之隔離件係用於利用導電性流體中所含之水來製造氫之電解單元中之隔離件，其具備導電板、及覆蓋上述導電板之一部分之絕緣層。上述導電板具備：電解區域，其形成於上述導電板之第一面之中央部；及供給歧管，其形成於上述第一面之包圍上述中央部之外周部，且貫通上述導電板。上述絕緣層具備：第一被覆部，其覆蓋上述供給歧管之內周面；及第二被覆部，其形成從上述供給歧管連接至上述電解區域之槽狀供給路徑。上述電解區域從上述絕緣層露出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:隔離件</p>  
        <p type="p">5a:第一面</p>  
        <p type="p">5α:中央部</p>  
        <p type="p">5β:外周部</p>  
        <p type="p">5P:導電板</p>  
        <p type="p">6:絕緣層</p>  
        <p type="p">50:電解區域</p>  
        <p type="p">50c:凹部</p>  
        <p type="p">51:供給歧管</p>  
        <p type="p">52:供給路徑</p>  
        <p type="p">52r:整流部</p>  
        <p type="p">52s:狹縫部</p>  
        <p type="p">53:排出歧管</p>  
        <p type="p">54:排出路徑</p>  
        <p type="p">54r:整流部</p>  
        <p type="p">54s:狹縫部</p>  
        <p type="p">55:排氣歧管</p>  
        <p type="p">62:第二被覆部</p>  
        <p type="p">65:第五被覆部</p>  
        <p type="p">67:凸部</p>  
        <p type="p">501:供給緣</p>  
        <p type="p">502:排出緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2229" publication-number="202628492"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628492.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在電漿腔室內減少互調失真之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR REDUCING INTERMODULATION DISTORTION IN A PLASMA CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05H7/02</main-classification>  
        <further-classification edition="200601120260401B">H05H1/02</further-classification>  
        <further-classification edition="200601120260401B">H05H1/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＭＫＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞多姆斯基　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RADOMSKI, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史文森　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWENSON, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉特林　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GITLIN, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲斯克　賴瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISK, LARRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯茲斯基　法拉迪米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOZITSKY, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈林頓　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRINGTON, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於在電漿腔室內減少互調失真之電源供應系統包括：源RF產生器，其在第一頻率下產生源RF訊號；偏壓RF產生器，其在低於所述第一頻率的第二頻率下產生偏壓RF訊號；耦合至產生器兩者的匹配網路；耦合至所述匹配網路的負載；及控制器。所述控制器接收來自所述偏壓RF產生器的同步訊號以將所述源RF產生器的操作與所述偏壓RF產生器同步；獲得特徵資料，其對應於在所述偏壓RF產生器之第n週期期間的反射訊號；及基於在所述第n週期期間獲得的所述特徵資料來調整在緊接週期期間的所述源RF訊號之頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply system for reducing intermodulation distortion in a plasma chamber comprises a source RF generator generating a source RF signal at a first frequency, a bias RF generator generating a bias RF signal at a second frequency lower than the first frequency, a matching network coupled to both generators, a load coupled to the matching network, and a controller. The controller receives a synchronization signal from the bias RF generator to synchronize operation of the source RF generator with the bias RF generator, obtains characteristic data corresponding to a reflected signal during an nth period of the bias RF signal, and adjusts a frequency of the source RF signal during a subsequent period based on the characteristic data obtained during the nth period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:雙電源輸入電漿系統/電漿系統</p>  
        <p type="p">312:第一電極/電極</p>  
        <p type="p">314:地</p>  
        <p type="p">316:第二電極/電極</p>  
        <p type="p">318:第一直流或RF電源/第一電源/電源</p>  
        <p type="p">320:第二電源</p>  
        <p type="p">322:電漿</p>  
        <p type="p">324:電漿腔室</p>  
        <p type="p">326:表面區域</p>  
        <p type="p">328:表面區域</p>  
        <p type="p">330:非對稱鞘層/鞘層</p>  
        <p type="p">332:接地鞘層/鞘層</p>  
        <p type="p">334:帶電荷鞘層/鞘層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2230" publication-number="202627233"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627233.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器用端子材料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C25D7/00</main-classification>  
        <further-classification edition="200601120260330B">C25D5/12</further-classification>  
        <further-classification edition="200601120260330B">H01R13/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北野麻奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITANO, MANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樽谷圭栄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARUTANI, YOSHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>匝瑳宏信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOSA, HIRONOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, KOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鎳層的平均厚度為0.15mm以上4.0mm以下，且前述銅錫合金層的平均厚度為0.15μm以上0.8μm以下，並且在與基材的壓延方向平行的剖面中，將連接部的銅錫合金層與錫層的合計面積中，錫層的面積率設為X%，將銲接部的銅錫合金層與錫層的合計面積中，錫層的面積率設為Y%時，X%為21%以上50%以下，Y%為31%以上90%以下，Y＞X，且其差值在10%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接器用端子材料</p>  
        <p type="p">21:基材</p>  
        <p type="p">22:連接部用皮膜</p>  
        <p type="p">23:銲接部用皮膜</p>  
        <p type="p">31:鎳層</p>  
        <p type="p">33:銅錫合金層</p>  
        <p type="p">35:錫層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2231" publication-number="202627142"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627142.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成薄膜的方法</chinese-title>  
        <english-title>METHOD FOR FORMING THIN FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C23C14/26</main-classification>  
        <further-classification edition="200601120260318B">C23C14/04</further-classification>  
        <further-classification edition="200601120260318B">C23C16/513</further-classification>  
        <further-classification edition="200601120260318B">C23C16/452</further-classification>  
        <further-classification edition="201601120260318B">C23C4/137</further-classification>  
        <further-classification edition="202001320260318B">G06F115/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金英雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG WOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種在一基板上形成一薄膜的方法，其中形成薄膜的方法包含將基板裝載至腔體中的步驟、將基板從加熱器定位在第一位置、將基板定位在第二位置以及在第一位置及/或第二位置於基板的頂面及底面的部分或全部部分上沉積薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for forming a thin film on a substrate, wherein the method comprises a step for loading the substrate into a chamber; positioning the substrate at a first position from a heater; positioning the substrate at a second position; and depositing a thin film on a portion or all portions of an upper surface and a lower surface of the substrate at the first position and/or the second position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理設備</p>  
        <p type="p">2:腔體</p>  
        <p type="p">3:加熱器</p>  
        <p type="p">5:基板支撐銷</p>  
        <p type="p">6:銷升降器</p>  
        <p type="p">7:升降裝置</p>  
        <p type="p">30:頂面</p>  
        <p type="p">61:銷升降單元</p>  
        <p type="p">62:銷板</p>  
        <p type="p">63:銷升降件</p>  
        <p type="p">64:銷連接件</p>  
        <p type="p">71:升降單元</p>  
        <p type="p">72:升降體</p>  
        <p type="p">73:升降連接件</p>  
        <p type="p">100:處理空間</p>  
        <p type="p">110:底空間</p>  
        <p type="p">200:基板</p>  
        <p type="p">230:頂面</p>  
        <p type="p">611:銷升降桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2232" publication-number="202628418"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628418.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用用於轉換係數之位置的碼字的編碼器、解碼器、系統、用於解碼之方法、用於編碼之方法、資料串流以及電腦程式</chinese-title>  
        <english-title>ENCODER, DECODER, SYSTEM, METHOD FOR DECODING, METHOD FOR ENCODING, DATA STREAM AND COMPUTER PROGRAM USING A CODE WORD FOR THE POSITION OF A TRANSFORM COEFFICIENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260326B">H04N19/18</main-classification>  
        <further-classification edition="201401120260326B">H04N19/91</further-classification>  
        <further-classification edition="201401120260326B">H04N19/13</further-classification>  
        <further-classification edition="200601120260326B">H03M7/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗勞恩霍夫爾協會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克曲后弗　辛納爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRCHHOFFER, HEINER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮恩特卡　蘇菲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIENTKA, SOPHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫姆瑞區　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELMRICH, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕雅夫　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFAFF, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史瓦茲　希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWARZ, HEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬皮　迪特利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARPE, DETLEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛德　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEGAND, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於藉由使用區塊式轉換解碼自一資料串流解碼一一維數位波形信號之解碼器，該解碼器經組配以藉由以下操作而自該資料串流解碼該一維數位波形信號之一預定區塊之一轉換係數序列：自該資料串流導出一位置資訊，使用該位置資訊來定位該轉換係數序列中之一位置；以及自該資料串流解碼該轉換係數序列之在該轉換係數序列中之該位置之前的一或多個第一轉換係數，且對該轉換係數序列之在該轉換係數序列中之該位置之後的一或多個第二轉換係數賦予一預定值。進一步揭露一種編碼器、一種系統、方法、一種資料串流及一種電腦程式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A decoder for decoding a one-dimensional digital waveform signal from a data stream by use of block-wise transform decoding, the decoder configured to decode a sequence of transform coefficients of a predetermined block of the one-dimensional digital waveform signal from the data stream by deriving a position information from the data stream, locating, using the position information, a position in the sequence of transform coefficients; and decoding one or more first transform coefficients of the sequence of transform coefficients from the data stream, which precede the position in the sequence of transform coefficients, and attributing a predetermined value to one or more second transform coefficients of the sequence of transform coefficients, which follow the position in the sequence of transform coefficients. Further disclosed is an encoder, a system, methods, a data stream and a computer program.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:解碼器</p>  
        <p type="p">16:資料串流，串流</p>  
        <p type="p">101:預定區塊，經重建構區塊</p>  
        <p type="p">102:一維數位波形信號，多維數位波形信號</p>  
        <p type="p">103:轉換係數序列，序列，轉換係數</p>  
        <p type="p">104:位置，第一轉換係數</p>  
        <p type="p">105:第一轉換係數</p>  
        <p type="p">106:第二轉換係數</p>  
        <p type="p">107:碼字</p>  
        <p type="p">108:位置資訊，位置</p>  
        <p type="p">109:旗標</p>  
        <p type="p">158:序列獲得器</p>  
        <p type="p">159:位置資訊導出器，位置導出器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2233" publication-number="202628895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141222</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於玻璃基板半導體封裝的傳送容器插槽自動掃描裝置</chinese-title>  
        <english-title>AUTOMATIC SCANNING APPARATUS FOR CARRIER SLOT FOR GLASS SUBSTRATE SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260319B">H10P72/30</main-classification>  
        <further-classification edition="202601120260319B">H10P95/00</further-classification>  
        <further-classification edition="200601120260319B">B65D85/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹相敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, SANGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金延埈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNJUNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式涉及一種用於玻璃基板半導體封裝工廠自動化的用於玻璃基板半導體封裝的傳送容器插槽自動掃描裝置，更具體而言，涉及一種用於玻璃基板半導體封裝的傳送容器插槽自動掃描裝置，該裝置能夠通過自動掃描根據傳送容器插槽的玻璃基板的位置和數量，並與製造執行服務系統中的相關資訊進行比較，從而實現同步。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automatic carrier slot scanning apparatus for glass substrate semiconductor packages according to the embodiment scans positions and the number of glass substrates allocated on a lot basis for each slot of carriers, which are handled in a glass substrate semiconductor package factory and each of which has an identification code attached thereto, compares scanned information with slot information of a manufacturing execution system, and includes a list generation unit configured to generate a list of carriers stored in each stocker, a scan task preparation unit configured to search for process equipment, which allows a scan task to be performed, and prepare the scan task, a scan task execution unit configured to select any one carrier included in the list, load the selected carrier into the process equipment, and automatically scan positions and the number of glass substrates for each slot of the carrier, a scan information comparison unit configured to compare scan information, which is output according to the automatic scanning and corresponds to the positions and the number of glass substrates for the slots of the carrier, with slot information previously stored in the manufacturing execution system, and to determine whether the scan information matches the slot information, and an error occurrence notification unit configured to, when the scan information does not match the slot information based on a result of determining whether the scan information matches the slot information, set the carrier to a holding state, store the carrier in the stocker, and transmit an error occurrence signal to an administrator terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用於玻璃基板半導體封裝的傳送容器插槽自動掃描裝置</p>  
        <p type="p">110:列表創建部</p>  
        <p type="p">120:掃描作業準備部</p>  
        <p type="p">121:製程設備搜索部</p>  
        <p type="p">122:製程設備狀態變更部</p>  
        <p type="p">123:掃描作業預約部</p>  
        <p type="p">130:掃描作業執行部</p>  
        <p type="p">131:傳送容器選擇部</p>  
        <p type="p">132:傳送容器出庫部</p>  
        <p type="p">133:傳送容器傳送部</p>  
        <p type="p">134:傳送容器裝載部</p>  
        <p type="p">135:傳送容器插槽掃描部</p>  
        <p type="p">136:插槽資訊傳輸部</p>  
        <p type="p">137:傳送容器卸載部</p>  
        <p type="p">140:掃描資訊比較部</p>  
        <p type="p">141:資訊接收部</p>  
        <p type="p">142:位置數量比較部</p>  
        <p type="p">143:比較結果輸出部</p>  
        <p type="p">150:錯誤發生通知部</p>  
        <p type="p">151:第一錯誤判斷部</p>  
        <p type="p">152:第二錯誤判斷部</p>  
        <p type="p">153:傳送容器返送部</p>  
        <p type="p">153:傳送容器入庫部</p>  
        <p type="p">154:錯誤資訊傳輸部</p>  
        <p type="p">155:錯誤資訊傳輸部</p>  
        <p type="p">160:掃描作業結束部</p>  
        <p type="p">161:掃描作業解除部</p>  
        <p type="p">162:製程設備狀態恢復部</p>  
        <p type="p">300:製程管理伺服器</p>  
        <p type="p">400:製造執行服務系統</p>  
        <p type="p">500:管理員終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2234" publication-number="202626843"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626843.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>交聯物及交聯物的製造方法</chinese-title>  
        <english-title>CROSSLINKED BODY AND METHOD FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G61/08</main-classification>  
        <further-classification edition="200601120260401B">C08L65/00</further-classification>  
        <further-classification edition="200601120260401B">C08K5/14</further-classification>  
        <further-classification edition="200601120260401B">C08K3/20</further-classification>  
        <further-classification edition="200601120260401B">C08J3/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寶理塑膠贏創有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPLASTICS-EVONIK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川友紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>六田充輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTSUDA, MITSUTERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>落合拓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHIAI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種交聯物，其係包含聚辛烯(polyoctenamer)及交聯劑之組成物之交聯物，並且，上述聚辛烯具有下述式(1)所表示之結構，上述交聯劑含有有機過氧化物，且不含穩定劑。 &lt;br/&gt;&lt;img align="absmiddle" height="100px" width="339px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A crosslinked body comprising a crosslinked product of a composition containing a polyoctenamer and a crosslinking agent, wherein the polyoctenamer has a structure represented by the following formula (1), &lt;br/&gt;&lt;img align="absmiddle" height="89px" width="338px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and the crosslinking agent contains an organic peroxide and is free of a stabilizer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2235" publication-number="202628275"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628275.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器以及連接器組件</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251122B">H01R13/646</main-classification>  
        <further-classification edition="201101120251122B">H01R13/658</further-classification>  
        <further-classification edition="200601120251122B">H01R13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊藤芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, TENGFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚坤磷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KUNLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾晨輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, CHENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁雙峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, SHUANGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器包括第一導電本體以及第一端子模組。第一端子模組包括複數第一導電端子以及第一絕緣固定塊。複數第一導電端子包括第一訊號端子、第二訊號端子、第一接地端子以及第二接地端子。第一訊號端子以及第二訊號端子均包括凸出第一絕緣固定塊的第一接觸臂。第一接地端子包括凸出第一絕緣固定塊的第一抵接部；第二接地端子包括凸出第一絕緣固定塊的第二抵接部。第一抵接部以及第二抵接部至少其中之一與第一導電本體相接觸，本發明實施方式還揭示了一種具有電連接器的連接器組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector includes a first conductive body and a first terminal module. The first terminal module includes a number of first conductive terminals and a first insulating fixing block. The first conductive terminals include a first signal terminal, a second signal terminal, a first ground terminal and a second ground terminal. The first signal terminal and the second signal terminal each include a first contact arm protruding beyond the first insulating fixing block. The first ground terminal includes a first abutting portion protruding beyond the first insulating fixing block. The second ground terminal includes a second abutting portion protruding beyond the first insulating fixing block. At least one of the first abutting portion and the second abutting portion is in contact with the first conductive body. A connector assembly having the electrical connector is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一導電本體</p>  
        <p type="p">118:第一容納槽</p>  
        <p type="p">3111:第一固定部</p>  
        <p type="p">3114:第一抵接部</p>  
        <p type="p">G1:第一接地端子</p>  
        <p type="p">H:圖48中畫框部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2236" publication-number="202626949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141248</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物及交聯物</chinese-title>  
        <english-title>RESIN COMPOSITION AND CROSS-LINKED ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L65/00</main-classification>  
        <further-classification edition="200601120260401B">C08L97/00</further-classification>  
        <further-classification edition="200601120260401B">C08J3/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商寶理塑膠贏創有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLYPLASTICS-EVONIK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川友紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>六田充輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTSUDA, MITSUTERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>落合拓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHIAI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包含具有下述式(1)所表示之結構之聚辛烯(polyoctenamer)、及有機天然物系填料之樹脂組成物及其交聯物。 &lt;br/&gt;&lt;img align="absmiddle" height="81px" width="257px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition and a cross-linked article thereof, wherein the resin composition comprises polyoctenamer having a structure represented by the following formula (1) and organic natural material-based filler. &lt;br/&gt;&lt;img align="absmiddle" height="67px" width="255px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2237" publication-number="202628282"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628282.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器以及連接器組件</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251201B">H01R13/6586</main-classification>  
        <further-classification edition="201101120251201B">H01R13/6587</further-classification>  
        <further-classification edition="200601120251201B">H01R13/426</further-classification>  
        <further-classification edition="201101120251201B">H01R12/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊藤芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, TENGFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚坤磷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KUNLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾晨輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, CHENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁雙峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, SHUANGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器包括第一導電本體、第一端子模組以及導電安裝塊。第一端子模組包括第一訊號端子、第二訊號端子、第一接地端子以及第二接地端子。第一訊號端子包括第一安裝腳，第二訊號端子包括第二安裝腳。第一接地端子包括第一尾部，第二接地端子包括第二尾部。導電安裝塊包括第一屏蔽凸條、第二屏蔽凸條以及第一鏤空孔。第一接地端子的第一尾部以及第二接地端子的第二尾部至少其中之一與導電安裝塊電性連接屏蔽訊號。本發明實施方式還揭示了一種具有電連接器的連接器組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector includes a first conductive body, a first terminal module and a conductive mounting block. The first terminal module includes a first signal terminal, a second signal terminal, a first ground terminal and a second ground terminal. The first signal terminal includes a first mounting foot. The second signal terminal includes a second mounting foot. The first ground terminal includes a first tail portion. The second ground terminal includes a second tail portion. The conductive mounting block includes a first shielding rib, a second shielding rib and a first hollow hole. At least one of the first tail portion of the first ground terminal and the second tail portion of the second ground terminal is electrically connected to the conductive mounting block. A connector assembly having the electrical connector is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電路板</p>  
        <p type="p">3116:第一安裝腳</p>  
        <p type="p">3117:第二安裝腳</p>  
        <p type="p">3118:第一尾部</p>  
        <p type="p">3119:第二尾部</p>  
        <p type="p">613:第一鏤空孔</p>  
        <p type="p">621:第一凸塊</p>  
        <p type="p">6211:第一安裝插孔</p>  
        <p type="p">622:第二凸塊</p>  
        <p type="p">6221:第二安裝插孔</p>  
        <p type="p">631:第一屏蔽凸條</p>  
        <p type="p">632:第二屏蔽凸條</p>  
        <p type="p">E:圖46中畫框部分</p>  
        <p type="p">G1:第一接地端子</p>  
        <p type="p">G2:第二接地端子</p>  
        <p type="p">S1:第一訊號端子</p>  
        <p type="p">S2:第二訊號端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2238" publication-number="202626029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141251</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>眼用調配物</chinese-title>  
        <english-title>OPHTHALMIC FORMULATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/426</main-classification>  
        <further-classification edition="200601120260401B">A61K47/04</further-classification>  
        <further-classification edition="200601120260401B">A61K47/40</further-classification>  
        <further-classification edition="200601120260401B">A61K47/26</further-classification>  
        <further-classification edition="200601120260401B">A61K47/38</further-classification>  
        <further-classification edition="200601120260401B">A61K9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商佩爾索斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELTHOS THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　艾瑞克　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, ERIC D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢德勒　賽門　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANDLER, SIMON PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江　德壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, DESHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼拉默特　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALAMUT, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包含2-{[3-(5-氯-2-{2-氯-5-氟-4-[(1,3-噻唑-4-基)胺磺醯基]苯氧基}苯基)丙基]胺基}乙醯胺或其醫藥學上可接受之鹽的眼用調配物，其製備方法及其用於治療各種眼部病狀(例如疼痛)之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to ophthalmic formulations comprising 2-{[3-(5-chloro-2-{2-chloro-5-fluoro-4-[(1,3-thiazol-4-yl)sulfamoyl]phenoxy}phenyl)propyl]amino}acetamide or a pharmaceutically acceptable salt thereof, to methods for preparation thereof, and uses thereof for treatment of various eye conditions (e.g., pain).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2239" publication-number="202628707"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628707.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像感測器</chinese-title>  
        <english-title>IMAGE SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10F39/18</main-classification>  
        <further-classification edition="202601120260302B">H10F39/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊曉冬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIAODONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉成明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　文超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WENCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁佑銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, YOUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐良宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, LIANGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋口正祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGUCHI, MASAYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供的影像感測器包括第一像素群組和第二像素群組。第一像素群組包括第一光電二極體陣列，包括光電二極體以產生第一色彩資料；以及第一微透鏡，其中第一微透鏡中的每一個配置為覆蓋第一光電二極體陣列中的n個光電二極體。第二像素群組位於第一像素旁邊並包括第二光電二極體陣列，包括光電二極體以產生表示與第一色彩資料不同色彩的第二色彩資料；以及第二微透鏡，其中第二微透鏡中的每一個配置為覆蓋第二光電二極體陣列中的m個光電二極體，n和m為整數，並且n和m中的至少一個大於1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensor provided herein includes a first pixel group and a second pixel group. The first pixel group includes a first photodiode array including photodiodes to generate a first color data; and first microlenses, wherein each of the first microlenses is disposed overlaying n of the photodiodes in the first photodiode array. The second pixel group is located next to the first pixel and includes a second photodiode array including photodiodes to generate a second color data representing a different color from the first color data; and second microlenses, wherein each of the second microlenses is disposed overlaying m of the photodiodes in the second photodiode array, n and m are integers, and at least one of n and m is greater than 1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:影像感測器</p>  
        <p type="p">102:重複單元</p>  
        <p type="p">110:第一像素群組</p>  
        <p type="p">112、122、132、142:光電二極體</p>  
        <p type="p">114:第一微透鏡</p>  
        <p type="p">120:第二像素群組</p>  
        <p type="p">124:第二微透鏡</p>  
        <p type="p">130:第三像素群組</p>  
        <p type="p">134:第三微透鏡</p>  
        <p type="p">140:第四像素群組</p>  
        <p type="p">144:第四微透鏡</p>  
        <p type="p">A112:第一光電二極體陣列</p>  
        <p type="p">A122:第二光電二極體陣列</p>  
        <p type="p">A132:第三光電二極體陣列</p>  
        <p type="p">A142:第四光電二極體陣列</p>  
        <p type="p">C:列方向</p>  
        <p type="p">R:行方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2240" publication-number="202627323"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627323.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滾動軸承</chinese-title>  
        <english-title>ROLLING BEARING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">F16C33/78</main-classification>  
        <further-classification edition="200601120260325B">F16C33/72</further-classification>  
        <further-classification edition="200601120260325B">F16C33/66</further-classification>  
        <further-classification edition="200601120260325B">F16C33/38</further-classification>  
        <further-classification edition="200601120260325B">F16C23/06</further-classification>  
        <further-classification edition="200601120260325B">F16C19/00</further-classification>  
        <further-classification edition="201601120260325B">F16J15/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＴＮ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NTN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供密封性安定的滾動軸承。滾動軸承，具備：內外環（2、3）；複數個滾動體；以及，封塞住內外環（2、3）之間的軸承空間之接觸式密封構件（6）。密封構件（6）具備：密封件傾倒抑制手段（St）、潤滑脂流動抑制手段（GS），以及，徑向變化量減低手段（Rcr）。密封件傾倒抑制手段（St）抑制密封構件（6）的內周側部分（13）往軸向內側傾倒。潤滑脂流動抑制手段（GS）抑制從副密封唇（16）的內周面往主密封唇（15）的內徑側前端部之潤滑脂的流動，並且，將主密封唇（15）設為相對於密封溝槽（7）之期望的接觸狀態。徑向變化量減低手段（Rcr）在干涉量的範圍內，將主密封唇（15）的徑向變化量減低至預定值以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a rolling bearing which makes the sealing performance stable. The rolling bearing includes: an inner ring (2); an outer ring (3); rolling elements; and a contact type seal member (6) closing a bearing space between the inner ring (2) and the outer ring (3). The seal member (6) includes: a seal falling suppression means (St); a grease flow suppression means (GS); and a radial direction variation reducing means (Rcr). The seal falling suppression means (St) prevents an inner peripheral side part (13) from falling inward in an axial direction. The grease flow suppression means (GS) prevents grease from flowing from an inner peripheral surface of a sub lip (16) to a tip part of a main lip (15) on an inner diameter side and makes the main lip (15) come into contact with a seal groove (7) in a desired contact state. The radial direction variation reducing means (Rcr) reduces a variation of the main lip (15) in the radial direction to a predetermined value or less within a range of interference.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:內環</p>  
        <p type="p">3:外環</p>  
        <p type="p">6:密封構件</p>  
        <p type="p">7:密封溝槽</p>  
        <p type="p">7c:外側面</p>  
        <p type="p">8:外周側部分</p>  
        <p type="p">8a:內側面</p>  
        <p type="p">8aa:傾斜面</p>  
        <p type="p">9:密封溝槽</p>  
        <p type="p">9a:內側面</p>  
        <p type="p">9b:外側面</p>  
        <p type="p">9c:溝槽底面</p>  
        <p type="p">10:核心金屬</p>  
        <p type="p">11:橡膠材</p>  
        <p type="p">13:內周側部分</p>  
        <p type="p">15:密封唇</p>  
        <p type="p">15c:接觸部(內徑側前端部)</p>  
        <p type="p">16:副密封唇</p>  
        <p type="p">GS:潤滑脂流動抑制手段</p>  
        <p type="p">Rcr:徑向變化量減低手段</p>  
        <p type="p">St:密封件傾倒抑制手段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2241" publication-number="202627114"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627114.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋅系脫硫劑之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C22B3/12</main-classification>  
        <further-classification edition="200601120260317B">C01G9/02</further-classification>  
        <further-classification edition="200601120260317B">B01J20/06</further-classification>  
        <further-classification edition="200601120260317B">B01D17/025</further-classification>  
        <further-classification edition="200601120260317B">B01D17/038</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山尚樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川晃平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紫垣伸行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGAKI, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所提供的鋅系脫硫劑，係在常溫附近具有優異的脫硫性能。本發明的鋅系脫硫劑之製造方法，係包含有：中和步驟、固液分離步驟及乾燥步驟；該中和步驟係將含有鋅離子的水溶液進行中和，而使鋅成分析出；該固液分離步驟係將所析出的上述鋅成分施行固液分離，而獲得含氫氧化鋅之脫水濾餅；該乾燥步驟係將上述含氫氧化鋅之脫水濾餅在氫氧化鋅的分解溫度以下進行乾燥，而獲得含氫氧化鋅之固形物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2242" publication-number="202626461"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626461.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>倉儲</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B65G1/14</main-classification>  
        <further-classification edition="200601120260401B">E04B2/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田圭丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板倉巧彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAKURA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>箕浦治紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINOURA, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於倉儲中，係對複數個支柱被安裝複數個外壁面板。倉儲具備有：面板壓持構件，其在與複數個支柱中至少1根第一支柱的表面之間夾持1塊外壁面板，並且可卡合自如地卡合於設置在支柱之表面的卡合部，在支柱的表面與卡合部連續地形成之插入槽內，其在離開卡合部的非卡合位置與卡合於卡合部的卡合位置之間可移動自如；及位置限制構件，其限制位於卡合部之卡合位置的面板壓持構件之移動，並且可嵌合自如地嵌合於設置在第一支柱之表面的嵌合部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">41:標準支柱(第二支柱)</p>  
        <p type="p">42:特殊支柱(第一支柱)</p>  
        <p type="p">43:橫樑</p>  
        <p type="p">50A,50B:物品載置構件</p>  
        <p type="p">80:外壁面板</p>  
        <p type="p">81:全寬支柱構造</p>  
        <p type="p">88:半寬支柱構造</p>  
        <p type="p">ASSY:外壁組裝體</p>  
        <p type="p">F:搬運用框架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2243" publication-number="202628209"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628209.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於確定催化能力的方法以及實行其的燃料電池設備</chinese-title>  
        <english-title>METHOD FOR DETERMINING CATALYTIC CAPABILITY, AND FUEL CELL INSTALLATION FOR PERFORMING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260324B">H01M8/04313</main-classification>  
        <further-classification edition="201601120260324B">H01M8/06</further-classification>  
        <further-classification edition="201601120260324B">H01M8/12</further-classification>  
        <further-classification edition="201601120260324B">H01M8/0444</further-classification>  
        <further-classification edition="201601120260324B">H01M8/0432</further-classification>  
        <further-classification edition="201601120260324B">H01M8/043</further-classification>  
        <further-classification edition="201601120260324B">H01M8/04992</further-classification>  
        <further-classification edition="200601120260324B">G01N25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹森　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSEN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佛　菲力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFER, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於確定能夠安裝在燃料電池設備中的組件(110、120)之催化劑層的催化能力的方法(10)包含當使該組件(110、120)達到其操作溫度及/或自該操作溫度進行冷卻時，使用安裝在該組件(110、120)或其供應管路及/或排放管路中之一者上的至少一個感測器(140)來量測被測變數(200)之輪廓。將該被測變數(200)之經量測之該輪廓與該被測變數之參考狀態進行比較。根據經量測之該輪廓(200)來計算催化能力。此方法致能催化能力的可靠及準確確定，此對於最佳化燃料電池設備的效能、效率及維護成本至關重要。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The method (10) for determining the catalytic capability of a catalyst layer of components (110, 120) that are able to be installed in a fuel cell installation comprises measuring a profile of a measured variable (200) using at least one sensor (140) that is installed on the component (110, 120) or one of its supply lines and/or discharge lines, while the component (110, 120) is being brought to its operating temperature and/or being cooled down therefrom. The measured profile of the measured variable (200) is compared with a reference state of the measured variable. Catalytic capability is calculated from the measured profile (200). This method enables reliable and accurate determination of catalytic capability, which is of crucial importance for optimizing performance, efficiency and maintenance costs of fuel cell installations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:方法</p>  
        <p type="p">a:第一步驟</p>  
        <p type="p">a1:可選步驟</p>  
        <p type="p">b:步驟</p>  
        <p type="p">c:步驟</p>  
        <p type="p">d:可選步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2244" publication-number="202627214"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627214.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電解槽電池堆的溫度管理方法、開環及／或閉環控制單元以及包括電解槽電池堆的電解設備</chinese-title>  
        <english-title>TEMPERATURE MANAGEMENT METHOD FOR AN ELECTROLYZER CELL STACK, OPEN-LOOP AND/OR CLOSED-LOOP CONTROL UNIT AND ELECTROLYSIS PLANT COMPRISING THE ELECTROLYZER CELL STACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260323B">C25B1/044</main-classification>  
        <further-classification edition="201401120260323B">H01M10/633</further-classification>  
        <further-classification edition="201601120260323B">H01M8/04537</further-classification>  
        <further-classification edition="201601120260323B">H01M8/04701</further-classification>  
        <further-classification edition="200601120260323B">G01R19/165</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡雷　馬克西姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARRE, MAXIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里德爾　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIEDEL, MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出了一種用於電解槽電池堆的溫度管理方法，該溫度管理方法至少包括以下方法步驟：量測瞬時堆電壓；處理堆電壓量測之堆電壓讀數；將經處理之堆電壓讀數應用於電解槽電池堆之多於一個特性溫度-電壓曲線，以將經處理之堆電壓讀數與各自與設定點溫度相關聯的特性溫度-電壓曲線之電壓值進行比較；在特性溫度-電壓曲線中之至少一者基於經處理之堆電壓讀數指示實際溫度低於相關聯之設定點溫度的情況下，執行對外部溫度控制裝置之至少一個加熱單元的開環及/或閉環控制以增加熱量輸出，在特性溫度-電壓曲線中之至少一者基於經處理之堆電壓讀數指示實際溫度高於相關聯之設定點溫度的情況下，執行對外部溫度控制裝置之至少一個加熱單元的開環及/或閉環控制以減少熱量輸出，以及在特性溫度-電壓曲線基於經處理之堆電壓讀數指示實際溫度在設定點溫度之接近範圍內的情況下，停用外部溫度控制裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A temperature management method for an electrolyzer cell stack is proposed, comprising at least the method steps of: measuring an instantaneous stack volt- age, processing a stack voltage reading of the stack voltage measurement, ap- plying the processed stack voltage reading to more than one characteristic tem- perature-voltage curve of the electrolyzer cell stack to compare the processed stack voltage reading with voltage values of the characteristic temperature- voltage curves that are each associated with a setpoint temperature, performing open-loop and/or closed-loop control of at least one heating unit of the external temperature control device to increase a heat output if at least one of the charac- teristic temperature-voltage curves indicates on the basis of the processed stack voltage reading that an actual temperature is below the associated setpoint tem- perature, performing open-loop and/or closed-loop control of the at least one heating unit of the external temperature control device to reduce the heat output if at least one of the characteristic temperature-voltage curves indicates on the ba- sis of the processed stack voltage reading that the actual temperature is above the associated setpoint temperature and deactivating the external temperature control device if the characteristic temperature-voltage curves indicate on the ba- sis of the processed stack voltage reading that the actual temperature is within close range of the setpoint temperature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14,16,18:特性溫度-電壓曲線</p>  
        <p type="p">20:堆電壓讀數</p>  
        <p type="p">22,22',24,24',26,26':設定點溫度</p>  
        <p type="p">40:數目</p>  
        <p type="p">46:電池電壓讀數</p>  
        <p type="p">48,50,52,54:可調諧低通濾波器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2245" publication-number="202628212"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628212.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於操作燃料電池系統的方法、電腦程式產品和燃料電池系統</chinese-title>  
        <english-title>METHOD FOR OPERATING A FUEL CELL SYSTEM, COMPUTER PROGRAM PRODUCT AND FUEL CELL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260324B">H01M8/04858</main-classification>  
        <further-classification edition="201601120260324B">H01M8/0438</further-classification>  
        <further-classification edition="201601120260324B">H01M8/043</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹森　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSEN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉夫　丹尼爾　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUFF, DANIEL MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淦舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, GANZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多爾納　瑪莉烏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DORNER, MARIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於操作一燃料電池系統（1）的方法，根據該方法，當請求一所傳送電功率（P_ist）至一所請求電功率（P_soll）之一改變時，改變用於供應一電池堆（2）之一燃料的一引入速率（n）。 &lt;br/&gt;在該方法中，考慮在引入該燃料與到達該電池堆（2）之間的該燃料之一輸送持續時間（TD）。 &lt;br/&gt;本發明另外關於一種用於執行該方法的電腦程式產品且關於一種以此方式操作之燃料電池系統（1）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for operating a fuel cell system (1) according to which, when a change in a delivered electrical power (P_ist) to a requested electrical power (P_soll) is requested, an introduction rate (n) of a fuel for supplying a stack (2) is changed. &lt;br/&gt;In the method, a transport duration (TD) of the fuel between introducing the fuel and reaching the stack (2) is taken into account. &lt;br/&gt;The invention additionally relates to a computer program product for executing the method and to a fuel cell system (1) operated in this manner.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P:功率</p>  
        <p type="p">P_ist:電功率/所傳送電功率</p>  
        <p type="p">P_soll:所請求電功率</p>  
        <p type="p">t:時間</p>  
        <p type="p">t_int:時間/初始時間</p>  
        <p type="p">TD:持續時間/輸送持續時間</p>  
        <p type="p">TK:持續時間/延遲持續時間</p>  
        <p type="p">△T:持續時間/改變持續時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2246" publication-number="202626234"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626234.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141364</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊件、包括焊件之半導體處理系統，以及製造用於腔室配置及半導體處理系統之焊件的方法</chinese-title>  
        <english-title>WELDMENTS, SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING WELDMENTS, AND METHODS OF MAKING WELDMENTS FOR CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B23K1/008</main-classification>  
        <further-classification edition="202601120260401B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉比諾維奇　費利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RABINOVICH, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿齊米　阿明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZIMI, AMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班納　薩梅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANNA, SAMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯傑　約拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERGER, YORAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種焊件包括一通道本體，該通道本體由一陶瓷材料形成且具有一板部分、一第一側壁部分及一第二側壁部分。該通道本體之該板部分具有一第一表面及一第二表面。該第一側壁部分自該板部分延伸且相對於該通道本體之該板部分之該第一表面實質上正交。該第二側壁部分與該通道本體之該第一側壁部分間隔開且實質上平行於該通道本體之該第一側壁部分。該通道本體具有單一整體構造，該整體構造沒有使用一減材製造技術形成之焊縫，以限制與原本因焊接而引入至該通道本體中之尺寸變化相關聯的光學效應。亦描述了包括焊件之腔室配置及半導體處理系統、製造焊件之方法，以及沉積材料層及/或自支撐在焊件內之基板移除材料的相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A weldment includes a channel body formed from a ceramic material and having a plate portion, a first sidewall portion, and a second sidewall portion. The plate portion of the channel body has a first surface and a second surface. The first sidewall portion extends from the plate portion and is substantially orthogonal relative to the first surface of the plate portion of the channel body. The second sidewall portion is spaced apart from the first sidewall portion of the channel body and is substantially parallel to the first sidewall portion of the channel body. The channel body has a single, one-piece construction with no welds formed using a subtractive manufacturing technique to limit optical effects associated with dimensional variation otherwise introduced into the channel body by welding. Chamber arrangements and semiconductor processing systems including weldments, methods of making weldments, and related methods of depositing material layers and/or removing material form substrates supported within weldments are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:焊件</p>  
        <p type="p">103:注入端槽</p>  
        <p type="p">106:注入端</p>  
        <p type="p">107:排放端槽</p>  
        <p type="p">108:排放端</p>  
        <p type="p">112:通道本體</p>  
        <p type="p">114:板本體</p>  
        <p type="p">116:注入凸緣本體</p>  
        <p type="p">118:排放凸緣本體</p>  
        <p type="p">120:擱架本體</p>  
        <p type="p">122:管狀本體</p>  
        <p type="p">124:板部分</p>  
        <p type="p">126:第一側壁部分</p>  
        <p type="p">128:二側壁部分</p>  
        <p type="p">152:內部表面</p>  
        <p type="p">162:通路</p>  
        <p type="p">166:板本體肋部分</p>  
        <p type="p">176:第二板本體縱向板坯</p>  
        <p type="p">180:擱架部分</p>  
        <p type="p">182:端肋部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2247" publication-number="202626973"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626973.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子零件安裝基板之製造方法及焊料助焊劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L93/04</main-classification>  
        <further-classification edition="200601120260401B">C08L91/06</further-classification>  
        <further-classification edition="200601120260401B">C08K5/092</further-classification>  
        <further-classification edition="200601120260401B">B23K35/362</further-classification>  
        <further-classification edition="202601120260401B">H05K3/34</further-classification>  
        <further-classification edition="202601120260401B">H05K3/3489</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉岡祐樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIOKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>境忠彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TADAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之電子零件安裝基板之製造方法具有以下工序：第1工序，係準備具有複數個焊盤之電路基板，前述焊盤形成有至少一部分被有機膜覆蓋之焊料預塗層；第2工序，係於被有機膜覆蓋之焊料預塗層上搭載JIS規格所規定之0402尺寸以下之電子零件；及第3工序，係將第2工序中搭載有電子零件之電路基板加熱，將電子零件分別焊接於複數個焊盤上；電子零件具有電子零件本體與一對端子，前述電子零件本體具有一對端面、上表面、下表面及一對側面，前述一對端子係在電子零件本體之兩端面側至少與下表面相接而配置；一對端子係在第3工序中使焊料預塗層熔融固化而焊接於第1焊盤上；有機膜包含3種以上軟化點不同之熱塑性樹脂；且，3種以上熱塑性樹脂各自之軟化點為焊料預塗層中所含之焊料的熔點以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2248" publication-number="202626860"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626860.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141371</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半芳香族聚醯胺組成物、半芳香族聚醯胺膜及其製造方法、電子材料、光學零件、以及太陽能發電模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G69/26</main-classification>  
        <further-classification edition="200601120260401B">C08L77/06</further-classification>  
        <further-classification edition="200601120260401B">C08K5/1575</further-classification>  
        <further-classification edition="200601120260401B">C08K5/3435</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">B29C55/14</further-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification>  
        <further-classification edition="202501120260401B">H10F19/80</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification>  
        <further-classification edition="200601320260401B">B29L7/00</further-classification>  
        <further-classification edition="200601320260401B">B29L11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尤尼吉可股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITIKA LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡部貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKABE, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中原純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAHARA, JUN-ICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種熔融擠出時不易產生凝膠狀物之半芳香族聚醯胺組成物。又，本發明之目的在於提供一種由前述半芳香族聚醯胺組成物所獲得，且黃度較低，具有較高之耐斷裂性，於高溫氣體環境下不易熱收縮，於高溫高濕氣體環境下具有較高之耐濕熱性的半芳香族聚醯胺膜。本發明之半芳香族聚醯胺組成物含有半芳香族聚醯胺、受阻酚系熱穩定劑、及受阻胺系熱穩定劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2249" publication-number="202626525"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626525.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141398</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於自含鋰鹽水中除去硼之製程</chinese-title>  
        <english-title>PROCESSES FOR REMOVING BORON FROM LITHIUM-CONTAINING BRINES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">C02F1/28</main-classification>  
        <further-classification edition="202301120260401B">C02F1/44</further-classification>  
        <further-classification edition="202301120260401B">C02F1/58</further-classification>  
        <further-classification edition="202301120260401B">C02F1/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞比馬利股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBEMARLE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜邦　傑斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUPONT, JESSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德克瓦　克萊兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECROIX, CLAIRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, KEYUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述一種自含鋰製程流中除去硼之製程包括在鋰吸附步驟及脫附步驟中處理該源鹽水、升高脫附流出物之pH及利用奈米過濾製程及反滲透製程中之一或多者過濾該脫附流出物以除去一部分之該硼。將該過濾之滲透物作為低硼再循環水流返回至該脫附製程。在一個實施例中，第一反滲透製程在低pH及低溫下操作，且第二反滲透製程在高pH及高溫下操作。由該第二反滲透製程保留之硼的量大於由該第一反滲透製程保留之硼的量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process is described to remove boron from lithium-containing process streams includes processing the source brine in a lithium adsorption step and a desorption step, raising the pH of a desorption effluent, and filtering the desorption effluent with one or more of a nanofiltration process and a reverse osmosis process to remove a portion of the boron. The permeate of the filtration is returned to the desorption process as a low boron recycled water stream. In one embodiment, a first reverse osmosis process operates at a low pH and low temperature and a second reverse osmosis process operates at a high pH and high temperature. The amount of boron retained by the second reverse osmosis process is greater than the amount of boron retained by the first reverse osmosis process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2250" publication-number="202629027"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629027.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141399</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>間隙式安裝元件</chinese-title>  
        <english-title>INTERSTITIAL MOUNTING OF COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10W72/29</main-classification>  
        <further-classification edition="202601120260401B">H10W70/62</further-classification>  
        <further-classification edition="202601120260401B">H10W70/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＢＡＥ系統資訊及電子系統整合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERRY, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩爾曼　雅各Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAUERMANN, JACOB R</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路易斯　布萊恩Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOUIS, BRIAN T</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玻恩　艾倫Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOONE, ALAN P</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有間隙表面安裝元件的電路卡。在一個範例中，該電路卡包括：一第一表面；一第二表面，其與該第一表面相對；以及一陣列的焊墊，其設置在該第一表面上。該等焊墊配置成提供該電路卡與一電子裝置的一球柵陣列之電耦接。該電路卡亦包括一個或多個間隙電氣元件，其安裝在該電路卡的該第一表面上之該陣列的該等焊墊之間。該電路卡進一步包括一個或多個附加電氣元件，其安裝在該電路卡的該第二表面上及在包含該陣列的焊墊之區域之外的該電路卡之該第一表面上。該等電氣元件可以包括電容器、旁路電容器、電感器及/或電阻器。該電子裝置可以是一積體電路或一現場可程式閘陣列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit card with interstitial surface mounted components. In an example, the circuit card includes a first surface; a second surface opposite the first surface; and an array of pads disposed on the first surface. The pads are configured to provide electrical coupling of the circuit card to a ball grid array of an electronic device. The circuit card also includes one or more interstitial electrical components mounted between the pads of the array on the first surface of the circuit card. The circuit card further includes one or more additional electrical components mounted on the second surface of the circuit card and on the first surface of the circuit card outside of a region comprising the array of pads. The electrical components may include capacitors, bypass capacitors, inductors, and/or resistors. The electronic device may be an integrated circuit or a field programmable gate array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2251" publication-number="202627583"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627583.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G02B6/42</main-classification>  
        <further-classification edition="200601120260401B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京瓷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOCERA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之光模組具備基板、光元件、散熱構件、光連接器及導熱性樹脂。基板具有第1面、及位於第1面之相反側之第2面。光元件具有與基板之第1面對向之第3面、及位於第3面之相反側之第4面。散熱構件位於光元件之第4面。光連接器以與散熱構件之間留出空間之狀態位於光元件之第4面。導熱性材料位於光元件與散熱構件之間。導熱性材料亦位於空間內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光模組</p>  
        <p type="p">2:基板</p>  
        <p type="p">4:散熱構件</p>  
        <p type="p">4a:面</p>  
        <p type="p">5:導熱性材料</p>  
        <p type="p">20a:第1面</p>  
        <p type="p">20b:第2面</p>  
        <p type="p">30a:第3面</p>  
        <p type="p">30b:第4面</p>  
        <p type="p">31:光連接器</p>  
        <p type="p">31a:本體部</p>  
        <p type="p">31b:突起部</p>  
        <p type="p">31c:面</p>  
        <p type="p">31d:面</p>  
        <p type="p">34:基板</p>  
        <p type="p">35:發熱部</p>  
        <p type="p">36:光傳輸路徑</p>  
        <p type="p">37:接著劑</p>  
        <p type="p">d1:距離</p>  
        <p type="p">d2:距離</p>  
        <p type="p">S:空間</p>  
        <p type="p">S1:第1空間</p>  
        <p type="p">S2:第2空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2252" publication-number="202626146"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626146.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲能集成裝置</chinese-title>  
        <english-title>ENERGY STORAGE INTEGRATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">A62C3/16</main-classification>  
        <further-classification edition="202101120260318B">H01M50/204</further-classification>  
        <further-classification edition="200601120260318B">A62C37/11</further-classification>  
        <further-classification edition="200601120260318B">G08B17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商武漢億緯儲能有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVE ENERGY STORAGE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏厚樸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, HOUPO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫遠彪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YUANBIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳倬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒郁郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, YULANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙紫輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, ZIHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易昊昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, HAOHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高宏銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種儲能集成裝置，包括集成艙及儲能集成櫃，集成艙包括電氣艙；儲能集成櫃設於電氣艙內；儲能集成櫃包括一櫃體，櫃體包括沿第一方向間隔設置的第一腔室、第二腔室及第三腔室；儲能集成櫃還包括交流及控制組件、直流配電組件以及電纜組件；交流及控制組件位於第一腔室內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy storage integration device is provided, including an integrated cabin and an energy storage integrated cabinet. The integrated cabin includes an electrical compartment. The energy storage integrated cabinet is located within the electrical compartment and includes a cabinet body. The cabinet body includes a first chamber, a second chamber, and a third chamber spaced apart in a first direction. The energy storage integrated cabinet is equipped with an AC and control assembly, a DC distribution assembly, and a cable assembly. The AC and control assembly is located in the first chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:儲能集成裝置</p>  
        <p type="p">1001:電氣艙</p>  
        <p type="p">1002:電池艙</p>  
        <p type="p">200:儲能集成櫃</p>  
        <p type="p">Z:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2253" publication-number="202625880"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625880.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>植物栽培設備</chinese-title>  
        <english-title>PLANT CULTIVATION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A01G9/24</main-classification>  
        <further-classification edition="200601120260330B">A01G9/18</further-classification>  
        <further-classification edition="200601120260330B">A01G7/02</further-classification>  
        <further-classification edition="200601120260330B">A01G31/02</further-classification>  
        <further-classification edition="200601120260330B">A01G31/04</further-classification>  
        <further-classification edition="200601120260330B">A01G27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>名倉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北伸幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITA, NOBUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種經改良的新穎的植物栽培設備。作為本發明的解決手段的植物栽培設備係具備無端狀的環繞構件、複數個移動棚架、及氣體供給部。環繞構件係在具有例如第一區間、第二區間、及二個第三區間的大致長圓形的路徑循環移動。環繞構件係在第一區間大致沿著橫向大致直線狀移動。第二區間係隔離於第一區間的上方且與第一區間重疊的位置，環繞構件係在第二區間大致沿著橫向大致直線狀移動。環繞構件係在第一區間與第二區間之間的二個第三區間以彎曲成向外突出狀的狀態來移動。複數個移動棚架係分別支持植物的栽培容器或具有該栽培容器，以環繞構件的長條延伸方向的預定間隔，經由連接部安裝在環繞構件，在使栽培容器維持大致一定的姿勢的狀態下，隨著該環繞構件的循環而移動。氣體供給部係朝向栽培容器所保持的植物供給氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a novel and improved plant cultivation apparatus. A plant cultivation apparatus according to the present invention includes, for example, an endless orbiting member that moves around a substantially elliptical path having a first section that moves substantially linearly in a horizontal direction, a second section that moves substantially linearly in the horizontal direction at a position spaced above the first section and overlapping with the first section, and two third sections that move while curving outwardly between the first and second sections; a plurality of movable shelves each supporting or holding a plant cultivation container, attached to the circumferential member via connecting parts at predetermined intervals in the longitudinal direction of the circumferential member, and moving as the orbiting member rotates while maintaining the cultivation containers in a substantially constant orientation; and a gas supply unit that supplies gas towards the plants held in the cultivation containers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鏈條(環繞構件)</p>  
        <p type="p">20:軌道</p>  
        <p type="p">30:連接部</p>  
        <p type="p">40:移動棚架(栽培容器)</p>  
        <p type="p">50:照明裝置</p>  
        <p type="p">50a:支持構件</p>  
        <p type="p">50b:LED單元</p>  
        <p type="p">51:照明裝置(第一照明裝置)</p>  
        <p type="p">52:照明裝置(第二照明裝置)</p>  
        <p type="p">63:液槽</p>  
        <p type="p">70:氣體供給機構</p>  
        <p type="p">71A:氣體噴嘴(氣體供給部)</p>  
        <p type="p">71B:氣體噴嘴(氣體供給部)</p>  
        <p type="p">100:植物栽培設備</p>  
        <p type="p">C:二點鏈線</p>  
        <p type="p">D1:第一區間</p>  
        <p type="p">D2:第二區間</p>  
        <p type="p">D31:第三區間</p>  
        <p type="p">D32:第三區間</p>  
        <p type="p">D4:第四區間</p>  
        <p type="p">D41:第四區間</p>  
        <p type="p">D42:第四區間</p>  
        <p type="p">G:氣體</p>  
        <p type="p">Pm1,Pm2:位置</p>  
        <p type="p">W:作業員</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2254" publication-number="202628876"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628876.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＭＯＣＶＤ設備及衛星盤自轉測量方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="200601120260302B">C23C16/00</further-classification>  
        <further-classification edition="201701120260302B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李肖辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭春磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種MOCVD設備及衛星盤自轉測量方法，MOCVD設備包括內設有行星盤反應腔、圖像採集裝置、圖像採集控制模組和圖像處理模組，行星盤上設有衛星盤，衛星盤上設有至少一個標記；圖像處理模組接收圖像採集裝置連續採集的多幀局部圖像並拼接為連續圖像以判斷衛星盤的自轉狀態。本發明通過設置圖像採集裝置連續採集局部圖像，並對局部圖像進行拼接以判斷行星盤是否自轉，並針對各行星盤的自轉情況進行調整，實現對各行星盤自轉速率的調整，使得各行星盤上承載的基片的自轉速率的統一，提高各基片成膜的均一性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:反應腔</p>  
        <p type="p">201:行星盤</p>  
        <p type="p">202:衛星盤</p>  
        <p type="p">203:圖像採集裝置</p>  
        <p type="p">204:圖像採集控制模組</p>  
        <p type="p">205:圖像處理模組</p>  
        <p type="p">206:分片子模組</p>  
        <p type="p">207:觀察窗</p>  
        <p type="p">208:溫度採集模組</p>  
        <p type="p">211:鏡頭</p>  
        <p type="p">212:上位機</p>  
        <p type="p">W:基片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2255" publication-number="202628829"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628829.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141505</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直流脈衝訊號控制系統和半導體處理設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P50/20</main-classification>  
        <further-classification edition="200601120260302B">H01J37/32</further-classification>  
        <further-classification edition="200601120260302B">H03K3/53</further-classification>  
        <further-classification edition="200601120260302B">H02M3/156</further-classification>  
        <further-classification edition="200601120260302B">H03K7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李博睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪　圖強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NI, TU-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種直流脈衝訊號控制系統和半導體處理設備，將根據交流類比訊號生成的第一控制訊號和根據脈衝數位訊號生成的第二控制訊號組合成混合同步訊號，第一控制訊號通過直流狀態控制模組作用於直流能量供給模組，來控制直流能量供給模組的充能狀態，使輸出的直流電壓訊號處於閾值範圍內；第二控制訊號通過直流輸出控制模組作用於直流能量供給模組，來調製直流電壓訊號得到直流脈衝訊號，並輸出給半導體處理設備作為偏置電壓。本發明可對偏置電壓精確調控，提高系統的適應性、抗干擾能力和回應穩定性，優化半導體加工的工藝性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:直流脈衝訊號控制系統</p>  
        <p type="p">103:負載終端</p>  
        <p type="p">104:鏈路</p>  
        <p type="p">201:總控模組</p>  
        <p type="p">202:輔助處理模組</p>  
        <p type="p">203:觸發模組</p>  
        <p type="p">204-1:第一隔離保護模組</p>  
        <p type="p">204-2:第二隔離保護模組</p>  
        <p type="p">205:直流輸出控制模組</p>  
        <p type="p">206:直流能量供給模組</p>  
        <p type="p">207:直流狀態控制模組</p>  
        <p type="p">208:緩衝模組</p>  
        <p type="p">209:感測模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2256" publication-number="202627195"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627195.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體噴淋頭組件及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C23C16/54</main-classification>  
        <further-classification edition="200601120251211B">C23C16/513</further-classification>  
        <further-classification edition="200601120251211B">H05H1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（廣州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. GUANGZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李曉磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張富榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氣體噴淋頭組件及電漿處理裝置，氣體噴淋頭組件設置在電漿處理裝置的反應腔內，包括：背板；位於背板下方的氣體噴淋頭；懸掛裝置，其第一端連接背板，其第二端連接氣體噴淋頭；第一連接裝置，連接背板和氣體噴淋頭的上表面；氣體噴淋頭具有拱形的上表面和下表面，上表面的中心區域低於邊緣區域，下表面的中心區域高於邊緣區域且上表面的中心區域和邊緣區域之間的高度差大於下表面的中心區域和邊緣區域之間的高度差；本發明使氣體噴淋頭的下表面在高溫工藝環境下大致與基座的上表面平行，保證了氣體噴淋頭下方的電漿分佈均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應腔</p>  
        <p type="p">111:安裝支架</p>  
        <p type="p">112:第二連接裝置</p>  
        <p type="p">121:背板</p>  
        <p type="p">122:進氣機構</p>  
        <p type="p">123:第一螺釘</p>  
        <p type="p">124:氣體噴淋頭</p>  
        <p type="p">130:側壁</p>  
        <p type="p">131:凸出部</p>  
        <p type="p">140:基片</p>  
        <p type="p">150:基座</p>  
        <p type="p">160:底壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2257" publication-number="202628188"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628188.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（廣州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. GUANGZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳青友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　班</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, BAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹志堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, GERALD ZHE YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　狄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳煌琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電漿處理裝置，其包括：真空反應腔，其側壁設有傳片口，用於傳輸基板；可上下移動的加熱器，設置於真空反應腔內，用於承載基板；可移動氣體約束框件，位於加熱器上方，且環繞加熱器的周向設置；當加熱器和可移動氣體約束框件移動至第一位置時，每個可移動氣體約束框件搭接在加熱器的邊緣，執行PECVD工藝；當加熱器和可移動氣體約束框件移動至第二位置時，每個可移動氣體約束框件搭接在加熱器的邊緣，執行乾法蝕刻工藝。本發明可同時滿足PECVD工藝和乾法蝕刻工藝的氣流限制需求，提高了薄膜沉積或蝕刻的均一性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:真空反應腔</p>  
        <p type="p">101:傳片口</p>  
        <p type="p">102:加熱器</p>  
        <p type="p">103:噴淋頭組件</p>  
        <p type="p">104:可移動氣體約束框件</p>  
        <p type="p">105:抽氣口</p>  
        <p type="p">106:抽氣裝置</p>  
        <p type="p">107:製冷裝置</p>  
        <p type="p">108:射頻電源</p>  
        <p type="p">121:支撐環</p>  
        <p type="p">131:進氣管道</p>  
        <p type="p">132:氣體源</p>  
        <p type="p">133:RPS反應器</p>  
        <p type="p">141:傳動桿</p>  
        <p type="p">142:可伸縮密封件</p>  
        <p type="p">161:乾式真空泵</p>  
        <p type="p">162:分子泵</p>  
        <p type="p">163:抽氣管道</p>  
        <p type="p">181:高頻電源</p>  
        <p type="p">182:低頻電源</p>  
        <p type="p">183:第一射頻匹配器</p>  
        <p type="p">184:第二射頻匹配器</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2258" publication-number="202627178"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627178.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學氣相沉積設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/455</main-classification>  
        <further-classification edition="200601120260302B">C23C16/52</further-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅稼昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃潔潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝振南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化學氣相沉積設備，其包括：反應腔；進氣裝置，其設置在所述反應腔的內部頂部，用於向反應腔內輸送氣體；托盤，其設置在反應腔內並位於進氣裝置下方，用於承載待處理的晶圓；所述進氣裝置包含層疊的若干個沿其徑向水平設置的進氣通道，每個所述進氣通道的進氣口與氣體源連通，且每個所述進氣通道的出氣口與所述進氣裝置的中心軸之間的第一距離為R1；所述晶圓靠近所述進氣通道的出氣口的邊緣與所述進氣裝置的中心軸之間的第二距離為R2，且所述第一距離R1與所述第二距離R2的比值範圍為0.2~0.82。本發明在保證晶圓生長均勻性的同時，提高了工藝源效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:進氣裝置</p>  
        <p type="p">104:托盤</p>  
        <p type="p">131:進氣通道</p>  
        <p type="p">141:間隙</p>  
        <p type="p">1312:出氣口</p>  
        <p type="p">A-A:中心軸</p>  
        <p type="p">R1:第一距離</p>  
        <p type="p">R2:第二距離</p>  
        <p type="p">R3:第三距離</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2259" publication-number="202627196"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627196.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體處理腔的透射蓋板及其製備方法、半導體處理設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">C23C16/54</main-classification>  
        <further-classification edition="200601120251211B">C23C16/46</further-classification>  
        <further-classification edition="200601120251211B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱生華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種用於半導體處理腔的透射蓋板及其製備方法、半導體處理設備。所述透射蓋板具有相對的第一表面和第二表面，第一表面朝向輻射源，透射蓋板包括：窗口，可透射熱輻射；外沿，其環繞所述窗口的外圍，包括上下層疊的第一外沿和第二外沿，第一外沿遠離輻射源，第二外沿靠近輻射源；以及阻擋層，其至少位於第一外沿和第二外沿之間；窗口和第一外沿的透射率相同，第二外沿透射率小於第一外沿透射率。本發明通過設置阻擋層，阻斷外沿在高溫下釋放的雜質滲入污染窗口，保證透射蓋板的紅外透光率、抗變形等性能的穩定，延長使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:透射蓋板</p>  
        <p type="p">1:窗口</p>  
        <p type="p">2:外沿</p>  
        <p type="p">21:第一外沿</p>  
        <p type="p">22:第二外沿</p>  
        <p type="p">3:阻擋層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2260" publication-number="202627184"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627184.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141510</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱裝置及氣相沉積設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/46</main-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification>  
        <further-classification edition="202601120260302B">H10P14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　世平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李勇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王家毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種加熱裝置，所述加熱裝置應用於氣相沉積設備中，氣相沉積設備的反應腔內設有用於承載晶圓的托盤，所述加熱裝置位於托盤的下方，包括在水平方向上間隔佈置的主加熱線圈和補熱線圈；主加熱線圈和補熱線圈的至少部分區段位於晶圓邊緣區域的正下方；水平方向上，晶圓中心位於主加熱線圈的繞制中心與補熱線圈的繞制中心之間。本發明的優點在於：通過補熱線圈有效補償主加熱線圈對晶圓邊緣區域的加熱能力不足，顯著提高了晶圓溫度分佈的一致性及晶圓表面薄膜厚度的均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">W:晶圓</p>  
        <p type="p">2:氣相沉積設備</p>  
        <p type="p">20:反應腔</p>  
        <p type="p">201:腔室蓋</p>  
        <p type="p">202:側壁</p>  
        <p type="p">203:底壁</p>  
        <p type="p">204:氣體注入口</p>  
        <p type="p">205:氣體排出口</p>  
        <p type="p">220:托盤</p>  
        <p type="p">221:氣流通道</p>  
        <p type="p">230:晶圓承載盤</p>  
        <p type="p">240:蓋板</p>  
        <p type="p">250:裝載環</p>  
        <p type="p">261:主加熱線圈</p>  
        <p type="p">262:補熱線圈</p>  
        <p type="p">280:引流板</p>  
        <p type="p">291:第一電流調節電路</p>  
        <p type="p">292:第二電流調節電路</p>  
        <p type="p">Wa:晶圓中心區域</p>  
        <p type="p">Wb:晶圓中間區域</p>  
        <p type="p">Wc:晶圓邊緣區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2261" publication-number="202628877"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628877.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單片式氣相沉積設備及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　世平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHIPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王家毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王寶賦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種單片式氣相沉積設備及系統，設備包括：基座，至少局部可升降的擋板，其環繞基座設置，成膜工藝過程中，擋板圍繞形成工藝腔室。工藝進氣機構，設置在工藝腔室的一側，用於供應工藝氣體。抽氣口，位於工藝腔室內，抽氣口和工藝進氣機構設置在單片式氣相沉積設備的相對側。傳片口，傳片口設置在單片式氣相沉積設備的不同於工藝進氣機構和抽氣口所在側的側邊；擋板僅在靠近工藝進氣機構的一側設有第一開口，工藝氣體經第一開口流入工藝腔室內，在襯底的表面水平流動並外延成膜，至少部分的未參與反應的工藝氣體及反應副產物從抽氣口排出。本發明能夠減小工藝氣體在襯底前沿和後沿的長速差，以提高外延層生長的晶體質量和膜厚均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">W:襯底</p>  
        <p type="p">100:腔體</p>  
        <p type="p">101:腔蓋</p>  
        <p type="p">102:襯套</p>  
        <p type="p">1021:第二開口</p>  
        <p type="p">103:支撐筒</p>  
        <p type="p">104:基座主體</p>  
        <p type="p">105:托盤</p>  
        <p type="p">106:傳輸環</p>  
        <p type="p">107:氣浮氣體進氣通道部</p>  
        <p type="p">108:氣浮氣體通道</p>  
        <p type="p">109:頂板</p>  
        <p type="p">110:支撐環</p>  
        <p type="p">111:覆蓋環</p>  
        <p type="p">113:調溫機構</p>  
        <p type="p">120:基座</p>  
        <p type="p">200:工藝進氣機構</p>  
        <p type="p">2001:出氣口</p>  
        <p type="p">2010:供氣口</p>  
        <p type="p">201:清潔進氣機構</p>  
        <p type="p">300:抽氣通道</p>  
        <p type="p">310:抽氣口</p>  
        <p type="p">400:擋板</p>  
        <p type="p">402:第一開口</p>  
        <p type="p">401:驅動裝置</p>  
        <p type="p">410:工藝腔室</p>  
        <p type="p">500:加熱組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2262" publication-number="202628878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141512</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物理氣相沉積設備、上電極組件、饋電結構和饋電方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="200601120260302B">C23C14/35</further-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王亞軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周國祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪　圖強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NI, TU-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物理氣相沉積設備、上電極組件、饋電結構和饋電方法，在物理氣相沉積設備的上電極組件中的靶材和饋電結構中的支撐結構之間設置傳動件，通過轉動支撐結構而令支撐結構內部的磁流體流動，將射頻功率或直流功率均勻分佈到支撐結構上，支撐結構的轉動帶動傳動件在靶材與支撐結構之間運動，不僅可以實現將射頻功率或直流功率均勻引入靶材，還可以實現射頻功率或直流功率在靶材上的均勻分佈，從而令靶材上的電場分佈均勻，提高了濺射沉積出的薄膜的均勻性，繼而提高了產品良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理腔</p>  
        <p type="p">21:靶材</p>  
        <p type="p">211:第二環狀凹槽</p>  
        <p type="p">22:饋電結構</p>  
        <p type="p">221:支撐結構</p>  
        <p type="p">2211:第一環狀凹槽</p>  
        <p type="p">222:傳動件</p>  
        <p type="p">23:功率源</p>  
        <p type="p">231:功率饋入元件</p>  
        <p type="p">24:第一馬達</p>  
        <p type="p">241:第一連接件</p>  
        <p type="p">25:屏蔽罩</p>  
        <p type="p">261:第二連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2263" publication-number="202627185"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627185.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>托盤組件以及化學氣相沉積裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/46</main-classification>  
        <further-classification edition="200601120260302B">C23C16/48</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉萊納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅時梁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張逸杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種托盤組件及化學氣相沉積裝置，所述托盤組件包括：托盤，用於承載基片，所述托盤的下表面在工藝過程中存在加熱不均勻的冷區；導光件，設置在所述托盤的下方；輔助輻射熱源，其發出的輻射光從所述導光件的一端入射，在所述導光件的內部以全反射的方式向前傳輸，從所述導光件的另一端投射在所述托盤的冷區，對所述冷區進行加熱。本發明用於消除托盤上的局部冷區，提高基片表面薄膜沉積均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應腔</p>  
        <p type="p">100a:上蓋</p>  
        <p type="p">100b:下蓋</p>  
        <p type="p">110:托盤</p>  
        <p type="p">111:導光件</p>  
        <p type="p">1111:主幹</p>  
        <p type="p">1112:分支</p>  
        <p type="p">112:輔助輻射熱源</p>  
        <p type="p">130:輻射熱源</p>  
        <p type="p">140:進氣口</p>  
        <p type="p">150:出氣口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2264" publication-number="202627146"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627146.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空傳輸腔、工藝平臺及其控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C14/56</main-classification>  
        <further-classification edition="200601120260302B">C23C14/54</further-classification>  
        <further-classification edition="200601120260302B">C23C16/448</further-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification>  
        <further-classification edition="200601120260302B">C23C16/52</further-classification>  
        <further-classification edition="202601120260302B">H10P14/43</further-classification>  
        <further-classification edition="202601120260302B">H10P14/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何偉業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王能語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖臘財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雯伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉學濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種真空傳輸腔和工藝平臺，真空傳輸腔包括：腔體，其具有多個介面，其中至少部分介面用於連接化學氣相沉積腔；吹掃裝置，其位於腔體的外部且連接腔體，用於提供氣體，以使腔體對化學氣相沉積腔形成正壓；抽真空裝置，其位於腔體的外部且連接腔體。工藝平臺包括真空傳輸腔，連接在腔體上的化學氣相沉積腔和非化學氣相沉積腔；控制器，用於控制吹掃裝置以使腔體對化學氣相沉積腔形成正壓。本發明可以降低腔體被化學氣相沉積腔污染的風險，並且可提高晶圓處理效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:腔體</p>  
        <p type="p">12:抽真空裝置</p>  
        <p type="p">13:吹掃裝置</p>  
        <p type="p">21:化學氣相沉積腔</p>  
        <p type="p">22:非化學氣相沉積腔</p>  
        <p type="p">101:介面</p>  
        <p type="p">102:分子泵</p>  
        <p type="p">103:低溫冷凝泵</p>  
        <p type="p">104:第一閥</p>  
        <p type="p">105:第二閥</p>  
        <p type="p">106:乾式真空泵</p>  
        <p type="p">F:氣流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2265" publication-number="202627469"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627469.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於氣櫃可燃性測試的系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">G01N31/12</main-classification>  
        <further-classification edition="200601120260128B">G01N33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王治平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋飄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋常征</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權漢釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種用於氣櫃可燃性測試的系統及方法，該系統至少包括：示蹤氣體容器，其通過示蹤氣體管路與一氣體模擬釋放點連通；氣體模擬釋放點位於氣櫃內部的閥門與管線的連接處；若干偵測器，每個偵測器通過一取樣管與一監測點連通；監測點至少設於氣櫃內部的電氣連接點；控制器，其與偵測器訊號連接；控制器用於對監測點處示蹤氣體濃度值與預設示蹤氣體濃度值進行比較，以判斷氣櫃的可燃性測試是否通過。本發明大幅提升了氣櫃可燃性測試的測試準確性及測試效率，且環境友好，具有廣泛的應用前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氣櫃</p>  
        <p type="p">11:管線</p>  
        <p type="p">12:閥門</p>  
        <p type="p">13:電氣連接點</p>  
        <p type="p">20:示蹤氣體容器</p>  
        <p type="p">21:示蹤氣體管路</p>  
        <p type="p">22:氣體模擬釋放點</p>  
        <p type="p">211:質量流量控制器</p>  
        <p type="p">212:調壓閥</p>  
        <p type="p">30:偵測器</p>  
        <p type="p">31:取樣管</p>  
        <p type="p">32:監測點</p>  
        <p type="p">321:近源位置點</p>  
        <p type="p">D1:近源偵測器</p>  
        <p type="p">D2:第一背景偵測器</p>  
        <p type="p">D3:第二背景偵測器</p>  
        <p type="p">D4~D15:監測點偵測器</p>  
        <p type="p">40:控制器</p>  
        <p type="p">60:排風裝置</p>  
        <p type="p">80:集成箱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2266" publication-number="202627179"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627179.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141520</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>前驅體輸送管路及半導體處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/455</main-classification>  
        <further-classification edition="200601120260302B">C23C16/52</further-classification>  
        <further-classification edition="202601120260302B">H10P14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓子迦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種前驅體輸送管路及半導體處理系統，所述前驅體輸送管路用於將源瓶內的前驅體輸送至反應腔，包括：至少一個第一管段，第一管段為開口向上的彎折段；至少兩個第二管段，第二管段與第一管段連接；源瓶與第一個第二管段連接，反應腔與最後一個第二管段連接；加熱器，設置在第一管段處，對第一管段進行加熱；其中，第一管段的兩端分別連接一個第二管段，第二管段的最低點高於或齊平於第一管段的最高點；本發明解決了固態前驅體堵塞前驅體輸送管路以及固態前驅體進入反應腔內污染晶圓的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:源瓶</p>  
        <p type="p">22:進氣閥</p>  
        <p type="p">23:載氣裝置</p>  
        <p type="p">24:出氣閥</p>  
        <p type="p">25:前驅體輸送管路</p>  
        <p type="p">26:反應腔</p>  
        <p type="p">27:第一加熱箱</p>  
        <p type="p">28:載氣通道</p>  
        <p type="p">29:第二加熱箱</p>  
        <p type="p">
        &lt;u&gt;251:第一管段&lt;/u&gt;
      </p>  
        <p type="p">252:第二管段</p>  
        <p type="p">252a、252b:第二管段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2267" publication-number="202628879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙通道的氣體噴淋頭、進氣裝置以及氣相沉積設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛緒光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任方波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳紅星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何偉業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓子迦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種雙通道的氣體噴淋頭、進氣裝置以及氣相沉積設備。氣體噴淋頭中勻氣盤的外圍設有第一氣體擴散腔和第一氣體彙聚腔，勻氣盤包括第一輸氣通道和第二輸氣通道：輸氣通道包括橫向通道和縱向通道，橫向通道包括沿第一方向橫向設置在勻氣盤內部的第一橫向通道，且第一橫向通道的兩端分別連通氣體擴散腔和氣體彙聚腔，縱向通道從第一橫向通道縱向貫通至勻氣盤的下表面，一部分第一氣體經由第一橫向通道到達第一氣體彙聚腔，另一部分第一氣體經由第一橫向通道、縱向通道到達反應腔；第二輸氣通道縱向貫通勻氣盤並與縱向通道間隔，第二氣體經由所述第二輸氣通道到達反應腔。本發明可以提高氣體噴淋頭的置換效率和氣相前驅體的進氣均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應腔</p>  
        <p type="p">200:基座</p>  
        <p type="p">300:進氣裝置</p>  
        <p type="p">310:氣體噴淋頭</p>  
        <p type="p">311:勻氣盤</p>  
        <p type="p">317:蓋板</p>  
        <p type="p">320:第一氣體源</p>  
        <p type="p">330:抽氣泵</p>  
        <p type="p">340:第二氣體源</p>  
        <p type="p">350:第一送氣管道</p>  
        <p type="p">360:第二送氣管道</p>  
        <p type="p">370:抽氣管道</p>  
        <p type="p">400:抽氣環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2268" publication-number="202628896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空傳輸腔以及工藝平臺</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/30</main-classification>  
        <further-classification edition="200601120260302B">C23C16/54</further-classification>  
        <further-classification edition="200601120260302B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王能語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雯伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何偉業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉學濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種真空傳輸腔和工藝平臺，真空傳輸腔包括：腔體，其具有多個傳片口，其中至少部分傳片口用於連接CVD腔；另一部分傳片口用於連接非CVD腔，所述傳片口上設置有閥門；冷阱，其位於腔體的內部，用於吸附所述CVD腔產生的污染顆粒；抽真空裝置，其位於腔體的外部並且連接所述腔體。工藝平臺包括所述真空傳輸腔，連接在真空傳輸腔上的CVD腔和非CVD腔；控制器，用於控制真空傳輸腔中各部件的啟閉。本發明通過冷阱吸附污染顆粒方式，減少了吹掃氣體使用，並提高了晶圓轉運效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:腔體</p>  
        <p type="p">102:CVD腔</p>  
        <p type="p">103:非CVD腔</p>  
        <p type="p">104:冷阱</p>  
        <p type="p">105:抽真空裝置</p>  
        <p type="p">111:傳片口</p>  
        <p type="p">112:閥門</p>  
        <p type="p">113:乾式機械真空泵</p>  
        <p type="p">114:分子泵</p>  
        <p type="p">115:低溫冷凝泵</p>  
        <p type="p">116:第一閥</p>  
        <p type="p">117:第二閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2269" publication-number="202628607"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628607.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141544</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251204B">H10D12/00</main-classification>  
        <further-classification edition="202501120251204B">H10D62/10</further-classification>  
        <further-classification edition="202501120251204B">H10D62/60</further-classification>  
        <further-classification edition="202501120251204B">H10D64/20</further-classification>  
        <further-classification edition="202501120251204B">H10D64/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美蓓亞功率半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINEBEA POWER SEMICONDUCTOR DEVICE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生井正輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMAI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在RC-IGBT中，抑制電洞向IGBT區域與二極體區域的邊界部附近的二極體區域的注入，降低恢復損失。一種包括RC-IGBT的半導體裝置100，其中IGBT區域21的IGBT中，射極電極14A與體層2經由接觸層8而歐姆連接，二極體區域22具有：陽極電極14B與陽極（陽極層12）進行肖特基連接的低注入二極體區域22B、以及陽極電極14B與陽極（陽極層12）經由接觸層8而歐姆連接的高注入二極體區域22A，高注入二極體區域22A與IGBT區域21鄰接地配置，低注入二極體區域22B與IGBT區域21之間介隔高注入二極體區域22A，從而與IGBT區域21分離地配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:漂移層</p>  
        <p type="p">2:體層</p>  
        <p type="p">3:溝槽</p>  
        <p type="p">4A:閘極絕緣膜</p>  
        <p type="p">4B:溝槽內絕緣膜</p>  
        <p type="p">5:閘極電極</p>  
        <p type="p">5A:第一閘極電極</p>  
        <p type="p">5B:第二閘極電極</p>  
        <p type="p">6:溝槽內電極</p>  
        <p type="p">7:射極層</p>  
        <p type="p">8:接觸層</p>  
        <p type="p">9:層間絕緣膜</p>  
        <p type="p">9A:溝槽內層間絕緣膜</p>  
        <p type="p">10:緩衝層</p>  
        <p type="p">11:集極層</p>  
        <p type="p">12:陽極層</p>  
        <p type="p">13:陰極接觸層</p>  
        <p type="p">14:表面電極</p>  
        <p type="p">14A:射極電極</p>  
        <p type="p">14B:陽極電極</p>  
        <p type="p">15:背面電極</p>  
        <p type="p">15A:集極電極</p>  
        <p type="p">15B:陰極電極</p>  
        <p type="p">16:場板</p>  
        <p type="p">21:IGBT區域</p>  
        <p type="p">22A:高注入二極體區域</p>  
        <p type="p">22B:低注入二極體區域</p>  
        <p type="p">100:半導體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2270" publication-number="202627419"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627419.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊提供程式</chinese-title>  
        <english-title>INFORMATION PROVIDING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G01C21/34</main-classification>  
        <further-classification edition="200601120260316B">G01C21/20</further-classification>  
        <further-classification edition="200601120260316B">G08B25/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商責愛泰克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENETEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野憲二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤義仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTOH, YOSHIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供考慮了避難完成預測時間的資訊提供程式等。 &lt;br/&gt;資訊提供程式係用於引導從路徑引導對象中的一個以上的出發區域之各者往該路徑引導對象中的一個以上的到達區域之避難路徑。資訊提供程式執行：根據關於各該出發區域的人員配置之第一資訊、關於在依災害發生場所分類下且包含依該出發區域分類的避難路徑之兩個以上的候補避難路徑群之第二資訊、關於根據該第一資訊與該第二資訊計算出的依該災害發生場所分類且依該兩個以上的候補避難路徑群分類的避難完成預測時間之第三資訊、及關於災害之至少場所的第四資訊，而從該兩個以上的候補避難路徑群特定一個避難路徑群之計算步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide an information providing system or the like that considers estimated evacuation completion times. &lt;br/&gt; An information providing system of the invention provides guidance for an evacuation route from each of one or more departure areas in a route guidance zone to one or more arrival areas in the route guidance zone. The information providing system executes a calculation process that identifies one evacuation route group from two or more candidate evacuation route groups based on first information regarding personnel distribution for each departure area, second information regarding the two or more candidate evacuation route groups including evacuation routes for each disaster location and each departure area, third information, which is calculated based on the first information and the second information, and relates to the estimated evacuation completion times for each disaster location and each of the two or more candidate evacuation route groups, and fourth information which is information regarding the disaster including at least the location thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A33b:第三十三輸出裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2271" publication-number="202628486"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628486.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於最佳化EUV光源中之電漿產生之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR OPTIMIZING PLASMA GENERATION IN AN EUV LIGHT SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05G1/10</main-classification>  
        <further-classification edition="200601120260401B">H05G1/32</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾金斯　威廉　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALKINS, WILLIAM LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼可拉夫　伊萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKOLAEV, IVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮區　切里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PICH, CHERISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪耶達　傑森　瑪那布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYEDA, JASON MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍　衛韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, JASMINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里達爾　欽梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRIDHAR, CHINMAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　錦城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAY, JUSTIN KAM SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明論述了用於初始化一極紫外線(EUV)源之系統及方法。該EUV輻射源可包括：一小滴產生器，其經組態以產生一目標材料之一小滴流；一雷射源，其以通訊方式耦接至一控制器。該雷射源經組態以：產生一第一脈衝光束，該第一脈衝光束在與一小滴相互作用後隨即起始該小滴之一形狀之一修改，從而形成一經修改小滴；及產生一第二脈衝光束，該第二脈衝光束經組態以使該經修改小滴實質上蒸發，藉此產生EUV光脈衝。該EUV輻射源包含一第一致動器，其以通訊方式耦接至該控制器，且經組態以調整該第二脈衝束之一寬度以最小化該等EUV光脈衝之能量之一變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for initializing an extreme ultraviolet (EUV) source are discussed. The EUV radiation source may include a droplet generator configured to generate a stream of droplets of a target material, a laser source communicatively coupled to a controller. The laser source is configured to generate a first pulsed beam of light, which upon interaction with a droplet, initiates a modification of a shape of the droplet, forming a modified droplet, and generate a second pulsed beam of light configured to substantially evaporate the modified droplet, thereby generating pulses of EUV light. The EUV radiation source comprises a first actuator communicatively coupled to the controller and configured to adjust a width of the second pulsed beam to minimize a variation of energy of the pulses of EUV light.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">601:光軸</p>  
        <p type="p">610:主脈衝束</p>  
        <p type="p">625:經修改小滴目標</p>  
        <p type="p">630:偏移</p>  
        <p type="p">650:方向</p>  
        <p type="p">MP&lt;sub&gt;w&lt;/sub&gt;:主脈衝束大小</p>  
        <p type="p">R&lt;sub&gt;y&lt;/sub&gt;:傾斜角</p>  
        <p type="p">-x:方向</p>  
        <p type="p">y:方向</p>  
        <p type="p">z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2272" publication-number="202627716"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627716.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輸出裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G05B19/4062</main-classification>  
        <further-classification edition="200601120260316B">B23Q17/00</further-classification>  
        <further-classification edition="200601120260316B">G05B19/4068</further-classification>  
        <further-classification edition="200601120260316B">G05B19/408</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田知正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠定量地確認重複控制所產生之效果之輸出裝置。輸出裝置具備：接收部，其自對週期性地動作之被驅動體進行驅動控制之數值控制裝置，接收被驅動體之動作資料；記憶部，其記憶接收部已接收之動作資料；週期取得部，其取得被驅動體之週期性動作之週期；分割部，其將動作資料就每個週期分割為複數個分割動作資料；以及輸出部，其將複數個分割動作資料以複數個分割動作資料之各自之起始點對齊的方式配置並輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:數值控制系統</p>  
        <p type="p">10:工作機械</p>  
        <p type="p">20:數值控制裝置</p>  
        <p type="p">30:顯示裝置</p>  
        <p type="p">31:接收部</p>  
        <p type="p">32:記憶部</p>  
        <p type="p">33:控制部</p>  
        <p type="p">34:顯示部</p>  
        <p type="p">331:週期取得部</p>  
        <p type="p">332:分割部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2273" publication-number="202628097"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628097.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置的數據對準電路</chinese-title>  
        <english-title>DATA ALIGNMENT CIRCUIT OF MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G11C11/407</main-classification>  
        <further-classification edition="200601120260401B">G11C7/10</further-classification>  
        <further-classification edition="200601120260401B">G11C7/22</further-classification>  
        <further-classification edition="200601120260401B">G11C8/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金龍珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YONG JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種記憶體裝置的數據對準電路。數據對準電路包括數據選通（data strobe，DQS）電路、同步控制電路以及數據對準器。DQS電路產生輸出DQS信號。同步控制電路依據記憶體裝置的至少一裝置時脈以及輸出DQS信號產生同步控制時脈，並依據同步控制時脈以及輸出DQS信號產生輸出控制信號。每個數據對準器分別依據輸出DQS信號對數據進行取樣，並分別依據同步控制時脈以及輸出控制信號輸出輸出數據。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data alignment circuit of a memory device is provided. The data alignment circuit includes a data strobe (DQS) circuit, a synchronous control circuit and data aligners. The DQS circuit generates an output DQS signal. The synchronous control circuit generates a synchronous control clock according to at least one device clock of the memory device and the output DQS signal, and generates an output control signal according to the synchronous control clock and the output DQS signal. Each of the data aligners samples a data according to the output DQS signal respectively and outputs an output data according to the synchronous control clock and the output control signal respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:數據對準電路</p>  
        <p type="p">110:DQS電路</p>  
        <p type="p">120:同步控制電路</p>  
        <p type="p">130_1~130_8:數據對準器</p>  
        <p type="p">CK:裝置時脈</p>  
        <p type="p">CK_DIV:同步控制時脈</p>  
        <p type="p">Dout1~Dout8:輸出數據</p>  
        <p type="p">Din1~Din8:數據</p>  
        <p type="p">DQSOUT:輸出DQS信號</p>  
        <p type="p">SEO:輸出控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2274" publication-number="202626427"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626427.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保持觸底緩衝器之托架部分</chinese-title>  
        <english-title>CARRIER PART TO RETAIN BOTTOM-OUT BUMPER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B62K21/08</main-classification>  
        <further-classification edition="200601120260331B">B62K25/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　威廉　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER, WILLIAM M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉爾伯特　達蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILBERT, DAMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一避震叉之緩衝器托架包括一底板及一保持特徵。保持特徵可配置以將一觸底緩衝器固接至緩衝器托架。在一些態樣中，保持特徵包括與底板成一體之一環形壁，環形壁可至少部分地嵌套觸底緩衝器。環形壁可界定由突出部包圍以保持觸底緩衝器之一環形凹口。底板可包括用於耦接至一頂帽之孔隙。在一些實現中，緩衝器托架包括永久地附著至底板之至少一個彈性部分，至少一個彈性部分可包覆成型或黏附地接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bumper carrier for a suspension fork includes a base plate and a retention feature. The retention feature may be configured to secure a bottom-out bumper to the bumper carrier. In some aspects, the retention feature comprises an annular wall integral with the base plate, which may at least partially nest the bottom-out bumper. The annular wall can define an annular notch surrounded by protrusions to retain the bottom-out bumper. The base plate may include apertures for coupling to a topcap. In some implementations, the bumper carrier includes at least one elastomeric portion permanently affixed to the base plate, which may be overmolded or adhesively bonded.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103b:上管/第二上管</p>  
        <p type="p">106b:下管/第二下管</p>  
        <p type="p">145:氣動軸</p>  
        <p type="p">148b:觸底緩衝器</p>  
        <p type="p">151b:觸底總成/第二觸底總成</p>  
        <p type="p">154:緩衝器托架</p>  
        <p type="p">160:頂帽</p>  
        <p type="p">166:接收表面</p>  
        <p type="p">169:環形壁</p>  
        <p type="p">170:環形槽</p>  
        <p type="p">183:凸耳</p>  
        <p type="p">186:環形壓痕</p>  
        <p type="p">200:空氣洩壓總成</p>  
        <p type="p">203:釋放機構</p>  
        <p type="p">204:彈簧</p>  
        <p type="p">205:彈簧板表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2275" publication-number="202628401"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628401.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141600</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種漫遊方法及裝置</chinese-title>  
        <english-title>ROAMING METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260327B">H04L43/0811</main-classification>  
        <further-classification edition="202201120260327B">H04L45/02</further-classification>  
        <further-classification edition="202201120260327B">H04L45/851</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉志成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, ZHICHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳云曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫豔賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YANBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種漫遊方法及裝置，涉及通信技術領域，用於提供主從光網路單元的處理流程。方法包括：主光網路單元MFU向目標SFU發送漫遊預處理消息，所述漫遊預處理消息用於指示所述目標SFU針對所述站點啟動漫遊準備；所述MFU接收來自所述目標SFU的漫遊預處理回饋消息，所述漫遊預處理回饋消息用於指示針對所述站點的漫遊準備是否成功。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A roaming method and apparatus, related to the field of communication technologies, are provided for processing procedures of a master and slave optical network units. The method includes: a main optical fiber network unit (MFU) sending a roaming preprocessing message to a target SFU, where the roaming preprocessing message is used to instruct the target SFU to initiate roaming preparation for the site; and the MFU receiving a roaming preprocessing feedback message from the target SFU, where the roaming preprocessing feedback message is used to indicate whether the roaming preparation for the site was successful.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2276" publication-number="202628449"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628449.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260401B">H04W36/08</main-classification>  
        <further-classification edition="202101120260401B">H04W12/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫豔賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YANBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳云曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信方法及裝置，涉及通信技術領域，用於降低或者避免站點漫遊過程中的較長的業務中斷時間。方法包括：第一SFU獲得來自站點的關聯請求幀（或者重關聯請求幀），以及與站點之間通信所使用的秘鑰，關聯請求幀（重關聯請求幀）用於站點與第一SFU進行關聯；第一SFU向主光網路單元MFU發送關聯請求幀（或者重關聯請求幀）以及秘鑰。MFU向第二SFU發送關聯請求幀（或者重關聯請求幀）以及秘鑰。在上線關聯階段，SFU將獲得的關聯請求幀以及秘鑰同步給MFU，MFU再同步給其它SFU，使得在漫遊階段無需在重新獲得聯請求幀以及秘鑰，降低漫遊切換流程的複雜度，從而降低或者避免站點漫遊過程中的較長的業務中斷時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and apparatus relate to the field of communication technologies, and are used to reduce or avoid a long service interruption time during a station roaming process. The method includes: obtaining, by a first SFU, an association request frame (or reassociation request frame) and a key used for communication with a station, where the association request frame (or reassociation request frame) is used by the station to associate with the first SFU; and sending, by the first SFU, the association request frame (or reassociation request frame) and the key to a master optical network unit (MFU). The MFU then sends the association request frame (or reassociation request frame) and the key to a second SFU. During the online association phase, the SFU synchronizes the obtained association request frame and key to the MFU, which then synchronizes them to other SFUs. This eliminates the need to re-obtain the association request frame and key during the roaming phase, thereby reducing the complexity of the roaming handover process and thus reducing or avoiding a long service interruption time during the station roaming process.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2277" publication-number="202625933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141606</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>層架與儲存系統</chinese-title>  
        <english-title>A SHELF AND A STORAGE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A47B96/02</main-classification>  
        <further-classification edition="200601120260330B">A47B45/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商艾法國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELFA INTERNATIONAL AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼爾森　彼德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NILSSON, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容關於一種用於儲存系統的層架(9)。此層架包括由金屬片腹板所形成的主體件(13)，金屬片腹板在前邊緣(15)和後邊緣(17)處被彎曲，離開頂表面(11)的平面，以形成垂直的前邊緣表面和後邊緣表面(19)。層架還包括側部件(21)，其被附接到主體件(13)且具有連接裝置(23、25)，用於連接到相應的托架，從而使層架懸掛。每一個側部件(21)具有覆蓋主體件(13)的側邊緣(29)之水平的頂凸緣(27)、及包括連接裝置(23、25)的垂直區段(31)。中間區段(33)位在頂凸緣(27)和垂直區段(31)之間，使得垂直區段在側邊緣(29)下方內縮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a shelf 9 for a storage system. The shelf comprises a main piece 13 being formed by a sheet metal web, which is bent, at a front 15 and a rear 17 edge, out of the plane of the top surface 11 to form vertical front and rear edge surfaces 19. The shelf further comprises side pieces 21, attached to the main piece 13 and having connector means 23, 25 for connecting to a respective bracket thereby suspending the shelf. Each side piece 21 has a horizontal top flange 27 covering a side edge 29 of the main piece 13 and a vertical section 31 comprising said connector means 23, 25. An intermediate section 33 is located between the top flange 27 and the vertical section 31, such that the vertical section is retracted under the side edge 29.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">9:層架</p>  
        <p type="p">11:頂表面</p>  
        <p type="p">13:主體件</p>  
        <p type="p">15:前邊緣</p>  
        <p type="p">17:後邊緣</p>  
        <p type="p">19:前(邊緣)表面</p>  
        <p type="p">20:底凸緣</p>  
        <p type="p">21:側部件</p>  
        <p type="p">29:側邊緣</p>  
        <p type="p">41:(強化)樑</p>  
        <p type="p">43:部分區段/部分</p>  
        <p type="p">45:中間區段/未拉伸部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2278" publication-number="202627530"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627530.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及透鏡部</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G02B1/08</main-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification>  
        <further-classification edition="200601120260401B">G02B5/30</further-classification>  
        <further-classification edition="200601120260401B">G02B3/02</further-classification>  
        <further-classification edition="201901120260401B">B32B7/023</further-classification>  
        <further-classification edition="200601120260401B">B32B27/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南原拓彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMBARA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施形態之光學積層體，依序具備：包含吸收型偏光膜之吸收型偏光構件、樹脂層及薄膜構件；前述吸收型偏光膜包含顯示二色性之有機染料；前述樹脂層係與前述吸收型偏光膜直接鄰接；且，前述樹脂層在85℃下之彈性模數為1.0×10&lt;sup&gt;6&lt;/sup&gt;Pa以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:吸收型偏光構件</p>  
        <p type="p">32:吸收型偏光膜</p>  
        <p type="p">40:樹脂層</p>  
        <p type="p">50:薄膜構件</p>  
        <p type="p">52:基材</p>  
        <p type="p">54:表面處理層</p>  
        <p type="p">62:黏著劑層</p>  
        <p type="p">100A:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2279" publication-number="202628906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬運位置之調整方法、基板搬運方法及基板處理系統</chinese-title>  
        <english-title>METHOD OF ADJUSTING SUBSTRATE TRANSFER POSITION, SUBSTRATE TRANSFER METHOD, AND SUBSTRATE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P72/50</main-classification>  
        <further-classification edition="202601120260331B">H10P72/30</further-classification>  
        <further-classification edition="200601120260331B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩野純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWANO, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺本聡寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAMOTO, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田博司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可減低從批次處理部搬運至單片處理部之基板的位置偏移之技術。&lt;br/&gt; 依本發明之一態樣之基板搬運位置之調整方法，係用於包含將複數片基板一起處理之批次處理部、將該基板逐片處理之單片處理部及使從該批次處理部搬運至該單片處理部之基板待機之基板待機部之基板處理系統；該基板待機部包含載置該基板之轉移台及將在該批次處理部處理後之該基板載置於該轉移台之第一搬運機器人；該單片處理部包含從該轉移台取得該基板之第二搬運機器人；該第一搬運機器人包含固持該基板之第一固持部；該第二搬運機器人包含固持該基板之第二固持部；該基板搬運位置之調整方法包含以下步驟：該第二固持部從該轉移台取得基板；在由該第二固持部固持著從該轉移台取得之該基板之狀態下，檢測該基板相對於基準位置之偏移量；以及根據檢測出之該偏移量，修正該第一固持部將該基板載置於該轉移台時之水平位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of adjusting a substrate transfer position is provided in a substrate processing system including: a batch processing section; a single-substrate processing section; and a substrate standby section configured to cause a substrate to be transferred from the batch processing section to the single-substrate processing section to wait. The substrate standby section includes: a delivery table; and a first transfer robot including a first holding section. The single-substrate processing section includes a second transfer robot including a second holding section. The method includes: acquiring, by the second holding section, the substrate from the delivery table; detecting a shift amount of the substrate with respect to a reference position while the second holding section holds the substrate acquired from the delivery table; and correcting a horizontal position when the first holding section mounts the substrate on the delivery table, based on the detected shift amount.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理系統</p>  
        <p type="p">2:搬入搬出部</p>  
        <p type="p">21:載入口</p>  
        <p type="p">22:儲存器</p>  
        <p type="p">23:載入器</p>  
        <p type="p">24:匣盒搬運裝置</p>  
        <p type="p">3:第一介面部</p>  
        <p type="p">31:基板移載裝置</p>  
        <p type="p">31a:基板固持手臂</p>  
        <p type="p">32:批量形成部</p>  
        <p type="p">33:第一轉移部</p>  
        <p type="p">4:批次處理部</p>  
        <p type="p">41:藥液槽</p>  
        <p type="p">42:清洗液槽</p>  
        <p type="p">43:第一搬運裝置</p>  
        <p type="p">43a:導軌</p>  
        <p type="p">43b:第一搬運手臂</p>  
        <p type="p">44:處理具</p>  
        <p type="p">45:驅動裝置</p>  
        <p type="p">5:第二介面部</p>  
        <p type="p">51:浸漬槽</p>  
        <p type="p">52:第二搬運裝置</p>  
        <p type="p">52a:Y軸驅動裝置</p>  
        <p type="p">52b:Z軸驅動裝置</p>  
        <p type="p">52c:第二搬運手臂</p>  
        <p type="p">53:第三搬運裝置</p>  
        <p type="p">53a:第三搬運手臂</p>  
        <p type="p">54:第二轉移部</p>  
        <p type="p">6:單片處理部</p>  
        <p type="p">61:第四搬運裝置</p>  
        <p type="p">61a:導軌</p>  
        <p type="p">61b:第四搬運手臂</p>  
        <p type="p">62:液處理裝置</p>  
        <p type="p">63:乾燥裝置</p>  
        <p type="p">C:匣盒</p>  
        <p type="p">W:基板</p>  
        <p type="p">9:控制電路</p>  
        <p type="p">91:演算部</p>  
        <p type="p">92:記憶部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2280" publication-number="202627034"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627034.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法、半導體裝置之製造方法及蝕刻裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K13/00</main-classification>  
        <further-classification edition="202601120260401B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井拓海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森啓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOMORI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提昇對含氮矽化合物膜之蝕刻速度之蝕刻方法、半導體裝置之製造方法及蝕刻裝置。 &lt;br/&gt;本發明係關於一種蝕刻方法，其使用將包含碳數5以下之氫氟碳之蝕刻氣體組合物電漿化而獲得之電漿氣體，於0℃以下對含氮矽化合物膜進行蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:下部電極</p>  
        <p type="p">15:上部電極</p>  
        <p type="p">18:基板</p>  
        <p type="p">100:蝕刻裝置</p>  
        <p type="p">110:腔室</p>  
        <p type="p">121,122:配管</p>  
        <p type="p">123,124:PI(壓力計)</p>  
        <p type="p">125,126:閥門</p>  
        <p type="p">127:真空泵</p>  
        <p type="p">130:惰性氣體供給部</p>  
        <p type="p">131,135:配管</p>  
        <p type="p">132:流量調整機構</p>  
        <p type="p">133,134:閥門</p>  
        <p type="p">140:蝕刻氣體供給部</p>  
        <p type="p">141,145:配管</p>  
        <p type="p">142:流量調整機構</p>  
        <p type="p">143,144:閥門</p>  
        <p type="p">150:氧化性氣體供給部</p>  
        <p type="p">151,155:配管</p>  
        <p type="p">152:流量調整機構</p>  
        <p type="p">153,154:閥門</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2281" publication-number="202627032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光元件及含彼之發光裝置</chinese-title>  
        <english-title>LIGHT-EMITTING ELEMENT AND LIGHT-EMITTING DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C09K11/06</main-classification>  
        <further-classification edition="200601120260318B">H05B33/14</further-classification>  
        <further-classification edition="202301120260318B">H10K50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬尾哲史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬尾広美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, HIROMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋辰義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TATSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種將螢光材料用作發光物質的發光元件，其具有較高的發光效率。本發明提供一種包括熱活化延遲螢光物質和螢光材料之混合物的發光元件。藉由對螢光材料的S&lt;sub&gt;1&lt;/sub&gt;能階的吸收中的最長波長一側的吸收帶與熱活化延遲螢光物質的發射光譜重疊，可將熱活化延遲螢光物質的S&lt;sub&gt;1&lt;/sub&gt;能階的能量轉移到螢光材料的S&lt;sub&gt;1&lt;/sub&gt;。可替代地，也可由熱活化延遲螢光物質的T&lt;sub&gt;1&lt;/sub&gt;能階的能量的一部分生成熱活化延遲螢光物質的S&lt;sub&gt;1&lt;/sub&gt;，且使該熱活化延遲螢光物質的S&lt;sub&gt;1&lt;/sub&gt;轉移到螢光材料的S&lt;sub&gt;1&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a light-emitting element which uses a fluorescent material as a light-emitting substance and has higher luminous efficiency. To provide a light-emitting element which includes a mixture of a thermally activated delayed fluorescent substance and a fluorescent material. By making the emission spectrum of the thermally activated delayed fluorescent substance overlap with an absorption band on the longest wavelength side in absorption by the fluorescent material in an S&lt;sub&gt;1&lt;/sub&gt; level of the fluorescent material, energy at an S&lt;sub&gt;1&lt;/sub&gt; level of the thermally activated delayed fluorescent substance can be transferred to the S&lt;sub&gt;1&lt;/sub&gt; of the fluorescent material. Alternatively, it is also possible that the S&lt;sub&gt;1&lt;/sub&gt; of the thermally activated delayed fluorescent substance is generated from part of the energy of a T&lt;sub&gt;1&lt;/sub&gt; level of the thermally activated delayed fluorescent substance, and is transferred to the S&lt;sub&gt;1&lt;/sub&gt; of the fluorescent material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:第一電極</p>  
        <p type="p">102:第二電極</p>  
        <p type="p">113:發光層</p>  
        <p type="p">113A:發光物質</p>  
        <p type="p">113D:熱活化延遲螢光物質</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2282" publication-number="202626262"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626262.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環保拋光墊及其製造方法</chinese-title>  
        <english-title>ECO-FRIENDLY POLISHING PAD AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260401B">B24B37/20</main-classification>  
        <further-classification edition="201201120260401B">B24B37/22</further-classification>  
        <further-classification edition="201201120260401B">B24B37/24</further-classification>  
        <further-classification edition="200601120260401B">B24D11/00</further-classification>  
        <further-classification edition="200601120260401B">B24D18/00</further-classification>  
        <further-classification edition="202601120260401B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商恩普士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENPULSE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智民景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, MINGYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹鍾旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李都炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DOEHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐章源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JANGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文壽泳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, SUYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔恩基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, EUNGI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪太壹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, TAEIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例係關於一種拋光墊，其包含一頂墊層及一子墊層，且係關於一種用於製備該拋光墊之方法。該等實施例係關於一種包含生物質組分之環保拋光墊，且係關於一種用於製備該環保拋光墊之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiments relate to a polishing pad that comprises a top pad layer and a sub pad layer, and to a process for preparing the same. They relate to an environmentally friendly polishing pad that comprises biomass components, and to a process for preparing the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:頂墊層</p>  
        <p type="p">20:黏著層</p>  
        <p type="p">30:子墊層</p>  
        <p type="p">100:拋光墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2283" publication-number="202626832"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626832.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有改良的透射率之拋光墊及用於製備其之方法及用於其中之窗區塊</chinese-title>  
        <english-title>POLISHING PAD WITH IMPROVED TRANSMITTANCE, AND METHOD FOR PREPARING THE SAME AND WINDOW BLOCK USED THEREIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C08G18/40</main-classification>  
        <further-classification edition="201201120260316B">B24B37/24</further-classification>  
        <further-classification edition="202601120260316B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商恩普士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENPULSE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李都炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DOEHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐章源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JANGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹鍾旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, JONGWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金潁煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金京煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴相圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SANGKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施例之拋光墊包含具有至少一個窗區塊之頂墊，其中該窗區塊包含聚胺甲酸酯樹脂，該聚胺甲酸酯樹脂包含異氰酸酯組分及多元醇組分，且該多元醇組分包含一60莫耳%或更大之量的式(1)之化合物。在根據以上實施例之該拋光墊中，該窗區塊之透射率經改良以提高厚度量測之準確度，且該窗區塊具有極佳的硬度以增強CMP製程之效率及可靠性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The polishing pad according to an embodiment comprises a top pad having at least one window block, wherein the window block comprises a polyurethane resin, the polyurethane resin comprises an isocyanate component and a polyol component, and the polyol component comprises a compound of Formula (1) in an amount of 60% by mole or more. In the polishing pad according to the above embodiment, the transmittance of the window block is improved to increase the accuracy of thickness measurements, and the window block has excellent hardness to enhance the efficiency and reliability of a CMP process.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2284" publication-number="202628248"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628248.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可抑制柵波增益之相控陣列天線模組及其相移控制方法</chinese-title>  
        <english-title>PHASE-CONTROL ARRAY ANTENNA MODULE CAPABLE OF SUPRESSING GRATING LOBE GAIN AND PHASE-SHIFT CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01Q21/06</main-classification>  
        <further-classification edition="200601120260327B">H01Q3/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>乾坤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYNTEC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張繼禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHI-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃炳彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周聖儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, SHENG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯春志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, CHUN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案為可抑制柵波增益之相控陣列天線模組，包括陣列天線及波束轉向單元。陣列天線包括複數個子天線。每一子天線包含至少一個天線單元，且任兩相鄰行或列之子天線在第一方向錯位排列。波束轉向單元經由複數個子天線輸出或接收複數個射頻訊號。在方位角方向的任兩射頻訊號之間具相移單元角度，其對應於陣列天線之波束的微波輻射場型在方位角方向的轉向角度而改變。沒有錯位與有錯位的兩相鄰子天線之複數個射頻訊號在俯仰角方向上之任兩相對應者之間定義一補償角度。在第一及第二相移單元角度區間時，補償角度分別為第一及第二補償角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a phase-control array antenna module capable of suppressing grating lobe gain. The phase-control array antenna module includes an array antenna and a beam steering unit. The array antenna includes a plurality of sub-antennas. Each sub-antenna includes at least one antenna unit. The sub-antennas of any two adjacent rows or columns are staggered in the first direction. The beam steering unit outputs and receives a plurality of RF signals through the plurality of sub-antennas. A phase-shift unit angle is formed between any two adjacent RF signals in the azimuth direction and changes in related to a steering angle of a beam according to a microwave radiation pattern of the array antenna in the azimuth direction. A compensation angle is defined between any two corresponding RF signals in an elevation direction and from the two adjacent sub-antennas with and without staggering. In the first phase-shift unit angle interval, the compensation angle is a first compensation angle; and in the second phase-shift unit angle interval, the compensation angle is a second compensation angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:陣列天線</p>  
        <p type="p">21:子天線</p>  
        <p type="p">22:天線單元</p>  
        <p type="p">22A、22B:天線單元之外側端</p>  
        <p type="p">D1:錯位間距</p>  
        <p type="p">D2:間距</p>  
        <p type="p">L1:基準線</p>  
        <p type="p">X、Y、Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2285" publication-number="202626294"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626294.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自律移動體、自律移動體之控制方法、及自律移動體之控制程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B25J5/00</main-classification>  
        <further-classification edition="200601120260323B">B25J13/00</further-classification>  
        <further-classification edition="200601120260323B">B25J13/08</further-classification>  
        <further-classification edition="202401120260323B">G05D1/639</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田義基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, YOSHIMOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種自律移動體，其具備：電動馬達；車輪，其由前述電動馬達驅動；及處理電路，其控制前述電動馬達。前述處理電路當外力被施加至前述自律移動體時，以前述車輪因前述外力而動作之方式停止對前述電動馬達供給電力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:自律移動體</p>  
        <p type="p">2:伺服器</p>  
        <p type="p">3:人類</p>  
        <p type="p">11:車輪</p>  
        <p type="p">12:車體</p>  
        <p type="p">13:貨台</p>  
        <p type="p">14:連結結構</p>  
        <p type="p">15:防護桿</p>  
        <p type="p">16:緊急停止按鈕</p>  
        <p type="p">22:電動馬達</p>  
        <p type="p">25:測位感測器</p>  
        <p type="p">26:觸控面板顯示器</p>  
        <p type="p">30:緊急停止開關</p>  
        <p type="p">33:第1壓力感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2286" publication-number="202626307"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626307.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制自律移動體之處理電路、控制方法、控制程式、及處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">B25J13/00</main-classification>  
        <further-classification edition="200601120260323B">B25J13/08</further-classification>  
        <further-classification edition="200601120260323B">B25J19/02</further-classification>  
        <further-classification edition="200601120260323B">G06F9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田義基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, YOSHIMOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的處理電路，於在發送藉由自律移動體所取得之取得資訊之後的既定時間以內，未能接收到根據前述取得資訊所演算出的與前述自律移動體之動作有關的動作資訊的情形時，或是於在發送前述取得資訊之後，預測為在前述既定時間內未能接收到前述動作資訊的情形時，輸出用於使前述自律移動體實施可讓前述自律移動體之周圍的人類認知的既定運動之運動指令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理系統</p>  
        <p type="p">2:伺服器</p>  
        <p type="p">3:人類</p>  
        <p type="p">10:自律移動體</p>  
        <p type="p">11:車輪</p>  
        <p type="p">12:基礎框架</p>  
        <p type="p">13:連結結構</p>  
        <p type="p">14:本體</p>  
        <p type="p">15:防護桿</p>  
        <p type="p">16:臂</p>  
        <p type="p">17:手</p>  
        <p type="p">18:頭部</p>  
        <p type="p">22:推進馬達</p>  
        <p type="p">25:觸控面板顯示器</p>  
        <p type="p">30:測位感測器</p>  
        <p type="p">33:壓力感測器</p>  
        <p type="p">N:通訊網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2287" publication-number="202626490"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626490.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141654</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>甲烷燃燒觸媒及含有硫氧化物之燃燒排氣之淨化方法</chinese-title>  
        <english-title>METHANE COMBUSTION CATALYST AND METHOD FOR PURIFYING COMBUSTION EXHAUST GAS CONTAINING SULFUR OXIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">C01B3/38</main-classification>  
        <further-classification edition="200601120260327B">C01G19/02</further-classification>  
        <further-classification edition="200601120260327B">C01G30/00</further-classification>  
        <further-classification edition="200601120260327B">B01J23/14</further-classification>  
        <further-classification edition="200601120260327B">B01J23/18</further-classification>  
        <further-classification edition="200601120260327B">F23C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商田中貴金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田和剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤俊祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高根澤豪紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKANEZAWA, HIDENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於於含有氧化錫作為必需成分之氧化錫系載體上載持鉑及/或鉑氧化物而成，用以燃燒含有硫氧化物之燃燒排氣中的甲烷之Pt/SnO&lt;sub&gt;2&lt;/sub&gt;系甲烷燃燒觸媒。本發明之甲烷燃燒觸媒中，上述氧化錫系載體係由摻雜銻之氧化錫(ATO)所構成。此時，氧化錫系載體中之銻的摻雜量，較佳為0.1質量%以上且5.0質量%以下。本發明中，氧化錫中所摻雜之銻，會提高氧化錫所具有之對鉑等的氧供給能力。藉此，達成甲烷燃燒觸媒之活性及耐久性的提高。本發明之Pt/SnO&lt;sub&gt;2&lt;/sub&gt;系甲烷燃燒觸媒，即使不應用銥之追加性的載持或覆蓋層，亦為高活性且耐久性優良。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A methane combustion catalyst including platinum and/or platinum oxide supported on a tin oxide-based support containing tin oxide as an essential component, and for combusting methane in combustion exhaust gas containing sulfur oxides. The tin oxide-based support is made of antimony-doped tin oxide (ATO). The amount of antimony doped in the tin oxide-based support is preferably 0.1% by mass or more and 5.0% by mass or less. The antimony doped in the tin oxide improves the tin oxide's ability to supply oxygen to platinum and other metals, thereby improving the activity and durability of the methane combustion catalyst without the need for additional iridium support or the addition of an overcoat layer.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2288" publication-number="202627747"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627747.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有無洩漏快速連接器之用於ＩＴ基礎設施之直接液冷構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G06F1/20</main-classification>  
        <further-classification edition="200601120260324B">H05K7/20</further-classification>  
        <further-classification edition="200601120260324B">F28F9/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商威圖公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RITTAL GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡喬　阿隆索　胡安　卡洛斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CACHO ALONSO, JUAN CARLOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁鐵生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種用於IT基礎設施之直接液冷（DLC）的構造，其中，該構造具有至少一冷卻劑迴路（15），其包含用於提供經冷卻之液體的冷卻劑分配單元（Coolant Distribution Units - CDU），其中，一膨脹容器（10）透過一無洩漏的快速連接器（50）流體連接至冷卻劑迴路（15）上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2.1:插入式設備</p>  
        <p type="p">6.1:第一盲接頭插式連接器</p>  
        <p type="p">6.2:第二盲接頭插式連接器</p>  
        <p type="p">10:膨脹容器</p>  
        <p type="p">13:殼體</p>  
        <p type="p">14:泵</p>  
        <p type="p">23:溫度及濕度感測器</p>  
        <p type="p">26:空氣差壓感測器</p>  
        <p type="p">50:無洩漏的快速連接器</p>  
        <p type="p">51:檢修開口</p>  
        <p type="p">52:閉合元件</p>  
        <p type="p">53:導引件</p>  
        <p type="p">54:可撓性軟管</p>  
        <p type="p">x:插入方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2289" publication-number="202627408"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627408.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擷取微影光罩上結構影像的裝置</chinese-title>  
        <english-title>DEVICE FOR CAPTURING IMAGES OF STRUCTURES ON PHOTOLITHOGRAPHIC MASKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G01B11/04</main-classification>  
        <further-classification edition="201201120260330B">G03F1/84</further-classification>  
        <further-classification edition="200601120260330B">G03F7/207</further-classification>  
        <further-classification edition="201701120260330B">G06T7/50</further-classification>  
        <further-classification edition="202601120260330B">H10P14/61</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬泰卡　尤瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATEJKA, ULRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　卓爾　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DRIEL, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克波姆　鹿茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREKERBOHM, LUTZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛葛斯基　歐拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROGALSKY, OLAF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多林　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOEHRING, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高勒斯　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOELLES, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊特根　慕尼黑　約翰內斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLEITGEN-MUENCH, JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種擷取微影光罩上結構影像、特別是微影光罩上結構的裝置（1）。就該裝置（1）而言，設置在物體載台（30）上的微影光罩（20）之區域係在每個情況，用掃描操作期間由影像擷取單元（40）之複數影像擷取感測器（42）以時間偏移的方式擷取，其中在該掃描操作期間對該微影光罩（20）與該影像擷取單元（40）之間該距離的調整，確保該微影光罩（20）上相同區域之該等所擷取影像係以不同方式聚焦。然後，由該等影像產生的該散焦特徵的該等變數係用於確定該裝置（1）之重新聚焦是否為必要，特別是該影像擷取單元（40）與該物體載台（30）之間該距離的調適是否係必須超出以不同方式所聚焦影像之該擷取所需的變化量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a device (1) for capturing images of structures on microlithographic masks, in particular structures on microlithographic masks. In the case of the device (1), a region of a photolithographic mask (20) arranged on an object stage (30) is in each case captured with a time offset by a plurality of image capturing sensors (42) of an image capturing unit (40) during a scanning operation, wherein an adjustment to the distance between the photolithographic mask (20) and the image capturing unit (40) during the scanning operation ensures that the captured images of the same region on the photolithographic mask (20) are focused differently. The variables that are characteristic for the defocus arising from the images are then used to ascertain whether a refocusing of the device (1) is necessary, in particular whether the distance between the image capturing unit (40) and the object stage (30) must be adapted beyond the variation required for the capture of differently focused images.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:裝置</p>  
        <p type="p">10:照明裝置</p>  
        <p type="p">20:微影光罩；反射式微影光罩</p>  
        <p type="p">30:物體載台；物體</p>  
        <p type="p">31:箭頭；掃描方向；方向</p>  
        <p type="p">32:雙向箭頭；方向</p>  
        <p type="p">40:影像擷取單元</p>  
        <p type="p">41:光學單元</p>  
        <p type="p">42:影像擷取感測器；影像擷取單元；影像感測器</p>  
        <p type="p">43:列</p>  
        <p type="p">46:距離感測器</p>  
        <p type="p">47:影像平面</p>  
        <p type="p">47':平面</p>  
        <p type="p">50:控制裝置</p>  
        <p type="p">51:介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2290" publication-number="202627658"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627658.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微影光罩檢測方法、電腦程式產品、微影光罩檢測系統、微影光罩修復方法以及微影方法</chinese-title>  
        <english-title>METHOD FOR INSPECTING MICROLITHOGRAPHIC PHOTOMASKS, COMPUTER PROGRAM PRODUCT, SYSTEM FOR INSPECTING A MICROLITHOGRAPHIC PHOTOMASK, METHOD FOR REPAIRING A MICROLITHOGRAPHIC PHOTOMASK AND METHOD OF MICROLITHOGRAPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260326B">G03F1/22</main-classification>  
        <further-classification edition="201201120260326B">G03F1/72</further-classification>  
        <further-classification edition="200601120260326B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔博恩　吉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABBONE, GILLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗洛里區　伯庸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FROEHLICH, BJOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法泰格　亞歷安卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREYTAG, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博哈爾　伯庸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAUER, BJOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　春長</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, XUAN TRUONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種微影光罩（17）檢測方法，其中借助包含照明透鏡（16）和投影透鏡（22）的光罩檢測裝置，透過該照明透鏡（16）照射的光罩（17）影像由該投影透鏡（22）投影到排列在該投影透鏡（22）像平面內的相機（23）之影像感測器（24）上。該光罩（17）放置在定位系統（26）上，該定位系統設計用於移動該光罩（17）。運用該定位系統（26）移動該光罩（17），使得影像感測器（24）捕捉對應於該光罩（17）上第一區域的第一影像線（101）。運用該定位系統（26）移動該光罩（17），使得影像感測器（24）捕捉對應於該光罩（17）上第二區域的第二影像線（102）。該第一區域和該第二區域之間存在重疊區域（200），使得該第一和該第二影像線（101、102）包含關於排列在該重疊區域（200）內該光罩（17）結構的一則影像資訊。對該第一影像線（101）中的該則影像資訊套用缺陷偵測方法，以便確定第一則缺陷資訊。對該第二影像線（102）中的該則影像資訊套用缺陷偵測方法，以便確定第二則缺陷資訊。比較該第一則缺陷資訊和該第二則缺陷資訊，以便確定關於排列在該重疊區域（200）內該光罩（17）結構正確性的一則資訊。本發明另關於一種微影光罩檢測系統、一種電腦程式產品、一種微影光罩修復方法以及一種微影方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for inspecting a microlithographic photomask (17), wherein with the aid of a mask inspection device comprising an illumination lens (16) and a projection lens (22), the image of a photomask (17) illuminated by means of the illumination lens (16) is projected by the projection lens (22) onto an image sensor (24) of a camera (23) arranged in the image plane of the projection lens (22). The photomask (17) is placed on a positioning system (26) that is designed to displace the photomask (17). The photomask (17) is displaced using the positioning system (26) such that the image sensor (24) captures a first image line (101) that corresponds to a first region on the photomask (17). The photomask (17) is displaced using the positioning system (26) such that the image sensor (24) captures a second image line (102) that corresponds to a second region on the photomask (17). There is an overlap (200) between the first region and the second region such that the first and the second image line (101, 102) comprise a piece of image information regarding a structure of the photomask (17) arranged within the overlap (200). A defect detection method is applied to the piece of image information in the first image line (101) in order to determine a first piece of defect information. A defect detection method is applied to the piece of image information in the second image line (102) in order to determine a second piece of defect information. The first piece of defect information is compared with the second piece of defect information in order to determine a piece of information regarding the correctness of the structure of the photomask (17) arranged within the overlap (200). The invention also relates to a system for inspecting a microlithographic photomask, a computer program product, a method for repairing a microlithographic photomask and a method of microlithography.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:EUV輻射源</p>  
        <p type="p">15:EUV光束路徑</p>  
        <p type="p">16:照明透鏡</p>  
        <p type="p">17:微影光罩；光罩</p>  
        <p type="p">22:投影透鏡</p>  
        <p type="p">23:EUV相機</p>  
        <p type="p">24:影像感測器</p>  
        <p type="p">26:定位系統</p>  
        <p type="p">40:真空外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2291" publication-number="202625992"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625992.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸收性物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">A61F13/15</main-classification>  
        <further-classification edition="200601120260320B">A61F13/496</further-classification>  
        <further-classification edition="200601120260320B">A61F13/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商優你　嬌美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNICHARM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, TAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大窪哲郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUBO, TETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡亮輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠兼顧提高貼合性、抑制滑落、以及抑制穿著者的肌膚問題的吸收性物品。吸收性物品(1)具備有：腹側部(3)、背側部(2)、以及含有吸收體(8)的吸收性本體(4)。腹側部(3)及背側部(2)被互相接合而構成腰圍部。吸收性本體(4)，是前側及後側的端部，分別延伸到腹側部(3)及背側部(2)中的寬方向的中央的部分。腰圍部包含在寬方向上伸縮的彈性構件(12、13)。腰圍部的寬方向的返回應力為0.010N/mm~0.030N/mm以下。在腰圍部的肌膚抵接面上塗布有偏移防止劑(SC)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:背側部</p>  
        <p type="p">2a:背側接合部</p>  
        <p type="p">2EA:存在區域</p>  
        <p type="p">2S:肌膚抵接面</p>  
        <p type="p">3:腹側部</p>  
        <p type="p">3a:腹側接合部</p>  
        <p type="p">3EA:存在區域</p>  
        <p type="p">3S:肌膚抵接面</p>  
        <p type="p">4:吸收性本體</p>  
        <p type="p">CL:長方向中心線</p>  
        <p type="p">SC:偏移防止劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2292" publication-number="202628210"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628210.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於控制燃料電池的Ｈ２濃度的方法</chinese-title>  
        <english-title>METHOD FOR CONTROLLING AN H2 CONCENTRATION OF A FUEL CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260316B">H01M8/04537</main-classification>  
        <further-classification edition="201601120260316B">H01M8/04791</further-classification>  
        <further-classification edition="201601120260316B">H01M8/04992</further-classification>  
        <further-classification edition="201601120260316B">H01M8/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊樂　哈特維希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEHLE, HARTWIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊茵沙根　霍爾格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REINSHAGEN, HOLGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞倫斯　麗莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LORENZ, LISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了提供一種以最佳化方式限定燃料電池的燃料濃度的方法，提出了一種用於控制燃料電池(100)的操作的方法，該方法包括以下步驟： &lt;br/&gt;- 記錄(B1)該燃料電池的一操作參數的至少一個量測值，或建立(B2)該操作參數的時間曲線的一模型， &lt;br/&gt;- 根據該記錄的量測值(C1)或該操作參數的該模型(C2)，確定該燃料電池的燃料氣體的一H&lt;sub&gt;2&lt;/sub&gt;濃度的一目標值，以及 &lt;br/&gt;- 以該H&lt;sub&gt;2&lt;/sub&gt;濃度的該確定的目標值來供應(D1, D2)燃料氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In order to provide a method for defining a fuel concentration of a fuel cell in an optimized manner, a method for controlling the operation of a fuel cell (100) is proposed, comprising the following steps: &lt;br/&gt;- recording (B1) at least one measured value of an operating parameter of the fuel cell, or creating (B2) a model for the temporal profile of the operating parameter, &lt;br/&gt;- ascertaining a target value for an H&lt;sub&gt;2&lt;/sub&gt; concentration for the fuel gas of the fuel cell on the basis of the recorded measured value (C1) or the model of the operating parameter (C2), and &lt;br/&gt;- supplying (D1, D2) fuel gas with the ascertained target value of the H&lt;sub&gt;2&lt;/sub&gt; concentration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">B:下降</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2293" publication-number="202628880"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628880.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器開閉裝置、及基板搬送裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P72/00</main-classification>  
        <further-classification edition="200601120260324B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商昕芙旎雅股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINFONIA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原裕揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, TATSURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納寛人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANO, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGISO, SHINPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是容易地修正被刻意傾斜之基板的傾斜角度。 &lt;br/&gt;　　晶圓盒開閉裝置(4)具備載置部(24)與角度修正部(30)。具有支持晶圓(W)之底板(101)的晶圓盒(100)被載置於載置部(24)上。角度修正部(30)使底板(101)搖動，修正被底板(101)支持之晶圓(W)的傾斜角度。如此，藉由角度修正部(30)搖動底板(101)，能夠容易地修正被刻意傾斜之晶圓(W)的傾斜角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:晶圓盒開閉裝置(容器開閉裝置)</p>  
        <p type="p">10:外部空間</p>  
        <p type="p">23:升降盒</p>  
        <p type="p">24:載置部</p>  
        <p type="p">29:支持構件</p>  
        <p type="p">30:角度修正部</p>  
        <p type="p">31:本體</p>  
        <p type="p">32:桿</p>  
        <p type="p">33:推壓部</p>  
        <p type="p">100:晶圓盒(容器)</p>  
        <p type="p">101:底板(基板支持部)</p>  
        <p type="p">102:罩蓋</p>  
        <p type="p">C:晶匣</p>  
        <p type="p">C2:晶匣</p>  
        <p type="p">W:晶圓(基板)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2294" publication-number="202629000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合基板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10W70/01</main-classification>  
        <further-classification edition="201401120260325B">B23K26/352</further-classification>  
        <further-classification edition="200601120260325B">H03H3/08</further-classification>  
        <further-classification edition="200601120260325B">H03H9/25</further-classification>  
        <further-classification edition="200601120260325B">H03H9/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本岳士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長屋昇吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種複合基板的製造方法，可以形成既定值以上的厚度的改質層且可以抑制活性層的剝離。本發明實施形態相關的複合基板的製造方法包括：在具有結晶性的支撐基板的至少一面形成活性層；以及藉由從活性層側對支撐基板的表面照射脈衝雷射，在支撐基板表面側形成改質層；其中包含照射脈衝雷射而使改質層的厚度成為10nm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐基板</p>  
        <p type="p">20:活性層</p>  
        <p type="p">21:氧化膜層</p>  
        <p type="p">30:改質層</p>  
        <p type="p">100:複合基板</p>  
        <p type="p">301:改質部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2295" publication-number="202628792"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628792.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P10/00</main-classification>  
        <further-classification edition="202601120260401B">H10P95/00</further-classification>  
        <further-classification edition="202601120260401B">H10W70/01</further-classification>  
        <further-classification edition="202301120260401B">H10N30/87</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本岳士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長屋昇吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可具有優異電性的複合基板。根據本發明實施形態的複合基板，依序具備：具有結晶性的支撐基板、前述支撐基板的結晶性改質後的改質層與活性層。支撐基板中的氧濃度不到1.0×10&lt;sup&gt;18&lt;/sup&gt;原子/cm&lt;sup&gt;3&lt;/sup&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐基板</p>  
        <p type="p">20:活性層</p>  
        <p type="p">30:改質層</p>  
        <p type="p">100:複合基板</p>  
        <p type="p">301:改質部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2296" publication-number="202628830"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628830.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置製造中之氧化錫膜</chinese-title>  
        <english-title>TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P50/20</main-classification>  
        <further-classification edition="202501120260316B">H10D84/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游　正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JENGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　暹華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SAMANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　惠榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HUI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威茲　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISE, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莎瑪　納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAMMA, NADER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛洛斯基　博里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLOSSKIY, BORIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">錫氧化物膜係用作半導體元件製造中的間隔件及硬遮罩。在一方法中，錫氧化物層係保形地形成於基板上之凸起特徵部的側壁及水平表面上方。然後，鈍化層係形成於側壁上之錫氧化物上方，以及然後從凸起特徵部的水平表面移除錫氧化物，而不移除凸起特徵部之側壁處的錫氧化物。然後，移除凸起特徵部的材料，同時留下位於凸起特徵部之側壁處的錫氧化物，從而形成錫氧化物間隔件。基於氫及基於氯的乾式蝕刻化學成分係用以於存在諸多材料的情況下，選擇性地蝕刻錫氧化物。在另一方法中，圖案化錫氧化物硬遮罩層係藉由在未經圖案化之錫氧化物上方形成圖案化層、並且將圖案轉移至錫氧化物而形成於基板上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Tin oxide films are used as spacers and hardmasks in semiconductor device manufacturing. In one method, tin oxide layer is formed conformally over sidewalls and horizontal surfaces of protruding features on a substrate. A passivation layer is then formed over tin oxide on the sidewalls, and tin oxide is then removed from the horizontal surfaces of the protruding features without being removed at the sidewalls of the protruding features. The material of the protruding features is then removed while leaving the tin oxide that resided at the sidewalls of the protruding features, thereby forming tin oxide spacers. Hydrogen-based and chlorine-based dry etch chemistries are used to selectively etch tin oxide in a presence of a variety of materials. In another method a patterned tin oxide hardmask layer is formed on a substrate by forming a patterned layer over an unpatterned tin oxide and transferring the pattern to the tin oxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4401:步驟</p>  
        <p type="p">4403:步驟</p>  
        <p type="p">4405:步驟</p>  
        <p type="p">4407:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2297" publication-number="202628596"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628596.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用雙電晶體－雙電阻結構的交叉開關電路</chinese-title>  
        <english-title>CROSSBAR CIRCUITS INCORPORATING 2-TRANSISTOR-2-RESISTOR CONFIGURATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">H10B63/00</main-classification>  
        <further-classification edition="200601120260401B">G11C13/00</further-classification>  
        <further-classification edition="202501120260401B">H10D84/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商特憶智能科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TETRAMEM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　民憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MINXIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛　寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置包括多個位線、多個字線、多個源極線和連接至所述位線、所述字線和所述源極線的多個交叉點器件。所述多個交叉點器件中的第一交叉點器件連接至所述多個位線中的第一位線和第二位線、所述多個字線中的第一字線和所述多個源極線中的第一源極線。所述第一交叉點器件可包括第一RRAM器件、連接至第一RRAM器件的NMOS電晶體、連接至NMOS電晶體的PMOS電晶體和連接至PMOS電晶體的第二RRAM器件。NMOS電晶體和PMOS電晶體均連接至第一源極線，並以並排結構或堆疊結構設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">211a,211b,211c,...,211n-2,211n-1,211n:字線</p>  
        <p type="p">213a,213b,...,213n-1,213n:位線</p>  
        <p type="p">215a,...,215m:源極線</p>  
        <p type="p">231a,...,231n:列開關</p>  
        <p type="p">233a,...,233n:行開關</p>  
        <p type="p">235a,...,235m:開關</p>  
        <p type="p">200:基於交叉開關的裝置</p>  
        <p type="p">220a,...,220z:交叉點器件</p>  
        <p type="p">221:第一RRAM器件</p>  
        <p type="p">223:NMOS電晶體</p>  
        <p type="p">225:PMOS電晶體</p>  
        <p type="p">227:第二RRAM器件</p>  
        <p type="p">240:輸出感測器</p>  
        <p type="p">241a-241m:讀出電路</p>  
        <p type="p">243a-243m:類比至數位轉換器</p>  
        <p type="p">2201:第一RRAM器件子陣列</p>  
        <p type="p">2203:第二RRAM器件子陣列</p>  
        <p type="p">260:編程電路</p>  
        <p type="p">207:字線邏輯電路</p>  
        <p type="p">205:位線邏輯電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2298" publication-number="202627548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141743</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光板及光硬化性接著劑</chinese-title>  
        <english-title>POLARIZING PLATE AND PHOTOCURABLE ADHESIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">G02B5/30</main-classification>  
        <further-classification edition="200601120260323B">C09J4/00</further-classification>  
        <further-classification edition="200601120260323B">B32B27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＤＥＫＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEKA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片波嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PYEON, BORAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井口麻里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGUCHI, MARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本間英里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONMA, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松土和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDO, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板野和幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITANO, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在高濕環境下偏光膜也不易變色之偏光板。 &lt;br/&gt;本發明之偏光板(1)係依序積層第一(甲基)丙烯酸系樹脂膜(21)、第一接著劑層(31)、聚乙烯醇系偏光膜(10)、第二接著劑層(32)及第二(甲基)丙烯酸系樹脂膜(22)，第一接著劑層(31)及第二接著劑層(32)為光硬化性接著劑的硬化物，含有光陽離子硬化性成分(A)、及相對於光陽離子硬化性成分(A)100重量份為1~10重量份之光陽離子聚合起始劑(B)，光陽離子硬化性成分(A)100重量份含有脂環式環氧化合物(A-1)20~50重量份、脂肪族二環氧丙基化合物(A-2)20~55重量份、包含源自於具有環氧基等取代基之單體的構成單元之聚合物(A-3)5~15重量份、及氧雜環丁烷化合物(A-4)5~25重量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a polarizing plate that does not easily discolor even under high humidity conditions. &lt;br/&gt;The polarizing plate (1) of this invention is formed by sequentially laminating a first (meth)acrylic resin film (21), a first adhesive layer (31), a polyvinyl alcohol polarizing film (10), a second adhesive layer (32), and a second (meth)acrylic resin film (22); the first adhesive layer (31) and the second adhesive layer (32) are a cured product of a photocurable adhesive and contain a photocationic curable component (A) and a photocationic polymerization initiator (B) in amounts of 1 to 10 parts by weight relative to 100 parts by weight of the photocationic curable component (A), wherein 100 parts by weight of the cationic photocurable component (A) contains 20 to 50 parts by weight of an alicyclic epoxy compound (A-1), 20 to 55 parts by weight of an aliphatic diglycidyl compound (A-2), 5 to 15 parts by weight of a polymer (A-3) containing a structural unit derived from a monomer having a substituent such as an epoxy group, and 5 to 25 parts by weight of an oxetane compound (A-4).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:偏光板</p>  
        <p type="p">10:聚乙烯醇系偏光膜</p>  
        <p type="p">21:第一(甲基)丙烯酸系樹脂膜</p>  
        <p type="p">22:第二(甲基)丙烯酸系樹脂膜</p>  
        <p type="p">31:第一接著劑層</p>  
        <p type="p">32:第二接著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2299" publication-number="202628221"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628221.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組件及包括電池組件的電池組</chinese-title>  
        <english-title>BATTERY ASSEMBLY AND BATTERY PACK INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260309B">H01M10/613</main-classification>  
        <further-classification edition="201401120260309B">H01M10/656</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金仁侐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, INHYEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭敏溶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, MINYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹柾勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, JUNGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭在軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAEHEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露實施例的電池組件包括：多個電池芯；以及電池芯框架，電池芯儲存在電池芯框架中。電池芯框架包括底部電池芯框架，電池芯安置在底部電池芯框架上，以及覆蓋電池芯框架，位於底部電池芯框架上。冷卻流體在電池芯框架內部循環，同時與電池芯直接接觸。底部電池芯框架包括晶舟，形成在底部電池芯框架之中電池芯安置的區域的外周緣上，以及第一密封構件位於晶舟中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery assembly according to an embodiment of the present disclosure comprises: a plurality of battery cells; and a cell frame in which the battery cells are stored. The cell frame comprises a bottom cell frame on which the battery cells are seated, and a cover cell frame located on the bottom cell frame. A cooling fluid circulates inside the cell frame while being in direct contact with the battery cells. The bottom cell frame comprises a basket formed on an outer circumference of a region where the battery cells are seated among ​​the bottom cell frame, and a first sealing member is located in the basket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池組件</p>  
        <p type="p">120:電池芯框架</p>  
        <p type="p">120ab:覆蓋電池芯框架</p>  
        <p type="p">120a:頂部電池芯框架</p>  
        <p type="p">120b:中間電池芯框架</p>  
        <p type="p">120c:底部電池芯框架</p>  
        <p type="p">121:入口埠</p>  
        <p type="p">122:出口埠</p>  
        <p type="p">500:防水膠</p>  
        <p type="p">500a:第一防水膠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2300" publication-number="202628907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對準器</chinese-title>  
        <english-title>ALIGNER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P72/50</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村瀬大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURASE, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹羽創生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIWA, SOSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">對準器（5）包括主軸（51）、殼體（52）以及升降器（6），主軸（51）使所支承的基板（9）旋轉，殼體（52）呈上下方向的高度比水平方向的長度短的扁平的形狀，升降器（6）將直接或間接地支承於主軸的基板抬起，從而支承基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aligner according to the present invention includes a spindle (51) that rotates a substrate (9) supported thereon, a flat housing (52) whose vertical height is smaller than its horizontal length, and a lifter (6) that lifts and supports the substrate supported directly or indirectly on the spindle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:對準器</p>  
        <p type="p">6:升降器</p>  
        <p type="p">51:主軸</p>  
        <p type="p">52:殼體</p>  
        <p type="p">53:臂部</p>  
        <p type="p">59:機殼</p>  
        <p type="p">61:升降件</p>  
        <p type="p">62:升降件</p>  
        <p type="p">63:升降件</p>  
        <p type="p">66:連結板</p>  
        <p type="p">510:感測器</p>  
        <p type="p">521:主體</p>  
        <p type="p">522:頂板</p>  
        <p type="p">523:台階</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2301" publication-number="202628782"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628782.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電振動裝置</chinese-title>  
        <english-title>PIEZOELECTRIC VIBRATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260328B">H10N30/88</main-classification>  
        <further-classification edition="202601120260328B">H10W76/12</further-classification>  
        <further-classification edition="202301120260328B">H10N30/071</further-classification>  
        <further-classification edition="202301120260328B">H10N30/87</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大真空股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAISHINKU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森裕章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMORI, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大西学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHNISHI, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中智也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的為確保搭載著壓電振動元件之基板與封裝件之充分的接合區域，且抑制壓電振動元件之自由端因為外部撞擊所導致之位移。於基板2之外底面2a，沿著基板2之矩形之一方側(圖3之右方)的短邊以並列配置的方式形成壓電振動元件用連接端子21、23。1個壓電振動元件用連接端子21係形成為其長度為較基板2之長邊方向的長度稍短，另一個壓電振動元件用連接端子23係形成為其長度為稍超過表示基板2之長邊之中央之線L。藉此，在將基板2之壓電振動元件用連接端子21、23分別接合於封裝件之壓電振動元件搭載墊時，作為在封裝件之段部中被以懸臂方式支持之基板2的左端部與封裝件之接合區域而言，確保了充分的接合面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An objective of the present invention is to secure a sufficient bonding area between a substrate on which a piezoelectric vibration element is mounted and a package, thereby enabling suppression of displacement of a free end of the piezoelectric vibration element due to external impact. On an outer bottom surface 2a of a substrate 2, piezoelectric vibration element connection terminals 21 and 23 are formed in parallel along a short side of one side of rectangular shape of the substrate 2 (right side in FIG. 3). One piezoelectric vibration element connection terminal 21 is formed to a length slightly shorter than the length of a long side of the substrate 2, and the other piezoelectric vibration element connection terminal 23 is formed to a length slightly longer than a line L representing the center of the long side of the substrate 2. Accordingly, when the piezoelectric vibration element connection terminals 21 and 23 of the substrate 2 are respectively bonded to piezoelectric vibration element mounting pads of the package, a sufficient bonding area can be secured as a bonding region between the package and a left end portion of the substrate 2 that is cantilever-supported at a step portion of the package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:基板</p>  
        <p type="p">2a:外底面</p>  
        <p type="p">21,23:壓電振動元件用連接端子</p>  
        <p type="p">22:接地連接端子</p>  
        <p type="p">L:直線(線)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2302" publication-number="202626428"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626428.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人力驅動車之電子控制器</chinese-title>  
        <english-title>AN ELECTRIC CONTROLLER FOR A HUMAN POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251231B">B62M6/45</main-classification>  
        <further-classification edition="200601120251231B">B62M25/08</further-classification>  
        <further-classification edition="201001120251231B">B62M6/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝花聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHANA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島岳彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, TAKEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於人力驅動車之電子控制器。該電子控制器包括一記憶體，其設置成儲存用於該人力驅動車的變速裝置自動變速操作之變速條件；以及一處理器，其能通訊地耦接至該記憶體。該處理器設置成基於該變速條件和該人力驅動車的行駛狀態的參數，來執行該自動變速操作。該處理器設置成接收關於該人力驅動車的傾斜角之資訊。該處理器設置成在該變速裝置處於多個檔位中第一檔位之狀態下，使該記憶體基於該傾斜角以第一量更新該變速條件的參數。該第一檔位具有第一齒輪比。該處理器設置成在該變速裝置處於該等多個檔位中第二檔位之狀態下，使該記憶體基於該傾斜角以第二量更新該變速條件的該參數。該第二檔位具有大於該第一齒輪比的第二齒輪比。該第二量大於該第一量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic controller for a human-powered vehicle is provided. The electric controller comprises a memory configured to store a transmission condition used for an automatic gear shift operation of a transmission device of the human powered vehicle and a processor communicatably coupled to the memory. The processor is configured to perform the automatic gear shift operation based on the transmission condition and a parameter of a moving state of the human powered vehicle. The processor is configured to receive information relating to an inclination angle of the human powered vehicle. The processor is configured to cause the memory to update a parameter of the transmission condition by a first amount based on the inclination angle in a state where the transmission device is in a first gear position among a plurality of gear positions. The first gear position has a first gear ratio. The processor is configured to cause the memory to update the parameter of the transmission condition by a second amount based on the inclination angle in a state where the transmission device is in a second gear position among the plurality of gear positions. The second gear position has a second gear ratio which is larger than the first gear ratio. The second amount is larger than the first amount.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2303" publication-number="202628474"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628474.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法、裝置及儲存介質</chinese-title>  
        <english-title>COMMUNICATION METHOD, APPARATUS, AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260401B">H04W88/12</main-classification>  
        <further-classification edition="200901120260401B">H04W48/20</further-classification>  
        <further-classification edition="202101120260401B">H04W12/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫豔賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YANBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳云曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種通信方法、裝置及儲存介質，屬於通信領域。方法應用於通信系統的主接入點，方法包括：確定通信系統中的主接入點和從接入點均支持的目標加密模式；向從接入點發送目標加密模式，目標加密模式用於從接入點進行漫遊配置。本申請能夠提高漫遊性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a communication method, an apparatus, and a storage medium, and pertains to the field of communications. The method is applied to a main access point in a communications system, and includes: determining a target encryption mode supported by both the main access point and a slave access point in the communications system; and sending the target encryption mode to the slave access point, where the target encryption mode is used for roaming configuration by the slave access point. This application can improve roaming performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:通信系統</p>  
        <p type="p">101:主接入點</p>  
        <p type="p">102:從接入點</p>  
        <p type="p">104:分光器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2304" publication-number="202628475"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628475.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接入點節能的方法、裝置、接入點和系統</chinese-title>  
        <english-title>METHOD, APPARATUS, ACCESS POINT, AND SYSTEM FOR POWER SAVING OF ACCESS POINT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260401B">H04W88/12</main-classification>  
        <further-classification edition="200901120260401B">H04W52/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖后飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, HOUFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種接入點節能的方法、裝置、設備和系統，屬於通信技術領域。在FTTR中，第一接入點指示第二接入點進行節能，並且獲取第二接入點的業務狀態信息，根據該業務狀態信息更新第二接入點的節能操作，使得在節能時，減少對業務的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method, an apparatus, an access point, and a system for power saving of access points, and pertains to the field of communications technologies. The method is applied to a first access point in an FTTR network, where the first access point is connected to at least one other access point in the FTTR network. The first access point receives power saving statistics information sent by at least one access point, where the power saving statistics information includes station information and/or service information. The first access point makes an power saving decision for the other access points based on the power saving statistics information. By using this application, power consumption of the access points can be reduced.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2305" publication-number="202628454"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628454.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接入點狀態反饋的方法、裝置、接入點和系統</chinese-title>  
        <english-title>METHOD, APPARATUS, ACCESS POINT, AND SYSTEM FOR FEEDBACK OF ACCESS POINT STATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260401B">H04W52/02</main-classification>  
        <further-classification edition="200901120260401B">H04W88/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖后飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, HOUFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹劍超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, JIANCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種接入點狀態回饋的方法、裝置、接入點和系統，屬於通信技術領域。該方法應用於FTTR網路中的第一接入點，第一接入點與FTTR網路中的至少一個其他接入點連接。第一接入點可以接收至少一個其他接入點中第二接入點發送的第一狀態，其中，第一狀態為工作狀態、節能狀態或者節能準備狀態，能夠指示從接入點的節能情況。這樣，第一接入點能夠瞭解第二接入點的節能情況，進而可以更好地對第二接入點進行節能控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a method and an apparatus for feeding back an access point status, an access point, and a system, which belong to the field of communications technologies. The method is applied to a first access point in an FTTR network, where the first access point is connected to at least one other access point in the FTTR network. The first access point may receive a first status sent by a second access point among the at least one other access point, where the first status is a working state, an energy-saving state, or an energy-saving preparation state, and can indicate the energy-saving condition of the second access point. In this way, the first access point can understand the energy-saving condition of the second access point, and thus can better perform energy-saving control on the second access point.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2306" publication-number="202626586"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626586.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C69/593</main-classification>  
        <further-classification edition="200601120260401B">C07C69/75</further-classification>  
        <further-classification edition="200601120260401B">C07C69/80</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋田源太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDA, GENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大友雄太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOMO, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供感度良好且邊緣粗糙度、尺寸偏差小、解像性優良，而且保存安定性也良好之具有光感應性高之陽離子之感光性鎓鹽之阻劑組成物、及圖案形成方法。一種阻劑組成物，其特徵為含有：因酸作用而鹼可溶性增大之樹脂(A)、及下列通式(1)表示之羧酸(D)，且更含有光酸產生劑(B)及/或光崩壞性鹼(C)。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="265px" width="439px" file="ed10253.JPG" alt="ed10253.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1～30之有機基，R&lt;sup&gt;2&lt;/sup&gt;為碳數1～8之也可含有氟原子之有機基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a resist composition containing a resin (A) whose alkali solubility is increased by an action of an acid and a carboxylic acid (D) represented by the following general formula (1), and further containing a photo-acid generator (B) and/or a photo-degradable base (C), where R&lt;sup&gt;1&lt;/sup&gt; represents an organic group having 1 to 30 carbon atoms; and R&lt;sup&gt;2&lt;/sup&gt; represents an organic group having 1 to 8 carbon atoms and optionally containing a fluorine atom. This can provide: a resist composition containing a photosensitive onium salt having a highly photosensitive cation, the resist composition having favorable sensitivity, low edge roughness, low size variation, excellent resolution, and furthermore, favorable storage stability; and a patterning process. &lt;br/&gt;&lt;img align="absmiddle" height="223px" width="385px" file="ed10254.JPG" alt="ed10254.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2307" publication-number="202628555"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628555.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件傳輸裝置</chinese-title>  
        <english-title>COMPONENT CONVEYING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">H05K13/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商ＭＢ自動化有限兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MB AUTOMATION GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼布勒　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIEBLER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布赫　魯道夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUCHER, RUDOLF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊秀鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文件描述一種元件傳輸裝置以及用於在該元件傳輸裝置中拾取一元件、置放一元件及檢測元件之方法。該元件傳輸裝置包括至少一第一及一第二傳輸單元、一控制單元及一元件檢測單元，其中該元件檢測單元係在一傳輸方向上配置於該第一傳輸單元與該第二傳輸單元之間。該第一傳輸單元包括可至少沿著及逆著一傳輸方向移動之至少一第一元件拾取器。該元件檢測單元包括可繞一第一旋轉軸線旋轉之至少一個第一板，及配置於該第一板徑向外側且可繞一第二旋轉軸線旋轉之至少一個第二元件拾取器。該第二傳輸單元包括可至少沿著及逆著一拾取方向及一傳輸方向移動之至少一個第三元件拾取器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This document describes a component conveying device and a method for picking up a component, depositing a component, and inspecting components in the component conveying device. The component conveying device comprises at least a first and a second conveyor unit, a control unit, and a component inspection unit, wherein the component inspection unit is arranged between the first conveyor unit and the second conveyor unit in a conveying direction. The first conveyor unit comprises at least a first component pick-up that is movable at least along and against a conveying direction. The component inspection unit comprises at least one first plate rotatable about a first axis of rotation and at least one second component pick-up arranged radially outside the first plate and rotatable about a second axis of rotation. The second conveyor unit comprises at least one third component pick-up which is movable at least along and against a pick-up direction and a conveying direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:元件傳輸裝置/元件傳輸機</p>  
        <p type="p">200:第一傳輸單元</p>  
        <p type="p">210:底板</p>  
        <p type="p">220:元件拾取器/元件安裝件</p>  
        <p type="p">300:元件檢測單元</p>  
        <p type="p">301:第一旋轉軸線</p>  
        <p type="p">302:第二旋轉軸線</p>  
        <p type="p">310:第一板</p>  
        <p type="p">320:元件拾取器</p>  
        <p type="p">400:第二傳輸單元</p>  
        <p type="p">410:底板</p>  
        <p type="p">420:元件拾取器/元件安裝件</p>  
        <p type="p">ECU:控制單元</p>  
        <p type="p">A:拾取方向</p>  
        <p type="p">B:元件</p>  
        <p type="p">F:傳輸方向</p>  
        <p type="p">K1:第一成像感測器</p>  
        <p type="p">K2:第二成像感測器</p>  
        <p type="p">K3:第三成像感測器/第一成像感測器</p>  
        <p type="p">K4:第四成像感測器/第一成像感測器</p>  
        <p type="p">K5:第五成像感測器</p>  
        <p type="p">K6:第六成像感測器</p>  
        <p type="p">P:置物板</p>  
        <p type="p">S5:第一前表面</p>  
        <p type="p">S6:第二前表面</p>  
        <p type="p">U:經結構化元件堆疊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2308" publication-number="202628160"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628160.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶電粒子光學元件</chinese-title>  
        <english-title>CHARGED PARTICLE-OPTICAL ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01J37/147</main-classification>  
        <further-classification edition="200601120260327B">H01J37/09</further-classification>  
        <further-classification edition="201801120260327B">G01N23/2251</further-classification>  
        <further-classification edition="202601120260327B">H10P74/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克雷辛尼克　法魯克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRECINIC, FARUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威蘭德　瑪寇　傑　加寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIELAND, MARCO JAN-JACO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬格努斯　艾爾伯圖斯　維克　傑拉杜斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGNUS, ALBERTUS VICTOR GERARDUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒夫　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOW, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇尼　約漢　胡斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONING, JOHAN JOOST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖恩　維貝　佛羅瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOONEN, WIEBE FLORIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種經組態以對一射束柵格中之複數個帶電粒子射束進行操作之帶電粒子光學元件，該帶電粒子光學元件包含一第一表面及一第二表面，其中該第一表面及該第二表面中之各者：具有界定於其中以允許該等射束穿過之複數個孔徑；相對於垂直於該射束柵格之一軸線的一平面成角度；且在一電位差下面向該帶電粒子光學元件之另一表面，使得該帶電粒子光學元件經組態以藉由控制該電位差而將一偏轉施加至該等射束。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charged particle-optical element configured to operate on a plurality of charged particle beams in a beam grid, the charged particle-optical element comprises: a first surface and a second surface, wherein each of the first surface and the second surface: has a plurality of apertures defined in it for allowing the beams to pass through, is angled relative to a plane perpendicular to an axis of the beam grid; and faces another surface of the charged particle-optical element at a potential difference, such that the charged particle-optical element is configured to apply a deflection to the beams by controlling the potential difference.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:電子光學設備/多射束電子光學設備/單射束電子光學設備</p>  
        <p type="p">201:源</p>  
        <p type="p">202:源射束</p>  
        <p type="p">207:樣本固持器</p>  
        <p type="p">208:樣本</p>  
        <p type="p">209:可致動載物台/載物台</p>  
        <p type="p">211:初級射束</p>  
        <p type="p">212:初級射束</p>  
        <p type="p">213:初級射束</p>  
        <p type="p">230:電子光學裝置</p>  
        <p type="p">231:聚光透鏡陣列</p>  
        <p type="p">240:偵測器陣列</p>  
        <p type="p">241:物鏡陣列</p>  
        <p type="p">250:控制透鏡陣列</p>  
        <p type="p">252:射束限制孔徑陣列/上部射束限制器</p>  
        <p type="p">260:掃描偏轉器陣列</p>  
        <p type="p">271:準直器陣列</p>  
        <p type="p">273:中間聚焦平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2309" publication-number="202626982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴墨印墨組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260323B">C09D11/30</main-classification>  
        <further-classification edition="201401120260323B">C09D11/38</further-classification>  
        <further-classification edition="200601120260323B">C09K11/06</further-classification>  
        <further-classification edition="202301120260323B">H10K50/15</further-classification>  
        <further-classification edition="202301120260323B">H10K50/16</further-classification>  
        <further-classification edition="202301120260323B">H10K50/80</further-classification>  
        <further-classification edition="202301120260323B">H10K85/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣田徹也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROTA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本圭佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種技術，其能在以噴墨印刷法形成光元件在陰極與陽極之間所具有的由金屬氧化物奈米粒子所構成之層時使伴隨其而來的缺陷不易產生。噴墨印墨組成物係包含：由從由電洞注入材料、電洞傳輸材料及電子傳輸材料組成之群組中選出的材料所構成之金屬氧化物奈米粒子；與包含二醇系溶劑及碳原子數在7至9的範圍內的非醇系溶劑之分散介質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2310" publication-number="202627065"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627065.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>皂複合粒子、皂複合粒子之製造方法、及化妝料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C11D9/10</main-classification>  
        <further-classification edition="200601120260323B">C11D9/20</further-classification>  
        <further-classification edition="200601120260323B">B01J2/00</further-classification>  
        <further-classification edition="200601120260323B">A61K8/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商巴川集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMOEGAWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池谷拓速</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEYA, HIROTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供皂複合粒子、皂複合粒子之製造方法、及化妝料，該皂複合粒子可改善皂粒子之皮脂吸附功能抑制脫妝，並可改善皮脂吸附功能之持續性。本發明之皂複合粒子，具有：含有飽和高級脂肪酸鹽之核心粒子、及於核心粒子外部添加之外部添加粒子；前述核心粒子之形狀為平均圓度0.80~1.00之球形；前述核心粒子中及/或前述外部添加粒子包含有皮脂吸附物質；前述皮脂吸附物質係選自於由膨土、蒙脫石、羥磷灰石所構成群組中之物質之粒子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2311" publication-number="202626213"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626213.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排流裝置、晶圓清洗設備及排流裝置的控制方法</chinese-title>  
        <english-title>DRAINAGE DEVICE, WAFER CLEANING EQUIPMENT, AND CONTROL METHOD FOR DRAINAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B08B11/00</main-classification>  
        <further-classification edition="200601120260302B">B08B13/00</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙宏宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, HONG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張亞斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YA BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高少飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, SHAO FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬宏帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, HONG SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, GUO QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>屠楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種排流裝置、晶圓清洗設備及排流裝置的控制方法。排流裝置包括：回收容器；第一流體管路，其一端用於與所述晶圓清洗設備的清洗腔室的排流口連通，另一端與所述回收容器的進流口連通；第二流體管路，其一端用於與所述清洗腔室的排流口連通，另一端用於與流體處理裝置連通；切換組件，用於選擇性地控制所述第一流體管路和所述第二流體管路的通斷；以及負壓裝置，與所述回收容器的出氣口連通，用於回應於所述切換組件控制所述第一流體管路斷開，抽取所述回收容器中的氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a drainage device, a wafer cleaning equipment, and a control method for the drainage device. The drainage device includes: a recovery container; a first fluid pipeline, one end of which is used to communicate with the drain outlet of the cleaning chamber of the wafer cleaning equipment, and the other end communicates with the inlet of the recovery container; a second fluid pipeline, one end of which is used to communicate with the drain outlet of the cleaning chamber, and the other end is used to communicate with a fluid processing device; a switching element, used to selectively control the opening and closing of the first fluid pipeline and the second fluid pipeline; and a negative pressure device, which communicates with the air outlet of the recovery container and is used to, in response to the switching component controlling the closing of the first fluid pipeline, extract gas from the recovery container.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓清洗設備</p>  
        <p type="p">10:清洗腔室</p>  
        <p type="p">11:清洗槽</p>  
        <p type="p">12:承載裝置</p>  
        <p type="p">13:遮蔽組件</p>  
        <p type="p">100:腔室主體</p>  
        <p type="p">101:密封蓋</p>  
        <p type="p">102:排流口</p>  
        <p type="p">103:出氣管路</p>  
        <p type="p">104:周向內壁</p>  
        <p type="p">105:進流口</p>  
        <p type="p">110:清洗槽排流閥</p>  
        <p type="p">111:清洗槽入口管段</p>  
        <p type="p">112:周向外壁</p>  
        <p type="p">20:流體供給裝置</p>  
        <p type="p">21:惰性氣體供給管路</p>  
        <p type="p">22:惰性氣體入口</p>  
        <p type="p">23:置換介質供給管路</p>  
        <p type="p">24:置換介質入口</p>  
        <p type="p">25:清洗藥液供給管路</p>  
        <p type="p">30:排流裝置</p>  
        <p type="p">301:負壓裝置</p>  
        <p type="p">302:進流口</p>  
        <p type="p">303:出氣口</p>  
        <p type="p">310:第一流體管路</p>  
        <p type="p">311:第一通斷閥</p>  
        <p type="p">320:第二流體管路</p>  
        <p type="p">321:第二通斷閥</p>  
        <p type="p">330:第三流體管路</p>  
        <p type="p">331:第三通斷閥</p>  
        <p type="p">340:第四流體管路</p>  
        <p type="p">341:第四通斷閥</p>  
        <p type="p">350:第五流體管路</p>  
        <p type="p">351:第五通斷閥</p>  
        <p type="p">360:排氣管路</p>  
        <p type="p">370:排液管路</p>  
        <p type="p">L1:第一管段</p>  
        <p type="p">S1:第一節點</p>  
        <p type="p">S2:第二節點</p>  
        <p type="p">S3:第三節點</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2312" publication-number="202627696"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627696.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擷取微影光罩上結構的影像的裝置</chinese-title>  
        <english-title>DEVICE FOR CAPTURING IMAGES OF STRUCTURES ON PHOTOLITHOGRAPHIC MASKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G03F7/207</main-classification>  
        <further-classification edition="201201120260330B">G03F1/82</further-classification>  
        <further-classification edition="202101120260330B">G02B7/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬泰卡　尤瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATEJKA, ULRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　卓爾　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DRIEL, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷克波姆　鹿茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREKERBOHM, LUTZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛葛斯基　歐拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROGALSKY, OLAF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多林　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOEHRING, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高勒斯　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOELLES, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊特根　慕尼黑　約翰內斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLEITGEN-MUENCH, JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種擷取微影光罩（20）上結構的影像的裝置（1），包含照明裝置（10）、影像擷取單元（40）以及控制裝置（50），照明裝置（10）利用照明輻射照射配置在物件平台（30）上的微影光罩（20），影像擷取單元（40）使用配置在影像擷取平面的至少一個影像擷取感測器（42）以執行藉由該微影光罩（20）轉換的照明輻射的掃描擷取，控制裝置（50）用於在一個掃描方向（31）控制該物件平台（30）與該影像擷取單元（40）之間的相對移動，其中該裝置（1）能藉由改變該影像擷取單元（40）與該物件平台（30）之間的距離來對焦，其中該影像擷取單元（40）包含光學單元（41），其用於將至少一個成像區域（91）與至少一個對焦區域（90）成像到該至少一個影像擷取感測器（42），其中該光學單元（41）設計成使得該至少一個成像區域（91）成像於其上的影像平面（47）與該至少一個對焦區域（90）成像於其上的影像平面（47'）彼此間隔開，且該控制裝置（50）設計成在每一種情況下確定對於成像至少一個成像區域（91）與至少一個對焦區域（90）的離焦特徵的一個變數，且若在該等確定的離焦特徵變數的基礎上確定一個非最佳距離，則在能從該等特徵變數推導出的一個方向調整該影像擷取單元（40）與該物件平台（30）之間的距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a device （1） for capturing images of structures on photolithographic masks （20）, comprising an illumination device （10） for illuminating a photolithographic mask （20） arranged on an object stage （30） with illumination radiation, an image capture unit （40） that uses at least one image capture sensor （42） arranged in an image capture plane to perform scanning capture of illumination radiation transformed by means of the photolithographic mask （20）, and a control device （50） for controlling a relative movement between the object stage （30） and the image capture unit （40） in a scanning direction （31）, wherein the device （20） can be focused by changing the distance between the image capture unit （40） and the object stage （30）, wherein the image capture unit （40） comprises an optical unit （41） for imaging at least one imaging region （91） and at least one focusing region （90） onto the at least one image capture sensor （42）, wherein the optical unit （41） is designed such that the image plane （47） onto which the at least one imaging region （91） is imaged is spaced apart from the image plane （47’） onto which the at least one focusing region （90） is imaged, and the control device （50） is designed to determine in each case a variable that is characteristic of the defocus for imaging at least one imaging region （91） and at least one focusing region （90） and, if a non-optimum distance is determined on the basis of the determined variables that are characteristic of the defocus, to adapt the distance between the image capture unit （40） and the object stage （30） in a direction that can be derived from the characteristic variables.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:裝置</p>  
        <p type="p">10:照明裝置</p>  
        <p type="p">20:微影光罩；物件</p>  
        <p type="p">30:物件平台</p>  
        <p type="p">31:箭頭；掃描方向</p>  
        <p type="p">32:雙頭箭頭；方向</p>  
        <p type="p">40:影像擷取單元</p>  
        <p type="p">41:光學單元</p>  
        <p type="p">42:影像擷取感測器</p>  
        <p type="p">43:列</p>  
        <p type="p">46:距離感測器</p>  
        <p type="p">47:影像平面</p>  
        <p type="p">47':影像平面</p>  
        <p type="p">48:額外光學元件</p>  
        <p type="p">50:控制裝置</p>  
        <p type="p">51:介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2313" publication-number="202627671"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627671.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測半導體基板的方法和裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR THE INSPECTION OF SEMICONDUCTOR SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260325B">G03F1/84</main-classification>  
        <further-classification edition="200601120260325B">G01N21/956</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬泰卡　尤瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATEJKA, ULRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫茲勒　喬誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HETZLER, JOCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROEDER, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒密特　卡斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDT, CARSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋施尼克　揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WERSCHNIK, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒密特　索倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDT, SOEREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特曼　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATTMANN, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種檢測半導體基板的方法，以及一種用於執行該方法的裝置（1）。該檢測半導體基板的方法使用一個對半導體基板上的結構進行基於影像擷取的裝置（1），用於基於影像擷取的該裝置以一個不同的焦距位置擷取一個半導體基板的至少一個區域，該方法包含以下步驟：a）以一個第一焦距位置擷取一個半導體基板的一個區域； b）以一個偏離該第一焦距位置的第二焦距位置擷取該半導體基板的該區域；以及 c）比較該兩個具有不同焦距位置的擷取影像，以便判定該半導體基板的該擷取區域中的缺陷。該裝置（1）用於執行該方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for the inspection of semiconductor substrates, and to a device （1） designed for carrying out this method. The method for the inspection of semiconductor substrates using a device （1） for the image-based capture of structures on semiconductor substrates, the device for the image-based capture being designed for capturing at least one region of a semiconductor substrate with a different focus position, comprises the following steps： &lt;br/&gt;a） capturing a region of a semiconductor substrate with a first focus position; &lt;br/&gt;b） capturing the region of the semiconductor substrate with a second focus position deviating from the first focus position; and &lt;br/&gt;c） comparison of the two captured images with different focus positions for the purpose of determining defects in the captured region of the semiconductor substrate. &lt;br/&gt;The device （1） is designed for carrying out the method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:照明裝置</p>  
        <p type="p">20:物件；微影光罩</p>  
        <p type="p">21:表面；物件表面</p>  
        <p type="p">30:物件平台</p>  
        <p type="p">31:方向；物件平面</p>  
        <p type="p">32:箭頭；方向</p>  
        <p type="p">40:影像擷取單元</p>  
        <p type="p">41:光學單元</p>  
        <p type="p">42:影像焦平面</p>  
        <p type="p">43:物件焦平面</p>  
        <p type="p">45:影像擷取感測器</p>  
        <p type="p">46:影像擷取感測器</p>  
        <p type="p">47:影像擷取感測器</p>  
        <p type="p">50:控制裝置；控制單元</p>  
        <p type="p">+△z/-△z:距離/離焦量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2314" publication-number="202627724"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627724.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行走車系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260330B">G05D1/617</main-classification>  
        <further-classification edition="202401120260330B">G05D1/693</further-classification>  
        <further-classification edition="200601120260330B">B61B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤祐斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAMI, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">行走車系統(1)，是收集行走於被預先規定的路徑(4)的行走車(6)所具備的感測器(34A)的檢出結果。行走車(6)，具有：將被預先設定的檢出位置(P1、P2)中的感測器(34A)的檢出結果記憶的記憶部(37)、及將有關於被記憶於記憶部(37)的檢出結果的情報顯示的顯示部(38)。行走車系統(1)，具備讀取裝置(60)，讀取裝置(60)沿著路徑配置，讀取裝置(60)讀取有關於如位於被預先設定的讀取位置(P3)的行走車(6)的顯示部(38)所示的檢出結果的資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:軌道(被預先規定的路徑)</p>  
        <p type="p">6:高架行走車(行走車)</p>  
        <p type="p">34A:防止衝突感測器(感測器)</p>  
        <p type="p">34B:障礙物感測器</p>  
        <p type="p">40A:支柱</p>  
        <p type="p">50:行走部</p>  
        <p type="p">60:攝像裝置(讀取裝置)</p>  
        <p type="p">80:檢查裝置</p>  
        <p type="p">81:固定部</p>  
        <p type="p">82:框狀本體部</p>  
        <p type="p">84:第一靶板</p>  
        <p type="p">85:第二靶板</p>  
        <p type="p">100:檢查組件</p>  
        <p type="p">A1:內部空間</p>  
        <p type="p">A2:外部空間</p>  
        <p type="p">D1:行走方向</p>  
        <p type="p">L1:第一距離</p>  
        <p type="p">L2:第二距離</p>  
        <p type="p">P1:第一檢查位置(第一檢出位置)</p>  
        <p type="p">P2:第二檢查位置(第二檢出位置)</p>  
        <p type="p">P3:讀取位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2315" publication-number="202628040"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628040.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260112B">G09G3/30</main-classification>  
        <further-classification edition="200601120260112B">G09G3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金種昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔承燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SEUNG CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG YEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐廷錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JUNG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉敬喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OK, KYUNG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宇晳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, WOO SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種顯示裝置。該顯示裝置包括：顯示面板，包含複數個單位像素，每個單位像素包含發射第一顏色的光的第一子像素及發射與第一顏色不同之第二顏色的光的第二子像素；以及電源供應器，配置以透過連接至第一子像素的第一電源線供應第一驅動電壓，並透過連接至第二子像素的第二電源線供應第二驅動電壓，其中，第一電源線和第二電源線分別包含彼此電性斷開的網狀結構線，且第一驅動電壓的電位與第二驅動電壓的電位不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus is provided.The display apparatus includes a display panel including a plurality of unit pixels each including a first subpixel emitting light of a first color and a second subpixel emitting light of a second color differing from the first color and a power supply configured to supply a first driving voltage through a first power line connected to the first subpixel and supply a second driving voltage through a second power line connected to the second subpixel, wherein the first and second power lines respectively include mesh structure lines electrically disconnected from one another, and the first driving voltage has a level differing from a level of the second driving voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">110:第一緩衝層</p>  
        <p type="p">110a:多緩衝層</p>  
        <p type="p">110b:主動緩衝層</p>  
        <p type="p">120:第一閘極絕緣層</p>  
        <p type="p">130:第一層間絕緣層</p>  
        <p type="p">140:第二緩衝層</p>  
        <p type="p">140a:氮化物緩衝層</p>  
        <p type="p">140b:氧化物緩衝層</p>  
        <p type="p">150:第二閘極絕緣層</p>  
        <p type="p">200:第二層間絕緣層</p>  
        <p type="p">300:平坦化層</p>  
        <p type="p">310:第一平坦化層</p>  
        <p type="p">320:第二平坦化層</p>  
        <p type="p">330:第三平坦化層</p>  
        <p type="p">500:堤部</p>  
        <p type="p">ACT1:第一主動層</p>  
        <p type="p">ACT2:第二主動層</p>  
        <p type="p">ACT3:第三主動層</p>  
        <p type="p">B:藍色</p>  
        <p type="p">BA:堤部區域</p>  
        <p type="p">BG2:第二金屬層</p>  
        <p type="p">BG3:第三金屬層</p>  
        <p type="p">BSM:第一金屬層</p>  
        <p type="p">CE1:第一中心電極</p>  
        <p type="p">CE2:第二中心電極</p>  
        <p type="p">CE3:第三中心電極</p>  
        <p type="p">CL:導線</p>  
        <p type="p">CP1e:第一接觸點連接電極</p>  
        <p type="p">CP2e:第二接觸點連接電極</p>  
        <p type="p">CP3e:第三接觸點連接電極</p>  
        <p type="p">DT:驅動電晶體</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">EA1:第一發光區域</p>  
        <p type="p">EA2:第二發光區域</p>  
        <p type="p">EA3:第三發光區域</p>  
        <p type="p">EL:發光層</p>  
        <p type="p">G:綠色</p>  
        <p type="p">G1:第一閘極電極</p>  
        <p type="p">G2:第二閘極電極</p>  
        <p type="p">G3:第三閘極電極</p>  
        <p type="p">Lx1:第一水平線</p>  
        <p type="p">Lx2:第二水平線</p>  
        <p type="p">Lx3:第三水平線</p>  
        <p type="p">Ly1:第一垂直線</p>  
        <p type="p">Ly2:第二垂直線</p>  
        <p type="p">Ly3:第三垂直線</p>  
        <p type="p">OLED:發光裝置</p>  
        <p type="p">R:紅色</p>  
        <p type="p">SD1a:第一源極電極</p>  
        <p type="p">SD1b:第一汲極電極</p>  
        <p type="p">SD2a:第二源極電極</p>  
        <p type="p">SD2b:第二汲極電極</p>  
        <p type="p">SD3a:第三源極電極</p>  
        <p type="p">SD3b:第三汲極電極</p>  
        <p type="p">SP1:第一子像素</p>  
        <p type="p">SP2:第二子像素</p>  
        <p type="p">SP3:第三子像素</p>  
        <p type="p">ST1:第一開關電晶體</p>  
        <p type="p">ST2:第二開關電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2316" publication-number="202627807"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627807.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料儲存裝置特性報告</chinese-title>  
        <english-title>DATA STORAGE DEVICE CHARACTERISTICS REPORTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G06F11/22</main-classification>  
        <further-classification edition="201601120260401B">G06F12/0844</further-classification>  
        <further-classification edition="200601120260401B">G06F13/42</further-classification>  
        <further-classification edition="201901120260401B">G06F16/245</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUONG, HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿雷帕利　納文　庫瑪　高德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AREPALLI, NAVEEN KUMAR GOUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瓦特　尼汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAWAT, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘迪　馬尼什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDEY, MANISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">態樣係關於具有一資料結構的一裝置特性報告，該資料結構使所有裝置特性能夠從一裝置（例如，通用快閃記憶體儲存(UFS)裝置）一次提取。因此，一單一查詢請求命令可由一主機（例如，UFS主機）發送，以檢索一單一裝置特性報告內的該裝置的複數個裝置特性（例如，描述符、旗標、及/或屬性），該單一裝置特性報告在一查詢回應中從該裝置發送至該主機。該裝置特性報告可包括至少一固定部分，該至少一固定部分含有在其內可包括固定的一組二或更多個裝置特性的預定義欄位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects relate to a device characteristics report having a data structure that enables all device characteristics to be fetched from a device (e.g., a Universal Flash Storage (UFS) device) at once. Thus, a single query request command may be sent by a host (e.g., a UFS host) to retrieve a plurality of device characteristics (e.g., descriptors, flags, and/or attributes) of the device within a single device characteristics report that is sent in a query response from the device to the host. The device characteristics report may include at least a fixed portion that contains pre-defined fields within which a fixed set of two or more device characteristics may be included.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">502:主機軟體</p>  
        <p type="p">504:主機控制器</p>  
        <p type="p">506:裝置</p>  
        <p type="p">508、510、512、514、516、518:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2317" publication-number="202628747"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628747.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透射型顯示器及其發光結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">H10H29/856</main-classification>  
        <further-classification edition="202501120260401B">H10H29/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPS ALPINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉井克昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHII, KATSUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬上友未</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMAGAMI, TOMOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">課題在於，提供能夠抑制在將光源點亮時由於通過電極間的間隙向顯示器的背面照射的光導致針對觀察面的亮度降低的“透射型顯示器及其發光結構”。解決手段在於，在具備以陣列狀配置的多組的電極(3、4)和以跨各組的電極(3、4)間的方式配置的具有透光性的多個LED(8)的透射型顯示器的發光結構(10)中，通過具備在從LED(8)的背面之中的與電極(3、4)間的間隙相對的部分朝向透明基板(1)的方向的光路上被配置在包含遮蔽該光路的區域的對象區域中的反射部(9)，在將LED(8)點亮時在從LED(8)的背面朝向透明基板(1)的方向上照射的光被反射部(9)反射而成為朝向觀察面的光，能夠抑制針對觀察面的亮度降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:透明基板</p>  
        <p type="p">2:絕緣層</p>  
        <p type="p">3:陽極電極</p>  
        <p type="p">4:陰極電極</p>  
        <p type="p">5:布線電極</p>  
        <p type="p">6:電極焊盤</p>  
        <p type="p">7:接觸孔</p>  
        <p type="p">8:LED(光源)</p>  
        <p type="p">9A:反射部(反射層)</p>  
        <p type="p">10A:發光結構</p>  
        <p type="p">11:公共布線電極</p>  
        <p type="p">12:分段布線電極</p>  
        <p type="p">20:開口部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2318" publication-number="202628843"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628843.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切割裝置及晶圓的處理方法</chinese-title>  
        <english-title>DICING DEVICE AND WAFER PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P52/00</main-classification>  
        <further-classification edition="202601120260331B">H10P72/00</further-classification>  
        <further-classification edition="202601120260331B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO SEIMITSU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, TASUKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種在減小保護膜對切斷步驟所造成的影響的同時，亦能抑制加工費用增加的切割裝置及晶圓的處理方法。此切割裝置，包括：切割部，用以對表面附有非水溶性保護膜的晶圓進行切割；紫外線照射部，用以對以該切割部進行切割後的該保護膜照射紫外線，使該保護膜變性為水溶性；以及洗淨部，用以洗淨變性為水溶性後的該保護膜，並從該晶圓除去該保護膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:切割裝置</p>  
        <p type="p">12:載入埠</p>  
        <p type="p">13:第一搬送機構</p>  
        <p type="p">15:晶圓台</p>  
        <p type="p">16:加工部</p>  
        <p type="p">17:洗淨部</p>  
        <p type="p">18:UV照明部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2319" publication-number="202628255"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628255.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器、連接至連接器中的連接基板的方法、以及治具</chinese-title>  
        <english-title>CONNECTOR, METHOD FOR CONNECTING TO CONNECTION SUBSTRATE IN CONNECTOR, AND JIG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251119B">H01R12/72</main-classification>  
        <further-classification edition="200601120251119B">H01R13/24</further-classification>  
        <further-classification edition="200601120251119B">H01R13/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本航空電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村惠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種連接器，包括：含第一接觸件組、第二接觸件組、絕緣構件的接觸組件，第一接觸件組及第二接觸件組構成為能夠在夾持連接基板的狀態下連接至連接基板，絕緣構件設置為保持第一接觸件組及第二接觸件組；以及導引構件，其設置為導引接觸組件朝連接用連接器插入至連接器內的方向側。接觸組件藉由導引構件而被導引，並在維持導引構件與連接基板之間的相對位置關係的狀態下移動，從而能夠使第一接觸件組及第二接觸件組連接至連接基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector which allows replacement with respect to a connection substrate is provided. A connector includes: a contact assembly including a first contact group and a second contact group capable of being connected to a connection substrate in a state in which they sandwich the connection substrate, and an insulating member configured to hold the first contact group and the second contact group; and a guide member configured to guide the contact assembly toward a side of an insertion direction of the connection connector into the connector. The contact assembly is guided by the guide member and moves in a state in which a relative positional relation between the guide member and the connection substrate is maintained, thereby enabling the first contact group and the second contact group to be connected to the connection substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接器</p>  
        <p type="p">2:連接基板</p>  
        <p type="p">4:連接用連接器</p>  
        <p type="p">4a:外殼</p>  
        <p type="p">5:外罩</p>  
        <p type="p">5a:貫通部</p>  
        <p type="p">12:接觸組件</p>  
        <p type="p">13:定位構件</p>  
        <p type="p">13a:第一通道部</p>  
        <p type="p">13b:第二通道部</p>  
        <p type="p">21:本體</p>  
        <p type="p">21b:凹槽部</p>  
        <p type="p">21c:天板</p>  
        <p type="p">21d:底板</p>  
        <p type="p">22:支撐部</p>  
        <p type="p">23:耦合部</p>  
        <p type="p">31:第一接觸件組</p>  
        <p type="p">32:第二接觸件組</p>  
        <p type="p">33:中板</p>  
        <p type="p">34:絕緣構件</p>  
        <p type="p">34a:本體</p>  
        <p type="p">34b:壁部</p>  
        <p type="p">35:接觸件</p>  
        <p type="p">35a:第一部分</p>  
        <p type="p">35b:第二部分</p>  
        <p type="p">35c:第三部分</p>  
        <p type="p">35d:第一電接觸部</p>  
        <p type="p">35e:第二電接觸部</p>  
        <p type="p">36:接觸件</p>  
        <p type="p">36a:第一部分</p>  
        <p type="p">36b:第二部分</p>  
        <p type="p">36c:第三部分</p>  
        <p type="p">36d:第一電接觸部</p>  
        <p type="p">36e:第二電接觸部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2320" publication-number="202627067"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627067.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廠房運轉監視系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C12M1/107</main-classification>  
        <further-classification edition="200601120260327B">C12M1/34</further-classification>  
        <further-classification edition="202201120260327B">H04L67/12</further-classification>  
        <further-classification edition="202201120260327B">G06V20/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化工機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI KAKOKI KAISHA, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化工機先進股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI KAKOKI ADVANCE, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相川英明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIKAWA, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤智紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑野慎二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANO, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森陶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, YOH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑就士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATA, NARIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松智美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, TOMOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大堺直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOSAKAI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">針對廠房的運轉管理提供提供一種廠房運轉監視系統，係能夠容易地進行遠端監視，且於災害發生等之情形中亦能應對於必要最低限度的應急遠端監視，從而能夠容易且廉價地進行功能擴充。本發明的廠房運轉監視系統(100A)係具有：雲端服務(101)，係擔任雲端伺服器；以及邊緣設備(102B)，係將於廠房(未圖示)內使用感測器(102A)所計測的一個以上的計測資訊之中經由分散式通訊的計測資訊向雲端服務(101)報告；廠房運轉監視系統(100A)係基於報告至雲端服務(101)的計測資訊進行廠房的運轉監視。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:廠房運轉監視系統</p>  
        <p type="p">101:雲端服務</p>  
        <p type="p">102:邊緣感測器</p>  
        <p type="p">102A:感測器</p>  
        <p type="p">102B:邊緣設備</p>  
        <p type="p">104a:資料取得部</p>  
        <p type="p">104b:資料保存部</p>  
        <p type="p">104c:警報發報部</p>  
        <p type="p">104d:可視化部</p>  
        <p type="p">104e:計測資料的將來預測功能</p>  
        <p type="p">105:終端</p>  
        <p type="p">106:其他的資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2321" publication-number="202628095"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628095.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有複數個磁阻裝置的組態位元及其編程與讀取方法</chinese-title>  
        <english-title>CONFIGURATION BIT HAVING A PLURALITY OF MAGNETORESISTIVE DEVICES, AND METHODS OF PROGRAMMING AND READING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G11C11/16</main-classification>  
        <further-classification edition="200601120260327B">G11C7/22</further-classification>  
        <further-classification edition="202301120260327B">H10B61/00</further-classification>  
        <further-classification edition="202301120260327B">H10N50/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾斯賓科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVERSPIN TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩德　麥可　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADD, MICHAEL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐布萊特　凱斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBRIGHT, KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾朗姆　席德　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAM, SYED M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡奇森　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUTCHISON, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DO, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於對包含磁性穿隧接面(MTJ)之一組態位元編程之方法，其包含在一第一階段期間：將一第一電壓施加於MTJ之一第一腳部及MTJ之一第三腳部以編程或抑制該第一腳部及該第三腳部之該等MTJ，及將一第二電壓施加於MTJ之一第二腳部及MTJ之一第四腳部以編程或抑制該第二腳部及該第四腳部之該等MTJ。在一第二階段期間：將該第二電壓施加於MTJ之該第一腳部及MTJ之該第三腳部以編程或抑制該第一腳部及該第三腳部之該等MTJ，及將該第一電壓施加於該MTJ之該第二腳部及MTJ之該第四腳部以編程或抑制該第二腳部及該第四腳部之該等MTJ。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for programming a configuration bit including magnetic tunnel junctions (MTJs), including during a first phase: applying a first voltage to a first leg of MTJs and a third leg of MTJs to program or inhibit the MTJs of the first leg and the third leg, and applying a second voltage to a second leg of MTJs and a fourth leg of MTJs to program or inhibit the MTJs of the second leg and the fourth leg. During a second phase: applying the second voltage to the first leg of MTJs and the third leg of MTJs to program or inhibit the MTJs of the first leg and the third leg, and applying the first voltage to the second leg of MTJs and the fourth leg of MTJs to program or inhibit the MTJs of the second leg and the fourth leg.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置/組態位元</p>  
        <p type="p">102:第一驅動器</p>  
        <p type="p">104:第一節點</p>  
        <p type="p">106:第一腳部</p>  
        <p type="p">112:第二驅動器</p>  
        <p type="p">114:第二節點</p>  
        <p type="p">116:第二腳部</p>  
        <p type="p">122:第五驅動器</p>  
        <p type="p">124:第五節點</p>  
        <p type="p">126:第四腳部</p>  
        <p type="p">132:第四驅動器</p>  
        <p type="p">134:第四節點</p>  
        <p type="p">136:第三腳部</p>  
        <p type="p">142:第三驅動器</p>  
        <p type="p">144:第三節點</p>  
        <p type="p">150:編程信號</p>  
        <p type="p">Vdd:偏壓電壓/參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2322" publication-number="202626801"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626801.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F212/14</main-classification>  
        <further-classification edition="200601120260401B">C08F212/32</further-classification>  
        <further-classification edition="200601120260401B">C08F220/10</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大友雄太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOMO, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供在使用高能射線之光微影中，溶劑溶解性優異、高感度、高對比度且EL、LWR、CDU、DOF等微影性能優異之化學增幅阻劑組成物中使用之聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。解決手段係一種聚合物，含有下式(a)表示之重複單元a及下式(b)表示之重複單元b。 &lt;br/&gt;&lt;img align="absmiddle" height="268px" width="455px" file="ed10246.JPG" alt="ed10246.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polymer containing a repeat unit a having the following formula (a) and a repeat unit b having the following formula (b). &lt;br/&gt;&lt;img align="absmiddle" height="270px" width="449px" file="ed10247.JPG" alt="ed10247.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2323" publication-number="202626546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142039</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含結晶相之玻璃</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C03C10/14</main-classification>  
        <further-classification edition="200601120260323B">C03C3/097</further-classification>  
        <further-classification edition="200601120260323B">C03C3/062</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商小原股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHARA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森彩乃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, AYANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川早矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKKAWA, SAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小笠原康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGASAWARA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種包含結晶相之玻璃，係以氧化物換算的質量%計，含有SiO&lt;sub&gt;2&lt;/sub&gt;成分30%至85%，變形點為840℃以下，在380nm至830nm之波長範圍中之厚度1mm時的平均透射率為30%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2324" publication-number="202628847"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628847.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃核心基板分割製程及由其獲得的玻璃核心基板單元</chinese-title>  
        <english-title>GLASS CORE SUBSTRATE SINGULATION PROCESS AND GLASS CORE SUBSTRATE UNIT OBTAINED THEREFROM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P54/20</main-classification>  
        <further-classification edition="202601120260401B">H10P54/30</further-classification>  
        <further-classification edition="201401120260401B">B23K26/364</further-classification>  
        <further-classification edition="200601120260401B">C03B33/08</further-classification>  
        <further-classification edition="202601120260401B">H10D86/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭大哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, DAE CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權五倬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, OH TAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳相旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, SANGUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪尙汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, SANGMOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昌熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHANG HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔雅湳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, A NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的示例性實施例提供玻璃核心基板單元和玻璃核心基板分割製程，玻璃核心基板分割製程包括以下步驟：在玻璃核心基板的一個表面或兩個表面上形成金屬圖案；在形成金屬圖案的玻璃核心基板的一個表面或兩個表面上形成絕緣層；從絕緣層去除形成在金屬圖案上的絕緣層；在絕緣層上形成保護層；去除金屬圖案；以及沿著玻璃核心基板的金屬圖案被去除的位置切割玻璃核心基板以形成玻璃核心基板單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An exemplary embodiment of the present disclosure provides a glass core substrate unit and a glass core substrate singulation process including the steps of: forming a metal pattern on one surface or both surfaces of a glass core substrate; forming an insulating layer on one surface or both surfaces of the glass core substrate on which the metal pattern is formed; removing the insulating layer formed on the metal pattern from the insulating layer; forming a protective layer on the insulating layer; removing the metal pattern; and cutting the glass core substrate along the position where the metal pattern of the glass core substrate is removed to form a glass core substrate unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:玻璃核心基板單元</p>  
        <p type="p">CT:中心</p>  
        <p type="p">DR1,DR3:方向</p>  
        <p type="p">ED1:第一側面</p>  
        <p type="p">ED2:第二側面</p>  
        <p type="p">S1:第一平面</p>  
        <p type="p">S2:第二平面</p>  
        <p type="p">T:厚度</p>  
        <p type="p">Ta1,Ta2:錐角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2325" publication-number="202626854"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626854.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142046</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橡膠用塑化劑、橡膠組成物、成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G65/332</main-classification>  
        <further-classification edition="200601120260401B">C08L71/02</further-classification>  
        <further-classification edition="200601120260401B">C08L9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口崇史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田尻裕輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJIRI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下垣知代</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOGAKI, TOMOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>所寛樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKORO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種橡膠用塑化劑，可在改善與橡膠的相容性的同時，對橡膠顯示出充分的塑化效果。一種橡膠用塑化劑，為以聚氧伸烷基二醇及單羧酸為反應原料的二酯，所述橡膠用塑化劑中，所述單羧酸為碳原子數12～24的脂肪酸，且包含碳原子數12～24的多不飽和脂肪酸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2326" publication-number="202628200"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628200.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於雷射維持電漿光收集之光譜範圍擴展</chinese-title>  
        <english-title>SPECTRAL RANGE EXTENSION FOR LASER-SUSTAINED PLASMA LIGHT COLLECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">H01J65/04</main-classification>  
        <further-classification edition="200601120260323B">H01S3/091</further-classification>  
        <further-classification edition="200601120260323B">H01S3/034</further-classification>  
        <further-classification edition="200601120260323B">H01J61/36</further-classification>  
        <further-classification edition="200601120260323B">H01J61/16</further-classification>  
        <further-classification edition="202601120260323B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>民戈白　馬可斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINGEBACH, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢札爾　伊爾亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEZEL, ILYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧摩多瓦　克里斯托弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALMODOVAR, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塞佳　迪帕克　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATHEJA, DEEPAK KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾登　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIELDEN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾芳戴鮑爾　巴喜德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESFANDYARPOUR, VAHID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茲達爾斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIMDARS, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種雷射維持寬頻光源。該光源可包含一氣體容納結構、一泵浦雷射源及一集光器元件。該氣體容納結構可包含由諸如熔融矽石之一光學透明材料形成之一本體，及透射真空紫外(VUV)光之一或多個窗口。該一或多個窗口可接合至一或多個延伸部分，由此確保一經密封內部氣體體積且避免金屬組件暴露於破壞性VUV輻射。該泵浦雷射源可經組態以將該泵浦光束引導至該氣體容納結構中以維持一電漿，從而透過該一或多個窗口發射寬頻光。可包含光學回反射器以增強集光效率。該光源組態將光譜範圍擴展至VUV及/或紅外區，改良可製造性且增強電漿穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser-sustained broadband light source is disclosed. The light source may include a gas containment structure, a pump laser source, and a light collector element. The gas containment structure may include a body formed from an optically transparent material, such as fused silica, and one or more windows transmissive to vacuum ultraviolet (VUV) light. The one or more windows may be bonded to one or more extension portions, thereby ensuring a sealed internal gas volume and avoiding exposure of metal components to destructive VUV radiation. The pump laser source may be configured to direct the pump beam into the gas containment structure to sustain a plasma, emitting broadband light through the one or more windows. Optional retroreflectors may be included to enhance light collection efficiency. The light source configuration extends the spectral range into the VUV and/or infrared regions, improves manufacturability, and enhances plasma stability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷射維持電漿(LSP)寬頻光源</p>  
        <p type="p">102:氣體容納結構</p>  
        <p type="p">106:經加壓氣體</p>  
        <p type="p">107:泵浦雷射源</p>  
        <p type="p">108:泵浦雷射光束</p>  
        <p type="p">110:燈本體</p>  
        <p type="p">111:寬頻光</p>  
        <p type="p">112:窗口</p>  
        <p type="p">113:電漿</p>  
        <p type="p">114:延伸部分</p>  
        <p type="p">116:密封件</p>  
        <p type="p">118:電極</p>  
        <p type="p">120:回反射鏡</p>  
        <p type="p">122:光學元件</p>  
        <p type="p">124:集光器元件</p>  
        <p type="p">126:下游應用</p>  
        <p type="p">128:收縮孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2327" publication-number="202626826"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626826.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改性封端聚異氰酸酯、塗料組合物、塗膜及塗膜的形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G18/10</main-classification>  
        <further-classification edition="200601120260401B">C08G18/22</further-classification>  
        <further-classification edition="200601120260401B">C08G18/32</further-classification>  
        <further-classification edition="200601120260401B">C08G18/62</further-classification>  
        <further-classification edition="200601120260401B">C08G18/73</further-classification>  
        <further-classification edition="200601120260401B">C08G18/83</further-classification>  
        <further-classification edition="200601120260401B">C09D175/04</further-classification>  
        <further-classification edition="200601120260401B">B05D3/02</further-classification>  
        <further-classification edition="200601120260401B">B05D7/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東楚股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSOH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口周人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, SHUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田斉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">改性封端聚異氰酸酯、塗料組合物、塗膜及塗膜的形成方法。一種改性封端聚異氰酸酯，其為用下述式（I）所示的含羥基四級銨鹽（I）改性的封端聚異氰酸酯。 &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="307px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2328" publication-number="202628939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>重組基板之微影方法</chinese-title>  
        <english-title>METHODS OF LITHOGRAPHY ON A RECONSTITUTED SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10P74/00</main-classification>  
        <further-classification edition="200601120260317B">G03F9/00</further-classification>  
        <further-classification edition="200601120260317B">G03F7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽倫　約里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SELEN, JORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渥克曼　羅伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WERKMAN, ROY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍特曼　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUPTMANN, MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種判定用於對一重組基板執行一微影曝光之一校正的方法，該重組基板包含一基底基板，該基底基板具有接合至其之複數個基板部分，該等基板部分係切割自一或多個預切割基板。該方法包含：獲得描述該一或多個預切割基板之至少一最上層中之特徵的一位置之位置資料；及使用該位置資料來判定用於在對該重組基板執行該微影曝光之該校正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method of determining a correction for performing a lithographic exposure on a reconstituted substrate, said reconstituted substrate comprising a base substrate with a plurality of substrate portions bonded thereto, said substrate portions having been diced from one or more pre-diced substrates The method comprises: obtaining positional data describing a position of features in at least an uppermost layer of said one or more pre-diced substrates; and using said positional data to determine said correction for performing the lithographic exposure on the reconstituted substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:預切割晶圓</p>  
        <p type="p">335:特定晶粒/晶粒</p>  
        <p type="p">335':標稱晶粒位置</p>  
        <p type="p">340:頂部特徵</p>  
        <p type="p">340':預期位置</p>  
        <p type="p">345:底部特徵</p>  
        <p type="p">345':預期位置</p>  
        <p type="p">350:箭頭</p>  
        <p type="p">355:箭頭</p>  
        <p type="p">360:箭頭</p>  
        <p type="p">362:箭頭</p>  
        <p type="p">365:場</p>  
        <p type="p">370:對準標記</p>  
        <p type="p">372:位移</p>  
        <p type="p">374:旋轉</p>  
        <p type="p">375:接合</p>  
        <p type="p">380:接合</p>  
        <p type="p">385:平面內位移資料</p>  
        <p type="p">x/y:位移</p>  
        <p type="p">z:旋轉</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2329" publication-number="202628189"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628189.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01J37/32</main-classification>  
        <further-classification edition="200601120260327B">H03K3/64</further-classification>  
        <further-classification edition="200601120260327B">H03K3/017</further-classification>  
        <further-classification edition="202601120260327B">H10P72/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩佐琥偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASA, TORAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊東祐里菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YURINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提高電漿處理裝置對基板之處理性能之技術。電漿處理裝置具有：腔室；基板支持部，其配置於腔室內；RF信號產生器；及電壓脈衝信號產生器，其構成為產生電壓脈衝信號。電壓脈衝信號於複數個週期之各者中包含之第1期間具有基準電壓位準，於複數個週期之各者中包含之第2期間具備具有第1電壓位準之電壓脈衝之序列，第1電壓位準之絕對值大於基準電壓位準之絕對值，電壓脈衝之序列中包含之複數個電壓脈衝之各者具有長於0秒且為0.5μ秒以下之接通期間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通訊介面</p>  
        <p type="p">10:腔室</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">12:電漿產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2330" publication-number="202626117"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626117.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔離器之除汙驗證系統、隔離器之除汙驗證方法及除汙驗證程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61L2/28</main-classification>  
        <further-classification edition="202601120260401B">A61L2/208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商澁谷工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBUYA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉壮馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻渡亮治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOUDO, RYOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>広沢祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSAWA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯上昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUGAMI, NOBORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於更靈活且準確地提供隔離器之除汙作業所需之除汙參數。具有與外部隔離之作業空間、並且藉由殺菌介質對作業空間進行除汙之隔離器之除汙驗證系統30具備：條件輸入部32，其輸入除汙作業時之條件；及參數算出機構34，其算出除汙參數。於條件輸入部32中，至少輸入配置於作業空間內之負載物之種類及其個數，參數算出部32根據負載物之種類及其個數、以及作業空間之容積來算出作為除汙參數之一之殺菌介質注入量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:除汙驗證作業支援系統</p>  
        <p type="p">32:條件輸入部(條件輸入機構)</p>  
        <p type="p">34:參數算出部(參數算出機構)</p>  
        <p type="p">36:顯示部(顯示機構)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2331" publication-number="202627454"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627454.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142085</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬箔的檢查方法及用於該方法的檢查系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G01N21/892</main-classification>  
        <further-classification edition="200601120260317B">G01B11/24</further-classification>  
        <further-classification edition="200601120260317B">B21C51/00</further-classification>  
        <further-classification edition="200601120260317B">B21C37/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>持田将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIDA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯野保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IINO, TAMOTSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠更高精度地檢測出搬送中之金屬箔的表面可能存在的異物的檢查方法。該檢查方法包含：(a)檢知搬送中之金屬箔的表面可能存在的異物，並取得異物之位置資訊的工程；(b)將異物之位置資訊，傳送至位於金屬箔之搬送方向下游側的攝像裝置及/或位移計的工程；(c)藉由攝像裝置，拍攝由位置資訊所指定之異物，以取得金屬箔表面之包含異物之區域的二維影像的工程；(d)在工程(c)之前或之後，藉由位移計，測量由位置資訊所指定之包含異物之區域的金屬箔表面的高度輪廓的工程；以及(e)根據二維影像及/或高度輪廓以評價異物的工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:檢查系統</p>  
        <p type="p">12:異物檢知裝置</p>  
        <p type="p">14:攝像裝置</p>  
        <p type="p">16:位移計</p>  
        <p type="p">18:資訊傳送部</p>  
        <p type="p">20:供給滾輪</p>  
        <p type="p">22:導引滾輪</p>  
        <p type="p">23:旋轉編碼器</p>  
        <p type="p">24:捲取滾輪</p>  
        <p type="p">26a,26b,26c:燈</p>  
        <p type="p">28a,28b:CCD感測器</p>  
        <p type="p">30:訊號處理部</p>  
        <p type="p">38:數據評價部</p>  
        <p type="p">46:標籤機</p>  
        <p type="p">M:金屬箔</p>  
        <p type="p">P,Q:讀取部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2332" publication-number="202627693"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627693.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>曝光方法、曝光裝置、及元件製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G03F7/20</main-classification>  
        <further-classification edition="200601120260318B">G02B27/18</further-classification>  
        <further-classification edition="202601120260318B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸江順一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROE, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋口潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGUCHI, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了抑制在曝光區域所重複之區域之感光材料之實效感光量之不均，曝光方法包含：進行n次（n為2以上之自然數）對感光性基板上之第1區域照射光之光照射處理的動作、以及進行n次（n為2以上之自然數）對包含與前述第1區域重複之重複區域及前述重複區域以外之非重複區域之、和前述第1區域不同之前述感光性基板上之第2區域照射光之光照射處理的動作；藉第1次至第n-1次之光照射處理之對前述非重複區域之累積曝光量小於目標累積曝光量；藉前述第1次至第n次之光照射處理之對前述非重複區域之累積曝光量，為前述目標累積曝光量以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2333" publication-number="202626111"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626111.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有新穎環狀雙核苷酸衍生物之抗體藥物共軛物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61K31/7084</further-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07H21/02</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石崎雅之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZAKI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木督</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久徳真梨子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYUTOKU, MARIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪浦弘志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKIURA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原香生子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, KYOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千原正尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIHARA, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚貴文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田悌司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, TEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">業界期待開發一種能夠全身投予、且能夠將STING促效劑特異性地傳遞至目標細胞或器官(例如，腫瘤部位)之抗體藥物共軛物及使用該抗體藥物共軛物之與STING促效劑活性相關之疾病、例如能夠藉由免疫活化治療之疾病(例如，癌症)之治療劑及/或治療法。 &lt;br/&gt;根據本發明，可提供一種能夠全身投予、且於表現抗原之腫瘤中表現出抗腫瘤效果之新穎抗體CDN衍生物共軛物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2334" publication-number="202628839"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628839.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合預清潔腔室及方法</chinese-title>  
        <english-title>HYBRID PRECLEAN CHAMBER AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P50/28</main-classification>  
        <further-classification edition="202601120260401B">H10P70/00</further-classification>  
        <further-classification edition="200601120260401B">C23C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李劉睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LIURUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVEY, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏博睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, BORUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例一般而言關於一種處理系統。在一或多個實施例中，該處理系統包括處理腔室和耦合至該處理腔室的流動組件，該流動組件包括電漿源。腔室主體、基板支撐件及蓋組件包括經過塗層處理的鋁材料，該塗層具有小於約9x10&lt;sup&gt;-4&lt;/sup&gt;的γ值。該處理腔室配置為執行對基板進行預處理的方法。該方法包括利用在電漿源中使用一或多種氣體形成的電漿，對設置於處理腔室中的基板執行第一碳清潔製程。電漿經由流動組件流入處理腔室。對設置於處理腔室中的基板執行第一選擇性氧化物移除製程。第一選擇性氧化物移除製程利用一或多種製程氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure generally relate to a processing system. In one or more embodiments, the processing system includes a processing chamber and a flow assembly coupled to the processing chamber including a plasma source. A chamber body, a substrate support, and a lid assembly include an aluminum material treated with a coating having a γ value of less than about 9x10&lt;sup&gt;-4&lt;/sup&gt;. The processing chamber is configured to perform a method of pretreating a substrate. The method includes performing a first carbon clean process on the substrate disposed in a processing chamber utilizing a plasma formed in the plasma source using one or more gases. The plasma flows into the processing chamber via the flow assembly. A first selective oxide removal process is performed on the substrate disposed in the processing chamber. The first selective oxide removal process utilizes one or more process gases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:流動組件</p>  
        <p type="p">201:電漿源組件</p>  
        <p type="p">205:處理腔室</p>  
        <p type="p">210:電漿源</p>  
        <p type="p">215:隔離器</p>  
        <p type="p">217:離子過濾器</p>  
        <p type="p">219:入口空腔</p>  
        <p type="p">220:流動配接器</p>  
        <p type="p">221:出口空腔</p>  
        <p type="p">222:傾斜流動開口</p>  
        <p type="p">225:第二流動開口</p>  
        <p type="p">226b:標號</p>  
        <p type="p">229:板材組件</p>  
        <p type="p">230:間隔板</p>  
        <p type="p">231:第一擋板</p>  
        <p type="p">232:中央開口</p>  
        <p type="p">235:混合歧管/歧管</p>  
        <p type="p">238:流動開口</p>  
        <p type="p">239:側流開口</p>  
        <p type="p">240:第一溝槽</p>  
        <p type="p">241:第二溝槽</p>  
        <p type="p">248:加熱器</p>  
        <p type="p">249:第二擋板</p>  
        <p type="p">250:氣室</p>  
        <p type="p">253:入口</p>  
        <p type="p">255:第一氣室</p>  
        <p type="p">257:第二氣室</p>  
        <p type="p">260:阻隔板</p>  
        <p type="p">263:開口</p>  
        <p type="p">270:面板</p>  
        <p type="p">280:可選的離子抑制元件</p>  
        <p type="p">290:蓋間隔物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2335" publication-number="202626768"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626768.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>（甲基）丙烯酸樹脂、感光性樹脂組成物，及樹脂硬化膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">C08F220/06</further-classification>  
        <further-classification edition="200601120260401B">C08F220/18</further-classification>  
        <further-classification edition="200601120260401B">C08F220/22</further-classification>  
        <further-classification edition="200601120260401B">C08F220/30</further-classification>  
        <further-classification edition="200601120260401B">C08F220/32</further-classification>  
        <further-classification edition="200601120260401B">C08F226/12</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/033</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGI, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木下健宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSHITA, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種(甲基)丙烯酸樹脂，其具有： &lt;br/&gt;　　具有經鹵素取代之苯基的式(1)表示之結構單位(a-1)： &lt;br/&gt;&lt;img align="absmiddle" height="213px" width="212px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，X為氫原子、碳原子數1~4之烷基或鹵素原子，Y為單鍵或2價有機基，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;係分別獨立為H、Br或I，惟，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;中至少1者為Br或I)，與 &lt;br/&gt;　　具有硬化性基之結構單位(X)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2336" publication-number="202628819"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628819.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光液</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SLURRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10P50/00</main-classification>  
        <further-classification edition="202601120260330B">H10P52/00</further-classification>  
        <further-classification edition="200601120260330B">C09K3/14</further-classification>  
        <further-classification edition="200601120260330B">C09G1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何華鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HUAFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李全干</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QUANGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付世龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, SHILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢尼星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, NIXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種化學機械拋光液，包括：水、研磨顆粒、鎢拋光促進劑、穩定劑、過氧化物、第一種鎢腐蝕抑制劑、第二種鎢腐蝕抑制劑以及多羥基環狀化合物。本發明的化學機械拋光液，將第一鎢的腐蝕抑制劑和第二鎢的腐蝕抑制劑複配使用，具有較低的鎢靜態拋光速率，較高的鎢的拋光速率與靜態腐蝕速率的速度比，還可以保證較高的對鎢拋光速率；同時通過添加多羥基環狀化合物，可以改善拋光後的鎢表面粗糙程度，提高對鎢金屬的平坦化效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a chemical mechanical polishing (CMP) slurry comprising: water, abrasive particles, a tungsten polishing promoter, a stabilizer, a peroxide, a first tungsten corrosion inhibitor, a second tungsten corrosion inhibitor, and a polyhydroxy cyclic compound. By combining the first tungsten corrosion inhibitor and the second tungsten corrosion inhibitor for use, the CMP slurry of the invention achieves a low static polishing rate for tungsten while maintaining a high ratio of tungsten polishing rate to static corrosion rate. Additionally, the inclusion of the polyhydroxy cyclic compound improves post-polishing surface smoothness and enhances planarization efficiency for tungsten metal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2337" publication-number="202628388"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628388.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H04L7/027</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊訊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。例如：該通信方法及裝置支援AMP有關的標準，或者適用於IEEE 802.11a/b/g標準、802.11n標準、802.11ac標準、802.11ax標準、802.11be標準或者802.11bn標準以及IEEE802.11系列的其他標準。AMP STA可以根據第一同步序列和第二同步序列生成並發送同步欄位，該第一同步序列用於相位檢測，第二同步序列用於相關檢測。從而，AMP AP接收到該同步欄位之後，可以根據第一同步序列進行粗同步，快速地確認第二同步序列的位置，以及根據第二同步序列進行精同步，提高同步準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communication technologies, and in particular, to a communication method and apparatus. For example, the communication method and apparatus support standards related to AMP, or are applicable to the IEEE 802.11a/b/g standard, 802.11n standard, 802.11ac standard, 802.11ax standard, 802.11be standard, 802.11bn standard, or other standards in the IEEE 802.11 series. An AMP STA may generate and send a synchronization field based on a first synchronization sequence and a second synchronization sequence, where the first synchronization sequence is used for phase detection, and the second synchronization sequence is used for correlation detection. In this way, after receiving the synchronization field, an AMP AP may perform coarse synchronization based on the first synchronization sequence to quickly determine the location of the second synchronization sequence, and then perform fine synchronization based on the second synchronization sequence, thereby improving synchronization accuracy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2338" publication-number="202627443"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627443.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合式奈米粒子組成測定之奈米粒子檢測</chinese-title>  
        <english-title>NANOPARTICLE DETECTION WITH INTEGRATED NANOPARTICLE COMPOSITION DETERMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260327B">G01N15/14</main-classification>  
        <further-classification edition="202101120260327B">G01N27/623</further-classification>  
        <further-classification edition="200601120260327B">G01N27/27</further-classification>  
        <further-classification edition="200601120260327B">G01N35/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商自然科學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELEMENTAL SCIENTIFIC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　明桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MYUNG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷德林　丹尼爾　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEDERIN, DANIEL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒茲　奧斯丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHULTZ, AUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海恩　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIN, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於分析含有奈米粒子之流體樣本以進行奈米粒子計數及奈米粒子元素組成的測定之系統及方法。在一態樣中，一種系統實施例包含但不限於：一遠端取樣系統，其經組態以接收含有奈米粒子之一流體樣本，該遠端取樣系統包含經組態以經由光散射檢測測定存在於該流體樣本中之奈米粒子之一數目之一粒子計數器；一樣本分析系統，其經組態以接收來自該遠端取樣系統之該流體樣本，該樣本分析系統包含經組態以測定存在於該流體樣本中之該等奈米粒子之一元素組成之一質譜儀；及一系統控制器，其通信地經組態以基於來自該質譜儀及該粒子計數器之各者之一輸出提供該流體樣本中之該等奈米粒子按特定元素類型之一分佈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for analyzing fluid samples containing nanoparticles for the determination of nanoparticle count and nanoparticle elemental composition are described. In an aspect, a system embodiment includes, but is not limited to, a remote sampling system configured to receive a fluid sample containing nanoparticles, the remote sampling system including a particle counter configured to determine a number of nanoparticles present in the fluid sample via light scattering detection; a sample analysis system configured to receive the fluid sample from the remote sampling system, the sample analysis system including a mass spectrometer configured to determine an elemental composition of the nanoparticles present in the fluid sample; and a system controller communicatively configured to provide a distribution of the nanoparticles in the fluid sample by specific element type based on an output from each of the mass spectrometer and the particle counter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:遠端取樣系統</p>  
        <p type="p">104:樣本分析系統</p>  
        <p type="p">106:流體傳送管線</p>  
        <p type="p">108:粒子計數器</p>  
        <p type="p">110:遠端取樣裝置</p>  
        <p type="p">112:流體樣本源/流體樣本</p>  
        <p type="p">114:樣本製備裝置</p>  
        <p type="p">116:泵系統</p>  
        <p type="p">118:閥系統</p>  
        <p type="p">120:稀釋劑源</p>  
        <p type="p">122:內部標準化學品源/內部標準</p>  
        <p type="p">124:樣本分析裝置</p>  
        <p type="p">126:傳送氣體供應</p>  
        <p type="p">128:第一資料輸出</p>  
        <p type="p">130:第二資料輸出</p>  
        <p type="p">132:系統控制器</p>  
        <p type="p">134:電腦處理器</p>  
        <p type="p">136:組合資料輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2339" publication-number="202628648"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628648.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有氧化錫半導體和成核層的電晶體</chinese-title>  
        <english-title>TRANSISTORS WITH TIN OXIDE SEMICONDUCTOR AND NUCLEATION LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D62/17</main-classification>  
        <further-classification edition="202501120260327B">H10D62/40</further-classification>  
        <further-classification edition="202501120260327B">H10D62/80</further-classification>  
        <further-classification edition="202501120260327B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商齊耐特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZINITE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鳳麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, FENGLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曉泰　傑姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOUTE, GEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴萊吉　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARLAGE, DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實例薄膜電晶體包括矽基基板、以及在該矽基基板處之源極及汲極。該源極及該汲極藉由間隙間隔開。該薄膜電晶體進一步包括在該間隙內至少與該矽基基板接觸之成核層以及與該成核層接觸之通道材料主體。該通道材料係奈米結晶氧化錫(SnO&lt;sub&gt;2&lt;/sub&gt;)。該成核層包括可降低該矽基基板與該通道材料主體之間之熱誘導應力的成核元素。該成核元素亦可促進該通道材料之較佳晶體定向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example thin-film transistor includes a silicon-based substrate and a source and drain at the silicon-based substrate. The source and drain are spaced apart by a gap. The thin-film transistor further includes a nucleation layer in contact with at least the silicon-based substrate within the gap, and a body of channel material in contact with the nucleation layer. The channel material is nanocrystalline tin oxide (SnO&lt;sub&gt;2&lt;/sub&gt;). The nucleation layer includes a nucleation element that may reduce thermally induced stress between the silicon-based substrate and the body of channel material. The nucleation element may also promote a preferred crystal orientation for the channel material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:薄膜電晶體</p>  
        <p type="p">12:源極</p>  
        <p type="p">14:汲極</p>  
        <p type="p">16:閘極</p>  
        <p type="p">20:基板</p>  
        <p type="p">30:源極材料主體</p>  
        <p type="p">32:汲極材料主體</p>  
        <p type="p">50:通道材料主體</p>  
        <p type="p">52:閘極介電材料主體</p>  
        <p type="p">54:閘極材料主體</p>  
        <p type="p">60:源極電極</p>  
        <p type="p">62:汲極電極</p>  
        <p type="p">70:成核層</p>  
        <p type="p">80:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2340" publication-number="202628036"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628036.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>掃描驅動電路及包括其的顯示裝置</chinese-title>  
        <english-title>SCAN DRIVING CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">G09G3/20</main-classification>  
        <further-classification edition="201601120251105B">G09G3/3225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李成秦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁禎烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNG YUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭度薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, DO HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置可以包括用於驅動發光元件的像素電路，以及用於供應掃描訊號至像素電路的掃描驅動電路。掃描驅動電路可以包括邏輯部分及反相器，邏輯部分用於接收多個時脈訊號，及透過邏輯輸出終端輸出邏輯訊號，反相器用於接收邏輯訊號，及透過閘極輸出終端輸出具有經反相的邏輯訊號的相位的掃描訊號。反相器包括n型的第一反相器電晶體及p型的第二反相器電晶體，第一反相器電晶體及第二反相器電晶體的閘極電極皆連接於邏輯部分的邏輯輸出終端，第一及第二反相器電晶體皆連接於閘極輸出終端。並且，第一反相器電晶體可以包括氧化物半導體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device can include a pixel circuit configured to drive a light emitting element, and a scan driving circuit configured to supply a scan signal to the pixel circuit. The scan driving circuit can include a logic portion to receive clock signals and output a logic signal through a logic output terminal, and an inverter to receive the logic signal and output the scan signal with a phase of the logic signal inverted through a gate output terminal. The inverter includes a first inverter transistor of n-type and a second inverter transistor of a p-type transistor, in which gate electrodes the first and second inverter transistors are both connected to the logic output terminal of the logic portion, the first and second inverter transistors are both connected to the gate output terminal. Also, the first inverter transistor can include an oxide semiconductor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">AA:主動區域</p>  
        <p type="p">NA:非主動區域</p>  
        <p type="p">SP:子像素</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">GL:閘極線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2341" publication-number="202626778"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626778.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光阻下層膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F8/08</main-classification>  
        <further-classification edition="200601120260401B">C08F8/14</further-classification>  
        <further-classification edition="200601120260401B">C08F8/18</further-classification>  
        <further-classification edition="200601120260401B">C08F8/30</further-classification>  
        <further-classification edition="200601120260401B">C08F36/06</further-classification>  
        <further-classification edition="200601120260401B">C08L47/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/11</further-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤祐希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村護</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之光阻下層膜形成用組成物，係含有具有碳-碳雙鍵且可經改性之聚丁二烯、及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2342" publication-number="202627131"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627131.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種降低嚴重裂紋風險的高壓壓鑄模具的製造方法</chinese-title>  
        <english-title>A METHOD FOR PRODUCING A MOULD FOR HIGH PRESSURE DIE CASTING WITH REDUCED RISK FOR GROSS CRACKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C22C38/00</main-classification>  
        <further-classification edition="200601120260325B">B22D17/00</further-classification>  
        <further-classification edition="200601120260325B">B22D17/22</further-classification>  
        <further-classification edition="200601120260325B">B23P15/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商伍德赫爾恩股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UDDEHOLMS AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彥傑馬克　瑟班天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EJNERMARK, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種降低或消除用於高壓壓鑄之一熱作工具中之嚴重裂紋危險的方法，該方法藉由製造用於HPDC之一近淨形（NNS）模具而實際上消除來自冷卻通道內部之裂紋形成危險，其中共形冷卻通道由具有一光滑表面之不鏽鋼管製成。該熱作工具包含至少一個非襯裡及/或一個共形冷卻通道。該NNS模具是藉由熱均壓（HIP）製造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is directed to a method for reducing or eliminating the danger for gross cracking in a hot work tool for high pressure die casting practically eliminates the danger of crack initiation from the inside of the cooling channel by manufacturing a near net shape (NNS) mould for HPDC, wherein the conformal cooling channels are made of stainless steel tubes having a smooth surface. The hot work tool comprises at least one non-liner and/or one conformal cooling channel. The NNS mould is produced by Hot Isostatic Pressing (HIP).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2343" publication-number="202626201"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626201.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可再生離子樹脂篩檢程式回收再生的方法</chinese-title>  
        <english-title>METHOD FOR RECOVERING AND REGENERATING RENEWABLE ION-EXCHANGE RESIN FILTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">B01J49/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美埃(中國)環境科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYAIR TECHNOLOGY (CHINA) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬來西亞商美埃製造(馬)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYAIR MANUFACTURING (M) SDN. BHD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　偉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAP, WEE KEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭玥婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUE TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮　偉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOONG, WAI HOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱蕾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種可再生離子樹脂過濾器回收再生的方法，包括：S1製作濾布；S2組裝過濾器；S3過濾器回收步驟；S4，過濾器再生過程。本發明採用無膠工藝製作濾布，組裝過濾器時，首先，將濾芯組裝到耐腐蝕的塑料框；然後，再組裝到金屬外框；其中塑料框和金屬外框的設計有可匹配的凹槽；回收再生時，把塑料框從不耐腐蝕的鋁型材框取出；一則，本發明金屬外框可以重複利用，避免造成浪費。二則本發明再生液循環使用3次後，使用壽命仍超過650min，為原始樹脂80%及以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2344" publication-number="202626372"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626372.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及光學構件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B32B37/06</main-classification>  
        <further-classification edition="201901120260318B">B32B7/02</further-classification>  
        <further-classification edition="201901120260318B">B32B7/035</further-classification>  
        <further-classification edition="201901120260318B">B32B7/023</further-classification>  
        <further-classification edition="202301120260318B">H10K50/86</further-classification>  
        <further-classification edition="202301120260318B">H10K59/10</further-classification>  
        <further-classification edition="200601120260318B">G02B5/30</further-classification>  
        <further-classification edition="200601120260318B">G02F1/13363</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北野康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITANO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德岡咲美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUOKA, SAKIMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施形態之光學積層體，包含具有第一主面及第二主面之第一相位差薄膜，且前述光學積層體係用以與具有曲面部之構件一體化者；前述第一相位差薄膜係從前述第一主面側起依序配置之液晶化合物之定向固化層與定向膜之積層體；令前述第一相位差薄膜之前述第一主面及前述第二主面利用奈米壓痕儀測定之彈性模數分別為X1及X2時，X1及X2滿足0.58≦X1/X2≦1.65之關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100B:光學積層體</p>  
        <p type="p">110:第一相位差薄膜</p>  
        <p type="p">110a,130a:第一主面</p>  
        <p type="p">110b,130b:第二主面</p>  
        <p type="p">112,132:液晶定向固化層</p>  
        <p type="p">114:定向膜</p>  
        <p type="p">120:黏著劑層</p>  
        <p type="p">130:第二相位差薄膜</p>  
        <p type="p">140:接著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2345" publication-number="202628218"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628218.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圓筒形電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260323B">H01M10/0587</main-classification>  
        <further-classification edition="201401120260323B">H01M10/643</further-classification>  
        <further-classification edition="202101120260323B">H01M50/593</further-classification>  
        <further-classification edition="201301120260323B">H01G11/80</further-classification>  
        <further-classification edition="200601120260323B">B65B51/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>褔岡孝博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUOKA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下修一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, SHUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木加奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">圓筒形電池(10)具備：電極體(14)，具有正極(11)、負極(12)及分隔件(13)，且藉由隔著分隔件(13)捲繞正極(11)與負極(12)而形成；外裝罐(15)，呈有底圓筒形狀，且容納電極體(14)；封口體(17)，將外裝罐(15)的開口部堵住；及絕緣板(22)，配置於電極體(14)及封口體(17)之間，在絕緣板(22)的與封口體(17)相向的上表面設置支撐封口體(17)之絕緣性的支撐部(40)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:圓筒形電池</p>  
        <p type="p">11:正極</p>  
        <p type="p">12:負極</p>  
        <p type="p">13:分隔件</p>  
        <p type="p">14:電極體</p>  
        <p type="p">15:外裝罐</p>  
        <p type="p">16:凹槽部</p>  
        <p type="p">17:封口體</p>  
        <p type="p">18:壓接部</p>  
        <p type="p">20:正極引線</p>  
        <p type="p">21:負極引線</p>  
        <p type="p">22:上部絕緣板</p>  
        <p type="p">23:下部絕緣板</p>  
        <p type="p">30:墊片</p>  
        <p type="p">40,40a,40b:支撐部</p>  
        <p type="p">A:框選處</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2346" publication-number="202628741"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628741.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及包含其之電子設備</chinese-title>  
        <english-title>DISPLAY DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10H29/49</main-classification>  
        <further-classification edition="202601120260327B">H10W72/29</further-classification>  
        <further-classification edition="202301120260327B">H10K59/131</further-classification>  
        <further-classification edition="202601120260327B">H10W70/654</further-classification>  
        <further-classification edition="202301120260327B">H10K77/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太昌一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAE, CHANGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李揆汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GYUJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全亨一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, HYUNGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含：一第一-1電極焊墊、一第一-2電極焊墊、與該第一-1電極焊墊及該第一-2電極焊墊間隔開的一第二電極焊墊，該第二電極焊墊包含一第一部分、在一第一方向上與該第一部分鄰近的一第二部分、以及將該第一部分及該第二部分連接的一連接部分；一第一發光元件，透過一第一凸塊金屬與該第一-1電極焊墊連接，並透過一第二凸塊金屬與該第二電極焊墊的該第一部分連接；以及一第二發光元件，透過一第三凸塊金屬與該第一-2電極焊墊連接，並透過該第二凸塊金屬與該第二電極焊墊的該第二部分連接。該連接部分在與該第一方向相交的一第二方向上的寬度小於該第一部分在該第二方向上的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes: a first-1 electrode pad, a first-2 electrode pad, a second electrode pad spaced apart from the first-1 and first-2 electrode pads and including a first portion, a second portion adjacent to the first portion in a first direction, and a connection portion connecting the first portion and the second portion, a first light-emitting element connected to the first-1 electrode pad through a first bump metal and connected to the first portion of the second electrode pad through a second bump metal, and a second light-emitting element connected to the first-2 electrode pad through a third bump metal and connected to the second portion of the second electrode pad through the second bump metal. A width of the connection portion in a second direction crossing the first direction is less than a width of the first portion in the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一島部分</p>  
        <p type="p">230:發光二極體</p>  
        <p type="p">230A:第一發光二極體</p>  
        <p type="p">230B:第二發光二極體</p>  
        <p type="p">230C:第三發光二極體</p>  
        <p type="p">241:第一電極焊墊</p>  
        <p type="p">241-1:第一-1電極焊墊</p>  
        <p type="p">241-2:第一-2電極焊墊</p>  
        <p type="p">241-3:第一-3電極焊墊</p>  
        <p type="p">242:第二電極焊墊</p>  
        <p type="p">242-1:第一部分</p>  
        <p type="p">242-2:第二部分</p>  
        <p type="p">242-3:第三部分</p>  
        <p type="p">242-4:第一連接部分</p>  
        <p type="p">242-5:第二連接部分</p>  
        <p type="p">CNT1:第一接觸孔</p>  
        <p type="p">CNT2:第二接觸孔</p>  
        <p type="p">PC:像素驅動電路單元</p>  
        <p type="p">VSSL:第二電壓線</p>  
        <p type="p">Wa,Wb:寬度</p>  
        <p type="p">x,y,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2347" publication-number="202626569"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626569.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142234</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經純化的氟炔烴化合物的製造方法、氟化吸附劑及其製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING PURIFIED FLUOROALKYNE COMPOUNDS, FLUORINATED ADSORBENTS AND METHOD FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C17/389</main-classification>  
        <further-classification edition="200601120260401B">C07C21/22</further-classification>  
        <further-classification edition="200601120260401B">B01J20/18</further-classification>  
        <further-classification edition="200601120260401B">B01J20/28</further-classification>  
        <further-classification edition="200601120260401B">B01J20/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江藤友亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村新吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木克親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, YOSHICHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山明平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, AKINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之經純化的氟炔烴化合物之製造方法，係具備下列步驟：對於含有水之氟炔烴化合物，藉由使用氟化吸附劑而實施脫水處理，以獲得經純化的氟炔烴化合物，且前述氟炔烴化合物係以式1所示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for producing a purified fluoroalkyne compound according to the present invention includes a step of dehydrating a water-containing fluoroalkyne compound using a fluorinated adsorbent to obtain a purified fluoroalkyne compound, wherein the fluoroalkyne compound is represented by Formula 1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2348" publication-number="202626380"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626380.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車後輪轂總成及鏈輪支撐主體</chinese-title>  
        <english-title>BICYCLE REAR HUB ASSEMBLY AND SPROCKET SUPPORT BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">B60B1/14</main-classification>  
        <further-classification edition="200601120260317B">B60B27/04</further-classification>  
        <further-classification edition="200601120260317B">B60B27/02</further-classification>  
        <further-classification edition="200601120260317B">B62M9/12</further-classification>  
        <further-classification edition="200601120260317B">B62M9/10</further-classification>  
        <further-classification edition="200601120260317B">F16H55/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡智成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, TOMONARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自行車後輪轂總成包含一輪轂軸、一輪轂主體及一鏈輪支撐主體。該輪轂軸包括具有等於或大於13 mm之一最小內徑的一軸通孔。該輪轂主體圍繞該自行車後輪轂總成之一旋轉中心軸線可旋轉地安裝於該輪轂軸上。該鏈輪支撐主體圍繞該旋轉中心軸線可旋轉地安裝於該輪轂軸上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bicycle rear hub assembly comprises a hub axle, a hub body, and a sprocket support body. The hub axle includes an axle through-bore that has a minimum inner diameter equal to or larger than 13 mm. The hub body is rotatably mounted on the hub axle about a rotational center axis of the bicycle rear hub assembly. The sprocket support body is rotatably mounted on the hub axle about the rotational center axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:自行車傳動系統</p>  
        <p type="p">12:自行車後輪轂總成</p>  
        <p type="p">14:自行車後鏈輪總成</p>  
        <p type="p">16:自行車制動轉子</p>  
        <p type="p">28:鏈輪支撐主體</p>  
        <p type="p">30:輪轂軸</p>  
        <p type="p">30A:軸通孔</p>  
        <p type="p">30B:第一軸端</p>  
        <p type="p">30C:第二軸端</p>  
        <p type="p">30X:軸管</p>  
        <p type="p">30Y:第一軸部分</p>  
        <p type="p">30Z:第二軸部分</p>  
        <p type="p">32:鎖定構件</p>  
        <p type="p">34:制動轉子支撐主體</p>  
        <p type="p">36:輪轂主體</p>  
        <p type="p">37:鏈輪支撐構件</p>  
        <p type="p">A1:中心軸線</p>  
        <p type="p">BD1:最小內徑</p>  
        <p type="p">BD2:最大外徑</p>  
        <p type="p">BD3:最小外徑</p>  
        <p type="p">BF:自行車框架</p>  
        <p type="p">BF1:第一框架</p>  
        <p type="p">BF2:第二框架</p>  
        <p type="p">BF11:第一凹槽</p>  
        <p type="p">BF21:第二凹槽</p>  
        <p type="p">CPL:軸向中心平面</p>  
        <p type="p">D2:軸向方向</p>  
        <p type="p">WS:車輪緊固結構</p>  
        <p type="p">WS1:緊固桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2349" publication-number="202626567"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626567.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全氟炔烴化合物的製造方法及組成物</chinese-title>  
        <english-title>METHOD FOR PRODUCING PERFLUOROALKYL COMPOUNDS AND COMPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C17/093</main-classification>  
        <further-classification edition="200601120260401B">C07C17/23</further-classification>  
        <further-classification edition="200601120260401B">C07C17/278</further-classification>  
        <further-classification edition="200601120260401B">C07C17/358</further-classification>  
        <further-classification edition="200601120260401B">C07C17/383</further-classification>  
        <further-classification edition="200601120260401B">C07C21/20</further-classification>  
        <further-classification edition="200601120260401B">C07C21/22</further-classification>  
        <further-classification edition="200601120260401B">B01J27/125</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大金工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江藤友亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村新吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木克親</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, YOSHICHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山明平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, AKINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種全氟炔烴化合物的製造方法，其具備：在含氟化氯化鋁之觸媒之存在下，使全氟二烯烴化合物反應而獲得全氟炔烴化合物之步驟，並且，上述含氟化氯化鋁之觸媒係自藉由在氫氯氟碳化物之存在下使氯化鋁反應而獲得之產物中，去除副產物之至少一部分而獲得者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for producing perfluoroalkyne compounds, comprising a step of reacting a perfluoroalkadiene compound in the presence of a fluorinated aluminum chloride-containing catalyst to obtain a perfluoroalkyne compound, wherein the fluorinated aluminum chloride-containing catalyst is obtained by removing at least a portion of by-products from a product obtained by reacting aluminum chloride in the presence of a hydrochlorofluorocarbon.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2350" publication-number="202628029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明顯示裝置</chinese-title>  
        <english-title>TRANSPARENT DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G09F9/33</main-classification>  
        <further-classification edition="200601120260302B">G09F9/302</further-classification>  
        <further-classification edition="202601120260302B">H10H29/24</further-classification>  
        <further-classification edition="202501120260302B">H10H29/854</further-classification>  
        <further-classification edition="200601120260302B">G02B1/04</further-classification>  
        <further-classification edition="200601120260302B">B29C39/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴藝瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YESEUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諏訪達弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUWA, TATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤森隆成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMORI, TAKASHIGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車淳旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, SOONMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭炅薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, KYUNGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYEONDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申榮訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YOUNGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">透明顯示裝置包括以M×N矩陣格式配置的複數個透明顯示模組、設置在複數個透明顯示模組之間的間隙中的填充劑、以及配置為覆蓋複數個透明顯示模組的前表面和填充劑的前表面的透光蓋。填充劑包括第一透光樹脂層，設置在複數個透明顯示模組中相鄰透明顯示模組的光透射基板之間的間隙中並配置為與光透射基板平行，第一透光樹脂層的折射率與光透射基板的折射率相匹配；以及第二透光樹脂層，設置在複數個透明顯示模組中相鄰透明顯示模組的前層之間的間隙中並配置為與前層平行，第二透光樹脂層的色彩值與前層的色彩值相匹配。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transparent display apparatus includes a plurality of transparent display modules arranged in an M×N matrix format, a filler disposed in a gap between the plurality of transparent display modules, and a light-transmitting cover configured to cover front surfaces of the plurality of transparent display modules and a front surface of the filler. The filler includes a first light-transmitting resin layer disposed in a gap between and arranged parallel to light-transmitting substrates of adjacent transparent display modules among the plurality of transparent display modules, the first light-transmitting resin layer having a refractive index matched with a refractive index of the light-transmitting substrates; and a second light-transmitting resin layer disposed in a gap between and arranged parallel to front layers of adjacent transparent display modules among the plurality of transparent display modules, the second light-transmitting resin layer having a color value matched with a color value of the front layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:透明顯示裝置</p>  
        <p type="p">10:透明顯示模組</p>  
        <p type="p">10a:第一顯示模組</p>  
        <p type="p">10b:第二顯示模組</p>  
        <p type="p">11:光透射基板</p>  
        <p type="p">11a:安裝表面</p>  
        <p type="p">12:前層</p>  
        <p type="p">13:電路圖案層</p>  
        <p type="p">14:發光元件</p>  
        <p type="p">15:安裝表面蓋</p>  
        <p type="p">20:基底</p>  
        <p type="p">30:填充劑</p>  
        <p type="p">31:第一透光樹脂層</p>  
        <p type="p">32:第二透光樹脂層</p>  
        <p type="p">40:透光蓋</p>  
        <p type="p">41:第一區</p>  
        <p type="p">42:第二區</p>  
        <p type="p">50:前側光學層</p>  
        <p type="p">60:背側光學層</p>  
        <p type="p">70:前黏合層</p>  
        <p type="p">80:後黏合層</p>  
        <p type="p">90:保護膜</p>  
        <p type="p">G:間隙</p>  
        <p type="p">X、Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2351" publication-number="202627275"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627275.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>灌漿填充方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">E04G21/12</main-classification>  
        <further-classification edition="200601120260325B">E04G21/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大成建設股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAISEI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲田博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INADA, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山智昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為：在從側方將梁構件接合於預鑄混凝土造的柱構件時能夠確認灌漿均勻地被填充至接合部且容易地填充灌漿。在梁構件5埋設有複數個梁筋接頭部54；在梁筋接頭部54各者插入有梁主筋52的一方材端52s以及柱構件2的接合用梁主筋27A、27B；在梁構件5形成有連通路58，連通路58係從梁筋接頭部54的內部空間延伸至端面5f以外的表面51s、51t並連通至外部；灌漿填充方法係包含：接縫模版設置工序，係以在梁構件5與柱構件2之間塞住接縫空間ZS的下方以及側方之方式設置接縫模版90；以及灌漿填充工序，係對一個連通路58C壓入灌漿G並開始填充(箭頭DR1)，而後在確認到從一個連通路58C以外的所有的連通路58排出了灌漿G(箭頭DR5)之後，停止灌漿G的填充。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2,2A:柱構件</p>  
        <p type="p">5:梁構件</p>  
        <p type="p">5f:端面</p>  
        <p type="p">25:突出部</p>  
        <p type="p">25f:前端面(柱構件的表面)</p>  
        <p type="p">27A,27B:接合用梁主筋</p>  
        <p type="p">51A:第一混凝土部</p>  
        <p type="p">51B:第二混凝土部</p>  
        <p type="p">51s,51t:表面</p>  
        <p type="p">52:梁主筋</p>  
        <p type="p">52A:上側梁主筋</p>  
        <p type="p">52B:下側梁主筋</p>  
        <p type="p">54,54C:梁筋接頭部</p>  
        <p type="p">58,58C:連通路</p>  
        <p type="p">90:接縫模版</p>  
        <p type="p">DR1至DR5:箭頭</p>  
        <p type="p">ZS:接縫空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2352" publication-number="202626358"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626358.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗汙垢複合結構與其製備方法</chinese-title>  
        <english-title>ANTIFOULING COMPOSITE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B32B27/00</main-classification>  
        <further-classification edition="200601120260401B">B32B27/28</further-classification>  
        <further-classification edition="200601120260401B">B32B27/30</further-classification>  
        <further-classification edition="200601120260401B">B32B33/00</further-classification>  
        <further-classification edition="200601120260401B">B32B3/30</further-classification>  
        <further-classification edition="200601120260401B">B32B37/24</further-classification>  
        <further-classification edition="200601120260401B">B32B37/26</further-classification>  
        <further-classification edition="200601120260401B">C08G77/442</further-classification>  
        <further-classification edition="200601120260401B">C09D183/10</further-classification>  
        <further-classification edition="200601120260401B">C09D5/16</further-classification>  
        <further-classification edition="200601120260401B">B05D1/38</further-classification>  
        <further-classification edition="200601120260401B">B05D3/02</further-classification>  
        <further-classification edition="200601120260401B">B05D3/10</further-classification>  
        <further-classification edition="200601120260401B">B05D5/00</further-classification>  
        <further-classification edition="200601120260401B">B05D7/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNGHSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛涵宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, HAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亭綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TING-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴怡珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YI-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳易辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種抗汙垢複合結構，其包含一彈性膜以及一抗汙膜，彈性膜的一材質包含聚二甲基矽氧烷，抗汙膜設置於彈性膜的一表面。抗汙膜與彈性膜的所述表面的一截面形狀呈皺褶狀。抗汙膜包含一共聚高分子，共聚高分子是由複數個聚二甲基矽氧烷單元與複數個聚苯乙烯單元共聚而成，且所述聚二甲基矽氧烷單元佔共聚高分子的一體積分率為10%至80%，共聚高分子具有如式(I)所示的一結構，式(I)中各符號如說明書中所定義者。藉此，可達到抗汙垢與抗生物附著等效果，且有助於延長抗汙垢複合結構的壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to the present disclosure, an antifouling composite structure includes a flexible film and an antifouling film. A material of the flexible film includes a polydimethylsiloxane. The antifouling film is disposed on a surface of the flexible film. A cross-sectional shape of the antifouling film and the surface of the flexible film is in a wrinkled shape. The antifouling film includes a copolymer. The copolymer is composed with a plurality of polydimethylsiloxane units and a plurality of polystyrene units, and a volume fraction of the plurality of polydimethylsiloxane units in the copolymer is 10% to 80%. The copolymer has a structure represented by formula (I), of which each symbol is defined in the specification. Therefore, the antifouling and anti-bioadhesion effects can be obtained, and it is favorable for improving the service life of the antifouling composite structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:抗汙垢複合結構</p>  
        <p type="p">110:彈性膜</p>  
        <p type="p">120:抗汙膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2353" publication-number="202627140"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627140.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶材及積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C23C14/14</main-classification>  
        <further-classification edition="200601120260324B">C23C14/20</further-classification>  
        <further-classification edition="200601120260324B">C22C19/05</further-classification>  
        <further-classification edition="200601120260324B">C23F1/18</further-classification>  
        <further-classification edition="200601120260324B">C09J9/02</further-classification>  
        <further-classification edition="201901120260324B">B32B7/05</further-classification>  
        <further-classification edition="200601120260324B">B32B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大同特殊鋼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIDO STEEL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戶塚巡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTSUKA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題提供之靶材，係頗適於成膜為與基板間之黏著性優異、且使用三氯化鐵時的蝕刻性亦優異的黏著層。 &lt;br/&gt;本發明之解決手段之靶材係含有元素Ni、Cr，更進一步含有Al及Zn中之至少1種，將該等Ni、Cr、Al、Zn的合計設為100at%時，含有Cr：4~14at%；Al及Zn中之至少1種：合計含有4~16at%；其餘則由Ni及不可避免的雜質構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層體</p>  
        <p type="p">12:基板</p>  
        <p type="p">14:黏著層</p>  
        <p type="p">16:導電層</p>  
        <p type="p">17:種子層</p>  
        <p type="p">18:電鍍層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2354" publication-number="202626455"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626455.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物品搬送系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">B65G1/04</main-classification>  
        <further-classification edition="200601120260128B">B65G1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商椿本鏈條股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBAKIMOTO CHAIN CO.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊達洋貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DATE, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田洋昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種物品搬送系統，其結構簡單，即使物品搬送台車在升降時亦不會使姿勢大幅地傾斜，而能夠抑制升降用齒輪的磨損，防止物品的散包。一種物品搬送系統（100），包括升降移動路徑（130）及物品搬送台車（110），升降移動路徑（130）具有升降用齒條（131）及升降用軌道（132），物品搬送台車（110）具有作為行駛用車輪（111）、升降用齒輪（115）、第一抵接輪（113）、第二抵接輪（114）的旋轉軸的行駛軸（Mc）、升降軸（Sc）、第一抵接旋轉軸、第二抵接旋轉軸（Rc），第一抵接旋轉軸與第二抵接旋轉軸（Rc）配置於不同的高度且不在垂直方向上排列的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:物品搬送系統</p>  
        <p type="p">110:物品搬送台車</p>  
        <p type="p">111:行駛用車輪</p>  
        <p type="p">112:行駛輔助車輪/輔助車輪</p>  
        <p type="p">113:第一抵接輪</p>  
        <p type="p">114:第二抵接輪</p>  
        <p type="p">115:升降用齒輪</p>  
        <p type="p">116:物品保持部</p>  
        <p type="p">130:升降移動路徑</p>  
        <p type="p">137:行駛用軌道</p>  
        <p type="p">138:行駛面</p>  
        <p type="p">139:凹部</p>  
        <p type="p">G:地面</p>  
        <p type="p">C:集裝箱(物品)</p>  
        <p type="p">T:保管貨架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2355" publication-number="202626295"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626295.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>補液系統、補液自走裝置及補液方法</chinese-title>  
        <english-title>FLUID REPLENISHING SYSTEM, FLUID REPLENISHING AUTONOMOUS MOBILE VEHICLE, AND FLUID REPLENISHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260203B">B25J5/00</main-classification>  
        <further-classification edition="200601120260203B">B25J11/00</further-classification>  
        <further-classification edition="200601120260203B">B25J19/02</further-classification>  
        <further-classification edition="200601120260203B">B65B3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雙鴻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AURAS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張芷宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KAITLYN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宣諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, HSUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉恬利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, TIAN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種補液系統、補液自走裝置及補液方法，其補液自走裝置包括一工作機體、一移動機構、一第一液箱、一第二液箱、一機械手臂、一第一接頭組、一第二接頭組、一第一管線組及一第二管線組。移動機構、第一液箱、第二液箱、機械手臂皆設置於工作機體上。第一接頭組設置於機械手臂上。第一管線組接通第一液箱與第一接頭組。第二管線組接通第二液箱與第二接頭組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fluid replenishing system, a fluid replenishing autonomous mobile vehicle, and a fluid replenishing method are provided, and the fluid replenishing autonomous mobile vehicle includes a working body, a moving mechanism, a first liquid tank, a second liquid tank, a robotic arm, a first connector assembly, a second connector assembly, a first pipeline set and a second pipeline set. The moving mechanism, the first liquid tank, the second liquid tank and the robotic arm are all arranged on the working body. The first connector assembly is arranged on the robotic arm. The first pipeline set is connected to the first liquid tank and the first connector assembly. The second pipeline set is connected to the second liquid tank and the second connector assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:補液自走裝置</p>  
        <p type="p">100:工作機體</p>  
        <p type="p">110:放置面</p>  
        <p type="p">200:移動機構</p>  
        <p type="p">310:第一液箱</p>  
        <p type="p">320:第二液箱</p>  
        <p type="p">330:過濾器</p>  
        <p type="p">340:檢驗容器</p>  
        <p type="p">370:液位計</p>  
        <p type="p">380:第一電泵</p>  
        <p type="p">390:第二電泵</p>  
        <p type="p">410:機械手臂操控裝置</p>  
        <p type="p">420:控制裝置</p>  
        <p type="p">430:電池模組</p>  
        <p type="p">432:訊號接收器</p>  
        <p type="p">500:機械手臂</p>  
        <p type="p">600:第一接頭組</p>  
        <p type="p">700:第二接頭組</p>  
        <p type="p">800:取像裝置</p>  
        <p type="p">900:可伸縮桿件</p>  
        <p type="p">A1:第一管線組</p>  
        <p type="p">A11:前管線</p>  
        <p type="p">A2:第二管線組</p>  
        <p type="p">A21:前管線</p>  
        <p type="p">A22:第一後管線</p>  
        <p type="p">C:外罩</p>  
        <p type="p">L1,L2:長軸方向</p>  
        <p type="p">M:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2356" publication-number="202628419"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628419.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在4:4:4色度格式及單一樹狀結構情況下針對所有通道之基於矩陣的內部預測技術</chinese-title>  
        <english-title>MIP FOR ALL CHANNELS IN THE CASE OF 4:4:4-CHROMA FORMAT AND OF SINGLE TREE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260316B">H04N19/186</main-classification>  
        <further-classification edition="201401120260316B">H04N19/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗勞恩霍夫爾協會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕雅夫　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFAFF, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛茲　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINZ, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希利　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELLE, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克爾　飛利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERKLE, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史泰倫柏格　柏喬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STALLENBERGER, BJOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏佛　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布洛斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROSS, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史瓦茲　希可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHWARZ, HEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬皮　迪特利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARPE, DETLEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威剛德　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEGAND, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於區塊之解碼器經組配以使用一分割方案將具有多於一個色彩分量及據以同等地取樣每一色彩分量之一色彩取樣格式之一圖像分割成區塊，根據該分割方案，該圖像相對於每一色彩分量同等地分割。另外，該基於區塊之解碼器經組配以藉由針對該圖像之經內部預測第一色彩分量區塊中之每一者選擇內部預測模式之一第一集合中之一個內部預測模式而以該等區塊為單位解碼該圖像之一第一色彩分量。該第一集合包含基於矩陣的內部預測模式，根據其中之每一者，藉由以下操作預測一區塊內部：自鄰近該區塊內部之參考樣本導出一樣本值向量；計算該樣本值向量與相關聯於各別基於矩陣的內部預測模式的一預測矩陣之間的一矩陣向量乘積以便獲得一預測向量；以及基於該預測向量預測該區塊內部中之樣本。另外，該基於區塊之解碼器經組配以藉由使用針對一共置經內部預測第一色彩分量區塊選擇的該基於矩陣的內部預測模式來對該圖像之一預定第二色彩分量區塊進行內部預測而以該等區塊為單位解碼該圖像之一第二色彩分量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Block based decoder configured to partition a picture (10) of more than one color component (10&lt;sub&gt;1&lt;/sub&gt;, 10&lt;sub&gt;2&lt;/sub&gt;) and of a color sampling format, according to which each color component (10&lt;sub&gt;1&lt;/sub&gt;, 10&lt;sub&gt;2&lt;/sub&gt;) is equally sampled, into blocks using a partitioning scheme according to which the picture (10) is equally partitioned with respect to each color component (10&lt;sub&gt;1&lt;/sub&gt;, 10&lt;sub&gt;2&lt;/sub&gt;). Additionally, the block based decoder is configured to decode a first color component (10&lt;sub&gt;1&lt;/sub&gt;) of the picture (10) in units of the blocks with selecting, for each of intra-predicted first color component blocks (18'&lt;sub&gt;11&lt;/sub&gt;-18'&lt;sub&gt;1n&lt;/sub&gt;) of the picture (10), one out of a first set (508) of intra-prediction modes. The first set (508) comprises matrix-based intra prediction modes (510&lt;sub&gt;1&lt;/sub&gt; to 510&lt;sub&gt;m&lt;/sub&gt;) according to each of which a block inner (18) is predicted by deriving a sample value vector (514) out of references samples (17), neighboring the block inner (18), computing a matrix-vector product (512) between the sample value vector (514) and a prediction matrix (516) associated with the respective matrix-based intra prediction mode (510&lt;sub&gt;1&lt;/sub&gt; to 510&lt;sub&gt;m&lt;/sub&gt;) so as to obtain a prediction vector (518), and predicting samples in the block inner (18) on the basis of the prediction vector (518). Additionally, the block based decoder is configured to decode a second color component (10&lt;sub&gt;2&lt;/sub&gt;) of the picture (10) in units of the blocks by intra-predicting a predetermined second color component block (18&lt;sub&gt;2&lt;/sub&gt;) of the picture using the matrix-based intra prediction mode selected for a co-located intra-predicted first color component block (18&lt;sub&gt;1&lt;/sub&gt;).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:圖像</p>  
        <p type="p">10&lt;sub&gt;1&lt;/sub&gt;:第一色彩分量</p>  
        <p type="p">10&lt;sub&gt;2&lt;/sub&gt;:第二色彩分量</p>  
        <p type="p">11:色彩取樣格式</p>  
        <p type="p">11':分割方案</p>  
        <p type="p">17,17a,17c,18:區塊</p>  
        <p type="p">18&lt;sub&gt;1&lt;/sub&gt;,18&lt;sub&gt;2&lt;/sub&gt;,18'&lt;sub&gt;11&lt;/sub&gt;,18'&lt;sub&gt;12&lt;/sub&gt;,18'&lt;sub&gt;15&lt;/sub&gt;,18'&lt;sub&gt;1n&lt;/sub&gt;:第一色彩分量區塊</p>  
        <p type="p">18'&lt;sub&gt;21&lt;/sub&gt;,18'&lt;sub&gt;22&lt;/sub&gt;,18'&lt;sub&gt;25&lt;/sub&gt;,18'&lt;sub&gt;2n&lt;/sub&gt;:第二色彩分量區塊</p>  
        <p type="p">500&lt;sub&gt;1&lt;/sub&gt;:定向模式</p>  
        <p type="p">502:預定方向</p>  
        <p type="p">506:DC內部預測模式</p>  
        <p type="p">508:第一集合</p>  
        <p type="p">510&lt;sub&gt;1&lt;/sub&gt;,510&lt;sub&gt;m&lt;/sub&gt;:內部預測模式</p>  
        <p type="p">512:矩陣向量乘積</p>  
        <p type="p">514:樣本值向量</p>  
        <p type="p">516:預測矩陣</p>  
        <p type="p">518:預測向量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2357" publication-number="202626285"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626285.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訂書機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B25C5/10</main-classification>  
        <further-classification edition="200601120260331B">B25C5/15</further-classification>  
        <further-classification edition="200601120260331B">B25C7/00</further-classification>  
        <further-classification edition="200601120260331B">B27F7/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美克司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAX CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀田太志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEDA, FUTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本一弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">訂書機(1)係，包括將針打出的針打出部(2)，被設於與針打出部(2)相向的位置、將藉由針打出部(2)被打出的針的一對的針腳部彎曲的裝訂部(3)，使針打出部(2)與裝訂部(3)朝相對接近的方向以及遠離的方向移動、執行藉由針之裝訂對象物的裝訂動作的驅動部(4)，以及將針打出部(2)與裝訂部(3)朝相對接近的方向偏壓的拉伸彈簧(47)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:訂書機</p>  
        <p type="p">2:針打出部</p>  
        <p type="p">3:裝訂部</p>  
        <p type="p">20:第一相向部</p>  
        <p type="p">21:第一凸部</p>  
        <p type="p">30:第二相向部</p>  
        <p type="p">31:第二凸部</p>  
        <p type="p">32:緊鉗</p>  
        <p type="p">40:第一連結件</p>  
        <p type="p">40a:支點軸</p>  
        <p type="p">41:第二連結件</p>  
        <p type="p">42:驅動軸</p>  
        <p type="p">43:馬達</p>  
        <p type="p">44:凸輪</p>  
        <p type="p">44a:限制面</p>  
        <p type="p">44b:限制釋放面</p>  
        <p type="p">44c:旋轉軸</p>  
        <p type="p">45:傳動機構</p>  
        <p type="p">46:凸輪從動件</p>  
        <p type="p">47:拉伸彈簧</p>  
        <p type="p">110:連接軸</p>  
        <p type="p">120:插入部</p>  
        <p type="p">C:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2358" publication-number="202626286"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626286.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訂書機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B25C5/10</main-classification>  
        <further-classification edition="200601120260331B">B25C5/15</further-classification>  
        <further-classification edition="200601120260331B">B25C7/00</further-classification>  
        <further-classification edition="200601120260331B">B27F7/36</further-classification>  
        <further-classification edition="200601120260331B">B27F7/38</further-classification>  
        <further-classification edition="200601120260331B">B27F7/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美克司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAX CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本一弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">訂書機(1A)係包括本體部(111)以及偵測部(100)。本體部(111)具有裝訂對象物所插入的插入部(120)，並且具有執行已被插入於插入部(120)的裝訂對象物之裝訂動作的驅動部(4)。偵測部(111)藉由裝訂對象物的偵測而使驅動部(4)運作，並且對於本體部(111)可拆裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:訂書機</p>  
        <p type="p">2:針打出部</p>  
        <p type="p">3:裝訂部</p>  
        <p type="p">4:驅動部</p>  
        <p type="p">5:針進給部</p>  
        <p type="p">6:成型板</p>  
        <p type="p">7:驅動板</p>  
        <p type="p">8:打出通道</p>  
        <p type="p">10:針</p>  
        <p type="p">10af:成型完畢針</p>  
        <p type="p">10bf:未成型針</p>  
        <p type="p">10re:針腳部</p>  
        <p type="p">11:連結針</p>  
        <p type="p">12:針盒</p>  
        <p type="p">20:第一相向部</p>  
        <p type="p">21:第一凸部</p>  
        <p type="p">23:針通道</p>  
        <p type="p">30:第二相向部</p>  
        <p type="p">31:第二凸部</p>  
        <p type="p">32:緊鉗</p>  
        <p type="p">42:驅動軸</p>  
        <p type="p">43:馬達</p>  
        <p type="p">50:第一卡止部</p>  
        <p type="p">51:第一支撐軸</p>  
        <p type="p">52:第一卡止偏壓部</p>  
        <p type="p">53:第一進給偏壓部</p>  
        <p type="p">61:第一驅動孔部</p>  
        <p type="p">71:第二驅動孔部</p>  
        <p type="p">100:偵測部</p>  
        <p type="p">100a:框部</p>  
        <p type="p">101:開關部</p>  
        <p type="p">102:運作部</p>  
        <p type="p">103:運作軸</p>  
        <p type="p">104:偏壓構件</p>  
        <p type="p">105:支撐部</p>  
        <p type="p">105a:螺絲</p>  
        <p type="p">107:位置調整部</p>  
        <p type="p">107a:長孔部</p>  
        <p type="p">107b:位置固定部</p>  
        <p type="p">110:連接軸</p>  
        <p type="p">111:本體部</p>  
        <p type="p">120:插入部</p>  
        <p type="p">121:入口</p>  
        <p type="p">130:壁部</p>  
        <p type="p">140:基板</p>  
        <p type="p">P100:偵測位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2359" publication-number="202626287"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626287.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訂書機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B25C5/10</main-classification>  
        <further-classification edition="200601120260331B">B25C5/15</further-classification>  
        <further-classification edition="200601120260331B">B25C7/00</further-classification>  
        <further-classification edition="200601120260331B">B27F7/36</further-classification>  
        <further-classification edition="200601120260331B">B27F7/38</further-classification>  
        <further-classification edition="200601120260331B">B27F7/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美克司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAX CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本一弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">訂書機(1A)係，包括藉由裝訂對象物的偵測而使驅動部(4)運作的偵測部(100)。針打出部(2)與裝訂部(3)係，沿著針(10)的打出方向而相向，且在針打出部(2)與裝訂部(3)之間，形成有裝訂對象物的插入部(120)。偵測部(100)係，在比插入部(120)的入口(121)更外側，設有裝訂對象物的偵測位置(P100)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:訂書機</p>  
        <p type="p">2:針打出部</p>  
        <p type="p">3:裝訂部</p>  
        <p type="p">4:驅動部</p>  
        <p type="p">5:針進給部</p>  
        <p type="p">6:成型板</p>  
        <p type="p">7:驅動板</p>  
        <p type="p">8:打出通道</p>  
        <p type="p">10:針</p>  
        <p type="p">10af:成型完畢針</p>  
        <p type="p">10bf:未成型針</p>  
        <p type="p">10re:針腳部</p>  
        <p type="p">11:連結針</p>  
        <p type="p">12:針盒</p>  
        <p type="p">20:第一相向部</p>  
        <p type="p">21:第一凸部</p>  
        <p type="p">23:針通道</p>  
        <p type="p">30:第二相向部</p>  
        <p type="p">31:第二凸部</p>  
        <p type="p">32:緊鉗</p>  
        <p type="p">42:驅動軸</p>  
        <p type="p">43:馬達</p>  
        <p type="p">50:第一卡止部</p>  
        <p type="p">51:第一支撐軸</p>  
        <p type="p">52:第一卡止偏壓部</p>  
        <p type="p">53:第一進給偏壓部</p>  
        <p type="p">61:第一驅動孔部</p>  
        <p type="p">71:第二驅動孔部</p>  
        <p type="p">100:偵測部</p>  
        <p type="p">101:開關部</p>  
        <p type="p">102:運作部</p>  
        <p type="p">103:運作軸</p>  
        <p type="p">110:連接軸</p>  
        <p type="p">120:插入部</p>  
        <p type="p">121:入口</p>  
        <p type="p">140:基板</p>  
        <p type="p">P100:偵測位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2360" publication-number="202626288"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626288.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訂書機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B25C5/10</main-classification>  
        <further-classification edition="200601120260331B">B25C5/15</further-classification>  
        <further-classification edition="200601120260331B">B25C7/00</further-classification>  
        <further-classification edition="200601120260331B">B27F7/21</further-classification>  
        <further-classification edition="200601120260331B">B27F7/38</further-classification>  
        <further-classification edition="200601120260331B">B42B4/00</further-classification>  
        <further-classification edition="200601120260331B">B42C19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美克司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAX CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本一弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">訂書機(1)係包括打出通道(8)以及推抵部(9)。打出通道(8)係，被設於朝從針打出部(2)朝向裝訂部(3)的方向突出的第一凸部(21)，朝對於針通道(23)交叉的方向延伸，藉由打出成型完畢針(10af)的驅動板(7)以及藉由驅動板(7)而被打出的成型完畢針(10af)所通過。推抵部(9)係，將藉由驅動板(7)被打出的成型完畢針(10af)所分離的連結針(11)，推抵於通過打出通道(8)的驅動板(7)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:訂書機</p>  
        <p type="p">2:針打出部</p>  
        <p type="p">3:裝訂部</p>  
        <p type="p">4:驅動部</p>  
        <p type="p">5:針進給部</p>  
        <p type="p">6:成型板</p>  
        <p type="p">7:驅動板</p>  
        <p type="p">8:打出通道</p>  
        <p type="p">9:推抵部</p>  
        <p type="p">10:針</p>  
        <p type="p">10af:成型完畢針</p>  
        <p type="p">10bf:未成型針</p>  
        <p type="p">10re:針腳部</p>  
        <p type="p">11:連結針</p>  
        <p type="p">12:針盒</p>  
        <p type="p">20:第一相向部</p>  
        <p type="p">21:第一凸部</p>  
        <p type="p">23:針通道</p>  
        <p type="p">30:第二相向部</p>  
        <p type="p">31:第二凸部</p>  
        <p type="p">32:緊鉗</p>  
        <p type="p">42:驅動軸</p>  
        <p type="p">43:馬達</p>  
        <p type="p">50:第一卡止部</p>  
        <p type="p">51:第一支撐軸</p>  
        <p type="p">52:第一卡止偏壓部</p>  
        <p type="p">53:第一進給偏壓部</p>  
        <p type="p">61:第一驅動孔部</p>  
        <p type="p">72:第二驅動孔部</p>  
        <p type="p">90:第二卡止部</p>  
        <p type="p">91:第二支撐軸</p>  
        <p type="p">92:第二卡止偏壓部</p>  
        <p type="p">93:第二進給偏壓部</p>  
        <p type="p">94:被作用部</p>  
        <p type="p">110:連接軸</p>  
        <p type="p">120:插入部</p>  
        <p type="p">130:壁部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2361" publication-number="202627563"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627563.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學元件的總厚度或局部厚度變化</chinese-title>  
        <english-title>TOTAL OR LOCAL THICKNESS VARIATION FOR OPTICAL DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G02B6/124</main-classification>  
        <further-classification edition="200601120260316B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱英東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, YINGDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚正平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, ZHENGPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張代化</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DAIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽爾　大衛亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SELL, DAVID ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊菁怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JINGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧曉培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, XIAOPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅瑟　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MESSER, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴爾嘉瓦　薩馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHARGAVA, SAMARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍拉尼　拉米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOURANI, RAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高德　路迪維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODET, LUDOVIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案的實施例一般係關於用於形成波導的方法。方法可包括以下步驟：測量一波導基板，該波導具有一基板厚度分佈；及將折射率匹配層沉積在波導的表面上，該折射率匹配層具有設置在該波導基板上的一第一表面和與該第一表面相對的一第二表面，其中該折射率匹配層僅設置在該波導基板的一部分上方，及該折射率匹配層的一第二表面的一裝置斜率與該波導的該第一表面的該波導斜率實質相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:波導</p>  
        <p type="p">106:折射率匹配層</p>  
        <p type="p">200:基板</p>  
        <p type="p">202:第一目標厚度分佈</p>  
        <p type="p">204:第二目標厚度分佈</p>  
        <p type="p">206:基底基板</p>  
        <p type="p">212:頂表面</p>  
        <p type="p">213:底表面</p>  
        <p type="p">214:非活性區域</p>  
        <p type="p">217:頂表面</p>  
        <p type="p">218:光柵結構</p>  
        <p type="p">220:非活性厚度分佈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2362" publication-number="202627719"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627719.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用基板測量的腔室部件條件估計的方法、基板處理系統及電腦可讀取媒體</chinese-title>  
        <english-title>METHOD, SUBSTRATE PROCESSING SYSTEM AND COMPUTER READABLE MEDIUM OF ESTIMATION OF CHAMBER COMPONENT CONDITIONS USING SUBSTRATE MEASUREMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G05B19/418</main-classification>  
        <further-classification edition="200601120260325B">G05B23/00</further-classification>  
        <further-classification edition="202601120260325B">H10P72/00</further-classification>  
        <further-classification edition="202601120260325B">H10P74/00</further-classification>  
        <further-classification edition="201901120260325B">G06N20/00</further-classification>  
        <further-classification edition="201701120260325B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　純磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHUNLEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祝昭釗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZHAOZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫特尼　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUTNEY, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：根據一配方來處理一處理腔室中的一基板，其中該基板在該處理之後包括一膜或一特徵之其中至少一者。該方法進一步包括以下步驟：產生第一基板的剖面圖。該方法進一步包括以下步驟：使用一第一模型來處理來自該剖面圖的資料，其中該第一模型輸出以下至少一者：用於該處理腔室的一基板支撐件的一估計的檯面條件、該基板支撐件的一估計的升降銷位置條件、該基板支撐件的一估計的密封帶條件、或用於該處理腔室的用於一處理套件環的一估計的處理套件環條件。該方法進一步包括以下步驟：輸出一通知以作為該處理的一結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes processing a substrate in a process chamber according to a recipe, wherein the substrate comprises at least one of a film or a feature after the processing. The method further includes generating a profile map of the first substrate. The method further includes processing data from the profile map using a first model, wherein the first model outputs at least one of an estimated mesa condition of a substrate support for the process chamber, an estimated lift pin location condition of the substrate support an estimated seal band condition of the substrate support, or an estimated process kit ring condition for a process kit ring for the process chamber. The method further includes outputting a notice as a result of the processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">330:腔室部件條件引擎</p>  
        <p type="p">405:模型訓練工作流程</p>  
        <p type="p">412:剖面圖</p>  
        <p type="p">417:模型應用工作流程</p>  
        <p type="p">436:訓練資料集</p>  
        <p type="p">438:訓練的機器學習模型</p>  
        <p type="p">445:模型儲存</p>  
        <p type="p">462:輸入資料</p>  
        <p type="p">467:腔室部件條件決定器</p>  
        <p type="p">469:腔室部件條件</p>  
        <p type="p">470:動作</p>  
        <p type="p">472:動作決定器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2363" publication-number="202626347"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626347.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層薄膜、積層薄膜之製造方法及光學積層體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">B32B7/12</main-classification>  
        <further-classification edition="201901120260316B">B32B7/06</further-classification>  
        <further-classification edition="200601120260316B">B32B27/00</further-classification>  
        <further-classification edition="201501120260316B">G02B1/10</further-classification>  
        <further-classification edition="201801120260316B">C09J7/40</further-classification>  
        <further-classification edition="202301120260316B">H10K59/10</further-classification>  
        <further-classification edition="202301120260316B">H10K50/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有賀草平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARUGA, SOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題在於提供：可抑制在影像顯示裝置中產生微小缺陷之積層薄膜、可順利製造該積層薄膜之積層薄膜之製造方法、及包含該積層薄膜之光學積層體之製造方法。&lt;br/&gt; 作為其解決手段，本發明實施形態之積層薄膜依序具備有基材層、液晶化合物之定向固化層、黏著劑層及剝離襯材。該剝離襯材係貼附於該黏著劑層之厚度方向的表面上。該剝離襯材可從該黏著劑層剝離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材層</p>  
        <p type="p">2:液晶化合物之定向固化層(第1液晶定向固化層)</p>  
        <p type="p">3:黏著劑層</p>  
        <p type="p">3a:第1面</p>  
        <p type="p">3b:第2面</p>  
        <p type="p">4:剝離襯材</p>  
        <p type="p">100:積層薄膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2364" publication-number="202625918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142386</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>衣服</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A41D13/002</main-classification>  
        <further-classification edition="200601120260331B">A41D13/005</further-classification>  
        <further-classification edition="200601120260331B">A41D27/28</further-classification>  
        <further-classification edition="200601120260331B">F04B39/00</further-classification>  
        <further-classification edition="200601120260331B">F04B39/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商海德設計股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDESIGN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商李瑠多貿易有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIBERTA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉井秀雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHII, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明具備設置有開口部(8)之衣服本體(2)、及覆蓋開口部(8)之罩蓋構件(10)，罩蓋構件(10)為具有頂點部(11)、從頂點部(11)延伸之一對側邊部(12a、12b)、與連結一對側邊部(12a、12b)的端部間之底邊部(13)的大致扇形或大致三角形，其中一邊的側邊部(12a)是固定於衣服本體(2)，另一邊的側邊部(12b)是可裝卸且固接位置為可變地固接於衣服本體(2)。可藉由改變另一邊的側邊部(12b)的固接位置，將罩蓋構件(10)可變地設成平坦的狀態、與在前述底邊部(13)與前述衣服本體(2)之間確保間隙之狀態。藉此，可以將設置有開口部(8)之衣服的功能性提高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:罩蓋構件</p>  
        <p type="p">11:頂點部</p>  
        <p type="p">12a,12b:側邊部</p>  
        <p type="p">13:底邊部</p>  
        <p type="p">14:線</p>  
        <p type="p">15:帶狀部</p>  
        <p type="p">16,17:魔鬼氈</p>  
        <p type="p">17a,17b:邊</p>  
        <p type="p">17c:直線邊</p>  
        <p type="p">17d:斜邊</p>  
        <p type="p">7:電動風扇</p>  
        <p type="p">9:虛線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2365" publication-number="202628783"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628783.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於量子計算系統的電子訊號感測裝置和方法</chinese-title>  
        <english-title>ELECTRONIC SIGNAL SENSING APPARATUS AND METHOD FOR QUANTUM COMPUTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260327B">H10N60/30</main-classification>  
        <further-classification edition="200601120260327B">G01R19/165</further-classification>  
        <further-classification edition="202201120260327B">G06N10/40</further-classification>  
        <further-classification edition="201101120260327B">B82Y10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商量子運動科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTUM MOTION TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡薩雷斯　札爾巴　米格爾　費爾南多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONZALEZ ZALBA, MIGUEL FERNANDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮　霍斯蒂格　菲力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VON HORSTIG, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一量子計算系統之電子訊號感測裝置，該裝置經組態以自該量子計算系統之一電子量測器件接收一電流訊號。該裝置包括：一超導體材料樣本，其經組態使得該所接收電流訊號通過該超導體材料樣本；一電流源，其經組態以使一基電流通過該超導體材料樣本，其中該基電流小於該超導體材料樣本之一臨界電流；以及一感測器，其經組態以偵測該超導體材料樣本自一第一狀態至一第二狀態之一相轉變，該第一狀態係一超導狀態，該第二狀態係在穿過該超導體材料樣本之總電流自低於該臨界電流增加至高於該臨界電流時發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic signal sensing apparatus for a quantum computing system, the apparatus being configured to receive a current signal from an electronic measurement device of the quantum computing system. The apparatus comprises a superconductor material sample configured such that the received current signal passes through the superconductor material sample; a current source configured to pass a base current through the superconductor material sample, wherein the base current is less than a critical current of the superconductor material sample; and a sensor configured to detect a phase transition of the superconductor material sample from a first state, which is a superconducting state, to a second state that occurs when the total current through the superconductor material sample increases from below the critical current to above the critical current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:單電子電晶體(SET)</p>  
        <p type="p">302:電子訊號感測裝置</p>  
        <p type="p">303:超導體材料樣本/樣本</p>  
        <p type="p">303i:第一端</p>  
        <p type="p">303ii:第二端</p>  
        <p type="p">305:接地電容器/電容器</p>  
        <p type="p">307a:第一電感器</p>  
        <p type="p">307b:第二電感器</p>  
        <p type="p">309:探針</p>  
        <p type="p">309c:耦合電容器</p>  
        <p type="p">311:電流源</p>  
        <p type="p">313:觸點</p>  
        <p type="p">315:集電器</p>  
        <p type="p">C&lt;sub&gt;filter&lt;/sub&gt;:電容</p>  
        <p type="p">I&lt;sub&gt;bias&lt;/sub&gt;:基電流</p>  
        <p type="p">I&lt;sub&gt;SET&lt;/sub&gt;:電流/電流訊號</p>  
        <p type="p">L&lt;sub&gt;bias&lt;/sub&gt;:電感</p>  
        <p type="p">L&lt;sub&gt;res&lt;/sub&gt;:電感</p>  
        <p type="p">V&lt;sub&gt;G&lt;/sub&gt;:閘極電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2366" publication-number="202628061"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628061.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動電光顯示器的方法</chinese-title>  
        <english-title>METHODS FOR DRIVING ELECTRO-OPTIC DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G09G3/34</main-classification>  
        <further-classification edition="201401120260401B">H04N19/182</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商電子墨水股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　德平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIM, TECK PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　賈亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, JAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班度夫　余弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEN-DOV, YUVAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供驅動電光顯示器(特別是電泳顯示器)的方法及裝置，以實現動畫及視訊應用中的快速影像傳送。這些方法藉由在傳送之前將8位元像素資料格式(Y8)重映射至縮減位元格式(Y1或Y2)來解決傳送瓶頸的技術問題，從而顯著地減少資料大小及傳送時間。方法亦描述將像素資料組織成資料封包的多種格式。這樣的重映射資料可以在顯示控制器中被擴展回到Y8格式，以便進行後續處理及顯示。因為資料在傳輸之前被減少，系統能夠在高解析度電泳顯示器上高效率地播放動畫及視訊，從而確保流暢的順序內容更新，而不會使可用的資料鏈路過載。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses are provided for driving electro-optic displays, particularly electrophoretic displays, to enable rapid image transfer for animation and video applications. These methods address the technical problem of transfer bottlenecks by remapping 8-bit pixel data (Y8) to reduced-bit formats (Y1 or Y2) prior to transfer, thereby significantly reducing data size and transfer time. The method also describes multiple formats for organizing the pixel data into data packets. Such remapped data may be expanded back to Y8 format within the display controller for subsequent processing and presentation. Because the data is reduced before transmission, the system enables efficient animation and video playback on high-resolution electrophoretic displays, ensuring smooth sequential content updates without overwhelming the available data links.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2367" publication-number="202627664"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627664.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>曝光遮罩之設計方法及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260327B">G03F1/70</main-classification>  
        <further-classification edition="201201120260327B">G03F1/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPIDUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永井聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種曝光遮罩之設計方法，其具有：取得配線層和與上述配線層鄰接的導通孔層的裝置圖案的工程；將上述配線層所具有的複數配線圖案分配成複數個的工程；以及作成由上述分配後的各配線圖案與上述導通孔層所具有的導通孔圖案的聯集所組成的複數遮罩佈局的工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2368" publication-number="202627119"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627119.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅材料及絕緣基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C22C9/00</main-classification>  
        <further-classification edition="200601120260330B">H01B1/02</further-classification>  
        <further-classification edition="200601120260330B">C22F1/00</further-classification>  
        <further-classification edition="200601120260330B">C22F1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村透</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧一誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKI, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤優樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">Cu的含量為99.9mass%以上、99.999mass%以下的範圍內，合計含有2massppm以上、20massppm以下之選自Al、Be、Cd、Mg、Pb、Ni、P、Sn、Cr、Si、Ti、Zr、Hf、Mn、Fe、Ag、Zn、In、Ga、Ge、Sb中1種或2種以上的A群元素，導電率為95%IACS以上，且在與板厚方向正交的面中，各結晶方位的面積比例S(110)，S(311)，S(331)，S(210)，S(321)，S(211)滿足S(110)+S(311)+ S(331)+S(210)+S(211)＞S(321)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2369" publication-number="202626588"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626588.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新的硬化劑及其製備方法</chinese-title>  
        <english-title>A NEW CURING AGENT AND A PREPARING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C69/76</main-classification>  
        <further-classification edition="200601120260401B">C07C231/02</further-classification>  
        <further-classification edition="200601120260401B">C07C233/75</further-classification>  
        <further-classification edition="200601120260401B">C08G59/40</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國生產技術硏究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全賢愛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, HYUN AEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金閏柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YUN JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴淑延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SOOK YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種新穎硬化劑，其包含萘基酯基團、N-芳族醯胺基團、及芳族羥基基團，其表現出優異的低介電損失特性(低Df)、除膠渣性能、銅箔黏著及溶液穩定性特性；一種製備該硬化劑之方法；一種包含該硬化劑之環氧組成物；一種硬化產物；及一種物品。本揭露之硬化劑不僅表現出優異的溶液穩定性，而且藉由包含本揭露之硬化劑及環氧樹脂的環氧組成物達成優異的低介電損失特性、除膠渣性能、及與銅箔之黏著。因此，由於改善的特性，包含本揭露之硬化劑的環氧組成物係適用於用為絕緣膜、用於封裝半導體之環氧膜、黏著劑膜、增層膜、基底膜、環氧模製材料、底部填充材料或類似者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a novel curing agent comprising a naphthyl ester group, an N-aromatic amide group, and an aromatic hydroxyl group, which exhibits an excellent low dielectric loss property (low Df), a desmear performance, a copper foil adhesion, and a solution stability property; a method for preparing the same; an epoxy composition comprising the same; a cured product; and an article. The curing agent of the present disclosure not only exhibits excellent solution stability, but also achieves an excellent low dielectric loss property, a desmear performance, and an adhesion to copper foil by an epoxy composition comprising a curing agent of the present disclosure and an epoxy resin. Therefore, due to the improved property, the epoxy composition comprising the curing agent of the present disclosure is suitable for use as an insulating film, an epoxy film for packaging a semiconductor, an adhesive film, a build-up film, a substrate film, an epoxy molding material, an underfill material, or the like.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2370" publication-number="202628105"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628105.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於混合匹配的節能向量相似度搜尋系統及其方法</chinese-title>  
        <english-title>ENERGY-EFFICIENT VECTOR SIMILARITY SEARCH SYSTEM BASED ON HYBRID MATCHING AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G11C16/04</main-classification>  
        <further-classification edition="200601120260327B">G11C16/26</further-classification>  
        <further-classification edition="200601120260327B">G11C16/34</further-classification>  
        <further-classification edition="202301120260327B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中央研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACADEMIA SINICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃其澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江浩瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HAO WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳安宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, AN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭湘筠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HSIANG YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡芝瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHIH YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於混合匹配的節能向量相似度搜尋系統及其方法，透過在快閃記憶體陣列的記憶體串列中結合精確搜尋模式與近似搜尋模式，於記憶體串列的第一部分執行精確搜尋以過濾不相關的記憶體串列並降低功耗，於通過過濾的記憶體串列的第二部分執行近似搜尋以量測向量相似度，並根據導通電流大小選擇符合查詢向量的記憶體串列，進而大幅減少冗餘搜尋，用以達成提高向量相似度搜尋的能源效率之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy-efficient vector similarity search (VSS) system based on hybrid matching and method thereof are disclosed. By combining an exact-search (ES) mode and an approximate-search (AS) mode within memory strings of a flash memory array, the ES mode is performed in a first portion of each memory string to filter out irrelevant memory strings and reduce power consumption, while the AS mode is performed in a second portion of the filtered memory strings to measure vector similarity, and memory strings matching a query vector are selected based on the magnitude of conduction current, thereby significantly reducing redundant searches. The mechanism helps to improve the energy efficiency of VSS.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:快閃記憶體陣列</p>  
        <p type="p">120:位元線驅動器電路</p>  
        <p type="p">130:字元線驅動器電路</p>  
        <p type="p">140:感測放大器電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2371" publication-number="202628087"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628087.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142450</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G11C7/18</main-classification>  
        <further-classification edition="200601120260316B">G11C11/54</further-classification>  
        <further-classification edition="200601120260316B">G06G7/60</further-classification>  
        <further-classification edition="202301120260316B">G06N3/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村肇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒川義元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKAWA, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠以低功耗進行積和運算的半導體裝置。本發明是一種包括第一、第二電路的半導體裝置，第一電路包括第一保持部、第一電晶體，第二電路包括第二保持部、第二電晶體。第一、第二電路的每一個與第一、第二輸入佈線及第一、第二佈線電連接。第一保持部具有保持在第一電晶體中流過的第一電流的功能，第二保持部具有保持在第二電晶體中流過的第二電流的功能。第一、第二電流根據第一資料決定。藉由對第一、第二輸入佈線輸入對應於第二資料的電位，第一電路對第一佈線和第二佈線中的一個輸出電流，第二電路對第一佈線和第二佈線中的另一個輸出電流。第一、第二電路對第一佈線或第二佈線輸出的電流的量根據第一資料及第二資料決定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">OL:佈線</p>  
        <p type="p">OLB:佈線</p>  
        <p type="p">WL:佈線</p>  
        <p type="p">W2L:佈線</p>  
        <p type="p">WX1L:佈線</p>  
        <p type="p">VE:佈線</p>  
        <p type="p">VEr:佈線</p>  
        <p type="p">HC:保持部</p>  
        <p type="p">MP:電路</p>  
        <p type="p">MC:電路</p>  
        <p type="p">M1:電晶體</p>  
        <p type="p">M1r:電晶體</p>  
        <p type="p">M2:電晶體</p>  
        <p type="p">M2r:電晶體</p>  
        <p type="p">M3:電晶體</p>  
        <p type="p">M3r:電晶體</p>  
        <p type="p">M4:電晶體</p>  
        <p type="p">M4r:電晶體</p>  
        <p type="p">C1:電容</p>  
        <p type="p">n1:節點</p>  
        <p type="p">n1r:節點</p>  
        <p type="p">outa:節點</p>  
        <p type="p">outb:節點</p>  
        <p type="p">ina:節點</p>  
        <p type="p">inb:節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2372" publication-number="202627209"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627209.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻組合物</chinese-title>  
        <english-title>ETCHING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23F1/38</main-classification>  
        <further-classification edition="200601120260401B">C23F1/44</further-classification>  
        <further-classification edition="202601120260401B">H10P50/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏德勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, DEYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫啟蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, QIMENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李呂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於蝕刻鎢的水性鹼性組合物，所述組合物包含水、有機溶劑、蝕刻劑、腐蝕抑制劑。其中，所述組合物的pH大於或等於7.50。該組合物可以與銅和電介質具有突出的相容性，更突出的是對TiN也具有良好的相容性，可以在不損害底層膜的情況下蝕刻鎢，蝕刻速率可控，操作條件溫和（在25℃~70℃均可使用），在半導體製造中的蝕刻領域具有廣泛的應用前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an aqueous alkaline composition for tungsten etching, comprising water, an organic solvent, an etchant, and a corrosion inhibitor. The pH of the composition is greater than or equal to 7.50. This composition exhibits excellent compatibility with copper and dielectric materials and particularly demonstrates good compatibility with TiN. It enables tungsten etching without damaging underlying films, with controllable etching rates and mild operating conditions (suitable for use at 25°C–70°C). It has broad application prospects in the field of etching for semiconductor manufacturing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2373" publication-number="202627033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>β型矽鋁氮氧化物螢光體粒子</chinese-title>  
        <english-title>Β-SIALON PHOSPHOR PARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C09K11/59</main-classification>  
        <further-classification edition="200601120260324B">C09K11/64</further-classification>  
        <further-classification edition="200601120260324B">C01B33/26</further-classification>  
        <further-classification edition="202501120260324B">H10H20/822</further-classification>  
        <further-classification edition="201801120260324B">G01N23/2251</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤良祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, RYOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的β型矽鋁氮氧化物螢光體粒子中，藉由濕式雷射繞射粒度分布法測定之粒度分布的累積體積頻率50%的粒徑（D50）為5～150μm並滿足以下條件i。（條件i）藉由掃描型電子顯微鏡（SEM）以50000倍的倍率觀察該β型矽鋁氮氧化物螢光體粒子的表面時，能夠確認到條紋圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A β-SiAlON phosphor particle of the invention has a particle size at 50 percent cumulative volume frequency (D50) in a particle size distribution measured using a wet dispersion laser diffraction particle size distribution method of 5 to 150 µm, and satisfies a condition i described below: (Condition i) a striped pattern can be identified when the surface of the β-SiAlON phosphor particle is observed at 50,000× magnification using a scanning electron microscope (SEM).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2374" publication-number="202627298"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627298.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液化氣體用之往復泵浦裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">F04B15/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦孝之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋裕樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠谷哲司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASATANI, TETSUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於將液態氫、液化天然氣、液化氨、液態氮、液化乙烯氣、液化石油氣等液化氣體升壓之往復泵浦裝置者。液化氣體用之往復泵浦裝置具備：汽缸（1）；配置於汽缸（1）中之活塞（2）；與活塞（2）連結之泵軸（41）；固定於泵軸（41）之滾珠螺帽（42）；與滾珠螺帽（42）螺合之螺旋軸（45）；及與螺旋軸（45）連結，並使螺旋軸（45）旋轉之電動機（48）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:汽缸</p>  
        <p type="p">1a:外周面</p>  
        <p type="p">1b:吸入側端面</p>  
        <p type="p">1c:凸緣</p>  
        <p type="p">2:活塞</p>  
        <p type="p">3:密封環</p>  
        <p type="p">6:液體入口</p>  
        <p type="p">7:吸入逆止閥</p>  
        <p type="p">9:汽缸護罩</p>  
        <p type="p">12:液體室</p>  
        <p type="p">15:入口端壁</p>  
        <p type="p">16:分隔壁</p>  
        <p type="p">20:吸入口</p>  
        <p type="p">22:泵浦機箱</p>  
        <p type="p">25:真空隔熱層</p>  
        <p type="p">30:吐出流路</p>  
        <p type="p">31:吐出埠</p>  
        <p type="p">33:吐出逆止閥</p>  
        <p type="p">35:氣體洩漏孔</p>  
        <p type="p">42:滾珠螺帽</p>  
        <p type="p">45:螺旋軸</p>  
        <p type="p">48:電動機</p>  
        <p type="p">49:馬達驅動器</p>  
        <p type="p">51:滾珠</p>  
        <p type="p">53:導軌</p>  
        <p type="p">55:溝</p>  
        <p type="p">60:洩漏回收孔</p>  
        <p type="p">41:泵軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2375" publication-number="202627180"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627180.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多個圖案化輻射吸收成分及/或垂直組成梯度的光阻</chinese-title>  
        <english-title>PHOTORESIST WITH MULTIPLE PATTERNING RADIATION-ABSORBING ELEMENTS AND/OR VERTICAL COMPOSITION GRADIENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C23C16/455</main-classification>  
        <further-classification edition="200601120260318B">C23C16/56</further-classification>  
        <further-classification edition="200601120260318B">B05D1/00</further-classification>  
        <further-classification edition="200601120260318B">G03F7/00</further-classification>  
        <further-classification edition="200601120260318B">G03F7/004</further-classification>  
        <further-classification edition="200601120260318B">G03F7/16</further-classification>  
        <further-classification edition="200601120260318B">G03F7/20</further-classification>  
        <further-classification edition="200601120260318B">G03F7/36</further-classification>  
        <further-classification edition="202601120260318B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏德曼　蒂莫西　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEIDMAN, TIMOTHY WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古　凱文　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, KEVIN LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納迪　凱蒂　林恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARDI, KATIE LYNN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳呈昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENGHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛洛斯基　博里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLOSSKIY, BORIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢森　艾瑞克　卡爾文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSEN, ERIC CALVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文之各種實施例涉及用於在基板上沉積光阻材料之技術。例如，該等技術可涉及在一反應腔室中提供該基板；將第一及第二反應物提供至該反應腔室，其中該第一反應物為具有M1&lt;sub&gt;a&lt;/sub&gt;R1&lt;sub&gt;b&lt;/sub&gt;L1&lt;sub&gt;c&lt;/sub&gt;之化學式的有機金屬前驅物，其中：M1為具有高圖案化輻射吸收截面的金屬，R1為一有機基團，其可在該第一反應物與該第二反應物之間的該反應後存留，且可在暴露於圖案化輻射下從M1斷裂，L1為與該第二反應物反應的配位基、離子、或其他部分，a ≥ 1，b ≥ 1，且c ≥ 1，且其中滿足以下條件之其中至少一者：該光阻材料包含二或更多高圖案化輻射吸收元素、及/或該光阻材料包含沿著該光阻材料之厚度的組成梯度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments herein relate to techniques for depositing photoresist material on a substrate. For example, the techniques may involve providing the substrate in a reaction chamber; providing a first and second reactant to the reaction chamber, where the first reactant is an organo-metallic precursor having a formula of M1&lt;sub&gt;a&lt;/sub&gt;R1&lt;sub&gt;b&lt;/sub&gt;L1&lt;sub&gt;c&lt;/sub&gt;, where: M1 is a metal having a high patterning radiation-absorption cross-section, R1 is an organic group that survives the reaction between the first reactant and the second reactant and is cleavable from M1 under exposure to patterning radiation, L1 is a ligand, ion, or other moiety that reacts with the second reactant, a ≥ 1, b ≥ 1, and c ≥ 1, and where at least one of the following conditions is satisfied: the photoresist material comprises two or more high-patterning radiation absorbing elements, and/or the photoresist material comprises a composition gradient along a thickness of the photoresist material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:處理站</p>  
        <p type="p">301a:反應物輸送系統</p>  
        <p type="p">302:處理腔室本體</p>  
        <p type="p">303:汽化點</p>  
        <p type="p">304:混合容器</p>  
        <p type="p">306:噴淋頭</p>  
        <p type="p">308:底座</p>  
        <p type="p">310:加熱器</p>  
        <p type="p">312:基板</p>  
        <p type="p">314:電源供應器</p>  
        <p type="p">316:匹配網路</p>  
        <p type="p">318:蝶形閥</p>  
        <p type="p">320:混合容器入口閥</p>  
        <p type="p">350:電腦控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2376" publication-number="202628768"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628768.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260119B">H10K59/131</main-classification>  
        <further-classification edition="202301120260119B">H10K59/126</further-classification>  
        <further-classification edition="202301120260119B">H10K59/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金度成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DOSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種顯示裝置。具體提供一種電致發光顯示裝置，包括：基板，包含顯示區域和非顯示區域；複數條第一訊號線，設置於顯示區域中；複數條第二訊號線，設置於顯示區域中，並沿垂直於該複數條第一訊號線的方向延伸；複數個焊墊電極，設置於非顯示區域中；複數條連接線，設置於非顯示區域中，並與該複數個焊墊電極和該複數條第一訊號線電性連接；低電源電壓接觸部，設置於非顯示區域中；以及屏蔽線，設置於該複數條連接線與低電源電壓接觸部之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a display device. An electroluminescent display device is provided which includes a substrate including a display area and a non-display area, a plurality of first signal lines in the display area, a plurality of second signal lines disposed in the display area and extending in a direction perpendicular to the plurality of first signal lines, a plurality of pad electrodes in the non-display area, a plurality of link lines disposed in the non-display area and electrically connected to the plurality of pad electrodes and the plurality of first signal lines, a low power supply voltage contact part in the non-display area, and a shielding line between the plurality of link lines and the low power supply voltage contact part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:第一基板</p>  
        <p type="p">CH1:第一接觸孔</p>  
        <p type="p">CH2a:第2-1接觸孔</p>  
        <p type="p">CH2b:第2-2接觸孔</p>  
        <p type="p">CH3:第三接觸孔</p>  
        <p type="p">CNT:接觸部</p>  
        <p type="p">DA:顯示區域</p>  
        <p type="p">DL1:第一資料線</p>  
        <p type="p">DL2:第二資料線</p>  
        <p type="p">DL3:第三資料線</p>  
        <p type="p">DL4:第四資料線</p>  
        <p type="p">ESL:屏蔽線</p>  
        <p type="p">GL:閘極線</p>  
        <p type="p">LA:連接區域</p>  
        <p type="p">LL:連接線</p>  
        <p type="p">LL1:第一連接線</p>  
        <p type="p">LL1a:第1-1連接線</p>  
        <p type="p">LL1b:第1-2連接線</p>  
        <p type="p">LL1c:第1-3連接線</p>  
        <p type="p">LL1d:第1-4連接線</p>  
        <p type="p">LL2:第二連接線</p>  
        <p type="p">LL3:第三連接線</p>  
        <p type="p">NDAa:第一非顯示區域</p>  
        <p type="p">NDAb:第二非顯示區域</p>  
        <p type="p">P:像素</p>  
        <p type="p">PA:焊墊區域</p>  
        <p type="p">PE:焊墊電極</p>  
        <p type="p">PE1:第一焊墊電極</p>  
        <p type="p">PE2:第二焊墊電極</p>  
        <p type="p">PE3:第三焊墊電極</p>  
        <p type="p">PE4:第四焊墊電極</p>  
        <p type="p">PE5:第五焊墊電極</p>  
        <p type="p">PE1a:第1-1焊墊電極</p>  
        <p type="p">PE1b:第1-2焊墊電極</p>  
        <p type="p">PE1c:第1-3焊墊電極</p>  
        <p type="p">PE1d:第1-4焊墊電極</p>  
        <p type="p">REFL:參考線</p>  
        <p type="p">SL1:第一訊號線</p>  
        <p type="p">SL2:第二訊號線</p>  
        <p type="p">VDDL:高電源電壓線</p>  
        <p type="p">VDDSa:第一高電源電壓短路條</p>  
        <p type="p">VDDSb:第二高電源電壓短路條</p>  
        <p type="p">VSC:低電源電壓接觸部</p>  
        <p type="p">VSL:低電源電壓線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2377" publication-number="202627694"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627694.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於曝光設備之方法及系統</chinese-title>  
        <english-title>A METHOD AND SYSTEM FOR USE IN AN EXPOSURE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G03F7/20</main-classification>  
        <further-classification edition="202601120260330B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙克曼　艾瑞克　賈斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONKMAN, ERIC JUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳哈尼　莎曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAHANI, SAMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>露克司　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROUX, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一曝光設備之方法，該曝光設備包含：至少一個基板支撐件，其經組態以支撐一基板；一圖案化裝置支撐件，其經組態以支撐一圖案化裝置；及成像光學器件，其經配置以在該至少一個基板支撐件安置於一曝光區中時在由該至少一個基板支撐件支撐之一基板上形成由該圖案化裝置支撐件支撐之一圖案化裝置的一影像。該方法包含進行一或多個量測，該一或多個量測指示由該圖案化裝置支撐件支撐之一圖案化裝置的一形狀。在進行該一或多個量測與將該至少一個基板支撐件中之一基板支撐件遠離該曝光區移動及/或將該至少一個基板支撐件中之一基板支撐件朝向該曝光區移動之間存在至少一些時間重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method is disclosed for use in an exposure apparatus comprising: at least one substrate support configured to support a substrate; a patterning device support configured to support a patterning device; and imaging optics arranged to form an image of a patterning device supported by the patterning device support on a substrate supported by the at least one substrate support when disposed in an exposure region. The method comprises making one or more measurements that are indicative of a shape of a patterning device supported by the patterning device support. There is at least some temporal overlap between making the one or more measurements and moving a substrate support of the at least one substrate support away from the exposure region and/or moving a substrate support of the at least one substrate support towards the exposure region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:新方法</p>  
        <p type="p">110:步驟</p>  
        <p type="p">112:步驟</p>  
        <p type="p">120:步驟</p>  
        <p type="p">122:步驟</p>  
        <p type="p">124:步驟/對準量測</p>  
        <p type="p">130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2378" publication-number="202627461"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627461.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定性能參數分佈的方法</chinese-title>  
        <english-title>METHOD OF DETERMINING A PERFORMANCE PARAMETER DISTRIBUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G01N21/956</main-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厄班澤克　亞當　簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URBANCZYK, ADAM JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種判定一性能參數之方法，其包含：判定一基板上之複數個區；判定對應於該複數個區之複數個性能參數估計模型；判定該複數個性能參數估計模型之性能參數估計模型參數；及應用具有經判定模型參數之該複數個性能參數估計模型中之至少一者以判定該複數個區中之對應區的該性能參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method of determining a performance parameter comprising determining a plurality of regions on a substrate; determining a plurality of performance parameter estimation models corresponding to the plurality of regions; determining performance parameter estimation model parameters for the plurality of performance parameter estimation models and applying at least one of the plurality of performance parameter estimation models with the determined model parameters to determine the performance parameter for the corresponding region of the plurality of regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:基板</p>  
        <p type="p">310:第一區/區</p>  
        <p type="p">320:第二區/區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2379" publication-number="202628793"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628793.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於接合半導體基板之方法</chinese-title>  
        <english-title>METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260320B">H10P10/00</main-classification>  
        <further-classification edition="202601120260320B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪祺佩洛　安得列</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKIPELOV, ANDREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史蒂文生　路卡斯　亨利克斯　喬漢斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEVENS, LUCAS HENRICUS JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪能　丹尼爾　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEENEN, DANIEL ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐德斯　史喬德　尼可拉斯　蘭伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONDERS, SJOERD NICOLAAS LAMBERTUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱姆克斯　吉爾特　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEMKERS, GEERT RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃根斯　彼特　喬斯福　瑪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOLTGENS, PIETER JOSEPH MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施托伊爾　麥可　馬里納斯　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEUR, MICHAEL MARINUS ANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比奇曼　阿爾罕　約翰尼斯　安敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEUKMAN, ARJAN JOHANNES ANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡駑戈帕蘭　斯安　帕拉雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENUGOPALAN, SYAM PARAYIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉史帝夫　克拉斯米爾　圖德洛夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRASTEV, KRASSIMIR TODOROV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於結合一第一半導體基板與一第二半導體基板之方法及設備。該方法可包含：將該第一半導體基板朝向一輔助部件進行第一推動以使該第一半導體基板接觸該輔助部件；接著將該第二半導體基板朝向該第一半導體基板及該輔助部件進行第二推動以引起該第一半導體基板與該第二半導體基板之結合，其中該第一推動與該第二推動實質上相同。另外或替代地，該方法可包含：將一輔助部件夾持至一夾具，其中該第一半導體基板緊固至該輔助部件；及將該輔助部件推離該夾具且朝向該第二半導體基板推動以使該第一半導體基板接觸該第二半導體基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods and apparatus for joining a first semiconductor substrate and a second semiconductor substrate. The method may comprise: first pushing the first semiconductor substrate towards an auxiliary member to bring the first semiconductor substrate into contact with the auxiliary member; and then second pushing the second semiconductor substrate towards the first semiconductor substrate and the auxiliary member to cause joining of the first semiconductor substrate and the second semiconductor substrate, wherein the first pushing is substantially the same as the second pushing. Additionally or alternatively, the method may comprise: clamping an auxiliary member to a clamp, wherein the first semiconductor substrate is secured to the auxiliary member; and pushing the auxiliary member away from the clamp and towards the second semiconductor substrate to bring the first semiconductor substrate into contact with the second semiconductor substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一基板/基板/第一半導體基板</p>  
        <p type="p">111:接合表面/(介電)接合表面</p>  
        <p type="p">112:背表面</p>  
        <p type="p">115:金屬部分</p>  
        <p type="p">130:輔助部件</p>  
        <p type="p">131:接合表面</p>  
        <p type="p">132:背表面</p>  
        <p type="p">135:金屬部分</p>  
        <p type="p">170:第一夾具/夾具</p>  
        <p type="p">171:銷</p>  
        <p type="p">172:夾持表面</p>  
        <p type="p">180:第二夾具/夾具</p>  
        <p type="p">(i):步驟</p>  
        <p type="p">(ii):步驟</p>  
        <p type="p">(iii):步驟</p>  
        <p type="p">(iv):步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2380" publication-number="202625884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142579</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貨物區阻隔組件</chinese-title>  
        <english-title>CARGO AREA BARRIER ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A01K1/03</main-classification>  
        <further-classification edition="200601120260331B">A01K1/035</further-classification>  
        <further-classification edition="200601120260331B">A01K1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商居佳國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹尼爾Ａ　賽克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANIEL A, SACK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURTIS M, HARTENSTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於車輛之貨物區的動物收容系統。該動物收容系統包括一主衝擊面板，其設置成橫跨車輛之一後貨物區延伸。該動物收容系統更包括一負載腳組件，其連結到該主衝擊面板。該負載腳組件包括一負載腳，其可從該主衝擊面板朝向該車輛之表面延伸。該負載腳係配置成在一衝擊事件期間減少從該車輛之該表面傳遞到該動物收容裝置的衝擊力之大小。該動物收容系統更包括一繫緊錨固帶，其配置為連結到該主衝擊面板以及該車輛之一安裝結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An animal containment system for a cargo area of a vehicle is disclosed. The animal containment system includes a main impact panel arranged to extend across a rear cargo area of a vehicle. The animal containment system further includes a load leg assembly coupled to the main impact panel. The load leg assembly includes a load leg extendable from the main impact panel toward a surface of the vehicle. The load leg is configured to reduce a magnitude of an impact force transferred from the surface of the vehicle to the animal containment device during an impact event. The animal containment system further includes a tie-down anchor strap configured to be coupled to the main impact panel and a mounting structure of the vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:動物收容系統</p>  
        <p type="p">1002:主衝擊面板</p>  
        <p type="p">1004:第一側衝擊面板；側衝擊面板</p>  
        <p type="p">1006:第二側衝擊面板；側衝擊面板</p>  
        <p type="p">1008:第一繫緊錨固帶連接結構</p>  
        <p type="p">1010:第二繫緊錨固帶連接結構</p>  
        <p type="p">1012:底部墊</p>  
        <p type="p">1018:第一繫緊錨固帶；繫緊錨固帶</p>  
        <p type="p">1020:第二繫緊錨固帶；繫緊錨固帶</p>  
        <p type="p">1030:頂部阻隔面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2381" publication-number="202625903"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625903.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>寵物食品及寵物食品之包裝物組合</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260401B">A23K50/42</main-classification>  
        <further-classification edition="201601120260401B">A23K10/00</further-classification>  
        <further-classification edition="201601120260401B">A23K40/25</further-classification>  
        <further-classification edition="201601120260401B">A23K40/30</further-classification>  
        <further-classification edition="201601120260401B">A23K20/158</further-classification>  
        <further-classification edition="201601120260401B">A23K20/163</further-classification>  
        <further-classification edition="201701120260401B">A21D13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商優你　嬌美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNICHARM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本將崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鹽田將貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOTA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠使寵物之誘食性變好之寵物食品及寵物食品之包裝物組合。&lt;br/&gt; 寵物食品係水分含量為12質量%以下，且將包含澱粉及油脂之2個以上之不同麵團以層狀配置有2層以上者，於2層以上之前述麵團中之至少1層中，以能夠視認之方式混合有嗜好性提升劑之摻合比率不同之2種以上之麵團。又，寵物食品之特徵在於對2層以上之前述麵團成形之成形品塗佈有油脂及外部添加劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:寵物食品</p>  
        <p type="p">3:混合麵團</p>  
        <p type="p">10:第1層</p>  
        <p type="p">20:第2層</p>  
        <p type="p">31:第1麵團</p>  
        <p type="p">32:第2麵團</p>  
        <p type="p">33:固形物</p>  
        <p type="p">101:上表面</p>  
        <p type="p">102:下表面</p>  
        <p type="p">103:接合面</p>  
        <p type="p">104:側面</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2382" publication-number="202627308"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627308.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142582</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性軸承裝置及渦輪分子泵浦</chinese-title>  
        <english-title>MAGNETIC BEARING DEVICE AND TURBOMOLECULAR PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">F04D19/04</main-classification>  
        <further-classification edition="200601120260223B">F04D27/00</further-classification>  
        <further-classification edition="200601120260223B">F16C32/04</further-classification>  
        <further-classification edition="200601120260223B">B23Q5/04</further-classification>  
        <further-classification edition="200601120260223B">H02K7/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商埃地沃茲日本有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS JAPAN LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野貴晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[問題]為了抑制來自一馬達之雜訊對一感測器之一影響。 &lt;br/&gt;[解決手段] &lt;br/&gt;一種磁性軸承裝置包含：一旋轉體；一馬達，其包含數目為一偶數且並非4之一倍數之磁極；一徑向電磁體；一徑向位移感測器；一第一振盪器；一第二振盪器；及一解調變電路，其中該徑向位移感測器包含一第一感測器磁極對及一第二感測器磁極對，該感測器磁極對之各線圈經連接使得各自磁極之極性彼此不同，該第一感測器磁極對之一端連接至該第二感測器磁極對之一端使得在該第一感測器磁極對及該第二感測器磁極對之該等感測器磁極當中，徑向面向彼此之一對感測器磁極之極性彼此相反，該第一感測器磁極對之另一端連接至該第一振盪器，且該第二感測器磁極對之另一端連接至該第二振盪器，且該兩個感測器磁極對之一中點電壓輸入至該解調變電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">[Problem] To suppress an influence of noise from a motor on a sensor. &lt;br/&gt;[Means of Solution] &lt;br/&gt;A magnetic bearing device includes: a rotating body; a motor including poles whose number is an even number and is not a multiple of 4; a radial electromagnet; a radial displacement sensor; a first oscillator; a second oscillator; and a demodulation circuit, in which the radial displacement sensor includes a first sensor magnetic pole pair and a second sensor magnetic pole pair, each coil of the sensor magnetic pole pair is connected such that polarities of respective magnetic poles are different from each other, one end of the first sensor magnetic pole pair is connected to one end of the second sensor magnetic pole pair such that polarities of a pair of sensor magnetic poles radially facing each other, among the sensor magnetic poles of the first sensor magnetic pole pair and the second sensor magnetic pole pair, are opposite to each other, the other end of the first sensor magnetic pole pair is connected to the first oscillator, and the other end of the second sensor magnetic pole pair is connected to the second oscillator, and a midpoint voltage of the two sensor magnetic pole pairs is input to the demodulation circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:轉子軸件</p>  
        <p type="p">64:徑向位移感測器</p>  
        <p type="p">67a:上磁極/感測器磁極</p>  
        <p type="p">67b:下磁極/感測器磁極</p>  
        <p type="p">M:磁力線</p>  
        <p type="p">P1:第一感測器磁極對</p>  
        <p type="p">P2:第一感測器磁極對</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2383" publication-number="202627309"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627309.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空泵</chinese-title>  
        <english-title>VACUUM PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260115B">F04D19/04</main-classification>  
        <further-classification edition="200601120260115B">F04D25/06</further-classification>  
        <further-classification edition="200601120260115B">F04D27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商埃地沃茲日本有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS JAPAN LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野貴晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了降低歸因於一馬達之切換之雜訊。 &lt;br/&gt;一種真空泵包含：一旋轉體；一馬達，其可旋轉地驅動該旋轉體；一徑向電磁鐵，其在該旋轉體上產生一徑向方向上之一電磁力；位移感測器，其等之各者具有由線圈製成之複數個感測器磁極且基於該等線圈之電感之一變化而量測該旋轉體之一位移；一功率轉換器，其將一輸入DC電壓轉換成施加至該馬達之一AC電壓；一馬達驅動器，其與該功率轉換器協作執行PWM控制；一振盪器，其將一AC電壓作為一經調變輸入信號輸出至該位移感測器；及一解調變電路，其藉由一同步偵測技術解調變來自該位移感測器之一輸出信號。該PWM控制中之一載波頻率係該位移感測器之一調變頻率之四倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To reduce noise due to switching of a motor. &lt;br/&gt;A vacuum pump includes: a rotating body; a motor that rotatably drives the rotating body; a radial electromagnet that generates an electromagnetic force in a radial direction on the rotating body; displacement sensors, each of which has a plurality of sensor magnetic poles made of coils and measures a displacement of the rotating body based on a change in inductances of the coils; a power converter that converts an input DC voltage into an AC voltage which is applied to the motor; a motor driver that performs PWM control in cooperation with the power converter; an oscillator that outputs an AC voltage as a modulated input signal to the displacement sensor; and a demodulation circuit that demodulates an output signal from the displacement sensor by a synchronous detection technique. A carrier frequency in the PWM control is four times a modulation frequency of the displacement sensor.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2384" publication-number="202628448"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628448.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142600</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260401B">H04W28/18</main-classification>  
        <further-classification edition="200901120260401B">H04W52/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉辰辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置。本申請可以應用於IEEE 802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請設計了一種適用於DRU的LTF序列，該LTF序列可以在不同DRU傳輸下均具有較低的PAPR。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of communications technologies, and in particular, to a communication method and apparatus. This application may be applied to the IEEE 802.11ax standard, 802.11be standard, 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, 802.11bf standard, IMMW standard, or SparkLink standard. This application designs an LTF sequence suitable for DRUs, which can have a relatively low PAPR under different DRU transmissions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401、402、403:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2385" publication-number="202628000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置、檢查裝置、檢查方法、及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260401B">G06V10/60</main-classification>  
        <further-classification edition="202201120260401B">G06V10/48</further-classification>  
        <further-classification edition="200601120260401B">G01N21/88</further-classification>  
        <further-classification edition="202601120260401B">H10P74/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商捷進科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FASFORD TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小橋英晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBASHI, HIDEHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] &lt;br/&gt;　　提供能夠提升外觀檢查的靈敏度的技術。 &lt;br/&gt;[解決手段] &lt;br/&gt;　　半導體製造裝置，具備有：攝像裝置、照明裝置、及控制裝置。上述控制裝置，構成為能夠(a)藉由上述照明裝置照射照明光，並且藉由上述攝像裝置對晶粒進行拍攝以取得影像資料，(b)對所取得的上述影像資料進行影像處理，以擷取符合第一指定條件的候選畫素，(c)依據所擷取的上述候選畫素檢索候選線，結合上述候選畫素以檢測異常候選。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2386" publication-number="202626555"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626555.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合化物粉末</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C04B35/04</main-classification>  
        <further-classification edition="200601120260323B">C04B35/576</further-classification>  
        <further-classification edition="200601120260323B">C01B25/42</further-classification>  
        <further-classification edition="200601120260323B">C01B35/12</further-classification>  
        <further-classification edition="200601120260323B">C01G37/14</further-classification>  
        <further-classification edition="200601120260323B">C01G39/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田光祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中章宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, AKINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元野隆二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTONO, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原周平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, SYUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一態樣係一種製造複合化物粉末之方法，其包括如下步驟：(a)提供包含選自由Zn、Mg及P所組成之群中之至少一種之化合物之粉末，其中上述化合物為負熱膨脹材料；(b)相對於上述步驟(a)中所提供之上述化合物之粉末100質量份，混合0.01質量份以上且50質量份以下之量之包含選自由屬於週期表之第5族或第6族之元素、Li及B所組成之群中之至少一種之元素的氧化物，形成混合粉末；以及(c)藉由對上述步驟(b)中所形成之上述混合粉末進行焙燒，獲得複合化物粉末。上述氧化物可包含選自由屬於週期表之第5族或第6族之V、Nb、Ta、Cr、Mo、及W所組成之群中之至少一種之氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2387" publication-number="202626402"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626402.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輪式移動裝置及載具</chinese-title>  
        <english-title>WHEELED MOVING DEVICE AND CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">B60P3/04</main-classification>  
        <further-classification edition="200601120260319B">B60N2/24</further-classification>  
        <further-classification edition="200601120260319B">A01K31/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商居佳國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱萬權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, WAN-QUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程滿群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, MAN-QUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳英忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-ZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘知仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, ZHI-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭征文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, ZHENG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種輪式移動裝置及載具。輪式移動裝置包括：承載架；載具；卡合機構，用於將所述載具可拆卸地卡合在所述承載架上；所述卡合機構包括卡合件和卡槽，所述載具包括收容於所述卡槽內的卡合桿，所述卡合件能在伸入所述卡槽以將所述卡合桿固定在所述卡槽內的第一位置和退出所述卡槽以使所述卡合桿能夠脫離所述卡槽的第二位置之間移動。載具包括：支架裝置，包括第一支架和第二支架；所述第一支架包括兩個短桿和兩個長桿，及連接於兩個所述長桿之間的支撐桿；所述第二支架包括第一連接桿，所述第一連接桿設置於所述支撐桿上；以及帶引導機構，連接於所述長桿和所述第一連接桿之間，用於與固定帶組件配合以將所述支架裝置固定於座椅上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a wheeled moving device and a carrier. The wheeled moving device includes: a carrying frame; a carrier; and an engaging mechanism for detachably engaging the carrier to the carrying frame; the engaging mechanism includes an engaging member and a slot, the carrier includes an engaging rod housed within the slot, the engaging member can move between a first position in which it extends into the slot to secure the engaging rod within the slot, and a second position in which it withdraws from the slot to enable the engaging rod to be disengaged from the slot. The carrier includes: a stand device including a first stand and a second stand; the first stand including two short rods and two long rods, and a support bar connected between the two long rods; the second stand including a first connecting rod, the first connecting rod disposed on the support bar; and a strap guide mechanism connected between the long rod and the first connecting rod, the strap guide mechanism is provided for cooperating with the fixing strap assembly to secure the stand device to the seat.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:前輪組件</p>  
        <p type="p">14:後輪組件</p>  
        <p type="p">15:腳輪</p>  
        <p type="p">22:前桿件</p>  
        <p type="p">23:前加強桿</p>  
        <p type="p">24:後支撐架</p>  
        <p type="p">26:第一過渡件</p>  
        <p type="p">28:第二過渡件</p>  
        <p type="p">29:扶手</p>  
        <p type="p">30:載具</p>  
        <p type="p">40:承載架</p>  
        <p type="p">50:第一鎖定機構</p>  
        <p type="p">60:卡合機構</p>  
        <p type="p">O1:第一樞接點</p>  
        <p type="p">O2:第二樞接點</p>  
        <p type="p">O3:第三樞接點</p>  
        <p type="p">O4:第四樞接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2388" publication-number="202628984"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628984.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置以及用於形成半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W40/10</main-classification>  
        <further-classification edition="202601120260302B">H10W20/40</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification>  
        <further-classification edition="200601120260302B">G02B6/12</further-classification>  
        <further-classification edition="200601120260302B">G02B6/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋管理私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC MANAGEMENT PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權興奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, HEUNGKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金永澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNGCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINGWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張政煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳京漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, KYUNGHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫基洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, KIRAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相震</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鍾允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JONGYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONGHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳受珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, SOOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種半導體裝置以及一種用於形成半導體裝置的方法。所述半導體裝置可以包括：第一再分佈層（RDL），所述第一RDL具有第一側和與所述第一側相對的第二側；至少一個電子元件，所述至少一個電子元件附接在所述第一RDL的第一側上；光子元件，所述光子元件附接在所述第一RDL的第二側上；第一多個導電凸塊，所述第一多個導電凸塊形成於所述第一RDL的第二側上並且與所述第一RDL電耦接；第二RDL，所述第二RDL具有第一側和與所述第一側相對的第二側，其中所述第二RDL的第一側與所述第一多個導電凸塊電耦接；以及第二多個導電凸塊，所述第二多個導電凸塊形成於所述第二RDL的第二側上並且與所述第二RDL電耦接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:第一RDL</p>  
        <p type="p">112:第一側</p>  
        <p type="p">114:第二側</p>  
        <p type="p">120:第二RDL</p>  
        <p type="p">122:第一側</p>  
        <p type="p">124:第二側</p>  
        <p type="p">130:玻璃透鏡</p>  
        <p type="p">132:第一電子元件</p>  
        <p type="p">134:第二電子元件</p>  
        <p type="p">142:光子元件</p>  
        <p type="p">143:第一密封劑</p>  
        <p type="p">146:橋接管芯</p>  
        <p type="p">148:導電凸塊</p>  
        <p type="p">158:導電凸塊</p>  
        <p type="p">170:第二密封劑</p>  
        <p type="p">180:基板</p>  
        <p type="p">182:第一側</p>  
        <p type="p">184:第二側</p>  
        <p type="p">186:導電凸塊</p>  
        <p type="p">188:加強件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2389" publication-number="202628365"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628365.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙閘極開關器件</chinese-title>  
        <english-title>DUAL-GATE SWITCH DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H03K17/28</main-classification>  
        <further-classification edition="200601120251204B">H03K7/08</further-classification>  
        <further-classification edition="202501120251204B">H10D64/20</further-classification>  
        <further-classification edition="202501120251204B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　光銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUANG MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余子威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, ZIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種開關器件，包括第一電晶體、第二電晶體、第一驅動器和第二驅動器。第一電晶體包括第一端、第二端和控制端；第二電晶體包括與第一電晶體的第一端耦接的第一端，與第一電晶體的第二端耦接的第二端，以及控制端；第一驅動器與第一電晶體的控制端耦接，且被配置為驅動第一電晶體。第二驅動器與第二電晶體的控制端耦接，且被配置為驅動第二電晶體。在第一電晶體和第二電晶體即將導通的第一階段，第一電晶體先於第二電晶體導通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A switch device includes a first transistor, a second transistor, a first driver, and a second driver. The first transistor includes a first terminal, a second terminal, and a control terminal. The second transistor includes a first terminal coupled to the first terminal of the first transistor, a second terminal coupled to the second terminal of the first transistor, and a control terminal. The first driver is coupled to the control terminal of the first transistor and configured to drive the first transistor. The second driver is coupled to the control terminal of the second transistor and configured to drive the second transistor. During a first period in which the first transistor and the second transistor are to be turned on, the first transistor is turned on before the second transistor is turned on.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:降壓轉換器</p>  
        <p type="p">10:開關控制器</p>  
        <p type="p">120:低側開關</p>  
        <p type="p">200:開關器件</p>  
        <p type="p">210:高側開關</p>  
        <p type="p">122,212,214:電晶體</p>  
        <p type="p">140,230A,230B:驅動器</p>  
        <p type="p">C1:電容器</p>  
        <p type="p">L1:電感器</p>  
        <p type="p">SIG&lt;sub&gt;PH&lt;/sub&gt;,SIG&lt;sub&gt;PL&lt;/sub&gt;:脈寬調製信號</p>  
        <p type="p">Vin:輸入電壓</p>  
        <p type="p">Vout:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2390" publication-number="202627193"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627193.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在基板之表面上的間隙內沉積材料之方法及反應器系統</chinese-title>  
        <english-title>METHOD OF DEPOSITING MATERIAL WITHIN GAP ON SURFACE OF SUBSTRATE AND REACTOR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C23C16/52</main-classification>  
        <further-classification edition="200601120260331B">C23C16/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗塞福德　查德　拉塞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNCEFORD, CHAD RUSSELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張帥迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUAIDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴克　喬納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKKE, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種沉積材料之方法及一種用於沉積材料之系統。例示性方法包括在改變反應腔室內之壓力的同時向基板供給前驅物及/或反應物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of depositing material and a system for depositing material are disclosed. Exemplary methods include dosing a substrate with a precursor and/or reactant while varying a pressure within the reaction chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">110:步驟</p>  
        <p type="p">112:步驟</p>  
        <p type="p">114:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2391" publication-number="202626730"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626730.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>識別ＭＡＧＥＡ４免疫原性肽之結合蛋白及其用途</chinese-title>  
        <english-title>BINDING PROTEINS RECOGNIZING MAGEA4 IMMUNOGENIC PEPTIDES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07K14/725</further-classification>  
        <further-classification edition="200601120260401B">C12N5/10</further-classification>  
        <further-classification edition="200601120260401B">A61K39/00</further-classification>  
        <further-classification edition="202501120260401B">A61K40/32</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="202601120260401B">G01N33/575</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商帝斯肯醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSCAN THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茱爾威茲　茉莉　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUREWICZ, MOLLIE M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾卡尼　路圖賈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULKARNI, RUTUJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古爾　卡甘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURER, CAGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供識別MAGEA4免疫原性肽之結合蛋白及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are binding proteins recognizing MAGEA4 immunogenic peptides and uses thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2392" publication-number="202628803"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628803.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P14/40</main-classification>  
        <further-classification edition="202601120260325B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山浩二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYAMA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村知大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, CHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈貝爾　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUBERT, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於在不增大介電膜之CET的情況下減少漏電流。 &lt;br/&gt;本發明之半導體裝置之製造方法包括如下工序：於半導體基板上或形成於半導體基板之下部電極上形成介電膜；使金屬選擇性附著於介電膜之表面上之特定區域；藉由對金屬實施熱處理而於介電膜之表面上之特定區域形成絕緣性之金屬氧化膜；及於介電膜之表面上之特定區域形成有金屬氧化膜之狀態下，在介電膜上形成上部電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101:步驟</p>  
        <p type="p">S102:步驟</p>  
        <p type="p">S103:步驟</p>  
        <p type="p">S104:步驟</p>  
        <p type="p">S105:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2393" publication-number="202628794"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628794.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板選擇方法、基板選擇裝置、積層基板製造方法、及積層基板製造系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260319B">H10P10/00</main-classification>  
        <further-classification edition="202601120260319B">H10P74/20</further-classification>  
        <further-classification edition="202601120260319B">H10P95/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅谷功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAYA, ISAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三石創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUISHI, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可抑制積層基板中之基板間的位置偏差。本發明之貼合第一基板與第二基板而製造積層基板的方法包含以下階段：依據關於第一基板及第二基板之各個彎曲的資訊，判斷第一基板及第二基板是否滿足指定條件；及滿足指定條件時，貼合第一基板與第二基板。上述積層基板製造方法中包含依據資訊推測將第一基板貼合於第二基板後之位置偏差量的階段，指定條件亦可包含位置偏差量在臨限值以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S102、S205、S301、S302、S303:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2394" publication-number="202626700"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626700.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142760</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於增生及感染性疾病治療之細胞激素結合物</chinese-title>  
        <english-title>CYTOKINE CONJUGATES FOR THE TREATMENT OF PROLIFERATIVE AND INFECTIOUS DISEASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07K14/55</main-classification>  
        <further-classification edition="201701120260324B">A61K47/60</further-classification>  
        <further-classification edition="201701120260324B">A61K47/54</further-classification>  
        <further-classification edition="201701120260324B">A61K47/64</further-classification>  
        <further-classification edition="201701120260324B">A61K47/65</further-classification>  
        <further-classification edition="201701120260324B">A61K47/68</further-classification>  
        <further-classification edition="200601120260324B">A61K38/20</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification>  
        <further-classification edition="200601120260324B">C07K14/71</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商欣爍克斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNTHORX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普塔辛　傑洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PTACIN, JEROD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡法洛　卡洛琳娜Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAFFARO, CAROLINA E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米菈　馬可斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLA, MARCOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示介白素(IL)結合物(例如IL-2結合物)及在治療一或多種適應症中之用途。本文亦描述包含一或多種介白素結合物(例如IL-2結合物)的醫藥組合物及套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are interleukin (IL) conjugates (e.g., IL-2 conjugates) and use in the treatment of one or more indications. Also described herein are pharmaceutical compositions and kits comprising one or more of the interleukin conjugates (e.g., IL-2 conjugates).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2395" publication-number="202626223"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626223.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142764</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銀粉及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260331B">B22F1/068</main-classification>  
        <further-classification edition="200601120260331B">B22F9/04</further-classification>  
        <further-classification edition="200601120260331B">H01B5/00</further-classification>  
        <further-classification edition="200601120260331B">H01B1/22</further-classification>  
        <further-classification edition="202401120260331B">G01N15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舟部未来斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNABE, MIKUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森中泰三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORINAKA, TAIZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之銀粉包含具有片形狀之複數個銀粒子。於將藉由雷射繞射散射式粒度分佈測定法所得之累積體積50體積%時之體積累積粒徑設為D&lt;sub&gt;50&lt;/sub&gt;(μm)，將BET比表面積設為SSA(m&lt;sup&gt;2&lt;/sup&gt;/g)時，由D&lt;sub&gt;50&lt;/sub&gt;/SSA所定義之值為3.50以上5.20以下。銀之晶粒尺寸較佳為40.0 nm以上45.0 nm以下。於藉由雷射繞射散射式粒度分佈測定法所獲得之粒度分佈中，具有超過18.50 μm之粒徑之銀粒子之比率較佳為1.40體積%以下。體積累積粒徑D&lt;sub&gt;50&lt;/sub&gt;較佳為3.80 μm以上7.40 μm以下。BET比表面積SSA較佳為0.70 m&lt;sup&gt;2&lt;/sup&gt;/g以上2.00 m&lt;sup&gt;2&lt;/sup&gt;/g以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P:粒子</p>  
        <p type="p">S:矩形</p>  
        <p type="p">W1:長徑</p>  
        <p type="p">W2:短徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2396" publication-number="202627207"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627207.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻液組合物</chinese-title>  
        <english-title>ETCHANT COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23F1/18</main-classification>  
        <further-classification edition="200601120260401B">C23F1/26</further-classification>  
        <further-classification edition="200601120260401B">C09K13/08</further-classification>  
        <further-classification edition="202601120260401B">H10P50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商東進世美肯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGJIN SEMICHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁多仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DA IN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金聖雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONG WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔周植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, JU SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE SEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙勇珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, YONG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金珍郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN WUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜東滸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, DONG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申賢哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, HYUN CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種蝕刻性能優異的蝕刻液組合物。根據一個方面，提供一種蝕刻液組合物，其包含：過氧化氫；磷酸鹽；胺，具有至少一個以上羥基；氟化物；四氮環狀化合物，具有環內四個氮原子；以及三氮環狀化合物，具有環內三個氮原子，並且所述四氮環狀化合物與所述三氮環狀化合物的重量比為1:0.01以上至1:1.25以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2397" publication-number="202626456"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626456.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動倉庫</chinese-title>  
        <english-title>AUTOMATED WAREHOUSE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">B65G1/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田雄一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松井修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUI, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石倉篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKURA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動倉庫10，具備複數個飛行體1、搬出搬入部3、具備複數個收納部2a的收納架2、及在收納架2的內部進行物品W的搬送之複數個搬送裝置4，複數個搬送裝置4是於上下方向配列複數層，且於X方向配列複數行，複數個搬送裝置4的每一個是構成為沿著Y方向搬送物品W，於收納架2中之Y方向第1側Y1的端部，設有複數個交接部5，複數個交接部5的每一個用於飛行體1和搬送裝置4之間的物品W的交接，搬出搬入部3相對於收納架2於Y方向第1側Y1分開而配置，複數個飛行體1是構成為在搬出搬入部3和複數個交接部5之間搬送物品W。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:飛行體</p>  
        <p type="p">2:收納架</p>  
        <p type="p">2a:收納部</p>  
        <p type="p">3:搬出搬入部</p>  
        <p type="p">3a:搬出搬入用搬送裝置</p>  
        <p type="p">4:搬送裝置</p>  
        <p type="p">5:交接部</p>  
        <p type="p">5a:構件</p>  
        <p type="p">6:第1待機充電部(待機充電部)</p>  
        <p type="p">7:第2待機充電部</p>  
        <p type="p">8:中繼部</p>  
        <p type="p">9:搬送路徑</p>  
        <p type="p">10:自動倉庫</p>  
        <p type="p">18:搬送輸送機</p>  
        <p type="p">E:飛行航線區</p>  
        <p type="p">W:物品</p>  
        <p type="p">X:水平面的特定的方向(方向)</p>  
        <p type="p">X1:X方向第1側</p>  
        <p type="p">X2:X方向第2側</p>  
        <p type="p">Y:在上下方向視角下與X方向交叉的方向(方向)</p>  
        <p type="p">Y1:Y方向第1側</p>  
        <p type="p">Y2:Y方向第2側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2398" publication-number="202628078"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628078.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音訊處理電路以及音訊處理方法</chinese-title>  
        <english-title>AUDIO PROCESSING CIRCUIT AND AUDIO PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251201B">G10L21/0208</main-classification>  
        <further-classification edition="200601120251201B">G10K11/175</further-classification>  
        <further-classification edition="200601120251201B">H04R3/12</further-classification>  
        <further-classification edition="200601120251201B">H04R3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漆力文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, LI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁志齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHIH-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種音訊處理電路，用以針對一音訊功能來產生一輸出訊號。該音訊處理電路包含至少一適應性濾波器以及一漏音偵測電路。該至少一適應性濾波器用以控制該輸出訊號。該漏音偵測電路用以依據一第一輸入訊號以及一第二輸入訊號來執行漏音偵測，以及依據一漏音偵測結果來調整該至少一適應性濾波器。該第一輸入訊號指示噪音訊號特徵。該第二輸入訊號源自一誤差麥克風拾取該音訊功能所產生之殘餘噪音而得的一誤差訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An audio processing circuit is used for generating an output signal for an audio function, and includes at least one adaptive filter and a leakage detection circuit. The at least one adaptive filter controls the output signal. The leakage detection circuit performs leakage detection according to a first input signal and a second input signal, and adjusts the at least one adaptive filter according to a leakage detection result. The first input signal is indicative of noise signal signature. The second input signal is derived from an error signal output by an error microphone that picks up remnant noise resulting from the audio function.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:音訊處理系統</p>  
        <p type="p">102:參考麥克風</p>  
        <p type="p">104:誤差麥克風</p>  
        <p type="p">106:音訊處理電路</p>  
        <p type="p">108:喇叭</p>  
        <p type="p">110:適應性濾波器</p>  
        <p type="p">112:漏音偵測電路</p>  
        <p type="p">S1:第一輸入訊號</p>  
        <p type="p">S2:第二輸入訊號</p>  
        <p type="p">x[n]:參考訊號</p>  
        <p type="p">e[n]:誤差訊號</p>  
        <p type="p">y[n]:抗噪訊號</p>  
        <p type="p">
        &lt;img align="absmiddle" height="22px" width="31px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;:估計訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2399" publication-number="202628491"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628491.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿產生裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">H05H1/46</main-classification>  
        <further-classification edition="200601120260321B">H01J37/32</further-classification>  
        <further-classification edition="200601120260321B">H01J37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高園翔大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAZONO, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山澤陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAWA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細野良輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSONO, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東谷善和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZUMAYA, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能提高電漿密度之均一性之技術。電漿產生裝置具備：第1螺旋線圈構造體，其具有第1螺旋形狀，且具有第1內側單極天線及第1外側單極天線，上述第1內側單極天線沿著第1螺旋形狀而配置，上述第1外側單極天線與第1內側單極天線相隔，沿著第1螺旋形狀而配置；及第2螺旋線圈構造體，其具有第2螺旋形狀，第2螺旋線圈構造體係以與第1螺旋線圈構造體於同一平面上形成嵌套件之方式配置，且具有第2內側單極天線及第2外側單極天線，上述第2內側單極天線沿著第2螺旋形狀而配置，上述第2外側單極天線與第2內側單極天線相隔，沿著第2螺旋形狀而配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通訊介面</p>  
        <p type="p">10:電漿處理腔室</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">12:電漿產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2400" publication-number="202628197"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628197.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於偵測污染之系統</chinese-title>  
        <english-title>SYSTEM FOR DETECTING CONTAMINATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">H01J49/04</main-classification>  
        <further-classification edition="200601120260323B">H01J49/10</further-classification>  
        <further-classification edition="200601120260323B">H01J49/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商自然科學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELEMENTAL SCIENTIFIC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約斯特　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOST, TYLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海恩　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIN, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宰碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴同喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, DONG CHERL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種可用樣本分析系統，其可包含一遠端採樣系統、至少一分析器及一控制器。該遠端採樣系統可包含：用於自其提供一對應樣本之複數個樣本源；及選擇性地耦合至該複數個樣本源之任何者之複數個樣本收集設備以自該複數個樣本源接收該等樣本之至少一者。該至少一分析器可耦合至該複數個樣本收集設備以自該複數個樣本收集設備收集該等樣本之至少一者。該控制器可與該遠端採樣系統及該至少一分析器耦合，該控制器經組態以控制該等樣本源之哪一者在一給定時間主動耦合至一給定樣本收集設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sample analysis system is available that can include a remote sampling system, at least one analyzer, and a controller. The remote sampling system can include a plurality of sample sources for providing a corresponding sample therefrom; and a plurality of sample collection devices selectively coupled to any of the plurality of sample sources for receiving at least one of the samples therefrom. The at least one analyzer can be coupled to the plurality of the sample collection devices for receiving at least one of the samples therefrom. The controller can be coupled with the remote sampling system and the at least one analyzer, the controller configured to control which of the sample sources is actively coupled to a given sample collection device at a given time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:分析系統</p>  
        <p type="p">104:遠端採樣系統</p>  
        <p type="p">106A:遠端樣本源</p>  
        <p type="p">106B:遠端樣本源</p>  
        <p type="p">108A:樣本收集設備/模組</p>  
        <p type="p">108B:樣本收集設備/模組</p>  
        <p type="p">109:源至模組流體連接</p>  
        <p type="p">110:樣本收集器</p>  
        <p type="p">112:分析設備/分析器</p>  
        <p type="p">114:採樣設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2401" publication-number="202627013"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627013.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體加工用片材</chinese-title>  
        <english-title>SHEET FOR PROCESSING SEMICONDUCTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260325B">C09J7/30</main-classification>  
        <further-classification edition="201801120260325B">C09J7/29</further-classification>  
        <further-classification edition="201801120260325B">C09J7/20</further-classification>  
        <further-classification edition="200601120260325B">C09J129/04</further-classification>  
        <further-classification edition="200601120260325B">C09J201/00</further-classification>  
        <further-classification edition="200601120260325B">B32B27/30</further-classification>  
        <further-classification edition="200601120260325B">B32B27/36</further-classification>  
        <further-classification edition="202601120260325B">H10P54/00</further-classification>  
        <further-classification edition="202601120260325B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北條雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOJO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍戸雄一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIDO, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山義治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, YOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三木惠太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種半導體加工用片材，其係具備：保護層，係含有親水性聚合物並貼合於被接著體之保護對象面；基材層，係以對向於前述保護層之單面的方式配置；及黏著劑層，係配置於前述基材層與前述保護層之間且藉由活性能量射線之照射而降低黏著力；並且對前述黏著劑層及前述保護層個別進行動態黏彈性測定時，前述黏著劑層之85℃之Tanδ係0.35以下，前述保護層之85℃之儲存彈性模數G’係15萬Pa以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a sheet for processing a semiconductor, the sheet comprising: a protective layer including a hydrophilic polymer and configured to be attached to a surface to be protected of an adherend； a base material layer disposed to be opposed to one surface of the protective layer； and a pressure-sensitive adhesive layer disposed between the base material layer and the protective layer and configured to have a pressure-sensitive adhesive force lowering by irradiation with active energy rays, in which when each of the pressure-sensitive adhesive layer and the protective layer is subjected to dynamic viscoelasticity measurement, a tanδ at 85ºC of the pressure-sensitive adhesive layer is 0.35 or less, and a storage elastic modulus at 85ºC of the protective layer is 150,000 Pa or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體加工用片材</p>  
        <p type="p">11:基材層</p>  
        <p type="p">12:保護層</p>  
        <p type="p">13:黏著劑層</p>  
        <p type="p">14:中間層</p>  
        <p type="p">15:離型紙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2402" publication-number="202626927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142836</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適於資源循環之組成物及該組成物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L1/02</main-classification>  
        <further-classification edition="200601120260401B">C08L1/28</further-classification>  
        <further-classification edition="200601120260401B">C08J3/02</further-classification>  
        <further-classification edition="200601120260401B">B01J13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＢＥＣＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本祥平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種具有高回收性及低環境負荷但容易製造之適於資源循環之組成物。此種組成物，係含有纖維素、醇溶解性纖維素衍生物、及作為液狀溶劑之多元醇，且不含水，或含有10重量份以下的水。多元醇，理想係二元醇。此外，此種組成物之製造方法，係具備：混合步驟，混合纖維素、醇溶解性纖維素衍生物、及多元醇；以及凝膠化步驟，對混合步驟所製作之混合物進行加熱及加壓，使混合物凝膠化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2403" publication-number="202627894"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627894.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於記憶體內運算之處理器</chinese-title>  
        <english-title>PROCESSOR FOR IN-MEMORY COMPUTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260327B">G06N3/063</main-classification>  
        <further-classification edition="200601120260327B">G06F17/16</further-classification>  
        <further-classification edition="201901120260327B">G06F1/3237</further-classification>  
        <further-classification edition="200601120260327B">G11C11/413</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商艾瑟雷拉人工智慧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AXELERA AI BV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科西曼斯　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COSEMANS, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏伊特霍芬　羅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UYTTERHOEVEN, ROEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈格　帕斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGER, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">記憶體內運算(IMC)處理器包含分組成複數個IMC處理級之一組IMC排組，各該IMC處理級包括一個IMC排組或採用一並聯組態之二或更多個IMC排組。在一處理循環時間性序列之一給定處理循環中，該等IMC處理級各被組配用以接收一數位輸入資料向量，並且用以使用該各別IMC處理級之該等IMC排組中所儲存之各別之一組權重資料，來處理該目前經接收輸入資料向量，用來產生及提供一輸出資料向量之一各別片段。該IMC處理器被組配用以採用一循序處理順序，使用該組IMC處理級來處理任何給定輸入資料向量，用於該給定輸入資料向量之該循序處理順序按該處理循環時間性序列之每個處理循環，在該組IMC排組內前移一個IMC處理級。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In-memory computing, IMC, processor, comprising a set of IMC banks that is grouped into a plurality of IMC processing stages, each of the IMC processing stages including either one IMC bank or two or more IMC banks in a parallel configuration. The IMC processing stages are each configured, in a given processing cycle of a temporal sequence of processing cycles, to receive a digital input data vector, and to process, using a respective set of weight data stored in the IMC banks of the respective IMC processing stage, the currently received input data vector to generate and pro-vide a respective fraction of an output data vector. The IMC pro-cessor is configured to process any given input data vector using the set of IMC processing stages in a sequential processing order, the sequential processing order for the given input data vector advancing within the set of IMC banks one IMC processing stage per processing cycle of the temporal sequence of processing cycles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:IMC處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2404" publication-number="202628083"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628083.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G11C5/02</main-classification>  
        <further-classification edition="202601120260302B">H10P54/00</further-classification>  
        <further-classification edition="202601120260302B">H10P10/00</further-classification>  
        <further-classification edition="202601120260302B">H10W10/00</further-classification>  
        <further-classification edition="202601120260302B">H10P95/90</further-classification>  
        <further-classification edition="202501120260302B">H10D62/80</further-classification>  
        <further-classification edition="202501120260302B">H10D62/40</further-classification>  
        <further-classification edition="202501120260302B">H10D62/60</further-classification>  
        <further-classification edition="202601120260302B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權正訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, JEONG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東協</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG HYOUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了製造包括高整合記憶體單元的半導體裝置的方法以及該半導體裝置。該方法包括：在基板之上形成水平排列的奈米片目標圖案，其中奈米片目標圖案包括水平取向的初始片和設置在每個初始片兩側的片擴展突出部；對奈米片目標圖案執行表面處理，以形成水平排列的窄片和奈米片介電層，每個奈米片介電層環繞不同的一個窄片；以及在奈米片介電層上形成水平導線，水平導線環繞窄片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a semiconductor device including high-integrated memory cells and the semiconductor device is provided. The method includes forming a horizontal arrangement of nano sheet target patterns over a substrate, wherein the nano sheet target patterns include initial sheets that are horizontally oriented and sheet expansion tabs disposed on both sides of each of the initial sheets; performing a surface treatment on the nano sheet target patterns to form a horizontal arrangement of narrow sheets and nano sheet dielectric layers, each of the nano sheet dielectric layers surrounding a different one of the narrow sheets; and forming a horizontal conductive line on the nano sheet dielectric layers, the horizontal conductive line surrounding the narrow sheets.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">GD:奈米片介電層</p>  
        <p type="p">GD1:沉積部分</p>  
        <p type="p">GD2:氧化部分</p>  
        <p type="p">HM1:硬遮罩層</p>  
        <p type="p">HM2:硬遮罩層</p>  
        <p type="p">HM3:硬遮罩層</p>  
        <p type="p">HL:奈米片</p>  
        <p type="p">HG:間隙</p>  
        <p type="p">IL2:第二單元間介電層</p>  
        <p type="p">LS:下部結構</p>  
        <p type="p">WL:第二導線</p>  
        <p type="p">WLL:虛設第二導線</p>  
        <p type="p">WLU:虛設第二導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2405" publication-number="202628976"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628976.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W20/20</main-classification>  
        <further-classification edition="202301120260302B">H10B41/20</further-classification>  
        <further-classification edition="202301120260302B">H10B41/30</further-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification>  
        <further-classification edition="202601120260302B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, JUN HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔康植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, KANG SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐重源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JUNG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尙洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包括高集成記憶體單元的半導體裝置及用於製造所述半導體裝置的方法被提供。所述方法包括：在基底之上形成第一半導體層垂直地被堆疊在其中的第一垂直堆疊，蝕刻第一垂直堆疊的第一半導體層並形成第一接觸孔，從第一垂直堆疊的最上面的第一半導體層形成虛設半導體層，在虛設半導體層上形成第二半導體層以形成第二垂直堆疊，蝕刻第二垂直堆疊的第二半導體層並形成第二接觸孔，以及用銲盤替換第一半導體層和第二半導體層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device including high-integrated memory cells and a method for fabricating the semiconductor device is provided. The method includes forming a first vertical stack in which first semiconductor layers are vertically stacked over a substrate, etching the first semiconductor layers of the first vertical stack and forming first contact holes, forming dummy semiconductor layers from an uppermost first semiconductor layer of the first vertical stack, forming second semiconductor layers on the dummy semiconductor layers to form a second vertical stack, etching the second semiconductor layers of the second vertical stack and forming second contact holes, and replacing the first and second semiconductor layers with pads.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基底</p>  
        <p type="p">12:第一模層</p>  
        <p type="p">13:第二模層</p>  
        <p type="p">15:第一銲盤片</p>  
        <p type="p">16:第一銲盤間介電層</p>  
        <p type="p">17:第一銲盤隔離層</p>  
        <p type="p">18:第一犧牲插塞</p>  
        <p type="p">19:第一虛設模層</p>  
        <p type="p">20:第二虛設模層</p>  
        <p type="p">21:附加虛設模層</p>  
        <p type="p">22:第一模層</p>  
        <p type="p">23:第二模層</p>  
        <p type="p">DSB:虛設堆疊</p>  
        <p type="p">R1:單元陣列區域</p>  
        <p type="p">R2:耦接區域</p>  
        <p type="p">SB1:第一模堆疊</p>  
        <p type="p">SB2:第二模堆疊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2406" publication-number="202628580"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628580.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B41/20</main-classification>  
        <further-classification edition="202301120260302B">H10B43/20</further-classification>  
        <further-classification edition="202501120260302B">H10D62/824</further-classification>  
        <further-classification edition="202501120260302B">H10D84/82</further-classification>  
        <further-classification edition="202601120260302B">H10D88/00</further-classification>  
        <further-classification edition="202601120260302B">H10W10/20</further-classification>  
        <further-classification edition="202601120260302B">H10W10/10</further-classification>  
        <further-classification edition="202501120260302B">H10D62/60</further-classification>  
        <further-classification edition="202601120260302B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋東一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, DONG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, JUN HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴晟珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNG MEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種包括高度整合的記憶體單元的半導體裝置以及一種用於製造半導體裝置的方法。所述半導體裝置包括：垂直排列的奈米片和水平排列的奈米片；水平導線，其水平取向並且圍繞所述水平排列的奈米片；焊盤，其耦接至所述水平導線的邊緣部分；以及焊盤間電介質層，其設置在所述焊盤之間，每個所述焊盤間電介質層包括氣隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device including high-integrated memory cells and a method for fabricating the semiconductor device is provided. The semiconductor device includes a vertical arrangement and a horizontal arrangement of nano sheets; horizontal conductive lines horizontally oriented while surrounding the horizontal arrangement of the nano sheets; pads coupled to edge portions of the horizontal conductive lines; and inter-pad dielectric layers disposed between the pads, each inter-pad dielectric layer including an air gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AG:氣隙</p>  
        <p type="p">B-B':線</p>  
        <p type="p">DG:虛擬生長層</p>  
        <p type="p">DP:虛擬片</p>  
        <p type="p">GD:奈米片電介質層</p>  
        <p type="p">HL:奈米片</p>  
        <p type="p">HM1~HM4:硬掩模層</p>  
        <p type="p">IL2:第二單元間電介質層</p>  
        <p type="p">LS:下部結構</p>  
        <p type="p">OPE:外邊緣</p>  
        <p type="p">PDL:焊盤間電介質層</p>  
        <p type="p">PE:內邊緣</p>  
        <p type="p">PIL:焊盤間隔離層</p>  
        <p type="p">R1:第一區域</p>  
        <p type="p">R2:第二區域</p>  
        <p type="p">SP1:第一間隔件</p>  
        <p type="p">WE:邊緣部分</p>  
        <p type="p">WL:第二導線</p>  
        <p type="p">WLL:虛擬第二導線</p>  
        <p type="p">WLU:虛擬第二導線</p>  
        <p type="p">WP:焊盤</p>  
        <p type="p">WSL:焊盤支撐層</p>  
        <p type="p">WSL1:第一焊盤支撐層</p>  
        <p type="p">WSL2:第二焊盤支撐層</p>  
        <p type="p">WSL3:第三焊盤支撐層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2407" publication-number="202628116"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628116.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於執行封裝後修復的記憶體系統及其操作方法</chinese-title>  
        <english-title>MEMORY SYSTEM FOR PERFORMING POST PACKAGE REPAIR AND AN OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G11C29/04</main-classification>  
        <further-classification edition="200601120260316B">G11C29/12</further-classification>  
        <further-classification edition="200601120260316B">G11C7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金頭鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DU HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體系統，包括至少一個記憶體裝置和控制器。控制器包括輸入路徑和輸出路徑，輸入路徑用於向至少一個記憶體裝置傳送從外部裝置輸入的資料輸入/輸出（I/O）請求，輸出路徑用於傳送與資料I/O請求相對應的回應。控制器被配置為選擇性地將輸出路徑耦接到輸入路徑，以進行封裝後修復（PPR）操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory system includes at least one memory device and a controller. The controller includes an input path for transferring a data input/output (I/O) request input from an external device to the at least one memory device and an output path for transferring a response corresponding to the data I/O request. The controller is configured to selectively couple the output path to the input path for a post package repair (PPR) operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:主機</p>  
        <p type="p">112:作業系統</p>  
        <p type="p">114:應用程式</p>  
        <p type="p">150:記憶體系統</p>  
        <p type="p">160:記憶體控制器</p>  
        <p type="p">162:記憶體管理電路</p>  
        <p type="p">164:資料輸入/輸出(I/O)電路</p>  
        <p type="p">166:封裝後修復(PPR)控制電路</p>  
        <p type="p">180:記憶體裝置</p>  
        <p type="p">ADDR:位址</p>  
        <p type="p">CH:通道</p>  
        <p type="p">REP:回應</p>  
        <p type="p">REQ:讀取請求</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2408" publication-number="202628571"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628571.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260328B">H10B12/00</main-classification>  
        <further-classification edition="202501120260328B">H10D64/20</further-classification>  
        <further-classification edition="202601120260328B">H10W20/40</further-classification>  
        <further-classification edition="202601120260328B">H10W72/90</further-classification>  
        <further-classification edition="202601120260328B">H10W70/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜洪成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HONG SEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭峻河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, JUN HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權正訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, JEONG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了包括高積體化記憶體單元的半導體裝置及其製造方法。半導體裝置包括垂直排列和水平排列的奈米片；圍繞水平排列的奈米片的水平導線；耦接至水平導線的邊緣部分的焊墊；設置在焊墊之間的焊墊間介電層；接觸插塞，每個接觸插塞耦接至不同的一個焊墊；以及接觸間隔件，每個接觸間隔件包含第一低k材料並且每個接觸間隔件形成在每個接觸插塞的側壁上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device including high-integrated memory cells and a method for fabricating the semiconductor device is provided. The semiconductor device includes a vertical arrangement and a horizontal arrangement of nano sheets; horizontal conductive lines that surround the horizontal arrangement of the nano sheets; pads coupled to edge portions of the horizontal conductive lines; inter-pad dielectric layers disposed between the pads; contact plugs each coupled to a different one of the pads; and contact spacers each including a first low-k material and each formed on a sidewall of each of the contact plugs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">B-B':線</p>  
        <p type="p">CT1、CT2:第一接觸插塞、第二接觸插塞</p>  
        <p type="p">CT3、CT4:第三接觸插塞、第四接觸插塞</p>  
        <p type="p">CTS1、CTS2:第一接觸間隔件、第二接觸間隔件</p>  
        <p type="p">CTS3、CTS4:第三接觸間隔件、第四接觸間隔件</p>  
        <p type="p">GD:奈米片介電層</p>  
        <p type="p">HL:奈米片</p>  
        <p type="p">SP1:第一間隔件</p>  
        <p type="p">PE:內邊緣</p>  
        <p type="p">WE:邊緣部分</p>  
        <p type="p">LS:下部結構</p>  
        <p type="p">WL:第二導線</p>  
        <p type="p">WLL、WLU:虛設第二導線</p>  
        <p type="p">IL2:第二單元間介電層</p>  
        <p type="p">HM1、HM2、HM3、HM4:硬光罩層</p>  
        <p type="p">PIL:焊墊間介電層</p>  
        <p type="p">LV1、LV2、LV3、LV4:第一層級、第二層級、第三層級、第四層級</p>  
        <p type="p">WP1、WP2、WP3、WP4:第一焊墊、第二焊墊、第三焊墊、第四焊墊</p>  
        <p type="p">DP:虛設片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2409" publication-number="202627612"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627612.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>緊湊型波導系統</chinese-title>  
        <english-title>COMPACT WAVEGUIDE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G02B27/01</main-classification>  
        <further-classification edition="200601120260325B">G02B6/122</further-classification>  
        <further-classification edition="200601120260325B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商魯姆斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMUS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈爾茨坦　內塔內爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLDSTEIN, NETANEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾森菲爾德　齊翁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EISENFELD, TSION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格爾貝格　喬納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELBERG, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光波導裝置可以包括用於接收在第一方向上行進的圖像光的入耦合區域、出耦合區域、在入耦合區域中的擴展器光導元件、在入耦合區域與出耦合區域之間的傳播區域以及在傳播區域中的支承光導元件。擴展器光導元件接收圖像光，在第一方向上透射圖像光的第一部分，並且在第二方向上朝向出耦合區域反射圖像光的第二部分。傳播區域包括接收來自擴展器光導元件的第二部分的光束的主子區域和不直接接收來自擴展器光導元件的第二部分的光束的目標子區域。支承光導元件將來自擴展器光導元件的第二部分的光束經由目標子區域引導到出耦合區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical waveguide apparatus may include an in-coupling region for receiving image light traveling in a first direction, an out-coupling region, expander light-guide elements in the in-coupling region, a propagation region between the in-coupling region and the out-coupling region, and supporting light-guide elements in the propagation region. The expander light-guide elements receive the image light, transmit a first portion of the image light in the first direction, and reflect a second portion of the image light in a second direction toward the out-coupling region. The propagation region includes primary sub-regions that receive a light beam of the second portion from the expander light-guide elements, and target sub-regions that do not directly receive a light beam of the second portion from the expander light-guide elements. The supporting light-guide elements direct a light beam of the second portion from the expander light-guide elements to the out-coupling region via the target sub-regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:近眼顯示器(NED)</p>  
        <p type="p">201:第一波導部分</p>  
        <p type="p">205:第二波導部分</p>  
        <p type="p">212:緊湊型圖像投影儀</p>  
        <p type="p">215:波導系統(可互換地稱為“基板”或“平板(slab)”)</p>  
        <p type="p">218:眼鏡框架</p>  
        <p type="p">219:控制器</p>  
        <p type="p">X、Y、Z:軸(方向)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2410" publication-number="202626706"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626706.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗IL-22抗體，抗體片段，其免疫結合物及其用途</chinese-title>  
        <english-title>ANTI-IL-22 ANTIBODIES, ANTIBODY FRAGMENTS, THEIR IMMUNOCONJUGATES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07K16/18</main-classification>  
        <further-classification edition="200601120260324B">C07K16/24</further-classification>  
        <further-classification edition="200601120260324B">A61K39/395</further-classification>  
        <further-classification edition="200601120260324B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商拜奧亞特拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOATLA, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休特　杰　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHORT, JAY M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗雷　傑爾哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREY, GERHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　懷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HWAI WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波以耳　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOYLE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供結合至人類IL-22及哺乳動物IL-22兩者之抗IL-22抗體或抗體片段以及經修飾抗IL-22抗體及抗體片段。亦提供包含該抗體或抗體片段之醫藥組合物及套組。亦提供用於治療各種IL-22介導之病狀及疾病之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anti-IL-22 antibody or antibody fragment that binds to both human IL-22 and a mammalian IL-22 as well as modified anti-IL-22 antibodies and antibody fragments. Pharmaceutical compositions and kits comprising the antibody or antibody fragment are also provided. Also provided are methods for treatment of various IL-22 mediated conditions and diseases.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2411" publication-number="202628346"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628346.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有基於變壓器之耦合的多模式電壓控制振盪器（ＶＣＯ）</chinese-title>  
        <english-title>MULTI-MODE VOLTAGE-CONTROLLED OSCILLATOR (VCO) WITH TRANSFORMER-BASED COUPLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H03B5/24</main-classification>  
        <further-classification edition="200601120260401B">H03B5/02</further-classification>  
        <further-classification edition="200601120260401B">H03L7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝石磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, SHILEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　怡武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YIWU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於使用具有基於變壓器之耦合的多模式電壓控制振盪器(VCO)電路之振盪信號產生之技術與設備。一實例VCO電路大致上包括：一第一對電晶體，其係與一第一主動負跨導電路相關聯；一第二對電晶體，其係與一第二主動負跨導電路相關聯；一變壓器，其包含一一次繞組及一二次繞組，該一次繞組耦接至該第二對電晶體；一第一組開關，其耦接在該第一對電晶體的閘極與該變壓器的該二次繞組之間；及一第二組開關，其耦接在該第一對電晶體的該等閘極與一第一電壓節點之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques and apparatus for oscillating signal generation using a multi-mode voltage-controlled oscillator (VCO) circuit with transformer-based coupling. An example VCO circuit generally includes a first pair of transistors associated with a first active negative transconductance circuit; a second pair of transistors associated with a second active negative transconductance circuit; a transformer comprising a primary winding and a secondary winding, the primary winding being coupled to the second pair of transistors; a first set of switches coupled between gates of the first pair of transistors and the secondary winding of the transformer; and a second set of switches coupled between the gates of the first pair of transistors and a first voltage node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400B:雙模VCO</p>  
        <p type="p">401:電力供應器</p>  
        <p type="p">402:參考電位節點</p>  
        <p type="p">420:變壓器</p>  
        <p type="p">422&lt;sub&gt;1&lt;/sub&gt;~422&lt;sub&gt;m&lt;/sub&gt;:p型主動負跨導電路切片</p>  
        <p type="p">424:n型主動負跨導電路</p>  
        <p type="p">450B:表</p>  
        <p type="p">C3:變容器</p>  
        <p type="p">M1~M4:電晶體</p>  
        <p type="p">SW1~SW5:開關</p>  
        <p type="p">T1:一次繞組</p>  
        <p type="p">T2:二次繞組</p>  
        <p type="p">V&lt;sub&gt;b&lt;/sub&gt;:偏壓節點</p>  
        <p type="p">V&lt;sub&gt;hi&lt;/sub&gt;:高電壓節點</p>  
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:電力供應節點</p>  
        <p type="p">GND:參考電位節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2412" publication-number="202625921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安全帽透氣裝置</chinese-title>  
        <english-title>BREATHABLE DEVICE OF SAFETY HELMET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">A42B3/28</main-classification>  
        <further-classification edition="200601120260325B">A42B3/12</further-classification>  
        <further-classification edition="200601120260325B">A42B3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭桓岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HUAN-TSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭桓岑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HUAN-TSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHUN YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt;本發明提供一安全帽透氣裝置。藉由將複數彈性元件固定至安全帽內部底部，以於騎士頭皮及安全帽之間製造透氣空間，當騎士騎乘時，空氣可從騎士頭皮、安全帽內部底部及彈性元件之間穿透，以達涼爽、舒適之效果。&lt;/b&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A breathable device of the safety helmet is provided. By fixing multiple elastic elements to the inner bottom of the safety helmet, a breathable space is created between the rider's scalp and the safety helmet. When the rider rides, air can penetrate between the rider's scalp, the inner bottom of the safety helmet and the elastic elements. To achieve the effect of coolness and comfort.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:彈性元件</p>  
        <p type="p">3:安全帽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2413" publication-number="202626180"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626180.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廢氣成分處理方法及廢氣處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01D53/68</main-classification>  
        <further-classification edition="200601120260401B">B01D53/32</further-classification>  
        <further-classification edition="200601120260401B">B01D53/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商菲佛費伯解決方案有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFEIFFER FAB SOLUTIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富許斯　伯恩德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUCHS, BERND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰拉克爾　尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THEILACKER, NICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種處理廢氣1的成分的方法100。方法100包含以下步驟：S2 產生表面活性介電阻隔放電2，以下稱為S-DBD， S4 使廢氣1與所產生的S-DBD 2接觸，以及S5 利用S-DBD2將含鹵素的廢氣成分轉化為反應產物3。&lt;br/&gt; 此外，本發明還涉及一種處理廢氣1的成分的廢氣處理系統6、一種製程設備15、以及一種製造廢氣處理系統的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:表面活性介電阻隔放電</p>  
        <p type="p">9:介電絕緣基板</p>  
        <p type="p">10:導電結構</p>  
        <p type="p">11:表面</p>  
        <p type="p">12:縫隙</p>  
        <p type="p">13:催化劑材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2414" publication-number="202626349"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626349.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝飾成膜裝置、裝飾成膜方法及裝飾基材</chinese-title>  
        <english-title>DECORATIVE FILM DEPOSITION APPARATUS, DECORATIVE FILM DEPOSITION METHOD, AND DECORATIVE SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B32B9/00</main-classification>  
        <further-classification edition="200601120260331B">C23C14/06</further-classification>  
        <further-classification edition="200601120260331B">C23C16/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大澤篤史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSAWA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種能夠容易地進行用於使基材發色之裝飾的技術。 &lt;br/&gt;本發明之解決手段為，一種裝飾成膜裝置，其係具備：腔室；鈦粒子釋放部，其包含被配置在上述腔室內之鈦靶材，且對上述鈦靶材賦予能量而使其釋放鈦粒子；氣體供給部，其連接於上述腔室，供給反應性氣體；以及控制部，其控制上述氣體供給部。上述氣體供給部係具有：含碳氣體供給部，其將含有碳原子之含碳氣體供給至上述腔室內；含氮氣體供給部，其將含有氮原子之含氮氣體供給至上述腔室內；以及流量調節部，其可相對於上述含氮氣體之流量，調節上述含碳氣體之流量；上述控制部係藉由上述流量調節部而調節上述含碳氣體之流量，調整形成於成膜對象物之膜的可見光反射率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:濺鍍裝置(裝飾成膜裝置)</p>  
        <p type="p">10:搬送部</p>  
        <p type="p">11:搬送滾輪</p>  
        <p type="p">20:電漿處理部(鈦粒子釋放部)</p>  
        <p type="p">30:旋轉陰極</p>  
        <p type="p">90:載體</p>  
        <p type="p">91:基材</p>  
        <p type="p">100:腔室</p>  
        <p type="p">120:溫調部</p>  
        <p type="p">130:管道</p>  
        <p type="p">153:高頻電源</p>  
        <p type="p">154:匹配電路</p>  
        <p type="p">160、161:閘門</p>  
        <p type="p">170:高真空排氣系統</p>  
        <p type="p">180:分光器</p>  
        <p type="p">200:控制部</p>  
        <p type="p">311:濺鍍用電源</p>  
        <p type="p">500:氣體供給部</p>  
        <p type="p">510:反應性氣體供給部</p>  
        <p type="p">511a:含碳氣體供給源</p>  
        <p type="p">511b:含氮氣體供給源</p>  
        <p type="p">512、512a、512b、512c、522、612、622:配管</p>  
        <p type="p">513、513a、513b、523、613、623:閥(流量調節部)</p>  
        <p type="p">520:濺鍍氣體供給部</p>  
        <p type="p">521:濺鍍氣體供給源</p>  
        <p type="p">L:搬送路徑</p>  
        <p type="p">V:處理空間</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2415" publication-number="202627412"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627412.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>繞射光柵</chinese-title>  
        <english-title>DIFFRACTION GRATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">G01B11/24</main-classification>  
        <further-classification edition="200601120260320B">G02B27/44</further-classification>  
        <further-classification edition="200601120260320B">G02B27/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯吉耐瑟　巴特　勞倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SJENITZER, BART LAURENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉思伯特森　阿爾揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIJSBERTSEN, ARJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹達斯　彼得　費納德　威廉　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENDAS, PETER FERNAND WILLIAM JOZEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一形貌量測系統之光學總成，該光學總成包含：一第一反射器；一第二反射器；及一第三反射器，其經定位成使得該第二反射器沿著該第一反射器與該第三反射器之間的一光徑而定位；其中該第一反射器之一焦距不同於該第三反射器之一焦距，使得該光學總成具有取決於該第一反射器之該焦距與該第三反射器之該焦距的一比率之一放大率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical assembly for a topography measurement system, the optical assembly comprises: a first reflector; a second reflector; and a third reflector located such that the second reflector is located along an optical path between the first reflector and the third reflector; wherein a focal length of the first reflector is different from a focal length of the third reflector such that the optical assembly has a magnification dependent on a ratio of the focal length of the first reflector to the focal length of the third reflector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一區域/反射區域</p>  
        <p type="p">12:第二區域</p>  
        <p type="p">13:透射基板14之表面/透射基板14之面向表面</p>  
        <p type="p">14:透射基板</p>  
        <p type="p">15:塗層</p>  
        <p type="p">21:第一偵測元件/第一偵測器元件</p>  
        <p type="p">22:第二偵測元件/第二偵測器元件</p>  
        <p type="p">30:入輻射</p>  
        <p type="p">31:第一光束/第一輻射光束</p>  
        <p type="p">32:第二光束/第二輻射光束</p>  
        <p type="p">DGR:偵測光柵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2416" publication-number="202626581"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626581.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備(甲基)丙烯酸酯之方法</chinese-title>  
        <english-title>PROCESS FOR PRODUCING (METH)ACRYLIC ESTERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C67/08</main-classification>  
        <further-classification edition="200601120260401B">C07C67/54</further-classification>  
        <further-classification edition="200601120260401B">C07C69/54</further-classification>  
        <further-classification edition="200601120260401B">B01D3/14</further-classification>  
        <further-classification edition="200601120260401B">B01D3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴地斯顏料化工廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭　歐特姆德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, ORTMUND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克藍普　瑪賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRAMP, MARVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華特　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTER, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯瑟　喬勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUETHER, JOACHIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種製備(甲基)丙烯酸酯之方法，該方法包括： &lt;br/&gt;(i)     將(甲基)丙烯酸與烷醇或異丁烯反應，由此在至少一個反應器(3, 23)中獲得包括(甲基)丙烯酸酯及(甲基)丙烯酸之反應混合物； &lt;br/&gt;(ii)    藉由在至少一個管柱(27, 43；93, 105)中精餾來處理該反應混合物，從而獲得產物流、含有低沸物之流及含有高沸物之流； &lt;br/&gt;(iii)  視情況在裂解設備(35)中濃縮並裂解來自含有高沸物之該流之該等高沸物； &lt;br/&gt;每一反應器(3, 23)、每一管柱(27, 43)及每一裂解設備(35)與作為再沸器之至少一個蒸發器連接，其中將包括(甲基)丙烯酸及/或(甲基)丙烯酸酯及/或高沸物之流蒸發並再循環至各別設備，其中該等蒸發器中之每一者以使比熱負載係2至20 kW/m&lt;sup&gt;2&lt;/sup&gt;之方式來設計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a process for producing (meth)acrylic esters comprising: &lt;br/&gt;(i) reacting (meth)acrylic acid and an alkanol or isobutene, thereby obtaining a reaction mixture comprising (meth)acrylic ester and (meth)acrylic acid in at least one reactor (3, 23); &lt;br/&gt;(ii) working-up the reaction mixture by rectification in at least one column (27, 43; 93, 105), obtaining a product stream, a stream containing low boilers and a stream containing high boilers; &lt;br/&gt;(iii) optionally concentrating and cracking the high boilers from the stream containing high boilers in a cracking apparatus (35); &lt;br/&gt;each reactor (3, 23), each column (27, 43) and each cracking apparatus (35) being connected with at least one evaporator as a reboiler, in which (meth)acrylic acid and/or (meth)acrylic ester and/or high boilers comprising stream is evaporated and recycled into the respective apparatus, wherein each of the evaporators is designed in such a way that the specific heat load is 2 to 20 kW/m&lt;sup&gt;2&lt;/sup&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一反應器</p>  
        <p type="p">3:反應區段</p>  
        <p type="p">5:蒸餾區段</p>  
        <p type="p">7:第一入口</p>  
        <p type="p">9:第二入口</p>  
        <p type="p">11:側進料</p>  
        <p type="p">13:頂部出口</p>  
        <p type="p">15:相分離器</p>  
        <p type="p">17:再循環管線</p>  
        <p type="p">19:回收管線</p>  
        <p type="p">21:廢水管線</p>  
        <p type="p">23:第二反應器</p>  
        <p type="p">25:再循環管線</p>  
        <p type="p">27:第一蒸餾管柱</p>  
        <p type="p">29:側進料</p>  
        <p type="p">31:頂部出口</p>  
        <p type="p">33:底部出口</p>  
        <p type="p">35:設備</p>  
        <p type="p">37:管線</p>  
        <p type="p">39:出口</p>  
        <p type="p">41:管線</p>  
        <p type="p">43:第二反應器</p>  
        <p type="p">45:側進料</p>  
        <p type="p">46:側出口</p>  
        <p type="p">47:頂部出口</p>  
        <p type="p">49:返回管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2417" publication-number="202627406"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627406.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用二維偵測器總成用於光譜臨界尺寸測量之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR SPECTROSCOPIC CRITICAL DIMENSION MEASUREMENT WITH TWO-DIMENSIONAL DETECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">G01B11/00</main-classification>  
        <further-classification edition="200601120260331B">G01N21/25</further-classification>  
        <further-classification edition="200601120260331B">G01J3/42</further-classification>  
        <further-classification edition="200601120260331B">G01J3/447</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄　明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里許南　桑卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAN, SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡大為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, DAWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　智賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JIHYUN JADE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包含：一光源，其經組態以發射光以照明一工件；一光學子系統，其包含經組態以引導及操縱由該工件反射之該光之一或多個透鏡、反射鏡及繞射光柵；以及一偵測器總成，其經組態以偵測由該工件反射之該光。該偵測器總成包含一二維感測器陣列及一二維微透鏡陣列，且各感測器經組態以基於透射穿過該二維微透鏡陣列之該光來個別地產生測量資料。該系統進一步包含一處理器，該處理器經組態以：接收來自各感測器之該測量資料及該二維感測器陣列中之各感測器之一對應位置；及基於跨該二維感測器陣列產生之該測量資料及各感測器之該對應位置來判定該工件之一光譜臨界尺寸(SCD)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The system includes a light source configured to emit light to illuminate a workpiece, an optical subsystem including one or more lenses, mirrors, and diffraction gratings configured to direct and manipulate the light reflected by the workpiece, and a detector assembly configured to detect the light reflected by the workpiece. The detector assembly includes a two-dimensional sensor array and a two-dimensional microlens array, and each sensor is configured to independently generate measurement data based on the light transmitted through the two-dimensional microlens array. The system further includes a processor configured to receive the measurement data from each sensor and a corresponding location of each sensor in the two-dimensional sensor array and determine a spectroscopic critical dimension (SCD) of the workpiece based on the measurement data generated across the two-dimensional sensor array and the corresponding location of each sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">100a:光譜橢偏測量(SE)工具</p>  
        <p type="p">101:工件</p>  
        <p type="p">102:入射角(AOI)平面</p>  
        <p type="p">110:光源</p>  
        <p type="p">111:光</p>  
        <p type="p">112:光</p>  
        <p type="p">113:繞射光線</p>  
        <p type="p">114:分散光</p>  
        <p type="p">121:第一補償器</p>  
        <p type="p">122:第二補償器</p>  
        <p type="p">130:集光鏡</p>  
        <p type="p">135:繞射光柵</p>  
        <p type="p">140:偵測器總成</p>  
        <p type="p">146:測量資料</p>  
        <p type="p">150:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2418" publication-number="202628897"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142996</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶粒供應器</chinese-title>  
        <english-title>DIE SUPPLIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P72/30</main-classification>  
        <further-classification edition="202601120260324B">H10P72/70</further-classification>  
        <further-classification edition="202601120260324B">H10P10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽格　奧拉夫　約翰內斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIJGER, OLAV JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種晶粒供應器，其包含：一供體支撐件，其經組態以支撐並旋轉一供體基板，該供體基板支撐複數個晶粒；一轉移臂，其經組態以藉由繞一第一軸線旋轉而自該供體基板轉移晶粒；及一額外轉移臂，其經組態以藉由繞不同於該第一軸線之一第二軸線旋轉而自該供體基板轉移晶粒，其中該轉移臂及該額外轉移臂經組態以將晶粒轉移至遠離該供體基板之實質上相同的部位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A die supplier comprising: a donor support configured to support and rotate a donor substrate that supports a plurality of dies; a transfer arm configured to transfer dies from the donor substrate by rotation around a first axis; and an additional transfer arm configured to transfer dies from the donor substrate by rotation around a second axis, different from the first axis, wherein the transfer arm and additional transfer arm are configured to transfer dies to substantially the same location away from the donor substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶粒供應器</p>  
        <p type="p">20:支撐載物台</p>  
        <p type="p">21:晶粒受體</p>  
        <p type="p">30:供體支撐件</p>  
        <p type="p">32:馬達</p>  
        <p type="p">33:孔隙</p>  
        <p type="p">34:量測感測器</p>  
        <p type="p">35:軸承</p>  
        <p type="p">40:轉移臂</p>  
        <p type="p">43:嚙合構件</p>  
        <p type="p">45:樞軸</p>  
        <p type="p">50:供體基板</p>  
        <p type="p">51:晶粒</p>  
        <p type="p">60:受體基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2419" publication-number="202626839"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626839.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143000</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改性烯丙基苯並噁嗪樹脂組合物、增層膜及其製備方法和應用</chinese-title>  
        <english-title>MODIFIED ALLYL BENZOXAZINE RESIN COMPOSITION, BUILD-UP FILM, PREPARATION METHOD THEREOF, AND APPLICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G59/42</main-classification>  
        <further-classification edition="200601120260401B">C08G59/68</further-classification>  
        <further-classification edition="200601120260401B">C08L61/34</further-classification>  
        <further-classification edition="200601120260401B">C08L63/00</further-classification>  
        <further-classification edition="200601120260401B">C08K7/18</further-classification>  
        <further-classification edition="202001120260401B">C08J7/04</further-classification>  
        <further-classification edition="200601120260401B">B32B15/08</further-classification>  
        <further-classification edition="200601120260401B">B32B27/00</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="200601120260401B">H05K3/46</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商清華珠三角研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESEARCH INSTITUTE OF TSINGHUA, PEARL RIVER DELTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭永軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YONGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫文彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, WENYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹廣盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, GUANGSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了改性烯丙基苯並噁嗪樹脂組合物、增層膜及其製備方法和應用，屬於複合材料技術領域。所述改性烯丙基苯並噁嗪樹脂組合物包括改性烯丙基苯並噁嗪樹脂、功能樹脂、固化劑、固化促進劑、無機填料、助劑；所述改性烯丙基苯並噁嗪樹脂的製備原料包括：改性劑和烯丙基苯並噁嗪樹脂；所述改性劑包括第一改性劑；所述第一改性劑為胺類含氟化合物；所述胺類含氟化合物為2,2-雙[4-(4-氨基苯氧基)苯基]六氟丙烷。本申請採用胺類含氟化合物對烯丙基苯並噁嗪樹脂進行改性，可以製備得到具備低介電常數、低介電損耗和低吸水率的改性烯丙基苯並噁嗪樹脂組合物，滿足增膜層的應用需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2420" publication-number="202628395"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628395.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊方法及裝置</chinese-title>  
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H04L27/36</main-classification>  
        <further-classification edition="200601120260401B">H04L27/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉辰辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周正春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHENGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及通訊技術領域，尤其涉及一種通訊方法及裝置。本申請可以應用於IEEE802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請實施例提供的方法中，在採用4個52-tone RU攜帶相同資料時，這4個52-tone RU中的兩個52-tone RU中索引為奇數的子載波上承載的值取反，或者這4個52-tone RU中的兩個52-tone RU中索引為偶數的子載波上承載的值相反。透過對部分子載波上承載的值取反，可以有效降低ELR複製傳輸時的PAPR。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2421" publication-number="202628462"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628462.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種通信方法和裝置</chinese-title>  
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">H04W72/0453</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李盼盼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PANPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊訊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信方法和裝置，用於實現不同AMP設備以FDM的方式通信。方法包括：第三設備發送第一資訊和第二資訊，第一資訊用於指示第一頻域資源，第一頻域資源用於第一設備發送第一激勵信號，第二資訊用於指示第二頻域資源，第二頻域資源用於第二設備發送第二激勵信號，第一頻域資源和第二頻域資源在頻域上不重疊。方法包括：第三設備發送第三資訊和第四資訊，第三資訊用於指示第一頻域偏移量，第一頻域偏移量為第一標籤接收的激勵信號與第一標籤生成的反射信號之間的頻域偏移量，第四資訊用於指示第二頻域偏移量，第二頻域偏移量為第二標籤接收的激勵信號與第二標籤生成的反射信號之間的頻域偏移量，第一頻域偏移量與第二頻域偏移量不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and apparatus are provided to enable different AMP devices to communicate in an FDM manner. The method includes: a third device sending first information and second information, where the first information is used to indicate a first frequency domain resource, the first frequency domain resource is used by a first device to send a first excitation signal, the second information is used to indicate a second frequency domain resource, the second frequency domain resource is used by a second device to send a second excitation signal, and the first frequency domain resource and the second frequency domain resource do not overlap in the frequency domain. The method further includes: the third device sending third information and fourth information, where the third information is used to indicate a first frequency domain offset, the first frequency domain offset is a frequency domain offset between an excitation signal received by a first tag and a reflected signal generated by the first tag, the fourth information is used to indicate a second frequency domain offset, the second frequency domain offset is a frequency domain offset between an excitation signal received by a second tag and a reflected signal generated by the second tag, and the first frequency domain offset is different from the second frequency domain offset.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401、S402:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2422" publication-number="202626614"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626614.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143011</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非聚合物化合物及膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D251/24</main-classification>  
        <further-classification edition="200601120260401B">C07D251/42</further-classification>  
        <further-classification edition="200601120260401B">C08F20/36</further-classification>  
        <further-classification edition="200601120260401B">C08L33/14</further-classification>  
        <further-classification edition="200601120260401B">C08K5/3492</further-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification>  
        <further-classification edition="200601120260401B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木聰太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, SOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種非聚合物化合物，其作為具有實用的可見光穿透性及對有機溶劑的優異溶解性之新穎非聚合物化合物，由下述式(1)表示， &lt;br/&gt;&lt;img align="absmiddle" height="144px" width="487px" file="ed10065.JPG" alt="ed10065.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，Ar&lt;sup&gt;1&lt;/sup&gt;各自獨立地表示亦可具有選自由甲基、乙基、苯基及苄基所組成的群組中之取代基的碳數6~14的芳香族烴基或碳數3~14的芳香族雜環基，Ar&lt;sup&gt;1&lt;/sup&gt;亦可藉由醚鍵相互連結，Et表示伸乙基，n各自獨立地表示0或1，R各自獨立地表示氫原子、甲基、乙基、苯基或萘基，k表示0或1，X各自獨立地表示具有三嗪骨架之官能基。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2423" publication-number="202627181"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627181.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>將氣體注入CVD反應器之製程室的裝置及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C23C16/455</main-classification>  
        <further-classification edition="200601120260331B">C23C16/54</further-classification>  
        <further-classification edition="202601120260331B">H10P14/24</further-classification>  
        <further-classification edition="200601120260331B">F15D1/04</further-classification>  
        <further-classification edition="200601120260331B">C23C16/458</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商愛思強歐洲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIXTRON SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆基諾維奇　梅里姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKINOVIC, MERIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夸爾堤爾　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUARTIER, GEORG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯克　卡斯滕路德維希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIRKE, CARSTEN LUDWIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格里貝爾　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIEBEL, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種CVD反應器(1)，其具有：殼體及包含在該殼體中之氣體入口構件(21)，該氣體入口構件具有最上方的氣體入口區(Z1)及至少一個佈置在其下方的其他氣體入口區(Z2，Z3)，該等氣體入口區各具一出氣面(6，6'，6")，該出氣面具有用於分別將一氣體注入製程室(19)之第一出氣開口(15)；佈置在該製程室(19)中且在該上氣體入口區(Z1)與其下方的該其他氣體入口區(Z2)之間緊鄰該氣體入口構件(21)之延長板(4)，該延長板用於將流過該上氣體入口區(Z1)與流過佈置在其下方的該其他氣體入口區(Z2)之該等氣體在空間上彼此隔開。為簡化該延長板(4)之安裝，本發明提出：該延長板(4)利用連接元件(20)與保持裝置(18)連接，該保持裝置緊固在該CVD反應器(1)之殼體(2)上或殼體固定的組成部分上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:CVD反應器</p>  
        <p type="p">2:殼體</p>  
        <p type="p">3:製程室頂部</p>  
        <p type="p">4:延長板</p>  
        <p type="p">5:流道</p>  
        <p type="p">6:出氣面</p>  
        <p type="p">6':出氣面</p>  
        <p type="p">6":出氣面</p>  
        <p type="p">7:出氣壁</p>  
        <p type="p">8:氣體進線</p>  
        <p type="p">8':氣體進線</p>  
        <p type="p">8":氣體進線</p>  
        <p type="p">9:氣體出口</p>  
        <p type="p">10:加熱裝置</p>  
        <p type="p">11:基板</p>  
        <p type="p">12:基板座</p>  
        <p type="p">13:基板架</p>  
        <p type="p">14:氣體分配腔</p>  
        <p type="p">14':氣體分配腔</p>  
        <p type="p">14":氣體分配腔</p>  
        <p type="p">15:第一出氣開口</p>  
        <p type="p">16:桿部</p>  
        <p type="p">17:第二出氣開口</p>  
        <p type="p">18:保持裝置</p>  
        <p type="p">19:製程室</p>  
        <p type="p">20:連接元件</p>  
        <p type="p">21:氣體入口構件</p>  
        <p type="p">22:預備區</p>  
        <p type="p">23:生長區</p>  
        <p type="p">24:上游端</p>  
        <p type="p">24':下游端</p>  
        <p type="p">25:載位</p>  
        <p type="p">26:支撐階部</p>  
        <p type="p">Z1:出氣區</p>  
        <p type="p">Z2:出氣區</p>  
        <p type="p">Z3:出氣區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2424" publication-number="202627044"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627044.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶介質</chinese-title>  
        <english-title>LIQUID CRYSTAL MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C09K19/54</main-classification>  
        <further-classification edition="200601120260331B">C09K19/60</further-classification>  
        <further-classification edition="200601120260331B">C07D211/46</further-classification>  
        <further-classification edition="200601120260331B">G02F1/13</further-classification>  
        <further-classification edition="200601120260331B">G02F1/1334</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏梓峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIA, TZU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳澤霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JER-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於如技術方案1中所定義之液晶(LC)介質及液晶材料及其用於光學、電光及電子目的，特定言之於節能LC顯示器，尤其於IPS、FFS、VA或PS-VA顯示器中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a liquid crystal (LC) medium as defined in claim 1 and to a liquid crystal material and to the use thereof for optical, electro-optical and electronic purposes, in particular in energy saving LC displays, especially in IPS, FFS, VA or PS-VA displays.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2425" publication-number="202628775"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628775.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251114B">H10K59/80</main-classification>  
        <further-classification edition="202301120251114B">H10K50/805</further-classification>  
        <further-classification edition="202301120251114B">H10K50/818</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金禧鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HEE-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露揭示一種顯示面板，其中獨立發光元件層設置於至少一個第一電極之每一者上，且共同發光元件層額外地設置以跨越多個子像素覆蓋該些獨立發光元件層。藉由以此方式提供獨立發光元件層及共同發光元件層兩者，可增加特定子像素中之反射效率，從而導致子像素中之亮度改善。此配置以允許針對目標子像素選擇性地調整光學路徑長度及發光特性，同時維持整體面板結構，從而實現增強之性能而無需不必要地增加厚度或複雜性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display panel in which an individual light-emitting element layer is disposed on each of at least one first electrode, and a common light-emitting element layer is additionally disposed so as to cover the individual light-emitting element layers across multiple sub pixels. By providing both the individual light emitting element layer and the common light emitting element layer in this manner, reflection efficiency in a specific sub-pixel can be increased, resulting in improved luminance in that sub-pixel. The configuration allows optical path length and emission characteristics to be selectively adjusted for targeted sub pixels while maintaining overall panel structure, thereby achieving enhanced performance without unnecessary increases in thickness or complexity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示面板</p>  
        <p type="p">100:基板</p>  
        <p type="p">110:電路區域</p>  
        <p type="p">112:電路區域絕緣層</p>  
        <p type="p">121:第一反射電極</p>  
        <p type="p">122:第二反射電極</p>  
        <p type="p">123:第三反射電極</p>  
        <p type="p">125a:絕緣層</p>  
        <p type="p">128:溝槽</p>  
        <p type="p">131:第一電極</p>  
        <p type="p">132a:第一堤層</p>  
        <p type="p">132b:第二堤層</p>  
        <p type="p">132c:第三堤層</p>  
        <p type="p">133a:第一獨立發光元件層</p>  
        <p type="p">133b:第二獨立發光元件層</p>  
        <p type="p">133c:第三獨立發光元件層</p>  
        <p type="p">134:共同發光元件層</p>  
        <p type="p">135:第二電極</p>  
        <p type="p">136a:第一圖案化區域</p>  
        <p type="p">136b:第二圖案化區域</p>  
        <p type="p">136c:第三圖案化區域</p>  
        <p type="p">137:空隙</p>  
        <p type="p">139:封裝層</p>  
        <p type="p">160:平坦化層</p>  
        <p type="p">162:黏著層</p>  
        <p type="p">164:覆蓋層</p>  
        <p type="p">CF1:第一彩色濾光片層</p>  
        <p type="p">CF2:第二彩色濾光片層</p>  
        <p type="p">CF3:第三彩色濾光片層</p>  
        <p type="p">SP1:第一子像素</p>  
        <p type="p">SP2:第二子像素</p>  
        <p type="p">SP3:第三子像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2426" publication-number="202628046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設備</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251117B">G09G3/32</main-classification>  
        <further-classification edition="200601120251117B">G06F3/01</further-classification>  
        <further-classification edition="200601120251117B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔庚源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, KYOUNG-WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了一種顯示設備用於：基於視線的焦點位置與注視點渲染資訊，選擇視線焦點區域作為掃描驅動起點，其中視線焦點區域為使用者視線所聚焦的區域；並且先將掃描訊號供應至視線焦點區域作為掃描驅動起點。此設計可改善響應特性並降低延遲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display apparatus configured to: select a gaze focus area as a scan driving start point, based on a focus position of a gaze and foveated rendering information, where the gaze focus area is an area on which the gaze of a user is being focused; and first supply a scan signal to the gaze focus area as the scan driving start point. This improves response characteristics and reduces latency.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2427" publication-number="202628510"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628510.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空腔印刷電路板及其製造方法</chinese-title>  
        <english-title>CAVITY PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05K3/46</main-classification>  
        <further-classification edition="200601120260401B">H05K3/42</further-classification>  
        <further-classification edition="200601120260401B">H05K1/02</further-classification>  
        <further-classification edition="200601120260401B">H05K1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商梨樹飛達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISUPETASYS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林賢秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HYUN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鍾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JONG DEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金延受</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YEON SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了空腔印刷電路板及其製造方法。根據本發明一實施例的空腔印刷電路板包括：第一基底基板，其包括由一面貫穿至另一面的第一貫通孔；以及第二基底基板，其一面層積有所述第一基底基板，且形成有空腔，所述空腔包括用於露出所述第一貫通孔的區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cavity printed circuit board and a method for manufacturing the same are provided. The cavity printed circuit board, according to one embodiment, comprises: a first base substrate including a first through-hole extending from one surface to the other surface; and a second base substrate having the first base substrate laminated on one surface, the second base substrate having a cavity formed thereon, including a region where the first through-hole is exposed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:印刷電路板</p>  
        <p type="p">100:第一基底基板</p>  
        <p type="p">101:第一貫通孔</p>  
        <p type="p">103:鍍層</p>  
        <p type="p">105a:覆蓋層的一部分</p>  
        <p type="p">107:高速信號傳輸用電路圖案</p>  
        <p type="p">10a(10):第一部件</p>  
        <p type="p">10b(10):第二部件</p>  
        <p type="p">11:壓接式電氣連接端子</p>  
        <p type="p">200:第二基底基板</p>  
        <p type="p">210:空腔</p>  
        <p type="p">CL:第一基底基板100和第二基底基板200之間的中心線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2428" publication-number="202628204"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628204.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鉛蓄電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">H01M4/14</main-classification>  
        <further-classification edition="200601120260331B">H01M4/62</further-classification>  
        <further-classification edition="200601120260331B">H01M10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商傑士湯淺國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GS YUASA INTERNATIONAL LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>籠橋宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAGOHASHI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郡健一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORI, KENICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鉛蓄電池，包括極板群組、電解液、以及電池槽，所述鉛蓄電池中，極板群組包含正極板、負極板、以及隔板，於鉛蓄電池的與電池槽的底部平行的剖面（CS）中，存在於較極板群組的外緣更靠外側處的電解液的剖面積（Se）相對於極板群組的剖面積（Sg）的比率Ra為0.20以下，正極板的剖面積（Sp）相對於由電池槽的內緣包圍的區域的面積（S）的比率Rb為0.30以上，負極板包含負極集電體與負極電極材料，負極電極材料包含有機防縮劑，有機防縮劑包含60質量%以上且90質量%以下的硫酸不溶成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鉛蓄電池</p>  
        <p type="p">2:正極板</p>  
        <p type="p">3:負極板</p>  
        <p type="p">4:隔板</p>  
        <p type="p">5:負極帶</p>  
        <p type="p">6:正極帶</p>  
        <p type="p">7:負極柱</p>  
        <p type="p">8:貫通連接體</p>  
        <p type="p">9:正極柱</p>  
        <p type="p">11:極板群組</p>  
        <p type="p">12:電池槽</p>  
        <p type="p">13:隔離壁</p>  
        <p type="p">14:單元室</p>  
        <p type="p">15:蓋</p>  
        <p type="p">16:正極端子</p>  
        <p type="p">17:負極端子</p>  
        <p type="p">18:液口栓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2429" publication-number="202628629"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628629.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>場效電晶體</chinese-title>  
        <english-title>FIELD-EFFECT TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D30/62</main-classification>  
        <further-classification edition="202501120260327B">H10D64/27</further-classification>  
        <further-classification edition="202501120260327B">H10D64/68</further-classification>  
        <further-classification edition="202501120260327B">H10D62/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＤＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TDK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有馬潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明在具有鰭片型構造且電流於基板之厚度方向流動的場效電晶體中，可抑制斷開時因電場集中所引起之絕緣破壞。 &lt;br/&gt;本發明之場效電晶體100具備有：半導體基板10；漂移層20，其被設在半導體基板10的上表面11上，並具有複數個鰭片構造部23；閘極電極62，其介插第1絕緣膜61而至少覆蓋複數個鰭片構造部23的側面23S；源極電極30，其連接於複數個鰭片構造部23的上面23T；以及汲極電極40，其連接於半導體基板10的背面12。閘極電極62包含本體部60與端子部63。端子部63與漂移層20之間的距離係大於第1絕緣膜61中覆蓋溝槽區域21的底部22且位於本體部60與漂移層20之間的部分之厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure suppresses dielectric breakdown caused by electric-field concentration during turn-off in a fin-type field-effect transistor in which current flows in the thickness direction of the substrate. &lt;br/&gt;A field-effect transistor 100 according to the disclosure includes: a semiconductor substrate 10; a drift layer 20 disposed on an upper surface 11 of the semiconductor substrate 10 and having a plurality of fin structures 23; a gate electrode 62 covering at least the side surfaces 23S of the plurality of fin structures 23 with a first insulating film 61 interposed therebetween; a source electrode 30 connected to the top surfaces 23T of the plurality of fin structures 23; and a drain electrode 40 connected to the back surface 12 of the semiconductor substrate 10. The gate electrode 62 includes a body portion 60 and a terminal portion 63. The distance between the terminal portion 63 and the drift layer 20 is greater than the thickness of the portion of the first insulating film 61 that covers the bottom 22 of the trench region 21 and is located between the body portion 60 and the drift layer 20.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體基板</p>  
        <p type="p">11:上表面</p>  
        <p type="p">12:背面</p>  
        <p type="p">20:漂移層</p>  
        <p type="p">21:溝槽區域</p>  
        <p type="p">22:底部</p>  
        <p type="p">23:鰭片構造部</p>  
        <p type="p">23S:側面</p>  
        <p type="p">23T:上面</p>  
        <p type="p">24:n&lt;sup&gt;+&lt;/sup&gt;層</p>  
        <p type="p">30:源極電極</p>  
        <p type="p">40:汲極電極</p>  
        <p type="p">60:本體部</p>  
        <p type="p">60A:邊緣部分</p>  
        <p type="p">61:絕緣膜</p>  
        <p type="p">62:閘極電極</p>  
        <p type="p">62A:邊緣部分</p>  
        <p type="p">63:端子部</p>  
        <p type="p">64:貫通孔</p>  
        <p type="p">71:絕緣膜</p>  
        <p type="p">100:場效電晶體</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2430" publication-number="202628940"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628940.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於掃描半導體晶圓之表面之噴嘴系統及噴嘴</chinese-title>  
        <english-title>NOZZLE SYSTEMS AND NOZZLES FOR SCANNING A SURFACE OF A SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P74/00</main-classification>  
        <further-classification edition="200601120260324B">H01J49/02</further-classification>  
        <further-classification edition="200601120260324B">G01N21/88</further-classification>  
        <further-classification edition="202101120260324B">G01N27/626</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商自然科學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELEMENTAL SCIENTIFIC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約斯特　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOST, TYLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷德林　丹尼爾　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEDERIN, DANIEL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪斯　畢奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTH, BEAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱瑟　傑瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASER, JARED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海恩　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEIN, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宰碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金杰閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAE MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇迪卡　史蒂芬　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUDYKA, STEPHEN H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於整合分解及掃描一半導體晶圓之系統及方法，其中一單一腔室用於分解及掃描所關注晶圓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:自動臂</p>  
        <p type="p">100:系統</p>  
        <p type="p">102:腔室</p>  
        <p type="p">104:掃描臂總成</p>  
        <p type="p">108:半導體晶圓</p>  
        <p type="p">110:晶圓支撐結構</p>  
        <p type="p">112:馬達系統</p>  
        <p type="p">114:清洗站</p>  
        <p type="p">116:腔室本體</p>  
        <p type="p">118:內部區域</p>  
        <p type="p">120:凸緣</p>  
        <p type="p">126:第一孔隙</p>  
        <p type="p">128:第二孔隙</p>  
        <p type="p">130:蓋子</p>  
        <p type="p">132:外部區域</p>  
        <p type="p">134:基座</p>  
        <p type="p">136:蓋臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2431" publication-number="202628329"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628329.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多相TLVR二次電壓應力減少</chinese-title>  
        <english-title>MULTI-PHASE TLVR SECONDARY VOLTAGE STRESS REDUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H02M1/084</main-classification>  
        <further-classification edition="200601120260327B">H02M3/158</further-classification>  
        <further-classification edition="200601120260327B">H01F27/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瑞薩電子美國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENESAS ELECTRONICS AMERICA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾鹄龙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, HULONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加哈里　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHAHARY, ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张海钰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">大體上描述用於實施多相TLVR二次電壓應力減少之系統及方法。一種半導體裝置可包含一控制器，該控制器經組態以按一預設次序將複數個脈衝寬度調變(PWM)信號映射為一第一序列以操作一跨電感器電壓調節器(TLVR)。該TLVR可包含一一次電路及一二次電路，且該一次電路可包含複數個相。該半導體裝置可進一步包含一電路，該電路經組態以將該複數個PWM信號映射至不同於該第一序列之一第二序列。該控制器可經組態以輸出該第二序列中之該複數個PWM信號以操作該TLVR。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for implementing multi-phase TLVR secondary voltage stress reduction are generally described. A semiconductor device can include a controller configured to map a plurality of pulse width modulation (PWM) signals in a default order as a first sequence to operate a trans-inductor voltage regulator (TLVR). The TLVR can include a primary circuit and a secondary circuit, and the primary circuit can include a plurality of phases. The semiconductor device can further include a circuit configured to map the plurality of PWM signals to a second sequence different from the first sequence. The controller can be configured to output the plurality of PWM signals in the second sequence to operate the TLVR.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:跨電感器電壓調節器(TLVR)系統</p>  
        <p type="p">101:控制器</p>  
        <p type="p">102:二次側電路</p>  
        <p type="p">103:TLVR群組/電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2432" publication-number="202628316"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628316.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具多個埠之適應性電壓調節</chinese-title>  
        <english-title>ADAPTIVE VOLTAGE REGULATION WITH MULTIPLE PORTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H02J7/90</main-classification>  
        <further-classification edition="200601120260327B">H02M3/156</further-classification>  
        <further-classification edition="200601120260327B">H02M1/088</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瑞薩電子美國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENESAS ELECTRONICS AMERICA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林成根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SUNGKEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓東佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, DONGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　逢闩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, FENGSHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於具多個埠之適應性電壓調節之系統及方法。裝置可包含耦合至一第一埠之一第一電壓調節器且可調節該第一埠與一電池之間的電壓。該裝置可進一步包含耦合至一第二埠之一第二電壓調節器且可調節該第二埠與該電池之間的電壓。該裝置亦可包含耦合至該第一電壓調節器、該第一埠、該第二電壓調節器及該第二埠之一旁路開關。該裝置可進一步包含經組態以操作該旁路開關之一積體電路。當該旁路開關可接通時，該第一電壓調節器可進一步經組態以調節該第二埠與該電池之間的電壓。該第二電壓調節器可進一步經組態以調節該第一埠與該電池之間的電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for adaptive voltage regulation with multiple ports are described. The device can include a first voltage regulator coupled to a first port and can regulate voltages between the first port and a battery. The device can further include a second voltage regulator coupled to a second port and can regulate voltages between the second port and the battery. The device can also include a bypass switch coupled to the first voltage regulator, the first port, the second voltage regulator and the second port. The device can further include an integrated circuit configured to operate the bypass switch. When the bypass switch can be turned on, the first voltage regulator can be further configured to regulate voltages between the second port and the battery. The second voltage regulator can be further configured to regulate voltages between the first port and the battery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:電池單元</p>  
        <p type="p">103a:埠</p>  
        <p type="p">103b:埠</p>  
        <p type="p">105a:開關/背對背(B2B)開關</p>  
        <p type="p">105b:開關/背對背(B2B)開關</p>  
        <p type="p">105c:開關/背對背(B2B)開關/第三背對背(B2B)開關</p>  
        <p type="p">107a:電壓調節器</p>  
        <p type="p">107b:電壓調節器</p>  
        <p type="p">L1:電感器</p>  
        <p type="p">L2:電感器</p>  
        <p type="p">Q1:p型金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q2:p型金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q3:p型金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q4:p型金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q5:p型金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q6:p型金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q7:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q8:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q9:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q10:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q11:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q12:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q13:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">Q14:金屬氧化物半導體場效電晶體(MOSFET)</p>  
        <p type="p">TCPC1:C型埠控制器</p>  
        <p type="p">TCPC2:C型埠控制器</p>  
        <p type="p">TCPM:C型埠管理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2433" publication-number="202627206"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627206.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬用蝕刻液、金屬用蝕刻液之製造方法及金屬用蝕刻液之原料套組</chinese-title>  
        <english-title>ETCHING SOLUTION FOR METAL, METHOD FOR PRODUCING ETCHING SOLUTION FOR METAL, AND RAW MATERIAL SET FOR ETCHING SOLUTION FOR METAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23F1/16</main-classification>  
        <further-classification edition="200601120260401B">C23F1/18</further-classification>  
        <further-classification edition="200601120260401B">C23F1/20</further-classification>  
        <further-classification edition="200601120260401B">C09K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商合同資源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODO SHIGEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後閑京介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOKAN, KYOHSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斉藤祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新開美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINGAI, YOSHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之金屬用蝕刻液，包含：使固態碘與氫碘酸反應而得的多碘離子及水性溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The metal etching solution of the present invention contains polyiodide ions and an aqueous solvent, obtained by reacting solid iodine with hydriodic acid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2434" publication-number="202626503"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626503.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體製造系統以及氣體製造系統的運轉方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">C01B32/50</main-classification>  
        <further-classification edition="200601120260401B">B01D53/14</further-classification>  
        <further-classification edition="200601120260401B">B01D53/82</further-classification>  
        <further-classification edition="200601120260401B">B01D53/96</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩田有波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOTA, ARUFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内藤皓貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAITO, TERUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大友順一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOMO, JUNICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">氣體製造系統(100)係，包括調節流路(L1、L4)的開關的切換部(21、22)，以及被連接於流路、在內部具有還原劑的中空的反應部(40A)。反應部係，經由流路被連接於供給包含二氧化碳以及氧的第1A氣體(G1A)的第一供給部(11)、與供給還原氣體的第二供給部(13)。藉由切換部，被構成為能分別切換為以下分別的接觸：從第一供給部被供給的第1A氣體與包含金屬氧化物之作為還原劑的第一還原劑的接觸，為已與第1A氣體接觸的第一還原劑之第二還原劑與還原氣體(G3)的接觸，為已與還原氣體接觸的第二還原劑之第三還原劑、與為已與第一還原劑接觸的第1A氣體之第1B氣體(G1B)的接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1,2,3:加熱器</p>  
        <p type="p">11:原料氣體供給部(第一供給部)</p>  
        <p type="p">12:生成氣體排出部</p>  
        <p type="p">13:氫發生裝置(第二供給部)</p>  
        <p type="p">14:水蒸氣排出裝置</p>  
        <p type="p">21:調整閥(第一切換部)</p>  
        <p type="p">22:調整閥(第二切換部)</p>  
        <p type="p">23,24,25:調整閥</p>  
        <p type="p">40A:反應器(反應部)</p>  
        <p type="p">50:控制部</p>  
        <p type="p">100A:氣體製造系統</p>  
        <p type="p">G1A:原料氣體(第1A氣體)</p>  
        <p type="p">G2:生成氣體</p>  
        <p type="p">G3:還原氣體</p>  
        <p type="p">G4:水蒸氣</p>  
        <p type="p">L1:原料氣體配管(流路)</p>  
        <p type="p">L2:氧去除配管(流路)</p>  
        <p type="p">L3:生成氣體配管(流路)</p>  
        <p type="p">L4:還原氣體配管(流路)</p>  
        <p type="p">L5:水蒸氣排出配管(流路)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2435" publication-number="202627813"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627813.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體控制器及記憶體系統</chinese-title>  
        <english-title>MEMORY CONTROLLER AND MEMORY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251201B">G06F12/0802</main-classification>  
        <further-classification edition="200601120251201B">G06F3/06</further-classification>  
        <further-classification edition="200601120251201B">G06F9/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申光植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, KWANG SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了記憶體控制器、記憶體裝置和記憶體系統。在實施例中，記憶體系統包括被配置為提供資料處理功能（諸如計算功能）的記憶體裝置。在記憶體系統中，在共享資料通道的N個儲存排之中的一些儲存排執行計算操作的時段的至少一部分期間，其餘儲存排中的至少一個執行一般記憶體操作（諸如寫入操作或讀取操作），從而使記憶體系統能夠在仍然提供計算操作的情況下，減少一般記憶體操作的延遲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a memory controllers, memory devices, and memory systems. In an embodiments, a memory system includes a memory device configured to provide a data processing function such as a computational function. In the memory system, during at least a part of a period in which some ranks among N ranks sharing a data channel perform a computational operation, at least one of the remaining ranks performs a general memory operation such as a write or read operation, allowing the memory system to reduce delays in the general memory operation while still providing the computational operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體系統</p>  
        <p type="p">110:記憶體裝置</p>  
        <p type="p">120:記憶體控制器</p>  
        <p type="p">200:主機裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2436" publication-number="202626956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成型體及成型體的製造方法</chinese-title>  
        <english-title>MOLDED BODY AND METHOD OF MANUFACTURING MOLDED BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">C08L69/00</main-classification>  
        <further-classification edition="200601120251210B">C08K5/5415</further-classification>  
        <further-classification edition="200601120251210B">B32B27/08</further-classification>  
        <further-classification edition="200601120251210B">B29C59/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商惠和股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIWA INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷知</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANI, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出島裕久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEJIMA, HIROHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種具有無需在成型體上形成黏接層而在高溫高濕環境中顯示出高密合性的表面的成型體。本公開的一個方案的成型體係一種光學用的由聚碳酸酯樹脂製成的成型體，其具有至少一個第一面，上述至少一個第一面具有與該成型體內部的化學組成不同的化學組成，在至少一個第一面上，水的接觸角為40°-65°，乙二醇的接觸角為20°-40°，二甲基甲醯胺的接觸角為0°-20°。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2437" publication-number="202627279"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627279.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為傢俱配件或作為結構配件設計而成的配件</chinese-title>  
        <english-title>A FITTING, CONFIGURED AS A FURNITURE FITTING OR AS A CONSTRUCTION FITTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">E05D5/02</main-classification>  
        <further-classification edition="200601120260331B">E05D7/04</further-classification>  
        <further-classification edition="200601120260331B">F16B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JULIUS BLUM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉布赫爾　西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRABHERR, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班瑟　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENZER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊哲樂　馬可斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIEZLER, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫恩　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUENG, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種配件（10），被作為傢俱配件或結構配件設計而成，其中該配件（10）用於將兩個傢俱元件（3a-3c）或結構元件相互連接起來，該配件（19）包括：&lt;br/&gt; - 至少一個基體（18），&lt;br/&gt; - 至少一個調節元件（19），該至少一個調節元件（19）以相對於該基體（18）可移動的方式安裝，&lt;br/&gt; - 至少一個調節裝置（14），用於調節該基體（18）與該調節元件（19）之間的相對位置，其中該至少一個調節裝置（14）包含可圍繞旋轉軸（21）旋轉的至少一個偏心輪（15），其中可藉由該至少一個偏心輪（15）圍繞該旋轉軸（21）的旋轉來調節該基體（18）與該調節元件（19）之間的相對位置，&lt;br/&gt; - 佈置於該至少一個偏心輪（15）之上的周向調節輪廓（23），其中當該偏心輪（15）圍繞該旋轉軸（21）旋轉時，該周向調節輪廓（23）在至少一個配合輪廓（29a）上運行，&lt;br/&gt; 其中該至少一個偏心輪（15）的該周向調節輪廓（23）及/或該至少一個配合輪廓（29a）至少在某些區域有巨觀表面結構（23a），以提高自鎖性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fitting (10), configured as a furniture fitting or as a construction fitting, the fitting (10) being configured to connect two furniture elements (3a-3c) or construction elements to each other, the fitting (10) comprising:&lt;br/&gt; - at least one base body (18),&lt;br/&gt; - at least one setting element (19) movably supported relative to the base body (18),&lt;br/&gt; - at least one adjustment device (14) for adjusting a relative position between the base body (18) and the setting element (19), the at least one adjustment device (14) including at least one eccentric (15) rotatable about a rotational axis (21), wherein the relative position between the base body (18) and the setting element (19) is adjustable by rotating the at least one eccentric (15) about the rotational axis (21),&lt;br/&gt; - a circumferential setting contour (23) arranged on the at least one eccentric (15), the circumferential setting contour (23) running along at least one counter-contour (29a) when rotating the eccentric (15) about the rotational axis (21), &lt;br/&gt; wherein the circumferential setting contour (23) of the at least one eccentric (15) and/or the at least one counter-contour (29a) at least partially includes a macroscopic surface structure (23a) in order to increase self-locking.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:配件</p>  
        <p type="p">13:固定元件</p>  
        <p type="p">14:調節裝置</p>  
        <p type="p">15:偏心輪</p>  
        <p type="p">16:另一調節裝置</p>  
        <p type="p">16a:調節元件</p>  
        <p type="p">18:基體</p>  
        <p type="p">19:調節元件</p>  
        <p type="p">21:旋轉軸</p>  
        <p type="p">22:旋轉軸</p>  
        <p type="p">23:調節輪廓</p>  
        <p type="p">23a:宏觀巨觀表面結構</p>  
        <p type="p">24:螺紋段</p>  
        <p type="p">25:桿</p>  
        <p type="p">26:接觸面</p>  
        <p type="p">27a:側桿</p>  
        <p type="p">27b:側桿</p>  
        <p type="p">28a:開口</p>  
        <p type="p">28b:開口</p>  
        <p type="p">29a:配合輪廓</p>  
        <p type="p">31:彈性結構部件</p>  
        <p type="p">31a:叉形部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2438" publication-number="202626697"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626697.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經遮蔽之IL-12細胞激素及其裂解產物</chinese-title>  
        <english-title>MASKED IL-12 CYTOKINES AND THEIR CLEAVAGE PRODUCTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K14/54</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K38/20</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾希利歐發展股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XILIO DEVELOPMENT, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅澤尼費爾德　拉斐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROZENFELD, RAPHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃斯基奧克　烏戈爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESKIOCAK, UGUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱　華偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, HUAWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約翰遜　派克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, PARKER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹金斯　庫爾特　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENKINS, KURT ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得祖里　里貝伊爾　瑪加利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEDERZOLI-RIBEIL, MAGALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托馬爾　德拉吉　辛格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMAR, DHEERAJ SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧唐納　麗貝卡　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O'DONNELL, REBEKAH KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於經遮蔽之IL-12細胞激素，其包含IL-12細胞激素或其功能片段、遮蔽部分及可經蛋白分解方式裂解之連接子。遮蔽部分遮蔽該IL-12細胞激素或其功能片段，藉此減少或阻止該IL-細胞激素或其功能片段與其同源受體之結合，但當可裂解連接子在目標位點處經過蛋白水解裂解時，該IL-12細胞激素或其功能片段變得活化，由此使得其能夠或更加能夠結合於其同源受體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to masked IL-12 cytokines, comprising an IL-12 cytokine or functional fragment thereof, a masking moiety and a proteolytically cleavable linker. The masking moiety masks the IL-12 cytokine or functional fragment thereof thereby reducing or preventing binding of the IL-cytokine or functional fragment thereof to its cognate receptor, but upon proteolytic cleavage of the cleavable linker at a target site, the IL-12 cytokine or functional fragment thereof becomes activated, which renders it capable or more capable of binding to its cognate receptor.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2439" publication-number="202627141"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627141.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鈮酸鋰濺鍍靶及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C23C14/16</main-classification>  
        <further-classification edition="200601120260330B">C04B35/495</further-classification>  
        <further-classification edition="200601120260330B">C07F1/02</further-classification>  
        <further-classification edition="200601120260330B">C04B35/645</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＸ金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JX ADVANCED METALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦山章紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URAYAMA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宗安慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUNEYASU, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈良淳史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於：提供高密度且具有微細之組織之鈮酸鋰濺鍍靶及其製造方法。一種鈮酸鋰濺鍍靶，其相對密度為80%以上，平均結晶粒徑為40 μm以下。一種鈮酸鋰濺鍍靶之製造方法，其包含將LiNbO&lt;sub&gt;3&lt;/sub&gt;粉末於非活性氣體環境中且在780℃以上1150℃以下熱壓燒結之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2440" publication-number="202628450"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628450.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無縫漫遊</chinese-title>  
        <english-title>SEAMLESS ROAMING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260321B">H04W36/08</main-classification>  
        <further-classification edition="201801120260321B">H04W76/15</further-classification>  
        <further-classification edition="200901120260321B">H04W36/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊希　喬瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHISCI, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　世耀當肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SAI YIU DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTERJADHI, ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈克　高朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIK, GAURANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉姆卡　桑凱特桑傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALAMKAR, SANKET SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾瓦　謝里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELWA, SHERIEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽里恩　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆薩薩米　克里希納庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTHUSAMY, KRISHNAKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝卡爾　尤嘉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEKAR, YOGESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛加特　維克拉姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHOGAT, VIKRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塔洽亞　圖許寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATTACHARYYA, TUSHNIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一種無線裝置可傳輸一第一請求訊息，該第一請求訊息請求準備從一第一存取點(access point, AP)多鏈路裝置(multi-link device, MLD)至一或多個候選AP MLD之中的一第二AP MLD的一服務轉變。該無線裝置可接收一第一回應訊息，該第一回應訊息指示該候選AP MLD之中的一個候選AP MLD係準備好進行該服務轉變的該第二AP MLD。該無線裝置可傳輸一第二請求訊息至該第一AP MLD或該第二AP MLD。該無線裝置可接收一第二回應訊息，該第二回應訊息指示至該第二AP MLD的該服務轉變完成，且該第二AP MLD準備好進行資料通訊。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless device may transmit a first request message that requests preparation of a service transition from a first access point (AP) multi-link device (MLD) to a second AP MLD among one or more candidate AP MLDs. The wireless device may receive a first response message that indicates that one candidate AP MLD, among the candidate AP MLDs, is the second AP MLD prepared for the service transition. The wireless device may transmit a second request message to the first AP MLD or the second AP MLD. The wireless device may receive a second response message that indicates completion of the service transition to the second AP MLD and that the second AP MLD is ready for data communications. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:實例</p>  
        <p type="p">310:客戶端</p>  
        <p type="p">315,320,325,330:AP MLD</p>  
        <p type="p">332:第一請求</p>  
        <p type="p">334:第一回應(準備回應)</p>  
        <p type="p">336:第二請求(轉變請求)</p>  
        <p type="p">338:轉變回應</p>  
        <p type="p">340:訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2441" publication-number="202628777"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628777.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H10K59/82</main-classification>  
        <further-classification edition="200601120260202B">G02F1/1333</further-classification>  
        <further-classification edition="200601120260202B">H05K1/11</further-classification>  
        <further-classification edition="200601120260202B">H05K1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪忠根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, CHOONGKEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, HYUNIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的一態樣，提供了一種顯示裝置。該顯示裝置包括：基板，包含顯示區域和非顯示區域；以及電路膜，與基板的非顯示區域中的至少一側電性連接。該電路膜包含複數個第一通孔，該些第一通孔配置為與非顯示區域重疊，並貫穿電路膜而形成。該複數個第一通孔中的一些被包含在第一組中。剩餘的第一通孔中的一些被包含在第二組中。第一組和第二組中包含的複數個第一通孔沿著第一方向與第二方向之間的方向排列，第二方向是與第一方向相交的方向。第一組和第二組在第一方向上交替設置。因此，該顯示裝置減少了非顯示區域的尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an aspect of the present disclosure, there is provided a display device. The display device includes a substrate comprising a display area and a non-display area and a circuit film electrically connected to at least one side in the non-display area of the substrate. The circuit film includes a plurality of first via holes configured to overlap the non-display area and formed through the circuit film. Some of the plurality of first via holes are included in a first group. Some of remaining first via holes are included in a second group. The plurality of first via holes included in the first and second groups are arranged in a direction between a first direction and a second direction that is a direction intersecting the first direction. The first and second groups are disposed alternately in the first direction. Therefore, the display device reduce the size of the non-display area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">101:第一焊墊</p>  
        <p type="p">102:第二焊墊</p>  
        <p type="p">107:有機發光元件</p>  
        <p type="p">108:覆蓋窗</p>  
        <p type="p">110a:基板</p>  
        <p type="p">111:第一佈線</p>  
        <p type="p">112:第二佈線</p>  
        <p type="p">160:電路膜</p>  
        <p type="p">161:第一連接焊墊</p>  
        <p type="p">162:第二連接焊墊</p>  
        <p type="p">165:第一通孔</p>  
        <p type="p">165a:第二通孔</p>  
        <p type="p">171:第一信號線</p>  
        <p type="p">172:第二信號線</p>  
        <p type="p">173:第三信號線</p>  
        <p type="p">174:第四信號線</p>  
        <p type="p">175:第五信號線</p>  
        <p type="p">180:源極驅動積體電路</p>  
        <p type="p">181:第一連接層</p>  
        <p type="p">181a:第一電極圖案層</p>  
        <p type="p">182:第二連接層</p>  
        <p type="p">182a:第二電極圖案層</p>  
        <p type="p">183:第三連接層</p>  
        <p type="p">183a:第三電極圖案層</p>  
        <p type="p">190:印刷電路</p>  
        <p type="p">191:第三連接焊墊</p>  
        <p type="p">AA:顯示區域</p>  
        <p type="p">NA:非顯示區域</p>  
        <p type="p">W1:第一寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2442" publication-number="202628102"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628102.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括用以調整字線之電壓位準之輔助電路的記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE INCLUDING ASSIST CIRCUIT FOR ADJUSTING VOLTAGE LEVEL OF WORDLINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G11C11/417</main-classification>  
        <further-classification edition="200601120260401B">G11C11/413</further-classification>  
        <further-classification edition="200601120260401B">G11C8/08</further-classification>  
        <further-classification edition="200601120260401B">G11C8/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙健熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KEONHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種記憶體裝置，其包括：一記憶體胞元陣列，其包括複數個記憶體胞元；一列解碼器，其基於自一記憶體控制器接收之一位址而選擇連接至該等複數個記憶體胞元之複數個字線中之一者；以及一字線電壓產生器，其將一字線電壓提供至一所選字線。該字線電壓產生器包括：一字線驅動器，其輸出該字線電壓，該字線電壓藉由基於一字線驅動電壓變化之一電力供應電壓而減少；一凸塊複製電路，其產生一凸塊信號，該凸塊信號具有回應於該電力供應電壓而增大或減小之一電壓位準；以及一字線電壓控制電路，其輸出該字線驅動電壓，該字線驅動電壓與該凸塊信號互補地增大或減小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a memory cell array including a plurality of memory cells; a row decoder selecting one of a plurality of wordlines connected to the plurality of memory cells based on an address received from a memory controller; and a wordline voltage generator providing a wordline voltage to a selected wordline. The wordline voltage generator includes a wordline driver outputting the wordline voltage which is reduced by a power supply voltage which varies based on a wordline driving voltage; a bump replica circuit generating a bump signal having a voltage level which increases or decreases in response to the power supply voltage; and a wordline voltage control circuit outputting the wordline driving voltage which increases or decreases complementarily to the bump signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:輔助電路</p>  
        <p type="p">1110:記憶體胞元陣列</p>  
        <p type="p">1110_1,1110_2,1110_m-1,1110_m:記憶體胞元</p>  
        <p type="p">1120:列解碼器</p>  
        <p type="p">1130:行解碼器</p>  
        <p type="p">1140:輸入/輸出電路</p>  
        <p type="p">1141:感測放大器</p>  
        <p type="p">1142:寫入驅動器</p>  
        <p type="p">1150:字線電壓產生器</p>  
        <p type="p">BL,BLB:位元線</p>  
        <p type="p">CA:行位址</p>  
        <p type="p">RA:列位址</p>  
        <p type="p">VDD:電力供應電壓</p>  
        <p type="p">VDDWL:字線驅動電壓</p>  
        <p type="p">WD1,WD2,WDm-1,WDm:字線驅動器</p>  
        <p type="p">WL1:第一字線，字線</p>  
        <p type="p">WL2:第二字線，字線</p>  
        <p type="p">WLm-1:第m-1字線，字線</p>  
        <p type="p">WLm:第m字線，字線</p>  
        <p type="p">WLB1,WLB2,WLBm-1,WLBm:互補字線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2443" publication-number="202626066"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626066.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143284</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合ＨＢＶ療法</chinese-title>  
        <english-title>COMBINATION HBV THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61K31/713</main-classification>  
        <further-classification edition="200601120260331B">A61K39/42</further-classification>  
        <further-classification edition="200601120260331B">A61P31/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商休曼斯生物醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMABS BIOMED SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商維爾生物科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIR BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴卡德吉耶夫　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKARDJIEV, ANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龐　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANG, PHILLIP S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇提　戴維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORTI, DAVIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供使用組合療法用於治療HBV感染之方法，及供使用之相關套組及組成物。組合療法的組分包括HBV基因表現抑制劑或降低HBV抗原負載之劑、及抗HBV抗體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods for treating HBV infection using combination therapies, and related kits and compositions for use. The components of the combination therapies include an inhibitor of HBV gene expression or an agent that reduces HBV antigenic load, and an anti-HBV antibody.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2444" publication-number="202627822"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627822.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運算資料儲存裝置</chinese-title>  
        <english-title>COMPUTATIONAL DATA STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G06F13/12</main-classification>  
        <further-classification edition="200601120260316B">G06F3/06</further-classification>  
        <further-classification edition="201801120260316B">G06F9/445</further-classification>  
        <further-classification edition="200601120260316B">G11C16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, CAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉斯里　亞列　亞伯拉罕　猶大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASRY, ARIEL ABRAHAM JUDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUONG, HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特里克　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRICK, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧曉琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, XIAOLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">態樣係關於一種運算資料儲存裝置，運算資料儲存裝置經組態以載入及執行資料生成程式。可在資料儲存裝置內啟用運算單元。一或多個資料生成程式可載入至運算單元中以用於其執行。在資料生成程式執行期間，資料儲存裝置可存取儲存於其中的資料以產生執行結果，然後執行結果亦可儲存在資料儲存裝置上。然後可從資料儲存裝置讀出執行結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects relate to a computational data storage device configured to load and execute data generative programs. A computing unit can be enabled within the data storage device. One or more data generative programs can be loaded into the computing unit for execution thereof. During execution of a data generative program, the data storage device can access data stored therein to produce execution results that may then also be stored on the data storage device. The execution results may then be read out of the data storage device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:設備</p>  
        <p type="p">602:CPU</p>  
        <p type="p">604:NPU</p>  
        <p type="p">606:主記憶體</p>  
        <p type="p">608:運算資料儲存裝置(DSD)</p>  
        <p type="p">610:儲存單元</p>  
        <p type="p">612:資料</p>  
        <p type="p">614:控制器</p>  
        <p type="p">616:記憶體單元</p>  
        <p type="p">618:運算邏輯單元(CLU)</p>  
        <p type="p">620:資料生成程式</p>  
        <p type="p">622:執行結果</p>  
        <p type="p">624:第一命令</p>  
        <p type="p">626:第二命令</p>  
        <p type="p">628:執行結果回應</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2445" publication-number="202627888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經由鍵相異性之機器學習快取記憶體驅逐</chinese-title>  
        <english-title>MACHINE LEARNING CACHE EVICTION VIA KEY DISSIMILARITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260321B">G06N3/0475</main-classification>  
        <further-classification edition="201601120260321B">G06F12/0891</further-classification>  
        <further-classification edition="201601120260321B">G06F12/121</further-classification>  
        <further-classification edition="201601120260321B">G06F12/0871</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樸俊英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊斯　道爾頓　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONES, DALTON JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫爾斯　馬修　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORSE, MATTHEW JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈爾　拉加夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOEL, RAGHAVV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛特　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOTT, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之某些態樣提供用於機器學習的技術及設備。在一實例方法中，存取與生成式機器學習模型相關聯的記憶體，同時使用生成式機器學習模型處理資料，。針對用於該生成式機器學習模型或由該生成式機器學習模型生成之一符記集合的各符記，該記憶體儲存對應於該符記的一各別鍵張量及一各別值張量。判定對應於符記集合之鍵張量的平均鍵張量。基於鍵張量及平均鍵張量，針對各鍵張量生成各別餘弦相似性度量。回應於判定用於對應於符記集合中之至少一符記的至少一鍵張量之各別餘弦相似性度量滿足條件而從記憶體驅逐該至少一鍵張量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Certain aspects of the present disclosure provide techniques and apparatus for machine learning. In an example method, a memory associated with a generative machine learning model is accessed while data is processed using the generative machine learning model. The memory stores, for each token of a set of tokens for, or generated by, the generative machine learning model, a respective key tensor and a respective value tensor corresponding to the token. An average key tensor of the key tensors corresponding to the set of tokens is determined. A respective cosine similarity metric is generated for each key tensor, based on the key tensor and the average key tensor. At least one key tensor corresponding to at least one token of the set of tokens is evicted from the memory in response to determining that the respective cosine similarity metric for the at least one key tensor satisfies a condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:方法</p>  
        <p type="p">805:方塊</p>  
        <p type="p">810:方塊</p>  
        <p type="p">815:方塊</p>  
        <p type="p">820:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2446" publication-number="202625897"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625897.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有害生物防治劑及防治方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A01N43/40</main-classification>  
        <further-classification edition="200601120260401B">A01P5/00</further-classification>  
        <further-classification edition="200601120260401B">A01P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三啓化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANKEI CHEMICAL CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉濱健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIHAMA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係提供一種防治劑及防治方法，其係即效地防治包含腹足類及環節動物之有害生物，且對人或家畜、寵物、鳥類安全性高。本發明係提供一種有害生物防治劑，其係以菸鹼酸或其衍生物作為有效成分。菸鹼酸或其衍生物，較佳為菸鹼酸或菸鹼醯胺，又，較佳為至少含有菸鹼酸及菸鹼醯胺兩者的混合劑。進一步地，防治劑之劑型較佳為液劑、原液散布劑、氣霧劑、固形劑、錠劑、粉劑、粒劑、餌劑、或含浸使用劑中的任一種，並且，較佳為含有0.001～30重量%之菸鹼酸或其衍生物的上述劑型。此外，本發明提供一種有害生物之防治方法，其係將有害生物防治劑從原粉末或原液以水稀釋至1ppm～100,000ppm，並以散布或含浸方式使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2447" publication-number="202628285"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628285.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於拼接連接的電連接器</chinese-title>  
        <english-title>ELECTRICAL CONNECTORS FOR SPLICING CONNECTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">H01R25/16</main-classification>  
        <further-classification edition="200601120260326B">H01R4/48</further-classification>  
        <further-classification edition="200601120260326B">H01R13/514</further-classification>  
        <further-classification edition="200601120260326B">H01R9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商理想企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEAL INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晨陶　艾倫　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANTOUT, ALAN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利德維格　傑森　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUDEWIG, JASON W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器包括外殼，該外殼界定第一埠、實質上平行於第一埠的第二埠以及實質上垂直於第一埠及第二埠的第三埠。電連接器包括匯流排，該匯流排定位於外殼內且促進複數個電導體之間的電接觸。電連接器包括複數個夾緊連接件，該複數個夾緊連接件在接合時各自固持接納於複數個埠中之至少一個中的複數個電導體中之至少一個，複數個電導體中之至少一個與匯流排進行電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector includes a housing defining a first port, a second port substantially parallel to the first port, and a third port substantially perpendicular to the first and second ports.The electrical connector includes a busbar positioned within the housing and facilitating electrical contact between the plurality of electrical conductors.The electrical connector includes a plurality of clamping connections that, when engaged, each holds at least one of the plurality of electrical conductors received in at least one of the plurality of ports in electrical connection with the busbar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電連接器</p>  
        <p type="p">102a:槓桿</p>  
        <p type="p">102b:槓桿</p>  
        <p type="p">102c:槓桿</p>  
        <p type="p">104a:槓桿</p>  
        <p type="p">104b:槓桿</p>  
        <p type="p">104c:槓桿</p>  
        <p type="p">106a:中間埠</p>  
        <p type="p">106b:中間埠</p>  
        <p type="p">106c:中間埠</p>  
        <p type="p">108a:右側埠</p>  
        <p type="p">108b:右側埠</p>  
        <p type="p">108c:右側埠</p>  
        <p type="p">112:左側部件</p>  
        <p type="p">114:中間部件</p>  
        <p type="p">116:右側部件</p>  
        <p type="p">118:接地臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2448" publication-number="202627756"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627756.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制低功率模式進入延遲的儲存裝置及其操作方法、處理資料的儲存裝置</chinese-title>  
        <english-title>STORAGE DEVICE CONTROLLING LOW POWER MODE ENTRY DELAY AND A METHOD FOR OPERATING THE SAME, STORAGE DEVICE FOR PROCESSING DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G06F1/3203</main-classification>  
        <further-classification edition="201901120251201B">G06F1/3206</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金正賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JEONG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種控制低功率模式進入延遲的儲存裝置及其操作方法，該儲存裝置包括記憶體和控制器，該記憶體用於儲存資料，該控制器基於功率模式來確定是否在多個低功率模式延遲技術之中啟用多個低功率模式進入技術中的一個或多個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a storage device controlling low power mode entry delay and method for controlling the same, the storage device includes a memory and a controller, the memory is used to store data, the controller determines whether to activate one or more of a plurality of low power mode entry techniques among a plurality of low-power mode delay techniques based on the power mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:儲存裝置</p>  
        <p type="p">110:記憶體</p>  
        <p type="p">120:控制器</p>  
        <p type="p">LOW_PWR_DELAY_1:第一低功率模式延遲技術</p>  
        <p type="p">LOW_PWR_DELAY_2:第二低功率模式延遲技術</p>  
        <p type="p">LOW_PWR_DELAY_3:第三低功率模式延遲技術</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2449" publication-number="202627543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學膜、偏光板、前面板、影像顯示裝置以及光學膜之製造方法</chinese-title>  
        <english-title>OPTICAL FILM, POLARIZING PLATE, FRONT PLATE, IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING OPTICAL FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G02B5/22</main-classification>  
        <further-classification edition="200601120260316B">C09B23/14</further-classification>  
        <further-classification edition="200601120260316B">C08J5/18</further-classification>  
        <further-classification edition="202301120260316B">H10K59/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商柯尼卡美能達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONICA MINOLTA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有本直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMOTO, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小渕礼子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBUCHI, REIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>御子柴恵美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKOSHIBA, EMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於光學膜、偏光板、前面板、影像顯示裝置及光學膜之製造方法。光學膜係包含具有源自降莰烯系單體之結構單元的環烯烴系樹脂、以及下述式(1)所示之色素化合物。光學膜在波長460nm的穿透率T(460)係70%以上，光學膜在波長460nm的穿透率T(460)與波長450nm的穿透率T(450)之差△T(T(460)-T(450))係20%以上。 &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="320px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an optical film, a polarizing plate, a front plate, an image display device, and a method for manufacturing an optical film. The optical film contains a cycloolefin-based resin having a structural unit derived from a norbornene-based monomer and a dye compound represented by the following formula (1). The transmittance T(460) of the optical film at a wavelength of 460 nm is 70% or more, and the difference ΔT(T(460)-T(450)) between the transmittance T(460) of the optical film at a wavelength of 460 nm and the transmittance T(450) at a wavelength of 450 nm is 20% or more. &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="336px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2450" publication-number="202628230"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628230.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池單元陣列、包含該電池單元陣列的電池組及車輛</chinese-title>  
        <english-title>BATTERY CELL ARRAY, AND BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260102B">H01M50/204</main-classification>  
        <further-classification edition="201401120260102B">H01M10/6568</further-classification>  
        <further-classification edition="202101120260102B">H01M50/30</further-classification>  
        <further-classification edition="200601120260102B">B60R16/033</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, EUI-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAE-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭渽勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAE-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔洙鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔泰雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TAE-WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露電池單元陣列，其能夠增加冷卻效率，以及包括該電池單元陣列的電池組和車輛。電池單元陣列包括多個電池單元；以及側邊框架，配置用於支撐多個電池單元並形成電池單元陣列的邊緣，並且多個電池單元在每個電池單元的高度方向的一個端部處被直接冷卻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a battery cell array capable of increasing cooling efficiency, and a battery pack and a vehicle including the same. The battery cell array includes a plurality of battery cells; and a side frame configured to support the plurality of battery cells and form an edge of the battery cell array, and the plurality of battery cells are directly cooled at one end in a height direction of each battery cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池單元陣列</p>  
        <p type="p">100:電池單元</p>  
        <p type="p">200:側邊框架</p>  
        <p type="p">X,Y:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2451" publication-number="202626321"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626321.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143346</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空袋成形系統、強化纖維複合成形體之製造方法及通氣層</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">B29C43/18</main-classification>  
        <further-classification edition="200601120260317B">B29C43/12</further-classification>  
        <further-classification edition="200601120260317B">B29C43/56</further-classification>  
        <further-classification edition="200601120260317B">B29C43/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上由輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小畑創一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBATA, SOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石內由圭里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIUCHI, YUKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉本純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMOTO, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大園達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZONO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種真空袋成形系統，其在強化纖維複合材料的高壓釜成形等之中，可減少廢棄物，可進行表面的外觀良好之成形體的成形。一種真空袋成形系統，其具備真空袋與前述真空袋內之排氣用的真空閥，在前述真空袋內部，收納有積層體，該積層體具有：直接配置或隔著其他構件而配置於模具上之未硬化之強化纖維複合材料、與以直接接觸的方式配置於前述未硬化之強化纖維複合材料之通氣層，前述通氣層為由以玻璃轉移溫度為100℃以下之熱塑性樹脂作為主要成分的纖維所形成之不織布。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:模具</p>  
        <p type="p">11:離型劑</p>  
        <p type="p">12:強化纖維複合材料</p>  
        <p type="p">13:通氣層</p>  
        <p type="p">14:離型薄膜</p>  
        <p type="p">15:封袋薄膜</p>  
        <p type="p">16:真空閥</p>  
        <p type="p">17:積層體</p>  
        <p type="p">18:密封膠帶(密封構件)</p>  
        <p type="p">19:真空袋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2452" publication-number="202628465"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628465.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種協作通信方法及裝置</chinese-title>  
        <english-title>A COOPERATION COMMUNICATION METHOD AND APPRATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260327B">H04W72/27</main-classification>  
        <further-classification edition="202301120260327B">H04W72/0446</further-classification>  
        <further-classification edition="200901120260327B">H04W84/12</further-classification>  
        <further-classification edition="200901120260327B">H04W88/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種多接入點MAP協作方法和裝置，應用於無線通訊領域。本申請實施例提供一種簡單有效的共用機制，被共用AP候選者將未來可返還的傳輸資源（如TXOP資源）告知給共用AP，共用AP可選擇返還的傳輸資源最多或最優的被共用AP候選者作為被共用AP，進行傳輸資源的共用。共用AP根據自身的收益作為共用傳輸資源的衡量指標，降低共用AP獲取的信息複雜度以及決策演算法的複雜度，提升了多AP協作的效率。本申請支持IEEE協定，如IEEE 802.11be/Wi-Fi 7/EHT協定，IEEE 802.11bn/UHR/Wi-Fi 8協定，IEEE Integrated mmWave/集成毫米波/IMMW協定，IEEE 802.15/UWB協定，或IEEE 802.11bf/sensing/感知協議；本申請也可支持星閃/spark link/nearlink標準協定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a multiple access points (MAP) cooperation method and apparatus, applied to wireless communication field. This application provides a simple and effective sharing mechanism. A candidate shared AP informs a sharing AP of a return transmission resource (such as a TXOP resource) in the future, the sharing AP selects a candidate shared AP, which has the most or optimal return transmission resource, as a shared AP, for sharing transmission resources. The sharing AP uses its own benefit as a metric of sharing the transmission resources, which reduces the complexity of information obtained by the sharing AP and the complexity of the decision algorithm, and improves the efficiency of MAP cooperation. This application can support IEEE protocols, such as 802.11be, Wi-Fi 7, EHT, IEEE 802.11bn, UHR, Wi-Fi 8, IEEE Integrated mmWave (IMMW), IEEE 802.15, UWB, IEEEE 802.11bf, or Wi-Fi Sensing; this application also can support sparklink/nearlink protocols.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2453" publication-number="202626480"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626480.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143373</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於將鋁箔蓋密封到罐體或框架的密封凸緣上以形成罐體的方法</chinese-title>  
        <english-title>METHOD FOR SEALING A FOIL LID ONTO A SEALING FLANGE OF A CAN BODY OR A FRAME TO FORM A CAN BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B67B3/00</main-classification>  
        <further-classification edition="200601120260331B">B67B3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商蘇德龍尼克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUDRONIC AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝瓦萊　弗朗索瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEVALLEY, FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉西　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GYSI, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈斯　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAAS, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭道特　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANDOLT, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧伯霍澤　馬歇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBERHOLZER, MARCEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史陶比爾　葛哈德　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAEUBLI, GERHARD DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於將一鋁箔蓋（9）密封在一罐體或一框架（8）之一密封凸緣（7）上以用於形成一罐體的方法。藉此，提供一罐體或一框架（8），其在一第一末端（A）之區域中形成由一密封凸緣（7）包圍的一第一開口。 &lt;br/&gt;該密封凸緣（7）在一第一加熱步驟中加熱至低於所要密封溫度之一溫度，並且該溫度經判定。此後，在一第二加熱步驟中實行該密封凸緣（7）之一進一步加熱，其中取決於在該第一加熱步驟之後該密封凸緣（7）之該溫度而調節經引入熱量。 &lt;br/&gt;隨後，將由一可密封箔材料製成之一鋁箔蓋（9）密封至該密封凸緣（7）上以使得該第一開口由該鋁箔蓋（9）密封。 &lt;br/&gt;根據本發明之方法使得有可能即使在高製造速度以及所提供罐體或框架（8）之變化材料溫度下亦始終確保該所要密封溫度，藉此促進一始終良好密封接縫品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for sealing a foil lid (9) on a sealing flange (7) of a can body or a frame (8) for forming a can body. Thereby, a can body or a frame (8) is provided, which forms a first opening surrounded by a sealing flange (7) in the area of a first end (A). &lt;br/&gt;The sealing flange (7) is heated up in a first heating step to a temperature below the desired sealing temperature and the temperature is determined. Thereafter, a further heating of the sealing flange (7) is carried out in a second heating step, wherein the introduced heat quantity is adjusted depending on the temperature of the sealing flange (7) after the first heating step. &lt;br/&gt;Subsequently, a foil lid (9) made of a sealable foil material is sealed onto the sealing flange (7) such that the first opening is sealed by the foil lid (9). &lt;br/&gt;The method according to the invention makes it possible to always ensure the desired sealing temperature even at high production speeds and varying material temperatures of the provided can bodies or frames (8), thereby promoting a consistently good seal seam quality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雙軌封口機/封口機/裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2454" publication-number="202628956"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628956.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脈衝閥歧管總成、兩部件脈衝閥歧管總成及單部件脈衝閥歧管</chinese-title>  
        <english-title>PULSE VALVE MANIFOLD ASSEMBLY, TWO PART PULSE VALVE MANIFOLD ASSEMBLY, AND SINGLE PART PULSE VALVE MANIFOLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P95/00</main-classification>  
        <further-classification edition="200601120260325B">C23C16/54</further-classification>  
        <further-classification edition="200601120260325B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹布拉　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'AMBRA, ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖爾希巴格瓦萊　謝什拉傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TULSHIBAGWALE, SHESHRAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南德瓦納　丁卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANDWANA, DINKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法爾科內　克里斯托弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FALCONE, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙克提　維許努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAKTI, VISHNU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩漢加　庫達誇謝　費斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NHANGA, KUDAKWASHE FAITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ZW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種脈衝閥歧管(PVM)總成包括一脈衝閥歧管。該脈衝閥歧管係由兩個或更少個歧管部件形成。該脈衝閥歧管包括：一管區段，其具有一進入口以使一反應物能夠進入該脈衝閥歧管；一矩形區塊區段，其具有一頂表面及一底表面，其中該頂表面連接至該管區段；及一基底區段，其連接至該底表面，具有一出口以使該反應物氣體流出至一噴淋頭。可使用積層製造(諸如3D印刷)來形成一單部件脈衝閥歧管。替代地，可形成一兩部件脈衝閥歧管，其具有包括該管區段之一頂部區段及包括該基底之一底部區段。該脈衝閥歧管進一步包括一潤濕路徑，其使一反應物氣體自該進入口流動至該出口，且該潤濕路徑可包括一螺旋形區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pulse valve manifold (PVM) assembly includes a PVM. The PVM is formed from two or less manifold parts. The PVM includes a pipe section having an entry inlet to enable a reactant to enter the PVM, a rectangular block section having a top surface and a bottom surface, wherein the top surface is connected to the pipe section, and a base section connected to the bottom surface having an outlet to flow the reactant gas out to a showerhead. A single part PVM may be formed using additive manufacturing (such as 3D printing). Alternatively, a two-part PVM may be formed having a top section including the pipe section and a bottom section including the base. The PVM further includes a wetted path that flows a reactant gas from the entry inlet to the outlet, and the wetted path may include a helical section.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:脈衝閥歧管</p>  
        <p type="p">202:入口</p>  
        <p type="p">204:第一側入口/入口</p>  
        <p type="p">206:第二側入口/入口</p>  
        <p type="p">208:第三側入口/入口</p>  
        <p type="p">212:中間中心路徑</p>  
        <p type="p">214:出口</p>  
        <p type="p">222:窄中心路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2455" publication-number="202628229"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628229.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池包及包含該電池包的車輛</chinese-title>  
        <english-title>BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260102B">H01M50/141</main-classification>  
        <further-classification edition="202101120260102B">H01M50/186</further-classification>  
        <further-classification edition="202101120260102B">H01M50/198</further-classification>  
        <further-classification edition="200601120260102B">C09J133/08</further-classification>  
        <further-classification edition="200601120260102B">C08J9/14</further-classification>  
        <further-classification edition="200601120260102B">B60R16/033</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴成奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNG-KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種電池包，其包括至少一個電池芯陣列，在至少一個電池芯陣列的至少一個側上設置有電路板單元；以及電池包殼體，經配置以容納至少一個電池芯陣列，其中電路板單元具有防止冷卻介質流動進入電路板單元的防水結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a battery pack, which includes at least one battery cell array having an electrical board unit provided on at least one side; and a pack case configured to accommodate the at least one battery cell array, wherein the electrical board unit has a waterproof structure that prevents a cooling medium from flowing into the electrical board unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池芯陣列</p>  
        <p type="p">50:電池包殼體</p>  
        <p type="p">100:電路板單元</p>  
        <p type="p">X、Y、Z:軸/方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2456" publication-number="202626572"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626572.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎓鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>ONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C25/18</main-classification>  
        <further-classification edition="200601120260401B">C07C309/42</further-classification>  
        <further-classification edition="200601120260401B">C07C309/43</further-classification>  
        <further-classification edition="200601120260401B">C07C309/48</further-classification>  
        <further-classification edition="200601120260401B">C07C309/74</further-classification>  
        <further-classification edition="200601120260401B">C07C381/12</further-classification>  
        <further-classification edition="200601120260401B">C07D307/77</further-classification>  
        <further-classification edition="200601120260401B">C07D327/08</further-classification>  
        <further-classification edition="200601120260401B">C07D333/76</further-classification>  
        <further-classification edition="200601120260401B">C08F232/08</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供：在使用高能射線之光微影中，係溶劑溶解性優異，高感度、高對比度，且LWR、CDU、EL、DOF等微影性能優異的化學增幅阻劑組成物中使用之鋶鹽型單體；包含來自該鋶鹽型單體之重複單元的聚合物；包含該聚合物之化學增幅阻劑組成物；以及使用該化學增幅阻劑組成物之圖案形成方法。 &lt;br/&gt;本發明之解決手段為下式(A)表示之鎓鹽型單體。 &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="520px" file="ed10253.JPG" alt="ed10253.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An onium salt monomer containing an aromatic sulfonic acid anion having a partial structure of a fused ring aromatic compound, specifically acenaphthylene is provided. A chemically amplified resist composition comprising a polymer comprising repeat units derived from the onium salt monomer has satisfactory solvent solubility, high sensitivity, and high contrast, and forms a resist film with improved lithography properties including LWR, CDU, EL and DOF.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2457" publication-number="202628259"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628259.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器端子、連接器和連接器組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">H01R13/24</main-classification>  
        <further-classification edition="200601120260331B">H01R13/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰科電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周文霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WENXIA (CECILY)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙玉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YUQIANG (THOMAS)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, WILLIAM (WEI)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種連接器端子、連接器和連接器組件。所述連接器端子包括：對配部，具有在其縱向上相對的前環部和後筒部以及位於所述前環部和所述後筒部之間的彈性部。所述彈性部包括在所述對配部的高度方向上相對的上彈臂和下彈臂以及在所述對配部的橫向上相對的左彈臂和右彈臂，所述彈性部的上彈臂、下彈臂、左彈臂和右彈臂適於與插入所述對配部中的對配端子同時電接觸。在本發明中，連接器端子能夠與插入的對配端子的四個側面同時電接觸，提高了電接觸可靠性和穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接器端子</p>  
        <p type="p">10:彈性部</p>  
        <p type="p">11:上彈臂</p>  
        <p type="p">13:左彈臂</p>  
        <p type="p">15:上U型臂</p>  
        <p type="p">15a:上U型槽</p>  
        <p type="p">17:前環部</p>  
        <p type="p">18:後筒部</p>  
        <p type="p">19:壓接部</p>  
        <p type="p">100:對配部</p>  
        <p type="p">180:鎖定部</p>  
        <p type="p">191:第一壓接部</p>  
        <p type="p">192:第二壓接部</p>  
        <p type="p">X:橫向</p>  
        <p type="p">Y:縱向</p>  
        <p type="p">Z:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2458" publication-number="202626473"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626473.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃板的製造方法及支撐裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B65H3/50</main-classification>  
        <further-classification edition="200601120260331B">B65H3/08</further-classification>  
        <further-classification edition="200601120260331B">B65G49/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永大生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, HIROO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茗原貴裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOHARA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大藤正直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OFUJI, MASANAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森伸広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, NOBUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種玻璃板的製造方法，包含取出步驟S，所述取出步驟S中，使用對保護片3的自玻璃板2伸出的伸出部3a進行保持的取出裝置6，自裝載於托盤4的玻璃板2與保護片3的積層體1中依次取出最前表面側的保護片3，在取出步驟S中，使支撐構件7位於在積層體1中沿前後方向排列的多張保護片3的伸出部3a、伸出部3a間，並自後方側支撐較支撐構件7更靠前方的伸出部3a。藉此，可防止伸出部3a向後方側的傾倒，可防止對其保持失敗。另外，由於可避免取出裝置6為了保持伸出部3a而必須移動的距離的延長，因此亦可縮短取出步驟S的節拍時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:積層體</p>  
        <p type="p">2:玻璃板</p>  
        <p type="p">2T:取出對象玻璃板</p>  
        <p type="p">3:保護片</p>  
        <p type="p">3a:伸出部</p>  
        <p type="p">3aa:上方伸出部</p>  
        <p type="p">3T:取出對象片</p>  
        <p type="p">4:取出對象片</p>  
        <p type="p">4b:靠背部</p>  
        <p type="p">5:支撐裝置</p>  
        <p type="p">6:取出裝置</p>  
        <p type="p">7:支撐構件</p>  
        <p type="p">7a:上緣部</p>  
        <p type="p">8:移動機構</p>  
        <p type="p">9:顏色感測器(檢測裝置)</p>  
        <p type="p">10:吸附墊</p>  
        <p type="p">11:臂</p>  
        <p type="p">12:驅動部</p>  
        <p type="p">71:第一支撐構件</p>  
        <p type="p">72:第二支撐構件</p>  
        <p type="p">73:第三支撐構件</p>  
        <p type="p">A1:吸附區</p>  
        <p type="p">A2:識別區</p>  
        <p type="p">P1:支撐位置</p>  
        <p type="p">S:取出步驟</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2459" publication-number="202626652"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626652.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＴＲＥＭ２調節劑</chinese-title>  
        <english-title>TREM2 MODULATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D487/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification>  
        <further-classification edition="200601120260401B">A61P19/00</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商穆納醫療有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUNA THERAPEUTICS APS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布希　彼德森　雅各</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUSCH-PETERSEN, JAKOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>惠特洛克　嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITLOCK, GAVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗拉格斯塔　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAGSTAD, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於可用於調節骨髓細胞上表現之觸發受體2（「TREM2」）的化合物。本發明亦關於用於治療與TREM2功能喪失相關之病狀，諸如神經退化性疾病的化合物，且亦關於包含該等化合物之醫藥組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to compounds useful for modulating Triggering Receptor Expressed on Myeloid Cells-2 (“TREM2”). The invention also relates to the compounds for use in treatment of conditions related to loss of function of TREM2, such as neurodegenerative diseases, and to pharmaceutical compositions comprising the compounds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2460" publication-number="202626573"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626573.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143407</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎓鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>ONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C25/18</main-classification>  
        <further-classification edition="200601120260401B">C07C381/12</further-classification>  
        <further-classification edition="200601120260401B">C07D207/452</further-classification>  
        <further-classification edition="200601120260401B">C07D327/08</further-classification>  
        <further-classification edition="200601120260401B">C07D333/76</further-classification>  
        <further-classification edition="200601120260401B">C07D405/12</further-classification>  
        <further-classification edition="200601120260401B">C08F222/40</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供：在使用高能射線之光微影中，係溶劑溶解性優異，高感度、高對比度，且LWR、CDU、EL、DOF等微影性能優異的化學增幅阻劑組成物中使用之鋶鹽型單體；包含來自該鋶鹽型單體之重複單元的聚合物；包含該聚合物之化學增幅阻劑組成物；以及使用該化學增幅阻劑組成物之圖案形成方法。 &lt;br/&gt;本發明之解決手段為下式(A)表示之鎓鹽型單體。 &lt;br/&gt;&lt;img align="absmiddle" height="160px" width="473px" file="ed10258.JPG" alt="ed10258.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An onium salt monomer containing an aromatic sulfonic acid anion having a polymerizable group of maleimide structure is provided. A chemically amplified resist composition comprising a polymer comprising repeat units derived from the onium salt monomer has high sensitivity and high contrast, and forms a resist film with improved lithography properties including LWR, CDU, EL and DOF as well as etching resistance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2461" publication-number="202628287"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628287.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143420</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過智慧型溫度調整及監測演算法減少水消耗量</chinese-title>  
        <english-title>REDUCED WATER CONSUMPTION THROUGH SMART TEMPERATURE ADJUST AND MONITOR ALGORITHM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H01S3/041</main-classification>  
        <further-classification edition="200601120260401B">H01S3/10</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商希瑪有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CYMER, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加格　阿尤許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARG, AYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於調整一雷射設備中之一氣體腔室之一目標溫度的系統及方法，其包含監測該雷射之效能參數，及基於此類監測之結果而更新該目標溫度。可使該目標溫度遞增或遞減以最佳化雷射氣體溫度。此類最佳化可改良效能、減少誤差並減少一冷卻系統中之資源水消耗量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for adjusting a target temperature of a gas chamber in a laser apparatus comprises monitoring performance parameters of the laser and updating the target temperature based on the results of such monitoring. The target temperature may be incrementally increased or decreased to optimize the laser gas temperature. Such optimization may improve performance, reduce errors, and reduce water consumption of resources in a cooling system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:溫度控制系統</p>  
        <p type="p">310:進水口</p>  
        <p type="p">311:水管路</p>  
        <p type="p">312:鼓風機模組</p>  
        <p type="p">313:氣體腔室</p>  
        <p type="p">314:脈衝功率模組</p>  
        <p type="p">315:流量計</p>  
        <p type="p">316:流量控制閥</p>  
        <p type="p">317:加熱器</p>  
        <p type="p">318:溫度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2462" publication-number="202626865"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626865.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻焊劑用硬化性樹脂組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260309B">C08G73/06</main-classification>  
        <further-classification edition="200601120260309B">C08F8/46</further-classification>  
        <further-classification edition="201801120260309B">C08K3/011</further-classification>  
        <further-classification edition="201401120260309B">C09D11/101</further-classification>  
        <further-classification edition="200601120260309B">G03F7/037</further-classification>  
        <further-classification edition="200601120260309B">C08G59/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤雄貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤吉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUMI, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種阻焊劑用硬化性樹脂組合物，其印刷性優異，該組合物的硬化物的玻璃轉移溫度高、熱膨脹係數低、焊料耐熱性優異、黏合性優異且相對介電常數及介電損耗正切低。 &lt;br/&gt;一種阻焊劑用硬化性樹脂組合物，其含有：（A）下述式（1）所示之雙馬來醯亞胺化合物 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="171px" width="671px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（1）中，A係獨立地表示包含環狀結構之四價有機基。B係獨立地為源自二聚物酸骨架的二價烴基。Q係獨立地為具有二價脂環式結構之烴基或具有芳香環之烴基。W為B或Q。n為1～100的數，m為1～100的數。又，由n及m所括起來之各重複單元的順序為任意。）；（B）檸康醯亞胺（citraconimide）化合物；（C）環氧樹脂；（D）硬化促進劑；以及（E）無機填充劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2463" publication-number="202628728"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628728.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功能面板、顯示裝置、輸入/輸出裝置、資料處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260320B">H10H29/10</main-classification>  
        <further-classification edition="202301120260320B">H10K59/00</further-classification>  
        <further-classification edition="201601120260320B">G09G3/32</further-classification>  
        <further-classification edition="200601120260320B">G06F3/147</further-classification>  
        <further-classification edition="200601120260320B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村太紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清野史康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEINO, FUMIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青山智哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAMA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石曽根崇浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHISONE, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種方便性、實用性或可靠性優異的新穎的功能面板。功能面板包括第一元件、第一反射膜及絕緣膜，第一元件包括第一電極、第二電極及包含發光性材料的層，包含發光性材料的層包括夾在第一電極與第二電極之間的區域，第一電極具有透光性，第一電極具有第一厚度，第一反射膜包括在與包含發光性材料的層之間夾有第一電極的區域，第一反射膜具有第二厚度。絕緣膜包括第一開口，第一開口與第一電極重疊，絕緣膜具有第一步階剖面形狀，第一步階剖面形狀圍繞第一開口，第一步階剖面形狀具有第一水平差，第一水平差為第一厚度與第二厚度之和的厚度以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">528:絕緣膜</p>  
        <p type="p">528h:開口</p>  
        <p type="p">550B:元件</p>  
        <p type="p">550G:元件</p>  
        <p type="p">700:功能面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2464" publication-number="202627529"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627529.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學薄膜及影像顯示裝置</chinese-title>  
        <english-title>OPTICAL FILM AND IMAGE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G02B1/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版巴川光學薄膜股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN TOMOEGAWA OPTICAL FILMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林和嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋裕介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種使用由聚酯系樹脂構成的薄膜作為基材，係薄型，且強度及平坦性優異之光學薄膜及使用其之影像顯示裝置。一種光學薄膜，其係於基材薄膜上形成有表面處理層的光學薄膜，其中基材薄膜係平均膜厚為13μm以上60μm以下的聚酯複合材，基材薄膜的最小楊氏模數E&lt;sub&gt;min&lt;/sub&gt;、最大楊氏模數E&lt;sub&gt;max&lt;/sub&gt;係滿足E&lt;sub&gt;max&lt;/sub&gt;/E&lt;sub&gt;min&lt;/sub&gt;≦1.3的條件，表面處理層的平均膜厚為2.0μm以上15.0μm以下，且以下述式(1)所定義的表面處理層的膜厚變動比率Vr為15%以下。&lt;br/&gt; Vr=(V&lt;sub&gt;max&lt;/sub&gt;/T&lt;sub&gt;avg&lt;/sub&gt;)×100</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學薄膜</p>  
        <p type="p">2:基材薄膜</p>  
        <p type="p">3:表面處理層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2465" publication-number="202628148"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628148.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子元件之製造方法、及媒介</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H01G4/12</main-classification>  
        <further-classification edition="200601120260330B">C04B35/64</further-classification>  
        <further-classification edition="200601120260330B">H01C17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新東工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINTOKOGIO, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野雅雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於包含陶瓷材料之電子元件中能夠避免燒結時研磨屑發生化學反應而使電子元件之品質劣化之技術。電子元件之製造方法包括如下工序：準備由陶瓷材料構成之未燒成或低溫燒成之電子元件本體之工序；對電子元件本體進行滾筒研磨之工序；以及對滾筒研磨後之電子元件本體進行燒成之工序；滾筒研磨係使用僅由在未達燒成工序之溫度下昇華之材料構成之媒介進行，燒成工序包括燒結電子元件本體並使滾筒研磨中產生之研磨屑燒掉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2466" publication-number="202628461"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628461.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於全雙工系統的上行鏈路控制通道重複</chinese-title>  
        <english-title>UPLINK CONTROL CHANNEL REPETITIONS FOR FULL-DUPLEX SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260327B">H04W72/0446</main-classification>  
        <further-classification edition="200601120260327B">H04L5/14</further-classification>  
        <further-classification edition="200601120260327B">H04L1/08</further-classification>  
        <further-classification edition="202301120260327B">H04W72/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿布達加法爾　穆罕默德賽義德凱里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABDELGHAFFAR, MUHAMMAD SAYED KHAIRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊普拉欣　阿普杜勒拉曼穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IBRAHIM, ABDELRAHMAN MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一網路實體可接收指示一或多個子頻帶全雙工(SBFD)時間間隔及一或多個非SBFD時間間隔的一型樣的第一資訊。該網路實體可接收與一上行鏈路控制通道通訊的多個重複相關聯的第二資訊，其中該第二資訊指示用於該多個重複的一有效時間間隔類型，且其中該有效時間間隔類型係一SBFD類型或一非SBFD類型。該網路實體可在具有如由該第一資訊指示的該有效時間間隔類型的一或多個時間間隔期間傳輸該多個重複中的一或多個重複。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a network entity may receive first information indicating a pattern of one or more subband full-duplex (SBFD) time intervals and one or more non-SBFD time intervals. The network entity may receive second information associated with multiple repetitions of an uplink control channel communication, wherein the second information is indicative of a valid time interval type for the multiple repetitions, and wherein the valid time interval type is either an SBFD type or a non-SBFD type. The network entity may transmit one or more repetitions, of the multiple repetitions, during one or more time intervals having the valid time interval type as indicated by the first information. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:實例</p>  
        <p type="p">805:第一網路實體</p>  
        <p type="p">810:第二網路實體</p>  
        <p type="p">815,820,825,820,830,835,840,845,850:元件符號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2467" publication-number="202626458"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626458.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接裝置、軌道機器人及倉儲系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B65G1/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商深圳市海柔創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAI ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>單明明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及物流倉儲技術領域，公開了一種連接裝置、軌道機器人及倉儲系統，該連接裝置應用於縱向軌道與橫向軌道間的裝配，包括：固定座，用於與縱向軌道固定連接；驅動輪，可轉動連接於固定座，且用於搭接在橫向軌道的頂端；拆裝機構，包括拉動組件、傳動組件和輔助輪，拉動組件安裝在縱向軌道上，傳動組件可擺動連接於固定座，拉動組件與傳動組件之間通過拉繩連接，輔助輪可轉動連接於傳動組件；拉動組件通過拉繩帶動傳動組件運動，以使輔助輪在第一位置和第二位置之間擺動，在第一位置時，輔助輪與橫向軌道分離，在第二位置時，輔助輪與橫向軌道相抵接。通過上述方式，本申請能夠實現軌道間的快速拆裝，並且無需登高作業，操作更加安全高效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接裝置</p>  
        <p type="p">101:第一連接裝置</p>  
        <p type="p">102:第二連接裝置</p>  
        <p type="p">131:拉動組件</p>  
        <p type="p">134:拉繩</p>  
        <p type="p">140:驅動件</p>  
        <p type="p">200:縱向軌道</p>  
        <p type="p">210:第一縱向軌道</p>  
        <p type="p">220:第二縱向軌道</p>  
        <p type="p">300:橫向軌道</p>  
        <p type="p">310:第一橫向軌道</p>  
        <p type="p">320:第二橫向軌道</p>  
        <p type="p">400:機器人主體</p>  
        <p type="p">500:軌道機器人</p>  
        <p type="p">600:貨架</p>  
        <p type="p">1000:倉儲系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2468" publication-number="202628852"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628852.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體材料處理裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR PROCESSING SEMICONDUCTOR MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P56/00</main-classification>  
        <further-classification edition="202601120260302B">H10P72/10</further-classification>  
        <further-classification edition="202601120260302B">H10P54/94</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金烔五</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈俊熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIM, JUN HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種半導體材料處理裝置，其可包括：溶液供給裝置，其向托盤或半導體材料供給臨時接合溶液；臨時接合裝置，其將半導體材料移送至上述托盤並將上述半導體材料臨時接合至上述托盤；及溶液去除裝置，其於需自上述托盤分離上述半導體材料之情形時，分解並去除上述臨時接合溶液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a semiconductor material processing apparatus, which may include: a solution supply device configured to supply a temporary bonding solution to a tray or a semiconductor material; a temporary bonding device configured to transfer the semiconductor material to the tray and temporarily bond the semiconductor material to the tray; and a solution removal device configured to decompose and remove the temporary bonding solution when separation of the semiconductor material from the tray is required.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體材料</p>  
        <p type="p">10:溶液供給裝置</p>  
        <p type="p">11:工作台</p>  
        <p type="p">12:溶液塗佈裝置</p>  
        <p type="p">13:工作台移送裝置</p>  
        <p type="p">20:臨時接合裝置</p>  
        <p type="p">21:晶片拾取器</p>  
        <p type="p">30:溶液去除裝置</p>  
        <p type="p">31:加熱器</p>  
        <p type="p">32:清洗裝置</p>  
        <p type="p">100:半導體材料處理裝置</p>  
        <p type="p">111:托板工作台</p>  
        <p type="p">C:半導體晶片</p>  
        <p type="p">DT:切割膠帶</p>  
        <p type="p">E:頂出器</p>  
        <p type="p">L:臨時接合溶液</p>  
        <p type="p">T:托盤</p>  
        <p type="p">Ta:收容槽</p>  
        <p type="p">WR:晶圓環形框架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2469" publication-number="202627618"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627618.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置、光學裝置之控制方法及助焊劑供給裝置</chinese-title>  
        <english-title>OPTICAL APPARATUS, ITS CONTROL METHOD AND FLUX FEEDING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">G02B27/40</main-classification>  
        <further-classification edition="202101120260212B">G03B15/00</further-classification>  
        <further-classification edition="200601120260212B">B23K3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金烔五</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈俊熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIM, JUN HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE GYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種光學裝置，其可包括：相機模組，形成為至少一部分可收容於基座下方，以在未使用模式時，不與移動之物體發生干涉；照明模組，於使用模式時，形成於伸出之上述相機模組而向上述相機模組之被攝體照射照明光；以及控制部，當相機模組提供之圖像資訊之相應像素值偏離基準值時，向上述相機模組與上述照明模組提供修正控制訊號以獲得清晰之圖像資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an optical device, which may include a camera module formed so that at least a part thereof can be accommodated under a base so as not to interfere with a moving object when in an unuse mode, a lighting module formed on the pulled-out camera module when in a use mode to illuminate light onto an subject of the camera module, and a control unit applying a correction control signal to the camera module and the lighting module so as to obtain clear image information when a corresponding pixel value of image information from the camera module deviates from a reference value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:助焊劑溶液</p>  
        <p type="p">11:批量板</p>  
        <p type="p">16:控制部</p>  
        <p type="p">21:基座</p>  
        <p type="p">21a:收容槽部</p>  
        <p type="p">30:光學裝置</p>  
        <p type="p">31:相機模組</p>  
        <p type="p">32:照明模組</p>  
        <p type="p">311:相機驅動裝置</p>  
        <p type="p">312:相機升降台</p>  
        <p type="p">313:相機部</p>  
        <p type="p">314:相機驅動馬達</p>  
        <p type="p">315:螺桿</p>  
        <p type="p">316:螺母構件</p>  
        <p type="p">321:發光元件</p>  
        <p type="p">322:照明升降台</p>  
        <p type="p">323:照明升降致動器</p>  
        <p type="p">324:照明角度調節致動器</p>  
        <p type="p">M:物體</p>  
        <p type="p">R:軌道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2470" publication-number="202627986"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627986.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像對焦資訊分析方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR ANALYZING IMAGE FOCUS INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251201B">G06T7/11</main-classification>  
        <further-classification edition="201701120251201B">G06T7/174</further-classification>  
        <further-classification edition="201701120251201B">G06T7/80</further-classification>  
        <further-classification edition="201701120251201B">G06T7/194</further-classification>  
        <further-classification edition="202301120251201B">H04N23/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭昌富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, CHANG BU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種影像對焦資訊分析方法，其可獲得拍攝之實際影像資訊，於上述實際影像資訊中分離感興趣之前景資訊與其他之背景資訊，利用上述前景資訊與上述背景資訊之代表值來重建為包括理想之代表前景資訊與代表背景資訊之黃金影像資訊，算出重建之上述黃金影像資訊之理想之黃金對焦值，算出上述實際影像資訊之實際舊對焦值，產生上述舊對焦值與上述黃金對焦值之比率即新對焦值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for analyzing imgae focus information which can obtain photographed actual image information, separate object information of interest and other background information from the captured actural image information, reconstruct golden image information including ideal representative object information and representative background information by using representative values of the object information and the background information, caculate an ideal golden focus value of the reconstructed golden image information, calculate an old focus value of the actual image information, and generate a new focus value which is a ratio of the old focus value and the golden ficus value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體設備</p>  
        <p type="p">2:相機</p>  
        <p type="p">3:被攝體</p>  
        <p type="p">100:對焦資訊分析裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2471" publication-number="202626960"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626960.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、乾膜及硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C08L71/12</main-classification>  
        <further-classification edition="200601120260317B">C08G71/02</further-classification>  
        <further-classification edition="200601120260317B">C08K3/36</further-classification>  
        <further-classification edition="200601120260317B">C08G77/442</further-classification>  
        <further-classification edition="202001120260317B">A61K6/62</further-classification>  
        <further-classification edition="202001120260317B">A61K6/64</further-classification>  
        <further-classification edition="200601120260317B">C08G65/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商太陽控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木拓実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲田和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKADA, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能坂麻美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOSAKA, MAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青山良朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAMA, YOSHITOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大城康太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKI, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤由美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, YUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種低溫下的嵌入性和熱學特性優異的樹脂組成物，以及使用該樹脂組成物所得之乾膜及硬化物。本發明一態樣為樹脂組成物。該樹脂組成物係含有：(A)支鏈聚苯醚；(B)交聯劑；(C)表面改質二氧化矽填料；及(D)自由基聚合起始劑。前述(C)表面改質二氧化矽填料係具有二氧化矽填料和覆膜，前述覆膜包含矽氧烷結構，該矽氧烷結構覆蓋前述二氧化矽填料表面的至少一部分，且含有苯乙烯基雙鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2472" publication-number="202626020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調配物</chinese-title>  
        <english-title>FORMULATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/132</main-classification>  
        <further-classification edition="200601120260401B">A61K9/20</further-classification>  
        <further-classification edition="200601120260401B">A61K47/12</further-classification>  
        <further-classification edition="200601120260401B">A61K47/26</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商奧法蘭股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORPHALAN S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾明　納辛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMIN, NASEEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包括三伸乙基四胺四鹽酸鹽(TETA.4HCl)之醫藥調配物。特定地，其係關於適用於向需要治療之個體一天一次投與之醫藥組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to pharmaceutical formulations comprising triethylenetetramine tetrahydrochloride (TETA.4HCl). Specifically, it relates to pharmaceutical compositions which are suitable for once a day administration to a subject in need of treatment.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2473" publication-number="202626753"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626753.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143510</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂積層體、感光性元件及圖案形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/38</main-classification>  
        <further-classification edition="200601120260401B">C08F2/44</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/033</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/09</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">H05K3/06</further-classification>  
        <further-classification edition="200601120260401B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日下智史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAKA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村祥汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三野原崇士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKANOHARA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種可兼顧高密著性與高解析度之感光性樹脂積層體、感光性元件、光阻圖案之形成方法及導體圖案製造方法。 &lt;br/&gt;本發明係提供一種感光性樹脂積層體，其係具有暫時支撐體、及於暫時支撐體上之感光性樹脂層。感光性樹脂層之平均厚度係20μm以下；感光性樹脂層係含有含（A）黏合劑聚合物、（B）具乙烯性不飽和鍵之光聚合性化合物、（C）光聚合起始劑、及（D）聚合抑制劑之感光性樹脂組成物。相對於（A）黏合劑聚合物及（B）光聚合性化合物之總量100質量份，（C）光聚合起始劑之含量係5.0質量份以上。（D）聚合抑制劑係包含具兩個以上酚性羥基之聚合抑制劑，且相對於（A）黏合劑聚合物及（B）光聚合性化合物之總量100質量份，含量係0.025質量份以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:遮光區域</p>  
        <p type="p">10:透射區域</p>  
        <p type="p">100:區域</p>  
        <p type="p">L:線</p>  
        <p type="p">S:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2474" publication-number="202629025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143514</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種半導體器件結構及其製備方法和相應晶片</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE, PREPARATION METHOD THEREOF AND CORRESPONDING CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W72/20</main-classification>  
        <further-classification edition="202601120260302B">H10W74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市聯合藍海應用材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN UNITED BLUE OCEAN APPLIED MATERIALS TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任長友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, CHANGYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊延壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種半導體器件結構及其製備方法和相應晶片，屬於半導體器件技術領域。半導體器件結構，包括金銀合金凸塊和UBM層，UBM層由種子層和粘附層組成，金銀合金凸塊底部與種子層連接，粘附層與晶片電極連接，金銀合金凸塊與粘附層的熱膨脹係數差值在9ppm/K以下。本發明提供的技術方案，解決了金銀合金凸塊與現有的UBM層不能通過高低溫迴圈可靠性測試這一技術問題，獲得的半導體器件結構及相應晶片，能夠通過各種可靠性測試，使金銀合金替代純金凸塊具備了實施可行性，從而大幅降低倒裝晶片的生產成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a semiconductor device structure, a preparation method thereof and a corresponding chip, and belongs to the technical field of semiconductor devices. The semiconductor device structure comprises a gold-silver alloy bump and a UBM layer, the UBM layer is composed of a seed layer and an adhesion layer, the bottom of the gold-silver alloy bump is connected with the seed layer, the adhesion layer is connected with a chip electrode, and the thermal expansion coefficient difference value of the gold-silver alloy bump and the adhesion layer is below 9ppm/K. According to the technical scheme provided by the invention, the technical problem that the gold-silver alloy bump and the existing UBM layer cannot pass a high-low temperature cycle reliability test is solved, the obtained semiconductor device structure and the corresponding chip can pass various reliability tests, the implementation feasibility is realized by replacing the pure gold bump with the gold-silver alloy, and the reliability of the gold-silver alloy bump is improved. Therefore, the production cost of the flip chip is greatly reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:晶圓襯底</p>  
        <p type="p">102:電極</p>  
        <p type="p">103:鈍化層</p>  
        <p type="p">104:粘附層</p>  
        <p type="p">105:種子層</p>  
        <p type="p">106:金銀合金凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2475" publication-number="202628201"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628201.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>借助於冷卻容器製造電極混合物和乾電極的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">H01M4/04</main-classification>  
        <further-classification edition="202201120260331B">B01F35/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商古斯塔夫愛立許機械製造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASCHINENFABRIK GUSTAV EIRICH GMBH &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋爾　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERL, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於借助冷卻容器製備電極混合物和乾電極的方法。本發明關於一種用於製備和調製電極混合物的方法，該電極混合物由活性材料、可選的添加劑和黏合劑構成，該方法包括以下步驟：1）在混合器的混合容器中製備電極混合物，其中在製備期間將混合物加熱到溫度T&lt;sub&gt;H&lt;/sub&gt;，其中T&lt;sub&gt;H&lt;/sub&gt; ＞ 45℃，2）將電極混合物轉移到具有冷卻容器的冷卻混合器中，冷卻容器的壁較佳地被冷卻，3）將冷卻容器中的電極混合物冷卻至少ΔT = 5℃到取出溫度T&lt;sub&gt;E&lt;/sub&gt;，該取出溫度較佳地 ＜ 35℃，4）從冷卻容器中取出電極混合物。本發明還關於一種用於從電極混合物製造乾電極的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:帶容器的混合機</p>  
        <p type="p">2:混合工具</p>  
        <p type="p">3:抽吸管</p>  
        <p type="p">4:容器旋轉軸</p>  
        <p type="p">5:混合工具旋轉軸</p>  
        <p type="p">6:計量元件</p>  
        <p type="p">7:緩衝容器</p>  
        <p type="p">8:顆粒尺寸測量設備</p>  
        <p type="p">9:文丘里噴嘴</p>  
        <p type="p">10:第二氣力輸送管線</p>  
        <p type="p">11:第一氣力輸送管線</p>  
        <p type="p">12:摩擦篩</p>  
        <p type="p">13:多輥壓延機</p>  
        <p type="p">14:料帶</p>  
        <p type="p">15:邊緣條帶</p>  
        <p type="p">16:用於氣力輸送的接收裝置</p>  
        <p type="p">19:真空泵</p>  
        <p type="p">20:雙層夾套</p>  
        <p type="p">21:進料裝置</p>  
        <p type="p">22:轉運管</p>  
        <p type="p">23:稱重感測器</p>  
        <p type="p">24:切割裝置</p>  
        <p type="p">25:輸送氣體</p>  
        <p type="p">36:氣體鬆動裝置</p>  
        <p type="p">37:分離器</p>  
        <p type="p">38:氣固分離器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2476" publication-number="202625907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143587</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>食品用品質改良劑、食品用品質改良劑之用途、烘焙食品、及烘焙食品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260401B">A23L29/10</main-classification>  
        <further-classification edition="200601120260401B">A21D2/16</further-classification>  
        <further-classification edition="200601120260401B">A21D2/08</further-classification>  
        <further-classification edition="201701120260401B">A21D13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増子朝貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUKO, TOMOSADA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山野内由貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANOUCHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田拓義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, TAKUGI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口千紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, CHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有馬哲史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種能夠長期抑制品質下降之食品用品質改良劑。 &lt;br/&gt;本發明係一種食品用品質改良劑，其包含水、離子性乳化劑(A)、具有15以上之HLB之蔗糖脂肪酸酯(B)、主要結構脂肪酸為不飽和脂肪酸且具有7以下之HLB之乳化劑(C)、及油脂(D)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2477" publication-number="202626821"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626821.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、及液晶顯示元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F293/00</main-classification>  
        <further-classification edition="200601120260401B">C08L53/00</further-classification>  
        <further-classification edition="200601120260401B">C08L71/02</further-classification>  
        <further-classification edition="200601120260401B">C08L79/08</further-classification>  
        <further-classification edition="200601120260401B">C08K5/1515</further-classification>  
        <further-classification edition="200601120260401B">C08K5/17</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三宅一世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAKE, KAZUTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森内正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIUCHI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野慎躍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHNO, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹雅倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, YALUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液晶配向劑，含有：由含有具有可聚合之不飽和烴基的聚合性基之化合物得到的聚合物α；選自於聚醯亞胺、聚醯胺酸、聚醯胺酸酯、聚醯胺、及聚脲中之至少1種的聚合物β；及下述化合物A及下述化合物B中之任一者的化合物。 &lt;br/&gt;化合物A：下述式(Add1-A)表示之化合物 &lt;br/&gt;化合物B：為分子內具有2個以上4個以下的環氧丙基，且分子內具有至少1個以上的不飽和鍵之化合物的下述式(Add1-B)表示之化合物 &lt;br/&gt;&lt;img align="absmiddle" height="98px" width="558px" file="ed10088.JPG" alt="ed10088.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(Add1-A)中，n1、m1、及m2各自獨立地表示1或2。 &lt;br/&gt;X&lt;sub&gt;1&lt;/sub&gt;及X&lt;sub&gt;2&lt;/sub&gt;表示單鍵、氧原子、-NR-(R為氫原子或甲基。)、或酯鍵。 &lt;br/&gt;A表示特定之基。) &lt;br/&gt;&lt;img align="absmiddle" height="96px" width="362px" file="ed10089.JPG" alt="ed10089.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(Add1-B)中，G表示下述式(G-1)表示之基。 &lt;br/&gt;Z表示下述式(Z-1)~(Z-2)中之任一者表示之基。) &lt;br/&gt;&lt;img align="absmiddle" height="132px" width="129px" file="ed10090.JPG" alt="ed10090.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="124px" width="237px" file="ed10091.JPG" alt="ed10091.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:橫向電場液晶顯示元件</p>  
        <p type="p">2:梳齒電極基板</p>  
        <p type="p">2a:基材</p>  
        <p type="p">2b:線狀電極</p>  
        <p type="p">2c:液晶配向膜</p>  
        <p type="p">3:液晶</p>  
        <p type="p">4:相對基板</p>  
        <p type="p">4a:液晶配向膜</p>  
        <p type="p">4b:基材</p>  
        <p type="p">L:電場線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2478" publication-number="202628468"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628468.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線通訊中的低工作循環分時雙工的隨機存取</chinese-title>  
        <english-title>RANDOM ACCESS FOR LOW-DUTY-CYCLE TIME DIVISION DUPLEXING IN WIRELESS COMMUNICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260327B">H04W74/0833</main-classification>  
        <further-classification edition="202301120260327B">H04W72/0446</further-classification>  
        <further-classification edition="200601120260327B">H04L5/14</further-classification>  
        <further-classification edition="202201120260327B">H04L47/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑古皮塔　阿亞恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENGUPTA, AYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里可　艾爾法里諾　艾爾伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICO ALVARINO, ALBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於無線通訊之提供用於低工作循環分時雙工(time division duplexing, TDD)通訊的隨機存取技術的方法、系統、及裝置。隨機存取前導碼傳輸可使用與一或多個前導碼重複單元(preamble repetition unit, PRU)相關聯的傳輸資源，其中一PRU可能至少部分地與對一傳輸無效的傳輸資源重疊。在此類情形中，可能將該PRU的該等隨機存取傳輸的全部或部分延遲至一次一有效上行鏈路通訊資源。隨機存取傳輸的延遲可針對一PRU內的符號群組在一符號群組層級、或在一PRU層級執行。進一步地，與隨機存取傳輸相關聯的無線電網路臨時識別符(RNTI)可基於與該隨機存取傳輸的一初始傳輸時機、或該經延遲傳輸時機相關聯的一系統訊框而識別。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for wireless communications are described that provide for random access techniques for low duty-cycle time division duplexing (TDD) communications. Random access preamble transmissions may use transmission resources associated with one or more preamble repetition units (PRUs), where a PRU may at least partially overlap with transmission resources that are not valid for a transmission. In such cases, all or a portion of the random access transmissions of the PRU may be postponed to a next valid uplink communication resource. Postponement of random access transmissions may be performed at a symbol-group level for symbol groups within a PRU, or at a PRU level. Further, radio network temporary identifiers (RNTIs) associated with random access transmissions may be identified based on a system frame associated with an initial transmission occasion of the random access transmission, or the postponed transmission occasion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:分時雙工(TDD)模式；TDD模式</p>  
        <p type="p">205:下行鏈路</p>  
        <p type="p">210:上行鏈路</p>  
        <p type="p">215-a:有效下行鏈路訊框</p>  
        <p type="p">215-b:有效下行鏈路訊框</p>  
        <p type="p">220-a:有效上行鏈路訊框</p>  
        <p type="p">220-b:有效上行鏈路訊框</p>  
        <p type="p">225:無效下行鏈路訊框</p>  
        <p type="p">230:無效上行鏈路訊框</p>  
        <p type="p">235:偏移</p>  
        <p type="p">240:週期性</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2479" publication-number="202626155"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626155.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具補強構件之多材料高爾夫球桿頭</chinese-title>  
        <english-title>MULTI-MATERIAL GOLF CLUB HEAD WITH REINFORCING MEMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260324B">A63B53/04</main-classification>  
        <further-classification edition="201501120260324B">A63B53/08</further-classification>  
        <further-classification edition="201501120260324B">A63B53/10</further-classification>  
        <further-classification edition="201501120260324B">A63B60/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡斯登製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARSTEN MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布貝克　柯爾Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUBAKER, COLE D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布羅克司漢　馬克Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOXHAM, MARK C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒曼　卓維斯Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLEMAN, TRAVIS D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">具全包覆式複合區域的高爾夫球桿頭設有用以提升結構完整性的凸肋。該等凸肋可包括線性或拱形部分，且可依特定排列方式配置而改善負載傳遞及聲響表現。在某些實施例中，該等凸肋是形成於該全包覆式複合區域且圍繞內表面連續延伸。於其他實施例中，該等凸肋是形成於框架上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Golf club heads with full-wrap composite regions have ribs for improving structural integrity. The ribs may include linear or arcuate segments and may be arranged in patterns to address load transfer and acoustic performance. In some embodiments, the ribs are formed on the full-wrap composite and extend continuously around an inner surface. In other embodiments, the ribs are formed on the frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:桿頭</p>  
        <p type="p">101:本體</p>  
        <p type="p">102:擊球面</p>  
        <p type="p">104:踵端</p>  
        <p type="p">105:插鞘</p>  
        <p type="p">106:趾端</p>  
        <p type="p">108:前端</p>  
        <p type="p">110:冠部</p>  
        <p type="p">111:後端</p>  
        <p type="p">112:底部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2480" publication-number="202626628"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626628.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>苯并二氧雜環或其鹽的製備方法</chinese-title>  
        <english-title>PREPARATION METHOD OF BENZODIOXANE DERIVATIVES OR SALTS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D405/04</main-classification>  
        <further-classification edition="200601120260401B">C07D405/14</further-classification>  
        <further-classification edition="200601120260401B">C07D211/10</further-classification>  
        <further-classification edition="200601120260401B">C07D211/44</further-classification>  
        <further-classification edition="200601120260401B">A61K31/454</further-classification>  
        <further-classification edition="200601120260401B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓飛朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, FEIPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欒自鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUAN, ZIHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王入志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施林峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, LINFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管凡夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUAN, FANFU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫佳琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, JIALIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及苯并二氧雜環衍生物或其鹽的製備方法。具體而言，本揭露涉及(&lt;i&gt;S&lt;/i&gt;)-4-(3-(4-氯-2-氟苯基)-2,3-二氫苯并[&lt;i&gt;b&lt;/i&gt;][1,4]二噁英-5-基)哌啶的製備方法，其具有良好的產率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to preparation method of benzodioxane derivatives or salts thereof. Specifically, the present disclosure relates to a method for preparing (S)-4-(3-(4-chloro-2-fluorophenyl)-2,3-dihydrobenz[b][1,4]dioxine-5-yl)piperidine, which exhibits excellent yield.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2481" publication-number="202628990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143625</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有內部結構部件的噴射冷卻</chinese-title>  
        <english-title>JET COOLING WITH INTERNALLY STRUCTURED PARTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10W40/40</main-classification>  
        <further-classification edition="201501120260401B">B33Y80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅洛伊企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLOY ENTERPRISES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西蒙　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMON, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛拉赫堤　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAHERTY, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　以男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米尼卻羅　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINICHIELLO, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於製造用於噴射衝擊之金屬部件之方法及系統。一些實施例包含：一金屬部件，其包括一外殼區域；及至少一個內部管系特徵，其由該外殼區域囊封且經構形以經由一流體冷卻一熱源。在一些實施例中，該內部管系特徵包括一內部通道、一輸送歧管、一洩流歧管、經構形以使該流體流動之一空隙空間、經構形以噴射該流體之一噴射孔口或用以接收該噴射流體之一目標物件之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for the manufacture of metal parts for jet impingement. Some embodiments include a metal part comprising a housing region and at least one internal plumbing feature encapsulated by the housing region and configured to cool a heat source via a fluid. In some embodiments, the internal plumbing feature comprises at least one of an internal channel, a delivery manifold, a drain manifold, a void space configured to flow the fluid, a jet orifice configured to jet the fluid, or a target object to receive the jetted fluid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:部件</p>  
        <p type="p">102:熱源</p>  
        <p type="p">104:歧管</p>  
        <p type="p">106:噴射孔口</p>  
        <p type="p">108:噴射腔室</p>  
        <p type="p">110:窗</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2482" publication-number="202627919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配送支援裝置</chinese-title>  
        <english-title>DELIVERY SUPPORT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260227B">G06Q10/087</main-classification>  
        <further-classification edition="202301120260227B">G06Q10/04</further-classification>  
        <further-classification edition="202401120260227B">G06Q10/08</further-classification>  
        <further-classification edition="202301120260227B">G06Q10/047</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｄ4Ａｌｌ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D4ALL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西郷孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIGO, TAKAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田雅人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸冨大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROTOMI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種配送支援裝置，藉由提升進行往零售店舖的商品補充之配送車輛的載台載運率之效率而追求減少配送車輛的班次，藉此，有助於減少物流相關人員之勞動時間、減少溫室氣體之排出。 &lt;br/&gt;該配送支援裝置具有：對各店舖、及在該店舖銷售的各商品，各自儲存店舖庫存量與店舖銷售量的趨勢的儲存手段；對該商品，各自儲存與該店舖庫存量相關之第1閾值、及較該第1閾值更大之第2閾值的儲存手段；對於一店舖，對商品各自算出既定期間後之店舖庫存量的預測值的手段；將與一店舖相關之店舖庫存量低於第1閾值的商品，抽出作為第1配送候選商品的手段；將與一店舖相關之店舖庫存量的預測值低於第2閾值的商品，抽出作為第2配送候選商品的手段；以及進行將第1配送候選商品及第2配送候選商品利用一車輛往一店舖配送之配送調度處理的手段。&lt;u&gt;  &lt;/u&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To contribute to the reduction of labor hours of persons involved in physical distribution and the reduction of emission of greenhouse effect gas by making of delivery vehicles for replenishing commodities to retail stores by making the load-carrying ratio of the delivery vehicles efficient. &lt;br/&gt;The information processing device includes a storage unit that stores a store inventory amount and a trend of a store sales amount for each store and for each product sold in the store, a storage unit that stores a first threshold value and a second threshold value larger than the first threshold value for the store inventory amount for each product, a unit that calculates an expected value of the store inventory amount after a predetermined period for each product with respect to one store, a unit that extracts a product of which the store inventory amount with respect to one store is less than the first threshold value as a first delivery candidate product, a unit that extracts a product of which the expected value of the store inventory amount with respect to one store is less than the second threshold value as a second delivery candidate product, and a unit that performs a delivery arrangement process of delivering the first delivery candidate product and the second delivery candidate product to one store using one vehicle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:配送支援裝置</p>  
        <p type="p">110:商品資訊儲存手段</p>  
        <p type="p">120:配送閾值儲存手段</p>  
        <p type="p">130:鄰近店舖儲存手段</p>  
        <p type="p">140:第1庫存量預測手段</p>  
        <p type="p">150:第1候選抽出手段</p>  
        <p type="p">160:第2候選抽出手段</p>  
        <p type="p">170:第2庫存量預測手段</p>  
        <p type="p">180:第3候選抽出手段</p>  
        <p type="p">190:剩餘空間判定手段</p>  
        <p type="p">200:配送手段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2483" publication-number="202627861"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627861.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品包裝提案裝置、商品包裝提案方法及商品包裝提案程式</chinese-title>  
        <english-title>PRODUCT PACKAGE PROPOSAL DEVICE, PRODUCT PACKAGE PROPOSAL METHOD AND PRODUCT PACKAGE PROPOSAL PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260306B">G06F30/27</main-classification>  
        <further-classification edition="202301120260306B">G06Q30/0201</further-classification>  
        <further-classification edition="201901120260306B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｄ4Ａｌｌ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D4ALL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西郷孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIGO, TAKAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田雅人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸冨大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROTOMI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種商品包裝提案裝置，可高精度地製作達成期望的銷售趨勢之商品包裝。該商品包裝提案裝置具有如下手段：生成藉由將商品種類及作為銷售目標的商品之銷售情形的相關特徵輸入而將商品包裝輸出之機械學習模型的手段；施行製造具備一商品包裝的商品之處理的手段，該一商品包裝係將一商品種類及作為銷售目標的商品之銷售情形的相關特徵之資料集輸入至機械學習模型而輸出；判定與具備一商品包裝的商品相關之營業額或銷售數量是否低於既定目標值的手段；使機械學習模型進行追加學習的手段；以及在判定為低於既定目標值之情況，施行製造具備其他商品包裝的商品之處理的手段，該其他商品包裝，係將一商品種類及作為銷售目標的商品之銷售情形的相關特徵之資料集輸入至追加學習後的機械學習模型而輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To accurately prepare a commodity package having an intended sales trend. The information processing device includes a unit that generates a machine learning model that outputs a product package by inputting a product type and a feature related to sales of a product to be sold, a unit that performs processing of inputting a data set of one product type and a feature related to sales of a product to be sold to the machine learning model and manufacturing a product including one output product package, a unit that performs additional learning on the machine learning model, and a unit that performs processing of inputting a data set of one product type and a feature related to sales of a product to be sold to the machine learning model after the additional learning and manufacturing a product including another output product package in a case where it is determined that the data set is below a predetermined target value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:商品包裝提案裝置</p>  
        <p type="p">110:學習資料儲存手段</p>  
        <p type="p">120:模型儲存手段</p>  
        <p type="p">130:模型生成手段</p>  
        <p type="p">140:商品製造手段</p>  
        <p type="p">150:驗證資訊算出手段</p>  
        <p type="p">160:目標達成判定手段</p>  
        <p type="p">170:追加學習手段</p>  
        <p type="p">180:商品再製造手段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2484" publication-number="202627927"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627927.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顧客服務提案裝置</chinese-title>  
        <english-title>SERVICE PROPOSAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260306B">G06Q30/015</main-classification>  
        <further-classification edition="201901120260306B">G06N20/00</further-classification>  
        <further-classification edition="202301120260306B">G06Q30/06</further-classification>  
        <further-classification edition="202301120260306B">G06Q10/0639</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｄ4Ａｌｌ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D4ALL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西郷孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIGO, TAKAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田雅人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸冨大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROTOMI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種顧客服務提案裝置，能夠以購買紀錄中的購入商品作為參考，高精度地獲得適合欲銷售商品之具體的顧客服務方法，有效率地追求營業額提升。該顧客服務提案裝置具有：生成機械學習模型的手段，該機械學習模型將銷售成功的商品、該商品銷售前的購買紀錄及銷售出商品時的顧客服務方法之資料集予以學習，將欲銷售的商品及購買紀錄輸入而將顧客服務方法輸出；將一欲銷售的商品及購買紀錄之資料集輸入至機械學習模型以生成顧客服務方法的生成手段；算出與實施了所生成之顧客服務方法的商品相關之營業額或銷售數量的手段；判定營業額或銷售數量是否低於既定目標值的手段；使機械學習模型進行追加學習的手段；以及在判定為低於目標值的情況，將一欲銷售的商品及購買紀錄之資料集輸入至追加學習後的機械學習模型，再生成其他顧客服務方法的手段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To efficiently increase sales by referring to a purchased commodity in a purchase history and accurately obtaining a specific customer service method suitable for a commodity desired to be sold. The method includes generating a machine learning model that learns a data set of a successfully sold product, a purchase history before the product is sold, and a customer service method when the product is sold, inputs a &lt;br/&gt;product to be sold and a purchase history, and outputs a customer service method, calculating sales or the number of sales relating to the product for which the generated customer service method is performed, determining whether or not the sales or the number of sales is less than a predetermined target value, causing the machine learning model to perform additional learning, and inputting the data set of the product to be sold and the purchase history to the machine learning model after the additional learning and regenerating another customer service method when it is determined that the sales or the number of sales is less than the predetermined target value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顧客服務提案裝置</p>  
        <p type="p">110:學習資料儲存手段</p>  
        <p type="p">120:模型儲存手段</p>  
        <p type="p">130:模型生成手段</p>  
        <p type="p">140:顧客服務方法生成手段</p>  
        <p type="p">150:顧客服務實施手段</p>  
        <p type="p">160:驗證資訊算出手段</p>  
        <p type="p">170:目標達成判定手段</p>  
        <p type="p">180:追加學習手段</p>  
        <p type="p">190:顧客服務方法再生成手段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2485" publication-number="202626277"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626277.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝工具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B25B13/50</main-classification>  
        <further-classification edition="200601120260331B">B25B13/52</further-classification>  
        <further-classification edition="200601120260331B">B25B25/00</further-classification>  
        <further-classification edition="200601120260331B">B25B31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商雷恩斯坦格工具公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENNSTEIG WERKZEUGE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍蘭　默里茨　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLAND-MORITZ, GEORG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德烈　喬納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREE, JONAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種安裝工具(1)，具有視情況而定的第一個實質上建構為扁平件的基體(4、5)，其中，該基體(4、5)實質上沿一平面(E)延伸，其中，在該基體(4、5)中還形成有一梅花扳手構造(9)，其具有大致垂直於平面(E)延伸的一開口軸線(A)以及沿該平面(E)之方向建構的一入口(12)，其中，在該基體(4、5)上還設有插入突出部(10、11)。本發明亦有關於一種具有第一及第二子工具(2、3)的安裝工具(1)。針對此種安裝工具之視情況亦由第一及第二子工具構成的有利建構方案，提出：該等插入突出部(10、11)係可相對於設有此等插入突出部的基體(4、5)在工作位置與保管位置之間位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:安裝工具</p>  
        <p type="p">2:(第一)子工具</p>  
        <p type="p">3:(第二)子工具</p>  
        <p type="p">5:(第二)基體</p>  
        <p type="p">6:邊緣隆起</p>  
        <p type="p">7:操縱構造</p>  
        <p type="p">9:梅花扳手構造</p>  
        <p type="p">10:插入突出部</p>  
        <p type="p">11:插入突出部</p>  
        <p type="p">12:入口</p>  
        <p type="p">13:突出部件</p>  
        <p type="p">18:彈簧部件</p>  
        <p type="p">22:環眼</p>  
        <p type="p">26:圓形部件</p>  
        <p type="p">27:腔槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2486" publication-number="202626379"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626379.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人力交通工具之輪轂及用於人力交通工具之輪子</chinese-title>  
        <english-title>HUB FOR HUMAN-POWERED VEHICLE AND WHEEL FOR HUMAN-POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260129B">B60B1/02</main-classification>  
        <further-classification edition="200601120260129B">B60B1/04</further-classification>  
        <further-classification edition="200601120260129B">B60B27/02</further-classification>  
        <further-classification edition="200601120260129B">B60B27/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下拓耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一人力交通工具之一輪子之輪轂包括一輪轂本體以及配置於該輪轂本體之相對側處之第一及第二輻條座部分。該第一輻條座部分包含圓周地延伸之一第一外表面、各接納一內輻條之內凹部及各接納一外輻條之外凹部。該等內凹部及該等外凹部配置於該第一外表面中。當軸向地觀看，該內輻條與該外輻條相交。各內凹部具有在該第一外表面中敞開之一軸向內開口及一內額外開口。該內輻條延伸穿過該內額外開口。該外凹部具有背對該軸向內開口之一軸向外開口及在該第一外表面中敞開之一外額外開口。該外輻條延伸穿過該外額外開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hub for a wheel of a human-powered vehicle comprises, a hub body and first and second spoke seats portions arranged at opposite sides of the hub body. The first spoke seats portion includes a first outer surface extending circumferentially, inner recesses, each receiving an inner spoke, and outer recesses, each receiving an outer spoke. The inner recesses and the outer recesses are arranged in the first outer surface. The inner spoke intersects with the outer spoke as viewed axially. Each inner recess has an axial inner opening and an inner additional opening which opens in the first outer surface. The inner spoke extends through the inner additional opening. The outer recess has an axial outer opening facing away from the axial inner opening and an outer additional opening which opens in the first outer surface. The outer spoke extends through the outer additional opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:輪轂</p>  
        <p type="p">22:輪轂本體</p>  
        <p type="p">26:第二輻條座部分</p>  
        <p type="p">30:第一輻條座區段</p>  
        <p type="p">32:第一內凹部</p>  
        <p type="p">34:第一外凹部</p>  
        <p type="p">R:圓周方向</p>  
        <p type="p">X:軸向方向</p>  
        <p type="p">Y:徑向方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2487" publication-number="202627203"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627203.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143669</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鋁或鋁合金之三價鉻表面處理劑及其製備方法與用途</chinese-title>  
        <english-title>TRIVALENT CHROMIUM SURFACE TREATMENT AGENT FOR ALUMINUM OR ALUMINUM ALLOY AND PREPARATION METHOD AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C22/38</main-classification>  
        <further-classification edition="200601120260401B">B65D25/14</further-classification>  
        <further-classification edition="200601120260401B">B65D25/34</further-classification>  
        <further-classification edition="200601120260401B">B65D41/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商開麥妥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEMETALL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫俊耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, JUN YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬盛興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, SHENG XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫景倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, JING LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於鋁或鋁合金之三價鉻表面處理劑，及其製備與用途。本發明提供用於鋁或鋁合金之三價鉻表面處理劑，其起始物質包含：a)六價鉻化合物；b)含有一級羥基、二級羥基及/或酚羥基之有機還原劑；c)氫氟酸；d)無機酸，其酸解離常數pKa小於氫氟酸之pKa；其中該六價鉻化合物中之Cr與理論上由該有機還原劑提供之電子之最大莫耳數之比率為1.0:3.0至5.0；該三價鉻係藉由原位還原該六價鉻化合物而獲得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a trivalent chromium surface treatment agent for aluminum or aluminum alloy, and the preparation and use thereof. The present invention provides a trivalent chromium surface treatment agent for aluminum or aluminum alloy, starting materials thereof comprising: a) a hexavalent chromium compound; b) an organic reducing agent, containing a primary hydroxyl group, a secondary hydroxyl group and/or a phenolic hydroxyl group; c) hydrofluoric acid; d) an inorganic acid, having an acid dissociation constant pKa that is less than the pKa of hydrofluoric acid; wherein the ratio of Cr in the hexavalent chromium compound to the maximum number of moles of electrons theoretically provided by the organic reducing agent is 1.0: 3.0 - 5.0; the trivalent chromium being obtained by in-situ reduction of the hexavalent chromium compound.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2488" publication-number="202628337"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628337.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馬達控制裝置、馬達控制系統及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H02P3/12</main-classification>  
        <further-classification edition="201601120260401B">H02P6/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新唐科技日本股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION JAPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森和輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田大祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下亨一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KYOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供可將減速時之馬達之負載壓力減輕之馬達控制裝置。&lt;br/&gt; [解決手段]馬達控制裝置100具備：逆變器電路20；及控制驅動電路30，朝構成逆變器電路20之複數組開關元件對之各開關元件，供給用於控制馬達10之驅動訊號，控制驅動電路30是進行朝各開關元件供給驅動訊號來令全關閉模式與短路煞車(short brake)模式交互地反覆之控制，作為降低馬達10之旋轉數之減速控制，全關閉模式是令全部的開關元件關閉，短路煞車模式是令全部的上側開關元件及全部的下側開關元件中之其中一開關元件群開啟且令全部的上側開關元件及前述全部的下側開關元件中之另一開關元件群關閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:馬達控制系統</p>  
        <p type="p">10:馬達</p>  
        <p type="p">20:逆變器電路</p>  
        <p type="p">21,23,25:上側開關元件</p>  
        <p type="p">22,24,26:下側開關元件</p>  
        <p type="p">30:控制驅動電路</p>  
        <p type="p">40:偵測電路</p>  
        <p type="p">100:馬達控制裝置</p>  
        <p type="p">GND:接地</p>  
        <p type="p">U:U相</p>  
        <p type="p">UL,UH,VL,VH,WL,WH:驅動訊號</p>  
        <p type="p">V:V相</p>  
        <p type="p">Vc:中性點電壓</p>  
        <p type="p">Vdd:電源電壓</p>  
        <p type="p">Vu:輸出電壓(U相電壓)</p>  
        <p type="p">Vv:輸出電壓(V相電壓)</p>  
        <p type="p">Vw:輸出電壓(W相電壓)</p>  
        <p type="p">W:W相</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2489" publication-number="202626457"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626457.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑動式離合器機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B65G1/04</main-classification>  
        <further-classification edition="200601120260331B">F16D11/14</further-classification>  
        <further-classification edition="200601120260331B">B60K17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川和廣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之滑動式離合器機構係具備：基部；軸，其旋轉自如地被支撐在基部上；咬合部，其被設置於軸之軸向一側的端部，且被構成為與被咬合部相咬合；及離合器，其被設置於基部與軸之間；且軸可於第1位置與第2位置之間移動，第1位置係咬合部自被咬合部離開既定距離之位置，第2位置係咬合部與被咬合部咬合之位置，離合器係當軸位於第1位置之情形時，可使基部繞軸之軸心與軸一起旋轉，當軸位於第2位置之情形時，可使軸繞軸心相對於基部而相對旋轉既定之旋轉遊隙量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:滑動式離合器機構</p>  
        <p type="p">41:驅動車輪(基部)</p>  
        <p type="p">41a:輪</p>  
        <p type="p">41b:輪胎</p>  
        <p type="p">42:驅動軸(軸)</p>  
        <p type="p">43:保持部</p>  
        <p type="p">50:驅動裝置</p>  
        <p type="p">60:離合器</p>  
        <p type="p">70:咬合部</p>  
        <p type="p">71:升降用小齒輪(小齒輪)</p>  
        <p type="p">72:下配重輪</p>  
        <p type="p">D1:軸向</p>  
        <p type="p">D2:徑向</p>  
        <p type="p">D3:圓周方向</p>  
        <p type="p">P1:第1位置</p>  
        <p type="p">P2:第2位置</p>  
        <p type="p">X,Y:方向</p>  
        <p type="p">Z:方向(延伸方向)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2490" publication-number="202627025"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627025.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體用接著劑、以及半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C09J201/00</main-classification>  
        <further-classification edition="200601120260330B">C09J11/04</further-classification>  
        <further-classification edition="200601120260330B">C09J11/06</further-classification>  
        <further-classification edition="202601120260330B">H10W72/00</further-classification>  
        <further-classification edition="202601120260330B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大久保健實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUBO, TAKENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑田孝博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURODA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體用接著劑，其在具備將半導體晶片及配線電路基板的各自的連接部彼此電連接而成之連接結構及/或將複數個半導體晶片的各自的連接部彼此電連接而成之連接結構之半導體裝置中用於連接部的密封，前述半導體用接著劑含有固化性樹脂成分、助熔劑及無機填料，以該半導體用接著劑的總量為基準，前述無機填料的含量為60～95質量%，該半導體用接著劑固化後的導熱率為1.5W/mK以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2491" publication-number="202627782"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627782.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光顯示裝置</chinese-title>  
        <english-title>LIGHT EMITTING DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06F3/041</main-classification>  
        <further-classification edition="200601120260102B">G06F3/044</further-classification>  
        <further-classification edition="202301120260102B">H10K59/40</further-classification>  
        <further-classification edition="202301120260102B">H10K50/84</further-classification>  
        <further-classification edition="202301120260102B">H10K50/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林裕錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, YUSOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳榮浣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, YOUNGWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志銀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, JIEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐映來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YEONGRAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的一個或多個實施例的發光顯示裝置可以包括：基板，其上設置有顯示區域及焊墊區域；封裝部分，在該基板上從該顯示區域朝向該焊墊區域延伸；至少一個無機絕緣層，設置於該封裝部分上；焊墊電極，設置於該基板上的該焊墊區域中，並且電性連接至對應的訊號連接線；以及焊墊覆蓋部分，配置為覆蓋該焊墊區域中的該焊墊電極的至少一部分，該至少一個無機絕緣層可以包含配置為與該焊墊覆蓋部分的端部重疊的延伸圖案部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light emitting display apparatus according to one or more embodiments of the present disclosure may include a substrate on which a display area and a pad area are disposed, an encapsulation portion extending from the display area toward the pad area on the substrate, at least one inorganic insulating layer disposed on the encapsulation portion, a pad electrode disposed in the pad area on the substrate and electrically connected to respective signal link lines, and a pad cover portion configured to cover at least a portion of the pad electrode in the pad area, the at least one inorganic insulating layer may include an extension pattern portion configured to overlap an end of the pad cover portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:基板</p>  
        <p type="p">BF:緩衝層</p>  
        <p type="p">CH:接觸孔</p>  
        <p type="p">DPE:顯示焊墊電極</p>  
        <p type="p">DPE_CP:顯示連接焊墊電極</p>  
        <p type="p">DPE_OP:開口圖案</p>  
        <p type="p">ENC:封裝部分</p>  
        <p type="p">GI:閘極絕緣層</p>  
        <p type="p">ILD1:第一層間絕緣層</p>  
        <p type="p">ILD2:第二層間絕緣層</p>  
        <p type="p">PDCP:焊墊覆蓋部分</p>  
        <p type="p">PLN:平坦化層</p>  
        <p type="p">S-BF:觸控緩衝層</p>  
        <p type="p">S-EP:延伸圖案部分</p>  
        <p type="p">S-ILD:觸控絕緣層</p>  
        <p type="p">SLL:顯示驅動連接線</p>  
        <p type="p">S-PAC:第二觸控保護層</p>  
        <p type="p">S-PAS:第一觸控保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2492" publication-number="202626823"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626823.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光阻下層膜形成用組成物、光阻下層膜、光阻圖案之形成方法、及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G8/28</main-classification>  
        <further-classification edition="200601120260401B">C08G12/00</further-classification>  
        <further-classification edition="200601120260401B">C08G12/08</further-classification>  
        <further-classification edition="200601120260401B">C08G12/40</further-classification>  
        <further-classification edition="200601120260401B">G03F7/11</further-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德永光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUNAGA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光阻下層膜形成用組成物，其係含有：於側鏈具有吲哚結構之樹脂（G）及溶劑；且 &lt;br/&gt;前述樹脂（G）並非吲哚結構與茀環之9位碳原子經由碳-碳雙鍵鍵結之樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2493" publication-number="202626824"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626824.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143721</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光阻下層膜形成用組成物、光阻下層膜、光阻圖案之形成方法、及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G12/00</main-classification>  
        <further-classification edition="200601120260401B">C08G12/40</further-classification>  
        <further-classification edition="200601120260401B">C08G14/12</further-classification>  
        <further-classification edition="200601120260401B">G03F7/11</further-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德永光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUNAGA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光阻下層膜形成用組成物，其係含有：於側鏈具有吲哚結構及至少一個碳-碳三鍵之樹脂（G）以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2494" publication-number="202625981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手術用頭盔、其操作及使用方法</chinese-title>  
        <english-title>SURGICAL HELMET, METHOD OF OPERATION AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260330B">A61B34/10</main-classification>  
        <further-classification edition="200601120260330B">A42B3/00</further-classification>  
        <further-classification edition="200601120260330B">A42B3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>四生活合作實驗室協會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>4LIFELAB- LABORATORIO COLABORATIVO ASSOCIACAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努內斯　若昂　貝爾納多　馬托斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUNES, JOAO BERNARDO MATOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞爾杜拉　安東尼奧　弗朗西斯科　馬丁戈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERDOURA, ANTONIO FRANCISCO MARTINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮門特爾　恩里克　豐塞卡　阿爾維斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIMENTEL, HENRIQUE FONSECA ALVES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席爾瓦　何塞　羅克　科雷亞　德奧利韋拉　依</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILVA, JOSE ROQUE CORREIA DE OLIVEIRA E</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費利扎多　何塞　魯伊　德恩卡納喬　帕爾馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FELIZARDO, JOSE RUI DE ENCARNACAO PALMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席爾瓦　海倫娜　路易莎　西馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILVA, HELENA LUISA SIMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝祥遇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於一手術用防護服之可攜式手術用頭盔，其包括經構形以圍繞一使用者頭部延伸且將該頭盔固定於使用者之頭部上之一頭部支撐件，該頭部支撐件包括一前框架及一頂端結構，其中該前框架包括一前額區段及一下頜區段，該頂端結構連接至該前額區段；其中該頂端結構包括：一鼓風機及複數個空氣通道，該複數個空氣通道自該鼓風機延伸至該前框架；一陀螺儀，其配置為鄰近該鼓風機且經組態以根據該使用者之頭部之移動調節鼓風機速度；該前框架包括用於將自該鼓風機接收之空氣傳導至配置於該下頜區段上之複數個出氣口之複數個空氣通道，該等出氣口經構形以冷卻該使用者並對一面罩除霧，且進一步包括至少兩個揚聲器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates a portable surgical helmet for a surgical cover suit comprising a head support configured to extend about a user head and secure the helmet on the user’s head, said head support comprises a frontal frame and a top head structure wherein the frontal frame comprises a forehead section and a mandibular section, being the top head structure connected to the forehead section; wherein the top head structure comprising: a blower and a plurality of air channels that extend from the blower to the frontal frame; a gyroscope arranged adjacent to the blower and configured to regulate the blower speed according to the movement of the user’s head; the frontal frame comprises a plurality of air channel for conducting the air received from the blower to a plurality of air outlets arranged on the mandibular section, the air outlets being configured to cool the user and demist a face shield, and further comprises at least two speakers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:頭部支撐件</p>  
        <p type="p">2:頂端結構</p>  
        <p type="p">3:前框架之前額區段</p>  
        <p type="p">4:前框架之下頜區段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2495" publication-number="202626769"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626769.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、硬化物、圖案硬化物的製造方法及電子零件</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PATTERN PRODUCT, AND ELECTRONIC COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F290/14</further-classification>  
        <further-classification edition="200601120260401B">C08G73/12</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="202601120260401B">H10P14/68</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification>  
        <further-classification edition="202601120260401B">H10W74/10</further-classification>  
        <further-classification edition="202601120260401B">H10W74/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商艾曲迪微系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HD MICROSYSTEMS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神原武彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANBARA, TAKEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴沼宏輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBANUMA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可提供一種感光性樹脂組成物、以及使用所述感光性樹脂組成物的硬化物、圖案硬化物的製造方法及電子零件，所述感光性樹脂組成物包含：具有聚合性的不飽和鍵的聚醯亞胺前驅體、5 mmHg下的沸點為130℃以上且具有聚合性基的第一交聯劑、760 mmHg下的沸點為200℃以下且具有聚合性基的第二交聯劑、光聚合起始劑、以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photosensitive resin composition comprising a polyimide precursor having a polymerizable unsaturated bond, a first cross-liking agent having a polymerizable group and having a boiling point of 130°C or higher at 5 mmHg, a second cross-linking agent having a polymerizable group and having a boiling point of 200°C or lower at 760 mmHg, a photoinitiator, and a solvent; a cured product, a method for producing a cured pattern product, and an electronic component using the photosensitive resin composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2496" publication-number="202628369"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628369.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙通道選擇模塊、多通道選擇電路、電子晶片及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">H03K19/20</main-classification>  
        <further-classification edition="200601120251126B">H03K17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雲鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種雙通道選擇模塊，其包括一解碼單元與一信號輸出單元，其中，該解碼單元耦接一包含1個使能位元的使能信號以及一包含一個選擇位元的選擇信號，且該信號輸出單元耦接該解碼單元、一第一輸入信號以及一第二輸入信號。依據本發明，該解碼單元被配置以依據該使能位元與該選擇信號產生複數個控制位元傳送至該信號輸出單元，使得該信號輸出單元基於該些控制位元的控制選擇該第一輸入信號或該第二輸入信號為一輸出信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雙通道選擇模塊</p>  
        <p type="p">101:解碼單元</p>  
        <p type="p">1011:第一反相器</p>  
        <p type="p">1012:第二反相器</p>  
        <p type="p">1013:第一及閘</p>  
        <p type="p">1014:或閘</p>  
        <p type="p">1015:第二及閘</p>  
        <p type="p">102:信號輸出單元</p>  
        <p type="p">1021:第三反相器</p>  
        <p type="p">1022:第四反相器</p>  
        <p type="p">1023:第五反相器</p>  
        <p type="p">1024:第六反相器</p>  
        <p type="p">1025:第七反相器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2497" publication-number="202628371"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628371.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>奇數分頻電路、電子晶片及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260210B">H03K23/66</main-classification>  
        <further-classification edition="200601120260210B">H03K21/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雲鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種奇數分頻電路，應用於一電子晶片之中，且主要包括一分頻模塊以及一控制模塊，其中，該分頻模塊被配置用以對一參考時鐘信號執行一分頻處理以產生一第一時鐘信號，且在執行所述分頻處理的過程中產生複數個中間數據。值得注意的是，在該分頻模塊正常工作時，當該複數個中間數據的一位元組合符合一目標位元組合之時，該分頻模塊會出現分頻輸出等待或環路鎖定之現象。因此，在本發明中，該控制模塊被配置以在所述位元組合符合該目標位元組合的情況下產生一重置信號以重置該分頻模塊，從而使該分頻模塊能夠正常地輸出所述第一時鐘信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:奇數分頻電路</p>  
        <p type="p">11:分頻模塊</p>  
        <p type="p">12:控制模塊</p>  
        <p type="p">13:佔空比調整模塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2498" publication-number="202626156"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626156.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具前移量、穩定性與趾部垂懸特性之高爾夫球桿頭</chinese-title>  
        <english-title>GOLF CLUB HEADS COMPRISING ONSET, STABILITY, AND TOE HANG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260324B">A63B53/04</main-classification>  
        <further-classification edition="201501120260324B">A63B53/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡斯登製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARSTEN MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩雷諾　安東尼Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERRANO, ANTHONY D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼齊奧萊克　泰勒Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIZIOLEK, TAYLER N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種高爾夫球桿頭的實施例，其包含一位於重心(CG)踵側前方處的前移桿身(onset shaft)。在此所述實施例可在推桿揮擊全程提供穩定性，使球體進入純滾動狀態，並因應不同球員的推擊類型。本發明實施例在提供前移桿身帶來的純滾動(更多前旋)優勢的同時，亦考慮球員的推擊類型。為球員配適符合其推擊類型的推桿，可使球員在其預定目標線上擊球，進而提升球員的推擊成功率。高爾夫運動的目標是打出最低桿數，而提升推擊成功率將有助於改善球員成績。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of a golf club head comprising an onset shaft that is in front of and on the heel side of the center of gravity (CG) are described herein. The embodiments described herein will provide stability through the putting stroke, get the ball on a true roll, and accommodate different players’ stroke types. These embodiments account for player stroke type while providing the true roll (more forward spin) of an onset shaft. Fitting a player to a putter that suits their stroke type allows a player to hit a ball on the player’s intended target line thereby increasing the amount putts holed by the player. The goal in the game of golf is to shoot the lowest score and making putts will improve a player's score.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:桿頭</p>  
        <p type="p">101:本體</p>  
        <p type="p">102:擊球面</p>  
        <p type="p">103:前沿</p>  
        <p type="p">104:踵部</p>  
        <p type="p">105:插鞘</p>  
        <p type="p">106:趾部</p>  
        <p type="p">107:插鞘孔</p>  
        <p type="p">108:前方</p>  
        <p type="p">110:頂面</p>  
        <p type="p">111:後方</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2499" publication-number="202627043"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627043.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種膽甾相液晶組合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09K19/30</main-classification>  
        <further-classification edition="200601120251201B">C09K19/34</further-classification>  
        <further-classification edition="200601120251201B">C09K19/20</further-classification>  
        <further-classification edition="200601120251201B">C09K19/18</further-classification>  
        <further-classification edition="200601120251201B">C09K19/32</further-classification>  
        <further-classification edition="200601120251201B">C09K19/44</further-classification>  
        <further-classification edition="200601120251201B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京八億時空液晶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙利傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及液晶顯示技術領域，具體涉及一種膽甾相液晶組合物及其應用。本發明的膽甾相液晶組合物包含一種或多種如下通式I所代表的化合物、一種或多種如下通式II所代表的化合物、一種或多種如下通式III所代表的化合物、一種或多種如下通式IV所代表的化合物、一種或多種如下通式V所代表的化合物以及一種或多種如下通式VI所代表的化合物。本發明的膽甾相液晶組合物通過通式I~VI所代表的化合物之間的協同作用，使得其具有主反射波長溫度穩定性好的特點，具體表現為在0℃~50℃範圍內，主反射波長變化量不超過5nm，特別適用於膽甾型雙穩態顯示器，可以改善現有雙穩態顯示器在較寬溫度範圍的顯示效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2500" publication-number="202626047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療重症肌無力的ＬＯＵ０６４</chinese-title>  
        <english-title>LOU064 FOR THE TREATMENT OF MYASTHENIA GRAVIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/505</main-classification>  
        <further-classification edition="200601120260401B">A61K31/573</further-classification>  
        <further-classification edition="200601120260401B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商諾華公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVARTIS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞尼　布魯諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENNI, BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基賽爾　伯恩德　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIESEIER, BERND C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛森　馬裡奧　雷內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOSEN, MARIO RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬內　達馬斯　瑪麗娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANE DAMAS, MARINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁內斯　馬丁內斯　瑪麗亞　皮拉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ MARTINEZ, MARIA PILAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普茨基　諾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUTZKI, NORMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇　文菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WENDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威利　羅曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLI, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述了用BTK抑制劑瑞米布替尼或其藥學上可接受的鹽治療gMG之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are methods of treating gMG with the BTK inhibitor remibrutinib or a pharmaceutically acceptable salt thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2501" publication-number="202626158"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626158.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>步行鞋</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">A63C17/12</main-classification>  
        <further-classification edition="200601120260317B">A43B5/16</further-classification>  
        <further-classification edition="202201120260317B">A43B3/34</further-classification>  
        <further-classification edition="202201120260317B">A43B3/44</further-classification>  
        <further-classification edition="202201120260317B">A43B3/48</further-classification>  
        <further-classification edition="200601120260317B">A63C17/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商微笑工廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMILEFACTORY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＫＢ機械加工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KB MACHINING., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中豊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TOYOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村太一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, TAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種以可步行為基礎且可進行驅動走行的步行鞋中，在自步行狀態朝向驅動走行、自驅動走行狀態朝向步行之轉換的選擇時，其可儘量減輕使用者的負擔。 &lt;br/&gt;步行鞋之左腳用鞋1L及右腳用鞋1R具備有：滾輪12f、12b，其等被設在底部；電動馬達13，其驅動滾輪；制動機構20，其對滾輪12f、12b施加制動；電磁線圈23，其使制動機構20之制動起作用；及控制單元U，其控制電動馬達13及電磁線圈23；在左腳用鞋1L及右腳用鞋1R，設有檢測機構27其可檢測該等已成為第1、第2配置狀態並建立關聯性；控制單元U係根據來自檢測機構27之檢測資訊，當判斷處於第1配置狀態時，解除制動機構20之制動並且開始電動馬達13之驅動，當判斷為已處於第2配置狀態時則開始停止電動馬達13之驅動並且使制動機構20進行制動作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:步行鞋</p>  
        <p type="p">1L:左腳用鞋/鞋</p>  
        <p type="p">1R:右腳用鞋/鞋</p>  
        <p type="p">2a:大底</p>  
        <p type="p">4b,4f:缺口</p>  
        <p type="p">9:基板</p>  
        <p type="p">10:軸承</p>  
        <p type="p">11b,11f:迴轉軸</p>  
        <p type="p">12b:後側滾輪</p>  
        <p type="p">12f:前側滾輪</p>  
        <p type="p">13:電動馬達</p>  
        <p type="p">14:電池</p>  
        <p type="p">15:自保持電路</p>  
        <p type="p">20:制動機構/升降機構</p>  
        <p type="p">21:制動盤</p>  
        <p type="p">22:卡鉗</p>  
        <p type="p">23:電磁線圈</p>  
        <p type="p">23a:柱塞</p>  
        <p type="p">26:主開關</p>  
        <p type="p">27:檢測機構</p>  
        <p type="p">27A:第1檢測機構</p>  
        <p type="p">27B:第2檢測機構</p>  
        <p type="p">28:轉速感測器</p>  
        <p type="p">31a:RFID讀取器(一通訊元件)</p>  
        <p type="p">31b:電子標籤(另一通訊元件)</p>  
        <p type="p">32a:RFID讀取器(一通訊元件)</p>  
        <p type="p">32b:電子標籤(另一通訊元件)</p>  
        <p type="p">34a:RFID讀取器(一通訊元件)</p>  
        <p type="p">34b:電子標籤(另一通訊元件)</p>  
        <p type="p">U:控制單元(控制裝置)</p>  
        <p type="p">UR:控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2502" publication-number="202626240"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626240.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143876</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工裝置、顯微鏡裝置及雷射加工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260316B">B23K26/362</main-classification>  
        <further-classification edition="200601120260316B">B23K26/16</further-classification>  
        <further-classification edition="201401120260316B">B23K26/064</further-classification>  
        <further-classification edition="201401120260316B">B23K26/082</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原佳祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦隆二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大石大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OISHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福神純平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUJIN, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之雷射加工裝置包含：配置部，其供配置對象物；雷射照射部，其用於照射第1雷射光及第2雷射光；及透過構件，其在配置於前述配置部之前述對象物、與前述雷射照射部之間，配置於前述第1雷射光及前述第2雷射光之光軸上，供前述第1雷射光及前述第2雷射光透過；且前述雷射照射部具有掃描部，該掃描部用於而進行利用前述第1雷射光對前述對象物之剝蝕加工、及利用前述第2雷射光將前述對象物之剝蝕加工中產生之微粒去除之剝蝕加工。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:試料保持具(配置部)</p>  
        <p type="p">2s:配置面</p>  
        <p type="p">6:試料室</p>  
        <p type="p">6s:內表面</p>  
        <p type="p">7:蓋(透過構件)</p>  
        <p type="p">7s:表面</p>  
        <p type="p">48:透鏡(集光部)</p>  
        <p type="p">70:捕集區域</p>  
        <p type="p">81:光軸調整部</p>  
        <p type="p">82:角度調整部</p>  
        <p type="p">A:試料(對象物)</p>  
        <p type="p">Ai:入射面</p>  
        <p type="p">L1:第1雷射光</p>  
        <p type="p">L2:第2雷射光</p>  
        <p type="p">N:法線</p>  
        <p type="p">Ox:光軸</p>  
        <p type="p">P1:第1集光點</p>  
        <p type="p">P2:第2集光點</p>  
        <p type="p">R1:第1照射區域</p>  
        <p type="p">R2:第2照射區域</p>  
        <p type="p">R5:通過區域</p>  
        <p type="p">Rt:微粒</p>  
        <p type="p">S401,S402:步驟</p>  
        <p type="p">X,Y,Z:軸</p>  
        <p type="p">Z1:第1位置</p>  
        <p type="p">Z2:第2位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2503" publication-number="202625950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃機器人工作站</chinese-title>  
        <english-title>ROBOT CLEANER STATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A47L11/40</main-classification>  
        <further-classification edition="200601120260331B">A47L11/24</further-classification>  
        <further-classification edition="200601120260331B">A47L11/28</further-classification>  
        <further-classification edition="200601120260331B">A47L11/34</further-classification>  
        <further-classification edition="200601120260331B">A47L9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KOOKHAENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃正培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, JUNGBAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成埈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種清掃機器人工作站，其包括：殼體，設置在廚具的下側上；以及座單元，其設置在殼體中，且清掃機器人的至少一部分耦接至座單元，其中，殼體的前端的寬度大於後端的寬度，從而在無需移除操作者的手難以觸及的後部處的托架的情況下插入及安裝該清掃機器人工作站。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a robot cleaner station, which includes a housing disposed on a lower side of kitchen furniture, and a seating unit which is disposed in the housing and to which at least a portion of a robot cleaner is coupled, wherein the housing has a width of a front end which is greater than a width of a rear end, thereby inserting and installing the robot cleaner station without removing pedestals at the rear, which are difficult for an operator’s hand to reach.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:清掃機器人系統</p>  
        <p type="p">100:清掃機器人工作站</p>  
        <p type="p">110:殼體</p>  
        <p type="p">130:門單元</p>  
        <p type="p">140:集塵單元</p>  
        <p type="p">145:集塵馬達</p>  
        <p type="p">160:拖布清洗單元</p>  
        <p type="p">170:拖布烘乾單元</p>  
        <p type="p">200:清掃機器人</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2504" publication-number="202625951"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625951.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃機器人工作站</chinese-title>  
        <english-title>ROBOT CLEANER STATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A47L11/40</main-classification>  
        <further-classification edition="200601120260331B">A47L11/24</further-classification>  
        <further-classification edition="200601120260331B">A47L11/28</further-classification>  
        <further-classification edition="200601120260331B">A47L11/34</further-classification>  
        <further-classification edition="200601120260331B">A47L9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪禎順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, JEONGSOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高武鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, MOOHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禹南一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOO, NAMIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種清掃機器人工作站，其包括：殼體；座單元，其設置在殼體中，且清掃機器人的至少一部分耦接至該座單元；以及集塵單元，配置以收集清掃機器人的集塵箱內部的灰塵，其中集塵單元進一步包含：集塵單元殼體，集塵箱內部的灰塵引入至集塵單元殼體中；集塵袋抽屜，耦接至集塵單元殼體以待拉出，且集塵袋可拆卸地安裝在集塵袋抽屜內部；以及過濾器，設置在集塵袋抽屜內部並與集塵袋抽屜一起被拉出，因此使用者可拉出集塵袋抽屜並簡單地提起集塵袋來更換預過濾器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a robot cleaner station, which includes a housing, a seating unit which is disposed in the housing and to which at least a portion of a robot cleaner is coupled, and a dust collection unit configured to collect dust inside a dust bin of the robot cleaner, wherein the dust collection unit further includes a dust collection unit housing into which the dust inside the dust bin is introduced, a dust bag drawer which is coupled to the dust collection unit housing to be pulled out and to which a dust bag is detachably mounted inside, and a filter disposed inside the dust bag drawer and pulled out together with the dust bag drawer, and thus a user can pull out the dust bag drawer and simply lift the dust bag to replace a prefilter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:清掃機器人系統</p>  
        <p type="p">100:清掃機器人工作站</p>  
        <p type="p">110:殼體</p>  
        <p type="p">130:門單元</p>  
        <p type="p">140:集塵單元</p>  
        <p type="p">145:集塵馬達</p>  
        <p type="p">160:拖布清洗單元</p>  
        <p type="p">170:拖布烘乾單元</p>  
        <p type="p">200:清掃機器人</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2505" publication-number="202625952"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625952.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃機器人工作站</chinese-title>  
        <english-title>ROBOT CLEANER STATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A47L11/40</main-classification>  
        <further-classification edition="200601120260331B">A47L11/24</further-classification>  
        <further-classification edition="200601120260331B">A47L11/28</further-classification>  
        <further-classification edition="200601120260331B">A47L9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪禎順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, JEONGSOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高武鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, MOOHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禹南一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOO, NAMIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種清掃機器人工作站，其包括：殼體；座單元，其設置在殼體中，且清掃機器人的至少一部分耦接至座單元；以及集塵單元，配置以收集清掃機器人的集塵箱內部的灰塵，其中集塵單元包含：集塵單元殼體、集塵袋抽屜，耦接至集塵單元殼體以在第一方向上待拉出、以及集塵袋，其在與第一方向相交的第二方向上可拆卸地耦接至集塵袋抽屜並收集集塵箱內的灰塵，藉此清掃機器人工作站可增加集塵袋的容量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a robot cleaner station, which can increase the capacity of a dust bag by including a housing, a seating unit which is disposed in the housing and to which at least a portion of a robot cleaner is coupled, and a dust collection unit configured to collect dust inside a dust bin of the robot cleaner, wherein the dust collection unit includes a dust collection unit housing, a dust bag drawer coupled to the dust collection unit housing to be pulled out in a first direction, and a dust bag which is detachably coupled to the dust bag drawer in a second direction intersecting the first direction and collects dust within the dust bin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:清掃機器人系統</p>  
        <p type="p">100:清掃機器人工作站</p>  
        <p type="p">110:殼體</p>  
        <p type="p">130:門單元</p>  
        <p type="p">140:集塵單元</p>  
        <p type="p">145:集塵馬達</p>  
        <p type="p">160:拖布清洗單元</p>  
        <p type="p">170:拖布烘乾單元</p>  
        <p type="p">200:清掃機器人</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2506" publication-number="202626021"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626021.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減充血劑控釋藥物遞送系統</chinese-title>  
        <english-title>DECONGESTANT CONTROLLED RELEASE DRUG DELIVERY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/137</main-classification>  
        <further-classification edition="200601120260401B">A61K31/454</further-classification>  
        <further-classification edition="200601120260401B">A61K47/14</further-classification>  
        <further-classification edition="200601120260401B">A61K47/38</further-classification>  
        <further-classification edition="200601120260401B">A61K47/32</further-classification>  
        <further-classification edition="200601120260401B">A61K9/24</further-classification>  
        <further-classification edition="200601120260401B">A61P37/08</further-classification>  
        <further-classification edition="200601120260401B">A61P11/06</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商ＦＡＥＳ製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAES FARMA, S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋拉達　何塞　路易士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELADA, JOSE LUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬西亞內斯　莫雷諾　帕特里夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARCIANES MORENO, PATRICIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷特斯　羅曼薩塔　蘇薩納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RETES ROMASANTA, SUSANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種控釋藥物組合物，包含減充血劑、丙烯酸酯共聚物、纖維素衍生物和交聯的丙烯酸聚合物。本發明提供了一種表現出可重現特性的口服劑型，其特徵是減充血劑在口服施用後超過十二小時以及優選至少十六小時的期間內受控釋放。本發明還涵蓋了其醫藥用途。本發明的遞送系統的釋放特性是高度可重現的，並且可每日施用一次，從而改善患者依從性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a controlled release pharmaceutical composition comprising a decongestant, an acrylate copolymer, a cellulose derivative and a crosslinked acrylic acid polymer. The present invention provides an oral dosage form exhibiting a reproducible profile characterized by a controlled release of the decongestant over a period in excess of twelve hours and preferably at least 16 hours after oral administration. The invention further contemplates medical uses thereof. The release profile of the delivery system of the invention is highly reproducible and can be administered once daily, thus improving patient compliance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2507" publication-number="202627795"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627795.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>計算系統以及資訊處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260327B">G06F8/41</main-classification>  
        <further-classification edition="201801120260327B">G06F8/33</further-classification>  
        <further-classification edition="201801120260327B">G06F8/30</further-classification>  
        <further-classification edition="200601120260327B">G06F9/50</further-classification>  
        <further-classification edition="201301120260327B">G06F21/60</further-classification>  
        <further-classification edition="201301120260327B">G06F21/10</further-classification>  
        <further-classification edition="200601120260327B">H04L9/32</further-classification>  
        <further-classification edition="202201120260327B">H04L67/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商關連風科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONNECTFREE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帝都　久利寿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATE, KRISTOPHER ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">計算系統包括：計算裝置及軟體開發裝置。計算裝置包含處理器，軟體開發裝置用以製作由計算裝置執行的應用程式。軟體開發裝置包括第一編譯器，所述第一編譯器對包含一個或多個命令與處理對象的資料的源進行編譯來生成中間碼。計算裝置包括第二編譯器，所述第二編譯器用中間碼中所含的一個或多個命令來反映計算裝置的硬體結構而生成機器碼。計算裝置的處理器於生成機器碼後執行該所生成的機器碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:IoT系統</p>  
        <p type="p">2:邊緣裝置</p>  
        <p type="p">100:軟體開發裝置</p>  
        <p type="p">200:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2508" publication-number="202627124"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627124.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>合金、可熔塞及灑水頭</chinese-title>  
        <english-title>ALLOY, FUSIBLE PLUG, AND SPRINKLER HEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260213B">C22C12/00</main-classification>  
        <further-classification edition="200601120260213B">C09K11/62</further-classification>  
        <further-classification edition="200601120260213B">C01G29/00</further-classification>  
        <further-classification edition="202101120260213B">F25B41/31</further-classification>  
        <further-classification edition="200601120260213B">F25B45/00</further-classification>  
        <further-classification edition="200601120260213B">C22F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商千住金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENJU METAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出井寛大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEI, KANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供由DSC曲線得到的吸熱峰溫度為85~90℃且具有高維氏硬度的合金、工作溫度為85~90℃的可熔塞、以及工作溫度為85~90℃的灑水頭。 &lt;br/&gt;　　[解決手段] 一種合金，具有以質量%計為Bi：47.0~ 49.0%、Sb：0.8~1.2%、並且其餘部分為In的合金組成。另外，可熔塞及灑水頭具備該合金，工作溫度為85~90℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:範圍</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2509" publication-number="202626794"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626794.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>３—甲基—１—丁烯共聚物、３—甲基—１—丁烯系聚合物顆粒及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F210/14</main-classification>  
        <further-classification edition="200601120260401B">C08F210/16</further-classification>  
        <further-classification edition="200601120260401B">C08F4/64</further-classification>  
        <further-classification edition="200601120260401B">C08F4/654</further-classification>  
        <further-classification edition="200601120260401B">C08J3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鳥越翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORIGOE, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWATA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個態樣是關於3-甲基-1-丁烯共聚物，所述共聚物包含：源自3-甲基-1-丁烯的構成單元以及源自α-烯烴（其中，3-甲基-1-丁烯除外。）的構成單元，所述3-甲基-1-丁烯共聚物具有藉由差示掃描量熱法測定的至少一個熔點Tm（°C），且滿足下述式（1）。&lt;br/&gt;&lt;br/&gt; Tm&lt;sub&gt;1&lt;/sub&gt;≧-1.8α+300 ...（1）&lt;br/&gt;&lt;br/&gt; （式（1）中，Tm&lt;sub&gt;1&lt;/sub&gt;是指具有一個所述熔點Tm（°C）時的熔點，或者具有兩個以上所述熔點Tm（°C）時的多個熔點中最低的熔點（°C），α是指藉由FT-IR的校準曲線算出的源自所述α-烯烴的構成單元的含量比例（mol%））</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2510" publication-number="202626026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>福多司坦藥物組成物、其製備方法及用途</chinese-title>  
        <english-title>FUDOSTEINE PHARMACEUTICAL COMPOSITION, PREPARATION METHOD AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/198</main-classification>  
        <further-classification edition="200601120260401B">A61K47/04</further-classification>  
        <further-classification edition="200601120260401B">A61K47/02</further-classification>  
        <further-classification edition="200601120260401B">A61K9/08</further-classification>  
        <further-classification edition="200601120260401B">A61P11/10</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海雲晟研新生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI AURORA BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應述歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, SHU-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳榜銀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BANG-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王居龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JU-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了福多司坦藥物組成物、其製備方法及用途。本發明提供了一種福多司坦藥物組成物，其包括以下組分：藥物活性成分、pH調節劑和水組成；所述福多司坦藥物組成物中，福多司坦濃度為20 mg/ml至200 mg/ml，pH值為3.0至6.0；所述的藥物活性成分為福多司坦、其藥學上可接受的鹽和其水合物中的一種或多種。本發明的福多司坦藥物組成物穩定性好、刺激性較小、起效劑量小、療效高、患者用藥順應性好、生產可操控性強，且不含有抗氧化劑和/或表面活性劑，不良反應發生率更低，安全性更好，市場化前景好。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a fudosteine pharmaceutical composition, a preparation process thereof and use thereof. The present invention provides a fudosteine pharmaceutical composition, which comprises the following components: a pharmaceutically active ingredient, a pH regulator and water; the concentration of fudosteine in the composition is 20mg/ml ~ 200mg/ml, and the pH value is 3.0 ~ 6.0; the pharmaceutically active ingredient is one or more of fudosteine, its pharmaceutically acceptable salts and its hydrates. The fudosteine composition of the present invention has good stability, low irritation, small effective dose, high curative effect, good patient medication compliance, strong production controllability, and does not contain antioxidants and/or surfactants, so it has lower incidence of adverse reactions, better safety and a good market prospect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2511" publication-number="202627629"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627629.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控螢幕及包含其之顯示裝置</chinese-title>  
        <english-title>TOUCHSCREEN AND DISPLAY DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260106B">G02F1/133</main-classification>  
        <further-classification edition="200601120260106B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李楊植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YANGSIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳旭相</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, OOKSANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置可包含：用於顯示影像之顯示面板；以及設置於顯示面板上之觸控螢幕，此觸控螢幕包含第一觸控路由線層、覆蓋第一觸控路由線層之絕緣層、設置於絕緣層上之第二觸控路由線層、以及包含用於連接第一觸控路由線層與第二觸控路由線層之接觸孔之多條觸控路由線。此外，該些觸控路由線包含至少兩個層間結構變化區段，於該些區段中第一觸控路由線層與第二佈線層之層間佈線位置發生變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device can include a display panel configured to display an image, and a touchscreen disposed on the display panel, the touchscreen including a first touch routing line layer, an insulating layer covering the first touch routing line layer, a second touch routing line layer disposed on the insulating layer, and a plurality of touch routing lines including a contact hole configured to interconnect the first touch routing line layer and the second touch routing line layer. Also, the plurality of touch routing lines include at least two interlayer structure change sections where interlayer wiring positions of the first touch routing line layer and the second routing line layer are changed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CH:接觸孔</p>  
        <p type="p">CH1A:第一接觸孔區域</p>  
        <p type="p">CH2A:第二接觸孔區域</p>  
        <p type="p">CH3A:第三接觸孔區域</p>  
        <p type="p">SILD:絕緣層</p>  
        <p type="p">TL:觸控路由線</p>  
        <p type="p">TL1:第一觸控路由線層</p>  
        <p type="p">TL2:第二觸控路由線層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2512" publication-number="202627092"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627092.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制凝血因子XI（FXI）表達的組合物和方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR INHIBITING EXPRESSION OF COAGULATION FACTOR XI (FXI)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="200601120260401B">A61P7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海舶望製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI ARGO BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒東旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, DONGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵　鵬程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, PENGCHENG PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了可用於抑制血漿凝血因子XI（FXI）基因的表達和用於治療FXI相關疾病和病症的組合物和方法。提供了可用於抑制細胞和受試者的FXI表達的FXI dsRNA藥劑、FXI反義多核苷酸藥劑、包含FXI dsRNA藥劑的組合物和包含FXI反義多核苷酸藥劑的組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compositions and methods useful to inhibiting the expression of Plasma Coagulation Factor XI (FXI) gene and for treatment of FXI -associated diseases and conditions are provided. Provided are FXI dsRNA agents, FXI antisense polynucleotide agents, compositions comprising FXI dsRNA agents, and compositions comprising FXI antisense polynucleotide agents that can be used to inhibiting FXI expression in cells and subjects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2513" publication-number="202627608"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627608.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變形近眼顯示設備</chinese-title>  
        <english-title>ANAMORPHIC NEAR-EYE DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G02B27/00</main-classification>  
        <further-classification edition="200601120260319B">G02B27/01</further-classification>  
        <further-classification edition="200601120260319B">G02B27/09</further-classification>  
        <further-classification edition="200601120260319B">G02B6/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瑞爾Ｄ斯帕克有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALD SPARK, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅賓森　麥可Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBINSON, MICHAEL G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾遜　奧斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILSON, AUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍蓋　葛拉漢Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOODGATE, GRAHAM J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種變形近眼顯示設備包含：一空間光調變器，其具有變形像素；一輸入橫向變形透鏡；以及一提取波導，其包含一側向變形光逆轉反射器。來自第一空間光調變器之光由該橫向變形透鏡在橫向方向上成像，輸入至該提取波導中，且在一第一方向上沿著該提取波導被導引。該光由該側向變形鏡在側向方向上成像，且在一第二方向上反向引導通過該提取波導。光提取特徵經配置以將該反射光引導朝向一檢視者之瞳孔。該等光提取特徵具備光功率，使得對於該空間光調變器上之各點，該輸出光朝向一檢視者之眼睛發散。可提供一有限視距處之一虛擬影像平面及對眼科病況之矯正。提供了一種用於擴增實境及虛擬實境顯示器之有效近眼顯示設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anamorphic near-eye display apparatus comprises a spatial light modulator with anamorphic pixels; an input transverse anamorphic lens; and an extraction waveguide comprising a lateral anamorphic light reversing reflector. Light from the first spatial light modulator is imaged in the transverse direction by the transverse anamorphic lens, is input into the extraction waveguide and is guided in a first direction along the extraction waveguide. The light is imaged by the lateral anamorphic mirror in the lateral direction and directed in a second direction back through the extraction waveguide. Light extraction features are arranged to direct the reflected light towards the pupil of a viewer. The light extraction features are provided with optical power so that for each point on the spatial light modulator, the output light diverges towards the eye of a viewer. A virtual image plane at a finite viewing distance and correction for ophthalmic conditions may be provided. An efficient near-eye display apparatus for Augmented Reality and Virtual Reality displays is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光波導/提取波導/波導</p>  
        <p type="p">2:輸入端</p>  
        <p type="p">4:反射端</p>  
        <p type="p">6:後導引表面</p>  
        <p type="p">8:前導引表面</p>  
        <p type="p">22:邊緣</p>  
        <p type="p">24:邊緣</p>  
        <p type="p">30:虛擬影像</p>  
        <p type="p">32C:對準之同軸虛擬像素/中心虛擬影像點/虛擬影像點</p>  
        <p type="p">32U:上部虛擬影像點/虛擬影像點</p>  
        <p type="p">34C:光線/導引光線/輸出光線/反射光線</p>  
        <p type="p">36:虛擬影像/影像</p>  
        <p type="p">39:虛擬視野/影像</p>  
        <p type="p">37C:虛擬光線</p>  
        <p type="p">44:瞳孔</p>  
        <p type="p">45:眼睛</p>  
        <p type="p">46:視網膜</p>  
        <p type="p">47:檢視者/使用者</p>  
        <p type="p">48:空間光調變器(SLM)/發射SLM/非變形SLM</p>  
        <p type="p">60:橫向變形組件/橫向變形光學元件/元件</p>  
        <p type="p">61:橫向透鏡/透鏡</p>  
        <p type="p">70:輸入線性偏振器/線性偏振器/偏振器</p>  
        <p type="p">72:偏振轉換延遲器</p>  
        <p type="p">100:近眼顯示設備/變形近眼顯示設備(ANEDA)/變形近眼顯示器/替代ANEDA</p>  
        <p type="p">110:側向變形組件/組件/側向方向/側向鏡/側向變形光學元件/元件</p>  
        <p type="p">130:外部真實物件/真實世界物件/外部物件/物件/遠場物件/遠距離物件</p>  
        <p type="p">132:同軸真實影像點/點</p>  
        <p type="p">134:光線/外部光線</p>  
        <p type="p">136:影像/真實影像</p>  
        <p type="p">140:光逆轉反射器/側向方向/側向鏡</p>  
        <p type="p">141:平面</p>  
        <p type="p">170:提取反射器/提取特徵</p>  
        <p type="p">169:光提取特徵/提取特徵/線性提取特徵</p>  
        <p type="p">191:第一方向</p>  
        <p type="p">195:側向方向</p>  
        <p type="p">199(44):輸出方向</p>  
        <p type="p">222C:像素</p>  
        <p type="p">222U:外部像素</p>  
        <p type="p">240:照明系統</p>  
        <p type="p">500:控制系統</p>  
        <p type="p">712:二向色堆疊/介電堆疊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2514" publication-number="202628831"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628831.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H10P50/20</main-classification>  
        <further-classification edition="202601120260326B">H10P50/28</further-classification>  
        <further-classification edition="202601120260326B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田紘輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KOUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐古卓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKO, TAKUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林典之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, NORIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">即使在低溫下對基板進行COR處理時也能有效地去除蝕刻時殘留在膜上的副生成物。 &lt;br/&gt;基板處理方法，係使用基板處理裝置對基板進行處理，包含下述工序：將處理氣體供應至腔室內以對該基板上的矽氧化膜的表面進行蝕刻處理；進行在減壓下使具有OH基的液體汽化並噴附到在該蝕刻處理中沉積在該基板上的AFS層的處理；以及對腔室內進行減壓以去除分解後的該AFS層的至少一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:氧化膜(矽氧化膜)</p>  
        <p type="p">120:AFS層</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2515" publication-number="202627672"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627672.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144042</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定感測器基準點劣化之方法</chinese-title>  
        <english-title>METHOD OF DETERMINING DEGRADATION ON A SENSOR FIDUCIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260401B">G03F1/84</main-classification>  
        <further-classification edition="200601120260401B">G03F9/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊莎　哈姆茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISSA, HAMZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉維錢德蘭　阿溫德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAVICHANDRAN, ARVIND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅斯塔米　哈米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSTAMI, HAMIDEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納伽薩　達摩　拉迪烏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASSA DHARMA, RADIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡波內　盧多維科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARBONE, LUDOVICO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種判定至少一個效能指示符之方法，各該效能指示符量化一積體電路製造設備之至少一個組件的劣化及/或該至少一個組件之劣化對該製造設備之效能的一影響。該方法包含：獲得與一倍縮光罩對準動作相關之至少倍縮光罩對準資料；判定與擬合至該倍縮光罩對準資料之一倍縮光罩對準模型之至少一個倍縮光罩對準誤差模型參數之一變異相關的至少一個變異度量；及自該至少一個變異度量判定該至少一個效能指示符。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method of determining at least one performance indicator, each said performance indicator quantifying degradation of at least one component of an integrated circuit manufacturing apparatus and/or an effect of degradation of said at least one component on performance of said manufacturing apparatus. The method comprises obtaining at least reticle alignment data relating to a reticle alignment action, determining at least one variation metric relating to a variation of at least one reticle alignment error model parameter of a reticle alignment model fitted to said reticle alignment data and determining the at least one performance indicator from said at least one variation metric.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">E2M:自曝光側轉移至量測側/轉移階段/轉移週期</p>  
        <p type="p">FWA:精細晶圓對準/精細對準</p>  
        <p type="p">ImH:浸潤罩</p>  
        <p type="p">RA:倍縮光罩對準</p>  
        <p type="p">SA:載物台對準</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2516" publication-number="202627048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固化性組成物以及膜形成方法和製品的製造方法</chinese-title>  
        <english-title>CURABLE COMPOSITION AND METHODS FOR FORMING FILM AND MANUFACTURING ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260401B">C09K23/42</main-classification>  
        <further-classification edition="201801120260401B">C09D7/47</further-classification>  
        <further-classification edition="200601120260401B">C09D201/00</further-classification>  
        <further-classification edition="201401120260401B">C09D11/38</further-classification>  
        <further-classification edition="200601120260401B">G03F7/00</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">B29C59/02</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本哲士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TETSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今村成希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAMURA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松島雛子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, HINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種固化性組成物，其在23℃和1atm下具有1.3mPa•s至60mPa•s的黏度，該固化性組成物包含聚合性化合物(a)、光聚合引發劑(b)、溶劑(d)和表面活性劑(c1)，該溶劑(d)相對於整個固化性組成物的量為大於5體積%至95體積%，該表面活性劑(c1)相對於整個固化性組成物的量為0.1質量%至10質量%。該溶劑(d)在1atm下具有低於250℃的沸點。聚合性化合物(a)和溶劑(d)各自具有17MPa&lt;sup&gt;1/2&lt;/sup&gt;至小於25MPa&lt;sup&gt;1/2&lt;/sup&gt;的SP值。該表面活性劑(c1)不含氟或矽原子並且具有SP值為11MPa&lt;sup&gt;1/2&lt;/sup&gt;至小於17MPa&lt;sup&gt;1/2&lt;/sup&gt;的拒液性原子團和SP值為25MPa&lt;sup&gt;1/2&lt;/sup&gt;至小於35MPa&lt;sup&gt;1/2&lt;/sup&gt;的親液性原子團。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A curable composition with a viscosity of 1.3 mPa·s to 60 mPa·s at 23°C and 1 atm contains a polymerizable compound (a), a photopolymerization initiator (b), a solvent (d) in an amount ranging from more than 5% to 95% by volume relative to the entire curable composition, and a surfactant (c1) in an amount of 0.1% to 10% by mass relative to the entire curable composition. The solvent (d) has a boiling point of less than 250°C at 1 atm. The polymerizable compound (a) and the solvent (d) each have an SP value ranging from 17 MPa&lt;sup&gt;1/2&lt;/sup&gt; to less than 25 MPa&lt;sup&gt;1/2&lt;/sup&gt;. The surfactant (c1) does not contain fluorine or silicon atoms and has a liquid-repellent atomic group with an SP value ranging from 11 MPa&lt;sup&gt;1/2&lt;/sup&gt; to less than 17 MPa&lt;sup&gt;1/2&lt;/sup&gt; and a lyophilic atomic group with an SP value ranging from 25 MPa&lt;sup&gt;1/2&lt;/sup&gt; to less than 35 MPa&lt;sup&gt;1/2&lt;/sup&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2517" publication-number="202626484"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626484.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機械諧振器的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD FOR MECHANICAL RESONATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B81C1/00</main-classification>  
        <further-classification edition="200601120260327B">G04D7/10</further-classification>  
        <further-classification edition="200601120260327B">G04B17/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商尼瓦克斯　法爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIVAROX-FAR S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查辛　傑弗瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHASSIN, GEOFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡森　皮爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUSIN, PIERRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個面向關於一種用於製造一組機械諧振器(2a)的方法，此組機械諧振器具有結構特徵，其具有被包含在預定的值範圍內的平均值，方法包括：在板材(1)中之機械諧振器(2b、2c)及振盪構件(10a、10b、10c)的形成(21)，以及基於針對結構特徵所判斷的值之應用於所形成的諧振器(2b、2c)的尺寸校正的計算(26)，以及接著基於計算出的尺寸校正之所形成的諧振器(2b、2c)的尺寸的修改(28)，以獲得具有被包含在預定的值範圍內的結構特徵值的該組機械諧振器(2a)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the invention relates to a method for manufacturing a set of mechanical resonators (2a) having structural characteristics with an average value comprised within a predetermined range of values, the method providing for the formation (21), in a plate (1), of mechanical resonators (2b, 2c) and of oscillating members (10a, 10b, 10c) and the calculation (26) of dimensional corrections to be applied to the resonators (2b, 2c) formed based on the value determined for the structural characteristic, and then a modification (28) of the dimensions of the resonators (2b, 2c) formed, based on the dimensional corrections calculated, to obtain the set of resonators (2a) having structural characteristic values comprised within the predetermined range of values.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:(形成)步驟</p>  
        <p type="p">21:(形成)步驟</p>  
        <p type="p">22:步驟</p>  
        <p type="p">23:子步驟</p>  
        <p type="p">24:測量階段</p>  
        <p type="p">25:子步驟</p>  
        <p type="p">26:步驟</p>  
        <p type="p">27:子步驟</p>  
        <p type="p">28:步驟</p>  
        <p type="p">29:子步驟</p>  
        <p type="p">30:子步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2518" publication-number="202626298"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626298.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>維護裝置、半導體製造系統、及維護方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B25J9/16</main-classification>  
        <further-classification edition="200601120260401B">B25J15/04</further-classification>  
        <further-classification edition="202601120260401B">H10P72/30</further-classification>  
        <further-classification edition="200601120260401B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤功英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, KOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀨口泰生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGUCHI, TAISEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之維護裝置連接於被減壓為真空環境之半導體製造系統之模組，以更換該半導體製造系統之零件。維護裝置具備：殼體，其連接於上述模組，具有能夠減壓為真空環境之內部空間；搬送機器人，其設置於上述內部空間，具有保持上述零件之末端效應器及使上述末端效應器移動之臂；以及固定機構，其將上述臂與上述末端效應器相互裝卸自如地固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:維護裝置</p>  
        <p type="p">61:零件更換裝置</p>  
        <p type="p">62:更換裝置側殼體</p>  
        <p type="p">62s,66s:內部空間</p>  
        <p type="p">63:搬送機器人</p>  
        <p type="p">64:末端效應器</p>  
        <p type="p">64A:使用過之末端效應器</p>  
        <p type="p">64B:使用前之末端效應器</p>  
        <p type="p">65:零件收納裝置</p>  
        <p type="p">66:收納裝置側殼體</p>  
        <p type="p">67:保持體</p>  
        <p type="p">68:升降機構</p>  
        <p type="p">631:基台</p>  
        <p type="p">632:臂</p>  
        <p type="p">632a:前端臂</p>  
        <p type="p">681:馬達</p>  
        <p type="p">682:螺旋軸</p>  
        <p type="p">683:位移構件</p>  
        <p type="p">CU:控制器</p>  
        <p type="p">RP:減壓機構</p>  
        <p type="p">X:消耗零件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2519" publication-number="202628057"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628057.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素電路</chinese-title>  
        <english-title>PIXEL CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251127B">G09G3/3233</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹科學園區新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煒力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種像素電路，包含：發光二極體、第一/第二內節點設定電晶體與亮度控制電晶體。發光二極體電連接於供應電壓線。第一內節點設定電晶體電連接於發光二極體與第一內節點。第二內節點設定電晶體電連接於第二內節點與資料信號線。資料信號線在資料電壓寫入期間的電壓值等於像素資料電壓值。在像素發光期間，像素電流自供應電壓線流經發光二極體、第一內節點設定電晶體與亮度控制電晶體至接地電壓線。像素電流的電流值與第一內節點和第二內節點在像素發光期間的電壓值相關。第二內節點在像素發光期間的電壓值與臨界電壓和像素資料電壓值相關。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel circuit including an LED, a first/second internal node setting transistor, and a brightness control transistor is provided. The LED is electrically connected to a supply voltage line. The first internal node setting transistor is electrically connected to the LED and a first internal node. The second internal node setting transistor is electrically connected to a second internal node and a data signal line. The voltage of the data signal line during a data voltage writing duration is equivalent to a pixel data setting voltage. During a pixel emission duration, a pixel current starting from a supply voltage line to a ground voltage line flows through the LED, the first internal setting transistor, and the brightness control transistor. The current value of the pixel current is related to the voltage of the first internal node and the voltage of the second internal node during the pixel emission duration. The voltage of the second internal node during the pixel emission duration is related to the threshold voltage of the brightness control transistor and the pixel data setting voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Vdd:供應電壓(線)</p>  
        <p type="p">Vss:接地電壓(線)</p>  
        <p type="p">PXLa(m,n):像素電路</p>  
        <p type="p">WS[n]:像素資料寫入用閘極信號(線)</p>  
        <p type="p">RS[n]:重置閘極信號(線)</p>  
        <p type="p">EM[n]:發光致能閘極信號(線)</p>  
        <p type="p">Tgset1,Tgset2,Tsset1,Tsset2,Tqset1,Tqset2:內節點設定電晶體</p>  
        <p type="p">Vini:預設電壓(線)</p>  
        <p type="p">DAT[m]:資料信號(線)</p>  
        <p type="p">Tled(m,n):亮度控制電晶體</p>  
        <p type="p">NDg(m,n),NDq(m,n),NDs(m,n):內節點</p>  
        <p type="p">C(m,n):電容</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2520" publication-number="202627368"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627368.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>極低溫冷凍機及極低溫冷凍機的控制器用表</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">F25B9/06</main-classification>  
        <further-classification edition="200601120260401B">F25B9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新田冬夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTA, TOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森江孝明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIE, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 縮短極低溫冷凍機的降溫時間。 &lt;br/&gt;　　[解決手段] 極低溫冷凍機(10)具備：膨脹機(14)，其具備膨脹機馬達(42)、第1冷卻台(33)及第2冷卻台(35)，並且藉由運轉膨脹機馬達(42)來冷卻第1冷卻台(33)和第2冷卻台(35)；第1溫度感測器(52)，測量第1冷卻台(33)的第1溫度；第2溫度感測器(54)，測量第2冷卻台(35)的第2溫度；及控制器(110)，構成為從第1溫度感測器(52)取得所測量出之第1溫度，從第2溫度感測器(54)取得所測量出之第2溫度，按照第1溫度、第2溫度及膨脹機馬達(42)的轉速的預先設定之關係，根據所測量出之第1溫度和所測量出之第2溫度來決定膨脹機馬達(42)的轉速，依據所決定之轉速來運轉膨脹機馬達(42)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:極低溫冷凍機</p>  
        <p type="p">12:壓縮機</p>  
        <p type="p">14:膨脹機</p>  
        <p type="p">16:膨脹機缸體</p>  
        <p type="p">16a:第1缸體</p>  
        <p type="p">16b:第2缸體</p>  
        <p type="p">18:置換器組裝體</p>  
        <p type="p">18a:第1置換器</p>  
        <p type="p">18b:第2置換器</p>  
        <p type="p">20:膨脹機殼體</p>  
        <p type="p">33:第1冷卻台</p>  
        <p type="p">35:第2冷卻台</p>  
        <p type="p">40:壓力切換閥</p>  
        <p type="p">42:膨脹機馬達</p>  
        <p type="p">43:運動轉換機構</p>  
        <p type="p">44:置換器驅動軸</p>  
        <p type="p">46:電源</p>  
        <p type="p">48:逆變器</p>  
        <p type="p">50:電流感測器</p>  
        <p type="p">52:第1溫度感測器</p>  
        <p type="p">54:第2溫度感測器</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">110:控制器</p>  
        <p type="p">112:溫度速度表</p>  
        <p type="p">S1:馬達電流訊號</p>  
        <p type="p">S2:馬達控制指令</p>  
        <p type="p">T1:第1溫度訊號</p>  
        <p type="p">T2:第2溫度訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2521" publication-number="202628918"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628918.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144086</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置用構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P72/70</main-classification>  
        <further-classification edition="202601120260331B">H10P95/90</further-classification>  
        <further-classification edition="200601120260331B">H05B3/03</further-classification>  
        <further-classification edition="200601120260331B">H05B3/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天野真悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMANO, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梶浦陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJIURA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>都築直起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUZUKI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池上慶太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGAMI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體製造裝置用構件，具備被分區之複數個加熱器電極，且抑制裂紋之產生。半導體製造裝置用構件之中，複數個加熱器電極各自具有：加熱器線路，沿著平行於陶瓷基板的上表面之方向延伸；且於虛擬俯視複數個加熱器電極時，複數個加熱器電極中之至少一個加熱器電極的加熱器線路的長度中之90%以上的長度部分，係藉由角度範圍20°以內之複數個直線部分來構成，且各跨接電極層，係藉由隔著呈線狀延伸之絕緣體而電性分離之複數個平面狀跨接電極所構成，且該呈線狀延伸之絕緣體，與至少一個加熱器電極中之加熱器線路的任一直線部分，均在上下方向不呈線狀重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體製造裝置用構件</p>  
        <p type="p">20:陶瓷基板</p>  
        <p type="p">20a:中央部</p>  
        <p type="p">20b:外周部</p>  
        <p type="p">21a:上表面</p>  
        <p type="p">21b:上表面</p>  
        <p type="p">23:下表面</p>  
        <p type="p">26:靜電吸附用電極</p>  
        <p type="p">27:加熱器電極</p>  
        <p type="p">29:跨接電極層</p>  
        <p type="p">30:底板</p>  
        <p type="p">30a:中央部</p>  
        <p type="p">30b:凸緣部</p>  
        <p type="p">31a:上表面</p>  
        <p type="p">31b:上表面</p>  
        <p type="p">32:冷媒流道</p>  
        <p type="p">33:下表面</p>  
        <p type="p">35:凹部</p>  
        <p type="p">40:接合層</p>  
        <p type="p">42:絕緣膜</p>  
        <p type="p">52:端子密集部</p>  
        <p type="p">55:單一區劃</p>  
        <p type="p">63:第三通孔</p>  
        <p type="p">71:共用跨接片</p>  
        <p type="p">72:共用端子</p>  
        <p type="p">73:接地線</p>  
        <p type="p">78:聚焦環</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2522" publication-number="202628225"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628225.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組及包含其的載具</chinese-title>  
        <english-title>BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260102B">H01M10/6552</main-classification>  
        <further-classification edition="201401120260102B">H01M10/6568</further-classification>  
        <further-classification edition="201901120260102B">B60L50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘辰基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAN, JIN-GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鍾珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JONG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白承律</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, SEUNG-RYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余景模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEO, KYEONG-MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種在多個層的電池單體陣列結構中具有改善冷卻性能的電池組以及包括其的載具。電池組包括堆疊在至少多個層中的多個電池單體陣列，電池單體陣列包括多個電池單體和用於冷卻多個電池單體的冷卻單元；管路組件，被配置為允許冷卻流體流入冷卻單元和從冷卻單元流出；以及多個連接器單元，連接至管路組件且被配置為允許冷卻流體在每個層中彼此相鄰配置的多個電池單體陣列的多個冷卻單元中相對於電池組的寬度方向沿不同方向流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a battery pack having improved cooling performance in a multi-layer battery cell array structure and a vehicle including the same. The battery pack includes a plurality of battery cell arrays stacked in at least multiple layers, the battery cell array including a plurality of battery cells and a cooling unit for cooling the plurality of battery cells; a pipe assembly configured to allow a cooling fluid to flow into and out of the cooling unit; and a plurality of connector units connected to the pipe assembly and configured to allow the cooling fluid to flow in different directions relative to a width direction of the battery pack in the cooling units of battery cell arrays arranged adjacent to each other in each layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池組</p>  
        <p type="p">100、101:電池單體陣列</p>  
        <p type="p">200:管路組件</p>  
        <p type="p">300:連接器單元</p>  
        <p type="p">400:組殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2523" publication-number="202626101"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626101.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用ＣＤ１９－ＣＤ２０雙ＣＡＲ－Ｔ細胞治療狼瘡之方法</chinese-title>  
        <english-title>METHODS OF TREATING LUPUS WITH CD19-CD20 DUAL CAR-T CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">A61K40/11</main-classification>  
        <further-classification edition="202501120260401B">A61K40/31</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商建南德克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENENTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博司達治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POSEIDA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努內斯　多斯　桑托斯　克里斯蒂安　德　赫蘇斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUNES DOS SANTOS, CRISTIANE DE JESUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞雷瑪　克里斯汀　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAREMA, KRISTIN A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝德洛克　得文　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEDLOCK, DEVON J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供藉由投予包含抗 CD20 嵌合抗原受體及抗 CD19 嵌合抗原受體的嵌合抗原受體 T 細胞 (CAR-T 細胞) 來治療全身性紅斑狼瘡&lt;i/&gt;(例如，高活動度、嚴重、治療難治性全身性紅斑狼瘡) 之方法。本揭露亦提供一種包含組成物之劑量輸注袋，該組成物包含 CAR-T 細胞，該等 CAR-T 細胞包含抗 CD20 嵌合抗原受體及抗 CD19 嵌合抗原受體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods of treating a systemic lupus erythematosus (&lt;i&gt;e.g.&lt;/i&gt; highly active, severe, treatment-refractory systemic lupus erythematosus) by administering a chimeric antigen receptor T cell (CAR-T cell) comprising an anti-CD20 chimeric antigen receptor and an anti-CD19 chimeric antigen receptor. The present disclosure also provides a dose infusion bag comprising a composition comprising CAR-T cells comprising an anti-CD20 chimeric antigen receptor and an anti-CD19 chimeric antigen receptor.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2524" publication-number="202628129"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628129.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於分析螢光標記循環上皮細胞的系統、方法與電腦程式產品</chinese-title>  
        <english-title>SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR ANALYZING FLUORESCENTLY LABELED CIRCULATING EPITHELIAL CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260401B">G16H50/20</main-classification>  
        <further-classification edition="201701120260401B">G06T7/00</further-classification>  
        <further-classification edition="202601120260401B">G01N33/575</further-classification>  
        <further-classification edition="200601120260401B">G01N33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方圓細胞生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACROCYTE THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　瑛芝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　兆嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LAUREN ELEANOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　昭霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LUCAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仁家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JEN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於分析具備螢光標記的循環上皮細胞的影像的分析系統，包括一處理器。處理器執行一處理程序，其中處理程序包括步驟：從影像中偵測多個細胞區域的邊界；於每個細胞區域中量測螢光訊號強度，以計算每個細胞區域的多種細胞標記的表現量；以及根據每個細胞區域的多種細胞標記的表現量，判斷每個細胞區域的多種細胞標記的標記狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An analysis system for analyzing an image of fluorescently labeled circulating epithelial cells includes at least a processor. The processor executes a processing procedure, wherein the processing procedure includes steps of: detecting boundaries of multiple cell areas from the image; measuring fluorescence signal intensity of each cell area to calculate expression levels of various cell markers of each cell area; and determining marker statuses of various cell markers of each cell area according to the expression levels of various cell markers of each cell area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:分析系統</p>  
        <p type="p">2:處理器</p>  
        <p type="p">3:電腦程式產品</p>  
        <p type="p">4:非暫態電腦可讀取媒體</p>  
        <p type="p">10:取像裝置</p>  
        <p type="p">20:影像預處理模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2525" publication-number="202626642"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626642.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144200</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吖呾ＰＡＲＰ１抑制劑之晶形</chinese-title>  
        <english-title>CRYSTALLINE FORMS OF AN AZETIDINE PARP1 INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D471/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/444</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石　兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述5-(((2R,3S)-1-((7-氯-6-側氧基-5,6-二氫-1,5-㖠啶-3-基)甲基)-2-甲基吖呾-3-基)氧基)-N-環丙基吡啶醯胺（化合物1）之晶形或其醫藥上可接受之鹽或溶劑合物。&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="156px" width="316px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are crystalline forms of 5-(((2R,3S)-1-((7-chloro-6-oxo-5,6-dihydro-1,5-naphthyridin-3-yl)methyl)-2-methylazetidin-3-yl)oxy)-N-cyclopropylpicolinamide (Compound 1), or a pharmaceutically acceptable salt or solvate thereof.&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="155px" width="322px" file="ed10005.JPG" alt="ed10005.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2526" publication-number="202626497"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626497.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鋰離子電池廢料直接回收之連續運作之方法及系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS FOR CONTINUOUS OPERATION OF DIRECT RECYCLING OF LITHIUM ION BATTERY WASTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C01B25/30</main-classification>  
        <further-classification edition="200601120260323B">C22B1/16</further-classification>  
        <further-classification edition="200601120260323B">C22B1/24</further-classification>  
        <further-classification edition="200601120260323B">C01D15/00</further-classification>  
        <further-classification edition="201001120260323B">H01M10/0525</further-classification>  
        <further-classification edition="201001120260323B">H01M10/054</further-classification>  
        <further-classification edition="200601120260323B">H01M6/52</further-classification>  
        <further-classification edition="202201320260323B">B09B101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商鋰工科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　元平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUNG, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇　亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊泰然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TAIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIAYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　征</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭盼妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, PANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於直接回收鋰離子電池廢料以促進回收及再利用電池材料之一連續程序(特別是針對磷酸鐵鋰(LFP)及基於其衍生物之鋰離子電池)之方法及系統。所揭示之技術可實現跨各種生命週期階段高效回收電池，包含由製造、使用及報廢處置產生之廢料。所得回收材料可維持適合於再利用之品質及完整性以提供滿足鋰離子電池之不斷增長需求之一可持續解決方案，同時減少環境足跡。所提出之系統適用於大規模連續運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods and systems for the direct recycling of lithium-ion battery waste, facilitating a continuous process to reclaim and reuse battery materials, particularly targeting lithium iron phosphate (LFP) and its derivative-based lithium-ion batteries. The disclosed techniques can enable efficient recycling of batteries across various lifecycle stages, including waste generated from manufacturing, usage, and end-of-life disposal. The resulting recycled materials can maintain quality and integrity suitable for reuse, providing a sustainable solution to meet the growing demand for lithium-ion batteries while reducing environmental footprint. The proposed system is adaptable for large-scale, continuous operations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:方法</p>  
        <p type="p">11至19:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2527" publication-number="202626225"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626225.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改善釩合金粉末冶金法製造之冷作工具鋼之耐磨性之方法</chinese-title>  
        <english-title>A METHOD FOR IMPROVING THE WEAR RESISTANCE OF VANADIUM ALLOYED POWDER METALLURGY PRODUCED COLD WORK TOOL STEELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B22F3/12</main-classification>  
        <further-classification edition="200601120260325B">B22F3/17</further-classification>  
        <further-classification edition="200601120260325B">B22F3/18</further-classification>  
        <further-classification edition="200601120260325B">B22F3/24</further-classification>  
        <further-classification edition="200601120260325B">C22C38/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商伍德赫爾恩股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UDDEHOLMS AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彥傑馬克　瑟班天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EJNERMARK, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於改善釩合金粉末冶金法製造之冷作工具鋼之耐磨性之方法，該工具鋼包含1-20% V、1-5% Mo及≤1% W，其藉由以下進行：對鋼進行HIP處理，及使經HIP之鋼在比工具鋼之固相線溫度高至少5℃之溫度下經受熱處理至少30分鐘之時間以增加VC粒子之尺寸，其中硬化及回火後之冷作工具鋼除VC之外不含明顯量之其他碳化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is directed to a method for improving the wear resistance of a vanadium alloyed powder metallurgy produced cold work tool steel comprising 1-20 %V, 1 – 5 %Mo and ≤ 1 %W by HIPing the steel and subjecting the HIPed steel to a heat treatment at a temperature of at least 5 °C higher than the solidus temperature of the tool steel for a time of at least 30 minutes in order to increase the size of the VC-particles, wherein the cold work tool steel after hardening and tempering does not contain noticeable amounts of other carbides than VC.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2528" publication-number="202628888"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628888.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保管系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P72/10</main-classification>  
        <further-classification edition="202601120260331B">H10P72/70</further-classification>  
        <further-classification edition="202601120260331B">H10P72/30</further-classification>  
        <further-classification edition="200601120260331B">B65D85/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄澤菊乃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARASAWA, KIKUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田浩二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野山泰斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENOYAMA, TAITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板垣哲彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAGAKI, TETSUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">具備有：層積體(ST)，能夠保持一片晶圓(W)的一個保持構件(90)，在上下方向上複數層積而成；容器(80)，儲存層積體(ST)；轉移裝置(20)，能夠對構成層積體(ST)的保持構件(90)移載晶圓(W)；及儲存裝置(30)，能夠對容器(80)取出或放入層積體(ST)。儲存裝置(30)，具有：升降台(26B)，使被支撐於底部(84)的狀態的層積體(ST)進行升降；及容器載置部(29)，配置於升降台(26B)的上方，從被支撐於底部(84)的狀態的層積體(ST)能夠通過的開口部(29C)的外側載置蓋部(81)的周緣，升降台(26B)，藉由使載置於底部(84)的層積體(ST)升降，經由開口部(29C)對容器(80)取出或放入層積體(ST)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">25:環體開啟器</p>  
        <p type="p">26A:基座</p>  
        <p type="p">26B:升降器(升降台)</p>  
        <p type="p">26Ba:彈性構件</p>  
        <p type="p">26C:滾珠螺桿</p>  
        <p type="p">26D:線性導件</p>  
        <p type="p">26E:殼體</p>  
        <p type="p">26Ea:上面</p>  
        <p type="p">26F:吸引裝置</p>  
        <p type="p">27:第一開關模組</p>  
        <p type="p">27A:第一環支撐部</p>  
        <p type="p">27B:第二環支撐部</p>  
        <p type="p">28:第二開關模組</p>  
        <p type="p">28A:第三環支撐部</p>  
        <p type="p">28B:第四環支撐部</p>  
        <p type="p">29:容器載置部</p>  
        <p type="p">29A:彈性構件</p>  
        <p type="p">29C:開口部</p>  
        <p type="p">80:晶圓容器(容器)</p>  
        <p type="p">81:蓋部</p>  
        <p type="p">84:底部</p>  
        <p type="p">87:覆蓋部</p>  
        <p type="p">S1:升降空間</p>  
        <p type="p">ST:層積體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2529" publication-number="202627132"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627132.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不鏽鋼板及其製造方法，及煞車碟盤轉子及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C22C38/40</main-classification>  
        <further-classification edition="200601120260316B">C22C38/48</further-classification>  
        <further-classification edition="200601120260316B">C22C38/50</further-classification>  
        <further-classification edition="200601120260316B">C22C38/54</further-classification>  
        <further-classification edition="200601120260316B">C22C38/52</further-classification>  
        <further-classification edition="200601120260316B">C21D9/46</further-classification>  
        <further-classification edition="200601120260316B">F16D65/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉澤俊希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIZAWA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種不鏽鋼板，其以質量基準計，含有：C：0.001~ &lt;br/&gt;0.150%、N：0.0010~0.3000%、Si：0.01~3.00%、Mn：0.010~5.000%、P：0.001~0.100%、S：0.0001~0.1000%、Cr：15.0%~25.0%、Ni：0.010~5.000%，剩餘部分為Fe及雜質， &lt;br/&gt;　　以下述(1)式所表示的A值為55~150， &lt;br/&gt;　　KAM值為0.00~0.65˚的組織的面積率為20.0~75.0%，KAM值為超過0.65˚、5.00˚以下的組織的面積率為25.0~80.0 &lt;br/&gt;%，且 &lt;br/&gt;　　維氏硬度為200~300HV。 &lt;br/&gt;　　A值=420C+470N+23Ni+7Mn-11.5Cr-11.5Si+189  (1) &lt;br/&gt;　　式中，各元素符號表示各元素的含量(%)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2530" publication-number="202628311"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628311.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大容量電容器充電系統及其控制方法</chinese-title>  
        <english-title>BULK CAPACITOR CHARGING SYSTEM AND CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H02J7/04</main-classification>  
        <further-classification edition="200601120260325B">H02J7/14</further-classification>  
        <further-classification edition="202601120260325B">H02J7/60</further-classification>  
        <further-classification edition="202601120260325B">H02J7/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普坎　里彭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHUKAN, RIPUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種大容量電容器預充電控制方法，包括：提供耦合於電源以及大容量電容器之間的功率轉換器；於第一預充電週期，啟動選自第一整流器以及第二整流器之開關中的一個開關以對大容量電容器充電；於第一預充電週期後之第二預充電週期，啟動選自第一整流器以及第二整流器之開關中的兩個開關以對大容量電容器充電；於第二預充電週期後之第三預充電週期，啟動選自第一整流器以及第二整流器之開關中的三個開關以對大容量電容器充電，其中三個開關中的兩個開關彼此同步。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bulk capacitor pre-charge control method includes providing a power converter coupled between a power source and a bulk capacitor, in a first pre-charge period, activating one switch selected from switches of the first rectifier and the second rectifier to charge the bulk capacitor, in a second pre-charge period immediately following the first pre-charge period, activating two switches selected from the switches of the first rectifier and the second rectifier to charge the bulk capacitor, and in a third pre-charge period immediately following the second pre-charge period, activating three switches selected from the switches of the first rectifier and the second rectifier to charge the bulk capacitor, wherein two of the three switches are synchronized with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:功率轉換系統</p>  
        <p type="p">110:功率轉換器</p>  
        <p type="p">200:控制器</p>  
        <p type="p">BH:高壓電源</p>  
        <p type="p">BL:低壓電源</p>  
        <p type="p">CB:大容量電容器</p>  
        <p type="p">RL1:繼電器</p>  
        <p type="p">VB:高壓匯流排</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2531" publication-number="202626492"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626492.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生產高純度氫氣之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR PRODUCING HIGH-PURITY HYDROGEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">C01B3/50</main-classification>  
        <further-classification edition="200601120260401B">B01D3/14</further-classification>  
        <further-classification edition="200601120260401B">B01D5/00</further-classification>  
        <further-classification edition="200601120260401B">B01D53/00</further-classification>  
        <further-classification edition="200601120260401B">F25J3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商德希尼布能源法國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNIP ENERGIES FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬錢德蘭　文卡特什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMACHANDRAN, VENKATESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊姆蘭　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMRAN, MUCHAMMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛夫勒　路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOEFFLER, LOUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里希納辛　拉傑恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNASING, RADJEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉拉姆　喬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUILLAUME, JOEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產高純度氫燃料氣體之系統可包括冷卻系列，該冷卻系列經組態以接收純化之經壓縮裂解氣並生產一或多個冷凝液體流及尾氣流；及去甲烷塔，其位於該冷卻系列之下游，經組態以接收該一或多個冷凝液體流之至少一部分並生產去甲烷器頂部流及去甲烷器底部流。系統可經組態以使尾氣不與去甲烷器頂部流混合。相反，系統可經組態以在多級氫氣膨脹單元中處理尾氣流，以生產用於高純度氫燃料氣體之氫氣流並在甲烷膨脹器及桶單元中處理去甲烷器頂部流，以生產甲烷流。氫氣流及甲烷流可用作冷卻系列中之冷媒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for producing high-purity hydrogen fuel gas may include a chilling train configured to receive a purified, compressed cracked gas and produce one or more condensed liquid streams and a tail gas stream; and a demethanizer tower downstream of the chilling train configured to receive at least a portion of the one or more condensed liquid streams and produce a demethanizer overhead stream and a demethanizer bottoms stream. The system may be configured such that the tail gas and demethanizer overhead streams are not mixed. Rather, the system may be configured to process the tail gas stream in a multi-stage hydrogen expansion unit to produce a hydrogen stream for the high-purity hydrogen fuel gas and process the demethanizer overhead stream in a methane expander and drum unit to produce a methane stream. The hydrogen stream and methane stream may be used as a refrigerant in the chilling train.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裂解氣流</p>  
        <p type="p">102:多級裂解氣壓縮單元</p>  
        <p type="p">104:C3+流</p>  
        <p type="p">106:經壓縮裂解氣流</p>  
        <p type="p">108:乙炔氫化單元</p>  
        <p type="p">110:純化之經壓縮裂解氣流</p>  
        <p type="p">112:冷卻系列</p>  
        <p type="p">114:熱交換器</p>  
        <p type="p">116:冷凝液體流；液體底部物</p>  
        <p type="p">118,120:冷凝液體流</p>  
        <p type="p">122:尾氣流</p>  
        <p type="p">124:去甲烷塔</p>  
        <p type="p">126:去甲烷器底部流</p>  
        <p type="p">128:去甲烷器頂部流</p>  
        <p type="p">130:甲烷膨脹器及桶單元</p>  
        <p type="p">132:液體烴底部流</p>  
        <p type="p">134:甲烷頂部流</p>  
        <p type="p">136:多級氫氣膨脹單元</p>  
        <p type="p">138:再循環流</p>  
        <p type="p">140:甲烷產物流</p>  
        <p type="p">142:氫氣流</p>  
        <p type="p">144:壓縮機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2532" publication-number="202628436"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628436.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144319</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>增益自適應讀出電路、增益控制器電路及其操作方法</chinese-title>  
        <english-title>GAIN ADAPTIVE READOUT CIRCUIT, GAIN CONTROLLER CIRCUIT AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H04N25/78</main-classification>  
        <further-classification edition="200601120260202B">H03M1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, ZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗雷森　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRESON, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭弦溶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, HYUNYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋明來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, MYONGLAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種採樣及保持電路包括耦合到畫素胞元的畫素層級連接。在電壓域全域快門操作中，依序對重置電壓及信號電壓進行採樣並將重置電壓及信號電壓儲存在重置電容器及信號電容器中。在讀出時，首先將所儲存的信號電壓讀出到比較電路，以確定用於類比數位轉換器電路的最佳增益因子，從而充分利用類比數位轉換器的轉換範圍來實現更好的訊雜比。一旦通過將信號電壓與預定的閾值電壓進行比較而確定並設定了用於類比數位轉換器的更好的增益，相同的信號電壓便被類比數位轉換器直接轉換以變成數位信號值。然後，類比數位轉換器將所儲存的重置電壓轉換成數位重置值而不改變增益因子，進而縮短讀出時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sample and hold circuit includes a pixel level connection coupled to a pixel cell. In a voltage domain global shutter operation, a reset voltage and a signal voltage are sampled and stored in a reset capacitor and a signal capacitor sequentially. In readout, the stored signal voltage is read out first to a comparing circuit to determine the best gain factor for the analog to digital converter (ADC) circuit to fully utilize the conversion range of the ADC to achieve a better signal to noise ratio. Once the better gain is determined and set for the ADC by comparing the signal voltage with a pre-determined threshold voltage, the same signal voltage is converted directly to become a digital signal value by the ADC. Then, the stored reset voltage is converted to a digital reset value by the ADC without changing the gain factor, to shorten the readout time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">114:畫素晶粒</p>  
        <p type="p">116:應用專用積體電路晶粒</p>  
        <p type="p">200:畫素讀出電路</p>  
        <p type="p">204:畫素胞元</p>  
        <p type="p">206:畫素線連接/畫素層級連接</p>  
        <p type="p">208、V_PIX:畫素線電壓</p>  
        <p type="p">218:採樣及保持電路</p>  
        <p type="p">222:重置開關信號/重置開關/重置存取開關/電晶體</p>  
        <p type="p">224、Cr:重置電容器/重置儲存電容器</p>  
        <p type="p">226:第二重置電晶體</p>  
        <p type="p">227:電壓偏置電晶體</p>  
        <p type="p">228:全域快門畫素</p>  
        <p type="p">232:斜坡電壓信號/動態斜升信號/斜坡信號/電晶體/信號存取開關</p>  
        <p type="p">234、Cs:信號電容器/信號儲存電容</p>  
        <p type="p">236:第二源極跟隨器電晶體</p>  
        <p type="p">238:第二列選擇電晶體</p>  
        <p type="p">239:電流源</p>  
        <p type="p">240:位線</p>  
        <p type="p">241:G帽比較器</p>  
        <p type="p">242:G帽單元</p>  
        <p type="p">243:G帽鎖存器</p>  
        <p type="p">244:閾值電壓/閾值電壓值</p>  
        <p type="p">245、246:輸出</p>  
        <p type="p">250:增益級</p>  
        <p type="p">260:類比數位轉換器</p>  
        <p type="p">280:ADC比較器/比較器</p>  
        <p type="p">282:ADC自動調零信號/自動調零信號</p>  
        <p type="p">284:輸出/電壓信號</p>  
        <p type="p">290:ADC計數器</p>  
        <p type="p">292、DOUT:數位值/輸出數位值</p>  
        <p type="p">AZ:自動調零</p>  
        <p type="p">BL:位線</p>  
        <p type="p">HB:混合接合</p>  
        <p type="p">lg_en:信號/輸出信號</p>  
        <p type="p">V_BL:位線電壓/BL電壓</p>  
        <p type="p">V_TH:閾值電壓/閾值電壓值</p>  
        <p type="p">Vramp:斜坡電壓信號/斜坡信號/動態斜升信號</p>  
        <p type="p">Vin:輸出/類比信號/電壓信號</p>  
        <p type="p">Vsig:信號電壓</p>  
        <p type="p">Vrst:重置電壓</p>  
        <p type="p">VB:偏置電壓</p>  
        <p type="p">PD:光電二極體</p>  
        <p type="p">TX:轉移信號</p>  
        <p type="p">FD:浮動擴散</p>  
        <p type="p">RST:重置</p>  
        <p type="p">RST2:第二重置</p>  
        <p type="p">rst2:第二重置信號</p>  
        <p type="p">RS2:第二列選擇</p>  
        <p type="p">rs2:第二列控制信號</p>  
        <p type="p">PIXVD:畫素電壓源</p>  
        <p type="p">SF:源極跟隨器</p>  
        <p type="p">SF2:第二源極跟隨器</p>  
        <p type="p">SEL:選擇</p>  
        <p type="p">SVD:電源電壓</p>  
        <p type="p">SWr:重置開關信號/重置開關</p>  
        <p type="p">SWs:信號開關信號/信號存取開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2533" publication-number="202626046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RAS抑制劑和PD-1/PD-L1抑制劑的組合及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/504</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61K31/282</further-classification>  
        <further-classification edition="200601120260401B">A61K31/555</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣州嘉越醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGZHOU JOYO PHARMATECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商醫睿世康藥業研發公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERASCA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YONGGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隗維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉未</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬金貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, JINGUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒梅克　羅伯特　菲爾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOEMAKER, ROBERT FIELD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種RAS抑制劑和PD-1/PD-L1抑制劑的組合及其用途。本公開具體涉及一種RAS抑制劑和PD-1/PD-L1抑制劑的組合及其用於治療腫瘤的用途，其中RAS抑制劑為化合物1或其藥學上可接受的鹽。&lt;br/&gt;&lt;img align="absmiddle" height="202px" width="267px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2534" publication-number="202626058"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626058.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＲＡＳ及ＰＤ－１或ＰＤ－Ｌ１抑制劑組合療法</chinese-title>  
        <english-title>RAS AND PD-1 OR PD-L1 INHIBITORS COMBINATION THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/551</main-classification>  
        <further-classification edition="200601120260401B">A61K31/504</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊瑞斯卡公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERASCA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣州嘉越醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGZHOU JOYO PHARMATECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休梅克　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOEMAKER, ROBERT FIELD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　艾琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEW, ERIN DENISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍盧布　科琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLUB, CORINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案大體上係關於泛RAS或KRAS抑制劑與PD-1或PD-L1抑制劑組合用於治療癌症、特定言之實體腫瘤之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates generally to the use a Pan-RAS or a KRAS inhibitor in combination with a PD-1 or PD-L1 inhibitor for treating cancer, specifically solid tumors.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2535" publication-number="202626793"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626793.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144369</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、膜、積層膜、及脫模膜</chinese-title>  
        <english-title>RESIN COMPOSITION, CURED PRODUCT, FILM, LAMINATED FILM, AND RELEASE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F210/02</main-classification>  
        <further-classification edition="200601120260401B">C08F232/08</further-classification>  
        <further-classification edition="200601120260401B">C08F236/20</further-classification>  
        <further-classification edition="202501120260401B">C08L23/08</further-classification>  
        <further-classification edition="200601120260401B">C08K3/16</further-classification>  
        <further-classification edition="200601120260401B">C08K5/5425</further-classification>  
        <further-classification edition="200601120260401B">C08K5/549</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">B32B27/18</further-classification>  
        <further-classification edition="200601120260401B">B32B27/32</further-classification>  
        <further-classification edition="200601120260401B">B29C33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平原賢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAHARA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝比奈浩太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHINA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種樹脂組成物，包含：具有交聯性基的烯烴系聚合物（A）、及錯合物（B），所述錯合物（B）包含金屬原子及配位體，當將所述烯烴系聚合物（A）的含量設為100質量份時，所述錯合物（B）的含量為0.0001質量份以上且5質量份以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基材層(a)</p>  
        <p type="p">20:樹脂層(b)</p>  
        <p type="p">100:積層膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2536" publication-number="202629047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144370</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體器件及其製造方法、底塗層形成用樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260321B">H10W74/47</main-classification>  
        <further-classification edition="202601120260321B">H10W74/10</further-classification>  
        <further-classification edition="200601120260321B">C08L79/08</further-classification>  
        <further-classification edition="201901120260321B">B32B7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉祥亮汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KICHIJO, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三澤祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISAWA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田貴広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKADA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤英一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, EIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體器件，具有：半導體元件，搭載於基板上；密封層，對所述半導體元件進行密封；以及底塗層，使用底塗層形成用樹脂組成物形成，並包覆所述半導體元件的至少側面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:半導體元件</p>  
        <p type="p">3:密封層(密封樹脂層)</p>  
        <p type="p">4:底塗層</p>  
        <p type="p">10:半導體器件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2537" publication-number="202626615"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626615.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含低雜質含量之２，４，６－三［（１，１＇－聯苯）－４－基］－１，３，５－三嗪之組合物</chinese-title>  
        <english-title>COMPOSITION COMPRISING 1,3,5-TRIAZINE, 2,4,6-TRIS[1,1'-BIPHENYL]-4-YL WITH LOWER AMOUNTS OF IMPURITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C07D251/24</main-classification>  
        <further-classification edition="200601120260325B">A61K8/49</further-classification>  
        <further-classification edition="200601120260325B">A61Q17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴地斯顏料化工廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼基　烏爾里奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENGE, ULLRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾布洛赫　馬庫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOBLOCH, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威伯爾斯　克里斯多夫　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIGBERS, CHRISTOF WILHELM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舍拉佛　約翰尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHLAEFER, JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯隆邁爾　漢默特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRONEMAYER, HELMUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於生產2,4,6-三[(1,1'-聯苯)-4-基]-1,3,5-三嗪(TBPT)之特定方法，其中所得產物中之(重)金屬雜質減少。此外，本發明係關於藉由此特定方法獲得之TBPT、包含該獲得之TBPT之化妝產品，以及該獲得之TBPT作為化妝產品中之UV濾光劑用於保護個體之毛髮及/或皮膚免受UV輻射之損害效應之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a specific process for the production of 1,3,5-triazine,2,4,6-tris[1,1’-biphenyl]-4-yl (TBPT), wherein (heavy) metal impurities are reduced in the resulting product. Furthermore, the invention relates to TBPT obtained by this specific process, to cosmetic products comprising the obtained TBPT and to uses of the obtained TBPT as a UV filter in a cosmetic product for protecting hair and/or skin of a subject from the damaging effects of UV radiation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2538" publication-number="202626056"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626056.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於預防或治療與多巴胺功能異常相關的不自主運動之醫藥組合物</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITION FOR PREVENTING OR TREATING INVOLUNTARY MOVEMENTS RELATED TO DOPAMINERGIC DYSFUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/549</main-classification>  
        <further-classification edition="201701120260401B">A61K47/34</further-classification>  
        <further-classification edition="200601120260401B">A61K9/107</further-classification>  
        <further-classification edition="200601120260401B">A61P25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中正大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG CHENG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳珮君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳靜誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於預防或治療多巴胺功能異常相關的不自主運動之醫藥組合物，包括：一鉀離子通道開啟劑及一藥學上可接受的載體，其中，該藥學上可接受的載體為一微胞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a pharmaceutical composition for preventing or treating involuntary movement disorders resulting from dopaminergic dysfunction. The composition comprises a potassium channel opener as an active ingredient and a pharmaceutically acceptable micellar carrier.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2539" publication-number="202627098"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627098.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>疫苗</chinese-title>  
        <english-title>VACCINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N15/45</main-classification>  
        <further-classification edition="200601120260401B">C12N15/40</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">C07K14/08</further-classification>  
        <further-classification edition="200601120260401B">A61K39/12</further-classification>  
        <further-classification edition="200601120260401B">A61K39/155</further-classification>  
        <further-classification edition="200601120260401B">A61K9/51</further-classification>  
        <further-classification edition="200601120260401B">A61P31/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商阿斯特捷利康公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTRAZENECA AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫洛卡瓦　切恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKAWA, CHEYNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉利伯特　傑森保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LALIBERTE, JASON PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊爾　韋德史丹頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAIR, WADE STANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種mRNA分子，其編碼多肽，該多肽包含hMPV F蛋白或其免疫原性片段、及能夠多聚化以形成奈米粒子之二氧四氫蝶啶合成酶(LuS)。本揭露之進一步態樣係關於包含該mRNA分子之組成物、及其作為包括由hMPV及RSV所引起之預防感染性疾病之疫苗之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to an mRNA molecule encoding a polypeptide comprising an hMPV F protein, or an immunogenic fragment thereof, and a lumazine synthase (LuS) capable of multimerising to form a nanoparticle. Further aspects of the disclosure relate to compositions comprising the mRNA molecule and their use as a vaccine in the prevention of infectious diseases, including those caused by hMPV and RSV.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2540" publication-number="202628758"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628758.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設備</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251120B">H10K59/121</main-classification>  
        <further-classification edition="202301120251120B">H10K59/122</further-classification>  
        <further-classification edition="202301120251120B">H10K59/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔仁愛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, INAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成世宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEONG, SEJONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示設備，包含具有多個像素之基板，每個像素具有多個子像素。第一非發光區域設置於基板上並定位於每個子像素內，且第二非發光區域連接至第一非發光區域並位於多個子像素的相鄰子像素之間。發光區域設置為相鄰於第一非發光區域及第二非發光區域兩者。修復部設置於第一非發光區域中以在發生短路時支持電氣斷開。此配置使得能夠擴大發光區域並在子像素結構內保持修復功能的同時增強發光效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus includes a substrate having a plurality of pixels, each pixel having a plurality of subpixels. A first non-light emission area is provided on the substrate and positioned within each subpixel, and a second non-light emission area is connected to the first non-light emission area and located between adjacent subpixels of the plurality of subpixels. A light-emission area is arranged adjacent to both the first non-light emission area and the second non-light emission area. A repair portion is disposed in the first non-light emission area to support electrical disconnection in the event of a short circuit. This configuration enables expansion of the light-emission area and enhances light emission efficiency while maintaining repair functionality within the subpixel structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CA:電路區域</p>  
        <p type="p">CDP:顯示設備</p>  
        <p type="p">EA:發光區域</p>  
        <p type="p">NEA1:第一非發光區域</p>  
        <p type="p">RPP:修復部</p>  
        <p type="p">SP:子像素</p>  
        <p type="p">W1:第一長度/第一寬度</p>  
        <p type="p">W2:第二長度/第二寬度</p>  
        <p type="p">W3:第三長度/第三寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2541" publication-number="202626859"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626859.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氫氟醚聚合物</chinese-title>  
        <english-title>HYDROFLUOROETHER POLYMERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G65/48</main-classification>  
        <further-classification edition="200601120260401B">C08L71/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商世索科專業聚合物義大利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYENSQO SPECIALTY POLYMERS ITALY S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮塔納　席莫內塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONTANA, SIMONETTA ANTONELLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹尼索夫　伊凡尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENISOV, EVGENY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿格茲　瑪麗娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGAZZI, MARINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬山諾比爾　格瑞奇安諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAZZANOBILE, GRAZIANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於包含(全)(鹵代)芳香族基團的新聚合物、用於其製造的方法及其衍生物，該等衍生物係用於適用於各種工業和應用的組成物的有用的添加劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to new polymers comprising (per)(halo)aromatic groups, to methods for their manufacture and to derivatives thereof that are useful additives for compositions suitable for several industries and applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2542" publication-number="202627300"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627300.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空幫浦系統、真空系統及產生真空之方法</chinese-title>  
        <english-title>A VACUUM PUMP SYSTEM, A VACUUM SYSTEM, AND A METHOD FOR GENERATING A VACUUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">F04C25/02</main-classification>  
        <further-classification edition="200601120260331B">F04C28/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商愛德華有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯金斯　馬克　愛德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMKINS, MARK EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種真空幫浦系統(10)，其包括：複數個幫浦級(12)，其等經並聯配置，其中該複數個幫浦級(12)之各幫浦級(12)之一入口(14)可連接至一接收端(102)；及一排氣幫浦(30)，其中該複數個幫浦級(12)之各幫浦級(12)之一出口(26)經由一歧管(28)連接至該排氣幫浦(30)之一入口(32)。此外，本發明係關於一種真空系統及一種產生一真空之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a vacuum pump system (10), comprising a plurality of pump stages (12) arranged in parallel, wherein an inlet (14) of each pump stage (12) of the plurality of pump stages (12) is connectable to a recipient (102); and an exhaust pump (30), wherein an outlet (26) of each pump stage (12) of the plurality of pump stages (12) is connected via a manifold (28) to an inlet (32) of the exhaust pump (30). Furthermore, the invention relates to a vacuum system and a method for generating a vacuum.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:真空幫浦系統</p>  
        <p type="p">12:幫浦級</p>  
        <p type="p">14:入口</p>  
        <p type="p">16:入口歧管</p>  
        <p type="p">18:入口</p>  
        <p type="p">26:出口</p>  
        <p type="p">28:歧管</p>  
        <p type="p">30:排氣幫浦</p>  
        <p type="p">32:入口</p>  
        <p type="p">34:出口</p>  
        <p type="p">36:旁路</p>  
        <p type="p">38:閥</p>  
        <p type="p">48:殼體</p>  
        <p type="p">50a:空間/切片</p>  
        <p type="p">50b:空間/設施切片</p>  
        <p type="p">52:幫浦控制系統</p>  
        <p type="p">100:真空系統</p>  
        <p type="p">102:接收端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2543" publication-number="202628152"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628152.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144493</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有分子篩選材料之超級電容器</chinese-title>  
        <english-title>ULTRACAPACITOR WITH A MOLECULAR SIEVE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260401B">H01G11/00</main-classification>  
        <further-classification edition="201301120260401B">H01G11/24</further-classification>  
        <further-classification edition="201301120260401B">H01G11/32</further-classification>  
        <further-classification edition="201301120260401B">H01G11/52</further-classification>  
        <further-classification edition="201301120260401B">H01G11/56</further-classification>  
        <further-classification edition="201301120260401B">H01G11/78</further-classification>  
        <further-classification edition="200601120260401B">B01J20/18</further-classification>  
        <further-classification edition="200601120260401B">B01J20/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商京瓷ＡＶＸ元件公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOCERA AVX COMPONENTS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　小榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAORONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱歐立　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAOILE, BRYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁赫　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAICH, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝羅里尼　瑪麗安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEROLINI, MARIANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有一分子篩選材料之超級電容器。該超級電容器含有：一第一電極，其包含電耦合至一第一碳質塗層之一第一集電器；一第二電極，其包含電耦合至一第二碳質塗層之一第二集電器；一分離器，其定位於該第一電極與該第二電極之間；及一非水電解質，其與該第一電極及該第二電極離子接觸。該超級電容器包含具有一金屬鋁矽酸鹽及一黏合劑之一分子篩選材料。該超級電容器亦包含一外殼，該第一電極、該第二電極、該分離器、該非水電解質及該分子篩選材料保持在該外殼內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ultracapacitor with a molecular sieve material is provided. The ultracapacitor contains a first electrode that includes a first current collector electrically coupled to a first carbonaceous coating, a second electrode that includes a second current collector electrically coupled to a second carbonaceous coating, a separator positioned between the first electrode and the second electrode, and a nonaqueous electrolyte in ionic contact with the first electrode and the second electrode. The ultracapacitor includes a molecular sieve material including a metal aluminosilicate and a binder. The ultracapacitor also includes a housing within which the first electrode, the second electrode, the separator, the nonaqueous electrolyte, and the molecular sieve material are retained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2106:層</p>  
        <p type="p">2108:電極總成</p>  
        <p type="p">2110:第一接觸邊緣</p>  
        <p type="p">2114:第一集電器盤</p>  
        <p type="p">2116:第一終端柱</p>  
        <p type="p">2118:蓋</p>  
        <p type="p">2120:第二集電器盤</p>  
        <p type="p">2122:金屬容器/鋁罐/鋁罐外殼</p>  
        <p type="p">2124:第一絕緣墊圈</p>  
        <p type="p">2126:第二絕緣墊圈</p>  
        <p type="p">2128:平墊圈</p>  
        <p type="p">2130:彈簧墊圈</p>  
        <p type="p">2132:鎖定螺母</p>  
        <p type="p">2134:盤形部分</p>  
        <p type="p">2136:螺栓部分</p>  
        <p type="p">2138:緊固件</p>  
        <p type="p">2140:螺栓部分</p>  
        <p type="p">2142:盤形部分/集電器盤部分</p>  
        <p type="p">2144:第二終端柱</p>  
        <p type="p">2146:孔</p>  
        <p type="p">2148:襯套</p>  
        <p type="p">2150:凸緣</p>  
        <p type="p">2152:插塞</p>  
        <p type="p">2160:空心</p>  
        <p type="p">3000:分子篩選材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2544" publication-number="202626698"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626698.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含ＩＬ－２１變體的多肽複合物及其用途</chinese-title>  
        <english-title>POLYPEPTIDE COMPLEXES COMPRISING IL-21 VARIANTS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K14/54</main-classification>  
        <further-classification edition="200601120260401B">C12N15/62</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K38/20</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海藥明生物技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUXI BIOLOGICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁若冰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, RUOBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫蒙蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, MENGMENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐建清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧　繼杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, JIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開內容提供了IL-21變體、包含所述IL-21變體的IL-21多肽複合物，產生其的方法及其用途。本公開內容的IL-21變體和多肽複合物可用作治療癌症、感染性疾病和炎症性疾病的有效藥劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided in the present disclosure are IL-21 variants, IL-21 polypeptide complexes comprising the IL-21 variants, the methods of producing the same and the uses thereof. The IL-21 variants and polypeptide complexes of the disclosure can be used as a potent agent for the treatment of cancers, infectious diseases and inflammatory diseases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2545" publication-number="202627966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144516</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產生製程參數的方法</chinese-title>  
        <english-title>METHOD OF GENERATING PROCESS PARAMETERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251204B">G06Q50/04</main-classification>  
        <further-classification edition="200601120251204B">G06F7/06</further-classification>  
        <further-classification edition="200601120251204B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宣諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂寧遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYU, NING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒達仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, DA-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種產生製程參數的方法，包括以下步驟。建立製程參數及對應製程參數的上限與下限。利用實驗規劃法建立對應製程參數的多組試驗參數。根據製程設計及多組試驗參數，利用實驗模擬法或利用實驗找出對應多組試驗參數的多個優化目標。以多組試驗參數為訓練參數，利用優化演算法計算出一組優化製程參數及對應該組優化製程參數的優化目標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of generating process parameters includes the following steps. Establishing the process parameters and upper and lower limits corresponding to the process parameters. Using an experimental planning to establish a plurality of sets of experimental parameters corresponding to the process parameters. According to a process design and the plurality of sets of experimental parameters, using an experimental simulation or using an experiment to find out a plurality of optimization goals corresponding to the plurality of sets of experimental parameters. Using the plurality of sets of experimental parameters as training parameters, and using an optimization algorithm to calculate a set of optimized process parameters and an optimization goal corresponding to the set of optimized process parameters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S200,S300,S400,S500,S600:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2546" publication-number="202627205"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627205.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基板表面之濕式化學處理之裝置</chinese-title>  
        <english-title>DEVICE FOR WET CHEMICAL PROCESSING OF SUBSTRATE SURFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C23F1/02</main-classification>  
        <further-classification edition="200601120260318B">H05K3/46</further-classification>  
        <further-classification edition="200601120260318B">H05K3/06</further-classification>  
        <further-classification edition="200601120260318B">B05B13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商吉伯史密德公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEBR. SCHMID GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密德　克利司堤恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMID, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置(100)包括一製程腔室(101)，該製程腔室(101)用於用一製程液體(105)對定位於該製程腔室(101)中之一基板(103)進行濕式化學處理。此外，該裝置(100)包括至少一個雙流體噴霧噴嘴(104)，該至少一個雙流體噴霧噴嘴(104)藉由加壓氣體操作以用於將該製程液體(105)噴灑至定位於該製程腔室(101)中之該基板上。特定言之，該裝置(100)包括一壓縮機(108)，該壓縮機(108)經設計以自該製程腔室(101)吸入一製程氣氛(107)，對該製程氣氛(107)進行壓縮，且將該製程氣氛(107)作為加壓氣體返回至該至少一個雙流體噴霧噴嘴(104)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device (100) comprises a process chamber (101) for wet chemical processing of a substrate (103) located in the process chamber (101) with a process liquid (105). Further, the device (100) comprises at least one twin-fluid spray nozzle (104) operated by pressurized gas for spraying the process liquid (105) onto the substrate, which is located in the process chamber (101). In particular, the device (100) comprises a compressor (108) which is designed to draw in a process atmosphere (107) from the process chamber (101), compress it, and return it as pressurized gas to the at least one twin-fluid spray nozzle (104).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">101:製程腔室</p>  
        <p type="p">102:運輸系統</p>  
        <p type="p">103:基板</p>  
        <p type="p">104:雙流體噴霧噴嘴</p>  
        <p type="p">105:製程液體</p>  
        <p type="p">106:貯槽</p>  
        <p type="p">108:液環壓縮機</p>  
        <p type="p">109:電動馬達</p>  
        <p type="p">110:可調整排洩閥</p>  
        <p type="p">111:下游液滴分離器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2547" publication-number="202625953"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625953.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144534</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動機構及清潔系統</chinese-title>  
        <english-title>DRIVING MECHANISM AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A47L11/40</main-classification>  
        <further-classification edition="200601120260331B">A47L11/24</further-classification>  
        <further-classification edition="200601120260331B">A47L11/34</further-classification>  
        <further-classification edition="200601120260331B">A47L11/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟东延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAI, DONGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>刘瑞旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, RUIWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝旭昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, XUCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡彩雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CAIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種驅動機構及清潔系統，涉及清潔設備技術領域。驅動機構用於清潔設備中清潔元件與主機之間的拆裝，驅動機構包括殼體、驅動裝置以及可動構件，殼體用於安裝在清潔基站上；驅動裝置設置於殼體上；可動構件與驅動裝置相連接，驅動裝置動作時能帶動可動構件移動，以用於可動構件解鎖清潔元件和主機之間的鎖扣。本實施例提供的驅動機構，實現清潔元件與主機之間的自動拆卸，無需人工拆卸清潔元件，大大方便了用戶使用，提升用戶使用體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a driving mechanism and a cleaning system, relating to the technical field of cleaning equipment. The driving mechanism is used for assembling and disassembling between a cleaning element and a main unit in the cleaning equipment. The driving mechanism includes a housing, a driving device and a movable member. The housing is configured to be mounted on a cleaning base station; the driving device is disposed on the housing; the movable member is connected to the driving device, and the driving device is capable of driving the movement of the movable member when actuated, so that the movable member unlocks locking between the cleaning element and the main unit. The driving mechanism provided in this embodiment realizes automatic detachment between the cleaning element and the main unit, eliminating the need for manually disassembling the cleaning element, which greatly facilitates user operation and improves user experience.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:第一殼體</p>  
        <p type="p">1113:電機安裝槽</p>  
        <p type="p">1114:轉軸孔</p>  
        <p type="p">112:第二殼體</p>  
        <p type="p">121:驅動電機</p>  
        <p type="p">1221:蝸桿</p>  
        <p type="p">1222:蝸輪</p>  
        <p type="p">1223:第一齒輪</p>  
        <p type="p">1224:第二齒輪</p>  
        <p type="p">1225:第一轉軸</p>  
        <p type="p">1231:螺母部件</p>  
        <p type="p">1232:絲桿</p>  
        <p type="p">1233:連接部</p>  
        <p type="p">1234:導向桿</p>  
        <p type="p">13:可動構件</p>  
        <p type="p">14:檢測裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2548" publication-number="202628088"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628088.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括記憶體胞元陣列區及介面區之半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING MEMORY CELL ARRAY REGIONS AND INTERFACE REGION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G11C7/18</main-classification>  
        <further-classification edition="200601120260302B">G11C8/14</further-classification>  
        <further-classification edition="202301120260302B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴台鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, TAEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAESUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYEONKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晟洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, SUNGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置。該半導體裝置包含：第一記憶體胞元陣列區及第二記憶體胞元陣列區，該等記憶體胞元陣列區彼此間隔開；一第一介面區，其位於該第一記憶體胞元陣列區與該第二記憶體胞元陣列區之間；第一字線及第二字線，該等字線穿過該第一記憶體胞元陣列區、該第一介面區及該第二記憶體胞元陣列區；一第一背閘極電極，其在該第一記憶體胞元陣列區中位於該第一字線與該第二字線之間，且延伸入該第一介面區中；以及一第一背閘極介電層。該第一背閘極介電層包含在該第一記憶體胞元陣列區中位於該第一字線與該第一背閘極電極之間的一第一部分、及位於該第二字線與該第一背閘極電極之間的一第二部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device is provided. The semiconductor device comprises: first and second memory cell array regions spaced apart from each other; a first interface region between the first and second memory cell array regions; first and second word lines crossing the first memory cell array region, the first interface region, and the second memory cell array region; a first back gate electrode between the first and second word lines in the first memory cell array region, and extending into the first interface region; and a first back gate dielectric layer. The first back gate dielectric layer comprises a first portion between the first word line and the first back gate electrode in the first memory cell array region, and a second portion between the second word line and the first back gate electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">9:作用圖案</p>  
        <p type="p">9a:胞元作用圖案</p>  
        <p type="p">9a_1:第一胞元作用圖案</p>  
        <p type="p">9a_2:第二胞元作用圖案，第二作用圖案</p>  
        <p type="p">9a_3:第三胞元作用圖案</p>  
        <p type="p">9a_4:第四胞元作用圖案</p>  
        <p type="p">9b:虛設作用圖案</p>  
        <p type="p">9b_1:第一虛設作用圖案</p>  
        <p type="p">9b_2:第二虛設作用圖案</p>  
        <p type="p">15:背閘極介電層，背閘極結構</p>  
        <p type="p">15_1:第一背閘極介電層</p>  
        <p type="p">15a:第一部分</p>  
        <p type="p">15b:第二部分</p>  
        <p type="p">15c:第三部分</p>  
        <p type="p">15d:第四部分</p>  
        <p type="p">15e:第五部分</p>  
        <p type="p">24:胞元閘極介電層，閘極結構</p>  
        <p type="p">24_1:第一胞元閘極介電層</p>  
        <p type="p">24_2:第二胞元閘極介電層</p>  
        <p type="p">27:胞元閘極電極</p>  
        <p type="p">90:位元線，結構</p>  
        <p type="p">95a:後接觸插塞，第一後接觸插塞</p>  
        <p type="p">B:區域</p>  
        <p type="p">BG:背閘極電極</p>  
        <p type="p">BG_1:第一背閘極電極</p>  
        <p type="p">BG_1e:第一末端部分</p>  
        <p type="p">BG_2:第二背閘極電極</p>  
        <p type="p">BG_2e:第二末端部分</p>  
        <p type="p">BGC:背閘極接觸插塞</p>  
        <p type="p">BGC1:第一背閘極接觸插塞</p>  
        <p type="p">BGC2:第二背閘極接觸插塞</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BL_1:第一位元線</p>  
        <p type="p">BL_2:第二位元線</p>  
        <p type="p">I-I',II-II',III-III':線</p>  
        <p type="p">IF1:第一介面區，介面區</p>  
        <p type="p">IF2:第二介面區，介面區</p>  
        <p type="p">MCA:記憶體胞元陣列區</p>  
        <p type="p">MCA1:第一記憶體胞元陣列區，記憶體胞元陣列區，區</p>  
        <p type="p">MCA2:第二記憶體胞元陣列區</p>  
        <p type="p">MCA3:第三記憶體胞元陣列區</p>  
        <p type="p">WL:字線</p>  
        <p type="p">WL_1:第一字線</p>  
        <p type="p">WL_2:第二字線</p>  
        <p type="p">WL_3:第三字線</p>  
        <p type="p">WL_4:第四字線</p>  
        <p type="p">WLC:字線接觸插塞</p>  
        <p type="p">X:第一水平方向</p>  
        <p type="p">Y:第二水平方向</p>  
        <p type="p">Z:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2549" publication-number="202628795"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628795.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中介層用晶圓、中介層用晶圓的製造方法、中介層以及中介層的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P10/00</main-classification>  
        <further-classification edition="202601120260302B">H10P32/14</further-classification>  
        <further-classification edition="202601120260302B">H10P30/00</further-classification>  
        <further-classification edition="202601120260302B">H10P95/90</further-classification>  
        <further-classification edition="202601120260302B">H10P14/40</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門野武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADONO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗田一成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠減少重金屬所引起的污染的中介層用晶圓。本發明的中介層用晶圓包括：矽晶圓（本體矽晶圓）11；以及固溶區域13。固溶區域13形成於所述矽晶圓11的表層部，固溶區域13中固溶有助於吸雜的元素。在氫或氮的氣氛中，以800°C以上且1150°C以下的溫度實施1分鐘以上且5分鐘以下的熱處理的情況下，在固溶區域13中形成尺寸為1.0nm&lt;sup&gt;2&lt;/sup&gt;以上且10nm&lt;sup&gt;2&lt;/sup&gt;以下，而且密度為1.0×10&lt;sup&gt;15&lt;/sup&gt;/cm&lt;sup&gt;3&lt;/sup&gt;以上且1.0×10&lt;sup&gt;17&lt;/sup&gt;/cm&lt;sup&gt;3&lt;/sup&gt;以下的黑點狀缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:中介層用晶圓</p>  
        <p type="p">11:本體矽晶圓</p>  
        <p type="p">13:固溶區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2550" publication-number="202628422"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628422.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇性影像圖框修改的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS OF SELECTIVE IMAGE FRAME MODIFICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260321B">H04N19/46</main-classification>  
        <further-classification edition="201401120260321B">H04N19/70</further-classification>  
        <further-classification edition="201101120260321B">H04N21/83</further-classification>  
        <further-classification edition="202201120260321B">G06V40/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利斯克　史考特　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEASK, SCOTT BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔胡布　哈立德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAHBOUB, KHALID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUNMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發送方裝置包括經組態以儲存一視訊的一影像圖框的一記憶體。該裝置亦包括耦接至該記憶體且經組態以獲得表示該影像圖框的經編碼影像資料的一或多個處理器。該一或多個處理器亦經組態以將一位元串流發送至一接收方裝置，該位元串流包括作為該視訊通訊的部分的該經編碼影像資料，及指示影像修改在該接收方裝置處係發送方允許或發送方禁止的一修改指示符。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sender device includes a memory configured to store an image frame of a video. The device also includes one or more processors coupled to the memory and configured to obtain encoded image data representing the image frame. The one or more processors are also configured to send, to a recipient device, a bitstream including the encoded image data as part of the video communication and a modification indicator that indicates whether image modification is sender permitted or sender prohibited at the recipient device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:使用者</p>  
        <p type="p">102:裝置</p>  
        <p type="p">103:使用者輸入</p>  
        <p type="p">104:裝置</p>  
        <p type="p">105:使用者</p>  
        <p type="p">107:使用者輸入</p>  
        <p type="p">120:影像來源</p>  
        <p type="p">122:輸入影像圖框</p>  
        <p type="p">124:經編碼影像資料</p>  
        <p type="p">126:圖形使用者介面(GUI)</p>  
        <p type="p">132:記憶體</p>  
        <p type="p">134:來源允許特徵指示符</p>  
        <p type="p">140:修改管理器(MM)</p>  
        <p type="p">142:編碼器</p>  
        <p type="p">144:位元串流產生器</p>  
        <p type="p">145:位元串流</p>  
        <p type="p">146:臉部特徵點偵測器</p>  
        <p type="p">150:修改指示符</p>  
        <p type="p">152:特徵指示符</p>  
        <p type="p">154:臉部特徵點資料</p>  
        <p type="p">160:修改管理器</p>  
        <p type="p">162:解碼器</p>  
        <p type="p">170:顯示裝置</p>  
        <p type="p">172:經解碼影像圖框</p>  
        <p type="p">174:影像資料</p>  
        <p type="p">176:GUI</p>  
        <p type="p">180:顯示裝置</p>  
        <p type="p">182:記憶體</p>  
        <p type="p">184:接收方允許特徵指示符</p>  
        <p type="p">186:輸出影像圖框</p>  
        <p type="p">190:處理器</p>  
        <p type="p">192:處理器</p>  
        <p type="p">194:位元串流分析器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2551" publication-number="202629001"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629001.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝基板的製作方法</chinese-title>  
        <english-title>MANUFACTURE METHOD FOR A PACKAGING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10W70/01</main-classification>  
        <further-classification edition="202601120260330B">H10P50/20</further-classification>  
        <further-classification edition="202601120260330B">H10P14/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAE HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實例的封裝基板的製作方法包括如下步驟來製作封裝基板：準備步驟，準備包括芯層及配置於所述芯層的絕緣層的基底基板；以及電漿步驟，對所述絕緣層的上部面進行電漿處理。在電漿步驟中，適用惰性氣體作為製程氣體，作為以下式1的電漿製程條件指數的Ipp值為80秒鐘以上。作為完成所述電漿步驟的所述絕緣層的上部面的表面展開面積比的Sdr值為50%以下。式1：Ipp=Rsb*H，在所述式1中，所述Rsb為在所述電漿步驟中所適用的偏置功率與源功率之比，所述H為所述電漿步驟的實施時間。在這種情況下，可以在芯層中更加精緻地體現具有細間距的重布線層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment, a method for manufacturing a packaging substrate includes a preparation step of providing a base substrate including a core layer and an insulating layer disposed on the core layer, and a plasma step of plasma-treating an upper surface of the insulating layer to manufacture a packaging substrate. In the plasma step, an inert gas is applied as a process gas, and a plasma process condition index, Ipp, defined by Equation 1 below, is 80 seconds or more. The surface area ratio, Sdr, of the upper surface of the insulating layer after the plasma step is 50% or less. [Equation 1] Ipp = Rsb × H In Equation 1, Rsb represents a ratio of bias power to source power applied in the plasma step, and H represents a process time of the plasma step.In such a case, a redistribution layer having a fine pitch can be more precisely implemented on the core layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底基板</p>  
        <p type="p">10:芯層</p>  
        <p type="p">20:絕緣層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2552" publication-number="202626616"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626616.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144620</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濾色器用著色組成物、濾色器用著色硬化性組成物、濾色器、固體攝像元件及圖像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D251/54</main-classification>  
        <further-classification edition="200601120260401B">C07D401/12</further-classification>  
        <further-classification edition="200601120260401B">C09B57/00</further-classification>  
        <further-classification edition="200601120260401B">C09B67/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G02B5/20</further-classification>  
        <further-classification edition="200601120260401B">G09F9/30</further-classification>  
        <further-classification edition="202501120260401B">H10F39/00</further-classification>  
        <further-classification edition="202501120260401B">H10F39/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋翊絢股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYO VISUAL SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部悠太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中谷侑華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATANI, YUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明在於提供一種濾色器用著色組成物，由於顏料彼此不易發生凝聚，因此對比度比高，即便在溫度變動下長期保管而塗膜的膜缺陷也少，製成著色硬化性組成物時相對於自組成物的塗布至曝光為止的時間而言的圖案特性依存性良好。另外，本發明在於提供一種使用了所述濾色器用著色組成物的濾色器用著色硬化性組成物、濾色器、固體攝像元件、及圖像顯示裝置。所述課題藉由濾色器用著色組成物來解決，其包含顏料（A）、色素衍生物（B）、樹脂型分散劑（C）、以及有機溶劑（D），所述濾色器用著色組成物的特徵在於，色素衍生物（B）包含具有雜環的化合物（B1）、具有雜環的化合物（B2）、以及具有雜環的化合物（B3），化合物（B1）～化合物（B3）的質量比滿足式[1]～式[3]的範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2553" publication-number="202626429"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626429.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用之控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260129B">B62M6/45</main-classification>  
        <further-classification edition="201001120260129B">B62M6/50</further-classification>  
        <further-classification edition="201001120260129B">B62M9/122</further-classification>  
        <further-classification edition="201001120260129B">B62M9/132</further-classification>  
        <further-classification edition="200601120260129B">B62M25/08</further-classification>  
        <further-classification edition="200601120260129B">F16H61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝花聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHANA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島岳彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, TAKEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西嶋昭太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIJIMA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島津速人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMAZU, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可適切地控制變速裝置之人力驅動車用之控制裝置。 &lt;br/&gt;人力驅動車用之控制裝置包含控制部；且控制部構成為基於複數個變速條件之任一者以變更變速比之方式控制變速裝置；複數個變速條件包含第1變速條件、及與第1變速條件不同之第2變速條件；控制部構成為於基於第1變速條件以變速比變小之方式控制變速裝置之情形下，以變速比不小於較最小變速比大之第1變速比之方式控制變速裝置；最小變速比係變速裝置可變更之最小之變速比；控制部構成為於基於第2變速條件以變速比變小之方式控制變速裝置之情形下，以變速比不小於較第1變速比大之第2變速比之方式控制變速裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:人力驅動車</p>  
        <p type="p">42:變速裝置</p>  
        <p type="p">42A:驅動源</p>  
        <p type="p">44:檢測部</p>  
        <p type="p">44A:曲柄旋轉狀態檢測部</p>  
        <p type="p">44B:人力驅動力檢測部</p>  
        <p type="p">44C:車輪旋轉狀態檢測部</p>  
        <p type="p">44D:傾斜檢測部</p>  
        <p type="p">60:控制裝置</p>  
        <p type="p">62:控制部</p>  
        <p type="p">64:記憶部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2554" publication-number="202626643"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626643.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎磺醯胺衍生物</chinese-title>  
        <english-title>NOVEL SULFONAMIDE DERIVATIVES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D471/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/16</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查普曼　馬克　洛夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAPMAN, MARK LOVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道　羅伯特　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOW, ROBERT LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉赫　亞倫　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERLACH, AARON CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈德　伊娃　卡特琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARDE, EVA KATRIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨德里克　艾倫　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDRICK, ALAN GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷納　瑪瑞亞斯　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOENER, MARIUS CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒布雷頓　西爾萬　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEBRETON, SYLVAIN MICHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅欽　英格麗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MECHIN, INGRID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈爾　阿尼爾　錢德拉　塞卡蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIR, ANIL CHANDRA SEKHARAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾克羅斯　羅傑　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORCROSS, ROGER DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波泰特　法蘭克　真　克洛德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTET, FRANCK JEAN CLAUDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯姆爾西娜　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMRCINA, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏達亞爾　維諾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UDAYAR, VINOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種式 (I) 化合物， &lt;br/&gt;&lt;img align="absmiddle" height="161px" width="234px" file="ed10264.JPG" alt="ed10264.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中 A&lt;sup&gt;1&lt;/sup&gt; 及 A&lt;sup&gt;2&lt;/sup&gt; 及 R&lt;sup&gt;1&lt;/sup&gt; 至 R&lt;sup&gt;7&lt;/sup&gt; 係如說明書中及申請專利範圍中所定義。該式 (I) 化合物可用為藥物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a compound of formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="168px" width="249px" file="ed10265.JPG" alt="ed10265.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;  &lt;br/&gt;wherein A&lt;sup&gt;1&lt;/sup&gt; and A&lt;sup&gt;2&lt;/sup&gt; and R&lt;sup&gt;1&lt;/sup&gt; to R&lt;sup&gt;7&lt;/sup&gt; are defined as in the description and in the claims. The compound of formula (I) can be used as a medicament.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2555" publication-number="202627028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拋光漿料及製造半導體裝置之方法</chinese-title>  
        <english-title>POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K3/14</main-classification>  
        <further-classification edition="200601120260401B">C09G1/02</further-classification>  
        <further-classification edition="202601120260401B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡利霖納　費多西亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALININA, FEDOSYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池尙洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEE, SANG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高允錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YOONSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昡在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNE JEA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林主亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JUHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">拋光漿料包括：一研磨劑；一氧化劑；以及一第一組胺酸衍生物，其包括一經取代或未經取代之環狀醯亞胺基；任擇的一第二組胺酸衍生物，其包括一經取代或未經取代之醯胺酸基；或其組合。描述一種使用該拋光漿料製造一半導體裝置之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">polishing slurry including an abrasive, an oxidizing agent, and a first histidine derivative including a substituted or unsubstituted cyclic imide group, optionally a second histidine derivative including a substituted or unsubstituted amic acid group, or a combination thereof. A method of manufacturing a semiconductor device using the same is described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2556" publication-number="202628342"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628342.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>推測裝置、推測程式、推測方法、馬達軸承磨耗監測裝置及罐裝馬達泵</chinese-title>  
        <english-title>ESTIMATION DEVICE, ESTIMATION PROGRAM, ESTIMATION METHOD, MOTOR BEARING WEAR MONITORING DEVICE, AND CANNED MOTOR PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251203B">H02P29/024</main-classification>  
        <further-classification edition="200601120251203B">H02K5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日機裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKKISO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中𤥨也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明減少調整檢測線圈之檢測值與軸承之磨耗量的對應關係的工時。 &lt;br/&gt;本發明之推測裝置53、6推測馬達軸承磨耗監測裝置5的調整值，該馬達軸承磨耗監測裝置5係根據多個檢測線圈C1～C8各自的檢測訊號，監測支撐旋轉軸31之軸承32、33的磨耗狀態。推測裝置具有：儲存部54、64，其儲存習得之推力學習模型M11、M21，該習得之推力學習模型M11、M21係以在輸入包含馬達3的額定電流值、可移動範圍的長度、檢測線圈的匝數及推力方向上的轉子36相對於定子37的位置的推力輸入資料時輸出推力調整值的方式進行機械學習而得；取得部530、630，其取得推力輸入資料；及推測部531、631，其將藉由取得部所取得之推力輸入資料輸入至推力學習模型，而推測推力調整值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To reduce the man-hours required for adjusting the correlation between the detection value of a detection coil and the wear amount of a bearing. &lt;br/&gt; An estimation device (53; 6) according to the present invention estimates an adjustment value of a motor bearing wear monitoring device (5) that monitors wear states of bearings 32 and 33 supporting a rotary shaft 31, based on a detection signal from each of a plurality of detection coils C1 to C8. The estimation device includes a storage (54; 64) that stores a trained thrust learning model (M11, M21) that is trained by machine learning to output a thrust adjustment value when thrust input data is input, the thrust input data including the rated current value of a motor (3), the length of a movable range, the number of turns of the detection coil, and the position of the rotor (36) relative to the stator (37) in the thrust direction, an acquisition unit (530; 630) that acquires the thrust input data, and an estimation unit (531; 631) that inputs the thrust input data acquired by the acquisition unit into the thrust learning model and estimates the thrust adjustment value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:馬達軸承磨耗監測裝置</p>  
        <p type="p">50:連接部</p>  
        <p type="p">51a,51b,51c,51d:訊號處理電路</p>  
        <p type="p">52:A/D轉換器</p>  
        <p type="p">53:控制部(推測裝置)</p>  
        <p type="p">530:第1取得部(取得部)</p>  
        <p type="p">531:推測部</p>  
        <p type="p">532:設定部</p>  
        <p type="p">533:第2取得部</p>  
        <p type="p">534:磨耗量檢測部</p>  
        <p type="p">53a:CPU</p>  
        <p type="p">53b:RAM</p>  
        <p type="p">53c:ROM</p>  
        <p type="p">54:儲存部</p>  
        <p type="p">55:顯示部</p>  
        <p type="p">56:偏移處理部</p>  
        <p type="p">C1,C3:檢測線圈(徑向檢測線圈、第1徑向檢測線圈)</p>  
        <p type="p">C5,C7:檢測線圈(徑向檢測線圈、第2徑向檢測線圈)</p>  
        <p type="p">C2,C4:檢測線圈(推力檢測線圈、第1推力檢測線圈)</p>  
        <p type="p">C6,C8:檢測線圈(推力檢測線圈、第2推力檢測線圈)</p>  
        <p type="p">M11:推力學習模型</p>  
        <p type="p">M12:徑向學習模型</p>  
        <p type="p">Lc1,Lc2:共通路徑</p>  
        <p type="p">S13,S57,S24,S68:合成訊號</p>  
        <p type="p">Sd:差量訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2557" publication-number="202627438"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627438.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144748</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>狀態監測裝置、泵、狀態監測程式、狀態監測方法及頻帶設定方法</chinese-title>  
        <english-title>STATE MONITORING DEVICE, PUMP, STATE MONITORING PROGRAM, STATE MONITORING METHOD, AND FREQUENCY BAND SETTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251203B">G01M99/00</main-classification>  
        <further-classification edition="200601120251203B">G01H7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日機裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKKISO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中琢也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係監測以轉子之位置的周期性位移呈現的泵之監測對象的狀態。 &lt;br/&gt;本發明之狀態監測裝置4係根據從檢測與泵1之馬達3的轉子33相對於定子34之位置的位移對應的磁通變化之多個檢測線圈C1～C4輸出的檢測訊號，監測泵之監測對象的狀態。狀態監測裝置4具有：取得部420，其經時性地取得第1合成訊號及第2合成訊號中的至少一者；頻譜生成部421，其對由取得部所取得之訊號執行FFT處理，而生成監測頻譜；儲存部43，其儲存對監測對象預先設定之監測頻帶及成為監測頻譜之比較對象的基準頻譜；及判定部425，其根據監測頻帶中的最新的監測頻譜與基準頻譜的比較，判定與監測頻帶對應的監測對象的狀態為正常或異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A state of a component to be monitored of a pump appearing as a periodic displacement of the rotor position is monitored. &lt;br/&gt;A state monitoring device 4 according to the present invention monitors a state of a component to be monitored of a pump 1, based on detection signals output from a plurality of detection coils C1 to C4 that detect magnetic flux changes corresponding to the displacement of a rotor 33 relative to a stator 34 of a motor 3 of the pump 1. The state monitoring device 4 includes an acquisition unit 420 that acquires at least one of a first combined signal and a second combined signal over time, a spectrum generation unit 421 that performs FFT processing on the signals acquired by the acquisition unit and generates a monitoring spectrum, a storage 43 that stores a monitoring frequency band that is preset for the component to be monitored and a reference spectrum that serves as a comparison for the monitoring spectrum, and a determination unit 425 that determines whether the state of the component to be monitored corresponding to the monitoring frequency band is normal or abnormal based on the comparison between the latest monitoring spectrum and the reference spectrum in the monitoring frequency band.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:狀態監測裝置</p>  
        <p type="p">40:連接部</p>  
        <p type="p">41a:訊號處理部</p>  
        <p type="p">41b:訊號處理部</p>  
        <p type="p">42:控制部</p>  
        <p type="p">420:取得部</p>  
        <p type="p">421:頻譜生成部</p>  
        <p type="p">422:第1計算部(理論監測頻帶計算部)</p>  
        <p type="p">423:第2計算部(修正值計算部)</p>  
        <p type="p">424:修正部</p>  
        <p type="p">425:判定部</p>  
        <p type="p">426:顯示控制部</p>  
        <p type="p">42a:CPU</p>  
        <p type="p">42b:RAM</p>  
        <p type="p">42c:ROM</p>  
        <p type="p">43:儲存部</p>  
        <p type="p">44:顯示部</p>  
        <p type="p">C1:檢測線圈(第1檢測線圈)</p>  
        <p type="p">C2:檢測線圈(第1檢測線圈)</p>  
        <p type="p">C3:檢測線圈(第2檢測線圈)</p>  
        <p type="p">C4:檢測線圈(第2檢測線圈)</p>  
        <p type="p">L11,L12:訊號路徑</p>  
        <p type="p">Lc1,Lc2:共通路徑</p>  
        <p type="p">S12,S34:合成訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2558" publication-number="202625949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於吸塵器的過濾器</chinese-title>  
        <english-title>FILTER FOR CLEANER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A47L9/10</main-classification>  
        <further-classification edition="200601120260223B">A47L9/12</further-classification>  
        <further-classification edition="200601120260223B">A47L9/16</further-classification>  
        <further-classification edition="200601120260223B">A47L9/20</further-classification>  
        <further-classification edition="200601120260223B">A47L5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JUNHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金翰信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HANSHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金詩容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓在勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JAEHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃仁揆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, INKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於吸塵器的過濾器，其中，當吸塵器站的集塵馬達運作時，渦輪單元透過集塵馬達的吸力來轉動，且與過濾器接觸的刷子連同渦輪單元的轉動相對於過濾器轉動，從而從過濾器移除異物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a filter for a cleaner, in which, when a dust collection motor of a cleaner station is operated, a turbine unit is rotated by a suction force of the dust collection motor, and a brush in contact with a filter rotates relative to the filter in conjunction with the rotation of the turbine unit, thereby removing foreign substances from the filter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:過濾器單元</p>  
        <p type="p">212a:上環形支架</p>  
        <p type="p">212b:下環形支架</p>  
        <p type="p">213:垂直支架</p>  
        <p type="p">221a:閥門部</p>  
        <p type="p">221b:旋轉部</p>  
        <p type="p">222:葉片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2559" publication-number="202625946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625946.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸塵器及吸塵器系統</chinese-title>  
        <english-title>CLEANER AND CLEANER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">A47L5/00</main-classification>  
        <further-classification edition="200601120260223B">A47L5/06</further-classification>  
        <further-classification edition="200601120260223B">A47L5/16</further-classification>  
        <further-classification edition="200601120260223B">A47L9/10</further-classification>  
        <further-classification edition="200601120260223B">A47L9/12</further-classification>  
        <further-classification edition="200601120260223B">A47L9/16</further-classification>  
        <further-classification edition="200601120260223B">A47L9/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JUNHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金翰信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HANSHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金詩容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓在勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JAEHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃仁揆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, INKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於吸塵器的過濾器，其中，當吸塵器站的集塵馬達運作時，渦輪單元透過集塵馬達的吸力來轉動，且與過濾器接觸的刷子連同渦輪單元的轉動相對於過濾器轉動，從而從過濾器移除異物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a filter for a cleaner, in which, when a dust collection motor of a clean station is operated, a turbine unit is rotated by a suction force of the dust collection motor, and a brush in contact with a filter rotates relative to the filter in conjunction with the rotation of the turbine, thereby removing foreign substances from the filter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:吸塵器</p>  
        <p type="p">2:吸塵器站</p>  
        <p type="p">11:延伸管</p>  
        <p type="p">12:清掃模組</p>  
        <p type="p">24:集塵箱蓋控制單元</p>  
        <p type="p">26:抽吸端口阻擋單元</p>  
        <p type="p">27:集塵單元</p>  
        <p type="p">28:氣流路徑單元</p>  
        <p type="p">29:集塵馬達</p>  
        <p type="p">130:灰塵分離器</p>  
        <p type="p">110:主體外殼</p>  
        <p type="p">111:過濾器蓋</p>  
        <p type="p">140:抽吸馬達</p>  
        <p type="p">180:集塵箱</p>  
        <p type="p">200:過濾器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2560" publication-number="202626487"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626487.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成系統及生成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260320B">C01B3/046</main-classification>  
        <further-classification edition="200601120260320B">B01D53/62</further-classification>  
        <further-classification edition="200601120260320B">B01J23/755</further-classification>  
        <further-classification edition="200601120260320B">B01J21/06</further-classification>  
        <further-classification edition="200601120260320B">F17C1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科納維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADEVIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙野裕之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKANO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提高烴氣體的生成效率的技術。生成系統包括：生成部，基於氫氣及氧化碳氣體，藉由觸媒反應生成烴氣體，將包含氫氣、氧化碳氣體及烴氣體的送出氣體送出；第一供給部，將包含氫氣及氧化碳氣體的第一原料氣體供給至生成部；第一獲取部，獲取第一原料氣體所包含的氫氣的量及氧化碳氣體的量；第二供給部，自送出氣體分離氫氣及氧化碳氣體，將包含經分離的氫氣及氧化碳氣體的第二原料氣體供給至生成部；第二獲取部，獲取第二原料氣體所包含的氫氣的量及氧化碳氣體的量；及控制部，基於第二原料氣體所包含的氫氣的量及氧化碳氣體的量，對第一原料氣體所包含的氫氣的量及氧化碳氣體的量進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:生成系統</p>  
        <p type="p">11:生成部</p>  
        <p type="p">12:第一供給部</p>  
        <p type="p">13:第一獲取部</p>  
        <p type="p">14:第二供給部</p>  
        <p type="p">15:第二獲取部</p>  
        <p type="p">16:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2561" publication-number="202628270"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628270.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器</chinese-title>  
        <english-title>CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01R13/629</main-classification>  
        <further-classification edition="201101120251201B">H01R12/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾威勒電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏毓宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, YU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐煜揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器包含端子體、第一殼體以及拉帶。端子體包含本體以及設置於本體上之閂扣。閂扣包含彈性臂、位於彈性臂之一端之按壓部以及位於彈性臂之另一端之卡鈎。按壓部具有抵靠斜面。第一殼體具有容置端子體之第一容置空間。拉帶穿過第一容置空間。拉帶包含致動部以及位於致動部之限位開口。致動部具有致動斜面，致動斜面位於限位開口之一內表面。在拉帶遠離端子體移動時，致動斜面抵靠抵靠斜面，致使閂扣相對於本體相對擺動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector includes a terminal body, a first housing, and a pull tab. The terminal body includes a main body and a latch disposed on the main body. The latch includes an elastic arm, a pressing portion located at an end of the elastic arm, and a hook located at the other end of the elastic arm. The pressing portion has an abutting inclined surface. The first housing has a first accommodating space accommodating the terminal body. The pull tab passes through the first accommodating space. The pull tab includes an actuating portion and a limiting opening located on the actuating portion. The actuating portion has an actuating inclined surface located on an inner surface of the limiting opening. When the pull tab moves away from the terminal body, the actuating inclined surface abuts against the abutting inclined surface, such that the latch seesaws relative to the main body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接器</p>  
        <p type="p">110:端子體</p>  
        <p type="p">111:本體</p>  
        <p type="p">113:耦合部</p>  
        <p type="p">114:閂扣</p>  
        <p type="p">115:彈性臂</p>  
        <p type="p">116:按壓部</p>  
        <p type="p">116ic:抵靠斜面</p>  
        <p type="p">117:卡鈎</p>  
        <p type="p">120:第一殼體</p>  
        <p type="p">121:第一底板</p>  
        <p type="p">123:第一頂板</p>  
        <p type="p">123ic:導引斜面</p>  
        <p type="p">130:第二殼體</p>  
        <p type="p">133:第二頂板</p>  
        <p type="p">134:第二背板</p>  
        <p type="p">140:拉帶</p>  
        <p type="p">142:握持部</p>  
        <p type="p">144:連接部</p>  
        <p type="p">146:致動部</p>  
        <p type="p">146ic:致動斜面</p>  
        <p type="p">147:限位開口</p>  
        <p type="p">AS1:第一容置空間</p>  
        <p type="p">AS2:第二容置空間</p>  
        <p type="p">CEO:出線口</p>  
        <p type="p">PD:拉動方向</p>  
        <p type="p">RD:按壓方向</p>  
        <p type="p">S1:第一狀態</p>  
        <p type="p">S2:第二狀態</p>  
        <p type="p">T4,T5:厚度</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2562" publication-number="202628117"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628117.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平行記憶體修復記憶體修復控制器</chinese-title>  
        <english-title>PARALLEL MEMORY REPAIR MEMORY REPAIR CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G11C29/44</main-classification>  
        <further-classification edition="200601120260401B">G11C29/52</further-classification>  
        <further-classification edition="200601120260401B">G06F11/07</further-classification>  
        <further-classification edition="201601120260401B">G06F12/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉斯拉姆普里亞　瑪雅克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARASRAMPURIA, MAYANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉歐　卡堤克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAO, KARTIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示技術包括一種其中一修復控制器及記憶體區塊或子系統使用一平行資料傳送協定進行通信的技術及架構。舉例而言，一修復控制器包括一記憶體修復控制器，該記憶體修復控制器耦合至一個一次性程式化(OTP)控制器或熔絲盒且耦合至個別記憶體區塊中之各別接收單元/模組。修復控制器包括一傳輸單元/模組且用作一BISR控制器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed technology includes a technique and architecture in which a repair controller and memory blocks or subsystems communicate using a parallel data transfer protocol. For instance, a repair controller includes a memory repair controller that is coupled to a one time programming (OTP) controller or fuse box and to the respective receive units/modules in individual memory blocks. The repair controller includes a transmit unit/module and functions as a BISR controller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:高階處理流程/程序流程</p>  
        <p type="p">620:方塊</p>  
        <p type="p">630:方塊</p>  
        <p type="p">640:方塊</p>  
        <p type="p">650:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2563" publication-number="202626299"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626299.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144873</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模擬裝置及模擬系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260121B">B25J9/16</main-classification>  
        <further-classification edition="200601120260121B">G05B19/4069</further-classification>  
        <further-classification edition="200601120260121B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇屋義也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKIYA, YOSHINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">專用模擬裝置在一個實施形態中，具備：第1通訊部，進行與通用模擬裝置的通訊；及第1取得部，從通用模擬裝置取得用以識別機器人的識別資訊及用以控制機器人的第1資訊。專用模擬裝置具備：輸入資料生成部，根據識別資訊來對第1資訊添加追加資訊並生成第2資訊；及模擬執行部，根據第2資訊來執行模擬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">8:第1模擬系統</p>  
        <p type="p">10:專用模擬裝置</p>  
        <p type="p">11:第1記憶部</p>  
        <p type="p">12:第1取得部</p>  
        <p type="p">13:第1處理部</p>  
        <p type="p">14:第1通訊部</p>  
        <p type="p">15:第1輸入部</p>  
        <p type="p">16:第1顯示部</p>  
        <p type="p">17:軟PLC裝置(下位側)</p>  
        <p type="p">18:追加資訊</p>  
        <p type="p">20:通用模擬裝置</p>  
        <p type="p">21:第2記憶部</p>  
        <p type="p">22:第2取得部</p>  
        <p type="p">23:第2處理部</p>  
        <p type="p">24:第2通訊部</p>  
        <p type="p">25:第2輸入部</p>  
        <p type="p">26:第2顯示部</p>  
        <p type="p">27:軟PLC裝置(上位側)</p>  
        <p type="p">31:輸入資料生成部</p>  
        <p type="p">32:模擬執行部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2564" publication-number="202626303"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626303.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144874</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制裝置、機器人系統及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">B25J9/22</main-classification>  
        <further-classification edition="200601120260128B">B25J13/08</further-classification>  
        <further-classification edition="200601120260128B">B23P19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅萬峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, WANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種控制裝置，是控制機器人的控制裝置，具備：力控制部，根據與作用於機器人之力及力矩有關的資訊來執行力控制；負載判定部，根據前述資訊，來判別機器人的軸的負載的狀態；及動作模式切換部，根據藉由負載判定部所得之判別的結果，來切換力控制之動作模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機器人</p>  
        <p type="p">20:機器人控制裝置、控制裝置</p>  
        <p type="p">21:處理器</p>  
        <p type="p">22:記憶部</p>  
        <p type="p">30:教示操作盤</p>  
        <p type="p">31:顯示部</p>  
        <p type="p">60:螺絲鎖緊機</p>  
        <p type="p">70:力感測器、力檢測器</p>  
        <p type="p">100:機器人系統</p>  
        <p type="p">111:馬達</p>  
        <p type="p">121:動作控制部</p>  
        <p type="p">122:力控制部</p>  
        <p type="p">123:力資料處理部</p>  
        <p type="p">124:負載判定部</p>  
        <p type="p">125:參數調整部</p>  
        <p type="p">126:位置姿勢調整部</p>  
        <p type="p">127:動作模式切換部</p>  
        <p type="p">128:設定部</p>  
        <p type="p">129:探索部</p>  
        <p type="p">161:控制部</p>  
        <p type="p">162:馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2565" publication-number="202627798"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627798.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>試驗裝置、試驗方法及非揮發電腦可讀取媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260102B">G06F9/30</main-classification>  
        <further-classification edition="200601120260102B">G06F17/10</further-classification>  
        <further-classification edition="201801120260102B">G06F9/44</further-classification>  
        <further-classification edition="200601120260102B">H03M13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛德萬測試股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANTEST CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金卷俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAMAKI, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種試驗裝置，具備：接收部，其對接收訊號列加以接收，該接收訊號列包含被試驗元件所輸出的T值(其中T為2以上的整數)的偽隨機訊號列；解碼部，其將接收訊號列內的T值的偽隨機訊號列解碼成C值(其中C為2以上且與T不同的整數)的解碼訊號列；及檢測部，其響應於解碼訊號列中的預先決定的訊號值的比例在基準範圍外的情形，檢測出產生接收訊號列內的T值的偽隨機訊號列之偽隨機訊號產生器處於禁止狀態的情形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:DUT</p>  
        <p type="p">20:發送部</p>  
        <p type="p">30:偽隨機訊號產生器</p>  
        <p type="p">35:編碼部</p>  
        <p type="p">100:試驗裝置</p>  
        <p type="p">110:接收部</p>  
        <p type="p">115:解碼部</p>  
        <p type="p">120:設定部</p>  
        <p type="p">130:期望值產生部</p>  
        <p type="p">140:比較部</p>  
        <p type="p">150:檢測部</p>  
        <p type="p">160:結果判定部</p>  
        <p type="p">170:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2566" publication-number="202626919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗靜電性樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08K5/098</main-classification>  
        <further-classification edition="200601120260401B">C08L53/00</further-classification>  
        <further-classification edition="200601120260401B">C08L101/00</further-classification>  
        <further-classification edition="200601120260401B">C08J5/18</further-classification>  
        <further-classification edition="200601120260401B">C09K3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東邦化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHO CHEMICAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內海哲洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTSUMI, TETSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMORI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種對樹脂賦予優異之抗靜電性以及成形性之抗靜電性樹脂組成物。 &lt;br/&gt;本發明之抗靜電性樹脂組成物係相對於熱塑性樹脂(A)，含有下述成分(B)及成分(C)： &lt;br/&gt;成分(B)：可藉由使(a)單末端經改質之聚烯烴與(b)聚醚或其改質物反應而獲得之具有特定結構之嵌段共聚物、 &lt;br/&gt;成分(C)：脂肪酸金屬鹽，且 &lt;br/&gt;成分(B)與成分(C)之質量比為(B)/(C)＝99.95/0.05~90/10。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2567" publication-number="202628341"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628341.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減少電源再生時的切換損失之馬達驅動裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02P27/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大井陽一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOI, YOUICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水上真一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUKAMI, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">馬達驅動裝置具備：轉換器，選擇性地執行整流動作及再生動作，前述整流動作將從交流電源所輸入的交流電力轉換成直流電力並往DC鏈路輸出，前述再生動作在DC鏈路電壓超過再生開始電壓的情況下，將DC鏈路的直流電力轉換成交流電力並往交流電源送回；逆變器，因應馬達驅動指令，選擇性地執行動力運行動作及再生動作，前述動力運行動作將DC鏈路的直流電力轉換成交流驅動電力並往馬達供給，前述再生動作將來自馬達的交流再生電力轉換成直流電力並往DC鏈路送回；及轉換器控制部，控制轉換器的動作，轉換器控制部因應與馬達驅動指令相關聯的資訊，來變更再生開始電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:馬達驅動裝置</p>  
        <p type="p">2:交流電源</p>  
        <p type="p">3:馬達</p>  
        <p type="p">11:轉換器</p>  
        <p type="p">12:逆變器</p>  
        <p type="p">13:轉換器控制部</p>  
        <p type="p">14:逆變器控制部</p>  
        <p type="p">15:電容器</p>  
        <p type="p">16R,16S,16T:交流電抗器</p>  
        <p type="p">17:DC鏈路</p>  
        <p type="p">21:輸入電流檢測部</p>  
        <p type="p">22:DC鏈路電流檢測部</p>  
        <p type="p">23:DC鏈路電壓檢測部</p>  
        <p type="p">24:逆變器電流檢測部</p>  
        <p type="p">25:速度檢測部</p>  
        <p type="p">26:編碼器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2568" publication-number="202625916"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625916.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風味吸入器和風味吸入系統</chinese-title>  
        <english-title>FLAVOR INHALER AND FLAVOR INHALATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260202B">A24F40/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本香煙產業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN TOBACCO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田竜二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMADA, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三上勇人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKAMI, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中代貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKADAI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種風味吸入器。該風味吸入器包括：可更換電池，該可更換電池具有兩端和將該等端連接在一起的側面，該電池具有第一電連接部分，該第一電連接部分電連接到該電池的正電極和負電極；以及組件，從該電池向該組件供應電力，該組件具有與該第一電連接部分電連接的第二電連接部分，其中，該第一電連接部分和該第二電連接部分在該電池的側面上彼此連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flavor inhaler is provided. The flavor inhaler comprises a replaceable battery which has two ends and a side face connecting the ends together, the battery having a first electrical connecting portion that is electrically connected to a positive electrode and a negative electrode of the battery, and an assembly to which power is supplied from the battery, the assembly having a second electrical connecting portion that is electrically connected to the first electrical connecting portion, wherein the first electrical connecting portion and the second electrical connecting portion are connected to each other on the side face of the battery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:電池</p>  
        <p type="p">90:端子</p>  
        <p type="p">211:電池組</p>  
        <p type="p">212:FPC</p>  
        <p type="p">213:電連接器</p>  
        <p type="p">215:膠帶</p>  
        <p type="p">340:FPC</p>  
        <p type="p">350:電連接器</p>  
        <p type="p">410:外殼</p>  
        <p type="p">412:第二開口部分</p>  
        <p type="p">418:第二容納部分</p>  
        <p type="p">419:突片</p>  
        <p type="p">510:內面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2569" publication-number="202625917"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625917.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144950</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風味吸入器和風味吸入系統</chinese-title>  
        <english-title>FLAVOR INHALER AND FLAVOR INHALATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251127B">A24F40/95</main-classification>  
        <further-classification edition="202001120251127B">A24F40/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本香煙產業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN TOBACCO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田竜二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMADA, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三上勇人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKAMI, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中代貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKADAI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種風味吸入器。該風味吸入器包括：可更換電池；電池容納部分，該電池容納部分具有開口並且通過該開口容納該電池；可移除電池蓋，該可移除電池蓋覆蓋該開口；以及可移除外面板，該可移除外面板覆蓋該電池蓋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flavor inhaler is provided. The flavor inhaler comprises a replaceable battery, a battery accommodating portion that has an opening and that accommodates the battery through the opening, a removable battery cover that covers the opening, and a removable outer panel that covers the battery cover.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:電池</p>  
        <p type="p">81:板</p>  
        <p type="p">90:端子</p>  
        <p type="p">91:第一連接部分</p>  
        <p type="p">200:風味吸入器</p>  
        <p type="p">204:上部構件</p>  
        <p type="p">208:封蓋</p>  
        <p type="p">300:風味產生組件</p>  
        <p type="p">310:底架</p>  
        <p type="p">380:觸覺開關</p>  
        <p type="p">390:顯示部分</p>  
        <p type="p">410:外殼</p>  
        <p type="p">411:第一開口部分</p>  
        <p type="p">412:第二開口部分</p>  
        <p type="p">414:第一端</p>  
        <p type="p">415:側面</p>  
        <p type="p">416:第二端</p>  
        <p type="p">417:第一容納部分</p>  
        <p type="p">418:第二容納部分</p>  
        <p type="p">500:面板部分</p>  
        <p type="p">510:內面板</p>  
        <p type="p">512:通孔</p>  
        <p type="p">515:通孔</p>  
        <p type="p">520:外面板</p>  
        <p type="p">522:窗口部分</p>  
        <p type="p">524:突起</p>  
        <p type="p">526:第二連接部分</p>  
        <p type="p">530:電池面板</p>  
        <p type="p">531:保護構件</p>  
        <p type="p">514A:第二連接部分</p>  
        <p type="p">514B:第二連接部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2570" publication-number="202626135"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626135.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合微結構貼片製造設備及微結構貼片的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">A61M37/00</main-classification>  
        <further-classification edition="202401120260127B">A61F13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>怡定興生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WCC BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉大佼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TA-JO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾清晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHING-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫耀其</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YAO-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉晉嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連玟絮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, WEN-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　星望</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAWBY, EDISON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉修鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, HSIU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張炤謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHAO-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅奇芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHI-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合微結構貼片製造設備，用以將一傳輸成分塗佈於一微結構貼片。該微結構貼片具有一貼片層，及一設置於該貼片層的微結構層。該整合式微結構貼片製造設備包含一箱體單元、一承載單元、一塗佈裝置，及一加工裝置。該箱體單元界定出一容置空間。該承載單元包括一設置於該容置空間的載台。該載台具有一用以承載該微結構貼片的承載部。該塗佈裝置設置於該容置空間並用以執行一塗佈程序，將該傳輸成分塗佈至該微結構層。該加工裝置設置於該容置空間並用以執行一第一加工程序，對該微結構貼片進行加工。故該整合式微結構貼片製造設備具有低空間需求的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">121:入料區</p>  
        <p type="p">122:第一加工區</p>  
        <p type="p">123:塗佈區</p>  
        <p type="p">124:第二加工區</p>  
        <p type="p">2:承載單元</p>  
        <p type="p">21:載台</p>  
        <p type="p">211:承載部</p>  
        <p type="p">22:移動結構</p>  
        <p type="p">222:馬達</p>  
        <p type="p">223:傳動帶</p>  
        <p type="p">3:塗佈裝置</p>  
        <p type="p">31:座體</p>  
        <p type="p">33:水平滑台結構</p>  
        <p type="p">35:抓取件</p>  
        <p type="p">36:升降滑台結構</p>  
        <p type="p">37:框架</p>  
        <p type="p">38:固持座</p>  
        <p type="p">39:馬達</p>  
        <p type="p">4:儲液容器</p>  
        <p type="p">40:回收容器</p>  
        <p type="p">6:加工裝置</p>  
        <p type="p">61:殺菌單元</p>  
        <p type="p">611:紫外光板</p>  
        <p type="p">62:乾燥單元</p>  
        <p type="p">621:噴頭</p>  
        <p type="p">7:包裝裝置</p>  
        <p type="p">71:水平滑台結構</p>  
        <p type="p">72:致動件</p>  
        <p type="p">73:吸附件</p>  
        <p type="p">731:真空吸嘴</p>  
        <p type="p">9:貼片單元</p>  
        <p type="p">9A:第一貼片單元</p>  
        <p type="p">9B:第二貼片單元</p>  
        <p type="p">9C:第三貼片單元</p>  
        <p type="p">91:微結構貼片</p>  
        <p type="p">911:貼片層</p>  
        <p type="p">912:微結構層</p>  
        <p type="p">92:托盤</p>  
        <p type="p">93:貼片組</p>  
        <p type="p">931:鋁膜</p>  
        <p type="p">10:包裝件</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">Y:前後方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2571" publication-number="202626695"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626695.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訊號肽及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K7/08</main-classification>  
        <further-classification edition="200601120260401B">C07K16/00</further-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海藥明生物技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUXI BIOLOGICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李全學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QUANXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉錦頻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JINPIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雅蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YARONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈暘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瞳昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TONGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳曉悅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIAOYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供包含SEQ ID NO: 1-96的胺基酸序列的訊號肽、包含訊號肽的感興趣蛋白質的前體，以及用於在表現系統中生產感興趣蛋白質的方法。本揭露中提供的訊號肽都具有將感興趣蛋白質分泌到哺乳動物細胞外的能力，並豐富了治療性蛋白生產中可用的訊號肽種類。在本揭露中提供的訊號肽中，一些訊號肽能提高感興趣蛋白質的產量，而另一些訊號肽能解決訊號肽殘基和不正確裂解的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2572" publication-number="202628232"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628232.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組與車輛</chinese-title>  
        <english-title>BATTERY PACK AND VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260211B">H01M50/383</main-classification>  
        <further-classification edition="202101120260211B">H01M50/358</further-classification>  
        <further-classification edition="201401120260211B">H01M10/6567</further-classification>  
        <further-classification edition="201901120260211B">B60L50/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭渽勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAE-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAE-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, EUI-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔洙鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔泰雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TAE-WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露電池組。電池組包括提供內部空間並具有基板的外殼；第一排氣導引，包括設置在基板的上表面上並在前後方向延伸的底板；設置在底板的上表面上的第一電池單元；設置在底板的上表面上的第二電池單元；以及定位在底板上並設置在第一電池單元和第二電池單元之間的第一冷卻件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a battery pack. The battery pack includes a case providing an internal space and having a base plate; a first venting guide including a bottom plate disposed on an upper surface of the base plate and extending in a front and rear direction; a first battery cell disposed on an upper surface of the bottom plate; a second battery cell disposed on the upper surface of the bottom plate; and a first cooling member positioned the bottom plate and disposed between the first battery cell and the second battery cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:外殼</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:側壁</p>  
        <p type="p">150:包裝蓋</p>  
        <p type="p">1000:電池組</p>  
        <p type="p">X,Y,Z:軸</p>  
        <p type="p">A-A',B-B',C-C',D-D',I-I':截面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2573" publication-number="202628276"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628276.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高速電連接器的電屏蔽組態</chinese-title>  
        <english-title>ELECTRICAL SHIELDING CONFIGURATION FOR HIGH-SPEED ELECTRICAL CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260325B">H01R13/646</main-classification>  
        <further-classification edition="200601120260325B">H01R13/648</further-classification>  
        <further-classification edition="201101120260325B">H01R13/658</further-classification>  
        <further-classification edition="201101120260325B">H01R13/6581</further-classification>  
        <further-classification edition="200601120260325B">H01R13/40</further-classification>  
        <further-classification edition="200601120260325B">H01R13/46</further-classification>  
        <further-classification edition="200601120260325B">H01R13/516</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨利　蘭德爾　羅伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENRY, RANDALL ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬修　布蘭登　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHEWS, BRANDON MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>Ｋ　拉克什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>K, RAKESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電連接器(100)，包括容納於一外殼(150)的一腔室(154)內之內殼(240)。該內殼具有一導電殼體(242)，該殼體於與一可插拔模組(120)對接的對接端(250)與安裝至一主機電路板(110)的安裝端(248)之間延伸。該電連接器包括接點組件(200)，其具有成對排列並容納於接點通道(270)內的接點(202)之接點插入件(220)。該電連接器包括一接地屏蔽(300)，其連結至該內殼，以封閉該等接點通道，從而使該接地屏蔽和該導電殼體提供電屏蔽給該等接點插入件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector (100) includes an inner housing (240) received in a chamber (154) of an outer housing (150). The inner housing has a conductive housing body (242) extending between a mating end (250) mated with a pluggable module (120) and a mounting end (248) mounted to a host circuit board (110). The electrical connector includes a contact assembly (200) having contact inserts (220) of contacts (202) arranged in pairs and received in contact channels (270). The electrical connector includes a ground shield (300) coupled to the inner housing to close the contact channels such that the ground shield and the conductive housing body provide electrical shielding for the contact inserts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電連接器</p>  
        <p type="p">124:電路板</p>  
        <p type="p">200:接點組件</p>  
        <p type="p">202:接點</p>  
        <p type="p">204:對接端</p>  
        <p type="p">206:安裝端</p>  
        <p type="p">208:接點陣列</p>  
        <p type="p">210:接點本體</p>  
        <p type="p">212:對接部分</p>  
        <p type="p">214:過渡部分</p>  
        <p type="p">216:端接部分</p>  
        <p type="p">218:彎曲部分</p>  
        <p type="p">220:接點插入件</p>  
        <p type="p">222:接點固定架</p>  
        <p type="p">240:內殼</p>  
        <p type="p">242:導電殼體</p>  
        <p type="p">244:第一側</p>  
        <p type="p">246:第二側</p>  
        <p type="p">300:接地屏蔽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2574" publication-number="202628760"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628760.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體顯示裝置</chinese-title>  
        <english-title>LIGHT EMITTING DIODE DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260130B">H10K59/122</main-classification>  
        <further-classification edition="202301120260130B">H10K59/40</further-classification>  
        <further-classification edition="201601120260130B">G09G3/3208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李垈興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DAEHEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含：顯示面板，包含位於第一至三像素區域的第一至三發光區中每一者中的發光二極體；透光度可變層，設置於顯示面板上並包含第一至三間隔件及位於第一至三間隔件之間的空間中或位於間隔件中每一者的側表面的光吸收層，第一至三間隔件分別位於第一至三發光區中；驅動電極，位於透光度可變層一側並包含分別位於第一、二非發光區中的第一、二驅動電極；及位於透光度可變層另一側並包含分別對應於第一、二驅動電極的第一、二觸控電極的觸控電極層。此配置能控制光透光度以減少環境光反射，同時保持顯示亮度並整合觸控感測功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a display panel including a light emitting diode in each of first to third emission areas of first to third pixel regions; a transmittance variable layer on the display panel and including first to third spacers and a light absorbing layer in a space between the first to third spacers or at a side surface of each spaces, the first to third spacers respectively in the first to third emission areas; a driving electrode at one side of the transmittance variable layer and including first and driving electrodes respectively in first and second non-emission areas; and a touch electrode layer at the other side of the transmittance variable layer and including first and second touch electrodes respectively corresponding to the first and second driving electrodes. This configuration enables control of light transmittance to reduce ambient light reflection while maintaining display brightness and integrating touch sensing functionality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:顯示面板</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:第一遮光圖案</p>  
        <p type="p">106:第三緩衝層</p>  
        <p type="p">110:第一半導體層</p>  
        <p type="p">110a:第一通道區域</p>  
        <p type="p">110b:第一源極區域</p>  
        <p type="p">110c:第一汲極區域</p>  
        <p type="p">112:第一閘極絕緣層</p>  
        <p type="p">114:第一閘極電極</p>  
        <p type="p">116:第一電容器電極</p>  
        <p type="p">118:第一層間絕緣層</p>  
        <p type="p">130:第二電容器電極</p>  
        <p type="p">132:第二遮光圖案</p>  
        <p type="p">134:第二層間絕緣層</p>  
        <p type="p">136:第二半導體層</p>  
        <p type="p">136a:第二通道區域</p>  
        <p type="p">136b:第二源極區域</p>  
        <p type="p">136c:第二汲極區域</p>  
        <p type="p">138:第二閘極絕緣層</p>  
        <p type="p">140:第二閘極電極</p>  
        <p type="p">142:第三層間絕緣層</p>  
        <p type="p">144a:第一源極電極</p>  
        <p type="p">144b:第一汲極電極</p>  
        <p type="p">146a:第二源極電極</p>  
        <p type="p">146b:第二汲極電極</p>  
        <p type="p">148:連接電極</p>  
        <p type="p">150:平坦化層</p>  
        <p type="p">150a:第一平坦化層</p>  
        <p type="p">150b:第二平坦化層</p>  
        <p type="p">156:堤岸</p>  
        <p type="p">160a:第一電極</p>  
        <p type="p">160b:發光層</p>  
        <p type="p">160c:第二電極</p>  
        <p type="p">162:封裝層</p>  
        <p type="p">162a:第一無機絕緣層</p>  
        <p type="p">162b:有機絕緣層</p>  
        <p type="p">162c:第二無機絕緣層</p>  
        <p type="p">D:有機發光二極體</p>  
        <p type="p">T1:第一薄膜電晶體</p>  
        <p type="p">T2:第二薄膜電晶體</p>  
        <p type="p">P:像素區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2575" publication-number="202628047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260129B">G09G3/32</main-classification>  
        <further-classification edition="201601120260129B">G09G3/3208</further-classification>  
        <further-classification edition="201601120260129B">G09G3/3258</further-classification>  
        <further-classification edition="200601120260129B">G09G5/10</further-classification>  
        <further-classification edition="200601120260129B">G09G5/37</further-classification>  
        <further-classification edition="200601120260129B">G09G5/377</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONG-HOON, YEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金種昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭美眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, MIJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置包含：基板，包含顯示區域及其外部之非顯示區域，顯示區域包含第一、二顯示區域，第一、二顯示區域分别包含第一、二像素區域，第二像素區域包含第一發光區域及透光區域；第一發光二極體，位於第一像素區域中且包含第一陽極、第一發光層及第一陰極；第二發光二極體，位於第一發光區域中且包含第二陽極、第二發光層及第二陰極；陰極分離圖案，位於第一、二像素區域之間；防止沉積圖案，位於透光區域中；第一、二低電位電壓線，位於非顯示區域中；第一、二陰極由陰極分離圖案分離，第一、二陰極分别連接至第一、二低電位電壓線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device comprises a substrate including a display area and a non-display area, the display area including a first display area and a second display area, the first display area including a first pixel region, the second display area including a second pixel region including a first emission area and a transmissive area; a first light emitting diode in the first pixel region and including a first cathode; a second light emitting diode in the first emission area and including a second cathode; a cathode separation pattern between the first and second pixel regions; a deposition preventing pattern in the transmissive area; and first and second low potential voltage line in the non-display area, wherein the first and second cathodes are separated by the cathode separation pattern, and wherein the first and second cathodes are respectively connected to the first and second low potential voltage lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:第一遮光圖案</p>  
        <p type="p">106:第一緩衝層</p>  
        <p type="p">110:第一半導體層</p>  
        <p type="p">110a:第一通道區域</p>  
        <p type="p">110b:第一源極區域</p>  
        <p type="p">110c:第一汲極區域</p>  
        <p type="p">112:第一閘極絕緣層</p>  
        <p type="p">114:第一閘極電極</p>  
        <p type="p">116:第一電容器電極</p>  
        <p type="p">118:第一層間絕緣層</p>  
        <p type="p">130:第二電容器電極</p>  
        <p type="p">132:第二遮光圖案</p>  
        <p type="p">134:第二層間絕緣層</p>  
        <p type="p">136:第二半導體層</p>  
        <p type="p">136a:第二通道區域</p>  
        <p type="p">136b:第二源極區域</p>  
        <p type="p">136c:第二汲極區域</p>  
        <p type="p">138:第二閘極絕緣層</p>  
        <p type="p">140:第二閘極電極</p>  
        <p type="p">142:第三層間絕緣層</p>  
        <p type="p">144a:第一源極電極</p>  
        <p type="p">144b:第一汲極電極</p>  
        <p type="p">146a:第二源極電極</p>  
        <p type="p">146b:第二汲極電極</p>  
        <p type="p">148:第一連接電極</p>  
        <p type="p">150:平坦化層</p>  
        <p type="p">152:第一平坦化層</p>  
        <p type="p">154:第二平坦化層</p>  
        <p type="p">156:堤岸</p>  
        <p type="p">158a:第一陽極</p>  
        <p type="p">158b:第一發光層</p>  
        <p type="p">158c:第一陰極</p>  
        <p type="p">159:間隔件</p>  
        <p type="p">162:封裝層</p>  
        <p type="p">162a:第一無機絕緣層</p>  
        <p type="p">162b:有機絕緣層</p>  
        <p type="p">162c:第二無機絕緣層</p>  
        <p type="p">166:橋接圖案</p>  
        <p type="p">168:第四層間絕緣層</p>  
        <p type="p">170:觸控電極</p>  
        <p type="p">172:第一保護層</p>  
        <p type="p">174:黑色矩陣</p>  
        <p type="p">176:濾色器層</p>  
        <p type="p">178:第二保護層</p>  
        <p type="p">P1:第一像素區域</p>  
        <p type="p">T1:第一薄膜電晶體</p>  
        <p type="p">T2:第二薄膜電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2576" publication-number="202626434"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626434.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人力驅動車之電子控制器</chinese-title>  
        <english-title>AN ELECTRIC CONTROLLER FOR A HUMAN POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260225B">B62M9/122</main-classification>  
        <further-classification edition="201001120260225B">B62M9/132</further-classification>  
        <further-classification edition="200601120260225B">B62M25/04</further-classification>  
        <further-classification edition="200601120260225B">B62M25/08</further-classification>  
        <further-classification edition="200601120260225B">B62K23/02</further-classification>  
        <further-classification edition="201201120260225B">B60W10/10</further-classification>  
        <further-classification edition="200601120260225B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝花聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHANA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島岳彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, TAKEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於人力驅動車之電子控制器。該電子控制器包括記憶體和可通訊耦接至該記憶體的處理器。該記憶體設置成儲存用於該人力驅動車的變速裝置自動變速操作之變速條件參數。該處理器設置成基於該變速條件參數和該人力驅動車的行駛狀態參數，來執行該自動變速操作。該處理器設置成執行手動變速操作，以回應接收來自使用者的手動操作指令。該處理器設置成在該人力驅動車處於第一狀態之狀態下，基於該手動操作指令讓該記憶體以第一量更新該變速條件參數。該處理器設置成在該人力驅動車處於與該第一狀態不同的第二狀態之狀態下，基於該手動操作指令讓該記憶體以第二量更新該變速條件參數。該第二量小於該第一量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electric controller for a human powered vehicle is provided. The electric controller includes a memory and a processor communicatably coupled to the memory. The memory is configured to store a parameter of a transmission condition used for an automatic gear shift operation of a transmission device of the human powered vehicle. The processor is configured to perform the automatic gear shift operation based on the parameter of the transmission condition and a parameter of a moving state of the human powered vehicle. The processor is configured to perform a manual gear shift operation in response to receiving a manual operation instruction from a user. The processor is configured to cause the memory to update the parameter of the transmission condition by a first amount based on the manual operation instruction in a state where the human powered vehicle is in a first state. The processor is configured to cause the memory to update the parameter of the transmission condition by a second amount based on the manual operation instruction in a state where the human powered vehicle is in a second state being different from the first state. The second amount is smaller than the first amount.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S41-S45:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2577" publication-number="202626300"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626300.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自主移動維修裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B25J9/16</main-classification>  
        <further-classification edition="202601120260401B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤功英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, KOEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀨口泰生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGUCHI, TAISEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高世真美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASE, MAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村理紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自主移動維修裝置，用以維修基板處理模組，具備：維修模組，可連接於基板處理模組；框架；自主移動搬運機器人，安裝在框架；定位調整單元，安裝在框架，用以調整維修模組的高度及姿態；第一偵測部，用以偵測基板處理模組中與維修模組連接的連接部分；及控制部，基於第一偵測部的輸出，而控制定位調整單元；自主移動搬運機器人包含：第二偵測部，在移動時偵測障礙物；及臂體，在自主移動搬運機器人移動時，使第二偵測部移動至框架的外側，並在自主移動搬運機器人停止時，使第二偵測部移動至框架的內側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:製造系統</p>  
        <p type="p">100:基板處理次系統</p>  
        <p type="p">110:真空搬運室</p>  
        <p type="p">115:機器臂</p>  
        <p type="p">120~126:基板處理裝置</p>  
        <p type="p">120g,120h:閘閥</p>  
        <p type="p">130~132:加載鎖室</p>  
        <p type="p">130g,130h:閘閥</p>  
        <p type="p">140:大氣壓搬運室</p>  
        <p type="p">141:載入埠</p>  
        <p type="p">145:機器臂</p>  
        <p type="p">200:搬運裝置</p>  
        <p type="p">300:保存裝置</p>  
        <p type="p">400:控制裝置</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2578" publication-number="202627904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145039</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理機器學習模型提示的系統和方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR PROCESSING PROMPTS FOR A MACHINE LEARNING MODEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260311B">G06N20/00</main-classification>  
        <further-classification edition="200601120260311B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇照遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, ZHAOYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓振九</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JINGOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔尊喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JOON HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程躍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安瓦爾　阿里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANWAR, ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方登　山姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOUNTAIN, SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種用於處理機器學習模型的提示的系統和方法。在一些實施例中，處理器接收用於第一機器學習模型的第一輸入和第二輸入。處理器識別用於第一輸入的第一服務等級和用於第二輸入的第二服務等級。基於第一服務等級和第二服務等級，處理器確定用於第一輸入的第一處理準則和第一批次大小，不同於用於第二輸入的第二處理準則和第二批次大小。第一機器學習模型根據第一處理準則和第一批次大小處理第一輸入，用於基於第一輸入生成回應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for processing prompts for a machine learning model are disclosed. In some embodiments, a processor receives a first input and a second input for a first machine learning model. The processor identifies a first service level for the first input and a second service level for the second input. Based on the first service level and the second service level, the processor determines a first processing criterion and a first batch size for the first input different from a second processing criterion and a second batch size for the second input. The first machine learning model processes the first input according to the first processing criterion and the first batch size for generating a response based on the first input.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">502、504、506、508、510、512:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2579" publication-number="202626703"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626703.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新胰島素受體促效劑</chinese-title>  
        <english-title>NEW INSULIN RECEPTOR AGONISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K14/62</main-classification>  
        <further-classification edition="201701120260401B">A61K47/64</further-classification>  
        <further-classification edition="200601120260401B">A61K38/28</further-classification>  
        <further-classification edition="200601120260401B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俄羅斯商吉洛法姆有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOO &lt;&lt;GEROPHARM&gt;&gt;</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅迪奧諾夫　彼得·彼得羅維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODIONOV, PETR PETROVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德雷　羅曼·瓦西里維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRAI, ROMAN VASILEVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬格魯克　馬克西姆·安德烈耶維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGRUK, MAKSIM ANDREEVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茲巴　達里亞·列昂尼多夫娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSYBA, DARIA LEONIDOVNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈桑希娜　朱赫拉·拉米列芙娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHASANSHINA, ZUKHRA RAMILEVNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊什楚克　謝爾蓋·亞歷山德羅維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHCHUK, SERGEI ALEKSANDROVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩帕羅娃　瓦萊麗婭·比亞什莫芙娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAPAROVA, VALERIIA BIASHIMOVNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧戈維克　伊利亞·阿列克謝耶維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUGOVIK, ILYA ALEKSEEVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊什圖巴耶娃　阿納斯塔西婭·德米特里芙娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IASHTUBAEVA, ANASTASIIA DMITRIEVNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於生物技術領域，即關於新穎胰島素受體促效劑，且其可以用於醫學中。所提供的超長效胰島素受體促效劑係包含與Fc片段多肽融合之胰島素或其類似物的融合蛋白，該Fc片段多肽對FcRn具有高結合能力且對FcγR具有弱結合能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the field of biotechnology, namely to novel insulin receptor agonists, and can be used in medicine. The provided ultra-long-acting insulin receptor agonists are a fusion protein comprising insulin or an analog thereof fused to an Fc fragment polypeptide having a high binding capacity for FcRn and a low binding capacity for FcγRs.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2580" publication-number="202626430"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626430.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用之控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251231B">B62M6/45</main-classification>  
        <further-classification edition="200601120251231B">B62M9/10</further-classification>  
        <further-classification edition="200601120251231B">B62M25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝花聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHANA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水谷祐太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTANI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可適切地控制變速裝置之人力驅動車用之控制裝置。 &lt;br/&gt;本發明之人力驅動車用之控制裝置包含控制部，該控制部構成為控制變更人力驅動車之車輪之車輪旋轉速度相對於人力驅動車之曲柄軸之旋轉速度之比即變速比之變速裝置；且控制部構成為基於與車輪旋轉速度及曲柄軸之旋轉速度之至少一者相關之變速條件以變更變速比之方式控制變速裝置，構成為即便於不滿足變速條件之情形下，但於輸入於曲柄軸之人力驅動力大於臨限值之情形下，亦以變速比變小之方式控制變速裝置；構成為於人力驅動車之狀態為第1狀態之情形下，將臨限值設定為第1臨限值；構成為於人力驅動車之狀態為與第1狀態不同之第2狀態之情形下，將臨限值設定為與第1臨限值不同之第2臨限值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:人力驅動車</p>  
        <p type="p">42:變速裝置</p>  
        <p type="p">42A:驅動源</p>  
        <p type="p">44:檢測部</p>  
        <p type="p">44A:曲柄旋轉狀態檢測部</p>  
        <p type="p">44B:車輪旋轉狀態檢測部</p>  
        <p type="p">46:狀態檢測部</p>  
        <p type="p">46A:傾斜檢測部</p>  
        <p type="p">46B:位置檢測部</p>  
        <p type="p">60:控制裝置</p>  
        <p type="p">62:控制部</p>  
        <p type="p">64:記憶部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2581" publication-number="202626612"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626612.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種感光性樹脂組合物及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D233/64</main-classification>  
        <further-classification edition="200601120260102B">C08F2/44</further-classification>  
        <further-classification edition="200601120260102B">C08F2/50</further-classification>  
        <further-classification edition="200601120260102B">G03F7/004</further-classification>  
        <further-classification edition="200601120260102B">G03F7/027</further-classification>  
        <further-classification edition="200601120260102B">G03F7/031</further-classification>  
        <further-classification edition="200601120260102B">G03F7/033</further-classification>  
        <further-classification edition="200601120260102B">G03F7/038</further-classification>  
        <further-classification edition="200601120260102B">G03F7/09</further-classification>  
        <further-classification edition="200601120260102B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力電子新材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力先端電子材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY ADVANCED ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商泰興強力先先電子新材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIXING TRONLY XIANXIAN NEW ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢曉春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, XIAOCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性樹脂組合物及其製備方法和應用，所述感光性樹脂組合物包括如下組分：(A)六芳基雙咪唑類混合光引發劑；(B)鹼可溶性聚合物；(C)具有烯屬不飽和雙鍵的化合物；(D)供氫體。本發明的感光性樹脂組合物具有優異的相容性，組合物的感光度高、分辨率和顯影性好，且具有優異的親水性，使得顯影液可重複利用，不會出現顯影垃圾堵塞濾網的情況，綜合應用性能優勢顯著。</p> 
      </isu-abst>  
      <isu-abst lang="en"></isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2582" publication-number="202626575"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626575.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學增幅負型阻劑組成物及阻劑圖案形成方法</chinese-title>  
        <english-title>CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C43/225</main-classification>  
        <further-classification edition="200601120260401B">C07C311/21</further-classification>  
        <further-classification edition="200601120260401B">C07C381/12</further-classification>  
        <further-classification edition="200601120260401B">C07D317/56</further-classification>  
        <further-classification edition="200601120260401B">C07D327/08</further-classification>  
        <further-classification edition="200601120260401B">C07D333/76</further-classification>  
        <further-classification edition="200601120260401B">C08F212/14</further-classification>  
        <further-classification edition="200601120260401B">C08F220/30</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification>  
        <further-classification edition="201201120260401B">G03F1/24</further-classification>  
        <further-classification edition="202601120260401B">H10P76/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島将大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供可改善圖案形成時的解析度，且可獲得LER及圖案忠實性良好的阻劑圖案之化學增幅負型阻劑組成物、及阻劑圖案形成方法。 &lt;br/&gt;該課題之解決手段為一種化學增幅負型阻劑組成物，含有： &lt;br/&gt;(A)光酸產生劑，由下式(A)表示之鎓鹽構成，及 &lt;br/&gt;(B)基礎聚合物，包含含有下式(B1)表示之重複單元的聚合物。 &lt;br/&gt;&lt;img align="absmiddle" height="362px" width="429px" file="ed10363.JPG" alt="ed10363.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An onium salt in which an aromatic ring having a sulfo group bonded thereto and another aromatic ring structure containing a bulky substituent group are linked via a sulfonamide bond generates an aromatic sulfonic acid with adequate acidity and controlled diffusion. When a chemically amplified negative resist composition comprising the onium salt as an acid generator and a polymer is processed by lithography, a pattern with improved resolution, reduced LER and satisfactory fidelity is obtainable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2583" publication-number="202626164"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626164.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點心組及點心組之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A63H33/30</main-classification>  
        <further-classification edition="200601120251231B">A63H17/00</further-classification>  
        <further-classification edition="200601120251231B">A63H33/42</further-classification>  
        <further-classification edition="200601120251231B">A23G3/54</further-classification>  
        <further-classification edition="200601120251231B">A23G3/50</further-classification>  
        <further-classification edition="200601120251231B">A23G1/54</further-classification>  
        <further-classification edition="200601120251231B">A23G9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商萬代股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANDAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水野英則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNO, HIDENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤凛太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, RINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡崎歌織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAZAKI, KAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種提高趣味性之點心組及點心組之製造方法。 &lt;br/&gt;本發明之點心組1具備：複數種本體部10，其等由可食用材料構成；及收容部20，其可收容本體部；且本體部構成為包含前方部10f及後方部10r，且可排列收容於收容部。又，點心組1之製造方法包含：填充工序，其將原料填充至模具中；成形工序，其使填充至模具中之原料成形；投入工序，其將成形後之原料作為點心投入至收容部；及移送工序，其移送投入有點心之收容部；且包含：積層工序，其於收容部之移送路徑之一個部位，於收容部之供給數超過排出數之情形時，將收容部積層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:點心組</p>  
        <p type="p">10:本體部</p>  
        <p type="p">10A:第1種類之本體部</p>  
        <p type="p">10a:本體部之上表面</p>  
        <p type="p">10B:第2種類之本體部</p>  
        <p type="p">10b:本體部之底面</p>  
        <p type="p">10C:第3種類之本體部</p>  
        <p type="p">10f:本體部之前方部</p>  
        <p type="p">10r:本體部之後方部</p>  
        <p type="p">11:第1本體部</p>  
        <p type="p">11d:第1凸部</p>  
        <p type="p">12:第2本體部</p>  
        <p type="p">12d:第2凸部</p>  
        <p type="p">20:托盤構件(收容部)</p>  
        <p type="p">20b:托盤底面(板部)</p>  
        <p type="p">20c:側壁部分</p>  
        <p type="p">20d:側壁部分</p>  
        <p type="p">20f:第1端部</p>  
        <p type="p">20r:第2端部</p>  
        <p type="p">X1:第1方向</p>  
        <p type="p">X2:第2方向</p>  
        <p type="p">Y:第3方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2584" publication-number="202625902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點心</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">A23G3/50</main-classification>  
        <further-classification edition="200601120251209B">A23G3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商萬代股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANDAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大久保宏海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUBO, HIROMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種提高趣味性之點心。 &lt;br/&gt;本發明之點心1具備：起點部10；路徑部20(21、22)，其等與起點部10連結；及終點部40，其與路徑部20(21、22)連結；且路徑部20(21、22)分別包含形狀不同之複數個區域而構成。藉由將路徑部20(21、22)構成為包含形狀不同之複數個區域，可創建自容器101拉離黏著性原材料之點心1時之分離阻力(黏著力)之變化。其結果，於將點心1自容器101釣出而進行遊戲時，可形成容易釣起之區域、與不易釣起之區域，從而可享受釣起操作之樂趣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:點心</p>  
        <p type="p">10:起點部</p>  
        <p type="p">20:路徑部</p>  
        <p type="p">21:第1種類之路徑部(路徑部)</p>  
        <p type="p">21b:曲線部</p>  
        <p type="p">22:第2種類之路徑部(路徑部)</p>  
        <p type="p">28:花紋</p>  
        <p type="p">31:第1種類之角色部</p>  
        <p type="p">32:第2種類之角色部</p>  
        <p type="p">40:終點部</p>  
        <p type="p">100:點心組</p>  
        <p type="p">101:容器</p>  
        <p type="p">102a:底面</p>  
        <p type="p">105:外周緣</p>  
        <p type="p">106:開始標記</p>  
        <p type="p">108:薄膜剝離部</p>  
        <p type="p">108b:缺口</p>  
        <p type="p">110:第1端部</p>  
        <p type="p">120:第2端部</p>  
        <p type="p">C1:第1角色(角色部)</p>  
        <p type="p">C2:第2角色(角色部)</p>  
        <p type="p">C3:第3角色(角色部)</p>  
        <p type="p">C4:第4角色(角色部)</p>  
        <p type="p">C5:第5角色(角色部)</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2585" publication-number="202626675"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626675.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅被膜形成用墨水、噴墨墨水、印刷物及銅電路形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C07F1/08</main-classification>  
        <further-classification edition="200601120260319B">C23C18/38</further-classification>  
        <further-classification edition="201401120260319B">C09D11/30</further-classification>  
        <further-classification edition="201401120260319B">C09D11/52</further-classification>  
        <further-classification edition="200601120260319B">C09D5/24</further-classification>  
        <further-classification edition="200601120260319B">B41J2/02</further-classification>  
        <further-classification edition="200601120260319B">C08K5/05</further-classification>  
        <further-classification edition="200601120260319B">C01B6/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商四國化成控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIKOKU KASEI HOLDINGS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商四國化成工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIKOKU CHEMICALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田宗作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, SHUSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於實現一種印刷性及印刷穩定性高的銅被膜形成用墨水。具體而言，為一種銅被膜形成用墨水，係含有：銅錯合物，其由具有由2~5個碳原子所構成之1個烷基取代基，或由1~5個碳原子所構成之2個以上的烷基取代基，且具有1~3個氮原子的五元或六元之含氮雜環化合物，及甲酸銅所構成；以及碳原子數2~6的一元醇，其亦可具有醚鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2586" publication-number="202626112"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626112.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用抗ROR1抗體藥物結合物治療癌症之方法</chinese-title>  
        <english-title>METHODS OF TREATING CANCER WITH ANTI-ROR1 ANTIBODY DRUG CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07D491/22</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊米若梅有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMMUNOME, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱丁　艾利森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAEDING, ALLISON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供用於治療ROR1表現癌症之ROR1之抗體藥物結合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are antibody drug conjugates for ROR1 for treating ROR1 expressing cancers.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2587" publication-number="202626102"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626102.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用表現ＣＤ１９　ＣＡＲ的細胞群體治療重症肌無力</chinese-title>  
        <english-title>TREATMENT OF MYASTHENIA GRAVIS USING A POPULATION OF CD19 CAR-EXPRESSING CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260401B">A61K40/11</main-classification>  
        <further-classification edition="202501120260401B">A61K40/31</further-classification>  
        <further-classification edition="200601120260401B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商諾華公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVARTIS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿迪維賈亞　班邦　塞諾阿吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADIWIJAYA, BAMBANG SENOAJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>培生　大衛　斯科特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEARSON, DAVID SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯坦格爾　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STANGEL, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了使用表現CD19 CAR的細胞群體（例如瑞達基奧侖賽）來治療重症肌無力之方法。還揭露了製備表現CD19 CAR的細胞群體之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides methods of using a population of CD19 CAR-expressing cells (for example, rapcabtagene autoleucel) for treating myasthenia gravis. Also disclosed are methods of making a population of CD19 CAR-expressing cells.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2588" publication-number="202628476"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628476.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145150</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱輻射源</chinese-title>  
        <english-title>THERMAL RADIATION SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260305B">H05B3/10</main-classification>  
        <further-classification edition="200601120260305B">H05B3/20</further-classification>  
        <further-classification edition="200601120260305B">G03F7/20</further-classification>  
        <further-classification edition="201201120260305B">G03F1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商４Ｋ微機電系統股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>4K-MEMS SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>因博登　馬蒂亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMBODEN, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩杜絲卡　薇若妮卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADURSKA, WERONIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史丹利　羅斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STANLEY, ROSS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼祖爾　艾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANZOOR, AYMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種熱輻射源，其包含一板體及至少一加熱器，該加熱器係配置為經由電流將板體加熱至放射溫度，俾使放射輻射可自板體放射而出，該加熱器包含一靠近板體之近端部分及一遠離板體之遠端部分。該加熱器係經安排俾使加熱器近端部分之電流密度及/或機械應力小於加熱器遠端部分之電流密度及/或機械應力。如此可改善該熱輻射源之壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熱輻射源</p>  
        <p type="p">3:連接墊</p>  
        <p type="p">4:加熱器</p>  
        <p type="p">10:板體</p>  
        <p type="p">100:瓣片</p>  
        <p type="p">400:用於部分測試之加熱器線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2589" publication-number="202627910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生產系統及生產方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">G06Q10/0631</main-classification>  
        <further-classification edition="202301120260102B">G06Q10/06</further-classification>  
        <further-classification edition="201201120260102B">G06Q50/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田憲一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, KENICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">謀求提供一種可隨著作業內容或資源的變化來制定製造計畫，並迅速且合理地分配資源之生產系統。生產系統在根據製造計畫來製造製品的工廠中具備：資源資訊部，包含資源資訊；製造計畫部，根據資源資訊部的內容，進行適合於製造計畫之作業員的配置；計畫推定判斷部，在製造計畫部進行人員配置之後，觀測及分析作業的進展狀況；及資源重新分配部，根據進展狀況而於作業的延遲或變更作業內容之際，重新評估製造計畫並調整資源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資源資訊部</p>  
        <p type="p">2:製造計畫部</p>  
        <p type="p">3:計畫推定判斷部</p>  
        <p type="p">4:資源重新分配部</p>  
        <p type="p">5:傳送部</p>  
        <p type="p">11:技能資訊部</p>  
        <p type="p">12:工具與設備資訊部</p>  
        <p type="p">13:生產資訊部</p>  
        <p type="p">31:生產狀況確認部</p>  
        <p type="p">32:現狀分析部</p>  
        <p type="p">41:製造計畫更新部</p>  
        <p type="p">42:資源重新分配器</p>  
        <p type="p">51:完成預測部</p>  
        <p type="p">52:傳送器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2590" publication-number="202626359"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626359.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子點光學片，以及包含該光學片的背光單元和顯示裝置</chinese-title>  
        <english-title>QUANTUM DOT OPTICAL SHEET, AND BACKLIGHT UNIT AND DISPLAY DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B32B27/00</main-classification>  
        <further-classification edition="200601120260401B">B32B27/20</further-classification>  
        <further-classification edition="200601120260401B">B32B27/28</further-classification>  
        <further-classification edition="200601120260401B">B32B27/36</further-classification>  
        <further-classification edition="201601120260401B">C08G75/045</further-classification>  
        <further-classification edition="200601120260401B">C09D181/02</further-classification>  
        <further-classification edition="201801120260401B">C09D7/61</further-classification>  
        <further-classification edition="200601120260401B">C09K11/02</further-classification>  
        <further-classification edition="200601120260401B">C09K11/70</further-classification>  
        <further-classification edition="200601120260401B">G02F1/00</further-classification>  
        <further-classification edition="200601120260401B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓松化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSOL CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南勁牟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, KYOUNG MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹美姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, MI HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申鎭湖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JIN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安載溶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, JAE YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵閏珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, YUN JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金吉蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GIL RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種量子點光學片以及包括其的背光單元和顯示裝置。量子點光學片在熱穩定性和阻擋特性兩方面均具有優異性能，無需使用高成本傳統阻擋膜，並且可以有效地應用於背光單元和顯示裝置的製造，從而在降低其製造成本的同時提供高品質顯示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A quantum dot optical sheet and a backlight unit and display device including the same are disclosed. The quantum dot optical sheet has excellent properties both in thermal stability and barrier characteristics without using a high cost conventional barrier film, and can be effectively applied to manufacture of backlight units and display devices, thereby providing a high-quality display device while reducing manufacturing costs thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100-1:第一基板/基板</p>  
        <p type="p">100-2:第二基板/基板</p>  
        <p type="p">200-1:第一阻擋層/阻擋層</p>  
        <p type="p">200-2:第二阻擋層/阻擋層</p>  
        <p type="p">300:光轉換層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2591" publication-number="202627047"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627047.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黑阻劑用感光性樹脂組成物、該感光性樹脂組成物的製造方法、遮光膜、濾光片、觸控面板及顯示裝置</chinese-title>  
        <english-title>PHOTOSENSITIVE RESIN COMPOSITION FOR BLACK RESIST, METHOD FOR PRODUCING THE SAME, LIGHT-SHIELDING FILM, COLOR FILTER, TOUCH PANEL AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260325B">C09K23/16</main-classification>  
        <further-classification edition="200601120260325B">G03F7/028</further-classification>  
        <further-classification edition="200601120260325B">G03F7/038</further-classification>  
        <further-classification edition="200601120260325B">C08F2/48</further-classification>  
        <further-classification edition="200601120260325B">C08K3/36</further-classification>  
        <further-classification edition="200601120260325B">C09C1/48</further-classification>  
        <further-classification edition="200601120260325B">G02B5/20</further-classification>  
        <further-classification edition="200601120260325B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日鐵化學材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新名将司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIINA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種黑阻劑用感光性樹脂組成物，可降低黑阻劑之玻璃基板側之反射率、抑制凝集異物、提高圖案化處理後與基板的密著性，又，提供該感光性樹脂組成物的製造方法。 &lt;br/&gt;本發明之解決手段為黑阻劑用感光性樹脂組成物含有(A)含有不飽和基之感光性樹脂；(B)具有至少2個以上不飽和鍵之光聚合性化合物；(C)光聚合起始劑；(D)含有選自由黑色顏料、混色顏料及遮光材所成群組之至少1種遮光成分之顏料分散質；(E)含有二氧化矽粒子之二氧化矽分散質；及(F)溶劑。前述(A)成分含有具有特定構造之(A1)成分，前述(A1)成分的一部分是以溶解於前述(F)成分之狀態含有，前述(A1)成分的一部分含有於前述(D)成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the present invention is to provide a photosensitive resin composition for black resist, which can reduce the reflectance of the black resist on the glass substrate side, suppress the aggregation of foreign matter, and enhance the adhesion to the substrate after patterning treatment; and a method for producing the photosensitive resin composition. &lt;br/&gt;The solution of the present invention is a photosensitive resin composition for black resist comprising (A) an unsaturated group-containing photosensitive resin, (B) a photopolymerizable compound having at least two or more unsaturated bonds, (C) a photopolymerization initiator, (D) a pigment dispersoid containing at least one light-shielding component selected from the group consisting of a black pigment, a mixed color pigment, and a light-shielding material, (E) a silica dispersoid containing silica particles, and (F) a solvent, wherein the component (A) comprises a component (A1) having a specific structure, a portion of the component (A1) is contained in a dissolved state in the component (F), and a portion of the component (A1) is contained in the component (D).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2592" publication-number="202628714"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628714.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全彩ＬＥＤ顯示屏及其製造方法</chinese-title>  
        <english-title>FULL-COLOR LED DISPLAY AND METHOD FOR MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260316B">H10H20/01</main-classification>  
        <further-classification edition="202501120260316B">H10H29/03</further-classification>  
        <further-classification edition="202501120260316B">H10H20/825</further-classification>  
        <further-classification edition="202501120260316B">H10H20/819</further-classification>  
        <further-classification edition="202501120260316B">H10H29/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國民大學校産學協力團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>都永洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DO, YOUNG RAG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種全彩LED顯示屏。據此，根據本發明之全彩LED顯示屏，較之採用傳統LED元件之顯示屏，由於透過晶圓之乾法蝕刻及濕法蝕刻所產生之表面缺陷與懸掛鍵等所導致之無效體積被最小化，具有能夠呈現出更優異高效率物性之LED元件，進而有利於達成更高亮度、光效率及解析度之全彩LED顯示屏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:全彩LED顯示屏</p>  
        <p type="p">S1、S2、S3:子像素區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2593" publication-number="202626431"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626431.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用之控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251231B">B62M6/45</main-classification>  
        <further-classification edition="200601120251231B">B62M9/10</further-classification>  
        <further-classification edition="201001120251231B">B62M9/122</further-classification>  
        <further-classification edition="200601120251231B">B62M25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝花聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHANA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可適切控制變速裝置之人力驅動車用之控制裝置。 &lt;br/&gt;人力驅動車包含：變速裝置，其構成為變更上述人力驅動車之車輪之旋轉速度相對於上述人力驅動車之曲軸之旋轉速度之比即變速比；及驅動單元，其構成為對上述人力驅動車賦予推進力；上述驅動單元構成為能夠變更輔助等級，人力驅動車用之控制裝置具備構成為控制上述變速裝置之控制部，上述控制部係構成為基於變速條件控制上述變速裝置以變更上述變速比，且構成為於滿足變更上述輔助等級之輔助變更條件且滿足上述變速條件之情形時，於抑制上述變速比增大之變速之第1控制狀態下控制上述變速裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:人力驅動車</p>  
        <p type="p">42:變速裝置</p>  
        <p type="p">42A:驅動源</p>  
        <p type="p">44:驅動單元</p>  
        <p type="p">44A:馬達</p>  
        <p type="p">46:檢測部</p>  
        <p type="p">46A:曲柄旋轉狀態檢測部</p>  
        <p type="p">46B:人力驅動力檢測部</p>  
        <p type="p">46C:車輪旋轉狀態檢測部</p>  
        <p type="p">46D:傾斜檢測部</p>  
        <p type="p">48:操作部</p>  
        <p type="p">60:控制裝置</p>  
        <p type="p">62:控制部</p>  
        <p type="p">64:記憶部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2594" publication-number="202626136"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626136.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微針的處理裝置及微針的處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61M37/00</main-classification>  
        <further-classification edition="200601120260331B">A61M5/32</further-classification>  
        <further-classification edition="200601120260331B">A61B5/151</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山政徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有突起部(MN1)的微針(MN)的處理裝置(EA)，其具備：支撐機構(10)，其透過支撐構件(14)支撐形成於上述支撐構件(14)的微針(MN)，所述支撐構件(14)具有與突起部(MN1)相對應的第1凹部(14B)及與突起部(MN1)不對應的第2凹部(14C)；分離機構(30)，其透過保持微針(MN)的保持構件(32)使上述微針(MN)與支撐構件(14)分離；以及偏壓機構(40)，其將進入了第2凹部(14C)內的微針部分(MN2)向保持構件(32)進行偏壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐機構</p>  
        <p type="p">11:線性馬達</p>  
        <p type="p">11A:滑塊</p>  
        <p type="p">12:基台</p>  
        <p type="p">12A:供氣孔</p>  
        <p type="p">13:厚度調整構件</p>  
        <p type="p">14:支撐構件</p>  
        <p type="p">14A:支撐面</p>  
        <p type="p">14B:第1凹部</p>  
        <p type="p">14C:第2凹部</p>  
        <p type="p">14D:噴氣孔</p>  
        <p type="p">20:按壓機構</p>  
        <p type="p">21:直線運動馬達</p>  
        <p type="p">21A:輸出軸</p>  
        <p type="p">22:按壓構件</p>  
        <p type="p">30:分離機構</p>  
        <p type="p">31:直線運動馬達</p>  
        <p type="p">31A:輸出軸</p>  
        <p type="p">32:保持構件</p>  
        <p type="p">32A:保持面</p>  
        <p type="p">32B:第1抽吸口</p>  
        <p type="p">32C:第2抽吸口</p>  
        <p type="p">32D:連通孔</p>  
        <p type="p">33:減壓機構</p>  
        <p type="p">33A:配管</p>  
        <p type="p">40:偏壓機構</p>  
        <p type="p">41:氣體供給機構</p>  
        <p type="p">41A:配管</p>  
        <p type="p">AA:符號</p>  
        <p type="p">EA:處理裝置</p>  
        <p type="p">MN:微針</p>  
        <p type="p">MN1:突起部</p>  
        <p type="p">MN2:微針部分</p>  
        <p type="p">PM:塑性材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2595" publication-number="202626014"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626014.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有增強紫外線防護之無水防曬劑組成物</chinese-title>  
        <english-title>ANHYDROUS SUNSCREEN COMPOSITIONS WITH ENHANCED ULTRAVIOLET PROTECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/86</main-classification>  
        <further-classification edition="200601120260401B">A61K8/35</further-classification>  
        <further-classification edition="200601120260401B">A61K8/37</further-classification>  
        <further-classification edition="200601120260401B">A61K8/89</further-classification>  
        <further-classification edition="200601120260401B">A61K8/92</further-classification>  
        <further-classification edition="200601120260401B">A61Q17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＥＬＣ管理公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELC MANAGEMENT LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　斯內哈爾Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, SNEHAL M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷迪　維多利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADY, VICTORIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩瓦　愛琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAVA, ELENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李耕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊昂斯　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYONS, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">外用無水防曬劑組成物，其包含甘油聚醚-26及阿伏苯宗及/或甘油聚醚-26。除了提升SPF值及UVA-PF值之外，甘油聚醚-26亦提供優異的美學、感官概況、及延展性，且特別適用於無水系統中。本發明之組成物可呈油/油、油/聚矽氧、或聚矽氧/油乳液、以及多相無水系統（諸如油/聚矽氧/油）之形式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Topical anhydrous sunscreen compositions that comprise glycereth-26 and avobenzone and/or glycerteh-26. In addition to boosting SPF and UVA-PF values, glycereth-26 provides excellent aesthetics, sensory profiles and spreading ability, and is particularly suitable for use in anhydrous systems. Compositions of the invention may be in the form of oil/oil, oil/silicone, or silicone/oil emulsions, as well as multi-phase anhydrous systems, such as oil/silicone/oil.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2596" publication-number="202628796"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628796.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高解析度陰影遮罩墊片</chinese-title>  
        <english-title>HIGH RESOLUTION SHADOW MASK GASKET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P14/22</main-classification>  
        <further-classification edition="202601120260327B">H10P14/44</further-classification>  
        <further-classification edition="200601120260327B">C23C14/04</further-classification>  
        <further-classification edition="200601120260327B">G03F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＢＡＥ系統資訊及電子系統整合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃倫　亞歷山大Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARREN, ALEXANDER S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威考夫　納旦尼爾Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WYCKOFF, NATHANIEL P</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERRY, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種製造積體電路之系統、組合件及方法。將一陰影遮罩與一基板黏附並對準。具有一陰影遮罩墊片介於該陰影遮罩與該基板之間。透過該陰影遮罩及該陰影遮罩墊片，將一薄膜材料沉積在該基板上，例如，矽晶圓。沉積的該薄膜材料形成具有垂直邊緣邊界的一薄膜特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system, assembly and method of producing an integrated circuit is provided. A shadow mask is adhered to and aligned with a substrate. There is a shadow mask gasket interposed between the shadow mask and the substrate. A thin film material is deposited on the substrate, such as a silicon wafer, through the shadow mask and the shadow mask gasket. The thin film material that is deposited results in a thin film feature having a boundary with a vertical edge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2597" publication-number="202628331"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628331.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多相AC/DC變換器及其控制方法</chinese-title>  
        <english-title>MULTI-PHASE AC/DC CONVERTER AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260202B">H02M1/42</main-classification>  
        <further-classification edition="200601120260202B">H02M1/08</further-classification>  
        <further-classification edition="200601120260202B">H02M7/217</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰國商泰達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索蘭基　吉滕德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLANKI, JITENDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案關於一種多相AC/DC變換器，包括：具有初級側和次級側的變壓器裝置；連接到變壓器裝置的初級側的雙向初級側電路；連接到變壓器裝置的次級側的雙向次級側電路；DC/DC變換器電路，包括至少一個輸入級、變壓器裝置和輸出級；雙向初級側電路包括AC/DC變換器電路和DC/DC變換器電路的上述至少一個輸入級；雙向次級側電路包括DC/DC變換器電路的輸出級；初級側電路是多軌結構，軌的數量對應於多相AC/DC變換器的相的數量，每個軌連接在多相AC輸入源的相和中性點之間，或者連接在多相AC輸入源的第一相與另一相之間，本案關於用於操作多相變換器的控制方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention concerns a multi-phase AC/DC converter comprising: a transformer device with a primary side and a secondary side; a bidirectional primary side circuit connected to the primary side of the transformer device; a bidirectional secondary side circuit connected to the secondary side of the transformer device; and a DC/DC converter circuit comprising at least one input stage, the transformer device, and an output stage; wherein the bidirectional primary side circuit comprises an AC/DC converter circuit and the at least one input stage of the DC/DC converter circuit; the bidirectional secondary side circuit comprises the output stage of the DC/DC converter circuit; and the primary side circuit is multi-rail with a number of rails corresponding to a number of phases of the multi-phase AC/DC converter, and each rail being connected between a phase and neutral or between a first phase and another phase of a multi-phase AC input source. The invention also concerns control methods for operating multi-phase converters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多相AC/DC變換器</p>  
        <p type="p">2:變壓器裝置</p>  
        <p type="p">3:初級側</p>  
        <p type="p">4:次級側</p>  
        <p type="p">5:初級側電路</p>  
        <p type="p">5a:AC/DC變換器電路</p>  
        <p type="p">5b:輸入級</p>  
        <p type="p">6:次級側電路</p>  
        <p type="p">6a:輸出級</p>  
        <p type="p">7a-7c:軌</p>  
        <p type="p">8a-8c:初級相</p>  
        <p type="p">9:中性點</p>  
        <p type="p">20:DC/DC變換器電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2598" publication-number="202626314"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626314.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造纖維產品的方法及纖維產品</chinese-title>  
        <english-title>A METHOD FOR PRODUCING A CELLULOSE PRODUCT AND A CELLULOSE PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260227B">B27N3/04</main-classification>  
        <further-classification edition="200601120260227B">B27N3/12</further-classification>  
        <further-classification edition="200601120260227B">B27N3/18</further-classification>  
        <further-classification edition="200601120260227B">B27N3/20</further-classification>  
        <further-classification edition="200601120260227B">B29C51/00</further-classification>  
        <further-classification edition="200601120260227B">D21J5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商普勒帕克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PULPAC AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉爾森　奧維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARSSON, OVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍格布洛姆　歐萊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOGBLOM, OLLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈格伯格　英格維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGBERG, YNGVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含一管狀構件（8）之高密度乾式模製纖維（HD-DMF）纖維素產品（1）以及一種用於自一纖維素紙材料（2）製造此類纖維素產品（1）之方法及系統，其中成型模具（3）包含具有一內表面（13）之一第一模具部件（4）、具有帶一外表面（16）的一可旋轉軸桿（9）之一第二模具部件（5）及具有一管狀按壓構件（10）之一第三模具部件（6），其中該方法包含以下步驟：藉由旋轉該可旋轉軸桿（9）而將該纖維素紙材料（2）配置於該可旋轉軸桿（9）上，藉此將預定義數目層纖維素紙材料（2）捲繞至該可旋轉軸桿（9）上；將具有該纖維素紙材料（2）之該可旋轉軸桿（9）配置於該第一模具部件（4）中，藉此在該第一模具部件（4）之該內側壁（13）與該可旋轉軸桿（9）之該外表面（16）之間產生一管狀成型空間（11）；以及藉由用該管狀按壓構件（10）以一成型壓力按壓該纖維素紙材料（2）以獲得該纖維素產品（1）來形成該纖維素產品（1）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A High Density Dry Moulded Fibre (HD-DMF) cellulose product (1) comprising a tube-shaped member (8) and a method and system for producing such a cellulose product (1) from a cellulose paper material (2), where the forming mould (3) comprises a first mould part (4) having an inner surface (13), a second mould part (5) having a rotatable shaft (9) having an outer surface (16), and a third mould part (6) having a tube-shaped pressing member (10), wherein the method comprises the steps of; arranging the cellulose paper material (2) on the rotatable shaft (9) by rotating the rotatable shaft (9), thereby winding a predefined number of layers of cellulose paper material (2) onto the rotatable shaft (9); arranging the rotatable shaft (9) with the cellulose paper material (2) in the first mould part (4), thereby creating a tube shaped forming space (11) between the inner side wall (13) of the first mould part (4) and the outer surface (16) of the rotatable shaft (9); and forming the cellulose product (1) by pressing the cellulose paper material (2) with the tube-shaped pressing member (10) with a forming pressure to obtain the cellulose product (1).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:纖維素產品</p>  
        <p type="p">2:纖維素紙材料</p>  
        <p type="p">3:成型模具</p>  
        <p type="p">4:第一模具部件</p>  
        <p type="p">5:第二模具部件</p>  
        <p type="p">6:第三模具部件</p>  
        <p type="p">9:可旋轉軸桿</p>  
        <p type="p">10:管狀按壓構件</p>  
        <p type="p">11:管狀成型空間</p>  
        <p type="p">12:承載表面</p>  
        <p type="p">13:內側壁</p>  
        <p type="p">16:外表面</p>  
        <p type="p">17:按壓表面</p>  
        <p type="p">18:外表面</p>  
        <p type="p">19:內表面</p>  
        <p type="p">23:第一切割器件</p>  
        <p type="p">24:第一對捲筒</p>  
        <p type="p">25:第二對捲筒</p>  
        <p type="p">26:緩衝區</p>  
        <p type="p">27:紙供應裝置</p>  
        <p type="p">28:夾持器件</p>  
        <p type="p">30:系統</p>  
        <p type="p">32:纖維素條帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2599" publication-number="202626619"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626619.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145354</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RAS抑制劑</chinese-title>  
        <english-title>RAS INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/04</main-classification>  
        <further-classification edition="200601120260401B">C07F5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商銳新醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REVOLUTION MEDICINES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔻登　愛蕾娜　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLTUN, ELENA S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桂格　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREGG, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉爾　愛德萊恩　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILL, ADRIAN L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾基　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGGEN, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班尼特　Ｇ　萊斯禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURNETT, G. LESLIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮特森　珍妮佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PITZEN, JENNIFER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴扣　安卓斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUCKL, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納克斯　約翰　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOX, JOHN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案之特徵在於能夠抑制Ras蛋白之巨環化合物以及其醫藥組成物及蛋白質複合物，及其在癌症治療中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure features macrocyclic compounds, and pharmaceutical compositions and protein complexesthereof, capable of inhibiting Ras proteins, and their uses in the treatment of cancers.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2600" publication-number="202628084"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628084.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">G11C5/04</main-classification>  
        <further-classification edition="200601120260209B">G11C11/04</further-classification>  
        <further-classification edition="202501120260209B">H10D62/10</further-classification>  
        <further-classification edition="202501120260209B">H10D62/40</further-classification>  
        <further-classification edition="202501120260209B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡熙載</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, HEEJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泫珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴希映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HUIYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金熙中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HUIJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金容寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YONGKWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一半導體裝置可包括：一基體，其具有一胞元陣列區、一周邊電路區及一連接區；一胞元元件分開圖案，其在該胞元陣列區上界定一胞元作用區；一周邊元件分開圖案，其在該周邊電路區上界定一周邊作用區；一分開絕緣圖案，其在該連接區上位於該胞元元件分開圖案與該周邊元件分開圖案之間；以及一胞元閘極結構。該分開絕緣圖案之一下表面可包括鄰近於該周邊電路區且在一第一高度的一第一下區、鄰近於該胞元陣列區且相對於該基體之一上表面位於比該第一高度更高的一第二高度的一第二下區，以及在該第一下區與該第二下區之間的一第一階部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a substrate having a cell array region, a peripheral circuit region, and a connection region; a cell element separation pattern defining a cell active region on the cell array region; a peripheral element separation pattern defining a peripheral active region on the peripheral circuit region; a separation insulating pattern between the cell element separation pattern and the peripheral element separation pattern on the connection region; and a cell gate structure. A lower surface of the separation insulating pattern may include a first lower region adjacent to the peripheral circuit region and on a first level, a second lower region adjacent to the cell array region and on a second level that is higher than the first level relative to an upper surface of the substrate, and a first step portion between the first lower region and the second lower region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:第一遮罩層</p>  
        <p type="p">101:基體</p>  
        <p type="p">110a:第一胞元元件分開圖案，胞元元件分開圖案</p>  
        <p type="p">110b:第二胞元元件分開圖案，胞元元件分開圖案</p>  
        <p type="p">120:閘極介電層</p>  
        <p type="p">121:下圖案</p>  
        <p type="p">122:上圖案</p>  
        <p type="p">125:閘極覆罩層</p>  
        <p type="p">128:緩衝絕緣層</p>  
        <p type="p">130:分開絕緣圖案</p>  
        <p type="p">131:第一絕緣層</p>  
        <p type="p">132:第二絕緣層</p>  
        <p type="p">133:第三絕緣層</p>  
        <p type="p">141:第一傳導圖案</p>  
        <p type="p">142:第二傳導圖案</p>  
        <p type="p">143:第三傳導圖案</p>  
        <p type="p">146:第一覆罩圖案</p>  
        <p type="p">147:第二覆罩圖案</p>  
        <p type="p">152:絕緣襯裡</p>  
        <p type="p">154:元件</p>  
        <p type="p">156:第一層間絕緣層，層間絕緣層</p>  
        <p type="p">158:第二層間絕緣層，層間絕緣層</p>  
        <p type="p">160cp1:閘極接觸插塞</p>  
        <p type="p">160p1:第二上傳導圖案，上傳導圖案</p>  
        <p type="p">162:阻障層</p>  
        <p type="p">164:傳導層</p>  
        <p type="p">165:絕緣圖案</p>  
        <p type="p">170:周邊元件分開圖案</p>  
        <p type="p">A:區</p>  
        <p type="p">ACT:胞元作用區</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BL_D:虛設位元線結構，虛設結構</p>  
        <p type="p">CAR:胞元陣列區，區</p>  
        <p type="p">GS_D:虛設閘極結構，虛設結構</p>  
        <p type="p">III-III&lt;i&gt;'&lt;/i&gt;:線</p>  
        <p type="p">IR:連接區域，連接區，區</p>  
        <p type="p">PCR:周邊電路區，區</p>  
        <p type="p">SS:間隔體結構</p>  
        <p type="p">T1a:第一胞元溝槽，胞元溝槽</p>  
        <p type="p">T1b:第二胞元溝槽，胞元溝槽</p>  
        <p type="p">T2:連接溝槽，溝槽</p>  
        <p type="p">T3:周邊溝槽，周圍溝槽</p>  
        <p type="p">WL:字線</p>  
        <p type="p">WLS:胞元閘極結構，字線結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2601" publication-number="202626731"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626731.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>針對ＩＬ－１０Ｒα及β次單元的單免疫球蛋白域雙特異性抗體及其使用方法</chinese-title>  
        <english-title>SINGLE IMMUNOGLOBULIN DOMAIN BISPECIFIC ANTIBODIES AGAINST IL-10R ALPHA AND BETA SUBUNITS AND METHODS OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07K16/46</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德利達基斯　喬治奧斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELIDAKIS, GEORGIOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　璜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科萊斯克　梅根　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLESKE, MEGAN L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　卿瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHINGWEI V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　奧克代爾　妮可　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHIRLE OAKDALE, NICOLE T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯姆森　納森　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMSEN, NATHAN D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易　唐盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, TANGSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岳　麗麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUE, LILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供雙特異性抗體，其包含特異性結合至介白素-10受體(IL-10R) α次單元(IL-10Rα)及β次單元(IL-10Rβ)之胞外域的第一VHH結合域及第二VHH結合域，且選擇性抑制骨髓細胞之活化且對T細胞或B細胞誘導最小活化或無直接活化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are bispecific antibodies comprising first and second VHH binding domains that specifically bind to the extracellular domains of interleukin-10 receptor (IL-10R) alpha subunit (IL-10Rα) and beta subunit (IL-10Rβ), and that selectively suppress activation of myeloid cells and induce minimal or no direct activation of T cells or B cells.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2602" publication-number="202626676"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626676.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於沉積金屬氧化物薄膜的揮發性的鍶和鋇的甲脒前驅物</chinese-title>  
        <english-title>VOLATILE STRONTIUM AND BARIUM FORMAMIDINATE PRECURSORS FOR DEPOSITON OF METAL OXIDE THIN FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F3/00</main-classification>  
        <further-classification edition="200601120260401B">C23C16/40</further-classification>  
        <further-classification edition="200601120260401B">C23C16/448</further-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="200601120260401B">C23C16/52</further-classification>  
        <further-classification edition="202301120260401B">H10B12/00</further-classification>  
        <further-classification edition="202601120260401B">H10P14/60</further-classification>  
        <further-classification edition="202601120260401B">H10P14/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商慧盛材料美國責任有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERSUM MATERIALS US, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國倉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, GUOCANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊瓦諾夫　塞基Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IVANOV, SERGEI V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩沃　麥克Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAVO, MICHAEL T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭露和請求保護的標的涉及鍶和鋇的前驅物、其合成以及其在沉積含鍶和/或鋇薄膜的方法中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed and claimed subject matter relates to strontium and barium precursors, their synthesis and their use in methods for depositing films containing strontium and/or barium.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2603" publication-number="202627093"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627093.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145475</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制Ｃ５基因表現的ＧａｌＮＡｃ寡聚核苷酸綴合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">C07H21/02</further-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="201701120260401B">A61K47/54</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification>  
        <further-classification edition="200601120260401B">A61P7/00</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商石藥集團中奇製藥技術（石家莊）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CSPC ZHONGQI PHARMACEUTICAL TECHNOLOGY (SHIJIAZHUANG) CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雪豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XUEYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凌宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LINGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇曉曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, XIAOYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙成龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, CHENGLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種包含GalNAc衍生物的寡聚核苷酸綴合物，包含所述寡聚核苷酸綴合物的藥物組合物，以及所述寡聚核苷酸綴合物或藥物組合物的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2604" publication-number="202628957"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628957.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理設備及控制通過半導體處理設備之氣體流量的方法</chinese-title>  
        <english-title>SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF CONTROLLING GAS FLOW THROUGH SEMICONDUCTOR PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P95/00</main-classification>  
        <further-classification edition="200601120260324B">C23C16/455</further-classification>  
        <further-classification edition="200601120260324B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅塞爾皮奧　達維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROSERPIO, DAVIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏斯特雷肯　西奧多羅斯　Ｇ．Ｍ．</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOSTERLAKEN, THEODORUS G.M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特后司特　赫伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERHORST, HERBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>優湯南渡　里札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKANANTO, RIZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班克瑞斯　瑞德寇　傑拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANKRAS, RADKO GERARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑迪拉　路西安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JDIRA, LUCIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種半導體處理設備。該設備包含：一處理腔室，其經組態以接收由一基板舟皿支撐之複數個基板；至少一個氣體注入器，其用於將一氣體提供至該處理腔室；至少兩個氣體排放出口，其用於自該處理腔室移除一氣體；以及至少兩個氣體排放導管，其各自連接至一各別氣體排放出口。該等氣體排放導管中之各者在該處理腔室內部沿一豎直方向在該基板舟皿的至少部分上方延伸。該等氣體排放導管中之至少一者包含在該豎直方向上間隔開的複數個孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor processing apparatus is disclosed. The apparatus comprises a process chamber configured to receive a plurality of substrates supported by a substrate boat; at least one gas injector for providing a gas to the process chamber; at least two gas exhaust outlets for removing a gas from the process chamber; and at least two gas exhaust conduits, each connected to a respective gas exhaust outlet. Each of the gas exhaust conduits extends in a vertical direction inside the process chamber over at least part of the substrate boat. At least one of the gas exhaust conduits comprises a plurality of holes spaced apart in the vertical direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:半導體處理設備</p>  
        <p type="p">102:處理腔室</p>  
        <p type="p">103:封閉頂端(頂端)</p>  
        <p type="p">104:可封閉底端(底端)</p>  
        <p type="p">105:控制器</p>  
        <p type="p">106:內部空間</p>  
        <p type="p">107:凸緣總成</p>  
        <p type="p">108:中心開口</p>  
        <p type="p">109:氣體入口</p>  
        <p type="p">110:氣體出口</p>  
        <p type="p">111:門板</p>  
        <p type="p">112:底座</p>  
        <p type="p">113:基板載體</p>  
        <p type="p">114:基板</p>  
        <p type="p">115:端板</p>  
        <p type="p">116:支撐桿</p>  
        <p type="p">117:槽</p>  
        <p type="p">118:加熱器</p>  
        <p type="p">119:外表面</p>  
        <p type="p">120:氣體源</p>  
        <p type="p">121:注入器</p>  
        <p type="p">122:注入器固持器</p>  
        <p type="p">123:真空泵</p>  
        <p type="p">124:排放氣體管線</p>  
        <p type="p">125:氣體排放導管</p>  
        <p type="p">126:氣體排放導管固持器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2605" publication-number="202626356"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626356.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B32B23/08</main-classification>  
        <further-classification edition="200601120260401B">B32B27/30</further-classification>  
        <further-classification edition="201901120260401B">B32B7/023</further-classification>  
        <further-classification edition="200601120260401B">B32B7/12</further-classification>  
        <further-classification edition="200601120260401B">G02B5/30</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1335</further-classification>  
        <further-classification edition="200601120260401B">G02F1/13363</further-classification>  
        <further-classification edition="200601120260401B">G09F9/30</further-classification>  
        <further-classification edition="202301120260401B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有賀草平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARUGA, SOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶田翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKARADA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船曳貴夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNABIKI, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題提供一種光學積層體，其可實現透過具有偏光作用之光學構件視辨之視辨性優異的影像顯示裝置，且可抑制裂痕產生及/或伸長。&lt;br/&gt; 作為其解決手段，本發明實施形態之光學積層體依序包含有第1相位差薄膜、偏光件及第2相位差薄膜。該第1相位差薄膜之面內相位差Re(550)為80nm以上且160nm以下。該第1相位差薄膜在-40℃~85℃下之平均線膨脹係數為4.5×10&lt;sup&gt;-5&lt;/sup&gt;/℃以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第1相位差薄膜</p>  
        <p type="p">2:第2相位差薄膜</p>  
        <p type="p">2a:第1表面</p>  
        <p type="p">2b:第2表面</p>  
        <p type="p">3:偏光件</p>  
        <p type="p">3a:第1表面</p>  
        <p type="p">3b:第2表面</p>  
        <p type="p">5:黏著劑層</p>  
        <p type="p">61:第1接著層</p>  
        <p type="p">62:第2接著層</p>  
        <p type="p">7:剝離襯材</p>  
        <p type="p">100:光學積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2606" publication-number="202626344"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626344.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體、影像顯示裝置及光學積層體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260330B">B32B7/027</main-classification>  
        <further-classification edition="200601120260330B">B32B38/14</further-classification>  
        <further-classification edition="200601120260330B">G02B5/30</further-classification>  
        <further-classification edition="200601120260330B">G02F1/1335</further-classification>  
        <further-classification edition="200601120260330B">B29D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有賀草平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARUGA, SOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶田翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKARADA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭在佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JAEWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案課題提供一種可穩定成形成三維曲面之光學積層體、影像顯示裝置及光學積層體之製造方法。&lt;br/&gt; 作為其解決手段，本發明實施形態之光學積層體係用於具有三維曲面之影像顯示裝置。光學積層體具備有偏光件。光學積層體在示差掃描熱量分析之升溫曲線的微分曲線DDSC中，50℃~95℃之溫度範圍的最大值大於600µW/分鐘且小於3000µW/分鐘。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第1相位差薄膜</p>  
        <p type="p">2:第2相位差薄膜</p>  
        <p type="p">3:偏光件</p>  
        <p type="p">61:第1接著層</p>  
        <p type="p">62:第2接著層</p>  
        <p type="p">100:光學積層體</p>  
        <p type="p">100a:第1面</p>  
        <p type="p">100b:第2面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2607" publication-number="202627125"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627125.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊料合金、焊膏、焊球及焊料接頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C22C12/00</main-classification>  
        <further-classification edition="200601120260302B">C22C13/02</further-classification>  
        <further-classification edition="200601120260302B">B23K35/02</further-classification>  
        <further-classification edition="200601120260302B">B23K35/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商千住金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENJU METAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松藤貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUFUJI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>足助海斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUKE, KAITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川俊策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, SHUNSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供焊料合金、焊膏、焊球及焊料接頭，該焊料合金為低熔點且延性、剪切強度及耐熱循環性優異，進而抑制開路不良的發生，而且即使在大面積的接合時也會減少殘留空隙。 &lt;br/&gt;　　其解決手段的焊料合金具有如下合金組成：以質量%計為Bi：35.0~68.0%、Sb：0.1~2.0%、Ni：0.010~ 0.050%、Ge：0.007~0.090%、且餘量由Sn所構成。較佳合金組成還含有以質量%計總計為0.1%以下的Co、Ti、Al、Mn、As、Fe、Pd、Zn、Zr、Pb、In、Ce、P及Ga中的至少1種。另外，該焊料合金可以適宜地用於焊膏、焊球、焊料接頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50~52:空隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2608" publication-number="202627428"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627428.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145598</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經組態用於在實施感測器電路及/或感測器處理之高溫環境中之感測器測量之類晶圓感測器及其實施方法</chinese-title>  
        <english-title>WAFER-LIKE SENSOR CONFIGURED FOR SENSOR MEASUREMENTS IN HIGH-TEMPERATURE ENVIRONMENTS IMPLEMENTING SENSOR CIRCUITS AND/OR SENSOR PROCESSING AND A PROCESS OF IMPLEMENTING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260319B">G01K1/14</main-classification>  
        <further-classification edition="200601120260319B">G01K1/16</further-classification>  
        <further-classification edition="200601120260319B">G01K1/20</further-classification>  
        <further-classification edition="200601120260319B">G01K7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商能多順測試與檢驗美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORDSON TEST AND INSPECTION AMERICAS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾瓦戈斯基　巴圖茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOWAKOWSKI, BARTOSZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文茲爾　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEINZIERL, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭格洛斯　丹尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANGLOIS, DENIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種類晶圓感測器，其包含一支撐基板、配置於該支撐基板上之至少一個溫度感測器、配置於該支撐基板上之一電介面及配置於該支撐基板上之至少一個感測器互連件。該類晶圓感測器進一步包含以下之至少一者：一感測器迴路配置、經組態以補償漂移之至少一個電阻器、經組態以連接至一單獨組件之複數個電連接、一感測器導體扇出組態、一診斷組態、一內部校準組態及/或用於計算一溫度分佈之一組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wafer-like sensor includes a support substrate, at least one temperature sensor arranged on the support substrate, an electrical interface arranged on the support substrate, and at least one sensor interconnect arranged on the support substrate. The wafer-like sensor further includes at least one of the following: a sensor loop arrangement, at least one resistor configured to compensate for drift, a plurality of electrical connections configured to connect to a separate component, a sensor conductor fanout configuration, a diagnostic configuration, an internal calibration configuration, and/or a component to calculate a temperature profile.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:類晶圓感測器</p>  
        <p type="p">102:溫度感測器</p>  
        <p type="p">104:溫度電路組件</p>  
        <p type="p">106:電介面</p>  
        <p type="p">108:電池組件</p>  
        <p type="p">110:電力互連件</p>  
        <p type="p">112:資料互連件</p>  
        <p type="p">114:感測器互連件</p>  
        <p type="p">116:支撐基板</p>  
        <p type="p">118:上基板表面</p>  
        <p type="p">120:基板側表面</p>  
        <p type="p">901:橫軸</p>  
        <p type="p">902:縱軸</p>  
        <p type="p">906:高溫環境</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2609" publication-number="202626732"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626732.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用抗人類連接素－４治療劑治療癌症之方法及組成物</chinese-title>  
        <english-title>METHODS AND COMPOSITIONS FOR TREATMENT OF CANCER WITH ANTI-HUMAN NECTIN-4 THERAPEUTICS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07K5/02</further-classification>  
        <further-classification edition="200601120260401B">C07D491/22</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默沙東有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　小平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, XIAOPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢本　艾咪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEEBE, AMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查許　艾利歐特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHARTASH, ELLIOT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多布連科夫　康斯坦丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOBRENKOV, KONSTANTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬拉特　安舒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARATHE, ANSHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾斯魯普　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORTHRUP, ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托普　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPP, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, TINGTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程燁哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YEZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供使用抗人類連接素-4 (Nectin-4)治療劑治療實體癌(例如尿路上皮癌(UC)、頭頸部鱗狀細胞癌(HNSCC)、子宮頸癌(CC)、子宮內膜癌(EC)或三陰性乳癌(TNBC))之方法、組成物、用途及套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods, compositions, uses, and kits for treatment of solid cancer (e.g., urothelial cancer (UC), head and neck squamous cell carcinoma (HNSCC), cervical cancer (CC), endometrial carcinoma (EC), or triple-negative breast cancer (TNBC)) using anti-human Nectin-4 therapeutics.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2610" publication-number="202626662"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626662.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件之製造方法及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D495/04</main-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">C07D493/04</further-classification>  
        <further-classification edition="200601120260401B">C07D517/04</further-classification>  
        <further-classification edition="202301120260401B">H10K30/60</further-classification>  
        <further-classification edition="202301120260401B">H10K30/30</further-classification>  
        <further-classification edition="202301120260401B">H10K85/20</further-classification>  
        <further-classification edition="202601120260401B">H10K39/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子和平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, KAZUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦寛記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米久田康智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKUTA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種響應性的電場強度依賴性優異之光電轉換元件以及與上述光電轉換元件相關之攝像元件、光感測器、攝像元件之製造方法及化合物。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中上述光電轉換膜含有由式（1）表示之化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="264px" width="607px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2611" publication-number="202627982"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627982.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於校準龍門架的方法</chinese-title>  
        <english-title>METHOD FOR CALIBRATING A GANTRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260128B">G06T5/60</main-classification>  
        <further-classification edition="202401120260128B">G06T5/70</further-classification>  
        <further-classification edition="201701120260128B">G06T7/269</further-classification>  
        <further-classification edition="201701120260128B">G06T7/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商碧綠威自動化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PBA SYSTEMS PTE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達馬拉然　薩提揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARMARAJAN, SATHYIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　明敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, MING MIN, MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈亞瓦爾達納　柯勒勒格　唐　馬利特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAYAWARDHANA, KORELEGE DON MALITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種用於校準龍門架的方法，該方法包括：用相機擷取校準點的訓練影像和測試影像；從訓練影像中選擇模型影像；掃描模型影像和測試影像以獲得模型掃描部分和測試掃描部分；對於每個測試掃描部分，將從模型掃描部分導出的模型子像素邊緣梯度向從測試掃描部分導出的測試子像素邊緣梯度偏移以獲得校正的模型子像素邊緣梯度，該校正的模型子像素邊緣梯度表示展現出與測試子像素邊緣梯度的最高NCC的偏移的模型子像素邊緣梯度；基於校正的模型子像素邊緣梯度獲得去噪的子像素邊緣位置；以及基於去噪的子像素邊緣位置確定校準點的去噪的點中心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for calibrating a gantry is disclosed, the method comprising capturing with a camera, training images and a test image of a calibration dot; selecting a model image from the training images; scanning the model image and the test image to obtain model scan portions and test scan portions; for each test scan portion, shifting a model subpixel edge gradient derived from the model scan portion towards a test subpixel edge gradient derived from the test scan portion to obtain a corrected model subpixel edge gradient, which represents the shifted model subpixel edge gradient that exhibits the highest NCC with the test subpixel edge gradient; obtaining a denoised subpixel edge position based on the corrected model subpixel edge gradient; and determining a denoised dot center of the calibration dot based on the denoised subpixel edge positions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">402~420:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2612" publication-number="202627902"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627902.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子運算系統、方法及電腦程式產品</chinese-title>  
        <english-title>SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR QUANTUM COMPUTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260202B">G06N10/20</main-classification>  
        <further-classification edition="202201120260202B">G06N10/40</further-classification>  
        <further-classification edition="202201120260202B">G06N10/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西班牙商多元宇宙運算公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派特拉　悉達多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRA, SIDDHARTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　蘇克賓德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, SUKHBINDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈赫羅米　賽義德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAHROMI, SAEED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧魯斯　羅曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORUS, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種量子運算系統，其包含：具有多個量子計算單元（202、203、801）之儲存槽（101、201），其中該些量子計算單元（202、203、801）是以非晶格計算配置方式配置；用以對儲存槽（101、201）之量子計算單元（202、203、801）進行計算操控之手段；用以使至少兩個經計算操控之量子計算單元（202、203、801）之間啟用計算互動之手段；以及量測手段（105、601），用以於該計算互動後量測該至少兩個量子計算單元（202、203、801）中至少一者的量子性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a quantum computing system comprising: a reservoir (101, 201) of quantum computational units (202, 203, 801), wherein the quantum computational units (202, 203, 801) are disposed in a non-lattice computational arrangement; means for computationally manipulating quantum computational units (202, 203, 801) of the reservoir (101, 201); means for enabling computational interaction between at least two quantum computational units (202, 203, 801) computationally manipulated; and a measurement means (105, 601) for measuring a quantum property of at least one of the at least two quantum computational units (202, 203, 801) after said computational interaction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:量子運算系統</p>  
        <p type="p">101:儲存槽</p>  
        <p type="p">102:計算操控手段</p>  
        <p type="p">103:計算互動啟用手段</p>  
        <p type="p">104:儲存手段</p>  
        <p type="p">105:量測手段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2613" publication-number="202628736"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628736.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫素結構</chinese-title>  
        <english-title>PIXEL STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251229B">H10H29/37</main-classification>  
        <further-classification edition="202501120251229B">H10H29/49</further-classification>  
        <further-classification edition="202501120251229B">H10D30/67</further-classification>  
        <further-classification edition="202501120251229B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹科學園區新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何毅達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YI-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳國光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUO-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫素結構設置於基板上且包括第一電晶體以及第二電晶體。第一電晶體包括第一導電層、第一導電層之上的第一半導體層、第一半導體層之上的第一閘極、第一閘極與第一半導體層之間的第一閘極絕緣層、以及電性連接第一半導體層的第一源極/汲極。第二電晶體電性連接第一電晶體且包括第一半導體層之上的第二半導體層、第二半導體層之上的第二閘極、第二閘極與第二半導體層之間的第二閘極絕緣層、以及電性連接第二半導體層的第二源極/汲極。第二半導體層於基板的正投影完全重疊第一導電層於基板的正投影，且第二半導體層於基板的正投影位於第一閘極於基板的正投影之外。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pixel structure disposed on a substrate includes a first transistor and a second transistor. The first transistor includes a first conductive layer, a first semiconductor layer over the first conductive layer, a first gate over the first semiconductor layer, a first gate insulating layer between the first gate and the first semiconductor layer, and a first source/drain electrically connecting the first semiconductor layer. The second transistor is electrically connected to the first transistor and includes a second semiconductor layer over the first semiconductor layer, a second gate over the second semiconductor layer, a second gate insulating layer between the second gate and the second semiconductor layer, and a second source/drain electrically connecting the second semiconductor layer. An orthographic projection of the second semiconductor layer on the substrate is completely overlapped with an orthographic projection of the first conductive layer on the substrate, and the orthographic projection of the second semiconductor layer on the substrate is outside an orthographic projection of the first gate on the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:畫素結構</p>  
        <p type="p">122,142:導電層</p>  
        <p type="p">124,144:半導體層</p>  
        <p type="p">128,148:閘極</p>  
        <p type="p">A-A’,B-B’:剖面線</p>  
        <p type="p">SP1:子畫素</p>  
        <p type="p">T1,T2:電晶體</p>  
        <p type="p">V1,V2,V3,V4,Va:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2614" publication-number="202626606"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626606.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145743</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＰＤＥ４抑制劑用於治療及／或預防慢性阻塞性肺病或其相關疾病</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D213/64</main-classification>  
        <further-classification edition="200601120260401B">C07D207/26</further-classification>  
        <further-classification edition="200601120260401B">C07D211/76</further-classification>  
        <further-classification edition="200601120260401B">C07D211/94</further-classification>  
        <further-classification edition="200601120260401B">C07D213/89</further-classification>  
        <further-classification edition="200601120260401B">C07D239/36</further-classification>  
        <further-classification edition="200601120260401B">C07D237/14</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4412</further-classification>  
        <further-classification edition="200601120260401B">A61K31/45</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4015</further-classification>  
        <further-classification edition="200601120260401B">A61K31/50</further-classification>  
        <further-classification edition="200601120260401B">A61K31/513</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商正大製藥（廣州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGZHOU CHIA TAI INNOVATIVE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖飞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖永红</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YONGHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>许小毛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIAOMAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及PDE4抑制劑用於治療及/或預防慢性阻塞性肺病或其相關疾病的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2615" publication-number="202628211"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628211.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體處理裝置的組裝方法、流體處理裝置以及配備此類流體處理裝置的電化學系統</chinese-title>  
        <english-title>METHOD OF MOUNTING A FLUID PROCESSOR DEVICE, A FLUID PROCESSOR DEVICE AND AN ELECTROCHEMICAL SYSTEM WITH SUCH A FLUID PROCESSOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260323B">H01M8/04701</main-classification>  
        <further-classification edition="201601120260323B">H01M8/0258</further-classification>  
        <further-classification edition="202101120260323B">C25B9/15</further-classification>  
        <further-classification edition="200601120260323B">F16L13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席伯　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIEBER, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱勒　拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KELLER, RALF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明進行一種一電化學系統之一流體處理裝置（10）的組裝方法，該流體處理裝置（10）包含至少一個高溫流體組件（12、14、16、18、20）及至少一個另外高溫流體組件（22、24），其中在至少一個方法步驟中，該高溫流體組件（12、14、16、18、20）經由該流體處理裝置（10）之至少一個溫度補償元件（26、28、30、32、34）間接接合至該另外高溫流體組件（22、24）。 &lt;br/&gt;提議該至少一個高溫流體組件（12、14、16、18、20）及該至少一個另外高溫流體組件（22、24）固定於一夾持裝置（36）中，以便實施接合該至少一個高溫流體組件（12、14、16、18、20）及該至少一個另外高溫流體組件（22、24）之一焊接製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention proceeds from a method of mounting a fluid processor device (10) of an electrochemical system, said fluid processor device (10) comprising at least one high- temperature fluid component (12, 14, 16, 18, 20) and at least one further high-temperature fluid component (22, 24), where, in at least one method step, the high-temperature fluid component (12, 14, 16, 18, 20) is bonded indirectly to the further high-temperature fluid component (22, 24) via at least one temperature compensation element (26, 28, 30, 32, 34) of the fluid processor device (10). &lt;br/&gt;It is proposed that the at least one high-temperature fluid component (12, 14, 16, 18, 20) and the at least one further high-temperature fluid component (22, 24) be fixed in a clamping device (36) in order to implement a welding process that bonds the at least one high-temperature fluid component (12, 14, 16, 18, 20) and the at least one further high-temperature fluid component (22, 24).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:流體處理裝置</p>  
        <p type="p">12:高溫流體組件</p>  
        <p type="p">14:高溫流體組件</p>  
        <p type="p">16:高溫流體組件</p>  
        <p type="p">18:高溫流體組件</p>  
        <p type="p">20:高溫流體組件</p>  
        <p type="p">22:高溫流體組件/其他高溫流體組件</p>  
        <p type="p">24:高溫流體組件/其他高溫流體組件</p>  
        <p type="p">26:溫度補償元件/膜型溫度補償元件</p>  
        <p type="p">28:溫度補償元件/膜型溫度補償元件</p>  
        <p type="p">30:溫度補償元件/膜型溫度補償元件</p>  
        <p type="p">32:溫度補償元件</p>  
        <p type="p">34:溫度補償元件</p>  
        <p type="p">38:後燃器</p>  
        <p type="p">40:後燃器</p>  
        <p type="p">42:重組器</p>  
        <p type="p">44:吸氣單元</p>  
        <p type="p">46:吸氣單元</p>  
        <p type="p">48:流體導引單元</p>  
        <p type="p">50:熱交換器/廢氣-燃料熱交換器</p>  
        <p type="p">52:熱交換器/廢氣-氧氣熱交換器</p>  
        <p type="p">54:縱向軸線</p>  
        <p type="p">56:燃料進料端</p>  
        <p type="p">58:氧氣進料端</p>  
        <p type="p">60:廢氣導管</p>  
        <p type="p">78:軸向自由度</p>  
        <p type="p">80:側向自由度</p>  
        <p type="p">82:端部</p>  
        <p type="p">84:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2616" publication-number="202626513"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626513.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燒結體製造用粉末及其製造方法、以及陶瓷燒結體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C01G9/02</main-classification>  
        <further-classification edition="200601120260102B">C04B35/626</further-classification>  
        <further-classification edition="200601120260102B">C04B35/64</further-classification>  
        <further-classification edition="200601120260102B">C04B35/453</further-classification>  
        <further-classification edition="200601120260102B">H01C7/112</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意礦物股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE MINERAL &amp; ALLOY COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五味洋二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOMI, YOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田圭美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, YOSHIMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本博惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, HIROE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種用於製造電特性優異的陶瓷燒結體的新穎的燒結體製造用粉末、新穎的燒結體製造用粉末的製造方法、電特性優異的陶瓷燒結體、以及該陶瓷燒結體的製造方法。本發明的燒結體製造用粉末是含有滿足下述條件A的金屬元素M，並且具有選自燒綠石結構及尖晶石結構的結晶結構，利用液相法合成的燒結體製造用粉末。（條件A）金屬元素M是金屬元素M1與金屬元素M2的組合，所述金屬元素M1是選自由Ca、Sr、Zn、Cd、Hg、Bi、Pb及稀土類元素所組成的群組中的至少一種，所述金屬元素M2是選自由B、Sn、Ti、Zr、V、Mo、Pt、Ru、Ir、Si、Ge、Hf、Nb、Ta及Sb所組成的群組中的至少一種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2617" publication-number="202628919"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628919.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/70</main-classification>  
        <further-classification edition="200601120260302B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林幸太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可抑制基板的面內溫度分布的不均之靜電吸盤。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：形成有複數個氣孔140之介電質基板100；支撐介電質基板100之底板200；將介電質基板100與底板200之間接合之接合層300。接合層300包含第一接合層310，與從外周側將第一接合層310圍繞成環狀之第二接合層320。第二接合層320的熱傳導率比第一接合層310的熱傳導率高。當複數個氣孔140之中形成於成為最外周側的位置的氣孔140為最外周氣孔140A時，第二接合層320之中內周側的端部位於比最外周氣孔140A的中心還靠內周側的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:靜電吸盤</p>  
        <p type="p">100:介電質基板</p>  
        <p type="p">110、120、210、220:面</p>  
        <p type="p">111:封環</p>  
        <p type="p">112:點</p>  
        <p type="p">116:底面</p>  
        <p type="p">130:吸附電極</p>  
        <p type="p">140、240:氣孔</p>  
        <p type="p">140A:最外周氣孔</p>  
        <p type="p">200:底板</p>  
        <p type="p">260:冷媒流道</p>  
        <p type="p">300:接合層</p>  
        <p type="p">310:第一接合層</p>  
        <p type="p">320:第二接合層</p>  
        <p type="p">D1、D2:距離</p>  
        <p type="p">DL1、DL2、DL3:一點鏈線</p>  
        <p type="p">SP:空間</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2618" publication-number="202628920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/70</main-classification>  
        <further-classification edition="200601120260302B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林幸太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可抑制基板的面內溫度分布的不均之靜電吸盤。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：形成有複數個氣孔140之介電質基板100；支撐介電質基板100之底板200；將介電質基板100與底板200之間接合之接合層300。接合層300包含第一接合層310，與從外周側將第一接合層310圍繞成環狀之第二接合層320。第二接合層320的熱傳導率比第一接合層310的熱傳導率高。當複數個氣孔140之中形成於成為最外周側的位置的氣孔140為最外周氣孔140A時，第一接合層310之中外周側的端部位於比最外周氣孔140A的中心還靠外周側的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:靜電吸盤</p>  
        <p type="p">100:介電質基板</p>  
        <p type="p">110、120、210、220:面</p>  
        <p type="p">111、112:封環</p>  
        <p type="p">113:點</p>  
        <p type="p">116:底面</p>  
        <p type="p">130:吸附電極</p>  
        <p type="p">140、240:氣孔</p>  
        <p type="p">140A:最外周氣孔</p>  
        <p type="p">200:底板</p>  
        <p type="p">260:冷媒流道</p>  
        <p type="p">300:接合層</p>  
        <p type="p">310:第一接合層</p>  
        <p type="p">320:第二接合層</p>  
        <p type="p">D1、D2:距離</p>  
        <p type="p">DL1、DL2、DL3:一點鏈線</p>  
        <p type="p">SP:空間</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2619" publication-number="202628921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145802</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/70</main-classification>  
        <further-classification edition="200601120260302B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林幸太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可抑制基板的面內溫度分布的不均之靜電吸盤。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：介電質基板100；底板200；將介電質基板100與底板200之間接合之接合層300。接合層300包含第一接合層310，與從外周側將第一接合層310圍繞成環狀之第二接合層320。第二接合層320的熱傳導率比第一接合層310的熱傳導率高。當複數個氣孔140之中形成於成為最外周側的位置的氣孔140為最外周氣孔140A時，第一接合層310之中外周側的端部E1位於比最外周氣孔140A的中心CT還靠內周側的位置，第二接合層320之中內周側的端部E2位於比最外周氣孔140A的中心CT還靠外周側的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:氣孔</p>  
        <p type="p">140A:最外周氣孔</p>  
        <p type="p">310:第一接合層</p>  
        <p type="p">320:第二接合層</p>  
        <p type="p">CT:中心</p>  
        <p type="p">D1、D2:距離</p>  
        <p type="p">D3、D4:層間距離</p>  
        <p type="p">E1、E2:端部</p>  
        <p type="p">SP2:空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2620" publication-number="202628922"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628922.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/70</main-classification>  
        <further-classification edition="200601120260302B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林幸太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可抑制基板的面內溫度分布的不均之靜電吸盤。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：具有包含載置面之面110之第一部分101，與從第一部分101的外周端更朝外周側突出，且比第一部分101還薄之第二部分102之介電質基板100；接合於介電質基板100之底板200；將介電質基板100與底板200之間接合之接合層300。接合層300包含第一接合層310，與從外周側將第一接合層310圍繞成環狀之第二接合層320。第二接合層320的熱傳導率比第一接合層310的熱傳導率高。在該靜電吸盤10中，在俯視下第二接合層320之中內周側的端部位於與第一部分101重疊的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:靜電吸盤</p>  
        <p type="p">100:介電質基板</p>  
        <p type="p">101:第一部分</p>  
        <p type="p">102:第二部分</p>  
        <p type="p">110、120、160、210、220:面</p>  
        <p type="p">111:封環</p>  
        <p type="p">112:點</p>  
        <p type="p">116:底面</p>  
        <p type="p">130:吸附電極</p>  
        <p type="p">140、240:氣孔</p>  
        <p type="p">141、241:擴徑部</p>  
        <p type="p">150、250:通氣塞</p>  
        <p type="p">200:底板</p>  
        <p type="p">260:冷媒流道</p>  
        <p type="p">300:接合層</p>  
        <p type="p">310:第一接合層</p>  
        <p type="p">320:第二接合層</p>  
        <p type="p">D1、D2:距離</p>  
        <p type="p">DL:虛線</p>  
        <p type="p">DL1、DL2、DL3:一點鏈線</p>  
        <p type="p">RE:環狀構件</p>  
        <p type="p">SP:空間</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2621" publication-number="202628923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/70</main-classification>  
        <further-classification edition="200601120260302B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林幸太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KOUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可抑制基板的面內溫度分布的不均之靜電吸盤。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：具有包含載置面之面110之第一部分101，與從第一部分101的外周端更朝外周側突出，且比第一部分101還薄之第二部分102之介電質基板100；接合於介電質基板100之底板200；將介電質基板100與底板200之間接合之接合層300。接合層300包含第一接合層310，與從外周側將第一接合層310圍繞成環狀之第二接合層320。第二接合層320的熱傳導率比第一接合層310的熱傳導率高。在該靜電吸盤10中，在俯視下第二接合層320之中內周側的端部位於不與第一部分101重疊的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:靜電吸盤</p>  
        <p type="p">100:介電質基板</p>  
        <p type="p">101:第一部分</p>  
        <p type="p">102:第二部分</p>  
        <p type="p">110、120、160、210、220:面</p>  
        <p type="p">111:封環</p>  
        <p type="p">112:點</p>  
        <p type="p">116:底面</p>  
        <p type="p">130:吸附電極</p>  
        <p type="p">140、240:氣孔</p>  
        <p type="p">141、241:擴徑部</p>  
        <p type="p">150、250:通氣塞</p>  
        <p type="p">200:底板</p>  
        <p type="p">260:冷媒流道</p>  
        <p type="p">300:接合層</p>  
        <p type="p">310:第一接合層</p>  
        <p type="p">320:第二接合層</p>  
        <p type="p">D1、D2、D3:距離</p>  
        <p type="p">DL:虛線</p>  
        <p type="p">DL1、DL2、DL3:一點鏈線</p>  
        <p type="p">RE:環狀構件</p>  
        <p type="p">SP:空間</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2622" publication-number="202627182"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627182.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理設備</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C23C16/455</main-classification>  
        <further-classification edition="202601120260401B">H10P14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵晋模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JIN MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板處理設備，包含腔室、蓋體、基板支撐件、第一氣體噴射器以及第二氣體噴射器。腔室包含處理空間。蓋體設置於處理空間上方。基板支撐件設置成面向蓋體並配置成支撐基板。第一氣體噴射器設置於處理空間的第一區域內。第二氣體噴射器設置於處理空間的第二區域內並配置成包含用於形成電漿的電極。第二氣體噴射器下表面的高度高於蓋體下表面的高度，且第一氣體噴射器下表面的高度等於或低於蓋體下表面的高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a substrate processing apparatus comprising a chamber including a processing space; a lid disposed above the processing space; a substrate supporter disposed to face the lid and configured to support a substrate; a first gas injector disposed in a first area of the processing space, and a second gas injector disposed in a second area of the processing space and configured to include an electrode for forming plasma, wherein a height of a lower surface of the second gas injector is higher than a height of a lower surface of the lid, and a height of a lower surface of the first gas injector is equal to or lower than the height of the lower surface of the lid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理設備</p>  
        <p type="p">200:處理空間</p>  
        <p type="p">210:第一區域</p>  
        <p type="p">220:第二區域</p>  
        <p type="p">230:第三區域</p>  
        <p type="p">4:噴射器</p>  
        <p type="p">41:第一氣體噴射器</p>  
        <p type="p">411:第一氣體噴射模組</p>  
        <p type="p">411c:中心</p>  
        <p type="p">412:第二氣體噴射模組</p>  
        <p type="p">412c:中心</p>  
        <p type="p">42:第二氣體噴射器</p>  
        <p type="p">421:第三氣體噴射模組</p>  
        <p type="p">422:第四氣體噴射模組</p>  
        <p type="p">43:第三氣體噴射器</p>  
        <p type="p">20:蓋體</p>  
        <p type="p">61:第一供應器</p>  
        <p type="p">62:第二供應器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2623" publication-number="202628313"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628313.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池管理系統的喚醒裝置及包含其的電池系統</chinese-title>  
        <english-title>WAKE-UP APPARATUS OF BATTERY MANAGEMENT SYSTEM AND BATTERY SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260328B">H02J7/44</main-classification>  
        <further-classification edition="201901120260328B">B60L58/10</further-classification>  
        <further-classification edition="201901120260328B">G06F1/3203</further-classification>  
        <further-classification edition="202601120260328B">H02J7/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金禎煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JEONG WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於喚醒管理多個電池芯的電池管理系統的主控制單元（MCU）的喚醒裝置。喚醒裝置包括：電源供應裝置配置為通過車輛的第二繼電器從用於啟動車輛的輔助電壓源接收第一電源信號，並使用第一電源信號向MCU提供MCU的操作所需要的第二電源信號；以及喚醒控制電路，配置為回應於車輛的關鍵開啟信號通過車輛的第一繼電器從輔助電壓源接收第一電源信號，並回應於第一電源信號驅動第二繼電器到開啟狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wake-up apparatus for waking up a main control unit (MCU) of a battery management system that manages a plurality of battery cells may be provided. The wake-up apparatus includes: a power supply device configured to receive a first power signal from an auxiliary voltage source used for starting a vehicle through a second relay of the vehicle, and provide a second power signal required for an operation of the MCU to the MCU using the first power signal; and a wakeup control circuit configured to receive the first power signal from the auxiliary voltage source through a first relay of the vehicle in response to a key on signal of the vehicle, and drive the second relay to an on state in response to the first power signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">163:主控制單元、微控制器、MCU</p>  
        <p type="p">165:喚醒裝置</p>  
        <p type="p">165_1:喚醒控制電路</p>  
        <p type="p">165_2:直流-直流轉換器</p>  
        <p type="p">165_3:低壓差電路、LDO電路</p>  
        <p type="p">20:外部裝置</p>  
        <p type="p">22:第一繼電器、繼電器</p>  
        <p type="p">222:第一開關</p>  
        <p type="p">224:第一線圈</p>  
        <p type="p">24:第二繼電器、繼電器</p>  
        <p type="p">242:第二開關</p>  
        <p type="p">244:第二線圈</p>  
        <p type="p">26:鉛酸電池</p>  
        <p type="p">28:內部電路</p>  
        <p type="p">CNT_LATCH:鎖存信號</p>  
        <p type="p">P1:第一針腳</p>  
        <p type="p">P2:第二針腳</p>  
        <p type="p">P3:第三針腳</p>  
        <p type="p">P4:第四針腳</p>  
        <p type="p">P5:第五針腳</p>  
        <p type="p">P6:第六針腳</p>  
        <p type="p">P7:第七針腳</p>  
        <p type="p">P8:第八針腳</p>  
        <p type="p">TE1:第一端子</p>  
        <p type="p">TE2:第二端子</p>  
        <p type="p">TE3:第三端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2624" publication-number="202626874"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626874.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、液晶配向膜及液晶元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C08G73/10</main-classification>  
        <further-classification edition="200601120260102B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米原卓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEHARA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口虎彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TORAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種液晶配向劑、液晶配向膜及液晶元件。一種液晶配向劑，含有在同一分子內包含結構單元（U1）、結構單元（U2）及結構單元（U3）的聚合物（P）。結構單元（U1）：源自具有式（1）所表示的部分結構的二胺的結構單元。結構單元（U2）：源自具有部分結構Y（-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;-等）的二胺的結構單元（其中，結構單元（U1）及結構單元（U3）除外）。結構單元（U3）：源自具有式（2）所表示的部分結構的二胺的結構單元。式（1）中，A&lt;sup&gt;1&lt;/sup&gt;及A&lt;sup&gt;2&lt;/sup&gt;為三價芳香環基。B&lt;sup&gt;1&lt;/sup&gt;為-NR&lt;sup&gt;1&lt;/sup&gt;-等。式（2）中，X&lt;sup&gt;1&lt;/sup&gt;為一價熱脫離性基。R&lt;sup&gt;4&lt;/sup&gt;為「-C(R&lt;sup&gt;7&lt;/sup&gt;)(R&lt;sup&gt;8&lt;/sup&gt;)-」等。R&lt;sup&gt;5&lt;/sup&gt;為「-C(R&lt;sup&gt;7&lt;/sup&gt;)(R&lt;sup&gt;8&lt;/sup&gt;)-」等。 &lt;br/&gt;&lt;img align="absmiddle" height="154px" width="467px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2625" publication-number="202626463"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626463.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">B65G43/08</main-classification>  
        <further-classification edition="200601120260102B">B65G49/07</further-classification>  
        <further-classification edition="201801120260102B">G01N23/225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商歐姆龍股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古屋大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUYA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種技術，其藉由簡易的裝置結構及控制，可在前一個檢查對象物的搬出結束之前開始後一個檢查對象物的搬入，從而縮短搬出/搬入的間隔時間。一種檢查裝置，具有檢查對象物的搬入口及搬出口、將檢查對象物自搬入口搬送至搬出口的搬送機構以及控制部，搬送機構構成為經由搬入口及搬出口與上游的搬送機構及下游的搬送機構的各者連接並且在裝置內將先搬入的檢查對象物以及之後搬入的檢查對象物一體地搬送，控制部執行如下控制：將在檢查對象物配置於搬送路徑上所設置的拍攝位置時檢查對象物的前端所處的搬送路徑上的第一位置與搬入口之間的距離即第一距離為先搬入至檢查裝置內的檢查對象物的後端與搬出口之間的距離即第二距離以上的情況作為條件，接受之後要檢查的檢查對象物的搬入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">90:X射線檢查裝置</p>  
        <p type="p">91:上游側裝置</p>  
        <p type="p">92:下游側裝置</p>  
        <p type="p">900:輸送機(搬送機構)</p>  
        <p type="p">901:搬入口</p>  
        <p type="p">902:搬出口</p>  
        <p type="p">910:輸送機(上游的搬送機構)</p>  
        <p type="p">920:輸送機(下游的搬送機構)</p>  
        <p type="p">C1:基板檢測感測器/感測器</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">D2:第二距離</p>  
        <p type="p">O:拍攝位置</p>  
        <p type="p">P1:第一位置</p>  
        <p type="p">P2:第二位置</p>  
        <p type="p">PI:搬入位置</p>  
        <p type="p">PO:搬出位置</p>  
        <p type="p">W1:工件(檢查對象物)</p>  
        <p type="p">W2:工件(檢查對象物)</p>  
        <p type="p">WE:基板後端位置(後端)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2626" publication-number="202628435"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628435.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145876</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像感測器及其像素電路的操作方法</chinese-title>  
        <english-title>IMAGE SENSOR AND OPERATION METHOD OF PIXEL CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260317B">H04N25/57</main-classification>  
        <further-classification edition="202301120260317B">H04N25/59</further-classification>  
        <further-classification edition="202301120260317B">H04N25/77</further-classification>  
        <further-classification edition="202301120260317B">H04N25/771</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山智史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐昇柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SEUNGJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新田嘉一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTA, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種影像感測器及其像素電路的操作方法。在像素電路中，轉移電晶體耦接於光感測元件與浮動擴散部之間。像素電路選擇性操作於低照度感測模式以及高照度感測模式其中一者。當像素電路操作於低照度感測模式時，具有第一準位的控制電壓在積分期間被施加於轉移電晶體的控制端，因此轉移電晶體為截止。當像素電路操作於高照度感測模式時，轉移電晶體的控制端在積分期間被施加具有高於第一準位的第二準位的控制電壓，因而轉移電晶體為截止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an image sensor and an operation method of a pixel circuit thereof. In the pixel circuit, a transfer transistor is coupled between a photosensitive element and a floating diffusion portion. The pixel circuit selectively operates in one of a low illumination sensing mode and a high illumination sensing mode. When the pixel circuit operates in the low illumination sensing mode, a control voltage with a first level is applied to a control terminal of the transfer transistor during an integration period, and therefore the transfer transistor is turned off. When the pixel circuit operates in the high illumination sensing mode, the control terminal of the transfer transistor is applied with the control voltage with a second level higher than the first level during the integration period, and therefore the transfer transistor is turned off.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310、S320、S330、S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2627" publication-number="202628559"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628559.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高速架構的電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE WITH HIGH-SPEED ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">H10B10/00</main-classification>  
        <further-classification edition="202501120251230B">H10D89/10</further-classification>  
        <further-classification edition="200601120251230B">G11C16/06</further-classification>  
        <further-classification edition="200601120251230B">G11C16/32</further-classification>  
        <further-classification edition="200601120251230B">G06F13/14</further-classification>  
        <further-classification edition="200601120251230B">G06F13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里維迪　馬尼什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIVEDI, MANISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛哈　桑迪潘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINHA, SANDIPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里　拉梅什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALLI, RAMESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾希德　塔哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHURSHEED, TAHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置包括一個位元單元、一個讀寫多工器以及一個字線生成塊。該位元單元電性連接在字線和一對位線之間。該位元單元執行讀取操作後接著執行寫入操作。在該讀取操作和該寫入操作之間存在一個間隔期。該讀寫多工器在該讀取操作期間將該成對位線上的位線電壓從操作電壓放電到預定電壓。該讀寫多工器在該間隔期內使該預定電壓浮動。該讀寫多工器在該間隔期後根據寫入該位元單元的資料，將該預定電壓充電到該操作電壓或將該預定電壓放電到接地電壓。該字線生成塊在該間隔期後且該寫入操作執行之前生成一個延遲期。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a bitcell, a read-write multiplexer and a word line generation block. The bitcell is electrically connected between a word line and a pair of bit lines. The bitcell performs a read operation followed by a write operation. There is a gap period between the read operation and the write operation. The read-write multiplexer discharges a bit line voltage on the pair of bit lines from an operating voltage to a predetermined voltage during the read operation. The read-write multiplexer floats the predetermined voltage during the gap period. The read-write multiplexer charges the predetermined voltage to the operating voltage or discharges the predetermined voltage to a ground voltage based on data being written into the bitcell after the gap period. The word line generation block generates a delay period after the gap period and before the write operation is performed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">102:位元單元</p>  
        <p type="p">104:預充電電路</p>  
        <p type="p">106:讀寫多工器</p>  
        <p type="p">108:footer裝置</p>  
        <p type="p">110:寫入驅動器</p>  
        <p type="p">112:第一D鎖存器</p>  
        <p type="p">114:第二D鎖存器</p>  
        <p type="p">116:感測放大器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2628" publication-number="202628848"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628848.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射剝離裝置</chinese-title>  
        <english-title>LASER DEBONGING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P54/20</main-classification>  
        <further-classification edition="202601120260316B">H10P54/90</further-classification>  
        <further-classification edition="201401120260316B">B23K26/57</further-classification>  
        <further-classification edition="200601120260316B">B23K26/073</further-classification>  
        <further-classification edition="201401120260316B">B23K26/082</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＯ科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EO TECHNICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文銀卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, EUN KYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭泰吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, TAI O</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭大鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, DAE HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種將光能傳遞至加工對象物的載體基板與元件之間的離型層並將所述元件自所述載體基板分離的雷射剝離裝置。所揭示的雷射剝離裝置包括：光源，生成雷射光；束整形器，將所述雷射光整形成加工束；以及投射光學系統，將所述加工束投射至所述離型層。所述雷射光為將所述離型層進行光化學分解的紫外脈衝雷射光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:加工對象物</p>  
        <p type="p">100:載台</p>  
        <p type="p">200:光源</p>  
        <p type="p">300:束整形器</p>  
        <p type="p">400:投射光學系統</p>  
        <p type="p">500:控制部</p>  
        <p type="p">L:雷射光</p>  
        <p type="p">PL:加工束</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2629" publication-number="202627278"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627278.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>致動器模組及門</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">E05B47/00</main-classification>  
        <further-classification edition="200601120260330B">E05B15/00</further-classification>  
        <further-classification edition="200601120260330B">E05B65/06</further-classification>  
        <further-classification edition="200601120260330B">E05B63/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美倍亞三美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINEBEA MITSUMI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田裕介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的致動器模組（1000）包括：驅動部（400）；輸出部（OS），將自所述驅動部輸出的動力輸出至外部；第一感測器（611、612），對隨著所述輸出部的旋轉而旋轉的第一旋轉體（G22）的旋轉方向上的位置進行偵測；以及第二感測器（620），對隨著所述輸出部的旋轉而旋轉的第二旋轉體（SG）的旋轉角度進行偵測。所述第一旋轉體的旋轉速度較所述第二旋轉體的旋轉速度小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:框體</p>  
        <p type="p">100a:前表面</p>  
        <p type="p">100in:內部空間</p>  
        <p type="p">200:電路基板</p>  
        <p type="p">300:控制器</p>  
        <p type="p">400:馬達(驅動部)</p>  
        <p type="p">400S:旋轉軸</p>  
        <p type="p">500:動力傳遞部</p>  
        <p type="p">600:感測器群組</p>  
        <p type="p">611:第一光斷續器(第一感測器、光斷續器)</p>  
        <p type="p">612:第二光斷續器(第一感測器、光斷續器)</p>  
        <p type="p">620:電位計(第二感測器)</p>  
        <p type="p">621:第一感測器部</p>  
        <p type="p">622:第二感測器部</p>  
        <p type="p">630:霍爾感測器</p>  
        <p type="p">700:記憶部</p>  
        <p type="p">1000:致動器模組</p>  
        <p type="p">G0:蝸輪</p>  
        <p type="p">G1:第一從動齒輪</p>  
        <p type="p">G2:第二從動齒輪</p>  
        <p type="p">G3:從動齒輪(第三從動齒輪)</p>  
        <p type="p">G4:輸出齒輪</p>  
        <p type="p">G11、G21:大徑齒輪</p>  
        <p type="p">G12:小徑齒輪</p>  
        <p type="p">G22:小徑齒輪(第一旋轉體)</p>  
        <p type="p">OP:開口</p>  
        <p type="p">OS:輸出軸(輸出部)</p>  
        <p type="p">SF&lt;sub&gt;G1&lt;/sub&gt;、SF&lt;sub&gt;G2&lt;/sub&gt;、SF&lt;sub&gt;G3&lt;/sub&gt;:軸</p>  
        <p type="p">SG:感測器齒輪(第二旋轉體)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2630" publication-number="202627990"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627990.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖像處理裝置及圖像處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">G06T7/70</main-classification>  
        <further-classification edition="200601120260401B">G06T1/00</further-classification>  
        <further-classification edition="200601120260401B">B25J13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲垣聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAGAKI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">有關本發明的圖像處理裝置，具備：排列圖像產生部，是將有關對象物的多個攝像圖像排列在單一圖框內，或者將有關對象物的一個攝像圖像、藉由圖像處理從有關對象物之一個攝像圖像所產生的至少一個處理圖像兩者排列在單一圖框內，而產生排列圖像；擷取部，是從排列圖像擷取多個對象物區域；以及整合部，是將被擷取的多個對象物區域，整合為單一整合對象物區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:檢測結果畫面</p>  
        <p type="p">201:區域</p>  
        <p type="p">203:區域</p>  
        <p type="p">205:區域</p>  
        <p type="p">207:區域</p>  
        <p type="p">209:中斷按鈕</p>  
        <p type="p">Po1:左上角位置</p>  
        <p type="p">Po2:右下角位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2631" publication-number="202626585"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626585.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>EUV劑量降低之有機底層及方法</chinese-title>  
        <english-title>ORGANIC UNDERLAYER AND METHODS OF EUV DOSE REDUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C07C69/54</main-classification>  
        <further-classification edition="201201120260319B">G03F1/22</further-classification>  
        <further-classification edition="200601120260319B">G03F7/028</further-classification>  
        <further-classification edition="200601120260319B">G03F7/038</further-classification>  
        <further-classification edition="200601120260319B">G03F7/38</further-classification>  
        <further-classification edition="202601120260319B">H10P50/20</further-classification>  
        <further-classification edition="202601120260319B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商布魯爾科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREWER SCIENCE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王育寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUBAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯威特　丹尼爾　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWEAT, DANIEL PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛倫曼　史戴芬　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANNEMANN, STEPHEN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種在基板上形成微電子結構之方法。該方法包括將底層形成組成物施加至微影堆疊之最上部中間層（若存在）上或施加至基板上以形成底層。該底層形成組成物包括前驅離子化合物，其在施加後烘烤期間產生離子化合物、部分體或兩者。該前驅離子化合物可包括例如具有縮水甘油甲基丙烯酸酯及4-乙烯基吡啶之共聚物。在該底層之上表面上直接施加包含金屬氧化物之EUV敏感性光阻。接著，進行EUV微影術。與使用含金屬氧化物之光阻進行EUV微影術之先前技術方法相比較，此方法可用於實現劑量降低。本文亦揭示使用含金屬氧化物之光阻進行EUV微影術的各種底層形成組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a microelectronic structure on a substrate is disclosed. The method includes applying an underlayer forming composition to an uppermost intermediate layer of a lithography stack, if present, or to the substrate to form an underlayer. The underlayer forming composition includes a pre-ionic compound that generates an ionic compound, moiety, or both during post-application bake. The pre-ionic compound can include, for example, a copolymer having glycidyl methacrylate and 4-vinylpyridine. An EUV-sensitive photoresist comprising a metal-oxide is applied directly on an upper surface of the underlayer. EUV lithography is then performed. This method can be used to achieve dose reduction compared to prior art methods of EUV lithography using metal-oxide containing photoresists. Various underlayer forming compositions for performing EUV lithography using a metal-oxide-containing resist are also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:堆疊</p>  
        <p type="p">12:基板</p>  
        <p type="p">14:表面</p>  
        <p type="p">16:中間層</p>  
        <p type="p">18:底層</p>  
        <p type="p">20:光阻層</p>  
        <p type="p">20':光阻層</p>  
        <p type="p">21:上表面</p>  
        <p type="p">22:遮罩</p>  
        <p type="p">24:曝光部分</p>  
        <p type="p">26:曝光區</p>  
        <p type="p">28:非曝光部分</p>  
        <p type="p">30:未曝光區</p>  
        <p type="p">32:圖案</p>  
        <p type="p">34:溝槽</p>  
        <p type="p">36:凸起特徵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2632" publication-number="202628734"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628734.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面顯示器</chinese-title>  
        <english-title>DUAL-SIDED DISPLAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251212B">H10H29/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹科學園區新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃景亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉家宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, JIA-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃書豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇松宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙面顯示器，包括第一基板、第二基板、電路結構、反射層、多個第一畫素、多個第二畫素以及隔離結構。第二基板重疊於第一基板。電路結構以及反射層分別形成於第一基板以及第二基板之上。各第一畫素包括接合至電路結構的第一發光二極體。電路結構被配置成至少部分遮蔽第一發光二極體朝第一基板發出的光線。各第二畫素包括接合至電路結構的第二發光二極體。反射層被配置成反射第二發光二極體朝第二基板發出的光線。隔離結構形成於第二基板之上。第一畫素以及第二畫素被隔離結構環繞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual-sided display includes a first substrate, a second substrate, a circuit structure, a reflective layer, first pixels, second pixels and an isolation structure. The second substrate overlaps the first substrate. The circuit structure and the reflective layer are formed above the first substrate and the second substrate respectively. Each first pixel includes a first light emitting diode bonded to the circuit structure. The circuit structure is configured to at least partially block light emitted by the first light emitting diode toward the first substrate. Each second pixel includes a second light emitting diode bonded to the circuit structure. The reflective layer is configured to reflect light emitted by the second light emitting diode toward the second substrate. An isolation structure is formed above the second substrate. The first pixels and the second pixels are surrounded by isolation structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:雙面顯示器</p>  
        <p type="p">100:第一基板</p>  
        <p type="p">110:遮蔽層</p>  
        <p type="p">120:緩衝層</p>  
        <p type="p">130:半導體層</p>  
        <p type="p">140:閘介電層</p>  
        <p type="p">150:第一導電層</p>  
        <p type="p">152:閘極</p>  
        <p type="p">154:導電特徵</p>  
        <p type="p">160:介電層</p>  
        <p type="p">170:第二導電層</p>  
        <p type="p">180:層間介電層</p>  
        <p type="p">190:第三導電層</p>  
        <p type="p">192,194:源極/汲極</p>  
        <p type="p">196:導電特徵</p>  
        <p type="p">200:第一平坦化層</p>  
        <p type="p">210:第一絕緣層</p>  
        <p type="p">220:第四導電層</p>  
        <p type="p">230:第二平坦化層</p>  
        <p type="p">240:第二絕緣層</p>  
        <p type="p">250:第五導電層</p>  
        <p type="p">260:第三絕緣層</p>  
        <p type="p">270:第四絕緣層</p>  
        <p type="p">280:第六導電層</p>  
        <p type="p">282:第一接墊</p>  
        <p type="p">284:第二接墊</p>  
        <p type="p">290:第五絕緣層</p>  
        <p type="p">300:第一遮光層</p>  
        <p type="p">300H:第一開口</p>  
        <p type="p">400:第二基板</p>  
        <p type="p">410:第二遮光層</p>  
        <p type="p">410H:第二開口</p>  
        <p type="p">420:隔離結構</p>  
        <p type="p">430:反射層</p>  
        <p type="p">440:封裝層</p>  
        <p type="p">CS:電路結構</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">EMT1:第一電晶體</p>  
        <p type="p">EMT2:第二電晶體</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">LD1:第一發光二極體</p>  
        <p type="p">LD2:第二發光二極體</p>  
        <p type="p">ND:法線方向</p>  
        <p type="p">PC1:第一畫素控制電路</p>  
        <p type="p">PC2:第二畫素控制電路</p>  
        <p type="p">PX1:第一畫素</p>  
        <p type="p">PX2:第二畫素</p>  
        <p type="p">S1,S2:距離</p>  
        <p type="p">TR:透明區</p>  
        <p type="p">X1:第一側</p>  
        <p type="p">X2:第二側</p>  
        <p type="p">θ:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2633" publication-number="202626514"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626514.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146110</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鈦粉末、氧化鈦漿料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260212B">C01G23/04</main-classification>  
        <further-classification edition="200601120260212B">C09C1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千頭英明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIKAMI, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水江圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUE, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾井颯一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OI, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氧化鈦粉末，其藉由氮吸附法測定之BET比表面積為80m&lt;sup&gt;2&lt;/sup&gt;/g以上、未滿300m&lt;sup&gt;2&lt;/sup&gt;/g，藉由粉末X射線繞射法(XRD)測定之結晶相的銳鈦礦含有率為90%以上，且 &lt;br/&gt;　　從藉由脈衝NMR測定使用離子交換水製作之氧化鈦含量為10質量%的混合液之自旋-自旋弛豫響應時間T2的倒數A，及從BET比表面積所算出之A/BET比表面積為2.3×10&lt;sup&gt;-5&lt;/sup&gt;[ms&lt;sup&gt;-1&lt;/sup&gt;/(m&lt;sup&gt;2&lt;/sup&gt;/g)]以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2634" publication-number="202626274"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626274.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保持裝置及用於保持基板之方法</chinese-title>  
        <english-title>RETAINING DEVICES AND METHOD FOR RETAINING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">B25B11/00</main-classification>  
        <further-classification edition="200601120260324B">G02B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾哈邁德　亞席爾阿拉法斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHAMED, YASEER ARAFATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王康康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KANGKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞爾登　班傑明Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIORDON, BENJAMIN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施特拉斯納　詹姆斯Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRASSNER, JAMES D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛迪　魯多維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODET, LUDOVIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的實施例提供了用於保持光學装置的裝置及方法。本文所述的裝置及方法提供用於保持基板，而不接觸基板的敏感部分。該等裝置及方法利用保持墊或真空銷來接觸禁止區，亦即基板的無源區，以保持基板並防止基板橫向移動。此外，保持力在豎直方向上保持基板，而不接觸基板。該等方法提供用於調節裝置以考慮到基板的多種幾何形狀。該等方法進一步提供用於調節裝置，諸如調節光學裝置與抽吸墊之間的間隙，以改變光學裝置上的裝置的保持力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein provide for devices and methods for retaining optical devices. The devices and methods described herein provide for retention of the substrate without contacting sensitive portions of the substrate. The devices and methods utilize retention pads or vacuum pins to contact the exclusion zones i.e., inactive areas of the substrate to retain the substrate and prevent the substrate from moving laterally. Additionally, a holding force retains the substrate in the vertical direction, without contacting the substrate. The methods provide for adjusting the devices to account for multiple geometries of the substrate. The methods further provide for adjusting the devices, such as adjusting a gap between the optical device and a suction pad, to alter the holding force of the devices on the optical devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:保持裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">103:第一表面</p>  
        <p type="p">104:基底板</p>  
        <p type="p">105:第二表面</p>  
        <p type="p">106:桿</p>  
        <p type="p">108:臂</p>  
        <p type="p">109:徑向距離</p>  
        <p type="p">110:抽吸墊</p>  
        <p type="p">111:外邊緣</p>  
        <p type="p">112:保持墊</p>  
        <p type="p">114:接觸墊</p>  
        <p type="p">116:間隙</p>  
        <p type="p">118:入口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2635" publication-number="202627862"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627862.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模擬污染物傳輸之系統與方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR SIMULATING POLLUTANT TRANSPORTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260224B">G06F30/28</main-classification>  
        <further-classification edition="200601120260224B">G01V9/02</further-classification>  
        <further-classification edition="200601120260224B">G01N33/18</further-classification>  
        <further-classification edition="201901120260224B">G16C20/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中央大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖中翊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, ZHONG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁菁萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHING-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHEN-WUING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳琤雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖泓硯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HONG-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種模擬污染物傳輸之系統，其包含導入模組、分析模組、模擬設定模組以及模擬輸出模組。此系統用於因應不同類型之污染物與環境條件，以提供準確之污染物傳輸模擬，且便於在污染控制與環境管理中更準確且即時決策。一種模擬污染物傳輸之方法，其透過此模擬污染物傳輸之系統的各要件以實現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for simulating pollutant transportation includes an import module, an analysis module, a simulation setting module and a simulation output module. The system is used to provide accurate simulation of pollutant transportation by adapting to different types of pollutants and environmental conditions, and is convenient for more accurate and timely decision-making in pollution control and environmental management. A method for simulating pollutant transportation is realized through elements of the system for simulating pollutant transportation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:模擬污染物傳輸之系統</p>  
        <p type="p">100:導入模組</p>  
        <p type="p">200:分析模組</p>  
        <p type="p">300:模擬設定模組</p>  
        <p type="p">400:模擬輸出模組</p>  
        <p type="p">500:顯示模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2636" publication-number="202628446"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628446.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者認證服務</chinese-title>  
        <english-title>USER AUTHENTICATION SERVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260401B">H04W12/06</main-classification>  
        <further-classification edition="202101120260401B">H04W12/04</further-classification>  
        <further-classification edition="200601120260401B">H04L9/32</further-classification>  
        <further-classification edition="201301120260401B">G06F21/31</further-classification>  
        <further-classification edition="201301120260401B">G06F21/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀　凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOO BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫恩　賈福　班德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORN, GAVIN BERNARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席西模普洛斯　哈里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZISIMOPOULOS, HARIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示用於使用者認證的系統及技術。例如，提供一種用於使用者認證的方法。該方法包括：藉由一無線裝置，使用與該無線裝置相關聯的一訂閱憑證，與一無線網路之一服務建立一安全連接；經由該安全連接，針對一使用者認證伺服器向該服務提供一使用者認證註冊請求；及從該服務接收已基於該使用者認證註冊請求成功建立用於使用者認證之一使用者設定檔的一指示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are disclosed for user authentication. For example, a process for user authentication is provided. The process includes: establishing, by a wireless device, a secure connection with a service of a wireless network using a subscription credential associated with the wireless device; providing, for a user authentication server, a user authentication registration request to the service via the secure connection; and receiving, from the service, an indication that a user profile for user authentication was successfully created based on the user authentication registration request.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:無線網路</p>  
        <p type="p">702:無線裝置</p>  
        <p type="p">704:無線節點</p>  
        <p type="p">706:安全性服務</p>  
        <p type="p">708:FIDO伺服器</p>  
        <p type="p">710:UDM</p>  
        <p type="p">712:訂閱及策略服務</p>  
        <p type="p">714:服務存取請求</p>  
        <p type="p">716:服務金鑰請求</p>  
        <p type="p">718:認證及金鑰協議程序</p>  
        <p type="p">720:安全性上下文建立</p>  
        <p type="p">722:服務金鑰回應</p>  
        <p type="p">724:服務安全性</p>  
        <p type="p">726:FIDO註冊請求</p>  
        <p type="p">728:FIDO註冊程序</p>  
        <p type="p">730:註冊</p>  
        <p type="p">732:使用者ID</p>  
        <p type="p">734:FIDO使用者設定檔建立請求</p>  
        <p type="p">736:使用者設定檔建立回應</p>  
        <p type="p">738:使用者設定檔建立結果</p>  
        <p type="p">750:使用者註冊服務</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2637" publication-number="202627805"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627805.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有經串列化冗餘介面的記憶體</chinese-title>  
        <english-title>MEMORY WITH SERIALIZED REDUNDANCY INTERFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G06F11/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　哲民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, CHULMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席司　德瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHETH, DHVANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金瑞希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEOHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科塔　阿尼爾　丘德利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTA, ANIL CHOWDARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有複數個庫的記憶體。一共用冗餘位址解碼器為該等庫之各者解碼一冗餘位址，以將一經解碼冗餘位址提供至各庫。一串列器將該經解碼冗餘位址串列成一經串列經解碼冗餘位址。該等庫將該經串列化經解碼冗餘位址解串列化以回復其等的經解碼冗餘位址。萬一該等庫之一者具有一缺陷，該庫回應於其經解碼冗餘位址藉由重組態其資源而修復該缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory is provided having a plurality of banks. A shared redundancy address decoder decodes a redundancy address for each of the banks to provide a decoded redundancy address to each bank. A serializer serializes the decoded redundancy address into a serialized decoded redundancy address. The banks deserialize the serialized decoded redundancy address to recover their decoded redundancy address. Should one of the banks have a defect, the bank repairs the defect by reconfiguring its resources responsive to its decoded redundancy address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路；系統單晶片(SoC)積體電路</p>  
        <p type="p">105:熔絲解碼器</p>  
        <p type="p">110:第一庫</p>  
        <p type="p">115:第二庫</p>  
        <p type="p">120:第N庫</p>  
        <p type="p">125:共用行冗餘位址解碼器；位址解碼器；解碼器</p>  
        <p type="p">130:串列化器</p>  
        <p type="p">135:熔絲記憶體</p>  
        <p type="p">mem1_fen:冗餘啟用信號</p>  
        <p type="p">mem2_fen:冗餘啟用信號</p>  
        <p type="p">memN_fen:冗餘啟用信號</p>  
        <p type="p">faddr&amp;lt;0：n-1&amp;gt;:n位元行冗餘位址；行冗餘位址</p>  
        <p type="p">fcol&amp;lt;0：2&lt;sup&gt;n-1&lt;/sup&gt;&amp;gt;:經解碼行冗餘位址信號</p>  
        <p type="p">fcol_ser:經串列化經解碼行冗餘位址信號；串列信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2638" publication-number="202626802"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626802.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物及圖案形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08F212/14</main-classification>  
        <further-classification edition="200601120260302B">C08F220/06</further-classification>  
        <further-classification edition="200601120260302B">C08F220/18</further-classification>  
        <further-classification edition="200601120260302B">C08F220/22</further-classification>  
        <further-classification edition="200601120260302B">C08F220/24</further-classification>  
        <further-classification edition="200601120260302B">C08F220/30</further-classification>  
        <further-classification edition="200601120260302B">C08F220/32</further-classification>  
        <further-classification edition="200601120260302B">C08F220/38</further-classification>  
        <further-classification edition="200601120260302B">C08F220/40</further-classification>  
        <further-classification edition="200601120260302B">C08F220/58</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/039</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification>  
        <further-classification edition="200601120260302B">G03F7/32</further-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大宮拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMIYA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錦織克聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKORI, KATSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於圖案形成時可以與先前同等以上的水準發揮感度、CDU、製程窗口及顯影缺陷抑制性的感放射線性組成物及圖案形成方法。一種感放射線性組成物，含有：聚合物、及溶劑，所述聚合物包含：結構單元（I），含有含酯鍵的單環結構；結構單元（II），源自下述式（1）所表示的化合物；以及結構單元（III），具有酚性羥基。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="241px" width="305px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（1）中，Ar&lt;sup&gt;1&lt;/sup&gt;為經取代或未經取代的碳數3～20的一價芳香族基；R&lt;sup&gt;1&lt;/sup&gt;為氫原子或碳數1～20的一價有機基；R&lt;sup&gt;2&lt;/sup&gt;為碳數1～20的一價有機基，或者於R&lt;sup&gt;1&lt;/sup&gt;為氫原子的情況下，R&lt;sup&gt;2&lt;/sup&gt;與Ar&lt;sup&gt;1&lt;/sup&gt;鍵結並與R&lt;sup&gt;2&lt;/sup&gt;所鍵結的碳原子及Ar&lt;sup&gt;1&lt;/sup&gt;一起形成環結構；R&lt;sup&gt;3&lt;/sup&gt;為氫原子、鹵基或碳數1～20的一價有機基；L&lt;sup&gt;1&lt;/sup&gt;為單鍵或二價連結基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2639" publication-number="202628256"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628256.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卡緣連接器組合</chinese-title>  
        <english-title>CARD EDGE CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260317B">H01R12/72</main-classification>  
        <further-classification edition="201101120260317B">H01R12/73</further-classification>  
        <further-classification edition="200601120260317B">H01R31/06</further-classification>  
        <further-classification edition="200601120260317B">H01R13/516</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐國峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, KUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種卡緣連接器組合，包括電子卡、第一卡緣連接器、第二卡緣連接器及轉接器，第一卡緣連接器包括第一插槽及位於第一插槽內的第一端子，第二卡緣連接器包括第二插槽及位於第二插槽內的第二端子，電子卡的左側設有第一金手指，電子卡的右側設有凹口及暴露於凹口的第二金手指，第一金手指插入第一插槽而與第一端子電性連接，第二金手指可以藉由轉接器與第二端子達成電性連接，以保證電流的可靠傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a card edge connector assembly including an electronic card, a first card-edge connector, a second card-edge connector, and an adapter. The first card-edge connector includes a first slot and plural first terminals protruding in the first slot. The second card-edge connector includes a second slot and plural second terminals protruding in the second slot. The electronic card includes a left portion with plural first gold fingers and a right portion having a recess and plural second gold fingers located in the recess. The first gold fingers are inserted into the first slot and are mechanically and electrically connected with the first terminals. The second gold fingers are inserted in the adaptor, and the adapter is inserted in the second slot and the second gold fingers are electrically connected to the second terminals via the adapter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:卡緣連接器組合</p>  
        <p type="p">10:電子卡</p>  
        <p type="p">20:第一卡緣連接器</p>  
        <p type="p">22:第一端子</p>  
        <p type="p">30:第二卡緣連接器</p>  
        <p type="p">40:轉接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2640" publication-number="202626702"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626702.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146310</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GLP-1、GIP及澱粉素受體之三重促效劑及其用途</chinese-title>  
        <english-title>TRI-AGONISTS OF THE GLP-1, GIP, AND AMYLIN RECEPTORS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K14/575</main-classification>  
        <further-classification edition="200601120260401B">C07K14/605</further-classification>  
        <further-classification edition="200601120260401B">C07K19/00</further-classification>  
        <further-classification edition="200601120260401B">A61K38/22</further-classification>  
        <further-classification edition="200601120260401B">A61K38/26</further-classification>  
        <further-classification edition="201701120260401B">A61K47/54</further-classification>  
        <further-classification edition="200601120260401B">A61P3/04</further-classification>  
        <further-classification edition="200601120260401B">A61P3/10</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商諾佛　儂迪克股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVO NORDISK A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯斯　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRUSE, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞　賈斯佩　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAU, JESPER F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥德森　夏洛特　斯塔爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADSEN, CHARLOTTE STAHL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈克維格　克里斯緹娜　蘇菲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAXVIG, CHRISTINA SOPHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種GLP-1/GIP/澱粉素受體三重促效劑，其在所有三種受體之間具有平衡的效力比及/或具有改善的藥物動力學特性。本發明亦提供包含此類GLP-1/GIP/澱粉素受體三重促效劑之醫藥組合物，以及其作為用於治療患有超重、肥胖及相關共病之個體之藥劑的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a GLP-1-/GIP-/amylin-receptor tri-agonist having a balanced potency ratio across all three receptors and/or having improved pharmacokinetic properties. The invention also provides pharmaceutical compositions comprising such a GLP-1-/GIP-/amylin-receptor tri-agonist as well as their use as a medicament for the treatment of subjects with overweight, obesity and associated co-morbidity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2641" publication-number="202627258"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627258.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶舌鉤針</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">D04B35/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商風琴針股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGAN NEEDLE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市川祐次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUJI, ICHIKAWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭秀霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">(課題)&lt;br/&gt; 本發明提供一種帶舌鉤針，其利用與以往不同的方法，能夠防止伴隨紗線滑行而產生的紗線起毛、斷線。&lt;br/&gt;&lt;br/&gt; (解決方法)&lt;br/&gt; 帶舌鉤針（10）安裝在工業用針織機上使用，具備：針主體（11），其在編織時紗線滑行的滑行部（22）形成有針舌支承槽（24）；和針舌（35），其插入於所述針舌支承槽（24），能夠相對於所述針主體（11）轉動地安裝在所述針主體（11），在所述滑行部（22），沿所述針主體（11）的長度方向形成有可保持潤滑油的油槽（30）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:滑行部</p>  
        <p type="p">22a:滑行面</p>  
        <p type="p">22c:側表面</p>  
        <p type="p">23:槽形成部</p>  
        <p type="p">24:針舌支承槽</p>  
        <p type="p">25:非槽形成部</p>  
        <p type="p">30:油槽</p>  
        <p type="p">30a:傾斜部</p>  
        <p type="p">30b:凹狀部</p>  
        <p type="p">31:平坦部</p>  
        <p type="p">32:肩部</p>  
        <p type="p">W1:針主體的厚度</p>  
        <p type="p">W2:除肩部以外的滑行部寬度</p>  
        <p type="p">W3:油槽寬度</p>  
        <p type="p">W4:針舌支承槽的寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2642" publication-number="202628240"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628240.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器模組</chinese-title>  
        <english-title>CONNECTOR MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">H01Q1/22</main-classification>  
        <further-classification edition="200601120260128B">H01Q1/12</further-classification>  
        <further-classification edition="200601120260128B">H01Q1/50</further-classification>  
        <further-classification edition="200601120260128B">H01Q7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商環鴻電子（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEN-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHIH-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉上豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHANG HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種連接器模組，其包含一基板、設置於基板的至少兩個連接器、設置在兩個連接器上的一天線電路板及電性連接於天線電路板與基板之間的一傳輸線。天線電路板的一側具有一天線結構，天線電路板的彼此相反的兩側分別具有兩個第一導電區域及兩個第二導電區域，兩個第一導電區域電性連通，兩個第二導電區域電性連通。所述天線結構包含一耦合環天線，耦合環天線配置為與相鄰的第一導電區域與第二導電區域進行電磁耦合共振，從而接收或傳遞頻率範圍介於3.2GHz至5GHz的信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a connector module, the connector module includes a substrate, at least two connectors that is disposed on the substrate, an antenna circuit board that is disposed on the two connectors, and a transmission line that is electrically connected between the antenna circuit board and the substrate. A side of the antenna circuit board has an antenna structure, the two opposite sides of the antenna circuit board respectively have two first conductive regions and two second conductive regions, the two first conductive regions are electrically connected, and the two second conductive regions are electrically connected. The antenna structure includes a coupling loop antenna, the coupling loop antenna is configured to perform electromagnetic coupling resonance with the adjacent first and second conductive regions, thereby receiving or transmitting signals in the frequency range of 3.2 GHz to 5 GHz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接器模組</p>  
        <p type="p">1:基板</p>  
        <p type="p">2a:連接器</p>  
        <p type="p">2b:連接器</p>  
        <p type="p">3:天線電路板</p>  
        <p type="p">31:天線結構</p>  
        <p type="p">4:傳輸線</p>  
        <p type="p">5a:導電體</p>  
        <p type="p">5b:導電體</p>  
        <p type="p">5c:輔助導電體</p>  
        <p type="p">6:防水構件</p>  
        <p type="p">61:第一殼體</p>  
        <p type="p">62:第二殼體</p>  
        <p type="p">TH:穿孔</p>  
        <p type="p">OP1:開口</p>  
        <p type="p">OP2:開口</p>  
        <p type="p">OP3:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2643" publication-number="202627988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測協同的控制系統及方法</chinese-title>  
        <english-title>CONTROL SYSTEM AND METHOD FOR SENSING COLLABORATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260202B">G06T7/521</main-classification>  
        <further-classification edition="200601120260202B">G06F3/042</further-classification>  
        <further-classification edition="202201120260202B">G01J5/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孟寰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MENG-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉驊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鎮城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUNG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感測協同的控制系統及方法。在方法中，透過處理器自第一影像中偵測目標區域，其中彩色相機取得第一影像，目標區域對應於第一座標資訊。接著，透過處理器將第一座標資訊轉換成第二座標資訊，第二座標資訊對應於飛時測距相機的成像平面。透過處理器自深度資訊取得第二座標資訊對應的深度值，其中飛時測距相機取得深度資訊。透過處理器依據深度值決定目標區域的感測數據。藉此，本發明結合不同感測器之優勢，提升了三維空間中目標定位的精準度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control system and method for sensing collaboration are provided. In the method, a processor detects a target area from a first image, where the first image is captured by a color camera, and the target area corresponds to first coordinate information. The processor converts the first coordinate information into second coordinate information, which corresponds to an imaging plane of a Time of Flight (ToF) camera. The processor obtains a depth value corresponding to the second coordinate information from depth information, wherein the depth information is acquired by the ToF camera. The processor determines sensing data of the target area based on the depth value. Therefore, the present invention combines the advantages of different sensors to improve the accuracy of target positioning in three-dimensional space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2644" publication-number="202626332"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626332.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>片膜用壓印裝置</chinese-title>  
        <english-title>IMPRINT APPARATUS FOR SHEET FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">B29C59/04</main-classification>  
        <further-classification edition="200601120260223B">B29C33/34</further-classification>  
        <further-classification edition="200601120260223B">B29C33/30</further-classification>  
        <further-classification edition="201101120260223B">B82Y40/00</further-classification>  
        <further-classification edition="200601120260223B">G03F7/004</further-classification>  
        <further-classification edition="200601320260223B">B29L7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商吉佳藍科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGALANE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金準基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUN-KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權相珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, SANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜秉柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BYUNG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬香花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, XIANG HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAEHYEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的實施例提供一種片膜用壓印裝置，所述壓印裝置包括：工台，能夠安裝母模或者基板；輥移動單元，包括能夠將所述片膜加壓到所述工台並移動的壓印輥；靜止夾具單元，與所述工台相鄰配置；以及移動夾具單元，附著於所述輥移動單元，並包括能夠移動的移動夾具，其中，所述靜止夾具單元能夠固定所述片膜的第一端部，所述移動夾具能夠固定所述片膜的第二端部，所述移動夾具的移動速度與所述壓印輥的移動速度相對應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:壓印裝置</p>  
        <p type="p">102:裝置台</p>  
        <p type="p">108:工台</p>  
        <p type="p">109:工台上面</p>  
        <p type="p">110:壓印輥</p>  
        <p type="p">112:軌道</p>  
        <p type="p">114:馬達</p>  
        <p type="p">130:輥移動單元</p>  
        <p type="p">134:樹脂固化部</p>  
        <p type="p">136:引導輥</p>  
        <p type="p">140:靜止夾具單元</p>  
        <p type="p">150:移動夾具單元</p>  
        <p type="p">152:移動夾具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2645" publication-number="202627667"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627667.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造光學元件結構之方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING OPTICAL DEVICE STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260323B">G03F1/80</main-classification>  
        <further-classification edition="201201120260323B">G03F1/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇拉克　萊文特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLAK, LEVENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛迪　魯多維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODET, LUDOVIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉伯特　安德烈Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LABONTE, ANDRE P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的實施例提供了形成光學元件結構的方法。該方法利用基板的旋轉來在該基板上形成光學元件結構，並且利用設置在基板及元件層或基板中的一者上的圖案化的光阻劑的蝕刻速率的可調諧性來形成光學元件結構，而無需多個微影圖案化步驟及成角度蝕刻步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein provide for methods of forming optical device structures. The methods utilize rotation of a substrate, to have the optical device structures formed thereon, and tunability of etch rates of a patterned resist disposed over the substrate and one of a device layer or the substrate to form the optical device structures without multiple lithographic patterning steps and angled etch steps.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">102:元件結構</p>  
        <p type="p">106:閃耀元件結構</p>  
        <p type="p">108:閃耀表面</p>  
        <p type="p">110:臺階</p>  
        <p type="p">d:線寬</p>  
        <p type="p">f:刻面法線</p>  
        <p type="p">h:深度</p>  
        <p type="p">γ:閃耀角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2646" publication-number="202626971"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626971.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐寒性聚矽氧組成物</chinese-title>  
        <english-title>COLD-RESISTANT SILICONE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">C08L83/06</main-classification>  
        <further-classification edition="200601120260323B">C08G77/52</further-classification>  
        <further-classification edition="200601120260323B">C09J183/10</further-classification>  
        <further-classification edition="200601120260323B">C08K3/22</further-classification>  
        <further-classification edition="201801120260323B">C08K3/014</further-classification>  
        <further-classification edition="200601120260323B">C08K7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商泰已科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAICA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺見和典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAMI, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種提高導熱性填料等填料材料之分散性並且形成亦兼具極低溫環境下之耐寒性之硬化物的聚矽氧組成物及由該組成物之硬化物所構成之耐寒性聚矽氧構件、耐寒性導熱性聚矽氧構件。&lt;br/&gt; 本發明之耐寒性聚矽氧組成物含有：於分子內含有苯基之聚矽氧聚合物(A)、填料(B)、及於分子內具有環氧基之有機聚矽氧烷(C)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2647" publication-number="202626733"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626733.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146402</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多特異性抗ＴＣＲδ可變１抗體</chinese-title>  
        <english-title>MULTISPECIFIC ANTI-TCR DELTA VARIABLE 1 ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商伽馬三角洲療法有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAMMADELTA THERAPEUTICS LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商Ｆ　星治療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F-STAR THERAPEUTICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芒伍特　娜塔莉　瑪麗安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOUNT, NATALIE MARIANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖娜　米希里班恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNA, MIHRIBAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏丹恩　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UDEN, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧德　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOD, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科克倫　肖娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORCORAN, SHAUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫頓　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUTTON, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班納吉　安塔拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANERJEE, ANTARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞德爾　凱西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIDL, KATHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒羅伊　派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEROY, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希克曼　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HICKMAN, TAYLOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供包含Fab區及Fc區之多特異性抗體，其中該Fab區包含特異於γδ T細胞受體(TCR)之可變δ1 (Vδ1)鏈之抗原決定基之結合位點；且該Fc區包含PD-L1結合位點。本發明亦提供包含此類多特異性抗體之組合物及醫藥組合物，以及製備此類多特異性抗體之方法。本發明亦提供涉及該等多特異性抗體之治療方法及醫療用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides multispecific antibodies comprising a Fab region and an Fc region, wherein the Fab region comprises a binding site specific for an epitope of the variable delta 1 (Vδ1) chain of a γδ T cell receptor (TCR); and the Fc region comprises an PD-L1 binding site. The present invention also provides compositions and pharmaceutical compositions comprising such multispecific antibodies, and methods of making such multispecific antibodies. The present invention also provides methods of treatment and medical uses involving the multispecific antibodies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2648" publication-number="202628433"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628433.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫質調整裝置、畫質調整方法以及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260323B">H04N23/82</main-classification>  
        <further-classification edition="202401120260323B">G06T5/92</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚作一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKA, SAKUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚作一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKA, SAKUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">畫質調整裝置具備：記憶部；以及畫質轉換部，其使用色調曲線來轉換實拍影像的畫質。色調曲線（TC-11～TC-14）是以下曲線：在將亮度的最大值設為1、最小值設為0並進行正規化的情況下，對應於最小值之轉換後影像的正規化亮度值，相較於在輸入軸及輸出軸皆為線性尺度時斜率為1且截距為0的直線之對應於該最小值之值，成為大於該值第一偏移量（OS1）的數值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:畫質調整裝置</p>  
        <p type="p">10:記憶部</p>  
        <p type="p">20:轉換部</p>  
        <p type="p">21:畫質轉換部</p>  
        <p type="p">30:攝像裝置(攝像部)</p>  
        <p type="p">40:顯示裝置(輸出部)</p>  
        <p type="p">50:印刷裝置(輸出部)</p>  
        <p type="p">L:直線</p>  
        <p type="p">OS1:第一偏移量</p>  
        <p type="p">OS2:第二偏移量</p>  
        <p type="p">P1:實拍影像(第一影像)</p>  
        <p type="p">P2:轉換後影像(第二影像)</p>  
        <p type="p">TC:色調曲線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2649" publication-number="202627830"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627830.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>計算系統、計算方法、晶片封裝及運算板</chinese-title>  
        <english-title>COMPUTING SYSTEMS, COMPUTING METHODS, CHIP PACKAGING, AND COMPUTING BOARDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G06F15/16</main-classification>  
        <further-classification edition="200601120251229B">G06F15/163</further-classification>  
        <further-classification edition="201901120251229B">G06F16/25</further-classification>  
        <further-classification edition="200601120251229B">G06F7/523</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海曦智科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI XIZHI TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈亦晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟懷宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, HUAI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張騫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華士躍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, SHI YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種計算系統、計算方法、晶片封裝及運算板。計算系統包括：共用處理單元；多個處理單元，每個所述處理單元電耦合至所述共用處理單元，其中，所述多個處理單元包括第一處理單元以及第二處理單元；多個光計算單元，每個所述光計算單元電耦合至所述共用處理單元，其中，所述多個光計算單元包括第一光計算單元以及第二光計算單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a computing system, a computing method, a chip package, and a computing board. The computing system includes: a common processing unit; a plurality of processing units, each of which being electrically coupled to the common processing unit and the plurality of processing units including a first processing unit and a second processing unit; and a plurality of optical computing units, each of which being electrically coupled to the common processing unit and the plurality of optical computing units including a first optical computing unit and a second optical computing unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:計算系統</p>  
        <p type="p">113a~113d:處理單元</p>  
        <p type="p">121a~121f:光計算單元</p>  
        <p type="p">190:共用處理單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2650" publication-number="202628753"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628753.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有發光裝置與像素透鏡之顯示設備</chinese-title>  
        <english-title>DISPLAY APPARATUS HAVING A LIGHT-EMITTING DEVICE AND A PIXEL LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">H10K50/858</main-classification>  
        <further-classification edition="202301120260102B">H10K50/84</further-classification>  
        <further-classification edition="202401120260102B">B60K35/10</further-classification>  
        <further-classification edition="202401120260102B">B60K35/22</further-classification>  
        <further-classification edition="202401120260102B">B60K35/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳釉鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YOU-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李榮福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOUNG-BOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SE-WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇晳鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KI, SEOK HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提出之顯示設備包含：裝置基板，其上設置有多個像素；第一發光裝置，與包含於各像素之像素區域中的第一發光區域重疊；上屏障圖案，設置在該第一發光裝置上且包含上開口；及像素透鏡，設置在該上屏障圖案上且與該上屏障圖案之該上開口重疊。該第一發光區域可至少部分地與該上屏障圖案之該上開口重疊。虛擬中心線在垂直於該裝置基板朝向該上屏障圖案之方向上穿過該像素透鏡之透鏡中心點，可位於該第一發光區域外部。顯示設備提供給位於相對於顯示面板傾斜之位置的使用者的影像的品質得到改善。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus presented herein includes a device substrate on which a plurality of pixels are disposed, a first light-emitting device overlapping a first emission area included in a pixel area of each pixel, an upper barrier pattern disposed on the first light-emitting device and comprising an upper opening, and a pixel lens disposed on the upper barrier pattern and overlapping the upper opening of the upper barrier pattern. The first emission area can at least partially overlap the upper opening of the upper barrier pattern. A virtual center line passing through a lens central point of the pixel lens in a direction perpendicular to the device substrate toward the upper barrier pattern can be located outside the first emission area. The quality of an image provided by the display apparatus to a user located obliquely with respect to the display panel is improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510h:下開口</p>  
        <p type="p">520h:上開口</p>  
        <p type="p">700:像素透鏡</p>  
        <p type="p">700c:透鏡中心點</p>  
        <p type="p">B-PA:藍色像素區域</p>  
        <p type="p">dd,dx,dy:間距</p>  
        <p type="p">EA1:第一發光區域</p>  
        <p type="p">EA2:第二發光區域</p>  
        <p type="p">G-PA:綠色像素區域</p>  
        <p type="p">PA:像素區域</p>  
        <p type="p">R-PA:紅色像素區域</p>  
        <p type="p">VC’:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2651" publication-number="202627350"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627350.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>照明器具及光源</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">F21S13/02</main-classification>  
        <further-classification edition="201801120260401B">F21S41/141</further-classification>  
        <further-classification edition="200601120260401B">F21V3/02</further-classification>  
        <further-classification edition="201601320260401B">F21Y105/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹田征史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">照明器具（1）具備：基板（15）；複數之固體發光元件，安裝在基板（15）；及1個以上的光學構件（55），配置在複數之固體發光元件所包含的1個以上的前述固體發光元件的光射出側。從1個以上的光學構件（55）射出的1束以上的光，包含在以固體發光元件的光軸為中心軸的情況沿著周向不對稱的光。藉此，可實現容易調整射出光的配光的照明器具（1）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:照明器具</p>  
        <p type="p">10:基座構件</p>  
        <p type="p">10a:基座構件10的下表面</p>  
        <p type="p">40:承受具</p>  
        <p type="p">41:凹孔</p>  
        <p type="p">45:保護蓋板</p>  
        <p type="p">45a:突出部</p>  
        <p type="p">45b:貫通孔</p>  
        <p type="p">55:光學構件</p>  
        <p type="p">80:光源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2652" publication-number="202628709"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628709.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能電池的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING SOLAR CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">H10F71/00</main-classification>  
        <further-classification edition="202501120260318B">H10F10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴權英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KWON YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金正培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUNG-BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種太陽能電池的製造方法，包含藉由在一基板的一個表面的一邊緣上進行一第一圖案化而形成一溝槽的一步驟、在基板的一個表面或另一表面上形成一薄膜層的一步驟以及進行一邊緣切割以沿溝槽切割基板的邊緣的一步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method for manufacturing a solar cell comprising a step of forming a groove by performing a first patterning on an edge of one surface of a substrate, a step of forming a thin film layer on one surface or the other surface of the substrate, and a step of performing an edge cutting to cut the edge of the substrate along the groove.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:導角結構</p>  
        <p type="p">110:太陽能電池</p>  
        <p type="p">120:外側部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2653" publication-number="202627783"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627783.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控感測器驅動電路及包含其之顯示裝置</chinese-title>  
        <english-title>TOUCH SENSOR DRIVING CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G06F3/041</main-classification>  
        <further-classification edition="201601120251229B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成撤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG-CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔南容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, NAMYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金塤培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HOON-BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUN-YEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜成珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SUNG-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控感測器驅動電路包含：驅動電路，用於透過傳輸導線將驅動訊號施加至設置在顯示區域中之第一觸控電極；及感測電路，用於分別透過第一、第二接收導線感測由驅動訊號產生之佈置於顯示區域內之第一、第二區域中之第二觸控電極的電壓。感測電路可對介於透過位於最靠近傳輸導線之相對最外側之傳輸導線的第n接收導線（其中n為自然數）感測到之電壓與第二參考電壓之間的電壓差進行放大或積分，並對介於透過相鄰於第n接收導線之第（n+1）接收導線感測到之電壓與不同於第二參考電壓之第一參考電壓之間的電壓差進行放大或積分。本文亦揭露一種顯示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch sensor driving circuit includes a driving circuit for applying a driving signal to first touch electrodes arranged in a display area through a plurality of TX wires; and a sensing circuit for sensing voltages of second touch electrodes arranged in first and second regions within the display area through first and second RX wires, respectively, the voltages being generated by the driving signal. The sensing circuit may amplify or integrate a voltage difference between a voltage sensed through one nth (where n is a natural number) RX wire positioned closest to TX wires located at opposite outermost sides of the plurality of TX wires and a second reference voltage, and amplify or integrate a voltage difference between a voltage sensed through an (n+1) th RX wire adjacent to the nth RX wire and a first reference voltage different from the second reference voltage. A display device is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AMP:放大器</p>  
        <p type="p">AMP11:第一-第一放大器</p>  
        <p type="p">AMP12:第一-第二放大器</p>  
        <p type="p">Cm,Cm’:邊緣電容</p>  
        <p type="p">DAMP1:第一差動放大器</p>  
        <p type="p">DAMP11:第一-第一差動放大器</p>  
        <p type="p">DAMP12:第一-第二差動放大器</p>  
        <p type="p">DAMP2:第二差動放大器</p>  
        <p type="p">INT:積分器</p>  
        <p type="p">INT11:第一-第一積分器</p>  
        <p type="p">INT12:第一-第二積分器</p>  
        <p type="p">OP1:第一運算放大器</p>  
        <p type="p">OP2:第二運算放大器</p>  
        <p type="p">OP3:第三運算放大器</p>  
        <p type="p">OP4:第四運算放大器</p>  
        <p type="p">OP5:第五運算放大器</p>  
        <p type="p">OP6:第六運算放大器</p>  
        <p type="p">OP7:第七運算放大器</p>  
        <p type="p">R1:第一電阻器</p>  
        <p type="p">R2:第二電阻器</p>  
        <p type="p">R3:第三電阻器</p>  
        <p type="p">R4:第四電阻器</p>  
        <p type="p">R5:第五電阻器</p>  
        <p type="p">R6:第六電阻器</p>  
        <p type="p">RXLn,RXLn+1:接收導線</p>  
        <p type="p">Vref,Vref1,Vref2:參考電壓</p>  
        <p type="p">Vout:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2654" publication-number="202627784"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627784.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可拉伸顯示裝置及觸控顯示裝置</chinese-title>  
        <english-title>STRETCHABLE DISPLAY DEVICE AND TOUCH DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06F3/041</main-classification>  
        <further-classification edition="200601120260202B">G06F3/044</further-classification>  
        <further-classification edition="202301120260202B">H10K59/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳美亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, MI-HYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可拉伸顯示裝置及觸控顯示裝置。可拉伸顯示裝置包含用於顯示影像之顯示面板及設置於顯示面板上之觸控面板。觸控面板包含在第一方向上延伸之第一感測線及在第二方向上延伸之第二感測線。第一感測線及第二感測線具有多個環相互連接之鏈狀，允許該些感測線在維持電性能之同時適應變形。此結構在顯示器被拉伸、彎曲或以其他方式變形時支援可靠之觸控偵測，且可應用於各種可拉伸顯示配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stretchable display device and a touch display device are provided. The stretchable display device includes a display panel for displaying an image and a touch panel disposed over the display panel. The touch panel includes a first sensing line extending in a first direction and a second sensing line extending in a second direction. The first and second sensing lines have a chain shape in which a plurality of rings are connected to each other, allowing the sensing lines to accommodate deformation while maintaining electrical performance. This structure supports reliable touch detection when the display is stretched, bent, or otherwise deformed, and can be applied to various stretchable display configurations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示面板</p>  
        <p type="p">A1:第一區域</p>  
        <p type="p">A2:第二區域</p>  
        <p type="p">A3:第三區域</p>  
        <p type="p">P:像素</p>  
        <p type="p">SP1:第一子像素</p>  
        <p type="p">SP2:第二子像素</p>  
        <p type="p">SP3:第三子像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2655" publication-number="202627730"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627730.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切換式穩壓器及其積體電路</chinese-title>  
        <english-title>SWITCHING REGULATOR AND INTEGRATED CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260113B">G05F1/565</main-classification>  
        <further-classification edition="200601120260113B">H02M3/156</further-classification>  
        <further-classification edition="200601120260113B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托波爾斯基　托德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPORSKI, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拉多　安吉洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALLARDO, ANGELO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了切換式穩壓器及其積體電路。該切換式穩壓器包括輸入端，接收輸入電壓；輸出端，提供輸出電壓；功率級電路，具有耦接在輸入端與開關節點之間的功率開關，其中，基於代表輸出電壓的回饋訊號來控制功率開關；輸出濾波器，耦接在開關節點與輸出端之間，其中，輸出濾波器包括串聯耦接在開關節點與輸出端之間的第一濾波電感器和第二濾波電感器，以及位於第一濾波電感器與第二濾波電感器之間用以改變輸出濾波器的頻率響應的第一補償網路；以及回饋電路，耦接至輸出端以基於輸出電壓來提供回饋訊號；其中，第一補償網路至少包括電容值小於1μF的補償電容器。該切換式穩壓器具有低輸出雜訊，良好的暫態響應效能，並且滿足嚴格的輸出電壓容差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A switching regulator and integrated circuit thereof are disclosed. The switching regulator includes an input terminal configured to receive an input voltage; an output terminal configured to provide an output voltage; a power stage circuit having a power switch coupled between the input terminal and a switch node, where the power switch is controlled based on a feedback signal indicative of the output voltage; an output filter coupled between the switch node and the output terminal, where the output filter includes a first filtering inductor, a second filtering inductor coupled in series between the switch node and the output terminal, and a first compensation network placed between the first filtering inductor and the second filtering inductor to alter the frequency response of the output filter; and a feedback circuit coupled to the output terminal to provide the feedback signal based on the output voltage; where the first compensation network includes at least a compensation capacitor which capacitance is less than 1μF. The switching regulator has a low output noise, a good transient response performance, and can satisfy tight output voltage tolerance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:功率級電路</p>  
        <p type="p">12A:輸出濾波器</p>  
        <p type="p">13:控制電路</p>  
        <p type="p">14:回饋電路</p>  
        <p type="p">101:輸入端</p>  
        <p type="p">102:輸出端</p>  
        <p type="p">121A:濾波器</p>  
        <p type="p">122A:補償電路</p>  
        <p type="p">123A:濾波器</p>  
        <p type="p">200:切換式穩壓器</p>  
        <p type="p">C2:濾波電容器</p>  
        <p type="p">Cc1,Cc2:電容器</p>  
        <p type="p">CP:補償節點</p>  
        <p type="p">L1,L2:濾波電感器</p>  
        <p type="p">PWM:開關控制訊號</p>  
        <p type="p">Rc:電阻器</p>  
        <p type="p">S1,S2:功率開關</p>  
        <p type="p">SW:開關節點</p>  
        <p type="p">Vfb:回饋訊號</p>  
        <p type="p">Vin:輸入電壓</p>  
        <p type="p">Vo:輸出電壓</p>  
        <p type="p">Vref:參考訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2656" publication-number="202626904"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626904.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯的解聚產物以及用於機械化學解聚聚酯的方法</chinese-title>  
        <english-title>DEPOLYMERIZATION PRODUCT OF POLYESTER AND METHOD FOR MECHANICAL-CHEMICALLY DEPOLYMERIZING POLYESTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J11/06</main-classification>  
        <further-classification edition="200601120260401B">C08J11/12</further-classification>  
        <further-classification edition="200601120260401B">C08J11/16</further-classification>  
        <further-classification edition="200601120260401B">B29B17/04</further-classification>  
        <further-classification edition="200601120260401B">C07C29/09</further-classification>  
        <further-classification edition="200601120260401B">C07C31/20</further-classification>  
        <further-classification edition="200601120260401B">C07C51/41</further-classification>  
        <further-classification edition="200601120260401B">C07C63/28</further-classification>  
        <further-classification edition="200601120260401B">C08L67/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商可隆工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLON INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙慧琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HAELIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東殷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慶忠顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GYOUNG, CHUNG-HYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WON HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於聚酯的解聚產物以及用於機械化學解聚聚酯的方法。聚酯的解聚產物包括0 wt%至10 wt%的未分解聚酯；60 wt%至99 wt%的二元酸；1 wt%至25 wt%的亞烷基二醇；以及0 wt%至15 wt%的未反應分解劑、雜質、或其組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a depolymerization product of polyester and a method for mechanical-chemically depolymerizing a polyester. The depolymerization product of the polyester includes 0 wt% to 10 wt% of an undecomposed polyester; 60 wt% to 99 wt% of a dibasic acid; 1 wt% to 25 wt% of alkylene glycol; and 0 wt% to 15 wt% of an unreacted decomposing agent, impurities, or a combination thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:解聚反應器</p>  
        <p type="p">100:反應部分</p>  
        <p type="p">110:反應部主體</p>  
        <p type="p">120:圓盤旋轉軸</p>  
        <p type="p">130:圓盤</p>  
        <p type="p">140:刀片部分支撐部</p>  
        <p type="p">150:刀片部分</p>  
        <p type="p">200:原料進料裝置</p>  
        <p type="p">300:分解劑進料裝置</p>  
        <p type="p">310:泵浦</p>  
        <p type="p">400:氮氣供應裝置</p>  
        <p type="p">500:排放槽</p>  
        <p type="p">510:排放管</p>  
        <p type="p">520:排氣管</p>  
        <p type="p">530:螺旋輸送機</p>  
        <p type="p">540:螺桿馬達</p>  
        <p type="p">600:乾燥機</p>  
        <p type="p">700:冷凝器</p>  
        <p type="p">800:主馬達</p>  
        <p type="p">810:馬達旋轉軸</p>  
        <p type="p">820:旋轉皮帶</p>  
        <p type="p">830:框架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2657" publication-number="202626005"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626005.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成根管黏合劑之牙科產品</chinese-title>  
        <english-title>DENTAL PRODUCT FOR FORMING AN ENDODONTIC CEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260401B">A61K6/858</main-classification>  
        <further-classification edition="202001120260401B">A61K6/54</further-classification>  
        <further-classification edition="202001120260401B">A61K6/878</further-classification>  
        <further-classification edition="202001120260401B">A61K6/887</further-classification>  
        <further-classification edition="200601120260401B">A61P1/02</further-classification>  
        <further-classification edition="201701120260401B">A61C5/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商艾龍製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACTEON MANUFACTURING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆雷特　露西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOULET, LUCIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李維瑞斯　艾里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIVIERES, ELISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛瑞特　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAURAT, VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於在牙管中形成根管黏合劑之牙科產品，該產品包括至少： &lt;br/&gt;-質量含量大於或等於20%之丙二醇， &lt;br/&gt;-能夠在水分存在下形成羥磷灰石之磷酸二鈣及磷酸四鈣之混合物，此混合物係以34%與40%之間之質量含量存在， &lt;br/&gt;-質量含量在1%與4%之間之黏結劑， &lt;br/&gt;-質量含量大於或等於20%之氧化鋯不透射線顯影劑，及 &lt;br/&gt;-質量含量在0.1%與0.38%之間之檸檬酸鉀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a dental product for forming an endodontic cement in a dental canal, said product comprising at least: &lt;br/&gt;- propylene glycol in a mass content greater than or equal to 20%, &lt;br/&gt;- a mixture of dicalcium phosphate and tetracalcium phosphate capable of forming hydroxyapatite in the presence of moisture, this mixture being present in a mass content of between 34% and 40%, &lt;br/&gt;- a binder in a mass content of between 1% and 4%, &lt;br/&gt;- a zirconium oxide radiopaque contrast agent in a mass content greater than or equal to 20%, and &lt;br/&gt;- potassium citrate in a mass content of between 0.1% and 0.38%.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2658" publication-number="202626881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護膜形成用組成物及半導體基板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08G77/14</main-classification>  
        <further-classification edition="200601120260302B">C08G77/26</further-classification>  
        <further-classification edition="200601120260302B">C08G77/28</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/075</further-classification>  
        <further-classification edition="200601120260302B">G03F7/11</further-classification>  
        <further-classification edition="202601120260302B">H10P14/60</further-classification>  
        <further-classification edition="202601120260302B">H10P14/68</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="202601120260302B">H10P50/28</further-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification>  
        <further-classification edition="202601120260302B">H10P76/20</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平林洋紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRABAYASHI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬古智昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKO, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木彩夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, AYAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳孝典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGI, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋爪希美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIZUME, NOZOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種保存穩定性及塗敷膜的去除性良好、且保護膜的耐蝕刻液性優異的保護膜形成組成物及半導體基板的製造方法。一種保護膜形成組成物，為半導體基板周緣部的保護膜形成用組成物，其含有聚矽氧烷以及溶媒，所述聚矽氧烷具有下述式（1）所表示的第一結構單元。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="246px" width="353px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（所述式（1）中，X為下述式（1-1）～式（1-9）中的任一者所表示的一價基；a為1～3的整數；於a為2以上的情況下，多個X相同或不同；R&lt;sup&gt;1&lt;/sup&gt;為碳數1～20的一價有機基、羥基或鹵素原子；b為0～2的整數；於b為2的情況下，兩個R&lt;sup&gt;1&lt;/sup&gt;相互相同或不同；其中，a+b為3以下） &lt;br/&gt;&lt;img align="absmiddle" height="38px" width="71px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="872px" width="372px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2659" publication-number="202626734"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626734.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異二聚體抗體、其製備方法及應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07K16/46</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸亞敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張正平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHENGPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　維剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊俊華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬子蘊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, ZIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬於生物醫藥領域，涉及含異二聚體抗體、用於製備此類異二聚體抗體的方法、以及此類抗體在製備治療腫瘤及自身免疫病的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2660" publication-number="202628058"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628058.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146786</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板及修復方法</chinese-title>  
        <english-title>DISPLAY PANEL AND METHOD FOR REPAIRING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251217B">G09G3/3233</main-classification>  
        <further-classification edition="202301120251217B">H10K59/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金元頭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, WONDOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田承峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, SEUNG JOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種顯示面板，此顯示面板可包含彼此間隔開且其間具有像素之第一及第二驅動電壓線、配置以連接第一驅動電壓線及第二驅動電壓線之多個驅動電壓連接圖案、及與第一及第二驅動電壓線相交之多個閘極線。此處，該些閘極線可包含至少一條閘極線，此閘極線包含一斷開部分，且多個驅動電壓連接圖案可包含配置以連接至少一條閘極線之斷開部分之修復圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a display panel. The display panel according to an embodiment of the present disclosure includes a first driving voltage line and a second driving voltage line spaced apart from each other with a pixel therebetween; a plurality of driving voltage connection patterns configured to connect the first and second driving voltage lines; and a plurality of gate lines that intersect the first and second driving voltage lines, wherein the plurality of gate lines include at least one gate line including an open portion, and wherein the plurality of driving voltage connection patterns include a repair pattern configured to connect the open portion of the at least one gate line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">GL1_1,GL2_1:第一層</p>  
        <p type="p">OP:斷開部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2661" publication-number="202626605"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626605.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜環化合物及其作為ＷＲＮ解旋酶抑制劑的用途</chinese-title>  
        <english-title>HETEROCYCLIC COMPOUNDS AND THEIR USE AS WRN HELICASE INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D213/63</main-classification>  
        <further-classification edition="200601120260401B">C07D401/04</further-classification>  
        <further-classification edition="200601120260401B">C07D405/04</further-classification>  
        <further-classification edition="200601120260401B">C07D409/04</further-classification>  
        <further-classification edition="200601120260401B">C07D413/04</further-classification>  
        <further-classification edition="200601120260401B">C07D403/04</further-classification>  
        <further-classification edition="200601120260401B">C07D487/08</further-classification>  
        <further-classification edition="200601120260401B">C07D239/47</further-classification>  
        <further-classification edition="200601120260401B">C07D401/14</further-classification>  
        <further-classification edition="200601120260401B">C07D239/34</further-classification>  
        <further-classification edition="200601120260401B">C07D498/08</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4412</further-classification>  
        <further-classification edition="200601120260401B">A61K31/444</further-classification>  
        <further-classification edition="200601120260401B">A61K31/506</further-classification>  
        <further-classification edition="200601120260401B">A61K31/443</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4436</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4545</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/496</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商來凱製藥（寧波）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAEKNA PHARMACEUTICAL NINGBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厲銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張敏華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MINHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUNYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧　祥巨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, XIANGJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了作為沃納綜合症RecQ DNA解旋酶(WRN)抑制劑的特定雜環化合物，例如式(I)的化合物，包含這些化合物的藥物組合物，以及這些化合物或藥物組合物在治療疾病或障礙中的使用方法。 &lt;br/&gt;&lt;img align="absmiddle" height="143px" width="164px" file="ed10913.JPG" alt="ed10913.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are certain heterocyclic compounds, such as a compound of Formula (I), as Werner Syndrome RecQ DNA helicase (WRN) inhibitors, pharmaceutical compositions comprising the compounds, and method of use of the compounds or pharmaceutical compositions in the treatment of diseases or disorders. &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="176px" file="ed10914.JPG" alt="ed10914.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2662" publication-number="202628769"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628769.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251205B">H10K59/131</main-classification>  
        <further-classification edition="202301120251205B">H10K50/805</further-classification>  
        <further-classification edition="202301120251205B">H10K50/844</further-classification>  
        <further-classification edition="202301120251205B">H10K50/87</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金會龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HOE YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔基敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, KI MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種顯示面板，這種顯示面板可包含：基板；設置於基板之第一側之接墊；設置於基板上且電性連接至接墊之低電位電壓圖案；設置於低電位電壓圖案上之導電封裝層；及用於電性連接低電位電壓圖案與導電封裝層之連接結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a display panel. The display panel according to an embodiment of the present disclosure includes a substrate; a pad arranged at a first side of the substrate; a low-potential voltage pattern arranged on the substrate and electrically connected to the pad; a conductive encapsulation layer arranged on the low-potential voltage pattern; and a connection structure configured to electrically connect the low-potential voltage pattern and the conductive encapsulation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:第一緩衝層</p>  
        <p type="p">30:絕緣層</p>  
        <p type="p">31:連接圖案</p>  
        <p type="p">50:覆蓋層</p>  
        <p type="p">50a,50b,50c,50d:第一層</p>  
        <p type="p">60:堤岸</p>  
        <p type="p">60a,60b,60c,60d:第二層</p>  
        <p type="p">70:封裝層</p>  
        <p type="p">71:絕緣封裝層</p>  
        <p type="p">73:導電封裝層</p>  
        <p type="p">81:第一電極</p>  
        <p type="p">81a:金屬圖案</p>  
        <p type="p">81b:連接電極</p>  
        <p type="p">81c:散熱電極</p>  
        <p type="p">85:第二電極</p>  
        <p type="p">85a:陰極電極延伸部分</p>  
        <p type="p">AA:顯示區域</p>  
        <p type="p">C:電容器</p>  
        <p type="p">CM:連接構件</p>  
        <p type="p">CT1:第一接觸部分</p>  
        <p type="p">CT2:第二接觸部分</p>  
        <p type="p">D1:第一堤壩</p>  
        <p type="p">D2:第二堤壩</p>  
        <p type="p">D3:第三堤壩</p>  
        <p type="p">D4:第四堤壩</p>  
        <p type="p">D5:第五堤壩</p>  
        <p type="p">NA1:第一周邊區域</p>  
        <p type="p">NA2:第二周邊區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2663" publication-number="202627407"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627407.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146830</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測量電子裝置製造機器中的移動葉片上的產品的性質的方法及系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS TO MEASURE PROPERTIES OF PRODUCTS ON A MOVING BLADE IN ELECTRONIC DEVICE MANUFACTURING MACHINES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">G01B11/00</main-classification>  
        <further-classification edition="200601120260319B">G01N21/47</further-classification>  
        <further-classification edition="200601120260319B">G01N21/93</further-classification>  
        <further-classification edition="202601120260319B">H10P74/00</further-classification>  
        <further-classification edition="202601120260319B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊根　陶德Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAN, TODD J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛許　艾菲雪克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, AVISHEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布迪亞多　愛德華Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUDIARTO, EDWARD W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　國衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GUOHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示的實施方案描述一種光學檢驗裝置，包含：光源，用於將光束引導到晶圓的表面上的部位，晶圓從處理腔室進行運輸，其中光束用於產生反射光；光學感測器，用於收集表示第一反射光的方向的第一資料，收集表示複數個值的第二資料，複數個值的特徵在於複數個波長中的對應一個波長處的反射光的強度；以及處理裝置，與光學感測器通訊，用於使用第一資料確定晶圓的表面的位置；檢索校準資料；以及使用晶圓的表面的位置、第二資料、及校準資料，確定表示晶圓的品質的特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations disclosed describe an optical inspection device comprising a source of light to direct a light beam to a location on a surface of a wafer, the wafer being transported from a processing chamber, wherein the light beam is to generate, a reflected light, an optical sensor to collect a first data representative of a direction of the first reflected light, collect a second data representative of a plurality of values characterizing intensity of the reflected light at a corresponding one of a plurality of wavelengths, and a processing device, in communication with the optical sensor, to determine, using the first data, a position of the surface of the wafer; retrieve calibration data, and determine, using the position of the surface of the wafer, the second data, and the calibration data, a characteristic representative of a quality of the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:機械葉片</p>  
        <p type="p">112:晶圓</p>  
        <p type="p">114:測量頭</p>  
        <p type="p">510:測量部位</p>  
        <p type="p">550:實施方案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2664" publication-number="202628597"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628597.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻變式記憶體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260112B">H10B63/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廈門半導體工業技術研發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱泰瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TAI WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈鼎瀛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, TING YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李武新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種阻變式記憶體，包括：基板和位於基板上的阻變結構，所述阻變結構包括依次層疊設置的：第一電極、阻變層、氧反應層和第二電極；所述阻變層具有主體部和凸起部，所述凸起部與所述第一電極抵接，所述主體部與所述氧反應層抵接，所述凸起部的寬度小於所述主體部的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">101:底電極、下電極</p>  
        <p type="p">102:阻變層</p>  
        <p type="p">1021:主體部</p>  
        <p type="p">1022:凸起部</p>  
        <p type="p">103:頂電極、上電極</p>  
        <p type="p">104:氧反應層</p>  
        <p type="p">105:側壁保護層</p>  
        <p type="p">106:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2665" publication-number="202628813"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628813.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146868</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>重摻雜P型矽片矽片體缺陷的量測方法、獲取矽片生長矽片體缺陷熱處理最優條件的方法、系統及電腦可讀取紀錄媒體</chinese-title>  
        <english-title>METHOD FOR MEASURING BMD OF A HEAVILY DOPED P-TYPE SILICON WAFER, METHOD, SYSTEM AND COMPUTER READABLE MEDIUM FOR OBTAINING OPTIMIZED CONDITIONS OF HEAT TREATMENT GROWING BMD IN WAFERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P36/20</main-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification>  
        <further-classification edition="200601120260302B">G01N21/88</further-classification>  
        <further-classification edition="200601120260302B">C30B33/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海新昇半導體科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZING SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳微微</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬靜如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種重摻雜P型矽片BMD的量測方法、獲取矽片生長BMD熱處理最優條件的方法、系統及電腦可讀取紀錄媒體，屬於半導體領域。該重摻雜P型矽片BMD的量測方法包括提供若干重摻雜P型矽片，將所述矽片在有氧條件下進行兩段熱處理，包括於第一設定溫度下熱處理第一設定時間，並隨後以設定的升溫速率加熱至第二設定溫度，於第二設定溫度條件下，加熱處理第二設定時間，以在所述矽片生長BMD。將生長有BMD的矽片清洗處理。對矽片進行量測，獲取所述矽片BMD的密度和大小。本發明通過對矽片能夠形成最大BMD密度進行一個相對準確的定量，以評估重摻雜P型矽片的特性，對後道加工工藝具有指導性意義。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a method of measuring BMD of a heavily doped P-type silicon wafer, method, system and computer readable medium for obtaining optimized conditions of heat treatment growing BMD in wafers, belong to semiconductor technical field. The method of measuring BMD of a heavily doped P-type silicon wafer comprises providing several heavily doped P-type silicon wafers, perform two-stage heat treatment, comprising performing heat treatment at a first predetermined temperature for a first predetermined time period, heating to a second predetermined temperature with a predetermined temperature rising speed, and performing heat treatment at a second predetermined temperature for a second predetermined time period to grow BMD in the silicon wafer. The silicon wafer grown with BMD is then be washed. The silicon wafer is measured to get density and size of the BMD therein. The present invention facilitates relatively precise quantitative analysis through maximum density of BMD in the silicon wafer to evaluate characteristics of the heavily doped P-type silicon wafer, as a guidance for the processing means performed later on.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11、S12、S13、S41:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2666" publication-number="202626797"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626797.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146877</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組合物、層間絕緣膜及其製造方法、以及顯示元件</chinese-title>  
        <english-title>RADIATION-SENSITIVE COMPOSITION, INTERLAYER INSULATING FILM AND MANUFACTURING METHOD THEREOF, AND DISPLAY ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F212/08</main-classification>  
        <further-classification edition="200601120260401B">C08F212/12</further-classification>  
        <further-classification edition="200601120260401B">C08F212/14</further-classification>  
        <further-classification edition="200601120260401B">C08F222/40</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/022</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="200601120260401B">H01B3/44</further-classification>  
        <further-classification edition="200601120260401B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金森進太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAMORI, SHINTAROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本律</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, RITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可形成放射線感度高、乾式蝕刻耐性、透明性優異的硬化膜的感放射線性組合物、由所述組合物形成的層間絕緣膜、包括所述層間絕緣膜的顯示元件、以及層間絕緣膜的製造方法。本發明涉及一種感放射線性組合物，含有：鹼可溶性聚合物（A）（將下述聚合物（C）除外）；醌二疊氮化合物（B）；聚合物（C），含有下述式（1）所表示的結構單元（V）、及源自選自由馬來醯亞胺、N-取代馬來醯亞胺及馬來酸酐所組成的群組中的至少一種化合物的結構單元（VI），相對於構成聚合物（C）的全部結構單元，所述結構單元（V）與結構單元（VI）的合計含量為55質量%以上；以及溶劑（S）。 &lt;br/&gt;&lt;img align="absmiddle" height="46px" width="67px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="246px" width="411px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2667" publication-number="202627020"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627020.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著片、積層片及顯示器</chinese-title>  
        <english-title>ADHESIVE SHEETS, LAMINATED SHEETS AND DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C09J133/10</main-classification>  
        <further-classification edition="200601120260326B">C09J183/14</further-classification>  
        <further-classification edition="200601120260326B">C08F2/06</further-classification>  
        <further-classification edition="201801120260326B">C08K3/011</further-classification>  
        <further-classification edition="201801120260326B">C09J7/40</further-classification>  
        <further-classification edition="200601120260326B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石智文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, MOTOFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在反覆屈曲及長時間的屈曲狀態的保持中抑制從被黏物的剝離及氣泡的黏著片、積層片及顯示器。一種黏著片，由包含(甲基)丙烯酸樹脂（a）、與矽酮寡聚物（s1）及矽酮寡聚物衍生物（s2）中的至少一者的黏著劑組合物形成，且滿足（i）、（ii）及（iiia）。 &lt;br/&gt;（i）霧度值小於1.5%。 &lt;br/&gt;（ii）25℃下的對於玻璃板的黏著力為3 N/25 mm以上。 &lt;br/&gt;（iiia）-20℃下的剪切儲存彈性模量小於500 kPa。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:黏著片</p>  
        <p type="p">2:第一隔膜</p>  
        <p type="p">3:第二隔膜</p>  
        <p type="p">10:積層片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2668" publication-number="202626124"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626124.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有安全特徵之自動注射器</chinese-title>  
        <english-title>AUTO INJECTORS WITH SAFETY FEATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A61M5/20</main-classification>  
        <further-classification edition="200601120260330B">A61M5/315</further-classification>  
        <further-classification edition="200601120260330B">A61M5/24</further-classification>  
        <further-classification edition="200601120260330B">A61M5/50</further-classification>  
        <further-classification edition="200601120260330B">A61M5/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商沙利工程塑膠有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAILY ENGINEERING PLASTICS LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾恩斯　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILNES, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿什福德　亞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHFORD, ARCHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾爾斯　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOWLES, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴夫薩爾　金賈爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHAVSAR, KINJAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動注射器包含殼體2及承載針頭6之注射器組件4。一扭力彈簧8經配置以促使驅動器10旋轉，該驅動器控制藥物之遞送。偏壓構件60經配置以在藥物遞送完成時相對於殼體2縮回注射器組件4及驅動器10。在縮回期間，該扭力彈簧8繼續作用於驅動器10並促使驅動器10之鎖定元件94抵靠固定之縱向導引元件90。在縮回結束時，該鎖定元件94到達該導引元件90之端部並卡扣於凸緣92後方，藉此防止驅動器10及注射器組件4再次推進。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An auto injector comprises a housing 2 and a syringe assembly 4 that carries a needle 6. A drive spring 8 is configured to urge a driver 10 to rotate, which controls delivery of a drug. Biasing means 60 are configured to retract the syringe assembly 4 and the driver 10 relative to the housing 2 when drug delivery is complete. During retraction, the drive spring 8 continues to act on the driver 10 and urges a latching element 94 of the driver 10 to bear against a fixed, longitudinal guide element 90. At the end of retraction, the latching element 94 reaches the end of the guide element 90 and snaps behind a ledge 92, whereby the driver 10 and the syringe assembly 4 are prevented from advancing again.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:驅動器</p>  
        <p type="p">12:按鈕</p>  
        <p type="p">62:鎖定轉盤</p>  
        <p type="p">8:扭力彈簧</p>  
        <p type="p">90:導引元件</p>  
        <p type="p">92:凸緣</p>  
        <p type="p">94:鎖定元件</p>  
        <p type="p">96:擋止表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2669" publication-number="202626125"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626125.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動注射器之功能順序</chinese-title>  
        <english-title>FUNCTIONAL SEQUENCING OF AUTO INJECTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A61M5/20</main-classification>  
        <further-classification edition="200601120260330B">A61M5/315</further-classification>  
        <further-classification edition="200601120260330B">A61M5/24</further-classification>  
        <further-classification edition="200601120260330B">A61M5/50</further-classification>  
        <further-classification edition="200601120260330B">A61M5/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商沙利工程塑膠有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAILY ENGINEERING PLASTICS LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾恩斯　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILNES, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿什福德　亞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHFORD, ARCHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾爾斯　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOWLES, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴夫薩爾　金賈爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHAVSAR, KINJAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動注射器包括殼體2及攜帶針6之注射器組件4。驅動彈簧8配置為促使驅動器10旋轉，該驅動器經由第一螺紋連接50、內螺紋51驅動柱塞14以通過針6遞送藥物，直至該第一螺紋連接用盡為止。呈外螺紋之第二螺紋連接54、短內螺紋55將驅動器10耦合至注射器組件4，且呈外螺紋之第三螺紋連接65、內部部分螺紋66將驅動器耦合至殼體2。壓縮彈簧60在藥物遞送完成且呈外螺紋之第三螺紋連接65、內部部分螺紋66用盡時縮回注射器組件4及驅動器10。相應螺紋之長度使得在驅動器10旋轉期間，第一螺紋連接50、內螺紋51在呈外螺紋之第三螺紋連接65、內部部分螺紋66用盡之前用盡。可存在環繞柱塞14之圓周之間隙88，位於第一螺紋連接50、內螺紋51之近端處，以在它們之間的第一螺紋連接50、內螺紋51已脫離之後容納相應部件之間的持續相對旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An auto injector comprises a housing 2 and a syringe assembly 4 that carries a needle 6. A drive spring 8 is configured to urge a driver 10 to rotate, which via a first threaded connection 50,51 drives a plunger 14 to deliver a drug through the needle 6 until the first threaded connection runs out. A second threaded connection 54,55 couples the driver 10 to the syringe assembly 4 and a third threaded connection 65,66 couples the driver to the housing 2. Biasing means 60 retract the syringe assembly 4 and the driver 10 when drug delivery is complete and the third threaded connection 65,66 runs out. The lengths of the respective threads are such that, during rotation of the driver 10, the first threaded connection 50,51 runs out before the third threaded connection 65,66 runs out. There may be a gap 88 about the circumference of the plunger 14 at a proximal end of the first threaded connection 50,51 to accommodate continuing relative rotation between the respective parts after the first threaded connection 50,51 between them has disengaged.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:柱塞</p>  
        <p type="p">44:臂</p>  
        <p type="p">6:針</p>  
        <p type="p">60:壓縮彈簧</p>  
        <p type="p">65:第三螺紋連接</p>  
        <p type="p">66:內部部分螺紋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2670" publication-number="202626126"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626126.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>於蓋帽移除時防止自動注射器啟動</chinese-title>  
        <english-title>PREVENTING AUTO INJECTOR ACTIVATION DURING CAP REMOVAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A61M5/20</main-classification>  
        <further-classification edition="200601120260330B">A61M5/315</further-classification>  
        <further-classification edition="200601120260330B">A61M5/24</further-classification>  
        <further-classification edition="200601120260330B">A61M5/50</further-classification>  
        <further-classification edition="200601120260330B">A61M5/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商沙利工程塑膠有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAILY ENGINEERING PLASTICS LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米爾恩斯　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILNES, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿什福德　亞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHFORD, ARCHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾爾斯　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNOWLES, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴夫薩爾　金賈爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHAVSAR, KINJAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動注射器包含一外殼2、一可旋轉驅動件10及一具有坡道28之軸向可滑動注射器組件4。當使用者按壓按鈕12以致動裝置時，驅動件10在驅動彈簧8之力下旋轉並作用於坡道28以推進注射器組件4。注射器組件4及驅動件10包含相互面向之止擋面99、101，其在驅動件10處於初始位置時接合以防止注射器組件4在裝置致動前推進，特別是當端蓋7被移除時。止擋面99、101可以大於或等於坡道28之角度之角度傾斜以避免在裝置被致動時干擾注射器組件4之推進。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An auto injector comprises a housing 2, a rotatable driver 10 and an axially slidable syringe assembly 4 with ramps 28. When the user presses a button 12 to actuate the device, the driver 10 rotates under the force of a drive spring 8 and acts on the ramps 28 to advance the syringe assembly 4. The syringe assembly 4 and the driver 10 comprise mutually facing stop surfaces 99,101, which engage when the driver 10 is in an initial position to prevent the syringe assembly 4 advancing before the device is actuated, in particular when an end cap 7 is removed. The stop surfaces 99,101 may be inclined at an angle greater than or equal to the angle of the ramps 28 to avoid interfering with the advancement of the syringe assembly 4 when the device is actuated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:驅動件</p>  
        <p type="p">100:突出部</p>  
        <p type="p">101:止擋面</p>  
        <p type="p">2:外殼</p>  
        <p type="p">26:連接管</p>  
        <p type="p">28:坡道</p>  
        <p type="p">56:凸緣</p>  
        <p type="p">62:鎖定轉盤</p>  
        <p type="p">72:按鈕臂</p>  
        <p type="p">76:止擋面</p>  
        <p type="p">78:止擋面</p>  
        <p type="p">98:凹部</p>  
        <p type="p">99:止擋面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2671" publication-number="202626836"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626836.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146972</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、液晶配向膜、液晶元件及液晶元件的製造方法、以及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C08G59/16</main-classification>  
        <further-classification edition="200601120260102B">C08G65/26</further-classification>  
        <further-classification edition="200601120260102B">C08G73/10</further-classification>  
        <further-classification edition="200601120260102B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村達哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安池伸夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUIKE, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野龍蔵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OONO, RYUUZOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, MEGUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝井宏充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSUI, HIROMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可在良好地保持液晶分子的配向均勻性的同時實現液晶元件的低電壓驅動化的液晶配向劑。一種液晶配向劑，含有化合物（Q），所述化合物（Q）是具有選自由氧雜環丙基及氧雜環丁基所組成的群組中的至少一種的化合物（E）、與具有能夠與氧雜環丙基或氧雜環丁基反應的官能基的反應性化合物的反應產物。化合物（E）的分子量為1,000以下，且在一分子內具有多個選自由氧雜環丙基及氧雜環丁基所組成的群組中的至少一種，或者在一分子內具有各一個氧雜環丙基或氧雜環丁基以及聚合性碳-碳不飽和鍵基。反應性化合物包含化合物（R1），所述化合物（R1）在一分子內具有一個能夠與氧雜環丙基或氧雜環丁基反應的官能基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2672" publication-number="202628898"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628898.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147001</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260310B">H10P72/30</main-classification>  
        <further-classification edition="202601120260310B">F26B21/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒枝篤史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROEDA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種可降低基板污染之可能性之技術。 &lt;br/&gt;基板處理裝置具備上游腔室(例如局部搬送腔室21)、上游壓力調整部(例如第2壓力調整部25)、乾燥處理腔室31、搬送部(例如局部搬送部22)、及控制部。乾燥處理腔室31經由第1閘(例如搬送處理閘GTP)連接於上游腔室。搬送部通過打開狀態之第1閘，於上游腔室與乾燥處理腔室31之間搬送基板W。控制部控制上游壓力調整部，於將上游腔室內之壓力設為高於乾燥處理腔室31內之壓力之第1壓力值之狀態下，打開第1閘，控制搬送部而搬送基板W，且於關閉第1閘之狀態下，控制上游壓力調整部，使上游腔室內之壓力降低至低於第1壓力值之第2壓力值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:乾燥處理模組</p>  
        <p type="p">10:裝載鎖定單元</p>  
        <p type="p">11:裝載鎖定腔室</p>  
        <p type="p">12:基板被配置部</p>  
        <p type="p">13:支持銷</p>  
        <p type="p">14:銷升降驅動部</p>  
        <p type="p">15:裝載壓力調整部(第1壓力調整部)</p>  
        <p type="p">16:第1氣體抽吸部</p>  
        <p type="p">17:第1氣體供給部</p>  
        <p type="p">20:局部搬送單元</p>  
        <p type="p">21:上游腔室、局部搬送腔室</p>  
        <p type="p">22:搬送部(局部搬送部)</p>  
        <p type="p">23:手</p>  
        <p type="p">24:手移動驅動部</p>  
        <p type="p">25:上游壓力調整部(第2壓力調整部)</p>  
        <p type="p">26:第2氣體抽吸部</p>  
        <p type="p">27:第2氣體供給部</p>  
        <p type="p">30:乾燥處理單元</p>  
        <p type="p">31:乾燥處理腔室</p>  
        <p type="p">32:基板被配置部</p>  
        <p type="p">33:載物台</p>  
        <p type="p">34:升降銷</p>  
        <p type="p">35:乾燥壓力調整部(第3壓力調整部)</p>  
        <p type="p">36:第3氣體抽吸部</p>  
        <p type="p">37:第3氣體供給部</p>  
        <p type="p">38:處理氣體供給部</p>  
        <p type="p">161:第1抽吸管</p>  
        <p type="p">162:第1壓力調整閥</p>  
        <p type="p">171:第1供給管</p>  
        <p type="p">172:第1供給閥</p>  
        <p type="p">261:抽吸管、第2抽吸管</p>  
        <p type="p">262:壓力調整閥(第2壓力調整閥)</p>  
        <p type="p">271:供給管(第2供給管)</p>  
        <p type="p">272:供給閥(第2供給閥)</p>  
        <p type="p">341:銷升降驅動部</p>  
        <p type="p">361:第3抽吸管</p>  
        <p type="p">362:第3壓力調整閥</p>  
        <p type="p">371:第3供給管</p>  
        <p type="p">372:第3供給閥</p>  
        <p type="p">381:供給管</p>  
        <p type="p">382:供給閥</p>  
        <p type="p">383:流量調整閥</p>  
        <p type="p">Dx:移動方向</p>  
        <p type="p">GLT:第2閘(裝載搬送閘)</p>  
        <p type="p">GTP:第1閘(搬送處理閘)</p>  
        <p type="p">PS:配管空間</p>  
        <p type="p">TW:塔</p>  
        <p type="p">TWA:乾燥塔</p>  
        <p type="p">VP:抽吸部</p>  
        <p type="p">VP1:第1抽吸部</p>  
        <p type="p">VP2:第2抽吸部</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2673" publication-number="202628966"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628966.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製程腔室</chinese-title>  
        <english-title>SEMICONDUCTOR PROCESS CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P95/90</main-classification>  
        <further-classification edition="200601120260302B">C23C16/458</further-classification>  
        <further-classification edition="200601120260302B">F27D1/18</further-classification>  
        <further-classification edition="200601120260302B">F27D7/06</further-classification>  
        <further-classification edition="200601120260302B">F16J15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旭剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XU GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李欣雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種半導體製程腔室，該半導體製程腔室包括製程管、第一法蘭組件、第二法蘭組件、載舟裝置、密封門組件和尾部封堵組件，其中，第一法蘭組件設於製程管的第一管口所在的第一端，第二法蘭組件設於製程管的第二管口所在的第二端，載舟裝置設於製程管內，且載舟裝置的第一端與第一法蘭組件連接，載舟裝置的第二端與第二法蘭組件連接，密封門組件與第一法蘭組件活動連接，用於藉由第一法蘭組件密封第一管口，尾部封堵組件藉由第二法蘭組件密封第二管口。上述方案可解決相關技術中的半導體製程腔室中的製程管存在容易損壞的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a semiconductor process chamber, wherein the semiconductor process chamber comprises a process tube, a first flange component, a second flange component, a boat carrier device, a sealing door component, and a tail end blocking component. The first flange component is disposed at a first end of the process tube, wherein the first end is provided with a first tube opening. The second flange component is disposed at a second end of the process tube, wherein the second end is provided with a second tube opening. The boat carrier device is disposed within the process tube, wherein a first end of the boat carrier device is connected to the first flange component, and a second end of the boat carrier device is connected to the second flange component. The sealing door component is movably connected to the first flange component and is used for sealing the first tube opening via the first flange component. The tail end blocking component seals the second tube opening via the second flange component. The above solution can solve the problem in the related art wherein the process tube in the semiconductor process chamber is prone to damage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">a:晶舟</p>  
        <p type="p">100:製程管</p>  
        <p type="p">200:第一法蘭組件</p>  
        <p type="p">300:第二法蘭組件</p>  
        <p type="p">400:載舟裝置</p>  
        <p type="p">410:支撐杆</p>  
        <p type="p">500:密封門組件</p>  
        <p type="p">510:環形邊緣部</p>  
        <p type="p">520:伸入部</p>  
        <p type="p">600:尾部封堵組件</p>  
        <p type="p">601:排氣管</p>  
        <p type="p">702:第一密封圈</p>  
        <p type="p">706:第二密封圈</p>  
        <p type="p">707:第三密封圈</p>  
        <p type="p">910:第一安裝座</p>  
        <p type="p">920:第二安裝座</p>  
        <p type="p">930:勻流板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2674" publication-number="202627709"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627709.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓調度方法、半導體製程設備及電腦可讀存儲介質</chinese-title>  
        <english-title>WAFER SCHEDULING METHOD, SEMICONDUCTOR PROCESSING EQUIPMENT, AND COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G05B19/048</main-classification>  
        <further-classification edition="200601120260302B">G05B23/00</further-classification>  
        <further-classification edition="200601120260302B">G05B19/418</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李漢傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HAN JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相會鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG, HUI FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供晶圓調度方法、半導體製程設備及電腦可讀存儲介質，該方法基於目標調度模型的資源回路中晶圓的製程路徑，確定歸屬於資源回路但未貫穿資源回路的晶圓，作為待貫穿晶圓，基於資源回路中待貫穿晶圓的數量與晶圓數量閾值的大小關係對資源回路進行鎖死狀態識別，由此，識別到的歸屬於但未貫穿相應資源回路的晶圓能夠精準表徵資源回路中在後續步驟無法流出的晶圓，即待貫穿晶圓，進而根據待貫穿晶圓的數量與資源回路的晶圓數量閾值的大小關係，能準確對相應的資源回路進行鎖死狀態識別，進而降低鎖死狀態誤識別對半導體製程設備生產效率的影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a wafer scheduling method, semiconductor processing equipment, and a computer-readable storage medium. The method determines wafers belonging to, but not traversing, a resource loop in the target scheduling model, based on the process paths of wafers within the resource loop. These wafers are designated as wafers to be traversed. The method then performs deadlock state identification for the resource loop based on the relationship between the number of wafers to be traversed in the resource loop and a wafer quantity threshold. In this way, the identified wafers that belong to but have not traversed the corresponding resource loop can accurately represent the wafers in the resource loop that cannot exit in subsequent steps, i.e., the wafers to be traversed. Accordingly, by comparing the number of wafers to be traversed with the wafer quantity threshold of the resource loop, the deadlock state of the corresponding resource loop can be accurately identified, thereby reducing the impact of deadlock misidentification on the production efficiency of semiconductor processing equipment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:大氣級聯模組</p>  
        <p type="p">102:第一真空級聯模組</p>  
        <p type="p">103:第二真空級聯模組</p>  
        <p type="p">1011:載入埠</p>  
        <p type="p">1012:冷卻位</p>  
        <p type="p">1013:校準位</p>  
        <p type="p">1014:裝卸載腔室</p>  
        <p type="p">1015:大氣機械手</p>  
        <p type="p">1021:第一製程腔室</p>  
        <p type="p">1022:第一真空機械手</p>  
        <p type="p">1031:第二製程腔室</p>  
        <p type="p">1032:第二真空機械手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2675" publication-number="202628361"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628361.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>時脈節流器架構</chinese-title>  
        <english-title>CLOCK THROTTLER ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260309B">H03K5/003</main-classification>  
        <further-classification edition="200601120260309B">H03K5/135</further-classification>  
        <further-classification edition="200601120260309B">G06F1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內馬尼　摩訶提婆穆爾蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMANI, MAHADEVAMURTY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查布拉　阿米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHHABRA, AMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫伯霍爾茲　雷納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERBERHOLZ, RAINER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">時脈節流器架構包括時脈節流器電路系統、相關方法、及狀態機，其中該時脈節流器電路系統包括：第一選擇電路系統，其用以選擇儲存器中之複數個模式中之一第一模式，其中該複數個模式中之各模式包含複數個位元；第二選擇電路系統，其用以順序地選擇該第一模式的位元，並以一連續方式將該等所選擇位元提供至時脈閘電路系統；其中該時脈閘電路系統用以接收一時脈輸入信號，並回應於應用該等所選擇位元而傳遞或閘控該時脈輸入信號之脈衝，以產生一時脈輸出信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Clock throttler architecture including clock throttler circuitry, related methods and state machine, where the clock throttler circuitry includes: first selection circuitry to select a first pattern of a plurality of patterns in storage, where each pattern of the plurality of patterns comprises a plurality of bits; second selection circuitry to sequentially select bits of the first pattern and to provide the selected bits to clock gate circuitry in a successive manner; where the clock gate circuitry is to receive a clock input signal and to pass or gate pulses of the clock input signal responsive to applying the selected bits to generate a clock output signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:時脈節流器電路系統</p>  
        <p type="p">2:輸入</p>  
        <p type="p">4:輸入</p>  
        <p type="p">6:輸入</p>  
        <p type="p">8:輸入</p>  
        <p type="p">10:輸入</p>  
        <p type="p">12:輸出</p>  
        <p type="p">14:輸出</p>  
        <p type="p">16:輸出</p>  
        <p type="p">18:輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2676" publication-number="202627760"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627760.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於節流器之緩解器</chinese-title>  
        <english-title>THROTTLER BASED MITIGATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260305B">G06F1/3296</main-classification>  
        <further-classification edition="201901120260305B">G06F1/32</further-classification>  
        <further-classification edition="200601120260305B">G06F1/08</further-classification>  
        <further-classification edition="200601120260305B">H03K19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏列齊娜　愛卡捷琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEREZINA, EKATERINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查布拉　阿米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHHABRA, AMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加斯帕皮涅羅　魯伊佩德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GASPAR PINHEIRO, RUI PEDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金伯　莎拉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMBER, SARAH JEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內馬尼　摩訶提婆穆爾蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMANI, MAHADEVAMURTY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">包括電路系統之一基於節流器之緩解器、相關方法、及狀態機，該電路系統包括：一第一組件，其用以：在該時脈節流電路處接收對應於一時脈輸出信號之一目標節流位準的一目標索引；判定該時脈節流電路處實施的一目前索引，其中該目前索引對應於該時脈輸出信號的一目前節流位準；回應於該判定，提供一索引信號以使該時脈節流電路根據該索引信號而節流該時脈輸出信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A throttler based mitigator including circuitry, related methods and state machine, the circuitry including: a first component to: receive a target index corresponding to a target level of throttle for a clock output signal at the clock throttle circuit; determine a current index implemented at the clock throttle circuit, where the current index corresponds to a current level of throttle of the clock output signal; provide, responsive to the determination, an index signal to cause the clock throttle circuit to throttle the clock output signal in accordance with the index signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1&lt;sub&gt;1&lt;/sub&gt;:時脈節流器電路；時脈節流器電路系統</p>  
        <p type="p">2&lt;sub&gt;1&lt;/sub&gt;:緩解狀態機</p>  
        <p type="p">3:暫存器庫；儲存器；儲存電路系統</p>  
        <p type="p">4&lt;sub&gt;1&lt;/sub&gt;:時脈輸入信號</p>  
        <p type="p">5:輸入</p>  
        <p type="p">6:輸入</p>  
        <p type="p">7:輸入；系統時脈信號</p>  
        <p type="p">8&lt;sub&gt;1&lt;/sub&gt;:時脈輸出信號</p>  
        <p type="p">9:輸出</p>  
        <p type="p">10:介面</p>  
        <p type="p">100:緩解器電路系統；系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2677" publication-number="202627704"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627704.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>學習方法、資訊處理方法、資訊處理裝置及電腦程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260328B">G05B13/04</main-classification>  
        <further-classification edition="202001120260328B">G06F30/27</further-classification>  
        <further-classification edition="202301120260328B">G06N3/04</further-classification>  
        <further-classification edition="202301120260328B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安崎遼路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANZAKI, RYOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤一宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種學習方法、資訊處理方法、資訊處理裝置及電腦程式。藉由電腦執行下述處理：從基板處理裝置或該基板處理裝置的模擬器獲取與在設定條件下於基板處理裝置中觀測到的時間序列之觀測值相關的數據；使用描述表示基板處理裝置之控制系統的狀態之狀態變數的時間發展、及依賴於狀態之觀測值的時間發展之深度狀態空間模型，以時間序列對在提供條件的情形時之觀測值進行預測；以及基於所獲取之數據與深度狀態空間模型的預測結果之偏離程度，來學習再現基板處理裝置的動作之動作再現模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:條件設定部</p>  
        <p type="p">112:輸入生成部</p>  
        <p type="p">200:基板處理裝置</p>  
        <p type="p">D:數據</p>  
        <p type="p">L:損失函數</p>  
        <p type="p">MD0:深度狀態空間模型</p>  
        <p type="p">O:最佳化演算法</p>  
        <p type="p">x&lt;sub&gt;t&lt;/sub&gt;:輸入</p>  
        <p type="p">y&lt;sub&gt;t&lt;/sub&gt;:輸出</p>  
        <p type="p">z&lt;sub&gt;t&lt;/sub&gt;:條件</p>  
        <p type="p">Φ:參數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2678" publication-number="202628684"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628684.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多堆疊半導體裝置</chinese-title>  
        <english-title>MULTI-STACK SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260317B">H10D84/83</main-classification>  
        <further-classification edition="202501120260317B">H10D64/20</further-classification>  
        <further-classification edition="202601120260317B">H10W20/42</further-classification>  
        <further-classification edition="202601120260317B">H10W20/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴志䛵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JISOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柄成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNGSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭臻愚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺永官</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YOUNGKWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千寬永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, KWANYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多堆疊半導體裝置之一範例包括：第一及第二下源極/汲極區；第一及第二下接點結構，其分別安置於該第一及第二下源極/汲極區之下表面上；第一及第二上源極/汲極區，其安置為分別與該第一及第二下源極/汲極區垂直地間隔開；第一及第二上接點，其分別安置於該第一及第二上源極/汲極區之上表面上；一垂直傳導通孔，其將該第一下接點結構垂直地連接至該第一上接點；以及一介電覆蓋結構，其安置於該第一上源極/汲極區與該第一上接點之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example of a multi-stack semiconductor device includes first and second lower source/drain regions, first and second lower contact structures disposed on lower surfaces of the first and second lower source/drain regions, respectively, first and second upper source/drain regions disposed to be vertically spaced apart from the first and second lower source/drain regions, respectively, first and second upper contacts disposed on upper surfaces of the first and second upper source/drain regions, respectively, a vertical conductive via vertically connecting the first lower contact structure to the first upper contact, and a dielectric cover structure disposed between the first upper source/drain region and the first upper contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多堆疊半導體裝置</p>  
        <p type="p">AA:區域、區</p>  
        <p type="p">BB:區域</p>  
        <p type="p">BML:背佈線線路</p>  
        <p type="p">CA1:下接點、第一下接點、第二下接點</p>  
        <p type="p">CA2:上接點、第一上接點、第二上接點</p>  
        <p type="p">CB:胞元邊界</p>  
        <p type="p">CE:胞元</p>  
        <p type="p">CH:胞元高度</p>  
        <p type="p">CM1:下接點合併線、第一下接點合併線、第二下接點合併線</p>  
        <p type="p">DCS:介電覆蓋結構</p>  
        <p type="p">FML:前佈線線路</p>  
        <p type="p">GL:閘極線</p>  
        <p type="p">LV1,LV2,LV3,LV4:垂直層級</p>  
        <p type="p">M1:第一佈線線路</p>  
        <p type="p">M2:第二佈線線路</p>  
        <p type="p">SD1:下源極/汲極區、第一下源極/汲極區、第二下源極/汲極區</p>  
        <p type="p">SD2:上源極/汲極區、第一上源極/汲極區、第二上源極/汲極區</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p>  
        <p type="p">VA1:下通孔</p>  
        <p type="p">VA2:上通孔</p>  
        <p type="p">VL:垂直傳導通孔</p>  
        <p type="p">X:第一水平方向</p>  
        <p type="p">X1-X1',X2-X2':線</p>  
        <p type="p">Y:第二水平方向</p>  
        <p type="p">Z:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2679" publication-number="202629046"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629046.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W74/10</main-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification>  
        <further-classification edition="202601120260302B">H10W70/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭盛木</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, SUNG MOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種半導體封裝件。該半導體封裝件包括佈線結構。佈線結構包括第一絕緣層、位於第一絕緣層上的導電墊、位於導電墊上的第二絕緣層、穿過第二絕緣層並且與導電墊重疊的通孔、設置在導電墊上並且位於通孔中的突出圖案、以及接觸突出圖案的上表面和側表面並且連接到導電墊的凸塊下金屬化（UBM）層。半導體晶片連接到UBM層並且設置在佈線結構上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a semiconductor package. The semiconductor package includes a wiring structure. The wiring structure includes a first insulating layer, a conductive pad on the first insulating layer, a second insulating layer on the conductive pad, a through hole passing through the second insulating layer and overlapping with the conductive pad, a protruding pattern disposed on the conductive pad and located in the through hole, and an under bump metallurgy (UBM) layer that contacts the upper surface and side surface of the protruding pattern and is connected to the conductive pad. A semiconductor chip connected to the UBM layer and disposed on the wiring structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:佈線結構</p>  
        <p type="p">23:第一絕緣層</p>  
        <p type="p">25:第二絕緣層</p>  
        <p type="p">27:第三絕緣層</p>  
        <p type="p">31:第一通孔電極</p>  
        <p type="p">38:第一水平電極</p>  
        <p type="p">41:第二通孔電極</p>  
        <p type="p">48:導電墊</p>  
        <p type="p">48':第二水平電極</p>  
        <p type="p">57:突出圖案</p>  
        <p type="p">63:凸塊下金屬化層</p>  
        <p type="p">72:第一焊料互連件</p>  
        <p type="p">89:晶片電極</p>  
        <p type="p">90:第一半導體晶片</p>  
        <p type="p">91:第一基板</p>  
        <p type="p">93:第一電路層</p>  
        <p type="p">110:部分</p>  
        <p type="p">172:第三焊料互連件</p>  
        <p type="p">189:基底晶片電極</p>  
        <p type="p">310:基底晶片</p>  
        <p type="p">311:基底基板</p>  
        <p type="p">317:基底電路層</p>  
        <p type="p">319:基底貫通電極</p>  
        <p type="p">320:第一核心晶片</p>  
        <p type="p">321:第一核心基板</p>  
        <p type="p">327:第一核心電路層</p>  
        <p type="p">329:第一核心貫通電極</p>  
        <p type="p">330:第二核心晶片</p>  
        <p type="p">331:第二核心基板</p>  
        <p type="p">337:第二核心電路層</p>  
        <p type="p">339:第二核心貫通電極</p>  
        <p type="p">340:第三核心晶片</p>  
        <p type="p">341:第三核心基板</p>  
        <p type="p">347:第三核心電路層</p>  
        <p type="p">349:第三核心貫通電極</p>  
        <p type="p">350:頂部晶片</p>  
        <p type="p">351:頂部基板</p>  
        <p type="p">357:頂部電路層</p>  
        <p type="p">416:基底後電極</p>  
        <p type="p">426:第一核心後電極</p>  
        <p type="p">429:第一核心前電極</p>  
        <p type="p">436:第二核心後電極</p>  
        <p type="p">439:第三核心前電極</p>  
        <p type="p">446:第三核心後電極</p>  
        <p type="p">449:第三核心前電極</p>  
        <p type="p">459:頂部前電極</p>  
        <p type="p">472:第二焊料互連件</p>  
        <p type="p">572:外部焊料互連件</p>  
        <p type="p">589:外部電極</p>  
        <p type="p">591:第一囊封層</p>  
        <p type="p">592:第二囊封層</p>  
        <p type="p">HD:水平方向</p>  
        <p type="p">VD:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2680" publication-number="202626037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新劑量方案</chinese-title>  
        <english-title>NEW DOSE REGIMEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/445</main-classification>  
        <further-classification edition="200601120260401B">A61P9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商亞納卡迪歐公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANACARDIO AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫爾辛保健公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELSINN HEALTHCARE SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史卓堡　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROMBERG, PATRIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森達爾　艾林　瑪里亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENDAHL, ELIN MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高登　艾倫　弗雷德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GORDON, ALLAN FRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆德　拉斯　赫曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUND, LARS HERMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威斯特伯格　卡爾　高倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTERBERG, KARL GORAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於具有結構式 (i) 的化合物： &lt;br/&gt;&lt;img align="absmiddle" height="154px" width="270px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;或其藥學上可接受的鹽，用於在受試者中治療藉由生長激素促分泌素受體（GHSR）1a激動可治療的疾病或病症中使用。所述治療包括 (a) 向該受試者投與第一先導劑量的該化合物或其藥學上可接受的鹽，隨後 (b) 向該受試者投與維持劑量的該化合物或其藥學上可接受的鹽；其中該第一先導劑量係該維持劑量的約50%或更少。另外地或可替代地，所述治療包括將該化合物或其藥學上可接受的鹽與食物一起投與於該受試者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a compound having the structural formula (i): &lt;br/&gt;&lt;img align="absmiddle" height="153px" width="272px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a pharmaceutically acceptable salt thereof, for use in the treatment of a disease or condition treatable by growth hormone secretagogue receptor (GHSR) 1a agonism in a subject. Said treatment comprises (a) administration of a first priming dose of the compound or the pharmaceutically acceptable salt thereof to the subject, prior to (b) administration of a maintenance dose of the compound or the pharmaceutically acceptable salt thereof to the subject; wherein the first priming dose is about 50% or less of the maintenance dose. Additionally or alternatively, said treatment comprises the administration of the compound or the pharmaceutically acceptable salt thereof to the subject with food.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2681" publication-number="202628423"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628423.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生成視訊的方法和裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR GENERATING VIDEO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260309B">H04N19/50</main-classification>  
        <further-classification edition="201401120260309B">H04N19/117</further-classification>  
        <further-classification edition="201701120260309B">G06T7/11</further-classification>  
        <further-classification edition="202201120260309B">G06V20/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　基逢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, KEE-BONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊爾　哈米　莫斯塔法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL-KHAMY, MOSTAFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍鲁日　奥列格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHORUZHIY, OLEG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆達薩爾　布爾漢　艾哈邁德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUDASSAR, BURHAN AHMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇雷什　普里特維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SURESH, PRITHVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>粟海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉青峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QINGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種用於生成視訊的方法和裝置。方法包括提取複數個視訊幀，包括至少第一幀和第二幀；為第二幀生成預測軟體積；為第一幀生成像素權重圖；將第二幀的預測軟體積與第一幀的像素權重圖結合以為輸出幀生成組合預測結果；以及生成包括輸出幀的組合預測結果的視訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and an apparatus for generating a video are disclosed. The method includes extracting a plurality of video frames including at least a first frame and a second frame; generating a predicted soft volume for the second frame; generating a weight map of pixels for the first frame; combining the predicted soft volume for the second frame with the weight map of pixels for the first frame to generate combined predictions for the output frame; and generating a video including the combined predictions for the output frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1601、1602、1603、1604、1605:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2682" publication-number="202626896"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626896.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>延伸膜及其製造方法</chinese-title>  
        <english-title>EXTENDED FILM AND METHOD FOR MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C08J5/22</main-classification>  
        <further-classification edition="201901120260209B">B32B7/028</further-classification>  
        <further-classification edition="200601120260209B">B32B27/08</further-classification>  
        <further-classification edition="200601120260209B">B32B27/30</further-classification>  
        <further-classification edition="200601120260209B">B29C55/04</further-classification>  
        <further-classification edition="200601120260209B">B29C55/12</further-classification>  
        <further-classification edition="200601120260209B">B65D81/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本他喜龍希愛股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C.I.TAKIRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹原一芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAHARA, KAZUFUSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森惠一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大島滉主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSHIMA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種延伸膜及其製造方法，延伸膜（10），其至少包括基材層（3）及阻隔層（5），基材層（3）以密度為0.950g／cm&lt;sup&gt;3&lt;/sup&gt;以上的高密度聚乙烯為主要成分，阻隔層（5）以乙烯含量為27mol％以上且38mol％以下的乙烯－乙烯醇共聚物作為主要成分，溫度25℃、濕度90％的環境氛圍下的氧透過率為2.5cc／m&lt;sup&gt;2&lt;/sup&gt;・日以下，在膜的延伸方向上，在120℃下加熱了10分鐘的情況下的熱收縮率為5％以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The object of the present invention is to provide a stretched film and a method for manufacturing the same. According to the present invention, the stretched film (10) comprises at least a base layer (3) and a barrier layer (5), wherein the base layer (3) is primarily composed of main component comprising a high-density polyethylene having a density of 0.950 g/cm&lt;sup&gt;3&lt;/sup&gt; or more, and the barrier layer (5) is primarily composed of main component comprising an ethylene-vinyl alcohol copolymer having an ethylene content of 27 mol% or more and 38 mol% or less. The stretched film has an oxygen permeability of 2.5 cc/m&lt;sup&gt;2&lt;/sup&gt;·day or less in an atmosphere at a temperature of 25°C and a humidity of 90%, and a heat shrinkage rate of 5% or less when heated in the stretching direction of the film at 120°C for 10 minutes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:積層體</p>  
        <p type="p">2:密封膜</p>  
        <p type="p">3:基材層(第一基材層)</p>  
        <p type="p">4:接著劑層(第一接著劑層)</p>  
        <p type="p">5:阻隔層</p>  
        <p type="p">10:延伸膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2683" publication-number="202626625"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626625.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>LPAR1拮抗劑藥物組合物及其在醫藥上的應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/14</main-classification>  
        <further-classification edition="200601120260401B">C07D401/04</further-classification>  
        <further-classification edition="200601120260401B">C07D405/14</further-classification>  
        <further-classification edition="200601120260401B">C07D417/14</further-classification>  
        <further-classification edition="200601120260401B">C07D513/04</further-classification>  
        <further-classification edition="200601120260401B">C07D487/04</further-classification>  
        <further-classification edition="200601120260401B">C07D471/04</further-classification>  
        <further-classification edition="200601120260401B">C07D409/14</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4436</further-classification>  
        <further-classification edition="200601120260401B">A61K31/444</further-classification>  
        <further-classification edition="200601120260401B">A61K31/553</further-classification>  
        <further-classification edition="200601120260401B">A61K31/55</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification>  
        <further-classification edition="200601120260401B">A61P13/08</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張軒邈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XUANMIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧士豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, SHIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴龐科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, PANGKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竇贏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOU, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張浩亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAOLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國彪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUOBIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋長偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, CHANGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀羚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAOLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐平明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, PINGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種藥物組合物，所述的藥物組合物包含治療有效量的活性成分和藥用賦形劑，所述的活性成分選自通式(I)所述的化合物或者其立體異構體、互變異構體、藥學上可接受的鹽，所述藥物組合物包含1-750mg活性成分。本發明還涉及所述藥物組合物用於製備治療LPAR1介導的疾病的相關藥物中的應用。 &lt;br/&gt;&lt;img align="absmiddle" height="118px" width="262px" file="ed10619.JPG" alt="ed10619.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2684" publication-number="202628335"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628335.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合式模組化多電平變換器及其控制方法</chinese-title>  
        <english-title>HYBRID MODULAR MULTILEVEL CONVERTER AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260317B">H02M7/483</main-classification>  
        <further-classification edition="200701120260317B">H02M7/5387</further-classification>  
        <further-classification edition="200601120260317B">H02M1/14</further-classification>  
        <further-classification edition="202601120260317B">H02J3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　汝錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬頔淏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, DIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案為一種混合式模組化多電平變換器及其控制方法，將電壓差值加上每一半橋子模組的原始電壓或每一全橋子模組的原始電壓，以取得補償電壓，電壓差值與半橋子模組及全橋子模組的原始電壓之間的差值具有相關性；根據橋臂電流及電壓參考值，將具有一種子模組的補償電壓的訊號及具有另一種子模組的原始電壓的訊號進行排序，以取得半橋子模組及全橋子模組的運作順序；根據半橋子模組及全橋子模組的原始電壓、電壓參考值及運作順序，計算半橋子模組及全橋子模組的運作模式，輸出驅動信號以控制半橋及全橋子模組，使電壓差值逐漸趨近於或等於0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hybrid modular multilevel converter and control method thereof are provided. After the voltage difference is added to the original voltage of each half-bridge submodule or the original voltage of each full-bridge submodule, a compensation voltage is obtained. The voltage difference is correlated with differences between original voltages of the plurality of half-bridge submodules and original voltages of the plurality of full-bridge submodules. According to a bridge arm current and a voltage reference value, signals of one type of submodules with the compensation voltage and signals with the original voltages of the other type of submodules are sorted. Consequently, an operating sequence of all half-bridge submodules and all full-bridge submodules is acquired. The operating modes of the half-bridge submodules and the full-bridge submodules are calculated according to the original voltages of the half-bridge submodules, the original voltages of the full-bridge submodules, the voltage reference value and the operating sequence. A corresponding driving signal is generated to control the half-bridge submodules and the full-bridge submodules. Consequently, the voltage difference gradually approaches or equal to 0.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;CHB,i&lt;/i&gt;
        &lt;/sub&gt;:原始電壓</p>  
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;CFB,j&lt;/i&gt;
        &lt;/sub&gt;:原始電壓</p>  
        <p type="p">4:控制器</p>  
        <p type="p">41:第一加總器</p>  
        <p type="p">42:第一濾波器</p>  
        <p type="p">43:第二加總器</p>  
        <p type="p">44:第二濾波器</p>  
        <p type="p">45:加減運算器</p>  
        <p type="p">46:比例積分控制單元</p>  
        <p type="p">47:加法器</p>  
        <p type="p">48:排序運算器</p>  
        <p type="p">49:合成驅動器</p>  
        <p type="p">
        &lt;img align="absmiddle" height="26px" width="41px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;:第一平均電壓</p>  
        <p type="p">
        &lt;img align="absmiddle" height="24px" width="39px" file="d10002.TIF" alt="其他非圖式ed10002.png" img-content="character" orientation="portrait" inline="no" giffile="ed10002.png"&gt;
        &lt;/img&gt;:第二平均電壓</p>  
        <p type="p">△&lt;i&gt;V&lt;/i&gt;:電壓差值</p>  
        <p type="p">
        &lt;i&gt;V'&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;CHB,i&lt;/i&gt;
        &lt;/sub&gt;:半橋補償電壓</p>  
        <p type="p">
        &lt;img align="absmiddle" height="26px" width="39px" file="d10003.TIF" alt="其他非圖式ed10003.png" img-content="character" orientation="portrait" inline="no" giffile="ed10003.png"&gt;
        &lt;/img&gt;:電壓參考值</p>  
        <p type="p">
        &lt;i&gt;i&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;arm&lt;/i&gt;
        &lt;/sub&gt;:橋臂電流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2685" publication-number="202626644"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626644.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有雜芳環的化合物、包含其的藥物組合物及其製備方法和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D471/04</main-classification>  
        <further-classification edition="200601120260401B">C07D401/12</further-classification>  
        <further-classification edition="200601120260401B">C07D401/14</further-classification>  
        <further-classification edition="200601120260401B">C07D498/14</further-classification>  
        <further-classification edition="200601120260401B">C07D413/14</further-classification>  
        <further-classification edition="200601120260401B">C07D405/14</further-classification>  
        <further-classification edition="200601120260401B">C07D401/04</further-classification>  
        <further-classification edition="200601120260401B">C07D487/10</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260401B">A61K31/506</further-classification>  
        <further-classification edition="200601120260401B">A61K31/497</further-classification>  
        <further-classification edition="200601120260401B">A61K31/553</further-classification>  
        <further-classification edition="200601120260401B">A61K31/53</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/501</further-classification>  
        <further-classification edition="200601120260401B">A61K31/496</further-classification>  
        <further-classification edition="200601120260401B">A61K31/519</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳忠輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李曉勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅紅江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋宏梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞　文勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種含有雜芳環的化合物、包含其的藥物組合物及其製備方法和用途。具體地，本公開涉及一種具有式(I)結構的化合物，可以用於預防或治療腫瘤或癌症。 &lt;br/&gt;&lt;img align="absmiddle" height="173px" width="184px" file="ed10688.JPG" alt="ed10688.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2686" publication-number="202626115"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626115.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>穩定的放射性核素錯合物溶液</chinese-title>  
        <english-title>STABLE RADIONUCLIDE COMPLEX SOLUTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K51/08</main-classification>  
        <further-classification edition="200601120260401B">A61K47/18</further-classification>  
        <further-classification edition="200601120260401B">A61K9/08</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商諾華公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVARTIS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比奧基　賈科莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOCCHI, GIACOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德爾伊索拉　安東尼奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELL'ISOLA, ANTONIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雷羅　瓦倫蒂娜　伊薩貝塔　維維安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERRERO, VALENTINA ELISABETTA VIVIANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔帝斯科　馬狄雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEDESCO, MATTIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於包含α粒子發射放射性核素的藥物水溶液，該藥物水溶液在延長的時間段內提供放射化學純度，產生適合用作用於治療目的的商業藥物產品的產品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to aqueous pharmaceutical solutions comprising an alpha-particle emitting radionuclide that provide for radiochemical purity over an extended period, resulting in a product is that is suitable for use as commercial drug product for therapeutic purposes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2687" publication-number="202629017"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629017.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含其中電容器包含垂直對準電容器互連件的裝置的封裝</chinese-title>  
        <english-title>PACKAGE COMPRISING A DEVICE WITH CAPACITOR COMPRISING VERTICALLY ALIGNED CAPACITOR INTERCONNECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10W70/63</main-classification>  
        <further-classification edition="202601120260323B">H10W70/652</further-classification>  
        <further-classification edition="202601120260323B">H10W74/10</further-classification>  
        <further-classification edition="202501120260323B">H10D1/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANE, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁　立昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, LI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝，其包含：一封裝基材，其包含：至少一個介電層；複數個互連件；一主動裝置，其至少部分地位於該至少一個介電層中，其中該主動裝置包含：一記憶體；及一電容器，其包含垂直對準的複數個電容器互連件；及一整合裝置，其耦接至該封裝基材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package comprising a package substrate comprising at least one dielectric layer; a plurality of interconnects; an active device located at least partially in the at least one dielectric layer, wherein the active device comprises a memory; and a capacitor comprising a plurality of capacitor interconnects that are vertically aligned; and an integrated device coupled to the package substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基材</p>  
        <p type="p">102:介電層</p>  
        <p type="p">103,103a,103b:電容器</p>  
        <p type="p">105:互連件</p>  
        <p type="p">107:橋接器</p>  
        <p type="p">131,131a,131b:電容器互連件</p>  
        <p type="p">132,132a,132b:電容器互連件</p>  
        <p type="p">170:橋接器互連件</p>  
        <p type="p">200:主動裝置</p>  
        <p type="p">201:記憶體</p>  
        <p type="p">210,210a:邏輯單元</p>  
        <p type="p">215:閘極氧化物</p>  
        <p type="p">220:閘極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2688" publication-number="202627213"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627213.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可攜式氫氣產生器</chinese-title>  
        <english-title>PORTABLE HYDROGEN GENERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260223B">C25B1/04</main-classification>  
        <further-classification edition="202101120260223B">C25B9/17</further-classification>  
        <further-classification edition="202101120260223B">C25B9/60</further-classification>  
        <further-classification edition="202101120260223B">C25B9/65</further-classification>  
        <further-classification edition="202101120260223B">C25B9/67</further-classification>  
        <further-classification edition="200601120260223B">A61M16/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信湧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信湧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可攜式氫氣產生器包含電解水箱、電解模組、冷凝器以及濕化模組。水箱具有容置空間以容置電解水。電解模組接收該電解水以產生並輸出含氫氣體。冷凝器耦接電解模組以冷凝及過濾含氫氣體。濕化模組耦接冷凝器。濕化模組用以容置水且自冷凝器接收含氫氣體至水中以濕化含氫氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A portable hydrogen generator includes a water tank, an electrolysis module, a condensing device and a humidifying module. The water tank has a containing space to contain the water. The electrolysis module receives the water to generate and output gas comprising hydrogen. The condensing device is coupled to the electrolysis module to condense and filter the gas comprising hydrogen. The humidifying module is coupled to the condensing device. The humidifying module is configured for containing the water and receiving the gas comprising hydrogen to humidify the gas comprising hydrogen.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">E:可攜式氫氣產生器</p>  
        <p type="p">1:電解水箱</p>  
        <p type="p">12:電解模組</p>  
        <p type="p">2:冷凝器</p>  
        <p type="p">3:過濾模組</p>  
        <p type="p">4:濕化模組</p>  
        <p type="p">45A:第一補水泵</p>  
        <p type="p">45B:第二補水泵</p>  
        <p type="p">5:過濾裝置</p>  
        <p type="p">6:控制模組</p>  
        <p type="p">61:揚聲器</p>  
        <p type="p">62:風扇</p>  
        <p type="p">7:外殼</p>  
        <p type="p">71:出氣口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2689" publication-number="202626075"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626075.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預防或改善老年性聽力損失的組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260401B">A61K35/748</main-classification>  
        <further-classification edition="200601120260401B">A61K38/16</further-classification>  
        <further-classification edition="200601120260401B">A61P27/16</further-classification>  
        <further-classification edition="201601120260401B">A23L33/135</further-classification>  
        <further-classification edition="201601120260401B">A23L33/17</further-classification>  
        <further-classification edition="201601120260401B">A23K10/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人農業　食品產業技術總合研究機構</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL AGRICULTURE AND FOOD RESEARCH ORGANIZATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井康行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陣内健昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JINNAI, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口主弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, MOTOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大池秀明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIKE, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的課題在於提供一種預防或改善老年性聽力損失的技術，利用如下預防或改善老年性聽力損失的組成物解決所述課題，所述預防或改善老年性聽力損失的組成物含有選自由螺旋藻、藻藍蛋白及藻藍素所組成的群組中的至少一種作為有效成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2690" publication-number="202626435"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626435.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147443</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人力交通工具之操作裝置</chinese-title>  
        <english-title>OPERATING DEVICE FOR HUMAN-POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">B62M25/04</main-classification>  
        <further-classification edition="200601120260128B">B62K23/02</further-classification>  
        <further-classification edition="200601120260128B">B62K23/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高尾憲太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAO, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村毅志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一人力交通工具之操作裝置。該操作裝置包括一底座、一定位棘輪、一定位構件、一第一釋放棘爪構件、一第二釋放棘爪構件及一第一釋放構件。該定位構件包含一接觸部件及在一固持位置與一釋放位置之間移動之一定位棘爪。該定位棘爪嚙合該定位棘輪以選擇性地建立該定位棘輪之預定位置。在其中該定位棘爪處於該釋放位置中之情況下，該定位棘爪從該定位棘輪脫離以允許該定位棘輪在一釋放方向上移動。該第一釋放棘爪構件接觸該接觸部件以使該定位棘爪從該定位棘輪脫離。該第二釋放棘爪構件接觸該接觸部件以使該定位棘爪從該定位棘輪脫離。該第一釋放構件包含經配置以使該第一釋放棘爪構件及該第二釋放棘爪構件從該定位構件脫離之一脫離部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An operating device for a human-powered vehicle is provided. The operating device comprises a base, a positioning ratchet, a positioning member, a first release pawl member, a second release pawl member and a first release member. The positioning member includes a contact part and a positioning pawl that moves between a holding position and a releasing position. The positioning pawl engages the positioning ratchet to selectively establish predetermined positions of the positioning ratchet. The positioning pawl is disengaged from the positioning ratchet to permit the positioning ratchet to move in a releasing direction where the positioning pawl is in the releasing position. The first release pawl member contacts the contact part to disengage the positioning pawl from the positioning ratchet. The second release pawl member contacts the contact part to disengage the positioning pawl from the positioning ratchet. The first release member including a disengaging portion arranged to disengage the first release pawl member and the second release pawl member from the positioning member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">16:釋放槓桿</p>  
        <p type="p">18:牽拉槓桿</p>  
        <p type="p">22:第一板/底板</p>  
        <p type="p">26:固定螺栓</p>  
        <p type="p">44:定位棘輪</p>  
        <p type="p">44a:定位棘輪齒</p>  
        <p type="p">58:第一釋放棘爪構件</p>  
        <p type="p">58b:第一釋放棘爪</p>  
        <p type="p">58c:第一臂</p>  
        <p type="p">60:第二釋放棘爪構件</p>  
        <p type="p">60b:第二釋放棘爪</p>  
        <p type="p">60c:第二臂</p>  
        <p type="p">62:第一釋放構件</p>  
        <p type="p">62a:脫離部分</p>  
        <p type="p">62a1:滑動表面</p>  
        <p type="p">62b:第一接觸部分</p>  
        <p type="p">62c:第二接觸部分</p>  
        <p type="p">62d:第三接觸部分</p>  
        <p type="p">80:牽拉棘爪</p>  
        <p type="p">81:突出部</p>  
        <p type="p">82:突出部</p>  
        <p type="p">84:樞銷</p>  
        <p type="p">86:偏置元件</p>  
        <p type="p">88:脫離部分</p>  
        <p type="p">A2:第二槓桿軸</p>  
        <p type="p">A3:樞軸</p>  
        <p type="p">A4:第四釋放軸</p>  
        <p type="p">A5:樞軸</p>  
        <p type="p">L1:第一距離</p>  
        <p type="p">L2:第二距離</p>  
        <p type="p">R1:第一方向</p>  
        <p type="p">R2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2691" publication-number="202626997"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626997.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光液</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09G1/02</main-classification>  
        <further-classification edition="200601120260401B">C09K3/14</further-classification>  
        <further-classification edition="202601120260401B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚明月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, MINGYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史經深</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, JINGSHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周凱瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, KAIRUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧欽源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, QINYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉資源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZIYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種化學機械拋光液，包括含有葡聚糖-有機羧酸結構的腐蝕抑制劑/保濕劑、經陰離子表面活性劑處理後的α‑氧化鋁奈米研磨顆粒、促進劑、氧化劑、水和pH調節劑。本發明所提供的化學機械拋光液，藉由腐蝕抑制劑/保濕劑羧基葡聚糖聚合物，可以顯著降低鋁的靜態腐蝕速率，並有效緩解拋光液磨料團聚的問題，且未對金屬鋁的拋光速率造成影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a chemical mechanical polishing solution, comprising a corrosion inhibitor/moisturizer containing a dextran-organic carboxylic acid structure, alpha-alumina nano-abrasive particles treated with an anionic surfactant, a promoter, an oxidizing agent, water, and a pH adjuster. The chemical mechanical polishing solution provided by the invention, through the corrosion inhibitor/moisturizer carboxymethyl dextran polymer, can significantly reduce the static corrosion rate of aluminum, effectively mitigate the agglomeration of abrasive particles in the polishing solution, and does not adversely affect the polishing rate of metallic aluminum.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2692" publication-number="202626169"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626169.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>去除氧化鈰拋光液中大顆粒的方法和氧化鈰拋光液</chinese-title>  
        <english-title>METHOD FOR REMOVING LARGE PARTICLES FROM CERIUM OXIDE POLISHING SOLUTION AND CERIUM OXIDE POLISHING SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01D29/50</main-classification>  
        <further-classification edition="200601120260401B">B01D29/60</further-classification>  
        <further-classification edition="200601120260401B">B01D37/04</further-classification>  
        <further-classification edition="200601120260401B">B24B57/02</further-classification>  
        <further-classification edition="201201120260401B">B24B37/00</further-classification>  
        <further-classification edition="200601120260401B">C09G1/02</further-classification>  
        <further-classification edition="200601120260401B">C09K3/14</further-classification>  
        <further-classification edition="202601120260401B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹先升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, XIANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王振新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHENXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬壯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, ZHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種去除氧化鈰拋光液中大顆粒的方法，該方法包括：提供首尾依次按序連接第一級濾芯與第二級濾芯、提供待過濾的氧化鈰拋光液原液；利用第一濾芯與第二濾芯，控制氧化鈰拋光液原液的流速為第一速率，按序過濾氧化鈰拋光液原液，得到去除大顆粒後的氧化鈰拋光液過濾液。本發明提供的去除氧化鈰拋光液中大顆粒的方法，顯著降低了氧化鈰拋光液中的大顆粒含量，避免了濾芯堵塞，同時兼顧了氧化鈰在化學機械拋光時較高的去除速率，顯著降低了拋光過程中的劃傷風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a method for removing large particles from a cerium oxide polishing solution, which includes: providing a first-stage filter element and a second-stage filter element connected in sequence, and providing the original cerium oxide polishing solution to be filtered; using the first and second filter elements to control the flow rate of the original cerium oxide polishing solution at a first rate, sequentially filtering the original solution to obtain the filtered polishing solution after large particle removal. The method significantly reduces the large particle content in the cerium oxide polishing solution, prevents filter element clogging, and maintains a high removal rate of cerium oxide during chemical-mechanical polishing, thereby substantially reducing the risk of scratches during the polishing process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2693" publication-number="202628908"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628908.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件的薄膜黏接裝置和方法以及半導體封裝件的切斷和分類裝置</chinese-title>  
        <english-title>FILM ADHERING APPARATUS OF SEMICONDUCTOR PACKAGE, FILM ADHERING METHOD AND SEMICONDUCTOR PACKAGE SAWING AND SORTING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/50</main-classification>  
        <further-classification edition="202601120260302B">H10P72/30</further-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/30</further-classification>  
        <further-classification edition="202601120260302B">H10W76/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田松賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, SONG HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金基洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GI RAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任炯昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, HYEONG UK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE GYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭浩承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, HO SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體封裝件的薄膜黏接裝置和方法以及半導體封裝件的切斷和分類裝置，可以包括：舟組件裝載裝置，用於將形成有黏著薄膜的未黏接狀態的舟組件移送至貨盤台；半導體封裝件移送裝置，用於將多個半導體封裝件移送至與該貨盤台對應的位置；以及批量黏接裝置，通過使該貨盤台朝著該半導體封裝件的方向進行相對移動，以此將該半導體封裝件批量黏接到該黏著薄膜上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:半導體封裝件</p>  
        <p type="p">10:舟組件</p>  
        <p type="p">20:舟組件裝載裝置</p>  
        <p type="p">21:舟拾取器</p>  
        <p type="p">211:拾取頭</p>  
        <p type="p">212:夾持器</p>  
        <p type="p">22:舟拾取器移動裝置</p>  
        <p type="p">23:托盤裝載器</p>  
        <p type="p">231:裝載框架</p>  
        <p type="p">30:半導體封裝件移送裝置</p>  
        <p type="p">31:翻轉台</p>  
        <p type="p">40:批量黏接裝置</p>  
        <p type="p">41:貨盤台</p>  
        <p type="p">42:升降裝置</p>  
        <p type="p">43:黏接壓力調節裝置</p>  
        <p type="p">50:舟組件卸載裝置</p>  
        <p type="p">51:貨盤台移動裝置</p>  
        <p type="p">52:托盤卸載器</p>  
        <p type="p">521:卸載框架</p>  
        <p type="p">72:單元拾取器</p>  
        <p type="p">73:攝像機</p>  
        <p type="p">90:控制部</p>  
        <p type="p">100:半導體封裝件的薄膜黏接裝置</p>  
        <p type="p">1000:半導體封裝件的切斷和分類裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2694" publication-number="202628881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓處理裝置及方法</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR PROCESSING WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="202601120260302B">H10W40/00</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金烔五</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈俊熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIM, JUN HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種晶圓處理裝置，可以包括：用於晶圓安置的工作臺；加壓裝置，用於對安置在該工作臺上的晶圓進行物理加壓，以校正該晶圓的變形並進行平坦化；以及熱交換裝置，用於與安置在該工作臺上的該晶圓進行熱交換，以校正該晶圓的變形並進行平坦化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">W:晶圓</p>  
        <p type="p">Wa:前表面</p>  
        <p type="p">Wb:後表面</p>  
        <p type="p">C:半導體晶片</p>  
        <p type="p">BH:鍵合頭</p>  
        <p type="p">10:工作臺</p>  
        <p type="p">11:真空管線</p>  
        <p type="p">20:加壓裝置</p>  
        <p type="p">21:前表面邊緣加壓裝置</p>  
        <p type="p">211:加壓主體</p>  
        <p type="p">M:升降裝置</p>  
        <p type="p">212:加壓台</p>  
        <p type="p">213:高度調節裝置</p>  
        <p type="p">G:引導構件</p>  
        <p type="p">30:熱交換裝置</p>  
        <p type="p">31:第一熱交換部</p>  
        <p type="p">32:第二熱交換部</p>  
        <p type="p">40:變形量測定裝置</p>  
        <p type="p">50:綜合控制部</p>  
        <p type="p">100:晶圓處理裝置</p>  
        <p type="p">1000:晶粒鍵合裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2695" publication-number="202627304"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627304.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>沉水泵</chinese-title>  
        <english-title>SUBMERGED PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">F04D13/08</main-classification>  
        <further-classification edition="200601120251210B">F17C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日機裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKKISO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUGIZAKI, NAOMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可去除殘留於馬達室之液化氣體的沉水泵。 &lt;br/&gt;本發明之沉水泵1具有框體2，該框體2容納旋轉軸4及葉輪6。框體具備：馬達室21；泵室20；凹部24，其配置於馬達室；第1流路23、52、7，其配置於比馬達3更靠下方向的位置，與馬達室及泵室連通；第2流路25，其配置於比馬達更靠上方向的位置，與馬達室及框體的外部空間S連通；及第3流路26，其與凹部及外部空間連通。第3流路在凹部的內表面之中配置於最靠下方向的部分24a開口。第3流路的流量小於第2流路的流量。在沉水泵吐出處理液時，從葉輪所吐出之處理液的一部分通過第1流路，從泵室被導入馬達室。被導入至馬達室之處理液通過馬達及第2流路、以及第3流路，從馬達室被導出至外部空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a submerged pump capable of removing liquefied gas remaining in a motor chamber. &lt;br/&gt; The submerged pump 1 according to the present invention includes a housing 2 that accommodates a rotary shaft 4 and an impeller 6. The housing includes a motor chamber 21, a pump chamber 20, a recess 24 disposed in the motor chamber, a first flow passage 23, 52, 7 disposed below a motor 3 and communicating with the motor chamber and the pump chamber, a second flow passage 25 disposed above the motor and communicating with the motor chamber and the external space S of the housing, and a third flow passage 26 communicating between the recess and the external space. A third flow passage opens to a portion 24a of an inner surface of the recess that is located at the lowest position. When the submerged pump is discharging pumped liquid, a portion of the pumped liquid discharged from the impeller passes through the first flow passage from the motor chamber and is introduced into the pump chamber. The pumped liquid introduced into the motor chamber passes through the motor, the second flow passage, and the third flow passage, and is discharged from the motor chamber to the external space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:沉水泵</p>  
        <p type="p">2a:周壁部</p>  
        <p type="p">2d:分隔壁部(分隔壁)</p>  
        <p type="p">2e:上表面</p>  
        <p type="p">2f:保持孔</p>  
        <p type="p">2g:外周面</p>  
        <p type="p">20:泵室</p>  
        <p type="p">21:馬達室</p>  
        <p type="p">23:軸承座(第1流路)</p>  
        <p type="p">23a:上部</p>  
        <p type="p">23b:下部</p>  
        <p type="p">24:凹部</p>  
        <p type="p">24a:底面(部分)</p>  
        <p type="p">26:排水孔(第3流路)</p>  
        <p type="p">26a:第1排水孔</p>  
        <p type="p">26b:第2排水孔</p>  
        <p type="p">26c:開口</p>  
        <p type="p">26d:開口</p>  
        <p type="p">27:孔口構件</p>  
        <p type="p">27a:節流孔(連通路徑)</p>  
        <p type="p">52:軸承(第1流路)</p>  
        <p type="p">7:推力平衡機構(第1流路)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2696" publication-number="202626696"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626696.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147600</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胜肽及包含有效載荷之共軛物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K7/08</main-classification>  
        <further-classification edition="201701120260401B">A61K47/54</further-classification>  
        <further-classification edition="200601120260401B">A61K51/08</further-classification>  
        <further-classification edition="200601120260401B">A61K51/04</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商肽夢想股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEPTIDREAM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里德　派翠克　克勞福德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REID, PATRICK CRAWFORD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳田勇人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGIDA, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稻葉紘子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INABA, HIROKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水越祥英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUKOSHI, YOSHIHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土田翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIDA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村秀智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, HIDETOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種胜肽與有效載荷之共軛物等，其具有CLDN18.2結合活性。[解決手段]一種共軛物等，其包含胜肽A2（ddab-Tbg-F4CON-Gthp-Y3Me-HeG-4Py-N-mCPeG-Cba-P-D-C（序列識別號136））等胜肽及有效載荷，其中，有效載荷包含螯合劑及放射性同位素的任一者或兩者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2697" publication-number="202628161"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628161.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147606</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子束成像設備的消像散方法、產品及設備</chinese-title>  
        <english-title>ASTIGMATISM CORRECTION METHOD OF ELECTRON BEAM IMAGING DEVICE, PRODUCT AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260113B">H01J37/153</main-classification>  
        <further-classification edition="200601120260113B">H01J37/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東方晶源微電子科技（北京）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGFANG JINGYUAN ELECTRON CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊彩虹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓春營</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甯豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈錫文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉成成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及半導體製造與檢測領域，特別是涉及一種電子束成像設備的消像散方法、產品及設備。該消像散方法包括：搜索電子束成像設備中消像散器的目標像散參數；按照設定步長對預調物鏡電流進行逐步調節，並採集不同物鏡電流對應的多張細聚焦圖像；計算多張細聚焦圖像在不同坐標軸方向上的梯度；根據梯度的一致性判斷目標像散參數是否符合消像散要求；若是，根據梯度確定電子束成像設備的目標物鏡電流。本揭露的消像散方法提高了消像散的準確性，從而提高了電子束成像設備的量測準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the field of semiconductor manufacturing and detection, and particularly to an astigmatism correction method of an electron beam imaging device, a product and an apparatus. The astigmatism correction method includes: searching a target astigmatism parameter of a stigmator in the electron beam imaging device; gradually adjusting a preset objective lens current according to a set step size, and collecting a plurality of fine focused images corresponding to different objective lens currents; calculating gradients of the plurality of fine focused images in different coordinate axis directions; judging whether the target astigmatism parameter meets an astigmatism correction requirement according to consistency of the gradients; and if yes, determining a target objective lens current of the electron beam imaging device according to the gradients. The astigmatism correction method according to the present invention improves astigmatism correction accuracy, thereby improving the measurement accuracy of the electron beam imaging device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S202:步驟</p>  
        <p type="p">S204:步驟</p>  
        <p type="p">S206:步驟</p>  
        <p type="p">S208:步驟</p>  
        <p type="p">S210:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2698" publication-number="202626562"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626562.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147623</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陶瓷成型用黏合劑組成物及陶瓷漿體組成物</chinese-title>  
        <english-title>BINDER COMPOSITION FOR CERAMIC MOLDING AND CERAMIC SLURRY COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C04B35/634</main-classification>  
        <further-classification edition="200601120260331B">C09J4/02</further-classification>  
        <further-classification edition="200601120260331B">C09J163/00</further-classification>  
        <further-classification edition="200601120260331B">C08G59/22</further-classification>  
        <further-classification edition="200601120260331B">C08G59/32</further-classification>  
        <further-classification edition="200601120260331B">C11D1/83</further-classification>  
        <further-classification edition="200601120260331B">H01G4/30</further-classification>  
        <further-classification edition="200601120260331B">H01G4/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOF CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高杉水晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASUGI, MIZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長澤敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASAWA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種陶瓷成型用黏合劑組成物，其可用於製造強度、柔軟性優異之陶瓷成型體。&lt;br/&gt; 本發明之解決手段為一種陶瓷成型用黏合劑組成物，係含有下述成分(A)及(B)，兩者之質量比(成分(A)/成分(B))為35/65~99.9/0.1。&lt;br/&gt; (A)酸價為10~160mgKOH/g之(甲基)丙烯酸系聚合物&lt;br/&gt; (B)環氧基當量為100~500g/eq.且每1分子之環氧基數為2~15個之多官能環氧化合物</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2699" publication-number="202627016"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627016.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫時固定用膜、暫時固定用積層體及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09J11/04</main-classification>  
        <further-classification edition="200601120260401B">C09J163/00</further-classification>  
        <further-classification edition="200601120260401B">C09J179/08</further-classification>  
        <further-classification edition="201801120260401B">C09J7/10</further-classification>  
        <further-classification edition="201801120260401B">C09J7/29</further-classification>  
        <further-classification edition="201801120260401B">C09J7/30</further-classification>  
        <further-classification edition="201801120260401B">C09J7/35</further-classification>  
        <further-classification edition="202601120260401B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮澤笑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAWA, EMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤須雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKASU, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榎本哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENOMOTO, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種暫時固定用膜，其用於暫時固定半導體構件與支撐構件，其中，該暫時固定用膜包含：（A）雙順丁烯二醯亞胺化合物；（B）熱固化性成分；及（C）填料，（B）成分包含（B-1）環氧樹脂，（C）成分的含量相對於（A）成分及（B-1）成分的合計100質量份為10質量份以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2700" publication-number="202627647"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627647.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147635</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光輸出產生的系統、方法及裝置</chinese-title>  
        <english-title>SYSTEMS, METHODS, AND DEVICES FOR OPTICAL OUTPUT GENERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G02F1/37</main-classification>  
        <further-classification edition="200601120260325B">G02F1/39</further-classification>  
        <further-classification edition="200601120260325B">G02B27/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＥＵＶ科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EUV TECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫辛　塞思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUSIN, SETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露的系統、方法及裝置可基於空間輪廓成形產生光輸出。裝置包括複數個光學元件，經配置以接收來自光源的第一光的光束，第一光具有第一波長，複數個光學元件經配置以將第一光的光束的空間分佈改變為環狀空間分佈。裝置包括聚焦元件，經配置以接收複數個光學元件的第一光輸出，且經配置以將環狀空間分佈聚焦至焦點處，作用介質基於焦點定位且經配置以基於第一光進行具有第二波長的第二光的高次諧波產生；及光學孔徑，經配置以阻擋穿過作用介質的第一光，且進一步經配置以將第二光作為第二光輸出來傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, methods, and devices disclosed herein generate optical outputs based on spatial profile shaping. Devices include a plurality of optical elements configured to receive a beam of a first light from a light source, the first light having a first wavelength, the plurality of optical elements being configured to change a spatial distribution of the beam of first light to an annular spatial distribution. Devices include a focusing element configured to receive a first optical output of the plurality of optical elements, and configured to focus the annular spatial distribution at a focal point, an interaction medium positioned based on the focal point and configured to undergo high-harmonic generation of a second light having a second wavelength based on the first light, and an optical aperture configured to block first light that passes through the interaction medium, and further configured to transmit the second light as a second optical output.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:光源</p>  
        <p type="p">104:光學裝置</p>  
        <p type="p">106:光輸出</p>  
        <p type="p">108:光學孔徑</p>  
        <p type="p">110:目標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2701" publication-number="202627035"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627035.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻組合物</chinese-title>  
        <english-title>ETCHING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K13/02</main-classification>  
        <further-classification edition="200601120260401B">C23F1/34</further-classification>  
        <further-classification edition="202601120260401B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏德勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, DEYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫啟蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, QIMENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種蝕刻單晶矽和多晶矽的蝕刻組合物。所述組合物包含水、有機溶劑、蝕刻劑、腐蝕抑制劑和螯合劑。該組合物與金屬銅和非金屬氮化矽、氧化矽等具有突出的相容性，更突出的是對銅離子具有優異的螯合能力，可以在去除晶圓表面或摻雜在表層單晶矽或多晶矽中銅離子，對單晶矽和多晶矽的蝕刻速率可控，操作條件溫和（在20℃~60℃的溫度即可滿足使用），並且蝕刻後的單晶矽或多晶矽的表面光滑，在半導體製造中的蝕刻領域具有廣泛的應用前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an etching composition for etching monocrystalline silicon and polycrystalline silicon. The composition comprises water, an organic solvent, an etching agent, a corrosion inhibitor, and a chelating agent. This composition exhibits outstanding compatibility with metallic copper and non-metallic materials such as silicon nitride and silicon oxide. Notably, it demonstrates excellent chelating capability for copper ions, enabling the removal of copper ions from the surface of the wafer or from the doped surface layers of monocrystalline or polycrystalline silicon. The etching rate of monocrystalline silicon and polycrystalline silicon is controllable, and the operating conditions are mild (operating temperatures between 20°C and 60°C are sufficient). Furthermore, the etched surfaces of monocrystalline or polycrystalline silicon are smooth. This composition has broad application prospects in the etching field of semiconductor manufacturing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2702" publication-number="202627768"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627768.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>外部輸入裝置、智慧型手機、資訊傳輸方法與控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">G06F3/01</main-classification>  
        <further-classification edition="201301120260330B">G06F3/048</further-classification>  
        <further-classification edition="200601120260330B">G06F1/16</further-classification>  
        <further-classification edition="202101120260330B">H04M1/724</further-classification>  
        <further-classification edition="200601120260330B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商機器人車庫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBO GARAGE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋智隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種輸入裝置，其於智慧型手機中不會產生輕彈操作之誤操作。外部輸入裝置包含：安裝部，其用於安裝於智慧型手機；通訊部，其用於與智慧型手機進行通訊；本體部，其包含通訊部；旋輪，其相對於本體部旋動自如地安裝，且不與智慧型手機之畫面接觸；及控制部，其以將基於旋輪之旋轉的旋轉資訊經由通訊部傳輸至智慧型手機之方式進行控制；且該外部輸入裝置安裝於以智慧型手機之顯示部所在之面為正面時之背面的右上方、且自智慧型手機之正面側觀察時可觀察到旋輪端部之一部分之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本體部</p>  
        <p type="p">11:旋輪</p>  
        <p type="p">12:安裝部</p>  
        <p type="p">13:軸</p>  
        <p type="p">100:外部輸入裝置</p>  
        <p type="p">d1:半徑</p>  
        <p type="p">d2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2703" publication-number="202627168"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627168.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含具有變化尺寸的路徑的排氣框，及相關設備及方法</chinese-title>  
        <english-title>GAS EXHAUST FRAMES INCLUDING PATHWAYS HAVING SIZE VARIATIONS, AND RELATED APPARATUS AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C23C16/44</main-classification>  
        <further-classification edition="202601120260320B">H10P72/00</further-classification>  
        <further-classification edition="200601120260320B">C30B25/00</further-classification>  
        <further-classification edition="200601120260320B">C30B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘迪　維許瓦思庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDEY, VISHWAS KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫拉迪安　雅拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORADIAN, ALA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華盛頓　羅莉Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WASHINGTON, LORI D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磊晶沉積腔室的實施例包括腔室主體、位於腔室主體內的上部視窗和下部視窗。此外，沉積腔室包括位於腔室主體中、在上部視窗和下部視窗之間的基板支撐件，使得處理體積界定在基板支撐件和上部視窗之間。此外，沉積腔室包括一個或多個熱源，配置成加熱處理體積；以及一個或多個氣體入口，通到處理體積中。再者，沉積腔室包括複數個排放路徑，用於排出處理體積。複數個排放路徑的每一個具有可調整的橫截面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment of an epitaxial deposition chamber includes a chamber body and an upper window and a lower window positioned in the chamber body. In addition, the deposition chamber includes a substrate support positioned in the chamber body, between the upper window and the lower window, so that a processing volume is defined between the substrate support and the upper window. Further, the deposition chamber includes one or more heat sources configured to heat the processing volume and one or more gas inlets into the processing volume. Still further, the deposition chamber includes a plurality of exhaust pathways out of the processing volume. Each of the plurality of exhaust pathways has an adjustable cross-sectional area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600A:排氣框</p>  
        <p type="p">600B:排氣框</p>  
        <p type="p">611A:排放路徑</p>  
        <p type="p">611B:排放路徑</p>  
        <p type="p">612A:排放路徑</p>  
        <p type="p">612B:排放路徑</p>  
        <p type="p">613A:排放路徑</p>  
        <p type="p">613B:排放路徑</p>  
        <p type="p">614A:排放路徑</p>  
        <p type="p">614B:排放路徑</p>  
        <p type="p">615A:排放路徑</p>  
        <p type="p">615B:排放路徑</p>  
        <p type="p">616A:第一端</p>  
        <p type="p">616B:第一端</p>  
        <p type="p">617A:第二端</p>  
        <p type="p">617B:第二端</p>  
        <p type="p">621A:第一外面</p>  
        <p type="p">621B:第一外面</p>  
        <p type="p">622A:第二外面</p>  
        <p type="p">622B:第二外面</p>  
        <p type="p">623A:第三外面</p>  
        <p type="p">623B:第三外面</p>  
        <p type="p">625A:弓形桿</p>  
        <p type="p">625B:弓形桿</p>  
        <p type="p">631A:支腳</p>  
        <p type="p">631B:支腳</p>  
        <p type="p">632A:支腳</p>  
        <p type="p">632B:支腳</p>  
        <p type="p">633A:支腳</p>  
        <p type="p">633B:支腳</p>  
        <p type="p">634A:支腳</p>  
        <p type="p">634B:支腳</p>  
        <p type="p">635A:支腳</p>  
        <p type="p">635B:支腳</p>  
        <p type="p">636A:支腳</p>  
        <p type="p">636B:支腳</p>  
        <p type="p">671:區塊</p>  
        <p type="p">672:區塊</p>  
        <p type="p">673:區塊</p>  
        <p type="p">674:區塊</p>  
        <p type="p">675:區塊</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">L1:長度</p>  
        <p type="p">RD1:徑向方向</p>  
        <p type="p">RP1:參考平面</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2704" publication-number="202628059"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628059.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251212B">G09G3/3233</main-classification>  
        <further-classification edition="202301120251212B">H10K59/40</further-classification>  
        <further-classification edition="202301120251212B">H10K59/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁禎烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNG YUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文泰亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, TAE HYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭柱熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, JU HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示面板包括：基板；設置在基板上的包括第一閘極電極、第一源極電極、第一汲極電極和第一主動層的開關電晶體；設置在基板上並與開關電晶體間隔開的包括第二閘極電極、第二源極電極、第二汲極電極和第二主動層的驅動電晶體；發光元件，其包括與驅動電晶體的第二源極電極和第二汲極電極之一導電連接的陽極、位於陽極上的發光層和位於發光層上的陰極；以及設置成將驅動電晶體的第二源極電極和第二汲極電極之一導電連接到陽極的中間電極。該第一主動層與陽極和中間電極中的至少一個重疊且該第二主動層的至少一部分不與陽極和中間電極重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display panel includes a substrate, a switching transistor disposed on the substrate and including a first gate electrode, a first source electrode, a first drain electrode, and a first active layer, a driving transistor disposed on the substrate to be spaced apart from the switching transistor and including a second gate electrode, a second source electrode, a second drain electrode, and a second active layer, a light-emitting element including an anode conductively connected to one electrode of the second source electrode and the second drain electrode of the driving transistor, an emission layer located on the anode, and a cathode located on the emission layer, an intermediate electrode configured to conductively connect the one electrode of the second source electrode and the second drain electrode of the driving transistor to the anode. The first active layer overlaps at least one of the anode and the intermediate electrode, and at least a portion of the second active layer does not overlap the anode and the intermediate electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">GL:閘極線</p>  
        <p type="p">SP:子像素</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">NA:非主動區</p>  
        <p type="p">10:顯示面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2705" publication-number="202626226"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626226.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147714</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鱗片狀銀粉及其製造方法以及使用鱗片狀銀粉之銀膠</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">B22F9/04</main-classification>  
        <further-classification edition="202201120260102B">B22F1/05</further-classification>  
        <further-classification edition="202201120260102B">B22F1/068</further-classification>  
        <further-classification edition="202201120260102B">B22F1/107</further-classification>  
        <further-classification edition="200601120260102B">H01B1/22</further-classification>  
        <further-classification edition="200601120260102B">H01B5/00</further-classification>  
        <further-classification edition="200601120260102B">H01B13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福田金屬箔粉工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA METAL FOIL &amp; POWDER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷知未来</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANICHI, MIKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田卓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種藉由以水為溶劑之濕式粉碎而可抑制對樹脂之不良影響之微細鱗片狀銀粉之製造方法。&lt;br/&gt; 為了解決上述課題，本發明提供一種鱗片狀銀粉之製造方法，其特徵在於：藉由對含有粒狀銀粉、以水為溶劑、且添加有HLB值為3.9～13、添加量為2～10重量%之非離子性界面活性劑之漿液實施濕式粉碎，而將前述粒狀銀粉鱗片化來獲得鱗片狀銀粉。又，前述鱗片狀銀粉之製造方法，其特徵在於，前述粒狀銀粉之D50%為0.1～3 μm，且前述鱗片狀銀粉之D50%為3 μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2706" publication-number="202628882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製程門移動裝置及半導體製程設備</chinese-title>  
        <english-title>PROCESS GATE MOVING DEVICE AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="202601120260302B">H10P72/30</further-classification>  
        <further-classification edition="202601120260302B">H10P95/90</further-classification>  
        <further-classification edition="200601120260302B">H05K7/20</further-classification>  
        <further-classification edition="200601120260302B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANG, YAO HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔祥天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONG, XIANG TIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉曉玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAO YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種製程門移動裝置及半導體製程設備，涉及半導體製備技術領域，所公開的製程門移動裝置包括箱體和移動機構，移動機構包括支撐部和移動部，支撐部設置在箱體中，移動部與支撐部滑動連接，箱體的側壁設有缺口，移動部可沿缺口的長度延伸方向移動，以帶動箱體外部的待傳輸部件執行相應的動作。藉由設置箱體，移動機構在運行過程中所產生的摩擦碎屑、潤滑脂揮發顆粒等污染物能夠被一定程度地約束在箱體中，從而降低了污染物擴散至箱體外部並對晶圓所在區域造成污染的概率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a process gate moving device and a semiconductor process equipment, relating to the technical field of semiconductor fabrication. The disclosed process gate moving device includes a housing and a moving mechanism. The moving mechanism includes a support part and a moving part, with the support part arranged inside the housing and the moving part slidably connected to the support part. The side wall of the housing is provided with a notch, and the moving part can move along the lengthwise direction of the notch to drive the component to be transferred outside the housing to perform corresponding actions. By providing the housing, contaminants such as friction debris and volatilized lubricant particles generated during the operation of the moving mechanism can be to a certain extent confined within the housing, thereby reducing the probability of contaminants spreading outside the housing and causing pollution in the area where the wafers are located.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製程門移動裝置</p>  
        <p type="p">110:箱體</p>  
        <p type="p">111:缺口</p>  
        <p type="p">112:進風口</p>  
        <p type="p">113:出風口</p>  
        <p type="p">120:支撐部</p>  
        <p type="p">130:移動部</p>  
        <p type="p">140:風機</p>  
        <p type="p">150:遮擋部</p>  
        <p type="p">160:驅動部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2707" publication-number="202627037"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627037.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇性蝕刻矽鍺材料的組合物</chinese-title>  
        <english-title>ETCHANT COMPOSITION FOR SELECTIVELY ETCHING SILICON-GERMANIUM MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K13/06</main-classification>  
        <further-classification edition="200601120260401B">C23F1/24</further-classification>  
        <further-classification edition="202601120260401B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡貝克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, BEIKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉玉鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種在半導體全環繞柵極電晶體（GAA）領域中蝕刻矽鍺犧牲層的蝕刻液組合物。所述組合物包括：氧化劑、蝕刻劑、腐蝕抑制劑、螯合劑、加速劑、溶劑和水。該組合物可用於7nm及更小技術節點的先進半導體蝕刻液領域，組合物中的氧化劑、蝕刻劑共同作用蝕刻SiGe材料，藉由添加有效的矽腐蝕抑制劑和螯合劑盡可能減少Si層損失，在最小程度損傷Si層的前提下，去除SiGe層，SiGe(25%)/Si蝕刻速率選擇比可達到100以上。該組合物蝕刻液在GAA領域具有廣泛的應用前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an etchant composition for etching a silicon-germanium (SiGe) sacrificial layer in the field of gate-all-around (GAA) transistors. The composition comprises: an oxidizing agent, an etchant, a corrosion inhibitor, a chelating agent, an accelerator, a solvent, and water. This composition can be applied in the advanced semiconductor etching field for technology nodes of 7nm and below. In the composition, the oxidizing agent and the etchant work together to etch the SiGe material. By adding an effective silicon corrosion inhibitor and a chelating agent, the loss of the silicon (Si) layer is minimized. Under the premise of causing minimal damage to the Si layer, the SiGe layer is removed, achieving an etching rate selectivity ratio of SiGe (25%)/Si of over 100. This etchant composition has broad application prospects in the GAA field.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2708" publication-number="202626879"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626879.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚亞芳基硫醚樹脂組成物、成型品、樹脂組成物的製造方法以及成型品的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260311B">C08G75/0204</main-classification>  
        <further-classification edition="200601120260311B">C08L81/02</further-classification>  
        <further-classification edition="200601120260311B">C08K5/521</further-classification>  
        <further-classification edition="201801120260311B">C08K3/011</further-classification>  
        <further-classification edition="200601120260311B">C08K7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋良尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YOSHIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤岡太一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAOKA, TAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾信吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及聚亞芳基硫醚樹脂組成物、成型品、樹脂組成物的製造方法、及成型品的製造方法。提供耐磨耗性且成型性優異的PAS樹脂成型品、能夠提供該成型品的PAS樹脂組成物以及它們的製造方法。更詳細而言，一種滑動構件用聚亞芳基硫醚樹脂組成物、包含其的成型品、以及它們的製造方法，前述滑動構件用聚亞芳基硫醚樹脂組成物是相對於在300℃下的V6黏度為250~3000Pa·s的聚亞芳基硫醚樹脂100質量份調配0.01~1質量份的熔點為300℃以上且平均粒徑100μm以下的有機系結晶促進劑而成的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2709" publication-number="202627844"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627844.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147807</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於對話內容推薦人工智慧消息的方法、電腦裝置以及電腦程式</chinese-title>  
        <english-title>METHOD, COMPUTER DEVICE, AND COMPUTER PROGRAM TO RECOMMEND AIMESSAGE BASED ON CONVERSATION CONTENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06F17/40</main-classification>  
        <further-classification edition="202301120260202B">G06Q30/0241</further-classification>  
        <further-classification edition="202301120260202B">G06Q30/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商連加股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINE PLUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慶憙秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYUNG, HEESU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芝水</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JISU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, HYUN JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河憲光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, HUNKWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及基於對話內容推薦人工智慧消息的方法、電腦裝置以及電腦程式。消息推薦方法包括：接收步驟，接收用戶所參與的聊天室的消息推薦請求；傳輸步驟，根據所述消息推薦請求向伺服器傳輸所述聊天室中所包含的消息中的部分消息；以及顯示步驟，從所述伺服器接收通過人工智慧並基於所述部分消息生成的AI消息來顯示在所述聊天室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310,S320,S330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2710" publication-number="202628859"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628859.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗液、半導體基板之清洗方法、半導體器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P70/00</main-classification>  
        <further-classification edition="200601120260324B">C09G1/02</further-classification>  
        <further-classification edition="200601120260324B">C23G1/06</further-classification>  
        <further-classification edition="200601120260324B">C23G1/10</further-classification>  
        <further-classification edition="200601120260324B">C11D1/83</further-classification>  
        <further-classification edition="200601120260324B">C11D1/28</further-classification>  
        <further-classification edition="200601120260324B">C11D1/74</further-classification>  
        <further-classification edition="200601120260324B">C11D1/70</further-classification>  
        <further-classification edition="200601120260324B">C11D7/06</further-classification>  
        <further-classification edition="200601120260324B">C11D7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹下祐太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKESHITA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種使用了氧化鈰粒子之CMP處理後的氧化鈰粒子的去除性優異且基板的溶解得到抑制之清洗液。本發明的清洗液為用於實施了化學機械研磨處理之半導體基板之清洗液，其含有：非離子性界面活性劑；以及選自由具有2個以上的羥基之還原劑及包含二硫鍵或硫醇基和羧基之還原劑組成之群組中之至少1種還原劑，pH為1.8以上且6.0以下，含氟化合物的含量相對於上述清洗液的總質量未達0.1質量%，上述非離子性界面活性劑的含量相對於上述清洗液的總質量為0.3～20質量%，或者上述非離子性界面活性劑的含量相對於上述還原劑的含量之質量比為1.00～100.00。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2711" publication-number="202626297"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626297.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者介面顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">B25J9/06</main-classification>  
        <further-classification edition="200601120260202B">B25J13/02</further-classification>  
        <further-classification edition="201301120260202B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用者介面顯示裝置。包括儲存部，可儲存操作機器人之動作程式；以及處理器；處理器可以在顯示裝置上顯示多個任務圖示，動作程式中一系列指令的多個部分由多個任務圖示分別對應，且多個任務圖示配置在依照動作程式之機器人之動作軌跡上的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:顯示畫面</p>  
        <p type="p">61:軌跡</p>  
        <p type="p">71,72,73:任務圖示</p>  
        <p type="p">20M:機械臂模型</p>  
        <p type="p">40M:工具模型</p>  
        <p type="p">201M,202M,203M:周邊設備模型</p>  
        <p type="p">WM:工件模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2712" publication-number="202626633"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626633.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>莫利司他鈉晶型、其製備方法和用途</chinese-title>  
        <english-title>CRYSTAL FORMS OF SODIUM MOLISTAT, PREPARATION METHOD AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D413/14</main-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61P13/12</further-classification>  
        <further-classification edition="200601120260401B">A61P7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海新禮泰藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI NEO-LEADING PHARMATECH CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應述歡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, SHU-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝起煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, QI-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范正飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, ZHENG-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒寶勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, BAO-QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉方國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, FANG-GUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及莫利司他鈉晶型、其製備方法和用途。本發明提供了1-[6-(嗎啉-4-基)嘧啶-4-基]-4-(1H-1,2,3-三唑-1-基)-1H-吡唑-5-酚鈉（即莫利司他鈉）的兩種晶型，其中晶型A的X射線粉末繞射圖在2θ值為17.1°±0.2°、24.2°±0.2°和26.6°±0.2°等處有特徵峰，晶型B的X射線粉末繞射圖在2θ值為6.5°±0.2°、9.7°±0.2°、16.5°±0.2°和26.6°±0.2°等處有特徵峰。本發明的莫利司他鈉晶型均具有溶解性好、穩定性好、生物利用度高更適合於工業化生產的優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to crystal forms of sodium molistat, preparation method and use thereof. The present invention provides two crystal forms of sodium 1-[6-(morpholin-4-yl)pyrimidin-4-yl]-4-(1H-1,2,3-triazol-1-yl)-1H-pyrazol-5-olate (i.e., sodium molistat), wherein the X-ray powder diffraction pattern of Crystal Form A has characteristic peaks at 2θ values of 17.1°±0.2°, 24.2°±0.2° and 26.6°±0.2°, among others, and the X-ray powder diffraction pattern of Crystal Form B has characteristic peaks at 2θ values of 6.5°±0.2°, 9.7°±0.2°, 16.5°±0.2° and 26.6°±0.2°, among others. The crystal forms of sodium molistat of the present invention all have the advantages of good solubility, good stability, high bioavailability and higher suitability for industrial production.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2713" publication-number="202626911"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626911.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147868</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙（２－羥基乙基）對苯二甲酸酯組成物、其製造方法及再生聚對苯二甲酸乙二酯組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C08J11/24</main-classification>  
        <further-classification edition="200601120260202B">C07C67/03</further-classification>  
        <further-classification edition="200601120260202B">C07C67/56</further-classification>  
        <further-classification edition="200601120260202B">C07C69/82</further-classification>  
        <further-classification edition="200601120260202B">C08G63/183</further-classification>  
        <further-classification edition="200601120260202B">C08L67/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林悠平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATARI, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧野正孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKINO, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種BHET組成物，其是將聚酯分解而獲得的雙(2-羥基乙基)對苯二甲酸酯（BHET）組成物，且特徵在於，利用分光光度計測定而得的360 nm～800 nm的峰值面積為0以上且10以下。較佳為將所述BHET組成物在95℃下混合於相對於BHET組成物而為40倍量的水中時的不溶成分的質量相對於BHET組成物的質量而為1%以上。較佳為將所述BHET組成物在95℃下混合於相對於所述BHET組成物而為40倍量的水中時的不溶成分為聚對苯二甲酸乙二酯（PET）寡聚物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2714" publication-number="202628220"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628220.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充放電控制電路、充放電控制裝置、及電池裝置</chinese-title>  
        <english-title>CHARGE/DISCHARGE CONTROL CIRCUIT, CHARGE/DISCHARGE CONTROL DEVICE, AND BATTERY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">H01M10/44</main-classification>  
        <further-classification edition="202001120260202B">G01R31/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商艾普凌科有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABLIC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福地晋也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUCHI, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種在進行UVLO的檢測的情況下可抑制電路規模的充放電控制電路、充放電控制裝置、及電池裝置。一種充放電控制電路（30），包括：UVLO檢測電路（31），與正極電源輸入端子（C1）連接，並對正極電源輸入端子（C1）的電壓小於UVLO檢測電壓的情況進行檢測；負載短路檢測電路（37），與過電流檢測端子（C3）連接，並對過電流檢測端子（C3）的電壓進行檢測；放電控制部（A2），進行根據從負載短路檢測電路（37）輸出的負載短路檢測信號來關斷放電控制用FET（21）的控制；UVLO遮罩部（A3），利用從負載短路檢測電路（37）輸出的負載短路檢測信號來遮罩從UVLO檢測電路（31）輸出的UVLO檢測信號；以及內部電路導通關斷控制電路（34），基於從UVLO遮罩部（A3）輸出的信號來控制內部電路的導通關斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In the case of performing UVLO detection, the circuit scale is suppressed. A charge/discharge control circuit (30) includes: a UVLO detection circuit (31) which is connected to a positive power input terminal (C1) and detects that voltage of the positive power input terminal (C1) is less than UVLO detection voltage; a load short circuit detection circuit (37) which is connected to an overcurrent detection terminal (C3) and detects voltage of the overcurrent detection terminal (C3); a discharge control part (A2) which performs control to turn off a discharge control FET (21) in response to a load short circuit detection signal output from the load short circuit detection circuit (37); a UVLO mask part (A3) which masks a UVLO detection signal output from the UVLO detection circuit (31) by a load short circuit detection signal output from the load short circuit detection circuit (37); and an internal circuit on/off control circuit (34) which controls on/off of an internal circuit based on a signal output from the UVLO mask part (A3).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池裝置</p>  
        <p type="p">11:電池</p>  
        <p type="p">12:過電流檢測用傳感電阻器</p>  
        <p type="p">13:短路負載</p>  
        <p type="p">14:開關</p>  
        <p type="p">20:充放電控制裝置</p>  
        <p type="p">21:放電控制用FET</p>  
        <p type="p">22:充電控制用FET</p>  
        <p type="p">30:充放電控制電路</p>  
        <p type="p">31:UVLO檢測電路</p>  
        <p type="p">32:反相器</p>  
        <p type="p">33:AND電路</p>  
        <p type="p">34:內部電路導通關斷控制電路</p>  
        <p type="p">35:偏壓電路</p>  
        <p type="p">36:內部低耐壓元件用電源電路</p>  
        <p type="p">37:負載短路檢測電路</p>  
        <p type="p">38:POC電路</p>  
        <p type="p">39:放電過電流狀態控制鎖存電路</p>  
        <p type="p">40:延遲電路</p>  
        <p type="p">41:DO控制電路</p>  
        <p type="p">A1:充放電控制部</p>  
        <p type="p">A2:放電控制部</p>  
        <p type="p">A3:UVLO遮罩部</p>  
        <p type="p">C1:正極電源輸入端子</p>  
        <p type="p">C2:負極電源輸入端子</p>  
        <p type="p">C3:過電流檢測端子</p>  
        <p type="p">C4:外部電壓輸入端子</p>  
        <p type="p">C5:放電控制用FET閘極連接端子</p>  
        <p type="p">C6:充電控制用FET閘極連接端子</p>  
        <p type="p">VDD、VINI、VM、VSS:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2715" publication-number="202626574"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626574.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147873</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組成物、圖案形成方法及感放射線性酸產生劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07C25/18</main-classification>  
        <further-classification edition="200601120260302B">C07C43/225</further-classification>  
        <further-classification edition="200601120260302B">C07C309/12</further-classification>  
        <further-classification edition="200601120260302B">C07C309/42</further-classification>  
        <further-classification edition="200601120260302B">C07C381/12</further-classification>  
        <further-classification edition="200601120260302B">C07D317/70</further-classification>  
        <further-classification edition="200601120260302B">C07D333/76</further-classification>  
        <further-classification edition="200601120260302B">C07F9/12</further-classification>  
        <further-classification edition="200601120260302B">C07F9/40</further-classification>  
        <further-classification edition="200601120260302B">C09K3/00</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification>  
        <further-classification edition="200601120260302B">G03F7/32</further-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification>  
        <further-classification edition="202601120260302B">H10W20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部真也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田垣安宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTAGAKI, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於圖案形成時可以充分的水準發揮感度、CDU及顯影缺陷抑制性的感放射線性組成物、圖案形成方法及感放射線性酸產生劑。一種感放射線性組成物，含有：感放射線性酸產生劑，具有有機酸根陰離子與有機陽離子；聚合物，包含具有酸解離性基的結構單元；及溶劑，選自由所述有機酸根陰離子及所述有機陽離子所組成的群組中的至少一種包含下述式（i）所表示的部分結構（i）。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="205px" width="235px" file="ed10059.JPG" alt="ed10059.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（i）中，R&lt;sup&gt;1&lt;/sup&gt;為氫原子、或者經取代或未經取代的碳數1～10的一價烴基；*為與感放射線性酸產生劑中的所述部分結構（i）以外的其他部分的鍵結鍵）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2716" publication-number="202627536"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627536.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">G02B3/00</main-classification>  
        <further-classification edition="202101120260223B">G02B7/02</further-classification>  
        <further-classification edition="200601120260223B">G02B9/64</further-classification>  
        <further-classification edition="200601120260223B">G02B11/34</further-classification>  
        <further-classification edition="200601120260223B">G02B15/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張相鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SANG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光學成像系統包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡、以及第八透鏡，沿著光軸朝向成像平面依序設置，其中第一透鏡具有正屈光力，第二透鏡具有負屈光力，以及第三透鏡具有正屈光力，以及滿足0.95 ＜ (TTL/(2×IMG HT))×Fno ＜ 1.00和6.9 ＜ TTL/BFL ＜ 8.5，其中TTL為沿著光軸從第一透鏡的物方表面到成像平面的距離，IMG HT為成像平面的對角線長度的一半，Fno為光學成像系統的F值，以及BFL為沿著光軸從第八透鏡的像方表面到成像平面的距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens sequentially disposed along an optical axis toward an imaging plane, wherein the first lens has a positive refractive power, the second lens has a negative refractive power, and the third lens has a positive refractive power, and 0.95 ＜ (TTL/(2×IMG HT))×Fno ＜ 1.00 and 6.9 ＜ TTL/BFL ＜ 8.5 are satisfied, where TTL is a distance along the optical axis from an object-side surface of the first lens to the imaging plane, IMG HT is one half of a diagonal length of the imaging plane, Fno is an F-number of the optical imaging system, and BFL is a distance along the optical axis from an image-side surface of the eighth lens to the imaging plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:第八透鏡</p>  
        <p type="p">IF:濾光片</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">ST:光闌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2717" publication-number="202626899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含碳同素異形體層的產品的製造方法、該產品及其用途</chinese-title>  
        <english-title>METHOD FOR PRODUCING PRODUCT COMPRISING CARBON ALLOTROPE LAYER, PRODUCT, AND USE OF PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260401B">C08J7/04</main-classification>  
        <further-classification edition="200601120260401B">C08J7/12</further-classification>  
        <further-classification edition="200601120260401B">C12Q1/00</further-classification>  
        <further-classification edition="200601120260401B">G01N27/327</further-classification>  
        <further-classification edition="200601120260401B">G01N33/53</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification>  
        <further-classification edition="201701120260401B">C01B32/15</further-classification>  
        <further-classification edition="201101120260401B">B82Y15/00</further-classification>  
        <further-classification edition="201101120260401B">B82Y30/00</further-classification>  
        <further-classification edition="201101120260401B">B82Y40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商卡纳圖芬蘭有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANATU FINLAND OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜萊　塞繆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DULAY, SAMUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭塔塔羅　塞繆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANTATARO, SAMUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊　納倫德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOON, NARENDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種含基板及連接於基板表面之碳同素異形體層的產品的製造方法。該方法包括提供一個基板、在基板表面上產生官能基、透過共價鍵將第一分子鍵結於至少一個官能基、以及在將第一分子鍵結於至少一個官能基之後，將碳同素異形體層施加於基板表面上。本揭露亦關於一種產品，該產品包含一個基板，其表面具有官能基、透過共價鍵鍵結於至少一個官能基的第一分子、以及碳同素異形體層，其中該碳同素異形體層透過第一分子連接於基板表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a method for producing a product comprising a substrate and a carbon allotrope layer connected to a surface of the substrate. The method comprises providing a substrate, generating functional groups on the surface of the substrate, bonding a first molecule to at least one of the functional groups through covalent bonding, and applying a carbon allotrope layer on the surface of the substrate after bonding the first molecule to at least one of the functional groups. The disclosure relates also to a product comprising a substrate having a surface comprising functional groups, a first molecule bonded to at least one of the functional groups through covalent bonding, and a carbon allotrope layer; wherein the carbon allotrope layer is connected to the surface of the substrate with the first molecule.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2718" publication-number="202628526"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628526.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機櫃安裝用轉接器及伺服器監視系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">H05K7/14</main-classification>  
        <further-classification edition="200601120251211B">G06F11/30</further-classification>  
        <further-classification edition="200601120251211B">G06K19/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商軟銀股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOFTBANK CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>右田和彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIGITA, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於，提供一種存儲用於謀求資料中心的伺服器之監視省力化、效率化的伺服器的機櫃安裝用轉接器。本發明之解決手段在於，一種用於在收容複數台伺服器之機櫃中存儲伺服器並將其安裝至機櫃的機櫃安裝用轉接器，該機櫃安裝用轉接器具備：電源連接器部，其與機櫃側之電力供給部連接，並向伺服器側供給電力；信號連接器部，其與機櫃側之信號供給部連接，並在伺服器側與機櫃側之間收發信號；及顯示部，其在機櫃用轉接器之外部顯示已存儲的伺服器之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:伺服器</p>  
        <p type="p">10:機櫃安裝用轉接器</p>  
        <p type="p">12:框體部</p>  
        <p type="p">13:電源連接器部</p>  
        <p type="p">14:信號連接器部</p>  
        <p type="p">15:冷卻連接器部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2719" publication-number="202628780"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628780.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱電模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">H10N10/17</main-classification>  
        <further-classification edition="202301120260102B">H10N10/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池和浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種熱電模組，其包括：第1基板，其包括第1主面；第2基板，其包括以與前述第1主面對向之方式配置之第2主面；複數個熱電元件，其等配置於前述第1主面與前述第2主面之間；及電極，其配置於前述第1主面，且連接有前述複數個熱電元件中之第1熱電元件及第2熱電元件。於前述第1主面配置有絕緣層，前述絕緣層包含：第1部分，其以圍繞前述電極之方式且與前述電極分離地配置；及第2部分，其配置於前述第1熱電元件與前述第2熱電元件之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:熱電模組</p>  
        <p type="p">110:絕緣層</p>  
        <p type="p">110a:部分</p>  
        <p type="p">110b:部分</p>  
        <p type="p">111:基板</p>  
        <p type="p">112:電極</p>  
        <p type="p">113:接合材</p>  
        <p type="p">114:主面</p>  
        <p type="p">121:基板</p>  
        <p type="p">122:電極</p>  
        <p type="p">123:接合材</p>  
        <p type="p">124:主面</p>  
        <p type="p">130n:N型熱電元件</p>  
        <p type="p">130p:P型熱電元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2720" publication-number="202627643"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627643.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光單元、液晶顯示裝置及資訊設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G02F1/13357</main-classification>  
        <further-classification edition="200601120260102B">G02B5/02</further-classification>  
        <further-classification edition="200601120260102B">G02B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商惠和股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIWA INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹賢太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開旨在提供一種新型的背光單元。本公開的一個方案所關於的背光單元（40）包括：導光板（43）、至少一個光源（41）、具有由沿第一方向（d12）延伸的多個棱鏡（64a）構成的第一棱鏡結構（64）及光擴散結構（65）的第一片材（44）、具有由沿第二方向（d13）延伸的多個棱鏡（45a）構成的第二棱鏡結構的第二片材（45）、以及具有由沿第三方向延伸的多個棱鏡（46a）構成的第三棱鏡結構的第三片材（46），導光板的光入射面延伸方向（d11）與第一方向在俯視時實質上平行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:背光單元</p>  
        <p type="p">41:光源</p>  
        <p type="p">42:反射片</p>  
        <p type="p">43:導光板</p>  
        <p type="p">43a:柱狀透鏡</p>  
        <p type="p">44:第一片材</p>  
        <p type="p">45:第二片材</p>  
        <p type="p">45a:棱鏡</p>  
        <p type="p">46:第三片材</p>  
        <p type="p">46a:棱鏡</p>  
        <p type="p">46b:突起</p>  
        <p type="p">47:光源層</p>  
        <p type="p">48:光</p>  
        <p type="p">62a:光出射面</p>  
        <p type="p">63a:光入射面</p>  
        <p type="p">64a:棱鏡</p>  
        <p type="p">d1:導光方向</p>  
        <p type="p">d11:導光板的光入射面延伸方向</p>  
        <p type="p">d12:第一方向</p>  
        <p type="p">d13:第二方向</p>  
        <p type="p">d14:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2721" publication-number="202627051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147929</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積垢單元、積垢裝置、氫化反應器以及積垢方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C10G45/04</main-classification>  
        <further-classification edition="202301120260325B">C02F1/28</further-classification>  
        <further-classification edition="202301120260325B">C02F1/44</further-classification>  
        <further-classification edition="202301120260325B">C02F1/52</further-classification>  
        <further-classification edition="202301120260325B">C02F9/00</further-classification>  
        <further-classification edition="200601120260325B">B01D61/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁勝華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, SHENGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴寒雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, HANXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIWU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種積垢單元（1），包括：內部筒體（11），所述內部筒體（11）由網狀結構形成，限定中心軸線（20）且包括圓柱形內部容積（113）；和多個曲面折流板（12），所述多個曲面折流板（12）圍繞所述內部筒體（11）沿周向均勻分佈，從所述內部筒體（11）的外周邊向外延伸，從而在相鄰的曲面折流板（12）之間形成環形流道。。本發明還涉及包括積垢單元（1）的積垢裝置、包括積垢裝置的氫化反應器（100）和使用積垢裝置的積垢方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:曲面折流板</p>  
        <p type="p">111:內環</p>  
        <p type="p">112:外環</p>  
        <p type="p">120:漸開式流道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2722" publication-number="202628250"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628250.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器組件及線端連接器</chinese-title>  
        <english-title>CONNECTOR ASSEMBLY AND CABLE-END CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260226B">H01R9/16</main-classification>  
        <further-classification edition="200601120260226B">H01R9/24</further-classification>  
        <further-classification edition="201101120260226B">H01R12/70</further-classification>  
        <further-classification edition="201101120260226B">H01R12/75</further-classification>  
        <further-classification edition="200601120260226B">H01R13/02</further-classification>  
        <further-classification edition="200601120260226B">H01R13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾威勒電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器組件包含匯流排夾式連接器、複數個線端連接器、複數個第一導電連接件以及複數個第二導電連接件。第一導電連接件連接線端連接器中之一者與匯流排夾式連接器之一側。第二導電連接件連接線端連接器中之另一者與匯流排夾式連接器之另一側。匯流排夾式連接器以及線端連接器分別配置以連接機殼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector assembly includes a busbar clip (BBC) connector, a plurality of cable-end connectors, a plurality of first conductive connecting pieces and a plurality of second conductive connecting pieces. The first conductive connecting pieces are connected with one of the cable-end connectors and a side of the BBC connector. The second conductive connecting pieces are connected with another one of the cable-end connectors and another side of the BBC connector. The BBC connector and the cable-end connectors are respectively configured to connect to a chassis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接器組件</p>  
        <p type="p">110:匯流排夾式連接器</p>  
        <p type="p">111:端子組</p>  
        <p type="p">130:第一導電連接件</p>  
        <p type="p">131:第一連接段</p>  
        <p type="p">131a:第一子連接段</p>  
        <p type="p">131b:第二子連接段</p>  
        <p type="p">132:第二連接段</p>  
        <p type="p">132a:第三子連接段</p>  
        <p type="p">132b:第四子連接段</p>  
        <p type="p">133:第一延伸段</p>  
        <p type="p">140:第二導電連接件</p>  
        <p type="p">141:第三連接段</p>  
        <p type="p">141a:第五子連接段</p>  
        <p type="p">141b:第六子連接段</p>  
        <p type="p">142:第四連接段</p>  
        <p type="p">142a:第七子連接段</p>  
        <p type="p">142b:第八子連接段</p>  
        <p type="p">143:第二延伸段</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">HD:高度差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2723" publication-number="202626018"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626018.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預防、緩解或治療周邊神經病變之組成物及其用途</chinese-title>  
        <english-title>COMPOSITION AND USE THEREOF FOR PREVENTING, ALLEVIATING, OR TREATING PERIPHERAL NEUROPATHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/045</main-classification>  
        <further-classification edition="200601120260102B">A61K31/343</further-classification>  
        <further-classification edition="200601120260102B">A61K31/513</further-classification>  
        <further-classification edition="200601120260102B">A61P25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG SHAN MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃相碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHIANG-SUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種TRPM8活化劑之用途，用於製備預防、緩解或治療有其需要之個體的周邊神經病變之組成物。一種預防、緩解或治療周邊神經病變之組成物，其包含：有效量之TRPM8活化劑以及醫藥上或化妝品上可接受之載劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a use of a TRPM8 activator in the manufacture of a composition for preventing, alleviating, or treating peripheral neuropathy in a subject in need thereof. A composition for preventing, alleviating, or treating peripheral neuropathy includes: an effective amount of the TRPM8 activator; and a pharmaceutically or cosmetically acceptable carrier.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2724" publication-number="202626677"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626677.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍶化合物、使用其製造含鍶薄膜及半導體裝置之方法</chinese-title>  
        <english-title>STRONTIUM COMPOUND, METHOD OF MANUFACTURING THIN FILM CONTAINING STRONTIUM AND SEMICONDUCTOR DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F3/00</main-classification>  
        <further-classification edition="200601120260401B">C23C16/40</further-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="202601120260401B">H10P14/692</further-classification>  
        <further-classification edition="202601120260401B">H10W20/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鐘元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JONG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉夫丘克　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRAVCHUK, DMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺勇碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, YONGSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭璂靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, KIJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元重喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WON, JOONGHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白鐵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAIK, CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金會潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HWEA YOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭丞燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, SEUNG-YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓珵任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JUNG IM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔泰溱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TAE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴英材</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YOUNGJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鍶化合物、一種利用該鍶化合物製造一薄膜之方法，以及一種製造包括該薄膜之一半導體裝置之方法。&lt;br/&gt; 該鍶化合物由化學式1表示：&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="63px" width="198px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; 在化學式1中，n、L&lt;sub&gt;1&lt;/sub&gt;、L&lt;sub&gt;2&lt;/sub&gt;、A及m如本文所定義。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A strontium compound, a method of making a thin film with the strontium compound, and a method of manufacturing a semiconductor device including the thin film.&lt;br/&gt; The strontium compound is represented by Chemical Formula 1:&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="65px" width="208px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; In Chemical Formula 1, n, L&lt;sub&gt;1&lt;/sub&gt;, L&lt;sub&gt;2&lt;/sub&gt;, A, and m are as defined herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2725" publication-number="202625944"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625944.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148061</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>洗米煮飯機</chinese-title>  
        <english-title>RICE WASHING AND COOKING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260227B">A47J27/00</main-classification>  
        <further-classification edition="200601120260227B">A47J43/24</further-classification>  
        <further-classification edition="200601120260227B">A47J36/00</further-classification>  
        <further-classification edition="200601120260227B">A47J27/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商井關農機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISEKI &amp; CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野寺佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONODERA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川端英臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABATA, HIDETOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弓達武志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUDATE, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越智輝久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHI, TERUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩井通和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAI, MICHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大家生裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OIE, IKUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於在洗米煮飯機中進一步縮短洗米工序與煮飯工序的合計時間。本發明提供一種洗米煮飯機，係具備：單個儲米箱，係收容米；單個洗米機，係對米進行清洗；以及複數個煮飯鍋；儲米箱與洗米機成為一體地在煮飯鍋的上方移動，從洗米機向預定的煮飯鍋供給米以及水；洗米煮飯機係能夠選擇通常連續模式與省時連續模式；在通常連續模式中，進行包含將用於煮飯的計量後的米向洗米機供給的計量工序、利用洗米機進行洗米的洗米工序、洗米工序後的浸泡工序、利用煮飯鍋進行的煮飯工序、煮飯工序後的利用煮飯鍋進行的燜蒸工序在內的一系列的洗米煮飯運轉，連續進行所設定的鍋數的洗米煮飯運轉；在省時連續模式中，省略一系列的洗米煮飯運轉中的燜蒸工序，以比通常連續模式短的循環連續進行所設定的鍋數的洗米煮飯運轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The objective of the present invention is to further reduce the total time of the rice washing process and the rice cooking process in a rice washing and cooking machine. The present invention provides a rice washing and cooking machine, comprising: a single rice storage box configured for containing rice, a single rice washing machine configured for washing the rice, and a plurality of rice cooking pots. The rice storage box and the rice washing machine are integrated to move above the plurality of rice cooking pots, and rice and water are supplied from the rice washing machine to the designated rice cooking pot. The rice washing and cooking machine is characterized in that a normal continuous mode and a time-saving continuous mode can be selected. In the normal continuous mode, a series of rice washing and cooking operations including a measuring step of supplying measured rice for cooking to the rice washing machine, a rice washing step of washing the rice using the rice washing machine, a soaking step after the rice washing step, a rice cooking step using the plurality of rice cooking pots, and a steaming step using the plurality of rice cooking pots after the rice cooking step are performed, and a set number of pots of rice washing and cooking operations are continuously performed; in the time-saving continuous mode, the steaming step in the series of rice washing and cooking operations is omitted, and the set number of pots of rice washing and cooking operations are continuously performed in a cycle shorter than that of the normal continuous mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">a,b:浸泡工序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2726" publication-number="202627077"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627077.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＣＡＲ—Ｔ細胞之高通量製造及篩選</chinese-title>  
        <english-title>HIGH-THROUGHPUT MANUFACTURING AND SCREENING OF CAR-T CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N5/0783</main-classification>  
        <further-classification edition="200601120260401B">C12N15/86</further-classification>  
        <further-classification edition="200601120260401B">C07K14/725</further-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱特製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITE PHARMA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡洛　亞歷山德羅　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALO, ALESSANDRO P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱南　妮可　Ｍ　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANNON, NICOLE M. W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約德　肖恩　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YODER, SEAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述可自動化高通量程序，其用於製造及篩選經工程改造之T細胞，諸如嵌合抗原受體(CAR)-T細胞及TCR-T細胞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described here are automatable high-throughput processes for manufacturing and screening engineered T cells, such as chimeric antigen receptor (CAR)-T cells and TCR-T cells.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2727" publication-number="202626113"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626113.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藥物組合及其用途和治療方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61K38/47</further-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">C07K16/32</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李如玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　家驊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JIAHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙曦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">涉及藥物組合及其用途和治療方法。具體涉及抗Trop-2抗體藥物偶聯物、抗Her2抗體藥物偶聯物和抗Her2抗體或其抗原結合片段中的兩種或更多種的組合及其預防和/或治療癌症的方法和在製備預防和/或治療癌症的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2728" publication-number="202626506"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626506.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽溶膠顆粒的處理方法與矽溶膠顆粒</chinese-title>  
        <english-title>METHOD FOR TREATING SILICA SOL PARTICLES AND SILICA SOL PARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C01B33/141</main-classification>  
        <further-classification edition="200601120260204B">C08J3/16</further-classification>  
        <further-classification edition="200601120260204B">C09K3/14</further-classification>  
        <further-classification edition="200601120260204B">C08J5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁一倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, YILUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹先升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, XIANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旭萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, XUPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WENKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種矽溶膠顆粒的處理方法，該方法包括：提供初始矽溶膠，並離心初始矽溶膠，棄去上清液，保留第一沉澱物；向所述第一沉澱物中加入鹼性清洗液，並進行分散得到分散液；離心所述分散液，並棄去其上清液，保留第二沉澱物；向所述第二沉澱物中加入鹼溶液，並重新分散，以去除部分或全部鬆散矽物種，得到目標矽溶膠。實現了在保證矽溶膠顆粒粒徑基本不變的基礎上，極大提升了矽溶膠的穩定性的技術效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a method for treating silica sol particles, which includes the following steps: providing an initial silica sol and centrifuging the initial silica sol to discard the supernatant and retain the first precipitate; adding an alkaline cleaning solution to the first precipitate and dispersing it to obtain a dispersion; centrifuging the dispersion and discarding the supernatant to retain the second precipitate; adding an alkaline solution to the second precipitate and redispersing it to remove part or all of the loose silicon species, thereby obtaining the target silica sol. This method achieves the technical effect of significantly improving the stability of the silica sol while essentially maintaining the particle size of the silica sol particles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2729" publication-number="202627060"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627060.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗液</chinese-title>  
        <english-title>CLEANING SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C11D7/06</main-classification>  
        <further-classification edition="200601120260302B">C11D7/08</further-classification>  
        <further-classification edition="200601120260302B">C11D7/26</further-classification>  
        <further-classification edition="200601120260302B">C11D7/32</further-classification>  
        <further-classification edition="200601120260302B">C11D7/34</further-classification>  
        <further-classification edition="200601120260302B">C11D7/50</further-classification>  
        <further-classification edition="200601120260302B">C23F11/12</further-classification>  
        <further-classification edition="200601120260302B">C23F11/14</further-classification>  
        <further-classification edition="200601120260302B">C23F11/16</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戚哮嘯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QI, XIAOXIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時英坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YINGKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種清洗液，包括：有機溶劑，有機鹼，金屬腐蝕抑制劑，螯合劑，氧化劑和水。本發明利用添加有合理配比的有機鹼，金屬腐蝕抑制劑，螯合劑，氧化劑的清洗液，可以在去除氮化鈦硬掩模和光致抗蝕劑蝕刻殘留物的同時，抑制對銅、鈷及非金屬（低k介電材料）的腐蝕，而且可以延長清洗液使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a cleaning solution comprising: an organic solvent, an organic base, a metal corrosion inhibitor, a chelating agent, an oxidizing agent, and water. The cleaning solution of the invention, with the addition of an organic base, a metal corrosion inhibitor, a chelating agent, and an oxidizing agent in a rationally proportioned ratio, can remove titanium nitride hard mask and photoresist etching residues while inhibiting corrosion of copper, cobalt, and non-metals (low-k dielectric materials), and can also extend the service life of the cleaning solution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2730" publication-number="202628108"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628108.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體讀取電路</chinese-title>  
        <english-title>MEMORY READ OUT CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G11C16/26</main-classification>  
        <further-classification edition="200601120260202B">G11C16/32</further-classification>  
        <further-classification edition="200601120260202B">G11C7/06</further-classification>  
        <further-classification edition="200601120260202B">G11C7/22</further-classification>  
        <further-classification edition="200601120260202B">G11C7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體讀取電路，包括感測模組、輸出模組和升壓單元。感測模組用以感測儲存在記憶體單元中的資料，以根據第一供應電壓產生輸出資料訊號。輸出模組包括緩衝器並用以穩定輸出輸出資料訊號。升壓單元用以在感測模組開始感測資料之前，提供第一供應電壓給該等緩衝器之至少一者，並在感測模組感測資料時，提供比第一供應電壓大的第二供應電壓給該等緩衝器之該至少一者，從而提高記憶體讀取電路的讀取速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory read out circuit includes a sensing module, an output module, and a voltage boost unit. The sensing module is configured to sense a data stored in a memory cell to generate an output data signal according to a first supply voltage. The output module includes buffers and configured to output the output data signal stably. The voltage boost unit is configured to provide the first supply voltage to at least one of the buffers before the sensing module begins to sense the data, and provide a second supply voltage greater than the first supply voltage to the at least one of the buffers when the sensing module senses the data so as to raise a reading speed of the memory read out circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:記憶體讀取電路</p>  
        <p type="p">20:記憶體陣列</p>  
        <p type="p">100:感測模組</p>  
        <p type="p">200:升壓單元</p>  
        <p type="p">300:輸出模組</p>  
        <p type="p">DIN:資料</p>  
        <p type="p">DOUT:輸出資料訊號</p>  
        <p type="p">SAOUT:感測資料訊號</p>  
        <p type="p">VDD:供應電壓</p>  
        <p type="p">VDDH:供應電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2731" publication-number="202626681"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626681.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成低介電常數含氮化硼薄膜的前體及利用其形成低介電常數含氮化硼薄膜的方法</chinese-title>  
        <english-title>PRECURSOR FOR FORMING LOW-K BORON NITRIDE-CONTAINING THIN FILM AND METHOD FOR FORMING LOW-K BORON NITRIDE-CONTAINING THIN FILM USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07F5/02</main-classification>  
        <further-classification edition="200601120260302B">C23C16/34</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="202601120260302B">H10P14/60</further-classification>  
        <further-classification edition="202601120260302B">H10P14/694</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商思科特利肯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK TRICHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾律</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG RYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭洙鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, SOO YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴炳鋋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BYEONG YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴容主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金韓㔡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAN BYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛晳熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, SEOK HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及含具有低介電常數（low-k）特性的氮化硼的用於形成薄膜的前體及利用其形成低介電常數含氮化硼薄膜的方法，具體而言，涉及可以利用包含脒基（amidinate group）的新型結構的化合物作為含氮化硼的用於形成薄膜的前體以形成優質的低介電常數薄膜的前體及利用所述前體形成含氮化硼薄膜的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2732" publication-number="202626682"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626682.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、組成物、光學構件、色轉換構件、光吸收構件以及包含其的光源單元、顯示器及照明裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F5/02</main-classification>  
        <further-classification edition="200601120260401B">C09K11/06</further-classification>  
        <further-classification edition="200601120260401B">G02B5/20</further-classification>  
        <further-classification edition="201601120260401B">F21S2/00</further-classification>  
        <further-classification edition="202301120260401B">H10K50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>境野裕健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAINO, HIROTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早朝愛美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAASA, MANAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">作為本發明的一態樣的化合物為下述通式（1）所表示的化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="137px" width="232px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（於通式（1）中，R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;9&lt;/sup&gt;選自由氫原子、烷基、環烷基、雜環基、烯基、環烯基、炔基、芳基、雜芳基、羥基、硫醇基、烷氧基、烷硫基、芳基醚基、芳硫基醚基、鹵素、氰基、醛基、羰基、羧基、氧基羰基、酯基、胺甲醯基、醯胺基、磺醯基、磺酸酯基、磺醯胺基、胺基、亞胺基、硝基、矽烷基、矽氧烷基、氧硼基及氧化膦基所組成的群組中。R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;9&lt;/sup&gt;中相互鄰接的基可連結而形成環結構。R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;7&lt;/sup&gt;中至少一個為包含二羧酸酐結構的基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:光學構件</p>  
        <p type="p">10:基材層</p>  
        <p type="p">11:光學功能層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2733" publication-number="202627452"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627452.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測設備和檢測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G01N21/88</main-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>京城中安半導體設備（北京）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JINGCHENG ZHONGAN SEMICONDUCTOR EQUIPMENT (BEIJING) LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, CHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張飛揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, FEIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一實施例提供的一種檢測設備包括光源組件、光路系統、檢測系統和光路調整模組。光路系統用於引導光源組件照射到晶圓上產生待檢測光信號。檢測系統包括第一通道和第二通道。第一通道接收待檢測光信號，以獲取晶圓在第一解析度下的第一光信號，第二通道接收待檢測光信號，以獲取晶圓在第二解析度下的第二光信號。光路調整模組用於調整待檢測光信號的傳輸方向，以使第一通道和第二通道接收待檢測光信號。其中，第一解析度大於第二解析度。由於複用同一套光路系統，有助於降低檢測成本、節省空間，還可以提高不同檢測通道的準確性和一致性，更好地滿足整體性能參數的全面監控和局部的精確檢測的需求，有利於提供更為全面和精準的檢測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:待檢測光信號</p>  
        <p type="p">11:第一光信號</p>  
        <p type="p">12:第二光信號</p>  
        <p type="p">100:檢測設備</p>  
        <p type="p">110:晶圓</p>  
        <p type="p">120:光源組件</p>  
        <p type="p">130:光路系統</p>  
        <p type="p">140:檢測系統</p>  
        <p type="p">141:第一通道</p>  
        <p type="p">142:第二通道</p>  
        <p type="p">150:光路調整模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2734" publication-number="202628234"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628234.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148204</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池陣列結構，以及包含該結構的電池組和車輛</chinese-title>  
        <english-title>CELL ARRAY STRUCTURE, AND BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260305B">H01M50/507</main-classification>  
        <further-classification edition="202101120260305B">H01M50/147</further-classification>  
        <further-classification edition="202101120260305B">H01M50/249</further-classification>  
        <further-classification edition="201901120260305B">B60L50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭渽勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAE-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAE-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, EUI-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔洙鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔泰雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TAE-WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露電池陣列結構，包括多個電池單元；多個副匯流排單元，配置為電性連接多個電池單元之中任意兩個電池單元；以及至少一個感測元件，電性連接至多個副匯流排單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a cell array structure, which includes a plurality of battery cells; a plurality of sub-bus bar units configured to electrically connect any two battery cells among the plurality of battery cells; and at least one sensing member electrically connected to the plurality of sub-bus bar units.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池陣列結構</p>  
        <p type="p">110:電池單元</p>  
        <p type="p">111:第一電極端子</p>  
        <p type="p">112:第二電極端子</p>  
        <p type="p">120:副匯流排單元</p>  
        <p type="p">130:感測元件</p>  
        <p type="p">140:焊接板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2735" publication-number="202627305"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627305.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>沉水泵</chinese-title>  
        <english-title>SUBMERGED PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260223B">F04D13/08</main-classification>  
        <further-classification edition="200601120260223B">F04D29/043</further-classification>  
        <further-classification edition="200601120260223B">F04D29/38</further-classification>  
        <further-classification edition="200601120260223B">F04D29/40</further-classification>  
        <further-classification edition="200601120260223B">F04D29/66</further-classification>  
        <further-classification edition="200601120260223B">F17C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日機裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKKISO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敏彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可去除殘留於馬達室之液化氣體的沉水泵。 &lt;br/&gt;本發明之沉水泵1容納於泵柱T1，且具有框體2，該框體2容納旋轉軸5及葉輪7。框體具備：馬達室R2；泵室R1；凹部2h，其配置於馬達室；第1流路2g、62、8，其與馬達室及泵室連通；第2流路2e、30、31，其與上部空間R21及第1內部空間Sc1連通；及第3流路2f，其與凹部及第2流路連通。第2流路具備可升降的升降流路及可升降地容納升降流路之一部分的容納流路。第3流路具備在凹部開口的第1開口2f1及在容納流路開口的第2開口2f2。在劃分出第2內部空間時，升降流路塞住第2開口。在沉水泵被抬升時，升降流路與第3流路連通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a submerged pump capable of removing liquefied gas remaining in a motor chamber. &lt;br/&gt; The submerged pump 1 according to the present invention includes a housing 2 that accommodates a rotary shaft 5 and an impeller 7, the housing accommodated in a pump column T1. The housing includes a motor chamber R2, a pump chamber R1, a recess 2h disposed in the motor chamber, a first flow passage 2g, 62, 8 that communicates with the motor chamber and the pump chamber, a second flow passage 2e, 30, 31 that communicates with an upper space R21 and a first internal space Sc1, and a third flow passage 2f that communicates with the recess and the second flow passage. The second flow passage includes a liftable flow passage and a housing flow passage that accommodates a portion of the liftable flow passage so as to be raised and lowered. The third flow passage includes a first opening 2f1 that opens to the recess and a second opening 2f2 that opens to the housing flow passage. When a second internal space is partitioned, the liftable flow passage closes the second opening. When the submerged pump is lifted, the liftable flow passage communicates with the third flow passage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本泵(沉水泵)</p>  
        <p type="p">2:框體</p>  
        <p type="p">2a:周壁部</p>  
        <p type="p">2b:上壁部</p>  
        <p type="p">2b1:軸承座</p>  
        <p type="p">2c:分隔壁部</p>  
        <p type="p">2c1:上表面</p>  
        <p type="p">2c2:保持孔</p>  
        <p type="p">2c3:吐出口</p>  
        <p type="p">2d:下壁部</p>  
        <p type="p">2d1:第1凸緣部</p>  
        <p type="p">2d2:第2凸緣部</p>  
        <p type="p">2d3:吸入口</p>  
        <p type="p">2e:插通孔(第2流路)</p>  
        <p type="p">2e1:第1插通孔</p>  
        <p type="p">2e2:第2插通孔(容納流路)</p>  
        <p type="p">2e3:第3插通孔</p>  
        <p type="p">2f:排水孔(第3流路)</p>  
        <p type="p">2f1:第1開口</p>  
        <p type="p">2f2:第2開口</p>  
        <p type="p">2g:軸承座(第1流路)</p>  
        <p type="p">2h:凹部</p>  
        <p type="p">2h1:底面(配置於最靠下方向的部分)</p>  
        <p type="p">3:導出構件</p>  
        <p type="p">30:第1導出管(第2流路)</p>  
        <p type="p">30a:導出孔</p>  
        <p type="p">31:第2導出管(第2流路、升降流路)</p>  
        <p type="p">31a:下端部</p>  
        <p type="p">31b:上端部</p>  
        <p type="p">32:保持器</p>  
        <p type="p">33:彈推構件</p>  
        <p type="p">34:環形構件(凸緣部)</p>  
        <p type="p">4:馬達</p>  
        <p type="p">41:轉子</p>  
        <p type="p">42:定子</p>  
        <p type="p">5:旋轉軸</p>  
        <p type="p">5a:下半部</p>  
        <p type="p">6:軸承</p>  
        <p type="p">61:軸承</p>  
        <p type="p">62:軸承(第1流路)</p>  
        <p type="p">7:葉輪</p>  
        <p type="p">8:推力平衡機構(第1流路)</p>  
        <p type="p">R1:泵室</p>  
        <p type="p">R2:馬達室</p>  
        <p type="p">R21:上部空間</p>  
        <p type="p">Sc:內部空間</p>  
        <p type="p">Sc1:第1內部空間</p>  
        <p type="p">Sc2:第2內部空間</p>  
        <p type="p">T1:泵柱</p>  
        <p type="p">T1a:抵接面</p>  
        <p type="p">T1b:突出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2736" publication-number="202626545"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626545.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>近紅外光吸收玻璃、元件及濾光器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C03C3/17</main-classification>  
        <further-classification edition="200601120251216B">C03C4/08</further-classification>  
        <further-classification edition="200601120251216B">G02B5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商成都光明光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍旭奕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝良振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>匡波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛露路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘余冬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種內在質量優異的近紅外光吸收玻璃。近紅外光吸收玻璃，其組分以莫耳百分比表示，陽離子組分含有：P&lt;sup&gt;5+&lt;/sup&gt;：38～52%；Al&lt;sup&gt;3+&lt;/sup&gt;：3～12%；Cu&lt;sup&gt;2+&lt;/sup&gt;：2～16%；Rn&lt;sup&gt;+&lt;/sup&gt;：10～40%；R&lt;sup&gt;2+&lt;/sup&gt;：3～30%，所述Rn&lt;sup&gt;+&lt;/sup&gt;為Li&lt;sup&gt;+&lt;/sup&gt;、Na&lt;sup&gt;+&lt;/sup&gt;、K&lt;sup&gt;+&lt;/sup&gt;中的一種或多種，R&lt;sup&gt;2+&lt;/sup&gt;為Mg&lt;sup&gt;2+&lt;/sup&gt;、Ca&lt;sup&gt;2+&lt;/sup&gt;、Sr&lt;sup&gt;2+&lt;/sup&gt;、Ba&lt;sup&gt;2+&lt;/sup&gt;中的一種或多種；陰離子組分含有：O&lt;sup&gt;2-&lt;/sup&gt;：82～97%；F&lt;sup&gt;-&lt;/sup&gt;：3～18%。通過合理的組分設計，本發明獲得的近紅外光吸收玻璃在可見光區域具有優異的透過特性，在近紅外區域具有優異的吸收特性，同時具有優異的內在質量，滿足高性能設備的使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2737" publication-number="202626482"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626482.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耳機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">B81B7/02</main-classification>  
        <further-classification edition="200601120260127B">B81B3/00</further-classification>  
        <further-classification edition="200601120260127B">A61B8/00</further-classification>  
        <further-classification edition="200601120260127B">H04R17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商優聲股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USOUND GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>書斯高尼克萊里西貝爾特拉米　安德里業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSCONI CLERICI BELTRAMI, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博托尼　費魯喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOTTONI, FERRUCCIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李敦維</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種貼耳式、耳罩式和/或入耳式耳機（1），包括用於產生和檢測至少超聲波（3）的至少一個聲換能器（2），和基於產生和檢測的超聲波（3）測定耳機（1）佩戴者（5）身體功能的控制單元（4）。至少一個聲換能器（2）是MEMS聲換能器（2），特別是寬帶MEMS聲換能器。還涉及一種測定耳機（1）佩戴者（5）身體功能的方法，特別是心臟和/或呼吸功能，包括：利用耳機（1）的MEMS聲換能器（2）產生超聲波（3）；利用MEMS聲換能器（2）和/或麥克風檢測超聲波（3）；基於產生和檢測的超聲波（3），通過耳機（1）的控制單元（4）測定佩戴者（5）身體功能。還涉及一種MEMS聲換能器（2）用於耳機（1）和/或用於測定身體功能的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:耳機</p>  
        <p type="p">2:聲換能器/MEMS聲換能器</p>  
        <p type="p">3:聲波/超聲波</p>  
        <p type="p">4:控制單元</p>  
        <p type="p">5:佩戴者</p>  
        <p type="p">6:耳部</p>  
        <p type="p">7:耳道</p>  
        <p type="p">8:鼓膜</p>  
        <p type="p">9:反射的超聲波</p>  
        <p type="p">19:信號發生器</p>  
        <p type="p">20:調製器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2738" publication-number="202628946"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628946.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>評價用元件、評價用元件組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P74/20</main-classification>  
        <further-classification edition="202601120260302B">H10P32/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三墾電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANKEN ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鳥居克行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORII, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富岡征悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMIOKA, SEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明獲得可掌握柱層的形成不良的狀況的評價用元件。柱層12藉由在深度方向上將p層12A～p層12E連結而形成。於該評價用元件T1中，於與柱層12在俯視時不同的區域分別形成與所述p層12B～p層12E相同的p層（第一評價用單獨擴散區域）22B～22E及p層（第二評價用單獨擴散區域）23B～23E，與所述p層12A對應地形成將p層22B與p層23B於其下側連結的p型的連結層24。於評價用元件T2～評價用元件T4中，亦同樣如此。因此，可根據所述元件T1～元件T4的電阻值來間接地調查構成柱層12的p層12A～p層12E的位置關係或尺寸的關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:評價用元件組</p>  
        <p type="p">11:n層(基材半導體區域)</p>  
        <p type="p">11A、11B、11C、11D、11E:n層</p>  
        <p type="p">12:柱層(p層/柱狀半導體區域)</p>  
        <p type="p">12A、12B、12C、12D、12E:p層(單獨擴散區域)</p>  
        <p type="p">22B、22C、22D、22E、32C、32D、32E、42D、42E、52E:p層(第一評價用單獨擴散區域)</p>  
        <p type="p">23B、23C、23D、23E、33C、33D、33E、43D、43E、53E:p層(第二評價用單獨擴散區域)</p>  
        <p type="p">24、34、44、54:連結層</p>  
        <p type="p">61:p&lt;sup&gt;+&lt;/sup&gt;層</p>  
        <p type="p">62:n&lt;sup&gt;+&lt;/sup&gt;層</p>  
        <p type="p">T1、T2、T3、T4:評價用元件(元件)</p>  
        <p type="p">T0、T11、T12、T21、T22、T31、T32、T41、T42:端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2739" publication-number="202626338"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626338.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝飾片材及裝飾片材的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B32B3/30</main-classification>  
        <further-classification edition="200601120260325B">B32B27/00</further-classification>  
        <further-classification edition="200601120260325B">B32B27/08</further-classification>  
        <further-classification edition="200601120260325B">B32B27/16</further-classification>  
        <further-classification edition="200601120260325B">B32B27/30</further-classification>  
        <further-classification edition="200601120260325B">B32B38/06</further-classification>  
        <further-classification edition="200601120260325B">B44C5/04</further-classification>  
        <further-classification edition="200601120260325B">B44C1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口祥太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明石彩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKASHI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平形政菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAKATA, SEINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本並哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTONAMI, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有與建材中使用的木紋板等的表面質感更接近的質感的裝飾片材。因此，裝飾片材（1）具有：著色熱塑性樹脂層（2）；圖樣層（3）、透明熱塑性樹脂層（4）及表面保護層（5），依次積層於著色熱塑性樹脂層（2）的其中一面；以及消光顯現用花紋部（6），積層於著色熱塑性樹脂層（2）的另一面，與著色熱塑性樹脂層（2）相比包含對規定波長的光具有光吸收性的規定材料，且配置於與圖樣層（3）的圖樣同步的位置，表面保護層（5）在最表面包括：在俯視時與消光顯現用花紋部（6）重疊的位置賦形有凹凸形狀的區域即凹凸區域（Aa）；在與圖樣層（3）的圖樣不同步的位置賦形的槽（51）；以及未賦形凹凸形狀及槽（51）的非賦形區域（Ab）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:裝飾片材</p>  
        <p type="p">2:著色熱塑性樹脂層(著色樹脂層)</p>  
        <p type="p">3:圖樣層</p>  
        <p type="p">4:透明熱塑性樹脂層(透明樹脂層)</p>  
        <p type="p">5:表面保護層</p>  
        <p type="p">6:消光顯現用花紋部</p>  
        <p type="p">7:底漆層</p>  
        <p type="p">51:槽</p>  
        <p type="p">52:壓花部</p>  
        <p type="p">Aa:凹凸區域</p>  
        <p type="p">Ab:非賦形區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2740" publication-number="202626114"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626114.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148248</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療組合及其用途和治療方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/68</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">C07K16/22</further-classification>  
        <further-classification edition="200601120260401B">C07K16/28</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　家驊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JIAHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李如玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIONG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙曦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供治療組合及其用途和治療方法。具體提供抗Trop-2抗體藥物偶聯物，以及VEGF抑制劑和EGFR抑制劑中的一種或兩種以及任選的他活性治療劑的治療組合及其預防和/或治療腫瘤或癌症的方法和在製備預防和/或治療腫瘤或癌症的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2741" publication-number="202627619"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627619.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統裝置及光學系統裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G02B27/62</main-classification>  
        <further-classification edition="202001120260211B">G02B30/00</further-classification>  
        <further-classification edition="200601120260211B">G02B1/00</further-classification>  
        <further-classification edition="200601120260211B">H05K13/04</further-classification>  
        <further-classification edition="202501120260211B">H05K5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＣＩＶＡＸ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCIVAX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草野正明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSANO, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松川英二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUKAWA, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木義一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中覚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即使光照射設備與光學元件的組合有變更，亦在不變更框體的情況下容易調節光照射設備與光學元件的分離距離的光學系統裝置及其製造方法。一種光學系統裝置100，包括光照射設備1、以及將光照射設備1保持為其光軸朝向Z方向的框體2，框體2具有：Z基準部22，成為光照射設備1的Z方向的位置的基準；以及光照射設備設置部21，形成用於相對於Z基準部22決定光照射設備1的Z方向的位置的位置調節空間23，光照射設備1是在位置調節空間23內不在Z方向上與框體2抵接地經固定的結構。光學系統裝置100藉由如下步驟來製造：保持步驟，將光照射設備1保持於夾具8的保持部81；Z方向配置步驟，將夾具8的抵接部82與Z基準部22抵接於框體2，並將光照射設備1配置於光照射設備設置部21內的規定位置；以及第一固定步驟，將光照射設備1在框體2的規定位置進行固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光照射設備</p>  
        <p type="p">2:框體</p>  
        <p type="p">4:接著劑</p>  
        <p type="p">8:夾具(光照射設備用)</p>  
        <p type="p">12:基板</p>  
        <p type="p">13:照射設備側固定部位</p>  
        <p type="p">15:照射設備基準位置</p>  
        <p type="p">21:光照射設備設置部</p>  
        <p type="p">22:Z基準部</p>  
        <p type="p">23:位置調節空間</p>  
        <p type="p">24:XY基準部(光照射設備用)</p>  
        <p type="p">24x:X基準部</p>  
        <p type="p">24y:Y基準部</p>  
        <p type="p">26:光學元件設置部</p>  
        <p type="p">27:抵接面</p>  
        <p type="p">81:保持部</p>  
        <p type="p">82:抵接部</p>  
        <p type="p">83:窄幅部</p>  
        <p type="p">84:寬幅部</p>  
        <p type="p">85:抽吸孔</p>  
        <p type="p">291:空間</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2742" publication-number="202628743"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628743.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光顯示設備</chinese-title>  
        <english-title>LIGHT EMITTING DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10H29/853</main-classification>  
        <further-classification edition="202301120260102B">H10K59/10</further-classification>  
        <further-classification edition="200601120260102B">G02F1/1333</further-classification>  
        <further-classification edition="202301120260102B">H10K59/131</further-classification>  
        <further-classification edition="202501120260102B">H10H29/39</further-classification>  
        <further-classification edition="202501120260102B">H10H29/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐映來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YEONGRAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳榮浣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, YOUNGWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志銀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, JIEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光顯示設備可包含一基板，包含一顯示區域及一圍繞該顯示區域之非顯示區域，至少一個絕緣層在該基板上，一電源電壓短路線路在該非顯示區域中之該至少一個絕緣層上，多個壩圖案在該非顯示區域中，該多個壩圖案之每一者包含一或多種有機材料且與該電源電壓短路線路重疊，及一覆蓋圖案在該多個壩圖案之間且覆蓋該電源電壓短路線路之一邊緣部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light emitting display apparatus may include a substrate including a display area and a non-display area surrounding the display area, at least one insulating layer on the substrate, a power voltage shorting line on the at least one insulating layer in the non-display area, a plurality of dam patterns in the non-display area, each comprising one or more organic materials and overlapping the power voltage shorting line, and a cover pattern between the plurality of dam patterns and covering an edge portion of the power voltage shorting line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CVSL:第二電源電壓短路線路</p>  
        <p type="p">DA:顯示區域</p>  
        <p type="p">DAM:壩圖案</p>  
        <p type="p">DM1:第一壩圖案</p>  
        <p type="p">DM2:第二壩圖案</p>  
        <p type="p">DVSL:第一電源電壓短路線路</p>  
        <p type="p">NDA:非顯示區域</p>  
        <p type="p">PA:接墊區域</p>  
        <p type="p">PD:接墊</p>  
        <p type="p">RA:佈線區域</p>  
        <p type="p">RVSL:參考電壓短路線路</p>  
        <p type="p">SD1:第一源極/汲極電極</p>  
        <p type="p">SD2:第二源極/汲極電極</p>  
        <p type="p">SLL1:閘極控制訊號聯絡線路</p>  
        <p type="p">SLL2:資料訊號聯絡線路</p>  
        <p type="p">TLL:觸控訊號聯絡線路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2743" publication-number="202629026"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629026.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附有焊料凸塊之構件、安裝前驅物及安裝體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10W72/20</main-classification>  
        <further-classification edition="202101120260331B">H01S5/0234</further-classification>  
        <further-classification edition="202601120260331B">H05K3/34</further-classification>  
        <further-classification edition="202601120260331B">H10W20/44</further-classification>  
        <further-classification edition="200601120260331B">B23K35/02</further-classification>  
        <further-classification edition="200601120260331B">B23K35/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欠畑純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKEHATA, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤井邦彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAI, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮地勝將</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAJI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種附有焊料凸塊之構件，其具備：基材；及複數個電極，設置於基材上且具有焊料凸塊，在至少一部分電極中，焊料凸塊為具有形成於電極表面之焊料基部及形成於焊料基部表面之至少三個焊料凸部之附有凸部之凸塊，焊料凸部的頂部高於焊料基部的頂部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:焊料基部</p>  
        <p type="p">2:焊料凸部</p>  
        <p type="p">3:基材</p>  
        <p type="p">4:電極</p>  
        <p type="p">5:焊料凸塊(附有凸部之凸塊)</p>  
        <p type="p">6:焊料凸塊(一般凸塊)</p>  
        <p type="p">10:附有焊料凸塊之構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2744" publication-number="202626847"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626847.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於模制應用的材料及其製品</chinese-title>  
        <english-title>MATERIAL FOR MOLDING APPLICATIONS AND ARTICLE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G63/183</main-classification>  
        <further-classification edition="201201120260401B">D04H1/435</further-classification>  
        <further-classification edition="201201120260401B">D04H1/4382</further-classification>  
        <further-classification edition="200601120260401B">B29C70/00</further-classification>  
        <further-classification edition="200601120260401B">A47G27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾科德寶兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL FREUDENBERG KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡澤豪澤　馬格努斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUNZENHAUSER, MAGNUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫尔德　安克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELD, ANKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於模制應用的材料，該材料包含含有纖維的非織物。所述非織物包括（i）含有聚對苯二甲酸乙二醇酯聚合物的第一纖維和含有聚對苯二甲酸丁二醇酯共聚物的第二纖維，（ii）雙組分纖維，所述雙組分纖維包含含有聚對苯二甲酸乙二醇酯聚合物的第一組分和含有聚對苯二甲酸丁二醇酯共聚物的第二組分，或（iii）含有聚對苯二甲酸乙二醇酯聚合物的第一纖維、和雙組分第二纖維，所述雙組分第二纖維包含含有聚對苯二甲酸乙二醇酯聚合物的第一組分和含有聚對苯二甲酸丁二醇酯共聚物的第二組分。其中所述聚對苯二甲酸丁二醇酯共聚物由二羧酸化合物和包含1,4-丁二醇和/或包含2-甲基-1,3-丙二醇的二醇化合物共聚而成，其中所述二醇化合物不包含新戊二醇。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A material for molding applications is provided comprising a nonwoven fabric comprising fibers, the nonwoven fabric (i) comprising first fibers comprising a polyethylene terephthalate polymer and second fibers comprising a polybutylene terephthalate copolymer, (ii) comprising bicomponent fibers comprising a first component comprising a polyethylene terephthalate polymer and a second component comprising a polybutylene terephthalate copolymer, or (iii) comprising first fibers comprising a polyethylene terephthalate polymer and bicomponent second fibers comprising a first component comprising a polyethylene terephthalate polymer and a second component comprising a polybutylene terephthalate copolymer, wherein the polybutylene terephthalate copolymer is copolymerized from a dicarboxylic acid compound and a diol compound comprising 1,4-butanediol and/or comprising 2-methyl-1,3-propanediol, wherein the diol compound does not comprise neopentyl glycol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2745" publication-number="202627126"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627126.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148354</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊料合金、焊料糊、焊料球、焊料預成形品，及焊料接合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C22C13/02</main-classification>  
        <further-classification edition="200601120260401B">B23K1/00</further-classification>  
        <further-classification edition="200601120260401B">B23K35/02</further-classification>  
        <further-classification edition="200601120260401B">B23K35/22</further-classification>  
        <further-classification edition="200601120260401B">B23K35/26</further-classification>  
        <further-classification edition="200601320260401B">B23K101/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商千住金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENJU METAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横山貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川俊策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, SHUNSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松藤貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUFUJI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供焊料合金、焊料糊、焊料球、焊料預成形品及焊料接合物，其具有優異的耐落下衝擊性及耐熱循環性，能夠抑制晶片立起及焊橋･焊料尖狀突起的產生，並且亦可抑制電遷移的產生。焊料合金具有如下合金組成：以質量%計為Ag：0.3~1.9%、Cu：0.40~1.00%、Bi：0.5~4.9%、P：0.00100~0.02000%，且殘餘部分為Sn。合金組成亦可以質量%計各自為0.06%以下的量含有Ge、Co及Ga中的至少1種。另外，合金組成亦可以質量%計各自為0.06%以下的量含有As、In、Zr、Mn、Ti、Zn、Fe、Al、Ni、Au、Mg、Cr及Pt中的至少1種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2746" publication-number="202626540"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626540.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148355</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有識別標記之二氧化鈦－二氧化矽玻璃體及其製造方法</chinese-title>  
        <english-title>TITANIA-SILICA GLASS BODY WITH IDENTIFYING MARKER AND METHODS OF MAKING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C03C3/06</main-classification>  
        <further-classification edition="200601120260401B">C03C3/078</further-classification>  
        <further-classification edition="200601120260401B">C03C4/00</further-classification>  
        <further-classification edition="200601120260401B">C03C15/00</further-classification>  
        <further-classification edition="200601120260401B">C03C23/00</further-classification>  
        <further-classification edition="201401120260401B">B23K26/00</further-classification>  
        <further-classification edition="201401120260401B">B23K26/36</further-classification>  
        <further-classification edition="201401120260401B">B23K26/53</further-classification>  
        <further-classification edition="201201120260401B">G03F1/22</further-classification>  
        <further-classification edition="201201120260401B">G03F1/24</further-classification>  
        <further-classification edition="201201120260401B">G03F1/60</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G06K19/06</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邊秋梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIAN, QIUMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席利普　克里斯多夫麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CILIP, CHRISTOPHER MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷尼爾　傑森羅伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRENIER, JASON ROY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫哈梅德哈　艾利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAMMADKHAH, ALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種玻璃體，其具有一頂表面、一相對底表面及一個或多個側表面。一識別標記位於該玻璃體之該頂表面、該底表面、該一個或多個側表面上及/或一塊體內，該識別標記提供關於該玻璃體之一個或多個性質、特性及/或組成特徵的經編碼資訊，且其中該玻璃體之一組成包含二氧化鈦及二氧化矽。此外，該玻璃體之複數個區段當中之羥基濃度的一峰谷值為約60 ppm或更小，該羥基濃度係使用一傅立葉變換紅外光譜透射法量測的，且該複數個區段包括跨該玻璃體之一長度及一寬度的每一相鄰區段，該長度為約25 mm或更大，且該寬度為約25 mm或更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass body with a top surface, an opposing bottom surface, and one or more side surfaces. An identifying marker is on the top surface, the bottom surface, the one or more side surfaces, and/or within a bulk of the glass body, the identifying marker providing encoded information about one or more properties, characteristics, and/or compositional features of the glass body, and wherein a composition of the glass body comprises titania and silica. Furthermore, a peak-to-valley of hydroxyl concentration among a plurality of segments of the glass body is about 60 ppm or less, the hydroxyl concentration being measured using a Fourier transform infrared spectroscopy in transmission, and the plurality of segments including every adjacent segment across a length and a width of the glass body, the length being about 25 mm or more and the width being about 25 mm or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:玻璃體</p>  
        <p type="p">412:頂表面</p>  
        <p type="p">414:相對底表面</p>  
        <p type="p">416:側表面</p>  
        <p type="p">418:外邊緣</p>  
        <p type="p">430:功能區域</p>  
        <p type="p">500:識別標記</p>  
        <p type="p">D:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2747" publication-number="202626998"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626998.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光液</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C09G1/02</main-classification>  
        <further-classification edition="200601120260302B">C09K3/14</further-classification>  
        <further-classification edition="201201120260302B">B24B37/04</further-classification>  
        <further-classification edition="202601120260302B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬英杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YINGJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何華鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HUAFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHUCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李全干</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QUANGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付世龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, SHILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢尼星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, NIXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種化學機械拋光液，包括：研磨顆粒、腐蝕抑制劑、鎢拋光促進劑、有機酸、矽烷偶聯劑、氧化劑和水。與現有技術相比，本發明的化學機械拋光液具有較高的鎢拋光速率，同時能改善拋光後的鎢表面粗糙程度，提高對鎢金屬表面的平坦化效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a chemical mechanical polishing solution, comprising: abrasive particles, a corrosion inhibitor, a tungsten polishing accelerator, an organic acid, a silane coupling agent, an oxidant, and water. Compared to the prior art, the chemical mechanical polishing solution of the present invention offers a higher tungsten polishing rate while also improving the surface roughness of polished tungsten and enhancing the planarization efficiency of tungsten metal surfaces.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2748" publication-number="202626686"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626686.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎矽化合物、其製備方法，以及利用該化合物沉積含矽薄膜的方法</chinese-title>  
        <english-title>NOVEL SILICON COMPOUNDS, METHOD OF PREPARING THE SAME, AND METHOD OF DEPOSITING A SILICON-CONTAINING THIN FILMS BY USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07F7/21</main-classification>  
        <further-classification edition="200601120260302B">C23C16/30</further-classification>  
        <further-classification edition="200601120260302B">C23C16/34</further-classification>  
        <further-classification edition="200601120260302B">C23C16/40</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊炳日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, BYEONG-IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁熙娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, HEE-YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成泳柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEONG, YEONG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述了新穎矽化合物、其製備方法以及利用該矽化合物沉積含矽薄膜的方法。更具體地說，本文描述如下式1所示的新穎矽化合物： &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="188px" width="256px" file="ed10087.JPG" alt="ed10087.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中R&lt;sub&gt;1&lt;/sub&gt;至R&lt;sub&gt;7&lt;/sub&gt;和 n的定義見下文。 &lt;br/&gt;該矽化合物在室溫和大氣壓力下為液態化合物，具有良好的熱穩定性和高揮發性，可透過各種沉積方法（如 ALD 或 PEALD）形成高純度、具有優異物理和電學性質的含矽薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are novel silicon compounds, their preparation method, and method for depositing a silicon-containing thin film using the silicon compounds. More specifically, described herein is noble silicon compounds, represented by the following Formula 1: &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="181px" width="254px" file="ed10088.JPG" alt="ed10088.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein R&lt;sub&gt;1&lt;/sub&gt; to R&lt;sub&gt;7&lt;/sub&gt;, and n are defined herein. &lt;br/&gt;The silicon compounds are a liquid-state compound at room temperature and under atmospheric pressure and have good thermal stability and high volatility to form silicon-containing films having high purity and excellent physical and electrical property by various deposition methods such as ALD or PEALD.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2749" publication-number="202627127"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627127.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148379</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無銀合金</chinese-title>  
        <english-title>SILVER-FREE ALLOY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260105B">C22C13/02</main-classification>  
        <further-classification edition="200601120260105B">B23K35/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商新加坡賀利氏材料私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS MATERIALS SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種合金，其係由0.1至1 wt.%的銅(Cu)、0.1至5 wt.%的鉍(Bi)、0.01至0.2 wt.%的鎳(Ni)、0.01至0.1 wt.%的鉻(Cr)、及餘量的錫(Sn)所組成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An alloy consisting of 0.1 to 1 wt.% of copper (Cu), 0.1 to 5 wt.% of bismuth (Bi), 0.01 to 0.2 wt.% of nickel (Ni), 0.01 to 0.1 wt.% of chromium (Cr) and tin (Sn) as a remainder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2750" publication-number="202627935"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627935.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置、資訊處理方法及資訊處理程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">G06Q30/02</main-classification>  
        <further-classification edition="202301120260102B">G06Q10/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENTSU INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴泰輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, TAE HWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">資訊處理裝置(1)包含：第一取得部，針對各第一時段的第一資訊取得第一增量觸及率；第二取得部，針對各第二時段的第二資訊取得第二增量觸及率；第三取得部，對每個第二時段取得對於第一總觸及率之第三增量觸及率；第四取得部，對每個第一時段取得對於第二總觸及率之第四增量觸及率；及選定部，基於第一增量觸及率、第二增量觸及率、第三增量觸及率及第四增量觸及率，從第一時段中選定m(m為自然數)個時段，並從第二時段中選定n(n為自然數)個時段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2751" publication-number="202626798"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626798.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相位差層、包含此之多層相位差薄膜及其製造方法，以及共聚物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F212/08</main-classification>  
        <further-classification edition="200601120260401B">C08F212/32</further-classification>  
        <further-classification edition="200601120260401B">C08F222/40</further-classification>  
        <further-classification edition="202001120260401B">C08J7/04</further-classification>  
        <further-classification edition="200601120260401B">C09D125/02</further-classification>  
        <further-classification edition="200601120260401B">C09D135/00</further-classification>  
        <further-classification edition="200601120260401B">B32B27/30</further-classification>  
        <further-classification edition="200601120260401B">B32B27/32</further-classification>  
        <further-classification edition="200601120260401B">G02B5/30</further-classification>  
        <further-classification edition="200601120260401B">G02F1/13363</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波多野拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANO, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種相位差層，其係Rth／d為−20.0×10&lt;sup&gt;−3&lt;/sup&gt;以上且−3.5×10&lt;sup&gt;−3&lt;/sup&gt;以下的相位差層；於此，Rth表示前述相位差層的厚度方向延遲，d表示前述相位差層的厚度，前述相位差層包含「包含由下述式（1）所示之結構單元及由下述式（2）所示之結構單元」的共聚物（P1）。式（1）中，R&lt;sup&gt;p&lt;/sup&gt;表示推電子性取代基等，R&lt;sup&gt;q&lt;/sup&gt;表示氫原子等，R&lt;sup&gt;r&lt;/sup&gt;表示氫原子等。式（2）中，R&lt;sup&gt;x&lt;/sup&gt;及R&lt;sup&gt;y&lt;/sup&gt;分別獨立表示氫原子等，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;、R&lt;sup&gt;6&lt;/sup&gt;及R&lt;sup&gt;7&lt;/sup&gt;分別獨立表示氫原子、碳數1～6的烷基等。&lt;br/&gt;&lt;img align="absmiddle" height="328px" width="295px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;　&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多層相位差薄膜</p>  
        <p type="p">110:相位差層</p>  
        <p type="p">120:基材層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2752" publication-number="202627586"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627586.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統裝置及光學系統裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260302B">G02B7/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＣＩＶＡＸ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCIVAX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草野正明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSANO, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松川英二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUKAWA, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木義一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中覚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 本發明提供一種可防止或抑制黏接劑滲出至光學元件的凹凸形狀的光學系統裝置及該光學系統裝置的製造方法。 &lt;br/&gt;[解決方法] 一種光學系統裝置，包括：光學元件，具有發揮光學功能的凹凸形狀；以及框體，利用抵接面對該光學元件進行保持，所述光學元件中，至少所述凹凸形狀由彈性樹脂製構件形成，所述光學元件與所述框體的所述抵接面之間由所述彈性樹脂製構件密閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:框體</p>  
        <p type="p">21:光照射單元設置部</p>  
        <p type="p">22:Z基準部</p>  
        <p type="p">23:位置調節空間</p>  
        <p type="p">24:XY基準部</p>  
        <p type="p">24x、28x:X基準部</p>  
        <p type="p">24y、28y:Y基準部</p>  
        <p type="p">26:光學元件設置部</p>  
        <p type="p">27:抵接面</p>  
        <p type="p">28:XY基準部(光學元件用)</p>  
        <p type="p">29:中間部</p>  
        <p type="p">291:空間</p>  
        <p type="p">A-A:線</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2753" publication-number="202628089"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628089.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G11C7/18</main-classification>  
        <further-classification edition="200601120260302B">G11C11/40</further-classification>  
        <further-classification edition="202501120260302B">H10D62/10</further-classification>  
        <further-classification edition="202501120260302B">H10D62/80</further-classification>  
        <further-classification edition="202501120260302B">H10D64/20</further-classification>  
        <further-classification edition="202501120260302B">H10D89/10</further-classification>  
        <further-classification edition="202601120260302B">H10D80/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴相炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SANGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃炯俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, HYUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李南勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, NAMHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永栽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOUNGJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭天炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHUNHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括位元線結構、第一閘極結構和第二閘極結構以及通道。位元線結構在第一方向上延伸。第一閘極結構包括在第二方向上延伸的第一閘電極、第一閘電極上的閘極阻障圖案、閘極阻障圖案上的封蓋圖案、以及位元線結構上的第一閘極絕緣圖案。第一閘極絕緣圖案在第一閘電極、閘極阻障圖案和封蓋圖案的側壁上。通道在第一閘極結構的側壁上在第三方向上延伸。第二閘極結構包括位元線結構上的第二閘極絕緣圖案和第二閘電極。第二閘極絕緣圖案在通道的側壁上。第二閘電極在第二閘極絕緣圖案的側壁上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a bit line structure, first and second gate structures and a channel. The bit line structure extends in a first direction. The first gate structure includes a first gate electrode extending in a second direction, a gate barrier pattern on the first gate electrode, a capping pattern on the gate barrier pattern, and a first gate insulation pattern on the bit line structure. The first gate insulation pattern is on sidewalls of the first gate electrode, the gate barrier pattern and the capping pattern. The channel extends in a third direction on a sidewall of the first gate structure. The second gate structure includes a second gate insulation pattern and a second gate electrode on the bit line structure. The second gate insulation pattern is on a sidewall of the channel. The second gate electrode is on a sidewall of the second gate insulation pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">127:通道</p>  
        <p type="p">165:第一閘極絕緣圖案</p>  
        <p type="p">175:第一閘電極</p>  
        <p type="p">210:第二閘極絕緣圖案</p>  
        <p type="p">220:第二閘電極</p>  
        <p type="p">225:第二閘極結構</p>  
        <p type="p">260:著陸墊</p>  
        <p type="p">270:第一電容器電極</p>  
        <p type="p">320:第二絕緣中間層</p>  
        <p type="p">A-A',B-B':線</p>  
        <p type="p">D1,D2,D3:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2754" publication-number="202628572"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628572.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title>METHODS OF PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10B12/00</main-classification>  
        <further-classification edition="202601120260302B">H10P14/692</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓在鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JAE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韓妃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAN BEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴又永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WOO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李仁奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, IN GYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理方法，包括如下步驟：在基板上形成氧化鋁膜夾雜在中間的一雙高介電常數薄膜的步驟；以及為了防止所述氧化鋁膜中鋁向所述高介電常數薄膜擴散，在所述氧化鋁膜與所述高介電常數薄膜之間形成摻雜鋁的防擴散膜的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:高介電常數薄膜</p>  
        <p type="p">12a:第一高介電常數薄膜</p>  
        <p type="p">12b:第二高介電常數薄膜</p>  
        <p type="p">14:氧化鋁膜</p>  
        <p type="p">18:摻雜鋁的防擴散膜</p>  
        <p type="p">18a:第一防擴散膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2755" publication-number="202628219"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628219.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池陣列結構以及包含電池陣列結構的電池組和車輛</chinese-title>  
        <english-title>CELL ARRAY STRUCTURE, AND BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260305B">H01M10/0587</main-classification>  
        <further-classification edition="202101120260305B">H01M50/14</further-classification>  
        <further-classification edition="202101120260305B">H01M50/171</further-classification>  
        <further-classification edition="202101120260305B">H01M50/213</further-classification>  
        <further-classification edition="200601120260305B">G01R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳寅石</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, IN-SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文東才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, DONG-JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴昭貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SO-JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露電池芯陣列結構，包括多個電池芯；以及至少一個側邊結構，配置為容納和支撐多個電池芯並在一方向上延長，其中側邊結構包括至少一個樹脂容納部，配置為用於容納填充樹脂的空的空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a cell array structure, which includes a plurality of battery cells; and at least one side structure configured to accommodate and support the plurality of battery cells and elongated in one direction, wherein the side structure includes at least one resin accommodation portion configured as an empty space for accommodating a filling resin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:側邊結構</p>  
        <p type="p">131:底架</p>  
        <p type="p">132:頂框</p>  
        <p type="p">133:第一端</p>  
        <p type="p">134:第二端</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">RA:樹脂容納部</p>  
        <p type="p">A、B:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2756" publication-number="202626360"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626360.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B32B27/00</main-classification>  
        <further-classification edition="200601120260302B">C09J11/00</further-classification>  
        <further-classification edition="200601120260302B">C09J133/00</further-classification>  
        <further-classification edition="200601120260302B">C09J201/00</further-classification>  
        <further-classification edition="201801120260302B">C09J7/20</further-classification>  
        <further-classification edition="201801120260302B">C09J7/35</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，依次包括：準備依次包含黏著性樹脂層（B）、基材層（A）及黏著性樹脂層（C）的黏著性膜（50），繼而，於黏著性膜（50）的黏著性樹脂層（C）側貼附支持基板（80）的步驟；使黏著性膜（50）中的揮發成分量降低的步驟；於黏著性膜（50）的黏著性樹脂層（B）側貼附電子零件（70）的步驟；以及利用密封材（60）將電子零件（70）密封的步驟，選自黏著性樹脂層（B）及黏著性樹脂層（C）中的至少一者包含藉由外部刺激而黏著力降低的層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of an electronic device includes, in sequence: a step of preparing an adhesive film (50) comprising, in sequence, an adhesive resin layer (B), a base layer (A), and an adhesive resin layer (C), then attaching a support substrate (80) to the adhesive resin layer (C) side of the adhesive film (50); a step of reducing the amount of volatile components in the adhesive film (50); a step of attaching an electronic component (70) to the adhesive resin layer (B) side of the adhesive film (50); and a step of sealing the electronic component (70) with a sealing material (60), wherein at least one selected from the adhesive resin layer (B) and the adhesive resin layer (C) comprises a layer whose adhesive strength is reduced by external stimulation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:基材層</p>  
        <p type="p">B:黏著性樹脂層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">50:黏著性膜</p>  
        <p type="p">60:密封材</p>  
        <p type="p">70:電子零件</p>  
        <p type="p">80:支持基板</p>  
        <p type="p">100:結構體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2757" publication-number="202628899"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628899.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理系統及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P72/30</main-classification>  
        <further-classification edition="202601120260323B">H10P95/70</further-classification>  
        <further-classification edition="202601120260323B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江頭篤嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGASHIRA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村和晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩島裕士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGISHIMA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原圭孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甲斐栄司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀之内亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORINOUCHI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種技術，能夠減低在搬運表面形成有液膜之基板之際，當搬運時間不一致時所追加之調整時間中的基板乾燥風險。本揭示之一態樣的基板處理系統，具備：批次處理部，其將包含複數片基板之批次進行批次處理；單片處理部，其將前述批次之前述基板逐片進行處理；介面部，其從前述批次處理部將前述基板在形成有液膜之狀態下交接給前述單片處理部；以及控制電路。前述單片處理部具備：複數個第1處理部，其對前述基板施加第1處理；複數個第2處理部，其對施加了前述第1處理之前述基板施加第2處理；以及搬運部，其將前述基板搬運至前述介面部、複數個前述第1處理部及複數個前述第2處理部。前述控制電路係基於：形成有前述液膜之前述基板從前述介面部被搬運至前述第1處理部之第1搬運處理的處理時間、前述第1處理的處理時間、前述基板從前述第1處理部被搬運至前述第2處理部之第2搬運處理的處理時間、前述第2處理的處理時間、以及從前述第2處理部搬出前述基板之第3搬運處理的處理時間，算出「前述基板之前述第1搬運處理、前述第2搬運處理及前述第3搬運處理的時機，與其他前述基板在前述搬運部被搬運的時機不會重複之一定的間隔」，並設定前述基板之前述第1搬運處理的開始時機，以使每隔所算出之一定的間隔開始前述第1搬運處理，且在算出前述一定的間隔之際，對前述第1處理的處理時間追加調整時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理系統</p>  
        <p type="p">2:搬入搬出部</p>  
        <p type="p">3:第1介面部</p>  
        <p type="p">4:批次處理部</p>  
        <p type="p">5:第2介面部</p>  
        <p type="p">6:單片處理部</p>  
        <p type="p">9:控制電路</p>  
        <p type="p">21:裝載埠</p>  
        <p type="p">22:儲料器</p>  
        <p type="p">23:裝載機</p>  
        <p type="p">24:卡匣搬運裝置</p>  
        <p type="p">31:基板移載裝置</p>  
        <p type="p">31a:基板固持臂</p>  
        <p type="p">32:批次形成部</p>  
        <p type="p">33:第1交接台</p>  
        <p type="p">41:化學液槽</p>  
        <p type="p">42:淋洗液槽</p>  
        <p type="p">43:第1搬運裝置</p>  
        <p type="p">43a:導軌</p>  
        <p type="p">43b:第1搬運臂</p>  
        <p type="p">44:處理具</p>  
        <p type="p">45:驅動裝置</p>  
        <p type="p">51:浸漬槽</p>  
        <p type="p">52:第2搬運裝置</p>  
        <p type="p">52a:Y軸驅動裝置</p>  
        <p type="p">52b:Z軸驅動裝置</p>  
        <p type="p">52c:第2搬運臂</p>  
        <p type="p">53:第3搬運裝置</p>  
        <p type="p">53a:第3搬運臂</p>  
        <p type="p">54:第2交接台</p>  
        <p type="p">61:第4搬運裝置</p>  
        <p type="p">61a:導軌</p>  
        <p type="p">61b:第4搬運臂</p>  
        <p type="p">62:液處理裝置</p>  
        <p type="p">63:乾燥裝置</p>  
        <p type="p">91:運算部</p>  
        <p type="p">92:記憶部</p>  
        <p type="p">C:卡匣</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2758" publication-number="202626875"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626875.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽酮改質聚醯亞胺樹脂、矽酮改質聚醯亞胺樹脂組成物、積層體、膜及硬化物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C08G73/10</main-classification>  
        <further-classification edition="200601120260330B">C08L79/08</further-classification>  
        <further-classification edition="200601120260330B">C08J5/18</further-classification>  
        <further-classification edition="200601120260330B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>案納将太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANNO, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在維持可溶性的同時與各種基材的接著性優異的矽酮改質聚醯亞胺樹脂組成物。一種矽酮改質聚醯亞胺樹脂，具有下述式（1）及式（2）所表示的結構單元， &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="160px" width="354px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式（1）及式（2）中，A為下述式（3）所表示的四羧酸二醯亞胺結構， &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="147px" width="489px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，帶波浪線的線表示鍵結鍵） &lt;br/&gt;Z為可具有-O-、-S-、-NH-、-SO&lt;sub&gt;2&lt;/sub&gt;-或-CO-鍵的碳數1～50的二價烴基， &lt;br/&gt;X為下述式（4）所表示的有機聚矽氧烷結構， &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="149px" width="556px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;相互獨立地為經取代或未經取代的碳數1～10的二價烴基，R&lt;sup&gt;2&lt;/sup&gt;相互獨立地為不具有脂肪族不飽和鍵的經取代或未經取代的碳數1～10的一價烴基，R&lt;sup&gt;3&lt;/sup&gt;相互獨立地為碳數2～10的烯基，m為0～20的整數，n為1～20的整數，其中，m+n小於30，帶波浪線的線表示鍵結鍵，括號內的矽氧烷單元的排列順序為任意）]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2759" publication-number="202628386"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628386.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260305B">H04L5/00</main-classification>  
        <further-classification edition="202301120260305B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉辰辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及無線技術領域，尤其涉及一種通信方法及裝置。本申請可以應用於IEEE802.11ax標準、802.11be標準、802.11bn標準等以及IEEE 802.11系列的其他標準，如802.15標準、802.11bf標準或IMMW標準或星閃標準等。本申請實施例提供的方案設計了離散頻寬60MHz下的子載波規劃，給出了12個52-tone DRU的子載波，6個106-tone DRU的子載波以及3個242-tone DRU的子載波。採用上述DRU傳輸PPDU的部分或全部欄位時，可以有效地提高每個子載波的發射功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of wireless technologies, and in particular, to a communication method and apparatus. This application may be applied to the IEEE 802.11ax standard, the 802.11be standard, the 802.11bn standard, and other standards in the IEEE 802.11 series, such as the 802.15 standard, the 802.11bf standard, the IMMW standard, or the SparkLink standard. The solution provided in embodiments of this application designs subcarrier planning for a discrete bandwidth of 60 MHz, and provides subcarriers for 12 52-tone DRUs, 6 106-tone DRUs, and 3 242-tone DRUs. When using the DRUs to transmit some or all fields of a PPDU, the transmit power of each subcarrier can be effectively improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301、302、303:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2760" publication-number="202628844"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628844.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P52/00</main-classification>  
        <further-classification edition="202601120260302B">H10P72/70</further-classification>  
        <further-classification edition="201801120260302B">C09J7/29</further-classification>  
        <further-classification edition="200601120260302B">C09J5/06</further-classification>  
        <further-classification edition="200601120260302B">C09J133/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，依次包括：準備依次包含黏著性樹脂層（B）、基材層（A）及黏著性樹脂層（C）的黏著性膜（50），繼而，於所述黏著性膜（50）的所述黏著性樹脂層（C）側貼附支持基板（80）的步驟；使所述黏著性膜（50）中的揮發成分量降低的步驟；於所述黏著性膜（50）的所述黏著性樹脂層（B）側貼附電子零件（70）的步驟；對所述電子零件（70）進行背面研磨的步驟；以及於所述電子零件（70）的經背面研磨的面形成金屬層（60）的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of an electronic device includes, in sequence: a step of preparing an adhesive film (50) comprising, in sequence, an adhesive resin layer (B), a base layer (A), and an adhesive resin layer (C), then attaching a support substrate (80) to the adhesive film (50) on the adhesive resin layer (C) side; a step of reducing the amount of volatile components in the adhesive film (50); a step of attaching an electronic component (70) to the adhesive film (50) on the adhesive resin layer (B) side; a step of back-grinding the electronic component (70); and a step of forming a metal layer (60) on the back-grinded surface of the electronic component (70).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:基材層</p>  
        <p type="p">B:黏著性樹脂層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">50:黏著性膜</p>  
        <p type="p">60:金屬層</p>  
        <p type="p">70:電子零件</p>  
        <p type="p">80:支持基板</p>  
        <p type="p">100:結構體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2761" publication-number="202627347"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627347.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖定裝置、壓力容器及鎖定方法</chinese-title>  
        <english-title>LOCKING DEVICE, PRESSURE CONTAINER AND LOCKING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">F17C1/04</main-classification>  
        <further-classification edition="200601120260128B">F17C13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許富傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FU CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭吉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHI MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種鎖定裝置、壓力容器及鎖定方法。該鎖定裝置包括一第一元件、一第二元件、一第一可移動元件、一第二可移動元件以及一頂抵結構。該第一元件具有一第一凹槽和與該第一凹槽相對的一第二凹槽。該第二元件容納在該第一元件中。該第一可移動元件經配置為插入該第一凹槽中並接觸該第二元件。該第二可移動元件經配置為插入該第二凹槽中並接觸該第二元件。該頂抵結構設置於該第一可移動元件和該第二可移動元件之間，用於防止該第一可移動元件和該第二可移動元件分別離開該第一凹槽和該第二凹槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A locking device, a pressure container and a locking method are provided. The locking device includes a first element, a second element, a first movable element, a second movable element and a sustaining structure. The first element defines a first recess and a second recess opposite to the first recess. The second element is accommodated in the first element. The first movable element is configured to be inserted into the first recess and contact the second element. The second movable element is configured to be inserted into the second recess and contact the second element. The sustaining structure is disposed between the first movable element and the second movable element, and is configured to prevent the first movable element and the second movable element from moving away from the first recess and the second recess, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基座部</p>  
        <p type="p">2:蓋子</p>  
        <p type="p">3:外殼</p>  
        <p type="p">4:第一鎖定組件</p>  
        <p type="p">5:第二鎖定組件</p>  
        <p type="p">6:頂抵結構</p>  
        <p type="p">7:鎖定裝置</p>  
        <p type="p">9:壓力容器</p>  
        <p type="p">10:側壁</p>  
        <p type="p">11:第一部份</p>  
        <p type="p">12:第二部份</p>  
        <p type="p">13:第一凹槽</p>  
        <p type="p">14:第二凹槽</p>  
        <p type="p">16:第一進氣通道</p>  
        <p type="p">17:第一排氣通道</p>  
        <p type="p">18:第二進氣通道</p>  
        <p type="p">19:第二排氣通道</p>  
        <p type="p">21:第一耐磨元件</p>  
        <p type="p">22:第二耐磨元件</p>  
        <p type="p">30:上部</p>  
        <p type="p">31:腔室</p>  
        <p type="p">32:冷卻器</p>  
        <p type="p">33:開口</p>  
        <p type="p">34:石英管</p>  
        <p type="p">36:加熱器</p>  
        <p type="p">38:夾緊裝置</p>  
        <p type="p">41:第一可移動元件</p>  
        <p type="p">42:第一驅動元件</p>  
        <p type="p">43:第一橫桿</p>  
        <p type="p">44:第一支撐結構</p>  
        <p type="p">51:第二可移動元件</p>  
        <p type="p">52:第二驅動元件</p>  
        <p type="p">53:第二橫桿</p>  
        <p type="p">54:第二支撐結構</p>  
        <p type="p">61:頂抵元件</p>  
        <p type="p">62:驅動元件</p>  
        <p type="p">63:連接桿</p>  
        <p type="p">90:支撐件</p>  
        <p type="p">91:升降機構</p>  
        <p type="p">92:承接板</p>  
        <p type="p">94:馬達</p>  
        <p type="p">341:內腔室</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">D4:第四方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2762" publication-number="202628883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體設備及其壓力控制方法</chinese-title>  
        <english-title>SEMICONDUCTOR EQUIPMENT AND PRESSURE CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="200601120260302B">G05D16/02</further-classification>  
        <further-classification edition="200601120260302B">G05D16/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許富傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FU CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭吉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHI MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體設備及其壓力控制方法。半導體設備包括高壓處理裝置及壓力平衡元件。高壓處理裝置包括內腔及外腔。內腔經配置為容納於第一壓力之反應氣體。外腔環繞內腔，且經配置為容納於第二壓力之惰性氣體。高壓處理裝置中的外腔與內腔隔離。壓力平衡元件通過第一管連接內腔、通過與第一管隔離之第二管連接外腔及經配置為當第一壓力與第二壓力之間的壓力差大於預定壓力差時，平衡第一壓力和第二壓力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor equipment and a pressure control method are provided. The semiconductor equipment includes a high-pressure processing apparatus and a pressure balancing element. The high-pressure processing apparatus includes an inner chamber and an outer chamber. The inner chamber is configured to accommodate a reaction gas at a first pressure. The outer chamber surrounds the inner chamber and is configured to accommodate an inert gas at a second pressure. The outer chamber is isolated from the inner chamber in the high-pressure processing apparatus. The pressure balancing element is connected to the inner chamber through a first pipe, connected to the outer chamber through a second pipe isolated from the first pipe, and is configured to balance the first pressure and the second pressure when a pressure difference between the first pressure and the second pressure is greater than a predetermined pressure difference.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體設備</p>  
        <p type="p">10:高壓處理裝置</p>  
        <p type="p">11:內腔</p>  
        <p type="p">12:外腔</p>  
        <p type="p">20:壓力平衡元件</p>  
        <p type="p">21:第一空間</p>  
        <p type="p">22:第二空間</p>  
        <p type="p">23:隔離元件</p>  
        <p type="p">31:第一管</p>  
        <p type="p">32:第二管</p>  
        <p type="p">40:偵測元件</p>  
        <p type="p">41:光發射器</p>  
        <p type="p">42:光接收器</p>  
        <p type="p">51:第一排氣管</p>  
        <p type="p">52:第二排氣管</p>  
        <p type="p">61:第一壓力傳送元件</p>  
        <p type="p">62:第二壓力傳送元件</p>  
        <p type="p">71:第一壓力控制元件</p>  
        <p type="p">72:第二壓力控制元件</p>  
        <p type="p">81:反應氣體供應管</p>  
        <p type="p">82:惰性氣體供應管</p>  
        <p type="p">91:第一增壓元件</p>  
        <p type="p">92:第二增壓元件</p>  
        <p type="p">10A:進口端</p>  
        <p type="p">10B:出口端</p>  
        <p type="p">101:外殼</p>  
        <p type="p">102:外蓋</p>  
        <p type="p">103:內罩</p>  
        <p type="p">104:密封元件</p>  
        <p type="p">1011:第一部分</p>  
        <p type="p">1012:第二部分</p>  
        <p type="p">G&lt;sub&gt;1&lt;/sub&gt;:反應氣體</p>  
        <p type="p">G&lt;sub&gt;2&lt;/sub&gt;:惰性氣體</p>  
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;:第一壓力</p>  
        <p type="p">P&lt;sub&gt;2&lt;/sub&gt;:第二壓力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2763" publication-number="202627330"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627330.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>密封結構、壓力容器及密封方法</chinese-title>  
        <english-title>SEALING STRUCTURE, PRESSURE CONTAINER AND SEALING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">F16J15/12</main-classification>  
        <further-classification edition="200601120260128B">F17C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五十嵐玲太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARASHI, REITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許富傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FU CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭吉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHI MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種密封結構、壓力容器及密封方法。該密封結構包括一第一部分以及一第二部分。該第一部分界定一第一凹槽，其中該第一凹槽的開口朝向一第一方向。該第二部分界定一第二凹槽，其中該第二凹槽的開口朝向一第二方向，該第二方向與該第一方向相反，其中該第一部分圍繞該第二部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sealing structure, a pressure container and a sealing method are provided. The sealing structure includes a first portion and a second portion. The first portion defines a first groove opening toward a first direction. The second portion defines a second groove opening toward a second direction opposite to the first direction. The first portion surrounds the second portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:壓力容器</p>  
        <p type="p">2:外腔體</p>  
        <p type="p">3:內腔體</p>  
        <p type="p">4:蓋子</p>  
        <p type="p">5:密封結構</p>  
        <p type="p">10:底座部分</p>  
        <p type="p">12:加熱器</p>  
        <p type="p">14:冷卻器</p>  
        <p type="p">16:緊固件</p>  
        <p type="p">17:緊固件</p>  
        <p type="p">20:開口</p>  
        <p type="p">21:第一空腔</p>  
        <p type="p">22:第一固定部</p>  
        <p type="p">31:第二空腔</p>  
        <p type="p">32:第二固定部</p>  
        <p type="p">61:上緩衝材料</p>  
        <p type="p">62:下緩衝材料</p>  
        <p type="p">105:貫穿孔</p>  
        <p type="p">106:貫穿孔</p>  
        <p type="p">227:第一孔</p>  
        <p type="p">228:第一孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2764" publication-number="202627799"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627799.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148630</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於執行多類型指令的流控制的處理器及相關方法</chinese-title>  
        <english-title>PROCESSOR FOR PERFORMING FLOW CONTROL OF MULTIPLE TYPES OF INSTRUCTIONS AND RELATED METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260202B">G06F9/38</main-classification>  
        <further-classification edition="201801120260202B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂育光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YU-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮國興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, KUO-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛琮樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, TSUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范博鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, PO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種用於執行多類型指令的流控制的處理器及方法。該處理器包括第一管線處理電路、第二管線處理電路、第一流控制單元和第二流控制單元。第一管線處理電路從該處理器的外部接收該多類型指令並處理第一類型指令。第二管線處理電路從第一管線處理電路接收該多類型指令並處理第二類型指令。第一流控制單元和第二流控制單元分別從第一管線處理電路和第二管線處理電路接收第三類型指令，以根據該第三類型指令生成控制資訊。第一管線處理電路和第二管線處理電路分別從第一流控制單元和第二流控制單元獲得控制資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processor and a method for performing flow control of multiple types of instructions are provided. The processor includes a first pipeline processing circuit, a second pipeline processing circuit, a first flow control unit and a second flow control unit. The first pipeline processing circuit receives the multiple types of instructions from outside of the processor and handles a first-type instruction. The second pipeline processing circuit receives the multiple types of instructions from the first pipeline processing circuit and handles a second-type instruction. The first flow control unit and the second flow control unit receives a third-type instruction from the first pipeline processing circuit and the second pipeline processing circuit, respectively, for generating control information according to the third-type instruction. The first pipeline processing circuit and the second pipeline processing circuit obtain the control information from the first flow control unit and the second flow control unit, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:指令處理器</p>  
        <p type="p">111:第一流控制操作電路</p>  
        <p type="p">121:第二流控制操作電路</p>  
        <p type="p">110:第一管線處理電路</p>  
        <p type="p">112,122:功能單元(FU)</p>  
        <p type="p">120:第二管線處理電路</p>  
        <p type="p">111R,121R:流控制暫存器檔案(FCRF)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2765" publication-number="202626353"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626353.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆金屬積層板、電路基板、電子元件及電子設備</chinese-title>  
        <english-title>METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">B32B15/08</main-classification>  
        <further-classification edition="201901120260321B">B32B7/022</further-classification>  
        <further-classification edition="200601120260321B">C08G73/10</further-classification>  
        <further-classification edition="200601120260321B">H05K1/03</further-classification>  
        <further-classification edition="200601120260321B">H05K3/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日鐵化學材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍戸勇太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIDO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種覆金屬積層板，能夠在確保金屬層與絕緣樹脂層的密著性的同時抑制絕緣樹脂層的斷裂、維持充分的伸長率。一種覆金屬積層板，其具備絕緣樹脂層及積層於該絕緣樹脂層的一側或兩側的金屬層，絕緣樹脂層具有與金屬層相接的聚醯亞胺層（A）及與該聚醯亞胺層（A）相鄰地積層的聚醯亞胺層（B）。聚醯亞胺層（A）的300℃下的儲存模數E’為1.5×10&lt;sup&gt;9&lt;/sup&gt;[Pa]以下，聚醯亞胺層（B）的300℃下的儲存模數E’為1.8×10&lt;sup&gt;9&lt;/sup&gt;[Pa]以上，將去除金屬層時對聚醯亞胺層（A）的露出表面測量的絕緣樹脂層的最大谷深設為Sv[μm]，將聚醯亞胺層（A）的厚度設為d[μm]時，滿足2d≥Sv＞0.5d的關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:金屬層</p>  
        <p type="p">20:絕緣樹脂層</p>  
        <p type="p">21、23:熱塑性聚醯亞胺層</p>  
        <p type="p">22:非熱塑性聚醯亞胺層</p>  
        <p type="p">100:覆金屬積層板</p>  
        <p type="p">S:露出表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2766" publication-number="202628851"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628851.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於移除表面氧化物的設備及方法</chinese-title>  
        <english-title>APPARATUS AND PROCESS FOR REMOVAL OF SURFACE OXIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260305B">H10P54/90</main-classification>  
        <further-classification edition="202601120260305B">H10P72/70</further-classification>  
        <further-classification edition="202601120260305B">H10P72/30</further-classification>  
        <further-classification edition="200601120260305B">H01J37/315</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商氣體產品及化學品股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIR PRODUCTS AND CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿藍尼　格雷哥戈羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARSLANIAN, GREGORY KHOSROV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃爾克　麥可史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALCK, MICHAEL SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於移除表面氧化物的設備及方法包括用於發射電子以供電子附接的電子發射器裝置，以促進從經過烘箱或爐的（多個）晶圓的表面的柱上的焊料凸塊及/或焊料帽(solder cap)移除氧化物。該電子發射器裝置可以包括具有電子發射構件的一或多個模組，該電子發射構件具有定位在不同殼體元件之間的複數個突起，使得該等突起延伸穿過界定在該等殼體元件之間的界面處的開口。該裝置的各模組可以經由使用緊固件或（多個）其他機構（例如經由螺栓或螺釘等）以模組化方式可釋放地附接至模組支撐構件以用於修理或替換，使得維護工作可以更快速及高效地發生以減少設備的停機時間並改進操作靈活性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus and process for removal of surface oxides includes an electron emitter device for emission of electrons for electron attachment to facilitate removal of oxides from solder bumps and/or solder caps on pillars of the surface of wafer(s) passing through an oven or furnace. The electron emitter device can include one or more modules having an electron emitting member with a plurality of projections positioned between different housing elements so that the projections extend through openings defined at an interface between the housing elements. Each module of the device can be releasably attached to a module support member for repair or replacement in a modular fashion via use of fasteners or other mechanism(s) (e.g. via bolts or screws, etc.) so that maintenance work can occur more quickly and efficiently to reduce downtime of equipment and improve operational flexibility.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:用於晶圓處理的設備</p>  
        <p type="p">3:烘箱</p>  
        <p type="p">4:用於移除表面氧化物的設備</p>  
        <p type="p">5:電子發射器裝置</p>  
        <p type="p">5a:第一電子發射器裝置</p>  
        <p type="p">5b:第二電子發射器裝置</p>  
        <p type="p">6:輸送機構</p>  
        <p type="p">W:晶圓</p>  
        <p type="p">WM:晶圓移動方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2767" publication-number="202628113"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628113.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽-氧化物-氮化物-氧化物-矽型非揮發性記憶體</chinese-title>  
        <english-title>SILICON-OXIDE-NITRIDE-OXIDE-SILICON TYPE NON-VOLATILE MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G11C16/34</main-classification>  
        <further-classification edition="200601120260302B">G11C16/14</further-classification>  
        <further-classification edition="200601120260302B">G11C16/02</further-classification>  
        <further-classification edition="200601120260302B">G11C7/18</further-classification>  
        <further-classification edition="200601120260302B">G11C8/14</further-classification>  
        <further-classification edition="202501120260302B">H10D62/10</further-classification>  
        <further-classification edition="202501120260302B">H10D62/60</further-classification>  
        <further-classification edition="202501120260302B">H10D62/80</further-classification>  
        <further-classification edition="202601120260302B">H10P54/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎俊霄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-HSIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍章俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNG, CHANG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉明源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種矽-氧化物-氮化物-氧化物-矽型非揮發性記憶體，其包括一記憶胞陣列。記憶胞陣列中包括一記憶胞區(memory cell area)以及一非記憶胞區(non-memory cell area)。本發明在記憶胞區設計SONOS記憶胞的連接關係，將記憶胞陣列區分為多個區塊(section)。於抹除動作時，可以針對記憶胞陣列中的一個區塊進行抹除動作，而其他區塊則未進行抹除動作。再者，本發明在非記憶胞區設計隔離電晶體，用以隔離井區線與位元線，使得SONOS記憶胞能夠正常運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A SONOS type non-volatile memory includes a memory cell array. The memory cell array includes a memory cell area and a non-memory cell area. The connection relationship between SONOS memory cells in the memory cell area are specially designed, and the memory cell array is divided into multiple sections. When the erase action is performed, only one section in the memory cell array is erased, but the other sections are not erased. Furthermore, isolation transistors are provided in the non-memory cell area to isolate the well lines and the bit line. Consequently, the SONOS memory cells can be operated normally.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:隔離結構</p>  
        <p type="p">310,360:隔離閘極結構</p>  
        <p type="p">314,364:隔離閘極層</p>  
        <p type="p">320,350:選擇閘極結構</p>  
        <p type="p">324,354:選擇閘極層</p>  
        <p type="p">330,340:儲存閘極結構</p>  
        <p type="p">338,348:控制閘極層</p>  
        <p type="p">371~377:p型摻雜區</p>  
        <p type="p">381,382:n型摻雜區</p>  
        <p type="p">391,392,393,394:導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2768" publication-number="202628884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製程系統及其操作方法</chinese-title>  
        <english-title>SEMICONDUCTOR PROCESSING SYSTEM AND METHOD OF OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許富傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FU CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭吉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHI MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHUN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體製程系統及其操作方法，其中該半導體製程系統包括：一製程腔體、一製程氣體排放管線，以及一冷卻氣體源。該製程氣體排放管線連接於該製程腔體，並經組態以自該製程腔體排出一製程氣體。該冷卻氣體源經由一冷卻氣體管線連接至該製程氣體排放管線，並經組態以將一冷卻氣體供應至該製程氣體排放管線中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor processing system and a method of operating the same, in which the semiconductor processing system comprises: a process chamber, a process gas exhaust pipeline, and a cooling gas source. The process gas exhaust pipeline is connected to the process chamber and configured to expel a process gas from the process chamber. The cooling gas source is connected to the process gas exhaust pipeline through a cooling gas pipeline and configured to supply a cooling gas into the process gas exhaust pipeline.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體製程系統</p>  
        <p type="p">10:製程腔體/製程反應腔體</p>  
        <p type="p">11:製程氣體供應組件</p>  
        <p type="p">12:製程氣體排放組件</p>  
        <p type="p">13:冷卻氣體供應組件</p>  
        <p type="p">101:外腔體</p>  
        <p type="p">102:內腔體</p>  
        <p type="p">110:製程氣體供應管線</p>  
        <p type="p">111:製程氣體源</p>  
        <p type="p">113:增壓元件</p>  
        <p type="p">120:製程氣體排氣管線</p>  
        <p type="p">121:冷卻元件</p>  
        <p type="p">122:惰性冷媒源</p>  
        <p type="p">123:溫度測量元件</p>  
        <p type="p">124:開關元件/冷媒開關元件</p>  
        <p type="p">125:溫度測量元件</p>  
        <p type="p">126:製程氣體低壓排氣管</p>  
        <p type="p">127:壓力控制元件</p>  
        <p type="p">128:製程氣體低壓緩衝容器/緩衝容器</p>  
        <p type="p">129:淨化器</p>  
        <p type="p">130:冷卻氣體輸送管線</p>  
        <p type="p">131:冷卻氣體源</p>  
        <p type="p">133:氣體輸送管線開關元件</p>  
        <p type="p">135:單向閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2769" publication-number="202628109"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628109.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低電容耦合效應的感測放大器、感測電路和包括此感測電路的記憶體裝置</chinese-title>  
        <english-title>SENSE AMPLIFIER REDUCING CAPACITIVE COUPLING EFFECT AND A SENSE CIRCUIT AND A MEMORY DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G11C16/26</main-classification>  
        <further-classification edition="200601120260202B">G11C16/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊又叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YOU-RUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示文件提供一種感測放大器。感測放大器包括第一至第三電晶體、偏壓電路和電壓耦合電路。第一電晶體耦接在第一電源端和第一節點之間。第二電晶體耦接在第一節點和第二節點之間，且其閘極接收參考電壓。第三電晶體耦接在第一節點和第三節點之間，且其閘極接收資料電壓。偏壓電路將第二節點和第三節點耦接到第二電源端。電壓耦合電路耦接在第一節點和第二電晶體的閘極之間，並向第二電晶體的閘極提供第一電壓。第一電壓與第一節點處的電壓呈負相關。第二電晶體的閘極的電阻-電容負載小於第三電晶體的閘極的電阻-電容負載。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sense amplifier is provided. The sense amplifier includes first through third transistors, a bias circuit, and a voltage coupling circuit. The first transistor is coupled between a first power terminal and a first node. The second transistor is coupled between the first and second nodes, and has a gate receiving a reference voltage. The third transistor is coupled between the first and third nodes, and has a gate receiving a data voltage. The bias circuit couples the second and third nodes to a second power terminal. The voltage coupling circuit is coupled between the first node and the gate of the second transistor, and provides a voltage to the gate of the second transistor. The first voltage is negatively correlated to a voltage at the first node. The gate of the second transistor has a resistor-capacitor loading smaller than that of the gate of the third transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:參考電壓線</p>  
        <p type="p">300A:感測放大器</p>  
        <p type="p">310A:電壓耦合電路</p>  
        <p type="p">312:電容器</p>  
        <p type="p">314:反相器</p>  
        <p type="p">320:偏壓電路</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">EN:致能訊號</p>  
        <p type="p">M1:電晶體</p>  
        <p type="p">M2:電晶體</p>  
        <p type="p">M3:電晶體</p>  
        <p type="p">M4:電晶體</p>  
        <p type="p">MA1:電晶體</p>  
        <p type="p">MA2:電晶體</p>  
        <p type="p">MA3:電晶體</p>  
        <p type="p">MA4:電晶體</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">N3:第三節點</p>  
        <p type="p">N4:第四節點</p>  
        <p type="p">N5:第五節點</p>  
        <p type="p">P1:第一電源端</p>  
        <p type="p">P2:第二電源端</p>  
        <p type="p">Vcom:共同電壓</p>  
        <p type="p">Vda:資料電壓</p>  
        <p type="p">Vref:參考電壓</p>  
        <p type="p">V1:第一電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2770" publication-number="202627038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻組合物</chinese-title>  
        <english-title>ETCHING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09K13/06</main-classification>  
        <further-classification edition="200601120260401B">C23F1/10</further-classification>  
        <further-classification edition="202601120260401B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WENBEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, BING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WINSTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭辛煊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, XINXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種氮化鈦蝕刻組合物，所述蝕刻組合物包括氧化物、緩蝕劑、銨鹽、表面活性劑和水。採用本發明的組合物，能夠有效去除氮化鈦，同時避免對氧化矽刻蝕，操作視窗較大，在半導體蝕刻製程中具有良好的應用前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a titanium nitride etching composition, which comprises an oxide, a corrosion inhibitor, an ammonium salt, a surfactant, and water. The composition of the present invention can effectively remove titanium nitride while preventing etching of silicon dioxide, offering a wide processing window and promising applications in semiconductor etching processes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2771" publication-number="202626999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光液</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SLURRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09G1/02</main-classification>  
        <further-classification edition="200601120260401B">C09K3/14</further-classification>  
        <further-classification edition="202601120260401B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹佳鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, JIAPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郁夏盈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, XIAYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林海峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種化學機械拋光液，包括：研磨顆粒、螯合劑、保護劑、潤濕劑、pH調節劑和水。實現了多晶矽平坦化，降低圖案化材料表面缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a chemical mechanical polishing slurry, comprising: abrasive particles, a chelating agent, a protective agent, a wetting agent, a pH adjuster, and water. It achieves polysilicon planarization and reduces surface defects of patterned materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2772" publication-number="202627906"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627906.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>時間預測方法及半導體製程設備</chinese-title>  
        <english-title>TIME PREDICTION METHOD AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">G06Q10/04</main-classification>  
        <further-classification edition="200601120251229B">G05B19/418</further-classification>  
        <further-classification edition="202301120251229B">G06Q10/0631</further-classification>  
        <further-classification edition="201201120251229B">G06Q50/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏昆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相會鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG, HUI FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李漢傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HAN JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種時間預測方法及半導體製程設備。該方法包括：獲得當前即時狀態下調度任務中每個晶圓的剩餘加工總時間；獲得當前即時狀態下調度任務中每個處理模組的必要閒置時間；根據每個晶圓的剩餘加工總時間和每個處理模組的必要閒置時間，獲得當前即時狀態下調度任務中所有晶圓的完成加工的時間。本申請在預測完成加工的時間的過程中，遍歷到調度任務中的所有晶圓，考慮到了每個晶圓的剩餘加工總時間，同時考慮到了當前即時狀態下所有處理模組的必要閒置時間，實現了某加工狀態下對整個調度任務所有晶圓完成加工的時間的精準預測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a time prediction method and a semiconductor processing equipment. The method includes: obtaining the remaining total processing time for each wafer in the scheduling task under the current real-time status; obtaining the required idle time for each processing module in the scheduling task under the current real-time status; and, based on the remaining total processing time for each wafer and the required idle time for each processing module, obtaining the time for accomplishing the processing of all wafers in the scheduling task under the current real-time status. In the process of predicting the time for accomplishing the processing, this application traverses all wafers in the scheduling task and takes into account the remaining total processing time for each wafer, while also considering the required idle time for all processing modules under the current real-time status, thereby achieving an accurate prediction of the time required to accomplish the processing of all wafers in the entire scheduling task under a certain processing status.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201,S202,S203:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2773" publication-number="202628309"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628309.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充放電控制電路、充放電控制裝置、及電池裝置</chinese-title>  
        <english-title>CHARGE-DISCHARGE CONTROL CIRCUIT, CHARGE-DISCHARGE CONTROL DEVICE, AND BATTERY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260302B">H02J7/02</main-classification>  
        <further-classification edition="200601120260302B">H02J7/10</further-classification>  
        <further-classification edition="202601120260302B">H02J7/00</further-classification>  
        <further-classification edition="200601120260302B">H01M10/42</further-classification>  
        <further-classification edition="200601120260302B">H01M10/48</further-classification>  
        <further-classification edition="200601120260302B">H02H7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商艾普凌科有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABLIC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福地晋也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUCHI, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野和亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, KAZUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於在級聯連接有多個保護IC的情況下抑制電路規模。電池裝置（10）包括：電池（11）；第一規定狀態檢測部，對第一電芯檢測第一規定狀態；第一邏輯電路，進行基於第一規定狀態檢測部的檢測結果的第一控制；第二規定狀態檢測部，對第二電芯（111B）檢測第二規定狀態；充電器連接檢測部，對電池（11）與充電器有無連接進行檢測；以及第二邏輯電路（62B），進行基於第二規定狀態檢測部的檢測結果、充電器連接檢測部的檢測結果、及來自第一邏輯電路的內容為第一規定狀態的第一通知的第二控制，第一規定狀態及第二規定狀態為過充電狀態或過放電狀態，在充電器連接檢測部的檢測結果滿足規定條件的情況下，第二邏輯電路（62B）遮罩來自第一邏輯電路的第一通知，並進行第二控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">When multiple protection ICs are cascade connected, circuit scale is suppressed. A battery device (10) includes a battery (11); a first predetermined state detection part that detects a first predetermined state regarding a first cell; a first logic circuit that performs first control based on a detection result of the first predetermined state detection part; a second predetermined state detection part that detects a second predetermined state regarding a second cell (111B); a charger connection detection part that detects presence or absence of connection between the battery (11) and a charger; and a second logic circuit (62B) that performs second control based on a detection result of the second predetermined state detection part, a detection result of the charger connection detection part, and a first notification from the first logic circuit regarding the first predetermined state. The first predetermined state and the second predetermined state are an over-charge state or an over-discharge state, and the second logic circuit (62B) masks the first notification from the first logic circuit and performs the second control in response to the detection result of the charger connection detection part satisfying a predetermined condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池裝置</p>  
        <p type="p">11:電池</p>  
        <p type="p">11B:電池部</p>  
        <p type="p">20:充放電控制裝置</p>  
        <p type="p">21:放電控制用FET</p>  
        <p type="p">22:充電控制用FET</p>  
        <p type="p">30、30B:充放電控制電路</p>  
        <p type="p">51B、52B、53B:過放電檢測梯形電阻器</p>  
        <p type="p">54B、55B、56B:過充電檢測梯形電阻器</p>  
        <p type="p">62B:第二邏輯電路</p>  
        <p type="p">71B、72B:開關</p>  
        <p type="p">81B:過放電檢測比較器</p>  
        <p type="p">82B:過充電檢測比較器</p>  
        <p type="p">91B:放電控制信號檢測電路</p>  
        <p type="p">92B:充電控制信號檢測電路</p>  
        <p type="p">93B:放電控制信號輸出電路</p>  
        <p type="p">94B:充電控制信號輸出電路</p>  
        <p type="p">95B:充電器連接檢測電路</p>  
        <p type="p">111B:第二電芯</p>  
        <p type="p">C1B、C2B:電源輸入端子</p>  
        <p type="p">C4B:外部電壓輸入端子</p>  
        <p type="p">C5B:放電控制用FET閘極連接端子</p>  
        <p type="p">C6B:充電控制用FET閘極連接端子</p>  
        <p type="p">C7B:DO端子輸出控制端子</p>  
        <p type="p">C8B:CO端子輸出控制端子</p>  
        <p type="p">C11B、C12B:電壓連接端子</p>  
        <p type="p">CO、DO、CTLC、CTLD:端子</p>  
        <p type="p">VC(n)、VC(n+1)、VDD、VM、VSS:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2774" publication-number="202628222"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628222.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池芯陣列結構以及包含電池芯陣列結構的電池組和車輛</chinese-title>  
        <english-title>CELL ARRAY STRUCTURE, AND BATTERY PACK AND VEHICLE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260305B">H01M10/613</main-classification>  
        <further-classification edition="201401120260305B">H01M10/625</further-classification>  
        <further-classification edition="201401120260305B">H01M10/653</further-classification>  
        <further-classification edition="201401120260305B">H01M10/6551</further-classification>  
        <further-classification edition="202101120260305B">H01M50/204</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, EUI-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭渽勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAE-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹仁世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, IN-SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAE-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔泰雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TAE-WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露電池芯陣列結構，包括多個電池芯；以及至少一個側邊結構，配置為容納和支撐多個電池芯，且側邊結構包括電池芯接觸部，配置為至少部分與電池芯接觸；以及冷卻構件接觸部，具有形成為與冷卻構件的預定區域接觸的底表面，冷卻構件配置為冷卻電池芯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a cell array structure, which includes a plurality of battery cells; and at least one side structure configured to accommodate and support the plurality of battery cells, and the side structure includes a cell contact portion configured such that at least a portion thereof is in contact with the battery cells; and a cooling member contact portion having a bottom surface formed to be in contact with a predetermined area of ​​a cooling member configured to cool the battery cells.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電池芯陣列結構</p>  
        <p type="p">110:電池芯</p>  
        <p type="p">111:第一電極端子</p>  
        <p type="p">112:第二電極端子</p>  
        <p type="p">120:側邊結構</p>  
        <p type="p">130:側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2775" publication-number="202628979"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628979.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>互連結構、包括其之電子裝置及包括其之電子設備</chinese-title>  
        <english-title>INTERCONNECT STRUCTURE, ELECTRONIC DEVICE INCLUDING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10W20/40</main-classification>  
        <further-classification edition="202601120260317B">H10W20/44</further-classification>  
        <further-classification edition="200601120260317B">C22C27/02</further-classification>  
        <further-classification edition="200601120260317B">C22C27/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙奇迎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, GIYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓有陳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, YU JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭太遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, TAE WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONGYUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁大珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DAEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申建旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, KEUN WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種互連結構、一種包括該互連結構之電子裝置，以及一種包括該互連結構之電子設備。該互連結構包括：一介電層，其具有一溝槽結構；以及一傳導佈線層，其填充於該溝槽結構內部，包括一由化學式1表示之合金：&lt;br/&gt; 化學式1&lt;br/&gt; M&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;1-x&lt;/sub&gt;M&lt;sup&gt;2&lt;/sup&gt;&lt;sub&gt;x&lt;/sub&gt;&lt;br/&gt; 在化學式1中，M&lt;sup&gt;1&lt;/sup&gt;為鉬、鎢或其一組合中之一者，M&lt;sup&gt;2&lt;/sup&gt;為鈮、釩或其一組合中之一者，且x小於約0.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An interconnect structure, an electronic device including the same, and an electronic apparatus including the same. The interconnect structure includes a dielectric layer having a trench structure; and a conductive wiring layer including an alloy represented by Chemical Formula 1 filled inside the trench structure:&lt;br/&gt; Chemical Formula 1&lt;br/&gt; M&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;1-x&lt;/sub&gt;M&lt;sup&gt;2&lt;/sup&gt;&lt;sub&gt;x&lt;/sub&gt;&lt;br/&gt; In Chemical Formula 1, M&lt;sup&gt;1&lt;/sup&gt; is one of molybdenum, tungsten, or a combination thereof, M&lt;sup&gt;2&lt;/sup&gt; is one of niobium, vanadium, or a combination thereof, and x is less than about 0.5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:互連結構</p>  
        <p type="p">101:介電層</p>  
        <p type="p">101a:溝槽結構</p>  
        <p type="p">103:傳導佈線層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2776" publication-number="202628455"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628455.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>終端、終端與服務細胞通訊的操作方法、以及通訊系統的操作方法</chinese-title>  
        <english-title>TERMINAL, OPERATIN METHOD OF A TERMINAL IN COMMUNICATION WITH A SERVING CELL AND OPERATION METHOD OF A COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260102B">H04W52/02</main-classification>  
        <further-classification edition="201801120260102B">H04W76/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴珍雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JINWOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭多海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONG, DAHAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金釩坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BEOMKON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>都周鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DO, JOOHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供終端、終端與服務細胞通訊的操作方法、以及通訊系統的操作方法。終端包括：射頻（radio frequency，RF）電路，包括低功率接收器和主接收器；記憶體，經組態以儲存指示低功率接收器的效能的第一資訊；以及處理器，經組態以基於第一資訊確定使用低功率接收器和主接收器中的至少一者執行無線電資源管理（radio resource management，RRM）量測的操作方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a terminal, operation method of a terminal in communication with a serving cell and operation method of a communication system. The terminal includes: a radio frequency (RF) circuit including a low-power receiver and a main receiver; a memory configured to store first information indicating a performance of the low-power receiver; and a processor configured to determine an operation scheme for performing radio resource management (RRM) measurement using at least one of the low-power receiver and the main receiver based on the first information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一基地台</p>  
        <p type="p">20:第二基地台</p>  
        <p type="p">30:第三基地台</p>  
        <p type="p">100:終端</p>  
        <p type="p">CELL#1、CELL#2、CELL#3:細胞</p>  
        <p type="p">BW#1、BW#2:頻寬</p>  
        <p type="p">B#1、B#2:頻帶</p>  
        <p type="p">LR_INFO:低功率接收器資訊</p>  
        <p type="p">LP:低功率接收器</p>  
        <p type="p">MR:主接收器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2777" publication-number="202626822"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626822.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、硬化物、硬化物的製造方法、半導體裝置及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G8/04</main-classification>  
        <further-classification edition="200601120260401B">C08G73/10</further-classification>  
        <further-classification edition="200601120260401B">C08G73/22</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/022</further-classification>  
        <further-classification edition="200601120260401B">G03F7/039</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下彩帆里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, SAHORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本啓華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KEIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林康宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種可獲得溶劑溶解性良好、感度高、於加熱處理時保持圖案形狀、斷裂伸長率高的硬化物的感光性樹脂組成物，其解決手段為一種感光性樹脂組成物，其含有：包含具有特定結構的二胺殘基的聚醯亞胺樹脂（A1）、酚樹脂（A2）、感光劑（B）及溶劑（C）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:畫素分割層具有含有厚膜部與薄膜部的階差形狀的顯示裝置</p>  
        <p type="p">101:基板</p>  
        <p type="p">102:金屬配線</p>  
        <p type="p">103:TFT元件層</p>  
        <p type="p">104:層間絕緣層</p>  
        <p type="p">105:TFT平坦化層/TFT保護層</p>  
        <p type="p">106:具有階差形狀的畫素分割層</p>  
        <p type="p">106a:畫素分割層部中的薄膜部</p>  
        <p type="p">107:第一電極</p>  
        <p type="p">108:發光層</p>  
        <p type="p">109:第二電極</p>  
        <p type="p">110:密封層</p>  
        <p type="p">111:觸控面板配線/觸控面板電極</p>  
        <p type="p">112:彩色濾光片層</p>  
        <p type="p">113:黑色矩陣層</p>  
        <p type="p">114:覆蓋層</p>  
        <p type="p">115:基板</p>  
        <p type="p">116:畫素分割層中的厚膜部</p>  
        <p type="p">100x:俯視時的剖面軸</p>  
        <p type="p">112a:彩色濾光片層部</p>  
        <p type="p">116a:畫素分割層部中的厚膜部</p>  
        <p type="p">117a:具有階差形狀的畫素分割層部的開口部</p>  
        <p type="p">118a:黑色矩陣層部的開口部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2778" publication-number="202626810"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626810.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物、光學構件、光學濾波器、固體攝像裝置及照相機模組</chinese-title>  
        <english-title>COMPOSITION, OPTICAL MEMBER, OPTICAL FILTER, SOLID-STATE IMAGING DEVICE, AND CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08F220/14</main-classification>  
        <further-classification edition="200601120260302B">C08F220/18</further-classification>  
        <further-classification edition="200601120260302B">C08F220/32</further-classification>  
        <further-classification edition="200601120260302B">C08F222/40</further-classification>  
        <further-classification edition="200601120260302B">C08L33/10</further-classification>  
        <further-classification edition="200601120260302B">C08L35/00</further-classification>  
        <further-classification edition="200601120260302B">C08K5/1545</further-classification>  
        <further-classification edition="200601120260302B">C08K5/18</further-classification>  
        <further-classification edition="200601120260302B">C08K5/55</further-classification>  
        <further-classification edition="200601120260302B">G02B1/04</further-classification>  
        <further-classification edition="200601120260302B">G02B5/22</further-classification>  
        <further-classification edition="202101120260302B">G03B11/00</further-classification>  
        <further-classification edition="202301120260302B">H04N23/55</further-classification>  
        <further-classification edition="202301120260302B">H04N25/13</further-classification>  
        <further-classification edition="202501120260302B">H10F39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二村聡太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIMURA, SOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茂木武志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOGI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田智士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎佑樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山耕治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>下河広幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMOGAWA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在包括由組合物形成的層的光學濾波器中螢光產生的抑制性優異、且耐裂紋性及塗布外觀優異的組合物。一種組合物、光學構件及光學濾波器以及包括所述光學濾波器的固體攝像裝置及照相機模組，所述組合物含有：聚合物1，包含（i）選自源自N-取代馬來醯亞胺化合物的結構單元及源自具有橋環脂環式烴基的化合物的結構單元中的至少一種結構單元、及（ii）源自具有(甲基)丙烯醯基的化合物的結構單元（其中，所述（ii）的結構單元中不包含與所述（i）相符的結構單元），且通過凝膠滲透色譜（GPC）法測定而得的、聚苯乙烯換算的重量平均分子量（Mw）為50,000～1,500,000；近紅外線吸收劑；以及溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2779" publication-number="202627524"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627524.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統裝置及框體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260225B">G01S17/894</main-classification>  
        <further-classification edition="202001120260225B">G01S17/10</further-classification>  
        <further-classification edition="200601120260225B">G01S7/497</further-classification>  
        <further-classification edition="200601120260225B">G01S7/481</further-classification>  
        <further-classification edition="202101120260225B">G02B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＣＩＶＡＸ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCIVAX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村智宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中覚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在使用了飛行時間（TOF）法的三維測量感測器中，降低延遲或雜訊的影響，提高測量精度的光學系統裝置。一種光學系統裝置，具有：光照射單元1，能夠照射光10；光學元件3，對光10發揮光學功能；以及框體2，與光學元件3一起內包光照射單元1，所述光學系統裝置的特徵在於，框體2具有光提取部21，所述光提取部21用於將光照射單元1的光提取至規定位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光照射單元</p>  
        <p type="p">2:框體</p>  
        <p type="p">3:光學元件</p>  
        <p type="p">4:波導</p>  
        <p type="p">5:光檢測單元</p>  
        <p type="p">10:光</p>  
        <p type="p">21:光提取部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2780" publication-number="202627435"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627435.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148810</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軸力測量裝置、軸力測量方法，以及軸力測量系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G01L5/24</main-classification>  
        <further-classification edition="202001120260211B">G01L5/16</further-classification>  
        <further-classification edition="201901120260211B">G06F16/24</further-classification>  
        <further-classification edition="200601120260211B">G06F17/10</further-classification>  
        <further-classification edition="201801120260211B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上剛志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田貴彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADA, TAKAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長埜浩太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANO, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]即便於緊固元件產生偏心之情形，亦以高精度測量其軸力。 &lt;br/&gt;　　[解決手段]軸力測量裝置，係具備：圖像取得部，係取得至少2張攝影了軸力產生變化之狀態之緊固元件之緊固元件圖像；應變計算部，係根據緊固元件圖像，計算產生於緊固元件之徑方向應變；應變分布抽出部，係自徑方向應變抽出緊固元件之預定剖面之徑方向應變分布，並且特定出緊固元件之偏心之方向；偏心計算部，係根據徑方向應變分布，計算緊固元件之偏心之大小；軸力資料庫，係對於產生在緊固元件之每個軸力，與偏心之方向及偏心之大小之組合建立對應關係而登錄徑方向應變分布；以及軸力檢索部，係參照軸力資料庫，檢索所計算之偏心之前述方向及偏心之大小，以及對應於所抽出之徑方向應變分布之軸力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:螺栓</p>  
        <p type="p">22:螺帽</p>  
        <p type="p">23:被緊固體</p>  
        <p type="p">F:軸力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2781" publication-number="202629002"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629002.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路基材加勁件</chinese-title>  
        <english-title>INTEGRATED CIRCUIT SUBSTRATE STIFFENER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10W70/02</main-classification>  
        <further-classification edition="202601120260327B">H10W70/62</further-classification>  
        <further-classification edition="202601120260327B">H10W40/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司 英國劍橋郡 CB1 9NJ 綺麗亨頓市富爾本路110號</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德拉克魯茲　哈維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELACRUZ, JAVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼爾森　卡麥隆科爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NELSON, CAMERON COLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路總成包含：一基材；及一積體電路晶粒，其實體地且電性地附接至該基材。一加勁件經附接至該基材，該加勁件包含一平面部分及一突起部分，該平面部分待附接至該基材且待定位成大約平行於該基材的一平面表面，該突起部分待延伸遠離該加勁件的該平面部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit assembly comprises a substrate, and an integrated circuit die physically and electrically attached to the substrate. A stiffener is attached to the substrate, the stiffener comprising a planar portion and a protruding portion, the planar portion to be attached to the substrate and to be positioned approximately parallel to a planar surface of the substrate, the protruding portion to extend away from the planar portion of the stiffener.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:積體電路晶粒</p>  
        <p type="p">104:基材</p>  
        <p type="p">106:焊球；覆晶球柵陣列；球柵陣列</p>  
        <p type="p">110:電容器及/或其他電組件</p>  
        <p type="p">112:加勁件；基材</p>  
        <p type="p">114:黏著劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2782" publication-number="202628941"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628941.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理方法、資訊處理裝置及電腦程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P74/00</main-classification>  
        <further-classification edition="200601120260302B">G05B23/02</further-classification>  
        <further-classification edition="200601120260302B">H01J37/32</further-classification>  
        <further-classification edition="200601120260302B">G06F17/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河村浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋知宙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, CHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種資訊處理方法、資訊處理裝置及電腦程式。 &lt;br/&gt;關於變更電漿處理製程條件中之1個或複數個設定值所獲得之複數個條件之各者，獲取於執行電漿處理時由特定之感測器測量之時間序列資料；關於複數個條件之各者，計算電漿處理製程條件之特定之步驟區間中之時間序列資料之平均值；導出設定值與所算出之平均值之相關關係；關於複數個條件之各者，將所算出之上述平均值與根據相關關係預測之預測值進行比較；及基於平均值與預測值之比較結果，來判斷電漿處理製程條件之穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2783" publication-number="202627977"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627977.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分叉、合併和著色器的平行執行</chinese-title>  
        <english-title>FORK, JOIN AND SHADER EXECUTION IN PARALLEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06T1/20</main-classification>  
        <further-classification edition="201801120260102B">G06F9/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅成平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, CHENGPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹友銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, YOU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　伯展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BOZHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白　鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋立彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, LITONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茅　健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於圖形處理單元的平行執行方法包括提供複數個執行緒，啟用第一程序計數器，且第一程序計數器在複數個執行緒上運行第一程序。當接收到分叉指令時，啟用第二程序計數器，且如果分叉指令的第一活動遮罩被設置為通過遮罩，第二活動遮罩被設置為失敗遮罩，第一程序計數器活化對應於通過遮罩的第一組執行緒。當第一組執行緒被阻擋時，第二程序計數器活化對應於失敗遮罩的第二組執行緒。當第二組執行緒被阻擋時，第一程序計數器活化第一組執行緒。當接收到合併指令時，禁用第二程序計數器，且第一程序計數器活化複數個執行緒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An execution in parallel method for a graphic processing unit includes providing a plurality of threads, enabling a first program counter, and the first program counter running a first program on the plurality of threads. When receiving a fork instruction, enable a second program counter, and if a first active mask of the fork instruction is set as a pass mask, and a second active mask is set as a fail mask, the first program counter activates a first set of threads corresponding to the pass mask. When the first set of threads is blocked, the second program counter activates a second set of threads corresponding to the fail mask. When the second set of threads is blocked, the first program counter activates the first set of threads. When receiving a join instruction, disable the second program counter, and the first program counter activates the plurality of threads.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400,450:執行緒</p>  
        <p type="p">410,440:第一組執行緒</p>  
        <p type="p">420,430:第二組執行緒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2784" publication-number="202627312"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627312.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風扇單元</chinese-title>  
        <english-title>FAN UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">F04D29/38</main-classification>  
        <further-classification edition="200601120260325B">F04D29/34</further-classification>  
        <further-classification edition="200601120260325B">F04D29/32</further-classification>  
        <further-classification edition="200601120260325B">F04D29/44</further-classification>  
        <further-classification edition="200601120260325B">F04D25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商山洋電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYO DENKI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮原義則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYABARA, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原勝充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, KATSUMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">風扇單元，具有：杯狀的旋轉罩；以及葉片構件，杯狀的輪轂部、設在前述輪轂部之外周面的葉片部，前述旋轉罩的外周面與前述輪轂部的內周面被接著劑給接著，在前述輪轂部的底部設有環狀的分隔壁，前述分隔壁，將前述輪轂部的底部與前述旋轉罩的底部之間的空間分隔成內周區域與外周區域，在前述外周區域設有接著劑囤積部，在前述內周區域，形成有使前述旋轉罩之內部的空間與前述輪轂部之外部的空間連通的連通流路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fan unit includes: a cup-shaped rotor cover; and a blade member having a cup-shaped boss portion and a blade portion provided to an outer peripheral surface of the boss portion, an outer peripheral surface of the rotor cover and an inner peripheral surface of the boss portion are bonded with an adhesive, a bottom portion of the boss portion is provided with a ring-shaped partition wall, the partition wall separates a space between the bottom portion of the boss portion and a bottom portion of the rotor cover into an inner peripheral area and an outer peripheral area, the outer peripheral area is provided with an adhesive reservoir, and the inner peripheral area is formed with a connecting flow path that connects a space inside the rotor cover and a space outside the boss portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">402:輪轂側面部</p>  
        <p type="p">402a:內周面</p>  
        <p type="p">403:分隔壁</p>  
        <p type="p">403A:第一壁部</p>  
        <p type="p">403B:第二壁部</p>  
        <p type="p">404:貫通孔</p>  
        <p type="p">405:補強肋</p>  
        <p type="p">500:板狀構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2785" publication-number="202626192"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626192.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體流路裝置及流體流路裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B01J19/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神鋼環境舒立淨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBELCO ECO-SOLUTIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市橋伸理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIHASHI, NOBUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諸山哲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROYAMA, TEPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提高折返流路中之被處理流體之流通性之流體流路裝置。本發明之流體流路裝置(10)包含：本體部(20)，其積層複數個基板而成；一對蓋部(30)，其等覆蓋本體部(20)之一對端面；及流體流路(40)，其跨及本體部(20)與一對蓋部(30)。流體流路(40)具有：第1流路(41)，其形成於一對第1基板(213)之間；第2流路(42)，其形成於一對第1基板(213)之間、或在積層方向上配置於與一對第1基板(213)不同之位置之一對第2基板(214)之間；及折返流路(43)，其以將自彼此相鄰之第1流路(41)及第2流路(42)中之一流路流出之被處理流體向另一流路折返之方式連接兩流路(41、42)彼此。折返流路(43)由形成於各蓋部(30)之內部之內部流路、或凹狀形成於該各蓋部(30)之與本體部(20)之對向面之凹狀流路構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:流體流路裝置</p>  
        <p type="p">11:第1供給埠口</p>  
        <p type="p">12:第2供給埠口</p>  
        <p type="p">13:被處理流體排出埠口</p>  
        <p type="p">14:調溫流體供給埠口</p>  
        <p type="p">15:調溫流體排出埠口</p>  
        <p type="p">16:螺栓</p>  
        <p type="p">17:第1導入流路</p>  
        <p type="p">18:第2導入流路</p>  
        <p type="p">19:導出流路</p>  
        <p type="p">20:本體部</p>  
        <p type="p">20a:左端面</p>  
        <p type="p">20b:右端面</p>  
        <p type="p">20c:上端面</p>  
        <p type="p">22:上側覆蓋基板(基板)</p>  
        <p type="p">30:凸緣部(蓋部)</p>  
        <p type="p">30a:對向面</p>  
        <p type="p">30b:螺栓插通孔</p>  
        <p type="p">31:右側凸緣部(蓋部)</p>  
        <p type="p">32:左側凸緣部(蓋部)</p>  
        <p type="p">40:反應流路(流體流路)</p>  
        <p type="p">41:第1流路</p>  
        <p type="p">42:第2流路</p>  
        <p type="p">43:折返流路</p>  
        <p type="p">50:密封墊(片狀之密封構件)</p>  
        <p type="p">51:右側密封墊(片狀之密封構件)</p>  
        <p type="p">60:密封墊保持板(保持板)</p>  
        <p type="p">II:方向箭頭</p>  
        <p type="p">III-III,V-V,VI-VI,X-X,XII-XII,XIII-XIII:線</p>  
        <p type="p">IX:部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2786" publication-number="202627003"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627003.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光液</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SLURRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C09G1/18</main-classification>  
        <further-classification edition="200601120260302B">C09G1/04</further-classification>  
        <further-classification edition="200601120260302B">C08K5/053</further-classification>  
        <further-classification edition="200601120260302B">C08K3/28</further-classification>  
        <further-classification edition="202001120260302B">C01F17/235</further-classification>  
        <further-classification edition="202201120260302B">B22F1/07</further-classification>  
        <further-classification edition="200601120260302B">C07C211/62</further-classification>  
        <further-classification edition="202601120260302B">H10P50/00</further-classification>  
        <further-classification edition="200601120260302B">C10M133/46</further-classification>  
        <further-classification edition="200601120260302B">C09K3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王興平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙占怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, ZHANYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　守田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHOUTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明採用奈米氧化鈰作為磨料，其動態光散射粒徑為1-30nm，有利於減少化學機械過程中導致的劃痕。藉由選擇合適的添加劑實現氧化矽、氮化矽以及多晶矽去除速率的調控。其中氧化矽去除速率與氮化矽去除速率的選擇比可在2:1~3500:1範圍內調控，氧化矽去除速率與多晶矽去除速率的選擇比可在2:1~3500:1範圍內調控。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention utilizes nano-sized cerium oxide as an abrasive, with a dynamic light scattering particle size ranging from 1 to 30 nm, which is beneficial for reducing scratches caused during chemical mechanical processes. By selecting appropriate additives, the removal rates of silicon oxide, silicon nitride, and polysilicon can be controlled. The selectivity ratio of silicon oxide removal rate to silicon nitride removal rate can be adjusted within the range of 2:1 to 3500:1, and the selectivity ratio of silicon oxide removal rate to polysilicon removal rate can also be adjusted within the range of 2:1 to 3500:1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2787" publication-number="202626670"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626670.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大環化合物及其製備方法和其藥物組合物和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D513/22</main-classification>  
        <further-classification edition="200601120260401B">C07D519/00</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/504</further-classification>  
        <further-classification edition="200601120260401B">A61K31/553</further-classification>  
        <further-classification edition="200601120260401B">A61K31/541</further-classification>  
        <further-classification edition="200601120260401B">A61K31/5386</further-classification>  
        <further-classification edition="200601120260401B">A61K31/551</further-classification>  
        <further-classification edition="200601120260401B">A61P29/00</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京鞍石生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING AVISTONE BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張培龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PEILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李關宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石和鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, HEPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祥秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIANGQIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭文麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, WENLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種大環化合物及其製備方法、含有該類化合物的藥物組合物以及用於治療癌症、炎症性疾病以及免疫性疾病的用途，其中，大環化合物的結構如式Ia所示： &lt;br/&gt;&lt;img align="absmiddle" height="267px" width="246px" file="ed13063.JPG" alt="ed13063.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;Q、M、G&lt;sub&gt;1&lt;/sub&gt;、G&lt;sub&gt;2&lt;/sub&gt;、L&lt;sub&gt;1&lt;/sub&gt;、L&lt;sub&gt;2&lt;/sub&gt;、L&lt;sub&gt;3&lt;/sub&gt;、L&lt;sub&gt;4&lt;/sub&gt;、A&lt;sub&gt;1&lt;/sub&gt;、A&lt;sub&gt;2&lt;/sub&gt;、A&lt;sub&gt;4&lt;/sub&gt;、A&lt;sub&gt;5&lt;/sub&gt;、A&lt;sub&gt;6&lt;/sub&gt;、R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、t、n的定義如說明書所述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2788" publication-number="202627311"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627311.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擴散器及離心泵</chinese-title>  
        <english-title>DIFFUSER AND CENTRIFUGAL PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F04D29/22</main-classification>  
        <further-classification edition="200601120251231B">F04D29/24</further-classification>  
        <further-classification edition="200601120251231B">F04D29/30</further-classification>  
        <further-classification edition="200601120251231B">F04D29/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日機裝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKKISO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>學校法人常翔學園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSHO GAKUEN EDUCATIONAL FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EJIRI, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮部正洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYABE, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋樹央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, MIKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明抑制離心泵的效率降低，並抑制發生旋轉失速。 &lt;br/&gt;本發明之擴散器7係在離心泵1之旋轉軸4的軸向上，以與葉輪6相鄰的方式配置的擴散器。擴散器具有流路形成部84及劃分出多個擴散器流路的多個葉片9。葉片分別具備正壓面91a～98a、負壓面91b～98b及前端部91c～98c、95 d～98d。葉片具備多個長葉片91～94及短於長葉片的至少1個短葉片95～98。長葉片具備以相鄰於與長葉片對應之短葉片的正壓面側的方式配置的至少1個特定長葉片。在軸向上，短葉片的前端部配置於比長葉片的前端部更靠後方向的位置。特定長葉片具備在特定長葉片的正壓面與負壓面開口的連通流路91d～94d。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To suppress the occurrence of rotating stall while reducing degradation in the efficiency of a centrifugal pump. &lt;br/&gt;A diffuser 7 according to the present invention is a diffuser disposed adjacent to an impeller 6 in the axial direction of a rotary shaft 4 of a centrifugal pump 1. The diffuser includes a flow passage forming portion 84 and a plurality of vanes 9 that define a plurality of diffuser flow passages. Each vane includes a positive pressure surface (91a to 98a), a negative pressure surface (91b to 98b), and a front end portion (91c to 98c and 95d to 98d). The vanes include a plurality of long vanes 91 to 94 and at least one short vane 95 to 98 that is shorter than the long vanes. The long vanes include at least one specific long vane that is disposed, on the positive-pressure-surface side of a short vane corresponding to one of the long vanes, adjacent to the short vane. In the axial direction, the front end portion of a short vane is disposed rearward of the front end portion of the corresponding long vane. Each specific long vane includes a communication flow passage (91d to 94d) that opens to the positive pressure surface and the negative pressure surface of the specific long vane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:擴散器</p>  
        <p type="p">8:本體部</p>  
        <p type="p">81:底部</p>  
        <p type="p">82:插通孔</p>  
        <p type="p">84:圓筒部(流路形成部)</p>  
        <p type="p">84a:外周面</p>  
        <p type="p">9:葉片</p>  
        <p type="p">91~94:長葉片</p>  
        <p type="p">91a:正壓面</p>  
        <p type="p">91b:負壓面</p>  
        <p type="p">91c:端面(前端部)</p>  
        <p type="p">91d:連通流路</p>  
        <p type="p">91e:第1部</p>  
        <p type="p">91f:第2部</p>  
        <p type="p">95~98:短葉片</p>  
        <p type="p">95a,98a:正壓面</p>  
        <p type="p">95b,98b:負壓面</p>  
        <p type="p">95c,98c:端面(前端部)</p>  
        <p type="p">95d,98d:下表面(前端部)</p>  
        <p type="p">Ch:擴散器流路</p>  
        <p type="p">Ch1~Ch4,Ch8:擴散器流路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2789" publication-number="202626825"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626825.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應性熱熔樹脂組成物、以及使用所述樹脂組成物的硬化物、密封材、絕緣材料及積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260310B">C08G18/06</main-classification>  
        <further-classification edition="200601120260310B">C08G18/10</further-classification>  
        <further-classification edition="200601120260310B">C08L75/12</further-classification>  
        <further-classification edition="200601120260310B">C08L33/10</further-classification>  
        <further-classification edition="200601120260310B">C08K5/053</further-classification>  
        <further-classification edition="200601120260310B">C08F293/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木和人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KAZUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松崎邦彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSUZAKI, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠形成柔軟性、絕緣性、耐濕性、耐濕熱性優異的硬化皮膜的反應性熱熔樹脂組成物、以及使用所述樹脂組成物的硬化物、密封材、絕緣材料及積層體。一種反應性熱熔樹脂組成物，至少含有胺基甲酸酯(甲基)丙烯酸酯，所述胺基甲酸酯(甲基)丙烯酸酯為以多元醇（A）、聚異氰酸酯（B）及含活性氫基的(甲基)丙烯酸酯（C）為必需原料的反應產物，所述多元醇（A）包含：脂環式聚酯多元醇（A1），具有源自脂環式多羧酸或其酸酐的結構單元及源自直鏈多元醇的結構單元；以及脂環式聚酯多元醇（A2），具有源自脂環式多羧酸或其酸酐的結構單元及源自側鏈多元醇的結構單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2790" publication-number="202628060"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628060.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251217B">G09G3/3233</main-classification>  
        <further-classification edition="202301120251217B">H10K59/121</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪Ｙ·</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, YEIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所述的顯示裝置包括：基板，該基板包括顯示區域和圍繞顯示區域的非顯示區域；設置於顯示區域中的多個像素，該多個像素包括發光元件和驅動電晶體；設置於非顯示區域中的至少一個壩；覆蓋多個像素的有機光學層；以及設置於非顯示區域中並貫穿有機光學層的至少一個阻擋圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device presented herein includes a substrate including a display area and a non-display area surrounding the display area, a plurality of pixels disposed in the display area and including a light emitting element and a driving transistor, at least one dam disposed in the non-display area, an organic optical layer covering the plurality of pixels, and at least one blocking pattern disposed in the non-display area and penetrating the organic optical layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A/A:顯示區域</p>  
        <p type="p">N/A:非顯示區域</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:緩衝層</p>  
        <p type="p">112:閘極絕緣層</p>  
        <p type="p">113:層間絕緣層</p>  
        <p type="p">114:第一平坦化層</p>  
        <p type="p">115:第二平坦化層</p>  
        <p type="p">116:堤</p>  
        <p type="p">120:第一驅動電晶體</p>  
        <p type="p">121:主動層</p>  
        <p type="p">122:源極電極</p>  
        <p type="p">123:汲極電極</p>  
        <p type="p">124:閘極電極</p>  
        <p type="p">130:發光元件</p>  
        <p type="p">131:第一電極</p>  
        <p type="p">132:發光電極</p>  
        <p type="p">133:第二電極</p>  
        <p type="p">141:有機光學層</p>  
        <p type="p">142:封裝層</p>  
        <p type="p">143:觸控緩衝層</p>  
        <p type="p">144:間隔件</p>  
        <p type="p">145:觸控絕緣層</p>  
        <p type="p">150:觸控感測單元</p>  
        <p type="p">151:第一觸控電極</p>  
        <p type="p">152:第二觸控電極</p>  
        <p type="p">153:觸控連接電極</p>  
        <p type="p">160:覆蓋層</p>  
        <p type="p">170:填充層</p>  
        <p type="p">190:中間電極</p>  
        <p type="p">DL1:第一線</p>  
        <p type="p">DL2:第二線</p>  
        <p type="p">DL3:第三線</p>  
        <p type="p">CP1:第一阻擋圖案</p>  
        <p type="p">CP2:第二阻擋圖案</p>  
        <p type="p">DAM1:第一壩</p>  
        <p type="p">DAM2:第二壩</p>  
        <p type="p">DAM3:第三壩</p>  
        <p type="p">116a:第一層</p>  
        <p type="p">144a:第二層</p>  
        <p type="p">115b:第一層</p>  
        <p type="p">116b:第二層</p>  
        <p type="p">144b:第三層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2791" publication-number="202628470"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628470.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法及裝置</chinese-title>  
        <english-title>COMMUNICATION METHOD AND APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260305B">H04W76/15</main-classification>  
        <further-classification edition="201801120260305B">H04W76/11</further-classification>  
        <further-classification edition="200901120260305B">H04W36/00</further-classification>  
        <further-classification edition="202201120260305B">H04L45/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUOGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種通信方法及裝置，涉及通信技術領域，能夠使得關聯AP MLD和第二AP MLD基於全域序列號進行DAPS傳輸，並允許關聯AP MLD和第二AP MLD各自進行A-MSDU的聚合和解聚合操作，減少DAPS傳輸實現的複雜度並提高通信性能。該方法包括：關聯AP MLD獲取第一信息，根據第一信息，向non-AP MLD進行DAPS傳輸所對應的第二AP MLD發送第二信息，關聯AP MLD根據第二信息，基於DAPS傳輸向non-AP MLD發送根據第一MSDU構成的PPDU，第一MSDU為包括全域序列號的MSDU。其中，第一信息包括non-AP MLD的MSDU、以及MSDU的TID；第二信息包括MSDU、TID、以及關聯AP MLD為該TID的MSDU所分配的全域序列號，關聯AP MLD為分散式系統映射對應的第一AP MLD；第一AP MLD和第二AP MLD基於全域序列號進行DAPS傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication method and apparatus are disclosed, relating to the field of communication technologies, which enable an associated AP MLD and a second AP MLD to perform DAPS transmission based on a global sequence number, and allow the associated AP MLD and the second AP MLD to perform A-MSDU aggregation and disassembly operations respectively, thereby reducing the complexity of implementing DAPS transmission and improving communication performance. The method includes: obtaining, by an associated AP MLD, first information; sending, to a second AP MLD corresponding to the non-AP MLD for DAPS transmission, second information according to the first information; and sending, by the associated AP MLD, a PPDU formed based on a first MSDU to the non-AP MLD based on the DAPS transmission according to the second information, where the first MSDU is an MSDU including a global sequence number. The first information includes an MSDU of the non-AP MLD and a TID of the MSDU; the second information includes an MSDU, a TID, and a global sequence number allocated by the associated AP MLD to the MSDU corresponding to the TID, where the associated AP MLD is a first AP MLD corresponding to the distributed system mapping; and the first AP MLD and the second AP MLD perform DAPS transmission based on the global sequence number.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">701、702、703、704、705:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2792" publication-number="202626861"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626861.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂、樹脂組成物、樹脂組成物的硬化物、樹脂的製造方法、基板、半導體裝置、通訊設備、顯示裝置、二次電池及電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G69/48</main-classification>  
        <further-classification edition="200601120260401B">C08G73/10</further-classification>  
        <further-classification edition="200601120260401B">C08G73/12</further-classification>  
        <further-classification edition="200601120260401B">C08G73/14</further-classification>  
        <further-classification edition="200601120260401B">C08L77/06</further-classification>  
        <further-classification edition="200601120260401B">C08L79/08</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1333</further-classification>  
        <further-classification edition="200601120260401B">G06F3/041</further-classification>  
        <further-classification edition="202501120260401B">H10F77/30</further-classification>  
        <further-classification edition="201301120260401B">H01G11/38</further-classification>  
        <further-classification edition="200601120260401B">H01M4/62</further-classification>  
        <further-classification edition="200601120260401B">H05K1/03</further-classification>  
        <further-classification edition="202601120260401B">H10W70/695</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山岡洸平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAOKA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弓場智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUBA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由於聚合物主鏈的結構單元中具有醯胺鍵、且所述醯胺鍵的一部分或全部由酸解離性基保護的樹脂，而提供一種能夠形成多層積層樹脂膜、亦應對加工製程的低溫化的樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">10:包含多層配線結構的基板(基板)</p>  
        <p type="p">10A:包含多層配線結構的基板的半導體元件側的面</p>  
        <p type="p">10B:包含多層配線結構的基板的支撐基板側的面</p>  
        <p type="p">30:模製樹脂</p>  
        <p type="p">301:模製樹脂的與包含多層配線結構的基板10側為相反側的面</p>  
        <p type="p">302:模製樹脂的包含多層配線結構的基板10側的面</p>  
        <p type="p">C1、C2:半導體元件</p>  
        <p type="p">C11:半導體元件的無凸塊M7的一側的面</p>  
        <p type="p">C12:半導體元件的存在凸塊M7的一側的面</p>  
        <p type="p">C13:半導體元件的側面</p>  
        <p type="p">L1~L4:層間絕緣膜</p>  
        <p type="p">L5:再外層的膜(層間絕緣膜)</p>  
        <p type="p">M1~M5:導電性配線層</p>  
        <p type="p">MM1~MM4:貫通配線</p>  
        <p type="p">M6:電極焊墊</p>  
        <p type="p">M7:凸塊</p>  
        <p type="p">X:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2793" publication-number="202626008"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626008.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149061</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>髮油組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K8/31</main-classification>  
        <further-classification edition="200601120260401B">A61K8/37</further-classification>  
        <further-classification edition="200601120260401B">A61K8/89</further-classification>  
        <further-classification edition="200601120260401B">A61K8/92</further-classification>  
        <further-classification edition="200601120260401B">A61Q5/00</further-classification>  
        <further-classification edition="200601120260401B">A61Q5/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOF CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂爪佑真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATSUME, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森川稔之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIKAWA, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種髮油組合物，其含有：0.5質量%以上20質量%以下的(A)平均碳原子數為50以上250以下的異構烷烴、10質量%以上50質量%以下的(B)平均碳原子數為20以上24以下的異構烷烴、20質量%以上60質量%以下的(C)25℃下的運動黏度為20mm&lt;sup&gt;2&lt;/sup&gt;/s以下的揮發性油劑、5質量%以上40質量%以下的(D)25℃下為液狀的酯油，其中，成分(A)相對於成分(B)的質量比((A)/(B))為1/20以上3/2以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2794" publication-number="202627024"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627024.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物、黏接劑、硬化物及物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260209B">C09J175/14</main-classification>  
        <further-classification edition="201801120260209B">C09J7/32</further-classification>  
        <further-classification edition="200601120260209B">C08G18/09</further-classification>  
        <further-classification edition="200601120260209B">C08L75/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松崎邦彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSUZAKI, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田拓矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種防濕性能、柔軟性、低溫密接性優異的濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物等。一種濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物，含有作為多元醇（A）及聚異氰酸酯（B）的反應產物的具有異氰酸酯基的胺基甲酸酯預聚物（i），所述濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物中，所述多元醇（A）包含具有直鏈型脂肪族二醇來源的結構單元、及脂環式多元酸來源的結構單元的聚酯多元醇（a1）、以及具有分支型脂肪族二醇來源的結構單元、及脂環式多元酸來源的結構單元的聚酯多元醇（a2）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2795" publication-number="202627162"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627162.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149122</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經由雷射吸收物種感測器的回饋的電漿源閉環控制</chinese-title>  
        <english-title>CLOSED-LOOP CONTROL OF PLASMA SOURCE VIA FEEDBACK FROM LASER ABSORPTION SPECIES SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C23C16/34</main-classification>  
        <further-classification edition="200601120260325B">C23C16/44</further-classification>  
        <further-classification edition="200601120260325B">C23C16/452</further-classification>  
        <further-classification edition="200601120260325B">C23C16/455</further-classification>  
        <further-classification edition="200601120260325B">C23C16/52</further-classification>  
        <further-classification edition="200601120260325B">H01J37/32</further-classification>  
        <further-classification edition="202601120260325B">H10P72/00</further-classification>  
        <further-classification edition="201401120260325B">G01N21/3504</further-classification>  
        <further-classification edition="200601120260325B">G01N21/39</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扎法爾　阿布杜拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAFAR, ABDULLAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　勁文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KELVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勞司　菲利浦亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRAUS, PHILIP ALLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所揭示之實施例包括一種半導體處理工具。在一實施例中，半導體處理工具包括腔室，在腔室內經配置用於固定基板的基座，以及位於基座上方的電漿源。在一實施例中，雷射源耦合至腔室，並且偵測器於雷射源對側耦合至腔室。在一實施例中，偵測器經配置為與雷射源光學耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, a pedestal in the chamber configured to secure a substrate, and a plasma source above the pedestal. In an embodiment, a laser source is coupled to the chamber, and a detector is coupled to the chamber across from the laser source. In an embodiment, the detector is configured to be optically coupled to the laser source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">660:製程</p>  
        <p type="p">661:操作</p>  
        <p type="p">662:操作</p>  
        <p type="p">663:操作</p>  
        <p type="p">664:操作</p>  
        <p type="p">665:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2796" publication-number="202627061"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627061.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光後的清洗液</chinese-title>  
        <english-title>POST CHEMICAL-MECHANICAL POLISHING CLEANING SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C11D7/24</main-classification>  
        <further-classification edition="200601120260401B">C11D7/26</further-classification>  
        <further-classification edition="200601120260401B">C11D7/28</further-classification>  
        <further-classification edition="200601120260401B">C11D7/22</further-classification>  
        <further-classification edition="202601120260401B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜建波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, JIANBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林海峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧欽源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, QINYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉資源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZIYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種以水為基礎的清洗液，該清洗液包括：一種不易溶於水的有機溶劑，一種溶於水的助溶劑，pH調節劑和水。不易溶於水的有機溶劑為芳香烴類、鹵化烴類、酯類。這種富含溶解能力極強的有機溶劑的清洗液，能夠迅速且高效地去除拋光後的有機殘留物和聚合物，同時展現出優異的穩定性。得益於其獨特的配方和高效的清洗能力，本發明的清洗液在半導體晶片清洗等領域展現出了廣闊的應用前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses an aqueous-based cleaning solution comprising: an organic solvent that is poorly soluble in water, a water-soluble co-solvent, a pH adjusting agent, and water. The organic solvent that is poorly soluble in water includes aromatic hydrocarbons, halogenated hydrocarbons, and esters. This cleaning solution, which is rich in organic solvents with extremely strong dissolving power, can quickly and efficiently remove organic residues and polymers left after polishing while demonstrating excellent stability. Thanks to its unique formulation and high cleaning efficiency, the cleaning solution of the invention shows broad application prospects in fields such as semiconductor wafer cleaning.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2797" publication-number="202627000"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627000.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鈰磨料顆粒製備方法</chinese-title>  
        <english-title>PREPARATION METHOD FOR CERIUM OXIDE ABRASIVE PARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260204B">C09G1/02</main-classification>  
        <further-classification edition="200601120260204B">C09K3/14</further-classification>  
        <further-classification edition="202001120260204B">C01F17/235</further-classification>  
        <further-classification edition="202001120260204B">C01F17/247</further-classification>  
        <further-classification edition="200601120260204B">C22B5/08</further-classification>  
        <further-classification edition="200601120260204B">C09F5/06</further-classification>  
        <further-classification edition="200601120260204B">C09C1/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹先升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, XIANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李節</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氧化鈰磨料顆粒製備方法，包括：製備碳酸鈰分散液；將所述碳酸鈰分散液保持攪拌，向分散液中緩慢加入脂肪酸，分散均勻，去除水分；除水之後，去除所述碳酸鈰分散液中的多餘油份；將去除油份後的碳酸鈰分散液，進行焙燒，得到氧化鈰磨料顆粒。引入脂肪酸，對氧化鈰磨料顆粒前驅體進行表面有機改性包覆，在高溫焙燒合成磨料氧化鈰過程中，可有效降低顆粒間團聚，實現顆粒均一、易分散，可顯著減少拋光劃傷缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a preparation method for cerium oxide abrasive particles, comprising the following steps: preparing a cerium carbonate dispersion; maintaining stirring of the cerium carbonate dispersion, slowly adding a fatty acid to the dispersion, and uniformly dispersing it, followed by removing moisture; after dehydration, removing the excess oil from the cerium carbonate dispersion; and subjecting the oil-removed cerium carbonate dispersion to calcination to obtain cerium oxide abrasive particles. The introduction of fatty acid enables surface organic modification and coating of the cerium oxide abrasive precursor. During the high-temperature calcination process for synthesizing the abrasive cerium oxide, it can effectively reduce interparticle agglomeration, achieve uniform and easily dispersible particles, and significantly reduce polishing scratch defects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2798" publication-number="202626829"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626829.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物、塗層劑、黏接劑、硬化物、以及物品及物品的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C08G18/32</main-classification>  
        <further-classification edition="200601120260317B">C08G18/72</further-classification>  
        <further-classification edition="200601120260317B">C08L75/04</further-classification>  
        <further-classification edition="200601120260317B">C09J175/04</further-classification>  
        <further-classification edition="200601120260317B">C09D175/04</further-classification>  
        <further-classification edition="200601120260317B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松崎邦彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSUZAKI, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田拓矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹東穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種噴霧適性高、能夠形成膜薄且防濕性能高的皮膜的濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物等。一種濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物，含有具有異氰酸酯基的胺基甲酸酯預聚物（i），所述濕氣硬化型聚胺基甲酸酯熱熔樹脂組成物中，所述胺基甲酸酯預聚物（i）為多元醇（A）及聚異氰酸酯（B）的反應產物，所述多元醇（A）至少必須包含脂環式聚酯多元醇（a1）、結晶性聚酯多元醇（a2）、及芳香族聚酯多元醇（a3），所述多元醇（A）中的所述脂環式聚酯多元醇（a1）的含量為50質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2799" publication-number="202628584"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628584.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可編程可抹除的非揮發性記憶胞</chinese-title>  
        <english-title>ERASABLE PROGRAMMABLE NONVOLATILE MEMORY CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260202B">H10B41/30</main-classification>  
        <further-classification edition="202301120260202B">H10B41/40</further-classification>  
        <further-classification edition="200601120260202B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力旺電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMEMORY TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫文堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEIN-TOWN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭婉勻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, WOAN-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏孝丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SIAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉明源</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可編程可抹除的非揮發性記憶胞，包括：一井區、一第一閘極結構、一第二閘極結構、一第一合併摻雜區、一第二合併摻雜區與一輕摻雜汲極區。第一合併摻雜區位於第一閘極結構的一第一側。輕摻雜汲極區位於第一閘極結構的一第二側與第二閘極結構的一第一側之間。第二合併摻雜區位於第二閘極結構的一第二側。第一合併摻雜區、第一閘極結構與輕摻雜汲極區形成一選擇電晶體。輕摻雜汲極區、第二閘極結構與第二合併摻雜區形成一浮動閘電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An erasable programmable non-volatile memory cell includes a well region, a first gate structure, a second gate structure, a first merged doped region, a second merged doped region and a lightly doped drain region. The first merged doped region is located beside a first side of the first gate structure. The lightly doped drain region is located beside a second side of the first gate structure and a first side of the second gate structure. The second merged doped region is located beside a second side of the second gate structure. The first merged doped region, the first gate structure and the lightly doped drain region are collaboratively formed as a select transistor. The lightly doped drain region, the second gate structure and the second merged doped region are collaboratively formed as a floating gate transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">502:隔離結構</p>  
        <p type="p">513,515:多晶矽閘極層</p>  
        <p type="p">551,552:n型輕摻雜汲極區</p>  
        <p type="p">548,558:間隙壁</p>  
        <p type="p">571,572:合併n型摻雜區</p>  
        <p type="p">580:金屬層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2800" publication-number="202627987"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627987.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光學裝置的光學解析度量測方法</chinese-title>  
        <english-title>OPTICAL RESOLUTION MEASUREMENT METHOD FOR OPTICAL DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260319B">G06T7/262</main-classification>  
        <further-classification edition="200601120260319B">G06T1/00</further-classification>  
        <further-classification edition="200601120260319B">G01M11/02</further-classification>  
        <further-classification edition="200601120260319B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅晉欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, JINXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫陽陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高德　路迪維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GODET, LUDOVIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中的實施例提供一種決定光學裝置調制轉換函數（MTF）的方法。本文中所述方法包括從一光引擎投射一圖案的一基線影像至一偵測器。該基線影像被分析以決定基線函數。該基線函數的基線快速傅立葉轉換（FFT）或基線MTF被取得。該方法進一步包括從該光引擎投射該圖案的影像至一或更多光學裝置。該圖案從該一或更多光學裝置經出耦合至該偵測器。該影像被分析以決定一函數。對應於該影像取得函數FFT或函數MTF。藉由將該基線FFT與分析該影像所決定的該函數FFT做比較、或是藉由將該基線MTF與分析該影像所決定的該函數MTF做比較，來決定該一或更多光學裝置的光學裝置MTF。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments herein provide for a method of determining an optical device modulation transfer function (MTF). The method described herein includes projecting a baseline image of a pattern from a light engine to a detector. The baseline image is analyzed to determine a baseline function. A baseline fast Fourier transform (FFT) or a baseline MTF of the baseline function is obtained. The method further includes projecting an image of the pattern from the light engine to one or more optical devices. The pattern is outcoupled from the one or more optical devices to the detector. The image is analyzed to determine a function. A function FFT or a function MTF is obtained corresponding to the image. An optical device MTF of the one or more optical devices is determined by comparing the baseline FFT and the function FFT determined by analyzing the image or by comparing the baseline MTF and the function MTF determined by analyzing the image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學裝置</p>  
        <p type="p">200:量測系統</p>  
        <p type="p">201:主體</p>  
        <p type="p">203:第一開口</p>  
        <p type="p">204:上部</p>  
        <p type="p">205:第二開口</p>  
        <p type="p">206:下部</p>  
        <p type="p">207:載物台</p>  
        <p type="p">208:對準攝影機</p>  
        <p type="p">209:托架</p>  
        <p type="p">210:光引擎</p>  
        <p type="p">212:反射偵測器</p>  
        <p type="p">214:讀碼器</p>  
        <p type="p">216:透射偵測器</p>  
        <p type="p">220:控制器</p>  
        <p type="p">252:處理器</p>  
        <p type="p">254:記憶體</p>  
        <p type="p">256:支援電路</p>  
        <p type="p">258:電線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2801" publication-number="202628224"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628224.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池包</chinese-title>  
        <english-title>BATTERY PACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260209B">H01M10/63</main-classification>  
        <further-classification edition="201401120260209B">H01M10/60</further-classification>  
        <further-classification edition="202101120260209B">H01M50/204</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行競科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XING MOBILITY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宇中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂凱翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, KAI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汲毓舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, YU-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖資文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TZU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴尚智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, SHANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊錦堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIN-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宜容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, I-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池包包含充放電電路、電池包外殼、高壓介面連接器、高壓切換電路及電池管理電路，其中充放電電路具有至少一電池單元組合。電池包外殼由垂直堆疊之至少一管狀殼體及分別覆蓋相對端之二蓋模組所形成，以形成絕緣屏障，絕緣屏障將電池單元組合與外部隔離。管狀殼體可為限液殼體，配置以容納熱管理液體進行浸沒式冷卻。電池包可利用殼體內之垂直壁通道以容納訊號線或導電棒，藉此實現分散式電氣介面配置或單端端子配置。結構有助於模組化組裝、高效熱管理及整合式電氣控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery pack includes a charging-discharging circuit with at least one battery cell assembly, a battery-pack enclosure, high-voltage interface connectors, a high-voltage switching circuit, and a battery management circuit. The enclosure is formed by vertically stacking at least one tubing-shaped casing and covering opposite ends with two lid modules to form an insulated barrier isolating the battery cell assembly from an exterior. The tubing-shaped casing may be a liquid-limiting casing configured to hold thermal-management liquid for immersion cooling. The battery pack may utilize vertical wall channels within the casing to accommodate signal lines or conductor rods, thereby enabling either a distributed electrical interface configuration or a single-ended terminal configuration. The structure facilitates modular assembly, efficient thermal management, and integrated electrical control.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">0230:垂直壁通道</p>  
        <p type="p">300:電池管理電路</p>  
        <p type="p">302:泵浦</p>  
        <p type="p">305:電池監控電路</p>  
        <p type="p">306:高壓互鎖迴路</p>  
        <p type="p">307:正極接觸器</p>  
        <p type="p">309:預充接觸器</p>  
        <p type="p">310:預充電阻</p>  
        <p type="p">311:電流分流器</p>  
        <p type="p">312:負極接觸器</p>  
        <p type="p">3001:第一電路模組</p>  
        <p type="p">3002:第二電路模組</p>  
        <p type="p">3020:模組化電能介面</p>  
        <p type="p">3050:介面模組</p>  
        <p type="p">3053:介面模組電連接排</p>  
        <p type="p">3060(a):第一電能介面模組</p>  
        <p type="p">3060(b):第二電能介面模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2802" publication-number="202626634"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626634.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胺化合物以及使用了該化合物之有機電致發光元件、電子元件及電子設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D413/14</main-classification>  
        <further-classification edition="200601120260401B">C07D417/14</further-classification>  
        <further-classification edition="202301120260401B">H10K50/11</further-classification>  
        <further-classification edition="202301120260401B">H10K50/18</further-classification>  
        <further-classification edition="202301120260401B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商保土谷化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HODOGAYA CHEMICAL CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富樫和法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOGASHI, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林栽建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JAE-GEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車玹旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, HYUN-WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平井大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>咸宗完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAHM, JONG-WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平山雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAYAMA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加瀬幸喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASE, KOUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">具有通式（a）的苯并唑環結構之胺化合物的薄膜的穩定性和耐久性優異，藉由優化分子設計，能夠提供可見光的折射率和紫外線附近的光的消光係數高的材料。藉由在構成覆蓋層之材料中使用該化合物，可獲得發光效率優異之有機EL元件。R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;4&lt;/sup&gt;表示H、芳基或雜芳基，至少1個表示芳基或雜芳基。L&lt;sup&gt;1&lt;/sup&gt;～L&lt;sup&gt;3&lt;/sup&gt;表示伸苯基等2價基，X&lt;sup&gt;1&lt;/sup&gt;～X&lt;sup&gt;3&lt;/sup&gt;表示O或S，Y&lt;sup&gt;1&lt;/sup&gt;、Y&lt;sup&gt;2&lt;/sup&gt;表示N或次甲基。 &lt;br/&gt;&lt;img align="absmiddle" height="196px" width="232px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:玻璃基板</p>  
        <p type="p">2:透明陽極(陽極)</p>  
        <p type="p">3:電洞注入層</p>  
        <p type="p">4:電洞傳輸層</p>  
        <p type="p">5:發光層</p>  
        <p type="p">6:電子傳輸層</p>  
        <p type="p">7:電子注入層</p>  
        <p type="p">8:陰極</p>  
        <p type="p">9:覆蓋層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2803" publication-number="202626850"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626850.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149251</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯系共聚物、染色不均減輕劑、熔融紡紗用聚酯系樹脂組成物、聚酯系纖維的製造方法、及聚酯系纖維</chinese-title>  
        <english-title>POLYESTER-BASED COPOLYMER, DYEING UNEVENNESS-MITIGATING AGENT, POLYESTER-BASED RESIN COMPOSITION FOR MELT SPINNING, METHOD FOR PRODUCING POLYESTER-BASED FIBER, AND POLYESTER-BASED FIBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08G63/672</main-classification>  
        <further-classification edition="200601120260302B">D01F6/84</further-classification>  
        <further-classification edition="200601120260302B">D01F6/92</further-classification>  
        <further-classification edition="200601120260302B">D01D5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日華化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICCA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>住友宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紙谷洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅村深雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEMURA, MIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢部奈生子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YABE, NAOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米元篤史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEMOTO, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種聚酯系共聚物，其為如下（B）聚酯系共聚物。（B）聚酯系共聚物具有源自（B1）聚伸烷基二醇的構成單元。（B1）聚伸烷基二醇的平均分子量位於400以上4000以下的範圍內。（B）聚酯系共聚物中的源自（B1）聚伸烷基二醇的構成單元的含量位於15質量％以上60質量％以下的範圍內，分子量為600以下的低分子量成分的含量為15質量％以下。（B）聚酯系共聚物可與（A）聚酯混合而用於熔融紡紗用途，使（B）聚酯系共聚物的含量相對於（A）聚酯及（B）聚酯系共聚物的總計100質量份位於0.5質量份以上15質量份以下的範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2804" publication-number="202628981"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628981.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149252</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路</chinese-title>  
        <english-title>INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10W20/42</main-classification>  
        <further-classification edition="202601120260327B">H10W20/43</further-classification>  
        <further-classification edition="202501120260327B">H10D64/20</further-classification>  
        <further-classification edition="202301120260327B">H10B10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴志珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>都楨湖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DO, JUNGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林哉炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JAEHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供包括水平延伸的中段製程（middle-of-line，MOL）結構的積體電路。積體電路包括：第一配線層，包括複數個圖案，各圖案在第一水平方向上延伸；主動接觸件；以及主動通孔，連接主動接觸件和複數個圖案之中的至少兩個圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit including a horizontally-extending middle-of-line (MOL) structure is provided. The integrated circuit includes: a first wiring layer comprising a plurality of patterns each extending in a first horizontal direction; an active contact; and an active via connecting the active contact and at least two patterns among the plurality of patterns.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積體電路</p>  
        <p type="p">M1:第一配線層</p>  
        <p type="p">P13、P14:圖案</p>  
        <p type="p">PR1:第一電源軌</p>  
        <p type="p">PR2:第二電源軌</p>  
        <p type="p">TR1:第一軌跡</p>  
        <p type="p">TR2:第二軌跡</p>  
        <p type="p">TR3:第三軌跡</p>  
        <p type="p">TR4:第四軌跡</p>  
        <p type="p">TR5:第五軌跡</p>  
        <p type="p">VAB:條形主動通孔</p>  
        <p type="p">X、Y、Z:軸</p>  
        <p type="p">Y1-Y1’:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2805" publication-number="202628385"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628385.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>操作數據機晶片的方法及數據機晶片次數</chinese-title>  
        <english-title>METHOD OF OPERATING A MODEM CHIP AND MODEM CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H04L1/1812</main-classification>  
        <further-classification edition="200601120260223B">H03M13/37</further-classification>  
        <further-classification edition="202301120260223B">H04W72/542</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵志珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種操作數據機晶片的方法及數據機晶片。操作數據機晶片的方法可包括測量分配用於接收碼字的多個資源元素的品質，基於品質的測量結果和對應於目標時隙的資源元素至碼塊（resource element-to-code block，RE-CB）映射模式分配每個碼塊的解碼迭代的最大次數，以及基於分配的每個碼塊的解碼迭代的最大次數解碼目標時隙的多個第一碼塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of operating a modem chip and modem chip. The method of operating a modem chip may include measuring quality of a plurality of resource elements allocated to receive a codeword, allocating a maximum number of decoding iterations per code block based on a measurement result of the quality and a resource element-to-code block (RE-CB) mapping pattern corresponding to a target slot, and decoding a plurality of first code blocks of the target slot based on the allocated maximum number of decoding iterations per code block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:基頻處理器</p>  
        <p type="p">112:解碼電路</p>  
        <p type="p">120:收發器</p>  
        <p type="p">130:介面電路</p>  
        <p type="p">140:記憶體</p>  
        <p type="p">150_1、150_2、150_k:天線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2806" publication-number="202628392"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628392.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者設備及其操作方法</chinese-title>  
        <english-title>USER EQUIPMENT AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H04L25/02</main-classification>  
        <further-classification edition="201501120260102B">H04B17/309</further-classification>  
        <further-classification edition="200601120260102B">H04B7/06</further-classification>  
        <further-classification edition="200901120260102B">H04W24/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴正淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JEONGSOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金昊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HOIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高寧佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YOUNGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供使用者設備及其操作方法。使用者設備經配置以與基地台通訊，可包括複數個天線，經配置以從基地台接收參考訊號，至少一個緩衝記憶體，經配置以依序儲存參考訊號，處理電路系統，經配置以從至少一個緩衝記憶體接收參考訊號並基於接收的參考訊號使用通道估計模型估計傳輸符元的通道。至少一個緩衝記憶體的數量可少於參考訊號的數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A user equipment and operation method thereof are provided. The user equipment configured to communicate with a base station, may include a plurality of antennas configured to receive reference signals from the base station, at least one buffer memory configured to store the reference signals sequentially, processing circuitry configured to receive the reference signals from the at least one buffer memory and estimate a channel for a transmission symbol using a channel estimation model, based on the received reference signals. The number of the at least one buffer memory may be less than the number of the reference signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:操作方法</p>  
        <p type="p">S410、S420、S430、S440、S450、S460、S470、S480:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2807" publication-number="202627123"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627123.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅合金材料、電阻體及電阻器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C22C9/05</main-classification>  
        <further-classification edition="200601120260302B">H01C3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神戶製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桂進也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSURA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川遼典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北山巧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAYAMA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種銅合金材料，為電阻用的銅合金材料，包含Mn：10.0質量%以上且14.0質量%以下、Ni：1.0質量%以上且4.0質量%以下、以及Al：0.3質量%以上且小於1.0質量%，且剩餘部分包含Cu及不可避免的雜質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">L/M:長度L(mm)與質量M(g)之比</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2808" publication-number="202629032"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629032.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置、接合裝置的控制方法及電腦可讀取記錄媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W72/50</main-classification>  
        <further-classification edition="202601120260302B">H10P72/76</further-classification>  
        <further-classification edition="200601120260302B">B23K20/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野浩章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋邦行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KUNIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種適當地矯正線尾的彎曲，使形成的自由空氣球精度良好地到達目標位置而進行接合的接合裝置、接合裝置的控制方法及記錄媒體。接合裝置包括：致動器，使供線插通的毛細管沿線的插通方向移動；夾持器，相對於線進行夾持的動作及釋放的動作；氣炬，在線的前端形成自由空氣球；以及控制部，對致動器、夾持器及氣炬進行控制，控制部在利用夾持器夾持線的狀態下，利用氣炬形成自由空氣球，使致動器進行動作，使毛細管接近自由空氣球，在夾持器釋放線的狀態下使致動器進行動作並將毛細管朝向接合對象下拉，將自由空氣球按壓並固接在接合對象。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:氣炬</p>  
        <p type="p">112:毛細管</p>  
        <p type="p">113:換能器</p>  
        <p type="p">131:第一夾持器</p>  
        <p type="p">132:第二夾持器</p>  
        <p type="p">210:切入部</p>  
        <p type="p">220:接受部</p>  
        <p type="p">300:線</p>  
        <p type="p">300a:自由空氣球(FAB)</p>  
        <p type="p">300b:切口</p>  
        <p type="p">310:引腳線</p>  
        <p type="p">320:基板</p>  
        <p type="p">321:焊盤電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2809" publication-number="202626442"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626442.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浮式結構體及具有浮式結構體的海上風力裝置</chinese-title>  
        <english-title>FLOATING STRUCTURE AND OFFSHORE WIND POWER GENERATOR HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B63B35/44</main-classification>  
        <further-classification edition="201601120260325B">F03D13/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商浦項股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POSCO CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金應洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, EUNGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯明鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOH, MYUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴圭植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KYUSIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開一種浮式結構體。根據本發明的實施例的浮式結構體包括：中心立柱，包括海上風力機艙的塔架連接到中心立柱；浮筒，包括多個邊，並與中心立柱連接；外立柱，設置在浮筒的多個邊之間；以及連接部件，連接浮筒與中心立柱，浮筒包括：混凝土部，在多個邊中與外立柱連接並形成多個邊的兩端部；以及鋼材部，在多個邊中設置在混凝土部之間，並連接設置在多個邊的兩端部的混凝土部，混凝土部設置在多個邊的兩端部，連接部件與鋼材部結合，使得浮筒連接到中心立柱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:浮式海上風力裝置</p>  
        <p type="p">20:發電設備</p>  
        <p type="p">21:塔架</p>  
        <p type="p">22:機艙</p>  
        <p type="p">23:轉子</p>  
        <p type="p">23a:輪轂</p>  
        <p type="p">23b:葉片</p>  
        <p type="p">30:系泊設備</p>  
        <p type="p">31:系泊線</p>  
        <p type="p">32:錨</p>  
        <p type="p">34:導纜器</p>  
        <p type="p">100:浮式結構體</p>  
        <p type="p">110:中心立柱</p>  
        <p type="p">120:浮筒</p>  
        <p type="p">121:邊</p>  
        <p type="p">121a:第一邊</p>  
        <p type="p">121b:第二邊</p>  
        <p type="p">121c:第三邊</p>  
        <p type="p">129:鋼材部</p>  
        <p type="p">130:外立柱</p>  
        <p type="p">140:連接部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2810" publication-number="202628781"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628781.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電體膜積層基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">H10N30/01</main-classification>  
        <further-classification edition="202301120260401B">H10N30/078</further-classification>  
        <further-classification edition="202301120260401B">H10N30/097</further-classification>  
        <further-classification edition="202301120260401B">H10N30/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商薩盟技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALMONTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田邊將之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANABE, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">［課題］提供一種壓電體膜積層基板之製造方法，該方法能夠在確保壓電性能等品質的同時，有效率地在作為對象的基板上形成壓電體膜。&lt;br/&gt; ［解決手段］製造機構A具有箱型壓克力盒1。此外，在壓克力盒1的內部設有搬送部2、噴塗部3、乾燥冷卻部4以及燒成部5。此外，製造機構A具有低濕度氣體供應部，可對壓克力盒1的內部供應乾燥空氣，以控制壓克力盒1內部環境的濕度。此外，低濕度氣體供應部可控制噴塗部3內部環境的濕度。再者，構成燒成部5的燒成爐50具有溫濕度控制裝置，構成為在燒成爐50內部燒成基板時，可將爐內的溫度及濕度控制在一定值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:製造機構</p>  
        <p type="p">1:壓克力盒</p>  
        <p type="p">2:搬送部</p>  
        <p type="p">20:機械手臂</p>  
        <p type="p">3:噴塗部</p>  
        <p type="p">30:塗佈用壓克力盒</p>  
        <p type="p">4:乾燥冷卻部</p>  
        <p type="p">40:耐熱底座</p>  
        <p type="p">5:燒成部</p>  
        <p type="p">50:燒成爐</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2811" publication-number="202628323"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628323.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直動電動機及電動機製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H02K41/02</main-classification>  
        <further-classification edition="200601120260102B">H02K1/18</further-classification>  
        <further-classification edition="202501120260102B">H02K15/028</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野慧大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SATOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿里夫　扎伊尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIFF, ZAINI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲員佑真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAKAZU, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加嶋俊大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIMA, SHUNTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">直動電動機（100）係具備：可動元件（1），係具有露出面（161），該露出面（161）為齒部（11至13）被樹脂（15）所覆蓋，並且從樹脂（15）露出齒部（11至13）之一部分而成；及可動元件（3），係具有露出面（361），該露出面（361）為齒部（31至33）被樹脂（35）所覆蓋，並且從樹脂（35）露出齒部（31至33）之一部分而成；可動元件（1）係以在配置於固定元件（2）上之際，露出面（161）之垂線垂直於可動元件（1）之推力產生之方向及磁間隙產生之方向之方式形成有露出面（161）；可動元件（3）係以在配置於固定元件（2）上之際，露出面（361）之垂線垂直於可動元件（3）之推力產生之方向及磁間隙產生之方向之方式形成有露出面（361）；可動元件（1）與可動元件（3）係可於推力產生之方向連結。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1,3:可動元件</p>  
        <p type="p">2:固定元件</p>  
        <p type="p">11,12,13,31,32,33:齒部</p>  
        <p type="p">14,34:螺絲孔</p>  
        <p type="p">15,35:樹脂</p>  
        <p type="p">16:定位溝</p>  
        <p type="p">21:永久磁鐵</p>  
        <p type="p">100:直動電動機</p>  
        <p type="p">161:露出面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2812" publication-number="202626511"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626511.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化鈰分散液合成方法和超細氧化鈰分散液</chinese-title>  
        <english-title>METHOD FOR SYNTHESIZING CERIUM OXIDE DISPERSION AND ULTRAFINE CERIUM OXIDE DISPERSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260204B">C01F17/235</main-classification>  
        <further-classification edition="200601120260204B">C09G1/02</further-classification>  
        <further-classification edition="202401120260204B">B01J35/45</further-classification>  
        <further-classification edition="202401120260204B">B01J35/51</further-classification>  
        <further-classification edition="200601120260204B">C22B5/08</further-classification>  
        <further-classification edition="200601120260204B">C08L39/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃振鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHENPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹先升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, XIANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮家輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, JIAHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種氧化鈰分散液合成方法，包括：將四價鈰鹽作為鈰源與聚乙烯吡咯烷酮混合配成鈰鹽溶液；將沉澱劑水溶液加入到上述鈰鹽混合溶液中，並攪拌一段時間形成沉澱前驅物；將沉澱前驅物轉移到晶化釜中進行水熱晶化反應；最後將所得到產物洗滌，分散，過濾得到超細氧化鈰分散液。本發明以鈰（Ⅳ）鹽溶液金屬前驅體，添加沉澱劑，以PVP作為表面保護劑，藉由水熱晶化反應的參數調控，成功合成粒徑分佈窄，顆粒粒徑可控1-20nm，高分散，類球形形貌的超細氧化鈰，具有超細氧化鈰晶粒得益於其具有高表面缺陷和活性羥基數量，具有潛在高的化學機械拋光活性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a method for synthesizing cerium oxide dispersion, which includes the following steps: mixing a tetravalent cerium salt as the cerium source with polyvinylpyrrolidone to prepare a cerium salt solution; adding a precipitant aqueous solution to the above cerium salt mixed solution and stirring for a period of time to form a precipitation precursor; transferring the precipitation precursor to a crystallization autoclave for hydrothermal crystallization reaction; finally, washing, dispersing, and filtering the obtained product to obtain an ultrafine cerium oxide dispersion. The invention uses a cerium (IV) salt solution as the metal precursor, adds a precipitant, and employs PVP as a surface protective agent. Through the parameter control of the hydrothermal crystallization reaction, it successfully synthesizes ultrafine cerium oxide with a narrow particle size distribution, controllable particle size of 1-20 nm, high dispersion, and spherical-like morphology. The ultrafine cerium oxide grains benefit from their high surface defect density and active hydroxyl group content, endowing them with potential high chemical mechanical polishing activity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2813" publication-number="202626785"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626785.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性樹脂組成物、預浸體、積層板、印刷線路板及半導體封裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260313B">C08F20/18</main-classification>  
        <further-classification edition="200601120260313B">C08K5/10</further-classification>  
        <further-classification edition="200601120260313B">C08L79/08</further-classification>  
        <further-classification edition="200601120260313B">C08J5/08</further-classification>  
        <further-classification edition="200601120260313B">B32B27/04</further-classification>  
        <further-classification edition="200601120260313B">C07C13/465</further-classification>  
        <further-classification edition="200601120260313B">C08L63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野裕太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡志織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, SHIORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日高圭芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDAKA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩永抗太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWANAGA, KOHTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前川拓磨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEKAWA, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種預浸體，其在包含具有低介電特性的成分的情況下仍可表現高回焊耐熱性。進一步提供使用前述預浸體而成之積層板、印刷線路板及半導體封裝體。前述熱硬化性樹脂組成物，具體而言為如下熱硬化性樹脂組成物，其含有：包含茚滿骨架之馬來醯亞胺樹脂(A)；以及，丙烯酸酯系樹脂(X)，其具有選自由羥基、羧基及經取代之胺基所組成之群組中的1種以上的官能基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2814" publication-number="202628477"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628477.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149442</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳線加熱器及碳線加熱器之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260114B">H05B3/14</main-classification>  
        <further-classification edition="200601120260114B">H05B3/44</further-classification>  
        <further-classification edition="200601120260114B">D01F9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商闊斯泰有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COORSTEK GK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土井寛太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOI, KANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大釜健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAMA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種碳線加熱器，其使用碳線發熱體表面之斷線較少且柔軟性較高的碳線發熱體。 &lt;br/&gt;本發明之碳線加熱器之特徵在於：其係於玻璃構件之內部收容藉由供電發熱之碳線發熱體而成者，且上述碳線發熱體係將束集碳單纖維而成之複數個碳纖維束編織為線狀而形成，上述碳線發熱體之石墨化度為0.2以上0.6以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2815" publication-number="202628556"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628556.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>精密系統及其組裝方法</chinese-title>  
        <english-title>PRECISION SYSTEM AND ASSEMBLING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H05K13/04</main-classification>  
        <further-classification edition="200601120251231B">H05K7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亮紫科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHTEST TECHNOLOGY TAIWAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊紳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, JIUN-SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董　中華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, ZHONGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種精密系統包括一腔體以及一殼體。腔體包括一第一壁及一第二壁，以形成一第一容置空間。至少一精密零件安裝於或將安裝於第一容置空間內第一壁上。殼體與腔體被組裝在一起或將被組裝在一起，以形成一第二容置空間。殼體與第一壁之間的第二容置空間連通至第一容置空間。在第一容置空間的壓力與精密系統外的壓力不同下，第一壁的變形實質上小於第二壁的變形或殼體的變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A precision system includes a chamber and an enclosure. The chamber includes a first wall and a second wall to create a first accommodation space. At least one precision part is mounted on the first wall inside the first accommodation space. The enclosure and the chamber are assembled to create a second accommodation space. The second accommodation space between the enclosure and the first wall connects to the first accommodation space. Deformation of the first wall is substantially less than deformation of the second wall or the enclosure after pressure in the first accommodation space becomes different from pressure outside the precision system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:精密系統</p>  
        <p type="p">110:腔體</p>  
        <p type="p">110H:孔洞</p>  
        <p type="p">110S,120S:容置空間</p>  
        <p type="p">110W1~110W4,120W1,120W2,120W4:壁</p>  
        <p type="p">120:殼體</p>  
        <p type="p">130:精密零件</p>  
        <p type="p">140:墊片</p>  
        <p type="p">150:密封件</p>  
        <p type="p">160:固定件</p>  
        <p type="p">170:降微粒器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2816" publication-number="202627758"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627758.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>逐幀提供頻率以驅動影片解碼器的電源管理方法</chinese-title>  
        <english-title>POWER MANAGEMENT METHOD THAT CAN PROVIDE FREQUENCY FRAME BY FRAME TO DRIVE VIDEO DECODER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260102B">G06F1/324</main-classification>  
        <further-classification edition="201901120260102B">G06F1/3296</further-classification>  
        <further-classification edition="201901120260102B">G06F1/3206</further-classification>  
        <further-classification edition="201401120260102B">H04N19/42</further-classification>  
        <further-classification edition="201401120260102B">H04N19/127</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫善強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, SHAN-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周冠宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, KUAN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡旻翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MIN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源管理方法包括：接收一輸入影片訊號，其中輸入影片訊號包括多個幀；從多個幀中提取至少一個影片特徵；根據至少一個影片特徵執行預測操作以生成粗略預測結果，其中粗略預測結果指示每個多個幀的所需功率值；以及對於每個多個幀，根據精細預測結果調整影片解碼器的頻率以驅動影片解碼器，其中精細預測結果是粗略預測結果的誤差校準版本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power management method includes: receiving an input video signal, wherein the input video signal comprises multiple frames; extracting at least one video feature from each of the multiple frames; performing a prediction operation according to the at least one video feature to generate a coarse prediction result, wherein the coarse prediction result is indicative of a value of a required power of the each of the multiple frames; and for the each of the multiple frames, adjusting a frequency of a video decoder according to a refined prediction result to drive the video decoder, wherein the refined prediction result is an error calibrated version of the coarse prediction result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子設備</p>  
        <p type="p">12:處理器</p>  
        <p type="p">14:儲存設備</p>  
        <p type="p">16:影片解碼器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2817" publication-number="202626243"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626243.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>焊料組成合金及錫球</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">B23K35/02</main-classification>  
        <further-classification edition="200601120260102B">B23K35/26</further-classification>  
        <further-classification edition="200601120260102B">C22C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海飛凱材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虞洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王先鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏昕妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種焊料組成合金及錫球，屬於合金技術領域。本申請實施例提供的焊料組成合金包括銀、銅、鎳、鍺、鉍和錫，通過調整銀的含量，可以使合金具有良好的耐熱迴圈性能和耐跌落衝擊性能；通過調整鎳的含量，可以有效減少以該合金形成的焊點的界金屬部位的厚度，避免該焊點在推球試驗時發生自界金屬部位斷裂的情況，進而提高合金的耐熱迴圈性能和耐跌落衝擊性能；通過調整鉍的含量，可以提高合金的抗拉強度和降伏強度，進而提高合金的耐熱迴圈性能，同時降低合金的熔點，減少焊接過程中所需的能量。由此可見，通過各組分之間的協同作用，不僅可以使合金同時具有良好的耐熱迴圈性能和耐跌落衝擊性能，還可以提升合金在其他方面的性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">
        </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2818" publication-number="202628359"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628359.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於一電力線路徑的主動式電感阻抗強化電路</chinese-title>  
        <english-title>ACTIVE INDUCTIVE IMPEDANCE ENHANCEMENT CIRCUIT APPLIED TO POWER LINE PATH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">H03H11/48</main-classification>  
        <further-classification edition="200601120260224B">H04B3/56</further-classification>  
        <further-classification edition="200601120260224B">H04B3/54</further-classification>  
        <further-classification edition="200601120260224B">H01F27/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商香港龍雲科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HK OCEANCOMM TECHNOLOGY CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HSIN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YONG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種應用於電力線路徑的主動式電感阻抗強化電路，利用閉環控制技術偵測電力線上的殘餘高頻訊號，並據此產生一補償電流注入至主電感的二次側。本發明能主動抑制流經主電感的高頻電流，從而顯著強化其對高頻雜訊的阻抗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an active inductive impedance enhancement circuit applied to a power line path. It utilizes a closed-loop control technique to detect residual high-frequency signals on the power line and generates a compensation current injected into the secondary side of the main inductor accordingly. The invention actively suppresses high-frequency current flowing through the main inductor, thereby significantly enhancing its impedance against high-frequency noise.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:本發明電路</p>  
        <p type="p">4:變壓器</p>  
        <p type="p">V:跨主電感兩端電壓值</p>  
        <p type="p">202:電流產生器</p>  
        <p type="p">L&lt;sub&gt;P&lt;/sub&gt;:主電感</p>  
        <p type="p">L&lt;sub&gt;S1&lt;/sub&gt;:二次側電感</p>  
        <p type="p">I&lt;sub&gt;in&lt;/sub&gt;:由訊號源產生流進主電感之電流</p>  
        <p type="p">I&lt;sub&gt;M&lt;/sub&gt;:殘餘高頻電流</p>  
        <p type="p">I&lt;sup&gt;+&lt;/sup&gt;,I&lt;sup&gt;-&lt;/sup&gt;:電流產生器產生之補償電流</p>  
        <p type="p">L:主電感電感值</p>  
        <p type="p">N:常數</p>  
        <p type="p">C5:隔離電容</p>  
        <p type="p">V&lt;sub&gt;M&lt;/sub&gt;:感應電壓</p>  
        <p type="p">C4:串聯電容</p>  
        <p type="p">NV:與主電感兩端電壓成比例的電壓訊號</p>  
        <p type="p">202a、202b:類比數位轉換器</p>  
        <p type="p">202c:DAC電流輸出決策與計算單元</p>  
        <p type="p">202d:電流型數位類比轉換器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2819" publication-number="202628223"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628223.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149532</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組、製造電池組的方法及包括電池組的載具</chinese-title>  
        <english-title>BATTERY PACK, METHOD FOR MANUFACTURING BATTERY PACK, AND VEHICLE INCLUDING THE BATTERY PACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260302B">H01M10/613</main-classification>  
        <further-classification edition="201401120260302B">H01M10/625</further-classification>  
        <further-classification edition="201401120260302B">H01M10/643</further-classification>  
        <further-classification edition="201401120260302B">H01M10/6554</further-classification>  
        <further-classification edition="201401120260302B">H01M10/6556</further-classification>  
        <further-classification edition="201401120260302B">H01M10/6557</further-classification>  
        <further-classification edition="202101120260302B">H01M50/204</further-classification>  
        <further-classification edition="202101120260302B">H01M50/213</further-classification>  
        <further-classification edition="202101120260302B">H01M50/24</further-classification>  
        <further-classification edition="202101120260302B">H01M50/242</further-classification>  
        <further-classification edition="202101120260302B">H01M50/244</further-classification>  
        <further-classification edition="202101120260302B">H01M50/249</further-classification>  
        <further-classification edition="202101120260302B">H01M50/258</further-classification>  
        <further-classification edition="202101120260302B">H01M50/271</further-classification>  
        <further-classification edition="202101120260302B">H01M50/291</further-classification>  
        <further-classification edition="201901120260302B">B60L50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔洙鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAE-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, EUI-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭渽勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAE-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔泰雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TAE-WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種電池組，其包括單體陣列結構，單體陣列結構包括多個電池單體和側框，側框被配置成支撐多個電池單體；以及冷卻構件，設置於多個電池單體的底部及多個電池單體之間的間隙中的至少一者，以冷卻多個電池單體，其中單體陣列結構包括片構件，片構件可拆卸地設置於多個電池單體的底部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a battery pack, which includes a cell array structure including a plurality of battery cells and a side frame configured to support the plurality of battery cells; and a cooling member provided to at least one of a bottom portion of the plurality of battery cells and a gap between the plurality of battery cells so as to cool the plurality of battery cells, wherein the cell array structure includes a sheet member detachably provided to the bottom portion of the plurality of battery cells.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池組</p>  
        <p type="p">100:單體陣列結構</p>  
        <p type="p">110:電池單體</p>  
        <p type="p">130:側框</p>  
        <p type="p">132:側壁</p>  
        <p type="p">150:片構件</p>  
        <p type="p">170:端蓋</p>  
        <p type="p">300:填充構件</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2820" publication-number="202626754"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626754.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149534</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性組成物、像素之製造方法、膜、濾光器、固體攝像元件及圖像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/38</main-classification>  
        <further-classification edition="200601120260401B">C08F2/44</further-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">C08K5/33</further-classification>  
        <further-classification edition="200601120260401B">C08K5/3417</further-classification>  
        <further-classification edition="200601120260401B">C08K5/375</further-classification>  
        <further-classification edition="200601120260401B">C08K5/45</further-classification>  
        <further-classification edition="200601120260401B">C08L101/08</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G02B5/20</further-classification>  
        <further-classification edition="200601120260401B">G02B5/22</further-classification>  
        <further-classification edition="200601120260401B">G09F9/30</further-classification>  
        <further-classification edition="202501120260401B">H10F39/00</further-classification>  
        <further-classification edition="202501120260401B">H10F39/12</further-classification>  
        <further-classification edition="202301120260401B">H10K59/35</further-classification>  
        <further-classification edition="202301120260401B">H10K59/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野修史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光硬化性組成物、使用前述光硬化性組成物之像素之製造方法、膜、濾光器、固體攝像元件及圖像顯示裝置，上述光硬化性組成物包含光聚合起始劑、聚合性化合物、樹脂、色材及聚合抑制劑，上述光聚合起始劑包含由式（1）表示之化合物，上述樹脂包含具有酸基之樹脂。 &lt;br/&gt;&lt;img align="absmiddle" height="104px" width="245px" file="ed10086.JPG" alt="ed10086.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2821" publication-number="202626595"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626595.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件及自由基聚合起始劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07C251/64</main-classification>  
        <further-classification edition="200601120260302B">C08F2/50</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/027</further-classification>  
        <further-classification edition="200601120260302B">G03F7/031</further-classification>  
        <further-classification edition="200601120260302B">G03F7/038</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification>  
        <further-classification edition="200601120260302B">G03F7/32</further-classification>  
        <further-classification edition="200601120260302B">B32B15/08</further-classification>  
        <further-classification edition="202601120260302B">H10P14/60</further-classification>  
        <further-classification edition="202601120260302B">H10P14/68</further-classification>  
        <further-classification edition="202601120260302B">H10W20/41</further-classification>  
        <further-classification edition="202601120260302B">H10W72/00</further-classification>  
        <further-classification edition="202601120260302B">H10W72/30</further-classification>  
        <further-classification edition="202601120260302B">H10W74/01</further-classification>  
        <further-classification edition="202601120260302B">H10W74/15</further-classification>  
        <further-classification edition="202601120260302B">H10W74/47</further-classification>  
        <further-classification edition="202601120260302B">H10W90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧野雅臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKINO, MASAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光硬化性組成物、將上述組成物硬化而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體器件及其製造方法、以及新型化合物，該光硬化性組成物含有光自由基聚合起始劑及硬化性化合物，上述光自由基聚合起始劑在1分子中具有2～4個以單鍵鍵結於芳香環之（酮）肟基，並且其中至少1個（酮）肟基在芳香環中與作為與芳香環的鍵結部位為氧原子、硫原子或氮原子之取代基X處於相鄰位的位置關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2822" publication-number="202627640"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627640.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光單元、液晶顯示裝置及資訊設備</chinese-title>  
        <english-title>BACKLIGHT UNIT, LIQUID CRYSTAL DISPLAY DEVICE AND INFORMATION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">G02F1/1335</main-classification>  
        <further-classification edition="200601120260211B">G02F1/13357</further-classification>  
        <further-classification edition="200601120260211B">G02B5/04</further-classification>  
        <further-classification edition="201501120260211B">G02B1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商惠和股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIWA INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹賢太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開旨在提供一種新型的背光單元。本公開的一個方案所關於的背光單元（40）包括：導光板（43）、至少一個光源（41）、具有沿第一方向（d12）延伸的多個棱鏡（64a）的第一片材（44）、具有沿第二方向（d13）延伸的多個棱鏡（45a）的第二片材（45）、以及具有沿第三方向（d14）延伸的多個棱鏡（46a）的第三片材（46），並且，在俯視時第二方向與第三方向基本上正交，俯視時的導光板的光入射面延伸方向（d11）與第一方向及第三方向之間的角度X&lt;sub&gt;1&lt;/sub&gt;和X&lt;sub&gt;3&lt;/sub&gt;滿足以下至少任意一項。（1）0° ≤ X&lt;sub&gt;3&lt;/sub&gt; ＜ 95°，且-10° ≤ X&lt;sub&gt;1&lt;/sub&gt;-X&lt;sub&gt;3&lt;/sub&gt; ≤ 10°（2）95° ≤ X&lt;sub&gt;3&lt;/sub&gt; ≤ 135°，且-45° ≤ X&lt;sub&gt;1&lt;/sub&gt;-X&lt;sub&gt;3&lt;/sub&gt; ≤ 45°（3）135° ＜ X&lt;sub&gt;3&lt;/sub&gt; ＜ 180°，且-10° ≤ X&lt;sub&gt;1&lt;/sub&gt;-X&lt;sub&gt;3&lt;/sub&gt; ≤ 10°</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:背光單元</p>  
        <p type="p">41:光源</p>  
        <p type="p">42:反射片</p>  
        <p type="p">43:導光板</p>  
        <p type="p">43a:柱狀透鏡</p>  
        <p type="p">44:第一片材</p>  
        <p type="p">45:第二片材</p>  
        <p type="p">45a:棱鏡</p>  
        <p type="p">46:第三片材</p>  
        <p type="p">46a:棱鏡</p>  
        <p type="p">46b:突起</p>  
        <p type="p">47:光源層</p>  
        <p type="p">48:光</p>  
        <p type="p">62a:光出射面</p>  
        <p type="p">63a:光入射面</p>  
        <p type="p">64a:棱鏡</p>  
        <p type="p">d1:導光方向</p>  
        <p type="p">d11:導光板的光入射面延伸方向</p>  
        <p type="p">d12:第一方向</p>  
        <p type="p">d13:第二方向</p>  
        <p type="p">d14:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2823" publication-number="202627343"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627343.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉接頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">F16L27/08</main-classification>  
        <further-classification edition="200601120260323B">H02K55/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商伊格爾工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EAGLE INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江藤隼太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETO, HAYATA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田孝治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高田寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKATA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神谷真司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMITANI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種旋轉接頭。負壓流道（R1）由形成於旋轉軸（2）的旋轉軸側負壓流道（21）、形成於殼體（3）的殼體側負壓流道（31）、以及形成於旋轉軸側負壓流道（21）與殼體側負壓流道（31）之間的負壓側間隙（S1）構成，正壓流道（R2）由形成於旋轉軸（2）的旋轉軸側正壓流道（22）、形成於殼體（3）的殼體側正壓流道（32）、以及形成於旋轉軸側正壓流道（22）與殼體側正壓流道（32）之間的正壓側間隙（S2）構成，並且具備密封負壓側間隙（S1）的負壓側密封構件（4，4）、以及密封正壓側間隙（S2）的正壓側密封構件（5，5）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:旋轉接頭</p>  
        <p type="p">2:旋轉軸</p>  
        <p type="p">3:殼體</p>  
        <p type="p">3a:凸緣部</p>  
        <p type="p">4:唇形密封件</p>  
        <p type="p">5:磁性流體密封件</p>  
        <p type="p">6:工作臺</p>  
        <p type="p">6a:凹部</p>  
        <p type="p">6b:貫通孔</p>  
        <p type="p">6c:貫通孔</p>  
        <p type="p">7:固定腔室</p>  
        <p type="p">8:軸承</p>  
        <p type="p">21:流道</p>  
        <p type="p">22:流道</p>  
        <p type="p">31:流道</p>  
        <p type="p">32:流道</p>  
        <p type="p">P1:真空泵</p>  
        <p type="p">P2:氣體供給泵</p>  
        <p type="p">R1:負壓流道</p>  
        <p type="p">R2:正壓流道</p>  
        <p type="p">S1:空間</p>  
        <p type="p">S2:空間</p>  
        <p type="p">S3:空間</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2824" publication-number="202628690"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628690.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括多高度單元的積體電路</chinese-title>  
        <english-title>INTEGRATED CIRCUIT INCLUDING MULTI-HEIGHT CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10D89/10</main-classification>  
        <further-classification edition="202001120260102B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金雅凛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, AHREUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炳洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNGSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">積體電路包括多高度單元、多個單元、以及至少一個填充單元。多高度單元包括具有第一寬度的至少一個正常主動圖案以及具有大於第一寬度的第二寬度的至少一個寬主動圖案，其中至少一個正常主動圖案和至少一個寬主動圖案分別在第一方向中延伸。多個單元在交叉第一方向的第二方向中彼此相鄰，其中多個單元中的每一個包括具有第一寬度的至少一個主動圖案。至少一個填充單元配置在多個單元的相鄰單元和多高度單元之間在第一方向中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a multi-height cell, a plurality of cells, and at least one filler cell. The multi-height cell includes at least one normal active pattern having a first width and at least one wide active pattern having a second width greater than the first width, where the at least one normal active pattern and the at least one wide active pattern respectively extend in a first direction. The plurality of cells are adjacent to one another in a second direction crossing the first direction, where each of the plurality of cells includes at least one active pattern having the first width. The at least one filler cell is arranged between an adjacent cell of the plurality of cells and the multi-height cell in the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電路</p>  
        <p type="p">11:多高度單元</p>  
        <p type="p">AP1a,AP1b,AP2a,AP2b,AP3a,AP3b,AP4a,AP4b,AP5a,AP5b,AP6a,AP6b,NAP1,NAP2,WAP1,WAP2:主動圖案</p>  
        <p type="p">AP_P:P型主動圖案</p>  
        <p type="p">AP_N:N型主動圖案</p>  
        <p type="p">BD:單元邊界</p>  
        <p type="p">C1~C6,FC,FC1,FC2,FC3,FC4:單元</p>  
        <p type="p">H:高度</p>  
        <p type="p">L1:第一長度</p>  
        <p type="p">L2:第二長度</p>  
        <p type="p">PR1,PR2,PR3,PR4:電源軌</p>  
        <p type="p">VDD:電源供應電壓</p>  
        <p type="p">VSS:接地</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W2:第二寬度</p>  
        <p type="p">X,Y,Z:軸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2825" publication-number="202628909"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628909.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板之搬運控制方法及基板處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H10P72/50</main-classification>  
        <further-classification edition="200601120260401B">G05B19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上晃誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, KOSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江頭篤嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGASHIRA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田一生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, ISSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">依本發明之一態樣的基板之搬運控制方法，係在包含批次處理部及單片處理部，並將在該批次處理部處理過的批次之基板搬運至該單片處理部進行處理之基板處理系統中的該基板之搬運控制方法，其包含以下步驟：使在該批次處理部處理過的該基板在浸漬於浸漬槽內的狀態下待命的步驟、從該浸漬槽內取出該基板，並搬運至設於搬運至該單片處理部之搬運路徑之中途的傳遞台的步驟，及將該傳遞台的該基板搬運至該單片處理部的步驟；該搬運至傳遞台的步驟，係在判斷該單片處理部為可接受該基板之狀態後進行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S31~S39:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2826" publication-number="202627166"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627166.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化矽塗佈膜、成形品、填充品，以及填充品的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/40</main-classification>  
        <further-classification edition="200601120260302B">B32B33/00</further-classification>  
        <further-classification edition="200601120260302B">B65D23/02</further-classification>  
        <further-classification edition="200601120260302B">B65D65/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日清奧利友集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE NISSHIN OILLIO GROUP, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>目時潤也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METOKI, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村野賢博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURANO, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤茜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, AKANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種即使與油脂或油脂組成物長期接觸亦保持疏油性及/或除油性良好的狀態、或抑制疏油性及/或除油性的劣化的氧化矽塗佈膜及成形品。具體而言，本發明提供一種氧化矽塗佈膜，供於與油脂或油脂組成物接觸的用途，所述氧化矽塗佈膜中，所述氧化矽塗佈膜的表面的20℃下的基於氫鍵與偶極-偶極相互作用的成分（γ&lt;sup&gt;h&lt;/sup&gt;）為2.4 mJ/m&lt;sup&gt;2&lt;/sup&gt;以下，及/或20℃下的表面自由能（γ）為26 mJ/m&lt;sup&gt;2&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2827" publication-number="202626080"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626080.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149587</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>皮膚外用組合物及其製備方法與用途</chinese-title>  
        <english-title>SKIN EXTERNAL COMPOSITION, AND PREPARATION METHOD AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K36/48</main-classification>  
        <further-classification edition="200601120260401B">A61P17/00</further-classification>  
        <further-classification edition="201701120260401B">A61K8/9789</further-classification>  
        <further-classification edition="200601120260401B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高雄醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏峰霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, FENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富媗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳姿慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TZU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊淳茵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種蝶豆花（&lt;i&gt;Clitoria ternatea&lt;/i&gt;）萃取物的用途，用於製備抑制懸浮微粒（particulate matter，PM）誘導之一氧化壓力、一發炎反應或一皮膚老化反應的一組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a use of &lt;i&gt;Clitoria ternatea&lt;/i&gt; flower extract for a preparation of a combination that inhibits an oxidative stress, an inflammatory response, or a skin aging response induced by particulate matters (PM).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2828" publication-number="202628226"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628226.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池簇</chinese-title>  
        <english-title>BATTERY CLUSTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260122B">H01M10/6567</main-classification>  
        <further-classification edition="200601120260122B">H01M10/44</further-classification>  
        <further-classification edition="202101120260122B">H01M50/284</further-classification>  
        <further-classification edition="202101120260122B">H01M50/204</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>行競科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XING MOBILITY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宇中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂凱翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, KAI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汲毓舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, YU-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖資文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TZU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴尚智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, SHANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊錦堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIN-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯　謝爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHEL, DMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宜容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, I-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池簇包含複數個電池包，被配置為彼此電性耦接且電性耦接至外部電氣設備。各電池包包含充放電電路、低壓介面及高壓介面。複數個電池包包含至少一第一型電池包及至少一第二型電池包，第一型電池包具有包級電池管理電路及高壓切換電路位於高壓電力路徑中，第二型電池包沒有包級電池管理電路但包含電池監控電路。第一型電池包及第二型電池包互連使得相同高壓電力路徑延伸穿過兩者，且開啟第一型電池包之高壓切換電路中斷流經高壓電力路徑之電流。包級電池管理電路經由低壓介面與電池監控電路通訊以獲取測量資訊並控制至少高壓切換電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery cluster is provided that includes a plurality of battery packs configured to be electrically coupled to one another and to external electrical equipment. Each battery pack includes a charging-discharging circuit, a low-voltage interface and a high-voltage interface. The plurality of battery packs includes at least one first-type pack having a pack-level battery management circuit and a high-voltage switching circuit in a high-voltage power path, and at least one second-type pack lacking the pack-level battery management circuit but including a cell-monitoring circuit. The first-type and second-type packs are interconnected such that a same high-voltage power path extends through both, and opening the high-voltage switching circuit of the first-type pack interrupts current flowing through the high-voltage power path. The pack-level battery management circuit communicates with the cell-monitoring circuit via the low-voltage interfaces to obtain measurement information and control at least the high-voltage switching circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2000:電池簇</p>  
        <p type="p">P0至Pn:並聯串列索引</p>  
        <p type="p">S0至Sm:串聯位置索引</p>  
        <p type="p">P0S0至P15S3:電池包</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2829" publication-number="202626495"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626495.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二氧化碳改質方法及二氧化碳改質系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C01B13/28</main-classification>  
        <further-classification edition="201701120251226B">C01B32/40</further-classification>  
        <further-classification edition="200601120251226B">B01D53/62</further-classification>  
        <further-classification edition="200601120251226B">B01J21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生沼学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OINUMA, GAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内藤皓貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAITO, TERUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的二氧化碳改質方法，其具有：取得二氧化碳之二氧化碳取得步驟、取得使用於水或氣體的處理之碳材料之碳材料取得步驟、以及藉由在前述碳材料的存在下，對前述二氧化碳施予電漿處理以改質成一氧化碳之電漿處理步驟；一種二氧化碳改質系統(200)，其具備：取得二氧化碳之二氧化碳取得部(5)、取得使用於水或氣體的處理之碳材料之碳材料取得部(6)、以及藉由在前述碳材料的存在下，對前述二氧化碳施予電漿處理以改質成一氧化碳之電漿改質控制部(7)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理容器</p>  
        <p type="p">1a:碳材料供給口</p>  
        <p type="p">1b:一氧化碳排出口</p>  
        <p type="p">100:二氧化碳改質裝置</p>  
        <p type="p">2:電漿產生部</p>  
        <p type="p">2a:二氧化碳入口</p>  
        <p type="p">2b,2c:電極</p>  
        <p type="p">2d:框體</p>  
        <p type="p">2e:電源</p>  
        <p type="p">C:碳材料</p>  
        <p type="p">P:放電電漿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2830" publication-number="202628505"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628505.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H05K1/181</main-classification>  
        <further-classification edition="202601120260327B">H05K3/341</further-classification>  
        <further-classification edition="200601120260327B">H05K3/46</further-classification>  
        <further-classification edition="202501120260327B">H10H29/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPS ALPINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安本貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUMOTO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠減少電子部件的安裝不良的產生的多層基板。本發明的多層基板（100）包括隔著絕緣層層疊的第一、第二、第三以及第四導體層，在作為最上層的第一導體層形成有用於焊料連接微型LED（80）的R電極、G電極、B電極、C（公共）電極的多個焊盤（130R、130G、130B、130C）。焊盤（130R、130G、130B、130C）具有相同的平面形狀。焊盤（130G、130G、130B、130C）經由導電性的通孔（140）與形成於第二至第四導體層的布線圖案電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">80:焊料連接微型LED</p>  
        <p type="p">100:多層基板</p>  
        <p type="p">210,220,230,240:絕緣層</p>  
        <p type="p">130R,130G,130B,130C:焊盤</p>  
        <p type="p">140R,140G,140B,140C:通孔</p>  
        <p type="p">250R,250G,250B,250C:布線圖案</p>  
        <p type="p">R,G,B,C:電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2831" publication-number="202628752"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628752.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260112B">H10K50/805</main-classification>  
        <further-classification edition="202301120260112B">H10K50/813</further-classification>  
        <further-classification edition="202301120260112B">H10K50/814</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金官洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWAN-SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供之一種具有均勻亮度之顯示裝置。顯示裝置包含：基板，包含發光區域及非發光區域；發光元件，其設置於基板上之發光區域內，且包含第一電極、有機層及第二電極；輔助配線，設置於基板上且位於非發光區域內；輔助電極，設置於輔助配線上，且包含位於至少一部分側表面上之凸起部；堤部，設置於輔助電極之一部分頂表面上，且包含至少一個形成於非發光區域內之開口；沉積防止層，設置於堤部及輔助電極上；以及連接圖案，與第二電極之每一側表面之至少一部分以及凸起部接觸，且凸起部及連接圖案與堤部之開口重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device presented herein features a display panel with uniform luminance. The display device includes a substrate including an emission area and a non-emission area, a light emitting element disposed in the emission area on the substrate and including a first electrode, an organic layer, and a second electrode, an auxiliary wiring on the substrate and in the non-emission area, an auxiliary electrode on the auxiliary wiring and including a protrusion in at least a part of a side surface, a bank in a part of a top surface of the auxiliary electrode and including at least one hole in the non-emission area, a deposition prevention layer on the bank and the auxiliary electrode, and a connection pattern in contact with at least a part of each side surface of the second electrode and the protrusion, and the protrusion and the connection pattern overlap the hole of the bank.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">124:輔助配線/輔助線路</p>  
        <p type="p">140:第一訊號線</p>  
        <p type="p">151:第二訊號線</p>  
        <p type="p">152:第三訊號線</p>  
        <p type="p">CNT1:第一接觸區域</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">EA:發光區域</p>  
        <p type="p">EA1:第一發光區域</p>  
        <p type="p">EA2:第二發光區域</p>  
        <p type="p">EA3:第三發光區域</p>  
        <p type="p">NEA:非發光區域</p>  
        <p type="p">SP1:第一子像素</p>  
        <p type="p">SP2:第二子像素</p>  
        <p type="p">SP3:第三子像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2832" publication-number="202628231"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628231.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組</chinese-title>  
        <english-title>BATTERY PACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260327B">H01M50/204</main-classification>  
        <further-classification edition="202101120260327B">H01M50/258</further-classification>  
        <further-classification edition="202101120260327B">H01M50/289</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宰榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JAE-YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎭浯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN-OH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, EUI-CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭渽勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, JAE-HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔洙鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔泰雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TAE-WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種電池組。電池組包括底板，具有從其上表面突出的第一連接銷；第一側結構，定位於底板上並在前後方向上延伸；多個第一電池單元，安裝至第一側結構；以及第一連接件，安裝至第一側結構並具有第一下部孔，第一連接銷插入第一下部孔中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a battery pack. The battery pack includes a base plate having a first coupling pin protruding from an upper surface thereof; a first side structure positioned on the base plate and extending in a front and rear direction; a plurality of first battery cells mounted to the first side structure; and a first coupling member mounted to the first side structure and having a first lower hole into which the first coupling pin is inserted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:外殼</p>  
        <p type="p">110:底板</p>  
        <p type="p">120:側壁</p>  
        <p type="p">150:包裝蓋</p>  
        <p type="p">1000:電池組</p>  
        <p type="p">F:緊固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2833" publication-number="202626594"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626594.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新方法</chinese-title>  
        <english-title>NEW PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C251/40</main-classification>  
        <further-classification edition="200601120260401B">C07C249/04</further-classification>  
        <further-classification edition="200601120260401B">C07D231/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商先正達農作物保護股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNGENTA CROP PROTECTION AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪伍德　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARWOOD, MICHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了一種用於製備丙-2-發明取代的苯基/肟醚、特別是製備1-(2,4,6-三氯苯基)-丙-2-酮肟和N-甲氧基-1-(2,4,6-三氯苯基)-丙-2-發明之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Process for the preparation of propan-2-imine-substituted phenyls/oxime ethers, in particular to the preparation of 1-(2,4,6-trichlorophenyl)-propan-2-one oxime and N-methoxy-1-(2,4,6-trichlorophenyl)-propan-2-imine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2834" publication-number="202626507"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626507.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磺酸改性膠體二氧化矽以及磺酸改性膠體二氧化矽的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C01B33/152</main-classification>  
        <further-classification edition="200601120260102B">C01B33/157</further-classification>  
        <further-classification edition="200601120260102B">C09K3/14</further-classification>  
        <further-classification edition="200601120260102B">C09G1/02</further-classification>  
        <further-classification edition="200601120260102B">C08L101/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商扶桑化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSO CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田良真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, RYOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野智陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, CHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠形成表面粗糙度高度地降低的研磨面的磺酸改性膠體二氧化矽。一種磺酸改性膠體二氧化矽，其特徵在於，二氧化矽顆粒的硫含量相對於1g二氧化矽顆粒為3000質量ppm以上且9000質量ppm以下，溶劑中的硫含量相對於1g溶劑為750質量ppm以下，將二氧化矽顆粒濃度設為1質量%時，二氧化矽顆粒中所含的粒徑為0.2μm以上的粗大顆粒含量為10,000,000個/mL以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2835" publication-number="202627029"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627029.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磺酸改性膠體二氧化矽以及磺酸改性膠體二氧化矽的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C09K3/14</main-classification>  
        <further-classification edition="200601120260302B">C01G1/02</further-classification>  
        <further-classification edition="200601120260302B">C01B33/14</further-classification>  
        <further-classification edition="200601120260302B">C01B33/141</further-classification>  
        <further-classification edition="202601120260302B">H10P52/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商扶桑化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSO CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野智陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, CHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種磺酸改性膠體二氧化矽，即使在用於對設置有氮化矽膜的半導體晶圓進行研磨處理的情況下，亦能夠以高速度形成平坦性高的研磨面。一種磺酸改性膠體二氧化矽，其特徵在於，二氧化矽顆粒的硫含量相對於1g二氧化矽顆粒為700質量ppm以上且小於3000質量ppm，溶劑中的硫含量相對於1g溶劑為250質量ppm以下，將二氧化矽顆粒濃度設為1質量%時，二氧化矽顆粒中所含的粒徑為0.2μm以上的粗大顆粒含量為10,000,000個/mL以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2836" publication-number="202627395"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627395.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有變化翼緣傾角的板式熱交換器</chinese-title>  
        <english-title>A PLATE HEAT EXCHANGER WITH VARYING FLANK INCLINATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">F28F3/08</main-classification>  
        <further-classification edition="200601120260327B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商舒瑞普國際股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWEP INTERNATIONAL AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托馬斯　達爾伯格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMAS, DAHLBERG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯文　安德森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SVEN, ANDERSSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種板式熱交換器，其包含複數個具有通孔及脊部及溝槽的圖案的第一熱交換板及第二熱交換板，該圖案在形成供流體進行熱交換的板間流道下，提供相鄰熱交換板之間的接觸點。每一該等脊部具有一頂部部分，且每一該等溝槽具有一底部部分，皆沿著脊部及溝槽的一縱向方向延伸，其中所述頂部及底部部分係經由沿著脊部及溝槽延伸的相對的第一翼緣及第二翼緣相連。至少一部分的脊部及溝槽的第一翼緣的傾角不同於其第二翼緣的傾角。所述第一翼緣的傾角沿著脊部及溝槽變化，及/或在不同脊部及溝槽之間變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plate heat exchanger comprising a plurality of first and second heat exchanger plates having port openings and a pattern of ridges and grooves providing contact points between adjacent heat exchanger plates under formation of interplate flow channels for fluids to exchange heat. Each of the ridges has a top portion and each of the grooves has a bottom portion extending in a longitudinal direction of the ridges and grooves, wherein said top and bottom portions are connected through opposite first and second flanks extending along the ridges and grooves. An inclination of the first flank of at least some of the ridges and grooves differs from an inclination of the second flank thereof. The inclination of said first flank varies along the ridges and grooves, and/or between different ridges and grooves.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一熱交換板</p>  
        <p type="p">120:第二熱交換板</p>  
        <p type="p">180:頂部部分</p>  
        <p type="p">190:底部部分</p>  
        <p type="p">200:第一翼緣</p>  
        <p type="p">210:第二翼緣</p>  
        <p type="p">181、182:頂部部分</p>  
        <p type="p">201、211、202、212:翼緣</p>  
        <p type="p">O1:第一通孔</p>  
        <p type="p">O2:第二通孔</p>  
        <p type="p">O3:第三通孔</p>  
        <p type="p">O4:第四通孔</p>  
        <p type="p">R:脊部</p>  
        <p type="p">G:溝槽</p>  
        <p type="p">R1:第一脊部</p>  
        <p type="p">R2:第二脊部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2837" publication-number="202628711"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628711.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149740</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體受光元件及半導體受光元件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260302B">H10F77/40</main-classification>  
        <further-classification edition="202501120260302B">H10F30/21</further-classification>  
        <further-classification edition="200601120260302B">G02B5/20</further-classification>  
        <further-classification edition="200601120260302B">G02B1/02</further-classification>  
        <further-classification edition="202501120260302B">H10F71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商同和電子科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWA ELECTRONICS MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野雅之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>町田真子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHIDA, MAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有光學濾波器並且暗電流小的半導體受光元件及半導體受光元件的製造方法。本揭示的半導體受光元件包括：基板；半導體積層體，具有受光部；以及上表面電極，所述上表面電極具有框狀電極及與所述框狀電極的一部分連接的焊墊電極，在俯視時，所述框狀電極以包圍所述半導體積層體的所述受光部的方式配置，所述受光元件具有覆蓋除了所述焊墊電極的外部連接面以外的所述半導體積層體及所述框狀電極上的整個面的光學濾波器，所述光學濾波器的電阻率為3.0×10&lt;sup&gt;12&lt;/sup&gt; Ωμm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體受光元件</p>  
        <p type="p">10:基板(n型InP生長用基板、生長用基板)</p>  
        <p type="p">20:受光層(In&lt;sub&gt;0.53&lt;/sub&gt;Ga&lt;sub&gt;0.47&lt;/sub&gt;As受光層、InGaAs受光層)</p>  
        <p type="p">30:窗層(n型InP窗層)</p>  
        <p type="p">50:擴散防止層</p>  
        <p type="p">60:Zn擴散區域</p>  
        <p type="p">61:p型接觸層(p型InGaAs接觸層、符號)</p>  
        <p type="p">62:p型區域</p>  
        <p type="p">63:受光部</p>  
        <p type="p">70:電介質層(Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;電介質層)</p>  
        <p type="p">80:上表面電極</p>  
        <p type="p">81:框狀電極</p>  
        <p type="p">82:焊墊電極</p>  
        <p type="p">90:光學濾波器</p>  
        <p type="p">100:背面電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2838" publication-number="202627541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光半導體元件及光半導體元件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G02B5/20</main-classification>  
        <further-classification edition="200601120260202B">C23C16/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商同和電子科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWA ELECTRONICS MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野雅之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>町田真子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACHIDA, MAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即便在高溫高濕下暗電流的增加亦少的電極與光學濾波器相接的光半導體元件及其製造方法。本揭示的光半導體元件包括：電極、以及至少一部分與電極相接的光學濾波器，所述光半導體元件具有所述光學濾波器且特徵在於，光學濾波器包含電介質多層膜，在光學濾波器的最上層上具有包含SiO&lt;sub&gt;2&lt;/sub&gt;或Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;的保護膜，在最上層與保護膜之間具有在剖面TEM像中觀察到較最上層及保護膜暗的中間層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板(n型InP生長用基板、生長用基板)</p>  
        <p type="p">20:受光層(In&lt;sub&gt;0.53&lt;/sub&gt;Ga&lt;sub&gt;0.47&lt;/sub&gt;As受光層、InGaAs受光層)</p>  
        <p type="p">30:窗層(n型InP窗層)</p>  
        <p type="p">50:擴散防止層</p>  
        <p type="p">60:Zn擴散區域</p>  
        <p type="p">61:p型接觸層(p型InGaAs接觸層、符號)</p>  
        <p type="p">62:p型區域</p>  
        <p type="p">63:受光部</p>  
        <p type="p">70:電介質層(Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;電介質層)</p>  
        <p type="p">80:上表面電極</p>  
        <p type="p">81:框狀電極</p>  
        <p type="p">82:焊墊電極</p>  
        <p type="p">90:光學濾波器</p>  
        <p type="p">91:保護膜</p>  
        <p type="p">100:背面電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2839" publication-number="202629028"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629028.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於嵌入式半導體裝置之封裝體及半導體裝置封裝體及其形成方法</chinese-title>  
        <english-title>PACKAGE FOR EMBEDDED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W72/29</main-classification>  
        <further-classification edition="202601120260302B">H10W20/43</further-classification>  
        <further-classification edition="202601120260302B">H05K1/185</further-classification>  
        <further-classification edition="202601120260302B">H05K3/328</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾馬　安吉特　布山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, ANKIT BHUSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置封裝體包括：一第一面板，其包括至少一個第一連接；及一第二面板，其包括至少一個第二連接。該封裝體包括一半導體裝置，該半導體裝置的一第一表面附接至該第一面板且連接至該至少一個第一連接，且與該半導體裝置的該第一表面相對的該半導體裝置的一第二表面附接至該第二面板且連接至該至少一個第二連接。該封裝體包括一面板連接器，該面板連接器的一第一表面附接至該第一面板，且與該面板連接器的該第一表面相對的該面板連接器的一第二表面附接至該第二面板，從而該面板連接器將該第一面板耦接至該第二面板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device package includes a first panel including at least one first connection and a second panel including at least one second connection. The package includes a semiconductor device with a first surface of the semiconductor device attached to the first panel and connected to the at least one first connection, and with a second surface of the semiconductor device, opposed to the first surface of the semiconductor device, attached to the second panel and connected to the at least one second connection. The package includes a panel connector, with a first surface of the panel connector attached to the first panel, and with a second surface of the panel connector, opposed to the first surface of the panel connector, attached to the second panel, the panel connector thereby coupling the first panel to the second panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:模組化嵌入式半導體裝置封裝體</p>  
        <p type="p">101:封裝材料</p>  
        <p type="p">102:面板</p>  
        <p type="p">104:面板</p>  
        <p type="p">106:半導體晶粒</p>  
        <p type="p">108:半導體晶粒</p>  
        <p type="p">110:面板連接器</p>  
        <p type="p">112,114,116,118,120,122,124,126:燒結層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2840" publication-number="202628885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149783</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拾取裝置的校準方法、半導體元件的製造方法及拾取裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P72/00</main-classification>  
        <further-classification edition="202601120260302B">H10W72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安齋秀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANZAI, SHUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊川雄也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOKAWA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩澤茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOZAWA, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於減低在從片剝離半導體晶片的動作中可能產生的不良。校準方法具有：步驟（S22），藉由使筒夾（61）相對於塊上頂面（531a）移動，在距基準高度（H531）規定的距離的位置配置筒夾（61）；步驟（S24），藉由塊馬達（532）接受筒夾馬達信號（C64），使塊上頂面（531a）接近筒夾保持面（61a）；步驟（S25），藉由接觸檢測部（65）對塊上頂面（531a）與筒夾保持面（61a）接觸的情況進行檢測；以及步驟（S3），使用從基準高度（H531）至配置筒夾（61）的步驟（S22）中設定的筒夾保持面（61a）的高度、以及檢測到塊上頂面（531a）與筒夾保持面（61a）接觸時的上頂面的高度，獲得塊馬達校正值（R532）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S3、S20、S21、S22、S23、S24、S25、S26、S27:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2841" publication-number="202626837"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626837.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>片狀樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260211B">C08G59/22</main-classification>  
        <further-classification edition="200601120260211B">C08L63/00</further-classification>  
        <further-classification edition="200601120260211B">C08G59/32</further-classification>  
        <further-classification edition="200601120260211B">C08K3/22</further-classification>  
        <further-classification edition="200601120260211B">C08K3/36</further-classification>  
        <further-classification edition="200601120260211B">C08K5/13</further-classification>  
        <further-classification edition="200601120260211B">B32B27/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐澤真義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARASAWA, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西岡宏司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIOKA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種操作性與低溫保管穩定性均良好的片狀樹脂組成物。一種片狀樹脂組成物，包含環氧樹脂、硬化劑及無機粒子，於根據動態黏彈性測定而獲得的時間-熔融黏度曲線中，將表示加熱時間10分鐘時的黏度的點A與表示加熱時間15分鐘時的黏度的點B連結的直線的斜率為1000 Pa·秒/分鐘以上且7000 Pa·秒/分鐘以下，所述動態黏彈性測定是於如下加熱條件下實施的：以0.93℃/秒的升溫速度自25℃升溫至135℃，以0.03℃/秒的升溫速度自135℃升溫至140℃，之後於140℃下進行保持。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2842" publication-number="202626261"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626261.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨墊、研磨方法及製造研磨墊的方法</chinese-title>  
        <english-title>POLISHING PAD, POLISHING METHOD, AND METHOD OF MANUFACTURING POLISHING PAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260401B">B24B37/04</main-classification>  
        <further-classification edition="201201120260401B">B24B37/10</further-classification>  
        <further-classification edition="201201120260401B">B24B37/20</further-classification>  
        <further-classification edition="201201120260401B">B24B37/24</further-classification>  
        <further-classification edition="201201120260401B">B24B37/26</further-classification>  
        <further-classification edition="200601120260401B">B24B57/02</further-classification>  
        <further-classification edition="200601120260401B">B24D18/00</further-classification>  
        <further-classification edition="202601120260401B">H10P52/00</further-classification>  
        <further-classification edition="202601120260401B">H10P52/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野村祥太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMURA, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松宏彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古川匠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬川将太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGAWA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望月健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIZUKI, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容提供了研磨墊、研磨方法及製造研磨墊的方法，該研磨墊實現抑制待研磨物件的邊緣處的邊緣滾降，同時維持高的整體平坦度和高的局部平坦度。研磨墊的特徵在於：氣泡面積比率最大的表面中的D20、D50和D80滿足以下運算式(1)和以下運算式(2)： &lt;br/&gt;100[μm]≤D50≤200[μm] (1)；和|D80-D20|/D50≤1.2 (2)；氣泡面積比率最大的表面中的氣泡面積比率為70面積%或更大且為95面積%或更小；並且在25℃下測量的樹脂片材的Asker A硬度為40或更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a polishing pad that achieves the suppression of edge roll-off at an edge of an object to be polished while maintaining high global flatness and high local flatness. The polishing pad is characterized in that: D20, D50, and D80 in a surface where a bubble area ratio is maximum satisfy the following formula (1) and the following formula (2): 100 [μm]≤D50≤200 [μm]∙∙∙(1); and |D80-D20|/D50≤1.2∙∙∙(2); the bubble area ratio in the surface where the bubble area ratio is maximum is 70 area% or more and 95 area% or less; and the Asker A hardness of the resin sheet measured at 25°C is 40 or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:凹部</p>  
        <p type="p">2:開口</p>  
        <p type="p">3:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2843" publication-number="202626406"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626406.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149796</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>刷拭裝置</chinese-title>  
        <english-title>WIPING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B60S1/04</main-classification>  
        <further-classification edition="200601120260325B">B60S1/16</further-classification>  
        <further-classification edition="200601120260325B">B60S1/24</further-classification>  
        <further-classification edition="200601120260325B">B60S1/34</further-classification>  
        <further-classification edition="200601120260325B">B60S1/44</further-classification>  
        <further-classification edition="200601120260325B">B08B9/087</further-classification>  
        <further-classification edition="200601120260325B">F16H21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁忠武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, CHUNG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁忠武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, CHUNG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種刷拭裝置，其包含一刷桿、安裝在該刷桿上之一刷件、一連動桿、一第一傳動臂、一第二傳動臂、一第一連動臂以及一第二連動臂，該連動桿與該刷桿彼此平行，該第一連動臂與該第二連動臂設置在該連動桿與該刷桿之間且彼此平行，該第一傳動臂與該第一連動臂轉動連接該連動桿且彼此直接或間接地轉動嚙合，該第一傳動臂與該第二傳動臂彼此平行，該第一傳動臂與該第二傳動臂的傳動端轉動軸連線平行或重合於該第一連動臂與該第二連動臂的配合端轉動軸連線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wiping device includes a wiping rod, a wiping member mounted on the wiping rod, a linking rod, a first transmission arm, a second transmission arm, a first linking arm and a second linking arm. The linking rod is parallel to the wiping rod. The first linking arm and the second linking arm are disposed between the linking rod and the wiping rod and parallel to each other. The first transmission arm and the first linking arm are rotatably connected to the linking rod and rotatably meshed with each other directly or indirectly. The first transmission arm is parallel to the second transmission arm. An extending line through rotating axes of transmission ends of the first transmission arm and the second transmission arm is parallel to or coincided with an extending line through rotating axes of cooperating ends of the first linking arm and the second linking arm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:刷拭裝置</p>  
        <p type="p">11:刷桿</p>  
        <p type="p">111:第一區段</p>  
        <p type="p">112:第二區段</p>  
        <p type="p">113:中間區段</p>  
        <p type="p">13:連動桿</p>  
        <p type="p">131:第一端部</p>  
        <p type="p">132:第二端部</p>  
        <p type="p">133:中間部</p>  
        <p type="p">14:第一傳動臂</p>  
        <p type="p">141:第一轉動端</p>  
        <p type="p">142:第一傳動端</p>  
        <p type="p">15:第二傳動臂</p>  
        <p type="p">151:第二轉動端</p>  
        <p type="p">152:第二傳動端</p>  
        <p type="p">16:第一連動臂</p>  
        <p type="p">161:第一配合端</p>  
        <p type="p">162:第一連動端</p>  
        <p type="p">17:第二連動臂</p>  
        <p type="p">171:第二配合端</p>  
        <p type="p">172:第二連動端</p>  
        <p type="p">18:第一動力源</p>  
        <p type="p">19:第二動力源</p>  
        <p type="p">2:待刷物件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2844" publication-number="202626256"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626256.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高產量拋光模組以及模組化拋光系統</chinese-title>  
        <english-title>HIGH THROUGHPUT POLISHING MODULES AND MODULAR POLISHING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260319B">B24B37/00</main-classification>  
        <further-classification edition="202601120260319B">H10P72/00</further-classification>  
        <further-classification edition="202601120260319B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗加拉賈　傑更</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANGARAJAN, JAGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈魯波司奇　艾德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLUBOVSKY, EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古魯薩米　傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURUSAMY, JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努尼佳　史帝文Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUNIGA, STEVEN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文的實施例包括高產量密度化學機械拋光（CMP）模組和由所述模組形成的可定制模組化CMP系統。在一個實施例中，拋光模組以載具支撐模組、載具裝載站、和拋光站為特徵。載具支撐模組以載具平臺和一個或多個載具元件為特徵。一個或多個載具元件各自包含從載具平臺懸掛的對應承載頭。載具裝載站用於將基板傳送到承載頭和從承載頭傳送基板。拋光站包含拋光壓板。在每個拋光模組內，載具支撐模組、基板裝載站、和拋光站包含一對一對一關聯性。載具支撐模組定位為在設置在拋光壓板上方的基板拋光位置與設置在基板裝載站上方的基板傳送位置之間移動一個或多個載具元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loading station, and a polishing station. The carrier support module features a carrier platform and one or more carrier assemblies. The one or more carrier assemblies each comprise a corresponding carrier head suspended from the carrier platform. The carrier loading station is used to transfer substrates to and from the carrier heads. The polishing station comprises a polishing platen. The carrier support module, the substrate loading station, and the polishing station comprise a one-to-one-to-one relationship within each of the polishing modules. The carrier support module is positioned to move the one or more carrier assemblies between a substrate polishing position disposed above the polishing platen and a substrate transfer position disposed above the substrate loading station.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:拋光模組</p>  
        <p type="p">111:直立支撐件</p>  
        <p type="p">112:桌面</p>  
        <p type="p">115:面板</p>  
        <p type="p">120:載具支撐模組</p>  
        <p type="p">121:支撐軸件</p>  
        <p type="p">123:載具平臺</p>  
        <p type="p">124:開口</p>  
        <p type="p">130:載具元件</p>  
        <p type="p">130a:第一載具元件</p>  
        <p type="p">130b:第二載具元件</p>  
        <p type="p">131:承載頭</p>  
        <p type="p">132:載具軸件</p>  
        <p type="p">151:壓板</p>  
        <p type="p">152:拋光墊</p>  
        <p type="p">155:墊調節器臂</p>  
        <p type="p">156:致動器</p>  
        <p type="p">157:墊調節器</p>  
        <p type="p">158:柵欄</p>  
        <p type="p">159:排水槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2845" publication-number="202628949"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628949.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸盤、微影裝置、基板台、頂板以及物品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P76/00</main-classification>  
        <further-classification edition="202601120260323B">H10P72/70</further-classification>  
        <further-classification edition="200601120260323B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神谷重雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYA, SHIGEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種吸盤，係受頂板支承，並支承基板；其特徵為：前述吸盤，係具備：基台，係具有與前述基板對向之表面，及與前述表面為相反側之裏面；裏面隔壁，係設於前述裏面；以及複數個裏面銷，係設於前述裏面，並相接於前述頂板；前述複數個裏面銷，係包含：複數個第1銷，係配置於前述裏面隔壁之內側，並沿著前述裏面隔壁以等間隔配置；前述裏面隔壁之高度，係比前述複數個裏面銷之高度更低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108:基板</p>  
        <p type="p">112:吸盤</p>  
        <p type="p">114:頂板</p>  
        <p type="p">202:基台</p>  
        <p type="p">204:表面隔壁</p>  
        <p type="p">206:表面銷</p>  
        <p type="p">208:裏面隔壁</p>  
        <p type="p">210:裏面銷</p>  
        <p type="p">210a:裏面銷</p>  
        <p type="p">251:表面</p>  
        <p type="p">252:裏面</p>  
        <p type="p">299:異物</p>  
        <p type="p">411:支承面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2846" publication-number="202626827"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626827.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二部分灌封組成物</chinese-title>  
        <english-title>TWO-PART POTTING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C08G18/10</main-classification>  
        <further-classification edition="200601120251231B">C09K3/12</further-classification>  
        <further-classification edition="201701120251231B">A61K47/44</further-classification>  
        <further-classification edition="200601120251231B">C08J9/08</further-classification>  
        <further-classification edition="202101120251231B">H01M50/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＨＫ文沃斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>H. K. WENTWORTH LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里希南　阿南德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAN, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金納　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINNER, PHILLIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫哈帕特拉　蘇巴吉亞蘭詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAPATRA, SOUBHAGYA RANJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里巴斯　莫加納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIBAS, MORGANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙克蒂維魯　帕德馬納巴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAKTHIVELU, PADMANABHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種二部分灌封組成物，其包含：A部分，其包含：第一多元醇流份、包含芳族醇的反應性稀釋劑、及水；及B部分，其包含聚異氰酸酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A two-part potting composition comprising: an A part comprising: a first polyol fraction, a reactive diluent comprising an aromatic alcohol, and water; and a B part comprising a polyisocyanate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2847" publication-number="202628427"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628427.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影片編解碼方法和用於影片編解碼的裝置</chinese-title>  
        <english-title>METHODS AND APPARATUS OF VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260305B">H04N19/593</main-classification>  
        <further-classification edition="201401120260305B">H04N19/117</further-classification>  
        <further-classification edition="201401120260305B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃毓文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明披露了一種使用重疊邊界處理進行混合幀內預測的影片編解碼方法和設備。根據該方法，對當前塊應用幀內預測混合過程（Intra Prediction Blending Process）和重疊邊界細化過程（Overlapped Boundary Refinement Process）。是否在重疊邊界細化過程之前或之後對當前塊應用幀內預測混合過程是預定義的或根據一個或多個條件自適應確定的。導出精細化的最終預測元，且導出過程取決於是否在重疊邊界細化過程之前或之後對當前塊或當前子塊應用幀內預測混合過程。使用精細化的最終預測元對當前塊或當前子塊進行編碼或解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus of video coding using overlapped boundary processing for blended intra prediction are disclosed. According to this method, an intra prediction blending process and an overlapped boundary refinement process is applied to the current block. Whether the intra prediction blending process is applied to the current block before or after the overlapped boundary refinement process is pre-defined or is determined adaptively for the current block according to one or more conditions. A refined final predictor is derived and the derivation process is dependent on whether the intra prediction blending process is applied to the current block or the current subblock before or after the overlapped boundary refinement process. The current block or the current subblock is encoded or decoded using the refined final predictor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1610:步驟</p>  
        <p type="p">1620:步驟</p>  
        <p type="p">1630:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2848" publication-number="202627864"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627864.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種阻抗匹配的設計方法及裝置、可讀儲存媒體</chinese-title>  
        <english-title>A DESIGN METHOD AND APPARATUS FOR IMPEDANCE MATCHING, AND A COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260102B">G06F30/30</main-classification>  
        <further-classification edition="202001120260102B">G06F30/33</further-classification>  
        <further-classification edition="202001120260102B">G06F30/3308</further-classification>  
        <further-classification edition="200601120260102B">H05H1/36</further-classification>  
        <further-classification edition="200601120260102B">H01J37/32</further-classification>  
        <further-classification edition="202001320260102B">G06F111/10</further-classification>  
        <further-classification edition="202001320260102B">G06F119/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商環旭電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSAL SCIENTIFIC INDUSTRIAL(SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊仲哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHONGZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費紅艷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI, HONGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宓霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MI, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種阻抗匹配的設計方法及裝置、可讀儲存媒體，該方法包括：獲取一用於阻抗匹配的匹配網路的樣品，該樣品包含至少一可變元件；通過對樣品實測得到可變元件在有限個取值下對應的匹配網路的阻抗參數，並構建實測阻抗特性集合；根據實測阻抗特性集合確定體現匹配網路的阻抗參數與可變元件的取值之間關係的數學模型；根據數學模型預測符合阻抗匹配要求的可變元件的取值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a design method and apparatus for impedance matching, and a computer-readable storage medium. The method comprises: obtaining a sample of a matching network for impedance matching, the sample comprising at least one variable element; obtaining impedance parameters of the matching network at a limited number of values of the variable element through actual measurement of the sample, and constructing a set of measured impedance characteristics; determining, based on the set of measured impedance characteristics, a mathematical model that represents the relationship between the impedance parameters of the matching network and the values of the variable element; and predicting, based on the mathematical model, the value of the variable element that satisfies the impedance matching requirement.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2849" publication-number="202628425"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628425.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊編解碼方法和裝置</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260305B">H04N19/513</main-classification>  
        <further-classification edition="201401120260305B">H04N19/593</further-classification>  
        <further-classification edition="201401120260305B">H04N19/105</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱志堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIH-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊政彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種使用優化預測的視訊編碼方法和裝置。根據該方法，確定當前區塊的一個或多個模板。為模板中的模板樣本和當前區塊中的預測樣本確定位置相關權重（Position-Related Weights，簡稱 PRW）。每個PRW的權重依賴於模板中目標模板樣本的第一位置和/或當前區塊中每個預測樣本的第二位置。從由相應PRWs加權的模板差值的總和中推導出當前區塊中每個預測樣本的基於樣本的預測偏移（Sample-Based Prediction Offset，簡稱 SPO），其中模板差值基於模板樣本推導出。使用SPO來優化預測樣本以生成優化的預測樣本。藉由使用優化的預測樣本來編碼或解碼當前區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus of video coding using refined prediction are disclosed. According to the method, one or more templates of the current block are determined. Position-Related Weights (PRWs) are determined for template samples in a template and prediction samples in the current block. Each weight of PRWs is dependent on a first position of a target template sample in the template and/or a second position of each of the prediction samples in the current block. An SPO (Sample-Based Prediction Offset) is derived for each of the prediction samples in the current block from a sum of template differences weighted by respective PRWs, wherein the template differences are derived based on the template samples. The prediction samples are refined using the SPO to generate refined prediction samples. The current block is encoded or decoded by using the refined prediction samples.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">410:步驟</p>  
        <p type="p">420:步驟</p>  
        <p type="p">430:步驟</p>  
        <p type="p">440:步驟</p>  
        <p type="p">450:步驟</p>  
        <p type="p">460:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2850" publication-number="202627159"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627159.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學氣相沉積裝置</chinese-title>  
        <english-title>CHEMICAL VAPOR DEPOSITION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/32</main-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="200601120260302B">C23C16/458</further-classification>  
        <further-classification edition="202601120260302B">H10P14/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＴＥＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TES CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承俱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEOUNG-GU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種化學氣相沉積裝置，更詳細地，係有關一種當在基板沉積碳化矽（SiC）膜等時，可以提高被安放基板的基座的溫度均勻度的化學氣相沉積裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:腔體</p>  
        <p type="p">110:容納空間</p>  
        <p type="p">200:氣體供應部</p>  
        <p type="p">210:供應口</p>  
        <p type="p">220:氣體流入管</p>  
        <p type="p">300:內腔體</p>  
        <p type="p">310:上板</p>  
        <p type="p">312:處理空間</p>  
        <p type="p">320:基座</p>  
        <p type="p">321:主體部</p>  
        <p type="p">324:第一翼部</p>  
        <p type="p">325:第二翼部</p>  
        <p type="p">326:衛星盤</p>  
        <p type="p">330:基座組件</p>  
        <p type="p">340:加熱器</p>  
        <p type="p">350:蓋體</p>  
        <p type="p">400:氣體排出管</p>  
        <p type="p">512,514:支承桿</p>  
        <p type="p">513,515:延伸部</p>  
        <p type="p">524:第一支承部</p>  
        <p type="p">525:第二支承部</p>  
        <p type="p">1000:化學氣相沉積裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2851" publication-number="202626947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>片狀樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C08L63/02</main-classification>  
        <further-classification edition="200601120260320B">C08L63/04</further-classification>  
        <further-classification edition="200601120260320B">C08L33/04</further-classification>  
        <further-classification edition="200601120260320B">C08G59/18</further-classification>  
        <further-classification edition="201801120260320B">C09D7/45</further-classification>  
        <further-classification edition="200601120260320B">C08K3/22</further-classification>  
        <further-classification edition="200601120260320B">C08K7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐澤真義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARASAWA, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤友宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本皓史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種操作性與低溫保管穩定性均良好的片狀樹脂組成物。一種片狀樹脂組成物，包含環氧樹脂、酚系硬化劑、無機粒子及溶劑，並滿足以下的式（1）。 &lt;br/&gt;&lt;br/&gt;15.6≦S×M≦75.0  …（1） &lt;br/&gt;&lt;br/&gt;此處，S為所述溶劑的含量（質量%），M為於所述片狀樹脂組成物的藉由GPC測定而獲得的分子量分佈曲線中將所有峰面積設為100%時的聚苯乙烯換算分子量為120以上且600以下的範圍的面積比例（%）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2852" publication-number="202626604"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626604.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性組成物、像素之製造方法、膜、濾光器、固體攝像元件及圖像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D209/88</main-classification>  
        <further-classification edition="200601120260401B">C08F2/38</further-classification>  
        <further-classification edition="200601120260401B">C08F2/44</further-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/027</further-classification>  
        <further-classification edition="200601120260401B">G03F7/031</further-classification>  
        <further-classification edition="200601120260401B">G03F7/038</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G02B5/20</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1335</further-classification>  
        <further-classification edition="200601120260401B">G09F9/30</further-classification>  
        <further-classification edition="202301120260401B">H10K50/11</further-classification>  
        <further-classification edition="202301120260401B">H10K50/86</further-classification>  
        <further-classification edition="202301120260401B">H10K59/122</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野修史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光硬化性組成物、使用前述光硬化性組成物之像素之製造方法、膜、濾光器、固體攝像元件及圖像顯示裝置，上述光硬化性組成物包含光聚合起始劑、聚合性化合物、色材、樹脂及聚合抑制劑，上述光聚合起始劑包含由式（1）表示之化合物，上述樹脂包含具有酸基之樹脂。 &lt;br/&gt;&lt;img align="absmiddle" height="199px" width="407px" file="ed10059.JPG" alt="ed10059.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2853" publication-number="202628845"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628845.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨墊、研磨方法及製造研磨墊的方法</chinese-title>  
        <english-title>POLISHING PAD, POLISHING METHOD, AND METHOD OF MANUFACTURING POLISHING PAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P52/00</main-classification>  
        <further-classification edition="201201120260323B">B24B37/26</further-classification>  
        <further-classification edition="202601120260323B">H10P95/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野村祥太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMURA, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古川匠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松宏彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬川将太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGAWA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望月健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOCHIZUKI, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了研磨墊、研磨方法及製造研磨墊的方法。該研磨墊在研磨速率方面優異，並且在研磨速率的維持性方面也優異。研磨墊具有氣泡面積比率最大的表面。在氣泡面積比率最大的表面中，由多個氣泡衍生的凹部的開口的平均長寬比為1.00或更大且為2.00或更小。在氣泡面積比率最大的表面中，由每單位面積的多個氣泡衍生的凹部的開口的面積等效圓直徑的總值為9.0 mm/mm&lt;sup&gt;2&lt;/sup&gt;或更大且為61.0 mm/mm&lt;sup&gt;2&lt;/sup&gt;或更小。在氣泡面積比率最大的表面中，氣泡面積比率為55面積%或更大且為95面積%或更小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a polishing pad, which is excellent in polishing rate and also excellent in maintainability of the polishing rate. The polishing pad has a surface where a bubble area ratio is maximum. The average aspect ratio of the openings of recesses derived from a plurality of bubbles in the surface where the bubble area ratio is maximum is 1.00 or more and 2.00 or less. The total value of the area-equivalent circle diameters of the openings of the recesses derived from the plurality of bubbles per unit area in the surface where the bubble area ratio is maximum is 9.0 mm/mm&lt;sup&gt;2&lt;/sup&gt; or more and 61.0 mm/mm&lt;sup&gt;2&lt;/sup&gt; or less. The bubble area ratio in the surface where the bubble area ratio is maximum is 55 area% or more and 95 area% or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:凹部</p>  
        <p type="p">2:開口</p>  
        <p type="p">3:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2854" publication-number="202627593"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627593.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>投影鏡頭</chinese-title>  
        <english-title>PROJECTION LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260105B">G02B11/04</main-classification>  
        <further-classification edition="200601120260105B">G02B9/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>揚明光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUNG OPTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張碩傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHUO-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUO-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種投影鏡頭包括從放大側到縮小側的第一透鏡組、光圈與第二透鏡組。第一透鏡組包括4~5片透鏡且包括一非球面透鏡。第二透鏡組包括5~6片透鏡，包括一膠合透鏡，且包括一非球面透鏡，設於最靠近縮小側的位置。投影鏡頭滿足以下條件：(1)景深範圍為EFL/D，其中EFL為該投影鏡頭的有效焦距，D為投影鏡頭最靠近放大側的透鏡表面到最靠近該縮小側的透鏡表面在光軸上的距離，而該景深範圍為 0.075 ~ 0.19 (2)投影鏡頭所有透鏡中的任二片透鏡間距離為固定不變的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A projection lens includes a first lens group, an aperture stop and a second lens group arranged in order from a magnified side to a minified side of the projection lens. The first lens group includes four or five lenses, and the four or five lenses include a first aspheric lens. The second lens group includes five or six lenses, the five or six lenses include a cemented doublet and a second aspheric lens, and the second aspheric lens is located at a position closest to the minified side. The projection lens satisfies the following conditions: (1) a depth of field range is defined by EFL/D, where EFL is an effective focal length of the projection lens, and D is a distance measured on an optical axis of the projection lens between a lens surface of the projection lens closest to the magnified side and a lens surface of the projection lens closest to the minified side, and the depth of field range is in a range between 0.075 and 0.19; and (2) an axial distance between any pair of lenses in the projection lens remains constant during operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10a:投影鏡頭</p>  
        <p type="p">12:光軸</p>  
        <p type="p">14:光圈</p>  
        <p type="p">16:影像源(發光面)</p>  
        <p type="p">20:第一透鏡組</p>  
        <p type="p">30:第二透鏡組</p>  
        <p type="p">L1-L10:第一透鏡-第十透鏡</p>  
        <p type="p">S1-S21:表面</p>  
        <p type="p">OS:放大側</p>  
        <p type="p">IS:縮小側</p>  
        <p type="p">CG:保護蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2855" publication-number="202626831"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626831.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149950</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性組成物、硬化物、光學材料及硬化物的製造方法</chinese-title>  
        <english-title>PHOTOCURABLE COMPOSITION, CURED PRODUCT, OPTICAL MATERIAL, AND METHODS FOR PRODUCING CURED PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08G18/38</main-classification>  
        <further-classification edition="200601120260302B">C08G18/75</further-classification>  
        <further-classification edition="200601120260302B">C08L75/04</further-classification>  
        <further-classification edition="200601120260302B">C08K5/103</further-classification>  
        <further-classification edition="200601120260302B">C08K5/3462</further-classification>  
        <further-classification edition="200601120260302B">G02B1/04</further-classification>  
        <further-classification edition="200601120260302B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉元祐熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMOTO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里貝羅　奈傑爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIBEIRO, NIGEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光硬化性組成物，含有光鹼產生劑（a）、聚異(硫代)氰酸酯化合物（b）、聚硫醇化合物（c）、以及二(甲基)丙烯酸酯化合物（d），光鹼產生劑（a）包含選自由式（1）～式（5）所表示的化合物所組成的群組中的至少一種。R&lt;sub&gt;1&lt;/sub&gt;～R&lt;sub&gt;11&lt;/sub&gt;為取代基，n為1～3的整數。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="263px" width="568px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2856" publication-number="202626864"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626864.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子零件包覆片、積層片及電子零件搭載基板</chinese-title>  
        <english-title>ELECTRONIC COMPONENT COATING SHEET, LAMINATED SHEET, AND ELECTRONIC COMPONENT MOUNTING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260304B">C08G71/04</main-classification>  
        <further-classification edition="200601120260304B">H05K3/28</further-classification>  
        <further-classification edition="200601120260304B">B32B27/08</further-classification>  
        <further-classification edition="200601120260304B">B32B27/28</further-classification>  
        <further-classification edition="201901120260304B">B32B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安東健次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松戸和規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDO, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可形成再加工性及常溫下的密接性優異的包覆層的電子零件包覆片、積層片以及具有所述包覆層的電子零件搭載基板。本揭示的電子零件包覆片為用於形成電子零件搭載基板10的包覆層3的電子零件包覆片，所述電子零件搭載基板10包括基板1、電子零件2、以及覆蓋電子零件2及基板1的至少一部分的包覆層3，（i）將所述電子零件包覆片與聚醯亞胺基材接合後的硬化物於25℃下的藉由180度撕離剝離而測定的接著力為2.0 N/cm以上，進而（ii）將所述電子零件包覆片與聚醯亞胺基材接合後的硬化物於25℃下的藉由180度撕離剝離而測定的接著力設為A[N/cm]，將該電子零件包覆片的硬化物於Tg+40℃下的藉由180度撕離剝離而測定的接著力設為B[N/cm]時，滿足0.15＜B/A＜0.85的關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:電子零件</p>  
        <p type="p">3:包覆層</p>  
        <p type="p">10:電子零件搭載基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2857" publication-number="202626067"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626067.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脂蛋白Ａ降低療法</chinese-title>  
        <english-title>LIPOPROTEIN A LOWERING THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/713</main-classification>  
        <further-classification edition="201001120260401B">C12N15/113</further-classification>  
        <further-classification edition="200601120260401B">A61P3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商諾華公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVARTIS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬葛洛斯　薇薇安　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORGOUSIS, VIVIAN CHRISTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭迪　席琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANDIE, CELINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於用於對需要Lp(a)降低療法的受試者、例如具有升高的Lp(a)並且正在接受或將要接受針對升高的LDL-C的PCSK9抑制劑（例如，抑脂擾核酸）療法的受試者進行治療的Lp(a)抑制劑，例如培拉卡森。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to Lp(a) inhibitors such as pelacarsen for the treatment of subjects in need of Lp(a) lowering therapy, for example subjects having elevated Lp(a), and who is receiving or who is to receive PCSK9 inhibitor (e.g., inclisiran) therapy for elevated LDL-C.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2858" publication-number="202627245"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627245.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於從柴可斯基晶體提拉系統中提拉晶體的裝置和方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR PULLING A CRYSTAL FROM A CZOCHRALSKI CRYSTAL PULLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C30B15/30</main-classification>  
        <further-classification edition="202601120260302B">H10P14/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商世創電子材料公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILTRONIC AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科恩　阿洛伊斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KERN, ALOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密德　羅爾夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMID, ROLF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於從柴可斯基晶體提拉系統中提拉晶體的裝置，包含以下元件：（a）晶體生長腔室（101），（b）第一腔室（102），其上端設有旋轉和抬升單元（103），並且該第一腔室（102）的尺寸使得經提拉的晶體（106）能夠被完全容納，其中該第一腔室（102）和該晶體生長腔室（101）能夠藉由可釋放的連接件（112）連接，並且其中該第一腔室（102）具有可水平樞轉的安裝件，（c）封閉元件，其能夠封閉第一腔室（102）的下端，（d）第二腔室（108），其被佈置成平行於該第一腔室（102）並且具有可水平樞轉的安裝件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for pulling a crystal from a Czochralski crystal pulling system, comprising the following elements: (a) a crystal growth chamber (101), (b) a first chamber (102) provided with a rotating and lifting unit (103) at the upper end, and the dimensions of the first chamber (102) are such that a pulled crystal (106) can be accommodated in full, wherein the first chamber (102) and the crystal growth chamber (101) can be connected by a releasable connection (112) and wherein the first chamber (102) has a horizontally pivotable mount, (c) a closure element capable of closing the lower end of the first chamber (102), (d) a second chamber (108) which is arranged parallel to the first chamber (102) and has a horizontally pivotable mount.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:晶體生長腔室</p>  
        <p type="p">102:第一腔室</p>  
        <p type="p">103:旋轉和抬升單元</p>  
        <p type="p">104:熔體</p>  
        <p type="p">105:提拉期間的晶體</p>  
        <p type="p">106:經提拉的晶體</p>  
        <p type="p">107:抬升單元</p>  
        <p type="p">108:第二腔室</p>  
        <p type="p">109:熱遮罩件</p>  
        <p type="p">110:矽填充的石英容器</p>  
        <p type="p">111:空的石英容器</p>  
        <p type="p">112:可釋放的連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2859" publication-number="202626068"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626068.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制3-羥基-3-甲基戊二醯-CoA還原酶（HMGCR）表達的組合物和方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR INHIBITING EXPRESSION OF 3-HYDROXY-3-METHYLGLUTARYL-COA REDUCTASE (HMGCR)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/713</main-classification>  
        <further-classification edition="201001120260401B">C12N15/113</further-classification>  
        <further-classification edition="200601120260401B">A61P3/06</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海舶望製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI ARGO BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒東旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, DONGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵　鵬程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, PENGCHENG PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路　明踐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MINGJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用於降低3-羥基-3-甲基戊二醯-CoA還原酶（HMGCR）基因的表達和用於治療HMGCR相關疾病和病症的組合物和方法。提供了可用於降低細胞和受試者的HMGCR表達的HMGCR dsRNA藥劑、HMGCR反義多核苷酸藥劑、包含HMGCR dsRNA藥劑的組合物和包含HMGCR反義多核苷酸藥劑的組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compositions and methods useful to reduce expression of 3-hydroxy-3-methylglutaryl-CoA reductase (HMGCR) gene and for treatment of HMGCR-associated diseases and conditions are provided. Provided are HMGCR dsRNA agents, HMGCR antisense polynucleotide agents, compositions comprising HMGCR dsRNA agents, and compositions comprising HMGCR antisense polynucleotide agents that can be used to reduce HMGCR expression in cells and subjects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2860" publication-number="202627725"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627725.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150067</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體控制裝置、存儲介質及流體控制裝置的診斷方法</chinese-title>  
        <english-title>FLUID CONTROL APPARATUS, STORAGE MEDIUM, AND DIAGNOSTIC METHOD FOR A FLUID CONTROL APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">G05D7/06</main-classification>  
        <further-classification edition="200601120260224B">G01F1/34</further-classification>  
        <further-classification edition="200601120260224B">G05B23/00</further-classification>  
        <further-classification edition="202201120260224B">G01F25/10</further-classification>  
        <further-classification edition="200601120260224B">G01M3/28</further-classification>  
        <further-classification edition="200601120260224B">G01L27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBA STEC, CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德永和彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUNAGA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋口世治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGUCHI, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧尻興太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIJIRI, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供流體控制裝置，所述流體控制裝置（100）具備：第二流量計算部（431），根據關閉了流體控制閥（32）的狀態下的上游側壓力（P1）或下游側壓力（P2）隨時間的變化，計算出流過流體阻力器（33）的流量；以及診斷用參數計算部（432），根據在關閉了流體控制閥（32）的狀態下由第一流量計算部（41）計算出的第一流量以及由第二流量計算部（431）計算出的第二流量，計算出診斷用參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fluid control apparatus 100 is provided with a second flow rate calculation unit 431 that calculates a flow rate flowing through a fluid resistor 33 based on a change over time in an upstream-side pressure P1 or a downstream-side pressure P2 in a state in which a fluid control valve 32 is closed, and with a diagnostic parameter calculation unit 432 that calculates a diagnostic parameter based on a first flow rate calculated by a first flow rate calculation unit 431, and on a second flow rate calculated by the second flow rate calculation unit 432 in a state in which the fluid control valve 32 is closed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:流體控制裝置</p>  
        <p type="p">2:流道塊</p>  
        <p type="p">2R:內部流道</p>  
        <p type="p">21:導入口</p>  
        <p type="p">22:導出口</p>  
        <p type="p">3:流體控制設備</p>  
        <p type="p">31:壓力感測器</p>  
        <p type="p">31a:上游側壓力感測器</p>  
        <p type="p">31b:下游側壓力感測器</p>  
        <p type="p">32:流體控制閥</p>  
        <p type="p">33:流體阻力器</p>  
        <p type="p">4:計算控制裝置</p>  
        <p type="p">41:第一流量計算部</p>  
        <p type="p">42:閥控制部</p>  
        <p type="p">43:診斷機構</p>  
        <p type="p">431:第二流量計算部</p>  
        <p type="p">432:診斷用參數計算部</p>  
        <p type="p">433:診斷部</p>  
        <p type="p">434:閥洩漏壓力變化模型製作部</p>  
        <p type="p">435:閥洩漏差分計算部</p>  
        <p type="p">436:感測器偏移壓力變化模型製作部</p>  
        <p type="p">437:感測器偏移差分計算部</p>  
        <p type="p">P1:上游側壓力</p>  
        <p type="p">P2:下游側壓力</p>  
        <p type="p">Q1:第一流量</p>  
        <p type="p">Q2:第二流量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2861" publication-number="202626172"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626172.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>霧捕集裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260127B">B01D50/00</main-classification>  
        <further-classification edition="202201120260127B">B01D46/00</further-classification>  
        <further-classification edition="200601120260127B">F24F7/06</further-classification>  
        <further-classification edition="200601120260127B">F24F13/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋雄汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山岸智和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGISHI, TOMOKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的霧捕集裝置即使在風扇的安裝狀態不正確的情況下運轉，也能夠防止過濾器用馬達的馬達軸與過濾器的軸插通孔咬住，並且能夠防止過濾器與其他部件接觸並破損，而且能夠維持基於風扇的排出功能。該霧捕集裝置具備：通過風扇用馬達旋轉的風扇、和通過使過濾器用馬達的馬達軸插通於軸插通孔來安裝的過濾器，若被輸入運轉開始，則通過過濾器安裝狀態判斷單元判斷過濾器的安裝狀態，在過濾器安裝狀態判斷單元判斷為過濾器不是正確的安裝狀態的情況下，控制部使過濾器不通過過濾器用馬達旋轉，並且使風扇通過風扇用馬達繼續旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:風扇</p>  
        <p type="p">11:風扇用馬達</p>  
        <p type="p">12:過濾器</p>  
        <p type="p">13:過濾器用馬達</p>  
        <p type="p">13a:馬達軸</p>  
        <p type="p">17:開關</p>  
        <p type="p">20:電源</p>  
        <p type="p">21:風扇用馬達驅動部</p>  
        <p type="p">22:過濾器用馬達驅動部</p>  
        <p type="p">23:控制部</p>  
        <p type="p">24:輸入部</p>  
        <p type="p">24a:運轉開始輸入部</p>  
        <p type="p">24b:運轉停止輸入部</p>  
        <p type="p">25:過濾器安裝狀態判斷單元</p>  
        <p type="p">26:報告單元</p>  
        <p type="p">27:儲存部</p>  
        <p type="p">30:強運轉開始輸入部</p>  
        <p type="p">31:中運轉開始輸入部</p>  
        <p type="p">32:弱運轉開始輸入部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2862" publication-number="202626974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有熱塑性塗層之多孔基材的回收方法</chinese-title>  
        <english-title>RECYCLING METHOD OF A POROUS SUBSTRATE WITH A THERMOPLASTIC COATING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260309B">C08L101/16</main-classification>  
        <further-classification edition="200601120260309B">C08J9/42</further-classification>  
        <further-classification edition="200601120260309B">C08J11/08</further-classification>  
        <further-classification edition="202001120260309B">C08J7/05</further-classification>  
        <further-classification edition="200601120260309B">C09D101/00</further-classification>  
        <further-classification edition="200601120260309B">C09D5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商布萊特普盧斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHTPLUS OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希塔拉　邁朱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIETALA, MAIJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬基馬蒂　奧斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKIMARTTI, OSKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瓦賈　伊斯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUVAJA, ISTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬林　圖伊爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARIN, TUIRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩斯基　亞爾莫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAASKI, JARMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢努　庫雷　米利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNU-KUURE, MILJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊沃　亞爾科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEIVO, JARKKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種回收塗覆有熱塑性塗層組成物的多孔基材的方法。該方法包括切碎經塗覆的多孔基材、溶解塗層組成物、以及分離經溶解的塗層組成物和基材的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention concerns a method for recycling a porous substrate coated with a thermoplastic coating composition. The method comprises the steps of shredding the coated porous substrate, dissolving the coating composition, and separating the dissolved coating composition and the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2863" publication-number="202629052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有不規則晶粒周邊以提升邊緣輸入/輸出容量之電子元件</chinese-title>  
        <english-title>ELECTRONIC DEVICE WITH IRREGULAR DIE PERIMETER FOR INCREASED BEACHFRONT INPUT/OUTPUT CAPACITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10W80/00</main-classification>  
        <further-classification edition="202601120260317B">H10W70/654</further-classification>  
        <further-classification edition="202601120260317B">H10W70/65</further-classification>  
        <further-classification edition="202501120260317B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商馬維爾亞洲私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARVELL ASIA PTE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊克洛　卡津　西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLACKLOW, KAZIN SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑德溫　扎卡里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALDWIN, ZACHARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索特　沃爾夫岡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAUTER, WOLFGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子元件(20)包含一基板(10、31)及形成於該基板上方之一半導體晶粒(11、35、36、37、38、45)，該半導體晶粒包含：(ⅰ)一核心區(21)，其至少含有邏輯電路系統；及(ⅱ)一邊緣區(22、33、47)，其包圍該核心區之至少部分，該邊緣區包含經組態以在該核心區與至少一外部元件之間交換信號之複數個介面電路，且該半導體晶粒具有一不規則周邊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device (20) includes a substrate (10, 31) and a semiconductor die (11, 35, 36, 37, 38, 45) formed over the substrate, the semiconductor die includes: (i) a core region (21) containing at least logic circuitry, and (ii) a beachfront region (22, 33, 47) surrounding at least part of the core region, the beachfront region includes a plurality of interface circuits configured to exchange signals between the core region and at least an external device, and the semiconductor die has an irregular perimeter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">11:半導體晶粒</p>  
        <p type="p">12:中心區段</p>  
        <p type="p">13:區段</p>  
        <p type="p">14:區段</p>  
        <p type="p">15:區段</p>  
        <p type="p">16:區段</p>  
        <p type="p">17:插圖</p>  
        <p type="p">18:插圖</p>  
        <p type="p">20:電子元件</p>  
        <p type="p">21:核心區</p>  
        <p type="p">22:邊緣區/邊緣</p>  
        <p type="p">22a:片段</p>  
        <p type="p">22b:片段</p>  
        <p type="p">22c:片段</p>  
        <p type="p">22e:片段</p>  
        <p type="p">22f:片段</p>  
        <p type="p">23:介面電路</p>  
        <p type="p">24:介面電路</p>  
        <p type="p">25:介面電路</p>  
        <p type="p">26:尺寸</p>  
        <p type="p">27:尺寸</p>  
        <p type="p">28:尺寸</p>  
        <p type="p">29a:端子</p>  
        <p type="p">29b:端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2864" publication-number="202626775"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626775.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載氧體材料及其製造方法、以及二氧化碳還原系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260107B">C08F4/26</main-classification>  
        <further-classification edition="200601120260107B">C01G49/02</further-classification>  
        <further-classification edition="200601120260107B">B01J20/06</further-classification>  
        <further-classification edition="200601120260107B">B01J21/06</further-classification>  
        <further-classification edition="200601120260107B">B01J23/745</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東京科學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩田有波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOTA, ARUFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>内藤皓貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAITO, TERUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大友順一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOMO, JUNICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露的載氧體材料，其為可將二氧化碳改質成一氧化碳之包含載氧體及擔體的載氧體材料，在前述載氧體使用氧化鐵，且在前述擔體使用鐵摻雜鈣鈦酸鹽。上述載氧體材料的製造方法包含生成前述擔體的第一步驟、以及使用前述擔體生成前述載氧體材料的第二步驟，在前述第一步驟中，加熱氧化鐵、碳酸鈣及氧化鈦的混合物，以生成鐵摻雜鈣鈦酸鹽，在前述第二步驟中，加熱前述鐵摻雜鈣鈦酸鹽與氧化鐵的混合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201~S207:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2865" publication-number="202627878"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627878.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>去識別化裝置及方法</chinese-title>  
        <english-title>DE-IDENTIFICATION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260202B">G06F40/295</main-classification>  
        <further-classification edition="202001120260202B">G06F40/284</further-classification>  
        <further-classification edition="202301120260202B">G06N3/045</further-classification>  
        <further-classification edition="201301120260202B">G06F21/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周昕妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HSIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHEN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭宇劭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YU-SHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種去識別化裝置及方法。該裝置儲存一語言模型。該裝置由該語言模型產生對應一待處理資料之複數個詞元。該裝置由該語言模型基於一起始特殊標記及一結束特殊標記，標記該等詞元中的一目標詞元，以產生對應該待處理資料之一標記資料，其中該目標詞元對應至一個人資訊。該裝置基於該標記資料中之該起始特殊標記及該結束特殊標記，替換該標記資料中之該目標詞元，以產生對應該待處理資料之一去識別化資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A de-identification device and method are provided. The device stores a language model. The device generates a plurality of tokens corresponding to to-be-processed data using the language model. Based on a begin special tag and an end special tag, the device tags a target token among the tokens to generate a tagged data corresponding to the to-be-processed data, and the target token corresponds to a personal information. Based on the begin special tag and the end special tag in the tagged data, the device replaces the target token in the tagged data to generate de-identified data corresponding to the to-be-processed data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:去識別化方法</p>  
        <p type="p">S601、S603、S605:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2866" publication-number="202627665"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627665.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150196</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於校正具有非均質材料特性的光學元件的方法與設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR CORRECTING AN OPTICAL ELEMENT WITH INHOMOGENEOUS MATERIAL PROPERTIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260302B">G03F1/72</main-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商卡爾蔡司ＳＭＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾賈拉特　阿斯昆斯　阿爾貝托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELJARRAT ASCUNCE, ALBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　卓爾　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DRIEL, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德米特里耶夫　瓦拉帝米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DMITRIEV, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏拉芙　喬納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMLAUFT, JONAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西賽博格　馬克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種用於校正光罩基板誤差的方法700、電腦程式和設備400，其使用施加在光罩基板上複數個位置處的複數個雷射脈衝。該方法包括：接收720光罩基板的折射率圖；接收730光罩基板誤差資訊；以及決定740複數個雷射脈衝及/或複數個位置的每個脈衝及/或位置的至少一個第一雷射參數，其中該決定是基於折射率圖和光罩基板誤差資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method 700, a computer program, and an apparatus 400 for correcting an error of a mask substrate using a plurality of laser pulses applied on a plurality of positions on the mask substrate is provided.</p>  
        <p type="p">The method comprises:</p>  
        <p type="p">receiving 720 a refractive index map of the mask substrate,</p>  
        <p type="p">receiving 730 mask substrate error information,</p>  
        <p type="p">determining 740 at least one first laser parameter for each of the plurality of laser pulses and/or the plurality of positions,</p>  
        <p type="p">wherein the determining is based on the refractive index map and the mask substrate error information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:折射率圖</p>  
        <p type="p">400:設備</p>  
        <p type="p">410:光罩基板</p>  
        <p type="p">420:卡盤/夾頭</p>  
        <p type="p">430:雷射源</p>  
        <p type="p">435:雷射脈衝</p>  
        <p type="p">440:聚焦物鏡/物鏡</p>  
        <p type="p">445:二向色鏡</p>  
        <p type="p">460:電腦系統</p>  
        <p type="p">465:相機/用於接收折射率圖的構件</p>  
        <p type="p">466:用於接收光罩誤差資訊的構件</p>  
        <p type="p">480:控制器</p>  
        <p type="p">490:轉向鏡或轉向系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2867" publication-number="202626788"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626788.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光阻下層膜形成用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F20/36</main-classification>  
        <further-classification edition="200601120260401B">G03F7/11</further-classification>  
        <further-classification edition="200601120260401B">G03F7/40</further-classification>  
        <further-classification edition="202601120260401B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤祐希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可在改善敏感度之同時形成良好光阻圖案之光阻下層膜形成用組成物等。 &lt;br/&gt;本發明之光阻下層膜形成用組成物，係含有具有下述式（1）所表示之結構單元之聚合物（A）、及溶劑，且以前述聚合物（A）作為前述光阻下層膜形成用組成物的膜構成成分的主成分。 &lt;br/&gt;&lt;img align="absmiddle" height="273px" width="224px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（1）中，R&lt;sup&gt;1&lt;/sup&gt;表示氫原子或碳原子數1～10的烷基。R&lt;sup&gt;2&lt;/sup&gt;表示單鍵或伸烷基。R&lt;sup&gt;3&lt;/sup&gt;表示封端異氰酸酯基。）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2868" publication-number="202626948"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626948.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預浸體、積層板、覆金屬積層板、印刷線路板及半導體封裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C08L63/04</main-classification>  
        <further-classification edition="200601120260320B">C08L63/10</further-classification>  
        <further-classification edition="200601120260320B">C08G59/42</further-classification>  
        <further-classification edition="200601120260320B">C08G73/18</further-classification>  
        <further-classification edition="200601120260320B">C08J5/08</further-classification>  
        <further-classification edition="200601120260320B">B32B27/04</further-classification>  
        <further-classification edition="200601120260320B">B32B27/28</further-classification>  
        <further-classification edition="201901120260320B">B32B7/025</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>結城千晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKI, CHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本德彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, NORIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須藤恭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUTOU, KYOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>砂入允哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNAIRI, YOSHIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城野啓太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNO, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北嶋貴代</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAJIMA, TAKAYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種預浸體，其可表現優異的鑽孔加工性且能降低相對介電常數(Dk)。進一步，還提供使用該預浸體所製成之積層板、覆金屬積層板、印刷線路板及半導體封裝體。前述預浸體，具體而言為如下預浸體，其含有纖維基材，該預浸體依據說明書記載的測定方法所測出的線性熱膨脹係數為4.6～5.4 ppm/℃，依據說明書記載的測定方法所測出的介電損耗正切(Df)為0.0050～0.0070。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2869" publication-number="202625938"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625938.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>椅具</chinese-title>  
        <english-title>CHAIR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260130B">A47D1/02</main-classification>  
        <further-classification edition="200601120260130B">A47D1/04</further-classification>  
        <further-classification edition="200601120260130B">A47C7/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡問渠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, WENQU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提出了一種椅具，包括：座椅；支撐腿組，可支撐於支撐面上，該支撐腿組包括第一支撐腿組和第二支撐腿組，第一支撐腿組和第二支撐腿組均樞接於座椅並能夠在支腿展開位置與支腿收合位置之間轉換；以及收折機構，該收折機構包括：第一驅動件，活動地設置於座椅並且連接於第一支撐腿組，第一支撐腿組相對座椅的樞轉帶動第一驅動件相對座椅滑動；第二驅動件，活動地設置於座椅並且連接於第二支撐腿組，第二支撐腿組相對座椅的樞轉帶動第二驅動件相對座椅滑動；以及引導件，活動地設置於座椅並與第一驅動件和第二驅動件連動，用於引導第一驅動件和第二驅動件彼此靠近或彼此遠離，從而帶動第一支撐腿組和第二支撐腿組同步收合或展開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a chair including a seat, a supporting leg and a folding mechanism. The supporting leg set capable of being supported on a supporting surface includes a first supporting leg set and a second supporting leg set that are both pivotally connected to the seat and switchable between a leg unfolded position and a leg folded position. The folding mechanism includes: a first driving member movably disposed on the seat and connected to the first supporting leg set, which pivots relative to the seat to drive the first driving member to slide relative to the seat; a second driving member movably disposed on the seat and connected to the second supporting leg set, which pivots relative to the seat to drive the second driving member to slide relative to the seat; and a guiding member movably disposed on the seat and linked with the first driving member and the second driving member, which guide the first driving member and the second driving member to move close to or away from each other, thereby driving the first supporting leg set and the second supporting leg set to be folded or unfolded synchronously.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:阻擋肋</p>  
        <p type="p">112:框架</p>  
        <p type="p">1121:滑動槽</p>  
        <p type="p">300:收折機構</p>  
        <p type="p">311:第二齒條</p>  
        <p type="p">314:第二阻擋部</p>  
        <p type="p">315:導軌</p>  
        <p type="p">321:第一齒條</p>  
        <p type="p">324:第一阻擋部</p>  
        <p type="p">325:滑動部</p>  
        <p type="p">420:本體部</p>  
        <p type="p">4210:滑動凸起</p>  
        <p type="p">430:鎖定部</p>  
        <p type="p">431:第二鎖定部</p>  
        <p type="p">432:第一鎖定部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2870" publication-number="202626694"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626694.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有抗肥胖和抗糖尿病活性的肽及其醫藥與功能性食品組合物</chinese-title>  
        <english-title>PEPTIDE WITH ANTI-OBESITY AND ANTI-DIABETIC ACTIVITY AND PHARMACEUTICAL AND FUNCTIONAL FOOD COMPOSITIONS COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07K7/06</main-classification>  
        <further-classification edition="201901120260302B">A61K38/08</further-classification>  
        <further-classification edition="200601120260302B">A61P3/04</further-classification>  
        <further-classification edition="200601120260302B">A61P3/10</further-classification>  
        <further-classification edition="201601120260302B">A23L33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商凱爾格恩有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAREGEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鎔池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YONG JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金銀美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, EUN MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李應智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, EUNG JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>延政泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEON, JEONG TAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金先洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEON SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種具有抗肥胖和抗糖尿病活性的肽及其用途。本發明的肽可用於治療、預防和改善肥胖或糖尿病，並且可用於在需要血糖控制的人群中降低血糖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a peptide with anti-obesity and anti-diabetic activity and its use. The peptide of the present invention can used for the treatment, prevention, and improvement of the obesity or diabetes, and can be useful for lowering the blood sugar in persons in need of the blood sugar control.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2871" publication-number="202627094"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627094.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向PNPLA3的雙鏈核糖核酸</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="201701120260401B">A61K47/54</further-classification>  
        <further-classification edition="200601120260401B">A61P1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YONGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭佳佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JIAJIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛興楓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, XINGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧丹丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, DANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONGJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬於生物醫藥領域，涉及一種靶向PNPLA3的雙鏈核糖核酸（dsRNA）、其藥學上可接受的鹽、其配體綴合物、或藥物組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2872" publication-number="202627978"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627978.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150295</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖形處理方法和系統、計算設備和儲存媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06T1/20</main-classification>  
        <further-classification edition="200601120260202B">G06T1/60</further-classification>  
        <further-classification edition="201101120260202B">G06T15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商摩爾線程智能科技（北京）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提出了一種圖形處理方法和系統、計算設備和儲存媒體，所述系統包括至少兩個被賦能的圖形處理核心，並且每個圖形處理核心包括頂點拆分模組、頂點處理流水線模組、圖元處理流水線模組以及像素處理流水線模組。目標圖形處理核心的頂點拆分模組被配置成從頂點索引數據確定要被目標圖形處理核心處理的圖元包；頂點處理流水線模組被配置成對所述圖元包中的索引對應的頂點進行著色處理，以得到著色處理結果；圖元處理流水線模組被配置成獲取圖元構成資訊並基於所述圖元構成資訊對所述著色處理結果進行幾何處理，以得到幾何處理結果；像素處理流水線模組被配置成對所述幾何處理結果進行處理，以得到視覺化圖形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:圖形處理系統</p>  
        <p type="p">110、120、130:圖形處理核心</p>  
        <p type="p">111、121、131:頂點拆分模組</p>  
        <p type="p">112、122、132:頂點處理流水線模組</p>  
        <p type="p">113、123、133:圖元處理流水線模組</p>  
        <p type="p">114、124、134:像素處理流水線模組</p>  
        <p type="p">140:系統組態模組</p>  
        <p type="p">150:系統匯流排</p>  
        <p type="p">160:儲存部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2873" publication-number="202627624"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627624.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由隨機排列的光學元件組成的用於近視或近視前期的眼科器材</chinese-title>  
        <english-title>AN OPHTHALMIC DEVICE COMPRISING RANDOMLY ARRANGED OPTICAL ELEMENTS FOR A MYOPIC OR PRE-MYOPIC EYE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">G02C7/08</main-classification>  
        <further-classification edition="200601120260320B">A61F9/013</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商恩塔米克控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NTHALMIC HOLDING PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中景緯視（蘇州）光學科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG JING WEI SHI (SUZHOU) OPTICAL TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芭卡羅朱　拉維　錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKARAJU, RAVI CHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾曼　克勞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EHRMANN, KLAUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費德克　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEDTKE, CATHLEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開內容涉及用於患有眼軸相關疾病（如近視）的眼睛的眼鏡鏡片的光學膜。所述光學膜配置有多個光學元件，例如正屈光度的環形鏡片和具有方位角變化屈光度的光學元件，這些光學元件配置有截斷、凹陷或傾斜。光學元件的排列、屈光度、尺寸、數量和/或方向是偽隨機的。這種配置在自然和/或指令性眼球運動過程中為眼睛提供動態的不規則方向提示。眼球運動的指令可通過近視管理應用程式提供。本發明旨在減緩近視的發展，或預防或減緩近視的發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to optical films for spectacle lenses for use with eyes experiencing eye-length-related disorders, like myopia. The optical films are configured with a plurality of optical elements, such as a plus-powered donut-ring and optical elements with azimuthally varying power distributions configured with truncations, depressions or a tilt. The arrangement, power, size, number and/or orientation of the optical elements are pseudo-random. This configuration provides dynamic irregular directional cues to the eye which occur during natural and/or instructed eye movements. Instructions on eye movements may be provided via a Myopia Management App. This invention is aimed at slowing the progression of myopia or at preventing or slowing the onset of myopia.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:光學膜</p>  
        <p type="p">1001:光學膜中心</p>  
        <p type="p">1002:中心遠用區</p>  
        <p type="p">1003:周邊治療區</p>  
        <p type="p">1004:光學元件</p>  
        <p type="p">1004a:光學元件</p>  
        <p type="p">1005:光學中心</p>  
        <p type="p">1006:距離</p>  
        <p type="p">1007:方位角</p>  
        <p type="p">1041:徑向輻條</p>  
        <p type="p">1042:方位角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2874" publication-number="202627493"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627493.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試探針和測試設備</chinese-title>  
        <english-title>TEST PROBE AND TEST DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260114B">G01R1/067</main-classification>  
        <further-classification edition="202001120260114B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商李諾工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEENO INDUSTRIAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金健勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KEONYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種測試探針，用於測試待測裝置的電氣特性。測試探針包括筒，成形為圓筒狀並插入和容置於沿軸穿過插座塊所形成的探針容置部中；柱塞，包括插入部和主幹，插入部具有對應於筒的內徑的直徑且插入筒的第二端，以在筒內沿軸向方向滑動，且主幹從插入部延伸；彈簧止擋件，設置於主幹的端部且相對於軸沿徑向方向突出；以及彈簧，成形為線圈狀、設置於主幹的外圓周上、兩端部分別在軸向方向上被筒的第二端和彈簧支撐件支撐，並運作為在柱塞滑動時壓縮和恢復。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a test probe for testing electrical characteristics of a device under test. The test probe includes a barrel shaped like a cylinder and inserted and accommodated in a probe accommodating portion formed through the socket block along an axis; a plunger including an insert portion that has a diameter corresponding to an inner diameter of the barrel and is inserted into a second end of the barrel so as to slide in an axial direction within the barrel, and a stem that extends from the insert portion; a spring stopper provided at an end portion of the stem and protruding in a radial direction with respect to the axis; and a spring shaped like a coil, provided on an outer circumference of the stem, with both ends being respectively supported in the axial direction by the second end of the barrel and the spring supporter, and operating to be compressed and restored upon sliding of the plunger.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:測試探針</p>  
        <p type="p">11:筒</p>  
        <p type="p">111:端子保持部</p>  
        <p type="p">112:插入部止擋件</p>  
        <p type="p">113,143:彈簧支撐面</p>  
        <p type="p">12:端子</p>  
        <p type="p">121:接觸尖端</p>  
        <p type="p">122:筒插入部</p>  
        <p type="p">123,133:滾槽</p>  
        <p type="p">13:柱塞</p>  
        <p type="p">131:插入部</p>  
        <p type="p">132:主幹</p>  
        <p type="p">14:彈簧止擋件</p>  
        <p type="p">141:主幹夾持部</p>  
        <p type="p">142:測試端部</p>  
        <p type="p">15:彈簧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2875" publication-number="202628314"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628314.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有改進的ＥＭＣ控制的可重構電池系統</chinese-title>  
        <english-title>RECONFIGURABLE BATTERY SYSTEM WITH IMPROVED EMC CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260401B">H02J7/56</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商銳萊控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RELECTRIFY HOLDINGS PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了用於控制可重構電池系統中的共模能量發射的系統。系統包括以預定幾何佈置排列的多個電池單體模組、具有被配置為選擇性地將各電池單體模組從串聯連接中連接或旁路的多個開關的開關電路和可操作地耦接到開關電路的控制器。控制器被配置為基於與電池單體模組的幾何佈置關聯的位置資訊來確定節點分佈，確定定義開關事件的一個或更多個時間間隔的時間分佈，並根據節點分佈和時間分佈操作開關電路以選擇性地連接或旁路一個或更多個電池單體模組。通過根據電池系統的空間和時間特性協調開關操作，控制器控制系統的共模能量發射分佈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for controlling common mode energy emissions in a reconfigurable battery system is disclosed. The system includes a plurality of battery cell modules arranged in a predetermined geometric arrangement, a switching circuit having a plurality of switches configured to selectively connect or bypass individual battery cell modules from a series connection, and a controller operatively coupled to the switching circuit. The controller is configured to determine a node profile based on position information associated with the geometric arrangement of the battery cell modules, determine a timing profile defining one or more time intervals for switching events, and operate the switching circuit to selectively connect or bypass one or more battery cell modules in accordance with the node profile and the timing profile. By coordinating switching operations as a function of spatial and temporal characteristics of the battery system, the controller controls a common mode energy emission profile of the system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">52:頻譜</p>  
        <p type="p">53:頻譜</p>  
        <p type="p">54:頻譜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2876" publication-number="202628546"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628546.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260112B">H05K7/20</main-classification>  
        <further-classification edition="200601120260112B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大谷將寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTANI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉岡健人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAOKA, TAKEHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥野喬也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUNO, TAKAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉本宰弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURAMOTO, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冷卻模組包括具備分配歧管與收集歧管之歧管。分配歧管具備與複數個冷卻部中之冷媒流入口連接之複數個接頭之連接口。收集歧管具備與複數個冷卻部中之冷媒流出口連接之複數個接頭之連接口。分配歧管與收集歧管各自藉由固定構件彼此固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:冷卻模組</p>  
        <p type="p">3:歧管</p>  
        <p type="p">4:流管</p>  
        <p type="p">5:冷卻部</p>  
        <p type="p">6:外部流路</p>  
        <p type="p">7:分配歧管</p>  
        <p type="p">8:收集歧管</p>  
        <p type="p">10:熱源</p>  
        <p type="p">51:流入口</p>  
        <p type="p">52:流出口</p>  
        <p type="p">70:連接部</p>  
        <p type="p">71:分配側接頭</p>  
        <p type="p">72:流入部</p>  
        <p type="p">78:固定構件</p>  
        <p type="p">80:連接部</p>  
        <p type="p">81:收集側接頭</p>  
        <p type="p">82:流出部</p>  
        <p type="p">88:固定構件</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2877" publication-number="202627979"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627979.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖形處理方法、裝置和系統、計算設備和儲存媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">G06T1/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商摩爾線程智能科技（北京）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提出了一種圖形處理方法、裝置和系統、計算設備和儲存媒體，所述方法由目標圖形處理核心中的拓撲拆分模組執行，包括：獲取圖形繪製命令，圖形繪製命令指示要繪製具有指定拓撲類型的圖形；基於圖形繪製命令，獲取繪製圖形所需使用的頂點索引數據；根據指定拓撲類型，對頂點索引數據按索引次序劃分圖元包，以確定要被目標圖形處理核心處理的圖元包並插入對應的同步標記；將要被目標圖形處理核心處理的圖元包和對應的同步標記傳送到目標圖形處理核心中的幾何流水處理線模組進行處理，以得到帶有同步標記的幾何處理結果，其中帶有同步標記的幾何處理結果在被目標圖形處理核心中的像素處理流水線模組進行處理後得到視覺化圖形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:圖形處理方法</p>  
        <p type="p">210、220、230、240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2878" publication-number="202626740"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626740.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＧＰＣ３抗體藥物接合物</chinese-title>  
        <english-title>ANTI-GPC3 ANTIBODY DRUG CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/30</main-classification>  
        <further-classification edition="200601120260401B">C07D491/22</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾伯維有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABBVIE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲伏爾　艾蜜莉　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAIVRE, EMILY JEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐　海恩海爾　伊果海寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O'HAINMHIRE, EOGHAININ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供GPC3抗體藥物接合物(ADC)，包括使用此類ADC之組成物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides GPC3 antibody drug conjugates (ADCs), including compositions and methods of using such ADC.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2879" publication-number="202626577"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626577.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體光阻組成物及使用組成物形成圖案的方法和系統</chinese-title>  
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD AND SYSTEM OF FORMING PATTERNS USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07C50/10</main-classification>  
        <further-classification edition="200601120260302B">C07C50/16</further-classification>  
        <further-classification edition="200601120260302B">C07D219/06</further-classification>  
        <further-classification edition="200601120260302B">C07D311/86</further-classification>  
        <further-classification edition="200601120260302B">C07D335/16</further-classification>  
        <further-classification edition="200601120260302B">C07F7/22</further-classification>  
        <further-classification edition="200601120260302B">C08G79/12</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification>  
        <further-classification edition="200601120260302B">G03F7/38</further-classification>  
        <further-classification edition="200601120260302B">G03F7/40</further-classification>  
        <further-classification edition="202601120260302B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓俊熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JOONHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張水民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秀斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SOOBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡閏珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, YUNJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金經睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGMOG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體光阻組成物以及使用半導體光阻組成物形成圖案的方法和系統。半導體光阻組成物包括：有機金屬化合物；由化學式1或化學式2表示的化合物；以及溶劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="394px" width="413px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor photoresist composition and a method and a system of forming patterns using the semiconductor photoresist composition are provided. The semiconductor photoresist composition includes: an organometallic compound; a compound represented by Chemical Formula 1 or Chemical Formula 2; and a solvent. &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="386px" width="439px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">108:光阻圖案</p>  
        <p type="p">112:有機膜圖案</p>  
        <p type="p">114:薄膜圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2880" publication-number="202627572"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627572.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150394</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260308B">G02B6/32</main-classification>  
        <further-classification edition="200601120260308B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日亞化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICHIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西森健博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMORI, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提高發光裝置的可靠性。發光裝置包括：支撐體，其包括基材、以及被該基材支撐並包含第一導電部的多個導電部件，在該支撐體的上表面具有第一凹部；第一發光元件，配置在該支撐體上；集體電路，在俯視下具有第一方向以及與該第一方向正交的第二方向，並且在該第一方向上與該第一發光元件對齊地配置在該支撐體上；接合部件，配置在該支撐體與該集體電路之間，並接合該支撐體與該集體電路；第一導線，連接至該第一導電部及該集體電路，在該第一方向上，該第一凹部位於該第一導電部與該第一導線被連接的連接部和該集體電路之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:支撐體</p>  
        <p type="p">3:集體電路</p>  
        <p type="p">3G-1:第一外緣</p>  
        <p type="p">3G-2:第二外緣</p>  
        <p type="p">3G-3:第三外緣</p>  
        <p type="p">3G-4:第四外緣</p>  
        <p type="p">4:接合部件</p>  
        <p type="p">6:通孔</p>  
        <p type="p">10:第一凹部</p>  
        <p type="p">11:基材</p>  
        <p type="p">12-1:第一導電部</p>  
        <p type="p">12,12-2,12-3,12-4,12-5,12-6,12-7,12-8,12-9,12-10,12-11,12-12,12-13:導電部件</p>  
        <p type="p">21:第一發光元件</p>  
        <p type="p">22:第二發光元件</p>  
        <p type="p">23:第三發光元件</p>  
        <p type="p">51:第一導線</p>  
        <p type="p">52:第二導線</p>  
        <p type="p">61:連接部</p>  
        <p type="p">100:發光裝置</p>  
        <p type="p">121:第一部分</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">L3:第二方向上的集體電路的最大長度</p>  
        <p type="p">L10-1:第一方向上的第一凹部的最大長度</p>  
        <p type="p">L10-2:第二方向上的第一凹部的最大長度</p>  
        <p type="p">L21:第二方向上的第一發光元件的最大長度</p>  
        <p type="p">L121:第二方向上的第一部分的最大長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2881" publication-number="202626770"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626770.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電融合器件用光硬化性組成物、光電融合器件用構件及光電融合器件</chinese-title>  
        <english-title>PHOTOCURABLE COMPOSITION FOR OPTOELECTRONIC FUSION DEVICE, MEMBER FOR OPTOELECTRONIC FUSION DEVICE, AND OPTOELECTRONIC FUSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08F2/44</main-classification>  
        <further-classification edition="200601120260401B">C08F2/50</further-classification>  
        <further-classification edition="200601120260401B">C08F220/30</further-classification>  
        <further-classification edition="200601120260401B">C08F222/20</further-classification>  
        <further-classification edition="200601120260401B">C08F228/02</further-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification>  
        <further-classification edition="200601120260401B">G02B6/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚健祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光電融合器件用光硬化性組成物，含有含(甲基)丙烯醯基的聚合性化合物、以及光聚合起始劑，相對於含(甲基)丙烯醯基的聚合性化合物的總量，光聚合起始劑的含量為0.5質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2882" publication-number="202629022"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629022.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陶瓷配線構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H10W70/692</main-classification>  
        <further-classification edition="202601120260326B">H10W70/67</further-classification>  
        <further-classification edition="202601120260326B">H10W70/60</further-classification>  
        <further-classification edition="200601120260326B">H05K3/40</further-classification>  
        <further-classification edition="200601120260326B">H05K1/11</further-classification>  
        <further-classification edition="200601120260326B">H05K1/03</further-classification>  
        <further-classification edition="200601120260326B">H03H9/15</further-classification>  
        <further-classification edition="200601120260326B">H03H9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＧＫ電子器件股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK ELECTRONICS DEVICES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩原正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOBARA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡浩介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方孝友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, TAKATOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種陶瓷配線構件，其具備： &lt;br/&gt;陶瓷製的絕緣基板，具有第1主面及第2主面，並疊層有第2層及包含該第1主面的第1層；及 &lt;br/&gt;導電部，以接觸該絕緣基板的方式配置，並由導體形成。 &lt;br/&gt;該導電部，具有： &lt;br/&gt;外層導體，形成於該第1主面； &lt;br/&gt;內層導體，形成於該第1層與該第2層之間；及 &lt;br/&gt;側面導體，電性連接該外層導體與該內層導體。 &lt;br/&gt;該側面導體，包含： &lt;br/&gt;側面部，以接觸該第1層中之與該第1主面相交的側面之方式形成； &lt;br/&gt;第1連接部，連接該側面部與該內層導體；及 &lt;br/&gt;第2連接部，連接該側面部與該外層導體。 &lt;br/&gt;該第1連接部，從該側面部的表面突出，且從該第2主面指向該第1主面的第1方向上之該第1連接部之該第1主面側的前端，位於比該第1層與該內層導體的交界面更接近該第1主面側之處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">1:陶瓷配線構件</p>  
        <p type="p">2:本體部</p>  
        <p type="p">21:絕緣基板</p>  
        <p type="p">212:第2主面</p>  
        <p type="p">22:框部</p>  
        <p type="p">23:空腔</p>  
        <p type="p">24:第1層</p>  
        <p type="p">241:缺口部</p>  
        <p type="p">25:第2層</p>  
        <p type="p">3:導電部</p>  
        <p type="p">4:內部端子</p>  
        <p type="p">41:內部輸入端子</p>  
        <p type="p">42:內部輸出端子</p>  
        <p type="p">5:外層導體</p>  
        <p type="p">7:電子零件</p>  
        <p type="p">71:壓電振動元件</p>  
        <p type="p">9:蓋子</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">D3:第3方向</p>  
        <p type="p">E1:第1端</p>  
        <p type="p">E2:第2端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2883" publication-number="202627332"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627332.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分流器型低壓ＳＣＲ用廢氣流量控制百葉窗式擋板</chinese-title>  
        <english-title>DIVERTER TYPE EXHAUST GAS FLOW CONTROL LOUVER DAMPER FOR LOW PRESSURE SCR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260227B">F16K1/32</main-classification>  
        <further-classification edition="200601120260227B">F16K31/12</further-classification>  
        <further-classification edition="200601120260227B">F16K31/53</further-classification>  
        <further-classification edition="200601120260227B">F16K27/00</further-classification>  
        <further-classification edition="200601120260227B">F16K41/00</further-classification>  
        <further-classification edition="200601120260227B">F17C13/00</further-classification>  
        <further-classification edition="200601120260227B">F17C5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＤＨ控制股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DH CONTROLS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鍾根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, JONGKEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成翰森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEONG, HANSAEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分流器型低壓SCR用廢氣流量控制百葉窗式擋板，包括：閥門主體，對船舶的引擎燃燒時所產生的廢氣進行排放的排氣管被氣密結合到第一側面，在第二側面氣密結合有將廢氣直接排放達外部的第一排放管，在第三側面氣密結合有對廢氣進行分流並迂回至SCR的迂回管，第一排放管與迂回管以彼此90度的角度相隔配置；百葉窗式第一葉片部，對第一排放管的出口進行開閉；百葉窗式第二葉片部，對迂回管的出口進行開閉；流路開閉部，使第一葉片部的葉片與第二葉片部的葉片相互聯動，而選擇性地開放第一排放管並封閉迂回管，或封閉第一排放管並開放迂回管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A louvered baffle for controlling exhaust gas flow in a diverter-type low-pressure SCR includes: a valve body, wherein an exhaust pipe for discharging exhaust gas generated during engine combustion in a ship is hermetically connected to a first side,and a first exhaust pipe for directly discharging exhaust gas to the outside is hermetically connected to a second side, and a detour pipe for diverting exhaust gas and redirecting it to the SCR is hermetically connected to a third side,and the first exhaust pipe and the detour pipe are spaced apart at 90-degree angles; a louvered first blade section for opening and closing the outlet of the first exhaust pipe; a louvered second blade section for opening and closing the outlet of the detour pipe; and a flow path opening and closing section that allows the blades of the first blade section and the blades of the second blade section to interact, thereby selectively opening the first exhaust pipe and closing the detour pipe, or closing the first exhaust pipe and opening the detour pipe.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:第一排放管</p>  
        <p type="p">113:迂回管</p>  
        <p type="p">121:葉片</p>  
        <p type="p">131:葉片</p>  
        <p type="p">140:流路開閉部</p>  
        <p type="p">141:旋轉驅動軸</p>  
        <p type="p">142:蝸杆齒輪</p>  
        <p type="p">143:第一渦輪</p>  
        <p type="p">144:第二渦輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2884" publication-number="202628547"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628547.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以減少浸沒式冷卻系統的蒸氣損失的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS TO REDUCE VAPOR LOSSES OF IMMERSION COOLING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05K7/20</main-classification>  
        <further-classification edition="200601120260401B">G06F1/20</further-classification>  
        <further-classification edition="200601120260401B">F28D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科慕ＦＣ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查爾凡特　理查德　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHALFANT, RICHARD L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波特克　古斯塔沃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTTKER, GUSTAVO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭特　德魯　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDT, DREW RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">透過使用一或多個氣刀或氣簾減少來自一浸沒式冷卻槽的一兩相浸沒式冷卻流體的蒸氣損失，該一或多個氣刀或氣簾在槽的頂部中的開口上方及/或下方產生空氣及/或蒸氣的一（多個）經水平定向的流，該槽容納有至少部分地浸沒在呈液體形式的浸沒式冷卻流體中的伺服器。空氣或蒸氣的該（等）流抑制空氣進入該槽及/或蒸氣離開該槽。該一或多個氣刀或氣簾可包括在開口之上的一者、在開口之下的一者、在開口之上的一者及在開口之下的一者、在開口之上的兩者、或在開口之下的兩者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Losses of vapor of a two-phase immersion cooling fluid from an immersion cooling tank are reduced through the use of one or more air knives or air curtains generating a horizontally oriented flow(s) of air and/or vapor over and/or under an opening in a top of the tank, which contains a server at least partially immersed in the immersion cooling fluid in liquid form. The flow(s) of air or vapor inhibits ingress of air into, and/or egress of vapor out of, the tank. The one or more air knives or air curtains may include one above the opening, one below the opening, one above and one below the opening, two above the opening or two below the opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:浸沒式冷卻槽；槽</p>  
        <p type="p">3:底板</p>  
        <p type="p">5:頂部</p>  
        <p type="p">7:第一側</p>  
        <p type="p">9:第二側</p>  
        <p type="p">15:浸沒式冷卻流體</p>  
        <p type="p">18:頂部空間</p>  
        <p type="p">20:空氣流動裝置</p>  
        <p type="p">22:蒸氣流動裝置</p>  
        <p type="p">35:冷卻劑入口；入口</p>  
        <p type="p">36:返回流；冷卻的冷卻劑；流</p>  
        <p type="p">37:冷卻劑出口；出口</p>  
        <p type="p">38:加熱的冷卻劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2885" publication-number="202627001"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627001.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光液及其應用</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SLURRY AND ITS APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C09G1/02</main-classification>  
        <further-classification edition="200601120260401B">C09K3/14</further-classification>  
        <further-classification edition="202601120260401B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雨春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹先升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, XIANSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭詩月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, SHIYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種碳化矽襯底化學機械拋光的組合物，所述組合物包含研磨顆粒、氧化劑、催化劑、分散劑和pH調節劑。所述組合物可一步實現碳化矽襯底的拋光，在保持較高去除速率的同時，能夠改善SiC表面品質，獲得低粗糙度的光潔表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a composition for the chemical mechanical polishing of silicon carbide substrates. The composition comprises abrasive particles, an oxidizing agent, a catalyst, a dispersant, and a pH adjuster. The composition enables one-step polishing of silicon carbide substrates, maintaining a high removal rate while improving the surface quality of SiC and achieving a highly smooth surface with low roughness</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2886" publication-number="202628548"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628548.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以減少浸沒式冷卻系統的蒸氣損失的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS TO REDUCE VAPOR LOSSES OF IMMERSION COOLING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H05K7/20</main-classification>  
        <further-classification edition="200601120260327B">B25J21/02</further-classification>  
        <further-classification edition="200601120260327B">B01D5/00</further-classification>  
        <further-classification edition="200601120260327B">F28D15/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科慕ＦＣ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查爾凡特　理查德　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHALFANT, RICHARD L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波特克　古斯塔沃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTTKER, GUSTAVO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭特　德魯　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRANDT, DREW RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由將一次級外殼定位在一浸沒式冷卻槽的頂部，可減少一兩相浸沒式冷卻槽的蒸氣損失，該浸沒式冷卻槽含有至少部分浸沒在呈液體形式之浸沒式冷卻流體中之一電子組件。該次級外殼的壁的底部邊緣環繞有該槽的一頂部的一開口，該開口係藉由將該槽的一蓋定位至一開啟位置而形成。以此方式，該次級外殼可減少或防止蒸氣逸出至周圍氣氛中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Losses of vapors of a two-phase immersion cooling tank are reduced by positioning a secondary enclosure on top of an immersion cooling tank containing an electronic component that is at least partially immersed in the immersion cooling fluid in liquid form. Bottom edges of the walls of the secondary enclosure surround an opening in a top of the tank that is creating by positioning a lid of the tank into an open position. In this manner, the secondary enclosure reduces or prevents egress of the vapors into the ambient atmosphere.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:伺服器</p>  
        <p type="p">5:槽</p>  
        <p type="p">7:底板</p>  
        <p type="p">9:頂部；槽頂部</p>  
        <p type="p">11:壁</p>  
        <p type="p">13:蓋</p>  
        <p type="p">15:液相；浸沒式冷卻流體</p>  
        <p type="p">17:冷凝器</p>  
        <p type="p">19:頂部空間</p>  
        <p type="p">21:外殼</p>  
        <p type="p">23:頂部；次級外殼頂部</p>  
        <p type="p">25:壁</p>  
        <p type="p">27:維護空間</p>  
        <p type="p">29:底部邊緣</p>  
        <p type="p">31:吊車</p>  
        <p type="p">33:門型滑車</p>  
        <p type="p">35:纜線</p>  
        <p type="p">39:懸吊支柱或纜線</p>  
        <p type="p">41:排氣軟管</p>  
        <p type="p">43:氣體泵或風扇</p>  
        <p type="p">45:開口</p>  
        <p type="p">49:蒸氣回收單元</p>  
        <p type="p">51:氣體供應器</p>  
        <p type="p">53:氣體供應軟管</p>  
        <p type="p">61:手套端口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2887" publication-number="202626626"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626626.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>喹啉化合物及其用途</chinese-title>  
        <english-title>QUINOLINE COMPOUND AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260202B">C07D401/14</main-classification>  
        <further-classification edition="200601120260202B">C07D487/10</further-classification>  
        <further-classification edition="200601120260202B">C07D471/10</further-classification>  
        <further-classification edition="200601120260202B">C07D413/14</further-classification>  
        <further-classification edition="200601120260202B">A61K31/496</further-classification>  
        <further-classification edition="200601120260202B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260202B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260202B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪秋蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIU-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張幼龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YOW-LONE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王翔靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HSIANG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳婉茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WAN-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種化合物或其鹽類，其中該化合物具有式(I)、式(II)或式(III)所示的結構：&lt;br/&gt;      &lt;img align="absmiddle" height="191px" width="393px" file="ed10234.JPG" alt="ed10234.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="211px" width="443px" file="ed10235.JPG" alt="ed10235.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；與&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="208px" width="417px" file="ed10236.JPG" alt="ed10236.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A compound or a salt thereof is provided. The compound has a structure represented by Formula (I), Formula (II) or Formula (III):&lt;br/&gt;&lt;img align="absmiddle" height="183px" width="455px" file="ed10237.JPG" alt="ed10237.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="230px" width="470px" file="ed10238.JPG" alt="ed10238.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ; and&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="203px" width="523px" file="ed10239.JPG" alt="ed10239.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; .</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2888" publication-number="202627740"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627740.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>指戴型穩定結構及指戴型裝置</chinese-title>  
        <english-title>FINGER-WORN STABILIZING STRUCTURE AND FINGER-WORN DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260227B">G06F1/16</main-classification>  
        <further-classification edition="200601120260227B">G06F3/01</further-classification>  
        <further-classification edition="200601120260227B">F16M13/04</further-classification>  
        <further-classification edition="200601120260227B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商環鴻電子（昆山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSAL GLOBAL TECHNOLOGY (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林皓芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HOU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種指戴型穩定結構，指戴型穩定結構包含一本體以及一承載件。本體具有一承靠面與一外環面，且本體包含一第一端部、一第二端部、一抵靠部及一穿孔。第一端部與第二端部彼此分離。抵靠部設置於外環面上並鄰設於第二端部。穿孔貫設於第二端部。承載件一體連接於第一端部，其中承載件具有一第一表面與一第二表面，第一表面與外環面連接，且第二表面與承靠面連接。藉此，本發明的指戴型穩定結構可穩定地配戴於使用者的手指，並可用以承載電子裝置，而具有相關產業的商業應用潛力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a finger-worn stabilizing structure including a mainbody and a bearing element. The mainbody has a bearing surface and an outer-ring surface, and the mainbody has a first end portion, a second end portion, an abutting portion and a through-hole. The first end portion and the second end portion are separately disposed to each other. The abutting portion is disposed on the outer-ring surface and disposed adjacent to the second end portion. The through hole is disposed through the second end portion. The bearing element is integrally connected to the first end portion, wherein the bearing element has a first surface and a second surface, the first surface is connected to the outer-ring surface, and the second surface is connected to the bearing surface. Therefore, the finger-worn stabilizing structure of the present disclosure can be stably worn on a finger of a user and can be used to carry an electronic device, and it has the potential for commercial application in related industries.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:指戴型穩定結構</p>  
        <p type="p">110:本體</p>  
        <p type="p">111:承靠面</p>  
        <p type="p">112:外環面</p>  
        <p type="p">113:第一端部</p>  
        <p type="p">114:第二端部</p>  
        <p type="p">115:抵靠部</p>  
        <p type="p">116:穿孔</p>  
        <p type="p">118:檔止件</p>  
        <p type="p">120:承載件</p>  
        <p type="p">121:第一表面</p>  
        <p type="p">122:第二表面</p>  
        <p type="p">130:手指容置空間</p>  
        <p type="p">140:開口</p>  
        <p type="p">150:夾設空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2889" publication-number="202627208"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627208.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、處理含金屬膜的方法及製造電子裝置的方法</chinese-title>  
        <english-title>COMPOSITION, METHOD OF TREATING METAL-CONTAINING FILM AND METHOD OF MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260305B">C23F1/26</main-classification>  
        <further-classification edition="200601120260305B">C07D251/56</further-classification>  
        <further-classification edition="200601120260305B">C09K13/06</further-classification>  
        <further-classification edition="200601120260305B">C23C18/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梨花女子大學校產學協力團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EWHA UNIVERSITY-INDUSTRY COLLABORATION FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴仁仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, INSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炳權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNGKWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智瑀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JEEWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李睿珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜炳俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BYUNGJOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴正一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JEONGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李錦喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUM HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃圭榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, KYUYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包括氧化劑、酸及蝕刻控制劑的組成物、一種藉由使用該組成物處理含金屬層的方法及一種藉由使用該組成物製造電子裝置的方法。該蝕刻控制劑可包括由式1表示之化合物及包括由式2表示之重複單元之聚合物中的至少一者：&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="182px" width="569px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。&lt;br/&gt; 式1及式2如本說明書中所描述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a composition including an oxidizing agent, an acid, and an etching controller, a method of treating a metal-containing layer by using the same, and a method of manufacturing an electronic device by using the composition. The etching controller may include at least one of a compound represented by Formula 1 and a polymer including a repeating unit represented by Formula 2:&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="165px" width="569px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.&lt;br/&gt; Formulae 1 and 2 are as described in this specification.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2890" publication-number="202625892"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625892.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體溶解擴散裝置</chinese-title>  
        <english-title>GAS DISSOLUTION AND DIFFUSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">A01K63/04</main-classification>  
        <further-classification edition="201701120260127B">A01K61/10</further-classification>  
        <further-classification edition="200601120260127B">C02F7/00</further-classification>  
        <further-classification edition="202301120260127B">C02F3/26</further-classification>  
        <further-classification edition="202201120260127B">B01F23/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商液態空氣喬治斯克勞帝方法研究開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史春瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, CHUNQIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TIANYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉胡安　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VILLAJUAN, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張洪榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HONGRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華志良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, ZHILIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露了一種氣體溶解擴散裝置，該氣體溶解擴散裝置包括外殼體和內殼體，外殼體側壁上沿軸向佈置至少一個流出口。內殼體部分地容納在混合室內。並且，內殼體的一部分具有沿氣液混合物流動方向逐漸縮小的截面積。氣液混合物從氣液導入口引入，從內殼體出口流出後，產生在混合室內循環流動的氣液流。內殼體出口與外殼體流出口位於相背的兩側。該氣體溶解擴散裝置能夠將氣泡高密度地均勻充滿養殖區域，增加水中的溶氧量。無需使用額外的泵或者循環裝置，減少能耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:氣液導入口</p>  
        <p type="p">102:第一端部</p>  
        <p type="p">103:第二端部</p>  
        <p type="p">104:外殼體側壁</p>  
        <p type="p">105:外殼體流出口</p>  
        <p type="p">106:混合室</p>  
        <p type="p">107:內殼體出口</p>  
        <p type="p">1081:內殼體的非錐形部分</p>  
        <p type="p">1082:內殼體的錐形部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2891" publication-number="202627095"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627095.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於抑制補體因子B（CFB）表達的組合物和方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR INHIBITING EXPRESSION OF COMPLEMENT FACTOR B (CFB)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海舶望製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI ARGO BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒東旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, DONGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵　鵬程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, PENGCHENG PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了用於降低CFB基因表達並且用於治療CFB相關疾病和病症的組合物和方法。提供了可用於降低細胞和受試者的CFB表達的CFB dsRNA藥劑、CFB反義多核苷酸藥劑、包含CFB dsRNA藥劑的組合物和包含CFB反義多核苷酸藥劑的組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compositions and methods useful to reduce expression of CFB gene and for treatment of CFB-associated diseases and conditions are provided. Provided are CFB dsRNA agents, CFB antisense polynucleotide agents, compositions comprising CFB dsRNA agents, and compositions comprising CFB antisense polynucleotide agents that can be used to reduce CFB expression in cells and subjects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2892" publication-number="202626885"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626885.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含磷醯膽鹼基矽氧烷化合物及其製造方法、隱形眼鏡用組成物、聚合物及隱形眼鏡</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08G77/395</main-classification>  
        <further-classification edition="200601120260401B">C08F220/28</further-classification>  
        <further-classification edition="200601120260401B">C08F226/10</further-classification>  
        <further-classification edition="200601120260401B">C08F230/02</further-classification>  
        <further-classification edition="200601120260401B">C08F230/08</further-classification>  
        <further-classification edition="200601120260401B">C08L43/04</further-classification>  
        <further-classification edition="200601120260401B">C08L83/04</further-classification>  
        <further-classification edition="200601120260401B">G02B1/04</further-classification>  
        <further-classification edition="200601120260401B">G02C7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOF CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山根奏太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANE, SOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五反田龍矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTANDA, RYUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩切規郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAKIRI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種含磷醯膽鹼基矽氧烷化合物，其能夠製造具有良好潤濕性，且即使因長時間佩戴而產生乾燥的情況下，鏡片表面的潤滑性仍得以維持的隱形眼鏡。式（1）所表示的含磷醯膽鹼基矽氧烷化合物。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="146px" width="376px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式（1）中， &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;為碳數1～18的烷基或式（2）所表示的含磷醯膽鹼基部位，R&lt;sup&gt;2&lt;/sup&gt;為甲基或式（2）所表示的含磷醯膽鹼基部位，R&lt;sup&gt;1&lt;/sup&gt;或R&lt;sup&gt;2&lt;/sup&gt;中的至少一者為式（2）所表示的含磷醯膽鹼基部位。n表示20～500的整數，m表示1～70的整數。] &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="114px" width="387px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式（2）中，X表示-CH&lt;sub&gt;2&lt;/sub&gt;CH&lt;sub&gt;2&lt;/sub&gt;-或-CH&lt;sub&gt;2&lt;/sub&gt;CH&lt;sub&gt;2&lt;/sub&gt;CH&lt;sub&gt;2&lt;/sub&gt;-。l表示0或1。]</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2893" publication-number="202628522"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628522.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05K7/12</main-classification>  
        <further-classification edition="200601120260401B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水紳太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚祐真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOTSUKA, YUUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠功士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井嵩大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電子裝置（10）具備：第1電路基板（361），形成有複數之卡止部（88）；第2電路基板（362），直立設置於第1電路基板；及溝槽構件（70），具備複數之卡合爪（82），卡止在複數之卡止部的各者，並且具備導引軌道（80），將第3電路基板（363）導引到第2電路基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">36:電路基板</p>  
        <p type="p">38:面板</p>  
        <p type="p">54:控制單元</p>  
        <p type="p">70:溝槽構件</p>  
        <p type="p">72:基板接頭</p>  
        <p type="p">74:中繼接頭</p>  
        <p type="p">78:導引構件</p>  
        <p type="p">82:卡合爪</p>  
        <p type="p">84:臂部</p>  
        <p type="p">86:鉤部</p>  
        <p type="p">88:卡止部</p>  
        <p type="p">88H:孔狀卡止部</p>  
        <p type="p">88N,88Na,88Nb:缺口狀卡止部</p>  
        <p type="p">90:突起部</p>  
        <p type="p">92:嵌合孔</p>  
        <p type="p">94:貫通孔</p>  
        <p type="p">104:倒角部</p>  
        <p type="p">361:第1電路基板</p>  
        <p type="p">361E:邊緣</p>  
        <p type="p">361Sa,361Sb:主面</p>  
        <p type="p">362:第2電路基板</p>  
        <p type="p">362Sa,362Sb:主面</p>  
        <p type="p">363:第3電路基板</p>  
        <p type="p">363C:基板接頭</p>  
        <p type="p">364:第4電路基板</p>  
        <p type="p">364C:基板接頭</p>  
        <p type="p">701:第1溝槽構件</p>  
        <p type="p">702:第2溝槽構件</p>  
        <p type="p">741:第1中繼接頭</p>  
        <p type="p">742:第2中繼接頭</p>  
        <p type="p">743:第3中繼接頭</p>  
        <p type="p">744:第4中繼接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2894" publication-number="202628516"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628516.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260311B">H05K5/02</main-classification>  
        <further-classification edition="200601120260311B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井嵩大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土本将孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIMOTO, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山裕亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠山貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYAMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及的電子裝置（10）具備：殼體（12），具有連通到殼體空間（36）之中的第1部分空間（36a）的通氣口（60）；及基板（18），界定第1部分空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">12:殼體</p>  
        <p type="p">14:電源部</p>  
        <p type="p">16:電性負載</p>  
        <p type="p">18:連接基板(基板)</p>  
        <p type="p">18a:第1面</p>  
        <p type="p">18b:第2面</p>  
        <p type="p">20:第1風扇</p>  
        <p type="p">22:第2風扇</p>  
        <p type="p">28:側板</p>  
        <p type="p">34:側板</p>  
        <p type="p">36:殼體空間</p>  
        <p type="p">36a:第1部分空間</p>  
        <p type="p">36b:第2部分空間</p>  
        <p type="p">38:前面面板</p>  
        <p type="p">40:背面面板</p>  
        <p type="p">42:電路基板</p>  
        <p type="p">44:連結構件</p>  
        <p type="p">46:控制基板(基板)</p>  
        <p type="p">50:連結構件</p>  
        <p type="p">52:第1連接接頭</p>  
        <p type="p">54:第2連接接頭</p>  
        <p type="p">56:電源側接頭</p>  
        <p type="p">58:負載側接頭</p>  
        <p type="p">60:通氣口</p>  
        <p type="p">60a:第1通氣口</p>  
        <p type="p">60b:第2通氣口</p>  
        <p type="p">62:第1吸氣口</p>  
        <p type="p">64:第1排氣口</p>  
        <p type="p">66:第2吸氣口</p>  
        <p type="p">68:第2排氣口</p>  
        <p type="p">70:電源接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2895" publication-number="202626400"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626400.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150652</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童安全座椅</chinese-title>  
        <english-title>CHILD SAFETY SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B60N2/28</main-classification>  
        <further-classification edition="200601120260331B">B60N2/06</further-classification>  
        <further-classification edition="200601120260331B">B60N2/14</further-classification>  
        <further-classification edition="200601120260331B">B60N2/433</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李如意</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方淦清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, GANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DALIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昱璡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種兒童安全座椅，其包括：底座；轉盤，其沿第一軸線可轉動地設置於所述底座；支撐件，其設置於所述轉盤，並且適於隨所述轉盤相對於所述底座轉動；以及座椅部，其適於由所述轉盤帶動而相對於所述底座轉動。所述座椅部沿第二軸線可轉動地連接至所述支撐件，使得所述座椅部在所述座椅部的橫向方向上可擺動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child safety seat is disclosed, which including: a base; a rotor rotatably arranged on the base about a first axis; a support arranged on the rotor and adapted to be rotated with the rotor relative to the base; and a seat part adapted to be rotated relative to the base by the rotor. The seat part is rotatably connected to the support about a second axis so that the seat part is swingable in a transverse direction of the seat part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A10:兒童安全座椅</p>  
        <p type="p">A100:底座</p>  
        <p type="p">A200:座椅部</p>  
        <p type="p">A230:第一操作件</p>  
        <p type="p">A300:轉盤</p>  
        <p type="p">A400:支撐件</p>  
        <p type="p">B:後</p>  
        <p type="p">F:前</p>  
        <p type="p">L:左</p>  
        <p type="p">R:右</p>  
        <p type="p">U1-U1:線</p>  
        <p type="p">Z2:第二軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2896" publication-number="202628527"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628527.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05K7/14</main-classification>  
        <further-classification edition="200601120260401B">H05K7/18</further-classification>  
        <further-classification edition="200601120260401B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井嵩大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土本将孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIMOTO, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山裕亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠山貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYAMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大塚祐真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOTSUKA, YUUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之電子裝置（10），包含：第1電路基板（361），其具有第1主面（361Sa）以及作為第1主面的背面的第2主面（361Sb）；第1插槽構件（701），其與第1主面相接，並將第2電路基板（362）引導至第1主面；以及第2插槽構件（702），其與第2主面相接，並將第3電路基板（363）引導至第2主面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">36:電路基板</p>  
        <p type="p">36A:放大器板</p>  
        <p type="p">38:面板</p>  
        <p type="p">54:控制單元</p>  
        <p type="p">70:插槽構件</p>  
        <p type="p">72:基板連接器</p>  
        <p type="p">74:中繼連接器</p>  
        <p type="p">76:放大器板連接器</p>  
        <p type="p">78:引導構件</p>  
        <p type="p">81:固定部</p>  
        <p type="p">82:卡合爪</p>  
        <p type="p">84:臂部</p>  
        <p type="p">86:鉤部</p>  
        <p type="p">88:卡止部</p>  
        <p type="p">88N,88Na,88Nb:缺口狀卡止部</p>  
        <p type="p">88H:孔狀卡止部</p>  
        <p type="p">104:倒角部</p>  
        <p type="p">361:第1電路基板</p>  
        <p type="p">362:第2電路基板</p>  
        <p type="p">363:第3電路基板</p>  
        <p type="p">364:第4電路基板</p>  
        <p type="p">364Sa,364Sb:主面</p>  
        <p type="p">364E:緣部</p>  
        <p type="p">701:第1插槽構件</p>  
        <p type="p">702:第2插槽構件</p>  
        <p type="p">741:第1中繼連接器</p>  
        <p type="p">744:第4中繼連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2897" publication-number="202628715"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628715.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150666</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體發光元件及半導體發光元件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260202B">H10H20/01</main-classification>  
        <further-classification edition="202501120260202B">H10H20/824</further-classification>  
        <further-classification edition="202501120260202B">H10H20/812</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商同和電子科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWA ELECTRONICS MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小鹿優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHIKA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門脇嘉孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADOWAKI, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種與先前的發光元件相比發光特性良好且逆向電流特性提高的半導體發光元件。根據本發明的半導體發光元件包括將障壁層與阱層重覆積層而成的III-V族化合物半導體的量子阱型發光層的半導體發光元件，障壁層由包含P的AlGaInAs&lt;sub&gt;1-x&lt;/sub&gt;P&lt;sub&gt;x&lt;/sub&gt;（0＜x＜1）組成，阱層由AlGaInAs&lt;sub&gt;1-y&lt;/sub&gt;P&lt;sub&gt;y&lt;/sub&gt;（0≦y≦x）組成，阱層的組成波長λ&lt;sub&gt;w&lt;/sub&gt;與障壁層的組成波長λ&lt;sub&gt;b&lt;/sub&gt;的組成波長差為500nm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2898" publication-number="202628517"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628517.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擴張單元及電子裝置套組</chinese-title>  
        <english-title>EXPANSION UNIT AND ELECTRONIC DEVICE SET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260323B">H05K5/02</main-classification>  
        <further-classification edition="200601120260323B">H05K5/04</further-classification>  
        <further-classification edition="200601120260323B">H05K7/12</further-classification>  
        <further-classification edition="200601120260323B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, SHUU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之擴張單元（14），係用以擴張電子裝置（12）的殼體（16）所具有之殼體空間（30）的擴張單元，其特徵為：殼體，包含：第1殼體構件（26），其具有殼體底部（32）；以及第2殼體構件（28），其具有殼體蓋部（46）同時相對於第1殼體構件可裝卸；殼體空間，由第1殼體構件與第2殼體構件所區隔出；當欲擴張殼體所具有的殼體空間時，將擴張單元配置於殼體底部與殼體蓋部之間；於擴張單元設置了送風風扇（54）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置套組</p>  
        <p type="p">12:電子裝置</p>  
        <p type="p">14:擴張單元</p>  
        <p type="p">16:殼體</p>  
        <p type="p">24:送風風扇</p>  
        <p type="p">26:第1殼體構件</p>  
        <p type="p">28:第2殼體構件</p>  
        <p type="p">32:殼體底部</p>  
        <p type="p">34:殼體前部</p>  
        <p type="p">36:殼體背部</p>  
        <p type="p">38:外部連接介面</p>  
        <p type="p">40:電源開關</p>  
        <p type="p">42:供氣部</p>  
        <p type="p">44:外部電源連接部</p>  
        <p type="p">46:殼體蓋部</p>  
        <p type="p">48a,48b:殼體側部</p>  
        <p type="p">50:擴張本體</p>  
        <p type="p">52:擴張前部</p>  
        <p type="p">54:送風風扇</p>  
        <p type="p">56:分隔板</p>  
        <p type="p">58:擴張背部</p>  
        <p type="p">60a,60b:擴張側部</p>  
        <p type="p">62:第1空間</p>  
        <p type="p">64:第2空間</p>  
        <p type="p">66:缺口部</p>  
        <p type="p">X,X1,X2,Y,Y1,Y2,Z,Z1,Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2899" publication-number="202628520"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628520.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H05K5/10</main-classification>  
        <further-classification edition="200601120260327B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井嵩大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土本将孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIMOTO, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山裕亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠山貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYAMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之電子裝置（10），包含：第1電子單元（54）；第2電子單元（56），其具備複數個電路基板（36），並利用連接器（62）與第1電子單元連接；以及把持部（66），其設置於第2電子單元，將複數個電路基板連結，同時在往連接器的連接解除方向拉動第2電子單元時被把持。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">36:電路基板</p>  
        <p type="p">36P,36P1~36P3:電力電路基板</p>  
        <p type="p">56:電源單元</p>  
        <p type="p">58:連結構件</p>  
        <p type="p">62:第2單元間連接器</p>  
        <p type="p">66:把持部</p>  
        <p type="p">68,68A,68B,70,70A,70B:電源電路連接器</p>  
        <p type="p">72:托架</p>  
        <p type="p">74:連結構件</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">D3:第3方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2900" publication-number="202628530"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628530.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">H05K7/18</main-classification>  
        <further-classification edition="200601120260401B">H05K13/04</further-classification>  
        <further-classification edition="200601120260401B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井嵩大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土本将孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIMOTO, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山裕亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠山貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYAMA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之電子裝置（10），包含：第1構件（14），其具備第1連接器（48）；以及第2構件（18），其具備第2連接器（50）；第1構件，可沿著第1方向（Z）裝卸；第2構件，可沿著與第1方向正交的第2方向（X）裝卸；第1連接器，往沿著第1方向的方向以及沿著第2方向的方向的其中任一個方向均可插入第2連接器或從其拔出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">12:殼體</p>  
        <p type="p">14:第1構件</p>  
        <p type="p">16:電路基板</p>  
        <p type="p">18:第2構件</p>  
        <p type="p">20:風扇</p>  
        <p type="p">22:底板</p>  
        <p type="p">24:頂板</p>  
        <p type="p">26,28,30,32:側板</p>  
        <p type="p">34:前面面板</p>  
        <p type="p">36:電源連接器</p>  
        <p type="p">38:背面面板</p>  
        <p type="p">40:殼體空間</p>  
        <p type="p">42:控制基板</p>  
        <p type="p">44:部分殼體</p>  
        <p type="p">48:第1連接器</p>  
        <p type="p">50:第2連接器</p>  
        <p type="p">X,X1,X2,Y,Y1,Y2,Z,Z1,Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2901" publication-number="202626470"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626470.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卸載方法、卸載模組以及包括其的電子器件裝卸系統</chinese-title>  
        <english-title>UNLOADING METHOD, UNLOADING MODULE, AND ELECTRONIC DEVICE HANDLING SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">B65G49/05</main-classification>  
        <further-classification edition="200601120260302B">B65G49/07</further-classification>  
        <further-classification edition="202601120260302B">H10P72/30</further-classification>  
        <further-classification edition="202001120260302B">G01R31/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧熙範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOH, HEE BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YOUNG HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種卸載方法、卸載模組以及包括其的電子器件裝卸系統，可以迅速地將電子器件按照等級卸載到托盤。根據本發明的在電子器件裝卸系統中卸載測試完的電子器件的方法包括：托盤準備步驟，準備收納有多個電子器件的第一托盤以及按照等級收納所述電子器件的第二托盤；以及移送步驟，將所述電子器件按照等級從所述第一托盤向所述第二托盤移送。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an unloading method, an unloading module, and an electronic device handling system including the same, which can quickly unload electronic devices onto trays according to their grades. The method for unloading tested electronic devices in an electronic device handling system according to the present invention comprises: a tray preparation step, preparing a first tray for accommodating a plurality of electronic devices and a second tray for accommodating the electronic devices according to their grades; and a transfer step, transferring the electronic devices from the first tray to the second tray according to their grades.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S610:步驟</p>  
        <p type="p">S620:步驟</p>  
        <p type="p">S621:步驟</p>  
        <p type="p">S622:步驟</p>  
        <p type="p">S623:步驟</p>  
        <p type="p">S624:步驟</p>  
        <p type="p">S625:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2902" publication-number="202629023"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629023.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板及其製造方法</chinese-title>  
        <english-title>SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10W72/00</main-classification>  
        <further-classification edition="202601120260302B">H10W72/20</further-classification>  
        <further-classification edition="202601120260302B">H10W72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡迪群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, DYI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板包括第一TGV單元和第二TGV單元。第二TGV單元接合至第一TGV單元。第一TGV單元電性連接至第二TGV單元，以及位於第一TGV單元和第二TGV單元之間包括玻璃對玻璃接合介面和金屬對金屬接合介面的直接接合介面。亦提供基板的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate includes a first TGV unit and a second TGV unit. The second TGV unit is bonded to the first TGV unit. The first TGV unit is electrically connected to the second TGV unit, and a directly bonding interface including a glass-to-glass bonding interface and a metal-to-metal bonding interface is located between the first TGV unit and the second TGV unit. A manufacturing method of a substrate is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,100A,100B:TGV單元</p>  
        <p type="p">101A,101B:玻璃層</p>  
        <p type="p">103A,103B:導電連接件</p>  
        <p type="p">105A,105B:支撐塊</p>  
        <p type="p">106:正交投影方向</p>  
        <p type="p">107:直接接合介面</p>  
        <p type="p">107g:玻璃對玻璃接合介面</p>  
        <p type="p">107m:金屬對金屬接合介面</p>  
        <p type="p">EA,EB:擴大部分</p>  
        <p type="p">PA,PB:柱狀部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2903" publication-number="202627163"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627163.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成氮化硼薄膜的方法及包含該薄膜的半導體器件</chinese-title>  
        <english-title>METHOD FOR FORMING BORON NITIRIDE THIN FILM AND SEMICONDUCTOR DEVICE INCLUDING THE THIN FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/38</main-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="202601120260302B">H10P14/24</further-classification>  
        <further-classification edition="202601120260302B">H10P14/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商思科特利肯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK TRICHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾律</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONG RYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛晳熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, SEOK HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭洙鏞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, SOO YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴炳鋋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BYEONG YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴容主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴素永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SO YEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尙炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG KYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及形成氮化硼薄膜的方法、由該方法製備的氮化硼薄膜及包含所述薄膜的半導體器件，更詳細地，涉及利用具有低介電常數（low-k）特性的含氮及硼的前驅物來形成絕緣膜以形成用氮化硼薄膜的方法、由該方法製備的氮化硼薄膜及包含所述薄膜的半導體器件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2904" publication-number="202626830"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626830.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性組合物、硬化物、顯示元件、攝像元件、顯示裝置、攝像裝置、硬化物的製造方法及聚合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C08G18/32</main-classification>  
        <further-classification edition="200601120260302B">C08G18/83</further-classification>  
        <further-classification edition="200601120260302B">C08G73/06</further-classification>  
        <further-classification edition="200601120260302B">C08G73/10</further-classification>  
        <further-classification edition="200601120260302B">C08G75/30</further-classification>  
        <further-classification edition="200601120260302B">G03F7/004</further-classification>  
        <further-classification edition="200601120260302B">G03F7/027</further-classification>  
        <further-classification edition="200601120260302B">G03F7/031</further-classification>  
        <further-classification edition="200601120260302B">G03F7/032</further-classification>  
        <further-classification edition="200601120260302B">G03F7/038</further-classification>  
        <further-classification edition="200601120260302B">G03F7/20</further-classification>  
        <further-classification edition="200601120260302B">G03F7/40</further-classification>  
        <further-classification edition="200601120260302B">G02B1/04</further-classification>  
        <further-classification edition="200601120260302B">G02B3/00</further-classification>  
        <further-classification edition="200601120260302B">G02F1/1335</further-classification>  
        <further-classification edition="202501120260302B">H10F39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田博幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋池利之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIIKE, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性組合物及可容易獲得所述感光性組合物的聚合物，更提供一種硬化物、顯示元件、攝像元件、顯示裝置、攝像裝置及硬化物的製造方法，所述感光性組合物在通用性高的溶劑中的溶解性優異且可容易形成高折射率的硬化物。一種感光性組合物，包括成分（A）：包含下述式（1）所表示的結構的聚合物；成分（B）：光引發劑；以及成分（C）：具有乙烯性不飽和鍵的聚合性化合物。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="168px" width="270px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（1）中，R'為熱脫離性基）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2905" publication-number="202627464"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627464.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種基於多設備聯用的製劑內原輔料識別方法及系統</chinese-title>  
        <english-title>A METHOD AND SYSTEM FOR IDENTIFYING RAW MATERIALS AND EXCIPIENTS IN PREPARATIONS BASED ON THE COMBINED USE OF MULTIPLE DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260224B">G01N23/2251</main-classification>  
        <further-classification edition="201801120260224B">G01N23/2208</further-classification>  
        <further-classification edition="200601120260224B">G01N21/65</further-classification>  
        <further-classification edition="200601120260224B">G01N1/42</further-classification>  
        <further-classification edition="202201120260224B">G06V10/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江芥衡科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHEJIANG JIT MACROMETER COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許駿蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUNMENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李林森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, LINSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉俊鶴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JUNHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史豔陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種基於多設備聯用的製劑內原輔料識別方法及系統，方法包括對待分析的測試樣品的一截面進行冷凍拋光處理以獲得待測試截面；採用電子顯微鏡對待測試截面進行觀察以獲得待測試截面的電子顯微鏡圖像，並在待測試截面上確定一待測試區；採用能譜儀掃描待測試區以獲得能譜圖像；根據電子顯微鏡圖像和能譜圖像判斷測試樣品中是否具有特徵元素，若有特徵元素，則根據能譜圖像識別特徵元素；根據電子顯微鏡圖像和能譜圖像判斷測試樣品中是否具有匹配預設的形貌特徵的成分，若有匹配預設的形貌特徵的成分，則利用預先構建的卷積神經網路模型對電子顯微鏡圖像進行分析處理以識別匹配預設的形貌特徵的成分。本發明能夠更準確、更快速地識別待分析樣品中的成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention disclosure provides a method and system for identifying raw materials and excipients in preparations based on the combined use of multiple devices, wherein the method comprises freezing and polishing a section of a test sample to be analyzed to obtain a section to be tested; observing the section to be tested with an electron microscope to obtain electron microscope images of the section to be tested, and determining an area to be tested on the section to be tested; scanning the area to be tested with an energy spectrometer to obtain energy spectrum images; based on the electron microscope images and the energy spectrum images, determining whether there are characteristic elements in the test sample, and if there are characteristic elements, identifying the characteristic elements according to the energy spectrum images; based on the electron microscope images and the energy spectrum images, determining whether the test sample contains components that match preset morphological features, and if so, analyzing and processing the electron microscope images by using a pre-constructed convolutional neural network model to identify the components that match the preset morphological features, the method and system can identify components in the sample to be analyzed more accurately and rapidly.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2906" publication-number="202628405"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628405.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>消息提供方法、支援該方法的記錄介質及電子裝置</chinese-title>  
        <english-title>MESSAGE PROVIDING METHODS, RECORDING MEDIUM AND ELECTRONIC DEVICES SUPPORTING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260305B">H04L51/02</main-classification>  
        <further-classification edition="202201120260305B">H04L41/16</further-classification>  
        <further-classification edition="202301120260305B">G06N3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商連加股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINE PLUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芝水</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JISU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金壽英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SOOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李充雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUNGWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任道憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, DOHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本公開一實施例的由至少一個處理器執行的消息提供方法可包括：識別與基於即時消息應用程式的消息請求相關聯的事件的步驟；利用人工神經網路模型，從與存取即時消息應用程式的使用者帳戶相關聯的第一資訊中，獲得第二資訊的步驟，所述第二資訊與事件的識別時間點相關聯的上下文或與事件相關聯的提示中的至少一者相關聯；利用人工神經網路模型，基於第二資訊生成第一消息的步驟；以及透過與人工神經網路模型相關聯的即時消息應用程式的第一消息室，提供第一消息的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment disclosed herein, a message providing method executed by at least one processor may include: the step of identifying an event associated with a message request based on an instant messaging application; the step of utilizing an artificial neural network model to obtain second information from first information associated with a user account accessing the instant messaging application, wherein the second information is associated with at least one of the context associated with at the time of identifying the event or a cue associated with the event; the step of generating a first message based on the second information utilizing the artificial neural network model; and the step of providing the first message through a first message room of the instant messaging application associated with the artificial neural network model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一消息室</p>  
        <p type="p">11:第一消息</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">111:人工神經網路模型</p>  
        <p type="p">200:網路</p>  
        <p type="p">300:外部電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2907" publication-number="202626587"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626587.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可抑制近視進展的化合物的製備及用途</chinese-title>  
        <english-title>PREPARATION AND USES OF COMPOUNDS THAT CAN INHIBIT THE PROGRESSION OF MYOPIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07C69/612</main-classification>  
        <further-classification edition="200601120260401B">C07C233/47</further-classification>  
        <further-classification edition="200601120260401B">C07D311/20</further-classification>  
        <further-classification edition="200601120260401B">C07C323/56</further-classification>  
        <further-classification edition="200601120260401B">C07D213/30</further-classification>  
        <further-classification edition="200601120260401B">C07C403/20</further-classification>  
        <further-classification edition="200601120260401B">A61K31/216</further-classification>  
        <further-classification edition="200601120260401B">A61K31/353</further-classification>  
        <further-classification edition="200601120260401B">A61K31/198</further-classification>  
        <further-classification edition="200601120260401B">A61K31/265</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4406</further-classification>  
        <further-classification edition="200601120260401B">A61K31/275</further-classification>  
        <further-classification edition="200601120260401B">A61P27/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商瀋陽興齊眼藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENYANG XINGQI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉繼東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JI-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YONG-XU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈勁松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, JIN-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了式(I)化合物，或其同位素變體、互變異構物、立體異構物、前藥、多晶型物、水合物或溶劑合物，或其藥學上可接受的鹽。本發明還提供了所述化合物的製備方法、包含其的藥物組成物及其抑制近視進展的用途。 &lt;br/&gt;&lt;img align="absmiddle" height="129px" width="203px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are a compound of formula (I), or a isotopic variant, a tautomer, a stereoisomer, a prodrug, a polymorph, a hydrate or a solvate thereof, or a pharmaceutically acceptable salt thereof. Also provided herein are a method for preparing said compounds, pharmaceutical compositions comprising said compounds, and their use in inhibiting the progression of myopia. &lt;br/&gt;&lt;img align="absmiddle" height="112px" width="210px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2908" publication-number="202627487"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627487.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150893</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種光纖封裝測試裝置及測試方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">G01R1/04</main-classification>  
        <further-classification edition="202001120260302B">G01R31/26</further-classification>  
        <further-classification edition="200601120260302B">G01R31/28</further-classification>  
        <further-classification edition="200601120260302B">G01M11/00</further-classification>  
        <further-classification edition="200601120260302B">G02B6/42</further-classification>  
        <further-classification edition="202601120260302B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商無錫宏芯優科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧笙豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　楚強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　振強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光纖封裝測試裝置及測試方法，涉及矽光子測試技術領域，包括：封裝晶片，該封裝晶片設有光閘口；以及測試機，該測試機嵌設有光纖接口，該光纖接口與該光閘口對應設置，以將該封裝晶片的該光閘口對準該測試機的該光纖接口，完成該封裝晶片的測試。本發明提供的測試裝置及測試方法，可以實現在晶粒(chip or die)或CoWOS/SOIC/ASIC封裝後的測試，而且還能夠實現量產封裝測試生產。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝晶片</p>  
        <p type="p">20:測試機</p>  
        <p type="p">101:光閘口</p>  
        <p type="p">201:光纖接口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2909" publication-number="202627260"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627260.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150895</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>衣服處理設備</chinese-title>  
        <english-title>LAUNDRY TREATMENT APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260130B">D06F18/00</main-classification>  
        <further-classification edition="202001120260130B">D06F58/00</further-classification>  
        <further-classification edition="202001120260130B">D06F33/30</further-classification>  
        <further-classification edition="200601120260130B">D06F39/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商南京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周永飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YONGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦金寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, JINBAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳榮鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, RONGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作公開了一種衣服處理設備。衣服處理設備包括多個筒體和底座，多個筒體間隔設於底座，筒體的軸線相對於底座傾斜設置，筒體開設有投放口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a laundry treatment apparatus. The laundry treatment apparatus includes a plurality of drums and a base, where the plurality of drums are arranged at the base at intervals; an axis of each drum is disposed obliquely relative to the base, and each drum is provided with a loading opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:筒體</p>  
        <p type="p">410:投放口</p>  
        <p type="p">500:投放盒</p>  
        <p type="p">700:底座</p>  
        <p type="p">1300:防護罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2910" publication-number="202626962"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626962.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯胺樹脂組成物、聚醯胺成形體及電子設備的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08L77/06</main-classification>  
        <further-classification edition="200601120260401B">C08K5/13</further-classification>  
        <further-classification edition="200601120260401B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口彰太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鷲尾功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WASHIO, ISAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駒木良樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMAKI, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤友章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦上達宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URAKAMI, TATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚醯胺樹脂組成物，包含聚醯胺樹脂（A）以及酚系化合物（B），所述聚醯胺樹脂組成物中，所述酚系化合物（B）為選自由下述通式（1）所表示的三酚系化合物（B-1）及具有二環戊二烯來源的骨架的酚系化合物（B-2）所組成的群組中的至少一種： &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="347px" width="420px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;{式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;分別獨立地為氫原子、鹵素原子、碳數為1～5的烷基、或碳數為1～5的烷氧基}。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2911" publication-number="202628198"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628198.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>四極型質量分析裝置</chinese-title>  
        <english-title>QUADRUPOLE MASS ANALYZING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">H01J49/04</main-classification>  
        <further-classification edition="200601120260302B">H01J49/42</further-classification>  
        <further-classification edition="200601120260302B">H01J49/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBA STEC, CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮林志帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYABAYASHI, SHIHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹倉一志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKURA, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山川伶奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKAWA, RENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸田創太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIDA, SOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高倉洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAKURA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種四極型質量分析裝置。四極型質量分析裝置的離子源具有：燈絲，其被施加電壓而釋放電子；離子化箱，其供電子入射而使試樣離子化；以及阻斷構件，其設置在燈絲與離子化箱之間，並且阻斷會在離子化箱形成覆膜的覆膜形成物移動到離子化箱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a quadrupole mass analyzing apparatus. An ion source of a quadrupole mass analyzing apparatus includes: a filament that emits electrons when a voltage is applied to the filament; an ionization box that ionizes a sample when electrons enter the ionization box; and a blocking member that is placed between the filament and the ionization box, and blocks a film-forming material from moving toward the ionization box, the film-forming material being to form a film in the ionization box.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:四極型質量分析裝置</p>  
        <p type="p">2:感測器部</p>  
        <p type="p">21:離子源</p>  
        <p type="p">211:燈絲</p>  
        <p type="p">212:離子化箱</p>  
        <p type="p">213:低電位構件</p>  
        <p type="p">214:阻斷構件</p>  
        <p type="p">22:過濾部</p>  
        <p type="p">22P:對置電極</p>  
        <p type="p">23:檢測部</p>  
        <p type="p">24h:試樣導入口</p>  
        <p type="p">3:運算控制部</p>  
        <p type="p">31:數據處理部</p>  
        <p type="p">32:電壓控制部</p>  
        <p type="p">S1:離子化箱的第一面</p>  
        <p type="p">S2:離子化箱的第二面</p>  
        <p type="p">Sa:對置面</p>  
        <p type="p">h1:離子釋放開口部</p>  
        <p type="p">h2:電子入射開口部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2912" publication-number="202627587"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627587.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150934</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260304B">G02B7/02</main-classification>  
        <further-classification edition="200601120260304B">G02B13/00</further-classification>  
        <further-classification edition="202101120260304B">G03B17/00</further-classification>  
        <further-classification edition="202101120260304B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀志忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, ZHIZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕鈿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIDIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，包括一外罩、一鏡筒、及設置在鏡筒內的多個透鏡。其中，鏡筒的前端部包含一鏡筒物側開孔，鏡筒的後端部包含一鏡筒像側開孔，鏡筒物側開孔的內徑小於鏡筒像側開孔的內徑。外罩呈圓錐狀，設置於鏡筒的前端部的外表面。外罩包含一個外罩物側開孔與一外罩像側開孔，外罩物側開孔的最大外徑小於外罩像側開孔的最大外徑。外罩在光軸上的長度大於鏡筒光軸上的長度的40%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens includes an outer cover, a lens barrel, and a plurality of lens elements arranged in the lens barrel is provided. A front end part of the lens barrel includes a lens barrel object-side opening, and a back end part of the lens barrel includes a lens barrel image-side opening. The inner diameter of the lens barrel object-side opening is smaller than the inner diameter of the lens barrel image-side opening. The outer cover is cone-shaped and is disposed on an outer surface of the front end part of the lens barrel. The outer cover includes an outer cover object-side opening and an outer cover image -side opening. The maximum outer diameter of the outer cover object-side opening is smaller than the maximum outer diameter of the outer cover image-side opening. The length of the outer cover on an optical axis is greater than 40% of the length of the lens barrel on the optical axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">99:成像面</p>  
        <p type="p">100:光學成像鏡頭</p>  
        <p type="p">110:外罩</p>  
        <p type="p">120:鏡筒</p>  
        <p type="p">122:前端部</p>  
        <p type="p">124:後端部</p>  
        <p type="p">130:感壓膠</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">B:夾角</p>  
        <p type="p">D1,D2,Dinmax,Dinmin:內徑</p>  
        <p type="p">Dcvon,Dcvox,Dcv,Dbr:外徑</p>  
        <p type="p">D3,D4:長度</p>  
        <p type="p">Tcv:厚度</p>  
        <p type="p">Wbr:寬度</p>  
        <p type="p">E:參考平面</p>  
        <p type="p">I:光軸</p>  
        <p type="p">L:透鏡</p>  
        <p type="p">O11:外罩物側開孔</p>  
        <p type="p">O12:外罩像側開孔</p>  
        <p type="p">O21:鏡筒物側開孔</p>  
        <p type="p">O22:鏡筒像側開孔</p>  
        <p type="p">S11:外罩環形平面</p>  
        <p type="p">S12:內環圓錐面</p>  
        <p type="p">S13:外罩圓錐面</p>  
        <p type="p">S21:鏡筒環形平面</p>  
        <p type="p">S22:外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2913" publication-number="202627266"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627266.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔熱織物部件的設置/回收整合裝置</chinese-title>  
        <english-title>INTEGRATED APPARATUS FOR ATTACHING AND DISATTACHING THERMAL INSULATION FABRIC ELEMENTS ON TRAIN RAIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">E01B19/00</main-classification>  
        <further-classification edition="200601120260224B">E01B31/00</further-classification>  
        <further-classification edition="200601120260224B">F16L59/02</further-classification>  
        <further-classification edition="200601120260224B">B65H16/00</further-classification>  
        <further-classification edition="200601120260224B">B65H18/08</further-classification>  
        <further-classification edition="202401120260224B">B08B1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國鐵道技術硏究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOREA RAILROAD RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薑東勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, DONG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙瑉基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, MIN KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔水墉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SU YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔在昍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOE, JAE HEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樸柱燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JU YEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明一實施例的隔熱織物部件的設置/回收整合裝置包括：本體，具有預定面積並在軌道上行駛；第一設置/回收模組，結合於本體一側，用於對第一軌道進行隔熱織物的設置和回收處理；以及第二設置/回收模組，結合於本體另一側，用於對第二軌道進行隔熱織物的設置和回收處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated apparatus for attaching and detaching a thermal insulation fabric element on train rails according to one embodiment of the present invention includes: a main body having a predetermined area and configured to travel along rails; a first attaching/detaching module coupled to one side of the main body and configured to perform attachment and detachment of the thermal insulation fabric element with respect to a first rail; and a second attaching/detaching module coupled to the other side of the main body and configured to perform attachment and detachment of the thermal insulation fabric element with respect to a second rail.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:隔熱織物部件的設置/回收整合裝置</p>  
        <p type="p">100:本體</p>  
        <p type="p">200:第一設置/回收模組</p>  
        <p type="p">300:第二設置/回收模組</p>  
        <p type="p">400:控制器</p>  
        <p type="p">500:第一清潔模組</p>  
        <p type="p">600:第二清潔模組</p>  
        <p type="p">20:第一軌道</p>  
        <p type="p">30:第二軌道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2914" publication-number="202627128"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627128.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鈦合金材、高爾夫球桿用的桿面構材、桿面及高爾夫球桿</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">C22C14/00</main-classification>  
        <further-classification edition="200601120260319B">C22C1/02</further-classification>  
        <further-classification edition="200601120260319B">C22F1/18</further-classification>  
        <further-classification edition="201501120260319B">A63B53/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石黑雄也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIGURO, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國枝知德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNIEDA, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋一浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案的鈦合金材是由鈦合金所構成；其中，在平行於厚度方向及輥軋方向的剖面中，α相的面積分率為80%以上，在前述剖面中以面積分率包含：寬度方向及c軸方向所構成之角度為0°以上且30°以下的α相為50%以上；&lt;br/&gt; 前述剖面具有：&lt;br/&gt; 第1區域，是由KAM值為0.1以上並且前述寬度方向及c軸方向所構成之角度為0°以上且20°以下的α相所構成；及&lt;br/&gt; 第2區域，是由寬度方向及c軸方向所構成之角度為大於20°且為90°以下的α相所構成；&lt;br/&gt; 沿著前述剖面之厚度方向同時存在第1區域與第2區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2915" publication-number="202626559"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626559.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氮化鎵燒結體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C04B35/58</main-classification>  
        <further-classification edition="200601120260401B">C04B35/626</further-classification>  
        <further-classification edition="200601120260401B">C04B35/64</further-classification>  
        <further-classification edition="200601120260401B">C04B41/91</further-classification>  
        <further-classification edition="200601120260401B">C30B25/18</further-classification>  
        <further-classification edition="200601120260401B">C30B29/38</further-classification>  
        <further-classification edition="202601120260401B">H10P14/20</further-classification>  
        <further-classification edition="202601120260401B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東曹股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOSOH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾崎瑠来</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAKI, RUKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯浜準也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIHAMA, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠瀬好郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUSE, YOSHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>召田雅実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MESUDA, MASAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供氮化鎵燒結體及其製造方法中至少任一種；該氮化鎵燒結體，相較於以往之氮化鎵燒結體，表面更平滑，藉此能夠進行氮化鎵膜的磊晶成長。本實施型態之氮化鎵燒結體10，係具有：高密度層1、及面積密度小於此高密度層1之低密度層2；高密度層之面積密度係84.0面積%以上；且鎵相對於鎵及氮的合計之原子比例之Ga／（Ga＋N）比係0.55以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:高密度層</p>  
        <p type="p">2:低密度層</p>  
        <p type="p">10:氮化鎵燒結體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2916" publication-number="202627726"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627726.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體控制裝置、存儲介質和流體控制裝置的診斷方法</chinese-title>  
        <english-title>FLUID CONTROL APPARATUS, STORAGE MEDIUM, AND DIAGNOSTIC METHOD FOR FLUID CONTROL APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">G05D7/06</main-classification>  
        <further-classification edition="200601120260224B">G01F1/34</further-classification>  
        <further-classification edition="200601120260224B">G01L27/00</further-classification>  
        <further-classification edition="200601120260224B">G05B23/00</further-classification>  
        <further-classification edition="200601120260224B">F16K37/00</further-classification>  
        <further-classification edition="202201120260224B">G01F25/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBA STEC, CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樋口世治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGUCHI, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧尻興太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIJIRI, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德永和彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUNAGA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供流體控制裝置、存儲介質和流體控制裝置的診斷方法。診斷機構具有：閥洩漏差分計算部，計算閥洩漏差分，閥洩漏差分是表示由流體控制閥的閥洩漏引起的壓力變化的閥洩漏壓力變化模型與由上游側壓力感測器檢測到的上游側壓力或由下游側壓力感測器檢測到的下游側壓力的差分；感測器漂移差分計算部，計算感測器漂移差分，感測器漂移差分是表示由上游側壓力感測器或下游側壓力感測器的感測器漂移引起的壓力變化的感測器漂移壓力變化模型與由上游側壓力感測器檢測到的上游側壓力或由下游側壓力感測器檢測到的下游側壓力的差分；以及診斷部，比較閥洩漏差分與感測器漂移差分，診斷是流體控制閥的異常或是各壓力感測器的異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides fluid control apparatus, storage medium, and diagnostic method for fluid control apparatus. A diagnostic mechanism includes: a valve leak difference calculation unit that calculates a valve leak difference that is a difference between a valve leak pressure change model indicating a pressure change due to a valve leak of a fluid control valve and an upstream pressure detected by an upstream pressure sensor or a downstream pressure detected by a downstream pressure sensor; a sensor shift difference calculation unit that calculates a sensor shift difference that is a difference between a sensor shift pressure change model indicating a pressure change due to a sensor shift of the upstream pressure sensor or the downstream pressure sensor and the upstream pressure detected by the upstream pressure sensor or the downstream pressure detected by the downstream pressure sensor; and a diagnostic unit that compares the valve leak difference with the sensor shift difference to diagnose whether the fluid control valve is abnormal or whether each of the pressure sensors is abnormal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:流體控制裝置</p>  
        <p type="p">2:流道塊</p>  
        <p type="p">2R:內部流道</p>  
        <p type="p">21:導入口</p>  
        <p type="p">22:導出口</p>  
        <p type="p">3:流體控制設備</p>  
        <p type="p">31:壓力感測器</p>  
        <p type="p">31a:上游側壓力感測器</p>  
        <p type="p">31b:下游側壓力感測器</p>  
        <p type="p">32:流體控制閥</p>  
        <p type="p">33:流體阻力器</p>  
        <p type="p">4:運算控制裝置</p>  
        <p type="p">41:第一流量計算部</p>  
        <p type="p">42:閥控制部</p>  
        <p type="p">43:診斷機構</p>  
        <p type="p">431:第二流量計算部</p>  
        <p type="p">432:診斷用參數計算部</p>  
        <p type="p">433:診斷部</p>  
        <p type="p">434:閥洩漏壓力變化模型製作部</p>  
        <p type="p">435:閥洩漏差分計算部</p>  
        <p type="p">436:感測器漂移壓力變化模型製作部</p>  
        <p type="p">437:感測器漂移差分計算部</p>  
        <p type="p">P1:上游側壓力</p>  
        <p type="p">P2:下游側壓力</p>  
        <p type="p">Q1:第一流量</p>  
        <p type="p">Q2:第二流量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2917" publication-number="202627644"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627644.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有背光單元的顯示設備</chinese-title>  
        <english-title>DISPLAY APPARATUS HAVING A BACK-LIGHT UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">G02F1/13357</main-classification>  
        <further-classification edition="200601120260224B">G02F1/1335</further-classification>  
        <further-classification edition="200601120260224B">G02B6/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林基成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, KI SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐明源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, MYUNG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金基聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KISEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種包含背光單元的顯示設備。該背光單元可為液晶面板提供光。例如，該背光單元可包括在光學基板上並排設置的藍色光源（212）。顏色轉換片（240）可依序堆疊在藍色光源（212）上。顏色轉換片（240）可透過利用從藍色光源（212）發出的藍光來向各個方向發出除藍色以外的其他顏色的光。藍色光可透過顏色轉換片（240）而向各個方向分散。因此，在該顯示設備中，可以防止由於藍光與除藍色以外的其他顏色的光的傳播方向不同而產生的斑點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus including a back-light unit is provided. The back-light unit can provide light to a liquid crystal panel. For example, the back-light unit can include blue light-sources (212) disposed side by side on the optical substrate. A color conversion sheet (240) can be sequentially stacked on the blue light-sources (212). The color conversion sheet (240) can emit light of a color other than a blue color in all directions by using blue light emitted from the blue light-sources (212). The blue light can be diffused in all directions by the color conversion sheet (240). Thus, in the display apparatus, the occurrence of spots due to the difference in the travelling direction of the blue light and the light of a color other than the blue color can be prevented.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示面板</p>  
        <p type="p">101:第一線性偏光片</p>  
        <p type="p">102:第二線性偏光片</p>  
        <p type="p">251:分散片</p>  
        <p type="p">252:第一稜鏡片</p>  
        <p type="p">253:第二稜鏡片</p>  
        <p type="p">240:藍色發光片</p>  
        <p type="p">241:轉換片層</p>  
        <p type="p">242:紅色發光體</p>  
        <p type="p">243:綠色發光體</p>  
        <p type="p">230:藍色發光片</p>  
        <p type="p">231:發光片層</p>  
        <p type="p">232:藍色發光體</p>  
        <p type="p">220:遮光片</p>  
        <p type="p">221:遮光基板</p>  
        <p type="p">222:遮光圖案</p>  
        <p type="p">210:光源單元</p>  
        <p type="p">211:光源基板</p>  
        <p type="p">212:藍色光源</p>  
        <p type="p">213:反射圖案</p>  
        <p type="p">214:光源平坦化層</p>  
        <p type="p">K1:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2918" publication-number="202628765"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628765.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面顯示裝置</chinese-title>  
        <english-title>DOUBLE-SIDED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260310B">H10K59/128</main-classification>  
        <further-classification edition="200601120260310B">G02F1/061</further-classification>  
        <further-classification edition="200601120260310B">G09G3/18</further-classification>  
        <further-classification edition="200601120260310B">G09F9/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋智勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JIHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金忠孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, CHOONGHYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種雙面顯示裝置，其中第一像素區域與第二濾光區域重疊，第一濾光區域與第二像素區域重疊，且第一透光區域與第二透光區域重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a double-sided display device in which the first pixel area overlaps the second filter area, the first filter area overlaps the second pixel area, and the first transmissive area overlaps the second transmissive area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雙面顯示裝置</p>  
        <p type="p">11:第一顯示單元</p>  
        <p type="p">12:第二顯示單元</p>  
        <p type="p">COF1:第一撓性電路板</p>  
        <p type="p">COF2:第二撓性電路板</p>  
        <p type="p">DAM:壩</p>  
        <p type="p">FA1:第一濾光區域</p>  
        <p type="p">FA2:第二濾光區域</p>  
        <p type="p">FILL:填料</p>  
        <p type="p">L1:第一光</p>  
        <p type="p">L2:第二光</p>  
        <p type="p">PAD1:第一接墊部</p>  
        <p type="p">PAD2:第二接墊部</p>  
        <p type="p">PA1:第一像素區域</p>  
        <p type="p">PA2:第二像素區域</p>  
        <p type="p">PCB1:第一印刷電路板</p>  
        <p type="p">PCB2:第二印刷電路板</p>  
        <p type="p">SUB1:第一基板</p>  
        <p type="p">SUB2:第二基板</p>  
        <p type="p">TA1:第一透光區域</p>  
        <p type="p">TA2:第二透光區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2919" publication-number="202628424"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628424.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊編解碼方法和裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260305B">H04N19/50</main-classification>  
        <further-classification edition="201401120260305B">H04N19/82</further-classification>  
        <further-classification edition="201401120260305B">H04N19/105</further-classification>  
        <further-classification edition="201401120260305B">H04N19/132</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱志堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIH-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊政彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴貞延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHEN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江嫚書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, MAN-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳泓輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於自適應預測精化的視訊編解碼方法和裝置被披露。根據一種方法，確定多個與位置相關的權重（Position-Related Weights，簡稱PRW），其中每個PRW依賴於模板中的目標模板樣本的位置和/或當前區塊中每個預測樣本的位置。對當前區塊中的目標預測樣本導出SPO（基於樣本的預測偏移），該SPO包括由相應PRW加權的模板差值的總和。模板差值是基於模板樣本導出的。與當前區塊相關的編解碼參數被確定用於調整SPO。根據另一種方法，確定當前區塊的分類以在多個類中選擇目標類。當前區塊中目標預測樣本的SPO根據目標類導出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus of video coding for adaptive prediction refinement are disclosed. According to one method, multiple Position-Related Weights (PRWs) are determined, where each PRW is dependent on a position of a target template sample in the templates and/or a position of each of the prediction samples in the current block. An SPO (Sample-Based Prediction Offset) is derived for a target prediction sample in the current block comprising a sum of template differences weighted by respective PRWs. The template differences are derived based on the template samples. Coding parameters associated with the current block are determined for the target prediction sample are used to adjust the SPO. According to another method, classification for the current block to select a target class among multiple classes is determined. The SPO for a target prediction sample in the current block is derived according to the target class.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1110:步驟</p>  
        <p type="p">1120:步驟</p>  
        <p type="p">1130:步驟</p>  
        <p type="p">1140:步驟</p>  
        <p type="p">1150:步驟</p>  
        <p type="p">1160:步驟</p>  
        <p type="p">1170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2920" publication-number="202627741"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627741.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G06F1/16</main-classification>  
        <further-classification edition="200601120260317B">H05K7/14</further-classification>  
        <further-classification edition="200601120260317B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔昌熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, CHANGHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置可包括顯示模組和設置於顯示模組的背面的彎曲模組，彎曲模組配置成使顯示模組彎曲，且彎曲模組可包括包含凸輪軌道的凸輪，連接至顯示模組的角落的角落臂，角落臂配置成使顯示模組的角落彎曲，以及連接至角落臂的凸輪從動件，凸輪從動件配置成沿凸輪軌道運動並將凸輪的旋轉運動轉換為角落臂的線性運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device may include a display module, and a bending module disposed on a rear surface of the display module, the bending module being configured to bend the display module, and the bending module may include a cam wheel including a cam rail, a corner arm connected to a corner of the display module, the corner arm being configured to bend the corner of the display module, and a cam follower connected to the corner arm, the cam follower being configured to move along the cam rail and convert a rotational movement of the cam wheel into a linear movement of the corner arm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">DC1:第一角落</p>  
        <p type="p">DC2:第二角落</p>  
        <p type="p">DC3:第三角落</p>  
        <p type="p">DC4:第四角落</p>  
        <p type="p">DS1:第一側邊</p>  
        <p type="p">DS2:第二側邊</p>  
        <p type="p">100:顯示模組</p>  
        <p type="p">200:彎曲模組</p>  
        <p type="p">201:第一側臂</p>  
        <p type="p">205:第二側臂</p>  
        <p type="p">250:凸輪</p>  
        <p type="p">RC:旋轉中心</p>  
        <p type="p">231:第一角落臂</p>  
        <p type="p">232:第二角落臂</p>  
        <p type="p">233:第三角落臂</p>  
        <p type="p">234:第四角落臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2921" publication-number="202626678"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626678.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新型用於形成含金屬薄膜的前驅物及利用其形成含金屬薄膜的方法</chinese-title>  
        <english-title>NOVEL PRECURSOR FOR FORMING METAL-CONTAINING THIN FILM AND METHOD FOR FORMING METAL-CONTAINING THIN FILM USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C07F5/00</main-classification>  
        <further-classification edition="200601120260302B">C23C16/30</further-classification>  
        <further-classification edition="200601120260302B">C23C16/34</further-classification>  
        <further-classification edition="200601120260302B">C23C16/40</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="202601120260302B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商思科特利肯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK TRICHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金韓㔡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAN BYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳澣率</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HAN SOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴容主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳範錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, BEOM SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及新型用於形成含金屬薄膜的前驅物及利用其形成含金屬薄膜的方法，更詳細地，涉及如下新型用於形成含金屬薄膜的前驅物及利用其形成含金屬薄膜的方法：包含鑭系金屬、釔（Y）或鈧（Sc）作為中心金屬，可以藉由脒基（amidinate）配體中含有氟的新型化學結構形成高品質的薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2922" publication-number="202627921"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627921.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內容提供方法以及支持該方法的記錄介質及電子裝置</chinese-title>  
        <english-title>METHOD FOR PROVIDING CONTENT, AND RECORDING MEDIUM AND ELECTRONIC DEVICE SUPPORTING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">G06Q10/40</main-classification>  
        <further-classification edition="201301120260302B">G06F3/048</further-classification>  
        <further-classification edition="202001120260302B">G06F40/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商連加股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINE PLUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慶憙秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYUNG, HEESU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芝水</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JISU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金壽英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SOOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一實施例的內容提供方法可包括如下步驟：在即時通訊應用程式的運行過程中，識別電子裝置的相關的第一用戶帳號與至少一第一外部電子裝置的相關的至少一第二用戶帳號之間的關聯性分析的關聯事件；回應於識別到事件，獲取在第一用戶帳號與第二用戶帳號之間共用的消息資訊；利用人工神經網路模型，基於消息資訊分析第一用戶帳號與第二用戶帳號之間的關聯性；利用人工神經網路模型，基於關聯性的分析結果，將第二用戶帳號分組成至少一個組；以及利用人工神經網路模型，提供將第二用戶帳號的相關的組作為基礎的至少一個內容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for providing a content according to an embodiment of the present disclosure includes identifying, during execution of an instant messaging application, an event related to analysis of a relationship between a first user account associated with an electronic device and at least one second user account associated with at least one first external electronic device, obtaining, in response to identifying the event, message information shared between the first user account and the second user account, analyzing, by using an artificial neural network model, the relationship between the first user account and the second user account based on the message information, grouping, by using the artificial neural network model, the second user account into at least one group based on a result of the relationship analysis, and providing, by using the artificial neural network model, at least one content based on a group associated with the second user account.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:內容提供方法</p>  
        <p type="p">S910、S920、S930、S940、S950:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2923" publication-number="202628763"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628763.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260302B">H10K59/126</main-classification>  
        <further-classification edition="202301120260302B">H10K59/80</further-classification>  
        <further-classification edition="202301120260302B">H04N25/71</further-classification>  
        <further-classification edition="200601120260302B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李成秦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申東菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, DONGCHAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包含：基板，包含主動區域及位於主動區域外之非主動區域；感測器，設置於基板之主動區域的一部分下方；發光元件，位於基板之主動區域上，發光元件包含第一電極、位於第一電極上並包含發光層之中間層、及位於中間層上之第二電極；遮光岸堤，位於第一電極上且限定發光元件之發光區域；以及金屬塊，垂直延伸並在截面視角中被置於基板與發光元件之間，金屬塊設置成鄰近感測器並包含兩個或更多個金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a substrate including an active area and a non-active area outside the active area; a sensor disposed under a portion of the active area of the substrate; a light-emitting element on the active area of the substrate, the light-emitting element including a first electrode, an intermediate layer on the first electrode and including an emission layer, and a second electrode on the intermediate layer; a light-shielding bank on the first electrode and defining an emission area of the light-emitting element; and a metal block extending vertically and positioned between the substrate and the light-emitting element in a cross-sectional view, the metal block being disposed adjacent to the sensor and including two or more metal layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:基板</p>  
        <p type="p">1111:第一有機膜</p>  
        <p type="p">1112:第二有機膜</p>  
        <p type="p">112:第一遮光圖案</p>  
        <p type="p">113:第一主動層</p>  
        <p type="p">114:第一閘極電極</p>  
        <p type="p">141A,118A,152:上金屬層</p>  
        <p type="p">141B,118B,114A:下金屬層</p>  
        <p type="p">115:第一儲存電極</p>  
        <p type="p">116:第二儲存電極</p>  
        <p type="p">117:無機層間絕緣層</p>  
        <p type="p">118:第二閘極電極</p>  
        <p type="p">120,121,122,123,124,125,126,127,128:絕緣層</p>  
        <p type="p">131,132:平坦化層</p>  
        <p type="p">137:第二主動層</p>  
        <p type="p">141,142,143,144:源極-汲極電極</p>  
        <p type="p">151:連接電極</p>  
        <p type="p">160:發光元件</p>  
        <p type="p">161:第一電極</p>  
        <p type="p">162:中間層</p>  
        <p type="p">163:第二電極</p>  
        <p type="p">170:遮光岸堤</p>  
        <p type="p">170E:端線</p>  
        <p type="p">180:透明岸堤</p>  
        <p type="p">190:封裝層</p>  
        <p type="p">191:第一無機封裝層</p>  
        <p type="p">192:有機封裝層</p>  
        <p type="p">193:第二無機封裝層</p>  
        <p type="p">201:黑色矩陣</p>  
        <p type="p">202:彩色濾光片</p>  
        <p type="p">203:鈍化層</p>  
        <p type="p">BLM,BLM1,BLM2,BLM3:金屬塊</p>  
        <p type="p">Cst:儲存電容器</p>  
        <p type="p">CT1,CT2,CT3:孔</p>  
        <p type="p">PLN:平坦化層</p>  
        <p type="p">SS:感測器</p>  
        <p type="p">TA:透光區域</p>  
        <p type="p">T1:第一電晶體</p>  
        <p type="p">T2:第二電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2924" publication-number="202627096"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627096.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151233</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制ＭＵＣ５ＡＣ基因表現的ＲＮＡｉ劑及其應用</chinese-title>  
        <english-title>AN RNAI AGENT THAT INHIBITS MUC5AC GENE EXPRESSION AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/713</further-classification>  
        <further-classification edition="201701120260401B">A61K47/54</further-classification>  
        <further-classification edition="200601120260401B">A61P11/06</further-classification>  
        <further-classification edition="200601120260401B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京泰德製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING TIDE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙焰平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YAN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬方劼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, FANG-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佩遙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEI-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李博岩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BO-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種抑制MUC5AC基因表達的RNAi劑及其應用，並具體揭露了用於抑制MUC5AC基因表達的雙鏈RNA，包含其編碼核苷酸的載體、細胞、藥物組合物和試劑盒，以及利用該dsRNA、載體、細胞或藥物組合物來治療受試者中MUC5AC表現調節或相關的疾病或病症的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention discloses an RNAi agent that inhibits MUC5AC gene expression and use thereof, and specifically discloses a double-stranded RNA for inhibiting MUC5AC gene expression, a vector, a cell, a pharmaceutical composition and a kit containing the encoding nucleotides thereof , and a method for using the dsRNA, vector, cell or pharmaceutical composition to treat diseases or disorders mediated by or related to MUC5AC expression in subjects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2925" publication-number="202628190"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628190.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">H01J37/32</main-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩蒂什庫馬爾　潘迪揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATHISHKUMAR, PANDIYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭載杓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JAE PYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉道訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIL, DO HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種清洗部件的方法，該部件用於利用電漿來處理基板的設備並以暴露於上述電漿的方式配備。根據一實施例，可包括以下步驟：第1步驟，利用第1液去除在上述部件的表面形成的雜質；及第2步驟，在上述第1步驟之後，利用第2液改善上述部件的表面粗糙度(roughness)。因此，可去除在石英材質的電漿腔室的內壁形成的雜質，改善電漿腔室的內壁的粗糙度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:基板處理步驟</p>  
        <p type="p">S200:電漿腔室調理步驟</p>  
        <p type="p">S210:第1調理步驟</p>  
        <p type="p">S220:第2調理步驟</p>  
        <p type="p">S230:第3調理步驟</p>  
        <p type="p">S240:第4調理步驟</p>  
        <p type="p">S250:洩壓步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2926" publication-number="202628942"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628942.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151295</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腔室洩漏檢測方法、儲存在記錄媒體中的程式及基板處理設備</chinese-title>  
        <english-title>METHOD FOR DETECTING CHAMBER LEAKAGE, PROGRAM STORED IN RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260302B">H10P74/00</main-classification>  
        <further-classification edition="200601120260302B">G01N21/67</further-classification>  
        <further-classification edition="200601120260302B">G01M3/38</further-classification>  
        <further-classification edition="200601120260302B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹民秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, MIN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭載杓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JAE PYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池效貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, HYO JEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種檢測利用電漿來處理基板的腔室的洩漏的方法。腔室洩漏檢測方法可從在上述腔室所提供的空間中產生的光訊號，測量第1波長範圍的光強度、及與上述第1波長範圍不同的第2波長範圍的光強度，並將包括其偏差相關資訊的判斷對象資料與預先導出的基準資料進行比較，以檢測上述腔室的洩漏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:基準資料導出步驟</p>  
        <p type="p">S20:判斷對象資料導出步驟</p>  
        <p type="p">S30:腔室洩漏判斷步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2927" publication-number="202627394"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627394.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260226B">F28F3/02</main-classification>  
        <further-classification edition="200601120260226B">F28F9/26</further-classification>  
        <further-classification edition="200601120260226B">F28D1/03</further-classification>  
        <further-classification edition="200601120260226B">F28D7/04</further-classification>  
        <further-classification edition="202101120260226B">F25B41/40</further-classification>  
        <further-classification edition="200601120260226B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戒田理夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAIDA, MICHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之一態樣之冷卻裝置具備冷卻構件、及熱擴散器件。熱擴散器件為獨立於冷卻構件之構件。冷卻構件具有冷媒之流入口及流出口、及將流入口與流出口連通之第1容器。熱擴散器件具有工作液、及配置有工作液之第2容器。第2容器具有沿水平方向擴展之平板部、及從平板部延伸之圓柱部，第1容器於外表面具有凹陷之凹部，且圓柱部之至少一部分配置於凹部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:冷卻構件</p>  
        <p type="p">2:熱擴散器件</p>  
        <p type="p">10:第1容器</p>  
        <p type="p">10a,10b,10c,21a,21b:外表面</p>  
        <p type="p">11:流入口</p>  
        <p type="p">12:流出口</p>  
        <p type="p">13:內部空間</p>  
        <p type="p">14:凹部</p>  
        <p type="p">21:平板部</p>  
        <p type="p">22:圓柱部</p>  
        <p type="p">22a:前端</p>  
        <p type="p">25:毛細結構</p>  
        <p type="p">W:發熱體</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2928" publication-number="202628191"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628191.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理系統</chinese-title>  
        <english-title>SUBSTRATE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01J37/32</main-classification>  
        <further-classification edition="200601120260325B">H01J37/00</further-classification>  
        <further-classification edition="202601120260325B">H10P50/20</further-classification>  
        <further-classification edition="202601120260325B">H10P72/70</further-classification>  
        <further-classification edition="200601120260325B">H05H1/24</further-classification>  
        <further-classification edition="200601120260325B">C23C16/00</further-classification>  
        <further-classification edition="200601120260325B">C23C16/448</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謙德拉瑟哈蘭　拉密許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANDRASEKHARAN, RAMESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　肖恩　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, SHAUN TYLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崎山幸紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKIYAMA, YUKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德彬　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DURBIN, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨利　強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENRI, JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板處理系統包括氣體源、RF源、以及光源。氣體源供應第一氣體至基板處理系統的處理模組。當將第一氣體供應至基板處理系統的處理模組時，RF源供應RF功率至處理模組以產生電漿。光源係耦接至處理模組以於電漿產生期間將光導入處理模組中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing system includes a gas source, an RF source, and a light source. The gas source supplies a first gas to a process module of the substrate processing system. The RF source supplies RF power to the process module to generate plasma when the first gas is supplied to the process module of the substrate processing system. The light source is coupled to the process module to introduce light into the process module during the plasma generation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">354:光源</p>  
        <p type="p">356:控制器</p>  
        <p type="p">380:CCP腔室</p>  
        <p type="p">382:噴淋頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2929" publication-number="202627498"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627498.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>來自傳輸線感測器的射頻測量</chinese-title>  
        <english-title>RF MEASUREMENT FROM A TRANSMISSION LINE SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G01R15/18</main-classification>  
        <further-classification edition="200601120260325B">G01R15/14</further-classification>  
        <further-classification edition="200601120260325B">G01R19/00</further-classification>  
        <further-classification edition="200601120260325B">G01R19/165</further-classification>  
        <further-classification edition="200601120260325B">G01R19/25</further-classification>  
        <further-classification edition="200601120260325B">H01J37/32</further-classification>  
        <further-classification edition="200601120260325B">H03H7/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫姆　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMOU, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李曉璞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOPU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑佩德羅　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANPEDRO, MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文公開的具體實施例包括感測器。在一種具體實施例中，感測器包括：板，其中穿過板形成孔；電流迴路，電流迴路圍繞孔捲繞穿過板；和電壓環，電壓環圍繞孔並且在電流迴路的內周邊內，其中電壓環包括：內環；絕緣環，絕緣環圍繞內環；和外環，外環在絕緣環周圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein include a sensor. In an embodiment, the sensor comprises a board, wherein an aperture is formed through the board, a current loop winding through the board around the aperture, and a voltage ring around the aperture and within an inner perimeter of the current ‎loop, wherein the voltage ring comprises an interior ring, an insulator ring around the interior ring, and an exterior ring around the insulator ring.‎</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電漿處理工具</p>  
        <p type="p">120:電漿腔室</p>  
        <p type="p">122:陰極</p>  
        <p type="p">130:阻抗匹配網路</p>  
        <p type="p">132&lt;sub&gt;1-n&lt;/sub&gt;:電源</p>  
        <p type="p">134:處理模組</p>  
        <p type="p">151&lt;sub&gt;1-n&lt;/sub&gt;:感測器</p>  
        <p type="p">152:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2930" publication-number="202626215"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626215.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>破碎系統、固體原料之製造裝置，以及固體原料之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260331B">B09B3/00</main-classification>  
        <further-classification edition="202201120260331B">B09B3/35</further-classification>  
        <further-classification edition="202201120260331B">B09B3/32</further-classification>  
        <further-classification edition="200601120260331B">B29B17/00</further-classification>  
        <further-classification edition="200601120260331B">B29B9/06</further-classification>  
        <further-classification edition="200601120260331B">C10L5/48</further-classification>  
        <further-classification edition="200601120260331B">B01J2/20</further-classification>  
        <further-classification edition="200601120260331B">C10B53/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種破碎系統，係具備：破碎機，係具備原料接收口、切斷刃及破碎物排出口；覆蓋體，係將切斷刃與破碎物排出口之間之區域，自外部氣體阻斷；水蒸氣注入口，係設置於覆蓋體；以及水蒸氣供給裝置，係連接至水蒸氣注入口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:破碎系統</p>  
        <p type="p">10:破碎機</p>  
        <p type="p">11:料斗</p>  
        <p type="p">12:原料接收口</p>  
        <p type="p">13,14:切斷刃</p>  
        <p type="p">15:轉子</p>  
        <p type="p">16:篩網</p>  
        <p type="p">17:破碎物排出口</p>  
        <p type="p">18:推動器</p>  
        <p type="p">19:油壓缸</p>  
        <p type="p">20:覆蓋體</p>  
        <p type="p">21:第2覆蓋體</p>  
        <p type="p">30:水蒸氣注入口</p>  
        <p type="p">31:第2水蒸氣注入口</p>  
        <p type="p">32,33:配管</p>  
        <p type="p">34:水蒸氣供給裝置</p>  
        <p type="p">40:磁選機</p>  
        <p type="p">41:容器</p>  
        <p type="p">50,51:帶式輸送機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2931" publication-number="202627152"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627152.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>富烯基薄膜形成前體</chinese-title>  
        <english-title>FULVENE-BASED THIN FILM FORMATION PRECURSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">C23C16/18</main-classification>  
        <further-classification edition="200601120260128B">C23C16/30</further-classification>  
        <further-classification edition="200601120260128B">C09D109/00</further-classification>  
        <further-classification edition="200601120260128B">C07F7/10</further-classification>  
        <further-classification edition="200601120260128B">C23C22/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＴＳＰ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張弘錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, HONGSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的薄膜形成前體具有特定富烯基結構，在製備過程中具有反應性優異、能夠以高收率進行大規模生產且純度高的效果。此外，具有以下效果：在薄膜製備過程中，沉積效率優異，能夠在更寬的溫度範圍內形成薄膜，並且即使在這種寬溫度範圍內亦能夠製備熱穩定性優異的高品質薄膜。此外，具有以下效果：能夠製備在功函數特性、沉積速度特性、厚度均勻性特性、階梯覆蓋率特性等多種特性優異的薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2932" publication-number="202627602"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627602.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151370</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合透鏡</chinese-title>  
        <english-title>COMPOUND LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">G02B13/14</main-classification>  
        <further-classification edition="202101120260127B">G02B7/02</further-classification>  
        <further-classification edition="200601120260127B">G02B9/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王光儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUANG JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂宜隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, I LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧兆展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, JAU JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合透鏡包括六個同軸對準透鏡：（i）第一基板及第一透鏡，以及，按照距離其增加的順序且在其同一側上，（ii）第二透鏡、第二基板、第三透鏡、第三基板、第四透鏡、第五透鏡、第四基板及第六透鏡。第一透鏡及第五透鏡為負透鏡。第二透鏡及第四透鏡為正透鏡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A compound lens includes six coaxially aligned lenses: (i) a first substrate, and a first lens and, in order of increasing distance therefrom, and on a same side thereof, (ii) a second lens, a second substrate, a third lens, a third substrate, a fourth lens, a fifth lens, a fourth substrate and a sixth lens. The first lens and the fifth lens are negative lenses. The second lens and the fourth lens are positive lenses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:複合透鏡</p>  
        <p type="p">201:光軸</p>  
        <p type="p">210:第一透鏡</p>  
        <p type="p">211,222,232,241,252,261,271,282,2011,2012,2021,2022:表面</p>  
        <p type="p">212:第一透鏡表面</p>  
        <p type="p">220:第二透鏡</p>  
        <p type="p">221:第二透鏡表面</p>  
        <p type="p">230:第三透鏡</p>  
        <p type="p">231:第三透鏡表面</p>  
        <p type="p">240:第四透鏡</p>  
        <p type="p">242:第四透鏡表面</p>  
        <p type="p">250:第五透鏡</p>  
        <p type="p">251:第五透鏡表面</p>  
        <p type="p">260:第六透鏡</p>  
        <p type="p">262:第六透鏡表面</p>  
        <p type="p">270:第一基板</p>  
        <p type="p">272:第一平面</p>  
        <p type="p">280:第二基板</p>  
        <p type="p">281:第二平面</p>  
        <p type="p">290:第三基板</p>  
        <p type="p">291:第三平面</p>  
        <p type="p">292:第四平面</p>  
        <p type="p">299:像平面</p>  
        <p type="p">2000:第四基板</p>  
        <p type="p">2001:第五平面</p>  
        <p type="p">2002:第六平面</p>  
        <p type="p">2010:濾光片</p>  
        <p type="p">2020:蓋玻璃</p>  
        <p type="p">ST:光闌</p>  
        <p type="p">TTL:總軌道長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2933" publication-number="202625939"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625939.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151380</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童載具</chinese-title>  
        <english-title>CHILID CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260226B">A47D13/04</main-classification>  
        <further-classification edition="200601120260226B">B62B1/10</further-classification>  
        <further-classification edition="200601120260226B">B60N2/26</further-classification>  
        <further-classification edition="200601120260226B">B60N2/28</further-classification>  
        <further-classification edition="201801120260226B">B60N2/90</further-classification>  
        <further-classification edition="200601120260226B">B62B9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪爾學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ERXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫明星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, MINGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兒童載具包括載具本體和座部移動裝置。該座部移動裝置包括：座部、驅動機構和傳動機構。座部能移動地支撐在載具本體上。驅動機構與座部耦合並能夠驅使座部移動。驅動機構借助傳動機構驅動座部。由於兒童載具的座部能夠自動調整至合適安全的位置，提高了兒童載具的使用便利性和功能性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child carrier includes a carrier body and a seat moving device. The seat moving device includes a seat, a driving mechanism, and a transmission mechanism. The seat is movably supported on the carrier body. The driving mechanism is coupled with the seat and may drive the seat to move. The driving mechanism drives the seat through the transmission mechanism. Since the seat of the child carrier is automatically adjustable to a suitable and safe position, the convenience and functionality of the child carrier may be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:兒童載具</p>  
        <p type="p">100:載具本體</p>  
        <p type="p">110:第一座管</p>  
        <p type="p">130:側扶手</p>  
        <p type="p">200:座部移動裝置</p>  
        <p type="p">210:座部</p>  
        <p type="p">220:驅動機構</p>  
        <p type="p">240:第一控制盒</p>  
        <p type="p">300:把手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2934" publication-number="202627370"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627370.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151386</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260226B">F25B41/40</main-classification>  
        <further-classification edition="202101120260226B">F25B41/36</further-classification>  
        <further-classification edition="202101120260226B">F25B41/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴岡恭生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUOKA, YASUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種冷卻系統，構成簡易，能夠依據冷媒之溫度自主地調整冷媒之流量。實施方式之一形態之冷卻系統，包含調整閥。調整閥設置於循環流路中之冷媒之返路且調整冷媒之流量，所述循環流路供冷媒在安裝於冷卻對象裝置之冷卻板與冷媒循環裝置之間循環，所述返路供冷媒從冷卻板向冷媒循環裝置流動。調整閥包含：可動栓及形狀記憶合金構件。可動栓調整流經返路之冷媒之流量。形狀記憶合金構件於返路中之冷媒的溫度上升時，變為使可動栓移動至增大冷媒的流量之位置的形狀，於冷媒的溫度返回至上升前之溫度時，變為使可動栓返回至增大冷媒的流量前之位置的形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:冷卻系統</p>  
        <p type="p">3:冷卻對象裝置</p>  
        <p type="p">4:冷卻板</p>  
        <p type="p">5:循環流路</p>  
        <p type="p">6:調整閥</p>  
        <p type="p">7:冷卻塔</p>  
        <p type="p">10:冷媒循環裝置</p>  
        <p type="p">11:泵單元</p>  
        <p type="p">12:熱交換器</p>  
        <p type="p">51:返路</p>  
        <p type="p">52:去路</p>  
        <p type="p">53:冷媒供給流路</p>  
        <p type="p">54:冷媒去路</p>  
        <p type="p">55:冷媒返路</p>  
        <p type="p">56:冷媒回流流路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2935" publication-number="202625923"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625923.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腳尖站立姿勢穩定用輔助工具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">A43B5/12</main-classification>  
        <further-classification edition="200601120260330B">A43B23/08</further-classification>  
        <further-classification edition="200601120260330B">A43B17/00</further-classification>  
        <further-classification edition="202201120260330B">A43B7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商舞動樂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANCINGFUN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長岐裕之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAKI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種腳尖站立姿勢穩定用輔助工具，其能夠實現進行被要求將指尖向腳的腳背側彎曲的腳尖站立姿勢的表演、比賽的陸地運動整體的由姿勢穩定化所帶來的運動能力的提高、以及腳的疼痛的減輕乃至消失、改善效果。在襪子狀的主體部（2）設置有下布（2a），做為與輔助對象的腳的底面的第一蹠骨至第三蹠骨的前端部重疊的片狀底部，在主體部（2）佩戴狀態下採取將指尖向腳的腳背側彎曲的腳尖站立姿勢時，在下布（2a）的上表面側，在第一蹠骨至第三蹠骨的前端部所接近的位置的至少一處設置有用於填補第一蹠骨至第三蹠骨中的至少兩根蹠骨的前端部到接地面的距離之差的墊（1），墊（1）具備：具有前端帶有圓角的銳角狀的角部的輪廓、和由恆定厚度構成的平面部或者厚度不同的至少兩個平面部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:腳尖站立姿勢穩定用輔助工具</p>  
        <p type="p">1:墊</p>  
        <p type="p">1C:角部</p>  
        <p type="p">2:主體部</p>  
        <p type="p">2a:下布</p>  
        <p type="p">2b:上布</p>  
        <p type="p">2P:墊插入用口袋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2936" publication-number="202626937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151408</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面保護用組成物及表面保護膜</chinese-title>  
        <english-title>SURFACE PROTECTIVE COMPOSITION AND SURFACE PROTECTIVE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260304B">C08L33/08</main-classification>  
        <further-classification edition="202201120260304B">C09K23/20</further-classification>  
        <further-classification edition="200601120260304B">C09D5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹中愛美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKENAKA, MANAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒添弘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAZOE, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種表面保護用組成物，其中藉由下述方法1而得的水接觸角X&lt;sub&gt;1&lt;/sub&gt;與藉由下述方法2而得的水接觸角X&lt;sub&gt;2&lt;/sub&gt;的差（X&lt;sub&gt;1&lt;/sub&gt;-X&lt;sub&gt;2&lt;/sub&gt;）為10°以上。（方法1）在基材上形成包含所述表面保護用組成物的膜1。接下來，依據JIS R3257：1999，將純化水滴加至所述膜1，測定剛滴加後的所述膜1的水接觸角，並將其設為水接觸角X&lt;sub&gt;1&lt;/sub&gt;。（方法2）以與（方法1）同樣的方式獲得膜1。在照度20 mW/cm&lt;sup&gt;2&lt;/sup&gt;、照射時間150秒、累積光量3000 mJ/cm&lt;sup&gt;2&lt;/sup&gt;的條件下，使用高壓水銀燈對所獲得的所述膜1照射光，獲得膜2。接下來，依據JIS R3257：1999，測定自將純化水滴加至所述膜2起60秒後的所述膜2的水接觸角，並將其設為水接觸角X&lt;sub&gt;2&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface protective composition in which the difference (X&lt;sub&gt;1&lt;/sub&gt; - X&lt;sub&gt;2&lt;/sub&gt;) between a water contact angle X&lt;sub&gt;1&lt;/sub&gt; obtained by Method 1 set forth below and a water contact angle X&lt;sub&gt;2&lt;/sub&gt; obtained by Method 2 set forth below is 10 degrees or greater. Method 1: A film 1 including the surface protective composition is formed on a substrate. Next, in accordance with JIS R3257:1999, purified water is dropped onto the film 1, the water contact angle of the film 1 immediately after the dropping is measured, and that value is designated as the water contact angle X&lt;sub&gt;1&lt;/sub&gt;. Method 2: A film 1 is obtained in the same manner as in Method 1. The obtained film 1 is irradiated with light using a high-pressure mercury lamp under conditions of irradiance of 20 mW/cm&lt;sup&gt;2&lt;/sup&gt;, irradiation time of 150 seconds, and a cumulative light dose of 3000 mJ/cm&lt;sup&gt;2&lt;/sup&gt;, thereby obtaining a film 2. Next, in accordance with JIS R3257:1999, the water contact angle of the film 2 is measured 60 seconds after dropping of purified water onto the film 2, and that value is designated as the water contact angle X&lt;sub&gt;2&lt;/sub&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2937" publication-number="202627219"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627219.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151409</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔及其製造方法</chinese-title>  
        <english-title>COPPER FOIL AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260116B">C25B9/30</main-classification>  
        <further-classification edition="200601120260116B">C01G3/10</further-classification>  
        <further-classification edition="200601120260116B">C22C9/00</further-classification>  
        <further-classification edition="200601120260116B">C25D1/04</further-classification>  
        <further-classification edition="200601120260116B">H01M4/64</further-classification>  
        <further-classification edition="201801120260116B">C09D7/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉日煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, ILHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，所述銅箔包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔具有1.1%以下的熱重量係數。熱重量係數係使用熱重分析儀（TGA）於氧氣氣氛中量測，並以10℃/分鐘的速率從25℃量測至800℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has a thermal gravimetric coefficient of 1.1% or less. The thermal gravimetric coefficient is measured using a thermogravimetric analyzer (TGA) in an oxygen atmosphere, and is measured at a rate of 10℃/min from 25℃ to 800℃.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2938" publication-number="202627120"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627120.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151410</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260127B">C22C9/00</main-classification>  
        <further-classification edition="200601120260127B">C25D1/04</further-classification>  
        <further-classification edition="200601120260127B">C09K13/04</further-classification>  
        <further-classification edition="200601120260127B">C11D1/66</further-classification>  
        <further-classification edition="202201120260127B">C09K23/18</further-classification>  
        <further-classification edition="200601120260127B">B29C41/26</further-classification>  
        <further-classification edition="201001120260127B">H01M4/1395</further-classification>  
        <further-classification edition="200601120260127B">B32B15/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉日煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, ILHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，所述銅箔包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔具有1.005%以下的熱重量係數。熱重量係數係使用熱重分析儀（TGA）於氮氣氣氛中量測，並以10℃/分鐘的速率從25℃量測至800℃。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has a thermal gravimetric coefficient of 1.005% or less. The thermal gravimetric coefficient is measured using a thermogravimetric analyzer (TGA) in a nitrogen atmosphere, and is measured at a rate of 10℃/min from 25℃ to 800℃.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2939" publication-number="202627225"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627225.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">C25D1/04</main-classification>  
        <further-classification edition="200601120260224B">C25D3/38</further-classification>  
        <further-classification edition="200601120260224B">C25D5/48</further-classification>  
        <further-classification edition="200601120260224B">H01M4/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉日煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, ILHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，所述銅箔包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔具有1.5 mW以下的最大功率差。最大功率差係藉由差示掃描量熱法（DSC）量測並以10℃/分鐘的速率從20℃量測至500℃，且表示最大功率值與在室溫下的功率值之間的差值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has a maximum power difference of 1.5 mW or less. The maximum power difference is measured by differential scanning calorimetry (DSC) and is measured at a rate of 10℃/min from 20℃ to 500℃, and means the difference between the maximum power value and the power value at room temperature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2940" publication-number="202627226"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627226.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151412</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">C25D1/04</main-classification>  
        <further-classification edition="202101120260224B">C25B11/052</further-classification>  
        <further-classification edition="200601120260224B">H01M4/66</further-classification>  
        <further-classification edition="200601120260224B">C22C9/00</further-classification>  
        <further-classification edition="200601120260224B">B32B15/04</further-classification>  
        <further-classification edition="200601120260224B">C25D5/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉日煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, ILHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，所述銅箔包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔具有10至30 Gpa的壓縮彈性應變指數。壓縮彈性應變指數係使用奈米壓痕儀量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has a compressive elastic strain index of 10 to 30 GPa. The compressive elastic strain index is measured using a nano-indenter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2941" publication-number="202627227"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627227.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">C25D1/04</main-classification>  
        <further-classification edition="200601120260224B">C25D3/38</further-classification>  
        <further-classification edition="200601120260224B">C25D5/48</further-classification>  
        <further-classification edition="200601120260224B">H01M4/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔具有2.0至6.0%的壓痕蠕變率。壓痕蠕變率係使用奈米壓痕儀量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has an indentation creep rate of 2.0 to 6.0%. The indentation creep rate is measured using a nano-indenter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2942" publication-number="202627228"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627228.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">C25D1/04</main-classification>  
        <further-classification edition="202101120260224B">C25B11/052</further-classification>  
        <further-classification edition="200601120260224B">H01M4/66</further-classification>  
        <further-classification edition="200601120260224B">C22C9/00</further-classification>  
        <further-classification edition="200601120260224B">G01N23/203</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中當相鄰的多個像素之間的方向差為5°以上的邊界被視為晶粒邊界時，具有在0°以上且小於2°的範圍內的室溫GOS值的多個晶粒（包含多個孿晶）的面積比為總截面積的45%至95%。室溫GOS值係使用電子背向散射繞射（EBSD）圖案分析儀於室溫下對銅箔的截面進行量測而得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein when the boundary in which an orientation difference between adjacent pixels is 5° or more is considered as a crystal grain boundary, the area ratio of crystal grains (including twins) having a room-temperature GOS value in a range of 0° or more and less than 2° is 45% to 95% of the total cross-sectional area. The room-temperature GOS value is measured at room temperature for a cross-section of the copper foil using electron backscatter diffraction (EBSD) pattern analyzer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2943" publication-number="202627229"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627229.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">C25D1/04</main-classification>  
        <further-classification edition="200601120260224B">C25D3/38</further-classification>  
        <further-classification edition="200601120260224B">C25D5/48</further-classification>  
        <further-classification edition="200601120260224B">H01M4/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中當相鄰的多個像素之間的方向差為5°以上的邊界被視為晶粒邊界時，具有在0°以上且小於2°的範圍內的高溫GOS值的多個晶粒（包含多個孿晶）的面積比為總截面積的45%至93%。高溫GOS值係使用電子背向散射繞射（EBSD）圖案分析儀在銅箔在190°C下經熱處理一小時後對銅箔的截面進行量測而得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein when the boundary in which an orientation difference between adjacent pixels is 5° or more is considered as a grain boundary, the area ratio of crystal grains (including twins) having a high-temperature GOS value in the range of 0° or more and less than 2° is 45% to 93% of the total cross-sectional area. The high-temperature GOS value is measured for a cross-section of the copper foil using an electron backscatter diffraction (EBSD) pattern analyzer after the copper foil is heat-treated at 190°C for an hour.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2944" publication-number="202627224"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627224.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔及其製造方法</chinese-title>  
        <english-title>COPPER FOIL AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260226B">C25B11/052</main-classification>  
        <further-classification edition="200601120260226B">C25D1/04</further-classification>  
        <further-classification edition="200601120260226B">H01M4/66</further-classification>  
        <further-classification edition="200601120260226B">C22C9/00</further-classification>  
        <further-classification edition="200601120260226B">C08L83/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉日煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, ILHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，所述銅箔包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔具有0.7立方公分/(平方公尺·天·大氣壓)以下的氧氣透過率。氧氣透過率係根據ASTM D3985使用透過率量測裝置進行量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has an oxygen permeability of 0.7 cc/(m&lt;sup&gt;2&lt;/sup&gt;∙day∙atm) or less. The oxygen permeability is measured using a permeability measuring device according to ASTM D3985.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2945" publication-number="202627202"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627202.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">C23C22/24</main-classification>  
        <further-classification edition="200601120260224B">C23C22/26</further-classification>  
        <further-classification edition="200601120260224B">C25D1/04</further-classification>  
        <further-classification edition="202101120260224B">C25B11/052</further-classification>  
        <further-classification edition="200601120260224B">H01M4/66</further-classification>  
        <further-classification edition="200601120260224B">C22C9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種具有第一表面及第二表面的銅箔，並包含具有面向第一表面的霧面表面及面向第二表面的亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔在第一表面上具有1.0至30.0的鏡面反射率。鏡面反射率係指從包含鏡面成分（SCI）模式下量測的亮度指數中減去排除鏡面成分（SCE）模式下量測的亮度指數所得的值，並使用色差計進行量測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil having a first surface and a second surface and including a copper film having a matte surface facing the first surface and a shiny surface facing the second surface; and a protective layer disposed on the copper film, wherein the copper foil has a specular reflectivity of 1.0 to 30.0 on the first surface. The specular reflectivity refers to a value obtained by subtracting a brightness index measured in a specular component excluded (SCE) mode from a brightness index measured in a specular component included (SCI) mode, and is measured using a colorimeter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">111a:霧面表面</p>  
        <p type="p">111b:亮面表面</p>  
        <p type="p">112:保護層</p>  
        <p type="p">S1:第一表面</p>  
        <p type="p">S2:第二表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2946" publication-number="202627230"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627230.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅箔</chinese-title>  
        <english-title>COPPER FOIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260224B">C25D1/04</main-classification>  
        <further-classification edition="200601120260224B">C25D3/38</further-classification>  
        <further-classification edition="200601120260224B">C25D5/48</further-classification>  
        <further-classification edition="200601120260224B">H01M4/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＳＫ納力世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK NEXILIS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SHAN HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金太映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例提供一種銅箔，包含具有霧面表面及亮面表面的銅薄膜，以及設置於銅薄膜上的保護層，其中銅箔具有在4°至12°的範圍內的室溫GOS值。室溫GOS值係使用電子背向散射繞射（EBSD）圖案分析儀於室溫下對銅箔的截面進行量測而得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One embodiment of the present disclosure provides a copper foil including a copper film having a matte surface and a shiny surface; and a protective layer disposed on the copper film, wherein the copper foil has a room-temperature GOS value in the range of 4° to 12°. The room-temperature GOS value is measured at room temperature for a cross-section of the copper foil using an electron backscatter diffraction (EBSD) pattern analyzer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:銅箔</p>  
        <p type="p">111:銅薄膜</p>  
        <p type="p">112:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2947" publication-number="202627169"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627169.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣態氧化氫生成組件、以及具備其的基板處理裝置</chinese-title>  
        <english-title>GASEOUS HYDROGEN OXIDE GENERATING ASSEMBLY AND SUBSTRATE PROCESSING APPARATUS HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">C23C16/44</main-classification>  
        <further-classification edition="200601120260302B">C23C16/448</further-classification>  
        <further-classification edition="200601120260302B">C23C16/455</further-classification>  
        <further-classification edition="202601120260302B">H10P70/00</further-classification>  
        <further-classification edition="202601120260302B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＨＰＳＰ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HPSP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白承鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, SEUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金周浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JOO HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹寭晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HYESEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種氣態氧化氫生成組件、以及具備其的基板處理裝置。該氣態氧化氫生成組件可以包括汽化模組及流體供給模組。該汽化模組可以被形成為將液態氧化氫轉換為氣態氧化氫。該流體供給模組可包括第一管路，該第一管路被形成為在第一動作模式下將該液態氧化氫供給至該汽化模組。該流體供給模組可被形成為在第二動作模式下，利用排出流體將該液態氧化氫的殘留物排放至排水口。該殘留物可為於該第一動作模式中產生，並殘留於該第一管路中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a gaseous hydrogen oxide generating assembly and a substrate processing apparatus having the same. The gaseous hydrogen oxide generating assembly may include a vaporization module and a fluid supply module. The vaporization module may be configured to convert liquid hydrogen oxide into gaseous hydrogen oxide. The fluid supply module may include a first pipeline configured to supply the liquid hydrogen oxide to the vaporization module in a first operating mode. The fluid supply module may be configured to discharge any residue of the liquid hydrogen oxide to a drain outlet using an exhaust fluid in a second operating mode. This residue may be generated in the first operating mode and remain in the first pipeline.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:外部腔室</p>  
        <p type="p">160:汽化模組</p>  
        <p type="p">200:流體供給模組</p>  
        <p type="p">210:第一管路</p>  
        <p type="p">220:第二管路</p>  
        <p type="p">230:第三管路</p>  
        <p type="p">240:第四管路</p>  
        <p type="p">250:第一切換閥</p>  
        <p type="p">260:第五管路</p>  
        <p type="p">265:逆流防止閥</p>  
        <p type="p">270:第二切換閥</p>  
        <p type="p">D:排水口</p>  
        <p type="p">P:幫浦</p>  
        <p type="p">T:氣體儲槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2948" publication-number="202627306"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627306.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>葉輪及軸流風扇</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260226B">F04D19/00</main-classification>  
        <further-classification edition="200601120260226B">F04D25/08</further-classification>  
        <further-classification edition="200601120260226B">F04D29/32</further-classification>  
        <further-classification edition="200601120260226B">F04D29/38</further-classification>  
        <further-classification edition="200601120260226B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹本心路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMOTO, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種葉輪，其具有：中心部，其繞沿軸向延伸之中心軸旋轉；及複數個葉片，其等自前述中心部之外周面沿徑向突出且沿周向間隔配置；前述葉片藉由繞前述中心軸旋轉而產生沿軸向流動之風，於至少一個前述葉片中之包含前述中心軸並沿徑向延伸之至少一個剖面中，軸向寬度隨著自徑向內側向徑向外側先增加後減少。以軸向一側為吸氣側，前述剖面中之軸向一側之邊緣具有向軸向一側突出之凸形。前述剖面於沿軸向觀察時與前述葉片之徑向內緣相交。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:葉輪</p>  
        <p type="p">31:中心部</p>  
        <p type="p">32A:葉片</p>  
        <p type="p">321:徑向內緣</p>  
        <p type="p">322:徑向外緣</p>  
        <p type="p">Da:軸向一側</p>  
        <p type="p">Db:軸向另一側</p>  
        <p type="p">F1,F2:流動</p>  
        <p type="p">Pc:中心位置</p>  
        <p type="p">Pw:徑向位置</p>  
        <p type="p">W:軸向寬度</p>  
        <p type="p">Wmax:最大軸向寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2949" publication-number="202628426"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628426.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影片編碼的方法和裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS OF VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260305B">H04N19/52</main-classification>  
        <further-classification edition="201401120260305B">H04N19/593</further-classification>  
        <further-classification edition="201401120260305B">H04N19/105</further-classification>  
        <further-classification edition="201401120260305B">H04N19/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊政彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱志堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIH-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種用於預測細化的影片編碼方法和裝置，使用基於迴歸的方法來提高編碼效率，其中預測細化是基於包含一個或多個殘差項的輸入信號導出的。根據一種方法，確定與當前塊的一組鄰近位置相關的一組殘差項。為一線性方程式獲取一個或多個權重參數，其中該一個或多個權重參數與一基於迴歸之模型相關。根據包含所獲取之該一個或多個權重參數和該組殘差項的該線性方程式，決定一目標預測樣本之一預測細化。使用該預測細化來細化該目標預測樣本以生成一細化預測樣本。使用包含該細化預測樣本的預測來編碼或解碼該當前塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus of video coding for prediction refinement using regression-based method to improve coding efficiency are disclosed, where the prediction refinement is derived based on input signals comprising one or more residual terms. According to one method, a set of residual terms associated with a set of neighbouring positions of the current block are determined. One or more weight parameters are obtained for a linear equation, wherein the one or more weight parameters are associated with a regression-based model. Prediction refinement for a target prediction sample is determined according to the linear equation comprising the obtained one or more weight parameters and the set of residual terms. The target prediction sample is refined using the prediction refinement to generate a refined prediction sample. The current block is encoded or decoded by using prediction comprising the refined prediction sample.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1210~1260:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2950" publication-number="202626679"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626679.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151519</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＹＯ薄膜的製造方法、半導體製造用部件的保護塗層材料形成方法及半導體製造用部件</chinese-title>  
        <english-title>Y2O3 THIN FILM HAVING PLASMA ETCHING RESISTANCE AND ITS MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F5/00</main-classification>  
        <further-classification edition="200601120260401B">C23C16/40</further-classification>  
        <further-classification edition="200601120260401B">C23C16/455</further-classification>  
        <further-classification edition="202601120260401B">H10P50/20</further-classification>  
        <further-classification edition="202601120260401B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商智慧化工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>釜山大學校産學協力團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商氣世化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鉉昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權世薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, SE HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;薄膜的製造方法、半導體製造用部件的保護塗層材料形成方法以及半導體製造用部件。本發明的目的在於提供一種可針對氟碳基高密度等離子體呈現出抗性的Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;薄膜的製造方法。根據上述目的，本發明使用雙(甲基環戊二烯基)(N'-異丙基-N-正丙基乙脒基)釔（Bis(methylcyclopentadienyl)(N'-isopropyl-N-n-propylacetamidinate)Yttrium;Y(MeCp)&lt;sub&gt;2&lt;/sub&gt;(iPr-nPrAMD)）作為前驅體來製造ALD-Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2951" publication-number="202627084"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627084.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新型工程裂解酶及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C12N9/88</main-classification>  
        <further-classification edition="200601120260401B">A61K38/51</further-classification>  
        <further-classification edition="200601120260401B">A61P31/04</further-classification>  
        <further-classification edition="200601120260401B">A61P15/02</further-classification>  
        <further-classification edition="200601120260401B">G01N33/569</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海賽增醫療科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI SCIZENG MEDICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧桑桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, SANGSANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪建峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張夢丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MENGDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃曉波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, XIAOBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茅柳柳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, LIULIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安慧芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, HUIFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康立山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, LISHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸文強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, WENQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王思勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SIQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及重組裂解酶及其變體，所述變體相對於所述重組裂解酶，具有提高的穩定性或殺菌活性。本申請還涉及包含該重組裂解酶及其變體的藥物組合物，以及它們用於預防和/或治療細菌感染（例如細菌性陰道病）的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2952" publication-number="202626735"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626735.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＤＨ１７抗體及其綴合物</chinese-title>  
        <english-title>ANTI-CDH17 ANTIBODIES AND CONJUGATES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C12N15/13</further-classification>  
        <further-classification edition="200601120260401B">C12N15/63</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="201701120260401B">A61K47/68</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京泰德製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING TIDE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王紅軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HONG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, TING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙焰平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, YAN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何景昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮澤旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, ZE-WANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及抗CDH17抗體，特別是特異性結合CDH17的抗體或其抗原結合片段、編碼所述抗體或其抗原結合片段的核酸、包含所述核酸的載體、以及包含所述核酸或載體的宿主細胞。還提供了包含所述抗體的綴合物、CAR和藥物組合物，以及使用抗體的治療、診斷和檢測方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to anti-CDH17 antibodies, particularly antibodies that specifically bind to CDH17 or antigen-binding fragments thereof, nucleic acids encoding said antibodies or antigen-binding fragments thereof, vectors containing said nucleic acids, and host cells containing said nucleic acids or vectors. Also provides conjugates, CARs, and pharmaceutical compositions containing said antibodies, as well as methods for treatment, diagnosis, and detection using said antibodies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2953" publication-number="202626350"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626350.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種複合導熱墊片及其製備方法、散熱器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260128B">B32B9/04</main-classification>  
        <further-classification edition="200601120260128B">B32B15/20</further-classification>  
        <further-classification edition="200601120260128B">B32B3/04</further-classification>  
        <further-classification edition="200601120260128B">B32B37/04</further-classification>  
        <further-classification edition="200601120260128B">B32B37/06</further-classification>  
        <further-classification edition="200601120260128B">B32B37/10</further-classification>  
        <further-classification edition="200601120260128B">C23C16/01</further-classification>  
        <further-classification edition="200601120260128B">C23C16/26</further-classification>  
        <further-classification edition="200601120260128B">B22D19/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市鴻富誠新材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN HFC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉金明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JINMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫愛祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, AIXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竇蘭月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOU, LANYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種複合導熱墊片及其製備方法、散熱器。複合導熱墊片包括：沿厚度方向取向的石墨烯層，其具有厚度方向的第一表面和第二表面，第一表面用於貼合於散熱裝置；液態金屬片層設置於石墨烯層的第二表面，並且能夠向石墨烯層的側面彎折，並包覆至少部分石墨烯層的側面。液態金屬片層從上到下依次包括第一合金層、中間層和第二合金層，第一合金層和第二合金層的材料相同，中間層為片狀導熱材料，包括固態金屬箔或第三合金；中間層的熔點溫度高於第一合金層和第二合金層。本申請的複合導熱墊片有高導熱性能，還具有高壓縮率和高重複性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:第一合金層</p>  
        <p type="p">102:中間層</p>  
        <p type="p">103:第二合金層</p>  
        <p type="p">200:石墨烯層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2954" publication-number="202626736"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626736.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151616</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與群落刺激因子１受體（ＣＳＦ—１Ｒ）結合之抗體及其用途</chinese-title>  
        <english-title>ANTIBODIES THAT BIND TO COLONY STIMULATING FACTOR 1 RECEPTOR (CSF-1R) AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P37/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英塞特公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INCYTE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩瑟蘭　科里　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUTHERLAND, CORY M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁內斯　吉伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ, GILBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪爾　科爾　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUER, COLE M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供了與人類群落刺激因子1受體(CSF-1R)結合之抗體，及用該等抗體治療慢性移植物抗宿主疾病(cGVHD)之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides antibodies that binds to human colony stimulating factor 1 receptor (CSF-1R) and methods of treating chronic graft-versus-host disease (cGVHD) with the antibodies.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2955" publication-number="202626498"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626498.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蛋黃蛋殼結構的矽－碳複合物、其製備方法及包括其的負極活性材料</chinese-title>  
        <english-title>YORK-SHELL STRUCTURED SILICON-CARBON COMPOSITE, PROCESS FOR PREPARING THE SAME, AND NEGATIVE ELECTRODE ACTIVE MATERIAL COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260326B">C01B32/05</main-classification>  
        <further-classification edition="200601120260326B">C01B33/02</further-classification>  
        <further-classification edition="200601120260326B">C23C16/26</further-classification>  
        <further-classification edition="200601120260326B">C23C16/44</further-classification>  
        <further-classification edition="200601120260326B">C23C16/455</further-classification>  
        <further-classification edition="200601120260326B">C23C16/56</further-classification>  
        <further-classification edition="200601120260326B">H01M4/36</further-classification>  
        <further-classification edition="200601120260326B">H01M4/38</further-classification>  
        <further-classification edition="201001120260326B">H01M4/587</further-classification>  
        <further-classification edition="201001120260326B">H01M10/052</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓華思路信公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANWHA SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國科學技術院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金度興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DO HEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全孝鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, HYOJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金義德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, EUI DUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴似朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SARANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任城甲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, SUNG GAP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔健優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, KEONWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張原態</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, WONTAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜旼廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, MINJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及蛋黃蛋殼結構的矽-碳複合物、其製備方法及包括其的負極活性材料。根據本發明的實施方式的蛋黃蛋殼結構的矽-碳複合物可以在不使用強酸的情況下製備，可以通過使用厚度均勻的無機層作為犧牲層來形成均勻的孔隙，從而在用作負極活性材料時容納矽的體積膨脹，以能夠抑制最外層碳薄膜的剝離現象。結果，能夠抑制電池性能及壽命的降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2956" publication-number="202628471"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628471.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於無線通訊的裝置及其方法</chinese-title>  
        <english-title>USER EQUIPMENT FOR WIRELESS COMMUNICATIONS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260223B">H04W76/27</main-classification>  
        <further-classification edition="200901120260223B">H04W68/00</further-classification>  
        <further-classification edition="200901120260223B">H04W60/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　國鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鏗銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐家俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉仁倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在本公開的一個方面，提供了一種方法、一種電腦可讀介質和一種裝置。該裝置可以是用戶裝置(user equipment；UE)。該 UE 向一網路節點發送一請求訊息，該請求訊息包括以下至少之一：當該 UE 在無線資源控制(Radio Resource Control；RRC)非活躍狀態下運行時，請求禁用監控無線存取網路(Radio Access Network；RAN)傳呼，或請求一值予一周期性基於RAN的通知區域(RAN-based Notification Area；RNA)更新之計時器。該 UE 從該網路節點接收一 RRC 釋放訊息，指示該 UE 進入該 RRC 非活躍狀態，該 RRC 釋放訊息包含響應於該請求訊息的配置資訊。該 UE 根據該配置資訊在該 RRC 非活躍狀態下運行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an aspect of the disclosure；a method；a computer-readable medium；and an apparatus are provided. The apparatus may be a UE. The UE sends a request message to a network node；and the request message includes at least one of: a request to disable monitoring of Radio Access Network (RAN) paging when the UE operates in a Radio Resource Control (RRC) Inactive state；or a request for a value for a periodic RAN-based Notification Area (RNA) update timer. The UE receives an RRC Release message from the network node instructing the UE to enter the RRC Inactive state；the RRC Release message including configuration information responsive to the request message. The UE operates in the RRC Inactive state according to the configuration information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1400:流程圖</p>  
        <p type="p">1402,1404,1406:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2957" publication-number="202628451"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628451.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151924</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由使用者設備執行的方法及無線通訊系統的個或多個網路節點執行的方法</chinese-title>  
        <english-title>METHOD PERFORMED BY USER EQUIPMENT AND METHOD PERFORMED BY ONE OR MORE NETWORK NODES OF WIRELESS COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260311B">H04W36/14</main-classification>  
        <further-classification edition="200901120260311B">H04W8/26</further-classification>  
        <further-classification edition="200901120260311B">H04W36/00</further-classification>  
        <further-classification edition="200901120260311B">H04W92/02</further-classification>  
        <further-classification edition="201801120260311B">H04W76/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　國鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鏗銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉仁倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳錦德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐家俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林元傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林牧台</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MU-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣邦彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PAN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHUN-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本公開的一個方面，提供了一種方法、一種計算機可讀介質和一種設備。設備可以是使用者設備（UE）。UE從第六代（6G）無線電存取網路（RAN）接收無線電資源控制（RRC）連接解除訊息。RRC連接解除訊息包括用於第四代（4G）網路頻率的重新定向載波資訊。UE在4G網路頻率上與目標4G小區建立RRC連接。UE向4G核心網路傳輸追蹤區域更新（TAU）請求訊息。UE從4G核心網路接收TAU接受訊息。在從6G RAN到4G RAN的移動過程其中，通過公共用戶平面錨點保持UE的網際網路協定（IP）地址。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a user equipment (UE). The UE receives a radio resource control (RRC) connection release message from a sixth-generation (6G) radio access network (RAN). The RRC connection release message comprises redirected carrier information for a fourth-generation (4G) network frequency. The UE establishes an RRC connection with a target 4G cell on the 4G network frequency. The UE transmits a tracking area update (TAU) request message to a 4G core network. The UE receives a TAU accept message from the 4G core network. An internet protocol (IP) address of the UE is maintained during a mobility procedure from the 6G RAN to a 4G RAN via a common user plane anchor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:圖</p>  
        <p type="p">804:UE</p>  
        <p type="p">810:PGW+(e)UPF+(e)SMF</p>  
        <p type="p">814:SGW</p>  
        <p type="p">816:MME</p>  
        <p type="p">820:eAMF</p>  
        <p type="p">832:4G RAN</p>  
        <p type="p">834:5G RAN</p>  
        <p type="p">836:6G RAN</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2958" publication-number="202628452"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628452.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由用戶設備、目標無線接入網路(RAN)，或是來源無線接入網路(RAN)執行的無線通信方法</chinese-title>  
        <english-title>A METHOD OF WIRELESS COMMUNICATION PERFORMED BY A USER EQUIPMENT, A TARGET RADIO ACCESS NETWORK, OR A SOURCE RADIO ACCESS NETWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260305B">H04W36/14</main-classification>  
        <further-classification edition="200901120260305B">H04W36/00</further-classification>  
        <further-classification edition="201801120260305B">H04W76/19</further-classification>  
        <further-classification edition="202101120260305B">H04W12/04</further-classification>  
        <further-classification edition="202101120260305B">H04W12/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　國鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鏗銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉仁倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳錦德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林元傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林牧台</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MU-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TSUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一用戶設備(UE)經歷與一來源無線接入技術(RAT)的一來源小區的無線鏈路故障。響應於該無線鏈路故障，該UE選擇一目標RAT的一目標小區。該目標RAT不同於該來源RAT。該UE驗證該目標小區是否與該來源小區在同一註冊區域中。響應於驗證該目標小區在該同一註冊區域中，該UE使用該來源小區的一安全上下文生成一安全令牌。該UE向該目標小區傳輸一重新建立請求訊息。該重新建立請求訊息包括以下一或多者：該安全令牌、該來源小區的一物理小區識別(PCI)，以及該UE在該來源小區中的一小區-無線網路臨時識別碼(C-RNTI)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A UE experiences a radio link failure with a source cell of a source radio access technology (RAT). In response to the radio link failure, the UE selects a target cell of a target RAT. The target RAT is different from the source RAT. The UE verifies that the target cell is in a same registration area as the source cell. In response to verifying that the target cell is in the same registration area, the UE generates a security token using a security context of the source cell. The UE transmits, to the target cell, a reestablishment request message. The reestablishment request message comprises one or more of the security token, a physical cell identity (PCI) of the source cell, and a Cell-Radio Network Temporary Identifier (C-RNTI) of the UE in the source cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:流程圖</p>  
        <p type="p">1002,1004,1006,1008,1010:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2959" publication-number="202627157"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627157.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學氣相沉積裝置</chinese-title>  
        <english-title>CHEMICAL VAPOR DEPOSITION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260107B">C23C16/30</main-classification>  
        <further-classification edition="200601120260107B">C23C16/32</further-classification>  
        <further-classification edition="200601120260107B">C23C16/44</further-classification>  
        <further-classification edition="200601120260107B">C23C16/46</further-classification>  
        <further-classification edition="200601120260107B">C23C16/52</further-classification>  
        <further-classification edition="200601120260107B">C30B35/00</further-classification>  
        <further-classification edition="200601120260107B">C30B29/36</further-classification>  
        <further-classification edition="200601120260107B">C30B25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＴＥＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TES CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承俱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEOUNG-GU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種化學氣相沉積裝置，更詳細地，係有關一種可以防止與加熱器連接的饋通件的損傷的化學氣相沉積裝置。所述化學氣相沉積裝置具備：腔體；基座，設置於所述腔體的內部且被安放基板；加熱器，設置於所述基座的下方且加熱所述基座；饋通件，與所述加熱器連接且施加高頻電壓；以及饋通件保護部，配置為包裹所述饋通件貫通所述腔體的區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">370:腿部</p>  
        <p type="p">512:側壁</p>  
        <p type="p">513,515:第一開口部</p>  
        <p type="p">514:蓋體</p>  
        <p type="p">532,534,542,544:饋通件</p>  
        <p type="p">532:第一延伸饋通管</p>  
        <p type="p">534:第二延伸饋通管</p>  
        <p type="p">542:第一饋通管</p>  
        <p type="p">544:第二饋通管</p>  
        <p type="p">550:吹掃氣體供應部</p>  
        <p type="p">552:供應孔</p>  
        <p type="p">560,570:內殼體</p>  
        <p type="p">562,564:第二開口部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2960" publication-number="202628776"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628776.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260223B">H10K59/80</main-classification>  
        <further-classification edition="202301120260223B">H10K50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李五榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, OHYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭喜榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWACK, HEEYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種顯示裝置，包括：基板，其包含：顯示區域，包含至少一個發光元件；非顯示區域，圍繞該顯示區域，並且包含從焊墊區域延伸的至少一條電源線；以及光學區域，包含開口區域，並且位於該顯示區域內，其中，在該開口區域處，該基板的至少一部分被移除；第一防潮結構，從該電源線的一部分延伸，且包含第一金屬層；以及第二防潮結構，設置在該顯示區域與該開口區域之間，且包含第二金屬層。並且，該顯示裝置能夠具有改進的可靠度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a display device that includes a substrate including a display area including at least one light emitting element, a non-display area including at least one power line extending from a pad area and surrounding the display area, and an optical area including an open area from which at least a portion of the substrate is removed, and located in the display area, a first moisture preventing structure extending from a portion of the power line and including a first metal layer, and a second moisture preventing structure disposed between the display area and the open area and including a second metal layer, and is capable of improving the reliability of the display device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">110:顯示面板</p>  
        <p type="p">111:基板</p>  
        <p type="p">120:資料驅動電路</p>  
        <p type="p">130:閘極驅動電路</p>  
        <p type="p">140:控制器</p>  
        <p type="p">150:主機系統</p>  
        <p type="p">CE:共用電極</p>  
        <p type="p">Cst:儲存電容器</p>  
        <p type="p">DATA:影像資料</p>  
        <p type="p">DCS:資料控制訊號</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">DT:驅動電晶體</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">N3:第三節點</p>  
        <p type="p">ED:發光元件</p>  
        <p type="p">EL_COM:共用中間層</p>  
        <p type="p">COM1:第一共用中間層</p>  
        <p type="p">COM2:第二共用中間層</p>  
        <p type="p">EML:發光層</p>  
        <p type="p">GCS:閘極控制訊號</p>  
        <p type="p">GL:閘極線</p>  
        <p type="p">NDA:非顯示區域</p>  
        <p type="p">OA:光學區域</p>  
        <p type="p">PE:像素電極</p>  
        <p type="p">SC:掃描訊號</p>  
        <p type="p">SCL:掃描線</p>  
        <p type="p">SP:子像素</p>  
        <p type="p">SPC:子像素電路</p>  
        <p type="p">ST:掃描電晶體</p>  
        <p type="p">VDATA:資料訊號</p>  
        <p type="p">VDD:第一共用驅動電壓</p>  
        <p type="p">VDDL:第一共用驅動電壓線</p>  
        <p type="p">VSS:第二共用驅動電壓</p>  
        <p type="p">VSSL:第二共用驅動電壓線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2961" publication-number="202626235"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626235.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114152185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於雷射鑽設盲通孔之方法及設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR LASER DRILLING BLIND VIAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260321B">B23K26/00</main-classification>  
        <further-classification edition="201401120260321B">B23K26/386</further-classification>  
        <further-classification edition="202601120260321B">H10P34/42</further-classification>  
        <further-classification edition="202601120260321B">H10P72/00</further-classification>  
        <further-classification edition="202601120260321B">H10P72/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>類維生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, WEI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒施基斯　寇迪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LESCHKIES, KURTIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇克　羅門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOUK, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維哈佛貝可　史帝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERHAVERBEKE, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希發拉馬奎斯南　菲斯維斯沃倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIVARAMAKRISHNAN, VISWESWAREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一實施例中，提供了一種在包含遮罩層、導電層和介電層的基板中形成盲通孔的方法，包括以下步驟：將基板傳送到掃描腔室；決定盲通孔的一種或多種性質，一種或多種性質包含頂部直徑、底部直徑、容積或約80°或更大的錐角；將雷射光束聚焦於基板處，以移除遮罩層的至少一部分；基於一種或多種性質調整雷射處理參數；及在經調整的雷射處理參數下聚焦雷射光束以移除容積內的介電層的至少一部分，以形成盲通孔。在一些實施例中，可預蝕刻遮罩層。在另一個實施例中，提供了一種用於在基板中形成盲通孔的設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:示例方法</p>  
        <p type="p">302:操作</p>  
        <p type="p">304:操作</p>  
        <p type="p">306:操作</p>  
        <p type="p">308:操作</p>  
        <p type="p">310:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2962" publication-number="202626653"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626653.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114152253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為ＨＥＲ２抑制劑之［１，３］二基［５，４－ｄ］嘧啶</chinese-title>  
        <english-title>[1,3]DIAZINO[5,4-D]PYRIMIDINES AS HER2 INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07D487/04</main-classification>  
        <further-classification edition="200601120260324B">C07D519/00</further-classification>  
        <further-classification edition="200601120260324B">A61K31/519</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾丁　巴吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILDING, BIRGIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯塞　戴利奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOESE, DIETRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英傑爾哈德特　哈拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENGELHARDT, HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富奇斯　朱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUCHS, JULIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐穆勒　勞弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUMUELLER, RALPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得羅茨基　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRONCZKI, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙恩　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHARN, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔伍　瑪夏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TREU, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於新[1,3]二𠯤基[5,4-&lt;i&gt;d&lt;/i&gt;]嘧啶及式&lt;b&gt;(I)&lt;/b&gt;之衍生物 &lt;br/&gt;&lt;img align="absmiddle" height="226px" width="291px" file="ed10078.JPG" alt="ed10078.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中基團&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt;及&lt;b&gt;R&lt;sup&gt;4&lt;/sup&gt;&lt;/b&gt;具有申請專利範圍及說明書中所給出之含義；其作為HER2及其突變體之抑制劑的用途；含有此類化合物之醫藥組合物；及其作為藥物，尤其作為用於治療及/或預防致癌疾病之藥劑的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to new [1,3]diazino[5,4-&lt;i&gt;d&lt;/i&gt;]pyrimidines and derivatives of Formula &lt;b&gt;(I)&lt;/b&gt;&lt;br/&gt;&lt;img align="absmiddle" height="237px" width="287px" file="ed10079.JPG" alt="ed10079.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein the groups &lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt; and&lt;b&gt;&lt;sup/&gt;R&lt;sup&gt;4&lt;/sup&gt;&lt;/b&gt;have the meanings given in the claims and specification, their use as inhibitors of HER2 and its mutants, pharmaceutical compositions which contain such compounds and their use as medicaments, especially as agents for treatment and/or prevention of oncological diseases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2963" publication-number="202626654"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626654.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114152254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為ＨＥＲ２抑制劑之［１，３］二基［５，４－ｄ］嘧啶</chinese-title>  
        <english-title>[1,3]DIAZINO[5,4-D]PYRIMIDINES AS HER2 INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07D487/04</main-classification>  
        <further-classification edition="200601120260324B">C07D519/00</further-classification>  
        <further-classification edition="200601120260324B">A61K31/519</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾丁　巴吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILDING, BIRGIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯塞　戴利奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOESE, DIETRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英傑爾哈德特　哈拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENGELHARDT, HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富奇斯　朱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUCHS, JULIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐穆勒　勞弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUMUELLER, RALPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得羅茨基　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRONCZKI, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙恩　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHARN, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔伍　瑪夏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TREU, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於新[1,3]二𠯤基[5,4-&lt;i&gt;d&lt;/i&gt;]嘧啶及式&lt;b&gt;(I)&lt;/b&gt;之衍生物 &lt;br/&gt;&lt;img align="absmiddle" height="225px" width="299px" file="ed10078.JPG" alt="ed10078.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中基團&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;、&lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt;及&lt;b&gt;R&lt;sup&gt;4&lt;/sup&gt;&lt;/b&gt;具有申請專利範圍及說明書中所給出之含義；其作為HER2及其突變體之抑制劑的用途；含有此類化合物之醫藥組合物；及其作為藥物，尤其作為用於治療及/或預防致癌疾病之藥劑的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to new [1,3]diazino[5,4-&lt;i&gt;d&lt;/i&gt;]pyrimidines and derivatives of Formula &lt;b&gt;(I)&lt;/b&gt;&lt;br/&gt;&lt;img align="absmiddle" height="236px" width="283px" file="ed10079.JPG" alt="ed10079.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein the groups &lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;2&lt;/sup&gt;&lt;/b&gt;, &lt;b&gt;R&lt;sup&gt;3&lt;/sup&gt;&lt;/b&gt; and&lt;b&gt;&lt;sup/&gt;R&lt;sup&gt;4&lt;/sup&gt;&lt;/b&gt;have the meanings given in the claims and specification, their use as inhibitors of HER2 and its mutants, pharmaceutical compositions which contain such compounds and their use as medicaments, especially as agents for treatment and/or prevention of oncological diseases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2964" publication-number="202627215"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627215.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115100141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>陽極結構與氣相電化學模組</chinese-title>  
        <english-title>ANODE STRUCTURE AND GAS PHASE ELECTROCHEMICAL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260121B">C25B1/23</main-classification>  
        <further-classification edition="202101120260121B">C25B11/032</further-classification>  
        <further-classification edition="202101120260121B">C25B11/052</further-classification>  
        <further-classification edition="202101120260121B">C25B11/073</further-classification>  
        <further-classification edition="200601120260121B">C25D1/08</further-classification>  
        <further-classification edition="201601120260121B">H01M8/0232</further-classification>  
        <further-classification edition="201601120260121B">H01M8/0245</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃萌祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高端環</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, TUNE-HUNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周敏傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MIN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂曼寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, MAN-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種陽極結構包括陽極電極板、多孔網板以及陽極觸媒層。多孔網板設置於陽極電極板上，且多孔網板內具有多個孔洞。陽極觸媒層形成於多孔網板上，且陽極觸媒層滲透於多孔網板之深度＞100 μm，其中陽極觸媒層的金屬含量＞95%。陽極觸媒層的材料為鈀(Pd)、鋅(Zn)、錫鈀(Sn-Pd)、鎳鐵(Ni-Fe)或鎳磷(Ni-P)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anode structure includes an anode electrode plate, a porous mesh, and an anode catalyst layer. The porous mesh is disposed on the anode electrode plate, and there are pores in the porous mesh. The anode catalyst layer is formed on the porous mesh, and a depth of the anode catalyst layer penetrating into the porous mesh is greater than 100 μm, wherein the metal content of the anode catalyst layer is greater than 95%. A material of the anode catalyst layer is palladium (Pd), zinc (Zn), tin-palladium (Sn-Pd), nickel-iron (Ni-Fe), or nickel-phosphorus (Ni-P).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:陽極結構</p>  
        <p type="p">302:陽極電極板</p>  
        <p type="p">304:多孔網板</p>  
        <p type="p">306:陽極觸媒層</p>  
        <p type="p">d2:深度</p>  
        <p type="p">t2、t3:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2965" publication-number="202627566"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627566.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115101884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光波導半導體封裝</chinese-title>  
        <english-title>WAVEGUIDE SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G02B6/13</main-classification>  
        <further-classification edition="200601120260316B">G02B6/122</further-classification>  
        <further-classification edition="202601120260316B">H10W74/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美泰萬有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAONE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江岳峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YUEH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光波導半導體封裝包含：至少一晶片；光波導基板與該至少一晶片堆疊，光波導基板包含光波導用於傳輸訊號；及光源對應光波導以提供光訊號，其中包含超透鏡對應於光波導。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A waveguide semiconductor package includes: at least one chip; a substrate stacked with the at least one chip, the substrate includes a waveguide to transmit light signals; and a light source is configurated to the waveguide to provide signals, a meta-lens is configurated to the optical waveguide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:邏輯晶片</p>  
        <p type="p">200:記憶體晶片</p>  
        <p type="p">300:訊號轉換元件</p>  
        <p type="p">400:光中介層</p>  
        <p type="p">410:光發射元件</p>  
        <p type="p">420:光接收元件</p>  
        <p type="p">500:波導陣列</p>  
        <p type="p">510:光波導</p>  
        <p type="p">800:超透鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2966" publication-number="202628379"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628379.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於光學可切換窗系統之感測及通信單元</chinese-title>  
        <english-title>SENSING AND COMMUNICATIONS UNIT FOR OPTICALLY SWITCHABLE WINDOW SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H04B7/14</main-classification>  
        <further-classification edition="200601120260318B">H04B7/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商唯景操作公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIEW OPERATING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里克　涅提</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIKHA, NITESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　史蒂芬　克拉克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN, STEPHEN CLARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎納　尼廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHANNA, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅茲畢基　羅伯特　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROZBICKI, ROBERT T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪利凡斯塔瓦　達爾雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHRIVASTAVA, DHAIRYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂尼阿諾　布蘭登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TINIANOV, BRANDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在一建築物中或上之高速資料通信網路包含：複數個中繼線區段，其藉由複數個被動電路串聯耦接至彼此，所述複數個被動電路經組態以將信號遞送至所述建築物上、中或外之一或多個裝置且自所述一或多個裝置接收信號，其中所述信號包括具有大於1 Gpbs之一傳輸速率的資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-speed data communications network in or on a building includes a plurality of trunk line segments serially coupled to each other by a plurality of passive circuits configured to deliver signals to, and to receive signals from, one or more devices on, in, or outside the building, wherein the signals comprise data having a greater than 1Gpbs transmission rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:建築物</p>  
        <p type="p">103:「控制面板」(CP)</p>  
        <p type="p">105:外部網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2967" publication-number="202626129"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626129.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>呼吸連接器組件與呼吸支持系統</chinese-title>  
        <english-title>A RESPIRATORY CONNECTOR ASSEMBLY AND RESPIRATORY SUPPORT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">A61M16/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐西蘭商費雪派克保健有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥迪蒙　加雷斯　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCDERMOTT, GARETH THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊凡斯　艾莉西亞　杰拉姆　杭特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVANS, ALICIA JERRAM HUNTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪　大衛雷納　蔡倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOW, DAVID-REYNER CAILUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃姆斯理　傑登　格雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALMSLEY, JAIDEN GRAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧斯本　漢米許　阿德里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSBORNE, HAMISH ADRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛德華　泰勒　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS, TAYLOR JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯吉斯　艾登　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURGESS, AIDAN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯　艾德里安　大衛　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBB, ADRIAN DAVID JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有流源和呼吸回路的呼吸支持系統。該呼吸回路具有泄壓閥和與該流源和該泄壓閥流體連通的管組件。該呼吸回路在該泄壓閥下游在選定氣體流量下具有30 - 50 cmH2O的氣體流動阻力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A respiratory support system having a flow source and a respiratory circuit. The respiratory circuit has a pressure relief valve and a tube assembly in fluid communication with the flow source and pressure relief valve. The respiratory circuit downstream of the pressure relief valve has a resistance to gas flow of 30 - 50 cmH2O at a selected gas flow rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:呼吸連接器組件</p>  
        <p type="p">4:第一連接器</p>  
        <p type="p">6:第二連接器</p>  
        <p type="p">8:泄壓閥</p>  
        <p type="p">10:呼吸療法系統</p>  
        <p type="p">11:醫療裝置和/或部件</p>  
        <p type="p">12:流源</p>  
        <p type="p">12a:添加氣體源</p>  
        <p type="p">13:高流量氣體</p>  
        <p type="p">14:吸氣導管</p>  
        <p type="p">15:患者介面</p>  
        <p type="p">16:患者</p>  
        <p type="p">17:增濕器</p>  
        <p type="p">18a:感測器</p>  
        <p type="p">18b:感測器</p>  
        <p type="p">18c:感測器</p>  
        <p type="p">18d:感測器/脈搏血氧計</p>  
        <p type="p">19:控制器</p>  
        <p type="p">20:輸入/輸出(I/O)介面</p>  
        <p type="p">1014:管組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2968" publication-number="202627108"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627108.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熔礦爐的爐壁附著物去除方法以及熔礦爐的操作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C21B5/00</main-classification>  
        <further-classification edition="200601120260401B">C21B7/06</further-classification>  
        <further-classification edition="201001120260401B">F27D25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意礦物股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE MINERAL &amp; ALLOY COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>筒井慶喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUI, YOSHINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郷原大成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOHARA, TOMONARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩田敏生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOTA, TOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>築地秀明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKIJI, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井紀文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, NORIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種熔礦爐的爐壁附著物去除方法及操作方法。本發明的熔礦爐的爐壁附著物去除方法為使熔礦爐中的裝入物的上表面下降至附著物的下部，使附著物露出，對所露出的附著物灑水，將附著物去除。所述方法較佳為在灑水中：在灑水-灑水間設置間隔而間歇性地灑水；以保持規定的爐熱水準的方式調整每次的灑水時間、間隔時間、灑水流量及總灑水量，進行附著物的去除。本發明的熔礦爐的操作方法包括：附著物去除步驟，在操作中或休風中，使熔礦爐中的裝入物減量至附著物的下部，藉由所述熔礦爐的爐壁附著物去除方法，將爐壁的附著物去除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熔礦爐</p>  
        <p type="p">2:爐壁</p>  
        <p type="p">3:爐口</p>  
        <p type="p">4:灑水噴嘴</p>  
        <p type="p">4A:灑水</p>  
        <p type="p">5:(水冷)爐身壁體</p>  
        <p type="p">6:(爐壁)附著物</p>  
        <p type="p">7:減料</p>  
        <p type="p">8:(附著物的)脫落/去除</p>  
        <p type="p">S:(爐內)裝入物</p>  
        <p type="p">SL:(減料後的)裝入物水平高度</p>  
        <p type="p">SL0:(減料前的)裝入物水平高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2969" publication-number="202626069"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626069.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>於患有血友病之個體中治療出血事件之方法及組成物</chinese-title>  
        <english-title>METHODS AND COMPOSITIONS FOR TREATING A BLEEDING EVENT IN A SUBJECT HAVING HEMOPHILIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61K31/713</main-classification>  
        <further-classification edition="201001120260331B">C12N15/113</further-classification>  
        <further-classification edition="200601120260331B">A61K38/37</further-classification>  
        <further-classification edition="200601120260331B">A61K38/36</further-classification>  
        <further-classification edition="200601120260331B">A61K48/00</further-classification>  
        <further-classification edition="200601120260331B">A61P7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商健贊公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENZYME CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿肯　艾金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKINC, AKIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種靶向Serpinc1基因之iRNA(例如，雙股核糖核酸(dsRNA))組成物、及使用此等iRNA(例如，dsRNA)組成物為患有血友病(例如，帶或不帶抑制劑)之個體治療出血事件之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to iRNA, &lt;i&gt;e.g.,&lt;/i&gt; double stranded ribonucleic acid (dsRNA), compositions targeting the Serpinc1 gene, and methods of using such iRNA, &lt;i&gt;e.g.,&lt;/i&gt; dsRNA, compositions to treat a bleeding event in a subject having a hemophilia (&lt;i&gt;e.g.,&lt;/i&gt; with or without inhibitors).</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2970" publication-number="202626267"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626267.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拋光裝置、基板處理方法及凹槽探測站</chinese-title>  
        <english-title>POLISHING APPARATUS, METHOD OF PROCESSING SUBSTRATE AND NOTCH FINDING STATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B24B49/12</main-classification>  
        <further-classification edition="200601120260325B">B24B49/10</further-classification>  
        <further-classification edition="200601120260325B">B24B41/053</further-classification>  
        <further-classification edition="201201120260325B">B24B37/005</further-classification>  
        <further-classification edition="200601120260325B">G01B11/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫塔米迪　諾楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTAMEDI, NOJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班維紐　多明尼克Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENVEGNU, DOMINIC J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史威克　柏格斯勞Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWEDEK, BOGUSLAW A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　哈利Ｑ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HARRY Q.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努尼佳　史帝文Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUNIGA, STEVEN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　浩權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, JUSTIN HO KUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">凹槽探測站包括感測器和控制器，感測器用於產生取決於感測器的感測區域被基板覆蓋的比例的訊號。控制器被配置為使致動器相對於感測器定位承載頭以使感測器的感測區域位於基板的邊緣，使馬達發生旋轉運動以使感測器的感測區域沿基板的圓周掃描，並根據來自感測器的訊號檢測基板邊緣中凹槽的角度位置，包括補償因基板中心偏離旋轉軸而產生的訊號的正弦分量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A notch finding station includes a sensor to generate a signal that depends on an proportion of a sensing region of the sensor that is covered by the substrate, and a controller. The controller is configured to cause an actuator to position a carrier head relative to the sensor such that the sensing region of the sensor is at an edge of the substrate, cause the motor to generate rotational motion such that the sensing region of the sensor scans along a circumference of the substrate, and detect an angular position of a notch in the edge of the substrate based on a signal from the sensor, including compensating for a sinusoidal component of the signal resulting from an offset of the center of the substrate from the axis of rotation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">110:拋光站</p>  
        <p type="p">120:可旋轉平臺</p>  
        <p type="p">140:承載頭</p>  
        <p type="p">142:固定環</p>  
        <p type="p">150:支撐結構</p>  
        <p type="p">152:旋轉軸線</p>  
        <p type="p">154:驅動軸</p>  
        <p type="p">156:承載頭旋轉馬達</p>  
        <p type="p">190:控制器</p>  
        <p type="p">200:凹槽探測站</p>  
        <p type="p">210:光學凹槽檢測器</p>  
        <p type="p">212:光源</p>  
        <p type="p">214:光檢測器</p>  
        <p type="p">216:電路系統</p>  
        <p type="p">220:光束</p>  
        <p type="p">222:反射光束</p>  
        <p type="p">224:撞擊光斑</p>  
        <p type="p">230:遮蔽件</p>  
        <p type="p">232:窗口</p>  
        <p type="p">240:光學板或框架</p>  
        <p type="p">242:致動器</p>  
        <p type="p">270:主幹</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2971" publication-number="202626305"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626305.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115102756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器控制器、對基板的定位進行準確光學感測的方法及非暫時性電腦可讀取媒體</chinese-title>  
        <english-title>SENSOR CONTROLLER, METHOD OF ACCURATE OPTICAL SENSING OF POSITIONING OF SUBSTRATES AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260319B">B25J11/00</main-classification>  
        <further-classification edition="200601120260319B">B25J13/00</further-classification>  
        <further-classification edition="200601120260319B">B25J9/16</further-classification>  
        <further-classification edition="200601120260319B">G01B11/00</further-classification>  
        <further-classification edition="202601120260319B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛　奇奇希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG, KIYKI-SHIY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔拉布金　米凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARABOUKHINE, MIKHAIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯得　凡卡達拉加費亞喬達瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODE, VENKATA RAGHAVAIAH CHOWDHARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露的實施方式描述一種整合式感測器控制器，包含感測器電路及邏輯電路。該感測器電路包括用以產生驅動信號的光源驅動器、用以利用該驅動信號製造將被傳遞至複數個感測器中之一感測器的複數個輸出驅動信號的解多工器、及放大器，該放大器用以從第一感測器接收第一信號以及產生第二信號，該第一信號關聯於代表在元件製造機器內基板的位置的第一事件。該感測器電路進一步包括用以接收該第二信號及產生第三信號的類比對數位轉換器。該邏輯電路包括記憶體裝置及經耦接至該記憶體裝置的處理裝置，該處理裝置用以基於該第三信號來獲得有關該基板的該位置的資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations disclosed describe an integrated sensor controller comprising a sensor circuit and a logic circuit. The sensor circuit includes a light source driver to generate a driving signal, a demultiplexer to produce, using the driving signal, a plurality of output driving signals to be delivered to one of a plurality of sensors, and an amplifier to: receive a first signal from a first sensor, the first signal being associated with a first event representative of a position of a substrate within a device manufacturing machine, and generate a second signal. The sensor circuit further includes an analog-to-digital converter to receive the second signal and generate a third signal. The logic circuit includes a memory device and a processing device coupled to the memory device, the processing device to obtain based on the third signal, information about the position of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">114-1,114-n:感測器</p>  
        <p type="p">118:主計算裝置</p>  
        <p type="p">150:感測器控制器</p>  
        <p type="p">200:整合電路架構</p>  
        <p type="p">202-1,202-n:感測頭</p>  
        <p type="p">204-1,204-n:光偵測器</p>  
        <p type="p">206:感測器連接器</p>  
        <p type="p">210:感測器電路</p>  
        <p type="p">212:光源驅動器</p>  
        <p type="p">214:放大器</p>  
        <p type="p">216:類比對數位轉換器(ADC)</p>  
        <p type="p">218:ISO DC/DC</p>  
        <p type="p">220:隔離電路</p>  
        <p type="p">230:電力電路</p>  
        <p type="p">240:邏輯電路</p>  
        <p type="p">242:處理裝置</p>  
        <p type="p">244:整合式電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2972" publication-number="202626848"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626848.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103174</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂及製備彼之方法</chinese-title>  
        <english-title>RESIN AND METHOD FOR PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08G63/183</main-classification>  
        <further-classification edition="200601120260325B">C08G63/197</further-classification>  
        <further-classification edition="200601120260325B">C08G63/672</further-classification>  
        <further-classification edition="200601120260325B">C08G63/688</further-classification>  
        <further-classification edition="200601120260325B">C08G64/06</further-classification>  
        <further-classification edition="200601120260325B">C08G64/08</further-classification>  
        <further-classification edition="200601120260325B">C08G64/16</further-classification>  
        <further-classification edition="200601120260325B">C08G64/30</further-classification>  
        <further-classification edition="200601120260325B">C07C323/19</further-classification>  
        <further-classification edition="200601120260325B">C07C43/23</further-classification>  
        <further-classification edition="200601120260325B">C07C43/253</further-classification>  
        <further-classification edition="200601120260325B">C07C43/295</further-classification>  
        <further-classification edition="200601120260325B">C07D209/86</further-classification>  
        <further-classification edition="200601120260325B">C07D235/20</further-classification>  
        <further-classification edition="200601120260325B">C07D307/79</further-classification>  
        <further-classification edition="200601120260325B">C07D307/91</further-classification>  
        <further-classification edition="200601120260325B">C08L67/02</further-classification>  
        <further-classification edition="200601120260325B">C08L69/00</further-classification>  
        <further-classification edition="200601120260325B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白種和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, JONGHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔日煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, IL HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵在順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JAESOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭珉碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, MIN SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭炳然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, BYEONGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案關於包含化學式1之單元的樹脂、製備彼之方法、包含彼之樹脂組成物、及包含該樹脂組成物之模塑物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a resin comprising a unit of Chemical Formula 1, a method for preparing the same, a resin composition comprising the same, and a molded article comprising the resin composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2973" publication-number="202626078"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626078.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有山萘酚糖苷配基之萃取物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K36/31</main-classification>  
        <further-classification edition="200601120260324B">A61K36/82</further-classification>  
        <further-classification edition="200601120260324B">A61K31/352</further-classification>  
        <further-classification edition="200601120260324B">A61K31/7048</further-classification>  
        <further-classification edition="200601120260324B">A61P3/00</further-classification>  
        <further-classification edition="200601120260324B">A61P43/00</further-classification>  
        <further-classification edition="201701120260324B">A61K8/9789</further-classification>  
        <further-classification edition="201601120260324B">A23L33/105</further-classification>  
        <further-classification edition="200601120260324B">A01G7/00</further-classification>  
        <further-classification edition="201801120260324B">A01G22/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大塚製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田泰隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, YASUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝上翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOKAMI, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芹沢領</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERIZAWA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿比留康弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABIRU, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野呂尚人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORO, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用以享受山萘酚帶來之生理作用的有用方法。 &lt;br/&gt;本發明之植物萃取物以乾燥重量換算計，含有山萘酚糖苷配基1 mg/g以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2974" publication-number="202626050"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626050.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水性組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K31/519</main-classification>  
        <further-classification edition="200601120260324B">A61K47/18</further-classification>  
        <further-classification edition="200601120260324B">A61K9/08</further-classification>  
        <further-classification edition="200601120260324B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂敦製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROHTO PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西本明功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMOTO, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>掛樋奈穂子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKEHI, NAHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林紗衣子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, SAEKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種水性組成物，其含有兩面神激酶抑制劑（Janus kinase inhibitor）及雙胍系防腐劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2975" publication-number="202628136"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628136.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115103843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切換卡、連接器、及連接器組件</chinese-title>  
        <english-title>PADDLE CARD, CONNECTOR, AND CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H01B11/06</main-classification>  
        <further-classification edition="201101120260318B">H01R24/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安芬諾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPHENOL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾森伯格　馬克　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYZENBERG, MARK M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加德瓦爾　穆罕默德　科瓦賈胡森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GADWAL MOHAMMED, KHWAJAHUSSAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬托格魯　埃德姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATOGLU, ERDEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙太安　卡塔林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUNTEAN, CATALIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種纜線組件，其包括具有能夠實現高密度和高信號完整性的終端的連接器。纜線的屏蔽層經由附接至切換卡表面的導電結構端接至切換卡。纜線的信號導體端接至切換卡上的在導電結構的開口內露出的焊盤。這樣的結構為每個纜線創建了接地結構，即使在多個纜線並排排列並且端接在一行或更多行中的情況下，也能提供低插入損耗和低串擾。纜線可以是無排擾的，使得大量纜線例如八個纜線能夠被包裹在高密度標準例如QSFP-DD或OSFP中規定的切換卡的寬度內。儘管如此，纜線可以具有大直徑的信號導體，使得2.5米或3米的組件能夠具有小於17 dB的插入損耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17dB insertion loss.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:纜線組件</p>  
        <p type="p">602:纜線</p>  
        <p type="p">604:切換卡</p>  
        <p type="p">606:導電結構</p>  
        <p type="p">608:導電結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2976" publication-number="202628801"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628801.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104086</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構、半導體裝置、形成沉積層之方法、及沉積系統</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE, METHOD OF FORMING A DEPOSITION LAYER, AND DEPOSITION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P14/24</main-classification>  
        <further-classification edition="200601120260325B">C23C16/448</further-classification>  
        <further-classification edition="200601120260325B">C23C16/455</further-classification>  
        <further-classification edition="202501120260325B">H10D62/822</further-classification>  
        <further-classification edition="202501120260325B">H10D62/832</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱巴夫法拉　阿米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJBAFVALA, AMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威斯壯　彼德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTROM, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪格蒂斯　喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARGETIS, JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>密斯金　卡列布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISKIN, CALEB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　彥霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEOW, YEN LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彦夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YANFU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示者係一種在基板表面上形成矽鍺層之方法及用於形成矽鍺層之系統。本揭露之實例提供一種方法，此方法包括提供複數個生長前驅物以控制、及/或促成寄生氣相（parasitic gas-phase）及表面反應，使得可實現對膜之（例如，厚度及/或組成）均勻性的更大控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a silicon germanium layer on a surface of a substrate and a system for forming a silicon germanium layer are disclosed. Examples of the disclosure provide a method that includes providing a plurality of growth precursors to control and/or promote parasitic gas-phase and surface reactions, such that greater control of the film (e.g., thickness and/or composition) uniformity can be realized.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">101:步驟</p>  
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">110:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2977" publication-number="202628573"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628573.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成記憶體裝置之方法及記憶體裝置</chinese-title>  
        <english-title>METHOD OF FORMING MEMORY DEVICE AND MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260325B">H10B12/00</main-classification>  
        <further-classification edition="202601120260325B">H10P14/43</further-classification>  
        <further-classification edition="202601120260325B">H10P14/40</further-classification>  
        <further-classification edition="202601120260325B">H10W10/17</further-classification>  
        <further-classification edition="200601120260325B">C23C16/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪伯恩　菲德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHBURN, FREDRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜聲官</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SUNG-KWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有支撐層的DRAM裝置，用於在被電極金屬填充之前保持bWL特徵。支撐層使結構從頂表面得到支撐，但不阻止間隙填充。首先將暫時間隙填充材料沉積在bWL間隙中，隨後使其凹陷以暴露頂部邊緣。隨後藉由電漿增強化學氣相沉積（PECVD）將支撐層材料沉積在結構上。隨後將裝置圖案化為正交且間距大於bWL間距。隨後移除暫時間隙填充材料，從而形成包括支撐材料的支撐樑。隨後可沉積金屬以填充在支撐樑之下的bWL間隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a DRAM device having a support layer is to hold the bWL features before being filled with the electrode metal. The support layer keeps the structure supported from the top surface but does not prevent the gap fill. A temporary gap-fill material is first deposited in the bWL gaps and then recessed to expose the top edges. A support layer material is then deposited on the structure by plasma enhanced chemical vapor deposition (PECVD). The device is then patterned orthogonal and with pitch greater than the bWL pitch. The temporary gap-fill material is then removed, forming support beams comprising the support material. A metal can then be deposited to fill the bWL gaps under the support beams.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">101:埋入式字元線堆疊/閘極堆疊</p>  
        <p type="p">102:主動區</p>  
        <p type="p">104:閘極氧化物層</p>  
        <p type="p">106:氮化物層</p>  
        <p type="p">108:溝槽</p>  
        <p type="p">114:支撐層/支撐材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2978" publication-number="202627376"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627376.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115104961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預燒爐體及預燒設備</chinese-title>  
        <english-title>PRE-HEATING FURNACE AND PRE-HEATING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260302B">F27B9/06</main-classification>  
        <further-classification edition="200601120260302B">F27B15/04</further-classification>  
        <further-classification edition="200601120260302B">F27B15/10</further-classification>  
        <further-classification edition="200601120260302B">F27B15/18</further-classification>  
        <further-classification edition="200601120260302B">F27B9/12</further-classification>  
        <further-classification edition="200601120260302B">F27D1/18</further-classification>  
        <further-classification edition="200601120260302B">F16K7/10</further-classification>  
        <further-classification edition="202001120260302B">G01R31/01</further-classification>  
        <further-classification edition="200601120260302B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻勁精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON. PRECISION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>饒兆慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAO, CHAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預燒爐體，包含爐本體、出風單元、中介件及給氣單元，爐本體設有相通之測試室及出風流道，測試室以供流入預設低溫之測試用氣體，並將測試用氣體排出至出風流道；出風單元裝配於爐本體，並設置箱具及閥門，箱具之通道相通出風流道，閥門可擺動式裝配於箱具，能夠啟閉通道；中介件設有腔室，並於外表面界定連結部及接合部，連結部裝配於閥門之外環部，接合部為自由端而可彈性變形；給氣單元之給氣管能夠對中介件之腔室充氣或抽氣，使中介件之接合部作彈性變形而貼合或脫離箱具之內壁面，以確實氣密通道或利於閥門擺動位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pre-heating furnace includes a furnace body, an air-outlet unit, an intermediate member, and a gas-providing unit. The furnace body has a testing room and an air-outlet channel communicating with each other. The testing room is adapted for a low-temperature gas to flow into, and the gas further enters the air-outlet channel. The air-outlet unit is arranged at the furnace body and has a box and a valve. The channel of the box communicates with the air-outlet channel. The valve is pivotably disposed on the box to open or close the channel. The intermediate member has a cavity, and has an engaging portion and a connection portion at the exterior surface thereof. The engaging portion is arranged at a portion surrounding the valve. The connection portion is a free end and is flexible and deformable. The gas-providing pipe can provide gas into the cavity or suck the gas from the cavity so that the connection portion deforms to contact or to leave the inner wall of the box. Thus, the channel is prevented from gas leaking, and the valve is easy to pivot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:箱具</p>  
        <p type="p">321:通道</p>  
        <p type="p">322:內壁面</p>  
        <p type="p">33:閥門</p>  
        <p type="p">331:外環部</p>  
        <p type="p">332:容置部</p>  
        <p type="p">333:階級面</p>  
        <p type="p">334:底面</p>  
        <p type="p">35:中介件</p>  
        <p type="p">351:腔室</p>  
        <p type="p">3511:通孔</p>  
        <p type="p">352:連結部</p>  
        <p type="p">353:接合部</p>  
        <p type="p">361:管道</p>  
        <p type="p">362:給氣管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2979" publication-number="202626301"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626301.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105511</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器開閉裝置、搬送裝置、及搬送系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">B25J9/16</main-classification>  
        <further-classification edition="200601120260316B">B25J9/02</further-classification>  
        <further-classification edition="200601120260316B">B25J13/08</further-classification>  
        <further-classification edition="200601120260316B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商平田機工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野拓海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬼海大司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKAI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種容器開閉裝置、搬送裝置及搬送系統，其藉由容器開閉裝置而精度良好地檢測設置於容器的支撐部的高度位置，並將其檢測結果反映至搬送裝置的搬送動作的控制中，防止保持於手的被搬送物與支撐部碰撞、或者手與支撐於支撐部的被搬送物碰撞。容器開閉裝置分別檢測第一支撐部以及第二支撐部在上下方向上的高度位置，並算出第一支撐部的第一位置偏移量及第二支撐部的第二位置偏移量。搬送裝置基於檢測部的檢測結果或算出部的算出結果，判定第一支撐部以及第二支撐部的高度位置是否異常。另外，搬送裝置以及搬送系統選擇第一位置偏移量以及第二位置偏移量中的一個作為插入高度修正量，基於所選擇的插入高度修正量，導出手的插入高度，使手升降至所導出的插入高度，使手以修正後的插入高度向容器插入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:搬送系統</p>  
        <p type="p">50:容器開閉裝置</p>  
        <p type="p">60:處理裝置</p>  
        <p type="p">100:搬送裝置</p>  
        <p type="p">110:框體</p>  
        <p type="p">112:框部</p>  
        <p type="p">114:壁部</p>  
        <p type="p">116:移動體</p>  
        <p type="p">118:導引結構</p>  
        <p type="p">120:搬送機構</p>  
        <p type="p">122:手</p>  
        <p type="p">124:台座部</p>  
        <p type="p">126:臂部</p>  
        <p type="p">128:搬送驅動部</p>  
        <p type="p">H:容器</p>  
        <p type="p">OP:開口</p>  
        <p type="p">W:被搬送物</p>  
        <p type="p">X:左右方向</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Z:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2980" publication-number="202626884"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626884.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感放射線性組合物、硬化膜及其製造方法、半導體元件及顯示元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">C08G77/20</main-classification>  
        <further-classification edition="200601120260316B">C08K5/057</further-classification>  
        <further-classification edition="200601120260316B">G03F7/023</further-classification>  
        <further-classification edition="200601120260316B">G03F7/028</further-classification>  
        <further-classification edition="200601120260316B">G03F7/075</further-classification>  
        <further-classification edition="200601120260316B">G03F7/26</further-classification>  
        <further-classification edition="200601120260316B">C08F220/32</further-classification>  
        <further-classification edition="200601120260316B">C08F230/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蛸島薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKOJIMA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅岡高英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAOKA, TAKAHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可形成顯影密接性優異的硬化膜的感放射線性組合物。一種感放射線性組合物，含有：聚合物，為選自由包含具有式（1）所表示的基或酸解離性基的結構單元（I）的聚合物及矽氧烷聚合物所組成的群組中的至少一種；光酸產生劑；以及具有疏水性基與羥基鍵結於矽原子上而成的部分結構、且不具有烷氧基的矽醇化合物。式（1）中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立地為氫原子、鹵素原子、羥基、碳數1～6的烷氧基、碳數1～10的烷基或苯基。其中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;中的一個以上為碳數1～6的烷氧基。“*”表示鍵結鍵。 &lt;br/&gt;    &lt;img align="absmiddle" height="142px" width="260px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2981" publication-number="202626341"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626341.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學積層體、附貼合層的光學積層體及其製造方法</chinese-title>  
        <english-title>OPTICAL LAMINATE, OPTICAL LAMINATE WITH LAMINATED LAYER, AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260316B">B32B7/022</main-classification>  
        <further-classification edition="200601120260316B">B32B7/12</further-classification>  
        <further-classification edition="201801120260316B">C09J7/29</further-classification>  
        <further-classification edition="200601120260316B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石貴志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神野亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JINNO, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永安智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYASU, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供光學積層體、附貼合層的光學積層體及其製造方法，該光學積層體係即使在具有馬氏硬度(Martens hardness)小的相位差層的光學積層體中，也可期望抑制光學特性的降低。 &lt;br/&gt;本發明之光學積層體係在線性偏光層的單面或雙面依序具有具保護層的偏光板、第1相位差層及第2相位差層。第1相位差層係包含聚合性液晶化合物的硬化物層之第1液晶層，第2相位差層係包含聚合性液晶化合物的硬化物層之第2液晶層。第2相位差層的加壓速度1mN/5秒、蠕變時間(creep time)5秒中的馬氏硬度H1係10 N/mm&lt;sup&gt;2&lt;/sup&gt;以下。光學積層體的第2相位差層側之加壓速度1mN/5秒、蠕變時間5秒中的馬氏硬度H2與馬氏硬度H1之比(H2/H1)係15以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide an optical laminate that can be expected to suppress deterioration of optical characteristics even in an optical laminate having a retardation layer having a low Martens hardness, an optical laminate with a laminated layer, and a manufacturing method thereof. &lt;br/&gt;The optical laminate has a polarizing plate having protective layers on one or both sides of a linearly polarizing layer, a first retardation layer, and a second retardation layer in this order. The first retardation layer includes a first liquid crystal layer which is a cured product layer of a polymerizable liquid crystal compound, and the second retardation layer includes a second liquid crystal layer which is a cured product layer of a polymerizable liquid crystal compound. The Martens hardness H1 of the second retardation layer at a pressurizing speed of 1 mN/ 5s and a creep time of 5s is 10 N/ mm&lt;sup&gt;2&lt;/sup&gt; or less. The ratio (H2/ H1) of the Martens hardness H2 to the Martens hardness H1 at a pressurizing speed of 1 mN/ 5s and a creep time of 5s on the second retardation layer side of the optical laminate is 15 or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:光學積層體</p>  
        <p type="p">10:第1相位差層</p>  
        <p type="p">11:第1配向層</p>  
        <p type="p">12:第1液晶層</p>  
        <p type="p">20:第2相位差層</p>  
        <p type="p">21:第2配向層</p>  
        <p type="p">22:第2液晶層</p>  
        <p type="p">31:第1貼合層</p>  
        <p type="p">32:第2貼合層</p>  
        <p type="p">40:偏光板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2982" publication-number="202628910"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628910.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬送機器人系統及基板檢測方法</chinese-title>  
        <english-title>SUBSTRATE TRANSPORT ROBOT SYSTEM AND SUBSTRATE DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260317B">H10P72/50</main-classification>  
        <further-classification edition="202601120260317B">H10P72/30</further-classification>  
        <further-classification edition="200601120260317B">G01N21/95</further-classification>  
        <further-classification edition="200601120260317B">B25J13/08</further-classification>  
        <further-classification edition="201701120260317B">G06T7/521</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤森一夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMORI, KAZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤匡裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板搬送機器人系統係具備：機器人，係搬送基板；照射部，係對機器人所保持之基板的主表面照射具有預定的形狀的檢測光；拍攝部，係拍攝基板，從而拍攝在基板的主表面反射的檢測光；以及控制部，係根據以拍攝部所拍攝到的檢測光的拍攝影像，檢測基板的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate transport robot system according to the present invention includes: a robot that transports a substrate; an irradiation unit that irradiates a detection light having a predetermined shape onto a main surface of the substrate held by the robot; an imaging unit that images the detection light reflected from the main surface of the substrate by imaging the substrate; and a control unit that detects the state of the substrate based on the image of the detection light captured by the imaging unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:搬送室</p>  
        <p type="p">11:前表面</p>  
        <p type="p">11a:裝載埠</p>  
        <p type="p">12:背面</p>  
        <p type="p">13:頂面</p>  
        <p type="p">20:機器人</p>  
        <p type="p">30:對準器</p>  
        <p type="p">30a:基板載置部</p>  
        <p type="p">40:拍攝部</p>  
        <p type="p">50:照射部</p>  
        <p type="p">60:控制部</p>  
        <p type="p">101:基板</p>  
        <p type="p">101a:主表面</p>  
        <p type="p">110:FOUP</p>  
        <p type="p">403:裝載緩衝部</p>  
        <p type="p">L1:檢測光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2983" publication-number="202628354"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628354.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由傳輸線數量定義的向量空間的阻抗調諧效用</chinese-title>  
        <english-title>IMPEDANCE TUNING UTILITY OF VECTOR SPACE DEFINED BY TRANSMISSION LINE QUANTITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H03F1/56</main-classification>  
        <further-classification edition="200601120260316B">H03H7/40</further-classification>  
        <further-classification edition="200601120260316B">H05H1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫姆　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMOU, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼德森　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETERSON, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所揭示的實施例包括一種在半導體處理工具中進行阻抗調諧的方法。在一實施例中，該方法包括量測傳輸線的電壓和電流；將類比電壓信號和類比電流信號轉換成數位電壓信號和數位電流信號；從該數位電壓信號和該數位電流信號計算u向量；用該u向量的實分量計算第一電容器的C1位置，以及用該u向量的虛分量計算第二電容器的C2位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein include a method of impedance tuning in a semiconductor processing tool. In an embodiment, the method comprises measuring a voltage and a current of a transmission line, converting an analog voltage signal and an analog current signal into a digital voltage signal and a digital current signal, calculating a u-vector from the digital voltage signal and the digital current signal, calculating a C1 position of a first capacitor with real components of the u-vector, and calculating a C2 position of a second capacitor with imaginary components of the u-vector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電漿處理工具</p>  
        <p type="p">120:電漿腔室</p>  
        <p type="p">122:陰極</p>  
        <p type="p">130:阻抗匹配網路</p>  
        <p type="p">132&lt;sub&gt;1&lt;/sub&gt;:電源</p>  
        <p type="p">132&lt;sub&gt;n&lt;/sub&gt;:電源</p>  
        <p type="p">134:過程功率控制模組</p>  
        <p type="p">151&lt;sub&gt;1&lt;/sub&gt;:感測器</p>  
        <p type="p">151&lt;sub&gt;n&lt;/sub&gt;:感測器</p>  
        <p type="p">152:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2984" publication-number="202626933"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626933.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105613</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有光配向性之熱硬化性液晶組合物、配向膜兼相位差膜及其製造方法、相位差板及其製造方法、光學構件及其製造方法、以及顯示裝置</chinese-title>  
        <english-title>THERMOSETTING LIQUID CRYSTAL COMPOSITION HAVING PHOTO-ALIGHMENT PROPERTY, ALIGNMENT AND RETARDATION FILM AND METHOD FOR PRODUCING THE SAME, RETARDATION PLATE AND METHOD FOR PRODUCING THE SAME, OPTICAL MEMBER AND METHOD FOR PRODUCING THE SAME, AND A DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C08L25/02</main-classification>  
        <further-classification edition="200601120260325B">C08L25/04</further-classification>  
        <further-classification edition="200601120260325B">C08L33/14</further-classification>  
        <further-classification edition="200601120260325B">C08L47/00</further-classification>  
        <further-classification edition="200601120260325B">C08L33/24</further-classification>  
        <further-classification edition="200601120260325B">C08F212/04</further-classification>  
        <further-classification edition="200601120260325B">C08F220/30</further-classification>  
        <further-classification edition="200601120260325B">C08F220/34</further-classification>  
        <further-classification edition="200601120260325B">C08F220/54</further-classification>  
        <further-classification edition="200601120260325B">C08F222/10</further-classification>  
        <further-classification edition="200601120260325B">C08F236/20</further-classification>  
        <further-classification edition="200601120260325B">C09K19/38</further-classification>  
        <further-classification edition="200601120260325B">C09K19/56</further-classification>  
        <further-classification edition="200601120260325B">G02B5/30</further-classification>  
        <further-classification edition="200601120260325B">G02F1/13363</further-classification>  
        <further-classification edition="200601120260325B">G02F1/1337</further-classification>  
        <further-classification edition="200601120260325B">H05B33/02</further-classification>  
        <further-classification edition="200601120260325B">H05B33/10</further-classification>  
        <further-classification edition="202301120260325B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>入江俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIE, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥山健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUYAMA, KEN-ICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田和之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋輝賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TERUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYAMA, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有光配向性之熱硬化性液晶組合物，其含有：側鏈型液晶聚合物(A)，其具有於側鏈含有液晶性部分之液晶性結構單元與於側鏈含有伸烷基之非液晶性結構單元；共聚物(B)，其具有於側鏈含有光配向性基之光配向性結構單元與於側鏈含有熱交聯性基之熱交聯性結構單元，且上述光配向性結構單元於光配向性基與單體單元之間不具有直鏈伸烷基；及熱交聯劑(C)，其與上述熱交聯性結構單元之熱交聯性基鍵結。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a thermosetting liquid crystal composition having photo-alignment property, the composition comprising a side-chain liquid crystal polymer (A) which comprises a liquid crystalline constitutional unit including a liquid crystalline moiety in a side chain thereof and a non-liquid crystalline constitutional unit including an alkylene group in a side chain thereof, a copolymer (B) which comprises a photo-alignment constitutional unit including a photo-alignment group in a side chain thereof and a thermally crosslinkable constitutional unit including a thermally crosslinkable group in a side chain thereof and in which the photo-alignment constitutional unit does not include a linear alkylene group between the photo-alignment group and a monomer unit, and a thermal crosslinking agent (C) which is bound to the thermally crosslinkable group of the thermally crosslinkable constitutional unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:配向層兼相位差層</p>  
        <p type="p">10:配向膜兼相位差膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2985" publication-number="202628165"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628165.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動地獲得訓練影像以用於訓練機器學習模型之方法與設備及相關非暫時性電腦可讀媒體</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR AUTOMATICALLY OBTAINING TRAINING IMAGES FOR USE IN TRAINING A MACHINE LEARNING MODEL AND RELATED NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H01J37/26</main-classification>  
        <further-classification edition="201901120260317B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周文天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WENTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于良江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, LIANGJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦凌凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, LINGLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種自動地獲得訓練影像以訓練改良影像品質之一機器學習模型之方法。該方法可包含分析關於一產品之一佈局的複數個資料型樣以識別該產品之一樣品上之複數個訓練位置以供用於訓練該機器學習模型。該方法可包含針對該複數個訓練位置中之每一者獲得具有一第一品質之一第一影像，及針對該複數個訓練位置中之每一者獲得具有一第二品質之一第二影像，該第二品質高於該第一品質。該方法可包含使用該第一影像及該第二影像來訓練該機器學習模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:流程圖</p>  
        <p type="p">101:圖形資料庫系統(GDS)</p>  
        <p type="p">102:SEM取樣系統</p>  
        <p type="p">105:參考影像</p>  
        <p type="p">107:品質強化系統</p>  
        <p type="p">108:低品質影像</p>  
        <p type="p">109:高品質影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2986" publication-number="202627695"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627695.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源裝置、光刻裝置和物品製造方法</chinese-title>  
        <english-title>LIGHT SOURCE APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">G03F7/20</main-classification>  
        <further-classification edition="200601120260320B">G02B5/08</further-classification>  
        <further-classification edition="200601120260320B">G02B5/10</further-classification>  
        <further-classification edition="202601120260320B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤真寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, MAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name></last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, MIZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光源裝置、光刻裝置和物品製造方法。光源裝置包括：光源；第一殼體，其被構造為容納光源；第一殼體的平面，其包括與第一殼體的外部連通的多個開口；以及多個部，其佈置在平面上，各個部具有相對於平面而傾斜的傾斜面。多個部中的至少一個部反射來自光源的光，使得反射光藉由多個開口中的至少一個開口離開第一殼體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light source apparatus includes a light source, a first housing configured to store the light source, a planar surface of the first housing including a plurality of openings communicating with an outside of the first housing, and a plurality of portions, disposed on the planar surface, each having an inclined plane inclining with respect to the planar surface. At least one of the plurality of portions reflects light from the light source, causing the reflected light to exit the first housing through at least one of the plurality of openings.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:燈</p>  
        <p type="p">50:反射鏡</p>  
        <p type="p">110:光源裝置</p>  
        <p type="p">111:第一殼體</p>  
        <p type="p">112:第二殼體</p>  
        <p type="p">AP:亮點</p>  
        <p type="p">FP1:第一焦點</p>  
        <p type="p">FP2:第二焦點</p>  
        <p type="p">OAX:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2987" publication-number="202625963"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625963.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105726</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">A61B5/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾奎皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, KUEI-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔德高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUI, TE KAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凱弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KAI HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林弘毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置。該電子裝置包括一可撓性元件及鄰近於該可撓性元件且經組態以偵測一生物信號之一感測元件。該電子裝置亦包括一主動組件，該主動組件在該可撓性元件中且與該感測元件電連接。亦揭示一種製造一電子裝置之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">10:可撓性元件/載體</p>  
        <p type="p">10c:腔體</p>  
        <p type="p">10e:外表面</p>  
        <p type="p">10i:內表面</p>  
        <p type="p">10m:底側</p>  
        <p type="p">10r:空間</p>  
        <p type="p">10t:頂側</p>  
        <p type="p">11:感測元件</p>  
        <p type="p">12:保護層</p>  
        <p type="p">13:連接器</p>  
        <p type="p">14:主動組件</p>  
        <p type="p">14p:導電元件</p>  
        <p type="p">h:高度</p>  
        <p type="p">w1:最大外徑</p>  
        <p type="p">w2:最小外徑</p>  
        <p type="p">w3:內徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2988" publication-number="202626388"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626388.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105760</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>浮空立體顯示裝置及其使用方法</chinese-title>  
        <english-title>FLOATING STEREOSCOPIC DISPLAY DEVICE AND METHOD FOR USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260318B">B60K35/23</main-classification>  
        <further-classification edition="202001120260318B">G02B30/56</further-classification>  
        <further-classification edition="200601120260318B">G02B27/01</further-classification>  
        <further-classification edition="201801120260318B">H04N13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達擎股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO DISPLAY PLUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪詩堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, SHIH-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張新安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宇翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種浮空立體顯示裝置。該裝置包括浮空顯示模組以及反射模組。浮空顯示模組包括處理器，其中，處理器響應於輸入影像資料產生立體影像資料，並提供立體影像資料至浮空顯示模組。浮空顯示模組根據立體影像資料投射浮空立體實像。反射模組將浮空立體實像反射於立體成像空間中，形成反射浮空立體實像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a floating stereoscopic display device. The device includes a floating display module and a reflective module. The floating display module includes an image processor, wherein the image processor generates a stereoscopic image data in response to an input image data and provides the stereoscopic image data to the floating display module. The floating display module projects a floating stereoscopic real image according to the stereoscopic image data. The reflective module reflects the floating stereoscopic real image in a stereoscopic display space to form a reflective floating stereoscopic real image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:浮空立體顯示裝置</p>  
        <p type="p">110:浮空顯示模組</p>  
        <p type="p">111:光場顯示器</p>  
        <p type="p">112:反射投影元件</p>  
        <p type="p">120:處理器</p>  
        <p type="p">130:輸入影像資料</p>  
        <p type="p">140:立體影像資料</p>  
        <p type="p">150:反射浮空立體實像</p>  
        <p type="p">151:浮空立體實像</p>  
        <p type="p">160:反射模組</p>  
        <p type="p">170:立體成像空間</p>  
        <p type="p">195:使用者</p>  
        <p type="p">Ie:投射光徑</p>  
        <p type="p">Ir:反射光徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2989" publication-number="202628646"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628646.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經改良之功率器件之設計及製法</chinese-title>  
        <english-title>DESIGN AND MANUFACTURE OF IMPROVED POWER DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260316B">H10D62/10</main-classification>  
        <further-classification edition="202501120260316B">H10D48/00</further-classification>  
        <further-classification edition="202501120260316B">H10D30/60</further-classification>  
        <further-classification edition="202501120260316B">H10D30/87</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＧｅｎｅＳｉＣ 半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENESIC SEMICONDUCTOR INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑達雷森　西達斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDARESAN, SIDDARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　蘭比爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, RANBIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴宰勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JAEHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種金屬絕緣體場效應電晶體。該金屬絕緣體半導體場效應電晶體包括位於碳化矽基板上的單位單元。該單位單元包括在具有第二導電類型的井區的溝槽、第一導電類型的源極區、具有第二導電類型的第一下沉區，以及具有該第二導電類型的第二下沉區。該第一下沉區的深度等於或大於該井區的深度。該第一下沉區和該第二下沉區中的每一者與具有第一導電類型的區域接觸，以形成p-n接面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A metal-insulator-semiconductor field effect transistor is provided. The metal-insulator-semiconductor field effect transistor comprises a unit cell on a SiC substrate. The unit cell comprises a trench in a well region having a second conduction type, a source region of a first conduction type, a first sinker region having a second conduction type, and a second sinker region having the second conduction type. The first sinker region has a depth that is equal to or greater than a depth of the well region. Each of the first sinker region and the second sinker region is in contact with a region having a first conduction type to form a p-n junction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:N+基板</p>  
        <p type="p">302:N-漂移層</p>  
        <p type="p">303:p井層</p>  
        <p type="p">304:N+源極區</p>  
        <p type="p">305:閘極氧化物</p>  
        <p type="p">306:多晶矽閘極</p>  
        <p type="p">307:ILD層</p>  
        <p type="p">308:源極互連金屬化層</p>  
        <p type="p">309:P型下沉區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2990" publication-number="202626688"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626688.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於極紫外光微影術的組合物及相關方法</chinese-title>  
        <english-title>COMPOSITIONS FOR EXTREME ULTRAVIOLET LITHOGRAPHY AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F7/22</main-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法法德　克勞迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAFARD, CLAUDIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾曼特　大衛　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERMERT, DAVID M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡麥隆　湯瑪斯　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMERON, THOMAS M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供單取代矽醇錫化合物及相關方法。一種方法包括使單取代錫(IV)化合物與矽醇化物反應物接觸以形成單取代矽醇錫化合物。一種組合物包括單取代矽醇錫化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Mono-substituted tin silanolate compounds and related methods are provided. A method comprises contacting a mono-substituted tin (IV) compound with a silanolate reactant to form a mono-substituted tin silanolate compound. A composition comprises a mono-substituted tin silanolate compound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:獲得/步驟</p>  
        <p type="p">104:獲得/步驟</p>  
        <p type="p">106:接觸/步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2991" publication-number="202628805"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628805.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105830</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體器件的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10P14/60</main-classification>  
        <further-classification edition="202601120260316B">H10P95/90</further-classification>  
        <further-classification edition="202601120260316B">H10P50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIAYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體器件的製造方法，包括：在襯底表面形成犧牲區；在犧牲區上形成疊層結構，疊層結構包括交替堆疊的第一半導體層和第二半導體層；去除犧牲區，以在襯底與疊層結構之間形成空腔；在空腔內填充絕緣層；去除第一半導體層和第二半導體層中的一者；在第一半導體層和第二半導體層中的另一者周圍形成柵極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor device, including: forming a sacrificial region on a surface of a substrate; forming a stacked structure on the sacrificial region, wherein the stacked structure including alternately stacked first semiconductor layers and second semiconductor layers; removing the sacrificial region to form a cavity between the substrate and the stacked structure; filling the cavity with an insulating layer; removing one of the first semiconductor layer and the second semiconductor layer; and forming a gate structure around another of the first semiconductor layer and the second semiconductor layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:襯底</p>  
        <p type="p">120:第二半導體層</p>  
        <p type="p">121:柵極結構</p>  
        <p type="p">151:絕緣層</p>  
        <p type="p">160:淺溝槽隔離結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2992" publication-number="202627197"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627197.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製程腔室及用於氣相沉積製程腔室的進氣襯體</chinese-title>  
        <english-title>PROCESS CHAMBERS AND AIR INLET LINER FOR VAPOR DEPOSITION PROCESS CHAMBERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C23C16/54</main-classification>  
        <further-classification edition="200601120260318B">C23C16/455</further-classification>  
        <further-classification edition="200601120260318B">C30B25/12</further-classification>  
        <further-classification edition="202601120260318B">H10P72/00</further-classification>  
        <further-classification edition="200601120260318B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周志文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHI WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王磊磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LEI LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於氣相沉積製程腔室的進氣襯體，用於與一內襯的進氣口對接，該進氣襯體開設有多個進氣孔，該多個進氣孔在一第一方向排列，且相互隔離，該多個進氣孔的貫通方向一致，該第一方向與該進氣孔的貫通方向相垂直。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inner liner for a vapor deposition process chamber is provided. An air inlet liner for a vapor deposition process chamber, for docking with an air inlet of an inner liner, is provided. The air inlet liner includes several air inlets arranged in a first direction and isolated from each other. Those air inlets have the same through direction, and the first direction is perpendicular to the through direction of the air inlets.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">33:進氣襯體</p>  
        <p type="p">032:第二排氣段</p>  
        <p type="p">101:弧形導流段</p>  
        <p type="p">305:環形定位凹槽</p>  
        <p type="p">307:進氣孔</p>  
        <p type="p">311:第一導流件</p>  
        <p type="p">312:第二導流件</p>  
        <p type="p">314:擋板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2993" publication-number="202626627"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626627.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於靶向降解雄激素受體之化合物及方法</chinese-title>  
        <english-title>COMPOUNDS AND METHODS FOR THE TARGETED DEGRADATION OF ANDROGEN RECEPTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D401/14</main-classification>  
        <further-classification edition="200601120260401B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260401B">A61K31/496</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞文納營運公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARVINAS OPERATIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>可魯　安卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREW, ANDREW P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董　漢清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, HANQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史奈德　勞倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNYDER, LAWRENCE B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　警</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於化合物、其製劑及此等化合物在治療有需要之個體的前列腺癌，包括轉移性及/或去勢抵抗性前列腺癌中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure pertains to compounds, the preparation thereof, and the use of these compounds in the treatment of prostate cancer, including metastatic and/or castrate-resistant prostate cancer, in subjects in need thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2994" publication-number="202627466"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627466.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115105990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>診斷裝置、半導體製造裝置系統、半導體裝置製造系統及診斷方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G01N25/18</main-classification>  
        <further-classification edition="202601120260317B">H10P72/70</further-classification>  
        <further-classification edition="200601120260317B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙普社</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, PUSHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝倉涼次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKURA, RYOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角屋誠浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMIYA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在於提供檢測靜電吸盤的膜的表面狀態的異常的技術。一種診斷裝置，針對半導體製造裝置的狀態進行診斷，前述半導體製造裝置具備載置被靜電吸附於膜的樣品之樣品台，前述診斷裝置取得導入至樣品的能量的變化前後的溫度資料，基於取得的前述溫度資料而檢測膜的異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體製造裝置系統</p>  
        <p type="p">100:故障診斷裝置(診斷裝置)</p>  
        <p type="p">101:資料收集部</p>  
        <p type="p">102:特徵量計算部</p>  
        <p type="p">103:異常檢測部</p>  
        <p type="p">200:蝕刻裝置(半導體製造裝置)</p>  
        <p type="p">201:電漿控制部</p>  
        <p type="p">202:腔室</p>  
        <p type="p">204:感測器資料</p>  
        <p type="p">RS:分析結果</p>  
        <p type="p">NW:網路線路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2995" publication-number="202628312"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628312.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>方法</chinese-title>  
        <english-title>METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">H02J7/32</main-classification>  
        <further-classification edition="201601120260317B">H02J50/10</further-classification>  
        <further-classification edition="202601120260317B">G06F1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瑞薩電子美國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENESAS ELECTRONICS AMERICA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁志刚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, ZHIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　麥胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, MEHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林成根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SUNGKEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛倫　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORAN, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">例示性實施例可包含一種器件，該器件具有：一輸入功率組件；一系統供應組件；一感應式充電器組件，其經可操作地耦合至該輸入組件及該系統組件；及一直接充電器組件，其經可操作地耦合至該感應式充電器及該系統組件。例示性實施例可進一步包含在一第一器件節點處經可操作地耦合至該輸入功率組件之一輸出節點的該感應式充電器組件之一輸入節點及該直接充電器組件之一輸入節點。例示性實施例亦可包含一種方法，該方法：接收一輸入功率信號；獲得一充電狀況；根據該經獲得充電狀況滿足一第一充電條件而進入一第一充電狀態；及根據該經獲得充電狀況滿足一第二充電條件而進入一第二充電狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary embodiments may include a device with an input power component, a system supply component, an inductive charger component operatively coupled to the input component and the system component, and a direct charger component operatively coupled to the inductive charger and the system component. Exemplary embodiments may further include an input node of the inductive charger component and an input node of the direct charger component operatively coupled to an output node of the input power component at a first device node. Exemplary embodiments may also include a method of receiving an input power signal, obtaining a charging condition, entering a first charging state, in accordance with the obtained charging condition satisfying a first charging condition, and entering a second charging state, in accordance with the obtained charging condition satisfying a second charging condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:輸入</p>  
        <p type="p">104:輸入控制器</p>  
        <p type="p">106:電池</p>  
        <p type="p">108:直接充電器</p>  
        <p type="p">110:負載</p>  
        <p type="p">112:充電器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2996" publication-number="202626084"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626084.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106057</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＰＴＨ綴合物的液體藥物製劑</chinese-title>  
        <english-title>LIQUID PHARMACEUTICAL FORMULATIONS OF PTH CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K38/29</main-classification>  
        <further-classification edition="201701120260324B">A61K47/60</further-classification>  
        <further-classification edition="200601120260324B">A61K47/12</further-classification>  
        <further-classification edition="200601120260324B">A61K47/18</further-classification>  
        <further-classification edition="200601120260324B">A61K47/36</further-classification>  
        <further-classification edition="200601120260324B">A61K47/02</further-classification>  
        <further-classification edition="200601120260324B">A61K47/10</further-classification>  
        <further-classification edition="200601120260324B">A61K9/08</further-classification>  
        <further-classification edition="200601120260324B">A61P5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商阿森迪斯藥物骨疾病股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASCENDIS PHARMA BONE DISEASES A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯堪德斯　安雅　Ｒ　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKANDS, ANJA R. H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克利曼　費力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLEEMANN, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索瑞森　邁克爾　杜蘭德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SORENSEN, MICHAEL DUELUND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜倫　茱利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARON, JULIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯普羅格　肯尼特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPROGOEE, KENNETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　艾里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMANN, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">液體藥物製劑，其中所述藥物製劑包含PTH綴合物、緩衝劑、等滲劑、防腐劑和任選的抗氧化劑，並且其中所述PTH綴合物包含與水溶性載體部分共價和可逆地綴合的PTH部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid pharmaceutical formulation, wherein the pharmaceutical formulation comprises a PTH conjugate, a buffering agent, an isotonicity agent, a preservative and optionally an antioxidant and wherein the PTH conjugate comprises a PTH moiety that is covalently and reversibly conjugated to a water-soluble carrier moiety.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2997" publication-number="202626167"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626167.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自混合物製備多肽之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR PREPARING A POLYPEPTIDE FROM A MIXTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B01D15/30</main-classification>  
        <further-classification edition="200601120260331B">B01D15/18</further-classification>  
        <further-classification edition="200601120260331B">C07K1/20</further-classification>  
        <further-classification edition="200601120260331B">C07K1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商里珍納龍藥品有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利維尼　伊莎貝爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIVIGNI, ISABELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克德莫特　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCDERMOTT, STEFANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬蒂拉　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTILA, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊利　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REILLY, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案之實施例係關於自包括目標多肽之混合物製備該目標多肽之方法。該方法可包括使該混合物與包括多個層析區之疏水性相互作用層析(HIC)裝置接觸。該方法可進一步包括使該目標多肽穿過該HIC裝置之至少第一區及第二區之出口。包括該目標多肽之該混合物在第一區中之滯留時間可與一或多個移動相在該第二區中之滯留時間大致相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure are directed to methods for preparing a target polypeptide from a mixture including the target polypeptide. The method may include contacting the mixture to a hydrophobic interaction chromatography (HIC) apparatus including multiple chromatographic zones. The method may further include passing the target polypeptide through the outlets of at least a first zone and a second zone of the HIC apparatus. A residence time for the mixture including the target polypeptide in a first zone may be approximately the same as a residence time of one or more mobile phases in the second zone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2998" publication-number="202628192"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628192.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理設備</chinese-title>  
        <english-title>A SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01J37/32</main-classification>  
        <further-classification edition="202601120260325B">H10P72/70</further-classification>  
        <further-classification edition="202601120260325B">H10P72/00</further-classification>  
        <further-classification edition="202601120260325B">H10P50/20</further-classification>  
        <further-classification edition="202601120260325B">H10P10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉光星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, KWANG SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種基板處理設備。該基板處理設備包括：外殼；卡盤，其用於支撐基板；介電板，其與卡盤相隔佈置且中間放置有基板；供氣單元，其用於提供工藝氣體，該工藝氣體用於對基板邊緣區域進行電漿處理；保護罩，其覆蓋介電板的整個底面且用於保護介電板免受所述電漿的影響；以及結合單元，其用於從介電板拆卸保護罩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:基板處理設備</p>  
        <p type="p">100:外殼</p>  
        <p type="p">110:上部外殼</p>  
        <p type="p">120:下部外殼</p>  
        <p type="p">102:處理空間</p>  
        <p type="p">104:排氣孔</p>  
        <p type="p">200:下電極單元</p>  
        <p type="p">210:卡盤</p>  
        <p type="p">212:冷卻流道</p>  
        <p type="p">214:冷卻流體供給管線</p>  
        <p type="p">216:冷卻液排放管線</p>  
        <p type="p">218:冷卻液供應源</p>  
        <p type="p">220:電源部件</p>  
        <p type="p">222:電源</p>  
        <p type="p">224:匹配器</p>  
        <p type="p">226:電源線</p>  
        <p type="p">230:絕緣環</p>  
        <p type="p">250:下邊緣電極</p>  
        <p type="p">260:驅動器</p>  
        <p type="p">270:軸</p>  
        <p type="p">300:上電極單元</p>  
        <p type="p">310:介電板</p>  
        <p type="p">320:上邊緣電極</p>  
        <p type="p">330:支撐體</p>  
        <p type="p">331:邊緣底面</p>  
        <p type="p">332:中間底面</p>  
        <p type="p">400:供氣單元</p>  
        <p type="p">410:第一供氣單元</p>  
        <p type="p">420:第一供氣管線</p>  
        <p type="p">422:噴出端</p>  
        <p type="p">430:第二供氣單元</p>  
        <p type="p">440:第二供氣管線</p>  
        <p type="p">442:第二噴出端</p>  
        <p type="p">510:保護層</p>  
        <p type="p">511:第一保護層</p>  
        <p type="p">512:第二保護層</p>  
        <p type="p">513:第三保護層</p>  
        <p type="p">514:第四保護層</p>  
        <p type="p">520:保護罩</p>  
        <p type="p">900:控制器</p>  
        <p type="p">G1:第一氣體</p>  
        <p type="p">G2:第二氣體</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2999" publication-number="202628464"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628464.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多時槽時槽格式指示符（ＳＦＩ）擴展</chinese-title>  
        <english-title>MULTI-SLOT SLOT FORMAT INDICATOR (SFI) EXTENSIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260325B">H04W72/232</main-classification>  
        <further-classification edition="202301120260325B">H04W72/0446</further-classification>  
        <further-classification edition="200901120260325B">H04W16/14</further-classification>  
        <further-classification edition="202301120260325B">H04W72/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOXIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李熙春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HEECHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了與多時槽時槽格式指示符（SFI）相關的無線通訊系統和方法。在一個實施例中，第一無線通訊設備與第二無線通訊設備傳送針對第一時槽集合的第一SFI和針對與該第一時槽集合重疊的第二時槽集合的第二SFI。該第一無線通訊設備基於該第一SFI或者該第二SFI中的至少一項與該第二無線通訊設備通訊。在一個實施例中，第一無線通訊設備與第二無線通訊設備傳送針對第一時槽的配置和指示針對包括該第一時槽的時槽集合的時槽格式的SFI。該SFI對於該第一時槽指示未指定的時槽格式。該第一無線通訊設備在該第一時槽中基於該配置與該第二無線通訊設備通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Wireless communications systems and methods related to multi-slot slot format indicators (SFIs) are provided. In one embodiment, a first wireless communication device communicates, with a second wireless communication device, a first SFI for a first set of slots and a second SFI for a second set of slots overlapping with the first set of slots. The first wireless communication device communicates with the second wireless communication device based on at least one of the first SFI or the second SFI. In one embodiment, a first wireless communication device communicates, with a second wireless communication device, a configuration for a first slot and an SFI indicating slot formats for a set of slots including the first slot. The SFI indicates an unspecified slot format for the first slot. The first wireless communication device communicates with the second wireless communication device in the first slot based on the configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:無線通訊網路</p>  
        <p type="p">105a:BS</p>  
        <p type="p">105b:BS</p>  
        <p type="p">105c:BS</p>  
        <p type="p">105d:BS</p>  
        <p type="p">105e:BS</p>  
        <p type="p">105f:BS</p>  
        <p type="p">115a:UE</p>  
        <p type="p">115b:UE</p>  
        <p type="p">115c:UE</p>  
        <p type="p">115d:UE</p>  
        <p type="p">115e:UE</p>  
        <p type="p">115f:UE</p>  
        <p type="p">115g:UE</p>  
        <p type="p">115h:UE</p>  
        <p type="p">115i:UE</p>  
        <p type="p">115j:UE</p>  
        <p type="p">115k:UE</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3000" publication-number="202626097"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626097.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗人類ＭＡＣ－１之單株抗體及其用途</chinese-title>  
        <english-title>MONOCLONAL ANTIBODY AGAINST HUMAN MAC-1 AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K39/395</main-classification>  
        <further-classification edition="200601120260324B">C07K16/18</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification>  
        <further-classification edition="200601120260324B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商先知生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASCENDO BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂衍達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YEN-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃品諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宜芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, I-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供抗人類Mac-1之單株抗體。此等抗體可結合至不同狀態之Mac-1以改變Mac-1之生物功能。此等抗體可藉由TLR活化之免疫細胞調節Th1/Th2細胞激素分泌並可用於治療與急性及慢性發炎病症相關之疾病，諸如傳染性疾病，及癌症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Monoclonal antibodies against human Mac-1 are provided. These antibodies can bind to different states of Mac-1 so as to alter the biofunctions of Mac-1. These antibodies can modulate Th1/Th2 cytokine secretions by TLR-activated immune cells and can be used for the treatments of diseases related to acute and chronic inflammatory disorders, such as infectious diseases, and cancers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3001" publication-number="202628467"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628467.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蜂巢運載工具到萬物設計原則</chinese-title>  
        <english-title>CELLULAR VEHICLE-TO-EVERYTHING DESIGN PRINCIPLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120260325B">H04W74/0816</main-classification>  
        <further-classification edition="200901120260325B">H04W16/14</further-classification>  
        <further-classification edition="202301120260325B">H04W72/0446</further-classification>  
        <further-classification edition="202301120260325B">H04W72/566</further-classification>  
        <further-classification edition="201801120260325B">H04W4/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬拉帝　杜爾加普拉薩德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLADI, DURGA PRASAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕帝　雪萊希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, SHAILESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了用於無線通訊的方法、系統和設備。5G設備可以在時間段的第一部分期間對運載工具到萬物系統中的安全訊息的控制通道傳輸進行解碼。5G設備可以至少部分地基於該解碼，來辨識可用於該時間段的資源區塊（RB）池。5G設備可以從可用的RB池中選擇RB子集，以用於在該時間段的第二部分期間的傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for wireless communication are described. A 5G device may decode a control channel transmission of a safety message in a vehicle-to-everything system during a first portion of a time period. The 5G device may identify, based at least in part on the decoding, a pool of resource blocks (RBs) that are available for the time period. The 5G device may select a subset of RBs from the available pool of RBs for a transmission during a second portion of the time period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:過程</p>  
        <p type="p">205:UE</p>  
        <p type="p">210:基地台</p>  
        <p type="p">215:方塊</p>  
        <p type="p">220:方塊</p>  
        <p type="p">225:方塊</p>  
        <p type="p">230:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3002" publication-number="202628587"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628587.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置、半導體記憶裝置之控制方法及半導體記憶裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260317B">H10B41/40</main-classification>  
        <further-classification edition="202301120260317B">H10B43/40</further-classification>  
        <further-classification edition="200601120260317B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西原大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIHARA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤弘康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIROYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式之半導體記憶裝置具備：第1積層膜，其係將複數個第1導電層與複數個第1絕緣層於第1方向上一層一層地交替積層而成，且於與第1方向交叉之第2方向、及與第1方向及第2方向交叉之第3方向上延伸；第1芯絕緣膜，其於第1方向上貫通第1積層膜，且包含氧化物；第2芯絕緣膜，其設置於第1芯絕緣膜之周圍，於第1方向上貫通第1積層膜，且包含氮化物；第3芯絕緣膜，其設置於第2芯絕緣膜之周圍，於第1方向上貫通第1積層膜，且包含氧化物；第1通道半導體膜，其設置於第3芯絕緣膜之周圍，且於第1方向上貫通第1積層膜；第1隧道絕緣膜，其設置於第1通道半導體膜之周圍，且於第1方向上貫通第1積層膜；第1電荷儲存膜，其設置於第1隧道絕緣膜之周圍，且於第1方向上貫通第1積層膜；第2積層膜，其係將複數個第2導電層與複數個第2絕緣層於第1方向上一層一層地交替積層而成，且於第2方向及第3方向上延伸；第4芯絕緣膜，其於第1方向上貫通第2積層膜，且包含氧化物；第2通道半導體膜，其設置於第4芯絕緣膜之周圍，且於第1方向上貫通第1積層膜；第2隧道絕緣膜，其設置於第2通道半導體膜之周圍，且於第1方向上貫通第2積層膜；及第2電荷儲存膜，其設置於第2隧道絕緣膜之周圍，且於第1方向上貫通第2積層膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30A:導電層</p>  
        <p type="p">31:導電層</p>  
        <p type="p">33:導電層</p>  
        <p type="p">34:導電層</p>  
        <p type="p">35:導電構件</p>  
        <p type="p">36:第1導電層</p>  
        <p type="p">37:第2導電層</p>  
        <p type="p">41:第1積層膜</p>  
        <p type="p">42:第2積層膜</p>  
        <p type="p">50:絕緣層</p>  
        <p type="p">53:絕緣層</p>  
        <p type="p">54:絕緣層</p>  
        <p type="p">55:絕緣層</p>  
        <p type="p">57:第1絕緣層</p>  
        <p type="p">58:絕緣層</p>  
        <p type="p">59:第2絕緣層</p>  
        <p type="p">75:導電構件</p>  
        <p type="p">76:導電構件</p>  
        <p type="p">80:第4芯絕緣膜</p>  
        <p type="p">81:第2通道半導體膜</p>  
        <p type="p">82:第2隧道絕緣膜</p>  
        <p type="p">83:第2電荷儲存膜</p>  
        <p type="p">84:第2阻擋絕緣膜</p>  
        <p type="p">90:第1芯絕緣膜</p>  
        <p type="p">91:第1通道半導體膜</p>  
        <p type="p">92:第1隧道絕緣膜</p>  
        <p type="p">93:第1電荷儲存膜</p>  
        <p type="p">94:第1阻擋絕緣膜</p>  
        <p type="p">96:第2芯絕緣膜</p>  
        <p type="p">97:第3芯絕緣膜</p>  
        <p type="p">110:記憶胞陣列</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">JT:接合部</p>  
        <p type="p">LMP:下部記憶體柱</p>  
        <p type="p">MP:記憶體柱</p>  
        <p type="p">MT0~MT7:記憶胞電晶體</p>  
        <p type="p">SGD:第1選擇閘極線</p>  
        <p type="p">SGS:第2選擇閘極線</p>  
        <p type="p">SHE:構件</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">ST1,ST2:選擇電晶體</p>  
        <p type="p">SU0~SU3:串組件</p>  
        <p type="p">UMP:上部記憶體柱</p>  
        <p type="p">WL0~WL7:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3003" publication-number="202628549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置及伺服器冷卻系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">H05K7/20</main-classification>  
        <further-classification edition="200601120260318B">F24F7/007</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商伸和控制工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINWA CONTROLS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, ISAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在本實施方式之伺服器冷卻系統(S)中，散熱裝置(1)具備：具有包含第1面(30A)及第2面(30B)之熱交換核(30C)之空冷式的熱交換器(30)；及藉由葉輪的旋轉，以作為氣體的空氣從第1面(30A)通過第2面(30B)的方式使空氣流動之複數個送風機(20)。並且，熱交換核(30C)具有使和空氣熱交換之熱媒體流通之複數個管(313、323)。並且，管(313、323)分別從第2面(30B)側朝向第1面(30A)側一邊蛇行一邊延伸，熱媒體從各個管(313、323)之中從第2面(30B)側朝向第1面(30A)側流動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:散熱裝置</p>  
        <p type="p">10:殼體</p>  
        <p type="p">20:送風機</p>  
        <p type="p">21:葉輪</p>  
        <p type="p">30:熱交換器</p>  
        <p type="p">30A:第1面</p>  
        <p type="p">30B:第2面</p>  
        <p type="p">30C:熱交換核</p>  
        <p type="p">310:上段熱交換核</p>  
        <p type="p">310A:上段第1面</p>  
        <p type="p">310B:上段第2面</p>  
        <p type="p">311:上段框</p>  
        <p type="p">313:管</p>  
        <p type="p">320:下段熱交換核</p>  
        <p type="p">320A:下段第1面</p>  
        <p type="p">320B:下段第2面</p>  
        <p type="p">321:下段框</p>  
        <p type="p">323:管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3004" publication-number="202628553"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628553.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H05K13/00</main-classification>  
        <further-classification edition="200601120260316B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福井祥吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUI, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>御所眞高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOSHO, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡村聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMURA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦智仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>URA, TOMOHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 使用超臨界狀態的處理流體將基板乾燥時，可抑制發生於基板表面上的微粒。 &lt;br/&gt;　　[技術內容] 一種基板處理裝置，是使用超臨界流體，對於在圖型形成面形成了液膜的基板，進行乾燥，具備：處理容器，是將基板收容並且被供給超臨界流體；及基板保持部，是在處理容器內將基板保持，且具有在圖型形成面朝上方的狀態下將基板從下方支撐的基座部；及第1檢出部，是檢出基座部對於水平面的傾斜；及姿勢調整機構，是調整基座部對於水平面的傾斜；及控制部，是藉由依據第1檢出部的檢出結果將姿勢調整機構控制，來進行基座部的水平校正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:超臨界乾燥裝置</p>  
        <p type="p">10:處理容器</p>  
        <p type="p">12:處理空間</p>  
        <p type="p">14:開口部</p>  
        <p type="p">16:流體供給部</p>  
        <p type="p">18:流體排出部</p>  
        <p type="p">20:基板保持部</p>  
        <p type="p">22:基座部</p>  
        <p type="p">24:蓋體</p>  
        <p type="p">26:支撐銷</p>  
        <p type="p">28:姿勢調整機構</p>  
        <p type="p">30:台座</p>  
        <p type="p">32:昇降致動器</p>  
        <p type="p">34:導軌</p>  
        <p type="p">36:行走體</p>  
        <p type="p">38:臂</p>  
        <p type="p">40:機框</p>  
        <p type="p">51~54:測距感測器(第1~4檢出部)</p>  
        <p type="p">60:基板昇降機</p>  
        <p type="p">62:昇降銷</p>  
        <p type="p">100:控制部</p>  
        <p type="p">101:運算部</p>  
        <p type="p">102:記憶部</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3005" publication-number="202627625"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627625.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學膜、眼鏡鏡片、眼鏡鏡片毛片、標準單光眼鏡鏡片及其組合</chinese-title>  
        <english-title>OPTICAL FILM, SPECTACLE LENS, SPECTACLE LENS BLANK, STANDARD SINGLE VISION SPECTACLE LENS AND THE COMBINATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">G02C7/08</main-classification>  
        <further-classification edition="200601120260317B">G02C7/00</further-classification>  
        <further-classification edition="200601120260317B">G02C7/02</further-classification>  
        <further-classification edition="200601120260317B">A61F9/013</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商恩塔米克控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NTHALMIC HOLDING PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中景緯視（蘇州）光學科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG JING WEI SHI (SUZHOU) OPTICAL TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芭卡羅朱　拉維　錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKARAJU, RAVI CHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及治療眼睛異常如近視的方法。 本發明包括一種用於處方，選擇，供應和裝配成對的近視管理眼鏡或在眼鏡前置鏡可附著非永久性輔助光學膜，或與標準單光結合使用的微型光學元件的套裝，裝配或套件的設備和方法。其中該裝置和配置方法為提供基本複曲面或散光或不對稱的方向性光學設計，以隨著時間來減慢，改善，控制，抑制或減少近視發展的速度，其中該方法可隨著時間和空間的變化來提供方向性光學或停止信號的處方性護理方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to means of managing eye-length disorders, like myopia. The invention includes an apparatus and methods for the prescription, selection, supply and fitting of sets, stocks, or kits of pairs of myopia management spectacles, or spectacle fronts, attachable impermanent auxiliary optical films or mini optical elements used in conjunction with standard single vision spectacles, wherein the apparatus and methods are configured to provide substantially toric, or astigmatic, or asymmetric, directional optical cues to decelerate, ameliorate, control, inhibit, or reduce the rate of myopia progression over time, wherein the method is a prescribed care regimen providing temporal and spatial variation to the directional optical cues or stop signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:-3D近視模型眼、近視眼</p>  
        <p type="p">301:入射光</p>  
        <p type="p">302:實施例之一</p>  
        <p type="p">303a:矢狀平面</p>  
        <p type="p">303b:切向平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3006" publication-number="202626331"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626331.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有在其上的複合結構的光學片材及其製造方法</chinese-title>  
        <english-title>OPTICAL SHEET HAVING A COMPOSITE STRUCTURE THEREON AND THE METHOD TO MAKE THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B29C59/02</main-classification>  
        <further-classification edition="200601120260327B">G02B5/02</further-classification>  
        <further-classification edition="200601320260327B">B29L11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友輝光電股份有限公司 桃園市大溪區新光東路80 號</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UBRIGHT OPTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　輝勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUI-YONG PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛隆賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIN, LUNG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊景安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHING-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮幼梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUAN, YU-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴建智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIEN CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘漢聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, HAN-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧民立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種形成光學片材的方法。該方法包含：提供一模具，其中該模具具有一第一表面；在該模具的該第一表面上形成複數個第一凹形狀，以使該模具的該第一表面改變成該模具的一第二表面；在該些第一凹形狀上形成複數個第二形狀，以使該模具的該第二表面改變成該模具的一第三表面；使用該模具的該第三表面壓印一基板上的一膜以形成一複合結構，其中該複合結構對應於該些第一凹形狀和該些第二形狀的結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a method of forming an optical sheet. The method comprises: providing a mold having a first surface; forming a plurality of first concave shapes on the first surface of the mold such that the first surface of the mold is changed to the second surface of the mold; forming a plurality of second shapes on the plurality of first concave shapes such that the second surface of the mold is changed to the third surface of the mold; and using the third surface of the mold to emboss a film on a substrate to form a composite structure corresponding to the combination of the plurality of first concave shapes and the plurality of second shapes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:第一光學片材</p>  
        <p type="p">101:膜</p>  
        <p type="p">101A:第三表面</p>  
        <p type="p">101B:第四表面</p>  
        <p type="p">102:複合結構</p>  
        <p type="p">102X:第一凸形狀</p>  
        <p type="p">102Y:第二形狀</p>  
        <p type="p">103:基板</p>  
        <p type="p">103A:第一表面</p>  
        <p type="p">103B:第二表面</p>  
        <p type="p">105:增亮層</p>  
        <p type="p">106:微結構</p>  
        <p type="p">106P:面</p>  
        <p type="p">106Q:面</p>  
        <p type="p">106R:稜線</p>  
        <p type="p">106G:谷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3007" publication-number="202626519"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626519.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋰離子二次電池用正極活性物質、鋰離子二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260320B">C01G45/1257</main-classification>  
        <further-classification edition="202501120260320B">C01G51/44</further-classification>  
        <further-classification edition="202501120260320B">C01G53/44</further-classification>  
        <further-classification edition="200601120260320B">C01G25/02</further-classification>  
        <further-classification edition="201001120260320B">H01M4/131</further-classification>  
        <further-classification edition="201001120260320B">H01M10/0525</further-classification>  
        <further-classification edition="200601120260320B">C01B17/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友金屬礦山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田治輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEDA, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森實健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIZANE, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種鋰離子二次電池用正極活性物質，含有鋰複合氧化物的粒子，該鋰複合氧化物含有Li、Ni、Mn、Zr、及添加元素M（M），以物量之比計，Li、Ni、Mn、Zr、及添加元素M（M）的比例為Li：Ni：Mn：Zr：M=a：b：c：d：e（0.95≦a≦1.20，0.10≦b＜0.70，0.01≦c≦0.50，0.0003≦d≦0.02，0.01≦e≦0.50，添加元素M為從Co、W、Mo、V、Mg、Ca、Al、Ti、及Ta中選出的1種以上的元素），其中，鋰複合氧化物的根據X射線繞射圖譜所算出的（003）面的峰的半高全寬FWHM&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;003&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;和（104）面的峰的半高全寬FWHM&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;104&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;滿足FWHM&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;104&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;≧FWHM&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;003&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;×2.90-0.10之關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3008" publication-number="202628655"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628655.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電晶體之集成偶極區</chinese-title>  
        <english-title>INTEGRATED DIPOLE REGION FOR TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10D64/68</main-classification>  
        <further-classification edition="202501120260325B">H10D64/60</further-classification>  
        <further-classification edition="202501120260325B">H10D64/00</further-classification>  
        <further-classification edition="202601120260325B">H10D62/00</further-classification>  
        <further-classification edition="202501120260325B">H10D30/00</further-classification>  
        <further-classification edition="202601120260325B">H10P14/40</further-classification>  
        <further-classification edition="202601120260325B">H10P95/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>干德可塔　史林尼維斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANDIKOTA, SRINIVAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊逸雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YIXIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　史蒂芬ＣＨ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, STEVEN C.H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄天逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TIANYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘古利　沙謝德利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANGULI, SESHADRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">敘述製造及處理半導體裝置(即，電子裝置)的方法。本揭示的實施例有利地提供電子裝置，其包含集成偶極區以滿足減少厚度與較低熱預算的要求。本文所述的電子裝置包含源極區、汲極區、及分開源極區與汲極區的通道、及具有界面層、在界面層上實質上沒有非金屬原子的金屬膜、及在金屬膜上的高ĸ介電層的偶極區。在一些實施例中，電子裝置的偶極區包含界面層、界面層上的高ĸ介電層、及高ĸ介電層上的金屬膜。在一些實施例中，方法包含退火基板以驅使來自金屬膜的金屬粒子進入界面層或高ĸ介電層的一者或多者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of manufacturing and processing semiconductor devices (i.e., electronic devices) are described. Embodiments of the disclosure advantageously provide electronic devices which comprise an integrated dipole region to meet reduced thickness and lower thermal budget requirements. The electronic devices described herein comprise a source region, a drain region, and a channel separating the source region and the drain region, and a dipole region having an interfacial layer, a metal film substantially free of non-metal atoms on the interfacial layer, and a high-ĸ dielectric layer on the metal film. In some embodiments, the dipole region of the electronic devices comprises an interfacial layer, a high-ĸ dielectric layer on the interfacial layer, and a metal film on the high-ĸ dielectric layer. In some embodiments, the methods comprise annealing the substrate to drive particles of metal from the metal film into one or more of the interfacial layer or the high-ĸ dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102,104,106,108,110:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3009" publication-number="202628846"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628846.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多個角度加壓區的拋光承載頭</chinese-title>  
        <english-title>POLISHING CARRIER HEAD WITH MULTIPLE ANGULAR PRESSURIZABLE ZONES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P52/40</main-classification>  
        <further-classification edition="202601120260327B">H10P72/70</further-classification>  
        <further-classification edition="200601120260327B">F16K11/22</further-classification>  
        <further-classification edition="201201120260327B">B24B37/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>努尼佳　史帝文Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUNIGA, STEVEN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古魯薩米　傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURUSAMY, JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納根葛斯特　安德魯Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGENGAST, ANDREW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加爾伯特　弗拉迪米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALBURT, VLADIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於研磨系統之承載頭包括外殼、可撓性膜、第一複數條壓力供應管線、第二複數條壓力供應管線及閥組件。可撓性膜限定多個可獨立加壓腔室。閥組件具有多個閥，其中多個閥中之每一相應閥耦接至來自多個可獨立加壓腔室之相應壓力腔室。每一相應閥經配置以選擇性地將相應壓力腔室耦接至來自一對壓力供應管線之一條壓力供應管線，該對壓力供應管線包括來自第一複數條壓力供應管線之壓力供應管線及來自第二複數條壓力供應管線之壓力供應管線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A carrier head for a polishing system includes a housing, a flexible membrane, a first plurality of pressure supply lines, a second plurality of pressure supply lines, and a valve assembly. The flexible membrane defines a multiplicity of independently pressurizable chambers. The valve assembly has a multiplicity of valves with each respective valve of the multiplicity of valves coupled to a respective pressure chamber from the multiplicity of independently pressurizable chambers. Each respective valve is configured to selectively couple the respective pressure chamber to one pressure supply line from a pair of pressure supply lines that include a pressure supply line from the first plurality of pressure supply lines and a pressure supply line from the second plurality of pressure supply lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">110:研磨墊</p>  
        <p type="p">181a:壓力源組</p>  
        <p type="p">181a-1:初級壓力源</p>  
        <p type="p">181a-2:初級壓力源</p>  
        <p type="p">181a-3:初級壓力源</p>  
        <p type="p">181b:壓力源組</p>  
        <p type="p">181b-1:次級壓力源</p>  
        <p type="p">181b-2:次級壓力源</p>  
        <p type="p">182:可撓性膜</p>  
        <p type="p">183a-1:壓力供應管線</p>  
        <p type="p">183a-2:壓力供應管線</p>  
        <p type="p">183b-1:壓力供應管線</p>  
        <p type="p">183b-2:壓力供應管線</p>  
        <p type="p">184:支撐板</p>  
        <p type="p">185:可加壓腔室</p>  
        <p type="p">185a:可獨立加壓腔室</p>  
        <p type="p">185b:可獨立加壓腔室</p>  
        <p type="p">185c:可獨立加壓腔室</p>  
        <p type="p">185d:可獨立加壓腔室</p>  
        <p type="p">185e:可獨立加壓腔室</p>  
        <p type="p">185f:可獨立加壓腔室</p>  
        <p type="p">185g:可獨立加壓腔室</p>  
        <p type="p">185h:可獨立加壓腔室</p>  
        <p type="p">185i:可獨立加壓腔室</p>  
        <p type="p">185j:可獨立加壓腔室</p>  
        <p type="p">186a:線程</p>  
        <p type="p">186b:線程</p>  
        <p type="p">186c:線程</p>  
        <p type="p">187a:壓力輸出管線</p>  
        <p type="p">187b:壓力輸出管線</p>  
        <p type="p">187c:壓力輸出管線</p>  
        <p type="p">187d:壓力輸出管線</p>  
        <p type="p">187e:壓力輸出管線</p>  
        <p type="p">187f:壓力輸出管線</p>  
        <p type="p">187g:壓力輸出管線</p>  
        <p type="p">187h:壓力輸出管線</p>  
        <p type="p">187i:壓力輸出管線</p>  
        <p type="p">189:閥組件</p>  
        <p type="p">190:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3010" publication-number="202628694"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628694.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置</chinese-title>  
        <english-title>OPTICAL APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260325B">H10F30/221</main-classification>  
        <further-classification edition="202501120260325B">H10F39/12</further-classification>  
        <further-classification edition="202501120260325B">H10F39/18</further-classification>  
        <further-classification edition="202601120260325B">H10F39/90</further-classification>  
        <further-classification edition="202501120260325B">H10F77/1223</further-classification>  
        <further-classification edition="202501120260325B">H10F99/00</further-classification>  
        <further-classification edition="200601120260325B">G02B6/00</further-classification>  
        <further-classification edition="200601120260325B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光程研創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTILUX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁哲夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHE-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊億</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學裝置，其包含一傳送單元、一接收單元及一處理單元。傳送單元包含有一或多個光源被配置用於傳送光子；接收單元包含一矽基板以及由矽基板支撐的複數像素，複數像素中的每一像素包含一由鍺組成的吸收區，其中，吸收區被配置為吸收光子，並在對吸收的光子做出反應時產生複數光載子，複數像素中的每一像素被配置為使由光子通過矽基板傳輸至吸收區；處理單元被配置用於處理複數光載子，且處理單元包含一接合於矽基板的第二基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical apparatus comprising a transmitting unit, a receiving unit, and a processing unit. The transmitting unit includes one or more light sources configured to transmit photons. The receiving unit includes a silicon substrate and a plurality of pixels supported by the silicon substrate; each pixel of the plurality of pixels includes an absorption region composed of germanium, wherein the absorption region is configured to absorb photons and generate a plurality of photocarriers in response to the absorbed photons; each pixel of the plurality of pixels is configured such that the photons are transmitted through the silicon substrate to the absorption region. The processing unit is configured to process the plurality of photocarriers and includes a second substrate bonded to the silicon substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">502:傳送單元</p>  
        <p type="p">504:接收單元</p>  
        <p type="p">506:處理單元</p>  
        <p type="p">510:目標物體</p>  
        <p type="p">512:光脈衝</p>  
        <p type="p">514:反射光脈衝</p>  
        <p type="p">500:取像系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3011" publication-number="202627429"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627429.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於圓柱形表面的感測元件及方法</chinese-title>  
        <english-title>SENSING APPARATUS AND METHODS FOR CYLINDRICAL SURFACES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260318B">G01K1/143</main-classification>  
        <further-classification edition="202101120260318B">G01K13/02</further-classification>  
        <further-classification edition="202101120260318B">G01K1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商極度清淨控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULTRA CLEAN HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉登　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRADUN, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪喬蒂　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMACCIOTTI, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德里格斯　傑納羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGUEZ, GENARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡米爾　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMYRE, ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾柏特　喬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYLBERT, JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種用於感測管路壁溫度以及推斷管內流體溫度的元件及方法。元件包括第一夾具主體及第二夾具主體，第一夾具主體包含熱量傳遞元件及與其連接的第一電連接及第二電連接，第二夾具主體可連接至第一夾具主體以在其間形成夾持腔，具有壁的受夾元件在夾持腔內是可固定的，熱量傳遞元件用以在其間接觸受夾元件的外表面。熱量傳遞元件可包括延伸穿過夾具主體中之一者並向夾持腔內延伸的導熱順應元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is an apparatus and method for sensing the temperature of a tubing wall, and inferentially the temperature of a fluid within the tubing. The apparatus includes first and second clamp bodies, the first clamp body comprising a heat transfer element and a first and a second electrical connection connected thereto, the second clamp body connectable to the first clamp body to form a clamping cavity therebetween within which a clamped element having a wall is securable, the heat transfer element configured to contact an outer surface of a clamped element therebetween. The heat transfer element may include a thermally conductive compliant element extending through one of the clamp bodies and inwardly of the clamping cavity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:熱裝置</p>  
        <p type="p">3:熱襯墊</p>  
        <p type="p">6:母線</p>  
        <p type="p">6b:母線</p>  
        <p type="p">9:導線</p>  
        <p type="p">20:第一導電緊固件</p>  
        <p type="p">25:導電線</p>  
        <p type="p">26:第二導電緊固件</p>  
        <p type="p">40:半圓柱形表面</p>  
        <p type="p">46:尾部部分</p>  
        <p type="p">58:元件凹槽</p>  
        <p type="p">60a~60d:頭部周邊壁</p>  
        <p type="p">62:上部安裝面</p>  
        <p type="p">64:正圓柱形外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3012" publication-number="202626593"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626593.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106596</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經取代的環己烷甲醯胺、其製備方法及其治療用途</chinese-title>  
        <english-title>SUBSTITUTED CYCLOHEXANECARBOXAMIDES, THEIR PREPARATION AND THEIR THERAPEUTIC APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07C235/40</main-classification>  
        <further-classification edition="200601120260324B">C07C237/12</further-classification>  
        <further-classification edition="200601120260324B">C07C255/60</further-classification>  
        <further-classification edition="200601120260324B">C07C311/46</further-classification>  
        <further-classification edition="200601120260324B">C07D213/40</further-classification>  
        <further-classification edition="200601120260324B">C07D235/14</further-classification>  
        <further-classification edition="200601120260324B">C07D305/06</further-classification>  
        <further-classification edition="200601120260324B">C07D307/33</further-classification>  
        <further-classification edition="200601120260324B">C07D311/58</further-classification>  
        <further-classification edition="200601120260324B">C07D317/40</further-classification>  
        <further-classification edition="200601120260324B">C07D407/12</further-classification>  
        <further-classification edition="200601120260324B">A61K31/165</further-classification>  
        <further-classification edition="200601120260324B">A61K31/222</further-classification>  
        <further-classification edition="200601120260324B">A61K31/4184</further-classification>  
        <further-classification edition="200601120260324B">A61K31/343</further-classification>  
        <further-classification edition="200601120260324B">A61K31/357</further-classification>  
        <further-classification edition="200601120260324B">A61K31/353</further-classification>  
        <further-classification edition="200601120260324B">A61K31/351</further-classification>  
        <further-classification edition="200601120260324B">A61K31/404</further-classification>  
        <further-classification edition="200601120260324B">A61P43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧格　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUGER, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝吉斯　吉勞姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEGIS, GUILLAUME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福立克　彥安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORICHER, YANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格布納　克里斯托夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREBNER, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪爾卡德　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOURCADE, STEPHANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅弗特　史黛芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEYFROOT, STEPHANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆勒　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUELLER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧夫　斯文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUF, SVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃斯　克勞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIRTH, KLAUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">式 (I) 的化合物：其中R&lt;sub&gt;1&lt;/sub&gt;表示-C(R&lt;sub&gt;2&lt;/sub&gt;)(R&lt;sub&gt;3&lt;/sub&gt;)-[C(R&lt;sub&gt;4&lt;/sub&gt;)(R&lt;sub&gt;5&lt;/sub&gt;)]&lt;sub&gt;m&lt;/sub&gt;-L-R&lt;sub&gt;6&lt;/sub&gt;基團或-R&lt;sub&gt;7&lt;/sub&gt;；以及式 (1) 的化合物的製備和式 (1) 的化合物作為TRPM8受體激動劑的治療用途，尤其適用於治療乾眼症候群。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compounds of formula (I): wherein R&lt;sub&gt;1&lt;/sub&gt; represents a -C(R&lt;sub&gt;2&lt;/sub&gt;)(R&lt;sub&gt;3&lt;/sub&gt;)-[C(R&lt;sub&gt;4&lt;/sub&gt;)(R&lt;sub&gt;5&lt;/sub&gt;)]&lt;sub&gt;m&lt;/sub&gt;-L-R&lt;sub&gt;6&lt;/sub&gt; group or -R&lt;sub&gt;7&lt;/sub&gt;; and the preparation and the therapeutic uses of the compounds of formula (1) as agonists of TRPM8 receptors, useful especially in the treatment of dry eye syndrome.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3013" publication-number="202626664"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626664.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為血小板活化因子受體拮抗劑之環戊烷并噻吩甲醯胺衍生物</chinese-title>  
        <english-title>CYCLOPENTATHIOPHENE CARBOXAMIDE DERIVATIVES AS PLATELET ACTIVATING FACTOR RECEPTOR ANTAGONISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D495/14</main-classification>  
        <further-classification edition="200601120260401B">A61K31/551</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification>  
        <further-classification edition="200601120260401B">A61P9/00</further-classification>  
        <further-classification edition="200601120260401B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾克哈德特　瑪夏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECKHARDT, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾瓦契　瑪麗娜　克力緹那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLWACHER, MARINA KRISTINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮斯德　吉爾金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRESTLE, JUERGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康帝斯　費倫茨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONTES, FERENC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯瑪斯　里歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMAS, LEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔特曼　克里斯多夫　西格弗里德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAUTERMANN, CHRISTOFER SIEGFRIED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威登梅爾　戴特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEDENMAYER, DIETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示式(I.0)環戊烷并噻吩甲醯胺， &lt;br/&gt;&lt;img align="absmiddle" height="192px" width="213px" file="ed10257.JPG" alt="ed10257.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;及其醫藥上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;及n係如說明書及隨附申請專利範圍中定義，式(I.0)環戊烷并噻吩甲醯胺及其醫藥上可接受之鹽可用於治療可受拮抗由血小板活化因子受體所介導之活性影響之疾病之方法中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Cyclopentathiophene carboxamides of formula (I.0) &lt;br/&gt;&lt;img align="absmiddle" height="200px" width="223px" file="ed10258.JPG" alt="ed10258.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, and n are as defined in the description and the claims, and pharmaceutically acceptable salts thereof can be used in methods for the treatment of diseases which can be influenced by antagonizing the activity mediated by the platelet activating factor receptor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3014" publication-number="202628802"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628802.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氧化物材料及半導體裝置</chinese-title>  
        <english-title>OXIDE MATERIAL AND SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P14/24</main-classification>  
        <further-classification edition="202501120260318B">H10D62/40</further-classification>  
        <further-classification edition="200601120260318B">C23C16/40</further-classification>  
        <further-classification edition="202501120260318B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASHIMA, MOTOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">目的在於提供一種適用於被包括於電晶體或二極體等中之半導體的材料。另一個目的在於提供一種包括電晶體之半導體裝置，其中介於氧化物半導體膜及與該氧化物半導體膜接觸之閘極絕緣膜之間的界面處之電子態狀況較有利。再者，另一個目的在於藉由提供穩定電氣特性給電晶體製造高可靠性半導體裝置，其中氧化物半導體膜係用於通道。半導體裝置係使用包括c-軸對準之晶體的氧化物材料形成，當從表面或界面方向看時該晶體具有三角形或六角形原子排列，並繞著c-軸旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object is to provide a material suitably used for a semiconductor included in a transistor, a diode, or the like. Another object is to provide a semiconductor device including a transistor in which the condition of an electron state at an interface between an oxide semiconductor film and a gate insulating film in contact with the oxide semiconductor film is favorable. Further, another object is to manufacture a highly reliable semiconductor device by giving stable electric characteristics to a transistor in which an oxide semiconductor film is used for a channel. A semiconductor device is formed using an oxide material which includes crystal with c-axis alignment, which has a triangular or hexagonal atomic arrangement when seen from the direction of a surface or an interface and rotates around the c-axis.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3015" publication-number="202626098"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626098.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗－ＡＸＬ抗體、抗體片段及其免疫結合物及其用途</chinese-title>  
        <english-title>ANTI-AXL ANTIBODIES, ANTIBODY FRAGMENTS AND THEIR IMMUNOCONJUGATES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61K39/395</main-classification>  
        <further-classification edition="200601120260331B">C07K16/28</further-classification>  
        <further-classification edition="200601120260331B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商拜奧亞特拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOATLA, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休特　杰　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHORT, JAY M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　懷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HWAI WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗雷　傑爾哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREY, GERHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於特異性結合至Axl蛋白之具有重鏈可變區及/或輕鏈可變區之多肽以及結合至Axl蛋白之含有重鏈可變區及/或輕鏈可變區之抗體及抗體片段。本發明亦提供包括該多肽或含有該多肽之抗體及抗體片段之醫藥組合物及套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polypeptide having a heavy chain variable region and/or light chain variable region that specifically binds to Axl protein as well as antibodies and antibody fragments containing the heavy chain variable region and/or the light chain variable region that bind to Axl protein. Pharmaceutical compositions and kits comprising the polypeptide or antibodies and antibody fragments containing the polypeptide are also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3016" publication-number="202627900"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627900.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106656</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於人工智慧系統運行期之確定性運算狀態復歸操作方法</chinese-title>  
        <english-title>METHOD FOR INITIALIZING AN ARTIFICIAL INTELLIGENCE SYSTEM TO A BASELINE STATE FOR DETERMINISTIC RUNTIME OPERATIONS.</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260318B">G06N5/025</main-classification>  
        <further-classification edition="201201120260318B">G06Q50/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王舜誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHUN YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王舜誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHUN YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents></agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種應用於人工智慧系統運行期之方法，係藉由將該系統初始化至一基準狀態，將人工智慧系統之機率生成行為轉化為具備一致性之確定性行為。本發明之目的，在於使該確定性行為能支持人工智慧相關法規對於透明性、可解釋性及究責性之要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for an artificial intelligence system runtime, which initializes the system to a baseline state to transform probabilistic generative behaviors into consistent deterministic behaviors. The objective of this invention is to ensure that such deterministic behaviors support the requirements of transparency, explainability, and accountability as mandated by artificial intelligence regulations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:復歸方法</p>  
        <p type="p">110:輸入位元流</p>  
        <p type="p">120:輸出位元流</p>  
        <p type="p">200:人工智慧系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3017" publication-number="202627400"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627400.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用虛擬交角進行彎管測量</chinese-title>  
        <english-title>BENT TUBE MEASUREMENT USING A VIRTUAL SHARP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G01B3/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商極度清淨控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULTRA CLEAN HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼爾森　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NELSON, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於判定一彎曲元件中的特徵的位置的設備，此彎曲元件具有至少兩個直線部分及位於此些兩個直線部分之間的至少一個彎曲部，此設備包括：一第一軌道；一第二軌道；一第三軌道；一第一旋轉耦接件，其將此第一軌道可旋轉地耦接至此第二軌道且可操作地耦接至一第一旋轉編碼器；一第二旋轉耦接件，其將此第二軌道可旋轉地耦接至此第三軌道且可操作地耦接至一第二旋轉編碼器；及一線性編碼器，其經設置及配置以判定此第二旋轉耦接件在此第二軌道上的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for determining the location of features in a bent element having at least two straight portions and at least one bend between the two straight portions includes a first rail, a second rail, a third rail, a first rotary coupling rotationally coupling the first rail to the second rail and operatively coupling to a first rotary encoder, a second rotary coupling rotationally coupling the second rail to the third rail and operatively coupling to a second rotary encoder, and a linear encoder configured and arranged to determine the location of the second rotary coupling on the second rail.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">48:檢驗及測量裝置</p>  
        <p type="p">50:基座</p>  
        <p type="p">52:第一軌道</p>  
        <p type="p">54:第二軌道</p>  
        <p type="p">56:第二軌道的第一端</p>  
        <p type="p">58:第一軌道的耦接端</p>  
        <p type="p">60:第一旋轉耦接件</p>  
        <p type="p">62:第一切口</p>  
        <p type="p">64:第二軌道的中心線</p>  
        <p type="p">66:第一軌道的中心線</p>  
        <p type="p">68:圓弧</p>  
        <p type="p">70:第二軌道的第二端</p>  
        <p type="p">72:第二軌道的外圓周表面</p>  
        <p type="p">74:平坦部</p>  
        <p type="p">76:第三軌道</p>  
        <p type="p">78:第二旋轉耦接件</p>  
        <p type="p">84:線性編碼器</p>  
        <p type="p">86:第二切口</p>  
        <p type="p">90:第二圓弧</p>  
        <p type="p">92:第一端壁</p>  
        <p type="p">94:第二端壁</p>  
        <p type="p">118:第一接合表面</p>  
        <p type="p">120:第二接合表面</p>  
        <p type="p">122:第三接合表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3018" publication-number="202626236"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626236.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板支撐組件及其製造方法</chinese-title>  
        <english-title>SUBSTRATE SUPPORT ASSEMBLY AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260320B">B23K26/00</main-classification>  
        <further-classification edition="201401120260320B">B23K26/352</further-classification>  
        <further-classification edition="202601120260320B">H10P95/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕克　維傑Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARKHE, VIJAY D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了用於反應器或電漿處理腔室的靜電吸盤(ESC)和製造ESC的方法。在實例中，製造基板支撐組件的方法包括提供陶瓷頂板，陶瓷頂板具有帶處理區域的頂表面。複數個檯面在處理區域內且在陶瓷板的頂表面上形成。雷射加工複數個檯面中的一或多個檯面以降低或增加複數個檯面中的一或多個檯面的表面粗糙度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Electrostatic chucks (ESCs) for reactor or plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a method of fabricating a substrate support assembly includes providing a ceramic top plate having a top surface with a processing region. A plurality of mesas is formed within the processing region and on the top surface of the ceramic plate. Laser-machining of one or more of the plurality of mesas is performed to reduce or to increase a surface roughness of the one or more of the plurality of mesas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">180:檯面</p>  
        <p type="p">190:檯面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3019" publication-number="202628771"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628771.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260324B">H10K59/38</main-classification>  
        <further-classification edition="202301120260324B">H10K59/40</further-classification>  
        <further-classification edition="202301120260324B">H10K50/86</further-classification>  
        <further-classification edition="200601120260324B">G06F3/044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申英燮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, YOUNGSUB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金永勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG-HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">討論一種顯示裝置，包含：基板；發光元件，放置於基板上；堤部，劃分對應於發光元件的發光區及相鄰於發光區的非發光區，且包含對應於發光元件的第一開口；封裝層，放置於發光元件上；觸控電極，放置於該封裝層上；第一矩陣及第二矩陣，第一矩陣放置於觸控電極上且第二矩陣放置於第一矩陣上，並且第二矩陣相較於第一矩陣具有較低的折射率；以及彩色濾光片，放置於觸控電極上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Discussed is a display device including a substrate, a light emitting element positioned on the substrate, a bank dividing an emission area corresponding to the light emitting element and a non-emission area that is adjacent to the emission area, and including a first opening corresponding to the light emitting element, an encapsulation layer positioned on the light emitting element, a touch electrode positioned on the encapsulation layer, a first matrix positioned on the touch electrode and a second matrix positioned on the first matrix and having a lower refractive index than the first matrix, and a color filter positioned on the touch electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BANK:堤部</p>  
        <p type="p">BK_W:寬度</p>  
        <p type="p">CF:彩色濾光片</p>  
        <p type="p">CW:覆蓋窗</p>  
        <p type="p">ENCAP:封裝層</p>  
        <p type="p">MAT:矩陣</p>  
        <p type="p">MAT1:第一矩陣</p>  
        <p type="p">MAT1_W:寬度</p>  
        <p type="p">MAT2:第二矩陣</p>  
        <p type="p">MAT2_W:寬度</p>  
        <p type="p">O1:第一開口</p>  
        <p type="p">O2:第二開口</p>  
        <p type="p">O3:第三開口</p>  
        <p type="p">O4:第四開口</p>  
        <p type="p">OCA:光學黏著層</p>  
        <p type="p">PAC:有機絕緣層</p>  
        <p type="p">PAS:無機絕緣層</p>  
        <p type="p">SUB:基板</p>  
        <p type="p">TBUF1:第一觸控緩衝層</p>  
        <p type="p">TBUF2:第二觸控緩衝層</p>  
        <p type="p">TE:觸控電極</p>  
        <p type="p">TE_W:寬度</p>  
        <p type="p">TFT:薄膜電晶體層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3020" publication-number="202628074"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628074.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音頻處理單元、方法及非暫時性媒體</chinese-title>  
        <english-title>AN AUDIO PROCESSING UNIT, METHOD AND A NON-TRANSITORY MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260319B">G10L19/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商杜比實驗室特許公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛蘭特　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANT, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾克羅斯　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORCROSS, SCOTT GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊德米勒　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIEDMILLER, JEFFREY C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃德　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARD, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露用來產生一已編碼音頻位元流的設備與方法，其包括藉由包括節目響度元資料與音頻資料於該位元流中，以及可選地亦包括節目邊界元資料於該位元流的至少一個片段(例如，訊框)中。其他態樣係為用來解碼此類位元流的設備與方法，例如包括藉由施行由該位元流所指示出之一音頻節目的該音頻資料的自適應響度處理，或者此類音頻節目之元資料及/或音頻資料的鑑定及/或驗證。另一態樣係為一音頻處理單元(例如，一編碼器、解碼器或後處理器)，其被組態(例如，程式化)以施行該方法之任何實施例或者其包括儲存根據該方法之任何實施例所產生之一音頻位元流之至少一個訊框的一緩衝記憶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and methods for generating an encoded audio bitstream, including by including program loudness metadata and audio data in the bitstream, and optionally also program boundary metadata in at least one segment (e.g., frame) of the bitstream. Other aspects are apparatus and methods for decoding such a bitstream, e.g., including by performing adaptive loudness processing of the audio data of an audio program indicated by the bitstream, or authentication and/or validation of metadata and/or audio data of such an audio program. Another aspect is an audio processing unit (e.g., an encoder, decoder, or post-processor) configured (e.g., programmed) to perform any embodiment of the method or which includes a buffer memory which stores at least one frame of an audio bitstream generated in accordance with any embodiment of the method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:解碼器</p>  
        <p type="p">201:訊框緩衝器</p>  
        <p type="p">202:音頻解碼器</p>  
        <p type="p">203:音頻狀態驗證台(驗證器)</p>  
        <p type="p">204:控制位元產生台</p>  
        <p type="p">205:剖析器</p>  
        <p type="p">300:後處理器</p>  
        <p type="p">301:訊框緩衝器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3021" publication-number="202628988"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628988.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有超薄型均溫板的積體電路封裝</chinese-title>  
        <english-title>IC PACAKAGE WITH VERY THIN VAPOR CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260319B">H10W40/22</main-classification>  
        <further-classification edition="202601120260319B">H10W40/30</further-classification>  
        <further-classification edition="202601120260319B">H10W74/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康銘元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, MING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路封裝包括：具有一第一均溫板的一基板；具有一頂面的一半導體晶片，該半導體晶片堆疊在該基板上；其中該第一均溫板設置在該半導體晶片下方，該第一均溫板包括一近端部分和一遠端部分，該第一均溫板的該近端部分與該半導體晶片的一底面熱耦合；和一封裝殼體用以包覆該半導體晶片和該第一均溫板，其中該第一均溫板的該近端部分位於該封裝殼體內，該第一均溫板的該遠端部分位於該封裝殼體外。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An IC package comprising a substrate with a first vaper chamber; a semiconductor die with a top surface, the semiconductor die stacked over the substrate; wherein the first vapor chamber disposed under the semiconductor die, the first vapor chamber comprises a proximal portion and a distal portion, the proximal portion of the first vapor chamber is thermally coupled to a bottom surface of the semiconductor die; and an encapsulating case encapsulating the semiconductor die and the first vapor chamber, wherein the proximal portion of the first vapor chamber is within the encapsulating case, and the distal portion of the first vapor chamber outside the encapsulating case.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">211:半導體晶片或裸晶</p>  
        <p type="p">22:基板</p>  
        <p type="p">23、51:均溫板</p>  
        <p type="p">231、511:近端部分</p>  
        <p type="p">232、512:遠端部分</p>  
        <p type="p">233、513:過渡部分</p>  
        <p type="p">24:封裝殼體</p>  
        <p type="p">25:TIM或熱黏合層</p>  
        <p type="p">3:PCB板</p>  
        <p type="p">31:散熱器</p>  
        <p type="p">32:風扇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3022" publication-number="202628591"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628591.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106937</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260326B">H10B43/27</main-classification>  
        <further-classification edition="202501120260326B">H10D62/17</further-classification>  
        <further-classification edition="202501120260326B">H10D64/68</further-classification>  
        <further-classification edition="202601120260326B">H10P50/26</further-classification>  
        <further-classification edition="202601120260326B">H10P50/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>峯村洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINEMURA, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一實施形態的半導體記憶裝置包括積層體以及柱狀體。所述積層體包含多個閘極電極層以及多個絕緣層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:第一積層體</p>  
        <p type="p">32:第二積層體</p>  
        <p type="p">42A-1:絕緣層(第三絕緣層)</p>  
        <p type="p">42A-2:絕緣層(第四絕緣層)</p>  
        <p type="p">42A-3、42B-3:絕緣層</p>  
        <p type="p">42B-1:絕緣層(第一絕緣層)</p>  
        <p type="p">42B-2:絕緣層(第二絕緣層)</p>  
        <p type="p">45:導電部分</p>  
        <p type="p">46:障壁金屬膜</p>  
        <p type="p">51:記憶體膜(多層膜)</p>  
        <p type="p">51a、52a:膨出部</p>  
        <p type="p">52:通道層</p>  
        <p type="p">53:絕緣芯</p>  
        <p type="p">61:區塊絕緣膜</p>  
        <p type="p">62:電荷阱膜</p>  
        <p type="p">63:隧道絕緣膜</p>  
        <p type="p">101:基部(第一部分)</p>  
        <p type="p">101a、102a、111a、112a:邊緣</p>  
        <p type="p">102:後退部(第二部分)</p>  
        <p type="p">111:基部</p>  
        <p type="p">112:後退部</p>  
        <p type="p">B1:第一邊界</p>  
        <p type="p">B2:第二邊界</p>  
        <p type="p">B3:第三邊界</p>  
        <p type="p">B4:第四邊界</p>  
        <p type="p">B5:第五邊界</p>  
        <p type="p">B6:第六邊界</p>  
        <p type="p">E1:第一邊緣</p>  
        <p type="p">E2:第二邊緣</p>  
        <p type="p">E3:第三邊緣</p>  
        <p type="p">E4:第四邊緣</p>  
        <p type="p">E5:第五邊緣</p>  
        <p type="p">E6:第六邊緣</p>  
        <p type="p">E7:第七邊緣</p>  
        <p type="p">E8:第八邊緣</p>  
        <p type="p">E9:第九邊緣</p>  
        <p type="p">E10:第十邊緣</p>  
        <p type="p">E11:第十一邊緣</p>  
        <p type="p">E12:第十二邊緣</p>  
        <p type="p">L1:第一距離</p>  
        <p type="p">L2:第二距離</p>  
        <p type="p">L3:第三距離</p>  
        <p type="p">L4:第四距離</p>  
        <p type="p">L5:第五距離</p>  
        <p type="p">L6:第六距離</p>  
        <p type="p">MH:記憶體柱(柱狀體)</p>  
        <p type="p">WLA-1:字元線(第三閘極電極層)</p>  
        <p type="p">WLA-2:字元線(第四閘極電極層)</p>  
        <p type="p">WLA-3、WLB-3:字元線</p>  
        <p type="p">WLB-1:字元線(第一閘極電極層)</p>  
        <p type="p">WLB-2:字元線(第二閘極電極層)</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3023" publication-number="202627759"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627759.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115106962</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用可配置的本地頻率節流管理以管理功率需求及消耗的基於處理器的系統及相關方法</chinese-title>  
        <english-title>PROCESSOR-BASED SYSTEM EMPLOYING CONFIGURABLE LOCAL FREQUENCY THROTTLING MANAGEMENT TO MANAGE POWER DEMAND AND CONSUMPTION, AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260328B">G06F1/324</main-classification>  
        <further-classification edition="201901120260328B">G06F1/3206</further-classification>  
        <further-classification edition="200601120260328B">H03L7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商微軟技術授權有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉帕卡　史密薩Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPAKA, SMITHA L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　曉泠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIAOLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉蘇布拉曼尼安　文卡特希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALASUBRAMANIAN, VENKATESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維穆拉　蘇尼爾Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEMULA, SUNIL K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉丁　德瑞克Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLADDING, DEREK E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬爾多納多　西薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALDONADO, CESAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露採用可配置的本地頻率節流管理以管理功率需求及消耗的基於處理器的系統及相關方法。例如，此種基於處理器的系統可包括處理器和其他功率電路系統以控制處理器的功率。處理器包括時脈控制電路，此時脈控制電路經配置為以指定頻率產生(多個)時脈信號，以用(多個)期望的運行頻率為處理器中的(多個)處理器核心提供時脈。時脈控制電路經配置成回應可能是意外事件的頻率限制事件而動態地節流(即，限制及/或降低)為處理器提供時脈的(多個)時脈信號的(多個)頻率。對於確保處理器可在中斷或降低的功率供應條件下繼續運行，降低功率需求可為重要的。限制處理器的運行頻率可能比限制供應給處理器的功率的運行電壓更快。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Processor-based systems employing configurable local frequency throttling management to manage power demand and consumption, and related methods. For example, such processor-based systems may include a processor and other power circuitry to control power to the processor. The processor includes a clock control circuit that is configured generate a clock signal(s) at a designated frequency to clock a processor core(s) in the processor at a desired operating frequency(ies). The clock control circuit is configured to dynamically throttle (i.e., limit and/or reduce) the frequency(ies) of a clock signal(s) clocking the processor in response to a frequency throttle event that may be an unexpected event. Reducing power demand may be important to ensure that the processor can continue to operate under interrupted or reduced power supply conditions. It may be faster to throttle the operating frequency of a processor than to throttle the operating voltage of power supplied to the processor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:基於處理器的系統</p>  
        <p type="p">202:時脈控制電路</p>  
        <p type="p">204:時脈輸出</p>  
        <p type="p">206:處理器</p>  
        <p type="p">208:頻率限制事件</p>  
        <p type="p">210:溫度監控器電路</p>  
        <p type="p">212:積體電路(IC)</p>  
        <p type="p">214:電路板</p>  
        <p type="p">216:處理單元</p>  
        <p type="p">218(1)~218(C):處理器核心</p>  
        <p type="p">222:電腦程式代碼/程式代碼222</p>  
        <p type="p">223:記憶體</p>  
        <p type="p">224:功率信號</p>  
        <p type="p">232:鎖相迴路(PLL)電路</p>  
        <p type="p">234:有限狀態FSM電路</p>  
        <p type="p">236:頻率步進電路</p>  
        <p type="p">238:頻率限制信號</p>  
        <p type="p">239:運行頻率指示符</p>  
        <p type="p">240:頻率限制信號</p>  
        <p type="p">242:功率管理電路(PMC)</p>  
        <p type="p">248:運行頻率暫存器</p>  
        <p type="p">249:IC晶片</p>  
        <p type="p">250:電源軌</p>  
        <p type="p">252:功率信號</p>  
        <p type="p">254:功率輸出</p>  
        <p type="p">254(1):第二功率輸出端</p>  
        <p type="p">256:運行電壓指示符</p>  
        <p type="p">258:運行電壓反饋指示符</p>  
        <p type="p">260:運行電壓暫存器</p>  
        <p type="p">262:運行電壓反饋暫存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3024" publication-number="202628243"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628243.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基板及配線基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01Q1/38</main-classification>  
        <further-classification edition="200601120260325B">H01Q9/30</further-classification>  
        <further-classification edition="200601120260325B">H05K1/09</further-classification>  
        <further-classification edition="200601120260325B">H05K9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武誠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKE, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口修司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, SHUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>初田千秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATSUTA, CHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之配線基板(10)具備：基板(11)；及網格配線層(20)，其配置於基板(11)上，且包含複數個配線(21、22)。基板(11)對於波長400 nm以上700 nm以下之光線之透過率為85%以上。配線(21、22)具有表面粗糙度Ra，表面粗糙度Ra為100 nm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Ra:表面粗糙度</p>  
        <p type="p">21:第1方向配線</p>  
        <p type="p">22:第2方向配線</p>  
        <p type="p">24a:正面</p>  
        <p type="p">29:金屬結晶</p>  
        <p type="p">d&lt;sub&gt;p&lt;/sub&gt;:粒徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3025" publication-number="202627770"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627770.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子筆、手寫輸入裝置及電子筆用芯體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G06F3/03</main-classification>  
        <further-classification edition="201301120260325B">G06F3/0354</further-classification>  
        <further-classification edition="200601120260325B">G06F3/046</further-classification>  
        <further-classification edition="200601120260325B">G06F3/041</further-classification>  
        <further-classification edition="201301120260325B">G06F3/038</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商和冠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WACOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本義治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, YOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種電子筆之構成為簡單而能夠以低成本來構成之手寫輸入裝置。 &lt;br/&gt;　　[解決手段]電子筆(2)，係為具備有由線圈(211)與電容器(215)所構成的共振電路之電磁感應方式之電子筆，並在插通於被捲繞有線圈(211)的磁性體芯(212)之貫通孔中之芯體(213)的筆尖部處，被設置有磁鐵部、和保持此磁鐵部之軛部。另一方面，手寫輸入裝置，係具備有：電子筆(2)；和位置檢測裝置部(13)，係在會使磁極作了接近或接觸的位置之顏色改變的磁性薄片(11)之下方處，將電磁感應方式之位置檢測感測器(12)與磁性薄片(11)相重疊地而作了配設。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:觸控板終端</p>  
        <p type="p">1B:操作面板部</p>  
        <p type="p">1Ba:電源鍵</p>  
        <p type="p">1Bb:書寫輸入結束鍵</p>  
        <p type="p">1Bc:資訊送訊鍵</p>  
        <p type="p">1Bd:功率指示器</p>  
        <p type="p">1Be:通訊指示器</p>  
        <p type="p">2:電子筆</p>  
        <p type="p">3:消除器</p>  
        <p type="p">1A:手寫輸入面</p>  
        <p type="p">11:磁性薄片</p>  
        <p type="p">12:位置檢測感測器</p>  
        <p type="p">13:位置檢測裝置部</p>  
        <p type="p">20:框體</p>  
        <p type="p">20a:開口</p>  
        <p type="p">20b:後端面</p>  
        <p type="p">21:電子筆本體部</p>  
        <p type="p">22:橡皮擦功能部</p>  
        <p type="p">211:線圈</p>  
        <p type="p">211a:線圈之其中一端</p>  
        <p type="p">211b:線圈之其中一端</p>  
        <p type="p">212:鐵氧體芯</p>  
        <p type="p">213:芯體</p>  
        <p type="p">214:筆壓檢測部</p>  
        <p type="p">215:電容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3026" publication-number="202626311"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626311.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有磁性張緊功能之可調整刃片總成</chinese-title>  
        <english-title>ADJUSTABLE BLADE ASSEMBLY HAVING MAGNETIC TENSIONING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">B26B19/02</main-classification>  
        <further-classification edition="200601120260316B">B26B19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安帝斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDIS COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特林加利　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRINGALI, RICHARD J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福森　扎卡里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSSUM, ZACHARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　賈斯敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, JASSEN R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">剪髮裝置或剪髮器設有磁性刃片總成。剪髮裝置包括切割刃片、靜止刃片、附接於切割刃片的軛。軛及/或切割刃片可能被磁化以在切割刃片和靜止刃片之間生成吸引力或排斥力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hair cutting device or clipper is provided with a magnetic blade assembly. The hair cutting device includes a cutting blade, a stationary blade and a yoke attached to the cutting blade. The yoke and/or cutting blade may be magnetized to create an attractive or repulsive force between the cutting blade and the stationary blade.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:剪髮器</p>  
        <p type="p">12:握柄</p>  
        <p type="p">14:刃片總成</p>  
        <p type="p">16:上刃片、切割刃片</p>  
        <p type="p">18:下刃片、靜止刃片</p>  
        <p type="p">20:切割齒</p>  
        <p type="p">22:切割刃片邊緣</p>  
        <p type="p">24:上殼</p>  
        <p type="p">26:下殼</p>  
        <p type="p">38:槓桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3027" publication-number="202627824"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627824.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬體加速器的資料傳輸排程的計算裝置及方法</chinese-title>  
        <english-title>COMPUTING DEVICE AND METHOD OF DATA TRANSFER SCHEDULING FOR HARDWARE ACCELERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">G06F13/376</main-classification>  
        <further-classification edition="200601120260321B">G06F15/80</further-classification>  
        <further-classification edition="200601120260321B">G06F15/173</further-classification>  
        <further-classification edition="202301120260321B">G06N3/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商微軟技術授權有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　莫尼卡曼凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, MONICA MAN KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭瑞華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, RUIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUAN, ZHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種計算裝置，包括經配置以進行用於一硬體加速器之資料傳輸排程的處理器，該硬體加速器包括複數個處理區域。進行資料傳輸排程的步驟可包括接收複數個資料傳輸指令，該複數個資料傳輸指令編寫有請求，該等請求用以傳輸資料至個別處理區域。進行資料傳輸排程的步驟可進一步包括識別出資料傳輸指令之間的複數個傳輸路徑衝突。進行資料傳輸排程的步驟可進一步包括將資料傳輸指令排序成為複數個傳輸指令子集。在各傳輸指令子集內，沒有資料傳輸指令具有傳輸路徑衝突。針對各傳輸指令子集，進行資料傳輸排程的步驟可進一步包括將該個傳輸指令子集中所包括的資料傳輸指令傳達至該硬體加速器。資料傳輸指令可在對應至該等傳輸指令子集的複數個連續的資料傳輸階段中被傳達。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computing device, including a processor configured to perform data transfer scheduling for a hardware accelerator including a plurality of processing areas. Performing data transfer scheduling may include receiving a plurality of data transfer instructions that encode requests to transfer data to respective processing areas. Performing data transfer scheduling may further include identifying a plurality of transfer path conflicts between the data transfer instructions. Performing data transfer scheduling may further include sorting the data transfer instructions into a plurality of transfer instruction subsets. Within each transfer instruction subset, none of the data transfer instructions have transfer path conflicts. For each transfer instruction subset, performing data transfer scheduling may further include conveying the data transfer instructions included in that transfer instruction subset to the hardware accelerator. The data transfer instructions may be conveyed in a plurality of sequential data transfer phases that correspond to the transfer instruction subsets.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:計算裝置</p>  
        <p type="p">12:處理器</p>  
        <p type="p">14:硬體加速器</p>  
        <p type="p">16:處理區域</p>  
        <p type="p">18:記憶體緩衝區</p>  
        <p type="p">19:互連處理硬體</p>  
        <p type="p">20:記憶體</p>  
        <p type="p">24:互連件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3028" publication-number="202628636"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628636.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於顯示裝置之電路之薄膜電晶體</chinese-title>  
        <english-title>THIN FILM TRANSISTORS FOR CIRCUITS FOR USE IN DISPLAY DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260318B">H10D30/67</main-classification>  
        <further-classification edition="202301120260318B">H10K59/123</further-classification>  
        <further-classification edition="202301120260318B">H10K59/121</further-classification>  
        <further-classification edition="201601120260318B">G09G3/3233</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金正培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUNG BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任東吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, DONG KIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　壽永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示了一種包括驅動薄膜電晶體的裝置。該驅動薄膜電晶體包括金屬氧化物通道、與驅動金屬氧化物通道接觸的源電極、以及設置在該金屬氧化物通道上方並實體連接至該驅動源電極的頂部閘電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a device including a driving thin film transistor. The driving thin film transistor includes a metal oxide channel, a source electrode in contact with the driving metal oxide channel, and a top gate electrode disposed above the metal oxide channel and physically connected to the driving source electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500A:驅動TFT</p>  
        <p type="p">500B:驅動TFT</p>  
        <p type="p">502:基板</p>  
        <p type="p">504:緩衝層</p>  
        <p type="p">506:底部閘電極</p>  
        <p type="p">508:底部閘極絕緣(GI)層</p>  
        <p type="p">510:通道結構</p>  
        <p type="p">512:頂部閘極絕緣(GI)層</p>  
        <p type="p">512’:頂部GI層</p>  
        <p type="p">514:頂部閘電極</p>  
        <p type="p">516:層間介電質(ILD)層</p>  
        <p type="p">518:源極</p>  
        <p type="p">519:汲極</p>  
        <p type="p">520:汲極電極路徑</p>  
        <p type="p">522:源極電極路徑</p>  
        <p type="p">524:頂部閘電極路徑</p>  
        <p type="p">526:底部閘電極路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3029" publication-number="202628458"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628458.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107100</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對異常穩健的時間平均射頻暴露符合連續性</chinese-title>  
        <english-title>EXCEPTION-ROBUST TIME-AVERAGED RADIO FREQUENCY EXPOSURE COMPLIANCE CONTINUITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260328B">H04W52/22</main-classification>  
        <further-classification edition="200901120260328B">H04W52/48</further-classification>  
        <further-classification edition="200901120260328B">H04W24/04</further-classification>  
        <further-classification edition="202601120260328B">G06F11/1471</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯帝斯　特洛伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURTISS, TROY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪奧達爾　阿克希爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEODHAR, AKHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納達古都堤　賈加迪許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NADAKUDUTI, JAGADISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古基安　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUCKIAN, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案的某些態樣提供了用於對異常穩健的時間平均射頻（RF）暴露符合連續性的技術。一種可以由使用者設備（UE）執行的方法通常包括：基於時間窗上的時間平均RF暴露量測結果，以第一發射功率發射第一訊號，以及儲存與該時間窗相關聯的RF暴露資訊。方法亦可以包括：偵測與UE相關聯的異常事件發生，以及回應於該事件的偵測，至少部分地基於所儲存的RF暴露資訊，以第二發射功率發射第二訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Certain aspects of the present disclosure provide techniques for exception-robust time-averaged radio frequency (RF) exposure compliance continuity. A method that may be performed by a user equipment (UE) generally includes transmitting a first signal at a first transmission power based on time-averaged RF exposure measurements over a time window and storing RF exposure information associated with the time window. The method may also include detecting that an exception event associated with the UE occurred and transmitting a second signal at a second transmission power based at least in part on the stored RF exposure information in response to the detection of the event.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:操作</p>  
        <p type="p">402:方塊</p>  
        <p type="p">404:方塊</p>  
        <p type="p">406:方塊</p>  
        <p type="p">408:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3030" publication-number="202627588"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627588.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄型彈出式相機及此類相機的鏡頭</chinese-title>  
        <english-title>SLIM POP-OUT CAMERAS AND LENSES FOR SUCH CAMERAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260316B">G02B7/02</main-classification>  
        <further-classification edition="202101120260316B">G03B17/04</further-classification>  
        <further-classification edition="202101120260316B">G03B13/02</further-classification>  
        <further-classification edition="202101120260316B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商核心光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COREPHOTONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙伯泰　加爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHABTAY, GAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耶德　伊泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEDID, ITAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈登堡　以法蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLDENBERG, EPHRAIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科曼　塔爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORMAN, TAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅迪克　羅伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUDNICK, ROY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈德斯坦　科比</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLDSTEIN, KOBI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科瓦爾　耶夫塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOWAL, YIFTAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德羅　邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DROR, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝勒　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHERER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種相機，其整合在一行動裝置中，該相機包括：一光學模組，包括一鏡頭組件，該鏡頭組件包括在一物體側上以L&lt;sub&gt;1&lt;/sub&gt;開始的N個透鏡元件L&lt;sub&gt;1&lt;/sub&gt;-L&lt;sub&gt;N&lt;/sub&gt;，其中N ≥ 4；一影像感測器，具有一感測器對角線S&lt;sub&gt;D&lt;/sub&gt;，該感測器對角線S&lt;sub&gt;D&lt;/sub&gt;在5至30毫米的範圍內；以及一彈出機構，配置為控制多個透鏡元件之間或一透鏡元件與該影像感測器之間的至少一個氣隙，以使該相機進入一操作彈出狀態及一收縮狀態，其中該彈出機構配置為升高及降低一移動窗元件，並且包括一外部模組密封件，其耦合到該移動窗元件及該固定表面，以適應該移動窗元件的一運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A camera integrated in a mobile device, comprising: an optics module comprising a lens assembly that includes N lens elements L&lt;sub&gt;1&lt;/sub&gt;-L&lt;sub&gt;N&lt;/sub&gt; starting with L&lt;sub&gt;1&lt;/sub&gt; on an object side, wherein N ≥ 4; an image sensor having a sensor diagonal S&lt;sub&gt;D&lt;/sub&gt; in a range of 5-30mm; and a pop-out mechanism configured to control at least one air-gap between lens elements or between a lens element and the image sensor to bring the camera to an operative pop-out state and to a collapsed state, wherein the pop-out mechanism is configured to raise and lower a moving window element, and comprises an external module seal configured to coupled to the moving window element so as to adapt to a motion of the moving window element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:相機</p>  
        <p type="p">202:鏡頭鏡筒支架</p>  
        <p type="p">204:鏡頭鏡筒</p>  
        <p type="p">206:彈出式鏡頭組件</p>  
        <p type="p">208:影像感測器</p>  
        <p type="p">210:通用彈出機構</p>  
        <p type="p">212:致動器</p>  
        <p type="p">214:窗框</p>  
        <p type="p">216:窗</p>  
        <p type="p">218:光圈</p>  
        <p type="p">222:氣隙</p>  
        <p type="p">224:外部模組密封件</p>  
        <p type="p">226:凸塊</p>  
        <p type="p">228:外表面</p>  
        <p type="p">230:彈簧</p>  
        <p type="p">232:蓋子</p>  
        <p type="p">234:光學窗</p>  
        <p type="p">240:光學模組</p>  
        <p type="p">242:銷</p>  
        <p type="p">244:凹槽</p>  
        <p type="p">250:主機裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3031" publication-number="202628353"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628353.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有輸入功率保護之放大器</chinese-title>  
        <english-title>AMPLIFIER HAVING INPUT POWER PROTECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H03F1/52</main-classification>  
        <further-classification edition="200601120260316B">H03F1/56</further-classification>  
        <further-classification edition="202501120260316B">H10D84/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天工方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安卓斯　保羅　雷蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDRYS, PAUL RAYMOND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種具有輸入功率保護之放大器。在一些實施例中，一放大器電路可包含一輸入節點及一輸出節點以及經實施於該輸入節點與該輸出節點之間的一放大器。該放大器電路可進一步包含經組態以將一偏壓信號提供至該放大器之一偏壓電路。該放大器電路可進一步包含經組態以產生代表存在於該輸入節點處的一射頻信號之一峰值之一經偵測電壓的一保護電路。該保護電路可進一步經組態以在該經偵測電壓大於一第一臨限值時啟用一保護模式且在該經偵測電壓小於一第二臨限值時停用該保護模式，該第二臨限值小於該第一臨限值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Amplifier having input power protection. In some embodiments, an amplifier circuit can include an input node and an output node, and an amplifier implemented between the input node and the output node. The amplifier circuit can further include a bias circuit configured to provide a bias signal to the amplifier. The amplifier circuit can further include a protection circuit configured to generate a detected voltage representative of a peak of a radio-frequency signal present at the input node. The protection circuit can be further configured to enable a protection mode when the detected voltage is greater than a first threshold value and to disable the protection mode when the detected voltage is less than a second threshold value that is less than the first threshold value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:放大器電路</p>  
        <p type="p">102:放大器</p>  
        <p type="p">104:輸入功率保護電路</p>  
        <p type="p">106:偵測器組件</p>  
        <p type="p">108:控制組件/開關控制邏輯電路</p>  
        <p type="p">109:基於二極體之靜電放電(ESD)保護電路</p>  
        <p type="p">110:偏壓電路</p>  
        <p type="p">112:射頻(RF)峰值偵測器</p>  
        <p type="p">114:施密特觸發器</p>  
        <p type="p">C1:電容器</p>  
        <p type="p">C2:DC阻隔電容</p>  
        <p type="p">C3:DC阻隔電容</p>  
        <p type="p">D1:二極體</p>  
        <p type="p">IREF:參考電流</p>  
        <p type="p">M1:電晶體</p>  
        <p type="p">M2:電晶體</p>  
        <p type="p">Q1:第一電晶體/第一雙極接面電晶體(BJT)/共同源極電晶體</p>  
        <p type="p">Q2:第二電晶體/第二雙極接面電晶體(BJT)/共同閘極電晶體</p>  
        <p type="p">R1:電阻器</p>  
        <p type="p">R2:偏壓電阻</p>  
        <p type="p">RF_in:射頻(RF)信號</p>  
        <p type="p">RF_out:經放大射頻(RF)信號</p>  
        <p type="p">SW1:開關</p>  
        <p type="p">SW2:開關</p>  
        <p type="p">SW3:開關</p>  
        <p type="p">SW4:開關</p>  
        <p type="p">SW5:開關</p>  
        <p type="p">SW6:開關</p>  
        <p type="p">VDD:供應電壓</p>  
        <p type="p">VDET:經偵測電壓</p>  
        <p type="p">VDET_BUF:信號</p>  
        <p type="p">VG:閘極電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3032" publication-number="202629033"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629033.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107115</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於無工具標記之針跡接合的裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260316B">H10W72/50</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天工方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋林　奧德林　奎茵儂斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARING, ALDRIN QUINONES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於無工具標記之針跡接合的裝置及方法。在一些實施例中，一種用於線接合之方法可包含透過一毛細管尖端饋送一線材且將該線材之一第一端附接至一第一位置，藉此形成一球接合。該方法可進一步包含當該線材自該毛細管尖端饋出時，移動該毛細管尖端朝向一第二位置。該方法可進一步包含將該線材之一第二端附接至該第二位置，同時防止該毛細管尖端與該第二位置之間的接觸，藉此形成一針跡接合而在該第二位置處無一工具標記。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:程序</p>  
        <p type="p">210:步驟</p>  
        <p type="p">220:步驟</p>  
        <p type="p">230:步驟</p>  
        <p type="p">240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3033" publication-number="202626296"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626296.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107118</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數值控制系統及產業用裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">B25J5/00</main-classification>  
        <further-classification edition="200601120260316B">B25J9/16</further-classification>  
        <further-classification edition="200601120260316B">G05B19/406</further-classification>  
        <further-classification edition="200601120260316B">G05B19/414</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>室伏拓實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUROFUSHI, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在機器人與工具機聯動之系統中，防止在已將自訂巨集變數使用於加工程式的情況下可能產生的不良情況。一種數值控制系統，是從數值控制裝置的加工程式透過機器人控制裝置來控制機器人，前述數值控制系統具備：變數清單資訊生成部，從前述數值控制裝置中的全部的前述加工程式之中取得變數，並生成已將前述變數與前述加工程式建立對應之變數清單資訊；及程式編輯部，在包含於前述數值控制裝置中的前述加工程式或前述機器人控制裝置中的機器人程式之前述變數，是以和前述變數清單資訊不同的對應關係被使用的情況下，即不使用前述變數；在包含於前述變數清單資訊之前述變數，是在不存在於前述變數清單資訊的前述加工程式中被使用的情況下，即不使用前述變數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:數值控制系統</p>  
        <p type="p">2:工具機</p>  
        <p type="p">3:機器人</p>  
        <p type="p">4:產業用裝置</p>  
        <p type="p">5:數值控制裝置</p>  
        <p type="p">6:機器人控制裝置</p>  
        <p type="p">41:變數清單資訊生成部</p>  
        <p type="p">42:變數清單資訊輸出部</p>  
        <p type="p">43,55,65:資料收發部</p>  
        <p type="p">44,58,68:顯示部</p>  
        <p type="p">51,61:記憶部</p>  
        <p type="p">52,62:程式輸入部</p>  
        <p type="p">53,63:分析部</p>  
        <p type="p">54,64:控制部</p>  
        <p type="p">56,66:輸入部</p>  
        <p type="p">57,67:程式編輯部</p>  
        <p type="p">511:加工程式</p>  
        <p type="p">512:變數(自訂巨集變數)</p>  
        <p type="p">513,612:變數清單資訊</p>  
        <p type="p">611:機器人程式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3034" publication-number="202628327"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628327.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源模組</chinese-title>  
        <english-title>POWER MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H02M1/08</main-classification>  
        <further-classification edition="200601120260316B">G06F1/26</further-classification>  
        <further-classification edition="200601120260316B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃道成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, DAOCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張新敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XINMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周迎新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YINGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電源模組，包括磁組件、位於磁組件上方的頂部結構、第一功率元件晶片、第二功率元件晶片、位於磁組件下方的輸出電容器層以及位於輸出電容器層內的第一組電容器與第二組電容器。磁組件包括磁芯、第一線圈及第二線圈。第一線圈的第一端和第二線圈的第一端均與頂部結構的下表面接觸。第一功率元件晶片具有至少一個接腳通過頂部結構電連接至第一線圈的第一端，並在第一線圈的第二端提供第一輸出電壓。第二功率元件晶片具有至少一個接腳通過頂部結構電連接至第二線圈的第一端，並在第二線圈的第二端提供第二輸出電壓。第一組電容器並聯連接在第一線圈的第二端和地之間，第二組電容器並聯連接在第二線圈的第二端和地之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a power module, including a magnetic assembly, a top structure on top of the magnetic assembly, a first power device die, a second power device die, an output capacitor layer under the magnetic assembly, and a first plurality of capacitors and a second plurality of capacitors which are in the output capacitor layer. The magnetic assembly has a magnetic core, a first winding, and a second winding. The first winding and the second winding each have a first end attached to a bottom surface of the top structure. The first power device die has at least one pin connected to the first end of the first winding via the top structure, and a first output voltage is provided at a second end of the first winding. The second power device die has at least one pin connected to the first end of the second winding via the top structure, and a second output voltage is provided at a second end of the second winding. The first plurality of capacitors are connected in parallel between the second end of the first winding and a ground, and the second plurality of capacitors are connected in parallel between the second end of the second winding and the ground.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:PCB底板</p>  
        <p type="p">202:PCB頂板</p>  
        <p type="p">203:功率元件晶片</p>  
        <p type="p">208:分立元件</p>  
        <p type="p">210:輸出電容基板層</p>  
        <p type="p">211:中介基板層</p>  
        <p type="p">236:下表面</p>  
        <p type="p">D20,D23:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3035" publication-number="202628193"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628193.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及電漿處理裝置</chinese-title>  
        <english-title>ETCHING METHOD AND PLASMA PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">H01J37/32</main-classification>  
        <further-classification edition="202601120260316B">H10P50/20</further-classification>  
        <further-classification edition="202601120260316B">H10P50/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千野光貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINO, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木彦一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, HIKOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抑制形成於含矽膜之凹部之形狀異常、且使凹部之底之蝕刻進行之技術。 &lt;br/&gt;本發明所揭示之蝕刻方法包含步驟(a)，其係準備具有包含氧化矽膜之含矽膜之基板。基板載置於設置在腔室內之基板支持器上。蝕刻方法進而包含步驟(b)，其係將處理氣體供給至腔室內。處理氣體包含六氟化鎢氣體、含有碳及氟之氣體、以及含氧氣體。蝕刻方法進而包含步驟(c)，其係自處理氣體產生電漿，而對含矽膜進行蝕刻。步驟(c)包含對基板支持器週期性地施加負直流電壓之步序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An etching method includes: (a) preparing a substrate including a silicon-containing film including a silicon oxide film and placed on a substrate support provided in a chamber; (b) supplying a processing gas containing a tungsten hexafluoride gas, a gas containing carbon and fluorine, and an oxygen-containing gas into the chamber; and (c) generating plasma from the processing gas to etch the silicon-containing film. (c) includes periodically applying a negative DC voltage to the substrate support.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">MT:方法</p>  
        <p type="p">STa:步驟</p>  
        <p type="p">STb:步驟</p>  
        <p type="p">STc:步驟</p>  
        <p type="p">STc1:步驟</p>  
        <p type="p">STc2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3036" publication-number="202626699"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626699.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多鏈嵌合多肽及其用途</chinese-title>  
        <english-title>MULTI-CHAIN CHIMERIC POLYPEPTIDES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07K14/54</main-classification>  
        <further-classification edition="200601120260324B">C07K14/715</further-classification>  
        <further-classification edition="200601120260324B">C07K14/745</further-classification>  
        <further-classification edition="200601120260324B">C07K16/28</further-classification>  
        <further-classification edition="200601120260324B">C12N15/62</further-classification>  
        <further-classification edition="200601120260324B">A61K38/20</further-classification>  
        <further-classification edition="200601120260324B">A61P31/00</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商免疫生物公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMMUNITYBIO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　慶祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, HING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供多鏈嵌合多肽，其包括：(a)第一嵌合多肽，其包括第一標靶結合性結構域、可溶性組織因子結構域、及一對親和力結構域之第一結構域；及(b)第二嵌合多肽，其包括一對親和力結構域之第二結構域及第二標靶結合性結構域，其中該第一嵌合多肽與該第二嵌合多肽經由該成對親和力結構域之第一結構域與第二結構域之結合而締合。此處亦提供使用此等多鏈嵌合多肽之方法，及編碼此等多鏈嵌合多肽之核酸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are multi-chain chimeric polypeptides that include: (a) a first chimeric polypeptide including a first target-binding domain, a soluble tissue factor domain, and a first domain of a pair of affinity domains; and (b) a second chimeric polypeptide including a second domain of a pair of affinity domains and a second target-binding domain, where the first chimeric polypeptide and the second chimeric polypeptide associate through the binding of the first domain and the second domain of the pair of affinity domains. Also provided here are methods of using these multi-chain chimeric polypeptides and nucleic acids encoding these multi-chain chimeric polypeptides.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3037" publication-number="202628751"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628751.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260320B">H10K50/00</main-classification>  
        <further-classification edition="200601120260320B">H05B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>初見亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATSUMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田太介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMADA, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有光檢測功能的顯示裝置。提供一種具有以指紋識別為代表的生物識別的功能的顯示裝置。提供一種具有觸控面板的功能及生物識別的功能的顯示裝置。顯示裝置包括第一基板、導光板、第一發光元件、第二發光元件及受光元件。第一基板與導光板被設置為彼此相對。第一發光元件及受光元件設置在第一基板與導光板之間。第一發光元件具有藉由導光板發射第一光的功能。第二發光元件具有對導光板的側面發射第二光的功能。受光元件具有接收第二光並將其轉換為電信號的功能。並且，第一光包含可見光，第二光包含紅外光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:顯示裝置</p>  
        <p type="p">51,52:基板</p>  
        <p type="p">53:受光元件</p>  
        <p type="p">54:發光元件</p>  
        <p type="p">55:功能層</p>  
        <p type="p">57B,57G,57R:發光元件</p>  
        <p type="p">59:導光板</p>  
        <p type="p">60:指頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3038" publication-number="202628832"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628832.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title>PLASMA PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P50/20</main-classification>  
        <further-classification edition="200601120260325B">H01J37/32</further-classification>  
        <further-classification edition="200601120260325B">H01J37/04</further-classification>  
        <further-classification edition="200601120260325B">H01J37/244</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輿水地塩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHIMIZU, CHISHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明要求可提高電漿之面內均勻性之電漿處理裝置。 &lt;br/&gt;本發明之電漿處理裝置具有腔室、第1下部電極、第2下部電極、第1上部電極、第2上部電極及第1電源。第1下部電極設置於腔室之內部，且具有載置基板之基板載置區域。第2下部電極配置於基板載置區域之外側之區域。第1上部電極與基板載置區域對向配置。第2上部電極配置於第1上部電極之外側之區域，且與第2下部電極對向配置。第1電源對第1下部電極供給具有週期性之信號。第2下部電極及第2上部電極之至少一者具有凹部。第2下部電極或第2上部電極位於對於凹部表面之法線上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plasma processing apparatus includes: a chamber; a first lower electrode provided inside the chamber and having a substrate placement region on which a substrate is placed; a second lower electrode disposed in a region outside the substrate placement region; a first upper electrode disposed to face the substrate placement region; a second upper electrode disposed in a region outside the first upper electrode to face the second lower electrode; and a first power supply configured to supply a first periodic signal to the first lower electrode, wherein at least one of the second lower electrode and the second upper electrode includes a recess, and the second lower electrode or the second upper electrode is located on a normal line with respect to a surface of the recess.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">16:載置台(第1下部電極)</p>  
        <p type="p">18:靜電吸盤</p>  
        <p type="p">26:絕緣構件</p>  
        <p type="p">34:上部電極</p>  
        <p type="p">35:第2電極板(第2上部電極)</p>  
        <p type="p">36:第1電極板(第1上部電極)</p>  
        <p type="p">37:噴出孔</p>  
        <p type="p">39:絕緣性構件</p>  
        <p type="p">40:氣體擴散室</p>  
        <p type="p">41:氣體流通孔</p>  
        <p type="p">42:絕緣性遮蔽構件</p>  
        <p type="p">AUX:輔助電極(第2下部電極)</p>  
        <p type="p">D:凹部</p>  
        <p type="p">ER:邊緣環</p>  
        <p type="p">PL:電漿</p>  
        <p type="p">P&lt;sub&gt;HZN1&lt;/sub&gt;:水平面</p>  
        <p type="p">P&lt;sub&gt;HZN2&lt;/sub&gt;:水平面</p>  
        <p type="p">W:半導體晶圓</p>  
        <p type="p">△H1:最短距離</p>  
        <p type="p">△H2:最短距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3039" publication-number="202628833"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628833.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title>PLASMA PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P50/20</main-classification>  
        <further-classification edition="200601120260325B">H01J37/32</further-classification>  
        <further-classification edition="200601120260325B">H01J37/04</further-classification>  
        <further-classification edition="200601120260325B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木彦一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, HIKOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭世栄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, SHIRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田武信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, TAKENOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昆泰光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KON, YOSHIMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電漿處理方法，其具備以下步驟：a)於電漿處理腔室內之基板支持部上，提供具有含矽膜、與上述含矽膜上之遮罩之基板；b)對上述電漿處理腔室內供給處理氣體；c)對上述基板支持部週期性地供給脈衝電壓；及d)週期性地供給RF電力，藉由上述RF電力自上述處理氣體產生電漿而對上述含矽膜進行蝕刻；且上述脈衝電壓具有負極性，上述c)中，使供給第1脈衝電壓之第1期間、與不供給上述脈衝電壓或供給絕對值小於上述第1脈衝電壓之第2脈衝電壓之第2期間反覆，上述d)中，使供給第1RF電力之第3期間、與不供給上述RF電力或供給相較上述第1RF電力小之第2RF電力之第4期間反覆，於上述第3期間開始前開始上述第1期間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">EL:蝕刻對象膜</p>  
        <p type="p">MK:遮罩</p>  
        <p type="p">Re:凹部</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3040" publication-number="202625970"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625970.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於非侵入式估算血糖的方法和計算機裝置、用於非侵入式測量心電圖訊號的裝置、以及非暫時性電腦可讀取記錄媒體</chinese-title>  
        <english-title>METHOD AND COMPUTING DEVICE FOR NON-INVASIVELY ESTIMATING BLOOD GLUCOSE, DEVICE FOR NON-INVASIVELY MEASURING ELECTROCARDIOGRAM SIGNAL, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">A61B5/145</main-classification>  
        <further-classification edition="202101120260325B">A61B5/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇翼醫電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGULAR WINGS MEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李維中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉欣哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSIN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉展元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHANG YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於非侵入式估算血糖的方法，用於透過計算機裝置來估算使用者的血糖值。所述方法包括：接收使用者的複數個心電圖（electrocardiogram, ECG）波形；從使用者的複數個心電圖波形中的每一個擷取至少二個第一心電圖特徵；分別決定與該些第一心電圖特徵中的每一個相對應的第一特徵峰值位置；計算在複數個第一特徵峰值位置之間的至少一個峰值間距；以及基於峰值間距來估算使用者的血糖值。第一心電圖特徵係選自由P波、Q波、R波、S波、T波和U波所組成之群組。此外，用於非侵入式估算血糖的計算機裝置、用於非侵入式測量心電圖訊號的裝置、以及非暫時性電腦可讀取記錄媒體被利用於所述方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for non-invasively estimating blood glucose for estimating a blood glucose value of a user by a computing device. The method includes receiving a plurality of electrocardiogram (ECG) waveforms of the user, extracting at least two first ECG features from each of the plurality of ECG waveforms of the user, respectively determining a first feature peak position corresponding to each of the first ECG features, calculating at least one peak distance between the plurality of the first feature peak positions, and estimating the blood glucose value of the user based on the peak distance. The first ECG features are selected from the group consisting of a P-wave, a Q-wave, an R-wave, an S-wave, a T-wave, and a U-wave. Furthermore, a computing device for non-invasively estimating blood glucose, a device for non-invasively measuring ECG signal, and a non-transitory computer readable storage medium are utilized for the method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S610:步驟</p>  
        <p type="p">S620:步驟</p>  
        <p type="p">S630:步驟</p>  
        <p type="p">S640:步驟</p>  
        <p type="p">S650:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3041" publication-number="202627201"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627201.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍍銅積層體之製造方法及可撓性電路基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C23C18/40</main-classification>  
        <further-classification edition="200601120260325B">H05K3/02</further-classification>  
        <further-classification edition="202601120260325B">H05K1/189</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋鋼鈑股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYO KOHAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迎展彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田隆広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉松陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMATSU, YOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種既能抑制應用於可撓性電路基板時之傳輸損耗，又能實現低介電樹脂膜與鍍銅層之較高之密接力及良好之體積電阻率的鍍銅積層體及其製造方法。 &lt;br/&gt;本發明之鍍銅積層體之特徵在於包含：低介電樹脂膜，其頻率10 GHz時之相對介電常數為3.5以下且介電損耗因數為0.008以下；及無電解鍍銅層，其積層於上述低介電樹脂膜之至少一面；而且上述無電解鍍銅層中之微晶之加權平均尺寸為25～300 nm，且上述樹脂膜與上述無電解鍍銅層之密接強度為4.2 N/cm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:樹脂膜</p>  
        <p type="p">2:無電解鍍銅層</p>  
        <p type="p">10:鍍銅積層體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3042" publication-number="202628048"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628048.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設備與車輛</chinese-title>  
        <english-title>DISPLAY APPARATUS AND VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260318B">G09G3/32</main-classification>  
        <further-classification edition="200601120260318B">G02B26/08</further-classification>  
        <further-classification edition="200601120260318B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>公昌仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, CHANGSEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明的示例性實施例之一種顯示設備包含：含有複數個子像素的顯示面板、這些子像素共用的第一電源線及這些子像素共用的第二電源線、配置為驅動顯示面板的驅動器、配置為對第一電源線提供高電位電源電壓和對第二電源線提供低電位電源電壓的電源管理電路，感測電路透過第二電源線感測顯示面板的感測區域的電力特性以輸出感測資料，其中，電源管理電路以顯示模式將第一低電位電壓應用於第二電源線，並以感測模式將高於第一低電位電壓的第二低電位電壓應用於第二電源線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus according to an exemplary embodiment of the present disclosure comprises a display panel comprising a plurality of sub-pixels, a first power line shared by the plurality of sub-pixels, and a second power line shared by the pixels; a driver driving the display panel; a power management circuit applying a high potential power voltage to the first power line and applying a low potential power voltage to the second power line; and a sensing circuit sensing electrical characteristics of a sensing area of the display panel through the second power line to output sensing data, wherein the power management circuit applies in a display mode, a first low potential power voltage to the second power line, in a sensing mode, a second low potential power voltage higher than the first low potential power voltage to the second power line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:第一閘極線</p>  
        <p type="p">22:資料線</p>  
        <p type="p">32:第一電源線</p>  
        <p type="p">34:第二電源線</p>  
        <p type="p">100:顯示面板</p>  
        <p type="p">200:閘極驅動器</p>  
        <p type="p">300:資料驅動器</p>  
        <p type="p">400:時序控制器</p>  
        <p type="p">500:記憶體</p>  
        <p type="p">600:感測電路</p>  
        <p type="p">700:電源管理電路</p>  
        <p type="p">900:顯示驅動器</p>  
        <p type="p">1000:顯示設備</p>  
        <p type="p">2000:主機系統</p>  
        <p type="p">DA:顯示區域</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p>  
        <p type="p">BZ:邊框區域</p>  
        <p type="p">BZ1:第一邊框區域</p>  
        <p type="p">BZ2:第二邊框區域</p>  
        <p type="p">BZ3:第三邊框區域</p>  
        <p type="p">BZ4:第四邊框區域</p>  
        <p type="p">ELVDD:高電位電源電壓</p>  
        <p type="p">ELVSS:低電位電源電壓</p>  
        <p type="p">Vref:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3043" publication-number="202628169"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628169.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造源前驅物輸送系統</chinese-title>  
        <english-title>SEMICONDUCTOR MANUFACTURING SOURCE PRECURSOR DELIVERY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01J37/317</main-classification>  
        <further-classification edition="200601120260325B">H01J37/02</further-classification>  
        <further-classification edition="202601120260325B">H10P72/00</further-classification>  
        <further-classification edition="202601120260325B">H10P30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>官偉航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUAN, WEIHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴羅利　沙那多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAROLLI, SANADO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐瀛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊斯　愛德華　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONES, EDWARD E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩斯　卡維塔　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURTHI, KAVITA R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱　夏羅納　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAY, SHARONA R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於在離子植入中輸送一汽化源前驅物之輸送系統，其包含一總成，該總成包含：一容器，其具有一內部體積且經組態以產生該汽化源前驅物；一第一加熱器，其用於加熱該容器；及一歧管，其經組態以控制該汽化源前驅物至一離子植入裝置之輸出，其中該總成經組態以安置於源入口凸緣之上游。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A delivery system for delivering a vaporized source precursor in ion implantation, including: an assembly including: a vessel having an interior volume and configured to produce the vaporized source precursor; a first heater to heat the vessel; and a manifold configured to control the output of the vaporized source precursor to an ion implantation device, wherein the assembly is configured to be disposed upstream of the source inlet flange.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:氣體箱</p>  
        <p type="p">104:工具</p>  
        <p type="p">106:容器</p>  
        <p type="p">108:源前驅物</p>  
        <p type="p">110:歧管</p>  
        <p type="p">112:導管</p>  
        <p type="p">114:加熱器</p>  
        <p type="p">116:電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3044" publication-number="202627526"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627526.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測造假的全球導航衛星系統信號</chinese-title>  
        <english-title>DETECTING SPOOFED GLOBAL NAVIGATION SATELLITE SYSTEM (GNSS) SIGNALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260325B">G01S19/21</main-classification>  
        <further-classification edition="201001120260325B">G01S19/20</further-classification>  
        <further-classification edition="201001120260325B">G01S19/49</further-classification>  
        <further-classification edition="201801120260325B">H04W4/029</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅　寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　更生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GENGSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊英花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YINGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個方面，用戶設備（UE）從伺服器或物聯網（IOT）設備接收造假警報訊息，該訊息指示是否存在造假的全球導航衛星系統（GNSS）狀況。基於決定造假警報訊息指示存在造假的GNSS狀況，UE基於造假警報訊息，決定正在廣播造假的GNSS信號的造假者的位置，基於造假者的位置和UE的當前位置，決定UE在造假的GNSS信號的接收區域內，並在不使用造假的GNSS信號的情況下決定UE的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an aspect, a user equipment (UE) receives a spoofing alert message from either a server or an internet-of-things (IOT) device that indicates whether a spoofed Global Navigation Satellite System (GNSS) condition is present. Based on determining that the spoofing alert message indicates that a spoofed GNSS condition is present, the UE determines, based on the spoofing alert message, a location of a spoofer broadcasting a spoofed GNSS signal, determines, based on the location of the spoofer and a current location of the UE, that the UE is within a receiving area of the spoofed GNSS signal, and determines a position of the UE without using the spoofed GNSS signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102(1)~102(N):物聯網(IOT)設備</p>  
        <p type="p">104:伺服器</p>  
        <p type="p">106:網路</p>  
        <p type="p">108(1)~108(M):用戶設備(UE)</p>  
        <p type="p">110:造假者</p>  
        <p type="p">112:造假資料</p>  
        <p type="p">114:導航感測器</p>  
        <p type="p">115:無線收發機</p>  
        <p type="p">116:感測器</p>  
        <p type="p">118(1)~118(N):位置</p>  
        <p type="p">120:感測器</p>  
        <p type="p">121:定位</p>  
        <p type="p">122:造假檢查器</p>  
        <p type="p">124:短期平均值(ST AVG)</p>  
        <p type="p">126:長期平均值(LT AVG)</p>  
        <p type="p">128:準則</p>  
        <p type="p">130:訊息</p>  
        <p type="p">132:造假偵測器</p>  
        <p type="p">133:分析</p>  
        <p type="p">134:條件</p>  
        <p type="p">136:機器學習</p>  
        <p type="p">138:子區域</p>  
        <p type="p">140:威脅層級</p>  
        <p type="p">141:置信度</p>  
        <p type="p">142:資料庫</p>  
        <p type="p">144:網路管理</p>  
        <p type="p">146:造假警報</p>  
        <p type="p">148:指令</p>  
        <p type="p">150:警報</p>  
        <p type="p">152:設備子集</p>  
        <p type="p">154:子區域</p>  
        <p type="p">156:造假者位置</p>  
        <p type="p">166:造假者位置</p>  
        <p type="p">168:全球導航衛星系統(GNSS)資料</p>  
        <p type="p">170:來源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3045" publication-number="202628950"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628950.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保持裝置、微影裝置及物品製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P76/00</main-classification>  
        <further-classification edition="202601120260324B">H10P72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井本浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMOTO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">保持裝置，具有：保持部，其將物體進行保持；相變化材料，其配置於前述保持部的內部或前述物體的保持面之上，在非晶相與結晶相之間進行相變化，隨該相變化而產生體積變化；以及控制部，其對使用了將前述相變化材料進行加熱的加熱部之前述相變化材料的加熱進行控制，從而予以產生前述相變化材料的體積變化從而使前述保持面產生變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:保持裝置</p>  
        <p type="p">101:基板保持部</p>  
        <p type="p">102:相變化材料</p>  
        <p type="p">103:加熱部</p>  
        <p type="p">105:基板</p>  
        <p type="p">C:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3046" publication-number="202627881"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627881.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單手操作型觸發裝置</chinese-title>  
        <english-title>ONE-HAND OPERATION TYPE TRIGGER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G06K7/01</main-classification>  
        <further-classification edition="200601120260401B">G06K7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宣德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPEED TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃英彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭建林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉軒如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSUAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種單手操作型觸發裝置，其包括開關組件、基座組件、按壓組件和限位加壓機構。基座組件的多個第一延伸件在第二方向上設於支撐件的相對兩側且沿第一方向靠近開關組件的第二接點部件延伸。按壓組件的抵接件抵接開關組件的第一接點部件，多個第二延伸件在第二方向上設於按壓本體的相對兩側且沿第一方向靠近第一接點部件延伸。限位加壓機構包括設於多個第一延伸件和多個第二延伸件的多個抵接凸件和多個抵接槽孔。施力於按壓本體一側，其相對一側的抵接凸件抵接抵接槽孔的孔壁，抵接件推動第一接點部件沿第一方向移動與第二接點部件接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A one-hand operation type trigger device is disclosed. The one-hand operation type trigger device includes a switch component, a base component, a pressing component and a limiting pressure mechanism. A plurality of first extension elements of the base component are disposed on two opposite sides of a support element in the second direction and extend close to a second contact part of the switch component along the first direction. An abutting element of the pressing component is abutted against a first contact part of the switch component. A plurality of second extension elements are disposed on two opposite sides of a pressing body in the second direction and extend close to the first contact part along the first direction. The limiting pressure mechanism includes a plurality of abutting protrusions and a plurality of abutting slots disposed on the plurality of first extension elements and the plurality of second extension elements. By applying force to one side of the pressing body, the abutting protrusions on the opposite side of the pressing body are abutted against the wall of the abutting slots. The first contact part is pushed through the abutting element to move along the first direction and contact the second contact part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:開關組件</p>  
        <p type="p">11:第一接點部件</p>  
        <p type="p">13:第一導線</p>  
        <p type="p">14:第二導線</p>  
        <p type="p">15:電路板</p>  
        <p type="p">20:基座組件</p>  
        <p type="p">21:支撐件</p>  
        <p type="p">212:支撐凸肋</p>  
        <p type="p">213:定位柱</p>  
        <p type="p">214:卡扣件</p>  
        <p type="p">215:線槽</p>  
        <p type="p">216:穿孔</p>  
        <p type="p">22:第一延伸件</p>  
        <p type="p">30:按壓組件</p>  
        <p type="p">31:按壓本體</p>  
        <p type="p">33:第二延伸件</p>  
        <p type="p">40:限位加壓機構</p>  
        <p type="p">41:抵接凸件</p>  
        <p type="p">42:抵接槽孔</p>  
        <p type="p">50:裝置容置組件</p>  
        <p type="p">51:容置件</p>  
        <p type="p">511:底壁</p>  
        <p type="p">511a:開槽</p>  
        <p type="p">512:外周壁</p>  
        <p type="p">514:卡合槽</p>  
        <p type="p">52:電連接件</p>  
        <p type="p">521:電連接件本體</p>  
        <p type="p">522:電連接結構</p>  
        <p type="p">53:卡合定位件</p>  
        <p type="p">531:第二卡合端部</p>  
        <p type="p">5311:導引斜面</p>  
        <p type="p">532:應力變形缺口</p>  
        <p type="p">533:結合槽</p>  
        <p type="p">54:導線定位件</p>  
        <p type="p">L1:第一方向</p>  
        <p type="p">L2:第二方向</p>  
        <p type="p">L3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3047" publication-number="202627882"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627882.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單手操作型觸發裝置</chinese-title>  
        <english-title>ONE-HAND OPERATION TYPE TRIGGER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G06K7/01</main-classification>  
        <further-classification edition="200601120260324B">G06K7/06</further-classification>  
        <further-classification edition="200601120260324B">H01H13/02</further-classification>  
        <further-classification edition="200601120260324B">G06F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宣德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPEED TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃英彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭建林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉軒如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSUAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種單手操作型觸發裝置，其包括開關組件、基座組件、按壓組件和限位加壓機構。基座組件的多個第一延伸件在第二方向上設於支撐件的相對兩側且沿第一方向靠近開關組件的第二接點部件延伸。按壓組件的抵接件抵接開關組件的第一接點部件，多個第二延伸件在第二方向上設於按壓本體的相對兩側且沿第一方向靠近第一接點部件延伸。限位加壓機構包括設於多個第一延伸件和多個第二延伸件的多個抵接凸件和多個抵接槽孔。施力於按壓本體一側，其相對一側的抵接凸件抵接抵接槽孔的孔壁，抵接件推動第一接點部件沿第一方向移動與第二接點部件接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A one-hand operation type trigger device is disclosed. The one-hand operation type trigger device includes a switch component, a base component, a pressing component and a limiting pressure mechanism. A plurality of first extension elements of the base component are disposed on two opposite sides of a support element in the second direction and extend close to a second contact part of the switch component along the first direction. An abutting element of the pressing component is abutted against a first contact part of the switch component. A plurality of second extension elements are disposed on two opposite sides of a pressing body in the second direction and extend close to the first contact part along the first direction. The limiting pressure mechanism includes a plurality of abutting protrusions and a plurality of abutting slots disposed on the plurality of first extension elements and the plurality of second extension elements. By applying force to one side of the pressing body, the abutting protrusions on the opposite side of the pressing body are abutted against the wall of the abutting slots. The first contact part is pushed through the abutting element to move along the first direction and contact the second contact part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:開關組件</p>  
        <p type="p">11:第一接點部件</p>  
        <p type="p">13:第一導線</p>  
        <p type="p">14:第二導線</p>  
        <p type="p">15:電路板</p>  
        <p type="p">20:基座組件</p>  
        <p type="p">21:支撐件</p>  
        <p type="p">212:支撐凸肋</p>  
        <p type="p">213:定位柱</p>  
        <p type="p">214:卡扣件</p>  
        <p type="p">215:線槽</p>  
        <p type="p">216:穿孔</p>  
        <p type="p">22:第一延伸件</p>  
        <p type="p">30:按壓組件</p>  
        <p type="p">31:按壓本體</p>  
        <p type="p">33:第二延伸件</p>  
        <p type="p">40:限位加壓機構</p>  
        <p type="p">41:抵接凸件</p>  
        <p type="p">42:抵接槽孔</p>  
        <p type="p">50:裝置容置組件</p>  
        <p type="p">51:容置件</p>  
        <p type="p">511:底壁</p>  
        <p type="p">511a:開槽</p>  
        <p type="p">512:外周壁</p>  
        <p type="p">514:卡合槽</p>  
        <p type="p">52:電連接件</p>  
        <p type="p">521:電連接件本體</p>  
        <p type="p">522:電連接結構</p>  
        <p type="p">53:卡合定位件</p>  
        <p type="p">531:第二卡合端部</p>  
        <p type="p">5311:導引斜面</p>  
        <p type="p">532:應力變形缺口</p>  
        <p type="p">533:結合槽</p>  
        <p type="p">54:導線定位件</p>  
        <p type="p">L1:第一方向</p>  
        <p type="p">L2:第二方向</p>  
        <p type="p">L3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3048" publication-number="202627883"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627883.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單手操作型觸發裝置</chinese-title>  
        <english-title>ONE-HAND OPERATION TYPE TRIGGER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G06K7/01</main-classification>  
        <further-classification edition="200601120260324B">G06K7/06</further-classification>  
        <further-classification edition="200601120260324B">H01H23/08</further-classification>  
        <further-classification edition="200601120260324B">H01H23/14</further-classification>  
        <further-classification edition="200601120260324B">H01H23/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宣德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPEED TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃英彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭建林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉軒如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSUAN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種單手操作型觸發裝置，其包括開關組件、基座組件、按壓組件和限位加壓機構。基座組件的多個第一延伸件在第二方向上設於支撐件的相對兩側且沿第一方向靠近開關組件的第二接點部件延伸。按壓組件的抵接件抵接開關組件的第一接點部件，多個第二延伸件在第二方向上設於按壓本體的相對兩側且沿第一方向靠近第一接點部件延伸。限位加壓機構包括設於多個第一延伸件和多個第二延伸件的多個抵接凸件和多個抵接槽孔。施力於按壓本體一側，其相對一側的抵接凸件抵接抵接槽孔的孔壁，抵接件推動第一接點部件沿第一方向移動與第二接點部件接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A one-hand operation type trigger device is disclosed. The one-hand operation type trigger device includes a switch component, a base component, a pressing component and a limiting pressure mechanism. A plurality of first extension elements of the base component are disposed on two opposite sides of a support element in the second direction and extend close to a second contact part of the switch component along the first direction. An abutting element of the pressing component is abutted against a first contact part of the switch component. A plurality of second extension elements are disposed on two opposite sides of a pressing body in the second direction and extend close to the first contact part along the first direction. The limiting pressure mechanism includes a plurality of abutting protrusions and a plurality of abutting slots disposed on the plurality of first extension elements and the plurality of second extension elements. By applying force to one side of the pressing body, the abutting protrusions on the opposite side of the pressing body are abutted against the wall of the abutting slots. The first contact part is pushed through the abutting element to move along the first direction and contact the second contact part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:開關組件</p>  
        <p type="p">11:第一接點部件</p>  
        <p type="p">13:第一導線</p>  
        <p type="p">14:第二導線</p>  
        <p type="p">15:電路板</p>  
        <p type="p">20:基座組件</p>  
        <p type="p">21:支撐件</p>  
        <p type="p">212:支撐凸肋</p>  
        <p type="p">213:定位柱</p>  
        <p type="p">214:卡扣件</p>  
        <p type="p">215:線槽</p>  
        <p type="p">216:穿孔</p>  
        <p type="p">22:第一延伸件</p>  
        <p type="p">30:按壓組件</p>  
        <p type="p">31:按壓本體</p>  
        <p type="p">33:第二延伸件</p>  
        <p type="p">40:限位加壓機構</p>  
        <p type="p">41:抵接凸件</p>  
        <p type="p">42:抵接槽孔</p>  
        <p type="p">50:裝置容置組件</p>  
        <p type="p">51:容置件</p>  
        <p type="p">511:底壁</p>  
        <p type="p">511a:開槽</p>  
        <p type="p">512:外周壁</p>  
        <p type="p">514:卡合槽</p>  
        <p type="p">52:電連接件</p>  
        <p type="p">521:電連接件本體</p>  
        <p type="p">522:電連接結構</p>  
        <p type="p">53:卡合定位件</p>  
        <p type="p">531:第二卡合端部</p>  
        <p type="p">5311:導引斜面</p>  
        <p type="p">532:應力變形缺口</p>  
        <p type="p">533:結合槽</p>  
        <p type="p">54:導線定位件</p>  
        <p type="p">L1:第一方向</p>  
        <p type="p">L2:第二方向</p>  
        <p type="p">L3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3049" publication-number="202628804"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628804.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107249</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置和使用遮罩用於選擇性電磁干擾屏蔽的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR SELECTIVE EMI SHIELDING USING A MASK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P14/40</main-classification>  
        <further-classification edition="202601120260324B">H10W42/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GUNHYUCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炫景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玟政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，該半導體裝置藉由提供包括複數個單元之條帶基板而製成。孔形成於該條帶基板中。囊封體沈積於該條帶基板上方。遮罩安置於該條帶基板及該囊封體上方，其中該遮罩之支腳安置於該孔中。屏蔽層形成於該遮罩及該條帶基板上方。在形成該屏蔽層之後移除該遮罩。單粒化該條帶基板以在形成該屏蔽層之後將該複數個單元彼此分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device is made by providing a strip substrate including a plurality of units. A hole is formed in the strip substrate. An encapsulant is deposited over the strip substrate. A mask is disposed over the strip substrate and encapsulant with a leg of the mask disposed in the hole. A shielding layer is formed over the mask and strip substrate. The mask is removed after forming the shielding layer. The strip substrate is singulated to separate the plurality of units from each other after forming the shielding layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:半導體晶粒/組件</p>  
        <p type="p">150:封裝</p>  
        <p type="p">152:基板</p>  
        <p type="p">154:絕緣層</p>  
        <p type="p">156:導電層</p>  
        <p type="p">164:離散組件</p>  
        <p type="p">172:孔/開口</p>  
        <p type="p">174:囊封體</p>  
        <p type="p">175:傾斜表面</p>  
        <p type="p">176:帶</p>  
        <p type="p">180:遮罩/蓋</p>  
        <p type="p">182:頂部</p>  
        <p type="p">184:側壁</p>  
        <p type="p">186:傾斜表面</p>  
        <p type="p">188:柱/支腳</p>  
        <p type="p">200:屏蔽層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3050" publication-number="202628292"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628292.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件及其製造方法</chinese-title>  
        <english-title>ELEMENT AND METHOD FOR PRODUCING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01S5/026</main-classification>  
        <further-classification edition="202101120260325B">H01S5/12</further-classification>  
        <further-classification edition="200601120260325B">H01S5/36</further-classification>  
        <further-classification edition="202301120260325B">H10K71/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商考拉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOALA TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班傑科　法蒂瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENCHEIKH, FATIMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIHARA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利比伊爾　尚　查理斯　莫里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIBIERRE, JEAN CHARLES MAURICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松龍太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, RYUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安達千波矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADACHI, CHIHAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋賢人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武石信弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEISHI, NOBUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種元件及其製造方法，該元件包含基板及至少2個不同的光電裝置，其中上述至少2個不同的光電裝置在基板上以單石方式製造。本發明亦公開了一種有機半導體雷射二極體，其依次包含基板、絕緣光柵、第一電極、有機層及第二電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are an element comprising a substrate and at least two different optoelectronic devices, wherein the at least two different optoelectronic devices are monolithically fabricated on the substrate; and a method for producing the same. Also disclosed is an organic semiconductor laser diode comprising a substrate, an insulating grating, a first electrode, an organic layer and a second electrode in this order.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3051" publication-number="202628761"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628761.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260324B">H10K59/122</main-classification>  
        <further-classification edition="202301120260324B">H10K59/126</further-classification>  
        <further-classification edition="202501120260324B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG YEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹基述</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KI SUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭德永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, DUK YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金張大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JANG DAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玟澈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MIN CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置，包括：裝置基板；第一薄膜電晶體，位於裝置基板上，第一薄膜電晶體包含第一半導體圖案、第一閘極電極、第一源極電極、第一汲極電極，第一半導體圖案包含氧化物半導體；第二薄膜電晶體，位於裝置基板上與第一薄膜電晶體隔開，第二薄膜電晶體包含第二半導體圖案、第二閘極電極、第二源極電極、第二汲極電極，第二半導體圖案包含氧化物半導體；第三薄膜電晶體，位於裝置基板上與第一薄膜電晶體和第二薄膜電晶體隔開，第三薄膜電晶體包含第三半導體圖案、第三閘極電極、第三源極電極、第三汲極電極，第三半導體圖案包含低溫多晶矽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display apparatus comprises: a device substrate; a first thin film transistor positioned on the device substrate and including a first semiconductor pattern including an oxide semiconductor, a first gate electrode, a first source electrode and a first drain electrode; a second thin film transistor positioned on the device substrate and spaced apart from the first thin film transistor, the second thin film transistor including a second semiconductor pattern including an oxide semiconductor, a second gate electrode, a second source electrode and a second drain electrode; a third thin film transistor positioned on the device substrate and spaced apart from the first and second thin film transistors, the third thin film transistor including a third semiconductor pattern including a low-temperature poly-Si, a third gate electrode, a third source electrode and a third drain electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:第一閘極絕緣層</p>  
        <p type="p">130:第一層間絕緣層</p>  
        <p type="p">141:第一隔離絕緣層</p>  
        <p type="p">142:第二隔離絕緣層</p>  
        <p type="p">150:第二閘極絕緣層</p>  
        <p type="p">160:第二層間絕緣層</p>  
        <p type="p">410:驅動半導體圖案</p>  
        <p type="p">430:驅動閘極電極</p>  
        <p type="p">431:第一驅動閘極</p>  
        <p type="p">432:第二驅動閘極</p>  
        <p type="p">450:驅動源極電極</p>  
        <p type="p">470:驅動汲極電極</p>  
        <p type="p">720:第二遮光圖案</p>  
        <p type="p">C1:第一電容</p>  
        <p type="p">C2:第二電容</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3052" publication-number="202625937"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625937.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107256</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童椅具及其背靠連接結構</chinese-title>  
        <english-title>CHILD CHAIR AND BACKREST CONNECTING STRUCTURE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">A47D1/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉開勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KAIQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何智楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, ZHIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種背靠連接結構以及具有該背靠連接結構的兒童椅具。該兒童椅具包含座椅本體和背靠組件。背靠組件通過背靠連接結構與座椅本體可拆卸連接，背靠連接結構包含背靠拆卸機構。背靠拆卸機構包括：卡合件和拆卸操作件。卡合件可移動地設置在背靠組件上，卡合件具有卡合端。拆卸操作件可轉動地連接於背靠組件，拆卸操作件與卡合件驅動連接，拆卸操作件能夠被轉動地操作以使卡合件在第一背靠鎖定位置和第一背靠解鎖位置之間移動。座椅本體設置有卡合部，當卡合件位於第一背靠鎖定位置時，卡合端能夠與卡合部卡合，以將背靠組件與座椅本體固定連接，當卡合件位於第一背靠解鎖位置時，卡合端與卡合部解除卡合，以允許背靠組件與座椅本體分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a backrest connecting structure and a child chair having the backrest connecting structure. The child chair includes a seat body and a backrest assembly. The backrest connecting structure is configured to detachably connect the backrest assembly to the seat body. The backrest connecting structure includes a backrest disassembly mechanism. The backrest disassembly mechanism includes an engagement member and a disassembly operating member. The engagement member is movably disposed on the backrest assembly and has a engagement end. The disassembly operating member is rotatably connected to the backrest assembly and drivingly connected to the engagement member. The disassembly operating member is capable of being operated to rotate to cause the engagement member to move between a first backrest locking position and a first backrest unlocking position. The seat body is provided with an engagement portion. When the engagement member is in the first backrest locking position, the engagement end is capable of being engaged with the engagement portion to connect the backrest assembly to the seat body. When the engagement member is in the first backrest unlocking position, the engagement end is disengaged from the engagement portion to allow the backrest assembly to be detached from the seat body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:背靠組件</p>  
        <p type="p">21:背靠主體</p>  
        <p type="p">213:背靠底部</p>  
        <p type="p">214:背靠側部</p>  
        <p type="p">215:限位板部</p>  
        <p type="p">216:第一限位凸部</p>  
        <p type="p">2161:第一限位槽</p>  
        <p type="p">2162:第一穿入口</p>  
        <p type="p">217:第二限位凸部</p>  
        <p type="p">2171:第二限位槽</p>  
        <p type="p">2172:第二穿入口</p>  
        <p type="p">23:容納腔</p>  
        <p type="p">25:第一穿出孔</p>  
        <p type="p">26:第二穿出孔</p>  
        <p type="p">300:背靠連接結構</p>  
        <p type="p">3:背靠拆卸機構</p>  
        <p type="p">31:卡合件</p>  
        <p type="p">311:卡合端</p>  
        <p type="p">318:限位平台</p>  
        <p type="p">32:拆卸操作件</p>  
        <p type="p">321:樞接部</p>  
        <p type="p">322:拆卸操作部</p>  
        <p type="p">33:拆卸復位件</p>  
        <p type="p">4:背靠調整機構</p>  
        <p type="p">41:調整件</p>  
        <p type="p">411:卡接端</p>  
        <p type="p">42:調整操作件</p>  
        <p type="p">43:驅動件</p>  
        <p type="p">431:驅動索</p>  
        <p type="p">432:連接端子</p>  
        <p type="p">45:第二調整復位件</p>  
        <p type="p">D1:連接凹槽的延伸方向</p>  
        <p type="p">D2:卡合件的移動方向</p>  
        <p type="p">D3:調整件的移動方向</p>  
        <p type="p">D4:調整操作件的移動方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3053" publication-number="202628194"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628194.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生波形的波形產生器、方法及非暫態電腦可讀取媒體</chinese-title>  
        <english-title>WAVEFORM GENERATOR, METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM FOR GENERATING WAVEFORMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H01J37/32</main-classification>  
        <further-classification edition="200601120260327B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿札德　Ａ　Ｎ　Ｍ瓦塞科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZAD, A N M WASEKUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬斯瓦米　卡提克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMASWAMY, KARTIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席門瑞　費南多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILVEIRA, FERNANDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中提供的實施例概略包括設備，例如電漿處理系統，以及用於在處理腔室中基板之電漿處理的方法。一些實施例乃針對波形產生器。該波形產生器一般包括第一電壓級，其具有：第一電壓源；第一開關；接地參考點；具有第一變壓比的變壓器，該第一變壓器包含：經耦接至該第一電壓源及該接地參考點的主要繞組；以及具有第一末端和第二末端的次要繞組，其中該第一末端經耦接至該接地參考點，及該第二末端經配置以藉由共同節點耦接至負載；及與該第一變壓器之該主要繞組並聯耦接的第一二極體。該波形產生器一般也包括藉由該共同節點耦接至負載的一或更多個額外電壓級。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments provided herein generally include apparatus, e.g., plasma processing systems, and methods for the plasma processing of a substrate in a processing chamber. Some embodiments are directed to a waveform generator. The waveform generator generally includes a first voltage stage having: a first voltage source; a first switch; a ground reference; a transformer having a first transformer ratio, the first transformer comprising: a primary winding coupled to the first voltage source and the ground reference; and a secondary winding having a first end and a second end, wherein the first end is coupled to the ground reference, and the second end is configured to be coupled to a load through a common node; and a first diode coupled in parallel with the primary winding of the first transformer. The waveform generator generally also includes one or more additional voltage stages coupled to a load through the common node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:脈衝器</p>  
        <p type="p">402:電容元件</p>  
        <p type="p">404:電容元件</p>  
        <p type="p">406:電容元件</p>  
        <p type="p">410:電晶體</p>  
        <p type="p">412:電晶體</p>  
        <p type="p">414:電晶體</p>  
        <p type="p">418:閘極驅動電路</p>  
        <p type="p">420:閘極驅動電路</p>  
        <p type="p">422:閘極驅動電路</p>  
        <p type="p">424:電阻元件</p>  
        <p type="p">426:負載</p>  
        <p type="p">428:電容元件</p>  
        <p type="p">430:電阻元件</p>  
        <p type="p">440,442,444:模組</p>  
        <p type="p">450:第三變壓器</p>  
        <p type="p">452:主要繞組</p>  
        <p type="p">454:次要繞組</p>  
        <p type="p">456,466,476:核心</p>  
        <p type="p">460:第二變壓器</p>  
        <p type="p">462:主要繞組</p>  
        <p type="p">464:次要繞組</p>  
        <p type="p">470:第一變壓器</p>  
        <p type="p">472:主要繞組</p>  
        <p type="p">474:次要繞組</p>  
        <p type="p">480:共同節點</p>  
        <p type="p">C1,C2,C3,C4:脈衝電容元件</p>  
        <p type="p">D1,D2,D3:主體二極體</p>  
        <p type="p">N1,N2,N3,N4,N5,N6:節點</p>  
        <p type="p">N7,N8,N9,N10,N11,N12:節點</p>  
        <p type="p">Q1,Q2,Q3:開關</p>  
        <p type="p">R1,R2:電阻元件</p>  
        <p type="p">U&lt;sub&gt;OUT&lt;/sub&gt;:輸出節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3054" publication-number="202628112"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628112.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電壓產生電路及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G11C16/30</main-classification>  
        <further-classification edition="200601120260325B">G11C5/14</further-classification>  
        <further-classification edition="200601120260325B">G05F1/571</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大岩広司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOIWA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施形態是在於提供一種可產生元件的耐壓以內的偏壓電壓的電壓產生電路及半導體裝置。 &lt;br/&gt;　　一實施形態的電壓產生電路，係具備： &lt;br/&gt;　　分壓電路，其係將被施加的電壓分壓； &lt;br/&gt;　　偏壓電路，其係產生將經由預定的端子而供給的電源電壓予以分壓的電壓；及 &lt;br/&gt;　　電源切換控制電路，其係進行： &lt;br/&gt;　　阻止往前述分壓電路之來自前述電源線的電壓供給，且將前述電源線連接至前述第1輸出端子，將接地連接至前述第2輸出端子的第1處理； &lt;br/&gt;　　將前述電源線及前述接地連接至前述分壓電路的第2處理；及 &lt;br/&gt;　　阻止電流從前述偏壓電路流至前述電源線，且將偏壓電路所產生的電壓供給至前述輸出端子，且將前述偏壓電路所產生的電壓供給至前述分壓電路，而藉由前述分壓電路來取得電壓的第3處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:RAM</p>  
        <p type="p">15a:端子</p>  
        <p type="p">GND:接地</p>  
        <p type="p">MN0~MN5,MP0,MP1,MPX,MPY:電晶體</p>  
        <p type="p">N1,N2,N3:節點</p>  
        <p type="p">OH:輸出端子</p>  
        <p type="p">OL:輸出端子</p>  
        <p type="p">R1~R3:電阻電路</p>  
        <p type="p">S0:耐壓超判定訊號</p>  
        <p type="p">S1:電源供給判定訊號</p>  
        <p type="p">S2:耐壓內判定訊號</p>  
        <p type="p">SC:電源切換控制電路</p>  
        <p type="p">VP:偏壓電路</p>  
        <p type="p">Vio:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3055" publication-number="202628367"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628367.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107345</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於經由一隔離通道之雙重通信的發射器</chinese-title>  
        <english-title>TRANSMITTER FOR DUAL COMMUNICATION OVER AN ISOLATION CHANNEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H03K17/689</main-classification>  
        <further-classification edition="200601120260325B">H03K17/785</further-classification>  
        <further-classification edition="200601120260325B">H02M1/08</further-classification>  
        <further-classification edition="200601120260325B">H04L27/32</further-classification>  
        <further-classification edition="200601120260325B">H04L27/12</further-classification>  
        <further-classification edition="200601120260325B">H04L27/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天工方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布里森諾　維德利厄　卡洛斯　吉瑟斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRISENO-VIDRIOS, CARLOS JESUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅　麥寇　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAY, MICHAEL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>狄　貝克　派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE BAKKER, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾維爾斯　費南都　納伊姆　拉瓦勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVILES, FERNANDO NAIM LAVALLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種隔離閘極驅動器，其包含用於接收閘極資訊之一第一輸入端子及用於接收組態資訊之一或多個輸入端子。一調變電路產生具有四個可能狀態之一經調變信號，該四個可能狀態之各者對應於該閘極資訊及該組態資訊之一對不同唯一值。該調變電路在該組態資訊等於一第一值時使用開關鍵控(OOK)來表示該等狀態中之兩者且基於該組態資訊等於一第二值來將該等狀態中之兩者表示為該OOK調變之一修改。該經調變信號經由耦合該隔離閘極驅動器之一發射器及接收器之一隔離通信通道來發送。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An isolated gate driver includes a first input terminal to receive gate information and one or more input terminals to receive configuration information. A modulation circuit generates a modulated signal having four possible states, each of the four possible states corresponding to a different unique pair of values of the gate information and the configuration information. The modulation circuit represents two of the states using on-off keying (OOK) while the configuration information is at a first value and represents two of the states as a modification to the OOK modulation based on the configuration information being at a second value. The modulated signal is sent over an isolation communication channel coupling a transmitter and receiver of the isolated gate driver.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">220:系統</p>  
        <p type="p">221:隔離閘極驅動器</p>  
        <p type="p">222:控制器</p>  
        <p type="p">226:發射器電路</p>  
        <p type="p">227:接收器電路</p>  
        <p type="p">228:隔離通信通道</p>  
        <p type="p">230:閘極信號</p>  
        <p type="p">232:電晶體</p>  
        <p type="p">TX_N:負信號</p>  
        <p type="p">TX_P:正信號</p>  
        <p type="p">VDD1:域</p>  
        <p type="p">VDD2:域</p>  
        <p type="p">VDD3:域</p>  
        <p type="p">VDD4:域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3056" publication-number="202626328"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626328.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異常探測系統、成形機系統、異常探測裝置、異常探測方法以及記錄並可讀取電腦程式的記錄媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">B29C45/17</main-classification>  
        <further-classification edition="201901120260324B">B29C48/25</further-classification>  
        <further-classification edition="201101120260324B">G01M99/00</further-classification>  
        <further-classification edition="200601120260324B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>風呂川幹央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUROKAWA, MIKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野峻之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]　提供一種異常探測系統，能夠探測製造裝置的異常，而不會對執行製造裝置的運轉控制之控制裝置造成過度的負擔。 &lt;br/&gt;[解決手段]　異常探測系統包含：異常探測裝置，探測製造裝置的異常；控制裝置，執行製造裝置的運轉控制，傳送運轉資料；感測器，檢測製造裝置的動作或產品相關的物理量，輸出感測值資料；異常探測裝置接收從控制裝置傳送的運轉資料，取得從感測器輸出的感測值資料，算出取得的感測值資料的統計量，基於算出的統計量、以及接收的運轉資料相應的臨界值，判定製造裝置的異常的有無，將判定結果以及統計量傳送至控制裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:雙軸混煉擠出機</p>  
        <p type="p">2:感測器</p>  
        <p type="p">3:異常探測裝置</p>  
        <p type="p">4:路由器</p>  
        <p type="p">5:診斷裝置</p>  
        <p type="p">6:資料庫</p>  
        <p type="p">7:終端裝置</p>  
        <p type="p">10:圓筒</p>  
        <p type="p">11:螺旋軸</p>  
        <p type="p">12:馬達</p>  
        <p type="p">13:減速機</p>  
        <p type="p">14:控制裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3057" publication-number="202628588"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628588.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經催化劑影響的圖案轉印技術</chinese-title>  
        <english-title>CATALYST INFLUENCED PATTERN TRANSFER TECHNOLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260401B">H10B43/10</main-classification>  
        <further-classification edition="202301120260401B">H10B43/27</further-classification>  
        <further-classification edition="202301120260401B">H10B43/50</further-classification>  
        <further-classification edition="202501120260401B">H10D30/01</further-classification>  
        <further-classification edition="202501120260401B">H10D30/62</further-classification>  
        <further-classification edition="202501120260401B">H10D30/67</further-classification>  
        <further-classification edition="202601120260401B">H10D84/01</further-classification>  
        <further-classification edition="202501120260401B">H10D84/03</further-classification>  
        <further-classification edition="202501120260401B">H10D84/83</further-classification>  
        <further-classification edition="202601120260401B">H10P50/24</further-classification>  
        <further-classification edition="202601120260401B">H10P50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德克薩斯大學系統董事會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦桑　賽德嘉塔Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SREENIVASAN, SIDLGATA V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪拉瓦拉普　艾克席拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLAVARAPU, AKHILA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格哈爾　石拉萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGHAL, SHRAWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐恩　勞倫斯Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNN, LAWRENCE R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高里克　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAWLIK, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明技術之各種實施例大體上係關於半導體元件構架及製造技術。更特別而言，本發明技術之一些實施例係關於使用催化劑影響的化學蝕刻技術並應用於三維記憶體構架及電晶體之矽蝕刻。CICE係基於催化劑的蝕刻方法，其可用於半導體上以及多層半導體上。CICE製程之各種實施例可使用催化劑來蝕刻半導基板並製造高縱橫比特徵。亦揭示達成此目的的製造工具。此應賦能在製造半導體元件中採用此項技術。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of the present technology generally relate to semiconductor device architectures and manufacturing techniques. More specifically, some embodiments of the present technology relate to silicon etching using catalyst influenced chemical etching technology with application to three-dimensional memory architectures and transistors. CICE is a catalyst based etching method that can be used on semiconductors as well as multilayers of the semiconductors. Various embodiments of the CICE process can use a catalyst to etch semiconducting substrates and to fabricate high aspect ratio features. A fabrication tool for this purpose is also disclosed. This shall enable adoption of this technology in making semiconductor devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">805:載入塢</p>  
        <p type="p">815:製程腔室</p>  
        <p type="p">816:預處理步驟</p>  
        <p type="p">818:蝕刻製程</p>  
        <p type="p">820:頂部電極/進線光學計量學</p>  
        <p type="p">822:局部溫度控制</p>  
        <p type="p">824:流量控制</p>  
        <p type="p">826:電場</p>  
        <p type="p">828:後處理</p>  
        <p type="p">830:晶圓卡盤/清洗步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3058" publication-number="202627137"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627137.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結晶性氧化物半導體薄膜及濺鍍靶材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C23C14/08</main-classification>  
        <further-classification edition="200601120260325B">C23C14/34</further-classification>  
        <further-classification edition="202501120260325B">H10D30/67</further-classification>  
        <further-classification edition="202601120260325B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神鋼科研股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBELCO RESEARCH INSTITUTE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越智元隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHI, MOTOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日野綾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINO, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮田浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的一態樣的結晶性氧化物半導體薄膜包含In元素及B元素，所述In的含有率[原子%]與所述B的含有率[原子%]之比滿足下述式1，藉由電子顯微鏡觀察到的表面上的平均晶粒尺寸為0.25 μm以上。 &lt;br/&gt;B/（In+B）≤0.20  ····（1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3059" publication-number="202626799"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626799.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光性樹脂組成物、感光性樹脂積層體、及光阻圖案之形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C08F212/08</main-classification>  
        <further-classification edition="200601120260324B">C08F220/06</further-classification>  
        <further-classification edition="200601120260324B">C08F220/18</further-classification>  
        <further-classification edition="200601120260324B">C08F2/44</further-classification>  
        <further-classification edition="200601120260324B">C08F2/48</further-classification>  
        <further-classification edition="200601120260324B">G03F7/027</further-classification>  
        <further-classification edition="200601120260324B">G03F7/031</further-classification>  
        <further-classification edition="200601120260324B">G03F7/038</further-classification>  
        <further-classification edition="200601120260324B">G03F7/20</further-classification>  
        <further-classification edition="200601120260324B">H05K3/06</further-classification>  
        <further-classification edition="200601120260324B">B32B27/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇野大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井隆覺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西本秀昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMOTO, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾裕樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種感光性樹脂組成物，該感光性樹脂組成物對於鹼可溶性高分子的共聚單體成分之中至少酸共聚單體成分，可控制其種類及比率，以求提升各種特性。 &lt;br/&gt;感光性樹脂組成物係含有以下成分： &lt;br/&gt;（A）鹼可溶性高分子、（B）具有乙烯性不飽和鍵之化合物、及（C）光聚合起始劑； &lt;br/&gt;（A）成分至少具有源自下述共聚單體成分之構成單元： &lt;br/&gt;（a）甲基丙烯酸或丙烯酸、（b）不同於作為上述（a）成分所選擇之酸之羧酸、及（c）具有芳香族結構或脂環式結構之化合物； &lt;br/&gt;（A）成分中，源自（a）成分之構成單元的質量比例（a1）與源自（b）成分之構成單元的質量比例（b1）的比率（質量比例（a1）／質量比例（b1））為1／10～10。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3060" publication-number="202626278"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626278.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>進階抓持裝置</chinese-title>  
        <english-title>ADVANCED HOLDING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B25B15/00</main-classification>  
        <further-classification edition="200601120260325B">B25B13/06</further-classification>  
        <further-classification edition="200601120260325B">B25B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商葛利普控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIP HOLDINGS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫庫克　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKUCKA, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫庫克　湯瑪士史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKUCKA, THOMAS STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳洲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種進階抓持裝置，其可以有效地在將扭力傳遞到承窩扣件。本發明包含：至少一個螺絲起子頭本體。螺絲起子頭本體更包含：複數個側壁、一個第一基面、及一個第二基面。複數個側壁放射狀地環繞螺絲起子頭本體的一條旋轉軸。每一個側壁更包含：一個第一側緣、一個第二側緣、一個側面、及至少一個結合穴。結合穴產生額外的夾持點，因而可以防止螺絲起子頭本體及承窩扣件之間的滑動。結合穴凹陷入側面。結合穴在螺絲起子頭本體上自第一基面朝著第二基面延伸。結合穴位於距離第一側緣一個第一距離的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A screw bit body allows for efficient torque force application onto a socket fastener. The screw bit body includes a plurality of laterally-bracing sidewalls, a first base, and a second base. The laterally-bracing sidewalls are radially distributed about a rotation axis of the screw bit body with each further including a first lateral edge, a second lateral edge, a bracing surface, and an engagement cavity. The engagement cavity creates an additional gripping point to prevent slippage in between the screw bit body and the socket fastener. The engagement cavity traverses normal and into the bracing surface. Additionally, the engagement cavity traverses into the screw bit body from the first base to the second base. The engagement cavity is specifically positioned offset from the first lateral edge by a first distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:螺絲起子頭本體</p>  
        <p type="p">2:側壁</p>  
        <p type="p">3:第一側緣</p>  
        <p type="p">4:第二側緣</p>  
        <p type="p">5:側面</p>  
        <p type="p">8:結合穴</p>  
        <p type="p">14:第一基面</p>  
        <p type="p">15:第二基面</p>  
        <p type="p">16:旋轉軸</p>  
        <p type="p">19:附裝本體</p>  
        <p type="p">26:第一基底表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3061" publication-number="202628886"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628886.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基板容器之歧管</chinese-title>  
        <english-title>MANIFOLD FOR A SUBSTRATE CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260324B">H10P72/00</main-classification>  
        <further-classification edition="202601120260324B">H10P72/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富勒　馬修　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULLER, MATTHEW A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾　寇頓　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARR, COLTON J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜特羅　伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUTRO, IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種基板容器，其包含界定一內部空間之一殼體及具有一進口及一氣體分配表面之一歧管。該殼體包含一前開口、一底壁及一後壁。該歧管附接至該底壁且更靠近該前開口而非該後壁。該氣體分配表面經構形以將淨化氣體分配至該內部空間中。一種淨化一開口基板容器之方法包含將淨化氣體之一第一流供應至一歧管及將淨化氣體之一第二流供應至該基板容器之一內部空間。該方法亦包含該歧管將該第一流之該淨化氣體分配於該基板容器之該內部空間內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate container includes a shell defining an interior space and a manifold with an inlet and a gas distributing surface. The shell includes a front opening, a bottom wall, and a rear wall. The manifold is attached to the bottom wall and is closer to the front opening than the rear wall. The gas distributing surface is configured to distribute purge gas into the interior space. A method of purging an open substrate container includes supplying a first stream of purge gas to a manifold and supplying a second stream of purge gas to an interior space of the substrate container. The method also including the manifold distributing the purge gas of the first stream within the interior space of the substrate container.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板容器</p>  
        <p type="p">6:殼體</p>  
        <p type="p">8:內部空間</p>  
        <p type="p">12:前開口</p>  
        <p type="p">14:第一側壁</p>  
        <p type="p">16:第二側壁</p>  
        <p type="p">18:後壁</p>  
        <p type="p">20:頂壁</p>  
        <p type="p">22:底壁</p>  
        <p type="p">24A:前邊緣</p>  
        <p type="p">24B:前邊緣</p>  
        <p type="p">26:設備掛鉤</p>  
        <p type="p">28:層架</p>  
        <p type="p">34A:第一進口埠/前進口埠</p>  
        <p type="p">34B:第二進口埠/前進口埠</p>  
        <p type="p">36A:後進口埠</p>  
        <p type="p">36B:後進口埠</p>  
        <p type="p">42A:第一進口</p>  
        <p type="p">42B:第二進口</p>  
        <p type="p">44:框架</p>  
        <p type="p">45:開口</p>  
        <p type="p">46:氣體分配表面</p>  
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:距離</p>  
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:方向</p>  
        <p type="p">D&lt;sub&gt;2&lt;/sub&gt;:方向</p>  
        <p type="p">D&lt;sub&gt;3&lt;/sub&gt;:方向</p>  
        <p type="p">f&lt;sub&gt;1&lt;/sub&gt;:淨化氣體之第一流</p>  
        <p type="p">f&lt;sub&gt;2&lt;/sub&gt;:淨化氣體之第二流</p>  
        <p type="p">f&lt;sub&gt;3&lt;/sub&gt;:淨化氣體之另一流</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3062" publication-number="202627515"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627515.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源管理電路</chinese-title>  
        <english-title>A POWER MANAGEMENT CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260326B">G01R31/64</main-classification>  
        <further-classification edition="202601120260326B">H02J7/80</further-classification>  
        <further-classification edition="200601120260326B">G01R19/165</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　鵬捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PENGJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請請求保護一種電源管理電路。該電源管理電路包括功率轉換電路和放電電路。功率轉換電路被配置為用於將匯流排電壓轉換為端子電壓而放電電路被配置為用於為儲能電容提供放電通路。通過本申請提供的方案可以對儲能電容的容值進行定期監測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a power management circuit. The power management circuit includes a power converter circuit and a discharging circuit. The power converter circuit is configured to convert a bus voltage to a terminal voltage, while the discharging circuit is configured to provide a discharging path for the energy storage capacitor. Through the solution provided in this application, the capacitance value of the energy storage capacitor can be monitored.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源管理電路</p>  
        <p type="p">101:功率轉換電路</p>  
        <p type="p">102:放電電路/可控放電電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3063" publication-number="202626365"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626365.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附有覆蓋膜之光學膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">B32B27/08</main-classification>  
        <further-classification edition="200601120260401B">B32B7/12</further-classification>  
        <further-classification edition="201801120260401B">C09J7/38</further-classification>  
        <further-classification edition="200601120260401B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦大生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TAISEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田美菜子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寳田翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKARADA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種附有覆蓋膜之光學膜，其適於自附有黏著劑層之薄光學膜剝離一覆蓋膜，同時抑制另一覆蓋膜之剝離及光學膜端部之龜裂，且適於抑制彎折時黏著劑層自光學膜剝落。 &lt;br/&gt;本發明之附有覆蓋膜之光學膜X1具備光學膜10、黏著劑層20、30及覆蓋膜40、50。光學膜10具有100 μm以下之厚度，黏著劑層20、30具有5～100 μm之厚度，覆蓋膜40具有40～80 μm之厚度H4，覆蓋膜50具有40～80 μm之厚度H5，且比率(H4/H5)為1以下。黏著劑層20、30之儲存模數為20～100 kPa。覆蓋膜40之第1剝離力為10 gf/25 mm以下，覆蓋膜50之第1剝離力相對於第2剝離力之比率為0.9以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學膜</p>  
        <p type="p">11:第1面</p>  
        <p type="p">12:第2面</p>  
        <p type="p">20:黏著劑層(第1黏著劑層)</p>  
        <p type="p">21:黏著面</p>  
        <p type="p">30:黏著劑層(第2黏著劑層)</p>  
        <p type="p">31:黏著面</p>  
        <p type="p">40:覆蓋膜(第1覆蓋膜)</p>  
        <p type="p">50:覆蓋膜(第2覆蓋膜)</p>  
        <p type="p">T:厚度方向</p>  
        <p type="p">X1:光學膜(附有覆蓋膜之光學膜)</p>  
        <p type="p">Y1:附有黏著劑層之光學膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3064" publication-number="202628574"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628574.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含雙面字元線的半導體元件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING DOUBLE SIDE WORD LINE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260326B">H10B12/00</main-classification>  
        <further-classification edition="202501120260326B">H10D30/63</further-classification>  
        <further-classification edition="202501120260326B">H10D64/68</further-classification>  
        <further-classification edition="202501120260326B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜序</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體元件及其製造方法。此半導體元件，包括一基板、一位元線、一第一字元線、一第二字元線及一通道層。該位元線設置於該基板上並且沿著一第一方向延伸。該第一字元線設置於該基板上並且沿著大致上垂直於該第一方向的一第二方向延伸。該第二字元線設置於該基板上並且沿著該第二方向延伸。該通道層設置在該第一字元線與該第二字元線之間並且沿該第二方向延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, a bit line, a first word line, a second word line, and a channel layer. The bit line is disposed on the substrate and extends along a first direction. The first word line is disposed on the substrate and extends along a second direction substantially perpendicular to the first direction. The second word line is disposed on the substrate and extending along the second direction. The channel layer is disposed between the first word line and the second word line and extending along the second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:半導體元件</p>  
        <p type="p">102:基板</p>  
        <p type="p">106:介電層</p>  
        <p type="p">110:位元線</p>  
        <p type="p">112:蓋層</p>  
        <p type="p">120:通道層</p>  
        <p type="p">120s1:側面</p>  
        <p type="p">120s2:側面</p>  
        <p type="p">132a:閘極介電質</p>  
        <p type="p">132b:閘極介電質</p>  
        <p type="p">136a:字元線</p>  
        <p type="p">136b:字元線</p>  
        <p type="p">140:介電圖案</p>  
        <p type="p">144:介電結構</p>  
        <p type="p">150:電容組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3065" publication-number="202628011"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628011.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107514</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手勢檢測裝置</chinese-title>  
        <english-title>DEVICE FOR HAND GESTURE DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260325B">G06V40/20</main-classification>  
        <further-classification edition="200601120260325B">G06F3/01</further-classification>  
        <further-classification edition="200601120260325B">G02B26/10</further-classification>  
        <further-classification edition="202201120260325B">G06F3/04815</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王維謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEICHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王維謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEICHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾孟鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, MONG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種手勢檢測裝置。手勢檢測裝置包括殼體及感測模組。感測模組包括處理器、光源發射元件、機電元件以及光感測器。光源發射元件用以發射光束。機電元件用以控制光束朝向檢測區域發射。光感測器用以接收光束對應的反射光，並根據反射光產生電子訊號。上述檢測區域包括手掌上的手指區域。處理器用以接收該電子訊號或根據該電子訊號產生該手指區域的影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for hand gesture detection are provided. The device includes a housing and a sensing module. The sensing module includes a processor, a light emitting component for emitting a light beam, an electromechanical component for controlling the light beam to emit towards a detection area, and a light sensor for receiving a reflected light corresponding to the light beam, and generating an electronic signal based on the reflected light. The detection area includes a finger area on the palm, and the processor is used to receive the electronic signal or generate an image of the finger area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:感測模組</p>  
        <p type="p">110:光源發射元件</p>  
        <p type="p">120:機電元件</p>  
        <p type="p">130:光感測器</p>  
        <p type="p">140:處理器</p>  
        <p type="p">150:無線通訊模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3066" publication-number="202627422"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627422.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於改善腔室匹配的混合流量計量</chinese-title>  
        <english-title>HYBRID FLOW METROLOGY FOR IMPROVED CHAMBER MATCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">G01F1/34</main-classification>  
        <further-classification edition="202201120260324B">G01F25/00</further-classification>  
        <further-classification edition="200601120260324B">F16K37/00</further-classification>  
        <further-classification edition="202601120260324B">H10P74/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈希米　葛美資　沙伊德　侯賽因</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHEMI GHERMEZI, SEYED HOSSEIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙瑞夫　艾克柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAREEF, IQBAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾嘉沃　皮佑許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, PIYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　秉燊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEUNG, JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史派洛普洛斯　伊凡傑洛斯　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPYROPOULOS, EVANGELOS T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板處理系統之氣體輸送系統，包含氣箱，其包含質量流量控制器以控制來自氣源之氣流。氣流路徑與該氣箱呈流體聯通。混合流量計量系統係與該氣流路徑呈流體聯通，且包含控制器，該控制器設置以執行第一流量計量，用以當由該質量流量控制器的至少其中一者所供應之氣體的期望流量小於預定流量時，基於在預定時段期間在氣箱及流量計量系統之間的氣流路徑中之氣體的差動質量來校準質量流量控制器的至少其中一者。該控制器係設置以當期望流量大於該預定流量時執行第二流量計量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gas delivery system of a substrate processing system includes a gas box including mass flow controllers to control flow of gas from gas sources. A gas flow path in fluid communication with the gas box. A hybrid flow metrology system is in fluid communication with the gas flow path and includes a controller configured to perform first flow metrology to calibrate at least one of the mass flow controllers based on a differential mass of gas in the gas flow path between the gas box and the flow metrology system during a predetermined period when a desired flow rate for the gas supplied by the at least one of the mass flow controllers is less than a predetermined flow rate. The controller is configured to perform second flow metrology when the desired flow rate is greater than the predetermined flow rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">312:氣體管線</p>  
        <p type="p">314:第二氣體管線</p>  
        <p type="p">320:混合流量計量系統</p>  
        <p type="p">480:溫度感測器</p>  
        <p type="p">510:閥</p>  
        <p type="p">511:閥</p>  
        <p type="p">513:歧管</p>  
        <p type="p">518-1:氣體管線</p>  
        <p type="p">518-2:氣體管線</p>  
        <p type="p">518-O:氣體管線</p>  
        <p type="p">520-1:精密孔口</p>  
        <p type="p">520-2:精密孔口</p>  
        <p type="p">520-O:精密孔口</p>  
        <p type="p">524-1:閥</p>  
        <p type="p">524-2:閥</p>  
        <p type="p">524-O:閥</p>  
        <p type="p">530:壓力感測器</p>  
        <p type="p">540:泵</p>  
        <p type="p">B:入口</p>  
        <p type="p">B’:入口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3067" publication-number="202627187"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627187.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成具有降低的介電常數及高機械強度之低Ｋ介電材料的方法</chinese-title>  
        <english-title>METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C23C16/505</main-classification>  
        <further-classification edition="200601120260327B">C23C16/40</further-classification>  
        <further-classification edition="200601120260327B">C23C16/56</further-classification>  
        <further-classification edition="202601120260327B">H10P14/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　求景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, KENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚姗姗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, SHANSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗瀟博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎　紀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, CHI-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　立群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, LI-QUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡卡塔拉曼　尚卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENKATARAMAN, SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">範例半導體處理方法可包括以下步驟：將第一含矽前驅物及第二含矽前驅物提供至半導體製程腔室的處理區域。基板可設置於半導體製程腔室的處理區域內。第一含矽前驅物可包括Si-O鍵結。所述方法可包括以下步驟：於處理區域中形成第一含矽前驅物及第二含矽前驅物之電漿。所述方法可包括以下步驟：於基板上形成含矽材料層。含矽材料層的特徵可在於小於或約3.0的介電常數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary semiconductor processing methods may include providing a first silicon-containing precursor and a second silicon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region of the semiconductor processing chamber. The first silicon-containing precursors may include Si-O bonding. The methods may include forming a plasma of the first silicon-containing precursor and the second silicon-containing precursor in the processing region. The methods may include forming a layer of silicon-containing material on the substrate. The layer of silicon-containing material may be characterized by a dielectric constant less than or about 3.0.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">305~320:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3068" publication-number="202629038"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202629038.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202629038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置以及氣流產生封裝體</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND AIRFLOW GENERATING PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10W74/00</main-classification>  
        <further-classification edition="202601120260325B">H10W40/43</further-classification>  
        <further-classification edition="202601120260325B">H10W40/40</further-classification>  
        <further-classification edition="200601120260325B">H05K7/20</further-classification>  
        <further-classification edition="200601120260325B">H05K7/00</further-classification>  
        <further-classification edition="200601120260325B">G06F1/20</further-classification>  
        <further-classification edition="200601120260325B">G06F1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商知微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XMEMS LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張俊羿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅烱成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHIUNG C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，其包括操作元件、導熱元件以及氣流產生封裝體。操作元件在操作時產生熱。導熱元件用以傳導操作元件所產生的熱，其中操作元件設置在導熱元件上。氣流產生封裝體設置在電子裝置的邊緣旁。氣流產生封裝體包括膜結構，膜結構包括瓣片對，瓣片對包括第一瓣片與第二瓣片，瓣片對以超聲波頻率操作而產生氣流。導熱元件朝氣流產生封裝體延伸，使得氣流產生封裝體所產生的氣流流經導熱元件，以透過導熱元件散逸操作元件所產生的熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes an operational component, a heat conductive component and an airflow generating package. The operational component produces a heat while operating. The heat conductive component is configured to conduct the heat generated by the operational component, wherein the operational component is disposed on the heat conductive component. The airflow generating package is disposed by an edge of the electronic device. The airflow generating package includes a film structure, the film structure includes a flap pair, and the flap pair includes a first flap and a second flap. The flap pair operates at an ultrasonic rate to produce an airflow. The heat conductive component extends toward the airflow generating package, such that the airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,DV:裝置</p>  
        <p type="p">110:熱源</p>  
        <p type="p">120:導熱元件</p>  
        <p type="p">130:外殼</p>  
        <p type="p">132:第一殼開口</p>  
        <p type="p">134:第二殼開口</p>  
        <p type="p">140:間隔物</p>  
        <p type="p">AFC:氣流產生晶片</p>  
        <p type="p">AR:錨定結構</p>  
        <p type="p">BSP:基底</p>  
        <p type="p">CSV:覆蓋結構</p>  
        <p type="p">CSVt:頂部</p>  
        <p type="p">CSVw:側壁</p>  
        <p type="p">FP:瓣片對</p>  
        <p type="p">FS:膜結構</p>  
        <p type="p">OPP,OPP1,OPP2:空氣開口</p>  
        <p type="p">PG:氣流產生封裝體</p>  
        <p type="p">PH:封裝殼體</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3069" publication-number="202628834"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628834.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用含硼及鹵素的前驅物的含金屬硬遮罩開孔方法</chinese-title>  
        <english-title>METAL-CONTAINING HARDMASK OPENING METHODS USING BORON-AND-HALOGEN-CONTAINING PRECURSORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260330B">H10P50/20</main-classification>  
        <further-classification edition="202601120260330B">H10P76/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于家珩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JIAHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　吉尼Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GENE H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">範例半導體處理方法可包括：將含硼及鹵素前驅物及含氧前驅物提供至半導體製程腔室的處理區域。基板可容置於處理區域中。含金屬硬遮罩材料層可設置於基板上。含矽材料層可設置於含金屬硬遮罩材料層上。所述方法可包括：形成含硼及鹵素前驅物及含氧前驅物的電漿流出物。所述方法可包括：使基板與含硼及鹵素前驅物及含氧前驅物的電漿流出物接觸。此接觸可蝕刻含金屬硬遮罩材料層中之特徵。此接觸可於含金屬硬遮罩材料層中之特徵的側壁上形成鈍化材料層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary semiconductor processing methods may include providing a boron-and-halogen-containing precursor and an oxygen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be housed in the processing region. A layer of metal-containing hardmask material may be disposed on the substrate. A layer of silicon-containing material may be disposed on the layer of metal-containing hardmask material. The methods may include forming plasma effluents of the boron-and-halogen-containing precursor and the oxygen-containing precursor. The methods may include contacting the substrate with the plasma effluents of the boron-and-halogen-containing precursor and the oxygen-containing precursor. The contacting may etch a feature in the layer of metal-containing hardmask material. The contacting may form a layer of passivation material on sidewalls of the feature in the layer of metal-containing hardmask material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">305~320:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3070" publication-number="202626689"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626689.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造及純化有機錫化合物、抑制二烷基錫化合物之形成與選擇性移除四（二烷基胺基）錫化合物的方法</chinese-title>  
        <english-title>METHODS FOR PRODUCING AND PURIFYING ORGANOTIN COMPOUNDS, SUPPRESSING FORMATION OF DIALKYL TIN COMPOUNDS AND SELECTIVELY REMOVING TETRAKIS(DIALKYLAMINO) TIN COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F7/22</main-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蓋列斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELEST, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　陶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, THAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井洸毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日置優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIOKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松坂洸季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAKA, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐姿漣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案之態樣係關於用於產生具有高純度之有機錫化合物之方法，其可涉及使用特定添加劑或反應條件。亦描述用於純化有機錫化合物及抑制有機錫化合物中之雜質形成的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the disclosure relate to methods for producing organotin compounds with high purity, which may involve the use of specific additives or reaction conditions. Methods for purifying organotin compounds and suppressing the formation of impurities in organotin compounds are also described.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3071" publication-number="202628076"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628076.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107793</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低延遲、低頻率效應之編碼解碼器</chinese-title>  
        <english-title>LOW-LATENCY, LOW-FREQUENCY EFFECTS CODEC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260317B">G10L19/008</main-classification>  
        <further-classification edition="201301120260317B">G10L19/012</further-classification>  
        <further-classification edition="201301120260317B">G10L19/02</further-classification>  
        <further-classification edition="201301120260317B">G10L19/032</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商杜拜研究特許公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔吉　里沙普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TYAGI, RISHABH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥格拉斯　大衛　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCGRATH, DAVID S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施方案中，一種對一低頻率效應(LFE)聲道進行編碼之方法包括：接收一時域LFE聲道信號；使用一低通濾波器對該時域LFE聲道信號進行濾波；將經濾波之該時域LFE聲道信號轉換成該LFE聲道信號的包括表示該LFE聲道信號之一頻譜之一定數目個係數之一頻域表示；將係數配置至與該LFE聲道信號之不同頻帶對應之一定數目個次頻帶群組中；根據該低通濾波器之一頻率回應曲線將每一次頻帶群組中之係數量化；使用針對該次頻帶群組調諧之一熵寫碼器對每一次頻帶群組中之該等經量化係數進行編碼；及產生包含經編碼之該等經量化係數之一位元串流；及將該位元串流儲存於一儲存裝置上或將該位元串流串流傳輸至一下游裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some implementations, a method of encoding a low-frequency effect (LFE) channel comprises: receiving a time-domain LFE channel signal; filtering, using a low-pass filter, the time-domain LFE channel signal; converting the filtered time-domain LFE channel signal into a frequency-domain representation of the LFE channel signal that includes a number of coefficients representing a frequency spectrum of the LFE channel signal; arranging coefficients into a number of subband groups corresponding to different frequency bands of the LFE channel signal; quantizing coefficients in each subband group according to a frequency response curve of the low-pass filter; encoding the quantized coefficients in each subband group using an entropy coder tuned for the subband group; and generating a bitstream including the encoded quantized coefficients; and storing the bitstream on a storage device or streaming the bitstream to a downstream device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:沉浸式聲音與音訊服務編碼解碼器</p>  
        <p type="p">101:音訊資料</p>  
        <p type="p">102:空間分析與降混單元</p>  
        <p type="p">103:主音訊聲道編碼單元/主音訊聲道編碼器</p>  
        <p type="p">104:空間後設資料編碼單元</p>  
        <p type="p">105:低頻率效應聲道編碼單元</p>  
        <p type="p">106:空間後設資料解碼單元</p>  
        <p type="p">107:主音訊聲道解碼單元</p>  
        <p type="p">108:低頻率效應聲道解碼單元</p>  
        <p type="p">109:空間合成/升混/呈現單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3072" publication-number="202628333"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628333.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降壓轉換器及其操作方法</chinese-title>  
        <english-title>BUCK CONVERTER AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">H02M3/156</main-classification>  
        <further-classification edition="200601120260330B">H02M1/08</further-classification>  
        <further-classification edition="200601120260330B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊詠竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種降壓轉換器，包括功率級、反饋網路、控制迴路、邏輯電路、驅動電路以及旁路檢測器。功率級包括輸入端及輸出端。反饋網路耦接於功率級，用以根據輸出電壓產生反饋電壓。控制迴路包括誤差放大器及比較器。誤差放大器用以通過比較參考電壓與反饋電壓來產生誤差電壓，比較器耦接於誤差放大器用以根據誤差電壓產生比較器信號。邏輯電路用以根據一組控制信號產生邏輯控制信號以實現控制方案。驅動電路用以根據邏輯控制信號驅動功率級。旁路檢測器用以將輸入電壓及預定閾值進行比較，並相應地產生旁路模式信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A buck converter includes a power stage, a feedback network, a control loop, a logic circuit, a driver circuit, and a bypass detector. The power stage includes an input terminal and an output terminal. The feedback network is coupled to the power stage and used to generate a feedback voltage according to the output voltage. The control loop includes an error amplifier and a comparator. The error amplifier is used to generate an error voltage by comparing a reference voltage with the feedback voltage. The comparator is coupled to the error amplifier and used to generate a comparator signal according to the error voltage. The logic circuit is used to generate a logic control signal to implement a control scheme according to a set of control signals. The driver circuit is used to drive the power stage according to the logic control signal. The bypass detector is used to compare the input voltage with a predetermined threshold and generate a bypass mode signal accordingly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:降壓轉換器</p>  
        <p type="p">110:功率級</p>  
        <p type="p">120:反饋網路</p>  
        <p type="p">130:控制迴路</p>  
        <p type="p">140:邏輯電路</p>  
        <p type="p">150:驅動電路</p>  
        <p type="p">160:旁路檢測器</p>  
        <p type="p">170:零電流檢測器</p>  
        <p type="p">180:導通時間產生器</p>  
        <p type="p">132:誤差放大器</p>  
        <p type="p">134:比較器</p>  
        <p type="p">162:過電流保護電路</p>  
        <p type="p">164:大電流檢測電路</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VFB:反饋電壓</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">VEAO:誤差放大器輸出電壓</p>  
        <p type="p">VLX:切換節點電壓</p>  
        <p type="p">VTH_IN:輸入電壓閾值</p>  
        <p type="p">VTH_OUT:輸出電壓閾值</p>  
        <p type="p">IL:輸出電流</p>  
        <p type="p">ILOAD:負載電流</p>  
        <p type="p">S1:第一開關</p>  
        <p type="p">S2:第二開關</p>  
        <p type="p">LOUT:輸出電感</p>  
        <p type="p">COUT:輸出電容</p>  
        <p type="p">SHYS:遲滯開關</p>  
        <p type="p">RBYP:旁路電阻</p>  
        <p type="p">RFB1,RFB2:反饋電阻</p>  
        <p type="p">CFF:前饋電容</p>  
        <p type="p">REAO:電阻</p>  
        <p type="p">CEAO:電容</p>  
        <p type="p">RLOAD:負載電阻</p>  
        <p type="p">dCOMP:比較器輸出信號</p>  
        <p type="p">LGC:邏輯控制信號</p>  
        <p type="p">dBYP_IN:旁路模式輸入信號</p>  
        <p type="p">dBYP_OUT:旁路模式輸出信號</p>  
        <p type="p">dSLP:睡眠模式信號</p>  
        <p type="p">TON:開啟時間信號</p>  
        <p type="p">dOCP:過電流保護信號</p>  
        <p type="p">dLCD:大電流信號</p>  
        <p type="p">EN_CMP:比較器啟用信號</p>  
        <p type="p">EN_BYP:旁路啟用信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3073" publication-number="202626542"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626542.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無鹼玻璃板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C03C3/091</main-classification>  
        <further-classification edition="202301120260318B">H10K50/00</further-classification>  
        <further-classification edition="200601120260318B">H05B33/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井未侑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, MAYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的無鹼玻璃板的特徵在於：玻璃組成中的Li&lt;sub&gt;2&lt;/sub&gt;O+Na&lt;sub&gt;2&lt;/sub&gt;O+K&lt;sub&gt;2&lt;/sub&gt;O的含量為0 mol%～0.5 mol%，楊氏模量為78 GPa以上，應變點為680℃以上，液相溫度為1450℃以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3074" publication-number="202627591"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627591.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">G02B9/60</main-classification>  
        <further-classification edition="200601120260318B">G02B13/18</further-classification>  
        <further-classification edition="200601120260318B">G02B15/14</further-classification>  
        <further-classification edition="202101120260318B">G03B17/12</further-classification>  
        <further-classification edition="202301120260318B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宰赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, JAE HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炳賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁召渼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SO MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括自物側設置的第一透鏡、第二透鏡、第三透鏡、第四透鏡及第五透鏡，其中所述第三透鏡具有正的折射力。在所述光學成像系統中，0.2 ＜ (D23+D34+D45)/BFL ＜ 0.95且0.8 ＜ TTL/f ＜ 0.95，其中D23是自所述第二透鏡的像側表面至所述第三透鏡的物側表面的距離，D34是自所述第三透鏡的像側表面至所述第四透鏡的物側表面的距離，D45是自所述第四透鏡的像側表面至所述第五透鏡的物側表面的距離，BFL是自所述第五透鏡的像側表面至成像平面的距離，TTL是自所述第一透鏡的物側表面至所述成像平面的距離，且f是所述光學成像系統的焦距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens having positive refractive power, a fourth lens, and a fifth lens disposed from an object side. In the optical imaging system, 0.2 ＜ (D23+D34+D45)/BFL ＜ 0.95 and 0.8 ＜ TTL/f ＜ 0.95, where D23 is a distance from an image-side surface of the second lens to an object-side surface of the third lens, D34 is a distance from an image-side surface of the third lens to an object-side surface of the fourth lens, D45 is a distance from an image-side surface of the fourth lens to an object-side surface of the fifth lens, BFL is a distance from an image-side surface of the fifth lens to an imaging plane, TTL is a distance from an object-side surface of the first lens to the imaging plane, and f is a focal length of the optical imaging system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">IF:濾波器</p>  
        <p type="p">ImgHT:成像平面的高度</p>  
        <p type="p">IP:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3075" publication-number="202626541"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626541.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無鹼玻璃板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C03C3/076</main-classification>  
        <further-classification edition="200601120260326B">C03C3/083</further-classification>  
        <further-classification edition="200601120260326B">C03C3/085</further-classification>  
        <further-classification edition="200601120260326B">C03C3/087</further-classification>  
        <further-classification edition="200601120260326B">C03C3/089</further-classification>  
        <further-classification edition="200601120260326B">C03C3/093</further-classification>  
        <further-classification edition="200601120260326B">C03C3/095</further-classification>  
        <further-classification edition="200601120260326B">C03B5/23</further-classification>  
        <further-classification edition="200601120260326B">C03B18/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虫明篤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSHIAKE, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斉藤敦己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, ATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的無鹼玻璃板的特徵在於：作為玻璃組成，以莫耳%計而含有55%～80%的SiO&lt;sub&gt;2&lt;/sub&gt;、10%～25%的Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、0%～4%的B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、0%～30%的MgO、0%～25%的CaO、0%～15%的SrO、0%～15%的BaO、0%～5%的ZnO、0%～未滿1.0%的Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;+La&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;，實質不含鹼金屬氧化物，且應變點為750℃以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3076" publication-number="202626983"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626983.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非均勻剛性桿網狀物</chinese-title>  
        <english-title>HETEROGENEOUS RIGID ROD NETWORKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260326B">C09D11/52</main-classification>  
        <further-classification edition="200601120260326B">H01B1/22</further-classification>  
        <further-classification edition="200601120260326B">H01B1/24</further-classification>  
        <further-classification edition="201101120260326B">B82Y30/00</further-classification>  
        <further-classification edition="200601120260326B">C03C17/22</further-classification>  
        <further-classification edition="201701120260326B">C01B32/174</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商奈米　Ｃ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANO-C, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瓦拉傑　拉米許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIVARAJAN, RAMESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇　梅莉莎　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICCI, MELISSA J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里西　科琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TREACY, COLLEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維珍斯　維塔爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEJINS, VIKTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由各種方法來形成非均勻、剛性桿樣顆粒、例如金屬奈米線及碳奈米管之交錯隨機網狀物。所得組合提供獨特的且藉由任一個別組分自身無法獲得之特性。在一實施例中，藉由施加來自單獨來源之剛性桿組分在熱輥主表面上連續形成該等非均勻網狀物且將該後形成網狀物完全或部分地轉移至與該主表面直接接觸之移動網之接收表面上。在另一實施例中，藉由施加調配物在該主表面或熱輥上形成該等非均勻網狀物，該等調配物係非均勻、剛性桿樣顆粒在共用溶劑中之共穩定分散液。在又一實施例中，藉由使該接收表面與一個以上該主表面或熱輥接觸來形成該等非均勻網狀物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Interlaced random networks of heterogeneous, rigid rod like particles such as metallic nanowires and carbon nanotubes are formed by various methods. The resulting combination provides characteristics that are unique and not attainable by either of the individual components on their own. In one of the embodiments, such heterogeneous networks are continuously formed on a master hot roller surface by application of the rigid rod components from separate sources and the post formed network is transferred fully or partially onto a receptor surface of a moving web directly in-contact with the master surface. In another embodiment the heterogenous networks are formed on the said master surface or hot roller by applying formulations that are co-stabilized dispersions of heterogeneous, rigid rod like particles in a common solvent. In yet another embodiment, such heterogeneous networks are formed by contacting the receptor surface with more than one such master surface or hot roller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:熱輥表面</p>  
        <p type="p">110:紅外加熱燈</p>  
        <p type="p">120:紅外加熱燈</p>  
        <p type="p">130:噴頭</p>  
        <p type="p">140:共用溶劑</p>  
        <p type="p">150:移動網</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3077" publication-number="202628070"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628070.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115107997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>穿戴式裝置及訊號處理方法</chinese-title>  
        <english-title>WEARABLE DEVICE AND SIGNAL PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260316B">G10K11/178</main-classification>  
        <further-classification edition="202601120260316B">H04R1/10</further-classification>  
        <further-classification edition="200601120260316B">H04R1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商知微電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XMEMS LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　振宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, JEMM YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　希聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種穿戴式裝置，包含有一聲音產生裝置及一聲音感測裝置。該聲音產生裝置在發出聲音時產生一前向放射波及一後向放射波。該聲音感測裝置設置於一節點位置，該前向放射波及該後向放射波在該節點位置上互相抵消。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The wearable device includes a sound producing device and a sound sensing device. The sound producing device produces a front radiating wave and a back radiating wave while producing the sound. The sound sensing device is disposed on a nodal position where the front radiating wave and the back radiating wave cancel each other on the nodal position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:穿戴式裝置</p>  
        <p type="p">101:前腔</p>  
        <p type="p">102:聲音產生裝置</p>  
        <p type="p">103:前端</p>  
        <p type="p">104:後腔</p>  
        <p type="p">105:殼體</p>  
        <p type="p">106:後端</p>  
        <p type="p">107:聲音感測裝置</p>  
        <p type="p">108:後通道</p>  
        <p type="p">109:前通道</p>  
        <p type="p">110:耳孔</p>  
        <p type="p">D103,D106:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3078" publication-number="202627277"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627277.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>收容裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">E05B41/00</main-classification>  
        <further-classification edition="200601120260325B">E05B63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東海理研股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKAI RIKEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤明広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅村正美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEMURA, MASAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬木信彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGI, NOBUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂上晃一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGAMI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種置物櫃裝置1，包括：收容部10，可收容行李；門12，用於進行收容部10的開閉；上鎖裝置20，可進行從將門12上鎖的上鎖狀態切換至將門12解鎖的解鎖狀態的第一切換動作和從解鎖狀態切換至上鎖狀態的第二切換動作；操作部30，受理使用者的操作；以及控制裝置51，根據操作部30的操作來控制上鎖裝置20；其中，收容部10包括在收容部10內未收容有行李的狀態下待機的待機模式和在收容部10內收容有行李的狀態下待機的收存模式，待機模式中，門12為上鎖狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:置物櫃裝置(收容裝置的一例)</p>  
        <p type="p">2:置物櫃結構體</p>  
        <p type="p">10:收容部</p>  
        <p type="p">11:框</p>  
        <p type="p">12:門</p>  
        <p type="p">20:上鎖裝置</p>  
        <p type="p">30:操作部</p>  
        <p type="p">32:顯示部</p>  
        <p type="p">38:印表機</p>  
        <p type="p">40:IC卡讀卡器</p>  
        <p type="p">122:把手</p>  
        <p type="p">A:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3079" publication-number="202626645"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626645.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108082</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>４－胺基－咪唑并喹啉化合物及其用途</chinese-title>  
        <english-title>4-AMINO-IMIDAZOQUINOLINE COMPOUNDS AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260317B">C07D471/04</main-classification>  
        <further-classification edition="200601120260317B">A61K31/437</further-classification>  
        <further-classification edition="200601120260317B">A61P35/00</further-classification>  
        <further-classification edition="200601120260317B">A61P37/00</further-classification>  
        <further-classification edition="200601120260317B">A61P31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩摩亞商駿達貿易有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIME REACH TRADING LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>WS</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周友誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種4-胺基咪唑并喹啉化合物及其用途。本發明化合物為類鐸受體7(Toll-like receptor 7)(TLR7)與TLR8雙重促效劑，其具有誘發IL-12與IP-10表現之活性，但不過度誘發IL-6。TLR 7/8雙重促效劑有潛力適用為免疫反應調節劑之醫藥。並揭示以根據本發明化合物或其鹽於製造醫藥之用途，用於為有此需要之個體治療可因活化TLR7及/或TLR8而提供效益之疾病或病症。亦揭示一種化合物或醫藥組成物，用於為有此需要之個體治療病毒感染、癌症、及/或過敏性疾病，或用於活化可有效對抗病毒感染、腫瘤、及/或過敏性疾病之免疫反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">4-Amino-imidazoquinoline compounds and use thereof are disclosed. The compounds of the invention are Toll-like receptor 7 (TLR7) and TLR8 dual agonists, which exhibit activities in inducing IL-12 and IP-10 expression without over-inducing IL-6. The TLR 7/8 dual agonists are potentially useful medications as immune response modifiers. Use of a compound or salt thereof according to the invention in the manufacture of a medicament for treating a disease or a condition wherein activation of TLR7 and/or TLR8 provides a benefit in a subject in need thereof is disclosed. A compound or a pharmaceutical composition for use in treating a viral infection, cancer, and/or an allergic disease, or for use in activating immune responses that are effective against a viral infection, a tumor, and/or an allergic disease in a subject in need thereof is also disclosed.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3080" publication-number="202626907"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626907.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>再生樹脂之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C08J11/08</main-classification>  
        <further-classification edition="200601120260327B">B29B17/02</further-classification>  
        <further-classification edition="200601120260327B">B04B1/08</further-classification>  
        <further-classification edition="200601120260327B">C07C19/03</further-classification>  
        <further-classification edition="202301120260327B">C02F1/38</further-classification>  
        <further-classification edition="200601320260327B">B29K69/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白武宗憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRATAKE, MUNENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石裕人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZUKA, HIROHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木祐梨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, YURI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水英貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, HIDETAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀越裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIKOSHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供自包含合成樹脂及有機雜質之廢樹脂組成物製造再生樹脂之方法。 &lt;br/&gt;　　本發明之製造方法係自廢樹脂組成物製造再生樹脂之方法，包含使前述廢樹脂組成物與1~30質量%之鹽水接觸而獲得再生樹脂組成物之步驟(a1)，及以水洗淨前述再生樹脂組成物而獲得再生樹脂的步驟(b1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3081" publication-number="202626077"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626077.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阿魏醯基腐胺用於製備提升睡眠質量組合物的用途</chinese-title>  
        <english-title>USES OF N-FERULOYLPUTRESCIN IN PREPARING COMPOSITION FOR IMPROVING SLEEP QUALITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K36/185</main-classification>  
        <further-classification edition="200601120260401B">A61P25/20</further-classification>  
        <further-classification edition="201601120260401B">A23L33/105</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大江生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TCI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詠翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴柏穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, MARGARET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煥祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUAN-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種阿魏醯基腐胺的用途，用於製備提升睡眠質量組合物，其中阿魏醯基腐胺是以水為溶劑提取自西番蓮（&lt;i&gt;Passiflora edulis&lt;/i&gt;）的種子及包覆在種子外的假種皮。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A use of N-Feruloylputrescin in preparing a composition for improving sleep quality, wherein the N-Feruloylputrescin is extracted with aqueous solvents from the seeds of the &lt;i&gt;Passiflora edulis&lt;/i&gt; and the aril cover out of the seeds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S10,S20,S30,S40,S410:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3082" publication-number="202626368"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626368.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>前面板、光學積層體及影像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">B32B27/30</main-classification>  
        <further-classification edition="200601120260327B">G09F9/00</further-classification>  
        <further-classification edition="202301120260327B">H10K59/00</further-classification>  
        <further-classification edition="202301120260327B">H10K50/00</further-classification>  
        <further-classification edition="200601120260327B">H05B33/02</further-classification>  
        <further-classification edition="200601120260327B">B32B17/10</further-classification>  
        <further-classification edition="201901120260327B">B32B7/023</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淵田岳仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUCHIDA, TAKEHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙洪賛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HONG CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">前面板朝厚度方向依序具備保護樹脂層與硬塗層。保護樹脂層的折射率與硬塗層的折射率之差Δ為0.04以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機EL顯示裝置</p>  
        <p type="p">2:光學積層體</p>  
        <p type="p">3:影像顯示構件</p>  
        <p type="p">4:前面板</p>  
        <p type="p">5:偏光薄膜</p>  
        <p type="p">6:保護構件</p>  
        <p type="p">7:基板</p>  
        <p type="p">8:黏著層</p>  
        <p type="p">9:第1黏著層</p>  
        <p type="p">10:第2黏著層</p>  
        <p type="p">11:第3黏著層</p>  
        <p type="p">12:保護樹脂層</p>  
        <p type="p">13:硬塗層</p>  
        <p type="p">14:第2硬塗層</p>  
        <p type="p">15:導電層</p>  
        <p type="p">16:遮蔽層</p>  
        <p type="p">17:偏光件保護薄膜</p>  
        <p type="p">18:偏光件</p>  
        <p type="p">19:光學補償層</p>  
        <p type="p">20:感測器電極部</p>  
        <p type="p">21:非顯示區域</p>  
        <p type="p">22:顯示區域</p>  
        <p type="p">25:撓曲部</p>  
        <p type="p">27:邊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3083" publication-number="202626453"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626453.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隱形眼鏡包裝盒及其打開方法</chinese-title>  
        <english-title>CONTACT LENS PACKAGES AND METHODS OF OPENING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B65D85/38</main-classification>  
        <further-classification edition="200601120260325B">A45C11/04</further-classification>  
        <further-classification edition="200601120260325B">B65D75/32</further-classification>  
        <further-classification edition="200601120260325B">B65D3/12</further-classification>  
        <further-classification edition="200601120260325B">G02C13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普威　山姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POPWELL, SAM JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安賽爾　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANSELL, SCOTT F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華德　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARD, DANIEL GRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山姆斯　斯蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMS, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈尼　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONEY, WILLIAM STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿克蘭　伊斯梅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKRAM, ISMAIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種改良的隱形眼鏡包裝盒。該包裝盒經組態使得在藉由配戴者打開包裝盒時，包裝溶液自隱形眼鏡排出並且實質上被收回於蓋中。鏡片包裝盒亦可包括鏡片支撐件，其促進單一觸碰轉移或一有色區域，該有色區域向一配戴者在視覺上指示在何處固持該包裝盒以供打開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to improved contact lens packages. The package may be configured such that upon opening the package by a wearer the packaging solution drains away from the contact lens and is substantially recaptured in the lid. Lens packages also may include a lens support that facilitates single touch transfer or a colored region that visually indicates to a wearer where to hold the package for opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:抓握構件</p>  
        <p type="p">110:打開突片、蓋</p>  
        <p type="p">112:蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3084" publication-number="202628924"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628924.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理設備</chinese-title>  
        <english-title>APPARATUS FOR PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P72/70</main-classification>  
        <further-classification edition="202601120260325B">H10P72/00</further-classification>  
        <further-classification edition="200601120260325B">B05B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DAESOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金俊永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUN YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李智勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車相允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHA, SANG YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種基板處理設備包含：腔體；在腔體中支撐至少一個基板的基板支撐單元；設置在基板支撐單元之上的底板；以及設置在底板之上的頂板，其中頂板包含提供第一氣體的第一噴射孔以及提供第二氣體的第二噴射孔，並且底板包含設置在第一噴射孔下的第一開口以允許從第一噴射孔提供的第一氣體通過第一開口，以及設置在第二噴射孔下的第二開口以允許從第二噴射孔提供的第二氣體通過第二開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a substrate processing apparatus including: a chamber; a substrate supporting unit supporting at least one substrate in the chamber; a lower plate disposed over the substrate supporting unit; and an upper plate disposed over the lower plate, wherein the upper plate includes a first injection hole providing a first gas and a second injection hole providing a second gas, and the lower plate includes a first opening disposed under the first injection hole to allow the first gas provided from the first injection hole to pass through the first opening, and a second opening disposed under the second injection hole to allow the second gas provided from the second injection hole to pass through the second opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">SH:供應孔</p>  
        <p type="p">BS:緩衝空間</p>  
        <p type="p">1:基板處理設備</p>  
        <p type="p">4:氣體噴射單元</p>  
        <p type="p">41:頂板</p>  
        <p type="p">41a:底面</p>  
        <p type="p">42:底板</p>  
        <p type="p">42a:頂面</p>  
        <p type="p">43:分隔空間</p>  
        <p type="p">100:製程空間</p>  
        <p type="p">411:第一噴射孔</p>  
        <p type="p">412:第二噴射孔</p>  
        <p type="p">421:第一開口</p>  
        <p type="p">422:第二開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3085" publication-number="202628077"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628077.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108363</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音訊處理單元與音訊處理的方法</chinese-title>  
        <english-title>AUDIO PROCESSING UNIT AND METHOD FOR AUDIO PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120260330B">G10L19/16</main-classification>  
        <further-classification edition="201301120260330B">G10L19/002</further-classification>  
        <further-classification edition="201301120260330B">G10L19/008</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商杜比實驗室特許公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊德米勒　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIEDMILLER, JEFFREY C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃德　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARD, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種音訊處理單元，包含緩衝記憶體，其儲存經編碼的音訊位元流的一部分，其中該經編碼的音訊位元流被分割成訊框，且至少一個訊框在該至少一個訊框的元資料區段中包含節目資訊元資料，而在該至少一個訊框的另一個區段中包含音訊資料，以及處理次系統，其耦接到該緩衝記憶體，其中該處理次系統係配置以將該經編碼的音訊位元流解碼，其中該元資料區段包含至少一個元資料酬載，該元資料酬載包含信頭，以及該節目資訊元資料中的至少一些，其在該信頭之後。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An audio processing unit, including a buffer memory that stores a portion of an encoded audio bitstream, wherein the encoded audio bitstream is segmented into frames and at least one frame includes program information metadata in a metadata segment of the at least one frame and audio data in another segment of the at least one frame, and a processing subsystem coupled to the buffer memory, wherein the processing subsystem is configured to decode the encoded audio bitstream, wherein the metadata segment includes at least one metadata payload, said metadata payload comprising a header, and after the header, at least some of the program information metadata.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:解碼器</p>  
        <p type="p">201:訊框緩衝器</p>  
        <p type="p">202:音訊解碼器</p>  
        <p type="p">203:音訊狀態驗證器</p>  
        <p type="p">204:控制位元產生器</p>  
        <p type="p">205:剖析器</p>  
        <p type="p">300:後處理器</p>  
        <p type="p">301:訊框緩衝器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3086" publication-number="202626543"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626543.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有Ｋ２Ｏ的顯示器玻璃</chinese-title>  
        <english-title>K2O-CONTAINING DISPLAY GLASSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C03C3/091</main-classification>  
        <further-classification edition="200601120260327B">G09F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米契爾　亞利桑卓賴清高安德魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITCHELL, ALEXANDRA LAI CHING KAO ANDREWS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種玻璃組成物，包括：約60莫耳%至約80莫耳%的SiO&lt;sub&gt;2&lt;/sub&gt;、0莫耳%至約11莫耳%的Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、約4.0莫耳%至約12莫耳%的B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、約0.5莫耳%至約20莫耳%的K&lt;sub&gt;2&lt;/sub&gt;O、0莫耳%至約18.5莫耳%的MgO及0莫耳%至約1莫耳%的SnO&lt;sub&gt;2&lt;/sub&gt;。玻璃組成物具有CTE，可基於組成物來調整所述CTE，且所述玻璃組成物可用於顯示應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass composition includes about 60 mol. % to about 80 mol. % SiO&lt;sub&gt;2&lt;/sub&gt;, 0 mol. % to about 11 mol. % Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;, about 4.0 mol. % to about 12 mol. % B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;, about 0.5 mol. % to about 20 mol. % of K&lt;sub&gt;2&lt;/sub&gt;O, 0 mol. % to about 18.5 mol. % MgO, and 0 mol. % to about 1 mol. % SnO&lt;sub&gt;2&lt;/sub&gt;. The glass composition has a range of CTE, which can be adjusted based on the composition, and can be used for display applications.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3087" publication-number="202626855"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626855.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性組成物、蓄熱材及物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C08G65/332</main-classification>  
        <further-classification edition="200601120260326B">C08G65/48</further-classification>  
        <further-classification edition="200601120260326B">C08F290/06</further-classification>  
        <further-classification edition="200601120260326B">C08L71/02</further-classification>  
        <further-classification edition="200601120260326B">C09K5/06</further-classification>  
        <further-classification edition="200601120260326B">F28D20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森本剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古川直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横田弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOTA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種硬化性組成物，含有下述式（1）所表示的化合物、以及選自由聚烷二醇單醚及聚烷二醇二醚所組成的群組中的至少一種聚烷二醇醚。 &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="239px" width="327px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;式（1）中，R&lt;sup&gt;11&lt;/sup&gt;及R&lt;sup&gt;12&lt;/sup&gt;分別獨立地表示氫原子或甲基，R&lt;sup&gt;13&lt;/sup&gt;表示具有聚氧伸烷基鏈的二價基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3088" publication-number="202626544"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626544.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含氧化釔的玻璃基板</chinese-title>  
        <english-title>YTTRIA-CONTAINING GLASS SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">C03C3/095</main-classification>  
        <further-classification edition="200601120260320B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛羅斯　提摩西麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROSS, TIMOTHY MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米契爾　亞利桑卓賴清高安德魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITCHELL, ALEXANDRA LAI CHING KAO ANDREWS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種玻璃基板，包括：約45莫耳%至約70莫耳%的SiO&lt;sub&gt;2&lt;/sub&gt;、約15莫耳%至約30莫耳%的Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、約7莫耳%至約20莫耳%的Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;及視情況0莫耳%至約9莫耳%的La&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;。所述玻璃基板具有高模數及破壞韌性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A glass substrate includes about 45 mol% to about 70 mol % SiO&lt;sub&gt;2&lt;/sub&gt;, about 15 mol % to about 30 mol% Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;, about 7 mol% to about 20 mol% of Y&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;, and optionally 0 mol% to about 9 mol% of La&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;. The glass substrate has high modulus and fracture toughness.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3089" publication-number="202626420"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626420.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>卡座組件及輪式移動裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">B62B9/12</main-classification>  
        <further-classification edition="200601120260318B">B62B7/14</further-classification>  
        <further-classification edition="200601120260318B">B62B7/08</further-classification>  
        <further-classification edition="200601120260318B">B62B9/18</further-classification>  
        <further-classification edition="200601120260318B">B62B5/00</further-classification>  
        <further-classification edition="200601120260318B">F16F9/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商居佳國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭征文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, ZHENGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳英忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YINGZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁家良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, JIALIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘知仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, ZHIREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種卡座組件及輪式移動裝置。卡座組件包括：座板總成，用於將物體放置於其上；鎖定機構，包括至少一個鎖定件；所述至少一個鎖定件設置於所述座板總成並能夠在第一鎖定位置和第一釋鎖位置之間滑動；當所述鎖定件處於所述第一鎖定位置時，所述鎖定件能夠鎖定所述物體；當所述鎖定件處於所述第一釋鎖位置時，所述鎖定件能夠釋鎖所述物體。輪式移動裝置包括上述的卡座組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:卡座組件</p>  
        <p type="p">21:鎖定機構</p>  
        <p type="p">211:鎖定件</p>  
        <p type="p">211A:第一鎖定件</p>  
        <p type="p">211B:第二鎖定件</p>  
        <p type="p">212:釋鎖操作件</p>  
        <p type="p">225:滑動件</p>  
        <p type="p">24:彈性裝置</p>  
        <p type="p">251:第一連桿</p>  
        <p type="p">25:聯動組件</p>  
        <p type="p">252:第二連桿</p>  
        <p type="p">253:第三連桿</p>  
        <p type="p">254:第四連桿</p>  
        <p type="p">257:聯動裝置</p>  
        <p type="p">27:聯動件</p>  
        <p type="p">271:牽引件</p>  
        <p type="p">A1:樞軸</p>  
        <p type="p">A2:樞軸</p>  
        <p type="p">F1:橫向方向、第一方向</p>  
        <p type="p">F2:縱向方向、第二方向</p>  
        <p type="p">M5:縱向中心線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3090" publication-number="202626610"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626610.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可離子化脂質及其用途</chinese-title>  
        <english-title>IONIZABLE LIPIDS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D231/12</main-classification>  
        <further-classification edition="200601120260401B">C07D403/06</further-classification>  
        <further-classification edition="200601120260401B">C07D413/06</further-classification>  
        <further-classification edition="200601120260401B">C07D401/06</further-classification>  
        <further-classification edition="200601120260401B">C07D233/64</further-classification>  
        <further-classification edition="200601120260401B">C07D241/04</further-classification>  
        <further-classification edition="200601120260401B">C07D211/44</further-classification>  
        <further-classification edition="200601120260401B">C07D233/56</further-classification>  
        <further-classification edition="200601120260401B">C07D249/04</further-classification>  
        <further-classification edition="202501120260401B">A61K9/127</further-classification>  
        <further-classification edition="200601120260401B">A61K9/51</further-classification>  
        <further-classification edition="200601120260401B">A61K31/7088</further-classification>  
        <further-classification edition="200601120260401B">A61K47/24</further-classification>  
        <further-classification edition="200601120260401B">A61K47/28</further-classification>  
        <further-classification edition="200601120260401B">A61K47/10</further-classification>  
        <further-classification edition="200601120260401B">A61K48/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商綠十字股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREEN CROSS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泫姃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, HYUN JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫智娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JI YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘在榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAN, JAE YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜善姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SUN HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴俊英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JOON YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金智媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JEE WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李定恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNG-EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種由式(I)表示之新穎可離子化脂質化合物或其鹽及含有該可離子化脂質化合物或其鹽之脂質奈米粒子。含有根據本發明之新穎的可離子化脂質化合物之脂質奈米粒子具有優異核酸囊封效率且具有核酸之細胞遞送的高效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a novel ionizable lipid compound represented by Formula (I) or a salt thereof, and a lipid nanoparticle containing the same. The lipid nanoparticle containing the novel ionizable lipid compound according to the present invention has an excellent nucleic acid encapsulation efficiency and has a high efficiency of cellular delivery of nucleic acid.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3091" publication-number="202626417"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626417.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車把組件及兒童載具</chinese-title>  
        <english-title>HANDLEBAR COMPONENTS AND CHILD CARRIERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B62B7/06</main-classification>  
        <further-classification edition="200601120260325B">B62K15/00</further-classification>  
        <further-classification edition="200601120260325B">B62K21/16</further-classification>  
        <further-classification edition="200601120260325B">B62K9/02</further-classification>  
        <further-classification edition="200601120260325B">B62M3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘知仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, ZHIREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種車把組件，包括：至少兩個車把本體，具有多個使用高度；及第一同步機構，設於至少兩個所述車把本體之間；其中，至少兩個所述車把本體可通過所述第一同步機構在不同的使用高度間同步切換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A handle component comprises: at least two handlebar bodies having a plurality of use heights; and a first synchronizing mechanism disposed between the at least two handlebar bodies; wherein the at least two handlebar bodies are concurrently switchable between different use heights via the first synchronizing mechanism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:前車輪</p>  
        <p type="p">40:後車輪</p>  
        <p type="p">100:車架</p>  
        <p type="p">110:第一架體</p>  
        <p type="p">111:連桿部</p>  
        <p type="p">112:第一連接部</p>  
        <p type="p">120:第二架體</p>  
        <p type="p">130:連動機構</p>  
        <p type="p">131:第一連接架</p>  
        <p type="p">132:第二連接架</p>  
        <p type="p">150:釋鎖組件</p>  
        <p type="p">152:提把</p>  
        <p type="p">180:座椅組件</p>  
        <p type="p">230:車把組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3092" publication-number="202628764"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628764.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260325B">H10K59/126</main-classification>  
        <further-classification edition="202301120260325B">H10K59/80</further-classification>  
        <further-classification edition="202301120260325B">H10K50/858</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李京鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KEONGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文洪萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HONG-MAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玄周奉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYUN, JOO BONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金昭娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SO YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種包含有多個發光裝置的顯示裝置。這些發光裝置設置於基板上。第一絕緣層設置於發光裝置上。多個透鏡，位於第一絕緣層上。這些透鏡設置為分別對應於發光裝置。第一遮光圖案，位於基板與第一絕緣層之間。第一遮光圖案對應於發光裝置間之一區域。第二遮光圖案設置於第一絕緣層上。第二遮光圖案與第一遮光圖案重疊。第一遮光圖案包含中心部分及圍繞此中心部分之邊緣部分。此邊緣部分相對於中心部分傾斜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device including a plurality of light-emitting devices is provided. The plurality of the light-emitting devices may be disposed on a substrate. A first insulating layer may be disposed on the plurality of light-emitting devices. Lenses may be disposed on the first insulating layer. The lenses may be disposed to respectively correspond to the plurality of light-emitting devices. A first light-shielding pattern may be disposed between the substrate and the first insulating layer. The first light-shielding pattern may be disposed to correspond to an area between the plurality of light-emitting devices. A second light-shielding pattern may be disposed on the first insulating layer. The second shielding pattern may overlap the first light-shielding pattern. The second light-shielding pattern may include a central portion and an edge portion disposed around the central portion. The edge portion may be inclined with respect to the central portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:發光陣列</p>  
        <p type="p">110:基板</p>  
        <p type="p">170a:發光裝置</p>  
        <p type="p">180:封裝層</p>  
        <p type="p">220:第一絕緣層</p>  
        <p type="p">220a:上表面</p>  
        <p type="p">220b:側面</p>  
        <p type="p">210:第一遮光圖案</p>  
        <p type="p">230:第二遮光圖案</p>  
        <p type="p">240:透鏡</p>  
        <p type="p">250:平面化層</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W2:第二寬度</p>  
        <p type="p">θ1:第一角度</p>  
        <p type="p">θ2:第二角度</p>  
        <p type="p">CVA:凸起區域</p>  
        <p type="p">FA:平坦區域</p>  
        <p type="p">OA:開放區域</p>  
        <p type="p">NOA:非開放區域</p>  
        <p type="p">A1:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3093" publication-number="202626419"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626419.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童載具</chinese-title>  
        <english-title>CHILD CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B62B9/08</main-classification>  
        <further-classification edition="200601120260331B">B62B9/20</further-classification>  
        <further-classification edition="200601120260331B">B62B7/04</further-classification>  
        <further-classification edition="200601120260331B">B62B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭征文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, ZHENG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪爾學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ER XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡守鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHOUFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫明星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, MINGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陰洪濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, HONGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兒童載具，包括：相樞接之車架本體和車手，車手可相對車架本體轉動；第一鎖定件，可移動地設置於車架本體中；第二鎖定件，可移動地設置於車架本體中；第一連動機構，設置於車架本體並與第一鎖定件連接；第二連動機構，設置於車架本體並與第二鎖定件連接；以及釋鎖機構，可操作地驅動第一連動機構或第二連動機構，從而解除第一鎖定件或第二鎖定件的鎖定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child carrier includes a standing frame and a handle frame pivotally connected to each other, the handle frame being rotatable relative to the standing frame; a first locking element movably disposed in the standing frame; a second locking element movably disposed in the standing frame; a first linking mechanism disposed on the standing frame and connected to the first locking element; a second linking mechanism disposed on the standing frame and connected to the second locking element; and a release mechanism operably driving the first linking mechanism or the second linking mechanism to unlock the first locking element or the second locking element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:兒童載具</p>  
        <p type="p">1:車架本體</p>  
        <p type="p">2:車手</p>  
        <p type="p">3:第一連動機構</p>  
        <p type="p">11:前輪座</p>  
        <p type="p">12:後輪座</p>  
        <p type="p">17:前輪</p>  
        <p type="p">18:後輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3094" publication-number="202628809"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628809.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大面積／晶圓級　ＣＭＯＳ　相容製程的二維材料插層摻雜，包括摻雜合成石墨烯的摻雜工具、製程與方法</chinese-title>  
        <english-title>LARGE-AREA/WAFER-SCALE CMOS-COMPATIBLE 2D-MATERIAL INTERCALATION DOPING TOOLS, PROCESSES, AND METHODS, INCLUDING DOPING OF SYNTHESIZED GRAPHENE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P32/12</main-classification>  
        <further-classification edition="200601120260318B">C23C16/26</further-classification>  
        <further-classification edition="200601120260318B">C23C16/48</further-classification>  
        <further-classification edition="200601120260318B">C30B25/04</further-classification>  
        <further-classification edition="200601120260318B">C30B25/10</further-classification>  
        <further-classification edition="200601120260318B">H01J37/317</further-classification>  
        <further-classification edition="200601120260318B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商迪斯尼２Ｄ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESTINATION 2D INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴納吉　考斯塔夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANERJEE, KAUSTAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊延加　拉維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYENGAR, RAVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德爾　薩提許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDAR, SATISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種插層摻雜裝置，包括：反應腔室，用於將單一或多數晶圓或基板置放在其內，並用於在所述反應腔室內對所述單一或多數晶圓或基板的至少一個表面施加在2巴至500巴範圍內的壓力，其中所述單一或多數晶圓或基板具有25 mm至450 mm的直徑或兩側邊距；加熱器，用於向所述單一或多數晶圓或基板施加熱能，使其包括25 ℃至500 ℃的溫度；以及摻雜劑施加裝置，至少包括將摻雜劑從外部帶至所述反應腔室內的閥門和管道，以及至少一個摻雜劑坩堝，設置在所述反應腔室內，其中所述摻雜劑包括處於固相、液相或氣相的材料，且包括插層摻雜劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intercalation doping apparatus including: a reactor chamber where single or multiple wafers or substrates (SoMWoSubs) are disposed within the reactor chamber, where SoMWoSubs have a diameter or a side distance from 25 mm to 450 mm; a heater, where the heater is configured to provide heat to the SoMWoSubs disposed within the reactor chamber, where the SoMWoSubs include a temperature from 25°C to 500°C; where pressure is applied to at least one surface of the SoMWoSubs disposed within the reactor chamber within a range of 2 bar to 500 bar; and a dopant application apparatus, where the dopant application apparatus includes at least valves and tubing which bring dopants from outside to within the reactor chamber and includes at least a dopant crucible disposed within the reactor chamber, where the dopants include material in solid, liquid, or gaseous phase, and where the dopants include intercalation doping agents.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:批次處理裝置</p>  
        <p type="p">102:反應腔室</p>  
        <p type="p">104:反應腔室門和密封件</p>  
        <p type="p">105:基板/晶圓</p>  
        <p type="p">106:槳葉</p>  
        <p type="p">108:摻雜劑處理氣體/霧氣入口</p>  
        <p type="p">110:全反應器處理室的內部空間</p>  
        <p type="p">112:多向高壓閥</p>  
        <p type="p">114:活塞室空間</p>  
        <p type="p">116:泵吹掃及加壓氣體</p>  
        <p type="p">118:加壓/排氣泵</p>  
        <p type="p">120:活塞運動軸</p>  
        <p type="p">122:活塞室</p>  
        <p type="p">124:螺線管或螺桿馬達</p>  
        <p type="p">126:活塞</p>  
        <p type="p">130:腔室側壁加熱器</p>  
        <p type="p">132:氣體3和4的額外設置</p>  
        <p type="p">134:腔室閥門</p>  
        <p type="p">140:氣體控制面板</p>  
        <p type="p">142:摻雜劑氣體混合區塊</p>  
        <p type="p">146:MFC(質量流量控制器)iso閥-輸出</p>  
        <p type="p">148:MFC(質量流量控制器)</p>  
        <p type="p">150:MFC iso閥-輸入</p>  
        <p type="p">152:氣體調節器</p>  
        <p type="p">154:顆粒過濾器</p>  
        <p type="p">156:摻雜劑1的氣瓶</p>  
        <p type="p">157:摻雜劑2的氣瓶</p>  
        <p type="p">158:無塵室氣體供應設施</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3095" publication-number="202627321"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627321.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防止錯位的滾輪式滑軌機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">F16C29/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州富齊林科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU FULFIL ACME TECHNOLOGY CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫忠憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種防止錯位的滾輪式滑軌機構，包括內軌、外軌以及設置在所述內軌上的滾輪；在內軌所在的兩外側位置分別開設有向外側敞開的定位槽，通過定位槽對滾輪形成固定，使滾輪所在的外沿突出內軌所在的外沿並相互平行，實現自轉動；滾輪所在的中心貫穿並向兩側突出有轉軸，使轉軸與定位槽僅形成軸向的轉動；外軌所在的截面呈現U型結構，實現內軌位於外軌所在的U型結構中心槽口內，使滾輪外沿貼合在外軌所在的中心槽口內壁滾動，從而帶動內軌與外軌產生軸線方向的相對移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:內軌</p>  
        <p type="p">12:第一鎖緊孔</p>  
        <p type="p">2:外軌</p>  
        <p type="p">21:第二鎖緊孔</p>  
        <p type="p">3:滾輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3096" publication-number="202626895"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626895.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光膜、偏光板、及該偏光膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C08J5/18</main-classification>  
        <further-classification edition="200601120260401B">C08F16/06</further-classification>  
        <further-classification edition="200601120260401B">G02B5/30</further-classification>  
        <further-classification edition="200601120260401B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高永幸佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAE, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上条卓史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIJO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川綠一葵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMIDORI, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種沿吸收軸方向之斷裂經抑制的偏光膜。本發明偏光膜係以含二色性物質之聚乙烯醇系樹脂薄膜構成。在一實施形態中，偏光膜於令單體透射率為x%、且令聚乙烯醇系樹脂之雙折射為y時，滿足下述式(1)。在一實施形態中，偏光膜於令單體透射率為x%、且令該聚乙烯醇系樹脂薄膜之面內相位差為znm時，滿足下述式(2)。在一實施形態中，偏光膜之厚度為10μm以下。本發明偏光板具有上述偏光膜與配置偏光膜之至少一側的保護層。&lt;br/&gt; y＜-0.011x+0.525　　　　　(1)&lt;br/&gt; z＜-60x+2875　　　　　　  (2)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:偏光膜</p>  
        <p type="p">20:第1保護層</p>  
        <p type="p">30:第2保護層</p>  
        <p type="p">100a,100b:偏光板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3097" publication-number="202627183"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627183.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基材處理系統</chinese-title>  
        <english-title>SUBSTRATE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">C23C16/455</main-classification>  
        <further-classification edition="200601120260318B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡達姆　尼丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADAM, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　亞倫　布萊克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, AARON BLAKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕蒂爾　納文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, NAVEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王塞納克運　潘亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONGSENAKHUM, PANYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布泰爾　戈倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUTAIL, GORUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯貝爾　思魯提</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMBARE, SHRUTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯林斯　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLLINS, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥德里格　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADRIGAL, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙堤雅德凡　曼局拿斯　亞曼納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATYADEVAN, MANJUNATH AMMANATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">將多個進料容積(CVs)用於在每一處理腔室供應反應物及惰性氣體以於基材上執行原子層沉積(ALD)。在劑量步驟期間可以高流動速率從兩個CVs供應一系列脈衝的反應物，從而延長劑量時間。於第一和第二淨化步驟可在相等起始壓力下從第一及第二CVs供應惰性氣體。加熱脈衝閥岐管(PVM)最小化於ALD期間從PVM供應至各別處理腔室之處理氣體的溫度變化。PVM在處理氣體進入各別的CVs之前在PVM中預熱處理氣體。PVM在CVs上方及下方包括額外的輔助加熱器以維持CVs內處理氣體的溫度。PVM可在執行維護之前快速地冷卻，從而減少停機時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Multiple charge volumes (CVs) are used to supply a reactant and an inert gas at each processing chamber to perform atomic layer deposition (ALD) on substrates. A series of pulses of the reactant can be supplied at a high flow rate from two CVs during a dose step, which extends dose time. The inert gas can be supplied at an equal starting pressure from first and second CVs at first and second purge steps. A heated pulse valve manifold (PVM) minimizes temperature variations of process gases supplied from the PVM to respective processing chamber during ALD. The PVM preheats the process gases before the process gases enter the respective CVs in the PVM. The PVM includes additional supplemental heaters above and below the CVs to maintain the temperature of the process gases within the CVs. The PVM can be rapidly cooled before performing maintenance, which reduces downtime.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3098" publication-number="202628702"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628702.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有增加的集成度的影像感測器</chinese-title>  
        <english-title>IMAGE SENSOR HAVING INCREASED INTEGRATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260316B">H10F39/12</main-classification>  
        <further-classification edition="202501120260316B">H10F77/14</further-classification>  
        <further-classification edition="202301120260316B">H04N25/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳暎究</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YOUNGGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳暎宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, YOUNGSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種影像感測器，包含半導體基底中的像素隔離結構。像素隔離結構界定多個像素區、像素區中的每一者上的半導體基底中的光電轉換區、位於半導體基底中且與光電轉換區間隔開的浮動擴散區。轉移閘極安置於像素區中的每一者上的光電轉換區與浮動擴散區之間。介電層安置於半導體基底上且覆蓋轉移閘極。彼此間隔開的多個主動圖案安置於介電層的頂表面上。多個像素電晶體安置於對應主動圖案上。在平面視圖中，主動圖案中的至少一者與像素隔離結構的一部分重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensor includes a pixel isolation structure in a semiconductor substrate. The pixel isolation structure defines a plurality of pixel regions, a photoelectric conversion region in the semiconductor substrate on each of the pixel regions, a floating diffusion region in the semiconductor substrate and spaced apart from the photoelectric conversion region. A transfer gate electrode is disposed between the photoelectric conversion region and the floating diffusion region on each of the pixel regions. A dielectric layer is disposed on the semiconductor substrate and covers the transfer gate electrode. A plurality of active patterns spaced apart from each other is disposed on a top surface of the dielectric layer. A plurality of pixel transistors is disposed on corresponding active patterns. In a plan view, at least one of the active patterns overlaps a portion of the pixel isolation structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光電轉換電路層</p>  
        <p type="p">20:像素電路層</p>  
        <p type="p">30:光傳輸層</p>  
        <p type="p">100:第一半導體基底</p>  
        <p type="p">100a:第一表面</p>  
        <p type="p">100b:第二表面</p>  
        <p type="p">110:光電轉換區</p>  
        <p type="p">111:襯裡介電圖案</p>  
        <p type="p">113:半導體圖案</p>  
        <p type="p">115:封蓋介電圖案</p>  
        <p type="p">120:第一介電層</p>  
        <p type="p">210:第二介電層</p>  
        <p type="p">220:內埋介電層</p>  
        <p type="p">230、240、250、260:層間介電層</p>  
        <p type="p">510:平坦化介電層</p>  
        <p type="p">520:柵格結構</p>  
        <p type="p">530:保護層</p>  
        <p type="p">540:彩色濾光片</p>  
        <p type="p">550:微透鏡</p>  
        <p type="p">560:鈍化層</p>  
        <p type="p">AP:主動圖案</p>  
        <p type="p">BS:接合表面</p>  
        <p type="p">FD:浮動擴散區</p>  
        <p type="p">GR:接地雜質區</p>  
        <p type="p">ML:導電線</p>  
        <p type="p">PG:像素閘極</p>  
        <p type="p">PIS:像素隔離結構</p>  
        <p type="p">PLG1:第一接觸插塞</p>  
        <p type="p">PLG2:第二接觸插塞</p>  
        <p type="p">PR:像素區</p>  
        <p type="p">PTR:像素電晶體</p>  
        <p type="p">SDR:源極/汲極區</p>  
        <p type="p">TG:轉移閘極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3099" publication-number="202627456"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627456.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108715</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝箱貨物檢驗系統及其方法</chinese-title>  
        <english-title>CASED GOODS INSPECTION SYSTEM AND METHOD THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G01N21/90</main-classification>  
        <further-classification edition="200601120260325B">B65B57/00</further-classification>  
        <further-classification edition="200601120260325B">G01B11/04</further-classification>  
        <further-classification edition="200601120260325B">G01B11/245</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商辛波提克加拿大公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYMBOTIC CANADA, ULC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽門　克莉絲汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMON, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉格爾　威廉恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEGARE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅塔利　塞米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METARI, SAMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜邁斯　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUMAIS, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種檢驗設備(用於裝箱貨物之檢驗)包括至少一輸送器、至少一相機，用於擷取利用該至少一輸送器而被推進通過該檢驗設備之各裝箱貨物的箱影像資料、及一處理器，組態成從該至少一相機接收該箱影像資料。該處理器被組態成從該箱影像資料將該裝箱貨物之一箱外部突出特徵化為在開狀況之一箱摺板，其中該處理器被組態成解析該箱影像資料並判定該箱外部突出為一一致平坦表面，且被編程以物理特性參數之一參數陣列，其描述判定界定一開箱摺板狀況之該一致平坦表面的箱摺板一致性屬性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inspection apparatus, for inspection of cased goods, includes at least one conveyor, at least one camera for capturing case image data of each of the cased goods advanced with the at least one conveyor past the inspection apparatus, and a processor configured to receive the case image data from the at least one camera. The processor is configured to characterize, from the case image data, a case exterior protrusion of the case good as a case flap in open condition, wherein the processor is configured to resolve the case image data and determine the case exterior protrusion is a coherent planar surface, and is programmed with a parameter array of physical characteristic parameters that describe case flap coherency attributes determinative of the coherent planar surface defining an open case flap condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝箱貨物檢驗系統</p>  
        <p type="p">101:檢驗系統開口</p>  
        <p type="p">102:產品/箱</p>  
        <p type="p">102E:箱外部</p>  
        <p type="p">102T:頂部側</p>  
        <p type="p">102L:橫向側</p>  
        <p type="p">102R:落後或「後」縱向側</p>  
        <p type="p">102F:領先側</p>  
        <p type="p">110:輸入輸送器</p>  
        <p type="p">110S,120S:輸送器座表面</p>  
        <p type="p">120:輸出輸送器</p>  
        <p type="p">150:視覺系統</p>  
        <p type="p">170:視覺系統</p>  
        <p type="p">170M:支柱</p>  
        <p type="p">171-173:感測器/成像裝置</p>  
        <p type="p">171L,172L,173L:雷射</p>  
        <p type="p">180:輪廓檢測系統</p>  
        <p type="p">181,184:感測器/成像裝置</p>  
        <p type="p">181C:相機</p>  
        <p type="p">181M:鏡子</p>  
        <p type="p">181D:漫射螢幕</p>  
        <p type="p">182,183:光源</p>  
        <p type="p">184C:相機</p>  
        <p type="p">184M:鏡子</p>  
        <p type="p">184D:漫射螢幕</p>  
        <p type="p">190:物流設施</p>  
        <p type="p">190SA:儲存陣列</p>  
        <p type="p">190ATV:自動運輸車</p>  
        <p type="p">190P:裝載器</p>  
        <p type="p">195:入站輸送器系統</p>  
        <p type="p">198:使用者介面</p>  
        <p type="p">199:控制器</p>  
        <p type="p">199A:物理特性參數</p>  
        <p type="p">199C:物理特性陣列</p>  
        <p type="p">199P:處理器</p>  
        <p type="p">199PC:結合器</p>  
        <p type="p">LS:塑光器</p>  
        <p type="p">GP:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3100" publication-number="202627549"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627549.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附相位差層之偏光板及圖像顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G02B5/30</main-classification>  
        <further-classification edition="201901120260325B">B32B7/023</further-classification>  
        <further-classification edition="200601120260325B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有賀草平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARUGA, SOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠謀求圖像顯示裝置中之斜方向之黑色亮度減少之附相位差層之偏光板及圖像顯示裝置。 &lt;br/&gt;本發明之附相位差層之偏光板具備：包含偏光元件之偏光板；及相鄰於上述偏光板配置之折射率特性顯示nx＞nz＞ny之關係之相位差層。上述偏光元件之吸收軸與上述相位差層之慢軸實質上平行或實質上正交。該附相位差層之偏光板滿足下述式(1)之關係。 &lt;br/&gt;&lt;img align="absmiddle" height="55px" width="586px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，a~j表示從上述吸收軸與上述慢軸之關係中選擇之常數，R&lt;sub&gt;0&lt;/sub&gt;表示波長550nm下之上述相位差層之正面相位差，NZ表示上述相位差層之Nz係數)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:附相位差層之偏光板</p>  
        <p type="p">2:偏光板</p>  
        <p type="p">3:相位差層</p>  
        <p type="p">21:偏光元件</p>  
        <p type="p">22:保護層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3101" publication-number="202627198"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627198.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬－有機化合物複合材料的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">C23C18/00</main-classification>  
        <further-classification edition="200601120260326B">C25D3/32</further-classification>  
        <further-classification edition="200601120260326B">B01D15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神戶製鋼所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湖山貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYAMA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤弘高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, HIROTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本慎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, SHINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桂翔生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSURA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種金屬-有機化合物複合材料，包含金屬材料以及多個有機化合物粒子，所述金屬材料包含合計超過50質量%的規定的金屬，所述多個有機化合物粒子具有選自由以藉由玻璃紙黏著帶能夠剝離的方式附著於所述金屬材料的表面的狀態、及以所述金屬材料的至少一部分露出至表面的方式埋沒於所述金屬材料中的狀態所組成的群組中的一個以上的狀態，所述多個有機化合物粒子包含選自由化合物A、化合物B及化合物C所組成的群組中的任意一種以上，所述化合物A是在單位分子結構內包含選自由氫、碳及氧所組成的群組中的任意兩種以上的脂肪族化合物，所述化合物B是在單位分子結構內包含一個以上的醯胺鍵的脂肪族化合物，所述化合物C是在單位分子結構內包含一個以上的胺基的芳香族化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:金屬材料</p>  
        <p type="p">2b:金屬材料2的表面/表面</p>  
        <p type="p">3:有機化合物粒子/粒子</p>  
        <p type="p">11:金屬-有機化合物複合材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3102" publication-number="202626738"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626738.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＤＬＬ３及ＣＤ３抗體構築體、其醫藥組合物、套組及用途</chinese-title>  
        <english-title>ANTIBODY CONSTRUCTS FOR DLL3 AND CD3, PHARMACEUTICAL COMPOSITIONS, KITS, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07K16/28</main-classification>  
        <further-classification edition="200601120260324B">C07K16/46</further-classification>  
        <further-classification edition="200601120260324B">C12N15/63</further-classification>  
        <further-classification edition="200601120260324B">C12N5/10</further-classification>  
        <further-classification edition="200601120260324B">C12N15/13</further-classification>  
        <further-classification edition="200601120260324B">C12P21/08</further-classification>  
        <further-classification edition="200601120260324B">A61K39/395</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商安美基研究（慕尼黑）公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMGEN RESEARCH (MUNICH) GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞烏　托拜耳斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAUM, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫佛　彼德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUFER, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘茲亞雷克　喬恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENDZIALEK, JOCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯梅爾　克勞蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUEMEL, CLAUDIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達霍夫　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAHLHOFF, CHRISTOPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMANN, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路特布斯　勞夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUTTERBUESE, RALF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那爾沃德　伊麗莎貝斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAHRWOLD, ELISABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種雙特異性抗體構築體，其包含結合於目標細胞表面上之人類DLL3的第一結合域及結合於T細胞表面上之人類CD3的第二結合域。此外，本發明提供一種編碼該抗體構築體之聚核苷酸、包含該聚核苷酸之載體及經該聚核苷酸或載體轉型或轉染之宿主細胞。此外，本發明提供一種用於產生本發明之抗體構築體的方法、該抗體構築體之醫療用途及包含該抗體構築體之套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a bispecific antibody construct comprising a first binding domain which binds to human DLL3 on the surface of a target cell and a second binding domain which binds to human CD3 on the surface of a T cell. Moreover, the invention provides a polynucleotide encoding the antibody construct, a vector comprising said polynucleotide and a host cell transformed or transfected with said polynucleotide or vector. Furthermore, the invention provides a process for the production of the antibody construct of the invention, a medical use of said antibody construct and a kit comprising said antibody construct.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3103" publication-number="202628307"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628307.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池桶及充電站</chinese-title>  
        <english-title>BATTERY BARREL AND CHARGING STATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260320B">H02J7/00</main-classification>  
        <further-classification edition="200601120260320B">H01M10/42</further-classification>  
        <further-classification edition="200601120260320B">H01M10/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商睿能創意公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOGORO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐振欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHEN-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王佑榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾志踴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHIH-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池桶包含桶體以及滾輪模組。桶體包含至少一側壁環繞形成插入口。側壁具有缺口連通插入口，並遠離插入口延伸。滾輪模組銜接於缺口，並配置以沿著缺口的內緣滑動而由插入口離開缺口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery barrel includes a barrel body and a roller module. The barrel body includes at least one side wall surrounding to form an insertion opening. The side wall has a notch communicating with the insertion opening and extending away from the insertion opening. The roller module is engaged with the notch and configured to slide along an inner edge of the notch and leave the notch through the insertion opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電池桶</p>  
        <p type="p">210:桶體</p>  
        <p type="p">211:側壁</p>  
        <p type="p">211a:缺口</p>  
        <p type="p">211a1:第一邊緣</p>  
        <p type="p">211a2:第二邊緣</p>  
        <p type="p">212:凸緣</p>  
        <p type="p">220:滾輪模組</p>  
        <p type="p">221:安裝板</p>  
        <p type="p">222:滾輪單元</p>  
        <p type="p">230:電池連接座</p>  
        <p type="p">H1:進氣口</p>  
        <p type="p">H2:出氣口</p>  
        <p type="p">O:插入口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3104" publication-number="202628463"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628463.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半持久排程物理下行鏈路共享通道釋放的方法及系統、以及使用者設備</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR SPS PDSCH RELEASE, AND USER EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260321B">H04W72/11</main-classification>  
        <further-classification edition="202301120260321B">H04W72/232</further-classification>  
        <further-classification edition="202301120260321B">H04L1/1812</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩波　哈米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SABER, HAMID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半持久排程（SPS）釋放的方法，所述方法包括：由使用者設備（UE）根據SPS配置在輸送區塊（TB）的多個槽上接收SPS物理下行鏈路共享通道（PDSCH）的一或多個時機；由所述UE接收包括下行鏈路控制資訊（DCI）格式的物理下行鏈路控制通道（PDCCH），使得在所接收的SPS PDSCH的第一時機的最末符號的結尾之前或與其同時接收到所述PDCCH的最末符號的結尾；以及由所述UE因應於接收到所述PDCCH而釋放所述SPS配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of semi-persistently scheduled (SPS) release, comprising: receiving, by a user equipment (UE), one or more occasions of SPS physical downlink shared channels (PDSCHs) over multiple slots for a transport block (TB) according to an SPS configuration; receiving, by the UE, a physical downlink control channel (PDCCH) including a downlink control information (DCI) format such that an end of a last symbol of the PDCCH is received before or at a same time as an end of a last symbol of a first occasion of a received SPS PDSCH; and releasing, by the UE, the SPS configuration in response to receiving the PDCCH.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1700:流程圖</p>  
        <p type="p">1702、1704、1706:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3105" publication-number="202628195"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628195.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title>PLASMA PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H01J37/32</main-classification>  
        <further-classification edition="200601120260325B">H05H1/46</further-classification>  
        <further-classification edition="200601120260325B">H05H1/03</further-classification>  
        <further-classification edition="200601120260325B">H03K17/687</further-classification>  
        <further-classification edition="202601120260325B">H10P50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永海幸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大下辰郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHSHITA, TATSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永關一也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASEKI, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>檜森慎司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMORI, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明抑制基板的蝕刻率降低、且使照射至腔室本體的內壁之離子的能量降低。本發明之電漿處理方法，包括：射頻信號供給步驟，由射頻電源供給射頻信號；直流電壓施加步驟，由一個以上之直流電源來將具有負極性之直流電壓施加至下部電極；且直流電壓施加步驟之中，將直流電壓周期性施加至下部電極，且於將施加直流電壓至下部電極之各周期予以規定之頻率係設定成未滿1MHz之狀態下，調整施加直流電壓至下部電極之期間在各周期內所佔之比率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plasma processing method includes providing a plasma processing apparatus; supplying radio-frequency waves from a radio-frequency power supply; and applying a negative DC voltage to a lower electrode from the at least one DC power supply. In the applying the DC voltage, the DC voltage is cyclically applied to the lower electrode, and in a state where a frequency defining each cycle in which the DC voltage is applied to the lower electrode is set to be lower than 1 MHz, a ratio occupied by a period during which the DC voltage is applied to the lower electrode in the each cycle is regulated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">PDC:周期</p>  
        <p type="p">S1,S2:步驟</p>  
        <p type="p">T1,T2:期間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3106" publication-number="202627045"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627045.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物、及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">C09K19/56</main-classification>  
        <further-classification edition="200601120260325B">C08G73/10</further-classification>  
        <further-classification edition="200601120260325B">G02F1/1337</further-classification>  
        <further-classification edition="200601120260325B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>結城達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田一平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, IPPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山之内洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANOUCHI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液晶配向劑，其特徵為含有聚合物(A)，該聚合物(A)係選自由具有下式(1)表示之重複單元(a1)之聚醯亞胺前驅物及係該聚醯亞胺前驅物之醯亞胺化物的聚醯亞胺構成之群組中之至少1種。 &lt;br/&gt;&lt;img align="absmiddle" height="193px" width="381px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(1)中，X&lt;sub&gt;1&lt;/sub&gt;表示4價有機基；Y&lt;sub&gt;1&lt;/sub&gt;係以下式(H)表示且具有3個以上之苯環之2價有機基； &lt;br/&gt;&lt;img align="absmiddle" height="50px" width="529px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(H)中，A表示碳數4~10之伸烷基。 &lt;br/&gt;Ar&lt;sub&gt;1&lt;/sub&gt;、及Ar&lt;sub&gt;1’&lt;/sub&gt;各自獨立地表示苯環、聯苯結構、或萘環。Ar&lt;sub&gt;1&lt;/sub&gt;、及Ar&lt;sub&gt;1’&lt;/sub&gt;之環上之任意氫原子亦可被1價基取代。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:橫電場液晶顯示元件</p>  
        <p type="p">2:梳齒電極基板</p>  
        <p type="p">2a:基材</p>  
        <p type="p">2b:線狀電極</p>  
        <p type="p">2c:液晶配向膜</p>  
        <p type="p">3:液晶</p>  
        <p type="p">4:對向基板</p>  
        <p type="p">4a:液晶配向膜</p>  
        <p type="p">4b:基材</p>  
        <p type="p">L:電力線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3107" publication-number="202627727"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627727.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流量控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">G05D7/06</main-classification>  
        <further-classification edition="200601120260321B">G05D16/20</further-classification>  
        <further-classification edition="200601120260321B">G01M3/26</further-classification>  
        <further-classification edition="200601120260321B">G01M3/28</further-classification>  
        <further-classification edition="200601120260321B">G01L19/08</further-classification>  
        <further-classification edition="200601120260321B">G01L13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士金股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKIN INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉田勝幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGITA, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平田薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山利貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋諒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">流量控制裝置(10)具備：開度可調整自如的壓力控制閥(12)、設置在壓力控制閥的下游側之流量控制閥(14)、設置在壓力控制閥和流量控制閥之間的節流部(16)、測定壓力控制閥和節流部之間的壓力之上游壓力感測器(18)、以及控制電路(13)，根據上游壓力感測器的輸出對壓力控制閥(12)進行反饋控制，藉由流量控制閥(14)的開閉控制進行脈衝式氣體供應，控制電路(13)構成為，根據流量控制閥(14)的開閉狀態來改變壓力控制閥(12)的反饋控制，或在流量控制閥(14)的開閉切換時，對壓力控制閥(12)的反饋控制進行附加控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:氣體供應源</p>  
        <p type="p">3:沖洗氣體供應源</p>  
        <p type="p">4,5:停止閥</p>  
        <p type="p">6:處理室</p>  
        <p type="p">8:真空泵</p>  
        <p type="p">10:流量控制裝置</p>  
        <p type="p">100:氣體供應系統</p>  
        <p type="p">G:氣體</p>  
        <p type="p">G’:沖洗氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3108" publication-number="202628196"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628196.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260322B">H01J37/32</main-classification>  
        <further-classification edition="200601120260322B">H05H1/46</further-classification>  
        <further-classification edition="200601120260322B">H03K4/02</further-classification>  
        <further-classification edition="200601120260322B">H03K7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輿水地塩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHIMIZU, CHISHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田紳治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於例示之實施形態之電漿處理裝置中，週期性地對下部電極施加脈衝狀之負極性之直流電壓。規定對下部電極施加脈衝狀之負極性之直流電壓之週期之頻率較為了生成電漿而供給之高頻電力之頻率低。高頻電力於週期內之第1部分期間內被供給。週期內之第2部分期間之高頻電力之功率位準設定為自第1部分期間之高頻電力之功率位準減少之功率位準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">10:腔室</p>  
        <p type="p">10s:內部空間</p>  
        <p type="p">12:腔室本體</p>  
        <p type="p">12g:閘閥</p>  
        <p type="p">12p:通路</p>  
        <p type="p">16:基板支持器</p>  
        <p type="p">17:支持部</p>  
        <p type="p">18:下部電極</p>  
        <p type="p">18f:流路</p>  
        <p type="p">20:靜電吸盤</p>  
        <p type="p">23a:配管</p>  
        <p type="p">23b:配管</p>  
        <p type="p">25:氣體供給管線</p>  
        <p type="p">27:絕緣區域</p>  
        <p type="p">30:上部電極</p>  
        <p type="p">32:構件</p>  
        <p type="p">34:頂板</p>  
        <p type="p">34a:氣體噴出孔</p>  
        <p type="p">36:支持體</p>  
        <p type="p">36a:氣體擴散室</p>  
        <p type="p">36b:氣體孔</p>  
        <p type="p">36c:氣體導入埠</p>  
        <p type="p">38:氣體供給管</p>  
        <p type="p">40:氣體源群</p>  
        <p type="p">41:閥群</p>  
        <p type="p">42:流量控制器群</p>  
        <p type="p">43:閥群</p>  
        <p type="p">48:擋板</p>  
        <p type="p">50:排氣裝置</p>  
        <p type="p">52:排氣管</p>  
        <p type="p">61:高頻電源</p>  
        <p type="p">62:偏壓電源</p>  
        <p type="p">63:整合電路</p>  
        <p type="p">64:低通濾波器</p>  
        <p type="p">78:電壓感測器</p>  
        <p type="p">AX:軸線</p>  
        <p type="p">ER:邊環</p>  
        <p type="p">MC:控制部</p>  
        <p type="p">PV:直流電壓</p>  
        <p type="p">RF:高頻電力</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3109" publication-number="202625974"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625974.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115108942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於量化一生物系統之一健康能力之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR QUANTIFYING A HEALTH CAPACITY OF A BIOLOGICAL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260320B">A61B5/24</main-classification>  
        <further-classification edition="201801120260320B">G16H50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商埃默亞公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMERJA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米勒　蓋伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLER, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓森　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSEN, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾文　史吉普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLVIN, SKIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述用於測量、記錄、傳輸、存取且使用量化諸如生物系統之複雜自適應系統之狀態之一實體及生理測量陣列之系統，更特定言之，該狀態反應在一度量指定之健康能力中。此等測量可用於(例如)一生物系統中之疾病狀態之症狀前偵測及攔截。在一個態樣中，該系統包括經組態以實質上同時測量較佳在該生物系統上之多個位點處且依據時間而變化之與水相關聯之度量之一陣列。該等系統可進一步包括使用一可擴縮科技平台以自跨多個系統之資料陣列識別，較佳相較於一訓練資料集，利用機器可讀指令以判定及/或預測該生物系統之健康狀態，包含該健康能力，且產生建議，包含修改或營養、睡眠、實體或精神輸入用於該生物系統之健康之改良。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems are described for measuring, recording, transmitting, accessing, and using an array of physical and physiological measurements that quantify states of complex adaptive systems, such as biological systems, more particularly the state is reflected in a metric designated health capacity. These measurements may be used, for example, for the pre-symptomatic detection and interception of disease states in a biological system. In one aspect, the system comprises a wearable device configured to measure, substantially simultaneously, an array of water-associated metrics, preferably at multiple loci on the biological system and as a function of time. The systems may further comprise using a scalable technology platform to identify, from the array of data across multiple systems, preferably compared to a training data set, utilizing machine readable instructions, to determine and/or predict health states, including the health capacity, of the biological system and to generate recommendations, including modification or nutrition, sleep, physical or mental inputs for the improvement of health for the biological system.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3110" publication-number="202626743"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626743.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經糖基修飾的融合蛋白、核酸分子、表達載體、宿主細胞及應用</chinese-title>  
        <english-title>GLYCOSYL-MODIFIED FUSION PROTEIN, NUCLEIC ACID MOLECULE, EXPRESSION VECTOR, HOST CELL AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">C07K19/00</main-classification>  
        <further-classification edition="200601120260324B">C07K16/30</further-classification>  
        <further-classification edition="200601120260324B">A61K39/395</further-classification>  
        <further-classification edition="200601120260324B">C12N15/13</further-classification>  
        <further-classification edition="200601120260324B">C12N15/63</further-classification>  
        <further-classification edition="200601120260324B">C12N15/64</further-classification>  
        <further-classification edition="200601120260324B">A61P35/00</further-classification>  
        <further-classification edition="200601120260324B">A61P31/12</further-classification>  
        <further-classification edition="200601120260324B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商凱米生物醫藥（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIMIGEN BIOMEDICAL (CHENGDU) CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史　躍年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YUENIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞　波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種經糖基修飾的融合蛋白、核酸分子、表達載體、宿主細胞及應用。本申請第一方面提供一種經糖基修飾的融合蛋白，包含鼠源Fc變體和多肽抗原，所述鼠源Fc變體是對鼠源Fc片段進行胺基酸突變和非哺乳動物糖基化修飾後得到的：所述鼠源Fc變體包括第223位的丙胺酸、第228位的丙胺酸、第230位的丙胺酸、第330位的白胺酸和第332位的麩胺酸中的至少一種；所述非哺乳動物糖基化修飾不包括唾液酸修飾；所述位點編號依照EU numbering系統進行；所述融合蛋白與DC細胞結合，以及活化DC細胞包括特異性T細胞的增殖和活化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a glycosyl-modified fusion protein, a nucleic acid molecule, an expression vector, a host cell and use thereof. A first aspect of this application provides a glycosyl-modified fusion protein including a murine Fc variant and a polypeptide antigen, where the murine Fc variant is obtained by subjecting a murine Fc fragment to amino acid mutation and non-mammalian glycosylation-modification; the murine Fc variant includes at least one of alanine at position 223, alanine at position 228, alanine at position 230, leucine at position 330 and glutamic acid at position 332; the non-mammalian glycosylation-modification excludes sialic acid-modification; the position numbering is performed according to the EU numbering system; the fusion protein binds to dendritic cells and activates the dendritic cells, including the proliferation and activation of specific T cells.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3111" publication-number="202626393"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626393.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>會員註冊及進行充電、預約充電的運營架構</chinese-title>  
        <english-title>OPERATING ARCHITECTURE FOR MEMBER REGISTRATION, CHARGING, AND CHARGING RESERVATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260326B">B60L53/60</main-classification>  
        <further-classification edition="201901120260326B">B60L53/64</further-classification>  
        <further-classification edition="201901120260326B">B60L53/62</further-classification>  
        <further-classification edition="202401120260326B">G06Q50/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李皞白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-PAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李皞白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAO-PAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王佑仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許郁莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種會員註冊及進行充電的運營架構，係由智慧型通信裝置、電動車、充電介面、充電樁及後台裝置所構成。使用者透過充電平台應用程式輸入號碼、車牌號及電子簽名完成註冊，後台據以建立包含一維碼、Hash摘要及時間戳記之數位憑證，經加密編碼後傳送至智慧型通信裝置；於充電時，充電介面將該數位憑證傳送至後台比對，驗證相符後即允許電動車充電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an operating architecture for member registration, charging, and charging reservation, which is composed of a smart communication device, an electric vehicle, a charging interface, a charging pile, and a backend device. A user completes registration by entering a number, a license plate number, and an electronic signature through a charging platform application program. Based thereon, the backend device establishes a digital certificate including a one-dimensional code, a Hash summary, and a timestamp, and transmits the digital certificate to the smart communication device after encryption and encoding. During charging, the charging interface transmits the digital certificate to the backend device for comparison, and when the verification result is matched, the electric vehicle is allowed to be charged.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1210~1295:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3112" publication-number="202628860"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628860.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109085</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用石墨烯合成工具的擴散耦合成方法</chinese-title>  
        <english-title>DIFFUSION-COUPLE SYNTHESIS METHOD USING A GRAPHENE SYNTHESIS TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260318B">H10P70/00</main-classification>  
        <further-classification edition="200601120260318B">C23C8/64</further-classification>  
        <further-classification edition="201701120260318B">C01B32/182</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商迪斯尼２Ｄ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESTINATION 2D INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊延加　拉維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYENGAR, RAVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴納吉　考斯塔夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANERJEE, KAUSTAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克朗奎斯特　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRONQUIST, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用經改造或未經改造的商用接合工具執行的擴散偶合成方法，該方法包括以下步驟：提供基板負載，該基板負載包含至少兩片已加工基板；其中該工具可以在其製程腔室內對該基板施加壓力和升高的溫度；將該基板負載放置在該製程腔室內；施加該壓力和該升高的溫度；其中，該至少兩片已加工基板包含碳化層，直接配置在一個擴散層上，該擴散層直接配置在一氧化層上，並包含元件基板，其上配置該氧化物層。該至少兩片已加工基板中的一片配置在另一片上方，其中，該至少兩片已加工基板中的一片的元件基板直接配置在該至少兩片已加工基板的另一片的碳源層上方；以及在該至少兩片已加工基板中的每一片的氧化物層與擴散層間的介面形成石墨烯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diffusion-couple synthesis method using a modified or unchanged commercial bonding tool comprising: providing a substrate load which comprises at least two prepared substrates; wherein said tool can apply pressure and elevated temperature to said substrate within a process chamber; placing said substrate load within said process chamber; applying said pressure and said elevated temperature; wherein each of said at least two prepared substrates comprises a carbon source disposed directly atop a diffusion layer, the diffusion layer disposed directly atop an oxide layer, and a device substrate with the oxide layer disposed atop, one of said at least two prepared substrates is disposed above another, wherein the device substrate of one of said at least two prepared substrates is directly atop said carbon source of other of said at least two prepared substrates; and forming graphene at an interface between said oxide layer and said diffusion layer of each of said at least two prepared substrates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:基板負載</p>  
        <p type="p">1101:上方接合/合成施力/液壓缸</p>  
        <p type="p">1102:底部接合/合成施力/液壓缸</p>  
        <p type="p">1105:上方加熱器/加熱板</p>  
        <p type="p">1107:底部加熱器/加熱板</p>  
        <p type="p">1110:上方過渡板</p>  
        <p type="p">1115:底部過渡板</p>  
        <p type="p">1120:基板/晶圓</p>  
        <p type="p">1130:犧牲擴散層</p>  
        <p type="p">1140:碳源層</p>  
        <p type="p">1160:施力方向標示</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3113" publication-number="202627078"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627078.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷凍保存經工程化之調節Ｔ細胞（ＴＲＥＧＳ）之方法</chinese-title>  
        <english-title>METHOD FOR CRYOPRESERVING ENGINEERED TREGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N5/0783</main-classification>  
        <further-classification edition="200601120260401B">C12N15/86</further-classification>  
        <further-classification edition="200601120260401B">C07K14/705</further-classification>  
        <further-classification edition="200601120260401B">C07K14/47</further-classification>  
        <further-classification edition="202501120260401B">A61K40/11</further-classification>  
        <further-classification edition="202501120260401B">A61K40/22</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商圭爾醫療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUELL THERAPEUTICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥吉爾　伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCGILL, IAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種在已冷凍保存之調節T細胞(Treg)群中保持CD62L表現的方法，其包含在冷凍保存之前將編碼FOXP3多肽之聚核苷酸引入Treg群中。本發明亦關於一種在冷凍保存後之Treg群中保持CD62L的方法，其包含將編碼FOXP3多肽之聚核苷酸引入Treg群中及冷凍保存該Treg群。此外，本發明係關於編碼FOXP3之外源聚核苷酸用於在冷凍保存後之Treg群中保持CD62L表現的用途，以及經冷凍保存之工程化Treg、包含該經冷凍保存之工程化Treg的醫藥組合物及其治療用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method of preserving CD62L expression in a regulatory T cell (Treg) population that has been cryopreserved, comprising introducing a polynucleotide encoding a FOXP3 polypeptide into the Treg population prior to cryopreservation. The present invention also relates to a method of preserving CD62L in a Treg population after cryopreservation, comprising introducing a polynucleotide encoding a FOXP3 polypeptide into the Treg population and cryopreserving said Treg population. Furthermore, the present invention relates to the use of an exogenous polynucleotide encoding FOXP3 for the preservation of CD62L expression in a Treg population after cryopreservation, and to a cryopreserved engineered Treg, pharmaceutical compositions comprising the cryopreserved engineered Treg and to therapeutic uses thereof.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3114" publication-number="202628052"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628052.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於烙印補償的顯示驅動電路及主處理器及其顯示系統</chinese-title>  
        <english-title>DISPLAY DRIVER CIRCUIT AND HOST PROCESSOR AND RELATED DISPLAY SYSTEM FOR DEBURN-IN COMPENSATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260325B">G09G3/3225</main-classification>  
        <further-classification edition="201601120260325B">G09G3/3208</further-classification>  
        <further-classification edition="201601120260325B">G09G3/32</further-classification>  
        <further-classification edition="200601120260325B">G09G3/36</further-classification>  
        <further-classification edition="200601120260325B">G09G3/30</further-classification>  
        <further-classification edition="200601120260325B">G09G3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玄用</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XUAN-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白鳳霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, FENG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇尚裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡詠誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YUNG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示驅動電路，包含有一接收單元、一記憶體及一補償電路。該接收單元用來從一主處理器接收一原始影像資料及一補償資料。該記憶體用來儲存該補償資料。該補償電路耦接於該記憶體及該接收單元，用來從該記憶體讀出該補償資料，並利用該補償資料來補償該原始影像資料以產生一第一補償影像資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display driver circuit includes a receiver, a memory and a compensation circuit. The receiver receives an original image data and a compensation data from a host processor. The memory stores the compensation data. The compensation circuit, coupled to the memory and the receiver, reads out the compensation data from the memory, and compensates the original image data by using the compensation data to generate a first compensated image data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:顯示系統</p>  
        <p type="p">610:主處理器</p>  
        <p type="p">620:顯示驅動電路</p>  
        <p type="p">630:顯示面板</p>  
        <p type="p">611:影像輸入單元</p>  
        <p type="p">612:像素編排轉換單元</p>  
        <p type="p">613:應力累積單元</p>  
        <p type="p">614:區塊累積單元</p>  
        <p type="p">615,624:儲存單元</p>  
        <p type="p">616:應力補償轉換單元</p>  
        <p type="p">617:編碼器</p>  
        <p type="p">618,622:選擇單元</p>  
        <p type="p">619:傳輸單元</p>  
        <p type="p">621:接收單元</p>  
        <p type="p">625:解碼器</p>  
        <p type="p">626:補償電路</p>  
        <p type="p">629:影像輸出單元</p>  
        <p type="p">R1,R2:第一記憶體</p>  
        <p type="p">F1,F2:第二記憶體</p>  
        <p type="p">ORI_IMG:原始影像資料</p>  
        <p type="p">ORI_IMG’:像素資料</p>  
        <p type="p">S&lt;sub&gt;N&lt;/sub&gt;:累積應力值</p>  
        <p type="p">T&lt;sub&gt;N&lt;/sub&gt;_OFS:烙印補償值</p>  
        <p type="p">T&lt;sub&gt;0&lt;/sub&gt;_OFS:像素級校正補償值</p>  
        <p type="p">T&lt;sub&gt;0&lt;/sub&gt;+T&lt;sub&gt;N&lt;/sub&gt;_IMG:全時域補償影像資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3115" publication-number="202627509"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627509.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子測量儀器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">G01R31/28</main-classification>  
        <further-classification edition="200601120260326B">G01R31/00</further-classification>  
        <further-classification edition="200601120260326B">G01R19/15</further-classification>  
        <further-classification edition="200601120260326B">G01R15/12</further-classification>  
        <further-classification edition="200601120260326B">G01R15/00</further-classification>  
        <further-classification edition="200601120260326B">G01R1/06</further-classification>  
        <further-classification edition="200601120260326B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商寶紳電子集團公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWER PROBE GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　富穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IP, FOO WING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種電子測量儀器，包括：設置有第一至第四孔位及邏輯電路之電表，以及表筆盒，該表筆盒包括一電路板，該表筆盒之一端設置有第一至第四端子，該表筆盒之另一端設置有一對測試探針，第一至第四端子係分別對應插設於該第一至第四孔位中，該電路板耦接至該第三、第四端子及該對測試探針；以及該第一與第二端子內各包括一金屬彈片，當該第一與第二端子分別插設於該第一與第二孔位中時，該第一與第二孔位間經由該表筆盒形成一迴路，藉以經由該邏輯電路判斷該電表是否插設有該表筆盒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電表</p>  
        <p type="p">11,12,13,14:孔位</p>  
        <p type="p">15:旋鈕</p>  
        <p type="p">16:顯示器</p>  
        <p type="p">2:表筆盒</p>  
        <p type="p">21,22,23,24:端子</p>  
        <p type="p">25,26:測試探針</p>  
        <p type="p">251,261:測試探針之第一端</p>  
        <p type="p">252,262:測試探針之第二端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3116" publication-number="202628007"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628007.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109256</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視線偵測裝置及其設定處理方法</chinese-title>  
        <english-title>A GAZE DETECTION DEVICE AND A CONFIGURATION PROCESSING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260330B">G06V40/18</main-classification>  
        <further-classification edition="202201120260330B">G06V40/20</further-classification>  
        <further-classification edition="202201120260330B">G06V10/70</further-classification>  
        <further-classification edition="200601120260330B">G02C11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種視線偵測裝置及其設定處理方法，包括一眼動追蹤模組與一目標偵測模組，其中，該眼動追蹤模組包括一感測裝置，該感測裝置透過感測眼睛資訊以估算判斷視線與視線的時序變化，藉以區分是掃視狀態或注視狀態。該目標偵測模組包括多個目標類別，用以供設定感興趣的至少一個該目標類別，在該注視狀態，該目標偵測模組可以偵測目標，該目標偵測模組判斷比對用的一影像資訊符合感興趣的該目標類別時，則擷取儲存該影像資訊，藉以供使用者回顧參考之用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gaze detection device and a configuration processing method thereof are provided. The gaze detection device comprises an eye-tracking module and a target detection module, wherein the eye-tracking module includes a sensing device, and the sensing device estimates and determines a gaze direction and temporal variations of the gaze direction by sensing eye information, so as to distinguish whether the gaze is in a saccadic state or a fixation state. The target detection module comprises a plurality of target categories, for setting at least one target category of interest. When in the fixation state, the target detection module is configured to detect a target. When the target detection module determines that image information used for comparison corresponds to the target category of interest, the image information is captured and stored, so as to be used by a user for subsequent review and reference.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:眼動追蹤模組</p>  
        <p type="p">11:感測裝置</p>  
        <p type="p">111:偵測鏡頭</p>  
        <p type="p">112:場景攝像鏡頭</p>  
        <p type="p">12:眼睛</p>  
        <p type="p">13:設定目標類別</p>  
        <p type="p">20:目標偵測模組</p>  
        <p type="p">21:第一神經網路處理器</p>  
        <p type="p">22:第一通訊模組</p>  
        <p type="p">23:運算處理裝置</p>  
        <p type="p">30:智慧裝置</p>  
        <p type="p">31:第二通訊模組</p>  
        <p type="p">32:偵測管理軟體程式</p>  
        <p type="p">33:儲存單元</p>  
        <p type="p">34:軟體開發套件</p>  
        <p type="p">41:資料傳輸溝通</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3117" publication-number="202626401"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626401.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童座椅</chinese-title>  
        <english-title>CHILD CAR SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">B60N2/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商寶鉅瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAMBINO PREZIOSO SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DA-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種兒童座椅，包括底座、轉盤及乘坐部，還包括鎖定機構及釋鎖機構，轉盤樞接於底座的上部，鎖定機構設置於轉盤，鎖定機構與乘坐部連接並將乘坐部鎖定於轉盤，釋鎖機構設置於底座，釋鎖機構可動作並帶動鎖定機構釋鎖乘坐部。通過釋鎖機構動作並帶動鎖定機構釋鎖乘坐部，使得乘坐部可拆卸下來，進而更換不同的乘坐部，消費者無需重新購買不同乘坐部的兒童安全座椅，從而可降低消費者的使用成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a child car seat including a base, a turntable and a seat portion. The safety mechanism for the child car seat further includes a locking mechanism and a releasing mechanism. The turntable is pivotally connected to an upper part of the base. The locking mechanism is disposed at the turntable, connected to the seat portion and locks the seat portion to the turntable. The releasing mechanism is disposed at the base, and is operable to drive the locking mechanism to release the seat portion. By driving the locking mechanism to release the seat portion by the releasing mechanism, the seat portion can be removed and be replaced by a different seat portion, so that a consumer does not need to further purchase a child car seat having a different seat portion, thereby reducing utilization &lt;br/&gt; costs for the consumer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:底座</p>  
        <p type="p">2:轉盤</p>  
        <p type="p">3:乘坐部</p>  
        <p type="p">100:兒童座椅安全機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3118" publication-number="202625925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109319</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>便於穿脫的鞋子後踵片</chinese-title>  
        <english-title>FOOTWEAR COUNTER FOR EASIER ENTRY AND REMOVAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260318B">A43B23/08</main-classification>  
        <further-classification edition="200601120260318B">A43B11/00</further-classification>  
        <further-classification edition="200601120260318B">A43B23/02</further-classification>  
        <further-classification edition="200601120260318B">A43B23/17</further-classification>  
        <further-classification edition="200601120260318B">A43B21/24</further-classification>  
        <further-classification edition="200601120260318B">A43B21/32</further-classification>  
        <further-classification edition="200601120260318B">A43B21/36</further-classification>  
        <further-classification edition="200601120260318B">A43B23/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史柯契爾　ＩＩ　美國股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKECHERS U.S.A., INC. II</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維克斯　約翰　麥克斯維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEEKS, JOHN MAXWEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱利　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KELLEY, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　豐陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, FRANK F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖珮君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PEI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤佳　強生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TJA, JOHNSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯托克布里奇　庫爾特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STOCKBRIDGE, KURT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭詠翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鞋子製品，包括一鞋面（16）及鞋底結構（14），且該鞋面（16）包括一容納腳的鞋口。該鞋子製品進一步包括一鞋跟杯（52），該鞋跟杯附接至該鞋面（16）且自該鞋底結構（14）延伸至鞋面（16）之後鞋跟領（74）的至少一部分。另外，該鞋跟杯（52）由一上部部分（64）、中間部分（58）以及下部部分（54）均勻地模製而成，且該上部部分（64）相比於該中間部分（58）具有一較短的中側長度，且該中間部分（58）及下部部分（54）形成經組態以容納腳跟之一凹形結構。該上部部分（64）具有一第一組態，且能夠在一使用者穿上鞋子時在該使用者之腳之一負荷下變形為一第二組態。在該第二組態中，該上部部分（64）之至少部分相對於該第一組態降低，且該上部部分（64）能夠在該使用者之腳之該負荷移除之後返回至該第一組態。該中間部分（58）包括具有一第一厚度之一周邊部分（70）及具有一第二厚度之一中心部分（50），且該第二厚度小於該第一厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An article of footwear includes an upper (16) and sole structure (14), and the upper (16) includes a foot receiving shoe opening. The article of footwear further includes a heel cup (52) attached to the upper (16) and extending from the sole structure (14) to at least a portion of the rear heel collar (74) of upper (16). Additionally, the heel cup (52) is uniformly molded with an upper portion (64), midportion (58), and lower portion (54) and the upper portion (64) has a smaller mediolateral length than the midportion (58), and the midportion (58) and lower portion (54) form a concave structure configured to receive the heel. The upper portion (64) has a first configuration and is capable of distorting into a second configuration under a load of a user's foot when the user is donning the footwear. In the second configuration, at least part of the upper portion (64) is lowered relative to the first configuration and the upper portion (64) is capable of returning to the first configuration after the load of the user's foot is removed. The midportion (58) includes a peripheral portion (70) having a first thickness and a central portion (50) having a second thickness, and the second thickness is less than the first thickness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3119" publication-number="202628334"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628334.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率轉換器電路及操作一功率轉換器電路之方法</chinese-title>  
        <english-title>POWER CONVERTER CIRCUIT AND METHOD OF OPERATING THE POWER CONVERTER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H02M3/158</main-classification>  
        <further-classification edition="200601120260325B">H02M3/155</further-classification>  
        <further-classification edition="200601120260325B">H02M3/15</further-classification>  
        <further-classification edition="200701120260325B">H02M1/00</further-classification>  
        <further-classification edition="200601120260325B">H02M1/084</further-classification>  
        <further-classification edition="200701120260325B">H02M1/38</further-classification>  
        <further-classification edition="200601120260325B">H02M7/04</further-classification>  
        <further-classification edition="200601120260325B">G05F1/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商予力半導體公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMPOWER SEMICONDUCTOR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼可森　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NICHOLSON, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲利普斯　提摩太　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHILLIPS, TIMOTHY ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種功率轉換器電路。在一個態樣中，該功率轉換器電路包括：一第一降壓轉換器，其在一接合點處串聯耦合至一第二降壓轉換器；及一控制電路，其耦合至該等第一及第二降壓轉換器中之每一者。在另一態樣中，該控制電路經配置以感測該接合點處之一電壓，比較該經感測電壓與一第一臨限電壓，且回應於該經感測電壓處於低於該第一臨限電壓之一電壓，該控制電路操作該第一降壓轉換器並停用該第二降壓轉換器。在又一態樣中，該控制電路經配置以比較該經感測電壓與一第二臨限電壓，且回應於該經感測電壓處於高於該第二臨限電壓之一電壓，該控制電路操作該第二降壓轉換器並停用該第一降壓轉換器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power converter circuit. In one aspect, the power converter circuit includes a first buck converter coupled in series to a second buck converter at a junction, and a control circuit coupled to each of the first and second buck converters. In another aspect, the control circuit is arranged to sense a voltage at the junction, compare the sensed voltage to a first threshold voltage and in response to the sensed voltage being at a voltage lower than the first threshold voltage, the control circuit operates the first buck converter and disables the second buck converter. In yet another aspect, the control circuit is arranged to compare the sensed voltage to a second threshold voltage and in response to the sensed voltage being at a voltage higher than the second threshold voltage, the control circuit operates the second buck converter and disables the first buck converter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:相位多工串聯堆疊式DC-DC功率轉換器電路</p>  
        <p type="p">102:第一開關</p>  
        <p type="p">103:節點</p>  
        <p type="p">104:第二開關</p>  
        <p type="p">106:第三開關</p>  
        <p type="p">107:節點</p>  
        <p type="p">108:第四開關</p>  
        <p type="p">109:頂相</p>  
        <p type="p">110:輸入端子</p>  
        <p type="p">111:底相</p>  
        <p type="p">112:飛行電容器</p>  
        <p type="p">114:第一電感器</p>  
        <p type="p">115:電容器</p>  
        <p type="p">116:第二電感器</p>  
        <p type="p">117:節點</p>  
        <p type="p">118:輸出端子</p>  
        <p type="p">120:接地</p>  
        <p type="p">124:第二輸入</p>  
        <p type="p">126:第二輸入</p>  
        <p type="p">128:窗口比較器</p>  
        <p type="p">130:輸出節點</p>  
        <p type="p">131:負載電容器</p>  
        <p type="p">132:第一OR閘</p>  
        <p type="p">134:第一AND閘</p>  
        <p type="p">135:負載</p>  
        <p type="p">136:節點</p>  
        <p type="p">138:第二OR閘</p>  
        <p type="p">140:第二AND閘</p>  
        <p type="p">141:設定-重設(S/R)鎖存器</p>  
        <p type="p">142:第一時脈產生器</p>  
        <p type="p">144:第二時脈產生器</p>  
        <p type="p">146:第一時脈Φ&lt;sub&gt;1&lt;/sub&gt;</p>  
        <p type="p">148:第二時脈Φ&lt;sub&gt;2&lt;/sub&gt;</p>  
        <p type="p">151:第一比較器</p>  
        <p type="p">153:第二比較器</p>  
        <p type="p">158:邏輯及控制電路</p>  
        <p type="p">159:反相器</p>  
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3120" publication-number="202626099"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626099.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109370</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減少顆粒形成的方法及由此所形成的組成物</chinese-title>  
        <english-title>METHODS OF REDUCING PARTICLE FORMATION AND COMPOSITIONS FORMED THEREBY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">A61K39/395</main-classification>  
        <further-classification edition="200601120260324B">A61K38/46</further-classification>  
        <further-classification edition="200601120260324B">A61K47/26</further-classification>  
        <further-classification edition="200601120260324B">A61K9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商里珍納龍藥品有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派特爾　馬揚克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, MAYANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦辛格　史黛西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WASINGER, STACY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯普里策　丹洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPRITZER, DANYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　小琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, XIAOLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中所公開的生物藥物組成物和藥品顯示微可見顆粒形成的數量減少。本文中所公開的組成物和藥品包含蛋白質及包括高百分比(例如至少97%)的長鏈脂肪酸酯的表面活性劑或穩定劑。本文中還公開了製備和儲存這種組成物和藥品的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Biopharmaceutical compositions and drug products disclosed herein exhibit reduced amounts of subvisible particle formation. Compositions and drug products disclosed herein comprise a protein and a surfactant or stabilizer including high percentage amounts (e.g., at least 97%) of a long-chain fatty acid ester. Also disclosed herein are methods of preparing and storing such compositions and drug products.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3121" publication-number="202627820"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627820.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109371</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲存裝置以及處理自主機計算裝置至儲存裝置的命令的方法</chinese-title>  
        <english-title>STORAGE DEVICE AND METHOD FOR PROCESSING COMMAND FROM HOST COMPUTING DEVICE TO STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260326B">G06F12/1027</main-classification>  
        <further-classification edition="201601120260326B">G06F12/1081</further-classification>  
        <further-classification edition="200601120260326B">G06F12/02</further-classification>  
        <further-classification edition="201601120260326B">G06F12/08</further-classification>  
        <further-classification edition="200601120260326B">G06F13/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾米克　丹尼爾　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELMICK, DANIEL LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿格拉沃爾　維賓　庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGRAWAL, VIPIN KUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露用於對自主機計算裝置至儲存裝置的命令進行處理的系統和方法。所述方法包括：由儲存裝置對來自主機計算裝置的命令進行辨識，所述命令包括邏輯位址；偵測條件；基於偵測到所述條件，由儲存裝置請求將邏輯位址轉換成實體位址；由儲存裝置將實體位址儲存於高速緩衝記憶體中；以及根據所述命令而基於實體位址傳送資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for processing commands from a host computing device to a storage device are disclosed. The method includes identifying, by the storage device, a command from the host computing device, the command including a logical address; detecting a condition; based on detecting the condition, requesting, by the storage device, translation of the logical address into a physical address; storing, by the storage device, the physical address in a cache; and transferring data according to the command based on the physical address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主機計算裝置/主機裝置/主機</p>  
        <p type="p">101:端點</p>  
        <p type="p">102、102a、102b、102c:儲存裝置</p>  
        <p type="p">104:主機記憶體/主機裝置記憶體/主機裝置記憶體位址/本地記憶體/儲存裝置</p>  
        <p type="p">105:處理器</p>  
        <p type="p">106:記憶體管理單元</p>  
        <p type="p">108:轉換代理(TA)</p>  
        <p type="p">110:位址轉換及保護表(ATPT)</p>  
        <p type="p">112:介面/根複合體(RC)</p>  
        <p type="p">114、114a、114b:根埠</p>  
        <p type="p">116:交換機</p>  
        <p type="p">118a、118b、118c:位址轉換高速緩衝記憶體(ATC)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3122" publication-number="202628770"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628770.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平鋪顯示設備</chinese-title>  
        <english-title>TILING DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260324B">H10K59/18</main-classification>  
        <further-classification edition="202301120260324B">H10K59/123</further-classification>  
        <further-classification edition="202301120260324B">H10K59/12</further-classification>  
        <further-classification edition="202501120260324B">H10D30/67</further-classification>  
        <further-classification edition="200601120260324B">G09G3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李浩範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HO BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴大成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, DAE SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌穹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE-GUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種平鋪顯示設備，包括用於產生控制命令訊號的一設定板，及基於序列通訊方案透過第一介面電路彼此連接的多個顯示模組，以對應於控制命令訊號執行目標操作。第一介面電路由在該些顯示模組的相鄰顯示模組之間具有回饋迴路類型的雙向序列介面實現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tiling display apparatus includes a set board configured to generate a control command signal and a plurality of display modules connected to one another through a first interface circuit based on a serial communication scheme, for executing a target operation corresponding to the control command signal. The first interface circuit is implemented with a bidirectional serial interface having a feedback loop type between adjacent display modules of the plurality of display modules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:平鋪顯示設備</p>  
        <p type="p">CB:顯示模組</p>  
        <p type="p">PNL:顯示面板</p>  
        <p type="p">TCON:時序控制器</p>  
        <p type="p">SET:設定板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3123" publication-number="202628811"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628811.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體器件及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260325B">H10P34/42</main-classification>  
        <further-classification edition="202601120260325B">H10W74/15</further-classification>  
        <further-classification edition="202601120260325B">H10W40/25</further-classification>  
        <further-classification edition="201401120260325B">B23K26/57</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JOONYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金禹淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, WOOSOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪聖權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, SEONGKWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金佳妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GAYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種半導體器件及其形成方法。所述方法包括：提供基底；提供半導體裸晶片，所述半導體裸晶片具有第一裸晶片表面和與所述第一裸晶片表面相對的第二裸晶片表面；通過包含焊料的互連結構將所述第一裸晶片表面附接到所述基底；以及用雷射束照射所述第二裸晶片表面，其中所述雷射束穿過所述半導體裸晶片並回流互連結構的焊料。在該方法中，可以使用雷射輔助鍵合來對焊料凸塊進行回流，雷射輔助鍵合後可以形成熱界面材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:半導體裸晶片</p>  
        <p type="p">214:凸塊/互連結構</p>  
        <p type="p">240:基底</p>  
        <p type="p">242:分布結構(RDS)</p>  
        <p type="p">260:背面金屬化層(BSM層)</p>  
        <p type="p">270:熱界面材料層(TIM層)</p>  
        <p type="p">270a:第一表面</p>  
        <p type="p">270b:第二表面</p>  
        <p type="p">272:第一助焊劑層</p>  
        <p type="p">274:第二助焊劑層</p>  
        <p type="p">280:散熱器</p>  
        <p type="p">282:蓋體</p>  
        <p type="p">282a:頂部</p>  
        <p type="p">282b:足部</p>  
        <p type="p">284:表面處理層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3124" publication-number="202628279"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628279.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>順應性屏蔽件、電性連接器、電子裝置、電子系統、印刷電路板以及用於電性連接器的安裝介面的組件</chinese-title>  
        <english-title>COMPLIANT SHIELD, ELECTRICAL CONNECTOR, ELECTRONIC DEVICE, ELECTRONIC SYSTEM, PRINTED CIRCUIT BOARD AND COMPONENT FOR MOUNTING INTERFACE OF ELECTRICAL CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120260324B">H01R13/658</main-classification>  
        <further-classification edition="201101120260324B">H01R13/6581</further-classification>  
        <further-classification edition="201101120260324B">H01R12/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安芬諾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPHENOL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅文徹　丹尼爾　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROVENCHER, DANIEL B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋路司　馬克　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAILUS, MARK W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在連接器與諸如PCB之基板之間具有順應性屏蔽件之互連系統。該順應性屏蔽件可在該連接器內部的屏蔽件與該PCB之接地結構之間提供電流路徑。該連接器、順應性屏蔽件及PCB可經配置以在相對於訊號導體之位置中提供電流，從而為藉由該等訊號導體運送的訊號提供合乎需要的訊號完整性。在一些實施例中，電流路徑可相鄰該等訊號導體，而在橫向方向上偏移一對導體之軸。此種路徑可藉由自連接器屏蔽件延伸的突片產生。該順應性屏蔽件之順應性導電構件可接觸該等突片及該PCB之表面上的導電襯墊。自該表面襯墊至內部接地結構延伸的陰影通孔可定位成相鄰該等突片之尖端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An interconnection system with a compliant shield between a connector and a substrate such as a PCB. The compliant shield may provide current flow paths between shields internal to the connector and ground structures of the PCB. The connector, compliant shield and PCB may be configured to provide current flow in locations relative to signal conductors that provide desirable signal integrity for signals carried by the signal conductors. In some embodiments, the current flow paths may be adjacent the signal conductors, offset in a transverse direction from an axis of a pair of conductors. Such paths may be created by tabs extending from connector shields. A compliant conductive member of the compliant shield may contact the tabs and a conductive pad on a surface of the PCB. Shadow vias, running from the surface pad to internal ground structures may be positioned adjacent the tip of the tabs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:連接器/底板連接器</p>  
        <p type="p">210:接點尾部</p>  
        <p type="p">220:配接介面</p>  
        <p type="p">600:連接器/子卡連接器</p>  
        <p type="p">610:接點尾部</p>  
        <p type="p">612:支撐構件</p>  
        <p type="p">614:支撐構件</p>  
        <p type="p">620:配接介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3125" publication-number="202626739"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626739.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙特異性抗體</chinese-title>  
        <english-title>BISPECIFIC ANTIBODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07K16/28</main-classification>  
        <further-classification edition="200601120260401B">C07K16/46</further-classification>  
        <further-classification edition="200601120260401B">A61K39/395</further-classification>  
        <further-classification edition="200601120260401B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商小野藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴山史朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAYAMA, SHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>手塚智也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEZUKA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特爾斯白　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THORSBY, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪克夫　科內利斯　亞德里恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE KRUIF, CORNELIS ADRIAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡羅　彼得　福克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN LOO, PIETER FOKKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克羅斯特　林斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLOOSTER, RINSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅弗斯　羅伯特斯　科內利斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROOVERS, ROBERTUS CORNELIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供一種用於對自體免疫疾病之預防、症狀進展抑制、復發抑制或治療的新穎藥劑。 &lt;br/&gt;本發明之發明人等專心檢討的結果，著眼於PD-1/CD19雙特異性抗體等作為可解決該課題之物質，確認該雙特異性抗體可成為用於自體免疫疾病之預防、症狀進展抑制、復發抑制或治療的新穎藥劑。再者，確認該雙特異性抗體具有容許PD-1與屬於其配體之PD-L1之間的相互作用的特徴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a new drug for prevention, suppression of symptom progression, recurrence suppression or treatment for autoimmune diseases. &lt;br/&gt;As a result of diligent studies, the inventors of the present invention have focused attention on PD-1/CD19 bispecific antibody and the like as a substance capable of solving such problems, and confirmed that the bispecific antibody can be a new drug for prevention, suppression of symptom progression, suppression of recurrence or treatment for autoimmune diseases. In addition, it was confirmed that the bispecific antibody has a characteristic that allows interaction with PD-1 and its ligand, PD-L1.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3126" publication-number="202628861"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628861.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用石墨烯合成工具的擴散耦合成方法</chinese-title>  
        <english-title>DIFFUSION-COUPLE SYNTHESIS METHOD USING A GRAPHENE SYNTHESIS TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260323B">H10P70/00</main-classification>  
        <further-classification edition="200601120260323B">C23C8/64</further-classification>  
        <further-classification edition="201701120260323B">C01B32/182</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商迪斯尼２Ｄ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESTINATION 2D INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊延加　拉維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYENGAR, RAVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴納吉　考斯塔夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANERJEE, KAUSTAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克朗奎斯特　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRONQUIST, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用經改造或未經改造的商用接合工具執行的擴散偶合成方法，該方法包括以下步驟：提供基板負載，該基板負載包含至少兩片已加工基板；其中該工具可以在其製程腔室內對該基板施加壓力和升高的溫度；將該基板負載放置在該製程腔室內；施加該壓力和該升高的溫度；其中，該至少兩片已加工基板包含碳化層，直接配置在一個擴散層上，該擴散層直接配置在一氧化層上，並包含元件基板，其上配置該氧化物層。該至少兩片已加工基板中的一片配置在另一片上方，其中，該至少兩片已加工基板中的一片的元件基板直接配置在該至少兩片已加工基板的另一片的碳源層上方；以及在該至少兩片已加工基板中的每一片的氧化物層與擴散層間的介面形成石墨烯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diffusion-couple synthesis method using a modified or unchanged commercial bonding tool comprising: providing a substrate load which comprises at least two prepared substrates; wherein said tool can apply pressure and elevated temperature to said substrate within a process chamber; placing said substrate load within said process chamber; applying said pressure and said elevated temperature; wherein each of said at least two prepared substrates comprises a carbon source disposed directly atop a diffusion layer, the diffusion layer disposed directly atop an oxide layer, and a device substrate with the oxide layer disposed atop, one of said at least two prepared substrates is disposed above another, wherein the device substrate of one of said at least two prepared substrates is directly atop said carbon source of other of said at least two prepared substrates; and forming graphene at an interface between said oxide layer and said diffusion layer of each of said at least two prepared substrates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:基板負載</p>  
        <p type="p">1101:上方接合/合成施力/液壓缸</p>  
        <p type="p">1102:底部接合/合成施力/液壓缸</p>  
        <p type="p">1105:上方加熱器/加熱板</p>  
        <p type="p">1107:底部加熱器/加熱板</p>  
        <p type="p">1110:上方過渡板</p>  
        <p type="p">1115:底部過渡板</p>  
        <p type="p">1120:基板/晶圓</p>  
        <p type="p">1130:犧牲擴散層</p>  
        <p type="p">1140:碳源層</p>  
        <p type="p">1160:施力方向標示</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3127" publication-number="202627291"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627291.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>外燃燒轉子引擎及多轉子外燃燒引擎</chinese-title>  
        <english-title>EXTERNAL COMBUSTION ROTARY ENGINE AND MULTIPLE ROTOR EXTERNAL COMBUSTION ENGINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">F02B53/08</main-classification>  
        <further-classification edition="200601120260331B">F02B19/10</further-classification>  
        <further-classification edition="200601120260331B">F02C3/00</further-classification>  
        <further-classification edition="200601120260331B">F02C7/00</further-classification>  
        <further-classification edition="200601120260331B">F02G1/00</further-classification>  
        <further-classification edition="200601120260331B">F01C1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　克安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟　安妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, ANNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　克安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一個外形像溫克爾引擎（Wankel engine）但燃燒室在引擎體外的轉子引擎。與溫克爾引擎不同的是：1. 燃燒發生在引擎體外的專責燃燒室而且引擎內腔也被區分為專責的空氣壓縮室及專責的燃氣膨脹室，2. 連續燃燒取代衝程燃燒， 3. 專責而且連續的燃燒提供了使用種種手段改善燃燒效益及減少排汙的機會。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Winkel engine alike rotary engine with a dedicated external combustion chamber. Unlike a Winkel engine: 1. the combustion occurs in a dedicated external combustion chamber, and inside of the engine body is divided into a dedicated air compression chamber and a dedicated gas expansion chamber, 2. Continuos combustion replaces pulsive combustion. 3. Dedicated and continuos combustion provided the opportunity to use various methods to improve the combustion efficiency and emissions reduction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:氣缸</p>  
        <p type="p">120:前外殼蓋</p>  
        <p type="p">130:後外殼蓋</p>  
        <p type="p">200:主軸</p>  
        <p type="p">300:轉子</p>  
        <p type="p">400:外燃燒器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3128" publication-number="202628853"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628853.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H10P56/00</main-classification>  
        <further-classification edition="202601120260326B">H10P50/60</further-classification>  
        <further-classification edition="202601120260326B">H10P54/92</further-classification>  
        <further-classification edition="202601120260326B">H10P54/94</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商沖電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKI ELECTRIC INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊田孝寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古田裕典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTA, HIRONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川兼一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGAWA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小酒達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北島由隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAJIMA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置的製造方法包括：準備半導體堆疊體，其中半導體堆疊體包含堆疊於基板上方的犧牲層、堆疊於犧牲層上的第一阻障層、以及堆疊於第一阻障層上的半導體層，第一阻障層相較於犧牲層對預定蝕刻劑具有較小蝕刻速率，半導體層具有位於基板側的第一面，半導體層的第一面與第一阻障層接觸；使半導體層的第一面小於與第一面接觸的第一阻障層的面；在使半導體層的第一面較小之後，形成保護膜，以覆蓋半導體層中除第一面以外的部分，保護膜對去除犧牲層的預定蝕刻劑具有抗性；在形成保護膜之後，使用預定蝕刻劑去除犧牲層；以及將半導體層從基板分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor device comprises : preparing a semiconductor stacked body including a sacrificial layer stacked above a substrate, a first barrier layer stacked on the sacrificial layer and having a lower etching rate with respect to a predetermined etchant than an etching rate of the sacrificial layer, and a semiconductor layer stacked on the first barrier layer and having a first surface on the substrate side, the first surface of the semiconductor layer being in contact with first barrier layer, making the first surface of the semiconductor layer smaller than a surface of the first barrier layer in contact with the first surface, forming a protection film so as to cover the semiconductor layer except for the first surface after the first surface is made smaller, the protection film having resistivity to the predetermined etchant for removing the sacrificial layer, removing the sacrificial layer using the predetermined etchant after the protection film is formed, and separating the semiconductor layer from the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:堆疊晶圓</p>  
        <p type="p">111:生長基板(基板)</p>  
        <p type="p">112:緩衝層</p>  
        <p type="p">113:下阻障層(第四層)</p>  
        <p type="p">114:保持層(第一層)</p>  
        <p type="p">115:犧牲層(第二層)</p>  
        <p type="p">116:上阻障層(第三層)</p>  
        <p type="p">117,119:披覆層</p>  
        <p type="p">118:光吸收層</p>  
        <p type="p">120:接觸層</p>  
        <p type="p">133:功能層(半導體層)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3129" publication-number="202626105"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626105.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎ＩＬ－２序列及其用途</chinese-title>  
        <english-title>NOVEL IL-2 SEQUENCES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">A61K47/60</main-classification>  
        <further-classification edition="200601120260401B">A61K38/20</further-classification>  
        <further-classification edition="200601120260401B">C07K14/55</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商阿森迪斯腫瘤製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASCENDIS PHARMA ONCOLOGY DIVISION A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛娜森　妮娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUNNARSSON, NINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅樂克斯　梅帝斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALECKIS, MATISS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LV</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森　大衛　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSEN, DAVID B</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於式Ala - SEQ A - Cys* - SEQ B (I)之IL-2蛋白序列，其中SEQ A與SEQ ID NO: 1具有至少94%序列一致性；SEQ B與SEQ ID NO: 2具有至少94%序列一致性；Ala為丙胺酸殘基；且Cys*為半胱胺酸殘基；其結合物及其用於治療癌症之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an IL-2 protein sequence of the formula Ala - SEQ A - Cys* - SEQ B (I), wherein SEQ A has at least 94% sequence identity to SEQ ID NO:1; SEQ B has at least 94% sequence identity to SEQ ID NO:2; Ala is an alanine residue; and Cys* is a cysteine residue; to conjugates thereof and their uses in the treatment of cancer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3130" publication-number="202628849"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628849.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於減輕半導體切割中之裂縫蜿蜒之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR MITIGATING CRACK MEANDERING IN SEMICONDUCTOR DICING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260322B">H10P54/30</main-classification>  
        <further-classification edition="202601120260322B">H10P54/92</further-classification>  
        <further-classification edition="202601120260322B">H10P50/28</further-classification>  
        <further-classification edition="202601120260322B">H10P58/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　韋伯哈夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, VIBHAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　韋章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, WEI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　新耘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XINYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邦薩　拉吉　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANSAL, RAJ K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　騰隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, TENG LEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中揭示用於減輕裂縫蜿蜒之系統及方法。在一些實施例中，該方法包含在一晶圓之一上表面之計畫劃線區上方形成一金屬層，接著選擇性地圖案化及/或蝕刻該金屬層以在該等計畫劃線區上方形成複數個隔離線。接著，該方法可包含將一鈍化材料沈積於該複數個隔離線上方。相鄰隔離線可彼此分開一足夠小的距離以中斷沈積程序，藉此在該等相鄰隔離線之各者之間之該鈍化材料中產生一間隙。該等間隙及/或藉由蝕刻該鈍化材料穿過該等間隙而在該晶圓之頂表面中形成之溝槽可幫助在一隱形切割程序期間吸引裂縫，藉此減少該等裂縫蜿蜒遠離該等計畫劃線區之量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for mitigating crack meandering, are disclosed herein. In some embodiments, the method includes forming a metallic layer over planned scribe regions of an upper surface of a wafer, then selectively patterning and/or etching the metallic layer to form a plurality of isolated lines over the planned scribe regions. The method can then include depositing a passivation material over the plurality of isolated lines. Adjacent isolated lines can be separated from each other by a small enough distance to disrupt the deposition process, thereby creating a gap in the passivation material between each of the adjacent isolated lines. The gaps and/or trenches formed in the top surface of the wafer by etching the passivation material through the gaps can help attract cracks during a stealth dicing process, thereby reducing the amount the cracks meander away from the planned scribe regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">702:基底基板</p>  
        <p type="p">712:第一電路系統層</p>  
        <p type="p">713:頂表面</p>  
        <p type="p">714:第二電路系統層</p>  
        <p type="p">715a:中心區</p>  
        <p type="p">715b:周邊區</p>  
        <p type="p">716:第三電路系統層</p>  
        <p type="p">722:半導體晶粒</p>  
        <p type="p">740:裂縫吸引特徵部</p>  
        <p type="p">742:隔離線</p>  
        <p type="p">748:溝槽</p>  
        <p type="p">749:分割溝槽</p>  
        <p type="p">770:內部電子器件</p>  
        <p type="p">772:陣列結構</p>  
        <p type="p">774:佈線結構</p>  
        <p type="p">776:外部接合墊</p>  
        <p type="p">778:犧牲製造結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3131" publication-number="202626690"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626690.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成被塗覆基板之方法</chinese-title>  
        <english-title>METHOD FOR FORMING A COATED SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07F7/22</main-classification>  
        <further-classification edition="200601120260401B">G03F7/004</further-classification>  
        <further-classification edition="200601120260401B">G03F7/20</further-classification>  
        <further-classification edition="200601120260401B">G03F7/16</further-classification>  
        <further-classification edition="200601120260401B">G03F7/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英培雅股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INPRIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡丁紐　布萊恩Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARDINEAU, BRIAN J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厄爾雷　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EARLEY, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬巴赫　杜魯門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAMBACH, TRUMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由有機硫化錫（及硒化錫）簇來闡述利用紫外光及極紫外光進行圖案化。該等簇於室溫下係固體，且可溶於極性不太強之有機溶劑中。輻照可使碳金屬鍵斷裂或者使不飽和有機部分交聯，以穩定被輻照材料。然後，被輻照材料係抵抗於有機溶劑中之溶解，使得未輻照材料可與一有機溶劑接觸，以對藉由輻射形成之潛像進行顯影。可輻射圖案化層可藉由塗覆一溶液或藉由氣相沈積而形成。闡述對應之前驅物溶液、結構及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Patterning with UV and EUV light is described with organo tin sulfide (and selenide) clusters. The clusters are solids at room temperature and are soluble in organic solvents that are not too polar. Irradiation can either fragment a carbon metal bond or crosslink unsaturated organic moieties to stabilize the irradiated material. The irradiated material then resist dissolving in organic solvents so that the un-irradiated material can be contacted with an organic solvent to develop the latent image formed with the radiation. Radiation patternable layers can be formed through coating a solution or through vapor deposition. Corresponding precursor solutions, structures and methods are described.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3132" publication-number="202628378"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628378.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109714</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>於分佈式輸入及分佈式輸出之無線通信中應用頻道互易以用於射頻校準之系統</chinese-title>  
        <english-title>SYSTEMS FOR RADIO FREQUENCY CALIBRATION EXPLOITING CHANNEL RECIPROCITY IN DISTRIBUTED INPUT DISTRIBUTED OUTPUT WIRELESS COMMUNICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260322B">H04B7/0452</main-classification>  
        <further-classification edition="201701120260322B">H04B7/0456</further-classification>  
        <further-classification edition="201501120260322B">H04B17/12</further-classification>  
        <further-classification edition="200901120260322B">H04W16/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商李爾登公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REARDEN, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛倫沙　安東尼奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORENZA, ANTONIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽比　法迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIBI, FADI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮特曼　提摩西　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PITMAN, TIMOTHY A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波爾曼　史蒂芬　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERLMAN, STEPHEN G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明闡述應用上行鏈路/下行鏈路頻道互易以用於一具有多使用者(MU)傳輸之多天線系統(MAS) (「MU-MAS」)中之射頻(RF)校準之系統及方法。該RF校準用於基於上行鏈路頻道估計而計算開環下行鏈路預編碼器，藉此避免如在閉環方案中之頻道狀態資訊之回饋附加項。舉例而言，一項實施例之一MU-MAS包括一無線蜂巢網路，該無線蜂巢網路具有經由預編碼方法而協作地操作以消除用戶端間干擾且增加網路容量的一個或多個信標台、多個用戶端器件及多個分佈式天線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods are described for radio frequency (RF) calibration in a multiple antenna system (MAS) with multi-user (MU) transmissions (“MU-MAS”) exploiting uplink/downlink channel reciprocity. The RF calibration is used to compute open-loop downlink precoder based on uplink channel estimates, thereby avoiding feedback overhead for channel state information as in closed-loop schemes. For example, a MU-MAS of one embodiment comprises a wireless cellular network with one or multiple beacon stations, multiple client devices and multiple distributed antennas operating cooperatively via precoding methods to eliminate inter-client interference and increase network capacity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1601:分佈式天線</p>  
        <p type="p">1602:基頻單元</p>  
        <p type="p">1603:傳輸射頻鏈</p>  
        <p type="p">1604:接收射頻鏈</p>  
        <p type="p">1605:射頻切換單元</p>  
        <p type="p">1606:天線</p>  
        <p type="p">1607:基地台網路</p>  
        <p type="p">1608:基頻單元</p>  
        <p type="p">1609:傳輸射頻鏈</p>  
        <p type="p">1610:接收射頻鏈</p>  
        <p type="p">1611:射頻切換器</p>  
        <p type="p">1612:天線</p>  
        <p type="p">1613:使用者設備</p>  
        <p type="p">1614:基頻單元</p>  
        <p type="p">1615:傳輸射頻鏈</p>  
        <p type="p">1616:接收射頻鏈</p>  
        <p type="p">1617:射頻切換器</p>  
        <p type="p">1618:天線</p>  
        <p type="p">1619:信標台</p>  
        <p type="p">1620:回饋頻道</p>  
        <p type="p">1621:集中式處理器</p>  
        <p type="p">1622:下行鏈路頻道矩陣</p>  
        <p type="p">1623:上行鏈路頻道矩陣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3133" publication-number="202628110"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628110.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109743</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非揮發性半導體記憶體</chinese-title>  
        <english-title>NONVOLATILE SEMICONDUCTOR MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G11C16/26</main-classification>  
        <further-classification edition="200601120260325B">G11C16/24</further-classification>  
        <further-classification edition="200601120260325B">G11C16/04</further-classification>  
        <further-classification edition="200601120260325B">G11C7/06</further-classification>  
        <further-classification edition="202301120260325B">H10B41/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前嶋洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEJIMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施形態提供一種用於神經網絡之記憶體系統、記憶體控制器、及半導體記憶裝置。 實施形態之記憶體系統具備：控制部，其發送包含第1資料之第1指令集；及半導體記憶裝置，其藉由從上述控制部接收上述第1指令集，將基於上述第1指令集之第2資料發送至上述控制部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ADD:位址</p>  
        <p type="p">AR:讀出電壓</p>  
        <p type="p">BR:讀出電壓</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLC:控制信號</p>  
        <p type="p">BLX:控制信號</p>  
        <p type="p">CR:讀出電壓</p>  
        <p type="p">DATA:輸入資料</p>  
        <p type="p">DQ:信號</p>  
        <p type="p">HLL:控制信號</p>  
        <p type="p">INV:節點</p>  
        <p type="p">R/Bn:就緒/忙碌信號</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">STB:控制信號</p>  
        <p type="p">S1001:步驟</p>  
        <p type="p">S1002-S1009:步驟</p>  
        <p type="p">S1010:步驟</p>  
        <p type="p">T1:時刻</p>  
        <p type="p">T2:時刻</p>  
        <p type="p">T3:時刻</p>  
        <p type="p">T4:時刻</p>  
        <p type="p">T5:時刻</p>  
        <p type="p">T6:時刻</p>  
        <p type="p">T7:時刻</p>  
        <p type="p">VBL:電位</p>  
        <p type="p">Vblc:電位</p>  
        <p type="p">Vss:電位</p>  
        <p type="p">VSL:電位</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">XAH:第1指令</p>  
        <p type="p">XBH:第2指令</p>  
        <p type="p">XXL:控制信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3134" publication-number="202628528"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628528.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109755</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設備</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260324B">H05K7/14</main-classification>  
        <further-classification edition="200601120260324B">H05K7/02</further-classification>  
        <further-classification edition="200601120260324B">H05K5/02</further-classification>  
        <further-classification edition="200601120260324B">H05K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱書敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, SHUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚魏强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, WEIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例公開了一種電子設備，該電子設備包括殼體、金屬連接件、主控板、固定支架、導電層、彈性導電接頭和柔性線路板，金屬連接件連接在殼體上的安裝槽內，固定支架和主控板設置在殼體內，導電層採用PDS製程形成在固定支架頂面、連接面和外側面上，彈性導電接頭的兩端分別與金屬連接件和導電層電連接，柔性線路板的一端與導電層電連接，柔性線路板的另一端與主控板電連接，從而將金屬連接件上產生的靜電通過柔性線路板放電傳導至主控板的接地點。該電子設備中金屬連接件的接地方式簡單，零件數量少，簡化了組裝流程且實現了靜電防護的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of the present invention discloses an electronic device, which includes a housing, a metal connector, a main control board, a fixing bracket, a conductive layer, an elastic conductive connector, and a flexible circuit board. The metal connector is installed in a mounting slot on the housing. The fixing bracket and the main control board are arranged inside the housing. The conductive layer is formed on the top surface, connection surface, and outer surface of the fixing bracket using PDS technology. Both ends of the elastic conductive connector are electrically connected to the metal connector and the conductive layer, respectively. One end of the flexible circuit board is electrically connected to the conductive layer, while the other end is electrically connected to the main control board, thereby discharging and conducting static electricity generated on the metal connector to the grounding point of the main control board through the flexible circuit board. This grounding method for the metal connector in the electronic device is simple, reduces the number of parts, simplifies the assembly process, and effectively provides electrostatic protection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">11:空腔</p>  
        <p type="p">14:限位塊</p>  
        <p type="p">4:固定支架</p>  
        <p type="p">6:柔性線路板</p>  
        <p type="p">8:抵接支架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3135" publication-number="202628137"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628137.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設備</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260320B">H01C1/06</main-classification>  
        <further-classification edition="200601120260320B">H01R13/11</further-classification>  
        <further-classification edition="201201120260320B">G03F1/40</further-classification>  
        <further-classification edition="200601120260320B">H05K1/11</further-classification>  
        <further-classification edition="200601120260320B">H05K5/06</further-classification>  
        <further-classification edition="200601120260320B">H05K7/14</further-classification>  
        <further-classification edition="202501120260320B">H05K5/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱書敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, SHUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚魏强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, WEIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例公開了一種電子設備，該電子設備包括殼體、金屬連接件、主控板、固定支架、導電層、彈性導電接頭和柔性線路板，金屬連接件連接在殼體上的安裝槽內，固定支架和主控板設置在殼體內，導電層採用PDS製程形成在固定支架頂面、連接面和外側面上，彈性導電接頭的兩端分別與金屬連接件和導電層電連接，柔性線路板的一端與導電層電連接，柔性線路板的另一端與主控板電連接，從而將金屬連接件上產生的靜電通過柔性線路板放電傳導至主控板的接地點。該電子設備中金屬連接件的接地方式簡單，零件數量少，簡化了組裝流程且實現了靜電防護的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of the present invention discloses an electronic device, which includes a housing, a metal connector, a main control board, a fixing bracket, a conductive layer, an elastic conductive connector, and a flexible circuit board. The metal connector is installed in a mounting slot on the housing. The fixing bracket and the main control board are arranged inside the housing. The conductive layer is formed on the top surface, connection surface, and outer surface of the fixing bracket using PDS technology. Both ends of the elastic conductive connector are electrically connected to the metal connector and the conductive layer, respectively. One end of the flexible circuit board is electrically connected to the conductive layer, while the other end is electrically connected to the main control board, thereby discharging and conducting static electricity generated on the metal connector to the grounding point of the main control board through the flexible circuit board. This grounding method for the metal connector in the electronic device is simple, reduces the number of parts, simplifies the assembly process, and effectively provides electrostatic protection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">11:空腔</p>  
        <p type="p">14:限位塊</p>  
        <p type="p">4:固定支架</p>  
        <p type="p">6:柔性線路板</p>  
        <p type="p">8:抵接支架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3136" publication-number="202628552"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628552.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設備</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">H05K9/00</main-classification>  
        <further-classification edition="200601120260327B">H05F3/02</further-classification>  
        <further-classification edition="200601120260327B">H05K5/02</further-classification>  
        <further-classification edition="200601120260327B">H05K1/02</further-classification>  
        <further-classification edition="201101120260327B">H01R12/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱書敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, SHUMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚魏强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, WEIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例公開了一種電子設備，該電子設備包括殼體、金屬連接件、主控板、固定支架、導電層和柔性線路板，金屬連接件連接在殼體上的安裝槽內，固定支架和主控板設置在殼體內，導電層採用PDS製程形成在固定支架頂面、連接面和外側面上，金屬連接件和導電層通過導電膠形成電連接，柔性線路板的一端與導電層電連接，柔性線路板的另一端與主控板電連接，從而將金屬連接件上產生的靜電通過柔性線路板放電傳導至主控板的接地點。該電子設備中金屬連接件的接地方式簡單，零件數量少，簡化了組裝流程且實現了靜電防護的作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The embodiment of the present invention discloses an electronic device, which includes a housing, a metal connector, a main control board, a fixing bracket, a conductive layer, and a flexible circuit board. The metal connector is installed in a mounting slot on the housing. The fixing bracket and the main control board are arranged inside the housing. The conductive layer is formed on the top surface, connection surface, and outer surface of the fixing bracket using PDS technology. The metal connector and the conductive layer are electrically connected through conductive adhesive. One end of the flexible circuit board is electrically connected to the conductive layer, while the other end is electrically connected to the main control board, thereby discharging and conducting static electricity generated on the metal connector to the grounding point of the main control board through the flexible circuit board. This grounding method for the metal connector in the electronic device is simple, reduces the number of parts, simplifies the assembly process, and effectively provides electrostatic protection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">11:空腔</p>  
        <p type="p">14:限位塊</p>  
        <p type="p">4:固定支架</p>  
        <p type="p">6:柔性線路板</p>  
        <p type="p">8:抵接支架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3137" publication-number="202626422"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626422.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有自動電源連接器之座桿總成</chinese-title>  
        <english-title>SEAT POST ASSEMBLY WITH AUTOMATIC POWER CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">B62J1/08</main-classification>  
        <further-classification edition="200601120260321B">B62J1/06</further-classification>  
        <further-classification edition="202001120260321B">B62J11/19</further-classification>  
        <further-classification edition="202001120260321B">B62J43/20</further-classification>  
        <further-classification edition="202001120260321B">B62J43/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商速聯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRAM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬丹　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JORDAN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧拉普　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNLAP, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓恩　賽吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAHN, SAGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一座桿總成包括：一第一管，其可沿著一軸線在一第一位置與一第二位置之間移動；以及一第二管，其可沿著該軸線相對於該第一管在一縮回位置與一延伸位置之間伸縮地移動。一定位總成係組配來相對於該第一管可調整地定位該第二管。一電氣致動器經調適來在該第一管從該第一位置移動至該第二位置時自動電氣連接至一電源，且在該第一管從該第二位置移動至該第一位置時自動與該電源電氣斷開。該電氣致動器為可移動的，來在該第一管位於該第二位置時，響應於經調適從該電源被傳輸的一電流而致動該定位總成，以相對於該第一管可調整地定位該第二管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A seat post assembly includes a first tube moveable along an axis between a first position and a second position and a second tube telescopically moveable along the axis relative to the first tube between a retracted position and an extended position. A positioning assembly configured to adjustably position the second tube relative to the first tube. An electric actuator is adapted to be automatically electrically connected to a power source when the first tube is moved from the first position to the second position, and automatically electrically disconnected from the power source when the first tube is moved from the second position to the first position. The electric actuator is movable to actuate the positioning assembly in response to an electrical current adapted to be transmitted from the power source when the first tube is in the first position to adjustably position the second tube relative to the second tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:下部第一管；第一管；下部管；管</p>  
        <p type="p">202:上部第二管；第二管</p>  
        <p type="p">204:端部部分；底端部分；下端部分</p>  
        <p type="p">210:電氣連接器；連接器</p>  
        <p type="p">212:端部端子；端子</p>  
        <p type="p">214:正電壓導線；可撓性導線；連接導線；電氣導線；導線</p>  
        <p type="p">220:彈簧偏壓構件；偏壓構件；彈簧</p>  
        <p type="p">400:電氣致動器；電動致動器；致動器</p>  
        <p type="p">402:閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3138" publication-number="202627249"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627249.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109864</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含結合ＣＤ３及ＣＤ１３７的改變的抗體可變區之抗原結合分子</chinese-title>  
        <english-title>ANTIGEN-BINDING MOLECULE COMPRISING ALTERED ANTIBODY VARIABLE REGION BINDING CD3 AND CD137</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">C40B30/04</main-classification>  
        <further-classification edition="200601120260331B">C07K16/28</further-classification>  
        <further-classification edition="200601120260331B">C12N15/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中外製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何菽　文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHU WEN SAMANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣庭奈緒香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRONIWA, NAOKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井実香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, MIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, TARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井川智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGAWA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可結合至CD3及CD137但不同時結合至CD3及CD137的抗原結合域及其使用方法。亦提供更有效率地獲得結合二種或更多種抗原的抗原結合域的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Antigen-binding domains that are capable of binding to CD3 and CD137 but do not bind to CD3 and CD137 at the same time and methods of using the same are provided. Methods to obtain antigen binding domains which bind to two or more different antigens more efficiently are also provided.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3139" publication-number="202628485"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628485.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傳導式電子武器及由傳導式電子武器執行之方法</chinese-title>  
        <english-title>CONDUCTED ELECTRICAL WEAPON AND METHOD PERFORMED BY A CONDUCTED ELECTRICAL WEAPON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">H05C1/06</main-classification>  
        <further-classification edition="200601120260325B">H05C3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛克勝企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AXON ENTERPRISE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼罕　梅格尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NERHEIM, MAGNE H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩亞拉揚　維倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATHYANARAYAN, VARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可　瑞安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARKLE, RYAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">由傳導式電子武器傳遞至目標之刺激訊號之持續時間可依照傳遞至該目標之刺激訊號之電流來選擇。該電流可藉由該傳導式電子武器量測。該電流可包括該刺激訊號之脈衝之量測電流。該持續時間可在該脈衝被傳遞至該目標的同時來選擇。該持續時間可從該刺激訊號可被施加之持續時間的範圍來選擇。該持續時間之範圍可包括依照量測電流之範圍之各自量測電流與增加脈衝持續時間之各自脈衝持續時間之組合而與由該刺激訊號提供之增加電荷之範圍相關聯之該增加脈衝持續時間之範圍。由量測電流傳遞之電荷及選定之持續時間可隨著該量測電流減小而增加。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A duration of a stimulus signal delivered to a target by a conducted electrical weapon may be selected in accordance with a current of the stimulus signal delivered to the target. The current may be measured by the conducted electrical weapon. The current may comprise a measured current of a pulse of the stimulus signal. The duration may be selected while the pulse is delivered to the target. The duration may be selected from a range of durations for which the stimulus signal may be applied. The range of durations may comprise a range of increasing pulse durations associated with a range of increasing charges provided by the stimulus signal in accordance with combinations of respective measured currents of a range of measured currents and respective pulse durations of the increasing pulse durations. A charge delivered by a measured current and a selected duration may increase as the measured current decreases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:傳導式電子武器</p>  
        <p type="p">210:處理器</p>  
        <p type="p">220:源</p>  
        <p type="p">230-1:第一電極</p>  
        <p type="p">230-2:第二電極</p>  
        <p type="p">232:導電長絲</p>  
        <p type="p">260:目標</p>  
        <p type="p">265:負載阻抗</p>  
        <p type="p">270:峰值電流感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3140" publication-number="202626157"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626157.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合高爾夫系統及其控制方法</chinese-title>  
        <english-title>HYBRID GOLF SYSTEM AND CONTROL METHOD FOR THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">A63B71/04</main-classification>  
        <further-classification edition="200601120260326B">A63B69/36</further-classification>  
        <further-classification edition="200601120260326B">A63B71/06</further-classification>  
        <further-classification edition="200601120260326B">A63B63/00</further-classification>  
        <further-classification edition="200601120260326B">G03B21/56</further-classification>  
        <further-classification edition="200601120260326B">G03B21/14</further-classification>  
        <further-classification edition="201501320260326B">A63B102/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商高爾縱股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOLFZON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉裁允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OK, JAE YOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秉泄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, BYOUNG SEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種混合高爾夫系統及其控制方法，該系統使得多個使用者能夠在混合高爾夫球艙內部進行虛擬高爾夫以及隨後的場地高爾夫，從而能夠在不受周邊氣溫或天氣等的影響的情況下進行高爾夫打球，並且當在混合高爾夫球艙內進行場地高爾夫時，使得所有用戶的球位置及相應的資訊能夠被有效地傳遞至用戶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">U1、U2、U3、U4:使用者</p>  
        <p type="p">100:混合高爾夫球艙</p>  
        <p type="p">102:虛擬高爾夫區域</p>  
        <p type="p">104:場地高爾夫區域</p>  
        <p type="p">201:影像</p>  
        <p type="p">202:載台</p>  
        <p type="p">204:螢幕</p>  
        <p type="p">206:擊球區</p>  
        <p type="p">210:模擬器</p>  
        <p type="p">300:果嶺投影儀</p>  
        <p type="p">400:實際果嶺</p>  
        <p type="p">410:洞杯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3141" publication-number="202627413"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627413.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109951</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>翹曲量估算裝置及翹曲量估算方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G01B11/24</main-classification>  
        <further-classification edition="200601120260327B">G01B11/02</further-classification>  
        <further-classification edition="202601120260327B">H10P74/00</further-classification>  
        <further-classification edition="200601120260327B">G03F7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清冨晶子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIYOTOMI, AKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">即使是基板的翹曲較大時，也可以在裝置不至於大型化之情況下，估算基板的翹曲量。 &lt;br/&gt;　　[解決手段]估算基板的翹曲量的翹曲量估算裝置，該翹曲量估算裝置具備：獲取部，其獲取估算對象基板的一個面的拍攝圖像；計算部，其對前述估算對象基板之前述一個面的拍攝圖像中的基板徑向的像素值之變化率進行計算；及估算部，其根據事先求出的基板之前述一個面的拍攝圖像中的基板徑向的像素值之變化率與基板的翹曲量之間的相關關係以及前述計算部的計算結果，來估算前述估算對象基板的翹曲量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:控制部</p>  
        <p type="p">210:記憶部</p>  
        <p type="p">220:獲取部</p>  
        <p type="p">230:計算部</p>  
        <p type="p">240:估算部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3142" publication-number="202628138"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628138.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電阻器、電流感測電阻器、電池分流器、分流電阻器及製造方法</chinese-title>  
        <english-title>RESISTORS, CURRENT SENSE RESISTORS, BATTERY SHUNTS, SHUNT RESISTORS, AND METHODS OF MAKING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">H01C1/14</main-classification>  
        <further-classification edition="200601120260326B">H01C13/02</further-classification>  
        <further-classification edition="200601120260326B">H01C17/232</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商維謝戴爾電子有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISHAY DALE ELECTRONICS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏德　泰德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WYATT, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯特許　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERTSCH, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強生　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勞斯　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRAUSE, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VO, SARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛蘭　達林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLENN, DARIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示複數個電阻器。該電阻器可包括一或多個電阻性元件及複數個導電部分。可經組態以調整該電阻器之電阻溫度係數（TCR）值的開口或槽經形成於該等電阻性元件中。該等開口或槽之形狀、數量及定向可改變。在一個態樣中，頭部總成經提供用於相對於該等電阻器緊固或固持接腳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plurality of resistors are disclosed herein. The resistor may include one or more resistive elements and a plurality of conductive portions. Openings or slots, which can be configured to adjust temperature coefficient of resistance (TCR) values of the resistor, are formed in the resistive elements. The shape, quantity, and orientation of the openings or slots can vary. In one aspect, header assemblies are provided for securing or holding pins relative to the resistors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">610:電阻器</p>  
        <p type="p">611:電阻性元件</p>  
        <p type="p">612:第一導電部分</p>  
        <p type="p">614:第二導電部分</p>  
        <p type="p">672、676:槽/開口/TCR調整槽/TCR調整開口</p>  
        <p type="p">672a、672b、676a、676b:彎曲末端</p>  
        <p type="p">X1:第一方向</p>  
        <p type="p">X2:第二方向</p>  
        <p type="p">Y1:方向</p>  
        <p type="p">Y2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3143" publication-number="202625920"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625920.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高度可調節系統的防護頭盔組件</chinese-title>  
        <english-title>PROTECTIVE HELMET ASSEMBLY WITH HIGHT ADJUSTABLE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">A42B3/14</main-classification>  
        <further-classification edition="200601120260326B">A42B3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商ＭＳＡ　歐洲有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSA EUROPE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路易　古埃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOUIS, GUAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯蒂安　弗里松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRISTIAN, FRISON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米蓮娜　沙吉歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILENA, SAGGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹尼斯　可廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENIS, COTTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強納森　路克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JONATHAN, ROUX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種防護頭盔組件，包括至少一個外殼，用以至少部分地圍繞使用者的頭部；至少一個頭盔懸掛系統，用於與外殼連接，其中該組件還包括至少一個連接元件，連接元件至少間接地連接到外殼並至少間接地連接到頭盔懸掛系統，其中連接元件的長度是可調節的，且連接元件包括至少一個可彎曲連接件，其中連接件的第一段從至少一個第一附接元件延伸到至少一個第二附接元件，第一附接元件包括至少一個第一開口，連接件穿過該開口，其中第一段的長度是可調節的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The application is directed a protective helmet assembly comprising at least one outer shell configured for surrounding at least partly a head of a user; at least one helmet suspension adapted to be coupled to the outer shell, wherein the assembly further comprises at least one link element configured to be at least indirectly connected to the outer shell and at least indirectly connected to the helmet suspension, wherein the length of the link element is adjustable and the link element comprises at least one bendable elongate connection member, wherein further a first section of the connection member is extending from at least one first attachment element to at least one second attachment element, the first attachment element comprises at least one opening through which the connection member is extending, and wherein the length of the first section is adjustable.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:防護頭盔組件</p>  
        <p type="p">3:外殼</p>  
        <p type="p">5:帽子</p>  
        <p type="p">7:使用者</p>  
        <p type="p">9:頭部</p>  
        <p type="p">11:高度調節裝置</p>  
        <p type="p">13:連接元件</p>  
        <p type="p">15:第一附接元件</p>  
        <p type="p">17:第二附接元件</p>  
        <p type="p">19:帶子</p>  
        <p type="p">21:第一段</p>  
        <p type="p">23:第二段</p>  
        <p type="p">25:第一端</p>  
        <p type="p">27:第二端</p>  
        <p type="p">h:高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3144" publication-number="202627315"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627315.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115109974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組接結構及其組接方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260326B">F16B21/12</main-classification>  
        <further-classification edition="200601120260326B">B25B27/00</further-classification>  
        <further-classification edition="200601120260326B">F16B5/02</further-classification>  
        <further-classification edition="200601120260326B">F16B19/00</further-classification>  
        <further-classification edition="200601120260326B">F16B21/07</further-classification>  
        <further-classification edition="200601120260326B">F16B35/06</further-classification>  
        <further-classification edition="200601120260326B">F16B37/04</further-classification>  
        <further-classification edition="200601120260326B">F16B43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鼎瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鼎瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種組接結構及其組接方法，其包含一頭部、一桿體及一組接體；該頭部具有側向之設置部以及直向之穿置部；該桿體具有側向之組設部及一扣體；該桿體係穿設於該頭部之穿置部，且使該組設部與該設置部對應，該組接體係穿設於該組設部與該設置部，用以組合該頭部與該桿體；另外，更可於該頭部活動組合一身部。藉此，可於結合至少兩物體時，係由該頭部進行操作帶動桿體進行扣接或脫離，而達到快速結合以及易於卸除之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:頭部</p>  
        <p type="p">111:穿置部</p>  
        <p type="p">112:設置部</p>  
        <p type="p">12:桿體</p>  
        <p type="p">121:扣部</p>  
        <p type="p">122:組設部</p>  
        <p type="p">13:組接體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3145" publication-number="202627218"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627218.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電化學純化氫氣之裝置、系統及方法</chinese-title>  
        <english-title>DEVICES, SYSTEMS, AND METHODS FOR ELECTROCHEMICALLY PURIFYING HYDROGEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260324B">C25B9/19</main-classification>  
        <further-classification edition="202101120260324B">C25B1/04</further-classification>  
        <further-classification edition="200601120260324B">C25B15/08</further-classification>  
        <further-classification edition="202601120260324B">C01B3/50</further-classification>  
        <further-classification edition="200601120260324B">C01B3/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒德洛　達里爾　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUDLOW, DARYL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒德洛　達里爾　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUDLOW, DARYL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供氫氣純化器電化學單元（10、50、150）、用於純化氫氣之系統（200）以及用於純化氫氣之方法。該單元、系統及方法採用雙膜電極（DMEA）電化學單元（24、26、152），其增加純化同時避免習知單元之複雜性及成本。可藉由從單元中去除至少一些中間氣體雜質來增加由單元、系統及方法製造之氫氣之純度。亦可藉由將氫氣引入到單元中以補充任何損失的氫來增加由單元、系統及方法製造之氫氣之純度。本發明亦揭示水電解電化學單元（250）及電解水以製造氫氣之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Hydrogen gas purifier electrochemical cells (10, 50, 150), systems (200) for purifying hydrogen gas, and methods for purifying hydrogen gas are provided. The cells, systems, and methods employ double membrane electrode (DMEA) electrochemical cells (24, 26, 152) that enhance purification while avoiding the complexity and cost of conventional cells. The purity of the hydrogen gas produced by the cells, systems, and methods can be enhanced by removing at least some intermediate gas impurities from the cells. The purity of the hydrogen gas produced by the cells, systems, and methods can also be enhanced be introducing hydrogen gas to the cells to replenish any lost hydrogen. Water electrolyzing electrochemical cells (250) and methods of electrolyzing water to produce hydrogen gas are also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氫氣純化器單元</p>  
        <p type="p">12:第一氣流/進料氣流</p>  
        <p type="p">13:氣流/廢氣流</p>  
        <p type="p">14:第一氫氣含量</p>  
        <p type="p">16:第一雜質氣體含量/非氫氣體</p>  
        <p type="p">18:非氫氣體含量氣流/第三氣流</p>  
        <p type="p">20:增加的氫氣含量/第三氫氣含量</p>  
        <p type="p">22:非氫氣體含量/第二雜質氣體含量/第三雜質氣體含量</p>  
        <p type="p">24:第一膜電極組件</p>  
        <p type="p">26:第二膜電極組件</p>  
        <p type="p">28:第一電極/第一陽極</p>  
        <p type="p">30:第一電解質</p>  
        <p type="p">32:第一陰極</p>  
        <p type="p">34:第二氫氣含量</p>  
        <p type="p">36:非氫氣體含量/第二雜質氣體含量</p>  
        <p type="p">38:第二氣流</p>  
        <p type="p">40:第二陽極</p>  
        <p type="p">41:第二陽極40產生之電子被引導回到第一陰極32</p>  
        <p type="p">42:第二電解質</p>  
        <p type="p">44:第二陰極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3146" publication-number="202626493"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626493.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電化學純化氫氣之裝置、系統及方法</chinese-title>  
        <english-title>DEVICES, SYSTEMS, AND METHODS FOR ELECTROCHEMICALLY PURIFYING HYDROGEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">C01B3/50</main-classification>  
        <further-classification edition="200601120260326B">C01B3/58</further-classification>  
        <further-classification edition="202101120260326B">C25B1/04</further-classification>  
        <further-classification edition="202101120260326B">C25B9/23</further-classification>  
        <further-classification edition="201601120260326B">H01M8/1004</further-classification>  
        <further-classification edition="202101120260326B">C25B11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒德洛　達里爾　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUDLOW, DARYL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒德洛　達里爾　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUDLOW, DARYL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供氫氣純化器電化學單元（10、50、150）、用於純化氫氣之系統（200）以及用於純化氫氣之方法。該單元、系統及方法採用雙膜電極（DMEA）電化學單元（24、26、152），其增加純化同時避免習知單元之複雜性及成本。可藉由從單元中去除至少一些中間氣體雜質來增加由單元、系統及方法製造之氫氣之純度。亦可藉由將氫氣引入到單元中以補充任何損失的氫來增加由單元、系統及方法製造之氫氣之純度。本發明亦揭示水電解電化學單元（250）及電解水以製造氫氣之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Hydrogen gas purifier electrochemical cells (10, 50, 150), systems (200) for purifying hydrogen gas, and methods for purifying hydrogen gas are provided. The cells, systems, and methods employ double membrane electrode (DMEA) electrochemical cells (24, 26, 152) that enhance purification while avoiding the complexity and cost of conventional cells. The purity of the hydrogen gas produced by the cells, systems, and methods can be enhanced by removing at least some intermediate gas impurities from the cells. The purity of the hydrogen gas produced by the cells, systems, and methods can also be enhanced be introducing hydrogen gas to the cells to replenish any lost hydrogen. Water electrolyzing electrochemical cells (250) and methods of electrolyzing water to produce hydrogen gas are also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氫氣純化器單元</p>  
        <p type="p">12:第一氣流/進料氣流</p>  
        <p type="p">13:氣流/廢氣流</p>  
        <p type="p">14:第一氫氣含量</p>  
        <p type="p">16:第一雜質氣體含量/非氫氣體</p>  
        <p type="p">18:非氫氣體含量氣流/第三氣流</p>  
        <p type="p">20:增加的氫氣含量/第三氫氣含量</p>  
        <p type="p">22:非氫氣體含量/第二雜質氣體含量/第三雜質氣體含量</p>  
        <p type="p">24:第一膜電極組件</p>  
        <p type="p">26:第二膜電極組件</p>  
        <p type="p">28:第一電極/第一陽極</p>  
        <p type="p">30:第一電解質</p>  
        <p type="p">32:第一陰極</p>  
        <p type="p">34:第二氫氣含量</p>  
        <p type="p">36:非氫氣體含量/第二雜質氣體含量</p>  
        <p type="p">38:第二氣流</p>  
        <p type="p">40:第二陽極</p>  
        <p type="p">41:第二陽極40產生之電子被引導回到第一陰極32</p>  
        <p type="p">42:第二電解質</p>  
        <p type="p">44:第二陰極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3147" publication-number="202627601"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627601.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110109</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260321B">G02B11/32</main-classification>  
        <further-classification edition="200601120260321B">G02B13/18</further-classification>  
        <further-classification edition="200601120260321B">G02B9/62</further-classification>  
        <further-classification edition="200601120260321B">G02B13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉晶光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖華濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HUABIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，從物側至像側沿一光軸依序包括一第一透鏡、一第二透鏡、一第三透鏡、一第四透鏡、一第五透鏡及一第六透鏡，其中第一透鏡至第六透鏡各自包括一朝向物側且使成像光線通過的物側面及一朝向像側且使成像光線通過的像側面。第二透鏡具有正屈光率，且第二透鏡的物側面的一圓周區域為凸面。第三透鏡的物側面的一光軸區域為凸面。第四透鏡的物側面的一光軸區域為凹面。第五透鏡具有正屈光率。第六透鏡的物側面的一圓周區域為凹面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens includes a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element from an object side to an image side in order along an optical axis. The first lens element to the sixth lens element each include an object-side surface facing the object side and allowing imaging rays to pass through and an image-side surface facing the image side and allowing the imaging rays to pass through. The second lens element has positive refracting power, and a periphery region of the object-side surface of the second lens element is convex. An optical axis region of the object-side surface of the third lens element is convex. An optical axis region of the object-side surface of the fourth lens element is concave. The fifth lens element has positive refracting power. A periphery region of the object-side surface of the sixth lens element is concave.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學成像鏡頭</p>  
        <p type="p">0:光圈</p>  
        <p type="p">1:第一透鏡</p>  
        <p type="p">2:第二透鏡</p>  
        <p type="p">3:第三透鏡</p>  
        <p type="p">4:第四透鏡</p>  
        <p type="p">5:第五透鏡</p>  
        <p type="p">6:第六透鏡</p>  
        <p type="p">9:濾光片</p>  
        <p type="p">15、25、35、45、55、65、95:物側面</p>  
        <p type="p">16、26、36、46、56、66、96:像側面</p>  
        <p type="p">99:成像面</p>  
        <p type="p">151、162、251、261、351、362、452、461、551、562、651、662:光軸區域</p>  
        <p type="p">153、164、253、263、354、364、453、463、554、563、654、663:圓周區域</p>  
        <p type="p">I:光軸</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3148" publication-number="202628104"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628104.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110189</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G11C16/02</main-classification>  
        <further-classification edition="200601120260327B">G11C16/06</further-classification>  
        <further-classification edition="200601120260327B">G11C16/08</further-classification>  
        <further-classification edition="200601120260327B">G11C16/10</further-classification>  
        <further-classification edition="200601120260327B">G11C16/26</further-classification>  
        <further-classification edition="200601120260327B">G11C16/34</further-classification>  
        <further-classification edition="202301120260327B">H10B12/00</further-classification>  
        <further-classification edition="202301120260327B">H10B43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前嶋洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEJIMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施形態在於抑制非選擇記憶串之讀取干擾。 &lt;br/&gt;實施形態之半導體記憶裝置具備記憶串，該記憶串具備第1及第2選擇電晶體以及複數個記憶胞。於讀出動作中，對源極線施加高於接地電壓之第1電壓，對連接於所選擇之記憶串之第1及第2選擇閘極線，施加將第1及第2選擇電晶體設為接通狀態之第2電壓。於讀出動作之第1期間，對連接於非選擇之記憶串之第1選擇閘極線施加第2電壓，於讀出動作之繼第1期間之後之第2期間，對連接於非選擇之記憶串之第1選擇閘極線施加第3電壓，該第3電壓高於接地電壓，且為對第1電壓加上第1選擇電晶體之閾值而得之電壓以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BL:位元線</p>  
        <p type="p">SGD:選擇閘極線</p>  
        <p type="p">SGS:選擇閘極線</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">VCGRV:電壓</p>  
        <p type="p">Vpre:預充電電壓</p>  
        <p type="p">VREAD:電壓</p>  
        <p type="p">Vss:接地電壓</p>  
        <p type="p">VSRC:電壓</p>  
        <p type="p">VSG:電壓</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3149" publication-number="202627793"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627793.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相位偵測自動對焦及相關多重取樣</chinese-title>  
        <english-title>PHASE DETECTION AUTO FOCUS AND CORRELATED MULTIPLE SAMPLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260325B">G06F7/57</main-classification>  
        <further-classification edition="202301120260325B">H04N25/75</further-classification>  
        <further-classification edition="202301120260325B">H04N25/704</further-classification>  
        <further-classification edition="200601120260325B">H03M7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種算數邏輯單元，其包含：一GC轉二進位級；一加法器級；一加法器輸出級；一加法器輸入鎖存器級，其經耦合以鎖存該GC轉二進位級之輸出；一回饋多工器級，其經耦合以接收該GC轉二進位級之該等輸出；一鎖存器輸出多工器，其經耦合以接收第一加法器輸入鎖存器之輸出，其中該鎖存器輸出多工器經組態以將該等第一加法器輸入鎖存器之該等輸出乘以-1抑或-2；及一加法器輸入多工器級，其中該加法器輸入多工器級之第一輸入經耦合以接收該鎖存器輸出多工器之輸出，且該加法器輸入多工器級之第二輸入經耦合以接收第二加法器輸入鎖存器之輸出。該算術邏輯對影像感測像素執行自適應相關多重取樣，且對其他像素執行相位偵測自動對焦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An arithmetic logic unit includes a GC to binary stage, an adder stage, an adder output stage, an adder input latch stage coupled to latch outputs of the GC to binary stage, a feedback multiplexer stage coupled to receive the outputs of the GC to binary stage, a latch output multiplexer coupled to receive outputs of the first adder input latches, where the latch output multiplexer is configured to multiply the outputs of the first adder input latches by either -1 or -2, and an adder input multiplexer stage, where first inputs of the adder input multiplexer stage are coupled to receive outputs of the latch output multiplexer and second inputs of the adder input multiplexer stage are coupled to receive outputs of the second adder input latches. The arithmetic logic performs adaptive correlated multiple sampling for image sensing pixels and phase detection auto focus for other pixels.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">418:算數邏輯單元(ALU)</p>  
        <p type="p">422:12位元格雷碼q_gc&amp;lt;11：0&amp;gt;</p>  
        <p type="p">426:前端鎖存器級</p>  
        <p type="p">428:信號鎖存器級</p>  
        <p type="p">430:格雷碼(GC)轉二進位級</p>  
        <p type="p">431:加法器輸入鎖存器級</p>  
        <p type="p">432a:第一加法器輸入鎖存器</p>  
        <p type="p">432b:第二加法器輸入鎖存器</p>  
        <p type="p">433:回饋多工器級</p>  
        <p type="p">434:第一回饋多工器</p>  
        <p type="p">435:第二回饋多工器</p>  
        <p type="p">436:鎖存器輸出多工器</p>  
        <p type="p">437:加法器輸入多工器級</p>  
        <p type="p">438:加法器級</p>  
        <p type="p">439:加法器輸出級</p>  
        <p type="p">440a:第一資料鎖存器</p>  
        <p type="p">440b:第二資料鎖存器</p>  
        <p type="p">442:資料鎖存器級</p>  
        <p type="p">443a:輸出開關rwl_pdl</p>  
        <p type="p">443b:輸出開關rwl_cdssig</p>  
        <p type="p">444:脈衝產生器</p>  
        <p type="p">447:輸出位元rbl&amp;lt;11：0&amp;gt;</p>  
        <p type="p">450:比較器輸出cmpout</p>  
        <p type="p">452:前端鎖存器使能信號</p>  
        <p type="p">454:信號鎖存器使能信號wen_sig</p>  
        <p type="p">456a:第一加法器輸入鎖存器使能信號wen_1st</p>  
        <p type="p">456b:第二加法器輸入鎖存器使能信號wen_2nd</p>  
        <p type="p">458:導線</p>  
        <p type="p">464a:第一資料鎖存器使能信號wwl_PDL</p>  
        <p type="p">464b:第二資料鎖存器使能信號wwl_sum</p>  
        <p type="p">470:判定區塊</p>  
        <p type="p">472:飽和電路</p>  
        <p type="p">474:相位偵測自動對焦(PDAF)電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3150" publication-number="202628585"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628585.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260327B">H10B41/30</main-classification>  
        <further-classification edition="202601120260327B">H10P76/00</further-classification>  
        <further-classification edition="200601120260327B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐貫朋也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANUKI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前嶋洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEJIMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內海哲章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTSUMI, TETSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式提供一種能夠提高動作之可靠性之半導體記憶裝置。 &lt;br/&gt;實施方式之半導體記憶裝置具備：記憶胞，其設置於基板之上方；高電壓產生電路26-1，其設置於基板與記憶胞之間，且產生向記憶胞供給之高電壓；及高電壓產生電路26-2，其設置於基板與記憶胞之間，產生上述高電壓，且具有與高電壓產生電路26-1等效之電路構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體記憶裝置</p>  
        <p type="p">11A:記憶胞陣列</p>  
        <p type="p">15A,15B:列解碼器</p>  
        <p type="p">16A:感測放大器</p>  
        <p type="p">19:資料暫存器</p>  
        <p type="p">20:行解碼器</p>  
        <p type="p">21:輸入輸出電路</p>  
        <p type="p">22:邏輯控制電路</p>  
        <p type="p">23:就緒/忙碌電路</p>  
        <p type="p">24-1,24-2:行邏輯控制電路</p>  
        <p type="p">25-1,25-2:列邏輯控制電路</p>  
        <p type="p">26-1,26-2:高電壓產生電路</p>  
        <p type="p">27-1,27-2:低電壓產生電路</p>  
        <p type="p">28:驅動器</p>  
        <p type="p">29:定序儀</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3151" publication-number="202628622"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628622.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110223</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及形成其之方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10D30/01</main-classification>  
        <further-classification edition="202501120260327B">H10D30/62</further-classification>  
        <further-classification edition="202501120260327B">H10D64/27</further-classification>  
        <further-classification edition="202501120260327B">H10D64/68</further-classification>  
        <further-classification edition="202501120260327B">H10D89/10</further-classification>  
        <further-classification edition="202601120260327B">H10P14/43</further-classification>  
        <further-classification edition="202601120260327B">H10P14/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TSUNG HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱冠璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUAN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEN-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仲強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUNG-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容之實施例提供半導體裝置結構及形成其之方法。該方法包括自一基體形成一鰭片結構，且該鰭片結構包括複數個半導體層。該方法進一步包括沉積環繞該等複數個半導體層中之各半導體層之一部分的一閘極介電層，在該閘極介電層上沉積一黏著層，且該黏著層包圍該等複數個半導體層中之各半導體層之該部分。該方法進一步包括在該黏著層上沉積一含氟層，且該含氟層包圍該等複數個半導體層中之各半導體層之該部分。該方法進一步包括在該含氟層上執行一退火製程，移除該含氟層及該黏著層，且在該閘極介電層上形成一閘極電極層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a semiconductor device structure and methods of forming the same. The method includes forming a fin structure from a substrate, and the fin structure includes a plurality of semiconductor layers. The method further includes depositing a gate dielectric layer around a portion of each semiconductor layer of the plurality of semiconductor layers, depositing an adhesion layer on the gate dielectric layer, and the adhesion layer surrounds the portion of each semiconductor layer of the plurality of semiconductor layers. The method further includes depositing a fluorine-containing layer on the adhesion layer, and the fluorine-containing layer surrounds the portion of each semiconductor layer of the plurality of semiconductor layers. The method further includes performing an annealing process on the fluorine-containing layer, removing the fluorine-containing layer and the adhesion layer, and forming a gate electrode layer on the gate dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">101:基體</p>  
        <p type="p">106:第一半導體層</p>  
        <p type="p">108:第二半導體層</p>  
        <p type="p">116:基體部分</p>  
        <p type="p">118:絕緣材料</p>  
        <p type="p">119:元件</p>  
        <p type="p">120:隔離區</p>  
        <p type="p">130:犧牲閘極結構</p>  
        <p type="p">132:犧牲閘極介電層</p>  
        <p type="p">134:犧牲閘極電極層</p>  
        <p type="p">136:遮罩層</p>  
        <p type="p">138:閘極間隔件</p>  
        <p type="p">A-A,B-B,C-C:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3152" publication-number="202628049"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628049.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置的亮度差異補償方法</chinese-title>  
        <english-title>LUMINANCE DIFFERENCE COMPENSATING METHOD OF DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260330B">G09G3/32</main-classification>  
        <further-classification edition="202001120260330B">H05B45/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李鐘範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JONG-BEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金世恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SE-EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴宰慜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JAEMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露一方面，顯示裝置的亮度差異補償方法包含測量第一驅動電晶體的汲極電極與子像素的第二驅動電晶體的源極電極間之節點上感測電壓偏差；從感測電壓偏差計算第一驅動電晶體的第一閾值電壓偏差；從第一閾值電壓偏差和預測資訊計算第二驅動電晶體的第二閾值電壓偏差；基於第一閾值電壓偏差補償第一資料電壓以將補償後的第一資料電壓施加至第一驅動電晶體；以及基於第二閾值電壓偏差補償第二資料電壓以將補償後的第二資料電壓施加至第二驅動電晶體，預測資訊為基於應力偏壓與時間確定的第一閾值電壓偏差與第二閾值電壓偏差之差值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an aspect of the present disclosure, a luminance difference compensating method of a display device includes measuring a sensing voltage variance at a node between a first driving transistor and a second driving transistor of a sub pixel; calculating a first threshold voltage variance of the first driving transistor from the sensing voltage variance; calculating a second threshold voltage variance of the second driving transistor from the first threshold voltage variance and a prediction information; compensating for a first data voltage based on the first threshold voltage variance; and compensating for a second data voltage based on the second threshold voltage variance, and the prediction information is a difference value of the first threshold voltage variance and the second threshold voltage variance according to a stress bias and a time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置</p>  
        <p type="p">SP:子像素</p>  
        <p type="p">PN:顯示面板</p>  
        <p type="p">GD:閘極驅動器</p>  
        <p type="p">DD:資料驅動器</p>  
        <p type="p">SL:掃描線</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">TC:時序控制器</p>  
        <p type="p">AA:主動區域</p>  
        <p type="p">NA:非主動區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3153" publication-number="202628812"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628812.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P34/42</main-classification>  
        <further-classification edition="202601120260327B">H10P52/00</further-classification>  
        <further-classification edition="202601120260327B">H10P72/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田之上隼斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANOUE, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為：於由第1基板與第2基板接合成的重合基板中，將第2基板從第1基板適當地剝離。作為解決上述課題之技術手段，本發明提供一種處理由第1基板與係矽基板之第2基板所接合成的重合基板之基板處理裝置，具有：程式收納部，將程式予以收納；電腦，從該程式收納部讀出該程式，並使該程式運作；雷射照射部；以及剝離部；且該程式，係在電腦上運作、俾使該基板處理裝置執行基板處理方法的程式；於該第2基板，從該第2基板側將剝離促進層及雷射吸收層依此順序疊層形成；該基板處理方法包含如下步驟：在該雷射照射部中，藉由從該第2基板側對該雷射吸收層照射遠紅外線波長之雷射光，而使應力產生於該雷射吸收層與該剝離促進層的界面，從而使該雷射吸收層與該剝離促進層的接合強度降低之步驟；以及在該剝離部中，沿著該雷射吸收層與該剝離促進層之邊界，將該第2基板從該第1基板剝離之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to appropriately release a second substrate from a first substrate in a compound substrate in which the first substrate and the second substrate are bonded together. As a means for solving the above-described problem, the present invention provides a device for processing compound substrate in which a first substrate and a second substrate, which is a silicon substrate, are bonded together, the device includes: a program storage that stores a program, a computer that reads the program from the program storage and executes the program, a laser irradiation unit, and a releasing unit; &lt;br/&gt;the program is a program that operates on the computer so that the device executes a substrate processing method; &lt;br/&gt;on the second substrate, a release promotion layer and a laser absorption layer being laminated and formed, in that order, from the side of the second substrate; &lt;br/&gt;the substrate processing method includes: a step in the laser irradiation unit, of irradiating laser light having a far-infrared wavelength onto the laser absorption layer from the side of the second substrate, thereby generating stress at an interface between the laser absorption layer and the release promotion layer and reducing bonding strength between the laser absorption layer and the release promotion layer, and a step in the releasing unit, of releasing the second substrate from the first substrate along the interface between the laser absorption layer and the release promotion layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓處理系統</p>  
        <p type="p">10:晶圓匣盒載置台</p>  
        <p type="p">20,40:晶圓搬送裝置</p>  
        <p type="p">21,41:搬送路</p>  
        <p type="p">22,42:搬送臂</p>  
        <p type="p">30:傳送裝置</p>  
        <p type="p">50:邊緣去除裝置</p>  
        <p type="p">60:清洗裝置</p>  
        <p type="p">70:內部用雷射照射裝置</p>  
        <p type="p">80:界面用雷射照射裝置</p>  
        <p type="p">90:控制裝置</p>  
        <p type="p">Ct,Cw1,Cw2:晶圓匣盒</p>  
        <p type="p">G1:搬出入區塊</p>  
        <p type="p">G2:搬送區塊</p>  
        <p type="p">G3:處理區塊</p>  
        <p type="p">H:記錄媒體</p>  
        <p type="p">T:重合晶圓</p>  
        <p type="p">W1:第1晶圓</p>  
        <p type="p">W2:第2晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3154" publication-number="202627453"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627453.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置以及檢查方法</chinese-title>  
        <english-title>INSPECTION APPARATUS AND INSPECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">G01N21/88</main-classification>  
        <further-classification edition="200601120260327B">G01N21/956</further-classification>  
        <further-classification edition="201401120260327B">G01N21/35</further-classification>  
        <further-classification edition="202301120260327B">G06F18/24</further-classification>  
        <further-classification edition="202201120260327B">G06V10/70</further-classification>  
        <further-classification edition="201701120260327B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩見順一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIOMI, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西原栄治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIHARA, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田有美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANETA, YUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">檢查裝置1係具備：圖像取得部2，係使用可見光來取得基板的可見光圖像並使用紅外光來取得基板的紅外光圖像；檢查部41，係對可見光圖像及紅外光圖像分別執行檢查處理並檢測基板的缺陷；以及缺陷種別判定部42，係根據針對藉由檢查部41所檢測的缺陷的可見光圖像的檢查處理結果、紅外光圖像的檢查處理結果以及該缺陷的存在區域的區域種別，判定該缺陷的缺陷種別。藉此，能詳細地判定缺陷的缺陷種別。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Inspection apparatus 1 includes an image obtaining part 2 that obtains a visible light image of a substrate using visible light and that obtains an infrared light image of the substrate using infrared light, an inspection part 41 that performs inspection processing on each of the visible light image and infrared light image to detect a defect of the substrate, and a defect type determination part 42 that determines a defect type of the defect on the basis of the inspection processing results of the visible light image and the infrared light image with respect to the defect detected by the inspection part 41 and an area type of presence area of the defect. It is therefore possible to determine a defect type of the defect in detail.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢查裝置</p>  
        <p type="p">2:圖像取得部</p>  
        <p type="p">4:檢查運算部</p>  
        <p type="p">35:顯示部</p>  
        <p type="p">41:檢查部</p>  
        <p type="p">42:缺陷種別判定部</p>  
        <p type="p">43:顯示控制部</p>  
        <p type="p">411:檢查資料集</p>  
        <p type="p">421:缺陷判定矩陣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3155" publication-number="202628999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合式被動構件的接合結構</chinese-title>  
        <english-title>BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10W44/00</main-classification>  
        <further-classification edition="202601120260327B">H10W40/10</further-classification>  
        <further-classification edition="202301120260327B">H10N97/00</further-classification>  
        <further-classification edition="202601120260327B">H10D80/00</further-classification>  
        <further-classification edition="202601120260327B">H10W72/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫海默德　伊利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAMMED, ILYAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古發拉　加百列　Ｚ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUEVARA, GABRIEL Z.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪拉克魯茲　賈維爾　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELACRUZ, JAVIER A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　少武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHAOWU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡雷米　蘿拉　威爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRKARIMI, LAURA WILLS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在各種具體實例中，揭示一種接合結構。該接合結構可包括一元件及一被動電子構件，該被動電子構件具有接合至該元件之一第一表面及與該第一表面相對之一第二表面。該被動電子構件可包含：一第一陽極端子，其接合至該元件之一對應的第二陽極端子；及一第一陰極端子，其接合至該元件之一對應的第二陰極端子。該第一陽極端子及該第一陰極端子可安置於該被動電子構件之該第一表面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:接合結構</p>  
        <p type="p">2:半導體元件</p>  
        <p type="p">3:被動電子構件</p>  
        <p type="p">4:電接點/互連件</p>  
        <p type="p">5:封裝基板</p>  
        <p type="p">6:焊球</p>  
        <p type="p">11:作用表面</p>  
        <p type="p">12:第一表面</p>  
        <p type="p">13:第二外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3156" publication-number="202628703"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628703.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有減少橫向溢出整合電容器重設及安定時間之像素設計</chinese-title>  
        <english-title>PIXEL DESIGNS WITH REDUCED LOFIC RESET AND SETTLING TIMES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260327B">H10F39/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商豪威科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, ZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許程成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, CHENGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　東霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DENNIS TUNGLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代　鐵軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, TIEJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示具有減少LOFIC重設及安定時間之像素設計。在一項實施例中，一種像素單元包含：一光電感測器，其經組態以回應於入射光而光生影像電荷；一浮動擴散，其用於自該光電感測器接收該影像電荷；一轉移電晶體，其耦合於該浮動擴散與該光電感測器之間以將該影像電荷轉移至該浮動擴散；以及一第一重設電晶體，其耦合於該浮動擴散與電壓供應器之間。該像素單元進一步包含具有兩個端之一電容器及一第二重設電晶體。該電容器之一第一端耦合至該浮動擴散。該第二重設電晶體耦合於該電容器之一第二端與該電壓供應器之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Pixel designs with reduced LOFIC reset and settling times are disclosed herein. In one embodiment, a pixel cell includes a photosensor configured to photogenerate image charge in response to incident light, a floating diffusion to receive the image charge from the photosensor, a transfer transistor coupled between the floating diffusion and the photosensor to transfer the image charge to the floating diffusion, and a first reset transistor coupled between the floating diffusion and the voltage supply. The pixel cell further includes a capacitor having two ends, and a second reset transistor. A first end of the capacitor is coupled to the floating diffusion. The second reset transistor is coupled between a second end of the capacitor and the voltage supply.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">204:像素單元</p>  
        <p type="p">210:列控制電路</p>  
        <p type="p">212:行位元線</p>  
        <p type="p">214:光電感測器</p>  
        <p type="p">222:轉移電晶體</p>  
        <p type="p">226:列驅動器</p>  
        <p type="p">227:寄生電容</p>  
        <p type="p">228:開關</p>  
        <p type="p">230:浮動擴散</p>  
        <p type="p">232:源極隨耦器電晶體</p>  
        <p type="p">234:列選擇電晶體</p>  
        <p type="p">236:第一重設電晶體</p>  
        <p type="p">237:第二重設電晶體</p>  
        <p type="p">238:雙浮動擴散(DFD)電晶體</p>  
        <p type="p">240:橫向溢出整合電容器(LOFIC)</p>  
        <p type="p">242:LOFIC電晶體</p>  
        <p type="p">243:第一LOFIC節點</p>  
        <p type="p">245:第二LOFIC節點</p>  
        <p type="p">250:框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3157" publication-number="202628127"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628127.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於指出杭納氏病變之程式、已學習之模型及其生成方法、以及膀胱內視鏡之控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260327B">G16H30/40</main-classification>  
        <further-classification edition="201801120260327B">G16H50/20</further-classification>  
        <further-classification edition="201801120260327B">G16H50/50</further-classification>  
        <further-classification edition="201901120260327B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田朋宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古魯西尼可夫　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRUSHNIKOV, ANDREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種無論醫生之知識或熟練程度如何，均能夠準確且快速地掌握患者之杭納氏（Hunner）病變之通用技術。提供一種於間質性膀胱炎之準確診斷、對間質性膀胱炎患者之救助、國際共識之形成之任一方面均找到顯著進展之技術。 &lt;br/&gt;本發明包含一種學習模型生成方法、已學習之模型、及程式，上述學習模型生成方法係取得膀胱中之杭納氏病變之內視鏡影像資料作為指導資料，使用上述指導資料生成學習模型，該學習模型將膀胱內視鏡影像作為輸入並將該膀胱內視鏡影像中之杭納氏病變之位置指出作為輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3158" publication-number="202626051"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626051.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物或其藥劑學上可接受的鹽用於製造實性瘤治療用醫藥組成物之用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">A61K31/53</main-classification>  
        <further-classification edition="200601120260401B">A61K31/538</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4035</further-classification>  
        <further-classification edition="200601120260401B">A61K31/416</further-classification>  
        <further-classification edition="200601120260401B">A61K31/4184</further-classification>  
        <further-classification edition="200601120260401B">A61K31/439</further-classification>  
        <further-classification edition="200601120260401B">A61P35/00</further-classification>  
        <further-classification edition="200601120260401B">A61P1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商衛材Ｒ＆Ｄ企管股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EISAI R&amp;D MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉井俊行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAI, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永尾聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種實性瘤治療用醫藥組成物，其包含式(I)所表示的(6S,9aS)-N-苄基-8-({6-[3-(4-乙基哌𠯤-1-基)四氫吖唉-1-基]吡啶-2-基}甲基)-6-(2-氟-4-羥基苄基)-4,7-二側氧基-2-(丙-2-烯-1-基)六氫-2H-吡𠯤并[2,1-c][1,2,4]三𠯤-1(6H)-甲醯胺（化合物A）或其藥劑學上可接受的鹽，化合物A或其藥劑學上可接受的鹽按1天2次、每次以化合物A計約10 mg至約150 mg的量，與對抑制消化系統症狀有效量的5-HT&lt;sub&gt;3&lt;/sub&gt;受體拮抗劑一起向人類受試者投與，所述消化系統症狀係由向人類受試者投與化合物A或其藥劑學上可接受的鹽所引起的消化系統症狀。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="215px" width="409px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3159" publication-number="202626889"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626889.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性樹脂組成物的製造方法、熱硬化性樹脂組成物及電子零件裝置</chinese-title>  
        <english-title>METHOD OF MANUFACTURING THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, AND ELECTRONIC COMPONENT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260327B">C08J3/20</main-classification>  
        <further-classification edition="200601120260327B">C08G59/20</further-classification>  
        <further-classification edition="200601120260327B">C08G59/62</further-classification>  
        <further-classification edition="200601120260327B">C08G59/68</further-classification>  
        <further-classification edition="200601120260327B">C08L63/00</further-classification>  
        <further-classification edition="200601120260327B">B29B7/00</further-classification>  
        <further-classification edition="200601120260327B">C08K5/49</further-classification>  
        <further-classification edition="200601120260327B">C08K3/36</further-classification>  
        <further-classification edition="202201120260327B">C01F7/785</further-classification>  
        <further-classification edition="200601120260327B">C08L91/06</further-classification>  
        <further-classification edition="200601120260327B">C08K3/04</further-classification>  
        <further-classification edition="202601120260327B">H10W74/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜東哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, DONGCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山浦格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAURA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村岳博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野澤博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOZAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪昌勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, CHANGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平嶋克至</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAJIMA, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">熱硬化性樹脂組成物的製造方法包括：一次混練，對熱硬化性樹脂進行混練；以及二次混練，於所述一次混練後添加硬化促進劑進一步進行混練。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a thermosetting resin composition includes a first kneading of kneading a thermosetting resin and a second kneading of further kneading the thermosetting resin after adding a curing accelerator following the first kneading.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主材投入口</p>  
        <p type="p">2:側向進料器</p>  
        <p type="p">10:混練擠出機</p>  
        <p type="p">A:第一混練部</p>  
        <p type="p">B:第二混練部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3160" publication-number="202628958"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628958.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110715</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理系統及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260327B">H10P95/00</main-classification>  
        <further-classification edition="202601120260327B">H10P72/30</further-classification>  
        <further-classification edition="202601120260327B">H10P72/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金川耕三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAGAWA, KOUZOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴崎廣太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUSAKI, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隠塚恵二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONZUKA, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甲斐義広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAI, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可將一併處理之複數片基板的間距縮窄，且可抑制基板與搬運機器人的干涉之技術。本發明之基板處理系統，具備：批次處理部，將隔著第1間距包含複數片基板的基板批一併處理；單片處理部，將該基板批之該基板逐片處理；以及介面部，於該批次處理部與該單片處理部之間傳遞該基板；該批次處理部，包含：貯存塊狀或霧狀之處理液的處理槽、隔著該第1間距保持該基板的第1保持具、及將隔著該第1間距之N(N為2以上的自然數)倍的第2間距排列之該基板於該處理液中從該第1保持具承接的第2保持具；該介面部包含搬運部，其將於該處理液中分開保持在該第1保持具與該第2保持具之該基板，從該批次處理部搬運至該單片處理部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide technology that can narrow the pitch between a plurality of substrates processed as a batch, and can suppress interference between the substrates and transportation robots. A substrate processing system of the invention comprises a batch processing section which processes, in a single batch, a lot containing a plurality of substrates at a first pitch, a single wafer processing section which processes the substrates in the lot individually, and an interface section which passes the substrates between the batch processing section and the single wafer processing section, wherein the batch processing section comprises a processing tank which holds a process liquid in an aggregate or mist form, a first holding tool which holds the substrates at the first pitch, and a second holding tool which receives, in the process liquid, the substrates aligned at a second pitch that is N times the first pitch (where N is a natural number of 2 or higher) from the first holding device, and the interface section comprises a transport section which transports the substrates held by the first holding device and the second holding device in the process liquid from the batch processing section to the single wafer processing section.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理系統</p>  
        <p type="p">2:搬出入部</p>  
        <p type="p">21:載置台</p>  
        <p type="p">22:載置板</p>  
        <p type="p">23:第1搬運區域</p>  
        <p type="p">24:第1搬運裝置</p>  
        <p type="p">25:傳遞部</p>  
        <p type="p">26:第1過渡裝置</p>  
        <p type="p">3:單片處理部</p>  
        <p type="p">31:第2搬運區域</p>  
        <p type="p">32:第2搬運裝置</p>  
        <p type="p">33:第2過渡裝置</p>  
        <p type="p">34:液體處理裝置</p>  
        <p type="p">35:乾燥裝置</p>  
        <p type="p">5:介面部</p>  
        <p type="p">51:基板批形成部</p>  
        <p type="p">52:搬運部</p>  
        <p type="p">6:批次處理部</p>  
        <p type="p">61:第3搬運區域</p>  
        <p type="p">62:第3搬運裝置</p>  
        <p type="p">63:第1藥液槽</p>  
        <p type="p">64:第1沖洗液槽</p>  
        <p type="p">65:第2藥液槽</p>  
        <p type="p">66:第2沖洗液槽</p>  
        <p type="p">67:第3藥液槽</p>  
        <p type="p">68:第3沖洗液槽(處理槽)</p>  
        <p type="p">71:第1處理具</p>  
        <p type="p">72:第1驅動裝置</p>  
        <p type="p">73:第2處理具</p>  
        <p type="p">74:第2驅動裝置</p>  
        <p type="p">75:第3處理具</p>  
        <p type="p">76:第3驅動裝置</p>  
        <p type="p">81:基板批解除部</p>  
        <p type="p">811:第1保持具</p>  
        <p type="p">814:第2保持具</p>  
        <p type="p">818:驅動裝置</p>  
        <p type="p">9:控制部</p>  
        <p type="p">91:CPU(中央處理器)</p>  
        <p type="p">92:記錄媒體</p>  
        <p type="p">93:輸入介面</p>  
        <p type="p">94:輸出介面</p>  
        <p type="p">A1,A2,A3,A4,A5:基板之移動順序</p>  
        <p type="p">C:基板匣盒</p>  
        <p type="p">L:基板批</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3161" publication-number="202627871"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627871.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110793</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子設計自動化方法、電腦程式產品、電子裝置、系統及機器可讀取媒體</chinese-title>  
        <english-title>ELECTRONIC DESIGN AUTOMATION (EDA) METHOD, COMPUTER PROGRAM PRODUCT, ELECTRONIC DEVICE, SYSTEM, AND MACHINE-READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260326B">G06F30/398</main-classification>  
        <further-classification edition="202001120260326B">G06F30/392</further-classification>  
        <further-classification edition="202001120260326B">G06F30/20</further-classification>  
        <further-classification edition="202001120260326B">G06F30/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｄ２Ｓ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D2S, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐里歐丹　唐納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIORDAN, DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈納克　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANAC, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例提供一種計算及顯示用於半導體層介面（例如金屬-通路及金屬-接觸件）的最小重疊。該方法利用機器訓練網路以快速且準確地推論出一系列製程變化的經製造的形狀的內部輪廓。該方法還建模半導體製程層與層錯位。訊息（來自機器訓練網路及建模）的組合集是被該方法利用以計算多層介面的最小重疊形狀。一些實施例的方法還利用最小重疊形狀以獲得通路或接觸件的電阻的精準計算。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments provide a method for computing and displaying of minimum overlap for semiconductor layer interfaces, such as metal-via and metal-contact. The method leverages a machine-trained network (e.g., a trained neural network) to quickly, but accurately, infer the contours for the manufactured shapes across a range of process variations. The method also models the semiconductor process manufacturing layer-to-layer misalignment. The combined set of information (from the machine-trained network and from the modeling) is used by the method to compute the minimum overlap shapes at multiple layer interfaces. The method in some embodiments then uses the minimum overlap shapes to obtain an accurate calculation of the via or contact resistance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2000:流程</p>  
        <p type="p">2005~2020:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3162" publication-number="202627097"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627097.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110805</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>寡核苷酸片段及其用於製備ＲＮＡＩ藥劑之方法</chinese-title>  
        <english-title>OLIGONUCLEOTIDE FRAGMENTS AND METHODS OF MAKING RNAI AGENTS USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260401B">C12N15/113</main-classification>  
        <further-classification edition="200601120260401B">A61K31/7088</further-classification>  
        <further-classification edition="200601120260401B">A61K48/00</further-classification>  
        <further-classification edition="200601120260401B">A61P1/16</further-classification>  
        <further-classification edition="200601120260401B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>處卡若夫　謝爾蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKANOV, SERGEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅伊　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAY, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩何　艾瑞克　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHER, ERIC DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於製備RNAi藥劑之中間化合物(亦即，寡核苷酸片段)或其醫藥學上可接受之鹽。另外，揭示經由雜合化學酶促途徑接合本文之該等中間化合物中之兩者或更多者來製備單股寡核苷酸的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Intermediate compounds (&lt;i&gt;i.e.&lt;/i&gt;, oligonucleotide fragments) are disclosed for making RNAi agents, or pharmaceutically acceptable salts thereof. In addition, methods are disclosed for making single-stranded oligonucleotides by ligating two or more of the intermediate compounds herein via a hybrid chemical-enzymatic route.</p> 
      </isu-abst>  
      <representative-img></representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3163" publication-number="202625999"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202625999.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202625999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於觸覺刺激器之精確多維移動的系統和方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR PRECISE MULTI-DIMENSIONAL MOVEMENT OF HAPTIC STIMULATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">A61H19/00</main-classification>  
        <further-classification edition="200601120260331B">B25J13/02</further-classification>  
        <further-classification edition="200601120260331B">B25J9/16</further-classification>  
        <further-classification edition="200601120260331B">B25J9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富雷薩斯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLESSAS, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富雷薩斯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLESSAS, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種機器人觸覺刺激器包括經組態以移動一觸覺刺激裝置之一機器人基座。該機器人基座可較佳在三維空間中移動該觸覺刺激裝置。在x、y及/或z方向上之移動可經獨立地控制且可參考可與人體相關聯之一指定點或位置。可使用光達以獲得關於一使用者之一或多個部分之位置/距離之資訊以用於控制該觸覺刺激裝置之位置。該觸覺刺激裝置之移動可模仿其他物件之移動及/或與視訊或聲音同步。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A robotic haptic stimulator comprises a robotic mount which is configured to move a haptic stimulation device. The robotic mount can preferably move the haptic stimulation device in three-dimensional space. Movement in the x, y and/or z directions may be independently controlled and may be referenced to a designated point or position that may be associated with the human body. Lidar may be used to obtain information regarding the location/distance of one or more parts of a user for use in controlling the position of the haptic stimulation device. Movement of the haptic stimulation device may emulate movement of other objects and/or be synchronized to video or sound.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:機器人觸覺刺激器</p>  
        <p type="p">60:控制器/處理器</p>  
        <p type="p">62:記憶體</p>  
        <p type="p">64:通信介面</p>  
        <p type="p">66:使用者裝置</p>  
        <p type="p">68:工作站</p>  
        <p type="p">70:伺服器</p>  
        <p type="p">72:光偵測及測距(LIDAR)系統</p>  
        <p type="p">M1:移動</p>  
        <p type="p">M2:移動</p>  
        <p type="p">M3:移動</p>  
        <p type="p">N:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3164" publication-number="202627248"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627248.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳化矽基板及碳化矽磊晶晶圓</chinese-title>  
        <english-title>SIC SUBSTRATE AND SIC EPITAXIAL WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260330B">C30B29/36</main-classification>  
        <further-classification edition="200601120260330B">C30B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西原禎孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIHARA, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周防裕政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUO, HIROMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之SiC基板，其特徵係在由位於從中心與半徑17.5mm的圓周重疊的位置的內周支持面內周支持時，將連接上面中從厚度方向所視與前述內周支持面重疊的第1點的面作為第1基準面，在較前述第1基準面上方為正時，BOW(彎曲度)為不足40μm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:內周支持面</p>  
        <p type="p">10:SiC基板</p>  
        <p type="p">10a:上面</p>  
        <p type="p">C:中心</p>  
        <p type="p">F:平坦面</p>  
        <p type="p">p1:第1點</p>  
        <p type="p">S1:第1面</p>  
        <p type="p">Sr1:第1基準面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3165" publication-number="202628959"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628959.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以防止沉積及晶圓滑動的主軸臂沖洗</chinese-title>  
        <english-title>PURGING SPINDLE ARMS TO PREVENT DEPOSITION AND WAFER SLIDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P95/00</main-classification>  
        <further-classification edition="202601120260331B">H10P72/30</further-classification>  
        <further-classification edition="200601120260331B">B08B5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾卡尼　普拉薩納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULKARNI, PRASANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱華檀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, HUATAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　布萊恩　喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, BRIAN JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚泰德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, TED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包含複數主軸臂，其位在一處理腔室中的複數工作站上方，用以在該等工作站之間運送半導體基板。在該半導體基板之處理期間，該等主軸臂駐留在該處理腔室中。該系統包含第一氣體管線，其係設置在該等工作站下方，用以供應沖洗氣體。該系統包含第二氣體管線，其自該等第一氣體管線向上延伸，用以在該處理腔室中處理該半導體基板時將該沖洗氣體供應至該等主軸臂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes a plurality of spindle arms located above a plurality of stations in a processing chamber to transport a semiconductor substrate between the stations. The spindle arms reside in the processing chamber during processing of the semiconductor substrate. The system comprises first gas lines arranged below the stations to supply a purge gas. The system comprises second gas lines extending upwards from the first gas lines to supply the purge gas to the spindle arms during the processing of the semiconductor substrate in the processing chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:處理腔室</p>  
        <p type="p">202-1:工作站</p>  
        <p type="p">202-2:工作站</p>  
        <p type="p">202-3:工作站</p>  
        <p type="p">202-4:工作站</p>  
        <p type="p">204-1:主軸臂</p>  
        <p type="p">204-2:主軸臂</p>  
        <p type="p">204-3:主軸臂</p>  
        <p type="p">204-4:主軸臂</p>  
        <p type="p">205:主軸</p>  
        <p type="p">206-1:襯裡</p>  
        <p type="p">206-2:襯裡</p>  
        <p type="p">206-3:襯裡</p>  
        <p type="p">206-4:襯裡</p>  
        <p type="p">208-1:入口</p>  
        <p type="p">208-2:入口</p>  
        <p type="p">208-3:入口</p>  
        <p type="p">208-4:入口</p>  
        <p type="p">210:入口</p>  
        <p type="p">212:元件</p>  
        <p type="p">213:元件</p>  
        <p type="p">230:氣體管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3166" publication-number="202627409"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627409.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學測量系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">G01B11/06</main-classification>  
        <further-classification edition="200601120260401B">G01N21/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大塚電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲野大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INANO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種光學測量系統，測量樣本當中包含的層的厚度，也就是測量膜厚。光學測量系統包含：光源，產生測量光；受光部，將測量光照射於樣本產生的反射光或通過光作為觀測光並接收；探測器，光學連接光源以及受光部，可配置於任意的位置；膜厚算出部，從基於受光部執行的檢測結果算出的分光反射率或分光通過率，算出樣本的膜厚；以及信賴度算出部，算出測量信賴度，測量信賴度示意藉由膜厚算出部算出的膜厚是在何等程度下被適當測量的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:測量裝置</p>  
        <p type="p">150:緩衝器</p>  
        <p type="p">152:傳播數轉換部</p>  
        <p type="p">154:傅立葉轉換部</p>  
        <p type="p">156:峰值探索部</p>  
        <p type="p">158:膜厚決定部</p>  
        <p type="p">160:測量信賴度算出部</p>  
        <p type="p">162:輸出處理部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3167" publication-number="202628925"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628925.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115110964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單一之介電部、靜電吸盤、基板支持器及電漿處理裝置</chinese-title>  
        <english-title>SINGLE DIELECTRIC PORTION, ELECTROSTATIC CHUCK, SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260326B">H10P72/70</main-classification>  
        <further-classification edition="200601120260326B">H01J37/32</further-classification>  
        <further-classification edition="200601120260326B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木康晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YASUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原亜人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAWARA, TSUGUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小泉克之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIZUMI, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板支持器具備第1區域、第2區域、第1電極、及第2電極。第1區域構成為保持載置於其上之基板。第2區域以包圍第1區域之方式設置，且構成為保持載置於其上之邊緣環。第1電極設置於第1區域內以接受第1電偏壓。第2電極至少設置於第2區域內以接受第2電偏壓。第2電極以於第1區域內與第1電極對向之方式，於第1電極之下方延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">10:腔室</p>  
        <p type="p">10s:內部空間</p>  
        <p type="p">16:基板支持器</p>  
        <p type="p">18:下部電極</p>  
        <p type="p">20:靜電吸盤</p>  
        <p type="p">20d:介電部</p>  
        <p type="p">21:第1區域</p>  
        <p type="p">21a:電極</p>  
        <p type="p">22:第2區域</p>  
        <p type="p">22a:電極</p>  
        <p type="p">22b:電極</p>  
        <p type="p">22g:氣體管線</p>  
        <p type="p">55:直流電源</p>  
        <p type="p">56:開關</p>  
        <p type="p">57:高頻電源</p>  
        <p type="p">58:匹配器</p>  
        <p type="p">61:第1偏壓電源</p>  
        <p type="p">62:電路</p>  
        <p type="p">71:直流電源</p>  
        <p type="p">72:開關</p>  
        <p type="p">73:濾波器</p>  
        <p type="p">74:直流電源</p>  
        <p type="p">75:開關</p>  
        <p type="p">76:濾波器</p>  
        <p type="p">81:第2偏壓電源</p>  
        <p type="p">82:電路</p>  
        <p type="p">86:氣體供給機構</p>  
        <p type="p">211:第1電極</p>  
        <p type="p">222:第2電極</p>  
        <p type="p">ER:邊緣環</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3168" publication-number="202628759"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628759.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示基板及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260326B">H10K59/121</main-classification>  
        <further-classification edition="201601120260326B">G09G3/3233</further-classification>  
        <further-classification edition="202301120260326B">H10K59/13</further-classification>  
        <further-classification edition="202301120260326B">H10K59/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商京東方科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商成都京東方光電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閆政龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, ZHENGLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石領</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚延陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG, YANYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張玉欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示基板，包括：襯底、位於第一顯示區的多個第一發光單元和多個第二發光單元、位於第一顯示區的多個第一像素電路、以及位於第二顯示區的多個第二像素電路。第一發光單元包括至少一個第一發光元件，第二發光單元包括至少一個第二發光元件。至少一個第一發光單元與至少一個第二發光單元相鄰。至少一個第一像素電路與至少一個第一發光元件電連接，配置為驅動至少一個第一發光元件發光。至少一個第二像素電路與至少一個第二發光元件電連接，配置為驅動至少一個第二發光元件發光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2a:第一發光單元</p>  
        <p type="p">2b:第二發光單元</p>  
        <p type="p">21a,21b,21c,21d:第一發光元件</p>  
        <p type="p">22a,22b,22c,22d:第二發光元件</p>  
        <p type="p">A11:第一子區域</p>  
        <p type="p">A12:第二子區域</p>  
        <p type="p">R:紅光</p>  
        <p type="p">G:綠光</p>  
        <p type="p">B:藍光</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3169" publication-number="202628377"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628377.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111183</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經由分佈式輸入分佈式輸出技術在無線蜂巢系統中應用小區間多工增益之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR EXPLOITING INTER-CELL MULTIPLEXING GAIN IN WIRELESS CELLULAR SYSTEMS VIA DISTRIBUTED INPUT DISTRIBUTED OUTPUT TECHNOLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260401B">H04B7/04</main-classification>  
        <further-classification edition="200901120260401B">H04W28/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商李爾登公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REARDEN, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛倫沙　安東尼奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORENZA, ANTONIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波爾曼　史蒂芬　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERLMAN, STEPHEN G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種具有多使用者(MU)傳輸之多天線系統(MAS) (「MU-MAS」)，其經由空間處理而應用小區間多工增益以增加無線通信網路中之容量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multiple antenna system (MAS) with multiuser (MU) transmissions (“MU-MAS”) exploiting inter-cell multiplexing gain via spatial processing to increase capacity in wireless communications networks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1301:使用者設備</p>  
        <p type="p">1302:基地收發器台</p>  
        <p type="p">1303:控制器</p>  
        <p type="p">1304:集中式處理器</p>  
        <p type="p">1305:基地台網路</p>  
        <p type="p">1306:外部網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3170" publication-number="202627872"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202627872.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202627872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111322</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>計算定義於半導體設計中的線結構的寄生參數之方法、機器可讀取媒體、電子裝置、系統及電腦程式產品</chinese-title>  
        <english-title>METHOD, MACHINE READABLE MEDIUM, ELECTRONIC DEVICE, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR CALCULATING PARASITIC PARAMETERS FOR WIRE STRUCTURES DEFINED IN A SEMICONDUCTOR DESIGN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260331B">G06F30/398</main-classification>  
        <further-classification edition="202001120260331B">G06F30/27</further-classification>  
        <further-classification edition="202501120260331B">H10D89/10</further-classification>  
        <further-classification edition="202001320260331B">G06F119/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｄ２Ｓ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D2S, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希拉利　納吉什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRALI, NAGESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐里歐丹　唐納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIORDAN, DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例提供一種計算定義於半導體設計中的線結構的寄生參數之方法。方法包含從半導體設計萃取線結構，線結構包含從用於定義半導體設計的電路佈局萃取第一線結構；產生第二線結構，第二線結構為第一線結構的預測製造版本；及利用第二線結構產生寄生參數組，寄生參數組用於定義由電路佈局中的第一線結構中的至少一導線所引起的寄生效應組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments provide a method for calculating parasitic parameters for wire structures defined in a semiconductor design. The method comprising: extracting a first wire structure from a circuit layout that specifies the semiconductor design; generating a second wire structure that is a predicted manufactured version of the first wire structure; and using the second wire structure to generate a set of parasitic parameters that specifies a set of parasitic effects experienced by at least one wire within the first wire structures in the circuit layout.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:非幾何方法</p>  
        <p type="p">710:線結構</p>  
        <p type="p">720:影像光柵化</p>  
        <p type="p">730:多通道二維影像</p>  
        <p type="p">740:神經網路</p>  
        <p type="p">750:電容向量(電容向量值)</p>  
        <p type="p">755:後處理器</p>  
        <p type="p">760:電容係數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3171" publication-number="202628947"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628947.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產生參考狀態資料以對腔室的狀態進行監測的方法、對腔室的狀態進行監測的方法以及裝置以及非暫時性電腦可讀取媒體</chinese-title>  
        <english-title>METHOD TO GENERATE REFERENCE STATUS DATA TO MONITOR STATUS OF CHAMBER, METHOD AND DEVICE TO MONITOR STATUS OF CHAMBER AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202601120260331B">H10P74/20</main-classification>  
        <further-classification edition="200601120260331B">G01N22/00</further-classification>  
        <further-classification edition="200601120260331B">G01R27/06</further-classification>  
        <further-classification edition="200601120260331B">G01R27/28</further-classification>  
        <further-classification edition="200601120260331B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商怡色公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AETHER, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宰顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAEHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐相勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SANG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG BEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李相元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐承勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SEUNGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋明坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, MYUNG GON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種對腔室的狀態進行監測的方法，所述方法包括：獲取反映腔室的狀態的參考狀態資料集；向欲被監測的腔室的內側發射處於特定頻率範圍的無線電波並且接收由腔室的內部空間反射的無線電波；使用所接收的無線電波來產生腔室的當前狀態資料；使用參考狀態資料集及當前狀態資料來產生關於腔室的當前狀態的監測資訊；以及提供監測資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method of monitoring a status of a chamber, the method including: acquiring a reference status data set that reflects a status of a chamber; transmitting radio waves in a specific frequency range to inside the chamber to be monitored and receiving radio waves reflected by the internal space of the chamber; generating current status data of the chamber using the received radio waves; generating monitoring information on a current status of the chamber using the reference status data set and the current status data; and providing the monitoring information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:監測裝置</p>  
        <p type="p">110:天線</p>  
        <p type="p">120:訊號處理單元</p>  
        <p type="p">130:通訊單元</p>  
        <p type="p">140:控制單元</p>  
        <p type="p">150:儲存單元</p>  
        <p type="p">160:固定部件</p>  
        <p type="p">170:輸出部件</p>  
        <p type="p">180:電磁波屏蔽件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3172" publication-number="202628417"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202628417.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202628417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼裝置、解碼裝置及非暫時性電腦可讀取之媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260401B">H04N19/105</main-classification>  
        <further-classification edition="201401120260401B">H04N19/134</further-classification>  
        <further-classification edition="201401120260401B">H04N19/189</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商松下電器（美國）知識產權公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠間正真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMA, TADAMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西孝啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安倍清史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KIYOFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">編碼裝置具備：電路；及記憶體，連接於電路，電路在動作中，導出針對複數個相對像素位置分別導出的複數個水平梯度和絕對值的總和，來作為第1參數，導出針對複數個相對像素位置分別導出的複數個垂直梯度和絕對值的總和，來作為第2參數，導出針對複數個相對像素位置分別導出的複數個水平對應像素差分值的總和，來作為第3參數，導出針對複數個相對像素位置分別導出的複數個垂直對應像素差分值的總和，來作為第4參數，導出針對複數個相對像素位置分別導出的複數個垂直對應水平梯度和的總和，來作為第5參數，使用第1參數、第2參數、第3參數、第4參數及第5參數，來產生使用於當前區塊的編碼的預測圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"></p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S3101至S3112:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3173" publication-number="202626418"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626418.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適配器裝置及兒童載具</chinese-title>  
        <english-title>ADAPTOR APPARATUS AND CHILD CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260331B">B62B7/14</main-classification>  
        <further-classification edition="200601120260331B">B62B9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳海濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAITAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種適配器裝置，用於將兒童載具的載具本體可拆卸地連接至兒童載具的架體，適配器裝置包括：適配器，適於與載具本體連接；以及配合組件，設置於架體，適配器可拆卸地連接至配合組件；其中架體包括具有自由端部的座椅架，在架體處於展開狀態時，自由端部在架體的前後方向上向前延伸，配合組件設置於自由端部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adaptor apparatus used for detachably connecting a carrier body of a child carrier to a frame body includes: an adaptor suitable to connect to the carrier body; and a cooperating assembly disposed on the frame body, the adaptor being detachably connected to the cooperating assembly; wherein the frame body includes a seat frame having a free end, when the frame body is in an unfolded state, the free end extends forward along a front-rear direction of the frame body, the cooperating assembly being disposed at the free end.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:連接座</p>  
        <p type="p">31a:第一殼體</p>  
        <p type="p">311:第一連接部</p>  
        <p type="p">312:第二連接部</p>  
        <p type="p">3121:限位凸部</p>  
        <p type="p">313:鎖定凹槽</p>  
        <p type="p">314:容納槽</p>  
        <p type="p">315:操作口</p>  
        <p type="p">316:凸起部</p>  
        <p type="p">317:卡合槽</p>  
        <p type="p">318:凸柱部</p>  
        <p type="p">32:鎖定件</p>  
        <p type="p">321:卡鉤部</p>  
        <p type="p">322:樞接部</p>  
        <p type="p">33:操作件</p>  
        <p type="p">331:主體部</p>  
        <p type="p">332:操作部</p>  
        <p type="p">34:牽引組件</p>  
        <p type="p">341:牽引件</p>  
        <p type="p">3411:第一端</p>  
        <p type="p">3413:中間部分</p>  
        <p type="p">342:護套</p>  
        <p type="p">35:復位件</p>  
        <p type="p">41:配合件</p>  
        <p type="p">F:前方</p>  
        <p type="p">B:後方</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3174" publication-number="202626665"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626665.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中環或大環之經苄基取代之雜環衍生物及相關用途</chinese-title>  
        <english-title>MEDIUM- OR MACRO-CYCLIC BENZYL-SUBSTITUTED HETEROCYCLE DERIVATIVES AND RELATED USES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D498/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/4353</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/26</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商森特薩製藥（英國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTESSA PHARMACEUTICALS (UK) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉伯森　卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBSON, KARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧特　葛瑞格利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTT, GREGORY R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂夫克　布魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEFKER, BRUCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈姆瑞斯　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMPHRIES, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於式(I’)之化合物： &lt;br/&gt;&lt;img align="absmiddle" height="196px" width="213px" file="ed10237.JPG" alt="ed10237.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及關於其前藥、醫藥上可接受之鹽、醫藥組成物、使用方法、及其製備方法。本文所揭示之化合物可用於調節食慾激素-2受體活性，並且可用於治療食慾激素-2受體活性所涉及的病症，諸如，猝睡症、嗜睡症、神經退化性病症、罕見遺傳病症之症狀、精神健康障礙、代謝症候群、骨質疏鬆症、心臟衰竭、昏迷、或促進麻醉甦醒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to compounds of Formula (I’):&lt;br/&gt;&lt;img align="absmiddle" height="193px" width="223px" file="ed10238.JPG" alt="ed10238.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;and to their prodrugs, pharmaceutically acceptable salts, pharmaceutical compositions, methods of use, and methods for their preparation. The compounds disclosed herein are useful for modulating orexin-2 receptor activity and may be used in the treatment of disorders in which orexin-2 receptor activity is implicated, such as narcolepsy, a hypersomnia disorder, a neurodegenerative disorder, a symptom of a rare genetic disorder, a mental health disorder, a metabolic syndrome, osteoporosis, cardiac failure, coma, or facilitating emergence from anaesthesia.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3175" publication-number="202626666"> 
    <tif-files tif-type="multi-tif">
      <tif no="1" file="202626666.zip"/>
    </tif-files>
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>13</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202626666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>115111611</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中環或大環之經苄基取代之雜環衍生物及相關用途</chinese-title>  
        <english-title>MEDIUM- OR MACRO-CYCLIC BENZYL-SUBSTITUTED HETEROCYCLE DERIVATIVES AND RELATED USES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260401B">C07D498/04</main-classification>  
        <further-classification edition="200601120260401B">A61K31/4353</further-classification>  
        <further-classification edition="200601120260401B">A61P25/00</further-classification>  
        <further-classification edition="200601120260401B">A61P25/28</further-classification>  
        <further-classification edition="200601120260401B">A61P25/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商森特薩製藥（英國）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTESSA PHARMACEUTICALS (UK) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉伯森　卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIBSON, KARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧特　葛瑞格利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTT, GREGORY R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂夫克　布魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEFKER, BRUCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈姆瑞斯　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMPHRIES, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於式(I’)之化合物： &lt;br/&gt;&lt;img align="absmiddle" height="190px" width="220px" file="ed10237.JPG" alt="ed10237.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;及關於其前藥、醫藥上可接受之鹽、醫藥組成物、使用方法、及其製備方法。本文所揭示之化合物可用於調節食慾激素-2受體活性，並且可用於治療食慾激素-2受體活性所涉及的病症，諸如，猝睡症、嗜睡症、神經退化性病症、罕見遺傳病症之症狀、精神健康障礙、代謝症候群、骨質疏鬆症、心臟衰竭、昏迷、或促進麻醉甦醒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to compounds of Formula (I’):&lt;br/&gt;&lt;img align="absmiddle" height="195px" width="221px" file="ed10238.JPG" alt="ed10238.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;and to their prodrugs, pharmaceutically acceptable salts, pharmaceutical compositions, methods of use, and methods for their preparation. The compounds disclosed herein are useful for modulating orexin-2 receptor activity and may be used in the treatment of disorders in which orexin-2 receptor activity is implicated, such as narcolepsy, a hypersomnia disorder, a neurodegenerative disorder, a symptom of a rare genetic disorder, a mental health disorder, a metabolic syndrome, osteoporosis, cardiac failure, coma, or facilitating emergence from anaesthesia.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無  </p> 
      </representative-img> 
    </description> 
  </tw-patent-application> 
</tw-patent-applications>
